200913828 九、發明說明 明所屬之技術領域】 本發明係關係電子構件及電路基板、或電 黏著固定、以及實施兩者之電極間之電性連接 帶'其連接方法、製造方法、壓著方法、黏著 黏著裝置、黏著劑膠帶盒、及使用其之黏著劑 尤其是，和捲成盤狀之黏著材膠帶、其連接方法 法、壓著方法、黏著材膠帶盤、黏著裝置、黏著 、使用其之黏著劑壓著方法、及向異導電材膠帶 【先前技術】 —般而言，液晶面板、PDP(電娥顯示面板 螢光顯示）面板、裸晶片封裝等之電子構件及電 或電路基板間之黏著固定、以及兩者之電極間的 手段’係採用黏著材膠帶。 日本特開200 1 ·284005號公報，係記載著將 布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度 盤之膠帶的長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上 著材膠帶之始端部並裝設至捲取盤。其次，從自 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著 電路基板等上’再以捲取盤捲取殘餘之基材。 基板間之 黏著材膠 膠帶盤、 著方法， 、製造方 劑膠帶盒 相關。 )、EL ( 路基板、 電性連接 在基材塗 ，捲取至 膠帶之盤 ^拉出黏 黏著材盤 劑壓著至 -6- 200913828 其次，黏著材盤之黏著材膠帶用完時’拆下用完之盤 、及捲取基材之捲取盤’將新捲取盤及新黏者材盤裝者於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 【發明內容】 近年來，隨著PDP等之面板畫面之大型化’電路基板 之黏著面積（或周圍之一邊尺寸）亦增大’ 一次使用之黏 著劑的使用量亦增加。又，因爲黏著劑用途之擴大’黏著 劑之使用量亦增加。因此，電子機器之製造工廠之黏著材 盤的更換更爲頻繁，因爲黏著材盤之更換十分麻煩，故有 無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 的捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率’然而’因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm ’若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大’可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，本發明之目的係在提供一種黏著材膠帶之連接 方法、钻者材膠帶、其製造方法、壓著方法、黏著材膠帶 盤、黏著裝置、黏著劑膠帶盒、使用其之黏著劑壓著方法 、及向異導電材膠帶，使黏著材盤之更換十分簡單，且可 200913828 提高電子機器之生產效率。 申請專利範圍第1項記載之發明’係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠帶 之終端部反折，使一方之黏著材膠帶之黏著劑面及另一方 之黏著材膠帶之黏著劑面重疊，並實施兩者之重疊部份的 加熱壓著使其連接。 此申請專利範圍第1項記載之發明時，係利用黏著材 膠帶之黏著劑來黏著全部捲出之黏著材膠帶之終端部、及 新裝著之黏著材膠帶之始端部，實施黏著材盤之更換，故 很簡單即可將新黏著材膠帶裝著至黏著裝置。又，因爲無 需在每次更換新黏著材膠帶時都更換捲取膠帶、將新黏著 材膠帶之始端裝設至捲取盤之作業、以及在特定路徑設定 導引銷等之作業，只需要較少時間即可更換新黏著材盤， 故可提高電子機器之生產效率。 因係將全部捲出之黏著材膠帶之終端部反折，並將黏 著材膠帶之黏著劑面及新裝著之黏著材膠帶之黏著劑面重 疊黏者’故具有較局之連接強度。 連接部份之加熱壓著若採用裝著著黏著材盤之黏著裝 置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第2項記載之發明，係如申請專利範圍 第1項記載之發明，其特徵爲，一方之黏著材膠帶之終端 部標示著結束標記。 200913828 此申請專利範圍第2項記載之發明時，除了具有和申 請專利範圍第1項記載之發明相同之作用效果以外，尙可 在結束標記露出時實施全部捲出之黏著材膠帶之切斷，故 實施切斷及連接作業之部份容易解開，而且，可利用必要 最小之位置實施連接，而可防止黏著材膠帶之浪費。 申請專利範圍第3項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，在將一方之黏著材膠帶之終端部反 折後，再使前導膠帶之黏著劑面和一方之黏著材膠帶之終 端部之黏著劑面重疊，實施重疊部份之加熱壓著。 此申請專利範圍第3項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶來黏著全部 捲出之黏著材膠帶之終端部 '及新裝著之黏著材膠帶之始 端部，故很簡單即可實施黏著材膠帶間之黏著。 申請專利範圍第4項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲’另一方之黏著材膠帶 -9- 200913828 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，使前導膠帶之黏著劑面和一方之黏 著材膠帶之終端部之黏著劑面重疊，實施重疊部份之加熱 壓著。 此申請專利範圍第4項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 申請專利範圍第5項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，在兩者 之重疊部份插入卡止銷來實施連接。 此申請專利範圍第5項記載之發明時，因爲係以卡止 銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏著 材膠帶之始端部，故連接十分簡卓。又’因爲無需在每次 更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 申請專利範圍第6項記載之發明’係利用卡止構件來 -10- 200913828 連接用以連接基材上塗布著電極連接用黏著劑之捲取至一 方之盤上之一方之黏著材膠帶、及捲取至另一方之盤上之 另一方之黏著材膠帶的黏著材膠帶之黏著材膠帶連接方法 ，其特徵爲，卡止構件具有配設於一方及另一方端部之爪 部、及配設於爪部間之彈性構件，一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部會互相抵接，配設於 卡止構件之一端之爪部會卡止於一方之黏著材膠帶之終端 部，配設於另一端之爪部會卡止於另一方之黏著材膠帶之 始端部，以彈性構件拉近兩方之爪部。 此申請專利範圍第6項記載之發明時，因爲使卡止構 件之一方之爪部卡止於一方之黏著材膠帶之終端部，而且 ，使卡止構件之另一方之爪部卡止於另一方之黏著材膠帶 之始端部，實施兩者之互相連接，故連接十分容易。又， 因爲一方之爪部及另一方之爪部之間具有彈性構件，故， 彈性構件可伸展而使卡止構件之另一方之爪部卡止於另一 方之黏著材膠帶之始端部之任意位置上，而爲具有高自由 度之連接。 又，因係使一方之黏著材膠帶之終端部、及另一方之 黏著材膠帶之始端部互相抵接之狀態實施連接，而無需使 膠帶互相重疊，可利用必要最小之位置實施連接，而可防 止黏著材膠帶之浪費。 申請專利範圍第7項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 -11 - 200913828 的黏著材膠帶連接方法，其特徵爲’使一方之黏者材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，以橫剖 面略呈；3字形之可彈性變形之夾子實施兩者之重疊部份的 夾持固定。 此申請專利範圍第7項記載之發明時，因爲只需以夾 子夾住一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部之重疊部份即可實施連接，連接作業十分容易 〇 申請專利範圍第8項記載之發明，其特徵爲，係以橫 剖面略呈3字形之金屬製夾持片夾住一方之黏著材膠帶及 另一方之黏著材膠帶之重疊部份，並從重疊部份之兩面壓 扁夾持片來連接兩者。 此申請專利範圍第8項記載之發明時，因係從重疊部 份之兩面壓扁夾持片來連接兩者，故可提高黏著材膠帶之 重疊部份的連接強度。 申請專利範圍第9項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部之其中任何一 方之黏著劑面重疊於另一方之基材面上，兩者之重疊長度 爲黏著劑膠帶寬度之2至50倍之範圍，以兩者之加熱壓 著實施連接。 此申請專利範圍第9項記載之發明時，因係利用黏著 -12- 200913828 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部來實施黏著材盤之更換’故很 簡單即可將新黏著材盤裝著至黏著裝置上。又，因爲無需 在每次更換新黏著材盤時都更換捲取盤、及將新黏著材之 始端裝設至捲取盤之作業’只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 重疊部份之長度爲黏著材膠帶寬度之2倍至50倍， 其理由如下所示，小於2倍時無法獲得充分之連接強度， 大於5 0倍時則連接部份使用之黏著材會增加過多而造成 黏著材之浪費。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑者，亦可以爲只有絕緣性黏著劑者，或者 ，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 〇項記載之發明，係用以連接基材 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠 帶之終端部折向黏著劑相對之方向，而將另一方之黏著材 膠帶之始端部折向黏著劑相對之方向，使兩者之彎折部份 互相卡止重疊且使兩者之黏著材面相對，實施重疊部份之 加熱壓著。 此申請專利範圍第1 〇項記載之發明時，除了具有和 -13- 200913828 申請專利範圍第1項記載之發明相同之作用效果以外，一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 會互相形成鈎狀卡止，且兩者之黏著劑面會互相連接，故 有較尚之連接強度。 申請專利範圍第1 1項記載之發明，係如申請專利範 圍第9或1 0項記載之發明，一方之黏著材膠帶之終端部 會標示著結束標記。 此申請專利範圍第1 1項記載之發明時，除了具有和 申請專利範圍第9或1 0項記載之發明相同之作用效果以 外，因爲一方之黏著材膠帶之終端部係利用結束標記部份 ，執行連接作業之部份容易解開且可利用必要最小之位置 實施連接，而可防止黏著材膠帶之浪費。又，可自動檢測 結束標記部份，故可利用該檢測信號控制裝置，若能發出 警報，則可提高作業效率。 申請專利範圍第1 2項記載之發明，係如申請專利範 圍第9〜1 1項之其中任一項記載之發明，其特徵爲，以形 成凹凸之一方之模具、及和其咬合之另一方之模具，夾住 一方之黏著材膠帶及另一方之黏著材膠帶之重疊部份，實 施加熱壓著。 此申請專利範圍第〗2項記載之發明時，除了具有和 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成凹凸而可擴大連接面 積’同時’可利用凹凸部之卡合來提高黏著材膠帶之拉伸 方向（縱向）之連接強度。 -14 - 200913828 申請專利範圍第1 3項記載之發明，係如申請專利範 圍第9〜11項之其中任一項記載之發明’其特徵爲’在一 方之黏著材膠帶及另一方之黏著材膠帶之重疊部份形成賃· 通孔後，實施重疊部份之加熱壓著。 此申請專利範圍第1 3項記載之發明時，除了具有如 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外’因爲連接部份會形成貫通孔’黏著劑會滲 出至貫通孔之內緣，而增加黏著劑之黏著面積’故可進一 步提高連接強度。 申請專利範圍第1 4項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 著材膠帶的黏著材膠帶連接方法，其特徵爲，一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部會重疊或 抵接，以跨越兩黏著材膠帶之矽處理基材之表面部份的方 式貼附矽黏著膠帶，實施兩黏著材膠帶之連接。 此申請專利範圍第1 4項記載之發明時，已捲取一方 之黏著材膠帶之黏著材盤、及只捲取黏著材膠帶之基材之 捲取盤係裝著於黏著裝置上，黏著材盤之黏著材膠帶用完 時’已用完之黏著材膠帶（一方之黏著材膠帶）之終端部 、及新裝著之黏著材盤之黏著材膠帶（另一方之黏著材膠 帶）之始端部會以矽黏著膠帶連接，新黏著材盤會取代已 用完之黏著材盤而裝著於黏著裝置上。 本發明時’只需連接已用完之黏著材膠帶及新黏著材 -15- 200913828 膠帶即可更換連接盤，故很容易即可將新黏著材盤裝著至 黏著裝置上。又，因爲無需在每次更換新黏著材盤時都更 換捲取盤、或將新黏著材膠帶之始端裝設至捲取盤並引導 黏著材膠帶之作業，故只需要較少時間即可更換新黏著材 盤，而可提高電子機器之生產效率。 黏著材膠帶之基材係利用矽實施表面處理，使用之黏 著膠帶亦使用矽黏著劑，可減少兩者之表面張力的差異而 提高密著力，故可實現傳統上較困難之兩者的黏著。 黏著材膠帶之黏著劑可以爲將導電粒子分散於絕緣性 黏著劑中之向異導電性黏著者，亦可以爲只有絕緣性黏著 劑者，或者，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 5項記載之發明，其特徵爲，申請 專利範圍第1 4項記載之矽黏著膠帶之黏著劑面之表面張 力及黏著材膠帶之矽處理基材之表面張力之差爲l〇mN/m (1 Odyne/cm )以下。 此申請專利範圍第1 5項記載之發明時，除了具有和 申請專利範圍第1 4項記載之發明相同之作用效果以外， 因爲矽黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽 處理基材之表面張力之差爲10mN/m(10dyne/cm)以下’ 可獲得較強之密著力，而可確實黏著兩者。表面張力係以 潮濕試劑或接觸角來檢測。 黏著材膠帶之矽處理基材及矽黏著膠帶之黏著劑面的 表面張力差應爲 0〜5mN/m(5dyne/cm)。表面張力之差 愈小愈好，若超過1 〇 ni N / m ( 1 0 d y n e / c m )則可能無法獲得 -16 - 200913828 充分密著強度。 申請專利範圍第1 6項記載之發明’係如申請專利範 圍第2項記載之發明，其特徵爲’矽黏著膠帶之黏著力係 100g/25mm 以上。 此申請專利範圍第1 6項記載之發明時’除了具有和 申請專利範圍第2項記載之發明相同之作用效果以外，一 方及另一方之黏著材膠帶的連接係利用對兩者之黏著劑面 張貼矽黏著膠帶來實施黏著，一方及另一方之黏著材膠帶 可獲得兩面之黏著（或密著），故可以高強度實施黏著。 尤其是，因爲黏著力爲100g/25mm以上，一方及另一 方之黏著材膠帶之兩黏著劑面的黏著會更爲強固。 黏著強度愈大可得到愈強之黏著強度，然而，小於 1 0 0 g / 2 5 m m則可無法獲得特定強度。 申請專利範圍第17項記載之發明，其特徵爲，使一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 重疊或抵接，並將申請專利範圍第1 6項記載之矽黏著膠 帶張貼於兩黏著材膠帶之兩面來實施連接。 此申請專利範圍第1 7項記載之發明時，除了具有和 申請專利範圍第1 6項記載之發明相同之作用效果以外， 係以其兩面實施一方及另一方之黏著材膠帶之連接，故可 得到更爲強固之連接。 申請專利範圍第1 8項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 -17- 200913828 著材膠帶的黏著材膠帶連接方法 著材膠帶之終端部及另一·方之黏著 兩面塗布著矽黏著劑之矽黏著膠帶 膠帶之連接，兩面之矽黏著劑和砂 1 0 m N / m ( 1 0 d y n e / c m )以下，且黏 ο 此申請專利範圍第1 8項記載 面黏著劑之矽黏著膠帶，而可以一 帶間夾著兩面矽黏著膠帶之方式來 著），故兩者之連接十分簡單且容 申請專·利範圍第19項記載之 上塗布著電極連接用黏著劑之捲取 黏著材膠帶、及捲取至另一方之盤 帶的黏著材膠帶連接方法，其特徵 之終端部、及另一方之黏著材膠帶 ，使糊狀之樹脂製黏著劑附著於重 以糊狀之樹脂製黏著劑之硬化來實 此申請專利範圍第1 9項記載 之黏著材膠帶之終端部、及新裝著 係以糊狀之樹脂製黏著劑實施固定 ，因爲無需在每次更換新黏著材膠 將新黏著材膠帶之始端裝設至捲取 路徑設定導引銷等之作業，只需要 著材盤，故可提高電子機器之生產 其特徵爲，以一方之黏 材膠帶之始端部間夾著 之方式來實施兩黏著材 基材之表面張力之差爲 著力爲100g/25mm以上 之發明時，因爲使用兩 方及另一方之黏著材膠 實施兩者之黏著（或密 易。 發明，係用以連接基板 至一方之盤上之一方之 上之另一方之黏著材膠 爲，一方之黏著材膠帶 之始端部會重疊或抵接 疊部份或抵接部份，並 施雨者之連接。 之發明時，因爲已用完 之黏著材膠帶之始端部 ，故連接十分簡單。又 帶時都更換捲取膠帶、 盤之作業、以及在特定 較少時間即可更換新黏 效率。 -18 - 200913828 因爲一方之黏著材膠帶之終端部、及另一方之黏著材 膠帶之始端部的重疊部份或抵接部份附著著樹脂製黏著劑 '故連接具有局自由度。 申請專利範圍第20項記載之發明，係如申請專利範 圍第1 9項記載之發明，其特徵爲，樹脂製黏著劑係從熱 硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑之群組中選 取之至少1種材料所構成。 此申請專利範圍第2 0項記載之發明時，除了具有和 申請專利範圍第1 9項記載之發明相同之作用效果以外， 因爲可從熱硬化性樹脂、光硬化性樹脂、熱金屬黏著劑之 群組中選取適合用於黏著材膠帶間之連接的樹脂製黏著劑 ，故可提高黏著材膠帶間之連接強度。 申請專利範圍第2 1項記載之發明，其特徵爲，裝著 著黏著材膠帶之黏著裝置上，裝設著用以供應申請專利範 圍第1 9或20項記載之樹脂製黏著劑的充塡機。 此申請專利範圍第2 1項記載之發明時，因爲黏著裝 置內配設著用以供應申請專利範圍第1 9或2 0項記載之樹 脂製黏著劑的充塡機，故無另行準備充塡機，而可防止連 接作業之浪費。 又’黏著裝置內除了充塡機以外，亦可具有以實施熱 硬化性樹脂之硬化爲目的之加熱器、或以實施光硬化性樹 脂之光照射爲目的之紫外線。 申請專利範圍第22項記載之發明，係用以將基材上 塗布著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材 -19- 200913828 膠帶盤，其特徵爲，黏著材膠帶盤在膠帶之寬度方向配設 著複數黏著材膠帶之捲部。 此申請專利範圍第22項記載之發明時，因爲配設著 複數黏著材膠帶之捲部（捲部）’複數之捲部當中’捲取 至一方之捲部之黏著材膠帶之全部捲出時，會將配置於全 部捲出之捲部之旁邊的另一方之捲部之黏著材膠帶裝設至 捲取盤。 如此，因爲一方之黏著材膠帶全部捲出時，會將另一 方之黏著材膠帶裝設至捲取盤，而實施黏著材膠帶之更換 ，故無需將新黏著材膠帶盤裝著至黏著裝置上。因此，新 黏著材膠帶盤之更換作業會較少，故可提高電子機器之生 產效率。 因爲可依序使用捲取至複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數’故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著’亦即’可防止阻塞’而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申g靑專利範圍第2 3項記載之發明，係如申請專利範 圍第22項記載之發明’其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部間，具有用以連接 兩者之連結膠帶’一方之黏著材膠帶之全部捲出時，會接 著開始捲出另一方之黏著材藤帶。 -20- 200913828 此申請專利範圍第23項記載之發明時，除了具有和 申請專利範圍第22項記載之發明相同之作用效果以外’ 因爲一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部係以連結膠帶實施連接，無需在一方之捲部之黏著 材膠帶之全部捲出後將另一方之捲部之黏著材膠帶裝設至 捲取盤上之作業，故可進一步提高電子機器之生產效率。 申請專利範圍第24項記載之發明，係具有申請專利 範圍第23項記載之黏著材膠帶盤、黏著材膠帶之捲取盤 、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏 著材膠帶之黏著材壓著至電子機器之電路基板的壓著部、 以及用以檢測連結膠帶之膠帶檢測手段的黏著裝置，其特 徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通過 壓著部爲止，會將連結膠帶捲取至捲取盤。 此申請專利範圍第24項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤’故一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，黏著裝置具有膠帶檢測手段，係由成對之發光部 及受光部所構成，用以實施連結膠帶之光學檢測。另一方 面，連結膠帶之兩端配設著有顏色之（例如黑色）標記， 受光部會利用發光部發出之雷射光檢測連結膠帶兩端之標 記來檢測連結膠帶。又’除了在連結膠帶附加標記以外， -21 - 200913828 可採用使連結膠帶之寬度和黏著材膠帶之寬度不同的方法 、或在連結膠帶上形成複數之孔的方法。 申請專利範圍第2 5項記載之發明，係利用卡止具連 接一方之黏著材朦帶之終端部及另一方之黏著材膠帶之始 端部的黏著材膠帶盤’其特徵爲’連接部份係以黏著材膠 帶覆蓋卡止具。 此申請專利範圍第2 5項記載之發明時，因爲利用卡 止具來連接全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，實施黏著材膠帶盤之更換，故將新黏 著材膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每 次更換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠 帶之始端裝設至捲取盤之作業、以及在特定路徑設定導引 銷等之作業，只需較少時間即可更換新黏著材膠帶盤，故 可提高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時’可防止連接部份之卡止具接觸黏者 -22- 200913828 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又’以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折1 80度，使黏 著材膠帶覆蓋卡止具。 又’亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第26項記載之發明，係具有申請專利 範圍第1項記載之黏著材膠帶盤、黏著材膠帶之捲取盤、 配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏著 材膠帶之黏著材壓著至電子機器之電路基板的壓著部、以 及用以檢測膠帶之連接部份的連接部檢測手段之黏著裝置 ’其特徵爲’連接部檢測手段檢測到膠帶之連接部份時， 至連接部份通過壓著部爲止，會將一方之黏著材膠帶捲取 至捲取盤。 此申請專利範圍第26項記載之發明時，連接部檢測 手段若檢測到連接部份，則因爲至連接部份通過壓著部爲 止’會將一方之黏著材膠帶捲取至捲取盤，故可防止連接 部份到達壓著部時實施壓著動作之問題。又，至連接部份 通過壓著部爲止，因爲會自動將一方之黏著材膠帶捲取至 捲取盤，故可省略捲取之麻煩。 申請專利範圍第2 7項記載之發明，係如申請專利範 圍第26項記載之發明’其特徵爲，連接部檢測手段係 -23- 200913828 CCD攝影機、厚度檢測感測器、及透射率檢測感測器之其 中之一。 此申請專利範圍第27項記載之發明時，除了具有和 申請專利範圍第26項記載之發明相同之作用效果以外， 以簡單之構成即可實施連接部份之檢測，而且，可利用這 些手段提高檢測精度。 例如，採用CCD攝影機做爲連接部檢測手段時，可 使連接部份之表面顯示於監視畫面，以比較圖素之濃淡來 檢測連接部份。又，採用厚度檢測感測器時，因爲連接部 份之厚度會大於黏著材膠帶之厚度，因可以比較厚度之變 化來檢測連接部份。又，採用透射率感測器時，會因爲連 接部份之厚度較厚，且因爲有卡止具而使透射率降低’故 可以比較透射率之値來檢測連接部份。 申請專利範圍第2 8項記載之黏著材膠帶連接方法， 其特徵爲，利用卡止具連接一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部’連接部份會以黏著材膠帶 覆蓋卡止具。 此申請專利範圍第2 8項記載之發明時’係利用卡止 具連接全部捲出之黏著材膠帶之終端部及新裝著之黏著材 膠帶之始端部來實施黏著材膠帶盤之更換’故將新黏著材 膠帶盤裝著至黏著裝置十分簡單。又’因爲無需在每次更 換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業’只需較少時間即可更換新黏著材膠帶盤’故可提 -24- 200913828 高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ’故外觀良好’同時，可防止連接部份之卡止具接觸黏著 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又’以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後’將連接部份朝膠帶之縱向反折1 8〇度，使黏 著材膠帶覆蓋卡止具。 又’亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第29項記載之發明，係在基材上塗布 黏著劑’並捲成盤狀之黏著劑膠帶，其特徵爲，基材上會 在膠帶之縱向上配置著複數條黏著劑。 此申請專利範圍第29項記載之發明時，若使用黏著 劑膠帶’將已捲取黏著劑膠帶之盤及空盤裝著至黏著裝置 -25- 200913828 ’對電路基板實施黏著劑之加熱加壓後’並以將基材捲至 空盤之方式裝著。 其次，對電路基板實施黏著劑之加熱加壓時’將配設 於基材之寬度方向的複數條黏著劑當中之1條壓著至電路 基板，壓著後之殘餘黏著劑條會和基材同時被捲取至空盤 。其次，盤上之黏著劑膠帶全部捲出後，會使盤之旋轉方 向逆轉，而使黏著劑膠帶之供應方向逆轉。如此，在各次 使用1條黏著劑後，會同時捲取殘餘之黏著劑及基材，並 重複依序使用殘餘之黏著劑條。因此，因爲會依序逐條使 用複數條黏著劑，故無需增加膠帶之捲數，即可大幅增加 1盤（2倍以上）可使用之黏著劑量。 本發明時，無需增加黏著劑膠帶之捲數，可大幅增加 使用黏著劑量。而且，因爲未增加黏著劑膠帶之捲數，故 可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度方向 滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可防止 阻塞，此外，亦可防止因爲基材較長而容易發生之伸展等 弊病（基材之損傷或切斷）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高製造效率。 又，黏著劑膠帶之製造上，因爲每1盤之黏著劑量較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 又，結束第1條黏著劑之壓著而將黏著劑膠帶捲取至 空盤後，爲了使用下1條黏著劑’不逆轉旋轉方向而更換 -26- 200913828 裝著於黏著裝置之2個盤亦可。 黏者劑可以爲將導電粒子分散於絕緣性黏著劑中之^向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 基材之寬度應爲5mm〜1000mm，然而，可依1條黎占 著劑之寬度或黏著劑之條數而任意選取。1條黏著劑之寬 度應爲〇.5mm〜10.0mm。 基材之寬度應爲5mm〜1000mm，基材之寬度低方々 5 mm時’配設於基材上之黏著劑之條數及黏著劑之寬度會 受到制限，大於1 0 0 0mm時’則無裝著至既存之黏著裝置 〇 申請專利範圍第3 0項記載之發明，係如申請專利範 圍第2 9項記載之發明’其特徵爲’複數條黏著劑之相鄰 的黏者劑條具有間隔。 此申請專利範圍第3 0項記載之發明時，除了具有和 申請專利範圍第2 9項記載之發明相同的作用效果以外， 同時’因爲相鄰之黏著劑條間爲互相分離，故容易實施黏 著劑之逐條壓著。 申請專利範圍第3丨項記載之發明，係如申請專利範 圍第29項記載之發明’其特徵爲，黏著劑係利用在膠帶 之縱向上形成縫隙來分離成複數條。 此申請專利範圍第3 1項記載之發明時，除了具有和 申g靑專利範圍第2 9項相同的作用效果以外，同時，在基 材之單面全面塗布黏著劑，並將黏著劑壓著至電路基板之 -27- 200913828 前一瞬間，亦即，在使用黏著劑膠帶之前一瞬間，尙以切 刃等使黏著劑具有切痕之方式來形成縫隙。 又’縫隙之形成上，亦可在製造黏著劑膠帶時，以切 刃等使黏著劑具有切痕而形成縫隙。 縫隙之形成上，除了利用切刃以外，亦可利用雷射或 電熱線等來形成。 本發明時，可增加配置於基材上之黏著劑條的條數。 申請專利範圍第3 2項記載之發明，係在基材上塗布 黏著劑’並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲’以在基材之寬度方向具有間隔之方式配置之塗布器， 對以連續方式搬運之基材面上供應黏著劑來對基材實施複 數條黏著劑之塗布。 此申請專利範圍第3 2項記載之發明時，可以利用既 存設備製造如申請專利範圍第3 0項記載之黏著劑膠帶。 塗布器可以爲配設於基材之寬度方向的複數滾筒，亦 可以爲噴嘴。 申請專利範圍第3 3項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，在一方之基材之單面全面塗布黏著劑，並在黏著劑上 形成縱向之縫隙後，在黏著劑面上配置另一方之基材，以 一方及另一方之基材夾住黏著劑，然後再使一方之基材及 另一方之基材互相分離’一方及另一方之基材上分別交互 貼附著複數條黏著劑’而在一方及另一方之基材上以具有 間隔之方式配置複數條黏著劑。 -28 - 200913828 此申請專利範圍第3 3項記載之發明時，因爲可以同 時製造2個如申請專利範圍第2項記載之黏著劑膠帶，故 具有良好製造效率。 申請專利範圍第3 4項記載之發明，係在基材上塗布 黏著劑，並利用捲成盤狀之黏著劑膠帶將黏著劑壓著至電 路基板之黏著劑壓著方法，其特徵爲，基材之單面全面會 塗布著黏著劑，對黏著劑膠帶之寬度方向的部份黏著劑從 基材側沿膠帶之縱向實施加熱加壓形成條狀，降低經過加 熱之部份之黏著劑的凝聚力並壓著至電路基板，壓著後， 將殘餘之黏著劑和基材同時捲成盤狀，並再度利用捲成盤 狀之黏著劑膠帶對電路基板實施殘餘之黏著劑的加熱加壓 〇 此申請專利範圍第3 4項記載之發明時，以對部份黏 著劑加熱來降低該部份之凝聚力（以下簡稱爲「凝聚力降 低線」），從凝聚力降低線將經過加熱之部份的黏著劑壓 著至電路基板，而和基材分離。殘餘之黏著劑會保持殘留 於基材上之情形下，和基材同時被捲取至空盤。 本發明時，因爲只是使黏著劑膠帶之寬度較傳統稍爲 寬一點而已，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑寬度，可以改變加熱 區域來進行任意設定，故壓著黏著劑寬度具有較高之自由 度。 又，和申請專利範圍第29項記載之發明相同，黏著 劑膠帶全部捲出至空盤時，使盤之旋轉方向逆轉，而使膠 -29- 200913828 帶之供應方向逆轉、或保持盤之旋轉方向但將盤相互交換 。利用此方式，因爲會依逐條對基材上之黏著劑加熱並壓 著至電路基板，可在不增加膠帶之捲數的情形下，大幅增 加1盤可使用之黏著劑量。 又，和申請專利範圍第29項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 膠帶寬度應爲5mm〜1000mm’壓著至電路基板之黏 著劑應爲 〇.5mm〜1.5mm。膠帶寬度爲 5mm〜1 000mm之 理由如下，因爲膠帶寬度低於5mm時，每1盤之黏著劑 壓著次數會較少，而大於l〇〇〇mm時，將無法裝著至既存 之黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑、亦可以爲只有絕緣性黏著劑者、或者將 絕緣性之隔件粒子分散於這些黏著劑中者。 申請專利範圍第3 5項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，黏著劑膠 帶之寬度爲和電路基板之一邊之長度相同或以上’且在膠 帶之寬度方向上配置著複數條黏著劑。 此申請專利範圍第3 5項記載之發明時，係以寬度和 電路基板之一邊重疊的方式來配置黏著劑膠帶’故可直接 沿著電路基板之一邊對配設於黏著劑膠帶之寬度方向的1 條黏著劑實施加熱加壓。 -30- 200913828 因爲黏著劑膠帶之寬度爲電路基板之一邊之長度以上 ，黏著劑膠帶只需拉出黏著劑之條寬即可。 其次，將黏著劑壓著至電路基板之一邊後，旋轉電路 基板，使另一邊位於黏著劑膠帶之寬度方向的位置，對另 一邊實施黏著劑條之加熱加壓。如此，依序對電路基板之 其他邊實施黏著劑之壓著，很容易即可對電路基板之四周 實施黏著劑之壓著。 因此，因爲可依序逐條使用具有電路基板之一邊之長 度以上之黏著劑，而一次之使用量爲黏著劑條之寬度尺寸 份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可使 用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面，因電子構件之製造工廠可減少新黏著劑膠 帶之更換次數，故可提高製造效率。 又，黏著劑膠帶之製造上，因每1盤之黏著劑量會較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑’亦可以爲只有絕緣性黏著劑者’或者’ 將絕緣性隔件粒子分散於這些黏著劑中者。 -31 - 200913828 黏著劑膠帶之寬度爲電路基板之一邊之尺寸以上，例 如，5mm〜3000mm。又，即使尺寸小於電路基板之一邊之 尺寸的黏著劑膠帶，亦可以在黏著劑膠帶之寬度方向配置 複數條相鄰接之方式來使其具有電路基板之一邊之尺寸。 此時，因很容易即可對應不同尺寸之電路基板故可提高生 產效率。1條黏著劑之寬度應爲例如0.5 mm~l 0.0mm。 黏著劑膠帶之寬度爲5mm〜3000mm之理由如下，電 路基板之一邊之尺寸很少會小於5mm，而大於3000mm時 ’盤之寬度會太寬’而可能無法裝著至既存之黏著裝置。 申請專利範圍第3 6項記載之發明，係如申請專利範 圍第3 5項記載之發明’其特徵爲，以相鄰之黏著劑條具 有間隔之方式配設複數條黏著劑。 此申請專利範圍第3 6項記載之發明時，除了具有和 申請專利範圍第3 5項記載之發明相同之作用效果以外， 因爲鄰接之黏著劑條爲分離，很容易即可將黏著劑逐條從 基材剝離並實施壓著。 申請專利範圍第3 7項記載之發明，係如申請專利範 圍第3 5項記載之發明’其特徵爲，黏著劑係利用形成於 膠帶之寬度方向的縫隙而分離成複數條。 此申請專利範圍第3 7項記載之發明時，除了具有和 申請專利範圍第3 5項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者’在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間’利用以切刃等使黏著劑具有切 -32- 200913828 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙’除了切刃以外，亦可利 用雷射或電熱線等來形成。 本發明時，除了可增加配置於基材上之黏著劑條的條 數以外，在膠帶之寬度方向配置複數條黏著劑之黏著劑膠 帶的製造更爲容易。 申請專利範圍第3 8項記載之發明，係在基材上塗布 黏著劑’並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，將黏著劑塗布於一方之基材之全面，並在黏著劑上沿 著膠帶之寬度方向形成縫隙後，在黏著劑面上配置另一方 之基材，以一方及另一方之基材夾住黏著劑，然後再使一 方之基材及另一方之基材互相分離，一方及另一方之基材 上分別交互貼附著複數條黏著劑，而在一方及另一方之基 材上以具有間隔之方式配置著複數條黏著劑。 此申請專利範圍第3 8項記載之發明時，因爲可以利 用既存設備同時製造2個如申請專利範圍第2項記載之黏 著劑膠帶’故具有良好製造效率。 申請專利範圍第3 9項記載之發明，係一種黏著劑膠 帶壓著方法’其特徵爲’將申請專利範圍第3 5〜3 7項之 其中任項通載之黏者劑膠帶配置於電路基板上，沿著寬 度方向對黏著劑膠帶實施加熱加壓，將黏著劑條壓著至電 路基板之一邊。此壓者方法亦可採用如下之方式，亦即， 將黏者劑膠帶配置於電路基板上’沿著寬度方向對黏著劑 -33- 200913828 膠帶實施加熱加壓，將黏著劑條壓著至電路基板之一邊， 其次，變更電路基板之位置，並沿著黏著劑膠帶之寬度方 向對電路基板之另一邊實施黏著劑膠帶之加熱加壓，將下 一黏著劑條壓著至電路基板之另一邊。 此申請專利範圍第3 9項記載之發明時，除了具有和 申請專利範圍第3 5〜3 7項之其中任一項記載之作用效果 以外，將黏著劑膠帶裝著於黏著裝置後，可將電路基板之 一邊配置於黏著劑膠帶之寬度方向，將黏著劑壓著至電路 基板之一邊，其次，將電路基板旋轉大約9 0度，使電路 基板之另一邊位於和黏著劑膠帶之寬度方向成爲平行之位 置上，並將黏著劑壓著至電路基板之另一邊。如此，可依 序將電路基板旋轉90度並實施回黏著劑之壓著，很簡單 即可將黏著劑壓著於電路基板之四周，而提高電子構件之 製造工廠的作業效率。 申請專利範圍第4 0項記載之發明的特徵如下，至少 在移動電路基板之搬運路上配置2條申請專利範圍第3 5〜 37項之其中任一項記載之黏著劑膠帶，一方之黏著劑膠帶 之配置上，其寬度方向和搬運路成垂直，另一方之黏著劑 膠帶之配置上，其寬度方向係沿著搬運路之方向，一方之 黏著劑膠帶係針對電路基板之相對2邊沿著寬度方向實施 黏著劑膠帶之加熱加壓將黏著劑條壓著至電路基板之相對 2邊，其次，使電路基板朝另一方之黏著劑膠帶移動，針 對電路基板之其餘2邊從基材側沿著寬度方向實施黏著劑 膠帶之加熱加壓，將黏著劑條壓著於電路基板之四周。 -34- 200913828 此申請專利範圍第40項記載之發明時’除了具有和 申請專利範圍第3 5〜3 7項記載之作用效果以外，無需旋 轉電路基板而將其移至一方之黏著劑膠帶及另一方之黏著 劑膠帶之位置，在各位置上沿著寬度方向實施加熱加壓’ 而很容易即可將黏著劑壓著於電路基板之四周，具有良好 作業效率。 申請專利範圍第4 1項記載之發明，係在基材之單面 全面塗布黏著劑，並利用捲成盤狀之黏著劑膠帶對電路基 板實施黏著劑之壓著的黏著劑膠帶壓著方法，其特徵爲’ 黏著劑膠帶之寬度爲電路基板之一邊之長度以上，從寬度 方向實施黏著劑膠帶之寬度方向之部份黏著劑的加熱加壓 ，降低加熱部份之黏著劑的凝聚力，將黏著劑壓著至電路 基板。 此申請專利範圍第4 1項記載之發明時，在將黏著劑 壓著至電路基板之周圍時，係將黏著劑膠帶裝著至黏著裝 置並沿著寬度方向實施黏著劑膠帶之加熱加壓，降低該部 份之凝聚力（以下簡稱爲「凝聚力降低線」），加熱部份 之黏著劑會沿著凝聚力降低線從基材分離而壓著至電路基 板上。其次，將電路基板旋轉約9 0度，使相鄰之邊位於 黏著劑膠帶之寬度方向之位置上，沿著寬度方向實施下一 黏著劑條之加熱加壓，將黏著劑條之黏著劑壓著至相鄰之 邊。如此，可依序將黏著劑壓著至電路基板之四邊，而有 良好作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可’ -35- 200913828 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度’可利用改變 加熱加壓區域來實施任意設定’故壓著之黏著劑寬度具有 高自由度。 又，和申請專利範圍第3 5項記載之發明相同’因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂’同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明的特徵’係具有一 方之盤、另一方之盤 '以及用以收容以可自由旋轉方式裝 設之這些盤的殼體，一方之盤上捲繞著在基材上塗布著黏 著劑之黏著劑膠帶，另一方之盤則固定著黏著劑膠帶之一 端，黏著劑膠帶上沿著膠帶之縱向至少配置著2條黏著劑 〇 此申請專利範圍第42項記載之發明時，將黏著劑膠 帶盒裝著至黏著裝置，以和電路基板之一邊重疊之方式， 對配置於黏著劑膠帶之寬度方向上之至少2條沿著縱向形 成之黏著劑的1條，從基材側實施加熱加壓，使1條之黏 著劑壓著至電路基板。如此，可依序將黏著劑壓著至電路 基板，從一方之盤依序捲出黏著劑膠帶，同時，將殘餘之 1條塗布著黏著劑之黏著劑膠帶捲取至另一方之盤。其次 ，捲繞於一方之盤的黏著劑膠帶全部捲出時，將盒反轉並 再度裝著至壓著裝置。 利用此方式，因爲一方之盤及另一方之盤會互換，而 -36- 200913828 變成從另一方之盤捲出黏著劑膠帶’可再實施1條黏著劑 之壓著。 在黏著劑膠帶上形成2條以上之黏著劑時’亦可改變 寬度方向之位置，並以依序或以具有間隔之方式實施壓著 〇 . 如上所示，本發明時，黏著劑板上至少在寬度方向上 並排著2條黏著劑，並可逐條使用，至1盤至少可使用2 盤份，而可在無需增加黏著劑膠帶之捲數的情形，使1盤 可使用之黏著劑量增加成2倍以上。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面’形成2條黏著劑時，電子構件之製造工廠 在用完1盤份（1條黏著劑）時只需反轉盒即可，故下一 裝著更爲容易。 又，因黏著劑膠帶係採盒方式，故在黏著裝置上將黏 著劑膠帶裝設於盤上時沒有繁複之步驟，只要將盒裝著至 黏著裝置即可’故處理上十分容易，而且具有良好之裝設 及更換作業性。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導性黏者劑’亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 -37- 200913828 申請專利範圍第4 3項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，複數條黏著劑之相鄰 之黏著劑條具有間隔。 此申請專利範圍第43項記載之發明時，除了具有和 申請專利範圍第42項記載之發明相同之作用效果以外， 相鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑 並實施壓著。 申請專利範圍第44項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，黏著劑係利用膠帶之 寬度方向上形成之縫隙來分離成複數條。 此申請專利範圍第44項記載之發明時，除了具有和 申請專利範圍第42項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間，利用以切刃等使黏著劑具有切 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 申請專利範圍第45項記載之發明的特徵，係將··具 有一方之盤、另一方之盤、以及用以收容以可自由旋轉方 式裝設之這些盤的殼體；及一方之盤上捲繞著在基材上塗 布著黏著劑之黏著劑膠帶，而另一方之盤固定著黏著劑膠 帶之一端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑 -38- 200913828 膠帶盒將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之 寬度方向之一部份進行加熱加壓，降低加熱部份之黏著劑 的凝聚力，將寬度方向之部份黏著劑壓著至電路基板。 此申請專利範圍第45項記載之發明時，利用對黏著 劑膠帶之寬度方向的一部份實施加熱加壓，降低該部份之 黏著劑之凝聚力（以下簡稱爲「凝聚力降低線」），可從 凝聚力降低線使加熱部份之黏著劑從基材分離並壓著至電 路基板。 本發明時，因爲黏著劑膠帶只需在基材之全面塗布黏 著劑即可，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 申請專利範圍第46項記載之發明，係一種利用黏著 劑膠帶盒之黏著劑壓著方法，其特徵爲，將：具有一方之 盤、另一方之盤、以及用以收容以可自由旋轉方式裝設之 這些盤的殻體；及一方之盤上捲繞著在基材上塗布著黏著 劑之黏著劑膠帶，而另一方之盤則固定著黏著劑膠帶之一 端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒 將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之寬度方 向的一部份實施加熱加壓，降低加熱部份之黏著劑的凝聚 力，將寬度方向之部份黏著劑壓著至電路基板，捲取至一 方之盤上之黏著劑膠帶全部捲出後，將黏著劑膠帶盒反轉 ，再將殘餘之部份黏著劑壓著至電路基板。 -39- 200913828 此申請專利範圍第4 6項記載之發明時，除了具有和 申請專利範圍第4 5項相同的作用效果以外，同時，捲取 至一方之盤上之黏著劑膠帶全部捲出時，將盒反轉並再度 裝著至壓著裝置，而將殘餘部份之黏著劑壓著至電路基板 ’故和申請專利範圍第1項記載之發明相同，在未增加捲 數之情形下可增加黏著劑量，故可防止捲取散亂，同時， 得到可防止因黏著劑之滲出而造成之阻塞、及防止因基材 之伸展而造成之弊病等之效果。此外，電子構件之製造工 廠在1盤份（1條份之黏著劑）全部捲出時，只要反轉盒 即可’下一裝著會更爲容易。因爲採用盒之方式，處理上 更爲容易，且具有良好之裝設及更換作業性。 申請專利範圍第47項記載之發明，係塗布於基材上 之捲成盤狀之黏著劑膠帶，其特徵爲，基材具有熱熔融劑 層及支持層。 此申請專利範圍第47項記載之發明時，若使用黏著 材膠帶’將捲取黏著材膠帶之盤及空盤裝著至黏著裝置， 對電路基板實施黏著材之加熱加壓後，會將基材捲取至空 盤。其次’使已全部捲出之捲取至一方之盤上之一方之黏 著材膠帶之終端部、及新捲取至另一方之盤上之另一方之 黏著材膠帶之始端部互相重疊或抵接，對此部份進行加熱 ，使熱熔融劑層熔融後，利用冷卻來使熱熔融劑固化，用 以連接黏著材膠帶。 利用黏著材膠帶之基材黏著全部捲出之黏著材膠帶之 終端部及新裝著之黏著材膠帶之始端部，來實施黏著材盤 -40- 200913828 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。又 ’因爲無需每次更換新黏著材盤時都更換捲取盤、將新黏 著材之始端裝設至捲取盤、及捲附至導引銷之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第48項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，支持層夾於熱熔融劑層 之間。 此申請專利範圍第48項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之作用效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。又，因爲熱 熔融劑層形成於膠帶之縱向全體，重疊長度無需嚴格定位 ，故連接具有高自由度。 申請專利範圍第4 9項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，熱熔融劑層夾於支持層 之間。 此申請專利範圍第4 9項記載之發明時’除了具有和 申請專利範圍第4 7項記載之發明相同之作用效果以外’ 黏著材膠帶之連接上，係在一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部互相抵接之位置上，利用黏 -41 - 200913828 著裝置之加熱加壓頭進行加熱。加熱時熱熔融劑會熔解滲 出，利用冷卻來使熱熔融劑固化’實施黏著材膠帶間之連 接。此時，因爲熱熔融劑層係夾於支持層之間，故可防止 熔融劑層曝露於大氣之下而因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層之黏著強度。 申請專利範圍第5 0項記載之發明，係用以連接捲取 至一方之盤之一方之黏著材膠帶、及捲取至另一方之盤上 之另一方之黏著材膠帶的黏著材膠帶連接方法，其特徵爲 ，黏著材膠帶具有以脫模劑實施表面處理之基材及黏著劑 ’除去其中任何一方之黏著材膠帶之基材端部之脫模劑， 使另一方之黏著材膠帶之黏著劑面重疊於該部份，以實施 兩者之重疊部份的加熱壓著來進行連接。 此申請專利範圍第5 0項記載之發明時，在其中任何 一方之黏著材膠帶之基材面上重疊另一方之黏著材膠帶之 黏著劑面，實施重疊部份之加熱壓著，利用連接全部捲出 之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部來 實施黏著材盤之更換，故很簡單即可將新黏著材盤裝著至 黏著裝置。 因爲無需每次更換新黏著材盤時都更換捲取盤、將新 黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路徑 設定導引銷等之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 又，在黏著材膠帶捲繞於盤上之狀態下，爲了避免黏 著劑面及基材面發生黏著’基材之表面上會塗布脫模劑。 -42- 200913828 本發明時，會除去一方之黏著材膠帶之脫模劑，並將另一 方之黏著材膠帶之黏著劑面重疊於該部份並進行黏著，故 黏著材膠帶間之連接十分簡單。 連接部份之加熱壓著上，若採用裝著著黏著材盤之黏 著裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第5 1項記載之發明，係如申請專利範 圍第5 0項記載之發明，其特徵爲，脫模劑之除去係利用 電漿放電、紫外線照射、雷射照射之其中任何一種方式來 實施。 此申請專利範圍第51項記載之發明時，除了具有和 申請專利範圍第5 0項記載之發明相同之作用效果以外， 因係利用電漿放電、紫外線照射、雷射照射之其中任何一 種方法來除去脫模劑，和以手剝離時相比，可以更短之時 間、更正確地除去脫模劑。 脫模劑之除去方法上，採用電漿放電時，係使處於電 漿狀態之氣體分解而成爲容易產生之狀態（激發狀態）， 並以對基材之表面實施放電來除去脫模劑。又，紫外線照 射時，例如，採用水銀燈當做光源，利用照射一定時間之 來自水銀燈之紫外線來實施。又，雷射照射時，係以利用 雷射振盪器照射之雷射光來對脫模劑進行加熱並使其熔解 ，用以除去脫模劑。 申請專利範圍第52項記載之發明，係將基材上塗布 著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材膠帶 盤，其特徵爲，黏著材膠帶盤之膠帶之寬度方向上配設著 -43- 200913828 複數之黏著材膠帶之捲部。 此申請專利範圍第52項記載之發明時’因配設著複 數之黏著材膠帶捲部（捲部），複數捲部當中之捲繞於一 方之捲部的黏著材膠帶全部捲出時’會捲取配置於全部捲 出之捲部之隔壁的另一方之捲部的黏著材膠帶並將其裝設 至盤。 如此，一方之黏著材膠帶全部捲出時，會將另一方之 黏著材膠帶裝設至盤，而實施黏著材膠帶之更換，故無需 將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少之新 黏著材膠帶盤之更換作業，故可提高電子機器之生產效率 〇 因爲係依序使用捲繞於複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著’亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第5 3項記載之發明，係如申請專利範 圍第52項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部之間具有用以連接 兩者之連結膠帶，一方之黏著材膠帶全部捲出時，會接著 開始捲出另一方之黏著材膠帶。 此申請專利範圍第5 3項記載之發明時，除了具有和 -44 - 200913828 申請專利範圍第52項記載之發明相同之作用效果以外， 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 部係利用連結膠帶實施連接，一方之捲部之黏著材膠帶全 部捲出後，無需將另一方之捲部之黏著材膠帶捲取至盤之 裝設作業，故可進一步提高電子機器之生產效率。 申請專利範圍第54項記載之發明，係具有如申請專 利範圍第5 3項記載之黏著材膠帶盤、黏著材膠帶之捲取 盤、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將 黏著材膠帶之黏著材壓著至電子機器之電路基板上之壓著 部、以及用以檢測連結膠帶之膠帶檢測手段之黏著裝置， 其特徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶 通過壓著部爲止會將連結膠帶捲取至捲取盤。 此申請專利範圍第54項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部捲 出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，膠帶檢測手段上，例如黏著裝置具有一對發光部 及受光部，以光學方式檢測連結膠帶。另一方面，連結膠 帶之兩端配設著有顏色之（例如黑色）標記，受光部會利 用發光部發出之雷射光檢測連結膠帶兩端之標記來檢測連 結膠帶。又，除了在連結膠帶附加標記以外，可採用使連 結膠帶之寬度和黏著材膠帶之寬度不同的方法、或在連結 -45- 200913828 膠帶上形成複數之孔的方法。 申請專利範圍第5 9項記載之發明，係具有一方之盤 、另一方之盤 '使一方之盤及另一方之盤連動旋轉之齒輪 單元、收容前述諸元件之殼體、配置於殼體之開口部之加 熱構件、以及對加熱構件供應電力之電源手段之黏著具， 其特徵爲，一方之盤上捲繞著在基材上塗布著黏著劑之黏 著劑膠帶，另一方之盤則固定著黏著劑膠帶之一端’加熱 構件具有利用供應之電力實施發熱之電熱構件，將捲取至 一方之盤上之黏著劑膠帶拉至殻體之開口部，以加熱構件 從基材側對位於開口部之黏著劑膠帶實施加熱加壓，將黏 著劑壓著至電路基板，以另一方之盤捲取黏著劑被剝離之 基材。 此申請專利範圍第5 9項記載之發明，在將黏著劑壓 著至電路基板時，係以單手握持殼體，將露出黏著劑膠帶 之開口部壓抵電路基板，配設於開口部之黏著劑膠帶基材 側之加熱構件會抵接位於開口部之黏著劑膠帶，而將黏著 劑壓著至電路基板。其次，在抵接位於加熱構件下之黏著 劑膠帶的情形下使黏著具前進，會從一方之盤拉出黏著劑 膠帶，而在從盤拉出黏著劑膠帶時，盤會旋轉，故固定於 一方之盤之同軸上的齒輪會旋轉，而和其齒合之另一方之 盤之齒輪亦會旋轉，以另一方之盤捲取黏著劑已被剝離之 基材。 對加熱構件之電力供應上，可以利用配設於殼體之開 關來切換電力之供應，或者，亦可在加熱構件上配設感壓 -46 - 200913828 開關，加熱構件被推壓時’可感測到該推壓而對加熱構件 供應電力。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著’亦可以爲只有絕緣性黏著劑者，或者，爲 將絕緣性隔件粒子分散於黏著劑中者。 申請專利範圍第6 0項記載之發明，係塗布於基材上 之黏著材膠帶’其特徵爲’基材係金屬膜或芳香族聚醯胺 膜所構成。 此申請專利範圍第6 0項記載之發明時，因爲黏著材 膠帶之基材係採用金屬膜（或金屬箔）或芳香族聚醯胺膜 ，即使基材之厚度較薄時，亦可防止基材伸展或切斷等問 題。 因此，利用由厚度較薄之基材所構成之黏著材膠帶， 可以增加每1盤之捲數，而增加1盤可使用之黏著劑量。 又，使用本發明之黏著材膠帶，每1盤之捲數會增多，電 子構件之製造工廠只需較少新黏著材膠帶之更換次數即可 ，故可提高作業效率。此外，黏著材膠帶之製造上，因可 以減少製造之盤數，且可減少盤材及濕氣防止材之使用量 ,故可降低製造成本。 金屬膜應採用伸展性較高之金屬，例如，銅、鋁、不 錶鋼、鐵、錫等。 芳香族聚醯胺膜之具體實例如對位芳香族聚醯胺纖維 膜（MICTRON ; TORAY株式會社製商品名稱）等。 黏著劑係採用熱可塑性樹脂、熱硬化性樹脂、或熱可 -47- 200913828 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，熱硬化性樹脂系則以 環氧樹脂系、壓克力樹脂系、以及矽樹脂系爲代表。 黏著劑亦可分散著導電粒子。導電粒子係如Au、A g 、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、或碳、 石墨等，亦可在前述之物及/或非導電性之玻璃、陶瓷、 塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子 '或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熟加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 申請專利範圍第6 1項記載之發明，係如申請專利範 圍第60項記載之發明，其特徵爲，基材之厚度爲〜 2 5 // m。 基材之厚度爲l/zm〜25/zm之理由如下，基材之厚 度低於1 // m時，基材無法得到充分之拉伸強度，而容易 斷裂。又，基材之厚度若超過25/zm時’每1盤之捲數方 面無法得到可滿足之捲數。 申請專利範圍第6 2項記載之發明，係如申請專利範 -48- 200913828 圍第6 0或6 1項記載之發明，其特徵爲’基材之拉伸強度 在25□時爲3 00MPa以上。 基材之拉伸強度爲3 00MPa以上之理由如下’基材之 拉伸強度小於300MPa時，基材容易延展，且黏著材膠帶 容易斷裂。 申請專利範圍第63項記載之發明，係如申請專利範 圍第60至62項之其中任一項記載之發明，其特徵爲，基 材對黏著劑之厚度比爲〇 . 〇 1〜1 . 〇。 基材對黏著劑之厚度比爲0 . 〇 1〜1. 〇之理由如下，基 材對黏著劑之厚度比低於0.01時，基材會太薄，而使黏 著材膠帶無法具有足充分之強度。又，基材對黏著劑之厚 度比超過1.0時，基材之厚度會過厚，每1盤之捲數會不 夠多。 申請專利範圍第64項記載之發明，係如申請專利範 圍第60至63項之其中任一項記載之發明，其特徵爲，基 材之表面粗細度Rmax爲0.5 // m以下。 基材之表面粗細度Rmax應爲0.5 m以下之理由如下 ，Rmax若超過〇.5//m，則因爲基材表面之凹凸，將黏著 劑壓著至電路基板時，黏著劑不易從基材分離。 申請專利範圍第65項記載之發明，係利用在基材上 塗布黏著劑並捲成盤狀之黏著材膠帶在被覆體上形成黏著 劑之黏著材膠帶黏著材形成方法，其特徵爲，分別從複數 盤拉出黏著材膠帶，使各黏著材膠帶重疊成一體，剝離一 方之基材即可在被覆體上形成重疊成一體之黏著劑。 -49- 200913828 此申請專利範圍第65項記載之發明時’從一方之盤 捲出之黏著材膠帶之黏著劑面、及從另一方之盤捲出之黏 著材膠帶之黏著劑面會重疊而使黏著材膠帶成爲一體。另 一方之黏著材膠帶之基材會會捲取至捲取用盤，而重疊成 一體之黏著材膠帶之黏著劑則會被加壓加熱頭壓著至被覆 體。被覆體係電子構件或電路基板，如引線框架或引線框 架之晶片等。 如此，在被覆體上形成黏著劑之前一步驟，可使一方 之黏著材膠帶之黏著劑、及另一方之黏著材膠帶之黏著劑 重疊，在得到期望之黏著劑厚度再在被覆體上形成黏著劑 ，在增多黏著材膠帶之捲數的情形，卻可縮小每1盤之黏 著材膠帶的捲繞直徑。因此，可增加每1盤之黏著材膠帶 之捲數，而大幅增加1次更換作業之可使用的黏著劑量。 因此，只需較少之新黏著材膠帶之更換作業即可，故可提 高電子機器之生產效率。 申請專利範圍第6 6項記載之發明，係如申請專利範 圍第1項記載之發明’其特徵爲，只有一方之黏著材膠帶 之黏著劑含有硬化劑。 此申請專利範圍第6 6項記載之發明時，除了具有和 申請專利範圍第6 5項記載之發明相同之作用效果以外， 因爲只有一方之黏著材膠帶之黏著劑含有硬化劑，故另一 方之黏著材膠帶之黏著劑不需要硬化劑。因此，未含有硬 化《!!之d者劑之黏者材膠帶無需低溫管理。因此，可減少 必須實施低溫管理之黏著材膠帶的數量，而可使黏著材膠 -50- 200913828 帶之運送及保管獲得有效率之管理。又，未調合硬化劑之 黏著材膠帶、及調合著硬化劑之黏著材膠帶的黏著劑，係 以不會和硬化劑產生反應之成分做爲另一方之黏著劑，除 了以不會和硬化劑產生反應之成分做爲硬化劑以外，尙以 使用之黏著劑做爲一方之黏著劑，故可提高黏著劑之保存 安定性。 申請專利範圍第67項記載之發明係向異導電材膠帶 ，其特徵爲，在芯材之縱向上實施具有膜狀黏著劑之向異 導電材之多數次捲繞積層。 又，申請專利範圍第6 8項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之單面配設基材膜之2層構造 的向異導電材。 又，申請專利範圍第69項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之兩面配設基材膜之3層構造 之向異導電材。 又，申請專利範圍第7 〇項記載之發明，係如申請專 利範圍第68或69項記載之向異導電材膠帶’其特徵爲’ 對基材膜之單面或兩面實施剝離處理。 又，申請專利範圍第71項記載之發明，係如申請專 利範圍第67至70項之其中任一項記載之向異導電材膠帶 ，膜狀黏著劑之寬度爲0.5〜5mm。 又，申請專利範圍第72項記載之發明，係如申請專 -51 - 200913828 利範圍第68至71項之其中任一項記載之向異導電材膠帶 ，基材膜之強度爲12kg/mm2以上、伸展爲60〜200%、厚 度爲lOO/zm以下。其次，若基材膜爲有色透明或有色不 透明之著色時，很容即可實施基材膜及黏著劑之判別，又 ，亦很容易判別捲出部之位置，故可提高作業性。 【實施方式】 其次，參照附錄圖面，針對本發明之實施形態進行說 明。又，以下之說明中，同一或同等之構成要素會附與相 同符號。 首先，參照第1圖〜第5圖，針對申請專利範圍第1 〜4項記載之發明之實施形態進行說明。 第1圖係第1實施形態之黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第2圖A及B係第1圖之連接部 份（A)之連接步驟圖，第2圖A係已使用之黏著材膠帶 之端膠帶的剖面斜視圖，第2圖B係反折已使用之黏著材 膠帶來連接新黏著材膠帶之斜視圖，第3圖係黏著裝置之 黏著劑壓著步驟的槪略圖，第4圖係電路基板間之黏著的 剖面圖，第5圖係黏著材膠帶之製造方法的步驟圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。亦即’各盤3、3 a具有捲軸5、及分別配置於黏著材膠 帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -52- 200913828 之黏著劑11所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑11係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋構成前述導電粒子1 3之材料 所構成之導電層等來形成導電粒子1 3。此外，亦可應用以 絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或倂用導 電粒子1 3及絕緣粒子等。在焊錫等之熱熔融金屬、或塑 膠等之高分子核材上形成導電層者，會具有因加熱加壓或 加壓而產生變形之變形性，故連接後之電極間距離會縮小 ’連接時可增加和電路之接觸面積，而可提高信賴性。尤 其是’以高分子類做爲核材更佳，因導電粒子1 3如焊錫 並沒有融點’在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 -53- 200913828 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15’將捲繞於盤3a上之黏著材膠帶 1的前端經由導引銷2 2裝設至捲取盤1 7 ,並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上’以配置於兩盤3 a、1 7間之加熱加壓 頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1 壓著至電路基板21。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連接 。正式連接如第4圖所示，在壓著至電路基板21上之黏 著劑1 I上配置配線電路（或電子構件）2 3，必要時，可 將例如聚四氟乙烯材2 4當做緩衝材，以加熱加壓頭1 9對 電路基板2 1實施配線電路2 3之加熱加壓。利用此方式， 可連接電路基板2 1之電極2 1 a及配線電路23之電極23a 〇 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大’有時會對PDP之周圍全體實施壓著，連接部份會較多 ’一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多’捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第1圖）。 本發明之黏著材膠帶之連接方法可以分成下述2種， -54 - 200913828 (a)直接使用捲取盤17，更換已使用之黏著材膠帶丨之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤17’ （b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤1 7使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b )時’如第1圖所示，爲了將盤3 a更換成新黏著 材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏著材 膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於新黏 著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1之始 端部3 2之連接。 此黏著材膠帶1之連接上，在露出已使用之盤3a之 黏著材膠帶1之結束標記28時，會如第2圖A所示，會 從黏著材膠帶1之結束標記28附近切斷（B )，並將黏著 材膠帶1之終端部3 0反折，使黏著材膠帶1之黏著劑1 1 面位於上側（第2圖B )。其次，將新黏著材盤3之黏著 材膠帶1之始端部32之黏著劑11面重疊於已使用之盤3a 之黏著材膠帶1之終端部30之黏著劑11面上（第2圖B )° 其次，如第4圖所示，將兩者之重疊部份置於工作台 104上，以黏著裝置15之加熱加壓頭19實施加熱加壓進 行黏著。利用此方式，即可連接捲繞於已使用之盤3 a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1。其 次，將已使用之盤3 a及新盤3互相對換’將新盤3裝著 至黏著裝置15。因此，無需實施將黏著材膠帶1裝著至捲 -55- 200913828 取盤1 7之作業。又，因以黏著劑1 1面間之重疊來進行黏 著，故有較高之連接強度。 又，黏著材膠帶1上之結束標記28之位置，當黏著 材膠帶1從已使用之盤（黏著材膠帶1完全捲出之盤）3a 延伸至加熱加壓頭1 9爲止時，應爲從黏著材膠帶1固定 於已使用之盤3a上之固定位置至加熱加壓頭19爲止之長 度的位置上。此時，從結束標記2 8之附近切斷，即使從 必要之最小位置切斷黏著材膠帶1，除了可防止黏著材膠 帶1之浪費以外，當可避免將拆下已使用之盤3a並移動 已使用之盤3a使結束標記28到達加熱加壓頭19之位置 的繁複作業。 此實施形態時，因黏著裝置1 5具有加熱加壓頭1 9， 並利用此加熱加壓頭1 9來實施已使用之盤3 a之黏著材膠 帶1之終端部3 0之黏著劑1 1、及新黏著材盤3之黏著材 膠帶1之始端部3 2之黏著劑1 1的連接’故無需另外使用 以實施黏著劑11間之壓著爲目的之壓著用器具，即可實 施已捲繞著黏著材膠帶1之盤3、3a之更換。 直接使用（a)之捲取盤17’將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤17之連接時’在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記28附近切斷，將殘留於捲取盤1 7側之黏著材 膠帶之終端部反折，使黏著劑11面成爲上側。其次’使 此黏著材膠帶1之終端部之黏著劑11面、及新黏著材盤3 -56- 200913828 之黏著材膠帶1之始端部3 2之黏著劑1 1面互相重疊。其 次’將兩者之重疊部份置於工作台1〇4上，以黏著裝置15 之加熱加壓頭1 9進行加熱加壓實施黏著。利用此方式， 可連接捲繞於捲取盤1 7上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1。利用此方式，因爲捲取盤17只會捲 取基材9，故可捲取數個黏著材盤份，減少捲取盤1 7之更 換次數，而有良好之作業效率。 此處’參照第5圖’針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機2 7塗布由樹脂及導電粒子丨3混合而成之黏著劑1丨，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上 ，或者，捲取至附側板之捲軸上，將其和除濕材一起綑包 ，實施低溫（-5°C〜- l〇°C )之管理並進行出貨。 其次，針對本發明之第2實施形態進行說明，以下之 說明係以和上述實施形態不同之點爲主。 第6圖所示之第2實施形態時，係利用新黏著材盤3 之黏著材膠帶1之始端部32具有之前導膠帶41，實施新 黏著材盤3之黏著材膠帶1、及捲繞於已使用之盤3a上之 黏著材膠帶1之連接。前導膠帶41係由基材63及其背面 之黏著劑43面所構成，新黏著材盤3之黏著材膠帶1之 始端部3 2，係利用前導膠帶4 1貼附於捲附至盤上之黏著 -57- 200913828 材膠帶1之基材9面來固定。其次，從基材9面剝離前導 膠帶41，並使其和反折之黏著材膠帶1之終端部30之黏 著劑1 1面重疊。將兩者之重疊部份置於工作台1 〇4上， 以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著。 如此，因爲利用黏著材膠帶1之前導膠帶41實施全部捲 出之黏著材膠帶1之終端部3 0、及新裝著之黏著材膠帶1 之始端部3 2的黏著，故黏著材膠帶1間之連接十分簡單 。此時，配設於前導膠帶41之基材63之背面側的黏著劑 43面具有黏著性，亦可只利用使其重疊於反折之黏著材膠 帶1之終端部3 0之黏著劑1 1面的方式來實施連接。 本發明並未受限於上述之實施形態，只要在未背離本 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，不反折捲繞於已使用 之盤3a上之黏著材膠帶1，而如第7圖所示，從基材9面 剝離新裝著之黏著材膠帶1之始端部3 2之前導膠帶4 1， 並將其貼附於背面之黏著劑1 1面，使前導膠帶4 1連接於 已使用之黏著材膠帶1之終端部3 0之黏著劑1 1面，再以 黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著亦可 。此時，因無需反折全部捲出之黏著材膠帶1，故可防止 將黏著材膠帶1捲取至捲取盤時可能發生之捲取散亂。 此時，從基材9面剝離黏著材膠帶1之始端部3 2之 前導膠帶41，並將前導膠帶41黏著於已使用之黏著材膠 帶1之基材9面亦可。 其次，針對申請專利範圍第5〜8項記載之發明進行 -58- 200913828 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5〜8項記載之發明之背 景技術進行說明。 一般而言，液晶面板' PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 -59- 200913828 增加。又’因爲黏著劑之用途之擴大’黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高’可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5〜8項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照第8圖A〜C、第3圖〜第5圖，針對本 發明之第1實施形態進行說明。第8圖A〜C係第1實施 形態之黏著材膠帶之連接方法圖，第8圖A係黏著材盤間 之連接的斜視圖，第8圖B係第8圖A之連接部份之連接 方法的斜視圖，第8圖C係第8圖A之連接部份之平面圖 〇 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 -60- 200913828 7。本實施形態時’黏著材膠帶1之長度約爲5 0m、寬度 W約爲5mm。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋構成前述導電粒子13之材料 所構成之導電層等來形成導電粒子1 3。此外，亦可應用以 絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或倂用導 電粒子1 3及絕緣粒子等。在焊錫等之熱熔融金屬、或塑 膠等之高分子核材上形成導電層者，會具有因加熱加壓或 加壓而產生變形之變形性，故連接後之電極間距離會縮小 ，連接時可增加和電路之接觸面積，而可提高信賴性。尤 其是’以高分子類做爲核材更佳，因導電粒子1 3如焊錫 -61 - 200913828 並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取 盤1 7裝著至黏著裝置1 5，將捲繞於盤3 a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤1 7，並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加壓 頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1 壓著至電路基板21。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，必要時，可 將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭1 9對 電路基板2 1實施配線電路2 3之加熱加壓。利用此方式， 可連接電路基板21之電極21a及配線電路23之電極23a 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 -62- 200913828 內會被捲取至捲取盤17 ’而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第8圖A )。 本發明之黏著材膠帶之連接方法可以分成下述2種’ (a)直接使用捲取盤17’更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶’並連接新黏著劑膠帶及捲取 盤17，（b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤17使用’並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b )時，如第8圖A所示，爲了將盤3 a更換成新黏 著材盤3，在盤3 a之黏著材膠帶1露出結束標記2 8時’ 會實施盤3 a之黏著材膠帶（一方之黏著材膠帶）1之終端 部3 0、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之 黏著材膠帶）之始端部32之連接（參照第8圖A )。 此黏著材膠帶1之連接上’如第8圖B及C所示，會 針對黏著材盤3 a之黏著材膠帶1之終端部3 0、及新黏著 材盤3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著 劑11面重疊於終端部30之基材9面上。其次，將略呈3 字形之卡止銷46插入重疊部份，實施黏著材膠帶1之終 端部30、及新黏著材盤3之黏著材膠帶1之始端部32之 連接。 利用此方式，可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，可以卡止銷46固定已全部捲出之黏著材膠帶1之終 端部3 0、及新裝著之黏著材膠帶1之始端部3 2 ’故連接 -63- 200913828 十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤1 7之作業。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之始端 部32重疊。其次，將略呈3字形之卡止銷46插入兩者之 重疊部份，實施黏著材膠帶1之終端部3 0、及新黏著材盤 3之黏著材膠帶1之始端部3 2之連接。 因爲捲取盤17只會捲取基材9，故可捲取數個黏著材 盤份。因此，可減少捲取盤17之更換次數，而有良好之 作業效率。 其次，針對申請專利範圍第5〜8項記載之發明的第2 〜第4實施形態進行說明，以下說明之實施形態中，相同 部份會附與相同符號並省略該部份之詳細說明，以下之說 明係以和上述第1實施形態不同之點爲主。 第9圖所示之第2實施形態時，係利用具有配設於一 方及另一方之端部之爪部48、49、及連結兩端之爪部以 、4 9之彈性構件5 0的卡止構件4 7，實施一方之黏著材膠 帶1之終端部3 0及另一方之黏著材膠帶1之始端部3 2之 • 64 - 200913828 連接。具體而言，使一方之黏著材膠帶1之終端咅f 另一方之黏著材膠帶1之始端部32互相抵接’使 卡止構件4 7之一端之爪部4 8卡止於終端部3 G ’並 於另一端之爪部4 9卡止於始端部3 2，並以彈性構1 近一方之爪部48及另一方之爪部49。又，爪部48 在板構件之背面配設前端爲尖形之複數爪5 1者。 因係使配設於卡止構件47之一端之爪部48卡 端部3 0，並使配設於另一端之爪部4 9卡止於始端ΐ 連接兩者，故連接十分容易。又，因爲一方之爪部 另一方之爪部49之間具有彈性構件5 0，彈性構件 展而將卡止構件47之另一方之爪部49卡止於另一 著材膠帶1之始端部3 2之任意位置上，故連接具 由度。 第1 〇圖所示之第3實施形態時，會針對捲繞 用之盤3 a上之黏著材膠帶1之終端部3 0、及新黏 3之黏著材膠帶1之始端部3 2，使始端部3 2之黏 面重疊於終端部3 0之基材9面上，其次，以橫剖 3字形之可彈性變形之夾子5 3夾住重疊部份實施 因爲只以夾子5 3夾住重疊部份來實施連接，故連 十分容易。 第1 1圖所示之第4實施形態時，係在第1實 中，以橫剖面略呈3字形之金屬製夾持片55覆蓋 份’並從重疊部份之兩面壓扁夾持片55來連接兩 係從重疊部份之兩面壓扁夾持片5 5來實施連接， "0及 配設於 .使配設 牛50拉 、47係 止於終 部32來 48及 50可伸 方之黏 有高自 於已使 著材盤 著劑1 1 面略呈 固定。 接作業 施形態 重疊部 者。因 故可利 -65 - 200913828 用重疊部份獲得強固之連接。 申請專利範圍第5〜8項記載之發明並未受限於上述 實施形態，只要未背離申請專利範圍第5〜8項記載之發 明之要旨的範圍內，可實施各種變形。 