JP2004211018A - Adhesive tape, method of producing adhesive tape and compression adhesion method for the same - Google Patents

Adhesive tape, method of producing adhesive tape and compression adhesion method for the same Download PDF

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JP2004211018A
JP2004211018A JP2003002093A JP2003002093A JP2004211018A JP 2004211018 A JP2004211018 A JP 2004211018A JP 2003002093 A JP2003002093 A JP 2003002093A JP 2003002093 A JP2003002093 A JP 2003002093A JP 2004211018 A JP2004211018 A JP 2004211018A
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Japan
Prior art keywords
adhesive
adhesive tape
circuit board
tape
width direction
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JP2003002093A
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JP4333140B2 (en
Inventor
Masahiro Arifuku
征宏 有福
Isao Tsukagoshi
功 塚越
Yasushi Goto
泰史 後藤
Naoki Fukushima
直樹 福嶋
Masami Yusa
正己 湯佐
Toshiyuki Yanagawa
俊之 柳川
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Priority to JP2003002093A priority Critical patent/JP4333140B2/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020067012929A priority patent/KR100700438B1/en
Priority to KR1020097017836A priority patent/KR100970800B1/en
Priority to KR1020087012294A priority patent/KR20080064886A/en
Priority to KR1020077011959A priority patent/KR20070063606A/en
Priority to KR1020107007008A priority patent/KR20100041890A/en
Priority to PCT/JP2003/009694 priority patent/WO2004011356A1/en
Priority to CN2008102146498A priority patent/CN101417758B/en
Priority to KR1020107001127A priority patent/KR100953011B1/en
Priority to CN2008102146479A priority patent/CN101402423B/en
Priority to KR1020087019045A priority patent/KR20080075565A/en
Priority to CN2009101730706A priority patent/CN101648658B/en
Priority to CN2010102460213A priority patent/CN101905817B/en
Priority to TW097143991A priority patent/TW200913829A/en
Priority to TW092120892A priority patent/TW200409405A/en
Priority to CN201410378540.3A priority patent/CN104152075B/en
Priority to CN2010102345395A priority patent/CN101920863B/en
Priority to CN2008102146483A priority patent/CN101402832B/en
Priority to TW096139425A priority patent/TW200823137A/en
Priority to TW097143988A priority patent/TW200913828A/en
Priority to KR1020067012942A priority patent/KR100690379B1/en
Priority to KR1020087005685A priority patent/KR100981478B1/en
Priority to TW097143987A priority patent/TW200913827A/en
Priority to CN 201110456093 priority patent/CN102556726A/en
Priority to CN2010102345094A priority patent/CN101920862B/en
Publication of JP2004211018A publication Critical patent/JP2004211018A/en
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Publication of JP4333140B2 publication Critical patent/JP4333140B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape that can increase the amount of an adhesive without increase of the rolling number of the adhesive tape, a method of producing the adhesive tape and compression adhesion method for the adhesive tape. <P>SOLUTION: The adhesive tape 1 allows an electronic part to adhere to a circuit board or allows a circuit board 21 to adhere to another circuit board 23. Simultaneously, the adhesive tape electrically connects between both electrodes 21a, 23a of these circuit boards. In this tape, the base material 9 is coated with an adhesive 11 and wound around a reel and the adhesive 11 is arranged in a plurality of rows in the transverse direction on the tape. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品と回路基板、又は回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続するための接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法に関する。
【０００２】
【従来の技術】
一般に、液晶パネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＬ（蛍光ディスプレイ）パネル、ベアチップ実装などの電子部品と回路基板、回路基板同士を接着固定し且つ両者の電極同士を電気的に接続する方法として、接着剤テープが用いられている。
特許文献１には、基材に接着剤が塗布された接着剤テープをリール状に巻き取ったものが開示されている。
この種の従来の接着剤テープは、幅が１〜３ｍｍ程度であり、リールに巻き取るテープの長さは５０ｍ程度である。そして、回路基板の四周に接着剤を圧着する場合には、接着剤テープを回路基板の一辺に沿って引き出して接着剤を圧着し、これを回路基板の四周に対して行って、回路基板の四周に接着剤を圧着している。
