JP2004059776A - Anisotropic conductive material tape - Google Patents
Anisotropic conductive material tape Download PDFInfo
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- JP2004059776A JP2004059776A JP2002221225A JP2002221225A JP2004059776A JP 2004059776 A JP2004059776 A JP 2004059776A JP 2002221225 A JP2002221225 A JP 2002221225A JP 2002221225 A JP2002221225 A JP 2002221225A JP 2004059776 A JP2004059776 A JP 2004059776A
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Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、例えば液晶パネル、PDPパネル、ELパネル、ペアチップ実装などの電子部品と回路板、回路板同士を接着固定すると共に、両者の電極同士を電気的に接続する異方導電材を供給するための異方導電材テープに関し、特に異方導電材テープの巻き形態に関する。
【0002】
【従来の技術】
異方導電材テープによる接続方法として、相対峙する電極間にフィルム状の接着剤である異方導電材を挟み、加熱加圧することにより接続を行うことがなされている。フィルム状の接着剤中には、電極間の導通を得る為の導電粒子が混合され、樹脂としては、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系、光硬化性樹脂が用いられている(例えば、特開昭55−104007号公報参照)。
また、導電粒子を含まず、樹脂のみからなる回路接続方法も知られている(例えば、特開昭60−262430号公報参照)。
樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、シリコーン樹脂系、アクリル樹脂系が知られている。熱可塑性樹脂系、熱硬化性樹脂系共に接続する為に、加熱加圧が必要である。熱可塑性樹脂系では樹脂を流動させ被着体との密着力を得る為に、また熱硬化性樹脂系では更に樹脂の硬化反応を行う為である。近年、接続信頼性の面から、熱可塑性樹脂と熱硬化性樹脂の混合系、熱硬化性樹脂系が主流となっている。また、低温度で接続することのできる光硬化樹脂系も工業的に用いられ始めている。
【0003】
【発明が解決しようとする課題】
近年、被接続体の反り及び伸びを防ぐために異方導電材の接続時の接続温度の低温化が要求されている。また、異方導電材の接続用途の拡大や液晶パネル、PDPパネル、ELパネル、ベアチップ実装などの需要拡大に伴い接続時のタクトタイムの短時間化の要求が、強くなされるようになっている。
また、異方導電材の接続需要及び用途の拡大に伴い、短時間接続のみならず、生産性向上が要求されている。液晶パネル、PDPパネル、ELパネル、ベアチップ実装などの需要拡大により、異方導電材テープの使用量は増加している。一方、液晶パネルの大画面及びPDPパネルなど大画面フラットパネルの需要拡大に伴い、異方導電材テープの1枚のパネルに使用される使用量も増加した。従来、異方導電材テープは、断面が円形の芯材にフィルム状の接着剤を巻き重ねたリール形状で供給されており、リールの取り替え時間が生産性向上を妨げていた。
一方、液晶パネルの狭額縁化に伴い、異方導電材テープの狭幅化が進んでおり、従来の同一円芯状に巻いたリール形状では巻崩れが発生し、製造上の工程内歩留が悪化していた。
本発明は、上記欠点に鑑みなされたもので、リールの取り替え時間の間隔を長くし、また巻き崩れによる作業性の低下をなくして生産性の向上に寄与する異方導電材テープを提供することを目的とした。
【0004】
【課題を解決するための手段】
本発明は、[1]フィルム状の接着剤からなる異方導電材を芯材の長手方向に多数回巻き積層したことを特徴とする異方導電材テープである。
また、[2]フィルム状の接着剤の片面に基材フィルムを設けた2層構造の異方導電材である上記[1]に記載の異方導電材テープである。
また、[3]フィルム状の接着剤の両面に基材フィルムを設けた3層構造の異方導電材である上記[1]に記載の異方導電材テープである。
また、[4]基材フィルムの片面または両面が剥離処理された基材フィルムである上記[2]または上記[3]に記載の異方導電材テープである。
