TWI793214B - Apparatus for bonding adhesive tape - Google Patents

Abstract

Provided is an adhesive tape joining device capable of more firmly joining ends of adhesive tapes to each other without using a new adhesive tape for joining.

The preceding adhesive tape T1 is cut off from the raw material roll 27A, and a part of the following adhesive tape T2 is cut|disconnected in the joint tape forming part 33, and the joint tape CT is produced. After switching the original material roll 27A at the supply position to another original material roll 27B, the front end of the subsequent adhesive tape T2 released from the original material roll 27B is bonded to the preceding adhesive tape T2 cut off from the original material roll 27A with the joint tape CT. Back end engagement with T1.

Description

Adhesive tape joining device

The present invention relates to an adhesive tape joining device, which is used in the process of supplying adhesive tape attached to various substrates such as semiconductor wafers, LEDs (Light emitting diodes), and electronic circuits. The back end of the tape engages the front end of the subsequent adhesive tape.

A semiconductor wafer (hereinafter, appropriately referred to as a "wafer") is a circuit pattern on which a plurality of elements are formed on the surface. For example, bumps and fine circuits are formed on the wafer surface. Then, an adhesive tape for protection is attached to prevent contamination and damage of the circuit surface during back grinding and transportation.

Here, the conventional structure of the tape sticking apparatus used for sticking the adhesive tape to the surface of this wafer is demonstrated. Conventional tape sticking device 101 is as shown in Figure 30, is equipped with tape supply part 103, spacer tape peeling part 105, holding table 107, tape sticking part 109, tape cutting mechanism 111, tape recovery part 113, and isolation tape. Belt recovery unit 115 and the like.

The tape supply unit 103 feeds out and guides the adhesive tape TS from a supply bobbin loaded with a raw material roll of the adhesive tape TS wound with a separator tape for circuit protection. The separator tape peeling unit 105 peels the separator tape S from the unwound adhesive tape TS. Holder 107 is the circuit forming surface The upward facing wafer W is sucked and held. An example of the tape sticking unit 109 is a sticking roller, which moves horizontally to the left in FIG. 30 . By this horizontal movement, the tape attaching unit 109 attaches the adhesive tape T from which the separator tape S has been peeled off to the wafer W on the holding table 107 .

The tape cutting mechanism 111 includes a cutter 111a, and the adhesive tape T is cut along the outer shape of the wafer W by the rotation of the tape cutting mechanism 111 around a vertical axis indicated by symbol P. The cut off unnecessary portion of the adhesive tape T, that is, the unnecessary tape Tn is wound around a winding shaft constituting the tape collecting section 113 in a roll shape and collected. The separator tape S peeled off from the adhesive tape T is wound up into a roll by a winding shaft constituting the separator tape recovery unit 115 and recovered.

In such a tape sticking device, it is necessary to install the adhesive tape T in the tape supply unit 103 below a certain amount, or when the amount of unnecessary Tn collected by the tape recovery unit 113 exceeds a certain amount. Exchange rolls. In the conventional tape sticking device 101, when it is necessary to exchange the rollers, the operator has to perform complicated work manually.

That is, in the tape supply unit 103, a series of operations such as cutting the adhesive tape T fed out from the raw material roll, exchanging the raw material roll, joining the cut adhesive tape T, and refeeding the adhesive tape T are required. . In addition, in the tape recovery section 113, etc., a series of processes such as cutting of the unnecessary tape Tn, removal of the unnecessary tape Tn collected in roll form, joining of the unnecessary tape Tn to the winding shaft, and rewinding of the unnecessary tape Tn are required. Operation. In the conventional device, during the series of operations, it is necessary to interrupt the operation of the tape attaching device.

In recent years, in order to avoid the reduction of the attachment efficiency due to the interruption of the operation of the tape attachment device, the exchange operation of the roll, especially the cutting The operation of joining the ends of the adhesive tape T to each other has been attempted to be automated. As an example, the following belt joining method is proposed (for example, refer patent document 1). That is, the joining tape attached to the joining adhesive tape is attached to the rear end of the prior adhesive tape with spacer.

After the bonding tape is attached, the rear end of the adhesive tape with separator tape to which the bonding tape is attached is pressed and joined to the front end of the following adhesive tape with separator. In this way, the ends of the preceding adhesive tape and the following adhesive tape can be joined to each other through the joining tape.

prior art literature

Patent Document 1 Japanese Patent Laid-Open No. 2014-133616

However, the above conventional devices have the following problems.

That is, in the conventional device, when joining the preceding adhesive tape and the succeeding adhesive tape, it may be necessary to separately prepare a joining tape called a third adhesive tape. In addition, since an apparatus for supplying and attaching the adhesive tapes is required separately, the apparatus for joining the adhesive tapes becomes large in size.

Furthermore, the adhesive surface of the joint tape is such that the non-adhesive surface of the rear end of the preceding adhesive tape is in contact with the non-adhesive surface of the front end of the following adhesive tape. Therefore, the adhesive force between the joint tape CT and the preceding adhesive tape, and the adhesive force between the joint tape CT and the following adhesive tape are weak. Therefore, there is also a concern that the previous adhesive tape and the subsequent adhesive tape that should have been joined are peeled off from each other, resulting in joint failure.

The present invention was made in view of such circumstances, and a main object thereof is to provide an adhesive tape joining device capable of joining ends of adhesive tapes more firmly without using a new adhesive tape for joining.

The present invention adopts the following configurations to achieve the above object.

That is to say, an adhesive tape joining device, which joins ends of long adhesive tapes together, is characterized by comprising: a tape supply unit, a raw material roll provided with a plurality of adhesive tapes, and the adhesive tape is fed from a plurality of the aforementioned raw materials. The first raw material roll arranged at the supply position among the material rolls is released; the cutting mechanism releases the first adhesive tape from the first raw material roll at the supply position among the plurality of raw material rolls equipped in the tape supply unit. Cut at a predetermined position and cut off from the first raw material roll; the first bonding tape forming mechanism, among the plurality of raw material rolls equipped in the tape supply unit, the first adhesive tape released from the first raw material roll A part of any one of the tape and the second adhesive tape released from the second raw material roll is cut and made into an adhesive tape sheet for bonding; the bonding tape holding member holds the aforementioned adhesive tape sheet; the roll switching mechanism makes the aforementioned tape The supply unit moves to switch the raw material roll arranged at the supply position from the first raw material roll to the second raw material roll; and the adhesive tape joining mechanism makes the first adhesive tape cut off from the first raw material roll and the front end of the second adhesive tape unwound from the second raw material roll are joined by the adhesive tape piece.

(Function, effect) According to this invention, the first adhesive tape forming mechanism is to combine the first adhesive tape and the second adhesive tape that are the object of bonding A part of either is cut off to make an adhesive tape sheet for joining. Then the adhesive tape joining mechanism joins the rear end of the first adhesive tape and the front end of the second adhesive tape with the adhesive tape piece.

At this time, a part of the first adhesive tape or the second adhesive tape to be joined is used as an adhesive tape sheet for joining. Therefore, when bonding the adhesive tapes, it is not necessary to prepare in advance a tape different from each of the adhesive tapes to be joined as the adhesive tape for joining. Also, there is no need to arrange a structure for supplying the different tape to the tape splicing device or a structure for attaching the different tape to the adhesive tape to be bonded. Therefore, it is possible to avoid complicating preparations for joining the adhesive tape, or increasing the size and cost of the tape joining device.

Then, the rear end of the first adhesive tape is joined to the front end of the second adhesive tape, and the characteristics of the adhesive tape sheet for joining are the same as those of the joining object. Therefore, the situation where the adhesive force between the adhesive tape sheet and the 1st adhesive tape is low, or the situation where the adhesive force between the adhesive tape sheet and the 2nd adhesive tape is low is avoided reliably. Therefore, it is possible to more surely prevent the occurrence of joint failure due to re-peeling in the joined portion.

Also, in the above invention, it is preferable that the adhesive tape joining mechanism is connected between the adhesive surface of the adhesive tape sheet, the adhesive surface of the rear end portion of the first adhesive tape, and the adhesive surface of the front end portion of the second adhesive tape. In the state of facing each other, the rear end of the first adhesive tape and the front end of the second adhesive tape are joined by the adhesive tape piece.

(Function, Effect) According to this configuration, the adhesive tape joining mechanism is in a state where the adhesive surface of the adhesive tape sheet, the adhesive surface of the rear end portion of the first adhesive tape, and the adhesive surface of the front end portion of the second adhesive tape face each other. In this state, the rear end of the first adhesive tape is joined to the front end of the second adhesive tape with an adhesive tape piece. That is, when joining, the adhesive surface of the rear end portion of the first adhesive tape and the adhesive surface of the front end portion of the second adhesive tape face the same direction, and relatively, the adhesive surface of the adhesive tape sheet faces each adhesive surface. Adhesive side of the tape.

Therefore, the adhesive surface of the adhesive tape sheet is bonded by contacting each of the adhesive surface of the rear end portion of the first adhesive tape and the adhesive surface of the front end portion of the second adhesive tape. At this time, the adhesive force system at the joining portion affects not only the adhesive force of the adhesive tape sheet, but also the adhesive force of the first adhesive tape and the second adhesive tape. Therefore, since the adhesive force at the joint portion can be further improved, the occurrence of joint failure in the joint portion can be more reliably avoided.

Also, in the above-mentioned invention, it is preferable that each of the above-mentioned raw material rolls feeds out the above-mentioned adhesive tape to which a spacer is added, and is provided with a spacer joining mechanism so that the first raw material roll cut off from the first raw material roll 1. The rear end of the spacer is joined to the front end of the second spacer fed out from the second raw material roll.

(Function, Effect) According to this configuration, the rear end of the first separator cut off from the first material roll and the front end of the second separator released from the second material roll are joined by the separator joining mechanism. That is, the adhesive tapes are joined to each other into a continuous long shape, and the isolation tapes are also joined to each other into a continuous long shape. Therefore, not only the adhesive tape but also the spacer tape can be continuously wound and recovered, so the device can be used continuously for a longer period of time.

In addition, in the above invention, it is preferable that the spacer joining mechanism includes a heating mechanism for heating at least one of the rear end of the first spacer and the front end of the second spacer, The first spacer and the second spacer are made of materials that can be bonded by thermal bonding.

(Function and Effect) According to this configuration, the first and second separators can be joined by heating at least one of the rear end of the first separator and the front end of the second separator by the separator joining mechanism. Therefore, the respective isolation bands can be joined to each other more appropriately.

Also, with regard to the above-mentioned invention, it is preferable to include: a third raw material roll for supplying a third adhesive tape having characteristics different from those of the first adhesive tape and the second adhesive tape; 3. A part of the adhesive tape is cut to make an adhesive tape sheet for joining; the selection mechanism selects either one of the first mode and the second mode according to the characteristics of the first adhesive tape or the characteristics of the second adhesive tape; And the control mechanism, according to the selection of the aforementioned selection mechanism, controls the aforementioned first joint band forming mechanism and the aforementioned second joint band forming mechanism, and the aforementioned control mechanism is to perform the second joint band when the aforementioned first mode is selected. Controlling the stop of the tape forming mechanism, and actuating the first bonding tape forming mechanism to cut a part of any one of the first adhesive tape and the second adhesive tape to make an adhesive tape sheet for bonding, When the aforementioned second mode is selected, control is performed to stop the first bonding tape forming mechanism, and the second bonding tape forming mechanism is actuated to cut a part of the aforementioned third adhesive tape to form the adhesive for bonding. The way of belt film is controlled.

(Function, Effect) According to this configuration, the third raw material roll is provided, and either one of the first mode and the second mode can be appropriately selected according to the characteristics of the first adhesive tape or the second adhesive tape to be joined. Then, when the first mode is selected, the first bonding tape forming mechanism is actuated to make an adhesive tape sheet for bonding using a part of the first adhesive tape or the second adhesive tape. On the other hand, when the second mode is selected, the second joining tape creating mechanism is activated to create an adhesive tape sheet for joining using the third adhesive tape.

At this time, when the characteristics of the first adhesive tape or the second adhesive tape are not suitable as the adhesive tape sheet for joining, the second mode is selected and the appropriate third adhesive tape is used as the adhesive tape sheet for joining. Therefore, the 1st adhesive tape and the 2nd adhesive tape can be joined firmly by the 3rd adhesive tape.

