JP2004196540A - Method of connecting adhesive tape - Google Patents

Method of connecting adhesive tape Download PDF

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Publication number
JP2004196540A
JP2004196540A JP2002370622A JP2002370622A JP2004196540A JP 2004196540 A JP2004196540 A JP 2004196540A JP 2002370622 A JP2002370622 A JP 2002370622A JP 2002370622 A JP2002370622 A JP 2002370622A JP 2004196540 A JP2004196540 A JP 2004196540A
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JP
Japan
Prior art keywords
adhesive tape
adhesive
reel
tape
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002370622A
Other languages
Japanese (ja)
Inventor
Toshiyuki Yanagawa
俊之 柳川
Masami Yusa
正己 湯佐
Masahiro Arifuku
征宏 有福
Naoki Fukushima
直樹 福嶋
Yasushi Goto
泰史 後藤
Isao Tsukagoshi
功 塚越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2002370622A priority Critical patent/JP2004196540A/en
Priority to TW096139425A priority patent/TW200823137A/en
Priority to TW097143987A priority patent/TW200913827A/en
Priority to CN 201110456093 priority patent/CN102556726A/en
Priority to CN201410378540.3A priority patent/CN104152075B/en
Priority to KR1020097017836A priority patent/KR100970800B1/en
Priority to TW097143991A priority patent/TW200913829A/en
Priority to KR1020107007008A priority patent/KR20100041890A/en
Priority to PCT/JP2003/009694 priority patent/WO2004011356A1/en
Priority to KR1020087012294A priority patent/KR20080064886A/en
Priority to CN2010102460213A priority patent/CN101905817B/en
Priority to KR1020067012929A priority patent/KR100700438B1/en
Priority to CN2009101730706A priority patent/CN101648658B/en
Priority to KR1020077011959A priority patent/KR20070063606A/en
Priority to KR1020107001127A priority patent/KR100953011B1/en
Priority to CN2008102146483A priority patent/CN101402832B/en
Priority to CNB038180847A priority patent/CN100548840C/en
Priority to TW092120892A priority patent/TW200409405A/en
Priority to CN2010102345094A priority patent/CN101920862B/en
Priority to TW097143988A priority patent/TW200913828A/en
Priority to KR1020087019045A priority patent/KR20080075565A/en
Priority to CN2008102146498A priority patent/CN101417758B/en
Priority to KR1020087005685A priority patent/KR100981478B1/en
Priority to CN2010102345395A priority patent/CN101920863B/en
Priority to KR1020067012942A priority patent/KR100690379B1/en
Priority to CN2008102146479A priority patent/CN101402423B/en
Publication of JP2004196540A publication Critical patent/JP2004196540A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Replacement Of Web Rolls (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of connecting an adhesive tape allowing easy replacement of an adhesive reel to improve the production efficiency of electronic equipment. <P>SOLUTION: In this method of connecting one adhesive tape 1 wound on one reel 3 and the other adhesive tape 1 wound on the other reel 3a, with an electrode connecting adhesive 11 applied to a base material 9 of each adhesive tape, the terminus part 30 of one adhesive tape 1 is turned over to overlap the face of the adhesive 11 of one adhesive tape 1 with the face of the adhesive 11 of the other adhesive tape 1, and the overlap parts of both faces are heat-pressed and connected. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品と回路基板、又は回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続する接着材テープに関し、特にリール状に巻かれた接着材テープの接続方法に関する。
