TWI321868B - - Google Patents

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Publication number
TWI321868B
TWI321868B TW092120892A TW92120892A TWI321868B TW I321868 B TWI321868 B TW I321868B TW 092120892 A TW092120892 A TW 092120892A TW 92120892 A TW92120892 A TW 92120892A TW I321868 B TWI321868 B TW I321868B
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive tape
tape
substrate
tapes
Prior art date
Application number
TW092120892A
Other languages
Chinese (zh)
Other versions
TW200409405A (en
Inventor
Naoki Fukushima
Takashi Tatsuzawa
Takahiro Fukutomi
Koji Kobayashi
Toshiyuki Yanagawa
Masami Yusa
Motohiro Arifuku
Yasushi Gotoh
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200409405A publication Critical patent/TW200409405A/en
Publication of TWI321868B publication Critical patent/TWI321868B/zh
Application granted granted Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

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1321868 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關係電子構件及電路基板、或電路基板間之 黏著固定、以及實施兩者之電極間之電性連接之黏著材膠 帶 '其連接方法、製造方法、壓著方法、黏著材膠帶盤、 黏著裝置、黏著劑膠帶盒、及使用其之黏著劑壓著方法， 尤其是，和捲成盤狀之黏著材膠帶、其連接方法、製造方 法、壓著方法、黏著材膠帶盤、黏著裝置、黏著劑膠帶盒 φ 、使用其之黏著劑壓著方法、及向異導電材膠帶相關。 【先前技術】 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 手段，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材塗 φ 布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶的長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 -著-村膠帶之姶端部並-裝設至捲取盤。其次，從亩黏著材盤—— — 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 -6 - [S1 (2) 1321868 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 【發明內容】 近年來，隨著PDP等之面板畫面之大型化，電路基 板之黏著面積（或周圍之一邊尺寸）亦增大，一次使用之 φ 黏著劑的使用量亦增加。又，因爲黏著劑用途之擴大，黏 著劑之使用量亦增加。因此，電子機器之製造工廠之黏著 材盤的更換更爲頻繁，因爲黏著材盤之更換十分麻煩，故 有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 的捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， φ 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因》 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，本發明之目的係在提供一種黏著材膠帶之連接 方法、黏著材膠帶、其製造方法、壓著方法、黏著材膠帶. 盤、黏著裝置、黏著劑膠帶盒、使用其之黏著劑壓著方法 、及向異導電材膠帶，使黏著材盤之更換十分簡單，且可 (3) 1321868 提高電子機器之生產效率。 第1項記載之發明，係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 連接方法，其特徵爲，將一方之黏著材膠帶之終端部反折 ，使一方之黏著材膠帶之黏著劑面及另一方之黏著材膠帶 之黏著劑面重疊，並實施兩者之重疊部份的加熱壓著使其 $ 連接。 φ 此第1項記載之發明時，係利用黏著材膠帶之黏著劑 來黏著全部捲出之黏著材膠帶之終端部、及新裝著之黏著 材膠帶之始端部，實施黏著材盤之更換，故很簡單即可將 新黏著材膠帶裝著至黏著裝置。又，因爲無需在每次更換 新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶之始端 裝設至捲取盤之作業、以及在特定路徑設定導引銷等之作 業，只需要較少時間即可更換新黏著材盤，故可提高電子 Φ機器之生產效率。 ® 因係將全部捲出之黏著材膠帶之終端部反折，並將黏 著材膠帶之黏著劑面及新裝著之黏著材膠帶之黏著劑面重 疊黏著，故具有較高之連接強度。 連接部份之加熱壓著若採用裝著著黏著材盤之黏著裝 置的加熱加壓頭，則可合理利用黏著裝置。 -_ 一第2項記載之發明，係如第ΐ項記載之發明，-其特徵 一 ' 爲，一方之黏著材膠帶之終端部標示著結束標記。 此第2項記載之發明時，除了具有和第1項記載之發 -8 - I S'] (4) 1321868 明相同之作用效果以外，尙可在結束標記露出時實施全部 捲出之黏著材膠帶之切斷，故實施切斷及連接作業之部份 容易解開，而且，可利用必要最小之位置實施連接，而可 防止黏著材膠帶之浪費。 第3項記載之發明，係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 φ 連接方法，其特徵爲，另一方之黏著材膠帶之始端部係利 用將前導膠帶貼附於捲附至盤上之黏著材膠帶基材面來使 其停止，在將一方之黏著材膠帶之終端部反折後，再使前 導膠帶之黏著劑面和一方之黏著材膠帶之終端部之黏著劑 面重疊，實施重疊部份之加熱壓著。 此第3項記載之發明時，和第1項記載之發明相同， 很簡單即可將新黏著材膠帶裝著至黏著裝置，又，只需要 較少時間即可更換新黏著材盤，故可提高電子機器之生產 效率。 此外，因爲係利用黏著材膠帶之前導膠帶來黏著全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部，故很簡單即可實施黏著材膠帶間之黏著。 第4項記載之發明，係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 連接方法，其特徵爲，另一方之黏著材膠帶之始端部係利 用將前導膠帶貼附於捲附至盤上之黏著材膠帶基材面來使 -9- (5) 1321868 其停止，使前導膠帶之黏著劑面和一方之黏著材膠帶之終 端部之黏著劑面重疊，實施重疊部份之加熱壓著。 此第4項記載之發明時，和第1項記載之發明相同， 很簡單即可將新黏著材膠帶裝著至黏著裝置，又，只需要 較少時間即可更換新黏著材盤，故可提高電子機器之生產 效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 φ 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 φ 第5項記載之發明，係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 連接方法，其特徵爲，使一方之黏著材膠帶之終端部、及 另一方之黏著材膠帶之始端部重疊，在兩者之重疊部份插 入卡止銷來實施連接。 此第5項記載之發明時，因爲係以卡止銷固定全部捲 φ 出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始端 φ 部，故連接十分簡單。又，因爲無需在每次更換新黏著材 膠帶時都更換捲取膠帶、將新黏著材膠帶之始端裝設至捲 取盤之作業、以及在特定路徑設定導引銷等之作業’只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 第6-項記載之發明，係利用卡止_構件來ϋ接用以連接 — — 基材上塗布著電極連接用黏著劑之捲取至一方之盤上之一 方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏著 -10 - [S] (6) 1321868 材膠帶的黏著材膠帶之黏著材膠帶連接方法，其特徵爲， 卡止構件具有配設於一方及另一方端部之爪部、及配設於 爪部間之彈性構件，一方之黏著材膠帶之終端部及另一方 之黏著材膠帶之始端部會互相抵接，配設於卡止構件之一 端之爪部會卡止於一方之黏著材膠帶之終端部，配設於另 一端之爪部會卡止於另一方之黏著材膠帶之始端部，以彈 性構件拉近兩方之爪部。 φ 此第6項記載之發明時，因爲使卡止構件之一方之爪 部卡止於一方之黏著材膠帶之終端部，而且，使卡止構件 之另一方之爪部卡止於另一方之黏著材膠帶之始端部，實 施兩者之互相連接，故連接十分容易。又，因爲一方之爪 部及另一方之爪部之間具有彈性構件，故，彈性構件可伸 展而使卡止構件之另一方之爪部卡止於另一方之黏著材膠 帶之始端部之任意位置上，而爲具有高自由度之連接。 又，因係使一方之黏著材膠帶之終端部、及另一方之 # 黏著材膠帶之始端部互相抵接之狀態實施連接，而無需使 膠帶互相重疊，可利用必要最小之位置實施連接，而可防 止黏著材膠帶之浪費。 第7項記載之發明，係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 連接方法，其特徵爲，使一方之黏著材膠帶之終端部、及 另一方之黏著材膠帶之始端部重疊，以橫剖面略呈3字形 之可彈性變形之夾子實施兩者之重疊部份的夾持固定。 -11 - (7) 1321868 此第7項記載之發明時，因爲只需以夾子夾住一方之 黏著材膠帶之終端部、及另一方之黏著材膠帶之始端部之 重疊部份即可實施連接，連接作業十分容易。 . 第8項記載之發明，其特徵爲，係以橫剖面略呈3字 形之金屬製夾持片夾住一方之黏著材膠帶及另一方之黏著 材膠帶之重疊部份，並從重疊部份之兩面壓扁夾持片來連 接兩者。 φ 此第8項記載之發明時，因係從重疊部份之兩面壓扁 φ 夾持片來連接兩者，故可提筒黏著材膠帶之重疊部份的連 接強度。 第9項記載之發明’係用以連接基材上塗布著電極連 接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、及 捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠帶 連接方法，其特徵爲，使一方之黏著材膠帶之終端部、及 另一方之黏著材膠帶之始端部之其中任何一方之黏著劑面 ^重疊於另一方之基材面上，兩者之重疊長度爲黏著劑膠帶 β 寬度之2至50倍之範圍，以兩者之加熱壓著實施連接。 此第9項記載之發明時，因係利用黏著材膠帶之黏著 劑黏著已用完之黏著材膠帶之終端部、及新裝著之黏著材 膠帶之始端部來實施黏著材盤之更換，故很簡單即可將新 黏著材盤裝著至黏著裝置上。又，因爲無需在每次更換新 --黏著材盤塒都更換捲取盤、及將新黏著符之始端裝設至捲 — 取盤之作業，只需要較少時間即可更換新黏著材盤，故可 提高電子機器之生產效率。1321868 (1) Technical Field of the Invention The present invention relates to an adhesive tape which relates to an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two. Connection method, manufacturing method, pressing method, adhesive tape tray, adhesive device, adhesive tape cassette, and adhesive pressing method using the same, in particular, and a disc-shaped adhesive tape, a connection method thereof, The manufacturing method, the pressing method, the adhesive tape tray, the adhesive device, the adhesive tape cassette φ, the adhesive pressing method using the same, and the related to the different conductive material tape. [Prior Art] Generally, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a bare chip package, a circuit board, or a circuit board, or both, and both The electrical connection means between the electrodes is made of adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with a φ cloth adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the end portion of the adhesive-village tape is pulled out and installed. To the roll tray. Next, the adhesive is pressed onto the circuit substrate or the like from the substrate side of the adhesive tape which is rolled out of the adhesive tape, and the residual substrate is taken up by the take-up reel. -6 - [S1 (2) 1321868 Next, when the adhesive tape of the adhesive sheet is used up, remove the used tray and the take-up tray of the take-up substrate, and install the new take-up tray and the new adhesive sheet. On the adhesive device, the beginning of the adhesive tape is mounted on the take-up reel. SUMMARY OF THE INVENTION In recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board (or the size of one side of the periphery) has also increased, and the amount of use of the φ adhesive for one use has also increased. Moreover, the use of adhesives has also increased due to the expansion of the use of adhesives. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, φ acts on the adhesive tape which is wound into a tape shape, and the pressure of the adhesive tape may increase, which may cause the adhesive to ooze out from both sides of the tape and become a cause of clogging. In addition, if the number of the adhesive tape is increased, the number of the adhesive tape is increased. The diameter of the disc will also increase, and it may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the object of the present invention is to provide a method for joining an adhesive tape, an adhesive tape, a method for manufacturing the same, a pressing method, an adhesive tape, a disk, an adhesive device, an adhesive tape cartridge, and an adhesive using the adhesive. The method and the conductive tape of the different conductive materials make the replacement of the adhesive material plate very simple, and can improve the production efficiency of the electronic machine by (3) 1321868. The invention according to the first aspect is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the disks, and the other one of which is wound up onto the other disk. The adhesive tape bonding method of the material tape is characterized in that the end portion of one of the adhesive tapes is folded back, and the adhesive surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped and implemented. The overlap between the two is pressed to make it $ connect. φ In the invention described in the first item, the end portion of the adhesive tape which has been completely unwound is adhered by the adhesive of the adhesive tape, and the beginning end of the newly attached adhesive tape is applied, and the adhesive disc is replaced. It is very simple to load the new adhesive tape to the adhesive device. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of installing the new adhesive tape to the take-up reel, and the setting of the guide pin in a specific path, it is only necessary to The new adhesive sheet can be replaced in a small amount of time, so that the production efficiency of the electronic Φ machine can be improved. ® has a high connection strength because the end portion of the adhesive tape is folded back and the adhesive surface of the adhesive tape and the adhesive surface of the newly attached adhesive tape are overlapped. If the heating portion of the connecting portion is heated and pressed, if the heating and pressing head of the bonding device with the adhesive sheet is used, the adhesive device can be used reasonably. The invention described in the second aspect is the invention according to the item 1-3, characterized in that the end portion of the adhesive tape of one of the ends is marked with an end mark. In the invention described in the second aspect, in addition to the same effects as those described in the above-mentioned item -8 - I S'] (4) 1321868, the enamel can be fully rolled out when the end mark is exposed. Since the tape is cut, the part which performs the cutting and joining operation is easily unwound, and the connection can be performed at the minimum necessary position, and the waste of the adhesive tape can be prevented. The invention according to the third aspect is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the disks, and the other one of which is wound onto the other disk. The adhesive tape φ connection method of the material tape, characterized in that the other end portion of the adhesive tape is stopped by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk, After the end portion of one of the adhesive tapes is folded back, the adhesive surface of the leading tape and the adhesive surface of the end portion of the adhesive tape are overlapped, and the overlapping portions are heated and pressed. In the invention described in the third aspect, as in the invention described in the first item, the new adhesive tape can be easily attached to the adhesive device, and the new adhesive disk can be replaced in a small amount of time. Improve the production efficiency of electronic machines. Further, since the end portion of the adhesive tape which is completely unwound and the beginning end of the newly attached adhesive tape are adhered by the adhesive tape before the adhesive tape, the adhesion between the adhesive tapes can be easily performed. The invention according to the fourth aspect is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the substrates, and the other one of which is wound onto the other disk. The adhesive tape bonding method of the material tape is characterized in that the other end of the adhesive tape is attached to the surface of the adhesive tape substrate which is attached to the disk by the leading tape to make -9- (5) 1321868 The stopping is performed so that the adhesive surface of the leading tape and the adhesive surface of the end portion of one of the adhesive tapes overlap each other, and the overlapping portions are heated and pressed. In the invention described in the fourth aspect, as in the invention of the first aspect, the new adhesive tape can be easily attached to the adhesive device, and the new adhesive disk can be replaced in a small amount of time. Improve the production efficiency of electronic machines. In addition, since the adhesive tape which is completely unwound is not required to be folded, the adhesive tape can be taken up to the take-up reel to prevent possible winding and scattering. The invention according to the fifth aspect is the adhesive tape for attaching one of the disks on which the electrode for the electrode connection is applied to the substrate, and the other of the disks to be wound onto the other disk. A method for attaching an adhesive tape of an adhesive tape, wherein a tip end portion of one of the adhesive tapes and a start end portion of the other adhesive tape are overlapped, and a locking pin is inserted in an overlapping portion of the two to perform connection . In the invention described in the fifth aspect, since the end portion of the adhesive tape which is formed by the entire winding φ and the start end φ of the newly attached adhesive tape are fixed by the locking pin, the connection is very simple. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of attaching the beginning of the new adhesive tape to the take-up reel, and setting the guide pin in a specific path, it is only necessary to The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The invention according to the sixth aspect is characterized in that the adhesive member is attached by means of a locking member, and the adhesive tape for coating the electrode for bonding the electrode to the one of the substrates is applied to the substrate, and the winding tape is taken up. Adhesive tape bonding method to the other side of the disk on the other side - 10 - [S] (6) 1321868 Adhesive tape bonding method of the adhesive tape of the material tape, characterized in that the locking member is disposed at one side and the other end The claw portion of the portion and the elastic member disposed between the claw portions, the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are abutted against each other, and are disposed at the claw end of one end of the locking member The claw portion of one of the adhesive tapes is locked, and the claw portion disposed at the other end is locked at the beginning end of the other adhesive tape, and the elastic members are used to draw the claws of both sides. φ In the invention according to the sixth aspect, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and the other claw of the locking member is locked to the other side. The beginning of the adhesive tape is used to connect the two, so the connection is very easy. Further, since the one claw portion and the other claw portion have an elastic member, the elastic member can be stretched to lock the other claw portion of the locking member to the beginning end of the other adhesive tape. In position, it is a connection with a high degree of freedom. Further, since the end portions of one of the adhesive tapes and the other end portions of the #adhesive tape are brought into contact with each other, it is not necessary to overlap the tapes, and the connection can be performed at the minimum necessary position. It can prevent the waste of adhesive tape. The invention according to the seventh aspect is the adhesive tape for attaching one side of the substrate to which the electrode for the electrode connection is applied, and the other one to the other of the disks. A method for attaching an adhesive tape of a material tape, wherein the end portion of one of the adhesive tapes and the other end of the adhesive tape are overlapped, and the elastically deformable clip having a three-dimensional cross section is implemented. The overlap of the overlapping parts is fixed. -11 - (7) 1321868 In the invention described in the seventh aspect, the connection can be made by simply holding the overlapping portion of the end portion of the adhesive tape and the beginning of the other adhesive tape with a clip. Connection work is very easy. The invention according to claim 8 is characterized in that the metal holding piece having a substantially three-shaped cross section sandwiches the overlapping portion of one of the adhesive tape and the other adhesive tape, and the overlapping portion The two sides are flattened by a clamping piece to connect the two. φ In the invention of the eighth aspect, since the φ holding pieces are flattened from both sides of the overlapping portion to connect the two, the connection strength of the overlapping portions of the adhesive tape can be lifted. The invention described in the ninth item is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the disks, and the other one of which is wound onto the other disk. A method for attaching an adhesive tape of a material tape, characterized in that an adhesive surface of one of the end portions of one of the adhesive tapes and the other end portion of the adhesive tape is superposed on the other substrate surface In the above, the overlapping length of the two is in the range of 2 to 50 times the width of the adhesive tape β, and the connection is performed by heating and pressing the two. In the invention described in the ninth aspect, the adhesive material is replaced by the adhesive portion of the adhesive tape adhered to the end portion of the used adhesive tape and the newly-installed adhesive tape. It is very simple to load the new adhesive sheet onto the adhesive unit. Moreover, since it is not necessary to replace the take-up tray every time the new--adhesive tray is replaced, and the beginning of the new adhesive is attached to the roll-to-reel operation, it takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved.

-12- (8) 1321868 重疊部份之長度爲黏著材膠帶寬度之2倍至50倍， 其理由如下所示，小於2倍時無法獲得充分之連接強度， 大於50倍時則連接部份使用之黏著材會增加過多而造成 黏著材之浪費。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 φ 異導電性黏著劑者，亦可以爲只有絕緣性黏著劑者，或者 ，將絕緣性隔件粒子分散於這些黏著劑中者。 第1〇項記載之發明，係用以連接基材上塗布著電極 連接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、 及捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠 帶連接方法，其特徵爲，將一方之黏著材膠帶之終端部折 向黏著劑相對之方向，而將另一方之黏著材膠帶之始端部 折向黏著劑相對之方向，使兩者之彎折部份互相卡止重疊 # 且使兩者之黏著材面相對，實施重疊部份之加熱壓著。 此第1 〇項記載之發明時，除了具有和第1項記載之 發明相同之作用效果以外，一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部會互相形成鈎狀卡止，且兩 者之黏著劑面會互相連接，故有較高之連接強度。 第1 1項記載之發明，係如第9或10項記載之發明’ 一方之黏著材膠帶之終端部會標示著結束標記。 此第11項記載之發明時，除了具有和第9或10項記 載之發明相同之作用效果以外，因爲一方之黏著材膠帶之 -13- (9) 1321868 終端部係利用結束標記部份’執行連接作業之部份容易解 開且可利用必要最小之位置實施連接，而可防止黏著材膠 帶之浪費。又，可自動檢測結束標記部份，故可利用該檢 測信號控制裝置，若能發出警報，則可提高作業效率。-12- (8) 1321868 The length of the overlapping portion is 2 to 50 times the width of the adhesive tape. The reason is as follows. When the thickness is less than 2 times, sufficient joint strength cannot be obtained. When the thickness is more than 50 times, the joint portion is used. The adhesive material will increase too much and cause the waste of the adhesive material. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be used reasonably. The adhesive may be a φ-transparent adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive, or an insulating spacer particle may be dispersed in these adhesives. The invention according to the first aspect of the invention is the adhesive tape for attaching one of the pads to which the electrode for the electrode bonding is applied to the substrate, and the other of the disks to be wound onto the other disk. The adhesive tape bonding method of the adhesive tape is characterized in that the end portion of one of the adhesive tapes is folded toward the opposite direction of the adhesive, and the beginning end of the other adhesive tape is folded toward the opposite direction of the adhesive. The bent portions of the two are mutually overlapped and the adhesive surfaces of the two are opposed to each other, and the overlapping portions are heated and pressed. In the invention described in the first aspect, in addition to the effects similar to those of the invention described in the first aspect, the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are hooked to each other. And the adhesive faces of the two will be connected to each other, so there is a high connection strength. According to the invention of the first aspect, the end portion of the adhesive tape of the invention of the ninth or tenth aspect is marked with an end mark. In the invention described in the eleventh aspect, in addition to the effects similar to those of the invention described in the ninth or tenth aspect, the end portion of the adhesive tape of one of the 13-(9) 1321868 end portions is executed by the end mark portion The part of the joining operation is easy to unravel and the connection can be made with the least necessary position, and the waste of the adhesive tape can be prevented. Further, since the end mark portion can be automatically detected, the detection signal control device can be used, and if an alarm can be issued, the work efficiency can be improved.

第1 2項記載之發明，係如第9〜1 1項之其中任一項 記載之發明’其特徵爲，以形成凹凸之一方之模具、及和 其咬合之另一方之模具，夾住一方之黏著材膠帶及另一方 φ 之黏著材膠帶之重疊部份，實施加熱壓著》 此第12項記載之發明時，除了具有和第9〜11項之 其中任一項記載之發明相同之作用效果以外，因爲連接部 份會形成凹凸而可擴大連接面積，同時，可利用凹凸部之 卡合來提高黏著材膠帶之拉伸方向（縱向）之連接強度。The invention according to any one of the items of the present invention, characterized in that the one of the embossing molds and the mold of the other one of the occlusions are sandwiched between The invention of the item 12 is the same as the invention described in any one of the items 9 to 11 in the case where the adhesive tape of the adhesive tape and the adhesive tape of the other φ are bonded to each other. In addition to the effect, since the joint portion is formed with irregularities, the joint area can be enlarged, and the joint of the uneven portion can be used to improve the joint strength in the stretching direction (longitudinal direction) of the adhesive tape.

第1 3項記載之發明，係如第9〜1 1項之其中任一項 記載之發明，其特徵爲，在一方之黏著材膠帶及另一方之 黏著材膠帶之重疊部份形成貫通孔後，實施重疊部份之加 φ 熱壓著。 此第1 3項記載之發明時，除了具有如第9〜1 1項之 其中任一項記載之發明相同之作用效果以外，因爲連接部 份會形成貫通孔，黏著劑會滲出至貫通孔之內緣’而增加 黏著劑之黏著面積，故可進一步提高連接強度。 第14項記載之發明，係用以連接矽處理基材上塗布 著電極連接用黏著劑之捲取至二方之盤上之—方之黏箸材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶的黏 著材膠帶連接方法，其特徵爲’一方之黏著材膠帶之終端The invention according to any one of the items of the present invention, wherein the one of the adhesive tape and the other adhesive tape is formed with a through hole , the implementation of the overlap part plus φ hot pressing. In addition to the effects of the invention described in any one of the items 9 to 11 above, the connection portion may form a through hole, and the adhesive may ooze out to the through hole. The inner edge 'increased the adhesive area of the adhesive, so the joint strength can be further improved. The invention according to the item 14 is for attaching the adhesive tape to which the electrode for the electrode bonding is applied to the enamel-treated substrate to the two-side disk, and for winding onto the other disk. The other method of bonding the adhesive tape of the adhesive tape, which is characterized by the end of the adhesive tape of one side

i SJ -14- (10) 1321868 部及另一方之黏著材膠帶之始端部會重疊或抵接，以跨越 兩黏著材膠帶之矽處理基材之表面部份的方式貼附矽粘著 膠帶，實施兩黏著材膠帶之連接。 此第14項記載之發明時，已捲取一方之黏著材膠帶 之黏著材盤、及只捲取黏著材膠帶之基材之捲取盤係裝著 於黏著裝置上，黏著材盤之黏著材膠帶用完時，已用完之 黏著材膠帶（一方之黏著材膠帶）之終端部、及新裝著之 φ 黏著材盤之黏著材膠帶（另一方之黏著材膠帶）之始端部 會以矽粘著膠帶連接，新黏著材盤會取代已用完之黏著材 盤而裝著於黏著裝置上。 本發明時，只需連接已用完之黏著材膠帶及新黏著材 膠帶即可更換連接盤，故很容易即可將新黏著材盤裝著至 黏著裝置上。又，因爲無需在每次更換新黏著材盤時都更 換捲取盤、或將新黏著材膠帶之始端裝設至捲取盤並引導 黏著材膠帶之作業，故只需要較少時間即可更換新黏著材 # 盤，而可提高電子機器之生產效率。 黏著材膠帶之基材係利用矽實施表面處理，使用之粘 著膠帶亦使用矽粘著劑，可減少兩者之表面張力的差異而 提高密著力，故可實現傳統上較困難之兩者的黏著。 黏著材膠帶之黏著劑可以爲將導電粒子分散於絕緣性 黏著劑中之向異導電性黏著者，亦可以爲只有絕緣性黏著 劑者，或者，將絕緣性隔件粒子分散於這些黏著劑中者。 第15項記載之發明，其特徵爲，第14項記載之矽粘 著膠帶之粘著劑面之表面張力及黏著材膠帶之矽處理基材 -15- (11) 1321868 之表面張力之差爲10mN/m ( 10dyne/cm)以下。 此第1 5項記載之發明時，除了具有和第1 4項記載之 發明相同之作用效果以外，因爲矽粘著膠帶之粘著劑面之 .表面張力及黏著材膠帶之矽處理基材之表面張力之差爲 10mN/m ( 10dyne/cm)以下，可獲得較強之密著力，而可 確實黏著兩者。表面張力係以潮濕試劑或接觸角來檢測。 黏著材膠帶之矽處理基材及矽粘著膠帶之粘著劑面的 表面張力差應爲0〜5mN/m ( 5dyne/cm)。表面張力之差 愈小愈好，若超過10mN/m ( 10dyne/cm)則可能無法獲得 充分密著強度。 第16項記載之發明，係如第2項記載之發明，其特 徵爲，矽粘著膠帶之黏著力係l〇〇g/25mm以上。 此第1 6項記載之發明時，除了具有和第2項記載之 發明相同之作用效果以外，一方及另一方之黏著材膠帶的 連接係利用對兩者之黏著劑面張貼矽粘著膠帶來實施黏著 φ ，一方及另一方之黏著材膠帶可獲得兩面之黏著（或密著 )，故可以高強度實施黏著。 尤其是，因爲黏著力爲100g/25mm以上，一方及另 一方之黏著材膠帶之兩黏著劑面的黏著會更爲強固。 黏著強度愈大可得到愈強之黏著強度，然而，小於 100g/25mm則可無法獲得特定強度。 - _第r?項記載之發萌，其特徵爲，使一方之黏著材膠 帶之終端部及另一方之黏著材膠帶之始端部重疊或抵接’ 並將第16項記載之矽粘著膠帶張貼於兩黏著材膠帶之兩 -16- (12) 1321868 面來實施連接。 此第17項記載之發明時，除了具有和第16項記載之 發明相同之作用效果以外’係以其兩面實施一方及另一方 之黏著材膠帶之連接’故可得到更爲強固之連接。 第1 8項記載之發明’係用以連接矽處理基材上塗布 著電極連接用黏著劑之捲取至一方之盤上之一方之黏著材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶的黏 φ 著材膠帶連接方法，其特徵爲，以一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部間夾著兩面塗布著矽 粘著劑之矽粘著膠帶之方式來實施兩黏著材膠帶之連接， 兩面之矽粘著劑和矽基材之表面張力之差爲l〇mN/m ( 10dyne/cm)以下，且黏著力爲100g/25mm以上。 此第1 8項記載之發明時，因爲使用兩面粘著劑之矽 粘著膠帶，而可以一方及另一方之黏著材膠帶間夾著兩面 矽粘著膠帶之方式來實施兩者之黏著（或密著），故兩者 %之連接十分簡單且容易。 第19項記載之發明，係用以連接基板上塗布著電極 連接用黏著劑之捲取至一方之盤上之一方之黏著材膠帶、 及捲取至另一方之盤上之另一方之黏著材膠帶的黏著材膠 帶連接方法，其特徵爲，一方之黏著材膠帶之終端部、及 另一方之黏著材膠帶之始端部會重疊或抵接，使糊狀之樹 脂製黏著劑附著於重疊部份或抵接部份，並以糊狀之樹脂 製黏著劑之硬化來實施兩者之連接。 此第19項記載之發明時，因爲已用完之黏著材膠帶i SJ -14- (10) 1321868 The beginning and the end of the adhesive tape of the other side will overlap or abut, and the adhesive tape will be attached to the surface of the substrate across the two adhesive tapes. Implement the connection of the two adhesive tapes. In the invention described in the fourteenth aspect, the adhesive sheet of the adhesive tape which has been taken up by one side, and the take-up tray of the base material which only winds up the adhesive tape are attached to the adhesive device, and the adhesive material of the adhesive material disk is attached. When the tape is used up, the end of the used adhesive tape (the adhesive tape of one side) and the adhesive tape of the newly installed φ adhesive material tape (the adhesive tape of the other side) will be Adhesive tape is attached, and the new adhesive sheet replaces the used adhesive sheet and is attached to the adhesive device. In the present invention, the lands are replaced by simply connecting the used adhesive tape and the new adhesive tape, so that the new adhesive platter can be easily attached to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, or to install the beginning of the new adhesive tape to the take-up reel and guide the adhesive tape, it takes less time to replace The new adhesive material #盘, can improve the production efficiency of electronic machines. The base material of the adhesive tape is subjected to surface treatment by using 矽, and the adhesive tape used also uses a 矽 adhesive, which can reduce the difference in surface tension between the two and improve the adhesion, so that it is possible to achieve both of the conventional difficulties. Adhesive. The adhesive for the adhesive tape may be a dissimilar conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive alone, or disperse the insulating spacer particles in the adhesive. By. The invention according to claim 15 is characterized in that the surface tension of the adhesive surface of the adhesive tape described in Item 14 and the surface tension of the adhesive substrate -15-(11) 1321868 of the adhesive tape are 10mN/m (10dyne/cm) or less. In the invention described in the fifteenth aspect, in addition to the effects similar to those of the invention described in the above item 14, the surface tension of the adhesive surface of the adhesive tape and the treatment of the substrate with the adhesive tape are When the difference in surface tension is 10 mN/m (10 dyne/cm) or less, a strong adhesion can be obtained, and both can be surely adhered. Surface tension is detected by wet reagents or contact angles. The surface tension difference between the adhesive substrate of the adhesive tape and the adhesive surface of the adhesive tape should be 0 to 5 mN/m (5 dyne/cm). The difference in surface tension is as small as possible, and if it exceeds 10 mN/m (10 dyne/cm), sufficient adhesion strength may not be obtained. The invention according to claim 2 is characterized in that the adhesive force of the adhesive tape is l〇〇g/25 mm or more. In the invention described in the sixteenth aspect, in addition to the effects similar to those of the invention described in the second aspect, the bonding of one of the other adhesive tapes is performed by attaching an adhesive tape to the adhesive faces of the two. Adhesive φ is applied, and the adhesive tape of one side and the other can obtain adhesion (or adhesion) on both sides, so that adhesion can be performed with high strength. In particular, since the adhesive force is 100 g/25 mm or more, the adhesion of the two adhesive faces of one of the other adhesive tapes is stronger. The stronger the adhesion strength, the stronger the adhesion strength, however, less than 100 g/25 mm, a specific strength cannot be obtained. - _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Attach the two-16-(12) 1321868 faces of the two adhesive tapes to perform the connection. In the invention described in the seventeenth aspect, in addition to the effects similar to those of the invention described in the sixteenth aspect, the connection between the one and the other of the adhesive tapes is carried out on both sides, so that a stronger connection can be obtained. The invention described in the above item 18 is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the disks, and to another disk. A method for joining adhesive tapes of one of the adhesive tapes, characterized in that the adhesive tape is coated on both sides by the end portion of one of the adhesive tapes and the other end of the adhesive tape. The adhesion of the two adhesive tapes was carried out by means of a tape, and the difference in surface tension between the adhesive on both sides and the base material was 10 μm/m (10 dyne/cm) or less, and the adhesive force was 100 g/25 mm or more. In the invention described in the above item 18, since the adhesive tape is applied to the adhesive tape of the double-sided adhesive, the adhesive tape of the one surface and the other adhesive tape can be adhered to each other by sandwiching the adhesive tape on both sides (or Closely, so the connection between the two is very simple and easy. The invention according to claim 19 is an adhesive tape for attaching one of the disks to which one of the disks for applying the electrode-bonding adhesive is applied to the substrate, and the other adhesive material for winding onto the other disk. A method for attaching an adhesive tape of a tape, characterized in that the end portion of one of the adhesive tapes and the beginning of the other adhesive tape are overlapped or abutted, so that the paste-like resin adhesive adheres to the overlapping portion Or the abutting part, and the connection of the two is made by the hardening of the paste-form resin adhesive. In the invention described in the 19th item, because the adhesive tape has been used up

WJ -17- (13) 1321868 之終端部、及新裝著之黏著材膠帶之始端部係以糊狀之樹 脂製黏著劑實施固定，故連接十分簡單。又，因爲無需在 每次更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠 帶之始端裝設至捲取盤之作業、以及在特定路徑設定導引 銷等之作業，只需要較少時間即可更換新黏著材盤，故可 提高電子機器之生產效率。The terminal part of WJ -17- (13) 1321868 and the beginning of the newly-applied adhesive tape are fixed by a paste-like adhesive, so the connection is very simple. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of installing the new adhesive tape to the take-up reel, and the setting of the guide pin in a specific path, it is only necessary to The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved.

因爲一方之黏著材膠帶之終端部、及另一方之黏著材 ^ 膠帶之始端部的重疊部份或抵接部份附著著樹脂製黏著劑 ，故連接具有高自由度。 第20項記載之發明，係如第1 9項記載之發明，其特 徵爲，樹脂製黏著劑係從熱硬化性樹脂、光硬化性樹脂、 及熱金屬黏著劑之群組中選取之至少1種材料所構成。Since the adhesive portion of the end portion of the adhesive tape of one of the adhesive tapes and the adhesive portion of the other tape is adhered to the overlapping portion or the abutting portion of the adhesive tape, the connection has a high degree of freedom. The invention according to claim 19, characterized in that the resin adhesive is at least one selected from the group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. Made up of materials.

此第20項記載之發明時，除了具有和第19項記載之 發明相同之作用效果以外，因爲可從熱硬化性樹脂、光硬 化性樹脂、熱金屬黏著劑之群組中選取適合用於黏著材膠 φ 帶間之連接的樹脂製黏著劑，故可提高黏著材膠帶間之連 接強度。 第21項記載之發明，其特徵爲，裝著著黏著材膠帶 之黏著裝置上，裝設著用以供應第19或20項記載之樹脂 製黏著劑的充塡機。 此第21項記載之發明時，因爲黏著裝置內配設著用 —以供應第-1 9或20-項13—載之樹脂製黏著劑的充塡機，_故無_ 另行準備充塡機，而可防止連接作業之浪費。 又，黏著裝置內除了充塡機以外，亦可具有以實施熱 -18- (14) 1321868 硬化性樹脂之硬化爲目的之加熱器、或以實施光硬化性樹 脂之光照射爲目的之紫外線。 第22項記載之發明，係用以將基材上塗布著電極連 接用黏著劑之黏著材膠帶捲取至盤之黏著材膠帶盤，其特 徵爲，黏著材膠帶盤在膠帶之寬度方向配設著複數黏著材 膠帶之捲部。In addition to the effects similar to those of the invention described in the twenty-ninth aspect, the invention of the invention of claim 20 is suitable for adhesion from a group of thermosetting resin, photocurable resin, and hot metal adhesive. The resin adhesive made of the glue φ between the tapes can improve the joint strength between the adhesive tapes. According to a twenty-first aspect of the invention, in the adhesive device comprising the adhesive tape, a charging device for supplying the resin adhesive according to the 19th or 20th aspect is provided. In the invention described in the twenty-first aspect, since the charging device is provided with a charging device for supplying the resin-made adhesive of the -1st or 20th-th 13th, the _ is not prepared separately. It can prevent the waste of connection work. Further, in the adhesive device, in addition to the charging device, a heater for the purpose of curing the heat-hardening resin or a light-emitting agent for performing light irradiation of the photocurable resin may be provided. The invention according to claim 22 is an adhesive tape for winding an adhesive tape coated with an electrode-bonding adhesive on a substrate to a disk, wherein the adhesive tape is disposed in the width direction of the tape. The roll of the multiple adhesive tape.

此第22項記載之發明時，因爲配設著複數黏著材膠 帶之捲部（捲部），複數之捲部當中，捲取至一方之捲部 之黏著材膠帶之全部捲出時，會將配置於全部捲出之捲部 之旁邊的另一方之捲部之黏著材膠帶裝設至捲取盤。 如此，因爲一方之黏著材膠帶全部捲出時，會將另一 方之黏著材膠帶裝設至捲取盤，而實施黏著材膠帶之更換 ，故無需將新黏著材膠帶盤裝著至黏著裝置上。因此，新 黏著材膠帶盤之更換作業會較少，故可提高電子機器之生 產效率。 因爲可依序使用捲取至複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 第23項記載之發明，係如第22項記載之發明，其特 徵爲，一方之黏著材膠帶之終端部及另一方之黏著材膠帶 -19- (15) 1321868 之始端部間，具有用以連接兩者之連結膠帶，一方之黏著 材膠帶之全部捲出時，會接著開始捲出另一方之黏著材膠 帶。 . 此第23項記載之發明時，除了具有和第22項記載之 發明相同之作用效果以外，因爲一方之黏著材膠帶之終端 部及另一方之黏著材膠帶之始端部係以連結膠帶實施連接 ，無需在一方之捲部之黏著材膠帶之全部捲出後將另一方 φ 之捲部之黏著材膠帶裝設至捲取盤上之作業，故可進一步 φ 提高電子機器之生產效率。 第24項記載之發明，係具有第23項記載之黏著材膠 帶盤、黏著材膠帶之捲取盤、配設於黏著材膠帶盤及捲取 盤之間且以加熱加壓頭將黏著材膠帶之黏著材壓著至電子 機器之電路基板的壓著部、以及用以檢測連結膠帶之膠帶 檢測手段的黏著裝置，其特徵爲，膠帶檢測手段檢測到連 結膠帶時，至連結膠帶通過壓著部爲止，會將連結膠帶捲 〇取至捲取盤。 ® 此第24項記載之發明時，因爲連結膠帶會自動捲取 至捲取盤，故一方之捲部之黏著材膠帶全部捲出後，會依 序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之舊煩。+ — > + · — _ 又，黏著裝置具有膠帶檢測手段，係由成對之發光部 及受光部所構成，用以實施連結膠帶之光學檢測。另一方 -20- I S1 (16) 1321868 面，連結膠帶之兩端配設著有顏色之（例如黑色）標記’ 受光部會利用發光部發出之雷射光檢測連結膠帶兩端之標 記來檢測連結膠帶。又，除了在連結膠帶附加標記以外， 可採用使連結膠帶之寬度和黏著材膠帶之寬度不同的方法 、或在連結膠帶上形成複數之孔的方法。 第2 5項記載之發明，係利用卡止具連接一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部的黏著材 φ 膠帶盤，其特徵爲，連接部份係以黏著材膠帶覆蓋卡止具 〇 此第2 5項記載之發明時，因爲利用卡止具來連接全 部捲出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始 端部，實施黏著材膠帶盤之更換，故將新黏著材膠帶盤裝 著至黏著裝置十分簡單。又，因爲無需在每次更換新黏著 材膠帶盤時都更換捲取膠帶、將新黏著材膠帶之始端裝設 至捲取盤之作業、以及在特定路徑設定導引銷等之作業， # 只需較少時間即可更換新黏著材膠帶盤，故可提高電子機 器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 -21 - (17) 1321868 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 _材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又，以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 φ 之始端部後，將連接部份朝膠帶之縱向反折1 80度，使黏 φ 著材膠帶覆蓋卡止具。 又，亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具 ° 第26項記載之發明，係具有第1項記載之黏著材膠 帶盤、黏著材膠帶之捲取盤、配設於黏著材膠帶盤及捲取 盤之間且以加熱加壓頭將黏著材膠帶之黏著材壓著至電子 機器之電路基板的壓著部、以及用以檢測膠帶之連接部份 φ 的連接部檢測手段之黏著裝置，其特徵爲，連接部檢測手 Φ 段檢測到膠帶之連接部份時，至連接部份通過壓著部爲止 ，會將一方之黏著材膠帶捲取至捲取盤。 此第26項記載之發明時，連接部檢測手段若檢測到 連接部份，則因爲至連接部份通過壓著部爲止，會將一方 之黏著材膠帶捲取至捲取盤，故可防止連接部份到達壓著 — 部畤實施壓著動作之苘題。又，至連接部份通過壓著部爲_ "" 止，因爲會自動將一方之黏著材膠帶捲取至捲取盤，故可 省略捲取之麻煩。 -22- [S] (18) 1321868 第27項記載之發明，係如第26項記載之發明，其特 徵爲，連接部檢測手段係CCD攝影機、厚度檢測感測器 、及透射率檢測感測器之其中之一。 此第27項記載之發明時，除了具有和第26項記載之 發明相同之作用效果以外，以簡單之構成即可實施連接部 份之檢測，而且，可利用這些手段提高檢測精度。 例如，採用CCD攝影機做爲連接部檢測手段時，可 0 使連接部份之表面顯示於監視畫面，以比較圖素之濃淡來 檢測連接部份。又，採用厚度檢測感測器時，因爲連接部 份之厚度會大於黏著材膠帶之厚度，因可以比較厚度之變 化來檢測連接部份。又，採用透射率感測器時，會因爲連 接部份之厚度較厚，且因爲有卡止具而使透射率降低，故 可以比較透射率之値來檢測連接部份。 第28項記載之黏著材膠帶連接方法，其特徵爲，利 用卡止具連接一方之黏著材膠帶之終端部及另一方之黏著 φ 材膠帶之始端部，連接部份會以黏著材膠帶覆蓋卡止具。 此第28項記載之發明時，係利用卡止具連接全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 來實施黏著材膠帶盤之更換’故將新黏著材膠帶盤裝著至 黏著裝置十分簡單。又’因爲無需在每次更換新黏著材膠 帶盤時都更換捲取膠帶、將新黏著材膠帶之始端裝設至捲 取盤之作業、以及在特定路徑設定導引銷等之作業’只需 較少時間即可更換新黏著材膠帶盤’故可提高電子機器之 生產效率。 -23- (19) 1321868 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 ^ 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 · 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又，以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折180度，使黏 φ著材膠帶覆蓋卡止具。 ® 又，亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 第29項記載之發明，係在基材上塗布黏著劑，並捲 成盤狀之黏著劑膠帶’其特徵爲’基材上會在膠帶之縱向 上配置著複數條黏著劑。 ——此第29項記載之發明畤，若使用黏著劑膠帶「將已 __ 捲取黏著劑膠帶之盤及空盤裝著至黏著裝置’對電路基板 實施黏著劑之加熱加壓後’並以將基材捲至空盤之方式裝 -24- (20) 1321868 著。 其次，對電路基板實施黏著劑之加熱加壓時，將配設 於基材之寬度方向的複數條黏著劑當中之1條壓著至電路 基板，壓著後之殘餘黏著劑條會和基材同時被捲取至空盤 。其次，盤上之黏著劑膠帶全部捲出後，會使盤之旋轉方 向逆轉，而使黏著劑膠帶之供應方向逆轉。如此，在各次 使用1條黏著劑後，會同時捲取殘餘之黏著劑及基材，並 Φ 重複依序使用殘餘之黏著劑條。因此，因爲會依序逐條使 用複數條黏著劑，故無需增加膠帶之捲數，即可大幅增加 1盤（2倍以上）可使用之黏著劑量。 本發明時，無需增加黏著劑膠帶之捲數，可大幅增加 使用黏著劑量。而且，因爲未增加黏著劑膠帶之捲數，故 可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度方向 滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可防止 阻塞，此外，亦可防止因爲基材較長而容易發生之伸展等 # 弊病（基材之損傷或切斷）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高製造效率。 _ 又，黏著劑膠帶之製造上，因爲每1盤之黏著劑量較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 又，結束第1條黏著劑之壓著而將黏著劑膠帶捲取至 空盤後，爲了使用下1條黏著劑，不逆轉旋轉方向而更換 裝著於黏著裝置之2個盤亦可。 -25- (21) 1321868 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 基材之寬度應爲5mm〜1 000mm，然而，可依1條黏 著劑之寬度或黏著劑之條數而任意選取。1條黏著劑之寬 度應爲〇.5mm〜10.0mm。In the invention described in the 22nd aspect, since the roll portion (roll portion) of the plurality of adhesive tapes is disposed, when all of the plurality of adhesive tapes wound up to one of the rolls are unwound, The adhesive tape disposed on the other side of the rolled portion of the rolled-out portion is attached to the take-up reel. In this way, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the take-up reel, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. . Therefore, the replacement of the new adhesive tape can be reduced, so that the productivity of the electronic machine can be improved. Since the adhesive tape taken up to the plurality of rolls can be sequentially used, it is possible to greatly increase the usable adhesive amount for one replacement operation without increasing the number of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention according to claim 22, characterized in that the end portion of one of the adhesive tapes and the other end of the adhesive tape -19-(15) 1321868 are used for When the bonding tape of the two is connected, when all of the adhesive tape of one side is unwound, the adhesive tape of the other side is then rolled out. In addition to the effects of the invention described in the twenty-second aspect, the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are connected by a connecting tape. Therefore, it is not necessary to install the adhesive tape of the other φ roll portion onto the take-up reel after the entire adhesive tape of one of the rolls is unwound, so that the production efficiency of the electronic device can be further improved. The invention according to claim 24, comprising the adhesive tape tray of the item 23, the take-up reel of the adhesive tape, the adhesive tape and the take-up reel, and the adhesive tape by the heat press head The adhesive device is pressed against the pressing portion of the circuit board of the electronic device, and the adhesive device for detecting the tape detecting means for connecting the tape, wherein when the tape detecting means detects the connecting tape, the connecting tape passes through the pressing portion. The link tape roll is then taken to the take-up reel. ® In the invention described in item 24, since the connecting tape is automatically taken up to the take-up reel, the adhesive tape of one of the rolls is completely unwound, and the adhesive tape is taken out from the next roll in that order. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the old trouble of winding can be omitted. + — > + · — _ Further, the adhesive device has a tape detecting means, and is composed of a pair of light-emitting portions and a light-receiving portion for performing optical detection of the connecting tape. On the other side, -20- I S1 (16) 1321868, the ends of the connecting tape are provided with a colored (for example, black) mark. The light-receiving part detects the link by using the marks on both ends of the link light of the laser light emitted from the light-emitting part. tape. Further, in addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the connecting tape may be employed. The invention according to the twenty-fifth aspect is an adhesive material φ tape tray in which the end portion of one of the adhesive tapes and the other end of the adhesive tape are connected by a locking device, and the connecting portion is made of an adhesive material. In the case of the invention described in the twenty-fifth aspect, the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are joined by the use of the stopper to carry out the adhesive tape tray. Replacement, so it is very simple to install the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time the new adhesive tape is replaced, the operation of attaching the beginning of the new adhesive tape to the take-up reel, and setting the guide pin in a specific path, etc. It takes less time to replace the new adhesive tape tray, which can improve the production efficiency of the electronic machine. Since the adhesive tape is used in sequence, it is possible to greatly increase the adhesive amount that can be used for one replacement operation without increasing the number of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. -21 - (17) 1321868 In addition, the connection part of the end part of the adhesive tape of one side and the beginning part of the adhesive tape of the other side is good because the adhesive tape is used to cover the locking piece, and at the same time, The card holder of the connecting portion is prevented from contacting the adhesive tape to damage the adhesive tape, or the heating member such as the heating press head or the support table that damages the adhesive device. Moreover, the method of covering the card with the adhesive tape should be such that the end portion of the adhesive tape φ at the end of the adhesive tape and the other end of the adhesive tape φ are placed in the longitudinal direction of the tape. Reflexed by 180 degrees, the adhesive tape covers the card holder. Further, the other adhesive material tape may be wound around the connecting portion to cover the locking device. The invention described in the item 26 is the adhesive tape disk of the first item, the winding disk of the adhesive tape, and the adhesive tape. a pressing portion between the material tape tray and the take-up reel and pressing the adhesive material of the adhesive tape to the circuit board of the electronic device with a heating and pressing head, and a connecting portion detecting means for detecting the connecting portion φ of the tape The adhesive device is characterized in that when the connecting portion detecting hand Φ section detects the connecting portion of the tape, the connecting portion passes through the pressing portion, and one of the adhesive tapes is taken up to the take-up reel. According to the invention of the twenty-sixth aspect, when the connecting portion detecting means detects the connecting portion, since the connecting portion passes through the pressing portion, one of the adhesive tapes is taken up to the take-up reel, thereby preventing the connection. Part of the arrival is pressed - the part of the Ministry of the implementation of the pressing action. Moreover, the connection portion is _ "" by the pressing portion, since the adhesive tape of one side is automatically taken up to the take-up reel, the trouble of winding can be omitted. The invention according to the twenty-seventh aspect, wherein the connection detecting means is a CCD camera, a thickness detecting sensor, and a transmittance detecting sensor. One of the devices. In the invention described in the twenty-seventh aspect, in addition to the effects similar to those of the invention described in the twenty-sixth aspect, the connection portion can be detected with a simple configuration, and the detection accuracy can be improved by these means. For example, when a CCD camera is used as the connection detecting means, the surface of the connecting portion can be displayed on the monitor screen to compare the pixels of the pixels to detect the connected portion. Further, when the thickness detecting sensor is used, since the thickness of the connecting portion is larger than the thickness of the adhesive tape, the connecting portion can be detected by comparing the thickness variations. Further, when the transmittance sensor is used, since the thickness of the connecting portion is thick and the transmittance is lowered by the use of the locking member, the connection portion can be detected by comparing the transmittance. The method for attaching an adhesive tape according to Item 28, characterized in that the end portion of the adhesive tape of one of the adhesive tapes and the beginning of the adhesive tape of the other of the adhesive tapes are attached by the stopper, and the connection portion covers the card with the adhesive tape. Stopper. In the invention described in the 28th item, the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are connected by the stopper to perform the replacement of the adhesive tape, so that the new adhesive material is used. It is very simple to install the tape tray to the adhesive device. 'Because there is no need to change the take-up tape every time the new adhesive tape is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path. The new adhesive tape tray can be replaced in less time, thus increasing the production efficiency of the electronic machine. -23- (19) 1321868 Since the adhesive tape is used in sequence, it is possible to increase the number of adhesives that can be used for one replacement operation without increasing the number of adhesive tapes of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. ^ Also, the connection part of the adhesive tape of one side and the adhesive part of the other side of the tape, because the adhesive tape covers the card holder, the appearance is good, and at the same time, the connection portion can be prevented. The card stopper contacts the adhesive tape to damage the adhesive tape, or the heating member such as the heating press head or the support table that damages the adhesive device. Moreover, the method of covering the locking device with the adhesive tape should be such that the connecting portion is opposite to the longitudinal direction of the tape after the end portion of the adhesive tape attached to one side of the locking device and the beginning end of the other adhesive tape. Fold 180 degrees, so that the sticky φ tape covers the card holder. ® Also, other adhesive tapes can be used to wrap the connection to cover the card holder. The invention according to claim 29 is characterized in that an adhesive is applied to a substrate and is wound into a disk-shaped adhesive tape, which is characterized in that a plurality of adhesives are disposed on the substrate in the longitudinal direction of the tape. - In the invention described in the 29th item, if an adhesive tape is used, "the disk and the empty disk which have been taken up by the adhesive tape are attached to the adhesive device", and the adhesive is heated and pressurized on the circuit substrate. In the case where the substrate is wound up to an empty tray, it is installed in the manner of -24-(20) 1321868. Next, when the circuit substrate is subjected to heating and pressing of the adhesive, it is disposed in a plurality of adhesives disposed in the width direction of the substrate. 1 piece is pressed to the circuit substrate, and the residual adhesive strip after pressing is taken up to the empty tray at the same time as the substrate. Secondly, after the adhesive tape on the disc is completely rolled out, the rotation direction of the disc is reversed, and The direction of supply of the adhesive tape is reversed. Thus, after each adhesive is used, the residual adhesive and the substrate are simultaneously taken up, and the residual adhesive strip is repeatedly used in sequence. Therefore, because By using a plurality of adhesives one by one, it is possible to greatly increase the adhesive amount that can be used in one disk (more than 2 times) without increasing the number of tapes. In the present invention, it is possible to increase the number of adhesive tapes without increasing the number of adhesive tapes. Use an adhesive dose. Since the number of the adhesive tape is not increased, the winding can be prevented from being scattered, and at the same time, the adhesive can be prevented from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, blocking can be prevented. In addition, it is possible to prevent stretching or the like which is likely to occur due to the long length of the substrate (damage or cutting of the substrate). Since the manufacturing unit of the electronic component can reduce the number of replacement of the new adhesive tape, the manufacturing efficiency can be improved. _ Moreover, in the manufacture of the adhesive tape, since the adhesion amount per one disk is large, the use amount of the disk material and the moisture prevention material can be reduced, so that the manufacturing cost can be reduced. Further, the pressure of the first adhesive is ended. After the adhesive tape is taken up to the empty tray, in order to use the next adhesive, the two discs attached to the adhesive device can be replaced without reversing the rotation direction. -25- (21) 1321868 Adhesive can be The dissimilar conductive adhesive in which the conductive particles are dispersed in the insulating adhesive may be an insulating adhesive only, or the insulating spacer particles may be dispersed in the adhesive. The width of the substrate should be 5mm~1 000mm, however, it can be arbitrarily selected according to the width of one adhesive or the number of adhesives. The width of one adhesive should be 〇5mm~10.0mm.

基材之寬度應爲 5mm〜1 000mm，基材之寬度低於 5mm時，配設於基材上之黏著劑之條數及黏著劑之寬度 會受到制限，大於l〇〇〇mm時，則無裝著至既存之黏著裝 置。 第3 0項記載之發明，係如第2 9項記載之發明，其特 徵爲，複數條黏著劑之相鄰的黏著劑條具有間隔。 此第30項記載之發明時，除了具有和第29項記載之 發明相同的作用效果以外，同時，因爲相鄰之黏著劑條間 爲互相分離，故容易實施黏著劑之逐條壓著。The width of the substrate should be 5mm~1 000mm. When the width of the substrate is less than 5mm, the number of adhesives disposed on the substrate and the width of the adhesive will be limited. When it is greater than l〇〇〇mm, then There is no attachment to the existing adhesive device. The invention of claim 30 is the invention according to the twenty-ninth aspect, characterized in that the adjacent adhesive strips of the plurality of adhesives have a space. In the invention described in the 30th aspect, in addition to the same effects as those of the invention described in the 29th item, since the adjacent adhesive strips are separated from each other, it is easy to carry out the pressing of the adhesive one by one.

第3 1項記載之發明，係如第29項記載之發明，其特 徵爲，黏著劑係利用在膠帶之縱向上形成縫隙來分離成複 數條。 此第31項記載之發明時，除了具有和第29項相同的 作用效果以外，同時，在基材之單面全面塗布黏著劑，並 將黏著劑壓著至電路基板之前一瞬間，亦即，在使用黏著 劑膠帶之前一瞬間，尙以切^刃等使黏著劑具有切痕之方式 來形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時，以切According to the invention of claim 29, the adhesive according to the invention is characterized in that the adhesive is separated into a plurality of strips by forming a slit in the longitudinal direction of the tape. In the invention described in the 31st aspect, in addition to the same effect as the item 29, the adhesive is applied to one side of the substrate, and the adhesive is pressed to the circuit board immediately, that is, Immediately before the use of the adhesive tape, the crucible is formed by cutting the edge of the adhesive so that the adhesive has a cut. Moreover, the formation of the gap can also be cut when manufacturing the adhesive tape.

