CN110304480A

CN110304480A - Adhesive tape engagement device

Info

Publication number: CN110304480A
Application number: CN201910194512.9A
Authority: CN
Inventors: 奥野长平
Original assignee: Ridong Precision Machine Co Ltd; Nitto Denko Corp
Current assignee: Ridong Precision Machine Co Ltd; Nitto Denko Corp
Priority date: 2018-03-27
Filing date: 2019-03-14
Publication date: 2019-10-08
Anticipated expiration: 2039-03-14
Also published as: KR20190113530A; JP7065555B2; JP2019172393A; CN110304480B; TWI793214B; KR102548801B1; TW201942994A

Abstract

The present invention provides a kind of adhesive tape engagement device, need not reuse the adhesive tape of engagement, it will be able to strongerly be bonded to each other the end of adhesive tape.Leading adhesive tape (T1) is cut off from adhesive tape volume (27A), and in a part of the middle subsequent adhesive tape (T2) of cutting of bonding ribbon preparing department (33) and makes bonding ribbon CT.After the adhesive tape volume (27A) for being located at supply position is switched to other adhesive tape volume (27B), the rear end of the front end for the subsequent adhesive tape (T2) released from adhesive tape volume (27B) and the leading adhesive tape (T1) cut off from adhesive tape volume (27A) is joined together using bonding ribbon (CT).

Description

Adhesive tape engagement device

Technical field

The present invention relates to one kind to be pasted on semiconductor crystal wafer, LED (Light emitting diode), electronic circuit etc. During the supply of the adhesive tape of various substrates, the rear end of the adhesive tape of Xiang Xianhang engages the bonding of the front end of subsequent adhesive tape Band engagement device.

Background technique

Semiconductor crystal wafer (hereinafter, appropriately referred to as work " wafer ") be formed on its surface there are many element circuit pattern.Example Such as, convex block, fine circuits are formed in crystal column surface.Therefore, dirt when being overleaf ground in order to prevent with circuit face when conveying Dye and damage, are pasted with the adhesive tape of protection.

Here, previous structure with sticker of the explanation for the surface mount adhesive tape in wafer.Previous band is viscous Label apparatus 101 as shown in figure 30, has band supply unit 103, separate sheet stripping portion 105, holding station 107, band paste section 109, band Cutting mechanism 111, band recoverer 113 and separate sheet recoverer 115 etc..

Adhesive tape TS is released and guided from the supply spool that adhesive tape is rolled up is filled with supply unit 103, the adhesive tape It is wound with the adhesive tape TS with separate sheet of circuit protection.Separate sheet stripping portion 105 is removed from the adhesive tape TS of releasing Separate sheet S.The absorption of holding station 107 keeps the wafer W that face-up state is formed in circuit.An example with paste section 109 Son is Sticking roller, is moved horizontally to the left in Figure 30.It is moved horizontally by this, will remove separate sheet S's with paste section 109 Adhesive tape T is pasted on the wafer W in holding station 107.

Band cutting mechanism 111 has a cutter 111a, the rotation of the vertical axis shown in the appended drawing reference P of band cutting mechanism 111, To which adhesive tape T is cut by the shape along wafer W.The i.e. unwanted band Tn of the adhesive tape T of unwanted part after cutting exists It constitutes and is wound as scroll-like and recycles on the wireline reel with recoverer 113.In addition, the separate sheet S removed from adhesive tape T is in structure It is wound as scroll-like on wireline reel at separate sheet recoverer 115 and recycles.

In such band sticker, it is lower than a certain amount of situation in the loadings with the adhesive tape T in supply unit 103 Under, or being recovered to the amount of unwanted band Tn etc. in recoverer 113 is more than to need to exchange roller in a certain amount of situation. It is previous with the exchange for carrying out roller in sticker 101 in the case where, operator needs manually to carry out complicated operation.

That is, needing to carry out to roll up the cutting of the adhesive tape T released from adhesive tape in band supply unit 103, the friendship that adhesive tape is rolled up A series of operations such as the engagement of the adhesive tape T change, being cut off and the releasing again of adhesive tape T.Also, in band recoverer 113 In, needs to carry out the cutting of unwanted band Tn, engaged with the removal of the unwanted band Tn of scroll-like recycling, to wireline reel Unwanted band Tn and a series of operations for again wrapping around unwanted band Tn etc..These systems are carried out in previous device During the operation of column, the operation of band of discontinuance sticker is needed.

In recent years, in order to avoid the decline of sticking efficiency caused by the outage with sticker, automatic progress has been attempted The exchanging operation of roller, the operation that especially end of cut-off adhesive tape T is engaged with each other.As its an example, propose with Lower such band joint method (referring for example to patent document 1).That is, being pasted in the rear end of the leading adhesive tape with separate sheet Adhesive tape, that is, bonding ribbon of engagement.

After having pasted bonding ribbon, the rear end for pasting the adhesive tape with separate sheet of bonding ribbon is pressed on subsequent The front end of adhesive tape with separate sheet engaged.By such method, leading glue can be made by bonding ribbon The end of crossed belt and subsequent adhesive tape is engaged with each other.

Patent document 1: Japanese Unexamined Patent Publication 2014-133616 bulletin

Summary of the invention

Problems to be solved by the invention

But there is a problem of in above-mentioned previous device following.

That is, needing in addition to prepare to claim when engaging leading adhesive tape and subsequent adhesive tape in previous device Make the bonding ribbon of the 3rd adhesive tape.Further, since separately needing to carry out the device of supply and the stickup of bonding ribbon, therefore, make to bond The device enlargement that band is engaged with each other.

Also, the non-adhering face of the rear end of the adhesive surface of bonding ribbon and leading adhesive tape and the front end of subsequent adhesive tape Non-adhering face be in contact.Therefore, the bonding force and bonding ribbon of bonding ribbon CT and leading adhesive tape and subsequent adhesive tape Bonding force it is weaker.Thus, also worry should articulate leading adhesive tape and subsequent adhesive tape remove mutually and send out Raw joint error such problems.

The present invention has been made in view of such circumstances, and main purpose is that engagement need not be reused by providing one kind The adhesive tape engagement device that the end of adhesive tape can be engaged with each other by adhesive tape strongerly.

The solution to the problem

The present invention takes following such structure to reach such purpose.

That is, a kind of adhesive tape engagement device, the end of the adhesive tape of strip is bonded to each other,

The adhesive tape engagement device is characterized in that, is included

Band supply unit, the adhesive tape volume with multiple adhesive tapes are configured at supply position from multiple adhesive tape volumes The 1st adhesive tape volume set releases adhesive tape；

Cutting mechanism will be located at the 1st adhesive tape of supply position from the volume of multiple adhesive tapes possessed by supply unit Roll up release the 1st adhesive tape predetermined position cut off, and by the 1st adhesive tape from the 1st adhesive tape cut roll from；

1st bonding ribbon manufacturing mechanism, by the 1st adhesive tape from the volume of multiple adhesive tapes possessed by supply unit A part cutting for rolling up any one of the 1st adhesive tape released and the 2nd adhesive tape released from the 2nd adhesive tape volume, comes Make the bonding strap of engagement；

Bonding ribbon holding member keeps the bonding strap；

Roller switching mechanism keeps the band supply unit mobile, the adhesive tape for being configured at supply position is rolled up from the described 1st and is glued Crossed belt cut roll is changed to the 2nd adhesive tape volume；And

Adhesive tape engaging mechanism, using it is described bonding strap by from the 1st adhesive tape cut roll from it is described 1st bonding The rear end of band and the front end for the 2nd adhesive tape released from the 2nd adhesive tape volume are joined together.

(function and effect) according to the present invention, the 1st bonding ribbon manufacturing mechanism glues coalesced object i.e. the 1st adhesive tape and the 2nd A part of any one of crossed belt is cut off and makes the bonding strap of engagement.Also, adhesive tape engaging mechanism is viscous using this The front end of the rear end of 1st adhesive tape and the 2nd adhesive tape is joined together by crossed belt piece.

In this case, coalesced object i.e. a part of the 1st adhesive tape or the 2nd adhesive tape is used as to the adhesive tape of engagement Piece.Therefore, when adhesive tape is engaged with each other, it is not necessary to prepare the band different from i.e. each adhesive tape of coalesced object in advance as connecing The adhesive tape shared.In addition, also need not to the structure being arranged with engagement device for supplying other bands, for by other bands It is pasted on the structure of the adhesive tape of coalesced object.Therefore, it can be avoided the state of affairs of the preparation complication of the engagement of adhesive tape, band connects Attach together the state of affairs of the enlargement set and incurred cost rising.

Also, the characteristic of the bonding strap for the engagement for engaging the rear end of the 1st adhesive tape and the front end of the 2nd adhesive tape with The characteristic of coalesced object is identical.Therefore, it can reliably avoid the bonding force between bonding strap and the 1st adhesive tape lower in this way The state of affairs, the lower such state of affairs of bonding force between bonding strap and the 2nd adhesive tape.Therefore, it can be prevented more reliably Lead to the generation of joint error because removing again in bonding part.

In addition, in the present invention as stated above, it is preferred that the adhesive tape engaging mechanism it is described bonding strap adhesive surface with The adhesive surface of the front end portion of the adhesive surface and the 2nd adhesive tape of the rear end part of 1st adhesive tape is facing each other Under state, the front end of the rear end of the 1st adhesive tape and the 2nd adhesive tape is joined together using the bonding strap.

(function and effect) according to this structure, adhesive tape engaging mechanism is in the adhesive surface and the 1st adhesive tape for bonding strap In the state that the adhesive surface of the front end portion of the adhesive surface of rear end part and the 2nd adhesive tape is facing each other, bonding strap is utilized The front end of the rear end of 1st adhesive tape and the 2nd adhesive tape is joined together.That is, when being engaged, the rear end of the 1st adhesive tape The adhesive surface of the front end portion of the adhesive surface and the 2nd adhesive tape that divide is towards identical direction, on the other hand, bonds the viscous of strap Conjunction face and the adhesive surface of each adhesive tape are facing.

Therefore, bond the adhesive surface of strap by respectively with the adhesive surface and the 2nd adhesive tape of the rear end part of the 1st adhesive tape The adhesive surface of front end portion be in contact to be engaged.In this case, the bonding force of bonding part is not only by bonding strap Bonding force influence, also influenced by the bonding force of the 1st adhesive tape and the 2nd adhesive tape.Thus, it is possible to further increase bonding part Bonding force therefore can more reliably avoid the generation of the joint error of bonding part.

In addition, in the present invention as stated above, it is preferred that each adhesive tape volume will add the adhesive tape for having separate sheet Release, adhesive tape engagement device have separate sheet engaging mechanism, the separate sheet engaging mechanism will from the 1st adhesive tape cut roll from The 1st separate sheet rear end and be joined together from the front end of the 2nd separate sheet that the 2nd adhesive tape volume is released.

(function and effect) according to this structure, from the 1st adhesive tape cut roll from the 1st separate sheet rear end and from the 2nd bonding The front end of the 2nd separate sheet with volume releasing utilizes separate sheet engaging mechanism to engage.That is, adhesive tape is engaged with each other and becomes continuous Strip, and separate sheet also engages each other and becomes continuous strip.Therefore, it is not only adhesive tape, it also can be to separation Piece carries out continuously winding recycling, and therefore, device being capable of for longer periods continuous operation.

In addition, in the present invention as stated above, it is preferred that the separate sheet engaging mechanism has heating mechanism, the heating mechanism At least one of the rear end of 1st separate sheet and the front end of the 2nd separate sheet are heated,

1st separate sheet and the 2nd separate sheet are made of the material that can be engaged by heat bonding.

(function and effect) according to this structure, separate sheet engaging mechanism will be before the rear end of the 1st separate sheet and the 2nd separate sheet At least one of end heating, so as to which the 1st separate sheet and the 2nd are separated chip bonding.It therefore, can more suitably will be each A separate sheet is engaged with each other.

In addition, in the present invention as stated above, it is preferred that the adhesive tape engagement device includes

3rd adhesive tape volume, for giving the 1st adhesive tape 3rd bonding different with the characteristic of the 2nd adhesive tape Band；

2nd bonding ribbon manufacturing mechanism cuts off a part of the 3rd adhesive tape and makes the bonding strap of engagement；

Selection mechanism, the characteristic of characteristic or the 2nd adhesive tape based on the 1st adhesive tape, select the 1st mode and Arbitrary patterns in 2nd mode；And

Control mechanism controls the 1st bonding ribbon manufacturing mechanism and the described 2nd based on the selection of the selection mechanism Bonding ribbon manufacturing mechanism,

The control mechanism is controlled as follows,

In the case where having selected 1 mode, the control for stopping the 2nd bonding ribbon manufacturing mechanism is carried out, and make 1st bonding ribbon manufacturing mechanism work, to cut off a part of any one of the 1st adhesive tape and described 2nd adhesive tape simultaneously The bonding strap of engagement is made,

In the case where having selected 2 mode, the control for stopping the 1st bonding ribbon manufacturing mechanism is carried out, and make 2nd bonding ribbon manufacturing mechanism work, to cut off a part of the 3rd adhesive tape and make the bonding strap of engagement.

