CN110304480B

CN110304480B - Adhesive tape joining apparatus

Info

Publication number: CN110304480B
Application number: CN201910194512.9A
Authority: CN
Inventors: 奥野长平
Original assignee: Ridong Precision Machine Co ltd; Nitto Denko Corp
Current assignee: Ridong Precision Machine Co ltd; Nitto Denko Corp
Priority date: 2018-03-27
Filing date: 2019-03-14
Publication date: 2022-11-25
Anticipated expiration: 2039-03-14
Also published as: TW201942994A; KR102548801B1; CN110304480A; JP7065555B2; KR20190113530A; TWI793214B; JP2019172393A

Abstract

The invention provides an adhesive tape jointing device which can joint the ends of the adhesive tape more firmly without reusing the adhesive tape for jointing. A preceding adhesive tape (T1) is cut off from an adhesive tape roll (27A), and a part of a succeeding adhesive tape (T2) is cut off in a bonding tape producing section (33) to produce a bonding tape CT. After the adhesive tape roll (27A) located at the supply position is switched to another adhesive tape roll (27B), the front end of the subsequent adhesive tape (T2) paid out from the adhesive tape roll (27B) and the rear end of the preceding adhesive tape (T1) cut from the adhesive tape roll (27A) are joined by the joining tape (CT).

Description

Adhesive tape joining apparatus

Technical Field

The present invention relates to an adhesive tape joining apparatus for joining a leading end of a succeeding adhesive tape to a trailing end of a preceding adhesive tape in a process of supplying the adhesive tape to be bonded to various substrates such as a semiconductor wafer, an LED (Light emitting diode), and an electronic circuit.

Background

A semiconductor wafer (hereinafter referred to as a "wafer" as appropriate) has a circuit pattern of many elements formed on its surface. For example, bumps and fine circuits are formed on the surface of the wafer. Therefore, a protective adhesive tape is attached to prevent the circuit surface from being contaminated or damaged during back grinding and transportation.

Here, a conventional structure of a tape joining apparatus for joining an adhesive tape to a surface of a wafer is described. As shown in fig. 30, the conventional tape application apparatus 101 includes a tape supply unit 103, a separator peeling unit 105, a holding table 107, a tape application unit 109, a tape cutting mechanism 111, a tape collection unit 113, a separator collection unit 115, and the like.

The tape supply unit 103 discharges and guides the adhesive tape TS from a supply reel loaded with an adhesive tape roll around which the adhesive tape TS with a release sheet for circuit protection is wound. The separator peeling section 105 peels the separator S from the discharged adhesive tape TS. The holding table 107 holds the wafer W with the circuit formation surface facing upward by suction. An example of the tape application section 109 is an application roller, and is horizontally moved leftward in fig. 30. By this horizontal movement, the tape joining section 109 joins the adhesive tape T from which the separation sheet S is peeled to the wafer W on the holding table 107.

The tape cutting mechanism 111 has a cutter 111a, and the tape cutting mechanism 111 rotates about a vertical axis line indicated by reference numeral P, whereby the adhesive tape T is cut along the outer shape of the wafer W. The unnecessary tape Tn, which is the unnecessary part of the adhesive tape T after cutting, is wound around a winding shaft constituting the tape collecting portion 113 in a roll shape and collected. The separator S peeled from the adhesive tape T is wound around a winding shaft constituting the separator collecting portion 115 in a roll shape and collected.

In such a tape sticking apparatus, when the amount of the adhesive tape T loaded in the tape supply unit 103 is less than a certain amount, or when the amount of the unnecessary tape Tn recovered in the tape recovery unit 113 or the like exceeds a certain amount, a replacement roller is necessary. In the case where the roll replacement is performed in the conventional tape joining apparatus 101, the operator needs to manually perform a complicated operation.

That is, the tape supply unit 103 needs to perform a series of operations such as cutting the adhesive tape T fed from the adhesive tape roll, exchanging the adhesive tape roll, joining the cut adhesive tape T, and feeding the adhesive tape T again. In the tape collecting section 113 and the like, a series of operations such as cutting the unnecessary tape Tn, removing the unnecessary tape Tn collected in a roll shape, joining the unnecessary tape Tn to the winding shaft, and rewinding the unnecessary tape Tn are required. While these series of operations are performed in the conventional apparatus, the operation of the tape application apparatus needs to be interrupted.

In recent years, in order to avoid a decrease in the joining efficiency due to an interruption in the operation of the tape joining apparatus, an attempt has been made to automatically perform a roll exchange operation, particularly an operation of joining the ends of the cut adhesive tape T to each other. As an example of this, the following tape joining method is proposed (for example, see patent document 1). That is, a bonding tape, which is a pressure-sensitive adhesive tape for bonding, is attached to the rear end of a preceding pressure-sensitive adhesive tape with a release sheet.

After the joining tape is attached, the rear end of the adhesive tape with the separator to which the joining tape is attached is pressed against the front end of the adhesive tape with the separator to be joined. By such a method, the ends of the preceding adhesive tape and the subsequent adhesive tape can be joined to each other by the joining tape.

Patent document 1: japanese laid-open patent publication No. 2014-133616

Disclosure of Invention

Problems to be solved by the invention

However, the above conventional apparatus has the following problems.

That is, when a preceding adhesive tape and a subsequent adhesive tape are joined in a conventional apparatus, it is necessary to separately prepare a joining tape to be referred to as a 3 rd adhesive tape. Further, since a device for supplying and attaching the adhesive tape is separately required, the device for joining the adhesive tapes is increased in size.

The adhesive surface of the joining tape is in contact with the non-adhesive surface of the rear end of the preceding adhesive tape and the non-adhesive surface of the front end of the succeeding adhesive tape. Therefore, the adhesive strength between the joining tape CT and the preceding adhesive tape and the adhesive strength between the joining tape CT and the succeeding adhesive tape are weak. Therefore, there is a concern that a bonding error may occur due to the peeling of the preceding adhesive tape and the subsequent adhesive tape that are to be bonded.

The present invention has been made in view of such circumstances, and a main object thereof is to provide an adhesive tape joining apparatus capable of joining ends of adhesive tapes more firmly without reusing the adhesive tapes for joining.

Means for solving the problems

To achieve the above object, the present invention has the following configuration.

That is, an adhesive tape joining apparatus for joining end portions of a long adhesive tape to each other,

the adhesive tape joining apparatus is characterized by comprising:

a tape supply unit having a plurality of adhesive tape rolls of adhesive tape, and configured to discharge the adhesive tape from a 1 st adhesive tape roll arranged at a supply position among the plurality of adhesive tape rolls;

a cutting mechanism for cutting the 1 st adhesive tape, which is fed from the 1 st adhesive tape roll located at the supply position among the plurality of adhesive tape rolls provided in the tape supply portion, at a predetermined position, and cutting the 1 st adhesive tape from the 1 st adhesive tape roll;

a 1 st adhesive tape producing mechanism that cuts off a part of either one of the 1 st adhesive tape fed out from the 1 st adhesive tape roll and the 2 nd adhesive tape fed out from the 2 nd adhesive tape roll among a plurality of adhesive tape rolls included in a tape supply unit to produce an adhesive tape sheet for bonding;

an adhesive tape holding member that holds the adhesive tape sheet;

a roller switching mechanism that moves the tape supply unit and switches the adhesive tape roll disposed at the supply position from the 1 st adhesive tape roll to the 2 nd adhesive tape roll; and

an adhesive tape joining mechanism that joins the rear end of the 1 st adhesive tape cut off from the 1 st adhesive tape roll and the front end of the 2 nd adhesive tape paid out from the 2 nd adhesive tape roll by the adhesive tape sheet.

According to the present invention, the 1 st joining tape making means cuts a part of either the 1 st adhesive tape or the 2 nd adhesive tape to be joined, to make a joining adhesive tape piece. The adhesive tape joining mechanism joins the rear end of the 1 st adhesive tape and the front end of the 2 nd adhesive tape by the adhesive tape sheet.

In this case, a part of the 1 st adhesive tape or the 2 nd adhesive tape to be joined is used as an adhesive tape sheet for joining. Therefore, when joining the adhesive tapes, it is not necessary to prepare in advance a tape different from each adhesive tape to be joined as an adhesive tape for joining. Further, it is not necessary to provide the tape joining apparatus with a structure for supplying the other tape or a structure for attaching the other tape to the adhesive tape to be joined. Therefore, it is possible to avoid a situation in which preparation for joining the adhesive tape becomes complicated, a situation in which the tape joining device becomes large, and a situation in which the cost increases.

The characteristics of the adhesive tape piece for joining which joins the rear end of the 1 st adhesive tape and the front end of the 2 nd adhesive tape are the same as those of the joining target. Therefore, a situation in which the adhesive force between the adhesive tape sheet and the 1 st adhesive tape is low, and a situation in which the adhesive force between the adhesive tape sheet and the 2 nd adhesive tape is low can be reliably avoided. Therefore, the occurrence of a bonding error due to re-peeling at the bonded portion can be more reliably prevented.

In the above invention, it is preferable that the adhesive tape joining means joins the rear end of the 1 st adhesive tape and the front end of the 2 nd adhesive tape by the adhesive tape sheet in a state where the adhesive surface of the adhesive tape sheet, the adhesive surface of the rear end portion of the 1 st adhesive tape and the adhesive surface of the front end portion of the 2 nd adhesive tape face each other.

According to this configuration, the adhesive tape joining means joins the rear end of the 1 st adhesive tape and the front end of the 2 nd adhesive tape by the adhesive tape sheet in a state where the adhesive surface of the adhesive tape sheet, the adhesive surface of the rear end portion of the 1 st adhesive tape and the adhesive surface of the front end portion of the 2 nd adhesive tape face each other. That is, when joining is performed, the adhesive surface of the rear end portion of the 1 st adhesive tape and the adhesive surface of the front end portion of the 2 nd adhesive tape face the same direction, whereas the adhesive surface of the adhesive tape piece faces the adhesive surface of each adhesive tape.

Therefore, the adhesive surface of the adhesive tape piece is joined by being brought into contact with the adhesive surface of the rear end portion of the 1 st adhesive tape and the adhesive surface of the front end portion of the 2 nd adhesive tape, respectively. In this case, the adhesive force of the joint portion is affected not only by the adhesive force of the adhesive tape sheet but also by the adhesive force of the 1 st adhesive tape and the 2 nd adhesive tape. Therefore, the adhesion of the joint portion can be further improved, and therefore, the occurrence of a joint error of the joint portion can be more reliably avoided.

Further, in the above invention, it is preferable that each of the adhesive tape rolls discharges the adhesive tape added with a separator, and the adhesive tape joining apparatus includes a separator joining mechanism that joins a rear end of a 1 st separator separated from the 1 st adhesive tape roll and a front end of a 2 nd separator discharged from the 2 nd adhesive tape roll.

According to this configuration, the rear end of the 1 st separator cut from the 1 st adhesive tape roll and the front end of the 2 nd separator paid out from the 2 nd adhesive tape roll are joined by the separator joining mechanism. That is, the adhesive tapes are joined to each other to form a continuous long tape, and the separator pieces are also joined to each other to form a continuous long tape. Therefore, the separator can be continuously wound and collected as well as the adhesive tape, and thus the apparatus can be continuously operated for a longer period of time.

In the above invention, it is preferable that the separator joining means includes heating means for heating at least one of a rear end of the 1 st separator and a front end of the 2 nd separator,

the 1 st separator sheet and the 2 nd separator sheet are made of materials that can be joined by thermal bonding.

With this configuration, the separator joining mechanism can heat at least one of the rear end of the 1 st separator and the front end of the 2 nd separator, thereby joining the 1 st separator and the 2 nd separator. Therefore, the respective separation sheets can be more appropriately joined to each other.

Further, in the above invention, it is preferable that the adhesive tape joining apparatus includes:

a 3 rd adhesive tape roll which supplies a 3 rd adhesive tape having a characteristic different from that of the 1 st adhesive tape and the 2 nd adhesive tape;

a 2 nd adhesive tape producing means for cutting a part of the 3 rd adhesive tape to produce an adhesive tape piece for bonding;

a selection mechanism that selects any one of a 1 st mode and a 2 nd mode based on a characteristic of the 1 st adhesive tape or a characteristic of the 2 nd adhesive tape; and

a control mechanism that controls the 1 st joint tape making mechanism and the 2 nd joint tape making mechanism based on a selection of the selection mechanism,

the control mechanism is controlled as follows,

when the 1 st mode is selected, control is performed to stop the 2 nd joining tape forming means and the 1 st joining tape forming means is operated to cut a part of either the 1 st adhesive tape or the 2 nd adhesive tape to form an adhesive tape piece for joining,

when the 2 nd mode is selected, the 1 st bonding tape producing means is controlled to stop, and the 2 nd bonding tape producing means is operated to cut a part of the 3 rd bonding tape to produce a bonding adhesive tape piece.