例如，上述之第1實施形態時，卡止銷46並非略呈 3字形’而爲1支線狀銷亦可，此時，應以複數個銷來固 定重疊部份。 第2實施形態時，亦可配合黏著材膠帶！之寬度來使 用複數個卡止構件47。 第3實施形態及第4實施形態時，亦可使用複數個夾 子53或夾持片55，並分別從黏著材膠帶1之重疊部份之 兩側進行固定。 其次，針對申請專利範圍第9〜1 3項記載之發明進行 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第9〜1 3項記載之發明之背 景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開2 0 0 1 -2 8 4 0 0 5號公報，係記載著將在基材上 -66- 200913828 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 -67- 200913828 會增大’可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第9〜1 3項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單’而提高電子機器之生產效率。 其次’參照附錄圖面，針對申請專利範圍第9〜1 3項 記載之發明之實施形態進行說明，首先，參照第1 2圖A 、B、第3圖〜第5圖，針對申請專利範圍第9〜13項記 載之發明之第1實施形態進行說明。第1 2圖A〜C係第1 實施形態之黏著材膠帶之連接方法圖，第1 2圖A係黏著 材盤間之連接的斜視圖，第1 2圖B係第1 2圖A之連接部 份之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲5 0m、寬度 W約爲3 m m。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 -68- 200913828 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取盤 17裝著至黏著裝置15，捲繞於盤3a上之黏著材膠帶1之 前端裝設至捲取盤7，並捲出黏著材膠帶1(第3圖中之 箭頭E)。其次，將黏著材膠帶1配置於電路基板21上 ’以配置於兩盤3 a、1 7間之加熱加壓頭1 9從基材9側實 施黏著材膠帶1之壓接，將黏著劑11壓著至電路基板21 。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 -69- 200913828 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑1 1上配置配線電路（或電子構件）2 3，必要時 ，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭 1 9對電路基板2 1實施配線電路2 3之加熱加壓。利用此方 式，可連接電路基板2 1之電極2 1 a及配線電路2 3之電極 2 3 a 〇 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第1 2圖A )。 申請專利範圍第9〜1 3項記載之發明之黏著材膠帶之 連接方法可以分成下述2種，（a )直接使用捲取盤1 7， 更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠帶 ，並連接新黏著劑膠帶及捲取盤17，（b)將已使用之黏 著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 〇 (b)時，如第12圖A所示，爲了將盤3a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 者材膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於 -70- 200913828 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部3 2之連接（參照第12圖A )。 此黏著材膠帶1之連接上，如第12圖B所示’會針 對黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材 盤3之黏著材膠帶1之始端部32，使始端部32之黏著劑 11面重疊於終端部30之基材9面上。兩者之重疊長度Η 爲黏著劑膠帶1之寬度W的大約2·5倍，將其置於工作台 3 6上，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施 黏著。利用此方式，可實施捲繞於已使用之盤3a上之黏 著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。 其次，將已使用之盤3a及新盤3互相對換，將新盤3裝 著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝著 至捲取盤1 7之作業。 此實施形態因係利用加熱加壓頭1 9，無需另行採用黏 著劑間之壓著用器具，即可更換捲繞著黏著材1之盤3、 3 a 〇 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，在露出已使用 之盤3 a之黏著材膠帶1之結束標記2 8時從黏著材膠帶1 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之始端 部3 2互相重疊。其次’以黏著裝置1 5之加熱加壓頭1 9 對兩者之重疊部份進行加熱加壓實施黏著。因爲捲取盤j 7 -71 - 200913828 只會捲取基材9，故可捲取數個黏著材盤份，減少捲取盤 1 7之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶之原始材料，以切割機3 3切成特定寬 度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上， 或者，捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（_ 5 °C〜-1 Ot )之管理並進行出貨。 其次，針對申請專利範圍第9〜1 3項記載之發明之其 他實施形態進行說明，以下說明之實施形態中，和上述實 施形態相同之部份會附與相同符號並省略該部份之詳細說 明，以下之說明係以和上述實施形態不同之點爲主。 第1 3圖所示之第2實施形態時，以表面爲參差不齊 (凹凸）44而爲互相嵌合之一方之模具56、及另一方之 模具57夾持黏著材膠帶1之重疊部份34，使重疊部份34 形成凹凸5 8。如此，利用形成凹凸5 8，可增加重疊部份 34之黏著面積’且利用重疊部份34之凹凸58的卡合可提 高拉伸方向（黏著材膠帶之縱向）之強度。形成凹凸時， 黏著劑1 1會流動而以黏著劑黏著重疊部份之端面間，可 進一步提高重疊部份34之拉伸方向的強度。 第1 4圖A及第14圖B所示之第3實施形態時，會將 -72- 200913828 捲取至新黏著材1之盤3之始端部3 2彎折成略呈V字形 ，捲繞於已使用之盤3 a上之黏著材膠帶1之終端部3 0亦 彎折成略呈V字形，使兩者成爲鈎狀必須黏著劑η互相 相對並卡止（第1 4圖A)，以加熱加壓頭1 9實施加熱加 壓來連接兩者（第14圖B )。此第3實施形態時，因終 端部3 0及始端部3 2係以鈎狀連結而可獲得強固之連結， 同時，因利用黏著劑1 1之重疊來連接，故可得到更爲強 固之連接。和上述相同，因爲黏著劑會在重疊部份流動並 黏著端面，故可獲得更強固之連接。 第1 5圖A及第1 5圖B所示之第4實施形態，係在第 1實施形態之加熱加壓前、或加熱加壓之同時在重疊部份 3 4形成貫通孔5 9。利用形成貫通孔5 9，加熱加壓時可使 黏著劑U從貫通孔59之周圍滲出並實施黏著而提高黏著 力，重疊部34可獲得強固之連接。 申請專利範圍第9〜1 3項記載之發明並未受限於上述 之實施形態，只要不背離申請專利範圍第9〜1 3項記載之 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，凹凸5 8不必爲山型 ，亦可以爲具弧形之九形。 第4實施形態時，貫通孔5 9之數並無特別限制，可 以爲任何數量。又，貫通孔5 9之直徑並無限制。又，第2 、第3實施形態時，亦可進一步在重疊部份3 4上形成H 通孔5 9。 其次，針對申請專利範圍第1 4〜1 8項記載之發明進 -73- 200913828 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開200 1 -28400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。黏著材盤之裝著後， 從自黏著材盤捲出之黏著材膠帶之基材側以加熱加壓頭將 黏著劑壓著至電路基板等上，再以捲取盤捲取殘餘之基材 〇 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，將黏著材膠帶之始端經由黏著裝置之導引銷裝 設至捲取盤。 -74- 200913828 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大’一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，而可能 因爲黏著劑從膠帶兩側滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 另一方面’以黏黏著材膠帶貼附黏著材膠帶及黏著材 膠帶並無法充分黏著力實施黏著。爲了使黏著材膠帶具有 良好黏著材剝離性，會在其上塗布氟系脫模劑或矽系脫模 劑等，而上述情形就是因爲其影響。 因此’申請專利範圍第1 4〜1 8項記載之發明的目的 ，係在提供一種黏著材膠帶之連接方法，尤其是黏著材膠 帶之基材採用經過矽處理之基材時，亦可使黏著材盤之更 換較爲簡單’而提高電子機器之生產效率。 其次’參照附錄圖面，針對申請專利範圍第1 4〜1 8 -75- 200913828 項記載之發明之實施形態進行說明’首先’參照第16圖 A、B、第3圖〜第5圖’針對申請專利範圍第14〜1 8項 記載之發明之第1實施形態進行說明。第1 6圖A及B係 第1實施形態之黏著材膠帶之連接方法圖’第16圖A係 黏著材盤間之連接的斜視圖’桌1 6圖B係弟1 6圖A之連 接部份（b )之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏著材膠帶1係由矽處理基材9、及塗布於矽處理基 材9之一側面之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 矽處理基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 PET (聚對苯二甲酸乙二酯）等之基材所構成，其表面利 用矽樹脂等實施表面處理。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系 '矽樹脂系爲代表。 黏者劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag ' Pt、Ni ' Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及非導電性之玻璃 '陶瓷 、塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子 -76- 200913828 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取盤 1 7裝著至黏著裝置1 5，將捲繞於盤3 a上之黏著材膠帶1 之前端裝設至捲取盤17，並捲出黏著材膠帶1(第3圖中 之箭頭E)。其次，將黏著材膠帶1配置於電路基板2 1 上，以配置於以配置於兩盤3 a、1 7間（；：配置之加熱加壓 頭1 9從矽處理基材9側實施黏著材膠帶1之壓接，將黏 著劑1 1壓著至電路基板2 1。其後，將矽基材9捲取至捲 取盤1 7。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑1 1上配置配線電路（或電子構件）2 3，必要時 ，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭 1 9對電路基板2 1實施配線電路23之加熱加壓。利用此方 -77- 200913828 式’可連接電路基板21之電極21a及配線電路23之電極 23a ° 利用本實施形態之黏著材膠帶1之P D P，其尺寸會較 大’有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此’捲繞於盤3a上之黏著材膠帶丨之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第16圖A )。 申請專利範圍第1 4〜1 8項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a)直接使用捲取盤17 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17，（b)將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤17 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 〇 (b)時，如第16圖A所示，爲了將盤3a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始ϋ而部3 2之連接。 此黏著材膠帶1之連接上，如第16圖Β所示，黏著 材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材盤3之 黏著材膠帶1之始端部3 2會互相抵接，以跨越兩黏著材 -78- 200913828 膠帶1、1之矽處理基材9、9之表面的方式貼附矽黏著膠 帶60，實施兩黏著材膠帶1、1之連接。 此矽黏著膠帶60係由基材63及塗布於基材63之單 面之矽黏著劑62所構成。基材63之材質並無特別限制， 然而，本實施形態係聚醯亞胺樹脂材。又，第1 6圖B中 ，黏著材膠帶之黏著劑11及矽黏著膠帶60之黏著劑部份 4 3分別以斜線表示。 此處，針對矽黏著膠帶60之黏著進行說明。一方及 另一方之黏著材膠帶1、1之矽處理基材9、9因爲分別覆 蓋著矽，故難以利用黏著劑進行黏著，然而，本實施形態 時，因矽黏著膠帶60之黏著劑43係採用矽樹脂，兩矽處 理基材9、9之表面張力差會較小，利用密著（黏著）可 使一方之黏著材膠帶1之終端部3 0及另一方之黏著材膠 帶1之始端部3 2有良好之連接。矽黏著膠帶6 〇之矽黏著 劑62表面' 及矽處理基材9、9表面之表面張力差應爲 10mN/m ( 10dyne/cm)以下，本實施形態時，幾乎沒有表 面張力差。 —般而言，一方之黏著材膠帶1之終端部30及另一 方之黏著材膠帶1之兩矽處理基材9、9之表面張力爲 25mN/m~ 60mN/m ( 25~ 60dyne/cm)，例如，表面張力爲 3 OmN/m時，矽黏著膠帶60之矽黏著劑62之表面張力應 設定成20mN/m以上、40mN/m以下。 石夕系黏者劑主要係由砂橡膠及砂樹脂所構成，一般而 言’係使兩者產生少許縮合反應而具有黏著性，其次，利 -79- 200913828 用過氧化物、白金觸媒之矽氫化反應使其交 溫度爲-1 oot以下者。上述皆爲市販品，可 用。 如此，利用矽黏著膠帶60實施捲繞於 材盤3 a上之黏著材膠帶1 '及捲繞於新黏著 著材膠帶1之連接。其次，將已使用之黏毫 黏著材盤3互相對換，將新黏著材盤3裝著 。因此，無需拉出新黏著材盤3之黏著材膠 材膠帶裝著至捲取盤17、或將新黏著材膠帶 裝置15之導引銷36之作業，故黏著材盤3 良好之作業效率。如此，因爲已全部捲出之 之終端部3 0、及新裝著之黏著材膠帶1之免 矽黏著膠帶進行連接，故連接十分簡單。 其次，將已使用之盤3 a及新盤3互相癸 裝著至黏著裝置丨5。因此，無需將新黏著材 捲取盤1 7之作業。 直接使用（a )之捲取盤1 7 ’將已使用 1之殘餘捲數變少的黏著劑膠帶更換成新黏 實施新黏著劑膠帶及捲取盤17之連接時，i 之黏著材膠帶1之結束標記2 8露出時’會右 之結束標記28附近實施切斷，使殘留於捲耳 著材膠帶之終端部3 0、及新黏著材盤3之黏 始端部3 2互相抵接。其次’在兩者之抵接 著膠帶實施黏著材膠帶1之終端部30、及新 聯，玻璃轉移 選擇適當者使 已使用之黏著 材盤3上之黏 P材盤3a及新 於黏著裝置1 5 帶1並將黏著 1裝設至黏著 、3a之更換有 黏著材膠帶1 3端部32係以 ί換，將新盤3 膠帶1裝著至 之黏著材膠帶 著劑膠帶，並 己使用之盤3 a ί黏著材膠帶1 Ζ盤1 7側之黏 著材膠帶1之 部份利用矽黏 黏著材盤3之 -80- 200913828 黏著材膠帶1之始端部32的連接。因爲捲取盤17只會捲 取基材9’故可捲取數個黏著材盤份，減少捲取盤I?之更 換次數’而有良好之作業效率。 其次，參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後，以捲取機3 1捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機3 3切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者， 捲取至附側板之捲軸上，將其和除濕材一起綑包，實施低 溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第1 7圖所示之第2實施形態時，除了如上述之第1 實施形態以外，在一方之黏著材膠帶1之終端部3 0、及另 一方之黏著材膠帶之始端部3 2之黏著劑11面側亦貼附著 矽黏著膠帶6 0。此第2實施形態之矽黏著膠帶6 0之矽黏 著劑62，其黏著力爲l〇〇g/25mm以上，本實施形態時則 爲700g/25mm〜1 400g/25mm。又，矽黏著膠帶60之矽黏 著劑62之表面張力的設定上，係和上述實施形態相同’ 一方及另一方之黏著材膠帶之矽基材之表面張力差爲 -81 - 200913828 10mN/m ( lOdyne/cm)以下。此第2實施形態時’ 一方之 黏著材膠帶1之終端部3 0及另一方之黏著材膠帶之始端 部32之兩面，因以矽黏著膠帶60實施黏著’可以較第1 實施形態更高之強度來實施兩黏著材膠帶丨、1之黏著。 第1 8圖所示之第3實施形態，係以重疊方式配置一 方之黏著材膠帶1之終端部30及另一方之黏著材膠帶1 之始端部3 2，其矽處理基材9側面及黏著材1 1側面則貼 附著第2實施形態之矽黏著膠帶60，利用此第3實施形態 ，可獲得和第2實施形態相同之作用效果。 第1 9圖所示之第4實施形態，係在一方之黏著材膠 帶1之終端部3 0、及另一方之黏著材膠帶1之始端部3 2 之間，存在基材之兩面塗布著矽黏著劑62之矽黏著膠帶 61，用以連接終端部3 0及始端部3 2。利用此第4實施形 態，因係使用兩面之矽黏著膠帶61，一方之黏著材膠帶1 之終端部3 0及另一方之黏著材膠帶1之始端部3 2的連接 更爲十分簡單且容易。 其次，針對申請專利範圍第1 9〜2 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 9〜2 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( -82- 200913828 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率’然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 -83- 200913828 3mm ’若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第1 9〜2 1項記載之發明的目的 ’係黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡 單’而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第1 9〜第 2 1項記載之發明之實施形態進行說明，首先，參照第2 0 圖A〜C、第2 1圖 '第4圖、及第5圖，針對申請專利範 圍第1 9〜2 1項記載之發明之第丨實施形態進行說明。第 20圖A〜C係本實施形態之黏著材膠帶之連接方法圖，第 20圖A係黏著材盤間之連接的斜視圖，第2〇圖b及C係 第20圖A之連接部份之連接方法的剖面圖。 黏著材膠帶1係分別捲繞於盤3 ' 3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑Π所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言’ 基材9應由〇PP (延伸聚丙烯）、聚四氟乙烯、以及經過 石夕處理之PET (聚對苯二甲酸乙二酯）等所構成’然而’ -84 - 200913828 並不限於此。 黏著劑U係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化丨生樹β曰系則以環氧樹脂系、乙'丨希基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Mi、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層而形成者。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小’連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是’以高分子類做爲核材更佳，如焊錫因沒有融點， 在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很容 易即可對應電極之厚度及平坦性之誤差的連接構件。 其次’針對本實施形態之黏著材膠帶之使用方法進行 說明。如第21圖所示，將黏著材膠帶丨之盤3a、及捲取 盤17裝者至黏者裝置is，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤17，並捲出黏著材 膠rtj 1 (弟21圖中之箭頭e)。其次，將黏著材膠帶1配 置於電路基板2 1上，利用配置於兩盤3、1 7間之加熱加 -85- 200913828 壓頭19從基材9側實施黏著材膠帶1之壓接，將黏著劑 1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤1 7 〇 上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）2 3，必要 時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭1 9對電路基板21實施配線電路2 3之加熱加壓。利用 此方式，可連接電路基板2 1之電極2 1 a及配線電路23之 電極2 3 a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑1 1的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記28 (參照第20圖A )。 申請專利範圍第1 9〜2 1項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a)直接使用捲取盤17 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17， （b)將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤1 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 -86- 200913828 (b)時，如第20圖A所示，爲了將盤3a更換成新 黏著材盤3，在盤3a之黏著材膠帶1露出結束標記28時 ’盤3a之黏著材膠帶（一方之黏著材膠帶）1之終端部 3〇、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之黏 著材膠帶）1之始端部3 2係利用樹脂製黏著劑64實施連 接。 樹脂製黏著劑64係例如環氧樹脂、氰酸樹脂、二馬 來醯亞胺樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂、醇酸 樹脂、壓克力樹脂、不飽和聚酯樹脂、苯二酸二烯丙酯樹 脂、矽樹脂、間苯二酚甲醛樹脂、二甲苯樹脂、呋喃樹脂 、聚胺酯樹脂、酮樹脂、三聚烯丙基胺氰樹脂等。 此黏著材膠帶1之連接如第20圖B所示，針對黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部3 2，使始端部32之黏著劑1 1面重 疊於終端部3 0之基材9面。其次’利用組合於黏著裝置 U之充塡機65將糊狀之樹脂製黏著劑64塗布於重疊部份 。其次，如第2 0圖C所示’此樹脂製黏著劑6 4爲熱硬化 性樹脂時，利用組合於黏著裝置1 5之加熱器6 6之加熱實 施硬化，連接黏著材膠帶1之終端部3 0、及新黏著材盤3 之黏著材膠帶1之始端部3 2。 利用此方式’可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此’以樹脂製黏著劑64固定已全部捲出之黏著材膠帶1 -87- 200913828 之終端部30、及新裝著之黏著材膠帶1之始端部32 ’故 連接十分簡單。 其次，將已使用之盤3 a及新盤3互相對換’將新盤3 裝著至黏著裝置15。因此’無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤17之連接時，已使用之盤3a 之黏著材膠帶1之結束標記28露出時會從黏著材膠帶1 之結束標記28附近實施切斷，使殘留於捲取盤1 7側之黏 著材膠帶之終端部3 0及新黏著材盤3之黏著材膠帶1之 始端部32重疊。其次，在兩者之重疊部份塗布糊狀之樹 脂製黏著劑64，依據使用之樹脂製黏著劑之種類實施加熱 、紫外線照射等使其發揮黏著力，實施終端部3 0、及新黏 著材盤3之黏著材膠帶1之始端部32之連接。因爲捲取 盤1 7只會捲取基材9，故可捲取數個黏著材盤份，減少捲 取盤1 7之更換次數，而有良好之作業效率。 此處’參照第5圖’針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在1>fc捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑u，並 以乾燥爐2 9實施乾燥後’以捲取機3 1捲取原始材料。被 捲取之黏者材膠帶之原始材料’以切割機33切成特定寬 度並捲取至捲軸後’從兩側將側板7、7裝著於捲軸上， -88- 200913828 或者’捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 申請專利範圍第1 9〜2 1項記載之發明並未受限於上 述之實施形態，只要未背離申請專利範圍第1 9〜2 1項記 載之發明之要旨的範圍內，可實施各種變形。 本實施形態時，樹脂製黏著劑6 4係以熱硬化性樹脂 爲例’然而’亦可以光硬化性樹脂取代熱硬化性樹脂，以 紫外線等之光照射實施硬化性樹脂之硬化，實施黏著材膠 帶1間之連接。 此時，光硬化性樹脂可採用在具有丙烯酸基或甲基丙 烯酸基之樹脂調合光聚合起動劑之組成物、或含有芳香族 重偶氮鹽、二烯丙基碘氫基鹽、鎏鹽等光硬化劑之環氧樹 脂等。 又’樹脂製黏著劑亦可採用以乙烯乙酸乙烯酯樹脂或 聚烯烴樹脂爲主成分之熱金屬黏著材，例如板狀之熱金屬 黏著材時，將板狀之熱金屬黏著劑置於黏著材膠帶1間之 重疊部份上，以加熱器6 6對熱金屬黏著劑進行加熱使其 熔融後，再以冷卻使熱金屬黏著劑固化，實施黏著材膠帶 1間之連接。 使用於黏著材膠帶1之連接之樹脂製黏著劑，亦可從 熱硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑所構成之 群組中選取複數種來使用。200913828 IX. TECHNICAL FIELD The present invention relates to electronic components and circuit boards, Or electrically fixed, And the electrical connection between the electrodes of the two is carried out. Production method, Pressing method, Adhesive device, Adhesive tape box, And the adhesives used therein, in particular, And a roll of adhesive tape, Connection method Pressing method, Adhesive tape tray, Adhesive device, Adhesive, Using its adhesive pressing method, And different conductive material tape [Prior Art] Generally speaking, LCD panel, PDP (Electronic Display Panel Fluorescent Display) panel, Adhesion between an electronic component such as a bare chip package and an electric or circuit substrate, And the means between the electrodes of the two are made of adhesive tape. Japanese Patent Laid-Open No. 2001-284005, It is described that the adhesive tape of the cloth adhesive material is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape is about 50 m. When the adhesive tape is attached to the adhesive device, The adhesive material (hereinafter referred to as "adhesive plate") is attached to the adhesive device at the beginning of the tape and is attached to the take-up reel. Secondly, From the side of the substrate from which the adhesive tape is taken up, a substrate is adhered by a heating and pressing head, and the remaining substrate is taken up by a take-up reel. Adhesive tape between the substrates Method, , Manufacturing kit tape box related. ), EL (road substrate, Electrical connection Roll up to the tray of the tape ^ Pull out the adhesive sheet and press it to -6- 200913828 Second, When the adhesive tape of the adhesive sheet is used up, 'Remove the used tray, And the take-up reel of the take-up substrate, the new reel and the new adhesive are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. SUMMARY OF THE INVENTION In recent years, As the panel screen of a PDP or the like is enlarged, the adhesion area of the circuit board (or the size of one side of the circuit) is also increased. The amount of the adhesive used at one time also increases. also, Because of the expansion of adhesive use, the amount of adhesive used has also increased. therefore, The replacement of the adhesive discs in the manufacturing plants of electronic machines is more frequent. Because the replacement of the adhesive sheet is very troublesome, Therefore, there is a problem that the production efficiency of the electronic machine cannot be improved. For this issue, Consider increasing the number of rolls of adhesive tape that is taken up to the disc, To increase the adhesion dose per plate, It is used to reduce the frequency of replacement of the disk. 'However' because the tape width of the adhesive tape is a narrower 1~3 mm ’. If the number of rolls is increased, the winding may be scattered. also, If you increase the number of volumes, The pressure on the adhesive tape that is wound into a tape shape will increase. It may cause the adhesive to seep from both sides of the tape and become a cause of blockage. In addition, If the number of rolls of adhesive tape increases, The diameter of the disc will also increase. It may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. therefore, The object of the present invention is to provide a method for joining adhesive tapes, Drilling tape, Manufacturing method thereof, Pressing method, Adhesive tape, Adhesive device, Adhesive tape box, Using its adhesive pressing method, And different conductive tape, It is very simple to replace the adhesive sheet. And 200913828 can improve the production efficiency of electronic machines. The invention described in the first aspect of the invention is for attaching an adhesive tape on one side of a substrate to which a pressure-sensitive adhesive for electrode connection is applied to a substrate. And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Reflex the end of one of the adhesive tapes, The adhesive surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped. And the overlapping portions of the two are heated and pressed to connect them. In the invention described in the first item of the patent application, Adhesive tape adhesive is used to adhere the end portion of the adhesive tape that is completely unrolled, And the beginning of the newly installed adhesive tape, Implement the replacement of the adhesive sheet, Therefore, it is very simple to attach the new adhesive tape to the adhesive device. also, Because there is no need to change the take-up tape every time you replace a new adhesive tape, Attaching the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. Because the end portion of the adhesive tape that is completely rolled out is folded back, And the adhesive surface of the adhesive tape and the adhesive surface of the newly-adhesive adhesive tape are overlapped, so that the connection strength is relatively large. The heating portion of the connecting portion is pressed by a heating and pressing head which is attached to the adhesive device of the adhesive sheet. The adhesive device can be reasonably utilized. Applying for the invention described in item 2 of the patent scope, For example, the invention described in claim 1 is applicable. Its characteristic is that The end of the adhesive tape on one side is marked with an end mark. 200913828 When the invention described in the second item of the patent application scope is In addition to the same effects as the invention described in claim 1 of the patent scope, 尙The cutting of the adhesive tape that is completely rolled out can be performed when the end mark is exposed. Therefore, the part that performs the cutting and connecting work is easy to unravel. and, The connection can be implemented with the least necessary location, It can prevent the waste of adhesive tape. Applying for the invention described in item 3 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that The other end of the adhesive tape is stopped by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk. After folding the end of one of the adhesive tapes, Then, the adhesive surface of the leading tape and the adhesive surface of the end of one of the adhesive tapes are overlapped. The overlapping portions are heated and pressed. In the invention described in the third paragraph of the patent application, Same as the invention described in the first paragraph of the patent application, It is very simple to load the new adhesive tape to the adhesive device. also, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. In addition, Because the adhesive tape is used to bond the end of the adhesive tape to the end of the adhesive tape, and the beginning of the newly attached adhesive tape. Therefore, it is very simple to implement the adhesion between the adhesive tapes. Applying for the invention described in item 4 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, The feature is that the beginning of the other adhesive tape -9-200913828 is stopped by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk. The adhesive surface of the leading tape is overlapped with the adhesive surface of the end portion of one of the adhesive tapes, Perform the heating of the overlap and press. When the invention described in the fourth aspect of the patent application is filed, Same as the invention described in the first paragraph of the patent application, It is very simple to load the new adhesive tape to the adhesive device. also, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. In addition, Because there is no need to fold the adhesive tape that is completely rolled out, When the adhesive tape is taken up to the take-up reel, It can prevent the rollup that may occur. Applying for the invention described in item 5 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Make the end of the adhesive tape on one side, And the other end of the adhesive tape overlaps the beginning end, Insert a locking pin to overlap the two to implement the connection. In the invention described in claim 5 of the patent application, Because the end portion of the adhesive tape that is completely rolled out is fixed by the locking pin, And the beginning of the newly installed adhesive tape, Therefore, the connection is very simple. And because there is no need to change the take-up tape every time you change a new adhesive tape, The installation of the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, It takes less time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. The invention described in the sixth aspect of the invention is based on the use of a locking member -10-200913828 to connect an adhesive tape for attaching one side of a substrate coated with an electrode-bonding adhesive to one side of the disk, And a method of attaching the adhesive tape to the adhesive tape of the adhesive tape of the other side of the other side of the tray, Its characteristic is that The locking member has claws disposed at one end and the other end, And an elastic member disposed between the claws, The end of the adhesive tape of one side and the beginning of the adhesive tape of the other side will abut each other. The claw portion provided at one end of the locking member is locked at the end portion of one of the adhesive tapes, The claws provided at the other end will be locked at the beginning of the other adhesive tape. Pull the claws of both sides with elastic members. In the invention described in claim 6 of the patent application, Because the claw of one of the locking members is locked to the end portion of the adhesive tape of one side, And, The other claw portion of the locking member is locked to the beginning end of the other adhesive tape. Implement the interconnection of the two, Therefore, the connection is very easy. also, Because there is an elastic member between the claw of one side and the claw of the other side, Therefore, The elastic member is stretchable so that the other claw of the locking member is locked at any position of the beginning end of the other adhesive tape, It is a connection with a high degree of freedom. also, Because the end of the adhesive tape of one side, And the other end of the adhesive tape is joined to each other in a state in which the initial ends of the adhesive tape are abutted. Without having to overlap the tapes, The connection can be implemented with the minimum necessary position, It can prevent the waste of adhesive tape. Applying for the invention described in item 7 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And the adhesive tape of the other side of the adhesive tape -11 - 200913828, which is taken up to the other side of the tray, It is characterized by 'the end of the adhesive tape of one side, And the other end of the adhesive tape overlaps the beginning end, Slightly cross-sectional; The 3-shaped elastically deformable clip performs the clamping and fixing of the overlapping portions of the two. In the invention described in claim 7 of the patent application, Because it is only necessary to clamp the end of the adhesive tape of one of the clips, And the overlapping part of the beginning end of the other adhesive tape can be connected. It is very easy to connect work. 申请 Apply for the invention described in item 8 of the patent scope. Its characteristic is that A metal-shaped holding piece having a slightly 3-shaped cross section sandwiches the overlapping portion of one of the adhesive tapes and the other adhesive tape. And the two pieces are pressed from both sides of the overlapping portion to connect the two. In the invention described in the eighth aspect of the patent application, Since the two pieces are flattened from the overlapping portions to connect the two, Therefore, the joint strength of the overlapping portions of the adhesive tape can be improved. Applying for the invention described in item 9 of the patent scope, It is used to connect an adhesive tape coated on the substrate with an adhesive for electrode connection to one of the disks on one side, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that Make the end of the adhesive tape on one side, And the adhesive surface of any one of the beginning ends of the other adhesive tape is superposed on the other substrate surface, The overlap length of the two is in the range of 2 to 50 times the width of the adhesive tape. The connection is carried out by heating with both. In the invention described in claim 9 of the patent application, Because the adhesive is adhered to the end of the used adhesive tape by adhesive -12- 200913828 And the beginning of the newly-adhesive adhesive tape is used to carry out the replacement of the adhesive sheet, so it is very simple to mount the new adhesive sheet onto the adhesive device. also, Because there is no need to change the take-up reel every time you replace a new adhesive tray, And the installation of the beginning of the new adhesive to the take-up tray' requires only a small amount of time to replace the new adhesive tray. Therefore, the production efficiency of the electronic machine can be improved. The length of the overlapping portion is 2 to 50 times the width of the adhesive tape. The reason is as follows, When it is less than 2 times, sufficient joint strength cannot be obtained. When it is more than 50 times, the adhesive material used in the joint portion may be excessively increased to cause waste of the adhesive material. The heating of the connecting part is pressed, If a heated pressurizing head with an adhesive device with an adhesive disc is used, The adhesive device can be reasonably utilized. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive. Can also be used only for insulating adhesives, Or , Dispersing insulating spacer particles in these adhesives. Applying for the invention described in item 1 of the patent scope, It is used to connect the substrate to the adhesive tape coated with the electrode-attaching adhesive to one of the plates, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the disk, Its characteristic is that Folding the end portion of one of the adhesive tapes in the opposite direction of the adhesive, And the other end of the adhesive tape is folded toward the opposite direction of the adhesive. Having the bent portions of the two overlap each other and the opposite faces of the two are opposite, The overlapping portions are heated and pressed. In the invention described in the first paragraph of the patent application, In addition to the same effects as the invention described in the first claim of the -13-200913828 patent application, The end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side are hooked to each other. And the adhesive faces of the two will be connected to each other. Therefore, there is a relatively strong connection strength. Applying for the invention described in item 11 of the patent scope, For example, if the invention described in Section 9 or 10 of the Patent Application is filed, The end of the adhesive tape on one side will be marked with an end mark. In the invention described in claim 1 of the patent application, Except for the same effects as the invention described in claim 9 or 10, Because the end part of the adhesive tape of one side uses the end mark part, The part that performs the connection work is easy to unravel and can be connected with the necessary minimum position. It can prevent the waste of adhesive tape. also, The end mark portion can be automatically detected. Therefore, the detection signal control device can be utilized. If an alarm can be issued, It can improve work efficiency. Applying for the invention described in item 12 of the patent scope, For example, the invention described in any one of the ninth to eleventh patent applications, Its characteristic is that To form a mold with one side of the bump, And the mold of the other side with which it is engaged, The overlapping part of the adhesive tape on one side and the adhesive tape on the other side, Apply heat and pressure. When the invention described in the second paragraph of the patent application scope is applied, In addition to the same effects as the invention described in any one of claims 9 to 11 of the patent application, Since the joint portion is formed with irregularities, the joint area can be enlarged. At the same time, the joint of the uneven portion can be used to increase the joint strength in the stretching direction (longitudinal direction) of the adhesive tape. -14 - 200913828 The invention described in claim 13 of the patent scope, The invention described in any one of the claims 9 to 11 is characterized in that after the overlapping portion of the adhesive tape and the other adhesive tape on one side forms a rental hole, The overlapping portions are heated and pressed. When the invention described in claim 13 of the patent application is filed, The adhesive has the same effect as the invention described in any one of the claims 9 to 11 because the adhesive portion of the connecting portion forms a through-hole, and the adhesive oozes to the inner edge of the through-hole. Increasing the adhesion area of the adhesive can further increase the joint strength. Applying for the invention described in item 14 of the patent scope, An adhesive tape for attaching one side of a substrate coated with an electrode-bonding adhesive to one of the disks, And a method of attaching the adhesive tape to the other adhesive tape of the other side of the tray, Its characteristic is that The end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side may overlap or abut, Adhesive tape is attached to the surface of the substrate by rubbing the adhesive tape between the two adhesive tapes. Implement the connection of the two adhesive tapes. In the invention described in claim 14 of the patent application, Adhesive tape of adhesive tape has been taken from one side, And the take-up reel of the substrate on which only the adhesive tape is taken up is attached to the adhesive device. When the adhesive tape of the adhesive sheet is used up, the end portion of the adhesive tape (one adhesive tape) that has been used up, The beginning of the adhesive tape of the newly-applied adhesive sheet (the other adhesive tape) is connected by adhesive tape. The new adhesive sheet will replace the used adhesive sheet and attach it to the adhesive unit. In the present invention, it is only necessary to connect the used adhesive tape and the new adhesive material -15- 200913828 to replace the lands. It is therefore easy to load the new adhesive sheet onto the adhesive unit. also, Because there is no need to change the take-up tray every time you change a new adhesive tray, Or attach the beginning of the new adhesive tape to the take-up reel and guide the operation of the adhesive tape. Therefore, it takes less time to replace the new adhesive sheet. It can improve the production efficiency of electronic machines. The substrate of the adhesive tape is surface treated with 矽, The adhesive tape used also uses a 矽 adhesive. It can reduce the difference in surface tension between the two and increase the adhesion. Therefore, the adhesion of both the traditionally difficult ones can be achieved. The adhesive for the adhesive tape may be a distorted adhesive which disperses the conductive particles in the insulating adhesive. It can also be used only for insulating adhesives. or, Dispersing insulating spacer particles in these adhesives. Applying for the invention described in item 15 of the patent scope, Its characteristic is that The difference between the surface tension of the adhesive surface of the adhesive tape and the surface tension of the treated substrate of the adhesive tape described in the first paragraph of the patent application is l〇mN/m (1 Odyne/cm) or less. In the invention described in the fifteenth aspect of the patent application, In addition to the same effects as the invention described in claim 14 of the patent application, Because the surface tension of the adhesive surface of the adhesive tape and the difference between the surface tension of the adhesive substrate and the surface tension of the substrate are 10 mN/m (10 dyne/cm) or less, a strong adhesion can be obtained. And it really sticks to both. Surface tension is measured by wet reagents or contact angles. The surface tension difference between the adhesive substrate of the adhesive tape and the adhesive surface of the adhesive tape should be 0 to 5 mN/m (5 dyne/cm). The difference in surface tension is as small as possible, If it exceeds 1 〇 ni N / m (1 0 d y n e / c m ), it may not be possible to obtain -16 - 200913828 full adhesion strength. The invention described in claim 16 is the invention described in claim 2, It is characterized in that the adhesive force of the adhesive tape is 100 g/25 mm or more. In the case of the invention described in the fifteenth aspect of the patent application, the invention has the same effects as those of the invention described in claim 2, The bonding of the adhesive tape of one side and the other is performed by applying adhesive tape to the adhesive faces of the two sides, Adhesive tape on one side and the other can obtain adhesion (or closeness) on both sides, Therefore, adhesion can be performed with high strength. especially, Because the adhesion is 100g/25mm or more, The adhesion of the two adhesive faces of the adhesive tape of one side and the other will be stronger. The stronger the adhesion strength, the stronger the adhesion strength. however, A specific strength cannot be obtained at less than 1 0 0 g / 2 5 m m. Applying for the invention described in item 17 of the patent scope, Its characteristic is that Overlap or abut the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side, The adhesive tape described in item 16 of the patent application is attached to both sides of the two adhesive tapes to perform the connection. When the invention described in claim 17 of the patent application is filed, In addition to the same effects as the invention described in claim 16 of the patent application, The connection of the adhesive tape of one side and the other side is carried out on both sides thereof. Therefore, a stronger connection can be obtained. Applying for the invention described in item 18 of the patent scope, An adhesive tape for attaching one side of a substrate coated with an electrode-bonding adhesive to one of the disks, And the other side of the disc is wound up to the other side. -17- 200913828 Adhesive tape connection method for the tape is applied to the end of the tape and the adhesive tape on the other side of