CN101649166A - Method of producing adhesive material tape - Google Patents

Abstract

The invention relates to a method of producing adhesive material tape, and producing adhesive tape capable of rooled into a reel by coating adhesive agents on the base, coating adhesive anents on a whole surface of a base, and then slits are formed on the adhesive agents along a width direction of the tape, then the adhesive agent is separated into a plurality of adhesive stripes, and then deploying another base on the adhesive agent surface and using the two bases to hold the adhesive agent, displacing an adhesive strip fro one base and another base and heating and pressuring such that a plurality of adhesive strips are sticked alternately on each of the two bases, then separating the base from another base, and a plurality of adhesive strips disposed alternately are left of the two bases. According to the invention, an adhesive material tape is provided, which can reduce the replacement time of a new adhesive material tape, and then productivity of electronic equipment is increased.

Description

The manufacture method of adhesive material tape

The application submitted on July 30th, 2003, application number is 03818084.7, and name is called the dividing an application of patent application of " adhesive material tape and attaching method thereof, manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, use the compression bonding method and the anisotropic conductive material band of their caking agent ".

Technical field

The present invention relates to a kind of with electronic devices and components and circuit card, or when being adhesively fixed between the circuit card, make adhesive material tape that is electrically connected between the electrode of the two and attaching method thereof, manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, use the compression bonding method of their caking agent, particularly be rolled into adhesive material tape of reel and attaching method thereof, manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, use the compression bonding method and the anisotropic conductive material band of their caking agent

Background technology

As will being adhesively fixed between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, and make the device that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In the TOHKEMY 2001-284005 communique, announced the adhesive material tape that is rolled into reel that is coated with adhesives on the base material.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the volume of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, pull out the top part branch of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is crimped onto caking agent on the circuit card etc. with thermal head, and residual base material is rolled onto on the winding off spindle.

Afterwards, after the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle is rolled up with new adhesives be installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

Along with the maximization of the panel of in recent years PDP etc., the bond area of circuit card (or the size on a limit) on every side also increases, and once the consumption of employed caking agent also constantly increases.In addition, because the purposes of caking agent is also extended, make the consumption of caking agent increase.Therefore, the replacing frequency of the adhesives of the manufacturing works of e-machine volume becomes many, owing to change adhesives volume spended time, therefore the problem that exists is to improve the production efficiency of e-machine.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increases the bonding dosage of per 1 volume, reduce the replacing frequency of adhesives volume, but,, collapse phenomenon if the number of turns increases just might take place to roll up because the bandwidth of adhesive material tape is too narrow to 1～3mm.In addition, if the number of turns increases, act on the increased pressure that is rolled on the zonal adhesive material tape, caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, Juan diameter dimension also can become greatly so, is difficult to be installed on the existing adhering device, might use in existing adhering device.

Summary of the invention

Therefore, the object of the present invention is to provide a kind of replacing that can carry out adhesives volume simply, realize e-machine production efficiency raising adhesive material tape method of attachment and adhesive material tape, its manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, use the compression bonding method and the anisotropic conductive material band of their caking agent.

The method of attachment of the adhesive material tape of the 1st scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part of the side's that overturns adhesive material tape, make a side the adhesive side of adhesive material tape and the opposing party's the adhesive side of adhesive material tape overlapping, the two lap is carried out thermo-compressed make its connection.

Invention according to the 1st scheme, owing to will use the top part of terminal part and the adhesive material tape of new installation of the caking agent end-of-use adhesive material tape of adhesive material tape to be bonded together, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesive material tape be installed simply.In addition, when carrying out the replacing of new adhesive material tape at every turn, needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

In addition, owing to will extract the terminal part upset of end-of-use adhesive material tape, the adhesive side that makes this adhesive material tape overlaps each other with the adhesive side of the adhesive material tape of new installation and is bonded together, so strength of joint is very high.

If use the thermal head of the adhering device that the adhesives volume is housed, the thermo-compressed of connection portion just can reasonably be utilized adhering device.

The method of attachment of the adhesive material tape of the 2nd scheme of the present invention is on the basis of the 1st scheme, it is characterized in that, is provided with terminal marking on the terminal part of a side adhesive material tape.

Invention according to the 2nd scheme, when can play the action effect identical with the 1st scheme, because the cut-out that can when having exposed terminal marking, extract the end-of-use adhesive material tape out, therefore, distinguish the part of cutting off and connecting operation easily, and can connect in the minimal position of necessity, thereby can prevent the waste of adhesive material tape.

The method of attachment of the adhesive material tape of the 3rd scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the top part of the opposing party's adhesive material tape, be directed with being pasted and fixed on the substrate surface that is wound on the adhesive material tape on the spool, after upset one side's the terminal part of adhesive material tape, make the adhesive side overlaid of terminal part of the adhesive side of pilot tape and a side's adhesive material tape, lap is carried out thermo-compressed.

According to the invention of the 3rd scheme, identical with the invention of the 1st scheme, can to adhering device new adhesive material tape be installed simply, in addition, can reduce the replacing time of new adhesive material tape, improved the production efficiency of e-machine.

In addition, owing to utilize the pilot tape of adhesive material tape, the terminal part of extracting the end-of-use adhesive material tape out the top part with the new adhesive material tape of installing is bonded together, therefore, can carries out bonding between the adhesive material tape simply.

The method of attachment of the adhesive material tape of the 4th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the top part of the opposing party's adhesive material tape, be directed with being pasted and fixed on the substrate surface that is wound on the adhesive material tape on the spool, make the adhesive side overlaid of terminal part of the adhesive side of pilot tape and a side's adhesive material tape, lap is carried out thermo-compressed.

According to the invention of the 4th scheme, identical with the invention of the 1st scheme, can to adhering device new adhesive material tape be installed simply, in addition, can reduce the replacing time of new adhesive material tape, improved the production efficiency of e-machine.

In addition, owing to do not need upset to extract the end-of-use adhesive material tape out, therefore, in the time of can preventing on winding off spindle the coiling adhesive material tape volume might take place and collapse.

The method of attachment of the adhesive material tape of the 5th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape, insert the fastening pin at the two lap and connect.

According to the invention of the 5th scheme,, therefore, connect very simple owing to will extract the terminal part of end-of-use adhesive material tape and the top partial fixing of the new adhesive material tape of installing out by the fastening pin.In addition, when carrying out the replacing of new adhesive material tape at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

The method of attachment of the adhesive material tape of the 6th scheme of the present invention is, use engagement device connecting and be coated with the electrode connecting adhesive on the base material, the adhesive material tape that is wound on the adhesive material tape of the side on a side the spool and is wound on the adhesive material tape of the opposing party on the opposing party's the spool couples together, it is characterized in that: engagement device has the claw on the end that is arranged on a side and the opposing party and is arranged on elastic component between the claw, with the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape toward each other, to be arranged on claw fastening on the end of engagement device on the terminal part of a side adhesive material tape, with being arranged on claw fastening on the other end on the top of the opposing party's adhesive material tape part, be pulled in together by the claw of elastic component with two sides.

Invention according to the 6th scheme, since with a side's of engagement device claw fastening on the terminal part of a side adhesive material tape, afterwards with the opposing party's of engagement device claw fastening on the top of the opposing party's adhesive material tape part, the two is interconnection, therefore, connection is easy to.In addition, owing to have elastic component between a side claw and the opposing party's the claw, therefore can the tensile elasticity member, on the optional position of the top of the opposing party's adhesive material tape part, therefore the degree of freedom that connects is very high with the opposing party's of engagement device claw fastening.

In addition, owing under the top part state respect to one another of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape, be connected, therefore, do not need belt is overlapped each other, owing on necessary minimal position, connect, thereby can prevent the waste of adhesive material tape.

The method of attachment of the adhesive material tape of the 7th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part that makes a side adhesive material tape, top part overlaid with the opposing party's adhesive material tape, be roughly the clip of the elastically deformable of コ font with cross section, the lap of the two clamped and fixing.

According to the invention of the 7th scheme,, therefore, connect operation and be easy to owing to only the terminal part of one side's adhesive material tape is just clamped and can be connected with the lap of the top part of the opposing party's adhesive material tape with clip.

The method of attachment of the adhesive material tape of the 8th scheme of the present invention, it is characterized in that: the metal system holding piece that is roughly the コ font with cross section, the lap of one side's adhesive material tape and the opposing party's adhesive material tape is clamped, thereby the two is coupled together from the two sides press nip sheet of lap.

According to the invention of the 8th scheme,, therefore, can improve the strength of joint of the lap of adhesive material tape owing to the two is coupled together from the two sides press nip sheet of lap.

The method of attachment of the adhesive material tape of the 9th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part that makes a side adhesive material tape, with the either party's of the top part of the opposing party's adhesive material tape substrate surface and the opposing party's adhesive side overlaid, the overlap length that makes the two carries out thermo-compressed to the two and makes its connection in 2 times to 50 times scope of the width of adhesive tapes.

Invention according to the 9th scheme, owing to utilize the caking agent of adhesive material tape, the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing are bonded together, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesives volume be installed simply.In addition, when carrying out the replacing of new adhesives volume at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

The length that why makes lap is 2 times to 50 times of width of adhesive tapes, is because if less than 2 times, just can't obtain enough strength of joint, if surpass 50 times, the employed adhesives in connection portion just too much, the waste that has produced adhesives.

If use the thermal head of dress by the adhering device of adhesives volume, the thermo-compressed of connection portion just can rationally be utilized adhering device.

Caking agent both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, can be dispersed with the spacer particle of insulativity in these caking agents.

The method of attachment of the adhesive material tape of the 10th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: with the terminal part of a side adhesive material tape towards the direction bending that caking agent is faced mutually, with the top part of the opposing party's adhesive material tape towards the direction bending that caking agent is faced mutually, make the mutual fastening of dogleg section of the two overlapping, and the adhesive side of the two is faced mutually, lap is carried out thermo-compressed.

Invention according to the 10th scheme, when can play the action effect identical with the invention of the 1st scheme, because the top part of adhesive material tape that makes a side the terminal part of adhesive material tape and the opposing party is mutually with hook-shaped fastening, and make the adhesive side of the two interconnection, so strength of joint is higher.

The method of attachment of the adhesive material tape of the 11st scheme of the present invention is on the basis of the 9th or the 10th scheme, it is characterized in that, is provided with terminal marking at the terminal part of a side adhesive material tape.

Invention according to the 11st scheme, when can play the action effect identical with the invention of the 9th or the 10th scheme, because the cutting of the terminal part of a side adhesive material tape can partly be carried out in terminal marking, therefore, distinguish the part that connects operation easily, and can connect in necessary inferior limit position, can prevent the waste of adhesive material tape.In addition, the sense terminals mark part is controlled device according to this detection signal, or is given the alarm automatically, thereby can improve operating efficiency.

The method of attachment of the adhesive material tape of the 12nd scheme of the present invention is on each basis of the 9th～11 scheme, it is characterized in that, with the mould that is formed with a concavo-convex side, and with the opposing party's of its interlock mould, the lap of clamping a side adhesive material tape and the opposing party's adhesive material tape carries out thermo-compressed.

Invention according to the 12nd scheme, when can play the action effect identical with each invention of the 9th～11 scheme, concavo-convex by forming in the connection portion, thereby can expand the connection area, can improve the strength of joint of the draw direction (length direction) of adhesive material tape simultaneously because of the engaging of jog.

The method of attachment of the adhesive material tape of the 13rd scheme of the present invention is on each basis of the 9th～11 scheme, it is characterized in that, after the lap of a side adhesive material tape and the opposing party's adhesive material tape has formed through hole, lap is carried out thermo-compressed.

Invention according to the 13rd scheme, when can play, by forming through hole in the connection portion, thereby make caking agent oozing out in interior week at through hole with the identical action effect of each invention of the 9th～11 scheme, increase the bond area of caking agent, therefore can further improve strength of joint.

The method of attachment of the adhesive material tape of the 14th scheme of the present invention is, silicon handled be coated with the electrode connecting adhesive on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, handle the part on the surface of base material with the silicon adhesive tape joining across the silicon of two adhesive material tapes, thereby two adhesive material tapes are coupled together.

Invention according to the 14th scheme, the adhesives volume of a side adhesive material tape will be wound with, be installed in the adhering device with the winding off spindle of the base material of the adhesive material tape of only having reeled, when the adhesive material tape of adhesives volume has been used up, by the silicon splicing tape, the terminal part of end-of-use adhesive material tape (side adhesive material tape) the top part with the adhesive material tape (the opposing party's adhesive material tape) of the new adhesives volume of installing is coupled together, replace end-of-use adhesives volume, new adhesives volume is installed in the adhering device.

Among the present invention,, carry out the replacing of spool, therefore, can to adhering device new adhesives be installed simply and roll up owing to only end-of-use adhesive material tape and new adhesive material tape are coupled together.In addition, when carrying out the replacing of new adhesive material-tape reel at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, or with the operation of adhesive material tape support on guide reel, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

By the base material of adhesive material tape being carried out surface treatment with silicon, on employed splicing tape, also use the silicon caking agent, owing to can reduce surface tension poor of the two, improve closing force, very difficult boths' is bonding before therefore can realizing.

The caking agent of adhesives both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, also the spacer particle of insulativity can be dispersed in these caking agents.

The method of attachment of the adhesive material tape of the 15th scheme of the present invention is on the basis of the 14th scheme, it is characterized in that, the surface tension of the adhesive side of silicon splicing tape is handled the difference of surface tension of base material below 10mN/m (10dyne/cm) with the silicon of adhesive material tape.

Invention according to the 15th scheme, can play with the 15th scheme the identical action effect of invention in, the difference that the surface tension of the adhesive side by making the silicon splicing tape and the silicon of adhesive material tape are handled the surface tension of base material is below the 10mN/m (10dyne/cm), can access strong closing force, thereby the two can be bonded together reliably.Surface-tension energy is measured with moistening reagent and contact angle.

The difference of the surface tension of the silicon processing base material of adhesive material tape and the adhesive side of silicon splicing tape is preferably 0-5mN/m (5dyne/cm).This is because the difference of surface tension is the smaller the better, and if its value then might can not obtain enough dhering strengths big to above 10mN/m (10dyne/cm) time.

The method of attachment of the adhesive material tape of the 16th scheme of the present invention is on the basis of the 14th or 15 schemes, it is characterized in that, the bonding force of silicon splicing tape is more than 100g/25mm.

Invention according to the 16th scheme, when can play the action effect identical with the invention of the 14th or 15 schemes, because in the connection of a side and the opposing party's adhesive material tape, can on the adhesive side of the two, all paste the silicon splicing tape, therefore, by getting up, can carry out bonding with high strength from the two sides with a side and the opposing party's adhesive material tape bonding (or driving fit).

Particularly, be more than the 100g/25mm by making bonding force, can carry out bonding between two adhesive side of adhesive material tape of a side and the opposing party more firmly.

Though, when less than 100g/25mm, then might be able to not reach the intensity of regulation if bonding force can obtain strong cohesive strength greatly.

The method of attachment of the adhesive material tape of the 17th scheme of the present invention is characterised in that, make the terminal part of a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, paste the described silicon splicing tape of the 16th scheme along the two sides of two adhesive material tapes and connect.

According to the invention of the 17th scheme, when can play the action effect identical with the 16th invention, owing to carry out being connected of adhesive material tape of a side and the opposing party on its two sides, so can access more firm connection.

The method of attachment of the adhesive material tape of the 18th scheme of the present invention is, silicon handled be coated with the electrode connecting adhesive on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: at the terminal part of a side adhesive material tape, and between the top part of the opposing party's adhesive material tape, clipping two sided coatings has the silicon splicing tape of silicon caking agent, and two adhesive material tapes are coupled together; The difference of the surface tension of the silicon caking agent on two sides and silicon processing base material is below 10mN/m (10dyne/cm), and bonding force is more than 100g/25mm.

According to the invention of the 18th scheme, owing to use the silicon splicing tape of double-sided adhesive agent, thereby two-sided silicon splicing tape can be clipped between a side and the opposing party's the adhesive material tape and the two be connected (or driving fit), so the connection of the two simply and easy.

The method of attachment of the adhesive material tape of the 19th scheme of the present invention is, the electrode connecting adhesive will be coated with on the base material, be wound on the adhesive material tape of the side on a side the spool, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, with the resin system caking agent of pasty state attached on lap or the part respect to one another, by making the resin system adhesive hardens of pasty state, and the two is coupled together.

According to the invention of the 19th scheme,, get up extracting the terminal part of end-of-use adhesive material tape and the top partial fixing of the new adhesive material tape of installing out, so connect very simple owing to pass through the resin system caking agent of pasty state.In addition, when carrying out the replacing of new adhesives volume at every turn, needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

Because at the terminal part of a side adhesive material tape, and adhere to resin system caking agent on the lap of the top part of the opposing party's adhesive material tape or the part respect to one another, therefore the degree of freedom of connection is higher.

The method of attachment of the adhesive material tape of the 20th scheme of the present invention is on the basis of the 19th scheme, it is characterized in that, resin system caking agent is made of at least a material of selecting from thermosetting resin, ray hardening resin, heatmeltable caking agent group.

Invention according to the 20th scheme, when can play the action effect identical with the invention of the 19th scheme, as resin system caking agent, can from thermosetting resin, ray hardening resin, heatmeltable caking agent group, select to be suitable for the resin system caking agent of the connection between the adhesive material tape, thereby can improve the strength of joint between the adhesive material tape.

The adhering device of the adhesive material tape of the 21st scheme of the present invention is characterized in that, the plugger that provides as the described resin system caking agent of the 19th or 20 schemes is provided.

According to the invention of the 21st scheme,, therefore do not need to prepare in addition plugger, thereby can prevent to connect the waste of operation owing to be provided with the plugger of the described resin system caking agent of the 19th or 20 schemes of supply in the adhering device.

In addition, except plugger, can also have and be used to make thermosetting resin hardened well heater in the adhering device, or be used for ray hardening resin is carried out light-struck ultraviolet ray.

The adhesive material-tape reel of the 22nd scheme of the present invention is wound with the adhesive material tape that is coated with the electrode connecting adhesive on the base material on the spool, it is characterized in that: the width that adhesive material tape twists in belt is provided with the winding part of a plurality of adhesive material tapes.

Invention according to the 22nd scheme, owing to be provided with the winding part (coiling portion) of a plurality of adhesive material tapes, therefore, when in a plurality of winding parts, the adhesive material tape that is wound on a winding part is drawn out of when having used up, and just will be installed on the winding off spindle with this adhesive material tape that is drawn out of other winding parts of end-of-use winding part disposed adjacent.

Like this, when the adhesive material tape of being reeled in the winding part is drawn out of when having used up, the adhesive material tape of being reeled on the adjacent winding part is installed on the winding off spindle, carries out the replacing of adhesive material tape, therefore do not need new adhesive material-tape reel is installed in the adhering device.So, can reduce replacing time of new adhesive material-tape reel, improved the production efficiency of e-machine.

Owing to can use the adhesive material tape of being reeled in a plurality of winding parts in turn, therefore do not increase the number of turns of 1 adhesive material tape on the adhesive material-tape reel, just can change in the operation at 1 time increases spendable bonding dosage significantly.In addition, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can also prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, and then can prevents the drawback of the stretching etc. of the base material that is easy to generate because of base material is elongated.

The adhesive material-tape reel of the 23rd scheme of the present invention is on the basis of the 22nd scheme, it is characterized in that, between the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape, be provided with the connecting band that connects the two, when a side adhesives has been used up, the adhesive material tape that and then begins to emit the opposing party.

Invention according to the 23rd scheme, when can play the action effect identical with the invention of the 22nd scheme, owing to couple together by the top part of connecting band with the terminal part of a side adhesive material tape and the opposing party's adhesive material tape, therefore, after the adhesive material tape of one side's adhesive material-tape reel is drawn out of and has used up, do not need the adhesive material tape of the opposing party's winding part is installed on the winding off spindle, can further improve the production efficiency of e-machine.

The adhering device of the 24th scheme of the present invention, the adhesive material-tape reel that comprises the 23rd scheme, the winding off spindle of adhesive material tape, be arranged between adhesive material-tape reel and the winding off spindle, and the adhesives of adhesive material tape is crimped onto the pressure contact portion on the circuit card of e-machine with thermal head, and detects the band proofing unit of connecting band, it is characterized in that: detect under the situation of connecting band at the band proofing unit, connecting band is wound up on the winding off spindle, has passed through pressure contact portion up to connecting band.

According to the invention of the 24th scheme and since connecting band by auto reeling to winding off spindle, therefore after the adhesive material tape of a side winding part has been used up, can be in turn from next winding part extraction adhesive material tape.

In addition, when the band proofing unit detects connecting band,, by pressure contact portion, therefore can save the time of coiling up to connecting band owing to automatically connecting band is wound up on the winding off spindle.

In addition,, for example in adhering device, have a pair of luminescent part and light-receiving part, connecting band is carried out optical detection as the band proofing unit.On the other hand, the mark of band look (for example black) is set at the two ends of connecting band, utilizes the laser that sends from luminescent part, detect the mark at the two ends of connecting band by light-receiving part, thereby judge connecting band.In addition,, can also adopt the width that makes connecting band and the width diverse ways of adhesive material tape, and on connecting band, form the method in a plurality of holes except mark on the connecting band subscript.

The adhesive material-tape reel of the 25th scheme of the present invention uses fastener that the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, and it is characterized in that: the connection portion coats fastener with adhesive material tape.

Invention according to the 25th scheme, owing to use the terminal part of fastener with the end-of-use adhesive material tape, couple together with the top part of the adhesive material tape of new installation, carry out the replacing of adhesive material-tape reel, therefore, can to adhering device new adhesive material-tape reel be installed simply.In addition, when carrying out the replacing of new adhesive material-tape reel at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesive material-tape reel, improve the production efficiency of e-machine.

Owing to can use adhesive material tape in turn, therefore can not increase the number of turns of 1 adhesive material tape on the adhesive material-tape reel, just can significantly increase spendable bonding dosage and change operation by 1 time.In addition, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, can also prevents the drawback of the stretching etc. of the base material that is easy to generate because of base material is elongated.

In addition, because the fastener of the connection portion of the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape is coated by adhesive material tape, when therefore outward appearance is preferable, the fastener that can prevent the connection portion contacts with adhesive material tape, thereby damage adhesive material tape, simultaneously, the thermal head of adhering device, support constitute the damage that component also can not be subjected to fastener.

In addition, as the method that coats fastener with adhesive material tape, preferably after the top part of the terminal part of the adhesive material tape by connecting a side with fastener and the opposing party's adhesive material tape, with folded lengthwise 180 degree of connection portion, thereby coat the method for fastener with adhesive material tape at belt.

In addition, also can coat the method for fastener with other adhesive material tape coiling connection portions.

The adhering device of the 26th scheme of the present invention, comprise the described adhesive material-tape reel of the 25th scheme, the winding off spindle of adhesive material tape, be arranged between adhesive material-tape reel and the winding off spindle, and the adhesives of adhesive material tape is crimped onto pressure contact portion on the circuit card with thermal head, and the connection section proofing unit of the connection portion of detection band, it is characterized in that: detect at the connection section proofing unit under the situation of connection portion of belt, one side's adhesive material tape is reeled on the winding off spindle, passed through pressure contact portion up to the connection portion.

Invention according to the 26th scheme, when the connection section proofing unit detects the connection portion, on the winding off spindle of automatically a side adhesive material tape being reeled, pass through pressure contact portion up to the connection portion, therefore, can prevent from when the connection portion arrives pressure contact portion, to carry out crimping and move this unsuitable situation.In addition, owing on the winding off spindle of automatically a side adhesive material tape being reeled, by pressure contact portion, therefore can save the time of coiling up to the connection portion.

The 27th scheme of the present invention is on the basis of the 26th scheme, it is characterized in that, the connection section proofing unit is any one in CCD photographic camera, thickness detecting sensor, the transmittance detecting sensor.

According to the invention of the 27th scheme, when can play the action effect identical, can carry out the detection of connection portion with simple structure with the invention of the 26th scheme, and, can improve accuracy of detection by using these devices.

For example,, the surface of connection portion is taken in the monitor picture,, detected the connection portion by comparing the deep or light of pixel using under the situation of CCD photographic camera as the connection section proofing unit.In addition, under the situation of used thickness detecting sensor,, therefore, detect the connection portion by the relatively variation of thickness because the thickness of connection portion is bigger than the thickness of adhesive material tape.In addition, under the situation of using transmittance sensor, because the thickness thickening of connection portion, and have fastener, so its transmittance reduction, by comparing the value of transmittance, detect the connection portion.

The method of attachment of the adhesive material tape of the 28th scheme of the present invention, it is characterized in that: use fastener that the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, the connection portion coats fastener with adhesive material tape.

Invention according to the 28th scheme, use the terminal part of fastener, couple together, carry out the replacing of adhesive material-tape reel with the top part of the adhesive material tape of new installation with the end-of-use adhesive material tape, therefore, can to adhering device new adhesive material-tape reel be installed simply.In addition, when carrying out the replacing of new adhesive material tape at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesive material-tape reel, improve the production efficiency of e-machine.

Owing to can use adhesive material tape in turn, therefore can not increase the number of turns of 1 adhesive material tape on the adhesive material tape, just can increase spendable bonding dosage significantly and change operation by 1 time.Owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, can also prevents the drawback of the stretching etc. of the base material that is easy to generate because of base material is elongated.

In addition, because the fastener of the connection portion of the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape coats with adhesive material tape, when therefore outward appearance is preferable, the damage adhesive material tape thereby the fastener that can prevent the connection portion contacts with adhesive material tape, simultaneously, formation component such as the thermal head of adhering device, support platform also can not be subjected to the damage of fastener.

In addition, as the method that coats fastener with adhesive material tape, preferably after the top part of the terminal part of the adhesive material tape by connecting a side with fastener and the opposing party's adhesive material tape, with folded lengthwise 180 degree of connection portion, thereby coat the method for fastener with adhesive material tape at belt.

In addition, also can coat the method for fastener with other adhesive material tape coiling connection portions.

The adhesive tapes of the 29th scheme of the present invention is coated with caking agent on the base material, and is wound into the spool shape, it is characterized in that: many caking agents of configuration on the length direction at belt on the base material.

According to the invention of the 29th scheme, when using adhesive tapes, be installed in the adhering device being wound with the spool of adhesive tapes and empty spool, after the caking agent thermo-compressed is on circuit card, base material is wound up on the empty spool.

Afterwards, under the situation of thermo-compressed caking agent on the circuit card, one in many caking agents that are arranged on the width of base material is crimped onto on the circuit card, remaining strip of glue after the crimping is wound up on the empty spool with base material.Afterwards, when from spool, adhesive tapes extracted out used up after, make the sense of rotation counter-rotating of spool, make the direction of the supply counter-rotating of adhesive tapes.Like this, after using up a caking agent, remaining caking agent and base material are wound up on the spool, carry out this operation repeatedly and use remaining strip of glue in turn.Therefore, because rule ground uses many caking agents in turn, therefore can not increase the number of turns of belt and spendable bonding dosage in 1 spool is significantly increased (more than 2 times).

According to the present invention, can not increase the number of turns of adhesive tapes and employed bonding dosage is significantly increased.And, owing to do not increase the number of turns of adhesive tapes, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, can also prevents the drawback (damage of base material and break) of the stretching etc. of the base material that is easy to generate because of base material is elongated.

In the manufacturing works of electronic devices and components, owing to reduced the replacing number of times of new adhesive tapes, so operating efficiency improves.

In addition, in the manufacturing of adhesive tapes, owing to can increase the bonding dosage of each spool, therefore the usage quantity that can cut down spool material and moisture proof material reduces manufacturing expense.

In addition, to use next bar caking agent after on the spool of the sky of adhesive tapes being reeled in order finishing, also can not make the sense of rotation counter-rotating, and change 2 spools that are installed in the adhering device in the crimping of the 1st caking agent.

Caking agent both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, can be dispersed with the spacer particle of insulativity in these caking agents.

The width of base material is preferably 5～1000mm, can select arbitrarily according to the width of a caking agent and the bar number of caking agent.One width of caking agent is preferably 0.5mm～10.0mm.

The width that why makes base material is 5～1000mm, be that the width of the bar number of set caking agent and caking agent can be restricted on the base material, simultaneously because under the situation of width less than 5mm of base material, if greater than 1000mm, just might can't be installed on the existing adhering device.

The adhesive tapes of the 30th scheme of the present invention is on the basis of the 29th scheme, it is characterized in that: have certain interval in vain between the strip of glue adjacent each other of many caking agents.

According to the invention of the 30th scheme, when can play the action effect identical, certain distance is arranged between the adjacent strip of glue owing to make with the invention of the 29th scheme, therefore can easily one rule ground in caking agent ground be carried out crimping.

The adhesive tapes of the 31st scheme of the present invention is on the basis of the 29th scheme, it is characterized in that: the slit that caking agent is formed on the length direction of belt is separated into many.

Invention according to the 31st scheme, when can play the action effect identical with the invention of the 29th scheme, being preferably on the whole surface of single face of base material coating adhesive makes, before being crimped onto caking agent on the circuit card, promptly, before using adhesive tapes, cut caking agent to form slit with cutting knife etc.

In addition, slit also can form with incision caking agents such as cutting knifes when making adhesive tapes.

The formation of slit except using blade, also can utilize formation such as laser and heating wire.

According to the present invention, the bar number of the strip of glue that is configured on the base material is increased.

The manufacture method of the adhesive tapes of the 32nd scheme of the present invention is, make on the base material and be coated with caking agent, and be wound into the adhesive tapes of spool shape, it is characterized in that: by by on the width of base material with the coater of certain arranged spaced, give on the substrate surface that transmits continuously and supply with caking agent, thereby on base material, be coated with many caking agents.

According to the invention of the 32nd scheme, can easily utilize existing installation to make the adhesive tapes of the 30th scheme.

