200823137 九、發明說明 【發明所屬之技術領域】 本發明係關係電子構件及電路基板、或電路基板間之 黏著固定、以及實施兩者之電極間之電性連接之黏著材膠 帶、其連接方法、製造方法、壓著方法、黏著材膠帶盤、 黏著裝置、黏著劑膠帶盒、及使用其之黏著劑壓著方法， 尤其是，和捲成盤狀之黏著材膠帶、其連接方法、製造方 法、壓著方法、黏著材膠帶盤、黏著裝置、黏著劑膠帶盒 、使用其之黏著劑壓著方法、及向異導電材膠帶相關。 【先前技術】 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 手段，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材塗 布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶的長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 -6- 200823137 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 【發明內容】 近年來，隨著PDP等之面板畫面之大型化，電路基板 之黏著面積（或周圍之一邊尺寸）亦增大，一次使用之黏 著劑的使用量亦增加。又，因爲黏著劑用途之擴大，黏著 劑之使用量亦增加。因此，電子機器之製造工廠之黏著材 盤的更換更爲頻繁，因爲黏著材盤之更換十分麻煩，故有 無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 的捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外’黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大’可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，本發明之目的係在提供一種黏著材膠帶之連接 方法、黏著材膠帶、其製造方法、壓著方法、黏著材膠帶 盤、黏著裝置、黏著劑膠帶盒、使用其之黏著劑壓著方法 、及向異導電材膠帶，使黏著材盤之更換十分簡單，且可 200823137 提筒電子機器之生產效率。 申請專利範圍第1項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠帶 之終端部反折，使一方之黏著材膠帶之黏著劑面及另一方 之黏著材膠帶之黏著劑面重疊，並實施兩者之重疊部份的 加熱壓著使其連接。 此申請專利範圍第1項記載之發明時，係利用黏著材 膠帶之黏著劑來黏著全部捲出之黏著材膠帶之終端部、及 新裝著之黏著材膠帶之始端部，實施黏著材盤之更換，故 很簡單即可將新黏著材膠帶裝著至黏著裝置。又，因爲無 需在每次更換新黏著材膠帶時都更換捲取膠帶、將新黏著 材膠帶之始端裝設至捲取盤之作業、以及在特定路徑設定 導引銷等之作業，只需要較少時間即可更換新黏著材盤， 故可提高電子機器之生產效率。 因係將全部捲出之黏著材膠帶之終端部反折，並將黏 著材膠帶之黏著劑面及新裝著之黏著材膠帶之黏著劑面重 疊黏著，故具有較高之連接強度。 連接部份之加熱壓著若採用裝著著黏著材盤之黏著裝 置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第2項記載之發明，係如申請專利範圍 第1項記載之發明，其特徵爲，一方之黏著材膠帶之終端 部標示著結束標記。 8- 200823137 此申請專利範圍第2項記載之發明時，除了具有和申 請專利範圍第1項記載之發明相同之作用效果以外，尙可 在結束標記露出時實施全部捲出之黏著材膠帶之切斷，故 實施切斷及連接作業之部份容易解開，而且，可利用必要 最小之位置實施連接，而可防止黏著材膠帶之浪費。 申請專利範圍第3項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，在將一方之黏著材膠帶之終端部反 折後，再使前導膠帶之黏著劑面和一方之黏著材膠帶之終 端部之黏著劑面重疊，實施重疊部份之加熱壓著。 此申請專利範圍第3項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶來黏著全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部，故很簡單即可實施黏著材膠帶間之黏著。 申請專利範圍第4項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 -9- 200823137 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，使前導膠帶之黏著劑面和一方之黏 著材膠帶之終端部之黏著劑面重疊，實施重疊部份之加熱 壓著。 此申請專利範圍第4項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 申請專利範圍第5項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，在兩者 之重疊部份插入卡止銷來實施連接。 此申請專利範圍第5項記載之發明時，因爲係以卡止 銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏著 材膠帶之始端部，故連接十分簡單。又，因爲無需在每次 更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 申請專利範圍第6項記載之發明，係利用卡止構件來 -10- 200823137 連接用以連接基材上塗布著電極連接用黏著劑之捲取至一 方之盤上之一方之黏著材膠帶、及捲取至另一方之盤上之 另一方之黏著材膠帶的黏著材膠帶之黏著材膠帶連接方法 ，其特徵爲，卡止構件具有配設於一方及另一方端部之爪 部、及配設於爪部間之彈性構件，一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部會互相抵接，配設於 卡止構件之一端之爪部會卡止於一方之黏著材膠帶之終端 部，配設於另一端之爪部會卡止於另一方之黏著材膠帶之 始端部，以彈性構件拉近兩方之爪部。 此申請專利範圍第6項記載之發明時，因爲使卡止構 件之一方之爪部卡止於一方之黏著材膠帶之終端部，而且 ，使卡止構件之另一方之爪部卡止於另一方之黏著材膠帶 之始端部，實施兩者之互相連接，故連接十分容易。又， 因爲一方之爪部及另一方之爪部之間具有彈性構件，故， 彈性構件可伸展而使卡止構件之另一方之爪部卡止於另一 方之黏著材膠帶之始端部之任意位置上，而爲具有高自由 度之連接。 又，因係使一方之黏著材膠帶之終端部、及另一方之 黏著材膠帶之始端部互相抵接之狀態實施連接，而無需使 膠帶互相重疊，可利用必要最小之位置實施連接，而可防 止黏著材膠帶之浪費。 申請專利範圍第7項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 -11 - 200823137 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，以橫剖 面略呈3字形之可彈性變形之夾子實施兩者之重疊部份的 夾持固定。 此申請專利範圍第7項記載之發明時，因爲只需以夾 子夾住一'方之黏者材膠帶之終端部、及另一'方之黏著材膠 帶之始端部之重疊部份即可實施連接，連接作業十分容易 〇 申請專利範圍第8項記載之發明，其特徵爲，係以橫 剖面略呈3字形之金屬製夾持片夾住一方之黏著材膠帶及 另一方之黏著材膠帶之重疊部份，並從重疊部份之兩面壓 扁夾持片來連接兩者。 此申請專利範圍第8項記載之發明時，因係從重疊部 份之兩面壓扁夾持片來連接兩者，故可提高黏著材膠帶之 重疊部份的連接強度。 申請專利範圍第9項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部之其中任何一 方之黏著劑面重疊於另一方之基材面上，兩者之重疊長度 爲黏著劑膠帶寬度之2至50倍之範圍，以兩者之加熱壓 著實施連接。 此申請專利範圍第9項記載之發明時，因係利用黏著 -12- 200823137 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部來實施黏著材盤之更換，故很 簡單即可將新黏著材盤裝著至黏著裝置上。又，因爲無需 在每次更換新黏著材盤時都更換捲取盤、及將新黏著材之 始端裝設至捲取盤之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 重疊部份之長度爲黏著材膠帶寬度之2倍至50倍， 其理由如下所示，小於2倍時無法獲得充分之連接強度， 大於5 0倍時則連接部份使用之黏著材會增加過多而造成 黏著材之浪費。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑者，亦可以爲只有絕緣性黏著劑者，或者 ，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 0項記載之發明，係用以連接基材 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠 帶之終端部折向黏著劑相對之方向，而將另一方之黏著材 膠帶之始端部折向黏著劑相對之方向，使兩者之彎折部份 互相卡止重疊且使兩者之黏著材面相對，實施重疊部份之 加熱壓著。 此申請專利範圍第1 0項記載之發明時，除了具有和 -13- 200823137 申請專利範圍第i項記載之發明相同之作用效果以外，一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 會互相形成鈎狀卡止，且兩者之黏著劑面會互相連接，故 有較高之連接強度。 申請專利範圍第1 1項記載之發明，係如申請專利範 圍第9或1 0項記載之發明，一方之黏著材膠帶之終端部 會標示著結束標記。 此申請專利範圍第1 1項記載之發明時，除了具有和 申請專利範圍第9或1 0項記載之發明相同之作用效果以 外，因爲一方之黏著材膠帶之終端部係利用結束標記部份 ，執行連接作業之部份容易解開且可利用必要最小之位置 實施連接，而可防止黏著材膠帶之浪費。又，可自動檢測 結束標記部份，故可利用該檢測信號控制裝置，若能發出 警報’則可提局作業效率。 申請專利範圍第1 2項記載之發明，係如申請專利範 圍第9〜1 1項之其中任一項記載之發明，其特徵爲，以形 成凹凸之一方之模具、及和其咬合之另一方之模具，夾住 一方之黏著材膠帶及另一方之黏著材膠帶之重疊部份，實 施加熱壓著。 此申請專利範圍第1 2項記載之發明時，除了具有和 申請專利範圍第9〜11項之其中任一項記載·之發明相同之 作用效果以外，因爲連接部份會形成凹凸而可擴大連接面 積，同時，可利用凹凸部之卡合來提高黏著材膠帶之拉伸 方向（縱向）之連接強度。 -14- 200823137 申請專利範圍第1 3項記載之發明，係如申請專利範 圍第9〜11項之其中任一項記載之發明，其特徵爲，在一 方之黏著材膠帶及另一方之黏著材膠帶之重疊部份形成貫 通孔後，實施重疊部份之加熱壓著。 此申請專利範圍第1 3項記載之發明時，除了具有如 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成貫通孔，黏著劑會滲 出至貫通孔之內緣，而增加黏著劑之黏著面積，故可進一 步提高連接強度。 申請專利範圍第1 4項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 著材膠帶的黏著材膠帶連接方法，其特徵爲，一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部會重疊或 抵接，以跨越兩黏著材膠帶之矽處理基材之表面部份的方 式貼附矽黏著膠帶，實施兩黏著材膠帶之連接。 此申請專利範圍第1 4項記載之發明時，已捲取一方 之黏著材膠帶之黏著材盤、及只捲取黏著材膠帶之基材之 捲取盤係裝著於黏著裝置上，黏著材盤之黏著材膠帶用完 時，已用完之黏著材膠帶（一方之黏著材膠帶）之終端部 、及新裝著之黏著材盤之黏著材膠帶（另一方之黏著材膠 帶）之始端部會以矽黏著膠帶連接，新黏著材盤會取代已 用完之黏著材盤而裝著於黏著裝置上。 本發明時，只需連接已用完之黏著材膠帶及新黏著材 -15- 200823137 膠帶即可更換連接盤，故很容易即可將新黏著材盤裝著至 黏著裝置上。又，因爲無需在每次更換新黏著材盤時都更 換捲取盤、或將新黏著材膠帶之始端裝設至捲取盤並引導 黏著材膠帶之作業，故只需要較少時間即可更換新黏著材 盤，而可提高電子機器之生產效率。 黏著材膠帶之基材係利用矽實施表面處理，使用之黏 著膠帶亦使用矽黏著劑，可減少兩者之表面張力的差異而 提高密著力，故可實現傳統上較困難之兩者的黏著。 黏著材膠帶之黏著劑可以爲將導電粒子分散於絕緣性 黏著劑中之向異導電性黏著者，亦可以爲只有絕緣性黏著 劑者，或者，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 5項記載之發明，其特徵爲，申請 專利範圍第1 4項記載之矽黏著膠帶之黏著劑面之表面張 力及黏著材膠帶之矽處理基材之表面張力之差爲10mN/m (1 Odyne/cm )以下。 此申請專利範圍第1 5項記載之發明時，除了具有和 申請專利範圍第1 4項記載之發明相同之作用效果以外， 因爲矽黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽 處理基材之表面張力之差爲10mN/m(10dyne/cm)以下， 可獲得較強之密著力，而可確實黏著兩者。表面張力係以 潮濕試劑或接觸角來檢測。 黏著材膠帶之矽處理基材及矽黏著膠帶之黏著劑面的 表面張力差應爲0〜5mN/m(5dyne/cm)。表面張力之差 愈小愈好，若超過1 〇 m N / m ( 1 0 d y n e / c m )則可能無法獲得 -16- 200823137 充分密著強度。 申請專利範圍第1 6項記載之發明，係如申請專利範 圍第2項記載之發明，其特徵爲，矽黏著膠帶之黏著力係 100g/25mm 以上。 此申請專利範圍第1 6項記載之發明時，除了具有和 申請專利範圍第2項記載之發明相同之作用效果以外，一 方及另一方之黏著材膠帶的連接係利用對兩者之黏著劑面 張貼砂黏者膠帶來實施黏著，一方及另一方之黏著材膠帶 可獲得兩面之黏著（或密著），故可以高強度實施黏著。 尤其是，因爲黏著力爲100g/25mm以上，一方及另一 方之黏著材膠帶之兩黏著劑面的黏著會更爲強固。 黏著強度愈大可得到愈強之黏著強度，然而，小於 100g/25mm則可無法獲得特定強度。 申請專利範圍第1 7項記載之發明，其特徵爲，使一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 重疊或抵接，並將申請專利範圍第1 6項記載之矽黏著膠 帶張貼於兩黏著材膠帶之兩面來實施連接。 此申請專利範圍第1 7項記載之發明時，除了具有和 申請專利範圍第1 6項記載之發明相同之作用效果以外， 係以其兩面實施一方及另一方之黏著材膠帶之連接，故可 得到更爲強固之連接。 申請專利範圍第1 8項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 -17- 200823137 著材膠帶的黏著材膠帶連接方法，其特徵爲’以一方之黏 著材膠帶之終端部及另一方之黏著材膠帶之始端部間夾著 兩面塗布著矽黏著劑之矽黏著膠帶之方式來實施兩黏著材 膠帶之連接，兩面之矽黏著劑和矽基材之表面張力之差爲 10mN/m ( l〇dyne/cm)以下，且黏著力爲l〇〇g/25mm以上 〇 此申請專利範圍第1 8項記載之發明時，因爲使用兩 面黏著劑之矽黏著膠帶，而可以一方及另一方之黏著材膠 帶間夾著兩面矽黏著膠帶之方式來實施兩者之黏著（或密 著），故兩者之連接十分簡單且容易。 申請專利範圍第1 9項記載之發明，係用以連接基板 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部會重疊或抵接 ，使糊狀之樹脂製黏著劑附著於重疊部份或抵接部份，並 以糊狀之樹脂製黏著劑之硬化來實施兩者之連接。 此申請專利範圍第1 9項記載之發明時，因爲已用完 之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始端部 係以糊狀之樹脂製黏著劑實施固定，故連接十分簡單。又 ，因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、 將新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定 路徑設定導引銷等之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 -18- 200823137 因爲一方之黏著材膠帶之終端部、及另一方之黏著材 膠帶之始端部的重疊部份或抵接部份附著著樹脂製黏著劑 ，故連接具有高自由度。 申請專利範圍第2 0項記載之發明，係如申請專利範 圍第1 9項記載之發明，其特徵爲，樹脂製黏著劑係從熱 硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑之群組中選 取之至少1種材料所構成。 此申請專利範圍第20項記載之發明時，除了具有和 申請專利範圍第1 9項記載之發明相同之作用效果以外， 因爲可從熱硬化性樹脂、光硬化性樹脂、熱金屬黏著劑之 群組中選取適合用於黏著材膠帶間之連接的樹脂製黏著劑 ，故可提高黏著材膠帶間之連接強度。 申請專利範圍第2 1項記載之發明，其特徵爲，裝著 著黏著材膠帶之黏著裝置上，裝設著用以供應申請專利範 圍第1 9或20項記載之樹脂製黏著劑的充塡機。 此申請專利範圍第2 1項記載之發明時，因爲黏著裝 置內配設著用以供應申請專利範圍第1 9或20項記載之樹 脂製黏著劑的充塡機，故無另行準備充塡機，而可防止連 接作業之浪費。 又，黏著裝置內除了充塡機以外，亦可具有以實施熱 硬化性樹脂之硬化爲目的之加熱器、或以實施光硬化性樹 脂之光照射爲目的之紫外線。 申請專利範圍第22項記載之發明，係用以將基材上 塗布著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材 -19- 200823137 膠帶盤，其特徵爲，黏著材膠帶盤在膠帶之寬度方向配設 著複數黏著材膠帶之捲部。 此申請專利範圍第22項記載之發明時，因爲配設著 複數黏著材膠帶之捲部（捲部），複數之捲部當中，捲取 至一方之捲部之黏著材膠帶之全部捲出時，會將配置於全 部捲出之捲部之旁邊的另一方之捲部之黏著材膠帶裝設至 捲取盤。 如此，因爲一方之黏著材膠帶全部捲出時，會將另一 方之黏著材膠帶裝設至捲取盤，而實施黏著材膠帶之更換 ，故無需將新黏著材膠帶盤裝著至黏著裝置上。因此，新 黏著材膠帶盤之更換作業會較少，故可提高電子機器之生 產效率。 因爲可依序使用捲取至複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第23項記載之發明，係如申請專利範 圍第22項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部間，具有用以連接 兩者之連結膠帶，一方之黏著材膠帶之全部捲出時，會接 著開始捲出另一方之黏著材膠帶。 -20- 200823137 此申請專利範圍第2 3項記載之發明時’除了具有和 申請專利範圍第22項記載之發明相同之作用效果以外， 因爲一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部係以連結膠帶實施連接’無需在一方之捲部之黏著 材膠帶之全部捲出後將另一方之捲部之黏著材膠帶裝設至 捲取盤上之作業，故可進一步提高電子機器之生產效率。 申請專利範圍第24項記載之發明，係具有申請專利 範圍第23項記載之黏著材膠帶盤、黏著材膠帶之捲取盤 、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏 著材膠帶之黏著材壓著至電子機器之電路基板的壓著部、 以及用以檢測連結膠帶之膠帶檢測手段的黏著裝置，其特 徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通過 壓著部爲止，會將連結膠帶捲取至捲取盤。 此申請專利範圍第24項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，故一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，黏著裝置具有膠帶檢測手段，係由成對之發光部 及受先R卩所構成’用以貫施連結膠帶之光學檢測。另一*方 面，連結膠帶之兩端配設著有顏色之（例如黑色）標記， 受光部會利用發光部發出之雷射光檢測連結膠帶兩端之標 記來檢測連結膠帶。又，除了在連結膠帶附加標記以外， -21 - 200823137 可採用使連結膠帶之寬度和黏著材膠帶之寬度不同的方法 、或在連結膠帶上形成複數之孔的方法。 申請專利範圍第25項記載之發明，係利用卡止具連 接一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始 端部的黏著材膠帶盤，其特徵爲，連接部份係以黏著材膠 帶覆蓋卡止具。 此申請專利範圍第25項記載之發明時，因爲利用卡 止具來連接全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，實施黏著材膠帶盤之更換，故將新黏 著材膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每 次更換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠 帶之始端裝設至捲取盤之作業、以及在特定路徑設定導引 銷等之作業，只需較少時間即可更換新黏著材膠帶盤，故 可提高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 -22- 200823137 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又，以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折1 80度，使黏 著材膠帶覆蓋卡止具。 又，亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第26項記載之發明，係具有申請專利 範圍第1項記載之黏著材膠帶盤、黏著材膠帶之捲取盤、 配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏著 材膠帶之黏著材壓著至電子機器之電路基板的壓著部、以 及用以檢測膠帶之連接部份的連接部檢測手段之黏著裝置 ，其特徵爲，連接部檢測手段檢測到膠帶之連接部份時， 至連接部份通過壓著部爲止，會將一方之黏著材膠帶捲取 至捲取盤。 此申請專利範圍第26項記載之發明時，連接部檢測 手段若檢測到連接部份，則因爲至連接部份通過壓著部爲 止，會將一方之黏著材膠帶捲取至捲取盤，故可防止連接 部份到達壓著部時實施壓著動作之問題。又，至連接部份 通過壓著部爲止，因爲會自動將一方之黏著材膠帶捲取至 捲取盤，故可省略捲取之麻煩。 申請專利範圍第27項記載之發明，係如申請專利範 圍第 26項記載之發明，其特徵爲，連接部檢測手段係 -23- 200823137 CCD攝影機、厚度檢測感測器、及透射率檢測感測器之其 中之一。 此申請專利範圍第27項記載之發明時，除了具有和 申請專利範圍第26項記載之發明相同之作用效果以外， 以簡單之構成即可實施連接部份之檢測，而且，可利用這 些手段提高檢測精度。 例如，採用CCD攝影機做爲連接部檢測手段時，可 使連接部份之表面顯示於監視畫面，以比較圖素之濃淡來 檢測連接部份。又，採用厚度檢測感測器時，因爲連接部 份之厚度會大於黏著材膠帶之厚度，因可以比較厚度之變 化來檢測連接部份。又，採用透射率感測器時，會因爲連 接部份之厚度較厚，且因爲有卡止具而使透射率降低，故 可以比較透射率之値來檢測連接部份。 申請專利範圍第2 8項記載之黏著材膠帶連接方法， 其特徵爲，利用卡止具連接一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部，連接部份會以黏著材膠帶 覆蓋卡止具。 此申請專利範圍第28項記載之發明時，係利用卡止 具連接全部捲出之黏著材膠帶之終端部及新裝著之黏著材 膠帶之始端部來實施黏著材膠帶盤之更換，故將新黏著材 膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每次更 換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需較少時間即可更換新黏著材膠帶盤，故可提 -24- 200823137 高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又，以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折1 80度，使黏 著材膠帶覆蓋卡止具。 又，亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第2 9項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，基材上會 在膠帶之縱向上配置著複數條黏著劑。 此申請專利範圍第29項記載之發明時，若使用黏著 劑膠帶，將已捲取黏著劑膠帶之盤及空盤裝著至黏著裝置 -25- 200823137 ’對電路基板實施黏著劑之加熱加壓後，並以將基材捲至 空盤之方式裝著。 其次，對電路基板實施黏著劑之加熱加壓時，將配設 於基材之寬度方向的複數條黏著劑當中之1條壓著至電路 基板’壓著後之殘餘黏著劑條會和基材同時被捲取至空盤 。其次’盤上之黏著劑膠帶全部捲出後，會使盤之旋轉方 向逆轉，而使黏著劑膠帶之供應方向逆轉。如此，在各次 使用1條黏著劑後，會同時捲取殘餘之黏著劑及基材，並 重複依序使用殘餘之黏著劑條。因此，因爲會依序逐條使 用複數條黏著劑，故無需增加膠帶之捲數，即可大幅增加 1盤（2倍以上）可使用之黏著劑量。 本發明時，無需增加黏著劑膠帶之捲數，可大幅增加 使用黏著劑量。而且，因爲未增加黏著劑膠帶之捲數，故 可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度方向 滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可防止 阻塞，此外，亦可防止因爲基材較長而容易發生之伸展等 弊病（基材之損傷或切斷）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高製造效率。 又，黏著劑膠帶之製造上，因爲每1盤之黏著劑量較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 又，結束第1條黏著劑之壓著而將黏著劑膠帶捲取至 空盤後，爲了使用下1條黏著劑，不逆轉旋轉方向而更換 -26- 200823137 裝著於黏著裝置之2個盤亦可。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 基材之寬度應爲5mm〜1 000mm，然而，可依1條黏 著劑之寬度或黏著劑之條數而任意選取。1條黏著劑之寬 度應爲〇.5mm〜10.0mm。 基材之寬度應爲 5mm〜1000mm，基材之寬度低於 5mm時，配設於基材上之黏著劑之條數及黏著劑之寬度會 受到制限，大於1 000mm時，則無裝著至既存之黏著裝置 〇 申請專利範圍第3 0項記載之發明，係如申請專利範 圍第29項記載之發明，其特徵爲，複數條黏著劑之相鄰 的黏著劑條具有間隔。 此申請專利範圍第3 0項記載之發明時，除了具有和 申請專利範圍第29項記載之發明相同的作用效果以外， 同時，因爲相鄰之黏著劑條間爲互相分離，故容易實施黏 著劑之逐條壓著。 申請專利範圍第3 1項記載之發明，係如申請專利範 圍第29項記載之發明，其特徵爲，黏著劑係利用在膠帶 之縱向上形成縫隙來分離成複數條。 此申請專利範圍第3 1項記載之發明時，除了具有和 申請專利範圍第29項相同的作用效果以外，同時，在基 材之單面全面塗布黏著劑，並將黏著劑壓著至電路基板之 -27- 200823137 前一瞬間’亦即，在使用黏著劑膠帶之前一瞬間，尙以切 刃等使黏著劑具有切痕之方式來形成縫隙。 又’縫隙之形成上，亦可在製造黏著劑膠帶時，以切 刃等使黏著劑具有切痕而形成縫隙。 縫隙之形成上，除了利用切刃以外，亦可利用雷射或 電熱線等來形成。 本發明時，可增加配置於基材上之黏著劑條的條數。 申請專利範圍第3 2項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，以在基材之寬度方向具有間隔之方式配置之塗布器， 對以連續方式搬運之基材面上供應黏著劑來對基材實施複 數條黏著劑之塗布。 此申請專利範圍第32項記載之發明時，可以利用既 存設備製造如申請專利範圍第3 0項記載之黏著劑膠帶。 塗布器可以爲配設於基材之寬度方向的複數滾筒，亦 可以爲噴嘴。 申請專利範圍第3 3項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，在一方之基材之單面全面塗布黏著劑，並在黏著劑上 形成縱向之縫隙後，在黏著劑面上配置另一方之基材，以 一方及另一方之基材夾住黏著劑，然後再使一方之基材及 另一方之基材互相分離，一方及另一方之基材上分別交互 貼附著複數條黏著劑，而在一方及另一方之基材上以具有 間隔之方式配置複數條黏著劑。 -28- 200823137 此申請專利範圍第3 3項記載之發明時’因爲可以同 時製造2個如申請專利範圍第2項記載之黏著劑膠帶’故 具有良好製造效率。 申請專利範圍第3 4項記載之發明’係在基材上塗布 黏著劑，並利用捲成盤狀之黏著劑膠帶將黏著劑壓著至電 路基板之黏著劑壓著方法’其特徵爲’基材之單面全面會 塗布著黏著劑，對黏著劑膠帶之寬度方向的部份黏著劑從 基材側沿膠帶之縱向實施加熱加壓形成條狀’降低經過加 熱之部份之黏著劑的凝聚力並壓著至電路基板’壓著後’ 將殘餘之黏著劑和基材同時捲成盤狀’並再度利用捲成盤 狀之黏著劑膠帶對電路基板實施殘餘之黏著劑的加熱加壓 〇 此申請專利範圍第3 4項記載之發明時’以對部份黏 著劑加熱來降低該部份之凝聚力（以下簡稱爲「凝聚力降 低線」），從凝聚力降低線將經過加熱之部份的黏著劑壓 著至電路基板，而和基材分離。殘餘之黏者劑會保持殘留 於基材上之情形下，和基材同時被捲取至空盤。 本發明時，因爲只是使黏著劑膠帶之寬度較傳統稍爲 寬一點而已，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑寬度，可以改變加熱 區域來進行任意設定，故壓著黏著劑寬度具有較高之自由 度。 又，和申請專利範圍第29項記載之發明相同，黏著 劑膠帶全部捲出至空盤時，使盤之旋轉方向逆轉，而使膠 -29- 200823137 帶之供應方向逆轉、或保持盤之旋轉方向但將盤相互交換 。利用此方式，因爲會依逐條對基材上之黏著劑加熱並壓 著至電路基板，可在不增加膠帶之捲數的情形下，大幅增 加1盤可使用之黏著劑量。 又’和申請專利範圍第29項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 膠帶寬度應爲5mm〜1 000mm，壓著至電路基板之黏 著劑應爲 〇.5mm〜1.5mm。膠帶寬度爲 5mm〜1000mm之 理由如下，因爲膠帶寬度低於5mm時，每1盤之黏著劑 壓著次數會較少，而大於1 000mm時，將無法裝著至既存 之黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑、亦可以爲只有絕緣性黏著劑者、或者將 絕緣性之隔件粒子分散於這些黏著劑中者。 申請專利範圍第3 5項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，黏著劑膠 帶之寬度爲和電路基板之一邊之長度相同或以上，且在膠 帶之寬度方向上配置著複數條黏著劑。 此申請專利範圍第3 5項記載之發明時，係以寬度和 電路基板之一邊重疊的方式來配置黏著劑膠帶，故可直接 沿著電路基板之一邊對配設於黏著劑膠帶之寬度方向的1 條黏著劑實施加熱加壓。 -30- 200823137 因爲黏著劑膠帶之寬度爲電路基板之一邊之長度以上 ，黏著劑膠帶只需拉出黏著劑之條寬即可。 其次，將黏著劑壓著至電路基板之一邊後，旋轉電路 基板，使另一邊位於黏著劑膠帶之寬度方向的位置，對另 一邊實施黏著劑條之加熱加壓。如此，依序對電路基板之 其他邊實施黏著劑之壓著，很容易即可對電路基板之四周 實施黏著劑之壓著。 因此，因爲可依序逐條使用具有電路基板之一邊之長 度以上之黏著劑，而一次之使用量爲黏著劑條之寬度尺寸 份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可使 用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面，因電子構件之製造工廠可減少新黏著劑膠 帶之更換次數，故可提高製造效率。 又，黏著劑膠帶之製造上，因每1盤之黏著劑量會較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 -31 200823137 黏著劑膠帶之寬度爲電路基板之一邊之尺寸以上，例 如，5mm〜3000mm。又，即使尺寸小於電路基板之一邊之 尺寸的黏著劑膠帶，亦可以在黏著劑膠帶之寬度方向配置 複數條相鄰接之方式來使其具有電路基板之一邊之尺寸。 此時，因很容易即可對應不同尺寸之電路基板故可提高生 產效率。1條黏著劑之寬度應爲例如0.5 mm〜10.0mm。 黏著劑膠帶之寬度爲5mm〜3000mm之理由如下，電 路基板之一邊之尺寸很少會小於5mm，而大於3000mm時 ，盤之寬度會太寬，而可能無法裝著至既存之黏著裝置。 申請專利範圍第3 6項記載之發明，係如申請專利範 圍第3 5項記載之發明，其特徵爲，以相鄰之黏著劑條具 有間隔之方式配設複數條黏著劑。 此申請專利範圍第3 6項記載之發明時，除了具有和 申請專利範圍第3 5項記載之發明相同之作用效果以外， 因爲鄰接之黏著劑條爲分離，很容易即可將黏著劑逐條從 基材剝離並實施壓著。 申請專利範圍第3 7項記載之發明，係如申請專利範 圍第3 5項記載之發明，其特徵爲，黏著劑係利用形成於 膠帶之寬度方向的縫隙而分離成複數條。 此申請專利範圍第3 7項記載之發明時，除了具有和 申請專利範圍第3 5項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間，利用以切刃等使黏著劑具有切 -32- 200823137 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 本發明時，除了可增加配置於基材上之黏著劑條的條 數以外，在膠帶之寬度方向配置複數條黏著劑之黏著劑膠 帶的製造更爲容易。 申請專利範圍第3 8項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，將黏著劑塗布於一方之基材之全面，並在黏著劑上沿 著膠帶之寬度方向形成縫隙後，在黏著劑面上配置另一方 之基材，以一方及另一方之基材夾住黏著劑，然後再使一 方之基材及另一方之基材互相分離，一方及另一方之基材 上分別交互貼附著複數條黏著劑，而在一方及另一方之基 材上以具有間隔之方式配置著複數條黏著劑。 此申請專利範圍第3 8項記載之發明時，因爲可以利 用既存設備同時製造2個如申請專利範圍第2項記載之黏 著劑膠帶，故具有良好製造效率。 申請專利範圍第3 9項記載之發明，係一種黏著劑膠 帶壓著方法，其特徵爲，將申請專利範圍第3 5〜3 7項之 其中任一項記載之黏著劑膠帶配置於電路基板上，沿著寬 度方向對黏著劑膠帶實施加熱加壓，將黏著劑條壓著至電 路基板之一邊。此壓著方法亦可採用如下之方式，亦即， 將黏著劑膠帶配置於電路基板上，沿著寬度方向對黏著劑 -33- 200823137 膠帶實施加熱加壓，將黏著劑條壓著至電路基板之一邊， 其次，變更電路基板之位置，並沿著黏著劑膠帶之寬度方 向對電路基板之另一邊實施黏著劑膠帶之加熱加壓，將下 一黏著劑條壓著至電路基板之另一邊。 此申請專利範圍第3 9項記載之發明時，除了具有和 申請專利範圍第3 5〜3 7項之其中任一項記載之作用效果 以外，將黏著劑膠帶裝著於黏著裝置後，可將電路基板之 一邊配置於黏著劑膠帶之寬度方向，將黏著劑壓著至電路 基板之一邊，其次，將電路基板旋轉大約90度，使電路 基板之另一邊位於和黏著劑膠帶之寬度方向成爲平行之位 置上，並將黏著劑壓著至電路基板之另一邊。如此，可依 序將電路基板旋轉90度並實施回黏著劑之壓著，很簡單 即可將黏著劑壓著於電路基板之四周，而提高電子構件之 製造工廠的作業效率。 申請專利範圍第40項記載之發明的特徵如下，至少 在移動電路基板之搬運路上配置2條申請專利範圍第3 5〜 37項之其中任一項記載之黏著劑膠帶，一方之黏著劑膠帶 之配置上，其寬度方向和搬運路成垂直，另一方之黏著劑 膠帶之配置上，其寬度方向係沿著搬運路之方向，一方之 黏著劑膠帶係針對電路基板之相對2邊沿著寬度方向實施 黏著劑膠帶之加熱加壓將黏著劑條壓著至電路基板之相對 2邊，其次，使電路基板朝另一方之黏著劑膠帶移動，針 對電路基板之其餘2邊從基材側沿著寬度方向實施黏著劑 膠帶之加熱加壓，將黏著劑條壓著於電路基板之四周。 -34- 200823137 此申請專利範圍第40項 申請專利範圍第3 5〜3 7項記 轉電路基板而將其移至一方之 劑膠帶之位置，在各位置上沿 而很容易即可將黏著劑壓著於 作業效率。 申請專利範圍第4 1項記 全面塗布黏著劑，並利用捲成 板實施黏著劑之壓著的黏著劑 黏著劑膠帶之寬度爲電路基板 方向實施黏著劑膠帶之寬度方 ，降低加熱部份之黏著劑的凝 基板。 此申請專利範圍第4 1項 壓著至電路基板之周圍時，係 置並沿著寬度方向實施黏著劑 份之凝聚力（以下簡稱爲「凝 之黏著劑會沿著凝聚力降低線 板上。其次，將電路基板旋轉 黏著劑膠帶之寬度方向之位置 黏著劑條之加熱加壓，將黏著 邊。如此，可依序將黏著劑壓 良好作業效率。 又，因爲只需在黏著劑膠 記載之發明時，除了具有和 載之作用效果以外，無需旋 黏著劑膠帶及另一方之黏著 著寬度方向實施加熱加壓， 電路基板之四周，具有良好 載之發明，係在基材之單面 盤狀之黏著劑膠帶對電路基 膠帶壓著方法，其特徵爲， 之一邊之長度以上，從寬度 向之部份黏著劑的加熱加壓 聚力，將黏著劑壓著至電路 記載之發明時，在將黏著劑 將黏著劑膠帶裝著至黏著裝 膠帶之加熱加壓，降低該部 聚力降低線」），加熱部份 從基材分離而壓著至電路基 約90度，使相鄰之邊位於 上，沿著寬度方向實施下一 劑條之黏著劑壓著至相鄰之 著至電路基板之四邊，而有 帶之全面塗布黏著劑即可， -35- 200823137 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和申請專利範圍第3 5項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明的特徵，係具有一 方之盤、另一方之盤、以及用以收容以可自由旋轉方式裝 設之這些盤的殼體，一方之盤上捲繞著在基材上塗布著黏 著劑之黏著劑膠帶，另一方之盤則固定著黏著劑膠帶之一 端，黏著劑膠帶上沿著膠帶之縱向至少配置著2條黏著劑 〇 此申請專利範圍第42項記載之發明時，將黏著劑膠 帶盒裝著至黏著裝置，以和電路基板之一邊重疊之方式， 對配置於黏著劑膠帶之寬度方向上之至少2條沿著縱向形 成之黏著劑的1條，從基材側實施加熱加壓，使1條之黏 著劑壓著至電路基板。如此，可依序將黏著劑壓著至電路 基板，從一方之盤依序捲出黏著劑膠帶，同時，將殘餘之 1條塗布著黏著劑之黏著劑膠帶捲取至另一方之盤。其次 ，捲繞於一方之盤的黏著劑膠帶全部捲出時，將盒反轉並 再度裝著至壓著裝置。 利用此方式，因爲一方之盤及另一方之盤會互換，而 -36- 200823137 變成從另一方之盤捲出黏著劑膠帶，可再實施1條黏著劑 之壓著。 在黏著劑膠帶上形成2條以上之黏著劑時，亦可改變 寬度方向之位置，並以依序或以具有間隔之方式實施壓著 〇 如上所示，本發明時，黏著劑板上至少在寬度方向上 並排著2條黏著劑，並可逐條使用，至1盤至少可使用2 盤份，而可在無需增加黏著劑膠帶之捲數的情形，使1盤 可使用之黏著劑量增加成2倍以上。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面，形成2條黏著劑時，電子構件之製造工廠 在用完1盤份（1條黏著劑）時只需反轉盒即可，故下一 裝著更爲容易。 又，因黏著劑膠帶係採盒方式，故在黏著裝置上將黏 著劑膠帶裝設於盤上時沒有繁複之步驟，只要將盒裝著至 黏著裝置即可，故處理上十分容易，而且具有良好之裝設 及更換作業性。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 37- 200823137 申請專利範圍第43項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，複數條黏著劑之相鄰 之黏著劑條具有間隔。 此申請專利範圍第43項記載之發明時，除了具有和 申請專利範圍第42項記載之發明相同之作用效果以外， 相鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑 並實施壓著。 申請專利範圍第44項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，黏著劑係利用膠帶之 寬度方向上形成之縫隙來分離成複數條。 此申請專利範圍第44項記載之發明時，除了具有和 申請專利範圍第42項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間，利用以切刃等使黏著劑具有切 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 申請專利範圍第45項記載之發明的特徵，係將：具 有一方之盤、另一方之盤、以及用以收容以可自由旋轉方 式裝設之這些盤的殻體；及一方之盤上捲繞著在基材上塗 布著黏著劑之黏著劑膠帶，而另一方之盤固定著黏著劑膠 帶之一端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑 -38- 200823137 膠帶盒將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之 寬度方向之一部份進行加熱加壓’降低加熱部份之黏著劑 的凝聚力，將寬度方向之部份黏著劑壓著至電路基板。 此申請專利範圍第45項記載之發明時，利用對黏著 劑膠帶之寬度方向的一部份實施加熱加壓，降低該部份之 黏著劑之凝聚力（以下簡稱爲「凝聚力降低線」），可從 凝聚力降低線使加熱部份之黏著劑從基材分離並壓著至電 路基板。 本發明時，因爲黏著劑膠帶只需在基材之全面塗布黏 著劑即可，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 申請專利範圍第46項記載之發明，係一種利用黏著 劑膠帶盒之黏著劑壓著方法，其特徵爲，將：具有一方之 盤、另一方之盤、以及用以收容以可自由旋轉方式裝設之 這些盤的殼體；及一方之盤上捲繞著在基材上塗布著黏著 劑之黏著劑膠帶，而另一方之盤則固定著黏著劑膠帶之一 端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒 將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之寬度方 向的一部份實施加熱加壓，降低加熱部份之黏著劑的凝聚 力，將寬度方向之部份黏著劑壓著至電路基板，捲取至一 方之盤上之黏著劑膠帶全部捲出後，將黏著劑膠帶盒反轉 ，再將殘餘之部份黏著劑壓著至電路基板。 -39- 200823137 此申請專利範圍第46項記載之發明時，除了具有和 申請專利範圍第45項相同的作用效果以外，同時，捲取 至一方之盤上之黏著劑膠帶全部捲出時，將盒反轉並再度 裝著至壓著裝置’而將殘餘部份之黏著劑壓著至電路基板 ，故和申請專利範圍第1項記載之發明相同，在未增加捲 數之情形下可增加黏著劑量，故可防止捲取散亂，同時， 得到可防止因黏著劑之滲出而造成之阻塞、及防止因基材 之伸展而造成之弊病等之效果。此外，電子構件之製造工 廠在1盤份（1條份之黏著劑）全部捲出時，只要反轉盒 即可，下一裝著會更爲容易。因爲採用盒之方式，處理上 更爲容易，且具有良好之裝設及更換作業性。 申請專利範圍第47項記載之發明，係塗布於基材上 之捲成盤狀之黏著劑膠帶，其特徵爲，基材具有熱熔融劑 層及支持層。 此申請專利範圍第47項記載之發明時，若使用黏著 材膠帶，將捲取黏著材膠帶之盤及空盤裝著至黏著裝置， 對電路基板實施黏著材之加熱加壓後，會將基材捲取至空 盤。其次，使已全部捲出之捲取至一方之盤上之一方之黏 著材膠帶之終端部、及新捲取至另一方之盤上之另一方之 黏著材膠帶之始端部互相重疊或抵接，對此部份進行加熱 ，使熱熔融劑層熔融後，利用冷卻來使熱熔融劑固化，用 以連接黏著材膠帶。 利用黏著材膠帶之基材黏著全部捲出之黏著材膠帶之 終端部及新裝著之黏著材膠帶之始端部，來實施黏著材盤 -40- 200823137 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。又 ，因爲無需每次更換新黏著材盤時都更換捲取盤、將新黏 著材之始端裝設至捲取盤、及捲附至導引銷之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第48項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，支持層夾於熱熔融劑層 之間。 此申請專利範圍第48項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之作用效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。又，因爲熱 熔融劑層形成於膠帶之縱向全體，重疊長度無需嚴格定位 ，故連接具有高自由度。 申請專利範圍第49項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，熱熔融劑層夾於支持層 之間。 此申請專利範圍第4 9項記載之發明時，除了具有和 申請專利範圍第47項記載之發明相同之作用效果以外， 黏著材膠帶之連接上，係在一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部互相抵接之位置上，利用黏 -41 - 200823137 著裝置之加熱加壓頭進行加熱。加熱時熱熔融劑會熔解滲 出，利用冷卻來使熱熔融劑固化，實施黏著材膠帶間之連 接。此時，因爲熱熔融劑層係夾於支持層之間，故可防止 熔融劑層曝露於大氣之下而因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層之黏著強度。 申請專利範圍第5 0項記載之發明，係用以連接捲取 至一方之盤之一方之黏著材膠帶、及捲取至另一方之盤上 之另一方之黏著材膠帶的黏著材膠帶連接方法，其特徵爲 ，黏著材膠帶具有以脫模劑實施表面處理之基材及黏著劑 ，除去其中任何一方之黏著材膠帶之基材端部之脫模劑， 使另一方之黏著材膠帶之黏著劑面重疊於該部份，以實施 兩者之重疊部份的加熱壓著來進行連接。 此申請專利範圍第5 0項記載之發明時，在其中任何 一方之黏著材膠帶之基材面上重疊另一方之黏著材膠帶之 黏著劑面，實施重疊部份之加熱壓著，利用連接全部捲出 之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部來 實施黏著材盤之更換，故很簡單即可將新黏著材盤裝著至 黏著裝置。 因爲無需每次更換新黏著材盤時都更換捲取盤、將新 黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路徑 設定導引銷等之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 又，在黏著材膠帶捲繞於盤上之狀態下，爲了避免黏 著劑面及基材面發生黏著，基材之表面上會塗布脫模劑。 -42- 200823137 本發明時，會除去一方之黏著材膠帶之脫模劑，並將另一 方之黏著材膠帶之黏著劑面重疊於該部份並進行黏著，故 黏著材膠帶間之連接十分簡單。 連接部份之加熱壓著上，若採用裝著著黏著材盤之黏 著裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第5 1項記載之發明，係如申請專利範 圍第50項記載之發明，其特徵爲，脫模劑之除去係利用 電漿放電、紫外線照射、雷射照射之其中任何一種方式來 實施。 此申請專利範圍第5 1項記載之發明時，除了具有和 申請專利範圍第5 0項記載之發明相同之作用效果以外， 因係利用電漿放電、紫外線照射、雷射照射之其中任何一 種方法來除去脫模劑，和以手剝離時相比，可以更短之時 間、更正確地除去脫模劑。 脫模劑之除去方法上，採用電漿放電時，係使處於電 漿狀態之氣體分解而成爲容易產生之狀態（激發狀態）， 並以對基材之表面實施放電來除去脫模劑。又，紫外線照 射時，例如，採用水銀燈當做光源，利用照射一定時間之 來自水銀燈之紫外線來實施。又，雷射照射時，係以利用 雷射振盪器照射之雷射光來對脫模劑進行加熱並使其熔解 ，用以除去脫模劑。 申請專利範圍第52項記載之發明，係將基材上塗布 著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材膠帶 盤，其特徵爲，黏著材膠帶盤之膠帶之寬度方向上配設著 -43- 200823137 複數之黏著材膠帶之捲部。 此申請專利範圍第52項記載之發明時，因配設著複 數之黏著材膠帶捲部（捲部），複數捲部當中之捲繞於一 方之捲部的黏著材膠帶全部捲出時，會捲取配置於全部捲 出之捲部之隔壁的另一方之捲部的黏著材膠帶並將其裝設 至盤。 如此，一方之黏著材膠帶全部捲出時，會將另一方之 黏著材膠帶裝設至盤，而實施黏著材膠帶之更換，故無需 將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少之新 黏著材膠帶盤之更換作業，故可提高電子機器之生產效率 〇 因爲係依序使用捲繞於複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第5 3項記載之發明，係如申請專利範 圍第52項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部之間具有用以連接 兩者之連結膠帶，一方之黏著材膠帶全部捲出時，會接著 開始捲出另一方之黏著材膠帶。 此申請專利範圍第5 3項記載之發明時，除了具有和 -44- 200823137 申請專利範圍第52項記載之發明相同之作用效果以外， 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 部係利用連結膠帶實施連接，一方之捲部之黏著材膠帶全 部捲出後，無需將另一方之捲部之黏著材膠帶捲取至盤之 裝設作業，故可進一步提高電子機器之生產效率。 申請專利範圍第54項記載之發明，係具有如申請專 利範圍第53項記載之黏著材膠帶盤、黏著材膠帶之捲取 盤、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將 黏著材膠帶之黏著材壓著至電子機器之電路基板上之壓著 部、以及用以檢測連結膠帶之膠帶檢測手段之黏著裝置， 其特徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶 通過壓著部爲止會將連結膠帶捲取至捲取盤。 此申請專利範圍第5 4項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部捲 出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，膠帶檢測手段上，例如黏著裝置具有一對發光部 及受光部，以光學方式檢測連結膠帶。另一方面，連結膠 帶之兩端配設著有顏色之（例如黑色）標記，受光部會利 用發光部發出之雷射光檢測連結膠帶兩端之標記來檢測連 結膠帶。又，除了在連結膠帶附加標記以外，可採用使連 結膠帶之寬度和黏著材膠帶之寬度不同的方法、或在連結 -45- 200823137 膠帶上形成複數之孔的方法。 申請專利範圍第5 9項記載之發明，係具有一方之盤 、另一方之盤、使一方之盤及另一方之盤連動旋轉之齒輪 單元、收容前述諸元件之殻體、配置於殼體之開口部之加 熱構件、以及對加熱構件供應電力之電源手段之黏著具， 其特徵爲，一方之盤上捲繞著在基材上塗布著黏著劑之黏 著劑膠帶，另一方之盤則固定著黏著劑膠帶之一端，加熱 構件具有利用供應之電力實施發熱之電熱構件，將捲取至 一方之盤上之黏著劑膠帶拉至殼體之開口部，以加熱構件 從基材側對位於開口部之黏著劑膠帶實施加熱加壓，將黏 著劑壓著至電路基板，以另一方之盤捲取黏著劑被剝離之 基材。 此申請專利範圍第5 9項記載之發明，在將黏著劑壓 著至電路基板時，係以單手握持殼體，將露出黏著劑膠帶 之開口部壓抵電路基板，配設於開口部之黏著劑膠帶基材 側之加熱構件會抵接位於開口部之黏著劑膠帶，而將黏著 劑壓著至電路基板。其次，在抵接位於加熱構件下之黏著 劑膠帶的情形下使黏著具前進，會從一方之盤拉出黏著劑 膠帶，而在從盤拉出黏著劑膠帶時，盤會旋轉，故固定於 一方之盤之同軸上的齒輪會旋轉，而和其齒合之另一方之 盤之齒輪亦會旋轉，以另一方之盤捲取黏著劑已被剝離之 基材。 對加熱構件之電力供應上，可以利用配設於殻體之開 關來切換電力之供應，或者，亦可在加熱構件上配設感壓 -46- 200823137 開關，加熱構件被推壓時，可感測到該推壓而對加熱構件 供應電力。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著，亦可以爲只有絕緣性黏著劑者，或者，爲 將絕緣性隔件粒子分散於黏著劑中者。 申請專利範圍第60項記載之發明，係塗布於基材上 之黏著材膠帶，其特徵爲，基材係金屬膜或芳香族聚醯胺 膜所構成。 此申請專利範圍第60項記載之發明時，因爲黏著材 膠帶之基材係採用金屬膜（或金屬箔）或芳香族聚醯胺膜 ，即使基材之厚度較薄時，亦可防止基材伸展或切斷等問 題。 因此，利用由厚度較薄之基材所構成之黏著材膠帶， 可以增加每1盤之捲數，而增加1盤可使用之黏著劑量。 又，使用本發明之黏著材膠帶，每1盤之捲數會增多，電 子構件之製造工廠只需較少新黏著材膠帶之更換次數即可 ，故可提高作業效率。此外，黏著材膠帶之製造上，因可 以減少製造之盤數，且可減少盤材及濕氣防止材之使用量 ，故可降低製造成本。 金屬膜應採用伸展性較高之金屬，例如，銅、鋁、不 銹鋼、鐵、錫等。 芳香族聚醯胺膜之具體實例如對位芳香族聚醯胺纖維 膜（MICTRON ; TORAY株式會社製商品名稱）等。 黏著劑係採用熱可塑性樹脂、熱硬化性樹脂、或熱可 -47- 200823137 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，熱硬化性樹脂系則以 環氧樹脂系、壓克力樹脂系、以及矽樹脂系爲代表。 黏著劑亦可分散著導電粒子。導電粒子係如Au、Ag 、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、或碳、 石墨等，亦可在前述之物及/或非導電性之玻璃、陶瓷、 塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 申請專利範圍第6 1項記載之發明，係如申請專利範 圍第60項記載之發明，其特徵爲，基材之厚度爲Ιμηι〜 2 5 μιη 〇 基材之厚度爲Ιμηι〜25μηι之理由如下，基材之厚度 低於1 μηι時，基材無法得到充分之拉伸強度，而容易斷裂 。又，基材之厚度若超過25 μπι時，每1盤之捲數方面無 法得到可滿足之捲數。 申請專利範圍第62項記載之發明，係如申請專利範 -48- 200823137 圍第60或61項記載之發明，其特徵爲，基材之拉伸強度 在25□時爲3 00MPa以上。 基材之拉伸強度爲3 00MPa以上之理由如下，基材之 拉伸強度小於3 00MPa時，基材容易延展，且黏著材膠帶 容易斷裂。 申請專利範圍第6 3項記載之發明，係如申請專利範 圍第60至62項之其中任一項記載之發明，其特徵爲，基 材對黏著劑之厚度比爲〇.〇1〜1.0。 基材對黏著劑之厚度比爲〇.〇1〜1.0之理由如下，基 材對黏著劑之厚度比低於〇.〇 1時，基材會太薄，而使黏 著材膠帶無法具有足充分之強度。又，基材對黏著劑之厚 度比超過1.0時，基材之厚度會過厚，每1盤之捲數會不 夠多。 申請專利範圍第64項記載之發明，係如申請專利範 圍第60至63項之其中任一項記載之發明，其特徵爲，基 材之表面粗細度Rmax爲〇·5μΠ1以下。 基材之表面粗細度Rmax應爲〇.5μιη以下之理由如下 ，Rmax若超過〇.5μιη，則因爲基材表面之凹凸，將黏著劑 壓著至電路基板時，黏著劑不易從基材分離。 申請專利範圍第65項記載之發明，係利用在基材上 塗布黏著劑並捲成盤狀之黏著材膠帶在被覆體上形成黏著 劑之黏著材膠帶黏著材形成方法，其特徵爲，分別從複數 盤拉出黏著材膠帶，使各黏著材膠帶重疊成一體，剝離一 方之基材即可在被覆體上形成重疊成一體之黏著劑。 -49- 200823137 此申請專利範圍第65項記載之發明時，從一方之盤 捲出之黏著材膠帶之黏著劑面、及從另一方之盤捲出之黏 著材膠帶之黏著劑面會重疊而使黏著材膠帶成爲一體。另 一方之黏著材膠帶之基材會會捲取至捲取用盤，而重疊成 一體之黏著材膠帶之黏著劑則會被加壓加熱頭壓著至被覆 體。被覆體係電子構件或電路基板，如引線框架或引線框 架之晶片等。 如此，在被覆體上形成黏著劑之前一步驟，可使一方 之黏著材膠帶之黏著劑、及另一方之黏著材膠帶之黏著劑 重疊，在得到期望之黏著劑厚度再在被覆體上形成黏著劑 ，在增多黏著材膠帶之捲數的情形，卻可縮小每1盤之黏 著材膠帶的捲繞直徑。因此，可增加每1盤之黏著材膠帶 之捲數，而大幅增加1次更換作業之可使用的黏著劑量。 因此，只需較少之新黏著材膠帶之更換作業即可，故可提 高電子機器之生產效率。 申請專利範圍第66項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，只有一方之黏著材膠帶 之黏著劑含有硬化劑。 此申請專利範圍第66項記載之發明時，除了具有和 申請專利範圍第6 5項記載之發明相同之作用效果以外， 因爲只有一方之黏著材膠帶之黏著劑含有硬化劑，故另一 方之黏著材膠帶之黏著劑不需要硬化劑。因此，未含有硬 化劑之黏著劑之黏著材膠帶無需低溫管理。因此，可減少 必須實施低溫管理之黏著材膠帶的數量，而可使黏著材膠 -50- 200823137 帶之運送及保管獲得有效率之管理。又，未調合硬化劑之 黏著材膠帶、及調合著硬化劑之黏著材膠帶的黏著劑，係 以不會和硬化劑產生反應之成分做爲另一方之黏著劑，除 了以不會和硬化劑產生反應之成分做爲硬化劑以外，尙以 使用之黏著劑做爲一方之黏著劑，故可提高黏著劑之保存 安定性。 申請專利範圍第67項記載之發明係向異導電材膠帶 ，其特徵爲，在芯材之縱向上實施具有膜狀黏著劑之向異 導電材之多數次捲繞積層。 又，申請專利範圍第6 8項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲’上述 向異導電材係在膜狀黏著劑之單面配設基材膜之2層構造 的向異導電材。 又，申請專利範圍第6 9項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶’其特徵爲’上述 向異導電材係在膜狀黏著劑之兩面配設基材膜之3層構造 之向異導電材。 又，申請專利範圍第7 0項記載之發明，係如申請專 利範圍第68或69項記載之向異導電材膠帶’其特徵爲’ 對基材膜之單面或兩面實施剝離處理° 又，申請專利範圍第7 1項記載之發明，係如申請專 利範圍第67至70項之其中任一項記載之向異導電材膠帶 ，膜狀黏著劑之寬度爲〇·5〜5mm° 又，申請專利範圍第7 2項記載之發明，係如申請專 -51 - 200823137 利範圍第68至7i項之其中任一項記載之向異導電材膠帶 ，基材膜之強度爲12kg/mm2以上、伸展爲60〜200%、厚 度爲100 μιη以下。其次，若基材膜爲有色透明或有色不透 明之著色時’很容即可實施基材膜及黏著劑之判別，又， 亦很容易判別捲出部之位置，故可提高作業性。 【實施方式】 其次’參照附錄圖面，針對本發明之實施形態進行說 明。又，以下之說明中，同一或同等之構成要素會附與相 同符號。 首先，參照第1圖〜第5圖，針對申請專利範圍第1 〜4項記載之發明之實施形態進行說明。 第1圖係第1實施形態之黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第2圖Α及Β係第1圖之連接部 份（A )之連接步驟圖，第2圖A係已使用之黏著材膠帶 之端膠帶的剖面斜視圖，第2圖B係反折已使用之黏著材 膠帶來連接新黏著材膠帶之斜視圖，第3圖係黏著裝置之 黏著劑壓著步驟的槪略圖，第4圖係電路基板間之黏著的 剖面圖，第5圖係黏著材膠帶之製造方法的步驟圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。亦即，各盤3、3 a具有捲軸5、及分別配置於黏著材膠 帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -52- 200823137 之黏著劑1 1所構成。 從強度、及構成向異導電 基材9應由OPP (延伸聚丙烯 處理之PET (聚對苯二甲酸乙 不限於此。 黏著劑1 1係採用熱可塑 熱可塑性樹脂及熱硬化性樹脂 可塑性樹脂系係以苯乙烯樹脂 硬化性樹脂系則以環氧樹脂系 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電3| Au、Ag、Pt、Ni、Cu、W、Sb 或碳、石墨等，亦可在前述之 、塑膠等高分子核材等覆蓋構 所構成之導電層等來形成導電) 絕緣層覆蓋前述導電粒子1 3 電粒子13及絕緣粒子等。在 膠等之高分子核材上形成導電 加壓而產生變形之變形性，故 ’連接時可增加和電路之接觸 其是，以高分子類做爲核材更 並沒有融點，在廣泛之連接溫 而可得到很容易即可對應電極 接構件。 材之黏著劑之剝離性而言， )、聚四氟乙烯、或經過矽 二酯）等所構成，然而，並 性樹脂、熱硬化性樹脂、或 之混合物、或熱金屬系。熱 系及聚酯樹脂系爲代表，熱 、乙烯基酯系樹脂、壓克力 空子1 3。導電粒子1 3係如 、Sn、焊錫等之金屬粒子、 物及非導電性之玻璃、陶瓷 成前述導電粒子1 3之材料 泣子1 3。此外，亦可應用以 之絕緣覆膜粒子、或倂用導 焊錫等之熱熔融金屬、或塑 層者，會具有因加熱加壓或 連接後之電極間距離會縮小 面積，而可提高信賴性。尤 佳，因導電粒子1 3如焊錫 度下亦可控制於軟化狀態， 之厚度及平坦性之誤差的連 -53- 200823137 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取 盤丨7裝著至黏著裝置1 5，將捲繞於盤3 a上之黏著材膠帶 1的前端經由導引銷22裝設至捲取盤17，並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加壓 頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1 壓著至電路基板21。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，必要時，可 將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭1 9對 電路基板2 1實施配線電路23之加熱加壓。利用此方式， 可連接電路基板21之電極21a及配線電路23之電極23a 〇 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第1圖）。 本發明之黏著材膠帶之連接方法可以分成下述2種， -54- 200823137 (a)直接使用捲取盤17，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶’並連接新黏著劑膠帶及捲取 盤17，（b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤1 7使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b)時，如第1圖所示，爲了將盤3a更換成新黏著 材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏著材 膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於新黏 著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1之始 端部3 2之連接。 此黏著材膠帶1之連接上，在露出已使用之盤3a之 黏著材膠帶1之結束標記28時，會如第2圖A所示，會 從黏著材膠帶1之結束標記2 8附近切斷（B ) ’並將黏著 材膠帶1之終端部3 0反折，使黏著材膠帶1之黏著劑1 1 面位於上側（第2圖B )。其次，將新黏著材盤3之黏著 材膠帶1之始端部3 2之黏著劑1 1面重疊於已使用之盤3 a 之黏著材膠帶1之終端部3 0之黏著劑1 1面上（第2圖B )° 其次，如第4圖所示，將兩者之重疊部份置於工作台 104上，以黏著裝置15之加熱加壓頭19實施加熱加壓進 行黏著。利用此方式，即可連接捲繞於已使用之盤3 a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1。其 次，將已使用之盤3 a及新盤3互相對換’將新盤3裝著 至黏著裝置15。因此，無需實施將黏著材膠帶1裝著至捲 -55- 200823137 取盤1 7之作業。又，因以黏著劑n面間之重疊來進行黏 著’故有較高之連接強度。 又’黏著材膠帶1上之結束標記28之位置，當黏著 材膠帶1從已使用之盤（黏著材膠帶1完全捲出之盤）3a 延伸至加熱加壓頭19爲止時，應爲從黏著材膠帶1固定 於已使用之盤3a上之固定位置至加熱加壓頭ip爲止之長 度的位置上。此時，從結束標記2 8之附近切斷，即使從 必要之最小位置切斷黏著材膠帶1，除了可防止黏著材膠 帶1之浪費以外，當可避免將拆下已使用之盤3a並移動 已使用之盤3 a使結束標記2 8到達加熱加壓頭1 9之位置 的繁複作業。 此實施形態時，因黏著裝置1 5具有加熱加壓頭1 9， 並利用此加熱加壓頭1 9來實施已使用之盤3 a之黏著材膠 帶1之終端部3 0之黏著劑1 1、及新黏著材盤3之黏著材 膠帶1之始端部32之黏著劑1 1的連接，故無需另外使用 以實施黏著劑1 1間之壓著爲目的之壓著用器具，即可實 施已捲繞著黏著材膠帶1之盤3、3a之更換。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤1 7之連接時’在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記2 8附近切斷’將殘留於捲取盤1 7側之黏著材 膠帶之終端部反折，使黏著劑1 1面成爲上側。其次’使 此黏著材膠帶1之終端部之黏著劑1 1面、及新黏著材盤3 -56- 200823137 之黏著材膠帶1之始端部3 2之黏著劑n面互相重疊。其 次，將兩者之重疊部份置於工作台104上，以黏著裝置15 之加熱加壓頭1 9進行加熱加壓實施黏著。利用此方式， 可連接捲繞於捲取盤1 7上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1。利用此方式，因爲捲取盤17只會捲 取基材9，故可捲取數個黏著材盤份，減少捲取盤1 7之更 換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上 ，或者，捲取至附側板之捲軸上，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-1 〇 °C )之管理並進行出貨。 其次，針對本發明之第2實施形態進行說明，以下之 說明係以和上述實施形態不同之點爲主。 第6圖所示之第2實施形態時，係利用新黏著材盤3 之黏著材膠帶1之始端部32具有之前導膠帶41，實施新 黏著材盤3之黏著材膠帶1、及捲繞於已使用之盤3a上之 黏著材膠帶1之連接。前導膠帶41係由基材63及其背面 之黏著劑43面所構成，新黏著材盤3之黏著材膠帶1之 始端部3 2，係利用前導膠帶41貼附於捲附至盤上之黏著 -57- 200823137 材膠帶1之基材9面來固定。其次，從基材9面剝離前導 膠帶4 1，並使其和反折之黏著材膠帶1之終端部3 0之黏 著劑1 1面重疊。將兩者之重疊部份置於工作台1 04上， 以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著。 如此，因爲利用黏著材膠帶1之前導膠帶41實施全部捲 出之黏著材膠帶1之終端部3 0、及新裝著之黏著材膠帶1 之始端部32的黏著，故黏著材膠帶1間之連接十分簡單 。此時，配設於前導膠帶4 1之基材63之背面側的黏著劑 43面具有黏著性，亦可只利用使其重疊於反折之黏著材膠 帶1之終端部3 0之黏著劑1 1面的方式來實施連接。 本發明並未受限於上述之實施形態，只要在未背離本 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，不反折捲繞於已使用 之盤3 a上之黏著材膠帶1，而如第7圖所示，從基材9面 剝離新裝著之黏著材膠帶1之始端部32之前導膠帶41， 並將其貼附於背面之黏著劑1 1面，使前導膠帶4 1連接於 已使用之黏著材膠帶1之終端部3 0之黏著劑1 1面，再以 黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著亦可 。此時，因無需反折全部捲出之黏著材膠帶1，故可防止 將黏著材膠帶1捲取至捲取盤時可能發生之捲取散亂。 此時，從基材9面剝離黏著材膠帶1之始端部32之 前導膠帶41，並將前導膠帶41黏著於已使用之黏著材膠 帶1之基材9面亦可。 其次，針對申請專利範圍第5〜8項記載之發明進行 -58- 200823137 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5〜8項記載之發明之背 景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 -59- 200823137 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5〜8項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照第8圖A〜C、第3圖〜第5圖，針對本 發明之第1實施形態進行說明。第8圖A〜C係第1實施 形態之黏著材膠帶之連接方法圖，第8圖A係黏著材盤間 之連接的斜視圖，第8圖B係第8圖A之連接部份之連接 方法的斜視圖，第8圖C係第8圖A之連接部份之平面圖 〇 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 -60- 200823137 7。本實施形態時，黏著材膠帶1之長度約爲50m W約爲5 m m。 黏著材膠帶1係由基材9、及塗布於基材9之 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 處理之PET (聚對苯二甲酸乙二酯）等所構成，然 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 或碳、石墨等，亦可在前述之物及非導電性之玻璃 、塑膠等高分子核材等覆蓋構成前述導電粒子13 所構成之導電層等來形成導電粒子1 3。此外，亦可 絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或 電粒子1 3及絕緣粒子等。在焊錫等之熱熔融金屬 膠等之高分子核材上形成導電層者，會具有因加熱 加壓而產生變形之變形性，故連接後之電極間距離 ，連接時可增加和電路之接觸面積，而可提高信賴 其是，以高分子類做爲核材更佳，因導電粒子1 3 、寬度 一側面 而言， 經過矽 而，並 脂、或 系。熱 表，熱 壓克力 3係如 粒子、 、陶瓷 之材料 應用以 倂用導 、或塑 加壓或 會縮小 性。尤 如焊錫 -61 - 200823137 並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤17，並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上，以配置於兩盤3 a、1 7間之加熱加壓 頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1 壓著至電路基板2 1。其後，將基材9捲取至捲取盤1 7。 上述壓著後（暫時連接），實施電路基板2 1之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，必要時，可 將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭1 9對 電路基板2 1實施配線電路23之加熱加壓。利用此方式， 可連接電路基板21之電極21a及配線電路23之電極23a 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 - 62- 200823137 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第8圖A )。 本發明之黏著材膠帶之連接方法可以分成下述2種， (a )直接使用捲取盤1 7，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤1 7，（ b )將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤1 7使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b )時，如第8圖A所示，爲了將盤3 a更換成新黏 著材盤3，在盤3a之黏著材膠帶1露出結束標記28時， 會實施盤3 a之黏著材膠帶（一方之黏著材膠帶）1之終端 部3 0、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之 黏著材膠帶）之始端部32之連接（參照第8圖A )。 此黏著材膠帶1之連接上，如第8圖B及C所示，會 針對黏著材盤3 a之黏著材膠帶1之終端部3 0、及新黏著 材盤3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著 劑1 1面重疊於終端部3 0之基材9面上。其次，將略呈3 字形之卡止銷46插入重疊部份，實施黏著材膠帶1之終 端部3 0、及新黏著材盤3之黏著材膠帶1之始端部3 2之 連接。 利用此方式，可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，可以卡止銷46固定已全部捲出之黏著材膠帶1之終 端部30、及新裝著之黏著材膠帶1之始端部32 ’故連接 -63- 200823137 十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤1 7之連接時’在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之始端 部32重疊。其次，將略呈3字形之卡止銷46插入兩者之 重疊部份，實施黏著材膠帶1之終端部3 0、及新黏著材盤 3之黏著材膠帶1之始端部3 2之連接。 因爲捲取盤17只會捲取基材9，故可捲取數個黏著材 盤份。因此，可減少捲取盤1 7之更換次數，而有良好之 作業效率。 其次，針對申請專利範圍第5〜8項記載之發明的第2 〜第4實施形態進行說明，以下說明之實施形態中’相同 部份會附與相同符號並省略該部份之詳細說明’以下之說 明係以和上述第1實施形態不同之點爲主。 第9圖所示之第2實施形態時，係利用具有配設於一 方及另一方之端部之爪部48、49、及連結兩端之爪部48 、4 9之彈性構件5 0的卡止構件4 7，實施一方之黏著材膠 帶1之終端部3 0及另一方之黏著材膠帶1之始端部3 2之 -64- 200823137 連接。具體而言，使一方之黏著材膠帶1之終端部3 〇及 另一方之黏著材膠帶1之始端部3 2互相抵接，使配設於 卡止構件47之一端之爪部4 8卡止於終端部3 0，並使配設 於另一端之爪部4 9卡止於始端部3 2，並以彈性構件5 〇拉 近一方之爪部48及另一方之爪部49。又，爪部48、47係 在板構件之背面配設前端爲尖形之複數爪5 1者。 因係使配設於卡止構件4 7之一端之爪部4 8卡止於終 端部3 0，並使配設於另一端之爪部4 9卡止於始端部3 2來 連接兩者，故連接十分容易。又’因爲一方之爪邰48及 另一方之爪部49之間具有彈性構件50，彈性構件50可伸 展而將卡止構件47之另一方之爪部49卡止於另一方之黏 著材膠帶1之始端部32之任意位置上，故連接具有高自 由度。 第1 0圖所示之第3實施形態時，會針對捲繞於已使 用之盤3a上之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑1 1 面重疊於終端部3 0之基材9面上，其次，以橫剖面略呈 3字形之可彈性變形之夾子5 3夾住重疊部份實施固定。 因爲只以夾子5 3夾住重疊部份來實施連接，故連接作業 十分容易。 第1 1圖所示之第4實施形態時，係在第1實施形態 中，以橫剖面略呈3字形之金屬製夾持片5 5覆蓋重疊部 份，並從重疊部份之兩面壓扁夾持片55來連接兩者。因 係從重疊部份之兩面壓扁夾持片5 5來實施連接，故可利 -65- 200823137 用重疊部份獲得強固之連接。 申請專利範圍第5〜8項記載之發明並未受限於上述 實施形態，只要未背離申請專利範圍第5〜8項記載之發 明之要旨的範圍內，可實施各種變形。 例如，上述之第1實施形態時’卡止銷46並非略呈 rj字形，而爲1支線狀銷亦可，此時，應以複數個銷來固 定重疊部份。 第2實施形態時，亦可配合黏著材膠帶1之寬度來使 用複數個卡止構件47。 第3實施形態及第4實施形態時’亦可使用複數個夾 子5 3或夾持片5 5，並分別從黏著材膠帶1之重疊部份之 兩側進行固定。 其次，針對申請專利範圍第9〜1 3項記載之發明進行 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第9〜1 3項記載之發明之背 景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開2001-284005號公報，係記載著將在基材上 -66 - 200823137 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 -67- 200823137 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第9〜1 3項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第9〜1 3項 記載之發明之實施形態進行說明，首先，參照第1 2圖A 、B、第3圖〜第5圖，針對申請專利範圍第9〜13項記 載之發明之第1實施形態進行說明。第1 2圖A〜C係第1 實施形態之黏著材膠帶之連接方法圖，第1 2圖A係黏著 材盤間之連接的斜視圖，第1 2圖B係第1 2圖A之連接部 份之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲5 0m、寬度 W約爲3mm。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 -68- 200823137 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂 硬化性樹脂系則以環氧樹脂系、乙烯基酯系 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等 或碳、石墨等，亦可在前述之物及/或非導 陶瓷、塑膠等高分子核材等覆蓋前述導電層 外，亦可應用以絕緣層覆蓋前述導電粒子之 、或倂用導電粒子及絕緣粒子等。在焊錫等 、或塑膠等之高分子核材上形成導電層者， 加壓或加壓而產生變形之變形性，故連接後 會縮小，連接時可增加和電路接觸之面積， 性。尤其是，以高分子類做爲核材更佳，如 點，在廣泛之連接溫度下亦可控制於軟化狀 很容易即可對應電極之厚度及平坦性之誤差 其次，針對本實施形態之黏著材膠帶之 說明。如第3圖所示，將黏著材膠帶1之盤 1 7裝著至黏著裝置1 5，捲繞於盤3 a上之黏 前端裝設至捲取盤7，並捲出黏著材膠帶1 箭頭E)。其次，將黏著材膠帶1配置於電 ，以配置於兩盤3 a、1 7間之加熱加壓頭1 9 施黏著材膠帶1之壓接，將黏著劑1 1壓著 。其後，將基材9捲取至捲取盤1 7。 上述壓著後（暫時連接），實施電路基 系爲代表，熱 樹脂、壓克力 :粒子13係如 之金屬粒子、 電性之玻璃、 等來形成。此 絕緣覆膜粒子 之熱熔融金屬 會具有因加熱 之電極間距離 而可提高信賴 焊錫因沒有融 態，而可得到 的連接構件。 使用方法進行 3 a、及捲取盤 著材膠帶1之 (第3圖中之 [路基板21上 從基材9側實 至電路基板2 1 板21之電極 -69- 200823137 及配線電路（電子構件）2 3之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑1 1上配置配線電路（或電子構件）2 3，必要時 ，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭 1 9對電路基板2 1實施配線電路2 3之加熱加壓。利用此方 式，可連接電路基板2 1之電極2 1 a及配線電路23之電極 23a ° 利用本實施形態之黏者材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第12圖A )。 申請專利範圍第9〜1 3項記載之發明之黏著材膠帶之 連接方法可以分成下述2種，（a )直接使用捲取盤1 7 ’ 更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠帶 ，並連接新黏著劑膠帶及捲取盤1 7，（ b )將已使用之黏 著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 〇 (b )時，如第12圖A所示，爲了將盤3 a更換成新 黏著材盤3,在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部3 〇、及捲繞於 -70- 200823137 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部32之連接（參照第12圖A)。 此黏著材膠帶1之連接上，如第12圖B所示，會針 對黏著材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材 盤3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑 11面重疊於終端部30之基材9面上。兩者之重疊長度Η 爲黏著劑膠帶1之寬度W的大約2.5倍，將其置於工作台 3 6上，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施 黏著。利用此方式，可實施捲繞於已使用之盤3 a上之黏 著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。 其次，將已使用之盤3 a及新盤3互相對換，將新盤3裝 著至黏著裝置1 5。因此，無需實施將新黏著材膠帶1裝著 至捲取盤1 7之作業。 此實施形態因係利用加熱加壓頭1 9，無需另行採用黏 著劑間之壓著用器具，即可更換捲繞著黏著材1之盤3、 3 a 〇 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記28附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之始端 部32互相重疊。其次，以黏著裝置15之加熱加壓頭19 對兩者之重疊部份進行加熱加壓實施黏著。因爲捲取盤1 7 -71 - 200823137 只會捲取基材9，故可捲取數個黏著材盤份，減少捲取盤 17之更換次數，而有良好之作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子1 3混合而成之黏著劑n，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶之原始材料，以切割機3 3切成特定寬 度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上， 或者’捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（-5°C〜-10°C )之管理並進行出貨。 其次，針對申請專利範圍第9〜1 3項記載之發明之其 他實施形態進行說明，以下說明之實施形態中，和上述實 施形態相同之部份會附與相同符號並省略該部份之詳細說 明，以下之說明係以和上述實施形態不同之點爲主。 第1 3圖所示之第2實施形態時，以表面爲參差不齊 (凹凸）44而爲互相嵌合之一方之模具56、及另一方之 模具5 7夾持黏著材膠帶1之重疊部份3 4，使重疊部份3 4 形成凹凸5 8。如此，利用形成凹凸5 8，可增加重疊部份 34之黏著面積，且利用重疊部份34之凹凸58的卡合可提 高拉伸方向（黏著材膠帶之縱向）之強度。形成凹凸時， 黏著劑1 1會流動而以黏著劑黏著重疊部份之端面間，可 進一步提高重疊部份34之拉伸方向的強度。 第1 4圖A及第1 4圖B所示之第3實施形態時，會將 -72- 200823137 捲取至新黏著材1之盤3之始端部32彎折成略呈v字形 ，捲繞於已使用之盤3a上之黏著材膠帶1之終端部30亦 彎折成略呈V字形，使兩者成爲鈎狀必須黏著劑1 1互相 相對並卡止（第1 4圖A )，以加熱加壓頭1 9實施加熱加 壓來連接兩者（第14圖B )。此第3實施形態時，因終 端部30及始端部32係以鈎狀連結而可獲得強固之連結， 同時，因利用黏著劑1 1之重疊來連接，故可得到更爲強 固之連接。和上述相同，因爲黏著劑會在重疊部份流動並 黏著端面，故可獲得更強固之連接。 第1 5圖A及第1 5圖B所示之第4實施形態，係在第 1實施形態之加熱加壓前、或加熱加壓之同時在重疊部份 3 4形成貫通孔5 9。利用形成貫通孔5 9，加熱加壓時可使 黏著劑1 1從貫通孔5 9之周圍滲出並實施黏著而提高黏著 力，重疊部34可獲得強固之連接。 申請專利範圍第9〜1 3項記載之發明並未受限於上述 之實施形態，只要不背離申請專利範圍第9〜1 3項記載之 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，凹凸5 8不必爲山型 ，亦可以爲具弧形之九形。 第4實施形態時，貫通孔59之數並無特別限制，可 以爲任何數量。又，貫通孔5 9之直徑並無限制。又，第2 、第3實施形態時，亦可進一步在重疊部份34上形成貫 通孔5 9。 其次，針對申請專利範圍第1 4〜1 8項記載之發明進 -73- 200823137 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。黏著材盤之裝著後， #自黏著材盤捲出之黏著材膠帶之基材側以加熱加壓頭將 黏著劑壓著至電路基板等上，再以捲取盤捲取殘餘之基材 〇 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 '及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 _占著裝置，將黏著材膠帶之始端經由黏著裝置之導引銷裝 設至捲取盤。 -74- 200823137 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，而可能 因爲黏著劑從膠帶兩側滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 另一方面，以黏黏著材膠帶貼附黏著材膠帶及黏著材 膠帶並無法充分黏著力實施黏著。爲了使黏著材膠帶具有 良好黏著材剝離性，會在其上塗布氟系脫模劑或砂系脫模 劑等，而上述情形就是因爲其影響。 因此，申請專利範圍第丨4〜1 8項記載之發明的目的 ，係在提供一種黏著材膠帶之連接方法，尤其是黏著材膠 帶之基材採用經過矽處理之基材時，亦可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第1 4〜1 8 -75- 200823137 項記載之發明之實施形態進行說明’首先’參照第1 6圖 A、B、第3圖〜第5圖，針對申請專利範圍第14〜1 8項 記載之發明之第1實施形態進行說明。第1 6圖A及B係 第1實施形態之黏著材膠帶之連接方法圖，第1 6圖A係 黏著材盤間之連接的斜視圖，第1 6圖B係第1 6圖A之連 接部份（b )之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏著材膠帶1係由矽處理基材9、及塗布於矽處理基 材9之一側面之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 矽處理基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 PET (聚對苯二甲酸乙二酯）等之基材所構成，其表面利 用矽樹脂等實施表面處理。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子n。導電粒子13係如 Au、Ag、Pt、Mi、Cii、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等筒分子核材等覆蓋前述導電層等來形成導電粒子 -76- 200823137 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所不，將黏著材膠帶1之盤3 a、及捲取盤 17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶1 之前端裝設至捲取盤17，並捲出黏著材膠帶1 (第3圖中 之箭頭E )。其次，將黏著材膠帶1配置於電路基板21 上，以配置於以配置於兩盤3 a、1 7間配置之加熱加壓 頭1 9從矽處理基材9側實施黏著材膠帶1之壓接，將黏 著劑1 1壓著至電路基板2 1。其後，將矽基材9捲取至捲 取盤1 7。 上述壓著後（暫時連接），實施電路基板2 1之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑1 1上配置配線電路（或電子構件）2 3，必要時 ’可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭 1 9對電路基板2 1實施配線電路23之加熱加壓。利用此方 -77- 200823137 式，可連接電路基板2 1之電極2 1 a及配線電路23之電極 23a 〇 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第16圖A )。 申請專利範圍第1 4〜1 8項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a )直接使用捲取盤1 7 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤1 7，（ b )將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 〇 (b )時，如第16圖A所示，爲了將盤3 a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部32之連接。 此黏著材膠帶1之連接上，如第16圖B所示，黏著 材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材盤3之 黏著材膠帶1之始端部3 2會互相抵接，以跨越兩黏著材 -78- 200823137 膠帶1、1之矽處理基材9、9之表面的方式貼附矽黏著膠 帶60，實施兩黏著材膠帶1、1之連接。 此矽黏著膠帶60係由基材63及塗布於基材63之單 面之矽黏著劑62所構成。基材63之材質並無特別限制， 然而，本實施形態係聚醯亞胺樹脂材。又，第1 6圖B中 ，黏著材膠帶之黏著劑1 1及矽黏著膠帶60之黏著劑部份 43分別以斜線表示。 此處，針對矽黏著膠帶60之黏著進行說明。一方及 另一方之黏著材膠帶1、1之矽處理基材9、9因爲分別覆 蓋著矽，故難以利用黏著劑進行黏著，然而，本實施形態 時，因矽黏著膠帶60之黏著劑43係採用矽樹脂，兩矽處 理基材9、9之表面張力差會較小，利用密著（黏著）可 使一方之黏著材膠帶1之終端部30及另一方之黏著材膠 帶1之始端部3 2有良好之連接。矽黏著膠帶60之矽黏著 劑62表面、及矽處理基材9、9表面之表面張力差應爲 1 OmN/m ( 10dyne/cm)以下，本實施形態時，幾乎沒有表 面張力差。 一般而言，一方之黏著材膠帶1之終端部3 0及另一 方之黏著材膠帶1之兩矽處理基材9、9之表面張力爲 25mN/m〜60mN/m(25〜60dyne/cm)，例如，表面張力爲 30mN/m時，矽黏著膠帶60之矽黏著劑62之表面張力應 設定成20mN/m以上、40mN/m以下。 矽系黏著劑主要係由矽橡膠及矽樹脂所構成，一般而 言，係使兩者產生少許縮合反應而具有黏著性，其次，利 -79- 200823137 用過氧化物、白金觸媒之矽氫化反應使其交聯，玻璃轉移 溫度爲-100°c以下者。上述皆爲市販品，可選擇適當者使 用。 如此，利用矽黏著膠帶60實施捲繞於已使用之黏著 材盤3 a上之黏著材膠帶1、及捲繞於新黏著材盤3上之黏 著材膠帶1之連接。其次，將已使用之黏著材盤3 a及新 黏著材盤3互相對換，將新黏著材盤3裝著於黏著裝置15 。因此，無需拉出新黏著材盤3之黏著材膠帶1並將黏著 材膠帶裝著至捲取盤1 7、或將新黏著材膠帶1裝設至黏著 裝置1 5之導引銷3 6之作業，故黏著材盤3、3 a之更換有 良好之作業效率。如此，因爲已全部捲出之黏著材膠帶1 之終端部3 0、及新裝著之黏著材膠帶1之始端部3 2係以 矽黏著膠帶進行連接，故連接十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需將新黏著材膠帶1裝著至 捲取盤1 7之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，已使用之盤3 a 之黏著材膠帶1之結束標記28露出時’會在黏著材膠帶1 之結束標記2 8附近實施切斷，使殘留於捲取盤1 7側之黏 著材膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之 始端部3 2互相抵接。其次’在兩者之抵接部份利用矽黏 著膠帶實施黏著材膠帶1之終端部3 G、及新黏著材盤3之 -80- 200823137 黏著材膠帶1之始端部3 2的連接。因爲捲取盤1 7只會捲 取基材9，故可捲取數個黏著材盤份，減少捲取盤1 7之更 換次數，而有良好之作業效率。 其次，參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後，以捲取機3 1捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機3 3切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者， 捲取至附側板之捲軸上，將其和除濕材一起綑包，實施低 溫（-5°C〜-l〇°C )之管理並進行出貨。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第1 7圖所示之第2實施形態時，除了如上述之第1 實施形態以外，在一方之黏著材膠帶1之終端部3 0、及另 一方之黏著材膠帶之始端部32之黏著劑1 1面側亦貼附著 矽黏著膠帶60。此第2實施形態之矽黏著膠帶60之矽黏 著劑6 2，其黏著力爲1 〇 〇 g / 2 5 m m以上，本實施形態時則 爲700g/25mm〜1400g/25mm。又，砂黏著膠帶60之砂黏 著劑62之表面張力的設定上，係和上述實施形態相同’ 一方及另一方之黏著材膠帶之矽基材之表面張力差爲 -81 - 200823137 10mN/m ( lOdyne/cm)以下。此第2實施形態時，一方之 黏著材膠帶1之終端部3 〇及另一方之黏著材膠帶之始端 邰32之兩面’因以矽黏著膠帶60實施黏著，可以較第1 實施形態更高之強度來實施兩黏著材膠帶1、1之黏著。 第1 8圖所示之第3實施形態，係以重疊方式配置一 方之黏著材膠帶1之終端部30及另一方之黏著材膠帶1 之始端部3 2 ’其矽處理基材9側面及黏著材1 1側面則貼 附著第2實施形態之矽黏著膠帶6〇，利用此第3實施形態 ，可獲得和第2實施形態相同之作用效果。 第1 9圖所示之第4實施形態，係在一方之黏著材膠 帶1之終端部3 0、及另一方之黏著材膠帶i之始端部3 2 之間，存在基材之兩面塗布著矽黏著劑62之矽黏著膠帶 6 1，用以連接終端部3 0及始端部3 2。利用此第4實施形 態，因係使用兩面之矽黏著膠帶6 1，一方之黏著材膠帶1 之終端部3 0及另一方之黏著材膠帶1之始端部3 2的連接 更爲十分簡單且容易。 其次，針對申請專利範圍第1 9〜2 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 9〜2 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( -82- 200823137 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法’係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 -83- 200823137 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第1 9〜2 1項記載之發明的目的 ，係黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第1 9〜第 2 1項記載之發明之實施形態進行說明，首先，參照第20 圖A〜C、第2 1圖、第4圖、及第5圖，針對申請專利範 圍第1 9〜2 1項記載之發明之第1實施形態進行說明。第 20圖A〜C係本實施形態之黏著材膠帶之連接方法圖，第 20圖A係黏著材盤間之連接的斜視圖，第20圖B及C係 第20圖A之連接部份之連接方法的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7 ° 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由opp (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， -84- 200823137 並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層而形成者。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小，連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點， 在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很容 易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第21圖所示，將黏著材膠帶1之盤3 a、及捲取 盤1 7裝著至黏著裝置1 5，將捲繞於盤3 a上之黏著材膠帶 1之前端經由導引銷2 2裝設至捲取盤1 7 ’並捲出黏著材 膠帶1(第21圖中之箭頭E)。其次’將黏著材膠帶1配 置於電路基板21上，利用配置於兩盤3、1 7間之加熱加 -85- 200823137 壓頭19從基材9側實施黏著材膠帶1之壓接，將黏著劑 11壓著至電路基板21。其後，將基材9捲取至捲取盤17 〇 上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）2 3，必要 時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭19對電路基板21實施配線電路23之加熱加壓。利用 此方式，可連接電路基板2 1之電極2 1 a及配線電路23之 電極2 3 a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第20圖A )。 申請專利範圍第1 9〜2 1項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a )直接使用捲取盤1 7 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17，（ b )將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 -86- 200823137 (b )時，如第20圖A所示，爲了將盤3 a更換成新 黏著材盤3，在盤3a之黏著材膠帶1露出結束標記28時 ’盤3a之黏著材膠帶（一方之黏著材膠帶）1之終端部 3〇、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之黏 著材膠帶）1之始端部3 2係利用樹脂製黏著劑64實施連 接。 樹脂製黏著劑64係例如環氧樹脂、氰酸樹脂、二馬 來醯亞胺樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂、醇酸 樹脂、壓克力樹脂、不飽和聚酯樹脂、苯二酸二烯丙酯樹 脂、矽樹脂、間苯二酚甲醛樹脂、二甲苯樹脂、呋喃樹脂 、聚胺酯樹脂、酮樹脂、三聚烯丙基胺氰樹脂等。 此黏著材膠帶1之連接如第2 0圖B所示，針對黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑1 1面重 疊於終端部3 0之基材9面。其次，利用組合於黏著裝置 1 5之充塡機65將糊狀之樹脂製黏著劑64塗布於重疊部份 。其次，如第20圖C所示，此樹脂製黏著劑64爲熱硬化 性樹脂時，利用組合於黏著裝置1 5之加熱器66之加熱實 施硬化，連接黏著材膠帶1之終端部3 0、及新黏著材盤3 之黏著材膠帶1之始端部32。 利用此方式，可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，以樹脂製黏著劑64固定已全部捲出之黏著材膠帶1 -87- 200823137 之終端部30、及新裝著之黏著材膠帶1之始端部32，故 連接十分簡單。 其次，將已使用之盤3 a及新盤3互相對換’將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤1 7之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，已使用之盤3 a 之黏著材膠帶1之結束標記28露出時會從黏著材膠帶1 之結束標記2 8附近實施切斷，使殘留於捲取盤1 7側之黏 著材膠帶之終端部30及新黏著材盤3之黏著材膠帶1之 始端部32重疊。其次，在兩者之重疊部份塗布糊狀之樹 脂製黏著劑64，依據使用之樹脂製黏著劑之種類實施加熱 、紫外線照射等使其發揮黏著力，實施終端部30、及新黏 著材盤3之黏著材膠帶1之始端部3 2之連接。因爲捲取 盤1 7只會捲取基材9，故可捲取數個黏著材盤份，減少捲 取盤1 7之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子1 3混合而成之黏著劑n，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶之原始材料，以切割機3 3切成特定寬 度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上， -88- 200823137 或者，捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（-5°έ〜-1 〇°c )之管理並進行出貨。 申請專利範圍第1 9〜2 1項記載之發明並未受限於上 述之實施形態，只要未背離申請專利範圍第1 9〜2 1項記 載之發明之要旨的範圍內，可實施各種變形。 本實施形態時，樹脂製黏著劑64係以熱硬化性樹脂 爲例，然而，亦可以光硬化性樹脂取代熱硬化性樹脂，以 紫外線等之光照射實施硬化性樹脂之硬化，實施黏著材膠 帶1間之連接。 此時，光硬化性樹脂可採用在具有丙烯酸基或甲基丙 烯酸基之樹脂調合光聚合起動劑之組成物、或含有芳香族 重偶氮鹽、二烯丙基碘氫基鹽、鎏鹽等光硬化劑之環氧樹 脂等。 又，樹脂製黏著劑亦可採用以乙烯乙酸乙烯酯樹脂或 聚烯烴樹脂爲主成分之熱金屬黏著材，例如板狀之熱金屬 黏著材時，將板狀之熱金屬黏著劑置於黏著材膠帶1間之 重疊部份上，以加熱器6 6對熱金屬黏著劑進行加熱使其 熔融後，再以冷卻使熱金屬黏著劑固化，實施黏著材膠帶 1間之連接。 使用於黏著材膠帶1之連接之樹脂製黏著劑，亦可從 熱硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑所構成之 群組中選取複數種來使用。 上述之實施形態時，使黏著材盤3 a之黏著材膠帶1 之終端部30之基材9面、及新黏著材盤3之黏著材膠帶1 -89- 200823137 之始端部3 2之黏著劑1 1面互相重疊，並塗布樹脂製黏著 劑之熱硬化性樹脂來實施連接，然而，亦可反折黏著材盤 3 a之黏著材膠帶1之終端部3 0，並以重疊黏著劑丨1面來 實施兩者之黏著後，再以熱硬化性樹脂固定。 其次，針對申請專利範圍第22〜24項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶盤及黏著裝置相關。 其次，針對申請專利範圍第22〜24項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從黏著材膠帶盤捲出之黏 著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基板 等，再以捲取盤捲取殘餘之基材。 -90- 200823137 其次，一方之黏著材膠帶盤之黏著材膠帶用完時， 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 路基板之黏著面積亦增大，一次使用之黏著劑的使用量 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可會g 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸 會增大，可能因無法裝著於既存之黏著裝置上而無法使 既存之黏著裝置。 因此，申請專利範圍第22〜24項記載之發明的目 ，係在提供一種黏著材膠帶盤、及黏著裝置，可使黏著 膠帶盤之更換更爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第22〜 項記載之發明之實施形態進行說明，首先，參照第22 拆 著 於 電 亦 亦 換 法 帶 its 頻 使 亦 用 的 材 24 圖 -91 - 200823137 A〜C、第23圖、第4圖、及第5圖，針對申請專利範 第22〜24項記載之發明之第1實施形態進行說明。第 圖A〜C係第1實施形態之黏著材膠帶盤圖，第22圖 係黏著材膠帶盤的斜視圖，第22圖B係第22圖A之正 圖，第22圖C係第22圖A之連結膠帶之平面圖，第 圖係黏著裝置之黏著劑壓著步驟的槪略圖。 如第2 2圖A所示，本實施形態之黏著材膠帶盤A 有複數之黏著材膠帶之捲部（以下簡稱爲捲部）2、2a 捲部2、2 a之盤3、3 a上分別捲繞著黏著材膠帶1。各 3、3a上配設著捲軸5、及配置於黏著材膠帶1之兩寬 側之側板7。如第23圖所示，黏著材膠帶！係由基材9 及塗布於基材9之一側面的黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部3 0、 捲繞於另一方之捲部之黏著材膠帶（以下稱爲另一方之 著材膠帶）1之始端部3 2間，配設著用以連接兩者之連 膠帶41。從一方之黏著材膠帶1之終端部3 〇沿著盤3 側板7之內側面配置著連結膠帶6 7，前述連結膠帶6 7 卡止於側板7之上部之切口部份68而連接於另一方之 著材膠帶1之始端部3 2。 又，一方及另一方之黏著材膠帶1、及連結膠帶67 連接部份，會標示著用以辨識連結膠帶67之標記69、 ’以膠帶檢測手段（發光部7 1、受光部72 )檢測到標 69、70時’會跳過連結膠帶67部份而不對連結膠帶67 圍 22 A 面 23 具 ， 盤 度 著 及 黏 結 之 會 黏 之 70 記 部 -92- 200823137 份實施壓著。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由opp (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Six、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 '塑膠等高分子核材等覆蓋前述之導電層等而形成者。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶盤A之使用方法 進行說明。如第2 3圖所示，將黏著材膠帶盤A、及捲取 -93- 200823137 盤17裝著至黏著裝置15，經由導引銷22將一方之黏著材 膠帶1之始端部32裝設至捲取盤17，並捲出黏著材膠帶 1 (第23圖中之箭頭E )。其次，將黏著材膠帶1配置於 電路基板2 1上，利用配置於兩盤3、1 7間之加熱加壓頭 19從基材9側實施黏著材膠帶1之壓接，將黏著劑11壓 著至電路基板21。其後，將基材9捲取至捲取盤17。 上述之壓著後（暫時連接），實施電路基板2 1之電 極及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）23，必要 時，可將例如聚四氟乙烯材24當做緩衝材，以加壓加壓 頭19對電路基板21實施配線電路23之加熱加壓。利用 此方式，可連接電路基板2 1之電極2 1 a及配線電路23之 電極2 3 a及奁連接。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ’一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦會變 多’捲繞於盤3上之黏著材膠帶1在相對較短之時間內會 被捲取至捲取盤17。 一方之黏著材膠帶1全部捲出時，連結膠帶67會脫 離切口部份68，接著，會捲出另一方之黏著材膠帶1。本 實施形態時，因爲在一方之黏著材膠帶1之終端部3 〇及 另一方之黏著材膠帶1之始端部3 2之間，具有用以連接 -94- 200823137 兩者之連結膠帶67,故一方之黏著材膠帶1全部捲出 會接著開始捲出另一方之黏著材膠帶1。因此，無需 在一方之黏著材膠帶1之全部捲出後將新黏著材膠帶 設至捲取盤1 7之作業，故可提高電子機器之生產效等 又，如第23圖所示，黏著裝置15具有一對發光 及受光部72，用以實施連結膠帶67之光學檢測。用 接一方之黏著材膠帶1及另一方之黏著材膠帶1之兩 連結藤帶67之兩端上，標示著黑色標記69、70。發 7 1會對黏著材膠帶1連續發出雷射光，受光部7 2則 收其反射光，並將檢測信號傳送至控制裝置79。受 72會接收到連結膠帶67之兩端之標記69、70之反射 並將該檢測信號傳送至控制裝置7 9。 接收到檢測信號之控制裝置79，會對用以驅動黏 置1 5之兩盤3、17之馬達輸出控制信號，利用馬達 器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達 器施加之脈衝數實施旋轉，使兩盤3、1 7以比通常速 快之速度移動，並使黏著材膠帶1朝捲出方向移動對 結膠帶67之長度的距離。 利用此方式，另一方之黏著材膠帶1會自動捲出 熱加壓頭1 9之位置，可省略以使另一方之黏著材膠 之始端部3 2位於加熱加壓頭1 9之位置而捲出連結膠 之作業。 又，因爲捲取盤17只會捲取基材9，故可捲取數 著材膠帶盤份而減少捲取盤1 7之更換次數，而有良 時， 實施 1裝 ：〇 部71 以連 者的 光部 會接 光部 光， 著裝 驅動 驅動 度更 應連 至加 帶1 帶67 :個黏 好之 -95- 200823137 作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶盤 A之製造方法進行說明。 在i/t捲出機25捲出之基材（separat〇r) 9上，以塗布 機2 7塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後，以捲取機3丨捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機3 3切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者， 捲取至附側板之捲軸上，將其和除濕材一起綑包，實施低 溫（-5°C〜-10°C )之管理並進行出貨。 其次’針對申請專利範圍第22〜24項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第24圖所示之第2實施形態時，因爲連結膠帶67之 寬度T小於前後之黏著材膠帶1之寬度W，故可辨識連結 膠帶67。又，黏著裝置15上，夾著黏著材膠帶1之相對 位置上配設著和第1實施形態相同之發光部及受光部。此 時，利用受光部接收透射連結膠帶67之寬度較狹部份的 雷射光來辨識連結膠帶6 7。 第25圖所示之第3實施形態時，連結膠帶67會形成 用以辨識連結膠帶67之多數孔5 3。此時，亦可利用受光 部接收透射連結膠帶67之孔53的雷射光來辨識連結膠帶 67 〇 -96- 200823137 第26圖所示之第4實施形態時，並未利用連 67實施黏著材膠帶i間之連接，而在一方之黏著材 全部捲出時’捲出另一方之黏著材膠帶丨使其捲附) 上來實施黏著材膠帶1之更換。此時，因爲無需將 材膠帶盤裝著至黏著裝置，而只需較少之新黏著材 之更換作業，故可提高電子機器之生產效率。 申請專利範圍第22〜24項記載之發明並未受 述之實施形態，只要在未背離申請專利範圍第22〜 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之第1及第2實施形態時，捲部2 個數並無任何限制，而可以爲任何個數。 第1至第3實施形態係以光學方式檢測連結膠； 然而，亦可在連結膠帶67上附加磁性膠帶並以磁 器來進行檢測。 其次，針對申請專利範圍第2 5〜2 8項記載之 行說明。 這些發明係關於電子構件及電路基板、或電路 之黏著固定、以及兩者之電極間之電性連接的黏著 。又，係關於在將半導體元件（晶片）黏著·固定 框架之固定用支持基板或引線框架之晶片、或半導 載置用支持基板之半導體裝置上所使用之黏著材膠 其是，和捲成盤狀之黏著材膠帶盤、黏著裝置、及 膠帶之連接方法相關。 其次，針對申請專利範圍第25〜28項記載之 結膠帶 膠帶1 玲盤17 新黏著 膠帶盤 限於上 - 24項 、2a之 f 67， 性感測 發明進 基板間 材膠帶 至引線 體元件 帶，尤 黏著材 發明之 -97- 200823137 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、L0C膠帶、晶粒結著膠帶、微 BGA · CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統電極連接用黏著材膠帶之寬度爲1〜3mm程 度，捲取至盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出之 黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基 板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 -98- 200823137 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第2 5〜2 8項記載之發明的目的 ，係在提供一種黏著材膠帶盤、黏著裝置、及連接方法， 可使黏著材膠帶盤之更換更爲簡單，而提高電子機器之生 產效率。 其次，參照附錄圖面，針對申請專利範圍第25〜28 項記載之發明之實施形態進行說明，首先，參照第27圖 A〜C、第28圖、第4圖、第29圖、及第5圖，針對申請 專利範圍第2 5〜2 8項記載之發明之第1實施形態進行說 明。第27圖A〜C係第1實施形態之黏著材膠帶盤圖，第 27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 ，第28圖係黏著裝置之黏著劑壓著步驟的槪略圖，第29 -99- 200823137 圖係PDP之黏著劑之使用狀態的斜視圖。 本實施形態之黏著材膠帶盤A具有複數之黏著材膠帶 1之捲部（以下稱爲捲部）2、2a，捲部2、2a具有捲繞著 黏著材膠帶1之盤3、3a。各盤3、3a上配設著捲軸5、 及配置於黏著材膠帶1之兩寬度側之側板7。如第28圖所 示，黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部3 0、及 捲繞於另一方之捲部2a之黏著材膠帶（以下稱爲另一方 之黏著材膠帶）1之始端部3 2係以卡止具76實施連接。 卡止具76係例如剖面略呈3字形之卡止銷，使一方之黏 著材膠帶1之終端部3 0及另一方之黏著材膠帶1之始端 部3 2互相重疊，將卡止銷插入此重疊部份來連接兩者。 其次，本實施形態時，連接部份74如第27圖C所示 ，以卡止具76連接終端部30及始端部32之後，將連接 部份74朝膠帶之縱向反折1 8 0度，使黏著材膠帶1覆蓋 卡止具76。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏著劑1 1係熱可塑性樹脂、熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 -100- 200823137 苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹脂系 則以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表。 黏著劑11內亦可分散著導電粒子13。導電粒子13係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶盤之使用方法進 行說明。如第28圖所示，將黏著材膠帶盤A、及捲取盤 17裝著至黏著裝置15，經由導引銷22將一方之黏著材膠 帶1之始端部3 2裝設至捲取盤1 7，並捲出黏著材膠帶1 (第28圖中之箭頭E )。其次，將黏著材膠帶1配置於 電路基板21上，以配置於兩盤3、1 7間之加熱加壓頭1 9 從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著 至電路基板21。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 -101 - 200823137 著劑1 1上配置配線電路（或電子構件）2 3，可將 乙烯材2 4當做緩衝材，以加熱加壓頭1 9對電路3 實施配線電路23之加熱加壓。利用此方式，可連 基板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1 ; 26之連接部份所示，黏著劑11係壓著於PDP 26 全體，故一次使用之黏著劑1 1之使用量明顯遠大: 上之使用量。因此，黏著材膠帶1之使用量亦會變 繞於盤3、3 a上之黏著材膠帶1在相對較短之時間 捲取至捲取盤1 7。 本實施形態時，一方之黏著材膠帶1全部捲出 接部份74會脫離切口 75，接著，會捲出另一方之 膠帶1 (第27圖B )。本實施形態時，係以卡止具 接一方之黏著材膠帶1之終端部3 0及另一方之黏 帶1之始端部32，一方之黏著材膠帶1全部捲出時 著開始捲出另一方之黏著材膠帶1。因此，無需實 方之黏著材膠帶1之全部捲出後將新黏著材膠帶1 捲取盤17之作業，故可提高電子機器之生產效率 連接部份74上因以黏著材膠帶1覆蓋卡止具76， 良好，同時，可防止連接部份74之卡止具76接觸 膠帶1而傷害到黏著材膠帶1。 又，如第28圖所示，黏著裝置15具有當做連 測感測器47使用之厚度檢測感測器，實施連接部份 光學檢測，使加熱加壓頭1 9跳過連接部份74。一 聚四氟 板21 接電路 之PDP 之周圍 於傳統 多，捲 內會被 時，連 黏著材 76連 著材膠 ，會接 施在一 裝設至 。又， 故外觀 黏著材 接部檢 • 74之 方之黏 -102- 200823137 著材膠帶1及另一方之黏著材膠帶1之連接部份74的厚 度，如第27圖C所示’會大於黏著材膠帶1之厚度，以 檢測不同厚度來辨識連接部份74。厚度檢測感測器47會 隨時檢測黏著材膠帶1之厚度，並將檢測信號傳送至控制 裝置79。 接收到檢測信號之控制裝置79，會對用以驅動黏著裝 置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅動 器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅動 器施加之脈衝數實施旋轉，使兩盤3、1 7以比通常速度更 快之速度旋轉，並使黏著材膠帶1朝捲出方向移動對應連 接部份74之搬運方向之長度的特定距離。 利用此方式，另一方之黏著材膠帶1會移動至加熱加 壓頭19之位置，故可防止一方及另一方之黏著材膠帶1 之連接部份74移至加熱加壓頭1 9之位置並執行壓著動作 之問題。又，至連接部份41通過加熱加壓頭1 9爲止，會 自動地將一方之黏著材膠帶1捲取至捲取盤1 7，故可省略 捲取之麻煩。 又，利用厚度檢測感測器47辨識連接部份74之前端 部4 1 a及後端部4 1 b，並只避開連接部份7 4 ’則可有效利 用黏著材膠帶1。 又，因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤1 7之更換次數’而有良好之 作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 -103- 200823137 之製造方法進行說明。 在丫皮捲出機25捲出之基材（separator) 9上，以塗布 機2 7塗布樹脂及導電粒子1 3混合之黏著劑，並以乾燥爐 2 9實施乾燥後，以捲取機31捲取原始材料。被捲取之黏 著材膠帶之原始材料，以切割機3 3切成特定寬度並捲取 至捲軸後，從兩側將側板7、7裝著於捲軸上，將其和除 濕材一起綑包，實施低溫（-5 °C〜-1 0 °C )之管理並進行出 貨。 其次，針對申請專利範圍第2 5〜2 8項記載之發明之 其他貝ί也形悲進丫了 g兌明’和上述貫施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第3 0圖所示之第2實施形態時，未使用具有複數捲 部2、2a之黏著材膠帶盤a，而使用具有1個捲部之黏著 材膠帶盤2c。此時，黏著材膠帶1係捲繞於捲取盤1 7， 當一方之黏著材膠帶1露出結束標記28時，爲了將一方 之黏著材膠帶盤2b更換至新黏著材膠帶盤2c，而連接一 方之黏著材膠帶1之終端部30、及另一方之黏著材膠帶1 之始端部3 2。 此時，亦利用連接部檢測手段之厚度檢測感測器77 檢測連接部份74，而使加熱加壓頭1 9避開連接部份74。 申請專利範圍第25〜28項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第2 5〜2 8項 記載之發明之要旨的範圍內，可實施各種變形。 -104- 200823137 例如，上述之第1及第2實施形態時，用以連接黏著 材膠帶1間之卡止具76並未限定爲卡止銷，其方法亦可 以橫剖面略呈3字形之可彈性變形之夾子來夾住並固定兩 者之重疊部份，或者，亦可以橫剖面略呈3字形之金屬片 夾住兩者之重疊部份，並從重疊部份之兩面壓扁夾持片來 連接兩者。 第1及第2實施形態係利用厚度檢測感測器47檢測 連接部份74之厚度來辨識連接部份74，然而，並不限於 此，亦可利用透射率檢測感測器來辨識連接部份74、或利 用CCD攝影機使連接部份之表面呈現於監視畫面並以圖 素之濃淡比較來檢測連接部份。 第31圖A、第31圖B、第32圖A〜C係用以實施引 線框架之固定用支持基板、半導體元件載置用支持基板、 或引線框架之晶片和半導體元件之連接之黏著材膠帶當中 ，將半導體元件黏著·固定於引線框架之固定用支持基板 及引線框架之LOC ( Lead on Chip )構造之1實例。 