(function and effect) according to this structure, which rolls up with the 3rd adhesive tape, and can be based on connecing The object i.e. characteristic of the 1st adhesive tape or the 2nd adhesive tape is closed suitably to select any one of the 1st mode and the 2nd mode.And In the case where having selected the 1st mode, the 1st bonding ribbon manufacturing mechanism works, and uses the one of the 1st adhesive tape or the 2nd adhesive tape Part and the bonding strap for making engagement.On the other hand, in the case where having selected 2 mode, the 2nd bonding ribbon manufacturing mechanism It works, the bonding strap of engagement is made using the 3rd adhesive tape.

In this case, the case where the characteristic of the 1st adhesive tape or the 2nd adhesive tape is not suitable for the bonding strap of engagement Under, the 2nd mode is selected, using the 3rd adhesive tape appropriate as the bonding strap of engagement.Therefore, the 3rd bonding can be utilized 1st adhesive tape and the 2nd adhesive tape are securely engaged by band.

On the other hand, in the case where the characteristic of the 1st adhesive tape or the 2nd adhesive tape is suitble to the bonding strap of engagement, choosing The 1st mode is selected, is engaged the 1st adhesive tape and the 2nd adhesive tape using a part of the 1st adhesive tape or the 2nd adhesive tape.Thus, It, can be into no matter the characteristic of the 1st adhesive tape and the 2nd adhesive tape by suitably distinguishing using the 1st mode and the 2nd mode The mutual engagement of row adhesive tape.That is, can be improved the versatility of adhesive tape engagement device.Also, the 3rd adhesive tape need not used In the case where capable of engaging, the mutual engagement of adhesive tape is carried out with the 1st mode, therefore, is able to suppress the bonding of auxiliary material the i.e. the 3rd The consumption of band, and can more reliably avoid that joint error occurs when the 1st adhesive tape and the 2nd adhesive tape engage.

The effect of invention

Adhesive tape engagement device according to the present invention has the end of the adhesive tape of strip of separate sheet to connect each other will add When conjunction, the bonding strap of engagement is made using coalesced object, that is, adhesive tape a part, will be bonded using the bonding strap The end of band is engaged with each other.Therefore, when preparing coalesced object, that is, adhesive tape, it is not necessary in addition prepare the bonding strap of engagement. In addition, coalesced object, that is, adhesive tape is identical as the bonding characteristic of structural material of strap of engagement, therefore, can reliably keep away Exempt from the lower such state of affairs of bonding force between the bonding strap of engagement and coalesced object i.e. adhesive tape.It is further possible to anti- The only enlargement of adhesive tape engagement device, cost increase.

Detailed description of the invention

Fig. 1 is the main view for indicating the basic structure of adhesive tape joining apparatus of embodiment 1.

Fig. 2 is the figure for indicating the structure with feed unit of embodiment 1.

(a) of Fig. 2 is the perspective view with feed unit, and (b) of Fig. 2 is the main view with feed unit.

Fig. 3 is the figure for indicating the structure with supply unit and separate sheet stripping portion of embodiment 1.

Fig. 4 is the figure for indicating the structure of bonding ribbon preparing department of embodiment 1.

Fig. 5 is the figure for indicating the structure of separation chip bonding unit of embodiment 1.

Fig. 6 is the cross-sectional view for indicating the structure of the adhesive tape with separate sheet of embodiment 1.

Fig. 7 is the flow chart for indicating the movement of adhesive tape joining apparatus of embodiment 1.

(a) of Fig. 7 is the flow chart for indicating the summary of the movement to bonding wafer adhesive tape, and (b) of Fig. 7 is to illustrate step The flow chart of the detailed content of the movement of S7.

Fig. 8 is the figure for indicating the movement of step S2 of embodiment 1.

(a) of Fig. 8 is the figure for indicating state of the adhesive tape joining before wafer, and (b) of Fig. 8 is to indicate adhesive tape joining The figure of state after wafer.

Fig. 9 is the figure for indicating the movement of step S3 of embodiment 1.

Figure 10 is the figure for indicating the movement of step S4 of embodiment 1.

Figure 11 is the figure for indicating the structure with engagement device when the step S7 of embodiment 1 starts.

Figure 12 is the figure for indicating to cut off the movement of leading adhesive tape in the step S7-1 of embodiment 1.

(a) of Figure 12 is to indicate that knife unit is configured at the figure of the state of initial position, and (b) of Figure 12 is to indicate cutter list For member to the figure of the mobile state of cutting ready position, (c) of Figure 12 is to indicate that knife unit is moved to cutting execution position and cuts Break leading adhesive tape state figure, (d) of Figure 12 is release direction (direction the L) observation of steps indicated from leading adhesive tape The cross-sectional view that the positional relationship of knife unit and leading adhesive tape in S7-2 obtains.

Figure 13 is the figure for indicating to cut off the movement of leading separate sheet in the step S7-1 of embodiment 1.

(a) of Figure 13 is to indicate that knife unit is configured at the figure of the state of initial position, and (b) of Figure 13 is to indicate cutter list For member to the figure of the mobile state of cutting ready position, (c) of Figure 13 is to indicate that knife unit is moved to cutting execution position and cuts The figure of the state for leading separate sheet of breaking.

Figure 14 is the figure for indicating the movement of step S7-2 of embodiment 1.

(a) of Figure 14 is to indicate that knife unit is configured at the figure of the state of initial position, and (b) of Figure 14 is to indicate cutter list Member is moved to cutting execution position and cuts off subsequent adhesive tape to make the figure of the state of bonding ribbon, and (c) of Figure 14 is to indicate The figure of the outline structure with engagement device after each process completion until step S7-3.

Figure 15 is the figure for indicating the movement of step S7-3 of embodiment 1.

(a) of Figure 15 is to indicate that bonding ribbon holding member is configured at the figure of the state of cutting ready position, and (b) of Figure 15 is Indicate that bonding ribbon holding member is displaced to the figure of the state after engaging ready position from cutting ready position, (c) of Figure 15 is Indicate that leading adhesive tape holding member is configured at the figure of the state by near position, (d) of Figure 15 is to indicate that leading adhesive tape is kept Figure of the component from the state moved by near position to retreating position.

Figure 16 is the figure for indicating the movement of step S7-4 of embodiment 1.

(a) of Figure 16 is the state with engagement device for indicating handover configurations before the adhesive tape volume of supply position Figure, (b) of Figure 16 are the figures for indicating state with engagement device of the handover configurations after the adhesive tape volume of supply position.

Figure 17 is the figure for indicating the movement of step S7-5 of embodiment 1.

(a) of Figure 17 is to indicate that bonding ribbon holding member is configured at the figure of the state of engagement ready position, and (b) of Figure 17 is It indicates that bonding ribbon holding member is displaced to from engagement ready position and engages execution position and by the figure for the state for pressing against bonding ribbon, figure 17 (c) is the state for the holding for indicating the mutual engagement completion of the adhesive tape carried out by bonding ribbon and relieving adhesive tape Figure, (d) of Figure 17 are the figures for indicating to start again at the state for releasing the adhesive tape that engagement completes.

Figure 18 is the figure for indicating the movement of step S7-6 of embodiment 1.

(a) of Figure 18 is to indicate that leading separate sheet holding member is configured at the figure of the state of engagement ready position, Figure 18's It (b) is to indicate that leading separate sheet holding member is displaced to engagement execution position from engagement ready position and heats leading separate sheet The figure of the state of later separation piece is pressed on, (c) of Figure 18 is to indicate that the mutual engagement of separate sheet is completed and relieves separate sheet Holding state figure.

Figure 19 is the figure for indicating the movement of step S7-5 and step S7-6 of embodiment 1.

(a) of Figure 19 is to indicate that band in the state of the mutual engagement of execution adhesive tape engagement mutual with separate sheet connects The figure for the outline structure set is attached together, (b) of Figure 19 is to indicate to complete in the mutual engagement of adhesive tape and the mutual engagement of separate sheet In the state of the outline structure with engagement device figure.

Figure 20 be the problem of illustrating previous structure and by embodiment 1 structure generate effect figure.

(a) of Figure 20 is that one-side band is used as bonding ribbon to execute the bonding part in the case where previous joint method Cross-sectional view, (b) of Figure 20 are that double-sides belt is used as bonding ribbon to execute the bonding part in the case where previous joint method Cross-sectional view, (c) of Figure 20 be execute embodiment 1 joint method in the case where bonding part cross-sectional view.

Figure 21 is the figure for indicating the structure with engagement device when the step S7 of embodiment 2 starts.

Figure 22 is the figure for indicating the movement of step S7-1 of embodiment 2.

(a) of Figure 22 is the figure for indicating to cut off the state before leading adhesive tape and leading separate sheet, and (b) of Figure 22 is table Show the figure for cutting off the state after leading adhesive tape and leading separate sheet.

Figure 23 is the figure for indicating the movement of step S7-2 of embodiment 2.

Figure 24 is the figure for indicating the movement of step S7-3 of embodiment 2.

Figure 25 is the figure for indicating the movement of step S7-4 of embodiment 2.

(a) of Figure 25 is the state with engagement device for indicating handover configurations before the adhesive tape volume of supply position Figure, (b) of Figure 25 are the figures for indicating state with engagement device of the handover configurations after the adhesive tape volume of supply position.

Figure 26 is the figure for indicating the movement of step S7-5 and step S7-6 of embodiment 2.

(a) of Figure 26 is the figure for indicating to start the state before the mutual engagement of adhesive tape and the mutual engagement of separate sheet, (b) of Figure 26 is the figure for indicating to execute the state of the mutual engagement of adhesive tape and the mutual engagement of separate sheet.

Figure 27 is the figure with engagement device for indicating variation.

(a) of Figure 27 is viscous in the case where the engagement using the thicker adhesive tape of substrate to execute the adhesive tape of embodiment The cross-sectional view of the bonding part of crossed belt, (b) of Figure 27 are the figures for indicating the outline structure with engagement device of variation.

Figure 28 is the figure for indicating the movement with engagement device of variation.

(a) of Figure 28 is the figure for indicating the original state of the subsequent adhesive tape when step S7 of variation starts, Figure 28's It (b) is the figure for indicating the state in the step S7-2 of variation before the cutting of beginning adhesive tape F, (c) of Figure 28 is to indicate The figure for the state that the process of the step S7-2 of variation is completed and bonding ribbon has made.

Figure 29 is the figure for indicating the movement with engagement device of variation.

(a) of Figure 29 is the figure of the state before the process for indicating the step S7-5 of variation starts, and (b) of Figure 29 is table Show the step S7-5 process for executing variation and the figure of state that adhesive tape is bonded to each other.

Figure 30 is the figure for indicating the structure with sticker of previous example.

Description of symbols

1, adhesive tape joining apparatus；3, band engagement device；5, holding station；7, band application unit；9, band cutting unit；11, Band stripping unit；13, band recoverer；15, separate sheet recoverer；17, band feed unit；19, leading adhesive tape holding member； 21, chip bonding unit is separated；27, adhesive tape is rolled up；29, band supply unit；31, separate sheet stripping portion；33, bonding ribbon preparing department；36, Separate sheet holding member；41, adhesive tape holding member；43, bonding ribbon holding member；45, knife unit；47, leading separate sheet Holding member；49, knife unit；50, heater；TS, band (adhesive tape with separate sheet)；T, adhesive tape；S, separate sheet；B, Substrate；C, adhesive layer.

Specific embodiment

[embodiment 1]

Illustrate the embodiment of the present invention 1 referring to the drawings.Fig. 1 is the adhesive tape engagement device for indicating to have embodiment 1 Adhesive tape joining apparatus 1 basic structure main view.In addition, use is omitted in the figure for showing adhesive tape joining apparatus 1 In the diagram of the bearing part for supporting various structures and driving part for driving various structures etc..

In the present embodiment, it is illustrated for example in the following cases, that is, it is (only simple below that semiconductor crystal wafer W will be pasted onto Referred to as " wafer W ") etc. the surface protection of various substrates adhesive tape T with splice have separate sheet S strip supply, in downstream Side is cut to predetermined shape.That is, in the present embodiment, the adhesive tape of strip is engaged with each other.In addition, splicing is had separate sheet S State adhesive tape T be set as band TS.

In the present embodiment, " upstream " and " downstream " is defined as along the release direction with TS.That is, the meaning of " upstream " is, Away from the aftermentioned closer side of band supply unit in the release direction with TS.In addition, as shown in fig. 6, adhesive tape T have will be non-stick The structure that the substrate B of conjunction property and the adhesive layer C with adhesiveness are laminated.As the material for constituting separate sheet S, more preferable energy The material enough engaged by heat bonding.

<integrally-built explanation>

As shown in Figure 1, there is the adhesive tape joining apparatus 1 of embodiment 1 adhesive tape engagement device 3, holding station 5, band to paste Unit 7, band cutting unit 9, band stripping unit 11, band recoverer 13 and separate sheet recoverer 15.Adhesive tape engagement device 3 exists The rear end of leading adhesive tape T engages the front end of subsequent other adhesive tapes T of leading adhesive tape T.Adhesive tape engagement device 3 Specific structure see below.