【０００２】
【従来の技術】
一般に、液晶パネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＬ（蛍光ディスプレイ）パネル、ベアチップ実装などの電子部品と回路基板、回路基板同士を接着固定し、両者の電極同士を電気的に接続する方法として、接着材テープが用いられている。
特許文献１には、基材に接着材が塗布された接着材テープをリール状に巻き取ったものが開示されている。
この種の従来の接着材テープは、幅が１〜３ｍｍ程度であり、リールに巻き取るテープの長さは５０ｍ程度である。
接着材テープを接着装置に装着する場合、接着材テープのリール（以下、単に「接着材リールという」）を接着装置に取り付け、接着材テープの始端部を引き出して、巻取りリールに取り付ける。そして、接着材リールから巻き出された接着材テープの基材側から加熱加圧ヘッドで接着剤を回路基板等に圧着し、残った基材を巻取りリールに巻き取っている。
そして、接着材リールの接着材テープが終了すると、終了したリールと、基材を巻き取った巻取りリールを外し、新たな巻取りリールと新たな接着材リールを接着装置に装着し、接着材テープの始端を巻取りリールに取り付けている。
【０００３】
【特許文献１】
特開２００１−２８４００５号公報
【０００４】
【発明が解決しようとする課題】
しかし、近年のＰＤＰ等におけるパネル画面の大型化にともない回路基板の接着面積が増大し、一度に使用する接着剤の使用量が増加してきた。また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、電子機器の製造工場では、接着材リールの交換頻度が多くなり、接着材リールの交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。
かかる問題に対して、リールに巻き取る接着材テープの巻き数を多くすることで、１リール当りの接着剤量を増やし、リールの交換頻度を低減することが考えられるが、接着材テープのテープ幅が１〜３ｍｍと狭いため、巻き数を多くすると巻き崩れが生じるおそれがある。また、巻き数を多くするとテープ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から染み出してブロッキングの原因になるおそれがある。
更に、接着材テープの巻き数を増やすと、リールの径寸法も大きくなり、既存の接着装置に装着し難く、既存の接着装置が使用できなくなるおそれがある。
そこで、本発明は、接着材リールの交換が簡単にでき、電子機器の生産効率の向上を図ることができる接着材テープの接続方法の提供を目的とする。
【０００５】
【課題を解決するための手段】
前記課題を解決するために、請求項１に記載された発明は、電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、一方の接着材テープの終端部を裏返して、一方の接着材テープの接着剤面と他方の接着材テープの接着剤面と重ね合わせ、両者の重ね合わせ部分を加熱圧着して接続することを特徴とする。
この請求項１に記載の発明では、接着材テープの接着剤を利用して巻き出しの終了した接着材テープの終端部と新たに装着する接着材テープの始端部と接着して、接着材リールの交換を行うので、接着装置への新たな接着材テープの装着が簡単にできる。また、新たな接着材テープの交換毎に巻取りテープの交換や新規接着材テープの始端を巻取りリールに取り付ける作業、所定の経路にガイドピン等の設定作業が必要ないので、新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
巻き出しの終了した接着材テープの終端部を裏返し、接着材テープの接着剤面と新たに装着する接着材テープの接着剤面同士を重ね合わせて接着するので、接続強度が高い。
接続部分の加熱圧着は、接着材リールを装着する接着装置の加熱加圧ヘッドを用いれば、接着装置を合理的に利用することができる。
【０００６】
請求項２に記載された発明は、請求項１に記載の発明において、一方の接着材テープの終端部にはエンドマークが付されていることを特徴とする。
この請求項２に記載の発明によれば、請求項１に記載の発明と同様な作用効果を奏するとともに、巻き出しの終了した接着材テープの切断はエンドマークが露出したときに行うことができるので、切断及び接続作業をする部分が解りやすく且つ必要最小限の位置で接続できるので接着材テープの無駄を防止できる。
【０００７】
請求項３に記載された発明は、電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、他方の接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テープの基材面に貼り付けて止めており、一方の接着材テープの終端部を裏返した後、リードテープの接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、重ね合わせ部分を加熱圧着することを特徴とする。
この請求項３に記載の発明によれば、請求項１記載の発明と同様に接着装置への新たな接着材テープの装着が簡単にでき、また新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
更に、接着材テープのリードテープを利用して巻き出しの終了した接着材テープの終端部と新たに装着する接着材テープの始端部と接着するので、接着材テープ同士の接着が簡単にできる。
【０００８】
請求項４に記載された発明は、電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、他方の接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テープの基材面に貼り付けて止めており、リードテープの接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、重ね合わせ部分を加熱圧着することを特徴とする。
この請求項４に記載の発明によれば、請求項１記載の発明と同様に接着装置への新たな接着材テープの装着が簡単にでき、また新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
更に、巻き出しの終了した接着材テープを裏返す必要がないので、巻取りリールに接着材テープを巻き取った際に巻き崩れが生じるおそれを防止できる。
【０００９】
【発明の実施の形態】
以下に添付図面を参照しながら本発明の実施の形態について説明するが、まず図１〜図５を参照して本発明の第１実施の形態について説明する。図１は第１実施の形態にかかる接着材テープの接続方法において、接着材リール同士の接続を示す斜視図であり、図２は、図１における接続部分（Ａ）の接続工程を示す図であり、（ａ）は使用済み接着材テープのエンドテープの切断を示す斜視図、（ｂ）は使用済みの接着材テープを裏返して新たな接着材テープとの接続を示す斜視図、図３は接着装置における接着剤の圧着工程を示す概略図であり、図４は回路基板同士の接着を示す断面図であり、図５は接着材テープの製造方法を示す工程図である。
【００１０】
接着材テープ１はリール３、３ａにそれぞれ巻かれており、各リール３、３ａには巻き芯５と接着材テープ１の両幅側に配置した側板７とが設けられている。