On the one hand, in the case where the characteristics of the first adhesive tape or the second adhesive tape are suitable as the adhesive tape sheet for joining, the first mode is selected to use a part of the first adhesive tape or the second adhesive tape to make the first adhesive tape and the second adhesive tape Adhesive tape engagement. Therefore, by appropriately utilizing the first mode and the second mode, the adhesive tapes can be bonded regardless of the characteristics of the first adhesive tape and the second adhesive tape. That is, the versatility of the adhesive tape joining device can be improved. In addition, when joining is possible without using the third adhesive tape, the adhesive tapes are joined together in the first mode, so the consumption of the third adhesive tape, which is an auxiliary material, can be suppressed and the need to join the first adhesive tape can be more reliably avoided. There is a case where joining fails with the second adhesive tape.

According to the adhesive tape joining device of the present invention, when joining the ends of the elongated adhesive tapes to which the spacer is added, the A part of the adhesive tape to be joined is made into an adhesive tape sheet for joining, and the ends of the adhesive tape are joined using the adhesive tape sheet. Therefore, if an adhesive tape to be joined is prepared, it is not necessary to separately prepare an adhesive tape sheet for joining. Also, since the adhesive tape to be joined and the adhesive tape sheet to be joined have the same characteristics of the constituent materials, it is possible to reliably avoid a situation where the adhesive force between the adhesive tape sheet to be joined and the adhesive tape to be joined is low. In addition, it is also possible to prevent an increase in the size and cost of the adhesive tape joining device.

1‧‧‧Adhesive tape attaching device

3‧‧‧With jointing device

5‧‧‧Holding table

7‧‧‧With attachment unit

9‧‧‧with cutting unit

11‧‧‧with stripping unit

13‧‧‧with recycling department

15‧‧‧Recycling department of isolation zone

17‧‧‧with supply unit

19‧‧‧Preadhesive adhesive tape retaining member

21‧‧‧Separation belt joint unit

27‧‧‧Raw material roll

29‧‧‧belt supply department

31‧‧‧Isolation strip stripping part

33‧‧‧Joint belt making department

36‧‧‧Separation belt retaining member

41‧‧‧Adhesive tape holding member

43‧‧‧Joint belt retaining member

45‧‧‧Cutter unit

47‧‧‧Retaining member of the leading barrier

49‧‧‧Cutter unit

50‧‧‧heater

TS‧‧‧Tape (adhesive tape with isolation tape)

T‧‧‧adhesive tape

S‧‧‧isolation zone

B‧‧‧Substrate

C‧‧‧adhesive layer

FIG. 1 is a front view showing the basic configuration of the adhesive tape sticking device of the first embodiment.

FIG. 2 is a configuration diagram showing a tape supply unit of the first embodiment. Fig. 2(a) is a perspective view of the string supply unit, and Fig. 2(b) is a front view of the string supply unit.

Fig. 3 is a configuration diagram showing a tape supply unit and a spacer tape peeling unit in the first embodiment.

FIG. 4 is a diagram showing the configuration of a joining tape forming unit in the first embodiment.

FIG. 5 is a diagram showing the configuration of a barrier joining unit according to the first embodiment.

Fig. 6 is a cross-sectional view showing the structure of the adhesive tape with spacer of the first embodiment.

Fig. 7 is a flow chart showing the operation of the adhesive tape sticking device of the first embodiment. FIG. 7( a ) is a flow chart showing the outline of the operation of attaching the adhesive tape to the wafer, and FIG. 7( b ) is a flow chart illustrating the details of the operation of step S7.

FIG. 8 is an operation diagram showing step S2 of the first embodiment. FIG. 8( a ) is a diagram showing the state before the adhesive tape is attached to the wafer, and FIG. 8( b ) is a diagram showing the state after the adhesive tape is attached to the wafer.

FIG. 9 is an operation diagram showing step S3 of the first embodiment.

FIG. 10 is an operation diagram showing step S4 of the first embodiment.

Fig. 11 is a diagram showing the configuration of the belt splicing device at the start of step S7 of the first embodiment.

Fig. 12 is a diagram showing the operation of cutting the preceding adhesive tape in step S7-1 of the first embodiment. Fig. 12(a) is a state diagram showing that the cutter unit is arranged at the initial position, Fig. 12(b) is a state diagram showing that the cutter unit is moving to the cutting preparation position, and Fig. 12(c) is a state diagram showing that the cutter unit is moving The state diagram of moving the cutting execution position and cutting the leading adhesive tape. Figure 12(d) shows the positions of the cutter unit and the leading adhesive tape in step S7-2 seen from the releasing direction (L direction) of the leading adhesive tape A cross-section of the relationship.

Fig. 13 is a diagram showing the operation of cutting the leading barrier in step S7-1 of the first embodiment. Fig. 13(a) shows the state diagram in which the cutter unit is arranged at the initial position, Fig. 13(b) shows the state diagram in which the cutter unit moves to the cutting preparation position, and Fig. 13(c) shows the state diagram in the cutting The state diagram of the knife unit moving to the cutting execution position and cutting the leading isolation zone.

Fig. 14 is a diagram showing the operation of step S7-2 in the first embodiment. Fig. 14(a) is a diagram showing the state where the cutter unit is arranged at the initial position, and Fig. 14(b) is a diagram showing the state where the cutter unit moves to the cutting execution position and cuts the subsequent adhesive tape to form a joint tape. 14(c) is a schematic configuration diagram showing the belt splicing device after each process up to step S7-3 is completed.

Fig. 15 is an operation diagram showing step S7-3 of the first embodiment. Fig. 15 (a) is a state diagram showing a state in which the joint belt holding member is arranged at the cutting preparation position, and Fig. 15 (b) is a state diagram showing a state diagram in which the joint belt holding member is displaced from the cutting preparation position to the joining preparation position, and Fig. 15(c) represents the pre-adhesive tape 15( d ) is a state diagram showing a state in which the leading adhesive tape holding member moves from the approaching position to the withdrawn position.

Fig. 16 is an operation diagram showing step S7-4 of the first embodiment. Fig. 16(a) is a diagram showing the state of the belt splicing device before switching the raw material rolls arranged at the supply position, and Fig. 16(b) is a diagram showing the belt splicing device after switching the raw material rolls arranged at the supply position state diagram.

Fig. 17 is a diagram showing the operation of step S7-5 in the first embodiment. Fig. 17(a) is a diagram showing a state in which the joint belt holding member is arranged at the joint preparation position, and Fig. 17(b) is a diagram showing a state in which the joint belt holding member is displaced from the joint preparation position to the joint execution position and the joint belt is pressed , Figure 17(c) is a state view showing that the bonding of the adhesive tapes is completed using the bonding tape, and the holding of the adhesive tape is released, and Figure 17(d) is a state view showing the re-release of the adhesive tape that has been bonded.

Fig. 18 is an operation diagram showing step S7-6 of the first embodiment. Fig. 18(a) is a state view showing that the leading partition holding member is arranged at the joint preparation position, and Fig. 18(b) shows that the leading partition holding member is displaced from the joint preparation position to the joint execution position, and the subsequent partition will go ahead. As a state diagram of heating and pressing the spacers, FIG. 18( c ) is a state diagram showing that the joining of the spacers has been completed and the holding of the spacers has been released.

Fig. 19 is an operation diagram showing steps S7-5 and S7-6 of the first embodiment. Fig. 19(a) is a schematic configuration diagram showing the tape splicing device in the state where the bonding between adhesive tapes and the bonding between spacer tapes are being performed, and Fig. 19(b) shows the bonding between adhesive tapes and the bonding between spacer tapes. Schematic configuration diagram of the belt splicing device in the spliced state.

Fig. 20 is an effect diagram illustrating the problems of the conventional structure and the structure of the first embodiment. Fig. 20 (a) is a cross-sectional view of a joint part using a single-sided tape as a joint tape and performing a conventional joint method, and Fig. 20 (b) is using a double-sided tape as a joint tape and performing a practice Fig. 20(c) is a cross-sectional view of the bonding portion in the case of implementing the bonding method of the first embodiment.

Fig. 21 is a diagram showing the configuration of the belt splicing device at the start of step S7 of the second embodiment.

Fig. 22 is an operation diagram showing step S7-1 of the second embodiment. Fig. 22 (a) is a state diagram showing the state before cutting the leading adhesive tape and the leading isolation tape, and Fig. 22 (b) is a state diagram showing the state after cutting the leading adhesive tape and the leading insulating tape.

Fig. 23 is an operation diagram showing step S7-2 of the second embodiment.

Fig. 24 is an operation diagram showing step S7-3 of the second embodiment.

Fig. 25 is an operation diagram showing step S7-4 of the second embodiment. Fig. 25(a) is a diagram showing the state of the belt splicing device before switching the raw material rolls arranged at the supply position, and Fig. 25(b) is a diagram showing the belt splicing device after switching the raw material rolls arranged at the supply position state diagram.

Fig. 26 is an operation diagram showing steps S7-5 and S7-6 of the second embodiment. Fig. 26(a) is a state diagram showing the state before starting the bonding of the adhesive tapes and the bonding of the spacer tapes, and Fig. 26(b) is a state view showing the state of performing the bonding of the adhesive tapes and the bonding of the spacer tapes.

Fig. 27 is a view showing a belt splicing device according to a modified example. Fig. 27(a) is a cross-sectional view of the bonding portion of the adhesive tape in the case where the bonding of the adhesive tape of the embodiment is carried out using an adhesive tape with a thick base material, and Fig. 27(b) shows a schematic configuration of a tape bonding device according to a modified example. picture.

Fig. 28 is an operation diagram showing a belt splicing device according to a modified example. Fig. 28 (a) shows the initial state diagram of the follow-up adhesive tape when the step S7 of the modified example starts, and Fig. 28 (b) shows the state diagram before starting the cutting of the adhesive tape F in the step S7-2 of the modified example , FIG. 28(c) is a state diagram showing the completion of the process of step S7-2 of the modification and the creation of the joint belt.

Fig. 29 is an operation diagram showing a belt splicing device according to a modified example. FIG. 29( a ) is a diagram showing a state before starting the process of step S7-5 of the modification, and FIG. 29( b ) is a diagram showing a state in which the process of step S7-5 of the modification is executed and the adhesive tapes are bonded.

Fig. 30 is a configuration diagram showing a conventional tape sticking device.

[Example 1]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a front view showing the basic configuration of an adhesive tape sticking device 1 provided with the adhesive tape joining device of the first embodiment. In addition, in the figure which shows the adhesive tape sticking apparatus 1, illustration of the support means which supports various components, the drive means which drives various components, etc. is abbreviate|omitted.

In this embodiment, the adhesive tape T for surface protection attached to various substrates such as a semiconductor wafer W (hereinafter, simply referred to as "wafer W") is in the form of a long shape spliced with a spacer tape S. The case where it is supplied and cut into a predetermined string on the downstream side will be described as an example. That is, in this embodiment, the elongated adhesive tapes are bonded together. In addition, let the adhesive tape T of the state which spliced the separator tape S be tape TS.

In this embodiment, "upstream" and "downstream" are defined along the discharge direction of the tape TS. That is, "upstream" refers to the The side that is close to the tape supply part described later in the release direction. In addition, the adhesive tape T is as shown in FIG. 6 , and has a structure in which a non-adhesive base material B and an adhesive layer C with adhesiveness are laminated. As a material constituting the isolation tape S, a material that can be bonded by thermal bonding is preferable.

<Description of overall composition>

The adhesive tape sticking device 1 of Embodiment 1 is as shown in FIG. Isolation belt recovery unit 15. The adhesive tape joining device 3 is attached to the rear end of the preceding adhesive tape T which joins the front end of another following adhesive tape T. The specific configuration of the adhesive tape joining device 3 will be described later.

The holding table 5 places and holds the wafer W with the circuit-formed surface facing upward. Although the holding table 5 in the embodiment uses a chuck table that suction-holds the wafer W, the configuration of the holding table 5 is not limited thereto. Further, a cutter running groove 5a is formed on the upper surface of the holding table 5 for cutting the adhesive tape T by rotating and moving the blade 9c included in the tape cutting unit 11 described later along the outer shape of the wafer W. The holding table 5 may be configured to be able to move up and down appropriately.

The tape attaching unit 7 attaches an adhesive tape T to the circuit surface of the wafer W placed and held by suction on the holding table 5 . As shown in FIG. 1 , the tape attaching unit 7 includes a movable table 7a that horizontally reciprocates left and right along an unshown rail, and an attaching roller 7b whose shaft is supported by a bracket connected to the movable table 7a.

The tape cutting unit 9 is equipped with a support arm 9b in a manner that can drive and rotate around the longitudinal axis P on the center of the holding table 5 at the lower part of the movable table 9a that can be driven up and down. Moreover, the cutting knife 9c with the knife edge facing down is attached to the free end side of the support arm 9b here. That is, it is configured to cut the adhesive tape T by moving the cutter 9c along the outer periphery of the wafer W through the rotation of the support arm 9b around the longitudinal axis P.