Simultaneously holding circuit forms face-up wafer W to the mounting of holding station 5.In embodiment, as holding station 5, suction is used The attached chuck table for keeping wafer W, but as the structure of holding station 5, it's not limited to that.In addition, in order to cut aftermentioned band The cutter 9c that disconnected unit 11 has adhesive tape T is cut off along the shape moving in rotation of wafer W and in the upper surface of the holding station 5 It is formed with cutter shifting chute 5a.Holding station 5 is also possible to be capable of the structure of appropriate lifting moving.

Adhesive tape T is pasted into application unit 7 and is placed in holding station 5 and the circuit face of the wafer W that is adsorbed holding.Such as Shown in Fig. 1, with application unit 7 have the movable table 7a that is moved back and forth along track left and right horizontal (not shown) and by with movable table The Sticking roller 7b that the bracket that 7a is connected is pivotally supported.

Supporting arm 9b, the supporting arm are equipped in the lower part for the movable table 9a that can be gone up and down by driving with cutting unit 9 9b can be rotated by driving around the supercentral vertical axis line P for being located at holding station 5.In addition, in the free end of supporting arm 9b Side is equipped with point of a knife cutter 9c directed downwardly.That is, the band cutting unit 9 is configured to, by supporting arm 9b with vertical axis line P It is rotated for rotation center, cutter 9c moves to cut adhesive tape T along the periphery of wafer W.

The adhesive tape Tw and adhesive tape Tw that are cut and be pasted on the surface of wafer W by cutter 9c are cut out with stripping unit 11 Become the i.e. unwanted band Tn separation of unwanted adhesive tape T after cutting.Have with stripping unit 11 and maintains unwanted band Tn's The guide reel 11a and nip roll 12 of pulling force.Nip roll 12 is by capableing of the pinch roll 12a of lifting moving and being driven by motor defeated Roller 12b is sent to constitute.Band stripping unit 11 is configured to move back and forth along track left and right horizontal (not shown).

Be disposed in the downstream with stripping unit 11 with recoverer 13, for wind the recycling spool of unwanted band Tn by Coiling direction drives and rotates.In separate sheet recoverer 15, for winding the recycling volume from the adhesive tape T separate sheet S removed Axis is driven and is rotated to coiling direction.

In addition, adhesive tape joining apparatus 1 also has control unit 81 and input unit 83.Control unit 81 has CPU (central operation Processing unit) etc., for each structure for being set to adhesive tape joining apparatus 1, it is uniformly controlled various movements etc..As input unit 83 example can enumerate control deck plate, keyboard etc., and operator inputs various instructions using input unit 83.It is input to input unit 83 instruction content is conveyed to control unit 81, and control unit 81 can carry out various controls according to the instruction.

Here, illustrating the structure of the adhesive tape engagement device 3 of embodiment 1.Adhesive tape engagement device 3 has band feed unit 17, leading adhesive tape holding member 19 and separation chip bonding unit 21.

As shown in (a) of Fig. 2, band feed unit 17 is configured to, and erects in swivel plate 23 and multiple spools 25 are arranged, will be with TS Adhesive tape volume 27 be loaded on each spool 25.It is set as in the present embodiment, spool 25A, the setting of the two spools of spool 25B are set It is placed in swivel plate 23.Appended drawing reference 27A is infused to the adhesive tape label for being loaded on spool 25A, to the adhesive tape for being loaded on spool 25B Both label infuses appended drawing reference 27B, distinguished with this.In addition, for ease of description, omission removes in the perspective view of (a) of Fig. 2 Each structure except swivel plate 23, spool 25 and adhesive tape volume 27.

As shown in (b) of Fig. 2, band feed unit 17 has multiple feed units 18 on the whole.The band supply of the present embodiment Device 17 is made of two feed units on the whole, that is, the 1st feed unit 18A including spool 25A and including spool 25B's 2nd feed unit 18B.Each feed unit 18 has band supply unit 29, separate sheet stripping portion 31 and bonding ribbon preparing department 33.

In addition, in the present embodiment, about each structure, being marked in the appended drawing reference of each structure contained by the 1st unit 18A A marks B in the appended drawing reference of each structure contained by the 2nd unit 18B, both is distinguished with this.As an example, pass through By two be disposed in the 1st unit 18A one band supply unit table in supply unit 29 be denoted as band supply unit 29A come it is specific.And And another band supply unit table for being disposed in the 2nd unit 18B is denoted as band supply unit 29B.

Swivel plate 23 is configured to rotate using driving mechanism 37 around the axis of central axis 39.By the rotation of swivel plate 23, 1st feed unit 18A and the 2nd feed unit 18B can be mutually shifted between supply position and position of readiness.

In the present embodiment, supply position refers to, adhesive tape T can be rolled up 27 to workpiece (in the present embodiment from adhesive tape In be wafer W) release and the position that supplies.That is, as an example, being configured at supply position in each structure of feed unit 18B In the case where setting, adhesive tape volume 27B possessed by the feed unit 18B in 27 can be rolled up from multiple adhesive tapes and is released simultaneously to workpiece Supply adhesive tape T.

In each figure of Fig. 1 and Fig. 2, shows the 1st feed unit 18A and be configured at supply position and the 2nd feed unit 18B It is configured at the state of position of readiness.Also, (scheming from the adhesive tape volume 27 for being configured at supply position in two adhesive tape volumes 27 In for adhesive tape roll up 27A) to band application unit 7 supply adhesive tape T.

As shown in figure 3, each band supply unit 29 has spool 25, adhesive tape volume 27 and guide reel (not shown).From dress It fills in front end with TS that the adhesive tape volume 27 of spool 25 is released and is guided roller maintenance pulling force, and by separate sheet stripping portion 31 Guidance.

In addition, the adhesive tape volume for being configured at position of readiness 27 is configured to, can automatically or manually by shutter door 91 to The external of adhesive tape joining apparatus 1 is taken out.Operator, Work robot take out adhesive tape volume 27, and by new adhesive tape Volume 27 is placed in position of readiness.

In addition, be configured in adhesive tape engagement device 3, position of readiness is located at and adhesive tape compared with supply position The separated position of the central portion of sticker 1.Under normal conditions, movable part, cutter and component as high temperature etc. are bonding Central portion with sticker 1 is arranged more.Therefore, when being swapped to the adhesive tape volume 27 for being switched to position of readiness, Can be avoided operator etc. to become component, movable part etc. of high temperature close to etc. as the state of affairs.

As shown in figure 3, separate sheet stripping portion 31 has guide reel 34, conveying roller 35, separate sheet holding member 36 and glues Crossed belt holding member 41.It is adhesive tape T and separate sheet S that the band TS for being directed into separate sheet stripping portion 31, which is guided the removing of roller 34,. Each structure of separate sheet stripping portion 31 is connected with swivel plate 23, and is displaced together under the rotation of swivel plate 23 with spool 25.

After band TS is stripped as adhesive tape T and separate sheet S, adhesive tape T is wound in guide reel 34 and by adhesive tape Holding member 41 guides.And separate sheet S is wound in conveying roller 35 and is guided to separate sheet holding member 36.

One example of separate sheet holding member 36 is the component of plate, point for keeping guiding to come via conveying roller 35 From piece S.The example of structure more preferably, separate sheet holding member 36 adsorb holding point using suction device (not shown) From piece S.

One example of adhesive tape holding member 41 is the component of plate, is kept in one face (retaining surface) from guide reel 34 are led through the adhesive tape T come.In the same manner as separate sheet holding member 36, adhesive tape holding member 41 more preferably has can Absorption keeps the function of adhesive tape T.

In addition, being directed into adhesive tape holding member 41 in the case where separate sheet stripping portion 31 is configured at supply position The adhesive tape T of (being adhesive tape holding member 41A in each figure of Fig. 2) is as shown in Figure 1, via leading adhesive tape holding member 19, further guided to band application unit 7.Also, being directed into separate sheet holding member 36 (is separation in each figure of Fig. 2 Piece holding member 36A) separate sheet S as shown in Figure 1 via separation chip bonding unit 21 further draw to separate sheet recoverer 15 It leads.

As shown in figure 4, bonding ribbon preparing department 33 has bonding ribbon holding member 43 and knife unit 45.Bonding ribbon keeps structure One example of part 43 is the component of plate.Bonding ribbon holding member 43 is configured to, and is being configured at supply position and standby position In the case where any position set, cutting ready position that can be shown in solid into Fig. 4 shown in dotted lines in Figure 4 is connect The each position for closing ready position and aftermentioned engagement execution position is mobile.

Cutting ready position and to engage ready position be positional relationship across adhesive tape T-phase pair, cutting ready position and Engagement execution position is the positional relationship across adhesive tape T-phase pair.Compared with engaging execution position, engagement ready position be located at Adhesive tape T separated position.

In the case where bonding ribbon holding member 43 is moved to cutting ready position, which is constituted To be configured at the downstream of adhesive tape holding member 41 and adhesive tape T can be kept in a face (retaining surface).Bonding ribbon is kept Component 43 more preferably has the function of that absorption keeps adhesive tape T.

In addition, in the case where bonding ribbon holding member 43 is mobile to engagement ready position from cutting ready position, engagement Band holding member 43 makes it towards reversion.That is, the retaining surface and adhesive tape of bonding ribbon holding member 43 are protected in engagement ready position The retaining surface for holding component 41 is configured to opposite.

Knife unit 45 has movable table 46 and cutter 48.Movable table 46 can be by driving mechanism (not shown) scheduled It is driven on the R of direction.Direction R is preferably the thickness direction of adhesive tape T.In addition, be configured to also can be adhesive tape T's for movable table 46 It is driven in width direction (being in the present embodiment the direction z).

There is cutter 48 in the top end part of movable table 46.Cutter 48 is in adhesive tape holding member 41 and bonding ribbon holding member Clearance portion between 43 cuts off adhesive tape T in entire width direction.Adhesive tape T is cut off by cutter 48, to form use In by the articulate adhesive tape in the front end of the rear end of leading adhesive tape T and subsequent adhesive tape T, that is, bonding ribbon CT.Bonding ribbon Holding member 43 also has the function of keeping established bonding ribbon CT.

In addition, each structure of feed unit 18 is connected with swivel plate 23, and by the rotation of swivel plate 23 around to rotate Axis centered on axis 39 is displaced.That is, being set to each band supply unit 29 of each feed unit 18, separate sheet stripping portion 31 and bonding ribbon preparing department 33 under the rotation of swivel plate 23, can be mutually shifted between supply position and position of readiness.

Leading adhesive tape holding member 19 is disposed in the downstream of the bonding ribbon preparing department 33 of supply position configuration, and is kept From the adhesive tape T, that is, leading adhesive tape T1 for 27 supply of adhesive tape volume for being located at supply position.Leading 19 structure of adhesive tape holding member As can be moved along the release direction of adhesive tape T, and aftermentioned by being moved back and forth between near position and retreating position.In advance The retaining surface of adhesive tape holding member 19 and the retaining surface for the adhesive tape holding member 41 for being configured at supply position are preferably concordant Structure.

As shown in figure 5, separation chip bonding unit 21 is disposed under the separate sheet holding member 36 of supply position configuration Trip, and there is leading separate sheet holding member 47 and knife unit 49.Leading separate sheet holding member 47 is kept from positioned at supply Separate sheet S, that is, leading separate sheet S1 of 27 supply of adhesive tape volume of position.It is arranged in the inside of leading separate sheet holding member 47 There is the heater 50 for heating separate sheet S.

Knife unit 49 has movable table 51 and cutter 53.Movable table 51 can be by driving mechanism (not shown) scheduled It is driven on the R of direction.Direction R is preferably the thickness direction of leading separate sheet S1.In addition, be configured to also can be leading for movable table 51 It is driven in the width direction (being in the present embodiment the direction z) of separate sheet S1.

There is cutter 53 in the front end of movable table 51.Cutter 53 is kept in separate sheet holding member 36 and leading separate sheet Clearance portion between component 47 cuts off leading separate sheet S1 in entire width direction.In addition, leading separate sheet holding member 47 and knife unit 49 be configured to mobile along the release direction (direction L) of leading separate sheet S1, and lean on peri position aftermentioned It sets and is moved back and forth between retreating position.

In embodiment 1, each knot of leading adhesive tape holding member 19 and separation chip bonding unit 21 and feed unit 18 Structure is different, is not connected with swivel plate 23.That is, leading adhesive tape holding member 19 and separate chip bonding unit 21 each structure with The rotation of swivel plate 23 is independent of one another and can suitably change its position.

Here, the adhesive tape T of circuit face protection is pasted on a system of wafer W using adhesive tape joining apparatus 1 by explanation The elemental motion of column.(a) of Fig. 7 is the flow chart for illustrating for the adhesive tape T of protection to be pasted on the process of wafer W.

When issuing stickup instruction, the wafer W of scheduled incorporating section is accommodated in after alignment tool contraposition, utilization is not shown Wafer conveying mechanism be placed in holding station 5.It is placed in the wafer W rotation of holding station 5 and is kept being located at the center of wafer W The supercentral mode of platform 5 align after in the state of be adsorbed holding.(step S1).