According to this structure, the adhesive tape joining apparatus has the 3 rd adhesive tape roll, and can appropriately select either one of the 1 st mode and the 2 nd mode based on the characteristics of the 1 st adhesive tape or the 2 nd adhesive tape which is the joining object. When the 1 st mode is selected, the 1 st joining tape making means operates to make a joining adhesive tape piece using a part of the 1 st adhesive tape or the 2 nd adhesive tape. On the other hand, when the mode 2 is selected, the 2 nd bonding tape making mechanism is operated to make a bonding adhesive tape piece using the 3 rd adhesive tape.

In this case, when the properties of the 1 st adhesive tape or the 2 nd adhesive tape are not suitable for the adhesive tape sheet for bonding, the 2 nd mode is selected, and an appropriate 3 rd adhesive tape is used as the adhesive tape sheet for bonding. Therefore, the 1 st adhesive tape and the 2 nd adhesive tape can be firmly joined by the 3 rd adhesive tape.

On the other hand, in the case where the properties of the 1 st adhesive tape or the 2 nd adhesive tape are suitable for the adhesive tape sheet for bonding, the 1 st mode is selected, and the 1 st adhesive tape or the 2 nd adhesive tape is used as a part thereof to bond the 1 st adhesive tape and the 2 nd adhesive tape. Thus, by appropriately differentiating the use of the 1 st mode and the 2 nd mode, the joining of the adhesive tapes to each other can be performed regardless of the characteristics of the 1 st adhesive tape and the 2 nd adhesive tape. That is, the versatility of the adhesive tape joining apparatus can be improved. In addition, since the adhesive tapes are joined to each other in the 1 st mode without using the 3 rd adhesive tape, consumption of the 3 rd adhesive tape as a sub-material can be suppressed, and a joining error can be more reliably avoided when the 1 st adhesive tape and the 2 nd adhesive tape are joined.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the adhesive tape joining apparatus of the present invention, when joining the end portions of the long adhesive tape to which the separator is added, the adhesive tape piece for joining is made using a part of the adhesive tape to be joined, and the end portions of the adhesive tape are joined using the adhesive tape piece. Therefore, when preparing the adhesive tape to be joined, it is not necessary to separately prepare an adhesive tape sheet for joining. Further, since the adhesive tape to be joined and the adhesive tape sheet to be joined have the same characteristics as the structural material, it is possible to reliably avoid a situation in which the adhesive force between the adhesive tape sheet to be joined and the adhesive tape to be joined is low. Further, the size and cost increase of the adhesive tape joining apparatus can be prevented.

Drawings

Fig. 1 is a front view showing a basic structure of an adhesive tape joining apparatus according to embodiment 1.

Fig. 2 is a diagram showing a structure of a tape supply unit of embodiment 1.

Fig. 2 (a) is a perspective view of the tape feeding unit, and fig. 2 (b) is a front view of the tape feeding unit.

Fig. 3 is a diagram showing the structure of the tape supplying section and the separator peeling section in example 1.

Fig. 4 is a diagram showing the structure of a joint tape forming part according to example 1.

Fig. 5 is a diagram showing a structure of a separator joining unit according to embodiment 1.

Fig. 6 is a sectional view showing the structure of the pressure-sensitive adhesive tape with a separator of example 1.

Fig. 7 is a flowchart showing the operation of the adhesive tape joining apparatus according to example 1.

Fig. 7 (a) is a flowchart showing an outline of the operation of attaching the adhesive tape to the wafer, and fig. 7 (b) is a flowchart explaining the details of the operation of step S7.

Fig. 8 is a diagram showing the operation of step S2 in example 1.

Fig. 8 (a) is a view showing a state before the adhesive tape is attached to the wafer, and fig. 8 (b) is a view showing a state after the adhesive tape is attached to the wafer.

Fig. 9 is a diagram showing the operation of step S3 in example 1.

Fig. 10 is a diagram showing the operation of step S4 in example 1.

Fig. 11 is a diagram showing the structure of the tape splicing apparatus at the start of step S7 in embodiment 1.

Fig. 12 is a diagram showing an operation of cutting the preceding adhesive tape in step S7-1 of example 1.

Fig. 12 (a) is a diagram showing a state in which the cutter unit is disposed at the initial position, fig. 12 (b) is a diagram showing a state in which the cutter unit is moved to the cutting preparation position, fig. 12 (c) is a diagram showing a state in which the cutter unit is moved to the cutting execution position and the preceding adhesive tape is cut, and fig. 12 (d) is a cross-sectional view showing a positional relationship between the cutter unit and the preceding adhesive tape in step S7-2 as viewed from the discharge direction (L direction) of the preceding adhesive tape.

Fig. 13 is a diagram showing an operation of cutting the preceding separator in step S7-1 of example 1.

Fig. 13 (a) is a diagram showing a state in which the cutter unit is disposed at the initial position, fig. 13 (b) is a diagram showing a state in which the cutter unit is moved to the cutting preparation position, and fig. 13 (c) is a diagram showing a state in which the cutter unit is moved to the cutting execution position and the preceding separator is cut.

Fig. 14 is a diagram showing the operation in step S7-2 of embodiment 1.

Fig. 14 (a) is a view showing a state in which the cutter unit is disposed at the initial position, fig. 14 (b) is a view showing a state in which the cutter unit moves to the cutting execution position and cuts the subsequent adhesive tape to produce the joined tape, and fig. 14 (c) is a view showing a schematic configuration of the tape joining apparatus after the completion of the respective steps up to step S7-3.

FIG. 15 is a diagram showing the operation in step S7-3 in example 1.

Fig. 15 (a) is a diagram showing a state in which the adhesive tape holding member is arranged at the cutting preparation position, fig. 15 (b) is a diagram showing a state after the adhesive tape holding member is displaced from the cutting preparation position to the bonding preparation position, fig. 15 (c) is a diagram showing a state in which the preceding adhesive tape holding member is arranged at the close position, and fig. 15 (d) is a diagram showing a state in which the preceding adhesive tape holding member is moved from the close position to the retracted position.

FIG. 16 is a diagram showing the operation in step S7-4 in example 1.

Fig. 16 (a) is a diagram showing a state of the tape splicing device before switching of the adhesive tape roll arranged at the supply position, and fig. 16 (b) is a diagram showing a state of the tape splicing device after switching of the adhesive tape roll arranged at the supply position.

FIG. 17 is a diagram showing the operation in step S7-5 in example 1.

Fig. 17 (a) is a diagram showing a state in which the adhesive tape holding member is disposed at the joining preparation position, fig. 17 (b) is a diagram showing a state in which the adhesive tape holding member is displaced from the joining preparation position to the joining execution position and presses the adhesive tape, fig. 17 (c) is a diagram showing a state in which joining of the adhesive tapes by the adhesive tape is completed and holding of the adhesive tape is released, and fig. 17 (d) is a diagram showing a state in which release of the joined adhesive tape is resumed.

FIG. 18 is a diagram showing the operation in step S7-6 in example 1.

Fig. 18 (a) is a diagram showing a state in which the leading separator holding member is disposed at the joining preparation position, fig. 18 (b) is a diagram showing a state in which the leading separator holding member is displaced from the joining preparation position to the joining execution position and the leading separator is heat-pressed against the following separator, and fig. 18 (c) is a diagram showing a state in which joining of the separators is completed and holding of the separators is released.

FIG. 19 is a diagram showing the operations of step S7-5 and step S7-6 in example 1.

Fig. 19 (a) is a view showing a schematic configuration of a tape joining apparatus in a state where joining of adhesive tapes and joining of release sheets are performed, and fig. 19 (b) is a view showing a schematic configuration of a tape joining apparatus in a state where joining of adhesive tapes and joining of release sheets are completed.

Fig. 20 is a diagram for explaining the problems of the conventional configuration and the effects of the configuration of example 1.

Fig. 20 (a) is a sectional view of a bonding portion in the case where the conventional bonding method is performed using a single-sided tape as a bonding tape, fig. 20 (b) is a sectional view of a bonding portion in the case where the conventional bonding method is performed using a double-sided tape as a bonding tape, and fig. 20 (c) is a sectional view of a bonding portion in the case where the bonding method of example 1 is performed.

Fig. 21 is a diagram showing the structure of the tape splicing apparatus at the start of step S7 in embodiment 2.

FIG. 22 is a diagram showing the operation in step S7-1 of example 2.

Fig. 22 (a) is a view showing a state before the preceding adhesive tape and the preceding separator are cut, and fig. 22 (b) is a view showing a state after the preceding adhesive tape and the preceding separator are cut.

Fig. 23 is a diagram showing the operation of step S7-2 in embodiment 2.

FIG. 24 is a diagram showing the operation in step S7-3 in example 2.

FIG. 25 is a diagram showing the operation in step S7-4 of example 2.

Fig. 25 (a) is a diagram showing a state of the tape splicing device before switching of the adhesive tape roll arranged at the supply position, and fig. 25 (b) is a diagram showing a state of the tape splicing device after switching of the adhesive tape roll arranged at the supply position.

FIG. 26 is a diagram showing the operation of step S7-5 and step S7-6 in example 2.

Fig. 26 (a) is a view showing a state before starting the joining of the adhesive tapes to each other and the joining of the release sheets to each other, and fig. 26 (b) is a view showing a state in which the joining of the adhesive tapes to each other and the joining of the release sheets to each other are performed.

Fig. 27 is a view showing a belt engagement device according to a modification.

Fig. 27 (a) is a cross-sectional view of a joining portion of an adhesive tape in the case where joining of the adhesive tape of the embodiment is performed using an adhesive tape having a thick substrate, and fig. 27 (b) is a view showing a schematic configuration of a tape joining apparatus of a modification.

Fig. 28 is a diagram showing an operation of the belt joining apparatus according to the modification.

Fig. 28 (a) is a diagram showing an initial state of the subsequent adhesive tape at the start of step S7 of the modification, fig. 28 (b) is a diagram showing a state before the start of cutting of the adhesive tape F in step S7-2 of the modification, and fig. 28 (c) is a diagram showing a state in which the process of step S7-2 of the modification is completed and the production of the joined tape is completed.

Fig. 29 is a diagram showing an operation of a belt splicing apparatus according to a modification.

Fig. 29 (a) is a diagram showing a state before the process of step S7-5 of the modification is started, and fig. 29 (b) is a diagram showing a state in which the process of step S7-5 of the modification is performed and the adhesive tapes are joined to each other.

Fig. 30 is a diagram showing a configuration of a tape application device of a conventional example.

Description of the reference numerals

1. An adhesive tape attaching device; 3. a tape engagement device; 5. a holding stage; 7. a tape application unit; 9. a tape cutting unit; 11. a tape peeling unit; 13. a belt recovery unit; 15. a separator recovery unit; 17. a tape supply unit; 19. a preceding adhesive tape holding member; 21. a separator joining unit; 27. an adhesive tape roll; 29. a tape supply section; 31. a separator peeling section; 33. a joint tape making section; 36. a separator holding member; 41. an adhesive tape holding member; 43. a joint belt holding member; 45. a cutter unit; 47. a preceding separator holding member; 49. a cutter unit; 50. a heater; TS, tape (adhesive tape with separator); t, an adhesive tape; s, separating the slices; B. a substrate; C. and (5) an adhesive layer.

Detailed Description

[ example 1 ]

Embodiment 1 of the present invention is explained below with reference to the drawings. Fig. 1 is a front view showing the basic structure of an adhesive tape joining apparatus 1 having an adhesive tape joining apparatus of embodiment 1. In the drawings showing the adhesive tape joining apparatus 1, a supporting member for supporting various structures, a driving member for driving various structures, and the like are not shown.

In this embodiment, a case will be described as an example in which an adhesive tape T for surface protection, which is to be bonded to various substrates such as a semiconductor wafer W (hereinafter simply referred to as "wafer W"), is supplied in a long shape in which a separator sheet S is joined, and is cut into a predetermined shape on the downstream side. That is, in the present embodiment, long adhesive tapes are joined to each other. The adhesive tape T with the separator S spliced thereto is referred to as a tape TS.

In the present embodiment, "upstream" and "downstream" are defined as in the discharge direction of the tape TS. That is, "upstream" means a side closer to a tape supplying section described later in the discharge direction of the tape TS. As shown in fig. 6, the adhesive tape T has a structure in which a non-adhesive base material B and an adhesive layer C having adhesiveness are laminated. As a material constituting the separator sheet S, a material capable of being joined by thermal bonding is more preferable.