-26- (22) 1321868 刃等使黏著劑具有切痕而形成縫隙。 縫隙之形成上，除了利用切刃以外，亦可利用雷射或 電熱線等來形成。 本發明時，可增加配置於基材上之黏著劑條的條數。 第32項記載之發明，係在基材上塗布黏著劑，並將 其捲成盤狀之黏著劑膠帶製造方法，其特徵爲，以在基材 之寬度方向具有間隔之方式配置之塗布器，對以連續方式 φ 搬運之基材面上供應黏著劑來對基材實施複數條黏著劑之 塗布。 此第3 2項記載之發明時，可以利用既存設備製造如 第3 0項記載之黏著劑膠帶。 塗布器可以爲配設於基材之寬度方向的複數滾筒，亦 可以爲噴嘴》 第33項記載之發明，係在基材上塗布黏著劑，並將 其捲成盤狀之黏著劑膠帶製造方法，其特徵爲，在一方之 # 基材之單面全面塗布黏著劑，並在黏著劑上形成縱向之縫 隙後，在黏著劑面上配置另一方之基材，以一方及另一方 之基材夾住黏著劑，然後再使一方之基材及另一方之基材 互相分離，一方及另一方之基材上分別交互貼附著複數條 黏著劑，而在一方及另一方之基材上以具有間隔之方式配 置複數條黏著劑。 此第33項記載之發明時，因爲可以同時製造2個如 第2項記載之黏著劑膠帶，故具有良好製造效率。 第34項記載之發明，係在基材上塗布黏著劑，並利 -27- (23) 1321868 用捲成盤狀之黏著劑膠帶將黏著劑壓著至電路基板之黏著 劑壓著方法，其特徵爲，基材之單面全面會塗布著黏著劑 ，對黏著劑膠帶之寬度方向的部份黏著劑從基材側沿膠帶 .之縱向實施加熱加壓形成條狀，降低經過加熱之部份之黏 著劑的凝聚力並壓著至電路基板，壓著後，將殘餘之黏著 劑和基材同時捲成盤狀，並再度利用捲成盤狀之黏著劑膠 帶對電路基板實施殘餘之黏著劑的加熱加壓。 φ 此第34項記載之發明時，以對部份黏著劑加熱來降 < 低該部份之凝聚力（以下簡稱爲「凝聚力降低線」），從 凝聚力降低線將經過加熱之部份的黏著劑壓著至電路基板 ，而和基材分離。殘餘之黏著劑會保持殘留於基材上之情 形下，和基材同時被捲取至空盤。 本發明時，因爲只是使黏著劑膠帶客寬度較傳統稍爲 寬一點而已，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑寬度，可以改變加熱 φ 區域來進行任意設定，故壓著黏著劑寬度具有較高之自由 < 度。 又，和第29項記載之發明相同，黏著劑膠帶全部捲 出至空盤時，使盤之旋轉方向逆轉，而使膠帶之供應方向 逆轉、或保持盤之旋轉方向但將盤相互交換。利用此方式 ，因爲會依逐條對基材上之黏著劑加熱並壓著至電路基板 ，可在不增加蓚帶之捲數的情形下，大幅增加1盤可使用 ’ 之黏著劑量。 又，和第29項記載之發明相同，因爲未增加捲數卻 •28- [S] (24) (24)-26- (22) 1321868 The edge of the adhesive causes the adhesive to have a cut to form a gap. The formation of the slit can be formed by using a laser or a heating wire in addition to the cutting edge. In the present invention, the number of the adhesive strips disposed on the substrate can be increased. The invention according to claim 32 is a method for producing an adhesive tape which is coated on a substrate and which is wound into a disk shape, and is characterized in that the applicator is disposed so as to have a space in the width direction of the substrate. The adhesive is applied to the substrate surface conveyed in a continuous manner φ to apply a plurality of adhesives to the substrate. In the invention described in the item 3, the adhesive tape described in item 30 can be produced by using an existing device. The applicator may be a plurality of rollers disposed in the width direction of the substrate, or may be a nozzle according to the invention described in Item 33, which is a method of manufacturing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape. It is characterized in that the adhesive is completely applied to one side of one of the substrates, and a longitudinal gap is formed on the adhesive, and the other substrate is disposed on the adhesive surface, and the substrate is one and the other. The adhesive is sandwiched, and then one of the substrate and the other substrate are separated from each other, and one or the other of the substrates is alternately attached with a plurality of adhesives, and one and the other of the substrates are provided with A plurality of adhesives are arranged in a spaced manner. In the invention described in the thirty-third aspect, since the two adhesive tapes as described in the second item can be simultaneously produced, the production efficiency is good. The invention according to claim 34 is an adhesive applying method in which an adhesive is applied to a substrate, and the adhesive is pressed onto the circuit substrate by a tape-like adhesive tape, which is -27-(23) 1321868. The method is characterized in that a single surface of the substrate is coated with an adhesive, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed from the substrate side along the longitudinal direction of the tape to form a strip shape, and the heated portion is lowered. The cohesive force of the adhesive is pressed against the circuit substrate, and after pressing, the residual adhesive and the substrate are simultaneously wound into a disk shape, and the residual adhesive is applied to the circuit substrate by using the adhesive tape rolled into a disk shape. Heat and pressure. φ In the invention described in the 34th item, the part of the adhesive is heated to lower the cohesive force of the part (hereinafter referred to as "cohesion reducing line"), and the heated portion is adhered from the cohesive force reducing line. The agent is pressed against the circuit substrate and separated from the substrate. The residual adhesive will remain on the substrate and will be taken up to the empty tray at the same time as the substrate. In the present invention, since the adhesive tape width is only slightly wider than the conventional one, the adhesive tape can be directly produced by using the existing equipment. Further, by pressing the width of the adhesive to the circuit board, the heating φ region can be changed to be arbitrarily set, so that the adhesive adhesive width has a high degree of freedom. Further, in the same manner as the invention of the twenty-ninth aspect, when the adhesive tape is all wound up to the empty tray, the rotation direction of the disk is reversed, and the supply direction of the tape is reversed, or the disk is rotated, but the disks are exchanged. In this way, since the adhesive on the substrate is heated and pressed to the circuit substrate one by one, the adhesive amount of one disk can be greatly increased without increasing the number of tapes of the tape. Also, it is the same as the invention described in the 29th item, because the number of volumes is not increased. • 28- [S] (24) (24)

1321868 可增加黏著劑量，故可防止捲取散亂，同時， 因黏著劑之滲出而造成之阻塞、及防止因基材 成之弊病等之效果。 膠帶寬度應爲5mm〜1 000mm，壓著至電 著劑應爲〇.5mm〜1.5mm。膠帶寬度爲5mm> 理由如下，因爲膠帶寬度低於5mm時，每1 壓著次數會較少，而大於1000mm時，將無法 之黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏 異導電性黏著劑、亦可以爲只有絕緣性黏著劑 絕緣性之隔件粒子分散於這些黏著劑中者。 第3 5項記載之發明，係在基材上塗布黏 成盤狀之黏著劑膠帶，其特徵爲，黏著劑膠帶 電路基板之一邊之長度相同或以上，且在膠帶 上配置著複數條黏著劑。 此第3 5項記載之發明時，係以寬度和電 邊重疊的方式來配置黏著劑膠帶，故可直接泊 之一邊對配設於黏著劑膠帶之寬度方向的1條 加熱加壓。 因爲黏著劑膠帶之寬度爲電路基板之一 ，黏著劑膠帶只需拉出黏著劑之條寬即可。 其次，將黏著劑壓著至電路基板之一邊 基板，使另一邊位於黏著劑膠帶之寬度方向 一邊實施黏著劑條之加熱加壓。如此，依序 得到可防止 之伸展而造 路基板之黏 1 0 0 0 mm 之 盤之黏著劑 裝著至既存 著劑中之向 者、或者將 著劑，並捲 之寬度爲和 之寬度方向 路基板之一 著電路基板 黏著劑實施 之長度以上 ，旋轉電路 位置，對另 電路基板之 -29- (25) 1321868 其他邊實施黏著劑之壓著，很容易即可對電路基板之四周 實施黏著劑之壓著。 因此，因爲可依序逐條使用具有電路基板之一邊之長 度以上之黏著劑，而一次之使用量爲黏著劑條之寬度尺寸 份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可使 用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面，因電子構件之製造工廠可減少新黏著劑膠 帶之更換次數，故可提高製造效率。 又，黏著劑膠帶之製造上，因每1盤之黏著劑量會較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 黏著劑膠帶之寬度爲電路基板之一邊之尺寸以上，例 如，5mm〜3000mm。又，即使尺寸小於電路基板之一邊 -之-尺-寸-的-黏-著劑—膠帶、亦可以—在—黏著爾膠―帶之寬度方向1已一 置複數條相鄰接之方式來使其具有電路基板之一邊之尺寸 。此時，因很容易即可對應不同尺寸之電路基板故可提高 -30- (26) 1321868 生產效率。1條黏著劑之寬度應爲例如〇.5mm〜10.Omm。 黏著劑膠帶之寬度爲5 mm〜3000 mm之理由如下，電 路基板之一邊之尺寸很少會小於5mm，而大於3000mm 時，盤之寬度會太寬，而可能無法裝著至既存之黏著裝置 〇 第3 6項記載之發明，係如第3 5項記載之發明，其特 徵爲，以相鄰之黏著劑條具有間隔之方式配設複數條黏著 • 劑。 此第3 6項記載之發明時，除了具有和第3 5項記載之 發明相同之作用效果以外，因爲鄰接之黏著劑條爲分離， 很容易即可將黏著劑逐條從基材剝離並實施壓著。 第3 7項記載之發明，係如第3 5項記載之發明，其特 徵爲，黏著劑係利用形成於膠帶之寬度方向的縫隙而分離 成複數條。 此第3 7項記載之發明時，除了具有和第3 5項相同的 # 作用效果以外，同時，黏著劑膠帶係採用將黏著劑塗布於 基材之單面全面並使其乾燥者，在將黏著劑壓著至電路基 板之前一瞬間，亦即，在使用黏著劑膠帶之前一瞬間，利 用以切刃等使黏著劑具有切痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 本發明時，除了可增加配置於基材上之黏著劑條的條 數以外’在膠帶之寬度方向配置複數條黏著劑之黏著劑膠 -31 - (27) 1321868 帶的製造更爲容易。 第3 8項記載之發明，係在基材上塗布黏著劑，並將 其捲成盤狀之黏著劑膠帶製造方法，其特徵爲，將黏著劑 .塗布於一方之基材之全面，並在黏著劑上沿著膠帶之寬度 方向形成縫隙後，在黏著劑面上配置另一方之基材，以一 方及另一方之基材夾住黏著劑，然後再使一方之基材及另 一方之基材互相分離，一方及另一方之基材上分別交互貼 φ 附著複數條黏著劑，而在一方及另一方之基材上以具有間 隔之方式配置著複數條黏著劑。 此第3 8項記載之發明時，因爲可以利用既存設備同 時製造2個如第2項記載之黏著劑膠帶，故具有良好製造 效率。 第39項記載之發明，係一種黏著劑膠帶壓著方法， 其特徵爲，將第35〜37項之其中任一項記載之黏著劑膠 帶配置於電路基板上，沿著寬度方向對黏著劑膠帶實施加 φ 熱加壓，將黏著劑條壓著至電路基板之一邊。此壓著方法 亦可採用如下之方式，亦即，將黏著劑膠帶配置於電路基 板上，沿著寬度方向對黏著劑膠帶實施加熱加壓，將黏著 劑條壓著至電路基板之一邊，其次，變更電路基板之位置 ，並沿著黏著劑膠帶之寬度方向對電路基板之另一邊實施 黏著劑膠帶之加熱加壓，將下一黏著劑條壓著至電路基板 之貫=嘗f ---------------------------------------- 此第39項記載之發明時，除了具有和第35〜37項之 其中任一項記載之作用效果以外，將黏.著劑膠帶裝著於黏 -32- ] (28) 1321868 著裝置後，可將電路基板之一邊配置於黏著劑膠帶之寬度 方向，將黏著劑壓著至電路基板之一邊，其次，將電路基 板旋轉大約90度，使電路基板之另一邊位於和黏著劑膠 帶之寬度方向成爲平行之位置上，並將黏著劑壓著至電路 基板之另一邊。如此，可依序將電路基板旋轉90度並實 施回黏著劑之壓著，很簡單即可將黏著劑壓著於電路基板 之四周，而提高電子構件之製造工廠的作業效率。 φ 第40項記載之發明的特徵如下，至少在移動電路基 板之搬運路上配置2條第3 5〜3 7項之其中任一項記載之 黏著劑膠帶，一方之黏著劑膠帶之配置上，其寬度方向和 搬運路成垂直，另一方之黏著劑膠帶之配置上，其寬度方 向係沿著搬運路之方向，一方之黏著劑膠帶係針對電路基 板之相對2邊沿著寬度方向實施黏著劑膠帶之加熱加壓將 黏著劑條壓著至電路基板之相對2邊，其次，使電路基板 朝另一方之黏著劑膠帶移動，針對電路基板之其餘2邊從 # 基材側沿著寬度方向實施黏著劑膠帶之加熱加壓，將黏著 劑條壓著於電路基板之四周。 此第40項記載之發明時，除了具有和第35〜37項記 載之作用效果以外，無需旋轉電路基板而將其移至一方之 黏著劑膠帶及另一方之黏著劑膠帶之位置，在各位置上沿 著寬度方向實施加熱加壓，而很容易即可將黏著劑壓著於 電路基板之四周，具有良好作業效率。 第41項記載之發明，係在基材之單面全面塗布黏著 劑，並利用捲成盤狀之黏著劑膠帶對電路基板實施黏著劑 -33- (29) 1321868 之壓著的黏著劑膠帶壓著方法，其特徵爲，黏著劑膠帶之 寬度爲電路基板之一邊之長度以上’從寬度方向實施黏著 劑膠帶之寬度方向之部份黏著劑的加熱加壓，降低加熱部 份之黏著劑的凝聚力’將黏著劑壓著至電路基板。 此第41項記載之發明時，在將黏著劑壓著至電路基 板之周圍時，係將黏著劑膠帶裝著至黏著裝置並沿著寬度 方向實施黏著劑膠帶之加熱加壓，降低該部份之凝聚力（ 以下簡稱爲「凝聚力降低線」），加熱部份之黏著劑會沿 著凝聚力降低線從基材分離而壓著至電路基板上。其次， 將電路基板旋轉約90度，使相鄰之邊位於黏著劑膠帶之 寬度方向之位置上，沿著寬度方向實施下一黏著劑條之加 熱加壓，將黏著劑條之黏著劑壓著至相鄰之邊。如此，可 依序將黏著劑壓著至電路基板之四邊，而有良好作業效率 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可，1321868 can increase the adhesion dose, so it can prevent the coiling from being scattered, and at the same time, it can be blocked due to the leakage of the adhesive, and the effect of preventing the defects caused by the substrate. The width of the tape should be 5mm~1 000mm, and the pressure should be 〇5mm~1.5mm. The tape width is 5 mm> The reason is as follows. Since the tape width is less than 5 mm, the number of times of pressing is less, and when it is more than 1000 mm, the device cannot be adhered. The adhesive may be one in which the conductive particles are dispersed in the insulating and viscous conductive adhesive, or the spacer particles in which only the insulating adhesive is insulating are dispersed in the adhesive. The invention according to claim 35, wherein the adhesive tape is adhered to the substrate, and the adhesive tape has a length of one side or more, and a plurality of adhesives are disposed on the adhesive tape. . In the invention described in the 35th aspect, the adhesive tape is disposed so as to overlap the width and the electric side. Therefore, one of the width directions of the adhesive tape can be heated and pressurized by one side of the adhesive. Since the width of the adhesive tape is one of the circuit substrates, the adhesive tape only needs to be pulled out of the width of the adhesive. Next, the adhesive is pressed to one side of the substrate of the circuit board, and the other side is heated and pressurized by the adhesive strip on the side in the width direction of the adhesive tape. In this way, the adhesive which prevents the stretching and the adhesion of the circuit board to the 0 0 0 mm disk is sequentially attached to the carrier or the agent in the existing agent, and the width of the roll is the width direction of the package. One of the circuit boards is more than the length of the circuit substrate adhesive, and the position of the rotating circuit is pressed against the other side of the other circuit board -29-(25) 1321868, so that it is easy to adhere to the periphery of the circuit board. The pressure of the agent. Therefore, since the adhesive having a length longer than one side of the circuit board can be used one by one, and the amount of use of the adhesive strip is one time, the width of the adhesive strip can be increased, and the number of the adhesive tape can be increased without increasing the number of the adhesive tape. Adhesive dose that can be used. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. Further, in the manufacture of the adhesive tape, since the amount of adhesion per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The width of the adhesive tape is greater than the size of one side of the circuit substrate, for example, 5 mm to 3000 mm. Moreover, even if the size is smaller than one side of the circuit board - the tape-inch-adhesive-adhesive tape, the tape can be placed in a plurality of adjacent directions in the width direction of the tape. It has the size of one side of the circuit substrate. At this time, the circuit board of different sizes can be easily replaced, so that the production efficiency of -30-(26) 1321868 can be improved. The width of one adhesive should be, for example, 〇5 mm to 10.0 mm. The reason why the width of the adhesive tape is 5 mm to 3000 mm is as follows. The size of one side of the circuit substrate is rarely less than 5 mm, and when it is larger than 3000 mm, the width of the disk is too wide, and may not be attached to the existing adhesive device. The invention of claim 3 is the invention according to the item 35, characterized in that the plurality of adhesives are disposed so as to be spaced apart from each other by the adjacent adhesive strips. In the invention described in the thirty-sixth aspect, in addition to the same effects as those of the invention described in the item 35, since the adjacent adhesive strips are separated, the adhesive can be easily peeled off from the substrate one by one and carried out. Pressed. The invention according to claim 3, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the item 37, in addition to the same effect as the item 35, the adhesive tape is applied by applying an adhesive to one side of the substrate and drying it. Immediately before the adhesive is pressed to the circuit board, that is, immediately before the use of the adhesive tape, the gap is formed by cutting the adhesive with a cutting edge or the like. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. In the present invention, in addition to the number of the adhesive strips disposed on the substrate, the adhesive tape-31-(27) 1321868 tape in which a plurality of adhesives are disposed in the width direction of the tape is easier to manufacture. The invention of claim 38 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, wherein the adhesive is applied to one of the base materials and is After forming a gap in the width direction of the adhesive on the adhesive, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one of the substrates and the other base is placed. The materials are separated from each other, and one or the other of the substrates is affixed with φ to adhere a plurality of adhesives, and a plurality of adhesives are disposed on one or the other of the substrates at intervals. According to the invention of the third aspect, since the two adhesive tapes as described in the second item can be simultaneously produced by the existing equipment, the manufacturing efficiency is good. The invention of claim 39, wherein the adhesive tape according to any one of items 35 to 37 is disposed on a circuit board, and the adhesive tape is applied along the width direction. Apply φ heat pressurization to press the adhesive strip to one side of the circuit board. The pressing method may also be carried out by disposing the adhesive tape on the circuit board, heating and pressing the adhesive tape along the width direction, pressing the adhesive strip to one side of the circuit substrate, and secondly. Change the position of the circuit board, and apply heat and pressure to the other side of the circuit board along the width direction of the adhesive tape to press the next adhesive strip to the circuit board. ------------------------------------- When this invention is recorded in item 39, in addition to In addition to the effects described in any of items 35 to 37, the adhesive tape can be placed on the adhesive tape, and one side of the circuit board can be placed on the width of the adhesive tape. In the direction, the adhesive is pressed to one side of the circuit board, and then the circuit substrate is rotated by about 90 degrees so that the other side of the circuit board is in a position parallel to the width direction of the adhesive tape, and the adhesive is pressed to The other side of the circuit board. In this way, the circuit substrate can be rotated by 90 degrees and the adhesive is pressed back, and the adhesive can be pressed around the circuit substrate in a simple manner, thereby improving the work efficiency of the manufacturing unit of the electronic component. Φ The feature of the invention of the 40th aspect is characterized in that at least one of the adhesive tapes according to any one of the items of the fifth to third aspects is disposed on the transport path of the mobile circuit board, and the adhesive tape is disposed on one of the adhesive tapes. The width direction is perpendicular to the conveying path, and the other adhesive tape is disposed in the width direction along the conveying path, and one of the adhesive tapes is applied to the opposite sides of the circuit board along the width direction. Pressurizing and pressing the adhesive strip to the opposite sides of the circuit board, and secondly, moving the circuit board toward the other adhesive tape, and applying adhesive to the width direction of the remaining two sides of the circuit board from the # substrate side The tape is heated and pressurized to press the adhesive strip around the circuit substrate. In the invention described in the 40th aspect, in addition to the effects described in the items 35 to 37, it is not necessary to rotate the circuit board and move it to the position of one of the adhesive tapes and the other adhesive tape at each position. The heat and pressure are applied in the width direction, and the adhesive can be easily pressed around the circuit substrate, which has good work efficiency. According to the invention of claim 41, the adhesive is applied to one side of the substrate, and the pressure-sensitive adhesive tape of the adhesive-33-(29) 1321868 is applied to the circuit board by the adhesive tape which is wound into a disk shape. The method is characterized in that the width of the adhesive tape is greater than or equal to the length of one side of the circuit substrate. The heating and pressing of a part of the adhesive in the width direction of the adhesive tape is performed from the width direction to reduce the cohesive force of the adhesive in the heating portion. 'Press the adhesive onto the circuit board. In the invention of the 41st aspect, when the adhesive is pressed around the circuit board, the adhesive tape is attached to the adhesive device, and the adhesive tape is heated and pressurized in the width direction to lower the portion. The cohesive force (hereinafter referred to as "cohesion reduction line"), the adhesive portion of the heated portion is separated from the substrate along the cohesive force reduction line and pressed onto the circuit substrate. Next, the circuit substrate is rotated by about 90 degrees so that the adjacent side is located at the position of the width direction of the adhesive tape, and the heating and pressing of the next adhesive strip is performed along the width direction to press the adhesive of the adhesive strip. To the adjacent side. In this way, the adhesive can be sequentially pressed to the four sides of the circuit substrate, and the work efficiency is good, because only the adhesive is completely applied to the adhesive tape.

故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和第3 5項記載之發明相同，因爲未增加捲數卻 可增加黏著劑量，故可防止捲取散亂，同時’得到可防止 -—首黏—著—劑—之滲ffi而造成_之—阻塞—「及—防企—因言材—之伸展_而造 成之弊病等之效果。 第42項記載之發明的特徵，係具有一方之盤、另一 -34- (30) 1321868 方之盤、以及用以收容以可自由旋轉方式裝設之這些盤的 殻體，一方之盤上捲繞著在基材上塗布著黏著劑之黏著劑 膠帶，另一方之盤則固定著黏著劑膠帶之一端，黏著劑膠 帶上沿著膠帶之縱向至少配置著2條黏著劑。 此第42項記載之發明時，將黏著劑膠帶盒裝著至黏 著裝置，以和電路基板之一邊重疊之方式，對配置於黏著 劑膠帶之寬度方向上之至少2條沿著縱向形成之黏著劑的 φ 1條，從基材側實施加熱加壓，使1條之黏著劑壓著至電 路基板。如此，可依序將黏著劑壓著至電路基板，從一方 之盤依序捲出黏著劑膠帶，同時，將殘餘之1條塗布著黏 著劑之黏著劑膠帶捲取至另一方之盤。其次，捲繞於一方 之盤的黏著劑膠帶全部捲出時，將盒反轉並再度裝著至壓 著裝置。 利用此方式，因爲一方之盤及另一方之盤會互換，而 變成從另一方之盤捲出黏著劑膠帶，可再實施1條黏著劑 #之壓著。 在黏著劑膠帶上形成2條以上之黏著劑時，亦可改變 寬度方向之位置，並以依序或以具有間隔之方式實施壓著 〇 如上所示，本發明時，黏著劑板上至少在寬度方向上 並排著2條黏著劑，並可逐條使用，至1盤至少可使用2 盤份，而可在無需增加黏著劑膠帶之捲數的情形，使1盤 可使用之黏著劑量增加成2倍以上。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 -35- (31) 1321868 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外’亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 .斷）。 另一方面，形成2條黏著劑時，電子構件之製造工廠 在用完1盤份（1條黏著劑）時只需反轉盒即可，故下一 裝著更爲容易。 ^ 又，因黏著劑膠帶係採盒方式’故在黏著裝置上將黏 φ 著劑膠帶裝設於盤上時沒有繁複之步驟，只要將盒裝著至 黏著裝置即可，故處理上十分容易，而且具有良好之裝設 及更換作業性。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者’或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 第43項記載之發明，係如第42項記載之發明，其特 φ 徵爲，複數條黏著劑之相鄰之黏著劑條具有間隔。 Φ 此第43項記載之發明時’除了具有和第42項記載之 發明相同之作用效果以外，相鄰之黏著劑條會分離，很容 即可從基材逐條拉離黏著劑並實施壓著。 第44項記載之發明，係如第42項記載之發明’其特 徵爲，黏著劑係利用膠帶之寬度方向上形成之縫隙來分離 成複數條。— 此第44項記載之發明時，除了具有和第42項相同的 作用效果以外，同時，黏著劑膠帶係採用將黏著劑塗布於 -36- (32) 1321868 基材之單面全面並使其乾燥者，在將黏著劑壓著至電路基 板之前一瞬間，亦即，在使用黏著劑膠帶之前一瞬間，利 用以切刃等使黏著劑具有切痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 第45項記載之發明的特徵，係將：具有一方之盤、 φ 另一方之盤、以及用以收容以可自由旋轉方式裝設之這些 盤的殻體；及一方之盤上捲繞著在基材上塗布著黏著劑之 黏著劑膠帶，而另一方之盤固定著黏著劑膠帶之一端；之 黏著劑膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒將黏著 劑膠帶拉出至電路基板上，對黏著劑膠帶之寬度方向之一 部份進行加熱加壓，降低加熱部份之黏著劑的凝聚力，將 寬度方向之部份黏著劑壓著至電路基板。 此第45項記載之發明時，利用對黏著劑膠帶之寬度 # 方向的一部份實施加熱加壓，降低該部份之黏著劑之凝聚 力（以下簡稱爲「凝聚力降低線」），可從凝聚力降低線 使加熱部份之黏著劑從基材分離並壓著至電路基板。 本發明時，因爲黏著劑膠帶只需在基材之全面塗布黏 著劑即可，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 第46項記載之發明，係一種利用黏著劑膠帶盒之黏 -37- 1321868 Ρ3)Therefore, it is possible to directly manufacture the adhesive tape using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. Further, in the same manner as the invention described in the 35th item, since the amount of the adhesive is not increased, the amount of the adhesive can be increased, so that the winding can be prevented from being scattered, and at the same time, the anti-ffi can be prevented from being formed. _ —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— A square disk and a casing for accommodating the disks rotatably mounted, one of which is wound with an adhesive tape coated with an adhesive on the substrate, and the other of which is fixedly adhered At one end of the adhesive tape, at least two adhesives are disposed along the longitudinal direction of the adhesive tape on the adhesive tape. In the invention of the 42nd item, the adhesive tape cassette is attached to the adhesive device to overlap one side of the circuit substrate. In the embodiment, at least two strips of φ disposed along the longitudinal direction of the adhesive tape are heated and pressurized from the substrate side, and one adhesive is pressed against the circuit board. , the adhesive can be pressed to the circuit base in sequence The adhesive tape is sequentially rolled out from one side of the tray, and the remaining adhesive tape coated with the adhesive is taken up to the other side of the tray. Secondly, the adhesive tape wound on one of the trays is completely rolled. When it is out, the cartridge is reversed and reloaded to the pressing device. In this way, since one disc and the other disc are interchanged, the adhesive tape is rolled out from the other disc, and one more can be implemented. Adhesive agent #. When two or more adhesives are formed on the adhesive tape, the position in the width direction may be changed, and the pressing may be performed in a sequential or spaced manner as shown above. , at least two adhesives are arranged side by side in the width direction on the adhesive sheet, and can be used one by one, and at least two trays can be used in one tray, and one tray can be used without increasing the number of adhesive tapes. The amount of adhesive that can be used is increased by more than 2 times. Moreover, since the number of the adhesive tape is not increased, the winding-35-(31) 1321868 can be prevented from being scattered, and at the same time, the adhesive can be prevented from being in the width direction of the tape. Exudation Blockage caused by adhesion between the belts, in addition, it can also prevent the disadvantages such as stretching which is easy to occur due to the long substrate (damage or cutting of the substrate). On the other hand, when two adhesives are formed, the electronic components The manufacturing plant only needs to reverse the box when one disk (one adhesive) is used, so it is easier to install the next one. ^ Also, because the adhesive tape is in the box mode, it is on the adhesive device. There is no complicated step when the adhesive tape is mounted on the disc, as long as the cartridge is attached to the adhesive device, the treatment is very easy, and the installation and replacement workability is good. The adhesive can be The electrically conductive adhesive in which the conductive particles are dispersed in the insulating adhesive may be those in which only the insulating adhesive is used or the insulating spacer particles are dispersed in the adhesive. According to the invention of claim 42, the special φ sign is that the adjacent adhesive strips of the plurality of adhesives have a space. Φ In the invention described in the 43rd item, in addition to the same effects as those of the invention described in the 42nd item, the adjacent adhesive strips are separated, and the adhesive can be pulled away from the substrate one by one and pressure is applied. With. The invention according to the invention of claim 42 is characterized in that the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. - In the invention described in the 44th item, in addition to the same effect as the item 42, the adhesive tape is applied to the single side of the -36-(32) 1321868 substrate by an adhesive. In the case of a drier, a gap is formed immediately before the adhesive is pressed to the circuit board, that is, immediately before the adhesive tape is used, by using a cutting edge or the like to make the adhesive have a cut. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. The invention of claim 45 is characterized in that: one disk, one disk of φ, and a casing for accommodating the disks rotatably mounted; and one of the disks is wound around The adhesive tape on the substrate is coated with an adhesive, and the other end of the disk is fixed with one end of the adhesive tape; the adhesive tape cartridge is attached to the pressing device, and the adhesive tape is pulled out from the adhesive tape cartridge to On the circuit board, a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive in the heating portion, and a part of the adhesive in the width direction is pressed against the circuit board. In the invention described in the 45th aspect, the part of the width of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive (hereinafter referred to as "cohesion reduction line"), and the cohesive force can be obtained. The lowering line separates the heated portion of the adhesive from the substrate and is pressed against the circuit substrate. In the present invention, since the adhesive tape only needs to be completely coated with the adhesive on the substrate, the adhesive tape can be directly produced by using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. The invention described in item 46 is an adhesive using an adhesive tape cassette -37- 1321868 Ρ3)

著劑壓著方法，其特徵爲，將：具有一方之盤、另一方之 盤、以及用以收容以可自由旋轉方式裝設之這些盤的殼體 ;及一方之盤上捲繞著在基材上塗布著黏著劑之黏著劑膠 帶，而另一方之盤則固定著黏著劑膠帶之一端；之黏著劑 膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒將黏著劑膠帶 拉出至電路基板上，對黏著劑膠帶之寬度方向的一部份實 施加熱加壓，降低加熱部份之黏著劑的凝聚力，將寬度方 向之部份黏著劑壓著至電路基板，捲取至一方之盤上之黏 著劑膠帶全部捲出後，將黏著劑膠帶盒反轉，再將殘餘之 部份黏著劑壓著至電路基板。 此第46項記載之發明時，除了具有和第45項相同的 作用效果以外，同時，捲取至一方之盤上之黏著劑膠帶全 部捲出時，將盒反轉並再度裝著至壓著裝置，而將殘餘部 份之黏著劑壓著至電路基板，故和第1項記載之發明相同 ，在未增加捲數之情形下可增加黏著劑量，故可防止捲取 散亂，同時，得到可防止因黏著劑之滲出而造成之阻塞、 及防止因基材之伸展而造成之弊病等之效果。此外，電子 構件之製造工廠在1盤份（1條份之黏著劑）全部捲出時 ，只要反轉盒即可，下一裝著會更爲容易。因爲採用盒之 方式，處理上更爲容易，且具有良好之裝設及更換作業性An agent pressing method, characterized in that: one disk, the other disk, and a casing for accommodating the disks rotatably mounted; and one of the disks is wound around the base The adhesive tape of the adhesive is applied to the material, and the other end of the disk is fixed with one end of the adhesive tape; the adhesive tape cartridge is attached to the pressing device, and the adhesive tape is pulled out from the adhesive tape cartridge to the adhesive tape On the circuit substrate, a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive in the heating portion, and a part of the adhesive in the width direction is pressed to the circuit substrate, and is taken up to one side of the disk. After the adhesive tape is completely rolled out, the adhesive tape cassette is reversed, and the remaining adhesive is pressed onto the circuit substrate. In the invention described in the 46th aspect, in addition to the same effect as the item 45, and at the same time, when the adhesive tape wound onto one of the trays is completely unwound, the cartridge is reversed and reattached to the pressure. In the device, the remaining portion of the adhesive is pressed against the circuit board. Therefore, as in the invention described in the first aspect, the amount of the adhesive can be increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, It can prevent the clogging caused by the oozing of the adhesive, and the effect of preventing the disadvantage caused by the stretching of the substrate. Further, when the manufacturing unit of the electronic component is completely unrolled in one serving (one adhesive), it is easier to reverse the cartridge as long as it is reversed. Because of the way of using the box, it is easier to handle, and has good installation and replacement workability.

第4 7-項記載之發-明’__保塗布_於基材上之-捲成盤1狀_之 黏著劑膠帶，其特徵爲，基材具有熱熔融劑層及支持層。 此第47項記載之發明時，若使用黏著材膠帶，將捲 -38- [S] (34) 1321868 取黏著材膠帶之盤及空盤裝著至黏著裝置，對電路基板實 施黏著材之加熱加壓後，會將基材捲取至空盤。其次，使 已全部捲出之捲取至一方之盤上之一方之黏著材膠帶之終 端部、及新捲取至另一方之盤上之另一方之黏著材膠帶之 始端部互相重疊或抵接，對此部份進行加熱，使熱熔融劑 層熔融後，利用冷卻來使熱熔融劑固化，用以連接黏著材 膠帶。 φ 利用黏著材膠帶之基材黏著全部捲出之黏著材膠帶之 終端部及新裝著之黏著材膠帶之始端部，來實施黏著材盤 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。又 ，因爲無需每次更換新黏著材盤時都更換捲取盤、將新黏 著材之始端裝設至捲取盤、及捲附至導引銷之作業’只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 φ 裝置的加熱加壓頭，則可合理利用黏著裝置。 第48項記載之發明，係如第1項記載之發明’其特 徵爲，支持層夾於熱熔融劑層之間。 此第48項記載之發明時，除了具有和第1項記載之 發明相同之作用效果以外’因爲熱熔融劑層位於基材之表 面，可將始端部之黏著劑面重疊於一方之黏著材膠帶之終 端部之熱熔融劑層’對此部份進行加熱壓著來連接兩者’ 故連接十分簡單。又，因爲熱熔融劑層形成於膠帶之縱向 全體，重疊長度無需嚴格定位’故連接具有高自由度。 -39- (35) 1321868 第49項記載之發明，係如第1項記載之發明’其特 徵爲，熱熔融劑層夾於支持層之間° 此第49項記載之發明時’除了具有和第47項記載之 _發明相同之作用效果以外，黏著材膠帶之連接上’係在一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 互相抵接之位置上，利用黏著裝置之加熱加壓頭進行加熱 。加熱時熱熔融劑會熔解滲出，利用冷卻來使熱熔融劑固 ^ 化，實施黏著材膠帶間之連接。此時’因爲熱熔融劑層係 φ 夾於支持層之間，故可防止熔融劑層曝露於大氣之下而因 爲濕氣之吸濕或灰塵等之附著而降低熱熔融劑層之黏著強 度。 第50項記載之發明，係用以連接捲取至一方之盤之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 著材膠帶的黏著材膠帶連接方法，其特徵爲，黏著材膠帶 具有以脫模劑實施表面處理之基材及黏著劑，除去其中任 φ 何一方之黏著材膠帶之基材端部之脫模劑，使另一方之黏 · 著材膠帶之黏著劑面重疊於該部份，以實施兩者之重疊部 份的加熱壓著來進行連搓。 此第50項記載之發明時，在其中任何一方之黏著材 膠帶之基材面上重疊另一方之黏著材膠帶之黏著劑面，實 施重疊部份之加熱壓著，利用連接全部捲出之黏著材膠帶 之終端部及新装著之黏著材膠帶之始端部來實施黏著材-盤 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。 因爲無需每次更換新黏著材盤時都更換捲取盤、將新 -40- (36) 1321868 黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路徑 設定導引銷等之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 又，在黏著材膠帶捲繞於盤上之狀態下，爲了避免黏 著劑面及基材面發生黏著，基材之表面上會塗布脫模劑。 本發明時，會除去一方之黏著材膠帶之脫模劑，並將另一 方之黏著材膠帶之黏著劑面重疊於該部份並進行黏著，故 φ 黏著材膠帶間之連接十分簡單。 連接部份之加熱壓著上，若採用裝著著黏著材盤之黏 著裝置的加熱加壓頭，則可合理利用黏著裝置。 第51項記載之發明，係如第5 0項記載之發明，其特 徵爲，脫模劑之除去係利用電漿放電、紫外線照射、雷射 照射之其中任何一種方式來實施。 此第5 1項記載之發明時，除了具有和第5 0項記載之 發明相同之作用效果以外，因係利用電漿放電、紫外線照 φ 射、雷射照射之其中任何一種方法來除去脫模劑，和以手 剝離時相比，可以更短之時間、更正確地除去脫模劑。 脫模劑之除去方法上，採用電漿放電時’係使處於電 漿狀態之氣體分解而成爲容易產生之狀態（激發狀態）， 並以對基材之表面實施放電來除去脫模劑。又’紫外線照 射時，例如，採用水銀燈當做光源’利用照射一定時間之 來自水銀燈之紫外線來實施。又’雷射照射時，係以利用 雷射振盪器照射之雷射光來對脫模劑進行加熱並使其熔解 ，用以除去脫模劑。 -41 - (37) 1321868 第52項記載之發明，係將基材上塗布著電極連接用 黏著劑之黏著材膠帶捲取至盤之黏著材膠帶盤，其特徵爲 ，黏著材膠帶盤之膠帶之寬度方向上配設著複數之黏著材 .膠帶之捲部。 此第52項記載之發明時，因配設著複數之黏著材膠 帶捲部（捲部），複數捲部當中之捲繞於一方之捲部的黏 著材膠帶全部捲出時，會捲取配置於全部捲出之捲部之隔 $ 壁的另一方之捲部的黏著材膠帶並將其裝設至盤。 φ 如此，一方之黏著材膠帶全部捲出時，會將另一方之 黏著材膠帶裝設至盤，而實施黏著材膠帶之更換，故無需 將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少之新 黏著材膠帶盤之更換作業，故可提高電子機器之生產效率 〇 因爲係依序使用捲繞於複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 φ 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 # 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 第53項記載之發明，係如第52項記載之發明，其特 徵爲，—方之黏著材髎帶之蔚端部及另二方之黏著材膠帶 一 之始端部之間具有用以連接兩者之連結膠帶，一方之黏著 材膠帶全部捲出時，會接著開始捲出另一方之黏著材膠帶 i S ] -42- (38) 1321868 此第53項記載之發明時，除了具有和第52項記載之 發明相同之作用效果以外，一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部係利用連結膠帶實施連接， 一方之捲部之黏著材膠帶全部捲出後，無需將另一方之捲 部之黏著材膠帶捲取至盤之裝設作業，故可進一步提高電 子機器之生產效率。 φ 第54項記載之發明，係具有如第53項記載之黏著材 膠帶盤、黏著材膠帶之捲取盤、配設於黏著材膠帶盤及捲 取盤之間且以加熱加壓頭將黏著材膠帶之黏著材壓著至電 子機器之電路基板上之壓著部、以及用以檢測連結膠帶之 膠帶檢測手段之黏著裝置，其特徵爲，膠帶檢測手段檢測 到連結膠帶時，至連結膠帶通過壓著部爲止會將連結膠帶 捲取至捲取盤。 此第54項記載之發明時，因爲連結膠帶會自動捲取 # 至捲取盤，一方之捲部之黏著材膠帶全部捲出後，會依序 從下一捲部捲出黏著材膠帶。 又’膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又’膠帶檢測手段上，例如黏著裝置具有一對發光部 及受光部，以光學方式檢測連結膠帶。另一方面，連結膠 帶之兩端配設著有顏色之（例如黑色）標記，受光部會利 用發光部發出之雷射光檢測連結膠帶兩端之標記來檢測連 -43- (39) 1321868 結膠帶。又，除了在連結膠帶附加標記以外’可採用使連 結膠帶之寬度和黏著材膠帶之寬度不同的方法、或在連結 膠帶上形成複數之孔的方法。 第59項記載之發明’係具有一方之盤、另一方之盤 、使一方之盤及另一方之盤連動旋轉之齒輪單元、收容前 述諸元件之殼體、配置於殼體之開口部之加熱構件、以及 對加熱構件供應電力之電源手段之黏著具，其特徵爲，一 |方之盤上捲繞著在基材上塗布著黏著劑之黏著劑膠帶，另 φ 一方之盤則固定著黏著劑膠帶之一端，加熱構件具有利用 供應之電力實施發熱之電熱構件，將捲取至一方之盤上之 黏著劑膠帶拉至殼體之開口部，以加熱構件從基材側對位 於開口部之黏著劑膠帶實施加熱加壓，將黏著劑壓著至電 路基板，以另一方之盤捲取黏著劑被剝離之基材。 此第5 9項記載之發明，在將黏著劑壓著至電路基板 時，係以單手握持殻體，將露出黏著劑膠帶之開口部壓抵 φ電路基板，配設於開口部之黏著劑膠帶基材側之加熱構件 β 會抵接位於開口部之黏著劑膠帶，而將黏著劑壓著至電路 基板。其次，在抵接位於加熱構件下之黏著劑膠帶的情形 下使黏著具前進，會從一方之盤拉出黏著劑膠帶，而在從 盤拉出黏著劑膠帶時，盤會旋轉，故固定於一方之盤之同 軸上的齒輪會旋轉，而和其齒合之另一方之盤之齒輪亦會 旋轉，以另一方之盤捲取黏著劑已被剝離之基材。…… —— — 對加熱構件之電力供應上，可以利用配設於殼體之開 關來切換電力之供應，或者，亦可在加熱構件上配設感壓 -44 - (40) 1321868 開關，加熱構件被推壓時，可感測到該推壓而對加熱構件 供應電力。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著，亦可以爲只有絕緣性黏著劑者，或者，爲 將絕緣性隔件粒子分散於黏著劑中者。 第60項記載之發明，係塗布於基材上之黏著材膠帶 ，其特徵爲，基材係金屬膜或芳香族聚醯胺膜所構成。 φ 此第60項記載之發明時，因爲黏著材膠帶之基材係 採用金屬膜（或金屬箔）或芳香族聚醯胺膜，即使基材之 厚度較薄時，亦可防止基材伸展或切斷等問題。 因此，利用由厚度較薄之基材所構成之黏著材膠帶， 可以增加每1盤之捲數，而增加1盤可使用之黏著劑量。 又，使用本發明之黏著材膠帶，每1盤之捲數會增多，電 子構件之製造工廠只需較少新黏著材膠帶之更換次數即可 ，故可提高作業效率。此外，黏著材膠帶之製造上，因可 # 以減少製造之盤數，且可減少盤材及濕氣防止材之使用量 ，故可降低製造成本。 金屬膜應採用伸展性較高之金屬，例如，銅、鋁、不 銹鋼、鐵、錫等。 芳香族聚醯胺膜之具體實例如對位芳香族聚醯胺纖維 膜（MICTRON ; TORAY株式會社製商品名稱）等。 黏著劑係採用熱可塑性樹脂、熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，熱硬化性樹脂系則以 -45- (41) 1321868 環氧樹脂系、壓克力樹脂系、以及矽樹脂系爲代表》The adhesive tape of the invention described in the above-mentioned item, which is characterized in that the substrate has a hot melt layer and a support layer. In the invention described in the 47th item, if an adhesive tape is used, the disk-38-[S] (34) 1321868 is placed on the disk and the empty disk of the adhesive tape to the adhesive device, and the adhesive is heated on the circuit substrate. After pressurization, the substrate is taken up to an empty tray. Next, the end portion of the adhesive tape which has been wound up to one of the discs on one side and the beginning end of the adhesive tape which is newly wound onto the other side of the disc are overlapped or abutted. The part is heated to melt the hot melt layer, and then the hot melt is solidified by cooling to connect the adhesive tape. φ The adhesive material is replaced by the end of the adhesive tape and the beginning of the newly attached adhesive tape, which is used to adhere the new adhesive material. To the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive material is attached to the take-up reel, and the work is attached to the guide pin, it takes only a small time to replace the new one. Adhesive trays can increase the productivity of electronic machines. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive φ device attached to the adhesive sheet is used, the adhesive device can be reasonably utilized. The invention according to the invention of claim 1 is characterized in that the support layer is sandwiched between the hot melt layers. In the invention described in the 48th aspect, in addition to the same effects as those of the invention described in the first aspect, "because the hot melt layer is located on the surface of the substrate, the adhesive surface of the beginning portion can be superposed on one of the adhesive tapes. The hot melt layer at the end portion is heated and pressed to connect the two parts, so the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. The invention according to claim 1 is characterized in that the hot melt layer is sandwiched between the support layers, and the invention described in the 49th item In addition to the same effect of the invention described in the 47th item, the attachment of the adhesive tape is performed at a position where the end portion of one of the adhesive tapes and the other end of the adhesive tape abut each other, and the adhesive device is used. The heated press head is heated. The hot melt is melted and bleed during heating, and the hot melt is solidified by cooling to effect the connection between the adhesive tapes. At this time, since the hot melt layer φ is sandwiched between the support layers, it is possible to prevent the molten material layer from being exposed to the atmosphere and to lower the adhesion strength of the hot melt layer due to adhesion of moisture moisture or dust. The invention according to claim 50 is an adhesive tape connecting method for connecting an adhesive tape which is wound up to one of the trays of one of the sheets, and an adhesive tape which is wound up to the other of the trays, and is characterized in that The adhesive tape has a substrate and an adhesive which are surface-treated with a release agent, and removes the release agent at the end of the substrate of the adhesive tape of the other side, so that the adhesive tape of the other side is adhered. The agent surface is superposed on the portion, and the heating and pressing of the overlapping portions of the two are performed to carry out the flail. In the invention according to the 50th aspect, the adhesive surface of the other adhesive tape is superposed on the surface of the adhesive tape of either one of the adhesive tapes, and the overlapping portions are heated and pressed, and the adhesives are all rolled out by the joints. The end of the tape and the beginning of the newly attached adhesive tape are used to replace the adhesive-disk, so it is very simple to load the new adhesive to the adhesive device. Because it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the new-40- (36) 1321868 adhesive tape is installed at the beginning of the adhesive tape, and the guide pin is set in a specific path. It takes less time to replace the new adhesive sheet, which can improve the production efficiency of the electronic machine. Further, in a state in which the adhesive tape is wound around the disk, a release agent is applied to the surface of the substrate in order to prevent adhesion between the adhesive surface and the substrate surface. In the present invention, the release agent of one of the adhesive tapes is removed, and the adhesive surface of the other adhesive tape is superposed on the portions and adhered, so that the connection between the adhesive tapes is very simple. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be reasonably utilized. The invention according to claim 50 is the invention according to item 50, wherein the removal of the release agent is carried out by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. In the invention described in the above item 51, in addition to the same effects as those of the invention described in the item 50, the mold release is removed by any one of plasma discharge, ultraviolet ray irradiation, and laser irradiation. The release agent can be removed more accurately in a shorter period of time than when the hand is peeled off. In the method of removing the releasing agent, when the plasma is discharged, the gas in the plasma state is decomposed to be easily generated (excited state), and the surface of the substrate is discharged to remove the releasing agent. Further, in the case of "ultraviolet irradiation, for example, a mercury lamp is used as a light source" by ultraviolet rays from a mercury lamp which is irradiated for a certain period of time. Further, in the case of laser irradiation, the release agent is heated and melted by laser light irradiated with a laser oscillator to remove the release agent. -41 - (37) 1321868 The invention according to Item 52 is an adhesive tape for winding an adhesive tape coated with an electrode-bonding adhesive onto a substrate, which is characterized in that the adhesive tape is taped. In the width direction, a plurality of adhesive materials and a roll portion of the tape are disposed. In the invention described in the 52nd aspect, when a plurality of adhesive tape rolls (rolls) are disposed, and the adhesive tape wound around one of the plurality of rolls is completely unwound, the winding is disposed. The adhesive tape of the other side of the wall of the rolled-out roll is attached to the roll. φ As such, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the tray, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. Therefore, it is only necessary to replace the replacement of the new adhesive tape, so that the production efficiency of the electronic machine can be improved, because the adhesive tape wound around the plurality of rolls is sequentially used, and it is not necessary to add one adhesive tape. The number of rolls of adhesive tape can be greatly increased by φ plus the amount of adhesive that can be used for replacement operations. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the coiling from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape and causing adhesion between the wound adhesive tapes, that is, It prevents clogging, and it also prevents the disadvantages such as stretching which is prone to occur due to the long substrate. The invention of claim 52, wherein the invention is characterized in that the end portion of the adhesive tape and the other end of the adhesive tape are connected to each other. When the adhesive tape of one of the adhesive tapes is completely unwound, the adhesive tape of the other side will be rolled out. i S ] -42- (38) 1321868 When the invention described in the 53rd item is in addition to the 52nd In addition to the effects of the invention described in the above, the end portion of one of the adhesive tapes and the other end of the adhesive tape are connected by a connecting tape, and the adhesive tape of one of the rolls is not required to be rolled out. The adhesive tape of the other side of the coil is taken up to the installation of the tray, so that the production efficiency of the electronic machine can be further improved. The invention according to claim 54 is the adhesive tape tray of the above-mentioned item 53, the winding disk of the adhesive tape, the tape of the adhesive tape, and the winding disk, and is adhered by the heating and pressing head. The adhesive portion of the material tape is pressed against the pressing portion on the circuit board of the electronic device, and the adhesive device for detecting the tape detecting means for connecting the tape, wherein when the tape detecting means detects the connecting tape, the connecting tape passes The connecting tape is taken up to the take-up reel until the crimping portion. In the invention described in the 54th item, since the connecting tape automatically takes up the # to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive tape is sequentially taken out from the next roll. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. Further, in the tape detecting means, for example, the adhesive device has a pair of light-emitting portions and a light-receiving portion, and optically detects the connecting tape. On the other hand, the two ends of the connecting tape are provided with a color (for example, black) mark, and the light receiving portion detects the connecting tape on both ends of the connecting tape by using the laser light emitted from the light emitting portion to detect the bonding tape -43- (39) 1321868 . Further, a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the connecting tape may be employed in addition to the additional tape attached to the connecting tape. The invention according to claim 59 is a gear unit having one disk, the other disk, a disk in which one disk and the other disk are rotated, a casing in which the components are housed, and a heating disposed in an opening of the casing. An adhesive for a member and a power source for supplying power to the heating member, characterized in that an adhesive tape coated with an adhesive on the substrate is wound around the disk, and the disk of the other side is fixedly adhered. One end of the adhesive tape, the heating member has an electric heating member that performs heat generation by using the supplied electric power, and the adhesive tape wound up to one of the disks is pulled to the opening of the casing, and the heating member is located at the opening from the substrate side The adhesive tape is subjected to heat and pressure to press the adhesive onto the circuit substrate, and the other substrate is used to wind up the substrate from which the adhesive is peeled off. According to the invention of the fifth aspect, when the adhesive is pressed against the circuit board, the casing is held by one hand, and the opening of the exposed adhesive tape is pressed against the φ circuit board, and the adhesion is disposed in the opening. The heating member β on the side of the adhesive tape substrate abuts against the adhesive tape located at the opening, and presses the adhesive to the circuit substrate. Secondly, when the adhesive tape is advanced against the adhesive tape under the heating member, the adhesive tape is pulled out from one of the disks, and when the adhesive tape is pulled out from the disk, the disk rotates, so it is fixed at The gear on the coaxial side of one of the discs will rotate, and the gear of the other of the discs that rotates with it will also rotate, and the other disc will take up the substrate from which the adhesive has been peeled off. ...... —— — For the power supply of the heating element, the switch provided by the housing can be used to switch the supply of electric power, or the pressure-44- (40) 1321868 switch can be arranged on the heating member to heat When the member is pushed, the pressing can be sensed to supply electric power to the heating member. The adhesive may be a conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive or a dispersion of the insulating spacer particles in the adhesive. The invention according to claim 60 is an adhesive tape applied to a substrate, which is characterized in that the substrate is a metal film or an aromatic polyamide film. φ In the invention described in the 60th item, since the substrate of the adhesive tape is made of a metal film (or metal foil) or an aromatic polyamide film, even if the thickness of the substrate is thin, the substrate can be prevented from stretching or Cut off and other issues. Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, with the adhesive tape of the present invention, the number of rolls per one disk increases, and the manufacturing unit of the electronic component only needs to replace the number of times of the new adhesive tape, so that work efficiency can be improved. Further, in the manufacture of the adhesive tape, the number of the manufactured disks can be reduced, and the amount of the disk and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The metal film should be made of a highly stretchable metal such as copper, aluminum, stainless steel, iron, tin, or the like. Specific examples of the aromatic polyamide film are, for example, a para-aramid fiber membrane (MICTRON; trade name, manufactured by TORAY Co., Ltd.). The adhesive is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by -45- (41) 1321868 epoxy resin type, acrylic resin type, and enamel resin type.

黏著劑亦可分散著導電粒子。導電粒子係如Au、Ag 、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、或碳、 石墨等，亦可在前述之物及/或非導電性之玻璃、陶瓷、 塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 第6 1項記載之發明，係如第60項記載之發明，其特 〇 徵爲，基材之厚度爲l//m〜25em。 基材之厚度爲l#m〜25ym之理由如下，基材之厚 度低於1 A m時，基材無法得到充分之拉伸強度，而容易 斷裂。又，基材之厚度若超過25em時，每1盤之捲數 方面無法得到可滿足之捲數。 第62項記載之發明，係如第60或6 1項記載之發明 ，--其一特徵_爲一，-_基 _材-之-拉強-度-在5-日-'時爲--3-0··θ-M-P'a-以-士-- 基材之拉伸強度爲3 00MPa以上之理由如下，基材之 拉伸強度小於3 00MPa時，基材容易延展，且黏著材膠帶 (42) 1321868 容易斷裂。 第63項記載之發明’係如第60至62項之其中任一 項記載之發明，其特徵爲，基材對黏著劑之厚度比爲〇.01 〜1 · 0。 基材對黏著劑之厚度比爲〇_01〜ι_〇之理由如下’基 材對黏著劑之厚度比低於o.o1時’基材會太薄，而使黏The adhesive can also disperse the conductive particles. The conductive particles are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may also be in the aforementioned materials and/or non-conductive glass, ceramics, and plastics. The polymer core or the like is covered with the conductive layer or the like to form conductive particles. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The invention according to claim 6 is the invention according to the item 60, characterized in that the thickness of the substrate is from 1/m to 25 em. The reason why the thickness of the substrate is l#m to 25ym is as follows. When the thickness of the substrate is less than 1 Am, the substrate cannot obtain sufficient tensile strength and is easily broken. Further, when the thickness of the substrate exceeds 25 cm, the number of rolls that can be satisfied cannot be obtained in terms of the number of rolls per one disk. The invention according to Item 62 is the invention according to Item 60 or 61, wherein one characteristic_is one, -_base_material-to-stretch-degree-in the 5-day-'- -3-0··θ-M-P'a----- The reason why the tensile strength of the substrate is 300 MPa or more is as follows. When the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched, and Adhesive tape (42) 1321868 is easy to break. The invention according to any one of the items 60 to 62, wherein the thickness ratio of the substrate to the adhesive is 〇.01 〜1·0. The reason why the thickness ratio of the substrate to the adhesive is 〇_01~ι_〇 is as follows: 'The thickness ratio of the substrate to the adhesive is lower than o.o1', the substrate will be too thin, and the adhesion is made

著材膠帶無法具有足充分之強度。又，基材對黏著劑之厚 φ 度比超過1.0時，基材之厚度會過厚，每1盤之捲數會不 夠多β 第64項記載之發明，係如第60至63項之其中任一 項記載之發明，其特徵爲，基材之表面粗細度Rmax爲0.5 "m以下。 基材之表面粗細度Rmax應爲0.5 v m以下之理由如下 ，Rmax若超過〇.5/zm，則因爲基材表面之凹凸，將黏著 劑壓著至電路基板時，黏著劑不易從基材分離。 B 第65項記載之發明，係利用在基材上塗布黏著劑並 捲成盤狀之黏著材膠帶在被覆體上形成黏著劑之黏著材膠 帶黏著材形成方法，其特徵爲，分別從複數盤拉出黏著材 膠帶，使各黏著材膠帶重疊成一體，剝離一方之基材即可 在被覆體上形成重疊成一體之黏著劑。 此第65項記載之發明時，從一方之盤捲出之黏著材 膠帶之黏著劑面、及從另一方之盤捲出之黏著材膠帶之黏 著劑面會重疊而使黏著材膠帶成爲一體。另一方之黏著材 膠帶之基材會會捲取至捲取用盤，而重疊成一體之黏著材The material tape does not have sufficient strength. Further, when the thickness ratio of the substrate to the adhesive exceeds 1.0, the thickness of the substrate is too thick, and the number of windings per one disk is insufficient. The invention described in Item 64 is as in Items 60 to 63. The invention according to any one of the invention is characterized in that the surface roughness Rmax of the substrate is 0.5 "m or less. The reason why the surface roughness Rmax of the substrate should be 0.5 vm or less is as follows. If Rmax exceeds 〇.5/zm, the adhesive is not easily separated from the substrate when the adhesive is pressed onto the circuit substrate due to the unevenness of the surface of the substrate. . The invention of claim 65 is a method for forming an adhesive tape adhesive material for forming an adhesive on an adherend by applying an adhesive to a substrate and winding the adhesive tape into a disk, which is characterized in that the plurality of disks are respectively The adhesive tape is pulled out, and the adhesive tapes are integrally laminated, and one of the substrates can be peeled off to form an adhesive which is integrally formed on the covering. In the invention described in the item 65, the adhesive surface of the adhesive tape which is wound from one of the disks and the adhesive surface of the adhesive tape which is wound from the other disk are overlapped to form the adhesive tape. The other side of the adhesive tape substrate will be taken up to the take-up reel, and the overlapping adhesive material

-47- (43) 1321868 膠帶之黏著劑則會被加壓加熱頭壓著至被覆體。被覆體係 電子構件或電路基板，如引線框架或引線框架之晶片等。 如此，在被覆體上形成黏著劑之前一步驟，可使一方 之黏著材膠帶之黏著劑、及另一方之黏著材膠帶之黏著劑 重疊，在得到期望之黏著劑厚度再在被覆體上形成黏著劑 ，在增多黏著材膠帶之捲數的情形，卻可縮小每1盤之黏 著材膠帶的捲繞直徑。因此，可增加每1盤之黏著材膠帶 ^ 之捲數，而大幅增加1次更換作業之可使用的黏著劑量。 因此，只需較少之新黏著材膠帶之更換作業即可，故可提 高電子機器之生產效率。 第66項記載之發明，係如第1項記載之發明，其特 徵爲，只有一方之黏著材膠帶之黏著劑含有硬化劑。 此第6 6項記載之發明時，除了具有和第6 5項記載之 發明相同之作用效果以外，因爲只有一方之黏著材膠帶之 黏著劑含有硬化劑，故另一方之黏著材膠帶之黏著劑不需 φ 要硬化劑。因此，未含有硬化劑之黏著劑之黏著材膠帶無 需低溫管理。因此，可減少必須實施低溫管理之黏著材膠 帶的數量，而可使黏著材膠帶之運送及保管獲得有效率之 管理。又，未調合硬化劑之黏著材膠帶、及調合著硬化劑 之黏著材膠帶的黏著劑’係以不會和硬化劑產生反應之成 分做爲另一方之黏著劑，除了以不會和硬化劑產生反應之 成分做爲硬化劑以-外τ尙以_使用之-黏著劑做属一方之黏.著 劑，故可提高黏著劑之保存安定性。 第67項記載之發明係向異導電材膠帶’其特徵爲， [S] -48- (44) 1321868 在芯材之縱向上實施具有膜狀黏著劑之向異導電材之多數 次捲繞積層。 又，第68項記載之發明，係如第67項記載之向異導 電材膠帶，其特徵爲，上述向異導電材係在膜狀黏著劑之 單面配設基材膜之2層構造的向異導電材。 又’第69項記載之發明，係如第67項記載之向異導 電材膠帶’其特徵爲’上述向異導電材係在膜狀黏者劑之 φ 兩面配設基材膜之3層構造之向異導電材。 又，第70項記載之發明，係如第68或69項記載之 向異導電材膠帶，其特徵爲，對基材膜之單面或兩面實施 剝離處理。 又，第71項記載之發明’係如第67至70項之其中 任一項記載之向異導電材膠帶’膜狀黏著劑之寬度爲〇.5 〜5 mm 0 又，第72項記載之發明，係如第68至71項之其中 φ 任一項記載之向異導電材膠帶，基材膜之強度爲 12kg/mm2以上、伸展爲60〜200%、厚度爲1〇〇 # m以下 。其次，若基材膜爲有色透明或有色不透明之著色時’很 容即可實施基材膜及黏著劑之判別’又’亦很容易判別捲 出部之位置，故可提高作業性。 【實施方式】 其次，參照附錄圖面，針對本發明之實施形態進行說 明。又，以下之說明中，同一或同等之構成要素會附與相-47- (43) 1321868 The adhesive for the tape is pressed against the covering by the pressurized heating head. Coating system Electronic components or circuit boards, such as lead frames or wafers of lead frames. Thus, in the first step before the adhesive is formed on the covering body, the adhesive of one of the adhesive tapes and the adhesive of the other adhesive tape can be overlapped, and the desired adhesive thickness can be obtained to form an adhesive on the coated body. In the case of increasing the number of rolls of the adhesive tape, the winding diameter of the adhesive tape per one disk can be reduced. Therefore, the number of rolls of the adhesive tape ^ per disk can be increased, and the amount of adhesive that can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the production efficiency of the electronic machine can be improved. The invention according to claim 1, wherein the adhesive of the adhesive tape of only one of the adhesives contains a curing agent. In the invention described in the sixty-sixth aspect, in addition to the effects similar to those of the invention described in the sixth aspect, since the adhesive of only one of the adhesive tapes contains a hardener, the adhesive of the other adhesive tape is provided. No need for φ to hardener. Therefore, the adhesive tape which does not contain the adhesive of the hardener does not require low temperature management. Therefore, the number of adhesive tapes that must be subjected to low temperature management can be reduced, and the transportation and storage of the adhesive tape can be efficiently managed. Moreover, the adhesive tape of the adhesive material which is not blended with the hardener, and the adhesive of the adhesive tape which is blended with the hardener are used as the adhesive of the other which does not react with the hardener, except that the hardener is not used. The component which produces the reaction is used as a hardening agent, and the adhesive which is used as one of the adhesives is used to improve the preservation stability of the adhesive. The invention of the invention of claim 67 is characterized in that the [S] -48- (44) 1321868 is subjected to a plurality of times of winding of a conductive material having a film-like adhesive in the longitudinal direction of the core material. . The invention according to claim 67, wherein the dissimilar conductive material is a two-layer structure in which a base material film is disposed on one surface of a film-like adhesive. Conductive conductive material. In the invention of the present invention, the invention relates to a three-layer structure in which the base material film is disposed on both sides of the φ-shaped surface of the film-shaped adhesive agent. The direction of the conductive material. The invention according to claim 70, wherein the one or both surfaces of the base film are subjected to a peeling treatment. The invention according to the invention of claim 71 is characterized in that the width of the film-like adhesive of the conductive conductive tape as described in any one of items 67 to 70 is 〇5 to 5 mm 0, and the item 72 is described. The invention is the conductive conductive tape according to any one of items 68 to 71, wherein the base film has a strength of 12 kg/mm 2 or more, a stretch of 60 to 200%, and a thickness of 1 〇〇 # m or less. Then, when the base film is colored or opaque, the base film and the adhesive can be easily judged, and the position of the unwinding portion can be easily determined, so that the workability can be improved. [Embodiment] Next, an embodiment of the present invention will be described with reference to an attached drawing. In the following description, the same or equivalent components will be attached to the phase.

-49- (45) 1321868 同符號。 首先，參照第1圖〜第5圖’針對第1〜4項記載之 發明之實施形態進行說明。 _ 第1圖係第1實施形態之黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第2圖A及B係第1圖之連接 部份（A)之連接步驟圖，第2圖A係已使用之黏著材膠 帶之端膠帶的剖面斜視圖，第2圖B係反折已使用之黏著 ^ 材膠帶來連接新黏著材膠帶之斜視圖，第3圖係黏著裝置 φ 之黏著劑壓著步驟的槪略圖，第4圖係電路基板間之黏著 的剖面圖，第5圖係黏著材膠帶之製造方法的步驟圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。亦即，各盤3、3a具有捲軸5、及分別配置於黏著材 膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 φ之黏著劑1 1所構成。 Φ 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 --熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 — 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 -50- i S] (46) 1321868 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 '或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋構成前述導電粒子13之材 料所構成之導電層等來形成導電粒子13。此外，亦可應 用以絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或倂 φ 用導電粒子13及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路之接觸面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，因導電粒子13如 焊錫並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀 態，而可得到很容易即可對應電極之厚度及平坦性之誤差 的連接構件。 ® 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示’將黏著材膠帶1之盤3a、及捲 取盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材 膠帶1的前端經由導引銷22裝設至捲取盤17，並捲出黏 著材膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶 1配置於電路基板21上’以配置於兩盤3a、17間之加熱 加壓頭19從基材9側實施黏著材膠帶1之壓接，將黏著 劑11壓著至電路基板21°其後，將基材9捲取至捲取盤 -51 - (47) 1321868-49- (45) 1321868 The same symbol. First, an embodiment of the invention described in the first to fourth aspects will be described with reference to Figs. 1 to 5 . _ Fig. 1 is a perspective view showing the connection between the adhesive sheets of the adhesive tape connecting method of the first embodiment, and Fig. 2 and Fig. 2 are the connection steps of the connecting portion (A) of Fig. 1, the second Figure A is a cross-sectional perspective view of the end tape of the adhesive tape used. Figure 2B is a perspective view of the adhesive tape used to reattach the new adhesive tape. Figure 3 is the adhesive of the adhesive device φ. FIG. 4 is a cross-sectional view showing adhesion between circuit boards, and FIG. 5 is a step view showing a method of manufacturing an adhesive tape. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on both width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. That is, each of the disks 3, 3a has a reel 5 and side plates 7 which are respectively disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side surface φ of the substrate 9. Φ In terms of strength and releasability of the adhesive to the dissimilar conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate). Ester) or the like, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The heat-plastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is an epoxy resin type, a vinyl ester type resin, or an acrylic-50-i S] (46) 1321868 Resin type and enamel resin are representative. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the foregoing materials and non-conductive glass, ceramics, and plastics. The conductive particles 13 are formed by covering a conductive layer or the like which constitutes the material of the conductive particles 13 with a polymer core or the like. Further, the insulating coating particles of the conductive particles 13 or the conductive particles 13 and the insulating particles may be coated with an insulating layer. When a conductive layer is formed on a polymer core material such as a hot molten metal such as solder or a plastic material, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability can be improved. In particular, it is more preferable to use a polymer as a core material, since the conductive particles 13 such as solder do not have a melting point, and can be controlled to a softened state at a wide connection temperature, and the thickness of the corresponding electrode can be easily obtained. A connecting member that is inaccurate in flatness. ® Next, the method of using the adhesive tape 1 of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound around the disc 3a is attached to the front end via the guide pin 22. The disc 17 is taken up, and the adhesive tape 1 (arrow E in Fig. 3) is taken out. Next, the adhesive tape 1 is placed on the circuit board 21. The pressure-adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17 to press the adhesive 11 to the adhesive 11 After the circuit substrate 21°, the substrate 9 is taken up to the take-up reel -51 - (47) 1321868

上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接如第4圖所不’在壓著至電路基板21上之 黏著劑1 1上配置配線電路（或電子構件）23，必要時， 可將例如聚四氟乙烯材2 4當做緩衝材，以加熱加壓頭1 9 對電路基板2 1實施配線電路2 3之加熱加壓。利用此方式 ，可連接電路基板21之電極21a及配線電路23之電極 23a ° 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記28 (參照第1圖）。After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. Formally connecting, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a cushioning material. Heating and pressurization of the wiring circuit 2 3 is performed on the circuit board 2 1 by the heating and pressing head 19. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP. There will be more connecting parts, and the amount of adhesive 1 used at one time will be much larger than the conventional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 1).

