CN105820769A - Silicone tape seamless connection end structure - Google Patents

Silicone tape seamless connection end structure Download PDF

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Publication number
CN105820769A
CN105820769A CN201610262097.2A CN201610262097A CN105820769A CN 105820769 A CN105820769 A CN 105820769A CN 201610262097 A CN201610262097 A CN 201610262097A CN 105820769 A CN105820769 A CN 105820769A
Authority
CN
China
Prior art keywords
silicone
silicone band
adhesive tape
end structure
isolating membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610262097.2A
Other languages
Chinese (zh)
Inventor
韩宝清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Baoyi Automation Technology Co Ltd
Original Assignee
Hefei Baoyi Automation Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Baoyi Automation Technology Co Ltd filed Critical Hefei Baoyi Automation Technology Co Ltd
Priority to CN201610262097.2A priority Critical patent/CN105820769A/en
Publication of CN105820769A publication Critical patent/CN105820769A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Replacement Of Web Rolls (AREA)

Abstract

The invention discloses a silicone tape seamless connection end structure. The structure comprises silicone tapes to be connected and isolating membranes, wherein the adhesive sides of the silicone tapes are downward and stick to the front of the isolating membranes; connecting ends of the two silicone tapes are close to each other and are spliced; a conductive adhesive tape sticks to the adhesive sides in the splicing position; the front of the isolating membranes on the adhesive sides of the silicone tapes covers the conductive adhesive tape; the lower end faces, at adhesive tape openings, of the two isolating membranes are connected by an adhesive tape through sticking. By adopting the structure, the problems that drums are changed frequently during adhesive sticking of automatic adhesive sticking machines and fracture easily happens between the silicone tapes are solved and the length exceeding that stipulated on the market can be customized according to the requirements of customers.

Description

A kind of silicone band seamless link end structure
Technical field
The present invention relates to silicone band automatic viscose glue technical field, be specifically related to a kind of silicone band seamless link end structure.
Background technology
Existing employing on silicone band is pasted artificially manually is puted up, without the worry of silicone band fracture more;But when pasting silicone band and using automatic adhesive sticking machine to paste, every reel probably needs 500 meters, an existing volume silica gel is mostly about 100 meters length, reel is changed frequent during automatic rubberizing, by common bonding way, article two, silicone band connection is improper, easily disconnects when pullling, and causes taking silicone band failure or receiving isolating membrane failure;Therefore, under existing market condition, it is badly in need of a solid and reliable connecting method of silicone band or structure solves problem instantly.
Summary of the invention
For the deficiencies in the prior art, the present invention provides a kind of silicone band seamless link end structure, and when overcoming automatic adhesive sticking machine rubberizing, changing bobbins is frequent, and the problem of easy fracture between silicone band, can customize according to the requirement of client and exceed the length of regulation on market.
The technical problem to be solved can be to realize by the following technical programs:
A kind of silicone band seamless link end structure, including silicone band to be connected and isolating membrane, described silicone band glue surface is downward, paste the front of isolating membrane, the connection end of two described silicone bands is near phase split, position glue surface in its phase split is pasted with conductive tape, and the front of the described isolating membrane in silicone band glue surface is covered on conductive tape, and two described isolating membrane adhesive tape Kou Chu lower surfaces are provided with adhesive tape sticking and connect.
Described conductive tape is corresponding with position, lower surface in isolating membrane upper surface with adhesive tape.
Described silica gel bandwidth 50-80mm.
Described silica gel bandwidth 60mm.
Described conductive tape and adhesive tape are long 6mm, wide 60mm.
Compared with prior art, the invention have the benefit that
The present invention two silicone band glue surface is downward, pastes the front of isolating membrane;Conductive tape is glue-free towards upper, with the mosaic adhesion of silica gel;The glue surface of conductive tape is downward, then with the phase adhesion of isolating membrane front;At isolating membrane reverse side, adhesive tape glue surface upwards, with isolating membrane reverse side phase adhesion;Volume one silicone band 100 meters is long, and the silicone band through seamless link is 500 meters, and joint does not turns off, and drastically increases the efficiency automatically pasting silica gel machine.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram;
Fig. 2 is perspective view of the present invention.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that, described embodiment is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
A kind of silicone band seamless link end structure, including silicone band 1 to be connected and isolating membrane 2, described silicone band 1 glue surface is downward, paste the front of isolating membrane 2, the connection end of two described silicone bands 1 is near phase split, position glue surface in its phase split is pasted with conductive tape 3, and the front of the described isolating membrane 2 in silicone band 1 glue surface is covered on conductive tape 3, and two described isolating membrane 2 adhesive tape Kou Chu lower surfaces are provided with adhesive tape 4 and paste connection;Described conductive tape 3 is corresponding with position, lower surface in isolating membrane upper surface with adhesive tape 4.During operation, the first step, by two silicone band 1 interface splits, glue surface and conductive tape 3 are without glue surface adhesion;Second step, the conductive tape 3 glue surface adhesion of two isolating membrane 2 seams is lived;3rd step, glues with adhesive tape 4 glue surface below isolating membrane 2, in order to isolating membrane 2 reclaims mutually;Silicone band through seamless link is 500 meters, and joint does not turns off, and drastically increases the efficiency automatically pasting silica gel machine.
It should be noted that, in this article, such as term " includes ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include that the process of a series of key element, method, article or equipment not only include those key elements, but also include other key elements being not expressly set out, or also include the key element intrinsic for this process, method, article or equipment.In the case of there is no more restriction, statement " including ... " key element limited, it is not excluded that there is also other identical element in including the process of described key element, method, article or equipment.
Above example only in order to technical scheme to be described, is not intended to limit;Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent;And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (5)