< description of the overall Structure >

As shown in fig. 1, an adhesive tape joining apparatus 1 of example 1 includes an adhesive tape joining apparatus 3, a holding table 5, a tape joining unit 7, a tape cutting unit 9, a tape peeling unit 11, a tape collecting unit 13, and a separator collecting unit 15. The adhesive tape joining apparatus 3 joins the front end of another adhesive tape T subsequent to the preceding adhesive tape T to the rear end of the preceding adhesive tape T. The specific structure of the adhesive tape joining apparatus 3 will be described later.

The holding table 5 mounts and holds the wafer W with the circuit-formed surface facing upward. In the embodiment, a chuck table for holding the wafer W by suction is used as the holding table 5, but the configuration of the holding table 5 is not limited to this. A cutter moving groove 5a is formed in the upper surface of the holding table 5 so that a cutter blade 9c provided in a tape cutting unit 11 described later rotates and moves along the outer shape of the wafer W to cut the adhesive tape T. The holding base 5 may be configured to be capable of appropriate lifting and lowering movements.

The tape joining unit 7 joins the adhesive tape T to the circuit surface of the wafer W placed on the holding table 5 and sucked and held. As shown in fig. 1, the tape application unit 7 includes a movable table 7a horizontally reciprocating in the left-right direction along a track not shown, and an application roller 7b pivotally supported by a bracket connected to the movable table 7 a.

The tape cutting unit 9 is provided with a support arm 9b at a lower portion of a movable table 9a that can be driven to move up and down, and the support arm 9b can be driven to rotate about a vertical axis P located at the center of the holding table 5. A cutter 9c having a downward cutting edge is attached to a free end side of the support arm 9b. That is, the tape cutting unit 9 is configured to cut the adhesive tape T by rotating the support arm 9b about the longitudinal axis P as a rotation center and moving the cutter 9c along the outer periphery of the wafer W.

The tape peeling unit 11 separates the adhesive tape Tw cut by the cutter 9c and adhered to the surface of the wafer W and the unnecessary tape Tn, which is the unnecessary adhesive tape T, after the adhesive tape Tw is cut. The tape peeling unit 11 has a guide roller 11a and a nip roller 12 that maintain tension of the unnecessary tape Tn. The pinch roller 12 is composed of a pinch roller 12a that can move up and down and a conveying roller 12b that is driven by a motor. The tape peeling unit 11 is configured to be horizontally reciprocated left and right along a rail not shown.

The tape recovery unit 13 is disposed downstream of the tape peeling unit 11, and a recovery spool for winding up the unnecessary tape Tn is driven and rotated in a winding direction. In the separator collecting section 15, a collecting reel for collecting the separator S peeled off from the adhesive tape T is driven and rotated in the winding direction.

The adhesive tape joining apparatus 1 further includes a control unit 81 and an input unit 83. The control unit 81 includes a CPU (central processing unit) and the like, and collectively controls various operations and the like for each configuration provided in the adhesive tape joining apparatus 1. Examples of the input unit 83 include a console panel and a keyboard, and the operator inputs various instructions using the input unit 83. The content of the instruction input to the input unit 83 is transmitted to the control unit 81, and the control unit 81 can perform various controls in accordance with the instruction.

< Structure of adhesive tape joining apparatus >

Here, the structure of the adhesive tape joining apparatus 3 of embodiment 1 is explained. The adhesive tape joining apparatus 3 includes a tape supply unit 17, a preceding adhesive tape holding member 19, and a separator joining unit 21.

As shown in fig. 2 (a), the tape supply unit 17 is configured to erect a plurality of reels 25 on the rotating plate 23, and load the adhesive tape rolls 27 with the tapes TS on the respective reels 25. In the present embodiment, two reels, i.e., the reel 25A and the reel 25B, are provided upright on the rotating plate 23. The adhesive tape roll loaded on the reel 25A is denoted by reference numeral 27A, and the adhesive tape roll loaded on the reel 25B is denoted by reference numeral 27B, so that the two can be distinguished from each other. In the perspective view of fig. 2 (a), the components other than the rotating plate 23, the reel 25, and the adhesive tape roll 27 are omitted for convenience of explanation.

As shown in fig. 2 (b), the tape supply unit 17 has a plurality of supply units 18 as a whole. The tape supply device 17 of the present embodiment is constituted by two supply units as a whole, i.e., the 1 st supply unit 18A including the reel 25A and the 2 nd supply unit 18B including the reel 25B. Each supply unit 18 has a tape supply section 29, a separator peeling section 31, and a joint tape making section 33.

In the present embodiment, regarding each component, a is denoted by reference numeral a for each component included in the 1 st unit 18A, and B is denoted by reference numeral B for each component included in the 2 nd unit 18B, so that the two components are distinguished from each other. As an example, one of the two tape supplies 29 disposed in the 1 st unit 18A is identified by being referred to as the tape supply 29A. And another tape supply portion disposed in the 2 nd unit 18B is denoted as a tape supply portion 29B.

The rotating plate 23 is configured to rotate around the axis of the central shaft 39 by the driving mechanism 37. By the rotation of the rotating plate 23, the 1 st supply unit 18A and the 2 nd supply unit 18B can be moved mutually between the supply position and the standby position.

In the present embodiment, the supply position is a position at which the adhesive tape T can be fed out from the adhesive tape roll 27 to the workpiece (wafer W in the present embodiment). That is, as an example, when the respective components of the supply unit 18B are arranged at the supply position, the adhesive tape T can be fed to the work by being fed from the adhesive tape roll 27B included in the supply unit 18B among the plurality of adhesive tape rolls 27.

In each of fig. 1 and 2, a state in which the 1 st supply unit 18A is disposed at the supply position and the 2 nd supply unit 18B is disposed at the standby position is shown. The adhesive tape T is supplied to the tape joining unit 7 from the adhesive tape roll 27 (in the figure, the adhesive tape roll 27A) arranged at the supply position out of the two adhesive tape rolls 27.

As shown in fig. 3, each tape supply section 29 includes a reel 25, an adhesive tape roll 27, and a guide roller not shown. The leading end of the tape TS fed from the adhesive tape roll 27 loaded on the reel 25 is guided to the separator peeling section 31 while maintaining a tension by the guide roller.

The adhesive tape roll 27 disposed at the standby position is configured to be automatically or manually taken out of the adhesive tape joining apparatus 1 through the opening/closing door 91. The operator, the work robot, takes out the adhesive tape roll 27, and places a new adhesive tape roll 27 in a standby position.

The adhesive tape joining apparatus 3 is configured such that the standby position is located apart from the center of the adhesive tape joining apparatus 1 than the supply position. In general, the movable portion, the cutter, the member which becomes high temperature, and the like are provided in many places in the center portion of the adhesive tape joining apparatus 1. Therefore, when the adhesive tape roll 27 switched to the standby position is exchanged, it is possible to avoid a situation where the operator or the like approaches a member, a movable portion, or the like that becomes high in temperature.

As shown in fig. 3, the separator peeling section 31 has a guide roller 34, a conveying roller 35, a separator holding member 36, and an adhesive tape holding member 41. The tape TS guided to the separator peeling section 31 is peeled into the adhesive tape T and the separator S by the guide roller 34. Each structure of the separator peeling unit 31 is connected to the rotating plate 23 and is displaced together with the reel 25 by the rotation of the rotating plate 23.

After the tape TS is peeled off into the adhesive tape T and the separator S, the adhesive tape T is wound around the guide roller 34 and guided to the adhesive tape holding member 41. And the separator S is wound around the conveying roller 35 and guided toward the separator holding member 36.

The separator holding member 36 is a plate-like member for holding the separator S guided by the conveying roller 35. As a more preferable example of the configuration, the separator holding member 36 uses a suction device not shown to suck and hold the separator S.

The adhesive tape holding member 41 is a plate-like member, and holds the adhesive tape T guided from the guide roller 34 on one surface (holding surface) thereof. The adhesive tape holding member 41 more preferably has a function capable of suction-holding the adhesive tape T, as with the separator holding member 36.

When the separator peeling section 31 is disposed at the supply position, the adhesive tape T guided to the adhesive tape holding member 41 (the adhesive tape holding member 41A in each of fig. 2) is further guided to the tape joining unit 7 through the preceding adhesive tape holding member 19 as shown in fig. 1. Then, the separator S guided to the separator holding member 36 (the separator holding member 36A in each of fig. 2) is further guided to the separator collecting portion 15 via the separator joining unit 21 as shown in fig. 1.

As shown in fig. 4, the joint tape making section 33 has a joint tape holding member 43 and a cutter unit 45. An example of the joining tape holding member 43 is a plate-like member. The joining tape holding member 43 is configured to be movable to each of a cutting preparation position indicated by a solid line in fig. 4, a joining preparation position indicated by a broken line in fig. 4, and a joining execution position described later, when disposed at any one of the supply position and the standby position.

The cutting preparation position and the joining preparation position are in a relative positional relationship with the adhesive tape T interposed therebetween, and the cutting preparation position and the joining execution position are in a relative positional relationship with the adhesive tape T interposed therebetween. The joining preparation position is located at a position separated from the adhesive tape T as compared with the joining execution position.

When the adhesive tape holding member 43 is moved to the cutting preparation position, the adhesive tape holding member 43 is configured to be arranged downstream of the adhesive tape holding member 41 and to be capable of holding the adhesive tape T on one surface (holding surface). The adhesive tape holding member 43 more preferably has a function of holding the adhesive tape T by suction.

Further, when the engagement tape holding member 43 is moved from the cutting preparation position to the engagement preparation position, the engagement tape holding member 43 is reversed in orientation. That is, in the joining preparation position, the holding surface of the joining tape holding member 43 and the holding surface of the adhesive tape holding member 41 are configured to face each other.

The cutter unit 45 has a movable table 46 and a cutter 48. The movable table 46 can be driven in the predetermined direction R by a driving mechanism, not shown. The direction R is preferably the thickness direction of the adhesive tape T. The movable table 46 is also configured to be drivable in the width direction of the adhesive tape T (in the present embodiment, the z direction).

The movable stand 46 has a cutter 48 at its distal end. The cutter 48 cuts the adhesive tape T in the entire width direction at the gap portion between the adhesive tape holding member 41 and the engaging tape holding member 43. The adhesive tape T is cut by the cutter 48, thereby forming a joint tape CT as an adhesive tape for joining the rear end of the preceding adhesive tape T and the front end of the succeeding adhesive tape T. The joint tape holding member 43 also has a function of holding the formed joint tape CT.

Each configuration of the supply unit 18 is connected to the rotating plate 23, and is displaced around an axis line centered on the rotating shaft 39 by the rotation of the rotating plate 23. That is, the tape supply units 29, the separator peeling unit 31, and the joint tape creating unit 33 provided in the respective supply units 18 are movable relative to each other between the supply position and the standby position by the rotation of the rotating plate 23.

The preceding adhesive tape holding member 19 is disposed downstream of the adhesive tape producing section 33 disposed at the supply position, and holds the preceding adhesive tape T1, which is the adhesive tape T supplied from the adhesive tape roll 27 located at the supply position. The preceding adhesive tape holding member 19 is configured to be movable in the discharge direction of the adhesive tape T and to reciprocate between a close position and a retracted position, which will be described later. The holding surface of the preceding adhesive tape holding member 19 and the holding surface of the adhesive tape holding member 41 disposed at the supply position are preferably flush with each other.

As shown in fig. 5, the separator joining unit 21 is disposed downstream of the separator holding member 36 disposed at the supply position, and includes a preceding separator holding member 47 and a cutter unit 49. The preceding separator holding member 47 holds the preceding separator S1, which is the separator S supplied from the adhesive tape roll 27 located at the supply position. A heater 50 for heating the separator S is disposed inside the leading separator holding member 47.

The cutter unit 49 has a movable table 51 and a cutter 53. The movable table 51 can be driven in the predetermined direction R by a driving mechanism, not shown. The direction R is preferably the thickness direction of the preceding separator sheet S1. The movable table 51 is also configured to be able to be driven in the width direction (z direction in the present embodiment) of the preceding separator S1.

The movable table 51 has a cutter 53 at its distal end. The cutter 53 cuts the preceding separator S1 across the width in the gap between the separator holding member 36 and the preceding separator holding member 47. The leading separator holding member 47 and the cutter unit 49 are configured to be movable in the feeding direction (direction L) of the leading separator S1 and to reciprocate between a close position and a retracted position, which will be described later.

In embodiment 1, the leading adhesive tape holding member 19 and the separator joining unit 21 are different from the supply unit 18 in structure, and are not connected to the rotating plate 23. That is, the respective configurations of the preceding adhesive tape holding member 19 and the separator joining unit 21 and the rotation of the rotating plate 23 are independent of each other, and the positions thereof can be appropriately changed.