實施厚度50μχη之表面處理之聚醯亞胺膜等支持膜78 之兩面，係採用兩面具有厚度2 5 μηι之聚醛亞胺系黏著劑 層等之黏著劑層80之具有如第31圖Α之構成之黏著材膠 帶，而可得到第31圖B所示之LOC構造之半導體裝置。 將第31圖A所示之黏著材膠帶，以第32圖A〜C所示之 黏著裝置之冲切模具87 (公模（凸部）95、母模（凹部） 96)冲切成細長形，例如，在厚度0.2mm之鐵-鎳合金製 引線框架上，以400 °C、3 MPa之壓力、3秒鐘之加壓實施 -105- 200823137 壓著，形成〇.2mm間隔、〇.2mm寬度之內引線，製成附有 半導體用黏著膜之引線框架。其次，在其他步驟實施350 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半導體元件壓 著至此附有半導體用黏著膜之引線框架之黏著劑層面，其 後，以金線實施引線框架及半導體元件之絲焊，以連續成 形使用環氧樹脂成形材料等密封材實施密封，得到第3 1 圖B所示之半導體裝置。第31圖A、B中，81係以黏著 材膠帶冲切所得之半導體用黏著膜，82係半導體元件，8 3 係引線框架，8 4係密封材，8 5係焊絲，8 6係匯流排條。 第32圖A、B、C係黏著裝置，第32圖A、B中，87係 冲切模具，8 8係引線框架搬運部，6 1係黏著劑膠帶冲切 貼附部，9 0係加熱器部，9 1係黏著材膠帶盤（黏著材膠 帶捲出部），92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第3 2圖C中，94係黏著材 膠帶（半導體用黏著膜），95係公模（凸部），96係母 模（凹部），97係膜壓板。黏著材膠帶92會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部89冲切成細長形且黏著至引線框架之引線部 份，將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接·黏著。黏著材膠帶只單純用 -106- 200823137 於黏著·固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第29〜34項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著劑膠帶 ，尤其是，和捲成盤狀之黏著劑膠帶、黏著劑膠帶之製造 方法、及黏著劑膠帶之壓著方法相關。 其次，針對申請專利範圍第29〜34項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度，黏著劑膠帶被從盤捲出並將 黏著劑壓著至電路基板等後，即不再使用。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，上述之電子機器之製造工廠之捲繞著黏著劑 -107- 200823137 膠帶之盤的更換更爲頻繁，因爲新盤之更換十分麻煩，故 有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膜的壓力會升高，而可能從 黏著劑膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著劑膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第29〜3 4項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在無需增加黏著劑膠帶之捲數 的情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第29〜34 項記載之發明之實施形態進行說明，首先，參照第3 3圖 A、B、第3圖、第4圖、第34圖、第5圖、第35圖，針 對申請專利範圍第29〜34項記載之發明之第1實施形態 進行說明。第3 3圖A及B係黏著劑膠帶圖，第3 3圖A 係捲繞著黏著劑膠帶之盤之斜視圖，第3 3圖B係第3 3圖 A之A-A剖面圖，第34圖係PDP之黏著劑之使用狀態的 斜視圖，第3 5圖係在基材上塗布黏著劑之步驟的剖面圖 -108- 200823137 本實施形態之黏著劑膠帶1係捲繞於盤3，盤3上配 設著捲軸5及配置於黏著劑膠帶1之兩寬度側之側板7。 本實施形態時，黏著劑膠帶1之長度約爲5 0m、寬度W約 爲 1 Omm 〇 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑1 1所構成，基材9上以具有間隔之方式配置著每條寬 度爲0.5 mm之5條黏著劑1 1。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用義可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠#之筒分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 -109- 200823137 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶之使用方法進行 說明。將黏著劑膠帶1之盤3、及空盤1 7裝著至黏著裝置 1 5，將捲繞於盤3之黏著劑膠帶1之前端裝設至空盤1 7， 並捲出黏著劑膠帶1(第3圖中之箭頭E)。其次，在電 路基板2 1上配置黏著劑膠帶1，以配置於兩盤3、1 7間之 加熱加壓頭1 9從基材9側實施將黏著劑膠帶1之壓接， 將1條份之黏著劑1 1壓著至電路基板。其後，將殘餘黏 著劑1 1和基材9 一起捲取至空盤1 7。 上述之壓著後（暫時連接），實施電路基板2 1之電 極及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上’在壓著於電路基板2 1上之黏著劑1 1上 配置配線電路（或電子構件）2 3，必要時，可將例如聚四 氟乙烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 i 實施配線電路23之加熱加壓。利用此方式，可連接電路 基板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對Pdp之周圍全體實施黏著，一 次使用之黏著劑1 1之使用量會遠大於傳統之使用量。因 此’捲繞於盤3上之黏著劑膠帶1之使用量亦會變多，捲 繞於盤3上之黏著劑膠帶1在相對較短之時間內會被捲取 -110- 200823137 至空盤17，盤3會變成空的。 當盤3變成空的時，分別使盤3及盤17逆轉，此時 ，會以空的盤3捲取，而使黏著劑膠帶1朝相反方向移動 (第3圖中之箭頭F )。 如此，每1條黏著劑U都會依序改變黏著劑膠帶1 之捲取方向（E、F)，而將黏著劑1 1壓著至電路基板2 1 〇 此處，參照第5圖及第3 5圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。如 第3 5圖所示，相對於基材9之1 0mm寬度配置著5個塗 布機27，塗布10mm寬度之5條黏著劑1 1。被捲取之黏 著劑膠帶之原始材料，以切割機3 3切成特定寬度並捲取 至捲軸後，從兩側將側板7、7裝著於捲軸上，或者，捲 取至附側板之捲軸上，將其和除濕材一起綑包，實施低溫 (-5°C〜-l〇°C )之管理並進行出貨。 其次，針對申請專利範圍第2 9〜3 4項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第36圖A〜C所示之第2實施形態時，黏著劑膠帶1 之基材之單面全面上塗布著寬度W之黏著劑，利用形成 -111 - 200823137 於基材之縱向的縫隙3 5將黏著劑隔離成寬度W方向上之 複數條。此第2實施形態之黏著劑膠帶1時，縫隙3 5應 在將盤3裝著於黏著裝置1 5後、將黏著劑膠帶1壓著至 電路基板21之前一瞬間形成。此時，亦可在黏著裝置15 之盤裝著部附近（如第3圖之S所示）裝設工作面而在捲 出之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在 第5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙 者捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機3 1 捲取之前一瞬間形成縫隙者。 將第2實施形態之黏著劑膠帶1使用於黏著裝置1 5 時，和第1實施形態相同，以縫隙3 5隔離之黏著劑會逐 條以加熱加壓頭1 9從基材9側實施壓著，而如第3 6圖A 、：B、C所示，依序逐條使用。 此第2實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到複數條之黏著 劑1 1，十分容易製造。 第3 7圖A〜C所示之第3實施形態時，基材9之全面 塗布著黏著劑11(第37圖A)，基材9及黏著劑11之寬 度W，係和上述實施形態相同之5〜1 000mm。其次，使用 時亦和第1實施形態相同，將其裝著至黏著裝置1 5，將從 盤3捲出之黏著劑膠帶1配置於電路基板21上，對黏著 劑膠帶1之寬度W方向之部份黏著劑（1條份）實施加熱 加壓（第3 7圖B )，降低該部份之凝聚力，只有加熱加 壓之部份黏著劑會從基材剝離而壓著至電路基板2 1 (第 112- 200823137 37 圖 C )。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線，實施加熱加壓部份之全部黏著劑應爲呈現軟化流動（ 簡易指標爲1 〇〇〇泊以下）而未開始黏著劑之硬化反應、 或低位狀態（簡易指標爲反應率20%以下），加熱溫度應 對應使甩之黏著劑系來進行選擇。 此第3實施形態時，黏著劑1 1在使用時，只有在寬 度W當中之1條份會軟化流動化且被壓著至基板電路， 故和上述之實施形態相同，只要利用黏著劑膠帶1之盤3 及空盤的正轉及逆轉，即可使用複數次份。 又，如上述之實施形態在黏著劑1 1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑11即可，故黏著劑膠帶之製造十分容易。 第3 8圖A〜C所示之第4實施形態，係第1實施形態 之黏著劑膠帶的其他製造方法，在塗布於基材9a上之黏 著劑11上形成縫隙98後（第3 8圖A )，以使黏著劑1 1 夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另一方 之基材9b (第38圖B)。其次，剝離一方及另一方之基 材9a、9b，各基材9a、9b上會以間隔1條之式配置著黏 著劑條1 1 a、1 1 b。此第4實施形態時，爲了在一方及另一 方之基材9a、9b上交互配置黏著劑條11a、lib，可從一 方之基材9 a或9 b側以間隔1條之方式實施黏著劑條1 1 a 、1 1 b之加熱加壓，而將黏著劑條1 1 a、1 1 b以間隔1條之 方式配置於各基材9a、9b上。 -113- 200823137 申請專利範圍第29〜3 4項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第29〜34項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 上述之實施形態時，形成於基材9上之黏著劑的條數 可以爲任意條，至少爲2條以上即可。 其次，針對申請專利範圍第3 5〜4 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 、黏著劑膠帶之製造方法、及黏著劑膠帶之壓著方法。 其次，針對申請專利範圍第3 5〜4 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電獎顯示面板）、EL( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 -114- 200823137 黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第3 5〜4 1項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在未增加黏著劑膠帶之捲數的 情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第3 5〜4 1 項記載之發明之實施形態進行說明，首先，參照第3 9圖 A、B、第40圖、第34圖、第5圖、第41圖，針對申請 專利範圍第3 5〜4 1項記載之發明之第1實施形態進行說 明。第3 9圖A及B係黏著劑膠帶圖，第3 9圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從從黏著劑側 觀看第39圖A之黏著劑膠帶時之平面圖，第40圖係黏著 -115- 200823137 裝置之黏著劑壓著步驟的斜視圖。 本實施形態之黏著劑膠帶1係捲繞於盤3上者’盤3 上配設著捲軸5、及配置於黏著劑膠帶1之兩側的側板7 。本實施形態時，黏著劑膠帶1之長度約爲5 0m，寬度W 則爲和電路基板之一邊大致相同尺寸之約1 500mm。 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑1 1所構成，基材9上之膠帶之寬度方向上，以等間隔 方式配置著1條寬度爲〇.5mm之黏著劑1 1。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由〇 P P (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化，桂樹脂之混合物、或熱金屬系。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表， 又，熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基 酯系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層而形成者。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 -116- 200823137 或加壓而產生變形之變形性’故連接後之電極間距離 小，連接時可增加和電路接觸之面積’而可提高信賴 尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 在廣泛之連接溫度下亦可控制於軟化狀態’而可得到 易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶1之使用方 行說明。將黏著劑膠帶1之盤3、及空盤1 7裝著至黏 置1 5，將捲繞於盤3上之黏著劑膠帶1之前端裝設 17並捲出黏著劑膠帶1(第40圖中之箭頭E)。其 在電路基板2 1上配置黏著劑膠帶1，以配置於兩盤3 間之加熱加壓頭1 9從基材9側實施黏著劑膠帶1之 ，將1條份之黏著劑1 1壓著至黏著劑膠帶之寬度方 之電路基板之一邊，只有該條份之黏著劑11會被捲 空盤17。 其次，將電路基板21旋轉約9 0度，使電路基右 之鄰邊位於黏著劑膠帶1之寬度方向上，利用加熱加 1 9將黏著劑1 1壓著至電路基板2 1之另一邊。如此， 路基板2 1旋轉約90度並壓著黏著劑1 1，可將黏著| 壓著至電路基板21之四周。 上述壓著後（暫時連接），實施電路基板2 1之 及配線電路（電子構件）2 3之電極的定位並進行正式 。正式連接上，將黏著劑1 1壓著至電路基板2 1之四 ，在黏著劑1 1上配置配線電路（或電子構件）2 3， 時，可將例如聚四氟乙烯材2 4當做緩衝材，以加熱 會縮 性。 點， 很容 法進 著裝 空盤 次， 、17 壓接 向上 取至 X 21 壓頭 將電 in η 電極 連接 周後 必要 加壓 -117- 200823137 頭1 9對電路基板21實施配線電路2 3之加熱加壓（參照 第4圖）。利用此方式，可連接固定電路基板21之電極 21a及配線電路23之電極23a。 如第34圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑11之使用量會遠大於傳統之使用量。然 而，因爲黏著劑膠帶1之寬度W和電路基板21之一邊之 I 長度H大致相等，即使和黏著劑膠帶1之寬度w較大之 傳統者相同之捲數，其黏著劑量亦遠多於傳統之物，故盤 之更換次數遠少於傳統之物。 此處，參照第5圖及第41圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子1 3混合而成之黏著劑1 1，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。塗 布機27會左右移動，以等間隔在基材9上塗布條狀黏著 劑。被捲取之黏著劑膠帶之原始材料，以切割機3 3切成 特定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲 軸上，或者，捲取至附側板之捲軸上，將其和除濕材一起 綑包，實施低溫（-5°C〜-10°C )之管理並進行出貨。 其次，針對申請專利範圍第3 5〜4 1項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 -118- 200823137 第44圖A〜C所示之第5實施形態，係第i實施形態 之黏著劑膠帶1之其他製造方法，在塗布於基材9a上之 黏著劑1 1上形成縫隙98後（第44圖A )，以使黏著劑 1 1夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另一 方之基材9b (第44圖B)。其次，剝離一方及另一方之 基材9a、9b，各基材9a、9b上會以間隔1條之方式配置 著黏著劑條11 a、1 1 b。此第5實施形態時，爲了在一方及 另一方之基材9a、9b上交互配置黏著劑條1 ia、1 lb，亦 可從一方之基材9a或9b側以間隔1條之方式實施黏著劑 條1 1 a、1 1 b之加熱加壓，而將黏著劑條1 1 a、1 1 b依序貼 附至各基材9a、9b。 申請專利範圍第3 5〜4 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第3 5〜4 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 其次，針對申請專利範圍第42〜46項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 盒、及利用黏著劑膠帶盒之黏著劑壓著方法。 其次，針對申請專利範圍第42〜46項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( -121 - 200823137 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏者面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第42〜46項記載之發明的目的 ，係在提供一種黏著劑膠帶盒、及利用黏著劑膠帶盒之黏 -122- 200823137 著劑壓著方法，可在未增加黏著劑膠帶之捲數的情形下 加黏著劑量，且盤之更換更爲簡易。 其次，參照添附圖面，針對申請專利範圍第4 2〜 項記載之發明之實施形態進行說明，首先，參照第45 A、B、第46圖、第47圖、第4圖、第34圖、及第48 ，針對申請專利範圍第42〜46項記載之發明之第1實 形態進行說明。爲了說明上之方便，針對黏著劑膠帶配 2條黏著劑時進行說明，然而，亦可形成複數條。第45 A及B係申請專利範圍第42〜46項記載之發明之第1 施形態之黏著劑膠帶盒圖，第45圖A係黏著劑膠帶盒 斜視圖，第45圖B係第45圖A之A-A切剖面圖，第 圖係第4 5圖A及B所示之膠帶盒之盤裝設狀態的剖面 ，第47圖係黏著裝置之黏著劑壓著步驟的正面圖，第 圖係黏著劑膠帶盒之製造方法的步驟圖。 本實施形態之黏著劑膠帶盒1 〇〇之主要構成係一方 盤3、另一方之盤17、以及收容前述盤之殻體99，一方 盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之另一端9a 固定於另一方之盤17。 殼體99之一側會形成開口 1 1，可從此開口 1 1拉出 著劑膠帶1。又，開口 1 1之兩側則配設著用以導引黏著 膠帶1之移動的導引件3 1、3 1。 殼體99係由半殼體99a、99b嵌合而成，配設於黏 裝置27 (後述）上之滑軸17 (參照第46圖）嵌插於一 及另一方之盤3、5上，而嵌合於各盤3、5。 增 46 圖 圖 施 置 圖 實 之 46 圖 48 之 之 則 黏 劑 著 方 -123- 200823137 此處，參照第46圖針對各盤3、5、及各盤3、5及殻 體99之嵌合進行說明。各盤3、5之內緣側會形成可嵌合 黏著裝置2 7之滑軸1 7的嵌合條1 9，而外圍側則會形成以 可旋轉之方式嵌合於殼體99之突部7c的嵌合溝21。 如第45圖B所示，黏著劑膠帶1之基材9之單面上 ，在寬度方向上會塗布著2條並排之黏著劑11a、lib。2 條黏著劑1 1 a、1 1 b間會有間隔。 本實施形態時，黏著劑膠帶1之長度約爲5 0 m，寬度 W則約爲4mm。各條黏著劑1 la、1 lb之寬度約爲1 .2mm 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ’熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基酯 系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子丨3係如 An、Ag、pt、Ni、cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳 '石墨等’亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層等來形成。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 -124 - 200823137 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 塑膠等之高分子核材上形成導電層者，會具有因加熱 或加壓而產生變形之變形性，故連接後之電極間距離 小，連接時可增加和電路接觸之面積，而可提高信賴 尤其是，以局分子類做爲核材更佳，焊如焊錫因沒有 ，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 容易即可對應電極之厚度及平坦性之誤差的連接構件 其次，針對本實施形態之黏著劑膠帶盒1 00之使 法進行說明。如第47圖所示，將黏著劑膠帶盒1 00 至黏著裝置27。黏著裝置27以具有間隔之方式配設 用之滑軸17、17 (參照第46圖），使滑軸17、17卡 黏著劑膠帶盒1〇〇之各盤3、5。因此，黏著劑膠帶盒 之裝著只需單觸即可完成，而無需實施傳統上將捲繞 之黏著劑膠帶1之另一端9a裝設至空盤之作業等。 其次，從黏著劑膠帶盒1 〇〇拉出黏著劑膠帶1， 黏著裝置27之導引件31、31。 其次，驅動黏著裝置27之滑軸1 7捲出黏著劑膠 (第47圖之箭頭E方向），將黏著劑膠帶1配置於 基板2 1上，以加熱加壓頭1 9從基材9側實施黏著劑 1之壓接，寬度方向之一側上的1條份黏著劑1 1 a被 至電路基板21之一邊，殘餘之1條黏著劑1 1 b及基 會被捲取至另一方之盤1 7。如此，可將黏著劑1 1 a壓 電路基板2 1之四周。 其次，在捲繞於一方之盤3之黏著劑膠帶1全部 、或 加壓 會縮 融點 到很 〇 用方 裝著 著盒 合於 100 於盤 々Μ 牙過 帶1 電路 膠帶 壓著 材9 著至 捲出 -125- 200823137 後，將黏著劑膠帶盒1 〇〇拆下並以反向裝著，重複上述之 步驟。黏著劑膠帶上形成2條以上之黏著劑時，可改變寬 度方向之位置依序或以間隔方式實施壓著。 上述壓著後（暫時連接），實施電路基板2 1之電極 3 3 a及配線電路（電子構件）3 7之電極3 7a的定位並進行 正式連接。正式連接上，在將黏著劑11a壓著至電路基板 2 1之四周後，在黏著劑1 1 a上配置配線電路（或電子構件 )3 7，必要時，可將例如聚四氟乙烯材3 9當做緩衝材， 以加熱加壓頭1 9對電路基板21實施配線電路23之加熱 加壓（參照第4圖）。利用此方式，可連接固定電路基板 21之電極33a及配線電路23之電極37a。 如第34圖所示，利用本實施形態之黏著劑膠帶盒i 00 實施黏著之PDP 26之連接部份，在本實施形態中係會黏 著於PDP 26之周圍全體，一次使用之黏著劑11的使用量 會遠大於傳統上之使用量。然而，因爲黏著劑膠帶1之寬 度W方向上配置著2條黏著劑1 1 a、1 1 b，即使爲和傳統 相同之捲數，其黏著劑量可爲傳統之2倍，故可減少盒之 更換次數。 又，黏著劑膠帶1係採用盒1之型式，故更換、處理 、及裝著都十分容易，而具有良好之作業性。 此處，參照第48圖，針對本實施形態之黏著劑膠帶 盒1 0 〇之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機2 8塗布由樹脂及導電性粒子3 〇混合而成之黏著劑i i -126- 200823137 ’並以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料 。塗布機28會在基材9上塗布多數條黏著劑。被捲取之 黏著劑膠帶之原始材料，整修步驟時，以切割機3 3切成 特定寬度（2條黏著劑條之寬度）並捲取至盤3後，以夾 於半殼體99a、99b之間的方式嵌合盤3及空盤5，製成黏 著劑膠帶盒100。 將黏著劑膠帶盒1 〇 〇和除濕材一起綑包，實施低溫 (-5°C〜-10°C )之管理並進行出貨。 其次’針kf申請專利範圍第4 2〜4 6項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第49圖所示之第2實施形態時，係一次即將黏著劑 11壓著至電路基板21之一邊全體者，黏著裝置27上配設 著可從黏著劑膠帶盒1 0 0拉出很長之黏著劑膠帶1的導引 件1 〇 1。此第2實施形態時，因係一次即將黏著劑壓著至 電路基板2 1之一邊全體，而有良好之作業效率。 第5 0圖所示之第3實施形態時，在基材9之單面全 面塗布寬度W之黏著劑1 1，並利用縫隙1 02將黏著劑分 隔成2條。此第3實施形態之黏著劑膠帶1時，縫隙1 02 應形成於將黏著劑膠帶盒裝著至黏著裝置27後、將 黏著劑膠帶1壓著至電路基板21之前一瞬間。此時，亦 可在黏著裝置27之盒裝著部附近（如第47圖之S所示） 裝設工作面而在捲出之黏著劑膠帶1之黏著劑1 1上形成 -127- 200823137 縫隙1 02，亦可將第4 8圖所示之黏著劑膠帶之製造時之整 修步驟中形成縫隙者捲取至盤3者，亦可在塗工步驟乾燥 後，以捲取機3 1捲取之前一瞬間形成縫隙1 02者。 此第3實施形態時’只需在以和傳統相同之步驟所得 到之基材9上之黏著劑1 1形成縫隙1 02，即可得到2條黏 著劑11a、lib，十分容易製造。 第5 1圖A及B所示之第4實施形態時，基材9之單 面全面塗布著黏著劑1 1 (第5 1圖A )，將收容此黏著劑 膠帶1之黏著劑膠帶盒1 〇〇以和第1實施形態相同之方式 裝著至黏著裝置27，對黏著劑膠帶1之寬度w方向之部 份黏著劑1 1 ( 1條份）實施加熱加壓，降低該部份之凝聚 力，只有加熱加壓之部份黏著劑1 1 a會從基材9剝離而壓 著至電路基板21(第51圖B)。 此時，會沿著加熱加壓頭1 9之周圍形成凝聚力降低 線1 03 (第5 1圖A )，實施加熱加壓部份之全部黏著劑應 爲呈現軟化流動（簡易指標爲1 〇 〇 〇泊以下）而未開始黏 著劑之硬化反應、或低位狀態（簡易指標爲反應率20%以 下），加熱溫度應對應使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，只有寬度 W方向之1條份2 5 a會軟化流動化而被壓著至基板電路。 其次，針對申請專利範圍第47〜49項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板同 間之黏著固定及兩者之電極間之電性連接的黏著材膠帶， -128 - 200823137 尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第47〜49項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 -129- 200823137 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第47〜49項記載之發明的目的 ，係在提供一種黏著材膠帶，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第47〜49 項記載之發明之實施形態進行說明。 參照第52圖A、B、第3圖、第4圖、第29圖、及 第5圖，針對申請專利範圍第47〜49項記載之發明之第1 實施形態進行說明。第5 2圖A及B係本實施形態之黏著 材膠帶之連接圖，第52圖A係黏著材盤間之連接的斜視 圖，第5 2圖B係第5 2圖A之連接部份的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7 ° 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -130- 200823137 之黏著劑Π所構成。 基材9具有支持層9 b、及從兩側夾住前述支持層 之熱熔融劑層（熱金屬層）9a’構成熱熔融劑層9a之 熔融劑（熱金屬）係採用熱可塑性樹脂之聚乙烯、S B S 苯乙烯丁二烯苯乙烯嵌段共聚物）、耐綸等，支持層 則係使用OPP (延伸聚丙烯）、聚四氟乙烯、或PET( 對苯二甲酸乙二酯）等之塑膠、玻璃纖維、芳香族聚醯 纖維、或碳纖維等之強化纖維。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又、熱硬化性 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 子、或碳、石墨等，亦可在前述之物及/或非導電性之 璃、陶瓷、塑膠等高分子核材等覆蓋前述之導電層而形 者。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱 融金屬、或塑膠等之高分子核材上形成導電層者，會具 因加熱加壓或加壓而產生變形之變形性，故連接後之電 間距離會縮小，連接時可增加和電路接觸之面積，而可 局is fe性。尤其是，以高分子類做爲核材更佳，如焊錫 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 9b 熱 ( 9b 聚 胺 或 系 樹 表 係 业丄 玻 成 覆 熔 有 極 提 因 而 -131 - 200823137 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取盤 17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶1 之前端經由導引銷22裝設至捲取盤7，並捲出黏著材膠帶 1(第3圖中之箭頭E)。其次，將黏著材膠帶1配置於 電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加壓頭1 9 從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著 至電路基板2 1。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路23之加熱加壓。利用此方式，可連接電路基 板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP. 26之連接部份所示，黏著劑11會壓著至PDP 26之周圍 全體，一次使用之黏著劑1 1的使用量會明顯大於傳統上 之使用量。因此，捲繞於盤3 a上之黏著材膠帶1之使用 量亦會變多，因爲捲繞於盤3a上之黏著材膠帶1會在相 對較短之時間內被捲取至捲取盤1 7，而露出捲繞於盤3 a 上之黏著材膠帶1之結束標記2 8 (參照第5 2圖A )。 如第52圖A所示，在盤3a之黏著材膠帶1露出結束 標記2 8時，爲了將盤3 a更換成新黏著材盤3，連接盤3 a -132- 200823137 之黏著材膠帶（一方之黏著材膠帶）1之終端部30、及捲 繞於新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶 )1之始端部3 2。 此黏著材膠帶1之連接上，如第52圖B所示’針對 黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑1 1 面重疊於終端部3 0之基材9之熱熔融劑層9a上，並將此 部份置於工作台104上。其次，以黏著裝置15之加熱加 壓頭1 9實施重疊部份之加熱，使熱熔融劑層9 a熔融後， 利用冷卻來使熱熔融劑固化，實施終端部3 0及始端部3 2 之連接。利用此方式，可實施捲繞於已使用之盤3 a上之 黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接 〇 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。又，因爲捲取盤17係只捲取基材 9，故可捲取數個黏著材盤份，減少捲取盤1 7之更換次數 ，而有良好之作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子丨3混合而成之黏著劑u，並 以乾燥爐29實施乾燥後，以捲取機3丨捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 -133- 200823137 寬度並捲取至捲軸後，從兩側將側板裝著至捲軸， 除濕材一起綑包，實施低溫（-5 t〜-10 °C )之管理 出貨。 其次，針對申請專利範圍第47〜49項記載之 其他實施形態進行說明，以下說明之實施形態中， 實施形態相同之部份會附與相同符號並省略該部份 說明，以下之說明係以和上述實施形態不同之點爲: 第5 3圖所示之第2實施形態時，黏著材膠帶 材9上，熱熔融劑層9 a會夾於支持層9 b之間。此 第3圖所示，爲了實施黏著材膠帶1間之連接，在 黏著材膠帶1之終端部3 0及另一方之黏著材膠帶 端部3 2互相抵接之位置上，以黏著裝置1 5之加熱 1 9實施熱熔融劑層9a之加熱。實施加熱會使熱熔 熱熔融劑層9a滲出，利用冷卻來使熱熔融劑固化 黏著材膠帶1間之連接。如此，因熱熔融劑層9a 支持層9b之間，而可防止因爲濕氣之吸濕或灰塵 著而降低熱熔融劑層9a之黏著強度。 申請專利範圍第47〜49項記載之發明並未受 述之實施形態，只要在未背離申請專利範圍第47 " 記載之發明之要旨的範圍內，可實施各種變形。 第1實施形態時，基材9係由支持層9b、及從 住支持層9b之熱熔融劑層9a之3層所構成，然而 限於此，亦可以爲4層以上。 本實施形態時，連接部份之加熱壓著係利用黏 將其和 並進行 發明之 和上述 之詳細 t ° 1之基 時，如 一方之 1之始 加壓頭 融劑從 ，實施 係夾於 等之附 限於上 -49項 兩側夾 ，並不 著裝置 -134- 200823137 1 5之加熱加壓頭1 9，然而，亦可採用其他加熱器來取代 加熱加壓頭1 9，對連接部份進行加熱，實施黏著材膠帶1 間之連接。 其次，針對申請專利範圍第50〜51項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著•固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板之半導體裝置上所使用之黏著材膠帶，尤其是 ，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第50〜51項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又，黏著材膠帶亦被應用於引線框架之引線固定膠帶 、：LOC膠帶、晶粒結著膠帶、微BGA · CSP等之黏著膜等 ，其目的則在提高半導體裝置全體之生產性及信賴性。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統之黏著材膠帶，爲了避免黏著劑固著於基材 上、或較容易剝離，會在基材之兩面實施矽處理。 -135- 200823137 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上’拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新黏著材盤裝著至黏著裝置’ 並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5 0〜5 1項記載之發明的目的 -136- 200823137 ，係提供一種黏著材膠帶之連接方法，可使黏著材盤之 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第5 0〜 項記載之發明之實施形態進行說明。首先，參照第54 A〜C、第55圖、第56圖、第4圖、及第29圖，針對 請專利範圍第5 0〜5 1項記載之發明之第1實施形態進 說明。第54圖A〜C係第55圖之連接部份之連接步驟 剖面圖，第5 4圖A係放電前之黏著材膠帶之狀態，第 圖B係放電後之黏著材膠帶之狀態，第54圖C係連接 份之加熱壓著圖。第5 5圖係黏著材膠帶連接方法之黏 材盤間之連接的斜視圖，第56圖係黏著裝置之黏著劑 著步驟的槪略圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側 7 ° 黏著材膠帶1係由基材9、及塗布於基材9之一側 之黏著劑1 1所構成。 從強度、及黏著劑1 1之剝離性而言，基材9應採 OPP (延伸聚丙烯）、聚四氟乙烯、及PET (聚對苯二 酸乙二酯）等，以脫模劑9a實施表面處理。脫膜劑係 用烯系脫模劑、乙二醇廿八碳酸酯、棕櫚蠟、石油系蠟 低融點蠟、低分子量氟樹脂、矽系或氟系之界面活性劑 油、蠟、樹脂、聚酯變性矽樹脂等，一般爲矽樹脂。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、 更 5 1 圖 串 行 的 54 部 著 壓 上 板 面 用 甲 採 等 或 -137- 200823137 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 月曰系係以環氧樹脂系、壓克力樹脂系、及砂樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小’連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點’在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第5 6圖所示，將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷2 2裝設至捲取盤1 7，並捲出黏著材 膠帶1(第56圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上，利用配置於兩盤3、17間之加熱加 壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑 -138- 200823137 11壓著至電路基板21。其後，將基材9捲取至捲取盤17 〇 其次’如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路23之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP 26之周圍 全體，可知一次使用之黏著劑1 1的使用量會遠大於傳統 上之使用量。因此，捲繞於盤3a上之黏著材膠帶1之使 用量亦會增多，捲繞於盤3a上之黏著材膠帶1在相對較 短之時間內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上 之黏著材膠帶1之結束標記2 8 (參照第5 5圖）。 如第5 5圖所示，爲了將盤3 a更換成新黏著材盤3， 會在盤3a之黏著材膠帶1上連接盤3a之黏著材膠帶（一 方之黏著材膠帶）1之終端部3 0、及捲繞於新黏著材盤3 上之黏著材膠帶（另一方之黏著材膠帶）1之始端部32。 此黏著材膠帶1之連接上，如第5 4圖B所示，將已 使用之盤3 a之黏著材膠帶1之終端部3 0置於放電機1 0 5 之照射位置。其次，對基材9之表面實施放電，去除脫模 劑9a 〇200823137 IX. [Technical Field] The present invention relates to an electronic component and a circuit board, Or the adhesion between the circuit boards, And an adhesive tape for electrically connecting the electrodes of the two, Its connection method, Production method, Pressing method, Adhesive tape tray, Adhesive device, Adhesive tape box, And using the adhesive pressing method thereof, especially, And a roll of adhesive tape, Its connection method, Production method, Pressing method, Adhesive tape tray, Adhesive device, Adhesive tape box, Using its adhesive pressing method, And related to the different conductive tape. [Prior Art] In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection between the electrodes of the two, Adhesive tape is used. Japanese Patent Laid-Open Publication No. 2001-284005, It is described that the adhesive tape of the adhesive material applied to the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, A disc of adhesive tape (hereinafter referred to as "adhesive disc") is mounted on the adhesive device. Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is taken up from the self-adhesive material disc is pressed against the circuit board by a heating and pressing head, The residual substrate is then taken up by a take-up reel. -6- 200823137 Secondly, When the adhesive tape of the adhesive sheet is used up, Remove the used disk, And a take-up tray for taking up the substrate, The new take-up tray and the new adhesive sheet are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. SUMMARY OF THE INVENTION In recent years, With the enlargement of panel images such as PDP, The adhesion area of the circuit substrate (or the size of one of the surrounding sides) also increases. The amount of adhesive used in one use has also increased. also, Because of the expansion of the use of adhesives, The amount of adhesive used has also increased. therefore, The replacement of the adhesive discs in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is 1 to 3 mm narrower, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape increases, The diameter of the disc will also increase. It may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. therefore, The object of the present invention is to provide a method for joining adhesive tapes, Adhesive tape, Manufacturing method thereof, Pressing method, Adhesive tape, Adhesive device, Adhesive tape box, Using its adhesive pressing method, And different conductive tape, It is very simple to replace the adhesive sheet. And can be used in 200823137 to increase the production efficiency of electronic machines. Applying for the invention described in item 1 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Reflex the end of one of the adhesive tapes, The adhesive surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped. And the overlapping portions of the two are heated and pressed to connect them. In the invention described in the first item of the patent application, Adhesive tape adhesive is used to adhere the end portion of the adhesive tape that is completely unrolled, And the beginning of the newly installed adhesive tape, Implement the replacement of the adhesive sheet, Therefore, it is very simple to attach the new adhesive tape to the adhesive device. also, Because there is no need to change the take-up tape every time you replace a new adhesive tape, Attaching the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. Because the end portion of the adhesive tape that is completely rolled out is folded back, And the adhesive surface of the adhesive tape and the adhesive surface of the newly attached adhesive tape are overlapped, Therefore, it has a high connection strength. The heating portion of the connecting portion is pressed by a heating and pressing head which is attached to the adhesive device of the adhesive sheet. The adhesive device can be reasonably utilized. Applying for the invention described in item 2 of the patent scope, For example, the invention described in claim 1 is applicable. Its characteristic is that The end of the adhesive tape on one side is marked with an end mark. 8-200823137 When the invention described in the second item of the patent application is filed, In addition to the same effects as the invention described in claim 1 of the patent scope, 尙The cutting of the adhesive tape that is completely rolled out can be performed when the end mark is exposed. Therefore, the part that performs the cutting and connecting work is easy to unravel. and, The connection can be implemented with the least necessary location, It can prevent the waste of adhesive tape. Applying for the invention described in item 3 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that The other end of the adhesive tape is stopped by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk. After folding the end of one of the adhesive tapes, Then, the adhesive surface of the leading tape and the adhesive surface of the end of one of the adhesive tapes are overlapped. The overlapping portions are heated and pressed. In the invention described in the third paragraph of the patent application, Same as the invention described in the first paragraph of the patent application, It is very simple to load the new adhesive tape to the adhesive device. also, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. In addition, Because the adhesive tape is used to bond the tape to the end of the adhesive tape. And the beginning of the newly installed adhesive tape, Therefore, it is very simple to implement the adhesion between the adhesive tapes. Applying for the invention described in item 4 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that The other side of the adhesive tape -9- 200823137 is terminated by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk. The adhesive surface of the leading tape is overlapped with the adhesive surface of the end portion of one of the adhesive tapes, Perform the heating of the overlap and press. When the invention described in the fourth aspect of the patent application is filed, Same as the invention described in the first paragraph of the patent application, It is very simple to load the new adhesive tape to the adhesive device. also, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. In addition, Because there is no need to fold the adhesive tape that is completely rolled out, When the adhesive tape is taken up to the take-up reel, It can prevent the rollup that may occur. Applying for the invention described in item 5 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Make the end of the adhesive tape on one side, And the other end of the adhesive tape overlaps the beginning end, Insert a locking pin to overlap the two to implement the connection. In the invention described in claim 5 of the patent application, Because the end portion of the adhesive tape that is completely rolled out is fixed by the locking pin, And the beginning of the newly installed adhesive tape, Therefore, the connection is very simple. also, Because there is no need to change the take-up tape every time you change a new adhesive tape, The installation of the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. Applying for the invention described in item 6 of the patent scope, By using a locking member -10- 200823137, an adhesive tape for attaching one side of a disk coated with an electrode connecting adhesive to a substrate, And a method of attaching the adhesive tape to the adhesive tape of the adhesive tape of the other side of the other side of the tray, Its characteristic is that The locking member has claws disposed at one end and the other end, And an elastic member disposed between the claws, The end of the adhesive tape of one side and the beginning of the adhesive tape of the other side will abut each other. The claw portion provided at one end of the locking member is locked at the end portion of one of the adhesive tapes, The claws provided at the other end will be locked at the beginning of the other adhesive tape. Pull the claws of both sides with elastic members. In the invention described in claim 6 of the patent application, Because the claw of one of the locking members is locked to the end portion of the adhesive tape of one side, And, The other claw portion of the locking member is locked to the beginning end of the other adhesive tape. Implement the interconnection of the two, Therefore, the connection is very easy. also, Because there is an elastic member between the claw of one side and the claw of the other side, Therefore, The elastic member is stretchable so that the other claw of the locking member is locked at any position of the beginning end of the other adhesive tape, It is a connection with a high degree of freedom. also, Because the end of the adhesive tape of one side, And the other end of the adhesive tape is joined to each other in a state in which the initial ends of the adhesive tape are abutted. Without having to overlap the tapes, The connection can be implemented with the minimum necessary position, It can prevent the waste of adhesive tape. Applying for the invention described in item 7 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And the adhesive tape of the other side of the adhesive tape -11 - 200823137, which is taken up to the other side of the tray, Its characteristic is that Make the end of the adhesive tape on one side, And the other end of the adhesive tape overlaps the beginning end, The elastically deformable clip having a substantially three-shaped cross section is used to perform the clamping and fixing of the overlapping portions. In the invention described in claim 7 of the patent application, Because it is only necessary to clamp the end of a 'adhesive tape' with a clip, And the overlap of the other end of the 'adhesive tape can be connected. It is very easy to connect work. 申请 Apply for the invention described in item 8 of the patent scope. Its characteristic is that A metal-shaped holding piece having a slightly 3-shaped cross section sandwiches the overlapping portion of one of the adhesive tapes and the other adhesive tape. And the two pieces are pressed from both sides of the overlapping portion to connect the two. In the invention described in the eighth aspect of the patent application, Since the two pieces are flattened from the overlapping portions to connect the two, Therefore, the joint strength of the overlapping portions of the adhesive tape can be improved. Applying for the invention described in item 9 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Make the end of the adhesive tape on one side, And the adhesive surface of any one of the beginning ends of the other adhesive tape is superposed on the other substrate surface, The overlap length of the two is in the range of 2 to 50 times the width of the adhesive tape. The connection is carried out by heating with both. In the invention described in claim 9 of the patent application, Because the adhesive tape of adhesive tape -12- 200823137 is used to adhere the end of the used adhesive tape, And the beginning of the newly attached adhesive tape to carry out the replacement of the adhesive sheet, It is therefore very simple to load the new adhesive sheet onto the adhesive unit. also, Because there is no need to change the take-up reel every time you replace a new adhesive tray, And the installation of the beginning of the new adhesive material to the take-up reel, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. The length of the overlapping portion is 2 to 50 times the width of the adhesive tape. The reason is as follows, When it is less than 2 times, sufficient joint strength cannot be obtained. When it is more than 50 times, the adhesive material used in the joint portion may be excessively increased to cause waste of the adhesive material. The heating of the connecting part is pressed, If a heated pressurizing head with an adhesive device with an adhesive disc is used, The adhesive device can be reasonably utilized. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive. Can also be used only for insulating adhesives, Or , Dispersing insulating spacer particles in these adhesives. Apply for the invention described in item 10 of the patent scope, It is used to connect the substrate to the adhesive tape coated with the electrode-attaching adhesive to one of the plates, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the disk, Its characteristic is that Folding the end portion of one of the adhesive tapes in the opposite direction of the adhesive, And the other end of the adhesive tape is folded toward the opposite direction of the adhesive. Having the bent portions of the two overlap each other and the opposite faces of the two are opposite, The overlapping portions are heated and pressed. When the invention described in claim 10 of the patent application scope is In addition to the same effects as the invention described in the item i of the patent application of the -13-200823137, The end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side are hooked to each other. And the adhesive faces of the two will be connected to each other. Therefore, there is a higher connection strength. Applying for the invention described in item 11 of the patent scope, For example, if the invention described in Section 9 or 10 of the Patent Application is filed, The end of the adhesive tape on one side will be marked with an end mark. In the invention described in claim 1 of the patent application, Except for the same effects as the invention described in claim 9 or 10, Because the end part of the adhesive tape of one side uses the end mark part, The part that performs the connection work is easy to unravel and can be connected with the necessary minimum position. It can prevent the waste of adhesive tape. also, The end mark portion can be automatically detected. Therefore, the detection signal control device can be utilized. If an alarm can be issued, the efficiency of the work can be improved. Applying for the invention described in item 12 of the patent scope, For example, the invention described in any one of the ninth to eleventh patent applications, Its characteristic is that To form a mold with one side of the bump, And the mold of the other side with which it is engaged, The overlapping part of the adhesive tape on one side and the adhesive tape on the other side, Apply heat and pressure. When the invention described in item 12 of the patent application is filed, In addition to the effects similar to the invention described in any one of claims 9 to 11, Since the connecting portion forms irregularities, the connecting area can be enlarged. Simultaneously, The engagement of the uneven portions can be utilized to increase the joint strength of the adhesive tape in the stretching direction (longitudinal direction). -14- 200823137 The invention described in the first and third paragraphs of the patent application, For example, the invention described in any one of the items 9 to 11 of the patent application, Its characteristic is that After forming a through hole in the overlapping portion of the adhesive tape on one side and the adhesive tape on the other side, The overlapping portions are heated and pressed. When the invention described in claim 13 of the patent application is filed, In addition to the same effects as the invention described in any one of claims 9 to 11 of the patent application, Because the connecting portion forms a through hole, The adhesive will seep out to the inner edge of the through hole. And increase the adhesive area of the adhesive, Therefore, the connection strength can be further improved. Applying for the invention described in item 14 of the patent scope, An adhesive tape for attaching one side of a substrate coated with an electrode-bonding adhesive to one of the disks, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that The end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side may overlap or abut, Adhesive tape is attached to the surface of the substrate by rubbing the adhesive tape between the two adhesive tapes. Implement the connection of the two adhesive tapes. In the invention described in claim 14 of the patent application, Adhesive tape of adhesive tape has been taken from one side, And the take-up reel of the substrate on which only the adhesive tape is taken up is attached to the adhesive device. When the adhesive tape of the adhesive sheet is used up, End portion of the used adhesive tape (adhesive tape of one side), The beginning of the adhesive tape of the newly-applied adhesive sheet (the other adhesive tape) is connected by adhesive tape. The new adhesive sheet will replace the used adhesive sheet and attach it to the adhesive unit. In the present invention, Simply connect the used adhesive tape and the new adhesive -15- 200823137 tape to replace the lands. It is therefore easy to load the new adhesive sheet onto the adhesive unit. also, Because there is no need to change the take-up tray every time you change a new adhesive tray, Or attach the beginning of the new adhesive tape to the take-up reel and guide the operation of the adhesive tape. Therefore, it takes less time to replace the new adhesive sheet. It can improve the production efficiency of electronic machines. The substrate of the adhesive tape is surface treated with 矽, The adhesive tape used also uses a 矽 adhesive. It can reduce the difference in surface tension between the two and increase the adhesion. Therefore, the adhesion of both the traditionally difficult ones can be achieved. The adhesive for the adhesive tape may be a distorted adhesive which disperses the conductive particles in the insulating adhesive. It can also be used only for insulating adhesives. or, Dispersing insulating spacer particles in these adhesives. Applying for the invention described in item 15 of the patent scope, Its characteristic is that The difference between the surface tension of the adhesive surface of the adhesive tape and the surface tension of the adhesive substrate of the adhesive tape described in the first paragraph of the patent application is 10 mN/m (1 Odyne/cm) or less. In the invention described in the fifteenth aspect of the patent application, In addition to the same effects as the invention described in claim 14 of the patent application, Because the surface tension of the adhesive surface of the adhesive tape and the surface tension of the adhesive substrate are 10 mN/m (10 dyne/cm) or less, Get a strong secret, And it really sticks to both. Surface tension is measured by wet reagents or contact angles. The surface tension difference between the adhesive substrate of the adhesive tape and the adhesive surface of the adhesive tape should be 0 to 5 mN/m (5 dyne/cm). The difference in surface tension is as small as possible, If it exceeds 1 〇 m N / m (1 0 d y n e / c m ), the full adhesion strength may not be obtained -16- 200823137. Applying for the invention described in item 16 of the patent scope, For example, if the invention described in the second paragraph of the patent application is applied, Its characteristic is that The adhesive force of the adhesive tape is 100g/25mm or more. In the invention described in claim 16 of the patent application, In addition to the same effects as the invention described in claim 2, The bonding of the adhesive tape of one side and the other is performed by applying the adhesive tape to the adhesive surface of the two sides, Adhesive tape on one side and the other can obtain adhesion (or closeness) on both sides, Therefore, adhesion can be performed with high strength. especially, Because the adhesion is 100g/25mm or more, The adhesion of the two adhesive faces of the adhesive tape of one side and the other will be stronger. The stronger the adhesion strength, the stronger the adhesion strength. however, A specific strength cannot be obtained with less than 100g/25mm. Applying for the invention described in item 17 of the patent scope, Its characteristic is that Overlap or abut the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side, The adhesive tape described in item 16 of the patent application is attached to both sides of the two adhesive tapes to perform the connection. When the invention described in claim 17 of the patent application is filed, In addition to the same effects as the invention described in claim 16 of the patent application, The connection of the adhesive tape of one side and the other side is carried out on both sides thereof. Therefore, a stronger connection can be obtained. Applying for the invention described in item 18 of the patent scope, An adhesive tape for attaching one side of a substrate coated with an electrode-bonding adhesive to one of the disks, And sticking to the other side of the disc on the other side -17- 200823137 Adhesive tape connection method for the tape It is characterized in that the two adhesive tapes are connected by sandwiching the adhesive tape of the adhesive tape on both sides of the adhesive tape end portion and the other end of the adhesive tape. The difference in surface tension between the adhesive on both sides and the base material is 10 mN/m (l〇dyne/cm) or less. And the adhesive force is l〇〇g/25mm or more. 〇 When the invention described in claim 18 of the patent application scope is Because of the adhesive tape on both sides of the adhesive, The adhesion (or closeness) of the two can be carried out by sandwiching the adhesive tape between the adhesive tape on one side and the other. Therefore, the connection between the two is very simple and easy. Applying for the invention described in item 19 of the patent scope, It is used to connect the adhesive tape coated on the substrate to the adhesive tape of one of the plates on one of the plates. And a method of attaching the adhesive tape to the other adhesive tape of the other side of the disk, Its characteristic is that The end of the adhesive tape on one side, And the other end of the adhesive tape will overlap or abut, Adhering a paste-like resin adhesive to the overlapping portion or the abutting portion, The bonding of the two is carried out by hardening of a paste-like resin adhesive. In the invention described in claim 19 of the patent application, Because the end of the adhesive tape has been used up, And the beginning of the newly-applied adhesive tape is fixed by a paste-like resin adhesive. Therefore, the connection is very simple. Again, Because there is no need to change the take-up tape every time you change a new adhesive tape, The operation of attaching the beginning of the new adhesive tape to the take-up reel, And setting up guide pins and the like in a specific path, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. -18- 200823137 Because the end of the adhesive tape of one side, And the other part of the adhesive tape, the overlapping portion or the abutting portion of the adhesive tape is adhered to the resin adhesive. Therefore, the connection has a high degree of freedom. Apply for the invention described in item 20 of the patent scope, For example, the invention described in Article 19 of the Patent Application, Its characteristic is that The resin adhesive is made of a thermosetting resin, Photocurable resin, And at least one material selected from the group of hot metal adhesives. In the invention described in claim 20 of the patent application, In addition to the same effects as the invention described in claim 19, Because it can be made from thermosetting resin, Photocurable resin, In the group of hot metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected. Therefore, the connection strength between the adhesive tapes can be improved. Applying for the invention described in item 21 of the patent scope, Its characteristic is that Attached to the adhesive device with adhesive tape, A charging machine for supplying a resin-made adhesive described in claim 19 or 20 of the patent application is installed. In the invention described in the second aspect of the patent application, Since the filling device is provided with a filling machine for supplying the resin adhesive as described in claim 19 or 20, Therefore, no additional filling machine is prepared. It can prevent waste of connection work. also, In addition to the filling machine, the adhesive device It may have a heater for the purpose of curing the thermosetting resin, Or ultraviolet rays for the purpose of irradiating light of a photocurable resin. Applying for the invention described in item 22 of the patent scope, It is used to take up the adhesive tape coated with the adhesive for electrode connection on the substrate to the adhesive material of the tray -19- 200823137 tape tray, Its characteristic is that The adhesive tape tray is provided with a roll of a plurality of adhesive tapes in the width direction of the tape. In the invention described in claim 22 of the patent application, Because it is equipped with a roll (roll) of a plurality of adhesive tapes, Among the plural volumes, When the entire adhesive tape of the roll of one side is taken out, The adhesive tape of the other side of the roll disposed next to the all-rolled roll portion is attached to the take-up reel. in this way, Because one of the adhesive tapes is completely rolled out, The adhesive tape of the other side will be attached to the take-up reel. And the replacement of the adhesive tape is carried out, Therefore, it is not necessary to put a new adhesive tape on the adhesive device. therefore, There will be fewer replacement jobs for new adhesive tapes. Therefore, the productivity of the electronic machine can be improved. Because the adhesive tape that is taken up to the multiple rolls can be used in sequence, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. It is possible to increase the amount of adhesive that can be used for one replacement operation. also, Because there is no need to increase the number of rolls of adhesive tape, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Prevents blockages, and, It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. Applying for the invention described in item 23 of the patent scope, For example, if the invention described in the 22nd section of the patent application is applied, Its characteristic is that Between the end of the adhesive tape on one side and the beginning of the adhesive tape on the other side, a connecting tape for connecting the two, When all of the adhesive tape of one side is rolled out, It will then start rolling out the adhesive tape on the other side. -20-200823137 In the case of the invention described in the second aspect of the patent application, the invention has the same effects as the invention described in claim 22, Because the end of the adhesive tape on one side and the beginning of the adhesive tape on the other side are connected by a connecting tape, it is not necessary to roll the adhesive tape of the other side after the roll of the adhesive tape of one side is rolled out. The operation of tape installation on the take-up reel, Therefore, the production efficiency of the electronic machine can be further improved. Applying for the invention described in item 24 of the patent scope, The adhesive tape tray of the 23rd item of the patent application scope, Reeling tape for adhesive tape, Between the adhesive tape tray and the take-up reel and pressing the adhesive of the adhesive tape to the pressing portion of the circuit board of the electronic device by the heating and pressing head, And an adhesive device for detecting a tape detecting means for connecting the tape, Its characteristics are, When the tape detecting means detects the connecting tape, Until the connecting tape passes through the pressing part, The connecting tape will be taken up to the take-up reel. In the invention described in claim 24 of the patent application, Because the adhesive tape is automatically taken up to the take-up reel, Therefore, after the adhesive tape of one of the rolls is completely rolled out, The adhesive tape will be rolled out from the next roll in sequence. also, When the tape detecting means detects the connecting tape, Until the connecting tape passes through the pressing part, The connecting tape is automatically taken up to the take-up reel. Therefore, it can save the trouble of taking up. also, The adhesive device has a tape detecting means, It is composed of a pair of light-emitting portions and a predetermined R-' for optical detection of a joint tape. on the other hand, The ends of the connecting tape are provided with colored (for example, black) marks. The light receiving unit detects the connecting tape by detecting the mark at both ends of the connecting tape by the laser light emitted from the light emitting unit. also, In addition to the additional mark on the link tape, -21 - 200823137 The method of making the width of the bonding tape different from the width of the adhesive tape, Or a method of forming a plurality of holes in a connecting tape. Applying for the invention described in item 25 of the patent scope, Attaching the end portion of the adhesive tape to one end of the adhesive tape and the adhesive tape tray at the beginning of the other adhesive tape. Its characteristic is that The connecting part covers the card holder with an adhesive tape. In the invention described in claim 25 of the patent application, Because the card stopper is used to connect the end portion of the adhesive tape which is completely unwound, and the beginning end of the newly attached adhesive tape, Implement the replacement of the adhesive tape tray, Therefore, it is very simple to put the new adhesive tape on the adhesive device. also, Because there is no need to change the take-up tape every time you replace a new adhesive tape tray, Attaching the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, Replace the new adhesive tape tray in less time. Therefore, the production efficiency of the electronic machine can be improved. Because the adhesive tape is used sequentially, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. This allows a significant increase in the amount of adhesive that can be used for one replacement job. also, Because there is no need to increase the number of rolls of adhesive tape, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Can prevent blockage, and, It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. also, The connection between the end of the adhesive tape of one side and the beginning of the adhesive tape of the other side, Because the card is covered with adhesive tape, Therefore, the appearance is good. Simultaneously, It can prevent the card stopper of the connecting part from coming into contact with the adhesive tape -22- 200823137 Or the components such as a heating press head or a support stand that are damaged to the adhesive device. also, a method of covering a card holder with an adhesive tape, It should be after the end of the adhesive tape on the side where the card is attached, and the beginning of the other adhesive tape. Fold the connecting part back to the longitudinal direction of the tape by 180 degrees. Cover the card with adhesive tape. also, Other adhesive tapes can also be used to cover the attachment to cover the card holder. Applying for the invention described in item 26 of the patent scope, It has an adhesive tape tray as described in item 1 of the patent application scope. Reeling tape for adhesive tape, Provided between the adhesive tape tray and the take-up reel and pressing the adhesive material of the adhesive tape to the pressing portion of the circuit board of the electronic device by the heating and pressing head, And an adhesive device for detecting the connection portion of the connecting portion of the tape, Its characteristic is that When the connection detecting means detects the connecting portion of the tape, Until the connecting part passes through the pressing part, The adhesive tape from one side will be taken up to the take-up reel. In the invention described in claim 26 of the patent application, If the connection detecting means detects the connected part, Then, because the connecting portion passes through the pressing portion, The adhesive tape of one side will be taken up to the take-up reel. Therefore, it is possible to prevent the pressing portion from being pressed when the connecting portion reaches the pressing portion. also, To the connecting part, by pressing the part, Because the adhesive tape of one side is automatically taken up to the take-up reel, Therefore, the trouble of winding up can be omitted. Applying for the invention described in item 27 of the patent scope, For example, if the invention described in the 26th section of the patent application is filed, Its characteristic is that Connection detection means -23- 200823137 CCD camera, Thickness detection sensor, And one of the transmittance detecting sensors. In the invention described in claim 27 of the patent application, In addition to the same effects as the invention described in claim 26, The connection part can be detected with a simple configuration. and, These methods can be used to improve the detection accuracy. E.g, When a CCD camera is used as the connection detecting means, The surface of the connected part can be displayed on the monitor screen. The connection portion is detected by comparing the shades of the pixels. also, When using a thickness detection sensor, Because the thickness of the joint portion is greater than the thickness of the adhesive tape, The connection portion can be detected because the thickness can be changed. also, When using a transmittance sensor, Because the thickness of the connecting part is thicker, And because of the card stopper, the transmittance is lowered, Therefore, the transmittance can be compared to detect the connection portion. Applying the method of attaching the adhesive tape according to Item 28 of the patent application, Its characteristic is that The end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side are connected by a card stopper, The connecting part will cover the card holder with adhesive tape. In the invention described in claim 28 of the patent application, The adhesive tape is replaced by a card stopper connecting the end portion of the adhesive tape which is completely unwound and the beginning end of the newly-adhesive adhesive tape. Therefore, it is very simple to install the new adhesive tape to the adhesive device. also, Because there is no need to change the take-up tape every time you change a new adhesive tape tray, The installation of the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, Replace the new adhesive tape tray in less time. Therefore, it can be mentioned -24- 200823137 The production efficiency of high electronic machines. Because the adhesive tape is used sequentially, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. This allows a significant increase in the amount of adhesive that can be used for one replacement job. also, Because there is no need to increase the number of rolls of adhesive tape, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Can prevent blockage, and, It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. also, The connection between the end of the adhesive tape of one side and the beginning of the adhesive tape of the other side, Because the card is covered with adhesive tape, Therefore, the appearance is good. Simultaneously, It can prevent the card part of the connecting part from contacting the adhesive tape and hurting the adhesive tape, Or the components such as a heating press head or a support stand that are damaged to the adhesive device. also, a method of covering a card holder with an adhesive tape, It should be after the end of the adhesive tape on the side where the card is attached, and the beginning of the other adhesive tape. Fold the connecting part back to the longitudinal direction of the tape by 180 degrees. Cover the card with adhesive tape. also, Other adhesive tapes can also be used to cover the attachment to cover the card holder. Applying for the invention described in item 29 of the patent scope, Applying an adhesive to the substrate, And rolled into a disc-shaped adhesive tape, Its characteristic is that A plurality of adhesives are disposed on the substrate in the longitudinal direction of the tape. In the invention described in claim 29 of the patent application, If using adhesive tape, Put the disk and the empty disk of the adhesive tape onto the adhesive device -25- 200823137 ’ After heating and pressing the adhesive on the circuit board, And it is mounted by winding the substrate to an empty tray. Secondly, When the circuit substrate is subjected to heating and pressurization of the adhesive, One of the plurality of adhesives disposed in the width direction of the substrate is pressed against the circuit substrate. The residual adhesive strip after pressing is simultaneously taken up to the empty tray with the substrate. Secondly, after the adhesive tape on the plate is completely rolled out, Will reverse the rotation direction of the disc, The direction of supply of the adhesive tape is reversed. in this way, After using one adhesive each time, Will reeler the residual adhesive and substrate at the same time. Repeat the use of the remaining adhesive strips in sequence. therefore, Because a plurality of adhesives are used one by one, Therefore, there is no need to increase the number of tapes. You can increase the amount of adhesive that can be used in one dish (more than 2 times). In the present invention, No need to increase the number of rolls of adhesive tape, The adhesive dose can be greatly increased. and, Because the number of rolls of adhesive tape is not increased, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Prevents blockages, In addition, It is also possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). Manufacturers of electronic components can reduce the number of replacements of new adhesive tapes, Therefore, the manufacturing efficiency can be improved. also, In the manufacture of adhesive tape, Because there is more adhesive dose per plate, Can reduce the amount of disk and moisture prevention materials used, Therefore, the manufacturing cost can be reduced. also, After the first adhesive is pressed and the adhesive tape is taken up to the empty tray, In order to use the next adhesive, Replace without changing the direction of rotation -26- 200823137 It is also possible to install two discs on the adhesive device. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive. Can also be used only for insulating adhesives, or, Dispersing insulating spacer particles in these adhesives. The width of the substrate should be 5mm~1 000mm, however, It can be arbitrarily selected according to the width of one adhesive or the number of adhesives. The width of one adhesive should be 〇. 5mm~10. 0mm. The width of the substrate should be 5mm~1000mm, and when the width of the substrate is less than 5mm, the number of adhesives disposed on the substrate and the width of the adhesive will be limited. When it is larger than 1 000mm, it is not installed. The invention described in claim 30 is the invention described in claim 29, wherein the adjacent adhesive strips of the plurality of adhesives have a space. In the invention described in claim 30, in addition to the same effects as the invention described in claim 29, at the same time, since the adjacent adhesive strips are separated from each other, the adhesive is easily applied. Pressed one by one. The invention described in claim 31 is the invention of claim 29, wherein the adhesive is separated into a plurality of strips by forming a slit in the longitudinal direction of the tape. In the invention described in the third aspect of the patent application, in addition to the same effects as those in the scope of claim 29, the adhesive is completely applied to one side of the substrate, and the adhesive is pressed to the circuit substrate. -27-200823137 The previous moment, that is, immediately before the use of the adhesive tape, the gap is formed by cutting the edge of the adhesive with a cutting edge or the like. Further, in the formation of the gap, when the adhesive tape is produced, the adhesive may be cut by a cutting edge or the like to form a slit. The formation of the slit can be formed by using a laser or a heating wire in addition to the cutting edge. In the present invention, the number of the adhesive strips disposed on the substrate can be increased. The invention described in claim 3 is an adhesive tape manufacturing method in which an adhesive is applied to a substrate and wound into a disk shape, and is characterized in that it is disposed so as to have a space in the width direction of the substrate. The applicator applies a plurality of adhesives to the substrate by supplying an adhesive to the substrate surface conveyed in a continuous manner. In the invention described in claim 32, the adhesive tape described in claim 30 of the patent application can be manufactured by using an existing device. The applicator may be a plurality of rollers disposed in the width direction of the substrate, or may be nozzles. The invention described in claim 3 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, characterized in that the adhesive is completely applied to one side of one of the substrates. After forming a longitudinal slit in the adhesive, the other substrate is disposed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one substrate and the other substrate are placed on the adhesive substrate. Separate from each other, a plurality of adhesives are alternately attached to one or the other of the substrates, and a plurality of adhesives are disposed on the one and the other of the substrates at intervals. -28-200823137 In the case of the invention described in the third aspect of the patent application, since two adhesive tapes as described in the second paragraph of the patent application can be manufactured at the same time, good manufacturing efficiency is obtained. The invention described in claim 4 of the patent application is an adhesive coating method in which an adhesive is applied to a substrate, and an adhesive is applied to the circuit substrate by a disk-shaped adhesive tape, which is characterized by a base. The adhesive is coated on one side of the material, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed from the side of the substrate along the longitudinal direction of the tape to form a strip shape to reduce the cohesive force of the heated portion. And pressing the circuit board 'after pressing' to roll the residual adhesive and the substrate into a disk shape at the same time and re-pressing the residual adhesive on the circuit substrate by using the adhesive tape rolled into a disk shape. When applying the invention described in the third paragraph of the patent scope, 'heating part of the adhesive to reduce the cohesive force of the part (hereinafter referred to as "cohesion reduction line"), and the heated part of the adhesive from the cohesive force reduction line Pressed to the circuit substrate and separated from the substrate. The residual adhesive will remain on the substrate and will be taken up to the empty tray at the same time as the substrate. In the present invention, since the width of the adhesive tape is only slightly wider than the conventional one, the adhesive tape can be directly produced by using the existing equipment. Further, by pressing the width of the adhesive to the circuit board, the heating area can be changed to be arbitrarily set, so that the width of the adhesive is pressed with a high degree of freedom. Further, in the same manner as the invention described in claim 29, when the adhesive tape is completely unwound to the empty tray, the rotation direction of the disk is reversed, and the supply direction of the glue -29-200823137 is reversed, or the rotation of the disk is maintained. Direction but swap the disks. In this manner, since the adhesive on the substrate is heated and pressed to the circuit substrate one by one, the adhesive amount which can be used for one disk can be greatly increased without increasing the number of tapes. Further, it is the same as the invention described in claim 29, because the amount of the adhesive is increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, the blockage caused by the leakage of the adhesive can be prevented, and the prevention can be prevented. The effect of the disadvantage caused by the stretching of the substrate. The tape width should be 5mm~1 000mm, and the adhesive pressed to the circuit board should be 〇. 5mm~1. 5mm. The reason why the tape width is 5 mm to 1000 mm is as follows. Since the tape width is less than 5 mm, the number of times of adhesion per one disk is small, and when it is more than 1 000 mm, it cannot be attached to the existing adhesive device. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The invention described in claim 35 is an adhesive tape coated on a substrate and wound into a disk-shaped adhesive tape, wherein the width of the adhesive tape is the same as or longer than the length of one side of the circuit substrate. And a plurality of adhesives are disposed in the width direction of the tape. In the invention described in claim 35, the adhesive tape is disposed so as to overlap one of the widths of the circuit board, so that it can be disposed directly along the side of the circuit board in the width direction of the adhesive tape. One adhesive is heated and pressurized. -30- 200823137 Since the width of the adhesive tape is longer than the length of one side of the circuit board, the adhesive tape only needs to pull out the width of the adhesive. Next, after the adhesive is pressed to one side of the circuit board, the circuit board is rotated so that the other side is positioned at the width direction of the adhesive tape, and the other side is heated and pressurized. In this way, the adhesive is pressed against the other side of the circuit board in this order, and it is easy to apply the adhesive to the periphery of the circuit board. Therefore, since the adhesive having a length longer than one side of the circuit board can be used one by one, and the amount of use of the adhesive strip is one time, the width of the adhesive strip can be increased, and the number of the adhesive tape can be increased without increasing the number of the adhesive tape. Adhesive dose that can be used. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. Further, in the manufacture of the adhesive tape, since the amount of adhesion per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. -31 200823137 The width of the adhesive tape is greater than the size of one side of the circuit board, for example, 5mm to 3000mm. Further, even if the adhesive tape having a size smaller than the size of one side of the circuit board, a plurality of adjacent strips may be disposed in the width direction of the adhesive tape to have a size of one side of the circuit board. In this case, it is easy to adapt to different sizes of circuit boards, which improves production efficiency. The width of one adhesive should be, for example, 0. 5 mm~10. 0mm. The reason why the width of the adhesive tape is 5 mm to 3000 mm is as follows. The size of one side of the circuit substrate is rarely less than 5 mm, and when it is larger than 3000 mm, the width of the disk may be too wide and may not be attached to the existing adhesive device. The invention described in claim 36 is the invention described in claim 35, wherein a plurality of adhesives are disposed in such a manner that adjacent adhesive strips are spaced apart. In the invention described in the third paragraph of the patent application, in addition to the same effects as the invention described in claim 35, since the adjacent adhesive strips are separated, the adhesive can be easily removed one by one. Peel off from the substrate and carry out pressing. The invention according to the invention of claim 3, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the third aspect of the patent application, in addition to the same effects as those of the third aspect of the patent application, the adhesive tape is applied to the single side of the substrate by using an adhesive. In the case of a drier, a gap is formed immediately before the adhesive is pressed to the circuit board, that is, immediately before the adhesive tape is used, by using a cutting edge or the like to cause the adhesive to have a mark of -32 to 200823137. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. In the present invention, in addition to the increase in the number of the adhesive strips disposed on the substrate, the adhesive tape in which a plurality of adhesives are disposed in the width direction of the tape is easier to manufacture. The invention described in claim 3 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, wherein the adhesive is applied to one of the base materials. After forming a gap in the width direction of the adhesive on the adhesive, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one of the substrates and the other is placed. The substrates are separated from each other, and a plurality of adhesives are alternately attached to one of the other substrates, and a plurality of adhesives are disposed on one or the other of the substrates at intervals. In the invention described in the third aspect of the patent application, since the adhesive tape described in the second item of the patent application can be simultaneously manufactured by using the existing equipment, it has good manufacturing efficiency. The invention described in claim 39 is an adhesive tape pressing method, which is characterized in that the adhesive tape described in any one of claims 35 to 37 is disposed on a circuit board. The adhesive tape is heated and pressurized along the width direction to press the adhesive strip to one side of the circuit board. The pressing method can also be carried out by disposing the adhesive tape on the circuit board, heating and pressing the adhesive-33-200823137 tape along the width direction, and pressing the adhesive strip to the circuit substrate. Next, next, the position of the circuit board is changed, and the other side of the circuit board is heated and pressurized along the width direction of the adhesive tape to press the next adhesive strip to the other side of the circuit board. In the invention described in claim 39, in addition to the effects described in any one of claims 3 to 3, the adhesive tape may be attached to the adhesive device. One side of the circuit board is disposed in the width direction of the adhesive tape, and the adhesive is pressed to one side of the circuit board. Next, the circuit board is rotated by about 90 degrees so that the other side of the circuit board is parallel to the width direction of the adhesive tape. Position and press the adhesive to the other side of the circuit board. In this way, the circuit board can be rotated by 90 degrees and the adhesive is pressed, and the adhesive can be pressed around the circuit board in a simple manner, thereby improving the work efficiency of the manufacturing unit of the electronic component. The invention of the invention of claim 40 is characterized in that at least one of the adhesive tapes described in any one of claims 3 to 37 is disposed on the moving path of the mobile circuit board, and one of the adhesive tapes is provided. In the configuration, the width direction and the conveying path are perpendicular, and the other adhesive tape is arranged in the width direction along the conveying path, and one of the adhesive tapes is implemented in the width direction with respect to the opposite sides of the circuit board. The adhesive tape is pressed and pressed to the opposite sides of the circuit substrate, and secondly, the circuit substrate is moved toward the other adhesive tape, and the remaining two sides of the circuit substrate are from the substrate side along the width direction. The adhesive tape is heated and pressurized to press the adhesive strip around the circuit substrate. -34- 200823137 Patent Application No. 40 Patent Application No. 3 5 to 3 7 Turning the circuit board and moving it to the position of one of the agent tapes, the adhesive can be easily applied at each position Pressed on the efficiency of the work. Patent application No. 41 of the patent application is fully applied with an adhesive, and the width of the adhesive tape is applied to the direction of the circuit substrate by using the width of the adhesive adhesive tape which is pressed by the adhesive to reduce the adhesion of the heating portion. The condensed substrate of the agent. When the fourth item of the patent application is pressed against the periphery of the circuit board, the cohesive force of the adhesive component is applied along the width direction (hereinafter referred to as "the adhesive of the condensation will decrease along the cohesive force on the wire plate. Secondly, The circuit board is rotated and pressed at the position of the adhesive tape in the width direction to adhere the adhesive strip, and the adhesive side is adhered. Thus, the adhesive can be pressed in order to improve the work efficiency. Moreover, since it is only required to be described in the adhesive adhesive. In addition to the effect of the load and the load, there is no need to apply heat and pressure in the width direction of the adhesive tape and the other side of the circuit board, and the invention has a good load on the periphery of the circuit board, and is adhered to the single-sided disk shape of the substrate. The method for pressing the tape on the circuit base tape is characterized in that, when the length of one side is greater than the length, the heat and pressure of the adhesive to the part of the adhesive are pressed, and when the adhesive is pressed to the invention of the circuit, the adhesive is adhered. The agent applies the adhesive tape to the heating and pressing of the adhesive tape to reduce the convergence reduction line of the part, and the heating part is separated from the substrate and pressed to the circuit base. At 90 degrees, the adjacent side is located on the upper side, and the adhesive of the next strip is pressed along the width direction to be adjacent to the four sides of the circuit substrate, and the strip is fully coated with the adhesive, -35- 200823137 Therefore, adhesive tape can be made directly from existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. Moreover, the invention is the same as the invention described in claim 35, because the amount of the adhesive is increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive can be prevented, and Prevents the effects of defects such as stretching of the substrate. The invention of claim 42 is characterized in that it has one disk, the other disk, and a casing for accommodating the disks rotatably mounted, and one of the disks is wound around the base. The adhesive tape on the material is coated with an adhesive, and the other end of the disk is fixed with one end of the adhesive tape. At least two adhesives are disposed on the adhesive tape along the longitudinal direction of the adhesive tape. In the invention, the adhesive tape cassette is attached to the adhesive device so as to overlap at least one of the adhesives disposed in the longitudinal direction of the adhesive tape in such a manner as to overlap one of the circuit substrates. The substrate side is heated and pressurized to press one of the adhesives onto the circuit board. Thus, the adhesive can be sequentially pressed onto the circuit substrate, and the adhesive tape is sequentially taken out from one of the trays, and the remaining adhesive tape coated with the adhesive is taken up to the other tray. Next, when the adhesive tape wound around one of the discs is completely unwound, the cartridge is reversed and reattached to the pressing device. In this way, since one of the discs and the other of the discs are interchanged, and -36-200823137 becomes the adhesive tape from the other side of the disc, one additional adhesive can be pressed. When two or more adhesives are formed on the adhesive tape, the position in the width direction may be changed, and the pressing may be performed in a sequential or intermittent manner. As shown above, in the present invention, the adhesive sheet is at least Two adhesives are arranged side by side in the width direction, and can be used one by one. At least 2 discs can be used in one tray, and the adhesive dose that can be used in one disc can be increased without increasing the number of adhesive tapes. More than 2 times. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, when two adhesives are formed, the manufacturing unit of the electronic component can simply reverse the cartridge when one disk (one adhesive) is used, so that it is easier to install the next one. Moreover, since the adhesive tape is a cassette type method, there is no complicated step when the adhesive tape is mounted on the disc on the adhesive device, as long as the cartridge is attached to the adhesive device, it is easy to handle and has Good installation and replacement workability. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. 37-200823137 The invention of claim 43 is the invention of claim 42, wherein the adjacent adhesive strips of the plurality of adhesives are spaced apart. In the invention described in claim 43 of the patent application, in addition to the same effects as those of the invention described in claim 42 of the patent application, the adjacent adhesive strips are separated and can be pulled away from the substrate one by one. Adhesive and pressed. The invention described in claim 44 is the invention according to claim 42, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the 44th aspect of the patent application, in addition to the same effect as the application of the 42nd item of the patent application, the adhesive tape is applied by applying the adhesive to one side of the substrate and drying it. The gap is formed immediately before the adhesive is pressed to the circuit board, that is, immediately before the adhesive tape is used, by using a cutting edge or the like to make the adhesive have a cut. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. The invention of claim 45 is characterized in that: one of the discs, the other disc, and a casing for accommodating the discs rotatably mounted; and one of the discs are wound Adhesive tape coated with an adhesive on the substrate, and the other end of the disk is fixed with one end of the adhesive tape; the adhesive tape cassette is attached to the pressing device, from the adhesive -38- 200823137 tape box The adhesive tape is pulled out onto the circuit board, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive in the heating portion, and a part of the adhesive in the width direction is pressed against the circuit substrate. In the invention described in claim 45, a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive (hereinafter referred to as "cohesion reduction line"). The adhesive portion of the heated portion is separated from the substrate and pressed to the circuit substrate from the cohesive force reduction line. In the present invention, since the adhesive tape only needs to be completely coated with the adhesive on the substrate, the adhesive tape can be directly produced by using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. The invention described in claim 46 is an adhesive pressing method using an adhesive tape cassette, which is characterized in that it has one disk, the other disk, and is housed in a freely rotatable manner. a housing of the discs; and one of the discs is wound with an adhesive tape coated with an adhesive on the substrate, and the other disc is fixed with one end of the adhesive tape; the adhesive tape cassette is loaded To the pressing device, the adhesive tape is pulled out from the adhesive tape cassette onto the circuit substrate, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive portion of the heating portion, and the width is increased. A part of the adhesive in the direction is pressed against the circuit substrate, and after the adhesive tape wound on one of the disks is completely unwound, the adhesive tape cassette is reversed, and the remaining adhesive is pressed onto the circuit substrate. -39- 200823137 In the invention described in claim 46, in addition to the same effect as the application of claim 45, when the adhesive tape wound onto one of the discs is completely unwound, The cartridge is reversed and reattached to the pressing device, and the residual portion of the adhesive is pressed to the circuit substrate. Therefore, the invention is the same as the invention described in claim 1, and the adhesion can be increased without increasing the number of windings. The dose can prevent the coiling from being scattered, and at the same time, it can prevent the clogging caused by the oozing of the adhesive and prevent the disadvantage caused by the stretching of the substrate. In addition, when the manufacturing unit of the electronic component is completely unrolled in one serving (one adhesive), it is easier to reverse the cartridge as long as it is reversed. Because of the way of using the box, it is easier to handle, and has good installation and replacement workability. The invention described in claim 47 is a disk-shaped adhesive tape coated on a substrate, characterized in that the substrate has a hot melt layer and a support layer. In the invention described in claim 47, when the adhesive tape is used, the disk and the empty disk of the adhesive tape are attached to the adhesive device, and the adhesive is heated and pressurized on the circuit substrate. The material is taken up to an empty tray. Next, the end portion of the adhesive tape which has been wound up to one of the discs on one side and the beginning end of the adhesive tape which is newly wound onto the other side of the disc are overlapped or abutted. The part is heated to melt the hot melt layer, and then the hot melt is solidified by cooling to connect the adhesive tape. The adhesive pad 40-200823137 is replaced by the end of the adhesive tape and the beginning of the newly attached adhesive tape, and the new adhesive can be easily replaced. The material plate is attached to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive material is attached to the take-up reel, and the roll is attached to the guide pin, it takes only a small time to replace the new one. Adhesive trays can increase the productivity of electronic machines. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be used reasonably. The invention described in claim 48 is the invention of claim 1, wherein the support layer is sandwiched between the hot melt layers. In the invention described in claim 48, in addition to the same effects as those of the invention described in claim 1, since the hot melt layer is located on the surface of the substrate, the adhesive faces at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. The invention described in claim 49 is the invention according to claim 1, wherein the hot melt layer is sandwiched between the support layers. In the invention described in claim 49, in addition to the same effects as the invention described in claim 47, the bonding of the adhesive tape is at the end of one of the adhesive tapes and the other. At the position where the beginning end portions of the adhesive tape of one side abut each other, the heating head of the device is heated by the heat-pressing head of the device. The hot melt is melted and bleed during heating, and the hot melt is solidified by cooling to effect the connection between the adhesive tapes. At this time, since the hot melt layer is sandwiched between the support layers, it is possible to prevent the molten material layer from being exposed to the atmosphere and to lower the adhesion strength of the hot melt layer due to moisture absorption or adhesion of moisture. The invention described in claim 50 is an adhesive tape connecting method for attaching an adhesive tape which is taken up to one of the trays of one side, and an adhesive tape which is wound up to the other of the trays of the other side. The adhesive tape has a substrate and an adhesive which are surface-treated with a release agent, and the release agent of the base of the adhesive tape of any one of the adhesive tapes is removed, so that the adhesive tape of the other adhesive tape is adhered. The agent surface is superposed on the portion, and is joined by heating and pressing the overlapping portions of the two. In the invention described in claim 50, the adhesive surface of the other adhesive tape is superposed on the surface of the adhesive tape of either one of the adhesive tapes, and the overlapping portions are heated and pressed, and all the connections are used. The end of the adhesive tape and the beginning of the newly attached adhesive tape are used to replace the adhesive disc, so that the new adhesive disc can be attached to the adhesive device. Since it is not necessary to change the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, it takes less time. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. Further, in a state in which the adhesive tape is wound around the disk, a release agent is applied to the surface of the substrate in order to prevent adhesion between the adhesive surface and the substrate surface. -42- 200823137 In the present invention, the release agent of one of the adhesive tapes is removed, and the adhesive surface of the other adhesive tape is superposed on the portions and adhered, so that the connection between the adhesive tapes is very simple. . The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be reasonably utilized. The invention according to claim 5, wherein the release agent is removed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. Implementation. In the invention described in the fifth aspect of the patent application, in addition to the same effects as the invention described in claim 50, the plasma discharge, ultraviolet irradiation, and laser irradiation are used. By removing the release agent, the release agent can be removed more accurately in a shorter period of time than when the hand is peeled off. In the method of removing the release agent, when the plasma is discharged, the gas in the plasma state is decomposed to be easily generated (excited state), and the surface of the substrate is discharged to remove the release agent. Further, in the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and is irradiated with ultraviolet rays from a mercury lamp for a predetermined period of time. Further, in the case of laser irradiation, the release agent is heated and melted by laser light irradiated with a laser oscillator to remove the release agent. The invention described in claim 52 is an adhesive tape for winding an adhesive tape coated with an electrode connecting adhesive onto a substrate, wherein the adhesive tape is in the width direction of the tape. Equipped with -43- 200823137 multiple rolls of adhesive tape. In the invention described in claim 52, when a plurality of adhesive tape rolls (rolls) are disposed, and all of the adhesive tapes wound around one of the plurality of rolls are unwound, The adhesive tape disposed on the other roll portion of the entire wall of the rolled-out roll portion is taken up and attached to the disk. Thus, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the disk, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. Therefore, it is only necessary to replace the replacement of the new adhesive tape, so that the production efficiency of the electronic machine can be improved, because the adhesive tape wound around the plurality of rolls is sequentially used, and it is not necessary to add one adhesive tape. The number of rolls of adhesive tape can greatly increase the amount of adhesive that can be used in one replacement operation. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention described in claim 5 is the invention of claim 52, wherein the end portion of one of the adhesive tapes and the other end of the adhesive tape are used between When the adhesive tape of the two is connected, when the adhesive tape of one of the adhesive tapes is completely rolled out, the adhesive tape of the other side is then rolled out. In the invention described in the fifth paragraph of the patent application, the end portion of the adhesive tape and the adhesive tape of the other side are provided in addition to the effects of the invention described in the 52nd paragraph of the patent application-44-200823137. Since the beginning end portion is connected by the connecting tape, and the adhesive tape of one of the winding portions is completely unwound, the adhesive tape of the other winding portion is not required to be taken up to the tray, so that the electronic device can be further improved. Productivity. The invention described in claim 54 is characterized in that the adhesive tape tray of the adhesive material of claim 53 and the take-up reel of the adhesive tape are disposed between the adhesive tape tray and the take-up reel and heated. The pressing head presses the adhesive material of the adhesive tape to the pressing portion on the circuit board of the electronic device, and the adhesive device for detecting the adhesive tape detecting means of the connecting tape, wherein the tape detecting means detects the connecting tape When the connecting tape passes through the pressing portion, the connecting tape is taken up to the take-up reel. In the invention described in the fifth paragraph of the patent application, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive material is sequentially unwound from the next roll. tape. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. Further, in the tape detecting means, for example, the adhesive device has a pair of light-emitting portions and a light-receiving portion, and optically detects the connecting tape. On the other hand, the two ends of the adhesive tape are provided with a color (for example, black) mark, and the light receiving portion detects the tie tape by detecting the marks on both ends of the link tape by the laser light emitted from the light-emitting portion. Further, in addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the -45-200823137 tape may be employed. The invention described in claim 59 is a gear unit having one disk, the other disk, a disk that rotates one disk and the other disk, a casing that houses the components, and is disposed in the casing. An adhesive member for an opening portion and an adhesive for supplying power to the heating member, wherein one of the disks is wound with an adhesive tape coated with an adhesive on the substrate, and the other disk is fixed. One end of the adhesive tape, the heating member has an electric heating member that performs heat generation by supplying electric power, and the adhesive tape wound up to one of the disks is pulled to the opening of the casing, and the heating member is located at the opening from the substrate side The adhesive tape is heated and pressurized to press the adhesive onto the circuit substrate, and the other substrate is used to wind up the substrate from which the adhesive is peeled off. According to the invention of the fifth aspect of the invention, when the adhesive is pressed against the circuit board, the casing is held by one hand, and the opening of the exposed adhesive tape is pressed against the circuit board, and is disposed in the opening. The heating member on the substrate side of the adhesive tape abuts the adhesive tape located at the opening, and presses the adhesive to the circuit substrate. Secondly, when the adhesive tape is advanced against the adhesive tape under the heating member, the adhesive tape is pulled out from one of the disks, and when the adhesive tape is pulled out from the disk, the disk rotates, so it is fixed at The gear on the coaxial side of one of the discs will rotate, and the gear of the other of the discs that rotates with it will also rotate, and the other disc will take up the substrate from which the adhesive has been peeled off. For the power supply of the heating member, the supply of the electric power can be switched by using a switch disposed in the casing, or the pressure-46-200823137 switch can be disposed on the heating member, and the heating member can be felt when pressed. The pressing is detected to supply electric power to the heating member. The adhesive may be a conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive or a dispersion of the insulating spacer particles in the adhesive. The invention described in claim 60 is an adhesive tape applied to a substrate, which is characterized in that the substrate is a metal film or an aromatic polyamide film. In the invention described in claim 60, since the substrate of the adhesive tape is made of a metal film (or metal foil) or an aromatic polyamide film, the substrate can be prevented even when the thickness of the substrate is thin. Problems such as stretching or cutting. Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, with the adhesive tape of the present invention, the number of rolls per one disk increases, and the manufacturing unit of the electronic component only needs to replace the number of times of the new adhesive tape, so that work efficiency can be improved. Further, in the manufacture of the adhesive tape, the number of the manufactured sheets can be reduced, and the amount of the disc and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The metal film should be made of a highly stretchable metal such as copper, aluminum, stainless steel, iron, tin, or the like. Specific examples of the aromatic polyamide film are, for example, a para-aramid fiber membrane (MICTRON; trade name, manufactured by TORAY Co., Ltd.). The adhesive is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. The adhesive can also disperse the conductive particles. The conductive particles are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may also be in the aforementioned materials and/or non-conductive glass, ceramics, and plastics. The polymer core or the like is covered with the conductive layer or the like to form conductive particles. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The invention described in claim 60 is the invention described in claim 60, wherein the thickness of the substrate is Ιμηι 2 2 5 μηη, and the thickness of the substrate is Ιμηι~25μηι. The reason is as follows. When the thickness of the substrate is less than 1 μm, the substrate cannot obtain sufficient tensile strength and is easily broken. Further, when the thickness of the substrate exceeds 25 μm, the number of rolls per one disk cannot be obtained. The invention described in claim 62 is the invention of claim 60, wherein the tensile strength of the substrate is 300 MPa or more at 25 □. The reason why the tensile strength of the substrate is 300 MPa or more is as follows. When the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched, and the adhesive tape is easily broken. The invention described in claim 6 is the invention of any one of claims 60 to 62, wherein the ratio of the thickness of the substrate to the adhesive is 〇. 〇1~1. 0. The thickness ratio of the substrate to the adhesive is 〇. 〇1~1. The reason for 0 is as follows, the thickness ratio of the substrate to the adhesive is lower than 〇. When 〇 1, the substrate will be too thin, so that the adhesive tape cannot have sufficient strength. Moreover, the thickness ratio of the substrate to the adhesive exceeds 1. At 0, the thickness of the substrate will be too thick, and the number of rolls per disk will not be enough. The invention according to any one of claims 60 to 63, wherein the surface roughness Rmax of the base material is 〇·5 μΠ1 or less. The surface roughness Rmax of the substrate should be 〇. The reason for 5μιη or less is as follows, if Rmax exceeds 〇. 5μιη, Because of the unevenness of the surface of the substrate, When the adhesive is pressed onto the circuit board, The adhesive is not easily separated from the substrate. Applying for the invention described in item 65 of the patent scope, An adhesive tape forming method for forming an adhesive on an adhesive layer by applying an adhesive on a substrate and rolling it into a disk-like adhesive tape. Its characteristic is that Pull out the adhesive tape from the multiple trays, Laying the adhesive tapes into one, The base material is peeled off to form an adhesive which is integrally formed on the covering body. -49- 200823137 When the invention described in claim 65 is applied, The adhesive surface of the adhesive tape that is rolled out from one side of the plate, And the adhesive surface of the adhesive tape which is rolled out from the other side of the disk overlaps and the adhesive tape is integrated. The substrate of the other adhesive tape will be taken up to the take-up reel. The adhesive of the adhesive tape which is superposed and integrated is pressed against the covering by the pressurized heating head. Coating system electronic components or circuit boards, Such as lead frames or wafers of lead frames. in this way, a step before the formation of an adhesive on the covering, An adhesive that can make one of the adhesive tapes, And the adhesive of the other adhesive tape overlaps, After the desired thickness of the adhesive is obtained, an adhesive is formed on the covering, In the case of increasing the number of rolls of adhesive tape, However, the winding diameter of the adhesive tape per one disk can be reduced. therefore, Can increase the number of rolls of adhesive tape per 1 disk, And the adhesive dose that can be used for a large replacement operation is greatly increased. therefore, Only a small amount of new adhesive tape replacement work is required. Therefore, the production efficiency of the electronic machine can be improved. Applying for the invention described in item 66 of the patent scope, For example, if the invention described in the first paragraph of the patent application is applied, Its characteristic is that Only one of the adhesive tape adhesives contains a hardener. In the invention described in claim 66 of the patent application, In addition to the same effects as the invention described in claim 65, Because only one of the adhesive tape adhesives contains a hardener, Therefore, the adhesive of the other adhesive tape does not require a hardener. therefore, Adhesive tapes that do not contain an adhesive for hardeners do not require low temperature management. therefore, It can reduce the amount of adhesive tape that must be subjected to low temperature management. The transportation and storage of the adhesive glue -50- 200823137 can be managed efficiently. also, Adhesive tape that is not blended with hardener, And an adhesive for bonding the adhesive tape of the hardener, Applying a component that does not react with the hardener as the other adhesive. Except that the component that does not react with the hardener acts as a hardener, 尙 use the adhesive as one of the adhesives, Therefore, the preservation stability of the adhesive can be improved. The invention described in claim 67 is a conductive tape of a different conductive material. Its characteristic is that A majority of the wound laminate of the conductive material having a film-like adhesive is applied in the longitudinal direction of the core material. also, Applying for the invention described in item 68 of the patent scope, For example, apply the dissimilar conductive tape as described in item 67 of the patent scope. It is characterized in that the above-mentioned electrically conductive material is a cross-conductive material having a two-layer structure in which a base material film is disposed on one surface of a film-like adhesive. also, Applying for the invention described in item 69 of the patent scope, The dissimilar conductive tape described in the 67th item of the patent specification is characterized in that the dissimilar conductive material is a three-layer structure in which a base material film is disposed on both surfaces of the film-like adhesive. also, Apply for the invention described in item 70 of the patent scope, For example, the dissimilar conductive tape </ RTI> as described in claim 68 or 69 is characterized in that a peeling treatment is applied to one or both sides of the base film. Applying for the invention described in item 71 of the patent scope, For example, apply to the dissimilar conductive tape as described in any of items 67 to 70 of the patent scope. The width of the film adhesive is 〇·5~5mm°, Applying for the invention described in item 72 of the patent scope, For example, apply to the special conductive tape as described in any of the items in the range of items 68 to 7i. The strength of the substrate film is 12 kg/mm 2 or more. Stretching is 60~200%, The thickness is 100 μηη or less. Secondly, If the substrate film is colored transparent or colored and opaque, it is easy to judge the substrate film and the adhesive. also, It is also easy to determine the location of the rollout. Therefore, workability can be improved. [Embodiment] Next, refer to the attached drawings. Embodiments of the present invention will be described. also, In the following description, The same or equivalent components are attached with the same symbols. First of all, Referring to Figures 1 to 5, Embodiments of the invention described in claims 1 to 4 of the patent application will be described. Fig. 1 is a perspective view showing the connection between the adhesive sheets of the adhesive tape connecting method of the first embodiment, Figure 2 is a connection diagram of the connection part (A) of Fig. 1 and Figure 2A is a cross-sectional perspective view of the end tape of the adhesive tape that has been used, Figure 2B is an oblique view of the adhesive tape used to re-fold the new adhesive tape. Figure 3 is a schematic diagram of the adhesive pressing step of the adhesive device, Figure 4 is a cross-sectional view of the adhesion between the circuit boards, Fig. 5 is a step diagram of a method of manufacturing an adhesive tape. Adhesive tape 1 is wound around the disc 3, 3 a, Each disk 3, 3a is equipped with a reel 5, And a side plate 7 disposed on both width sides of the adhesive tape 1. that is, Each disk 3, 3 a has a reel 5, And side plates 7 respectively disposed on the two width sides of the adhesive tape 1. Adhesive tape 1 is made of substrate 9, And an adhesive 1 1 applied to one side of the substrate 9 -52- 200823137. From intensity, And the constituent conductive substrate 9 should be made of OPP (stretched polypropylene treated PET (polyethylene terephthalate is not limited thereto). The adhesive 1 1 is made of a thermoplastic resin and a thermosetting resin. The plastic resin is a styrene resin. The curable resin is an epoxy resin. The resin is representative. Conductive 3| Au is dispersed in the adhesive 1 1 Ag, Pt, Ni, Cu, W, Sb or carbon, Graphite, etc. Also in the foregoing, A conductive layer made of a polymer material such as plastic or the like is formed to cover the conductive layer. The insulating layer covers the conductive particles 13 and the insulating particles. Forming a conductive pressurization on a polymer core material such as glue to deform the deformation, Therefore, when connecting, it can increase the contact with the circuit. There is no melting point in the use of polymers as nuclear materials. The electrode joint member can be easily obtained by wide connection temperature. In terms of the peelability of the adhesive of the material, ), PTFE, Or by a bismuth diester), however, Paraphilic resin, Thermosetting resin, Or a mixture, Or hot metal. Heat and polyester resin are representative, Hot, Vinyl ester resin, Acrylic space 1 3 . Conductive particles 13 are, for example, Sn, Metal particles such as solder, And non-conductive glass, Ceramics The material of the aforementioned conductive particles 13 is sobs 1 3 . In addition, It is also possible to apply insulating film particles, Or use hot molten metal such as solder, Or plastic layer, There will be a reduction in the area between the electrodes due to heating or pressurization or connection. And can improve reliability. Especially good, Since the conductive particles 13 can be controlled to soften under the soldering degree, The thickness and flatness error of the connection -53- 200823137 Secondly, The method of using the adhesive tape 1 of the present embodiment will be described. As shown in Figure 3, Put the adhesive tape 1 on the tray 3 a, And the winding tray 7 is attached to the adhesive device 15 5, The leading end of the adhesive tape 1 wound on the disk 3a is attached to the take-up reel 17 via the guide pin 22. And roll out the adhesive tape 1 (arrow E in Figure 3). Secondly, The adhesive tape 1 is placed on the circuit board 2 1 , To be configured in two sets of 3 a, 1 7 heat and pressure head 1 9 is pressed from the substrate 9 side by the adhesive tape 1 The adhesive 1 1 is pressed against the circuit board 21. Thereafter, The substrate 9 is taken up to the take-up reel 17. After the above pressing (temporary connection), The electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. The official connection is shown in Figure 4. A wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, when necessary, For example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 2 1 . Using this method, The electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. P The PDP of the adhesive tape 1 of the present embodiment is used. Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. The amount of adhesive 1 used in one use will be much larger than the conventional use. therefore, The amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (see Fig. 1). The method for connecting the adhesive tape of the present invention can be divided into the following two types. -54- 200823137 (a) Direct use of the take-up reel 17, Replace the adhesive tape of the remaining adhesive tape 1 with a small number of residual rolls and connect the new adhesive tape and the take-up reel 17, (b) using an adhesive tape having a reduced number of residual rolls of the adhesive tape 1 already used as the take-up reel 1 7 Also connect the new adhesive tape and the adhesive tape with less residual volume. (b), As shown in Figure 1, In order to replace the disc 3a with the new adhesive sheet 3, The end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. And the connection of the beginning end portion 3 2 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3. The connection of the adhesive tape 1 is When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, Will be as shown in Figure 2A, Will cut (B) ' from the vicinity of the end mark 28 of the adhesive tape 1 and fold the end portion 30 of the adhesive tape 1 back. The adhesive 1 1 surface of the adhesive tape 1 is placed on the upper side (Fig. 2B). Secondly, The surface of the adhesive 1 1 of the adhesive tape 1 of the new adhesive sheet 3 is superposed on the surface of the adhesive 1 1 of the adhesive tape 1 of the used disc 3 a (2nd) Figure B) ° Second, As shown in Figure 4, Place the overlap between the two on the workbench 104, The heating and pressurizing head 19 of the bonding device 15 is heated and pressurized to perform adhesion. Using this method, The adhesive tape 1 wound on the used tray 3 a can be connected. And the adhesive tape 1 wound on the new tray 3. Secondly, The used disc 3 a and the new disc 3 are swapped with each other. The new disc 3 is attached to the adhesive device 15. therefore, There is no need to carry out the work of loading the adhesive tape 1 to the roll -55- 200823137. also, Because of the adhesion between the n-faces of the adhesive, there is a high connection strength. Again, the position of the end mark 28 on the adhesive tape 1 is When the adhesive tape 1 is extended from the used disk (the disk in which the adhesive tape 1 is completely unwound) 3a to the heating and pressing head 19, It should be at a position from the fixing position of the adhesive tape 1 to the length of the used disk 3a to the length of the heating head ip. at this time, Cut off from the vicinity of the end marker 28, Even if the adhesive tape 1 is cut from the minimum necessary position, In addition to preventing the waste of the adhesive tape 1 It is possible to avoid the complicated operation of removing the used disc 3a and moving the used disc 3 a to bring the end mark 28 to the position of the heating press head 19. In this embodiment, Since the adhesive device 15 has a heating and pressing head 19 The heat pressurizing head 19 is used to carry out the adhesive 1 1 of the end portion 30 of the adhesive tape 1 of the used disc 3 a, And the adhesion of the new adhesive sheet 3, the adhesive 1 1 of the beginning end 32 of the tape 1, Therefore, it is not necessary to separately use a pressing device for the purpose of performing the pressing of the adhesive 1 1 . The disc 3 on which the adhesive tape 1 has been wound can be implemented, Replacement of 3a. Direct use of (a) volume pick-up disk 17. When the adhesive tape of the adhesive tape 1 which has been used is reduced in the number of remaining adhesive tapes is replaced with a new adhesive tape 'and the new adhesive tape and the take-up reel 1 7 are connected, the adhesive of the used disc 3a is exposed. When the end mark 28 of the material tape 1 is cut off from the vicinity of the end mark 28 of the adhesive tape 1, the end portion of the adhesive tape remaining on the side of the take-up reel 1 7 is folded back. The surface of the adhesive 11 is made to be the upper side. Next, the adhesive of the end portion of the adhesive tape 1 is 1 And the adhesive n faces of the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3 - 56 - 200823137 overlap each other. Secondly, Place the overlap between the two on the workbench 104, Adhesion is performed by heating and pressurizing the heating and pressing head 19 of the adhesive device 15. Using this method, The adhesive tape 1 wound on the take-up reel 1 can be connected And the adhesive tape 1 wound on the new tray 3. Using this method, Since the take-up reel 17 will only take up the substrate 9, Therefore, several adhesive sheets can be taken up. Reduce the number of replacements for the reel 1 7 And there is good work efficiency. Here, Referring to Figure 5, A method of manufacturing the adhesive tape 1 of the present embodiment will be described. On a substrate 9 that is unwound from the unwinder 25, The adhesive 11 mixed with the resin and the conductive particles 13 is applied by a coater 27, After drying in the drying oven 29, The original material is taken up by the coiler 31. The original material of the adhesive tape 1 that was taken up, After the cutter 3 3 is cut into a specific width and taken up to the reel, Side panels 7 from both sides, 7 is mounted on the reel, or, Roll up onto the reel with the side panel, Bundle it with the dehumidifying material, The management of low temperature (-5 °C~-1 〇 °C) is carried out and shipped. Secondly, A second embodiment of the present invention will be described. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 6, The beginning end portion 32 of the adhesive tape 1 using the new adhesive sheet 3 has the front conductive tape 41, Adhesive tape 1 for implementing new adhesive sheet 3 And the connection of the adhesive tape 1 wound on the used disc 3a. The leading tape 41 is composed of a substrate 63 and a surface of an adhesive 43 on the back surface thereof. The beginning end of the adhesive tape 1 of the new adhesive sheet 3 3 2, The base tape 9 is attached to the surface of the base material 9 of the adhesive tape 1 attached to the disk by the leading tape 41. Secondly, The front tape is peeled off from the surface of the substrate 9 Further, it is overlapped with the adhesive 1 1 of the end portion 30 of the adhesive tape 1 which is folded back. Place the overlap between the two on the workbench 104 Adhesion is performed by heating and pressurizing the heating and pressing head 19 of the adhering device 15. in this way, Since the adhesive tape 41 is used to carry out the end portion of the adhesive tape 1 which is completely unwound by the adhesive tape 41, And the adhesion of the beginning end portion 32 of the newly attached adhesive tape 1 Therefore, the connection between the adhesive tapes 1 is very simple. at this time, The surface of the adhesive 43 disposed on the back side of the substrate 63 of the leading tape 4 1 is adhesive. The connection may be carried out only by overlapping the surface of the adhesive 1 1 of the end portion 30 of the adhesive tape 1 which is folded back. The present invention is not limited to the above embodiments. As long as it does not depart from the gist of the present invention, Various modifications can be implemented. E.g, In the second embodiment described above, The adhesive tape 1 wound on the used tray 3 a is not folded back, As shown in Figure 7, The tape 41 is peeled off from the beginning end portion 32 of the newly attached adhesive tape 1 from the surface of the substrate 9 And attach it to the adhesive on the back side, 1 1 side, The leading tape 4 1 is attached to the surface of the adhesive 1 1 of the end portion 30 of the used adhesive tape 1 Further, it is also possible to apply heat and pressure by the heating and pressing head 19 of the adhesive device 15 to carry out adhesion. at this time, Since there is no need to fold the adhesive tape 1 which is completely rolled out, Therefore, it is possible to prevent the winding which may occur when the adhesive tape 1 is taken up to the take-up reel. at this time, The leading tape 41 of the beginning end portion 32 of the adhesive tape 1 is peeled off from the surface of the substrate 9 The leading tape 41 may be adhered to the surface of the substrate 9 of the adhesive tape 1 already used. Secondly, The invention described in Sections 5 to 8 of the patent application is described in -58-200823137. These inventions relate to electronic components and circuit boards, Or adhesion between circuit boards, And an adhesive tape that is electrically connected between the electrodes of the two ’, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Secondly, The background technology of the invention described in claims 5 to 8 will be described. In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection method between the electrodes of the two, Adhesive tape is used. 曰本特开200 1 -284005, It is described that the adhesive tape to which the adhesive material is applied on the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, A disc of adhesive tape (hereinafter referred to as "adhesive disc") is mounted on the adhesive device. Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is taken up from the self-adhesive material disc is pressed against the circuit board by a heating and pressing head, The residual substrate is then taken up by a take-up reel. Secondly, When the adhesive tape of the adhesive sheet is used up, Remove the used disk, And a take-up tray for taking up the substrate, The new take-up tray and the new adhesive sheet are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. however, In recent years, With the enlargement of panel images such as PDP, The adhesion area of the circuit substrate also increases. The amount of adhesive used in one use was also increased from -59 to 200823137. also, Because of the expansion of the use of adhesives, The amount of adhesive used has also increased. therefore, The replacement of the adhesive trays in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is 1 to 3 mm narrower, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, Then the diameter of the disc will also increase. It may not be possible to use an existing adhesive device because it cannot be attached to an existing adhesive device. therefore, The purpose of the invention described in claims 5 to 8 is Is providing a method of joining adhesive tapes, It can make the replacement of the adhesive plate easier. And improve the production efficiency of electronic machines. Secondly, Refer to Figure 8 A to C, Figure 3 ~ Figure 5, A first embodiment of the present invention will be described. Fig. 8 is a diagram showing a method of connecting the adhesive tape of the first embodiment, Figure 8 is a perspective view of the connection between the sheets of the adhesive material, Figure 8B is an oblique view of the connection method of the connecting portion of Figure 8A, Figure 8C is a plan view of the connecting portion of Figure 8A. 黏 Adhesive tape 1 is wound around the disc 3, 3a, Each disk 3, 3a is equipped with a reel 5, And disposed on the side plates of the two width sides of the adhesive tape 1 -60- 200823137 7. In this embodiment, The adhesive tape 1 has a length of about 50 m W of about 5 m. Adhesive tape 1 is made of substrate 9, And an adhesive 11 coated on the substrate 9. From intensity, And the releasability of the adhesive constituting the electrically conductive material. The substrate 9 should be made of OPP (extended polypropylene), PTFE, Or treated PET (polyethylene terephthalate), etc. Not limited to this. Adhesive 1 1 is made of thermoplastic resin, Thermosetting tree, a mixture of a thermoplastic resin and a thermosetting resin, Or a hot metal plastic resin system is a styrene resin type or a polyester resin type, and a hardening resin type is an epoxy resin type. Vinyl ester resin, Resin system, The resin is representative. The conductive particles 13 are dispersed in the adhesive 11. Conductive particles 1 Au, Ag, Pt, Ni, Cu, W, Sb, Sn, Metal or carbon such as solder Graphite, etc. Also in the aforementioned materials and non-conductive glass, The conductive particles such as plastics or the like are formed to cover the conductive layer formed of the conductive particles 13 to form the conductive particles 13 . In addition, The insulating layer of the conductive particles 13 may be covered by an insulating layer, Or electric particles 13 and insulating particles. A conductive layer is formed on a polymer core material such as a hot molten metal paste such as solder. It will have deformation due to deformation due to heating and pressurization. Therefore, the distance between the electrodes after the connection, Increase the contact area with the circuit when connecting. And can increase trust, it is, It is better to use polymers as the core material. Due to the conductive particles 1 3 , Width on one side, After 矽, And fat, Or system. Hot table, Hot acrylic 3 series such as particles, , The material of ceramics is applied to Or plastic pressurization or shrinking. For example, solder -61 - 200823137 does not have a melting point, It can also be controlled to soften at a wide range of connection temperatures. Further, it is possible to obtain a connecting member which is easy to correspond to the error of the thickness and flatness of the electrode. Secondly, The method of using the adhesive tape 1 of the present embodiment will be described. As shown in Figure 3, Put the adhesive tape 1 on the tray 3 a, And the take-up reel 17 is attached to the adhesive device 15, The front end of the adhesive tape 1 wound on the disk 3a is attached to the take-up reel 17 via the guide pin 22. And roll out the adhesive tape 1 (arrow E in Figure 3). Secondly, The adhesive tape 1 is placed on the circuit board 21, To be configured in two sets of 3 a, 1 7 heat and pressure head 1 9 is pressed from the substrate 9 side by the adhesive tape 1 The adhesive 1 1 is pressed against the circuit board 2 1 . Thereafter, The substrate 9 is taken up to the take-up reel 17. After the above pressing (temporary connection), The electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. The official connection is shown in Figure 4. A wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, when necessary, For example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 2 1 . Using this method, The electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected to the PDP of the adhesive tape 1 of the present embodiment. Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. The amount of adhesive 1 used in one use will be much larger than the conventional use. therefore, The amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the disc 3 a is taken up to the take-up reel 17 in a relatively short period of time - 62 - 200823137, The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 8A). The method for connecting the adhesive tape of the present invention can be divided into the following two types. (a) Direct use of the take-up tray 17. Replacing the adhesive tape of the adhesive tape 1 that has been used, and the remaining number of remaining rolls is reduced. And connect new adhesive tape and take-up tray 17. (b) using an adhesive tape having a reduced number of residual rolls of the adhesive tape 1 already used as the take-up reel 1 7 Also connect the new adhesive tape and the adhesive tape with less residual volume. (b), As shown in Figure 8, Figure A, In order to replace the disc 3 a with the new adhesive sheet 3, When the adhesive tape 1 of the disc 3a exposes the end mark 28, The end of the adhesive tape (the adhesive tape of one side) 1 of the disc 3 a will be implemented. And the connection of the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3 (refer to Fig. 8A). The connection of the adhesive tape 1 is As shown in Figure 8 and Figure B, The end portion of the adhesive tape 1 for the adhesive sheet 3 a will be 30. And the beginning end of the adhesive tape 1 of the new adhesive sheet 3 3 2, The surface of the adhesive 1 1 of the starting end portion 3 2 is superposed on the surface of the substrate 9 of the terminal portion 30. Secondly, Insert a slightly 3-shaped card stop pin 46 into the overlapping portion. Implementing the end portion of the adhesive tape 1 3 0, And the connection of the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3. Using this method, Adhesive tape 1 wound on the used disc 3 a can be implemented And the connection of the adhesive tape 1 wound on the new tray 3. in this way, The locking pin 46 can be used to fix the end portion 30 of the adhesive tape 1 which has been completely unwound, And the newly installed adhesive tape 1 is at the beginning 32', so the connection -63-200823137 is very simple. Secondly, Replace the used disc 3 a and the new disc 3 with each other. The new disc 3 is attached to the adhesive device 15. therefore, There is no need to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Direct use of (a) volume pick-up disk 17. When the adhesive tape of the adhesive tape 1 which has been used is reduced in the number of remaining adhesive tapes is replaced with a new adhesive tape 'and the new adhesive tape and the take-up reel 1 7 are connected, the adhesive of the used disc 3a is exposed. When the end mark 28 of the material tape 1 is cut off from the end mark 28 of the adhesive tape 1, End portion 30 of the adhesive tape remaining on the side of the take-up reel 1 7 The beginning portion 32 of the adhesive tape 1 of the new adhesive sheet 3 overlaps. Secondly, Insert a slightly 3-shaped card stop pin 46 into the overlapping portion of the two, Implementing the end portion of the adhesive tape 1 3 0, And the connection of the beginning end portion 3 of the adhesive tape 1 of the new adhesive material plate 3. Because the take-up reel 17 only winds up the substrate 9, Therefore, several adhesive sheets can be taken up. therefore, Can reduce the number of replacements of the reeling tray 17 And there is good work efficiency. Secondly, The second to fourth embodiments of the invention described in claims 5 to 8 will be described. In the following description, the same reference numerals will be given to the same parts, and the detailed description of the parts will be omitted. The following description mainly differs from the above-described first embodiment. In the second embodiment shown in Fig. 9, Using the claws 48 having the ends disposed at one side and the other, 49. And connecting the claws 48 at both ends, The locking member 4 7 of the elastic member 50 of 49 The terminal portion 30 of the adhesive tape 1 and the beginning end portion 3 of the other adhesive tape 1 are connected to -64-200823137. in particular, The end portion 3 of the adhesive tape 1 on one side and the beginning end 3 2 of the other adhesive tape 1 are brought into contact with each other. The claw portion 4 8 disposed at one end of the locking member 47 is locked to the terminal portion 30, And the claw portion 49 disposed at the other end is locked to the start end portion 3 2 , The claw portion 48 and the other claw portion 49 are pulled by the elastic member 5 〇. also, Claw 48, 47 Series A plurality of claws 5 having a pointed shape at the front end are disposed on the back surface of the plate member. Since the claw portion 4 8 disposed at one end of the locking member 47 is locked to the terminal portion 30, And the claw portion 49 disposed at the other end is locked to the start end portion 3 2 to connect the two, Therefore, the connection is very easy. Further, since there is an elastic member 50 between one of the claws 48 and the other of the claws 49, The elastic member 50 is stretched to lock the other claw portion 49 of the locking member 47 to any position of the beginning end portion 32 of the other adhesive tape 1, Therefore, the connection has a high degree of freedom. In the third embodiment shown in Fig. 10, For the terminal portion 30 of the adhesive tape 1 wound on the used disk 3a, And the new adhesive material plate 3 of the adhesive tape 1 at the beginning of the 3 2, The surface of the adhesive 1 1 of the starting end portion 3 2 is superposed on the surface of the substrate 9 of the terminal portion 30, Secondly, The elastically deformable clips 5 3 having a substantially three-dimensional cross section are sandwiched by the overlapping portions for fixing. Since the connection is carried out only by the clip 5 3 sandwiching the overlapping portion, Therefore, connecting work is very easy. In the fourth embodiment shown in Fig. 1, In the first embodiment, The metal holding piece 5 5 having a substantially 3-shaped cross section covers the overlapping portion, And the clamping piece 55 is flattened from both sides of the overlapping portion to connect the two. The connection is made by flattening the holding pieces 5 5 from both sides of the overlapping portion, Therefore, Kelly-65-200823137 obtained a strong connection with overlapping parts. The invention described in the fifth to eighth claims is not limited to the above embodiment. As long as it does not deviate from the scope of the gist of the invention described in Sections 5 to 8 of the patent application, Various modifications can be implemented. E.g, In the first embodiment described above, the locking pin 46 is not slightly rj-shaped. For a linear pin, at this time, The overlap should be fixed with a plurality of pins. In the second embodiment, A plurality of locking members 47 may be used in conjunction with the width of the adhesive tape 1. In the third embodiment and the fourth embodiment, a plurality of clips 5 3 or holding pieces 5 5 may be used. They are fixed from both sides of the overlapping portion of the adhesive tape 1 respectively. Secondly, The invention described in the claims 9 to 13 will be described. These inventions relate to electronic components and circuit boards, Or adhesion between circuit boards, And an adhesive tape that is electrically connected between the electrodes of the two ’, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Secondly, The background technology of the invention described in the claims 9 to 13 will be described. In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection method between the electrodes of the two, Adhesive tape is used. Japanese Patent Laid-Open Publication No. 2001-284005, It is described that the adhesive tape coated with the adhesive material on the substrate -66 - 200823137 is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, A disc of adhesive tape (hereinafter referred to as "adhesive disc") is mounted on the adhesive device. Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is taken up from the self-adhesive material disc is pressed against the circuit board by a heating and pressing head, The residual substrate is then taken up by a take-up reel. Secondly, When the adhesive tape of the adhesive sheet is used up, Remove the used disk, And a take-up tray for taking up the substrate, The new take-up tray and the new adhesive sheet are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. however, In recent years, With the enlargement of panel images such as PDP, The adhesion area of the circuit substrate also increases. The amount of adhesive used in one use has also increased. also, Because of the expansion of the use of adhesives, The amount of adhesive used has also increased. therefore, The replacement of the adhesive trays in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is 1 to 3 mm narrower, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, The diameter of the disc will also increase from -67 to 200823137. It may not be possible to use an existing adhesive device because it cannot be attached to an existing adhesive device. therefore, The purpose of the invention described in the scope of claims 9 to 13 is Is providing a method of joining adhesive tapes, It can make the replacement of the adhesive plate easier. And improve the production efficiency of electronic machines. Secondly, Referring to the attached drawings, An embodiment of the invention described in claim 9 to 13 will be described. First of all, Refer to Figure 1 2 Figure A, B, Figure 3 ~ Figure 5, The first embodiment of the invention described in the claims 9 to 13 of the patent application will be described. Fig. 2 is a diagram showing a method of connecting the adhesive tape of the first embodiment, Figure 1 2 Figure A is an oblique view of the connection between the adhesive sheets, Fig. 2B is a perspective view showing a method of connecting the connecting portions of Fig. 12A. Adhesive tape 1 is wound around the disc 3, 3 a, Each disk 3, 3a is equipped with a reel 5, And a side plate 7 disposed on both width sides of the adhesive tape 1. In this embodiment, The length of the adhesive tape 1 is about 50 m, The width W is approximately 3 mm. Adhesive tape 1 is made of substrate 9, And an adhesive 11 coated on one side of the substrate 9. From intensity, And the exfoliation of the adhesive to the electrically conductive material, Substrate 9 should be made of OPP (extended polypropylene), PTFE, Or consisting of ruthenium treated PET (polyethylene terephthalate), etc. however, It is not limited to this. Adhesive 1 1 is made of thermoplastic resin, Thermosetting resin, Or a mixture of a thermoplastic resin and a thermosetting resin, Or hot metal. Heat -68- 200823137 Plastic resin is made of styrene resin and polyester resin. The resin is made of epoxy resin. Vinyl ester resin, The resin is representative. Conductive particles 13 are dispersed in the adhesive 11. Conductive Au, Ag, Pt, Ni, Cu, W, Sb, Sn, Solder, etc. or carbon, Graphite, etc. Also in the foregoing and/or non-conductive ceramics, Plastic polymer materials such as plastic cover the conductive layer, It is also possible to apply an insulating layer to cover the aforementioned conductive particles. Or use conductive particles and insulating particles. In solder, etc. Or a conductive layer formed on a polymer core material such as plastic, Deformation that is deformed by pressurization or pressurization, Therefore, it will shrink after connecting. Increase the area of contact with the circuit when connecting, Sex. especially, It is better to use polymers as the core material. Like point, It can also be controlled to soften at a wide range of connection temperatures. It is easy to measure the thickness and flatness of the electrode. Secondly, Description of the adhesive tape of the present embodiment. As shown in Figure 3, The disc 1 7 of the adhesive tape 1 is attached to the adhesive device 15 5, The viscous front end wound on the disk 3a is attached to the take-up reel 7, And roll out the adhesive tape 1 arrow E). Secondly, Disposing the adhesive tape 1 on the electricity, To be configured in two sets of 3 a, 1 7 heating and pressing heads 1 9 Applying the adhesive tape 1 to the crimping, The adhesive 1 1 is pressed. Thereafter, The substrate 9 is taken up to the take-up reel 17. After the above pressing (temporary connection), Implementing the circuit infrastructure as a representative, Hot resin, Acrylic: The particles 13 are like metal particles, Electrical glass, Wait to form. The hot-melt metal of the insulating film particles can be improved by the distance between the electrodes heated, and the solder is not melted. And the connecting members are available. Use method 3 a, And the coiling tape 1 (the electrode on the road substrate 21 from the substrate 9 side to the circuit board 2 1 electrode 21 - 69 - 200823137 and the wiring circuit (electronic component) 2 3 Position and make a formal connection. Formally connected, As shown in Figure 4, A wiring circuit (or electronic component) 2 3 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, when necessary , For example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 2 3 on the circuit board 2 1 . Using this method, The electrode 2 1 a of the circuit board 2 1 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment is used. Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. The amount of adhesive 1 used in one use will be much larger than the conventional use. therefore, The amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the tray 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 12A). The joining method of the adhesive tape of the invention described in the ninth to thirteenth aspect of the patent application can be divided into the following two types. (a) directly using the take-up reel 1 7 ’ to replace the adhesive tape of the used adhesive tape 1 with less residual reeling tape, And connect the new adhesive tape and take-up tray 17. (b) using the adhesive tape having a reduced number of residual rolls of the adhesive tape 1 already used as the take-up reel 1 7 When connecting the new adhesive tape and the adhesive tape with less residual volume 〇 (b), As shown in Figure 12A, In order to replace the disc 3 a with the new adhesive sheet 3, The end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. And the connection of the beginning end portion 32 of the adhesive tape (the other adhesive tape) of the new adhesive sheet 3 wound on -70-200823137 (refer to Fig. 12A). The connection of the adhesive tape 1 is As shown in Figure 12B, The end portion of the adhesive tape 1 of the adhesive sheet 3 a will be used. And the beginning of the adhesive tape 1 of the new adhesive sheet 3 3 2, The surface of the adhesive 11 of the starting end portion 3 2 is superposed on the surface of the substrate 9 of the terminal portion 30. The overlap length of the two is about 2. The width W of the adhesive tape 1 is about 2. 5 times, Place it on the workbench 3 6 Adhesion is carried out by heating and pressurizing the heating and pressing head 19 of the adhering device 15. Using this method, Adhesive tape 1 wound on the used disc 3 a can be implemented And the connection of the adhesive tape 1 wound on the new tray 3. Secondly, Replace the used disc 3 a and the new disc 3 with each other. The new disc 3 is attached to the adhesive device 15. therefore, There is no need to carry out the work of attaching the new adhesive tape 1 to the take-up reel 1 7 . This embodiment uses a heated press head 19 There is no need to use a separate pressing device between the adhesives. The disc 3 on which the adhesive material 1 is wound can be replaced. 3 a 〇 Direct use of the roll of (a) Replace the adhesive tape with less residual reeling tape of the used adhesive tape 1 with a new adhesive tape. And when the new adhesive tape and the take-up tray 1 7 are connected, When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut off from the vicinity of the end mark 28 of the adhesive tape 1, End portion 30 of the adhesive tape remaining on the side of the take-up reel 1 7 The beginning portions 32 of the adhesive tape 1 of the new adhesive sheet 3 overlap each other. Secondly, The overlapping portion of the both is heated and pressurized by the heating and pressing head 19 of the bonding device 15 to perform adhesion. Because the take-up tray 1 7 -71 - 200823137 will only wind up the substrate 9, Therefore, several adhesive sheets can be taken up. Reduce the number of replacements of the take-up tray 17 And there is good work efficiency. Here, refer to Figure 5, A method of manufacturing the adhesive tape i of the present embodiment will be described. On a substrate 9 that is unwound from the unwinder 25, The adhesive n mixed with the resin and the conductive particles 13 is applied by a coater 27, And after drying in a drying oven, The original material is taken up by the coiler 31. The original material of the adhesive tape that was taken up, After the cutter 3 3 is cut into a specific width and taken up to the reel, Side panels 7 from both sides, 7 is mounted on the reel, Or 'retracted onto the reel with the side panel, Bundle it with the dehumidifying material, The management of low temperature (-5 ° C ~ -10 ° C) is carried out and shipped. Secondly, Other embodiments of the invention described in claims 9 to 13 will be described. In the embodiment described below, The same parts as those in the above embodiment will be denoted by the same reference numerals and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 3, a mold 56 in which one of the surfaces is jagged with unevenness (concavity and convexity) 44, And the other mold 5 7 holds the overlapping portion 3 of the adhesive tape 1 4, The overlapping portion 3 4 is formed into a concavity and convexity 5 8 . in this way, Using the formation of bumps 5 8, The adhesion area of the overlapping portion 34 can be increased, Further, the engagement of the unevenness 58 of the overlapping portion 34 can increase the strength of the stretching direction (the longitudinal direction of the adhesive tape). When bumps are formed, Adhesive 1 1 will flow and adhere to the end faces of the overlapping portions with an adhesive. The strength of the stretching direction of the overlapping portion 34 can be further increased. In the third embodiment shown in FIGS. 14A and 14B, The -72-200823137 is taken up to the beginning end 32 of the disc 3 of the new adhesive material 1 and bent into a slightly v-shape. The end portion 30 of the adhesive tape 1 wound on the used disc 3a is also bent into a slightly V-shape. To make the two hooks, the adhesives 1 1 must be opposite each other and locked (Fig. 14A). The heating and pressing head 19 is heated and pressurized to connect the two (Fig. 14B). In the third embodiment, Since the terminal end portion 30 and the start end portion 32 are hooked, a strong connection can be obtained. Simultaneously, By using the overlap of the adhesives 1 1 to connect, Therefore, a stronger connection can be obtained. Same as above, Because the adhesive will flow in the overlapping part and stick to the end face, Therefore, a stronger connection can be obtained. The fourth embodiment shown in FIGS. 15A and 15B shows Before the heating and pressurization of the first embodiment, The through hole 5 9 is formed in the overlapping portion 34 while heating and pressurizing. Using the through hole 5 9, When heated and pressurized, the adhesive 1 1 can be oozing out from the periphery of the through hole 509 and adhesively applied to improve the adhesion. The overlap 34 provides a strong connection. The invention described in the claims 9 to 13 is not limited to the above embodiment. As long as it does not deviate from the scope of the invention described in Sections 9 to 13 of the patent application, Various modifications can be implemented. E.g, In the second embodiment described above, Bump 5 8 does not have to be mountain type, It can also be a nine-shaped arc. In the fourth embodiment, The number of through holes 59 is not particularly limited. It can be any quantity. also, The diameter of the through hole 5.9 is not limited. also, 2nd , In the third embodiment, Further, a through hole 5.9 can be formed in the overlapping portion 34. Secondly, The invention described in the claims 1 to 14 of the patent application is described in the line -73-200823137. These inventions relate to electronic components and circuit boards, Or adhesion between circuit boards, And an adhesive tape for electrically connecting the electrodes of the two, especially, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Secondly, The background art of the invention described in the Patent Application Nos. 14 to 18 will be described. In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection method between the electrodes of the two, Adhesive tape is used. 曰本特开200 1 -284005, It is described that the adhesive tape to which the adhesive material is applied on the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, A disc of adhesive tape (hereinafter referred to as "adhesive disc") is mounted on the adhesive device. Pull out the beginning of the adhesive tape and attach it to the take-up reel. After the adhesive plate is loaded, #The substrate side of the adhesive tape which is rolled out from the adhesive material is pressed onto the circuit board by a heating and pressing head. Then take up the residual substrate with a take-up reel. 〇 Secondly, When the adhesive tape of the adhesive sheet is used up, Remove the used tray 'and the take-up reel of the take-up substrate, Put the new take-up tray and the new adhesive sheet on the _ occupying device. The beginning of the adhesive tape is attached to the take-up reel via the guide pin of the adhesive device. -74- 200823137 However, In recent years, With the enlargement of the panel image of the PDP, etc., the adhesion area of the circuit substrate also increases. The amount of adhesive used in one use has also increased. also, Because of the expansion of the use of adhesives, The amount of adhesive used has also increased. therefore, The replacement of the adhesive trays in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is 1 to 3 mm narrower, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may be because the adhesive oozes from both sides of the tape and becomes a cause of blockage. In addition, If the number of rolls of adhesive tape increases, Then the diameter of the disc will also increase. It may not be possible to use an existing adhesive device because it cannot be attached to an existing adhesive device. on the other hand, Adhesive tape and adhesive tape are adhered to the adhesive tape, and the adhesive is not sufficiently adhered. In order to make the adhesive tape have good adhesive peelability, A fluorine-based release agent or a sand-based release agent may be applied thereto. The above situation is because of its influence. therefore, The purpose of the invention described in the scope of patent application No. 4~1, Is providing a method of joining adhesive tapes, In particular, when the substrate of the adhesive tape is made of a ruthenium-treated substrate, It can also make the replacement of the adhesive plate easier. And improve the production efficiency of electronic machines. Secondly, Referring to the attached drawings, The description of the invention of the invention described in the patent application No. 1 4 to 18-75-200823137 is first described with reference to FIG. B, Figure 3 ~ Figure 5, The first embodiment of the invention described in the Patent Application Nos. 14 to 18 will be described. Fig. 16 is a diagram showing a method of connecting the adhesive tape of the first embodiment, Figure 16 is a perspective view of the connection between the sheets of adhesive material. Fig. 16 is a perspective view showing the connection method of the connecting portion (b) of Fig. 16A. Adhesive tape 1 is wound around the disc 3, 3 a, Each disk 3, 3a is equipped with a reel 5, And disposed on the side plates of the two width sides of the adhesive tape 1. Adhesive tape 1 is treated by enamel substrate 9, And an adhesive 11 coated on one side of the enamel processing substrate 9. From intensity, And the exfoliation of the adhesive to the electrically conductive material, 矽Processing substrate 9 should be made of OPP (extended polypropylene), PTFE, Or a substrate made of PET (polyethylene terephthalate), The surface thereof is subjected to surface treatment using a resin or the like. Adhesive 1 1 is made of thermoplastic resin, Thermosetting resin, Or a mixture of a thermoplastic resin and a thermosetting resin, Or hot metal. The thermoplastic resin system is represented by a styrene resin system and a polyester resin system. The thermosetting resin is made of epoxy resin. Vinyl ester resin, Acrylic resin, The resin is representative. The conductive particles n are dispersed in the adhesive 11. The conductive particles 13 are such as Au, Ag, Pt, Mi, Cii, W, Sb, Sn, Metal particles such as solder, Or carbon, Graphite, etc. Also in the aforementioned materials and non-conductive glass, Ceramic, A plastic core or the like is covered with a conductive layer or the like to form conductive particles -76-200823137. In addition, It is also possible to apply an insulating coating particle covering the conductive particles with an insulating layer, Or use conductive particles and insulating particles. a hot molten metal such as solder, Or a conductive layer formed on a polymer core material such as plastic, It will have deformation due to deformation due to heat, pressure or pressure. Therefore, the distance between the electrodes after connection will be reduced. Increase the area of contact with the circuit when connecting, It can improve reliability. especially, It is better to use polymers as the core material. If the solder has no melting point, It can also be controlled to soften at a wide range of connection temperatures. A connecting member which is easy to correspond to the thickness and flatness of the electrode can be obtained. Secondly, The method of using the adhesive tape of the present embodiment will be described. As shown in Figure 3, Put the adhesive tape 1 on the tray 3 a, And the take-up tray 17 is attached to the adhesive device 15, The front end of the adhesive tape 1 wound on the disk 3a is attached to the take-up reel 17, And roll out the adhesive tape 1 (arrow E in Figure 3). Secondly, Disposing the adhesive tape 1 on the circuit board 21, Configured to be configured on two disks 3 a, The heat and pressure of the seven-part arrangement is performed by pressing the adhesive tape 1 from the side of the enamel-treated substrate 9 . The adhesive 11 is pressed against the circuit board 2 1 . Thereafter, The crucible substrate 9 is taken up to the take-up tray 17. After the above pressing (temporary connection), The electrodes of the circuit board 2 1 and the electrodes of the wiring circuits (electronic components) 23 are positioned and connected. Formally connected, As shown in Figure 4, A wiring circuit (or electronic component) 2 3 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, If necessary, for example, PTFE 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 2 1 . Use this side -77- 200823137, The electrode 2 1 a of the circuit board 2 1 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment is used. Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. The amount of adhesive 1 used in one use will be much larger than the conventional use. therefore, The amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the tray 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 16A). The method of connecting the adhesive tape of the invention described in the patent application No. 14 to 18 can be classified into the following two types. (a) use the take-up reel 1 7 directly, Replacing the adhesive tape of the adhesive tape 1 that has been used, which has a small number of residual rolls, And connect the new adhesive tape and take-up tray 17. (b) using the adhesive tape having a reduced number of remaining rolls of the adhesive tape 1 as the take-up reel 1 7 , When connecting the new adhesive tape and the adhesive tape with less residual volume 〇 (b), As shown in Figure 16A, In order to replace the disc 3 a with the new adhesive sheet 3, The end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. And the connection of the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3. The connection of the adhesive tape 1 is As shown in Figure 16B, The end portion of the adhesive tape 1 of the adhesive plate 3 a 3 0, And the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3 will abut each other. To span two adhesive materials -78- 200823137 tape 1, 1 after processing the substrate 9, The surface of the 9 is attached to the adhesive tape 60, Implement two adhesive tapes1 1 connection. The adhesive tape 60 is composed of a base material 63 and an adhesive 62 applied to one side of the base material 63. The material of the substrate 63 is not particularly limited. however, This embodiment is a polyimine resin material. also, In Figure 16 and Figure B, The adhesive 1 1 of the adhesive tape and the adhesive portion 43 of the adhesive tape 60 are indicated by oblique lines, respectively. Here, The adhesion of the adhesive tape 60 will be described. One side and the other side of the adhesive tape 1, 1 after processing the substrate 9, 9 because they are covered with cockroaches, Therefore, it is difficult to adhere with an adhesive. however, In this embodiment, Because the adhesive 43 of the adhesive tape 60 is made of enamel resin, Two substrates for processing the substrate 9, 9 the surface tension difference will be smaller, The adhesion (adhesion) allows a good connection between the end portion 30 of the adhesive tape 1 of one side and the beginning end portion 3 2 of the other adhesive tape 1 of the other. 矽 Adhesive tape 60 on the surface of adhesive 62, And processing the substrate 9, 9 The surface tension difference should be 1 OmN/m (10dyne/cm) or less. In this embodiment, There is almost no difference in surface tension. In general, The end portion of the adhesive tape 1 on one side 30 and the other two treatment substrates 9 of the adhesive tape 1 The surface tension of 9 is 25mN/m~60mN/m (25~60dyne/cm). E.g, When the surface tension is 30mN/m, The surface tension of the adhesive 62 of the adhesive tape 60 should be set to 20 mN/m or more. 40mN/m or less. The lanthanum adhesive is mainly composed of enamel rubber and enamel resin. In general, It causes the two to have a little condensation reaction and is adhesive. Secondly, 利 -79- 200823137 with peroxide, The hydrogenation reaction of the platinum catalyst is cross-linked, Glass transfer temperature is below -100 °c. All of the above are marketers, You can choose the appropriate one to use. in this way, The adhesive tape 1 wound on the used adhesive disk 3 a is applied by the adhesive tape 60. And the connection of the adhesive tape 1 wound on the new adhesive sheet 3. Secondly, The used adhesive sheet 3 a and the new adhesive sheet 3 are mutually exchanged. The new adhesive sheet 3 is attached to the adhesive device 15. therefore, It is not necessary to pull out the adhesive tape 1 of the new adhesive sheet 3 and attach the adhesive tape to the take-up tray. Or the new adhesive tape 1 is attached to the guide pin 36 of the adhesive device 15. Therefore, the adhesive plate 3, 3 a replacement has good working efficiency. in this way, Because the terminal portion 30 of the adhesive tape 1 that has been completely rolled out, And the newly-installed adhesive tape 1 at the beginning end 3 2 is connected by adhesive tape. Therefore, the connection is very simple. Secondly, Replace the used disc 3 a and the new disc 3 with each other. The new disc 3 is attached to the adhesive device 15. therefore, There is no need to load the new adhesive tape 1 to the take-up reel 1 7 . Direct use of (a) volume pick-up disk 17. Replace the adhesive tape with less residual reeling tape of the used adhesive tape 1 with a new adhesive tape. And when the new adhesive tape and the take-up tray 1 7 are connected, When the end mark 28 of the adhesive tape 1 of the used disc 3 a is exposed, the cutting is performed near the end mark 28 of the adhesive tape 1 . End portion 30 of the adhesive tape remaining on the side of the take-up reel 1 7 And the beginning end portion 3 2 of the adhesive tape 1 of the new adhesive sheet 3 abuts each other. Next, the end portion 3 G of the adhesive tape 1 is applied by the adhesive tape at the abutting portion of the two. And the new adhesive material plate 3 -80- 200823137 The connection of the beginning end portion 3 of the adhesive tape 1 . Because the take-up tray 17 only picks up the substrate 9, Therefore, several adhesive sheets can be taken up. Reduce the number of replacements for the reel 1 7 And there is good work efficiency. Secondly, Referring to Figure 5, A method of manufacturing the adhesive tape i of the present embodiment will be described. On a substrate 9 that is unwound from the unwinder 25, An adhesive formed by mixing a resin and conductive particles with a coater 27, After drying in the drying oven 29, The original material is taken up by the coiler 31. The original material of the adhesive tape that was taken up, After the cutter 3 3 is cut into a specific width and taken up to the reel, Side panels 7 from both sides, 7 is mounted on the reel, or, Roll up onto the reel with the side panel, Bundle it with the dehumidifying material, Implement low temperature (-5°C~-l〇°C) management and ship. Secondly, Other embodiments of the invention described in the Patent Application Nos. 14 to 18 will be described. The same portions as those in the above embodiment will be denoted by the same reference numerals and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 17, In addition to the first embodiment described above, At the end of the adhesive tape 1 on one side 30, The adhesive tape 60 is also adhered to the side of the adhesive 1 1 at the beginning end portion 32 of the other adhesive tape. In the second embodiment, the adhesive tape 6 of the adhesive tape 60 is used. Its adhesion is 1 〇 〇 g / 2 5 m m or more. In the present embodiment, it is 700 g / 25 mm to 1400 g / 25 mm. also, The setting of the surface tension of the sand adhesive 62 of the sand adhesive tape 60, The surface tension difference of the base material of the adhesive tape of the one of the above and the other embodiment is -81 - 200823137 10 mN/m (10 Odyne/cm) or less. In the second embodiment, The end portion of the adhesive tape 1 on one side and the other end of the adhesive tape on the other side 两32 are adhered by the adhesive tape 60, The two adhesive tapes can be implemented with higher strength than the first embodiment. 1 is sticky. The third embodiment shown in Fig. 18, The end portion 30 of one of the adhesive tapes 1 and the other end portion 3 2 of the other adhesive tape 1 are disposed in an overlapping manner, and the side surface of the substrate 9 and the side surface of the adhesive 1 1 are attached to the second embodiment.矽 Adhesive tape 6〇, Using this third embodiment, The same operational effects as those of the second embodiment can be obtained. The fourth embodiment shown in FIG. Attached to the terminal part of the adhesive tape 1 on one side 30, And between the beginning end portion 3 2 of the other adhesive tape i, There are adhesive tapes on both sides of the substrate coated with the adhesive 62. It is used to connect the terminal part 30 and the start part 3 2 . With this fourth embodiment, Because of the use of two-sided adhesive tape 6 1, The connection between the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 3 of the other adhesive tape 1 is much simpler and easier. Secondly, The invention described in the Patent Application No. 19-2-1 is described. These inventions relate to electronic components and circuit boards, Or adhesion between circuit boards, And an adhesive tape for electrically connecting the electrodes of the two, especially, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Secondly, The background art of the invention described in the Patent Application No. 19-2-1 is described. In general, LCD panel, PDP (plasma display panel), EL (-82- 200823137 fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection between the electrodes of the two is based on adhesive tape. Japanese Patent Laid-Open Publication No. 2001-284005, It is described that the adhesive tape to which the adhesive material is applied on the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, A disc of adhesive tape (hereinafter referred to as "adhesive disc") is mounted on the adhesive device. Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is taken up from the self-adhesive material disc is pressed against the circuit board by a heating and pressing head, The residual substrate is then taken up by a take-up reel. Secondly, When the adhesive tape of the adhesive sheet is used up, Remove the used disk, And a take-up tray for taking up the substrate, The new take-up tray and the new adhesive sheet are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. however, In recent years, With the enlargement of panel images such as PDP, The adhesion area of the circuit substrate also increases. The amount of adhesive used in one use has also increased. also, Because of the expansion of the use of adhesives, The amount of adhesive used has also increased. therefore, The replacement of the adhesive trays in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is narrower than 1~-83-200823137 3mm, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, Then the diameter of the disc will also increase. It may not be possible to use an existing adhesive device because it cannot be attached to an existing adhesive device. therefore, The purpose of the invention described in the Patent Application No. 1 9 to 2, The method of connecting the adhesive tape, The replacement of the adhesive sheet can be made simpler. And improve the production efficiency of electronic machines. Secondly, Referring to the attached drawings, An embodiment of the invention described in the claims 9-9 to 21 will be described. First of all, Refer to Figure 20 A to C, Figure 2, Figure 4, And Figure 5, The first embodiment of the invention described in the Patent Application No. 19-2-1 is described. 