また、[5]フィルム状の接着剤の幅が、0.5〜5mmである上記[1]ないし上記[4]のいずれかに記載の異方導電材テープである。
また、[6]基材フィルムの強度が、12kg/mm2以上で、伸びが、60〜200%、厚みが、100μm以下である上記[2]ないし上記[5]のいずれかに記載の異方導電材テープである。そして、基材フィルムは、有色透明または有色不透明に着色してあると基材フィルムと接着剤の判別が容易であり、また、巻きだし部の位置が容易となり、作業性が向上する。
【0005】
【発明の実施の形態】
本発明の一実施形態は、図1及び図2に示したように、糸巻き状にフィルム状の接着剤2と両面を剥離処理した基材フィルム1の2層構造あるいはフィルム状の接着剤2と接着剤面を剥離処理した2種の基材5、6の3層構造からなる異方導電材テープの供給形態である。
異方導電材テープを側板3の付いた芯材(巻芯)4の長手方向に多数回巻き積層して糸巻き状に巻くことにより、巻崩れのない、長尺の異方導電材テープの供給が可能あり、生産性の向上が可能となる。
基材フィルム1、5、6の引張り強度は、12kg/mm2以上、基材フィルム1、5、6の破断伸びは60〜200%にすることにより、基材フィルムが強度を持ち、伸びが小さいため、異方導電材であるフィルム状接着剤2を接続部材に転写する前のプロセスにおいて、フィルム状接着剤2が伸びたり、厚みが薄くなったり、幅が細くなったりすることを防止できる。また、基材フィルム1、5、6の厚みはハンドリング及び環境面から考えると100μm以下が望ましい。
薄いと上記効果に劣るようになるので0.5μm以上とするのが好ましい。フィルム状の接着材である異方導電材が、粘着性がなく、ブロッキング現象を示さないものであればフィルム状の接着材を基材フィルム無しで単独で糸巻き状に巻くことができる。
基材フィルムの剥離処理は、シリコンまたはフッ素処理を行うことにより容易に行うことができ、基材フィルムの片面にのみ剥離処理を行うと、基材フィルムの表裏に離型性に差を設けることができ、基材フィルムに対する背面転写を防止することができる。また、基材フィルムの両面に剥離処理を行うと、フィルム状接着剤面はシリコン及びフッ素処理を行い、剥離性を有するものとする。
【0006】
本発明について図面を参照して、さらに具体的に説明する。
図1は本発明のフィルム状の接着剤と両面を剥離処理した基材フィルムからなる2層構造の異方導電材テープの供給形態の一実施例を説明する模式図である。
図2は、図1の基材フィルムを2種類とし、異方導電材を含み、3層構造からなる異方導電材テープの供給形態を説明する模式図である。
本発明の異方導電材テープは、基材フィルム1上に塗布された異方導電材であるフィルム状接着剤2からなり、高精細化された電子部品の接続に用いられるため無機及び有機物の異物及び汚染を防ぐため、基材フィルム1が接着剤の外側となる構造を示している。
本発明に用いられるフィルム状の接着剤2は、高信頼性を有する熱硬化性樹脂系であるエポキシ樹脂系、接着剤の低応力化を図り、接着剤の相溶性に効果のあるシリコーン樹脂系、これらより更に低温度・短時間で接続することが可能なラジカル系は主にアクリル系接着剤を使用するが、これらに制限するものではない。
さらに、本発明の異方導電材テープに用いられる基材フィルムは、強度及び異方導電材を構成する接着剤の剥離性の面からシリコン及びフッ素剥離処理したPP(ポリプロピレン)、OPP(延伸ポリプロピレン)、PET(ポリエチレンテレフタレート)などを用いるが、これらに制限するものではない。
異方導電材を用いた接続は、タクトタイムの向上が求められており、異方導電材の転写性が要求されている。異方導電材テープを側板3の付いた芯材(巻芯)4に糸巻き状に巻くことにより、異方導電材テープの取り替え時間の間隔を長くすることができ、巻崩れのない、長尺の異方導電材テープの供給が可能であり、生産性の向上が可能となる。
図2は、基材フィルムを2種類とし、異方導電材を含み、3層構造からなる異方導電材テープの供給形態であり、接着剤である異方導電材が柔らかい場合、巻芯側の次の基材フィルムによる接着剤の変形を防止することができる。
【0007】
さらに、基材フィルムの物性値である基材フィルムの引張り強度は、12kg/mm2以上で、基材フィルムの破断伸びは、60〜200%にすることにより、基材フィルムに物理的強度が得られ、フィルム状の接着剤の伸びに伴う、薄膜化、幅方向に細くなることを防ぐことが可能である。また、基材の厚みは100μm以下にすることにより、ハンドリング及び環境面での対応が可能である。
【0008】
【実施例】
次に実施例を説明するが、本発明はこの実施例に制限されるものではない。