the adhesive tape. Tape connection, Adhesive on both sides and sand below 10 m N / m (1 0 d y n e / c m ), And sticky ο the first part of the scope of this patent application, the adhesive tape for the surface adhesive, And it can be done with a tape on both sides of the tape.) Therefore, the connection between the two is very simple, and the application of the adhesive for electrode connection is applied to the adhesive tape for the electrode connection. And the method of attaching the adhesive tape to the tape of the other side, The terminal part of its characteristics, And the other side of the adhesive tape, The adhesive portion of the adhesive resin is adhered to the adhesive portion of the paste-like resin, and the end portion of the adhesive tape described in claim 19 of the patent application is And newly installed with a paste-like resin adhesive for fixing, Because it is not necessary to install the new adhesive tape at the beginning of the new adhesive tape to the winding path setting guide pin, etc. Just need a seed plate, Therefore, the production of electronic equipment can be improved. When the difference in surface tension between the two adhesive substrates is carried out by sandwiching between the beginning portions of one of the adhesive tapes, the invention is such that the force is 100 g/25 mm or more. Because the adhesive between the two sides and the other side is used to adhere the two (or it is easy. invention, The adhesive material used to connect the substrate to one of the other sides of the disk. The beginning of one of the adhesive tapes will overlap or abut the overlap or abutment. And the connection of the rainer. When invented, Because the beginning of the adhesive tape has been used up, Therefore, the connection is very simple. Replace the take-up tape, Pan operation, And new adhesive efficiencies can be replaced in a fraction of the time. -18 - 200913828 Because the end of the adhesive tape of one side, And the other part of the adhesive tape is attached to the overlapping portion or the abutting portion of the adhesive tape with a resin adhesive. Applying for the invention described in item 20 of the patent scope, For example, the invention described in Article 19 of the Patent Application, Its characteristic is that The resin adhesive is made of a thermosetting resin, Photocurable resin, And at least one material selected from the group of hot metal adhesives. In the case of the invention described in item 20 of the patent application, In addition to the same effects as the invention described in claim 19, Because it can be made from thermosetting resin, Photocurable resin, In the group of hot metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected. Therefore, the connection strength between the adhesive tapes can be improved. Applying for the invention described in item 21 of the patent scope, Its characteristic is that Attached to the adhesive device with adhesive tape, A charging machine for supplying a resin-made adhesive described in claim 19 or 20 of the patent application is installed. In the invention described in the second aspect of the patent application, Because the filling device is provided with a filling machine for supplying the resin adhesive described in the patent application No. 19 or 20, Therefore, no additional filling machine is prepared. It can prevent waste of connection work. In addition, in addition to the filling machine, It may have a heater for the purpose of curing the thermosetting resin, Or ultraviolet rays for the purpose of irradiating light of a photocurable resin. Applying for the invention described in item 22 of the patent scope, It is used to roll the adhesive tape coated with the adhesive for electrode connection on the substrate to the adhesive material of the tray -19- 200913828 tape tray, Its characteristic is that The adhesive tape tray is provided with a roll of a plurality of adhesive tapes in the width direction of the tape. In the invention described in claim 22 of the patent application, In the case where the roll portion (roll portion) of the plurality of adhesive tapes is disposed, and all of the adhesive tapes that are taken up to the roll portion of one of the plurality of rolls are rolled out, The adhesive tape of the other side of the roll disposed next to the all-rolled roll portion is attached to the take-up reel. in this way, Because one of the adhesive tapes is completely rolled out, The adhesive tape of the other side will be attached to the take-up reel. And the replacement of the adhesive tape is carried out, Therefore, it is not necessary to put a new adhesive tape on the adhesive device. therefore, There will be fewer replacement jobs for new adhesive tapes. Therefore, the productivity of the electronic machine can be improved. Because the adhesive tape that is taken up to the multiple rolls can be used in sequence, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. It is possible to increase the amount of adhesive that can be used for one replacement operation. also, Because there is no need to increase the number of rolls of adhesive tape, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up, that is, preventing clogging. It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention described in Item 2 of the patent scope of the application For example, the invention described in claim 22 of the patent application is characterized in that Between the end of the adhesive tape on one side and the beginning of the adhesive tape on the other side, When all of the adhesive tape having the connecting tape of the two is attached, It will then start rolling out the other side of the sticky vine belt. -20- 200913828 When the invention described in claim 23 of the patent application, In addition to the same effects as the invention described in claim 22, the end portion of the adhesive tape of one of the adhesive tapes and the other end of the adhesive tape are connected by a connecting tape. It is not necessary to install the adhesive tape of the other side of the roll onto the take-up reel after the entire adhesive tape of one of the rolls is rolled out. Therefore, the production efficiency of the electronic machine can be further improved. Applying for the invention described in item 24 of the patent scope, The adhesive tape tray of the 23rd item of the patent application scope, Reeling tape for adhesive tape, Between the adhesive tape tray and the take-up reel and pressing the adhesive of the adhesive tape to the pressing portion of the circuit board of the electronic device by the heating and pressing head, And an adhesive device for detecting a tape detecting means for connecting the tape, Its characteristics are, When the tape detecting means detects the connecting tape, Until the connecting tape passes through the pressing part, The connecting tape will be taken up to the take-up reel. In the invention described in claim 24 of the patent application, Since the adhesive tape is automatically taken up to the take-up reel, the adhesive tape of the roll of one side is completely unrolled. The adhesive tape will be rolled out from the next roll in sequence. also, When the tape detecting means detects the connecting tape, Until the connecting tape passes through the pressing part, The connecting tape is automatically taken up to the take-up reel. Therefore, it can save the trouble of taking up. also, The adhesive device has a tape detecting means, It consists of a pair of light-emitting parts and a light-receiving part. Used to perform optical inspection of the bonding tape. on the other hand, The ends of the connecting tape are provided with colored (for example, black) marks. The light receiving unit detects the connecting tape by detecting the mark at both ends of the connecting tape by the laser light emitted from the light emitting unit. In addition to the addition of marks on the connecting tape, -21 - 200913828 It is possible to use a method in which the width of the bonding tape is different from the width of the adhesive tape, Or a method of forming a plurality of holes in a connecting tape. Applying for the invention described in item 25 of the patent scope, The adhesive tape tray ‘attached to the end portion of the adhesive tape of one of the adhesive tapes and the other end of the adhesive tape is characterized in that the attachment portion is covered with an adhesive tape to cover the fastener. When the invention described in claim 25 of the patent application is filed, Because the card stopper is used to connect the end portion of the adhesive tape which is completely unwound, and the beginning end of the newly attached adhesive tape, Implement the replacement of the adhesive tape tray, Therefore, it is very simple to put the new adhesive tape on the adhesive device. also, Because there is no need to change the take-up tape every time you replace a new adhesive tape tray, Attaching the beginning of the new adhesive tape to the take-up reel, And setting up a guide pin or the like on a specific path, Replace the new adhesive tape tray in less time. Therefore, the production efficiency of the electronic machine can be improved. Because the adhesive tape is used sequentially, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. This allows a significant increase in the amount of adhesive that can be used for one replacement job. also, Because there is no need to increase the number of rolls of adhesive tape, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Can prevent blockage, and, It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. also, The connection between the end of the adhesive tape of one side and the beginning of the adhesive tape of the other side, Because the card is covered with adhesive tape, Therefore, the appearance is good. At the same time, it can prevent the card part of the connecting part from contacting the adhesive. -22- 200913828 The tape is damaged and the adhesive tape is damaged. Or the components such as a heating press head or a support stand that are damaged to the adhesive device. And the method of covering the card holder with adhesive tape, It should be after the end of the adhesive tape on the side where the card is attached, and the beginning of the other adhesive tape. Fold the connecting part back to the longitudinal direction of the tape by 180 degrees. Cover the card with adhesive tape. Also, other adhesive tapes may be used to wrap the connecting portion to cover the card stopper. Applying for the invention described in item 26 of the patent scope, It has an adhesive tape tray as described in item 1 of the patent application scope. Reeling tape for adhesive tape, Provided between the adhesive tape tray and the take-up reel and pressing the adhesive material of the adhesive tape to the pressing portion of the circuit board of the electronic device by the heating and pressing head, And an adhesive device for detecting a connecting portion detecting means for detecting a connecting portion of the tape, wherein the connecting portion detecting means detects the connecting portion of the tape, Until the connecting part passes through the pressing part, The adhesive tape from one side will be taken up to the take-up reel. In the invention described in claim 26 of the patent application, If the connection detecting means detects the connected part, Then, because the connecting portion passes through the pressing portion, the adhesive tape of one side is taken up to the take-up reel, Therefore, it is possible to prevent the pressing portion from being pressed when the connecting portion reaches the pressing portion. also, To the connecting part, by pressing the part, Because the adhesive tape of one side is automatically taken up to the take-up reel, Therefore, the trouble of winding up can be omitted. Applying for the invention described in item 27 of the patent scope, For example, the invention described in claim 26 of the patent application is characterized in that Connection detection means -23- 200913828 CCD camera, Thickness detection sensor, And one of the transmittance detecting sensors. In the invention described in claim 27 of the patent application, In addition to the same effects as the invention described in claim 26, The connection part can be detected with a simple configuration. and, These methods can be used to improve the detection accuracy. E.g, When a CCD camera is used as the connection detecting means, The surface of the connected part can be displayed on the monitor screen. The connection portion is detected by comparing the shades of the pixels. also, When using a thickness detection sensor, Because the thickness of the joint portion is greater than the thickness of the adhesive tape, The connection portion can be detected because the thickness can be changed. also, When using a transmittance sensor, Because the thickness of the connecting part is thicker, Moreover, since the transmittance is lowered because of the card stopper, the connection portion can be detected by comparing the transmittance. Applying the method of attaching the adhesive tape according to Item 28 of the patent application, Its characteristic is that The end portion of the adhesive tape to which one of the adhesive tapes is attached by the card stopper and the attachment portion of the other end of the adhesive tape are covered with the adhesive tape. In the invention described in the twenty-eighth aspect of the patent application, the end portion of the adhesive tape which is completely unwound by the card stopper and the beginning end portion of the newly attached adhesive tape are used to perform the replacement of the adhesive tape tray. It is very simple to install the new adhesive tape to the adhesive device. And because there is no need to change the take-up tape every time you change a new adhesive tape tray, The installation of the beginning of the new adhesive tape to the take-up reel, And the operation of setting the guide pin or the like in a specific path 'replaces the new adhesive tape tray in a small amount of time', so that the production efficiency of the high-electronic machine can be improved. Because the adhesive tape is used sequentially, There is no need to increase the number of rolls of adhesive tape for one adhesive tape. This allows a significant increase in the amount of adhesive that can be used for one replacement job. also, Because there is no need to increase the number of rolls of adhesive tape, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Can prevent blockage, and, It can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. also, The connection between the end of the adhesive tape of one side and the beginning of the adhesive tape of the other side, Because the adhesive tape is used to cover the card holder, the appearance is good, and It can prevent the card part of the connecting part from contacting the adhesive tape and hurting the adhesive tape, Or the components such as a heating press head or a support stand that are damaged to the adhesive device. And the method of covering the card holder with adhesive tape, The connecting portion should be folded back to the longitudinal direction of the tape by 18 degrees after the end portion of the adhesive tape attached to the card holder and the beginning end of the other adhesive tape. Cover the card with adhesive tape. Also, other adhesive tapes may be used to wrap the connecting portion to cover the card stopper. Applying for the invention described in item 29 of the patent scope, Applying an adhesive to the substrate and rolling it into a disc-shaped adhesive tape. Its characteristic is that A plurality of adhesives are disposed on the substrate in the longitudinal direction of the tape. In the invention described in claim 29 of the patent application, If the adhesive tape is used, the disk and the empty disk of the adhesive tape are attached to the adhesive device-25-200913828 'After heating and pressing the adhesive on the circuit substrate' and the substrate is rolled up to the empty disk. The way is loaded. Secondly, When the heating and pressurization of the adhesive is applied to the circuit substrate, one of the plurality of adhesives disposed in the width direction of the substrate is pressed against the circuit substrate. The residual adhesive strip after pressing will be taken up to the empty tray at the same time as the substrate. Secondly, After the adhesive tape on the plate is completely rolled out, Will reverse the rotation direction of the disc, The direction of supply of the adhesive tape is reversed. in this way, After using one adhesive each time, Will reeler the residual adhesive and substrate at the same time. Repeat the use of the remaining adhesive strips in sequence. therefore, Because a plurality of adhesives are used one by one, Therefore, there is no need to increase the number of tapes. You can increase the amount of adhesive that can be used in one dish (more than 2 times). In the present invention, No need to increase the number of rolls of adhesive tape, The adhesive dose can be greatly increased. and, Because the number of rolls of adhesive tape is not increased, Therefore, it can prevent the coiling from being scattered. Simultaneously, It prevents the adhesive from oozing out from the width of the tape and causing adhesion between the tapes that have been taken up. that is, Prevents blockages, In addition, It is also possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). Manufacturers of electronic components can reduce the number of replacements of new adhesive tapes, Therefore, the manufacturing efficiency can be improved. also, In the manufacture of adhesive tape, Because there is more adhesive dose per plate, Can reduce the amount of disk and moisture prevention materials used, Therefore, the manufacturing cost can be reduced. also, After the first adhesive is pressed and the adhesive tape is taken up to the empty tray, In order to use the next adhesive, 'do not reverse the direction of rotation and replace -26- 200913828. It is also possible to mount two discs on the adhesive device. The adhesive agent may be a heterogeneous conductive adhesive in which conductive particles are dispersed in an insulating adhesive. Can also be used only for insulating adhesives, or, Dispersing insulating spacer particles in these adhesives. The width of the substrate should be 5mm~1000mm, however, It can be arbitrarily selected according to the width of one of the agents or the number of adhesives. The width of one adhesive should be 〇. 5mm~10. 0mm. The width of the substrate should be 5mm~1000mm. When the width of the substrate is lower than 5mm, the number of adhesives disposed on the substrate and the width of the adhesive will be limited. When it is greater than 1000mm, there is no The invention described in claim 30, wherein the invention described in claim 29 is characterized in that the adjacent adhesive strips of the plurality of adhesives are spaced apart. . In the invention described in claim 30, in addition to the same effects as the invention described in the twenty-ninth aspect of the patent application, it is easy to carry out adhesion because the adjacent adhesive strips are separated from each other. The agent is pressed one by one. The invention described in the third aspect of the invention is the invention described in claim 29, wherein the adhesive is separated into a plurality of strips by forming a slit in the longitudinal direction of the tape. In the invention described in the third aspect of the patent application, in addition to the same effect as the item 29 of the patent application scope, the adhesive is completely applied to one side of the substrate, and the adhesive is pressed. -27-200913828 to the circuit board immediately before, that is, immediately before the use of the adhesive tape, the gap is formed by cutting the adhesive with a cutting edge or the like. Further, in the formation of the gap, when the adhesive tape is produced, the adhesive may be cut by a cutting edge or the like to form a slit. The formation of the slit can be formed by using a laser or a heating wire in addition to the cutting edge. In the present invention, the number of the adhesive strips disposed on the substrate can be increased. The invention described in claim 3 is an adhesive tape manufacturing method in which an adhesive is applied to a substrate and wound into a disk shape, and is characterized in that it is disposed so as to have a space in the width direction of the substrate. The applicator applies a plurality of adhesives to the substrate by supplying an adhesive to the substrate surface conveyed in a continuous manner. In the invention described in the third aspect of the patent application, the adhesive tape described in claim 30 of the patent application can be manufactured by using an existing device. The applicator may be a plurality of rollers disposed in the width direction of the substrate, or may be nozzles. The invention described in claim 3 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, characterized in that the adhesive is completely applied to one side of one of the substrates. After forming a longitudinal slit in the adhesive, the other substrate is disposed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one substrate and the other substrate are placed on the adhesive substrate. The plurality of adhesives are alternately attached to each other on one or the other of the substrates, and a plurality of adhesives are disposed on one or the other of the substrates at intervals. -28 - 200913828 In the invention described in the third aspect of the patent application, since two adhesive tapes as described in the second aspect of the patent application can be simultaneously produced, good manufacturing efficiency is obtained. The invention described in claim 4 is an adhesive applying method in which an adhesive is applied to a substrate, and an adhesive is pressed onto the circuit substrate by a disk-shaped adhesive tape, which is characterized in that The adhesive is coated on one side of the material, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed from the side of the substrate along the longitudinal direction of the tape to form a strip shape, thereby reducing the cohesive force of the heated portion. And pressing to the circuit substrate, after pressing, the residual adhesive and the substrate are simultaneously wound into a disk shape, and the resin substrate is again subjected to heating and pressing of the adhesive on the circuit substrate by using a disk-shaped adhesive tape. When applying the invention described in the third paragraph of the patent application, the cohesive force of the portion (hereinafter referred to as "cohesion reduction line") is reduced by heating a part of the adhesive, and the heated portion is adhered from the cohesive force reduction line. Pressed to the circuit substrate and separated from the substrate. The residual adhesive will remain on the substrate and will be taken up to the empty tray at the same time as the substrate. In the present invention, since the width of the adhesive tape is only slightly wider than the conventional one, the adhesive tape can be directly produced by using the existing equipment. Further, by pressing the width of the adhesive to the circuit board, the heating area can be changed to be arbitrarily set, so that the width of the adhesive is pressed with a high degree of freedom. Further, in the same manner as the invention described in claim 29, when the adhesive tape is completely unwound to the empty tray, the rotation direction of the disk is reversed, and the supply direction of the glue -29-200913828 is reversed, or the rotation of the disk is maintained. Direction but swap the disks. In this manner, since the adhesive on the substrate is heated and pressed to the circuit substrate one by one, the adhesive amount which can be used for one disk can be greatly increased without increasing the number of tapes. Further, in the same manner as the invention described in claim 29, since the amount of the adhesive is increased without increasing the number of rolls, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent clogging due to the bleeding of the adhesive and prevent it from being prevented. The effect of the disadvantage caused by the stretching of the substrate. The tape width should be 5mm~1000mm'. The adhesive pressed to the circuit board should be 〇. 5mm~1. 5mm. The reason why the tape width is 5 mm to 1 000 mm is as follows. Since the tape width is less than 5 mm, the number of times of adhesive pressing per one disk is small, and when it is larger than l〇〇〇mm, it cannot be attached to the existing adhesive device. . The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The invention described in claim 35 is an adhesive tape coated on a substrate and wound into a disk-shaped adhesive tape, wherein the width of the adhesive tape is the same as or longer than the length of one side of the circuit substrate. 'And a plurality of adhesives are disposed in the width direction of the tape. In the invention described in the 35th aspect of the patent application, the adhesive tape is disposed so as to overlap one of the widths of the circuit board, so that it can be disposed directly along the side of the circuit board in the width direction of the adhesive tape. One adhesive is heated and pressurized. -30- 200913828 Since the width of the adhesive tape is longer than the length of one side of the circuit board, the adhesive tape only needs to be pulled out of the width of the adhesive. Next, after the adhesive is pressed to one side of the circuit board, the circuit board is rotated so that the other side is positioned at the width direction of the adhesive tape, and the other side is heated and pressurized. In this way, the adhesive is pressed against the other side of the circuit board in this order, and it is easy to apply the adhesive to the periphery of the circuit board. Therefore, since the adhesive having a length longer than one side of the circuit board can be used one by one, and the amount of use of the adhesive strip is one time, the width of the adhesive strip can be increased, and the number of the adhesive tape can be increased without increasing the number of the adhesive tape. Adhesive dose that can be used. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. Further, in the manufacture of the adhesive tape, since the amount of adhesion per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The adhesive may be a dissimilar conductive adhesive which disperses conductive particles in an insulating adhesive, or may be an insulating adhesive alone or an insulating spacer particle may be dispersed in these adhesives. -31 - 200913828 The width of the adhesive tape is greater than the size of one side of the circuit board, for example, 5mm to 3000mm. Further, even if the adhesive tape having a size smaller than the size of one side of the circuit board, a plurality of adjacent strips may be disposed in the width direction of the adhesive tape to have a size of one side of the circuit board. In this case, it is easy to adapt to different sizes of circuit boards, which improves production efficiency. The width of one adhesive should be, for example, 0. 5 mm~l 0. 0mm. The reason why the width of the adhesive tape is 5 mm to 3000 mm is as follows. The size of one side of the circuit substrate is rarely less than 5 mm, and when it is larger than 3000 mm, the width of the disk is too wide and may not be attached to the existing adhesive device. The invention described in claim 36 is the invention described in claim 35, wherein a plurality of adhesives are disposed in such a manner that adjacent adhesive strips are spaced apart. In the invention described in the third paragraph of the patent application, in addition to the same effects as the invention described in claim 35, since the adjacent adhesive strips are separated, the adhesive can be easily removed one by one. Peel off from the substrate and carry out pressing. The invention described in claim 3 is the invention described in claim 35, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the third aspect of the patent application, in addition to the same effects as those of the third aspect of the patent application, the adhesive tape is applied to the single side of the substrate by using an adhesive. The dryer "forms a gap immediately before the adhesive is pressed to the circuit board, that is, immediately before the use of the adhesive tape, by using a cutting edge or the like to cause the adhesive to have a cut-32-200913828 mark. Further, in the formation of the slit, the adhesive may be formed by cutting the adhesive with a cutting edge or the like to form a slit. In addition to the cutting edge, it may be formed by using a laser or a heating wire. In the present invention, in addition to the increase in the number of the adhesive strips disposed on the substrate, the adhesive tape in which a plurality of adhesives are disposed in the width direction of the tape is easier to manufacture. The invention described in claim 38 is an adhesive tape manufacturing method in which an adhesive is applied to a substrate and wound into a disk shape, and the adhesive is applied to one of the base materials. After forming a gap in the width direction of the adhesive on the adhesive, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one of the substrates and the other is placed. The substrates are separated from each other, and a plurality of adhesives are alternately attached to one of the other substrates, and a plurality of adhesives are disposed on one or the other of the substrates at intervals. In the invention described in the third paragraph of the patent application, since it is possible to simultaneously manufacture two adhesive tapes as described in the second paragraph of the patent application, it is possible to use the existing equipment to have good manufacturing efficiency. The invention described in claim 39, is an adhesive tape pressing method, which is characterized in that: the adhesive tape of any one of the claims 5th to 37th is applied to a circuit board. Upper, the adhesive tape is heated and pressurized along the width direction, and the adhesive strip is pressed to one side of the circuit board. The method of pressing can also be carried out in such a manner that the adhesive tape is disposed on the circuit substrate, and the adhesive is heated and pressurized along the width direction to press the adhesive strip to the circuit. One side of the substrate, next, changing the position of the circuit board, and applying heat and pressure to the other side of the circuit board along the width direction of the adhesive tape to press the next adhesive strip to the other side of the circuit board . In the invention described in claim 39, in addition to the effects described in any one of claims 3 to 3, the adhesive tape may be attached to the adhesive device. One of the circuit boards is disposed in the width direction of the adhesive tape, and the adhesive is pressed to one side of the circuit board. Next, the circuit board is rotated by about 90 degrees, so that the other side of the circuit board is positioned in the width direction of the adhesive tape. In parallel, the adhesive is pressed against the other side of the circuit board. In this way, the circuit board can be rotated by 90 degrees and the adhesive is pressed, and the adhesive can be pressed around the circuit board in a simple manner, thereby improving the work efficiency of the manufacturing unit of the electronic component. The feature of the invention described in claim 40 is as follows: at least one of the adhesive tapes described in any one of claims 3 to 37, and one of the adhesive tapes, is disposed on at least the moving path of the mobile circuit board. In the arrangement, the width direction is perpendicular to the conveying path, and the other adhesive tape is disposed in the width direction along the conveying path, and one adhesive tape is oriented in the width direction with respect to the opposite sides of the circuit board. Carrying out the heating and pressing of the adhesive tape to press the adhesive strip to the opposite sides of the circuit substrate, and secondly, moving the circuit substrate toward the other adhesive tape, and the remaining two sides of the circuit substrate are from the substrate side along the width In the direction, the adhesive tape is heated and pressurized, and the adhesive strip is pressed around the circuit substrate. -34- 200913828 In the invention described in claim 40, in addition to the effects described in the third and fifth aspects of the patent application, it is not necessary to rotate the circuit board and move it to one of the adhesive tapes. The position of the adhesive tape on the other side is heated and pressurized in the width direction at each position. It is easy to press the adhesive around the circuit board, which has good work efficiency. The invention described in claim 4 is a method in which an adhesive is applied to a single surface of a substrate, and an adhesive tape which is pressed against a circuit board by a disk-shaped adhesive tape is pressed. The feature is that the width of the adhesive tape is longer than the length of one side of the circuit substrate, and the adhesive of the adhesive in the width direction of the adhesive tape is heated from the width direction to reduce the cohesive force of the adhesive in the heating portion, and the adhesive is adhered. The agent is pressed against the circuit substrate. In the invention described in the fourth aspect of the patent application, when the adhesive is pressed around the circuit board, the adhesive tape is attached to the adhesive device, and the adhesive tape is heated and pressurized in the width direction. The cohesive force of the portion (hereinafter referred to as "cohesion reduction line") is lowered, and the adhesive portion of the heating portion is separated from the substrate along the cohesive force reduction line and pressed onto the circuit substrate. Next, the circuit substrate is rotated by about 90 degrees so that the adjacent side is located at the position of the width direction of the adhesive tape, and the heating and pressing of the next adhesive strip is performed along the width direction to press the adhesive of the adhesive strip. To the adjacent side. In this way, the adhesive can be sequentially pressed to the four sides of the circuit board, and the work efficiency is good. Moreover, since it is only necessary to apply the adhesive to the adhesive tape in its entirety, it is possible to manufacture the adhesive tape directly from the existing equipment. Further, the width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. Moreover, it is the same as the invention described in claim 35 of the patent application. 