【０００３】
【特許文献１】
特開２００１−２８４００５号公報
【０００４】
【発明が解決しようとする課題】
しかし、近年のＰＤＰ等におけるパネル画面の大型化にともない回路基板の接着面積（周囲一辺の寸法）が増大し、一度に使用する接着剤の使用量が増加してきた。また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、上述した電子機器の製造工場では、接着剤テープを巻いたリールの交換頻度が多くなり、リールの交換には手間がかかるため電子機器の生産効率の向上が図れなくなるという問題がある。
かかる問題に対して、リールに巻き取る接着剤テープの巻き数を多くすることで、１リール当りの接着剤量を増やし、リールの交換頻度を低減することが考えられるが、接着剤テープのテープ幅が１〜３ｍｍと狭いため、巻き数を多くすると巻き崩れが生じるおそれがある。また、巻き数を多くするとテープ状に巻いた接着剤テープに作用する圧力が高くなり接着剤がテープの両幅から染み出してブロッキングの原因になるおそれがある。
そこで、本発明は、接着剤テープの巻き数を多くすることなく、接着剤量を増やすことができる接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法の提供を目的とする。
【０００５】
【課題を解決するための手段】
前記課題を解決するために、請求項１に記載された発明は、基材に接着剤が塗布され、リール状に巻いた接着剤テープであって、接着剤テープの幅は回路基板の一辺の長さと同じ以上であり、接着剤はテープの幅方向に複数条配置されていることを特徴とする。
この請求項１に記載の発明では、接着剤テープをその幅が回路基板の一辺に重なるように配置し、接着剤テープの幅方向に設けた接着剤の一条をそのまま回路基板の一辺に沿って加熱加圧する。
接着剤テープの幅は回路基板の一辺の長さと同じ以上であるから、接着剤テープは接着剤の条幅だけ引き出して用いればよい。
そして、回路基板の一辺に接着剤を圧着後、回路基板を回して、他辺を接着剤テープの幅方向に位置させ接着剤条を他辺に加熱加圧する。このようにして、順次回路基板の他辺にも接着剤を圧着すれば、回路基板の四周に容易に接着剤を圧着できる。
したがって、回路基板の一辺の長さ以上を有する接着剤を順次一条づつ使用するので、一回の使用量は接着剤条の幅寸法分だけであるから、接着剤テープの巻き数を増やすことなく、１リールで使用可能な接着剤量を大幅に増やすことができる。
しかも、接着剤テープの巻き数を増やすことがないから、巻き崩れを防止できるとともに、接着剤がテープの幅方向に染み出して巻かれているテープ同士が接着するブロッキングを防止でき、更に、基材が長くなることにより生じ易い基材の伸び等の弊害（基材の損傷や切断）を防止できる。
一方、電子部品の製造工場では、新しい接着剤テープの交換回数が少なくて済むので、製造効率が高まる。
また、接着剤テープの製造においては、１リール当りの接着剤量を多くできるので、リール材や湿気防止材の使用量を削減でき、製造コストを低減できる。
接着剤は、絶縁性接着剤中に導電粒子を分散した異方導電性接着剤であってもよいし、絶縁性接着剤のみであってもよいし、それらの接着剤中に絶縁性のスペーサ粒子を分散したものであってもよい。
接着剤テープの幅は、回路基板の一辺の寸法以上を有するから、例えば、５ｍｍ〜３０００ｍｍである。また、回路基板の一辺の寸法を有しない接着剤テープであっても接着剤テープの幅方向に複数条、隣接配置することで回路基板の一辺の寸法を有すればよい。この場合、異なる寸法の回路基板へも容易に適応できるため生産効率を向上できる。接着剤の一条の幅は、例えば０．５ｍｍ〜１０．０ｍｍである。
接着剤テープの幅を５ｍｍ〜３０００ｍｍとしているのは、回路基板の一辺の寸法が５ｍｍ未満である場合が少ないからであり、３０００ｍｍより大きくなるとリールの幅が広くなりすぎて、既存の接着装置への装着ができなくなるおそれがある為である。
【０００６】
請求項２に記載された発明は、請求項１に記載された発明において、複数条の接着剤は、互いに隣合う接着剤条が間隔をあけていることを特徴とする。
この請求項２に記載の発明によれば、請求項１に記載の発明と同様な作用効果を奏するとともに、隣合う接着剤条同士が離れているので、接着剤を一条づつ容易に基材から引き離して圧着できる。
【０００７】
請求項３に記載された発明は、請求項１に記載された発明において、接着剤は、テープの幅方向に形成したスリットにより複数条に分離されていることを特徴とする。
この請求項３に記載の発明によれば、請求項１と同様な作用効果を奏するとともに、接着剤テープは基材の片面全面に接着剤を塗布して乾燥したものを用い、接着剤を回路基板に圧着する直前に、即ち、接着剤テープの使用直前に切刃等により接着剤に切れ目を入れてスリットを形成することが好ましい。
尚、スリットは、接着剤テープの製造時に、切刃等で接着剤に切れ目を入れてスリットを形成してもよいし、切刃のほか、レーザや電熱線等により形成するものであってもよい。
本発明によれば、基材上に配置する接着剤条の条数を多くすることができるとともに、テープの幅方向に接着剤を複数条配置する接着剤テープの製造が容易である。
【０００８】
請求項４に記載された発明は、基材に接着剤が塗布され、リール状に巻いた接着剤テープの製造方法であって、一方の基材の全面に接着剤を塗布し、次に接着剤にテープの幅方向に沿ってスリットを形成した後、接着剤面上に他方の基材を配置して一方及び他方の基材で接着剤を挟み、次に一方の基材と他方の基材とを互いに離して一方及び他方の基材のそれぞれに複数条の接着剤を交互に貼着することにより、一方及び他方の基材に複数条の接着剤を間隔をおいて配置したものを製造することを特徴とする。
この請求項４に記載の発明によれば、既存設備を利用して請求項２に記載の接着剤テープを同時に２つ製造できるので、製造効率に優れる。
【０００９】
請求項５に記載された発明は、請求項１〜３のいずれかに記載の接着剤テープを回路基板上に配置し、接着剤テープを幅方向に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着し、接着剤テープを幅方向に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着することを特徴とする接着剤テープの圧着方法である。この圧着方法では、接着剤テープを回路基板上に配置し、接着剤テープを幅方向に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着し、次いで回路基板の位置を変えて回路基板の他辺に接着剤テープをその幅方向に沿って加熱加圧することにより回路基板の他辺に次の接着剤条を圧着することもできる。
この請求項５に記載された発明によれば、請求項１〜３のいずれかに記載の作用効果を得ることができるとともに、接着剤テープを接着装置に装着後、回路基板の一辺を接着剤テープの幅方向に配置して回路基板の一辺に接着剤を圧着し、次に、回路基板を例えば約９０度回して回路基板の他の辺を接着剤テープの幅方向と平行に位置させ、回路基板の他辺に接着剤を圧着する。このように、回路基板を順次９０度回して接着剤を圧着することにより、回路基板の四周に接着剤を簡単に圧着でき、電子部品の製造工場では作業効率を向上できる。
【００１０】
請求項６に記載の発明は、請求項１〜３のいずれかに記載の接着剤テープを回路基板を移動する搬送路に少なくとも２つ配置し、一方の接着剤テープはその幅方向が搬送路に直交する方向に配置し、他方の接着剤テープはその幅方向を搬送路に沿う方向に配置し、一方の接着剤テープにおいて、回路基板の対向する２辺について接着剤テープを幅方向に沿って加熱加圧することにより回路基板の対向する２辺に接着剤条を圧着し、次に回路基板を他方の接着剤テープへ移動し、回路基板の残りの２辺について基材側から接着剤テープを幅方向に沿って加熱加圧することにより、回路基板の四周に接着剤条を圧着することを特徴とする。
この請求項６に記載の発明によれば、請求項１〜３に記載の作用効果を得ることができるとともに、回路基板を回転させることなく、一方の接着剤テープと他方の接着剤テープとの位置に移動して、それぞれの位置で幅方向に沿って加熱加圧することにより、回路基板の四周に容易に接着剤を圧着でき作業効率が良い。
【００１１】
請求項７に記載の発明は、基材の片面全面に接着剤が塗布され、リール状に巻いた接着剤テープを用いて回路基板に接着剤を圧着する接着剤テープの圧着方法であって、接着剤テープの幅は回路基板の一辺の長さ以上を有しており、接着剤テープの幅方向における接着剤の一部を幅方向に加熱加圧することにより加熱した部分の接着剤の凝集力を低下させつつ回路基板に接着剤を圧着することを特徴とする。