(実施例1)
(1)異方導電材フィルムの作製
フィルム形成材としてフェノキシ樹脂(高分子量エポキシ樹脂)50gとエポキシ樹脂20g、イミダゾールを5g添加し、酢酸エチルの30重量%溶液を作製し、これに平均粒径2.5μmのNi粉を5体積%添加した。薄く青色に着色した透明な厚み50μmのポリエチレンテレフタレートフィルム(破断強度25kg/mm2、破断伸び130%)の両面にシリコン処理した基材フィルムを用いた。この基材フィルムの片面にロールコータを用いて上記の溶液を塗布し、110℃、5分間乾燥し、厚み50μmの異方導電材フィルムの巻物を得た。
【0009】
(2)異方導電材テープの作製
上記の異方導電材フィルムの巻物を幅1.5mmにスリットしながら、側板のついた直径48mm、幅100mmの芯材(巻芯)の長手方向に多数回巻いて積層し糸巻き状に巻くことにより、300mの長さの異方導電材テープを得た。
この糸巻き状に巻いた異方導電材テープの供給形態にて異方導電材テープ圧着自動機に取付け、供給した場合、異方導電材の転写性及び伸び試験において良好な結果が得られ、しかも、リールの取付け回数が減り、取付けに要する時間や転写性、接着剤の伸びに起因する貼付け作業の繰り返しがなくなり、これらの効果により生産性が向上した。
【0010】
(実施例2)
実施例1と同様に異方導電材テープを作製し、基材フィルムと接着剤の積層体に、さらにもう1種類の厚み25μmのポリエチレンテレフタレート基材フィルム(破断強度25kg/mm2、破断伸び130%)をラミネートし、3層構造の異方導電材とし、実施例1と同様にこのフィルムの巻物を幅1.5mmにスリットしながら、側板のついた直径48mm、幅100mmの芯材(巻芯)に糸巻き状に巻くことにより、300mの長さの異方導電材テープを得た。
実施例2においても実施例1と同様に良好な生産性が得られた。
【0011】
(参考例)
実施例1と同様であるが基材フィルムとして厚み50μmのポリテトラフルオロエチレンフィルム(破断強度4.6kg/mm2、破断伸び350%)を用いたこと以外は実施例1と同様にして異方導電材フィルムの巻物を得、さらに実施例1と同様にこのフィルムの巻物を幅1.5mmにスリットしながら、側板のついた直径48mm、幅100mmの芯材(巻芯)に糸巻き状に巻くことにより、300mの長さの異方導電材テープを得た。この場合、所々に糸巻き状に巻くときに腰が弱く接着剤と基材フィルムの間に剥離がみられたが、300mの長さに巻くことができた。
【0012】
(比較例)
実施例1と同様にして異方導電材フィルムの巻物を得、さらに実施例1と同様にこのフィルムの巻物を幅1.5mmにスリットしながら、従来のリールに同一円芯状に巻き、100mの長さの異方導電材テープを得た。
この糸巻き状に巻いた異方導電材テープの供給形態にて異方導電材テープ圧着自動機に取付け、供給した場合、異方導電材の転写性及び伸び試験において良好な結果が得られたがリールの取付け回数が実施例の3倍となり、取付けに要する時間と調整に用する時間が増えた。
【0013】
【発明の効果】
本発明によれば、被接続部材に対して良好な転写性(貼付け性)を有し、良好な接続信頼性を有し、そのことにより工程内における歩留を高め、さらに作業性をも向上した、従来より長尺の異方導電材テープの供給が可能であり、生産性、作業性が向上する。
【図面の簡単な説明】
【図1】本発明の2層構成異方導電材テープの供給形態の模式図。
【図2】本発明の3層構成異方導電材テープの供給形態の模式図。
【符号の説明】
1…基材フィルム 2…フィルム状の接着剤 3…側板 4…芯材(巻芯) 5…基材フィルム 6…基材フィルム。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides an anisotropic conductive material for bonding and fixing an electronic component such as a liquid crystal panel, a PDP panel, an EL panel, and a pair chip mounting to a circuit board and circuit boards, and electrically connecting both electrodes. Conductive material tape for an anisotropic conductive material, and more particularly to a winding form of the anisotropic conductive material tape.