At this moment, with application unit 7, with cutting unit 9 and with initial shown in stripping unit 11 respectively (a) to Fig. 8 Position is mobile.That is, it is mobile to the right side of holding station 5 with application unit 9, it is mobile to the left side of holding station 5 with stripping unit 11.This Outside, standby in the top of holding station 5 with cutting unit 9.

In addition, rolling up 27 from the adhesive tape for being loaded on the spool 25 for being moved to supply position with TS in band feed unit 17 It downstream releases and supplies, band TS is adhesive tape T and separate sheet S by the removing of separate sheet stripping portion 31.Then, adhesive tape T by It is guided with application unit 7 and with stripping unit 11.

Then, as shown in (b) of Fig. 8, the Sticking roller 7b with application unit 7 on one side presses downwards adhesive tape T, on one side (being in fig. 8 left) rolls forwards on wafer W, and the initial position shown in the dotted line is moved to terminal location shown in solid It is dynamic.Adhesive tape T is pasted on the entire surface (step S2) of wafer W as a result,.

After adhesive tape T is pasted on wafer W, as shown in figure 9, standby band cutting unit 9 declines above, from dotted line Shown in initial position it is mobile to off-position shown in solid.Then, declined by band cutting unit 9 to off-position, knife Tool 9c pierces through adhesive tape T in the cutter shifting chute 5a of holding station 5.

When cutter 9c pierces through adhesive tape T, supporting arm 9b is rotated using vertical axis P as rotation center.Concomitantly, Cutter 9c with the sliding contact of wafer outer peripheral edge, carries out moving in rotation on one side on one side, and adhesive tape T is cut off (step along the shape of wafer Rapid S3).

At the end of the shape along wafer is to the cutting of adhesive tape T, original position of readiness is risen to cutting unit 9. Then, band application unit 7 is returned from terminal location to initial position.Application unit 17 is returned to initial position, and such as Figure 10 Shown, band stripping unit 11 is rearward (being right in Figure 10) mobile.That is, with stripping unit 11 from Figure 10 shown in dotted line Initial position towards being moved to the right with terminal location shown in solid.

Band stripping unit 11 is mobile to terminal location, and will be removed cutting on wafer W in adhesive tape T and be left Unwanted band Tn roll and remove (step S4).In addition, the part to the surface for being pasted on wafer W in adhesive tape T is marked Appended drawing reference Tw is infused, to distinguish with unwanted band Tn.

When band 11 incoming terminal position of stripping unit terminates overburden operation, band stripping unit 11 is returned from terminal location To initial position.At this moment, unwanted band Tn is wound and is recovered by guiding to band recoverer 13, and from being configured at confession A certain amount of band TS (step S5) is released to the adhesive tape volume 27 of position.

At the end of managing everywhere in until step S5, the absorption of holding station 5 is released from.After absorption releases, it is pasted with The wafer W of adhesive tape Tw is conveyed by wafer conveying mechanism and is recycled to wafer recoverer (step S6) (not shown).It is above complete It is handled at 1 adhesive tape joining.

In addition, rolling up 27 (supply bands) according to the adhesive tape for being configured at supply position after the completion of adhesive tape joining processing Loadings branch into process below.Supply band loadings be prespecified specified amount situation below under, temporarily When stop from be located at supply position adhesive tape volume 27 release movements with TS, progress the automatic exchange (step S7) with TS.It is logical Crossing using the loadings of the confirmations such as various sensors supply band is specified amount or more, is repeated in above-mentioned movement later.

Here, illustrating automatic process of the exchange with TS in step S7.The exchange process of band in step S7 is according to Fig. 7's (b) process of step S7-1 shown in flow chart to step S7-6 carries out.The process according to shown in (b) of Fig. 7 makes to load There is the new adhesive tape volume 27 with TS of sufficient amount to be configured at the supply position with feed unit 17.It then, will be new viscous from this Crossed belt volume 27 release subsequent (upstream side) adhesive tape T front end with before exchanging adhesive tape volume 27 release in advance The rear end of (downstream side) adhesive tape T is joined together automatically.In addition, by the rear end of leading separate sheet S and subsequent separate sheet S Front end be joined together automatically.

In addition, in the present embodiment, being illustrated for example in the following cases, that is, initially in the confession with feed unit 17 27A is rolled up configured with spool 25A and adhesive tape to position, in the step s 7, loadings is become into specified value adhesive tape below and are rolled up 27A is exchanged for new adhesive tape volume 27B.Become specified value or less in the loadings of adhesive tape volume 27A and starts to execute step S7 At the time of under adhesive tape engagement device 3 each structure it is as shown in figure 11.

When illustrating step S7, roll up for the adhesive tape for being configured at supply position before exchange (is viscous in the present embodiment Crossed belt rolls up 27A) each structure with TS for releasing, referred to as in advance with TS1, leading adhesive tape T1, leading separate sheet S1.Also, needle To new adhesive tape volume (rolling up 27B in the present embodiment for the adhesive tape) releasing for being configured at supply position after exchange with TS's Each structure, referred to as subsequent band TS2, subsequent adhesive tape T2, later separation piece S2, is distinguished with each structure with leading band TS1.

When step S7 starts, illustrate the initial configuration of each structure of adhesive tape engagement device 3.Firstly, in explanatory diagram 11 With the structure of part shown in appended drawing reference D1.Leading adhesive tape holding member 19 is moved adjacent to position, protects close to adhesive tape Hold component 41A.Bonding ribbon holding member 43A positioned at supply position is moved to engagement ready position.It is quasi- by being configured at engagement Standby position, bonding ribbon holding member 43A is across splicing tape T1 with the retaining surface of retaining surface and adhesive tape holding member 41A phase each other It is right.

Then, illustrate the structure of the part as shown in appended drawing reference D2.Positioned at the bonding ribbon holding member 43B of position of readiness It is moved to cutting ready position.By being moved to cutting ready position, the retaining surface of bonding ribbon holding member 43B (keeps bonding Face with T) it is aligned with the retaining surface of adhesive tape holding member 41B.

In addition, the subsequent band TS2 for being configured at position of readiness is constituted as follows in advance when step S7 starts.Such as figure In 11 as shown in appended drawing reference D2 like that, 27B is rolled up from the adhesive tape for being configured at position of readiness release the adhesive tape for having separate sheet I.e. subsequent band TS2.The subsequent band TS2 released is subsequent adhesive tape T2 and later separation piece S2 by separate sheet stripping portion 31B removing, The adhesive layer C exposure of subsequent adhesive tape T2.

Later separation piece S2 is wound in conveying roller 35B and is guided to the retaining surface of separate sheet holding member 36B.Subsequent point Front end portion from piece S2 is adsorbed by separate sheet holding member 36B to keep.Subsequent adhesive tape T2 is wound in guide reel 34B, and by To the retaining surface of adhesive tape holding member 41B and the retaining surface guidance of bonding ribbon holding member 43B.The front end of subsequent adhesive tape T2 Part is adsorbed by bonding ribbon holding member 43B and is kept, than the part of the front end portion on the upstream side by adhesive tape holding member 41B Absorption is kept.

It is configured at the retaining surface of the bonding ribbon holding member 43B of cutting ready position and the guarantor of adhesive tape holding member 41B It holds in face of neat.Therefore, it is able to maintain that the pulling force of subsequent adhesive tape T2 entirety, and adhesive tape holding member 41B and bonding ribbon are protected Component 43B is held to be able to stably keep subsequent adhesive tape T2 in the entire surface of retaining surface.In addition, distinguishing in embodiment 1 Manually be wound subsequent adhesive tape T2 and by bonding ribbon holding member 43B keep operation, winding later separation piece S2 simultaneously The operation kept by separate sheet holding member 36B, but automation can also be realized under the control of control unit 81.Step S7 starts The initial configuration of preceding various structures is as previously discussed.

Step S7-1 (cutting of leading band)

In the exchange process of band, it is first turned off leading band.That is, being supplied in adhesive tape engagement device 3 using being configured at The knife unit 45 of position (is cut off leading adhesive tape T1 in the present embodiment for knife unit 45A), and is connect using separate sheet It closes knife unit 49 possessed by unit 21 and cuts off leading separate sheet S1.

It is indicated in Figure 11 by appended drawing reference D1 by the position that knife unit 45A cuts off leading adhesive tape T1, by cutter list The position of the 49 leading separate sheet S1 of cutting of member is indicated in Figure 11 by appended drawing reference D3.Firstly, using each figure of Figure 12, explanation is cut Break the movement of leading adhesive tape T1.

(a) of Figure 12 indicates to cut off the state of the bonding ribbon preparing department 33A before leading adhesive tape T1.Leading adhesive tape is protected Component 19 is held in advance from the retreating position shown in dotted line to by close position displacement shown in solid, keeps structure close to adhesive tape Part 41A.Also, leading adhesive tape T1 is adsorbed keep respectively by leading adhesive tape holding member 19 and adhesive tape holding member 41A. In addition, knife unit 45A is located at the initial position (position being represented by dotted lines in (d) of Figure 12 left from adhesive tape T1 M1)。

When beginning to switch off leading adhesive tape T1, the movable table 46A of knife unit 45A is driven to direction R, such as Figure 12 (b) shown in, keep knife unit 45A mobile from initial position to cutting ready position.In (b) of Figure 12, cutter 48A is to leading The inboard of adhesive tape T1 is mobile.In addition, the cutting ready position of knife unit 45A is equivalent in (d) of Figure 12 by double dot dash line Shown in position M2.

After knife unit 45A is moved to cutting ready position, by movable table 46A along the width side of leading adhesive tape T1 It is driven to (direction z).By the driving, positioned at cutting ready position knife unit 45A in (d) of Figure 12 with shown in solid Cutting to complete position mobile.Along with the movement, cutter 48A is in leading adhesive tape holding member 19 and adhesive tape holding member Leading adhesive tape T1 is cut off ((c) of Figure 12) in entire width direction by the scheduled position between 41A.In cutting completion Afterwards, knife unit 45A completes position to initial position return from cutting.

Leading adhesive tape T1 is cut off by knife unit 45A, the downstream side (T1f) of leading adhesive tape T1 is rolled up from adhesive tape 27A is cut off.After the cutting, the rear end part of the leading adhesive tape T1f cut off from adhesive tape volume 27A is by leading adhesive tape The absorption of holding member 19 is kept.Also, the upstream side (T1r) for the leading adhesive tape T1 that 27A is connected still is rolled up with adhesive tape It is adsorbed and keeps by adhesive tape holding member 41A in front end portion.

It is kept by carrying out each absorption, after being cut off by knife unit 45A, also can steadily remain leading The position of adhesive tape T1.In addition, making leading adhesive tape holding member 19 to by near position movement when cutting off leading adhesive tape T1 And close to adhesive tape holding member 41A.Therefore, can be avoided because leading adhesive tape T1 leading adhesive tape holding member 19 with it is viscous The reasons such as flexure lead to the state of affairs as the cutting accuracy decline of leading adhesive tape T1 between crossed belt holding member 41A.

Then, using each figure of Figure 13, illustrate the movement for cutting off leading separate sheet S1.(a) of Figure 13 indicates that cutting is leading The state of each structure before separate sheet S1.Leading separate sheet holding member 47 is configured in initial position and protects close to separate sheet The position in the downstream side of component 36A is held, and opposite with separate sheet holding member 36A across leading separate sheet S1.Also, divide in advance Leading separate sheet S1 is adsorbed respectively from piece holding member 47 and separate sheet holding member 36A and is kept.In addition, knife unit 49 In the initial position left from leading separate sheet S1.

When beginning to switch off leading separate sheet S1, the movable table 51 of knife unit 49 is driven to direction R, such as Figure 13 (b) shown in, keep knife unit 49 mobile from initial position to cutting ready position.In (b) of Figure 13, cutter 53 is to leading point It is mobile from the inboard of piece S1.

After knife unit 49 is moved to cutting ready position, by movable table 51 along the width direction of leading separate sheet S1 (direction z) driving.By the driving, the knife unit 49 positioned at cutting ready position is mobile to nearby side from the back side, i.e., to cutting It is disconnected to complete position movement.Along with the movement, cutter 53 leading separate sheet holding member 47 and separate sheet holding member 36A it Between scheduled position leading separate sheet S1 is cut off into ((c) of Figure 13) in entire width direction.After cutting is completed, knife Have unit 49 and completes position to initial position return from cutting.

Leading separate sheet S1 is cut off by knife unit 49, the downstream side (S1f) of leading separate sheet S1 is rolled up from adhesive tape 27A is cut off.After the cutting, the rear end part of the leading separate sheet S1f cut off from adhesive tape volume 27A is protected by leading separate sheet The absorption of component 47 is held to keep.

Also, still and before the upstream side (leading separate sheet S1r) of the adhesive tape volume 27A leading separate sheet S1 being connected End part is adsorbed by separate sheet holding member 36A and is kept.It is kept by carrying out each absorption, is cut off by knife unit 49 Later, the position of leading separate sheet S1 also can steadily be maintained.By leading adhesive tape T1 and leading separate sheet S1 respectively by It cuts off and is cut off from adhesive tape volume 27A, the process of step S7-1 is completed.