本發明之黏著材膠帶之連接方法可以分成下述2種， (a)直接使用捲取盤17，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤17，（b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤17使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 -( >特，如第-1擺所示’爲了將盤3 a更換成新黏著 材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏著材 膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於新黏 [S] -52- (48) 1321868 著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1之始 端部3 2之連接。 此黏著材膠帶1之連接上，在露出已使用之盤3a之 黏著材膠帶1之結束標記28時，會如第2圖A所示，會 從黏著材膠帶1之結束標記28附近切斷（B)，並將黏著 材膠帶1之終端部30反折，使黏著材膠帶1之黏著劑1 1 面位於上側（第2圖B)。其次，將新黏著材盤3之黏著 φ 材膠帶1之始端部32之黏著劑11面重疊於已使用之盤 3a之黏著材膠帶1之終端部30之黏著劑11面上（第2 圖B ) 〇 其次，如第4圖所示，將兩者之重疊部份置於工作台 104上，以黏著裝置15之加熱加壓頭19實施加熱加壓進 行黏著。利用此方式，即可連接捲繞於已使用之盤3a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1。其 次，將已使用之盤3a及新盤3互相對換，將新盤3裝著 # 至黏著裝置15。因此，無需實施將黏著材膠帶1裝著至 捲取盤1 7之作業。又，因以黏著劑1 1面間之重疊來進行 黏著，故有較高之連接強度》 又’黏著材膠帶1上之結束標記28之位置，當黏著 材膠帶1從已使用之盤（黏著材膠帶1完全捲出之盤）3a 延伸至加熱加壓頭19爲止時，應爲從黏著材膠帶1固定 於已使用之盤3a上之固定位置至加熱加壓頭19爲止之長 度的位置上。此時，從結束標記28之附近切斷，即使從 必要之最小位置切斷黏著材膠帶1，除了可防止黏著材膠 -53- (49) 1321868 帶1之浪費以外’當可避免將拆下已使用之盤3a並移動 已使用之盤3 a使結束標記2 8到達加熱加壓頭1 9之位置 的繁複作業。The bonding method of the adhesive tape of the present invention can be divided into the following two types: (a) directly using the take-up reel 17, replacing the adhesive tape of the adhesive tape 1 which has been used, and connecting the new adhesive. The tape and the take-up reel 17, (b) the adhesive tape which has the remaining number of remaining adhesive tapes 1 used as the take-up reel 17, and the new adhesive tape and the adhesive having less residual number are attached. tape. - ( > special, as shown in the -1 pendulum 'In order to replace the disc 3 a with the new adhesive sheet 3, the adhesive tape 1 of the disc 3a is applied to the adhesive tape 1 of the disc 3a (the adhesive tape of one side) The terminal portion 30 of 1 and the connection of the beginning end portion 3 2 of the adhesive tape (the other adhesive tape) wound on the new adhesive [S] -52- (48) 1321868. When the adhesive tape 1 is attached, when the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it will be cut off from the vicinity of the end mark 28 of the adhesive tape 1 as shown in Fig. 2A (B). And the end portion 30 of the adhesive tape 1 is folded back so that the adhesive 1 1 surface of the adhesive tape 1 is located on the upper side (Fig. 2B). Secondly, the new adhesive material 3 is adhered to the φ material tape 1 The surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the adhesive 11 of the end portion 30 of the adhesive tape 1 of the used disc 3a (Fig. 2B). Next, as shown in Fig. 4, the two are The overlapping portion is placed on the table 104, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized for adhesion. In this way, the connection can be wound and used. The adhesive tape 1 on the disc 3a and the adhesive tape 1 wound on the new disc 3. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is loaded with ## to the adhesive device 15 Therefore, there is no need to carry out the operation of attaching the adhesive tape 1 to the take-up reel 17. Further, since the adhesive is adhered by the overlap between the faces of the adhesive 1, there is a high joint strength and an adhesive tape. At the position of the end mark 28 on the upper end, when the adhesive tape 1 is extended from the used disk (the disk in which the adhesive tape 1 is completely unwound) 3a to the heating and pressing head 19, it should be fixed from the adhesive tape 1 to The fixing position on the disk 3a has been used to the position of the length of the heating pressurizing head 19. At this time, cutting from the vicinity of the end mark 28, even if the adhesive tape 1 is cut from the necessary minimum position, it can be prevented. Adhesive glue-53- (49) 1321868 In addition to the waste of 1 'When it is avoided, the used disc 3a will be removed and the used disc 3 a will be moved to the position where the end mark 28 reaches the position of the heating press head 19 Complex work.

此實施形態時，因黏著裝置1 5具有加熱加壓頭1 9， 並利用此加熱加壓頭19來實施已使用之盤3a之黏著材膠 帶1之終端部30之黏著劑11、及新黏著材盤3之黏著材 膠帶1之始端部32之黏著劑11的連接’故無需另外使用 $ 以實施黏著劑11間之壓著爲目的之壓著用器具，即可實 施已捲繞著黏著材膠帶1之盤3、3a之更換。In this embodiment, since the adhesive device 15 has the heating and pressing head 19, and the heating and pressing head 19 is used to carry out the adhesive 11 of the end portion 30 of the adhesive tape 1 of the used disk 3a, and the new adhesive The connection of the adhesive 11 at the beginning end portion 32 of the adhesive tape 1 of the material tray 3 is performed. Therefore, it is not necessary to separately use the pressing device for the purpose of pressing the adhesive 11 to perform the winding of the adhesive. Replacement of the discs 3, 3a of the tape 1.

直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤17之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記28附近切斷，將殘留於捲取盤17側之黏著材 膠帶之終端部反折，使黏著劑1 1面成爲上側’。其次，使 φ 此黏著材膠帶1之終端部之黏著劑11面、及新黏著材盤 3之黏著材膠帶1之始端部32之黏著劑11面互相重疊。 其次，將兩者之重疊部份置於工作台104上，以黏著裝置 1 5之加熱加壓頭1 9進行加熱加壓實施黏著。利用此方式 ，可連接捲繞於捲取盤17上之黏著材膠帶1、及捲繞於 新盤3上之黏著材膠帶1。利用此方式，因爲捲取盤17 一只會捲取基材9，故可捲取數個黏著材盤倚，減少捲取盤~ 17之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 Γ S] -54- (50) 1321868 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布由樹脂及導電粒子13混合而成之黏著劑u ’並以乾燥爐29實施乾燥後’以捲取機31捲取原始材料 。被捲取之黏著材膠帶1之原始材料，以切割機33切成 特定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲 軸上，或者，捲取至附側板之捲軸上，將其和除濕材—起 φ 綑包’實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對本發明之第2實施形態進行說明，以下之 說明係以和上述實施形態不同之點爲主。 第6圖所示之第2實施形態時，係利用新黏著材盤3 之黏著材膠帶1之始端部32具有之前導膠帶41，實施新 黏著材盤3之黏著材膠帶1、及捲繞於已使用之盤3a上 之黏著材膠帶1之連接。前導膠帶41係由基材63及其背 面之黏著劑43面所構成，新黏著材盤3之黏著材膠帶1 φ 之始端部32，係利用前導膠帶41貼附於捲附至盤上之黏 著材膠帶1之基材9面來固定。其次，從基材9面剝離前 導膠帶41，並使其和反折之黏著材膠帶1之終端部3 0之 黏著劑11面重疊。將兩者之重疊部份置於工作台1〇4上 ，以黏著裝置15之加熱加壓頭19進行加熱加壓實施黏著 。如此，因爲利用黏著材膠帶1之前導膠帶41實施全部 捲出之黏著材膠帶1之終端部30、及新裝著之黏著材膠 帶1之始端部32的黏著，故黏著材膠帶1間之連接十分 簡單。此時，配設於前導膠帶41之基材63之背面側的黏 -55- (51) 1321868 著劑43面具有粘著性，亦可只利用使其重疊於反折之黏 著材膠帶1之終端部30之黏著劑11面的方式來實施連接 〇 . 本發明並未受限於上述之實施形態，只要在未背離本 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，不反折捲繞於已使用 之盤3a上之黏著材膠帶1，而如第7圖所示，從基材9 ^ 面剝離新裝著之黏著材膠帶1之始端部32之前導膠帶41 φ ，並將其貼附於背面之黏著劑1 1面，使前導膠帶4 1連接 於已使用之黏著材膠帶1之終端部30之黏著劑11面，再 以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著亦 可。此時，因無需反折全部捲出之黏著材膠帶1，故可防 止將黏著材膠帶1捲取至捲取盤時可能發生之捲取散亂。 此時，從基材9面剝離黏著材膠帶1之始端部32之 前導膠帶41，並將前導膠帶41黏著於已使用之黏著材膠 φ帶1之基材9面亦可。 φ 其次，針對第5〜8項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對第5〜8項記載之發明之背景技術進行說 ——明… - — ^ _ — 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 -56- ί S3 (52) 1321868 或電路基板間之黏著固定、以及兩者之電極間的電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 φ (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， φ 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， -57- (53) 1321868 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。When the reeling tape 17 of (a) is used as it is, the adhesive tape which has the remaining number of remaining adhesive tapes 1 is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion of the adhesive tape remaining on the take-up reel 17 side is folded back. The adhesive 1 1 surface becomes the upper side'. Next, the surface of the adhesive 11 of the end portion of the adhesive tape 1 and the adhesive 11 of the beginning portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are overlapped with each other. Next, the overlapping portions of the two are placed on the table 104, and the bonding is performed by heating and pressing the heating and pressing heads 1 of the bonding device 15. In this manner, the adhesive tape 1 wound around the take-up reel 17 and the adhesive tape 1 wound around the new disc 3 can be joined. In this way, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, reducing the number of replacements of the take-up reel, and having good work efficiency. Here, a method of manufacturing the adhesive tape 1 Γ S] - 54 - (50) 1321868 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinding machine 25, an adhesive u' obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, by a coiler 31. Take the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. In the above, it is managed and shipped at a low temperature (-5 °C to -1 0 °C) with the dehumidification material - φ bundle. Next, a second embodiment of the present invention will be described. The following description is mainly based on differences from the above embodiment. In the second embodiment shown in Fig. 6, the beginning end portion 32 of the adhesive tape 1 using the new adhesive sheet 3 has the adhesive tape 41, the adhesive tape 1 for the new adhesive sheet 3, and the winding tape 1 The connection of the adhesive tape 1 on the disc 3a that has been used. The leading tape 41 is composed of the substrate 63 and the surface of the adhesive 43 on the back side, and the beginning end portion 32 of the adhesive tape 1 φ of the new adhesive sheet 3 is attached to the adhesive tape attached to the disk by the leading tape 41. The base material 9 of the material tape 1 is fixed. Next, the front tape 41 is peeled off from the surface of the substrate 9 and overlapped with the surface of the adhesive 11 of the end portion 30 of the adhesive tape 1 which is folded back. The overlapping portions of the two are placed on the table 1 to 4, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized to perform adhesion. In this manner, since the adhesive tape 41 is used to carry out the adhesion of the terminal portion 30 of the adhesive tape 1 and the initial end portion 32 of the newly attached adhesive tape 1 by the adhesive tape 41, the connection between the adhesive tapes 1 is performed. Very simple. At this time, the surface of the adhesive sheet 55 disposed on the back side of the base material 63 of the leading tape 41 has adhesiveness, and it is also possible to use only the adhesive tape 1 which is superposed on the reverse folding. The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, in the second embodiment described above, the adhesive tape 1 wound on the used disk 3a is not folded back, and as shown in Fig. 7, the newly attached adhesive tape is peeled off from the substrate 9 The tape 40 φ is guided by the leading end portion 32 of the first tape, and is attached to the surface of the adhesive 11 on the back surface, so that the leading tape 41 is attached to the adhesive 11 of the end portion 30 of the adhesive tape 1 already used, and then Adhesion may be performed by heating and pressurizing the heating and pressing head 19 of the adhesive device 15. At this time, since it is not necessary to refold the adhesive tape 1 which is completely unwound, it is possible to prevent the winding of the adhesive tape 1 from being taken up to the take-up reel. At this time, the leading tape 41 of the beginning end portion 32 of the adhesive tape 1 is peeled off from the surface of the substrate 9, and the leading tape 41 may be adhered to the surface of the substrate 9 of the adhesive tape φ tape 1 which has been used. φ Next, the invention described in the fifth to eighth aspects will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to a method of connecting an adhesive tape wound into a disk shape. Next, the background art of the invention described in the fifth to eighth aspects will be described as follows - - ^ ^ _ - In general, a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a bare wafer Adhesive tape is used for the electronic components such as packages and circuit boards, the adhesion between the circuit boards, and the electrical connection between the electrodes. Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the disk φ of the adhesive tape (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. . Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the φ circuit substrate has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, -57-(53) 1321868, the pressure applied to the tape-like adhesive tape may increase, which may cause the adhesive to ooze out from both sides of the tape and cause blockage. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device.

因此，第5〜8項記載之發明的目的，係在提供一種 黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡單， 而提高電子機器之生產效率。 其次，參照第8圖A〜C、第3圖〜第5圖，針對本 發明之第1實施形態進行說明。第8圖A〜C係第1實施 形態之黏著材膠帶之連接方法圖，第8圖A係黏著材盤 間之連接的斜視圖，第8圖B係第8圖A之連接部份之 連接方法的斜視圖，第8圖C係第8圖A之連接部份之 平面圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 φ配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 · 7。本實施形態時，黏著材膠帶1之長度約爲50m、寬度 W約爲5 m m。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基-材9應由Ο PP (延伸聚丙烯）、聚四氟乙烯、或經過艰 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 -58- (54) 1321868 黏著劑11係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹β曰系係以苯乙烧樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。Therefore, the object of the invention described in the fifth to eighth aspects is to provide a method of connecting an adhesive tape, which makes it easy to replace the adhesive disk and improve the production efficiency of the electronic device. Next, a first embodiment of the present invention will be described with reference to Figs. 8A to 8C and 3rd to 5th. Figs. 8A to 8C are views showing a method of connecting the adhesive tape of the first embodiment, Fig. 8A is a perspective view showing the connection between the adhesive sheets, and Fig. 8B is a connection of the connecting portion of Fig. 8A. An oblique view of the method, and Fig. 8C is a plan view of the connecting portion of Fig. 8A. The adhesive tape 1 is wound around the discs 3, 3a, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 5 m. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The base material 9 should be made of Ο PP (extended polypropylene), polytetrafluoroethylene, or entangled PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. The diester) or the like is constituted, however, it is not limited thereto. -58- (54) 1321868 The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin β-lanthanide system is represented by styrene-acetic resin and polyester resin, and the thermosetting resin is represented by epoxy resin, vinyl ester resin, acrylic resin or enamel resin. .

黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 φ 、或碳、石墨等’亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋構成前述導電粒子13之材 料所構成之導電層等來形成導電粒子13。此外，亦可應 用以絕緣層覆蓋前述導電粒子13之絕緣覆膜粒子、或倂 用導電粒子13及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路之接觸面積，而可提高信賴性 φ 。尤其是，以高分子類做爲核材更佳’因導電粒子13如 焊錫並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀 態，而可得到很容易即可對應電極之厚度及平坦性之誤差 的連接構件。 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲 取盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材 膠帶1之前端經由導引銷22裝設至捲取盤17 ’並捲出黏 著材膠帶1(第3圖中之箭頭E)。其次’將黏著材膠帶 CS) -59- (55) 1321868 1配置於電路基板21上，以配置於兩盤3a、17間之加熱 加壓頭19從基材9側實施黏著材膠帶1之壓接，將黏著 劑11壓著至電路基板21。其後，將基材9捲取至捲取盤 17 ° 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接如第4圖所示，在壓著至電路基板21上之 φ 黏著劑1 1上配置配線電路（或電子構件）2 3，必要時， 可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭19 對電路基板21實施配線電路23之加熱加壓。利用此方式 ，可連接電路基板21之電極21a及配線電路23之電極 2 3 a ° 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑11的使用量會遠大於傳統上之使 φ 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記28 (參照第8圖A )。 本發明之黏著材膠帶之連接方法可以分成下述2種， (a)直接使用捲取盤17，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶7並連接新黏著劑膠帶及捲取 盤17，（b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤17使用，並連接新黏著劑膠帶及 -60- L S] (56) 1321868 殘餘捲數變少的黏著劑膠帶。 (b)時，如第8圖A所示，爲了將盤3a更換成新黏 著材盤3，在盤3a之黏著材膠帶1露出結束標記28時， 會實施盤3a之黏著材膠帶（一方之黏著材膠帶）1之終 端部30、及捲繞於新黏著材盤3上之黏著材膠帶（另一 方之黏著材膠帶）之始端部32之連接（參照第8圖A) 〇 φ 此黏著材膠帶1之連接上，如第8圖B及C所示， 會針對黏著材盤3a之黏著材膠帶1之終端部30、及新黏 著材盤3之黏著材膠帶1之始端部32,使始端部32之黏 著劑11面重疊於終端部30之基材9面上。其次，將略呈 3字形之卡止銷46插入重疊部份，實施黏著材膠帶1之 終端部30、及新黏著材盤3之黏著材膠帶1之始端部32 之連接。 利用此方式，可實施捲繞於已使用之盤3a上之黏著 # 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，可以卡止銷46固定已全部捲出之黏著材膠帶1之終 端部30、及新裝著之黏著材膠帶1之始端部32,故連接 十分簡單。 其次，將已使用之盤3a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 -61 - (57) 1321868 實施新黏著劑膠帶及捲取盤17之連接時’在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記28附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部30、及新黏著材盤3之黏著材膠帶1之始 端部32重疊。其次，將略呈3字形之卡止銷46插入兩者 之重疊部份，實施黏著材膠帶1之終端部30、及新黏著 材盤3之黏著材膠帶1之始端部32之連接。The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles φ such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, The conductive particles 13 are formed by covering a conductive layer or the like which constitutes the material of the conductive particles 13 with a polymer core material such as plastic. Further, the insulating coating particles of the conductive particles 13 or the conductive particles 13 and the insulating particles may be used as an insulating layer. When a conductive layer is formed on a polymer core material such as a hot molten metal such as solder or a plastic material, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability φ can be improved. In particular, it is better to use a polymer as a core material. Because the conductive particles 13 such as solder have no melting point, they can be controlled to a softened state at a wide connection temperature, and the thickness of the electrode can be easily obtained. A connecting member that is inaccurate in flatness. Next, a method of using the adhesive tape 1 of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. Roll up the tray 17' and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, 'adhesive tape CS' -59-(55) 1321868 1 is placed on the circuit board 21, and the pressure of the adhesive tape 1 is applied from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17 Then, the adhesive 11 is pressed against the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17°. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. As shown in FIG. 4, the wiring circuit (or electronic component) 23 is placed on the φ adhesive 1 1 which is pressed onto the circuit board 21, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP. The connection portion will be more, and the amount of the adhesive 11 used at one time will be much larger than the conventional amount of φ. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 8A). The joining method of the adhesive tape of the present invention can be divided into the following two types: (a) directly using the take-up reel 17, replacing the adhesive tape 7 having a small remaining number of the remaining adhesive tape 1 and connecting the new adhesive. The tape and the take-up reel 17, (b) the adhesive tape which has the remaining number of remaining adhesive tapes 1 used as the take-up reel 17, and the new adhesive tape and -60-LS] (56) 1321868 Adhesive tape with less residual volume. (b), as shown in Fig. 8A, in order to replace the disc 3a with the new adhesive sheet 3, when the adhesive tape 1 of the disc 3a is exposed with the end mark 28, the adhesive tape of the disc 3a is implemented (one side) The end portion 30 of the adhesive tape) 1 and the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3 (refer to Fig. 8A) 〇φ This adhesive material The connection of the tape 1 is as shown in Figs. 8B and C, and the starting end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the beginning end 32 of the adhesive tape 1 of the new adhesive sheet 3 are used to make the beginning. The surface of the adhesive 11 of the portion 32 is superposed on the surface of the substrate 9 of the terminal portion 30. Next, the slightly triangular-shaped card stopper 46 is inserted into the overlapping portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined. In this manner, the adhesion of the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be performed. Thus, the locking pin 46 can fix the end portion 30 of the adhesive tape 1 which has been completely unwound, and the beginning end portion 32 of the newly attached adhesive tape 1, so that the connection is very simple. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Directly use the reeling tray 17 of (a), replace the adhesive tape with less residual reeling tape of the used adhesive tape 1 with a new adhesive tape, and implement new adhesive tape and -61 - (57) 1321868 When the winding tray 17 is connected, when the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, so that the adhesive remaining on the side of the winding tray 17 is adhered. The end portion 30 of the tape and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 overlap. Next, a slightly triangular-shaped card stopper 46 is inserted into the overlapping portion of the two, and the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive pad 3 are joined.

_ 因爲捲取盤17只會捲取基材9，故可捲取數個黏著 材盤份。因此，可減少捲取盤17之更換次數，而有良好 之作業效率。 其次，針對第5〜8項記載之發明的第2〜第4實施 形態進行說明，以下說明之實施形態中’相同部份會附與 相同符號並省略該部份之詳細說明，以下之說明係以和上 述第1實施形態不同之點爲主。_ Since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up. Therefore, the number of replacements of the take-up reel 17 can be reduced, and good work efficiency can be achieved. In the following, the second to fourth embodiments of the invention described in the fifth to eighth embodiments will be described. In the following description, the same portions will be denoted by the same reference numerals, and the detailed description will be omitted. It is mainly different from the above-described first embodiment.

第9圖所示之第2實施形態時，係利用具有配設於一 | 方及另一方之端部之爪部48、49、及連結兩端之爪部48 、49之彈性構件50的卡止構件47，實施一方之黏著材膠 帶1之終端部30及另一方之黏著材膠帶1之始端部32之 連接。具體而言，使一方之黏著材膠帶1之終端部30及 另一方之黏著材膠帶1之始端部32互相抵接，使配設於 卡止構件47之一端之爪部48卡止於終端部30，並使配 -設於另-一端之笊部竹卡止於-始端部32 ’並以彈性構件50 拉近一方之爪部48及另一方之爪部49。又，爪部48、47 係在板構件之背面配設前端爲尖形之複數爪51者。In the second embodiment shown in Fig. 9, the claws 48, 49 having the end portions disposed at one side and the other, and the elastic members 50 connecting the claw portions 48, 49 at both ends are used. The stopper member 47 is connected to the end portion 30 of the one adhesive tape 1 and the other end portion 32 of the other adhesive tape 1. Specifically, the end portion 30 of one of the adhesive tapes 1 and the other end portion 32 of the other adhesive tape 1 are brought into contact with each other, and the claw portion 48 disposed at one end of the locking member 47 is locked to the terminal portion. 30. The crotch portion of the crotch portion disposed at the other end is stopped at the start end portion 32' and the one claw portion 48 and the other claw portion 49 are pulled by the elastic member 50. Further, the claw portions 48 and 47 are provided with a plurality of claws 51 having a pointed tip end on the back surface of the plate member.

-62- (58) 1321868 因係使配設於卡止構件47之一端之爪部48卡止於終 端部30，並使配設於另一端之爪部49卡止於始端部32 來連接兩者，故連接十分容易。又，因爲一方之爪部48 及另一方之爪部49之間具有彈性構件5〇 ’彈性構件50 可伸展而將卡止構件47之另一方之爪部49卡止於另一方 之黏著材膠帶1之始端部32之任意位置上，故連接具有 高自由度。 φ 第10圖所示之第3實施形態時，會針對捲繞於已使 用之盤3a上之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部32，使始端部32之黏著劑1 1 面重疊於終端部30之基材9面上，其次，以橫剖面略呈 3字形之可彈性變形之夾子53夾住重疊部份實施固定。 因爲只以夾子53夾住重疊部份來實施連接，故連接作業 十分容易。 第1 1圖所示之第4實施形態時，係在第1實施形態 Φ 中’以橫剖面略呈3字形之金屬製夾持片55覆蓋重疊部 份，並從重疊部份之兩面壓扁夾持片55來連接兩者。因 係從重疊部份之兩面壓扁夾持片55來實施連接，故可利 用重疊部份獲得強固之連接。 第5〜8項記載之發明並未受限於上述實施形態，只 要未背離第5〜8項記載之發明之要旨的範圍內，可實施 各種變形。 例如’上述之第1實施形態時，卡止銷46並非略呈 3字形，而爲1支線狀銷亦可’此時，應以複數個銷來固 -63- (59) 1321868 定重疊部份。 第2實施形態時，亦可配合黏著材膠帶1之寬度來使 用複數個卡止構件47。 _ 第3實施形態及第4實施形態時，亦可使用複數個夾 子53或夾持片55，並分別從黏著材膠帶1之重疊部份之 兩側進行固定。 其次，針對第9〜1 3項記載之發明進行說明。 ^ 這些發明係關於電子構件及電路基板、或電路基板間 φ 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對第9〜1 3項記載之發明之背景技術進行說 明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 φ 方法，係採用黏著材膠帶。 φ 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 —(以下簡稱爲Γ黏著材盤」_：)裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 -64 - (60) 1321868 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時’拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 φ 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 # 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，第9〜13項記載之發明的目的，係在提供一種 黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡單， 而提高電子機器之生產效率。 其次，參照附錄圖面，針對第9〜1 3項記載之發明之 實施形態進行說明，首先，參照第12圖A、B、第3圖〜 -65- (61) 1321868 第5圖，針對第9〜1 3項記載之發明之第1實施形態進行 說明。第12圖A〜C係第1實施形態之黏著材膠帶之連 接方法圖，第1 2圖A係黏著材盤間之連接的斜視圖，第 _ 12圖B係第1 2圖A之連接部份之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲50m、寬度 W 約爲 3 m m。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 Φ 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等’亦可在前述之物及/或非導電性之玻-璃一 、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。 此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 [S1 -66 - (62) 1321868 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者’會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 •。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取 盤17裝著至黏著裝置15，捲繞於盤3a上之黏著材膠帶1 之前端裝設至捲取盤7，並捲出黏著材膠帶1(第3圖中 之箭頭E)。其次，將黏著材膠帶1配置於電路基板21 上，以配置於兩盤3 a、1 7間之加熱加壓頭1 9從基材9側 實施黏著材膠帶1之壓接，將黏著劑11壓著至電路基板 # 21。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上’如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）23，必要 時’可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭19對電路基板21實施配線電路23之加熱加壓。利用 此方式’可連接電路基板21之電極21a及配線電路23之 電極2 3 a。 -67- (63) (63)1321868 利用本實施形態之黏著材膠帶1之PDP »其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑11的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記2 8 (參照第12圖A )。 第9〜13項記載之發明之黏著材膠帶之連接方法可以 分成下述2種，（a)直接使用捲取盤17，更換已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶，並連接新黏 著劑膠帶及捲取盤17，（b)將已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶當做捲取盤1 7使用，並連接 新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶。 (b)時，如第12圖A所示，爲了將盤3a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部32之連接（參照第12圖A)。 此黏著材膠帶1之連接上，如第12圖B所示，會針 對黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材 盤3之黏著材膠帶1之始端部32，使始端部32之黏著劑 11面重疊於終端部3 〇之基材9面上。雨者之重疊長度Η 爲黏著劑膠帶1之寬度W的大約2.5倍，將其置於工作 台3 6上，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓 S] -68- (64) 1321868 實施黏著。利用此方式，可實施捲繞於已使用之盤3a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連 接。其次，將已使用之盤3a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，無需另行採用 黏著劑間之壓著用器具，即可更換捲繞著黏著材1之盤3 3a。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤17之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部30、及新黏著材盤3之黏著材膠帶1之始 端部32互相重疊。其次，以黏著裝置15之加熱加壓頭 φ 19對兩者之重疊部份進行加熱加壓實施黏著。因爲捲取 盤17只會捲取基材9，故可捲取數個黏著材盤份，減少 捲取盤17之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布由樹脂及導電粒子13混合而成之黏著劑u ，並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料 。被捲取之黏著材膠帶之原始材料，以切割機33切成特 -69- (65) 1321868 定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸 上，或者，捲取至附側板之捲軸上，將其和除濕材一起綑 包，實施低溫（-5 °C〜-1 )之管理並進行出貨。 其次，針對第9〜1 3項記載之發明之其他實施形態進 行說明，以下說明之實施形態中，和上述實施形態相同之 部份會附與相同符號並省略該部份之詳細說明，以下之說 明係以和上述實施形態不同之點爲主。-62- (58) 1321868 The claw portion 48 disposed at one end of the locking member 47 is locked to the end portion 30, and the claw portion 49 disposed at the other end is locked to the starting end portion 32 to connect the two However, the connection is very easy. Further, since one of the claw portions 48 and the other claw portion 49 has an elastic member 5'', the elastic member 50 can be extended to lock the other claw portion 49 of the locking member 47 to the other adhesive tape. At any position of the beginning end portion 32 of the 1st, the connection has a high degree of freedom. φ In the third embodiment shown in Fig. 10, the end portion 30 of the adhesive tape 1 wound around the used disc 3a and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are The surface of the adhesive 1 1 of the starting end portion 32 is superposed on the surface of the base material 9 of the end portion 30, and secondly, the elastically deformable clip 53 having a substantially three-dimensional cross section is sandwiched and fixed. Since the connection is carried out only by sandwiching the overlapping portion with the clip 53, the connection work is very easy. In the fourth embodiment shown in Fig. 1, in the first embodiment Φ, the metal holding piece 55 having a substantially three-dimensional cross section covers the overlapping portion and is flattened from both sides of the overlapping portion. The clamping piece 55 is used to connect the two. Since the connection is performed by flattening the holding pieces 55 from both sides of the overlapping portion, the overlapping portion can be used to obtain a strong connection. The invention described in the fifth to eighth embodiments is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in the fifth to eighth aspects. For example, in the first embodiment described above, the locking pin 46 is not slightly triangular, but may be a linear pin. In this case, a plurality of pins should be used to fix the overlap-63-(59) 1321868. . In the second embodiment, a plurality of locking members 47 may be used in combination with the width of the adhesive tape 1. In the third embodiment and the fourth embodiment, a plurality of clips 53 or holding pieces 55 may be used and fixed from both sides of the overlapping portion of the adhesive tape 1. Next, the invention described in the ninth to thirteenth aspects will be described. ^ These inventions relate to an adhesive tape for fixing an electrical component between a electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, a method of connecting an adhesive tape wound into a disk shape Related. Next, the background art of the invention described in the ninth to thirteenth aspects will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection φ method uses adhesive tape. Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as the adhesive material plate _:) is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted to the roll. Take the plate. Next, the adhesive is pressed onto the substrate substrate of the -64 - (60) 1321868 circuit substrate by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the residual base is taken up by the take-up reel. material. Secondly, when the adhesive tape of the adhesive material disc is used up, 'removing the used tray and the take-up tray for taking up the substrate, and loading the new take-up tray and the new adhesive sheet on the adhesive device, and sticking the adhesive material The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive φ is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the items 9 to 13 is to provide a method of joining the adhesive tape, which makes it easy to replace the adhesive disk and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in the ninth to thirteenth aspects will be described with reference to the drawings. First, referring to FIG. 12A, B, and FIG. 3 to -65- (61) 1321868, FIG. 5, The first embodiment of the invention described in the following paragraphs 9 to 13 will be described. 12A to C are views showing a method of connecting the adhesive tape according to the first embodiment, and Fig. 2A is a perspective view showing the connection between the adhesive sheets, and Fig. 12B is a connection portion of Fig. 2A. An oblique view of the connection method. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on both width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 3 m. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, or a mixture of Φ thermoplastic resin and thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, or carbon, graphite, etc. 'may also be in the foregoing and/or non-conductive glass-glass 1. A polymer core material such as ceramics or plastic is formed by covering the above-mentioned conductive layer or the like. Further, an insulating coating particle [S1 - 66 - (62) 1321868, or conductive particles and insulating particles for covering the conductive particles with an insulating layer may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, the deformability due to deformation due to heating, pressurization or pressurization is reduced, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection components•. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the take-up reel 7, and Roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3a and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and the adhesive 11 is applied. Pressed to the circuit board #21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. Formally connected as shown in Fig. 4, a wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 23 can be connected. -67- (63) (63) 1321868 The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be large. The amount of adhesive 11 used will be much greater than conventionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 12A). The method of connecting the adhesive tape of the invention according to the invention of the ninth to thirteenth aspect can be divided into the following two types: (a) directly using the take-up reel 17, and replacing the adhesive tape having a small remaining number of the adhesive tape 1 used. And attaching a new adhesive tape and a take-up reel 17, (b) using an adhesive tape having a reduced number of residual rolls of the used adhesive tape 1 as a take-up reel 1 7 and attaching a new adhesive tape and residue Adhesive tape with a reduced number of rolls. (b), as shown in Fig. 12A, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. The terminal portion 30 and the connection of the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3 (see Fig. 12A). The connection of the adhesive tape 1 is as shown in Fig. 12B, and the end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the beginning end 32 of the adhesive tape 1 of the new adhesive sheet 3 are made. The surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the substrate 9 of the end portion 3. The overlapping length of the rainer is about 2.5 times the width W of the adhesive tape 1, and is placed on the table 36, and heated and pressurized by the heating and pressing head 1 of the bonding device 15]. (64) 1321868 Implement adhesion. In this manner, the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound around the new disk 3 can be connected. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. In this embodiment, since the heating and pressing head 19 is used, the disk 3 3a around which the adhesive 1 is wound can be replaced without separately using the pressing device between the adhesives. When the reeling tape 17 of (a) is used as it is, the adhesive tape which has the remaining number of remaining adhesive tapes 1 is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion 30 of the adhesive tape remaining on the side of the take-up reel 1 7 is The starting end portions 32 of the adhesive tape 1 of the new adhesive sheet 3 overlap each other. Next, the overlapping portions of the two are heated and pressed by the heating and pressing head φ 19 of the bonding device 15 to perform adhesion. Since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, reducing the number of replacements of the take-up reel 17, and having good work efficiency. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinder 25, an adhesive u obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, followed by a coiler. 3 1 Take the original material. The original material of the adhesive tape which is taken up is cut into a width of -69-(65) 1321868 by the cutter 33 and taken up to the reel, and the side plates 7, 7 are mounted on the reel from both sides, or It is taken up to the reel with the side plate, and it is bundled with the dehumidifying material, and is managed at a low temperature (-5 °C to -1) and shipped. In the following, the other embodiments of the invention described in the ninth to third aspects will be described. In the embodiments described below, the same reference numerals will be given to the same parts as the above-described embodiments, and the detailed description of the parts will be omitted. The description is mainly based on differences from the above embodiments.

第1 3圖所示之第2實施形態時，以表面爲參差不齊 (凹凸）44而爲互相嵌合之一方之模具56、及另一方之 模具57夾持黏著材膠帶1之重疊部份34，使重疊部份34 形成凹凸5 8。如此，利用形成凹凸5 8，可增加重疊部份 34之黏著面積，且利用重疊部份34之凹凸58的卡合可 提高拉伸方向（黏著材膠帶之縱向）之強度。形成凹凸時 ，黏著劑1 1會流動而以黏著劑黏著重疊部份之端面間， 可進一步提高重疊部份34之拉伸方向的強度。In the second embodiment shown in Fig. 3, the overlapping portion of the adhesive tape 1 is sandwiched between the mold 56 having the surface unevenness (concavity and convexity) 44 and the other mold 57. 34, the overlapping portion 34 is formed with the unevenness 58. Thus, by forming the unevenness 5 8, the adhesion area of the overlapping portion 34 can be increased, and the engagement of the unevenness 58 of the overlapping portion 34 can increase the strength of the stretching direction (the longitudinal direction of the adhesive tape). When the unevenness is formed, the adhesive 1 1 flows and the adhesive adheres to the end faces of the overlapping portions, so that the strength of the overlapping portion 34 in the stretching direction can be further improved.

第14圖A及第14圖B所示之第3實施形態時，會 將捲取至新黏著材1之盤3之始端部32彎折成略呈V字 形，捲繞於已使用之盤3a上之黏著材膠帶1之終端部30 亦彎折成略呈V字形，使兩者成爲鈎狀必須黏著劑1 1互 相相對並卡止（第1 4圖a )，以加熱加壓頭1 9實施加熱 加壓來連接兩者（第14圖B )。此第3實施形態時，因 終端部.4 0及始端部-3 2係以鉤狀連結而可獲得強-固之連結 ，同時，因利用黏著劑1 1之重疊來連接，故可得到更爲 強固之連接。和上述相同，因爲黏著劑會在重疊部份流動In the third embodiment shown in Figs. 14A and 14B, the starting end portion 32 of the disk 3 wound up to the new adhesive material 1 is bent into a substantially V shape and wound around the used disk 3a. The terminal portion 30 of the adhesive tape 1 is also bent into a V-shape so that the two are hook-shaped, and the adhesives 1 must be opposed to each other and locked (Fig. 14 a) to heat the pressing head 19 Heat and pressure are applied to connect the two (Fig. 14B). In the third embodiment, since the terminal portion .40 and the start portion -3 2 are connected in a hook shape, a strong-solid connection can be obtained, and at the same time, since the adhesive 1 1 is connected by overlapping, it is possible to obtain more. For a strong connection. Same as above because the adhesive will flow in the overlapping part

-70- (66) 1321868 並黏著端面，故可獲得更強固之連接。 第15圖A及第15圖B所示之第4實施形態 第1實施形態之加熱加壓前、或加熱加壓之同時在 份34形成貫通孔59。利用形成貫通孔59，加熱加 使黏著劑11從貫通孔59之周圍滲出並實施黏著而 著力，重疊部34可獲得強固之連接。 第9〜13項記載之發明並未受限於上述之實施 φ 只要不背離第9〜13項記載之發明之要旨的範圍內 施各種變形。 例如，上述之第2實施形態時，凹凸5 8不必 ，亦可以爲具弧形之九形。 第4實施形態時，貫通孔59之數並無特別限 以爲任何數量。又，貫通孔59之直徑並無限制。 2、第3實施形態時，亦可進一步在重疊部份3 4上 通孔5 9。 # 其次，針對第1 4〜1 8項記載之發明進行說明‘ 這些發明係關於電子構件及電路基板、或電路 之黏著固定、以及兩者之電極間之電性連接的黏著 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相 其次，針對第1 4〜1 8項記載之發明之背景技 說明。 一般而言，液晶面板、PDP (電漿顯示面板） 螢光顯示）面板、裸晶片封裝等之電子構件及電路 或電路基板間之黏著固定、以及兩者之電極間之電 ，係在 重疊部 壓時可 提筒黏 形態， ，可實 爲山型 制，可 又，第 形成貫 基板間 材膠帶 關。 術進行 、EL ( 基板、 性連接 -71 - (67) 1321868 方法，係採用黏著材膠帶。 曰本特開200 1 -2 84005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。黏著材盤之裝著後， 從自黏著材盤捲出之黏著材膠帶之基材側以加熱加壓頭將 黏著劑壓著至電路基板等上，再以捲取盤捲取殘餘之基材 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，將黏著材膠帶之始端經由黏著裝置之導引銷裝 設至捲取盤。 然而，近年來，隨著PDP等之面板畫面之大型化’ 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大’黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩’故有無法提高電 子機器之生產效率之問題。 針對此問題，·可方考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 [S1 -72- (68) 1321868 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，而可能 因爲黏著劑從膠帶兩側滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 另一方面，以粘黏著材膠帶貼附黏著材膠帶及黏著材 φ 膠帶並無法充分黏著力實施黏著。爲了使黏著材膠帶具有 良好黏著材剝離性，會在其上塗布氟系脫模劑或矽系脫模 劑等，而上述情形就是因爲其影響。 因此，第14〜18項記載之發明的目的，係在提供一 種黏著材膠帶之連接方法，尤其是黏著材膠帶之基材採用 經過矽處理之基材時，亦可使黏著材盤之更換較爲簡單， 而提高電子機器之生產效率。 其次，參照附錄圖面，針對第14〜18項記載之發明 φ 之實施形態進行說明，首先，參照第16圖A、B、第3圖 〜第5圖，針對第1 4〜1 8項記載之發明之第1實施形態 進行說明。第16圖A及B係第1實施形態之黏著材膠帶 之連接方法圖，第1 6圖A係黏著材盤間之連接的斜視圖 ，第16圖B係第16圖A之連接部份（b)之連接方法的 斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 -73- (69) 1321868 黏著材膠帶1係由矽處理基材9、及塗布於矽處理基 材9之一側面之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， .矽處理基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 PET (聚對苯二甲酸乙二酯）等之基材所構成，其表面利 用矽樹脂等實施表面處理。-70- (66) 1321868 and adhere to the end face, so you can get a stronger connection. Fourth Embodiment shown in Fig. 15 and Fig. 15B. The through hole 59 is formed in the portion 34 before the heating and pressurization or the heating and pressing in the first embodiment. By forming the through hole 59, heating causes the adhesive 11 to ooze out from the periphery of the through hole 59, and the adhesion is exerted, and the overlapping portion 34 can be strongly connected. The invention described in the ninth to thirteenth aspects is not limited to the above-described embodiments. φ Various modifications are possible without departing from the gist of the invention described in the ninth to thirteenth. For example, in the second embodiment described above, the unevenness 5 8 is not necessary, and may be a nine-shape having an arc shape. In the fourth embodiment, the number of the through holes 59 is not particularly limited. Further, the diameter of the through hole 59 is not limited. 2. In the third embodiment, the through hole 5 9 may be further formed on the overlapping portion 34. # Next, the invention described in the first to fourth aspects will be described. The invention relates to adhesion of an electronic component, a circuit board, or a circuit, and an electrical connection between electrodes, in particular, and The method of joining the adhesive tape wound into a disk shape is followed by the background art of the invention described in the first to fourth aspects. In general, a liquid crystal panel, a PDP (plasma display panel) fluorescent display panel, an electronic component such as a bare chip package, and a circuit or a circuit board are bonded and fixed, and the electric power between the electrodes is overlapped. When pressing, the shape of the tube can be lifted, and it can be made into a mountain type. In the process of EL, the substrate (Slab, Sexual Connection - 71 - (67) 1321868 is an adhesive tape. 曰本特开开开开开开开开开开开开开开开开The tape is rolled into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape is placed on the tape. (hereinafter referred to as "adhesive plate") is installed on the adhesive device, pulls out the beginning end of the adhesive tape and attaches it to the take-up reel. After the adhesive plate is loaded, the adhesive is rolled out from the self-adhesive plate. The substrate side of the material tape is pressed onto the circuit board by a heating and pressing head, and the residual substrate is taken up by the take-up reel, and then the adhesive tape of the adhesive material disc is used up, and the adhesive tape is used up. The tray, and the take-up tray of the take-up substrate, the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the beginning end of the adhesive tape is attached to the take-up tray via the guide pin of the adhesive device. In recent years, with the enlargement of the panel image of PDP, etc. The adhesive area of the board is also increased, and the amount of the adhesive used at one time is also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine More frequent, because the replacement of the adhesive material plate is very troublesome, so there is a problem that the production efficiency of the electronic machine cannot be improved. In response to this problem, it is possible to increase the number of the adhesive tapes that are taken up to the disk to increase the number of rolls. The adhesive dose of 1 disc is used to reduce the frequency of replacement of the disc. However, since the tape width of the adhesive tape is narrower than 1 [S1 -72- (68) 1321868 3 mm, if the number of rolls is increased, the roll may be scattered. In addition, if the number of rolls is increased, the pressure of the adhesive tape which is applied to the tape-like tape may increase, and the adhesive may become a cause of clogging because the adhesive oozes from both sides of the tape. If it increases, the diameter of the disk will also increase, and it may not be able to be attached to the existing adhesive device, and the existing adhesive device cannot be used. On the other hand, it is attached with adhesive tape. The tape and the adhesive material φ tape cannot be adhered to the adhesive tape sufficiently. In order to make the adhesive tape have good adhesive peelability, a fluorine-based release agent or a release agent may be applied thereon, and the above situation is Therefore, the object of the invention described in the items 14 to 18 is to provide a method for joining an adhesive tape, in particular, when the substrate of the adhesive tape is made of a ruthenium-treated substrate, the adhesive can also be used. The replacement of the disk is relatively simple, and the production efficiency of the electronic device is improved. Next, the embodiment of the invention φ described in the items 14 to 18 will be described with reference to the attached drawings. First, reference is made to Fig. 16A, B, and 3. Fig. 5 is a first embodiment of the invention described in the first to fourth aspects. Fig. 16 is a view showing a method of connecting the adhesive tape according to the first embodiment, Fig. 16 An oblique view of the connection between the adhesive sheets, and Fig. 16B is a perspective view showing the connection method of the connecting portion (b) of Fig. 16A. The adhesive tape 1 is wound around the discs 3, 3 a, respectively, and the reels 5 are disposed on the discs 3, 3 a and the side plates disposed on the width sides of the adhesive tape 1 - 73 - (69) 1321868 Adhesive The tape 1 is composed of a ruthenium-treated substrate 9 and an adhesive 1 1 applied to one side of the ruthenium-treated substrate 9. From the strength and the releasability of the adhesive to the isoelectric material, the 矽 treatment substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or PET (polyethylene terephthalate). The surface of the substrate is formed, and the surface thereof is subjected to surface treatment using a resin or the like.

黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 >熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type.

黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層等來形成導電粒 φ子。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 一一沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，-而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be used in the above-mentioned materials and non-conductive glass, ceramics, and plastics. The polymer core or the like is covered with the conductive layer or the like to form a conductive particle φ. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use a polymer as a core material, such as solder, because there is no melting point, and it can be controlled to soften at a wide connection temperature, and it is easy to obtain the thickness and flatness of the electrode. The connection component of the error of the sex.

-74- (70) 1321868 其次，針對本實施形態之黏著材膠帶之使用方 說明。如第3圖所示’將黏著材膠帶1之盤3a、 盤17裝著至黏著裝置15’將捲繞於盤3a上之黏 帶1之前端裝設至捲取盤17 ’並捲出黏著材膠帶】 圖中之箭頭E)。其次’將黏著材膠帶1配置於電 21上，以配置於以配置於兩盤3a、17間丨C配置之 壓頭19從矽處理基材9側實施黏著材膠帶1之壓 φ 黏著劑11壓著至電路基板21。其後，將矽基材9 捲取盤17。 上述壓著後（暫時連接），實施電路基板21 及配線電路（電子構件）23之電極的定位並進行 接。正式連接上，如第4圖所示，在壓著至電路3 上之黏著劑11上配置配線電路（或電子構件）23 時，可將例如聚四氟乙烯材24當做緩衝材，以加 頭19對電路基板21實施配線電路23之加熱加壓 此方式，可連接電路基板21之電極21a及配線電K 電極23a。 利用本實施形態之黏著材膠帶1之PDP，其尺 大，有時會對PDP之周圍全體實施壓著，連接部 多’一次使用之黏著劑11的使用量會遠大於傳統 用量。因此’捲繞於盤3a上之黏著材膠帶1之使 會變多，捲繞於盤3a上之黏著材膠帶1在相對較 間內會被捲取至捲取盤17，而露出捲繞於盤3a上 材膠帶1之結束標記28(參照第16圖A)。 法進行 及捲取 著材膠 1 (第3 路基板 加熱加 接，將 捲取至 之電極 正式連 I板21 ，必要 熱加壓 。利用 "3之 寸會較 份會較 上之使 用量亦 短之時 之黏著 -75- (71) 1321868 第14〜18項記載之發明之黏著材膠帶之連接方法可 以分成下述2種’ （a)直接使用捲取盤17’更換已使用 之黏著材膠帶1之殘胃捲數變少的黏著劑膠帶’ #連接新 黏著劑膠帶及捲取盤17，（b)將已使用之黏著材膠帶1 之殘餘捲數變少的黏著劑膠帶當做捲取盤17使用’並連 接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶。 (b)時，如第16圖A所示，爲了將盤33更換成新 ^ 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 φ 著材膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於 新黏著材盤3上之黏著材·膠帶（另一方之黏著材膠帶）1 之始端部3 2之連接。 此黏著材膠帶1之連接上，如第16圖Β所示，黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部3 2會互相抵接，以跨越兩黏著材 膠帶1、1之矽處理基材9、9之表面的方式貼附矽粘著膠 φ 帶60，實施兩黏著材膠帶1、1之連接。 φ 此矽粘著膠帶60係由基材63及塗布於基材63之單 面之矽粘著劑62所構成。基材63之材質並無特別限制， 然而，本實施形態係聚醯亞胺樹脂材。又，第1 6圖B中 ，黏著材膠帶之黏著劑1 1及矽粘著膠帶60之粘著劑部份 4 3分別以斜線表示。 ---此處-’贵對砍粘著膠帶-60之黏著進行說明。一方及— 另一方之黏著材膠帶1、1之矽處理基材9、9因爲分別覆 蓋著砂’故難以利用黏著劑進行黏著，然而，本實施形態 -76- (72) 1321868 時’因矽粘著膠帶60之粘著劑43係採用矽樹脂，兩矽處 理基材9、9之表面張力差會較小，利用密著（黏著）可 使一方之黏著材膠帶1之終端部30及另一方之黏著材膠 帶1之始端部32有良好之連接。矽粘著膠帶6〇之矽粘著 劑62表面、及矽處理基材9、9表面之表面張力差應爲 10mN/m ( 1 Odyne/cm )以下，本實施形態時，幾乎沒有表 面張力差。 φ —般而言’一方之黏著材膠帶1之終端部30及另一 方之黏著材膠帶1之兩矽處理基材9、9之表面張力爲 25mN/m 〜60mN/m(25 〜60dyne/cm)，例如，表面張力 爲30mN/m時，矽粘著膠帶60之矽粘著劑62之表面張力 應設定成20mN/m以上、40mN/m以下。 矽系粘著劑主要係由矽橡膠及矽樹脂所構成，一般而 言，係使兩者產生少許縮合反應而具有粘著性，其次，利 用過氧化物、白金觸媒之矽氫化反應使其交聯，玻璃轉移 Φ 溫度爲-100 °c以下者。上述皆爲市販品，可選擇適當者使 用。 如此，利用矽粘著膠帶60實施捲繞於已使用之黏著 材盤3a上之黏著材膠帶1、及捲繞於新黏著材盤3上之 黏著材膠帶1之連接。其次，將已使用之黏著材盤3a及 新黏著材盤3互相對換，將新黏著材盤3裝著於黏著裝置 15。因此，無需拉出新黏著材盤3之黏著材膠帶1並將黏 著材膠帶裝著至捲取盤17、或將新黏著材膠帶1裝設至 黏著裝置15之導引銷36之作業，故黏著材盤3、3a之更 -77- (73) 1321868 換有良好之作業效率。如此，因爲已全部捲出之黏著材膠 帶1之終端部30、及新裝著之黏著材膠帶1之始端部32 係以矽粘著膠帶進行連接，故連接十分簡單。 其次，將已使用之盤3a及新盤3互相對換’將新盤 3裝著至黏著裝置15。因此，無需將新黏著材膠帶1裝著 至捲取盤1 7之作業。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤17之連接時，已使用之盤3a 之黏著材膠帶1之結束標記28露出時，會在黏著材膠帶 1之結束標記28附近實施切斷，使殘留於捲取盤17側之 黏著材膠帶之終端部30、及新黏著材盤3之黏著材膠帶1 之始端部32互相抵接。其次，在兩者之抵接部份利用矽 粘著膠帶實施黏著材膠帶1之終端部30、及新黏著材盤3 之黏著材膠帶1之始端部32的連接。因爲捲取盤17只會 捲取基材9，故可捲取數個黏著材盤份，減少捲取盤17 之更換次數，而有良好之作業效率。 其次，參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾 燥爐19實施乾燥後「以捲取機3Ί捲取JT始秫料·。被捲取 之黏著材膠帶之原始材料，以切割機33切成特定寬度並 捲取至捲軸後’從兩側將側板7、7裝著於捲軸上，或者 -78- (74) 1321868 ，捲取至附側板之捲軸上，將其和除濕材一起綑包，實施 低溫（-5°C〜-l〇°C )之管理並進行出貨。 其次，針對第14〜18項記載之發明之其他實施形態 進行說明，和上述實施形態相同之部份會附與相同符號並 省略該部份之詳細說明，以下之說明係以和上述實施形態 不同之點爲主。 第17圖所示之第2實施形態時，除了如上述之第1 φ 實施形態以外，在一方之黏著材膠帶1之終端部3 0、及 另一方之黏著材膠帶之始端部3 2之黏著劑1 1面側亦貼附 著矽粘著膠帶60。此第2實施形態之矽粘著膠帶60之矽 粘著劑62，其黏著力爲l〇〇g/25mm以上，本實施形態時 則爲700g/25mm〜1 400g/25mm。又，矽粘著膠帶60之矽 粘著劑62之表面張力的設定上，係和上述實施形態相同 ，一方及另一方之黏著材膠帶之矽基材之表面張力差爲 10mN/m ( 10dyne/cm)以下。此第2實施形態時，一方之 • 黏著材膠帶1之終端部30及另一方之黏著材膠帶之始端 部32之兩面，因以矽粘著膠帶60實施黏著，可以較第1 實施形態更高之強··度來實施兩黏著材膠帶1、1之黏著。 第1 8圖所示之第3實施形態，係以重疊方式配置一 方之黏著材膠帶1之終端部30及另一方之黏著材膠帶1 之始端部3 2，其矽處理基材9側面及黏著材1 1側面則貼 附著第2實施形態之矽粘著膠帶60，利用此第3實施形 態，可獲得和第2實施形態相同之作用效果。 第19圖所示之第4實施形態，係在一方之黏著材膠 -79- (75) 1321868 帶1之終端部30、及另一方之黏著材膠帶1之始端部32 之間，存在基材之兩面塗布著矽粘著劑62之矽粘著膠帶 6 1，用以連接終端部3 0及始端部3 2。利用此第4實施形 _態，因係使用兩面之矽粘著膠帶61，一方之黏著材膠帶1 之終端部30及另一方之黏著材膠帶1之始端部32的連接 更爲十分簡單且容易。 其次，針對第1 9〜2 1項記載之發明進行說明。 ^ 這些發明係關於電子構件及電路基板、或電路基板間 φ 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對第1 9〜2 1項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 φ 方法，係採用黏著材膠帶。 · 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 ——（以-下簡稱爲E黏著材盤」）裝-設於黏著裝置上，拉邗黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 -80- (76) 1321868 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時’拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 φ 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 φ 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大’可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此’第1 9〜2 1項記載之發明的目的，係黏著材膠 帶之連接方法’可使黏著材盤之更換較爲簡單，而提高電 子機器之生產效率。 其次，參照附錄圖面，針對第1 9〜第2 1項記載之發 明之實施形態進行說明，首先，參照第20圖A〜C、第 -81 - (77) 1321868 21圖、第4圖、及第5圖，針對第19〜21項記載之發明 之第1實施形態進行說明。第2 0圖A〜C係本實施形態 之黏著材膠帶之連接方法圖，第20圖A係黏著材盤間之 _連接的斜視圖，第20圖B及C係第20圖A之連接部份 之連接方法的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶丨之兩寬度側之側板 • 7 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度 '及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 φ 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13係如 Au、Ag、Pt、Ni、Cu' W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層而形成者。此外 ’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子' [S] -82- (78) (78)1321868 或併用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路接觸之面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點 ，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第21圖所示，將黏著材膠帶1之盤3a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠 帶1之前端經由導引銷22裝設至捲取盤17，並捲出黏著 材膠帶1(第21圖中之箭頭E)。其次，將黏著材膠帶1 配置於電路基板2 1上，利用配置於兩盤3 ' 1 7間之加熱 加壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著 劑Π壓著至電路基板21。其後，將基材9捲取至捲取盤 17° 上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）23之電極的定位並進行正式 連接。正式連接上，如第4圖所示，在壓著至電路基板 2 1上之黏著劑1 1上配置配線電路（或電子構件）23，必 要時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加 壓頭19對電路基板21實施配線電路23之加熱加壓。利 用此方式’可連接電路基板21之電極21a及配線電路23 之電極2 3 a。 -83- (79) 1321868 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑11的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記28(參照第20圖A)。 第19〜21項記載之發明之黏著材膠帶之連接方法可 φ 以分成下述2種，（a )直接使用捲取盤1 7，更換已使用 之黏著材膠帶1之殘餘捲數變少的黏著劑膠帶，並連接新 黏著劑膠帶及捲取盤17， （b)將已使用之黏著材膠帶1 之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7使用，並連 接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶。 (b)時，如第20圖A所示，爲了將盤3a更換成新 黏著材盤3’在盤3a之黏著材膠帶1露出結束標記28時 ’盤3a之黏著材膠帶（一方之黏著材膠帶之終端部 φ 3〇、及捲繞於新黏著材盤3上之黏著材膠帶（另—方之黏 著材膠帶）1之始端部32係利用樹脂製黏著劑64實施連 接。 樹脂製黏著劑64係例如環氧樹脂、氰酸樹脂、二馬 來醒亞胺樹脂、酸樹脂、尿素樹脂、三聚氧胺樹脂、醇酸 樹脂、壓克力樹腊、不飽和聚酯樹脂、苯二酸二稀丙醋樹 - 脂、矽樹脂、間苯二酚甲醛樹脂、二甲苯樹脂、呋喃樹脂 、聚胺酯樹脂 '酮樹脂、三聚烯丙基胺氰樹脂等。 [S1 -84- (80) 1321868 此黏著材膠帶1之連接如第20圖B所示，針對黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部32，使始端部32之黏著劑11面 重疊於終端部3 0之基材9面。其次，利用組合於黏著裝 置15之充塡機65將糊狀之樹脂製黏著劑64塗布於重疊 部份。其次，如第20圖C所示，此樹脂製黏著劑64爲熱 硬化性樹脂時，利用組合於黏著裝置1 5之加熱器66之加 φ 熱實施硬化，連接黏著材膠帶1之終端部30、及新黏著 材盤3之黏著材膠帶1之始端部32。 利用此方式，可實施捲繞於已使用之盤3a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，以樹脂製黏著劑64固定已全部捲出之黏著材膠帶1 之終端部30、及新裝著之黏著材膠帶1之始端部32，故 連接十分簡單。 其次，將已使用之盤3a及新盤3互相對換，將新盤 φ 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 直接使用（a)之捲取盤17’將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤17之連接時’已使用之盤3a 之黏著材膠帶1之結束標記28露出時會從黏著材膠帶1 之結束標記28附近實施切斷，使殘留於捲取盤1 7側之黏 著材膠帶之終端部30及新黏著材盤3之黏著材膠帶1之 始端部32重疊。其次，在兩者之重疊部份塗布糊狀之樹 -85- (81) 1321868 脂製黏著劑64，依據使用之樹脂製黏著劑之種類實施加 熱、紫外線照射等使其發揮黏著力，實施終端部30、及 新黏著材盤3之黏著材膠帶1之始端部32之連接。因爲 捲取盤17只會捲取基材9，故可捲取數個黏著材盤份， 減少捲取盤17之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。-74- (70) 1321868 Next, a description will be given of the use of the adhesive tape of the present embodiment. As shown in Fig. 3, 'the disc 3a of the adhesive tape 1 and the disc 17 are attached to the adhesive device 15', and the front end of the adhesive tape 1 wound on the disc 3a is attached to the take-up reel 17' and rolled out. Tape] The arrow E) in the figure. Next, the adhesive tape 1 is placed on the electric appliance 21, and is placed on the nip 1 which is disposed between the two trays 3a and 17, and the pressure of the adhesive tape 1 is applied from the side of the enamel processing substrate 9 to the pressure φ. It is pressed to the circuit board 21. Thereafter, the crucible substrate 9 is taken up by the disc 17. After the pressing (temporary connection), the electrodes of the circuit board 21 and the wiring circuit (electronic component) 23 are positioned and connected. On the formal connection, as shown in Fig. 4, when the wiring circuit (or electronic component) 23 is placed on the adhesive 11 pressed onto the circuit 3, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material to be added. 19, the circuit board 21 is heated and pressurized by the wiring circuit 23, and the electrode 21a of the circuit board 21 and the wiring electric K electrode 23a can be connected. In the PDP of the adhesive tape 1 of the present embodiment, the size of the PDP of the adhesive tape 1 is large, and the entire periphery of the PDP may be pressed, and the amount of the adhesive 11 used in the connection portion may be much larger than the conventional amount. Therefore, the amount of the adhesive tape 1 wound on the disk 3a becomes large, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively small space, and the exposed winding is The end mark 28 of the upper tape 1 of the disk 3a (refer to Fig. 16A). The method is to carry out and take up the glue 1 (the third substrate is heated and connected, and the electrode to be taken up is officially connected to the I plate 21, and it is necessary to be hot pressed. The use of "3 inch will be compared with the usage. Also in the short time -75- (71) 1321868 The method of joining the adhesive tape of the invention described in Items 14 to 18 can be divided into the following two types: (a) directly using the take-up reel 17' to replace the used adhesive. The adhesive tape of the tape 1 has a small number of residual stomach rolls. ##Connect the new adhesive tape and the take-up reel 17, and (b) use the adhesive tape which has less residual reel of the adhesive tape 1 as a roll. The tray 17 is made of 'and a new adhesive tape and an adhesive tape having a small number of remaining reels. (b), as shown in Fig. 16A, in order to replace the disc 33 with a new adhesive sheet 3, on the tray The adhesive tape 1 of 3a is subjected to the adhesive portion of the disc 3a, the end portion 30 of the adhesive tape (one adhesive tape) 1, and the adhesive/tape wrapped around the new adhesive disc 3 (the other is adhered) The connection of the beginning end portion 3 of the material tape) 1. The connection of the adhesive tape 1 is as shown in Fig. 16, The end portion 30 of the adhesive tape 1 of the material tray 3a and the beginning end portion 3 2 of the adhesive tape 1 of the new adhesive sheet 3 abut each other to treat the substrate 9 across the two adhesive tapes 1, 1. The surface of the surface of the 9 is attached to the adhesive tape φ tape 60, and the two adhesive tapes 1 and 1 are joined. φ The adhesive tape 60 is applied from the substrate 63 and applied to one side of the substrate 63. The material of the base material 63 is not particularly limited. However, the present embodiment is a polyimine resin material. Further, in Fig. 6B, the adhesive 1 1 of the adhesive tape and the adhesive are adhered. The adhesive portion 4 3 of the tape 60 is indicated by oblique lines. --- Here - 'The adhesion of the chopped adhesive tape-60 is explained. One side and the other side of the adhesive tape 1, 1 Since the treated substrates 9 and 9 are covered with sand, respectively, it is difficult to adhere with an adhesive. However, in the present embodiment, -76-(72) 1321868, the adhesive 43 of the adhesive tape 60 is made of enamel resin. The difference in surface tension between the two substrates 9 and 9 is small, and the end portion 30 of the adhesive tape 1 on one side can be made by adhesion (adhesion). The beginning end portion 32 of one of the adhesive tapes 1 has a good connection. The surface tension of the surface of the adhesive tape 62 and the surface of the adhesive substrate 62 and the substrate 9 and 9 should be 10 mN/m (1 Odyne). /cm) Hereinafter, in the present embodiment, there is almost no difference in surface tension. φ Generally, the end portion 30 of the adhesive tape 1 on one side and the two treated substrates 9 and 9 of the other adhesive tape 1 are The surface tension is 25 mN/m to 60 mN/m (25 to 60 dyne/cm). For example, when the surface tension is 30 mN/m, the surface tension of the adhesive 62 of the adhesive tape 60 should be set to 20 mN/m or more. 40mN/m or less. The lanthanum-based adhesive is mainly composed of ruthenium rubber and ruthenium resin. Generally, it has a slight condensation reaction between the two and has adhesiveness. Secondly, it is hydrogenated by a hydrogen peroxide reaction of a peroxide or a platinum catalyst. Cross-linking, glass transfer Φ Temperature is below -100 °c. All of the above are marketed and can be used by appropriate people. In this manner, the adhesive tape 1 wound around the used adhesive sheet 3a and the adhesive tape 1 wound around the new adhesive sheet 3 are joined by the adhesive tape 60. Next, the used adhesive sheet 3a and the new adhesive sheet 3 are mutually exchanged, and the new adhesive sheet 3 is attached to the adhering means 15. Therefore, it is not necessary to pull out the adhesive tape 1 of the new adhesive sheet 3 and attach the adhesive tape to the take-up reel 17, or attach the new adhesive tape 1 to the guide pin 36 of the adhesive device 15, so The adhesive sheet 3, 3a is more -77- (73) 1321868 for good work efficiency. Thus, since the terminal portion 30 of the adhesive tape 1 which has been completely unwound and the beginning end portion 32 of the newly attached adhesive tape 1 are joined by the adhesive tape, the connection is very simple. Next, the used disc 3a and the new disc 3 are swapped with each other', and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to load the new adhesive tape 1 to the take-up tray 17. When the reeling tape 17 of (a) is used as it is, the adhesive tape which has the remaining number of remaining adhesive tapes 1 is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, the cutting is performed in the vicinity of the end mark 28 of the adhesive tape 1, and the end portion 30 of the adhesive tape remaining on the side of the take-up reel 17 is The beginning end portions 32 of the adhesive tape 1 of the new adhesive sheet 3 abut each other. Next, the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined by the adhesive tape at the abutting portions of the two. Since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, reducing the number of replacements of the take-up reel 17, and having good work efficiency. Next, a method of manufacturing the adhesive tape i of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinding machine 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, and dried in a drying furnace 19, and then "JT is taken up by a coiler 3". The raw material of the adhesive tape that has been taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are mounted on the reel from both sides, or -78- ( 74) 1321868, coiled onto the reel with the side plate, bundled with the dehumidifying material, and managed and shipped at low temperature (-5 ° C ~ -l ° ° C). Second, for the 14th to 18th The other embodiments of the invention are described with the same reference numerals, and the detailed description of the parts will be omitted. The following description is based on the differences from the above-mentioned embodiments. In the second embodiment shown in the figure, in addition to the first φ embodiment described above, the adhesive 1 of the end portion 30 of the adhesive tape 1 and the beginning end portion 3 of the other adhesive tape are provided. The adhesive tape 60 is also attached to the one side. The second embodiment is adhered to the adhesive tape. The adhesive agent 62 of the adhesive tape 60 has an adhesive force of l〇〇g/25 mm or more, and in the present embodiment, it is 700 g/25 mm to 1 400 g/25 mm. Further, the adhesive 60 of the adhesive tape 60 is adhered to the adhesive tape 60. The surface tension is set in the same manner as in the above embodiment, and the surface tension difference between the one and the other adhesive tape is 10 mN/m (10 dyne/cm) or less. In the second embodiment, one side is required. The both ends of the end portion 30 of the adhesive tape 1 and the other end portion 32 of the other adhesive tape are adhered by the adhesive tape 60, and the two adhesives can be made higher than the first embodiment. The adhesive tape 1 and 1 are adhered to each other. In the third embodiment shown in Fig. 18, the end portion 30 of one of the adhesive tapes 1 and the other end portion 3 2 of the other adhesive tape 1 are placed in an overlapping manner. The enamel adhesive tape 60 of the second embodiment is attached to the side surface of the substrate 9 and the side surface of the adhesive material 1 1 , and the third embodiment can provide the same operational effects as those of the second embodiment. The fourth embodiment is a terminal of one of the adhesive glue-79-(75) 1321868 Between the portion 30 and the beginning end portion 32 of the other adhesive tape 1, there is a 矽 adhesive tape 161 on both sides of the substrate coated with the 矽 adhesive 62 for connecting the terminal portion 30 and the start portion 3 2 According to the fourth embodiment, since the adhesive tape 61 on both sides is used, the connection between the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 32 of the other adhesive tape 1 is simpler and Next, the invention described in the above-mentioned items 9 to 21 will be described. ^ These inventions relate to adhesion of φ between an electronic component and a circuit board or a circuit board, and adhesion of electrical connections between electrodes. The tape is, in particular, related to the method of joining the adhesive tape which is rolled into a disk shape. Next, the background art of the invention described in the nineteenth to twenty-firstth aspects will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection φ is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the disk of the adhesive tape - (hereinafter referred to as E-adhesive plate) is mounted on the adhesive device, and the beginning end of the adhesive tape is attached and installed. To the roll tray. Next, the adhesive side is pressed onto the substrate substrate of the -80-(76) 1321868 circuit substrate by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive material tray, and the residual base is taken up by the take-up reel. material. Secondly, when the adhesive tape of the adhesive material disc is used up, 'removing the used tray and the take-up tray for taking up the substrate, and loading the new take-up tray and the new adhesive sheet on the adhesive device, and sticking the adhesive material The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive φ is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the φ adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk will also increase. It may be impossible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the above-mentioned items 9-9 to 2 is that the method of joining the adhesive tapes can make the replacement of the adhesive sheets relatively simple and improve the production efficiency of the electronic machine. Next, an embodiment of the invention described in the nineteenth to twenty-firstth aspects will be described with reference to the attached drawings. First, reference is made to Figs. 20A to AC, to -81 - (77) 1321868, and to FIG. And Fig. 5, the first embodiment of the invention described in the items 19 to 21 will be described. Fig. 20A to C are diagrams showing a method of connecting the adhesive tape of the present embodiment, Fig. 20A is a perspective view of the connection between the adhesive sheets, and Fig. 20B and the connection of the second drawing of Fig. 20A. A cross-sectional view of the connection method. The adhesive tape 1 is wound around the discs 3 and 3a, respectively, and the reels 5 and the side plates disposed on the width sides of the adhesive tape 各 are disposed on the respective discs 3 and 3a. 7 The adhesive tape 1 is made of the substrate 9 And an adhesive 11 coated on one side of the substrate 9. From the strength 'and the releasability of the adhesive to the dissimilar conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and ruthenium treated PET (polyethylene terephthalate). ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, or a mixture of φ thermoplastic resin and thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. Conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu' W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be used in the above-mentioned materials and non-conductive glass, ceramics, plastics, and the like. A polymer core material or the like is formed to cover the conductive layer. Further, an insulating coating particle [S]-82-(78) (78) 1321868 in which the conductive particles are covered with an insulating layer or a conductive particle, an insulating particle or the like may be used. When a conductive layer is formed on a polymer core material such as a hot molten metal such as solder or a plastic material, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 21, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. The disc 17 is taken up and the adhesive tape 1 is unwound (arrow E in Fig. 21). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing heads 19 disposed between the two trays 3'17, and the adhesive is rubbed. It is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel at 17°. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. On the formal connection, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a buffer. The heating and pressurization of the wiring circuit 23 is performed on the circuit board 21 by the heating and pressing head 19. In this way, the electrode 21a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 23 can be connected. -83- (79) 1321868 The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more, and the adhesive 11 used at one time. The usage will be much larger than the traditional usage. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 20A). The method of connecting the adhesive tape of the invention described in the above-mentioned items 19 to 21 can be divided into the following two types: (a) directly using the take-up reel 1 7 and replacing the number of remaining reels of the used adhesive tape 1 Adhesive tape, and a new adhesive tape and a take-up reel 17, (b) an adhesive tape having a reduced number of residual reels of the used adhesive tape 1 is used as a take-up reel, and a new adhesive is attached. Adhesive tape with less tape and fewer remnants. (b), as shown in Fig. 20A, in order to replace the disc 3a with the new adhesive sheet 3' when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, the adhesive tape of the disc 3a (adhesive material of one side) The end portion 32 of the tape end portion φ 3 〇 and the adhesive tape (other-side adhesive tape) 1 wound around the new adhesive sheet 3 is connected by a resin adhesive 64. Resin adhesive 64 series such as epoxy resin, cyanate resin, dammaramide resin, acid resin, urea resin, melamine resin, alkyd resin, acrylic wax, unsaturated polyester resin, phthalic acid Di-propyl vinegar tree - fat, crepe resin, resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin 'ketone resin, triallyallylamine cyanide resin, etc. [S1 -84- (80) 1321868 The connection of the adhesive tape 1 is as shown in Fig. 20B. The end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are made to have the starting end portion 32. The surface of the adhesive 11 is superposed on the surface of the substrate 9 of the terminal portion 30. Secondly, it is combined with the adhesive device 15 The paste machine 65 applies a paste-form resin adhesive 64 to the overlapping portion. Next, as shown in Fig. 20C, when the resin adhesive 64 is a thermosetting resin, it is combined with the adhesive device 15 The heat of the heater 66 is φ heat-hardened, and the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined. In this manner, the disk 3a can be wound around the used disk 3a. The adhesive tape 1 and the adhesive tape 1 wound around the new disk 3 are connected. Thus, the end portion 30 of the adhesive tape 1 which has been completely unwound is fixed by the resin adhesive 64, and newly installed The connection end 32 of the adhesive tape 1 is very simple. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc φ 3 is attached to the adhesive device 15. Therefore, it is not necessary to implement a new adhesive. The tape 1 is loaded to the take-up reel 17. The use of the reel 17' of the (a) directly replaces the adhesive tape of the used adhesive tape 1 with a smaller number of residual adhesive tapes into a new adhesive tape' When the new adhesive tape and the take-up reel 17 are connected, the used disc 3a When the end mark 28 of the tape 1 is exposed, the cutting is performed from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion 30 of the adhesive tape remaining on the side of the take-up reel 1 and the new adhesive pad 3 are adhered. The beginning end portion 32 of the material tape 1 is overlapped. Next, a paste-like tree-85-(81) 1321868 grease adhesive 64 is applied to the overlapping portion of the material, and heating and ultraviolet irradiation are performed depending on the type of the resin-based adhesive to be used. When the adhesive force is applied, the connection between the end portion 30 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 is carried out. Since the take-up reel 17 only winds up the substrate 9, a plurality of adhesives can be taken up. The number of plates is reduced, and the number of replacements of the take-up tray 17 is reduced, and the work efficiency is good. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 .