この請求項７に記載の発明によれば、回路基板の周囲に接着剤を圧着する場合には、接着装置に接着剤テープを装着し、幅方向に沿って接着剤テープを加熱加圧することにより、その部分の凝集力が低下し（以下「凝集力低下ライン」という）、凝集力低下ラインから加熱した部分の接着剤が基材から離れて回路基板に圧着される。次に、回路基板を約９０度回転して、隣の辺を接着剤テープの幅方向に位置させ、幅方向に沿って次の接着剤条を加熱加圧して、接着剤条を隣の辺に接着剤を圧着する。このようにして、順次回路基板の四辺に接着剤を圧着することができ、作業効率が良い。
また、接着剤テープにはその全面に接着剤を塗布すればよいので、既存設備をそのまま用いて接着剤テープを製造できる。
更に、回路基板に圧着する接着剤の幅は、加熱加圧領域を変えることにより任意に設定でき、圧着する接着剤幅の自由度が高い。
また、請求項１に記載の発明と同様に、巻き数を増加させることなく接着剤量を増加できるので、巻き崩れを防止できるとともに、接着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる等の効果を得ることができる。
【００１２】
【発明の実施の形態】
以下に添付図面を参照しながら本発明の実施の形態について説明するが、まず図１乃至図６を参照して本発明の第１実施の形態について説明する。図１は接着剤テープの図であり、（ａ）は接着剤テープを巻いたリールの斜視図であり、（ｂ）は（ａ）の接着剤テープを接着剤側から見た平面図であり、図２は接着装置における接着剤の圧着工程を示す斜視図であり、図３は回路基板同士の接着を示す断面図であり、図４はＰＤＰにおける接着剤の使用状態を示す斜視図であり、図５は接着剤テープの製造方法を示す工程図である。
本実施の形態にかかる接着剤テープ１はリール３に巻かれたものであり、リール３には巻き芯５と接着剤テープ１の両側に配置した側板７とが設けられている。本実施の形態では、接着剤テープ１は長さが約５０ｍであり、幅Ｗは回路基板の一辺と略同じ寸法の約１５００ｍｍである。
接着剤テープ１は、基材９と、基材９上に塗布された接着剤１１とから構成されており、基材９上には一条の幅が０．５ｍｍの接着剤１１が等間隔をあけて且つテープの幅方向に設けられている。
基材９は、強度及び異方導電材を構成する接着剤の剥離性の面からＯＰＰ（延伸ポリプロピレン）、ポリテトラフルオロエチレン、シリコーン処理したＰＥＴ（ポリエチレンテレフタレート）などを用いるが、これらに制限するものではない。
接着剤１１は、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系、ホットメルト系が用いられている。かかる樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、アクリル系、ビニルエステル系樹脂系、シリコーン樹脂系が用いられる。
【００１３】
接着剤１１には、導電粒子１３が分散されている。導電粒子１３としては、Ａｕ，Ａｇ，Ｐｔ，Ｎｉ，Ｃｕ，Ｗ，Ｓｂ、Ｓｎ，はんだなどの金属粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、プラスチック等の高分子核材等に、前記した導電層を被覆等により形成したものでもよい。さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子や、導電粒子と絶縁粒子の併用等も適用可能である。はんだ等の熱溶融金属や、プラスチック等の高分子核材に導電層を形成したものは、加熱加圧もしくは加圧により変形性を有し、接続後の電極間の距離が減少し、接続時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。
【００１４】
次に、本実施の形態にかかる接着剤テープ１の使用方法について説明する。接着装置１５に接着剤テープ１のリール３と、空リール１７とを装着し、リール３に巻いた接着剤テープ１の先端を空リール１７に取り付け、接着剤テープ１を繰り出す（図２中矢印Ｅ）。そして、回路基板２１上に接着剤テープ１を配置して、両リール３、１７間に配置された加熱加圧ヘッド１９で接着剤テープ１を基材９側から圧接し、一条分の接着剤１１を接着剤テープの幅方向にある回路基板の一辺に圧着し、接着剤１１をその条幅分だけ空リール１７に巻き取る。
次に、回路基板２１を約９０度回転させて、回路基板２１の隣の辺を接着剤テープ１の幅方向に位置させ、加熱加圧ヘッド１９により接着剤１１を回路基板２１の他の辺に圧着する。このように、回路基板２１を約９０度回転させては接着剤１１を圧着させて、回路基板２１の四周に亘って接着剤１１を圧着する。
上記の圧着後（仮接続）、回路基板２１の電極と配線回路（電子部品）２３の電極を位置合わせして本接続する。本接続は、回路基板２１の四周に接着剤１１を圧着後、接着剤１１に配線回路（又は電子部品）２３を配置して、必要によりクッション材として、例えば、ポリテトラフルオロエチレン材２４を介して加熱加圧ヘッド１９により配線回路２３を回路基板２１に加熱加圧する（図３参照）。これにより回路基板２１の電極２１ａと配線回路２３との電極２３ａを接続固定する。
【００１５】
図４に示すように、本実施の形態による接着剤テープ１を用いたＰＤＰ２６の接続部分は、ＰＤＰの周囲全体に亘り接着しており、一度に用いる接着剤１１の使用量が従来に比較して格段に多くなる。しかし、接着剤テープ１の幅Ｗを回路基板２１の一辺の長さＨと略等しくしているから、接着剤テープ１の幅Ｗは広くなるものの従来と同じ巻き数でも接着剤量が従来よりも極めて多くなるので、リールの交換は従来のものより格段に少ない。
ここで、図５及び図６を参照して本実施の形態にかかる接着剤テープ１の製造方法について説明する。
巻出機２５から巻きだされた基材（セパレータ）にコーター２７により、樹脂と導電粒子１３が混合された接着剤１１を塗布し、乾燥炉２９で乾燥した後、巻取機３１で原反を巻き取る。コーター２７は、左右に移動して基材９に等間隔で条状の接着剤を塗布する。巻き取られた接着剤テープの原反は、スリッタ３３により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯に側板７，７が両側から装着されて、あるいは、側板付巻き芯に巻き取られ、除湿材とともに梱包され、好ましくは、低温（−５℃〜−１０℃）に管理されて出荷される。
【００１６】
次に、本発明の他の実施の形態について説明するが、以下に説明する実施の形態では上述した実施の形態と同一の部分には同一の符合を付することによりその部分の詳細な説明を省略し、以下では上述した実施の形態と異なる点を主に説明する。
図６に示す第２実施の形態では、接着装置１５において、接着剤テープ１を２箇所に装着しており、一方の接着剤テープ１及び他方の接着剤テープ１を互いに直交する方向に設けている。そして、一方の接着剤テープ１において回路基板２１の対向する一対の縦辺Ｎに接着剤１１を圧着し（第１工程）、他方の接着剤テープ１において対向する一対の横辺Ｍに接着剤１１を圧着して（第２工程）、２つの工程で回路基板２１の四周に接着剤を圧着するものである。この第２実施の形態では、第１工程と第２工程との間で回路基板２１の向きを回転させることなく、第１工程で載置されている回路基板２１をそのまま第２工程に移動させることにより接着剤の自動圧着が可能となり、さらに作業効率の向上を図ることができる。この場合、回路基板２１を搬送ベルトに載せて自動搬送するものであってもよい。
【００１７】
図７に示す第３実施の形態では、基材の片面全面に幅Ｗで接着剤を塗布しており、基材の幅Ｗ方向に形成したスリット３５により接着剤を幅Ｗ方向に複数条に分離したものである。この第３実施の形態の接着剤テープ１において、スリット３５は、接着装置１５にリール３を装着後で接着剤テープ１を回路基板２１に圧着する直前に形成することが好ましい。この場合、接着装置１５のリール装着部近傍（図２にＳで示す）に切羽を取り付けて巻き出される接着剤テープ１の接着剤１１にスリット３５を形成するものであってもよいし、図５に示す接着剤テープの製造時に仕上げ工程でスリットを形成したものをリールに巻き取ったものであってもよいし、塗工工程において乾燥後巻取機３１で巻き取る直前にスリットを形成しても良い。尚、各場合において切羽は接着剤シート１の幅Ｗ方向に往復動するものであってもよい。
尚、第３実施の形態にかかる接着剤テープ１を接着装置１５で使用するときには、第１実施の形態と同様に、スリット３５で分離された一条ずつの接着剤を基材９側から加熱加圧ヘッドで圧着して、先端側から順次使用していく。
この第３実施の形態では、従来と同様な工程により得られた基材上の接着剤にスリット３５を形成するだけで幅方向に設けた複数条の接着剤１１を得ることができるので、製造が容易である。
【００１８】
図８に示す第４実施の形態では、基材９には接着剤１１が片面全面に塗布されており（図８（ａ））、基材９及び接着剤１１の幅Ｗは上述した実施の形態と同様に回路基板の一辺の長さと略同じ寸法である。そして、使用時には第１実施の形態と同様に装着し、接着剤テープ１の幅Ｗ方向に接着剤の一部（一条分）を加熱加圧することにより（図８（ｂ））、その部分の凝集力を低下させて、加熱加圧した部分の接着剤のみを基材から分離して回路基板２１に圧着する（図８（ｃ））。