[0002]
[Prior art]
As a connection method using an anisotropic conductive material tape, a connection is made by sandwiching an anisotropic conductive material, which is a film adhesive, between electrodes facing each other and applying heat and pressure. In the film-like adhesive, conductive particles for obtaining conduction between the electrodes are mixed, and as the resin, thermoplastic resin, thermosetting resin, or a mixed system of thermoplastic resin and thermosetting resin, light A curable resin is used (see, for example, JP-A-55-104007).
Also, a circuit connection method that does not include conductive particles and is made of only resin is also known (see, for example, Japanese Patent Application Laid-Open No. 60-262430).
Typical examples of the resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a silicone resin type, and an acrylic resin type as a thermosetting resin type are known. In order to connect both the thermoplastic resin type and the thermosetting resin type, it is necessary to apply heat and pressure. In the case of a thermoplastic resin, the resin is allowed to flow to obtain an adhesion to an adherend, and in the case of a thermosetting resin, the resin is further cured. In recent years, from the viewpoint of connection reliability, a mixed system of a thermoplastic resin and a thermosetting resin, and a thermosetting resin system have become mainstream. Also, photocurable resin systems that can be connected at low temperatures have begun to be used industrially.
[0003]
[Problems to be solved by the invention]
In recent years, there has been a demand for lowering the connection temperature when connecting an anisotropic conductive material in order to prevent warpage and elongation of a connected body. In addition, with the expansion of connection applications of anisotropic conductive materials and the expansion of demand for liquid crystal panels, PDP panels, EL panels, bare chip mounting, and the like, demands for shortening the tact time at the time of connection have been increasing. .
In addition, with an increase in connection demand and applications of the anisotropic conductive material, not only short-time connection but also improvement in productivity is required. Due to growing demand for liquid crystal panels, PDP panels, EL panels, bare chip mounting, and the like, the amount of anisotropic conductive material tape used has increased. On the other hand, as the demand for large-screen flat panels such as large-screen liquid crystal panels and PDP panels has increased, the amount of anisotropic conductive material tape used for one panel has also increased. Conventionally, the anisotropic conductive material tape has been supplied in the form of a reel in which a film-shaped adhesive is wound on a core material having a circular cross section, and the time required for replacing the reel has hindered an improvement in productivity.
On the other hand, the width of the anisotropic conductive material tape has been narrowing due to the narrowing of the frame of the liquid crystal panel, and the conventional reel shape wound in the same circular core has collapsed, and the yield in the manufacturing process has been reduced. Was getting worse.
The present invention has been made in view of the above-described drawbacks, and provides an anisotropic conductive material tape that contributes to an increase in productivity by extending the interval of reel replacement time and eliminating a decrease in workability due to winding collapse. Aimed at.
[0004]
[Means for Solving the Problems]
The present invention relates to [1] an anisotropic conductive material tape characterized in that an anisotropic conductive material made of a film-like adhesive is wound many times in the longitudinal direction of a core and laminated.
[2] The anisotropic conductive material tape according to the above [1], which is a two-layer anisotropic conductive material having a base film provided on one surface of a film adhesive.
[3] The anisotropic conductive material tape according to the above [1], which is a three-layer anisotropic conductive material in which a base film is provided on both surfaces of a film-like adhesive.
[4] The anisotropic conductive material tape according to the above [2] or [3], wherein one or both sides of the base film are peeled.
[5] The anisotropic conductive material tape according to any one of [1] to [4], wherein the width of the film-like adhesive is 0.5 to 5 mm.
[6] The difference according to any one of [2] to [5], wherein the strength of the base film is 12 kg / mm 2 or more, the elongation is 60 to 200%, and the thickness is 100 μm or less. It is a conductive material tape. When the base film is colored to be transparent or colored and opaque, it is easy to distinguish the base film from the adhesive, and the position of the unwinding part is easy, so that the workability is improved.