1. a silicone band seamless link end structure, including silicone band to be connected and isolating membrane, it is characterized in that: described silicone band glue surface is downward, paste the front of isolating membrane, the connection end of two described silicone bands is near phase split, position glue surface in its split is pasted with conductive tape, and the front of the described isolating membrane in silicone band glue surface is covered on conductive tape, and two described isolating membrane adhesive tape Kou Chu lower surfaces are provided with adhesive tape sticking and connect.
2. a kind of silicone band seamless link end structure as claimed in claim 1, it is characterised in that described conductive tape is corresponding with position, lower surface in isolating membrane upper surface with adhesive tape.
3. a kind of silicone band seamless link end structure as claimed in claim 1, it is characterised in that described silica gel bandwidth 50-80mm.
4. a kind of silicone band seamless link end structure as claimed in claim 1, it is characterised in that described silica gel bandwidth 60mm.
5. a kind of silicone band seamless link end structure as claimed in claim 1, it is characterised in that described conductive tape and adhesive tape are long 6mm, wide 60mm.
CN201610262097.2A 2016-04-22 2016-04-22 Silicone tape seamless connection end structure Pending CN105820769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610262097.2A CN105820769A (en) 2016-04-22 2016-04-22 Silicone tape seamless connection end structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610262097.2A CN105820769A (en) 2016-04-22 2016-04-22 Silicone tape seamless connection end structure

Publications (1)

Publication Number Publication Date
CN105820769A true CN105820769A (en) 2016-08-03

Family

ID=56527410

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610262097.2A Pending CN105820769A (en) 2016-04-22 2016-04-22 Silicone tape seamless connection end structure

Country Status (1)

Country Link
CN (1) CN105820769A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111318958A (en) * 2018-12-17 2020-06-23 Agc株式会社 Film body for holding glass substrate and method for polishing glass substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194359A (en) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same
CN101649166A (en) * 2002-07-30 2010-02-17 日立化成工业株式会社 Method of producing adhesive material tape
CN102382581A (en) * 2010-06-14 2012-03-21 日立化成工业株式会社 An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
CN203256203U (en) * 2013-07-15 2013-10-30 刘萍娇 Tape allowing end to be torn off conveniently
CN104194664A (en) * 2014-08-22 2014-12-10 桐城信邦电子有限公司 Conductive tape

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101649166A (en) * 2002-07-30 2010-02-17 日立化成工业株式会社 Method of producing adhesive material tape
JP2009194359A (en) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same
CN102382581A (en) * 2010-06-14 2012-03-21 日立化成工业株式会社 An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
CN203256203U (en) * 2013-07-15 2013-10-30 刘萍娇 Tape allowing end to be torn off conveniently
CN104194664A (en) * 2014-08-22 2014-12-10 桐城信邦电子有限公司 Conductive tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111318958A (en) * 2018-12-17 2020-06-23 Agc株式会社 Film body for holding glass substrate and method for polishing glass substrate
CN111318958B (en) * 2018-12-17 2023-07-14 Agc株式会社 Film for holding glass substrate and method for polishing glass substrate

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20160803