Step S7-2 (production of bonding ribbon)

By the process of step S7-1, in leading adhesive tape T1 and the leading respective downstream side separate sheet S1 by from adhesive tape After volume 27A is cut off, the production process of the bonding ribbon of step S7-2 is executed.As feature of the invention, will be used to be pasted on work Part (in the present embodiment for a part of the adhesive tape T of wafer W) as bonding strap, that is, bonding ribbon CT of engagement come using.

It in the present embodiment, the use of the knife unit 45 for being configured at position of readiness (is in the present embodiment knife unit The front end of subsequent adhesive tape T2 45B) is cut into a part, will be cut and the front end portion of part be used as bonding ribbon CT. Specifically, the production of bonding ribbon is carried out with position shown in appended drawing reference D2 in Figure 11.

Using each figure of Figure 14, illustrate the process for making bonding ribbon CT.(a) of Figure 14 indicate to cut off subsequent adhesive tape T2 it The state of preceding each structure.Bonding ribbon holding member 43B is mobile to cutting ready position.That is, bonding ribbon holding member 43B is configured Near the downstream side of adhesive tape holding member 41B, the front end portion of subsequent adhesive tape T2 is adsorbed and is kept.Knife unit 45B Initial position is configured to position away from from subsequent adhesive tape T2.

When beginning to switch off subsequent adhesive tape T2, the movable table 46B of knife unit 45B is driven to direction R, makes cutter list First 45B is mobile from initial position to cutting ready position.After knife unit 45B is moved to cutting ready position, movable table 46B drives knife unit 45B along the width direction (direction z) of subsequent adhesive tape T2.By the driving, knife unit 45B from It cuts off ready position and completes position movement to cutting, it is pre- between adhesive tape holding member 41B and bonding ribbon holding member 43B Positioning, which is set, cuts off ((b) of Figure 14) in entire width direction for subsequent adhesive tape T2.

Subsequent adhesive tape T2 is cut off by knife unit 45B, 27B is rolled up from adhesive tape in the front end portion of subsequent adhesive tape T2 It cuts off.After the cutting, bonding ribbon is held in as bonding ribbon CT absorption from the front end portion that adhesive tape volume 27B is cut off and is protected Hold component 43B.Also, the front end portion of the subsequent adhesive tape T2 newly formed by the cutting is by adhesive tape holding member 41B Absorption is kept.

After cutting is completed, knife unit 45B completes position from cutting and returns to initial position.In this way, by by connecing The bonding ribbon preparing department 33B production bonding ribbon CT for being configured at position of readiness in crossed belt preparing department 33, completes the work of step S7-2 Sequence.Outline structure such as Figure 14 of adhesive tape engagement device 3 in the state of after the completion of the process of step S7-1 and step S7-2 (c) shown in.

Step S7-3 (displacement of bonding ribbon)

Continue the front end portion of adhesive tape T2 after severance after completing the production of bonding ribbon, is displaced bonding ribbon.That is, logical Crossing, which makes to remain engaged with the bonding ribbon holding member 43B with CT in the feed unit 18 for being located at position of readiness, suitably moves, to connect The mode that the adhesive layer C of the front end portion of the adhesive layer C of crossed belt CT and subsequent adhesive tape T2 becomes facing positional relationship makes Bonding ribbon CT reversion.

In the present embodiment, as the process for being displaced bonding ribbon CT, the progress as so following.It has just been made in bonding ribbon CT After finishing, as shown in (a) of Figure 15, the adhesive layer C court of the front end portion of the adhesive layer C of bonding ribbon CT and subsequent adhesive tape T2 To identical direction.In this state, using driving device (not shown), make bonding ribbon holding member 43B around the axis in the direction z Reversion movement, and be allowed to suitably move in parallel on x/y plane.

By the movement, bonding ribbon holding member 43B is from (b) of Figure 15 with cutting ready position shown in dotted line to same It is mobile with engagement ready position shown in solid in figure.It is mobile to engagement ready position by bonding ribbon holding member 43B, with quilt The adhesive layer C for the bonding ribbon CT that bonding ribbon holding member 43B is kept and the subsequent adhesive tape kept by adhesive tape holding member 41B The mode that the adhesive layer C of the front end portion of T2 becomes facing positional relationship inverts bonding ribbon CT.As long as in addition, can make The adhesive layer C of the front end portion of the adhesive layer C of bonding ribbon CT and subsequent adhesive tape T2 is opposite, then bonding ribbon holding member 43B Motion track is not limited to the structure of the present embodiment.

It is further preferred, that in bonding ribbon preparing department 33B carry out bonding ribbon CT reversion process synchronously, connecing Keep out of the way leading adhesive tape holding member 19 in crossed belt preparing department 33A.At the time of making bonding ribbon CT, in advance with holding member 19 to by near position movement ((c) of Figure 15).That is, leading adhesive tape holding member 19 is configured at adhesive tape holding member 41A's Near downstream.

By using driving device (not shown) in this state, make leading adhesive tape holding member 19 along adhesive tape T's Release direction downstream moves.By the movement, leading adhesive tape holding member 19 maintains absorption and keeps leading adhesive tape The state of the rear end part of T1f, and from (d) of Figure 15 with shown in dotted line lean near position into same figure with shown in solid Retreating position is mobile.

The retreating position of leading adhesive tape holding member 19 more preferably in the main view of adhesive tape engagement device 3 not with The position that swivel plate 23 is overlapped.By making leading adhesive tape holding member 19 mobile to retreating position in advance, can reliably keep away Exempt from the knot being connected with swivel plate 23 in the aftermentioned process for rotating swivel plate 23 by taking separate sheet holding member 36 as an example The state of affairs that structure is interfered with leading 19 phase of adhesive tape holding member.

Similarly, for the purpose of the state of affairs mutually interfered to avoid separation chip bonding unit 21 with other structures, more preferably, point Also maintain the state that absorption keeps the rear end part of leading separate sheet S1f from chip bonding unit 21, and in main view The position Chong Die with swivel plate 23 is not kept out of the way.Complete the reversion of bonding ribbon CT, leading adhesive tape holding member 19 keep out of the way and Separate chip bonding unit 21 at the time of keeping out of the way under adhesive tape engagement device 3 structure such as Figure 16 (a) shown in.Pass through engagement Band CT completes displacement, thus the process for completing step S7-3.

Step S7-4 (switching of adhesive tape volume)

After inverting bonding ribbon CT, the switching of adhesive tape volume is carried out.That is, making the swivel plate 23 with supply unit unit 17 Appropriate rotation is rolled up 27 to the adhesive tape for being configured at supply position and is switched over.By the rotation of swivel plate 23, it is configured at supply position The adhesive tape volume 27 set is reduced to make a reservation for adhesive tape below from loadings with TS and rolls up 27A ((a) of Figure 16) to being filled with foot The adhesive tape volume 27B switching ((b) of Figure 16) with TS enough measured.

In addition, passing through the rotation of turntable 23, each structure being connected with turntable 23 is also displaced with turntable 23 together. That is, about 180 ° of swing offset centered on rotary shaft 39 of each structure of the 1st feed unit 18A of supply position are configured at, from Supply position is mobile to position of readiness.On the other hand, each structure of the 2nd feed unit 18B of position of readiness is configured at from standby Position is mobile to supply position.

As a result, being protected by the adhesive tape holding member 41B subsequent adhesive tape T2 kept and by bonding ribbon holding member 43B The bonding ribbon CT held maintains respective adhesive layer C facing state each other, and synchronously from position of readiness to supply position Set movement.On the other hand, the i.e. leading adhesive tape holding member 19 of the structure not being connected with turntable 23 and chip bonding list is separated The position of member 21 not will receive the influence of the rotation of turntable 23.

Thus, by the movement for make switching adhesive tape volume 27 and swivel plate 23 rotates, after being moved to supply position Continue the attached of the rear end part for the leading adhesive tape T1f that adhesive tape T2 and bonding ribbon CT remains to leading adhesive tape holding member 19 Nearly mobile ((b) of Figure 16).In addition, absorption keep later separation piece S2 separate sheet holding member 36B also from position of readiness to Supply position is mobile.

As a result, the leading separate sheet S1f that later separation piece S2 is kept to the absorption of leading separate sheet holding member 47 It is moved near rear end part.Switch the feed unit 18 for being located at supply position and rotating swivel plate 23, to complete The process of step S7-4.It, can also be in addition, the sequence of the process of the process and step S7-4 of step S7-3 both can be replaced suitably It is synchronous to carry out.

Step S7-5 (engagement of adhesive tape)

After the switching of adhesive tape volume is completed, the engagement of adhesive tape is carried out.That is, in the bonding ribbon for being configured at supply position In preparing department 33 (being bonding ribbon preparing department 33B at the moment), carry out the rear end of leading adhesive tape T1f by bonding ribbon CT Divide the articulate operation in front end portion with subsequent adhesive tape T2.

Using each figure of Figure 17, illustrate the process of step S7-5.Firstly, making to keep out of the way position as shown in (a) of Figure 17 The leading adhesive tape holding member 19 set is to by near position movement.That is, leading adhesive tape holding member 19 is viscous in advance to remain The state of the rear end of crossed belt T1f is leaned on from retreating position shown in dotted line to shown in solid along the release direction of adhesive tape T Near position is mobile.As a result, the rear end of leading adhesive tape T1f and subsequent adhesive tape T2 become with can by bonding ribbon CT into The close state of the degree of row engagement.

In the rear end and subsequent adhesive tape T2 for making leading adhesive tape T1f after, carry out adhesive tape T's by bonding ribbon CT Engagement.That is, making bonding ribbon holding member 43B to engage ready position shown in dotted line towards with reality as shown in (b) of Figure 17 Engagement execution position shown in line is moved along direction R.By the movement, make bonding ribbon CT to the rear end of leading adhesive tape T1f and Subsequent adhesive tape T2 pressing.By the pressing, leading adhesive tape T1 and subsequent adhesive tape T2 are engaged.That is, leading adhesive tape The rear end of T1f is connected with the front end of subsequent adhesive tape T2 using bonding ribbon CT, and continuous strip is become.

The rear end of leading adhesive tape T1f is supported by leading adhesive tape holding member 19, and subsequent adhesive tape T2 is protected by adhesive tape Hold component 41B bearing.Also, the retaining surface of leading adhesive tape holding member 19 and the retaining surface pair of adhesive tape holding member 41B Together.It therefore, being capable of even action and stronger pressing between bonding ribbon CT and leading adhesive tape T1f and subsequent adhesive tape T2 Power.

In the bonding process of the adhesive tape of the present embodiment, the adhesive layer C of the rear end of leading adhesive tape T1f and subsequent bonding The adhesive layer C of adhesive layer C with T2 and bonding ribbon CT becomes facing positional relationship.That is, passing through bonding ribbon CT to each bonding Band T is pressed, the adhesive layer of the adhesive layer C and subsequent adhesive tape T2 of the rear end of the adhesive layer C of bonding ribbon CT and leading adhesive tape T1f C is bonded together.In other words, be not an adhesive layer C be in contact with another substrate B (non-adhering face) but adhesive layer C each other Bonding, therefore, the bonding force between bonding ribbon CT and the rear end and subsequent adhesive tape T2 of leading adhesive tape T1f becomes stronger. Thus, it is possible to which leading adhesive tape T1 and subsequent adhesive tape T2 are more firmly joined together.

After the engagement of the leading adhesive tape T1f and subsequent adhesive tape T2 carried out by bonding ribbon CT is completed, debonding The absorption of bonding ribbon CT is kept with holding member 43B.Also, as Figure 17 (c) shown in, make bonding ribbon holding member 43B from It engages execution position and returns to ((b) of Figure 19, arrow N1) to engagement ready position.

Adhesive tape holding member 41B is released respectively while the return to keep the absorption of subsequent adhesive tape T2 and in advance Adhesive tape holding member 19 keeps the absorption of leading adhesive tape T1f.It is engaged by bonding ribbon CT and becomes continuous band-like The respective absorption holding of leading adhesive tape T1f and subsequent adhesive tape T2 are released from, so as to release to direction L.

Step S7-6 (engagement of separate sheet)

While carrying out the bonding process of adhesive tape, the bonding process of separate sheet is carried out.That is, being moved to supply position Separate sheet holding member 36B with separate chip bonding unit cooperate, thus make the rear end part of leading separate sheet S1f with it is subsequent The front end portion of separate sheet S2 is joined together.

Using each figure of Figure 18, illustrate the process of step S7-6.Firstly, making to keep out of the way position as shown in (a) of Figure 18 The separation chip bonding unit 21 set is mobile.That is, leading separate sheet holding member 47 is to remain the rear end of leading separate sheet S1f State is moved from retreating position shown in dotted line to engagement ready position shown in solid along the release direction of separate sheet S. As a result, the rear end of leading separate sheet S1f and the front end of later separation piece S2 are as positional relationship facing each other.

In the rear end and later separation piece S2 for making leading separate sheet S1f after, carry out separate sheet S's using heating Engagement.That is, as Figure 18 (b) shown in, make leading separate sheet holding member 47 from shown in dotted line engagement ready position to Engagement execution position shown in solid, that is, direction R is mobile.By the movement, the rear end of leading separate sheet S1f is relative to subsequent point Front end pressing from piece S2.