Coater both can be arranged on a plurality of rollers of the width of base material, also can be nozzle.

The manufacture method of the adhesive tapes of the 33rd scheme of the present invention is, make on the base material and be coated with caking agent, and be wound into the adhesive tapes of reel, it is characterized in that: coating adhesive on the whole surface of the single face of a side base material, next on caking agent, form after the slit of length direction, configuration the opposing party's base material on adhesive side, clamp caking agent by a side base material and the opposing party's base material, next the base material that makes a side base material and the opposing party is disconnected from each other and make and all be pasted with many caking agents with certain interval on a side and the opposing party base material separately, thereby produces the adhesive tapes that many caking agents are arranged with certain arranged spaced on a side and the opposing party's base material.

According to the invention of the 33rd scheme, owing to can make the adhesive tapes of 2 the 29th schemes simultaneously, it is preferable therefore to make efficient.

The 34th scheme of the present invention the compression bonding method of adhesive tapes be, use on the base material and be coated with caking agent, and be wound into the adhesive tapes of reel and caking agent is crimped on the circuit card, it is characterized in that: on the whole surface of base material single face, be coated with caking agent, by a part to the caking agent on the width of adhesive tapes, length direction from the base material side along belt carries out strip hot pressing, when being reduced, the cohesive force of the caking agent that heater block divides is crimped onto on the circuit card, caking agent remaining after the crimping is wound into the spool shape with base material, reuse the adhesive tapes that is wound into the spool shape, with remaining caking agent thermo-compressed on circuit card.

According to the invention of the 34th scheme, heat by a part caking agent, the cohesive force of this part is descended (below be called " cohesive force droop line "), the caking agent that heater block is divided from this cohesive force droop line is crimped onto on the circuit card, leaves base material.Remaining caking agent is winding on the empty spool with base material with the state that remains on the base material.

According to the present invention,, therefore, can former state use existing device fabrication adhesive tapes owing to only make the width of adhesive tapes wideer than in the past.

In addition, be crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing heating region, the degree of freedom of the caking agent width of crimping is higher.

In addition, the same with the invention of the 29th scheme, when adhesive tapes when the spool extraction of sky goes out to have used up, thereby make the sense of rotation counter-rotating of spool make the direction of the supply counter-rotating of adhesive tapes, perhaps keep the sense of rotation of spool, spool is exchanged.Like this, because therefore the caking agent on the rule heated substrate and being crimped onto on the circuit card in turn can not increase the number of turns of belt, the bonding dosage that can use in 1 spool is increased significantly.

In addition, the same with the invention of the 29th scheme, increase bonding dosage owing to can not increasing the number of turns, therefore, can prevent to roll up when collapsing, can obtain to prevent the effects such as drawback of the stretching etc. of caused obstruction of oozing out of caking agent and base material.

Bandwidth is preferably 5～1000mm, and the caking agent that is crimped on the circuit card is preferably 0.5mm～1.5mm.Why bandwidth is 5～1000mm, is because under the situation of bandwidth less than 5mm, and the caking agent crimping number of times on 1 spool is less, simultaneously, if greater than 1000mm, just might can't be installed on the existing adhering device.

Caking agent both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, also can be dispersed with the spacer particle of insulativity in these caking agents.

The adhesive tapes of the 35th scheme of the present invention is coated with caking agent on the base material, and is wound into the spool shape, it is characterized in that: the width of adhesive tapes is greater than the length on one side of circuit card, and disposes many caking agents at the width of belt.

According to the invention of the 35th scheme, make one side overlay configuration of the width and the circuit card of adhesive tapes, to of the caking agent on the width that is arranged on adhesive tapes, along one side thermo-compressed of circuit card.

Because therefore the width of adhesive tapes, can only extract a wide use of bar of the strip of glue of adhesive tapes out more than or equal to the length on one side of circuit card.

Afterwards, after one side of circuit card crimping caking agent, the rotation circuit plate makes the other side be positioned at the width of adhesive tapes, and strip of glue hot pressing is received on the other side.Like this, if also crimping caking agent on other limits of circuit card, easily crimping caking agent around circuit card in turn.

Therefore, because a rule is used the caking agent greater than an edge lengths of circuit card in turn, therefore, usage quantity once only is the width size of strip of glue, thereby can not increase the number of turns of adhesive tapes, and increase spendable bonding dosage in 1 spool significantly.

And, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the belt that winds up is bonded together mutually form blocks, can also prevent the drawback (damage of base material and break) of the stretching etc. of the base material that is easy to generate because of base material is elongated.

In addition, in the manufacturing works of electronic devices and components, owing to can reduce the replacing number of times of new adhesive tapes, so operating efficiency is higher.

In addition, in the manufacturing of adhesive tapes, owing to can increase the bonding dosage of each spool, therefore the usage quantity that can cut down spool material and moisture proof material reduces manufacturing expense.

Caking agent both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, also can be dispersed with the spacer particle of insulativity in these caking agents.

Owing to be greater than an edge lengths of circuit card, thereby the width of adhesive tapes is for for example, 5～3000mm.In addition, even do not have the adhesive tapes of width of size on one side of circuit card, also can be by on the width of adhesive tapes, being adjacent to dispose many sizes with one side of circuit card.In this case, owing to can therefore can enhance productivity easily corresponding to the circuit card that varies in size.One width of caking agent for example is 0.5mm～10.0mm.

Why making the width of adhesive tapes is 5mm～3000mm, be because the size on one side of circuit card seldom less than 5mm, simultaneously, if greater than 3000mm, then the width of spool is excessive, might can't be installed on the existing adhering device.

The adhesive tapes of the 36th scheme of the present invention is on the basis of the 35th scheme, it is characterized in that: have certain interval in vain between the strip of glue adjacent to each other of many caking agents.

According to the invention of the 36th scheme, when can play the action effect identical with the invention of the 35th scheme, owing between the adjacent strip of glue certain distance is arranged, therefore easily a rule is carried out crimping from base material separation caking agent.

The adhesive tapes of the 37th scheme of the present invention is on the basis of the 35th scheme, it is characterized in that: caking agent is separated into many by the slit that the width along belt forms.

Invention according to the 37th scheme, when can play the action effect identical with the invention of the 35th scheme, preferably use coating adhesive and dried adhesive tapes on the whole surface of the single face of base material, before being crimped onto caking agent on the circuit card, promptly, use before the adhesive tapes, utilize cutting knife etc. to cut caking agent to form slit.

In addition, slit also can form with incision caking agents such as cutting knifes when making adhesive tapes, except using cutting knife, also can utilize formation such as laser and heating wire.

According to the present invention, can increase the bar number of the strip of glue that is configured on the base material, and can easily be manufactured on the adhesive tapes that disposes many caking agents on the width of belt.。

The manufacture method of the adhesive tapes of the 38th scheme of the present invention is made on the base material and is coated with caking agent, and is wound into the adhesive tapes of spool shape, it is characterized in that:

Coating adhesive on the whole surface of a side base material, next broad ways forms after the slit on caking agent, configuration the opposing party's base material on adhesive side, base material by a side and the opposing party is clamped caking agent, next base material by making a side and the opposing party's disconnected from each other the making on a side and the opposing party base material separately of base material all are pasted with many caking agents, thereby produce the adhesive tapes that many caking agents are arranged with certain arranged spaced on a side and the opposing party's base material.

According to the invention of the 38th scheme, can utilize existing installation, make the adhesive tapes of 2 the 35th schemes simultaneously, it is high therefore to make efficient.

The compression bonding method of the adhesive tapes of the 39th scheme of the present invention, it is characterized in that: each adhesive tapes in the 35th to 37 scheme is configured on the circuit card, by adhesive tapes being carried out hot pressing along width, thus on one side of circuit card the crimping strip of glue.

In this compression bonding method, adhesive tapes is configured on the circuit card, by along width to the adhesive tapes thermo-compressed, crimping strip of glue on one side of circuit card, next, by changing the position of circuit card, along width with the adhesive tapes thermo-compressed on the other side of circuit card, from starve can be on the other side of circuit card the next strip of glue of crimping

Invention according to the 39th scheme, when can play the action effect identical with each invention in the 35th～the 37th scheme, after being installed in adhesive tapes in the adhering device, one side of circuit card is configured on the width of adhesive tapes, to one side crimping caking agent of circuit card, next, circuit card is for example rotated about 90 degree, make the other side of circuit card be positioned at the position parallel, crimping caking agent on the other side of circuit card with the width of adhesive tapes.Like this, turn 90 degrees and the crimping caking agent by circuit card is revolved, crimping caking agent around circuit card can improve operating efficiency in the manufacturing works of electronic devices and components simply.

The compression bonding method of the adhesive tapes of the 40th scheme of the present invention, it is characterized in that: the adhesive tapes that is provided with in 2 the 35th to the 37th schemes each on the transmission road on the walking circuit plate at least, the width of one side's adhesive tapes is configured in and transmits on the vertical direction, and the width of the opposing party's adhesive tapes is configured on the direction that transmits the road; In one side's the adhesive tapes,, by along width hot pressing adhesive tapes, thereby strip of glue is crimped on the 2 relative limits of circuit card for the 2 relative limits of circuit card; Next circuit card is shifted to the opposing party's adhesive tapes, for the 2 remaining limits of circuit card, by from the base material side along width hot pressing adhesive tapes, thereby with strip of glue be crimped on circuit card around.

Invention according to the 40th scheme, when can play the action effect identical with each invention in the 35th～the 37th scheme, do not need the rotation circuit plate, the position of adhesive tapes by moving a side and the opposing party's adhesive tapes, on position separately along the width thermo-compressed, just can be easily at the crimping caking agent all around of circuit card, operating efficiency is preferable.

The compression bonding method of the adhesive tapes of the 41st scheme of the present invention, be coated with caking agent on the whole surface of the single face of use base material, and be wound into the adhesive tapes of spool shape, and caking agent is crimped onto on the circuit card, it is characterized in that: the width of adhesive tapes is more than or equal to the length on one side of circuit card, by a part to the caking agent on the width of adhesive tapes, carry out hot pressing at width, the cohesive force of the caking agent of heater block branch reduces thereby make, and caking agent is crimped onto on the circuit card.

Invention according to the 41st scheme, under the situation of crimping caking agent around the circuit card, adhesive tapes is installed in adhering device, by along width to the adhesive tapes thermo-compressed, the cohesive force of this part is descended (below be called " cohesive force droop line "), the caking agent that heater block is divided from this cohesive force droop line leaves base material and is crimped on the circuit card.Next, circuit card is for example rotated about 90 degree, make adjacent side be positioned at width with adhesive tapes,, strip of glue is crimped onto on the adjacent side along the next strip of glue of width thermo-compressed.Like this, can be in turn at the crimping caking agent all around of circuit card, operating efficiency is preferable.

In addition, owing to can therefore can former state use existing device fabrication adhesive tapes at the whole surface coated caking agent of adhesive tapes.

In addition, be crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing the hot pressing zone, the degree of freedom of caking agent width of carrying out crimping is higher.

In addition, the same with the invention of the 35th scheme, increase bonding dosage owing to can not increasing the number of turns, therefore, can prevent to roll up when collapsing, can obtain to prevent the effects such as the caused drawback of stretching of caused obstruction of oozing out of caking agent and base material.

The adhesive agent-tape cassette of the 42nd scheme of the present invention, it is characterized in that: have a side spool, the opposing party's spool and the box body that can keep and hold with rotating freely these two spools, be wound with the adhesive tapes that has been coated with caking agent on the base material on one side's the spool, fixing an end of adhesive tapes on the opposing party's the spool, the length direction along belt on the adhesive tapes disposes 2 caking agents at least.

Invention according to the 42nd scheme, adhesive agent-tape cassette is installed on the adhering device, make one of formed at least 2 caking agents alongst of width of the adhesive tapes one side overlay configuration with circuit card,, a caking agent is crimped onto on the circuit card from base material side thermo-compressed.Like this, in turn caking agent is crimped onto on the circuit card, when emitting adhesive tapes in turn from a side the spool, reeling on the opposing party's spool is coated with the adhesive tapes of a remaining caking agent.Afterwards, when the adhesive tapes on the assorted side's that reels the spool had been used up, the upset tape drum was installed in it on adhering device once more.

Like this, because therefore a side spool and the opposing party's changing reel, extract adhesive tapes, the crimping of a caking agent that is left out from the opposing party's spool specifically.

Under the situation that is formed with the caking agent more than 2 on the adhesive tapes, can change the position of width in turn, perhaps carry out crimping with certain interval.

Like this, among the present invention, on adhesive tapes, caking agent is set side by side with 2 and the use of 1 rule ground at least at width, therefore, 1 spool can be used as 2 spools at least and use, and therefore can not increase the number of turns of adhesive tapes, and spendable bonding dosage in 1 spool is increased to more than 2 times.

And, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, can also prevents the drawback (damage of base material and break) of the stretching etc. of the base material that is easy to generate because of base material is elongated.

On the other hand, under the situation that is formed with 2 caking agents, in the manufacturing works of electronic devices and components,, only need the upset tape drum, can easily carry out installation next time when 1 spool amount (1 caking agent) when having used up.

In addition, because adhesive tapes is made tape drum, therefore in adhering device, do not need to spend adhesive tapes is installed to time on the spool, but only tape drum is installed in the adhering device, so operation is easy, and the operation of installing and changing is preferable.

Caking agent both can be the caking agent that is dispersed with the anisotropic conductive of conducting particles in the caking agent of insulativity, also can be the insulativity caking agent, also can be dispersed with the spacer particle of insulativity in these caking agents.

The adhesive agent-tape cassette of the 43rd scheme of the present invention is on the basis of the 42nd scheme, it is characterized in that: at least two caking agents are the strip of glue adjacent to each other of having certain intervals in vain.

According to the invention of the 43rd scheme, when can play the action effect identical with the invention of the 42nd scheme, owing between the adjacent strip of glue certain distance is arranged, therefore easily a rule is carried out crimping from base material separation caking agent.

The adhesive agent-tape cassette of the 44th scheme of the present invention is on the basis of the 42nd scheme, it is characterized in that: the slit that caking agent is formed on the length direction of belt is separated at least 2.

Invention according to the 44th scheme, when can play the action effect identical with the invention of the 42nd scheme, preferably use coating adhesive and dried adhesive tapes on the whole surface of the single face of base material, before being crimped onto caking agent on the circuit card, promptly, use before the adhesive tapes, utilize cutting knife etc. to cut caking agent to form slit.

In addition, slit also can utilize incision caking agent formation such as cutting knife when making adhesive tapes, except utilizing cutting knife, and also can be by formation such as laser and heating wires.

The compression bonding method of the caking agent of the use adhesive agent-tape cassette of the 45th scheme of the present invention, it is characterized in that: the spool that will have a side, the opposing party's spool, and the box body that can keep and hold with rotating freely these two spools, and be wound with the adhesive tapes that has been coated with caking agent on the base material on a side the spool, the adhesive agent-tape cassette of fixing an end of adhesive tapes on the opposing party's the spool is installed in the compression bonding apparatus, from adhesive agent-tape cassette, be drawn out to adhesive tapes on the circuit card, carry out hot pressing by a part to the width of adhesive tapes, thereby the cohesive force of the caking agent that heater block divides is reduced, and the caking agent of the part of width is crimped onto on the circuit card.

Invention according to the 45th scheme, by in adhesive tapes to a part of thermo-compressed of width, the cohesive force of the caking agent of this part is descended (below be called " cohesive force droop line "), make the caking agent of hot spots leave base material from this cohesive force droop line and be crimped on the circuit card.

Among the present invention, owing to can therefore can former state use existing device fabrication adhesive tapes at the whole surface coated caking agent of the base material of adhesive tapes.

In addition, be crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing the hot pressing zone, the degree of freedom of caking agent width of carrying out crimping is higher.

The compression bonding method of the caking agent of the use adhesive agent-tape cassette of the 46th scheme of the present invention, it is characterized in that: the spool that will have a side, the opposing party's spool, and the box body that can keep and hold with rotating freely these two spools, and be wound with the adhesive tapes that has been coated with caking agent on the base material on a side the spool, the adhesive agent-tape cassette of fixing an end of adhesive tapes on the opposing party's the spool is installed in the compression bonding apparatus, from adhesive agent-tape cassette, be drawn out to adhesive tapes on the circuit card, carry out hot pressing by a part to the width of adhesive tapes, thereby making, the cohesive force of the caking agent of heater block branch reduces, and the caking agent of the part of width is crimped onto on the circuit card, after the adhesive tapes of being reeled on a side the spool has been used up, the upset adhesive agent-tape cassette is crimped onto the caking agent of remainder on the circuit card.

Invention according to the 46th scheme, when can play the action effect identical with the invention of the 45th scheme, when the adhesive tapes on the spool that is wound on a side has been used up, tape drum is installed in the compression bonding apparatus once more owing to can overturn, the adhesive tapes of remainder is crimped onto on the circuit card, therefore, the same with the invention of the 42nd scheme, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can obtain to prevent that caking agent from oozing out the effect of the caused drawback of stretching of caused obstruction and base material etc. from the width of belt.And then, in the manufacturing works of electronic devices and components, after the adhesive tapes that uses 1 spool (1 caking agent) has been used up since only need the upset tape drum then can, therefore install easily next time.Owing to adopt tape drum, so operation is easy, and the operation of installing and changing is preferable.

The adhesive material tape of the 47th scheme of the present invention is the bonding material band that rolls becomes reel, and it is characterized in that: base material has heat and melts agent layer and supporting layer.

According to the invention of the 47th scheme, when using adhesive material tape, be installed in the adhering device being wound with the spool of adhesive material tape and empty spool, after the thermo-compressed adhesives, base material is winding on the empty spool on circuit card.Afterwards, make the terminal part of a side's who is reeled on the spool of extracting end-of-use one side out adhesive material tape, overlap with the top of the opposing party's who is reeled on new the opposing party's the spool adhesive material tape or toward each other, heat this part, heat is melted after the fusing of agent layer, make heat melt agent by cooling and solidify, thus adhesive material tape is interconnection.

Owing to utilize the base material of adhesive material tape, be bonded together extracting the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing out, carry out the replacing of adhesives volume, therefore can to adhering device new adhesives volume be installed simply.In addition, when carrying out the replacing of new adhesive material tape at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of setting up guide reel etc., therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

If use the thermal head of the adhering device that the adhesives volume is installed, the thermo-compressed of connection portion can rationally be utilized adhering device.

The 48th scheme of the present invention adhesive material tape be on the basis of the 47th scheme, it is characterized in that: supporting layer is melted the clamping of agent layer by heat.

Invention according to the 48th scheme, when can play the action effect identical with the invention of the 47th scheme, because the surface of base material has heat to melt the agent layer, thereby the heat of the terminal part of a side adhesive material tape can be melted the adhesive side overlaid of agent layer and top part, this part is carried out thermo-compressed and the two is coupled together, therefore connect very simple.In addition, because heat is melted on the whole length direction that the agent layer is formed on belt, therefore needn't carry out strict location to overlap length, the degree of freedom of connection is higher.

The adhesive material tape of the 49th scheme of the present invention is on the basis of the 47th scheme, it is characterized in that: heat is melted the agent layer and is supported a layer clamping.

Invention according to the 49th scheme, when can play the action effect identical with the invention of the 47th scheme, for adhesive material tape is interconnected, make the top part of a side the terminal part of adhesive material tape and the opposing party's adhesive material tape be in position respect to one another, carry out thermo-compressed with the thermal head of adhering device.During heating, heat is melted agent layer fusing and is oozed out, and make heat melt agent by cooling and solidify, thus adhesive material tape is interconnection.At this moment, be supported layer and be clipped in the middle, therefore, can prevent that heat from melting the agent layer and being exposed in the atmosphere, because of the decline that caused heat is melted the bonding strength of agent layer of adhering to of moisture absorption that moisture caused and dust because heat is melted the agent layer.

The method of attachment of the adhesive material tape of the 50th scheme of the present invention is, the adhesive material tape of a side on a side the spool will be wound on, couple together with the adhesive material tape of the opposing party on the spool that is wound on the opposing party, it is characterized in that: adhesive material tape has with parting agent has implemented surface-treated base material and caking agent, the parting agent of the base material end of removal either party's adhesive material tape, make the adhesive side overlaid of this part and the opposing party's adhesive material tape, the two lap is carried out thermo-compressed make its connection.

Invention according to the 50th scheme, owing to make either party's the substrate surface of adhesive material tape and the opposing party's the adhesive side of adhesive material tape overlapping, lap is carried out thermo-compressed, couple together extracting the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing out, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesives volume be installed simply.

When carrying out the replacing of new adhesive material tape at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation that guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

In addition,, become at adhesive material-tape reel under the state of reel for the surface of base material, not bonding in order to make adhesive side and substrate surface, be coated with parting agent on the surface of base material.Among the present invention, owing to remove the parting agent of a side adhesive material tape, make that this part and the opposing party's the adhesive side of adhesive material tape is overlapping carries out bondingly, so the connection between the adhesive material tape is very simple.

If use the thermal head of the adhering device that documented adhesives volume is installed, the thermo-compressed of connection portion can rationally be utilized adhering device.

The method of attachment of the adhesive material tape of the 51st scheme of the present invention is on the basis of the 50th scheme, it is characterized in that: remove parting agent and undertaken by any method in plasma discharge, uviolizing, the laser radiation.

Invention according to the 51st scheme, when can play the action effect identical with the invention of the 50th scheme, remove parting agent owing to use any method in plasma discharge, uviolizing, the laser radiation, thereby with peel manually from situation compare, can be reliably and realize the removal of parting agent with the short period of time.

As the removal method of parting agent, using under the situation of plasma discharge, by making the decomposing gas of isoionic state, be in easily the state of (excited state) of reacting, remove parting agent by discharging on the surface of base material.In addition, under the situation of uviolizing, for example mercuryvapour lamp uses as light source, by carrying out from the ultraviolet ray of mercuryvapour lamp irradiation certain hour.In addition, under the situation of laser radiation, utilize laser oscillator institute emitted laser, to remove parting agent with the parting agent heat fused.

The adhesive material-tape reel of the 52nd scheme of the present invention is the adhesive material-tape reel that is wound on the spool with two side plates, it is characterized in that: the width that adhesive material tape twists in belt is provided with the winding part of a plurality of adhesive material tapes.

Invention according to the 52nd scheme, owing to be provided with the winding part (coiling portion) of a plurality of adhesive material tapes, therefore, thereby, in a plurality of winding parts, the adhesive material tape that one side's winding part is reeled is drawn out of when having used up, and just will be installed on the winding off spindle with this adhesive material tape that is drawn out of other winding parts of end-of-use winding part disposed adjacent.

Like this, when the adhesive material tape of reeling when a side winding part is drawn out of and has used up, the adhesive material tape of being reeled on the adjacent winding part is installed on the winding off spindle, carries out the replacing of adhesive material tape, therefore do not need new adhesive material-tape reel is installed in the adhering device.So, can reduce replacing time of new adhesive material tape, improved the production efficiency of e-machine.

Owing to can use the adhesive material tape of being reeled in a plurality of winding parts in turn, therefore can not increase the number of turns of 1 adhesive material tape on the adhesive material-tape reel, and can increase spendable bonding dosage significantly by 1 time replacing operation.In addition, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape that winds up is bonded together this so-called obstruction mutually, can also prevents the drawback of the stretching etc. of the base material that is easy to generate because of base material is elongated.

The adhesive material-tape reel of the invention of the 53rd scheme of the present invention is on the basis of the 52nd scheme, it is characterized in that: the accommodation section that is provided with siccative on the side plate of spool.

The 54th scheme of the present invention adhesive material-tape reel be on the basis of the 52nd scheme or 53 schemes,, it is characterized in that: be provided with on the spool can freely install and remove be used for spool on the adhesive material tape of being reeled around coat the cover of getting up.

The adhesive material-tape reel of the invention of the 55th scheme of the present invention is on the basis of the 54th scheme, it is characterized in that: cover has the outlet of adhesive material tape.

The 56th scheme of the present invention adhesive material-tape reel be on the basis of the 52nd scheme or 53 schemes,, it is characterized in that: the side plate of the winding part of adhesive material tape each other can freely install and remove ground chimeric.

The 57th scheme of the present invention adhesive material-tape reel be on the basis of the 52nd scheme or 53 schemes, it is characterized in that: adhesive material tape is the adhesive material tape that is coated with the electrode connecting adhesive that connects electrode of opposite on the base material.

The 58th scheme of the present invention adhesive material-tape reel be on the basis of the 52nd scheme or 53 schemes, it is characterized in that: adhesive material tape be connect lead frame fixing with support substrate or semiconductor element mounting with the tube core of support substrate or lead frame and the adhesive material tape of semiconductor element.

The adhering apparatus of the 59th scheme of the present invention, spool with a side, the opposing party's spool, make the gear unit of rotation interlock of a side spool and the opposing party's spool, the shell that holds them, be configured in shell peristome heater block and to the supply unit of heater block power supply, it is characterized in that: be wound with the adhesive tapes that has been coated with caking agent on the base material on a side the spool, be fixed with an end of adhesive tapes on the opposing party's the spool, heater block has the electroheat member that the electric energy that passes through to be supplied with generates heat, the adhesive tapes that is wound on a side the spool is extracted out from the peristome of shell, from the base material side adhesive tapes that is positioned at peristome is carried out hot pressing by heater block, thereby caking agent is crimped onto on the circuit card, and the base material that caking agent is stripped from is wound up on the opposing party's the spool.

Invention according to the 59th scheme, under the situation of circuit card crimping caking agent, by to be hold by one hand tape drum, the peristome that will expose adhesive tapes is by being pressed on the circuit card, and the heater block of the adhesive tapes base material side that is arranged on peristome is contacted with the adhesive tapes that is positioned at peristome greatly, thereby caking agent is crimped onto on the circuit card.Like this, push the adhesive tapes that is positioned under the heater block when on one side, when advancing adhering apparatus on one side, owing to extract adhesive tapes out from a side spool, and just rotation of spool when spool is extracted adhesive tapes out, therefore also rotate with the co-axially fixed gear of a side spool, make the gear rotation with the opposing party's spool of its interlock, the base material that caking agent has been stripped from is wound up on the opposing party's the spool.

Stretching and fault such as fracture.

In addition, by utilizing the adhesive material tape that base material constituted of thinner thickness, 1 number of turns on the spool is increased, thereby can increase spendable bonding dosage on 1 spool.In addition,,, therefore, in the manufacturing works of electronic devices and components, can reduce the replacing number of times of new adhesive material tape, improve operating efficiency owing to the number of turns on 1 spool is more if use adhesive material tape of the present invention.In addition, in the manufacturing of adhesive material tape, owing to can reduce the spool number that is used to make, therefore the usage quantity that can cut down spool material and moisture proof material reduces manufacturing expense.

Metallic film is the high metal of ductility preferably, can adopt copper, aluminium, stainless steel, iron, tin etc.

The aromatic polyamide film specifically, can adopt palladium class aromatic polyamide film (ミ Network ト ロ Application, eastern レ Co., Ltd. system, trade(brand)name).

Caking agent can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.In the representative of these resins,, polystyrene resin class, alkyd resin class are arranged, in addition,, epoxy resin, third rare resene, silicone resin class are arranged as the thermosetting resin class as type thermoplastic resin.

Can be dispersed with conducting particles in the caking agent, as conducting particles, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. are arranged, can be by on polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles constitutes, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thus can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, be ideal very.

The adhesive material tape of the 61st scheme of the present invention is on the basis of the 60th scheme, it is characterized in that: the thickness of base material is 1 μ m～25 μ m.

The thickness that why makes base material is 1 μ m～25 μ m, is that base material can't obtain enough tensile strengths because under the situation of thickness less than 1 μ m of base material, fracture easily.In addition, surpassed under the situation of 25 μ m, be difficult in 1 spool and obtain the gratifying number of turns at the thickness of base material.

The adhesive material tape of the 62nd scheme of the present invention is on the basis of the 60th or the 61st scheme, it is characterized in that: the tensile strength of base material is down more than the 300MPa at 25 ℃.

The tensile strength that why makes base material is more than the 300MPa, be because in the base material tensile strength than 300MPa hour, base material is stretched easily, adhesive material tape ruptures easily in addition.

The adhesive material tape of the 63rd scheme of the present invention is on the basis of the 60th or the 61st scheme, it is characterized in that: base material is 0.01～1.0 with the thickness ratio of caking agent.

Why making the base material and the thickness ratio of caking agent is 0.01～1.0, be because at the thickness of base material and caking agent than laughing under 0.01 situation, base material is thin excessively, adhesive material tape can't obtain enough intensity.In addition, than having surpassed under 1.0 the situation, base material is blocked up, is difficult in 1 spool and obtains the gratifying number of turns at the thickness of base material and caking agent.

The adhesive material tape of the 64th scheme of the present invention is on the basis of the 60th or the 61st scheme, it is characterized in that: the surfaceness R of base material _MaxBe below the 0.5 μ m.

Why make the surfaceness R of base material _MaxBeing below the 0.5 μ m, is because if R _MaxSurpassed 0.5 μ m, because substrate surface is concavo-convex, to circuit card crimping caking agent the time, caking agent is difficult to separate from base material.

The formation method of the adhesives of the adhesive material tape of the 65th scheme of the present invention, be to use and be coated with caking agent on the base material, and be rolled into the adhesive material tape of reel, form the formation method of adhesives of the adhesive material tape of caking agent on by sticky object, it is characterized in that: from a plurality of spools, draw adhesive material tape respectively, make each adhesive material tape overlapping for one, when peeling off a side base material, make overlappingly to be

According to the invention of the 65th scheme, the adhesive side of the adhesive material tape that will be extracted out from a side the spool, overlapping with the adhesive side of the adhesive material tape of from the opposing party's spool, being extracted out, adhesive material tape is made of one.The base material of the opposing party's adhesive material tape is wound up on the winding off spindle, utilizes thermal head, the caking agent of overlapping adhesive material tape for one is crimped onto by on the sticky object.It by sticky object tube core of electronic devices and components, circuit card, lead frame and lead frame etc.