接着材テープ１は、基材９と、基材９の一側面に塗布された接着剤１１とから構成されている。
基材９は、強度及び異方導電材を構成する接着剤の剥離性の面からＯＰＰ(延伸ポリプロピレン)、ポリテトラフルオロエチレン、シリコーン処理したＰＥＴ(ポリエチレンテレフタレート)などを用いるが、これらに制限するものではない。
【００１１】
接着剤１１は、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系、ホットメルト系が用いられている。かかる樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、ビニルエステル系樹脂、アクリル樹脂系、シリコーン樹脂系が用いられる。
【００１２】
接着剤１１には、導電粒子１３が分散されている。導電粒子１３としては、Ａｕ，Ａｇ，Ｐｔ，Ｎｉ，Ｃｕ，Ｗ，Ｓｂ、Ｓｎ，はんだなどの金属粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、プラスチック等の高分子核材等に、前記した導電層を被覆等により形成したものでもよい。
さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子や、導電粒子と絶縁粒子の併用等も適用可能である。はんだ等の熱溶融金属や、プラスチック等の高分子核材に導電層を形成したものは、加熱加圧もしくは加圧により変形性を有し、接続後の電極間の距離が減少し、接続時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。
【００１３】
次に、本実施の形態にかかる接着材テープの使用方法について説明する。図３に示すように、接着装置１５に接着材テープ１のリール３ａと、巻取りリール１７とを装着し、リール３ａに巻いた接着材テープ１の先端をガイドピン２２に掛けて巻取りリール１７に取り付け、接着材テープ１を繰り出す（図３中矢印Ｅ）。そして、回路基板２１上に接着材テープ１を配置して、両リール３ａ、１７間に配置された加熱加圧ヘッド１９で接着材テープ１を基材９側から圧接し、接着剤１１を回路基板２１に圧着する。その後、基材９を巻取りリール１７に巻き取る。
上記の圧着後(仮接続)、回路基板２１の電極と配線回路（電子部品）２３の電極を位置合わせして本接続する。本接続は、図４に示すように、回路基板２１に圧着された接着剤１１に配線回路（又は電子部品）２３を配置して、必要によりクッション材として、例えば、ポリテトラフルオロエチレン材２４を介して加熱加圧ヘッド１９により配線回路２３を回路基板２１に加熱加圧する。これにより回路基板２１の電極２１ａと配線回路２３との電極２３ａを接続する。
本実施の形態による接着材テープ１を用いたＰＤＰは、そのサイズが大きくなっており、ＰＤＰの周囲全体に亘り圧着する場合があり、接続部分が多く、接着剤１１は一度に用いる接着剤１１の使用量が従来に比較して格段に多くなる。したがって、リール３ａに巻いた接着材テープ１の使用量も多くなり、リール３ａに巻いた接着材テープ１は比較的短時間で巻取りリール１７に巻き取られて、リール３ａに巻かれた接着材テープ１のエンドマーク２８が露出される（図１参照）。
【００１４】
本発明の接着材テープの接続方法は、（ａ）巻取りリール１７をそのまま使用し、使用済みの接着材テープ１の巻きが残り少なくなった接着剤テープを交換し、新たな接着剤テープと巻取りリール１７を接続する場合と、（ｂ）巻取りリール１７として使用済みの接着材テープ１の巻きが残り少なくなった接着剤テープを使用し、新たな接着剤テープと巻きが残り少なくなった接着剤テープを接続する場合がある。
（ｂ）の場合、図１に示すように、リール３ａの接着材テープ１に、リール３ａを新たな接着材リール３と交換するため、リール３ａの接着材テープ（一方の接着材テープ）１の終端部３０と、新たな接着材リール３に巻かれた接着材テープ（他方の接着材テープ）１の始端部３２とを接続する。
この接着材テープ１の接続は、図２（ａ）に示すように、使用済みリール３ａの接着材テープ１のエンドマーク２８が露出したときに接着材テープ１のエンドマーク２８付近を切断し（Ｂ）、接着材テープ１の終端部３０を裏返して、接着材テープ１の接着剤１１面を上側にする（図２（ｂ））。そして、使用済みリール３ａの接着材テープ１の終端部３０の接着剤１１面に、新たな接着材リール３の接着材テープ１の始端部３２の接着剤１１面を重ね合わせる（図２（ｂ））。
両者の重ね合わせ部分を、テーブル３４に置き、接着装置１５の加熱加圧ヘッド１９で加熱加圧して接着する。これにより、使用済みのリール３ａに巻かれた接着材テープ１と、新たなリール３に巻かれた接着材テープ１とが接続される。次に、使用済みのリール３ａと新たなリール３を入れ替えて、新たなリール３を接着装置１５に装着する。したがって、巻取りリール１７に接着材テープ１を装着する作業が必要ない。また、接着剤１１面同士を重ね合わせて接着するので、接続強度が高い。
尚、エンドマーク２８は、使用済みリール３ａの接着材テープ１の固定位置から、加熱加圧ヘッド１９までテープを伸ばした位置に付けることが望ましい。この場合、エンドマーク２８の付近を切断すれば、必要最小限の位置で接続できるので接着材テープ１の無駄を防止できる。
この実施の形態では、加熱加圧ヘッド１９を利用しているので、接着剤１１同士の圧着用器具を別途用いることなく、接着材テープ１が巻かれたリール３、３ａの交換ができる。
【００１５】
（ａ）の巻取りリール１７をそのまま使用し、使用済みの接着材テープ１の巻きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、新たな接着剤テープと巻取りリール１７を接続する場合は、使用済みリール３ａの接着材テープ１のエンドマーク２８が露出したときに接着材テープ１のエンドマーク２８付近を切断し、巻取りリール１７側に残った接着材テープの終端部を裏返し、接着剤１１面を上側にする。そして、新たな接着材リール３の接着材テープ１の始端部３２の接着剤１１面を重ね合わせる。両者の重ね合わせ部分を、テーブル３４に置き、接着装置１５の加熱加圧ヘッド１９で加熱加圧して接着する。これにより、巻取りリール１７に巻かれた接着材テープ１と、新たなリール３に巻かれた接着材テープ１とが接続される。これにより、巻取りリール１７では基材９だけを巻き取っているので、接着材リールの数本分を巻き取ることができるので、巻取りリール１７の交換回数を少なくすることができ、作業効率が良い。
【００１６】
ここで、図５を参照して本実施の形態にかかる接着材テープ１の製造方法について説明する。
巻出機２５から巻き出された基材（セパレータ）９にコーター２７により、樹脂と導電粒子１３が混合された接着剤１１を塗布し、乾燥炉２９で乾燥した後、巻取機３１で原反を巻き取る。巻き取られた接着材テープ１の原反は、スリッタ３３により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯に側板７，７が両側から装着されて、あるいは、側板付巻き芯に巻き取られ、除湿材とともに梱包され、低温（−５℃〜−１０℃）に管理されて出荷される。
【００１７】
次に、本発明の他の実施の形態について説明するが、以下に説明する実施の形態では上述した実施の形態と同一の部分には同一の符合を付することによりその部分の詳細な説明を省略し、以下では上述した実施の形態と異なる点を主に説明する。