< overview of tape sticking action >

Here, a series of basic operations of attaching the adhesive tape T for circuit surface protection to the wafer W using the adhesive tape attaching apparatus 1 will be described. Fig. 7 (a) is a flowchart illustrating a process of attaching the protective adhesive tape T to the wafer W.

When the bonding command is issued, the wafer W stored in the predetermined storage section is aligned on the alignment stage, and then placed on the holding stage 5 by a wafer transfer mechanism not shown. The wafer W placed on the holding table 5 is rotated and held by suction in a state aligned such that the center of the wafer W is positioned on the center of the holding table 5. (step S1).

At this time, the tape application unit 7, the tape cutting unit 9, and the tape peeling unit 11 are moved to the initial positions shown in fig. 8 (a). That is, the tape application unit 9 moves to the right side of the holding base 5, and the tape separation unit 11 moves to the left side of the holding base 5. Further, the tape cutting unit 9 stands by above the holding table 5.

In the tape supply unit 17, the tape TS is fed and fed downstream from the adhesive tape roll 27 loaded on the reel 25 moved to the supply position, and the tape TS is separated into the adhesive tape T and the separation sheet S by the separation sheet separation section 31. Then, the adhesive tape T is guided to the tape attaching unit 7 and the tape detaching unit 11.

Next, as shown in fig. 8 (b), the joining roller 7b of the tape joining unit 7 rolls forward (leftward in fig. 8) on the wafer W while pressing the adhesive tape T downward, and moves from the initial position shown by the broken line to the final position shown by the solid line. Thereby, the adhesive tape T is attached to the entire surface of the wafer W (step S2).

After the adhesive tape T is attached to the wafer W, as shown in fig. 9, the tape cutting unit 9 which is standing on standby at the upper side is lowered, and is moved from the initial position shown by the broken line to the cutting position shown by the solid line. Then, the tape cutting unit 9 is lowered to the cutting position, and the cutter 9c pierces the adhesive tape T in the cutter moving groove 5a of the holding base 5.

When the cutter 9c pierces the adhesive tape T, the support arm 9b rotates about the vertical axis P as a rotation center. Accordingly, the cutter 9c rotates while sliding in contact with the outer peripheral edge of the wafer, and the adhesive tape T is cut along the outer shape of the wafer (step S3).

When the cutting of the adhesive tape T along the outer shape of the wafer is completed, the tape cutting unit 9 is raised to the original standby position. Then, the tape application unit 7 returns from the terminal position to the initial position. The application unit 17 returns to the initial position, and as shown in fig. 10, the tape peeling unit 11 moves backward (rightward in fig. 10). That is, the tape peeling unit 11 moves rightward from the initial position shown by the broken line in fig. 10 toward the terminal position shown by the solid line.

The tape peeling unit 11 moves to the terminal position, and winds up and peels off the unnecessary tape Tn left after the adhesive tape T is cut and cut off from the wafer W (step S4). Note that, a portion of the adhesive tape T that is attached to the surface of the wafer W is denoted by reference numeral Tw to be distinguished from an unnecessary tape Tn.

When the tape peeling unit 11 reaches the terminal position and the peeling operation is ended, the tape peeling unit 11 returns from the terminal position to the initial position. At this time, the unnecessary tape Tn is wound and guided to the tape collecting section 13 to be collected, and a certain amount of tape TS is paid out from the adhesive tape roll 27 disposed at the supply position (step S5).

When the processes up to step S5 are completed, the suction of the holding base 5 is released. After the adsorption is released, the wafer W with the adhesive tape Tw attached thereto is transported by the wafer transport mechanism and collected in a wafer collection unit (not shown) (step S6). This completes 1 adhesive tape joining process.

After the completion of the adhesive tape joining process, the process is branched into the following steps according to the loading amount of the adhesive tape roll 27 (supply tape) disposed at the supply position. When the loading amount of the supply tape is equal to or less than a predetermined amount, the operation of discharging the tape TS from the adhesive tape roll 27 located at the supply position is temporarily stopped, and the tape TS is automatically exchanged (step S7). The loading amount of the supply tape is confirmed to be a predetermined amount or more by using various sensors and the like, and then the above operation is sequentially repeated.

< description of tape exchange Process >

Here, the procedure of automatically exchanging the tape TS in step S7 will be described. The tape exchange process in step S7 is performed in accordance with the processes of step S7-1 to step S7-6 shown in the flowchart of fig. 7 (b). According to the process shown in fig. 7 (b), a new adhesive tape roll 27 filled with a sufficient amount of tape TS is disposed at the supply position of the tape supply unit 17. Then, the leading end of the succeeding (upstream side) adhesive tape T paid out from the new adhesive tape roll 27 is automatically joined to the trailing end of the preceding (downstream side) adhesive tape T paid out from the adhesive tape roll 27 before the exchange. Further, the rear end of the preceding separator S and the front end of the succeeding separator S are automatically joined.

In the present embodiment, a case will be described as an example in which the reel 25A and the adhesive tape roll 27A are initially arranged at the supply position of the tape supply unit 17, and the adhesive tape roll 27A having a loading amount of a predetermined value or less is replaced with a new adhesive tape roll 27B in step S7. Fig. 11 shows the respective configurations of the adhesive tape joining apparatus 3 at the time when the amount of the adhesive tape roll 27A loaded becomes equal to or less than the predetermined value and step S7 starts to be executed.

In the description of step S7, the respective configurations of the tape TS fed from the adhesive tape roll (the adhesive tape roll 27A in the present embodiment) disposed at the supply position before the exchange are referred to as a preceding tape TS1, a preceding adhesive tape T1, and a preceding separator S1. The respective configurations of the tape TS paid out from a new adhesive tape roll (adhesive tape roll 27B in the present embodiment) arranged at the supply position after the exchange are referred to as a subsequent tape TS2, a subsequent adhesive tape T2, and a subsequent separator S2, and are distinguished from the respective configurations of the preceding tape TS 1.

At the start of step S7, the initial arrangement of the respective structures of the adhesive tape joining apparatus 3 will be described. First, the structure of a portion shown by reference numeral D1 in fig. 11 is explained. The preceding adhesive tape holding member 19 moves to the close position, close to the adhesive tape holding member 41A. The joining tape holding member 43A located at the feeding position is moved to the joining preparation position. By being arranged at the joining preparation position, the joining tape holding member 43A faces the holding surface of the adhesive tape holding member 41A with the adhesive tape T1 interposed therebetween.

Next, the structure of the portion indicated by reference numeral D2 is explained. The engaging-tape holding member 43B located at the standby position moves to the cutting preparation position. By moving to the cutting preparation position, the holding surface of the joining tape holding member 43B (the surface holding the adhesive tape T) is aligned with the holding surface of the adhesive tape holding member 41B.

At the start of step S7, the subsequent tape TS2 placed at the standby position is configured as follows. As shown by reference numeral D2 in fig. 11, the adhesive tape with the separator, i.e., the subsequent tape TS2, is discharged from the adhesive tape roll 27B disposed at the standby position. The discharged subsequent tape TS2 is peeled by the separator peeling section 31B into the subsequent adhesive tape T2 and the subsequent separator S2, and the adhesive layer C of the subsequent adhesive tape T2 is exposed.

The succeeding separator S2 is wound around the conveying roller 35B and guided to the holding surface of the separator holding member 36B. The leading end portion of the succeeding separator S2 is sucked and held by the separator holding member 36B. The subsequent adhesive tape T2 is wound around the guide roller 34B, and is guided to the holding surface of the adhesive tape holding member 41B and the holding surface of the engaging tape holding member 43B. The leading end portion of the succeeding adhesive tape T2 is sucked and held by the adhesive tape holding member 43B, and the portion on the upstream side of the leading end portion is sucked and held by the adhesive tape holding member 41B.

The holding surface of the joining tape holding member 43B arranged at the cutting preparation position is aligned with the holding surface of the adhesive tape holding member 41B. Therefore, the tension of the entire subsequent adhesive tape T2 can be maintained, and the adhesive tape holding member 41B and the adhesive tape holding member 43B can stably hold the subsequent adhesive tape T2 over the entire holding surface. In addition, in embodiment 1, the operation of winding the subsequent adhesive tape T2 and holding it by the engaging tape holding member 43B and the operation of winding the subsequent separator S2 and holding it by the separator holding member 36B are performed manually, respectively, but automation may be realized under the control of the control section 81. The initial configuration of the various structures before the start of step S7 is as described above.

Step S7-1 (cutting of leading tape)

In the tape replacing step, the preceding tape is first cut. That is, in the adhesive tape joining apparatus 3, the leading adhesive tape T1 is cut by the cutter unit 45 (in the present embodiment, the cutter unit 45A) disposed at the supply position, and the leading separator S1 is cut by the cutter unit 49 included in the separator joining unit 21.

A portion where the leading adhesive tape T1 is cut by the cutter unit 45A is denoted by reference numeral D1 in fig. 11, and a portion where the leading separator S1 is cut by the cutter unit 49 is denoted by reference numeral D3 in fig. 11. First, the operation of cutting the preliminary adhesive tape T1 will be described with reference to the respective drawings of fig. 12.

Fig. 12 (a) shows a state of the bonded tape producing portion 33A before the preceding bonded tape T1 is cut. The preceding adhesive tape holding member 19 is displaced in advance from the retracted position shown by the broken line to the approaching position shown by the solid line, and approaches the adhesive tape holding member 41A. The preceding adhesive tape holding member 19 and the adhesive tape holding member 41A respectively hold the preceding adhesive tape T1 by suction. Further, the cutter unit 45A is located at an initial position (position M1 indicated by a broken line in fig. 12 d) spaced apart from the adhesive tape T1.

When cutting of the preceding adhesive tape T1 is started, the movable table 46A of the cutter unit 45A is driven in the direction R, and the cutter unit 45A is moved from the initial position to the cutting preparation position as shown in fig. 12 (b). In fig. 12 (b), the cutter 48A moves to the back side of the preceding adhesive tape T1. The cutting preparation position of the cutter unit 45A corresponds to a position M2 indicated by a two-dot chain line in fig. 12 (d).

After the cutter unit 45A is moved to the cutting preparation position, the movable table 46A is driven in the width direction (z direction) of the preceding adhesive tape T1. By this driving, the cutter unit 45A located at the cutting preparation position moves to the cutting completion position shown by the solid line in fig. 12 (d). With this movement, the cutter 48A cuts the leading adhesive tape T1 across the entire width at a predetermined position between the leading adhesive tape holding member 19 and the adhesive tape holding member 41A ((c) of fig. 12). After the cutting is completed, the cutter unit 45A returns from the cutting completion position to the initial position.

The leading adhesive tape T1 is cut by the cutter unit 45A, and the downstream side (T1 f) of the leading adhesive tape T1 is separated from the adhesive tape roll 27A. After the cutting, the rear end portion of the preceding adhesive tape T1f separated from the adhesive tape roll 27A is sucked and held by the preceding adhesive tape holding member 19. Then, the leading end portion on the upstream side (T1 r) of the preceding adhesive tape T1 still connected to the adhesive tape roll 27A is sucked and held by the adhesive tape holding member 41A.

By performing the respective suction holding, the position of the preceding adhesive tape T1 can be stably maintained even after the cutting by the cutter unit 45A. When the pre-adhesive tape T1 is cut, the pre-adhesive tape holding member 19 is moved to the close position and brought close to the adhesive tape holding member 41A. Therefore, it is possible to avoid a situation in which the cutting accuracy of the pre-adhesive tape T1 is lowered due to, for example, the pre-adhesive tape T1 being bent between the pre-adhesive tape holding member 19 and the adhesive tape holding member 41A.

Next, the operation of cutting the preceding separator sheet S1 will be described with reference to the respective drawings of fig. 13. Fig. 13 (a) shows the state of each structure before the preceding separator sheet S1 is cut. The leading separator holding member 47 is disposed at an initial position at a position close to the downstream side of the separator holding member 36A, and faces the separator holding member 36A with the leading separator S1 interposed therebetween. The preceding separator holding member 47 and the separator holding member 36A respectively hold the preceding separator S1 by suction. Further, the cutter unit 49 is located at an initial position apart from the preceding separator S1.

When cutting of the preceding separator S1 is started, the movable table 51 of the cutter unit 49 is driven in the direction R, and the cutter unit 49 is moved from the initial position to the cutting preparation position as shown in fig. 13 (b). In fig. 13 (b), the cutter blade 53 moves to the back side of the preceding separator sheet S1.