'Because the number of rolls is not increased, the amount of the adhesive can be increased, so that the winding can be prevented from being scattered, and at the same time, the blockage caused by the leakage of the adhesive can be prevented, and Prevents the effects of defects such as stretching of the substrate. The feature of the invention described in claim 42 is that there is one disk, the other disk, and a casing for accommodating the disks rotatably mounted, and one of the disks is wound around the base. The adhesive tape on the material is coated with an adhesive, and the other end of the disk is fixed with one end of the adhesive tape. At least two adhesives are disposed on the adhesive tape along the longitudinal direction of the adhesive tape. In the invention, the adhesive tape cassette is attached to the adhesive device so as to overlap at least one of the adhesives disposed in the longitudinal direction of the adhesive tape in such a manner as to overlap one of the circuit substrates. The substrate side is heated and pressurized to press one of the adhesives onto the circuit board. Thus, the adhesive can be sequentially pressed onto the circuit substrate, and the adhesive tape is sequentially taken out from one of the trays, and the remaining adhesive tape coated with the adhesive is taken up to the other tray. Next, when the adhesive tape wound around one of the discs is completely unwound, the cartridge is reversed and reattached to the pressing device. In this way, since one of the discs and the other of the discs are interchanged, -36-200913828 becomes an adhesive tape that is rolled out from the other disc', and one additional adhesive can be pressed. When two or more adhesives are formed on the adhesive tape, the position in the width direction can also be changed, and the crimping can be carried out in order or in a spaced manner. As shown above, in the present invention, at least two adhesives are arranged side by side in the width direction of the adhesive sheet, and can be used one by one, and at least two trays can be used for one tray, without the need to increase the volume of the adhesive tape. In the case of a number, the adhesive dose that can be used for one disk is increased by more than 2 times. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, when two adhesives are formed, the manufacturing unit of the electronic component can simply reverse the cartridge when one disk (one adhesive) is used, so that it is easier to install the next one. Moreover, since the adhesive tape is a cassette type, there is no complicated step in mounting the adhesive tape on the disc on the adhesive device, as long as the cartridge is attached to the adhesive device, it is easy to handle, and has Good installation and replacement workability. The adhesive may be an isotropic adhesive which disperses the conductive particles in the insulating adhesive. Alternatively, the insulating adhesive may be used, or the insulating spacer particles may be dispersed in the adhesive. The invention described in claim 4 is the invention of claim 42, wherein the adjacent adhesive strips of the plurality of adhesives have a space. In the invention described in claim 43 of the patent application, in addition to the same effects as those of the invention described in claim 42 of the patent application, the adjacent adhesive strips are separated and can be pulled away from the substrate one by one. Adhesive and pressed. The invention described in claim 44 is the invention according to claim 42, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the 44th aspect of the patent application, in addition to the same effect as the application of the 42nd item of the patent application, the adhesive tape is applied by applying the adhesive to one side of the substrate and drying it. The gap is formed immediately before the adhesive is pressed to the circuit board, that is, immediately before the adhesive tape is used, by using a cutting edge or the like to make the adhesive have a cut. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. The invention of claim 45 is characterized in that it has one disk, the other disk, and a casing for accommodating the disks rotatably mounted; and one of the disks is wound up. Adhesive tape coated with an adhesive on the substrate, and the other end of the disk is fixed with one end of the adhesive tape; the adhesive tape cartridge is attached to the pressing device, from the adhesive -38- 200913828 tape box The adhesive tape is pulled out onto the circuit board, and one part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive in the heating part, and the adhesive in the width direction is pressed to the circuit substrate. . In the invention described in claim 45, a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive (hereinafter referred to as "cohesion reduction line"). The adhesive portion of the heated portion is separated from the substrate and pressed to the circuit substrate from the cohesive force reduction line. In the present invention, since the adhesive tape only needs to be completely coated with the adhesive on the substrate, the adhesive tape can be directly produced by using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. The invention described in claim 46 is an adhesive pressing method using an adhesive tape cassette, which is characterized in that it has one disk, the other disk, and is housed in a freely rotatable manner. a housing of the discs; and one of the discs is wound with an adhesive tape coated with an adhesive on the substrate, and the other disc is fixed with one end of the adhesive tape; the adhesive tape cassette is loaded To the pressing device, the adhesive tape is pulled out from the adhesive tape cassette onto the circuit substrate, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive portion of the heating portion, and the width is increased. A part of the adhesive in the direction is pressed against the circuit substrate, and after the adhesive tape wound on one of the disks is completely unwound, the adhesive tape cassette is reversed, and the remaining adhesive is pressed onto the circuit substrate. -39- 200913828 In the invention described in the fourth paragraph of the patent application, in addition to the same effect as the item 45 of the patent application, at the same time, when the adhesive tape wound onto one of the discs is completely unwound , the cartridge is reversed and reattached to the pressing device, and the remaining portion of the adhesive is pressed to the circuit substrate. Therefore, the invention is the same as the invention described in claim 1 and can be increased without increasing the number of windings. By increasing the amount of the adhesive, it is possible to prevent the coiling from being scattered, and at the same time, it is possible to prevent the clogging caused by the bleeding of the adhesive and to prevent the disadvantage caused by the stretching of the substrate. In addition, when the manufacturing unit of the electronic component is completely unrolled in one serving (one adhesive), it is easier to reverse the cartridge. Because of the way of using the box, it is easier to handle, and has good installation and replacement workability. The invention described in claim 47 is a disk-shaped adhesive tape coated on a substrate, characterized in that the substrate has a hot melt layer and a support layer. In the invention described in claim 47, when the adhesive tape is used to attach the disk and the empty disk of the adhesive tape to the adhesive device, the substrate is heated and pressurized by the adhesive material, and then the base is applied. The material is taken up to an empty tray. Secondly, 'the end portion of the adhesive tape which has been taken up to one of the discs on one side and the other end of the adhesive tape which is newly wound onto the other side of the disc are overlapped or abutted The part is heated to melt the hot melt layer, and then the hot melt is solidified by cooling to connect the adhesive tape. The adhesive pad 40-200913828 is replaced by the end of the adhesive tape and the beginning of the newly-adhesive adhesive tape, which is adhered to the substrate of the adhesive tape. The material plate is attached to the adhesive device. 'Because there is no need to change the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive material is attached to the take-up reel, and the roll is attached to the guide pin, it takes only a small amount of time to replace it. Adhesive trays can increase the productivity of electronic machines. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be used reasonably. The invention described in claim 48 is the invention of claim 1, wherein the support layer is sandwiched between the hot melt layers. In the invention described in claim 48, in addition to the same effects as those of the invention described in claim 1, since the hot melt layer is located on the surface of the substrate, the adhesive faces at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. The invention described in claim 4 is the invention according to claim 1, wherein the hot melt layer is sandwiched between the support layers. In the invention described in the fourth paragraph of the patent application, in addition to the same effects as the invention described in claim 47, the attachment of the adhesive tape is at the end of one of the adhesive tapes and The other end of the adhesive tape is abutted at the same position, and is heated by the heating head of the device. The hot melt is melted and bleed during heating, and the hot melt is solidified by cooling. The connection between the adhesive tapes is carried out. At this time, since the hot melt layer is sandwiched between the support layers, it is possible to prevent the molten material layer from being exposed to the atmosphere and to lower the adhesion strength of the hot melt layer due to moisture absorption or adhesion of moisture. The invention described in claim 50 is an adhesive tape connecting method for attaching an adhesive tape which is taken up to one of the trays of one side, and an adhesive tape which is wound up to the other of the trays of the other side. The adhesive tape has a substrate treated with a release agent and a release agent that removes the release agent at the end of the substrate of the adhesive tape of any one of the adhesive tapes, and adheres the adhesive tape of the other adhesive tape. The agent surface is superposed on the portion, and is joined by heating and pressing the overlapping portions of the two. In the invention described in claim 50, the adhesive surface of the other adhesive tape is superposed on the surface of the adhesive tape of either one of the adhesive tapes, and the overlapping portions are heated and pressed, and all the connections are used. The end of the adhesive tape and the beginning of the newly attached adhesive tape are used to replace the adhesive disc, so that the new adhesive disc can be attached to the adhesive device. Since it is not necessary to change the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, it takes less time. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. Further, in a state where the adhesive tape is wound around the disk, a release agent is applied to the surface of the substrate to prevent adhesion of the adhesive surface and the substrate surface. -42- 200913828 In the present invention, the release agent of one of the adhesive tapes is removed, and the adhesive surface of the other adhesive tape is superposed on the portions and adhered, so that the connection between the adhesive tapes is very simple. . The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be reasonably utilized. The invention described in claim 5 is the invention described in claim 50, wherein the removal of the release agent is by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. To implement. In the invention described in claim 51, in addition to the same effects as those of the invention described in claim 50, the plasma discharge, ultraviolet irradiation, and laser irradiation are used. By removing the release agent, the release agent can be removed more accurately in a shorter period of time than when the hand is peeled off. In the method of removing the release agent, when the plasma is discharged, the gas in the plasma state is decomposed to be easily generated (excited state), and the surface of the substrate is discharged to remove the release agent. Further, in the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and is irradiated with ultraviolet rays from a mercury lamp for a predetermined period of time. Further, in the case of laser irradiation, the release agent is heated and melted by laser light irradiated with a laser oscillator to remove the release agent. The invention described in claim 52 is an adhesive tape for winding an adhesive tape coated with an electrode connecting adhesive onto a substrate, wherein the adhesive tape is in the width direction of the tape. Equipped with a -43- 200913828 plural roll of adhesive tape. In the invention described in the 52nd paragraph of the patent application, when a plurality of adhesive tape rolls (rolls) are provided, and the adhesive tape wound around one of the plurality of rolls is completely unwound, The adhesive tape disposed on the other roll portion of the entire wall of the rolled-out roll portion is taken up and attached to the disk. Thus, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the disk, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. Therefore, it is only necessary to replace the replacement of the new adhesive tape, so that the production efficiency of the electronic machine can be improved, because the adhesive tape wound around the plurality of rolls is sequentially used, and it is not necessary to add one adhesive tape. The number of rolls of adhesive tape can greatly increase the amount of adhesive that can be used in one replacement operation. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape and causing adhesion between the wound adhesive tapes, that is, it can be prevented. It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention described in claim 5 is the invention of claim 52, wherein the end portion of one of the adhesive tapes and the other end of the adhesive tape are used between When the adhesive tape of the two is connected, when the adhesive tape of one of the adhesive tapes is completely rolled out, the adhesive tape of the other side is then rolled out. In the invention described in the fifth aspect of the patent application, the end portion of the adhesive tape and the adhesive tape of the other side are the same as those of the invention described in the 52nd application of the patent application No. -44 - 200913828. Since the beginning end portion is connected by the connecting tape, and the adhesive tape of one of the winding portions is completely unwound, the adhesive tape of the other winding portion is not required to be taken up to the tray, so that the electronic device can be further improved. Productivity. The invention described in claim 54 is the adhesive tape tray of the adhesive material of claim 5, the winding disc of the adhesive tape, the adhesive tape tray, and the take-up reel, and a pressing device for pressing a bonding material of an adhesive tape to a pressing portion of a circuit board of an electronic device, and an adhesive device for detecting a tape detecting means for connecting the tape, wherein the tape detecting means detects the connecting tape When the connecting tape passes through the pressing portion, the connecting tape is taken up to the take-up reel. In the invention described in the 54th article, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive tape is sequentially unwound from the next roll. . Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. Further, in the tape detecting means, for example, the adhesive device has a pair of light-emitting portions and a light-receiving portion, and optically detects the connecting tape. On the other hand, the two ends of the adhesive tape are provided with a color (for example, black) mark, and the light receiving portion detects the tie tape by detecting the marks on both ends of the link tape by the laser light emitted from the light-emitting portion. Further, in addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the tape of -45-200913828 may be employed. The invention described in the ninth aspect of the invention is a gear unit having one disk and the other disk that rotates one disk and the other disk, a casing that houses the components, and is disposed in the casing. An adhesive member for an opening portion and an adhesive for supplying power to the heating member, wherein one of the disks is wound with an adhesive tape coated with an adhesive on the substrate, and the other disk is fixed. One end of the adhesive tape, the heating member has an electric heating member that performs heat generation by supplying electric power, and the adhesive tape wound up to one of the disks is pulled to the opening of the casing, and the heating member is located at the opening from the substrate side. The adhesive tape is heated and pressurized to press the adhesive onto the circuit substrate, and the other substrate is used to wind up the substrate from which the adhesive is peeled off. According to the invention of the fifth aspect of the invention, when the adhesive is pressed against the circuit board, the casing is held by one hand, and the opening of the exposed adhesive tape is pressed against the circuit board, and is disposed in the opening. The heating member on the substrate side of the adhesive tape abuts the adhesive tape located at the opening, and presses the adhesive to the circuit substrate. Secondly, when the adhesive tape is advanced against the adhesive tape under the heating member, the adhesive tape is pulled out from one of the disks, and when the adhesive tape is pulled out from the disk, the disk rotates, so it is fixed at The gear on the coaxial side of one of the discs will rotate, and the gear of the other of the discs that rotates with it will also rotate, and the other disc will take up the substrate from which the adhesive has been peeled off. For the power supply of the heating member, the supply of the electric power can be switched by the switch provided in the casing, or the pressure-46-200913828 switch can be arranged on the heating member, and the heating member can be sensed when pressed. The pressing is detected to supply electric power to the heating member. The adhesive may be a conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive or a dispersion of the insulating spacer particles in the adhesive. The invention described in claim 60 is an adhesive tape applied to a substrate, which is characterized by a substrate-based metal film or an aromatic polyamide film. In the invention described in claim 60, since the base material of the adhesive tape is a metal film (or metal foil) or an aromatic polyamide film, the base can be prevented even when the thickness of the substrate is thin. Problems such as stretching or cutting. Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, with the adhesive tape of the present invention, the number of rolls per one disk increases, and the manufacturing unit of the electronic component only needs to replace the number of times of the new adhesive tape, so that work efficiency can be improved. Further, in the manufacture of the adhesive tape, the number of the manufactured sheets can be reduced, and the amount of the disc and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. Metal films should be made of highly stretchable metals such as copper, aluminum, stainless steel, iron, tin, etc. Specific examples of the aromatic polyamide film are, for example, a para-aramid fiber membrane (MICTRON; trade name, manufactured by TORAY Co., Ltd.). The adhesive is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. The adhesive can also disperse the conductive particles. The conductive particles are metal particles such as Au, A g , Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A conductive material such as a polymer or the like is covered with the conductive layer or the like to form conductive particles. Further, it is also possible to apply an insulating coating particle or a conductive particle and an insulating particle which cover the conductive particles with an insulating layer. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation or pressurization is applied, and the distance between the electrodes after connection is reduced. It increases the area of contact with the circuit and improves reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The invention described in claim 60 is the invention of claim 60, wherein the thickness of the substrate is 〜25 // m. The reason why the thickness of the substrate is from 1/zm to 25/zm is as follows. When the thickness of the substrate is less than 1 // m, the substrate cannot obtain sufficient tensile strength and is easily broken. Further, when the thickness of the substrate exceeds 25/zm, the number of windings per one disk cannot be obtained. The invention described in claim 6 is the invention described in the patent application No. 48-200913828, which is characterized in that the tensile strength of the substrate is 300 MPa or more at 25 □. . The reason why the tensile strength of the substrate is 300 MPa or more is as follows. When the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched, and the adhesive tape is easily broken. The invention described in any one of claims 60 to 62, wherein the thickness ratio of the base material to the adhesive is 〇. 〇 1~1 . Hey. The thickness ratio of the substrate to the adhesive is 0. 〇 1~1. The reason for the crucible is as follows, the thickness ratio of the substrate to the adhesive is less than 0. At 01, the substrate will be too thin, so that the adhesive tape will not have sufficient strength. Moreover, the thickness ratio of the substrate to the adhesive exceeds 1. At 0, the thickness of the substrate will be too thick, and the number of rolls per disk will not be enough. The invention described in claim 64 is the invention of any one of claims 60 to 63, wherein the surface roughness Rmax of the substrate is 0. 5 // m or less. The surface roughness Rmax of the substrate should be 0. The reason for 5 m or less is as follows, if Rmax exceeds 〇. When 5//m is used, when the adhesive is pressed against the circuit board due to the unevenness of the surface of the substrate, the adhesive is not easily separated from the substrate. The invention described in claim 65 is a method for forming an adhesive tape adhesive material for forming an adhesive on an adherend by applying an adhesive to a substrate and winding the adhesive tape into a disk, which is characterized in that The plurality of discs are pulled out of the adhesive tape to overlap the adhesive tapes, and one of the substrates can be peeled off to form an adhesive which is integrally formed on the covering. -49- 200913828 In the invention described in claim 65, the adhesive surface of the adhesive tape which is rolled up from one of the trays and the adhesive surface of the adhesive tape which is wound from the other disk overlap. Make the adhesive tape into one. The substrate of the adhesive tape of the other side is taken up to the take-up reel, and the adhesive of the adhesive tape which is superposed and integrated is pressed against the cover by the pressurized heating head. The system electronic component or circuit substrate, such as a lead frame or a lead frame wafer, is coated. Thus, in the first step before the adhesive is formed on the covering body, the adhesive of one of the adhesive tapes and the adhesive of the other adhesive tape can be overlapped, and the desired adhesive thickness can be obtained to form an adhesive on the coated body. In the case of increasing the number of rolls of the adhesive tape, the winding diameter of the adhesive tape per one disk can be reduced. Therefore, the number of rolls of the adhesive tape per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the production efficiency of the electronic machine can be improved. The invention described in claim 6 is the invention described in claim 1, wherein only one of the adhesive tapes of the adhesive tape contains a curing agent. In the invention described in the sixth paragraph of the patent application, in addition to the same effects as the invention described in claim 65, since only one of the adhesives for the adhesive tape contains a hardener, the other is Adhesives for adhesive tape do not require a hardener. Therefore, the adhesive tape that does not contain the hardened "!!" is not required for low temperature management. Therefore, the number of adhesive tapes that must be subjected to low temperature management can be reduced, and the transportation and storage of the adhesive glue -50-200913828 can be efficiently managed. Further, the adhesive tape of the unbonded hardener and the adhesive of the adhesive tape of the hardener are made of the adhesive which does not react with the hardener as the other adhesive, except that the hardener is not used. In addition to the component which produces the reaction as the hardener, the adhesive used as the adhesive is used as one of the adhesives, so that the preservation stability of the adhesive can be improved. The invention described in claim 67 is a conductive material tape which is characterized in that a plurality of turns of a conductive adhesive having a film-like adhesive are applied in the longitudinal direction of the core material. The invention according to claim 67, wherein the dissimilar conductive material is provided on a single side of the film-like adhesive. A conductive material of a two-layer structure of a material film. The invention according to claim 69, wherein the dissimilar conductive material is provided on the both surfaces of the film-like adhesive, and the base film is disposed on both sides of the film-like adhesive. The three-layer structure is a conductive material. Further, the invention described in the seventh aspect of the invention is the tape of the dissimilar conductive material as described in claim 68 or 69, wherein the one side or both surfaces of the base film are subjected to a peeling treatment. Further, the invention described in claim 71 is a conductive adhesive tape as disclosed in any one of claims 67 to 70, wherein the width of the film-like adhesive is 0. 5~5mm. Further, the invention described in claim 72 is the conductive material tape of any one of the items 68 to 71 of the application of the Japanese Patent Application No. Hei. The stretch is 60 to 200% and the thickness is lOO/zm or less. Next, when the base film is colored or opaque, the base film and the adhesive can be discriminated, and the position of the unwound portion can be easily determined, so that workability can be improved. [Embodiment] Next, an embodiment of the present invention will be described with reference to an attached drawing. In the following description, the same or equivalent components will be denoted by the same reference numerals. First, an embodiment of the invention described in claims 1 to 4 will be described with reference to Figs. 1 to 5 . Fig. 1 is a perspective view showing the connection between the adhesive sheets of the adhesive tape connecting method of the first embodiment, and Fig. 2 and Fig. 2 are the connection steps of the connecting portion (A) of Fig. 1, Fig. 2 A section oblique view of the end tape of the adhesive tape used in the A system, and Fig. 2B is a perspective view of the adhesive tape used to re-fold the new adhesive tape, and Fig. 3 is the adhesive of the adhesive device. FIG. 4 is a cross-sectional view showing adhesion between circuit boards, and FIG. 5 is a step view showing a method of manufacturing an adhesive tape. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on both width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. That is, each of the disks 3, 3a has a reel 5 and side plates 7 which are respectively disposed on the two width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side of the substrate 9 - 52 - 200913828. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. The conductive particles 13 are formed by covering a conductive layer or the like which constitutes the material of the conductive particles 13 with a polymer core material or the like. Further, an insulating coating particle covering the conductive particles 13 or an insulating conductive particle 13 and insulating particles may be applied with an insulating layer. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability can be improved. In particular, it is better to use a polymer as a core material, because the conductive particles 13 such as solder have no melting point, and can be controlled in a softened state at a wide connection temperature, and it is easy to obtain the thickness of the electrode. And the connecting member of the flatness error. -53- 200913828 Next, a method of using the adhesive tape 1 of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15'. The front end of the adhesive tape 1 wound around the disc 3a is loaded via the guide pin 2 2 Set to the take-up reel 1 7 and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17 to bond the adhesive 1 1 is pressed against the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. As shown in FIG. 4, a wiring circuit (or an electronic component) 23 is placed on the adhesive 1 which is pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 2 3 on the circuit board 2 1 . In this manner, the electrode 2a of the circuit board 2 1 and the electrode 23a of the wiring circuit 23 can be connected to each other by the PDP of the adhesive tape 1 of the present embodiment, and the size of the PDP can be large. Pressing, the connection part will be more 'the amount of adhesive 11 used at one time will be much larger than the traditional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased. The adhesive tape 1 wound on the disk 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 1). The bonding method of the adhesive tape of the present invention can be divided into the following two types, -54 - 200913828 (a) directly using the take-up reel 17, replacing the adhesive tape of the adhesive tape which has been used, and the residual reeling tape is less, and Attaching new adhesive tape and take-up reel 17' (b) Using the adhesive tape with less residual reeling tape of the used adhesive tape 1 as the take-up reel 1 7 and connecting the new adhesive tape and the number of residual reels Less adhesive tape. (b) When, as shown in Fig. 1, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. The terminal portion 30 and the connection of the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3 are formed. When the adhesive tape 1 is joined, when the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it will be cut from the vicinity of the end mark 28 of the adhesive tape 1 as shown in Fig. 2A ( B), and the end portion 30 of the adhesive tape 1 is folded back so that the surface of the adhesive 1 1 of the adhesive tape 1 is located on the upper side (Fig. 2B). Next, the adhesive 11 of the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 is superposed on the surface of the adhesive 11 of the end portion 30 of the adhesive tape 1 of the used disc 3a (Fig. 2B). ° Next, as shown in Fig. 4, the overlapping portions of the two are placed on the table 104, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized to perform adhesion. In this manner, the adhesive tape 1 wound around the used tray 3a and the adhesive tape 1 wound around the new tray 3 can be joined. Next, the used disc 3 a and the new disc 3 are swapped each other', and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the operation of loading the adhesive tape 1 to the roll-55-200913828. Further, since the adhesive is adhered by the overlap between the surfaces of the adhesive 11, the connection strength is high. Further, the position of the end mark 28 on the adhesive tape 1 is when the adhesive tape 1 is extended from the used disk (the disk in which the adhesive tape 1 is completely unwound) 3a to the heating and pressing head 19, The adhesive tape 1 is fixed to a position from the fixed position on the used disk 3a to the length of the heated pressurizing head 19. At this time, cutting from the vicinity of the end mark 28, even if the adhesive tape 1 is cut from the necessary minimum position, in addition to preventing waste of the adhesive tape 1, it is possible to avoid removing the used disk 3a and moving it. The used disc 3a causes the end mark 28 to reach the complicated operation of the position where the pressurizing head 19 is heated. In this embodiment, since the adhesive device 15 has the heating and pressing head 19, and the heating and pressing head 19 is used to carry out the adhesive 1 1 of the end portion 30 of the adhesive tape 1 of the used disk 3a. And the connection of the adhesive 1 1 at the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3, so that it is not necessary to separately use a pressing device for the purpose of pressing between the adhesives 11 The discs 3, 3a around which the adhesive tape 1 is wound are replaced. When the reeling tape 17' of the (a) is used, the adhesive tape of the used adhesive tape 1 having a small remaining number of rolls is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion of the adhesive tape remaining on the side of the winding reel 1 is folded back. The surface of the adhesive 11 is made to be the upper side. Next, the surface of the adhesive 11 of the end portion of the adhesive tape 1 and the adhesive 11 surface of the adhesive portion 1 of the new adhesive sheet 3 - 56 to 200913828 are overlapped with each other. Next, the overlapping portions of the two are placed on the table 1 to 4, and the heating and pressing heads of the bonding device 15 are heated and pressurized to perform adhesion. In this manner, the adhesive tape 1 wound around the take-up reel 1 and the adhesive tape 1 wound on the new disc 3 can be joined. In this manner, since the take-up reel 17 only retracts the substrate 9, a plurality of adhesive disc portions can be taken up, and the number of replacements of the take-up reel 1 7 can be reduced, with good work efficiency. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is taken up from the unwinder 25, an adhesive 1 made of a mixture of a resin and conductive particles 3 is applied by a coater 27, and dried in a drying oven 29. The coiler 3 1 takes up the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7 and 7 are attached to the reel from both sides, or are taken up to the side plate. On the reel, it is bundled with the dehumidifying material, and is managed at a low temperature (-5 ° C to - l 〇 ° C) and shipped. Next, a second embodiment of the present invention will be described. The following description is mainly based on differences from the above embodiment. In the second embodiment shown in Fig. 6, the beginning end portion 32 of the adhesive tape 1 using the new adhesive sheet 3 has the adhesive tape 41, the adhesive tape 1 for the new adhesive sheet 3, and the winding tape 1 The connection of the adhesive tape 1 on the disc 3a that has been used. The leading tape 41 is composed of the substrate 63 and the surface of the adhesive 43 on the back side, and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 is attached to the disk by the leading tape 4 1 . Adhesive-57- 200913828 The substrate 9 of the material tape 1 is fixed. Next, the front tape 41 is peeled off from the surface of the substrate 9 and overlapped with the adhesive 11 of the end portion 30 of the adhesive tape 1 which is folded back. The overlapping portions of the two are placed on the table 1 〇 4, and the heating and pressing heads of the bonding device 15 are heated and pressurized to perform adhesion. In this manner, since the adhesive tape 41 is used to carry out the adhesion of the terminal portion 30 of the adhesive tape 1 and the initial end portion 3 2 of the newly attached adhesive tape 1 by the adhesive tape 41, the adhesive tape 1 is interposed. The connection is very simple. At this time, the surface of the adhesive 43 disposed on the back side of the base material 63 of the leading tape 41 has adhesiveness, and it is also possible to use only the adhesive 1 1 which is overlapped with the end portion 30 of the adhesive tape 1 which is folded back. The way to implement the connection. The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, in the second embodiment described above, the adhesive tape 1 wound on the used disk 3a is not folded back, and as shown in Fig. 7, the newly attached adhesive tape 1 is peeled off from the surface of the substrate 9. The leading end portion 3 2 is guided by the adhesive tape 4 1 and attached to the adhesive 1 1 surface of the back surface, so that the leading adhesive tape 4 1 is attached to the adhesive 1 1 of the end portion 30 of the used adhesive tape 1 Then, the heating and pressing head 19 of the adhesive device 15 is heated and pressurized to perform adhesion. At this time, since it is not necessary to fold the adhesive tape 1 which is completely unwound, it is possible to prevent the winding which may occur when the adhesive tape 1 is taken up to the take-up reel. At this time, the leading tape 41 of the beginning end portion 3 of the adhesive tape 1 is peeled off from the surface of the substrate 9, and the leading tape 41 may be adhered to the surface of the substrate 9 of the adhesive tape 1 to be used. Next, the invention described in the fifth to eighth patent applications is described in the description of -58-200913828. These inventions relate to an adhesive tape for attaching and fixing an electronic component and a circuit board or a circuit board, and an electrical connection between electrodes of the two, in particular, a method of joining the adhesive tape wound into a disk shape. Next, the background technology of the invention described in the fifth to eighth patent applications will be described. In general, the liquid crystal panel 'PDP (plasma display panel), EL (fluorescent display) panel, bare chip package, and other electronic components and circuit boards, or the adhesion between the circuit boards, and the electricity between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel images such as PDPs, the adhesion area of circuit boards has also increased, and the amount of adhesive used at one time has also increased from -59 to 200913828. Moreover, the use of adhesives has increased due to the expansion of the use of adhesives. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per disk 'to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive tape which is wound into a tape shape rises, which may cause the adhesive to ooze out from both sides of the tape and become a cause of clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claims 5 to 8 is to provide a method of joining adhesive tapes, which makes it easier to replace the adhesive sheets and improve the production efficiency of the electronic equipment. Next, a first embodiment of the present invention will be described with reference to Figs. 8A to 8C and 3rd to 5th. Figs. 8A to 8C are views showing a method of connecting the adhesive tape of the first embodiment, Fig. 8A is a perspective view showing the connection between the adhesive sheets, and Fig. 8B is a connection of the connecting portion of Fig. 8A. The oblique view of the method, Fig. 8C is a plan view of the connecting portion of Fig. 8A, the adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 are arranged on the discs 3, 3a, and The side plate is disposed on the two width sides of the adhesive tape 1 -60- 200913828 7. In the present embodiment, the length of the adhesive tape 1 is about 50 m and the width W is about 5 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the aforementioned materials and non-conductive glass, ceramics, and plastics. The conductive particles 13 are formed by covering a conductive layer or the like which constitutes the material of the conductive particles 13 with a polymer core material or the like. Further, an insulating coating particle covering the conductive particles 13 or an insulating conductive particle 13 and insulating particles may be applied with an insulating layer. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability can be improved. In particular, it is better to use a polymer as a core material, because the conductive particles 13 such as solder-61 - 200913828 have no melting point, and can be controlled to soften at a wide connection temperature, and can be easily obtained. A connecting member that corresponds to an error in the thickness and flatness of the electrode. Next, a method of using the adhesive tape 1 of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 1 7 are attached to the adhesive device 15 to feed the front end of the adhesive tape 1 wound on the disc 3a via the guide pin 22. Mounted to the take-up reel 1 7 and unwound the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the pressure-adhesive tape 1 is placed between the two trays 3a and 17 to press the adhesive tape 1 from the substrate 9 side, and the adhesive is applied. 1 1 is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. As shown in FIG. 4, the wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 2 3 on the circuit board 2 1 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP. There will be more parts, and the amount of adhesive 1 used in one use will be much larger than the traditional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the coil in a relatively short period of time -62-200913828. The disc 17' is taken out to expose the end mark 28 of the adhesive tape 1 wound around the disc 3a (refer to Fig. 8A). The method for joining the adhesive tape of the present invention can be divided into the following two types: (a) directly using the take-up reel 17' to replace the adhesive tape of the adhesive tape 1 which has been used, and the number of residual adhesive tapes is reduced, and the new adhesive is attached. The tape and the take-up reel 17, (b) the adhesive tape which has the remaining number of remaining adhesive tapes 1 used as the take-up reel 17 and which is connected with a new adhesive tape and an adhesive having a small number of residual reels tape. (b), as shown in Fig. 8A, in order to replace the disc 3a with the new adhesive sheet 3, when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, the adhesive of the disc 3a is carried out. The connection between the end portion 30 of the tape (one adhesive tape) 1 and the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3 (refer to Fig. 8A) . The connection of the adhesive tape 1 is as shown in Figs. 8 and B, and the end portion of the adhesive tape 1 of the adhesive tape 3 a and the beginning of the adhesive tape 1 of the new adhesive disk 3 In the portion 3 2, the surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the substrate 9 of the end portion 30. Next, a slightly triangular-shaped card stopper 46 is inserted into the overlapping portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined. In this manner, the adhesive tape 1 wound around the used disk 3a and the bonding of the adhesive tape 1 wound on the new disk 3 can be carried out. Thus, the locking pin 46 can be used to fix the end portion 30 of the adhesive tape 1 which has been completely unwound, and the beginning end portion 3 2 of the newly attached adhesive tape 1 so that the connection -63-200913828 is very simple. Next, the used disc 3 a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. The coiling tray 17 of (a) is directly used, and the adhesive tape of the used adhesive tape 1 having a small remaining number of rolls is replaced with a new adhesive tape, and the new adhesive tape and the winding tray are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion 3 of the adhesive tape remaining on the side of the take-up reel 1 7 is removed. 0. The beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 overlaps. Next, a slightly triangular-shaped card stopper 46 is inserted into the overlapping portion of the two, and the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined. Since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up. Therefore, the number of replacements of the take-up reel 17 can be reduced, and the work efficiency is good. In the following, the second to fourth embodiments of the invention described in the fifth to eighth aspects of the invention are described. In the following description, the same reference numerals will be given to the same parts, and the detailed description of the parts will be omitted. The description is mainly based on the difference from the above-described first embodiment. In the second embodiment shown in Fig. 9, the claws 48 and 49 which are disposed at one end and the other end, and the claws of the both ends are used, and the card of the elastic member 50 of 49 is used. The stopper member 4 7 is connected to the end portion 30 of the adhesive tape 1 of one side and the beginning end portion 3 2 of the other adhesive tape 1 2 to 64-200913828. Specifically, the end portion 32 of the adhesive tape 1 of the other end of the adhesive tape 1 is brought into contact with each other. The claw portion 4 of one end of the locking member 47 is locked to the end portion 3 G. The claw portion 49 at the other end is locked to the start end portion 32, and the claw portion 48 and the other claw portion 49 of the one side are elastically configured. Further, the claw portion 48 is provided with a plurality of claws 51 having a pointed tip end on the back surface of the plate member. Since the claw portion 48 disposed at one end of the locking member 47 is engaged with the end portion 30, and the claw portion 49 disposed at the other end is locked to the start end ΐ, the connection is very easy. Further, since the elastic member 50 is provided between the claw portions 49 of the other claw portion, the elastic member is stretched to lock the other claw portion 49 of the locking member 47 to the beginning end portion 3 of the other material tape 1. At any position of 2, the connection is made. In the third embodiment shown in Fig. 1, the end portion 30 of the adhesive tape 1 on the disk 3a for winding and the beginning end portion 3 of the adhesive tape 1 of the new adhesive 3 are made. The adhesive surface of the starting end portion 3 2 is superposed on the surface of the substrate 9 of the terminal portion 30, and secondly, the elastically deformable clip 5 3 having a cross-sectional shape of a cross section is sandwiched by the overlapping portion because the overlap is only sandwiched by the clip 53 Part of the implementation of the connection, so it is very easy. In the fourth embodiment shown in Fig. 1, in the first embodiment, the metal holding piece 55 having a substantially three-shaped cross section covers the portion 'and flattens the holding piece 55 from both sides of the overlapping portion. To connect the two systems from the two sides of the overlapping portion to flatten the clamping piece 5 5 to implement the connection, "0 and is equipped with . The arrangement of the cattle 50 pulls, the 47 series ends at the end 32, and the 50 and 50 can be stretched. The height of the material is slightly fixed. Pick up the work form and overlap the part. For this reason, Kelly -65 - 200913828 uses a overlapping part to obtain a strong connection. The invention described in the fifth to eighth aspects of the invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first embodiment described above, the locking pin 46 may not be slightly triangular and may be a linear pin. In this case, the overlapping portion should be fixed by a plurality of pins. In the second embodiment, it is also possible to use an adhesive tape! A plurality of locking members 47 are used for the width. In the third embodiment and the fourth embodiment, a plurality of clips 53 or holding pieces 55 may be used and fixed from both sides of the overlapping portion of the adhesive tape 1. Next, the invention described in the claims 9 to 13 will be described. These inventions relate to an adhesive tape for attaching and fixing an electronic component and a circuit board or a circuit board, and an electrical connection between electrodes of the two, in particular, a method of joining the adhesive tape wound into a disk shape. Next, the background technology of the invention described in the claims 9 to 13 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2000-A No. 8 4 0 0 No. 5 discloses that the adhesive tape coated with the adhesive material on the substrate -66-200913828 is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase from -67 to 200913828. It may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 9 to 13 is to provide a method of connecting an adhesive tape, which makes it easier to replace the adhesive disk, and to improve the production efficiency of the electronic device. Next, with reference to the attached drawings, an embodiment of the invention described in the ninth to thirteenth patent application will be described. First, referring to Figs. 2A, A, B, and 3 to 5, the scope of the patent application is described. The first embodiment of the invention described in the items 9 to 13 will be described. Fig. 2 is a view showing a method of connecting the adhesive tapes according to the first embodiment, and Fig. 2A is a perspective view showing the connection between the adhesive sheets, and Fig. 2B is a connection of Fig. 2A. An oblique view of the partial connection method. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on both width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 3 m. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. Heat-68-200913828 The plastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is an epoxy resin type, a vinyl ester type resin, an acryl resin type, and an enamel resin type. representative. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, or carbon, graphite, etc. may also be in the foregoing and/or non-conductive glass or ceramics. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the take-up reel 7, And roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17 to bond the adhesive 11 Pressed to the circuit substrate 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the electrode -69-200913828 and the wiring circuit (electronic component) 23 of the circuit board 21 are positioned and connected. On the formal connection, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a buffer. The material is heated and pressurized by the wiring circuit 2 3 to the circuit board 2 1 by the heating and pressing head 19. In this manner, the electrode 2 1 a of the circuit board 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be a PDP. The entire circumference is pressed, and the connection portion is more. The amount of the adhesive 1 used at one time is much larger than the conventional usage. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 2A). The joining method of the adhesive tape of the invention described in the ninth to thirteenth aspect of the patent application can be divided into the following two types: (a) directly using the take-up reel 1 7 and replacing the residual reel number of the used adhesive tape 1 Less adhesive tape, and connect new adhesive tape and take-up reel 17, (b) Use adhesive tape with less residual reeling tape of used adhesive tape 1 as take-up reel 1 7 and connect new When the adhesive tape and the adhesive tape 〇(b) having a small residual reel count are shown, as shown in Fig. 12A, in order to replace the disc 3a with the new adhesive disc 3, the adhesive tape 1 of the disc 3a is implemented. The end portion 30 of the adhesive tape of the disc 3a (adhesive tape of one side) 1 and the beginning end of the adhesive tape (the other adhesive tape) of the new adhesive sheet 3 wound on -70-200913828 3 2 connection (refer to Figure 12 A). The connection of the adhesive tape 1 is such that, as shown in Fig. 12B, the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a and the beginning portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are used. The surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the substrate 9 of the terminal portion 30. The overlap length Η of the two is about 2.5 times the width W of the adhesive tape 1, and is placed on the table 36, and is heated and pressurized by the heating and pressing heads 1 of the bonding device 15 to perform adhesion. In this manner, the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound around the new disk 3 can be connected. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. In this embodiment, since the heating and pressing head 19 is used, the disk 3, 3 a which is wound around the adhesive 1 can be replaced without using the pressing device between the adhesives, and the winding disk of (a) can be directly used. 17. When the adhesive tape of the adhesive tape 1 which has been used has a small remaining number of tapes is replaced with a new adhesive tape, and the connection of the new adhesive tape and the take-up reel 1 7 is performed, the used disc is exposed. When the end mark 2 of the adhesive tape 1 of 3 a is cut off from the vicinity of the end mark 28 of the adhesive tape 1, the end portion 30 of the adhesive tape remaining on the side of the take-up reel 1 and the new adhesive are placed. The beginning end portions 3 2 of the adhesive tape 1 of the disc 3 overlap each other. Next, the overlapping portion of the two is heated and pressurized by the heating and pressing head 1 of the bonding device 15 to carry out adhesion. Since the take-up tray j 7 -71 - 200913828 only winds up the substrate 9, it is possible to take up several adhesive discs and reduce the number of replacements of the take-up tray 17 with good work efficiency. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinder 25, an adhesive 11 obtained by mixing a resin and conductive particles 13 is applied by a coater 27, dried in a drying oven 29, and then taken up by a coiler. 3 1 Take the original material. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7 and 7 are attached to the reel from both sides, or are taken up to the reel of the side plate. In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (_ 5 ° C to -1 Ot ) and shipped. In the following, the other embodiments of the invention described in the ninth to third aspects of the invention are described. In the embodiments described below, the same reference numerals will be given to the same parts as the above-mentioned embodiments, and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 3, the overlapping portion of the adhesive tape 1 is sandwiched between the mold 56 having the surface unevenness (concavity and convexity) 44 and the other mold 57. 34, the overlapping portion 34 is formed with the unevenness 58. Thus, by forming the unevenness 5 8, the adhesion area ' of the overlapping portion 34 can be increased and the engagement of the unevenness 58 of the overlapping portion 34 can increase the strength of the stretching direction (the longitudinal direction of the adhesive tape). When the unevenness is formed, the adhesive 1 1 flows and the adhesive adheres to the end faces of the overlapping portions, so that the strength of the overlapping portion 34 in the stretching direction can be further improved. In the third embodiment shown in Figs. 14 and A and Fig. 14B, the -72-200913828 is taken up to the beginning end portion 3 of the disc 3 of the new adhesive material 1 and bent into a substantially V shape, and wound. The end portion 30 of the adhesive tape 1 on the used disc 3a is also bent into a V-shape so that the two hooks must be adhered to each other and locked (Fig. 14A). The heating and pressurizing head 19 is heated and pressurized to connect the two (Fig. 14B). In the third embodiment, the terminal portion 30 and the starting end portion 3 2 are connected in a hook shape to obtain a strong connection, and at the same time, the connection is made by the overlapping of the adhesive 1 1 , so that a stronger connection can be obtained. . As in the above, since the adhesive flows in the overlapping portion and adheres to the end faces, a stronger connection can be obtained. In the fourth embodiment shown in Figs. 15 and A and Fig. 5B, the through hole 509 is formed in the overlapping portion 34 before the heating and pressurization or the heating and pressing in the first embodiment. When the through hole 5 9 is formed by heating and pressurizing, the adhesive U can be oozing out from the periphery of the through hole 59 to be adhered to increase the adhesive force, and the overlapping portion 34 can be strongly connected. The invention described in the claims 9 to 13 is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention as set forth in the claims 9 to 13 of the patent application. For example, in the second embodiment described above, the unevenness 5 8 does not have to be a mountain shape, and may have a curved nine shape. In the fourth embodiment, the number of the through holes 590 is not particularly limited and may be any number. Further, the diameter of the through hole 5.9 is not limited. Further, in the second and third embodiments, the H through hole 5.9 may be further formed on the overlapping portion 34. Next, the invention described in the first to fourth paragraphs of the patent application is described in the paragraph -73-200913828. These inventions relate to an adhesive tape for attaching and fixing an electronic component and a circuit board or a circuit board, and an electrical connection between electrodes of the two, in particular, a method of joining the adhesive tape wound into a disk shape. Next, the background art of the invention described in the claims 1 to 11 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-280400 No. 5 discloses that the adhesive tape to which the adhesive material is applied to the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. After the adhesive material tray is mounted, the adhesive is pressed onto the circuit substrate by a heating and pressing head from the substrate side of the adhesive tape which is rolled out from the adhesive material tray, and the residual substrate is taken up by the take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is adhered. The beginning of the tape is attached to the take-up reel via a guide pin of the adhesive device. -74- 200913828 However, in recent years, as the panel screen of PDP and the like has increased in size, the adhesion area of the circuit board has increased. The amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may become a cause of clogging because the adhesive oozes from both sides of the tape. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. On the other hand, the adhesive tape and the adhesive tape are adhered to the adhesive tape, and the adhesive is not sufficiently adhered. In order to impart good adhesive peelability to the adhesive tape, a fluorine-based release agent or a bismuth-based release agent or the like is applied thereon, which is because of the influence thereof. Therefore, the object of the invention described in the claims 1 to 10 is to provide a method for joining adhesive tapes, in particular, when the substrate of the adhesive tape is treated with a ruthenium-treated substrate, it is also adhesive. The replacement of the material plate is relatively simple' and the production efficiency of the electronic machine is improved. Next, the description of the invention of the invention described in the patent application No. 1 4 to 18-75-200913828 will be described with reference to the drawings. First, reference is made to Figs. 16A, B, and 3rd to 5th. The first embodiment of the invention described in the claims 14 to 18 will be described. Fig. 16 is a perspective view showing the connection between the adhesive tapes of the first embodiment. Fig. 16A is a perspective view of the connection between the adhesive sheets. Table 1 6 Fig. B is the connection portion of Fig. A 6 Fig. A An oblique view of the connection method of part (b). The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 配置 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. The adhesive tape 1 is composed of a ruthenium-treated substrate 9 and an adhesive 1 1 applied to one side of the ruthenium-treated substrate 9. The ruthenium treated substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or PET (polyethylene terephthalate), etc., in terms of strength and releasability of the adhesive to the electrically conductive material. The base material is formed, and the surface thereof is subjected to surface treatment using a resin or the like. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, and an acrylic resin type "antimony resin type". Conductive particles 13 are dispersed in the adhesive 1 1 . The conductive particles 13 are metal particles such as Au, Ag ' Pt, Ni ' Cu, W, Sb, Sn, solder, or the like, or carbon, graphite, etc.' may also be in the aforementioned materials and non-conductive glass 'ceramics, plastics The polymer core or the like is covered with the above-mentioned conductive layer or the like to form conductive particles -76-200913828. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3 a of the adhesive tape 1 and the take-up reel 1 7 are attached to the adhesive device 15 , and the front end of the adhesive tape 1 wound on the disc 3 a is attached to the roll. Take the tray 17 and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 2 1 so as to be disposed between the two trays 3 a and 17 (the heat-adjusting head 19 disposed to be placed on the side of the enamel-treated substrate 9). The adhesive tape 1 is pressed to press the adhesive 1 1 to the circuit board 21 1. Thereafter, the crucible base material 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the circuit board 21 is implemented. The electrodes and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected in a formal manner. As shown in FIG. 4, the wiring circuit (or the electronic component) is placed on the adhesive 1 1 pressed onto the circuit board 21. 2 3, if necessary, for example, the polytetrafluoroethylene material 24 can be used as a buffer material, and the heating and pressing head 19 can be used to heat and press the wiring circuit 23 on the circuit board 2 1. Using this method -77-200913828 The electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and the entire circumference of the PDP may be pressed, and the connection portion may be More, the amount of adhesive 1 used in one use will be much greater than Therefore, the amount of the adhesive tape entangled on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up in a relatively short period of time. To the take-up reel 17, the end mark 28 of the adhesive tape 1 wound around the disc 3a is exposed (refer to Fig. 16A). The adhesive tape of the invention described in the patent claims No. 14 to 18. The connection method can be divided into the following two types, (a) directly using the take-up reel 17, replacing the adhesive tape of the remaining adhesive tape 1 having a small number of remaining rolls, and attaching the new adhesive tape and the take-up reel 17, (b) when the adhesive tape having a small remaining number of the adhesive tape 1 used is used as the take-up reel 17, and the new adhesive tape and the adhesive tape 〇(b) having a small residual number are attached, As shown in Fig. 16A, in order to replace the disc 3a with the new adhesive sheet 3, the end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is applied to the adhesive tape 1 of the disc 3a. And the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3 is the first part 3 2 The connection of the adhesive tape 1 is as shown in Fig. 16, the end portion 30 of the adhesive tape 1 of the adhesive plate 3 a, and the beginning end 3 of the adhesive tape 1 of the new adhesive disk 3 2 will abut each other, and the adhesive tape 60 is attached to the surface of the substrate 9, 9 after the two adhesive materials -78-200913828 tape 1 and 1 are applied, and the two adhesive tapes 1 and 1 are connected. The adhesive tape 60 is composed of a base material 63 and an adhesive 62 applied to one surface of the base material 63. The material of the base material 63 is not particularly limited. However, the present embodiment is a polyimide resin material. Further, in Fig. 16B, the adhesive 11 of the adhesive tape and the adhesive portion 4 of the adhesive tape 60 are indicated by oblique lines, respectively. Here, the adhesion of the adhesive tape 60 will be described. Since the adhesive substrates 1 and 1 of the adhesive tape 1 and 1 of the other side are covered with the enamel, it is difficult to adhere with the adhesive. However, in the present embodiment, the adhesive 43 of the adhesive tape 60 is adhered. With the enamel resin, the difference in surface tension between the two substrates 9 and 9 is small, and the end portion of the adhesive tape 1 and the other end of the adhesive tape 1 can be made by adhesion (adhesion). 3 2 has a good connection. The surface tension difference between the surface of the adhesive tape 6 and the surface of the ruthenium-treated substrate 9 and 9 should be 10 mN/m (10 dyne/cm) or less, and in the present embodiment, there is almost no difference in surface tension. In general, the surface tension of the two end treatment portions 9 and 9 of the end portion 30 of the adhesive tape 1 and the other adhesive tape 1 of the adhesive tape 1 is 25 mN/m to 60 mN/m (25 to 60 dyne/cm). For example, when the surface tension is 3 OmN/m, the surface tension of the adhesive 62 of the adhesive tape 60 should be set to 20 mN/m or more and 40 mN/m or less. Shixi adhesives are mainly composed of sand rubber and sand resin. Generally speaking, 'they make the two have a little condensation reaction and have adhesiveness. Secondly, Li-79-200913828 uses peroxide and platinum catalyst. The hydrogenation reaction is carried out to make the temperature below -1 oot. All of the above are marketable and available. Thus, the adhesive tape 1' wound around the material tray 3a and the connection wound around the new adhesive tape 1 are carried out by the adhesive tape 60. Next, the used adhesive sheets 3 are replaced with each other, and the new adhesive sheet 3 is loaded. Therefore, it is not necessary to pull out the adhesive material tape of the new adhesive sheet 3 to the take-up tray 17, or the guide pin 36 of the new adhesive tape device 15, so that the adhesive sheet 3 has a good work efficiency. In this way, since the terminal portion 30 which has been completely unwound and the adhesive tape 1 of the newly attached adhesive tape 1 are connected, the connection is very simple. Next, the used tray 3a and the new tray 3 are attached to each other to the bonding device 丨5. Therefore, it is not necessary to take up the new adhesive material for the operation of the tray 17. Directly using (a) the reeling tray 1 7 'Replace the adhesive tape which has been used less than 1 in the number of residual reels into a new adhesive. When the new adhesive tape and the take-up reel 17 are connected, the adhesive tape 1 of i When the end mark 28 is exposed, the cutting is performed in the vicinity of the end mark 28 of the right end, and the end portion 30 of the tape-attached tape and the sticky end portion 3 2 of the new adhesive sheet 3 are brought into contact with each other. Next, 'the end portion 30 of the adhesive tape 1 and the new joint are applied to the tape, and the glass transfer is selected to make the adhesive P-plate 3a on the used adhesive sheet 3 and the new adhesive device 15 Belt 1 and the adhesive 1 is attached to the adhesive, 3a is replaced with the adhesive tape 1 3 end 32 is replaced by ί, the new disc 3 tape 1 is attached to the adhesive tape adhesive tape, and the used tray 3 a ί Adhesive tape 1 The part of the adhesive tape 1 on the side of the tray 1 is bonded to the beginning end 32 of the adhesive tape 1 by the adhesive tape 3 -80- 200913828. Since the take-up reel 17 only takes up the substrate 9', it is possible to take up a plurality of adhesive discs and reduce the number of replacements of the reeling disc I. It has good work efficiency. Next, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, dried in a drying furnace 29, and then wound up by a coiler 31. original material. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7 and 7 are attached to the reel from both sides, or are taken up to the reel of the side plate. In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the other embodiments of the invention described in the first and fourth embodiments of the invention are described, and the same reference numerals are given to the same parts as the above-mentioned embodiments, and the detailed description of the parts is omitted. The difference from the above embodiment is mainly. In the second embodiment shown in Fig. 17, in addition to the first embodiment described above, the end portion 30 of the adhesive tape 1 and the beginning end portion 3 of the other adhesive tape are adhered. Adhesive tape 60 is also attached to the side of the agent 11. In the second embodiment, the adhesive agent 62 of the adhesive tape 60 has an adhesive force of 10 〇〇 g / 25 mm or more, and in the present embodiment, it is 700 g / 25 mm to 1 400 g / 25 mm. Further, the surface tension of the adhesive agent 62 of the adhesive tape 60 is set to be the same as that of the above-described embodiment. The surface tension difference between the one and the other adhesive tape is -81 - 200913828 10 mN/m ( lOdyne/cm) below. In the second embodiment, the two sides of the end portion 30 of the adhesive tape 1 and the other end portion 32 of the other adhesive tape can be adhered by the adhesive tape 60, which is higher than that of the first embodiment. The strength is used to carry out the adhesion of the two adhesive tapes, 1 and 1 . In the third embodiment shown in Fig. 18, the end portion 30 of one of the adhesive tapes 1 and the other end portion 3 of the other adhesive tape 1 are placed in an overlapping manner, and the side surface of the substrate 9 is adhered and adhered. The adhesive tape 60 of the second embodiment is attached to the side surface of the material 1 1 , and the third embodiment can provide the same operational effects as those of the second embodiment. In the fourth embodiment shown in Fig. 9, between the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 3 of the other adhesive tape 1, the both sides of the substrate are coated with ruthenium. Adhesive tape 61 is adhered to adhesive tape 62 for connecting terminal portion 30 and starting end portion 32. According to the fourth embodiment, since the adhesive tape 61 on both sides is used, the connection between the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 32 of the other adhesive tape 1 is much simpler and easier. Next, the invention described in the Patent Application No. 19-2-1 will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to a method of connecting an adhesive tape wound into a disk shape. Next, the background art of the invention described in the Patent Application No. 19-2-1 will be described. In general, a liquid crystal panel, a PDP (plasma display panel), an EL (-82-200913828 fluorescent display) panel, an electronic component such as a bare chip package, a circuit board, or a circuit board, or a circuit board, and both The method of electrically connecting the electrodes is to use an adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per disk to reduce the frequency of replacement of the disk. However, since the tape width of the adhesive tape is narrower. 1~ -83- 200913828 3mm 'If you increase the number of rolls, it may cause the roll to be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 9-9 to 2 is a method of connecting the adhesive tape, which makes it easy to replace the adhesive disk, and improves the production efficiency of the electronic device. Next, with reference to the attached drawings, an embodiment of the invention described in the Patent Application Nos. 19 to 21 will be described. First, reference is made to FIGS. 2A to A, C1, 2, 4, and Fig. 5 is a view showing a third embodiment of the invention described in the claims 1 to 2 of the patent application. 20A to C are connection diagrams of the adhesive tape of the present embodiment, and FIG. 20A is a perspective view of the connection between the adhesive sheets, and the connection portion of the second drawing b and the C drawing 20A. A cross-sectional view of the connection method. The adhesive tape 1 is wound around the disk 3' 3 a, and each of the disks 3, 3 a is provided with a reel 5 and a side plate 配置 disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive enamel applied to one side of the substrate 9. From the strength and the releasability of the adhesive to the dissimilar conductive material, the substrate 9 should be made of 〇PP (extended polypropylene), polytetrafluoroethylene, and PET treated with Shixia (polyethylene terephthalate). The diester) constitutes 'however' -84 - 200913828 is not limited to this. The adhesive U is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting axillary tree β-based system is an epoxy resin type, a B's thiol ester type resin, an acrylic resin type, or an anthracene resin. Department is representative. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as An, Ag, Pt, Mi, Cu, W, Sb, Sn, solder, or the like, or carbon, graphite, etc. may also be in the foregoing and non-conductive glass, ceramic, plastic A polymer core or the like is formed to cover the conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use a polymer as a core material. For example, solder can be controlled to a softened state at a wide connection temperature because there is no melting point, and the error of the thickness and flatness of the electrode can be easily obtained. Connection member. Next, the method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 21, the disc 3a for the adhesive tape and the take-up reel 17 are attached to the adhesive device is, and the front end of the adhesive tape 1 wound on the disc 3a is mounted via the guide pin 22. To the take-up tray 17, and roll out the adhesive glue rtj 1 (arrow e in the figure of the brother 21). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating-85-200913828 indenter 19 disposed between the two trays 3 and 17 and The adhesive 1 1 is pressed to the circuit substrate 2 1 . Thereafter, the substrate 9 is taken up to the take-up reel 1 7 〇 After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. On the formal connection, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a buffer. The material is heated and pressurized by the wiring circuit 23 on the circuit board 21 by the heating and pressing head 19. In this manner, the electrode 2 1 a of the circuit board 2 1 and the electrode 2 3 a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be large, and the amount of the adhesive 1 used at one time may be much larger than that of the PDP. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (see Fig. 20A). The method of connecting the adhesive tape of the invention described in the Patent Application No. 19-2-1 can be divided into the following two types: (a) directly using the take-up reel 17, and replacing the residual roll number of the used adhesive tape 1 Less adhesive tape, and connect new adhesive tape and take-up reel 17, (b) Use adhesive tape with less residual reel of used adhesive tape 1 as take-up reel 1 7 and connect new Adhesive tape and adhesive tape with less residual volume -86- 200913828 (b) As shown in Fig. 20A, in order to replace the disc 3a with the new adhesive disc 3, the adhesive tape 1 on the disc 3a When the end mark 28 is exposed, the end portion 3 of the adhesive tape (one adhesive tape) 1 of the disk 3a, and the adhesive tape (the other adhesive tape) wound around the new adhesive disk 3 are The start end portion 3 2 is connected by a resin adhesive 64. The resin adhesive 64 is, for example, an epoxy resin, a cyanic resin, a bismaleimide resin, a phenol resin, a urea resin, a melamine resin, an alkyd resin, an acrylic resin, an unsaturated polyester resin, or a phthalic acid. A diallyl resin, an anthracene resin, a resorcinol formaldehyde resin, a xylene resin, a furan resin, a polyurethane resin, a ketone resin, a trimeric allylamine cyanide resin, or the like. The connection of the adhesive tape 1 is as shown in Fig. 20B, the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a, and the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3, the beginning portion The surface of the adhesive 1 of 32 is superposed on the surface of the substrate 9 of the terminal portion 30. Next, a paste-like resin adhesive 64 is applied to the overlapping portion by means of a filling machine 65 combined with the bonding device U. Next, as shown in Fig. 20C, when the resin adhesive 6 4 is a thermosetting resin, it is cured by heating by a heater 66 combined with the adhesive device 15 to connect the end portion of the adhesive tape 1 . 30, and the beginning end portion 3 of the adhesive tape 1 of the new adhesive sheet 3. In this manner, the bonding of the adhesive tape 1 wound on the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be performed. Thus, the connection between the terminal portion 30 of the adhesive tape 1 - 87 - 200913828 and the beginning portion 32 of the newly attached adhesive tape 1 is fixed by the resin adhesive 64, so that the connection is very simple. Next, the used disc 3a and the new disc 3 are replaced with each other', and the new disc 3 is attached to the adhesive device 15. Therefore, there is no need to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. When the reeling tape 17 of (a) is used as it is, the adhesive tape of the used adhesive tape 1 having a small remaining number of rolls is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, the cutting is performed from the vicinity of the end mark 28 of the adhesive tape 1, so that the end portion of the adhesive tape remaining on the side of the take-up reel 1 is 30. The beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 overlaps. Then, a paste-form resin adhesive 64 is applied to the overlapping portion of the two, and the adhesive portion is applied by heating or ultraviolet irradiation depending on the type of the resin-based adhesive to be used, and the terminal portion 30 and the new adhesive are applied. The connection of the beginning end portion 32 of the adhesive tape 1 of the disc 3. Since the take-up tray 17 only winds up the substrate 9, it is possible to take up several sheets of the adhesive sheet, and reduce the number of replacements of the take-up tray 17 with good work efficiency. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5 . The adhesive u mixed with the resin and the conductive particles 13 is applied onto the substrate of the 1>fc winder 25, and the adhesive u is mixed with the resin and the conductive particles 13 and dried. Machine 3 1 takes up the original material. The original material of the unwound adhesive tape is cut into a specific width by the cutter 33 and taken up to the reel. The side panels 7, 7 are mounted on the reel from both sides, -88-200913828 or 'rolled to The reel with the side plate is bundled with the dehumidifying material, and is managed at a low temperature (-5 °C to -1 0 °C) and shipped. The invention described in the ninth aspect of the invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. In the present embodiment, the resin-based adhesive 64 is exemplified by a thermosetting resin. However, the photocurable resin may be substituted for the thermosetting resin, and the curable resin may be cured by irradiation with light such as ultraviolet rays. The connection between the tapes 1. In this case, the photocurable resin may be a composition of a photopolymerization initiator which has an acrylic group or a methacryl group, or an aromatic heavy azo salt, a diallyl iodide salt, a phosphonium salt, or the like. Epoxy resin of light hardener, etc. Moreover, the resin adhesive may also be a hot metal adhesive mainly composed of an ethylene vinyl acetate resin or a polyolefin resin, for example, a plate-shaped hot metal adhesive, and a plate-shaped hot metal adhesive is placed on the adhesive. On the overlapping portion between the tapes 1, the hot metal adhesive is heated by the heater 66 to be melted, and then the hot metal adhesive is solidified by cooling to effect the connection between the adhesive tapes 1. The resin adhesive used for the connection of the adhesive tape 1 may be selected from a group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive.
上述之實施形態時，使黏著材盤3a之黏著材膠帶！ 之終端部30之基材9面、及新黏著材盤3之黏著材膠帶I -89- 200913828 之始端部32之黏著劑11面互相重疊，並塗布樹脂製黏著 劑之熱硬化性樹脂來實施連接’然而’亦可反折黏著材盤 3 a之黏著材膠帶1之終端部3 0，並以重疊黏著劑1 1面來 實施兩者之黏著後’再以熱硬化性樹脂固定。 其次，針對申請專利範圍第22〜24項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶盤及黏著裝置相關。 其次，針對申請專利範圍第2 2〜2 4項記載之發明之 背景技術進行說明。 —般而言’液晶面板、PDP (電漿顯示面板）、EL( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從黏著材膠帶盤捲出之黏 著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基板 等，再以捲取盤捲取殘餘之基材。 -90- 200913828 其次’一方之黏著材膠帶盤之黏著材膠帶用完時’拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又’因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數’來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第22〜24項記載之發明的目的 ，係在提供一種黏著材膠帶盤、及黏著裝置，可使黏著材 膠帶盤之更換更爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第22〜24 項記載之發明之實施形態進行說明，首先，參照第22圖 -91 - 200913828 A〜C、第2 3圖、第4圖、及第5圖，針對申請專利範 第22〜24項記載之發明之第丨實施形態進行說明。第 圖A〜C係第1實施形態之黏著材膠帶盤圖，第22圖 係黏著材膠帶盤的斜視圖，第22圖B係第22圖A之正 圖’第22圖C係第22圖A之連結膠帶之平面圖，第 圖係黏著裝置之黏著劑壓著步驟的槪略圖。 如第22圖A所示，本實施形態之黏著材膠帶盤A 有複數之黏著材膠帶之捲部（以下簡稱爲捲部）2、2ς 捲部2、2a之盤3、3a上分別捲繞著黏著材膠帶1。各 3、3 a上配設著捲軸5、及配置於黏著材膠帶1之兩寬 側之側板7。如第23圖所示，黏著材膠帶1係由基材ί 及塗布於基材9之一側面的黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部30、 捲繞於另一方之捲部之黏著材膠帶（以下稱爲另一方之 著材膠帶）1之始端部3 2間，配設著用以連接兩者之連 膠帶41。從一方之黏著材膠帶1之終端部3 0沿著盤3 側板7之內側面配置著連結膠帶6 7，前述連結膠帶6 7 卡止於側板7之上部之切口部份68而連接於另一方之 著材膠帶1之始端部3 2。 又，一方及另一方之黏著材膠帶1、及連結膠帶67 連接部份，會標示著用以辨識連結膠帶67之標記69、 ，以膠帶檢測手段（發光部7 1、受光部7 2 )檢測到標 69、70時，會跳過連結膠帶67部份而不對連結膠帶67 圍 22 A 面 23 具 ， 盤 度 著 及 黏 結 之 會 黏 之 70 記 部 -92- 200913828 份實施壓著。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由opp (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑Π係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述之導電層等而形成者。此 外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶盤A之使用方法 進行說明。如第2 3圖所示，將黏著材膠帶盤A、及捲取 -93- 200913828 盤17裝著至黏著裝置15 ’經由導引銷22將一方之黏著材 膠帶1之始端部32裝設至捲取盤17 ’並捲出黏著材膠帶 1(第23圖中之箭頭E)。其次’將黏著材膠帶1配置於 電路基板2 1上’利用配置於兩盤3 ' 1 7間之加熱加壓頭 1 9從基材9側實施黏著材膠帶1之壓接’將黏著劑11壓 著至電路基板21。其後’將基材9捲取至捲取盤17。 上述之壓著後（暫時連接）’實施電路基板21之電 極及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上’如第4圖所示’在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）2 3，必要 時，可將例如聚四氟乙烯材2 4當做緩衝材，以加壓加壓 頭1 9對電路基板2 1實施配線電路2 3之加熱加壓。利用 此方式，可連接電路基板21之電極及配線電路23之 電極23a及奁連接。 利用本實施形態之黏著材膠帶1之P D P，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑Π的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦會變 多，捲繞於盤3上之黏著材膠帶1在相對較短之時間內會 被捲取至捲取盤1 7。 一方之黏著材膠帶1全部捲出時，連結膠帶6 7會脫 離切口部份68，接著，會捲出另一方之黏著材膠帶1。本 實施形態時’因爲在一方之黏著材膠帶1之終端部3 0及 另一方之黏著材膠帶1之始端部32之間，具有用以連接 -94- 200913828 兩者之連結膠帶67，故一方之黏著材膠帶1全部捲出時， 會接著開始捲出另一方之黏著材膠帶1。因此，無需實施 在一方之黏著材膠帶1之全部捲出後將新黏著材膠帶1裝 設至捲取盤17之作業，故可提高電子機器之生產效率。 又，如第23圖所示，黏著裝置15具有一對發光部71 及受光部72，用以實施連結膠帶67之光學檢測。用以連 接一方之黏著材膠帶1及另一方之黏著材膠帶1之兩者的 連結膠帶67之兩端上，標示著黑色標記69、70。發光部 7 1會對黏著材膠帶1連續發出雷射光，受光部72則會接 收其反射光，並將檢測信號傳送至控制裝置7 9。受光部 72會接收到連結膠帶67之兩端之標記69、70之反射光， 並將該檢測信號傳送至控制裝置79。 接收到檢測信號之控制裝置7 9，會對用以驅動黏著裝 置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅動 器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅動 器施加之脈衝數實施旋轉，使兩盤3、17以比通常速度更 快之速度移動，並使黏著材膠帶1朝捲出方向移動對應連 結膠帶67之長度的距離。 利用此方式，另一方之黏著材膠帶1會自動捲出至加 熱加壓頭1 9之位置，可省略以使另一方之黏著材膠帶i 之始端部3 2位於加熱加壓頭1 9之位置而捲出連結膠帶6 7 之作業。 又，因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤17之更換次數，而有良好之 -95- 200913828 作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶盤 A之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機2 7塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後’以捲取機3 1捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機3 3切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者， 捲取至附側板之捲軸上，將其和除濕材一起綑包，實施低 溫（-5 °C〜-1 〇 °C )之管理並進行出貨。 其次’針對申請專利範圍第2 2〜2 4項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第24圖所示之第2實施形態時，因爲連結膠帶67之 寬度T小於前後之黏著材膠帶丨之寬度w，故可辨識連結 膠帶67。又，黏著裝置15上，夾著黏著材膠帶丨之相對 位置上配設著和第1實施形態相同之發光部及受光部。此 時’利用受光部接收透射連結膠帶67之寬度較狹部份的 雷射光來辨識連結膠帶67。 第2 5圖所示之第3實施形態時，連結膠帶6 7會形成 用以辨5哉連結膠帶6 7之多數孔5 3。此時，亦可利用受光 部接收透射連結膠帶6 7之孔5 3的雷射光來辨識連結膠帶 67 ° -96 - 200913828 第26圖所示之第4實施形態時，並未利用連結膠帶 67實施黏著材膠帶1間之連接，而在一方之黏著材膠帶i 全部捲出時’捲出另一方之黏著材膠帶1使其捲附於盤17 上來實施黏著材膠帶1之更換。此時，因爲無需將新黏著 材膠帶盤裝著至黏著裝置，而只需較少之新黏著材膠帶盤 之更換作業，故可提高電子機器之生產效率。 申請專利範圍第22〜24項記載之發明並未受限於上 述之實施形態’只要在未背離申請專利範圍第22〜24項 記載之發明之要旨的範圍內，可實施各種變形。 例如’上述之第1及第2實施形態時，捲部2、2a之 個數並無任何限制，而可以爲任何個數。 第1至第3實施形態係以光學方式檢測連結膠帶67， 然而，亦可在連結膠帶67上附加磁性膠帶並以磁性感測 器來進行檢測。 其次，針對申請專利範圍第2 5〜2 8項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 。又，係關於在將半導體元件（晶片）黏著·固定至引線 框架之固定用支持基板或引線框架之晶片、或半導體元件 載置用支持基板之半導體裝置上所使用之黏著材膠帶，尤 其是，和捲成盤狀之黏著材膠帶盤、黏著裝置、及黏著材 膠帶之連接方法相關。 其次，針對申請專利範圍第25〜28項記載之發明之 -97- 200913828 背景技術進行說明。 一般而言’液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法’係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、L0C膠帶、晶粒結著膠帶、微 BGA . CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 曰本特開200 1 -284〇05號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統電極連接用黏著材膠帶之寬度爲1〜3mm程 度，捲取至盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出之 黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基 板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 -98- 200913828 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加’則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第2 5〜2 8項記載之發明的目的 ，係在提供一種黏著材膠帶盤、黏著裝置、及連接方法’ 可使黏著材膠帶盤之更換更爲簡單’而提高電子機器之生 產效率。 其次，參照附錄圖面’針對申請專利範圍第2 5〜2 8 項記載之發明之實施形態進行說明’首先’參照第27圖 A〜C '第28圖、第4圖、第29圖、及第5圖，針對申請 專利範圍第2 5〜2 8項記載之發明之第1實施形態進行說 明。第2 7圖A〜C係第1實施形態之黏著材膠帶盤圖’第 27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 ，第28圖係黏著裝置之黏著劑壓著步驟的槪略圖’第29 -99- 200913828 圖係PDP之黏著劑之使用狀態的斜視圖。 本實施形態之黏著材膠帶盤A具有複數之黏著材膠帶 1之捲部（以下稱爲捲部）2、2a，捲部2、2a具有捲繞著 黏著材膠帶1之盤3、3a。各盤3、3a上配設著捲軸5、 及配置於黏著材膠帶1之兩寬度側之側板7。如第28圖所 不，黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部3 0、及 捲繞於另一方之捲部2a之黏著材膠帶（以下稱爲另一方 之黏著材膠帶）1之始端部32係以卡止具76實施連接。 卡止具7 6係例如剖面略呈3字形之卡止銷’使一方之黏 著材膠帶1之終端部3 0及另一方之黏著材膠帶1之始端 部3 2互相重疊，將卡止銷插入此重疊部份來連接兩者。 其次，本實施形態時，連接部份74如第2 7圖C所示 ’以卡止具7 6連接終端部3 0及始端部3 2之後’將連接 部份74朝膠帶之縱向反折1 80度’使黏著材膠帶1覆蓋 卡止具 7 6。 從強度、及構成向異導電材之黏著劑之剝離性而言’ 基材9應由Ο P P (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而’ 並不限於此。 黏著劑1 1係熱可塑性樹脂、熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 -100- 200913828 苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹脂系 則以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表。 黏著劑U內亦可分散著導電粒子1 3。導電粒子1 3係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶盤之使用方法進 行說明。如第28圖所示，將黏著材膠帶盤a、及捲取盤 17裝著至黏著裝置15，經由導引銷22將一方之黏著材膠 帶1之始端部32裝設至捲取盤17，並捲出黏著材膠帶1 (第2 8圖中之箭頭E )。其次，將黏著材膠帶1配置於 電路基板2 1上’以配置於兩盤3、1 7間之加熱加壓頭j 9 從基材9側實施黏著材膠帶1之壓接，將黏著劑u壓著 至電路基板2 1。其後，將基材9捲取至捲取盤1 7。 其次’如第4圖所示，在壓著至電路基板21上之黏 200913828 著劑1 1上配置配線電路（或電子構件）2 3，可將聚四氟 乙烯材2 4當做緩衝材，以加熱加壓頭1 9對電路基板2 1 實施配線電路23之加熱加壓。利用此方式，可連接電路 基板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1係壓著於PDP 26之周圍 全體，故一次使用之黏著劑11之使用量明顯遠大於傳統 上之使用量。因此，黏著材膠帶1之使用量亦會變多，捲 繞於盤3、3 a上之黏著材膠帶1在相對較短之時間內會被 捲取至捲取盤1 7。 本實施形態時，一方之黏著材膠帶1全部捲出時，連 接部份74會脫離切口 75，接著，會捲出另一方之黏著材 膠帶1 (第27圖B )。本實施形態時，係以卡止具76連 接一方之黏著材膠帶1之終端部30及另一方之黏著材膠 帶1之始端部32，一方之黏著材膠帶1全部捲出時，會接 著開始捲出另一方之黏著材膠帶1。因此，無需實施在一 方之黏著材膠帶1之全部捲出後將新黏著材膠帶1裝設至 捲取盤17之作業，故可提高電子機器之生產效率。又， 連接部份74上因以黏著材膠帶1覆蓋卡止具76，故外觀 良好，同時，可防止連接部份74之卡止具76接觸黏著材 膠帶1而傷害到黏著材膠帶1。 又，如第28圖所示，黏著裝置15具有當做連接部檢 測感測器47使用之厚度檢測感測器，實施連接部份74之 光學檢測，使加熱加壓頭1 9跳過連接部份7 4。一方之黏 -102- 200913828 著材膠帶1及另一方之黏著材膠帶1之連接部份74的厚 度’如第27圖C所示，會大於黏著材膠帶丨之厚度，以 檢測不同厚度來辨識連接部份74。厚度檢測感測器47會 隨時檢測黏著材膠帶1之厚度，並將檢測信號傳送至控制 裝置79。 接收到檢測信號之控制裝置79，會對用以驅動黏著裝 置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅動 器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅動 器施加之脈衝數實施旋轉，使兩盤3、1 7以比通常速度更 快之速度旋轉，並使黏著材膠帶1朝捲出方向移動對應連 接部份74之搬運方向之長度的特定距離。 利用此方式，另一方之黏著材膠帶1會移動至加熱加 壓頭19之位置，故可防止一方及另一方之黏著材膠帶1 之連接部份74移至加熱加壓頭1 9之位置並執行壓著動作 之問題。又，至連接部份41通過加熱加壓頭1 9爲止，會 自動地將一方之黏著材膠帶1捲取至捲取盤1 7，故可省略 捲取之麻煩。 又，利用厚度檢測感測器4 7辨識連接部份74之前端 部4 1 a及後端部4 1 b，並只避開連接部份74，則可有效利 用黏著材膠帶1。 又，因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤17之更換次數，而有良好之 作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶1 -103- 200913828 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機2 7塗布樹脂及導電粒子1 3混合之黏著劑，並以乾燥爐 29實施乾燥後’以捲取機3 1捲取原始材料。被捲取之黏 著材膠帶之原始材料’以切割機33切成特定寬度並捲取 至捲軸後，從兩側將側板7、7裝著於捲軸上，將其和除 濕材一起綑包，實施低溫（-5 T：〜-1 〇。(：）之管理並進行出 貨。 其次’針對申請專利範圍第2 5〜2 8項記載之發明之 其他貫施形態進仃說明’和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第30圖所示之第2實施形態時，未使用具有複數捲 部2、2a之黏著材膠帶盤a，而使用具有1個捲部之黏著 材膠帶盤2 C。此時’黏著材膠帶1係捲繞於捲取盤丨7， 當一方之黏著材膠帶1露出結束標記28時，爲了將一方 之黏著材膠帶盤2b更換至新黏著材膠帶盤2c，而連接一 方之黏著材膠帶1之終端部3 0、及另一方之黏著材膠帶1 之始端部3 2。 此時’亦利用連接部檢測手段之厚度檢測感測器77 檢測連接部份74，而使加熱加壓頭1 9避開連接部份74。 申請專利範圍第2 5〜2 8項記載之發明並未受限於上 述之實施形態’只要在未背離申請專利範圍第2 5〜2 8項 記載之發明之要旨的範圍內，可實施各種變形。 -104- 200913828 例如’上述之第1及第2實施形態時，用以連接黏著 材膠帶1間之卡止具76並未限定爲卡止銷，其方法亦可 以橫剖面略呈3字形之可彈性變形之夾子來夾住並固定兩 者之重疊部份，或者，亦可以橫剖面略呈3字形之金屬片 夾住兩者之重疊部份，並從重疊部份之雨面壓扁夾持片來 連接兩者。 第1及第2實施形態係利用厚度檢測感測器4 7檢測 連接部份74之厚度來辨識連接部份74，然而，並不限於 此，亦可利用透射率檢測感測器來辨識連接部份74、或利 用CCD攝影機使連接部份之表面呈現於監視畫面並以圖 素之濃淡比較來檢測連接部份。 第31圖A、第31圖B、第32圖A〜C係用以實施引 線框架之固定用支持基板、半導體元件載置用支持基板、 或引線框架之晶片和半導體元件之連接之黏著材膠帶當中 ’將半導體元件黏著·固定於引線框架之固定用支持基板 及引線框架之LOC ( Lead on Chip )構造之1實例。 實施厚度50#m之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏著 材膠帶，而可得到第3 1圖B所示之LOC構造之半導體裝 置。將第3 1圖A所示之黏著材膠帶，以第3 2圖A〜C所 示之黏著裝置之冲切模具8 7 (公模（凸部）9 5、母模（凹 部）96 )冲切成細長形，例如，在厚度〇.2mm之鐵-鎳合 金製引線框架上，以400 °C、3MPa之壓力、3秒鐘之加壓 -105- 200913828 實施壓者，形成〇.2mm間隔、〇.2mm寬度之內引線，製成 附有半導體用黏著膜之引線框架。其次，在其他步驟實施 3 5 0 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半導體元 件壓著至此附有半導體用黏著膜之引線框架之黏著劑層面 ’其後’以金線實施引線框架及半導體元件之絲焊，以連 續成形使用環氧樹脂成形材料等密封材實施密封，得到第 31圖B所不之半導體裝置。第31圖a、B中，81係以黏 著材膠帶冲切所得之半導體用黏著膜，8 2係半導體元件， 8 3係引線框架’ 8 4係密封材，8 5係焊絲，8 6係匯流排條 。第32圖A、B'C係黏著裝置，第32圖A、B中，87 係冲切模具’ 8 8係引線框架搬運部，6 1係黏著劑膠帶冲 切貼附部，9 0係加熱器部’ 91係黏著材膠帶盤（黏著材 膠帶捲出部），92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第32圖C中，9 4係黏著材 膠帶（半導體用黏著膜），95係公模（凸部），96係母 模（凹部），9 7係膜壓板。黏著材膠帶9 2會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部8 9冲切成細長形且黏著至引線框架之引線部 份，將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪9 3搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又’以同樣方法實施引線框架 之晶片及半導體元件之連接·黏著。黏著材膠帶只單純用 -106 - 200913828 於黏著.固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第2 9〜3 4項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著劑膠帶 ’尤其是，和捲成盤狀之黏著劑膠帶、黏著劑膠帶之製造 方法、及黏著劑膠帶之壓著方法相關。 其次，針對申請專利範圍第2 9〜3 4項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -2 84005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度，黏著劑膠帶被從盤捲出並將 黏著劑壓著至電路基板等後，即不再使用。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，上述之電子機器之製造工廠之捲繞著黏著劑 -107 - 200913828 膠帶之盤的更換更爲頻繁，因爲新盤之更換十分麻煩，故 有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率’然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膜的壓力會升高’而可能從 黏著劑膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著劑膠帶之捲數若增加’則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第2 9〜3 4項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在無需增加黏著劑膠帶之捲數 的情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第2 9〜3 4 項記載之發明之實施形態進行說明’首先’參照第3 3圖 A、B、第3圖、第4圖、第34圖、第5圖、第35圖’針 對申請專利範圍第2 9〜3 4項記載之發明之第1實施形態 進行說明。第3 3圖A及B係黏著劑膠帶圖’第3 3圖A 係捲繞著黏著劑膠帶之盤之斜視圖’第3 3圖B係第3 3圖 A之A-A剖面圖，第34圖係PDP之黏著劑之使用狀態的 斜視圖，第3 5圖係在基材上塗布黏著劑之步驟的剖面圖 -108- 200913828 本實施形態之黏著劑膠帶1係捲繞於盤3，盤3上配 設著捲軸5及配置於黏著劑膠帶1之兩寬度側之側板7。 本實施形態時，黏著劑膠帶1之長度約爲5 0m、寬度W約 爲 10mm。 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑1 1所構成，基材9上以具有間隔之方式配置著每條寬 度爲0.5mm之5條黏著劑11。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙燒）、聚四乙稀、或經過石夕 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 -109- 200913828 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點’在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶之使用方法進行 說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著裝置 15’將捲繞於盤3之黏著劑膠帶1之前端裝設至空盤17, 並捲出黏著劑膠帶1(第3圖中之箭頭E)。其次，在電 路基板21上配置黏著劑膠帶1，以配置於兩盤3、1 7間之 加熱加壓頭1 9從基材9側實施將黏著劑膠帶1之壓接， 將1條份之黏著劑1 1壓著至電路基板。其後，將殘餘黏 著劑11和基材9 一起捲取至空盤17。 上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，在壓著於電路基板2 1上之黏著劑1 1上 配置配線電路（或電子構件）2 3，必要時，可將例如聚四 氟乙烯材2 4當做緩衝材，以加熱加壓頭1 9對電路基板2 1 實施配線電路23之加熱加壓。利用此方式，可連接電路 基板21之電極21a及配線電路23之電極23a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑1 1之使用量會遠大於傳統之使用量。因 此，捲繞於盤3上之黏著劑膠帶1之使用量亦會變多，捲 繞於盤3上之黏著劑膠帶1在相對較短之時間內會被捲取 -110- 200913828 至空盤17，盤3會變成空的。 當盤3變成空的時，分別使盤3及盤丨7逆轉，此時 ’會以空的盤3捲取，而使黏著劑膠帶1朝相反方向移動 (第3圖中之箭頭f)。 如此’每1條黏著劑1 1都會依序改變黏著劑膠帶1 之捲取方向（E、F)，而將黏著劑11壓著至電路基板21 〇 此處’參照第5圖及第3 5圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑π，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。如 第3 5圖所示，相對於基材9之1 0mm寬度配置著5個塗 布機27’塗布10mm寬度之5條黏著劑n。被捲取之黏 著劑膠帶之原始材料’以切割機33切成特定寬度並捲取 至捲軸後，從兩側將側板7 ' 7裝著於捲軸上，或者，捲 取至附側板之捲軸上，將其和除濕材一起綑包，實施低溫 (-5 °C〜-1 0 °c )之管理並進行出貨。 其次’針對申請專利範圍第2 9〜3 4項記載之發明之 其他實施形態進行說明’和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第36圖A〜C所示之第2實施形態時，黏著劑膠帶1 之基材之單面全面上塗布著寬度W之黏著劑，利用形成 -111 - 200913828 於基材之縱向的縫隙3 5將黏著劑隔離成寬度W方向上之 複數條。此第2實施形態之黏著劑膠帶1時，縫隙3 5應 在將盤3裝著於黏著裝置丨5後、將黏著劑膠帶1壓著至 電路基板21之前一瞬間形成。此時，亦可在黏著裝置i 5 之盤裝著部附近（如第3圖之S所示）裝設工作面而在捲 出之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在 第5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙 者捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機3 1 捲取之前一瞬間形成縫隙者。 將第2實施形態之黏著劑膠帶1使用於黏著裝置1 5 時，和第1實施形態相同，以縫隙3 5隔離之黏著劑會逐 條以加熱加壓頭1 9從基材9側實施壓著，而如第3 6圖A 、B、C所示，依序逐條使用。 此第2實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到複數條之黏著 劑1 1，十分容易製造。 第37圖A〜C所示之第3實施形態時，基材9之全面 塗布著黏著劑1丨（第37圖A) ’基材9及黏著劑11之寬 度W，係和上述實施形態相同之5〜1 0 〇 0 m m。其次’使用 時亦和第1實施形態相同，將其裝著至黏著裝置1 5，將從 盤3捲出之黏著劑膠帶1配置於電路基板21上，對黏著 劑膠帶1之寬度W方向之部份黏著劑（1條份）實施加熱 加壓（第3 7圖B ) ’降低該部份之凝聚力，只有加熱加 壓之部份黏著劑會從基材剝離而壓著至電路基板2 1 (第 -112- 200913828 3 7 圖 C )。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線，實施加熱加壓部份之全部黏著劑應爲呈現軟化流動（ 簡易指標爲1 〇〇〇泊以下）而未開始黏著劑之硬化反應、 或低位狀態（簡易指標爲反應率20%以下），加熱溫度應 對應使用之黏著劑系來進行選擇。 此第3實施形態時，黏著劑1 1在使用時，只有在寬 度W當中之1條份會軟化流動化且被壓著至基板電路， 故和上述之實施形態相同，只要利用黏著劑膠帶1之盤3 及空盤的正轉及逆轉，即可使用複數次份。 又，如上述之實施形態在黏著劑1 1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑1 1即可，故黏著劑膠帶之製造十分容易。 第3 8圖A〜C所示之第4實施形態，係第1實施形態 之黏著劑膠帶的其他製造方法，在塗布於基材9a上之黏 著劑1 1上形成縫隙9 8後（第3 8圖A )，以使黏著劑1 1 夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另一方 之基材9b (第38圖B)。其次，剝離一方及另一方之基 材9a、9b，各基材9a、9b上會以間隔1條之式配置著黏 著劑條1 1 a、1 1 b。此第4實施形態時，爲了在一方及另一 方之基材9a、9b上交互配置黏著劑條11a、lib，可從一 方之基材9a或9b側以間隔1條之方式實施黏著劑條1 1 a 、Π b之加熱加壓，而將黏著劑條1 1 a、1 1 b以間隔1條之 方式配置於各基材9a、9b上。 -113- 200913828 申請專利範圍第2 9〜3 4項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第29〜34項 記載之發明之要旨的範圍內，可實施各種變形。 例如’上述之實施形態時，亦可爲黏著劑U內未分 散著導電粒子1 3之絕緣性黏著劑。 上述之實施形態時，形成於基材9上之黏著劑的條數 可以爲任意條，至少爲2條以上即可。 其次’針對申請專利範圍第3 5〜4 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 、黏著劑膠帶之製造方法、及黏著劑膠帶之壓著方法。 其次’針對申請專利範圍第3 5〜4 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開2 00 1 -2 84005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 -114- 200913828 黏著劑壓著至電路基板之四周。 然而’近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。 針對此問題’可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而’因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第3 5〜4 1項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在未增加黏著劑膠帶之捲數的 情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第3 5〜4 1 項記載之發明之實施形態進行說明，首先，參照第3 9圖 A、B、第40圖、第34圖、第5圖、第41圖，針對申請 專利範圍第3 5〜4 1項記載之發明之第1實施形態進行說 明。第3 9圖A及B係黏著劑膠帶圖，第3 9圖A係捲繞 著黏著劑膠帶之盤之斜視圖’第3 9圖B係從從黏著劑側 觀看第39圖A之黏著劑膠帶時之平面圖，第40圖係黏著 -115- 200913828 裝置之黏著劑壓著步驟的斜視圖。 本實施形態之黏著劑膠帶1係捲繞於盤3上者， 上配設著捲軸5、及配置於黏著劑膠帶1之兩側的側 。本實施形態時，黏著劑膠帶1之長度約爲50m，寬 則爲和電路基板之一邊大致相同尺寸之約1500mm。 黏著劑膠帶1係由基材9、及塗布於基材9上之 劑11所構成，基材9上之膠帶之寬度方向上，以等 方式配置者1條寬度爲之黏著劑11。 從強度、及構成向異導電材之黏著劑之剝離性而 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂 熱可塑性樹脂及熱硬化，桂樹脂之混合物、或熱金屬 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 又，熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙 酯系樹脂系、及矽樹脂系爲代表。 黏著劑Π內分散著導電粒子〗3。導電粒子1 3 Au ' Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 或碳、石墨等’亦可在前述之物及非導電性之玻璃、 、塑膠等高分子核材等覆蓋前述導電層而形成者。此 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 塑膠等之高分子核材上形成導電層者，會具有因加熱 盤3 板7 度W 黏著 間隔 過矽 ，並 、或 系。 表， 稀基 係如 子、 陶瓷 外， 、或 、或 加壓 -116- 200913828 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小，連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點， 在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很容 易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶1之使用方法進 行說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著裝 置1 5，將捲繞於盤3上之黏著劑膠帶1之前端裝設空盤 1 7並捲出黏著劑膠帶1 (第40圖中之箭頭E )。其次， 在電路基板21上配置黏著劑膠帶1，以配置於兩盤3、i 7 間之加熱加壓頭1 9從基材9側實施黏著劑膠帶1之壓接 ，將1條份之黏著劑1 1壓著至黏著劑膠帶之寬度方向上 之電路基板之一邊，只有該條份之黏著劑11會被捲取至 空盤17。 其次’將電路基板21旋轉約9 0度，使電路基板2 1 之鄰邊位於黏著劑膠帶1之寬度方向上，利用加熱加壓頭 19將黏者劑11壓著至電路基板21之另一邊。如此，將電 路基板21旋轉約90度並壓著黏著劑11，可將黏著劑u 壓著至電路基板21之四周。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連接 。正式連接上’將黏著劑11壓著至電路基板21之四周後 ，在黏著劑1 1上配置配線電路（或電子構件）2 3，必要 時’可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 -117- 200913828 頭1 9對電路基板21實施配線電路23之加熱加壓（參照 第4圖）。利用此方式，可連接固定電路基板21之電極 2 1 a及配線電路2 3之電極2 3 a。 如第34圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑1 1之使用量會遠大於傳統之使用量。然 而，因爲黏著劑膠帶1之寬度W和電路基板21之一邊之 長度Η大致相等，即使和黏著劑膠帶1之寬度W較大之 傳統者相同之捲數’其黏著劑量亦遠多於傳統之物，故盤 之更換次數遠少於傳統之物。 此處’參照第5圖及第41圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子1 3混合而成之黏著劑u，並 以乾燥爐2 9實施乾燥後’以捲取機3 1捲取原始材料。塗 布機27會左右移動’以等間隔在基材9上塗布條狀黏著 劑。被捲取之黏著劑膠帶之原始材料，以切割機3 3切成 特定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲 軸上，或者’捲取至附側板之捲軸上，將其和除濕材一起 綑包，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次’針封申I靑專利軺圍第35〜41項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 200913828 第41圖所示之第2實施形態時，黏著裝置15上有2 處裝著至黏著劑膠帶1’以互相垂直之方式裝設一方之黏 著劑膠帶1及另一方之黏著劑膠帶i。其次’一方之黏著 劑膠帶1將黏著劑1 1壓著至電路基板2 1之相對縱邊N上 (第1步驟），另一方之黏著劑膠帶1則將黏著劑1 1壓 著至相對橫邊Μ上（第2步驟），2個步驟即可將黏著劑 壓著至電路基板21之四周。此第2實施形態時’在第1 步驟及第2步驟之間無需旋轉電路基板21之方向’可將 第1步驟中載置之電路基板21直接移至第2步驟，故可 實現黏著劑之自動壓著’此外，亦可提高作業效率。此時 ’亦可將電路基板21載置於搬運帶而實現自動搬運。 第42圖Α〜C所示之第3實施形態時，基材之單面全 面上會塗布寬度W之黏著劑，利用形成於基材之寬度W 方向上之縫隙3 5，寬度W方向上將黏著劑分隔成複數條 。此第3實施形態之黏著劑膠帶1時，縫隙3 5應形成於 將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓著至電 路基板21之前一瞬間。此時，亦可在黏著裝置1 5之盤裝 著部附近（如第40圖之S所示）裝設工作面而在捲出之 黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在第5 圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙者捲 取至盤者，亦可在塗工步驟時之乾燥後、以捲取機31捲 取之前一瞬間形成縫隙者。又，無論何種實施形態，工作 面亦可爲在黏著劑板1之寬度W方向往返移動者。 又，將第3實施形態之黏著劑膠帶1使用於黏著裝置 -119- 200913828 1 5時’和第丨實施形態相同，以縫隙3 5隔離之黏著劑會 逐條以加熱加壓頭從基材9側實施壓著，而從前端側依序 逐條使用。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到配設於寬度方 向之複數條黏著劑1 1，十分容易製造。 第43圖A〜C所示之第4實施形態時，係在基材9之 單面全面塗布黏著劑11 (第43圖A)，基材9及黏著劑 1 1之寬度W和上述實施形態相同，係和電路基板之一邊 長度大致相同之尺寸。其次，使用時係以和第丨實施形態 相同之方式裝著，對黏著劑膠帶1之寬度W方向之部份 黏著劑（1條份）實施加熱加壓（第4 3圖B )，降低該部 份之凝聚力，只有實施加熱加壓之部份的黏著劑會從基材 分離並壓著至電路基板21 (第43圖C)。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線’加熱加壓部份之全部黏著劑應爲呈現軟化流動（簡易 指標爲1 〇〇〇泊以下）而未開始黏著劑之硬化反應、或低 位狀態（簡易指標爲反應率20%以下），加熱溫度應對應 使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑U在使用時，會逐條使 寬度w方向上之1條份軟化流動化並壓著至基板電路。 又’如上述之實施形態在黏著劑丨1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑11即可’故黏著劑膠帶之製造十分容易。 -120- 200913828 第44圖A〜C所示之第5實施形態’係第1實施形態 之黏著劑膠帶1之其他製造方法’在塗布於基材9a上之 黏著劑1 1上形成縫隙98後（第44圖A ) ’以使黏著劑 1 1夾於基材9 a、9 b之間之方式，在黏著劑1 1上貼附另一 方之基材9b (第44圖B)。其次’剝離一方及另一方之 基材9a、9b，各基材9a、9b上會以間隔1條之方式配置 著黏著劑條1 1 a、1 1 b。此第5實施形態時’爲了在一方及 另一方之基材9a、9b上交互配置黏著劑條11a、lib’亦 可從一方之基材9 a或9 b側以間隔1條之方式實施黏著劑 條1 1 a、1 1 b之加熱加壓，而將黏著劑條1 1 a、1 1 b依序貼 附至各基材9a、9b。 申請專利範圍第3 5〜4 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第3 5〜4 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 其次，針對申請專利範圍第42〜46項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 盒、及利用黏著劑膠帶盒之黏著劑壓著方法。 其次’針對申請專利範圍第4 2〜4 6項記載之發明之 背景技術進行說明。 一般而S ’液晶面板、PDP (電漿顯示面板）、EL( -121 - 200913828 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁’因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數’ 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高’而可能 使黏著劑從膨帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第42〜46項記載之發明的目的 ，係在提供一種黏著劑膠帶盒、及利用黏著劑膠帶盒之黏 -122 - 200913828 著劑壓著方法，可在未增加黏著劑膠帶之捲數的情形下 加黏著劑量，且盤之更換更爲簡易。 其次，參照添附圖面，針對申請專利範圍第42〜 項記載之發明之實施形態進行說明，首先，參照第45 A'B、第46圖、第47圖、第4圖、第34圖、及第48 ，針對申請專利範圍第42〜46項記載之發明之第1實 形態進行說明。爲了說明上之方便，針對黏著劑膠帶配 2條黏著劑時進行說明，然而，亦可形成複數條。第4 5 A及B係申請專利範圍第42〜46項記載之發明之第1 施形態之黏著劑膠帶盒圖，第45圖A係黏著劑膠帶盒 斜視圖，第45圖B係第45圖A之A-A切剖面圖，第 圖係第45圖A及B所示之膠帶盒之盤裝設狀態的剖面 ，第47圖係黏著裝置之黏著劑壓著步驟的正面圖，第 圖係黏著劑膠帶盒之製造方法的步驟圖。 本實施形態之黏著劑膠帶盒1 00之主要構成係一方 盤3、另一方之盤17、以及收容前述盤之殼體99，一方 盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之另一端9a 固定於另一方之盤17。 殼體99之一側會形成開口 11，可從此開口 1 1拉出 著劑膠帶1。又’開口 1 1之兩側則配設著用以導引黏著 膠帶1之移動的導引件31、31。 殼體99係由半殼體99a、99b嵌合而成，配設於黏 裝置27 (後述）上之滑軸1 7 (參照第46圖）嵌插於一 及另一方之盤3、5上，而嵌合於各盤3、5。 增 46 圖 圖 施 置 圖 實 之 46 圖 48 之 之 則 黏 劑 著 方 -123- 200913828 此處’參照第46圖針對各盤3、5、及各盤3、5及殼 體99之嵌合進行說明。各盤3、5之內緣側會形成可嵌合 黏著裝置2 7之滑軸1 7的嵌合條1 9，而外圍側則會形成以 可旋轉之方式嵌合於殻體99之突部7c的嵌合溝21。 如第45圖B所示，黏著劑膠帶1之基材9之單面上 ’在寬度方向上會塗布著2條並排之黏著劑lla、lib。2 條黏著劑1 1 a、1 1 b間會有間隔。 本實施形態時，黏著劑膠帶1之長度約爲5 0m，寬度 W則約爲4mm。各條黏著劑1 1 a、1 1 b之寬度約爲1 . 2mm 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ’熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基醋 系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層等來形成。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 -124- 200913828 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小’連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是’以商分子類做爲核材更佳’焊如焊錫因沒有融點 ’在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶盒1 00之使用方 法進行說明。如第47圖所示，將黏著劑膠帶盒1 〇〇裝著 至黏著裝置27。黏著裝置27以具有間隔之方式配設著盒 用之滑軸1 7、1 7 (參照第46圖），使滑軸1 7、1 7卡合於 黏著劑膠帶盒100之各盤3、5。因此，黏著劑膠帶盒100 t裝著只需單觸即可完成，而無需實施傳統上將捲繞於盤 之黏著劑膠帶1之另一端9a裝設至空盤之作業等。 其次，從黏著劑膠帶盒1 〇〇拉出黏著劑膠帶1，穿過 黏著裝置27之導引件3 1、3 1。 其次，驅動黏著裝置2 7之滑軸1 7捲出黏著劑膠帶1 (第47圖之箭頭E方向），將黏著劑膠帶1配置於電路 基板21上，以加熱加壓頭1 9從基材9側實施黏著劑膠帶 1之壓接，寬度方向之一側上的1條份黏著劑1 1 a被壓著 至電路基板21之一邊，殘餘之1條黏著劑1 1 b及基材9 會被捲取至另一方之盤17。如此，可將黏著劑11a壓著至 電路基板2 1之四周。 其次，在捲繞於一方之盤3之黏著劑膠帶1全部捲出 -125- 200913828 後，將黏著劑膠帶盒1 00拆下並以反向裝著，重複上述之 步驟。黏著劑膠帶上形成2條以上之黏著劑時，可改變寬 度方向之位置依序或以間隔方式實施壓著。 上述壓著後（暫時連接），實施電路基板21之電極 3 3 a及配線電路（電子構件）3 7之電極3 7a的定位並進行 正式連接。正式連接上，在將黏著劑11a壓著至電路基板 2 1之四周後，在黏著劑1 1 a上配置配線電路（或電子構件 )3 7，必要時，可將例如聚四氟乙烯材3 9當做緩衝材， 以加熱加壓頭1 9對電路基板2 1實施配線電路23之加熱 加壓（參照第4圖）。利用此方式，可連接固定電路基板 21之電極33a及配線電路23之電極37a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶盒1 〇〇 實施黏著之P D P 2 6之連接部份，在本實施形態中係會黏 著於PDP 26之周圍全體，一次使用之黏著劑11的使用量 會遠大於傳統上之使用量。然而，因爲黏著劑膠帶1之寬 度W方向上配置著2條黏著劑1 1 a、1 1 b，即使爲和傳統 相同之捲數，其黏著劑量可爲傳統之2倍，故可減少盒之 更換次數。 又，黏著劑膠帶1係採用盒1之型式，故更換、處理 、及裝著都十分容易，而具有良好之作業性。 此處，參照第48圖，針對本實施形態之黏著劑膠帶 盒1 〇〇之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機28塗布由樹脂及導電性粒子30混合而成之黏著劑：[! -126- 200913828 ，並以乾燥爐29實施乾燥後’以捲取機3 1捲取原始材料 。塗布機28會在基材9上塗布多數條黏著劑。被捲取之 黏著劑膠帶之原始材料，整修步驟時’以切割機3 3切成 特定寬度（2條黏著劑條之寬度）並捲取至盤3後’以夾 於半殼體99 a、99b之間的方式嵌合盤3及空盤5，製成黏 著劑膠帶盒100。 將黏著劑膠帶盒1 〇〇和除濕材一起綑包，實施低溫 (-5°c〜-10°C )之管理並進行出貨。 其次，針對申請專利範圍第42〜46項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第4 9圖所示之第2實施形態時，係一次即將黏著劑 11壓著至電路基板21之一邊全體者，黏著裝置27上配設 著可從黏著劑膠帶盒1 〇〇拉出很長之黏著劑膠帶1的導引 件1 〇 1。此第2實施形態時，因係一次即將黏著劑壓著至 電路基板21之一邊全體，而有良好之作業效率。 第5 0圖所示之第3實施形態時，在基材9之單面全 面塗布寬度w之黏著劑1 1，並利用縫隙1 〇 2將黏著劑分 隔成2條。此第3實施形態之黏著劑膠帶1時，縫隙！ 02 應形成於將黏著劑膠帶盒1 00裝著至黏著裝置27後、將 黏著劑膠帶1壓著至電路基板2 1之前一瞬間。此時，亦 可在黏著裝置27之盒裝著部附近（如第47圖之S所示） 裝設工作面而在捲出之黏著劑膠帶1之黏著劑11上形成 -127- 200913828 縫隙1 02，亦可將第48圖所示之黏著劑膠帶之製造時之整 修步驟中形成縫隙者捲取至盤3者，亦可在塗工步驟乾燥 後，以捲取機3 1捲取之前一瞬間形成縫隙1 〇2者。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材9上之黏著劑1 1形成縫隙1 〇 2，即可得到2條黏 著劑11a、lib，十分容易製造。 第51圖A及B所示之第4實施形態時，基材9之單 面全面塗布著黏著劑1 1 (第5 1圖A )，將收容此黏著劑 膠帶1之黏著劑膠帶盒1 〇 〇以和第1實施形態相同之方式 裝著至黏著裝置27’對黏著劑膠帶1之寬度W方向之部 份黏著劑1 1 ( 1條份）實施加熱加壓，降低該部份之凝聚 力，只有加熱加壓之部份黏著劑1 1 a會從基材9剝離而壓 著至電路基板21(第51圖B)。 此時，會沿著加熱加壓頭1 9之周圍形成凝聚力降低 線1 0 3 (第5 1圖A )，實施加熱加壓部份之全部黏著劑應 爲呈現軟化流動（簡易指標爲1 〇〇〇泊以下）而未開始黏 著劑之硬化反應、或低位狀態（簡易指標爲反應率20%以 下），加熱溫度應對應使用之黏著劑系來進行選擇。 此第4實施形態時’黏著劑1 1在使用時，只有寬度 W方向之1條份25a會軟化流動化而被壓著至基板電路》 其次，針對申請專利範圍第4 7〜4 9項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板同 間之黏著固定及兩者之電極間之電性連接的黏著材膠帶， -128- 200913828 尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第47〜49項記載之發明之 背景技術進行說明。 一般而言，液晶面板' PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -2 84〇05號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 m m程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 -129 - 200913828 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第47〜49項記載之發明的目的 ，係在提供一種黏著材膠帶，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第47〜49 項記載之發明之實施形態進行說明。 參照第52圖A、B、第3圖、第4圖、第29圖、及 第5圖，針對申請專利範圍第47〜49項記載之發明之第1 實施形態進行說明。