図６に示す第２実施の形態では、新たな接着材リール３の接着材テープ１の始端部３２に備えてあるリードテープ４１を利用して、新たな接着材リール３の接着材テープ１と使用済みのリール３ａに巻かれた接着材テープ１との接続を行っている。リードテープ４１は基材４５と裏面の接着剤４３面とからなり、新たな接着材リール３の接着材テープ１の始端部３２は、リードテープ４１によりリールに巻き付けてある接着材テープ１の基材９面に貼り付けて止めている。そして、リードテープ４１を基材９面から剥がして、裏返した接着材テープ１の終端部３０の接着剤１１面に重ね合わせる。両者の重ね合わせ部分を、テーブル３４に置き、接着装置１５の加熱加圧ヘッド１９で加熱加圧して接着する。このように、接着材テープ１のリードテープ４１を利用して巻き出しの終了した接着材テープ１の終端部３０と新たに装着する接着材テープ１の始端部３２と接着するので、接着材テープ１同士の接続が簡単である。また、この場合、リードテープ４１の基材４５の裏面側に設けた接着剤４３面は、粘着性があるので裏返した接着材テープ１の終端部３０の接着剤１１面に重ね合わせるだけで接続されるのでこの方法でも良い。
本発明は、上述した実施の形態に限らず、本発明の要旨を逸脱しない範囲で種々変形可能である。
例えば、上述した第２実施の形態において、使用済みのリール３ａに巻かれた接着材テープ１を裏返さずに、図７に示すように新たに装着する接着材テープ１の始端部３２のリードテープ４１を基材９面から剥がして、裏面の接着剤１１面に貼り付け、リードテープ４１を使用済みの接着材テープ１の接着剤１１面に接続して接着装置１５の加熱加圧ヘッド１９で加熱加圧して接着しても良い。この際、巻き出しの終了した接着材テープ１を裏返す必要がないので、巻取りリールに接着材テープ１を巻き取った際に巻き崩れが生じるおそれを防止できる。
さらに、この場合、接着材テープ１の始端部３２のリードテープ４１を基材９面から剥がして、リードテープ４１を使用済みの接着材テープ１の基材９面に接着しても良い。
【００１８】
【発明の効果】
請求項１に記載の発明によれば、接着材テープの接着剤を利用して巻き出しの終了した接着材テープ（一方の接着材テープ）の終端部と新たに装着する接着材テープ（他方の接着材テープ）の始端部と接着して、接着材リールの交換を行うので、接着装置への新たな接着材テープの装着が簡単にできる。また、新たな接着材テープの交換毎に巻取りテープの交換や新規接着材テープの始端を巻取りリールに取り付ける作業、所定の経路にガイドピン等の設定作業が必要ないので、新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
一方の接着材テープと他方の接着材テープとは、接着剤面同士を重ね合わせて接着するので、接続強度が高い。
請求項２に記載の発明によれば、請求項１に記載の発明と同様な効果を奏するとともに、巻き出しの終了した接着材テープの切断はエンドマークが露出したときに行うことができるので、切断及び接続作業をする部分が解りやすく且つ必要最小限の位置で接続できるので接着材テープの無駄を防止できる。
請求項３に記載の発明によれば、請求項１記載の発明の効果と同様に接着装置への新たな接着材テープの装着が簡単にでき、また新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
更に、接着材テープのリードテープを利用して巻き出しの終了した接着材テープの終端部と新たに装着する接着材テープの始端部と接着するので、接着材テープ同士の接着が簡単にできる。
請求項４に記載の発明によれば、請求項１記載の発明の効果と同様に接着装置への新たな接着材テープの装着が簡単にでき、また新しい接着材リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
更に、巻き出しの終了した接着材テープを裏返す必要がないので、巻取りリールに接着材テープを巻き取った際に巻き崩れが生じるおそれを防止できる。
【図面の簡単な説明】
【図１】第１実施の形態にかかる接着材テープの接続方法において、接着材リール同士の接続を示す斜視図である。
【図２】図１における接続部分の接続工程を示す斜視図である。
【図３】接着装置における接着剤の圧着工程を示す概略図である。
【図４】回路基板同士の接着を示す断面図である。
【図５】接着材テープの製造方法を示す工程図である。
【図６】本発明の第２実施の形態における、接着材テープの接続方法を示す斜視図である。
【図７】本発明の第２実施の形態の変形例における、接着材テープの接続方法を示す斜視図である。
【符号の説明】
１．接着材テープ、 ３、３ａ．リール、 ５．巻芯、 ７．側板、
９．基材、 １１．接着剤、 １３．導電粒子、 １５．接着装置、
１７．巻取りリール、 １９．加熱加圧ヘッド、 ２１．回路基板、
２２．ガイドピン、 ２３．配線回路、 ２５．巻出機、
２７．コーター、 ２８．エンドマーク、 ２９．乾燥炉、 ３０．終端部、
３１．巻取機、 ３２．始端部、 ３３．スリッタ、
４１．リードテープ、 ４３．リードテープの接着剤、
４５．リードテープの基材。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other and electrically connecting both electrodes, and particularly to a method for connecting an adhesive tape wound in a reel shape.
[0002]
[Prior art]
2. Description of the Related Art In general, a method for bonding and fixing electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare chip to a circuit board and circuit boards and electrically connecting both electrodes to each other is as follows. Adhesive tape is used.
Patent Literature 1 discloses that an adhesive tape in which an adhesive is applied to a base material is wound in a reel shape.
This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
When the adhesive tape is mounted on the bonding apparatus, a reel of the adhesive tape (hereinafter, simply referred to as “adhesive reel”) is mounted on the bonding apparatus, a starting end of the adhesive tape is pulled out, and mounted on a take-up reel. Then, the adhesive is pressed against a circuit board or the like by a heating / pressing head from the base material side of the adhesive tape unwound from the adhesive reel, and the remaining base material is wound on a take-up reel.