In addition, being built in leading separate sheet holding member 47 while keeping leading separate sheet holding member 47 mobile Heater 50 heats the rear end of leading separate sheet S1f.By the heating and pressing, the rear end of leading separate sheet S1f with it is subsequent The front end of separate sheet S2 is engaged by heat bonding, becomes continuous strip.In addition, being at this moment more preferably, protected in separate sheet Also internal heater is held in component 36B, is also heated the front end side of later separation piece S2 using the heater.

After engagement between the rear end of leading separate sheet S1f and the front end of later separation piece S2 is completed, release leading Separate sheet holding member 47 keeps the absorption of leading separate sheet S1f.Also, as shown in (c) of Figure 18, protect leading separate sheet It holds component 47 and returns to ((b) of Figure 19, arrow N2) to initial position.

While the return, releases separate sheet holding member 36B and the absorption of later separation piece S2 is kept.Utilize hot pressing The respective absorption holding for engaging and becoming continuous band-like leading separate sheet S1f and later separation piece S2 is released from, from And it can be released to direction L.In addition, being moved to the bonding ribbon holding member 43A of position of readiness from ready position is engaged to cutting Ready position returns to ((b) of Figure 19, arrow N3).

The adhesive tape bonding process of step S7-5 and the separate sheet bonding process of step S7-6 can both make the time executed Appropriate point of front and back ground carries out, and can also synchronize progress.It is viscous in the state of respectively being pressed of step S7-5 and step S7-6 Shown in (a) of the structure of crossed belt engagement device 3 such as Figure 19.Also, by completing step S7-5 and step S7-6, adhesive tape engagement Shown in (b) of the structure of device 3 such as Figure 19.

When step S7-5 and step S7-6 is completed, it is loaded on the band TS2 for being newly moved to the adhesive tape volume 27B of supply position It is engaged respectively with leading adhesive tape T1f and leading separate sheet S1f, becomes continuous band-like.As a result, restarting band TS2 is released and the operation to bonding wafer adhesive tape T.By each process until step S7-1~step S7-6, complete automatic The series of processes that exchange adhesive tape rolls up 27 and engages adhesive tape T and separate sheet S automatically respectively.

In addition, can be viscous to adhesive tape via shutter door 91 from the adhesive tape volume 27A that supply position is switched to position of readiness The external of label apparatus 1 is taken out.Further, it is possible to be located at position of readiness spool 25A be filled with sufficient amount with TS's New adhesive tape volume 27.

In the past, as the method engaged the leading the 1st automatically with P and the subsequent 2nd with P, can enumerate it is following in this way Structure.That is, 3rd adhesive tape with Q as engagement different from each band P is prepared in advance, by the 1st band P and the 2nd band P Between the mode adhesive band Q that connects.

As a result, it is generally the case that band Q only single side have adhesive layer Ca in the case where, the section of bonding part It is constructed as shown in (a) such as Figure 20, in the case where band Q has adhesive layer Ca on two sides, the section of bonding part becomes It is constructed as shown in (b) of Figure 20.In such previous joint method, following problem is worried.

1st, as shown in each figure of Figure 20, the adhesive layer Ca with Q is by being connected to layer or separate sheet S with the substrate B in P Layer will band P be engaged with each other.That is, in the previous method, engagement with Q relative to coalesced object i.e. with the non-adhering of P It pastes in face.In this case, the bonding force of bonding part is only influenced by bonding force possessed by the adhesive layer Ca with Q, therefore, The bonding force of bonding part is weaker.Therefore, worry generates band Q and removes from band P and joint error such problems occurs.

2nd, engagement it is different from the practical band P relative to bonding wafer with Q, be pre-prepd band.Therefore, sometimes The constituent material with Q with P with engagement of wafer with protection, property difference.Thus, it is possible to expect the viscous with Q of engagement The substrate B (or separate sheet S with P) with P for closing layer Ca and circuit protection is the case where being difficult to the combination being bonded each other.When being When the poor combination of the compatibility of this bonding, further dies down with Q and the bonding force with P, therefore, engage more significantly The state of affairs as mistake.

Also, it independently with the band P as main material, needs to prepare band Q as auxiliary material, therefore, it is a variety of to generate preparation With such complexity.Furthermore, it is necessary to will be used to be disposed in band again to the structure etc. with the mutual bonding part supply belt Q of P Engagement device, therefore, band engagement device are easy enlargement, it is difficult to inhibit cost.

Also, in previous structure, as shown in (b) of Figure 20, will be stacked on one another with P across engagement with Q In the case that mode engages them, the thickness J of bonding part becomes thicker.That is, being connect compared with the part other than bonding part It is thicker to close part, therefore, in the band P winding recycling after engaging, the part with thickness is stuck in spool etc..As a result, The shape distortion for worrying reel spool, the state of affairs for leading to winding efficiency decline, winding mistake occurring.There is separate sheet S that will add In the state of band P be engaged with each other in the case where, the thickness J of bonding part thickens more significantly.

It is leading with P's before and after bonding part also, by being engaged in a manner of being stacked on one another with P Track (height etc.) ((b) of Figure 20) different with the track of subsequent band P.Therefore, it especially near bonding part, releases first Track of the row with P and the track for releasing subsequent band P deviate, and also worry for it will be pasted on the operation of wafer W with P The state of affairs of the accuracy decline respectively operated.The deviation of the track of the front and back of such bonding part is becoming proportionately larger with thickness J.

On the other hand, in the adhesive tape engagement device 3 of the present embodiment, carrying out, the mutual engagement of adhesive tape T is i.e. leading Adhesive tape T1 and subsequent adhesive tape T2 engagement when, cut a part of subsequent adhesive tape T2 in advance.Then, this is cut The part taken is utilized as the adhesive tape i.e. bonding ribbon CT of engagement.In this case it is not necessary to be arranged with adhesive tape T independently The structure of filling bonding ribbon CT, the large-scale structure for supplying bonding ribbon CT to bonding part in advance.Therefore, adhesive tape engagement dress Set 3 miniaturization, cost effective become easy.

In addition, in the present embodiment, the bonding ribbon CT and adhesive tape T1 and adhesive tape T2 for becoming coalesced object is phase really Construction together, property.Therefore, it can reliably avoid the bonding compatibility between each adhesive tape T and bonding ribbon CT poor Such state of affairs.Therefore, it can be improved the engaging force based on bonding ribbon CT.

Also, in the present embodiment, make the bonding of bonding ribbon CT by leading band and the engagement of subsequent band The adhesive surface C phase of layer C and each adhesive layer C and subsequent adhesive tape T2 for becoming and being aligned and close to parallel leading adhesive tape T1 It is right, in this state, bonding ribbon CT is pressed to each adhesive tape T to engage.That is, being engaged as shown in (c) of Figure 20 When, each adhesive surface C contact.

By engaging adhesive layer C and being in contact with each other, the bonding force of bonding part is in addition to by bonding ribbon CT Adhesive layer C possessed by bonding force influence except, also by possessed by coalesced object, that is, adhesive tape T adhesive layer C be bonded Power influences.Therefore, the bonding force of bonding part can be further increased, therefore, can more reliably avoid that engagement mistake occurs The state of affairs accidentally.In addition, the adhesive surface C of the adhesive layer C of leading adhesive tape T1 and subsequent adhesive tape T2 are parallel to be aligned shape.Therefore, Before and after bonding part, it can be avoided and occur in the track for releasing leading adhesive tape T1 and the track for releasing subsequent adhesive tape T2 Deviate.

Also, it in the present embodiment, will instead of not add the band TS in the state of having separate sheet being engaged with each other, by band TS removing carries out the mutual engagement of adhesive tape T and the mutual engagement of separate sheet S respectively after being adhesive tape T and separate sheet S.Cause This, especially in the case where being bonded to each other adhesive tape T using bonding ribbon CT, the thickness J and previous methods of bonding part Compared to also thinning ((c) of Figure 20).

Therefore, even if can also reduce and be had an impact to the component of device in the case where bonding part is wound recycling. In addition, remove be adhesive tape T and separate sheet S and make adhesive layer C exposure after make bonding ribbon CT, therefore, it is not necessary to carry out from The process of the complexity such as bonding ribbon CT peel separation piece S of part is easy so that the adhesive layer C and adhesive tape T of bonding ribbon CT Adhesive layer C opposite mode keeps various holding members mobile.

[embodiment 2]

Then, illustrate the embodiment of the present invention 2.In embodiment 1, it is illustrated by taking following structure as an example, that is, When leading adhesive tape T1 and subsequent adhesive tape T2 is engaged, a part of subsequent adhesive tape T2 is used to glue as bonding ribbon CT In the mutual engagement of crossed belt T.In example 2, it is illustrated by taking following structure as an example, that is, by the one of leading adhesive tape T1 Part is used as bonding ribbon CT, is used for the mutual engagement of adhesive tape T.In addition, the adhesive tape joining apparatus and embodiment 1 of embodiment 2 Device it is substantially common in configuration aspects.Therefore, structure identical with the adhesive tape joining apparatus of embodiment 1 is marked identical Different structure divisions is described in detail in appended drawing reference.

In the adhesive tape engagement device 3 of embodiment 1, bonding ribbon preparing department 33 is set to each feed unit 18, and at For the structure being connected with swivel plate 23.Also, each bonding ribbon preparing department 33A and 33B are configured to, and pass through the rotation of turntable 23 Turn, is replaced mutually between supply position and position of readiness.On the other hand, it in the adhesive tape engagement device 3a of embodiment 2, connects Crossed belt preparing department 61 is independently arranged with feed unit 18, is not connected with swivel plate 23, different from embodiment 1 in this regard. For the bonding ribbon preparing department 61 of embodiment 2, no matter the quantity of feed unit 18, at least it is arranged one.

The bonding ribbon preparing department 61 of embodiment 2 is disposed in the mobile adhesive tape holding member 41 in supply position (in Figure 21 In be adhesive tape holding member 41A) downstream.Bonding ribbon preparing department 61 is leaning in the same manner as leading adhesive tape holding member 19 It is moved back and forth between near position and retreating position along the release direction L of adhesive tape T.

In the case where bonding ribbon preparing department 61 is moved adjacent to position, the configuration of bonding ribbon preparing department 61 is to supply position Near the downstream of mobile adhesive tape holding member 41A.In the case where bonding ribbon preparing department 61 is moved to retreating position, engagement It is configured at preparing department 61 and can be avoided the position mutually interfered with each structure with feed unit 17.One as retreating position Example, it is not Chong Die with turntable 23 preferably under main view in the same manner as the leading adhesive tape holding member 19 of each embodiment Position.

The bonding ribbon preparing department 61 of embodiment 2 has bonding ribbon holding member 63 and knife unit 65.Bonding ribbon keeps structure Part 63 similarly to Example 1, is configured in cutting ready position, engagement ready position, the engagement mutual phase shift of execution position It is dynamic.The cutting ready position of bonding ribbon holding member 63 is equivalent under the mobile adhesive tape holding member 41 in supply position Trip.Bonding ribbon holding member 63 is configured to, and in the case where being moved to cutting ready position, can keep bonding in its retaining surface Band T.Cutting ready position, the positional relationship engaged between ready position, engagement execution position are same as Example 1.

Knife unit 65 has movable table 67 and cutter 68.Movable table 67 and the respective structure of cutter 68 and embodiment 1 Movable table 46 it is identical with the structure of cutter 48, therefore omit detailed description.In addition, bonding ribbon holding member 63 is with as follows Function, that is, a part of the leading adhesive tape T1 cut by knife unit 65 is kept as bonding ribbon CT, also, Bonding ribbon CT is pressed to the mutual bonding part adhesive tape T and engages them.

Here, illustrating each process of the step S7 of embodiment 2.The summary and implementation of the flow chart of the step S7 of embodiment 2 Example 1 is common, as shown in (b) of Fig. 7.Therefore, illustrate part different from embodiment 1 in each process of the step S7 of embodiment 2.

When starting step S7, the initial configuration of each structure of adhesive tape engagement device 3 is as shown in figure 21.That is, bonding ribbon Preparing department 61 and leading adhesive tape holding member 19 are to by near position movement.Bonding ribbon holding member 63 is configured at cutting and prepares position It sets.In this case, it is configured with bonding ribbon near the downstream to the mobile adhesive tape holding member 41A in supply position and keeps structure Part 63 is configured with leading adhesive tape holding member 19 near the downstream of bonding ribbon holding member 63.Also, adhesive tape keeps structure Respectively absorption keeps leading adhesive tape T1 for part 41A, bonding ribbon holding member 63 and leading adhesive tape holding member 19.

In addition, the original state of subsequent band TS2 is as described below.That is, as in Figure 21 as shown in appended drawing reference D4, in advance 27B first is rolled up from the adhesive tape for being configured at position of readiness and releases subsequent band TS2, is subsequent viscous using separate sheet stripping portion 31B removing Crossed belt T2 and later separation piece S2.Also, the front end portion of subsequent adhesive tape T2 is adsorbed by adhesive tape holding member 41B and is kept, It is adsorbed and keeps by separate sheet holding member 36B in the front end portion of later separation piece S2.When the step S7 of embodiment 2 starts It carves, each structure operates in advance as more than.