20A to C are views showing a method of connecting the adhesive tape of the embodiment. Figure 20A is an oblique view of the connection between the adhesive sheets, Fig. 20 is a cross-sectional view showing the connection method of the connecting portion of Fig. 20A. Adhesive tape 1 is wound around the disc 3, 3 a, Each disk 3, 3a is equipped with a reel 5, And the side plate disposed on the two width sides of the adhesive tape 1 7 The adhesive tape 1 is composed of the substrate 9, And an adhesive 11 coated on one side of the substrate 9. From intensity, And the exfoliation of the adhesive to the electrically conductive material, Substrate 9 should be made of opp (extended polypropylene), PTFE, And ruthenium-treated PET (polyethylene terephthalate), etc. however, -84- 200823137 is not limited to this. Adhesive 1 1 is made of thermoplastic resin, Thermosetting resin, Or a mixture of a thermoplastic resin and a thermosetting resin, Or hot metal. The thermoplastic resin system is represented by a styrene resin system and a polyester resin system. The thermosetting resin is made of epoxy resin. Vinyl ester resin, Acrylic resin, The resin is representative. The conductive particles 13 are dispersed in the adhesive 11. Conductive particles 13 are like An, Ag, Pt, Ni, Cu, W, Sb, Sn, Metal particles such as solder, Or carbon, Graphite, etc. Also in the aforementioned materials and non-conductive glass, Ceramic, A polymer core material such as plastic is formed to cover the conductive layer. In addition, It is also possible to apply an insulating coating particle covering the conductive particles with an insulating layer, Or use conductive particles and insulating particles. Hot molten metal such as solder, Or a conductive layer formed on a polymer core such as plastic, Will have deformation due to deformation by heating, pressurization or pressurization, Therefore, the distance between the electrodes after the connection is reduced. Increase the area of contact with the circuit when connecting, And can improve reliability. especially, It is better to use polymers as the core material. If the solder has no melting point, It can also be controlled to soften at a wide range of connection temperatures. Further, it is possible to obtain a connecting member which is easy to correspond to the error of the thickness and flatness of the electrode. Secondly, The method of using the adhesive tape of the present embodiment will be described. As shown in Figure 21, Put the adhesive tape 1 on the tray 3 a, And the take-up tray 1 7 is attached to the adhesive device 15 5, The front end of the adhesive tape 1 wound on the disk 3a is attached to the take-up reel 1 7 ' via the guide pin 2 2 and the adhesive tape 1 is unwound (arrow E in Fig. 21). Next, the adhesive tape 1 is placed on the circuit board 21, Use the configuration on two sets of 3, 1 7 heating plus -85- 200823137 The indenter 19 is pressed from the substrate 9 side by the adhesive tape 1 The adhesive 11 is pressed against the circuit board 21. Thereafter, Winding the substrate 9 to the take-up reel 17 〇 After the above pressing (temporary connection), The electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. Formally connected, As shown in Figure 4, A wiring circuit (or electronic component) 2 3 is disposed on the adhesive 1 1 pressed onto the circuit board 21, when necessary, For example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The circuit board 21 is heated and pressurized by the heating and pressing head 19. In this way, The electrode 2 1 a of the circuit board 2 1 and the electrode 2 3 a of the wiring circuit 23 can be connected. By using the PDP of the adhesive tape 1 of the present embodiment, Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. The amount of adhesive 1 used in one use will be much larger than the conventional use. therefore, The amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the tray 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 20A). The method of connecting the adhesive tape of the invention described in the Patent Application No. 19-2-1 can be divided into the following two types. (a) use the take-up reel 1 7 directly, Replacing the adhesive tape of the adhesive tape 1 that has been used, which has a small number of residual rolls, And connect the new adhesive tape and the take-up reel 17, (b) using the adhesive tape having a reduced number of remaining rolls of the adhesive tape 1 as the take-up reel 1 7 , And connect the new adhesive tape and the adhesive tape with less residual volume -86- 200823137 (b), As shown in Figure 20, In order to replace the disc 3 a with the new adhesive sheet 3, When the adhesive tape 1 of the disc 3a is exposed with the end mark 28, the end portion of the adhesive tape (one adhesive tape) of the disc 3a 3〇, The starting end portion 3 2 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3 is joined by a resin adhesive 64. The resin adhesive 64 is, for example, an epoxy resin. Cyanate resin, Two horses, imine resin, Phenolic resin, Urea resin, Melamine resin, Alkyd resin, Acrylic resin, Unsaturated polyester resin, Diallyl phthalate resin, Resin, Resorcinol formaldehyde resin, Xylene resin, Furan resin, Polyurethane resin, Ketone resin, Tripolyallylamine cyanide resin and the like. The connection of the adhesive tape 1 is as shown in FIG. The terminal portion 30 of the adhesive tape 1 for the adhesive sheet 3a, And the beginning end of the adhesive tape 1 of the new adhesive sheet 3 3 2, The surface of the adhesive 1 1 of the starting end portion 3 2 is superposed on the surface of the substrate 9 of the end portion 30. Secondly, The paste-form resin adhesive 64 is applied to the overlapping portion by a charging machine 65 combined with the adhesive device 15. Secondly, As shown in Figure 20, When the resin adhesive 64 is a thermosetting resin, Hardening is performed by heating by a heater 66 combined with the bonding device 15, Connecting the end portion of the adhesive tape 1 3 0, And the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3. Using this method, Adhesive tape 1 wound on the used disc 3 a can be implemented And the connection of the adhesive tape 1 wound on the new tray 3. in this way, The terminal portion 30 of the adhesive tape 1 -87- 200823137 which has been completely rolled out is fixed by the adhesive 8 made of a resin, And the beginning end 32 of the newly attached adhesive tape 1 Therefore, the connection is very simple. Secondly, The used disc 3 a and the new disc 3 are swapped with each other', and the new disc 3 is attached to the adhesive device 15. therefore, There is no need to carry out the work of attaching the new adhesive tape 1 to the take-up reel 1 7 . Direct use of (a) volume pick-up disk 17. Replace the adhesive tape with less residual reeling tape of the used adhesive tape 1 with a new adhesive tape. And when the new adhesive tape and the take-up tray 1 7 are connected, When the end mark 28 of the adhesive tape 1 of the used disc 3 a is exposed, the cutting is performed from the vicinity of the end mark 28 of the adhesive tape 1 . The end portion 30 of the adhesive tape remaining on the side of the take-up reel 1 7 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are overlapped. Secondly, Applying a paste-like resin adhesive 64 on the overlapping portion of the two, Heating according to the type of resin adhesive used, UV irradiation, etc., to make it adhesive, Implementing the terminal unit 30, And the connection of the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3. Because the take-up tray 17 only winds up the substrate 9, Therefore, several adhesive sheets can be taken up. Reduce the number of replacements of the reel 1 7 And there is good work efficiency. Here, Referring to Figure 5, A method of manufacturing the adhesive tape 1 of the present embodiment will be described. On a substrate that is unwound from the unwinder 25, The adhesive n mixed with the resin and the conductive particles 13 is applied by a coater 27, And after drying in a drying oven, The original material is taken up by the coiler 31. The original material of the adhesive tape that was taken up, After the cutter 3 3 is cut into a specific width and taken up to the reel, Side panels 7 from both sides, 7 is mounted on the reel, -88- 200823137 Or, Roll up onto the reel with the side panel, Bundle it with the dehumidifying material, The management of low temperature (-5°έ~-1 〇°c) is carried out and shipped. The invention described in the Patent Application No. 19-2-1 is not limited to the above embodiment. As long as it does not deviate from the scope of the invention of the invention as stated in Articles 1 9 to 2 of the patent application, Various modifications can be implemented. In this embodiment, The resin adhesive 64 is an example of a thermosetting resin. however, It is also possible to replace the thermosetting resin with a photocurable resin. Hardening of the curable resin by irradiation with ultraviolet light or the like, Implement a connection between the adhesive tapes. at this time, The photocurable resin may be a composition in which a photopolymerization initiator is blended with a resin having an acrylic group or a methacrylic acid group, Or contain aromatic azo salts, Diallyl iodide salt, An epoxy resin such as a light hardener such as barium salt. also, The resin adhesive may also be a hot metal adhesive mainly composed of an ethylene vinyl acetate resin or a polyolefin resin. For example, when a plate-shaped hot metal bonding material is used, Place a plate-shaped hot metal adhesive on the overlapping portion of the adhesive tape 1 After the hot metal adhesive is heated by the heater 66 to be melted, Cooling to cure the hot metal adhesive, Implement the connection of the adhesive tape 1 . a resin adhesive used for bonding the adhesive tape 1 Also available from thermosetting resins, Photocurable resin, And a plurality of groups of hot metal adhesives are used for selection. In the above embodiment, Making the substrate 9 of the end portion 30 of the adhesive tape 1 of the adhesive sheet 3 a, And the adhesive tape 1 of the new adhesive material plate 1 -89- 200823137 at the beginning end 3 2 of the adhesive 1 1 surface overlap each other, And applying a thermosetting resin of a resin adhesive to carry out the connection, however, It is also possible to re-fold the end of the adhesive tape 1 3 of the adhesive tape 3 3, And after bonding the two sides with overlapping adhesives, It is then fixed with a thermosetting resin. Secondly, The invention described in the claims 22 to 24 will be described. These inventions relate to electronic components and circuit boards, Or adhesion between circuit boards, And an adhesive tape for electrically connecting the electrodes of the two, especially, It is associated with a disc-shaped adhesive tape tray and an adhesive device. Secondly, The background art of the invention described in the claims 22 to 24 will be described. In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection method between the electrodes of the two, Adhesive tape is used. Japanese Patent Laid-Open Publication No. 2001-284005, It is described that the adhesive tape to which the adhesive material is applied on the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, Attaching the adhesive tape tape wound with the adhesive tape to the adhesive device, Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is unwound from the adhesive tape is pressed against the circuit substrate by a heating and pressing head, etc. The residual substrate is then taken up by a take-up reel. -90- 200823137 Secondly, When one of the adhesive tapes of the adhesive tape is used up, Used up, And a take-up tray for taking up the substrate, Load the new take-up tray and the new adhesive tape onto the adhesive unit. Place the beginning of the adhesive tape on the take-up reel. however, In recent years, With the enlargement of panel images such as PDP, The adhesion area of the road substrate also increases. The amount of adhesive used in one use increases. also, Because of the expansion of the use of adhesives, The amount of adhesive used is increased. therefore, Adhesive tapes for electronic machine manufacturing plants are more frequent, Because the replacement of the adhesive tape is very troublesome, Therefore, there is a problem of improving the production efficiency of electronic machines. For this issue, It can be considered to increase the number of rolls of adhesive glue that is taken up to the disc. To increase the adhesion dose per plate, Used to reduce the replacement rate of the disc, however, Because the tape width of the adhesive tape is a narrower 1 3mm, If the number of volumes is increased, the volume may be scattered. also, If the number of rolls is increased, the pressure applied to the adhesive tape wound into a tape shape will increase. It can cause g-adhesives to ooze out from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, Then the diameter of the disk will increase. It may not be possible to attach an existing adhesive device to an existing adhesive device. therefore, The purpose of the invention described in claim 22 to 24, Is providing an adhesive tape tray, And adhesive device, It makes the replacement of the adhesive tape tray easier. And improve the production efficiency of electronic machines. Secondly, Referring to the attached drawings, An embodiment of the invention described in the 22nd to the patent application is described. First of all, Refer to the 22nd for the electric and the same method for the frequency. 24 -91 - 200823137 A~C, Figure 23, Figure 4, And Figure 5, The first embodiment of the invention described in the patents Nos. 22 to 24 will be described. Figs. A to C are the adhesive tape tape patterns of the first embodiment. Figure 22 is an oblique view of the adhesive tape tray, Figure 22B is the front view of Figure 22A. Figure 22C is a plan view of the connecting tape of Figure 22A, The figure is a schematic view of the adhesive pressing step of the adhesive device. As shown in Figure 2, Figure 2, The adhesive tape tray A of the present embodiment has a plurality of roll portions of adhesive tape (hereinafter referred to as a roll portion). 2a volume 2 2 a disk 3, Adhesive tape 1 is wound around 3 a. Each 3 3a is equipped with a reel 5, And side plates 7 disposed on the two wide sides of the adhesive tape 1. As shown in Figure 23, Adhesive tape! The base material 9 and the adhesive 1 1 applied to one side surface of the base material 9 are comprised. Volume 2 In 2a, The end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape" 1) wound around one of the rolls 2 Between the beginning end portion 3 2 of the adhesive tape (hereinafter referred to as the other side of the tape) 1 wound around the other roll portion, A connecting tape 41 for connecting the two is provided. A connecting tape 67 is disposed from the end portion 3 of one of the adhesive tapes 1 to the inner side surface of the side plate 7 of the disk 3 The connecting tape 67 is locked to the slit portion 68 of the upper portion of the side plate 7 and joined to the beginning end portion 32 of the other of the material tape 1. also, One side and the other side of the adhesive tape 1, And the connecting part of the connecting tape 67, A mark 69 for identifying the adhesive tape 67 will be indicated, 'With tape detection means (light-emitting part 7 1 , The light receiving unit 72) detects the mark 69, At 70 o', the part of the connecting tape 67 will be skipped, but the connecting tape 67 will be around 22 A, 23 The degree of sticking and sticking will be sticky. 70 parts -92- 200823137 parts are pressed. From intensity, And the exfoliation of the adhesive to the electrically conductive material, Substrate 9 should be made of opp (extended polypropylene), PTFE, Or consisting of ruthenium treated PET (polyethylene terephthalate), etc. however, It is not limited to this. Adhesive 1 1 is made of thermoplastic resin, Thermosetting resin, Or a mixture of a thermoplastic resin and a thermosetting resin, Or hot metal. The thermoplastic resin system is represented by a styrene resin system and a polyester resin system. The thermosetting resin is made of epoxy resin. Vinyl ester resin, Acrylic resin, The resin is representative. The conductive particles 13 are dispersed in the adhesive 11. Conductive particles 13 are like Au, Ag, Pt, Ni, Cu, W, Sb, Six, Metal particles such as solder, Or carbon, Graphite, etc. Also in the aforementioned materials and non-conductive glass, A ceramic polymer such as plastic is formed by covering the above-mentioned conductive layer or the like. Further, it is also possible to apply an insulating coating film covering the conductive particles with an insulating layer, Or use conductive particles and insulating particles. Hot molten metal such as solder, Or a conductive layer formed on a polymer core material such as plastic, Will have deformation due to deformation due to heating, pressurization or pressurization, Therefore, the distance between the electrodes after connection will be reduced. Increase the area of contact with the circuit when connecting, It can improve reliability. especially, It is better to use polymers as the core material. If the solder has no melting point, It can also be controlled to soften at a wide range of connection temperatures. Further, it is possible to obtain a connecting member which is easy to correspond to the error of the thickness and flatness of the electrode. Secondly, The method of using the adhesive tape tray A of the present embodiment will be described. As shown in Figure 2, Adhesive tape tape A, And reeling -93- 200823137 The tray 17 is attached to the adhesive device 15, The start end portion 32 of one of the adhesive tapes 1 is attached to the take-up reel 17 via the guide pin 22, And roll out the adhesive tape 1 (arrow E in Figure 23). Secondly, The adhesive tape 1 is disposed on the circuit board 2 1 , Use the configuration on two sets of 3, 1 7 heating and pressing heads 19 The pressure bonding of the adhesive tape 1 is performed from the side of the substrate 9 The adhesive 11 is pressed against the circuit board 21. Thereafter, The substrate 9 is taken up to the take-up reel 17. After the above pressing (temporary connection), The electrodes of the circuit board 2 1 and the electrodes of the wiring circuits (electronic components) 23 are positioned and officially connected. Formally connected, As shown in Figure 4, A wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, when necessary, For example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The circuit board 21 is subjected to heating and pressurization of the circuit board 21 by the pressurizing pressurizing head 19. In this way, The electrode 2 1 a of the circuit board 2 1 and the electrode 2 3 a of the wiring circuit 23 can be connected to each other. By using the PDP of the adhesive tape 1 of the present embodiment, Its size will be larger, Sometimes the whole circumference of the PDP is pressed, There will be more connections. 'The amount of adhesive 1 used in one use will be much larger than the traditional use. therefore, The amount of the adhesive tape 1 wound on the disc 3 is also increased. The adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time. When one of the adhesive tapes 1 is completely rolled out, The connecting tape 67 will be separated from the slit portion 68, then, The other side of the adhesive tape 1 will be rolled out. In this embodiment, Because between the end portion 3 of the adhesive tape 1 on one side and the beginning end 3 2 of the adhesive tape 1 on the other side, A connecting tape 67 for connecting both -94-200823137, Therefore, the adhesive tape 1 of one side is completely unwound, and then the adhesive tape 1 of the other side is started to be unrolled. therefore, It is not necessary to set the new adhesive tape to the take-up reel 1 7 after all of the adhesive tape 1 has been unwound. Therefore, the production efficiency of the electronic machine can be improved, As shown in Figure 23, The adhesive device 15 has a pair of light-emitting and light-receiving portions 72, Used to perform optical detection of the bonding tape 67. Use one of the adhesive tape 1 and the other of the adhesive tape 1 to connect the two ends of the rattan belt 67. Marked with black mark 69, 70. Hair 7 1 will continuously emit laser light on the adhesive tape 1 The light receiving unit 7 2 receives the reflected light, The detection signal is transmitted to the control device 79. Accepted by the 72, the mark 69 at both ends of the connecting tape 67, The reflection of 70 transmits the detection signal to the control unit 79. Receiving a control signal 79 of the detection signal, Will be used to drive the two plates of 5, 3, 17 motor output control signal, The drive pulse is output to the motor using the motor. Secondly, The motor will rotate according to the number of pulses applied by the motor. Make two sets of 3, 1 7 moves at a faster speed than usual, The distance between the adhesive tape 1 and the length of the knot tape 67 is moved in the unwinding direction. Using this method, The other side of the adhesive tape 1 will automatically roll out the position of the hot pressurizing head 19, The operation of unwinding the adhesive can be omitted so that the beginning end portion 3 2 of the other adhesive material is positioned at the position of the heating and pressing head 19. also, Because the take-up reel 17 only winds up the substrate 9, Therefore, the number of tapes can be taken up and the number of replacements of the take-up trays can be reduced. And when there is a good time, Implementation 1 installation: 〇 Part 71, the light part of the connected person will be connected to the light part, The dress drive drive should be connected to the belt 1 with 67: Sticky -95- 200823137 Work efficiency. Here, refer to Figure 5, A method of manufacturing the adhesive tape tray A of the present embodiment will be described. On the substrate (separat〇r) 9 that the i/t roll-out machine 25 is unrolled, An adhesive formed by coating a resin and a conductive particle by a coater 27, After drying in the drying oven 29, The original material is taken up by the coiler 3丨. The original material of the adhesive tape that was taken up, After the cutter 3 3 is cut into a specific width and taken up to the reel, Side panels 7 from both sides, 7 is mounted on the reel, or, Roll up onto the reel with the side panel, Bundle it with the dehumidifying material, The management of low temperature (-5 ° C ~ -10 ° C) is carried out and shipped. Next, another embodiment of the invention described in the claims 22 to 24 will be described. In the embodiment described below, The same parts as those in the above embodiment will be denoted by the same reference numerals and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 24, Since the width T of the bonding tape 67 is smaller than the width W of the adhesive tape 1 before and after, Therefore, the connecting tape 67 can be recognized. also, Adhesive device 15, A light-emitting portion and a light-receiving portion which are the same as those of the first embodiment are disposed at positions opposed to each other with the adhesive tape 1 interposed therebetween. at this time, The bonding tape 67 is recognized by the laser light receiving the laser beam having a narrow width of the transmission connecting tape 67. In the third embodiment shown in Fig. 25, The connecting tape 67 forms a plurality of holes 53 for identifying the connecting tape 67. at this time, When the fourth embodiment shown in Fig. 26 is recognized by the laser beam receiving the hole 53 of the transmission connecting tape 67, the light receiving portion can recognize the connecting tape 67 〇 -96- 200823137 I did not use the connection between the adhesive tapes i. When the adhesive material of one of the adhesive materials is completely unwound, the other adhesive tape is rolled up and wound up to perform the replacement of the adhesive tape 1. at this time, Because there is no need to load the tape onto the adhesive device, And less replacement work for new adhesives, Therefore, the production efficiency of the electronic machine can be improved. The invention described in the claims 22 to 24 of the patent application is not described in the embodiment. As long as it does not deviate from the gist of the invention described in the 22nd to the patent application scope, Various modifications can be implemented. E.g, In the first and second embodiments described above, There are no restrictions on the number of rolls 2, And can be any number. In the first to third embodiments, the adhesive is optically detected; however, Magnetic tape can also be attached to the bonding tape 67 and detected by a magnetic device. Secondly, For the description of the lines described in Sections 25 to 28 of the patent application. These inventions relate to electronic components and circuit boards, Or the adhesion of the circuit, And the adhesion of the electrical connections between the electrodes of the two. also, A wafer for fixing a support substrate or a lead frame for adhering and fixing a semiconductor element (wafer) to a semiconductor device (wafer), Or semi-conductive adhesive material used on a semiconductor device on which a support substrate is mounted, And a disc-shaped adhesive tape tray, Adhesive device, And the connection method of the tape. Secondly, For the tape of the patent application range 25~28, the tape 1 玲17 new adhesive tape plate is limited to the upper - 24 items, 2a of f 67, Inductive testing, inventing the inter-substrate tape to the lead body element, In particular, the invention is described in the background of the invention. In general, LCD panel, PDP (plasma display panel), EL (fluorescent display) panel, Electronic components and circuit boards such as bare chip packages, Or the adhesion between the circuit boards, And the electrical connection method between the electrodes of the two, Adhesive tape is used. also, Adhesive tape is also applied to the lead fixing tape of the lead frame, L0C tape, The grain is covered with tape, Adhesive film such as micro BGA, CSP, etc. The purpose is to improve the productivity and reliability of the entire semiconductor device. 曰本特开200 1 -284005, It is described that the adhesive tape to which the adhesive material is applied on the substrate is wound into a disk shape. The width of the adhesive tape for the conventional electrode connection is 1 to 3 mm, The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, Attaching the adhesive tape tape wound with the adhesive tape to the adhesive device, Pull out the beginning of the adhesive tape and attach it to the take-up reel. Secondly, The substrate side of the adhesive tape which is unwound from the self-adhesive tape is pressed against the circuit board by a heating and pressing head, The residual substrate is then taken up by a take-up reel. Secondly, When one of the adhesive tapes of the adhesive tape is used up, Remove the used disk, And a take-up tray for taking up the substrate, Load the new take-up tray and the new adhesive tape onto the adhesive unit. Install the beginning of the adhesive tape on the take-up reel. however, In recent years, With the enlargement of panel images such as PDP, The adhesion area of the circuit substrate also increases. The amount of adhesive used in one use has also increased. also, Because of the expansion of the use of adhesives, The amount of adhesive used was also increased from -98 to 200823137. therefore, The replacement of the adhesive tape tray of the manufacturing factory of the electronic machine is more frequent, Because the replacement of the adhesive tape is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, Used to reduce the frequency of disk replacement, however, Because the tape width of the adhesive tape is 1 to 3 mm narrower, If the number of volumes is increased, the volume may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, Then the diameter of the disc will also increase. It may not be possible to use an existing adhesive device because it cannot be attached to an existing adhesive device. therefore, The purpose of the invention described in the Patent Application No. 2 5 to 2, Is providing an adhesive tape tray, Adhesive device, And connection method, The replacement of the adhesive tape can be made simpler. Improve the productivity of electronic machines. Secondly, Referring to the attached drawings, An embodiment of the invention described in claims 25 to 28 will be described. First of all, Refer to Figure 27 A~C, Figure 28, Figure 4, Figure 29, And Figure 5, The first embodiment of the invention described in the scope of claims 25 to 28 will be described. 27A to C are the disk tape diagrams of the adhesive material according to the first embodiment. Figure 27A is an oblique view of the adhesive tape tray, Figure 27B is a front view of Figure 27A, Figure 27C is a cross-sectional view of the connecting portion of Figure 27A, Figure 28 is a schematic diagram of the adhesive pressing step of the adhesive device, 29-99-200823137 A perspective view of the state of use of the adhesive of the PDP. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as a roll portion) of the adhesive tape 1 2a, Volume 2 2a has a disk 3 around which the adhesive tape 1 is wound, 3a. Each disk 3, 3a is equipped with a reel 5, And a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Figure 28, Adhesive tape 1 is made of substrate 9, And an adhesive 11 coated on one side of the substrate 9. Volume 2 In 2a, The end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape" 1) wound around one of the rolls 2 And the beginning end portion 3 2 of the adhesive tape (hereinafter referred to as the other adhesive tape) 1 wound around the other roll portion 2a is connected by the locking tool 76. The locking device 76 is, for example, a card-shaped pin having a slightly 3-shaped cross section. The end portion 30 of the adhesive tape 1 on one side and the start end portion 3 2 of the other adhesive tape 1 are overlapped with each other. Insert the card pin into this overlapping part to connect the two. Secondly, In this embodiment, The connecting portion 74 is as shown in Figure 27C. After the terminal portion 30 and the start portion 32 are connected by the locking tool 76, The connecting portion 74 is folded back 180 degrees toward the longitudinal direction of the tape, The adhesive tape 1 is covered with the adhesive tape 76. From intensity, And the exfoliation of the adhesive to the electrically conductive material, Substrate 9 should be made of OPP (extended polypropylene), PTFE, And ruthenium-treated PET (polyethylene terephthalate), etc. however, Not limited to this. Adhesive 1 1 is a thermoplastic resin, Thermosetting resin, Or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by -100- 200823137 styrene resin system and polyester resin system. also, The thermosetting resin is made of epoxy resin. Acrylic resin system, And enamel resin is representative. Conductive particles 13 may also be dispersed in the adhesive 11. The conductive particles 13 are, for example, Au. Ag, Pt, Ni, Cu, W, Sb, Sn, Metal particles such as solder, Or carbon, Graphite, etc. It can also be in the aforementioned and/or non-conductive glass, ceramics, A polymer core material such as plastic is formed to cover the conductive layer or the like. In addition, It is also possible to apply an insulating coating particle covering the conductive particles with an insulating layer, Or use conductive particles and insulating particles. a hot molten metal such as solder, Or a conductive layer formed on a polymer core material such as plastic, It will have deformation due to deformation due to heat, pressure or pressure. Therefore, the distance between the electrodes after connection will be reduced. Increase the area of contact with the circuit when connecting, It can improve reliability. especially, It is better to use polymers as the core material. If the solder has no melting point, It can also be controlled to soften at a wide range of connection temperatures. A connecting member which is easy to correspond to the thickness and flatness of the electrode can be obtained. Secondly, The method of using the adhesive tape tray of the present embodiment will be described. As shown in Figure 28, Adhesive tape tape A, And the take-up tray 17 is attached to the adhesive device 15, The start end portion 3 2 of one of the adhesive tapes 1 is attached to the take-up reel 7 via the guide pin 22 And roll out the adhesive tape 1 (arrow E in Figure 28). Secondly, The adhesive tape 1 is disposed on the circuit board 21, To be configured in two sets of 3, 1 7 heating and pressing heads 1 9 The pressure bonding of the adhesive tape 1 is performed from the side of the substrate 9 The adhesive 11 is pressed against the circuit board 21. Thereafter, The substrate 9 is taken up to the take-up reel 17. Secondly, As shown in Figure 4, A wiring circuit (or an electronic component) 2 3 is disposed on the adhesive 101 adhered to the circuit substrate 21, Can use vinyl 2 4 as a cushioning material, The circuit 3 is heated and pressurized by the heating and pressurizing head 19 to the circuit 3. Using this method, The electrode 21a of the substrate 21 and the electrode 23a of the wiring circuit 23 can be connected. The adhesive tape 1 of the embodiment is used as shown in Fig. 29; As shown in the connection section of 26, The adhesive 11 is pressed against the entire PDP 26, Therefore, the amount of adhesive 1 used in one use is significantly larger: The amount used. therefore, The amount of adhesive tape 1 will also be changed around the tray 3, The adhesive tape 1 on 3 a is taken up to the take-up reel 17 at a relatively short time. In this embodiment, One of the adhesive tapes 1 is completely unwound, and the portion 74 is separated from the slit 75. then, Tape 1 of the other side will be rolled out (Fig. 27B). In this embodiment, To terminate the end portion 30 of the adhesive tape 1 on one side and the start end 32 of the adhesive tape 1 on the other side, When one of the adhesive tapes 1 is completely unrolled, the other adhesive tape 1 is rolled out. therefore, After the entire adhesive tape 1 is unrolled, the new adhesive tape 1 is taken up and the tray 17 is taken. Therefore, the production efficiency of the electronic device can be improved, and the locking member 76 is covered by the adhesive tape 1 on the connecting portion 74. good, Simultaneously, The card holder 76 of the connecting portion 74 can be prevented from contacting the tape 1 and damaging the adhesive tape 1. also, As shown in Figure 28, The adhesive device 15 has a thickness detecting sensor used as the continuous sensor 47. Implement the connection part optical inspection, The heating pressurizing head 19 is caused to skip the connecting portion 74. A PTFE plate 21 is connected to the PDP of the circuit. When the volume is received, Even the adhesive material 76 is connected with the glue. Will be attached to one of the installations. also, Therefore, the appearance of the adhesive material is checked. The adhesion of the side of the adhesive tape -102- 200823137 The thickness of the connecting portion 74 of the adhesive tape 1 and the other adhesive tape 1 is As shown in Figure 27C, 'will be greater than the thickness of the adhesive tape 1, The connecting portion 74 is identified by detecting different thicknesses. The thickness detecting sensor 47 detects the thickness of the adhesive tape 1 at any time. The detection signal is transmitted to the control unit 79. Receiving a control signal 79 of the detection signal, It will be used to drive the two plates 3 of the adhesive device 15. 1 7 motor output control signal, The motor drive starts to output a drive pulse to the motor. Secondly, The motor will rotate according to the number of pulses applied by the motor driver. Make two sets of 3, 1 7 rotates at a faster speed than usual, The adhesive tape 1 is moved in the unwinding direction by a specific distance corresponding to the length of the conveying direction of the connecting portion 74. Using this method, The other adhesive tape 1 is moved to the position of the heating presser 19, Therefore, it is possible to prevent the connecting portion 74 of the adhesive tape 1 of one side and the other from moving to the position where the pressing head 19 is heated and performing the pressing operation. also, Until the connecting portion 41 is heated by the pressing head 19, Will automatically take one of the adhesive tapes 1 to the take-up tray 17. Therefore, the trouble of the winding can be omitted. also, The thickness detecting sensor 47 is used to recognize the front end portion 4 1 a and the rear end portion 4 1 b of the connecting portion 74, Adhesive tape 1 can be effectively used only by avoiding the connecting portion 7 4 '. also, Because the take-up reel 17 only winds up the substrate 9, Therefore, it is possible to take up a plurality of adhesive tape discs and reduce the number of replacements of the take-up reel 1 7 and have good work efficiency. Here, Referring to Figure 5, A method of manufacturing the adhesive tape 1 - 103 - 200823137 of the present embodiment will be described. On the substrate 9 which is unwound from the suede rollout machine 25, The adhesive of the resin and the conductive particles 13 is applied by a coater 27, After drying in a drying oven, The original material is taken up by the coiler 31. The original material of the adhesive tape that was taken up, After cutting the cutter 3 3 to a specific width and winding it to the reel, Side panels 7 from both sides, 7 is mounted on the reel, Bundle it with the dehumidifying material, Perform low temperature (-5 °C ~ -1 0 °C) management and carry out the goods. Secondly, The other parts of the invention described in the 25th to the 28th paragraphs of the patent application are also sorrowful. The same parts as the above-mentioned embodiments will be given the same reference numerals and the detailed description of the parts will be omitted. , The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 30, Not used with multiple volumes 2 2a adhesive tape tape a, Instead, an adhesive tape tray 2c having one roll portion is used. at this time, Adhesive tape 1 is wound around a take-up reel When one of the adhesive tapes 1 reveals the end mark 28, In order to replace one of the adhesive tape trays 2b with the new adhesive tape tray 2c, And connecting the terminal portion 30 of the adhesive tape 1 on one side, And the other end portion 3 2 of the adhesive tape 1 . at this time, The thickness detecting sensor 77 of the connecting portion detecting means also detects the connecting portion 74, The heating pressurizing head 19 is prevented from avoiding the connecting portion 74. The invention described in the claims 25 to 28 is not limited to the above embodiment. As long as it does not deviate from the gist of the invention described in Articles 25 to 28 of the patent application scope, Various modifications can be implemented. -104- 200823137 For example, In the first and second embodiments described above, The card holder 76 for connecting the adhesive tape 1 is not limited to the locking pin. The method can also clamp and fix the overlapping portions of the two in a slightly 3-shaped elastically deformable clip. or, It is also possible to sandwich a slightly three-shaped metal piece in a cross section to sandwich the overlapping portions of the two. And the two pieces are flattened from both sides of the overlapping portion to connect the two. In the first and second embodiments, the thickness detecting portion 47 detects the thickness of the connecting portion 74 to identify the connecting portion 74. however, Not limited to this, The transmittance detecting sensor can also be used to identify the connecting portion 74, Or use a CCD camera to make the surface of the connected part appear on the monitor screen and detect the connected part by comparing the shades of the pixels. Figure 31, Figure A, Figure 31 B, 32A to C are fixing substrate for fixing the lead frame, a support substrate for mounting a semiconductor element, Or the adhesive tape of the connection between the wafer of the lead frame and the semiconductor component, An example of a LOC (Lead on Chip) structure in which a semiconductor element is adhered and fixed to a fixing support substrate of a lead frame and a lead frame. Carrying both sides of the support film 78 such as a surface-treated polyimine film having a thickness of 50 μ? The adhesive tape layer 80 having a polyaldimine adhesive layer having a thickness of 2 5 μηι on both sides, and an adhesive tape having the structure of the 31st sheet, Further, a semiconductor device of the LOC structure shown in Fig. 31B can be obtained. Apply the adhesive tape shown in Figure 31A, A punching die 87 (male die (protrusion) 95) of the adhesive device shown in Figs. 32A to AC The female mold (recess) 96) is punched into a slender shape, E.g, In thickness 0. 2mm iron-nickel alloy lead frame is pressed at 400 °C, 3 MPa pressure, 3 seconds of pressure -105- 200823137 Pressing to form 〇. 2mm interval, 〇. A lead frame having an adhesive film for a semiconductor is formed by a lead having a width of 2 mm. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the adhesive film for semiconductor, and then the gold wire is applied. The wire bonding of the lead frame and the semiconductor element is performed by sealing with a sealing material such as an epoxy resin molding material in a continuous molding to obtain a semiconductor device shown in FIG. In Fig. 31A and B, 81 is an adhesive film for semiconductor obtained by die-bonding tape, 82-series semiconductor element, 8 3 type lead frame, 8 4-series sealing material, 8 5-series welding wire, and 8 6-series bus bar. article. Fig. 32A, B, and C are adhesion devices, and in Fig. 32A and B, 87 is a die-cutting die, 8 8 is a lead frame conveying portion, and 6 1 is an adhesive tape punching and attaching portion, and 90 is heating. The part is a 9 1 type adhesive tape tape (adhesive tape roll-out part), 92 type adhesive tape (semiconductor adhesive film), and 93 type adhesive tape roll-out roller. Further, in Fig. 3C, a 94-type adhesive tape (adhesive film for semiconductor), a 95-type male die (protrusion), a 96-series master (concave portion), and a 97-series film platen. The adhesive tape 92 is continuously rolled out from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is considered to be carried out from the lead frame transport unit as a lead frame with an adhesive film for a semiconductor. The adhesive tape obtained by die cutting is taken out from the roller 93 by the adhesive tape. The semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape in the same manner as described above. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame were carried out in the same manner. Adhesive tape can be used only when -10-200823137 is used for adhesion or fixation, and can be electrically connected by electrodes or conductive particles. It will consist solely of adhesives. Next, the invention described in claim 29 to 34 will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, in particular, and an adhesive tape or an adhesive tape which is wound into a disk shape. The manufacturing method and the pressing method of the adhesive tape are related. Next, the background art of the invention described in claim 29 to 34 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., it is no longer used. . However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing line of the electronic device is wound with the adhesive -107-200823137. The replacement of the disk is more frequent, and the replacement of the new disk is troublesome, so that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive film wound into a tape shape may increase, and may bleed out from both sides of the adhesive tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claims 29 to 34 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without increasing the volume of the adhesive tape. In the case of a number, the adhesion dose is increased. Next, an embodiment of the invention described in claims 29 to 34 will be described with reference to the attached drawings. First, reference is made to Fig. 3, Fig. 3, Fig. 3, Fig. 3, Fig. 4, Fig. 34, and Fig. 5. Fig. 35 is a view showing a first embodiment of the invention described in the claims 29 to 34. Fig. 3 3A and B are adhesive tape diagrams, Fig. 3 3A is a perspective view of a disk wrapped with an adhesive tape, and Fig. 3B is a sectional view of AA of Fig. 3, Fig. 34, Fig. 34 FIG. 3 is a cross-sectional view showing a state in which an adhesive is applied to a PDP, and FIG. 5 is a cross-sectional view showing a step of applying an adhesive on a substrate. -108-200823137 The adhesive tape 1 of the present embodiment is wound around a disk 3, and the disk 3 is wound. A reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1 are disposed on the reel. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 1 Omm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. 9 is arranged in a spaced manner with a width of 0. 5 adhesives of 5 mm 1 1. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a core material of a plastic cylinder, deformation due to deformation due to heating, pressurization or pressurization may occur, so that the distance between the electrodes after the connection is -109-200823137. Reduced, the area of contact with the circuit can be increased when connected, and the reliability can be improved. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15 , and the front end of the adhesive tape 1 wound around the disc 3 is attached to the empty tray 17 and the adhesive tape 1 is unwound. (arrow E in Figure 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and one portion is placed. The adhesive 1 1 is pressed against the circuit substrate. Thereafter, the residual adhesive 1 1 and the substrate 9 are taken up together to the empty tray 17. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuits (electronic components) 23 are positioned and connected. The wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed against the circuit board 2 1 in a formal connection. If necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material for heating and pressurization. The head 19 performs heating and pressurization of the wiring circuit 23 on the circuit board 2 i. In this manner, the electrode 2 1 a of the circuit substrate 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Fig. 34, the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment adheres to the entire periphery of the Pdp, and the amount of the adhesive 1 used at one time is much larger than that of the conventional use. the amount. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up in a relatively short period of time -110-200823137 to the empty tray 17, disk 3 will become empty. When the disk 3 becomes empty, the disk 3 and the disk 17 are respectively reversed. At this time, the empty disk 3 is taken up, and the adhesive tape 1 is moved in the opposite direction (arrow F in Fig. 3). Thus, each of the adhesives U sequentially changes the winding direction (E, F) of the adhesive tape 1, and presses the adhesive 1 1 to the circuit substrate 2 1 〇 here, refer to Figs. 5 and 3 Fig. 5 is a view showing a method of manufacturing the adhesive tape 1 of the present embodiment. On a substrate 9 which is unwound from the unwinder 25, an adhesive 11 obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, and then taken up by a coiler 3. 1 Take the original material. As shown in Fig. 35, five applicators 27 were disposed with a width of 10 mm from the substrate 9, and five adhesives 11 having a width of 10 mm were applied. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -l ° ° C) and shipped. In the following, the other embodiments of the invention described in the ninth aspect of the invention will be described, and the same reference numerals will be given to the same parts as the above-mentioned embodiments, and the detailed description thereof will be omitted. The difference from the above embodiment is mainly. In the second embodiment shown in Figs. 36A to AC, the adhesive of the width W is applied to one surface of the base material of the adhesive tape 1 in a wide range, and the slit 3 5 in the longitudinal direction of the substrate is formed by using -111 - 200823137. The adhesive is isolated into a plurality of strips in the width W direction. In the adhesive tape 1 of the second embodiment, the slit 35 is formed immediately after the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the disk mounting portion of the adhesive device 15 (as shown by S in FIG. 3) to form a slit 3 5 on the adhesive 1 1 of the adhesive tape 1 which is unwound. The person who formed the gap in the refurbishing step at the time of manufacture of the adhesive tape shown in Fig. 5 may be taken up to the disc, or may be dried immediately after the coating step, and before the coiler 3 1 is taken up. Form the gap. When the adhesive tape 1 of the second embodiment is used in the adhesive device 15 as in the first embodiment, the adhesive which is separated by the slits 35 is pressed from the substrate 9 side by the heating and pressing head 1 by one. As shown in Figure 3, Figure 6, A, B, and C, they are used one by one. In the second embodiment, it is only necessary to form the slits 3 5 by the adhesive on the substrate obtained by the same procedure as the conventional one, so that a plurality of adhesives 11 can be obtained, which is easy to manufacture. In the third embodiment shown in Figs. 3 to 7A to C, the substrate 9 is entirely coated with the adhesive 11 (Fig. 37A), and the width W of the substrate 9 and the adhesive 11 is the same as in the above embodiment. 5~1 000mm. Then, in the same manner as in the first embodiment, the adhesive tape 1 which is taken up from the disk 3 is placed on the circuit board 21 in the same manner as in the first embodiment, and the width W direction of the adhesive tape 1 is applied. Part of the adhesive (1 part) is heated and pressurized (Fig. 7B) to reduce the cohesive force of the part. Only the part of the adhesive which is heated and pressurized will be peeled off from the substrate and pressed onto the circuit board 2 1 (No. 112-200823137 37 Figure C). At this time, a cohesive force reduction line is formed along the side line of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (a simple index of 1 or less) without starting the adhesive. The hardening reaction, or the low state (the simple index is the reaction rate of 20% or less), and the heating temperature should be selected in accordance with the adhesive system of the crucible. In the third embodiment, when the adhesive 1 1 is used, only one of the widths W is softened and fluidized and pressed against the substrate circuit. Therefore, as in the above embodiment, the adhesive tape 1 is used. The normal rotation and reversal of the disc 3 and the empty disc can be used in multiples. Further, in the above embodiment, the gap 3 5 is formed in the adhesive 1 1 and is not required to be divided into a plurality of strips, and it is only necessary to apply the adhesive 11 on one side of the wider base material, so that the adhesive tape is used. Manufacturing is very easy. The fourth embodiment shown in Figs. 3A to 8C is another method for producing the adhesive tape according to the first embodiment, after the slit 98 is formed on the adhesive 11 applied to the substrate 9a (Fig. 38) A), the other substrate 9b is attached to the adhesive 1 1 so that the adhesive 1 1 is sandwiched between the substrates 9a and 9b (Fig. 38B). Next, the base materials 9a and 9b of one of the other and the other are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals of one. In the fourth embodiment, in order to alternately dispose the adhesive strips 11a and 11b on one of the other base materials 9a and 9b, the adhesive can be applied from one side of the base material 9a or 9b at intervals of one. The strips 1 1 a and 1 1 b are heated and pressurized, and the adhesive strips 1 1 a and 1 1 b are placed on the respective base materials 9a and 9b at intervals of one. -113-200823137 The invention described in the claims 29th to 3rd is not limited to the above-described embodiments, and various types of inventions can be implemented without departing from the gist of the invention described in claims 29 to 34. Deformation. For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 1 1 may be used. In the above embodiment, the number of the adhesives formed on the substrate 9 may be any number of at least two or more. Next, the invention described in the patent application No. 35-41 will be described. These inventions relate to an adhesive tape for fixing an electronic component, a circuit board, or a circuit board, and an electrical connection between electrodes, a method of manufacturing an adhesive tape, and a method of pressing an adhesive tape. Next, the background art of the invention described in the Patent Application No. 35-41 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (Electronics Display Panel), an EL (fluorescent display panel), a bare chip package, a circuit board, or a circuit board, or an electric circuit between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit board, the adhesive tape is pulled along one side of the circuit board and the adhesive is pressed. Since it is applied to the periphery of the circuit board, it will be -114-200823137 The adhesive is pressed against the periphery of the circuit substrate. However, in recent years, as the panel size of a PDP or the like has increased, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine is more frequently replaced by the disk on which the adhesive tape is wound, and since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. Therefore, the object of the invention described in claim 3 to 4 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without adding an adhesive tape. The amount of adhesive is increased in the case of the number of rolls. Next, with reference to the attached drawings, an embodiment of the invention described in the Patent Application No. 35-41 will be described. First, referring to FIG. 3A, B, 40, 34, and 5, Fig. 41 is a view showing a first embodiment of the invention described in the third to fifth aspects of the patent application. Figure 39 and Figure A are adhesive tape diagrams, Figure 39 is a perspective view of the disk with the adhesive tape wrapped, and Figure 39 shows the adhesive of Figure 39 from the adhesive side. Plan view of the tape, Figure 40 is an oblique view of the adhesive pressing step of the device -115- 200823137. In the adhesive tape 1 of the present embodiment, the reel 5 is wound around the disk 3, and the reel 5 and the side plates 7 disposed on both sides of the adhesive tape 1 are disposed. In the present embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 1,500 mm which is substantially the same size as one side of the circuit board. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. The width of the tape on the substrate 9 is arranged at equal intervals with a width of 〇. 5mm adhesive 1 1. The substrate 9 should be made of 〇PP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. Ester) or the like, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin, a mixture of a lauric resin or a hot metal. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic type, a vinyl ester type resin type, and an anthracene resin type. . The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. A polymer core or the like is formed to cover the conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot-melt metal such as solder or a polymer core material such as plastic, the deformation is deformed by heating and pressing -116-200823137 or pressurization, so the distance between electrodes after connection is small. When connecting, the area of contact with the circuit can be increased, and the reliability can be improved. In particular, it is preferable to use a polymer as a core material, such as solder can be controlled in a softened state because it is not melted at a wide connection temperature. A connecting member that is easy to correspond to an error in the thickness and flatness of the electrode. Next, the use of the adhesive tape 1 of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty disc 1 7 are attached to the adhesive 15 , and the adhesive tape 1 is attached to the front end of the adhesive tape 1 wound around the disc 3 and the adhesive tape 1 is unwound (Fig. 40) Arrow E). The adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is placed on the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3, and the adhesive 1 1 is pressed against the adhesive substrate 1 On the side of one of the circuit boards to the width of the adhesive tape, only the adhesive 11 of the strip is wound up. Next, the circuit board 21 is rotated by about 90 degrees so that the right side of the circuit base is positioned in the width direction of the adhesive tape 1, and the adhesive 11 is pressed against the other side of the circuit board 2 1 by heating. Thus, the substrate 2 1 is rotated by about 90 degrees and pressed against the adhesive 1 1 to adhere the adhesive to the periphery of the circuit board 21. After the pressing (temporary connection), the positioning of the electrodes of the circuit board 2 1 and the wiring circuit (electronic component) 23 is performed and formalized. In the case of the connection, the adhesive 1 1 is pressed to the fourth of the circuit board 2 1 and the wiring circuit (or electronic component) 2 3 is placed on the adhesive 1 , for example, the polytetrafluoroethylene material 2 4 can be used as a buffer. The material will shrink when heated. Point, it is easy to enter the empty tray, 17 crimping up to the X 21 indenter to connect the electric in η electrode after the circumference is necessary to pressurize -117- 200823137 head 19 to the circuit board 21 to implement the wiring circuit 2 3 Heating and pressurizing (refer to Figure 4). In this manner, the electrode 21a of the fixed circuit substrate 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 34, the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment is adhered to the entire periphery of the PDP, and the amount of the adhesive 11 used at one time is much larger than that of the conventional use. However, since the width W of the adhesive tape 1 and the length H of one side of the circuit substrate 21 are substantially equal, even if the number of windings is the same as that of the conventional one having the larger width w of the adhesive tape 1, the adhesive amount is much higher than that of the conventional one. The goods, so the number of replacements is far less than the traditional things. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Figs. 5 and 41. On a substrate 9 which is unwound from the unwinder 25, an adhesive 11 formed by mixing a resin and conductive particles 13 is applied by a coater 27, dried in a drying furnace 29, and then wound up. Machine 3 1 takes up the original material. The applicator 27 is moved left and right to apply a strip of adhesive on the substrate 9 at equal intervals. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the other embodiments of the invention described in the claims of the invention are described in the appended claims, and the same reference numerals are given to the same parts as the above-mentioned embodiments, and the detailed description of the parts is omitted. The difference from the above embodiment is mainly. -118-200823137 The fifth embodiment shown in Figs. 44A to AC is another manufacturing method of the adhesive tape 1 of the i-th embodiment, after the slit 98 is formed on the adhesive 1 1 applied to the substrate 9a. (Fig. 44A), the other substrate 9b is attached to the adhesive 1 1 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (Fig. 44B). Next, the base materials 9a and 9b of one of the other and the other are peeled off, and the adhesive strips 11a and 1 1b are disposed on each of the base materials 9a and 9b at intervals. In the fifth embodiment, in order to alternately dispose the adhesive strips 1 ia and 1 lb on one of the base materials 9a and 9b, the adhesive may be applied from one side of the base material 9a or 9b at intervals of one. The strips 1 1 a and 1 1 b are heated and pressurized, and the strips 1 1 a and 1 1 b are sequentially attached to the respective substrates 9a and 9b. The invention described in the third to fifth aspects of the patent application is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in claims 35 to 41. . For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 1 1 may be used. Next, the invention described in the patent application section 42 to 46 will be described. These inventions relate to an adhesive tape cartridge for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and an adhesive pressing method using an adhesive tape cartridge. Next, the background art of the invention described in the patent application section 42 to 46 will be described. Generally, a liquid crystal panel, a PDP (plasma display panel), an EL (-121 - 200823137 fluorescent display) panel, an electronic component such as a bare chip package, a circuit board, or a circuit board, or a circuit board, and both The method of electrically connecting the electrodes is to use an adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit board, the adhesive tape is pulled along one side of the circuit board and the adhesive is pressed, because the adhesive is pressed against the periphery of the circuit board. To the periphery of the circuit board. However, in recent years, as the panel size of a PDP or the like has increased, the area of the adhesive substrate (the size of one side) has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine is more frequently replaced by the disk on which the adhesive tape is wound, and since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. Therefore, the object of the invention described in claim 42 to 46 is to provide an adhesive tape cassette and a pressure-adhesive method using an adhesive tape cassette, without adding an adhesive tape. In the case of the number of rolls, the adhesive amount is added, and the replacement of the disk is simpler. Next, an embodiment of the invention described in Patent Application No. 4-2 will be described with reference to the accompanying drawings. First, reference is made to 45A, B, 46, 47, 4, and 34. And 48th, the first embodiment of the invention described in the patent application scopes 42 to 46 will be described. For the convenience of description, the adhesive tape is described with two adhesives, however, a plurality of adhesives may be formed. 45A and B are the adhesive tape cassettes of the first embodiment of the invention described in claim 42 to 46, and FIG. 45A is an oblique view of the adhesive tape cassette, and FIG. 45B is a 45th drawing A AA cut section view, the figure is a section of the tape mounting state of the tape cassette shown in Figs. 45 and A, and Fig. 47 is a front view of the adhesive pressing step of the adhesive device, the figure is an adhesive A step diagram of a method of manufacturing a tape cassette. The adhesive tape cassette 1 of the present embodiment mainly has one disk 3, the other disk 17 and a casing 99 for accommodating the disk, and an adhesive tape 1 is wound around one disk 3, and the adhesive tape 1 is adhered. The other end 9a is fixed to the other disk 17. An opening 1 1 is formed on one side of the casing 99, from which the adhesive tape 1 can be pulled out. Further, guide members 3 1 and 31 for guiding the movement of the adhesive tape 1 are disposed on both sides of the opening 1 1 . The casing 99 is fitted by the half casings 99a and 99b, and the sliding shaft 17 (see FIG. 46) disposed on the bonding device 27 (described later) is inserted into the disks 3 and 5 on the other side. It is fitted to each of the discs 3, 5.增 46 图 图 图 图 图 图 图 图 图 图 图 图 图 -123 - 200823137 Here, refer to Figure 46 for each disk 3, 5, and each disk 3, 5 and the housing 99 Be explained. On the inner edge side of each of the discs 3, 5, a fitting strip 179 for fitting the sliding shaft 17 of the adhesive device 27 is formed, and a peripheral side is formed to be rotatably fitted to the projection of the housing 99. The fitting groove 21 of 7c. As shown in Fig. 45B, on one surface of the substrate 9 of the adhesive tape 1, two side-by-side adhesives 11a, lib are applied in the width direction. There will be a gap between the two adhesives 1 1 a and 1 1 b. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm. Each strip of adhesive 1 la, 1 lb has a width of about 1. 2mm 〇 In terms of strength and releasability of the adhesive to the isoelectric material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate). The diester) or the like is constituted, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the 'thermosetting resin type system is represented by an epoxy resin type, an acrylic type, a vinyl ester type resin type, and an anthracene resin type. . The conductive particles 13 are dispersed in the adhesive 11. Conductive particles 丨3 are metal particles such as An, Ag, pt, Ni, cu, W, Sb, Sn, solder, etc., or carbon 'graphite, etc.' may also be in the aforementioned materials and non-conductive glass, ceramics, plastics The polymer core or the like is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles such as -124 - 200823137 may be used. When a conductive layer is formed on a polymer core material such as a hot-melt metal plastic such as solder, deformation due to deformation due to heating or pressurization is formed, so that the distance between the electrodes after connection is small, and the contact with the circuit can be increased during connection. The area can be improved, especially, it is better to use the molecular type as the core material. If the solder is not soldered, it can be controlled to soften at a wide connection temperature, and the thickness of the electrode can be easily obtained. Connection member of the flatness error Next, the method of the adhesive tape cassette 100 of the present embodiment will be described. As shown in Fig. 47, the adhesive tape cassette 100 is attached to the adhesive device 27. The adhesive device 27 is provided with the slide shafts 17, 17 (see Fig. 46) provided with a space therebetween, and the slide shafts 17, 17 are stuck to the respective discs 3, 5 of the adhesive tape cassette 1. Therefore, the adhesive tape cartridge can be mounted in a single touch without the need to perform the conventional operation of attaching the other end 9a of the adhesive tape 1 to the empty tray. Next, the adhesive tape 1 and the guide members 31, 31 of the adhesive device 27 are pulled out from the adhesive tape cartridge 1. Next, the sliding shaft of the driving device 27 is driven out of the adhesive (the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the substrate 2 to heat the pressing head 19 from the side of the substrate 9. The pressure bonding of the adhesive 1 is carried out, and one adhesive 1 1 a on one side in the width direction is applied to one side of the circuit substrate 21, and the remaining adhesive 1 1 b and the base are taken up to the other side. Disk 1 7. Thus, the adhesive 1 1 a can be pressed around the circuit substrate 2 1 . Next, all of the adhesive tape 1 wound on one of the trays 3, or the pressure will be melted to a very convenient position, and the cartridge is placed on the tray. The tape is pressed over the tape. After rolling out the -125-200823137, remove the adhesive tape cassette 1 并 and install it in the reverse direction, repeat the above steps. When two or more adhesives are formed on the adhesive tape, the position in the width direction can be changed in order or in a spaced manner. After the pressing (temporary connection), the electrodes 3 3 a of the circuit board 2 1 and the electrodes 3 7 a of the wiring circuit (electronic component) 37 are positioned and connected. In the case of the connection, after the adhesive 11a is pressed to the periphery of the circuit board 21, a wiring circuit (or an electronic component) 3 is disposed on the adhesive 1 1 a, and if necessary, for example, a polytetrafluoroethylene material 3 can be disposed. 9 As a cushioning material, the heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21 (see Fig. 4). In this manner, the electrode 33a of the fixed circuit substrate 21 and the electrode 37a of the wiring circuit 23 can be connected. As shown in Fig. 34, the bonded portion of the PDP 26 adhered by the adhesive tape cartridge i 00 of the present embodiment is adhered to the entire periphery of the PDP 26 in the present embodiment, and the adhesive 11 for one use is used. The amount used will be much larger than the traditional usage. However, since the adhesive tape 1 is provided with two adhesives 1 1 a, 1 1 b in the width W direction, even if it is the same number as the conventional one, the adhesive dose can be twice as long as the conventional one, so that the box can be reduced. The number of replacements. Further, since the adhesive tape 1 is of the type of the cartridge 1, it is easy to replace, handle, and mount, and has good workability. Here, a method of manufacturing the adhesive tape cartridge 10 of the present embodiment will be described with reference to Fig. 48. On a substrate 23 which is taken up from the unwinder 25, an adhesive ii - 126 - 200823137 ' of a resin and conductive particles 3 〇 is applied by a coater 28 and dried in a drying oven 29. After that, the original material is taken up by the coiler 31. The coater 28 coats a plurality of adhesives on the substrate 9. The original material of the adhesive tape to be taken up is cut into a specific width (the width of two adhesive strips) by the cutter 3 3 during the refurbishing step and taken up to the tray 3 to be sandwiched between the half shells 99a, 99b. The adhesive tape cassette 100 is formed by interposing the disc 3 and the empty disc 5. The adhesive tape cassette 1 〇 捆 is bundled with the dehumidifying material, and the low temperature (-5 ° C to -10 ° C ) is managed and shipped. In the following, the other embodiments of the invention described in the fourth paragraph of the application of the Japanese Patent Application No. 4-2 to 4, the same as the above-mentioned embodiments will be denoted by the same reference numerals and the parts will be omitted. DETAILED DESCRIPTION The following description is based on differences from the above embodiments. In the second embodiment shown in Fig. 49, the adhesive 11 is pressed to one side of the circuit board 21 at a time, and the adhesive device 27 is disposed to be pulled out from the adhesive tape cassette 100. The guide member 1 of the adhesive tape 1 is 〇1. In the second embodiment, the adhesive is pressed to the entire side of the circuit board 2 1 at a time, and the work efficiency is good. In the third embodiment shown in Fig. 50, the adhesive 1 of the width W is applied to the entire surface of the substrate 9 and the adhesive is divided into two by the slit 102. In the adhesive tape 1 of the third embodiment, the slit 102 is formed immediately before the adhesive tape cartridge is attached to the adhesive device 27, and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the boxed portion of the adhesive device 27 (as shown by S in Fig. 47) to form a gap of -127-200823137 on the adhesive 1 1 of the adhesive tape 1 which is unwound. 1 02, the gap forming the gap in the manufacturing step of the adhesive tape shown in FIG. 48 may be taken up to the tray 3, or may be taken up by the coiler 3 1 after the coating step is dried. The gap 1 02 was formed in the previous moment. In the third embodiment, it is only necessary to form the slits 102 in the adhesive 11 formed on the substrate 9 obtained in the same manner as the conventional one, and two adhesives 11a and lib can be obtained, which is very easy to manufacture. In the fourth embodiment shown in FIGS. 51 and A and B, the adhesive material 1 1 is completely applied to one surface of the substrate 9 (Fig. 5A), and the adhesive tape cassette 1 for accommodating the adhesive tape 1 is attached.装In the same manner as in the first embodiment, the adhesive device 27 is attached to the adhesive device 27, and a part of the adhesive 1 1 (one portion) in the width w direction of the adhesive tape 1 is heated and pressurized to reduce the cohesive force of the portion. Only a part of the adhesive 1 1 a which is heated and pressurized is peeled off from the substrate 9 and pressed against the circuit substrate 21 (Fig. 51B). At this time, a cohesive force reduction line 103 (Fig. 51) is formed along the periphery of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (simple index is 1 〇〇). The anchoring of the adhesive is not started, and the hardening reaction of the adhesive or the low state (the simple index is 20% or less) is not started, and the heating temperature should be selected according to the adhesive system to be used. In the fourth embodiment, when the adhesive 1 1 is used, only one of the widths W 5 will be softened and fluidized and pressed against the substrate circuit. Next, the invention described in the claims 47 to 49 will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, -128 - 200823137, in particular, relating to a roll-shaped adhesive tape . Next, the background art of the invention described in the claims of claims 47 to 49 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, and the replacement of the adhesive material tray is troublesome, so that the production efficiency of the electronic-129-200823137 machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claims 47 to 49 is to provide an adhesive tape which can easily replace the adhesive disk and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in claims 47 to 49 of the patent application will be described with reference to the attached drawings. The first embodiment of the invention described in the claims of claims 47 to 49 will be described with reference to Figs. 52A, B, 3, 4, 29, and 5. Fig. 5A and Fig. 2B are connection diagrams of the adhesive tape of the embodiment, Fig. 52A is a perspective view showing the connection between the adhesive sheets, and Fig. 52 is a connection portion of Fig. 5B. Sectional view. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 are disposed on the discs 3, 3a, and the side plates 7 are disposed on the width sides of the adhesive tape 1. The adhesive tape 1 is made of the substrate 9. And an adhesive layer applied to one side of the substrate 9 -130-200823137. The base material 9 has a support layer 9b, and a hot melt layer (hot metal) 9a' sandwiching the support layer from both sides to form a hot melt layer 9a. The molten material (hot metal) is a thermoplastic resin. Ethylene, SBS styrene butadiene styrene block copolymer, nylon, etc., support layer is OPP (stretched polypropylene), polytetrafluoroethylene, or PET (ethylene terephthalate) Reinforcing fibers such as plastic, fiberglass, aromatic polybenzazole, or carbon fiber. The adhesive 11 is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin. The thermoplastic resin is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is an epoxy resin type, an acrylic resin type, and an anthraquinone resin type. The conductive particles 13 may be dispersed. The conductive particles 1 3 such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, metal such as solder, or carbon, graphite, etc., may also be in the foregoing and/or non-conductive glass, ceramic, A polymer core material such as plastic covers the aforementioned conductive layer and is shaped. Further, an insulating film particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot-melt metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit, and can be used. In particular, it is better to use a polymer as a core material, such as solder without a melting point, and it can be controlled to soften at a wide connection temperature, 9b heat (9b polyamine or phylogenetic tree industry) It is a matter of fact that the connection member which can easily correspond to the error of the thickness and the flatness of the electrode can be obtained from -131 to 200823137. Next, the method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, The disc 3 a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the take-up reel 7 via the guide pin 22, and The adhesive tape 1 is unwound (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 2 1 to be placed between the two trays 3 a and 17 and the heating head 1 9 The adhesive tape 1 is pressed against the substrate 9 side, and the adhesive 1 1 is pressed against the circuit board 2 1. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4 a wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21 to form a polytetra The fluoroethylene material 24 is used as a buffer material, and the heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this manner, the electrode 2 1 a of the circuit substrate 2 1 and the electrode 2 of the wiring circuit 2 3 can be connected. 3 a. As shown in Fig. 29, the PDP of the adhesive tape 1 of the present embodiment is used. As shown in the connection portion of 26, the adhesive 11 is pressed against the entire circumference of the PDP 26, and the amount of the adhesive 1 used at one time is significantly larger than that of the conventional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased because the adhesive tape 1 wound on the disk 3a is taken up to the take-up tray 1 in a relatively short period of time. 7, the end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 5A). As shown in Fig. 52A, when the adhesive tape 1 of the disc 3a is exposed with the end mark 28, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape of the tray 3a-132-200823137 (one side) The end portion 30 of the adhesive tape) 1 and the beginning end portion 3 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3. The connection of the adhesive tape 1 is as shown in Fig. 52B, 'the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a, and the beginning end portion 3 2 of the adhesive tape 1 of the new adhesive sheet 3. The adhesive 1 1 of the starting end portion 3 2 is superposed on the hot melt layer 9a of the substrate 9 of the terminal portion 30, and this portion is placed on the table 104. Then, the heating and pressurizing heads 19 of the adhesive device 15 are heated by the overlapping portions to melt the hot melt layer 9a, and then the hot melt is solidified by cooling, and the terminal portion 30 and the start portion 3 2 are implemented. connection. In this manner, the adhesive tape 1 wound on the used tray 3a and the adhesive tape 1 wound on the new tray 3 can be implemented, and the used tray 3a and the new tray can be used. 3 swapping each other, the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Moreover, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, and the number of replacements of the take-up reel 1 7 can be reduced, and the work efficiency is good. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5. The adhesive u mixed with the resin and the conductive particles 丨3 is applied onto a substrate unwound from the unwinder 25, and dried by a drying furnace 29, and then taken up by a coiler 3.丨Reel the original material. The original material of the adhesive tape 1 which is taken up is cut into a specific -133-200823137 width by the cutter 3 3 and taken up to the reel, and the side plates are attached to the reel from both sides, and the dehumidifying materials are bundled together to perform low temperature. (-5 t~-10 °C) management shipment. In the following description of the embodiments of the present invention, the same reference numerals are given to the same parts in the embodiments described below, and the same reference numerals will be given to the same parts, and the following description will be omitted. The difference in the above embodiment is that, in the second embodiment shown in Fig. 5, the hot-melt material layer 9a is sandwiched between the support layers 9b on the adhesive tape material 9. As shown in FIG. 3, in order to perform the connection between the adhesive tapes 1, the adhesive device 15 is attached to the end portion 30 of the adhesive tape 1 and the adhesive tape end portion 3 2 at the other end. The heating of the hot melt layer 9a is performed by heating 19. Heating is performed to bleed out the hot-melt hot-melt layer 9a, and the hot-melt agent is solidified by cooling to bond the adhesive tape 1 therebetween. Thus, since the hot melt layer 9a supports between the layers 9b, the adhesion strength of the hot melt layer 9a can be prevented from being lowered due to moisture absorption or dust. The invention described in the claims is not limited to the scope of the invention, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. In the first embodiment, the base material 9 is composed of the support layer 9b and the three layers of the hot melt layer 9a from the support layer 9b. However, the present invention may be four or more layers. In the present embodiment, when the heating and pressing of the joint portion is bonded and the invention is combined with the above-described detailed t ° 1 basis, the first pressurizing head is melted from the first one, and the tie is applied thereto. The attachment is limited to the upper-49 item side clamps, and does not have the device-134-200823137 1 5 heating and pressing head 1 9, however, other heaters may be used instead of the heating and pressing head 19. The parts are heated and the connection between the adhesive tapes 1 is carried out. Next, the invention described in the claims 50 to 51 will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Next, the background art of the invention described in the claims 50 to 51 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Further, the adhesive tape is also applied to a lead frame fixing tape of a lead frame, a LOC tape, a die-bonding tape, an adhesive film such as a micro BGA/CSP, etc., and the purpose thereof is to improve the productivity and reliability of the entire semiconductor device. . Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. Such conventional adhesive tapes are treated on both sides of the substrate in order to prevent the adhesive from sticking to the substrate or to be easily peeled off. -135- 200823137 When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device. 'Pull out the beginning end of the adhesive tape and install it to Roll up the disk. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive material disc is used up, the used disc and the take-up reel of the take-up substrate are removed, the new adhesive disc is loaded to the adhesive device', and the beginning of the adhesive tape is installed. On the take-up tray. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the patent application No. 50-51 is -136-200823137, which provides a method for joining adhesive tapes, which makes it easier to change the adhesive disk and improve the production efficiency of the electronic machine. . Next, an embodiment of the invention described in the Patent Application No. 50-No is described with reference to the attached drawings. First, referring to the 54th A to C, 55th, 56th, 4th, and 29th, the first embodiment of the invention described in the patent claims 50 to 5 will be described. Fig. 54 is a sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55, Fig. 5A is the state of the adhesive tape before discharge, and Fig. B is the state of the adhesive tape after discharge, the 54th Figure C is a heating map of the joints. Fig. 5 is a perspective view showing the connection between the adhesive sheets of the adhesive tape, and Fig. 56 is a schematic view showing the steps of the adhesive of the adhesive device. The adhesive tape 1 is wound around the discs 3, 3 a, respectively, and the discs 3, 3 a are provided with a reel 5 and a side disposed on the width side of the adhesive tape 1 7 ° Adhesive tape 1 is a substrate 9. An adhesive 1 1 applied to one side of the substrate 9 is formed. In terms of strength and peelability of the adhesive 11, the substrate 9 should be OPP (extended polypropylene), polytetrafluoroethylene, and PET (polyethylene terephthalate), etc., with release agent 9a. Perform surface treatment. The release agent is an olefin-based release agent, ethylene glycol octacarbonate, palm wax, petroleum wax low melting point wax, low molecular weight fluororesin, lanthanide or fluorine-based surfactant oil, wax, resin, The polyester denatured resin or the like is generally an anthracene resin. The adhesive 1 1 is made of a thermoplastic resin, a thermosetting resin, a 54-piece pressure-pressing upper surface, or a mixture of -137-200823137 thermoplastic resin and thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting tree is also represented by an epoxy resin type, an acrylic resin type, and a sand resin type. Conductive particles 13 may also be dispersed in 1. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, such as solder having no melting point, which can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 5, the disc 3 a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is guided by the guide pin 2 2 . Mounted to the take-up reel 1 7 and unwound the adhesive tape 1 (arrow E in Fig. 56). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3 and 17, and the adhesive-138- 200823137 11 is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17 〇 Next, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is placed on the adhesive 1 1 pressed onto the circuit board 21, and The polytetrafluoroethylene material 24 is used as a cushioning material, and the heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed against the entire periphery of the PDP 26, and it is understood that the amount of the adhesive 1 used at one time will be used. Far greater than the traditional usage. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 5). As shown in Fig. 5, in order to replace the disc 3a with the new adhesive sheet 3, the end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is joined to the adhesive tape 1 of the disc 3a. 0, and the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3. The connection of the adhesive tape 1 is as shown in Fig. 5B, and the end portion 30 of the adhesive tape 1 of the used disc 3 a is placed at the irradiation position of the discharger 1 0 5 . Next, discharge is performed on the surface of the substrate 9 to remove the release agent 9a.
其次，使另一方之黏著材膠帶1之始端部32之黏著 劑11面重疊於已去除脫模劑9a之基材9面（第54圖C -139- 200823137 )。將兩者之重疊部份置於工作台，以黏著裝置1 5之加 熱加壓頭1 9進行加熱加壓實施黏著。利用此方式，可實 施捲繞於已使用之盤3 a上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1之連接。 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，而無需使用其他 黏著材膠帶1間之連接器具，即可更換已捲繞著黏著材膠 帶1之盤3、3a。又，因爲捲取盤17只會捲取基材9，故 可捲取數個黏著材盤份，減少捲取盤1 7之更換次數，而 有良好之作業效率。 申請專利範圍第5 0〜5 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 0〜5 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，去除已結束捲取之一方之 黏著材膠帶1之基材9之脫模劑9 a，將新黏著材膠帶1之 黏著劑1 1面重疊於此部份，並以加熱加壓頭1 9實施加熱 加壓進行黏著來連接兩者，然而，亦可去除新黏著材膠帶 1之基材9之脫模劑9a，將已結束捲取之一方之黏著材膠 帶1之黏著劑1 1面重疊於此部份來連接兩者。 去除脫模劑9a之方法，除了電漿放電以外，亦可以 爲紫外線照射或雷射照射之方法，紫外線照射時，例如將 水銀燈當做光源使用，實施一定時間之水銀燈的紫外線照 -140- 200823137 射。其次，雷射照射時，則利用以雷射振盪器照射之雷射 光來分解飛散脫模劑9a，去除脫模劑9a。 上述係針對電子構件及電路基板、以及電路基板間之 黏著固定時進行說明，然而，亦可應用於將半導體元件（ 晶片）黏著·固定至引線框架之固定用支持基板、引線框 架之晶片、半導體元件載置用支持基板之半導體裝置所使 用之黏著材膠帶。 其次，針對申請專利範圍第52〜5 8項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著·固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板所使用之半導體裝置使用之黏著材膠帶，尤其 是，和捲成盤狀之黏著材膠帶盤相關。 其次，針對申請專利範圍第52〜58項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又，黏著材膠帶亦被應用於引線框架之引線固定膠帶 、L Ο C膠帶、晶粒結著膠帶等，例如，使用引線固定膠帶 之目的，係用以固定引線框架之引線銷，提高引線框架自 -141 - 200823137 體或半導體裝置全體之生產性及信賴性。 隨著電子機器之小型·輕量化發展，半導 展被稱爲微BGA (球形陣列）或CSP (晶片尺 小型封裝之開發，前述微BGA (球形陣列）或 尺寸封裝）係在半導體裝置（封裝）下部以區 置其外部端子，這些封裝之構造上，係在具有 配線構造之玻璃環氧基板或聚醯亞胺基板等半 置用支持基板上，利用黏著劑載置半導體元件 半導體元件側之端子及基板之配線板側端子則 裝晶片方式連接’連接部、及晶片上面部或端 系密封材或環氧系液狀密封材進行密封，在配 以區域陣列狀配置焊球等金屬端子。又，QFN Non-leaded Package )或 SON (Small Outline Package )等亦採用黏著材膠帶。其次，在電 板上，以迴焊方式實施高密度之複數個上述封 齊安裝。其次，利用黏著劑載置引線框架之晶 元件（晶片），以絲焊連接半導體元件側之端 架端子’以環氧系密封材或環氧系液狀密封材 、及晶片上面部或端面部。此種半導體裝置之 用黏著材膠帶。 曰本特開2001-284005號公報中，電極間 方法係將基材上塗布著黏著材之黏著材膠帶捲 此種傳統黏著材膠帶之寬度爲1〜3mm程 盤之膠帶之長度爲5 0m程度。 體裝置亦推 寸封裝）之 CSP (晶片 域陣列狀配 1層或多層 導體元件載 (晶片）， 以絲焊或倒 面部以環氧 線基板背面 (Quad Flat Non-leaded 子機器之基 裝之全面一 片及半導體 子及引線框 密封連接部 黏著劑亦採 之電性連接 戎盤狀者。 度，捲取至 -142- 200823137 將黏著材膠帶裝著於黏著裝置時，將盤上捲繞著黏著 材膠帶之黏著材膠帶盤裝設至黏著裝置，拉出黏著材膠帶 之始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出 之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路 基板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因，或者，盤之 直徑尺寸增大而可能因無法裝著於既存之黏著裝置上而無 法使用既存之黏著裝置。 其次，黏著材膠帶盤若使黏著材膠帶直接曝露於大氣 -143- 200823137 下，則可能因爲灰塵或濕氣而導致品質降低。 因此，申請專利範圍第5 2〜5 8項記載之發明的目的 ，係在提供一種黏著材膠帶盤，黏著材膠帶盤之更換比較 簡單，而可提高電子機器之生產效率及維持黏著材膠帶之 品質。 其次，參照附錄圖面，以電極連接用之黏著材膠帶爲 例，針對申請專利範圍第5 2〜5 8項記載之發明之實施形 態進行說明，然而，半導體元件連接用之黏著材膠帶亦相 同。首先，參照第57圖A〜C、第3圖、第4圖、第29 圖、及第58圖，針對申請專利範圍第52〜58項記載之發 明之第1實施形態進行說明。第5 7圖A〜C係第1實施形 態之黏著材膠帶盤圖，第57圖A係黏著材膠帶盤的斜視 圖，第57圖B係第57圖A之正面圖，第57圖C係第57 圖A之蓋體構件之正面圖，第58圖係黏著材膠帶之製造 方法的步驟圖。 本實施形態之黏著材膠帶盤A，具有複數之黏著材膠 帶1之捲部（以下簡稱爲捲部）2、2a，捲部2、2a具有 已捲繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著 捲軸5、及配置於黏著材膠帶1之兩寬度側之側板7、7a 、7b。如第3圖所示，黏著材膠帶1係由基材9、及塗布 於基材9之一側面之黏著劑1 1所構成。未使用之捲部2a 上，覆蓋捲繞於盤3a上之黏著材膠帶1之周圍的蓋體構 件8，以可自由裝卸之方式裝設於盤3 a上。 又，捲部2、2a之內側之側板7a上，配設著乾燥劑 -144 - 200823137 1 〇之收容部（收容空間）12，收容剖12內收容著矽凝膠 等乾燥劑1 〇，用以從內部去除未使用之捲部2 a內之濕氣 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點’在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 -145- 200823137 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶盤A、及捲取盤1 7 裝著至黏著裝置1 5，將一方之黏著材膠帶1之始端部經由 導引銷22裝設至捲取盤17，並捲出黏著材膠帶1 (第3 圖中之箭頭E)。其次，將黏著材膠帶1配置於電路基板 2 1上，利用配置於兩盤3、1 7間之加熱加壓頭1 9從基材 9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著至電路基 板2 1。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路23之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑11會被壓著至PDP 26之周 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳統上 之使用量。因此，黏著材膠帶1之使用量亦較多，捲繞於 盤3、3 a上之黏著材膠帶1會在相對較短之時間內被捲取 至捲取盤1 7。 在一方之捲部2之黏著材膠帶1上露出結束標記時， 將其更換成新捲部2a之黏著材膠帶1。本實施形態時’未 使用之捲部2 a上，配設著蓋體構件8，拆下此蓋體構件8 後，捲出黏著材膠帶1並將其裝設至捲取盤1 7。 -146- 200823137 如此，一方之捲部2全部捲出時’可將另一方之捲部 2a之黏著材膠帶1裝設至捲取盤17而實施黏著材膠帶1 之更換，故無需將新黏著材膠帶盤裝著至黏著裝置15。因 此，只需較少之新黏著材膠帶盤之更換作業，故可提高電 子機器之生產效率。 又，因爲未使用之捲部2a上配設著蓋體構件8，黏著 材膠帶1不會直接曝露於大氣下，故黏著材膠帶1不易因 灰塵或濕氣而發生黏著力降低等情形。因此，即使配設著 複數捲部2、2a時，亦可利用在未使用之捲部2a上配設 蓋體構件8來防止黏著材膠帶1之品質降低。 又，因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤1 7之更換次數，而有良好之 作業效率。 此處，參照第5 8圖，針對本實施形態之黏著材膠帶 盤A之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子丨3混合而成之黏著劑，並以 乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被捲 取之黏著材膠帶之原始材料，以切割機3 3切成特定寬度 並捲取至捲軸後’從兩側將側板7、7 a、7 b裝著於捲軸上 ，然後’實施蓋體構件8之裝著，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對申請專利範圍第5 2〜5 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 -147- 200823137 與相同符號並省略該部份之詳細說明，以下之說明 上述實施形態不同之點爲主。 第5 9圖所示之第2實施形態時，裝設於捲部 之蓋體構件8，具有黏著材膠帶1之拉出口 1〇6。 因爲可從蓋體構件8之拉出口 106捲出黏著材膠帶 拆下捲部2、2a之蓋體構件8亦可從捲部2、2a直 黏著材膠帶1。 第6 0圖A及B所示之第3實施形態時，捲部 、2b係不同之個體，以可自由滑動方式，裝設於黏 15本體上之軸107上。其次，一方之捲部2全部捲 拆下裝設於軸107之前端的蓋帽108，從黏著裝置 一方之捲部2。其次，使另一方之捲部2a移動至黏 並拆下蓋體構件8後，將另一方之捲部2a之黏著和 捲裝至捲取盤1 7，實施黏著材膠帶1之更換。此時 複數之捲部2、2a、2b係不同之個體，故很容易處 第61圖所示之第4實施形態時，和第3實施 同，捲部2、2a、2b係不同之個體，使捲部2、2a 側板7、7a互相嵌合，將其裝著至黏著裝置1 5。； 圖所示，另一方之捲部2a之側板7a上，配設著橫 呈二字形之被嵌合部1 1 〇，將配設於一方之捲部2 7上之被嵌合部4 9，從上側嵌合至被嵌合部1 1 0， 兩者。將全部捲出之一方之捲部2從黏著裝置15 ’只要將一方之捲部2向上提起即可解除嵌合，很 可拆下一方之捲部2。 係以和 2、2a 此時， 1，不 接捲出 ;2、2a 著裝置 出時， 15取下 著位置 ί*膠帶1 ’因爲 理。 形態相 、2b之 泊第6 1 剖面略 之側板 可連接 拆下時 簡單即 -148- 200823137 申請專利範圍第52〜5 8項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 2〜5 8項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，捲部2、2a之數量並無特 別限制，可以爲任意個。 第4實施形態時，係以使側板7、7 a上下滑動來嵌合 一方及另一方之捲部2、2a，然而，亦可在一方之側板7 上形成嵌合孔，而在另一方之側板7 a上配設嵌合突起， 並從膠帶之寬度方向將嵌合突起壓入嵌合孔內來使兩者嵌 合。 第3 1圖A、B係用以實施引線框架之固定用支持基板 、半導體元件載置用支持基板、或引線框架之晶片和半導 體元件之連接1黏著材膠帶當中，將半導體元件黏著·固 定於引線框架之固定用支持基板及引線框架之LOC ( Lead on Chip )構造的1個實例。 實施厚度50μιη之表面處理之聚醯亞胺膜等支持膜78 之兩面，係採用兩面具有厚度25μιη之聚醛亞胺系黏著劑 層等之黏著劑層80之具有如第31圖Α之構成之黏著材膠 帶，而可得到第3 1圖B所示之LOC構造之半導體裝置。 將第31圖A所示之黏著材膠帶，以第32圖A〜C所示之 黏著裝置之冲切模具87 (公模（凸部）95、母模（凹部） 96)冲切成細長形，例如，在厚度〇.2mm之鐵-鎳合金製 引線框架上，以4 0 0 °C、3 Μ P a之壓力、3秒鐘之加壓實施 壓著，形成〇.2mm間隔、〇.2mm寬度之內引線，製成附有 -149- 200823137 半導體用黏著膜之引線框架。其次，在其他步驟實施3 5 〇 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半導體元件壓 著至此附有半導體用黏著膜之引線框架之黏著劑層面，其 後’以金線實施引線框架及半導體元件之絲焊，以連續成 形使用環氧樹脂成形材料等密封材實施密封，得到第3 1 圖B所示之半導體裝置。第31圖a、B中，81係以黏著 材膠帶冲切所得之半導體用黏著膜，54係半導體元件，83 係引線框架，8 4係密封材，8 5係焊絲，8 6係匯流排條。 弟32圖A、B、C係黏著裝置，第32圖A、B中，87係 冲切模具，8 8係引線框架搬運部，6 1係黏著劑膠帶冲切 貼附部，9 G係加熱器部，9 1係黏著材膠帶盤（黏著材膠 帶捲出部），92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第32圖C中，94係黏著材 膠帶（半導體用黏著膜），95係公模（凸部），96係母 模（凹部），97係膜壓板。黏著材膠帶92會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部8 9冲切成細長形且黏著至引線框架之引線部 份’將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪9 3搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接·黏著。黏著材膠帶只單純用 於黏著·固定時，可以電極間之接觸、或以導電性粒子實 -150- 200823137 施電性連接，而對應目的來選擇使用之黏著劑’若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第5 9項記載之發明進行說 明。 此發明係關於將電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑壓著 至電路基板之黏著具。 其次，針對申請專利範圍第59項記載之發明之背景 技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者，將此黏著劑膠帶之 盤（以下稱爲「黏著劑盤」）裝著於自動黏著機械來使用 〇 自動黏著機械具有黏著劑盤之裝著部、空盤之裝著部 、配設於前述盤間之加熱加壓構件、以及用以載置基板之 工作台’從黏著劑盤將黏著劑膠帶拉出至基板上，利用加 熱加壓構件從基材之背面側實施黏著劑膠帶之加熱加壓， 將黏者劑壓著至基板上。 然而’傳統之自動黏著機械較爲大型，欲在部份基板 上實施黏著劑之壓著時、壓著黏著劑之面積較小時、或暫 -151 - 200823137 時壓著時等，會因爲較爲大型，反而有不易操作之問題。 另一方面，若爲和此種大型自動黏著機械不同之小型 卻可很簡單地進行操作，故在局部或暫時壓著時，希望能 有不使用大型裝置卻可實施黏著劑之壓著的器具。 因此，申請專利範圍第59項記載之發明的目的，係 提供一種黏著具，十分小型且可以單手操作，並且很容易 即可對基板之一部份實施黏著劑之壓著。 其次，參照附錄圖面，針對申請專利範圍第5 9項記 載之發明之實施形態進行說明。第62圖A及B係申請專 利範圍第59項記載之發明之第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 A-A剖面圖，第63圖係用以說明第62圖A及B所示之黏 著具之使用方法的側面圖，第64圖係黏著具之製造方法 的步驟圖。 本實施形態之黏著具11 1之主要構成係一方之盤（供 應盤）3、另一方之盤（空盤）5、以及收容前述盤之殼體 99，一方之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之 一端9a則固定於另一方之盤5。 殼體9 9之形成上，係可以單手把持之尺寸，從側面 觀看時，角部具有弧度而大致呈三角形，係容易把持之形 狀。略呈三角形之殻體99之角部上，會形成開口部1丨3， 黏著劑膠帶9會從此開口部1 1 3露出。 又，開口部1 1 3上突設著加熱構件1 1 4，從側面觀看 時，此加熱構件114亦略呈三角形，用以引導從上面13a -152- 200823137 沿著下面1 3 b拉出之黏著劑膠帶1，其下面側配設著電熱 板 11 5。 加熱構件1 1 4之形狀呈棒狀，在以電熱板1 1 5覆蓋加 熱構件1 1 4之情形下拉出黏著材膠帶9時，可利用加熱構 件1 1 4之旋轉而順利拉出膠帶9。又，電熱板1 1 5之外側 若配設聚四氟乙烯、矽橡膠、或雙方，則實施黏著劑9之 壓著時，可獲得均一之壓力。 殻體99係由半殻體99a、99b嵌合而成，一方及另一 方之盤3、5係收容於殼體內。殼體內配設著導引件1 6， 用以引導黏著劑膠帶1之移動。又，殻體99a或7b之其 中任一方之底面之一方上，會形成板狀之導引件，在使此 導引件抵壓至電路基板之邊緣之情形下，將黏著劑壓著至 電路基板，則可沿著電路基板實施精度良好之黏著劑壓著 〇 一方之盤3上會以同軸方式固定著一方之齒輪116, 另一方之盤17上亦以同軸方式固定著另一方之齒輪117, 一方之齒輪116及另一方之齒輪117會互相齒合，當一方 之盤3旋轉而使黏著劑膠帶1被拉出時，另一方之盤17 會實施黏著劑膠帶1之拉出量的旋轉，並捲取基材9。又 ，齒輪單元118係由一方之齒輪116及另一方之齒輪117 所構成。 又，殼體99之側面配設著對加熱構件1 1 4供應電力 之第三殼體（電源手段）119，第三殻體119內除了收容 乾電池以外，尙會收容供應給加熱構件1 1 4之電力之調整 -153- 200823137 電路。又，第三殻體1 1 9上配設著電源開關1 2 0， 持黏著具1 1 1之手的手指實施ON/off之操作。 如第62圖B所示，黏著劑膠帶1上之基材9 上塗布著黏著劑1 1。 本實施形態時，黏著劑膠帶1之長度約爲20m W 約爲 1.2 m m。 從強度、及構成向異導電材之黏著劑之剝離性 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 處理之PET (聚對苯二甲酸乙二酯）等所構成，然 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 ，熱硬化性樹脂系係以環氧樹脂系、乙烯基酯系樹 克力系樹脂、及矽樹脂系爲代表。 黏著劑Η內分散著導電粒子1 3。導電粒子1 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 或碳、石墨等，亦可在前述之物及/或非導電性之 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 、或塑膠等之高分子核材上形成導電層者，會具有 加壓或加壓而產生變形之變形性，故連接後之電極 會縮小，連接時可增加和電路接觸之面積，而可提 可以把 之單面 、寬度 而言， 經過矽 而，並 脂、或 系。熱 表，又 脂、壓 3係如 粒子、 玻璃、 成。此 膜粒子 融金屬 因加熱 間距離 局信賴 -154- 200823137 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著具1 1 1之使用方法進行 說明。如第63圖所示，以單手握持黏著具1 1 1，將電源開 關120切至ON。其次，使露出黏著劑膠帶1之開口部 1 1 3抵壓電路基板2 7。因爲開口部1 1上之黏著劑膠帶i 之基材9側配設著加熱構件1 1 4，壓附位於加熱構件1 1 4 下面側之黏著劑膠帶1，對電路基板27實施黏著劑11之 加熱壓著。 在將黏著具111壓向下方之狀態下朝前方（第63圖 中之箭頭E )移動，會依序拉出黏著劑膠帶1，加熱構件 1 1 4會朝E方向前進，同時，新黏著劑9會位於加熱構件 1 1 4之下，而將黏著劑1 1依序壓著至電路基板27。 如此，從一方之盤3拉出黏著劑膠帶1時，因一方之 盤3會旋轉，故和一方之盤3以同軸方式固定之一方之齒 輪116亦會旋轉，和其齒合之另一方之齒輪117亦會隨之 旋轉，而將已剝離黏著劑25之基材9捲取至另一方之盤 17° 利用本實施形態，欲將黏著劑1 1壓著至電路基板27 上之任意位置時，只要以單手握持黏著具1 1 1並向前推， 很簡單即可實施黏著劑1 1之壓著。如此，因爲很黏著劑 1 1之壓著很簡單，特別適合例如將電子構件（配線電路） 37暫時黏著於電路基板27上時、或只對電路基板27之一 -155- 200823137 部份實施電子構件（配線電路）3 7之壓著時。 上述之壓著後（暫時連接），實施電路基板27之電 極及電子構件（配線電路）3 7之電極的定位並進行正式連 接。正式連接上，對電路基板27實施黏著劑1 1之壓著後 ，在黏著劑1 1上配置電子構件（配線電路）3 7，必要時 ，可將聚四氟乙烯材3 9當做緩衝材，以加熱加壓頭1 9對 電路基板27實施電子構件（配線電路）3 7之加熱加壓（ 參照第4圖）。利用此方式，可連接固定電路基板2 7之 電極27a及電子構件（配線電路）37之電極37a。 又，因爲構成上，黏著劑膠帶1係收容於殼體9 9內 且直接使用，故十分容易處理而具有良好之作業性。 此處，參照第64圖，針對本實施形態之黏著具ni 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機28塗布由樹脂及導電粒子13混合而成之黏著劑，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著劑膠帶之原始材料，在整修步驟中以切割機3 3 切成特定寬度並捲取至盤3後，以夾於半殼體99a、99b 間之方式嵌合一方之盤3及另一方之盤（空盤）5，且組 裝收容著加熱構件114及乾電池等之第三殼體119，製成 黏著具1 1 1。 將黏著具1 1 1和除濕材一起綑包，實施低溫（_ 5它〜-10°c )之管理並進行出貨。 其次，針對申請專利範圍第60〜64項記載之發明進 -156- 200823137 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第60〜64項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度，黏著材膠帶從盤捲出並將黏 著劑壓著至電路基板等後，即不會再度使用。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之厚度較厚，很難增加每1盤 -157- 200823137 之捲數。 又，若考慮減少黏著材膠帶之厚度，則因爲使用經過 矽處理之PET (聚對苯二甲酸乙二酯）當做基材，基材之 厚度若太薄，會有容易發生基材伸展或斷裂等之問題。 因此，申請專利範圍第60〜64項記載之發明的目的 ，係在提供一種黏著材膠帶，可增加每1盤之捲數，而提 高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第60〜64 項記載之發明之實施形態進行說明。參照第65圖A、B、 第3圖、第4圖、第2 9圖、及第5圖，針對申請專利範 圍第6〇〜64項記載之發明之第1實施形態進行說明。第 65圖A及B係第1實施形態之黏著材膠帶圖，第65圖A 係黏著材盤的斜視圖，第65圖B係第65圖A之A-A剖 面圖。 黏著材膠帶1係捲繞於盤3者，盤3上配設著捲軸5 、及配置於黏著材膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 基材9係採用銅膜（銅箔）。基材9之厚度（第65 圖B中之S)爲ΙΟμπι，基材9之25°C時之拉伸強度爲 500MPa，基材9對黏著劑11之厚度比（S/T)爲0.5，黏 著劑1 1之厚度爲20μηι。基材9之表面粗細度Rmax爲 0 · 2 5 μηι 〇 又，亦製成採用芳香族聚醯胺膜（MIC TRON)當做基 -158- 200823137 材9者。製作上，基材9之厚度、拉伸強度、及基 黏著劑1 1之厚度比（S/T )皆和銅膜相同。 其次，針對上述之黏著材膠帶之使用方法進行 如第3圖所示，將黏著材膠帶1之盤3、及捲取盤 至黏著裝置15，捲繞於盤3上之黏著材膠帶1之前 由導引銷22裝設至捲取盤17並捲出黏著材膠帶] 圖中之箭頭E )。其次，將黏著材膠帶1配置於電 21上，以配置於兩盤3、1 7間之加熱加壓頭19從 側壓接黏著材膠帶1，將黏著劑1 1壓著至電路基ί 其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21 著劑1 1上配線電路（或電子構件）23，將聚四氟 24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實 電路23之加熱加壓。利用此方式，可連接電路基枝 電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1 26之連接部份所示，黏著劑11會壓著至PDP之周 ，可知一次使用之黏著劑1 1的使用量會遠大於傳 使用量。因此，捲繞於盤3上之黏著材膠帶1之使 會增多，捲繞於盤3上之黏著材膠帶1在相對較短 內會被捲取至捲取盤17，而使盤3成爲空的。 盤3成爲空的時，更換已使用之盤3及新盤， 裝著至黏著裝置15。其次，如上面所述，重複將 1 1壓著至電路基板2 1並將基材9捲取至捲取盤1 7 材9對 說明。 17裝著 端會經 I (第3 路基板 ，基材9 U 21 〇 上之黏 乙烯材 施配線 ί 21之 之PDP 圍全體 統上之 用量亦 之時間 將新盤 黏著劑 之動作 -159- 200823137 結果，採用銅膜做爲基材9者、及採用芳香族聚醯胺 膜做爲基材9者，皆和傳統黏著材膠帶1同樣容易處理， 且沒有基材9伸展或斷裂之問題。其次，相對於基材1 1 之厚度較傳統品（5 0 μιη )爲薄之部份，黏著材膠帶之捲數 會增多，故可減少盤之更換頻率而提高生產性。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸5 上，將其和除濕材一起綑包，實施低溫（-5 °C〜-1 〇 °C )之 管理並進行出貨。 又，針對基材9之厚度爲4μπι、20μιη、25μιη之銅膜 及芳香族聚醯胺膜，製作黏著材膠帶1，如上面所述之實 際使用上，未發生基材9之伸展或斷裂等之問題。 又，針對基材9對黏著劑11之厚度比（s/Τ)爲〇.〇1 、0.05、1.0之銅膜及芳香族聚醯胺膜，製作黏著材膠帶1 ，如上面所述之實際使用上，未發生基材9之伸展或斷裂 等之問題。 其次，針對申請專利範圍第6 5〜6 6項記載之發明進 行說明。 -160- 200823137 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接黏著材膠帶之 黏著材形成方法。又，係關於在將半導體元件（晶片）黏 著•固定至引線框架之固定用支持基板或引線框架之晶片 、或半導體元件載置用支持基板之半導體裝置上所使用之 黏著材膠帶之黏著材形成方法，尤其是，和捲成盤狀之黏 著材膠帶盤之黏著材形成方法相關。 其次，針對申請專利範圍第65〜66項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、LOC膠帶、晶粒結著膠帶、微 BGA · CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 -161 - 200823137 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，新黏著材盤及新捲取盤仓裝著至 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，黏著材膠帶之捲數若增加，盤之黏著材膠帶捲 繞直徑之尺寸（以下稱爲「捲繞直徑」）亦會較大，可能 因無法裝著於既存之黏著裝置上而無法使用既存之黏著裝 置° 因此，申請專利範圍第65〜66項記載之發明的目的 ，係在提供一種黏著材膠帶之形成方法，可不增加黏著材 膠帶之捲繞直徑，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第 65〜66 項記載之發明之實施形態進行說明。參照第66圖A及B 、第67圖、第68圖、第4圖、第29圖、及第5圖，針 對申請專利範圍第65〜66項記載之發明之第1實施形態 進行說明。第66圖A及B係第1實施形態之黏著材膠帶 -162- 200823137 之黏著樹形成步驟圖，第66圖A係將各黏著材膠帶重疊 成一體並將一方之基.材捲取至捲取用盤之步驟的槪略圖’ 第66圖B係第66圖A之黏著劑間之重疊部份的剖面圖， 第67圖係在被覆體上形成黏著裝置之黏著劑之步驟的槪 略圖，第6 8圖係捲繞著黏著材膠帶之盤之斜視圖，第4 圖係電路基板間之黏著的剖面圖，第29圖係PDP之黏著 劑之使用狀態的斜視圖，第5圖係黏著材膠帶之製造方法 的步驟圖。 黏著材膠帶1分別捲繞於盤3、121，各盤3、121上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。黏著材膠帶1係由基材9、及塗布於基材9之一側面之 黏著劑1 1所構成。 從強度、及黏著劑之剝離性而言，基材9應由OPP ( 延伸聚丙烯）、聚四氟乙烯、或經過矽處理之PET (聚對 苯二甲酸乙二酯）等所構成，然而，並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏者劑11內亦可分散著導電粒子13。導電粒子13係 如Au、Ag、Pt、m、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 -163- 200823137 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者’會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積’而可提高 信賴性。尤其是，以高分子類做爲核材更佳’如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第66圖A所示，將2個黏著材膠帶1之盤3、 121、及捲取用之盤17、18裝著至黏著裝置15，將捲繞於 一方之盤3上之黏著材膠帶1之前端經由導引銷22裝設 至一方之捲取盤17，並捲出黏著材膠帶1(第66圖A甲 箭頭E)。又，捲繞於另一方之盤121上之黏著材膠帶1 之前端亦裝設至另一方之捲取盤18，並捲出黏著材膠帶1 〇 從盤3、1 2 1捲出之黏著材膠帶1，會利用配置於盤3 、1 2 1及加熱加壓頭1 9之間之壓著滾輪1 22，使各黏著材 膠帶1重疊成一體。其次，將另一方之黏著材膠帶1之基 材9捲取至捲取盤1 8。 其次，將一方之黏著材膠帶1配置於電路基板2 1上 ，以加熱加壓頭1 9從基材9側實施黏著材膠帶1之壓接 ，將黏著劑1 1壓著至被覆體之電路基板2 1。其後，將基 -164- 200823137 材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）23，將聚四 烯材24當做緩衝材，以加熱加壓頭19對電路基板： 施配線電路2 3之加熱加壓。利用此方式，可連接電 板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑1 1會被壓著至PDP 26 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳 之使用量。因此，捲繞於盤3、12 1之黏著材膠帶1 用量亦會增多，捲繞於盤3、121之黏著材膠帶1會 對較短之時間內被捲取至捲取盤1 7、1 8。 此實施形態時，將黏著劑1 1壓著至電路基板2 1 一步驟中，會使一方之黏著材膠帶1之黏著劑11、及 方之黏著材膠帶1之黏著劑1 1重疊，得到期望之黏 1 1之厚度後，再將黏著劑1 1壓著至電路基板2 1，故 著材膠帶1之厚度只要一半即可。因此，可增加每1 黏著材膠帶1之捲數，而可大幅增加1次更換作業之 用的黏著劑量。因此，只需較少之新黏著材膠帶1之 作業，故可提高電子機器之生產效率。 此處，參照第5圖，針對本實施形態之黏著材膠 製造方法進行說明。 在從捲出機25捲出之基材（separator ) 9上，以 爲通常之大約一半的方式利用塗布機2 7塗布由樹脂 之黏 氟乙 1實 路基 PDP 之周 統上 之使 在相 之前 另一 著劑 各黏 盤之 可使 更換 帶之 厚度 及導 -165- 200823137 電粒子1 3混合而成之黏著劑π，並以乾燥爐29實施乾燥 後’以捲取機3 1捲取原始材料。被捲取之黏著材膠帶1 之原始材料，以切割機3 3切成特定寬度並捲取至捲軸5 後’從兩側將側板7、7裝著於捲軸5上，將其和除濕材 一起綑包，實施低溫（-5 °C〜-1 〇艺）之管理並進行出貨。 又，黏著材膠帶1亦可以爲黏著劑11中含有後述之硬化 劑者。 其次，針對申請專利範圍第6 5〜6 6項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第69圖A所示之第2實施形態時，亦可製作黏著劑 11a含有硬化劑及導電粒子13之黏著材膠帶la、及不含 有硬化劑及導電粒子13之黏著材膠帶lb，如第69圖A 所示，使含有硬化劑等之黏著材膠帶1 a、及不含有硬化劑 等之黏著材膠帶lb重疊成一體，再將重疊之物壓著至電 路基板21。此時，因爲只有一方之黏著材膠帶la之黏著 劑11a含有硬化劑，另一方之黏著材膠帶lb之黏著劑lib 即無需含有硬化劑。因此，未含有硬化劑之黏著劑1 1 b之 黏著材膠帶1 b無需實施低溫管理。 因此，可減少需要低溫管理之黏著材膠帶1 a之數， 黏著材膠帶之運送及保管可實現較有效率之管理。 又，黏著劑爲環氧樹脂系時’環氧樹脂之硬化劑應爲 咪唑系、胺醯亞胺、銨鹽、聚胺類、及聚硫醇等。 -166- 200823137 又，如第69圖B所示，含有硬化劑之一方之黏著材 膠帶la之黏著劑11a含有導電粒子13而爲2層構成，因 被壓著側未含有導電粒子，樹脂會流動，不會從導電粒子 相對峙之電路間流出，加熱加壓時可確實使導電粒子13 保持留在電極21a及電極23a之間。 申請專利範圍第65〜66項記載之發明並未受限於上 述之實施形態，申請專利範圍第65〜66項記載之發明之 要旨的範圍內，可實施各種變形。 第1實施形態時，黏著劑1 1係含有導電粒子1 3，然 而，亦可以爲未含有導電粒子13之黏著劑11。 上面所述係針對電子構件及電路基板、以及電路基板 間之黏著固定時進行說明，然而，亦可應用於將半導體元 件（晶片）黏著·固定於引線框架之固定用支持基板、引 線框架之晶片、或半導體元件載置用支持基板之半導體裝 置上。 其次，針對申請專利範圍第67〜72項記載之發明進 行說明。 這些發明係關於例如液晶面板、PDP面板、EL面板 、裸晶片封裝等之電子構件及電路板、或電路板間之黏著 固定、以及以提供用以實施兩者之電極間之電性連接之向 異導電材爲目的之向異導電材膠帶，尤其是，和向異導電 材之捲取形態相關。 其次，針對申請專利範圍第67〜72項記載之發明之 背景技術進行說明。 -167- 200823137 利用向異導電材膠帶之電子構件及電路板、或電路板 間之連接方法，係利用相對峙之電極間夾著膜狀黏著劑之 向異導電材，以加熱加壓實施電子構件及電路板、或電路 板間之連接。膜狀之黏著劑中，混合著以實現電極間之導 通爲目的之導電粒子，採用之樹脂爲熱可塑性樹脂、熱硬 化性樹脂、熱可塑性樹脂及熱硬化性樹脂之混合物、以及 光硬化性樹脂（例如，參照日本特開昭5 5 - 1 0 4 0 0 7號公報 )° 又，採用不含導電粒子而只由樹脂所構成之向異導電 材的電路連接方法亦爲大家所熟知（例如，參照日本特開 昭60-262430號公報）。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 表，又，熱硬化性樹脂系則以環氧樹脂系、矽樹脂系、及 壓克力樹脂系爲代表。熱可塑性樹脂系及熱硬化性樹脂系 之連接上，皆需要實施加熱加壓。其目的係爲了使熱可塑 性樹脂系之樹脂流動並得到和被覆體間之密著力、以及爲 了使熱硬化性樹脂系能獲得進一步之樹脂之硬化反應。近 年來，以連接信賴性之角度而言，係以熱可塑性樹脂及熱 硬化性樹脂之混合物、及熱硬化性樹脂系爲主流。又，可 以低溫度實施連接之光硬化樹脂系亦開始被應用於工業上 〇Next, the surface of the adhesive 11 of the other end portion 32 of the adhesive tape 1 is superposed on the surface of the substrate 9 from which the release agent 9a has been removed (Fig. 54-C-139-200823137). The overlapping portion of the two is placed on the table, and the bonding is performed by heating and pressing the heating head 19 of the bonding device 15. In this manner, the bonding of the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be carried out. Next, the used disc 3 a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. In this embodiment, the discs 3, 3a around which the adhesive tape 1 has been wound can be replaced by using the heating and pressing head 19 without using a connecting device between the other adhesive tapes 1. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, and the number of replacements of the take-up reel 1 7 can be reduced, and the work efficiency is good. The invention described in the claims 5th to 5th is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in the claims 50 to 51. . For example, in the above embodiment, the release agent 9 a of the base material 9 of the adhesive tape 1 which has been wound up is removed, and the surface of the adhesive 1 1 of the new adhesive tape 1 is overlapped. The heating and pressing head 19 is heated and pressurized to bond the two. However, the release agent 9a of the substrate 9 of the new adhesive tape 1 can be removed, and the adhesive tape 1 which has been wound up is completed. The adhesive 1 1 overlaps this portion to connect the two. The method of removing the release agent 9a may be a method of ultraviolet irradiation or laser irradiation in addition to the plasma discharge, and when the ultraviolet light is irradiated, for example, a mercury lamp is used as a light source, and the ultraviolet light of the mercury lamp is irradiated for a certain period of time - 140-200823137 . Next, in the case of laser irradiation, the scattering release agent 9a is decomposed by the laser light irradiated with the laser oscillator to remove the release agent 9a. The above description is for the case where the electronic component, the circuit board, and the circuit board are fixed to each other. However, the present invention can also be applied to a fixing support substrate for bonding and fixing a semiconductor element (wafer) to a lead frame, a wafer of a lead frame, and a semiconductor. An adhesive tape used in a semiconductor device in which a component is mounted on a support substrate. Next, the invention described in the 52nd to 58th paragraphs of the patent application will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. Further, the adhesive tape for use in a semiconductor device used for a semiconductor device (wafer) to be bonded and fixed to a fixing support substrate or a lead frame of a lead frame or a semiconductor device mounting substrate, in particular, It is associated with a roll of adhesive tape that is rolled into a disk shape. Next, the background art of the invention described in the patent application section 52 to 58 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Moreover, the adhesive tape is also applied to the lead fixing tape of the lead frame, the L Ο C tape, the die-bonding tape, etc., for example, the purpose of fixing the lead pin of the lead frame by using the lead fixing tape, and improving the lead frame From -141 to 200823137 The productivity and reliability of the entire body or semiconductor device. With the development of small size and light weight of electronic equipment, semi-guided exhibition is called micro BGA (spherical array) or CSP (development of wafer scale small package, the aforementioned micro BGA (spherical array) or size package) is attached to a semiconductor device (package) The lower part is provided with an external terminal, and the structure of these packages is on a semi-support substrate such as a glass epoxy substrate or a polyimide substrate having a wiring structure, and the semiconductor element semiconductor element side is placed on the adhesive side. The terminal and the wiring board side terminal of the substrate are connected by a wafer connection "connection portion", a wafer upper surface portion or an end seal material or an epoxy liquid sealing material, and metal terminals such as solder balls are arranged in an array of regions. Also, QFN Non-leaded Package or SON (Small Outline Package) also uses adhesive tape. Next, on the board, a plurality of the above-mentioned sealed installations of high density are carried out by reflow. Next, the crystal element (wafer) of the lead frame is placed by an adhesive, and the end frame terminal of the semiconductor element side is wire-bonded with an epoxy-based sealing material or an epoxy-based liquid sealing material, and a face or end face on the wafer. . Adhesive tape for such a semiconductor device. In Japanese Patent Laid-Open Publication No. 2001-284005, the method of inter-electrode is to apply an adhesive tape coated with an adhesive material on a substrate. The width of the conventional adhesive tape is 1 to 3 mm, and the length of the tape is 50 m. . The body device also pushes the CSP of the package (the wafer domain array is provided with one or more layers of conductor elements (wafers), and is wire-bonded or inverted on the back side of the epoxy-line substrate (the base of the Quad Flat Non-leaded sub-machine) A complete piece of semiconductor and lead frame sealing joint adhesive is also used to electrically connect the disk. Degree, coiled to -142- 200823137 When the adhesive tape is placed on the adhesive device, the disk is wound The adhesive tape of the adhesive tape is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Secondly, the substrate side of the adhesive tape which is rolled out from the self-adhesive tape is heated. The pressing head presses the adhesive onto the circuit board, etc., and then reeles the residual substrate with a take-up reel. Next, when the adhesive tape of one of the adhesive tape discs is used up, the used disc and the roll are removed. Take the take-up tray of the substrate, install the new take-up tray and the new adhesive tape onto the adhesive device, and install the beginning of the adhesive tape on the take-up reel. However, in recent years, with the PDP, etc. Large-scale panel screen, circuit board The adhesive area is also increased, and the amount of the adhesive used at one time is also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more Frequently, because the replacement of the adhesive tape is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. For this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase each disk. The adhesive dose is used to reduce the frequency of replacement of the disk. However, since the tape width of the adhesive tape is 1 to 3 mm narrower, if the number of rolls is increased, the winding may be scattered. Moreover, if the number of rolls is increased, the effect is The pressure of the tape-bonded adhesive tape may increase, which may cause the adhesive to ooze out from both sides of the tape and cause obstruction, or the diameter of the disk may increase due to the inability to be attached to the existing adhesive device. It is impossible to use the existing adhesive device. Secondly, if the adhesive tape is directly exposed to the atmosphere -143- 200823137, it may be gray Therefore, the purpose of the invention described in the scope of claims 5 to 5 is to provide an adhesive tape tray, and the replacement of the adhesive tape is relatively simple, and the electronic machine can be improved. Production efficiency and maintenance of the quality of the adhesive tape. Next, with reference to the attached drawings, an embodiment of the invention described in the patent application No. 5-2 to 58 will be described by taking the adhesive tape for electrode connection as an example. The same applies to the adhesive tape for connecting semiconductor elements. First, referring to Figs. 57A to AC, Fig. 3, Fig. 4, Fig. 29, and Fig. 58, the invention described in claim 52 to 58 The first embodiment will be described. Fig. 7A to Fig. 7C are diagrams showing the adhesive tape of the first embodiment, Fig. 57A is a perspective view of the adhesive tape tray, and Fig. 57B is the 57th A Front view, Fig. 57C is a front view of the cover member of Fig. 57, and Fig. 58 is a step view of the method of manufacturing the adhesive tape. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter simply referred to as rolls) 2, 2a of the adhesive tape 1, and the roll portions 2, 2a have the disks 3, 3a around which the adhesive tape 1 has been wound. . Each of the disks 3, 3a is provided with a reel 5 and side plates 7, 7a, 7b disposed on both width sides of the adhesive tape 1. As shown in Fig. 3, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. On the unused roll portion 2a, the cover member 8 covering the periphery of the adhesive tape 1 wound around the disk 3a is detachably attached to the disk 3a. Further, the side plate 7a on the inner side of the rolled portions 2, 2a is provided with a accommodating portion (accommodating space) 12 of a desiccant - 144 - 200823137 1 ,, and a desiccant 1 such as a sputum gel is accommodated in the storage section 12 for use. In order to remove the moisture enthalpy in the unused roll portion 2 a from the inside, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene in terms of strength and peeling property of the adhesive to the different conductive material. Or ruthenium-treated PET (polyethylene terephthalate) or the like, however, it is not limited thereto. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthraquinone resin type. Conductive particles 13 may also be dispersed. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, such as solder having no melting point, which can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The connection structure -145- 200823137 pieces. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the adhesive tape tray A and the take-up reel 1 7 are attached to the adhesive device 15, and the beginning end of one of the adhesive tapes 1 is attached to the take-up reel 17 via the guide pin 22. , and roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing heads 9 disposed between the two trays 3 and 17 to bond the adhesive 1 1 is pressed to the circuit board 2 1 . Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as a cushioning material to heat the pressing head 19. The circuit board 21 is subjected to heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed to the entire periphery of the PDP 26, and the amount of the adhesive 1 used at one time is large. Traditionally used. Therefore, the adhesive tape 1 is used in a large amount, and the adhesive tape 1 wound on the discs 3, 3 a is taken up to the take-up reel 17 in a relatively short period of time. When the end mark is exposed on the adhesive tape 1 of the one roll portion 2, it is replaced with the adhesive tape 1 of the new roll portion 2a. In the present embodiment, the cover member 8 is disposed on the unused roll portion 2a, and after the cover member 8 is removed, the adhesive tape 1 is taken up and attached to the take-up reel 17. -146- 200823137 When the roll portion 2 of one of the rolls is completely unwound, the adhesive tape 1 of the other roll portion 2a can be attached to the take-up reel 17 to replace the adhesive tape 1, so that it is not necessary to be newly adhered. The tape is loaded onto the adhesive device 15. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved. Further, since the cover member 8 is disposed on the unused roll portion 2a, the adhesive tape 1 is not directly exposed to the atmosphere, so that the adhesive tape 1 is less likely to be lowered by adhesion of dust or moisture. Therefore, even when the plurality of winding portions 2, 2a are disposed, the lid member 8 can be disposed on the unused roll portion 2a to prevent the quality of the adhesive tape 1 from being lowered. Further, since the take-up reel 17 only winds up the substrate 9, it is possible to take up a plurality of adhesive tape discs and reduce the number of replacements of the take-up reel 1 7 with good work efficiency. Here, a method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 58. On the substrate which is unwound from the unwinding machine 25, an adhesive obtained by mixing a resin and conductive particles 3 is applied by a coater 27, and dried in a drying oven 29, and then taken up by a coiler 3. 1 Take the original material. The original material of the adhesive tape that has been taken up is cut into a specific width by the cutter 3 3 and taken up to the reel. 'The side panels 7, 7 a, 7 b are mounted on the reel from both sides, and then the cover is implemented. The member 8 is attached, and is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the other embodiments of the invention described in the claims 5th to 5th, and the same reference numerals will be given to the same parts as the above-mentioned embodiments, and the same reference numerals will be given, and the detailed description of the parts will be omitted. The differences between the above embodiments are mainly explained. In the second embodiment shown in Fig. 5, the lid member 8 attached to the winding portion has the pull-out port 1〇6 of the adhesive tape 1. Since the adhesive tape can be unwound from the take-out opening 106 of the cover member 8, the cover member 8 from which the rolled portions 2, 2a are removed can also directly adhere the tape 1 from the rolled portions 2, 2a. In the third embodiment shown in Figs. 60 and A and B, the individual portions of the roll portion and the portion 2b are slidably attached to the shaft 107 of the body of the adhesive body 15. Next, the roll portion 2 attached to the front end of the shaft 107 is detached from the roll portion 2 of one of the rolls, and the roll portion 2 of the adhesive device is removed. Next, after the other roll portion 2a is moved to the adhesive body and the cover member 8 is removed, the other roll portion 2a is adhered and wound to the take-up reel 1 7, and the adhesive tape 1 is replaced. In this case, the plurality of rolls 2, 2a, and 2b are different individuals, so that the fourth embodiment shown in Fig. 61 is easily used, and the rolls 2, 2a, and 2b are different from each other in the third embodiment. The roll portions 2, 2a side plates 7, 7a are fitted to each other and attached to the adhesive device 15. As shown in the figure, the side plate 7a of the other roll portion 2a is provided with a fitting portion 1 1 横 which is formed in a zigzag shape, and is fitted to the fitted portion 49 of the one roll portion 27 It is fitted from the upper side to the fitted portion 1 1 0, both. When the one roll portion 2 is completely unwound from the adhesive device 15', the one roll portion 2 can be lifted up to release the fitting, and the one roll portion 2 can be removed. At the same time, 2, 2a, at this time, 1, not connected; 2, 2a when the device is out, 15 remove the position ί * tape 1 ' because of reason. The invention is not limited to the above embodiment, as long as it is not deviated from the above-mentioned embodiments, as shown in the description of the scope of the invention. Various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the above embodiment, the number of the rolls 2, 2a is not particularly limited, and may be any number. In the fourth embodiment, the side plates 7 and 7a are slid up and down to fit one and the other of the roll portions 2 and 2a. However, the one side plate 7 may be formed with a fitting hole, and the other side may be formed. A fitting projection is disposed on the side plate 7a, and the fitting projection is press-fitted into the fitting hole from the width direction of the tape to fit the both. FIG. 3A and FIG. 3B are diagrams for attaching and fixing a semiconductor element to a fixing support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a connection between a wafer of a lead frame and a semiconductor element; One example of the LOC (Lead on Chip) structure of the support substrate and the lead frame for fixing the lead frame. The adhesive film layer 80 having a polyacrylonitrile-based adhesive layer having a thickness of 25 μm on both sides of the support film 78 having a surface-treated polyimine film having a thickness of 50 μm is formed as shown in Fig. 31. The adhesive tape is used to obtain the semiconductor device of the LOC structure shown in FIG. The adhesive tape shown in Fig. 31A is punched into a slender shape by a punching die 87 (male die (protrusion) 95, mother die (recess) 96) of the adhesive device shown in Figs. 32A to C. , for example, in thickness 〇. 2mm iron-nickel alloy lead frame is pressed at 400 ° C, 3 Μ P a pressure, and pressed for 3 seconds to form 〇. 2mm interval, 〇. A lead frame having a thickness of 2 mm and a lead frame with an adhesive film for -149-200823137 semiconductor. Next, in another step, a temperature of 3 〇 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the adhesive film for semiconductor, and then 'gold. The lead wire frame and the wire bonding of the semiconductor element are subjected to sealing by continuous molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device shown in FIG. In Fig. 31, a and B, 81 is an adhesive film for semiconductor obtained by die-bonding tape, 54-type semiconductor element, 83-type lead frame, 8 4-series sealing material, 8 5-series welding wire, and 8 6-series bus bar. . 32, A, B, and C are adhesion devices, and in Fig. 32, A and B, 87 is a die-cutting die, 8 8 is a lead frame conveying part, and 6 1 is an adhesive tape punching and attaching part, and 9 G is heating. The part is a 9 1 type adhesive tape tape (adhesive tape roll-out part), 92 type adhesive tape (semiconductor adhesive film), and 93 type adhesive tape roll-out roller. Further, in Fig. 32C, a 94-type adhesive tape (adhesive film for semiconductor), a 95-type male mold (protrusion), a 96-series male mold (concave portion), and a 97-series film press plate. The adhesive tape 92 is continuously unwound from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport unit. The adhesive tape obtained by die cutting is taken out from the roller 9 3 by the adhesive tape. The semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape in the same manner as described above. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame were carried out in the same manner. Adhesive tape is only used for adhesion and fixation. It can be contacted between electrodes or electrically connected with conductive particles. The adhesive is selected for the purpose. If the support film is used, It will consist of adhesive alone. Next, the invention described in claim 59 of the patent application will be described. This invention relates to an adhesive for adhering an electronic component, a circuit board, or a circuit board to an electric circuit, and an adhesive for electrically connecting the electrodes between the electrodes to the circuit board. Next, the background art of the invention described in claim 59 of the patent application will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Patent Publication No. 2001-284005 discloses that a tape of an adhesive tape coated with an adhesive on a substrate is taken up, and a disk of the adhesive tape (hereinafter referred to as an "adhesive disk") is attached. The automatic bonding machine is used in the automatic bonding machine, the mounting portion having the adhesive disk, the mounting portion of the empty disk, the heating and pressing member disposed between the disks, and the table for mounting the substrate The adhesive disc pulls the adhesive tape onto the substrate, and heats and presses the adhesive tape from the back side of the substrate by a heating and pressing member to press the adhesive onto the substrate. However, 'the traditional automatic adhesive machine is relatively large. When the adhesive is pressed on some of the substrates, the area where the adhesive is pressed is small, or when the pressure is pressed from -151 to 200823137, it will be because For large, it is not easy to operate. On the other hand, if it is small in size and can be easily operated in comparison with such a large automatic adhesive machine, it is desirable to have a device that can be pressed without using a large device when partially or temporarily pressed. . Therefore, the object of the invention described in claim 59 is to provide an adhesive which is extremely small and can be handled by one hand, and it is easy to apply adhesive to a part of the substrate. Next, an embodiment of the invention described in the ninth application of the patent application will be described with reference to the attached drawings. Fig. 62 is a perspective view of the first embodiment of the invention described in claim 59, wherein Fig. 62A is a perspective view of the adhesive, and Fig. 62B is a cross-sectional view taken along line AA of Fig. 62A. Fig. 63 is a side view for explaining the method of using the adhesive shown in Figs. 62A and B, and Fig. 64 is a step view showing the manufacturing method of the adhesive. The main structure of the adhesive 11 1 of the present embodiment is a disk (supply disk) 3, another disk (empty disk) 5, and a casing 99 for accommodating the disk, and an adhesive is wound around one disk 3. The tape 1 and one end 9a of the adhesive tape 1 are fixed to the other disk 5. The housing 9 9 is formed to be gripped by one hand, and when viewed from the side, the corner portion has a curvature and is substantially triangular, and is easily gripped. An opening portion 1丨3 is formed in a corner portion of the slightly triangular casing 99, and the adhesive tape 9 is exposed from the opening portion 113. Further, the heating member 1 14 is protruded from the opening portion 1 1 3 , and the heating member 114 is also slightly triangular when viewed from the side for guiding the drawing from the upper surface 13a - 152 - 200823137 along the lower surface 1 3 b. The adhesive tape 1 is provided with a hot plate 11 5 on the lower side thereof. The shape of the heating member 1 1 4 is rod-shaped, and when the adhesive member tape 9 is pulled down by covering the heating member 1 14 with the hot plate 115, the tape 9 can be smoothly pulled out by the rotation of the heating member 1 14 . Further, when the outer side of the hot plate 1 1 5 is provided with polytetrafluoroethylene, ruthenium rubber, or both, when the adhesive 9 is pressed, a uniform pressure can be obtained. The casing 99 is fitted by the half casings 99a and 99b, and the one and the other disks 3 and 5 are housed in the casing. A guide member 16 is disposed in the housing for guiding the movement of the adhesive tape 1. Further, on one of the bottom surfaces of either one of the casings 99a or 7b, a plate-shaped guide member is formed, and the adhesive is pressed to the circuit in the case where the guide member is pressed against the edge of the circuit substrate. In the substrate, one of the gears 116 can be coaxially fixed to the disk 3 which is adhered to the circuit board with a high-precision adhesive. The other disk 17 is also coaxially fixed to the other gear. 117, one of the gears 116 and the other of the gears 117 are meshed with each other. When one of the disks 3 is rotated to cause the adhesive tape 1 to be pulled out, the other disk 17 is subjected to the amount of the adhesive tape 1 pulled out. Rotate and take up the substrate 9. Further, the gear unit 118 is composed of one gear 116 and the other gear 117. Further, a third casing (power source means) 119 for supplying electric power to the heating member 141 is disposed on a side surface of the casing 99. The third casing 119 is accommodated and supplied to the heating member 1 1 4 except for accommodating the dry battery. The adjustment of power -153- 200823137 circuit. Further, the third housing 119 is provided with a power switch 1 220, and the finger holding the hand of the adhesive 1 1 1 is turned ON/OFF. As shown in Fig. 62B, the substrate 9 on the adhesive tape 1 is coated with an adhesive 11. In the present embodiment, the length of the adhesive tape 1 is about 20 mW. 2 m m. The peelable substrate 9 from the strength and the adhesive to the different conductive material should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or treated PET (polyethylene terephthalate). It is not limited to this. The adhesive 1 1 is a mixture of a thermoplastic resin, a thermosetting resin, and a thermosetting resin, or a hot metal plastic resin is a styrene resin or a polyester resin, and a thermosetting resin is used. The epoxy resin type, the vinyl ester type gram resin, and the oxime resin are represented. The conductive particles 13 are dispersed in the adhesive crucible. Conductive particles 1 Au, Ag, Pt, Ni, Cu, W, Sb, Sn, metals such as solder, carbon, graphite, etc., may also be in the above-mentioned materials and/or non-conductive ceramics, plastics and other polymer core materials The insulating layer covering the conductive particles or the conductive particles and the insulating particles may be applied by covering the conductive layer or the like with an insulating layer. When a conductive layer is formed on a polymer core such as a hot melt such as solder or a plastic material such as plastic, deformation due to pressurization or pressurization may occur, so that the connected electrode may be reduced, and the connection may be increased in connection with the circuit. The area can be raised in one side or in width, and it is fat, or tied. Heat table, and grease, pressure 3 series such as particles, glass, and. This membrane particle melts the metal due to the distance between the heating bureaus -154- 200823137. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive 1 1 1 of the present embodiment will be described. As shown in Fig. 63, the power switch 120 is turned ON by holding the adhesive 1 1 1 with one hand. Next, the opening portion 1 1 3 of the exposed adhesive tape 1 is pressed against the circuit board 27 . The heating member 141 is disposed on the substrate 9 side of the adhesive tape i on the opening portion 1 1 , and the adhesive tape 1 on the lower side of the heating member 1 1 4 is pressed, and the adhesive 11 is applied to the circuit substrate 27. Heated and pressed. Moving toward the front (arrow E in Fig. 63) while pressing the adhesive 111 downward, the adhesive tape 1 is sequentially pulled out, and the heating member 1 1 4 advances in the E direction, and at the same time, a new adhesive 9 will be placed under the heating member 1 14 and the adhesive 1 1 will be sequentially pressed to the circuit substrate 27. Thus, when the adhesive tape 1 is pulled out from one of the trays 3, since one of the trays 3 is rotated, one of the disks 3 is coaxially fixed, and one of the gears 116 is also rotated, and the other of the teeth is rotated. The gear 117 is also rotated, and the substrate 9 from which the adhesive 25 has been peeled is taken up to the other disk 17°. In the present embodiment, when the adhesive 11 is to be pressed to any position on the circuit board 27 As long as the adhesive 1 1 1 is held by one hand and pushed forward, the pressing of the adhesive 1 1 can be carried out simply. Thus, since the adhesion of the adhesive 11 is very simple, it is particularly suitable, for example, when the electronic component (wiring circuit) 37 is temporarily adhered to the circuit substrate 27, or only one of the circuit substrates 27 is implemented - 155 - 200823137 When the member (wiring circuit) 3 is pressed. After the above-described pressing (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic components (wiring circuit) 37 are positioned and officially connected. After the adhesive connection is applied to the circuit board 27 by the adhesive connection, the electronic component (wiring circuit) 3 is placed on the adhesive 1 1 , and if necessary, the polytetrafluoroethylene material 3 9 can be used as a buffer material. The electronic substrate (wiring circuit) 37 is heated and pressurized by the heating and pressing head 19 on the circuit board 27 (refer to Fig. 4). In this manner, the electrode 27a of the fixed circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 can be connected. Further, since the adhesive tape 1 is housed in the casing 9 9 and used as it is, it is easy to handle and has good workability. Here, a method of manufacturing the adhesive ni according to the present embodiment will be described with reference to Fig. 64. On a substrate 23 which is taken up from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 28, and dried in a drying oven 29, and then taken up by a coiler 3. 1 Take the original material. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 3 3 and taken up to the tray 3 in the refurbishing step, and then the one of the trays 3 is sandwiched between the half-shells 99a and 99b. And the other disk (empty disk) 5, and the third casing 119 in which the heating member 114 and the dry battery are housed is assembled to form the adhesive 1 1 1 . The adhesive 1 1 1 is bundled with the dehumidifying material, and the low temperature (_ 5 it ~ -10 ° c) is managed and shipped. Next, the invention described in Sections 60 to 64 of the patent application is described in the line -156-200823137. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to an adhesive tape wound in a disk shape. Next, the background art of the invention described in the claims 60 to 64 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., it will not be repeated again. use. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk to reduce the frequency of replacement of the disk. However, because the thickness of the adhesive tape is thick, it is difficult. Increase the number of volumes per plate -157- 200823137. Moreover, if it is considered to reduce the thickness of the adhesive tape, since the treated PET (polyethylene terephthalate) is used as the substrate, if the thickness of the substrate is too thin, the substrate may be easily stretched or broken. Waiting for the problem. Therefore, the object of the invention described in the claims 60 to 64 is to provide an adhesive tape which can increase the number of rolls per one disk and improve the production efficiency of the electronic machine. Next, an embodiment of the invention described in the claims 60 to 64 will be described with reference to the attached drawings. The first embodiment of the invention described in the sixth to fourth embodiments of the patent application will be described with reference to Figs. 65A, B, 3, 4, 2, and 5. Fig. 65 is a perspective view of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive disk, and Fig. 65B is a cross-sectional view taken along line A-A of Fig. 65A. The adhesive tape 1 is wound around the disk 3, and the disk 3 is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 is made of a copper film (copper foil). The thickness of the substrate 9 (S in Fig. 65B) is ΙΟμπι, the tensile strength at 25 °C of the substrate 9 is 500 MPa, and the thickness ratio (S/T) of the substrate 9 to the adhesive 11 is 0. 5. The thickness of the adhesive 1 1 is 20 μm. The surface roughness Rmax of the substrate 9 was 0 · 2 5 μηι 〇. Further, an aromatic polyimide film (MIC TRON) was used as the base -158-200823137. In the production, the thickness of the substrate 9, the tensile strength, and the thickness ratio (S/T) of the base adhesive 11 are the same as those of the copper film. Next, as shown in FIG. 3, the method of using the adhesive tape described above is carried out by winding the disc 3 of the adhesive tape 1 and the take-up reel to the adhesive device 15 before winding the adhesive tape 1 on the disc 3. The guide pin 22 is attached to the take-up reel 17 and the adhesive tape is unwound] arrow E) in the figure. Next, the adhesive tape 1 is placed on the electric 21, and the adhesive pressurizing tape 19 is placed between the two discs 3 and 17 to press the adhesive tape 1 from the side, and the adhesive 1 1 is pressed to the circuit base. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is pressed onto the substrate 11 of the circuit substrate 21, and the polytetrafluoro 24 is used as a buffer material to heat the pressing head 19 to the circuit substrate 2. 1 The heating and pressurization of the real circuit 23. In this manner, the circuit base electrode 21a and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, the adhesive portion 11 is pressed against the circumference of the PDP by using the joint portion of the adhesive tape 126 of the present embodiment, and it can be seen that the amount of the adhesive 1 used at one time is much larger than that of the transfer amount. . Therefore, the adhesive tape 1 wound on the disc 3 is increased, and the adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period, and the disc 3 is made empty. of. When the disc 3 becomes empty, the used disc 3 and the new disc are replaced and attached to the adhesive device 15. Next, as described above, the pressing of 1 1 to the circuit substrate 2 1 and the winding of the substrate 9 to the winding tray 1 7 are repeated. 17The end of the installation will be through I (the third substrate, the substrate 9 U 21 之 on the sticky vinyl wire ί 21 of the PDP circumference of the total amount of time will also be the new disk adhesive action -159- As a result, the use of a copper film as the substrate 9 and the use of the aromatic polyimide film as the substrate 9 were all handled as easily as the conventional adhesive tape 1, and there was no problem that the substrate 9 was stretched or broken. Secondly, the thickness of the adhesive tape is increased relative to the thickness of the substrate 11 compared to the conventional product (50 μm), so that the number of rolls of the adhesive tape is increased, so that the frequency of replacement of the disk can be reduced and productivity can be improved. Fig. 5 is a view showing a method of manufacturing the adhesive tape 1 of the present embodiment. On a substrate which is unwound from the winder 25, an adhesive which is obtained by mixing a resin and conductive particles 13 is applied by a coater 27. After the agent 11 is dried in the drying oven 29, the original material is taken up by the coiler 31. The original material of the adhesive tape 1 taken up is cut into a specific width by the cutter 3 3 and taken up to the reel. , the side plates 7, 7 are mounted on the reel 5 from both sides, and Wet materials are bundled together and managed at a low temperature (-5 °C to -1 〇 °C) and shipped. Also, a copper film with a thickness of 4 μm, 20 μm, and 25 μm for the substrate 9 and an aromatic polyamine The film is used to produce the adhesive tape 1. As described above, the problem of stretching or breaking of the substrate 9 does not occur. Further, the thickness ratio (s/Τ) of the substrate 9 to the adhesive 11 is 〇. . 〇1, 0. 05, 1. The copper film and the aromatic polyamide film of 0 were used to form the adhesive tape 1, and as described above, the problem of stretching or breaking of the substrate 9 did not occur. Next, the invention described in the sixth to fifth aspects of the patent application will be described. -160-200823137 These inventions relate to a method of forming an adhesive for adhering and fixing an electronic component, a circuit board, or a circuit board, and electrically connecting an adhesive tape between electrodes. In addition, it is an adhesive material for an adhesive tape used for a semiconductor device in which a semiconductor element (wafer) is adhered and fixed to a fixing support substrate or a lead frame of a lead frame or a semiconductor device mounting substrate. The method, in particular, relates to a method of forming an adhesive material that is rolled into a disk-shaped adhesive tape. Next, the background art of the invention described in the claims 65 to 66 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Further, the adhesive tape is also applied to a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, an adhesive film such as a micro BGA/CSP, etc., and the purpose thereof is to improve the productivity and reliability of the entire semiconductor device. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the substrate of the substrate from the substrate side of the adhesive tape which is taken up from the adhesive sheet to the -161 - 200823137 circuit board, and the residual substrate is taken up by the take-up reel. Secondly, when the adhesive tape of the adhesive material plate is used up, the used tray and the take-up tray of the take-up substrate are removed, the new adhesive material tray and the new take-up tray are loaded to the adhesive device, and the adhesive material is adhered. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per one disk, so as to reduce the frequency of replacement of the disk. However, if the number of the adhesive tape is increased, the disk is increased. The size of the winding diameter of the adhesive tape (hereinafter referred to as the "winding diameter") may also be large, and it may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the patent application range is 65~ The object of the invention described in the 66th aspect is to provide a method for forming an adhesive tape which can improve the production efficiency of an electronic device without increasing the winding diameter of the adhesive tape. Next, an embodiment of the invention described in the claims 65 to 66 will be described with reference to the attached drawings. Referring to Figs. 66A and A, Fig. 67, Fig. 68, Fig. 4, Fig. 29, and Fig. 5, a first embodiment of the invention described in the claims 65 to 66 will be described. Fig. 66A and Fig. B are the steps of forming the adhesive tree of the adhesive tape -162-200823137 of the first embodiment, and Fig. 66 is a view of the adhesive tape overlapping one another and one base. Figure 6 is a cross-sectional view showing the overlap between the adhesives in Fig. 66A, and Fig. 67 is an adhesive for forming an adhesive device on the covering. Figure 6 is a perspective view of the disk with the adhesive tape wound, Figure 4 is a cross-sectional view of the adhesion between the circuit boards, and Figure 29 is a perspective view of the state of use of the adhesive of the PDP. Fig. 5 is a step diagram of a method of manufacturing an adhesive tape. The adhesive tape 1 is wound around the discs 3, 121, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 121. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. In terms of strength and adhesion of the adhesive, the substrate 9 should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate), however Not limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthraquinone resin type. The conductive particles 13 may also be dispersed. The conductive particles 13 are metal particles such as Au, Ag, Pt, m, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A polymer core material such as plastic covers the conductive layer or the like to form -163-200823137. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, the deformability due to deformation due to heating, pressurization or pressurization is reduced, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit' to improve reliability. In particular, it is better to use a polymer as a core material. If the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and the error of the thickness and flatness of the electrode can be easily obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 66A, the discs 3, 121 of the two adhesive tapes 1, and the reels 17 and 18 for winding are attached to the adhesive device 15, and the adhesive tape wound on one of the discs 3 is attached. The front end of 1 is attached to one of the take-up reels 17 via the guide pin 22, and the adhesive tape 1 is unwound (Fig. 66A, arrow A). Further, the front end of the adhesive tape 1 wound on the other disk 121 is also attached to the other take-up reel 18, and the adhesive tape 1 is unwound and the adhesive material is unwound from the disc 3, 1 2 1 The tape 1 is formed by laminating the adhesive tapes 1 by using the pressure rollers 1 22 disposed between the disks 3 and 121 and the heating and pressing heads 19. Next, the base material 9 of the other adhesive tape 1 is taken up to the take-up reel 18. Next, one of the adhesive tapes 1 is placed on the circuit board 21, and the pressure of the adhesive tape 1 is applied from the side of the substrate 9 by the heating and pressing head 19, and the adhesive 11 is pressed against the circuit of the covering. Substrate 2 1. Thereafter, the base -164 - 200823137 material 9 is taken up to the take-up tray 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polytetraene material 24 is used as a buffer material to heat the pressing head 19 to the circuit. Substrate: The heating and pressurization of the wiring circuit 2 3 is performed. In this manner, the electrode 2 1 a of the board 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Fig. 29, as shown in the connecting portion of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed against the entire PDP 26, and the amount of the adhesive 1 used at one time is much larger than that of the first use. The amount of usage passed. Therefore, the amount of the adhesive tape 1 wound around the discs 3, 12 1 is also increased, and the adhesive tape 1 wound on the discs 3, 121 is taken up to the take-up reel 1 7 and 1 in a short period of time. 8. In this embodiment, when the adhesive 1 1 is pressed against the circuit board 2 1 in one step, the adhesive 11 of the adhesive tape 1 and the adhesive 1 1 of the adhesive tape 1 are superposed, and the desired one is obtained. After the thickness of the adhesive layer 1 is applied, the adhesive 1 1 is pressed to the circuit board 2 1, so that the thickness of the tape 1 can be half. Therefore, the number of rolls per 1 adhesive tape 1 can be increased, and the amount of adhesive for replacement work can be greatly increased. Therefore, less work of the new adhesive tape 1 is required, so that the production efficiency of the electronic machine can be improved. Here, a method of manufacturing an adhesive paste according to the present embodiment will be described with reference to Fig. 5 . On the substrate 9 which is unwound from the unwinding machine 25, the coating machine 27 is used to coat the periphery of the PDP of the fluoroacetic acid PDP from the resin in a manner of about half of the usual manner. The adhesive of the adhesive tape can be used to make the thickness of the replacement tape and the adhesive π which is mixed with the conductive particles 13 and dried in the drying oven 29, and the raw material is taken up by the coiler 3 1 . The original material of the adhesive tape 1 taken up is cut into a specific width by the cutter 3 3 and taken up to the reel 5, and the side plates 7, 7 are attached to the reel 5 from both sides, together with the dehumidifying material. Packing and carrying out management of low temperature (-5 °C~-1 〇艺) and shipping. Further, the adhesive tape 1 may be one in which the adhesive 11 described later contains a curing agent. In the following, the other embodiments of the invention described in the sixth to fifth aspects of the application are described. In the embodiments described below, the same reference numerals will be given to the same parts as the above embodiments, and the details of the parts will be omitted. Note that the following description is mainly based on differences from the above embodiment. In the second embodiment shown in Fig. 69A, the adhesive 11a containing the curing agent and the conductive particles 13 and the adhesive tape lb not containing the curing agent and the conductive particles 13 can be produced, as in the 69th. As shown in Fig. A, an adhesive tape 1a containing a curing agent or the like, and an adhesive tape lb not containing a curing agent or the like are integrally laminated, and the superposed substances are pressed against the circuit board 21. At this time, since only one of the adhesive tapes 11a of the adhesive tape la contains a hardener, the adhesive lib of the other adhesive tape lb does not need to contain a hardener. Therefore, the adhesive tape 1 b of the adhesive 1 1 b which does not contain the hardener does not need to be subjected to low temperature management. Therefore, the number of adhesive tapes 1 a requiring low temperature management can be reduced, and the transportation and storage of the adhesive tape can achieve more efficient management. Further, when the adhesive is an epoxy resin, the curing agent for the epoxy resin should be an imidazole type, an amine imide, an ammonium salt, a polyamine, or a polythiol. Further, as shown in Fig. 69B, the adhesive 11a containing the adhesive tape la of one of the curing agents contains the conductive particles 13 and has two layers. Since the pressed side does not contain conductive particles, the resin will The flow does not flow out from the circuit between the conductive particles and the crucible, and the conductive particles 13 can be surely kept between the electrode 21a and the electrode 23a when heated and pressurized. The invention described in the claims 65 to 66 is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the invention as set forth in the claims 65 to 66. In the first embodiment, the adhesive 11 contains the conductive particles 13 or, however, the adhesive 11 not containing the conductive particles 13 may be used. The above description is directed to the case where the electronic component, the circuit board, and the circuit board are fixed to each other. However, the present invention can also be applied to a wafer for fixing and fixing a semiconductor element (wafer) to a fixing support substrate of a lead frame or a lead frame. Or on a semiconductor device on which a semiconductor substrate is mounted. Next, the invention described in the claims 67 to 72 will be described. These inventions relate to electronic components such as liquid crystal panels, PDP panels, EL panels, bare chip packages, and the like, and to the adhesion between the boards, and to provide electrical connection between the electrodes of the two. The conductive material for the purpose of the different conductive material is, in particular, related to the winding form of the different conductive material. Next, the background art of the invention described in the claims 67 to 72 will be described. -167- 200823137 A method of connecting electronic components to a different-conductive conductive tape, a circuit board, or a circuit board, by using a conductive adhesive material sandwiching a film-like adhesive between opposing electrodes, and performing electron heating and pressing The connection between components and boards, or boards. In the film-like adhesive, conductive particles for the purpose of conducting conduction between the electrodes are mixed, and the resin used is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin, and a photocurable resin. (For example, refer to Japanese Laid-Open Patent Publication No. Hei. No. 5-5-100-07.) Further, a circuit connection method using a conductive material and having a resin-only conductive material is also known (for example, , refer to Japanese Laid-Open Patent Publication No. 60-262430. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an anthracene resin type, and an acrylic resin type. Both the thermoplastic resin and the thermosetting resin are required to be heated and pressurized. The purpose is to allow a resin of a thermoplastic resin to flow and to obtain a adhesion between the resin and the coating, and to obtain a further curing reaction of the resin in order to obtain a thermosetting resin. In recent years, from the viewpoint of connection reliability, a mixture of a thermoplastic resin and a thermosetting resin, and a thermosetting resin are mainly used. Moreover, the photohardenable resin which can be connected at a low temperature has also been applied to industrial applications.
又’近年來，爲了防止被連接體之反翹及伸展，要求 向異導電材之連接時之連接溫度的低溫化。又，隨著向異 導電材之連接用途的擴大、以及液晶面板、PDP面板、EL -168- 200823137 面板、及裸晶片封裝等之需要的擴大，對連接時之工作時 間之短時間化的要求愈來愈強。 又，隨著向異導電材之連接需要及用途之擴大，不但 要求短時間之連接，尙要求能提高生產性。因爲液晶面板 、PDP面板、EL面板、及裸晶片封裝等之需要的擴大， 向異導電材之使用量亦增加。另一方面，隨著液晶面板之 大畫面及PDP面板等大畫面平板之需要的擴大，向異導電 材之1片面板所使用之使用量亦增加。傳統上，向異導電 材之提供係採用將膜狀之黏著劑重疊捲繞於剖面爲圓形芯 材上的盤形狀，盤之更換時間妨礙生產性之提高。 另一方面，隨著液晶面板之細邊緣化，向異導電材亦 朝狹窄化發展，傳統上捲繞於同一圓芯狀之盤形狀很容易 發生捲取散亂，進而導致製造步驟之廢料率的惡化。 有鑑於上述缺點，申請專利範圍第67〜72項記載之 發明的目的，係在提供一種向異導電材膠帶，可延長盤之 更換時間之間隔，且以避免捲取散亂所導致之作業性的降 低，而可提高生產性。 其次，針對申請專利範圍第67〜72項記載之發明之 實施形態進行說明。 第70圖係申請專利範圍第67〜72項記載之發明之第 1實施形態之模式圖。 如第70圖所示，本實施形態之向異導電材膠帶，係 將由膜狀黏著劑1 1、及兩面經過剝離處理之基材膜（基材 )9之2層構造所構成之向異導電材，以多捲數方式積層 -169- 200823137 於芯材5之縱向上而成爲捲線狀，第7 0圖係向異導電材 之供應形態。第70圖中，芯材5之兩端部分別配設著側 板7。又，向異導電材膠帶係由基材膜9、及塗布於基材 膜9上之向異導電材之膜狀黏著劑11所構成，向異導電 材膠帶因係應用於高精細化之電子構件之連接上，爲了防 止無機及有機物之異物及污染，基材膜9會位於黏著劑之 外側。 採用向異導電材之連接上，要求縮短工作時間，且要 求向異導電材之迅速轉錄性。如上面所述，將向異導電材 以多捲數方式積層於附有側板7之芯材（捲軸）5之縱向 上而成捲線狀，可提供不會發生捲取散亂之長方形向異導 電材。因此，可延長向異導電材膠帶之更換時間之間隔而 提高生產性。 上述向異導電材膠帶時，基材膜9之拉伸強度應爲 12kg/mm2以上、基材膜9之斷裂伸展應爲60〜200%。因 此，基材膜9因爲具有強度且伸展較小，在將構成向異導 電材之膜狀黏著劑1 1轉錄至電路基板等連接構件之前的 過程中，可防止膜狀黏著劑1 1伸展、厚度變薄、以及寬 度變細。又，以處理及環境保護之角度而言，基材膜9之 厚度應爲100 μηι以下。因爲基材膜9太薄會導致上述效果 之劣化，故基材膜9之厚度應爲0.5 μπι以上。 其次，上述向異導電材膠帶所採用之基材膜9，從強 度、及構成向異導電材之黏著劑之剝離性的角度而言，應 採用經過矽及氟剝離處理之ΡΡ (聚丙烯）、ΟΡΡ (延伸聚 -170- 200823137 丙烯）、及PET (聚對苯二甲酸乙二酯）等，然而，並不 限於此。 基材膜9之剝離處理，以矽或氟處理即可實現，只在 基材膜9之單面實施剝離處理的話，可使基材膜9之表面 及背面具有不同之脫模性，而可防止對基材膜9之背面轉 錄。又，對基材膜9之兩面實施剝離處理時，對膜狀黏著 劑1 1面實施矽及氟處理，而使膜狀黏著劑1 1面具有剝離 性。 膜狀之黏著劑1 1係使用具高信賴性之熱硬化性樹脂 系之環氧樹脂系、以黏著劑之低應力化爲目的而且具有良 好黏著劑相溶性之矽樹脂系、以及可以較上述爲低之溫度 及較短之時間實施連接之自由基系之物，然而，膜狀之黏 著劑並未受限於此。自由基系之黏著劑11係以壓克力系 黏著劑爲主。 第7 1圖係申請專利範圍第67〜72項記載之發明之第 2實施形態的模式圖。又，第71圖中，和第70圖相同之 構成要素會附與相同符號並省略詳細說明。 如第7 1圖所示，本實施形態之向異導電材膠帶有2 種基材膜，除了採用以前述基材模夾住黏著劑之方式構成 之向異導電材以外，其餘構成和第1實施形態之向異導電 體膠帶相同。亦即，本實施形態之向異導電材如第71圖 所示，係由膜狀之黏著劑11、及黏著劑11面實施過剝離 處理之2種基材9a、9b之3層構造所構成。 構成向異導電材之黏著劑較軟時，可以利用捲軸側之 -171 - 200823137 如下所示之基材膜來防止黏著劑變形。 其次，基材膜9a、9b之物性値上，基材膜9a、9b之 拉伸強度應爲 1.2kg/mm2以上、基材膜 9a、9b之斷裂伸 展應爲60〜200%之理由，和第1實施形態時相同。利用 此方式，基材膜9a、9b可得到物理強度，而可防止因爲 膜狀黏著劑之伸展而產生薄膜化、以及寬度方向之變細。 又，基材9a、9b之厚度應爲1 ΟΟμιη以下，如此，在操作 及環境保護都可有良好之對應。 又，上述第1及第2實施形態時，若構成向異導電材 之膜狀黏著劑1 1爲無黏著性且不會出現阻塞現象者，則 可在無基材膜9或9a、9b之狀態下單獨其膜狀黏著劑1 1 捲成捲線狀。 以下，針對實施例進行說明，然而，申請專利範圍第 67〜72項記載之發明並未受限於這些實施例。 (實施例1 ) (〇向異導電材膜之製作 製作乙酸乙酯之30重量百分率溶液，對其添加平均 粒徑爲2·5 μιη、5體積百分率之Ni粉。其次，上述乙酸乙 酯溶液添加當做膜形成材之苯氧基樹脂（高分子量環氧樹 脂）50g、環氧樹脂20g、及咪唑5g，得到黏著劑形成用 溶液。另一方面，準備在著色成淡藍色之透明、厚度爲 50μηι之聚對苯一甲酸乙一醋S旲（斷裂強度爲25kg/mm2、 斷裂伸展爲1 3 0 % )之兩面實施矽處理之基材膜。其次’ -172- 200823137 在此基材膜之單面上以滾塗機塗布上述溶液 之5分鐘乾燥，得到厚度50μιη之向異導 (2)向異導電材膠帶之製作 將上述向異導電材膜之捲繞物切割成寬 多捲數方式積層於附有側板之直徑48mm、1 芯材（捲軸）之縱向上而成爲捲線狀，得到 向異導電材膠帶。 將此捲繞成捲線狀之向異導電材，亦良口 材膠帶裝設於向異導電材膠帶自動壓著機上 電材時，在向異導電材之轉錄性及伸展試驗 果，而且，可減少盤之裝設次數、無需裝 免轉錄性及黏著劑之伸展所導致之貼附作業 些效果可提高生產性。 (實施例2 ) 製作和實施例1相同之向異導電材膠麂 ，在基材膜及黏著劑之積層體上，以2基和 之方式，層壓另1種類之厚度爲25 μπι之葬 烯酯基材膜（斷裂強度爲2 5kg/mm2、斷裂1 ，得到3層構造之向異導電材膜之捲物。戔 1相同，將此膜之捲物切割成寬度1.5mm， 附有側板之直徑48mm、寬度1 〇〇mm之芯和 ，實施1 1 〇 t: 材膜的捲繞物 度 1 . 5 m m，以 i度1 0 0mm之 3 00m長度之 ，將向異導電 並供應向異導 中獲得良好結 時間、以及避 的重複，而這 之捲物。其次 膜夾住黏著劑 對苯二甲酸乙 【展爲130%) 次，和實施例 並將其捲取至 (捲軸）而成 -173- 200823137 爲捲線狀，得到3 00m長度之向異導電材膠帶。 實施例2亦和實施例1相同，可得到良好之生產性。 (實施例3 ) 除了基材膜採用厚度50μιη之聚四氟乙烯膜（斷裂強 度爲4.6kg/mm2、斷裂伸展爲3 5 0%)以外，得到和實施例 1相同之向異導電材膜之捲繞物，此外，和實施例1相同 ，將此膜之捲繞物切割成寬度1 .5mm，捲繞於附有側板之 直徑48mm、幅100mm之芯材（捲軸）而成爲捲線狀，得 到3 0 0m長度之向異導電材膠帶。此時，亦可捲繞3 00m 之長度。 (比較例1 ) 得到和實施例1相同之向異導電材膜之捲繞物，此外 ，和實施例1相同，將此膜之捲繞物切割成寬度1 . 5mm， 以同一圓芯狀捲繞至傳統之盤，得到l〇〇m長度之向異導 電材膠帶。 將此捲繞成捲線狀之向異導電材膠帶裝著至向異導電 材膠帶自動壓著機，並供應向異導電材時，向異導電材之 轉錄性及伸展試驗皆獲得良好結果，然而，盤之裝設次數 爲實施例之3倍，裝設時間及調整時間都增加。 本發明之產業上的利用可能性如下所示。 如以上說明所示，利用申請專利範圍第1項記載之發 明時’係利用黏著材膠帶之黏著劑來黏著全部捲出之黏著 -174- 200823137 材膠帶（一方之黏著材膠帶）之終端部、及新裝著之黏著 材膠帶（另一方之黏著材膠帶）之始端部，實施黏著材盤 之更換，很簡單即可將新黏著材膠帶裝著至黏著裝置。 又，因爲無需在每次更換新黏著材膠帶時都更換捲取 膠帶、將新黏著材膠帶之始端裝設於捲取盤上之作業、以 及在特定路徑設定導引銷等之作業，只需要較少時間即可 更換新黏著材盤，故可提高電子機器之生產效率。 因爲一方之黏著材膠帶及另一方之黏著材膠帶係以重 疊黏著劑面來進行黏著，故有較高之連接強度。 利用申請專利範圍第2項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之效果以外，全部捲 出之黏著材膠帶之切斷係在露出結束標記時實施，切斷及 執行連接作業之部份容易解開且可利用必要最小之位置實 施連接，而可防止黏著材膠帶之浪費。 利用申請專利範圍第3項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶黏著全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 ，故很簡單即可實施黏著材膠帶間之黏著。 利用申請專利範圍第4項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 -175- 200823137 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 利用申請專利範圍第5項記載之發明時，因爲係以卡 止銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏 著材膠帶之始端部，故連接十分簡單。又，因爲無需在每 次更換新黏著材盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設於捲取盤上作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 利用申請專利範圍第6項記載之發明時，卡止構件之 一方之爪部會卡止於一方之黏著材膠帶之終端部，其後， 配設於卡止構件之另一方之爪部會卡止於另一方之黏著材 膠帶之始端部，實施兩者之互相連接，故連接十分容易。 因爲一方之爪部及另一方之爪部之間具有彈性構件， 故，彈性構件可伸展而使卡止構件之另一方之爪部卡止於 另一方之黏著材膠帶之始端部之任意位置上，故連接具有 高自由度。 又5 —方之黏著材膠帶之終細部及另一方之黏者材膠 帶之始端部會在互相抵接之狀態進行連接，無需重疊膠帶 ，可利用必要最小之位置實施連接’而可防止黏者材膠帶 之浪費。 利用申請專利範圍第7項記載之發明時，只需以夾子 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 -176- 200823137 部之重疊部份即可連接，連接作業十分容易。 利用申請專利範圍第8項記載之發明時，係從重疊部 份之兩面壓扁夾持片來連接兩者，可提高黏著材膠帶之重 疊部份的連接強度。 利用申g靑專利範圍第9項記載之發明時，係利用黏著 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，因爲無需 每次更換新黏著材盤時都更換基材之捲取盤、及將新黏著 材之始端裝設至捲取盤，只需要較少時間即可更換新黏著 材盤，故可提高製造效率。 利用申請專利範圍第1 0項記載之發明時，除了具有 和申請專利範圍第9項記載之發明相同之效果以外，一方 之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部會 互相形成鈎狀卡止，而且，兩者係以黏著劑面互相連接， 故有較高之連接強度。 利用申請專利範圍第1 1項記載之發明時，除了具有 和申請專利範圍第9或1 0項記載之發明相同之效果以外 ，一方之黏著材膠帶之終端部係結束標記之部份，執行連 接作業之部份容易解開，且防止黏著材膠帶之浪費。 利用申請專利範圍第1 2項記載之發明時，除了具有 和申請專利範圍第9項〜1 1之其中任一項記載之發明相同 之效果以外，因爲連接部份會形成凹凸，可擴大連接面積 ，同時，可提高連接部份之黏著材膠帶之拉伸方向（縱向 -177- 200823137 )之強度。 利用申請專利範圍第1 3項記載之發明時，除了具有 和申請專利範圍第9項〜第1 1項之其中任一項記載之發 明相同之效果以外，連接部份會形成貫通孔，貫通孔之內 緣會有黏著劑滲出，可增加黏·著劑之黏著面積，而進一步 提高連接強度。 利用申請專利範圍第1 4項記載之發明時，只需連接 已用完之黏著材膠帶（一方之黏著材膠帶）、及新黏著材 膠帶（另一方之黏著材膠帶）即可更換盤，故很簡單即可 將新黏著材盤裝著至黏著裝置。又，因爲無需每次更換新 黏著材盤時都更換捲取盤、將新黏著材膠帶之始端裝設於 捲取盤上、以及將黏著材膠帶裝設於導引件之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 黏著材膠帶之處理基材所使用之處理劑係矽系樹脂， 且黏著膠帶亦使用矽黏著劑，因可降低兩者之表面張力差 而提高密著力，故可實現傳統上十分困難之兩者之黏著。 利用申請專利範圍第1 5項記載之發明時，除了具有 和申請專利範圍第1 4項記載之發明相同之效果以外，矽 黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽處理基 材之表面張力之差爲l〇mN/m ( 10dyne/cm)以下，可得到 強密著力，而可確實黏著兩者。 利用申請專利範圍第1 6項記載之發明時，除了具有 和申請專利範圍第1 5項記載之發明相同之效果以外，因 -178- 200823137 爲黏著力爲1 0〇g/25mm以上，可使一方及另一方之黏著材 膠帶之兩黏著劑面之黏著更爲強固。 利用申請專利範圍第1 7項記載之發明時，除了具有 和申請專利範圍第1 6項記載之發明相同之效果以外，係 利用兩面連接一方及另一方之黏著材膠帶，故可得到更爲 強固之連接。 利用申請專利範圍第1 8項記載之發明時，因爲採用 兩面黏著劑之矽黏著膠帶，利用將兩面矽黏著膠帶夾於一 方及另一方之黏著材膠帶間之方式來實施兩者之黏著（或 密著），故兩者之連接十分簡單且容易。 利用申請專利範圍第1 9項記載之發明時，因已全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部係以糊狀樹脂製黏著劑固定，故連接十分簡單。又， 因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、將 新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路 徑設定導引銷等之作業，只需要較少時間即可更換新黏著 材盤，故可提高電子機器之生產效率。 利用申請專利範圍第20項記載之發明時，除了具有 和申請專利範圍第1 9項記載之發明相同之作用效果以外 ，因樹脂製黏著劑可從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取適合黏著材膠帶間之連接的樹 脂製黏著劑，故可提高黏著材膠帶間之連接強度。 利用申請專利範圍第2 1項記載之發明時，黏著裝置 內因配設著供應申請專利範圍第1 9或20項記載之樹脂製 -179- 200823137 黏著劑之充塡機，無需另行準備充塡機，故可防止連接作 業之浪費。 利用申請專利範圍第22項記載之發明時’捲繞於一 方之捲部的黏著材膠帶全部捲出時，將捲繞於相鄰捲部之 黏著材膠帶裝設至捲取盤，實施黏著材膠帶之更換，因爲 無需將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少 之新黏著材膠帶盤之更換作業，故可提高電子機器之生產 效率。 利用申請專利範圍第23項記載之發明時，除了具有 和申請專利範圍第22項記載之發明相同之效果以外，因 係以連結膠帶連接一方之黏著材膠帶之終端部及另一方之 黏著材膠帶之始端部，故一方之黏著材膠帶盤之黏著材膠 帶全部捲出後，無需將另一方之捲部之黏著材膠帶裝設至 盤之作業，故可進一步提高電子機器之生產效率。 利用申請專利範圍第24項記載之發明時，因爲連結 膠帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，連結膠帶會被自動捲取至捲取盤，故可省 略捲取之麻煩。 利用申請專利範圍第2 5項記載之發明時，一方之黏 著材膠帶之終端部及另一方之黏著材膠帶之始端部之連接 部份，因爲係以黏著材膠帶覆蓋卡止具，故外觀良好，同 時，可防止連接部份之卡止具接觸黏著材膠帶而使黏著材 -180- 200823137 膠帶或黏著裝置受損。 利用申請專利範圍第26項記載之發明時，連接部檢 測手段檢測到連接部份，至連接部份通過壓著部爲止，會 將一方之黏著材膠帶捲取至捲取盤，可防止連接部份到達 壓著部時實施壓著動作之問題。又，至連接部份通過壓著 部爲止，因爲會自動將一方之黏著材膠帶捲取至捲取盤， 故可省略捲取之麻煩。 利用申請專利範圍第27項記載之發明時，除了具有 和申請專利範圍第26項記載之發明相同之作用效果以外 ，以簡單之構成即可實施連接部份之檢測，而且，可利用 這些手段來提高檢測精度。 利用申請專利範圍第29項記載之發明時，因可依序 逐條使用複數條黏著劑，可在不增加膠帶之捲數的情形下 ，可使1盤可使用之黏著劑的量增加成傳統之2倍以上。 因未增加捲數，故可防止捲取散亂，同時，可防止因 爲黏著劑從膠帶之寬度方向滲出而使捲取之膠帶間發生黏 著所導致之阻塞，此外，亦可防止因爲膠帶狀之基材較長 而容易發生之伸展等弊病（基材之損傷或斷裂）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高作業效率。 又，黏著劑膠帶之製造上，因可減少製造之盤數，可 減少盤材及濕氣防止材之使用量，故可降低製造成本。 利用申請專利範圍第3 0項記載之發明時，除了具有 和和申請專利範圍第2 9項記載之發明相同之·效果以外， -181 - 200823137 因相鄰之黏著劑條間具有間隔，很容易即可實施逐條分離 ，而使對電路基板之壓著更爲容易。 利用申請專利範圍第3 1項記載之發明時，除了具有 和申請專利範圍第2 9項相同之效果以外，只需在塗布於 基材之單面全面上之黏著劑上形成縫隙即可，製造十分容 易，而且，相鄰之黏著劑條間的間隙很小，故可增加配置 於基材上之黏著劑條之條數。 利用申請專利範圍第3 2項記載之發明時，很容易即 可製造申請專利範圍第3 0項記載之黏著劑膠帶。 利用申請專利範圍第3 3項記載之發明時，因可同時 製造2條黏著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 4項記載之發明時，因係實施 部份黏著劑之加熱來降低該部份之凝聚力並將其壓著至電 路基板，而黏著劑膠帶係使用在基材之單面全面塗布黏著 劑者，故可直接利用既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用變更加熱區 域而進行任意設定，故壓著之黏著劑寬度具有高自由度。 和申請專利範圍第29項記載之發明相同，因爲會依 逐條對基材上之黏著劑加熱並壓著至電路基板，可在不增 加膠帶之捲數的情形下，將1盤可使用黏著劑量增加成2 倍以上。 因無需增加捲數即可增加黏著劑量，故和申請專利範 圍第29項記載之發明相同，可防止捲取散亂，同時，亦 可防止因黏著劑之滲出而導致之阻塞及基材伸展之弊病。 -182- 200823137 利用申請專利範圍第3 5項記 劑膠帶之寬度具有電路基板之一邊 加黏著劑量，同時，減少黏著劑膠 因爲無需增加黏著劑膠帶之捲 著劑量，故可防止捲取散亂，同時 損傷或斷裂。又，因電子構件之製 膠帶之更換次數，故可提高製造效 此外，黏著劑膠帶之製造上， 量，可減少盤材及濕氣防止材之使 本° 利用申請專利範圍第3 6項記 和申請專利範圍第3 5項記載之發 鄰之黏著劑條會分離，很容易即可 離並實施壓著。 利用申請專利範圍第3 7項記 和申請專利範圍第3 5項相同之效 於基材上之黏著劑條之條數且製造 利用申請專利範圍第3 8項記 用既存設備同時製造2條申請專利 著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 9項記 到申請專利範圍第3 5項〜第3 7項 果以外，很簡單即可將黏著劑壓著 可提高電子構件之製造工廠之作業 載之發明時，因爲黏著 以上之長度，故可在增 帶之捲數。 數即可大幅增加使用黏 ，可防止阻塞、基材之 造工廠可減少新黏著劑 率。 因增加每1盤之黏著劑 用量，故可降低製造成 載之發明時，除了具有 明相同之效果以外，相 逐條將黏著劑從基材剝 載之發明時，除了具有 果以外，尙可增加配置 更爲容易。 載之發明時，因爲可利 丨範圍第3 6項記載之黏 載之發明時，除了可得 之其中任一項記載之效 至電路基板之一邊，而 效率。 -183- 200823137 利用申請專利範圍第40項記載之發明時，除了可得 到申請專利範圍第3 5項〜第3 7項記載之效果以外，無需 旋轉電路基板，而只要移動一方之黏著劑膠帶及另一方之 黏著劑膠帶之位置，很容易即可將黏著劑壓著至電路基板 之四周，故有良好之作業效率。 利用申請專利範圍第4 1項記載之發明時，將黏著劑 壓著至電路基板之周圍時，會沿著寬度方向對黏著劑膠帶 實施條狀加熱加壓，很容易即可將黏著劑壓著至電路基板 ，而有良好之作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可， 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和申請專利範圍第3 5項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明時，因係逐條使用 配置於黏著劑板上之寬度方向的至少2條黏著劑，每1盤 至少可使用2盤份，無需增加黏著劑膠帶之捲數，即可大 幅增加1盤可使用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 -184- 200823137 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或斷 裂）。 因黏著劑膠帶係盒形式，黏著裝置上無需實施將黏著 劑膠帶裝設至盤之繁複業作，而只要將盒裝著至黏著裝置 即可，處理上更爲容易，且具有良好之裝設及更換作業性 〇 利用申請專利範圍第43項記載之發明時，除了具有 和申請專利範圍第42項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑並 實施壓著。 利用申請專利範圍第44項記載之發明時，除了具有 和申請專利範圍第4 2項相同之效果以外，黏著劑膠帶只 需在基材之單面全面塗布黏著劑並形成縫隙即可，故製造 十分容易。 利用申請專利範圍第45項記載之發明時，因爲黏著 劑膠帶只需在基材之全面塗布黏著劑即可，故可直接利用 既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用改變加熱加 壓區域來實施任意設定，故壓著之黏著劑寬度具有高自由 度。 利用申請專利範圍第46項記載之發明時，除了具有 和申請專利範圍第45項相同之效果以外，尙和申請專利 範圍第1項記載之發明相同，因爲未增加捲數卻可增加黏 -185· 200823137 著劑量，故可防止捲取散亂，同時，得到可防止因黏著劑 之滲出而造成之阻塞、及防止因基材之伸展而造成之弊病 等之效果。使用時，1盤份全部捲出時，只需反轉盒即可 ，故下一次之裝著十分容易。因採用盒形式，處理上更爲 容易，且具有良好之裝設及更換作業性。 利用申請專利範圍第47項記載之發明時，利用黏著 材膠帶之基材黏著全部捲出之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，無需每次 更換新黏著材盤時都更換捲取盤、及將新黏著材盤之始端 裝設至捲取盤之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 利用申請專利範圍第48項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。 又，因爲熱熔融劑層形成於膠帶之縱向全體，重疊長 度無需嚴格定位，故連接具有高自由度。 利用申請專利範圍第49項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 熱熔融劑層係夾於支持層之間，可防止熱熔融劑層曝露於 大氣下，故可防止濕氣之吸濕或灰塵等之附著而導致熱熔 融劑層之黏著強度降低。 -186- 200823137 利用申請專利範圍第5 0項記載之發明時，去除基材 端部之以脫模劑實施表面處理之部份，利用黏著材膠帶之 黏著劑黏著全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，來實施黏著材盤之更換，故很簡單即 可將新黏著材盤裝著至黏著裝置。 利用申請專利範圍第5 1項記載之發明時，除了具有 和申請專利範圍第5 OIX C記載之發明相同之效果以外， 因係利用電漿放電、紫外線照射、及雷射照射之其中任何 一種方法去除脫模劑，可在短時間內正確地去除脫模劑。 利用申請專利範圍第5 2項記載之發明時，因爲黏著 材膠帶盤上配設著複數個將黏著材膠帶捲繞於盤上之黏著 材膠帶之捲部（捲部），複數之捲部當中，一個捲部之黏 著材膠帶全部捲出時，會使用和全部捲出之捲部爲相鄰配 置之其他捲部之黏著材膠帶，因爲無需將新黏著材膠帶盤 裝著至黏著裝置，只需較少之新黏著材膠帶盤之更換作業 ，故可提高電子機器之生產效率。又，因爲係依序使用複 數之黏著材膠帶，無需增加1個黏著材膠帶盤之黏著材膠 帶的捲數，即可大幅增加1次更換作業之可使用的黏著劑 量。又，因爲無需增加黏著材膠帶之捲數，故可防止捲取 散亂，同時，可防止黏著劑從膠帶之寬度方向滲出而使已 捲取之黏著材膠帶間發生黏著，亦即，可防止阻塞，而且 ，亦可防止因爲基材較長而容易發生之伸展等弊病。 利用申請專利範圍第5 3項記載之發明時，因爲盤之 側板上配設著乾燥劑之收容部，除了具有和申請專利範圍 -187- 200823137 第52項記載之發明相同之作用效果以外，尙可從內部確 實除去黏著材膠帶盤內之濕氣，故可進一步防止黏著材膠 帶因濕氣之吸濕而發生品質降低下。 利用申請專利範圍第54項記載之發明時，因爲覆蓋 捲繞於盤上之黏著材膠帶之周圍的蓋體構件，係以可自由 裝卸之方式配設於盤上，黏著材膠帶不會直接曝露於大氣 下，故可防止灰塵或大氣之濕氣對黏著材膠帶產生不良影 響。因此，即使配設複數之捲部時，對未使用之捲部配設 蓋體構件，可防止黏著材膠帶之品質降低。 又，因爲以可自由裝卸之方式配設蓋體構件，只要拆 下蓋體構件，即可簡單地從黏著材膠帶盤捲出黏著材膠帶 〇 利用申請專利範圍第5 5項記載之發明時，除了具有 和申請專利範圍第5 2至5 4項之其中任一項記載之發明相 同之作用效果以外，因爲尙可從蓋體構件之拉出口捲出黏 著材膠帶，故無需拆下黏著材膠帶盤之蓋體構件，而可直 接從黏著材膠帶盤捲出黏著材膠帶。 利用申請專利範圍第5 6項記載之發明時’具有和申 請專利範圍第5 2至5 5項之其中任一項記載之發明相同之 效果以外’尙因爲捲部之側板係以可自由裝卸之方式互相 嵌合，一方之捲部之黏著材膠帶全部捲出後，解除其和另 一方之捲部之嵌合，即可依序從下一捲部捲出黏著材膠帶 〇 利用申請專利範圍第5 7、5 8項記載之發明時’具有 -188- 200823137 和申請專利範圍第52至56項之其中任一項記載之發明相 同之作用效果，尤其是，黏著材膠帶爲將用以連接相對電 極之電極連接用黏著劑塗布於基材上之黏著材膠帶、黏著 材膠帶爲用以實施引線框架之固定用支持基板、半導體元 件載置用支持基板、或引線框架之晶片和半導體元件之連 接的黏著材膠帶時特別有用。 利用申請專利範圍第5 9項記載之發明時，以單手握 持殼體，使露出黏著劑膠帶之開口部抵壓電路基板，加熱 構件從基材側實施加熱壓著，將黏著劑壓著至電路基板， 故十分小型且可以單手操作，尙且，很容易即可將黏著劑 壓著至基板之一部份。 利用申請專利範圍第60項記載之發明時，因爲黏著 材膠帶之基材係金屬膜或芳香族聚醯胺膜，即使基材之厚 度較薄時，亦可防止基材伸展或斷裂等之問題。 因此，利用厚度較薄之基材所構成之黏著材膠帶，可 增加每1盤之捲數，而增加1盤可使用之黏著劑量。又， 使用本發明之黏著材膠帶時，因可增加每1盤之捲數，電 子構件之製造工廠只需實施較少之新黏著材膠帶之更換次 數，故可提高作業效率。其次，黏著材膠帶之製造上，可 減少製造之盤數，並可減少盤材及濕氣防止材之使用量， 故可降低製造成本。 利用申請專利範圍第6 1項記載之發明時，除了具有 和申請專利範圍第60項記載之發明相同之效果以外，尙 可獲得較薄且具高拉伸強度之黏著材膠帶。 -189- 200823137 利用申請專利範圍第62項記載之發明時，除了具有 和申請專利範圍第60或6 1項記載之發明相同之效果以外 ，因爲基材之拉伸強度爲3 0 OMPa以上，不易發生基材伸 展或斷裂之問題。 利用申請專利範圍第63項記載之發明時，除了具有 和申請專利範圍第60至62項之其中任一項記載之發明相 同之效果以外，因爲基材對黏著劑之厚度比爲0.0 1〜1 . 0 ，此外，尙可得到較薄且具有高拉伸強度之黏著材膠帶。 利用申請專利範圍第64項記載之發明時，除了具有 和申請專利範圍第60至63項之其中任一項記載之發明相 同之效果以外，基材之表面粗細度Rmax爲0.5 μπι以下， 基材之表面十分平滑，將黏著劑壓著至電路基板時，黏著 劑容易從基材分離。 利用申請專利範圍第6 5項記載之發明時，在被覆體 上形成黏著劑之前一步驟，使一方之黏著材膠帶之黏著劑 、及另一方之黏著材膠帶之黏著劑重疊，得到期望之黏著 劑之厚度後，再在被覆體上形成黏著劑，故各黏著材膠帶 之厚度較薄，雖然黏著材膠帶之捲數增多，每1盤之黏著 材膠帶之捲繞直徑卻更小。 因此，可增加每1盤之黏著材膠帶之捲數，而可大幅 增加1次更換作業之可使用的黏著劑量。因此’只需較少 之新黏著材膠帶之更換作業即可，故可提高電子機器之生 產效率。 利用申請專利範圍第66項記載之發明時，除了具有 -190- 200823137 和申請專利範圍第65項記載之發明相同之效果以外，可 減少需要低溫管理之黏著材膠帶之數量，黏著材膠帶之運 送及保管可實施更有效率之管理。 利用申請專利範圍第67項〜72項之其中任一項記載 之發明時，因爲對被連接構件具有良好轉錄性（貼附性） 及良好連接信賴性，且可在改善步驟內之廢料率、及提高 作業性之情形下，提供傳統之長方形向異導電材膠帶，故 可提高生產性及作業性。 【圖式簡單說明】 第1圖係第1實施形態之黏著材膠帶連接方法時之黏 著材盤間之連接斜視圖。 第2圖A及第2圖B係第1圖之連接部份的連接步驟 斜視圖。 第3圖係黏著裝置之黏著劑的壓著步驟槪略圖。 第4圖係電路基板間之黏著的剖面圖。 第5圖係黏著材膠帶製造方法之步驟圖。 第6圖係本發明第2實施形態之黏著材膠帶連接方法 的斜視圖。 第7圖係本發明第2實施形態之變形例之黏著材膠帶 連接方法的斜視圖。 第8圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第8圖A係黏著材盤間之連接的斜視圖，第8圖B係 第8圖A之連接部份之連接方法的斜視圖，第8圖C係第 -191 - 200823137 8圖A之連接部份的平面圖。 第9圖係本發明第2實施形態之黏著材膠帶連接方法 的剖面圖。 第1 0圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第1 1圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第1 2圖A及B係第1實施形態之黏著材膠帶連接方 法圖，第1 2圖A係黏著材盤間之連接的斜視圖，第1 2圖 B係第1 2圖A之連接部份之連接方法的斜視圖。 第1 3圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 4圖A及第1 4圖B係本發明第3實施形態之黏著 材膠帶連接方法的剖面圖，第1 4圖A係加熱加壓前之狀 態，第1 4圖B係加熱加壓後之狀態。 第1 5圖A及第1 5圖B係本發明第4實施形態之黏著 材膠帶連接方法圖，第1 5圖A係剖面圖，第1 5圖B係平 面圖。 第1 6圖A及第1 6圖B係第1實施形態之黏著材膠帶 連接方法圖，第1 6圖A係黏著材盤間之連接的斜視圖， 第1 6圖B係第1 6圖A之連接部份（b )的斜視圖。 第1 7圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 8圖係本發明第3實施形態之黏著材膠帶連接方 -192- 200823137 法的剖面圖。 第1 9圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第20圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第20圖A係黏著材盤間之連接的斜視圖，第20圖B 及C係第20圖A之連接部份之連接方法的剖面圖。 第2 1圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第22圖A〜C係第1實施形態之黏著材膠帶盤圖，第 22圖A係黏著材膠帶盤的斜視圖，第22圖B係第22圖 A之正面圖，第22圖C係第22圖A之連結膠帶之平面圖 〇 第23圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第24圖係本發明第2實施形態之連結膠帶之平面圖 〇 第25圖係本發明第3實施形態之連結膠帶之平面圖 〇 第26圖係本發明第4實施形態之黏著材膠帶盤的斜 視圖。 第2 7圖A〜C係第1實施形態之黏著材膠帶盤圖，第 27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 〇 第2 8圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第29圖係PDP之黏著劑之使用狀態的斜視圖。 -193- 200823137 第3 0圖係本發明第2實施形態之黏著材膠帶盤的斜 視圖。 第31圖A係將本發明之黏著材膠帶盤之黏著材膠帶 應用於LOC構造之半導體裝置時之黏著材膠帶之剖面圖 ’第31圖B係將本發明之黏著材膠帶盤之黏著材膠帶應 用於LOC構造之半導體裝置時之LOC構造之半導體裝置 之剖面圖。 第32圖A〜C係應用本發明之黏著材膠帶盤的黏著裝 置之槪略圖，第32圖A係正面圖，第32圖B係側面圖， 第32圖C係第32圖B之黏著材膠帶冲切貼附部89的重 要部位放大圖。 第3 3圖A及B係黏著劑膠帶圖，第3 3圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第33圖B係第33圖A之 A-A剖面圖。 第34圖係PDP之黏著劑之使用狀態的斜視圖。 第3 5圖係將黏著劑塗布於基材之步驟的剖面圖。 第3 6圖A〜C係本發明第2實施形態之黏著劑膠帶之 剖面圖。 第3 7圖A〜C係本發明第3實施形態之黏著劑膠帶及 其壓著方法的步驟圖。 第3 8圖A〜C係本發明第4實施形態之黏著劑膠帶製 造方法的步驟圖。 第39圖A及B係黏著劑膠帶圖，第39圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從黏著劑側觀 -194- 200823137 看第39圖A之黏者劑膠帶時的平面圖。 第40圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第4 1圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第42圖A〜C係本發明第3實施形態之黏著劑膠帶之 剖面圖。 第43圖A〜C係本發明第4實施形態之黏著劑膠帶及 其壓著方法的步驟圖。 第44圖A〜C係本發明第5實施形態之黏著劑膠帶製 造方法的步驟圖。 第45圖A及B係本發明第1實施形態之黏著劑膠帶 盒圖，第45圖A係黏著劑膠帶盒之斜視圖，第45圖B係 第45圖A之A-A剖面圖。 第46圖係第45圖A所示之膠帶盒之盤的裝設狀態剖 面圖。 第47圖係黏著裝置之黏著劑壓著步驟的正面圖。 第4 8圖係黏著劑膠帶盒之製造方法的步驟圖。 第49圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第5 0圖係本發明第3實施形態之黏著劑膠帶之剖面 圖。 第5 1圖A及B係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第52圖A及B係第1實施形態之黏著材膠帶圖，第 -195- 200823137 52圖A係黏著材盤間之連接的斜視圖，第52圖B係第52 圖A之連接部份的剖面圖。 第5 3圖係第2實施形態之黏著材膠帶的剖面圖。 第5 4圖A〜C係第5 5圖之連接部份之連接步驟的剖 面圖，第54圖A係放電前之狀態，第54圖B係放電後之 狀態，第54圖C係連接部份之加熱壓著圖。 第5 5圖係黏著材膠帶連接方法之黏著材盤間之連接 的斜視圖。 第56圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第57圖A〜C係第1實施形態之黏著材膠帶盤圖，第 5 7圖A係黏著材膠帶盤的斜視圖，第5 7圖B係第5 7圖 A之正面圖，第57圖C係第57圖A之蓋體構件之正面圖 〇 第58圖係黏著材膠帶盤之製造方法的步驟圖。 第5 9圖係本發明第2實施形態之黏著材膠帶盤之側 面圖。 第60圖A及B係本發明第3實施形態之黏著材膠帶 盤之正面圖、及黏著劑膠帶之更換說明圖。 第6 1圖係本發明第4實施形態之捲部之側板的斜視 圖。 第62圖A及B係本發明第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 A-A剖面圖。 第63圖係用以說明第62圖A及第62圖B所示之黏 -196- 200823137 著具之使用方法的側面圖。 第64圖係黏著具之製造方法的步驟圖。 第6 5圖A及B係第1實施形態之黏著材膠帶圖’第 65圖A係黏著材膠帶捲繞於盤之斜視圖，第65圖A係第 65圖A之A-A剖面圖。 第66圖A及B係第1實施形態之黏著材膠帶之黏箸 材形成步驟圖，第66圖A係使各黏著材膠帶重疊成一 _ 且將一方之基材捲取至捲取用盤之步驟的槪略圖，第66 圖B係第66圖A之黏著劑間之重疊部份的剖面圖。 第67圖係黏著裝置在被覆體上形成黏著劑之步驟的 槪略圖。 第6 8圖係捲繞著黏著材膠帶之盤之斜視圖。 第69圖A係第2實施形態之黏著材膠帶之黏著材形 成步驟的剖面圖，第69圖B係應用第69圖A之黏著材實 施電路基板間之黏著的剖面圖。 第70圖係本發明之2層構成向異導電材膠帶之供應 形態的模式圖。 第7 1圖係本發明之3層構成向異導電材膠帶之供應 形態的模式圖。 