この場合、加熱加圧ヘッド１９の周囲ラインに沿って凝集力低下ラインが形成され、加熱加圧された部分のほとんどは接着剤が軟化流動し、（１０００ポイズ以下が目安）、接着剤の硬化反応が開始しないか低位の状態（反応率２０％以下が目安）とすることが好ましく、加熱温度は使用する接着剤系に応じて選定する。
この第３実施の形態によれば、接着剤１１は、使用時にのみ幅Ｗ方向に一条分ずつを軟化流動化させて基板回路に圧着することができる。
また、上述した実施の形態のように接着剤１１にスリット３５を形成したり、複数条分離して設ける必要がなく、幅広の基材の片面全面に接着剤１１を塗布しておくだけなので、接着剤テープの製造が容易である。
【００１９】
図９に示す第５実施の形態は、第１実施の形態にかかる接着剤テープ１の他の製造方法を示すものであり、基材９ａに塗布した接着剤１１にスリット４１を形成した後に（図９（ａ））、接着剤１１を基材９ａ、９ｂで挟むように、接着剤１１の上に他方の基材９ｂを貼着する（図９（ｂ））。次に、一方及び他方の基材９ａ、９ｂを剥がすように分離し、それぞれの基材９ａ、９ｂに一つ置きに接着剤条１１ａ、１１ｂを配置する。この第５実施の形態では、一方及び他方の基材９ａ、９ｂに交互に接着剤条１１ａ、１１ｂが配置するように、一方の基材９ａ又は９ｂ側から接着剤条１１ａ、１１ｂを一つ置きに加熱加圧することにより、接着剤条１１ａ、１１ｂを順次各基材９ａ、９ｂに貼着してもよい。
本発明は、上述した実施の形態に限らず、本発明の要旨を逸脱しない範囲で種種変形可能である。
例えば、上述した実施の形態において、接着剤１１には導電粒子１３を分散していない絶縁性接着剤であってもよい。
【００２０】
【発明の効果】
請求項１に記載の発明によれば、接着剤テープの幅は回路基板の一辺の長さ以上を有しているので、接着剤量を多くしながら、接着剤テープの巻き数を削減することができる。
接着剤テープの巻き数を増やすことなく、使用する接着剤量を大幅に増やすことができるから、巻き崩れを防止できるとともに、ブロッキングや基材の損傷や切断を防止できる。また、電子部品の製造工場では、新しい接着剤テープの交換回数が少なくて済むので、製造効率が高まる。
更に、接着剤テープの製造においては、１リール当りの接着剤量を多くできるので、リール材や湿気防止材の使用量を削減でき、製造コストを低減できる。
請求項２に記載の発明によれば、請求項１に記載の発明と同様な効果を奏するとともに、隣合う接着剤条同士が離れているので、接着剤を一条づつ容易に基材から引き離して圧着できる。
請求項３に記載の発明によれば、請求項１と同様な効果を奏するとともに、基材上に配置する接着剤条の条数を多くすることができるとともに、製造が容易である。
請求項４に記載の発明によれば、既存設備を利用して請求項２に記載の接着剤テープを同時に２つ製造できるので、製造効率に優れる。
請求項５に記載された発明によれば、請求項１〜３のいずれかに記載の効果を得ることができるとともに、回路基板の一辺に接着剤を簡単に圧着でき、電子部品の製造工場における作業効率を向上できる。
請求項６に記載の発明によれば、請求項１〜３に記載の効果を得ることができるとともに、回路基板を回転させることなく、一方の接着剤テープと他方の接着剤テープとの位置に移動して、回路基板の四周に容易に接着剤を圧着でき、作業効率が良い。
請求項７に記載の発明によれば、回路基板の周囲に接着剤を圧着する場合には、幅方向に沿って条状に接着剤テープを加熱加圧することにより、回路基板に接着剤の圧着が容易にでき、作業効率が良い。
また、接着剤テープにはその全面に接着剤を塗布すればよいので、既存設備をそのまま用いて接着剤テープを製造できる。
更に、回路基板に圧着する接着剤の幅は、加熱加圧領域を変えることにより任意に設定でき、圧着する接着剤幅の自由度が高い。
また、請求項１に記載の発明と同様に、巻き数を増加させることなく接着剤量を増加できるので、巻き崩れを防止できるとともに、接着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる等の効果を得ることができる。
【図面の簡単な説明】
【図１】接着剤テープの図であり、（ａ）は接着剤テープを巻いたリールの斜視図であり、（ｂ）は（ａ）の接着剤テープを接着剤側から見た平面図である。
【図２】接着装置における接着剤の圧着工程を示す概略図である。
【図３】回路基板と配線回路（電子部品）との接着を示す断面図である。
【図４】ＰＤＰにおける接着剤の使用状態を示す斜視図である。
【図５】接着剤テープの製造方法を示す工程図である。
【図６】本発明の第２実施の形態であって、接着装置における接着剤の圧着工程を示す概略図である。
【図７】本発明の第３実施の形態にかかる接着剤テープの断面図である。
【図８】本発明の第４実施の形態にかかる接着剤テープ及びその圧着方法を示す工程図である。
【図９】本発明の第５実施の形態にかかる接着剤テープの製造方法を示す工程図である。
【符号の説明】
１．接着剤テープ、
３．リール、 ５．巻き芯、 ７．側板、
９、９ａ、９ｂ．基材、 １１、１１ａ、１１ｂ．接着剤、
１３．導電粒子、 １５．接着装置、 １７．空リール、
１９．加熱加圧ヘッド、 ２１．回路基板、 ２３．配線回路
２５．巻出機、 ２６．ＰＤＰ、 ２７．コーター、 ２９．乾燥炉、
３１．巻取機、 ３３．スリッタ、 ３５．スリット、 ４１．スリット。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and to electrically connect both electrodes, a method for manufacturing the adhesive tape, and a method for crimping the adhesive tape. .
[0002]
[Prior art]
2. Description of the Related Art In general, a method for bonding and fixing electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare chip to a circuit board and circuit boards and electrically connecting both electrodes to each other is as follows. Adhesive tape is used.
Patent Literature 1 discloses an adhesive tape in which an adhesive is applied to a base material, which is wound in a reel shape.
This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m. Then, when bonding the adhesive around the circuit board, the adhesive tape is pulled out along one side of the circuit board, the adhesive is pressed, and this is performed on the circuit board around the circuit board. Adhesive is crimped around the circumference.
[0003]
[Patent Document 1]
JP 2001-284005 A
[Problems to be solved by the invention]
However, with an increase in the size of a panel screen in a PDP or the like in recent years, the bonding area of the circuit board (dimension of one side) has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in the above-described electronic device manufacturing plant, the frequency of replacing the reel wound with the adhesive tape increases, and the replacement of the reel is troublesome, so that there is a problem that the production efficiency of the electronic device cannot be improved.