After the cutter unit 49 is moved to the cutting preparation position, the movable table 51 is driven in the width direction (z direction) of the preceding separator S1. By this driving, the cutter unit 49 located at the cutting preparation position moves from the back side to the front side, that is, to the cutting completion position. With this movement, the cutter blade 53 cuts the leading separator S1 across the width at a predetermined position between the leading separator holding member 47 and the separator holding member 36A ((c) of fig. 13). After the cutting is completed, the cutter unit 49 returns from the cutting completion position to the initial position.

The cutter unit 49 cuts the preceding separator S1, and the downstream side (S1 f) of the preceding separator S1 is separated from the adhesive tape roll 27A. After the cutting, the rear end portion of the preceding separator S1f separated from the adhesive tape roll 27A is sucked and held by the preceding separator holding member 47.

Further, the leading end portion of the upstream side (leading separator S1 r) of the leading separator S1 still connected to the adhesive tape roll 27A is sucked and held by the separator holding member 36A. By performing the respective suction holding, the position of the preceding separator sheet S1 can be stably maintained even after the cutting by the cutter unit 49. The preceding adhesive tape T1 and the preceding separator S1 are cut and separated from the adhesive tape roll 27A, and the process of step S7-1 is completed.

Step S7-2 (manufacturing of joint belt)

After the downstream sides of the leading adhesive tape T1 and the leading separator S1 are separated from the adhesive tape roll 27A by the step S7-1, the step S7-2 of manufacturing the adhesive tape is performed. As a feature of the present invention, a part of the adhesive tape T to be stuck to a workpiece (wafer W in the present embodiment) is used as an adhesive tape CT which is an adhesive tape sheet for bonding.

In the present embodiment, the cutter unit 45 (in the present embodiment, the cutter unit 45B) disposed at the standby position is used to cut a part of the leading end of the subsequent adhesive tape T2, and the cut and fragmented leading end portion is used as the adhesive tape CT. Specifically, the joint tape is manufactured at a portion indicated by reference numeral D2 in fig. 11.

The step of producing the junction zone CT will be described with reference to the drawings of fig. 14. Fig. 14 (a) shows the state of each structure before the subsequent adhesive tape T2 is cut. The engagement tape holding member 43B moves to the cutting preparation position. That is, the adhesive tape holding member 43B is disposed in the vicinity of the downstream side of the adhesive tape holding member 41B, and sucks and holds the leading end portion of the subsequent adhesive tape T2. The cutter unit 45B is disposed at the initial position, i.e., at a position separated from the subsequent adhesive tape T2.

When cutting of the subsequent adhesive tape T2 is started, the movable table 46B of the cutter unit 45B is driven in the direction R, and the cutter unit 45B is moved from the initial position to the cutting preparation position. After the cutter unit 45B is moved to the cutting preparation position, the movable table 46B drives the cutter unit 45B in the width direction (z direction) of the subsequent adhesive tape T2. By this driving, the cutter unit 45B moves from the cutting preparation position to the cutting completion position, and the subsequent adhesive tape T2 is cut in the entire width direction at a predetermined position between the adhesive tape holding member 41B and the engaging tape holding member 43B ((B) of fig. 14).

The subsequent adhesive tape T2 is cut by the cutter unit 45B, and the leading end portion of the subsequent adhesive tape T2 is cut off from the adhesive tape roll 27B. After the cutting, the leading end portion cut off from the adhesive tape roll 27B is sucked and held as the joining tape CT to the joining tape holding member 43B. The leading end portion of the subsequent adhesive tape T2 newly formed by the cutting is sucked and held by the adhesive tape holding member 41B.

After the cutting is completed, the cutter unit 45B returns from the cutting completion position to the initial position. In this way, the bonding tape CT is produced from the bonding tape producing section 33B arranged at the standby position among the bonding tape producing sections 33, and the step S7-2 is completed. Fig. 14 (c) shows a schematic configuration of the adhesive tape joining apparatus 3 in a state after the steps S7-1 and S7-2 are completed.

Step S7-3 (Displacement of Joint band)

After the leading end portion of the subsequent adhesive tape T2 is cut to complete the production of the joint tape, the joint tape is displaced. That is, by appropriately moving the joining tape holding member 43B holding the joining tape CT in the supply unit 18 located at the standby position, the joining tape CT is reversed so that the adhesive layer C of the joining tape CT and the adhesive layer C of the leading end portion of the following adhesive tape T2 are in a facing positional relationship.

In the present embodiment, the step of displacing the joint tape CT is performed as follows. Immediately after the joining tape CT is manufactured, as shown in fig. 15 (a), the adhesive layer C of the joining tape CT and the adhesive layer C of the leading end portion of the subsequent adhesive tape T2 face in the same direction. In this state, the joint tape holding member 43B is moved in reverse around the axis in the z direction by a driving device not shown, and is moved in parallel on the xy plane as appropriate.

By this movement, the joint tape holding member 43B moves from the cutting preparation position shown by the broken line in fig. 15 (B) to the joint preparation position shown by the solid line in the same figure. By the movement of the adhesive tape holding member 43B to the joining preparation position, the adhesive layer C of the adhesive tape CT held by the adhesive tape holding member 43B and the adhesive layer C of the leading end portion of the subsequent adhesive tape T2 held by the adhesive tape holding member 41B are reversed in a facing positional relationship. In addition, as long as the adhesive layer C of the joining tape CT and the adhesive layer C of the leading end portion of the following adhesive tape T2 can be opposed to each other, the movement locus of the joining tape holding member 43B is not limited to the configuration of the present embodiment.

In addition, it is preferable that the leading adhesive tape holding member 19 is retracted in the adhesive tape preparing section 33A in synchronization with the reversing step of the adhesive tape CT in the adhesive tape preparing section 33B. At the time of producing the joint tape CT, the leading tape holding member 19 is moved to the close position (fig. 15 (c)). That is, the preceding adhesive tape holding member 19 is disposed in the vicinity of the downstream of the adhesive tape holding member 41A.

In this state, the preceding adhesive tape holding member 19 is moved downstream in the direction of discharging the adhesive tape T by using a driving device, not shown. By this movement, the preceding adhesive tape holding member 19 moves from the close position shown by the broken line in fig. 15 (d) to the retreat position shown by the solid line in the same drawing while maintaining the state of suction-holding the rear end portion of the preceding adhesive tape T1 f.

The retracted position of the preceding adhesive tape holding member 19 is more preferably a position not overlapping with the rotating plate 23 in the front view of the adhesive tape joining apparatus 3. By moving the preceding adhesive tape holding member 19 to the retracted position in advance, it is possible to reliably avoid a situation in which the configuration connected to the rotating plate 23, such as the separate piece holding member 36, interferes with the preceding adhesive tape holding member 19 in the step of rotating the rotating plate 23, which will be described later.

Similarly, in order to avoid a situation in which the separator joining unit 21 interferes with other structures, it is more preferable that the separator joining unit 21 also retracts to a position not overlapping the rotating plate 23 in the front view while maintaining the state of sucking and holding the rear end portion of the preceding separator S1 f. The structure of the adhesive tape joining apparatus 3 at the timing when the reverse rotation of the joining tape CT, the retraction of the preceding adhesive tape holding member 19, and the retraction of the separator joining unit 21 are completed is shown in fig. 16 (a). The displacement is completed by the joint tape CT, thereby completing the process of step S7-3.

Step S7-4 (switching of adhesive tape roll)

After the joining tape CT is reversed, the switching of the adhesive tape roll is performed. That is, the rotating plate 23 of the tape supply unit 17 is appropriately rotated to switch the adhesive tape roll 27 disposed at the supply position. By the rotation of the rotating plate 23, the adhesive tape roll 27 disposed at the supply position is switched from the adhesive tape roll 27A (fig. 16 (a)) in which the amount of the loaded tape TS is reduced to a predetermined amount or less to the adhesive tape roll 27B in which a sufficient amount of the tape TS is loaded (fig. 16 (B)).

Further, by the rotation of the turntable 23, the respective structures connected to the turntable 23 are also displaced together with the turntable 23. That is, the 1 st supply unit 18A disposed at the supply position is rotationally displaced by approximately 180 ° about the rotation shaft 39, and moves from the supply position to the standby position. On the other hand, the components of the 2 nd supply unit 18B disposed at the standby position move from the standby position to the supply position.

As a result, the subsequent adhesive tape T2 held by the adhesive tape holding member 41B and the joining tape CT held by the joining tape holding member 43B are moved from the standby position to the supply position in synchronization with each other while maintaining the state in which the respective adhesive layers C face each other. On the other hand, the positions of the leading adhesive tape holding member 19 and the separator joining unit 21, which are not connected to the rotary table 23, are not affected by the rotation of the rotary table 23.

Therefore, by performing the operation of rotating the rotating plate 23 to switch the adhesive tape roll 27, the subsequent adhesive tape T2 and the adhesive tape CT moved to the supply position move to the vicinity of the rear end portion of the preceding adhesive tape T1f held by the preceding adhesive tape holding member 19 (fig. 16 (b)). Further, the separator holding member 36B that holds the succeeding separator S2 by suction also moves from the standby position to the supply position.

As a result, the succeeding separator sheet S2 moves to the vicinity of the rear end portion of the preceding separator sheet S1f sucked and held by the preceding separator sheet holding member 47. The supply unit 18 located at the supply position is switched by rotating the rotary plate 23, thereby completing the process of step S7-4. The sequence of the step S7-3 and the step S7-4 may be appropriately replaced or synchronized.

Step S7-5 (joining of adhesive tape)

After the switching of the adhesive tape roll is completed, the joining of the adhesive tape is performed. That is, in the joining tape making section 33 (the joining tape making section 33B at this point of time) disposed at the supply position, an operation of joining the rear end portion of the preceding adhesive tape T1f and the front end portion of the following adhesive tape T2 via the joining tape CT is performed.

The process of step S7-5 will be described with reference to the drawings of fig. 17. First, as shown in fig. 17 (a), the preceding adhesive tape holding member 19 retracted to the retracted position is moved to the close position. That is, the preceding adhesive tape holding member 19 moves from the retracted position indicated by the broken line to the close position indicated by the solid line in the discharge direction of the adhesive tape T while holding the rear end of the preceding adhesive tape T1 f. As a result, the rear end of the preceding adhesive tape T1f and the subsequent adhesive tape T2 are brought into a state close to each other to the extent that they can be joined by the joining tape CT.

After the rear end of the preceding adhesive tape T1f and the subsequent adhesive tape T2 are brought close to each other, the adhesive tape T is joined by the joining tape CT. That is, as shown in fig. 17 (B), the engagement tape holding member 43B is moved in the direction R from the engagement preparatory position shown by the broken line toward the engagement performing position shown by the solid line. By this movement, the joining tape CT is pressed against the rear end of the preceding adhesive tape T1f and the following adhesive tape T2. By this pressing, the preceding adhesive tape T1 and the following adhesive tape T2 are joined. That is, the rear end of the preceding adhesive tape T1f and the front end of the following adhesive tape T2 are connected by the joining tape CT to form a continuous long tape.

The rear end of the preceding adhesive tape T1f is supported by the preceding adhesive tape holding member 19, and the subsequent adhesive tape T2 is supported by the adhesive tape holding member 41B. Then, the holding surface of the preceding adhesive tape holding member 19 and the holding surface of the adhesive tape holding member 41B are aligned. Therefore, a uniform and strong pressing force can act between the joining tape CT and the preceding adhesive tape T1f and the succeeding adhesive tape T2.

In the joining step of the adhesive tape of this embodiment, the adhesive layer C of the rear end of the preceding adhesive tape T1f and the adhesive layer C of the succeeding adhesive tape T2 are in a facing positional relationship with the adhesive layer C of the joining tape CT. That is, the adhesive layer C of the joining tape CT is bonded to the adhesive layer C of the rear end of the preceding adhesive tape T1f and the adhesive layer C of the succeeding adhesive tape T2 by pressing the joining tape CT against each adhesive tape T. In other words, not one adhesive layer C is in contact with the other substrate B (non-adhesive surface) but the adhesive layers C are adhered to each other, and therefore, the adhesion force between the joining tape CT and the rear end of the preceding adhesive tape T1f and the succeeding adhesive tape T2 becomes stronger. Thus, the preceding adhesive tape T1 and the subsequent adhesive tape T2 can be more firmly joined.

After the joining of the preceding adhesive tape T1f and the subsequent adhesive tape T2 by the joining tape CT is completed, the suction holding of the joining tape CT by the joining tape holding member 43B is released. Then, as shown in fig. 17 (c), the engagement tape holding member 43B is returned from the engagement performing position to the engagement preparatory position (fig. 19 (B), arrow N1).