Like this, in the operation in by sticky object before the formation caking agent, make a side the caking agent of adhesive material tape and the opposing party's the caking agent of adhesive material tape overlapping, form after the desirable thickness, on by sticky object, form caking agent, therefore, can make the thinner thickness of each adhesive material tape, increase the number of turns of adhesive material tape, thereby can reduce the winding diameter of 1 adhesive material tape on the spool.So, can increase the number of turns of the adhesive material tape of 1 spool, change spendable bonding dosage in the operation thereby can increase by 1 time significantly.Therefore, can reduce the replacing operation of new adhesive material tape, improve the production efficiency of e-machine.

The adhesives formation method of the adhesive material tape of the 66th scheme of the present invention is on the basis of the 65th scheme, it is characterized in that: have only in a side the caking agent of adhesive material tape and contain stiffening agent.

] according to the invention of the 66th scheme, when can play the action effect identical, contain stiffening agent in the caking agent owing to the adhesive material tape that has only a side with the invention of the 65th scheme, therefore, do not need stiffening agent in the caking agent of the opposing party's adhesive material tape.So the adhesive material tape that does not contain the caking agent of stiffening agent does not need the low temperature keeping.Thereby can reduce the number of the adhesive material tape that needs the low temperature keeping, thereby can take care of efficiently conveying, the keeping of adhesive material tape.In addition, for the adhesive material tape that is not added with stiffening agent and be added with the caking agent of the adhesive material tape of stiffening agent, by will with the composition of stiffening agent reaction caking agent as the opposing party, will with stiffening agent use not with the caking agent of the composition of stiffening agent reaction caking agent as a side, thereby can improve the storage stability of caking agent.

The anisotropic conductive material band of the 67th scheme of the present invention is characterized in that: will have the anisotropic conductive material of the caking agent of film like, coiling multireel lamination forms on the length direction of core.

The anisotropic conductive material band of the 68th scheme of the present invention be the 67th scheme the basis on, it is characterized in that: above-mentioned anisotropic conductive material is the anisotropic conductive material that is provided with 2 layers of structure of base material film on the single face of the caking agent of film like.

The anisotropic conductive material band of the 69th scheme of the present invention be the 67th scheme the basis on, it is characterized in that: above-mentioned anisotropic conductive material is the anisotropic conductive material that is provided with 3 layers of structure of base material film on the caking agent of film like two-sided.

The anisotropic conductive material band of the 70th scheme of the present invention is on the basis of the 68th scheme or the 69th scheme, and it is characterized in that: the single or double to above-mentioned base material film has been implemented lift-off processing.Invention, in the described anisotropic conductive material band, the single or double of above-mentioned base material film has been implemented lift-off processing.

The 71st scheme of the present invention the anisotropic conductive material band be in the 67th scheme to the 70 schemes on each the basis, it is characterized in that: the width of the caking agent of above-mentioned film like is 0.5～5mm.Invention, in the anisotropic conductive material band, the width of the caking agent of above-mentioned film like is 0.5～5mm.

In addition, the anisotropic conductive material band of the 72nd scheme of the present invention is on the basis of the 68th scheme or the 71st scheme, it is characterized in that: the base material film strength is 12kg/mm ²More than, unit elongation is 60～200%, thickness is below the 100 μ m.Afterwards, if base material film is coloured to colored transparent or coloured opaque, the differentiation of base material film and caking agent just is easier to, and in addition, the position of winding part also is easier to differentiate, and has improved operation.

Description of drawings

Fig. 1 is in the method for attachment of the adhesive material tape of embodiment 1, the stereographic map of the connection between the expression adhesives volume.

Fig. 2 A and Fig. 2 B are the stereographic map of connection operation of the connection portion of presentation graphs 1.

Fig. 3 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Fig. 4 is the bonding sectional view between the indication circuit plate.

Fig. 5 is the process picture sheet of the manufacture method of expression adhesive material tape.

Fig. 6 is the stereographic map of the method for attachment of the adhesive material tape of expression embodiments of the invention 2.

Fig. 7 is the stereographic map of the method for attachment of the adhesive material tape of the variation of expression embodiments of the invention 2.

Fig. 8 A～Fig. 8 C is the synoptic diagram of the method for attachment of the adhesive material tape of expression embodiment 1, Fig. 8 A is the stereographic map of the connection between the expression adhesives volume, Fig. 8 B is the stereographic map of method of attachment of the connection portion of presentation graphs 8A, and Fig. 8 C is the vertical view of the connection portion of Fig. 8 A.

Fig. 9 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 2.

Figure 10 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 3.

Figure 11 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 4.

Figure 12 A and Figure 12 B are the synoptic diagram of method of attachment of the adhesive material tape of expression embodiment 1, and Figure 12 A is the stereographic map of the connection between the expression adhesives volume, and Figure 12 B is the stereographic map of method of attachment of the connection portion of presentation graphs 12A.

Figure 13 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 2.

Figure 14 A and Figure 14 B are the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 3, and Figure 14 A represents the state before the thermo-compressed, and Figure 14 B represents the state after the thermo-compressed.

Figure 15 A and Figure 15 B are the synoptic diagram of the method for attachment of the adhesive material tape of expression embodiments of the invention 4, and Figure 15 A is a sectional view, and Figure 15 B is a vertical view.

Figure 16 A and Figure 16 B are the synoptic diagram of the method for attachment of the adhesive material tape of expression embodiment 1, and Figure 16 A is the stereographic map of the connection between the expression adhesives volume, and Figure 16 B is the stereographic map of the connection portion (b) of presentation graphs 16A.

Figure 17 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 2.

Figure 18 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 3.

Figure 19 is the sectional view of the method for attachment of the adhesive material tape of expression embodiments of the invention 4.

Figure 20 A～Figure 20 C is the synoptic diagram of method of attachment of the adhesive material tape of expression embodiment 1, and Figure 20 A is the stereographic map of the connection between the expression adhesives volume, and Figure 20 B and Figure 20 C are the sectional view of method of attachment of the connection portion of presentation graphs 20A.

Figure 21 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Figure 22 A～22C is the stereographic map of expression adhesive material-tape reel for the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 22 A, and Figure 22 B is the front view of Figure 22 A, and Figure 22 C is the vertical view of the connecting band of Figure 22 A.

Figure 23 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Figure 24 is the vertical view of the connecting band of embodiments of the invention 2.

Figure 25 is the vertical view of the connecting band of embodiments of the invention 3.

Figure 26 is the stereographic map of the adhesive material-tape reel of expression embodiments of the invention 4.

Figure 27 A～27C is the stereographic map of expression adhesive material-tape reel for the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 27 A, and Figure 27 B is the front view of Figure 27 A, and Figure 27 C is the sectional view of the connection portion of Figure 27 A.

Figure 28 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Figure 29 is the stereographic map of the user mode of the caking agent of expression PDP.

Figure 30 is the stereographic map of the adhesive material-tape reel of expression embodiments of the invention 2.

Under the situation of Figure 31 A for the semiconducter device that the adhesive material tape of adhesive material-tape reel of the present invention is used for the LOC structure, the sectional view of adhesive material tape.

Under the situation of Figure 31 B for the semiconducter device that the adhesive material tape of adhesive material-tape reel of the present invention is used for the LOC structure, the sectional view of the semiconducter device of LOC structure.

Figure 32 A～Figure 32 C uses the synoptic diagram of the adhering device of adhesive material-tape reel of the present invention for expression, and Figure 32 A is a front view, and Figure 32 B is a side-view, Figure 32 C be Figure 32 B adhesive material tape punching press paste section 89 want portion's enlarged view.

Figure 33 A and Figure 33 B are the synoptic diagram of adhesive tapes, and Figure 33 A is for rolling up the stereographic map of the spool that adhesive tapes is arranged, and Figure 33 B is the A-A line sectional view of Figure 33 A.

Figure 34 is the stereographic map of the user mode of the caking agent of expression PDP.

Figure 35 is the sectional view that is illustrated in the operation of coating adhesive on the base material.

Figure 36 A～Figure 36 C is the sectional view of the adhesive tapes of embodiments of the invention 2.

Figure 37 A～Figure 37 C is the adhesive tapes of expression embodiments of the invention 3 and the process picture sheet of compression bonding method thereof.

Figure 38 A～Figure 38 C is the process picture sheet of the manufacture method of the adhesive tapes of expression embodiments of the invention 4.

Figure 39 A and Figure 39 B are the synoptic diagram of adhesive tapes, and Figure 39 A has the stereographic map of spool of adhesive tapes for volume, and Figure 39 B sees the vertical view of adhesive tapes for Figure 39 A's from the caking agent side.

Figure 40 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Figure 41 is the synoptic diagram of the crimping process of the caking agent of the adhering device of expression embodiments of the invention 2

Figure 42 A～Figure 42 C is the sectional view of the adhesive tapes of embodiments of the invention 3.

Figure 43 A～Figure 43 C is the adhesive tapes of expression embodiments of the invention 4 and the process picture sheet of compression bonding method thereof.

Figure 44 A～Figure 44 C is the process picture sheet of the manufacture method of the adhesive tapes of expression embodiments of the invention 5.

Figure 45 A and Figure 45 B are the synoptic diagram of the adhesive agent-tape cassette of embodiments of the invention 1, and Figure 45 A is the stereographic map of adhesive agent-tape cassette, and Figure 45 B is the A-A line sectional view of Figure 45 A.

Figure 46 is the sectional view of installment state of the spool of the tape drum shown in the presentation graphs 45A.

Figure 47 is the front view of the crimping process of the caking agent of expression adhering device.

Figure 48 is the process picture sheet of the manufacture method of expression adhesive agent-tape cassette.

Figure 49 is the synoptic diagram of the crimping process of the caking agent of the adhering device of expression embodiments of the invention 2

Figure 50 is the sectional view of the adhesive tapes of embodiments of the invention 3.

Figure 51 A and Figure 51 B are the adhesive tapes of expression embodiments of the invention 4 and the process picture sheet of compression bonding method thereof.

Figure 52 A and Figure 52 B are the synoptic diagram of the adhesive material tape of expression embodiment 1, and Figure 52 A is the stereographic map of the connection between the expression adhesives volume, and Figure 52 B is the sectional view of the connection portion of presentation graphs 52A.

Figure 53 is the sectional view of the adhesive material tape of expression embodiment 2.

Figure 54 A～Figure 54 C is the sectional view of the connection operation of the connection portion of expression Figure 55, the state before Figure 54 A represents to discharge, and the state after Figure 54 B represents to discharge, Figure 54 C is the synoptic diagram of the thermo-compressed of expression connection portion.

Figure 55 is the stereographic map of the connection between the volume of the adhesives in the method for attachment of expression adhesive material tape.

Figure 56 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Figure 57 A～Figure 57 C is the stereographic map of expression adhesive material-tape reel for the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 57 A, and Figure 57 B is the front view of Figure 57 A, and Figure 57 C is the front view of the cover of Figure 57 A.

Figure 58 is the process picture sheet of the manufacture method of expression adhesive material-tape reel.

Figure 59 is the side-view of the adhesive material-tape reel of embodiments of the invention 2.

Figure 60 A and Figure 60 B are the front view of the adhesive material-tape reel of embodiments of the invention 3, and the replacing of adhesive tapes is described.

Figure 61 is the stereographic map of the side plate of the coiling portion of expression embodiments of the invention 4.

Figure 62 A and Figure 62 B are the synoptic diagram of the adhering apparatus of embodiments of the invention 1, and Figure 62 A is the stereographic map of adhering apparatus, and Figure 62 B is the A-A line sectional view of Figure 62 A.

Figure 63 is the side-view of the using method of the adhering apparatus shown in explanatory view 62A and Figure 62 B.

Figure 64 is the process picture sheet of the manufacture method of expression adhering apparatus.

Figure 65 A and Figure 65 B are the synoptic diagram of the adhesive material tape of expression embodiment 1, and Figure 65 A is wound on the stereographic map on the spool for representing adhesive material tape, and Figure 65 B is the A-A line sectional view of Figure 65 A.

Figure 66 A and Figure 66 B form the synoptic diagram of operation for the adhesives of the adhesive material tape of expression embodiment 1, Figure 66 A makes each adhesive material tape overlapping and be made of one for expression, one side's base material is wound up into the synoptic diagram of the operation on the spool of coiling usefulness, Figure 66 B is the sectional view of the part that overlaps each other between the caking agent of presentation graphs 66A.

Figure 67 is formed on by the synoptic diagram of the operation on the sticky object for the caking agent of expression with adhering device.

Figure 68 has the stereographic map of the spool of adhesive material tape for volume.

Figure 69 A is the sectional view of the formation operation of the adhesives of the adhesive material tape of expression embodiment 2.

Figure 69 B is the bonding sectional view between the circuit card of the adhesives of expression use Figure 69 A.

Figure 70 is the synoptic diagram of the supply mode of the anisotropic conductive material band of expression 2 layers of structure of the present invention.

Figure 71 is the synoptic diagram of the supply mode of the anisotropic conductive material band of expression 3 layers of structure of the present invention.

Embodiment

Below, with reference to accompanying drawing embodiments of the invention are elaborated.In addition, in the following description, identical or equal integrant is put on identical symbol.

At first, with reference to Fig. 1～Fig. 5, the embodiment of the 1st scheme of the present invention～the 4th scheme is described.

Fig. 1 is the stereographic map of the connection between the adhesives volume in the method for attachment of the adhesive material tape of expression embodiment 1, Fig. 2 A and Fig. 2 B are the connection process picture sheet of the connection portion (A) of presentation graphs 1, Fig. 2 A is the stereographic map of expression with the cut-out of the magnetic tape trailer of end-of-use adhesive material tape, Fig. 2 B is connected end-of-use adhesive material tape upset for expression with new adhesive material tape stereographic map, Fig. 3 is the synoptic diagram of the crimping process of the caking agent of expression adhering device, Fig. 4 is the bonding sectional view between the indication circuit plate, and Fig. 5 is the process picture sheet of the manufacture method of expression adhesive material tape.

Adhesive material tape 1 is wound on respectively on spool 3, the 3a, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 on each spool 3,3a.Also promptly, each spool 3,3a have the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 respectively.

Adhesive material tape 1 is made of a base material 9 and a lateral caking agent 11 that is coated on base material 9.

Base material 9 from intensity and constitute the separability aspect of the caking agent of anisotropic conductive material, is handled PET formations such as (polyethylene terephthalates), but is not limited in this by OPP (extended polypropylene), tetrafluoroethylene, silicon.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Conducting particles 13 can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat the made conductive layer of material that constitutes above-mentioned conducting particles 13 and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles 13 obtains, and conducting particles 13 and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles 13 usefulness scolding tin are ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.As shown in Figure 3, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end that twists in the adhesive material tape 1 on the spool 3a is supportted on the guide reel 22 and be installed on the winding off spindle 17, extracts adhesive material tape 1 (arrow E among Fig. 3) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spool 3a, 17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of present embodiment adhesive material tape 1, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, and the adhesive material tape that twists on the spool 3a just is rolled on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Fig. 1) of the adhesive material tape 1 that twists on the spool 3a.

The method of attachment of adhesive material tape of the present invention has (a) and reaches (b) two kinds of situations.(a) situation is as using winding off spindle 17 in the past, and changed the residual adhesive tapes that a spot of volume is arranged of the adhesive material tape 1 that uses up, new adhesive tapes being connected on the winding off spindle 17; (b) situation is that the residual of adhesive material tape 1 that will use up has the adhesive tapes of a spot of volume to use as winding off spindle 17, has the adhesive tapes of a spot of volume to be connected with residual new adhesive tapes.

Under (b) situation, as shown in Figure 1, on the adhesive material tape 1 of spool 3a, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of being reeled on the new adhesives volume 3.

The connection of this adhesive material tape 1, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, shown in Fig. 2 A, cut off (B) near the terminal marking 28 with adhesive material tape 1, the terminal part 30 of upset adhesive material tape 1 makes caking agent 11 faces of adhesive material tape 1 be positioned at upside (Fig. 2 B).Next, with 11 of the caking agents of the terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a, with 11 overlaids of caking agent (Fig. 2 B) of the top part 32 of the adhesive material tape 1 of new adhesives volume 3.

Next, as shown in Figure 4, the two lap is placed on the platform 104, utilize the thermal head 19 of adhering device 15 to carry out thermo-compressed, make it bonding.Like this, the adhesive material tape 1 of being reeled on the end-of-use spool 3a just has been connected with the adhesive material tape 1 of being reeled on the new spool 3.Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.So, do not need adhesive material tape 1 is installed to operation on the winding off spindle 17.In addition, owing to make 11 of caking agents overlapped and bonding, so strength of joint is very high.

In addition, in adhesive material tape 1, with adhesive material tape 1 from end-of-use spool (spool that adhesive material tape 1 is extracted out fully) when 3a moves thermal head 19 to, terminal marking 28 is positioned at from adhesive material tape 1 carries out the fixed position, on the extension position between the thermal head 19 at end-of-use spool 3a.In this case, if near terminal marking 28, cut off, then adhesive material tape 1 is cut in the inferior limit position of necessity, when can prevent the waste of adhesive material tape 1, can avoid in order to take off end-of-use spool 3a and terminal marking 28 to be delivered to thermal head 19 and the operation of this trouble of mobile end-of-use spool 3a.

In the present embodiment, because adhering device 15 has thermal head 19, utilize this thermal head 19, carry out the caking agent 11 of terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a, with being connected between the caking agent 11 of the top part 32 of the adhesive material tape 1 of new adhesives volume 3, therefore, do not need to be used in addition caking agent is crimped on together apparatus for pressure welding mutually, just can roll up the spool 3 of adhesive material tape 1, the replacing of 3a.

In (a) as using winding off spindle 17 in the past, there are the adhesive tapes of a spot of volume and new adhesive tapes to change the residual of adhesive material tape 1 that uses up, new adhesive tapes is connected under the situation on the winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, cut off near the terminal marking 28 with adhesive material tape 1, upset remains in the terminal part of the adhesive material tape of winding off spindle 17 sides, makes caking agent 11 faces be positioned at upside.Next, make 11 of the caking agents of the terminal part of this adhesive material tape 1, with 11 overlaids of caking agent of the top part 32 of the adhesive material tape 1 of new adhesives volume 3.Afterwards, the two lap is placed on the platform 104, utilize the thermal head 19 of adhering device 15 to carry out thermo-compressed, make it bonding.Like this, be wound on the adhesive material tape 1 on the winding off spindle 17, just be connected with the adhesive material tape 1 of being reeled on the new spool 3.Like this, because the base material 9 of only reeling on the winding off spindle 17, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, make operating efficiency higher.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) 9 that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape 1 of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, under low temperature (5 ℃～-10 ℃), take care of and outbound.

Next embodiments of the invention 2 are described, below main explanation and the foregoing description dissimilarity.

Among the embodiment 2 shown in Fig. 6, utilize the pilot tape 41 that is provided with in the top part 32 of adhesive material tape 1 of new adhesives volume 3, carry out the adhesive material tape 1 of new adhesives volume 3 and roll up being connected between the adhesive material tape 1 of being reeled on the 3a with the adhesives that uses.Pilot tape 41 is made of base material 45 43 of the caking agents inboard with it, and the top part 32 of the adhesive material tape 1 of new adhesives volume 3 utilizes pilot tape 41 to paste and be fixed on 9 of the base materials of the adhesive material tape 1 that is wound on the spool.Afterwards, peel off pilot tape 41, its 11 of caking agent with the terminal part 30 of the adhesive material tape 1 that has overturn is overlapped from 9 of base materials.The lap of the two is placed on the platform 104, utilize thermal head 19 thermo-compressed of adhering device 15, make it bonding.Like this, owing to utilize the pilot tape 41 of adhesive material tape 1, will roll out the terminal part 30 of the adhesive material tape 1 that finishes, couple together with the top part 32 of the adhesive material tape 1 of new installation, therefore, the connection between the adhesive material tape 1 is very simple.In addition, in this case, because the inboard set caking agent 43 mask toughness of the base material 45 of pilot tape 41, as long as its 11 overlaids of caking agent with the terminal part 30 of the adhesive material tape 1 that has reversed just can be connected, this method also is feasible.

The present invention is not limited to the foregoing description, can carry out various distortion in the scope that does not break away from purport of the present invention.

For example, in the foregoing description 2, the adhesive material tape 1 that can not overturn and be reeled on the end-of-use spool 3a, but as shown in Figure 7, the pilot tape 41 of the top part 32 of the adhesive material tape 1 newly installed is peeled off from 9 of base materials, stick on 11 of the inboard caking agents, pilot tape 41 is connected with caking agent 11 faces of the terminal part 30 of end-of-use adhesive material tape 1, carry out bonding thereby utilize the thermal head 19 of adhering device 15 to carry out thermo-compressed again.At this moment, do not roll out the adhesive material tape 1 that finishes, thereby can prevent from when being wound on adhesive material tape 1 on the winding off spindle, to take place the danger that volume collapses owing to do not need to reverse.

In addition, in this case, also the pilot tape 41 of the top part 32 of adhesive material tape 1 can be peeled off from 9 of base materials, and pilot tape 41 is mutually bonding with 9 of the base materials of end-of-use adhesive material tape 1.

Next, the invention to the 5th scheme～the 8th scheme describes.

These inventions relate to bonding and fixedly electronic devices and components and circuit card, or between the circuit card time, make and realize the adhesive material tape that is electrically connected between the two the electrode, relate in particular to the method for attachment of the adhesive material tape that is wound into the spool shape.

Next, the background technology to the invention of the 5th scheme～the 8th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle is rolled up with new adhesives be installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 5th scheme～the 8th scheme is to provide a kind of replacing that can carry out the adhesives volume simply, the method for attachment of the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, with reference to Fig. 8 A～Fig. 8 C, Fig. 3～Fig. 5, embodiments of the invention 1 are described.Fig. 8 A～Fig. 8 C is the synoptic diagram of the method for attachment of the adhesive material tape of expression embodiment 1, Fig. 8 A is the stereographic map of the connection between the expression adhesives volume, Fig. 8 B is the stereographic map of method of attachment of the connection portion of presentation graphs 8A, and Fig. 8 C is the vertical view of the connection portion of Fig. 8 A.

Adhesive material tape 1 is twisted in respectively on spool 3, the 3a, is provided with the side plate 7 of rolling up core 5 and being configured in the both sides of adhesive material tape 1 among each spool 3, the 3a.In the present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 5mm.

Adhesive material tape 1 is made of base material 9 and the caking agent 11 that is coated on the side of base material 9.

Base material 9 is handled PET formations such as (polyethylene terephthalates), but is not limited to this by OPP (extended polypropylene), tetrafluoroethylene, silicon from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Conducting particles 13 can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat the made conductive layer of material that constitutes above-mentioned conducting particles 13 and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles 13 obtains, and conducting particles 13 and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles 13 usefulness scolding tin are ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.As shown in Figure 3, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end that twists in the adhesive material tape 1 on the spool 3a is supportted on the guide reel 22 and be installed on the winding off spindle 17, extracts adhesive material tape 1 (arrow E among Fig. 3) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spool 3a, 17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of present embodiment adhesive material tape 1, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, and the adhesive material tape that twists on the spool 3a just is rolled on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Fig. 8 A) of the adhesive material tape 1 that twists on the spool 3a.

The method of attachment of adhesive material tape of the present invention has (a) and reaches (b) two kinds of situations.(a) situation is as using winding off spindle 17 in the past, and changed the residual adhesive tapes that a spot of volume is arranged of the adhesive material tape 1 that uses up, new adhesive tapes being connected on the winding off spindle 17; (b) situation is that the residual of adhesive material tape 1 that will use up has the adhesive tapes of a spot of volume to use as winding off spindle 17, has the adhesive tapes of a spot of volume to be connected with residual new adhesive tapes.

Under (b) situation, shown in Fig. 8 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of being reeled on the new adhesives volume 3 (with reference to Fig. 8 A).

The connection of this adhesive material tape 1, shown in Fig. 8 B and Fig. 8 C, for the terminal part 30 of the adhesive material tape 1 of adhesives volume 3a, the top part 32 with the adhesive material tape 1 of new adhesives volume 3 makes 9 11 of caking agents with top part 32 of base material of terminal part 30 overlapping.Afterwards, on lap, insert the fastening pin 46 roughly be the コ font,, couple together with the top part 32 of the adhesive material tape 1 of new adhesives volume 3 with the terminal part 30 of adhesive material tape 1.

Therefore, the adhesive material tape 1 of being reeled on the end-of-use spool 3a has been connected with the adhesive material tape 1 of being reeled on the new spool 3.Like this, owing to the top part 32 of the terminal part 30 that will extract end-of-use adhesive material tape 1 with fastening pin 46 out with the new adhesive material tape of installing 1 is fixed up, make that connection is very simple.

Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.Therefore, do not need new adhesive material tape 1 is installed to operation on the winding off spindle 17.

In (a) as using winding off spindle 17 in the past, there are the adhesive tapes of a spot of volume and new adhesive tapes to change the residual of adhesive material tape 1 that uses up, new adhesive tapes is connected under the situation on the winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, cut off near the terminal marking 28 with adhesive material tape 1, make the terminal part 30 of the adhesive material tape that remains in winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesives volume 3.Afterwards, on the lap of the two, insert the fastening pin 46 roughly be the コ font,, couple together with the top part 32 of the adhesive material tape 1 of new adhesives volume 3 with the terminal part 30 of adhesive material tape 1.

The base material 9 owing on winding off spindle 17, only reel, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, inventive embodiment 2～embodiment 4 to the 5th scheme～the 8th scheme describes, below among the illustrated embodiment by to putting on prosign with a part, thereby omit the detailed description of this part, below mainly to describing with the foregoing description 1 difference.

Among the embodiment 2 shown in Figure 9, use has the claw 48,49 of the end that is arranged on a side and the opposing party and the engagement device 47 of the elastic component 50 of the claw 48,49 that is connected two ends, and the terminal part 30 of a side the adhesive material tape 1 top part 32 with the opposing party's adhesive material tape 1 is coupled together.Detailed says, make a side adhesive material tape 1 terminal part 30 and the opposing party's adhesive material tape 1 top part 32 toward each other, the claw 48 that is arranged on engagement device 47 1 ends is stuck on the terminal part 30, the claw 49 that is arranged on the other end is stuck on the top part 32, and a side claw 48 is held with the opposing party's claw 49 usefulness elastic components 50.In addition, claw 48,49 is provided with the pawl 51 of point of a plurality of front ends in the inboard of board-like material.

Owing to will be arranged on claw 48 fastenings on the end of engagement device 47 on terminal part 30, with being arranged on claw 49 fastenings on the other end on top part 32 that the two is interconnection afterwards, therefore make to connect to be easy to.In addition, owing to be provided with elastic component 50 between a side claw 48 and the opposing party's the claw 49, therefore just can be on the optional position of the top part 32 of the opposing party's adhesive material tape 1, so the degree of freedom of connection is very high by tensile elasticity member 50 with the opposing party's of engagement device 47 claw 49 fastenings.

Among the embodiment 3 shown in Figure 10, terminal part 30 for the adhesive material tape 1 of being reeled on the end-of-use spool 3a, top part 32 with the adhesive material tape 1 of new adhesives volume 3, make 9 11 of caking agents of base material of terminal part 30 overlapping with top part 32, afterwards, the clip 53 that roughly is the elastically deformable of コ font with cross section is clamped and fixing lap.Owing to only lap is just clamped and can be connected, therefore connect operation and be very easy to by clip 53.

Among the embodiment 4 shown in Figure 11, the metal holding piece 55 that roughly is the コ font by cross section encases the lap among the embodiment 1, presses holding piece 55 from the two sides of lap the two is coupled together.Owing to connect by pressing holding piece 55, therefore can obtain firm connection at lap from the two sides of lap.

The invention of the 5th scheme～the 8th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 5th scheme～the 8th scheme.

For example, in the foregoing description 1, fastening pin 46 can not be a コ the font roughly but safety pin of 1 wire in this case, preferably uses fixedly lap of many safety pins.

Among the embodiment 2, engagement device 47 can use a plurality of corresponding to the width of adhesive material tape 1.

Among embodiment 3 and the embodiment 4, clip 53 or holding piece 55 can use a plurality of, and it is fixed from the both sides of the lap of adhesive material tape 1 respectively.

Next, the invention to the 9th scheme～the 13rd scheme describes.

These inventions relate to electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly are rolled into the method for attachment of the adhesive material tape of reel.

Next, the background technology to the invention of the 9th scheme～the 13rd scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle is rolled up with new adhesives be installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 9th scheme～the 13rd scheme is, a kind of replacing that can carry out the adhesives volume simply is provided, the method for attachment of the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 9th scheme～the 13rd scheme.At first, with reference to Figure 12 A, Figure 12 B, Fig. 3～Fig. 5 the inventive embodiment 1 of the 9th scheme～the 13rd scheme is described.Figure 12 A, Figure 12 B are the synoptic diagram of method of attachment of the adhesive material tape of expression embodiment 1, and Figure 12 A is the stereographic map of the connection between the expression adhesives volume, and Figure 12 B is the stereographic map of method of attachment of the connection portion of presentation graphs 12A.

Adhesive material tape 1 is twisted in respectively on spool 3, the 3a, is provided with the side plate 7 of rolling up core 5 and being configured in the both sides of adhesive material tape 1 among each spool 3, the 3a.In the present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 3mm.

Adhesive material tape 1 is made of base material 9 and the caking agent 11 that is coated on the side of base material 9.