在從捲出機25捲出之基材（separator)上，以塗布 機2 7塗布由樹脂及導電粒子丨3混合而成之黏著劑11， 並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。 被捲取之黏著材膠帶之原始材料，以切割機33切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上 ’或者’捲取至附側板之捲軸上，將其和除濕材一起綑包 ’實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。The adhesive 11 mixed with the resin and the conductive particles 丨3 is applied onto a substrate unwound from the unwinder 25, and dried by a drying oven 29, and then wound up. Machine 3 1 takes up the original material. The original material of the adhesive tape that has been taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are mounted on the reel from both sides 'or 'rolled onto the reel of the side plate. It is packaged with the dehumidifying material 'implementation of low temperature (-5 °C ~ -1 0 °C) and shipped.

第1 9〜2 1項記載之發明並未受限於上述之實施形態 ’只要未背離第19〜21項記載之發明之要旨的範圍內， 可實施各種變形。 本實施形態時，樹脂製黏著劑6 4係以熱硬化性樹脂 爲例，然而，亦可以光硬化性樹脂取代熱硬化性樹脂，以 紫外線等之光照射實施硬化性樹脂之硬化，實施黏著材膠 帶1間之連接。 …此畤光硬化性樹脂哥採用在具有丙烯_酸基或_甲基丙^ 烯酸基之樹脂調合光聚合起動劑之組成物 '或含有芳香族 重偶氮鹽、二烯丙基碘氫基鹽、鎏鹽等光硬化劑之環氧樹 -86- [S] (82) 1321868 脂等。 又，樹脂製黏著劑亦可採用以乙烯乙酸乙稀醋樹脂或 聚烯烴樹脂爲主成分之熱金屬黏著材，例如I板狀之熱金屬 黏著材時，將板狀之熱金屬黏著劑置於黏著材膠帶1間之 重疊部份上，以加熱器66對熱金屬黏著劑進行加熱使其 熔融後，再以冷卻使熱金屬黏著劑固化’實施黏著材膠帶 1間之連接。 φ 使用於黏著材膠帶1之連接之樹脂製黏著劑’亦可從 熱硬化性樹脂 '光硬化性樹脂、及熱金屬黏著劑所構成之 群組中選取複數種來使用。 上述之實施形態時，使黏著材盤3a之黏著材膠帶1 之終端部30之基材9面、及新黏著材盤3之黏著材膠帶 1之始端部32之黏著劑11面互相重疊’並塗布樹脂製黏 著劑之熱硬化性樹脂來實施連接，然而，亦可反折黏著材 盤3a之黏著材膠帶1之終端部30，並以重疊黏著劑11 φ 面來實施兩者之黏著後，再以熱硬化性樹脂固定。 其次，針對第22〜24項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶盤及黏著裝置相關。 其次，針對第22〜24項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 -87- (83) 1321868 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。The invention described in the above is not limited to the above-described embodiments. Various modifications can be made without departing from the scope of the invention as set forth in the 19th to 21st. In the present embodiment, the resin adhesive 6 is a thermosetting resin. However, the photocurable resin may be substituted for the thermosetting resin, and the curable resin may be cured by irradiation with light such as ultraviolet rays. The connection between the tapes 1. The photocurable resin is a composition of a photopolymerization initiator which has a propylene-acid group or a methacrylic acid group, or contains an aromatic heavy azo salt or a diallyl iodide. Epoxy tree-86- [S] (82) 1321868 fat of light curing agent such as base salt or strontium salt. Further, the resin adhesive may be a hot metal adhesive mainly composed of ethylene vinyl acetate resin or a polyolefin resin, for example, a plate-shaped hot metal adhesive, and a plate-shaped hot metal adhesive is placed. On the overlapping portion of the adhesive tape 1, the hot metal adhesive is heated by the heater 66 to be melted, and then the hot metal adhesive is solidified by cooling to carry out the connection between the adhesive tapes 1. φ The resin adhesive used for the connection of the adhesive tape 1 may be selected from a group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. In the above embodiment, the surface of the base material 9 of the end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the surface of the adhesive 11 of the adhesive end portion 32 of the new adhesive sheet 3 overlap each other' The thermosetting resin coated with the resin adhesive is applied and joined. However, the end portion 30 of the adhesive tape 1 of the adhesive sheet 3a may be folded back, and the adhesion between the two may be performed by overlapping the adhesive 11 φ surface. It is then fixed with a thermosetting resin. Next, the invention described in the items 22 to 24 will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, in particular, relating to a disk-shaped adhesive tape disk and an adhesive device. . Next, the background art of the invention described in the items 22 to 24 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, and the adhesion between the -87-(83) 1321868 or the circuit board, and The electrical connection method between the electrodes of the two is made of adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m.

將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從黏著材膠帶盤捲出之黏 著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基板 等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the substrate side of the adhesive tape which is unwound from the adhesive tape is pressed against the circuit substrate by a heating and pressing head, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel.

然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩’故有無 法提高電子機器之生產效率之問題。 _ _針舆此問題，可以考慮以增加-捲取至盤之黏著材膠_帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 -88- (84) 1321868 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，第22〜24項記載之發明的目的，係在提供一 φ 種黏著材膠帶盤、及黏著裝置，可使黏著材膠帶盤之更換 更爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對第22〜24項記載之發明 之實施形態進行說明，首先，參照第22圖A〜C、第23 圖、第4圖、及第5圖，針對第22〜24項記載之發明之 第1實施形態進行說明。第22圖A〜C係第1實施形態 之黏著材膠帶盤圖，第22圖A係黏著材膠帶盤的斜視圖 ，第22圖B係第22圖A之正面圖，第22圖C係第22 φ 圖A之連結膠帶之平面圖，第23圖係黏著裝置之黏著劑 壓著步驟的槪略圖。 如第22圖A所示，本實施形態之黏著材膠帶盤A具 有複數之黏著材膠帶之捲部（以下簡稱爲捲部）2、2a， 捲部2、2a之盤3、3a上分別捲繞著黏著材膠帶1。各盤 3、3a上配設著捲軸5、及配置於黏著材膠帶1之兩寬度 側之側板7。如第23圖所示，黏著材膠帶1係由基材9、 及塗布於基材9之一側面的黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 -89- (85) 1321868 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部30、及 捲繞於另一方之捲部之黏著材膠帶（以下稱爲另一方之黏 著材膠帶）1之始端部32間，配設著用以連接兩者之連 結膠帶41。從一方之黏著材膠帶1之終端部30沿著盤3 之側板7之內側面配置著連結膠帶67，前述連結膠帶67 會卡止於側板7之上部之切口部份6 8而連接於另一方之 黏著材膠帶1之始端部32。However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, so there is a problem of improving the production efficiency of the electronic machine. _ _ 舆 舆 舆 舆 , , , 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以The width of the tape is 1~ -88- (84) 1321868 3 mm. If the number of rolls is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the items 22 to 24 is to provide a φ type of adhesive tape tray and an adhesive device, which makes it easier to replace the adhesive tape, and improves the production efficiency of the electronic device. Next, an embodiment of the invention described in the items 22 to 24 will be described with reference to the attached drawings. First, referring to Figs. 22A to AC, Fig. 23, Fig. 4, and Fig. 5, for the 22nd to 24th The first embodiment of the invention described in the section will be described. Fig. 22A to Fig. 4C are diagrams showing the adhesive tape of the first embodiment, Fig. 22A is a perspective view of the adhesive tape tray, Fig. 22B is a front view of Fig. 22, and Fig. 22 is a 22 φ Figure A is a plan view of the bonding tape, and Figure 23 is a schematic view of the adhesive pressing step of the adhesive device. As shown in Fig. 22A, the adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as rolls) 2, 2a of the adhesive tape, and the rolls 3, 3a of the rolls 2, 2a are respectively wound. Around the adhesive tape 1. Each of the disks 3, 3a is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Fig. 23, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. Among the plurality of rolled portions 2 and 2a, the end portion 30 of the adhesive-89-(85) 1321868 tape (hereinafter referred to as one adhesive tape) 1 wound around one of the rolls 2 and wound around the other side A connecting tape 41 for connecting the two is provided between the beginning end portions 32 of the adhesive tape (hereinafter referred to as the other adhesive tape) 1 of the roll portion. A connecting tape 67 is disposed from the end portion 30 of one of the adhesive tapes 1 along the inner side surface of the side plate 7 of the disk 3, and the connecting tape 67 is locked to the slit portion 68 of the upper portion of the side plate 7 to be connected to the other side. The beginning end portion 32 of the adhesive tape 1 is attached.

又，一方及另一方之黏著材膠帶1、及連結膠帶67 之連接部份，會標示著用以辨識連結膠帶67之標記69、 70，以膠帶檢測手段（發光部7 1、受光部72 )檢測到標 記69、70時，會跳過連結膠帶67部份而不對連結膠帶 67部份實施壓著。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (.延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並Moreover, the connecting portions of the adhesive tape 1 and the connecting tape 67 of one of the other and the other are marked with the marks 69 and 70 for identifying the connecting tape 67, and the tape detecting means (the light emitting portion 7 1 and the light receiving portion 72) When the marks 69, 70 are detected, the portion of the joining tape 67 is skipped without pressing the connecting tape 67 portion. The substrate 9 should be made of OPP (. Extended Polypropylene), Teflon, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and peelability of the adhesive to the different conductive material. Ester), etc., however,

φ 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 — 黏著劑11肉分散著導電省子13。導電粒子13係如-Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 '、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 -90- (86) 1321868 瓷、塑膠等高分子核材等覆蓋前述之導電層等而形成 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 屬、或塑膠等之高分子核材上形成導電層者，會具有 熱加壓或加壓而產生變形之變形性，故連接後之電極 離會縮小，連接時可增加和電路接觸之面積，而可提 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 φ 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 到很容易即可對應電極之厚度及平坦性之誤差的連接 〇 其次，針對本實施形態之黏著材膠帶盤A之使 法進行說明。如第2 3圖所示，將黏著材膠帶盤A、 取盤17裝著至黏著裝置15，經由導引銷22將一方 著材膠帶1之始端部32裝設至捲取盤17，並捲出黏 膠帶1(第23圖中之箭頭E)。其次，將黏著材膠帶 # 置於電路基板21上’利用配置於兩盤3、17間之加 壓頭19從基材9側實施黏著材膠帶1之壓接，將黏 11壓著至電路基板21。其後’將基材9捲取至捲取！ 〇 上述之壓著後（暫時連接），實施電路基板21 極及配線電路（電子構件）23之電極的定位並進行 連接。正式連接上，如第4圖所示，在壓著至電路 21上之黏著劑Π上配置配線電路（或電子構件）23 要時，可將例如聚四氟乙烯材24當做緩衝材，以加 膜粒 融金 因加 間距 问1d 沒有 可得 構件 用方 及捲 之黏 著材 1配 熱加 著劑 之電 正式 基板 ，必 壓加 -91 - (87) 1321868 壓頭19對電路基板21實施配線電路23之加熱加壓。利 用此方式，可連接電路基板21之電極21a及配線電路23 之電極23a及奁連接。 . 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑Π的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦會 φ 變多，捲繞於盤3上之黏著材膠帶1在相對較短之時間內 會被捲取至捲取盤17。 一方之黏著材膠帶1全部捲出時，連結膠帶67會脫 離切口部份68，接著，會捲出另一方之黏著材膠帶1。本 實施形態時，因爲在一方之黏著材膠帶1之終端部3 0及 另一方之黏著材膠帶1之始端部32之間，具有用以連接 兩者之連結膠帶67,故一方之黏著材膠帶1全部捲出時 ，會接著開始捲出另一方之黏著材膠帶1。因此，無需實 φ 施在一方之黏著材膠帶1之全部捲出後將新黏著材膠帶1 裝設至捲取盤17之作業，故可提高電子機器之生產效率 〇 又，如第23圖所示，黏著裝置15具有一對發光部 71及受光部72，用以實施連結膠帶67之光學檢測。用以 連接一方之黏著材膠帶1及另一方之黏著材膠帶1之兩者 …的連結膠帶6·7之爾端土，標示著黑色標記· 69、70。發光 部71會對黏著材膠帶1連續發出雷射光，受光部72則會 接收其反射光，並將檢測信號傳送至控制裝置79。受光 -92- (88) (88)1321868 部72會接收到連結膠帶67之兩端之標記69、70之反射 光，並將該檢測信號傳送至控制裝置79。 接收到檢測信號之控制裝置79，會對用以驅動黏著 裝置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅 動器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅 動器施加之脈衝數實施旋轉，使兩盤3、17以比通常速度 更快之速度移動，並使黏著材膠帶1朝捲出方向移動對應 連結膠帶67之長度的距離。 利用此方式，另一方之黏著材膠帶1會自動捲出至加 熱加壓頭19之位置，可省略以使另一方之黏著材膠帶1 之始端部32位於加熱加壓頭19之位置而捲出連結膠帶 67之作業。 又’因爲捲取盤17只會捲取基材9，故可捲取數個 黏著材膠帶盤份而減少捲取盤17之更換次數，而有良好 之作業效率。 此處，參照第5圖’針對本實施形態之黏著材膠帶盤 A之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾 燥爐29實施乾燥後，以捲取機31捲取原始材料。被捲取 之黏著材膠帶之原始材料’以切割機33切成特定寬度並 捲取至捲軸後’從兩側將側板7、7裝著於捲軸上，或者 ，捲取至附側板之捲軸上，將其和除濕材—起綑包，實施 低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 -93- (89) 1321868 其次’針對第22〜24項記載之發明之其他實施形態 進行說明’以下說明之實施形態中，和上述實施形態相同 之部份會附與相同符號並省略該部份之詳細說明，以下之 .說明係以和上述實施形態不同之點爲主。 第24圖所示之第2實施形態時，因爲連結膠帶67之 寬度T小於前後之黏著材膠帶1之寬度w，故可辨識連 結膠帶67。又，黏著裝置15上，夾著黏著材膠帶1之相 φ 對位置上配設著和第1實施形態相同之發光部及受光部。 此時，利用受光部接收透射連結膠帶6 7之寬度較狹部份 的雷射光來辨識連結膠帶67。 第25圖所示之第3實施形態時，連結膠帶67會形成 用以辨識連結膠帶67之多數孔53。此時，亦可利用受光 部接收透射連結膠帶67之孔53的雷射光來辨識連結膠帶 67 〇 第26圖所示之第4實施形態時，並未利用連結膠帶 φ 67實施黏著材膠帶1間之連接，而在一方之黏著材膠帶1 全部捲出時，捲出另一方之黏著材膠帶1使其捲附於盤 17上來實施黏著材膠帶1之更換。此時，因爲無需將新 黏著材膠帶盤裝著至黏著裝置，而只需較少之新黏著材膠 帶盤之更換作業，故可提高電子機器之生產效率。 第22〜24項記載之發明並未受限於上述之實施形態 -，-只要在未背灕第22〜24項記載之發明之-要旨的範圍內 ，可實施各種變形。 例如，上述之第1及第2實施形態時，捲部2、2a之 (90) 1321868 個數並無任何限制，而可以爲任何個數。 第1至第3實施形態係以光學方式檢測連結膠帶67 ，然而，亦可在連結膠帶67上附加磁性膠帶並以磁性感 測器來進行檢測。 其次，針對第2 5〜2 8項記載之發明進行說明。 這些發明係關於電子構件及電路基板'或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 φ 。又，係關於在將半導體元件（晶片）黏著·固定至引線 框架之固定用支持基板或引線框架之晶片、或半導體元件 載置用支持基板之半導體裝置上所使用之黏著材膠帶，尤 其是，和捲成盤狀之黏著材膠帶盤、黏著裝置、及黏著材 膠帶之連接方法相關。 其次，針對第25〜28項記載之發明之背景技術進行 說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( # 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、L0C膠帶、晶粒結著膠帶、微 BGA· CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統電極連接用黏著材膠帶之寬度爲1〜3mm程 -95- (91) (91)1321868 度，捲取至盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出之 黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基 板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來/隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無 法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶-之兩邊摻出而戒爲粗塞之原因。 - 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 -96- (92) 1321868 既存之黏著裝置。 因此，第25〜28項記載之發明的目的，係在提供一 種黏著材膠帶盤、黏著裝置、及連接方法，可使黏著材膠 帶盤之更換更爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對第25〜28項記載之發明 之實施形態進行說明，首先，參照第27圖A〜C、第28 圖、第4圖、第29圖 '及第5圖，針對第25〜28項記載 φ 之發明之第1實施形態進行說明。第27圖A〜C係第1 實施形態之黏著材膠帶盤圖，第27圖A係黏著材膠帶盤 的斜視圖，第27圖B係第27圖A之正面圖，第27圖C 係第27圖A之連接部份之剖面圖，第28圖係黏著裝置 之黏著劑壓著步驟的槪略圖，第29圖係PDP之黏著劑之 使用狀態的斜視圖。 本實施形態之黏著材膠帶盤A具有複數之黏著材膠 帶1之捲部（以下稱爲捲部）2、2a，捲部2、2a具有捲 φ 繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著捲軸 5、及配置於黏著材膠帶1之兩寬度側之側板7。如第28 圖所示，黏著材膠帶1係由基材9、及塗布於基材9之一 側面之黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部30、及 捲繞於另一方之捲部2a之黏著材膠帶（以下稱爲另一方 之黏著材膠帶）1之始端部32係以卡止具76實施連接。 卡止具76係例如剖面略呈3字形之卡止銷，使一方之黏 -97- (93) 1321868 著材膠帶1之終端部30及另一方之黏著材膠帶1之始端 部32互相重疊，將卡止銷插入此重疊部份來連接兩者。 其次，本實施形態時，連接部份74如第27圖C所示 ，以卡止具76連接終端部30及始端部32之後，將連接 部份74朝膠帶之縱向反折180度，使黏著材膠帶1覆蓋 卡止具7 6。 從強度、及構成向異導電材之黏著劑之剝離性而言， ^ 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 φ 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏著劑1 1係熱可塑性樹脂、熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹脂系 則以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表。 黏著劑11內亦可分散著導電粒子13。導電粒子13 φ 係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 · 粒子、或碳 '石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 成。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之局分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小’連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是’以高分子類做爲核材更佳，如焊錫因φ is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. — Adhesive 11 is dispersed in the conductive section 13 . The conductive particles 13 are metal particles such as -Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the foregoing materials and non-conductive glass, ceramics - 90-(86) 1321868 A polymer core material such as porcelain or plastic is formed to cover the above-mentioned conductive layer or the like, and an insulating layer covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a polymer core material such as solder or the like, or a plastic material such as plastic, the deformation is deformed by hot pressing or pressurization, so that the electrode after the connection is reduced, and the connection can be increased. The area in contact with the circuit, and can be relied upon. In particular, it is better to use a polymer as a core material. For example, the solder can be controlled to a softened state at a wide connection temperature due to the melting point of φ, and it is easy to correspond to the thickness and flatness of the electrode. Next, the method of making the adhesive tape tray A of the present embodiment will be described. As shown in Fig. 2, the adhesive tape tray A and the take-up tray 17 are attached to the adhesive device 15, and the leading end portion 32 of the one-way tape 1 is attached to the take-up reel 17 via the guide pin 22, and is wound. Adhesive tape 1 (arrow E in Fig. 23). Next, the adhesive tape # is placed on the circuit board 21, and the pressure-sensitive adhesive tape 19 disposed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the substrate 9 side to press the adhesive 11 to the circuit substrate. twenty one. Thereafter, the substrate 9 is taken up to the coiling!后 After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the wiring circuit (electronic component) 23 are positioned and connected. On the formal connection, as shown in Fig. 4, when the wiring circuit (or electronic component) 23 is placed on the adhesive 压 which is pressed onto the circuit 21, for example, the PTFE material 24 can be used as a buffer material to add The film is melted by the gap 1d. There is no available member and the adhesive material of the roll. The main substrate of the heat-adhesive is added. -91 - (87) 1321868 The indenter 19 is used to wire the circuit board 21. The heating and pressurization of the circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected to each other. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more, and the amount of the adhesive used in one use may be much larger than that. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3 is also increased by φ, and the adhesive tape 1 wound on the disk 3 is taken up to the take-up reel 17 in a relatively short period of time. When one of the adhesive tapes 1 is completely unwound, the connecting tape 67 will be separated from the slit portion 68, and then the other adhesive tape 1 will be unwound. In the present embodiment, since the connecting tape 67 for connecting the two ends of the adhesive tape 1 and the other end portion 32 of the other adhesive tape 1 are provided, the adhesive tape of one of the adhesive tapes is provided. When all of 1 is rolled out, the adhesive tape 1 of the other side is then rolled out. Therefore, it is not necessary to apply the new adhesive tape 1 to the take-up reel 17 after all of the adhesive tape 1 has been wound out, so that the production efficiency of the electronic device can be improved, as shown in Fig. 23. The adhesive device 15 has a pair of light-emitting portions 71 and a light-receiving portion 72 for performing optical detection of the connecting tape 67. The joint tape of the connecting tape 6·7 for connecting the adhesive tape 1 of one side and the adhesive tape 1 of the other one is marked with black marks 69 and 70. The light-emitting portion 71 continuously emits laser light to the adhesive tape 1, and the light-receiving portion 72 receives the reflected light and transmits the detection signal to the control device 79. The light-receiving -92-(88) (88) 1321868 portion 72 receives the reflected light of the marks 69, 70 connecting the both ends of the tape 67, and transmits the detection signal to the control device 79. The control device 79 that has received the detection signal outputs a control signal to the motors for driving the two disks 3, 17 of the adhesive device 15, and starts to output a drive pulse to the motor by the motor driver. Next, the motor rotates in accordance with the number of pulses applied by the motor driver, causing the two disks 3, 17 to move at a faster speed than the normal speed, and moving the adhesive tape 1 in the unwinding direction by the distance corresponding to the length of the connecting tape 67. In this manner, the other adhesive tape 1 is automatically unwound to the position of the heating and pressing head 19, and can be omitted so that the other end portion 32 of the adhesive tape 1 is placed at the position of the heating and pressing head 19 to be unwound. The operation of joining the tape 67. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive tape discs can be taken up to reduce the number of replacements of the take-up reel 17, and the work efficiency is good. Here, a method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 5'. On a substrate 9 which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, dried in a drying furnace 29, and then taken up by a coiler 31. material. The original material of the taken up adhesive tape is cut into a specific width by the cutter 33 and taken up to the reel. The side panels 7, 7 are attached to the reel from both sides, or are taken up to the reel of the side panel. It is bundled with the dehumidifying material and managed at a low temperature (-5 °C to -10 °C) and shipped. -93- (89) 1321868 Next, the other embodiments of the invention described in the 22nd to 24th embodiments will be described. In the embodiments described below, the same portions as the above-described embodiments will be denoted by the same reference numerals and the parts will be omitted. In the detailed description, the following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 24, since the width T of the connecting tape 67 is smaller than the width w of the adhesive tape 1 before and after, the connecting tape 67 can be recognized. Further, in the adhesive device 15, the light-emitting portion and the light-receiving portion which are the same as those in the first embodiment are disposed at positions φ with the adhesive tape 1 interposed therebetween. At this time, the light-receiving portion receives the laser light of the narrow portion of the width of the transmission connecting tape 67 to recognize the connecting tape 67. In the third embodiment shown in Fig. 25, the connecting tape 67 forms a plurality of holes 53 for identifying the connecting tape 67. At this time, the light receiving unit can receive the connecting tape 67 by receiving the laser light transmitted through the hole 53 of the connecting tape 67. When the fourth embodiment shown in Fig. 26 is used, the adhesive tape 1 is not used by the connecting tape φ 67. When the adhesive tape 1 of one of the adhesive tapes 1 is completely unwound, the other adhesive tape 1 is taken up and attached to the disk 17 to carry out the replacement of the adhesive tape 1. At this time, since the new adhesive tape is not required to be attached to the adhesive device, less replacement work of the new adhesive tape is required, so that the production efficiency of the electronic device can be improved. The invention described in the above-mentioned items 22 to 24 is not limited to the above-described embodiments - and various modifications can be made without departing from the gist of the invention described in the items 22 to 24. For example, in the first and second embodiments described above, the number of (90) 1321868 of the rolled portions 2, 2a is not limited, and may be any number. In the first to third embodiments, the connecting tape 67 is optically detected. However, a magnetic tape may be attached to the connecting tape 67 and detected by a magnetic sensor. Next, the invention described in the twenty-fifth to twenty-eighthth aspects will be described. These inventions relate to an adhesive tape φ for adhering and fixing an electronic component and a circuit board ' or a circuit board, and electrically connecting the electrodes between the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the method of connecting the disc-shaped adhesive tape, the adhesive device, and the adhesive tape. Next, the background art of the invention described in the items 25 to 28 will be described. Generally, a liquid crystal panel, a PDP (plasma display panel), an EL (#fluorescent display) panel, an electronic component such as a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Further, the adhesive tape is also applied to a lead fixing tape of a lead frame, an L0C tape, a die-bonding tape, an adhesive film such as a micro BGA/CSP, etc., and the purpose thereof is to improve the productivity and reliability of the entire semiconductor device. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the adhesive tape for the conventional electrode connection is 1 to 3 mm, -95-(91) (91), 1321868 degrees, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive side of the adhesive tape which is unwound from the self-adhesive tape is pressed against the circuit board by a heating and pressing head, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, and since the replacement of the adhesive tape is troublesome, there is a problem that the production efficiency of the electronic machine can be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive tape which is wound into a tape shape may increase, and the adhesive may be mixed from both sides of the tape to cause a thick plug. - In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will increase, and it may not be possible to use the existing adhesive device -96- (92) 1321868 Existing adhesive device. Therefore, the object of the invention described in the items 25 to 28 is to provide an adhesive tape, an adhesive device, and a joining method, which can make the replacement of the adhesive tape reel easier and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in the items 25 to 28 will be described with reference to the attached drawings. First, referring to FIGS. 27A to A, 28, 4, 29, and 5, The first embodiment of the invention of φ is described in items 25 to 28. Fig. 27A to Fig. C are diagrams showing the adhesive tape of the first embodiment, Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is a front view of Fig. 27, and Fig. 27C 27 is a cross-sectional view of the connecting portion of Fig. A, Fig. 28 is a schematic view showing the adhesive pressing step of the adhesive device, and Fig. 29 is a perspective view showing the state of use of the adhesive of the PDP. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as rolls) 2, 2a of the adhesive tape 1, and the rolls 2, 2a have a roll φ around the sheets 3, 3a of the adhesive tape 1. Each of the disks 3, 3a is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. Among the plurality of rolls 2 and 2a, the end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape") 1 wound around one of the rolls 2 and the roll wound around the other roll 2a The beginning end portion 32 of the tape (hereinafter referred to as the other adhesive tape) is connected by the locking tool 76. The locking piece 76 is, for example, a locking pin having a substantially three-shaped cross section, so that the end portion 30 of one adhesive-97-(93) 1321868 marking tape 1 and the beginning end portion 32 of the other adhesive tape 1 overlap each other. Insert the card pin into this overlapping part to connect the two. Next, in the present embodiment, as shown in FIG. 27C, the connecting portion 74 is connected to the end portion 30 and the starting end portion 32 by the locking member 76, and the connecting portion 74 is folded back 180 degrees toward the longitudinal direction of the tape to adhere. The material tape 1 covers the locking device 7 6 . From the strength and the releasability of the adhesive to the dissimilar conductive material, ^ Substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and PET treated with φ 矽 (polyethylene terephthalate) The diester) or the like is constituted, however, it is not limited thereto. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. Conductive particles 13 may also be dispersed in the adhesive 11. The conductive particles 13 φ are metal, particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon 'graphite, etc., and may be in the above-mentioned materials and/or non-conductive glass, A polymer core material such as ceramics or plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot metal such as solder or a local nuclear material such as plastic, there is deformation due to deformation due to heating, pressurization or pressurization, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use polymers as nuclear materials, such as soldering

[S J -98- (94) 1321868 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態 可得到很容易即可對應電極之厚度及平坦性之誤差的 構件。 其次，針對本實施形態之黏著材膠帶盤之使用方 行說明。如第28圖所示，將黏著材膠帶盤A、及捲 17裝著至黏著裝置15，經由導引銷22將一方之黏著 帶1之始端部32裝設至捲取盤17，並捲出黏著材膠 φ (第28圖中之箭頭E)。其次，將黏著材膠帶1配 電路基板21上，以配置於兩盤3、1 7間之加熱加壓j 從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1 至電路基板21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）2 3，可將聚 乙烯材24當做緩衝材，以加熱加壓頭1 9對電路基| 實施配線電路23之加熱加壓。利用此方式，可連接 9 基板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑11係壓著於PDP 26之 全體’故一次使用之黏著劑11之使用量明顯遠大於 上之使用量。因此，黏著材膠帶1之使用量亦會變多 繞於盤3、3a上之黏著材膠帶1在相對較短之時間內 捲取至捲取盤17。 本實施形態時，一方之黏著材膠帶1全部捲出時 接部份74會脫離切口 75，接著，會捲出另一方之黏 ，而 連接 法進 取盤 材膠 帶1 置於 i 19 壓著 之黏 四氟 X 21 電路 PDP 周圍 傳統 ，捲 會被 ，連 著材 -99- (95) 1321868 膠帶1 (第27圖B )。本實施形態時，係以卡ll 接一方之黏著材膠帶1之終端部30及另一方之 帶1之始端部32，一方之黏著材膠帶1全部捲 .接著開始捲出另一方之黏著材膠帶1。因此，無 一方之黏著材膠帶1之全部捲出後將新黏著材膠 至捲取盤17之作業，故可提高電子機器之生產 ，連接部份74上因以黏著材膠帶1覆蓋卡止具 φ 觀良好，同時，可防止連接部份· 74之卡止具76 材膠帶1而傷害到黏著材膠帶1。 又，如第28圖所示，黏著裝置15具有當做 測感測器4 7使用之厚度檢測感測器，實施連接吾 光學檢測，使加熱加壓頭1 9跳過連接部份74。 著材膠帶1及另一方之黏著材膠帶1之連接部佐 度，如第27圖C所示，會大於黏著材膠帶1之 檢測不同厚度來辨識連接部份74。厚度檢測感測 φ 隨時檢測黏著材膠帶1之厚度，並將檢測信號傳 裝置79。 接收到檢測信號之控制裝置79，會對用以 裝置1 5之兩盤3、1 7之馬達輸出控制信號，利 動器開始對馬達輸出驅動脈衝。其次，馬達會對 動器施加之脈衝數實施旋轉，使兩盤3、17以比 -更快之速度旋轉「並使黏著材膠帶1朝捲出方向 連接部份74之搬運方向之長度的特定距離。 利用此方式，另一方之黏著材膠帶1會移動 二具76連 黏著材膠 出時，會 需實施在 帶1裝設 效率。又 76，故外 接觸黏著 連接部檢 1H 分74之 一方之黏 卜74的厚 厚度，以 丨器47會 送至控制 驅動黏著 用馬達驅 應馬達驅 通常速度 碜動對應 至加熱加 -100- (96) 1321868 壓頭19之位置，故可防止一方及另一方之黏著材膠帶1 之連接部份74移至加熱加壓頭19之位置並執行壓著動作 之問題。又，至連接部份41通過加熱加壓頭19爲止，會 自動地將一方之黏著材膠帶1捲取至捲取盤17，故可省 略捲取之麻煩。 又，利用厚度檢測感測器47辨識連接部份74之前端 部4 1 a及後端部4 1 b，並只避開連接部份74，則可有效利 φ 用黏著材膠帶1。 又，因爲捲取盤17只會捲取基材9，故可捲取數個 黏著材膠帶盤份而減少捲取盤17之更換次數，而有良好 之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布樹脂及導電粒子13混合之黏著劑，並以乾燥 # 爐29實施乾燥後，以捲取機31捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機33切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，將其和 除濕材一起綑包，實施低溫（-5°C〜-l〇°C )之管理並進 行出貨。 其次，針對第25〜28項記載之發明之其他實施形態 進行說明，和上述實施形態相同之部份會附與相同符號並 省略該部份之詳細說明，以下之說明係以和上述實施形態 不同之點爲主。 -101 - (97) 1321868 第30圖所示之第2實施形態時，未使用具有複數捲 部2、2a之黏著材膠帶盤A，而使用具有1個捲部之黏著 材膠帶盤2c。此時，黏著材膠帶1係捲繞於捲取盤17, 當一方之黏著材膠帶1露出結束標記28時，爲了將一方 之黏著材膠帶盤2b更換至新黏著材膠帶盤2c，而連接一 方之黏著材膠帶1之終端部30、及另一方之黏著材膠帶i 之始端部32。[S J -98- (94) 1321868 There is no melting point, and it can be controlled to a softened state at a wide connection temperature. A member which is easy to correspond to the thickness and flatness of the electrode can be obtained. Next, the use of the adhesive tape tray of the present embodiment will be described. As shown in Fig. 28, the adhesive tape tray A and the roll 17 are attached to the adhesive device 15, and the starting end portion 32 of one of the adhesive tapes 1 is attached to the take-up reel 17 via the guide pin 22, and is unwound. Adhesive glue φ (arrow E in Figure 28). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by heating and pressing j disposed between the two trays 3 and 17 to bond the adhesive 1 1 to the circuit substrate. twenty one. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polyethylene material 24 can be used as a buffer material to heat the pressing head 19. The heating and pressurization of the wiring circuit 23 is performed on the circuit base. In this manner, the electrode 21a of the substrate 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, the adhesive portion 11 is pressed against the entire portion of the PDP 26 by the connection portion of the adhesive tape 1 of the present embodiment. Therefore, the amount of the adhesive 11 used at one time is significantly larger than that of the upper portion. Usage amount. Therefore, the amount of the adhesive tape 1 used is also increased. The adhesive tape 1 wound around the discs 3, 3a is taken up to the take-up reel 17 in a relatively short period of time. In this embodiment, when the adhesive tape 1 of one of the adhesive tapes 1 is completely unwound, the joint portion 74 will be separated from the slit 75, and then the other side will be unrolled, and the adhesive tape 1 of the joining method is placed on the adhesive of i 19 Conventional for the PTFE X 21 circuit PDP, the coil will be attached to the -99- (95) 1321868 tape 1 (Fig. 27B). In the present embodiment, the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the other tape 1 are joined by the card ll, and one of the adhesive tapes 1 is completely wound. Then the other adhesive tape is rolled up. 1. Therefore, when all of the adhesive tape 1 is unwound, the new adhesive is glued to the take-up reel 17, so that the production of the electronic device can be improved, and the connecting portion 74 is covered with the adhesive tape 1 The φ view is good, and at the same time, the adhesive tape 1 of the connecting portion 74 can be prevented from being damaged by the adhesive tape 1 . Further, as shown in Fig. 28, the adhering means 15 has a thickness detecting sensor which is used as the measuring sensor 47, and performs optical inspection to cause the heating pressurizing head 19 to skip the connecting portion 74. The joint portion of the tape 1 and the other adhesive tape 1 as shown in Fig. 27C will be larger than the thickness of the adhesive tape 1 to identify the joint portion 74. Thickness detection sensing φ The thickness of the adhesive tape 1 is detected at any time, and the detection signal is transmitted to the device 79. The control means 79, which receives the detection signal, outputs a control signal to the motors of the two disks 3, 17 of the device 15, and the actuator starts to output a drive pulse to the motor. Next, the number of pulses applied by the motor to the actuator is rotated so that the two discs 3, 17 are rotated at a faster speed than "the faster distance of the direction in which the adhesive tape 1 is attached to the unwinding direction portion 74". In this way, when the adhesive tape 1 of the other side will move two 76 joint adhesives, it will need to be installed in the belt 1 efficiency. 76, so the external contact adhesive joint inspection 1H points 74 The thick thickness of the adhesive bush 74 is sent to the control drive adhesive motor to drive the motor drive to drive the normal speed corresponding to the position of the heating plus -100- (96) 1321868 indenter 19, thus preventing one side and the other The connecting portion 74 of the adhesive tape 1 on one side is moved to the position where the pressing head 19 is heated and the pressing operation is performed. Further, until the connecting portion 41 is heated by the pressing head 19, one of the electrodes is automatically adhered. The material tape 1 is taken up to the take-up reel 17, so that the trouble of winding up can be omitted. Further, the thickness detecting sensor 47 recognizes the front end portion 4 1 a and the rear end portion 4 1 b of the connecting portion 74, and only avoids Open the connection part 74, it can effectively use φ to adhere Tape 1. Moreover, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive tape discs can be taken up to reduce the number of replacements of the take-up reel 17, and there is good work efficiency. Fig. 5 is a view showing a method of manufacturing the adhesive tape 1 of the present embodiment. On a substrate 9 which is unwound from the winder 25, an adhesive which is a mixture of a resin and conductive particles 13 is applied by a coater 27. After drying in the drying oven #29, the original material is taken up by the coiler 31. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 33 and taken up to the reel, from both sides. The side plates 7 and 7 are mounted on a reel, and are packaged together with the dehumidifying material, and are managed at a low temperature (-5 ° C to -l ° ° C) and shipped. Next, for the items 25 to 28 The other embodiments of the invention will be described with the same reference numerals, and the detailed description of the parts will be omitted. The following description is mainly different from the above embodiment. -101 - ( 97) 1321868 In the second embodiment shown in Fig. 30, An adhesive tape tray 2c having a single roll portion is used, and an adhesive tape 2c having one roll portion is used. At this time, the adhesive tape 1 is wound around the take-up reel 17, when one of the adhesive sheets When the tape 1 is exposed to the end mark 28, in order to replace one adhesive tape 2b to the new adhesive tape 2c, the end portion 30 of one of the adhesive tapes 1 and the other end of the adhesive tape i are connected. 32.

此時，亦利用連接部檢測手段之厚度檢測感測器77 檢測連接部份74，而使加熱加壓頭1 9避開連接部份74。 第25〜28項記載之發明並未受限於上述之實施形態 ，只要在未背離第25〜28項記載之發明之要旨的範圍內 ，可實施各種變形。 例如，上述之第1及第2實施形態時，用以連接黏著 材膠帶1間之卡止具76並未限定爲卡止銷，其方法亦可 以橫剖面略呈3字形之可彈性變形之夾子來夾住並固定兩 者之重疊部份，或者，亦可以橫剖面略呈3字形之金屬片 夾住兩者之重疊部份，並從重疊部份之兩面壓扁夾持片來 連接兩者。 第1及第2實施形態係利用厚度檢測感測器47檢測 連接部份74之厚度來辨識連接部份74，然而，並不限於 此，亦可利用透射率檢測感測器來辨識連接部份74、或 利用CCD攝影機使連接部份之表面_呈現於監]視畫面並以 圖素之濃淡比較來檢測連接部份。 第31圖A、第31圖B、第32圖A〜C係用以實施引 -102- (98) 1321868 線框架之固定用支持基板、半導體元件載置用支持基板、 或引線框架之晶片和半導體元件之連接之黏著材膠帶當中 ’將半導體元件黏著·固定於引線框架之固定用支持基板 及引線框架之LOC ( Lead on Chip)構造之1實例。 實施厚度50//m之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25 之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏 % 著材膠帶，而可得到第31圖B所示之LOC構造之半導體 裝置。將第31圖A所示之黏著材膠帶，以第32圖A〜C 所示之黏著裝置之冲切模具87 (公模（凸部）95、母模 (凹部）96)冲切成細長形，例如，在厚度〇.2mm之鐵-鎳合金製引線框架上，以400t、3MPa之壓力、3秒鐘之 加壓實施壓著，形成〇.2mm間隔、0.2mm寬度之內引線 ，製成附有半導體用黏著膜之引線框架。其次，在其他步 驟實施350 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半 # 導體元件壓著至此附有半導體用黏著膜之引線框架之黏著 劑層面，其後，以金線實施引線框架及半導體元件之絲焊 ，以連續成形使用環氧樹脂成形材料等密封材實施密封， 得到第31圖B所示之半導體裝置。第31圖A、B中，81 係以黏著材膠帶冲切所得之半導體用黏著膜，82係半導 體元件，83係引線框架’ 84係密封材，85係焊絲，86係 匯流排條。第32圖A、B、C係黏著裝置，第32圖A、B 中，8 7係冲切模具，8 8係引線框架搬運部，6 1係黏著劑 膠帶冲切貼附部，90係加熱器部，9 1係黏著材膠帶盤（ -103- (99) 1321868 黏著材膠帶捲出部），92係黏著材膠帶（半導體用黏著 膜），93係黏著材膠帶捲出滾輪。又，第32圖c中，94 係黏著材膠帶（半導體用黏著膜），95係公模（凸部）At this time, the thickness detecting sensor 77 of the connecting portion detecting means also detects the connecting portion 74, so that the heating pressurizing head 19 avoids the connecting portion 74. The invention described in the twenty-fifth to the twenty-eighthth aspects is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first and second embodiments described above, the locking device 76 for connecting the adhesive tape 1 is not limited to the locking pin, and the method may also be a three-shaped elastically deformable clip having a transverse cross section. To clamp and fix the overlapping portions of the two, or to sandwich the overlapping portions of the three-shaped metal piece in a cross section, and to flatten the clamping pieces from both sides of the overlapping portion to connect the two . In the first and second embodiments, the thickness detecting portion 47 detects the thickness of the connecting portion 74 to identify the connecting portion 74. However, the present invention is not limited thereto, and the transmittance detecting sensor may be used to identify the connecting portion. 74. Or use a CCD camera to make the surface of the connected portion appear on the screen and detect the connected portion by comparing the shades of the pixels. 31A, 31B, and 32A to C are used to implement a fixing support substrate, a semiconductor element mounting support substrate, or a lead frame wafer of the lead-102-(98) 1321868 wire frame. In the adhesive tape to which the semiconductor element is bonded, an example of a LOC (Lead on Chip) structure in which a semiconductor element is adhered and fixed to a fixing support substrate of a lead frame and a lead frame. An adhesive layer 80 having a polyaldimine adhesive layer having a thickness of 25 on both sides of the support film 78 having a thickness of 50/m is used as shown in Fig. 31A. The viscous component of the composition is a tape, and the semiconductor device of the LOC structure shown in Fig. 31B can be obtained. The adhesive tape shown in Fig. 31A is punched into a slender shape by a punching die 87 (male die (protrusion) 95, female die (recess) 96) of the adhesive device shown in Figs. 32A to C. For example, on a lead frame of an iron-nickel alloy having a thickness of 22 mm, pressing is performed at a pressure of 400 t, 3 MPa, and pressure for 3 seconds to form a lead having a width of 0.2 mm and a width of 0.2 mm. A lead frame with an adhesive film for semiconductors. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied, and the semi-conductor element is pressed against the adhesive layer of the lead frame with the adhesive film for semiconductor, and thereafter, gold is applied. The lead frame and the wire bonding of the semiconductor element are subjected to sealing by continuous molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device shown in FIG. 31B. In Figs. 31A and AB, 81 is an adhesive film for semiconductor obtained by die-bonding tape, 82-series semiconductor element, 83-type lead frame '84-series sealing material, 85-series welding wire, and 86-series bus bar. Fig. 32A, B, and C are adhesion devices, and in Fig. 32, A and B, 8 7 is a punching die, 8 8 is a lead frame conveying portion, and 6 1 is an adhesive tape punching and attaching portion, and 90 is heated. The parts are 9 1 series adhesive tape ( -103- (99) 1321868 adhesive tape roll-out part), 92 type adhesive tape (semiconductor adhesive film), 93-series adhesive tape roll-out roller. In addition, in Fig. 32, the 94-series adhesive tape (adhesive film for semiconductor), 95-type male mold (convex)

’ 96係母模（凹部）’ 97係膜壓板。黏著材膠帶92會從 黏著材膠帶盤（黏著材膠帶捲出部）91連續捲出，並在 黏著材膠帶冲切貼附部8 9冲切成細長形且黏著至引線框 架之引線部份’將其視爲附有半導體用黏著膜之引線框架 而從引線框架搬運部搬出。冲切所得之黏著材膠帶則從黏 著材膠帶捲出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體兀件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接·黏著。黏著材膠帶只單純用 於黏著•固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。'96-series master (concave portion)' 97-series membrane platen. The adhesive tape 92 is continuously unwound from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport unit. The adhesive tape obtained by die cutting is taken out from the roller 93 by the adhesive tape. In the same manner as described above, the semiconductor element is bonded to the semiconductor chip mounting support substrate by an adhesive tape. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame were carried out in the same manner. Adhesive tape is only used for adhesion. When it is fixed, it can be contacted between electrodes or electrically connected with conductive particles. The adhesive to be used for the purpose is sometimes adhered to by the support film. Composition of the agent.

其次，針對第29〜34項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著劑膠帶 ，尤其是，和捲成盤狀之黏著劑膠帶、黏著劑膠帶之製造 方法、及黏著劑膠帶之壓著方法相關。 其次，針對第29〜34項記載之發明之背景技術進行 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 [S] -104- (100) 1321868 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲5 0m程度，黏著劑膠帶被從盤捲出並 將黏著劑壓著至電路基板等後，即不再使用。 φ 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，上述之電子機器之製造工廠之捲繞著黏著 劑膠帶之盤的更換更爲頻繁，因爲新盤之更換十分麻煩， 故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 • 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膜的壓力會升高，而可能從 黏著劑膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著劑膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，第29〜34項記載之發明的目的，係在提供一 種黏著劑膠帶、黏著劑膠帶之製造方法、及黏著劑膠帶之 -105- 1321868 (ίου 壓著方法，可在無需增加黏著劑膠帶之捲數的情形下增加 黏著劑量。Next, the invention described in the items 29 to 34 will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, in particular, and an adhesive tape or an adhesive tape which is wound into a disk shape. The manufacturing method and the pressing method of the adhesive tape are related. Next, in the background art of the invention described in the items 29 to 34, generally, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display panel), or a bare chip package, and a circuit board are used. S] -104- (100) 1321868 Or adhesive bonding between circuit boards and electrical connection between the electrodes, using adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., reuse. φ However, in recent years, with the increase in the size of the panel image such as the PDP, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the disk on which the adhesive tape is wound in the above-mentioned manufacturing facility of the electronic device is more frequent, and the replacement of the new disk is troublesome, so that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is The stenosis is 1~3mm. If the number of rolls is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive film wound into a tape shape may increase, and may bleed out from both sides of the adhesive tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the items 29 to 34 is to provide an adhesive tape, a method for producing an adhesive tape, and an adhesive tape-105- 1321868 (pressure-removing method, without adding an adhesive tape) In the case of the number of rolls, the amount of adhesive is increased.