Then, when the adhesive tape on the adhesive reel is completed, the completed reel and the take-up reel on which the base material has been wound are removed, and a new take-up reel and a new adhesive reel are attached to the adhesive device, and the adhesive material is removed. The beginning of the tape is attached to the take-up reel.
[0003]
[Patent Document 1]
JP 2001-284005 A
[Problems to be solved by the invention]
However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing factory, the frequency of exchanging the adhesive reel increases, and it takes time and effort to exchange the adhesive reel. Therefore, there is a problem that the production efficiency of the electronic device cannot be improved.
To solve this problem, it is conceivable to increase the number of adhesive tapes wound on the reel to increase the amount of adhesive per reel and to reduce the frequency of replacing reels. Since the width is as narrow as 1 to 3 mm, when the number of windings is increased, winding collapse may occur. Further, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
Further, when the number of windings of the adhesive tape is increased, the diameter of the reel also increases, and it is difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus may not be used.
Therefore, an object of the present invention is to provide a method of connecting an adhesive tape that can easily replace an adhesive reel and improve the production efficiency of electronic devices.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 has an adhesive for electrode connection applied to a base material, and is wound around one adhesive tape wound on one reel and the other reel. A method of connecting an adhesive tape to connect the other adhesive tape, wherein the end of one adhesive tape is turned over, and the adhesive surface of one adhesive tape and the adhesive surface of another adhesive tape are turned over. , And the two overlapped portions are connected by hot pressing.
According to the first aspect of the present invention, the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are bonded to each other by using the adhesive of the adhesive tape to form an adhesive reel. Replacement, it is easy to attach a new adhesive tape to the bonding apparatus. In addition, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, and set guide pins etc. on a predetermined path each time a new adhesive tape is replaced. The replacement time of the device is reduced, and the production efficiency of the electronic device is increased.
Since the end of the unwound adhesive tape is turned over and the adhesive surface of the adhesive tape and the adhesive surface of the newly attached adhesive tape are overlapped and bonded, the connection strength is high.
The heat bonding of the connecting portion can be rationally used by using the heating and pressing head of the bonding device to which the adhesive material reel is mounted.
[0006]
According to a second aspect of the present invention, in the first aspect of the present invention, an end mark is provided at an end of one of the adhesive tapes.
According to the second aspect of the invention, the same operation and effect as those of the first aspect of the invention can be obtained, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed. Therefore, the cutting and connecting portions can be easily understood and the connection can be made at the minimum necessary position, so that waste of the adhesive tape can be prevented.
[0007]
According to a third aspect of the present invention, one adhesive tape wound on one reel and another adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to the base material, are connected. In the method of connecting the adhesive tape, the starting end of the other adhesive tape is fixed to the base surface of the adhesive tape wound around the reel with a lead tape, and the end of one adhesive tape is terminated. After the part is turned over, the adhesive surface of the lead tape is overlapped with the adhesive surface at the end of one adhesive tape, and the overlapped portion is heat-pressed.
According to the third aspect of the present invention, similarly to the first aspect of the present invention, it is possible to easily attach a new adhesive tape to the bonding apparatus, and it is possible to reduce the time for replacing a new adhesive reel. Increases the production efficiency of electronic equipment.
Furthermore, since the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are bonded to each other using the lead tape of the adhesive tape, the adhesive tapes can be easily bonded to each other.
[0008]
According to the invention described in claim 4, one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to the base material, are connected. In the method of connecting the adhesive tape, the starting end of the other adhesive tape is adhered to the base material surface of the adhesive tape wound around the reel with the lead tape, and the adhesive surface of the lead tape is fixed. The adhesive tape is overlapped on the adhesive surface at the end of the adhesive tape, and the overlapped portion is heat-pressed.
According to the fourth aspect of the present invention, similarly to the first aspect of the present invention, it is possible to easily attach a new adhesive tape to the bonding apparatus, and it is possible to reduce the time for replacing a new adhesive reel. Increases the production efficiency of electronic equipment.
Further, since it is not necessary to turn over the adhesive tape after the unwinding, it is possible to prevent a possibility that the adhesive tape may be broken when the adhesive tape is wound on the take-up reel.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tape according to the first embodiment, and FIG. 2 is a view showing a connection step of a connection portion (A) in FIG. Yes, (a) is a perspective view showing the cutting of the end tape of the used adhesive tape, (b) is a perspective view showing the used adhesive tape turned over and connection with a new adhesive tape, and FIG. FIG. 4 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus, FIG. 4 is a cross-sectional view showing the bonding between circuit boards, and FIG.
[0010]
The adhesive tape 1 is wound around each of the reels 3 and 3a, and each of the reels 3 and 3a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
The adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), or the like in terms of strength and releasability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. Not something.
[0011]
As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acrylic resin type, and a silicone resin type as a thermosetting resin type. Can be
[0012]
The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and non-conductive polymers such as glass, ceramics, and plastics. The above-mentioned conductive layer may be formed on a core material or the like by coating or the like.
Furthermore, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. A conductive layer formed on a hot-melt metal, such as solder, or a polymer nucleus material, such as plastic, has deformability due to heating and pressurizing or pressurizing, and the distance between the electrodes after connection decreases. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, a softening state can be widely controlled by a connection temperature because it does not show a melting point like solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
[0013]
Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15, and the leading end of the adhesive tape 1 wound around the reel 3a is hung on the guide pin 22 to take up the take-up reel. 17, and the adhesive tape 1 is paid out (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 arranged between the two reels 3 a and 17, and the adhesive 11 is applied to the circuit. It is crimped to the substrate 21. Thereafter, the substrate 9 is wound around a take-up reel 17.