【主要元件對照表】 1 :黏著材膠帶 2 :捲部 2a :捲部 -197- 200823137 2b :黏著材膠帶盤 2c :黏著材膠帶盤 3 :盤 3 a ··盤 5 :捲軸 7 :側板 7a :側板 7b :側板 8 :蓋體構件 9 :基材 9 a :基材 9 b :基材 1 〇 :乾燥劑 1 1 :膜狀黏著劑 1 1 a :黏著劑 1 1 b :黏著劑 1 2 :收容部 1 3 :導電粒子 1 5 :黏著裝置 16 :導引件 1 7 :捲取盤 1 9 :加熱加壓頭 2 1 :電路基板 2 1 a :電極 -198- 200823137 22 :導引銷 2 3 :配線電路 2 3 a :電極 24 :聚四氟乙烯材 25 :捲出機 2 6 ： PDP 27 :塗布機 2 8 :結束標記 2 9 :乾燥爐 3 0 :終端部 3 1 :捲取機 3 2 :始端部 3 3 :切割機 3 4 :重疊部份 3 5 :縫隙 3 6 :工作台 4 1 :連結膠帶 43 :黏著劑 44 :凹凸 46 :卡止銷 47 :卡止構件 4 8 :爪部 49 :爪部 5 0 :彈性構件 -199 200823137 51 :爪 5 3 :夾子 5 5 :夾持片 5 6 :模具 5 7 :模具 58 :凹凸 5 9 :貫通孔 60 :矽黏著膠帶 61 :矽黏著膠帶 62 :矽黏著劑 6 3 :基材 64 :樹脂製黏著劑 65 :充塡機 6 6 :加熱器 67 :連結膠帶 6 8 :切口部份 6 9 :標記 70 :標記 71 :發光部 72 :受光部 74 :連接部份 75 :切口 7 6 :卡止具 77 :厚度檢測感測器 -200 200823137 78 :支持膜 79 :控制裝置 8 0 :黏著劑層 8 1 :半導體用黏著膜 82 :半導體元件 83 :引線框架 8 4 :密封材 8 5 :焊絲 8 6 :匯流排條 8 7 :冲切模具 88 :引線框架搬運部 89 :黏著材膠帶冲切貼附部 90 :加熱器部 9 1 :黏著材膠帶盤 92 :黏著材膠帶 93 :黏著材膠帶捲出滾輪 94 :黏著材膠帶 95 :公模 9 6 :母模 97 :膜壓板 9 8 :縫隙 99 :殼體 99a :半殼體 99b :半殼體 -201 - 200823137 100 ： 101 : 102 ： 103 ： 104 ： 105 ： 106 ： 107 ： 108 ： 110： 111： 113： 114： 115： 116: 117: 118： 119: 120 ： 121 ： 黏著劑膠帶盒 導引件 縫隙 凝聚力降低線 工作台 放電機 拉出口 軸 蓋帽 被嵌合部 黏著具 開口部 加熱構件 電熱板 齒輪 齒輪 齒輪單元 第三殼體 電源開關 盤Further, in recent years, in order to prevent the warpage and stretching of the connected body, the connection temperature at the time of connection to the different conductive material is required to be lowered. In addition, with the expansion of the use of the connection to the different conductive materials, and the expansion of the needs of the liquid crystal panel, the PDP panel, the EL-168-200823137 panel, and the bare chip package, the short-time requirement for the connection time at the time of connection is required. It is getting stronger and stronger. Further, as the connection to the different conductive material is required and the use is expanded, not only a short connection is required, but also productivity is required. Since the demand for liquid crystal panels, PDP panels, EL panels, and bare chip packages has increased, the amount of use of the conductive material has also increased. On the other hand, with the expansion of large screens such as liquid crystal panels and large-screen panels such as PDP panels, the amount of use for one panel of a different conductive material has also increased. Conventionally, the supply of the electrically conductive material has been carried out by superimposing a film-like adhesive on a disk shape having a circular core shape, and the replacement time of the disk hinders the improvement of productivity. On the other hand, with the thinning of the liquid crystal panel, the conductive material is also narrowed, and the shape of the disk which is conventionally wound in the same core shape is liable to be wound up, which leads to the scrap rate of the manufacturing step. Deterioration. In view of the above disadvantages, the object of the invention described in claims 67 to 72 is to provide a tape for a different conductive material, which can extend the interval between replacement times of the disk and avoid workability caused by winding and scattering. The reduction can improve productivity. Next, an embodiment of the invention described in claims 67 to 72 will be described. Fig. 70 is a schematic view showing a first embodiment of the invention described in the claims 67 to 72. As shown in Fig. 70, the isotropic conductive material tape of the present embodiment is a heterogeneous conductive structure composed of a two-layer structure of a film-like adhesive 11 and a base film (substrate) 9 subjected to release treatment on both sides. The material is laminated in a multi-volume manner - 169 - 200823137 in the longitudinal direction of the core material 5 to be wound, and the 70th is a supply form to the electrically conductive material. In Fig. 70, the side plates 7 are disposed at both end portions of the core member 5, respectively. Further, the dissimilar conductive material tape is composed of the base film 9 and the film-like adhesive 11 applied to the base film 9 to the different-conductive material, and the dissimilar conductive tape is applied to the high-definition electronic component. In order to prevent foreign matter and contamination of inorganic and organic substances, the substrate film 9 is located on the outer side of the adhesive. The use of a connection to a different electrically conductive material requires a shortened working time and requires rapid transcription to the electrically conductive material. As described above, the conductive material is laminated in a plurality of windings in the longitudinal direction of the core material (reel) 5 to which the side plate 7 is attached, and the rectangular conductive material which can be wound and scattered can be provided. material. Therefore, it is possible to increase the interval between the replacement time of the different conductive material tapes and improve the productivity. In the case of the above-mentioned conductive material tape, the tensile strength of the base film 9 should be 12 kg/mm2 or more, and the fracture stretch of the base film 9 should be 60 to 200%. Therefore, the base film 9 has a small strength and a small stretch, and the film-like adhesive 1 1 can be prevented from stretching during the process of transcribed the film-like adhesive 11 constituting the different-conductive material to a connecting member such as a circuit board. The thickness is thinner and the width is thinner. Further, the thickness of the base film 9 should be 100 μη or less from the viewpoint of handling and environmental protection. Since the substrate film 9 is too thin to cause deterioration of the above effects, the thickness of the substrate film 9 should be 0. 5 μπι or more. Next, the base film 9 used for the above-mentioned conductive material tape should be treated with ruthenium and fluorine peeling treatment from the viewpoint of strength and peeling property to the adhesive of the different conductive material. , ΟΡΡ (extending poly-170-200823137 propylene), and PET (polyethylene terephthalate), etc., however, it is not limited thereto. The release treatment of the base film 9 can be carried out by treatment with hydrazine or fluorine. When the release treatment is performed on only one side of the base film 9, the surface and the back surface of the base film 9 can have different release properties. The back side of the substrate film 9 is prevented from being transcribed. Further, when the both surfaces of the base film 9 are subjected to the release treatment, the surface of the film-like adhesive 1 1 is subjected to a ruthenium treatment and a fluorine treatment to impart a peeling property to the surface of the film-like adhesive 11 . The film-like adhesive 1 1 is an epoxy resin based on a thermosetting resin having high reliability, a resin having a good adhesive compatibility for the purpose of reducing the stress of the adhesive, and the like. The attached radicals are carried out at a low temperature and for a short period of time, however, the film-like adhesive is not limited thereto. The free radical adhesive 11 is mainly composed of an acrylic adhesive. Fig. 7 is a schematic view showing a second embodiment of the invention described in the claims 67 to 72. It is to be noted that the same reference numerals are given to the same components as in the FIG. As shown in Fig. 7 , the conductive conductive tape of the present embodiment has two types of base material films, and the other components and the first conductive layer are formed by sandwiching the adhesive with the base mold. The conductive conductor tape of the embodiment is the same. That is, as shown in Fig. 71, the electrically conductive material of the present embodiment is composed of a three-layer structure of two kinds of base materials 9a and 9b which are subjected to a release treatment by a film-like adhesive 11 and an adhesive 11 surface. . When the adhesive constituting the electrically conductive material is relatively soft, the base material film of -171 - 200823137 on the reel side can be used to prevent the adhesive from being deformed. Next, on the physical properties of the substrate films 9a, 9b, the tensile strength of the substrate films 9a, 9b should be 1. The reason why the fracture elongation of the base film 9a, 9b is 60 to 200% is 2 kg/mm2 or more, and is the same as in the first embodiment. In this manner, the base film 9a, 9b can obtain physical strength, and can prevent filming due to stretching of the film-like adhesive and narrowing in the width direction. Further, the thickness of the base materials 9a and 9b should be 1 ΟΟμηη or less, so that there is a good correspondence between operation and environmental protection. Further, in the first and second embodiments, when the film-like adhesive 1 1 which is a conductive material is non-adhesive and does not cause clogging, the substrate-free film 9 or 9a, 9b can be used. In the state, the film adhesive 1 1 is wound into a coil shape alone. Hereinafter, the embodiments will be described. However, the inventions described in the claims 67 to 72 are not limited to these embodiments. (Example 1) (Preparation of a 30% by weight solution of ethyl acetate to a film made of a conductive material, and addition of Ni powder having an average particle diameter of 2·5 μm and 5 volume percent. Next, the above ethyl acetate solution 50 g of a phenoxy resin (high molecular weight epoxy resin) as a film forming material, 20 g of an epoxy resin, and 5 g of an imidazole were added to obtain a solution for forming an adhesive. On the other hand, it was prepared to be transparent to a pale blue color and thickness. A substrate film of ruthenium treated on both sides of 50 μm of poly(p-phenylene benzoate) acetoacetate (breaking strength of 25 kg/mm 2 , rupture extension of 130%). Secondly, - -172- 200823137 is used in the substrate film The above solution was applied to a single surface by a roll coater for 5 minutes to obtain a direction-oriented (2)-to-isoconductive material tape having a thickness of 50 μm. The above-mentioned winding of the isoconductive material film was cut into a wide multi-volume method. Laminated in a longitudinal direction of a 48 mm diameter and 1 core material (reel) with a side plate to form a coiled wire, and a tape of a different conductive material is obtained. This is wound into a coil-shaped conductive material, and is also provided with a tape. Automatically conductive tape When the on-board electrical material is used, the effect of the transcription and stretching of the conductive material on the conductive material can be reduced, and the number of times of mounting the disk can be reduced, and the effect of attaching the work without the transcription and the stretching of the adhesive can be improved. (Example 2) The same conductive material was produced in the same manner as in Example 1. On the laminate of the base film and the adhesive, the thickness of the other type was 25 μm. The ruthenium ester substrate film (breaking strength is 25 kg/mm2, rupture 1 , and a roll of the three-layer structure of the dissimilar conductive material film is obtained. The 戋1 is the same, and the roll of the film is cut into a width of 1. 5mm, with a side plate diameter of 48mm, a width of 1 〇〇mm core and the implementation of 1 1 〇 t: the winding of the material film 1 . 5 m m, with a length of 3 00 m of 1 degree 0 0 mm, will provide a different junction time for the heteroconductivity and a good junction time, and avoid the repetition. Next, the film is sandwiched with the adhesive, terephthalic acid B (shown as 130%) times, and the embodiment is taken up and rolled up to (reel) to form -173-200823137 in the form of a coil, which gives a conductive conductor of 300 m length. tape. Also in Example 2, as in Example 1, good productivity was obtained. (Example 3) A polytetrafluoroethylene film having a thickness of 50 μm was used except for the substrate film (the breaking strength was 4. A wound of the same conductive material film as in Example 1 was obtained, except that 6 kg/mm 2 and a fracture stretch was 305 %. Further, in the same manner as in Example 1, the wound of the film was cut into a width of 1 . 5 mm, which was wound around a core material (reel) having a diameter of 48 mm and a width of 100 mm, which was attached to a side plate, and which was wound in a line shape, and obtained a conductive conductive tape having a length of 300 m. At this time, it is also possible to wind a length of 300 m. (Comparative Example 1) A wound material of the same conductive material film as in Example 1 was obtained, and in the same manner as in Example 1, the wound material of the film was cut into a width of 1. 5mm, wound into the traditional disk in the same round core to obtain the length of the conductive tape of l〇〇m length. When the tape is wound into a coil-shaped conductive material tape to the isoconductive tape automatic crimping machine and supplied to the isoelectric material, the transcription and stretching tests to the isoelectric material are good, however, The number of times the disk is installed is three times that of the embodiment, and the installation time and the adjustment time are increased. The industrial utilization possibilities of the present invention are as follows. As described above, when the invention described in the first application of the patent application is used, the adhesive portion of the adhesive tape is used to adhere the entire end of the adhesive tape-174-200823137 tape (one adhesive tape). And the newly-installed adhesive tape (the other side of the adhesive tape) at the beginning of the implementation of the adhesive plate replacement, it is very simple to put the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the operation of mounting the beginning of the new adhesive tape on the take-up reel, and the setting of the guide pin in a specific path, only The new adhesive plate can be replaced in less time, which can increase the production efficiency of the electronic machine. Since one of the adhesive tapes and the other adhesive tape are adhered by overlapping adhesive faces, there is a high connection strength. In the case of the invention described in the second paragraph of the patent application, in addition to the effects similar to those of the invention described in the first aspect of the patent application, the cutting of the entire adhesive tape is performed when the end mark is exposed, and the cutting is performed. The part that performs the joining operation is easy to unravel and the connection can be performed with the minimum necessary position, and the waste of the adhesive tape can be prevented. When the invention described in the third paragraph of the patent application is applied, the effect of the invention described in the first aspect of the patent application is the same, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. In addition, since the end portion of the adhesive tape which is completely unwound and the beginning end of the newly attached adhesive tape are adhered by the adhesive tape before the adhesive tape, the adhesion between the adhesive tapes can be easily performed. When the invention described in claim 4 is applied, the effect of the invention described in the first aspect of the patent application is the same, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. Can be more -175- 200823137 Renew the adhesive plate, so it can improve the production efficiency of electronic machines. In addition, since the adhesive tape is not required to be folded back, the adhesive tape can be taken up to the take-up reel to prevent possible winding up. According to the invention described in the fifth paragraph of the patent application, since the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are fixed by the locking pin, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. According to the invention described in claim 6, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and thereafter, the other claw portion of the locking member is engaged. At the beginning of the adhesive tape on the other side, the two are connected to each other, so the connection is very easy. Since there is an elastic member between the claw portion of one of the claws and the claw portion of the other, the elastic member can be stretched so that the other claw portion of the locking member is locked at any position of the beginning end portion of the other adhesive tape. Therefore, the connection has a high degree of freedom. In addition, the final part of the adhesive tape and the other end of the adhesive tape are connected to each other without overlapping tape, and the connection can be made with the minimum necessary position to prevent stickiness. Waste of material tape. When the invention described in claim 7 is used, it is only necessary to connect the end portion of the adhesive tape on one side of the clip and the overlapping portion of the other end of the adhesive tape -176-200823137, and the connection operation is easy. . According to the invention described in the eighth aspect of the invention, the holding pieces are flattened from both sides of the overlapping portion to join the two, and the joint strength of the overlapping portion of the adhesive tape can be improved. When the invention described in the ninth patent of the patent application is used, the adhesive portion of the adhesive tape is adhered to the end portion of the used adhesive tape, and the beginning portion of the newly attached adhesive tape is used to carry out the adhesive. The replacement of the plate makes it easy to load the new adhesive plate to the adhesive device. Moreover, since it is not necessary to replace the winding disc of the substrate every time the new adhesive sheet is replaced, and the beginning of the new adhesive material is attached to the take-up reel, it takes only a small time to replace the new adhesive disc, so Improve manufacturing efficiency. When the invention described in claim 10 is the same as the invention described in claim 9, the end portion of one of the adhesive tapes and the other end of the adhesive tape are mutually in contact with each other. A hook-like snap is formed, and the two are connected to each other with an adhesive surface, so that the joint strength is high. When the invention described in the first application of the patent application is the same as the invention described in claim 9 or 10, the terminal portion of the adhesive tape is terminated at the end portion of the adhesive tape. Part of the job is easy to unravel and prevent the waste of adhesive tape. In addition to the effects of the invention described in any one of claims 9 to 11, the invention has the same effect as the invention described in any one of claims 9 to 11. At the same time, the strength of the stretching direction of the adhesive tape (longitudinal -177-200823137) of the joint portion can be increased. When the invention described in claim 13 is the same as the invention described in any one of the items 9 to 11 of the patent application, the connecting portion forms a through hole and a through hole. The inner edge will have an adhesive oozing out, which can increase the adhesion area of the adhesive and further increase the joint strength. When using the invention described in the Patent Application No. 14 item, it is only necessary to connect the used adhesive tape (one adhesive tape) and the new adhesive tape (the other adhesive tape) to replace the disk. It is very simple to load the new adhesive tray to the adhesive unit. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the adhesive tape is installed on the guide member, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The treatment agent used for the treatment of the adhesive tape is a lanthanum resin, and the adhesive tape is also a ruthenium adhesive, which can reduce the surface tension difference between the two to improve the adhesion, so that it is practically difficult to achieve both. Sticky. When the invention described in the fifteenth aspect of the patent application is used, the surface tension of the adhesive surface of the adhesive tape and the treatment of the substrate of the adhesive tape are treated in addition to the same effects as the invention described in claim 14 of the patent application. The difference in surface tension is l〇mN/m (10dyne/cm) or less, and a strong force can be obtained, and both can be surely adhered. When the invention described in the fifteenth aspect of the patent application is used, the adhesion is 10 〇g/25 mm or more, in addition to the effect similar to the invention described in claim 15 of the patent application. The adhesion of the two adhesive faces of the adhesive tape of one side and the other is stronger. When the invention described in claim 17 is used, it has the same effect as the invention described in claim 16 of the patent application, and the adhesive tape of one side and the other is connected by both sides, so that it can be made stronger. The connection. In the case of the invention described in claim 18, since the adhesive tape of the double-sided adhesive is used, the adhesive tape of the two sides is sandwiched between the adhesive tape of one of the other and the adhesive tape of the other (or Closely, so the connection between the two is very simple and easy. When the invention described in claim 19 is used, since the end portion of the adhesive tape which has been completely rolled out and the beginning end portion of the newly attached adhesive tape are fixed by a paste-like resin adhesive, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. When the invention described in claim 20 is the same as the invention described in claim 19, the resin-based adhesive can be made of a thermosetting resin, a photocurable resin, and heat. In the group of metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected, so that the joint strength between the adhesive tapes can be improved. When the invention described in the second paragraph of the patent application is applied, the filling device for supplying the resin-179-200823137 adhesive described in the No. 19 or 20 of the patent application scope is disposed in the adhesive device, and the charging device is not required to be separately prepared. Therefore, it can prevent the waste of connection work. In the case of the invention described in claim 22, when the adhesive tape wound around one of the rolls is completely unwound, the adhesive tape wound around the adjacent roll is attached to the take-up reel, and the adhesive is applied. The replacement of the tape, because it is not necessary to put the new adhesive tape on the adhesive device. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved. In the case of the invention described in claim 23, in addition to the effect similar to the invention described in claim 22, the end portion of the adhesive tape and the other adhesive tape are joined by a connecting tape. Since the adhesive tape of the adhesive tape of one of the adhesive tapes is completely unwound, the adhesive tape of the other roll portion is not required to be attached to the disk, so that the production efficiency of the electronic device can be further improved. When the invention described in claim 24 is used, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive tape is sequentially unwound from the next roll. . Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. When the invention described in claim 25 is applied, the connection portion between the end portion of the adhesive tape and the other end portion of the adhesive tape is covered by the adhesive tape, so that the appearance is good. At the same time, it can prevent the bonding part of the card from contacting the adhesive tape and damage the adhesive tape-180-200823137 tape or adhesive device. According to the invention described in claim 26, the connecting portion detecting means detects the connecting portion, and when the connecting portion passes through the pressing portion, the adhesive tape of one side is taken up to the take-up reel to prevent the connecting portion. The problem of the pressing action when the part reaches the pressing part. Further, since the connecting portion passes through the pressing portion, since one of the adhesive tapes is automatically taken up to the take-up reel, the trouble of winding can be omitted. When the invention described in claim 27 is used, the detection of the joint portion can be performed with a simple configuration, in addition to the same effects as those of the invention described in claim 26, and these means can be utilized. Improve detection accuracy. When the invention described in claim 29 is used, since a plurality of adhesives can be used one by one in order, the amount of adhesive which can be used in one disk can be increased to a conventional one without increasing the number of tapes. More than 2 times. Since the number of rolls is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to adhesion of the adhesive tape from the width direction of the tape, and also to prevent the tape from being formed. The substrate is long and prone to stretching and other disadvantages (damage or breakage of the substrate). Since the manufacturing unit of the electronic component can reduce the number of replacement of the new adhesive tape, the work efficiency can be improved. Further, in the manufacture of the adhesive tape, since the number of the manufactured disks can be reduced, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in claim 30 is applied, the effect is the same as that of the invention described in claim 29, and -181 - 200823137 is easily separated by the adjacent adhesive strips. It is possible to perform separation one by one, and it is easier to press the circuit board. When the invention described in the third paragraph of the patent application is used, it is only necessary to form a slit on the adhesive applied to the entire surface of the substrate, in addition to the effect similar to the second aspect of the patent application. It is very easy, and the gap between adjacent adhesive strips is small, so that the number of adhesive strips disposed on the substrate can be increased. When the invention described in the third paragraph of the patent application is applied, it is easy to manufacture the adhesive tape described in claim 30 of the patent application. When the invention described in the third paragraph of the patent application is applied, since two adhesive tapes can be simultaneously produced, it has good manufacturing efficiency. When the invention described in the Patent Application No. 34 is applied, the adhesion of the adhesive is reduced by the partial adhesive and pressed against the circuit substrate, and the adhesive tape is used on one side of the substrate. If the adhesive is completely applied, the adhesive tape can be directly manufactured by using the existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating area, so that the adhesive width of the pressing has a high degree of freedom. It is the same as the invention described in claim 29, because the adhesive on the substrate is heated and pressed to the circuit substrate one by one, and one plate can be used without increasing the number of tapes. The dose is increased by more than 2 times. Since the adhesive amount can be increased without increasing the number of rolls, the same as the invention described in claim 29, the roll-up can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive and the stretching of the substrate can be prevented. Disadvantages. -182- 200823137 The width of the adhesive tape of Article 35 of the patent application range has one side of the circuit board plus the adhesive amount, and at the same time, the adhesive glue is reduced because it does not need to increase the winding amount of the adhesive tape, thereby preventing the coiling from being scattered. At the same time, it is damaged or broken. Moreover, since the number of times of tape replacement by the electronic component can improve the manufacturing efficiency, the amount of the adhesive tape can be reduced, and the amount of the disk and the moisture preventing material can be reduced. It is separated from the adjacent adhesive strips described in item 35 of the patent application, and it is easy to separate and carry out the pressing. The number of adhesive strips on the substrate is the same as that of the third paragraph of the patent application, and the number of the adhesive strips on the substrate is the same as that of the application. Patented adhesive tape, so it has good manufacturing efficiency. In addition to the 35th item to the 3rd item of the patent application scope, it is very simple to press the adhesive agent to improve the operation of the manufacturing process of the electronic component, because the adhesion is adhered. The length of the above, so the number of rolls can be increased. The number can be greatly increased, and the adhesion can be prevented, and the substrate manufacturing plant can reduce the new adhesive rate. Since the amount of the adhesive per one disk is increased, it is possible to reduce the effect of manufacturing the carrier, and in addition to having the same effect, when the adhesive is peeled off from the substrate one by one, in addition to the fruit, It is easier to add configuration. In the invention of the invention, it is effective to use the invention described in the item 36 of the scope of the invention in addition to any one of the circuit boards described above. -183-200823137 When using the invention described in claim 40, in addition to the effects described in Items 35 to 37 of the patent application, it is not necessary to rotate the circuit board, and it is only necessary to move one of the adhesive tapes and The position of the adhesive tape on the other side makes it easy to press the adhesive onto the periphery of the circuit board, so that it has good work efficiency. According to the invention described in the fourth aspect of the patent application, when the adhesive is pressed around the circuit board, the adhesive tape is heated and pressurized in the width direction, and the adhesive can be easily pressed. To the circuit board, and have good work efficiency. Moreover, since it is only necessary to apply the adhesive to the adhesive tape in its entirety, it is possible to directly manufacture the adhesive tape using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. Moreover, the invention is the same as the invention described in claim 35, because the amount of the adhesive is increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive can be prevented, and Prevents the effects of defects such as stretching of the substrate. When applying the invention described in the 42nd paragraph, at least two adhesives disposed in the width direction of the adhesive sheet are used one by one, and at least two discs can be used per one tray, without increasing the number of adhesive tape rolls. , you can greatly increase the amount of adhesive that can be used in one set. Moreover, since the number of the adhesive tape is not increased, the winding can be prevented from being scattered, and at the same time, the adhesive can be prevented from clogging due to the adhesion of the adhesive tape from the width of the tape -184-200823137 In addition, it is also possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or breakage of the substrate). In the form of an adhesive tape cassette, it is not necessary to carry out the complicated operation of attaching the adhesive tape to the disc on the adhesive device, and the cartridge is attached to the adhesive device, which is easier to handle and has a good installation. And the replacement workability. When the invention described in claim 43 is used, in addition to the same effect as the invention described in claim 42, the adjacent adhesive strips are separated and can be easily removed from the substrate. Pull the adhesive one by one and apply pressure. When the invention described in claim 44 is applied, in addition to the same effect as the fourth item of the patent application range, the adhesive tape only needs to be completely coated on one side of the substrate to form a gap, thereby manufacturing. Very easy. When the invention described in claim 45 is used, since the adhesive tape only needs to be completely applied to the substrate, the adhesive tape can be directly produced by using the existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressing region, so that the adhesive width of the pressing has a high degree of freedom. When the invention described in claim 46 is used, the invention is the same as the invention described in the first application of the patent application, except that it has the same effect as the application of claim 45, because the number of windings is increased without increasing the number of rolls. · 200823137 The dose is taken, so that the coiling can be prevented from being scattered, and at the same time, the effect of preventing the clogging caused by the oozing of the adhesive and preventing the disadvantage caused by the stretching of the substrate can be obtained. When using, when all the 1 disk is rolled out, just reverse the box, so it is very easy to install the next time. Due to the box form, it is easier to handle and has good installation and replacement workability. When the invention described in claim 47 is applied, the end portion of the adhesive tape which is completely unwound is adhered to the substrate of the adhesive tape, and the beginning end of the newly attached adhesive tape is used to perform the replacement of the adhesive disk. Therefore, it is very simple to put the new adhesive plate to the adhesive device. Moreover, it is not necessary to replace the take-up reel when replacing the new adhesive sheet, and to install the new adhesive sheet at the beginning of the new adhesive tray to the take-up reel, and it takes only a small time to replace the new adhesive disc, thereby improving Production efficiency of electronic machines. When the invention described in the 48th application of the patent application has the same effect as the invention described in claim 47, since the hot melt layer is located on the surface of the substrate, the adhesive surface at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. When the invention described in claim 49 is used, the hot melt layer is prevented from being exposed to the hot melt layer by being sandwiched between the support layers, in addition to the effects similar to those of the invention described in claim 47. Under the atmosphere, it is possible to prevent moisture from adhering to moisture or dust, and the adhesion strength of the hot melt layer is lowered. -186- 200823137 When using the invention described in claim 50, the surface of the substrate is removed by the release agent, and the adhesive tape of the adhesive tape is adhered to the adhesive tape. The end portion of the adhesive tape and the newly-installed adhesive tape are used to replace the adhesive disc, so that the new adhesive disc can be attached to the adhesive device. In the case of the invention described in the fifth paragraph of the patent application, the plasma discharge, the ultraviolet irradiation, and the laser irradiation are used in addition to the effects similar to those of the invention described in the fifth aspect of the patent application. By removing the release agent, the release agent can be removed correctly in a short time. In the invention described in claim 5, the adhesive tape is provided with a plurality of roll portions (rolled portions) of the adhesive tape on which the adhesive tape is wound on the disk, among the plurality of rolls When the adhesive tape of one roll is completely unwound, the roll portion of the other roll portion which is used and which is completely rolled out is used, because it is not necessary to put the new adhesive tape on the adhesive device, only The replacement work of the new adhesive tape is required, so that the production efficiency of the electronic machine can be improved. Further, since the plurality of adhesive tapes are sequentially used, it is possible to greatly increase the amount of adhesive which can be used for one replacement operation without increasing the number of rolls of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. In the case of the invention described in the fifth paragraph of the patent application, the accommodating portion of the desiccant is disposed on the side plate of the disk, and the effect is the same as the invention described in the 52nd item of the patent application-187-200823137, 尙The moisture in the adhesive tape tray can be surely removed from the inside, so that the adhesive tape can be further prevented from being deteriorated due to moisture absorption. When the invention described in claim 54 is applied, the cover member covering the periphery of the adhesive tape wound around the disk is detachably attached to the disk, and the adhesive tape is not directly exposed. Under the atmosphere, it can prevent dust or atmospheric moisture from adversely affecting the adhesive tape. Therefore, even when a plurality of rolls are provided, the cover member is disposed on the unused roll portion, and the quality of the adhesive tape can be prevented from being lowered. Moreover, since the cover member is detachably attached, the adhesive member tape can be simply unwound from the adhesive tape by removing the cover member, and when the invention described in claim 55 is used, In addition to the same effects as the invention described in any one of claims 5 to 5, since the crucible can be unwound from the pull-out opening of the cover member, it is not necessary to remove the adhesive tape. The cover member of the disc can be rolled out of the adhesive tape directly from the adhesive tape. In the case of the invention described in claim 56, the invention has the same effect as the invention described in any one of claims 5 to 5, because the side plate of the roll is freely detachable. When the adhesive tapes of the one side of the roll are all rolled out, and the other part of the roll is unwound, the adhesive tape can be rolled out from the next roll in order, and the patent application scope is utilized. In the case of the invention described in the paragraphs 5 to 5, the invention has the same effect as the invention described in any one of the items of the invention, in particular, the adhesive tape is to be used for connection. The adhesive tape and the adhesive tape which are applied to the substrate by the electrode for the electrode connection adhesive are a support substrate for fixing the lead frame, a support substrate for mounting the semiconductor element, or a connection between the wafer and the semiconductor element of the lead frame. It is especially useful when bonding tape. According to the invention described in claim 59, the casing is held by one hand, the opening of the adhesive tape is exposed to press against the circuit board, and the heating member is heated and pressed from the substrate side to press the adhesive. It is very small and can be operated with one hand, and it is easy to press the adhesive to a part of the substrate. According to the invention described in claim 60, since the base material of the adhesive tape is a metal film or an aromatic polyamide film, even when the thickness of the substrate is thin, the substrate can be prevented from being stretched or broken. . Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, when the adhesive tape of the present invention is used, since the number of rolls per one disk can be increased, the manufacturing unit of the electronic component only needs to perform a small number of replacements of the new adhesive tape, so that work efficiency can be improved. Secondly, in the manufacture of the adhesive tape, the number of manufactured disks can be reduced, and the amount of the disk and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in the sixth paragraph of the patent application is applied, in addition to the effects similar to those of the invention described in claim 60, a thin and high tensile strength adhesive tape can be obtained. In the case of the invention described in claim 62, the tensile strength of the substrate is preferably 30 MPa or more, in addition to the effects similar to those of the invention described in claim 60 or 61. The problem of stretching or breaking of the substrate occurs. When the invention described in claim 63 is used, the thickness ratio of the substrate to the adhesive is 0, except that it has the same effect as the invention described in any one of claims 60 to 62. 0 1~1. In addition, 尙 can obtain a thin and high tensile strength adhesive tape. When the invention described in claim 64 is used, the surface roughness Rmax of the substrate is 0, except for the same effect as the invention described in any one of claims 60 to 63. Below 5 μπι, the surface of the substrate is very smooth, and when the adhesive is pressed against the circuit substrate, the adhesive is easily separated from the substrate. When the invention described in claim 65 is applied, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are superimposed one step before the adhesive is formed on the covering to obtain a desired adhesive. After the thickness of the agent, an adhesive is formed on the covering, so that the thickness of each adhesive tape is thin. Although the number of the adhesive tape is increased, the winding diameter of the adhesive tape per one disk is smaller. Therefore, the number of rolls of the adhesive tape per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the productivity of the electronic machine can be improved. When the invention described in claim 66 is used, the number of the adhesive tapes requiring low temperature management and the transportation of the adhesive tape can be reduced, in addition to the effects of the invention described in the -190-200823137 and the scope of the patent application. And custody can implement more efficient management. When the invention described in any one of the items 67 to 72 of the patent application is used, since the member to be connected has good transcription property (adhesiveness) and good connection reliability, and the scrap rate in the improvement step, In the case of improving the workability, the conventional rectangular-oriented conductive tape is provided, so that productivity and workability can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the connection between the adhesive sheets in the method of joining the adhesive tapes of the first embodiment. Fig. 2A and Fig. 2B are oblique views of the connecting step of the connecting portion of Fig. 1. Fig. 3 is a schematic view showing the step of pressing the adhesive of the adhesive device. Fig. 4 is a cross-sectional view showing adhesion between circuit boards. Figure 5 is a step diagram of a method of manufacturing an adhesive tape. Fig. 6 is a perspective view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 7 is a perspective view showing a method of connecting an adhesive tape according to a modification of the second embodiment of the present invention. 8A to C are views showing a method of connecting an adhesive tape according to a first embodiment, Fig. 8A is a perspective view showing a connection between the adhesive sheets, and Fig. 8B is a connection method of a connecting portion of Fig. 8A. Oblique view, Fig. 8C is a plan view of the connecting portion of Fig. A of -191 - 200823137. Fig. 9 is a cross-sectional view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 10 is a cross-sectional view showing a method of joining an adhesive tape according to a third embodiment of the present invention. Fig. 1 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. Fig. 2 is a perspective view showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 2 is a perspective view showing a connection between the adhesive sheets, and Fig. 2B is a connection portion of Fig. 2A. An oblique view of the connection method. Fig. 3 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Fig. 14 is a cross-sectional view showing a method of connecting an adhesive tape according to a third embodiment of the present invention, and Fig. 14 is a state before heating and pressurization, and Fig. 4B is heating and pressing. After the state. Fig. 15 is a plan view showing a method of connecting an adhesive tape according to a fourth embodiment of the present invention, and Fig. 15 is a cross-sectional view, and Fig. 5B is a plan view. Fig. 16 is a view showing a method of connecting the adhesive tape of the first embodiment, and Fig. 6 is a perspective view showing the connection between the adhesive sheets, and Fig. 6 is a diagram of Fig. 16. An oblique view of the connecting portion (b) of A. Fig. 17 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Fig. 18 is a cross-sectional view showing the method of attaching the adhesive tape of the third embodiment of the present invention to -192-200823137. Fig. 19 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. 20A to C are views showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 20A is a perspective view showing a connection between the adhesive sheets, and Fig. 20B and a connection portion of Fig. 20A. A cross-sectional view of the connection method. Figure 21 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 22A to Fig. 4C are diagrams showing the adhesive tape of the first embodiment, Fig. 22A is a perspective view of the adhesive tape tray, Fig. 22B is a front view of Fig. 22, and Fig. 22 is a Fig. 23 is a plan view of the adhesive tape of Fig. A. Fig. 23 is a schematic view of the adhesive pressing step of the adhesive device. Figure 24 is a plan view of a connecting tape according to a second embodiment of the present invention. Figure 25 is a plan view of a connecting tape according to a third embodiment of the present invention. Fig. 26 is a perspective view of a tape of an adhesive tape according to a fourth embodiment of the present invention. . Fig. 27 is a perspective view of the adhesive tape of the first embodiment, Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is a front view of Fig. 27, and Fig. 27C Fig. 27 is a cross-sectional view of the connecting portion of Fig. A. Fig. 28 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 29 is a perspective view showing the state of use of the adhesive of the PDP. -193- 200823137 Figure 30 is a perspective view of an adhesive tape tray according to a second embodiment of the present invention. Figure 31A is a cross-sectional view of an adhesive tape when the adhesive tape of the adhesive tape of the present invention is applied to a semiconductor device of the LOC structure. Fig. 31B is an adhesive tape of the adhesive tape of the present invention. A cross-sectional view of a semiconductor device of the LOC structure applied to a semiconductor device of the LOC structure. 32A to C are schematic views of an adhesive device for applying an adhesive tape tray of the present invention, Fig. 32A is a front view, Fig. 32B is a side view, and Fig. 32C is a 32#Fig. B adhesive material An enlarged view of an important part of the tape punching and attaching portion 89. Fig. 3A is a perspective view of the adhesive tape, and Fig. 3A is a perspective view of the disk around which the adhesive tape is wound, and Fig. 33B is a cross-sectional view taken along line A-A of Fig. 33A. Figure 34 is a perspective view showing the state of use of the adhesive of the PDP. Fig. 5 is a cross-sectional view showing a step of applying an adhesive to a substrate. Fig. 3 is a cross-sectional view showing an adhesive tape according to a second embodiment of the present invention. Fig. 37 is a step view showing a pressure-sensitive adhesive tape and a method of pressing the same according to a third embodiment of the present invention. Fig. 3A is a flow chart showing a method of producing an adhesive tape according to a fourth embodiment of the present invention. Fig. 39A and Fig. B are adhesive tape diagrams, Fig. 39A is a perspective view of a disk wrapped with adhesive tape, and Fig. 39B is viewed from the side of the adhesive-194-200823137, see Fig. 39A. Plan view of the adhesive tape. Figure 40 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 4 is a schematic view showing an adhesive pressing step of the adhesive device according to the second embodiment of the present invention. 42A to C are cross-sectional views showing an adhesive tape according to a third embodiment of the present invention. Fig. 43 is a flow chart showing the steps of the adhesive tape and the method of pressing the same according to the fourth embodiment of the present invention. Fig. 44 is a flow chart showing a method of producing an adhesive tape according to a fifth embodiment of the present invention. Fig. 45 is a perspective view of the adhesive tape cartridge according to the first embodiment of the present invention, Fig. 45A is a perspective view of the adhesive tape cartridge, and Fig. 45B is a cross-sectional view taken along line A-A of Fig. 45A. Fig. 46 is a cross-sectional view showing the mounting state of the disc cartridge of Fig. 45A. Figure 47 is a front elevational view of the adhesive pressing step of the adhesive device. Fig. 4 is a step diagram of a method of manufacturing an adhesive tape cassette. Fig. 49 is a schematic view showing the step of adhering the adhesive to the adhesive device according to the second embodiment of the present invention. Fig. 5 is a cross-sectional view showing an adhesive tape according to a third embodiment of the present invention. Fig. 5 is a step diagram showing an adhesive tape and a method of pressing the same according to a fourth embodiment of the present invention. Fig. 52 is a perspective view of the adhesive tape of the first embodiment, and Fig. 195-200823137 52 is a perspective view showing the connection between the adhesive sheets, and Fig. 52B is the connection portion of Fig. 52A. Sectional view. Fig. 5 is a cross-sectional view showing the adhesive tape of the second embodiment. Fig. 5 is a cross-sectional view showing the connecting step of the connecting portion of Fig. 5 to Fig. 5, Fig. 54A is a state before discharge, Fig. 54B is a state after discharge, and Fig. 54 is a connecting portion of Fig. C The heat is pressed against the map. Fig. 5 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method. Figure 56 is a schematic view of the adhesive pressing step of the adhesive device. 57A to C are the adhesive tape tray diagrams of the first embodiment, and Fig. 7A is a perspective view of the adhesive tape tray, and Fig. 7B is a front view of Fig. 57, Fig. 57. Front view of the cover member of Fig. 57, Fig. A, Fig. 58 is a step view showing a method of manufacturing the adhesive tape tray. Fig. 5 is a side elevational view showing the adhesive tape tray of the second embodiment of the present invention. Fig. 60 is a front view of the adhesive tape tray and a replacement explanatory view of the adhesive tape according to the third embodiment of the present invention. Fig. 61 is a perspective view showing a side plate of a winding portion according to a fourth embodiment of the present invention. Fig. 62 is a perspective view of the first embodiment of the present invention, Fig. 62 is a perspective view of the adhesive, and Fig. 62B is a cross-sectional view taken along line A-A of Fig. 62A. Fig. 63 is a side view for explaining the method of use of the adhesive-196-200823137 shown in Figs. 62A and 62B. Fig. 64 is a step diagram of the manufacturing method of the adhesive. Fig. 65 is a perspective view of the adhesive tape of the first embodiment. Fig. 65A is a perspective view of the adhesive tape wound around the disk, and Fig. 65A is a cross-sectional view taken along line A-A of Fig. 65A. Fig. 66 is a plan view showing the steps of forming the adhesive material of the adhesive tape according to the first embodiment, and Fig. 66 is a view showing that the adhesive tapes are stacked one on another and one of the substrates is taken up to the take-up reel. A schematic diagram of the steps, Fig. 66B is a cross-sectional view of the overlapping portion between the adhesives of Fig. 66A. Figure 67 is a schematic view showing the steps of the adhesive device forming an adhesive on the covering. Fig. 6 is a perspective view of the disk around which the adhesive tape is wound. Fig. 69 is a cross-sectional view showing the steps of forming the adhesive material of the adhesive tape of the second embodiment, and Fig. 69B is a cross-sectional view showing the adhesion between the circuit boards using the adhesive material of Fig. 69A. Fig. 70 is a schematic view showing a form of supply of a two-layer structure to a different-conductive conductive tape of the present invention. Fig. 7 is a schematic view showing a form of supply of a three-layer structure of the present invention to a different-conductive conductive tape. [Main component comparison table] 1 : Adhesive tape 2 : Coil 2a : Coil - 197 - 200823137 2b : Adhesive tape 2c : Adhesive tape 3 : Disk 3 a · · Disk 5 : Reel 7 : Side plate 7a : side plate 7b: side plate 8: cover member 9: base material 9 a : base material 9 b : base material 1 干燥: desiccant 1 1 : film-like adhesive 1 1 a : adhesive 1 1 b : adhesive 1 2 : accommodating portion 1 3 : conductive particles 1 5 : bonding device 16 : guiding member 1 7 : winding disk 1 9 : heating and pressing head 2 1 : circuit substrate 2 1 a : electrode - 198 - 200823137 22 : guide pin 2 3 : Wiring circuit 2 3 a : Electrode 24 : Polytetrafluoroethylene material 25 : Winding machine 2 6 : PDP 27 : Coater 2 8 : End mark 2 9 : Drying furnace 3 0 : End portion 3 1 : Winding Machine 3 2 : Starting end portion 3 3 : Cutting machine 3 4 : Overlapping portion 3 5 : Slit 3 6 : Table 4 1 : Connecting tape 43 : Adhesive 44 : Concavo-convex 46 : Engagement pin 47 : Clamping member 4 8 : claw portion 49 : claw portion 50 : elastic member - 199 200823137 51 : claw 5 3 : clip 5 5 : holding piece 5 6 : mold 5 7 : mold 58 : unevenness 5 9 : through hole 60 : adhesive tape 61 : 矽 Adhesive tape 62 : 矽 Adhesive 6 3 : Substrate 64 : Tree Grease adhesive 65: Filling machine 6 6 : Heater 67 : Connecting tape 6 8 : Notched portion 6 9 : Mark 70 : Mark 71 : Light-emitting portion 72 : Light-receiving portion 74 : Connecting portion 75 : Cutting 7 6 : Card stopper 77: thickness detecting sensor-200 200823137 78: support film 79: control device 80: adhesive layer 8 1 : adhesive film for semiconductor 82: semiconductor element 83: lead frame 8 4: sealing material 8 5 : Welding wire 8 6 : Bus bar 8 7 : Punching die 88 : Lead frame conveying portion 89 : Adhesive tape punching and attaching portion 90 : Heater portion 9 1 : Adhesive tape tape 92 : Adhesive tape 93 : Adhesive material Tape roll-out roller 94: Adhesive tape 95: Male die 96: Female die 97: Film press plate 9 8: Slit 99: Housing 99a: Half-shell 99b: Half-shell - 201 - 200823137 100 : 101 : 102 : 103 : 104 : 105 : 106 : 107 : 108 : 110 : 111 : 113 : 114 : 115 : 116 : 117 : 118 : 119 : 120 : 121 : Adhesive tape box guides gap cohesion reduction line table discharge machine pull The outlet shaft cap is fitted with the fitting portion, the opening portion, the heating member, the electric heating plate, the gear, the gear unit, and the third Housing power switch