Base material 9 is handled PET formations such as (polyethylene terephthalates), but is not limited to this by OPP (extended polypropylene), tetrafluoroethylene, silicon from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles 13 and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.As shown in Figure 3, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end that twists in the adhesive material tape 1 on the spool 3a is installed on the winding off spindle 17, extract adhesive material tape 1 (arrow E among Fig. 3) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spool 3a, 17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of present embodiment adhesive material tape 1, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, the adhesive material tape that twists on the spool 3a just is rolled on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Figure 12 A) of the adhesive material tape 1 that twists on the spool 3a.

The method of attachment of the adhesive material tape of the 9th scheme to the 13 schemes of the present invention has (a) and reaches (b) two kinds of situations.(a) situation is as using winding off spindle 17 in the past, and changed the residual adhesive tapes that a spot of volume is arranged of the adhesive material tape 1 that uses up, new adhesive tapes being connected on the winding off spindle 17; (b) situation is that the residual of adhesive material tape 1 that will use up has the adhesive tapes of a spot of volume to use as winding off spindle 17, has the adhesive tapes of a spot of volume to be connected with residual new adhesive tapes.

Under (b) situation, shown in Figure 12 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of being reeled on the new adhesives volume 3 (with reference to Figure 12 A).

The connection of this adhesive material tape 1, shown in Figure 12 B, for the terminal part 30 of the adhesive material tape 1 of adhesives volume 3a, the top part 32 with the adhesive material tape 1 of new adhesives volume 3 makes 9 11 of caking agents with top part 32 of base material of terminal part 30 overlapping.Make the two overlap length H be about 2.5 times of width W of adhesive tapes 1, be positioned on the platform 36, utilize thermal head 19 thermo-compressed of adhering device 15 to connect.Like this, the adhesive material tape 1 of being reeled on the end-of-use spool 3a just has been connected with the adhesive material tape 1 of being reeled on the new spool 3.Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.Therefore, do not need adhesive material tape is installed to operation on the winding off spindle 17.

In the present embodiment, owing to utilize thermal head 19, thereby do not need to use in addition the apparatus for pressure welding between the caking agent, just can change spool 3, the 3a of coiling adhesive material tape 1.

In (a) as using winding off spindle 17 in the past, there are the adhesive tapes of a spot of volume and new adhesive tapes to change the residual of adhesive material tape 1 that uses up, new adhesive tapes is connected under the situation on the winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, cut off near the terminal marking 28 with adhesive material tape 1, make the terminal part 30 of the adhesive material tape that remains in winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesives volume 3.Afterwards, the lap that utilizes thermal head 19 thermo-compressed of adhering device 15 to connect the two makes its connection.The base material 9 owing on winding off spindle 17, only reel, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, with reference to Fig. 5 the manufacture method of this adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 9th scheme～the 13rd scheme describe, in following illustrated embodiment,, omit the detailed description of this part by part same as the previously described embodiments is put on identical symbol, below mainly the difference with the foregoing description is described.

Among the embodiment 2 shown in Figure 13, by the mould 56 of a side that is in surperficial sawtooth (concavo-convex) 44 mutual interlocks and the mould 57 of opposite side, the lap 34 of clamping adhesive material tape 1 forms concavo-convex 58 on lap 34.Concavo-convex 58 by such formation, the bond area of lap 34 can be increased, and the intensity of draw direction (length direction of adhesive material tape) can be increased by concavo-convex 58 combination of lap 34.Form when concavo-convex, caking agent 11 flows, and by being bonded together between the end face of caking agent with lap, and then the intensity of the draw direction of lap 34 is increased.

Among the embodiment 3 shown in Figure 14 A and Figure 14 B, there is the top part 32 of the spool 3 of new adhesives 1 to be bent into roughly V font volume, the terminal part 30 of the adhesive material tape 1 of being reeled on the end-of-use spool 3a also is bent into roughly V font, thereby make the two hook-shaped and caking agent 11 is faced one another and block (Figure 14 A), utilize thermal head 19 thermo-compressed, the two is coupled together (Figure 14 B).Among this embodiment 3, couple together, when therefore connecting securely, connect owing to caking agent 11 overlaps each other, thereby can access more firm connection because terminal part 30 and top part 32 are hook-shaped.Same as described above, the caking agent of lap flows, and makes end face also be bonded together, and therefore can access more firm connection.

Among the embodiment 4 shown in Figure 15 A and Figure 15 B, before the thermo-compressed in carrying out embodiment 1 or in the thermo-compressed, stamp through hole 59 at lap 34.By stamping through hole 59,, therefore, can improve bonding force, thereby can obtain firm connection at lap 34 because caking agent 11 can ooze out around the through hole 59 they are bonded together when carrying out thermo-compressed.

The invention of the 9th scheme～the 13rd scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 9th scheme～the 13rd scheme.

For example, in the foregoing description 2, concavo-convex 58 can not be trilateral, but has the round of circular arc.

Among the embodiment 4, the number of through hole 59 is had no particular limits, several can.In addition also without limits to the diameter of through hole 59.In addition, in embodiment 2,3, also can on lap 34, form through hole 59.

Next, the invention to the 14th scheme～the 18th scheme describes.

These inventions relate to electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel.

Next, the background technology to the invention of the 14th scheme～the 18th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, draw the top part of adhesive material tape, be installed on the winding off spindle.After adhesives volume was installed, the base material side of the adhesive material tape that is rolled out from the adhesives volume was utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle and new adhesives volume are installed on the adhering device, and when the adhesive material tape support is on the guide reel of adhering device, its top are installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

On the other hand, even paste with adhesive tapes between adhesive material tape and the adhesive material tape, can not be bonding with enough bonding forces.This is because to have good separability between adhesive material tape and adhesives and be coated with on adhesive material tape due to the influence of parting agent of the parting agent of fluorine class and silicon class in order to make.

Therefore, the purpose of the invention of the 14th scheme～the 18th scheme is to provide a kind of method of attachment of adhesive material tape, particularly the base material at adhesive material tape uses under the situation of the base material of being handled by silicon, also can carry out the replacing of adhesives volume simply, realize the raising of the production efficiency of e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 14th scheme～the 18th scheme.At first, with reference to Figure 16 A, 16B, Fig. 3～Fig. 5 the inventive embodiment 1 of the 14th scheme～the 18th scheme is described.Figure 16 A and Figure 16 B are the synoptic diagram of method of attachment of the adhesive material tape of expression embodiment 1, and Figure 16 A is the stereographic map of the connection between the expression adhesives volume, and Figure 16 B is the stereographic map of method of attachment of the connection portion (b) of presentation graphs 16A.

Adhesive material tape 1 is twisted in respectively on spool 3, the 3a, and each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.

Adhesive material tape 1 is handled base material 9 and is coated on the caking agent 11 that silicon handles on the side of base material 9 and constitutes by silicon.

Silicon is handled base material 9, from intensity and constitute the separability aspect of the caking agent of anisotropic conductive material, use OPP (extended polypropylene), tetrafluoroethylene, PET base materials such as (polyethylene terephthalates), utilize silicone resin etc. to carry out surface treatment on its surface.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles 13 and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape of present embodiment describes.As shown in Figure 3, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end that twists in the adhesive material tape 1 on the spool 3a is installed on the winding off spindle 17, extract adhesive material tape 1 (arrow E among Fig. 3) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21,, handles base material 9 side pressures from silicon and connect adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 by being arranged on the thermal head 19 between two spool 3a, 17.Afterwards, silicon being handled base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of present embodiment adhesive material tape 1, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, the adhesive material tape that twists on the spool 3a just is rolled on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Figure 16 A) of the adhesive material tape 1 that twists on the spool 3a.

The method of attachment of the adhesive material tape of the invention of the 14th scheme～the 18th scheme has (a) and reaches (b) two kinds of situations.(a) situation is as using winding off spindle 17 in the past, and changed the residual adhesive tapes that a spot of volume is arranged of the adhesive material tape 1 that uses up, new adhesive tapes being connected on the winding off spindle 17; (b) situation is that the residual of adhesive material tape 1 that will use up has the adhesive tapes of a spot of volume to use as winding off spindle 17, has the adhesive tapes of a spot of volume to be connected with residual new adhesive tapes.

Under (b) situation, shown in Figure 16 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of being reeled on the new adhesives volume 3.

The connection of this adhesive material tape 1, shown in Figure 16 B, adhesives is rolled up the terminal part 30 of the adhesive material tape 1 of 3a, with the top part 32 of the adhesive material tape 1 of new adhesives volume 3 toward each other, handle the surface of base material 9,9 across the silicon of two adhesive material tapes 1,1 and paste upward silicon splicing tape 60, two adhesive material tapes 1,1 are coupled together.

This silicon splicing tape 60 is made of base material 63 and the silicon caking agent 62 that is coated with on the single face of base material 63.There is no particular limitation to the material of base material 63, in the present embodiment, is the polyimide resin material.In addition, among Figure 16 B, the caking agent 11 of adhesive material tape is represented with oblique line respectively with the caking agent part 43 of silicon splicing tape 60.

Here, to describing by the bonding of silicon splicing tape 60.The silicon of one side and the opposing party's adhesive material tape 1,1 is handled on the base material 9,9 and is coated with silicon respectively, therefore utilizes caking agent bonding very difficult; But in the present embodiment, by in the caking agent 43 of silicon splicing tape 60, adopting silicone resin, the capillary difference that itself and two silicon are handled between the base material 9,9 is less, by making its driving fit (bonding) terminal part 30 of a side the adhesive material tape 1 top part 32 with the opposing party's adhesive material tape 1 is coupled together well.The surface tension difference that the surface of the silicon caking agent 62 in the silicon splicing tape 60 and silicon are handled between base material 9,9 surfaces is preferably in below the 10mN/m (10dyne/cm), and in the present embodiment, the surface tension difference does not almost have.

In general, the terminal part 30 of one side's adhesive material tape 1 is 25mN/m～60mN/m (25～60dyne/cm) with the surface tension that two silicon of the opposing party's adhesive material tape 1 are handled base material 9,9, for example, surface tension is under the situation of 30mN/m, the surface tension of the silicon caking agent 62 of silicon splicing tape 60 is set at more than the 20mN/m, below the 40mN/m.

Silicon class caking agent mainly is made of silicon rubber and silicone resin, make the two that condensation reaction take place slightly and show cementability, in addition, generally crosslinked by the hydrosilylation reactions generation that utilizes superoxide, platinum catalyzer, make the glass tansition temperature for below-100 ℃.These silicon class caking agents are existing commercially available, can be advantageously applied to this.

Like this, use silicon splicing tape 60,, roll up the adhesive material tape 1 of being reeled on 3 with new adhesives and couple together the adhesive material tape 1 of being reeled on the end-of-use adhesives volume 3a.Next, change end-of-use adhesives volume 3a and new adhesives volume 3, new adhesives volume 3 is installed on the adhering device 15.Therefore, owing to do not need the adhesive material tape 1 of new adhesives volume 3 is extracted out, adhesive material tape is installed on the winding off spindle 17, and with the guiding 36 first-class operations of adhesive material tape 1 support at adhering device 15, so the replacing operating efficiency of adhesives volume 3,3a is fine.Like this, owing to extract the terminal part 30 of the adhesive material tape 1 be over, utilize the silicon splicing tape to be connected with the top part 32 of the adhesive material tape 1 of new installation, therefore connection is very simple.

Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.Therefore, do not need adhesive material tape 1 is installed to operation on the winding off spindle 17.

In (a) as using winding off spindle 17 in the past, there are the adhesive tapes of a spot of volume and new adhesive tapes to change the residual of adhesive material tape 1 that uses up, new adhesive tapes is connected under the situation on the winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, cut off near the terminal marking 28 with adhesive material tape 1, make the terminal part 30 of the adhesive material tape that remains in winding off spindle 17 sides, with the top part 32 of the adhesive material tape 1 of new adhesives volume 3 toward each other.Afterwards, utilize the terminal part 30 of silicon splicing tape, be connected the two the place of part toward each other with the top part 32 of the adhesive material tape 1 of new adhesives volume 3 with adhesive material tape 1.The base material 9 owing on winding off spindle 17, only reel, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, with reference to Fig. 5 the manufacture method of this adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 14th scheme～the 18th scheme describe, in following illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly the difference with the foregoing description is described.

Among the embodiment 2 shown in Figure 17, be that the terminal part 30 of the adhesive material tape 1 of the side in the foregoing description 1 has also been pasted silicon splicing tape 60 with 11 sides of caking agent of the top part 32 of the opposing party's adhesive material tape.The silicon caking agent 62 of the silicon splicing tape 60 of this embodiment 2, its bonding force are more than the 100g/25mm, in the present embodiment, are 700g/25mm～1400g/25mm.In addition, the surface tension of the caking agent 62 of silicon splicing tape 60, the same with the foregoing description, the difference between the surface tension of the silicon substrate of a side and the opposing party's adhesive material tape is set at below the 10mN/m (10dyne/cm).In the present embodiment 2, because on the two sides of the terminal part 30 of a side adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape, undertaken by silicon splicing tape 60 bonding, therefore can be two adhesive material tapes 1,1 be bonded together than embodiment 1 higher intensity.

Among the embodiment 3 shown in Figure 180, top part 32 overlay configuration with terminal part 30 with the opposing party's the adhesive material tape of a side adhesive material tape 1, handle base material 9 sides and adhesives 11 sides at this silicon, paste the silicon splicing tape 60 of embodiment 2, if adopt this embodiment 3, can play the action effect identical with embodiment 2.

Among the embodiment 4 shown in Figure 19, between the top part 32 of the terminal part 30 of a side adhesive material tape 1 and the opposing party's adhesive material tape, all be coated with the silicon splicing tape 61 of silicon caking agent 62 by the two sides of base material, terminal part 30 and top part 32 are coupled together.If adopt this embodiment 4, by using two-sided silicon splicing tape 61, can allow between a side the top part 32 of terminal part 30 and the opposing party's adhesive material tape of adhesive material tape 1 be connected simple more and easy.

Next, the invention to the 19th scheme～the 21st scheme describes.

These inventions relate to electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel.

Next, the background technology to the invention of the 19th scheme～the 21st scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle is rolled up with new adhesives be installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 19th scheme～the 21st scheme is to provide a kind of replacing that can carry out the adhesives volume simply, the method for attachment of the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, the invention to the 19th scheme～the 21st scheme describes with reference to accompanying drawing.At first, with reference to Figure 20 A～Figure 20 C, Figure 21, Fig. 4 and Fig. 5, the inventive embodiment 1 of the 19th scheme～the 21st scheme is described.Figure 20 A～Figure 20 C is the synoptic diagram of method of attachment of the adhesive material tape of expression present embodiment, and Figure 20 A is the stereographic map of the connection between the expression adhesives volume, and Figure 20 B and Figure 20 C are the sectional view of method of attachment of the connection portion of presentation graphs 20A.

Adhesive material tape 1 is twisted in respectively on spool 3, the 3a, is provided with the side plate 7 of rolling up core 5 and being configured in the both sides of adhesive material tape 1 among each spool 3, the 3a.

Adhesive material tape 1 is made of base material 9 and the caking agent 11 that is coated on the side of base material 9.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.As shown in figure 21, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end that twists in the adhesive material tape 1 on the spool 3a is supportted on the guide reel 22 and be installed on the winding off spindle 17, extracts adhesive material tape 1 (arrow E among Fig. 3) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spool 3a, 17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of present embodiment adhesive material tape 1, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, the adhesive material tape that twists on the spool 3a just is rolled on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Figure 20 A) of the adhesive material tape 1 that twists on the spool 3a.

The method of attachment of the adhesive material tape of the invention of the 19th scheme～the 21st scheme has (a) and reaches (b) two kinds of situations.(a) situation is as using winding off spindle 17 in the past, and changed the residual adhesive tapes that a spot of volume is arranged of the adhesive material tape 1 that uses up, new adhesive tapes being connected on the winding off spindle 17; (b) situation is that the residual of adhesive material tape 1 that will use up has the adhesive tapes of a spot of volume to use as winding off spindle 17, has the adhesive tapes of a spot of volume to be connected with residual new adhesive tapes.

Under (b) situation, shown in Figure 20 A, when on the adhesive material tape 1 of spool 3a, having exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, use the terminal part 30 of resin system caking agent 64 adhesive material tapes with spool 3a (side's adhesive material tape) 1, the top part 32 of rolling up the adhesive material tape (the opposing party's adhesive material tape) 1 of being reeled on 3 with new adhesives is connected.

As resin system caking agent 64, for example can enumerate, Resins, epoxy, cyanate ester resin, bimaleimide resin, resol,, urea resin, melamine resin, Synolac, acrylic resin, unsaturated polyester resin, diallyl phthalate ester resin, silicone resin, resorcinol formaldehyde resin, xylene resin, furane resin, polyurethane resin, ketone resin, triallyl cyanurate resin or the like.

The connection of this adhesive material tape 1, shown in Figure 20 B, for the terminal part 30 of the adhesive material tape 1 of adhesives volume 3a, the top part 32 with the adhesive material tape 1 of new adhesives volume 3 makes 9 11 of caking agents with top part 32 of base material of terminal part 30 overlapping.Afterwards, from the tucker 65 that is assembled on the adhering device 15 the resin system caking agent 64 of pasty state is coated on the lap.Afterwards, shown in Figure 20 C, by being assembled in the heating of the well heater 66 in the adhering device 15, at resin system caking agent 64 is under the situation of thermosetting resin, by making its sclerosis the terminal part 30 of the adhesive material tape 1 top part 32 with the adhesive material tape 1 of new adhesives volume 3 is coupled together.

Therefore, the adhesive material tape 1 of being reeled on the end-of-use spool 3a has been connected with the adhesive material tape 1 of being reeled on the new spool 3.Like this, owing to the top part 32 of the terminal part 30 that will extract end-of-use adhesive material tape 1 with resin system caking agent 64 out with the new adhesive material tape of installing 1 is fixed up, connect very simple.

Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.Therefore, do not need new adhesive material tape 1 is installed to operation on the winding off spindle 17.

In (a) as using winding off spindle 17 in the past, there are the adhesive tapes of a spot of volume and new adhesive tapes to change the residual of adhesive material tape 1 that uses up, new adhesive tapes is connected under the situation on the winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, cut off near the terminal marking 28 with adhesive material tape 1, make the terminal part 30 of the adhesive material tape that remains in winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesives volume 3.Afterwards, the resin system caking agent 64 of pasty state is coated on the lap of the two, kind according to employed resin system caking agent heats, uviolizing etc., make it can bring into play bonding force, the terminal part 30 top part 32 with the adhesive material tape 1 of new adhesives volume 3 is coupled together.The base material 9 owing to only reel on the winding off spindle 17, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape 1 of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, under low temperature (5 ℃～-10 ℃), take care of and outbound.

The invention of the 19th scheme～the 21st scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 19th scheme～the 21st scheme.

In the present embodiment, be example with the thermosetting resin, but also can use ray hardening resin to replace thermosetting resin that the rayed by ultraviolet ray etc. makes the ray hardening resin sclerosis, carries out the connection between the adhesive material tape 1 as resin system caking agent 64.

In this case, as ray hardening resin, can use the Resins, epoxy that contains the photo-hardening agent, these photo-hardening agent are compositions of being furnished with photo-induced polymerization initiator in having acrylate-based or methacrylate based resin, reach aromatic series diazonium salt, 2 aryl salts, sulfonium salt etc.

In addition, as resin system caking agent, can use the heatmeltable adhesives of main component as cyclopropyl acetoacetic ester resin and polyolefin resin, for example under the situation of using laminar heatmeltable adhesives, in the part that adhesive material tape 1 overlaps each other, laminar heatmeltable caking agent on the volume, with 66 pairs of heatmeltable caking agents of well heater heat make its fusing after, by cooling the heatmeltable caking agent is solidified, thus adhesive material tape 1 is interconnection.

The resin system caking agent that is used for the connection of adhesive material tape 1 can use select multiple from thermosetting resin, ray hardening resin, heatmeltable caking agent group.

In the above embodiments, though 9 of the base materials of the terminal part 30 of the adhesive material tape 1 by making adhesives volume 3a, overlap with 11 of the caking agents of the top part 32 of the adhesive material tape 1 of new adhesives volume 3, coating connects as the thermosetting resin of resin system caking agent, but the terminal part 30 of the adhesive material tape 1 of the adhesives that also can overturn volume 3a, caking agent 11 faces are overlapped each other and with the two bonding after, fix by thermosetting resin again.

Next, the invention to the 22nd scheme～the 24th scheme describes.

These inventions relate to electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly are rolled into the adhesive material-tape reel and the adhering device of reel.

Next, the background technology to the invention of the 22nd scheme～the 24th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, there is the adhesive material-tape reel of adhesive material tape to be installed on the adhering device volume on the spool, draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, from the base material side of the adhesive material tape that adhesive material-tape reel rolled out, utilize thermal head that caking agent is crimped onto on circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of a side adhesive material-tape reel uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle and new adhesive material-tape reel are installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material-tape reel increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 22nd scheme～the 24th scheme is to provide a kind of can carry out the replacing of adhesive material-tape reel simply, the adhesive material-tape reel and the adhering device of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 22nd scheme～the 24th scheme.At first, with reference to Figure 22 A～Figure 22 C, Figure 23, Fig. 4 and Fig. 5, the inventive embodiment 1 of the 22nd scheme～the 24th scheme is described.Figure 22 A～Figure 22 C is the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 22 A is the stereographic map of expression adhesive material-tape reel, Figure 22 B is the front view of Figure 22 A, and Figure 22 C is the vertical view of the connecting band of Figure 22 A, and Figure 23 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Shown in Figure 22 A, the adhesive material-tape reel A of present embodiment has winding part (below be called coiling portion) 2, the 2a of a plurality of adhesive material tapes, among winding part 2, the 2a, is wound with adhesive material tape 1 on spool 3, the 3a respectively.Each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 23, adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Among a plurality of winding parts 2, the 2a, the terminal part 30 of the adhesive material tape of being reeled on one side's the winding part 2 (below be called a side adhesive material tape) 1, and between the top part 32 of the adhesive material tape of being reeled on the opposing party's the winding part (below be called the opposing party adhesive material tape) 1, be provided with the connecting band 67 that connects the two.Connecting band 67, the medial surface configuration from the terminal part 30 of a side adhesive material tape 1 along the side plate 7 of spool 3, and be stuck in the formed notch part 58 in top of side plate 7 and be connected with the top part 32 of the opposing party's adhesive material tape 1.

In addition, in one side and the opposing party's adhesive material tape 1 and the part that connecting band 67 is connected, be provided with the mark 69,70 that to discern connecting band 67, when detecting mark 69,70 with belt proofing unit (luminescent part 71, light-receiving part 72), skip connecting band 67 parts, do not carry out crimping in connecting band 67 parts.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding material that is connected of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material-tape reel A of present embodiment describes.As shown in figure 23, adhesive material-tape reel A and winding off spindle 17 are installed on the adhering device 15, on the guide reel 22 and be installed on the winding off spindle 17, extract top part 32 supports of a side adhesive material tape 1 out adhesive material tape 1 (arrow E among Figure 23).Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spools 3,17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect as shown in Figure 4 in fact, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Use the PDP of the adhesive material tape 1 of present embodiment, its size is bigger, will carry out crimping to the entire circumference of PDP sometimes, and the connection portion is a lot, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3 also becomes many, and the adhesive material tape that twists on the spool 3 just is rolled on the winding off spindle 17 for 1 within a short period of time.

One side's adhesive material tape 1 takes out connecting band 67 after extracting out and having used up from notch part 68, next carry out the extraction of the opposing party's adhesive material tape 1.In the present embodiment, owing between the top part 32 of the terminal part 30 of a side adhesive material tape 1 and the opposing party's adhesive material tape 1, have the connecting band 67 that is connected both, thereby, can then begin to extract out the opposing party's adhesive material tape 1 in case a side adhesive material tape 1 is extracted out when having used up.Therefore, when a side adhesive material tape 1 extract out used up after, do not need new adhesive material tape 1 is installed to operation on the winding off spindle 17, improved the production efficiency of e-machine.

In addition, adhering device 15 has a pair of luminescent part 71 and light-receiving part 72 as shown in figure 23, and connecting band 67 is carried out optical detection.Be provided with the mark 69,70 of black at the two the two ends of connecting band 67 of the adhesive material tape 1 that connects a side and the opposing party's adhesive material tape 1.Luminescent part 71 to adhesive material tape 1 emission laser, receives its reflected light by light-receiving part 72 continuously, and this detection signal is sent to control device 79.Like this, the reflected light of the mark 69,70 at the two ends of light-receiving part 72 reception connecting bands 67 sends to control device 79 with this detection signal.

Received the control device 79 of detection signal, the motor output control signal to two spools 3,17 that drive adhering device 15 begins to export driving pulse by motor driver to motor.Afterwards, motor is corresponding to from the rotation of umber of pulse that motor driver applied, and two spools 3,17 are moved with the speed that exceeds common speed, makes adhesive material tape 1 move distance corresponding to the length of connecting band 67 to rolling out direction simultaneously.

Like this, because the opposing party's adhesive material tape 1 is retracted to the position of thermal head 19 automatically, therefore, before the top part 32 of the opposing party's adhesive material tape 1 arrives the position of thermal heads 19, can both save the time of extracting connecting band 67 out.

In addition, because the base material 9 of only reeling on the winding off spindle 17, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 22nd scheme～the 24th scheme describe, in following illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the embodiment 2 shown in Figure 24, do forr a short time, so that identification connecting band 67 than the width W of the adhesive material tape 1 of front and back by width T with connecting band 67.In addition, in the adhering device 15, luminescent part and the light-receiving part identical with embodiment 1 are set clipping on the position of facing mutually of adhesive material tape 1.In this case, receive the laser that sees through from the width narrower part of connecting band 67, connecting band 67 is discerned by light-receiving part.

Among the embodiment 3 shown in Figure 25, discern connecting band 67 by on connecting band 67, forming a plurality of holes 53.In this case, also receive the laser that sees through from the hole 53 of connecting band 67, connecting band 67 is discerned by light-receiving part.

Among the embodiment 4 shown in Figure 26, the not connection of being undertaken between the adhesive material tape 1 by connecting band 67, but when a side adhesive material tape 1 extract out used up after, the opposing party's adhesive material tape 1 is wound up on the winding off spindle 17, carry out the replacing of adhesive material tape 1.In this case too,, therefore, can reduce the replacing operation of new adhesive material-tape reel, improve the production efficiency of e-machine owing to do not need new adhesive material-tape reel is installed on the adhering device.

The invention of the 22nd scheme～the 24th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 22nd scheme～the 24th scheme.

For example, among the foregoing description 1 and the embodiment 2, to the not special restriction of winding part 2,2a, be several can.

Among the embodiment 1 to embodiment 3, though connecting band 67 is carried out optical detection, also can roll up in this connecting band 67 has tape, with Magnetic Sensor it is detected.

Next, the invention to the 25th scheme～the 28th scheme describes.

These inventions relate to a kind of with electron device and circuit card, or when crimping is fixed up between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two.In addition, also relate to fixing tube core at lead frame, semiconductor element mounting with support substrate and lead frame with support substrate on, employed adhesive material tape in the semiconducter device bonding and fixedly semiconductor element (chip), particularly a kind of method of attachment that is rolled into adhesive material-tape reel, adhering device and the adhesive material tape of reel.

Next, the background technology to the invention of the 25th scheme～the 28th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.In addition, adhesive material tape is used for the bonding film of lead-in wire fixing strip, LOC band, chips incorporate band, little BGACSP of lead frame etc., is used to improve productivity, the reliability of semiconducter device integral body.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with adhesives on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, there is the adhesive material-tape reel of adhesive material tape to be installed on the adhering device volume on the spool, pull out the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that rolls out from adhesive material-tape reel is utilized thermal head that caking agent is crimped onto on circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, after the adhesive material tape of a side adhesive material-tape reel uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle and new adhesive material-tape reel are installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material-tape reel increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 25th scheme～the 28th scheme is to provide a kind of can carry out the replacing of adhesive material-tape reel simply, adhesive material-tape reel, adhering device and the method for attachment of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 25th scheme～the 28th scheme.At first, with reference to Figure 27 A～Figure 27 C, Figure 28, Fig. 4, Figure 29 and Fig. 5 the inventive embodiment 1 of the 25th scheme～the 28th scheme is described.Figure 27 A～27C is the stereographic map of expression adhesive material-tape reel for the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 27 A, and Figure 27 B is the front view of Figure 27 A, and Figure 27 C is the sectional view of the connection portion of Figure 27 A.Figure 28 is the synoptic diagram of the crimping process of the caking agent of expression adhering device, and Figure 29 is the stereographic map of the user mode of the caking agent of expression PDP.

The adhesive material-tape reel A of present embodiment has winding part (below be called coiling portion) 2, the 2a of a plurality of adhesive material tapes, has the spool 3, the 3a that are wound with adhesive material tape 1 on winding part 2, the 2a.Each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 28, adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Among a plurality of winding parts 2, the 2a, the terminal part 30 of the adhesive material tape of being reeled on one side's the winding part 2 (below be called a side adhesive material tape) 1, and between the top part 32 of the adhesive material tape of being reeled on the opposing party's the winding part 2a (below be called the opposing party adhesive material tape) 1, use fastener 76 to couple together.Fastener 76 for example is roughly the fastening pin of コ font for the cross section, make a side the terminal part 30 of adhesive material tape 1 overlapping with the top part 32 of the opposing party's adhesive material tape 1, inserts fastening pin at this lap both are coupled together.