After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic components) 23 are aligned and permanently connected. In this connection, as shown in FIG. 4, a wiring circuit (or an electronic component) 23 is arranged on the adhesive 11 which is crimped to the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 is used as a cushion material. The wiring circuit 23 is heated and pressed on the circuit board 21 by the heating and pressing head 19 through the intermediary. Thus, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.
The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded over the entire periphery of the PDP, has many connection portions, and uses the adhesive 11 used at one time. Is significantly increased as compared with the prior art. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound up on the take-up reel 17 in a relatively short time, and the adhesive tape wound on the reel 3a is used. The end mark 28 of the material tape 1 is exposed (see FIG. 1).
[0014]
The method of connecting an adhesive tape according to the present invention comprises the steps of (a) using the take-up reel 17 as it is, replacing the used adhesive tape 1 with a reduced amount of the remaining adhesive tape, and winding the tape with a new adhesive tape. When the take-up reel 17 is connected, (b) a new adhesive tape is used as the take-up reel 17 and a new adhesive tape is used as the take-up reel. Sometimes a tape is connected.
In the case of (b), as shown in FIG. 1, the adhesive tape 1 of the reel 3a (one adhesive tape) is used for replacing the reel 3a with a new adhesive reel 3 for the adhesive tape 1 of the reel 3a. Is connected to the start end 32 of the adhesive tape (the other adhesive tape) 1 wound around a new adhesive reel 3.
As shown in FIG. 2A, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the connection of the adhesive tape 1 is cut around the end mark 28 of the adhesive tape 1 (see FIG. 2A). B), the end 30 of the adhesive tape 1 is turned upside down, and the adhesive 11 surface of the adhesive tape 1 is turned upward (FIG. 2B). Then, the surface of the adhesive 11 at the start end 32 of the adhesive tape 1 of the new adhesive reel 3 is superimposed on the surface of the adhesive 11 at the end 30 of the adhesive tape 1 of the used reel 3a (FIG. 2 (b) )).
The superposed portion of the two is placed on a table 34 and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond the two. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17. Also, since the surfaces of the adhesive 11 are overlapped and bonded, the connection strength is high.
The end mark 28 is desirably attached to a position where the tape is extended from the fixing position of the adhesive tape 1 on the used reel 3a to the heating / pressing head 19. In this case, if the vicinity of the end mark 28 is cut, connection can be made at the minimum necessary position, so that waste of the adhesive tape 1 can be prevented.
In this embodiment, since the heating / pressing head 19 is used, the reels 3 and 3a around which the adhesive tape 1 is wound can be replaced without using a separate device for crimping the adhesives 11 together.
[0015]
(A) Using the take-up reel 17 as it is, replacing the used adhesive tape 1 with a small amount of remaining adhesive tape 1 with a new adhesive tape, and replacing the new adhesive tape and the take-up reel 17 with each other. In the case of connection, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 is cut, and the end of the adhesive tape remaining on the take-up reel 17 side. Is turned over, and the adhesive 11 surface is turned upward. Then, the surface of the adhesive 11 at the start end 32 of the adhesive tape 1 of the new adhesive reel 3 is overlapped. The superposed portion of the two is placed on a table 34 and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond the two. Thereby, the adhesive tape 1 wound on the take-up reel 17 and the adhesive tape 1 wound on a new reel 3 are connected. Thereby, since only the base material 9 is wound on the take-up reel 17, several reels of the adhesive material can be taken up. Therefore, the number of times of changing the take-up reel 17 can be reduced, and work efficiency can be reduced. Is good.
[0016]
Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
The adhesive 11 in which the resin and the conductive particles 13 are mixed is applied to the base material (separator) 9 unwound from the unwinding machine 25 by the coater 27 and dried in the drying furnace 29. Take up the anti. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slitter 33 and wound around a core, and then the side plates 7, 7 are attached to the core from both sides, or the side plate is wound. It is wound around a core, packed with a dehumidifying material, and shipped at a low temperature (−5 ° C. to −10 ° C.).
[0017]
Next, another embodiment of the present invention will be described. In the embodiment described below, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and a detailed description of the portions will be given. The description will be omitted, and the points different from the above-described embodiment will be mainly described.
In the second embodiment shown in FIG. 6, the adhesive tape 1 of the new adhesive reel 3 is combined with the adhesive tape 1 of the new adhesive reel 3 by using the lead tape 41 provided at the starting end 32 of the adhesive tape 1 of the new adhesive reel 3. The connection with the adhesive tape 1 wound on the used reel 3a is performed. The lead tape 41 is composed of a base material 45 and an adhesive 43 on the back surface, and the starting end 32 of the adhesive tape 1 of the new adhesive reel 3 is formed by the base of the adhesive tape 1 wound around the reel by the lead tape 41. It is stuck on 9 surfaces of the material. Then, the lead tape 41 is peeled off from the surface of the base material 9 and superposed on the adhesive 11 surface of the terminal end portion 30 of the adhesive tape 1 turned over. The superposed portion of the two is placed on a table 34 and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond the two. As described above, the end tape 30 of the adhesive tape 1 that has been unwound and the start end 32 of the adhesive tape 1 to be newly mounted are bonded by using the lead tape 41 of the adhesive tape 1. Connection between 1 is easy. In this case, since the adhesive 43 surface provided on the back surface side of the base material 45 of the lead tape 41 is sticky, it is connected only by overlapping the adhesive 11 surface of the terminal end portion 30 of the adhesive tape 1 turned over. This method may be used.