To solve this problem, it is conceivable to increase the number of adhesive tapes wound on a reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. Since the width is as narrow as 1 to 3 mm, when the number of windings is increased, winding collapse may occur. Further, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
Therefore, an object of the present invention is to provide an adhesive tape capable of increasing the amount of adhesive without increasing the number of windings of the adhesive tape, a method of manufacturing the adhesive tape, and a method of crimping the adhesive tape.
[0005]
[Means for Solving the Problems]
In order to solve the above problem, an invention according to claim 1 is an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, and the width of the adhesive tape is one side of a circuit board. The length is equal to or longer than the length, and a plurality of adhesives are arranged in the width direction of the tape.
According to the first aspect of the present invention, the adhesive tape is arranged so that the width thereof overlaps one side of the circuit board, and one strip of the adhesive provided in the width direction of the adhesive tape is directly applied along one side of the circuit board. Heat and press.
Since the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, the adhesive tape may be drawn out by the width of the adhesive and used.
Then, after bonding the adhesive to one side of the circuit board, the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape, and the adhesive strip is heated and pressed to the other side. In this manner, if the adhesive is sequentially pressed on the other side of the circuit board, the adhesive can be easily pressed on the four circumferences of the circuit board.
Therefore, since the adhesive having the length of one side or more of the circuit board is sequentially used one by one, the amount used at one time is only the width of the adhesive strip, without increasing the number of turns of the adhesive tape. First, the amount of adhesive usable on one reel can be greatly increased.
In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent winding collapse and prevent the adhesive from leaking out in the width direction of the tape and blocking the wound tapes from adhering to each other. It is possible to prevent adverse effects such as elongation of the base material (damage or cutting of the base material), which are likely to occur due to the longer material.
On the other hand, in an electronic component manufacturing plant, the number of times of replacement of a new adhesive tape is reduced, so that the manufacturing efficiency is improved.
Further, in the production of the adhesive tape, the amount of adhesive per reel can be increased, so that the amount of the reel material and the moisture prevention material used can be reduced, and the production cost can be reduced.
The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, an insulating adhesive alone, or an insulating spacer in those adhesives. Particles may be dispersed.
Since the width of the adhesive tape is equal to or larger than the dimension of one side of the circuit board, it is, for example, 5 mm to 3000 mm. Further, even if the adhesive tape does not have the dimension of one side of the circuit board, it may have the dimension of one side of the circuit board by arranging a plurality of strips adjacent to each other in the width direction of the adhesive tape. In this case, the production efficiency can be improved because it can be easily adapted to circuit boards of different dimensions. One width of the adhesive is, for example, 0.5 mm to 10.0 mm.
The reason why the width of the adhesive tape is set to 5 mm to 3000 mm is that the dimension of one side of the circuit board is less than 5 mm in many cases. This is because there is a possibility that the device cannot be mounted.
[0006]
The invention described in claim 2 is characterized in that, in the invention described in claim 1, the plurality of adhesives are such that adhesives adjacent to each other are spaced apart.
According to the second aspect of the present invention, the same effect as that of the first aspect of the invention can be obtained, and the adjacent adhesive strips are separated from each other. Can be separated and crimped.
[0007]
The invention described in claim 3 is characterized in that, in the invention described in claim 1, the adhesive is separated into a plurality of strips by slits formed in the width direction of the tape.
According to the third aspect of the present invention, the same operation and effect as those of the first aspect are obtained, and the adhesive tape is formed by applying an adhesive to the entire surface of one side of the base material and drying the adhesive tape. It is preferable that a slit is formed by making a cut in the adhesive with a cutting blade or the like immediately before pressure bonding to the substrate, that is, immediately before using the adhesive tape.
The slit may be formed by cutting the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape to form the slit, or in addition to the cutting blade, may be formed by a laser, a heating wire, or the like. Good.
According to the present invention, it is possible to increase the number of adhesive strips arranged on a base material, and it is easy to manufacture an adhesive tape in which a plurality of adhesive strips are arranged in the width direction of the tape.
[0008]
The invention described in claim 4 is a method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, wherein the adhesive is applied to the entire surface of one of the base materials, and then the adhesive is applied. After forming a slit in the tape along the width direction of the tape, place the other base material on the adhesive surface, sandwich the adhesive between one and the other base material, and then use one base material and the other base material. By separating the material from each other and alternately applying a plurality of adhesives to each of the one and the other base materials, a plurality of the adhesives are arranged at intervals on the one and the other base materials. It is characterized by being manufactured.
According to the fourth aspect of the present invention, two adhesive tapes according to the second aspect can be manufactured at the same time using existing equipment, so that the manufacturing efficiency is excellent.
[0009]
According to a fifth aspect of the present invention, one side of the circuit board is provided by disposing the adhesive tape according to any one of the first to third aspects on a circuit board, and heating and pressing the adhesive tape along the width direction. A pressure-sensitive adhesive strip on one side of a circuit board by heating and pressing the adhesive tape along the width direction. In this crimping method, an adhesive tape is placed on a circuit board, and the adhesive tape is crimped on one side of the circuit board by heating and pressing the adhesive tape along the width direction, and then the position of the circuit board is changed. The next adhesive strip can be pressed on the other side of the circuit board by heating and pressing an adhesive tape on the other side of the circuit board along the width direction.
According to the invention described in claim 5, the operation and effect according to any one of claims 1 to 3 can be obtained, and after attaching the adhesive tape to the bonding device, one side of the circuit board is bonded with the adhesive. The adhesive is pressed on one side of the circuit board by arranging in the width direction of the tape, and then the circuit board is turned, for example, about 90 degrees to position the other side of the circuit board in parallel with the width direction of the adhesive tape, An adhesive is pressed on the other side of the circuit board. As described above, by sequentially turning the circuit board by 90 degrees and pressing the adhesive, the adhesive can be easily pressed on the four circumferences of the circuit board, and the working efficiency can be improved in an electronic component manufacturing factory.
[0010]
According to a sixth aspect of the present invention, at least two adhesive tapes according to any one of the first to third aspects are disposed on a transport path for moving a circuit board, and one of the adhesive tapes has a width direction corresponding to the transport path. And the other adhesive tape is arranged so that its width direction is along the conveyance path. In one adhesive tape, the adhesive tape is applied along the width direction on two opposing sides of the circuit board. The adhesive strip is pressed against the two opposing sides of the circuit board by heating and pressing, and then the circuit board is moved to the other adhesive tape, and the adhesive tape is applied to the other two sides of the circuit board from the base material side. Is heated and pressurized along the width direction, so that the adhesive strip is pressure-bonded to the four circumferences of the circuit board.
According to the invention described in claim 6, it is possible to obtain the functions and effects described in claims 1 to 3, and to rotate the one adhesive tape and the other adhesive tape without rotating the circuit board. By moving to the position and applying heat and pressure along the width direction at each position, the adhesive can be easily pressed on the four circumferences of the circuit board, and the work efficiency is good.
[0011]
The invention according to claim 7 is a method for crimping an adhesive tape, in which an adhesive is applied to one entire surface of a base material and the adhesive is pressure-bonded to a circuit board using an adhesive tape wound in a reel shape, The width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and a portion of the adhesive in the width direction of the adhesive tape is heated and pressurized in the width direction so that the adhesive cohesive force of the heated portion The adhesive is pressure-bonded to the circuit board while reducing the pressure.