At the same time as this return, the suction holding of the subsequent adhesive tape T2 by the adhesive tape holding member 41B and the suction holding of the preceding adhesive tape T1f by the preceding adhesive tape holding member 19 are released. The leading adhesive tape T1f and the following adhesive tape T2, which are joined by the joining tape CT and are continuous, are released from each other by suction and holding, and can be released in the direction L.

Step S7-6 (joining of separator)

The step of joining the separator is performed simultaneously with the step of joining the adhesive tape. That is, the separator holding member 36B moved to the feeding position cooperates with the separator engaging unit, thereby engaging the rear end portion of the preceding separator S1f with the front end portion of the succeeding separator S2.

The process of step S7-6 will be described with reference to the drawings of fig. 18. First, as shown in fig. 18 (a), the separator joining unit 21 retracted to the retracted position is moved. That is, the leading separator holding member 47 moves from the retracted position shown by the broken line to the joint preparation position shown by the solid line in the release direction of the separator S while holding the rear end of the leading separator S1 f. As a result, the rear end of the preceding separator S1f and the front end of the succeeding separator S2 are in a facing positional relationship.

After the rear end of the preceding separator S1f and the succeeding separator S2 are brought close to each other, the separators S are joined by heating. That is, as shown in fig. 18 (b), the leading separator holding member 47 is moved from the bonding preparation position shown by the broken line to the bonding execution position shown by the solid line, i.e., the direction R. By this movement, the rear end of the preceding separator S1f is pressed against the front end of the succeeding separator S2.

Further, while the preceding separator holding member 47 is being moved, the heater 50 built in the preceding separator holding member 47 heats the rear end of the preceding separator S1 f. By this heating and pressing, the rear end of the preceding separator sheet S1f and the front end of the succeeding separator sheet S2 are joined by thermal adhesion, and are continuous and long. In this case, it is more preferable that a heater is also incorporated in the separator holding member 36B, and the leading end side of the succeeding separator S2 is also heated by this heater.

After the joining between the rear end of the preceding separator S1f and the front end of the succeeding separator S2 is completed, the suction holding of the preceding separator S1f by the preceding separator holding member 47 is released. Then, as shown in fig. 18 c, the preceding separator holding member 47 is returned to the initial position (fig. 19 b, arrow N2).

At the same time as this return, the suction holding of the subsequent separation sheet S2 by the separation sheet holding member 36B is released. The leading separator S1f and the following separator S2, which are continuous in the tape form by thermocompression bonding, are released from the respective suction holding and can be discharged in the direction L. Further, the joining tape holding member 43A moved to the standby position is returned from the joining preparation position to the cutting preparation position (fig. 19 (b), arrow N3).

The adhesive tape joining step of step S7-5 and the separator joining step of step S7-6 may be performed in a time-series manner or in a synchronized manner. The structure of the adhesive tape joining apparatus 3 in the pressed state in each of the steps S7-5 and S7-6 is shown in fig. 19 (a). And, by completing the step S7-5 and the step S7-6, the adhesive tape joining apparatus 3 is structured as shown in (b) of fig. 19.

When step S7-5 and step S7-6 are completed, the tape TS2 loaded on the adhesive tape roll 27B newly moved to the supply position is joined to the preceding adhesive tape T1f and the preceding separator S1f, respectively, to form a continuous tape. As a result, the tape TS2 is released and the adhesive tape T is attached to the wafer. Through the steps from step S7-1 to step S7-6, a series of steps of automatically exchanging the adhesive tape roll 27 and automatically joining the adhesive tape T and the separator S, respectively, is completed.

The adhesive tape roll 27A switched from the supply position to the standby position can be taken out of the adhesive tape joining apparatus 1 through the opening/closing door 91. Then, a new adhesive tape roll 27, in which a sufficient amount of tape TS has been loaded, can be loaded onto the spool 25A located at the standby position.

< effects produced by the Structure of example 1 >

Conventionally, as a method of automatically joining the preceding 1 st tape P and the following 2 nd tape P, the following configuration has been mentioned. That is, a 3 rd tape Q different from each tape P is prepared in advance as an adhesive tape for bonding, and the tape Q is attached so as to connect the 1 st tape P and the 2 nd tape P.

As a result, in a normal case, when the tape Q has the adhesive layer Ca only on one side, the cross section of the joint portion has the structure shown in fig. 20 (a), and when the tape Q has the adhesive layers Ca on both sides, the cross section of the joint portion has the structure shown in fig. 20 (b). In such a conventional joining method, the following problems may occur.

As shown in fig. 20, the adhesive layer Ca of the tape Q bonds the tapes P to each other by coming into contact with the layer of the base material B or the layer of the separator S in the tape P. That is, in the conventional method, the tape Q for bonding is stuck to the non-adhesive surface of the tape P as the bonding target. In this case, the adhesion at the joint portion is affected only by the adhesion of the adhesive layer Ca of the tape Q, and thus the adhesion at the joint portion is weak. Therefore, there is a concern that the tape Q may be peeled off from the tape P and a bonding error may occur.

The tape Q for bonding is a tape prepared in advance, unlike the tape P actually bonded to the wafer. Therefore, the constituent materials and properties of the wafer protection tape P and the bonding tape Q may be different from each other. Therefore, it is conceivable that the adhesive layer Ca of the joining tape Q and the base material B of the circuit protection tape P (or the separator sheet S of the tape P) are a combination that is difficult to adhere to each other. In the case of such a combination with poor adhesion compatibility, the adhesion between the tape Q and the tape P is further weakened, and therefore, a situation in which a bonding error occurs more significantly occurs.

Further, since the tape Q needs to be prepared as the sub-material independently of the tape P as the main material, there is a complication that a plurality of tapes are prepared. Further, since a configuration for feeding the tape Q to the joining portion of the tapes P and the like needs to be newly provided in the tape joining device, the tape joining device is likely to be large in size, and it is difficult to suppress the cost.

In the conventional structure, as shown in fig. 20 (b), when the tapes P are laminated and joined to each other with the joining tape Q interposed therebetween, the thickness J of the joined portion becomes thick. That is, since the joined portion is thicker than the portion other than the joined portion, the portion having the thickness is caught on the reel or the like when the joined tape P is wound and collected. As a result, the shape of the winding drum may be deformed, which may cause a reduction in winding efficiency and a winding error. In the case where the tapes P in the state where the separator S is added are joined to each other, the thickness J of the joined portion becomes thicker more remarkably.

When the tapes P are joined to each other in a stacked manner, the track (height, etc.) of the preceding tape P and the track of the subsequent tape P are different before and after the joint portion (fig. 20 (b)). Therefore, particularly in the vicinity of the joint, the trajectory of the tape P fed out in advance and the trajectory of the tape P fed out in the subsequent stage may be deviated, and the accuracy of each operation, for example, the operation of attaching the tape P to the wafer W may be lowered. The deviation of the front and rear rails of the joint portion becomes large in proportion to the thickness J.

On the other hand, in the adhesive tape joining apparatus 3 of the present embodiment, when joining the adhesive tapes T, that is, joining the preceding adhesive tape T1 and the succeeding adhesive tape T2, a part of the succeeding adhesive tape T2 is cut in advance. Then, the cut portion is used as a bonding tape CT which is a bonding adhesive tape for bonding. In this case, it is not necessary to provide a structure in which the joint tape CT is loaded in advance separately from the adhesive tape T, or a large-sized structure in which the joint tape CT is supplied to the joint portion. Therefore, the adhesive tape joining apparatus 3 can be easily downsized and reduced in cost.

In the present embodiment, the joining tape CT has the same structure and properties as the adhesive tapes T1 and T2 to be joined. Therefore, a situation in which the compatibility of the adhesion between each adhesive tape T and the joining tape CT is poor can be reliably avoided. Therefore, the joining force by the joining band CT can be improved.

In the present embodiment, when joining the preceding tape and the succeeding tape, the adhesive layer C of the joining tape CT is opposed to the adhesive layer C of the preceding adhesive tape T1 and the adhesive surface C of the succeeding adhesive tape T2, which are aligned and arranged in parallel, and in this state, the joining tape CT is pressed against each adhesive tape T to join them. That is, as shown in fig. 20 (C), the adhesive surfaces C come into contact with each other at the time of bonding.

By bringing the adhesive layers C into contact with each other in this manner to bond them, the adhesive strength of the bonded portion is affected by the adhesive strength of the adhesive layer C of the adhesive tape T, which is the object to be bonded, in addition to the adhesive strength of the adhesive layer C of the adhesive tape CT. Therefore, the adhesion of the joined portion can be further improved, and therefore, the occurrence of a joining error can be more reliably avoided. The adhesive layer C of the preceding adhesive tape T1 and the adhesive surface C of the succeeding adhesive tape T2 are arranged in parallel in alignment. Therefore, the deviation between the track where the preceding adhesive tape T1 is discharged and the track where the subsequent adhesive tape T2 is discharged can be avoided before and after the joint portion.

Further, in the present embodiment, the tapes TS in a state in which the separation sheet is added are not joined to each other, but the joining of the tapes T and the joining of the separation sheets S are performed after the tapes TS are separated into the tapes T and the separation sheets S, respectively. Therefore, particularly when the adhesive tapes T are joined together by the joining tape CT, the thickness J of the joined portion becomes thinner as compared with the conventional method (fig. 20 (c)).

Therefore, even in the case of winding and recovering the engaging portion, it is possible to reduce the influence on the members of the apparatus. Further, since the adhesive tape T and the release sheet S are peeled off and the adhesive layer C is exposed, the adhesive tape CT is manufactured, and therefore, it is not necessary to perform a complicated step such as peeling the release sheet S from the cut adhesive tape CT, and it is easy to move the various holding members so that the adhesive layer C of the adhesive tape CT and the adhesive layer C of the adhesive tape T face each other.

[ example 2 ]

Next, embodiment 2 of the present invention will be explained. In embodiment 1, a description has been given of an example in which, when joining the preceding adhesive tape T1 and the subsequent adhesive tape T2, a part of the subsequent adhesive tape T2 is used as the joining tape CT for joining the adhesive tapes T. In example 2, a description will be given of a configuration in which a part of the preceding adhesive tape T1 is used as the joining tape CT for joining the adhesive tapes T to each other, as an example. The adhesive tape joining apparatus of example 2 and the apparatus of example 1 are basically common in terms of structure. Therefore, the same components as those of the adhesive tape joining apparatus of embodiment 1 are denoted by the same reference numerals, and different components will be described in detail.

In the adhesive tape joining apparatus 3 according to embodiment 1, the joining tape preparing portion 33 is provided in each of the supply units 18 and is connected to the rotating plate 23. The joint

tape forming portions

33A and 33B are configured to be replaced with each other between the supply position and the standby position by rotation of the rotary table 23. On the other hand, the adhesive tape joining apparatus 3a of embodiment 2 is different from embodiment 1 in that the joining tape making section 61 is provided separately from the supply unit 18 and is not connected to the rotary plate 23. The joint tape forming portion 61 of example 2 may be provided at least one regardless of the number of the supply units 18.

The adhesive tape producing section 61 of example 2 is disposed downstream of the adhesive tape holding member 41 (adhesive tape holding member 41A in fig. 21) that moves to the supply position. The joint tape making section 61 reciprocates between the close position and the retreat position in the discharge direction L of the adhesive tape T, similarly to the preceding adhesive tape holding member 19.

When the joint tape making part 61 is moved to the close position, the joint tape making part 61 is arranged in the vicinity of the downstream of the adhesive tape holding member 41A moved to the supply position. When the joint tape making unit 61 is moved to the retracted position, the joint tape making unit 61 is disposed at a position where it can avoid interference with the respective components of the tape supply unit 17. As an example of the retracted position, a position where the rotation table 23 does not overlap in a front view is preferable, as in the preceding adhesive tape holding member 19 of each embodiment.

The joint tape making section 61 of embodiment 2 has a joint tape holding member 63 and a cutter unit 65. The joining tape holding member 63 is configured to be movable relative to each other at a cutting preparation position, a joining preparation position, and a joining execution position, as in embodiment 1. The cutting preparation position of the joining tape holding member 63 corresponds to the downstream of the adhesive tape holding member 41 moved to the supply position. The adhesive tape holding member 63 is configured to be able to hold the adhesive tape T on its holding surface when moved to the cutting preparation position. The positional relationship among the cutting preparation position, the joining preparation position, and the joining execution position is the same as in embodiment 1.

The cutter unit 65 has a movable table 67 and a cutter 68. The respective configurations of the movable table 67 and the cutter 68 are the same as those of the movable table 46 and the cutter 48 of embodiment 1, and therefore, detailed description thereof is omitted. The adhesive tape holding member 63 has a function of holding a part of the preceding adhesive tape T1 cut out by the cutter unit 65 as an adhesive tape CT, and pressing and joining the adhesive tape CT to a joining portion between the adhesive tapes T.