Step S7-1 (cutting of leading band)

When step S7 starts, it is first turned off leading band.That is, carrying out utilizing cutter list in adhesive tape engagement device 3a The cutting of the cutting of the leading adhesive tape T1 of member 65 and the leading separate sheet S1 using knife unit 49.At the beginning of step S7-1 Shown in (a) of the structure such as Figure 22 on the periphery of the bonding ribbon preparing department 61 and separation chip bonding unit 21 at quarter.

In this state, as shown in (b) of Figure 22, make knife unit 65 from initial position shown in dotted line to solid line Shown in the 1st cutting execution position suitably move.By the movement, knife unit 65 leading adhesive tape holding member 19 with connect Leading adhesive tape T1 is cut off ((b) of Figure 22, arrow by the scheduled position between crossed belt holding member 63 in the direction of the width W1)。

By the cutting, the downstream side (T1f) of leading adhesive tape T1 is cut from the adhesive tape volume 27A for being located at supply position From.The rear end part of the leading adhesive tape T1f cut off from adhesive tape volume 27A is adsorbed by leading adhesive tape holding member 19 to be kept. Also, it is still kept with the front end portion of the upstream side (T1r) of the adhesive tape volume 27A leading adhesive tape T1 being connected by bonding ribbon Component 63 and adhesive tape holding member 41A absorption are kept.

Also, leading adhesive tape T1 is cut off, on the other hand, cuts off leading separate sheet S1.That is, similarly to Example 1, knife Have scheduled position of the unit 49 between leading separate sheet holding member 47 and separate sheet holding member 36A, will separate in advance Piece S1 cuts off ((b) of Figure 22, arrow W2) in entire width direction.Leading separate sheet S1 is cut off by knife unit 49, first The downstream side (S1f) of row separate sheet S1 is cut off from adhesive tape volume 27A.Distinguished by leading adhesive tape T1 and leading separate sheet S1 It is cut off and is cut off from adhesive tape volume 27A, so that the process of step S7-1 is completed.

Step S7-2 (production of bonding ribbon)

After leading adhesive tape T1 and the leading respective downstream side separate sheet S1 are cut off from adhesive tape volume 27A, execute The production process of the bonding ribbon of step S7-2.In the present embodiment, the front end of leading adhesive tape T1r is cut using knife unit 65 A part is taken, the part of the front end portion cut is used as bonding ribbon CT.

Specifically, as shown in figure 23, cutting knife unit 65 from the 1st cutting execution position to the shown in solid the 2nd Disconnected execution position suitably moves.By the movement, knife unit 65 is in adhesive tape holding member 41A and bonding ribbon holding member 63 Between scheduled position, leading adhesive tape T1r is cut off in the direction of the width.

By the cutting, the downstream side (front end portion) of leading adhesive tape T1r is cut off from adhesive tape volume 27A, is produced For bonding strap, that is, bonding ribbon CT of engagement.Also, the bonding ribbon CT of production is adsorbed by bonding ribbon holding member 63 and is kept.And And still with the front end portion of the upstream side of the adhesive tape volume 27A leading adhesive tape T1r being connected by adhesive tape holding member 41A absorption is kept.

Step S7-3 (reversion of bonding ribbon)

After the completing of bonding ribbon, invert bonding ribbon.That is, by protecting the bonding ribbon that remain bonding ribbon CT It holds component 63 suitably to move from cutting ready position to engagement ready position, thus with the adhesive layer C of bonding ribbon CT and viscous in advance The adhesive layer C of the front end portion of crossed belt T1r opposite mode makes bonding ribbon CT be displaced (Figure 24).

It is further preferred, that in bonding ribbon preparing department 61 carry out bonding ribbon CT reversion process synchronously, make to engage Band preparing department 61, leading adhesive tape holding member 19, separation chip bonding unit 21 are kept out of the way from band feed unit 17.As what is kept out of the way The specific example in direction keeps bonding ribbon preparing department 61 and leading adhesive tape holding member 19 downward along the release direction of adhesive tape T Trip side is kept out of the way, and keeps out of the way separation chip bonding unit 21 downstream along the release direction of separate sheet.

Bonding ribbon preparing department 61, leading adhesive tape holding member 19, separation chip bonding unit 21 between retreating position more The not position Chong Die with swivel plate 23 preferably in the main view of adhesive tape engagement device 3.The reversion of bonding ribbon CT is completed, by The process of this step S7-3 is completed.Shown in (a) for completing structure such as Figure 25 of the adhesive tape engagement device 3a at moment.

Step S7-4 (switching of adhesive tape volume)

After inverting bonding ribbon CT, the switching of adhesive tape volume is carried out.That is, keeping the swivel plate 23 with feed unit 17 suitable Work as rotation, carrys out handover configurations in the adhesive tape of supply position and roll up 27.By the rotation of swivel plate 23, it is configured at the viscous of supply position Crossed belt volume 27 from loadings with TS be reduced to make a reservation for adhesive tape volume 27A ((a) of Figure 25) below be switched to be filled with it is enough The adhesive tape with TS of amount rolls up 27B ((b) of Figure 25).

In addition, by the rotation of turntable 23, each structure being connected with turntable 23 also with the position together of turntable 23 It moves.Therefore, the subsequent adhesive tape T2 for being held in adhesive tape holding member 41B is mobile from position of readiness to supply position.Another party Face, the structure not being connected with turntable 23 i.e. bonding ribbon preparing department 63, leading adhesive tape holding member 19 and separate sheet connect The position for closing unit 21 not will receive the influence generated by the rotation of turntable 23.

As a result, the front end portion of subsequent adhesive tape T2 is to the leading bonding kept by leading adhesive tape holding member 19 It is moved near rear end part with T1f and the bonding ribbon CT kept by bonding ribbon holding member 63.Make swivel plate 23 rotate and The adhesive tape for being configured at supply position volume 27 is switched to other adhesive tape volume 27, so that the process of step S7-4 is completed.

Step S7-5 (engagement of adhesive tape)

After the switching of adhesive tape volume is completed, the engagement of adhesive tape is carried out.That is, making to keep out of the way as shown in (a) of Figure 26 The engagement band maintaining part 61 of retreating position and leading adhesive tape holding member 19 are to by near position movement.That is, leading adhesive tape is protected Hold component 19 with remain the state of the rear end of leading adhesive tape T1f from retreating position shown in dotted line to shown in solid It is mobile by near position.As a result, the rear end of leading adhesive tape T1f and subsequent adhesive tape T2 become with can be by bonding ribbon CT The close state of the degree engaged.

In the rear end and subsequent adhesive tape T2 for making leading adhesive tape T1f after, carry out adhesive tape T's by bonding ribbon CT Engagement.That is, making bonding ribbon holding member 63 to engage ready position shown in dotted line to solid line as shown in (b) of Figure 26 Shown in engagement execution position it is mobile.It is mobile to the direction R by bonding ribbon holding member 63, make bonding ribbon CT to leading adhesive tape The rear end of T1f and subsequent adhesive tape T2 pressing.As a result, the front end of the rear end of leading adhesive tape T1f and subsequent adhesive tape T2 It is engaged by bonding ribbon CT and becomes continuous strip.

After the engagement of the leading adhesive tape T1f and subsequent adhesive tape T2 carried out using bonding ribbon CT is completed, releasing is connect Crossed belt holding member 63 keeps the absorption of bonding ribbon CT.Then, make bonding ribbon holding member 63 from engagement execution position to connecing Ready position is closed to return.While the return, adhesive tape holding member 41B is released respectively, the absorption of subsequent adhesive tape T2 is protected It holds and the absorption of leading adhesive tape T1f is kept with leading adhesive tape holding member 19.It is engaged by bonding ribbon CT and becomes continuous Strip leading adhesive tape T1f and subsequent adhesive tape T2 by respective absorption holding be released from and can be put to direction L Out.

Step S7-6 (engagement of separate sheet)

The bonding process of adhesive tape is carried out, and carries out the bonding process of separate sheet.That is, making to move back as shown in (a) of Figure 26 The separation chip bonding unit 21 for keeping away retreating position is mobile.Leading separate sheet holding member 47 is to remain leading separate sheet S1f Rear end state, along separate sheet S release direction from retreating position shown in dotted line to engagement preparation shown in solid Position is mobile.

After close and opposite in the rear end and later separation piece S2 for making leading separate sheet S1f, as shown in (b) of Figure 26, Make leading separate sheet holding member 47 from shown in dotted line engagement ready position to engagement execution position shown in solid i.e. Direction R is mobile.By the movement, the rear end of leading separate sheet S1f is pressed to the front end of subsequent separate sheet S2.Also, it presses at this While pressure, leading separate sheet S1f is heated using heater 50.It is pressed by the heating, after leading separate sheet S1f End is engaged with the front end of later separation piece S2 by heat bonding, becomes continuous band-like.

After the engagement of the front end of the rear end and later separation piece S2 of leading separate sheet S1f is completed, separation in advance is released Piece holding member 47 keeps the absorption of leading separate sheet S1f, returns to leading separate sheet holding member 47 to initial position.? While the return, releases separate sheet holding member 36B and the absorption of later separation piece S2 is kept.Quilt is kept by each absorption It releases, the leading separate sheet S1f and later separation piece S2 for becoming continuous band-shaped can be released to direction L.By above process, The each process of the step S7 of embodiment 2 is completed.

By embodiment 2 band engagement device, can by leading adhesive tape T1f and leading separate sheet S1f respectively with filling Band TS2 to adhesive tape volume 27B is engaged automatically.In embodiment 1, a part of subsequent adhesive tape T2 is used as bonding ribbon CT, But passes through the structure of embodiment 2, also a part of leading adhesive tape T1 can be used as bonding ribbon CT.Leading adhesive tape T1 is with after Continuous adhesive tape T2 is the practical adhesive tape T used relative to workpiece similarly.

That is, similarly to Example 1, in the structure of embodiment 2, the bonding of the adhesive layer C and adhesive tape T of bonding ribbon CT Layer C also becomes identical structure, therefore, can be avoided the bonding force decline of bonding ribbon CT and adhesive tape T and the state of affairs of removing.This Outside, the adhesive layer C of the adhesive layer C of bonding ribbon CT and adhesive tape T is pressed and is engaged with opposite state, therefore, can be based on The respective bonding force of the adhesive layer C of the adhesive layer C and adhesive tape T of bonding ribbon CT realizes stronger engagement.In addition, In embodiment 2, no matter the quantity of feed unit 18, engaging band maintaining part 61, at least one therefore can be more Simplify the structure of adhesive tape engagement device 3.

The present invention is not limited to above embodiment, can be deformed as so following to implement.

(1) in embodiments, a part (adhesive tape volume 27 of the adhesive tape T that will be used for the stickup of wafer W is illustrated A part) it is used as the structure of bonding ribbon, but the present invention is not limited to only carry out the device of the structure.That is, being also possible to be used in combination The structure of 1st mode and the 2nd mode, a part for the adhesive tape T for being used for the adhering processes of wafer W is used as by the 1st mode to be connect Crossed belt, the 2nd mode supply the adhesive tape F different from the adhesive tape T for being wound in each adhesive tape volume 27 as bonding ribbon.

Firstly, the case where as 2 mode as described above is used, the case where capable of being listed below.That is, such as Figure 27 (a) shown in, in the case where there are much bumps as caused by convex block etc. on the surface of wafer W, as the adhesive tape of circuit protection, Sometimes adhesive tape Tp thicker using substrate B.

In this case, it using the structure of each embodiment, is incited somebody to action in a part for cutting adhesive tape Tp as bonding ribbon CT In the case that adhesive tape Tp is engaged with each other, the thickness of band increases at bonding part, and flexibility declines, and therefore, worry connects Crossed belt CT removes and occurs the state of affairs of joint error.Therefore, using the thicker adhesive tape Tp of substrate B, it is difficult to answer With such structure, that is, cutting adhesive tape rolls up 27 a part to be used as the structure of bonding ribbon CT.Such state of affairs can also incite somebody to action The adhesive tape joining with a higher rigidity of substrate B occurs in the case where wafer W.

Attached drawing used below is to illustrate and with an example of the structure of the variation of two modes.Such as (b) institute of Figure 27 Show, the adhesive tape engagement device 3b of variation also has other than each structure of the adhesive tape engagement device 3 with embodiment 1 There are sensor 71, mode decision portion 73 and bonding ribbon feed unit 75.In addition, the adhesive tape engagement device 3b of variation can also To be set as following structure, that is, based on the adhesive tape engagement device 3a of embodiment 2, there is sensor 71, mode decision portion 73 and bonding ribbon feed unit 75.

Sensor 71 detects the characteristic for being loaded on the adhesive tape T of adhesive tape volume 27.The example of characteristic as adhesive tape T, The thickness of substrate B, rigidity of substrate B etc. can be enumerated.As sensor 71, optical sensor can be properly used, TV is taken the photograph Camera etc. is used to detect the well known structure of the characteristic of adhesive tape T.