According to the seventh aspect of the invention, when the adhesive is pressed around the circuit board, the adhesive tape is attached to the bonding device, and the adhesive tape is heated and pressed along the width direction. Then, the cohesive force of the portion is reduced (hereinafter, referred to as “cohesive force reducing line”), and the adhesive of the portion heated from the cohesive force reducing line is separated from the base material and pressed against the circuit board. Next, the circuit board is rotated by about 90 degrees, the adjacent side is positioned in the width direction of the adhesive tape, and the next adhesive strip is heated and pressed along the width direction, and the adhesive strip is moved to the adjacent side. Press adhesive on. In this way, the adhesive can be sequentially pressed on the four sides of the circuit board, and the working efficiency is good.
Further, since the adhesive may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
Further, the width of the adhesive to be press-bonded to the circuit board can be arbitrarily set by changing the heating / pressing area, and the degree of freedom of the width of the adhesive to be pressed is high.
Further, similarly to the first aspect of the present invention, since the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding and to prevent the blocking due to the exudation of the adhesive and the elongation of the base material. It is possible to obtain effects such as prevention of adverse effects.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a view of an adhesive tape, (a) is a perspective view of a reel around which the adhesive tape is wound, and (b) is a plan view of the adhesive tape of (a) viewed from the adhesive side. FIG. 2 is a perspective view showing a bonding step of the adhesive in the bonding apparatus, FIG. 3 is a cross-sectional view showing the bonding between circuit boards, and FIG. 4 is a perspective view showing a state of using the adhesive in the PDP. FIG. 5 is a process chart showing a method of manufacturing an adhesive tape.
The adhesive tape 1 according to the present embodiment is wound around a reel 3, and the reel 3 is provided with a core 5 and side plates 7 arranged on both sides of the adhesive tape 1. In the present embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 1500 mm, which is almost the same size as one side of the circuit board.
The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the adhesive 11 having a width of 0.5 mm is formed on the base material 9 at regular intervals. The opening is provided in the width direction of the tape.
As the substrate 9, OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), or the like is used from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. Not something.
As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, a vinyl ester type resin type and a silicone resin type as a thermosetting resin type. Can be
[0013]
The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and non-conductive polymers such as glass, ceramics, and plastics. The above-mentioned conductive layer may be formed on a core material or the like by coating or the like. Furthermore, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. A conductive layer formed on a hot-melt metal, such as solder, or a polymer nucleus material, such as plastic, has deformability due to heating and pressurizing or pressurizing, and the distance between the electrodes after connection decreases. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, a softening state can be widely controlled by a connection temperature because it does not show a melting point like solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
[0014]
Next, a method of using the adhesive tape 1 according to the present embodiment will be described. The reel 3 of the adhesive tape 1 and the empty reel 17 are mounted on the adhesive device 15, the tip of the adhesive tape 1 wound on the reel 3 is attached to the empty reel 17, and the adhesive tape 1 is paid out (arrow in FIG. 2). E). Then, the adhesive tape 1 is arranged on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 arranged between the two reels 3 and 17, and the adhesive tape 1 11 is pressed against one side of the circuit board in the width direction of the adhesive tape, and the adhesive 11 is wound around the empty reel 17 by the width of the adhesive tape.
Next, the circuit board 21 is rotated by about 90 degrees so that the side adjacent to the circuit board 21 is positioned in the width direction of the adhesive tape 1, and the adhesive 11 is applied to the other side of the circuit board 21 by the heating / pressing head 19. Crimp to As described above, the adhesive 11 is pressed by rotating the circuit board 21 by about 90 degrees, and the adhesive 11 is pressed by four turns of the circuit board 21.
After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic components) 23 are aligned and permanently connected. In this connection, after bonding the adhesive 11 on the four sides of the circuit board 21, a wiring circuit (or an electronic component) 23 is arranged on the adhesive 11, and if necessary, as a cushion material, for example, via a polytetrafluoroethylene material 24. The wiring circuit 23 is heated and pressed on the circuit board 21 by the heating and pressing head 19 (see FIG. 3). Thus, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected and fixed.
[0015]
As shown in FIG. 4, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is adhered over the entire periphery of the PDP, and the amount of the adhesive 11 used at one time is smaller than that of the conventional one. So much more. However, since the width W of the adhesive tape 1 is substantially equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 is increased, but the amount of the adhesive is larger than that of the related art even with the same number of windings. And the number of reel exchanges is significantly less than that of the conventional reel.
Here, a method of manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIGS.
The adhesive 11 in which the resin and the conductive particles 13 are mixed is applied to the base material (separator) unwound from the unwinder 25 by the coater 27, dried in the drying furnace 29, and then rolled by the winder 31. Take up. The coater 27 moves left and right to apply a strip-shaped adhesive to the base material 9 at regular intervals. The raw material of the wound adhesive tape is cut into a predetermined width by a slitter 33 and wound around a core, and then the side plates 7, 7 are attached to the core from both sides, or a core with a side plate is provided. And is packaged together with a dehumidifying material, and is preferably shipped at a controlled low temperature (−5 ° C. to −10 ° C.).
[0016]
Next, another embodiment of the present invention will be described. In the embodiment described below, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and a detailed description of the portions will be given. The description will be omitted, and the points different from the above-described embodiment will be mainly described.
In the second embodiment shown in FIG. 6, in the bonding device 15, the adhesive tapes 1 are mounted at two places, and one adhesive tape 1 and the other adhesive tape 1 are provided in directions orthogonal to each other. I have. Then, the adhesive 11 is pressure-bonded to the pair of longitudinal sides N of the circuit board 21 in the one adhesive tape 1 (first step), and the adhesive 11 is adhered to the pair of lateral sides M in the other adhesive tape 1. 11 is pressure-bonded (second step), and an adhesive is pressed on the four circumferences of the circuit board 21 in two steps. In the second embodiment, the circuit board 21 placed in the first step is moved to the second step without rotating the direction of the circuit board 21 between the first step and the second step. This enables automatic pressure bonding of the adhesive, and further improves the working efficiency. In this case, the circuit board 21 may be placed on a transport belt and automatically transported.
[0017]
In the third embodiment shown in FIG. 7, the adhesive is applied to the entire surface of one side of the base material with a width W, and the adhesive is formed into a plurality of strips in the width W direction by slits 35 formed in the width W direction of the base material. It is separated. In the adhesive tape 1 according to the third embodiment, the slit 35 is preferably formed immediately after the adhesive tape 1 is pressed against the circuit board 21 after the reel 3 is mounted on the bonding device 15. In this case, a slit may be formed in the adhesive 11 of the adhesive tape 1 to be unwound by attaching a face to the vicinity of the reel mounting portion of the adhesive device 15 (indicated by S in FIG. 2). The slit formed in the finishing step at the time of manufacturing the adhesive tape shown in FIG. 5 may be wound on a reel, or the slit may be formed immediately before winding by the winder 31 after drying in the coating step. May be. In each case, the face may reciprocate in the width W direction of the adhesive sheet 1.