< description of tape exchange Process in example 2 >

Here, each step of step S7 of example 2 will be described. The outline of the flowchart of step S7 in example 2 is common to example 1, as shown in fig. 7 (b). Therefore, a portion different from example 1 in each step of step S7 of example 2 will be described.

At the start of step S7, the initial arrangement of the respective structures of the adhesive tape joining apparatus 3 is as shown in fig. 21. That is, the joint tape making section 61 and the preceding adhesive tape holding member 19 are moved to the close position. The bonding tape holding member 63 is disposed at the cutting preparation position. In this case, the adhesive tape holding member 63 is disposed in the vicinity of the downstream of the adhesive tape holding member 41A moving to the supply position, and the preceding adhesive tape holding member 19 is disposed in the vicinity of the downstream of the adhesive tape holding member 63. The adhesive tape holding member 41A, the joining tape holding member 63, and the preceding adhesive tape holding member 19 each hold the preceding adhesive tape T1 by suction.

The initial state of the subsequent band TS2 is as follows. That is, as shown by reference numeral D4 in fig. 21, the subsequent tape TS2 is paid out from the adhesive tape roll 27B arranged at the standby position in advance, and is peeled off as the subsequent adhesive tape T2 and the subsequent separator S2 by the separator peeling section 31B. The leading end portion of the subsequent adhesive tape T2 is sucked and held by the adhesive tape holding member 41B, and the leading end portion of the subsequent separator S2 is sucked and held by the separator holding member 36B. At the time point when step S7 of embodiment 2 starts, the respective configurations are previously operated as described above.

Step S7-1 (cutting of leading tape)

When step S7 starts, the preceding tape is first cut. That is, in the adhesive tape joining apparatus 3a, cutting of the preceding adhesive tape T1 by the cutter unit 65 and cutting of the preceding separator S1 by the cutter unit 49 are performed. Fig. 22 (a) shows the structure of the periphery of the bonding tape producing section 61 and the separator bonding unit 21 at the start of step S7-1.

In this state, as shown in fig. 22 (b), the cutter unit 65 is appropriately moved from the initial position shown by the broken line to the 1 st cutting execution position shown by the solid line. By this movement, the cutter unit 65 cuts the leading adhesive tape T1 in the width direction at a predetermined position between the leading adhesive tape holding member 19 and the joint tape holding member 63 (fig. 22 (b), arrow W1).

By this cutting, the downstream side (T1 f) of the preceding adhesive tape T1 is separated from the adhesive tape roll 27A located at the supply position. The rear end portion of the preceding adhesive tape T1f cut off from the adhesive tape roll 27A is sucked and held by the preceding adhesive tape holding member 19. Then, the leading end portion of the upstream side (T1 r) of the preceding adhesive tape T1 still connected to the adhesive tape roll 27A is sucked and held by the adhesive tape holding member 63 and the adhesive tape holding member 41A.

The preceding adhesive tape T1 is cut, and the preceding separator sheet S1 is cut. That is, as in example 1, the cutter unit 49 cuts the preceding separator sheet S1 across the entire width at a predetermined position between the preceding separator sheet holding member 47 and the separator sheet holding member 36A (arrow W2 in fig. 22 (b)). The cutter unit 49 cuts the preceding separator S1, and the downstream side (S1 f) of the preceding separator S1 is separated from the adhesive tape roll 27A. The step S7-1 is completed by cutting the preceding adhesive tape T1 and the preceding separator S1, respectively, and separating them from the adhesive tape roll 27A.

Step S7-2 (manufacturing of joint belt)

After the downstream sides of the leading adhesive tape T1 and the leading separator S1 are separated from the adhesive tape roll 27A, the step S7-2 of manufacturing the adhesive tape is performed. In the present embodiment, the cutter unit 65 is used to cut a part of the leading end of the preceding adhesive tape T1r, and a cut piece of the cut leading end part is used as the joining tape CT.

Specifically, as shown in fig. 23, the cutter unit 65 is appropriately moved from the 1 st cutting execution position to the 2 nd cutting execution position shown by a solid line. By this movement, the cutter unit 65 cuts the preceding adhesive tape T1r in the width direction at a predetermined position between the adhesive tape holding member 41A and the joining tape holding member 63.

By this cutting, the downstream side (tip end portion) of the preceding adhesive tape T1r is cut off from the adhesive tape roll 27A, and is made into an adhesive tape CT which is an adhesive tape sheet for bonding. The produced bonding tape CT is sucked and held by the bonding tape holding member 63. The upstream-side leading end portion of the preceding adhesive tape T1r still connected to the adhesive tape roll 27A is sucked and held by the adhesive tape holding member 41A.

Step S7-3 (reversal of the Joint tape)

After the fabrication of the joint tape is completed, the joint tape is reversed. That is, by appropriately moving the joining tape holding member 63 holding the joining tape CT from the cutting preparation position to the joining preparation position, the joining tape CT is displaced so that the adhesive layer C of the joining tape CT faces the adhesive layer C of the leading end portion of the leading adhesive tape T1r (fig. 24).

In addition, it is preferable that the joint tape producing section 61, the leading adhesive tape holding member 19, and the separator joining unit 21 are retracted from the tape supplying unit 17 in synchronization with the reversing step of the joint tape CT in the joint tape producing section 61. As a specific example of the retracting direction, the bonding tape producing section 61 and the preceding adhesive tape holding member 19 are retracted to the downstream side in the feeding direction of the adhesive tape T, and the separator bonding unit 21 is retracted to the downstream side in the feeding direction of the separator.

The retreat position between the bonding tape producing portion 61, the preceding adhesive tape holding member 19, and the separator bonding unit 21 is more preferably a position not overlapping the rotating plate 23 in the front view of the adhesive tape bonding apparatus 3. The reverse rotation of the joint tape CT is completed, whereby the process of step S7-3 is completed. The structure of the adhesive tape joining apparatus 3a at the completion time is shown in fig. 25 (a).

Step S7-4 (switching of adhesive tape roll)

After the joining tape CT is reversed, the switching of the adhesive tape roll is performed. That is, the adhesive tape roll 27 disposed at the supply position is switched by appropriately rotating the rotary plate 23 of the tape supply unit 17. By the rotation of the rotating plate 23, the adhesive tape roll 27 disposed at the supply position is switched from the adhesive tape roll 27A (fig. 25 (a)) in which the amount of the loaded tape TS is reduced to a predetermined amount or less to the adhesive tape roll 27B (fig. 25 (B)) in which a sufficient amount of the tape TS is loaded.

Further, by the rotation of the turntable 23, the respective components connected to the turntable 23 are also displaced together with the turntable 23. Therefore, the succeeding adhesive tape T2 held by the adhesive tape holding member 41B is moved from the standby position to the supply position. On the other hand, the positions of the bonding tape preparing section 63, the preceding adhesive tape holding member 19, and the separator bonding unit 21, which are not connected to the turntable 23, are not affected by the rotation of the turntable 23.

As a result, the front end portion of the subsequent adhesive tape T2 moves to the vicinity of the rear end portion of the preceding adhesive tape T1f held by the preceding adhesive tape holding member 19 and the joining tape CT held by the joining tape holding member 63. The rotating plate 23 is rotated to switch the adhesive tape roll 27 disposed at the supply position to another adhesive tape roll 27, and the process of step S7-4 is completed.

Step S7-5 (joining of adhesive tape)

After the switching of the adhesive tape roll is completed, the joining of the adhesive tape is performed. That is, as shown in fig. 26 (a), the joining tape holding portion 61 and the preceding adhesive tape holding member 19 which are retracted to the retracted position are moved to the approaching position. That is, the preceding adhesive tape holding member 19 moves from the retracted position shown by the broken line to the approaching position shown by the solid line while holding the rear end of the preceding adhesive tape T1 f. As a result, the rear end of the preceding adhesive tape T1f and the subsequent adhesive tape T2 are brought into a state close to each other to the extent that they can be joined by the joining tape CT.

After the rear end of the preceding adhesive tape T1f and the subsequent adhesive tape T2 are brought close to each other, the adhesive tape T is joined by the joining tape CT. That is, as shown in fig. 26 (b), the joining tape holding member 63 is moved from the joining preparation position shown by the broken line to the joining execution position shown by the solid line. The joining tape CT is pressed against the rear end of the preceding adhesive tape T1f and the succeeding adhesive tape T2 by the movement of the joining tape holding member 63 in the R direction. As a result, the rear end of the preceding adhesive tape T1f and the front end of the following adhesive tape T2 are joined by the joining tape CT to form a continuous long tape.

After the joining of the preceding adhesive tape T1f and the subsequent adhesive tape T2 by the joining tape CT is completed, the suction holding of the joining tape CT by the joining tape holding member 63 is released. Then, the engagement tape holding member 63 is returned from the engagement performing position to the engagement preparatory position. Simultaneously with this return, the suction holding of the subsequent adhesive tape T2 by the adhesive tape holding member 41B and the suction holding of the preceding adhesive tape T1f by the preceding adhesive tape holding member 19 are released, respectively. The leading adhesive tape T1f and the following adhesive tape T2, which are continuously joined by the joining tape CT, are released from the respective suction-holding and can be released in the direction L.

Step S7-6 (joining of separator)

The adhesive tape joining step is performed, and the separator joining step is performed. That is, as shown in fig. 26 (a), the separator joining unit 21 retracted to the retracted position is moved. The leading separator holding member 47 moves from the retracted position shown by the broken line to the joint preparation position shown by the solid line in the release direction of the separator S, with the trailing end of the leading separator S1f held.

After the rear end of the preceding separator S1f and the succeeding separator S2 are brought close to and opposed to each other, as shown in fig. 26 (b), the preceding separator holding member 47 is moved from the bonding preparation position shown by the broken line to the bonding execution position shown by the solid line, i.e., the direction R. By this movement, the rear end of the preceding separator S1f is pressed against the front end of the succeeding separator S2. Simultaneously with this pressing, the preceding separator sheet S1f is heated by the heater 50. By this heating and pressing, the rear end of the preceding separator sheet S1f and the front end of the succeeding separator sheet S2 are joined by thermal adhesion to form a continuous belt.

After the joining of the rear end of the preceding separator S1f and the front end of the succeeding separator S2 is completed, the suction holding of the preceding separator S1f by the preceding separator holding member 47 is released, and the preceding separator holding member 47 is returned to the initial position. At the same time as this return, the suction holding of the subsequent separation sheet S2 by the separation sheet holding member 36B is released. The respective suction holding is released, and the preceding separator sheet S1f and the subsequent separator sheet S2, which are continuous belt-like, can be released in the direction L. Through the above steps, the steps of step S7 of example 2 are completed.

With the tape joining apparatus of embodiment 2, the preceding adhesive tape T1f and the preceding separator S1f can be automatically joined to the tape TS2 loaded on the adhesive tape roll 27B, respectively. In embodiment 1, a part of the subsequent adhesive tape T2 is used as the joining tape CT, but a part of the preceding adhesive tape T1 can be used as the joining tape CT by the structure of embodiment 2. The preceding adhesive tape T1 is an adhesive tape T actually used for a workpiece, like the subsequent adhesive tape T2.

That is, in the same manner as in example 1, in the structure of example 2, the adhesive layer C of the joining tape CT and the adhesive layer C of the adhesive tape T are also configured in the same manner, and therefore, a situation in which the adhesive force of the joining tape CT and the adhesive tape T is reduced and peeled off can be avoided. Further, since the adhesive layer C of the joining tape CT and the adhesive layer C of the adhesive tape T are pressed and joined in an opposed state, stronger joining can be achieved based on the respective adhesive forces of the adhesive layer C of the joining tape CT and the adhesive layer C of the adhesive tape T. In addition, in embodiment 2, there is only one bonding tape holding portion 61 regardless of the number of the supply units 18, and therefore, the structure of the adhesive tape bonding apparatus 3 can be further simplified.

The present invention is not limited to the above-described embodiments, and can be modified as described below.

(1) In each embodiment, a structure in which a part of the adhesive tape T (a part of the adhesive tape roll 27) used for bonding the wafer W is used as the bonding tape is described, but the present invention is not limited to a device that performs only this structure. That is, the configuration may be combined between the 1 st mode in which a part of the adhesive tape T used in the step of joining the wafer W is used as the joining tape and the 2 nd mode in which an adhesive tape F different from the adhesive tape T wound around each adhesive tape roll 27 is supplied as the joining tape.