The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.
For example, in the second embodiment described above, the adhesive tape 1 wound around the used reel 3a is not turned upside down, and as shown in FIG. The tape 41 is peeled off from the surface of the base material 9 and attached to the surface of the adhesive 11 on the back surface, and the lead tape 41 is connected to the surface of the adhesive 11 of the used adhesive tape 1 to connect the heating and pressing head 19 of the bonding device 15. May be bonded by heating and pressing. At this time, since it is not necessary to turn over the adhesive tape 1 that has been unwound, it is possible to prevent the possibility that the adhesive tape 1 may be broken when the adhesive tape 1 is wound on the take-up reel.
Further, in this case, the lead tape 41 at the start end 32 of the adhesive tape 1 may be peeled off from the surface of the base material 9 and the lead tape 41 may be adhered to the surface of the base material 9 of the used adhesive tape 1.
[0018]
【The invention's effect】
According to the first aspect of the present invention, the end of the unwound adhesive tape (one adhesive tape) and the newly attached adhesive tape (the other adhesive tape) are finished using the adhesive of the adhesive tape. Since the adhesive reel is replaced by bonding to the starting end of the adhesive tape, it is easy to mount a new adhesive tape on the bonding apparatus. In addition, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, and set guide pins etc. on a predetermined path each time a new adhesive tape is replaced. The replacement time of the device is reduced, and the production efficiency of the electronic device is increased.
One adhesive tape and the other adhesive tape are superposed and adhered to each other with an adhesive surface, so that the connection strength is high.
According to the second aspect of the invention, the same effect as that of the first aspect of the invention can be obtained, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed. Since the cutting and connecting portions are easy to understand and can be connected at the minimum necessary position, waste of the adhesive tape can be prevented.
According to the third aspect of the present invention, it is possible to easily attach a new adhesive tape to the bonding apparatus as in the case of the first aspect of the present invention, and the replacement time of a new adhesive reel is reduced. , Increase the production efficiency of electronic equipment.
Furthermore, since the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are bonded to each other using the lead tape of the adhesive tape, the adhesive tapes can be easily bonded to each other.
According to the fourth aspect of the present invention, it is possible to easily attach a new adhesive tape to the bonding apparatus as in the case of the first aspect of the present invention, and it is possible to reduce the time for replacing a new adhesive reel. , Increase the production efficiency of electronic equipment.
Further, since it is not necessary to turn over the adhesive tape after the unwinding, it is possible to prevent a possibility that the adhesive tape may be broken when the adhesive tape is wound on the take-up reel.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a connection between adhesive reels in a method for connecting an adhesive tape according to a first embodiment.
FIG. 2 is a perspective view showing a connecting step of a connecting portion in FIG.
FIG. 3 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
FIG. 4 is a cross-sectional view showing adhesion between circuit boards.
FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
FIG. 6 is a perspective view illustrating a method of connecting an adhesive tape according to a second embodiment of the present invention.
FIG. 7 is a perspective view showing a method of connecting an adhesive tape in a modified example of the second embodiment of the present invention.
[Explanation of symbols]
1. Adhesive tape, 3, 3a. Reel, 5. Core, 7. Side plate,
9. 10. a substrate; Adhesive, 13. 14. conductive particles; Bonding equipment,
17. Take-up reel, 19. Heating and pressing head, 21. Circuit board,
22. Guide pin, 23. Wiring circuit, 25. Unwinder,
27. Coater, 28. End mark, 29. Drying oven, 30. Termination,
31. Winder, 32. Start end, 33. Slitter,
41. Lead tape, 43. Lead tape adhesive,
45. Base material for lead tape.

Claims (4)

電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、一方の接着材テープの終端部を裏返して、一方の接着材テープの接着剤面と他方の接着材テープの接着剤面と重ね合わせ、両者の重ね合わせ部分を加熱圧着して接続することを特徴とする接着材テープの接続方法。An adhesive tape connecting method in which an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel is connected to the other adhesive tape wound on the other reel. Invert the end of one adhesive tape, overlap the adhesive surface of one adhesive tape with the adhesive surface of the other adhesive tape, and heat-press and connect the overlapped portion of both. Characteristic adhesive tape connection method. 一方の接着材テープの終端部にはエンドマークが付されていることを特徴とする請求項１に記載の接着材テープの接続方法。2. The method for connecting an adhesive tape according to claim 1, wherein an end mark is attached to an end portion of one of the adhesive tapes. 電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、他方の接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テープの基材面に貼り付けて止めており、一方の接着材テープの終端部を裏返した後、リードテープの接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、重ね合わせ部分を加熱圧着することを特徴とする接着材テープの接続方法。An adhesive tape connecting method in which an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel is connected to the other adhesive tape wound on the other reel. The other end of the adhesive tape is attached to the base surface of the adhesive tape wound around the reel with a lead tape, and is stopped. After the end of one adhesive tape is turned over, the lead tape is bonded. A method for connecting an adhesive tape, wherein the adhesive surface is overlapped with the adhesive surface at the end of one adhesive tape, and the overlapped portion is heated and pressed. 電極接続用の接着剤が基材に塗布された、一方のリールに巻いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法であって、他方の接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テープの基材面に貼り付けて止めており、リードテープの接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、重ね合わせ部分を加熱圧着することを特徴とする接着材テープの接続方法。An adhesive tape connecting method in which an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel is connected to the other adhesive tape wound on the other reel. The other end of the adhesive tape is attached to the base surface of the adhesive tape wound around the reel with a lead tape and fixed, and the adhesive surface of the lead tape is bonded to the end of one adhesive tape. A method for connecting an adhesive tape, wherein the adhesive tape is superimposed on a surface of an agent and the superimposed portion is heat-pressed.