In addition, in the present embodiment, connection portion 74 is shown in Figure 27 C, after by fastener 76 terminal part 30 and top part 32 being coupled together, by with connection portion 74 at the length direction of belt 180 degree that turn back, thereby with adhesive material tape 1 fastener 76 is covered.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material-tape reel of present embodiment describes.As shown in figure 28, adhesive material-tape reel A and winding off spindle 17 are installed on the adhering device 15, on the guide reel 22 and be installed on the winding off spindle 17, extract top part 32 supports of a side adhesive material tape 1 out adhesive material tape 1 (arrow E among Figure 28).Afterwards, adhesive material tape 1 is configured on the circuit card 21,, connects adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures by being arranged on the thermal head 19 between two spools 3,17.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21,, utilizes thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21 through polytetrafluoroethylmaterial material 24 as cushioning material.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

The connection portion of the PDP26 of the adhesive material tape 1 of use present embodiment as shown in figure 29 as can be known, caking agent 11 carries out crimping in the entire circumference of PDP, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, it is many that the usage quantity of adhesive material tape 1 also becomes, and the adhesive material tape that twists on spool 3, the 3a just is rolled onto on the winding off spindle 17 for 1 within a short period of time.

In the present embodiment, after a side adhesive material tape 1 extraction has been used up, connection portion 74 is taken out from notch part 75, next the opposing party's adhesive material tape 1 is extracted out (Figure 27 B).In the present embodiment, because the terminal part 30 of a side adhesive material tape 1 is connected with the top part 32 usefulness fasteners 76 of the opposing party's adhesive material tape 1, therefore, in case a side adhesive material tape 1 extract out use up after, can then begin to extract out the opposing party's adhesive material tape 1.Therefore, when a side adhesive material tape 1 extract out use up after, do not need new adhesive material tape 1 is installed to operation on the winding off spindle 17, improved the production efficiency of e-machine.In addition, in the connection portion 74, owing to fastener 76 is covered by adhesive material tape 1, so outward appearance is preferable, simultaneously, can prevent that the fastener 76 of connection portion 74 from contacting with adhesive material tape 1, damage adhesive material tape 1.

In addition, adhering device 15 has the thickness detecting sensor as connection section detecting sensor 47 as shown in figure 28, and optical detection is carried out in connection portion 74, makes connection portion 74 skip the part of thermal head 19.One side's the adhesive material tape 1 and the connection portion 74 of the opposing party's adhesive material tape 1 shown in Figure 27 C, are compared greatly with the thickness of adhesive material tape 1, by the difference of detection thickness, thus identification connection portion 74.Thickness detecting sensor 47, often the thickness to adhesive material tape 1 detects, and this detection signal is sent to control device 79.

Received the control device 79 of detection signal, the motor output control signal to two spools 3,17 that drive adhering device 15 begins to export driving pulse by motor driver to motor.Afterwards, motor is corresponding to the umber of pulse rotation by motor driver applied, make two spools 3,17 to exceed the speed rotation of common speed, make adhesive material tape 1 move the corresponding set a distance of giving of length with the delivery direction of connection portion 74 simultaneously to rolling out direction.

Like this, because the opposing party's adhesive material tape 1 is sent to the position of thermal head 19, therefore, the connection portion 74 that can prevent a side and the opposing party's adhesive material tape 1 arrives the position of thermal heads 19 and implements the fault of crimping action and so on.In addition, by before the thermal head 19, owing to automatically a side adhesive material tape 1 is wound up on the winding off spindle 17, thereby can save the coiling time up to connection portion 74.

In addition, utilize thickness detecting sensor 47, can discern the leading section 74a and the rearward end 74b of connection portion 74,, thereby can effectively utilize adhesive material tape 1 if only allow connection portion 74 skip.

In addition, because the base material 9 of only reeling on the winding off spindle 17, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, and operating efficiency is higher.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 25th scheme～the 28th scheme describe, below among the illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the embodiment 2 shown in Figure 30, do not use adhesive material-tape reel A, and use adhesive material-tape reel 2c with 1 winding part with a plurality of winding parts 2,2a.In this case, when adhesive material tape 1 is wound up on the winding off spindle 17, when having exposed terminal marking 28 on one side's the adhesive material tape 1, for a side adhesive material-tape reel 2b and new adhesive material-tape reel 2c are changed, the terminal part 30 of a side the adhesive material tape 1 top part 32 with the opposing party's adhesive material tape 1 is coupled together.

In this case, also can detect connection portion 74, connection portion 74 is skipped from the part of thermal head 19 by thickness detecting sensor 77 as the connection section proofing unit.

The invention of the 25th scheme～the 28th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 25th scheme～the 28th scheme.

For example, among the foregoing description 1 and the embodiment 2, the interconnection fastener 76 of adhesive material tape 1 will be connect, be not limited to the fastening pin, can also adopt the clip that is roughly the elastically deformable of コ font with cross section, the lap of the two is clamped be fixed up, perhaps the tinsel that is roughly the コ font with cross section is clamped the lap of the two, from the two sides compression clamping sheet of lap, with methods such as the two couple together.

Among embodiment 1 and the embodiment 2, detect the thickness of connection portion 74 by used thickness detecting sensor 47, connection portion 74 is discerned, but be not limited to this, can also use transmitance detecting sensor identification connection portion 74, perhaps use the CCD photographic camera, the surface of connection portion is absorbed in the monitor picture, by comparing the deep or light of pixel, detect the connection portion.

Among Figure 31 A, Figure 31 B, Figure 32 A～Figure 32 C, represented lead frame fixing with support substrate, semiconductor element mounting with in the tube core of support substrate or lead frame and the adhesive material tape that semiconductor element is connected, lead frame fixing is bonding and be fixed to an example of LOC (the Lead on Chip) structure on the lead frame with support substrate and semiconductor element.

Use the carrying out of thick 50 μ m the two sides of supporting film 78 of surface-treated polyimide film etc., add the adhesive material tape of formation of this Figure 31 A of bond layer 80 of the polyamide-based bond layer etc. of thick 25 μ m, obtain the semiconducter device of the LOC structure shown in Figure 31 B.Use the press tool 87 (punch (protuberance) 95, die (recess) 96) of the adhering device shown in Figure 32 A～Figure 32 C, adhesive material tape shown in Figure 31 A is struck out rectangle, for example, on the lead frame that the iron nickel alloy of thick 0.2mm is made, lift-launch is spaced apart 0.2mm, wide is the internal lead of 0.2mm, and crimping was carried out in pressurization in 3 seconds under the pressure of 400 ℃ and 3MPa, made the lead frame that has adhesive film for semiconductor.Next, by other operations, have on the caking agent aspect of lead frame of adhesive film for semiconductor at this, under the pressure of 350 ℃ temperature and 3MPa, crimping is carried out in semiconductor element pressurization, afterwards, lead frame and semiconductor element wire-bonded are got up, use packaged materials such as epoxy resin molding material with metal wire, encapsulate by transfer moudling, obtain the semiconducter device shown in Figure 31 B.Among Figure 31 A, Figure 31 B, 81 is the adhesive film for semiconductor that is stamped to form by adhesive material tape, and 82 is semiconductor element, and 83 is lead frame, and 84 is packaged material, and 85 is bonding wire, and 86 is bus.Figure 32 A, Figure 32 B, Figure 32 C are adhering device, among Figure 32 A, Figure 32 B, 87 roll out roller for adhesive material tape for adhesive material tape (adhesive film for semiconductor), 93 for adhesive material-tape reel (adhesive material tape rolls out portion), 92 for heater block, 91 for adhesive tapes punching press paste section, 90 for lead frame transport unit, 89 for press tool, 88.In addition, among Figure 32 C, 94 is that adhesive material tape (adhesive film for semiconductor), 95 is that punch (protuberance), 96 is that die (recess), 97 is pressuring diaphragm.Adhesive material tape 92, rolled out continuously from adhesive material-tape reel (adhesive material tape rolls out portion) 91, strike out rectangle by adhesive material tape punching press paste section 89, mutually bonding with the leading part of lead frame, be transmitted out from the lead frame transport unit as the lead frame that has adhesive film for semiconductor.The adhesive material tape that is stamped to form rolls out roller 93 from adhesive material tape and sends out.

Same as described above, use adhesive material tape that semiconductor element is connected on the semiconductor element mounting substrate.In addition, same tube core with lead frame is connected with semiconductor element and is bonded together.Adhesives has following two kinds of situations: just being used for bonding and the fixed occasion, by the contact between the electrode, perhaps use the caking agent that is electrically connected through electroconductive particle according to purpose; Use the occasion of supporting film, only constitute by caking agent.

Next, the invention to the 29th scheme～the 34th scheme describes.

These inventions relate to electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive tapes that is electrically connected between the electrode of the two, the particularly a kind of adhesive tapes of reel, the manufacture method of adhesive tapes and compression bonding method of adhesive tapes of being rolled into.

Next, the background technology to the invention of the 29th scheme～the 34th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive tapes.

In TOHKEMY 2001-284005 communique, the content that the adhesive tapes that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive tapes before this, its width is about 1～3mm, and the length that twists in the belt on the spool is about 50m, and adhesive tapes rolled out and after being crimped onto caking agent on the circuit card, does not just re-use from the spool last time.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, because therefore the spool spended time that more renews exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive tapes on the spool, thereby increases the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but,, collapse if the number of turns increases just might occur rolling up because the bandwidth of adhesive tapes is narrow in 1～3mm.In addition, if the number of turns increases, the pressure that acts on the adhesive film that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive tapes, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 29th scheme～the 34th scheme is to provide a kind of number of turns that does not increase adhesive tapes just can increase the adhesive tapes of bonding dosage, the manufacture method of adhesive tapes and the compression bonding method of adhesive tapes.

Next, describe with reference to the inventive embodiment of accompanying drawing the 29th scheme～the 34th scheme.At first, with reference to Figure 33 A, Figure 33 B, Figure 34, Fig. 3, Fig. 4, Fig. 5 and Figure 35 the inventive embodiment 1 of the 29th scheme～the 34th scheme is described.Figure 33 A and Figure 33 B are the synoptic diagram of adhesive tapes, and Figure 33 A is for rolling up the stereographic map of the spool that adhesive tapes is arranged, and Figure 33 B is the A-A line sectional view of Figure 33 A.Figure 34 is the stereographic map of the user mode of the caking agent of expression PDP.Figure 35 is the sectional view that is illustrated in the operation of coating adhesive on the base material.

The adhesive tapes 1 of present embodiment is twisted on the spool 3, is provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive tapes 1 on spool 3.In the present embodiment, the length of adhesive tapes 1 is about 50m, and width W is about 10mm.

Adhesive tapes 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9, the caking agent 11 that to be spaced 5 every width on the base material 9 be 0.5mm.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive tapes of present embodiment describes.The spool 3 and the empty winding off spindle 17 of adhesive tapes are installed on the adhering device 15, the front end that twists in the adhesive tapes 1 of spool 3 is installed on the empty winding off spindle 17 (arrow E among the figure).Afterwards, adhesive tapes 1 is configured on the circuit card 21,, connects adhesive tapes 1, the caking agent 11 of 1 amount is crimped onto on the circuit card from base material 9 side pressures by being arranged on the thermal head 19 between two spools 3,17.Afterwards, base material 9 is rolled onto on the empty winding off spindle 17 with remaining caking agent 11.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Reality connects exactly wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, and in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

As shown in figure 34, use the connection portion of PDP26 of the adhesive tapes 1 of present embodiment, carry out crimping in the entire circumference of PDP, nonrecoverable caking agent 11 amounts with compared in the past very many.Therefore, the usage quantity that twists in the adhesive tapes 1 on the spool 3 also becomes many, and the adhesive tapes that twists on the spool 3 just is rolled on the empty winding off spindle 17 for 1 within a short period of time, and spool 3 becomes empty.

When spool 3 becomes empty, spool 3 and winding off spindle 17 reverses respectively, specifically by become empty spool 3 reel, the travel direction quilt of adhesive tapes 1 is (the arrow F among Fig. 3) conversely.

Like this, to each bar of caking agent 11 coiling direction of conversion adhesive tapes 1 (E, F) in turn, caking agent 11 is crimped onto on the circuit card 21.

Next, with reference to Fig. 5 and Figure 35 the manufacture method of the adhesive tapes 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.Coater 27 as shown in figure 35, the width to the 10mm of base material 9 disposes 5 coaters 27,5 caking agents 11 of coating on the width of 10mm.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 29th scheme～the 34th scheme describe, below among the illustrated embodiment by part same as the previously described embodiments is put on identical symbol, thereby omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

On the adhesive tapes 1 of embodiment 2 shown in Figure 36 A～Figure 36 C, with the width W coating adhesive, caking agent is separated into many in the width W direction by the slit on the length direction that is formed on base material 35 on the whole surface of the single face of base material.In the adhesive tapes 1 of this embodiment 2, slit 35, be preferably in be installed in spool 3 on the adhering device 15 after, before being crimped onto adhesive tapes 1 on the circuit card 21, form.In this case, both can be near the spool installation portion of adhering device 15 (representing with S among Fig. 3) blade is installed, on the caking agent 11 of the adhesive tapes 1 that is rolled out, form slit 35, also can be when the manufacturing of as shown in Figure 5 adhesive tapes, in finishing operation, form slit, afterwards it is wound up on the spool formation slit before can also be in applying operation after drying, reeling with up-coiler 31.

When in adhering device 15, using the adhesive tapes 1 of embodiment 2, identical with embodiment 1, carried out crimping with 19 pairs of thermal heads by slit 35 isolating per 1 caking agent from base material 9 sides, shown in Figure 36 A, 36B, 36C, use in turn.

Among this embodiment 2,, therefore make to be very easy to because only formation slit 35 just can obtain many caking agents 11 on the caking agent on the resulting base material of operation the same as before by utilizing.

Among the embodiment 3 shown in Figure 37 A～Figure 37 C, be coated with caking agent 11 (Figure 37 A) on the whole surface of base material 9, the width W of base material 9 and caking agent 11 is same as the previously described embodiments, is 5～1000mm.And, in use also with embodiment 1 the same being installed on the adhering device 15, the adhesive tapes 1 that to be extracted out from the spool 3 is configured on the circuit card 21, carry out thermo-compressed (Figure 37 B) by a part () to the caking agent on the width W direction of adhesive tapes 1, the cohesive force of this part is reduced, separated and be crimped into (Figure 37 C) on the circuit card 21 from base material by the caking agent of thermo-compressed part thereby only allow.

In this case, preferably the circumferential wire along thermal head 19 forms the cohesive force droop line, make by the caking agent of the part of thermo-compressed almost all softening and mobile, (roughly target is that 100 pools are following), and as if the sclerous reaction that is in caking agent does not begin this low-end trim (roughly target is that reactivity is below 20%) as yet, and Heating temperature is selected according to employed caking agent class.

According to this embodiment 3, thereby because caking agent 11 only allows softening flowing in the width W be crimped on the circuit card in use, therefore same as the previously described embodiments, spool 3 by making adhesive tapes 1 and empty winding off spindle just change and reverse, and can use repeatedly.

In addition, owing to do not need as the foregoing description, formation slit 35 makes many separation on caking agent 11, and only need be on the whole surface of the single face of the base material of broad coating adhesive 11, so the manufacturing of adhesive tapes is easy to.

Embodiment 4 shown in Figure 38 A～Figure 38 C is other manufacture method of having represented the adhesive tapes of embodiment 1, after having formed slit 98 on the caking agent 11 that on base material 9a, is coated with (Figure 38 A), other base materials of stickup 9b on caking agent 11, thus make base material 9a, 9b clamp caking agent 11 (Figure 38 B).Next, it is separated a side and the opposing party's base material 9a, 9b strip off, and make strip of glue 11a, the 11b that is arranged with one of space on each base material 9a, the 9b.Among this embodiment 4, in order to be arranged with strip of glue 11a, 11b alternately on the base material 9a, the 9b that make a side and the opposing party, can by from a side base material 9a and 9b side space one to strip of glue 11a, 11b heating and pressurization, strip of glue 11a, one of 11b space are configured on each base material 9a, the 9b.

The invention of the 29th scheme～the 34th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 29th scheme～the 34th scheme.

For example, in the foregoing description, can be the insulativity caking agent that is not dispersed with conducting particles 13 in the caking agent 11.

In the foregoing description, the bar number that is formed on the caking agent on the base material 9 be several can, so long as get final product more than 2.

Next, the invention to the 35th scheme～the 41st scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive tapes that is electrically connected between the electrode of the two, the manufacture method of adhesive tapes and the compression bonding method of adhesive tapes.

Next, the background technology to the invention of the 35th scheme～the 41st scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive tapes.

In TOHKEMY 2001-284005 communique, the content that the adhesive tapes that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive tapes before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.And, caking agent is crimped onto circuit card around the time, one side with adhesive tapes along the drawing and the crimping caking agent of circuit card, to carrying out this operation around the circuit card, crimping caking agent around circuit card.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card (Yi Bian size on every side) also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, owing to change the spool spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive tapes on the spool, thereby increases the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but,, collapse if the number of turns increases just might occur rolling up because the bandwidth of adhesive tapes is narrow in 1～3mm.In addition, if the number of turns increases, the pressure that acts on the adhesive tapes that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

Therefore, the purpose of the invention of the 35th scheme～the 39th scheme is, a kind of number of turns that does not increase adhesive tapes is provided, and can increases the adhesive tapes of bonding dosage, the manufacture method of adhesive tapes and the compression bonding method of adhesive tapes.

Next, describe with reference to the inventive embodiment of accompanying drawing the 35th scheme～the 39th scheme.At first, with reference to Figure 39 A, Figure 39 B, Figure 40, Figure 34, Fig. 5 and Figure 41 the inventive embodiment 1 of the 35th scheme～the 39th scheme is described.Figure 39 A and Figure 39 B are the synoptic diagram of adhesive tapes, and Figure 39 A is for rolling up the stereographic map of the spool that adhesive tapes is arranged, and Figure 39 B is the vertical view from the adhesive tapes of caking agent side 39A with the aid of pictures.Figure 40 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

The adhesive tapes 1 of present embodiment is twisted on the spool 3, and spool 3 is provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive tapes 1.In the present embodiment, the length of adhesive tapes 1 is about 50m, and the size on one side of width W and circuit card is roughly the same, is about 1500mm.

Adhesive tapes 1 is made of base material 9 and the caking agent 11 that is coated on the base material 9, on the base material 9 uniformly-spaced and every the width that on the width of belt, is provided be the caking agent 11 of 0.5mm.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive tapes 1 of present embodiment describes.The spool 3 and the empty winding off spindle 17 of adhesive tapes are installed on the adhering device 15, the front end that twists in the adhesive tapes 1 of spool 3 is installed on the empty winding off spindle 17, extract adhesive tapes 1 (arrow E among Figure 40) out.Afterwards, adhesive tapes 1 is configured on the circuit card 21,, connects adhesive tapes 1, the caking agent 11 of 1 amount is crimped onto on the limit of the circuit card that is positioned at the adhesive tapes width from base material 9 side pressures by being arranged on the thermal head 19 between two spools 3,17.Afterwards, the caking agent 11 with only empty this width is wound on the winding off spindle 17.

Next, make about 90 degree of circuit card 21 rotation, make the adjacent side of circuit card 21 be positioned at the width of adhesive tapes 1.Utilize thermal head 19 that caking agent 11 is crimped onto on another limit of circuit card 21.Like this, by making about 90 degree and the crimping caking agents 11 of circuit card 21 rotation, in turn caking agent 11 is crimped onto circuit card 21 around.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect in fact exactly caking agent 11 is crimped on circuit card 21 around after, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11, through cushioning material, for example polytetrafluoroethylmaterial material 24 in case of necessity, utilize thermal head 19 that (with reference to Fig. 4) on the circuit card 21 received in wired circuit 23 hot pressing.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

As shown in figure 34, use the connection portion of PDP26 of the adhesive tapes 1 of present embodiment, carry out crimping in the entire circumference of PDP, once use the usage quantity of caking agent 11 with compared in the past very many.But, because the length H on one side of the width W of adhesive tapes 1 and circuit card 21 is about equally, therefore, it is big that the width W of adhesive tapes 1 becomes, even the number of turns is with identical in the past, bonding dosage also becomes very many with comparing in the past, therefore, the replacing of spool becomes considerably less with comparing in the past.

Next, with reference to Fig. 5 and Figure 41 the manufacture method of the adhesive tapes 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.Coater 27 move left and right, on base material 9 uniformly-spaced to be coated with the caking agent of strip.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side plate 7,7 is installed on the volume core from both sides, perhaps it is wound on the volume core that has side plate, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 35th scheme～the 41st scheme describe, below among the illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

In the adhering device 15 of embodiment 2 shown in Figure 41, two adhesive tapes 1, one sides' adhesive tapes 1 and the opposing party's adhesive tapes 1 are installed are arranged on the mutually perpendicular direction.On a pair of longitudinal edge N that faces mutually that on a side the adhesive tapes 1 caking agent 11 is crimped onto circuit card 21 (the 1st operation), on a pair of horizontal edge M that faces mutually that on the opposing party's the adhesive tapes 1 caking agent 11 is crimped onto circuit card 21 (the 2nd operation), by these two operations crimping caking agent around circuit card 21.Among this embodiment 2, do not need between the 1st operation and the 2nd operation rotation circuit plate 21 towards, move in the 2nd operation by circuit card 21 former states institute's mounting in the 1st operation, just can carry out the crimping of caking agent automatically, can further improve operating efficiency.In this case, circuit card 21 lift-launchs can be transmitted on travelling belt automatically.

Among the embodiment 3 shown in Figure 42 A～Figure 42 C, with the width W coating adhesive, caking agent is separated into many on the width W direction by the slit 35 on the width W direction that is formed on base material on the whole surface of the single face of base material.In the adhesive tapes 1 of this embodiment 3, slit 35 is preferably in spool 3 is installed in back and formation before being crimped onto adhesive tapes 1 on the circuit card 21 on the adhering device 15.In this case, both can be near the spool installation portion of adhering device 15 (representing with S among Figure 40) blade is installed, on the caking agent 11 of the adhesive tapes 1 that is rolled out, form slit 35, also can be when the manufacturing of as shown in Figure 5 adhesive tapes, in finishing operation, form slit, afterwards it is wound up on the axle, can also in applying operation, forms slit before reeling with up-coiler 31 in dry back.In addition, can make section to-and-fro movement on the width W direction of adhesive tapes 1 under each situation.

In addition, identical when in adhering device 15, using the adhesive tapes 1 of embodiment 3 with embodiment 1, carried out crimping with 19 pairs of thermal heads by slit 35 isolating 1 caking agent from base material 9 sides, use in turn from front.

Among this embodiment 3, only, just can access many caking agents 11 that are arranged on the width, therefore make very easy by on the caking agent that utilizes on the resulting base material of operation the same as before, forming slit 35.

Among the embodiment 4 shown in Figure 43 A～Figure 43 C, be coated with caking agent 11 (Figure 43 A) on the whole surface of the single face of base material 9, the width W of base material 9 and caking agent 11 is roughly the same with the length dimension on one side of circuit card same as the previously described embodimentsly.And, also install similarly to Example 1 in use, carry out thermo-compressed (Figure 43 B) by a part () on the width W direction of adhesive tapes 1 to caking agent, the cohesive force of this part is reduced, separated and be crimped onto (Figure 43 C) on the circuit card 21 from base material by the caking agent of thermo-compressed part thereby only allow.

In this case, preferably the circumferential wire along thermal head 19 forms the cohesive force droop line, make by the caking agent of the part of thermo-compressed almost all softening and mobile, (roughly target is that 100 pools are following), and as if the sclerous reaction that is in caking agent does not begin this low-end trim (roughly target is that reactivity is below 20%) as yet, and Heating temperature is selected according to employed caking agent class.

According to this embodiment 4, caking agent 11, thus can only on the width W direction, allow softening flowing be crimped on the circuit card in use.

In addition, owing to do not need as the foregoing description, form slit 35 on caking agent 11, many are separated settings, and only need be on the whole surface of the single face of the base material of broad coating adhesive 11, so the manufacturing of adhesive tapes is easy to.

What the embodiment 5 shown in Figure 44 A～Figure 44 C represented is other manufacture method of the adhesive tapes 1 of embodiment 1, after having formed slit 98 on the caking agent 11 that on base material 9a, is coated with (Figure 44 A), on caking agent 11, paste other base materials 9b, thereby clamp caking agent 11 (Figure 44 B) with base material 9a, 9b.Next, base material 9a, the 9b strip off with a side and the opposing party makes its separation, a ground, space placement of adhesives bar 11a, 11b on each base material 9a, 9b.Among this embodiment 5, for last mutual strip of glue 11a, the 11b of arranging of the base material 9a, the 9b that make a side and the opposing party, can by from ground of base material 9a or 9b side space of a side to strip of glue 11a, 11b thermo-compressed, thereby strip of glue 11a, 11b are sticked on each base material 9a, the 9b in turn.

The invention of the 35th scheme～the 41st scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 35th scheme～the 41st scheme.

For example, in the foregoing description, can be the insulativity caking agent that is not dispersed with conducting particles 13 in the caking agent 11.

Next, the invention to the 42nd scheme～the 46th scheme describes.

These inventions relate to a kind of being used for electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make adhesive agent-tape cassette that is electrically connected between the electrode of the two and the compression bonding method that uses the caking agent of adhesive agent-tape cassette.

Next, the background technology to the invention of the 42nd scheme～the 46th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive tapes.

In TOHKEMY 2001-284005 communique, the content that the adhesive tapes that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive tapes before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.And, when crimping caking agent around circuit card, adhesive tapes is extracted out and the crimping caking agent along a limit of circuit card, to carrying out this operation, crimping caking agent around circuit card around the circuit card.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card (Yi Bian size on every side) also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, owing to change the spool spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive tapes on the spool, thereby increases the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but,, collapse if the number of turns increases just might occur rolling up because the bandwidth of adhesive tapes is narrow in 1～3mm.In addition, if the number of turns increases, the pressure that acts on the adhesive tapes that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

Therefore, the purpose of the invention of the 42nd scheme～the 46th scheme is, a kind of number of turns that does not increase adhesive tapes is provided, and can increases bonding dosage, and can carry out simply spool replacing adhesive agent-tape cassette and use the compression bonding method of the caking agent of adhesive agent-tape cassette.

Next, describe with reference to the inventive embodiment of accompanying drawing the 42nd scheme～the 46th scheme.At first, with reference to Figure 45 A, Figure 45 B, Figure 46, Figure 47, Fig. 4, Figure 34 and Figure 48 the inventive embodiment 1 of the 42nd scheme～the 46th scheme is described.For convenience of explanation, and the occasion that disposes 2 caking agents on the adhesive tapes is described, but caking agent also can be formed with many.Figure 45 A and Figure 45 B are the synoptic diagram of adhesive agent-tape cassette of the inventive embodiment 1 of the 42nd scheme～the 46th scheme, Figure 45 A is the stereographic map of adhesive agent-tape cassette, Figure 45 B is the A-A line sectional view of Figure 45 A, Figure 46 is the sectional view of installment state of the spool of the tape drum shown in presentation graphs 45A and Figure 45 B, Figure 47 is the front view of the crimping process of the caking agent of expression adhering device, and Figure 48 is the process picture sheet of the manufacture method of expression adhesive agent-tape cassette.

The relevant adhesive agent-tape cassette 100 of present embodiment, mainly constitute by a side spool 3 and the opposing party's winding off spindle 17 and the tape drum 99 that holds them, be wound with adhesive tapes 1 on one side's the spool 3, the other end 1a of adhesive tapes 1 is fixed on the opposing party's the winding off spindle 17.

In the tape drum 99, the one side is formed with opening 123, draws adhesive tapes 1 from this opening 123.In addition, the both sides of opening 123 are provided with the guiding rod 124,124 that guiding adhesive tapes 1 moves.

Tape drum 99 by with half box 99a, 99b is chimeric makes, be interspersed with on a side and the opposing party's the spool 3,17 be arranged on the adhering device 128 (aftermentioned) around axle 126 (with reference to Figure 46), with each spool 3,17 tablings.

Next, with reference to Figure 46, to describing cooperating between each spool 3,17 and each spool 3,17 and the tape drum 99.On each spool 3,17, all sides are formed with the setting strip 125 that matches around axle 126 with adhering device 128 in it, its outer circumferential side be formed with the protuberance 99c of tape drum 99 rotatably tabling embeded slot 127.

On the adhesive tapes 1, shown in Figure 45 B, on width, be coated with two caking agent 11a, 11b on the single face of base material 9 side by side.Leave certain interval between these two caking agent 11a, 11b.

The length of the adhesive tapes 1 of present embodiment is about 50m, width W be about 4mm.The width of each bar caking agent 11a, 11b is about 1.2mm.

Base material 9 though use OPP (extended polypropylene), tetrafluoroethylene, silicon to handle PET (polyethylene terephthalate) etc., is not limited to this from the separability aspect of the caking agent of intensity and formation anisotropic conductive material.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive agent-tape cassette 100 of present embodiment describes.As shown in figure 47, in the adhering device 128 adhesive agent-tape cassette 100 is installed.In the adhering device 128, be provided with the tape drum that separates with certain interval and use around axle 126,126 (with reference to Figure 46), each spool 3,17 of adhesive agent-tape cassette 100 with match around axle 126,126.Therefore, the installation of adhesive agent-tape cassette 100 can once be finished, and does not need the other end 1a that carries out as before twisting in the adhesive tapes 1 on the spool to be installed to the empty first-class operation of winding off spindle.Next, draw adhesive tapes 1 from adhesive agent-tape cassette 100, support is on the guide reel 124,124 of adhering device 128.

Next, drive adhering device 128 around axle 126, extract adhesive tapes 1 (the arrow E direction among Figure 47) out, adhesive tapes 1 is configured on the circuit card 21, utilize thermal head 19 to connect adhesive tapes 1 from base material 9 side pressures, 1 caking agent 11a that will be positioned at the side on the width is crimped onto on one side of circuit card 21, on the winding off spindle 17 that remaining that caking agent 11b and base material 9 are wound up into the opposing party.Like this, with connect caking agent 11a be crimped in turn circuit card 21 around.