The tape peeling unit 11 separates the adhesive tape Tw cut off by the cutter 9c and attached to the surface of the wafer W from the unnecessary tape Tn cut off from the adhesive tape Tw to become an unnecessary adhesive tape T. The tape peeling unit 11 is provided with the guide roller 11a and the nip roller 12 which maintain the tension of the unnecessary tape Tn. The nip roller 12 is constituted by a pressure roller 12a that can be moved up and down and a feed roller 12b driven by a motor. The tape peeling unit 11 is configured to be able to reciprocate horizontally to the left and right along a rail not shown.

The tape recovery unit 13 is arranged downstream of the tape peeling unit 11, and the recovery bobbin for winding up the unnecessary tape Tn is rotationally driven in the winding direction. The spacer tape collection part 15 is a collection bobbin which winds up the spacer tape S peeled off from the adhesive tape T, and is rotationally driven in the winding direction.

In addition, the adhesive tape sticking device 1 further includes a control unit 81 and an input unit 83 . The control part 81 is equipped with CPU (Central Processing Unit) etc., and controls various operations etc. collectively for every structure provided in the adhesive tape sticking apparatus 1. Examples of the input unit 83 include a console panel, a keyboard, and the like, and the operator uses the input unit 83 to input various instructions. The instruction content input to the input part 83 is sent to the control part 81, and the control part 81 can perform various controls according to this instruction.

<Configuration of Adhesive Tape Splicing Device>

Here, the structure of the adhesive tape joining apparatus 3 of Example 1 is demonstrated. The adhesive tape splicing device 3 includes a tape supply unit 17 , a preceding adhesive tape holding member 19 , and a separator tape splicing unit 21 .

The tape supply unit 17 is, as shown in FIG. 2( a ), configured to vertically install a plurality of bobbins 25 on a rotating plate 23 and to load the raw material roll 27 with tape TS into each bobbin 25 . In this embodiment, two bobbins 25A and 25B are vertically installed on the rotary plate 23 . The symbol 27A is assigned to the raw material roll loaded in the bobbin 25A, and the symbol 27B is attached to the raw material roller loaded in the bobbin 25B to distinguish between the two. In addition, in the perspective view of FIG. 2( a ), components other than the rotary plate 23 , the bobbin 25 , and the raw material roll 27 are omitted for convenience of description.

As shown in FIG. 2( b ), the tape supply unit 17 is provided with a plurality of supply units 18 as a whole. The tape supply device 17 of the present embodiment consists of two supply units as a whole, that is, a first supply unit 18A including the bobbin 25A and a second supply unit 18B including the bobbin 25B. Each supply unit 18 includes a tape supply unit 29 , a spacer tape peeling unit 31 , and a joint tape forming unit 33 .

In addition, in the present embodiment, each configuration included in the first unit 18A is assigned a code A, and each configuration included in the second unit 18B is assigned a code B to distinguish between the two. As an example, one of the two tape supply units 29 arranged in the first unit 18A is identified by being expressed as the tape supply unit 29A. And the other one arrange|positioned in the 2nd unit 18B is represented as the tape supply part 29B.

The rotating plate 23 is configured to rotate about the axis of the central axis 39 via the drive mechanism 37 . Through the rotation of the rotating plate 23, the first supply The unit 18A and the second supply unit 18B are mutually movable between a supply position and a standby position.

In this embodiment, the supply position refers to a position where the adhesive tape T can be fed out from the raw material roll 27 toward the workpiece (wafer W in this embodiment). That is, when the components of the supply unit 18B as an example are arranged at the supply position, the adhesive tape T can be fed out to the workpiece from the raw material roll 27B included in the supply unit 18B among the plurality of raw material rolls 27 .

In each of FIG. 1 and FIG. 2 , the state in which the first supply unit 18A is arranged at the supply position and the second supply unit 18B is arranged at the standby position is shown. Then, the adhesive tape T is supplied to the tape attaching unit 7 by the original material roll 27 (original material roll 27A in the figure) arranged at the supply position among the two original material rolls 27 .

Each of the tape supply parts 29 is provided with the bobbin 25, the raw material roll 27, and the guide roll which is not shown in figure, as shown in FIG. The leading end of the tape TS loaded on the bobbin 25 and fed out from the raw material roll 27 is guided to the spacer tape peeling unit 31 while being maintained in tension by the guide roll.

In addition, the raw material roll 27 arrange|positioned at a standby position is comprised so that it can be taken out to the exterior of the adhesive tape sticking apparatus 1 automatically or manually through the opening and closing door 91. As shown in FIG. The operator or the work robot can take out the raw material roll 27 and set a new raw material roll 27 at the standby position.

In addition, in the adhesive tape splicing device 3 , the standby position is located at a position deviated from the central portion of the adhesive tape sticking device 1 compared to the supply position. In general, movable parts, cutters, members that become high temperature, and the like are often provided in the center of the adhesive tape sticking device 1 . Therefore, when exchanging the raw material roll 27 switched to the standby position, it is possible to prevent an operator from getting close to a member or a movable part that becomes high temperature.

As shown in FIG. 3 , the separator peeling unit 31 includes a guide roller 34 , a feed roller 35 , a separator holding member 36 , and an adhesive tape holding member 41 . The tape TS guided toward the separator tape peeling portion 31 is peeled into an adhesive tape T and a separator tape S by the guide roller 34 . Each component of the isolation tape peeling part 31 is connected to the rotary plate 23, and is displaced together with the bobbin 25 by the rotation of the rotary plate 23.

After the tape TS is peeled into the adhesive tape T and the separator tape S, the adhesive tape T is wound around the guide roller 34 and guided toward the adhesive tape holding member 41 . Next, the separator tape S is wound around the feed roller 35 and guided toward the separator tape holding member 36 .

The separator holding member 36 is an example of a plate-shaped member, and holds the separator S guided via the feed roller 35 . As a more preferable configuration example, the separator holding member 36 sucks and holds the separator S using a suction device (not shown).

The adhesive tape holding member 41 is an example of a plate-shaped member, and holds the adhesive tape T guided from the guide roller 34 on one surface (holding surface). It is more preferable that the adhesive tape holding member 41 has a function of absorbing and holding the adhesive tape T, similarly to the spacer tape holding member 36 .

In addition, when the separator tape peeling part 31 is arranged at the supply position, the adhesive tape T guided to the adhesive tape holding member 41 (adhesive tape holding member 41A in each figure of FIG. 2 ) is as shown in FIG. The tape holding member 19 is adhered first, and then guided toward the tape attaching unit 7 . Then, the separation tape S guided to the separation tape holding member 36 (the separation tape holding member 36A in each figure of FIG. 2 ) passes through the separation tape joining unit 21 as shown in FIG. guide.

As shown in FIG. 4 , the joint tape forming unit 33 includes a joint tape holding member 43 and a cutter unit 45 . An example of the joint belt holding member 43 is a plate-shaped member. Even if the spliced tape holding member 43 is disposed at any one of the supply position and the standby position, it can be configured to move toward the cutting preparation position shown by the solid line in FIG. 4 and the splicing preparation position shown by the dotted line in FIG. 4 . And each position movement of the joining execution position described later.

The cutting preparation position and the joining preparation position, and the cutting preparation position and the joining execution position are in a positional relationship in which both sides of the adhesive tape T are opposed to each other. The joining preparation position is configured to be located at a position away from the adhesive tape T compared to the joining execution position.

The joint tape holding member 43 is disposed downstream of the adhesive tape holding member 41 and is configured to hold the adhesive tape T on one side (holding surface) when the joint tape holding member 43 moves to the cutting preparation position. It is more preferable that the adhesive tape holding member 43 has a function of absorbing and holding the adhesive tape T.

Also, when the spliced tape holding member 43 moves from the cutting preparation position to the splicing preparation position, the spliced tape holding member 43 reverses its direction. That is, it is configured such that the holding surface of the bonding tape holding member 43 and the holding surface of the adhesive tape holding member 41 face each other at the joining preparation position.

The cutter unit 45 includes a movable table 46 and a blade 48 . The movable table 46 is drivable in a predetermined direction R by a drive mechanism not shown. The direction R is preferably the thickness direction of the adhesive tape T. The movable table 46 is also configured to be drivable in the width direction of the adhesive tape T (z direction in this embodiment).

A blade 48 is provided at a front end portion of the movable table 46 . The blade 48 cuts the adhesive tape T across the width direction at the gap between the adhesive tape holding member 41 and the joint tape holding member 43 . The adhesive tape T is cut through the blade 48 to form an adhesive tape for joining the rear end of the preceding adhesive tape T to the front end of the following adhesive tape T, that is, the joining tape CT. The joint tape holding member 43 also has a function of holding the formed joint tape CT.

In addition, each component of the supply unit 18 is connected to the rotating plate 23 , and is displaced about an axis centered on the rotating shaft 39 by the rotation of the rotating plate 23 . That is, the tape supply part 29 , the spacer tape stripping part 31 and the joining tape forming part 33 provided in each supply unit 18 are mutually movable between the supply position and the standby position by the rotation of the rotary plate 23 .

The preceding adhesive tape holding member 19 is disposed downstream of the bonding tape forming section 33 disposed at the supply position, and holds the adhesive tape T supplied from the raw material roll 27 at the supply position, that is, the preceding adhesive tape T1. The leading adhesive tape holding member 19 is configured to be movable along the feeding direction of the adhesive tape T, and to reciprocate between an approach position and a retracted position which will be described later. It is preferable to configure so that the holding surface of the preceding adhesive tape holding member 19 and the holding surface of the adhesive tape holding member 41 arranged at the supply position become the same plane.

As shown in FIG. 5 , the tape joining unit 21 is arranged downstream of the tape holding member 36 arranged at the supply position, and includes a leading tape holding member 47 and a cutter unit 49 . The leading separator holding member 47 holds the separator S supplied from the raw material roll 27 at the supply position, that is, the leading separator S1. A heater 50 for heating the separator tape S is disposed inside the leading separator tape holding member 47 .

The cutter unit 49 includes a movable table 51 and a blade 53 . The movable table 51 is drivable in a predetermined direction R by a drive mechanism not shown. The direction R is preferably the thickness direction of the preceding isolation zone S1. Furthermore, the movable table 51 is configured to be drivable also in the width direction (z direction in this embodiment) of the preceding isolation strip S1.

A blade 53 is provided at a front end portion of the movable table 51 . The blade 53 is positioned at a gap between the median holding member 36 and the preceding median holding member 47, and cuts the preceding median S1 across the width direction. Further, the leading median holding member 47 and the cutter unit 49 are configured to be movable along the feeding direction (direction L) of the leading median S1, and to reciprocate between an approach position and a retreat position described later.

In Embodiment 1, the preceding adhesive tape holding member 19 and the separator joining unit 21 are different in configuration from the supply unit 18 and are not connected to the rotary plate 23 . That is, each configuration of the preceding adhesive tape holding member 19 and the barrier tape joining unit 21 can be appropriately changed in position independently of the rotation of the rotary plate 23 .

<Summary of Taping Action>

Here, a series of basic operations for attaching the adhesive tape T for protecting the circuit surface to the wafer W using the adhesive tape applying apparatus 1 will be described. FIG. 7( a ) is a flow chart illustrating the process of attaching the protective adhesive tape T to the wafer W. As shown in FIG.

When a sticking command is issued, the wafer W stored in a predetermined storage section is aligned on the alignment table, and then placed on the holding table 5 by a wafer transfer mechanism not shown. The wafer W placed on the holding table 5 is transferred moves, and is sucked and held in a state where the center of the wafer W is aligned so that the center of the wafer W is above the center of the holding table 5 . (step S1).

At this time, the tape sticking unit 7, the tape cutting unit 9, and the tape peeling unit 11 move to the initial positions shown in FIG. 8(a), respectively. That is, the tape sticking unit 9 moves to the right side of the holding table 5 , and the tape peeling unit 11 moves to the left side of the holding table 5 . Also, the tape cutting unit 9 is on standby above the holding table 5 .

In addition, in the tape supply unit 17, the tape TS is discharged downstream from the raw material roll 27 loaded on the bobbin 25 moved to the supply position for supply, and the tape TS is peeled by the separator tape peeling part 31 into an adhesive tape T and a separator tape. with S. Then the adhesive tape T is guided to the tape sticking unit 7 and the tape peeling unit 11 .

Next, as shown in FIG. 8(b), the attaching roller 7b of the tape attaching unit 7 rotates forward (leftward in FIG. 8 ) on the wafer W while pressing the adhesive tape T downward. The initial position shown is towards the end position shown by the solid line. Thereby, the adhesive tape T is attached to the whole surface of the wafer W (step S2).

After the adhesive tape T is attached to the wafer W, as shown in FIG. 9 , the tape cutting unit 9 standing by above descends and moves from the initial position shown by the dotted line to the cutting position shown by the solid line. Then, the tape cutting unit 9 descends toward the cutting position, so that the cutter 9c in the cutter running groove 5a of the holding table 5 penetrates into the adhesive tape T.