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
As shown in FIGS. 1 and 2, one embodiment of the present invention employs a two-layer structure or a film-
Supply of a long anisotropic conductive material tape without winding collapse by winding and laminating the anisotropic conductive material tape many times in the longitudinal direction of a core material (winding core) 4 having the
The
When the thickness is small, the above-described effect is inferior. Therefore, the thickness is preferably 0.5 μm or more. If the anisotropic conductive material, which is a film-like adhesive, has no tackiness and does not show a blocking phenomenon, the film-like adhesive can be wound alone without a base film in a pincushion shape.
The release treatment of the base film can be easily performed by performing a silicon or fluorine treatment, and if the release treatment is performed only on one side of the base film, a difference in releasability is provided between the front and back of the base film. And transfer of the back surface to the base film can be prevented. In addition, when peeling treatment is performed on both surfaces of the base film, the film adhesive surface is treated with silicon and fluorine to have releasability.
[0006]
The present invention will be described more specifically with reference to the drawings.
FIG. 1 is a schematic diagram illustrating an embodiment of a supply mode of a two-layer anisotropic conductive material tape comprising a film adhesive of the present invention and a base film having both surfaces peeled off.
FIG. 2 is a schematic diagram for explaining a supply mode of an anisotropic conductive material tape having a three-layer structure including two types of base film of FIG. 1 and including an anisotropic conductive material.
The anisotropic conductive material tape of the present invention is composed of a film-
The film-
Further, the base film used for the anisotropic conductive material tape of the present invention is made of PP (polypropylene) or OPP (stretched polypropylene) that has been subjected to silicon and fluorine release treatment from the viewpoint of strength and releasability of an adhesive constituting the anisotropic conductive material. ), PET (polyethylene terephthalate) or the like, but is not limited thereto.
In connection using an anisotropic conductive material, improvement in tact time is required, and transferability of the anisotropic conductive material is required. By winding the anisotropic conductive material tape around the core material (core) 4 with the
FIG. 2 shows a supply form of an anisotropic conductive material tape having a three-layer structure including two types of base films and including an anisotropic conductive material. The deformation of the adhesive by the next base film can be prevented.
[0007]
Further, the tensile strength of the base film, which is a physical property value of the base film, is 12 kg / mm 2 or more, and the elongation at break of the base film is set to 60 to 200%. It is possible to prevent thinning and narrowing in the width direction due to the elongation of the obtained film-like adhesive. By setting the thickness of the base material to 100 μm or less, handling and environmental protection can be performed.
[0008]
【Example】
Next, an example will be described, but the present invention is not limited to this example.
(Example 1)
(1) Preparation of anisotropic conductive material film As a film forming material, 50 g of a phenoxy resin (high molecular weight epoxy resin), 20 g of an epoxy resin, and 5 g of imidazole were added, and a 30% by weight solution of ethyl acetate was prepared. 2.5 μm Ni powder was added at 5% by volume. A base film which was silicon-treated on both sides of a transparent 50 μm thick polyethylene terephthalate film (breaking strength 25 kg / mm 2 , breaking elongation 130%) which was colored light blue was used. The above solution was applied to one surface of the base film using a roll coater and dried at 110 ° C. for 5 minutes to obtain a roll of an anisotropic conductive material film having a thickness of 50 μm.
[0009]
(2) Production of anisotropic conductive material tape While slitting the above-mentioned scroll of anisotropic conductive material film to a width of 1.5 mm, a large number of core materials (winding cores) with side plates having a diameter of 48 mm and a width of 100 mm were provided in the longitudinal direction. By winding, laminating and winding into a bobbin shape, an anisotropic conductive material tape having a length of 300 m was obtained.
When this anisotropic conductive material tape wound in the form of a thread is attached and supplied to an automatic anisotropic conductive material tape crimping machine, good results are obtained in the transferability and elongation test of the anisotropic conductive material, and In addition, the number of times of mounting the reel was reduced, and the time required for mounting, the transferability, and the repetition of the bonding operation due to the elongation of the adhesive were eliminated, and productivity was improved by these effects.
[0010]
(Example 2)
An anisotropic conductive material tape was produced in the same manner as in Example 1, and another 25 μm-thick polyethylene terephthalate substrate film (breaking strength 25 kg / mm 2 , breaking elongation 130) was formed on the laminate of the substrate film and the adhesive. %) To form an anisotropic conductive material having a three-layer structure. While slitting the roll of this film to 1.5 mm in width in the same manner as in Example 1, a core material (winding) having a side plate with a diameter of 48 mm and a width of 100 mm was wound. The anisotropic conductive material tape having a length of 300 m was obtained by winding the core around the core.