其次，參照附錄圖面，針對第29〜34項記載之發明 之實施形態進行說明，首先，參照第3 3圖A、B、第3圖 、第4圖、第34圖、第5圖、第35圖，針對第29〜34 項記載之發明之第1實施形態進行說明。第3 3圖A及B 係黏著劑膠帶圖，第33圖A係捲繞著黏著劑膠帶之盤之 斜視圖，第33圖B係第33圖A之A-A剖面圖，第34圖 係PDP之黏著劑之使用狀態的斜視圖，第3 5圖係在基材 上塗布黏著劑之步驟的剖面圖。 本實施形態之黏著劑膠帶1係捲繞於盤3，盤3上配 設著捲軸5及配置於黏著劑膠帶1之兩寬度側之側板7。 本實施形態時，黏著劑膠帶1之長度約爲50m、寬度W 約爲1 0mm。 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 φ 劑1 1所構成，基材9上以具有間隔之方式配置著每條寬 度爲0.5mm之5條黏著劑11。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 …黏著劑1 1係採用熱可塑性樹脂、熱硬·化性樹1旨、…或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 -106- (102) 1321868 硬化性樹脂系則以環氧樹脂系、乙烯基醋 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導Next, an embodiment of the invention described in the items 29 to 34 will be described with reference to the attached drawings. First, reference is made to Fig. 3, Fig. 3, Fig. 3, Fig. 3, Fig. 4, Fig. 34, Fig. 5, and Fig. Fig. 35 is a view showing a first embodiment of the invention described in the items 29 to 34. Fig. 3 3A and B are adhesive tape diagrams, Fig. 33A is a perspective view of a disk wrapped with an adhesive tape, Fig. 33B is a sectional view of AA of Fig. 33A, and Fig. 34 is a PDP An oblique view of the state of use of the adhesive, and Fig. 35 is a cross-sectional view showing a step of applying an adhesive to the substrate. The adhesive tape 1 of the present embodiment is wound around a disk 3, and the disk 3 is provided with a reel 5 and side plates 7 disposed on both width sides of the adhesive tape 1. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 10 mm. The adhesive tape 1 is composed of a base material 9 and an adhesive φ agent 11 coated on the base material 9. The base material 9 is provided with five adhesives 11 each having a width of 0.5 mm. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 1 1 is made of a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the heat-106-(102) 1321868 curable resin type is represented by an epoxy resin type, a vinyl vine resin type, and an anthracene resin type. Conductive particles 13 are dispersed in the adhesive 11. guide

Au、 Ag、 Pt、 Ni、 Cu、 W、 Sb、 Sn、焊 、或碳、石墨等，亦可在前述之物及/或 、陶瓷、塑膠等高分子核材等覆蓋前述導 此外’亦可應用以絕緣層覆蓋前述導電粒 φ子、或倂用導電粒子及絕緣粒子等。在焊 屬、或塑膠等之高分子核材上形成導電層 熱加壓或加壓而產生變形之變形性，故連 離會縮小，連接時可增加和電路接觸之面 賴性。尤其是，以高分子類做爲核材更佳 融點，在廣泛之連接溫度下亦可控制於軟 到很容易即可對應電極之厚度及平坦性之 〇 B 其次，針對本實施形態之黏著劑膠帶 說明。將黏著劑膠帶1之盤3、及空盤] 置15，將捲繞於盤3之黏著劑膠帶1之 17,並捲出黏著劑膠帶1 (第3圖中之箭 在電路基板21上配置黏著劑膠帶1 ’以配 間之加熱加壓頭1 9從基材9側實施將黏 接，將1條份之黏著劑1 1壓著至電路基 餘黏著劑11和基材9 一起捲取至空盤17 上述之壓著後（暫時連接）’實施電 系樹脂 '壓克力 【電粒子1 3係如 錫等之金屬粒子 非導電性之玻璃 電層等來形成。 子之絕緣覆膜粒 錫等之熱熔融金 者，會具有因加 接後之電極間距 積，而可提高信 ，如焊錫因沒有 化狀態，而可得 誤差的連接構件 之使用方法進行 17裝著至黏著裝 前端裝設至空盤 頭E )。其次， !置於兩盤3、1 7 著劑膠帶1之壓 板。其後，將殘 〇 路基板21之電 -107- (103) 1321868 極及配線電路（電子構件）23之電極的定位並進行正式 連接。正式連接上，在壓著於電路基板21上之黏著劑11 上配置配線電路（或電子構件）23，必要時，可將例如聚 四氟乙烯材24當做緩衝材，以加熱加壓頭19對電路基板 21實施配線電路23之加熱加壓。利用此方式，可連接電 路基板21之電極21a及配線電路23之電極23a。Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc. may also cover the above-mentioned guides in the above-mentioned materials and/or polymer core materials such as ceramics and plastics. The conductive particles φ, the conductive particles, the insulating particles, and the like are covered with an insulating layer. When a conductive layer is formed on a polymer core material such as a solder or a plastic, which is deformed by heat or pressure, the connection is reduced, and the contact with the circuit can be increased during connection. In particular, the use of polymers as a core material is a better melting point, and can be controlled to a softness and easy to be able to correspond to the thickness and flatness of the electrode at a wide connection temperature. Agent tape instructions. The disc 3 of the adhesive tape 1 and the empty tray are placed 15, and the adhesive tape 1 of the disc 3 is wound, and the adhesive tape 1 is unwound (the arrow in Fig. 3 is arranged on the circuit board 21). The adhesive tape 1' is adhered from the substrate 9 side by the heating and pressing head of the compartment, and the adhesive 1 1 is pressed to the circuit base adhesive 11 and the substrate 9 is taken up together. After the pressure is applied to the empty tray 17 (temporarily connected), 'electro-resin resin' is applied. [Electroparticles 13 are formed by a non-conductive glass electric layer such as tin or the like. In the case of hot-melting gold such as granule tin, the electrode pitch product after the addition is added, and the letter can be improved. For example, if the solder is not in a state of being used, the use of the connecting member which can obtain an error is carried out 17 to the front end of the adhesive. Installed to the empty pan head E). Next, put the pressure plate on the two tapes 3 and 17 of the adhesive tape 1. Thereafter, the electrodes - 107- (103) 1321868 of the residual circuit substrate 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. On the formal connection, a wiring circuit (or electronic component) 23 is disposed on the adhesive 11 pressed against the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a cushioning material to heat the pressing head 19 The circuit board 21 performs heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected.

如第3 4圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑11之使用量會遠大於傳統之使用量。因 此，捲繞於盤3上之黏著劑膠帶1之使用量亦會變多，捲 繞於盤3上之黏著劑膠帶1在相對較短之時間內會被捲取 至空盤17，盤3會變成空的。 當盤3變成空的時，分別使盤3及盤17逆轉，此時 ，會以空的盤3捲取，而使黏著劑膠帶1朝相反方向移動 (第3圖中之箭頭F )。 如此，每1條黏著劑1 1都會依序改變黏著劑膠帶1 之捲取方向（E、F)，而將黏著劑11壓著至電路基板21 此處，參照第5圖及第3 5圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機27塗布由樹脂及導電粒子_ 13混合而成之黏著劑Γ1 ，並以乾燥爐29實施乾燥後，以捲取機31捲取原始材料 。如第35圖所示，相對於基材9之10mm寬度配置著5 -108- C S ] (104) 1321868 個塗布機27，塗布10mm寬度之5條黏著劑1 1。被捲取 之黏著劑膠帶之原始材料，以切割機33切成特定寬度並 捲取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者 ，捲取至附側板之捲軸上，將其和除濕材一起綑包，實施 低溫（-5°C〜- l〇°C )之管理並進行出貨。 其次，針對第29〜34項記載之發明之其他實施形態 進行說明，和上述實施形態相同之部份會附與相同符號並 φ 省略該部份之詳細說明，以下之說明係以和上述實施形態 不同之點爲主。 第3 6圖A〜C所示之第2實施形態時，黏著劑膠帶1 之基材之單面全面上塗布著寬度W之黏著劑，利用形成 於基材之縱向的縫隙35將黏著劑隔離成寬度W方向上之 複數條。此第2實施形態之黏著劑膠帶1時，縫隙3 5應 在將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓著至 電路基板21之前一瞬間形成》此時，亦可在黏著裝置15 # 之盤裝著部附近（如第3圖之S所示）裝設工作面而在捲 出之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在 第5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙 者捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機 3 1捲取之前一瞬間形成縫隙者。 將第2實施形態之黏著劑膠帶1使用於黏著裝置15 時，和第1實施形態相同，以縫隙3 5隔離之黏著劑會逐 條以加熱加壓頭1 9從基材9側實施壓著，而如第3 6圖A 、：B、C所示，依序逐條使用。 -109- (105) 1321868 此第2實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到複數條之黏 著劑11，十分容易製造。As shown in Fig. 34, the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment is adhered to the entire periphery of the PDP, and the amount of the adhesive 11 used at one time is much larger than that of the conventional use. . Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up to the empty tray 17 in a relatively short period of time, the tray 3 Will become empty. When the disk 3 becomes empty, the disk 3 and the disk 17 are respectively reversed. At this time, the empty disk 3 is taken up, and the adhesive tape 1 is moved in the opposite direction (arrow F in Fig. 3). Thus, each of the adhesives 1 1 sequentially changes the winding direction (E, F) of the adhesive tape 1, and the adhesive 11 is pressed against the circuit substrate 21, referring to Figs. 5 and 35. A method of manufacturing the adhesive tape 1 of the present embodiment will be described. On a substrate 9 which is unwound from the unwinder 25, an adhesive Γ1 obtained by mixing a resin and conductive particles _13 is applied by a coater 27, and dried in a drying furnace 29, followed by a coiler. 31 take the original material. As shown in Fig. 35, 5 - 108 - C S ] (104) 1321868 coaters 27 were disposed with a width of 10 mm from the substrate 9, and 5 adhesives 11 of a width of 10 mm were applied. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. It is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to - l 〇 ° C) and shipped. In the following, the other embodiments of the invention are described in the above-mentioned embodiments, and the same reference numerals will be given to the same parts as in the above-mentioned embodiments, and the detailed description of the parts will be omitted. The difference is mainly. In the second embodiment shown in Figs. 36 to A to C, the adhesive of the adhesive tape 1 is entirely coated with the adhesive of the width W on one side, and the adhesive is separated by the slit 35 formed in the longitudinal direction of the substrate. A plurality of strips in the width W direction. In the adhesive tape 1 of the second embodiment, the slit 35 should be formed immediately after the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21 at this time. The working surface is installed near the disk mounting portion of the adhesive device 15 (shown as S in FIG. 3), and a gap 3 5 is formed on the adhesive 1 1 of the adhesive tape 1 which is rolled out, and may also be in the fifth If the gap formed in the refurbishing step of the adhesive tape shown in the figure is taken up to the disc, the gap may be formed immediately after the drying at the coating step and immediately before the coiler 31 is taken up. When the adhesive tape 1 of the second embodiment is used in the adhesive device 15, as in the first embodiment, the adhesive which is separated by the slits 35 is pressed from the base material 9 side by the heating and pressing head 1 by one. And as shown in Figure 3A, A, B, and C, they are used one by one. -109- (105) 1321868 In the second embodiment, it is only necessary to form the slits 3 5 by the adhesive on the substrate obtained by the same procedure as the conventional one, thereby obtaining a plurality of adhesives 11 which are very easy to manufacture. .

第37圖A〜C所示之第3實施形態時，基材9之全 面塗布著黏著劑Π (第37圖A)，基材9及黏著劑11 之寬度W，係和上述實施形態相同之5〜1 000mm。其次 ，使用時亦和第1實施形態相同，將其裝著至黏著裝置 15，將從盤3捲出之黏著劑膠帶1配置於電路基板21上 ，對黏著劑膠帶1之寬度W方向之部份黏著劑（1條份） 實施加熱加壓（第37圖B)，降低該部份之凝聚力，只 有加熱加壓之部份黏著劑會從基材剝離而壓著至電路基板 21 (第 37 圖 C)。In the third embodiment shown in Figs. 37A to A, the substrate 9 is entirely coated with an adhesive Π (Fig. 37A), and the width W of the substrate 9 and the adhesive 11 is the same as that of the above embodiment. 5 to 1 000 mm. Then, in the same manner as in the first embodiment, it is attached to the adhesive device 15, and the adhesive tape 1 wound from the disk 3 is placed on the circuit board 21, and the width of the adhesive tape 1 in the W direction is applied. Part of the adhesive (1 part) is heated and pressurized (Fig. 37B) to reduce the cohesive force of the part. Only the part of the adhesive which is heated and pressurized is peeled off from the substrate and pressed to the circuit substrate 21 (37th) Figure C).

此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線，實施加熱加壓部份之全部黏著劑應爲呈現軟化流動（ 簡易指標爲1 000泊以下）而未開始黏著劑之硬化反應、 φ 或低位狀態（簡易指標爲反應率20%以下），加熱溫度應 對應使用之黏著劑系來進行選擇。 此第3實施形態時，黏著劑11在使用時，只有在寬 度W當中之1條份會軟化流動化且被壓著至基板電路， 故和上述之實施形態相同，只要利用黏著劑膠帶1之盤3 及空盤的正轉及逆轉，即可使用複數次份。 -_ 又’如上述之實施形態在黏著劑-丨」形成縫_隙3纟，_無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑11即可，故黏著劑膠帶之製造十分容易》 -110- (106) 1321868 第38圖A〜C所示之第4實施形態，係第1實施形 態之黏著劑膠帶的其他製造方法，在塗布於基材9a上之 黏著劑1 1上形成縫隙98後（第38圖A )，以使黏著劑 1 1夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另 —方之基材9b (第38圖B)。其次，剝離一方及另一方 之基材9a、9b，各基材9a、9b上會以間隔1條之式配置 著黏著劑條1 1 a、1 1 b。此第4實施形態時，爲了在一方 0 及另一方之基材9a、9b上交互配置黏著劑條11a、lib， 可從一方之基材9a或9b側以間隔1條之方式實施黏著劑 條1 1 a、1 1 b之加熱加壓，而將黏著劑條1 1 a、1 1 b以間隔 1條之方式配置於各基材9a、9b上。 第29〜34項記載之發明並未受限於上述之實施形態 ，只要在未背離第29〜34項記載之發明之要旨的範圍內 ，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著.劑1 1內未分 # 散著導電粒子1 3之絕緣性黏著劑。 上述之實施形態時，形成於基材9上之黏著劑的條數 可以爲任意條，至少爲2條以上即可。 其次，針對第3 5〜4 1項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 、黏著劑膠帶之製造方法、及黏著劑膠帶之壓著方法。 其次，針對第3 5〜4 1項記載之發明之背景技術進行 說明。 -111 - (107) 1321868 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 .方法，係採用黏著劑膠帶》 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 φ 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至 鲁 電路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠 帶並實施黏著劑之壓著，因係針對電路基板之四周，故會 將黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積（一邊之尺寸）亦會增大，一次使用 之黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大 ，黏著劑之使用量亦增加。因此，上述之電子機器之製造 φ 工廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之 β 更換十分麻煩，故有無法提高電子機器之生產效率之問題 〇 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致箱取散亂。又，若增_多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 [S] 112 (108) 1321868 因此，第35〜41項記載之發明的目的，係在提供— 種黏著劑膠帶、黏著劑膠帶之製造方法、及黏著劑膠帶之 壓著方法，可在未增加黏著劑膠帶之捲數的情形下增加黏 著劑量。 其次，參照附錄圖面，針對第35〜41項記載之發明 之實施形態進行說明，首先，參照第39圖A、B、第40 圖、第34圖、第5圖、第41圖，針對第35〜41項記載 φ 之發明之第1實施形態進行說明。第39圖A及B係黏著 劑膠帶圖，第3 9圖A係捲繞著黏著劑膠帶之盤之斜視圖 ，第3 9圖B係從從黏著劑側觀看第3 9圖A之黏著劑膠 帶時之平面圖，第40圖係黏著裝置之黏著劑壓著步驟的 斜視圖。 本實施形態之黏著劑膠帶1係捲繞於盤3上者，盤3 上配設著捲軸5、及配置於黏著劑膠帶1之兩側的側板7 。本實施形態時，黏著劑膠帶1之長度約爲50m，寬度W # 則爲和電路基板之一邊大致相同尺寸之約1 500mm。 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑1 1所構成，基材9上之膠帶之寬度方向上，以等間隔 方式配置著1條寬度爲〇.5mm之黏著劑1 1。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 -113- (109) 1321868 熱可塑性樹脂及熱硬化，桂樹脂之混合物、或熱金屬系。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表， 又’熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙嫌基 酯系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 φ 瓷、塑膠等高分子核材等覆蓋前述導電層而形成者。此外 ’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、 或倂用導電粒子及絕緣粒子等。在焊錫等之熱溶融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路接觸之面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點 ，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 φ 容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶1之使用方法進 行說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著 裝置15，將捲繞於盤3上之黏著劑膠帶1之前端裝設空 盤17並捲出黏著劑膠帶1(第40圖中之箭頭E)。其次 ，在電路基板21上配置黏著劑膠帶1，以配置於兩盤3、 --1 7間之加熱加壓頭1 9從基材_·9惻實施黏著劑膠帶T之壓 接，將1條份之黏著劑11壓著至黏著劑膠帶之寬度方向 上之電路基板之一邊，只有該條份之黏著劑Π會被捲取 -114- (110) 1321868 至空盤1 7。 其次，將電路基板21旋轉約90度，使電路基板21 之鄰邊位於黏著劑膠帶1之寬度方向上，利用加熱加壓頭 19將黏著劑11壓著至電路基板21之另一邊。如此，將 電路基板21旋轉約90度並壓著黏著劑11，可將黏著劑 11壓著至電路基板21之四周。 上述壓著後（暫時連接）’實施電路基板21之電極 φ 及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上，將黏著劑Η壓著至電路基板21之四周 後，在黏著劑1 1上配置配線電路（或電子構件）23，必 要時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加 壓頭19對電路基板21實施配線電路23之加熱加壓（參 照第4圖）。利用此方式，可連接固定電路基板21之電 極21a及配線電路23之電極23a。 如第34圖所示，利用本實施形態之黏著劑膠帶1之 φ PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑11之使用量會遠大於傳統之使用量。然 而，因爲黏著劑膠帶1之寬度W和電路基板21之一邊之 長度Η大致相等，即使和黏著劑膠帶1之寬度W較大之 傳統者相同之捲數，其黏著劑量亦遠多於傳統之物，故盤 之更換次數遠少於傳統之物。 此處，參照第5圖及第41圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 -115- (111) 1321868 布機27塗布由樹脂及導電粒子13混合而成之黏著劑u ，並以乾燥爐29實施乾燥後，以捲取機31捲取原始材料 。塗布機27會左右移動，以等間隔在基材9上塗布條狀 黏著劑。被捲取之黏著劑膠帶之原始材料，以切割機33 切成特定寬度並捲取至捲軸後，從兩側將側板7、7裝著 於捲軸上，或者，捲取至附側板之捲軸上，將其和除濕材 一起綑包，實施低溫（-5 °C〜-1 〇 °C )之管理並進行出貨At this time, a cohesive force reduction line is formed along the side line of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (a simple index of 1 000 poise or less) without starting the hardening of the adhesive. Reaction, φ or low state (simple indicator is 20% or less of reaction rate), heating temperature should be selected according to the adhesive system used. In the third embodiment, when the adhesive 11 is used, only one of the widths W is softened and fluidized and pressed against the substrate circuit. Therefore, as in the above embodiment, the adhesive tape 1 is used. The normal rotation and reversal of the disc 3 and the empty disc can be used in multiple copies. -_ Further, as in the above embodiment, the adhesive_丨3 is formed in the adhesive-丨, and _ need not be divided into a plurality of strips, and the adhesive 11 can be completely applied to one side of the wider substrate. Therefore, the adhesive tape is easy to manufacture. -110- (106) 1321868 The fourth embodiment shown in Figs. 38A to AC is another method for producing the adhesive tape according to the first embodiment, which is applied to a substrate. After the gap 98 is formed on the adhesive 1 1 on the layer 9a (Fig. 38A), the other side of the adhesive 1 1 is attached to the adhesive 1 1 so as to sandwich the adhesive 11 between the substrates 9a and 9b. Material 9b (Fig. 38B). Next, the base materials 9a and 9b of one of the other and the other are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals of one. In the fourth embodiment, in order to alternately dispose the adhesive strips 11a and 11b on one of the base materials 9a and 9b, the adhesive strips can be applied from one side of the base material 9a or 9b at intervals of one. 1 1 a and 1 1 b are heated and pressurized, and the adhesive strips 1 1 a and 1 1 b are placed on the respective base materials 9a and 9b at intervals of one. The invention described in the 29th to 34th aspects is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive agent 1 may be used. In the above embodiment, the number of the adhesives formed on the substrate 9 may be any number of at least two or more. Next, the invention described in the third to fifth aspects will be described. These inventions relate to an adhesive tape for fixing an electronic component, a circuit board, or a circuit board, and an electrical connection between electrodes, a method of manufacturing an adhesive tape, and a method of pressing an adhesive tape. Next, the background art of the invention described in the third to fifth aspects will be described. -111 - (107) 1321868 In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board or a circuit board are adhered and fixed, and For the electrical connection between the electrodes of the two methods, an adhesive tape is used. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the φ disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit board, the adhesive tape is pulled along one side of the circuit board and the adhesive is pressed, because the adhesive is pressed around the circuit substrate. It is placed around the circuit board. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, because of the expansion of the use of the adhesive, the amount of the adhesive is also increased. Therefore, in the manufacture of the above-mentioned electronic device, the replacement of the disk on which the adhesive tape is wound is more frequent, because the β replacement of the disk is very troublesome, and there is a problem that the production efficiency of the electronic device cannot be improved. Consider increasing the number of rolls of adhesive tape taken up to the disk to increase the amount of adhesive per disk to reduce the frequency of replacement of the disk. However, because the tape width of the adhesive tape is narrower than 1 to 3 mm, Increasing the number of rolls may cause the box to be scattered. Further, if the number of rolls is increased by _, the pressure applied to the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. [S] 112 (108) 1321868 Therefore, the object of the invention described in the 35th to 41st is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, which are not increased. The adhesive dose is increased in the case of the number of adhesive tapes. Next, an embodiment of the invention described in the 35th to 41st embodiments will be described with reference to the drawings. First, referring to FIGS. 39A, B, 40, 34, 5, and 41, The first embodiment of the invention of φ of 35 to 41 will be described. Fig. 39A and Fig. B are adhesive tape drawings, Fig. 39 Fig. A is a perspective view of the disk with the adhesive tape wound, and Fig. 39B is the adhesive of Fig. 39 from the adhesive side. The plan view of the tape, and the 40th view is an oblique view of the adhesive pressing step of the adhesive device. The adhesive tape 1 of the present embodiment is wound around the disk 3. The disk 3 is provided with a reel 5 and side plates 7 disposed on both sides of the adhesive tape 1. In the present embodiment, the adhesive tape 1 has a length of about 50 m, and the width W # is about 1,500 mm which is substantially the same size as one side of the circuit board. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. The width of the tape on the substrate 9 is arranged at equal intervals with a width of 〇.5 mm. Adhesive 1 1. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, or a -113- (109) 1321868 thermoplastic resin and a thermosetting resin, a mixture of a lauric resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the 'thermosetting resin type is an epoxy resin type, an acrylic type, an ethyl phthalate type resin type, and an anthracene resin type. representative. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramic φ porcelain. A polymer core material such as plastic is formed to cover the conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a polymer material such as a hot-melt metal such as solder or a plastic material such as plastic, deformation due to deformation due to heating, pressurization, or pressurization is caused, so that the distance between electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material. For example, since the solder has no melting point, it can be controlled to a softened state at a wide connection temperature, and a φ can be easily obtained to correspond to the thickness and flatness of the electrode. The connecting member of the error. Next, a method of using the adhesive tape 1 of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15, and the empty tray 17 is attached to the front end of the adhesive tape 1 wound on the disc 3 and the adhesive tape 1 is unwound (Fig. 40) Arrow E). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3 and -17 is pressure-bonded from the substrate _·9 , to the adhesive tape T. The adhesive 11 of the strip is pressed to one side of the circuit substrate in the width direction of the adhesive tape, and only the adhesive of the strip is taken up from -114-(110) 1321868 to the empty tray 17. Next, the circuit board 21 is rotated by about 90 degrees so that the adjacent side of the circuit board 21 is positioned in the width direction of the adhesive tape 1, and the adhesive 11 is pressed against the other side of the circuit board 21 by the heating and pressing head 19. Thus, by rotating the circuit board 21 by about 90 degrees and pressing the adhesive 11, the adhesive 11 can be pressed to the periphery of the circuit board 21. After the pressing (temporary connection), the electrodes φ of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. After the adhesive is pressed onto the periphery of the circuit board 21 on the main connection, the wiring circuit (or electronic member) 23 is placed on the adhesive 1 1 , and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The circuit board 21 is heated and pressurized by the heating and pressing head 19 (see FIG. 4). In this manner, the electrode 21a of the fixed circuit substrate 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 34, the connection portion of the φ PDP 26 of the adhesive tape 1 of the present embodiment adheres to the entire periphery of the PDP, and the amount of the adhesive 11 used at one time is much larger than that of the conventional use. . However, since the width W of the adhesive tape 1 and the length 之一 of one side of the circuit substrate 21 are substantially equal, even if the number of windings is the same as that of the conventional one in which the width W of the adhesive tape 1 is large, the adhesive amount is much larger than that of the conventional one. Things, so the number of replacements is far less than the traditional things. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Figs. 5 and 41. The adhesive u mixed with the resin and the conductive particles 13 is applied onto a substrate 9 which is unwound from the unwinding machine 25 by a coating-115-(111) 1321868 cloth machine 27, and is implemented in a drying furnace 29. After drying, the original material is taken up by the coiler 31. The coater 27 is moved left and right to apply a strip of adhesive on the substrate 9 at equal intervals. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. , it is bundled with the dehumidifying material, and the low temperature (-5 °C~-1 〇 °C) is managed and shipped.

其次，針對第3 5〜4 1項記載之發明之其他實施形態 進行說明，和上述實施形態相同之部份會附與相同符號並 省略該部份之詳細說明，以下之說明係以和上述實施形態 不同之點爲主。In the following, the other embodiments of the invention described in the third to fifth embodiments will be described, and the same reference numerals will be given to the same parts, and the detailed description of the parts will be omitted. The difference in shape is dominant.

第41圖所示之第2實施形態時，黏著裝置15上有2 處裝著至黏著劑膠帶1，以互相垂直之方式裝設一方之黏 著劑膠帶1及另一方之黏著劑膠帶1。其次’一方之黏著 劑膠帶丨將黏著劑11壓著至電路基板21之相對縱邊N 上（第1步驟），另一方之黏著劑膠帶1則將黏著劑Η 壓著至相對橫邊Μ上（第2步驟）’ 2個步驟即可將黏著 劑壓著至電路基板21之四周。此第2實施形態時’在第 1步驟及第2步驟之間無需旋轉電路基板21之方向’可 將第1步驟中載置之電路基板21直接移至弟2步驟’故 可實現黏著劑之自動壓著，此外’亦可提高怍業效率。此 時，亦可將電路基板21載置於搬運帶而實現自動搬運。 第42圖Α〜C所示之第3實施形態時’基材之單面 [S1 -116- (112) 1321868 全面上會塗布寬度W之黏著劑，利用形成於基材之 W方向上之縫隙35，寬度W方向上將黏著劑分隔成 條。此第3實施形態之黏著劑膠帶1時，縫隙3 5應 於將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓 電路基板21之前一瞬間。此時，亦可在黏著裝置15 裝著部附近（如第40圖之S所示）裝設工作面而在 之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將 φ 5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫 捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取I 捲取之前一瞬間形成縫隙者。又，無論何種實施形態 作面亦可爲在黏著劑板1之寬度W方向往返移動者。 又，將第3實施形態之黏著劑膠帶1使用於黏著 1 5時，和第1實施形態相同，以縫隙3 5隔離之黏著 逐條以加熱加壓頭從基材9側實施壓著，而從前端側 逐條使用。 # 此第3實施形態時，只需在以和傳統相同之步驟 到之基材上之黏著劑形成縫隙3 5，即可得到配設於 方向之複數條黏著劑11，十分容易製造。 第43圖A〜C所示之第4實施形態時，係在基 之單面全面塗布黏著劑11(第43圖A)，基材9及 劑1 1之寬度W和上述實施形態相同，係和電路基板 邊長度大致相同之尺寸。其次，使用時係以和第1實 態相同之方式裝著，對黏著劑膠帶1之寬度W方向 份黏著劑（1條份）實施加熱加壓（第43圖B )，降 寬度 複數 形成 著至 之盤 捲出 在第 隙者 I 3 1 ，工 裝置 劑會 依序 所得 寬度 材9 黏著 之一 施形 之部 低該 -117- (113) (113)In the second embodiment shown in Fig. 41, the adhesive tape 15 is attached to the adhesive tape 1 at two places, and one adhesive tape 1 and the other adhesive tape 1 are attached to each other perpendicularly. Next, the adhesive tape 11 of one side presses the adhesive 11 against the opposite longitudinal side N of the circuit board 21 (step 1), and the adhesive tape 1 of the other side presses the adhesive to the opposite lateral side. (Second Step) 'The adhesive can be pressed to the periphery of the circuit board 21 in two steps. In the second embodiment, the direction of the circuit board 21 is not required to be rotated between the first step and the second step. The circuit board 21 placed in the first step can be directly moved to the second step, so that the adhesive can be realized. Automatically press, in addition, 'can also improve the efficiency of the industry. At this time, the circuit board 21 can be placed on the conveyance belt to realize automatic conveyance. In the third embodiment shown in FIGS. 42A to C, the single side of the substrate [S1-116-(112) 1321868 is coated with a width W adhesive, and the gap formed in the W direction of the substrate is used. 35. The adhesive is divided into strips in the width W direction. In the adhesive tape 1 of the third embodiment, the slit 35 is applied immediately after the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the mounting portion of the adhesive device 15 (as shown by S in FIG. 40) to form a slit 3 5 on the adhesive 1 1 of the adhesive tape 1, or φ 5 In the refurbishing step of the adhesive tape shown in the figure, the seam is taken up to the disc, and the gap may be formed immediately after the drying at the coating step and immediately before the coiling of the coiling I. Further, in any embodiment, the surface may be reciprocated in the width W direction of the adhesive sheet 1. Moreover, when the adhesive tape 1 of the third embodiment is used for the adhesion 15 as in the first embodiment, the adhesion is separated by the slits 35, and the pressure is applied from the substrate 9 side by the heating and pressing head. Use one by one from the front end side. In the third embodiment, it is only necessary to form the slits 35 by the adhesive on the substrate which is the same as the conventional one, and a plurality of adhesives 11 disposed in the direction can be obtained, which is very easy to manufacture. In the fourth embodiment shown in Figs. 43A to AC, the adhesive 11 (FIG. 43A) is entirely applied to one side of the base, and the width W of the substrate 9 and the agent 1 is the same as that of the above embodiment. The size is approximately the same as the length of the side of the circuit board. Next, when it is used, it is attached in the same manner as in the first embodiment, and the adhesive (1 part) of the width W direction of the adhesive tape 1 is heated and pressurized (Fig. 43B), and the width reduction is formed plural. When the coil is rolled out in the gap I 3 1 , the workpiece will be sequentially obtained. The width of the material 9 is adhered to the lower part of the shape -117-(113) (113)

1321868 部份之凝聚力，只有實施加熱加壓之部份的黏著劑 材分離並壓著至電路基板21 (第43圖C)。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚 線，加熱加壓部份之全部黏著劑應爲呈現軟化流動 指標爲1 000泊以下）而未開始黏著劑之硬化反應 位狀態（簡易指標爲反應率20%以下），加熱溫度 使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，會 寬度W方向上之1條份軟化流動化並壓著至基板電 又，如上述之實施形態在黏著劑1 1形成縫隙 需分成複數條來配設，而只需在較寬之基材的單面 布黏著劑11即可，故黏著劑膠帶之製造十分容易。 第44圖A〜C所示之第5實施形態，係第1 態之黏著劑膠帶1之其他製造方法，在塗布於基材 之黏著劑1 1上形成縫隙9 8後（第44圖A )，以 劑11夾於基材9a、9b之間之方式，在黏著劑11 另一方之基材9b (第44圖B)。其次，剝離一方 方之基材9a、9b，各基材9a、9b上會以間隔1條 配置著黏著劑條1 1 a、1 1 b。此第5實施形態時， 一方及另一方之基材9a、9b上交互配置黏著劑條 1 lb，亦可從一方之基材9a或9b側以間隔1條之 -施黏著劑條1 l a、1 l b之加熱加_壓，-而將黏著-劑條 1 lb依序貼附至各基材9a、9b。 第35〜41項記載之發明並未受限於上述之實 會從基 力降低 (簡易 、或低 應對應 逐條使 :路。 35，無 全面塗 實施形 9a上 使黏著 上貼附 及另一 之方式 爲了在 11a、 方式實 1 1 a、 施形態 -118- (114) 1321868 ’只要在未背離第35〜41項記載之發明之要旨的範圍內 ，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 其次，針對第42〜46項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 φ 盒、及利用黏著劑膠帶盒之黏著劑壓著方法。 其次，針對第42〜46項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開2001 -284005號公報，係記載著將在基材上 # 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至 電路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠 帶並實施黏著劑之壓著，因係針對電路基板之四周，故會 將黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積（一邊之尺寸）亦會增大，一次使用 之黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大 -119- (115) 1321868 ’黏著劑之使用量亦增加。因此，上述之電子機器之 工廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲 更換十分麻煩，故有無法提高電子機器之生產效率之問 〇 _ 針對此問題，可以考慮以增加捲取至盤之黏著劑膠 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換 率’然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1 φ 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，第42〜46項記載之發明的目的，係在提供 種黏著劑膠帶盒、及利用黏著劑膠帶盒之黏著劑壓著方 ，可在未增加黏著劑膠帶之捲數的情形下增加黏著劑量 且盤之更換更爲簡易。 其次，參照添附圖面，針對第42〜46項記載之發 φ 之實施形態進行說明，首先，參照第4 5圖A、B、第 圖、第47圖、第4圖、第34圖、及第48圖，針對第 〜46項記載之發明之第1實施形態進行說明。爲了說 上之方便，針對黏著劑膠帶配置2條黏著劑時進行說明 然而，亦可形成複數條。第45圖A及B係第42〜46 記載之發明之第1實施形態之黏著劑膠帶盒圖’第45 A係黏著劑膠帶盒之斜視圖，第45圖B係第45圖_ A A-A切剖面圖，第46圖係第45圖A及B所不之膠帶 之盤裝設狀態的剖面圖，第47圖係黏著裝置之黏著劑 造 之 題 市 頻 能 法 > 明 46 42 明 項 圖 之 盒 壓 -120- (116) 1321868 著步驟的正面圖，第48圖係黏著劑膠帶盒之製造方法的 步驟圖。 本實施形態之黏著劑膠帶盒1〇〇之主要構成係一方之 盤3'另一方之盤17、以及收容前述盤之殼體99，一方 之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之另一端9a 則固定於另一方之盤17。 殼體99之一側會形成開口 1 1，可從此開口 1 1拉出 φ 黏著劑膠帶1。又，開口 1 1之兩側則配設著用以導引黏 著劑膠帶1之移動的導引件3 1、3 1。 殼體99係由半殼體99a、99b嵌合而成，配設於黏著 裝置27(後述）上之滑軸17(參照第46圖）嵌插於一方 及另一方之盤3、5上，而嵌合於各盤3、5。 此處，參照第46圖針對各盤3、5、及各盤3、5及 殻體99之嵌合進行說明。各盤3、5之內緣側會形成可嵌 合黏著裝置2 7之滑軸1 7的嵌合條1 9，而外圍側則會形 Φ 成以可旋轉之方式嵌合於殼體99之突部7c的嵌合溝21 〇 如第45圖B所示，黏著劑膠帶1之基材9之單面上 ，在寬度方向上會塗布著2條並排之黏著劑11a、lib。2 條黏著劑1 1 a、1 1 b間會有間隔。 本實施形態時，黏著劑膠帶1之長度約爲50m，寬度 W則約爲4mm。各條黏著劑11a、lib之寬度約爲1.2mm 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， -121 - (117) 1321868 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或1321868 Part of the cohesive force, only the adhesive agent that is heated and pressurized is separated and pressed onto the circuit substrate 21 (Fig. 43C). At this time, a coalescing line is formed along the side line of the heating and pressing head 19, and all the adhesives in the heated and pressurized portion should have a softening flow index of 1 000 poise or less) without starting the hardening reaction state of the adhesive ( The simple indicator is a reaction rate of 20% or less. The heating temperature is selected by using an adhesive system. In the fourth embodiment, when the adhesive 1 1 is used, one portion of the width W direction is softened and fluidized and pressed against the substrate. Further, in the above embodiment, the gap formed in the adhesive 1 1 is divided into plural numbers. The strips are provided, and it is only necessary to apply the adhesive 11 on the single side of the wider substrate, so that the adhesive tape is easy to manufacture. The fifth embodiment shown in Figs. 44A to AC is another manufacturing method of the adhesive tape 1 of the first aspect, after the slit 9 8 is formed on the adhesive 1 1 applied to the substrate (Fig. 44A). The substrate 11 is sandwiched between the substrates 9a and 9b so as to be on the other substrate 9b of the adhesive 11 (Fig. 44B). Next, the base materials 9a and 9b are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals. In the fifth embodiment, the adhesive strips 11b are alternately disposed on one of the other base materials 9a and 9b, and the adhesive strips 1a may be applied from one side of the base material 9a or 9b. 1 lb of heat is added to the pressure, and the adhesive-stick strips 1 lb are sequentially attached to the respective substrates 9a, 9b. The inventions described in items 35 to 41 are not limited to the above-mentioned facts, which are reduced from the base force (simple or low-corresponding to one by one: road. 35, no full-coating form 9a is attached to the adhesive and another In one embodiment, various modifications can be made in the range of 11a, the mode 1 1 a, and the mode -118-(114) 1321868', without departing from the gist of the invention described in the 35th to 41st. In the embodiment, the insulating adhesive of the conductive particles 13 may not be dispersed in the adhesive 1 1. Next, the invention described in the items 42 to 46 will be described. The invention relates to an electronic component and a circuit board, or An adhesive tape φ box for bonding between circuit boards and an electrical connection between electrodes, and an adhesive pressing method using an adhesive tape cassette. Next, the background of the invention described in items 42 to 46 Description of the technology. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board or a circuit board are adhered and fixed. In the method of electrically connecting the electrodes between the two, an adhesive tape is used. Japanese Laid-Open Patent Publication No. 2001-284005 describes the use of an adhesive tape coated with an adhesive on a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit substrate, the adhesive is pulled along one side of the circuit substrate. The tape is pressed against the adhesive, and the adhesive is applied to the periphery of the circuit board because it is applied around the circuit board. However, in recent years, with the enlargement of the panel image of the PDP, the adhesion of the circuit board The area (the size of one side) will also increase, and the amount of the adhesive used at one time will also increase. Also, because the use of the adhesive is expanded -119-(115) 1321868 'the amount of the adhesive is also increased. Therefore, the above In the factory of the electronic machine, the replacement of the disk with the adhesive tape is more frequent, because the replacement is very troublesome, so there is a problem that the production efficiency of the electronic device cannot be improved _ for this problem, Consider increasing the number of rolls of adhesive glue that is taken up to the disk to increase the adhesion amount per disk to reduce the replacement rate of the disk. However, because the tape width of the adhesive tape is a narrower 1 φ 3 mm, Increasing the number of rolls may cause the roll to be scattered. Moreover, if the number of rolls is increased, the pressure applied to the tape-like adhesive tape may increase, and the adhesive may ooze out from both sides of the tape to cause blockage. The purpose of the invention described in the items 42 to 46 is to provide an adhesive tape cassette and an adhesive for adhering the adhesive tape cassette, and to increase the adhesive dose without increasing the number of adhesive tapes. Further, the replacement of the disk is simpler. Next, the embodiment of the hair φ described in the items 42 to 46 will be described with reference to the drawings. First, referring to Fig. 45, A, B, Fig. 47, Fig. 4, 34, and 48, the first embodiment of the invention described in the item "46" will be described. For the sake of convenience, it is explained that two adhesives are disposed for the adhesive tape. However, a plurality of strips may be formed. Fig. 45 is a perspective view of the adhesive tape cassette of the first embodiment of the invention according to the first embodiment of the invention, and the 45th drawing of the adhesive tape cassette of the 45th embodiment is shown in Fig. 45 and Fig. 45B. Sectional view, Fig. 46 is a sectional view of the state in which the tape of the tape is not shown in Fig. 45 and Fig. 47, and Fig. 47 is a diagram of the adhesive material of the adhesive device. The box pressure is -120- (116) 1321868. The front view of the step, and the 48th drawing is a step diagram of the manufacturing method of the adhesive tape cassette. The main component of the adhesive tape cassette 1 of the present embodiment is a disk 17 of the other disk 3' and a case 99 for accommodating the disk, and the adhesive tape 1 is wound around one of the disks 3, and the adhesive is applied. The other end 9a of the tape 1 is fixed to the other disk 17. An opening 1 1 is formed on one side of the casing 99, from which the φ adhesive tape 1 can be pulled out. Further, guide members 31, 31 for guiding the movement of the adhesive tape 1 are disposed on both sides of the opening 1 1. The casing 99 is fitted by the half casings 99a and 99b, and the sliding shaft 17 (see FIG. 46) disposed on the bonding device 27 (described later) is inserted into one and the other of the disks 3 and 5. It is fitted to each of the discs 3, 5. Here, the fitting of each of the disks 3, 5, and the respective disks 3, 5 and the casing 99 will be described with reference to Fig. 46. On the inner edge side of each of the discs 3, 5, a fitting strip 179 for fitting the sliding shaft 17 of the adhesive device 27 is formed, and the peripheral side is shaped to be rotatably fitted to the housing 99. The fitting groove 21 of the projection 7c is as shown in Fig. 45B. On one surface of the base material 9 of the adhesive tape 1, two adjacent adhesives 11a and 11b are applied in the width direction. There will be a gap between the two adhesives 1 1 a and 1 1 b. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm. The width of each of the adhesives 11a and 11b is about 1.2 mm. From the strength and the peeling property of the adhesive to the electrically conductive material, -121 - (117) 1321868 The substrate 9 should be made of OPP (extended polypropylene). It is composed of polytetrafluoroethylene or ruthenium-treated PET (polyethylene terephthalate), but is not limited thereto. Adhesive 1 1 is made of thermoplastic resin, thermosetting resin, or

熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ，熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基酯 系樹脂系、及矽樹脂系爲代表。A mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic type, a vinyl ester type resin type, and an anthracene resin type. .

黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt ' Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此外 ，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、 或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路接觸之面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，焊如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶盒100之使用方 法進行說明。如第47圖所示，將黏著劑膠帶盒1 00裝著 至黏著裝置27。黏著裝置27以具有間隔之方式配設著盒 用之滑軸17、17(參照第46圖），使滑軸17、17卡合 -122- ] (118) 1321868 於黏著劑膠帶盒100之各盤3、5。因此，黏著劑膠帶盒 100之裝著只需單觸即可完成，而無需實施傳統上將捲繞 於盤之黏著劑膠帶1之另一端9a裝設至空盤之作業等。 其次，從黏著劑膠帶盒1〇〇拉出黏著劑膠帶1，穿過 黏著裝置27之導引件31、31。 其次，驅動黏著裝置27之滑軸17捲出黏著劑膠帶1 (第47圖之箭頭E方向），將黏著劑膠帶1配置於電路 φ 基板2 1上，以加熱加壓頭1 9從基材9側實施黏著劑膠帶 1之壓接，寬度方向之一側上的1條份黏著劑1 1 a被壓著 至電路基板21之一邊，殘餘之1條黏著劑lib及基材9 會被捲取至另一方之盤17。如此，可將黏著劑11a壓著 至電路基板21之四周。 其次，在捲繞於一方之盤3之黏著劑膠帶1全部捲出 後，將黏著劑膠帶盒100拆下並以反向裝著，重複上述之 步驟。黏著劑膠帶上形成2條以上之黏著劑時，可改變寬 φ 度方向之位置依序或以間隔方式實施壓著。 上述壓著後（暫時連接），實施電路基板21之電極 33a及配線電路（電子構件）37之電極37a的定位並進行 正式連接。正式連接上，在將黏著劑11a壓著至電路基板 21之四周後，在黏著劑11a上配置配線電路（或電子構 件）3 7，必要時，可將例如聚四氟乙烯材3 9當做緩衝材 ，以加熱加壓頭19對電路基板21實施配線電路23之加 熱加壓（參照第4圖）。利用此方式，可連接固定電路基 板21之電極33a及配線電路23之電極37a。 -123- (119) 1321868 如第3 4圖所示，利用本實施形態之黏著劑膠帶盒 100實施黏著之PDP 26之連接部份，在本實施形態中係 會黏著於PDP 26之周圍全體，一次使用之黏著劑11的使 .用量會遠大於傳統上之使用量。然而，因爲黏著劑膠帶1 之寬度W方向上配置著2條黏著劑11a、lib，即使爲和 傳統相同之捲數，其黏著劑量可爲傳統之2倍，故可減少 盒之更換次數。 φ 又，黏著劑膠帶1係採用盒1之型式，故更換、處理 、及裝著都十分容易，而具有良好之作業性。 此處，參照第48圖，針對本實施形態之黏著劑膠帶 盒100之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機2 8塗布由樹脂及導電性粒子3 0混合而成之黏著劑 1 1，並以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材 料。塗布機28會在基材9上塗布多數條黏著劑。被捲取 φ 之黏著劑膠帶之原始材料，整修步驟時，以切割機33切 成特定寬度（2條黏著劑條之寬度）並捲取至盤3後，以 夾於半殼體99a、99b之間的方式嵌合盤3及空盤5，製 成黏著劑膠帶盒1〇〇。 將黏著劑膠帶盒1 00和除濕材一起綑包，實施低溫 (-5°C〜- l〇°C )之管理並進行出貨。 •其次，針對第42〜46項記載之發明之其他實施形態 進行說明，以下說明之實施形態中，和上述實施形態相同 之部份會附與相同符號並省略該部份之詳細說明，以下之 -124- (120) 1321868 說明係以和上述實施形態不同之點爲主。 第49圖所7Γ；之第2實施形態時，係一次即將黏著劑 11壓著至電路基板21之一邊全體者，黏著裝置27上配 設著可從黏著劑膠帶盒1〇〇拉出很長之黏著劑膠帶1的導 引件1 〇 1。此第2實施形態時，因係一次即將黏著劑壓著 至電路基板21之一邊全體，而有良好之作業效率。 第50圖所示之第3實施形態時，在基材9之單面全 φ 面塗布寬度W之黏著劑11，並利用縫隙102將黏著劑分 隔成2條。此第3實施形態之黏著劑膠帶1時，縫隙1 02 應形成於將黏著劑膠帶盒100裝著至黏著裝置27後、將 黏著劑膠帶1壓著至電路基板21之前一瞬間。此時，亦 可在黏著裝置27之盒裝著部附近（如第47圖之S所示） 裝設工作面而在捲出之黏著劑膠帶1之黏著劑11上形成 縫隙102，亦可將第48圖所示之黏著劑膠帶之製造時之 整修步驟中形成縫隙者捲取至盤3者，亦可在塗工步驟乾 φ 燥後，以捲取機3 1捲取之前一瞬間形成縫隙1 02者。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材9上之黏著劑1 1形成縫隙1 G2，即可得到2條 黏著劑11a、lib，十分容易製造。 第51圖A及B所示之第4實施形態時，基材9之單 面全面塗布著黏著劑11 (第51圖A)，將收容此黏著劑 膠帶1之黏著劑膠帶盒1 00以和第1實施形態相同之方式 裝著至黏著裝置27，對黏著劑膠帶1之寬度W方向之部 份黏著劑1 1 ( 1條份）實施加熱加壓，降低該部份之凝聚 -125- (121) (121)1321868 力，只有加熱加壓之部份黏著劑11a會從基材9剝離而壓 著至電路基板21(第51圖B)。 此時，會沿著加熱加壓頭19之周圍形成凝聚力降低 線103 (第51圖A)，實施加熱加壓部份之全部黏著劑 應爲呈現軟化流動（簡易指標爲1 〇〇〇泊以下）而未開始 黏著劑之硬化反應、或低位狀態（簡易指標爲反應率20% 以下），加熱溫度應對應使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，只有寬度 W方向之1條份25a會軟化流動化而被壓著至基板電路。 其次，針對第47〜49項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板同 間之黏著固疋及兩者之電極間之電性連接的黏者材膠帶， 尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對第47〜49項記載之發明之背景技術進行 說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲Γ〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 -126- (122) 1321868 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 φ 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 # 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此’第47〜49項記載之發明的目的，係在提供一 種黏著材膠帶，可使黏著材盤之更換較爲簡單，而提高電 -127- (123) 1321868 子機器之生產效率。 其次，參照附錄圖面，針對第47〜49項記載之發明 之實施形態進行說明。The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt 'Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. The polymer core or the like is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles, insulating particles, or the like may be applied. When a conductive layer is formed on a polymer core material such as a hot molten metal such as solder or a plastic material, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is more preferable to use a polymer as a core material, and soldering such as solder has no melting point, and can be controlled to a softened state at a wide connection temperature, and it is easy to obtain the thickness and flatness of the electrode. The connecting member of the error. Next, a method of using the adhesive tape cartridge 100 of the present embodiment will be described. As shown in Fig. 47, the adhesive tape cassette 100 is attached to the adhesive device 27. The adhesive device 27 is provided with the slide shafts 17 and 17 for the cartridges (see FIG. 46) with a space therebetween, and the slide shafts 17 and 17 are engaged with each of the adhesive tape cartridges 100-122-] (118) 1321868. Disks 3, 5. Therefore, the attachment of the adhesive tape cartridge 100 can be completed by a single touch without performing the operation of conventionally attaching the other end 9a of the adhesive tape 1 wound around the disk to the empty tray. Next, the adhesive tape 1 is pulled out from the adhesive tape cartridge 1 and passed through the guide members 31, 31 of the adhesive device 27. Next, the sliding shaft 17 of the driving adhesive device 27 is rolled out of the adhesive tape 1 (the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the circuit φ substrate 2 1 to heat the pressing head 19 from the substrate. The adhesive tape 1 is crimped on the 9 side, and one adhesive 1 1 a on one side in the width direction is pressed to one side of the circuit substrate 21, and the remaining adhesive lib and substrate 9 are rolled. Take the disk 17 of the other party. Thus, the adhesive 11a can be pressed to the periphery of the circuit board 21. Next, after the adhesive tape 1 wound around one of the trays 3 is completely unwound, the adhesive tape cartridge 100 is detached and loaded in the reverse direction, and the above steps are repeated. When two or more adhesives are formed on the adhesive tape, the position in the direction of the width φ can be changed sequentially or in a spaced manner. After the pressing (temporary connection), the electrode 33a of the circuit board 21 and the electrode 37a of the wiring circuit (electronic component) 37 are positioned and connected. On the formal connection, after the adhesive 11a is pressed to the periphery of the circuit board 21, a wiring circuit (or an electronic component) 3 is disposed on the adhesive 11a, and if necessary, for example, a polytetrafluoroethylene material 3 9 can be used as a buffer. The material is heated and pressurized by the heating circuit 19 to the circuit board 21 (see FIG. 4). In this manner, the electrode 33a of the fixed circuit board 21 and the electrode 37a of the wiring circuit 23 can be connected. -123- (119) 1321868 As shown in Fig. 4, the connection portion of the PDP 26 adhered by the adhesive tape cartridge 100 of the present embodiment is adhered to the entire periphery of the PDP 26 in the present embodiment. The amount of the adhesive 11 used at one time is much larger than the conventional use. However, since the adhesive tape 1 is provided with two adhesives 11a, lib in the width W direction, even if it is the same number as the conventional one, the adhesive dose can be twice as long as the conventional one, so that the number of replacement of the cartridge can be reduced. φ Also, the adhesive tape 1 is in the form of the cartridge 1, so it is easy to replace, handle, and load, and has good workability. Here, a method of manufacturing the adhesive tape cartridge 100 of the present embodiment will be described with reference to Fig. 48. The substrate 11 which is obtained by mixing the resin and the conductive particles 30 is applied to a separator 23 which is taken up from the unwinder 25, and dried by a drying furnace 29, and then dried. The coiler 3 1 takes up the original material. The coater 28 coats a plurality of adhesives on the substrate 9. The original material of the adhesive tape which is taken up by φ is cut into a specific width (the width of two adhesive strips) by the cutter 33 during the refurbishing step and taken up to the tray 3 to be sandwiched between the half-shells 99a, 99b. Between the fitting disc 3 and the empty disc 5, an adhesive tape cassette 1 is formed. The adhesive tape cassette 100 is bundled with the dehumidifying material, and the low temperature (-5 ° C to - l 〇 ° C ) is managed and shipped. In the following, the other embodiments of the invention described in the above-mentioned embodiments of the present invention are described in the above-mentioned embodiments, and the same reference numerals are given to the same parts as those in the above-described embodiments, and the detailed description of the parts will be omitted. The description of -124-(120) 1321868 is mainly different from the above embodiment. In the second embodiment, the adhesive 11 is pressed to one side of the circuit board 21 at a time, and the adhesive device 27 is disposed so as to be long from the adhesive tape cassette 1 The guide member 1 of the adhesive tape 1 is 〇1. In the second embodiment, the adhesive is pressed to the entire side of the circuit board 21 at a time, and the work efficiency is good. In the third embodiment shown in Fig. 50, the adhesive 11 having a width W is applied to the entire surface of the substrate 9 on the entire surface of the substrate 9, and the adhesive is divided into two by the slit 102. In the adhesive tape 1 of the third embodiment, the slit 102 is formed immediately before the adhesive tape cartridge 100 is attached to the adhesive device 27, and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the boxed portion of the adhesive device 27 (as shown by S in FIG. 47), and a slit 102 may be formed on the adhesive 11 of the adhesive tape 1 that is unwound, or may be formed. In the refining step of the adhesive tape shown in Fig. 48, the gap formed in the refining step is taken up to the disc 3, and after the drying step in the coating step, the gap is formed immediately before the reeling machine 3 1 is taken up. 1 02. In the third embodiment, it is only necessary to form the slit 1 G2 in the adhesive 1 1 on the substrate 9 obtained in the same manner as the conventional one, thereby obtaining two adhesives 11a and lib, which are very easy to manufacture. In the fourth embodiment shown in Figs. 51A and A, the adhesive material 11 (Fig. 51A) is entirely applied to one surface of the substrate 9, and the adhesive tape cassette 100 containing the adhesive tape 1 is used. In the same manner as in the first embodiment, the adhesive device 27 is attached to the adhesive device 27, and a part of the adhesive 1 1 (one portion) in the width W direction of the adhesive tape 1 is heated and pressurized to reduce the aggregation of the portion -125- ( 121) (121) 1321868 Force, only a part of the adhesive 11a which is heated and pressurized is peeled off from the substrate 9 and pressed against the circuit board 21 (Fig. 51B). At this time, the cohesive force reduction line 103 (Fig. 51A) is formed along the periphery of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (simple index is 1 berth or less) The curing reaction of the adhesive is not started, or the low state (the simple index is 20% or less), and the heating temperature should be selected according to the adhesive system to be used. In the fourth embodiment, when the adhesive 11 is used, only one of the portions 25a in the width W direction is softened and fluidized and pressed against the substrate circuit. Next, the invention described in the items 47 to 49 will be described. These inventions relate to an adhesive tape for electronically connecting an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes of the two, in particular, to a disk-shaped adhesive tape. Next, the background art of the invention described in the items 47 to 49 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 3 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape -126-(122) 1321868 (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out. Install to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. φ However, in recent years, with the increase in the size of the panel image such as the PDP, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is The stenosis is 1~3mm. If the number of rolls is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the items 47 to 49 is to provide an adhesive tape which can easily replace the adhesive sheet and improve the production efficiency of the electric -127-(123) 1321868 sub-machine. Next, an embodiment of the invention described in the items 47 to 49 will be described with reference to the drawings.

參照第52圖A、B、第3圖、第4圖、第29圖、及 第5圖，針對第47〜49項記載之發明之第1實施形態進 行說明。第52圖A及B係本實施形態之黏著材膠帶之連 接圖’第52圖A係黏著材盤間之連接的斜視圖，第52 圖B係第5 2圖A之連接部份的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 黏著材膠帶1係由基材9 '及塗布於基材9之一側面 之黏著劑1 1所構成。 基材9具有支持層9b、及從兩側夾住前述支持層9b 之熱熔融劑層（熱金屬層）9a，構成熱熔融劑層9a之熱 φ熔融劑（熱金屬）係採用熱可塑性樹脂之聚乙烯、SBS ( 苯乙烯丁二烯苯乙烯嵌段共聚物）、耐綸等，支持層9b 則係使用OPP (延伸聚丙烯）、聚四氟乙烯、或PET (聚 對苯二甲酸乙二酯）等之塑膠、玻璃纖維、芳香族聚醯胺 纖維、或碳纖維等之強化纖維。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 —熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又、熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 -128- (124) 1321868 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子i 3 係如Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等’亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述之導電層而形 成者。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣 覆膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱 φ 熔融金屬、或塑膠等之高分子核材上形成導電層者，會具 有因加熱加壓或加壓而產生變形之變形性，故連接後之電 極間距離會縮小，連接時可增加和電路接觸之面積，而可 提商信賴性。尤其是，以高分子類做爲核材更佳，如焊錫 因沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 # 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠 帶1之前端經由導引銷22裝設至捲取盤7’並捲出黏著 材膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1 配置於電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加 壓頭1 9從基材9側實施黏著材膠帶1之壓接’將黏著劑 11壓著至電路基板21。其後’將基材9捲取至捲取盤17 〇 其次，如第4圖所示’在壓著至電路基板21上之黏 -129- (125) 1321868 著劑1 1上配置配線電路（或電子構件）23，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路23之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a« 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP 26之周圍 全體，一次使用之黏著劑11的使用量會明顯大於傳統上 φ 之使用量。因此，捲繞於盤3a上之黏著材膠帶1之使用 量亦會變多，因爲捲繞於盤3a上之黏著材膠帶1會在相 對較短之時間內被捲取至捲取盤17，而露出捲繞於盤3a 上之黏著材膠帶1之結束標記28(參照第52圖A)。 如第52圖A所示，在盤3a之黏著材膠帶1露出結束 標記28時，爲了將盤3a更換成新黏著材盤3，連接盤3a 之黏著材膠帶（一方之黏著材膠帶）1之終端部30、及捲 繞於新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶 φ ) 1之始端部3 2。 此黏著材膠帶1之連接上，如第52圖B所示，針對 黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部32，使始端部32之黏著劑11 面重疊於終端部30之基材9之熱熔融劑層9a上，並將此 部份置於工作台104上。其次，以黏著裝置15之加熱加 壓頭1 9實施重疊部份之加熱，使熱溶融劑層9a熔融後， 利用冷卻來使熱熔融劑固化，實施終端部3 0及始端部3 2 之連接。利用此方式，可實施捲繞於已使用之盤3a上之 -130- (126) 1321868 黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接 〇 其次，將已使用之盤3a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。又，因爲捲取盤17係只捲取基 材9，故可捲取數個黏著材盤份，減少捲取盤17之更換 次數，而有良好之作業效率。 φ 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11， 並以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。 被捲取之黏著材膠帶1之原始材料，以切割機33切成特 定寬度並捲取至捲軸後，從兩側將側板裝著至捲軸，將其 和除濕材一起綑包，實施低溫（-5 °C〜-1 〇 °C )之管理並 #進行出貨。 其次，針對第47〜49項記載之發明之其他實施形態 進行說明，以下說明之實施形態中，和上述實施形態相同 之部份會附與相同符號並省略該部份之詳細說明，以下之 說明係以和上述實施形態不同之點爲主。 弟53圖所不之第2實施形態時，黏著材膠帶1之基 材9上，熱熔融劑層9a會夾於支持層9b之間。此時，如 第3圖所示’爲了實施黏著材膠帶1間之連接’在一方之 黏著材膠帶1之終端部30及另一方之黏著材膠帶1之始 -131 - (127) 1321868 端部32互相抵接之位置上，以黏著裝置15之加熱加壓頭 19實施熱熔融劑層9a之加熱。實施加熱會使熱熔融劑從 熱熔融劑層9a滲出，利用冷卻來使熱熔融劑固化，實施 黏著材膠帶1間之連接。如此，因熱熔融劑層9a係夾於 支持層9b之間，而可防止因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層9a之黏著強度。The first embodiment of the invention described in the items 47 to 49 will be described with reference to Figs. 52A, B, 3, 4, 29, and 5. Fig. 52A and Fig. B are connection diagrams of the adhesive tape of the present embodiment. Fig. 52A is a perspective view showing the connection between the adhesive sheets, and Fig. 52B is a sectional view of the connecting portion of Fig. 52A. . The adhesive tape 1 is wound around the discs 3 and 3a, and the reels 5 are disposed on the discs 3 and 3a, and the side panel adhesive tape 1 disposed on the width sides of the adhesive tape 1 is made of the substrate 9' and The adhesive 11 coated on one side of the substrate 9 is formed. The substrate 9 has a support layer 9b and a hot melt layer (hot metal layer) 9a sandwiching the support layer 9b from both sides, and a hot φ melt (hot metal) constituting the hot melt layer 9a is made of a thermoplastic resin. Polyethylene, SBS (styrene butadiene styrene block copolymer), nylon, etc., support layer 9b is OPP (stretched polypropylene), polytetrafluoroethylene, or PET (polyethylene terephthalate) A reinforcing fiber such as a diester), a plastic fiber, a glass fiber, an aromatic polyamide fiber, or a carbon fiber. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type -128- (124) 1321868 The conductive particles 13 may also be dispersed in the adhesive 1 1. The conductive particles i 3 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the foregoing and/or non-conductive glass or ceramics. A polymer core material such as plastic or the like is formed by covering the above-mentioned conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a polymer nucleus such as a solder such as a hot metal such as solder or a plastic material such as plastic, the deformability due to deformation due to heating, pressurization or pressurization is reduced, so that the distance between the electrodes after the connection is reduced and the connection is reduced. When you can increase the area of contact with the circuit, you can increase the reliability of the business. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a description will be given of the method of using the adhesive tape of the present embodiment. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. Wind the tray 7' and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 2 1 , and the heat-adhesive head 19 disposed between the two trays 3 a and 17 is pressed against the adhesive tape 1 from the substrate 9 side. 11 is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17 and secondly, as shown in Fig. 4, a wiring circuit is disposed on the adhesive-129-(125) 1321868 primer 11 which is pressed onto the circuit substrate 21. Or the electronic component 23, the polytetrafluoroethylene material 24 is used as a buffer material, and the heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed. As far as the entire periphery of the PDP 26 is concerned, the amount of the adhesive 11 used at one time is significantly larger than that of the conventional φ. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased because the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 52A). As shown in Fig. 52A, when the adhesive tape 1 of the disc 3a is exposed with the end mark 28, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape (the adhesive tape of one side) of the lands 3a is attached. The end portion 30 and the beginning end portion 3 of the adhesive tape (the other adhesive tape φ) 1 wound around the new adhesive sheet 3 are placed. The connection of the adhesive tape 1 is as shown in Fig. 52B, the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a, and the beginning end 32 of the adhesive tape 1 of the new adhesive sheet 3, the beginning end The adhesive 11 of the portion 32 is superposed on the hot melt layer 9a of the substrate 9 of the terminal portion 30, and this portion is placed on the table 104. Next, the heating and pressurizing heads 19 of the adhesive device 15 are heated by the overlapping portions to melt the hot melt agent layer 9a, and then the hot melt is solidified by cooling, and the terminal portion 30 and the start end portion 3 2 are connected. . In this manner, the connection of -130-(126) 1321868 adhesive tape 1 wound on the used disc 3a and the adhesive tape 1 wound on the new tray 3 can be carried out, and the used one will be used. The disc 3a and the new disc 3 are swapped with each other, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, and the number of replacements of the take-up reel 17 can be reduced, and the work efficiency is good. φ Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . The adhesive 11 mixed with the resin and the conductive particles 13 is applied onto a substrate unwound from the unwinding machine 25, and dried by a drying furnace 29, and then wound up by a coiler 31. Take the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates are attached to the reel from both sides, and are packaged together with the dehumidifying material to perform low temperature (- 5 °C ~ -1 〇 °C) Management and # to ship. In the following, the other embodiments of the invention described in the above-mentioned embodiments of the present invention will be described with reference to the same reference numerals, and the detailed description of the parts will be omitted, and the following description will be omitted. It is mainly different from the above embodiment. In the second embodiment, which is not shown in Fig. 53, the hot melt layer 9a is sandwiched between the support layers 9b on the substrate 9 of the adhesive tape 1. At this time, as shown in Fig. 3, 'in order to carry out the connection between the adhesive tapes 1' at the end portion 30 of one of the adhesive tapes 1 and the other end of the adhesive tape 1 - 131 - (127) 1321868 At a position where 32 abuts each other, the heating of the hot melt layer 9a is performed by the heating and pressing head 19 of the bonding device 15. Heating is performed to bleed the hot melt from the hot melt layer 9a, and the hot melt is solidified by cooling to effect the connection between the adhesive tapes 1. In this manner, since the hot melt layer 9a is sandwiched between the support layers 9b, the adhesion strength of the hot melt layer 9a can be prevented from being lowered due to moisture absorption or adhesion of dust or the like.