Afterwards, after the adhesive tapes 1 of being reeled on a side the spool 3 has been used up, once take off adhesive agent-tape cassette 100 after, loading onto conversely, repeat above-mentioned operation.Forming on the adhesive tapes under the situation of the caking agent more than 2, change the position of width, just can in turn or separate certain interval and carry out crimping.

After the above-mentioned crimping (interim connect), the electrode 23a position of the electrode 21a of circuit card 21 and wired circuit (electronic devices and components) 23 is coincided carry out reality to connect.Connect in fact exactly caking agent 11a is crimped on circuit card 21 around after, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11a, through cushioning material, for example polytetrafluoroethylmaterial material 24 in case of necessity, utilize thermal head 19 that (with reference to Fig. 4) on the circuit card 21 received in wired circuit 23 hot pressing.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

As shown in figure 34, use adhesive agent-tape cassette 100 to carry out the connection portion of bonding PDP26 according to present embodiment, the entire circumference at PDP26 in the present embodiment is carried out crimping, once use the usage quantity of caking agent 11 with compared in the past very many.But, owing to dispose 2 caking agent 11a, 11b in the adhesive tapes 1,, therefore,,, thereby the replacing number of times of tape drum is reduced because bonding dosage also becomes former twice even the number of turns is with identical in the past.

In addition, owing to the form of adhesive tapes 1 being made tape drum 1, therefore replacing, operation, installation all are easier to good work.

Next, with reference to Figure 48 the manufacture method of the adhesive agent-tape cassette 100 of present embodiment is described.

On the base material (spacer) 9 that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.Coater 27 is coated with many caking agents on base material 9.The former fabric width of the adhesive material tape of being reeled, in finishing operation, cut into given width (being the width of 2 strip of glue) by longitudinal cutter 33, after being wound up on the core, half box 99a, 99b are chimeric to clamp spool 3 and empty winding off spindle 17 by making, and manufactures adhesive agent-tape cassette 100.

Adhesive agent-tape cassette 100 wires up with siccative, is preferably in to take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 42nd scheme～the 46th scheme describe, below among the illustrated embodiment, by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the embodiment 2 shown in Figure 49, once, in the adhering device 128, be provided with to from adhesive agent-tape cassette 100, extracting long one section guide reel 101 that adhesive tapes 1 disposes out to a whole limit crimping caking agent 11 of circuit card 21.According to this embodiment 2 since can be once to the whole limit crimping caking agent of circuit card 21, so operating efficiency is better.

Among the embodiment 3 shown in Figure 50, on the whole surface of the single face of base material 9,, caking agent is separated into 2 by slit 102 with width W coating adhesive 11.In the adhesive tapes 1 of this embodiment 3, slit 102, be preferably in be installed to adhesive agent-tape cassette 100 on the adhering device 128 after, before being crimped onto adhesive tapes 1 on the circuit card 21, form.In this case, both can be near the tape drum installation portion of adhering device 128 (representing with S among Figure 47) blade is installed, on the caking agent 11 of the adhesive tapes 1 that is rolled out, form slit 102, also can be when the manufacturing of as shown in figure 48 adhesive tapes, in finishing operation, form slit, afterwards it is wound up on the spool 3, can also be in applying operation after the drying, form slit 102 before reeling by up-coiler 31.

Among this embodiment 3, owing to, just can access 2 caking agent 11a, 11b only by on the caking agent 11 that utilizes on the resulting base material 9 of operation the same as before, forming slit 102, thereby make very easy.

Among the embodiment 4 shown in Figure 51 A and Figure 51 B, be coated with caking agent 11 (Figure 51 A) on the whole surface of the single face of base material 9, the adhesive agent-tape cassette 100 and embodiment 1 the same being installed on the adhering device 128 that will hold this adhesive tapes 1, carry out thermo-compressed by a part () to the caking agent 11 of the width W direction of adhesive tapes 1, the cohesive force of this part is reduced, thereby only allow the caking agent 11a of thermo-compressed part separate and be crimped into (Figure 51 B) on the circuit card 21 from base material 9.

In this case, preferably the circumferential wire along thermal head 19 forms cohesive force droop line 103 (Figure 51 A), make the caking agent of part of thermo-compressed almost all softening and flow, (roughly target is that 1000 pools are following), and as if the sclerous reaction that is in caking agent does not begin this low-end trim (roughly target is that reactivity is below 20%) as yet, and Heating temperature is selected according to employed caking agent class.

According to this embodiment 4, thereby caking agent 11 can only make softening the flowing of a 11a on the width W direction be crimped on the circuit card in use.

Next, the invention to the 47th scheme～the 49th scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly a kind of adhesive material tape that is rolled into reel.

Next, the background technology to the invention of the 47th scheme～the 49th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape is installed on the adhering device (is designated hereinafter simply as " adhesive material-tape reel "), draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, from the base material side of the adhesive material tape that adhesive material-tape reel rolled out, utilize thermal head that caking agent is crimped onto on circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, when the adhesive material tape of a side adhesive material-tape reel uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle and new adhesive material-tape reel are installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material-tape reel increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm,, the number of turns collapses if increasing just might occur rolling up.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can increase, and is difficult to be installed on the existing adhering device, might can not use by existing adhering device.

Therefore, the purpose of the invention of the 47th scheme～the 49th scheme is to provide a kind of can carry out the replacing of adhesive material-tape reel simply, the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 47th scheme～the 49th scheme.

With reference to Figure 52 A, Figure 52 B, Fig. 3, Fig. 4, Figure 29 and Fig. 5 the inventive embodiment 1 of the 47th scheme～the 49th scheme is described.Figure 52 A and Figure 52 B are the synoptic diagram of the connection of the adhesive material tape of expression present embodiment, and Figure 52 A is the stereographic map of the connection between the expression adhesive material-tape reel, and Figure 52 B is the sectional view of the connection portion of presentation graphs 52A.

Adhesive material tape 1 twists in respectively on spool 3, the 3a, and each spool 3,3a are provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive material tape 1.

Adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Base material 9, the heat that has supporting layer 9b and clamp supporting layer 9b from both sides is melted agent layer (heat is melted layer) 9a, constitute hot heat of melting agent layer 9a and melt agent (heat is melted), use is as polyethylene, SBS (styrene butadiene styrene segmented copolymer) and the nylon etc. of thermoplastic resin, supporting layer 9b, adopt OPP (extended polypropylene), tetrafluoroethylene, PET plastics such as (polyethylene terephthalates), perhaps reinforcing fibres such as glass fibre, Kevlar, carbon fiber.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.As shown in Figure 3, the spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, after the front end support that twists in the adhesive material tape 1 on the spool 3a is on guide reel 22, is installed on the winding off spindle 17 extraction adhesive material tape 1 (arrow E among Fig. 3).Afterwards, adhesive material tape 1 is configured on the circuit card 21, utilizes the thermal head 19 that is arranged between two spool 3a, 17, connect adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21,, utilizes thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21 through polytetrafluoroethylmaterial material 24 as cushioning material.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

The connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment of representing by Figure 29 as can be known, caking agent 11 has carried out crimping on the entire circumference of PDP, once the usage quantity of the caking agent that uses 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, and the adhesive material tape that twists on the spool 3a just is rolled onto on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Figure 52 A) of the adhesive material tape 1 that twists on the spool 3a.

Shown in Figure 52 A, when on the adhesive material tape 1 of spool 3a, having exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) of being reeled on the new adhesives volume 3.

The connection of this adhesive material tape 1, shown in Figure 52 B, roll up the terminal part 30 of the adhesive material tape 1 of 3a for adhesives, top part 32 with the adhesive material tape 1 of new adhesives volume 3, it is overlapping to make the heat of the base material 9 of terminal part 30 melt 11 of the caking agents of agent layer 9a and top part 32, and lap is placed on the platform 104.Afterwards, utilize 19 pairs of lap heating of thermal head of adhering device 15, heat is melted after the agent layer 9a thawing, make heat melt agent by cooling again and solidify, thereby terminal part 30 and top part 32 are coupled together.Like this, the adhesive material tape 1 of being reeled on the end-of-use spool 3a just couples together with the adhesive material tape 1 of being reeled on the new spool 3.

Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.So, do not need adhesive material tape 1 is installed to operation on the winding off spindle 17.In addition, the base material 9 because winding off spindle 17 is mainly only reeled, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, make operating efficiency higher.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, be wound up on the core after, with side plate from both sides be installed to the volume core on, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 47th scheme～the 49th scheme describe, below among the illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the embodiment 2 shown in Figure 53, in the base material 9 of adhesive material tape 1, heat is melted agent layer 9a and is supported a layer 9b clamping.In this case, as shown in Figure 3, for adhesive material tape 1 is interconnection, with the terminal part 30 of a side adhesive material tape 1, with the top part 32 of the opposing party's adhesive material tape 1 toward each other, on this position, utilize 19 pairs of heat of thermal head of adhering device 15 to melt agent layer 9a and heat.Heat is melted agent and is melted among the agent layer 9a by heat and ooze out during heating, and make heat melt agent by cooling and solidify, thus adhesive material tape 1 is interconnection.Like this, because heat melts agent layer 9a and be supported a layer 9b clamping, can prevent from therefore adhering to of moisture absorption that moisture causes and dust to cause that heat melts the reduction of the bonding strength of agent layer 9a.

The invention of the 47th scheme～the 49th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 47th scheme～the 49th scheme.

Among the embodiment 1,, also can be more than 4 layers though base material 9 by supporting layer 9b and melt agent layer 9b by heat and clamp these 3 layers of supporting layer 9b from both sides and constitute, is not limited to this.

In the present embodiment, use 19 pairs of bonding portions of thermal head of adhering device 15 to carry out thermo-compressed, but also can use other well heater to replace thermal head 19, the connection portion is heated, carry out the connection between the adhesive material tape 1.

Next, the invention to the 50th scheme～the 51st scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two.In addition, also relate to semiconductor element (chip) is bonding and the fixing tube core, semiconductor element mounting that are fixed on lead frame with support substrate and lead frame with the semiconducter device on the support substrate in employed adhesive material tape, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel.

Next, the background technology to the invention of the 50th scheme～the 51st scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In addition, adhesive material tape is used for bonding film of lead-in wire fixing strip, LOC band, chips incorporate band, little BGACSP of lead frame etc. etc., is used to improve productivity, the reliability of semiconducter device integral body.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive material tape before this in order to make bonding insecure between caking agent and the base material, perhaps in order to peel off easily, is handled and implement silicon on the two sides of base material.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, draw the top part of adhesive material tape, be installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, after the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new adhesives volume is installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card (Yi Bian size on every side) also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of coiling adhesives volume increases, because therefore more changing-over material webs spended time exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive tapes on the spool, thereby increases the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but,, collapse if the number of turns increases just might occur rolling up because the bandwidth of adhesive tapes is narrow in 1～3mm.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction.

In addition, if increase the number of turns of adhesive material tape, then the radial dimension of spool also can become greatly, is difficult to be installed on the existing adhering device, might use in existing adhering device.

Therefore, the purpose of the invention of the 50th scheme～the 51st scheme is, a kind of replacing that can carry out the adhesives volume simply is provided, the method for attachment of the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 50th scheme～the 51st scheme.At first, with reference to Figure 54 A～Figure 54 C, Figure 55, Figure 56, Fig. 4, Figure 29 the inventive embodiment 1 of the 50th scheme～the 51st scheme is described.Figure 54 A～54C is the sectional view of the connection operation of the connection portion of expression Figure 55, the state of the adhesive material tape before Figure 54 A represents to discharge, and the state of the adhesive material tape after Figure 54 B represents to discharge, Figure 54 C is the synoptic diagram of the thermo-compressed of expression connection portion.The stereographic map of the connection in the method for attachment of Figure 55 for the expression adhesive material tape, between the adhesives volume.Figure 56 is the synoptic diagram of the crimping process of the caking agent of expression adhering device.

Adhesive material tape 1 is twisted in respectively on spool 3, the 3a, and each spool 3,3a are provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive material tape 1.

Adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Base material 9 from the separability aspect of intensity and caking agent 11, adopts OPP (extended polypropylene), tetrafluoroethylene, PET (polyethylene terephthalate) etc., implements surface treatment with parting agent 9a.Parting agent can adopt tensio-active agent, oil, wax, resin, polyester modification silicone resin of low melt waxes such as olefines parting agent, montanic acid glycol ester, carnauba wax, paraffin, low-molecular-weight fluoro-resin, silicon or fluorine class etc., particularly generally adopts silicone resin.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape 1 of present embodiment describes.Shown in Figure 56, the spool 3a and the winding off spindle 17 of adhesive material tape 1 are installed on the adhering device 15, be installed on the winding off spindle 17 after supportting the front end that twists in the adhesive material tape 1 on the spool 3a on guide reel 22, extract adhesive material tape 1 (arrow E among Figure 56) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21, utilizes the thermal head 19 that is arranged between two spool 3a, 17, connect adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21,, utilizes thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21 through polytetrafluoroethylmaterial material 24 as cushioning material.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Figure 29 has represented to use the connection portion of PDP26 of the adhesive material tape 1 of present embodiment, and hence one can see that, and caking agent 11 has carried out crimping on the entire circumference of PDP, once the usage quantity of the caking agent that uses 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3a also becomes many, and the adhesive material tape that twists on the spool 3a just is rolled onto on the winding off spindle 17 for 1 within a short period of time, has exposed the terminal marking 28 (with reference to Figure 55) of the adhesive material tape 1 that twists on the spool 3a.

Shown in Figure 55, when on the adhesive material tape 1 of spool 3a, having exposed terminal marking 28, for spool 3a being replaced by new adhesives volume 3, with the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) of being reeled on the new adhesives volume 3.

The connection of this adhesive material tape 1 shown in Figure 54 B, places the terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a at the irradiation position place of Electrical Discharge Machine 105.Afterwards, remove parting agent 9a by discharging on the surface of base material 9.

Afterwards, make 9 of base materials having removed parting agent 9a, with 11 of the caking agents overlapping (Figure 54 C) of the top part 32 of the opposing party's adhesive material tape 1.The lap of the two is placed on the platform, utilize the thermal head 19 of adhering device 15 to carry out hot pressing and make it bonding.Like this, the adhesive material tape 1 of being reeled on the end-of-use spool 3a just couples together with the adhesive material tape 1 of being reeled on the new spool 3.

Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on the adhering device 15.So, do not need adhesive material tape 1 is installed to operation on the winding off spindle 17.

In the present embodiment,, therefore do not need to use in addition the connection apparatus between the adhesive material tape 1, just can change the spool 3, the 3a that are wound with adhesive material tape 1 owing to utilize thermal head 19.In addition, because 17 coiling base materials 9 of winding off spindle, a plurality of adhesivess of therefore can reeling are rolled up, thereby can reduce the replacing number of times of winding off spindle 17, make operating efficiency higher.

The invention of the 50th scheme～the 51st scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 50th scheme～the 51st scheme.

For example, in the foregoing description, the parting agent 9a of base material 9 that extracts end-of-use one side's adhesive material tape 1 out is removed, make 11 of the caking agents of this part and new adhesive material tape 1 overlapping, utilizing thermal head 19 to carry out hot pressing makes it bonding, the two is coupled together, but also the parting agent 9a of the base material 9 of new adhesive material tape 1 can be removed, 11 of caking agents that make this part and the adhesive material tape 1 of extracting end-of-use one side out are overlapping and couple together.

As the method for removing parting agent 9a, except plasma discharge, can also adopt methods such as uviolizing or laser radiation, under the situation that adopts uviolizing, for example adopting, mercuryvapour lamp is undertaken by the ultraviolet ray of being shone certain hour by mercuryvapour lamp as light source.In addition, under the situation of laser radiation, the laser that utilizes laser oscillator to shine disperses out parting agent 9a decomposition, thereby removes parting agent 9a.

In above-mentioned, to electronic devices and components and circuit card, and the situation about being adhesively fixed between the circuit card is illustrated, but for semiconductor element (chip) is bonding and be fixed on the fixing of lead frame and also can similarly carry out with employed adhesive material tape in the semiconducter device on the support substrate with tube core, the semiconductor element mounting of support substrate and lead frame.

Next, the invention to the 52nd scheme～the 58th scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or bonding and fixing while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two.In addition, relate to fixing tube core at lead frame, semiconductor element mounting with support substrate and lead frame with support substrate on, employed adhesive material tape in the semiconducter device bonding and fixedly semiconductor element (chip), particularly a kind of adhesive material-tape reel that is rolled into reel.

Next, the background technology to the invention of the 52nd scheme～the 58th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In addition, adhesive material tape is used for the lead-in wire fixing strip, LOC band, chips incorporate band of lead frame etc., and the fixing strip that for example goes between is used for the wire lead leg of lead frame is fixed up, and improves productivity, the reliability of lead frame self or semiconducter device integral body.

Progress along with the miniaturization and of e-machine, in the semiconducter device, its outside terminal is the exploitation of compact package that the area array shape is configured in the assembly (CSP) that is called microspheroidal network array (BGA-ball gridarray) and die size of semiconducter device (assembly) bottom constantly to be developed, in these assemblies, semiconductor element mounting such as glass epoxy substrate with 1 layer or multi-layer circuit structure or polyimide substrate with support substrate on, by caking agent semiconductor element (chip) is installed, the terminal of the running board side of the terminal of semiconductor element side and substrate is coupled together with wire-bonded mode or flip chip, encapsulate with epoxies packaged material or the aqueous packaged material of epoxies upper surface part or end face portion, adopt metal terminal with solder ball etc. to be the area array shape and be configured in structure in the inboard of circuit board with connection section and chip.In addition, quad flat no-lead (QFN) envelope is changeed (QFN-Quad Flat Non-leaded Package) and little gabarit does not have in the lead packages (SON-Small Outline Non-leaded Package) etc. and uses adhesive material tape yet.And the majority in these assemblies adopts on the substrate of e-machine by the mode of scolding tin reflux type with high-density butt joint complete installation.In addition, the tube core and the semiconductor element (chip) of lead frame are installed by caking agent, the terminal of semiconductor element side and the terminal of lead frame are coupled together by wire-bonded, and encapsulate by epoxies packaged material or the aqueous packaged material of epoxies upper surface part and end face portion with connection section and chip.The caking agent of such semiconducter device also uses adhesive material tape

The spy opens in the 2001-284005 communique, as the method that will be electrically connected between the electrode, discloses the adhesive material tape that is rolled into reel that is coated with adhesives on the base material.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the adhesive material-tape reel that adhesive material tape is wound on the spool is installed on the adhering device, draws the top part of adhesive material tape, is installed on the winding off spindle.Afterwards, from the base material side of the adhesive material tape that adhesive material-tape reel rolled out, utilize thermal head that caking agent is crimped onto on circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, after the adhesive material tape of adhesive material-tape reel uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle and new adhesive material-tape reel are installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material-tape reel increases, owing to change the adhesive material-tape reel spended time, therefore exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive tapes on the spool, thereby increases the bonding dosage of 1 spool, scheme with the replacing frequency that reduces spool, but,, collapse if the number of turns increases just might occur rolling up because the bandwidth of adhesive tapes is narrow in 1～3mm.In addition, if the number of turns increases, the pressure that acts on the adhesive material tape that is rolled into reel will become greatly, and caking agent might ooze out from the both sides of belt, becomes the reason of obstruction; Simultaneously, the radial dimension of spool also can become greatly, is difficult to be installed on the existing adhering device, and existing adhering device might can't use.

In addition, if in the adhesive material-tape reel adhesive material tape is directly exposed in the atmosphere, might cause quality to descend because of dust and moisture etc.

Therefore, the purpose of the invention of the 52nd scheme～the 58th scheme is, provides a kind of and can carry out the replacing of adhesive material-tape reel simply, the raising of the production efficiency of realization e-machine and the high-quality adhesive material-tape reel that can keep adhesive material tape.

Next, though be example with reference to accompanying drawing with the adhesive material tape that electrode connects usefulness, the inventive embodiment of the 52nd scheme～the 58th scheme is described, the adhesive material tape that semiconductor element connects usefulness is also identical therewith.At first, with reference to Figure 57 A～Figure 57 C, Fig. 3, Fig. 4, Figure 29 and Figure 58 the inventive embodiment 1 of the 52nd scheme～the 52nd scheme is described.Figure 57 A～Figure 57 C is the stereographic map of expression adhesive material-tape reel for the synoptic diagram of the adhesive material-tape reel of expression embodiment 1, Figure 57 A, and Figure 57 B is the front view of Figure 57 A, and Figure 57 C is the front view of the cover of Figure 57 A.Figure 58 is the process picture sheet of the manufacture method of expression adhesive material tape.

The adhesive material-tape reel A of present embodiment has winding part (below be called coiling portion) 2, the 2a of a plurality of adhesive material tapes 1, and winding part 2,2a are provided with spool 3, the 3a that is wound with adhesive material tape 1 respectively.Each spool 3,3a are provided with volume core 5 and are configured in side plate 7,7a, the 7b of the both sides of adhesive material tape 1.As shown in Figure 3, adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.On the untapped winding part 2a, can be provided with the cover 8 on every side that covers the adhesive material tape 1 that is wound on the spool 3a on the spool 3a with freely installing and removing.

In addition, on the side plate 7a of the inboard of winding part 2,2a, be provided with the accommodation section (spatial accommodation) 12 of siccative 10.By in accommodation section 12, holding siccative 10 such as silica gel, remove the moisture in the untapped winding part 2a internally.

Base material 9 from the separability aspect of intensity and caking agent 11, adopts OPP (extended polypropylene), tetrafluoroethylene, PET (polyethylene terephthalate) etc., but is not limited thereto.

Caking agent 11 can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape of present embodiment describes.Shown in Figure 56, the spool 3a and the winding off spindle 17 of adhesive material tape 1 are installed on the adhering device 15, be installed on the winding off spindle 17 after supportting the front end that twists in the adhesive material tape 1 on the spool 3a on guide reel 22, extract adhesive material tape 1 (arrow E among Figure 56) out.Afterwards, adhesive material tape 1 is configured on the circuit card 21, utilizes the thermal head 19 that is arranged between two spool 3a, 17, connect adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21,, utilizes thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21 through polytetrafluoroethylmaterial material 24 as cushioning material.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

As the connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment represented among Figure 29, can learn that caking agent 11 carries out crimping in the entire circumference of PDP, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, it is many that the usage quantity of adhesive material tape 1 also becomes, and the adhesive material tape that twists on spool 3, the 3a just is rolled on the winding off spindle 17 for 1 within a short period of time.

When having exposed terminal marking on the adhesive material tape 1 of a side winding part 2, be replaced by the adhesive material tape 1 of new winding part 2a.In the present embodiment, on untapped winding part 2a, be provided with cover 8, after this cover 8 is taken off, extract adhesive material tape 1 out and be installed on the winding off spindle 17.

Like this, when a side winding part 2 is extracted out when having used up,, carry out the replacing of adhesive material tape 1 because the adhesive material tape 1 of the opposing party's winding part 2a is installed on the winding off spindle 17, therefore, do not need new adhesive material-tape reel is installed on the adhering device 15.So, can reduce the replacing operation of new adhesive material-tape reel, improve the production efficiency of e-machine.

In addition, owing to be provided with cover 8 on untapped winding part 2a, therefore, adhesive material tape 1 can not be directly exposed in the atmosphere, and adhesive material tape 1 is difficult to generation causes bonding force because of dust or moisture decline.Therefore, even under the situation that is provided with a plurality of winding parts 2,2a,, can prevent that also the quality of adhesive material tape 1 from descending by on untapped winding part 2a, cover 8 being set.

In addition, because the base material 9 of only reeling on the winding off spindle 17, a plurality of adhesive material-tape reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is higher.

Next, with reference to Figure 58 the manufacture method of the adhesive material-tape reel A of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, after being wound up on the core, side 7,7a, 7b plate are installed on the volume core from both sides, mounting cover parts 8, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, other embodiment to the invention of the 52nd scheme～the 58th scheme describe, below among the illustrated embodiment, by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the embodiment 2 shown in Figure 59, on the cover of being installed on winding part 2, the 2a 8, be provided with the outlet 106 of adhesive material tape 1.In this case,, therefore do not need to take off the cover 8 of winding part 2,2a, can directly extract adhesive material tape 1 out from winding part 2,2a owing to can extract adhesive material tape 1 out from the outlet 106 of cover 8.

Among the embodiment 3 shown in Figure 60 A and Figure 60 B, winding part 2,2a, 2b are provided with separately respectively, can be installed in sliding freely on the axle 107 that is located at adhering device 15 main bodys.Now, when a side winding part 2 extractions have been used up, take off the cover 108 of the front end that is installed in axle 107, from adhering device 15, take out a side winding part 2.Afterwards, the opposing party's winding part 2a is moved to the bonding location place, take off after the cover 8, the adhesive material tape 1 of the opposing party's winding part 2a is rolled onto on the winding off spindle 17, carry out the replacing of adhesive material tape 1.In this case, owing to a plurality of winding parts 2,2a, 2b are provided with separately respectively, therefore operate being very easy to.

Among the embodiment 4 shown in Figure 61, the same with embodiment 3, winding part 2,2a, 2b are provided with separately respectively, by making side plate 7,7a between winding part 2,2a, the 2b chimeric mutually, are installed on the adhering device 15.Shown in Figure 61, the side plate 7a of the opposing party's winding part 2a be provided with cross section be roughly the コ font by fitting portion 109, by set fitting portion 110 on the side plate 7 of a side winding part 2 is inserted into by the fitting portion 109 from upside, the two is coupled together.Under the situation that the winding part 2 that will extract end-of-use one side out takes off from adhering device 15, only by with a side winding part 2 to upside mention just can remove chimeric, thereby can take off a side winding part 2 simply.

The invention of the 52nd scheme～the 58th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 52nd scheme～the 58th scheme.

For example, in the foregoing description, winding part 2,2a are had no particular limits, be several can.

Among the embodiment 4, by side plate 7,7a are slided up and down mutually, and a side and the opposing party's winding part 2,2a is chimeric, but also can on a side side plate 7, form embeded slot, on the opposing party's side plate 7a, mosaic process is set, enter the embeded slot by mosaic process being pushed from the width of belt, thus the two is chimeric.

Among Figure 31 A, Figure 31 B, represented to connect the fixing of lead frame with support substrate, semiconductor element mounting support substrate, or in the tube core of lead frame and the adhesive material tape that is connected semiconductor element, lead frame fixing is bonding and be fixed to an example of LOC (the Lead on Chip) structure on the lead frame with support substrate and semiconductor element.

Use is on the two sides of the supporting film 78 of thickness surface-treated polyimide film that is applying of 50 μ m etc., add the adhesive material tape of structure of this Figure 31 A of bond layer 80 of the polyamide-based bond layer etc. of thick 25 μ m, obtain the semiconducter device of the LOC structure shown in Figure 31 B.Use the press tool 87 (punch (protuberance) 95, die (recess) 96) of the adhering device shown in Figure 32 A～32C, adhesive material tape shown in Figure 31 A is struck out rectangle, for example, on the lead frame that the iron nickel alloy of thick 0.2mm is made, lift-launch is spaced apart 0.2mm, wide is the internal lead of 0.2mm, and crimping was carried out in pressurization in 3 seconds under the pressure of 400 ℃ and 3MPa, made the lead frame that has adhesive film for semiconductor.Next, by other operations, have on the caking agent aspect of lead frame of adhesive film for semiconductor at this, with the pressure of 350 ℃ temperature and 3MPa to semiconductor element pressurization carried out crimping in 3 seconds, afterwards, lead frame and semiconductor element wire-bonded are got up, use packaged materials such as epoxy resin molding material with metal wire, encapsulate by the transfer mould moulding method, obtain the semiconducter device shown in Figure 31 B.Among Figure 31 A, the 31B, 81 is the adhesive film for semiconductor that is punched down from adhesive material tape, and 82 is semiconductor element, and 83 is lead frame, and 84 is packaged material, and 85 is bonding wire, and 86 is bus.Figure 32 A, 32B, 32C are adhering device, among Figure 32 A, the 32B, 87 roll out roller for adhesive material tape for adhesive material tape (adhesive film for semiconductor), 93 for adhesive material-tape reel (adhesive material tape rolls out portion), 92 for heater block, 91 for adhesive tapes punching press paste section, 90 for lead frame transport unit, 89 for press tool, 88.In addition, among Figure 32 C, 94 is that adhesive material tape (adhesive film for semiconductor), 95 is that punch (protuberance), 96 is that die (recess), 97 is pressuring diaphragm.Adhesive material tape 92, roll out continuously from adhesive material-tape reel (adhesive material tape rolls out portion) 91, strike out rectangle in adhesive material tape punching press paste section 89, mutually bonding with the leading part of lead frame, send out from the lead frame transport unit as the lead frame that has adhesive film for semiconductor.The adhesive material tape that has carried out punching press rolls out roller 93 from adhesive material tape and sends out.

Same as described above, use adhesive material tape that semiconductor element is connected on the semiconductor element mounting substrate.In addition, equally that the tube core of lead frame and semiconductor element is bonding and couple together.Adhesive material tape has following two kinds of situations: only carry out bonding and fixed occasion, pass through the contact between the electrode or use the caking agent that is electrically connected through electroconductive particle according to purpose; In the occasion of using supporting film, only constitute by caking agent.

Next, the invention to the 59th scheme describes.

This invention relates to a kind ofly will be used for electronic devices and components and circuit card, or bonding and fixed makes the caking agent that is electrically connected between the electrode of the two be crimped onto adhering apparatus on the circuit card simultaneously between the circuit card.

Next, the background technology to the invention of the 59th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive tapes.

The spy opens in the 2001-284005 communique, discloses and has been coated with the adhesive tapes that caking agent is rolled into reel on the base material, and put down in writing the spool of this adhesive tapes (below be called " felting agent coil ") is installed in the automatic splicing machine and uses.