When the cutter 9c penetrates into the adhesive tape T, the support arm 9b rotates around the longitudinal axis P as the rotation center. The cutter 9c rotates and moves while sliding on the outer periphery of the wafer, and the adhesive tape T is cut along the outer shape of the wafer (step S3).

When the cutting of the adhesive tape T along the outer shape of the wafer is finished, the tape cutting unit 9 moves up to the original standby position. Then, the tape attaching unit 7 returns to the initial position from the terminal position. The attaching unit 17 returns to the original position and as shown in FIG. 10 , the tape peeling unit 11 moves backward (right direction in FIG. 10 ). That is, the tape peeling unit 11 moves rightward from the initial position shown by the dotted line in FIG. 10 toward the terminal position shown by the solid line.

The tape peeling unit 11 winds up and peels the unnecessary tape Tn remaining after being cut and cut on the wafer W in the adhesive tape T while moving toward the terminal position (step S4 ). In addition, the symbol Tw is attached to the part of the adhesive tape T attached to the surface of the wafer W to distinguish it from the part that does not have Tn.

When the tape peeling unit 11 reaches the terminal position and the stripping operation ends, the tape peeling unit 11 returns from the terminal position to the initial position. At this time, the unnecessary tape Tn is wound and guided to the tape collecting unit 13 for collection, and a certain amount of tape TS is fed out from the raw material roll 27 arranged at the supply position (step S5 ).

When the processes up to step S5 are completed, the suction on the holding table 5 is released. After the adsorption is released, the wafer W to which the adhesive tape Tw is attached is transported by the wafer transport mechanism and recovered in a wafer recovery unit (not shown) (step S6 ). Up to the above, one adhesive tape sticking process is completed.

In addition, after the adhesive tape attaching process is completed, it is divided into the following process according to the loading amount of the raw material roll 27 (supply tape) arrange|positioned at the supply position. When the loading amount of the tape for supply becomes below a predetermined amount, the unwinding of the tape from the raw material roller 27 at the supply position is temporarily stopped. The operation of TS is to carry out automatic exchange with TS (step S7). After confirming that the loading amount of the supply tape is more than a predetermined amount by using various sensors, etc., the above-mentioned operations are repeated in sequence.

<explanation of exchange process of band>

Here, the process of automatically switching with TS in step S7 will be described. The tape exchange process of step S7 is performed along with the processes from step S7-1 to step S7-6 shown in the flowchart of FIG. 7(b). Through the process shown in FIG. 7( b ), a new raw material roll 27 loaded with a sufficient amount of tape TS is arranged at the supply position of the tape supply unit 17 . Next, the front end of the subsequent (upstream side) adhesive tape T fed out from the new raw material roll 27 and the rear end of the preceding (downstream side) adhesive tape T fed out from the raw material roll 27 before replacement are automatically switched. ground joint. Also, the rear end of the preceding separation strip S and the front end of the following separation strip S are automatically joined.

In addition, in this embodiment, the bobbin 25A and the raw material roll 27A are initially arranged at the supply position of the tape supply unit 17, and the raw material roll 27A whose loading amount is less than a predetermined value is replaced with a new raw material roll 27A in step S7. The case of the material roll 27B will be described as an example. Each structure of the adhesive tape splicing apparatus 3 at the time when the loading amount of the original material roll 27A becomes below a predetermined value and step S7 is started is as shown in FIG. 11 .

When describing step S7, each configuration of the tape TS unwound from the raw material roll (the raw material roll 27A in this embodiment) arranged at the supply position before replacement is referred to as leading tape TS1, leading adhesive tape T1, Advance isolation zone S1. Then, each structure of the tape TS discharged from the new raw material roll (the original material roll 27B in this embodiment) arranged at the supply position after exchange is These components are called the follow-up zone TS2, the follow-up adhesive zone T2, and the follow-up isolation zone S2 to distinguish them from the components of the preceding zone TS1.

At the start of step S7, the initial arrangement of each component in the adhesive tape joining device 3 will be described. First, the configuration of the portion indicated by symbol D1 in FIG. 11 will be described. The preceding adhesive tape holding member 19 moves toward the approaching position, and approaches the adhesive tape holding member 41A. The spliced tape holding member 43A at the feeding position is moved to the splicing preparation position. By being arranged at the joint preparation position, the adhesive tape holding member 41A and the holding surface face each other so that the adhesive tape holding member 43A sandwiches the adhesive tape T1.

Next, the structure of the part shown by the code|symbol D2 is demonstrated. The spliced tape holding member 43B in the standby position moves to the cutting preparation position. By moving to the cutting preparation position, the holding surface of the tape holding member 43B (the surface holding the adhesive tape T) becomes flush with the holding surface of the adhesive tape holding member 41B.

Also, when step S7 is started, the follow-up tape TS2 arranged at the standby position is constructed in advance as follows. As indicated by a symbol D2 in FIG. 11 , the follow-up tape TS2 which is an adhesive tape with a spacer tape is fed out from the raw material roll 27B arranged at the standby position. The released follow-up tape TS2 is peeled into the follow-up adhesive tape T2 and the follow-up separator tape S2 by the separator tape peeling part 31B, and the adhesive layer C of the follow-up adhesive tape T2 is exposed.

The subsequent separator tape S2 is wound around the feed roller 35B and guided toward the holding surface of the separator tape holding member 36B. The front end portion of the subsequent separator S2 is sucked and held by the separator holding member 36B. The subsequent adhesive tape T2 is wound around the guide roller 34B, and moves toward the side of the adhesive tape holding member 41B. The holding surface and the holding surface of the joint belt holding member 43B are guided. The leading end portion of the subsequent adhesive tape T2 is suction-held by the bonding tape holding member 43B, and the portion upstream of the leading end portion is suction-holding by the adhesive tape holding member 41B.

The holding surface of the joint tape holding member 43B disposed at the cutting preparation position is flush with the holding surface of the adhesive tape holding member 41B. Therefore, the tension of the entire subsequent adhesive tape T2 is maintained, and the adhesive tape holding member 41B and the joint tape holding member 43B can hold the subsequent adhesive tape T2 stably on the entire surface of the holding surface. In addition, although the operation of winding the subsequent adhesive tape T2 and holding it on the joint tape holding member 43B and the operation of winding the subsequent separator tape S2 and holding it on the tape holding member 36B in Example 1 are performed manually, respectively, Automation is also performed under the control of the control unit 81 . The initial arrangement of various components before the start of step S7 is as described above.

Step S7-1 (cutting of leading belt)

In the exchange process of the belt, the leading belt is cut first. That is, in the adhesive tape splicing device 3, the preceding adhesive tape T1 is cut by the cutter unit 45 (the cutter unit 45A in this embodiment) arranged at the supply position, and the separator tape splicing unit 21 includes The cutter unit 49 cuts the preceding barrier S1.

The cutting position of the preceding adhesive tape T1 by the cutter unit 45A is shown by symbol D1 in FIG. First, the operation of cutting the preceding adhesive tape T1 will be described using each diagram of FIG. 12 .

Fig.12 (a) has shown the state of 33 A of joining tape preparation parts before performing cutting|disconnection of the preceding adhesive tape T1. The leading adhesive tape holding member 19 is displaced in advance from the retracted position shown by the dotted line toward the approaching position shown by the solid line to approach the adhesive tape holding member 41A. Furthermore, the preceding adhesive tape holding member 19 and the adhesive tape holding member 41A absorb and hold the preceding adhesive tape T1 , respectively. Also, the cutter unit 45A is located at an initial position (position M1 indicated by a dotted line in FIG. 12( d )) deviated from the adhesive tape T1.

When the cutting of the preceding adhesive tape T1 starts, the movable table 46A of the cutter unit 45A is driven in the direction R, and the cutter unit 45A is moved from the initial position to the cutting preparation position as shown in FIG. In FIG. 12( b ), the blade 48A moves toward the inner side of the preceding adhesive tape T1. In addition, the cutting preparation position of the cutter unit 45A corresponds to the position M2 shown by the two-dot chain line in FIG. 12( d ).

After the cutter unit 45A moves to the cutting preparation position, the movable table 46A is driven in the width direction (z direction) of the preceding adhesive tape T1. By this driving, the cutter unit 45A at the cutting preparation position moves toward the cutting completion position shown by the solid line in FIG. 12( d ). With this movement, the blade 48A cuts the preceding adhesive tape T1 across the width direction at a predetermined position between the preceding adhesive tape holding member 19 and the adhesive tape holding member 41A ( FIG. 12( c )). After the cutting is completed, the cutter unit 45A returns to the initial position from the cutting completed position.

The preceding adhesive tape T1 is cut by the cutter unit 45A, and the downstream side (T1f) of the preceding adhesive tape T1 is cut off from the original material roll 27A. After this cutting, the rear end portion of the preceding adhesive tape T1f cut off from the raw material roll 27A is sucked and held by the preceding adhesive tape holding member 19 . and still with the original The front end portion of the upstream side ( T1r ) of the preceding adhesive tape T1 connected to the material roll 27A is sucked and held by the adhesive tape holding member 41A.

By performing each suction holding, the position of the preceding adhesive tape T1 can be stably maintained even after cutting by the cutter unit 45A. Moreover, when cutting the preceding adhesive tape T1, the preceding adhesive tape holding member 19 is moved to an approach position, and it approaches the adhesive tape holding member 41A. Therefore, it is possible to avoid a reduction in cutting accuracy of the preceding adhesive tape T1 due to bending of the preceding adhesive tape T1 between the preceding adhesive tape holding member 19 and the adhesive tape holding member 41A.

Next, the operation of cutting the preceding separator S1 will be described using each diagram in FIG. 13 . Fig. 13(a) shows the state of each structure before the cutting of the preceding separation zone S1 is performed. The leading median holding member 47 is located at an initial position, is arranged at a position close to the downstream side of the median holding member 36A, and faces the median holding member 36A across the leading median S1. Further, the preceding median strip holding member 47 and the median strip holding member 36A respectively suck and hold the preceding median strip S1. In addition, the cutter unit 49 is at an initial position separated from the preceding barrier S1.

When the cutting of the preceding isolation belt S1 starts, the movable table 51 of the cutter unit 49 is driven in the direction R, and the cutter unit 49 is moved from the initial position to the cutting preparation position as shown in FIG. In Fig. 13(b), the blade 53 moves toward the inner side of the preceding separation zone S1.

After the cutter unit 49 moves to the cutting preparation position, the movable table 51 is driven in the width direction (z direction) of the preceding separation belt S1. By this driving, the cutter unit 49 at the cutting preparation position moves from the rear side toward the front side, and moves toward the cutting completion position. Along with this movement, the blade 53 is tied to At a predetermined position between the preceding tape holding member 47 and the tape holding member 36A, the leading tape S1 is cut across the width direction ( FIG. 13( c )). After the cutting is completed, the cutter unit 49 returns to the initial position from the cutting completed position.

The preceding barrier S1 is cut by the cutter unit 49, and the downstream side (S1f) of the preceding barrier S1 is cut off from the raw material roll 27A. After this cutting, the rear end portion of the preceding separator S1f separated from the raw material roll 27A is sucked and held by the preceding separator holding member 47 .

Then, the front end portion on the upstream side (preceding separator S1r) of the preceding separator S1 still connected to the raw material roll 27A is sucked and held by the separator holding member 36A. By carrying out each suction holding, the position of the preceding separator S1 can be stably maintained even after cutting by the cutter unit 49 . The process of step S7-1 is completed by cutting the preceding adhesive tape T1 and the preceding separating tape S1 respectively and cutting them off from the raw material roll 27A.

Step S7-2 (creation of joint tape)

Through the process of step S7-1, after the downstream side of each of the preceding adhesive tape T1 and the preceding separator tape S1 is cut off from the raw material roll 27A, the process of making the joining tape of step S7-2 is performed. A feature of the present invention is that a part of the adhesive tape T for sticking to the workpiece (wafer W in this embodiment) is used as a bonding tape CT which is an adhesive tape sheet for bonding.

In this embodiment, a part of the front end of the subsequent adhesive tape T2 is cut using the cutter unit 45 (in this embodiment, the cutter unit 45B) arranged at the standby position, and the cut and fragmented front end part is used as the spliced tape CT. use. Specifically, the joining zone is formed at the location indicated by the symbol D2 in FIG. 11 .