第47〜49項記載之發明並未受限於上述之實施形態 ，只要在未背離第47〜49項記載之發明之要旨的範圍內 ，可實施各種變形。 第1實施形態時，基材9係由支持層9b、及從兩側 夾住支持層9b之熱熔融劑層9a之3層所構成，然而，並 不限於此，亦可以爲4層以上。 本實施形態時，連接部份之加熱壓著係利用黏著裝置 15之加熱加壓頭19，然而，亦可採用其他加熱器來取代 加熱加壓頭19，對連接部份進行加熱，實施黏著材膠帶1 • 間之連接。 其次，針對第5 0〜5 1項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著·固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板之半導體裝置上所使甩之黏著材膠帶，尤其是 ，和捲成盤狀之黏著材膠帶之連接方法相關。 其次’針對第50〜5 1項記載之發明之背景技術進行 -132- (128) 1321868 說明》 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶》 又，黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶、微BGA. CSP等之黏著膜 φ 等，其目的則在提高半導體裝置全體之生產性及信賴性。 日本特開2001-284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統之黏著材膠帶，爲了避免黏著劑固著於基材 上、或較容易剝離，會在基材之兩面實施矽處理。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 # 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新黏著材盤裝著至黏著裝置， 並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 -133- (129) 1321868 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 .之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 φ 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置》 因此，第5 0〜5 1項記載之發明的目的，係提供一種 黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡單， 而提高電子機器之生產效率。 其次，參照附錄圖面，針對第50〜51項記載之發明 φ 之實施形態進行說明。首先，參照第54圖A〜C、第55 圖、第56圖、第4圖、及第29圖，針對第50〜51項記 載之發明之第1實施形態進行說明。第54圖A〜C係第 55圖之連接部份之連接步驟的剖面圖，第54圖A係放電 前之黏著材膠帶之狀態，第54圖B係放電後之黏著材膠 帶之狀態，第54圖C係連接部份之加熱壓著圖。第55圖 -係黏著材膠帶連接方法之黏著材盤間之連接的斜視圖，第 56圖係黏著裝置之黏著劑壓著步驟的槪略圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 -134- (130) 1321868 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側 Ί。 黏著材膠帶1係由基材9、及塗布於基材9之 之黏著劑1 1所構成。 從強度、及黏著劑1 1之剝離性而言，基材9 OPP (延伸聚丙烯）、聚四氟乙烯、及PET (聚對 酸乙二酯）等，以脫模劑9a實施表面處理。脫膜 用烯系脫模劑、乙二醇廿八碳酸酯、棕櫚蠟、石油 低融點蠟、低分子量氟樹脂、矽系或氟系之界面活 油、蠟、樹脂、聚酯變性矽樹脂等，一般爲矽樹脂 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系 〇 黏著劑11內亦可分散著導電粒子13。導電丰 係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等 粒子、或碳、石墨等，亦可在前述之物及/或非導 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層 成。此外，亦可應用以絕緣層覆蓋前述導電粒子之 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等 融金屬、或塑膠等之高分子核材上形成導電層者， 因加熱加壓或加壓而產生變形之變形性，故連接後 間距離會縮小，連接時可增加和電路接觸之面積， 之側板 一側面 應採用 苯二甲 劑係採 系蠟等 性劑、 〇 脂、或 樹脂系 化性樹 爲代表 Ϊ子 13 之金屬 電性之 等來形 絕緣覆 之熱熔 會具有 之電極 而可提 -135- (131) 1321868 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 .構件。The invention described in the 47th to the 49th is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. In the first embodiment, the base material 9 is composed of a support layer 9b and three layers of the hot melt layer 9a sandwiching the support layer 9b from both sides. However, the base material 9 is not limited thereto, and may be four or more layers. In the present embodiment, the heating and pressing of the connecting portion is performed by the heating and pressing head 19 of the bonding device 15. However, other heaters may be used instead of the heating and pressing head 19, and the connecting portion is heated to carry out the bonding material. Tape 1 • Connection between the two. Next, the invention described in the fifth to fifth aspects will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. In addition, the adhesive tape for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Next, the background art of the invention described in the above paragraphs 50 to 5 is -132-(128) 1321868 Description In general, a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display panel), a bare wafer The electronic components such as the package and the circuit board, or the adhesion between the circuit boards, and the electrical connection between the electrodes of the two are made of adhesive tape. Further, the adhesive tape is also applied to the lead fixing tape of the lead frame. The purpose of improving the productivity and reliability of the entire semiconductor device is to improve the productivity of the semiconductor device, such as the LOC tape, the die-bonding tape, and the adhesive film φ such as micro-BGA. Japanese Laid-Open Patent Publication No. 2001-284005 describes a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. Such conventional adhesive tapes are treated on both sides of the substrate in order to prevent the adhesive from sticking to the substrate or to be easily peeled off. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like from the substrate side of the adhesive tape which is taken up by the self-adhesive disk #, and the residual substrate is taken up by the take-up reel. Secondly, when the adhesive tape of the adhesive material disc is used up, the used disc and the take-up reel of the take-up substrate are removed, the new adhesive disc is loaded to the adhesive device, and the beginning of the adhesive tape is installed. On the take-up tray. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, and since the replacement of the adhesive sheet is troublesome, there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk to reduce the frequency of replacement of the disk. However, since the tape width of the adhesive tape is narrow 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the φ adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be attached to the existing adhesive device. Therefore, items 50 to 5 are recorded. The object of the invention is to provide a method for joining adhesive tapes, which can make the replacement of the adhesive trays simpler and improve the production efficiency of the electronic equipment. Next, an embodiment of the invention φ described in the 50th to 51st paragraphs will be described with reference to the attached drawings. First, a first embodiment of the invention described in the 50th to 51st aspects will be described with reference to Figs. 54A to AC, 55th, 56th, 4th, and 29th. Fig. 54 is a cross-sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55, Fig. 54A is the state of the adhesive tape before discharge, and Fig. 54B is the state of the adhesive tape after discharge, Figure 54 is a heating and pressing diagram of the connecting portion. Fig. 55 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method, and Fig. 56 is a schematic view showing the adhesive pressing step of the adhesive device. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and each of the discs 3, 3a is provided with a reel 5 and two width sides 配置 disposed on the adhesive tape 1 -134-(130) 1321868. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. From the strength and the releasability of the adhesive 11, the substrate 9 OPP (extended polypropylene), polytetrafluoroethylene, and PET (polyethylene terephthalate) were subjected to surface treatment with a release agent 9a. Ethylene release agent for stripping, ethylene glycol octacarbonate, palm wax, petroleum low melting point wax, low molecular weight fluororesin, lanthanide or fluorine based interfacial active oil, wax, resin, polyester denatured resin In general, a resin adhesive 11 is a mixture of a thermoplastic resin, a thermosetting tree thermoplastic resin, and a thermosetting resin. The thermoplasticity is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is also an epoxy resin type, an acryl resin type, and a bismuth resin type 〇 adhesive agent 11, and a conductive particle can also be dispersed. 13. Conductive abundance such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder and other particles, or carbon, graphite, etc., may also be in the above-mentioned objects and / or non-conductive glass, ceramics, plastics and other polymer core The material or the like covers the aforementioned conductive layer. Further, a film particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a molten metal such as solder or a polymer material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is reduced, so that the distance between the connections is reduced, and the contact with the circuit can be increased during connection. The area, one side of the side plate should be made of a material such as a benzoic acid-based wax, a blush, or a resin-based tree, which is representative of the electrical properties of the metal of the scorpion 13 The electrode can be lifted -135- (131) 1321868 High reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection. Component.

其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第56圖所示，將黏著材膠帶1之盤3a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠 φ 帶1之前端經由導引銷22裝設至捲取盤17，並捲出黏著 材膠帶1(第56圖中之箭頭E)。其次，將黏著材膠帶1 配置於電路基板21上，利用配置於兩盤3、1 7間之加熱 加壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著 劑11壓著至電路基板21。其後，將基材9捲取至捲取盤 17 °Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 56, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape φ tape 1 wound on the disc 3a is loaded via the guide pin 22. Set to the take-up reel 17, and roll out the adhesive tape 1 (arrow E in Fig. 56). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing heads 19 disposed between the two trays 3 and 17 to press the adhesive 11 The circuit board 21 is placed. Thereafter, the substrate 9 is taken up to the take-up reel 17 °

其次，如第4圖所示，在壓著至電路基板21上之黏 著劑Η上配置配線電路（或電子構件）23，將聚四氟乙 φ 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路23之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑丨丨會壓著至PDP 26之周圍 全體，可知一次使用之黏著劑11的使用量會遠大於傳統 上之使用量。因此，捲繞於盤3a上之黏著材膠帶Γ之使— 用量亦會增多，捲繞於盤3a上之黏著材膠帶1在相對較 短之時間內會被捲取至捲取盤17，而露出捲繞於盤3a上 [S] -136- (132) (132)1321868 之黏著材膠帶1之結束標記28(參照第55圖）。 如第55圖所示，爲了將盤3a更換成新黏著材盤3’ 會在盤3a之黏著材膠帶1上連接盤3a之黏著材膠帶（一 方之黏著材膠帶）1之終端部30、及捲繞於新黏著材盤3 上之黏著材膠帶（另一方之黏著材膠帶）1之始端部32。 此黏著材膠帶1之連接上，如第54圖B所示’將已 使用之盤3a之黏著材膠帶1之終端部30置於放電機105 之照射位置。其次，對基材9之表面實施放電，去除脫模 劑9 a。 其次，使另一方之黏著材膠帶1之始端部32之黏著 劑Π面重疊於已去除脫模劑9a之基材9面（第54圖C )。將兩者之重疊部份置於工作台，以黏著裝置15之加 熱加壓頭19進行加熱加壓實施黏著。利用此方式，可實 施捲繞於已使用之盤3a上之黏著材膠帶1、及捲繞於新 盤3上之黏著材膠帶1之連接。 其次，將已使用之盤3a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，而無需使用其 他黏著材膠帶1間之連接器具，即可更換已捲繞著黏著材 膠帶1之盤3、3a。又，因爲捲取盤17只會捲取基材9， 故可捲取數個黏著材盤份，減少捲取盤17之更換次數， 而有良好之作業效率。 第5 0〜5 1項記載之發明並未受限於上述之實施形態 -137- (133) 1321868 ，只要在未背離第50〜51項記載之發明之要旨的範圍內 ，可實施各種變形。 例如，上述之實施形態時，去除已結束捲取之一方之 .黏著材膠帶1之基材9之脫模劑9a，將新黏著材膠帶i 之黏著劑1 1面重疊於此部份，並以加熱加壓頭1 9實施加 熱加壓進行黏著來連接兩者，然而，亦可去除新黏著材膠 帶1之基材9之脫模劑9a，將已結束捲取之一方之黏著 φ 材膠帶1之黏著劑11面重疊於此部份來連接兩者。 去除脫模劑9a之方法，除了電漿放電以外，亦可以 爲紫外線照射或雷射照射之方法，紫外線照射時，例如將 水銀燈當做光源使用，實施一定時間之水銀燈的紫外線照 射。其次，雷射照射時，則利用以雷射振盪器照射之雷射 光來分解飛散脫模劑9a，去除脫模劑9a。 上述係針對電子構件及電路基板、以及電路基板間之 黏著固定時進行說明，然而，亦可應用於將半導體元件（ φ 晶片）黏著·固定至引線框架之固定用支持基板、引線框 架之晶片、半導體元件載置用支持基板之半導體裝置所使 用之黏著材膠帶。 其次，針對第5 2〜5 8項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著.固定至引線框架_ 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板所使用之半導體裝置使用之黏著材膠帶，尤其 -138- (134) 1321868 是，和捲成盤狀之黏著材膠帶盤相關。 其次，針對第52〜58項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 φ 又，黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶等，例如，使用引線固定膠帶 之目的，係用以固定引線框架之引線銷，提高引線框架自 體或半導體裝置全體之生產性及信賴性。 隨著電子機器之小型·輕量化發展，半導體裝置亦推 展被稱爲微BGA (球形陣列）或CSP (晶片尺寸封裝）之 小型封裝之開發，前述微BGA (球形陣列）或CSP (晶片 尺寸封裝）係在半導體裝置（封裝）下部以區域陣列狀配 φ 置其外部端子，這些封裝之構造上，係在具有1層或多層 配線構造之玻璃環氧基板或聚醯亞胺基板等半導體元件載 置用支持基板上，利用黏著劑載置半導體元件（晶片）， 半導體元件側之端子及基板之配線板側端子則以絲焊或倒 裝晶片方式連接，連接部、及晶片上面部或端面部以環氧 系密封材或環氧系液狀密封材進行密封，在配線基板背面 以區域陣列狀配置焊球等金屬端子。又，QFN ( Quad Flat Non-leaded Package )或 SON (Small Outline Non-leaded Package )等亦採用黏著材膠帶。其次，在電子機器之基 -139- (135) (135)1321868 板上’以迴焊方式實施高密度之複數個上述封裝之全面一 齊安裝。其次’利用黏著劑載置引線框架之晶片及半導體 元件（晶片）’以絲焊連接半導體元件側之端子及引線框 架端子’以環氧系密封材或環氧系液狀密封材密封連接部 、及晶片上面部或端面部。此種半導體裝置之黏著劑亦採 用黏著材膠帶。 日本特開200 1 -284005號公報中，電極間之電性連接 方法係將基材上塗布著黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將盤上捲繞著黏著 材膠帶之黏著材膠帶盤裝設至黏著裝置，拉出黏著材膠帶 之始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出 之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路 基板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加☆又，因爲黏著劑之用-途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩’故有無 -140- (136) 1321868 法提高電子機器之生產效率之問題。 針對此問題’可以考慮以增加捲取至盤之黏著材膠帶 之捲數’來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因，或者，盤之 φ 直徑尺寸增大而可能因無法裝著於既存之黏著裝置上而無 法使用既存之黏著裝置。 其次，黏著材膠帶盤若使黏著材膠帶直接曝露於大氣 下，則可能因爲灰塵或濕氣而導致品質降低。 因此，第52〜58項記載之發明的目的，係在提供一 種黏著材膠帶盤，黏著材膠帶盤之更換比較簡單，而可提 高電子機器之生產效率及維持黏著材膠帶之品質。 其次，參照附錄圖面，以電極連接用之黏著材膠帶爲 φ 例，針對第52〜58項記載之發明之實施形態進行說明， 然而，半導體元件連接用之黏著材膠帶亦相同。首先，參 照第57圖A〜C、第3圖、第4圖、第29圖、及第58圖 ，針對第52〜5 8項記載之發明之第1實施形態進行說明 。第57圖A〜C係第1實施形態之黏著材膠帶盤圖，第 57圖A係黏著材膠帶盤的斜視圖，第57圖B係第57圖 A之正面圖，第57圖C係第57圖A之蓋體構件之正面 圖，第58圖係黏著材膠帶之製造方法的步驟圖。 本實施形態之黏著材膠帶盤A，具有複數之黏著材膠 -141 - (137) (137)1321868 帶1之捲部（以下簡稱爲捲部）2、2a，捲部2、2a具有 已捲繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著 捲軸5、及配置於黏著材膠帶1之兩寬度側之側板7、7a 、7b。如第3圖所示，黏著材膠帶1係由基材9、及塗布 於基材9之一側面之黏著劑Π所構成。未使用之捲部2a 上，覆蓋捲繞於盤3a上之黏著材膠帶1之周圍的蓋體構 件8，以可自由裝卸之方式裝設於盤3a上。 又，捲部2、2a之內側之側板7a上，配設著乾燥劑 1 〇之收容部（收容空間）1 2，收容剖1 2內收容著矽凝膠 等乾燥劑1 0，用以從內部去除未使用之捲部2a內之濕氣 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑11內亦可分散著導電粒子13。導電粒子13 係如 A-η、A g、P t、Ni、Cu、W·、S b、S η、焊錫等之金屬 粒子、或碳、石墨等’亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 -142- (138) 1321868 成。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之 融金屬、或塑膠等之高分子核材上形成導電層者，會 因加熱加壓或加壓而產生變形之變形性，故連接後之 間距離會縮小，連接時可增加和電路接觸之面積，而 高信賴性。尤其是，以高分子類做爲核材更佳，如焊 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態 φ 可得到很容易即可對應電極之厚度及平坦性之誤差的 構件。 其次，針對本實施形態之黏著材膠帶之使用方法 說明。如第3圖所示，將黏著材膠帶盤A、及捲取f 裝著至黏著裝置15，將一方之黏著材膠帶1之始端 由導引銷22裝設至捲取盤17，並捲出黏著材膠帶1 3圖中之箭頭E)。其次，將黏著材膠帶1配置於電 板21上，利用配置於兩盤3、1 7間之加熱加壓頭1 9 φ 材9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著 路基板21。其後，將基材9捲取至捲取盤17» 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）23，將聚四 烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 施配線電路2 3之加熱加壓。利用此方式，可連接電 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑1 1會被壓著至PDP 26 緣覆 熱熔 具有 電極. 可提 錫因 ，而 連接 進行 ! 17 部經 (第 路基 從基 至電 之黏 氟乙 1實 路基 PDP 之周 -143- (139) 1321868 圍全體，一次使用之黏著劑11的使用量會遠大於傳統上 之使用量。因此，黏著材膠帶1之使用量亦較多，捲繞於 盤3、3a上之黏著材膠帶1會在相對較短之時間內被捲取 至捲取盤17。 在一方之捲部2之黏著材膠帶1上露出結束標記時， 將其更換成新捲部2a之黏著材膠帶1。本實施形態時， 未使用之捲部2a上，配設著蓋體構件8，拆下此蓋體構 ^ 件8後，捲出黏著材膠帶1並將其裝設至捲取盤17。 如此* 一方之捲部2全部捲出時’可將另-*方之捲部 2a之黏著材膠帶1裝設至捲取盤17而實施黏著材膠帶1 之更換，故無需將新黏著材膠帶盤裝著至黏著裝置15。 因此，只需較少之新黏著材膠帶盤之更換作業，故可提高 電子機器之生產效率。 又，因爲未使用之捲部2a上配設著蓋體構件8，黏 著材膠帶1不會直接曝露於大氣下，故黏著材膠帶1不易 φ 因灰塵或濕氣而發生黏著力降低等情形。因此，即使配設 著複數捲部2、2a時，亦可利用在未使用之捲部2a上配 設蓋體構件8來防止黏著材膠帶1之品質降低。 又，因爲捲取盤17只會捲取基材9，故可捲取數個 黏著材膠帶盤份而減少捲取盤17之更換次數，而有良好 之作業效率。 龀處-參照第58 «，針對本實施形態之黏著材膠帶 盤Α之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 -144 - (140) 1321868 機27塗布由樹脂及導電粒子13混合而成之黏著劑，並以 乾燥爐29實施乾燥後’以捲取機31捲取原始材料。被捲 取之黏著材膠帶之原始材料，以切割機33切成特定寬度 並捲取至捲軸後’從兩側將側板7、7a、7b裝著於捲軸上 ’然後’貫施盖體構件8之裝者，將其和除濕材~起網包 ，實施低溫（-5°C〜-10°C )之管理並進行出貨。 其次’針對第5 2〜5 8項記載之發明之其他實施形態 φ 進行說明，和上述實施形態相同之部份會附與相同符號並 省略該部份之詳細說明，以下之說明係以和上述實施形態 不同之點爲主。 第59圖所示之第2實施形態時，裝設於捲部2、2a 之蓋體構件8，具有黏著材膠帶1之拉出口 106。此時， 因爲可從蓋體構件8之拉出口 106捲出黏著材膠帶1，不 拆下捲部2、2a之蓋體構件8亦可從捲部2、2a直接捲出 黏著材膠帶1。 φ 第60圖A及B所示之第3實施形態時，捲部2、2a 、2b係不同之個體，以可自由滑動方式，裝設於黏著裝 置15本體上之軸107上。其次，一方之捲部2全部捲出 時，拆下裝設於軸107之前端的蓋帽1〇8’從黏著裝置15 取下一方之捲部2。其次，使另一方之捲部2a移動至黏 著位置並拆下蓋體構件8後，將另一方之捲部2a之黏著 材膠帶1捲裝至捲取盤17，實施黏著材膠帶1之更換。 此時，因爲複數之捲部2、2a、2b係不同之個體’故很容 易處理。 -145- (141) 1321868 第6 1圖所示之第4實施形態時，和第3實施形態相 同，捲部2、2a、2b係不同之個體，使捲部2、2a、2b之 側板7、7a互相嵌合，將其裝著至黏著裝置15。如第61 圖所示’另一方之捲部2a之側板7a上，配設著橫剖面略 呈〕字形之被嵌合部110’將配設於一方之捲部2之側板 7上之被嵌合部49，從上側嵌合至被嵌合部110，可連接 兩者。將全部捲出之一方之捲部2從黏著裝置15拆下時 φ ’只要將一方之捲部2向上提起即可解除嵌合，很簡單即 可拆下一方之捲部2。 第52〜58項記載之發明並未受限於上述之實施形態 ’只要在未背離第52〜58項記載之發明之要旨的範圍內 ，可實施各種變形。 例如，上述之實施形態時，捲部2、2a之數量並無特 別限制，可以爲任意個。 第4實施形態時，係以使側板7 ' 7a上下滑動來嵌合 ^ 一方及另一方之捲部2、2a，然而，亦可在—方之側板7 上形成嵌合孔，而在另一方之側板7a上配設嵌合突起， 並從膠帶之寬度方向將嵌合突起壓入嵌合孔內來使兩者嵌 合。 第31圖A、B係用以貫施引線框架之固定用支持基 板、半導體元件載置用支持基板、或引線框架之晶片和半 導體元件之連接1黏著材膠帶當中，將半導體元件黏著· 固定於引線框架之固定用支持基板及引線框架之L0C ( Lead on Chip)構造的1個實例。 -146- (142) 1321868 實施厚度50 之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25 之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏 著材膠帶，而可得到第31圖B所示之LOC構造之半導體 裝置。將第31圖A所示之黏著材膠帶，以第32圖A〜C 所示之黏著裝置之冲切模具87 (公模（凸部）95、母模 (凹部）96 )冲切成細長形，例如，在厚度〇.2mm之鐵-φ 鎳合金製引線框架上，以400°C、3MPa之壓力、3秒鐘之 加壓實施壓著，形成0.2mm間隔、0.2mm寬度之內引線 ’製成附有半導體用黏著膜之引線框架。其次，在其他步 驟實施350 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半 導體元件壓著至此附有半導體用黏著膜之引線框架之黏著 劑層面，其後，以金線實施引線框架及半導體元件之絲焊 ’以連續成形使用環氧樹脂成形材料等密封材實施密封， 得到第31圖B所示之半導體裝置。第31圖A、B中，81 % 係以黏著材膠帶冲切所得之半導體用黏著膜，54係半導 體元件，83係引線框架，84係密封材，85係焊絲，86係 匯流排條。第32圖A、B、C係黏著裝置，第32圖A、B 中，8 7係冲切模具，8 8係引線框架搬運部，61係黏著劑 膠帶冲切貼附部，90係加熱器部，91係黏著材膠帶盤（ 黏著材膠帶捲出部），92係黏著材膠帶（半導體用黏著 膜），93係黏著材膠帶捲出滾輪。又，第32圖C中，94 係黏著材膠帶（半導體用黏著膜），95係公模（凸部） ，96係母模（凹部）’ 97係膜壓板。黏著材膠帶92會從 -147- (143) (143)1321868 黏著材膠帶盤（黏著材膠帶捲出部）91連續捲出，並在 黏著材膠帶冲切貼附部8 9冲切成細長形且黏著至引線框 架之引線部份，將其視爲附有半導體用黏著膜之引線框架 而從引線框架搬運部搬出。冲切所得之黏著材膠帶則從黏 著材膠帶捲出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接•黏著。黏著材膠帶只單純用 於黏著•固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對第5 9項記載之發明進行說明。 此發明係關於將電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑壓著 至電路基板之黏著具。 其次，針對第5 9項記載之發明之背景技術進行說明 〇 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開2 0 (>1 - 2 8 4 θ 0 5號公報，係記載著黹在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者，將此黏著劑膠帶之 盤（以下稱爲「黏著劑盤」）裝著於自動黏著機械來使用 -148- (144) 1321868 自動黏著機械具有黏著劑盤之裝著部、空盤之裝著部 、配設於前述盤間之加熱加壓構件、以及用以載置基板之 工作台’從黏著劑盤將黏著劑膠帶拉出至基板上，利用加 熱加壓構件從基材之背面側實施黏著劑膠帶之加熱加壓， 將黏著劑壓著至基板上。 然而’傳統之自動黏著機械較爲大型，欲在部份基板 φ 上實施黏著劑之壓著時、壓著黏著劑之面積較小時、或暫 時壓著時等’會因爲較爲大型，反而有不易操作之問題。 另一方面，若爲和此種大型自動黏著機械不同之小型 卻可很簡單地進行操作，故在局部或暫時壓著時，希望能 有不使用大型裝置卻可實施黏著劑之壓著的器具。 因此，第59項記載之發明的目的，係提供一種黏著 具，十分小型且可以單手操作，並且很容易即可對基板之 一部份實施黏著劑之壓著。 φ 其次，參照附錄圖面，針對第5 9項記載之發明之實 施形態進行說明。第62圖A及B係第59項記載之發明 之第1實施形態之黏著具圖，第62圖A係黏著具之斜視 圖，第62圖B係第62圖A之A-A剖面圖，第63圖係用 以說明第62圖A及B所示之黏著具之使用方法的側面圖 ，第64圖係黏著具之製造方法的步驟圖。 本實施形態之黏著具111之主要構成係一方之盤（供 應盤）3、另一方之盤（空盤）5、以及收容前述盤之殻體 99，一方之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之 -149- (145) 1321868 —端9a則固定於另一方之盤5。 殼體99之形成上，係可以單手把持之尺寸，從側面 觀看時，角部具有弧度而大致呈三角形，係容易把持之形 狀。略呈三角形之殻體99之角部上，會形成開口部113 ，黏著劑膠帶9會從此開口部113露出。 又，開口部1 1 3上突設著加熱構件1 1 4，從側面觀看 時，此加熱構件114亦略呈三角形，用以引導從上面13a 沿著下面13b拉出之黏著劑膠帶1，其下面側配設著電熱 板Π 5。 加熱構件1 1 4之形狀呈棒狀，在以電熱板1 1 5覆蓋加 熱構件1 1 4之情形下拉出黏著材膠帶9時，可利用加熱構 件1 1 4之旋轉而順利拉出膠帶9。又，電熱板1 1 5之外側 若配設聚四氟乙烯、矽橡膠、或雙方，則實施黏著劑9之 壓著時，可獲得均一之壓力。 方及另 殼體99係由半殼體99a、99b嵌合而成 方之盤3、5係收容於殼體內。殼體內配設著導引件16, 用以引導黏著劑膠帶1之移動。又，殼體99a或7b之其 中任一方之底面之一方上，會形成板狀之導引件，在使此 導引件抵壓至電路基板之邊緣之情形下，將黏著劑壓著至 電路基板，則可沿著電路基板實施精度良好之黏著劑壓著 一方之盤3上會以苘軸方式固定著一方之齒輪1 16， 另一方之盤17上亦以同軸方式固定著另一方之齒輪117 ，一方之齒輪116及另一方之齒輪117會互相齒合’當一 t S1 -150- (146) 1321868 方之盤3旋轉而使黏著劑膠帶1被拉出時，另一方之盤 17會實施黏著劑膠帶1之拉出量的旋轉，並捲取基材9。 又，齒輪單元118係由一方之齒輪116及另一方之齒輪 1 1 7所構成》 又，殼體99之側面配設著對加熱構件1 1 4供應電力 之第三殼體（電源手段）119,第三殻體119內除了收容 乾電池以外，尙會收容供應給加熱構件1 1 4之電力之調整 φ 電路。又’第三殻體119上配設著電源開關120，可以把 持黏著具111之手的手指實施ΟΝ/OFF之操作。 如第62圖B所示，黏著劑膠帶1上之基材9之單面 上塗布著黏著劑1 1。 本實施形態時，黏著劑膠帶1之長度約爲20m、寬度 W 約爲 1.2 m m。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 # 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ’熱硬化性樹脂系係以環氧樹脂系、乙烯基酯系樹脂、壓 克力系樹脂、及矽樹脂系爲代表^ 黏著劑11內分散著導電粒子13。導電粒子13係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 -151 - (147) 1321868 '或碳、石墨等，亦可在前述之物及/或非導電性之玻璃 、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。 此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 φ 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 其次，針對本實施形態之黏著具111之使用方法進行 說明。如第63圖所示，以單手握持黏著具1 1 1，將電源 開關1 20切至ON。其次，使露出黏著劑膠帶1之開口部 113抵壓電路基板27»因爲開口部11上之黏著劑膠帶1 φ 之基材9側配設著加熱構件1 1 4 ’壓附位於加熱構件1 1 4 下面側之黏著劑膠帶1，對電路基板27實施黏著劑1 1之 加熱壓著。 在將黏著具111壓向下方之狀態下朝前方（第63圖 中之箭頭E)移動’會依序拉出黏著劑膠帶1’加熱構件 114會朝E方向前進，同時，新黏著劑9會位於加熱構件 -1 14之下，而將黏著劑Π依序壓著至電路基板27。 如此，從一方之盤3拉出黏著劑膠帶1時’因—方之 盤3會旋轉，故和一方之盤3以同軸方式固定之一方之齒 -152 - (148) 1321868 輪116亦會旋轉，和其齒合之另一方之齒輪117亦會隨之 旋轉，而將已剝離黏著劑25之基材9捲取至另一方之盤 17 ° 利用本實施形態，欲將黏著劑1 1壓著至電路基板27 上之任意位置時，只要以單手握持黏著具111並向前推， 很簡單即可實施黏著劑1 1之壓著。如此，因爲很黏著劑 1 1之壓著很簡單，特別適合例如將電子構件（配線電路 φ ) 37暫時黏著於電路基板27上時、或只對電路基板27 之一部份實施電子構件（配線電路）37之壓著時。 上述之壓著後（暫時連接），實施電路基板27之電 極及電子構件（配線電路）37之電極的定位並進行正式 連接。正式連接上，對電路基板27實施黏著劑11之壓著 後，在黏著劑Π上配置電子構件（配線電路）3 7，必要 時’可將聚四氟乙烯材3 9當做緩衝材，以加熱加壓頭i 9 對電路基板27實施電子構件（配線電路）37之加熱加壓 Φ (參照第4圖）。利用此方式，可連接固定電路基板27 之電極27a及電子構件（配線電路）37之電極37a。 又，因爲構成上’黏著劑膠帶1係收容於殼體99內 且直接使用，故十分容易處理而具有良好之作業性。 此處’參照第6 4圖’針對本實施形態之黏著具1 j j 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機28塗布由樹脂及導電粒子13混合而成之黏著劑，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。被 -153- (149) 1321868 捲取之黏著劑膠帶之原始材料，在整修步驟中以切割機 33切成特定寬度並捲取至盤3後，以夾於半殼體99a、 9 9b間之方式嵌合一方之盤3及另一方之盤（空盤）5， .且組裝收容著加熱構件114及乾電池等之第三殼體119, 製成黏著具1 1 1。 將黏著具1 1 1和除濕材一起綑包，實施低溫（-5 °C 〜-1 (TC )之管理並進行出貨。 φ 其次，針對第60〜64項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對第60〜64項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 φ 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開2001 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度，黏著材膠帶從盤捲出並將 黏著劑壓著至電路基板等後，即不會再度使用。 _ 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 -154- (150) 1321868 亦增加。又，因爲黏著劑之用途之擴大’黏著劑之 亦增加。因此，電子機器之製造工廠之黏著材盤的 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著 之捲數，來增加每1盤之黏著劑量’用以降低盤之 率，然而，因爲黏著材膠帶之厚度較厚，很難增加 Φ 之捲數。 又，若考慮減少黏著材膠帶之厚度，則因爲使 矽處理之PET (聚對苯二甲酸乙二酯）當做基材， 厚度若太薄，會有容易發生基材伸展或斷裂等之問 因此，第60〜64項記載之發明的目的，係在 種黏著材膠帶，可增加每1盤之捲數，而提高電子 生產效率。 其次，參照附錄圖面，針對第60〜64項記載 # 之實施形態進行說明。參照第65圖A、B、第3圖 圖、第29圖、及第5圖，針對第60〜64項記載之 第1實施形態進行說明。第65圖A及B係第1實 之黏著材膠帶圖，第65圖A係黏著材盤的斜視圖 圖B係第65圖A之A-A剖面圖。 黏著材膠帶1係捲繞於盤3者，盤3上配設著 、及配置於黏著材膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之 之黏著劑1 1所構成。 使用量 更換更 提高電 材膠帶 更換頻 每1盤 用經過 基材之 題。 提供一 機器之 之發明 I、第4 發明之 施形態 ，第65 :捲軸5 一側面 -155- (151) 1321868 基材9係採用銅膜（銅箔）。基材9之厚度（第65 圖B中之S)爲10/zm，基材9之25°C時之拉伸強度爲 500MPa，基材9對黏著劑11之厚度比（S/T)爲0.5，黏 著劑11之厚度爲20/zm。基材9之表面粗細度Rinax爲 0 · 2 5 // m。 又，亦製成採用芳香族聚醯胺膜（MICTRON)當做 基材9者。製作上，基材9之厚度、拉伸強度、及基材9 ^ 對黏著劑1 1之厚度比（S/T )皆和銅膜相同。 其次，針對上述之黏著材膠帶之使用方法進行說明。 如第3圖所示，將黏著材膠帶1之盤3、及捲取盤17裝 著至黏著裝置15，捲繞於盤3上之黏著材膠帶1之前端 會經由導引銷22裝設至捲取盤17並捲出黏著材膠帶1( 第3圖中之箭頭E)。其次，將黏著材膠帶1配置於電路 基板2 1上，以配置於兩盤3、1 7間之加熱加壓頭1 9從基 材9側壓接黏著材膠帶1，將黏著劑11壓著至電路基板 φ 21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑11上配線電路（或電子構件）23，將聚四氟乙烯材 24當做緩衝材，以加熱加壓頭1 9對電路基板21實施配 線電路23之加熱加壓。利用此方式，可連接電路基板21 之電極21a及配線電路23之電極23a。 ---如第29僵之利-用本實施形態-之黏著材髎帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP之周圍全體 ，可知一次使用之黏著劑11的使用量會遠大於傳統上之 -156- (152) 1321868 使用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦 會增多，捲繞於盤3上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而使盤3成爲空的。 盤3成爲空的時，更換已使用之盤3及新盤，將新盤 裝著至黏著裝置15。其次，如上面所述，重複將黏著劑 11壓著至電路基板21並將基材9捲取至捲取盤17之動 作。 φ 結果，採用銅膜做爲基材9者、及採用芳香族聚醯胺 膜做爲基材9者，皆和傳統黏著材膠帶1同樣容易處理， 且沒有基材9伸展或斷裂之問題。其次，相對於基材11 之厚度較傳統品（5 0 /i m )爲薄之部份，黏著材膠帶之捲 數會增多，故可減少盤之更換頻率而提高生產性。 此處，參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 φ 機27塗布由樹脂及導電粒子13混合而成之黏著劑11， 並以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。 被捲取之黏著材膠帶1之原始材料，以切割機33切成特 定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸 5上，將其和除濕材一起綑包，實施低溫（_ 5艺〜_〗〇 t ) 之管理並進行出貨。 又，針對基材9之厚度爲4//m、20ym、25；tzm之銅 膜及芳香族聚醯胺膜’製作黏著材膠帶1，如上面所述之 實際使用上，未發生基材9之伸展或斷裂等之問題。 -157- (153) 1321868 又，針對基材9對黏著劑1 1之厚度比（S/T )爲0· 01 、0.05、1.0之銅膜及芳香族聚醯胺膜，製作黏著材膠帶 i，如上面所述之實際使用上，未發生基材9之伸展或斷 -裂等之問題。 其次，針對第65〜66項記載之發明進行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接黏著材膠帶之 φ 黏著材形成方法。又，係關於在將半導體元件（晶片）黏 著•固定至引線框架之固定用支持基板或引線框架之晶片 '或半導體元件載置用支持基板之半導體裝置上所使用之 黏著材膠帶之黏著材形成方法，尤其是，和捲成盤狀之黏 著材膠帶盤之黏著材形成方法相關。 其次，針對第65〜66項記載之發明之背景技術進行 說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( # 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、LOC膠帶' 晶粒結著膠帶、微 BG A · CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏者材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 -158- (154) 1321868 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 φ 、及捲取基材之捲取盤，新黏著材盤及新捲取盤爸裝著至 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題》 φ 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數’來增加每1盤之黏著劑量，用以降低盤之更換頻 率’然而’黏著材膠帶之捲數若增加，盤之黏著材膠帶捲 繞直徑之尺寸（以下稱爲「捲繞直徑」）亦會較大，可能 因無法裝著於既存之黏著裝置上而無法使用既存之黏著裝 置0 因此’第65〜66項記載之發明的目的，係在提供— 種黏著材膠帶之形成方法，可不增加黏著材膠帶之捲繞直 徑，而提高電子機器之生產效率。 -159- (155) 1321868 其次，參照附錄圖面，針對第65〜66項記載之發明 之實施形態進行說明。參照第66圖A及B、第67圖、第 68圖、第4圖、第29圖、及第5圖，針對第65〜66項 .記載之發明之第1實施形態進行說明。第66圖A及B係 第1實施形態之黏著材膠帶之黏著樹形成步驟圖，第66 圖 A係將各黏著材膠帶重疊成一體並將一方之基材捲取 至捲取用盤之步驟的槪略圖，第66圖B係第66圖A之 φ 黏著劑間之重疊部份的剖面圖，第67圖係在被覆體上形 成黏著裝置之黏著劑之步驟的槪略圖，第68圖係捲繞著 黏著材膠帶之盤之斜視圖，第4圖係電路基板間之黏著的 剖面圖，第29圖係PDP之黏著劑之使用狀態的斜視圖， 第5圖係黏著材膠帶之製造方法的步驟圖。 黏著材膠帶1分別捲繞於盤3、121，各盤3、121上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。黏著材膠帶1係由基材9、及塗布於基材9之一側面 φ 之黏著劑1 1所構成。 從強度、及黏著劑之剝離性而言，基材9應由OPP ( 延伸聚丙烯）、聚四氟乙烯、或經過矽處理之PET (聚對 苯二甲酸乙二酯）等所構成，然而，並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 -係以笨乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 -160- (156) 1321868 黏著劑11內亦可分散著導電粒子13。導電粒子13 係如Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子 '或碳、石墨等’亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 成。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 φ 因加熱加壓或加壓而產生變形之變形性’故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第66圖A所示，將2個黏著材膠帶1之盤3、 φ 121、及捲取用之盤17、18裝著至黏著裝置15，將捲繞 於一方之盤3上之黏著材膠帶1之前端經由導引銷22裝 設至一方之捲取盤17，並捲出黏著材膠帶〗（第66圖A 甲箭頭E)。又，捲繞於另一方之盤121上之黏著材膠帶 1之前端亦裝設至另一方之捲取盤18,並捲出黏著材膠帶 1 ° 從盤3、121捲出之黏著材膠帶1，會利用配置於盤3 、121及加熱加壓頭19之間之壓著滾輪122，使各黏著材 膠帶1重疊成一體。其次，將另一方之黏著材膠帶1之基 -161 - (157) 1321868 材9捲取至捲取盤18。 其次，將一方之黏著材膠帶1配置於電路基板21上 ，以加熱加壓頭19從基材9側實施黏著材膠帶1之壓接 ’將黏著劑11壓著至被覆體之電路基板21。其後，將基 材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the adhesive niper pressed onto the circuit board 21, and the polytetrafluoroethylene phthalene material 24 is used as a cushioning material to heat the pressing head. 19 The heating and pressurization of the wiring circuit 23 is performed on the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 丨丨 is pressed against the entire periphery of the PDP 26, and it is understood that the amount of the adhesive 11 used at one time is large. Traditionally used. Therefore, the amount of the adhesive tape wound around the disk 3a is increased, and the amount of the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound on the disk 3a [S] - 136 - (132) (132) 1321868 is exposed (refer to Fig. 55). As shown in Fig. 55, in order to replace the disc 3a with the new adhesive sheet 3', the end portion 30 of the adhesive tape (one adhesive tape) 1 of the disc 3a is joined to the adhesive tape 1 of the disc 3a, and The beginning end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3. The connection of the adhesive tape 1 is as shown in Fig. 54B. The end portion 30 of the adhesive tape 1 of the used disc 3a is placed in the irradiation position of the discharger 105. Next, discharge is performed on the surface of the substrate 9 to remove the release agent 9a. Next, the adhesive surface of the other end portion 32 of the adhesive tape 1 is superposed on the surface of the substrate 9 from which the release agent 9a has been removed (Fig. 54C). The overlapping portions of the two are placed on the table, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized to perform adhesion. In this manner, the adhesion of the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be realized. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. In this embodiment, the discs 3, 3a around which the adhesive tape 1 has been wound can be replaced by using the heating and pressurizing head 119 without using a connecting device between the other adhesive tapes 1. Moreover, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, and the number of replacements of the take-up reel 17 can be reduced, and the work efficiency is good. The invention described in the above paragraphs 50 to 5 is not limited to the above-described embodiment -137-(133) 1321868, and various modifications can be made without departing from the scope of the invention as set forth in the 50th to 51st. For example, in the above embodiment, one of the ends of the winding is removed. The release agent 9a of the substrate 9 of the adhesive tape 1 is superposed on the surface of the adhesive 1 1 of the new adhesive tape i, and is heated and pressurized by the heating and pressing head 1 to be bonded. However, the release agent 9a of the substrate 9 of the new adhesive tape 1 can be removed, and the adhesive 11 of the adhesive tape 1 which has been wound up is overlapped with this surface to connect the two. The method of removing the release agent 9a may be a method of ultraviolet irradiation or laser irradiation in addition to plasma discharge, and for example, a mercury lamp is used as a light source during ultraviolet irradiation, and ultraviolet irradiation of a mercury lamp for a certain period of time is performed. Next, in the case of laser irradiation, the scattering release agent 9a is decomposed by the laser light irradiated with the laser oscillator to remove the release agent 9a. The above description is directed to the case where the electronic component, the circuit board, and the circuit board are bonded and fixed. However, the present invention can also be applied to a semiconductor chip (φ wafer) which is adhered and fixed to the fixing support substrate of the lead frame, the wafer of the lead frame, and the like. An adhesive tape used in a semiconductor device in which a semiconductor substrate is mounted on a support substrate. Next, the invention described in the fifth to fifth aspects will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. Also, it is about sticking a semiconductor element (wafer). The adhesive tape used for the semiconductor device used for fixing the support substrate or the lead frame of the lead frame _ or the semiconductor device mounting substrate, in particular -138-(134) 1321868, and rolled into a disk shape The adhesive tape is related to the tape. Next, the background art of the invention described in the items 52 to 58 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. φ Also, the adhesive tape is also applied to the lead frame fixing tape of the lead frame, the LOC tape, the die-bonding tape, etc., for example, the purpose of using the lead fixing tape is to fix the lead pin of the lead frame, and improve the lead frame from Productivity and reliability of the entire body or semiconductor device. With the development of small and lightweight electronic devices, semiconductor devices are also developing a small package called Micro BGA (Spherical Array) or CSP (Chip Size Package), the aforementioned micro BGA (spherical array) or CSP (wafer size package). The external terminals are arranged in the area array in the lower part of the semiconductor device (package). The structure of these packages is based on a semiconductor element such as a glass epoxy substrate or a polyimide substrate having a one-layer or multi-layer wiring structure. On the support substrate, the semiconductor element (wafer) is placed on the support, and the terminal on the semiconductor element side and the wiring board side terminal on the substrate are connected by wire bonding or flip chip bonding, the connection portion, and the upper surface portion or the end surface portion of the wafer. Sealed with an epoxy-based sealing material or an epoxy-based liquid sealing material, and metal terminals such as solder balls are arranged in an array of regions on the back surface of the wiring board. Further, adhesive tape is also used for QFN (Qua Flat Non-leaded Package) or SON (Small Outline Non-leaded Package). Next, a full-scale installation of a plurality of high-density packages described above is performed on the base of the electronic machine - 139-(135) (135) 1321868. Next, 'the wafer on which the lead frame is placed by the adhesive and the semiconductor element (wafer)' are connected by wire bonding to the terminal on the semiconductor element side and the lead frame terminal 'to seal the connection portion with an epoxy-based sealing material or an epoxy-based liquid sealing material, And the upper face or the end face of the wafer. Adhesive tapes are also used for the adhesives of such semiconductor devices. In Japanese Laid-Open Patent Publication No. 2001-284005, the method of electrically connecting the electrodes is to roll the adhesive tape coated with the adhesive material on the substrate into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape on which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed against the substrate or the like by a heating and pressing head from the substrate side of the adhesive tape wound from the adhesive tape, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, with the increase in the size of the panel image such as PDP, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. ☆ Moreover, since the adhesive is used, the adhesive is expanded. The amount of use has also increased. Therefore, the replacement of the adhesive tape tray of the manufacturing factory of the electronic machine is more frequent, because the replacement of the adhesive tape is very troublesome. Therefore, there is no problem that the -140- (136) 1321868 method improves the production efficiency of the electronic machine. In response to this problem, it is considered to increase the number of adhesive tapes of the adhesive tape to the disk to increase the adhesive amount per disk to reduce the frequency of replacement of the disk. However, since the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Moreover, if the number of rolls is increased, the pressure applied to the adhesive tape which is wound into a tape shape may increase, and the adhesive may leak out from both sides of the tape to cause blockage, or the diameter of the disk may increase in diameter. It is impossible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Secondly, if the adhesive tape is directly exposed to the adhesive tape, the quality may be degraded due to dust or moisture. Therefore, the object of the invention described in the items 52 to 58 is to provide an adhesive tape tray in which the replacement of the adhesive tape is relatively simple, and the production efficiency of the electronic device can be improved and the quality of the adhesive tape can be maintained. Next, an embodiment of the invention described in the items 52 to 58 will be described with reference to the drawings in the drawings, in which the adhesive tape for electrode connection is used as an example. However, the adhesive tape for connecting semiconductor elements is also the same. First, a first embodiment of the invention described in the 52nd to 58th paragraphs will be described with reference to Figs. 57A to A, 3, 4, 29, and 58. 57A to C are the adhesive tape trays of the first embodiment, and Fig. 57A is a perspective view of the adhesive tape tray, and Fig. 57B is a front view of Fig. 57, and Fig. 57C is the first 57 is a front view of the cover member of Fig. A, and Fig. 58 is a step view showing a method of manufacturing the adhesive tape. The adhesive tape sheet A of the present embodiment has a plurality of adhesives - 141 - (137) (137) 1321868, a roll portion 1 (hereinafter referred to as a roll portion) 2, 2a, and the roll portions 2, 2a have been rolled. Around the disc 3, 3a of the adhesive tape 1. Each of the disks 3, 3a is provided with a reel 5 and side plates 7, 7a, 7b disposed on both width sides of the adhesive tape 1. As shown in Fig. 3, the adhesive tape 1 is composed of a substrate 9 and an adhesive enamel applied to one side of the substrate 9. On the unused roll portion 2a, the cover member 8 covering the periphery of the adhesive tape 1 wound around the disk 3a is detachably attached to the disk 3a. Further, the side plate 7a on the inner side of the roll portions 2, 2a is provided with a accommodating portion (accommodating space) 1 2 of the desiccant 1 ,, and a desiccant 10 such as a sputum gel is accommodated in the storage section 1 2 for The inside of the unused roll portion 2a is removed from the strength and the peeling property of the adhesive to the different conductive material. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or The composition is PET (polyethylene terephthalate) or the like, but is not limited thereto. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthraquinone resin type. The conductive particles 13 can be dispersed. The conductive particles 13 are metal particles such as A-η, A g, P t, Ni, Cu, W·, S b, S η, solder, or the like, or carbon, graphite, etc. may also be in the foregoing and/or non- Conductive glass, ceramics, plastics, and the like are covered with a conductive material such as the above-mentioned conductive layer to form -142- (138) 1321868. Further, it is also possible to apply an insulating film, an insulating particle, an insulating particle or the like which covers the conductive particles with an insulating layer. When a conductive layer is formed on a molten metal such as solder or a polymer material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is reduced, so that the distance between the connections is reduced, and the connection can be increased. The area of circuit contact, and high reliability. In particular, it is preferable to use a polymer as a core material, such as a weld without a melting point, and a softening state can be controlled at a wide connection temperature to obtain a member which is easy to correspond to an error in thickness and flatness of the electrode. . Next, a description will be given of a method of using the adhesive tape of the present embodiment. As shown in Fig. 3, the adhesive tape tray A and the take-up f are attached to the adhesive device 15, and the beginning end of one of the adhesive tapes 1 is attached to the take-up reel 17 by the guide pin 22, and is unwound. Adhesive tape 1 3 arrow E). Next, the adhesive tape 1 is placed on the electric board 21, and the adhesive tape 1 is pressed by the heating and pressing head 1 9 φ material 9 disposed between the two trays 3 and 17 to press the adhesive 1 1 . The road substrate 21 is placed. Thereafter, the substrate 9 is taken up to the take-up reel 17». Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polytetra is placed. The olefin material 24 is used as a cushioning material, and the heating and pressing head 19 is used to heat and press the wiring circuit 2 of the circuit board 2. In this manner, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed to the edge of the PDP 26 and has a hot melt electrode.  Can be tinned, and the connection is carried out! 17 parts of the road (the base of the road from the base to the electricity of the fluorine fluoride 1 road base PDP week -143- (139) 1321868 circumference, the use of the adhesive 11 will be large The amount of the adhesive tape 1 is also used in a large amount, and the adhesive tape 1 wound on the discs 3, 3a is taken up to the take-up reel 17 in a relatively short period of time. When the end mark is exposed on the adhesive tape 1 of the one roll portion 2, it is replaced with the adhesive tape 1 of the new roll portion 2a. In the present embodiment, the cover member is disposed on the unused roll portion 2a. 8. After removing the cover member 8, the adhesive tape 1 is taken out and attached to the take-up reel 17. Thus, when one of the rolls 2 is completely unwound, the roll of the other can be rolled out. Since the adhesive tape 1 of the portion 2a is attached to the take-up reel 17 and the adhesive tape 1 is replaced, it is not necessary to apply the new adhesive tape to the adhesive device 15. Therefore, less new adhesive tape is required. Since the replacement work is performed, the production efficiency of the electronic device can be improved. Further, since the unused roll portion 2a is provided with a cover body In the member 8, the adhesive tape 1 is not directly exposed to the atmosphere, so that the adhesive tape 1 is less likely to cause a decrease in adhesion due to dust or moisture. Therefore, even when a plurality of rolls 2, 2a are provided, The cover member 8 can be disposed on the unused roll portion 2a to prevent the quality of the adhesive tape 1 from being lowered. Also, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive tapes can be taken up. The number of replacements of the take-up reel 17 is reduced, and the work efficiency is improved. 龀 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - On the substrate, an adhesive obtained by mixing a resin and conductive particles 13 is applied by coating a -144 - (140) 1321868 machine 27, and dried in a drying oven 29, and then taken up by a coiler 31. Original material. The original material of the adhesive tape that has been taken up is cut into a specific width by the cutter 33 and taken up to the reel. 'The side panels 7, 7a, 7b are mounted on the reel from both sides' and then the cover is applied. The installer of the body member 8 and the dehumidification material The management of the temperature (-5 ° C to -10 ° C) is carried out. Next, the other embodiments of the invention described in the fifth to fifth aspects will be described, and the same portions as the above-described embodiments will be attached. The same reference numerals are given to omit the detailed description of the parts, and the following description is mainly based on the difference from the above embodiment. In the second embodiment shown in Fig. 59, the cover body is mounted on the roll portions 2, 2a. The member 8 has a pull-out port 106 of the adhesive tape 1. At this time, since the adhesive tape 1 can be unwound from the pull-out opening 106 of the cover member 8, the cover member 8 without removing the rolled portions 2, 2a can also be The roll portions 2, 2a directly roll out the adhesive tape 1. φ In the third embodiment shown in Figs. 60 and A and B, the individual portions of the winding portions 2, 2a, and 2b are slidably attached to the shaft 107 of the body of the bonding device 15. Next, when all of the winding portions 2 are unwound, the cap 1 8' attached to the front end of the shaft 107 is removed, and the one winding portion 2 is removed from the adhesive device 15. Next, after the other roll portion 2a is moved to the adhesive position and the lid member 8 is removed, the adhesive tape 1 of the other roll portion 2a is wound up to the take-up reel 17, and the adhesive tape 1 is replaced. At this time, since the plural rolls 2, 2a, and 2b are different individuals, it is easy to handle. -145- (141) 1321868 In the fourth embodiment shown in Fig. 61, the roll portions 2, 2a, and 2b are different from each other, and the side plates 7 of the rolled portions 2, 2a, and 2b are formed in the same manner as in the third embodiment. And 7a are fitted to each other and attached to the adhesive device 15. As shown in Fig. 61, the side plate 7a of the other roll portion 2a is provided with a fitting portion 110' having a substantially cross-sectional shape and is disposed on the side plate 7 of one of the rolls 2 The joint portion 49 is fitted to the fitted portion 110 from the upper side, and both of them can be connected. When all of the rolled portion 2 is taken out from the adhesive device 15, φ ' can be released by lifting one of the rolled portions 2 upward, and the one of the rolled portions 2 can be easily removed. The invention described in the above paragraphs 52 to 58 is not limited to the above-described embodiments. Various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the above embodiment, the number of the rolls 2, 2a is not particularly limited, and may be any number. In the fourth embodiment, the side plates 7' to 7a are slid up and down to fit the one and the other of the roll portions 2, 2a. However, the side holes 7 may be formed with the fitting holes, and the other side may be formed on the other side. A fitting projection is disposed on the side plate 7a, and the fitting projection is press-fitted into the fitting hole from the width direction of the tape to fit the both. FIG. 31A and FIG. 3B are diagrams for attaching and fixing a semiconductor element to a fixing support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a connection between a wafer of a lead frame and a semiconductor element; One example of the L0C (Lead on Chip) structure of the support substrate and the lead frame for fixing the lead frame. -146- (142) 1321868 A double-sided support film 78 such as a polyimide film having a thickness of 50 is used, and an adhesive layer 80 having a polyaldimine adhesive layer having a thickness of 25 on both sides is used. The adhesive tape of the configuration shown in Fig. 31A provides a semiconductor device of the LOC structure shown in Fig. 31B. The adhesive tape shown in Fig. 31A is punched into a slender shape by a punching die 87 (male die (protrusion) 95, mother die (recess) 96) of the adhesive device shown in Figs. 32A to C. , for example, in thickness 〇. The lead frame of a 2 mm iron-φ nickel alloy was pressed at 400 ° C, a pressure of 3 MPa, and a pressure of 3 seconds to form a press. 2mm interval, 0. A lead frame having a thickness of 2 mm is formed as a lead frame with an adhesive film for a semiconductor. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the adhesive film for semiconductor, and then the gold wire is applied. The lead frame and the wire bonding of the semiconductor element are sealed by using a sealing material such as an epoxy resin molding material for continuous molding to obtain a semiconductor device shown in FIG. 31B. In Fig. 31A and Fig. A, 81% is an adhesive film for a semiconductor obtained by die-bonding tape, a 54-series semiconductor element, an 83-series lead frame, an 84-series sealing material, an 85-series welding wire, and an 86-series bus bar. Fig. 32A, B, and C are adhesion devices, and Fig. 32, Figs. A and B, 8 7 is a die-cutting die, 8 8 is a lead frame conveying portion, 61 is an adhesive tape punching and attaching portion, and 90 is a heater. Department, 91 series adhesive tape tape (adhesive tape roll-out part), 92-series adhesive tape (semiconductor adhesive film), 93-series adhesive tape roll-out roller. Further, in Fig. 32C, 94 is an adhesive tape (adhesive film for semiconductor), a 95-type male die (protrusion), and a 96-series master (concave) 97-type film presser. The adhesive tape 92 is continuously rolled out from the -147- (143) (143) 1321868 adhesive tape tray (adhesive tape roll-out portion) 91, and is punched into a slender shape at the adhesive tape punching and attaching portion 8 9 . Further, it is adhered to the lead portion of the lead frame, and is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport portion. The adhesive tape obtained by die cutting is taken out from the roller 93 by the adhesive tape. The semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape in the same manner as described above. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame are carried out in the same manner. Adhesive tape is only used for adhesion. When it is fixed, it can be contacted between electrodes or electrically connected with conductive particles. The adhesive to be used for the purpose is sometimes adhered to by the support film. Composition of the agent. Next, the invention described in the 59th item will be described. This invention relates to an adhesive for adhering an electronic component, a circuit board, or a circuit board to an electric circuit, and an adhesive for electrically connecting the electrodes between the electrodes to the circuit board. Next, the background art of the invention described in the ninth aspect will be described. Generally, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display panel), or a bare chip package, and a circuit board, Adhesive tape is used for the adhesion between the circuit boards and the electrical connection between the electrodes. Japanese Patent Publication No. 2 (>1 - 2 8 4 θ 0 5 discloses a disk in which an adhesive tape is applied to a substrate and an adhesive tape is taken up, and the adhesive tape is hereinafter referred to as a disk (hereinafter referred to as Used as an "adhesive plate" for use in an automatic bonding machine -148- (144) 1321868 The automatic bonding machine has a mounting portion of an adhesive disk, an empty disk mounting portion, and a heating device disposed between the disks. The pressing member and the table for placing the substrate pull the adhesive tape from the adhesive disk onto the substrate, and heat and press the adhesive tape from the back side of the substrate by the heating and pressing member to fix the adhesive. Pressed onto the substrate. However, 'the traditional automatic bonding machine is relatively large, and it is necessary to apply the adhesive on some of the substrates φ, when the area of the adhesive is small, or when it is temporarily pressed. Because it is relatively large, it has problems that are difficult to operate. On the other hand, if it is small and different from such a large automatic adhesive machine, it can be easily operated. Therefore, when it is partially or temporarily pressed, it is desirable to not use it. Large devices can implement adhesives Therefore, the object of the invention described in the 59th item is to provide an adhesive which is extremely small and can be handled by one hand, and it is easy to apply adhesive to one part of the substrate. An embodiment of the invention described in the ninth aspect will be described with reference to the drawings. Fig. 62A and B are the adhesive diagrams of the first embodiment of the invention described in the 59th item, and Fig. 62A is an adhesive. The oblique view, Fig. 62B is a cross-sectional view taken along line AA of Fig. 62, and Fig. 63 is a side view for explaining the use of the adhesive shown in Fig. 62A and B. Fig. 64 is an adhesive Step diagram of the manufacturing method. The main structure of the adhesive device 111 of the present embodiment is a disk (supply disk) 3, another disk (empty disk) 5, and a casing 99 for accommodating the disk, and one disk 3 The adhesive tape 1 is wound, and the adhesive tape 1 is -149-(145) 1321868 - the end 9a is fixed to the other disk 5. The casing 99 is formed by one hand and can be viewed from the side. When the corner has a curvature and is substantially triangular, it is easy to hold the shape. An opening portion 113 is formed in a corner portion of the slightly triangular casing 99, and the adhesive tape 9 is exposed from the opening portion 113. Further, the heating member 1 1 4 is protruded from the opening portion 1 1 3 when viewed from the side The heating member 114 is also slightly triangular in shape to guide the adhesive tape 1 drawn from the upper surface 13a along the lower surface 13b, and the lower side is provided with a heating plate Π 5. The heating member 1 1 4 has a rod shape. When the adhesive tape 9 is pulled down by covering the heating member 1 1 4 with the hot plate 115, the tape 9 can be smoothly pulled out by the rotation of the heating member 141. Further, if the outer surface of the hot plate 1 1 5 is equipped When PTFE, ruthenium rubber, or both are used, uniform pressure can be obtained when the adhesive 9 is pressed. The squares and the other casings 99 are housed in the casings by the half-shells 99a and 99b. A guide member 16 is disposed in the housing for guiding the movement of the adhesive tape 1. Further, on one of the bottom surfaces of either one of the casings 99a or 7b, a plate-shaped guide member is formed, and the adhesive is pressed to the circuit in the case where the guide member is pressed against the edge of the circuit substrate. In the substrate, the one of the discs 3 that is adhered to the circuit board with a high-precision adhesive is fixed on one side of the disc 3, and the other side of the disc 17 is coaxially fixed to the other side. 117, one of the gears 116 and the other of the gears 117 will be engaged with each other 'When a t S1 -150- (146) 1321868 disk 3 is rotated to cause the adhesive tape 1 to be pulled out, the other disk 17 will The rotation of the amount of the adhesive tape 1 is performed, and the substrate 9 is taken up. Further, the gear unit 118 is constituted by one gear 116 and the other gear 1 17 . Further, a third casing (power supply means) 119 for supplying electric power to the heating member 1 1 4 is disposed on the side surface of the casing 99. In addition to the storage of the dry battery, the third casing 119 accommodates the electric power adjustment φ circuit supplied to the heating member 1 14 . Further, the third housing 119 is provided with a power switch 120, and the finger of the hand holding the adhesive 111 can be turned on/off. As shown in Fig. 62B, the adhesive material 11 is coated on one side of the substrate 9 on the adhesive tape 1. In the present embodiment, the adhesive tape 1 has a length of about 20 m and a width W of about 1. 2 m m. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or PET treated with 矽# in terms of strength and releasability of the adhesive to the electrically conductive material. Ester) or the like, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the 'thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic type resin, and an anthracene resin type. ^ Conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc. -151 - (147) 1321868 ' or carbon, graphite, etc., and may be in the foregoing and/or non- Conductive glass, ceramics, plastics, and the like are formed by covering the conductive layer or the like with a polymer core material. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit, and can improve the reliability of the signal. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection Member Next, a method of using the adhesive 111 of the present embodiment will be described. As shown in Fig. 63, hold the adhesive 1 1 1 with one hand and cut the power switch 1 20 to ON. Next, the opening portion 113 exposing the adhesive tape 1 is pressed against the circuit substrate 27» because the heating member 1 1 4 4 is attached to the heating member 1 because the substrate 9 side of the adhesive tape 1 φ on the opening portion 11 is disposed. 1 4 The adhesive tape 1 on the lower side is subjected to heating and pressing of the adhesive 11 to the circuit board 27. When the adhesive device 111 is pressed downward, moving forward (arrow E in Fig. 63) 'will pull out the adhesive tape 1' sequentially, the heating member 114 will advance in the E direction, and at the same time, the new adhesive 9 will Located under the heating member-1 14, the adhesive is sequentially pressed to the circuit substrate 27. Thus, when the adhesive tape 1 is pulled out from one of the trays 3, the disk 3 is rotated, so that one of the disks 3 is coaxially fixed to one of the teeth - 152 - (148) 1321868 The wheel 116 also rotates. The gear 117 of the other of the teeth is also rotated, and the substrate 9 from which the adhesive 25 has been peeled is taken up to the other disk 17 °. In the present embodiment, the adhesive 1 1 is pressed. When it is to any position on the circuit board 27, as long as the adhesive 111 is held by one hand and pushed forward, the pressing of the adhesive 1 1 can be performed simply. In this way, since the adhesion of the adhesive 11 is very simple, it is particularly suitable, for example, when the electronic component (wiring circuit φ) 37 is temporarily adhered to the circuit board 27, or only one of the circuit boards 27 is subjected to an electronic component (wiring). When the circuit 37 is pressed. After the above-described pressing (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are positioned and connected. In the case of the connection of the circuit board 27 to the circuit board 27, the electronic component (wiring circuit) 3 is placed on the adhesive Π, and if necessary, the PTFE material 3 can be used as a cushioning material to heat. The pressurizing head i 9 applies heat and pressure Φ to the electronic component (wiring circuit) 37 to the circuit board 27 (see Fig. 4). In this manner, the electrode 27a of the fixed circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 can be connected. Further, since the upper adhesive tape 1 is housed in the casing 99 and used directly, it is easy to handle and has good workability. Here, a method of manufacturing the adhesive 1 j j of the present embodiment will be described with reference to Fig. 6 4 . On a substrate 23 which is taken up from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 28, dried in a drying furnace 29, and then wound up by a coiler 31. Take the original material. The original material of the adhesive tape taken up by -153-(149) 1321868 is cut into a specific width by the cutter 33 in the refurbishing step and taken up to the tray 3 to be sandwiched between the half-shells 99a and 9 9b. The method of fitting one side of the disc 3 and the other side of the disc (empty disc) 5, . Further, the third casing 119 in which the heating member 114 and the dry battery are housed is assembled to form the adhesive 1 1 1 . The adhesive 1 1 1 is bundled with the dehumidifying material, and the low temperature (-5 ° C to -1 (TC ) is managed and shipped. φ Next, the invention described in the 60th to 64th embodiments will be described. The adhesive tape for fixing the electronic component and the circuit board, or the circuit board, and the electrical connection between the electrodes, in particular, is related to the adhesive tape wound into a disk shape. The background art of the invention described in the above-mentioned section, which is described in the above-mentioned, is generally described as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display panel), an electronic component such as a bare chip package, and a circuit board, φ or a circuit board. The adhesive bonding between the electrodes and the electrical connection between the electrodes of the two are made of an adhesive tape. The Japanese Patent Publication No. 2001-284005 describes the winding of an adhesive tape coated with an adhesive on a substrate. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., Do not _ However, in recent years, with the enlargement of the panel image of PDP, etc., the adhesion area of the circuit board has also increased, and the amount of adhesive used at one time -154-(150) 1321868 has also increased. The expansion of the use of adhesives has also increased the number of adhesives. Therefore, the adhesive sheets of the manufacturing plants of electronic machines are frequent, because the replacement of the adhesive sheets is very troublesome, and there is a problem that the production efficiency of the sub-machines cannot be solved. It is conceivable to increase the number of rolls that are taken up to the disk to increase the amount of adhesive per disk' to reduce the disk rate. However, since the thickness of the adhesive tape is thick, it is difficult to increase the number of turns of Φ. Further, if it is considered to reduce the thickness of the adhesive tape, since the ruthenium-treated PET (polyethylene terephthalate) is used as the substrate, if the thickness is too thin, the substrate may be easily stretched or broken. The purpose of the invention described in the 60th to 64th is that the adhesive tape can be used to increase the number of rolls per disk, thereby improving the electronic production efficiency. Next, referring to the appendix, for the 60th to 64th The embodiment described in the item # is described with reference to FIGS. 65A, B, 3, 29, and 5, and the first embodiment described in the 60th to 64th embodiments will be described. And B is the first actual adhesive tape diagram, and Fig. 65A is an oblique view of the adhesive tray. Figure B is the AA cross-sectional view of Fig. 65A. The adhesive tape 1 is wound on the tray 3, on the tray 3. The side plate 7 disposed on both width sides of the adhesive tape 1 is disposed. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. The tape replacement frequency is used for the substrate per one disk. The invention of the first aspect of the invention is provided, and the configuration of the fourth invention, the 65th: the reel 5, one side - 155- (151) 1321868, the substrate 9 is made of a copper film ( Copper foil). The thickness of the substrate 9 (S in FIG. 65B) is 10/zm, the tensile strength at 25° C. of the substrate 9 is 500 MPa, and the thickness ratio (S/T) of the substrate 9 to the adhesive 11 is 0. 5. The thickness of the adhesive 11 is 20/zm. The surface roughness of the substrate 9 is Rinax of 0 · 2 5 // m. Further, an aromatic polyimide film (MICTRON) was also used as the substrate 9. In the production, the thickness of the substrate 9, the tensile strength, and the thickness ratio (S/T) of the substrate 9 to the adhesive 11 are the same as those of the copper film. Next, the method of using the above-mentioned adhesive tape will be described. As shown in Fig. 3, the disc 3 of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3 is attached to the front end via the guide pin 22. The reel 17 is taken up and the adhesive tape 1 (arrow E in Fig. 3) is taken out. Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressure-bonded from the substrate 9 side to the heating and pressing heads 19 disposed between the two trays 3, 17 to press the adhesive 11 To the circuit board φ 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, the wiring circuit (or electronic member) 23 is pressed onto the adhesive 11 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as a buffer material to heat the pressurizing head 19 pair. The circuit board 21 performs heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. --- As for the 29th zombie benefit - as shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed against the entire periphery of the PDP, and the adhesive used once is known. The usage of 11 will be much larger than the traditional -156- (152) 1321868 usage. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time, thereby Disk 3 becomes empty. When the disc 3 becomes empty, the used disc 3 and the new disc are replaced, and the new disc is attached to the adhesive device 15. Next, as described above, the action of pressing the adhesive 11 to the circuit substrate 21 and winding the substrate 9 to the take-up reel 17 is repeated. As a result of φ, the use of a copper film as the substrate 9 and the use of the aromatic polyimide film as the substrate 9 were all handled as easily as the conventional adhesive tape 1, and there was no problem that the substrate 9 was stretched or broken. Secondly, the thickness of the adhesive tape is increased relative to the thickness of the substrate 11 which is thinner than the conventional product (50 / i m ), so that the frequency of replacement of the disk can be reduced to improve productivity. Here, a method of manufacturing the adhesive tape i of the present embodiment will be described with reference to Fig. 5 . The adhesive 11 mixed with the resin and the conductive particles 13 is applied onto a substrate unwound from the unwinding machine 25 by a coating φ machine 27, and dried in a drying furnace 29, and then taken up by a winding machine 31. Take the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel 5 from both sides, and are bundled together with the dehumidifying material. , the implementation of low temperature (_ 5 art ~ _ 〇 t) management and shipment. Further, the adhesive tape 1 was produced for the copper film of the substrate 9 having a thickness of 4/m, 20 μm, 25; tzm and an aromatic polyamide film, and as described above, the substrate 9 did not occur. Problems such as stretching or breaking. -157- (153) 1321868 Further, the thickness ratio (S/T) of the substrate 9 to the adhesive 1 1 is 0·01, 0. 05, 1. The copper film of 0 and the aromatic polyamide film were used to produce an adhesive tape i. As described above, the problem of stretching or breaking of the substrate 9 did not occur. Next, the invention described in the items 65 to 66 will be described. These inventions relate to a method of forming an adhesive material of an adhesive tape between an electronic component and a circuit board, or a circuit board, and an electrode between the electrodes. Further, it is an adhesive material for an adhesive tape used for a semiconductor device in which a semiconductor element (wafer) is adhered and fixed to a fixing support substrate of a lead frame or a wafer of a lead frame or a semiconductor device mounting substrate. The method, in particular, relates to a method of forming an adhesive material that is rolled into a disk-shaped adhesive tape. Next, the background art of the invention described in the items 65 to 66 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (#fluorescent display) panel, a bare chip package, a circuit board, or a circuit board, or an electrode between the circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Further, the adhesive tape is also applied to a lead frame fixing tape of a lead frame, a LOC tape's die-bonding tape, an adhesive film such as micro BG A · CSP, etc., and the purpose thereof is to improve the productivity and reliability of the entire semiconductor device. . Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with a material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to -158-(154) 1321868 is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive material disc is used up, the used disc φ and the take-up reel of the take-up substrate are removed, the new adhesive disc and the new take-up tray are loaded to the adhesive device, and will be adhered. The beginning of the material tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive material tray is very troublesome, so there is a problem that the production efficiency of the electronic machine cannot be improved. φ For this problem, it is considered to increase the winding up to The number of rolls of adhesive tape on the plate is used to increase the adhesive dose per plate to reduce the frequency of replacement of the disk. However, if the number of rolls of the adhesive tape is increased, the size of the winding tape of the adhesive tape of the disk (hereinafter referred to as The "winding diameter" is also large, and it may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the purpose of the invention described in the items 65 to 66 is to provide an adhesive. The method of forming the material tape can improve the production efficiency of the electronic machine without increasing the winding diameter of the adhesive tape. -159- (155) 1321868 Next, an embodiment of the invention described in the items 65 to 66 will be described with reference to the attached drawings. Refer to Figure 66 A and B, Figure 67, Figure 68, Figure 4, Figure 29, and Figure 5 for items 65-66. The first embodiment of the invention described will be described. Fig. 66 is a flow chart showing the steps of forming an adhesive tape of the adhesive tape according to the first embodiment, and Fig. 66A is a step of integrally laminating the adhesive tapes and winding one of the substrates onto the take-up reel. Figure 66 is a cross-sectional view of the overlap between the adhesives of Fig. 66, Fig. 66, and Fig. 67 is a schematic view of the step of forming the adhesive of the adhesive device on the covering, Fig. 68 FIG. 4 is a cross-sectional view showing the adhesion between the circuit boards, FIG. 29 is a perspective view showing the state of use of the adhesive of the PDP, and FIG. 5 is a manufacturing method of the adhesive tape. Step diagram. The adhesive tape 1 is wound around the discs 3, 121, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 121. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side surface φ of the substrate 9. In terms of strength and adhesion of the adhesive, the substrate 9 should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate), however Not limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a stupid vinyl resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type -160- (156) 1321868 The conductive particles 13 may also be dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A polymer core material such as plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot-melt metal such as solder or a polymer core material such as plastic, deformability due to deformation due to heating, pressurization, or pressurization is reduced, so the distance between electrodes after connection is reduced. It increases the area of contact with the circuit and improves reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 66A, the disc 3, φ121, and the reeling discs 17, 18 for the two adhesive tapes 1 are attached to the adhesive device 15, and the adhesive material wound on one of the discs 3 is attached. The front end of the tape 1 is attached to one of the take-up reels 17 via the guide pins 22, and the adhesive tape is unwound (Fig. 66A, arrow A). Further, the front end of the adhesive tape 1 wound on the other disk 121 is also attached to the other take-up reel 18, and the adhesive tape 1 is rolled out. The adhesive tape 1 which is unwound from the discs 3, 121 1 The pressure-sensitive adhesive tapes 1 disposed between the disks 3 and 121 and the heating and pressing head 19 are used to overlap the adhesive tapes 1 . Next, the base -161 - (157) 1321868 material 9 of the other adhesive tape 1 is taken up to the take-up reel 18. Then, one of the adhesive tapes 1 is placed on the circuit board 21, and the pressure-adhesive tape 1 is pressed against the substrate 9 by the heating and pressing head 19, and the adhesive 11 is pressed against the circuit board 21 of the covering. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in FIG. 4, the adhesion on the circuit substrate 21 is pressed.