JP2002370622A 2002-07-30 2002-12-20 Method of connecting adhesive tape Pending JP2004196540A (en)

Priority Applications (26)

Application Number Priority Date Filing Date Title
JP2002370622A JP2004196540A (en) 2002-12-20 2002-12-20 Method of connecting adhesive tape
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN 201110456093 CN102556726A (en) 2002-07-30 2003-07-30 Bonding material band and production method thereof
CN201410378540.3A CN104152075B (en) 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor
KR1020097017836A KR100970800B1 (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020107007008A KR20100041890A (en) 2002-07-30 2003-07-30 Adhesive material tape
PCT/JP2003/009694 WO2004011356A1 (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape
KR1020087012294A KR20080064886A (en) 2002-07-30 2003-07-30 Adhesive material tape
CN2010102460213A CN101905817B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape
KR1020067012929A KR100700438B1 (en) 2002-07-30 2003-07-30 Anisotropic electroconductive tape
CN2009101730706A CN101648658B (en) 2002-07-30 2003-07-30 Connection method of adhesive material tape and adhesive material connector
KR1020077011959A KR20070063606A (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
KR1020107001127A KR100953011B1 (en) 2002-07-30 2003-07-30 Method of producing adhesive material tape
CN2008102146483A CN101402832B (en) 2002-07-30 2003-07-30 Adhesive material tape and anisotropic conductive material tape
CNB038180847A CN100548840C (en) 2002-07-30 2003-07-30 The method of attachment of adhesive material tape connector and adhesive material tape
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape
CN2010102345094A CN101920862B (en) 2002-07-30 2003-07-30 Crimping connection method of adhesive tapes
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020087019045A KR20080075565A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN2008102146498A CN101417758B (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus
KR1020087005685A KR100981478B1 (en) 2002-07-30 2003-07-30 Connecting structure
CN2010102345395A CN101920863B (en) 2002-07-30 2003-07-30 Method for producing adhesive materials for tapes composed with the same
KR1020067012942A KR100690379B1 (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette
CN2008102146479A CN101402423B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape and adhesive material tape connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002370622A JP2004196540A (en) 2002-12-20 2002-12-20 Method of connecting adhesive tape

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2007213986A Division JP4349450B2 (en) 2007-08-20 2007-08-20 Adhesive tape connection method and adhesive tape connector
JP2007213991A Division JP2007331949A (en) 2007-08-20 2007-08-20 Adhesive reel

Publications (1)

Publication Number Publication Date
JP2004196540A true JP2004196540A (en) 2004-07-15

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JP2002370622A Pending JP2004196540A (en) 2002-07-30 2002-12-20 Method of connecting adhesive tape

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
JP2006165219A (en) * 2004-12-07 2006-06-22 Fuji Mach Mfg Co Ltd Filmlike tape feeder
JP2008156424A (en) * 2006-12-21 2008-07-10 Shibaura Mechatronics Corp Acf tape-sticking device, acf tape-pasting device and acf tape-sticking method
WO2008126376A1 (en) * 2007-03-30 2008-10-23 Panasonic Corporation Working device, adhesive tape applying device, and method of adding tape member
US7875138B2 (en) 2007-10-03 2011-01-25 Panasonic Corporation Adhesive tape applying apparatus and tape splicing method
CN111224305A (en) * 2020-01-13 2020-06-02 上海申远高温线有限公司 Joint method for teflon lapped insulating wire lapping tape
JP2020092966A (en) * 2018-12-14 2020-06-18 出光ユニテック株式会社 Zipper tape, and manufacturing method and manufacturing apparatus of bag with zipper tape

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Publication number Priority date Publication date Assignee Title
JP2006165219A (en) * 2004-12-07 2006-06-22 Fuji Mach Mfg Co Ltd Filmlike tape feeder
JP4628765B2 (en) * 2004-12-07 2011-02-09 富士機械製造株式会社 Film tape feeder
JP2008156424A (en) * 2006-12-21 2008-07-10 Shibaura Mechatronics Corp Acf tape-sticking device, acf tape-pasting device and acf tape-sticking method
WO2008126376A1 (en) * 2007-03-30 2008-10-23 Panasonic Corporation Working device, adhesive tape applying device, and method of adding tape member
JPWO2008126376A1 (en) * 2007-03-30 2010-07-22 パナソニック株式会社 Working device, adhesive tape attaching device, and method for adding tape member
JP4514829B2 (en) * 2007-03-30 2010-07-28 パナソニック株式会社 Working device, adhesive tape attaching device, and method for adding tape member
CN101652303B (en) * 2007-03-30 2012-02-01 松下电器产业株式会社 Working device, adhesive tape applying device, and method of adding tape member
US7875138B2 (en) 2007-10-03 2011-01-25 Panasonic Corporation Adhesive tape applying apparatus and tape splicing method
JP2020092966A (en) * 2018-12-14 2020-06-18 出光ユニテック株式会社 Zipper tape, and manufacturing method and manufacturing apparatus of bag with zipper tape
CN111224305A (en) * 2020-01-13 2020-06-02 上海申远高温线有限公司 Joint method for teflon lapped insulating wire lapping tape

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