The process of creating the spliced tape CT will be described using the diagrams in FIG. 14 . Fig.14 (a) has shown the state of each structure before performing the cutting|disconnection of the following adhesive tape T2. The spliced tape holding member 43B moves to the cutting preparation position. That is, the spliced tape holding member 43B is disposed near the downstream side of the adhesive tape holding member 41B, and sucks and holds the leading end portion of the following adhesive tape T2. The cutter unit 45B is arranged at an initial position, that is, a position away from the subsequent adhesive tape T2.

When cutting of the subsequent adhesive tape T2 starts, the movable table 46B of the cutter unit 45B is driven in the direction R, and the cutter unit 45B is moved from the initial position to the cutting preparation position. After the cutter unit 49 moves to the cutting preparation position, the movable table 46B drives the cutter unit 45B in the width direction (z direction) of the subsequent adhesive tape T2. By this driving, the cutter unit 49 moves from the cutting preparation position to the cutting completion position, and cuts the subsequent adhesive tape T2 across the width direction at a predetermined position between the adhesive tape holding member 41B and the joint tape holding member 43B ( Figure 14(b)).

The subsequent adhesive tape T2 is cut by the cutter unit 45B, so that the front end portion of the subsequent adhesive tape T2 is cut off from the raw material roll 27B. After this cutting, the front end portion separated from the raw material roll 27B is sucked and held by the bonded tape holding member 43B as the bonded tape CT. Then, the leading end portion of the subsequent adhesive tape T2 newly formed by the cutting is sucked and held by the adhesive tape holding member 41B.

After the cutting is completed, the cutter unit 45B returns to the initial position from the cutting completed position. In this way, the process of step S7 - 2 is completed by forming the joint tape CT by the joint tape forming part 33B disposed at the standby position among the joint tape forming parts 33 . In the work of step S7-1 and step S7-2 The schematic configuration of the adhesive tape joining device 3 in the state of completion of the process is shown in FIG. 14(c).

Step S7-3 (displacement of joint belt)

After the front end portion of the subsequent adhesive tape T2 is cut to complete the joint tape, the joint tape is displaced. That is, through the supply unit 18 at the standby position, the joint tape holding member 43B holding the joint tape CT is appropriately moved so that the adhesive layer C of the joint tape CT and the adhesive layer C at the front end portion of the subsequent adhesive tape T2 face each other. The way of the positional relationship makes the bonding tape CT reversed.

The process of displacing the joint belt CT in this embodiment is carried out as follows. After the bonding tape CT is produced, as shown in FIG. 15( a ), the adhesive layer C of the bonding tape CT and the adhesive layer C of the front end portion of the subsequent adhesive tape T2 face the same direction. In this state, the spliced belt holding member 43B is appropriately moved in parallel on the xy plane while reversely moving around the axis in the z direction using a driving device not shown.

Through this movement, the spliced tape holding member 43B moves from the cutting preparation position indicated by the dotted line in FIG. 15( b ) to the splicing preparation position indicated by the solid line in the same figure. The joint tape holding member 43B is moved toward the joint preparation position, and the joint tape CT is reversed so that the adhesive layer C of the joint tape CT held by the joint tape holding member 43B and the subsequent adhesive tape held by the adhesive tape holding member 41B are separated. The adhesive layer C of the front-end part of T2 becomes the positional relationship which faces each other. In addition, as long as the adhesive layer C of the joint tape CT can face the adhesive layer C at the front end portion of the subsequent adhesive tape T2, the moving locus of the joint tape holding member 43B is not limited by the configuration of this embodiment.

In addition, it is preferable to retract the preceding adhesive tape holding member 19 in the joint tape forming part 33A in synchronization with the process of reversing the joint tape CT in the joint tape forming part 33B. At the time when the joint belt CT is created, the leading belt holding member 19 is moving to the approaching position ( FIG. 15( c )). That is, the preceding adhesive tape holding member 19 is arranged in the vicinity of the downstream of the adhesive tape holding member 41A.

In this state, the leading adhesive tape holding member 19 is moved downstream in the direction in which the adhesive tape T is fed out by using a drive device not shown. Through this movement, the preceding adhesive tape holding member 19 retracts from the approaching position indicated by the dotted line in FIG. The location moves.

The retracted position of the leading adhesive tape holding member 19 is preferably a position that does not overlap the rotary plate 23 in a front view of the adhesive tape joining device 3 . By moving the row adhesive tape holding member 19 toward the retracted position in advance, in the process of rotating the rotating plate 23 described later, it is possible to reliably avoid the construction of the partition holding member 36 connected to the rotating plate 23 and the preceding adhesive tape. A situation where the retaining member 19 interferes.

Similarly, for the purpose of avoiding the situation where the barrier joint unit 21 interferes with other structures, the barrier joint unit 21 is retracted to the front view while maintaining the state in which the rear end portion of the preceding barrier S1f is sucked and held. Among them, a position that does not overlap with the rotating plate 23 is more preferable. The configuration of the adhesive tape splicing device 3 at the time when the inversion of the spliced tape CT, retraction of the preceding adhesive tape holding member 19, and retraction of the spacer tape splicing unit 21 is completed is shown in FIG. 16( a ). After the displacement of the joint belt CT is completed, the engineering of step S7-3 is completed.

Step S7-4 (Switching of raw material rolls)

After the bonding belt CT is reversed, the material rolls are switched. That is, the rotary plate 23 of the tape supply unit 17 is rotated appropriately to switch the raw material roll 27 arranged at the supply position. Through the rotation of the rotating plate 23, the original material roll 27 arranged at the supply position is switched from the original material roll 27A (FIG. 16(a)) in which the loading amount of the tape TS is reduced to a predetermined value or less, to the one loaded with a sufficient amount of the tape TS. The raw material roll 27B (Fig. 16(b)).

Moreover, by the rotation of the turntable 23, each structure connected to the turntable 23 is also displaced together with the turntable 23. That is, each structure of the first supply unit 18A arranged at the supply position is rotated and displaced about 180° around the rotation shaft 39, and moves from the supply position to the standby position. On the other hand, each structure of the 2nd supply unit 18B arrange|positioned at a standby position moves toward a supply position from a standby position.

As a result, the succeeding adhesive tape T2 held by the adhesive tape holding member 41B and the joint tape CT held by the joint tape holding member 43B move synchronously from the standby position to the supply position while maintaining the state where the respective adhesive layers C face each other. . On the one hand, the positions of the preceding adhesive tape holding member 19 and the separator joining unit 21 which are not connected to the turntable 23 are not affected by the rotation of the turntable 23 .

Therefore, by rotating the rotating plate 23 to switch the operation of the original material roller 27, the subsequent adhesive tape T2 and the joint tape CT moving to the supply position are directed toward the rear end portion of the preceding adhesive tape T1f held by the preceding adhesive tape holding member 19. moving nearby (Fig. 16(b)). Also, the subsequent isolation The spacer tape holding member 36B, in which the tape S2 is sucked and held, also moves from the standby position to the supply position.

As a result, the following separation strip S2 moves toward the vicinity of the rear end portion of the preceding separation strip S1f held by the preceding separation strip holding member 47 by suction. By rotating the rotary plate 23 to switch the supply unit 18 at the supply position, the process of step S7-4 is completed. In addition, the order of the process of step S7-3 and the process of step S7-4 may be switched appropriately, and may be performed simultaneously.

Step S7-5 (joining of adhesive tape)

After the switching of the material rolls is completed, the bonding of the adhesive tape is carried out. That is, in the joint tape forming part 33 (at this point, the joint tape forming part 33B) arranged at the supply position, the rear end portion of the preceding adhesive tape T1f and the front end portion of the following adhesive tape T2 are passed through the joint tape CT to make them Engagement operations.

The process of step S7-5 is demonstrated using each figure of FIG. First, as shown in FIG. 17( a ), the preceding adhesive tape holding member 19 evacuated to the evacuated position is moved to the approaching position. That is, the preceding adhesive tape holding member 19 moves from the withdrawn position shown by the dotted line toward the approaching position shown by the solid line along the releasing direction of the adhesive tape T while holding the rear end of the leading adhesive tape T1f. As a result, the rear end of the preceding adhesive tape T1f and the succeeding adhesive tape T2 are in a state close to being able to be joined through the joining tape CT.

After bringing the rear end of the preceding adhesive tape T1f close to the succeeding adhesive tape T2, the adhesive tape T is joined using the joining tape CT. that is As shown in FIG. 17( b ), the splicing tape holding member 43B is moved in the direction R from the splicing preparation position shown by the dotted line toward the splicing execution position shown by the solid line. Through this movement, the bonding tape CT is pressed against the rear end of the preceding adhesive tape T1f and the following adhesive tape T2. By this pressing, joining of the preceding adhesive tape T1 and the following adhesive tape T2 is performed. That is, the rear end of the preceding adhesive tape T1f and the front end of the following adhesive tape T2 are connected through the joint tape CT, and it becomes a continuous elongate shape.

The rear end of the preceding adhesive tape T1f is supported by the preceding adhesive tape holding member 19, and the following adhesive tape T2 is supported by the adhesive tape holding member 41B. Furthermore, the holding surface of the preceding adhesive tape holding member 19 and the holding surface of the adhesive tape holding member 41B are the same plane. Therefore, a uniform and strong pressing force can act between the bonding tape CT, the preceding adhesive tape T1f, and the following adhesive tape T2.

In the bonding process of the adhesive tape of this embodiment, the rear end of the preceding adhesive tape T1f and each adhesive layer C of the following adhesive tape T2 and the adhesive layer C of the bonding tape CT are in a positional relationship facing each other. That is, when the bonding tape CT is pressed toward each adhesive tape T, the adhesive layer C of the bonding tape CT is bonded to the rear end of the preceding adhesive tape T1f and each adhesive layer C of the following adhesive tape T2. In other words, since one adhesive layer C is not in contact with the other substrate B (non-adhesive surface) but the adhesive layers C are attached to each other, the adhesive force between the joint tape CT and the rear end of the preceding adhesive tape T1f and the subsequent adhesive tape T2 become stronger. Therefore, the preceding adhesive tape T1 and the succeeding adhesive tape T2 can be joined more firmly.

After the joining of the preceding adhesive tape T1f and the subsequent adhesive tape T2 with the joining tape CT is completed, the use of the joining tape holding member 43B is released. Adsorption and retention of joint tape CT. Then, as shown in FIG. 17( c ), the splicing tape holding member 43B is returned from the splicing performing position to the splicing preparation position ( FIG. 19( b ), arrow N1 ).

Accompanying this return, the suction holding of the subsequent adhesive tape T2 by the adhesive tape holding member 41B and the suction holding of the preceding adhesive tape T1f by the preceding adhesive tape holding member 19 are respectively released. The preceding adhesive tape T1f and the succeeding adhesive tape T2 which are joined by the joining tape CT and become a continuous belt can be released toward the direction L by releasing the suction holding of each.

Step S7-6 (Joining of barrier tape)

At the same time as the bonding process of the adhesive tape, the bonding process of the isolation tape is carried out. That is, the rear end portion of the preceding separator S1f is joined to the front end portion of the following separator S2 by the separator holding member 36B moving toward the supply position in cooperation with the separator joining unit.

The process of step S7-6 is demonstrated using each figure of FIG. First, as shown in FIG. 18( a ), the barrier joining unit 21 retracted toward the retracted position is moved. That is, the leading median strip holding member 47 moves from the retracted position shown by the dotted line to the joint preparation position shown by the solid line along the releasing direction of the median strip S while holding the rear end of the leading median strip S1f. As a result, the rear end of the preceding separation strip S1f and the front end of the following separation strip S2 are in a positional relationship facing each other.

After the rear end of the preceding separator S1f is brought close to the subsequent separator S2, the separator S is joined by heating. That is, as shown in FIG. 18( b), the leading partition holding member 47 is ready for joining from the dotted line. The position moves in the direction R toward the joining execution position shown by the solid line. Through this movement, the rear end of the preceding separation strip S1f is pressed against the front end of the following separation strip S2.

Moreover, when the preceding median strip holding member 47 is moved, the heater 50 built in the leading median strip holding member 47 heats the rear end of the leading median strip S1f. By this heating and pressing, the rear end of the preceding separator S1f and the front end of the following separator S2 are bonded by thermal bonding, and form a continuous elongated shape. In addition, at this time, it is more preferable that a heater is also built in the separator holding member 36B, and the leading end side of the following separator S2 is also heated by this heater.

After the rear end of the preceding separation strip S1f is joined to the front end of the following separation strip S2, the suction holding of the preceding separation strip S1f by the preceding separation strip holding member 47 is released. Then, as shown in FIG. 18(c), the leading median holding member 47 is returned to the initial position (FIG. 19(b), arrow N2).

Accompanying this return, the suction holding of the subsequent separator tape S2 by the separator tape holding member 36B is released. The preceding separator S1f and the following separator S2 joined by thermocompression bonding and formed into a continuous belt can be released in the direction L by releasing the adsorption and holding of each. Also, the spliced tape holding member 43A moved to the standby position returns from the splicing ready position to the cutting ready position ( FIG. 19( b ), arrow N3 ).