著劑1 1上配置配線電路（或電子構件）2 3，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會被壓著至PDP 26之周 圍全體，一次使用之黏著劑11的使用量會遠大於傳統上 之使用量。因此，捲繞於盤3、121之黏著材膠帶1之使 用量亦會增多，捲繞於盤3、121之黏著材膠帶1會在相 φ 對較短之時間內被捲取至捲取盤17、18。 此實施形態時，將黏著劑11壓著至電路基板21之前 一步驟中，會使一方之黏著材膠帶1之黏著劑11、及另 一方之黏著材膠帶1之黏著劑11重疊，得到期望之黏著 劑11之厚度後，再將黏著劑11壓著至電路基板21，故 各黏著材膠帶1之厚度只要一半即可。因此，可增加每1 盤之黏著材膠帶1之捲數，而可大幅增加1次更換作業之^ 可使用的黏著劑量。因此，只需較少之新黏著材膠帶1之 更換作業，故可提高電子機器之生產效率。 -162- (158) 1321868 此處’參照第5圖’針對本實施形態之黏著材膠帶之 製造方法進行說明。 在to捲出機25捲出之基材（separator) 9上，以厚 度爲通常之大約一半的方式利用塗布機27塗布由樹脂及 導電粒子1 3混合而成之黏著劑n，並以乾燥爐2 9實施 乾燥後’以捲取機31捲取原始材料。被捲取之黏著材膠 帶1之原始材料，以切割機33切成特定寬度並捲取至捲 φ 軸5後，從兩側將側板7、7裝著於捲軸5上，將其和除 濕材一起綑包，實施低溫（-5 t：〜-1 〇 °C )之管理並進行 出貨。又’黏著材膠帶1亦可以爲黏著劑丨丨中含有後述 之硬化劑者。 其次，針對第65〜66項記載之發明之其他實施形態 進行說明’以下說明之實施形態中，和上述實施形態相同 之部份會附與相同符號並省略該部份之詳細說明，以下之 說明係以和上述實施形態不同之點爲主。 φ 第69圖A所示之第2實施形態時，亦可製作黏著劑A wiring circuit (or electronic component) 23 is disposed on the agent 1 1 , and the polytetrafluoroethylene material 24 is used as a buffer material, and the heating and pressing head 19 is used to heat and press the wiring circuit 23 on the circuit board 2 1 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed to the entire periphery of the PDP 26, and the amount of the adhesive 11 used at one time is large. Traditionally used. Therefore, the amount of the adhesive tape 1 wound around the discs 3, 121 is also increased, and the adhesive tape 1 wound around the discs 3, 121 is taken up to the take-up reel in a short period of phase φ. 17,18. In this embodiment, in the first step before the pressure-sensitive adhesive 11 is pressed against the circuit board 21, the adhesive 11 of the adhesive tape 1 and the adhesive 11 of the other adhesive tape 1 are superimposed, and the desired one is obtained. After the thickness of the adhesive 11 is applied, the adhesive 11 is pressed against the circuit board 21, so that the thickness of each of the adhesive tapes 1 is only half. Therefore, the number of rolls of the adhesive tape 1 per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, less replacement work of the new adhesive tape 1 is required, so that the production efficiency of the electronic machine can be improved. -162- (158) 1321868 Here, a method of manufacturing the adhesive tape of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 to be unwound 25, an adhesive n mixed with a resin and conductive particles 13 is applied by a coater 27 so as to have a thickness of about half a normal thickness, and dried in a drying oven. 2 9 After drying, the original material is taken up by the coiler 31. The original material of the adhesive tape 1 taken up is cut into a specific width by the cutter 33 and taken up to the roll φ axis 5, and the side plates 7, 7 are attached to the reel 5 from both sides, and the dehumidifying material is attached. Packing together and implementing low temperature (-5 t: ~-1 〇 °C) management and shipping. Further, the adhesive tape 1 may contain a curing agent to be described later in the adhesive. In the following, the embodiments of the invention described in the above-mentioned embodiments are described with the same reference numerals, and the detailed description of the parts will be omitted, and the following description will be omitted. It is mainly different from the above embodiment. φ In the second embodiment shown in Fig. 69A, an adhesive can also be produced.

Ua含有硬化劑及導電粒子13之黏著材膠帶la、及不含 有硬化劑及導電粒子13之黏著材膠帶lb，如第69圖A 所示，使含有硬化劑等之黏著材膠帶la、及不含有硬化 劑等之黏著材膠帶lb重疊成一體，再將重疊之物壓著至 電路基板21。此時，因爲只有一方之黏著材膠帶la之黏 著劑11a含有硬化劑，另一方之黏著材膠帶lb之黏著劑 1 1 b即無需含有硬化劑。因此，未含有硬化劑之黏著劑 lib之黏著材膠帶lb無需實施低溫管理。 -163- (159) 1321868 因此，可減少需要低溫管理之黏著材膠帶1 a之數， 黏著材膠帶之運送及保管可實現較有效率之管理。 又，黏著劑爲環氧樹脂系時，環氧樹脂之硬化劑應爲 .咪唑系、胺醯亞胺、銨鹽、聚胺類、及聚硫醇等。 又，如第69圖B所示，含有硬化劑之一方之黏著材 膠帶la之黏著劑11a含有導電粒子13而爲2層構成，因 被壓著側未含有導電粒子，樹脂會流動，不會從導電粒子 φ 相對峙之電路間流出，加熱加壓時可確實使導電粒子13 保持留在電極21a及電極23a之間。 第65〜66項記載之發明並未受限於上述之實施形態 ，第65〜66項記載之發明之要旨的範圍內，可實施各種 變形。 第1實施形態時，黏著劑1 1係含有導電粒子1 3，然 而，亦可以爲未含有導電粒子13之黏著劑11。 上面所述係針對電子構件及電路基板、以及電路基板 Φ 間之黏著固定時進行說明，然而，亦可應用於將半導體元 件（晶片）黏著·固定於引線框架之固定用支持基板、引 線框架之晶片、或半導體元件載置用支持基板之半導體裝 置上。 其次，針對第67〜72項記載之發明進行說明。 這些發明係關於例如液晶面板、PDP面板、EL面板 —、裸晶片封裝等之電子構件及電路板、或電路板間之黏著 固定、以及以提供用以實施兩者之電極間之電性連接之向 異導電材爲目的之向異導電材膠帶，尤其是，和向異導電 -164- (160) 1321868 材之捲取形態相關。 其次，針對第67〜72項記載之發明之背景技 說明。 利用向異導電材膠帶之電子構件及電路板、或 間之連接方法，係利用相對峙之電極間夾著膜狀黏 向異導電材，以加熱加壓實施電子構件及電路板、 板間之連接。膜狀之黏著劑中，混合著以實現電極 φ 通爲目的之導電粒子，採用之樹脂爲熱可塑性樹脂 化性樹脂、熱可塑性樹脂及熱硬化性樹脂之混合物 光硬化性樹脂（例如，參照日本特開昭5 5 · 1 0 4 0 0 7 )° 又，採用不含導電粒子而只由樹脂所構成之向 材的電路連接方法亦爲大家所熟知（例如，參照曰 昭60-26243 0號公報）。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂 • 表，又，熱硬化性樹脂系則以環氧樹脂系、矽樹脂 壓克力樹脂系爲代表。熱可塑性樹脂系及熱硬化性 之連接上，皆需要實施加熱加壓。其目的係爲了使 性樹脂系之樹脂流動並得到和被覆體間之密著力、 了使熱硬化性樹脂系能獲得進一步之樹脂之硬化反 年來，以連接信賴性之角度而言，係以熱可塑性樹 硬化性樹脂之混合物、及熱硬化性樹脂系爲主流。 以低溫度實施連接之光硬化樹脂系亦開始被應用於 術進行 電路板 著劑之 或電路 間之導 、熱硬 、以及 號公報 異導電 本特開 系爲代 系、及 樹脂系 熱可塑 以及爲 應。近 脂及熱 又，可 工業上 -165- (161) 1321868 又，近年來，爲了防止被連接體之反翹及伸展，要求 向異導電材之連接時之連接溫度的低溫化。又，隨著向異 導電材之連接用途的擴大、以及液晶面板、PDP面板、 EL面板 '及裸晶片封裝等之需要的擴大，對連接時之工 作時間之短時間化的要求愈來愈強。Ua contains the adhesive tape la of the hardener and the conductive particles 13, and the adhesive tape lb which does not contain the hardener and the conductive particles 13, as shown in Fig. 69A, the adhesive tape la containing the hardener, etc. The adhesive tape lb containing a curing agent or the like is superposed and integrated, and the overlapped object is pressed against the circuit board 21. At this time, since only one of the adhesive tapes 11a of the adhesive tape la contains a hardener, the adhesive 1b of the other adhesive tape lb does not need to contain a hardener. Therefore, the adhesive tape lb which does not contain the hardener adhesive lib does not need to be subjected to low temperature management. -163- (159) 1321868 Therefore, the number of adhesive tapes 1 a requiring low temperature management can be reduced, and the transportation and storage of the adhesive tape can achieve more efficient management. Further, when the adhesive is an epoxy resin, the curing agent of the epoxy resin should be an imidazole type, an amine imide, an ammonium salt, a polyamine, or a polythiol. Further, as shown in Fig. 69B, the adhesive 11a containing the adhesive tape la of one of the curing agents contains the conductive particles 13 and is composed of two layers. Since the pressed side does not contain the conductive particles, the resin flows and does not flow. When the conductive particles φ flow out between the circuits of the crucible, it is possible to surely keep the conductive particles 13 between the electrodes 21a and the electrodes 23a during heating and pressurization. The invention described in the sixth to sixth embodiments is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the invention described in the sixth to sixth embodiments. In the first embodiment, the adhesive 11 contains the conductive particles 13 or, however, the adhesive 11 not containing the conductive particles 13 may be used. The above description is for the case where the electronic component, the circuit board, and the circuit board Φ are fixed to each other. However, the present invention can also be applied to a fixing support substrate or a lead frame in which a semiconductor element (wafer) is adhered and fixed to a lead frame. The wafer or the semiconductor device on which the semiconductor element is mounted is supported. Next, the invention described in the items 67 to 72 will be described. These inventions relate to electronic components and circuit boards such as liquid crystal panels, PDP panels, EL panels, bare die packages, and the like, or to adhesion between circuit boards, and to provide electrical connections between electrodes for performing the two. The dissimilar conductive tape for the purpose of the dissimilar conductive material, in particular, is related to the rewinding pattern of the heteroconductive-164-(160) 1321868 material. Next, the background of the invention described in the items 67 to 72 will be described. By using an electronic component to a different-conductive tape, a circuit board, or a connection method between the electrodes, the film is adhered to the different conductive material between the electrodes of the opposite conductive layer, and the electronic component, the circuit board, and the board are heated and pressurized. connection. In the film-like adhesive, conductive particles for the purpose of achieving electrode φ are mixed, and the resin used is a mixture of a thermoplastic resinizable resin, a thermoplastic resin, and a thermosetting resin (for example, refer to Japan). JP-A-Chao 5 5 · 1 0 4 0 0 7 ) ° Also, a circuit connection method using a conductive material and containing only a resin is known (for example, refer to 曰昭 60-26243 0 Bulletin). The thermoplastic resin is a styrene resin or a polyester resin. The thermosetting resin is represented by an epoxy resin or a enamel resin. Both the thermoplastic resin and the thermosetting bond are required to be subjected to heat and pressure. The purpose is to make the resin-based resin flow and obtain a close contact with the covering, and to make the thermosetting resin capable of obtaining further hardening of the resin, and to use heat in terms of connection reliability. A mixture of a plastic tree curable resin and a thermosetting resin are mainly used. Photohardenable resin systems that are connected at low temperatures have also been used for circuit board coating or inter-circuit conduction, thermosetting, and isoelectric conductivity, and resin-based thermoplastics. It should be. In addition, in recent years, in order to prevent the warpage and extension of the connected body, the connection temperature at the time of connection to the different conductive material is required to be lowered. In addition, with the expansion of the use of the conductive material and the expansion of the requirements for the liquid crystal panel, the PDP panel, the EL panel, and the bare chip package, the demand for short-term operation time at the time of connection is becoming stronger. .

又，隨著向異導電材之連接需要及用途之擴大，不但 要求短時間之連接，尙要求能提高生產性。因爲液晶面板 、PDP面板、EL面板、及裸晶片封裝等之需要的擴大， 向異導電材之使用量亦增加。另一方面，隨著液晶面板之 大畫面及PDP面板等大畫面平板之需要的擴大，向異導 電材之1片面板所使用之使用量亦增加。傳統上，向異導 電材之提供係採用將膜狀之黏著劑重疊捲繞於剖面爲圓形 芯材上的盤形狀，盤之更換時間妨礙生產性之提高。 另一方面，隨著液晶面板之細邊緣化，向異導電材亦 朝狹窄化發展，傳統上捲繞於同一圓芯狀之盤形狀很容易 發生捲取散亂，進而導致製造步驟之廢料率的惡化。 有鑑於上述缺點，第67〜72項記載之發明的目的， 係在提供一種向異導電材膠帶，可延長盤之更換時間之間 隔，且以避免捲取散亂所導致之作業性的降低，而可提高 生產性。 其次，針對第67〜72項記載之發明之實施形態進行 說明。- " 第70圖係第67〜72項記載之發明之第1實施形態之 模式圖。 -166- (162) 1321868 如第7〇圖所示，本實施形態之向異導電材膠帶，係 將由膜狀黏著劑11、及兩面經過剝離處理之基材膜（基 材）9之2層構造所構成之向異導電材，以多捲數方式積 層於芯材5之縱向上而成爲捲線狀，第70圖係向異導電 材之供應形態。第70圖中，芯材5之兩端部分別配設著 側板7。又，向異導電材膠帶係由基材膜9、及塗布於基 材膜9上之向異導電材之膜狀黏著劑11所構成，向異導 φ 電材膠帶因係應用於高精細化之電子構件之連接上，爲了 防止無機及有機物之異物及污染，基材膜9會位於黏著劑 之外側。 採用向異導電材之連接上，要求縮短工作時間，且要 求向異導電材之迅速轉錄性。如上面所述，將向異導電材 以多捲數方式積層於附有側板7之芯材（捲軸）5之縱向 上而成捲線狀，可提供不會發生捲取散亂之長方形向異導 電材。因此，可延長向異導電材膠帶之更換時間之間隔而 • 提高生產性。 上述向異導電材膠帶時，基材膜9之拉伸強度應爲 12kg/mm2以上、基材膜9之斷裂伸展應爲60〜200%。因 此，基材膜9因爲具有強度且伸展較小，在將構成向異導 電材之膜狀黏著劑11轉錄至電路基板等連接構件之前的 過程中，可防止膜狀黏著劑1 1伸展、厚度變薄、以及寬 度變細。又，以處理及環境保護之角度而言，基材膜9之 厚度應爲1〇〇//m以下。因爲基材膜9太薄會導致上述效 果之劣化，故基材膜9之厚度應爲0.5/zm以上。 -167- (163) 1321868 其次’上述向異導電材膠帶所採用之基材膜9,從強 度、及構成向異導電材之黏著劑之剝離性的角度而言，應 採用經過矽及氟剝離處理之PP(聚丙烯）、〇PP(延伸聚 丙烯）、及PET (聚對苯二甲酸乙二酯）等，然而，並不 限於此。Further, as the connection to the different conductive material is required and the use is expanded, not only a short connection is required, but also productivity is required. Since the demand for liquid crystal panels, PDP panels, EL panels, and bare chip packages has increased, the amount of use of the conductive material has also increased. On the other hand, with the expansion of large screens such as liquid crystal panels and large-screen panels such as PDP panels, the amount of use for one panel of an isoelectric material has also increased. Conventionally, the supply of the conductive material has a disk shape in which a film-like adhesive is superposed and wound on a circular core material, and the replacement time of the disk hinders the improvement of productivity. On the other hand, with the thinning of the liquid crystal panel, the conductive material is also narrowed, and the shape of the disk which is conventionally wound in the same core shape is liable to be wound up, which leads to the scrap rate of the manufacturing step. Deterioration. In view of the above-mentioned drawbacks, the object of the invention described in the items 67 to 72 is to provide a tape for the electrically conductive material, which can extend the interval between replacement times of the disk and prevent the workability from being caused by the disorder of the winding. It can improve productivity. Next, an embodiment of the invention described in the items 67 to 72 will be described. - Fig. 70 is a schematic view showing a first embodiment of the invention described in the items 67 to 72. -166- (162) 1321868 As shown in Fig. 7 , the conductive adhesive tape of the present embodiment is composed of a film adhesive 11 and a base film 9 (substrate) 9 which has been subjected to release treatment on both sides. The conductive material composed of the structure is laminated in the longitudinal direction of the core material 5 in a multi-volume manner to form a winding shape, and FIG. 70 is a form of supply to the different conductive material. In Fig. 70, the side plates 7 are respectively disposed at both end portions of the core member 5. Further, the dissimilar conductive material tape is composed of the base film 9 and the film-like adhesive 11 applied to the base film 9 to the different-conductive material, and the isotropic conductive material tape is applied to the high-definition material. In order to prevent foreign matter and contamination of inorganic and organic substances, the base film 9 is located on the outer side of the adhesive. The use of a connection to a different electrically conductive material requires a shortened working time and requires rapid transcription to the electrically conductive material. As described above, the conductive material is laminated in a plurality of windings in the longitudinal direction of the core material (reel) 5 to which the side plate 7 is attached, and the rectangular conductive material which can be wound and scattered can be provided. material. Therefore, it is possible to extend the interval between replacement of the different conductive tapes. • Improve productivity. In the case of the above-mentioned conductive material tape, the tensile strength of the base film 9 should be 12 kg/mm2 or more, and the fracture stretch of the base film 9 should be 60 to 200%. Therefore, since the base film 9 has a small strength and a small stretch, the film-like adhesive 1 1 can be prevented from stretching and thickening before the film-like adhesive 11 constituting the different-conductive material is transcribed to a connecting member such as a circuit board. Thinner and thinner. Further, the thickness of the base film 9 should be 1 Å/m or less from the viewpoint of handling and environmental protection. Since the substrate film 9 is too thin to cause deterioration of the above effects, the thickness of the substrate film 9 should be 0.5/zm or more. -167- (163) 1321868 Next, the base film 9 used for the above-mentioned conductive adhesive tape should be peeled off by bismuth and fluorine from the viewpoint of the strength and the peeling property of the adhesive to the different conductive material. Treated PP (polypropylene), hydrazine PP (stretched polypropylene), and PET (polyethylene terephthalate), etc., however, it is not limited thereto.

基材膜9之剝離處理，以矽或氟處理即可實現，只在 基材膜9之單面實施剝離處理的話，可使基材膜9之表面 及背面具有不同之脫模性，而可防止對基材膜9之背面轉 錄。又，對基材膜9之兩面實施剝離處理時，對膜狀黏著 劑1 1面實施矽及氟處理，而使膜狀黏著劑1 1面具有剝離 性。The release treatment of the base film 9 can be carried out by treatment with hydrazine or fluorine. When the release treatment is performed on only one side of the base film 9, the surface and the back surface of the base film 9 can have different release properties. The back side of the substrate film 9 is prevented from being transcribed. Further, when the both surfaces of the base film 9 are subjected to the release treatment, the surface of the film-like adhesive 1 1 is subjected to a ruthenium treatment and a fluorine treatment to impart a peeling property to the surface of the film-like adhesive 11 .

膜狀之黏著劑1 1係使用具高信賴性之熱硬化性樹脂 系之環氧樹脂系、以黏著劑之低應力化爲目的而且具有良 好黏著劑相溶性之矽樹脂系、以及可以較上述爲低之溫度 及較短之時間實施連接之自由基系之物，然而，膜狀之黏 B著劑並未受限於此。自由基系之黏著劑1 1係以壓克力系 黏著劑爲主。 第71圖係第67〜72項記載之發明之第2實施形態的 模式圖。又，第71圖中，和第70圖相同之構成要素會附 與相同符號並省略詳細說明。 如第71圖所示，本實施形態之向異導電材膠帶有2 種基材膜，除了採用以前述基材模夾住黏著劑之方式構成 之向異導電材以外，其餘構成和第1實施形態之向異導電 體膠帶相同。亦即，本實施形態之向異導電材如第7 1圖The film-like adhesive 1 1 is an epoxy resin based on a thermosetting resin having high reliability, a resin having a good adhesive compatibility for the purpose of reducing the stress of the adhesive, and the like. The attached radicals are carried out at a low temperature and for a short period of time, however, the film-like adhesive B is not limited thereto. The free radical adhesive 1 1 is mainly composed of an acrylic adhesive. Figure 71 is a schematic view showing a second embodiment of the invention described in the items 67 to 72. In the seventh embodiment, the same components as those in FIG. 70 will be denoted by the same reference numerals and will not be described in detail. As shown in Fig. 71, the dissimilar conductive material tape of the present embodiment has two types of base material films, and the other configuration and the first embodiment are the same except that the conductive material is sandwiched between the substrate molds. The shape of the different conductor tape is the same. That is, the dissimilar conductive material of the present embodiment is as shown in FIG.

-168- (164) (164)-168- (164) (164)

1321868 所示，係由膜狀之黏著劑11、及黏著劑11面實施 處理之2種基材9a、9b之3層構造所構成。 構成向異導電材之黏著劑較軟時，可以利用捲_ 如下所示之基材膜來防止黏著劑變形。 其次，基材膜9a、9b之物性値上，基材膜9a、 拉伸強度應爲1 .2kg/mm2以上、基材膜9a、9b之圏 展應爲60〜200%之理由，和第1實施形態時相同。 此方式，基材膜9a、9b可得到物理強度，而可防it 膜狀黏著劑之伸展而產生薄膜化、以及寬度方向之變 又’基材9a、9b之厚度應爲100/zm以下，如此， 作及環境保護都可有良好之對應。 又’上述第1及第2實施形態時，若構成向異_ 之膜狀黏著劑11爲無粘著性且不會出現阻塞現象宅 可在無基材膜9或9a、9b之狀態下單獨其膜狀黏著 捲成捲線狀。 以下，針對實施例進行說明，然而，第67〜72 載之發明並未受限於這些實施例。 (實施例1 ) (1)向異導電材膜之製作 製作乙酸乙酯之30重量百分率溶液，對其添 粒徑爲2.5〆《!、5體積百分率之Ni粉。其次，上 乙酯溶液添加當做膜形成材之苯氧基樹脂（高分子 樹脂）50g、環氧樹脂20g、及咪唑5g，得到黏著 !剝離 丨側之 9b之 :裂伸 利用 .因爲 :細。 在操 :電材 ，則 劑11 項記 平均 乙酸 環氧 形成 -169- (165) 1321868 用溶液。另一方面，準備在著色成淡藍色之透明、厚度爲 50 y m之聚對苯二甲酸乙二酯膜（斷裂強度爲25kg/mm2 、斷裂伸展爲130%)之兩面實施矽處理之基材膜。其次 ，在此基材膜之單面上以滾塗機塗布上述溶液，實施110 °(：之5分鐘乾燥，得到厚度50/zm之向異導電材膜的捲 繞物。1321868 is composed of a three-layer structure of two types of substrates 9a and 9b which are treated by a film-like adhesive 11 and an adhesive 11 surface. When the adhesive constituting the conductive material is soft, the substrate film shown below can be used to prevent the adhesive from being deformed. Next, the physical properties of the base film 9a, 9b, the base film 9a, the tensile strength should be 1.2 kg / mm2 or more, and the substrate film 9a, 9b should be 60 to 200%, and 1 is the same in the embodiment. In this manner, the substrate films 9a and 9b can obtain physical strength, and can prevent the film-like adhesive from being stretched to cause film formation and the width direction to change. The thickness of the substrates 9a and 9b should be 100/zm or less. In this way, there is a good correspondence between environmental protection and environmental protection. Further, in the first and second embodiments described above, the film-like adhesive 11 constituting the opposite direction is non-adhesive and does not have a clogging phenomenon, and can be separately in the state without the substrate film 9 or 9a, 9b. The film-like adhesive is wound into a coil shape. Hereinafter, the embodiments will be described, however, the inventions contained in the 67th to 72th are not limited to these embodiments. (Example 1) (1) Preparation of a film of an isoelectric material A 30 wt% solution of ethyl acetate was prepared, and a particle size of 2.5 Å "!, 5 volume percent of Ni powder was added thereto. Next, the upper ethyl ester solution was added with 50 g of a phenoxy resin (polymer resin) as a film-forming material, 20 g of an epoxy resin, and 5 g of an imidazole, and it was adhered to the side of the ruthenium side 9b: cracking and stretching. In the operation: electric material, the agent 11 items average acetic acid epoxy to form -169- (165) 1321868 solution. On the other hand, a substrate subjected to ruthenium treatment on both sides of a polyethylene terephthalate film (breaking strength of 25 kg/mm2 and breaking elongation of 130%) which is colored in a light blue color and has a thickness of 50 μm is prepared. membrane. Next, the solution was applied to one surface of the base film by a roll coater, and dried at 110 ° (for 5 minutes to obtain a wound of a conductive conductive film having a thickness of 50 / zm).

(2)向異導電材膠帶之製作 將上述向異導電材膜之捲繞物切割成寬度K5mm，以 多捲數方式積層於附有側板之直徑48mm、寬度100mm之 芯材（捲軸）之縱向上而成爲捲線狀，得到300m長度之 向異導電材膠帶。 將此捲繞成捲線狀之向異導電材，亦即，將向異導電 材膠帶裝設於向異導電材膠帶自動壓著機上並供應向異導 電材時’在向異導電材之轉錄性及伸展試驗中獲得良好結 φ果，而且，可減少盤之裝設次數、無需裝設時間、以及避 免轉錄性及黏著劑之伸展所導致之貼附作業的重複，而這 些效果可提高生產性。 (實施例2 ) 製作和實施例1相同之向異導電材膠帶之捲物。其次 ，在基材膜及黏著劑之積層體上，以2基材膜夾住黏著劑 之方式，層壓另1種類之厚度爲25#m之聚對苯二甲酸 乙烯酯基材膜（斷裂強度爲25kg/mm2、斷裂伸展爲130% -170- (166) (166)1321868 )，得到3層構造之向異導電材膜之捲物。其次，和實施 例1相同，將此膜之捲物切割成寬度1.5mm，並將其捲取 至附有側板之直徑48mm、寬度100mm之芯材（捲軸）而 成爲捲線狀，得到300m長度之向異導電材膠帶。 實施例2亦和實施例1相同，可得到良好之生產性。 (實施例3) 除了基材膜採用厚度50#m之聚四氟乙烯膜（斷裂 強度爲4.6kg/mm2、斷裂伸展爲350% )以外，得到和實 施例1相同之向異導電材膜之捲繞物，此外，和實施例1 相同，將此膜之捲繞物切割成寬度1.5mm，捲繞於附有側 板之直徑48 mm、幅1 OOmm之芯材（捲軸）而成爲捲線 狀，得到300m長度之向異導電材膠帶。此時，亦可捲繞 3 00m之長度。 (比較例1 ) 得到和實施例1相同之向異導電材膜之捲繞物，此外 ，和實施例1相同，將此膜之捲繞物切割成寬度1 .5mm， 以同一圓芯狀捲繞至傳統之盤，得到100m長度之向異導 電材膠帶。 將此捲繞成捲線狀之向異導電材膠帶裝著至向異導電 材膠帶自動壓著機，並供應向異導電材時，向異導電材之 轉錄性及伸展試驗皆獲得良好結果，然而，盤之裝設次數 爲實施例之3倍，裝設時間及調整時間都增加。 -171 - (167) 1321868 本發明之產業上的利用可能性如下所示。 如以上說明所示，利用第1項記載之發明時，係利用 黏著材膠帶之黏著劑來黏著全部捲出之黏著材膠帶（一方 之黏著材膠帶）之終端部、及新裝著之黏著材膠帶（另一 方之黏著材膠帶）之始端部，實施黏著材盤之更換，很簡 單即可將新黏著材膠帶裝著至黏著裝置。(2) Preparation of a different-conductive conductive tape The above-mentioned wound material of the electrically conductive material film was cut into a width of K5 mm, and laminated in a multi-volume manner to a longitudinal direction of a core material (reel) having a side plate having a diameter of 48 mm and a width of 100 mm. On the top, it became a coiled shape, and a tape of 300 m length of dissimilar conductive material was obtained. This is wound into a coil-shaped conductive material, that is, when the dissimilar conductive tape is attached to the dissimilar conductive tape autoclave and supplied to the dissimilar conductive material. Good results in the sex and stretch test, and can reduce the number of times the disk is installed, no installation time, and avoid duplication of the transcription and adhesion of the adhesive, which can improve production. Sex. (Example 2) A roll of the same conductive material tape as in Example 1 was produced. Next, another type of polyethylene terephthalate base film having a thickness of 25 #m is laminated on the laminate of the base film and the adhesive by sandwiching the adhesive with the two base film. The strength was 25 kg/mm2, and the elongation at break was 130% - 170 - (166) (166) 1321868), and a roll of a three-layer structure of a dissimilar conductive material film was obtained. Next, in the same manner as in Example 1, the roll of the film was cut into a width of 1.5 mm, and it was taken up to a core material (reel) having a side plate having a diameter of 48 mm and a width of 100 mm, and was wound into a line shape to obtain a length of 300 m. Tape to the different conductive material. Also in Example 2, as in Example 1, good productivity was obtained. (Example 3) The same conductive material film as in Example 1 was obtained except that the base film was a polytetrafluoroethylene film having a thickness of 50 #m (breaking strength: 4.6 kg/mm2, elongation at break of 350%). In the same manner as in Example 1, the wound material of the film was cut into a width of 1.5 mm, and wound into a core material (reel) having a diameter of 48 mm and a width of 100 mm attached to the side plate to be wound. A 300 m length of dissimilar conductive tape was obtained. At this time, it is also possible to wind a length of 300 m. (Comparative Example 1) A wound material of the same conductive material film as in Example 1 was obtained, and in the same manner as in Example 1, the wound material of the film was cut into a width of 1.5 mm, and the same core-shaped roll was obtained. Wrap around to the traditional plate and get a 100m length of dissimilar conductive tape. When the tape is wound into a coil-shaped conductive material tape to the isoconductive tape automatic crimping machine and supplied to the isoelectric material, the transcription and stretching tests to the isoelectric material are good, however, The number of times the disk is installed is three times that of the embodiment, and the installation time and the adjustment time are increased. -171 - (167) 1321868 The industrial use possibilities of the present invention are as follows. As described above, in the invention according to the first aspect, the adhesive portion of the adhesive tape (one adhesive tape) and the newly attached adhesive are adhered by the adhesive of the adhesive tape. The beginning of the tape (the other side of the adhesive tape), the replacement of the adhesive plate, it is very simple to put the new adhesive tape to the adhesive device.

又，因爲無需在每次更換新黏著材膠帶時都更換捲取 膠帶、將新黏著材膠帶之始端裝設於捲取盤上之作業、以 及在特定路徑設定導引銷等之作業，只需要較少時間即可 更換新黏著材盤，故可提高電子機器之生產效率。 因爲一方之黏著材膠帶及另一方之黏著材膠帶係以重 疊黏著劑面來進行黏著，故有較高之連接強度》 利用第2項記載之發明時，除了具有和第1項記載之 發明相同之效果以外，全部捲出之黏著材膠帶之切斷係在 露出結束標記時實施，切斷及執行連接作業之部份容易解 開且可利用必要最小之位置實施連接，而可防止黏著材膠 帶之浪費。 利用第3項記載之發明時，具有和第1項記載之發明 相同之效果，很簡單即可將新黏著材膠帶裝著至黏著裝置 ，又，只需要較少時間即可更換新黏著材盤，故可提高電 子機器之生產效率。 - 此外，因爲係利用黏著材膠帶之前導膠帶黏著全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 ，故很簡單即可實施黏著材膠帶間之黏著》 -172- (168) 1321868 利用第4項記載之發明時，具有和第1項記載之發明 相同之效果，很簡單即可將新黏著材膠帶裝著至黏著裝置 ，又，只需要較少時間即可更換新黏著材盤，故可提高電 子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 利用第5項記載之發明時，因爲係以卡止銷固定全部 φ 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部，故連接十分簡單。又，因爲無需在每次更換新黏著 材盤時都更換捲取膠帶、將新黏著材膠帶之始端裝設於捲 取盤上作業、以及在特定路徑設定導引銷等之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 利用第6項記載之發明時，卡止構件之一方之爪部會 卡止於一方之黏著材膠帶之終端部，其後，配設於卡止構 # 件之另一方之爪部會卡止於另一方之黏著材膠帶之始端部 ，實施兩者之互相連接，故連接十分容易。 因爲一方之爪部及另一方之爪部之間具有彈性構件， 故，彈性構件可伸展而使卡止構件之另一方之爪部卡止於 另一方之黏著材膠帶之始端部之任意位置上，故連接具有 高自由度。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部會在互相抵接之狀態進行連接，無需重疊膠帶 ，可利用必要最小之位置實施連接，而可防止黏著材膠帶 -173- (169) 1321868 之浪費。 利用第7項記載之發明時，只需以夾子一方之黏著材 膠帶之終端部及另一方之黏著材膠帶之始端部之重疊部份 即可連接，連接作業十分容易。 利用第8項記載之發明時，係從重疊部份之兩面壓扁 夾持片來連接兩者，可提高黏著材膠帶之重疊部份的連接 強度。Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the operation of mounting the beginning of the new adhesive tape on the take-up reel, and the setting of the guide pin in a specific path, only The new adhesive plate can be replaced in less time, which can increase the production efficiency of the electronic machine. Since the adhesive tape of one of the adhesive tapes and the other adhesive tape are adhered by overlapping adhesive surfaces, there is a high joint strength. In the invention described in the second item, the invention is the same as the invention described in the first item. In addition to the effect, the cutting of the adhesive tape which is all rolled out is performed when the end mark is exposed, and the part which is cut and performs the joining operation is easily unwound and can be connected by using the necessary minimum position, thereby preventing the adhesive tape. Waste. According to the invention described in the third aspect, the same effect as the invention described in the first aspect can be achieved, and the new adhesive tape can be easily attached to the adhesive device, and the new adhesive tray can be replaced in a small amount of time. Therefore, the production efficiency of the electronic machine can be improved. - In addition, because the adhesive tape is used to bond the end portion of the adhesive tape and the beginning of the newly attached adhesive tape, it is very simple to apply the adhesion between the adhesive tapes. -172 - (168) 1321868 When the invention according to the fourth aspect is used, it has the same effect as the invention described in the first item, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. Replacing the new adhesive sheet can increase the productivity of the electronic machine. In addition, since the adhesive tape is not required to be folded back, the adhesive tape can be taken up to the take-up reel to prevent possible winding up. According to the invention of the fifth aspect, since the end portion of the adhesive tape which is wound by all the φ and the beginning end of the newly attached adhesive tape are fixed by the locking pin, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. According to the invention of the sixth aspect, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and thereafter the claw portion of the other of the locking members is locked. At the beginning of the other adhesive tape, the two are connected to each other, so the connection is very easy. Since there is an elastic member between the claw portion of one of the claws and the claw portion of the other, the elastic member can be stretched so that the other claw portion of the locking member is locked at any position of the beginning end portion of the other adhesive tape. Therefore, the connection has a high degree of freedom. Further, the end portion of the adhesive tape of one of the adhesive tapes and the other end portion of the adhesive tape are connected to each other without overlapping the tape, and the connection can be performed at the minimum necessary position, thereby preventing the adhesive tape - 173- (169) 1321868 Waste. According to the invention of the seventh aspect, it is only necessary to connect the overlapping portion of the end portion of the adhesive tape of the one of the clips and the beginning of the other adhesive tape, and the joining operation is very easy. According to the invention of the eighth aspect, the holding pieces are flattened from both sides of the overlapping portion to connect the two, and the joint strength of the overlapping portions of the adhesive tape can be improved.

利用第9項記載之發明時，係利用黏著材膠帶之黏著 劑黏著已用完之黏著材膠帶之終端部、及新裝著之黏著材 膠帶之始端部，來實施黏著材盤之更換，故很簡單即可將 新黏著材盤裝著至黏著裝置。又，因爲無需每次更換新黏 著材盤時都更換基材之捲取盤、及將新黏著材之始端裝設 至捲取盤，只需要較少時間即可更換新黏著材盤，故可提 高製造效率。 利用第1 〇項記載之發明時，除了具有和第9項記載 之發明相同之效果以外，一方之黏著材膠帶之終端部及另 一方之黏著材膠帶之始端部會互相形成鈎狀卡止，而且， 兩者係以黏著劑面互相連接，故有較高之連接強度。 利用第11項記載之發明時，除了具有和第9或10項 記載之發明相同之效果以外，一方之黏著材膠帶之終端部 係結束標記之部份，執行連接作業之部份容易解開，且防 止黏著材膠帶之浪費。_ 利用第1 2項記載之發明時，除了具有和第9項〜1 1 之其中任一項記載之發明相同之效果以外’因爲連接部份 -174- (170) 1321868 會形成凹凸，可擴大連接面積，同時，可提高連接部份之 黏著材膠帶之拉伸方向（縱向）之強度。 利用第13項記載之發明時，除了具有和第9項〜第 11項之其中任一項記載之發明相同之效果以外’連接部 份會形成貫通孔，貫通孔之內緣會有黏著劑滲出’可增加 黏著劑之黏著面積，而進一步提高連接強度。 利用第14項記載之發明時，只需連接已用完之黏著 φ 材膠帶（一方之黏著材膠帶）、及新黏著材膠帶（另一方 之黏著材膠帶）即可更換盤，故很簡單即可將新黏著材盤 裝著至黏著裝置。又，因爲無需每次更換新黏著材盤時都 更換捲取盤、將新黏著材膠帶之始端裝設於捲取盤上、以 及將黏著材膠帶裝設於導引件之作業，只需要較少時間即 可更換新黏著材盤，故可提高電子機器之生產效率。 黏著材膠帶之處理基材所使用之處理劑係矽系樹脂， 且粘著膠帶亦使用矽粘著劑，因可降低兩者之表面張力差 # 而提高密著力，故可實現傳統上十分困難之兩者之黏著。 利用第1 5項記載之發明時，除了具有和第1 4項記載 之發明相同之效果以外，矽粘著膠帶之粘著劑面之表面張 力及黏著材膠帶之矽處理基材之表面張力之差爲10mN/m (lOdyne/cm )以下，可得到強密著力，而可確實黏著兩 者。 利用第1 6項記載之發明時，除了具有和第1 5項記載 之發明相同之效果以外，因爲黏著力爲100g/2 5 mm以上 ’可使一方及另一方之黏著材膠帶之兩黏著劑面之黏著更 -175- (171) 1321868 爲強固。 利用第1 7項記載之發明時，除了具有和第1 6項記載 之發明相同之效果以外，係利用兩面連接一方及另一方之 黏著材膠帶，故可得到更爲強固之連接。According to the invention of the ninth aspect, the adhesive portion of the adhesive tape is adhered to the end portion of the used adhesive tape and the beginning portion of the newly attached adhesive tape, thereby performing the replacement of the adhesive disk. It is very simple to load the new adhesive tray to the adhesive unit. Moreover, since it is not necessary to replace the winding disc of the substrate every time the new adhesive sheet is replaced, and the beginning of the new adhesive material is attached to the take-up reel, it takes only a small time to replace the new adhesive disc, so Improve manufacturing efficiency. According to the invention described in the first aspect, in addition to the effect similar to the invention described in the ninth aspect, the end portion of the adhesive tape of one of the adhesive tapes and the beginning end portion of the other adhesive tape are hooked to each other. Moreover, the two are connected to each other with an adhesive surface, so that there is a high connection strength. According to the invention of the eleventh aspect, in addition to the effect similar to the invention of the ninth or tenth aspect, the end portion of the adhesive tape of one of the adhesive tapes is partially closed, and the portion for performing the joining operation is easily untied. And to prevent the waste of adhesive tape. In addition to the effects of the invention described in any one of the items 9 to 1 1 , the connection portion -174-(170) 1321868 is formed to have irregularities, and can be enlarged. The joint area and, at the same time, increase the strength of the stretch direction (longitudinal direction) of the adhesive tape of the joint portion. According to the invention of the thirteenth aspect, in addition to the effects similar to those of the invention according to any one of the items 9 to 11, the connecting portion forms a through hole, and the inner edge of the through hole has an adhesive bleed out. 'It can increase the adhesion area of the adhesive and further increase the joint strength. When the invention described in item 14 is used, it is only necessary to connect the used adhesive tape (one adhesive tape) and the new adhesive tape (the other adhesive tape) to replace the disk, so it is simple The new adhesive tray can be attached to the adhesive unit. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the adhesive tape is installed on the guide member, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The treatment agent used for the treatment of the adhesive tape is a lanthanum resin, and the adhesive tape is also a ruthenium adhesive. Since the surface tension difference between the two can be lowered, the adhesion is improved, so that it is practically difficult. The two are glued together. According to the invention of the fifteenth aspect, the surface tension of the adhesive surface of the adhesive tape and the surface tension of the substrate of the adhesive tape are treated in addition to the effects similar to those of the invention described in the above item 14. When the difference is 10 mN/m (lOdyne/cm) or less, a strong force can be obtained, and both can be surely adhered. According to the invention of the first aspect, in addition to the effects similar to those of the invention described in the fifteenth aspect, since the adhesive force is 100 g/2 5 mm or more, the two adhesives of the adhesive tape of one side and the other can be used. The adhesion of the face is more -175- (171) 1321868 is strong. According to the invention of the seventeenth aspect, in addition to the effects similar to those of the invention described in the sixteenth aspect, the adhesive tape of one of the other and the other is bonded to each other, so that a stronger connection can be obtained.

利用第1 8項記載之發明時，因爲採用兩面粘著劑之 矽粘著膠帶，利用將兩面矽粘著膠帶夾於一方及另一方之 黏著材膠帶間之方式來實施兩者之黏著（或密著），故兩 者之連接十分簡單且容易。 利用第19項記載之發明時，因已全部捲出之黏著材 膠帶之終端部、及新裝著之黏著材膠帶之始端部係以糊狀 樹脂製黏著劑固定，故連接十分簡單。又，因爲無需在每 次更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶 之始端裝設至捲取盤之作業、以及在特定路徑設定導引銷 等之作業，只需要較少時間即可更換新黏著材盤，故可提 禹電子機器之生產效率。 利用第2 0項記載之發明時，除了具有和第1 9項記載 之發明相同之作用效果以外，因樹脂製黏著劑可從熱硬化 性樹脂 '光硬化性樹脂、及熱金屬黏著劑之群組中選取適 合黏著材膠帶間之連接的樹脂製黏著劑，故可提高黏著材 膠帶間之連接強度。 利用第2 1項記載之發明時，黏著裝置內因配設著供 應第19或20項記載之樹脂製黏著劑之充塡機，無需另行 準備充塡機，故可防止連接作業之浪費。 利用第22項記載之發明時，捲繞於一方之捲部的黏 -176- (172) 1321868 著材膠帶全部捲出時，將捲繞於相鄰捲部之黏著材膠帶裝 設至捲取盤，實施黏著材膠帶之更換，因爲無需將新黏著 材膠帶盤裝著至黏著裝置。因此，只需較少之新黏著材膠 帶盤之更換作業，故可提高電子機器之生產效率。 利用第23項記載之發明時，除了具有和第22項記載 之發明相同之效果以外，因係以連結膠帶連接一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部，故一方 φ 之黏著材膠帶盤之黏著材膠帶全部捲出後，無需將另一方 之捲部之黏著材膠帶裝設至盤之作業，故可進一步提高電 子機器之生產效率。 利用第24項記載之發明時，因爲連結膠帶會自動捲 取至捲取盤，一方之捲部之黏著材膠帶全部捲出後，會依 序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，連結膠帶會被自動捲取至捲取盤，故可省 φ 略捲取之麻煩。 利用第25項記載之發明時，一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部之連接部份，因爲係 以黏著材膠帶覆蓋卡止具，故外觀良好，同時，可防止連 接部份之卡止具接觸黏著材膠帶而使黏著材膠帶或黏著裝 置受損。 利用第26項記載之發明時，連接部檢測手段檢測到 連接部份，至連接部份通過壓著部爲止，會將一方之黏著 材膠帶捲取至捲取盤，可防止連接部份到達壓著部時實施 -177- (173) 1321868 壓著動作之問題。又，至連接部份通過壓著部爲止，因爲 會自動將一方之黏著材膠帶捲取至捲取盤，故可省略捲取 之麻煩。 利用第27項記載之發明時，除了具有和第26項記載 之發明相同之作用效果以外，以簡單之構成即可實施連接 部份之檢測，而且，可利用這些手段來提高檢測精度。According to the invention of claim 18, since the adhesive tape of the double-sided adhesive is used, the adhesive tape of the two-side adhesive tape is sandwiched between one of the adhesive tapes of the other adhesive tape (or Closely, so the connection between the two is very simple and easy. According to the invention of the nineteenth aspect, since the end portion of the adhesive tape which has been completely unwound and the beginning end portion of the newly attached adhesive tape are fixed by a paste-like resin adhesive, the connection is very simple. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of installing the new adhesive tape to the take-up reel, and the setting of the guide pin in a specific path, it is only necessary to The new adhesive plate can be replaced in a small amount of time, so the production efficiency of the electronic machine can be improved. In addition to the effects similar to those of the invention described in the ninth aspect, the resin-based adhesive can be obtained from the group of the thermosetting resin 'photocurable resin and the hot metal adhesive. In the group, a resin adhesive suitable for the connection between the adhesive tapes is selected, so that the connection strength between the adhesive tapes can be improved. According to the invention of the second aspect, the charging device for supplying the resin-made adhesive according to the 19th or 20th aspect is provided in the adhesive device, and it is not necessary to separately prepare the charging device, so that the waste of the connection work can be prevented. According to the invention of the twenty-second aspect, when the adhesive tape 176-(172) 1321868 wound around one of the rolls is completely unwound, the adhesive tape wound around the adjacent roll is attached to the winding. The disc, the replacement of the adhesive tape is carried out, because it is not necessary to put the new adhesive tape onto the adhesive device. Therefore, it is only necessary to replace the new adhesive tape reel, so that the production efficiency of the electronic machine can be improved. According to the invention of the twenty-third aspect, in addition to the effect similar to the invention of the twenty-second aspect, the end portion of the adhesive tape and the other end portion of the adhesive tape are connected by a connecting tape. After the adhesive tape of the adhesive tape of φ is completely unwound, the adhesive tape of the other roll portion is not required to be installed on the disk, so that the production efficiency of the electronic device can be further improved. According to the invention of the twenty-fourth aspect, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the wraps is completely unwound, the adhesive tape is sequentially taken out from the next roll. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of φ being slightly wound can be saved. According to the invention of the twenty-fifth aspect, the connection portion between the end portion of the adhesive tape and the other end portion of the adhesive tape is covered with the adhesive tape, so that the appearance is good and at the same time, Prevent the adhesive part of the connecting part from contacting the adhesive tape and damage the adhesive tape or the adhesive device. According to the invention of the twenty-sixth aspect, the connecting portion detecting means detects the connecting portion, and when the connecting portion passes through the pressing portion, one of the adhesive tapes is taken up to the take-up reel to prevent the connecting portion from reaching the pressure. When the Ministry was implemented -177- (173) 1321868 The problem of pressing action. Further, since the connecting portion passes through the pressing portion, since one of the adhesive tapes is automatically taken up to the take-up reel, the trouble of winding can be omitted. According to the invention of the twenty-seventh aspect, in addition to the effects similar to those of the invention of the twenty-sixth aspect, the detection of the joint portion can be performed with a simple configuration, and the detection accuracy can be improved by these means.