Mode decision portion 73 receives information relevant to the characteristic of adhesive tape T that sensor 71 detects, is based on the information To judge the mode that should be executed in the 1st mode and the 2nd mode.That is, adhesive tape T is used as bonding ribbon CT, also there is no problem In the case where, it is indicated the judgement that the meaning of engagement of adhesive tape T is executed by the 1st mode.

In the case where execute the judgement of the meaning of the 1st mode, control unit 81 receives the information of the judgement to unite One each structure of control.Each structure of adhesive tape engagement device 3 is under the control of control unit 81, the work that illustrates according to each embodiment The a part for being loaded on the adhesive tape T of adhesive tape volume 27 is used as bonding ribbon CT to carry out the engagement of adhesive tape T by sequence.

On the other hand, in the case where being not suitable for adhesive tape T being used as bonding ribbon CT, mode decision portion 73 is carried out by the 2nd Mode executes the judgement of the meaning of the engagement of adhesive tape T.In this case, control unit 81 receives the information of the judgement, unified to control Make each structure.Each structure of adhesive tape engagement device 3 supplies under the control of control unit 81 using from bonding ribbon feed unit 75 Adhesive tape F carry out the engagement of adhesive tape T.As an example for judging benchmark, the substrate B's for being detected as adhesive tape T In the case where 0.5mm or more, mode decision portion 73 is judged as that the 2nd mode is suitable, will select the letter of the meaning of the 2nd mode It ceases and is sent to control unit 81.

Bonding ribbon feed unit 75 has band supply unit 77, guide reel 78 and knife unit as shown in (a) of Figure 28 etc. 79.The spool rolled up from the adhesive tape for being wrapped around adhesive tape F with being filled with of separately preparing of adhesive tape T with supply unit 77 is by the bonding Band F is released and is supplied.Adhesive tape F preferably constitutes substrate B by the relatively thin and lower raw material of rigidity.In addition, the bonding of adhesive tape F Jointing material contained by layer C is preferably the stronger material of bonding force between the adhesive layer C of adhesive tape T.As adhesive tape F's One example of the thickness of substrate B, more preferably 0.1mm~0.2mm.

Guide reel 78 will wind from the adhesive tape F supplied with supply unit 77 and guide to bonding ribbon holding member 43.Cutter There is movable part and cutter in the same manner as unit 79 is equal with knife unit 45, be directed to the adhesive tape F of bonding ribbon holding member 43 It cuts off in the direction of the width.

Illustrate each process of the step S7 executed in the case where having selected 2 mode in variation below.Here, with reality Based on process and the device of applying example 1, illustrate the variation for carrying out the 2nd mode.The step S7 of 2nd mode and the 1st mode (each reality Apply example) step S7 difference be following two points.

1st, in variation, in step S7-1, bonding ribbon holding member 43 does not keep adhesive tape T, and is turned off elder generation Row adhesive tape T1 and leading separate sheet S1.2nd, in variation, in step S7-2, by bonding ribbon holding member 43 keep from The bonding ribbon F that bonding ribbon feed unit 75 supplies, the bonding ribbon that adhesive tape T is engaged with each other so that production is sent as an envoy to.

That is, in embodiment 1, subsequent adhesive tape T2 becomes the appended drawing reference D2 of Figure 11 before step S7 starts in advance Shown in state.That is, the subsequent adhesive tape T2 supplied from the adhesive tape of position of readiness volume 27B is by adhesive tape holding member 41B It is guided with bonding ribbon holding member 43B, and is adsorbed and keep by each holding member.On the other hand, the subsequent adhesive tape T2 of variation In advance as state shown in (a) of Figure 28.That is, the adhesive tape T2 supplied from adhesive tape volume 27B is not by bonding ribbon holding member 43B is kept, but is adsorbed by adhesive tape holding member 41B and kept its front end.

Firstly, in the step S7-1 of variation, similarly to Example 1, leading adhesive tape T1 and leading separate sheet S1 It is cut off, is cut off (Figure 12, Figure 13) from adhesive tape volume 27A respectively.

Also, in the step S7-2 of variation, as shown in (b) of Figure 28, released simultaneously from band supply unit 77 by adhesive tape F Supply, via guide reel 78, front end portion is kept the adhesive tape F of supply by bonding ribbon holding member 43B.Carrying out the suction After attached holding, predetermined position of the knife unit 79 between bonding ribbon holding member 43B and guide reel 78 is by adhesive tape F in width It spends on direction and cuts off ((c) of Figure 28).By the cutting, the front end portion of adhesive tape F is cut off from band supply unit 77.It cuts off The front end portion of adhesive tape F is kept as bonding ribbon CT by bonding ribbon holding member 43B.

In variation, more than utilization process makes, prepares bonding ribbon CT.Step S7-3 later process and each reality It is identical to apply example, therefore omits detailed description.By a series of process of variation, in step S7-5, by adhesive tape F shape At bonding ribbon CT so that state ((a) of Figure 29) adhesive layer C relative to each other presses on leading adhesive tape T1 and subsequent bonding With T2 ((b) of Figure 29).By the pressing, bonding ribbon CT engages leading adhesive tape T1 and subsequent adhesive tape T2.

It is configured in this variation, mode decision appropriate is carried out according to the characteristic of adhesive tape T, can suitably be selected Any one of 1st mode and the 2nd mode.That is, selecting the 1st in the case where the characteristic of adhesive tape T is suitable as bonding ribbon CT Mode can obtain distinctive beneficial effect by the way that a part of adhesive tape T is used as bonding ribbon CT in embodiments.

On the other hand, in the case where the characteristic of adhesive tape T is not suitable as bonding ribbon CT, the 2nd mode is selected.In the feelings Under condition, substrate B is thicker and adhesive tape T with a higher rigidity is relatively thin each other by means of substrate B and the part of the lower adhesive tape F of rigidity and Engagement.Therefore, the generation that adhesive tape T is itself functioned as to joint error caused by bonding ribbon CT can reliably be avoided.

In addition, in this variation, instantiating the detection of the automatic characteristic for executing adhesive tape T respectively, the selection of mode, gluing The structure of the supply of crossed belt F.But it is also possible to by carrying out at least one of they manually.That is, being loaded by adhesive tape T At the time of spool 25, operator is able to detect the characteristic of adhesive tape T.In addition, operator passes through appropriate operation inputting part 83, energy Enough selections in the 1st mode and the 2nd mode are more suitable for the mode of the engagement of adhesive tape T.Also, operator can will also bond It is cut to the part of suitable length with F, the absorption of bonding ribbon holding member 43 is made to keep the part of adhesive tape F.

(2) in each embodiment and each variation, as the example for the adhesive tape T for becoming the object engaged automatically, with electricity It is illustrated for the adhesive tape (protection band) of road protection, but not limited to this.That is, as adhesive tape T, in addition to protection Except band, as long as supporting the bearing adhesive tape (cutting belt) of semiconductor crystal wafer on entire ring frame, being protected to remove The adhesive tape of band and the strip that is pasted on the adhesive tape of the removing on the surface of protection band etc., it will be able to apply band of the invention The structure of engagement device.

(3) in each embodiment and each variation, band engagement device of the invention is illustrated using adhesive tape joining apparatus, But band engagement device of the invention and with recyclable device other than band sticker, can also apply to a variety of tape handling dresses It sets.As the example of tape processing unit, the band stripping off device for removing the various bands for being pasted on wafer can be enumerated or for inciting somebody to action Wafer is installed on mounting device (assembly machine) of ring frame etc..

(4) it in each embodiment and each variation, is disposed in the adhesive tape volume 27 with feed unit 17 and is not limited to two It is a, 3 or more can also be arranged.In this case, each structure of feed unit 18 is added according to the quantity of adhesive tape volume 27.

(5) in each embodiment and each variation, the structure using cutter cutting adhesive tape T is instantiated, but as long as being energy Enough structures for cutting off adhesive tape T in the direction of the width, then can be properly used well known cutting section and cutting-off method.

(6) in embodiment and each variation, about engagement separate sheet S process, instantiate using heating and pressing come The method of engagement, but it is not limited to this method.As the method for engagement separate sheet S, can also suitably change to be coated with Pressed in the state of jointing material and engage structure, both make ultrasonic bonding structure etc. using ultrasonic generator Other methods.

(7) it in each embodiment and each variation, instantiates and is wound with band TS i.e. in adhesive tape T in each adhesive tape volume 27 Add the structure for having the long strip of separate sheet S, but in the adhesive tape T formed by substrate B and adhesive layer C for not adding separate sheet S Structure of the invention can also be applied by being wound in the structure of each adhesive tape volume 27.In this case, it engages and fills in adhesive tape In setting, structure involved in the operation of separate sheet S can be omitted.For example, can omit by separate sheet S winding guidance structure, By separate sheet S structure cut off and engaged etc..

(8) in each embodiment and each variation, the sequence for executing each process of step S7 can also be suitably changed.As Then one example, the process that can also first carry out step S7-2 and step S7-3 carry out step S7-1's and step S7-4 Process.

Bonding ribbon CT is made by carrying out each process with such sequence, and with the adhesive layer C of bonding ribbon CT and is glued Facing mode makes bonding ribbon CT be displaced (reversion) to the adhesive layer C of crossed belt T each other.Then, leading adhesive tape T1 and elder generation are cut off Row separate sheet S1, and the adhesive tape for being configured at supply position volume 27 is switched to other adhesive tape volume 27.

In this case, viscous to wafer W stickup in the band TS for rolling up 27 using the adhesive tape being wound in supply position configuration During crossed belt T, it is able to use to be wound in and comes pre-production and preparation in the adhesive tape T of the adhesive tape volume 27 of position of readiness configuration Bonding ribbon CT.Therefore, the time needed for capable of shortening the process for engaging adhesive tape T can be improved adhesive tape engagement device 3 Working efficiency.

Claims

1. a kind of adhesive tape engagement device, the end of the adhesive tape of strip is bonded to each other,

The adhesive tape engagement device is characterized in that, is included

Band supply unit, the adhesive tape volume with multiple adhesive tapes are configured at supply position from multiple adhesive tape volumes 1st adhesive tape volume releases adhesive tape；

Cutting mechanism puts the 1st adhesive tape volume for being located at supply position from the volume of multiple adhesive tapes possessed by supply unit The 1st adhesive tape out predetermined position cut off, and by the 1st adhesive tape from the 1st adhesive tape cut roll from；

1st bonding ribbon manufacturing mechanism puts the 1st adhesive tape volume from the volume of multiple adhesive tapes possessed by supply unit The 1st adhesive tape out and a part cutting from any one of the 2nd adhesive tape of the 2nd adhesive tape volume releasing, to make The bonding strap of engagement；

Bonding ribbon holding member keeps the bonding strap；

Roller switching mechanism keeps the band supply unit mobile, and the adhesive tape for being configured at supply position is rolled up from the 1st adhesive tape Cut roll is changed to the 2nd adhesive tape volume；And

Adhesive tape engaging mechanism, using the bonding strap by from the 1st adhesive tape cut roll from the 1st adhesive tape Rear end and the front end for the 2nd adhesive tape released from the 2nd adhesive tape volume are joined together.

2. adhesive tape engagement device according to claim 1, which is characterized in that

Adhesive surface of the adhesive tape engaging mechanism in the adhesive surface of the bonding strap and the rear end part of the 1st adhesive tape With the adhesive surface of the front end portion of the 2nd adhesive tape it is facing each other in the state of, using the bonding strap by the 1st bonding The rear end of band and the front end of the 2nd adhesive tape are joined together.

3. adhesive tape engagement device according to claim 1 or 2, which is characterized in that

Each adhesive tape volume is released the adhesive tape for having separate sheet is added,

Adhesive tape engagement device have separate sheet engaging mechanism, the separate sheet engaging mechanism will from the 1st adhesive tape cut roll from The 1st separate sheet rear end and be joined together from the front end of the 2nd separate sheet that the 2nd adhesive tape volume is released.

4. adhesive tape engagement device according to claim 3, which is characterized in that

The separate sheet engaging mechanism has a heating mechanism, and the heating mechanism is by the rear end of the 1st separate sheet and 2nd point described The heating of at least one of front end from piece,

5. adhesive tape engagement device according to claim 1 or 2, which is characterized in that

The adhesive tape engagement device includes

3rd adhesive tape volume, for giving the 1st adhesive tape 3rd adhesive tape different with the characteristic of the 2nd adhesive tape；

Selection mechanism, the characteristic of characteristic or the 2nd adhesive tape based on the 1st adhesive tape select the 1st mode and the 2nd Arbitrary patterns in mode；And

Control mechanism controls the 1st bonding ribbon manufacturing mechanism and the 2nd engagement based on the selection of the selection mechanism Band manufacturing mechanism,

The control mechanism is controlled as follows,

In the case where having selected 1 mode, the control for stopping the 2nd bonding ribbon manufacturing mechanism is carried out, and make the 1st to connect The work of crossed belt manufacturing mechanism, is connect with cutting off a part and production of any one of the 1st adhesive tape and described 2nd adhesive tape The bonding strap shared,

In the case where having selected 2 mode, the control for stopping the 1st bonding ribbon manufacturing mechanism is carried out, and make the 2nd to connect Crossed belt manufacturing mechanism work, to cut off a part of the 3rd adhesive tape and make the bonding strap of engagement.