In Example 2, as in Example 1, good productivity was obtained.
[0011]
(Reference example)
Same as Example 1, except that a 50 μm-thick polytetrafluoroethylene film (rupture strength: 4.6 kg / mm 2 , elongation at break: 350%) was used as the base film. A roll of a conductive material film is obtained, and the roll of the film is wound into a thread around a core material (winding core) having a diameter of 48 mm and a width of 100 mm with a side plate while slitting the film to a width of 1.5 mm as in Example 1. Thus, an anisotropic conductive material tape having a length of 300 m was obtained. In this case, the stiffness was weak when winding in some places in the shape of a pin, and peeling was observed between the adhesive and the base film, but the film could be wound to a length of 300 m.
[0012]
(Comparative example)
A roll of the anisotropic conductive material film was obtained in the same manner as in Example 1, and the roll of this film was slit into a width of 1.5 mm and wound on a conventional reel in the same core shape in the same manner as in Example 1. The length of the anisotropic conductive material tape was obtained.
In the case where the anisotropic conductive material tape was supplied in the form of a supply wound onto the anisotropic conductive material tape crimping automatic machine and supplied, good results were obtained in the transferability and elongation test of the anisotropic conductive material. The number of times of mounting the reel is three times that of the embodiment, and the time required for mounting and the time required for adjustment are increased.
[0013]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, it has good transferability (pasting property) with respect to a to-be-connected member, and has favorable connection reliability, thereby increasing the yield in a process and improving workability. In addition, it is possible to supply a longer anisotropic conductive material tape than before, and productivity and workability are improved.
[Brief description of the drawings]
FIG. 1 is a schematic view of a supply mode of a two-layer anisotropic conductive material tape of the present invention.
FIG. 2 is a schematic view of a supply form of a three-layer anisotropic conductive material tape of the present invention.
[Explanation of symbols]
DESCRIPTION OF
Claims (6)
Priority Applications (28)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002221225A JP2004059776A (en) | 2002-07-30 | 2002-07-30 | Anisotropic conductive material tape |
KR1020097017836A KR100970800B1 (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape and method of producing the tape |
KR1020087019045A KR20080075565A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
CN 201110456093 CN102556726A (en) | 2002-07-30 | 2003-07-30 | Bonding material band and production method thereof |
CN2010102345094A CN101920862B (en) | 2002-07-30 | 2003-07-30 | Crimping connection method of adhesive tapes |
KR1020087005685A KR100981478B1 (en) | 2002-07-30 | 2003-07-30 | Connecting structure |
CN2008102146483A CN101402832B (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape and anisotropic conductive material tape |
PCT/JP2003/009694 WO2004011356A1 (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape |
CNB038180847A CN100548840C (en) | 2002-07-30 | 2003-07-30 | The method of attachment of adhesive material tape connector and adhesive material tape |
TW096139425A TW200823137A (en) | 2002-07-30 | 2003-07-30 | Joining structure and adhesive material reel |
CN2010102345395A CN101920863B (en) | 2002-07-30 | 2003-07-30 | Method for producing adhesive materials for tapes composed with the same |
CN2010102460213A CN101905817B (en) | 2002-07-30 | 2003-07-30 | Method of connecting adhesive material tape |
KR1020107007008A KR20100041890A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape |
CNA2008102146500A CN101418193A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape and method of producing the same |
TW097143987A TW200913827A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
CN2009101730706A CN101648658B (en) | 2002-07-30 | 2003-07-30 | Connection method of adhesive material tape and adhesive material connector |
CN2008102146479A CN101402423B (en) | 2002-07-30 | 2003-07-30 | Method of connecting adhesive material tape and adhesive material tape connector |