The timing of the adhesive tape joining process of step S7-5 and the insulating tape joining process of step S7-6 can be appropriately adjusted before and after, and can also be performed synchronously. The configuration of the adhesive tape joining device 3 in the state of being pressed in steps S7-5 and S7-6 is as shown in Figure 19(a) shown. Then it is completed according to step S7-5 and step S7-6, and the composition of the adhesive tape joining device 3 is as shown in Fig. 19(b).

When steps S7-5 and S7-6 are completed, the tape TS2 loaded on the raw material roll 27B newly moved to the supply position is joined with each of the preceding adhesive tape T1f and the preceding separator tape S1f to form a continuous tape. shape. As a result, the tape TS2 is unwound, and the operation of attaching the adhesive tape T to the wafer can be restarted. Through each process from step S7-1 to step S7-6, the raw material roll 27 is automatically exchanged, and a series of processes of automatically joining each of the adhesive tape T and the separator tape S are completed.

In addition, the raw material roll 27A switched from the supply position to the standby position can be taken out to the outside of the adhesive tape sticking apparatus 1 through the opening and closing door 91 . Then, a new material roll 27 filled with a sufficient amount of tape TS can be loaded to the bobbin 25A in the standby position.

<Effect of the configuration of Embodiment 1>

Conventionally, as a method of automatically joining the preceding first tape P and the succeeding second tape P, the following configurations can be cited. That is, in addition to the respective tapes P, the third tape Q as an adhesive tape for joining is prepared in advance, and the tape Q is attached so as to connect the first tape P and the second tape P.

As a result, in general, the cross section of the joining portion has a structure as shown in FIG. 20(a) when the tape Q has an adhesive layer Ca on only one side, and when the tape Q has an adhesive layer Ca on both sides. A structure as shown in Fig. 20(b) is obtained. Such a conventional joining method may have the following problems.

First, as shown in each figure of FIG. 20 , the adhesive layer Ca of the tape Q bonds the tapes P to each other by contacting the layer of the base material B or the layer of the separator tape S in the tape P. That is, in the conventional method, the tape Q for joining is attached to the non-adhesive surface of the tape P which is the joining object. At this time, only the adhesive force of the adhesive layer Ca with Q is affected on the adhesive force in the joint portion, so the adhesive force in the joint portion becomes weak. Therefore, the tape Q is likely to be peeled off from the tape P, and there is a concern that the joining failure may occur.

Second, the tape Q for bonding is a prepared tape different from the tape P actually attached to the wafer. Therefore, the tape P for wafer protection and the tape Q for bonding may differ in the material or property of the structure. Therefore, it is conceivable that the adhesive layer Ca of the tape Q for joining and the substrate B of the tape P for circuit protection (or the separator tape S of the tape P) are not easily bonded to each other. In this way, in the case of a combination with poor bonding affinity, since the bonding force between the tape Q and the tape P becomes weaker, the occurrence of bonding failure occurs more remarkably.

Furthermore, in addition to the tape P which is the main material, it is necessary to prepare the tape Q which is the sub-material, so that it is complicated to prepare a plurality of types of tapes. In addition, since it is necessary to rearrange the belt splicing device such as a configuration for supplying the tape Q to the joint between the belts P, the belt splicing device tends to be enlarged and it becomes difficult to suppress the cost.

Furthermore, in the conventional configuration, as shown in FIG. 20( b ), when the tapes Q for bonding are sandwiched and bonded so that the tapes P are laminated, the thickness J at the bonded portion becomes thicker. That is, since the joining part is relatively thick compared with other than the joining part, when the joined tape P is wound up and collected, the thick part may hang on the bobbin or the like. as a result, There is concern that the shape of the coil will be deformed, the coiling efficiency will be reduced, or the coiling failure will occur. The thickness J in the joined portion becomes more remarkably thicker when the tapes P in the state where the separator tape S is added are joined together.

Furthermore, when the tapes P are joined so that they are stacked, the track (height, etc.) of the preceding tape P is different from that of the following tape P before and after the joint ( FIG. 20( b )). Therefore, in particular, in the vicinity of the bonding portion, misalignment occurs between the track from which the preceding tape P is released and the track from which the subsequent tape P is released, and there is also concern about each operation such as the operation of attaching the tape P to the wafer W. In case of reduced accuracy. The displacement of the front and rear rails of such a joint portion becomes larger in proportion to the thickness J.

On the one hand, in the adhesive tape joining device 3 of this embodiment, when the adhesive tapes T are joined together, that is, when the preceding adhesive tape T1 and the following adhesive tape T2 are joined, a part of the following adhesive tape T2 is cut in advance. . Then, this cut-out portion is used as a splicing tape CT belonging to an adhesive tape for splicing. In this case, there is no need to provide a configuration in which a bonding tape CT different from the adhesive tape T is loaded in advance, or a large-scale configuration in which the bonding tape CT is supplied to the bonding portion. Therefore, size reduction or cost reduction of the adhesive tape joining device 3 becomes easy.

In addition, in the present example, the bonding tape CT has exactly the same structure and properties as the adhesive tape T1 and the adhesive tape T2 which are bonding objects. Therefore, the poor bonding affinity between each adhesive tape T and junctional tape CT is reliably avoided. Therefore, the bonding force of the bonding tape CT can be improved.

Furthermore, in this embodiment, in the case of joining the preceding tape and the following tape, the preceding tapes that are on the same surface and are close to parallel Each of the adhesive layer C of the tape T1 and the adhesive surface C of the subsequent adhesive tape T2 is joined by pressing the adhesive tape CT against the adhesive tape T in a state where the adhesive layer C of the adhesive tape CT faces each other. That is, as shown in FIG. 20(c), at the time of bonding, the adhesive surfaces C are in contact with each other.

In this way, the bonding is carried out through the contact of the adhesive layers C, and the adhesive force of the joint part not only has the adhesive force possessed by the adhesive layer C of the bonding tape CT, but also affects the adhesive force possessed by the adhesive layer C of the adhesive tape T which is the bonding object. Therefore, the adhesive force at the joint portion can be further improved, so that joint failure can be more reliably avoided. Moreover, the adhesive layer C of the preceding adhesive tape T1 and the adhesive surface C of the succeeding adhesive tape T2 run in parallel on the same plane. Therefore, it is possible to avoid misalignment between the track for feeding out the preceding adhesive tape T1 and the track for feeding out the subsequent adhesive tape T2 before and after the joining portion.

In addition, in this embodiment, instead of joining the tapes TS with the spacer tape added thereto, the tape TS is peeled off into the adhesive tape T and the spacer tape S, and then the joining of the adhesive tapes T and the spacer tape are performed separately. S join each other. Therefore, especially in the case where the adhesive tapes T are joined with the joining tape CT, the thickness J of the joined portion becomes thinner than the conventional method ( FIG. 20( c )).

Therefore, even in the case of winding up and recovering the joined portion, the influence on the device components can be reduced. In addition, since the bonding tape CT is produced after peeling off the adhesive tape T and the separator tape S to expose the adhesive layer C, it is possible to make the bonded tape CT without performing complicated processes such as peeling the separator tape S from the fragmented bonding tape CT. The adhesive layer C with CT and the adhesive layer C of the adhesive tape T face each other to facilitate the movement of various holding members.

[Example 2]

Next, Embodiment 2 of the present invention will be described. In Example 1, when joining the preceding adhesive tape T1 and the following adhesive tape T2, the structure which used part of the following adhesive tape T2 as the joining tape CT for joining adhesive tape T was demonstrated as an example. In Example 2, the structure which uses a part of the preceding adhesive tape T1 as the joining tape CT for joining of adhesive tapes T is demonstrated as an example. In addition, the adhesive tape sticking apparatus of Example 2 and the apparatus of Example 1 are basically the same in structure. Therefore, the same code|symbol is attached|subjected to the same structure as the adhesive tape sticking apparatus of Example 1, and it demonstrates in detail about a different structural part.

In the adhesive tape splicing device 3 according to the first embodiment, the splicing tape forming part 33 is provided on each of the supply units 18 and is configured to be connected to the rotating plate 23 . Furthermore, each of the spliced tape forming units 33A and 33B is configured so that the supply position and the standby position are mutually switched in accordance with the rotation of the turntable 23 . On the other hand, in the adhesive tape splicing device 3 a of the second embodiment, the splicing tape forming part 61 is provided independently from the supply unit 18 , and is different from the first embodiment in that it is not connected to the rotary plate 23 . The joint tape forming part 61 of the second embodiment does not matter the number of the supply units 18, and it is only necessary to provide at least one of them.

The joint tape forming unit 61 of the second embodiment is disposed downstream of the adhesive tape holding member 41 (adhesive tape holding member 41A in FIG. 21 ) that is moving toward the supply position. The joining tape forming part 61 reciprocates in the feeding direction L of the adhesive tape T between the approaching position and the withdrawn position similarly to the preceding adhesive tape holding member 19 .

When the joint tape forming part 61 moves to the close position, the joint tape forming part 61 is arranged in the vicinity of the downstream of the adhesive tape holding member 41A that is moving toward the supply position. When the joint tape forming unit 61 moves to the retracted position, the joint tape forming unit 61 is arranged at a position where interference with each configuration of the tape supply unit 17 can be avoided. As an example of the retracted position, similar to the preceding adhesive tape holding member 19 in each embodiment, a position that does not overlap with the rotary table 23 in a front view is preferable.

The joint tape forming unit 61 of the second embodiment includes a joint tape holding member 63 and a cutter unit 65 . The spliced tape holding member 63 is the same as in the first embodiment, and is configured such that the cutting preparation position, the splicing preparation position, and the splicing execution position are mutually movable. The cutting preparation position of the joint tape holding member 63 corresponds to the downstream of the adhesive tape holding member 41 which is moving to the supply position. When the joint tape holding member 63 moves to the cutting preparation position, it is configured so that the adhesive tape T can be held on the holding surface. The positional relationship between the cutting preparation position, the joining preparation position and the joining execution position is the same as that of the first embodiment.

The cutter unit 65 includes a movable table 67 and a blade 68 . The respective configurations of the movable table 67 and the blade 68 are the same as those of the movable table 46 and the blade 48 in the first embodiment, and thus detailed description thereof will be omitted. The bonding tape holding member 63 has a function of holding a part of the preceding adhesive tape T1 cut by the cutter unit 65 as the bonding tape CT, and pressing the bonding tape CT against the bonding portion of the bonding tapes T to bond.

<Explanation of the exchange process of the belt of Example 2>

Here, each process of step S7 of Example 2 is demonstrated. The outline of the flowchart of step S7 in the second embodiment is the same as that in the first embodiment, as shown in FIG. 7( b ). Then, the part which differs from Example 1 among each process of step S7 of Example 2 is demonstrated.

When step S7 is started, the initial arrangement of each component in the adhesive tape joining device 3 is as shown in FIG. 21 . That is, the joining tape forming part 61 and the preceding adhesive tape holding member 19 are moving to the approaching position. The spliced tape holding member 63 is arranged at the cutting preparation position. At this time, the joining tape holding member 63 is arranged in the vicinity of the downstream of the adhesive tape holding member 41A moving to the supply position, and the preceding adhesive tape holding member 19 is arranged in the vicinity of the downstream of the joining tape holding member 63 . Furthermore, the adhesive tape holding member 41A, the joint tape holding member 63 , and the preceding adhesive tape holding member 19 each absorb and hold the preceding adhesive tape T1 .

Also, the initial state of the subsequent tape TS2 is as follows. That is, as shown by symbol D4 in FIG. 21 , the follow-up tape TS2 is unwound in advance from the raw material roll 27B arranged at the standby position, and is peeled into a follow-up adhesive tape T2 and a follow-up separator tape S2 by the separator tape peeling portion 31B. Then, the front end portion of the subsequent adhesive tape T2 is sucked and held by the adhesive tape holding member 41B, and the front end portion of the following separator tape S2 is sucked and held by the insulating tape holding member 36B. At the start of step S7 in the second embodiment, each configuration is previously operated as above.

Step S7-1 (cutting of leading belt)

When step S7 is started, the leading tape is cut first. That is, in the adhesive tape splicing device 3, the cutter unit 65 is used to cut the pre-adhesive The tape T1 and the preceding separator tape S1 are cut by the cutter unit 49 . The configuration around the joining zone forming portion 61 and the barrier joining unit 21 at the start of step S7-1 is as shown in FIG. 22(a).