Automatic splicing machine, have the installation portion of felting agent coil and the installation portion of the spool of sky, be arranged on the thermo-compressed parts between these spools, and the platform of placement substrate, from felting agent coil, be retracted to adhesive tapes on the substrate, utilize the thermo-compressed parts from the rear side of base material to the adhesive tapes thermo-compressed, caking agent is crimped onto on the substrate.

Yet former automatic splicing machine all is large-scale, and in the time of carrying out the part crimping of caking agent on substrate, or the area of crimping caking agent hour, when perhaps carrying out interim crimping, owing to be main equipment, has this problem of operational difficulty on the contrary.

On the other hand, people wish to have a kind of with so large-scale automatic splicing machine different, and are small-sized and can operate simply, under the situation of local or interim crimping, do not need to use the utensil that large-scale plant just can the crimping caking agent.

Therefore, the purpose of the invention of the 59th scheme is, provides a kind of small-sized and can be with one-handed performance, and can easily caking agent be crimped onto the adhering apparatus on the part of substrate.

Next, describe with reference to the inventive embodiment of accompanying drawing the 59th scheme.Figure 62 A and Figure 62 B are the synoptic diagram of the adhering apparatus of the inventive embodiment 1 of expression the 59th scheme, Figure 62 A is the stereographic map of adhering apparatus, Figure 62 B is the A-A line sectional view of Figure 62 A, Figure 63 is the side-view of the using method of the adhering apparatus shown in explanatory view 62A and Figure 62 B, and Figure 64 is the process picture sheet of the manufacture method of expression adhering apparatus.

The adhering apparatus 111 of present embodiment, mainly by a side spool (supply shaft) 3 and the opposing party's spool (empty spool) 17, and hold their tape drum 99 formations, and being wound with adhesive tapes 1 on a side the spool 3, an end 1a of adhesive tapes 1 is fixed on the opposing party's the winding off spindle 17.

Tape drum 99 has can be with the size that is hold by one hand, and in the side-view, the angle is crooked general triangular, makes the shape of easy gripping.Bight at the tape drum 99 of general triangular is formed with peristome 113, exposes adhesive tapes 1 from this peristome 113.

In addition, be provided with outstanding heater block 114 in the peristome 113, these heater block 114 side-lookings are general triangular, to along from upper surface 114a to adhesive tapes 1 channeling conduct that lower surface 114b is extracted out, be provided with hot plate 115 in lower face side.

Being shaped as of heater block 114 is bar-shaped, by coating heater block 114 by hot plate 115, when extracting adhesive tapes 1 out, can smoothly adhesive tapes 1 be extracted out by heater block 114 rotations.In addition, the outside of hot plate 115 preferably is provided with tetrafluoroethylene or silicon rubber or the two, so that when crimping adhesive tapes 1, apply uniform pressure.

Tape drum 99 by half box 99a, 99b is chimeric forms, a side and the opposing party's spool 3,17 is contained in the tape drum.Also be provided with guide reel 16 in the tape drum, to the mobile channeling conduct of adhesive tapes 1.In addition, be formed with tabular guide surface on the side of the bottom surface of any among half box 99a or the 99b, when in the edge that this guide surface is pressed to circuit card, being crimped onto caking agent on the circuit card, just can be along circuit card crimping caking agent accurately.

A gear 116 that is fixed with coaxially in one side's the spool 3, also be fixed with another gear 117 on the opposing party's the winding off spindle 17 coaxially, one side's gear 116 is engaged with the opposing party's gear 117, when one side's spool 3 rotations and extraction adhesive tapes 1, the opposing party's winding off spindle 17 also only rotates the extraction amount and the coiling base material 9 of this adhesive tapes 1.In addition, a side gear 116 constitutes gear assembly 118 with the opposing party's gear 117.

In addition, the side of tape drum 99 is provided with when accommodating drying battery in 119, the 3 box portions 119 of the 3rd box portion (supply unit) of heater block 114 power supplies, also accommodates the adjustment circuit to heater block 114 power supplies.In addition, the 3rd box portion 119 is provided with power switch 120, can be carried out the ON/OFF operation by the finger of the hand that grips adhering apparatus 111.

Adhesive tapes 1 has caking agent 11 at the single spreading of base material 9 shown in Figure 62 B.

The length of the adhesive tapes 1 of present embodiment is about 20m, and width is about 1.2mm.

Base material 9 from intensity and constitute the separability aspect of the caking agent of anisotropic conductive material, is handled PET formations such as (polyethylene terephthalates), but is not limited thereto by OPP (extended polypropylene), tetrafluoroethylene, silicon.

Caking agent 11 adopts mixture class, the heat of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin to melt the thing class.In the representative relevant resin,, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class as type thermoplastic resin.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhering apparatus 111 of present embodiment describes.Shown in Figure 63, one hand is held adhering apparatus 111, turns on the power switch 120.Afterwards, will expose the peristome 113 of adhesive tapes 1 by being pressed on the circuit card 21.In the peristome 113, be provided with heater block 114,, then caking agent 11 hot pressing received on the circuit card 21 by the adhesive tapes 1 of pushing the following side that is positioned at heater block 114 in base material 9 sides of adhesive tapes 1.

Push adhering apparatus 111 (arrow E among Figure 63) propelling forwards on one side on one side downwards, extract adhesive tapes 1 in turn out, when advancing heater block 114 towards the E direction, new adhesive tapes 1 is positioned under the heater block 114, and caking agent 11 is crimped onto on the circuit card 21 in turn.

Like this, when a side spool 3 is extracted adhesive tapes 1 out, because a side spool 3 rotates, therefore the gear 116 with a side spool 3 co-axially fixed sides also can rotate, make the opposing party's gear 117 rotation with its interlock, thereby the base material 9 after caking agent 11 peeled off is wound up on the opposing party's the winding off spindle 17.

According to present embodiment, be under the situation of crimping caking agent 11 on the optional position of circuit card 21, as long as to be hold by one hand adhering apparatus 111 and to make it just advance crimping caking agent 11 simply.Like this, because crimping caking agent 11 simply, for example under the interim situation that connects electronic devices and components (wired circuit) 23 on the circuit card 21, perhaps only effective especially under the situation of crimping electronic devices and components (wired circuit) 23 on the part of circuit card 21.

After the above-mentioned crimping (interim connect), the electrode position of the electrode of circuit card 21 and electronic devices and components (wired circuit) 23 is coincided carry out reality to connect.In connecing in fact, after being crimped onto caking agent 11 on the circuit card 21, electronic devices and components (wired circuit) 23 are configured on the caking agent 11, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that (with reference to Fig. 4) on the circuit card 21 received in electronic devices and components (wired circuit) 23 hot pressing.Like this, the electrode 21a of circuit card 21 and the electrode 23a of electronic devices and components (wired circuit) 23 are coupled together.

In addition, owing to make the note structure that adhesive tapes 1 is contained in the tape drum 99 and uses with this state, so processing ease, operation is better.

Next, with reference to Figure 64, the manufacture method of the adhering apparatus 111 of present embodiment is described.

On the base material (spacer) 9 that is rolled out from the machine of rolling out 25, the caking agent that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, in finishing operation, cut into given width by longitudinal cutter 33, after being wound up on the core 3, half box 99a, 99b are chimeric to clamp a side spool 3 and the opposing party's spool (empty spool) 17 by making, and held the 3rd box portion 119 of heater block 114 and drying battery etc. in the assembling, thereby produced adhering apparatus 111.Adhering apparatus 111 together wires up with siccative, is preferably in to take care of under the low temperature (5 ℃～-10 ℃) and outbound.

Next, the invention to the 60th scheme～the 64th scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the adhesive material tape that is electrically connected between the electrode of the two, particularly are rolled into the adhesive material tape of reel.

Next, the background technology to the invention of the 60th scheme～the 64th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.

In TOHKEMY 2001-284005 communique, the content that the adhesive material tape that will be coated with caking agent on the base material is wound into reel is disclosed.

Adhesive material tape before this, its width is about 1～3mm, and the length that twists in the belt on the spool is about 50m, and adhesive material tape just can not reuse in case roll out and caking agent is crimped onto after circuit card etc. goes up from axle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, because therefore more changing-over material webs spended time exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, the someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increases the bonding dosage of 1 spool, reduce the method for the replacing frequency of spool, but because the thickness of adhesive material tape is thicker, the number of turns on each spool is difficult to increase.

In addition, someone considers to reduce the method for the thickness of adhesive material tape, but owing to use silicon to handle PET (polyethylene terephthalate) as base material, therefore, in case the thickness attenuation of base material, the just danger of drawbacks such as the stretching of the easy generation of existence base material, fracture.

Therefore, the purpose of the invention of the 60th scheme～the 64th scheme is that providing a kind of can increase by 1 number of turns on the spool, the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 60th scheme～the 64th scheme.Figure 65 A, Figure 65 B, Fig. 3, Fig. 4, Figure 29 and Fig. 5 are used for the inventive embodiment 1 of the 60th scheme～the 64th scheme is described.Figure 65 A and Figure 65 B are the synoptic diagram of the adhesive material tape of embodiment 1, and Figure 65 A is the stereographic map of expression adhesives volume, and Figure 65 B is the A-A line sectional view of Figure 65 A.

Adhesive material tape 1 is twisted on the spool 3, and spool 3 is provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive material tape 1.

Adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Base material 9 uses copper film (Copper Foil).The thickness of base material 9 (representing with S among Figure 65 B) is 10 μ m, and the tensile strength of base material 9 under 25 ℃ is 500MPa, and base material 9 is 0.5 with the thickness of caking agent 11 than (S/T), and the thickness of caking agent 11 is 20 μ m.The surfaceness R of base material 9 _MaxBe 0.25 μ m.

In addition, base material 9 can also adopt aromatic polyamide film (as ミ Network ト ロ Application) to make.Thickness, tensile strength, the base material 9 of making base material 9 are all more identical with copper film respectively than (S/T) with the thickness of caking agent 11.

Next, the using method to above-mentioned adhesive material tape 1 describes.As shown in Figure 3, the spool 3 and the winding off spindle 17 of adhesive material tape 1 is installed on the adhering device 15, the front end support that twists in the adhesive material tape 1 on the spool 3 is extracted adhesive material tape 1 (arrow E among Fig. 3) out on the guide reel 22 and be installed on the winding off spindle 17.Afterwards, adhesive material tape 1 is configured on the circuit card 21, utilizes the thermal head 19 that is arranged between two spools 3,17, connect adhesive material tape 1, caking agent 11 is crimped onto on the circuit card 21 from base material 9 side pressures.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21, in case of necessity through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

The connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment of representing as Figure 29 can learn that caking agent 11 carries out crimping in the entire circumference of PDP, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in adhesive material tape 1 on the spool 3 also becomes many, and the adhesive material tape that twists on the spool 3 just is rolled onto on the winding off spindle 17 for 1 within a short period of time, and spool 3 becomes empty.

When spool 3 has become empty, end-of-use spool 3 is replaced by new spool, new spool is installed on the adhering device 15.Afterwards, as mentioned above, repeat caking agent 11 is crimped onto on the circuit card 21, base material 9 is wound up into action on the winding off spindle 17.

Consequently, base material 9 use in copper film and the aromatic polyamide film which kind of all with the 1 same operation easily of former adhesive material tape, and base material 9 can not stretch or rupture yet.And, can make the thickness of base material 9 thinner, thereby increase the number of turns of adhesive material tape, thereby can reduce the replacing frequency of spool than former (50 μ m), boost productivity.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix carries out in drying oven 29 after the drying, reels by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape of being reeled, cut into given width by longitudinal cutter 33, be wound up on the core after, with side plate 7,7 from both sides be installed to the volume core 5 on, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.

In addition, even be under the situation of the copper film of 4 μ m, 20 μ m, 25 μ m and aromatic polyamide film at the thickness of base material 9, make adhesive material tape 1, the faults such as stretching, fracture of base material 9 do not take place in actual as mentioned above trying out yet.

In addition, even at the thickness of base material 9 and caking agent 11 is under the situation of 0.01,0.05,1.0 copper film and aromatic polyamide film than (S/T), make adhesive material tape 1, the faults such as stretching, fracture of base material 9 do not take place in actual as mentioned above trying out yet.

Next, the invention to the 65th scheme～the 66th scheme describes.

These inventions relate to a kind of with electronic devices and components and circuit card, or the bonding and fixed while between the circuit card, make the formation method of the adhesives of the adhesive material tape that is electrically connected between the electrode of the two.In addition, also relate to fixing tube core at lead frame, semiconductor element mounting with support substrate and lead frame with support substrate on, the formation method of the adhesives of employed adhesive material tape in the semiconducter device bonding and fixedly semiconductor element (chip), particularly a kind of formation method of adhesives of the adhesive material-tape reel that is rolled into reel.

Next, the background technology to the invention of the 65th scheme～the 66th scheme describes.

As with bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence demonstration) screen, bare chip installation etc. and circuit card, the circuit card, make the method that is electrically connected between the electrode of the two, generally adopt adhesive material tape.In addition, adhesive material tape is used for the bonding film of lead-in wire fixing strip, LOC band, chips incorporate band, little BGACSP of lead frame etc., is used to improve all productivitys of semiconducter device, reliability.

The spy opens in the 2001-284005 communique, discloses to be coated with the adhesive material tape that is rolled into reel of adhesives on the base material.

Adhesive material tape before this, its width is about 1～3mm, the length that twists in the belt on the spool is about 50m.

Under situation about adhesive material tape being installed on the adhering device, the spool of adhesive material tape (below be called " adhesives volume ") is installed on the adhering device, the top part of pulling out adhesive material tape is installed on the winding off spindle.Afterwards, the base material side of the adhesive material tape that is rolled out from adhesives volume is utilized thermal head that caking agent is crimped onto on the circuit card etc., and residual base material is rolled onto on the winding off spindle.

Afterwards, after the adhesive material tape of adhesives volume uses up, take off the winding off spindle that the spool that uses up and volume have base material, new winding off spindle is rolled up with new adhesives be installed on the adhering device, and the top of adhesive material tape is installed on the winding off spindle.

But along with the maximization of the screen-picture of in recent years PDP etc., the bond area of circuit card also increases, and once the usage quantity of employed caking agent constantly increases.In addition, because the purposes of caking agent also enlarges, make the usage quantity of caking agent increase.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesives volume increases, because therefore more changing-over material webs spended time exists and can't realize that the production efficiency of e-machine improves this problem.

Problem hereto, someone considers to twist in by increase the number of turns of the adhesive material tape on the spool, thereby increase the bonding dosage of 1 spool, reduce the method for the replacing frequency of spool, but if the number of turns of adhesive material tape increases, the radial dimension (below be called " coil diameter ") that twists in the adhesive material tape on the spool also increases, be difficult to be installed on the existing adhering device problem that exists existing adhering device can't use.

Therefore, the purpose of the invention of the 65th scheme～the 66th scheme is, a kind of coil diameter that can not increase adhesive material tape is provided, the formation method of the adhesive material tape of the raising of the production efficiency of realization e-machine.

Next, describe with reference to the inventive embodiment of accompanying drawing the 65th scheme～the 66th scheme.At first, with reference to Figure 66 A and Figure 66 B, Figure 67, Figure 68, Fig. 4, Figure 29 and Fig. 5 the inventive embodiment 1 of the 65th scheme～the 66th scheme is described.Figure 66 A and Figure 66 B are the synoptic diagram of the formation operation of the adhesives of the adhesive material tape of expression embodiment 1, Figure 66 A for the expression with each adhesive material tape overlapping be one, one side's base material is wound up into the synoptic diagram of coiling with the operation on the spool, and Figure 66 B is the sectional view of the part that overlaps each other between the caking agent of presentation graphs 66A.Figure 67 is formed on by the synoptic diagram of the operation on the sticky object for the caking agent of expression with adhering device.Figure 68 has the stereographic map of the spool of adhesive material tape for volume.Fig. 4 is the bonding sectional view between the indication circuit plate.Figure 29 is the stereographic map of the user mode of the caking agent of expression PDP.Fig. 5 is the process picture sheet of the manufacture method of expression adhesive material tape.

Adhesive material tape 1 is wound on respectively on the spool 3,121, is provided with the side plate 7 of rolling up core 5 and being configured in the both sides of adhesive material tape 1 in each spool 3,121.Adhesive material tape 1 is made of base material 9 and caking agent 11 on the side that is coated on base material 9.

Base material 9 from the separability aspect of intensity and caking agent 11, adopts PET (polyethylene terephthalate) that OPP (extended polypropylene), tetrafluoroethylene, silicon handled etc., but is not limited thereto.

Caking agent 11 can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, polystyrene resin class, alkyd resin class are arranged, in addition,, can adopt epoxy resin, vinyl ester resinoid, third rare resene, silicone resin class as the thermosetting resin class.

Be dispersed with conducting particles 13 in the caking agent 11,, metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc. arranged as conducting particles 13.Can be by in polymer cores such as these and/or dielectric glass, pottery, plastics, coat above-mentioned conductive layer and form.In addition, can also use with insulation layer and coat the insulating coating particle that aforesaid conducting particles obtains, and conducting particles and insulating particle and use etc.On polymer cores such as heatmeltable metal such as scolding tin and plastics, form after the conductive layer, owing to have deformability by hot pressing or pressurization, the distance between electrodes after the connection reduces, during connection with the increase of the contact area of circuit, therefore having improved reliability, is unusual ideal.Be under the situation of core particularly with the high score subclass, owing to as scolding tin, there is not fusing point clearly, therefore can be at very wide connection temperature range inner control soft state, thereby can access easily and the thickness of electrode and the corresponding transom of fluctuation of flatness, thereby conducting particles scolding tin is ideal very.

Next, the using method to the adhesive material tape of present embodiment describes.Shown in Figure 66 A, the spool 3,121 of 2 adhesive material tapes 1 is installed on the adhering device 15, and reel with winding off spindle 17,18, the support of the front end of the adhesive material tape 1 of being reeled on the spool 3 with a side is extracted adhesive material tape 1 (arrow E among Figure 66 A) out on the guide reel 22 and be installed on a side the winding off spindle 17.In addition, the front end of the adhesive material tape 1 of being reeled on the spool 121 with the opposing party also is installed on the opposing party's the winding off spindle 18, extracts adhesive material tape 1 out.

The adhesive material tape of being extracted out from the spool 3,121 1 utilizes the crimping roller 122 that is configured between spool 3,121 and the thermal head 19, with each adhesive material tape 1 coincidence and be made of one.Afterwards, the base material 9 with the opposing party's adhesive material tape 1 is wound up on the winding off spindle 18.

Afterwards, a side adhesive material tape 1 is configured on the circuit card 21, utilizes thermal head 19 to connect adhesive material tape 1, caking agent 11 is crimped onto as by on the circuit card 21 of sticky object from base material 9 side pressures.Afterwards, base material 9 is rolled onto on the winding off spindle 17.

Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 that is crimped on the circuit card 21,, utilizes thermal head 19 that wired circuit 23 hot pressing are received on the circuit card 21 through polytetrafluoroethylmaterial material 24 as cushioning material.Like this, the electrode 21a of circuit card 21 and the electrode 23a of wired circuit 23 are coupled together.

Figure 29 has represented to use the connection portion of PDP26 of the adhesive material tape 1 of present embodiment, and hence one can see that, and caking agent 11 carries out crimping in the entire circumference of PDP, once use caking agent 11 caking agent 11 usage quantity with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on the spool 3,121 also becomes many, and the adhesive material tape that twists on the spool 3,121 just is rolled on the winding off spindle 17,18 for 1 within a short period of time.

In the present embodiment, in the operation before caking agent 11 is crimped onto circuit card 21, because it is the caking agent 11 of a side adhesive material tape 1 is overlapping with the caking agent 11 of the opposing party's adhesive material tape 1, form after the thickness of desired caking agent 11, caking agent 11 is crimped onto on the circuit card 21, therefore, can make the thickness of each adhesive material tape 1 be half.So, can increase the number of turns of 1 adhesive material tape 1 on the spool, can increase spendable bonding dosage in the operation significantly once changing.Therefore, can reduce the replacing operation of new adhesive material tape 1, improve the production efficiency of e-machine.

Next, with reference to Fig. 5 the manufacture method of the adhesive material tape 1 of present embodiment is described.

On the base material (spacer) that is rolled out from the machine of rolling out 25, utilize the resin of the common only about half of thickness of coater 27 coatings and the caking agent 11 that conducting particles 13 mixes, in drying oven 29, carry out after the drying, reel by former fabric width with up-coiler 31.The former fabric width of the adhesive material tape 1 of being reeled, cut into given width by longitudinal cutter 33, be wound up on the core 5, afterwards with side plate 7,7 from both sides be installed to the volume core on 5, together wire up with siccative, be preferably in and take care of under the low temperature (5 ℃～-10 ℃) and outbound.In addition, can contain stiffening agent described later in the caking agent 11 of adhesive material tape 1.

Next, other embodiment to the invention of the 65th scheme～the 66th scheme describe, below among the illustrated embodiment by part same as the previously described embodiments is put on identical symbol, omit the detailed description of this part, below mainly to describing with the foregoing description dissimilarity.

Among the described embodiment 2 of Figure 69 A, can carry out containing among the caking agent 11a adhesive material tape 1a of stiffening agent and conducting particles 13, with the two manufacturing of the adhesive material tape 1b that does not contain stiffening agent and conducting particles 13 among the caking agent 11a, shown in Figure 69 A, the adhesive material tape 1a that contains stiffening agent etc. is overlapped with the adhesive material tape 1b that does not contain stiffening agent etc. be made of one, the adhesive material tape after overlapping is crimped onto on the circuit card 21.In this case, contain stiffening agent among the caking agent 11a owing to the adhesive material tape 1a that has only a side, so do not need stiffening agent among the opposing party's the adhesive material tape 1b.Therefore, the adhesive material tape 1b that does not contain the caking agent 11b of stiffening agent does not need the low temperature keeping.Thereby can reduce the number of the adhesive material tape 1a that need carry out the low temperature keeping, carry out transportation, the keeping of adhesive material tape effectively.

In addition, be under the situation of epoxy resin at caking agent, as the stiffening agent of Resins, epoxy, can list imidazoles, imido Suan , salt, polyamine class, polythiol etc.

In addition, shown in Figure 69 B, the adhesive material tape 1a that contains a side of stiffening agent makes 2 layers of structure that contain conducting particles 13 among the caking agent 11a, because being crimped side does not contain conducting particles, thereby conducting particles 13 can not remain on conducting particles 13 between electrode 21a and the electrode 23a when thermo-compressed reliably along with resin flow flows out between the circuit of face-off mutually.

The invention of the 65th scheme～the 66th scheme is not limited to the foregoing description, can carry out various distortion in the scope of the purport of the invention that does not break away from the 65th scheme～the 66th scheme.

Though contain conducting particles 13 in the caking agent 11 of embodiment 1, also can be the caking agent 11 that does not contain conducting particles 13.

In above-mentioned, to electronic devices and components and circuit card, and the situation about being adhesively fixed between the circuit card is illustrated, but for the fixing tube core of lead frame, semiconductor element mounting with support substrate and lead frame with support substrate on, semiconducter device bonding and fixedly semiconductor element (chip) also can similarly carry out.

Next, the invention to the 67th scheme～the 72nd scheme describes.

These inventions relate to a kind of being used to provide for example with bonding between the electronic devices and components of liquid crystal display, PDP screen, EL screen, bare chip installation etc. and circuit card, the circuit card and fixed simultaneously, make the winding method of the anisotropic conductive material band, particularly anisotropic conductive material of the anisotropic conductive material that is electrically connected between the electrode of the two.

Next, the background technology to the invention of the 67th scheme～the 72nd scheme describes.

As the electronic devices and components that adopt the anisotropic conductive material band and the method for attachment between circuit card and the circuit card normally, clamping is as the anisotropic conductive material of the caking agent of film like between electrode of opposite, carries out being connected between electronic devices and components and circuit card and the circuit card by heating.In the caking agent of film like, be mixed with conducting particles in order to make mutual conducting between electrode.As resin, can adopt mixture class, the ray hardening resin (reference example such as Japanese kokai publication sho 55-104007 communique) of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.

In addition, known also have to use do not contained conducting particles, only the circuit connecting method (reference example such as Japanese kokai publication sho 60-262430 communique) of the anisotropic conductive material that is made of resin.

In the representative resin, known have, and as type thermoplastic resin, polystyrene resin class, alkyd resin class arranged, and in addition, as the thermosetting resin class, epoxy resin, silicone resin class, third rare resene arranged.In order to connect, type thermoplastic resin and thermosetting resin class all must be carried out thermo-compressed.For type thermoplastic resin, be for make resin flows obtain with by the closing force of sticky object, and for the thermosetting resin class, be in order further to carry out the hardening of resin reaction.In recent years, from the reliability that connects, the mixture class and the thermosetting resin class of thermoplastic resin and thermosetting resin have become main flow.In addition, the ray hardening resin that can connect is at low temperatures also brought into use in industry.

In addition, in recent years,, require the low temperatureization of the connection temperature of anisotropic conductive material when connecting in order to prevent to be connected the warpage and the stretching of thing.In addition, be accompanied by the expansion of the needs of the expansion of connection purposes of anisotropic conductive material and liquid crystal display, PDP screen, EL screen, bare chip installation etc., the requirement of the shortening of the production pitch time when connecting is more and more stronger.

In addition, be accompanied by the connection needs of anisotropic conductive material and the expansion of purposes, not only require the short period of time to connect, also require to boost productivity.Along with the expansion of the needs of liquid crystal display, PDP screen, EL screen, bare chip installation etc., the usage quantity of anisotropic conductive material is also in continuous increase.In addition, along with the expansion of the needs of the big flat screens of picture such as the big picture of liquid crystal display and PDP screen, anisotropic conductive material employed usage quantity in 1 screen also increases.In the past, anisotropic conductive material was to be that the reel of the caking agent of multilaminate coiled film shape on the core of circle is supplied with in the cross section, and the replacing time of spool has hindered productive raising.

On the other hand, be accompanied by the narrow limitization of liquid crystal display, the change in a narrow margin of anisotropic conductive material constantly makes progress, be wound on in the past identical circular core on reel volume can take place collapses, the qualification rate in the manufacturing process is reduced.

The invention of the 67th scheme～the 72nd scheme, in view of there being above-mentioned shortcoming, its purpose is to provide a kind of replacing timed interval that can prolong spool, can not collapse and not cause the operation reduction because of volume takes place, help to boost productivity the anisotropic conductive material band.

Below, the inventive embodiment of the 67th scheme～the 72nd scheme is described.

Figure 70 is the synoptic diagram of the inventive embodiment 1 of expression the 67th scheme～the 72nd scheme.

Shown in Figure 70, the anisotropic conductive material band of present embodiment is to have been carried out 2 layers of anisotropic conductive material that structure constitutes of the base material film (base material) 9 of lift-off processing by the caking agent 11 of film like and two sides, the coiling lamination becomes to form with a plurality of spool-like on the length direction of core 5, and what Figure 70 represented is the supply form of anisotropic conductive material.Among Figure 70, the both ends of core 5 are provided with side plate 7 respectively.In addition, the anisotropic conductive material band, constitute by base material film 9 and the film like caking agent 11 that is coated on the base material film 9 as anisotropic conductive material, prevent inorganic and organic foreign matter and pollution for the connection that is used for the precise electronic components and parts, therefore in the anisotropic conductive material band, make base material film 9 be positioned at the outside of caking agent.

Use the connection of anisotropic conductive material, require to improve and produce pitch time, require the rapid replicability of anisotropic conductive material.As mentioned above, become around the axle shape, the long anisotropic conductive material that collapses does not take place to roll up thereby can provide by lamination that anisotropic conductive material is repeatedly reeled on the length direction of the core that has side plate 7 (volume core) 5.Therefore, can prolong between the replacing time of anisotropic conductive material band, boost productivity.

In the above-mentioned anisotropic conductive material band, the tensile strength that preferably makes base material film 9 is 12kg/mm ²More than, the tension set that makes base material film 9 is 60～200%.Like this, because base material film 9 keeps certain intensity, it is less to stretch, therefore can copy at the film like caking agent 11 that will constitute anisotropic conductive material in the processing before the transom such as circuit card, the caking agent 11 that prevents film like is stretched, the thickness attenuation, and width attenuates.In addition, consider that from operation and environment this respect the thickness of base material film 9 is preferably below the 100 μ m.If base material film 9 is too thin, above-mentioned effect will variation, and therefore, the thickness of base material film 9 is preferably more than the 0.5 μ m.

In addition, as employed base material film 9 in the above-mentioned anisotropic conductive material band, from intensity and constitute the separability aspect of the caking agent of anisotropic conductive material, though can adopt PP (polypropylene), OPP (extended polypropylene), PET (polyethylene terephthalate) of silicon and fluorine lift-off processing etc., be not limited to this.

The lift-off processing of base material film 9 is handled and can easily be carried out by carrying out silicon or fluorine, and when a single face to base material film 9 carried out lift-off processing, it was poor separability to be set in the inside and outside both sides of base material film 9, thereby can prevent from the back side of base material film 9 is duplicated.In addition, when lift-off processing is carried out on the two sides of base material film 9, caking agent 11 faces of film like are carried out silicon and fluorine is handled, and make caking agent 11 masks of film like that separability be arranged.

The caking agent 11 of film like, can adopt as Resins, epoxy with thermosetting resin class of high reliability, and can realize caking agent low-stressization, help the silicone resin class of the intermiscibility of caking agent, and with above-mentioned two resinoids mutually specific energy contain free radical with what more low temperature and shorter time connected, but the caking agent 11 of film like is not limited to this.As the caking agent 11 that contains free radical, mainly use propylene class caking agent.

Figure 71 is the synoptic diagram of the inventive embodiment 2 of expression the 67th scheme～the 72nd scheme.In addition, among Figure 71 the integrant identical with Figure 70 put on identical symbol, omit its detailed description.