When the adhesive tape 1 according to the third embodiment is used in the bonding device 15, the adhesive separated by the slit 35 is heated and applied from the base material 9 side similarly to the first embodiment. Crimping is performed with a pressure head and used sequentially from the tip side.
In the third embodiment, a plurality of adhesives 11 provided in the width direction can be obtained only by forming the slits 35 in the adhesive on the base material obtained by the same process as the conventional method. Is easy.
[0018]
In the fourth embodiment shown in FIG. 8, an adhesive 11 is applied to the entire surface of the base material 9 on one side (FIG. 8A), and the width W of the base material 9 and the adhesive 11 is equal to that of the above-described embodiment. Similar to the form, the dimensions are substantially the same as the length of one side of the circuit board. At the time of use, the adhesive is mounted in the same manner as in the first embodiment, and a part (one strip) of the adhesive is heated and pressed in the width W direction of the adhesive tape 1 (FIG. 8B), whereby The cohesive force is reduced, and only the adhesive at the heated and pressurized portion is separated from the base material and pressed against the circuit board 21 (FIG. 8C).
In this case, a cohesive force reduction line is formed along the peripheral line of the heating / pressing head 19, and the adhesive softens and flows in most of the heated / pressed portions (1000 poise or less is a guide), and the adhesive hardens. It is preferable that the reaction does not start or is in a low state (a reaction rate of 20% or less is a standard), and the heating temperature is selected according to the adhesive system to be used.
According to the third embodiment, the adhesive 11 can be softened and fluidized one by one in the width W direction only at the time of use and can be pressure-bonded to the substrate circuit.
Further, since it is not necessary to form the slits 35 in the adhesive 11 or separate them from each other as in the above-described embodiment, it is only necessary to apply the adhesive 11 on one entire surface of the wide base material. Easy to manufacture adhesive tape.
[0019]
The fifth embodiment shown in FIG. 9 shows another method of manufacturing the adhesive tape 1 according to the first embodiment, and after forming a slit 41 in the adhesive 11 applied to the base material 9a ( (FIG. 9A), the other substrate 9b is adhered on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (FIG. 9B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and adhesive strips 11a and 11b are arranged every other base material 9a and 9b. In the fifth embodiment, one of the adhesive strips 11a and 11b is arranged from one of the bases 9a and 9b so that the adhesive strips 11a and 11b are alternately arranged on one and the other bases 9a and 9b. The adhesive strips 11a and 11b may be sequentially adhered to the respective base materials 9a and 9b by heating and pressing each other.
The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.
For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are not dispersed.
[0020]
【The invention's effect】
According to the first aspect of the present invention, since the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, the number of turns of the adhesive tape can be reduced while increasing the amount of the adhesive. Can be.
Since the amount of adhesive used can be greatly increased without increasing the number of windings of the adhesive tape, it is possible to prevent winding collapse and prevent blocking, damage and cutting of the base material. In addition, in an electronic component manufacturing plant, the number of times of replacement of a new adhesive tape is reduced, so that manufacturing efficiency is improved.
Further, in the production of the adhesive tape, the amount of adhesive per reel can be increased, so that the amount of the reel material and the moisture prevention material used can be reduced, and the production cost can be reduced.
According to the second aspect of the invention, the same effect as the first aspect of the invention is obtained, and the adjacent adhesive strips are separated from each other. Can be crimped.
According to the third aspect of the invention, the same effect as that of the first aspect is obtained, and the number of the adhesive strips arranged on the base material can be increased, and the manufacture is easy.
According to the fourth aspect of the present invention, two adhesive tapes according to the second aspect can be manufactured at the same time using existing equipment, so that the manufacturing efficiency is excellent.
According to the invention described in claim 5, the effects described in any one of claims 1 to 3 can be obtained, and the adhesive can be easily crimped to one side of the circuit board. Work efficiency can be improved.
According to the invention described in claim 6, the effects described in claims 1 to 3 can be obtained, and the position of one adhesive tape and the other adhesive tape can be set without rotating the circuit board. It can be moved and the adhesive can be easily pressed on the four circumferences of the circuit board, and the working efficiency is good.
According to the seventh aspect of the present invention, when the adhesive is pressure-bonded to the periphery of the circuit board, the adhesive tape is heated and pressed in a strip shape along the width direction, so that the adhesive is pressed to the circuit board. Can be done easily and work efficiency is good.
Further, since the adhesive may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
Further, the width of the adhesive to be press-bonded to the circuit board can be arbitrarily set by changing the heating / pressing area, and the degree of freedom of the width of the adhesive to be pressed is high.
Further, similarly to the first aspect of the present invention, since the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding and to prevent the blocking due to the exudation of the adhesive and the elongation of the base material. It is possible to obtain effects such as prevention of adverse effects.
[Brief description of the drawings]
FIG. 1 is a view of an adhesive tape, (a) is a perspective view of a reel around which the adhesive tape is wound, and (b) is a plan view of the adhesive tape of (a) viewed from the adhesive side. is there.
FIG. 2 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
FIG. 3 is a cross-sectional view showing adhesion between a circuit board and a wiring circuit (electronic component).
FIG. 4 is a perspective view showing a use state of an adhesive in a PDP.
FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
FIG. 6 is a second embodiment of the present invention and is a schematic view showing a pressure bonding step of an adhesive in an adhesive device.
FIG. 7 is a sectional view of an adhesive tape according to a third embodiment of the present invention.
FIG. 8 is a process diagram showing an adhesive tape and a pressure bonding method thereof according to a fourth embodiment of the present invention.
FIG. 9 is a process chart showing a method for manufacturing an adhesive tape according to a fifth embodiment of the present invention.
[Explanation of symbols]
1. Adhesive tape,
3. Reel, 5. 6. winding core; Side plate,
9, 9a, 9b. Base material, 11, 11a, 11b. adhesive,
13. 14. conductive particles; Bonding device, 17. Empty reel,
19. Heating and pressing head, 21. Circuit board, 23. Wiring circuit 25. Unwinder, 26. PDP, 27. Coater, 29. drying furnace,