In this state, as shown in FIG. 22( b ), the cutter unit 65 is appropriately moved from the initial position shown by the dotted line to the first cutting execution position shown by the solid line. By this movement, the cutter unit 65 cuts the preceding adhesive tape T1 in the width direction at a predetermined position between the preceding adhesive tape holding member 19 and the joint tape holding member 63 ( FIG. 22( b ), arrow W1 ).

By this cutting, the downstream side (T1f) of the preceding adhesive tape T1 is cut|disconnected from the raw material roll 27A which exists in a supply position. The rear end portion of the preceding adhesive tape T1f cut off from the raw material roll 27A is sucked and held by the preceding adhesive tape holding member 19 . Next, the leading end portion of the upstream side ( T1r ) of the preceding adhesive tape T1 still connected to the raw material roll 27A is sucked and held by the bonding tape holding member 63 and the adhesive tape holding member 41A.

Then cut off the leading adhesive tape T1, on the one hand, cut off the leading isolation tape S1. That is, the same as in Embodiment 1, the cutter unit 49 is located at a predetermined position between the leading median strip holding member 47 and the median strip holding member 36A, and cuts the leading median strip S1 across the width direction (FIG. 22(b) , arrow W2). The preceding barrier S1 is cut by the cutter unit 49, and the downstream side (S1f) of the preceding barrier S1 is cut off from the raw material roll 27A. The process of step S7-1 is completed by cutting the preceding adhesive tape T1 and the preceding separating tape S1 respectively and cutting them off from the raw material roll 27A.

Step S7-2 (creation of joint tape)

After the respective downstream sides of the preceding adhesive tape T1 and the preceding separator tape S1 are cut off from the raw material roll 27A, the process of preparing the spliced tape in step S7-2 is executed. In this embodiment, a part of the front end of the preceding adhesive tape T1r is cut out using the cutter unit 65, and a fragment of the cut out front end part is used as the splice tape CT.

Specifically, as shown in FIG. 23 , the cutter unit 65 is appropriately moved from the first cutting execution position to the second cutting execution position shown by the solid line. Through this movement, the cutter unit 65 is positioned at a predetermined position between the adhesive tape holding member 41A and the joint tape holding member 63, and cuts the preceding adhesive tape T1r in the width direction.

Through this cutting, the downstream side (tip portion) of the preceding adhesive tape T1r is cut off from the raw material roll 27A, and the joining tape CT which is the adhesive tape sheet for joining is produced. Then, the formed spliced tape CT is sucked and held by the spliced tape holding member 63 . Further, the upstream end portion of the preceding adhesive tape T1r still connected to the raw material roll 27A is sucked and held by the adhesive tape holding member 41A.

Step S7-3 (reversal of spliced belt)

After the joint tape is completed, the joint tape is reversed. That is, by appropriately moving the spliced tape holding member 63 holding the spliced tape CT from the cutting ready position toward the spliced ready position, the adhesive layer C of the spliced tape CT and the adhesive layer C at the leading end portion of the preceding adhesive tape T1r are aligned. In the opposite way, the joint belt CT is displaced (Fig. 24).

In addition, it is preferable to synchronize the process of reversing the joint tape CT in the joint tape forming part 61 so that the joint tape forming part 61 and The preceding adhesive tape holding member 19 and the separator tape joining unit 21 retreat from the tape supply unit 17 . As a specific example of the evacuation direction, the joining tape forming part 61 and the preceding adhesive tape holding member 19 are evacuated toward the downstream side along the release direction of the adhesive tape T, and the separator joining unit 21 is directed downstream along the release direction of the separator tape. retreat.

The retracted positions of the adhesive tape forming part 61 , the preceding adhesive tape holding member 19 and the isolation tape engaging unit 21 are preferably positions that do not overlap the rotary plate 23 in the front view of the adhesive tape engaging device 3 . Since the inversion of the splice tape CT is completed, the engineering of step S7-3 is completed. The composition of the adhesive tape joining device 3a at the point of completion is shown in Fig. 25(a).

Step S7-4 (Switching of raw material rolls)

After the bonding belt CT is reversed, the material rolls are switched. That is, the rotary plate 23 of the tape supply unit 17 is appropriately rotated to switch the raw material roll 27 arranged at the supply position. By the rotation of the rotary plate 23, the raw material roll 27 arranged at the supply position is switched from the raw material roll 27A (FIG. 25(a)) where the loading amount of the tape TS is reduced to a predetermined value or less, so that it is loaded with a sufficient amount. The raw material roll 27B with TS (FIG. 25(b)).

In addition, by the rotation of the turntable 23 , the components connected to the turntable 23 are also displaced together with the turntable 23 . Therefore, the subsequent adhesive tape T2 held by the adhesive tape holding member 41B moves from the standby position toward the supply position. On the one hand, the positions of the joining tape forming part 63 , the advanced adhesive tape holding member 19 and the isolation tape joining unit 21 which are not connected to the turntable 23 are not affected by the rotation of the turntable 23 .

As a result, the front end portion of the subsequent adhesive tape T2 moves toward the vicinity of the rear end portion of the preceding adhesive tape T1f held by the preceding adhesive tape holding member 19 and the joint tape CT held by the joint tape holding member 63 . By rotating the rotating plate 23 and switching the raw material roll 27 arranged at the supply position to another raw material roll 27, the process of step S7-4 is completed.

Step S7-5 (joining of adhesive tape)

After the switching of the material rolls is completed, the bonding of the adhesive tape is carried out. That is, as shown in FIG. 26( a ), the joint tape holding portion 61 and the preceding adhesive tape holding member 19 retracted toward the retracted position are moved toward the approaching position. That is, the preceding adhesive tape holding member 19 moves from the receding position indicated by the dotted line to the approaching position indicated by the solid line while holding the rear end of the preceding adhesive tape T1f. As a result, the rear end of the preceding adhesive tape T1f and the succeeding adhesive tape T2 are in a state close to being able to be joined through the joining tape CT.

After bringing the rear end of the preceding adhesive tape T1f close to the succeeding adhesive tape T2, the adhesive tape T is joined using the joining tape CT. That is, as shown in FIG. 26( b ), the splicing tape holding member 63 is moved from the splicing preparation position shown by the dotted line to the splicing execution position shown by the solid line. As the bonding tape holding member 63 moves in the R direction, the bonding tape CT is pressed against the rear end of the preceding adhesive tape T1f and the following adhesive tape T2. As a result, the rear end of the preceding adhesive tape T1f and the front end of the following adhesive tape T2 are bonded through the bonding tape CT to form a continuous elongated shape.

After the bonding of the preceding adhesive tape T1f and the following adhesive tape T2 is completed using the bonding tape CT, release the holding member using the bonding tape 63 Adsorption and retention of the bonding tape CT. Next, the splicing tape holding member 63 is returned from the splicing execution position to the splicing preparation position. Accompanying this return, the suction holding of the subsequent adhesive tape T2 by the adhesive tape holding member 41B and the suction holding of the preceding adhesive tape T1f by the preceding adhesive tape holding member 19 are respectively released. The preceding adhesive tape T1f and the succeeding adhesive tape T2 which are continuous and elongated by being joined by the joining tape CT can be released in the direction L by releasing the suction and holding of each.

Step S7-6 (Joining of barrier tape)

When performing the bonding process of the adhesive tape, the bonding process of the barrier tape is performed. That is, as shown in FIG. 26( a ), the barrier joining unit 21 retracted toward the retracted position is moved. The leading median holding member 47 moves from the retracted position shown by the dotted line to the joining preparation position shown by the solid line along the releasing direction of the median S1 while holding the rear end of the leading median S1f.

After making the rear end of the leading median S1f and the succeeding median S2 nearly face each other, as shown in FIG. The execution position moves in the direction R. Through this movement, the rear end of the preceding separation strip S1f is pressed against the front end of the following separation strip S2. Then, the leading separator tape S1f is heated by the heater 50 accompanying this pressing. By this heating and pressing, the rear end of the preceding separator S1f and the leading end of the following separator S2 are bonded by thermal bonding to form a continuous belt.

After the joint of the rear end of the leading separation strip S1f and the front end of the following separation strip S2 is completed, the use of the preceding separation strip holding member is released. The adsorption and holding of the preceding median strip S1f by 47 returns the preceding median strip holding member 47 to the initial position. Accompanying this return, the suction holding of the subsequent separator tape S2 by the separator tape holding member 36B is released. The continuous strip-shaped preceding separation zone S1f and subsequent separation zone S2 can be released in the direction L by releasing the respective suction and holding. Through the above process, each process of step S7 of embodiment 2 is completed.

With the tape splicing device of Example 2, each of the preceding adhesive tape T1f and the preceding separator tape S1f can be automatically joined to the tape TS2 loaded on the original material roll 27B. In Example 1, part of the subsequent adhesive tape T2 was used as the joining tape CT, but with the configuration of Example 2, a part of the preceding adhesive tape T1 can also be used as the joining tape CT. The preceding adhesive tape T1 is the same as the following adhesive tape T2, and it is the adhesive tape T actually used for a workpiece|work.

That is, the same as in Example 1, the composition of Example 2 is the same as that of the adhesive layer C of the bonding tape CT and the adhesive layer C of the adhesive tape T, so that the adhesive force of the bonding tape CT and the adhesive tape T can be avoided from being lowered. The situation of stripping. In addition, since the adhesive layer C of the joint tape CT and the adhesive layer C of the adhesive tape T are pressed and bonded in a state where they face each other, it is possible to realize the respective differences between the adhesive layer C of the joint tape CT and the adhesive layer C of the adhesive tape T. Stronger joint due to adhesion. Furthermore, in the second embodiment, regardless of the number of supply units 18, at least one bonding tape holding portion 61 is sufficient, so the configuration of the adhesive tape bonding device 3 can be simplified.

The present invention is not limited to the above-described embodiments, and may be modified and implemented as follows.

(1) In each embodiment, although a part of the adhesive tape T (a part of the raw material roll 27 ) used for attaching the wafer W has been described as a bonding tape, the present invention is not limited to only carrying out The constituted device. That is, it is also possible to make a configuration in which the first mode and the second mode are used together. In the first mode, a part of the adhesive tape T used in the process of attaching the wafer W is used as a bonding tape, and in the second mode, a part of the adhesive tape T used in the process of attaching the wafer W is used, and the second mode is used with the reel. Adhesive tapes F with different adhesive tapes T wound around the original material rolls 27 are supplied as spliced tapes.

First, the following cases can be exemplified regarding the situation of using the above-mentioned second mode. That is, as shown in FIG. 27( a ), when the surface of the wafer W has many bumps and other irregularities, an adhesive tape Tp with a thick base material B may be used as an adhesive tape for circuit protection.

At this time, applying the configurations of the respective embodiments, when cutting out a part of the adhesive tape Tp as the joint tape CT and joining the adhesive tapes Tp to each other, there is a possibility that the joint tape CT will be peeled off because the thickness of the tape in the joined portion will increase and the flexibility will decrease. However, a joint failure occurs. Therefore, when using the adhesive tape Tp whose base material B is thick, it is difficult to apply the structure which cuts off a part of the raw material roll 27 and uses it as the bonding tape CT. Such a situation also occurs when the highly rigid adhesive tape of the base material B is attached to the wafer W.

Hereinafter, an example of a configuration of a modified example in which two modes are used in combination will be described using drawings. As shown in FIG. 27(b), the adhesive tape splicing device 3b of the modified example is provided with a sensor 71, a mode determination unit 73, and a bonding tape supply unit in addition to the respective configurations of the adhesive tape splicing device 3 of the first embodiment. 75. In addition, the adhesive tape joining device 3b of the modified example may also be It is a configuration based on the adhesive tape splicing device 3 a of the second embodiment and includes a sensor 71 , a mode determination unit 73 , and a splicing tape supply unit 75 .

The sensor 71 detects the characteristic of the adhesive tape T loaded on the raw material roll 27 . As an example of the characteristic of the adhesive tape T, the thickness of the base material B, the rigidity of the base material B, etc. are mentioned. As the sensor 71, a well-known structure which detects the characteristic of the adhesive tape T, such as an optical sensor and a television camera, can also be utilized suitably.

The mode determination unit 73 receives information related to the characteristics of the adhesive tape T detected by the sensor 71, and determines which mode should be executed among the first mode and the second mode based on the information. That is, when there is no problem in using the adhesive tape T as the joining tape CT, the determination of the purpose of performing the joining of the adhesive tape T in the 1st mode is performed.

When it is determined that the purpose of executing the first mode is determined, the control unit 81 receives the information of the determination and collectively controls each component. Each configuration of the adhesive tape splicing device 3 is controlled by the control unit 81. According to the process described in each embodiment, a part of the adhesive tape T loaded on the raw material roll 27 is used as the splicing tape CT to perform bonding of the adhesive tape T. join.