First, as a case of using the above-described mode 2, the following case can be cited. That is, as shown in fig. 27 (a), when there are many irregularities due to bumps or the like on the surface of the wafer W, an adhesive tape Tp having a thick base material B may be used as the adhesive tape for circuit protection.

In this case, when the structure of each embodiment is applied and a part of the adhesive tape Tp is cut out to join the adhesive tapes Tp to each other as the joining tape CT, the thickness of the tape increases at the joining portion and the flexibility decreases, so that there is a concern that the joining tape CT peels off and a joining error occurs. Therefore, in the case of using the adhesive tape Tp having a thick base material B, it is difficult to apply a structure in which a part of the adhesive tape roll 27 is cut to be used as the joining tape CT. Such a situation also occurs when the adhesive tape having high rigidity of the base material B is bonded to the wafer W.

An example of the structure of a modification of the two modes will be described below with reference to the drawings. As shown in fig. 27 (b), an adhesive tape joining apparatus 3b of a modification includes a sensor 71, a mode determination unit 73, and a joining tape supply unit 75, in addition to the respective configurations of the adhesive tape joining apparatus 3 of embodiment 1. The adhesive tape joining apparatus 3b of the modification may be configured to include the sensor 71, the mode determination unit 73, and the joining tape supply unit 75 in addition to the adhesive tape joining apparatus 3a of embodiment 2.

The sensor 71 detects the characteristics of the adhesive tape T loaded on the adhesive tape roll 27. Examples of the characteristics of the pressure-sensitive adhesive tape T include the thickness of the base material B and the rigidity of the base material B. As the sensor 71, a known structure for detecting the characteristics of the adhesive tape T, such as an optical sensor or a television camera, can be suitably used.

The mode determination portion 73 receives information on the characteristics of the adhesive tape T detected by the sensor 71, and determines the mode to be executed out of the 1 st mode and the 2 nd mode based on the information. That is, when there is no problem even if the adhesive tape T is used as the joining tape CT, a judgment is made to the effect that joining of the adhesive tape T is performed in the 1 st mode.

When a determination is made to execute the mode 1, the control unit 81 receives information of the determination and controls the respective components collectively. Each configuration of the adhesive tape joining apparatus 3 joins the adhesive tape T by using a part of the adhesive tape T loaded on the adhesive tape roll 27 as the joining tape CT in accordance with the procedure described in each embodiment under the control of the control section 81.

On the other hand, when the adhesive tape T is not suitable for use as the joining tape CT, the mode determination portion 73 determines that joining of the adhesive tape T is to be performed in the 2 nd mode. In this case, the control unit 81 receives the information of the determination and controls the respective components collectively. Each configuration of the adhesive tape joining apparatus 3 performs joining of the adhesive tape T using the adhesive tape F supplied from the adhesive tape supply unit 75 under the control of the control section 81. As an example of the determination criterion, when the thickness of the base material B of the adhesive tape T is detected to be 0.5mm or more, the mode determination unit 73 determines that the 2 nd mode is appropriate, and transmits information indicating that the 2 nd mode is selected to the control unit 81.

As shown in fig. 28 (a), the joint tape supply unit 75 includes a tape supply unit 77, a guide roller 78, and a cutter unit 79. The tape supply unit 77 feeds out and supplies the adhesive tape F from a reel, which is prepared separately from the adhesive tape T and is loaded with an adhesive tape roll around which the adhesive tape F is wound. The adhesive tape F preferably includes a base material B that is thin and has low rigidity. The adhesive material contained in the adhesive layer C of the adhesive tape F is preferably a material having strong adhesion to the adhesive layer C of the adhesive tape T. As an example of the thickness of the base material B of the pressure-sensitive adhesive tape F, 0.1mm to 0.2mm is more preferable.

The guide roller 78 winds the adhesive tape F supplied from the tape supply portion 77 and guides the adhesive tape F to the engaging tape holding member 43. The cutter unit 79 has a movable portion and a cutter similarly to the cutter unit 45, and cuts the adhesive tape F guided to the adhesive tape holding member 43 in the width direction.

The following describes each step of step S7 executed when mode 2 is selected in the modification. Here, a modification example of mode 2 will be described based on the steps and apparatus of example 1. The following two points are different from step S7 in mode 2 and step S7 in mode 1 (each example).

1 st, in the modification, in step S7-1, the adhesive tape holding member 43 does not hold the adhesive tape T, but cuts the preceding adhesive tape T1 and the preceding separator S1. 2 nd, in the modification, in step S7-2, the joining tape F supplied from the joining tape supply unit 75 is held by the joining tape holding member 43, thereby producing a joining tape in which the adhesive tapes T are joined to each other.

That is, in embodiment 1, the subsequent pressure-sensitive adhesive tape T2 is in the state shown by reference numeral D2 in fig. 11 before the start of step S7. That is, the subsequent adhesive tape T2 supplied from the adhesive tape roll 27B in the standby position is guided to the adhesive tape holding member 41B and the adhesive tape holding member 43B, and is sucked and held by the respective holding members. On the other hand, the subsequent adhesive tape T2 of the modified example is in advance in the state shown in fig. 28 (a). That is, the adhesive tape T2 supplied from the adhesive tape roll 27B is not held by the adhesive tape holding member 43B, but is sucked and held at its leading end by the adhesive tape holding member 41B.

First, in step S7-1 of the modified example, the preceding adhesive tape T1 and the preceding separator sheet S1 are cut and separated from the adhesive tape roll 27A, respectively, in the same manner as in example 1 (fig. 12 and 13).

In step S7-2 of the modification, as shown in fig. 28 (B), the adhesive tape F is fed and fed from the tape feeding section 77, and the tip end portion of the fed adhesive tape F is held by the joining tape holding member 43B via the guide roller 78. After this suction holding is performed, the cutter unit 79 cuts the adhesive tape F in the width direction at a predetermined position between the adhesive tape holding member 43B and the guide roller 78 ((c) of fig. 28). By this cutting, the tip end portion of the adhesive tape F is cut off from the tape supply portion 77. The leading end portion of the separated adhesive tape F is held as an adhesive tape CT by the adhesive tape holding member 43B.

In the modification, the joint tape CT is prepared and prepared by the above steps. The steps after step S7-3 are the same as those in the respective embodiments, and therefore, detailed description thereof is omitted. Through a series of steps of the modified example, in step S7-5, the joining tape CT formed of the adhesive tape F is pressed against the preceding adhesive tape T1 and the succeeding adhesive tape T2 in a state where the adhesive layers C are opposed to each other ((a) of fig. 29) (fig. 29). By this pressing, the joining tape CT joins the preceding adhesive tape T1 and the subsequent adhesive tape T2.

In the present modification, an appropriate mode determination is performed based on the characteristics of the adhesive tape T, and any one of the 1 st mode and the 2 nd mode can be appropriately selected. That is, the 1 st mode is selected in the case where the characteristics of the adhesive tape T are suitable as the joining tape CT, and by using a part of the adhesive tape T as the joining tape CT, a unique advantageous effect can be obtained in each embodiment.

On the other hand, in the case where the characteristics of the adhesive tape T are not suitable as the joining tape CT, the 2 nd mode is selected. In this case, the adhesive tapes T having the thick base material B and high rigidity are joined to each other by the broken pieces of the adhesive tape F having the thin base material B and low rigidity. Therefore, the occurrence of a joining error caused by using the adhesive tape T itself as the joining tape CT can be reliably avoided.

In the present modification, the detection of the characteristics of the adhesive tape T, the selection of the mode, and the supply of the adhesive tape F are automatically performed. However, at least one of them may be performed manually. That is, the operator can detect the characteristics of the adhesive tape T at the time of loading the adhesive tape T on the reel 25. Further, the operator can select a mode more suitable for joining the adhesive tape T from the 1 st mode and the 2 nd mode by appropriately operating the input portion 83. The operator can also cut the adhesive tape F into pieces of an appropriate length and suck and hold the pieces of the adhesive tape F by the adhesive tape holding member 43.

(2) In each of the embodiments and modifications, the adhesive tape T to be subjected to automatic joining is exemplified by an adhesive tape (protective tape) for circuit protection, but the present invention is not limited thereto. That is, as the adhesive tape T, in addition to the protective tape, the configuration of the tape joining apparatus of the present invention can be applied as long as it is an adhesive tape for supporting the semiconductor wafer on the entire ring frame (dicing tape), an adhesive tape for peeling which is joined to the surface of the protective tape for peeling the protective tape, or the like.

(3) In the embodiments and the modifications, the tape joining apparatus of the present invention has been described using the adhesive tape joining apparatus, but the tape joining apparatus and the tape collecting apparatus of the present invention can be applied to various tape processing apparatuses other than the tape joining apparatus. Examples of the tape processing apparatus include a tape peeling apparatus that peels off various tapes attached to a wafer, and a mounting apparatus (mounter) that mounts a wafer on a ring frame.

(4) In each of the embodiments and modifications, the number of the adhesive tape rolls 27 disposed in the tape supply unit 17 is not limited to two, and may be 3 or more. In this case, the respective configurations of the supply unit 18 are added according to the number of the adhesive tape rolls 27.

(5) In each of the embodiments and modifications, the structure in which the adhesive tape T is cut by the cutter is exemplified, but a known cutting member and a known cutting method may be appropriately used as long as the adhesive tape T can be cut in the width direction.

(6) In the examples and the modifications, the bonding method by heating and pressing is exemplified as the step of bonding the separator sheet S, but the bonding method is not limited to this method. As a method of bonding the separator S, other methods such as a structure in which the separator S is pressed and bonded while being coated with an adhesive material, a structure in which both are ultrasonically bonded using an ultrasonic generator, and the like may be appropriately changed.

(7) In each of the embodiments and the modifications, the structure in which the tape TS, that is, the long tape in which the separator S is attached to the adhesive tape T, is wound around each of the adhesive tape rolls 27 is exemplified, but the structure of the present invention can be applied to a structure in which the adhesive tape T formed of the base material B and the adhesive layer C, to which the separator S is not attached, is wound around each of the adhesive tape rolls 27. In this case, the adhesive tape joining apparatus can omit the structure relating to the operation of the separation sheet S. For example, a structure for guiding the separator S by winding, a structure for cutting and joining the separator S, and the like can be omitted.

(8) In each of the embodiments and modifications, the order of executing the steps of step S7 may be changed as appropriate. As an example, the steps S7-2 and S7-3 may be performed first, and then the steps S7-1 and S7-4 may be performed.

The joining tape CT is produced by performing the respective steps in this order, and the joining tape CT is displaced (reversed) so that the adhesive layer C of the joining tape CT and the adhesive layer C of the adhesive tape T face each other. Then, the preceding adhesive tape T1 and the preceding separator S1 are cut, and the adhesive tape roll 27 disposed at the supply position is switched to another adhesive tape roll 27.

In this case, while the adhesive tape T is being stuck to the wafer W using the tape TS wound around the adhesive tape roll 27 disposed at the supply position, the adhesive tape CT can be prepared and prepared in advance using the adhesive tape T wound around the adhesive tape roll 27 disposed at the standby position. Therefore, the time required for the step of joining the adhesive tape T can be shortened, and the work efficiency of the adhesive tape joining apparatus 3 can be improved.

Claims

1. An adhesive tape joining apparatus for joining end portions of an elongated adhesive tape to each other,

the adhesive tape joining apparatus is characterized by comprising:

a cutting mechanism for cutting the 1 st adhesive tape fed from the 1 st adhesive tape roll located at the feeding position among the plurality of adhesive tape rolls provided in the tape feeding portion at a predetermined position, and cutting the 1 st adhesive tape from the 1 st adhesive tape roll;

an adhesive tape holding member that holds the adhesive tape sheet;

2. The adhesive tape joining apparatus according to claim 1,

the adhesive tape joining mechanism joins the rear end of the 1 st adhesive tape and the front end of the 2 nd adhesive tape by the adhesive tape sheet in a state where the adhesive surface of the adhesive tape sheet, the adhesive surface of the rear end portion of the 1 st adhesive tape, and the adhesive surface of the front end portion of the 2 nd adhesive tape face each other.

3. The adhesive tape joining apparatus according to claim 1 or 2,

each of the adhesive tape rolls discharges the adhesive tape added with a separate sheet,

the adhesive tape joining apparatus has a separator joining mechanism that joins a rear end of a 1 st separator cut from the 1 st adhesive tape roll and a front end of a 2 nd separator paid out from the 2 nd adhesive tape roll.

4. The adhesive tape joining apparatus according to claim 3,

the separator joining mechanism has a heating mechanism that heats at least one of a rear end of the 1 st separator and a front end of the 2 nd separator,

5. The adhesive tape joining apparatus according to claim 1 or 2,

the adhesive tape joining apparatus includes:

the control mechanism is controlled as follows,