31. Winder, 33. Slitter, 35. Slit, 41. slit.

Claims (7)

基材に接着剤が塗布され、リール状に巻いた接着剤テープであって、接着剤テープの幅は回路基板の一辺の長さと同じ以上であり、接着剤はテープの幅方向に複数条配置されていることを特徴とする接着剤テープ。Adhesive tape applied to the base material and wound in a reel shape, the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and a plurality of adhesives are arranged in the width direction of the tape An adhesive tape characterized by being made. 複数条の接着剤は、互いに隣合う接着剤条が間隔をあけていることを特徴とする請求項１に記載の接着剤テープ。2. The adhesive tape according to claim 1, wherein the adhesive strips adjacent to each other are spaced apart from each other. 3. 接着剤は、テープの幅方向に形成したスリットにより複数条に分離されていることを特徴とする請求項１に記載の接着剤テープ。The adhesive tape according to claim 1, wherein the adhesive is separated into a plurality of strips by slits formed in a width direction of the tape. 基材に接着剤が塗布され、リール状に巻いた接着剤テープの製造方法であって、一方の基材の全面に接着剤を塗布し、次に接着剤にテープの幅方向に沿ってスリットを形成した後、接着剤面上に他方の基材を配置して一方及び他方の基材で接着剤を挟み、次に一方の基材と他方の基材とを互いに離して一方及び他方の基材のそれぞれに複数条の接着剤を交互に貼着することにより、一方及び他方の基材に複数条の接着剤を間隔をおいて配置したものを製造することを特徴とする接着剤テープの製造方法。A method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound into a reel, in which the adhesive is applied to the entire surface of one of the base materials, and then the adhesive is slit along the width direction of the tape. After forming, the other substrate is placed on the adhesive surface, the adhesive is sandwiched between the one and the other substrates, and then the one and the other substrates are separated from each other and the one and the other are separated. An adhesive tape characterized in that a plurality of adhesives are alternately stuck to each of the base materials to produce a plurality of adhesives arranged at intervals on one and the other base material. Manufacturing method. 請求項１〜３のいずれかに記載の接着剤テープを回路基板上に配置し、接着剤テープを幅方向に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着することを特徴とする接着剤テープの圧着方法。The adhesive tape according to any one of claims 1 to 3, which is disposed on a circuit board, and the adhesive tape is pressed on one side of the circuit board by heating and pressing the adhesive tape along the width direction. Adhesive tape compression method. 請求項１〜３のいずれかに記載の接着剤テープを回路基板を移動する搬送路に少なくとも２つ配置し、一方の接着剤テープはその幅方向が搬送路に直交する方向に配置し、他方の接着剤テープはその幅方向を搬送路に沿う方向に配置し、一方の接着剤テープにおいて、回路基板の対向する２辺について接着剤テープを幅方向に沿って加熱加圧することにより回路基板の対向する２辺に接着剤条を圧着し、次に回路基板を他方の接着剤テープへ移動し、回路基板の残りの２辺について基材側から接着剤テープを幅方向に沿って加熱加圧することにより、回路基板の四周に接着剤条を圧着することを特徴とする接着剤テープの圧着方法。At least two adhesive tapes according to any one of claims 1 to 3 are disposed on a transport path for moving a circuit board, and one adhesive tape is disposed in a direction whose width direction is orthogonal to the transport path. The adhesive tape is arranged so that its width direction is along the conveying path, and one of the adhesive tapes is heated and pressurized along the width direction of the adhesive tape on two opposing sides of the circuit board. Adhesive strips are pressed against the two opposing sides, then the circuit board is moved to the other adhesive tape, and the adhesive tape is heated and pressed along the width direction from the base material side for the remaining two sides of the circuit board. A method for crimping an adhesive tape, comprising: crimping an adhesive strip on four sides of a circuit board. 基材の片面全面に接着剤が塗布され、リール状に巻いた接着剤テープを用いて回路基板に接着剤を圧着する接着剤テープの圧着方法であって、接着剤テープの幅は回路基板の一辺の長さ以上を有しており、接着剤テープの幅方向における接着剤の一部を幅方向に加熱加圧することにより加熱した部分の接着剤の凝集力を低下させつつ回路基板に接着剤を圧着することを特徴とする接着剤テープの圧着方法。An adhesive is applied to the entire surface of one side of the base material, and the adhesive tape is pressed on the circuit board using an adhesive tape wound in a reel shape.The width of the adhesive tape is the width of the circuit board. The adhesive has a length of one side or more and is applied to the circuit board while reducing the cohesive force of the adhesive in the heated portion by heating and pressing a part of the adhesive in the width direction of the adhesive tape in the width direction. And a method of crimping an adhesive tape.
JP2003002093A 2002-07-30 2003-01-08 Method for producing adhesive tape Expired - Fee Related JP4333140B2 (en)

Priority Applications (25)

Application Number Priority Date Filing Date Title
JP2003002093A JP4333140B2 (en) 2003-01-08 2003-01-08 Method for producing adhesive tape
CN2010102345395A CN101920863B (en) 2002-07-30 2003-07-30 Method for producing adhesive materials for tapes composed with the same
CN201410378540.3A CN104152075B (en) 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor
KR1020077011959A KR20070063606A (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
KR1020097017836A KR100970800B1 (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
PCT/JP2003/009694 WO2004011356A1 (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape
CN2008102146498A CN101417758B (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus
KR1020107001127A KR100953011B1 (en) 2002-07-30 2003-07-30 Method of producing adhesive material tape
CN2008102146479A CN101402423B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape and adhesive material tape connector
KR1020087019045A KR20080075565A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN2009101730706A CN101648658B (en) 2002-07-30 2003-07-30 Connection method of adhesive material tape and adhesive material connector
CN2008102146483A CN101402832B (en) 2002-07-30 2003-07-30 Adhesive material tape and anisotropic conductive material tape
KR1020067012929A KR100700438B1 (en) 2002-07-30 2003-07-30 Anisotropic electroconductive tape
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape
KR1020087012294A KR20080064886A (en) 2002-07-30 2003-07-30 Adhesive material tape
KR1020107007008A KR20100041890A (en) 2002-07-30 2003-07-30 Adhesive material tape
CN2010102460213A CN101905817B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020067012942A KR100690379B1 (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette
KR1020087005685A KR100981478B1 (en) 2002-07-30 2003-07-30 Connecting structure
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN 201110456093 CN102556726A (en) 2002-07-30 2003-07-30 Bonding material band and production method thereof
CN2010102345094A CN101920862B (en) 2002-07-30 2003-07-30 Crimping connection method of adhesive tapes
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel

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JP2003002093A JP4333140B2 (en) 2003-01-08 2003-01-08 Method for producing adhesive tape

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JP2009081752A Division JP2009188414A (en) 2009-03-30 2009-03-30 Adhesive tape crimping method
JP2009116702A Division JP4692664B2 (en) 2009-05-13 2009-05-13 Adhesive tape crimping method

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JP2007047286A (en) * 2005-08-08 2007-02-22 Matsushita Electric Ind Co Ltd Device and method for sticking anisotropic conductive film
JP2011026619A (en) * 2010-11-08 2011-02-10 Sony Chemical & Information Device Corp Anisotropic conductive film, method for producing anisotropic conductive film, and connecting method and connection structure between electronic members
JPWO2011111784A1 (en) * 2010-03-12 2013-06-27 日立化成株式会社 Adhesive reel
CN114507488A (en) * 2016-10-03 2022-05-17 昭和电工材料株式会社 Conductive film, wound body, connection structure, and method for producing connection structure

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JP2007047286A (en) * 2005-08-08 2007-02-22 Matsushita Electric Ind Co Ltd Device and method for sticking anisotropic conductive film
JPWO2011111784A1 (en) * 2010-03-12 2013-06-27 日立化成株式会社 Adhesive reel
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JP2011026619A (en) * 2010-11-08 2011-02-10 Sony Chemical & Information Device Corp Anisotropic conductive film, method for producing anisotropic conductive film, and connecting method and connection structure between electronic members
WO2012063804A1 (en) * 2010-11-08 2012-05-18 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure
CN102906941A (en) * 2010-11-08 2013-01-30 索尼化学&信息部件株式会社 Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure
CN114507488A (en) * 2016-10-03 2022-05-17 昭和电工材料株式会社 Conductive film, wound body, connection structure, and method for producing connection structure

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