On the other hand, when the adhesive tape T is not suitable for use as the splicing tape CT, the mode determination unit 73 performs a determination that the splicing of the adhesive tape T is performed in the second mode. At this time, the control part 81 receives the information of this determination, and controls each structure collectively. Each configuration of the adhesive tape joining device 3 performs joining of the adhesive tape T using the adhesive tape G supplied from the joining tape supply unit 75 under the control of the control unit 81 . As an example of the judgment criterion, when the thickness of the base material B of the adhesive tape T is detected to be 0.5 mm or more, the mode judging unit 73 judges that the second mode is suitable, and transmits information on the purpose of selecting the second mode to the control unit 81. .

The spliced tape supply unit 75 is provided with the tape supply part 77, the guide roller 78, and the cutter unit 79, as shown in FIG.28(a) etc. The tape supply unit 77 feeds out the adhesive tape F from a bobbin loaded with a raw material roll on which the adhesive tape F is wound, which is prepared separately from the adhesive tape T. It is preferable that the adhesive tape F is made of a thinner and less rigid material to form the base material B. Furthermore, it is preferable that the adhesive material contained in the adhesive layer C of the adhesive tape F is a material with strong adhesion to the adhesive layer C of the adhesive tape T. The thickness of the base material B of the adhesive tape F is more preferably 0.1 mm to 0.2 mm as an example.

The guide roller 78 winds and guides the adhesive tape F supplied from the tape supply unit 77 toward the spliced tape holding member 43 . The cutter unit 79 is the same as the cutter unit 45 and the like, and includes a movable portion and a blade, and cuts the adhesive tape F guided toward the joint tape holding member 43 in the width direction.

Hereinafter, each process of step S7 executed when the second mode is selected in the modified example will be described. Here, based on the process and equipment of the first embodiment, a modified example for performing the second mode will be described. The difference between step S7 in the second mode and step S7 in the first mode (each embodiment) is the following two points.

First, in step S7-1 in the modified example, the joining tape holding member 43 cuts the preceding adhesive tape T1 and the preceding separator tape S1 without holding the adhesive tape T. Second, in step S7-2 in the modified example, the joint tape F supplied from the joint tape supply unit 75 is held by the joint tape holding member 43, and a joint tape in which the adhesive tapes T are joined to each other is produced.

That is, the follow-up adhesive tape T2 in Example 1 becomes the state shown by the code|symbol D2 of FIG. 11 before step S7 starts. That is, the subsequent adhesive tape T2 supplied from the raw material roll 27B at the standby position It is guided toward the adhesive tape holding member 41B and the bonding tape holding member 43B, and is sucked and held by each holding member. On the other hand, the follow-up adhesive tape T2 in the modified example is in the state shown in FIG. 28( a ) in advance. That is, the adhesive tape T2 supplied from the raw material roll 27B is not held by the spliced tape holding member 43B, but the leading end thereof is sucked and held by the adhesive tape holding member 41B.

First, in step S7-1 of the modified example, the preceding adhesive tape T1 and the preceding spacer tape S1 are cut in the same manner as in Example 1, and each is cut off from the raw material roll 27A ( FIGS. 12 and 13 ).

Next, in step S7-2 of the modified example, as shown in FIG. 28(b), the adhesive tape F is fed out from the tape supply unit 77 for supply, and the supplied adhesive tape F passes through the guide roller 78, and its front end is borrowed. It is held by the joint belt holding member 43B. After this adsorption and holding, the cutter unit 79 is positioned at a predetermined position between the bonded tape holding member 43B and the guide roller 78 to cut the adhesive tape F in the width direction ( FIG. 28( c )). Through this cutting, the front end portion of the adhesive tape F is cut off from the tape supply unit 77 . The front end portion of the cut-off adhesive tape F is held by the bonded tape holding member 43B as the bonded tape CT.

In the modified example, the bonding tape CT is produced and prepared through the above process. The processes after step S7-3 are the same as those in the respective embodiments, so detailed description is omitted. Through a series of processes of the modified example, in step S7-5, the joint tape CT composed of the adhesive tape F is pressed against the preceding adhesive tape T1 and Adhesive tape T2 follows (FIG. 29(b)). By this pressing, the joining tape CT joins the preceding adhesive tape T1 and the succeeding adhesive tape T2.

In this modified example, determination of an appropriate mode is performed in accordance with the characteristics of the adhesive tape T, and either one of the first mode and the second mode can be appropriately selected. That is, when the characteristics of the adhesive tape T are suitable for the bonding tape CT, the first mode is selected, and by using a part of the adhesive tape T as the bonding tape CT, advantageous effects characteristic of each embodiment can be obtained.

On the other hand, the second mode is selected when the characteristics of the adhesive tape T are not suitable for the bonding tape CT. At this time, the adhesive tapes T with a thick base B and high rigidity are bonded through the fragments of the adhesive tape F with a thin base B and low rigidity. Therefore, it is possible to reliably avoid the occurrence of splicing failure due to the use of the adhesive tape T itself as the splicing tape CT.

In addition, in this modification, the structure which automatically performs detection of the characteristic of the adhesive tape T, selection of a mode, and supply of the adhesive tape F is illustrated. However, at least one of these can also be performed manually. That is, the operator can check the characteristics of the adhesive tape T when the adhesive tape T is loaded in the bobbin 25 . In addition, the operator can select an appropriate mode for joining with the adhesive tape T from the first mode and the second mode by appropriately operating the input unit 83 . Furthermore, the operator can also cut the adhesive tape F into fragments of an appropriate length, and make the fragments of the adhesive tape F adsorb and hold on the bonding tape holding member 43 .

(2) In each embodiment and each modification, an adhesive tape (protective tape) for circuit protection was described as an example of the adhesive tape T to be automatically joined, but it is not limited thereto. That is, as the adhesive tape T, in addition to the protective tape, as long as it is an adhesive tape for support (dicing tape) for supporting the semiconductor wafer throughout the ring frame or attached to the A long adhesive tape such as an adhesive tape for peeling off the surface of the protective tape can be applied to the configuration of the tape splicing device of the present invention.

(3) In each embodiment and each modification, although the tape splicing device of the present invention was described using the adhesive tape sticking device, the tape splicing device and tape collecting device of the present invention can be applied to various applications other than the tape sticking device. belt processing device. Examples of the tape processing apparatus include a tape peeling apparatus for peeling off various tapes attached to wafers, a mounter for mounting wafers on ring frames, and the like.

(4) In each embodiment and each modified example, the number of raw material rolls 27 arranged in the tape supply unit 17 is not limited to two, but three or more may be arranged. At this time, each configuration of the supply unit 18 is increased according to the number of raw material rolls 27 .

(5) In each embodiment and each modification, although the configuration in which the adhesive tape T is cut with a blade is illustrated, as long as the adhesive tape T can be cut in the width direction, a known cutting method can also be used appropriately. means and cutting methods.

(6) In the embodiment and each modified example, the method of joining by heating and pressing was exemplified for the process of joining the separator S, but it is not limited to this method. As a method of joining the separator S, other methods such as a configuration in which the adhesive is applied and pressed to join, or a configuration in which the two are ultrasonically joined using an ultrasonic generator can also be appropriately changed.

(7) In each embodiment and each modified example, although the tape TS is wound on each of the raw material rolls 27, that is, the structure in which a long tape with a separator tape S is wound around the adhesive tape T is shown. , but the composition of the present invention can also be applied to a structure composed of a base material B and an adhesive layer C without an additional separator S. The completed adhesive tape T is wound on each of the raw material rolls 27 . In this case, in the adhesive tape splicing device, the configuration for handling the separator tape S can be omitted. For example, a configuration for winding and guiding the separator tape S, a configuration for cutting and joining the separator tape S, and the like may be omitted.

(8) In each embodiment and each modification, the order of executing the processes of step S7 can be changed as appropriate. As an example, the processes of steps S7-2 and S7-3 may be performed first, and then the processes of steps S7-1 and S7-4 may be performed.

By performing each process in this order, the junction tape CT is produced, and the junction tape CT is displaced (reversed) so that the adhesive layer C of the adhesive tape T may face each other. Thereafter, the preceding adhesive tape T1 and the preceding separator tape S1 are cut, and the original material roll 27 arranged at the supply position is then switched to another original material roll 27 .

At this time, while the adhesive tape T is attached to the wafer W using the tape TS wound on the raw material roll 27 disposed at the supply position, the adhesive tape wound on the raw material roll 27 disposed at the standby position may be used. T is prepared in advance and the splicing tape CT is prepared. Therefore, the time required for the process of joining the adhesive tape T can be reduced, and the operating efficiency of the adhesive tape joining device 3 can be improved.

3‧‧‧With jointing device

7‧‧‧With attachment unit

15‧‧‧Recycling department of isolation zone

19‧‧‧Preadhesive adhesive tape retaining member

21‧‧‧Separation belt joint unit

27A, 27B‧‧‧raw material roll

33B‧‧‧Joint belt making department

34B‧‧‧guide roller

35B‧‧‧Feed roller

36B‧‧‧Separator retaining member

41A, 41B‧‧‧adhesive tape holding member

43A, 43B‧‧‧Joint belt holding member

45B‧‧‧Cutter unit

46B‧‧‧movable table

47‧‧‧Retaining member of the leading barrier

49‧‧‧Cutter unit

B‧‧‧Substrate

C‧‧‧adhesive layer

CT‧‧‧joint belt

R‧‧‧direction

S1f, S1r‧‧‧advanced isolation zone

S2‧‧‧Subsequent isolation zone

T1f, T1r‧‧‧adhesive tape in advance

T2‧‧‧Follow-up Adhesive Tape

TS1‧‧‧leader belt

TS2‧‧‧sequel tape

Claims (5)

An adhesive tape joining device, which joins ends of long adhesive tapes together, is characterized in that it includes: a tape supply unit, a raw material roll provided with a plurality of adhesive tapes, and is arranged on a supply side from the plurality of said raw material rolls. The first raw material roll at the position will release the adhesive tape; the cutting mechanism will release the first adhesive tape at the specified position from the first raw material roll at the supply position among the plurality of raw material rolls equipped in the tape supply unit. Cutting and separating from the first raw material roll; the first joint tape forming mechanism, among the plurality of raw material rolls provided by the tape supply unit, the aforementioned first adhesive tape discharged from the first raw material roll and the first adhesive tape from the first raw material roll A part of any one of the second adhesive tapes discharged from the second raw material roll is cut and made into an adhesive tape sheet for splicing; the splicing tape holding member holds the aforementioned adhesive tape sheet; the roll switching mechanism moves the aforementioned tape supply unit , switching the raw material roll arranged at the supply position from the first raw material roll to the second raw material roll; The front end of the second adhesive tape unwound from the second raw material roll is bonded with the adhesive tape piece. The adhesive tape joining device according to claim 1, wherein the adhesive tape joining mechanism is used to attach the adhesive surface of the aforementioned adhesive tape sheet to the adhesive surface of the rear end portion of the aforementioned first adhesive tape and the front end portion of the aforementioned second adhesive tape. In a state where the surfaces face each other, the rear end of the first adhesive tape and the front end of the second adhesive tape are joined by the adhesive tape piece. The adhesive tape joining device according to claim 1 or 2, wherein each of the above-mentioned raw material rolls feeds out the aforementioned adhesive tape to which a spacer is added, and is equipped with a spacer belt joint mechanism that cuts off from the first raw material roll. The rear end of the first spacer is joined to the front end of the second spacer unwound from the aforementioned second raw material roll. The adhesive tape joining device according to claim 3, wherein the separating tape joining mechanism has a heating mechanism for heating at least one of the rear end of the first insulating tape and the front end of the second insulating tape, and the first insulating tape And the aforementioned second isolation zone is made of a material that can be bonded by thermal bonding. The adhesive tape joining device according to claim 1 or 2, which includes: a third raw material roll for supplying a third adhesive tape having characteristics different from those of the first adhesive tape and the second adhesive tape; Part of the aforementioned third adhesive tape is cut to make an adhesive tape sheet for joining; the selection mechanism selects either one of the first mode and the second mode according to the characteristics of the aforementioned first adhesive tape or the properties of the aforementioned second adhesive tape and the control mechanism, according to the selection of the aforementioned selection mechanism, controls the aforementioned 1st joint zone forming mechanism and the aforementioned 2nd joint zone forming mechanism. 2. Control the stop of the joint tape forming mechanism, and activate the first joint tape forming mechanism to place the first adhesive tape and the second adhesive tape Part of any one of the adhesive tapes is cut and controlled to form an adhesive tape sheet for joining. When the aforementioned second mode is selected, control is performed to stop the first joining tape forming mechanism, and the second mode is controlled to stop. 2. The joining tape forming mechanism operates to cut a part of the third adhesive tape and control it so as to make an adhesive tape sheet for joining.

Images