利用第2 9項記載之發明時，因可依序逐條使用複數 條黏著劑，可在不增加膠帶之捲數的情形下，可使1盤可 使用之黏著劑的量增加成傳統之2倍以上。 因未增加捲數，故可防止捲取散亂，同時，可防止因 爲黏著劑從膠帶之寬度方向滲出而使捲取之膠帶間發生黏 著所導致之阻塞，此外，亦可防止因爲膠帶狀之基材較長 而容易發生之伸展等弊病（基材之損傷或斷裂）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高作業效率。 又，黏著劑膠帶之製造上，因可減少製造之盤數，可 減少盤材及濕氣防止材之使用量，故可降低製造成本。 利用第30項記載之發明時，除了具有和和第29項記 載之發明相同之效果以外，因相鄰之黏著劑條間具有間隔 ，很容易即可實施逐條分離，而使對電路基板之壓著更爲 容易。 -利用第3 1項記載之發明時，-餘了具有和第2 9項租同 之效果以外’只需在塗布於基材之單面全面上之黏著劑上 形成縫隙即可’製造十分容易，而且，相鄰之黏著劑條間 -178- (174) 1321868 的間隙很小，故可增加配置於基材上之黏著劑條之條數。 利用第32項記載之發明時，很容易即可製造第30項 記載之黏著劑膠帶。 利用第3 3項記載之發明時，因可同時製造2條黏著 劑膠帶，故具有良好製造效率。 利用第3 4項記載之發明時，因係實施部份黏著劑之 加熱來降低該部份之凝聚力並將其壓著至電路基板，而黏 φ 著劑膠帶係使用在基材之單面全面塗布黏著劑者，故可直 接利用既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用變更加熱區 域而進行任意設定，故壓著之黏著劑寬度具有高自由度。 和第2 9項記載之發明相同，因爲會依逐條對基材上 之黏著劑加熱並壓著至電路基板，可在不增加膠帶之捲數 的情形下，將1盤可使用黏著劑量增加成2倍以上。 因無需增加捲數即可增加黏著劑量，故和第29項記 φ 載之發明相同，可防止捲取散亂，同時，亦可防止因黏著 劑之滲出而導致之阻塞及基材伸展之弊病。 利用第3 5項記載之發明時，因爲黏著劑膠帶之寬度 具有電路基板之一邊以上之長度，故可在增加黏著劑量， 同時，減少黏著劑膠帶之捲數。 因爲無需增加黏著劑膠帶之捲數即可大幅增加使用黏 著劑量，故可防止捲取散亂，同時，可防止阻塞、基材之 損傷或斷裂。又，因電子構件之製造工廠可減少新黏著劑 膠帶之更換次數，故可提高製造效率。 -179- (175) 1321868 此外，黏著劑膠帶之製造上，因增加每1盤之黏著劑 量，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 利用第3 6項記載之發明時，除了具有和第3 5項記載 之發明相同之效果以外，相鄰之黏著劑條會分離’很容易 即可逐條將黏著劑從基材剝離並實施壓著。 利用第3 7項記載之發明時，除了具有和第3 5項相同When the invention described in the twenty-ninth item is used, since the plurality of adhesives can be used one by one, the amount of the adhesive which can be used in one tray can be increased to the conventional one without increasing the number of the tapes. More than double. Since the number of rolls is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to adhesion of the adhesive tape from the width direction of the tape, and also to prevent the tape from being formed. The substrate is long and prone to stretching and other disadvantages (damage or breakage of the substrate). Since the manufacturing unit of the electronic component can reduce the number of replacement of the new adhesive tape, the work efficiency can be improved. Further, in the manufacture of the adhesive tape, since the number of the manufactured disks can be reduced, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. According to the invention of the thirty-ninth aspect, in addition to the effects similar to those of the invention described in the twenty-ninth aspect, it is easy to separate one by one by the interval between adjacent adhesive strips, and to make the circuit board It is easier to press. - When the invention described in the third item is used, it is easy to manufacture by forming a gap on the adhesive which is applied to the entire surface of the substrate in addition to the effect of the second item. Moreover, the gap between the adjacent adhesive strips -178-(174) 1321868 is small, so that the number of adhesive strips disposed on the substrate can be increased. According to the invention described in the 32nd aspect, the adhesive tape of the 30th item can be easily produced. According to the invention described in the third aspect, since two adhesive tapes can be simultaneously produced, the production efficiency is good. In the invention described in the item 4, the heat of the adhesive is applied to reduce the cohesive force of the portion and press it onto the circuit substrate, and the adhesive tape is used on one side of the substrate. If the adhesive is applied, the adhesive tape can be directly manufactured by using the existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating area, so that the adhesive width of the pressing has a high degree of freedom. It is the same as the invention described in the twenty-ninth item, because the adhesive on the substrate is heated and pressed to the circuit substrate one by one, and the adhesive amount of one disk can be increased without increasing the number of tapes. More than 2 times. Since it is possible to increase the adhesive amount without increasing the number of rolls, it is the same as the invention of the 29th item φ, which prevents the coiling from being scattered, and at the same time prevents the clogging caused by the oozing of the adhesive and the disadvantage of the substrate stretching. . According to the invention of the 35th aspect, since the width of the adhesive tape has a length of one side or more of the circuit board, the amount of the adhesive can be increased, and the number of the adhesive tape can be reduced. Since the amount of the adhesive tape can be increased without increasing the number of adhesive tapes, the coiling can be prevented from being scattered, and at the same time, the clogging, damage or breakage of the substrate can be prevented. Further, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. -179- (175) 1321868 In addition, since the amount of the adhesive agent per one disk is increased in the manufacture of the adhesive tape, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. According to the invention described in the sixth aspect, in addition to the effects similar to those of the invention described in the item 35, the adjacent adhesive strips are separated, so that the adhesive can be peeled off from the substrate one by one and pressure is applied. With. When using the invention described in item 37, except that it has the same

之效果以外，尙可增加配置於基材上之黏著劑條之條數且 製造更爲容易。 利用第3 8項記載之發明時，因爲可利用既存設備同 時製造2條第3 6項記載之黏著劑膠帶，故具有良好製造 效率。 利用第3 9項記載之發明時，除了可得到第3 5項〜第 37項之其中任一項記載之效果以外，很簡單即可將黏著 劑壓著至電路基板之一邊，而可提高電子構件之製造工廠 之作業效率。 利用第40項記載之發明時，除了可得到第35項〜第 37項記載之效果以外，無需旋轉電路基板’而只要移動 一方之黏著劑膠帶及另一方之黏著劑膠帶之位置，很容易 即可將黏著劑壓著至電路基板之四周’故有良好之作業效 率。 利用第41項記載之發明時’將_黏著劑壓著至電路基 板之周圍時，會沿著寬度方向對黏著劑膠帶實施條狀加熱 加壓，很容易即可將黏著劑壓著至電路基板’而有良好之 -180 - (176) 1321868 作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可， 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和第3 5項記載之發明相同，因爲未增加捲數卻 φ 可增加黏著劑量，故可防止捲取散亂，同時，得到可防止 因黏著劑之滲出而造成之阻塞、及防止因基材之伸展而造 成之弊病等之效果。 第42項記載之發明時，因係逐條使用配置於黏著劑 板上之寬度方向的至少2條黏著劑，每1盤至少可使用2 盤份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可 使用之黏著劑量》 而且，因爲未增加黏著劑膠帶之捲數 '，故可防止捲取 ® 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或斷 裂）。 因黏著劑膠帶係盒形式，黏著裝置上無需實施將黏著 劑膠帶裝設至盤之繁複業作，而只要將盒裝著至黏著裝置 即可，處理上更爲容易’且具有良好之裝設及更換作業性 〇 利用第43項記載之發明時，除了具有和第42項記載 -181 - (177) 1321868 之發明相同之效果以外，相鄰之黏著劑條會分離，很容即 可從基材逐條拉離黏著劑並實施壓著。 利用第44項記載之發明時，除了具有和第42項相同 之效果以外，黏著劑膠帶只需在基材之單面全面塗布黏著 劑並形成縫隙即可，故製造十分容易。 利用第4 5項記載之發明時，因爲黏著劑膠帶只需在 基材之全面塗布黏著劑即可，故可直接利用既存設備製造In addition to the effect, the number of adhesive strips disposed on the substrate can be increased and manufacturing is easier. According to the invention of the third aspect, since the adhesive tapes described in the two items of the third item can be simultaneously produced by using the existing equipment, the manufacturing efficiency is good. According to the invention of the ninth aspect, in addition to the effects described in any one of the items 5 to 37, the adhesive can be pressed to one side of the circuit board, and the electron can be improved. The operating efficiency of the manufacturing plant of the component. According to the invention of the 40th aspect, in addition to the effects described in the 35th to 37thth aspects, it is possible to easily move the position of the adhesive tape and the other adhesive tape without rotating the circuit board '. The adhesive can be pressed to the periphery of the circuit board, so there is good work efficiency. According to the invention of the 41st aspect, when the adhesive is pressed around the circuit board, the adhesive tape is heated and pressurized in the width direction, and the adhesive can be easily pressed to the circuit substrate. 'And there is good -180 - (176) 1321868 work efficiency. Moreover, since it is only necessary to apply the adhesive to the adhesive tape in its entirety, it is possible to directly manufacture the adhesive tape using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. Further, in the same manner as the invention described in the 35th item, since the number of rolls is not increased, φ can increase the amount of the adhesive, so that the winding can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive can be prevented, and the cause can be prevented. The effect of the disadvantages caused by the stretching of the substrate. In the invention according to the 42nd aspect, at least two adhesives disposed in the width direction of the adhesive sheet are used one by one, and at least two discs can be used per one tray, and the number of the adhesive tapes can be increased without increasing the number of the adhesive tape. Significantly increase the amount of adhesive that can be used in one set. Moreover, because the number of rolls of adhesive tape is not increased, it prevents the roll-up® from being scattered, and at the same time prevents the adhesive from being entangled from the width of the tape. Blockage caused by adhesion between the tapes, and prevention of stretching or the like which is likely to occur due to the long substrate (damage or breakage of the substrate). In the form of an adhesive tape cassette, it is not necessary to carry out the complicated operation of attaching the adhesive tape to the disc on the adhesive device, and the cartridge is attached to the adhesive device, which is easier to handle and has a good installation. In addition to the effect of the invention described in the 43rd item, the adjacent adhesive strips are separated, and the adhesive strips are separated from each other. The material is pulled away from the adhesive one by one and pressed. According to the invention of the fourteenth aspect, the adhesive tape can be completely applied by applying an adhesive to one side of the substrate and forming a slit, in addition to the same effect as the item 42. According to the invention described in the item 45, since the adhesive tape only needs to apply the adhesive to the entire substrate, it can be directly manufactured by using the existing equipment.

壓著至電路基板之黏著劑的寬度，可利用改變加熱加 壓區域來實施任意設定，故壓著之黏著劑寬度具有高自由 度。 利用第46項記載之發明時，除了具有和第45項相同 之效果以外，尙和第1項記載之發明相同，因爲未增加捲 數卻可增加黏著劑量，故可防止捲取散亂，同時，得到可 防止因黏著劑之滲出而造成之阻塞、及防止因基材之伸展 φ而造成之弊病等之效果。使用時，1盤份全部捲出時，只 需反轉盒即可，故下一次之裝著十分容易。因採用盒形式 ，處理上更爲容易，且具有良好之裝設及更換作業性。 利用第4 7項記載之發明時，利用黏著材膠帶之基材 黏著全部捲出之黏著材膠帶之終端部、及新裝著之黏著材 膠帶之始端部，來實施黏著材盤之更換，故很簡單即可將 新黏著材盤裝著至黏著裝置。又，無需每次更換新黏著材 ..盤時都更換捲取盤、及將新黏著材盤之始端裝設至捲取盤 之作業，只需要較少時間即可更換新黏著材盤，故可提高 -182- (178) 1321868 電子機器之生產效率。 利用第48項記載之發明時，除了具有和第47項記載 之發明相同之效果以外，因爲熱熔融劑層位於基材之表面 ，可將始端部之黏著劑面重疊於一方之黏著材膠帶之終端 部之熱熔融劑層，對此部份進行加熱壓著來連接兩者，故 連接十分簡單。 又，因爲熱熔融劑層形成於膠帶之縱向全體，重疊長 φ 度無需嚴格定位，故連接具有高自由度。 利用第49項記載之發明時，除了具有和第47項記載 之發明相同之效果以外，因熱熔融劑層係夾於支持層之間 ，可防止熱熔融劑層曝露於大氣下，故可防止濕氣之吸濕 或灰塵等之附著而導致熱熔融劑層之黏著強度降低。 利用第5 0項記載之發明時，去除基材端部之以脫模 劑實施表面處理之部份，利用黏著材膠帶之黏著劑黏著全 部捲出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始 # 端部，來實施黏著材盤之更換，故很簡單即可將新黏著材 盤裝著至黏著裝置。 利用第51項記載之發明時，除了具有和第50IX (乙 記載之發明相同之效果以外，因係利用電漿放電、紫外線 照射、及雷射照射之其中任何一種方法去除脫模劑，可；^ 短時間內正確地去除脫模劑。 利用第52項記載之發明時，因爲黏著材膠帶盤上配 設著複數個將黏著材膠帶捲繞於盤上之黏著材膠帶之捲$ (捲部），複數之捲部當中，一個捲部之黏著材膠帶全部 -183- (179) 1321868 捲出時，會使用和全部捲出之捲部爲相鄰配置之其他捲部 之黏著材膠帶，因爲無需將新黏著材膠帶盤裝著至黏著裝 置，只需較少之新黏著材膠帶盤之更換作業，故可提高電 子機器之生產效率。又，因爲係依序使用複數之黏著材膠 帶’無需增加1個黏著材膠帶盤之黏著材膠帶的捲數，即The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressing region, so that the adhesive width of the pressing has a high degree of freedom. According to the invention described in the 46th aspect, the invention is the same as the invention of the first item, and the invention described in the first item is the same as the invention described in the first item, since the amount of the coating can be increased without increasing the number of windings, so that the winding can be prevented from being scattered. The effect of preventing clogging due to the oozing of the adhesive and preventing the disadvantage caused by the stretching of the substrate φ is obtained. When using, when all the 1 trays are rolled out, you only need to reverse the box, so it is very easy to install the next time. Due to the box form, it is easier to handle and has good installation and replacement workability. According to the invention of the seventh aspect, the end portion of the adhesive tape which is completely unwound is adhered to the base material of the adhesive tape, and the beginning end portion of the newly attached adhesive tape is used to replace the adhesive disk. It is very simple to load the new adhesive tray to the adhesive unit. Moreover, there is no need to replace the new adhesive material every time. When the disk is replaced, the winding tray is replaced, and the beginning of the new adhesive material tray is installed to the take-up tray, and it takes only a small time to replace the new adhesive material tray, so Can increase the production efficiency of -182- (178) 1321868 electronic machines. According to the invention of the 48th aspect, in addition to the effect similar to the invention of the 47th aspect, since the hot melt layer is located on the surface of the substrate, the adhesive surface of the beginning portion can be superposed on one of the adhesive tapes. The hot melt layer of the terminal portion is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length φ degree does not need to be strictly positioned, so the connection has a high degree of freedom. According to the invention of the 49th aspect, in addition to the effects similar to those of the invention described in the 47th item, since the hot melt layer is sandwiched between the support layers, the hot melt layer can be prevented from being exposed to the atmosphere, so that it can be prevented. The moisture absorption or the adhesion of dust or the like causes the adhesion strength of the hot melt layer to decrease. In the invention described in the item 50, the surface of the substrate is removed by the release agent, and the adhesive portion of the adhesive tape is adhered to the end portion of the adhesive tape which is completely unwound and newly installed. At the beginning of the adhesive tape, the replacement of the adhesive plate is carried out, so it is very simple to install the new adhesive plate to the adhesive device. In the invention according to the 51st aspect, the release agent may be removed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation in addition to the effect of the invention of the 50th (the invention described in the seventh paragraph); ^ Correctly remove the release agent in a short period of time. When using the invention described in item 52, the adhesive tape is provided with a plurality of rolls of adhesive tape wound on the disk. ), among the plural rolls, the adhesive tape of one roll is all -183- (179) 1321868 When rolled out, the roll that is rolled out is used as the adhesive tape of the other roll parts of the adjacent configuration, because There is no need to put the new adhesive tape on the adhesive device, and it requires less replacement of the new adhesive tape, which can improve the production efficiency of the electronic machine. Also, because the adhesive tape is used in sequence, it is not necessary. Increase the number of rolls of adhesive tape on an adhesive tape tray, ie

可大幅增加1次更換作業之可使用的黏著劑量。又，因爲 無需增加黏著材膠帶之捲數，故可防止捲取散亂，同時， 可防止黏著劑從膠帶之寬度方向滲出而使已捲取之黏著材 膠帶間發生黏著，亦即，可防止阻塞，而且，亦可防止因 爲基材較長而容易發生之伸展等弊病。 利用第5 3項記載之發明時，因爲盤之側板上配設著 乾燥劑之收容部，除了具有和第5 2項記載之發明相同之 作用效果以外，尙可從內部確實除去黏著材膠帶盤內之濕 氣，故可進一步防止黏著材膠帶因濕氣之吸濕而發生品質 降低下。The adhesive amount that can be used for one replacement operation can be greatly increased. Moreover, since it is not necessary to increase the number of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. According to the invention of the fifth aspect, since the accommodating portion of the desiccant is disposed on the side plate of the disk, the squeegee tape can be surely removed from the inside, in addition to the same effect as the invention described in the item (2). The moisture inside can further prevent the adhesive tape from deteriorating due to moisture absorption.

利用第54項記載之發明時，因爲覆蓋捲繞於盤上之 黏著材膠帶之周圍的蓋體構件，係以可自由裝卸之方式配 設於盤上，黏著材膠帶不會直接曝露於大氣下，故可防止 灰塵或大氣之濕氣對黏著材膠帶產生不良影響。因此，即 使配設複數之捲部時，對未使用之捲部配設蓋體構件，可 防止黏著材膠帶之品質降低。 ——又，因爲以可自由裝卸之方式配'設蓋體構件，只要拆 下蓋體構件，即可簡單地從黏著材膠帶盤捲出黏著材膠帶 [S] -184- (180) 1321868 利用第55項記載之發明時，除了具有和第52至54 項之其中任一項記載之發明相同之作用效果以外，因爲尙 可從蓋體構件之拉出口捲出黏著材膠帶，故無需拆下黏著 材膠帶盤之蓋體構件，而可直接從黏著材膠帶盤捲出黏著 材膠帶。 利用第56項記載之發明時，具有和第52至55項之 其中任一項記載之發明相同之效果以外，尙因爲捲部之側 φ 板係以可自由裝卸之方式互相嵌合，一方之捲部之黏著材 膠帶全部捲出後，解除其和另一方之捲部之嵌合，即可依 序從下一捲部捲出黏著材膠帶。 利用第57、58項記載之發明時，具有和第52至56 項之其中任一項記載之發明相同之作用效果，尤其是，黏 著材膠帶爲將用以連接相對電極之電極連接用黏著劑塗布 於基材上之黏著材膠帶、黏著材膠帶爲用以實施引線框架 之固定用支持基板、半導體元件載置用支持基板、或引線 φ 框架之晶片和半導體元件之連接的黏著材膠帶時特別有用 〇 利用第59項記載之發明時，以單手握持殼體，使露 出黏著劑膠帶之開口部抵壓電路基板，加熱構件從基材側 實施加熱壓著’將黏著劑壓著至電路基板，故十分小型且 可以單手操作’尙且，很容易即可將黏著劑壓著至基板之 一部份。 利用第60項記載之發明時，因爲黏著材膠帶之基材 係金屬膜或芳香族聚醯胺膜，即使基材之厚度較薄時，亦 -185- (181) 1321868 可防止基材伸展或斷裂等之問題。According to the invention of the fifty-fifth aspect, since the cover member covering the periphery of the adhesive tape wound around the disk is detachably attached to the disk, the adhesive tape is not directly exposed to the atmosphere. Therefore, it can prevent dust or atmospheric moisture from adversely affecting the adhesive tape. Therefore, even when a plurality of rolls are disposed, the cover member is disposed on the unused roll portion, and the quality of the adhesive tape can be prevented from deteriorating. ——In addition, because the cover member can be freely attached and detached, the adhesive tape can be simply rolled out from the adhesive tape by removing the cover member [S] -184- (180) 1321868 In the invention of the 55th aspect, in addition to the same effects as those of the invention of any one of the items 52 to 54, since the adhesive tape can be taken out from the pull-out opening of the cover member, it is not necessary to remove the adhesive tape. The cover member of the adhesive tape tray can be rolled out of the adhesive tape directly from the adhesive tape. According to the invention of the 56th aspect, in addition to the effects similar to the invention of any one of the items 52 to 55, the side φ plate of the winding portion is detachably fitted to each other, After the adhesive tape of the roll portion is completely unwound, the fitting of the adhesive tape to the other roll portion is released, and the adhesive tape can be unwound from the next roll portion in sequence. When the invention according to the 57th and 58th aspects, the invention has the same effects as those of the invention of any one of the items 52 to 56, in particular, the adhesive tape is an electrode for connecting electrodes for connecting the opposite electrodes. The adhesive tape and the adhesive tape which are applied to the substrate are particularly used for the fixing of the support frame for the lead frame, the support substrate for the semiconductor element mounting, or the bonding of the wafer of the lead φ frame and the semiconductor element. When the invention according to the 59th aspect is used, the casing is held by one hand, the opening of the adhesive tape is exposed to press against the circuit board, and the heating member is pressed by the substrate side to pressurize the adhesive to The circuit board is very small and can be operated with one hand', and it is easy to press the adhesive to one part of the substrate. According to the invention of the 60th aspect, since the base material of the adhesive tape is a metal film or an aromatic polyamide film, even when the thickness of the substrate is thin, -185-(181) 1321868 can prevent the substrate from stretching or Problems such as breaks.

因此，利用厚度較薄之基材所構成之黏著材膠帶，可 增加每1盤之捲數，而增加1盤可使用之黏著劑量。又， 使用本發明之黏著材膠帶時，因可增加每1盤之捲數，電 子構件之製造工廠只需實施較少之新黏著材膠帶之更換次 數，故可提高作業效率。其次，黏著材膠帶之製造上，可 減少製造之盤數，並可減少盤材及濕氣防止材之使用量， 故可降低製造成本。 利用第6 1項記載之發明時，除了具有和第60項記載 之發明相同之效果以外，尙可獲得較薄且具高拉伸強度之 黏著材膠帶。 利用第62項記載之發明時，除了具有和第60或61 項記載之發明相同之效果以外，因爲基材之拉伸強度爲 3 OOMPa以上，不易發生基材伸展或斷裂之問題。 利用第63項記載之發明時，除了具有和第60至62 φ項之其中任一項記載之發明相同之效果以外，因爲基材對 黏著劑之厚度比爲0.01〜1 .〇，此外，尙可得到較薄且具 有高拉伸強度之黏著材膠帶。 利用第64項記載之發明時，除了具有和第60至63 項之其中任一項記載之發明相同之效果以外，基材之表面 粗細度Rmax爲0.5/zm以下，基材之表面十分平滑，將黏 著劑壓著至電路基板時’黏著劑容易從-基枒分離。 利用第6 5項記載之發明時，在被覆體上形成黏著劑 之前一步驟，使一方之黏著材膠帶之黏著劑、及另一方之 -186- (182) 1321868 黏著材膠帶之黏著劑重疊，得到期望之黏著劑之厚度後， 再在被覆體上形成黏著劑，故各黏著材膠帶之厚度較薄， 雖然黏著材膠帶之捲數增多，每1盤之黏著材膠帶之捲繞 直徑卻更小》 因此，可增加每1盤之黏著材膠帶之捲數，而可大幅 增加1次更換作業之可使用的黏著劑量。因此，只需較少 之新黏著材膠帶之更換作業即可，故可提高電子機器之生 Φ 產效率。 利用第66項記載之發明時，除了具有和第65項記載 之發明相同之效果以外，可減少需要低溫管理之黏著材膠 帶之數量，黏著材膠帶之運送及保管可實施更有效率之管 理。 利用第67項〜72項之其中任一項記載之發明時，因 爲對被連接構件具有良好轉錄性（貼附性）及良好連接信 賴性，且可在改善步驟內之廢料率、及提高作業性之情形 # 下，提供傳統之長方形向異導電材膠帶，故可提高生產性 及作業性。 【圖式簡單說明】 第1圖係第1實施形態之黏著材膠帶連接方法時之黏 著材盤間之連接斜視圖。 第2圖A及第2圖B係第1圖之連接部份的連接步 驟斜視圖。 第3圖係黏著裝置之黏著劑的壓著步驟槪略圖。 -187- (183)1321868 第4圖係電路基板間之黏著的剖面圖。 第5圖係黏著材膠帶製造方法之步驟圖^ 第6圖係本發明第2實施形態之黏著材膠帶連接方法 的斜視圖。 第7圖係本發明第2實施形態之變形例之黏著材膠帶 連接方法的斜視圖。Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, when the adhesive tape of the present invention is used, since the number of rolls per one disk can be increased, the manufacturing unit of the electronic component only needs to perform a small number of replacements of the new adhesive tape, so that work efficiency can be improved. Secondly, in the manufacture of the adhesive tape, the number of manufactured disks can be reduced, and the amount of the disk and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. According to the invention of the sixth aspect, in addition to the effects similar to those of the invention described in the 60th aspect, the adhesive tape having a thin and high tensile strength can be obtained. According to the invention of the 62nd aspect, in addition to the effects similar to those of the invention described in the 60th or 61st, the tensile strength of the substrate is 300 MPa or more, and the problem of stretching or breaking of the substrate is less likely to occur. In addition to the effects of the invention described in any one of the items 60 to 62 φ, the thickness ratio of the substrate to the adhesive is 0.01 to 1 〇, in addition, 尙A thin adhesive tape with high tensile strength is obtained. According to the invention of the 64th aspect, the surface roughness Rmax of the substrate is 0.5/zm or less, and the surface of the substrate is very smooth, in addition to the effects similar to those of the invention described in any one of the items 60 to 63. When the adhesive is pressed to the circuit board, the adhesive is easily separated from the base. According to the invention of the sixty-fifth aspect, the adhesive of one of the adhesive tapes and the adhesive of the other of the 186-(182) 1321868 adhesive tape are overlapped in one step before the adhesive is formed on the covering. After the desired thickness of the adhesive is obtained, an adhesive is formed on the coated body, so that the thickness of each adhesive tape is thin. Although the number of the adhesive tape is increased, the winding diameter of the adhesive tape per one disk is more Therefore, the number of rolls of adhesive tape per one disk can be increased, and the amount of adhesive that can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the productivity of the electronic machine can be improved. According to the invention of the 66th aspect, in addition to the effects similar to those of the invention described in the item 65, the number of adhesive tapes requiring low temperature management can be reduced, and the transportation and storage of the adhesive tape can be more efficiently managed. According to the invention described in any one of items 67 to 72, since the member to be connected has good transcription property (adhesiveness) and good connection reliability, the scrap rate in the improvement step can be improved, and the work can be improved. In the case of sex #, the conventional rectangular-oriented conductive tape is provided, so that productivity and workability can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the connection between the adhesive sheets in the method of joining the adhesive tapes of the first embodiment. Fig. 2A and Fig. 2B are oblique views of the connecting steps of the connecting portion of Fig. 1. Fig. 3 is a schematic view showing the step of pressing the adhesive of the adhesive device. -187- (183) 1321868 Fig. 4 is a cross-sectional view showing adhesion between circuit boards. Fig. 5 is a perspective view showing a method of manufacturing an adhesive tape. Fig. 6 is a perspective view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 7 is a perspective view showing a method of connecting an adhesive tape according to a modification of the second embodiment of the present invention.

第8圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第8圖A係黏著材盤間之連接的斜視圖，第8圖B 係第8圖A之連接部份之連接方法的斜視圖，第8圖c 係第8圖A之連接部份的平面圖。 第9圖係本發明第2實施形態之黏著材膠帶連接方法 的剖面圖。 第1 〇圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第11圖係本發明第4實施形態之黏著材膠帶連接方 φ法的剖面圖。 第12圖A及B係第1實施形態之黏著材膠帶連接方 法圖，第12圖A係黏著材盤間之連接的斜視圖，第1 2 圖B係第1 2圖A之連接部份之連接方法的斜視圖。 第1 3圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第14圖· A及第14圓B係本發明第3實施形態之黏 著材膠帶連接方法的剖面圖，第14圖A係加熱加壓前之 狀態，第1 4圖B係加熱加壓後之狀態。 -188- (184) 1321868 第15圖A及第15圖B係本發明第4實施形態之黏 著材膠帶連接方法圖，第15圖A係剖面圖，第15圖B 係平面圖。 第16圖A及第16圖B係第1實施形態之黏著材膠 帶連接方法圖，第16圖A係黏著材盤間之連接的斜視圖 ，第1 6圖B係第1 6圖A之連接部份（b )的斜視圖。 第17圖係本發明第2實施形態之黏著材膠帶連接方 φ 法的剖面圖。 第1 8圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第1 9圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第20圖A〜C係第1實施形態之黏著材膠帶連接方 法圖，第20圖A係黏著材盤間之連接的斜視圖，第20 圖B及C係第20圖A之連接部份之連接方法的剖面圖。 # 第21圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第22圖A〜C係第1實施形態之黏著材膠帶盤圖， 第22圖A係黏著材膠帶盤的斜視圖，第22圖B係第22 圖A之正面圖，第22圖C係第22圖A之連結膠帶之平 面圖。 第23圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第24圖係本發明第2實施形態之連結膠帶之平面圖 〇 第2 5圖係本發明第3實施形態之連結膠帶之平面圖 -189- (185) 1321868 第26圖係本發明第4實施形態之黏著材膠帶盤的斜 視圖。 第27圖A〜C係第1實施形態之黏著材膠帶盤圖， 第27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27 圖A之正面圖’第27圖C係第27圖A之連接部份之剖 面圖。8A to C are the connection method of the adhesive tape of the first embodiment, FIG. 8A is a perspective view of the connection between the adhesive sheets, and FIG. 8B is a connection method of the connection portion of FIG. 8A. The oblique view of Fig. 8 is a plan view of the connecting portion of Fig. 8A. Fig. 9 is a cross-sectional view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 1 is a cross-sectional view showing a method of joining an adhesive tape according to a third embodiment of the present invention. Figure 11 is a cross-sectional view showing the method of joining the adhesive tape of the fourth embodiment of the present invention. 12A and B are views showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 12A is a perspective view showing a connection between the adhesive sheets, and Fig. 2B is a connection portion of Fig. 2A. An oblique view of the connection method. Fig. 3 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Fig. 14A and Fig. 14B are cross-sectional views showing a method of connecting an adhesive tape according to a third embodiment of the present invention, and Fig. 14A is a state before heating and pressurization, and Fig. 4B is a state after heating and pressurization. status. -188- (184) 1321868 Fig. 15A and Fig. 15B are views showing a method of connecting an adhesive tape according to a fourth embodiment of the present invention, and Fig. 15 is a cross-sectional view, and Fig. 15B is a plan view. Fig. 16A and Fig. 16B are views showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 16A is a perspective view showing a connection between the adhesive sheets, and Fig. 6B is a connection of Fig. 6A. An oblique view of part (b). Fig. 17 is a cross-sectional view showing the method of joining the adhesive tape of the second embodiment of the present invention. Fig. 18 is a cross-sectional view showing a method of joining an adhesive tape according to a third embodiment of the present invention. Fig. 19 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. 20A to C are views showing a method of connecting adhesive tapes according to the first embodiment, and Fig. 20A is a perspective view showing the connection between the adhesive sheets, and Fig. 20B and the connecting portion of Fig. 20A of Fig. 20 A cross-sectional view of the connection method. #第第图图图的图图。 Figure 21 is a schematic diagram of the adhesive pressing step of the adhesive device. Fig. 22A to Fig. 4C are diagrams showing the adhesive tape of the first embodiment, Fig. 22A is a perspective view of the adhesive tape tray, Fig. 22B is a front view of Fig. 22, and Fig. 22 is a Figure 2 is a plan view of the connecting tape of Figure A. Figure 23 is a schematic view of the adhesive pressing step of the adhesive device. Figure 24 is a plan view of a connecting tape according to a second embodiment of the present invention. Figure 25 is a plan view of a connecting tape according to a third embodiment of the present invention - 189- (185) 1321868 Figure 26 is a fourth embodiment of the present invention. Oblique view of the adhesive tape tray. Fig. 27A to Fig. C are diagrams showing the adhesive tape of the first embodiment, Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is the front view of Fig. 27A. Figure 27 is a cross-sectional view of the connecting portion of Figure A.

第28圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第29圖係PDP之黏著劑之使用狀態的斜視圖。 第30圖係本發明第2實施形態之黏著材膠帶盤的斜 視圖。 第31圖A係將本發明之黏著材膠帶盤之黏著材膠帶 應用於LOC構造之半導體裝置時之黏著材膠帶之剖面圖 ’第31圖B係將本發明之黏著材膠帶盤之黏著材膠帶應 用於LOC構造之半導體裝置時之LOC構造之半導體裝置 之剖面圖。 第32圖A〜C係應用本發明之黏著材膠帶盤的黏著 裝置之槪略圖，第32圖A係正面圖，第32圖B係側面 圖’第32圖C係第32圖B之黏著材膠帶冲切貼附部89 的重要部位放大圖。 第33圖A及B係黏著劑膠帶圖，第33圖A係捲繞 著黏著濟膠帶之盤之斜視圖，第33匾B係第3 3圖A之 A-A剖面圖。 第3 4圖係P D P之黏著劑之使用狀態的斜視圖》 (186) (186)1321868 第35圖係將黏著劑塗布於基材之步驟的剖面圖。 第36圖A〜C係本發明第2實施形態之黏著劑膠帶 之剖面圖。 第3 7圖A〜C係本發明第3實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第3 8圖A〜C係本發明第4實施形態之黏著劑膠帶 製造方法的步驟圖。 . 第39圖A及B係黏著劑膠帶圖，第39圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從黏著劑側觀 看第39圖A之黏著劑膠帶時的平面圖。 第40圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第4 1圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第42圖A〜C係本發明第3實施形態之黏著劑膠帶 之剖面圖。 第43圖A〜C係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第44圖A〜C係本發明第5實施形態之黏著劑膠帶 製造方法的步驟圖。 第45圖A及B係本發明第1實施形態之黏著劑膠帶 盒圖，第45圖A係黏著劑膠帶盒之斜視圖，第45圖B 係第45圖A之A-A剖面圖。 第46圖係第45圖A所示之膠帶盒之盤的裝設狀態 剖面圖。 -191 - (187) 1321868 第47圖係黏著裝置之黏著劑壓著步驟的正面圖。 第48圖係黏著劑膠帶盒之製造方法的步驟圖。 第49圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第5 0圖係本發明第3實施形態之黏著劑膠帶之剖面 圖。 第5 1圖A及B係本發明第4實施形態之黏著劑膠帶Figure 28 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 29 is a perspective view showing the state of use of the adhesive of the PDP. Figure 30 is a perspective view of an adhesive tape tray according to a second embodiment of the present invention. Figure 31A is a cross-sectional view of an adhesive tape when the adhesive tape of the adhesive tape of the present invention is applied to a semiconductor device of the LOC structure. Fig. 31B is an adhesive tape of the adhesive tape of the present invention. A cross-sectional view of a semiconductor device of the LOC structure applied to a semiconductor device of the LOC structure. 32A to C are schematic views showing an adhesive device for applying an adhesive tape tray of the present invention, and Fig. 32A is a front view, and Fig. 32B is a side view '32, Fig. C, the adhesive material of Fig. 32B. An enlarged view of an important part of the tape punching and attaching portion 89. Fig. 33A and Fig. B are diagrams of the adhesive tape, and Fig. 33A is a perspective view of the disk around which the adhesive tape is wound, and Fig. 33B is a cross-sectional view taken along line A-A of Fig. 3A. Fig. 34 is a perspective view showing the state of use of the adhesive of P D P (186) (186) 1321868 Fig. 35 is a cross-sectional view showing a step of applying an adhesive to a substrate. Fig. 36 is a cross-sectional view showing an adhesive tape according to a second embodiment of the present invention. Fig. 37 is a step view showing a pressure-sensitive adhesive tape and a method of pressing the same according to a third embodiment of the present invention. Fig. 3A is a flow chart showing a method of producing an adhesive tape according to a fourth embodiment of the present invention. Fig. 39 is a view of the adhesive tape, Fig. 39 is a perspective view of the disk around which the adhesive tape is wound, and Fig. 39B is a view of the adhesive tape of Fig. 39A from the adhesive side. Floor plan. Figure 40 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 4 is a schematic view showing an adhesive pressing step of the adhesive device according to the second embodiment of the present invention. 42A to C are cross-sectional views showing an adhesive tape according to a third embodiment of the present invention. 43A to C are process diagrams of an adhesive tape and a method of pressing the same according to a fourth embodiment of the present invention. Fig. 44 is a flow chart showing a method of producing an adhesive tape according to a fifth embodiment of the present invention. Fig. 45 is a perspective view of an adhesive tape cartridge according to a first embodiment of the present invention, Fig. 45A is a perspective view of an adhesive tape cartridge, and Fig. 45B is a cross-sectional view taken along line A-A of Fig. 45A. Fig. 46 is a sectional view showing the mounting state of the disc cartridge of Fig. 45A. -191 - (187) 1321868 Figure 47 is a front view of the adhesive pressing step of the adhesive device. Figure 48 is a step diagram of a method of manufacturing an adhesive tape cartridge. Fig. 49 is a schematic view showing the step of adhering the adhesive to the adhesive device according to the second embodiment of the present invention. Fig. 5 is a cross-sectional view showing an adhesive tape according to a third embodiment of the present invention. 51A and A are adhesive tapes according to a fourth embodiment of the present invention.

及其壓著方法的步驟圖。 第52圖A及B係第1實施形態之黏著材膠帶圖，第 52圖A係黏著材盤間之連接的斜視圖，第52圖B係第 52圖A之連接部份的剖面圖。 第5 3圖係第2實施形態之黏著材膠帶的剖面圖。 第54圖A〜C係第55圖之連接部份之連接步驟的剖 面圖，第54圖A係放電前之狀態，第54圖B係放電後 之狀態，第5 4圖C係連接部份之加熱壓著圖。 第55圖係黏著材膠帶連接方法之黏著材盤間之連接 的斜視圖。 第56圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第57圖A〜C係第1實施形態之黏著材膠帶盤圖， 第57圖A係黏著材膠帶盤的斜視圖，第57圖B係第57 ® A之正面圖，第57圖C係第57圖A之蓋體構件之正 面簡。- —— ^ 第58圖係黏著材膠帶盤之製造方法的步驟圖。 第5 9圖係本發明第2實施形態之黏著材膠帶盤之側 -192- (188) 1321868 面圖。 第60圖A及B係本發明第3實施形態之黏著材膠帶 盤之正面圖、及黏著劑膠帶之更換說明圖。 第6 1圖係本發明第4實施形態之捲部之側板的斜視 圖。 第62圖A及B係本發明第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 φ A-A剖面圖。 第63圖係用以說明第62圖A及第62圖B所示之黏 著具之使用方法的側面圖。 第64圖係黏著具之製造方法的步驟圖。 第65圖A及B係第1實施形態之黏著材膠帶圖，第 65圖A係黏著材膠帶捲繞於盤之斜視圖，第65圖A係第 65圖A之A-A剖面圖。 第66圖A及B係第1實施形態之黏著材膠帶之黏著 # 材形成步驟圖，第66圖A係使各黏著材膠帶重疊成一體 且將一方之基材捲取至捲取用盤之步驟的槪略圖，第66 圖B係第66圖A之黏著劑間之重疊部份的剖面圖。 第67圖係黏著裝置在被覆體上形成黏著劑之步驟的 槪略圖。 第68圖係捲繞著黏著材膠帶之盤之斜視圖。 第69圖A係第2實施形態之黏著材膠帶之黏著材形 成步驟的剖面圖，第69圖B係應用第69圖A之黏著材 實施電路基板間之黏著的剖面圖。 -193- (189) 1321868 第70圖係本發明之2層構成向異導電材膠帶之供應 形態的模式圖。 第71圖係本發明之3層構成向異導電材膠帶之供應 形態的模式圖。 « (And a step diagram of the pressing method. Fig. 52 is a perspective view of the adhesive tape of the first embodiment, Fig. 52A is a perspective view showing the connection between the adhesive plates, and Fig. 52B is a cross-sectional view of the connecting portion of Fig. 52A. Fig. 5 is a cross-sectional view showing the adhesive tape of the second embodiment. Fig. 54 is a sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55, Fig. 54 is a state before discharge, Fig. 54B is a state after discharge, and Fig. 54 is a connecting portion of Fig. The heating is pressed against the figure. Fig. 55 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method. Figure 56 is a schematic view of the adhesive pressing step of the adhesive device. 57A to C are the adhesive tapes of the first embodiment, and Fig. 57A is a perspective view of the adhesive tape tray, and Fig. 57B is a front view of the 57th A, and Fig. 57C 57 The front side of the cover member of Figure A is simple. - —— ^ Figure 58 is a step diagram of the method of manufacturing the adhesive tape tray. Fig. 5 is a plan view showing the side of the adhesive tape tray of the second embodiment of the present invention - 192 - (188) 1321868. Fig. 60 is a front view of the adhesive tape tray and a replacement explanatory view of the adhesive tape according to the third embodiment of the present invention. Fig. 61 is a perspective view showing a side plate of a winding portion according to a fourth embodiment of the present invention. Fig. 62 is a perspective view showing an adhesive of the first embodiment of the present invention, Fig. 62A is a perspective view of the adhesive, and Fig. 62B is a cross-sectional view taken along line φ A-A of Fig. 62A. Fig. 63 is a side view for explaining the method of using the adhesive shown in Figs. 62A and 62B. Fig. 64 is a step diagram of the manufacturing method of the adhesive. Fig. 65 is a perspective view of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive tape wound around the disk, and Fig. 65A is a cross-sectional view taken along line A-A of Fig. 65A. Fig. 66A and Fig. B are the adhesion of the adhesive tape of the first embodiment. Fig. 66 is a view showing that the adhesive tape is integrally formed and the one substrate is taken up to the winding disk. A schematic diagram of the steps, Fig. 66B is a cross-sectional view of the overlapping portion between the adhesives of Fig. 66A. Figure 67 is a schematic view showing the steps of the adhesive device forming an adhesive on the covering. Figure 68 is a perspective view of the disk around which the adhesive tape is wound. Fig. 69 is a cross-sectional view showing the steps of forming the adhesive material of the adhesive tape of the second embodiment, and Fig. 69B is a cross-sectional view showing the adhesion between the circuit boards by applying the adhesive of Fig. 69A. -193- (189) 1321868 Fig. 70 is a schematic view showing a form of supply of a two-layer structure to a different-conductive conductive tape of the present invention. Fig. 71 is a schematic view showing a form of supply of a three-layer structure of the present invention to a different-conductive conductive tape. « (

【主要元件對照表】 1 黏著材膠帶. 2 捲部 2 a 捲部 2b 黏著材膠帶盤 2c 黏著材膠帶盤 3 fiin. 盤 3 a 盤 5 捲軸 7 側板 7a 側板 7b 側板 8 蓋體構件 9 基材 9 a 基材 9b 基材 10 —乾燥劑 11 膜狀黏著劑 11a 黏著劑[Main component comparison table] 1 Adhesive tape. 2 Coiled part 2 a Coiled part 2b Adhesive tape 2c Adhesive tape 3 fiin. Plate 3 a Plate 5 Reel 7 Side plate 7a Side plate 7b Side plate 8 Cover member 9 Substrate 9 a substrate 9b substrate 10 - desiccant 11 film adhesive 11a adhesive

-194- (190) 黏著劑 收容部 導電粒子 黏著裝置 導引件 捲取盤 加熱加壓頭 電路基板 電極 導引銷 配線電路 電極 聚四氟乙烯材 捲出機-194- (190) Adhesive accommodating part Conductive particles Adhesive device Guide member Coiling disk Heating and pressing head Circuit board Electrode Guide pin Wiring circuit Electrode Teflon material Rolling machine

PDP 塗布機 結束標記 乾燥爐 終端部 捲取機 始端部 切割機 重疊部份 縫隙 -195- (191)1321868PDP coater End mark Drying furnace End part Coiling machine Starting end Cutting machine Overlapping part Gap -195- (191)1321868

36 工作台 4 1 連結膠帶 43 黏著劑 44 凹凸 46 卡止銷 47 卡止構件 48 爪部 49 爪部 50 彈性構件 5 1 爪 53 夾子 5 5 夾持片 56 模具 5 7 模具 5 8 凹凸 59 貫通孔 60 矽粘著膠帶 6 1 矽粘著膠帶 62 矽粘著劑 63 基材 64 樹脂製黏著劑 一 充塡機 66 加熱器 67 連結膠帶36 Table 4 1 Connecting tape 43 Adhesive 44 Bumps 46 Locking pin 47 Locking member 48 Claw 49 Claw 50 Elastic member 5 1 Claw 53 Clamp 5 5 Clamping piece 56 Mold 5 7 Mold 5 8 Bump 59 Through hole 60 矽 Adhesive tape 6 1 矽 Adhesive tape 62 矽 Adhesive 63 Substrate 64 Resin adhesive-filling machine 66 Heater 67 Connecting tape

-196- (192) 切口部份 標記 標記 發光部 受光部 連接部份 切口 卡止具 厚度檢測感測器 支持膜 控制裝置 黏著劑層 半導體用黏著膜 半導體元件 引線框架 密封材 焊絲 匯流排條 冲切模具 引線框架搬運部 黏著材膠帶冲切貼附部 加熱器部 黏著材膠帶盤 黏著材膠帶 -197- (193) 黏著材膠帶捲出滾輪 黏著材膠帶 公模 母模 膜壓板 縫隙 殼體 半殼體 φ 半殼體 黏著劑膠帶盒 導引件 縫隙 凝聚力降低線 工作台 放電機 拉出□ ❿ 軸 蓋帽 被嵌合部 黏著具 開口部 加熱構件 ^ 電熱板 齒輪 ί -198- (194)1321868 117 齒 輪 118 齒 輪 單 元 119 第 二 殼 體 1 20 電 源 開 關 12 1 盤-196- (192) Incision Part Marking Marking Light-emitting part Light-receiving part Connection part Notch Locking Thickness Detection Sensor Supporting Film Control Device Adhesive Layer Semiconductor Adhesive Film Semiconductor Element Lead Frame Sealing Material Wire Convergence Strip Punching Mold Lead Frame Transporting Adhesive Tape Punching Attachment Heater Adhesive Tape Adhesive Tape Adhesive Tape - 197- (193) Adhesive Tape Roll-Off Roller Adhesive Tape Male Mold Master Film Press Plate Slit Housing Half Shell φ Half-shell adhesive tape guide guide gap cohesion reduction line table discharger pull-out □ 轴 Shaft cap is fitted with adhesive part opening heating element ^ electric heating plate gear ί -198- (194)1321868 117 gear 118 Gear unit 119 second housing 1 20 power switch 12 1

Claims (1)

1321868 拾、申請專利範圍 产)年’丨月’妇修(更)正替換頁f卜Ρέ 第92 1 20892號專利申請案 中文申請專利範圍修正本 民國97年11月14日修正1321868 Picking up, applying for a patent range Production) Year '丨月' Women's repair (more) is replacing page f Ρέ Ρέ 92 1 20892 Patent application Chinese patent application scope amendments Amendment of November 14, 1997 1. 一種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤上之一方之黏著 材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶 ，其特徵爲： 將一方之黏著材膠帶之終端部反折，使一方之黏著材 膠帶之黏著劑面及另一方之黏著材膠帶之黏著劑面重疊， 並實施兩者之重疊部份的加熱壓著使其連接。 2. 如申請專利範圍第1項記載之黏著材膠帶連接方法 ，其中 一方之黏著材膠帶之終端部標示著結束標記。A method for joining adhesive tapes, which is used for attaching an adhesive tape coated on a substrate to an adhesive tape of one of the coils on one of the reels, and to the other of the reels The adhesive tape of the other side is characterized in that: the end portion of one of the adhesive tapes is folded back, and the adhesive surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped, and both are implemented. The overlapping portions are heated and pressed to connect them. 2. The method of attaching an adhesive tape according to the first aspect of the patent application, wherein the end portion of the adhesive tape of one of the ends is marked with an end mark. 3. —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤之一方之黏著材 膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶， 其特徵爲= 另一方之黏著材膠帶之始端部係利用將前導膠帶貼附 於捲附至捲盤上之黏著材膠帶基材面來使其煞車，在將一 --方之黏著材膠帶之終端部反折後，再使前導膠帶之黏著劑 面和一方之黏著材膠帶之終端部之黏著劑面重疊，實施重 疊部份之加熱壓著。 1321868 4. 一種黏著材膠帶連接方法’係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤上之—方之黏著 材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶 ，其特徵爲：3. A method for attaching an adhesive tape, which is used to connect an adhesive tape coated with an electrode for attaching an electrode to one of the reels of one of the reels, and to the reel of the other side. The other side of the adhesive tape, which is characterized by the fact that the beginning of the other adhesive tape is attached to the surface of the adhesive tape substrate attached to the reel by the leading tape, so that one will be - - After the end portion of the adhesive tape is folded back, the adhesive surface of the leading tape and the adhesive surface of the end portion of the adhesive tape are overlapped, and the overlapping portions are heated and pressed. 1321868 4. A method for attaching an adhesive tape is used to connect an adhesive tape coated with an electrode for attaching an electrode to a reel of one side, and to take up the tape to the other side. The other adhesive tape on the other side is characterized by: 另一方之黏著材膠帶之始端部係利用將前導膠帶貼附 於捲附至捲盤上之黏著材膠帶基材面來使其煞車，使前導 膠帶之黏著劑面和一方之黏著材膠帶之終端部之黏著劑面 重疊，實施重疊部份之加熱壓著。 5. —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤之一方之黏著材 膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶， 其特徵爲： 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部重疊，在兩者之重疊部份插入卡止插銷來實施 連接。The other end of the adhesive tape is made by attaching the leading tape to the surface of the adhesive tape substrate attached to the reel, so that the adhesive tape of the leading tape and the end of the adhesive tape of one side are used. The adhesive faces of the parts are overlapped, and the overlapping portions are heated and pressed. 5. A method for attaching an adhesive tape, which is used for attaching an adhesive tape coated with an electrode for attaching an adhesive to one of the reels of one of the reels, and for winding onto another reel. The other adhesive tape is characterized in that the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are overlapped, and a locking pin is inserted into the overlapping portion to perform the connection. 6. —種黏著材膠帶連接方法，係利用卡止構件來連接 用以連接基材上塗布著電極連接用黏著劑之捲取至一方之 捲盤上之一方之黏著材膠帶、及捲取至另一方之捲盤上之 另一方之黏著材膠帶的黏著材膠帶，其特徵爲： 卡止構件具有配設於一方及另一方之端部之爪部、及 ••配設於爪部間之彈性構件，一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部會互相抵接，配設於卡止構 件之一端之爪部會卡止於一方之黏著材膠帶之終端部，配 設於另一端之爪部會卡止於另一方之黏著材膠帶之始端部 -2- 1321868 ，以彈性構件拉近兩方之爪部。 7. —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤上之一方之黏著 材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶 ，其特徵爲：6. A method for joining adhesive tapes by using a locking member to connect an adhesive tape for attaching one side of a roll coated with an electrode connecting adhesive to one of the reels, and to take up to The adhesive tape of the other adhesive tape on the other side of the reel is characterized in that: the locking member has a claw portion disposed at one end of the other side, and • is disposed between the claw portions In the elastic member, the end portion of one of the adhesive tapes and the other end of the adhesive tape are abutted against each other, and the claw portion disposed at one end of the locking member is locked at the end portion of one of the adhesive tapes. The claw portion disposed at the other end is locked to the beginning end of the other adhesive tape -2- 1321868, and the elastic member is used to draw the claw portions of both sides. 7. A method for attaching an adhesive tape, which is used for attaching an adhesive tape coated with an electrode for attaching an electrode to one of the reels of one of the reels, and for winding onto another reel. The other side of the adhesive tape is characterized by: 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部重疊，以橫剖面略呈3字形之可彈性變形之夾 子實施兩者之重疊部份的夾持固定。 8. —種黏著材膠帶連接方法，其特徵爲： 係使一方之黏著材膠帶及另一方之黏著材膠帶重疊， 以橫剖面略呈3字形之金屬製夾持片夾住一方之黏著材膠 帶及另一方之黏著材膠帶之重疊部份，並從重疊部份之兩 面側壓扁夾持片來連接兩者。The end portion of one of the adhesive tapes and the other end of the adhesive tape are superimposed, and the elastically deformable clips having a substantially three-dimensional cross section are used to sandwich and fix the overlapping portions. 8. A method for attaching an adhesive tape, which is characterized in that: one of the adhesive tapes and the other adhesive tape are overlapped, and the adhesive tape sandwiching one of the metal clips having a slightly three-dimensional cross section And the overlapping portion of the adhesive tape of the other side, and the clamping piece is flattened from both sides of the overlapping portion to connect the two. 9. 一種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之捲盤上之一方之黏著 材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠帶 ，其特徵爲： 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部之其中任何一方之黏著劑面重疊於另一方之基 材面上，兩者之重疊長度爲黏著劑膠帶寬度之2倍至50 倍之範圍，以兩者之加熱壓著實施連接。 -10 . —種黏著材膠帶連接方法，係用以連接基材上塗 布著電極連接用黏著劑之捲取至一方之捲盤上之一方之黏 著材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠 -3- 1321868 帶，其特徵爲： 將一方之黏著材膠帶之終端部折向黏著劑相對之方向 ，而將另一方之黏著材膠帶之始端部折向黏著劑相對之方 向，使兩者之彎折部份互相卡止重疊且使兩者之黏著材面 相對，實施重疊部份之加熱壓著。 11. 如申請專利範圍第9或10項記載之黏著材膠帶連 接方法，其中9. A method for attaching an adhesive tape, which is used for attaching an adhesive tape coated on a substrate to an adhesive tape of one of the coils on one of the reels, and to the other of the reels The other adhesive tape is characterized in that: the adhesive surface of one of the end portions of one of the adhesive tapes and the other end of the adhesive tape is superposed on the other substrate surface, The overlap length is in the range of 2 to 50 times the width of the adhesive tape, and the connection is performed by heating and pressing the two. -10. A method for joining adhesive tapes, which is used to connect an adhesive tape coated on a substrate to an adhesive tape for one of the coils on one of the reels, and to take up the roll to the other side. The other side of the adhesive tape -3- 1321868 belt, which is characterized in that: the end portion of one of the adhesive tape is folded in the opposite direction of the adhesive, and the other end of the adhesive tape is folded toward the adhesive. In the opposite direction, the bent portions of the two are mutually overlapped and the adhesive faces of the two are opposed to each other, and the overlapping portions are heated and pressed. 11. The method of attaching an adhesive tape according to claim 9 or 10, wherein 一方之黏著材膠帶之終端部會標示著結束標記。 12. 如申請專利範圍第9或10項記載之黏著材膠帶連 接方法，其中 以形成凹凸之一方之模具、及和其咬合之另一方之模 具，夾住一方之黏著材膠帶及另一方之黏著材膠帶之重疊 部份，實施加熱壓著。 1 3 .如申請專利範圍第9或1 0項記載之黏著材膠帶連 接方法，其中The end of the adhesive tape on one side will be marked with an end mark. 12. The method of attaching an adhesive tape according to claim 9 or claim 10, wherein the mold which forms one of the irregularities and the other mold which is engaged with the other one are sandwiched between one of the adhesive tapes and the other adhesive tape. The overlapping portions of the material tape are subjected to heat pressing. 1 3 . The method of attaching an adhesive tape as described in claim 9 or 10, wherein 在一方之黏著材膠帶及另一方之黏著材膠帶之重疊部 份形成貫通孔後，實施重疊部份之加熱壓著。 14· —種黏著材膠帶連接方法，係用以連接矽處理基 材上塗布著電極連接用黏著劑之捲取至一方之捲盤上之一 方之黏著材膠帶、及捲取至另一方之捲盤上之另一方之黏 著材膠帶，其特徵爲： 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部會重疊或抵接，以跨越兩黏著材膠帶之矽處理基材 之表面部份的方式貼附矽黏著膠帶，實施兩黏著材膠帶之 -4 - 1321868 連接。 15. —種黏著材膠帶連接方法，其特徵爲： 申請專利範圍第14項記載之矽黏著膠帶之黏著劑面 之表面張力及黏著材膠帶之矽處理基材之表面張力之差爲 1 0 m N / m ( 1 0 d y n e / c m )以下。 16. 如申請專利範圍第14或15項記載之黏著材膠帶 連接方法，其中After the through hole is formed in the overlapping portion of one of the adhesive tape and the other adhesive tape, the overlapping portion is heated and pressed. 14. A method for joining adhesive tapes, which is used to connect an adhesive tape coated with an electrode for attaching an electrode to an adhesive tape on one of the reels, and to be wound up to another roll. The adhesive tape of the other side of the disc is characterized in that: the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side overlap or abut, and the substrate is processed across the adhesive tape of the two adhesive tapes. The surface part is attached to the adhesive tape and the 4 - 1321868 connection of the two adhesive tapes is implemented. 15. A method for joining adhesive tapes, characterized in that: the surface tension of the adhesive surface of the adhesive tape described in claim 14 of the patent application and the surface tension of the adhesive substrate of the adhesive tape are 10 m N / m (1 0 dyne / cm ) or less. 16. The method of attaching an adhesive tape according to claim 14 or 15, wherein 矽黏著膠帶之黏著力係l〇〇g/25mm以上。 17. —種黏著材膠帶連接方法，其特徵爲： 使一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部重疊或抵接，並將申請專利範圍第1 6項記載之 矽黏著膠帶張貼於兩黏著材膠帶之兩面來實施連接。The adhesive force of the adhesive tape is l〇〇g/25mm or more. 17. A method of joining adhesive tapes, characterized in that: the end portion of one of the adhesive tapes and the other end of the adhesive tape are overlapped or abutted, and the patent application is described in item 16. Adhesive tape is applied to both sides of the two adhesive tapes to perform the connection. 18. —種黏著材膠帶連接方法，係用以連接矽處理基 材上塗布著電極連接用黏著劑之捲取至一方之捲盤上之一 方之黏著材膠帶、及捲取至另一方之捲盤上之另一方之黏 著材膠帶，其特徵爲： 以一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部間夾著兩面塗布著矽黏著劑之矽黏著膠帶之方式 來實施兩黏著材膠帶之連接，兩面之矽黏著劑和矽處理基 材之表面張力之差爲10mN/m ( lOdyne/cm)以下，且黏著 力爲100g/25mm以上。 -19. 一種黏著材膠帶連接方法，係用以連接基材上塗 布著電極連接用黏著劑之捲取至一方之捲盤上之一方之黏 著材膠帶、及捲取至另一方之捲盤上之另一方之黏著材膠 -5- 1321868 帶，其特徵爲： 一方之黏著材膠帶之終端部、及另一方之黏著材膠帶 之始端部重疊或抵接，使糊狀之樹脂製黏著劑附著於重疊 部份或抵接部份，以糊狀之樹脂製黏著劑之硬化來實施兩 者之連接。 20. 如申請專利範圍第19項記載之黏著材膠帶連接方 法，其中18. A method for attaching an adhesive tape, which is used for joining an adhesive tape coated with an electrode for attaching an electrode to an adhesive tape of one of the reels, and for winding the tape to the other side. The adhesive tape of the other side of the disc is characterized in that: the end portion of the adhesive tape of one of the adhesive tapes is bonded to the beginning of the adhesive tape of the other side, and the adhesive tape coated with the adhesive on both sides is applied. The adhesion between the two adhesive tapes is such that the difference between the surface tension of the adhesive on both sides and the treated substrate is 10 mN/m (10 Odyne/cm) or less, and the adhesive force is 100 g/25 mm or more. -19. A method for attaching an adhesive tape, which is used for attaching an adhesive tape coated on a substrate to an adhesive tape for one of the coils on one of the reels, and to the other of the reels The adhesive tape of the other side is a tape of the adhesive tape - 5 - 1321868, which is characterized in that: the end portion of one of the adhesive tapes and the other end of the adhesive tape are overlapped or abutted to adhere the paste-like resin adhesive. The connection between the two is performed by hardening the paste-form resin adhesive on the overlapping portion or the abutting portion. 20. The method of joining adhesive tapes as recited in claim 19, wherein 樹脂製黏著劑係從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取之至少1種材料所構成。 21. —種黏著材膠帶黏著裝置，其特徵爲： 裝著著黏著材膠帶之黏著裝置上，裝設著用以供應串 請專利範圍第1 9或20項記載之樹脂製黏著劑的充塡機。 22. —種黏著材膠帶連接方法，其特徵爲：The resin-made adhesive is composed of at least one selected from the group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. 21. An adhesive tape adhesive device, characterized in that: the adhesive device with the adhesive tape is provided with a resin adhesive for supplying the resin adhesive according to the scope of the patent application No. 19 or 20. machine. 22. A method of joining adhesive tapes, characterized by: 利用卡止具連接一方之黏著材膠帶之終端部及另—方 之黏著材膠帶之始端部，連接部份會以黏著材膠帶覆蓋卡 止具。 1321868 染、（一）、本案指定代表圖為：第1圖 (二）、本代表圖之元件代表符號簡單說明： 1 ： 黏著材膠帶 3 ： 盤 3a ：盤 5 ： 捲軸 7 ： 側板 28 :結束標記 30 :終端部 32 :始端部The end portion of the adhesive tape of one side and the beginning end of the other adhesive tape are connected by the card holder, and the connecting portion covers the card holder with the adhesive tape. 1321868 Dyeing, (1), the designated representative figure of this case is: Figure 1 (2), the representative symbol of the representative figure is a simple description: 1 : Adhesive tape 3 : Disk 3a : Disk 5 : Reel 7 : Side plate 28 : End Mark 30: Terminal portion 32: Starting end portion 捌、本案若有化學式時，請揭示最能顯示發明特徵的化學 式：捌 If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
TW092120892A 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape TW200409405A (en)

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JP2003118287A JP4654566B2 (en) 2003-04-23 2003-04-23 Adhesive tape connection method and adhesive tape connector
JP2003130197A JP4238626B2 (en) 2003-05-08 2003-05-08 Adhesive tape reel, adhesive device, connection method, and adhesive tape connector
JP2003130196A JP2004331833A (en) 2003-05-08 2003-05-08 Tape reel for adhesive materials
JP2003176321A JP2005330296A (en) 2003-06-20 2003-06-20 Connecting method of adhesive material tape
JP2003176322A JP2005330297A (en) 2003-06-20 2003-06-20 Method of forming adhesive material by adhesive material tape

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TWI580628B (en) * 2011-08-18 2017-05-01 日立化成股份有限公司 Adhesive material reel, method for blocking inhibition, exchange method for adhesive material reel, feeding method of adhesive material tape, method for manufacturing adhesive material reel, method for arranging end marker, reel kit, and package body
TWI613679B (en) * 2011-09-15 2018-02-01 兆科學公司 Microcavity carrier belt and method of manufacture

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WO2004011356A1 (en) 2004-02-05
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KR20060084453A (en) 2006-07-24
TWI321973B (en) 2010-03-11
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TWI322129B (en) 2010-03-21
KR20060084862A (en) 2006-07-25
KR100981478B1 (en) 2010-09-10
TW200913828A (en) 2009-03-16
KR100700438B1 (en) 2007-03-28

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