The anisotropic conductive material band of present embodiment, shown in Figure 71, except use has 2 kinds of base material films, with these 2 kinds of base material films caking agent is clipped in the middle outside the anisotropic conductive material that is constituted, other all have identical structure with the anisotropic conductive material band of embodiment 1.Also promptly, the anisotropic conductive material of present embodiment shown in Figure 71, is made of the caking agent 11 of film like and 2 kinds of these 3-tier architectures of base material 9a, 9b 11 of caking agents having been implemented lift-off processing.

The caking agent that constitutes anisotropic conductive material than the softish situation under, can prevent the distortion of caking agent by the next base material film of volume core side.

In addition, as the physical characteristic value of base material film 9a, 9b, the tensile strength that preferably makes base material film 9a, 9b is 12kg/mm ²More than, the tension set that makes base material film 9 is 60～200%, this point is identical with embodiment 1.Like this because the physical strength that had of base material film 9a, 9b, thereby can prevent to be accompanied by film like caking agent stretching and its filming, width are attenuated.In addition, the thickness of base material film 9a, 9b is preferably below the 100 μ m, like this can be corresponding with operation and environment this respect.

In addition, among the foregoing description 1 and the embodiment 2, constitute the caking agent 11 of the film like of anisotropic conductive material, if there is not viscosity, do not show choking phenomenon, so do not need base material film 9 or 9a, 9b, can be separately the caking agent 11 of film like be wound into spool-like.

Below embodiment is described, but the 67th scheme～invention of the 72nd scheme is not subjected to the restriction of these embodiment.

Embodiment 1

(1) making of anisotropic conductive material film

The weight ratio of making vinyl acetic monomer is 30% solution, is the Ni powder of 2.5 μ m to the average particle diameter that wherein adds 5% volume ratio.Afterwards, in above-mentioned vinyl acetic monomer solution, add the 50g phenoxy resin (high molecular expoxy resin), 20g Resins, epoxy and the 5g imidazoles that form material as film, obtain caking agent and form solution.On the other hand, for preparing that the two sides carried out that silicon handles is light blue transparent, and thickness is that (breaking tenacity is 25kg/mm for the pet film of 50 μ m ², tension set is 130%) base material film.Afterwards, use is coated with roller and is coated with above-mentioned solution on the single face of this base material film, and drying is 5 minutes under 110 ℃, and obtaining thickness is the coiled strip of the anisotropic conductive material film of 50 μ m.

(2) making of anisotropic conductive material band

Vertically cut into wide 1.5mm by coiled strip with above-mentioned anisotropic conductive material film, at the length direction of the core that has the diameter 48mm of side plate, wide 100mm (volume core) lamination of repeatedly reeling, be wound into spool-like, obtaining length is the anisotropic conductive material band of 300m.

This is wound into the anisotropic conductive material of spool-like, also be that the anisotropic conductive material band is installed on the anisotropic conductive material band automatic crimping machine, supply with under the situation of anisotropic conductive material, then can obtain the replicability of anisotropic conductive material and the good result in the tension test, and can reduce the installation number of times of spool, elimination comes from the repetition of the caused sticking operation of stretching that needed time and replicability and caking agent are installed, thereby can improve productivity.

Embodiment 2

Make the coiled strip of anisotropic conductive material band similarly to Example 1.Afterwards, on the multilayer body of base material film and caking agent, (breaking tenacity is 25kg/mm to the polyethylene terephthalate base material film of a kind of thick 25 μ m of lamination again ², tension set is 130%), make 2 base material films clamp caking agent, thereby obtain the coiled strip of the anisotropic conductive material film of 3 layers of structure.Afterwards, the same with embodiment 1, vertically cut into wide 1.5mm by the coiled strip with above-mentioned anisotropic conductive material film, be wound into spool-like at the length direction of the core that has the diameter 48mm of side plate, wide 100mm (volume core), obtaining length is the anisotropic conductive material band of 300m.

Embodiment 2 is also the same with embodiment 1, can access good productivity.

Embodiment 3

(breaking tenacity is 4.6kg/mm except the polytetrafluoroethylene film that uses thick 50 μ m ²Tension set is 350%) as outside the base material film, other are all identical with embodiment 1, obtain the coiled strip of anisotropic conductive material film, and then it is the same with embodiment 1, the coiled strip of this film is vertically cut into wide 1.5mm, be wound into spool-like by the length direction at the core that has the diameter 48mm of side plate, wide 100mm (volume core), obtaining length is the anisotropic conductive material band of 300m.In this case, also can be wound up into the length of 300m.

Comparative example 1

Identical with embodiment 1, obtain the coiled strip of anisotropic conductive material film.And then the same with embodiment 1, the coiled strip of this film is vertically cut into wide 1.5mm, be wound into same round core shape on the former spool, obtaining length is the anisotropic conductive material band of 100m.

This anisotropic conductive material band that is wound into spool-like is installed on the anisotropic conductive material band automatic crimping machine, supply with under the situation of anisotropic conductive material, though can obtain the replicability of anisotropic conductive material and the good result in the tension test, but the installation number of times of spool is 3 times of embodiment, has increased the time of the needed time being installed and being used to adjust.

Invention according to aforesaid the 1st scheme, utilize the caking agent of adhesive material tape, to extract the terminal part of end-of-use adhesive material tape (side adhesive material tape) and the top part of the new adhesive material tape of installing (the opposing party's adhesive material tape) out is bonded together, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesive material tape be installed simply.

In addition, when carrying out the replacing of new adhesive material tape at every turn, owing to needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation that guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesive material tape, improve the production efficiency of e-machine.

In addition, be bonded together because the adhesive side of a side adhesive material tape and the opposing party's adhesive material tape is overlapped each other, so strength of joint is very high.

Invention according to the 2nd scheme, when can play the action effect identical with the invention of the 1st scheme, because extracting the cut-out of end-of-use adhesive material tape out can carry out when having exposed terminal marking, therefore, can distinguish the part of cutting off and connecting operation at an easy rate, and owing to can connect, thereby can prevent the waste of adhesive material tape in the minimal position of necessity.

According to the invention of the 3rd scheme, identical with the effect of the invention of the 1st scheme, can to adhering device new adhesive material tape be installed simply, in addition, can reduce the replacing time of new adhesive material tape, improved the production efficiency of e-machine.

In addition, owing to utilize the pilot tape of adhesive material tape, the terminal part of extracting the end-of-use adhesive material tape out the top part with the new adhesive material tape of installing is bonded together, therefore, can carries out bonding between the adhesive material tape simply.

According to the invention of the 4th scheme, identical with the effect of the invention of the 1st scheme, can to adhering device new adhesive material tape be installed simply, in addition, can reduce the replacing time of new adhesive material tape, improved the production efficiency of e-machine.

In addition, owing to do not need upset to extract the end-of-use adhesive material tape out, therefore, in the time of can preventing on winding off spindle the coiling adhesive material tape volume takes place and collapse.

According to the invention of the 5th scheme,, therefore, connect very simple owing to will extract the terminal part of end-of-use adhesive material tape and the top partial fixing of the new adhesive material tape of installing out by the fastening pin.In addition, when carrying out the replacing of new adhesive material tape at every turn, needn't carry out winding off spindle replacing, the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation of guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesive material tape, improve the production efficiency of e-machine.

Invention according to the 6th scheme, since with a side's of engagement device claw fastening on the terminal part of a side adhesive material tape, afterwards with the opposing party's of engagement device claw fastening on the top of the opposing party's adhesive material tape part, the two is interconnection, therefore, connection is very simple.

Owing to have elastic component between a side claw and the opposing party's the claw, therefore can the tensile elasticity member, on the optional position of the top of the opposing party's adhesive material tape part, therefore the degree of freedom of connection is very high with the opposing party's of engagement device claw fastening.

In addition, owing under the top part state respect to one another of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape, be connected, therefore, do not need belt is overlapped each other, owing to can connect, thereby can prevent the waste of adhesive material tape with minimal position.

According to the invention of the 7th scheme,, therefore, connect very simple owing to only the terminal part of one side's adhesive material tape is just clamped and can be connected with the lap of the top part of the opposing party's adhesive material tape by clip.

According to the invention of the 8th scheme,, therefore, can improve the strength of joint of the lap of adhesive material tape owing to the two is coupled together from the two sides press nip sheet of lap.

Invention according to the 9th scheme, utilize the caking agent of adhesive material tape, the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing are coupled together, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesives volume be installed simply.In addition, when carrying out the replacing of new adhesives volume at every turn, do not need base material winding off spindle replacing and the top of new adhesive material tape is installed to operation on the winding off spindle, therefore, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

Invention according to the 10th scheme, when can play the action effect identical with the invention of the 9th scheme, make the top part of a side the terminal part of adhesive material tape and the opposing party's adhesive material tape make hook-shaped mutual fastening, and make the adhesive side of the two interconnection, so strength of joint is higher.

Invention according to the 11st scheme, when can play the action effect identical with the invention of the 9th scheme or the 10th scheme, because the terminal part of a side adhesive material tape can partly carry out in terminal marking, therefore, the part that connects operation is easier to distinguish, and can prevents the waste of adhesive material tape.

Invention according to the 12nd scheme, when can play the action effect identical with each invention in the 9th scheme～the 11st scheme, concavo-convex by forming in the connection portion, the connection area can be expanded, and the intensity of the draw direction (length direction) of the adhesive material tape of connection portion can be improved.

Invention according to the 13rd scheme, when can play the action effect identical with each invention in the 9th scheme～the 11st scheme, by form through hole in the connection portion, because caking agent oozing out in interior week at through hole, the bond area of caking agent is increased, therefore can further improve strength of joint.

Invention according to the 14th scheme, because only will extract the terminal part of end-of-use adhesive material tape (side adhesive material tape) and the top part of the new adhesive material tape of installing (the opposing party's adhesive material tape) out is bonded together, carry out the replacing of spool, therefore, can to adhering device new adhesives volume be installed simply.In addition, when carrying out the replacing of new adhesives volume at every turn, do not need winding off spindle replacing, the top of new adhesive material tape is installed to operation on the winding off spindle, and with the operation of adhesive material tape support on guide reel, therefore, can reduce the replacing time of new adhesive material tape, improve the production efficiency of e-machine.

The treatment agent of the processing base material by being used in adhesive material tape is the silicon resinoid, also uses the silicon caking agent in splicing tape, owing to can reduce the capillary poor of the two, improves closing force, and very difficult the two is bonding before therefore can realizing.

Invention according to the 15th scheme, when can play the action effect identical with the invention of the 14th scheme, the difference that the surface tension of the adhesive side by making the silicon splicing tape and the silicon of adhesive material tape are handled the surface tension of base material is below the 10mN/m (10dyne/cm), can access strong closing force, thereby the two can be bonded together reliably.

Invention according to the 16th scheme, when can play the action effect identical with the invention of the 15th scheme, by further making bonding force is more than the 100g/25mm, can carry out bonding between two adhesive side of adhesive material tape of a side and the opposing party more firmly.

According to the invention of the 17th scheme, when can play the action effect identical with the invention of the 16th scheme, owing to carry out being connected of adhesive material tape of a side and the opposing party on its two sides, so can access more firm connection.

According to the invention of the 18th scheme, owing to use the silicon splicing tape of double-sided adhesive agent, thus can between a side and the opposing party's adhesive material tape, clip two-sided silicon splicing tape with the two bonding (or driving fit), so the connection of the two is simple and easy.

According to the invention of the 19th scheme,, get up extracting the terminal part of end-of-use adhesive material tape and the top partial fixing of the new adhesive material tape of installing out, so connect very simple owing to use the resin system caking agent of pasty state.In addition, when carrying out the replacing of new adhesives volume at every turn, do not need the replacing of winding off spindle and the top of new adhesive material tape is installed to operation on the winding off spindle, and the operation that guide reel etc. is set on given route, therefore, can reduce the replacing time of new adhesive material tape, improve the production efficiency of e-machine.

Invention according to the 20th scheme, when can play the action effect identical with the invention of the 19th scheme, as resin system caking agent, can be from thermosetting resin, ray hardening resin, heatmeltable caking agent, selection is suitable for the resin system caking agent of the connection between the adhesive material tape, thereby can improve the strength of joint between the adhesive material tape.

According to the invention of the 21st scheme,, therefore do not need to prepare in addition plugger, thereby can prevent to connect the waste of operation owing to be provided with the plugger of the resin system caking agent of the 19th scheme of supply or the 20th scheme in the adhering device.

Invention according to the 22nd scheme, when the adhesive material tape extraction of being reeled in a side the winding part has been used up, the adhesive material tape of being reeled on the adjacent winding part is installed on the winding off spindle, carry out the replacing of adhesive material tape, therefore do not need new adhesive material-tape reel is installed on the adhering device.So, can reduce replacing time of new adhesive material tape, improved the production efficiency of e-machine.

Invention according to the 23rd scheme, when can play the action effect identical with the invention of the 22nd scheme, owing to pass through connecting band, the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, therefore, after the adhesive material tape of one side's adhesive material-tape reel is extracted out and used up, do not need the adhesive material tape of the opposing party's winding part is installed on the winding off spindle, can further improve the production efficiency of e-machine.

According to the invention of the 24th scheme, because connecting band can automatically be wound up on the winding off spindle, therefore after the adhesive material tape of a side winding part has been used up, can be in turn from next winding part extraction adhesive material tape.

In addition, when detecting connecting band,, therefore can save the time of coiling owing to can automatically connecting band be wound up on the winding off spindle by before the pressure contact portion up to connecting band with the band proofing unit.

Invention according to the 25th scheme, because the fastener of the connection portion of the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape is coated by adhesive material tape, therefore outward appearance is preferable, simultaneously, the fastener that can prevent the connection portion contacts with adhesive material tape and damages adhesive material tape or damage adhering device.

Invention according to the 26th scheme, when the connection section proofing unit detects the connection portion, since up to the connection portion by the winding off spindle of automatically a side adhesive material tape being reeled before the pressure contact portion on, therefore, can prevent to carry out when the connection portion from arriving pressure contact portion crimping and move this fault.In addition, owing to owing to up to the connection portion is automatically reeled a side adhesive material tape to winding off spindle before by pressure contact portion on, therefore can save the time of coiling.

According to the invention of the 27th scheme, when can play the action effect identical, can carry out the detection of connection portion with simple structure with the invention of the 26th scheme, and, can improve accuracy of detection by using these devices.

According to the invention of the 29th scheme because rule ground uses many caking agents in turn, therefore can not increase the number of turns of belt, before spendable bonding dosage in 1 spool is increased to more than 2 times.

Owing to do not increase the number of turns, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out from the width of belt, the belt that winds up is bonded together mutually causes obstruction, and then, can prevent the drawback (damage of base material and break) of stretching etc. because of the elongated base material that is easy to generate of zonal base material.

In the manufacturing works of electronic devices and components, owing to can reduce the replacing number of times of new adhesive tapes, so operating efficiency is higher.

In addition, in the manufacturing of adhesive tapes, owing to can reduce the spool number of manufacturing, therefore the usage quantity that can cut down spool material and moisture proof material reduces manufacturing expense.

Invention according to the 30th scheme, when can play the action effect identical with the invention of the 29th scheme, because making has certain distance between the adjacent strip of glue, therefore easily a rule is separated, thereby can easily be crimped onto on the circuit card.

Invention according to the 31st scheme, when can play the action effect identical with the invention of the 29th scheme, owing to only form slit in the caking agent on being coated on the whole single face of base material, therefore make and be easier to, and, because almost very close to each other between the adjacent strip of glue, thereby can increase the bar number of the strip of glue that is configured on the base material.

According to the invention of the 32nd scheme, can easily make the adhesive tapes of the 30th scheme.

According to the invention of the 33rd scheme, owing to can make 2 adhesive tapes simultaneously, it is preferable therefore to make efficient.

Invention according to the 34th scheme, heat by a part caking agent, owing to the cohesive force of this part descended and be crimped onto on the circuit card, therefore, under the situation of coating adhesive on the whole surface of the single face of base material, can former state use existing device fabrication adhesive tapes in the adhesive tapes use.

Be crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing heating region, the degree of freedom of caking agent width of carrying out crimping is higher.

The same with the invention of the 29th scheme, because therefore the caking agent on the rule heated substrate and being crimped onto on the circuit card in turn can not increase the number of turns of belt, spendable bonding dosage in 1 spool is increased to more than 2 times.

Increase bonding dosage owing to can not increasing the number of turns, therefore the same with the invention of the 29th scheme, can prevent to roll up when collapsing, can prevent the drawback of the stretching etc. of caused obstruction of oozing out of caking agent and base material.

According to the invention of the 35th scheme, because the width of adhesive tapes is more than the length on one side of circuit card, therefore, can increase bonding dosage, reduce the number of turns of adhesive tapes.

Owing to can not increase the number of turns of adhesive tapes and increase employed bonding dosage significantly, therefore can prevent to roll up when collapsing, can prevent to block and the damage of base material and breaking.In addition, in the manufacturing works of electronic devices and components, owing to can reduce the replacing number of times of new adhesive tapes, it is higher therefore to make efficient.

In addition, in the manufacturing of adhesive tapes,, therefore, can cut down the usage quantity of spool material and moisture proof material, reduce manufacturing expense owing to can increase the bonding dosage of 1 spool.

According to the invention of the 36th scheme, when can play the action effect identical with the invention of the 35th scheme, owing between the adjacent strip of glue certain distance is arranged, therefore easily a rule is carried out crimping from base material separation caking agent.

According to the invention of the 37th scheme, when can play the action effect identical, can increase the bar number of the strip of glue that is configured on the base material, and manufacturing is easier to the invention of the 35th scheme.

According to the invention of the 38th scheme, can utilize existing installation, make the adhesive tapes of 2 the 36th schemes simultaneously, it is higher therefore to make efficient.

According to the invention of the 39th scheme, can play with the 35th scheme～the 37th scheme in the identical action effect of each invention the time, crimping caking agent on one side of circuit card simply can improve the operating efficiency in the manufacturing works of electronic devices and components.

Invention according to the 40th scheme, when can play the action effect identical with each invention in the 35th scheme～the 37th scheme, do not need the rotation circuit plate just can move the position of a side adhesive tapes and the opposing party's adhesive tapes, thereby can be easily at the crimping caking agent all around of circuit card, functioning efficiency is preferable.

According to the invention of the 41st scheme, under the situation of crimping caking agent around the circuit card, adhesive tapes is carried out thermo-compressed by be strip ground along width, thereby crimping caking agent on circuit card easily, operating efficiency is preferable.

In addition since can be on the whole surface of adhesive tapes coating adhesive, therefore can former state use existing device fabrication adhesive tapes.

And then, being crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing heating region, the degree of freedom of caking agent width of carrying out crimping is higher.

In addition, the same with the invention of the 35th scheme, increase bonding dosage owing to can not increasing the number of turns, therefore, can obtain can prevent to roll up when collapsing, can prevent the effect of the caused drawback of stretching of caused obstruction of oozing out of caking agent and base material.

Invention according to the 42nd scheme, owing on its width, disposing the use of 2 caking agents and 1 rule ground on the felting agent coil at least, therefore, 1 spool can use as 2 spools at least, therefore can not increase the number of turns of adhesive tapes, and increase spendable bonding dosage in 1 spool significantly.

And, owing to do not increase the number of turns of adhesive tapes, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out and the belt that winds up is bonded together mutually from the width of adhesive tapes causes obstruction, in addition, can also prevent the drawback (damage of base material and break) of the stretching etc. of the base material that is easy to generate because of base material is elongated.

Because adhesive tapes is installed in the tape drum, so do not need in the adhering device adhesive tapes is installed to time on the spool, owing to only tape drum is installed in the adhering device, therefore operation easily, and the operation of installing and changing is preferable.

According to the invention of the 43rd scheme, when can play the action effect identical with the invention of the 42nd scheme, owing between the adjacent strip of glue certain distance is arranged, therefore easily a rule is carried out crimping from base material separation caking agent.

According to the invention of the 44th scheme, when can play the action effect identical, because adhesive tapes coating adhesive and form slit on the whole surface of the single face of base material only, therefore make and be easier to the invention of the 42nd scheme.

According to the invention of the 45th scheme, owing to can therefore can former state use existing device fabrication adhesive tapes at the whole surface coated caking agent of the base material of adhesive tapes.

Be crimped onto the width of the caking agent on the circuit card, can set arbitrarily by changing heating region, the degree of freedom of caking agent width of carrying out crimping is higher.

Invention according to the 46th scheme, can play the action effect identical with the invention of the 45th scheme, and, the same with the invention of the 1st scheme, increase bonding dosage owing to can not increasing the number of turns, therefore, can prevent to roll up when collapsing, can be prevented the effect of the caused drawback of stretching etc. of caused obstruction of oozing out of caking agent and base material.During use, after the adhesive tapes on 1 spool had been used up, owing to only need the upset tape drum to get final product, therefore ensuing installation was easy to.Because adopt tape drum, so processing ease, and the operation of installing and changing is preferable.

Invention according to the 47th scheme, owing to utilize the base material of adhesive material tape, be bonded together extracting the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing out, carry out the replacing of adhesives volume, therefore can to adhering device new adhesives volume be installed simply.In addition, when carrying out the replacing of new adhesives volume, do not need the replacing of winding off spindle and top that adhesives that will be new is rolled up to be installed to operation on the winding off spindle, therefore at every turn, can reduce the replacing time of new adhesives volume, improve the production efficiency of e-machine.

Invention according to the 48th scheme, when can play the action effect identical with the invention of the 47th scheme, because the surface of base material has heat to melt the agent layer, the heat of the terminal part of the adhesive material tape by making a side is melted the adhesive side overlaid of agent layer and top part, this part is carried out thermo-compressed and the two is coupled together, therefore connect very simple.

In addition, because heat melts on the whole length direction that the agent layer is formed on belt, so overlap length do not need to carry out tight location, and the degree of freedom of connection is higher.

Invention according to the 49th scheme, when can play the action effect identical with the invention of the 47th scheme, since heat melt the agent layer be supported the layer be clipped in the middle, therefore, can prevent that heat from melting the agent layer and being exposed in the atmosphere, because of moisture absorption that moisture caused and because of adhering to of dust caused heat melt the decline of the bonding strength of agent layer.

Invention according to the 50th scheme, that removes the base material end has carried out the surface-treated part with parting agent, utilize the terminal part that the caking agent of adhesive material tape will extract the end-of-use adhesive material tape out and the top part of the new adhesive material tape of installing to be bonded together, carry out the replacing of adhesives volume, therefore, can to adhering device new adhesives volume be installed simply.

Invention according to the 51st scheme, when can play the action effect identical with the invention of the 50th scheme, owing to use any method in plasma discharge, uviolizing, the laser radiation to remove parting agent, therefore can reliably and carry out the removal of parting agent in short time.

Invention according to the 52nd scheme, because in the adhesive material-tape reel, be provided with the winding part (coiling portion) that is wound with the adhesive material tape of adhesive material tape on a plurality of spools, therefore, in a plurality of winding parts, the adhesive material tape of 1 winding part is drawn out of when having used up, just use the adhesive material tape of extracting other winding parts of end-of-use winding part disposed adjacent with this out, therefore, do not need new adhesive material-tape reel is installed in the adhering device, can reduce the replacing time of new adhesive material-tape reel, improve the production efficiency of e-machine.In addition, owing to can use a plurality of adhesive material tapes in turn, therefore can not increase the number of turns of 1 adhesive material tape on the adhesive material-tape reel, and increase spendable bonding dosage in 1 time the replacing operation significantly.In addition, owing to do not increase the number of turns of adhesive material tape, therefore can prevent to roll up when collapsing, can prevent that caking agent from oozing out and the what is called that the belt that winds up is bonded together is mutually blocked from the width of belt, in addition, can prevent the drawback of the stretching etc. of the base material that is easy to generate because of base material is elongated.

Invention according to the 53rd scheme, owing on the side plate of spool, be provided with the accommodation section of siccative, therefore, when can play the action effect identical with the invention of the 52nd scheme, by removing the moisture in the adhesive material-tape reel internally reliably, the quality that can further suppress to be produced because of the adhesive material tape moisture absorption descends.

Invention according to the 54th scheme, since be provided with can freely install and remove on the spool be used for spool on the cover that gets up of the coating on every side of the adhesive material tape of being reeled, therefore adhesive material tape can not be directly exposed in the atmosphere, thereby can prevent the detrimentally affect that adhesive material tape brings because of dust and atmospheric humidity.Therefore, even be provided with under the situation of a plurality of winding parts,, can prevent that also the quality of adhesive material tape from descending by cover being set at untapped winding part.

In addition, because cover is configured to and can freely installs and removes, therefore, cover just taken off from adhesive material-tape reel, to extract adhesive material tape simply out.

Invention according to the 55th scheme, when can play the action effect identical with each invention in the 52nd scheme to the 54 schemes, owing to can from the opening of cover, extract adhesive material tape out, therefore do not need to take off the cover of adhesive material-tape reel, just can directly from adhesive material-tape reel, extract adhesive material tape out.

Invention according to the 56th scheme, when can play the action effect identical with each invention in the 52nd scheme to the 55 schemes, because it is chimeric that the side plate of winding part can freely be installed and removed ground mutually, therefore, after the adhesive material tape of a side winding part has been used up, by removing chimeric with the opposing party's winding part, can extract adhesive material tape out from next winding part in turn.

Invention according to the 57th scheme, the 58th scheme, can play with the 52nd scheme to the 56 schemes in the identical action effect of each invention, particularly, at adhesive material tape is the adhesive material tape that has been coated with the electrode connecting adhesive that the electrode that will face mutually couples together on the base material, is particularly useful under the situation with the fixing adhesive material tape that couples together with the tube core and the semiconductor element of support substrate, lead frame with support substrate or semiconductor element mounting of lead frame at adhesive material tape perhaps.

Invention according to the 59th scheme, because to be hold by one hand tape drum, the peristome that will expose adhesive tapes is by being pressed on the circuit card, heater block carries out thermo-compressed and caking agent is crimped onto on the circuit card from the base material side, therefore can miniaturization and can do with single behaviour's hand, and can easily carry out crimping on a part that caking agent is crimped onto substrate the time.

According to the invention of the 60th scheme, be metallic film or aromatic polyamide film by the base material that makes adhesive material tape, even under the situation of the thinner thickness of base material, also can prevent faults such as the stretching of base material and fracture.

In addition, by utilizing the adhesive material tape that base material constituted of thinner thickness, 1 number of turns on the spool is increased, thereby can increase spendable bonding dosage on 1 spool.In addition, the adhesive material tape of the application of the invention owing to the number of turns on 1 spool is more, so in the manufacturing works of electronic devices and components, can reduce the replacing number of times of new adhesive material tape, has improved operating efficiency.In addition, in the manufacturing of adhesive material tape, owing to can reduce the number of the spool of manufacturing, therefore the usage quantity that can cut down spool material and moisture proof material reduces manufacturing expense.

According to the invention of the 61st scheme, when can play the action effect identical, can access thin and the high adhesive material tape of tensile strength with the invention of the 60th scheme.

According to the invention of the 62nd scheme, when can play the action effect identical, be more than the 300MPa by the tensile strength that makes base material with the invention of the 60th scheme or the 61st scheme, make base material be difficult to be stretched or break.

Invention according to the 63rd scheme, when can play the action effect identical with each invention in the 60th scheme to the 62 schemes, thickness ratio by making base material and caking agent is between 0.01～1.0, can access adhesive material tape thinner and that tensile strength is higher.

According to the invention of the 64th scheme, when can play the action effect identical, by making the surfaceness R of base material with each invention in the 60th scheme to the 63 schemes _MaxBe below the 0.5 μ m, make the surface smoothing of base material, caking agent separates from base material easily during the crimping caking agent on circuit card.

Invention according to the 65th scheme, in the operation on by sticky object before the formation caking agent, owing to make a side the caking agent of adhesive material tape and the opposing party's the caking agent of adhesive material tape overlapping, form after the desirable thickness, again caking agent is formed on by on the sticky object, therefore, can makes the thinner thickness of each adhesive material tape, increase the number of turns of adhesive material tape, thereby can reduce the winding diameter of 1 adhesive material tape on the spool.

So, can increase the number of turns of the adhesive material tape of 1 spool, change spendable bonding dosage in the operation thereby increase by 1 time significantly.Therefore, can reduce the replacing operation of new adhesive material tape, improve the production efficiency of e-machine.

According to the invention of the 66th scheme, when can play the action effect identical, can reduce the number of the adhesive material tape that needs low temperature keeping, thereby can carry out the management such as transportation, keeping of adhesive material tape efficiently with the invention of the 65th scheme.

According to each invention in the 67th scheme～the 72nd scheme, can provide and have good replicability (adhibit quality) being connected member, and has good connection reliability, thereby can improve the qualification rate of in-process, further raising operation, the anisotropic conductive material band longer than size with former raw meat, thus productivity, operation improved.To the power supply of heater block, can utilize the switch power supply that is arranged on the tape drum, perhaps, also pressure-sensitive switch can be set on heater block, when sensing heater block and be pressed, then heater block is powered.

Claims (1)

1. the manufacture method of an adhesive material tape is manufactured on coating adhesive on the base material, and is rolled into the adhesive material tape of reel, it is characterized in that:

Coating adhesive on the whole surface of side's base material, next the width along band forms slit on caking agent, caking agent is separated into a plurality of strip of glue, then, configuration the opposing party base material is also clamped caking agent with a side and the opposing party's base material on adhesive side, put a strip of glue and heating and pressurizing by being sidelong from a side and the opposing party's base material, thereby on each of a side and the opposing party's base material, alternately paste a plurality of strip of glue, next by a side and the opposing party's base material is disconnected from each other, dispose many caking agents and on a side and the opposing party's base material, leave the compartment of terrain.

Images