KR1020067012929A KR100700438B1 (en) | 2002-07-30 | 2003-07-30 | Anisotropic electroconductive tape |
KR1020087012294A KR20080064886A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape |
CN201410378540.3A CN104152075B (en) | 2002-07-30 | 2003-07-30 | Adhesive material band and crimping method therefor |
KR1020077011959A KR20070063606A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape and method of producing the tape |
TW097143988A TW200913828A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
KR1020107001127A KR100953011B1 (en) | 2002-07-30 | 2003-07-30 | Method of producing adhesive material tape |
CN200910173071A CN101649166A (en) | 2002-07-30 | 2003-07-30 | Method of producing adhesive material tape |
TW097143991A TW200913829A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
KR1020067012942A KR100690379B1 (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette |
CN2008102146498A CN101417758B (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus |
TW092120892A TW200409405A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002221225A JP2004059776A (en) | 2002-07-30 | 2002-07-30 | Anisotropic conductive material tape |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009004971A Division JP2009138203A (en) | 2009-01-13 | 2009-01-13 | Anisotropic conductive material tape |
Publications (1)
Publication Number | Publication Date |
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JP2004059776A true JP2004059776A (en) | 2004-02-26 |
Family
ID=31941606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002221225A Pending JP2004059776A (en) | 2002-07-30 | 2002-07-30 | Anisotropic conductive material tape |
Country Status (2)
Country | Link |
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JP (1) | JP2004059776A (en) |
CN (7) | CN101402423B (en) |
Cited By (5)
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JP2014040095A (en) * | 2012-07-24 | 2014-03-06 | Hitachi Chemical Co Ltd | Laminated body of adhesive material and wound body of the same |
JP2015006937A (en) * | 2013-06-25 | 2015-01-15 | 日立化成株式会社 | Winding core holder, winding core unit, and film-like adhesive set |
JP2015147832A (en) * | 2014-02-05 | 2015-08-20 | デクセリアルズ株式会社 | Anisotropic conductive film and production method of the same, and connection method and joined body |
JP2015230711A (en) * | 2014-06-06 | 2015-12-21 | キヤノン株式会社 | Information processor and program, and control method |
WO2023276792A1 (en) * | 2021-07-01 | 2023-01-05 | 日東電工株式会社 | Bonding sheet and method for producing electronic component |
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-
2002
- 2002-07-30 JP JP2002221225A patent/JP2004059776A/en active Pending
-
2003
- 2003-07-30 CN CN2008102146479A patent/CN101402423B/en not_active Expired - Fee Related
- 2003-07-30 CN CN2008102146498A patent/CN101417758B/en not_active Expired - Fee Related
- 2003-07-30 CN CN 201110456093 patent/CN102556726A/en active Pending
- 2003-07-30 CN CN2009101730706A patent/CN101648658B/en not_active Expired - Fee Related
- 2003-07-30 CN CNA2008102146500A patent/CN101418193A/en active Pending
- 2003-07-30 CN CN200910173071A patent/CN101649166A/en active Pending
- 2003-07-30 CN CN2008102146483A patent/CN101402832B/en not_active Expired - Lifetime
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JP2014040095A (en) * | 2012-07-24 | 2014-03-06 | Hitachi Chemical Co Ltd | Laminated body of adhesive material and wound body of the same |
JP2015006937A (en) * | 2013-06-25 | 2015-01-15 | 日立化成株式会社 | Winding core holder, winding core unit, and film-like adhesive set |
JP2015147832A (en) * | 2014-02-05 | 2015-08-20 | デクセリアルズ株式会社 | Anisotropic conductive film and production method of the same, and connection method and joined body |
JP2015230711A (en) * | 2014-06-06 | 2015-12-21 | キヤノン株式会社 | Information processor and program, and control method |
WO2023276792A1 (en) * | 2021-07-01 | 2023-01-05 | 日東電工株式会社 | Bonding sheet and method for producing electronic component |
Also Published As
Publication number | Publication date |
---|---|
CN101417758B (en) | 2012-11-28 |
CN101417758A (en) | 2009-04-29 |
CN101418193A (en) | 2009-04-29 |
CN101648658B (en) | 2012-06-13 |
CN101402832A (en) | 2009-04-08 |
CN101648658A (en) | 2010-02-17 |
CN101649166A (en) | 2010-02-17 |
CN102556726A (en) | 2012-07-11 |
CN101402832B (en) | 2012-10-24 |
CN101402423B (en) | 2011-02-02 |
CN101402423A (en) | 2009-04-08 |
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