第5 2圖A及B係本實施形態之黏著 材膠帶之連接圖，第5 2圖A係黏著材盤間之連接的斜視 圖，第5 2圖B係第52圖A之連接部份的剖面圖。 黏者材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶〗之兩寬度側之側板 7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -130- 200913828 之黏著劑1 1所構成。 基材9具有支持層9b、及從兩側夾住前述支持層 之熱熔融劑層（熱金屬層）9a，構成熱熔融劑層9a之 熔融劑（熱金屬）係採用熱可塑性樹脂之聚乙烯、S B S 苯乙烯丁二烯苯乙烯嵌段共聚物）、耐綸等，支持層 則係使用OPP (延伸聚丙烯）、聚四氟乙烯、或PET ( 對苯二甲酸乙二酯）等之塑膠、玻璃纖維、芳香族聚醯 纖維、或碳纖維等之強化纖維。 黏著劑11係採用熱可塑性樹脂、熱硬化性樹脂、 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又、熱硬化性 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代 〇 黏著劑Π內亦可分散著導電粒子1 3。導電粒子1 3 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 子、或碳、石墨等，亦可在前述之物及/或非導電性之 璃、陶瓷、塑膠等高分子核材等覆蓋前述之導電層而形 者。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱 融金屬、或塑膠等之高分子核材上形成導電層者，會具 因加熱加壓或加壓而產生變形之變形性，故連接後之電 間距離會縮小，連接時可增加和電路接觸之面積，而可 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫 沒有融點’在廣泛之連接溫度下亦可控制於軟化狀態， 9b 熱 ( 9b 聚 胺 或 系 樹 表 係 \|λΧ. In 玻 成 覆 熔 有 極 提 因 而 200913828 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取盤 17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶1 之前端經由導引銷22裝設至捲取盤7，並捲出黏著材膠帶 1(第3圖中之箭頭E)。其次，將黏著材膠帶1配置於 電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加壓頭1 9 從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著 至電路基板21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑 U上配置配線電路（或電子構件）2 3，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑11會壓著至PDP 26之周圍 全體，一次使用之黏著劑1 1的使用量會明顯大於傳統上 之使用量。因此，捲繞於盤3a上之黏著材膠帶1之使用 量亦會變多，因爲捲繞於盤3a上之黏著材膠帶1會在相 對較短之時間內被捲取至捲取盤1 7，而露出捲繞於盤3 a 上之黏著材膠帶1之結束標記28(參照第52圖A)。 如第52圖A所示，在盤3a之黏著材膠帶1露出結束 標記2 8時，爲了將盤3 a更換成新黏著材盤3，連接盤3 a -132- 200913828 之黏著材膠帶（一方之黏著材膠帶）1之終端部30及捲 繞於新黏著材盤3上之黏著材膠帶（另一方之黏者材膠而 )1之始端部3 2。 此黏著材膠帶丨之連接上，如第5 2圖B所示’針對 黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部3 2 ’使始端部3 2之黏著劑1 1 面重疊於終端部3 0之基材9之熱熔融劑層9 a上’並將此 部份置於工作台1 〇 4上。其次，以黏著裝置1 5之加熱加 壓頭1 9實施重疊部份之加熱，使熱熔融劑層9a溶融後’ 利用冷卻來使熱熔融劑固化，實施終端部3 0及始端部3 2 之連接。利用此方式，可實施捲繞於已使用之盤3a上之 黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接 〇 其次，將已使用之盤3 a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。又，因爲捲取盤17係只捲取基材 9，故可捲取數個黏著材盤份，減少捲取盤1 7之更換次數 ’而有良好之作業效率。 此處’梦照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以涂布· 機27塗布由樹脂及導電粒子13混合而成之黏著劑u，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 -133- 200913828 寬度並捲取至捲軸後，從兩側將側板裝著至捲軸’將其和 除濕材一起綑包，實施低溫（-5t〜-10°C )之管理並進行 出貨。 其次，針對申請專利範圍第47〜49項記載之發明之 其他實施形態進行說明，以下說明之實施形態中’和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第5 3圖所示之第2實施形態時，黏著材膠帶1之基 材9上，熱熔融劑層9a會夾於支持層9b之間。此時’如 第3圖所示，爲了實施黏著材膠帶1間之連接，在一方之 黏著材膠帶1之終端部3 0及另一方之黏著材膠帶1之始 端部3 2互相抵接之位置上，以黏著裝置1 5之加熱加壓頭 1 9實施熱溶融劑層9a之加熱。實施加熱會使熱熔融劑從 熱熔融劑層9 a滲出，利用冷卻來使熱溶融劑固化，實施 黏著材膠帶1間之連接。如此，因熱熔融劑層9a係夾於 支持層9b之間，而可防止因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層9a之黏著強度。 申請專利範圍第47〜49項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第47〜49項 記載之發明之要旨的範圍內，可實施各種變形。 第1實施形態時，基材9係由支持層9b、及從兩側夾 住支持層9b之熱熔融劑層9a之3層所構成，然而’並不 限於此，亦可以爲4層以上。 本實施形態時，連接部份之加熱壓著係利用黏著裝置 -134- 200913828 1 5之加熱加壓頭1 9，然而，亦可採用其他加熱器來取代 加熱加壓頭1 9，對連接部份進行加熱’實施黏著材膠帶1 間之連接。 其次，針對申請專利範圍第5 0〜5 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著·固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板之半導體裝置上所使用之黏著材膠帶，尤其是 ，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5 0〜5 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法’係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶、微BGA . CSP等之黏著膜等 ’其目的則在提高半導體裝置全體之生產性及信賴性。 日本特開2 00 1 -2 84005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統之黏著材膠帶，爲了避免黏著劑固著於基材 上、或較容易剝離’會在基材之兩面實施矽處理。 -135- 200913828 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新黏著材盤裝著至黏著裝置， 並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數’ 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5 0〜5 1項記載之發明的目的 -136- 200913828 ’係提供一種黏著材膠帶之連接方法，可使黏著材盤之 換較爲簡單’而提高電子機器之生產效率。 其次’參照附錄圖面，針對申請專利範圍第5 〇〜 項記載之發明之實施形態進行說明。首先，參照第54 A〜C、第55圖、第56圖、第4圖、及第29圖，針對 請專利範圍第5 〇〜5 1項記載之發明之第1實施形態進 說明。第54圖A〜C係第55圖之連接部份之連接步驟 剖面圖，第54圖A係放電前之黏著材膠帶之狀態，第 圖B係放電後之黏著材膠帶之狀態，第5 4圖C係連接 份之加熱壓著圖。第5 5圖係黏著材膠帶連接方法之黏 材盤間之連接的斜視圖，第5 6圖係黏著裝置之黏著劑 著步驟的槪略圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側 Ί。 黏著材膠帶1係由基材9、及塗布於基材9之一側 之黏著劑1 1所構成。 從強度 '及黏著劑1 1之剝離性而言，基材9應採 OPP (延伸聚丙烯）、聚四氟乙烯、及PET (聚對苯二 酸乙二酯）等，以脫模劑9 a實施表面處理。脫膜劑係 用烯系脫模劑、乙二醇廿八碳酸酯、棕櫚蠟、石油系蠟 低融點蠟、低分子量氟樹脂、矽系或氟系之界面活性劑 油、蠟、樹脂、聚酯變性矽樹脂等，一般爲矽樹脂。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、 更 5 1 圖 串 行 的 54 部 著 壓 上 板 面 用 甲 採 等 > 或 -137- 200913828 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙嫌樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 0 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3係 如Au、Ag、Pt、Ni、Cu、w、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第5 6圖所示’將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤1 7 ’並捲出黏著材 膠帶1 (第5 6圖中之箭頭E )。其次，將黏著材膠帶1配 置於電路基板2 1上’利用配置於兩盤3、1 7間之加熱加 壓頭19從基材9側實施黏著材膠帶1之壓接’將黏著劑 -138- 200913828 1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤i 7 〇 其次’如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，將聚四氟乙 稀材24當做緩衝材，以加熱加壓頭1 9對電路基板21實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶丨之PE)P 26之連接部份所示，黏著劑丨丨會壓著至pdp 26之周圍 全體，可知一次使用之黏著劑1 1的使用量會遠大於傳統 上之使用量。因此，捲繞於盤3 a上之黏著材膠帶1之使 用量亦會增多，捲繞於盤3 a上之黏著材膠帶1在相對較 短之時間內會被捲取至捲取盤17，而露出捲繞於盤3a上 之黏著材膠帶1之結束標記2 8 (參照第5 5圖）。 如第5 5圖所示，爲了將盤3 a更換成新黏著材盤3， 會在盤3a之黏著材膠帶1上連接盤3a之黏著材膠帶（一 方之黏著材膠帶）1之終端部3 0、及捲繞於新黏著材盤3 上之黏著材膠帶（另一方之黏著材膠帶）1之始端部3 2。 此黏著材膠帶1之連接上，如第54圖B所示，將已 使用之盤3a之黏著材膠帶1之終端部30置於放電機105 之照射位置。其次，對基材9之表面實施放電，去除脫模 劑9a。In the above embodiment, the adhesive tape of the adhesive sheet 3a is made! The surface of the base material 9 of the end portion 30 and the surface of the adhesive 11 of the adhesive tape I-89-200913828 of the new adhesive sheet 3 are overlapped with each other, and a thermosetting resin made of a resin adhesive is applied. The connection 'but' can also be folded back to the end portion 30 of the adhesive tape 1 of the adhesive sheet 3 a, and the adhesive is adhered to the surface of the adhesive 1 1 and then fixed with a thermosetting resin. Next, the invention described in the claims 22 to 24 will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, in particular, relating to a disk-shaped adhesive tape disk and an adhesive device. . Next, the background art of the invention described in the claims 2 to 2 will be described. Generally speaking, the electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the substrate side of the adhesive tape which is unwound from the adhesive tape is pressed against the circuit substrate by a heating and pressing head, and the residual substrate is taken up by a take-up reel. -90- 200913828 Next, when the adhesive tape of the adhesive tape on one side is used up, remove the used tray and the take-up tray of the take-up substrate, and pack the new take-up tray and the new adhesive tape. To the bonding device, and install the beginning of the adhesive tape on the take-up reel. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, the use of adhesives has also increased due to the expansion of the use of adhesives. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes per roll to increase the number of adhesives per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 22 to 24 is to provide an adhesive tape tray and an adhesive device which can easily replace the adhesive tape and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in claim 22 to 24 will be described with reference to the drawings. First, reference is made to Figs. 22-91 - 200913828 A to C, 2, 3, 4, and Fig. 5 is a view showing a third embodiment of the invention described in the application of the patents No. 22 to 24. Figs. A to C are the adhesive tape tray diagrams of the first embodiment, Fig. 22 is a perspective view of the adhesive tape tray, and Fig. 22B is the front view of Fig. 22A. Fig. 22, Fig. C, Fig. 22 A plan view of the bonding tape of A, the figure is a sketch of the adhesive pressing step of the adhesive device. As shown in Fig. 22A, the adhesive tape tray A of the present embodiment has a plurality of roll portions (hereinafter referred to simply as a roll portion) 2, 2, and 2, 2a, 2, 2a, 3, 3a, respectively. Adhesive tape 1. Each of the 3, 3 a is provided with a reel 5 and a side plate 7 disposed on the two wide sides of the adhesive tape 1. As shown in Fig. 23, the adhesive tape 1 is composed of a substrate ί and an adhesive 1 1 applied to one side of the substrate 9. Among the plurality of rolls 2 and 2a, the end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape") 1 wound around one of the rolls 2, and the adhesive tape wound around the other roll ( Hereinafter, it is referred to as the beginning end portion 3 of the other side of the tape tape 1), and a continuous tape 41 for connecting the two is disposed. A connecting tape 6 is disposed along the inner side surface of the side plate 7 of the disc 3 from the end portion 30 of the adhesive tape 1 of the one side, and the connecting tape 6 7 is locked to the slit portion 68 of the upper portion of the side plate 7 to be connected to the other side. The beginning end portion 3 of the tape 1 is. Further, the adhesive tape 1 of one of the other and the connecting portion of the connecting tape 67 are marked with a mark 69 for identifying the connecting tape 67, and are detected by the tape detecting means (the light emitting portion 7 1 and the light receiving portion 7 2 ). When the standard is 69, 70, the part of the connecting tape 67 will be skipped, and the connecting tape 67 will be surrounded by 22 A side 23, and the sticking and bonding will stick to the 70-part-92-200913828 parts. The substrate 9 should be made of opp (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. A polymer core or the like is formed to cover the above-mentioned conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape tray A of the present embodiment will be described. As shown in FIG. 2, the adhesive tape tray A and the take-up-93-200913828 tray 17 are attached to the adhesive device 15'. The start end portion 32 of one of the adhesive tapes 1 is attached via the guide pin 22. Roll up the tray 17' and roll out the adhesive tape 1 (arrow E in Fig. 23). Next, 'the adhesive tape 1 is placed on the circuit board 2 1'. The pressure-adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3 '17. It is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuits (electronic components) 23 are positioned and officially connected. Formally connected as shown in Fig. 4, a wiring circuit (or electronic component) 2 is disposed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 2 4 can be regarded as The cushioning material is heated and pressurized by the wiring circuit 2 3 to the circuit board 21 by the pressurizing pressurizing head 19. In this manner, the electrodes of the circuit board 21 and the electrodes 23a of the wiring circuit 23 can be connected to each other. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more. The amount of the adhesive used in one use is much larger than that of the conventional one. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time. When one of the adhesive tapes 1 is completely unwound, the connecting tape 67 will be separated from the slit portion 68, and then the other adhesive tape 1 will be unwound. In the present embodiment, the connecting tape 67 for connecting both the end portion 32 of the adhesive tape 1 and the beginning end portion 32 of the other adhesive tape 1 has a connecting tape 67 for connecting -94 to 200913828. When the adhesive tape 1 is completely unwound, the adhesive tape 1 of the other side is then unwound. Therefore, it is not necessary to carry out the operation of attaching the new adhesive tape 1 to the take-up reel 17 after all of the adhesive tape 1 has been unwound, so that the production efficiency of the electronic device can be improved. Further, as shown in Fig. 23, the adhesive device 15 has a pair of light-emitting portions 71 and a light-receiving portion 72 for performing optical detection of the connecting tape 67. Black marks 69, 70 are indicated on both ends of the connecting tape 67 for connecting both the adhesive tape 1 of one side and the other adhesive tape 1 of the other. The light-emitting portion 7 1 continuously emits laser light to the adhesive tape 1, and the light-receiving portion 72 receives the reflected light and transmits the detection signal to the control device 79. The light receiving unit 72 receives the reflected light of the marks 69 and 70 connecting the both ends of the tape 67, and transmits the detection signal to the control device 79. The control means 7 for receiving the detection signal outputs a control signal to the motors for driving the two disks 3, 17 of the bonding device 15, and the motor driver starts to output a driving pulse to the motor. Next, the motor rotates in accordance with the number of pulses applied by the motor driver, causing the two disks 3, 17 to move at a faster speed than the normal speed, and moving the adhesive tape 1 in the unwinding direction by the distance corresponding to the length of the connecting tape 67. In this way, the other adhesive tape 1 is automatically unwound to the position of the heating and pressing head 19, and can be omitted so that the beginning end portion 3 2 of the other adhesive tape i is located at the position of the heating and pressing head 19. The operation of unwinding the bonding tape 67 is carried out. Further, since the take-up reel 17 only winds up the substrate 9, it is possible to take up a plurality of adhesive tape discs and reduce the number of replacements of the take-up reel 17, and has a good work efficiency of -95-200913828. Here, a method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 5. On a substrate 9 which is unwound from the unwinding machine 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, and dried in a drying oven 29, and then taken up by a coiler 3 1 Take the original material. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7 and 7 are attached to the reel from both sides, or are taken up to the reel of the side plate. In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (-5 °C to -1 〇 °C) and shipped. In the following, the other embodiments of the invention described in the second and second aspects of the patent application are described. In the embodiments described below, the same reference numerals will be given to the same parts as the above embodiments, and the details of the parts will be omitted. Note that the following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 24, since the width T of the connecting tape 67 is smaller than the width w of the adhesive tape 前后 before and after, the connecting tape 67 can be recognized. Further, the light-emitting portion and the light-receiving portion which are the same as those of the first embodiment are disposed on the adhesive device 15 at a position opposite to the adhesive tape. At this time, the coupling tape 67 is recognized by the laser light receiving the laser beam having a narrow width of the transmission connecting tape 67. In the third embodiment shown in Fig. 25, the connecting tape 67 forms a plurality of holes 5 3 for discriminating the connecting tape 67. At this time, when the fourth embodiment shown in FIG. 26 is recognized by the light receiving unit receiving the laser light transmitted through the hole 53 of the connecting tape 67, the connecting tape 67°-96 - 200913828 can be used without using the connecting tape 67. The adhesive tape 1 is connected, and when one of the adhesive tapes i is completely unwound, the other adhesive tape 1 is rolled up and attached to the disk 17 to carry out the replacement of the adhesive tape 1. At this time, since the new adhesive tape is not required to be attached to the adhesive device, less replacement of the new adhesive tape is required, so that the production efficiency of the electronic device can be improved. The invention described in the claims 22 to 24 is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first and second embodiments described above, the number of the rolls 2, 2a is not limited, and may be any number. In the first to third embodiments, the connecting tape 67 is optically detected. However, a magnetic tape may be attached to the connecting tape 67 and detected by a magnetic sensor. Next, the invention described in the claims 25 to 28 will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes between the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the method of connecting the disc-shaped adhesive tape, the adhesive device, and the adhesive tape. Next, the background art of the invention of -97-200913828 of the invention of claim 25 to 28 will be described. Generally, the electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a bare chip package, and the like, and a circuit board, or a circuit board, and the electrodes are electrically connected. The method of sexual connection 'uses adhesive tape. Moreover, the adhesive tape is also applied to the lead fixing tape of the lead frame, the L0C tape, the die-bonding tape, and the micro BGA. The adhesive film of CSP or the like is intended to improve the productivity and reliability of the entire semiconductor device. Japanese Laid-Open Patent Publication No. 2001-284-05 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the adhesive tape for the conventional electrode connection is 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive side of the adhesive tape which is unwound from the self-adhesive tape is pressed against the circuit board by a heating and pressing head, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Also, because of the expansion of the use of adhesives, the amount of adhesive used has also increased from -98 to 200913828. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per disk 'to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 25 to 28 is to provide an adhesive tape tray, an adhesive device, and a connection method 'to make the replacement of the adhesive tape tray easier' and to improve the electronic device. Production efficiency. Next, the description of the invention of the invention described in the second and fifth aspects of the patent application is described with reference to the appended drawings. First, reference is made to Figs. 27A to C', which are shown in Fig. 27, Fig. 4, Fig. 29, and Fig. 5 is a view showing a first embodiment of the invention described in the claims 25 to 28. Fig. 27 is a perspective view of the adhesive tape tray of the first embodiment, Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is a front view of Fig. 27, and Fig. 27C Fig. 27 is a cross-sectional view showing the connecting portion of Fig. A, and Fig. 28 is a schematic view showing the adhesive pressing step of the adhesive device. [29-99-200913828] The oblique view of the state of use of the adhesive of the PDP. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as rolls) 2, 2a of the adhesive tape 1, and the rolls 2, 2a have the disks 3, 3a around which the adhesive tape 1 is wound. Each of the disks 3, 3a is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. Among the plurality of roll portions 2 and 2a, the end portion of the adhesive tape (hereinafter referred to as "adhesive tape") 1 wound around one of the rolls 2 and the roll portion 2a wound around the other roll portion 2a The beginning end portion 32 of the material tape (hereinafter referred to as the other adhesive tape) is connected by the locking tool 76. The locking device 76 is, for example, a locking pin which has a substantially three-shaped cross section, so that the end portion 30 of one of the adhesive tapes 1 and the starting end portion 3 2 of the other adhesive tape 1 overlap each other, and the locking pin is inserted. This overlap is used to connect the two. Next, in the present embodiment, the connecting portion 74 is folded in the longitudinal direction of the tape by connecting the terminal portion 30 and the starting portion 3 2 with the locking member 76 as shown in FIG. The 80 degree 'make the adhesive tape 1 cover the locking device 7 6 . From the strength and the peelability of the adhesive to the different conductive materials, the substrate 9 should be made of Ο PP (stretched polypropylene), PTFE, and ruthenium treated PET (polyethylene terephthalate). Ester), etc., but 'not limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. Conductive particles 13 may also be dispersed in the adhesive U. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape tray of the present embodiment will be described. As shown in Fig. 28, the adhesive tape tray a and the take-up reel 17 are attached to the adhesive device 15, and the start end portion 32 of one of the adhesive tapes 1 is attached to the take-up reel 17 via the guide pin 22. And roll out the adhesive tape 1 (arrow E in Figure 28). Next, the adhesive tape 1 is placed on the circuit board 2 1 and the adhesive tape j 9 is placed on the substrate 9 side by the heating and pressing head j 9 disposed between the two disks 3 and 17 to bond the adhesive tape u. Pressed to the circuit substrate 2 1 . Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or an electronic component) 23 is placed on the adhesive 1113828 which is pressed onto the circuit board 21, and the polytetrafluoroethylene material 2 4 can be used as a cushioning material. The heating and pressing head 19 heats and presses the wiring circuit 23 on the circuit board 2 1 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, the adhesive portion 11 is pressed against the entire periphery of the PDP 26 by the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, so that the amount of the adhesive 11 used at one time is remarkably large. Traditionally used. Therefore, the amount of the adhesive tape 1 used is also increased, and the adhesive tape 1 wound on the discs 3, 3a is taken up to the take-up reel 17 in a relatively short period of time. In the present embodiment, when one of the adhesive tapes 1 is completely unwound, the connecting portion 74 is separated from the slit 75, and then the other adhesive tape 1 is unwound (Fig. 27B). In the present embodiment, when the end portion 30 of the adhesive tape 1 and the other end portion 32 of the other adhesive tape 1 are joined by the locking device 76, when one of the adhesive tapes 1 is completely unwound, the roll is started. The adhesive tape 1 on the other side. Therefore, it is not necessary to carry out the operation of attaching the new adhesive tape 1 to the take-up reel 17 after all of the adhesive tape 1 has been unwound, so that the production efficiency of the electronic device can be improved. Further, since the engaging portion 76 is covered with the adhesive tape 1 on the connecting portion 74, the appearance is good, and at the same time, the engaging member 76 of the connecting portion 74 can be prevented from coming into contact with the adhesive tape 1 to damage the adhesive tape 1. Further, as shown in Fig. 28, the adhesive device 15 has a thickness detecting sensor used as the connecting portion detecting sensor 47, and performs optical detection of the connecting portion 74 so that the heating and pressing head 19 skips the connecting portion. 7 4. The adhesion of one side -102- 200913828 The thickness of the connecting portion 74 of the adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape , as shown in Fig. 27C, and is detected by detecting different thicknesses. Connect the portion 74. The thickness detecting sensor 47 detects the thickness of the adhesive tape 1 at any time and transmits a detection signal to the control device 79. The control unit 79 that has received the detection signal outputs a control signal to the motors for driving the two disks 3, 17 of the bonding device 15, and starts to output a driving pulse to the motor by the motor driver. Next, the motor rotates in accordance with the number of pulses applied by the motor driver, causing the two disks 3, 17 to rotate at a faster speed than the normal speed, and moving the adhesive tape 1 in the unwinding direction to move the corresponding connecting portion 74. The specific distance of the length. In this way, the other adhesive tape 1 is moved to the position of the heating pressurizing head 19, so that the connecting portion 74 of the adhesive tape 1 of one side and the other can be prevented from moving to the position of the heating and pressing head 19 and Perform the pressing action. Further, until the connecting portion 41 heats the pressing head 19, one of the adhesive tapes 1 is automatically taken up to the take-up reel 1 7, so that the trouble of winding up can be omitted. Further, the thickness detecting sensor 47 recognizes the front end portion 4 1 a and the rear end portion 4 1 b of the connecting portion 74, and avoids only the connecting portion 74, whereby the adhesive tape 1 can be effectively utilized. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive tape discs can be taken up to reduce the number of replacements of the take-up reel 17, and the work efficiency is good. Here, a method of manufacturing the adhesive tape 1 - 103 - 200913828 of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinder 25, an adhesive mixed with a resin and conductive particles 13 is applied by a coater 27, and dried in a drying oven 29, and then taken up by a coiler 3 1 Take the original material. The raw material of the taken up adhesive tape is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7 and 7 are attached to the reel from both sides, and the dehumidified material is bundled and implemented. Low temperature (-5 T: ~-1 〇. (:) management and shipment. Secondly, for the other aspects of the invention described in the patent application scopes 25 to 28, and the above embodiment The same portions are denoted by the same reference numerals, and the detailed description of the portions will be omitted. The following description mainly differs from the above-described embodiment. In the second embodiment shown in Fig. 30, the plural volume is not used. The adhesive tapes a of the portions 2 and 2a are used, and the adhesive tape 2 C having one roll portion is used. At this time, the adhesive tape 1 is wound around the take-up reel 7, and one of the adhesive tapes 1 When the end mark 28 is exposed, in order to replace one of the adhesive tape sheets 2b with the new adhesive tape 2c, the end portion 30 of one of the adhesive tapes 1 and the other end portion 3 of the other adhesive tape 1 are joined. 2. At this time, 'also use the thickness inspection of the connection detection means The sensor 77 detects the connecting portion 74 and causes the heating and pressing head 19 to avoid the connecting portion 74. The invention described in the claims 25 to 2 is not limited to the above embodiment 'as long as Various modifications can be made without departing from the gist of the invention described in the scope of claims 25 to 28. -104- 200913828 For example, in the first and second embodiments described above, the adhesive tape 1 is connected. The card holder 76 is not limited to the locking pin, and the method can also clamp and fix the overlapping portions of the three-shaped elastically deformable clip in a cross section, or the cross section can be slightly The three-shaped metal piece sandwiches the overlapping portions of the two, and the two are sandwiched from the rain surface of the overlapping portion to connect the two. The first and second embodiments detect the connection by the thickness detecting sensor 47. The thickness of the portion 74 is used to identify the connecting portion 74. However, the present invention is not limited thereto, and the transmittance detecting sensor may be used to identify the connecting portion 74, or the surface of the connecting portion may be presented on the monitoring screen by using a CCD camera. Detecting the connection part by comparing the shades of the pixels 31A, 31B, and 32A to C are adhesive tapes for fixing a support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a wafer of a lead frame and a semiconductor element. In the example of the LOC (Lead on Chip) structure in which the semiconductor element is adhered and fixed to the fixing support substrate of the lead frame and the lead frame, a support film 78 such as a polyimide film having a surface thickness of 50#m is applied. On both sides, an adhesive tape layer 80 having a thickness of a polyaldimine-based adhesive layer or the like having an adhesive layer 80 having a thickness as shown in Fig. 31A is obtained, and the LOC structure shown in Fig. 31B can be obtained. Semiconductor device. The adhesive tape shown in Fig. 31 is punched by a punching die 87 (male die (protrusion) 9.5, female die (recess) 96) of the adhesive device shown in Figs. Cut into a slender shape, for example, in thickness 〇. On the 2mm iron-nickel alloy lead frame, pressurize at 400 °C, 3MPa, and pressure for 3 seconds -105- 200913828. 2mm interval, 〇. A lead frame having an adhesive film for a semiconductor is formed by a lead having a width of 2 mm. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied, and the semiconductor element is pressed to the adhesive layer of the lead frame with the adhesive film for semiconductors, and then the gold is pressed. Wire bonding of the lead frame and the semiconductor element is performed on the wire, and sealing is performed by using a sealing material such as an epoxy resin molding material for continuous molding, and a semiconductor device according to FIG. 31B is obtained. In Fig. 31, a and B, 81 is an adhesive film for semiconductor obtained by die-bonding tape, 8 2 type semiconductor element, 8 3 type lead frame ' 8 4 type sealing material, 8 5 type welding wire, 8 6 series confluence Rowing. Fig. 32A, B'C is an adhesive device, and in Fig. 32A and B, 87 is a punching die '8 8 series lead frame conveying portion, 6 1 is an adhesive tape punching and attaching portion, and 90 is heating The part '91 is an adhesive tape tape (adhesive tape roll-out part), 92 type adhesive tape (semiconductor adhesive film), and 93-series adhesive tape roll-out roller. Further, in Fig. 32C, the ninth-type adhesive tape (adhesive film for semiconductor), the 95-type male mold (convex portion), the 96-series male mold (concave portion), and the 97-based film press plate. The adhesive tape 9 2 is continuously rolled out from the adhesive tape tray (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport unit. The adhesive tape obtained by die cutting is taken out from the roller 9 3 by the adhesive tape. The semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape in the same manner as described above. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame are carried out in the same manner. Adhesive tape is only used with -106 - 200913828 for adhesion. When it is fixed, it may be contacted between electrodes or electrically connected by conductive particles, and the adhesive to be used may be selected for the purpose. If the support film is used, it may be composed of an adhesive alone. Next, the invention described in the ninth to third paragraphs of the patent application will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes of the two, in particular, and an adhesive tape or an adhesive tape which is wound into a disk shape. The manufacturing method and the pressing method of the adhesive tape are related. Next, the background art of the invention described in the Patent Application No. 29-34 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., use. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing line of the electronic device is wound with the adhesive -107 - 200913828. The replacement of the tape is more frequent, and the replacement of the new disk is troublesome, so that the production efficiency of the electronic device cannot be improved. In order to solve this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount of each disk to reduce the frequency of replacement of the disk. However, since the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive film wound into a tape shape rises, and may bleed out from both sides of the adhesive tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the Patent Application No. 29-34 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without adding an adhesive tape. The amount of adhesive is increased in the case of the number of rolls. Next, with reference to the attached drawings, an embodiment of the invention described in the Patent Application No. 29-34 will be described. First, reference is made to Figures 3, A, B, 3, 4, and 34. Fig. 5 and Fig. 35' are descriptions of the first embodiment of the invention described in the ninth to third aspects of the patent application. Fig. 3 3 A and B are adhesive tape drawings 'Fig. 3 3 A is a perspective view of a disk around which an adhesive tape is wound' 3rd, 3rd, B, 3rd, 3rd, AA, and Fig. 34, Fig. 34 FIG. 3 is a perspective view showing a state in which an adhesive is applied to a PDP, and FIG. 5 is a cross-sectional view showing a step of applying an adhesive on a substrate. -108-200913828 The adhesive tape 1 of the present embodiment is wound around a disk 3, and the disk 3 is wound. A reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1 are disposed on the reel. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 10 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to the substrate 9. The substrate 9 is disposed with a width of 0. 5 adhesives of 5 mm. In terms of strength and releasability of the adhesive to the electrically conductive material, the substrate 9 should be made of OPP (Extended Polypropylene), Polytetraethylene, or PET treated by Shixi (polyethylene terephthalate). Ester) or the like, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. Conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A polymer core material such as plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so the distance between electrodes after connection is -109-200913828. Reduced, the area of contact with the circuit can be increased when connected, and the reliability can be improved. In particular, it is preferable to use a polymer as a core material, such as solder having no melting point, which can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15'. The front end of the adhesive tape 1 wound around the disc 3 is attached to the empty tray 17, and the adhesive tape 1 is unwound (3rd Arrow E) in the figure. Next, the adhesive tape 1 is placed on the circuit board 21, and the pressure-adhesive tape 1 placed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and one portion is placed. The adhesive 1 1 is pressed against the circuit substrate. Thereafter, the residual adhesive 11 and the substrate 9 are taken up together to the empty tray 17. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuits (electronic components) 23 are positioned and officially connected. On the main connection, a wiring circuit (or an electronic component) 23 is placed on the adhesive 1 1 pressed against the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a cushioning material to be heated. The indenter 19 performs heating and pressurization of the wiring circuit 23 on the circuit board 2 1 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 34, the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment is adhered to the entire periphery of the PDP, and the amount of the adhesive 1 used at one time is much larger than that of the conventional use. the amount. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up in a relatively short period of time -110-200913828 to the empty tray 17, disk 3 will become empty. When the disk 3 becomes empty, the disk 3 and the cartridge 7 are respectively reversed, and at this time, the empty disk 3 is taken up, and the adhesive tape 1 is moved in the opposite direction (arrow f in Fig. 3). Thus, each of the adhesives 1 1 sequentially changes the winding direction (E, F) of the adhesive tape 1, and the adhesive 11 is pressed against the circuit substrate 21, where it is referred to FIG. 5 and FIG. The method for producing the adhesive tape 1 of the present embodiment will be described. On a substrate 9 which is unwound from the unwinding machine 25, an adhesive π obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying oven 29, followed by a coiler. 3 1 Take the original material. As shown in Fig. 35, five coaters 27' were disposed to coat five adhesives n having a width of 10 mm with respect to the width of the substrate 9 of 10 mm. The original material of the adhesive tape taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plate 7'7 is attached to the reel from both sides, or taken up to the reel of the side plate. It is packaged together with the dehumidifying material, and is managed at a low temperature (-5 °C to -1 0 °c) and shipped. In the following, the description of the other embodiments of the invention described in the claims of the ninth aspect of the invention will be described with the same reference numerals, and the detailed description of the parts will be omitted, and the following description is omitted. The difference from the above embodiment is mainly. In the second embodiment shown in Figs. 36A to AC, the adhesive of the width W is applied to one surface of the base material of the adhesive tape 1 in a wide range, and the slit 3 5 in the longitudinal direction of the substrate is formed by using -111 - 200913828. The adhesive is isolated into a plurality of strips in the width W direction. In the adhesive tape 1 of the second embodiment, the slits 35 are formed immediately after the disk 3 is attached to the adhesive device 5 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the disk mounting portion of the adhesive device i 5 (as shown by S in FIG. 3) to form a slit 35 on the adhesive 1 1 of the adhesive tape 1 that is unwound. Alternatively, the gap formed in the refurbishing step of the adhesive tape shown in FIG. 5 may be taken up to the disc, or may be dried after the coating step, before the coiler 3 1 is taken up. Instantly form a gap. When the adhesive tape 1 of the second embodiment is used in the adhesive device 15 as in the first embodiment, the adhesive which is separated by the slits 35 is pressed from the substrate 9 side by the heating and pressing head 1 by one. As shown in Figure 3, Figure A, B, and C, they are used one by one. In the second embodiment, it is only necessary to form the slits 3 5 by the adhesive on the substrate obtained by the same procedure as the conventional one, so that a plurality of adhesives 11 can be obtained, which is easy to manufacture. In the third embodiment shown in Figs. 37A to A, the substrate 9 is entirely coated with the adhesive 1 (Fig. 37A). The width W of the substrate 9 and the adhesive 11 is the same as that of the above embodiment. 5~1 0 〇0 mm. Next, in the same manner as in the first embodiment, it is attached to the adhesive device 15 and the adhesive tape 1 wound from the disk 3 is placed on the circuit board 21 in the width W direction of the adhesive tape 1. Part of the adhesive (1 part) is heated and pressurized (Fig. 7B). 'Reducing the cohesive force of the part. Only the part of the adhesive which is heated and pressurized will be peeled off from the substrate and pressed onto the circuit board 2 1 (No. -112- 200913828 3 7 Figure C). At this time, a cohesive force reduction line is formed along the side line of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (a simple index of 1 or less) without starting the adhesive. The hardening reaction or the low state (simple index is 20% or less of the reaction rate), and the heating temperature should be selected according to the adhesive system used. In the third embodiment, when the adhesive 1 1 is used, only one of the widths W is softened and fluidized and pressed against the substrate circuit. Therefore, as in the above embodiment, the adhesive tape 1 is used. The normal rotation and reversal of the disc 3 and the empty disc can be used in multiples. Further, in the above embodiment, the slits 3 5 are formed in the adhesive 1 1 and need not be divided into a plurality of strips, and it is only necessary to apply the adhesive 1 1 on one side of the wider substrate, so that the adhesive tape is used. It is very easy to manufacture. The fourth embodiment shown in Figs. 3A to 8C is another manufacturing method of the adhesive tape according to the first embodiment, after the slit 9 8 is formed on the adhesive 1 1 applied to the substrate 9a (third 8A), the other substrate 9b is attached to the adhesive 1 1 so that the adhesive 1 1 is sandwiched between the substrates 9a and 9b (Fig. 38B). Next, the base materials 9a and 9b of one of the other and the other are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals of one. In the fourth embodiment, in order to alternately dispose the adhesive strips 11a and 11b on one of the other base materials 9a and 9b, the adhesive strip 1 can be applied from one side of the base material 9a or 9b at intervals of one. 1 a and Π b are heated and pressurized, and the adhesive strips 1 1 a and 1 1 b are placed on the respective base materials 9a and 9b at intervals of one. -113-200913828 The invention described in the ninth to third aspects of the patent application is not limited to the above-described embodiments, and may be implemented within the scope of the gist of the invention described in claims 29 to 34. Various deformations. For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive U may be used. In the above embodiment, the number of the adhesives formed on the substrate 9 may be any number of at least two or more. Next, the invention described in the third to fifth paragraphs of the patent application is described. These inventions relate to an adhesive tape for fixing an electronic component, a circuit board, or a circuit board, and an electrical connection between electrodes, a method of manufacturing an adhesive tape, and a method of pressing an adhesive tape. Next, the background art of the invention described in the patent application No. 35-41 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Patent Publication No. 2 00 1 - No. 84,005 discloses a method of winding a tape of an adhesive tape coated with an adhesive on a substrate. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit substrate, the adhesive tape is pulled along one side of the circuit substrate and the adhesive is pressed, because it is around the circuit substrate, so it will be -114- 200913828 The adhesive is pressed against the periphery of the circuit substrate. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine is more frequently replaced by the disk on which the adhesive tape is wound, and since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, it is considered to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk to reduce the frequency of replacement of the disk. However, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. Therefore, the object of the invention described in claim 3 to 4 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without adding an adhesive tape. The amount of adhesive is increased in the case of the number of rolls. Next, with reference to the attached drawings, an embodiment of the invention described in the Patent Application No. 35-41 will be described. First, referring to FIG. 3A, B, 40, 34, and 5, Fig. 41 is a view showing a first embodiment of the invention described in the third to fifth aspects of the patent application. Figure 39 and Figure A are adhesive tape diagrams, and Figure 39 is a perspective view of the disk with the adhesive tape wrapped. Plan view of the tape, Figure 40 is an oblique view of the adhesive pressing step of the device -115- 200913828. The adhesive tape 1 of the present embodiment is wound around the disk 3, and is provided with a reel 5 and a side disposed on both sides of the adhesive tape 1. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width of about 1500 mm which is substantially the same as one side of the circuit board. The adhesive tape 1 is composed of a substrate 9 and an agent 11 applied to the substrate 9. The adhesive 11 is disposed in a width direction of the tape on the substrate 9 in a widthwise manner. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or treated PET (polyethylene terephthalate) from the strength and the releasability of the adhesive to the different conductive material. The composition is, however, not limited to this. The adhesive 1 1 is made of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin. The mixture of the lauric resin or the hot metal thermoplastic resin is replaced by a styrene resin or a polyester resin. The resin system is represented by an epoxy resin, an acrylic, an ethylenic resin, and an anthracene resin. The conductive particles are dispersed in the adhesive crucible. Conductive particles 1 3 Au 'Ag, Pt, Ni, Cu, W, Sb, Sn, metal particles such as solder or carbon, graphite, etc.' may also be in the above-mentioned materials and non-conductive glass, plastic and other polymer cores A material or the like is formed to cover the conductive layer. Further, it is also possible to apply an insulating coating particle covering the conductive particles with an insulating layer, conductive particles and insulating particles. When a conductive layer is formed on a polymer core material such as a hot-melt metal plastic such as solder, it may have a gap of 7 degrees W between the heating plate 3 and a gap. Table, thin base such as sub-, ceramic, or, or press-116-200913828 or deformation to deform deformation, so the distance between the electrodes after the connection will be reduced, the area of contact with the circuit can be increased when connected , can improve the reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape 1 of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15 , and the empty tray 17 is attached to the front end of the adhesive tape 1 wound on the disc 3 and the adhesive tape 1 is unwound (first) 40 arrow E). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3 and i7 is pressed against the adhesive tape 1 from the side of the substrate 9 to bond one portion. The agent 1 1 is pressed to one side of the circuit board in the width direction of the adhesive tape, and only the adhesive 11 of the strip is taken up to the empty tray 17. Next, 'the circuit board 21 is rotated by about 90 degrees so that the adjacent side of the circuit board 2 1 is located in the width direction of the adhesive tape 1, and the adhesive 11 is pressed against the other side of the circuit board 21 by the heating and pressing head 19. . Thus, by rotating the circuit substrate 21 by about 90 degrees and pressing the adhesive 11, the adhesive u can be pressed to the periphery of the circuit board 21. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. After the adhesive 11 is pressed onto the periphery of the circuit board 21, the wiring circuit (or electronic component) 2 is placed on the adhesive 1 1 , and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurization -117 - 200913828 The first and second pairs of the circuit board 21 are heated and pressurized by the wiring circuit 23 (see Fig. 4). In this manner, the electrode 2 1 a of the fixed circuit substrate 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Fig. 34, the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment is adhered to the entire periphery of the PDP, and the amount of the adhesive 1 used at one time is much larger than that of the conventional use. . However, since the width W of the adhesive tape 1 and the length 之一 of one side of the circuit substrate 21 are substantially equal, even if the width of the adhesive tape 1 is larger than the conventional one, the number of the rolls is much larger than that of the conventional one. Things, so the number of replacements is far less than the traditional things. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Figs. 5 and 41. On a substrate 9 which is unwound from the unwinder 25, an adhesive u obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying oven (9). Machine 3 1 takes up the original material. The applicator 27 will move left and right to apply a strip of adhesive on the substrate 9 at equal intervals. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or 'rolled to the reel of the side plate In the above, it is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the other embodiments of the invention described in the above paragraphs 35 to 41 of the present invention will be described with the same reference numerals and the detailed description of the parts will be omitted. It is mainly different from the above embodiment. In the second embodiment shown in Fig. 41, the adhesive device 15 is provided with two adhesive tapes 1 and the other adhesive tape i which are attached to the adhesive tape 1' so as to be perpendicular to each other. Next, the adhesive tape 1 of one side presses the adhesive 1 1 to the opposite longitudinal side N of the circuit board 2 1 (the first step), and the adhesive tape 1 of the other side presses the adhesive 1 1 to the opposite side. On the side edge (second step), the adhesive can be pressed to the periphery of the circuit board 21 in two steps. In the second embodiment, the direction of the circuit board 21 is not required to be rotated between the first step and the second step. The circuit board 21 placed in the first step can be directly moved to the second step, so that the adhesive can be realized. Automatic pressing 'in addition, can also improve work efficiency. At this time, the circuit board 21 can be placed on the conveyance belt to realize automatic conveyance. In the third embodiment shown in Figs. 42A to C, the adhesive of the width W is applied to the entire surface of the substrate, and the slit 3 5 formed in the width W direction of the substrate is used in the width W direction. The adhesive is divided into a plurality of strips. In the adhesive tape 1 of the third embodiment, the slit 35 should be formed immediately before the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the disk mounting portion of the adhesive device 15 (as shown by S in FIG. 40) to form a slit 35 on the adhesive 1 1 of the adhesive tape 1 that is unwound. Alternatively, the person who formed the gap in the refurbishing step at the time of manufacture of the adhesive tape shown in Fig. 5 may be taken up to the disk, or may be dried immediately after the coating step, and immediately before the coiler 31 is taken up. Form the gap. Further, in any embodiment, the working surface may be reciprocated in the width W direction of the adhesive sheet 1. Further, when the adhesive tape 1 of the third embodiment is used in the adhesive device-119-200913828 1 5', the adhesive is separated by the slits 35, and the adhesive is heated from the substrate one by one. The 9 side is pressed and used one by one from the front end side. In the third embodiment, it is only necessary to form the slits 35 by the adhesive on the substrate obtained by the same procedure as the conventional one, and it is possible to obtain a plurality of adhesives 1 1 disposed in the width direction, which is easy to manufacture. In the fourth embodiment shown in Figs. 43A to A, the adhesive 11 (FIG. 43A) is applied to one surface of the substrate 9, the width W of the substrate 9 and the adhesive 1 and the above embodiment. Similarly, the length of one side of the circuit board and the circuit board are substantially the same. Next, when it is used, it is attached in the same manner as in the third embodiment, and a part of the adhesive (1 part) in the width W direction of the adhesive tape 1 is heated and pressurized (Fig. 4B). Part of the cohesive force, only the adhesive which is subjected to heat and pressure is separated from the substrate and pressed to the circuit substrate 21 (Fig. 43C). At this time, the cohesive force reduction line will be formed along the side line of the heating and pressing head 19, and all the adhesives in the heated and pressurized portion should exhibit a softening flow (simple index is 1 or less) without starting the adhesive. The hardening reaction or the low state (the simple index is the reaction rate of 20% or less), and the heating temperature should be selected according to the adhesive system used. In the fourth embodiment, when the adhesive U is used, one portion in the width w direction is softened and fluidized one by one and pressed against the substrate circuit. Further, in the above embodiment, the gap 3 5 is formed in the adhesive crucible 1, and it is not necessary to divide into a plurality of strips, and it is only necessary to apply the adhesive 11 on one side of the wider substrate as a whole. Manufacturing is very easy. -120- 200913828 The fifth embodiment shown in Figs. 44A to AC is another manufacturing method of the adhesive tape 1 of the first embodiment, after the slit 98 is formed on the adhesive 1 1 applied to the substrate 9a. (Fig. 44A) "The other substrate 9b is attached to the adhesive 1 1 so that the adhesive 11 is sandwiched between the substrates 9a, 9b (Fig. 44B). Next, the base materials 9a and 9b of one and the other are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals of one. In the fifth embodiment, the pressure-sensitive adhesive strips 11a and 9b may be alternately disposed on one of the base materials 9a and 9b, and may be adhered from one side of the base material 9a or 9b. The strips 1 1 a and 1 1 b are heated and pressurized, and the strips 1 1 a and 1 1 b are sequentially attached to the respective substrates 9a and 9b. The invention described in the third to fifth aspects of the patent application is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in claims 35 to 41. . For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 1 1 may be used. Next, the invention described in the patent application section 42 to 46 will be described. These inventions relate to an adhesive tape cartridge for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and an adhesive pressing method using an adhesive tape cartridge. Next, the background art of the invention described in the 4th to 4th paragraphs of the patent application will be described. Generally, an electronic component such as an S' liquid crystal panel, a PDP (plasma display panel), an EL (-121 - 200913828 fluorescent display) panel, a bare chip package, or a circuit board, or a circuit board, or both, and both The method of electrically connecting the electrodes is to use an adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit board, the adhesive tape is pulled along one side of the circuit board and the adhesive is pressed, because the adhesive is pressed against the periphery of the circuit board. To the periphery of the circuit board. However, in recent years, as the panel size of a PDP or the like has increased, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine has a more frequent replacement of the disk with the adhesive tape. Since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure applied to the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the swell band to cause clogging. Therefore, the object of the invention described in claim 42 to 46 is to provide an adhesive tape cassette and a pressure-adhesive method using an adhesive tape cassette, without adding an adhesive tape. In the case of the number of rolls, the adhesive amount is added, and the replacement of the disk is simpler. Next, an embodiment of the invention described in the 42nd to the patent application will be described with reference to the accompanying drawings. First, reference is made to the 45th A'B, the 46th, 47th, 4th, and 34th, and 48. The first embodiment of the invention described in the patent application section 42 to 46 will be described. For the convenience of description, the adhesive tape is described with two adhesives, however, a plurality of adhesives may be formed. 4th A and B are the adhesive tape cassettes of the first embodiment of the invention described in the 42nd to 46th patents, and FIG. 45A is an oblique view of the adhesive tape cassette, and FIG. 45B is a 45th drawing. A section cutaway view of A, the figure is a section of the disc mounting state of the tape cassette shown in Figs. 45 and A, and Fig. 47 is a front view of the adhesive pressing step of the adhesive device, the figure is an adhesive A step diagram of a method of manufacturing a tape cassette. The adhesive tape cassette 100 of the present embodiment is mainly composed of a single tray 3, the other tray 17, and a casing 99 for accommodating the disk. The one disk 3 is wound with an adhesive tape 1 and an adhesive tape 1 The other end 9a is fixed to the other disk 17. An opening 11 is formed on one side of the casing 99, from which the adhesive tape 1 can be pulled. Further, guide members 31, 31 for guiding the movement of the adhesive tape 1 are disposed on both sides of the opening 1 1. The casing 99 is fitted by the half casings 99a and 99b, and the sliding shaft 17 (refer to Fig. 46) disposed on the bonding device 27 (described later) is inserted into the disks 3 and 5 on the other side. And fitted to each of the discs 3, 5.增 46 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图Be explained. On the inner edge side of each of the discs 3, 5, a fitting strip 179 for fitting the sliding shaft 17 of the adhesive device 27 is formed, and a peripheral side is formed to be rotatably fitted to the projection of the housing 99. The fitting groove 21 of 7c. As shown in Fig. 45B, on the single side of the substrate 9 of the adhesive tape 1, two side-by-side adhesives 11a, lib are applied in the width direction. There will be a gap between the two adhesives 1 1 a and 1 1 b. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm. The width of each adhesive 1 1 a, 1 1 b is about 1. 2mm 〇 In terms of strength and releasability of the adhesive to the isoelectric material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate). The diester) or the like is constituted, however, it is not limited thereto. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the 'thermosetting resin type system is represented by an epoxy resin type, an acrylic type, a vinyl vine type resin type, and an anthracene resin type. . The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the aforementioned materials and non-conductive glass, ceramics, and plastics. The polymer core or the like is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles such as -124-200913828 may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use a commercial molecule as a core material. Soldering such as solder has no melting point. It can be controlled to soften at a wide connection temperature, and it is easy to match the thickness and flatness of the electrode. The connecting member of the error. Next, a method of using the adhesive tape cassette 100 of the present embodiment will be described. As shown in Fig. 47, the adhesive tape cartridge 1 is attached to the adhesive device 27. The adhesive device 27 is provided with the slide shafts 1 7 and 17 for the cartridge (see FIG. 46) so as to be spaced apart, and the slide shafts 17 and 17 are engaged with the respective trays 3 and 5 of the adhesive tape cartridge 100. . Therefore, the adhesive tape cartridge 100 t can be completed by one-touch operation without performing the operation of conventionally attaching the other end 9a of the adhesive tape 1 wound around the disk to the empty tray. Next, the adhesive tape 1 is pulled out from the adhesive tape cartridge 1 and passed through the guides 3 1 and 31 of the adhesive device 27. Next, the sliding shaft 17 of the driving adhesive device 27 is taken up by the adhesive tape 1 (the direction of the arrow E in FIG. 47), and the adhesive tape 1 is placed on the circuit substrate 21 to heat the pressing head 19 from the substrate. The adhesive tape 1 is crimped on the 9 side, and one adhesive 1 1 a on one side in the width direction is pressed to one side of the circuit substrate 21, and the remaining adhesive 1 1 b and the substrate 9 will be It is taken up to the other party's disk 17. Thus, the adhesive 11a can be pressed to the periphery of the circuit board 2 1 . Next, after the adhesive tape 1 wound around one of the trays 3 is completely unwound -125-200913828, the adhesive tape cartridge 100 is removed and loaded in the reverse direction, and the above steps are repeated. When two or more adhesives are formed on the adhesive tape, the position in the width direction can be changed in order or in a spaced manner. After the pressing (temporary connection), the electrodes 3 3 a of the circuit board 21 and the electrodes 3 7 a of the wiring circuit (electronic component) 37 are positioned and connected. In the case of the connection, after the adhesive 11a is pressed to the periphery of the circuit board 21, a wiring circuit (or an electronic component) 3 is disposed on the adhesive 1 1 a, and if necessary, for example, a polytetrafluoroethylene material 3 can be disposed. 9 As a cushioning material, the heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21 (see Fig. 4). In this manner, the electrode 33a of the fixed circuit substrate 21 and the electrode 37a of the wiring circuit 23 can be connected. As shown in Fig. 34, the connection portion of the PDP 26 adhered by the adhesive tape cassette 1 of the present embodiment is adhered to the entire periphery of the PDP 26 in the present embodiment, and is adhered at one time. The amount of agent 11 used will be much greater than conventionally used. However, since the adhesive tape 1 is provided with two adhesives 1 1 a, 1 1 b in the width W direction, even if it is the same number as the conventional one, the adhesive dose can be twice as long as the conventional one, so that the box can be reduced. The number of replacements. Further, since the adhesive tape 1 is of the type of the cartridge 1, it is easy to replace, handle, and mount, and has good workability. Here, a method of manufacturing the adhesive tape cartridge 1 of the present embodiment will be described with reference to Fig. 48. On a substrate 23 that is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 30 is applied by a coater 28: [! -126- 200913828, and drying is performed in a drying oven 29. After 'reeling the original material with the coiler 3 1 . The coater 28 coats a plurality of adhesives on the substrate 9. The original material of the adhesive tape to be taken up is cut into a specific width (width of two adhesive strips) by the cutter 3 3 and taken up to the tray 3 after the refurbishing step to sandwich the half-shell 99 a, The adhesive tape cassette 100 is formed by fitting the disc 3 and the empty disc 5 between 99b. The adhesive tape cassette 1 is bundled with the dehumidifying material, and the low temperature (-5 ° c to -10 ° C) is managed and shipped. In the following, the other embodiments of the invention are described in the following claims, and the same reference numerals are given to the same parts as the above-described embodiments, and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 49, the adhesive 11 is pressed to one side of the circuit board 21 at a time, and the adhesive device 27 is disposed so as to be long from the adhesive tape cassette 1 The guide member 1 of the adhesive tape 1 is 〇1. In the second embodiment, the adhesive is pressed to the entire side of the circuit board 21 at a time, and the work efficiency is good. In the third embodiment shown in Fig. 50, the adhesive 11 of the width w is applied to the entire surface of the substrate 9 and the adhesive is divided into two by the slit 1 〇 2 . In the adhesive tape 1 of the third embodiment, the gap! 02 should be formed immediately after the adhesive tape cartridge 100 is attached to the adhesive device 27 and the adhesive tape 1 is pressed against the circuit substrate 2 1 . At this time, it is also possible to form a working surface near the boxed portion of the adhesive device 27 (as shown by S in Fig. 47) to form a gap on the adhesive 11 of the adhesive tape 1 which is unwound -127-200913828 02, the person who formed the gap in the refurbishing step in the manufacturing process of the adhesive tape shown in FIG. 48 may also be taken up to the tray 3, or may be wound up by the coiler 3 1 after the coating step is dried. Instantly form a gap of 1 〇2. In the third embodiment, it is only necessary to form the slits 1 〇 2 in the adhesive 1 1 on the substrate 9 obtained in the same manner as the conventional one, thereby obtaining two adhesives 11a and lib, which are very easy to manufacture. In the fourth embodiment shown in Figs. 51A and A, the adhesive material 1 1 is completely applied to one surface of the substrate 9 (Fig. 51), and the adhesive tape cassette 1 for accommodating the adhesive tape 1 is placed.装In the same manner as in the first embodiment, the adhesive device 27' is attached to the adhesive device 27' to heat and press a part of the adhesive 1 1 (one portion) in the width W direction of the adhesive tape 1 to reduce the cohesive force of the portion. Only a part of the adhesive 1 1 a which is heated and pressurized is peeled off from the substrate 9 and pressed against the circuit substrate 21 (Fig. 51B). At this time, a cohesive force reduction line 1 0 3 (Fig. 5A) is formed along the periphery of the heating and pressurizing head 19, and all the adhesives which are subjected to the heating and pressurizing portion should exhibit a softening flow (simple index is 1 〇) The anchoring of the adhesive is not started, and the hardening reaction of the adhesive or the low state (the simple index is 20% or less) is not started, and the heating temperature should be selected according to the adhesive system to be used. In the fourth embodiment, when the adhesive 1 1 is used, only one of the portions 25a in the width W direction is softened and fluidized and pressed to the substrate circuit. Next, the fourth to fourth paragraphs of the patent application are described. The invention will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, -128- 200913828, in particular, relating to a roll-shaped adhesive tape . Next, the background art of the invention described in the claims of claims 47 to 49 will be described. In general, the liquid crystal panel 'PDP (plasma display panel), EL (fluorescent display) panel, bare chip package and other electronic components and circuit boards, or the adhesion between the circuit boards, and the electricity between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The width of the conventional adhesive tape is about 1 to 3 m, and the length of the tape taken up to the disc is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the productivity of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per disk 'to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claims 47 to 49 is to provide an adhesive tape which can easily replace the adhesive disk and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in claims 47 to 49 of the patent application will be described with reference to the attached drawings. The first embodiment of the invention described in the claims of claims 47 to 49 will be described with reference to Figs. 52A, B, 3, 4, 29, and 5. Fig. 5A is a connection diagram of the adhesive tape of the present embodiment, and Fig. 5A is a perspective view showing the connection between the adhesive sheets, and Fig. 52 is a connection portion of Fig. 52A. Sectional view. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape are disposed on the respective discs 3, 3a. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9 -130-200913828. The substrate 9 has a support layer 9b and a hot melt layer (hot metal layer) 9a sandwiching the support layer from both sides, and a molten material (hot metal) constituting the hot melt layer 9a is a polyethylene using a thermoplastic resin. , SBS styrene butadiene styrene block copolymer), nylon, etc., support layer is made of OPP (stretched polypropylene), polytetrafluoroethylene, or PET (ethylene terephthalate) plastic , reinforced fiber of glass fiber, aromatic polyfluorene fiber, or carbon fiber. The adhesive 11 is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin. The thermoplastic resin is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is an epoxy resin type, an acrylic resin type, and an enamel resin type. The conductive particles 13 are dispersed. The conductive particles 1 3 such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, metal such as solder, or carbon, graphite, etc., may also be in the foregoing and/or non-conductive glass, ceramic, A polymer core material such as plastic covers the aforementioned conductive layer and is shaped. Further, an insulating film particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot-melt metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and can be highly reliable. In particular, it is better to use a polymer as a core material, such as solder without a melting point, which can be controlled in a softened state at a wide connection temperature, 9b heat (9b polyamine or phylogenetic tree system \|λΧ. In glass cladding has a strong cause and 200913828 can provide a connecting member that can easily correspond to the thickness and flatness of the electrode. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. The disc 7 is taken up and the adhesive tape 1 is unwound (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3a and 17 is pressed against the adhesive tape 1 from the side of the substrate 9, and the adhesive is applied. 1 1 is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 2 is placed on the adhesive U pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as a cushioning material to heat the pressing head 1. The pair of circuit boards 2 1 are heated and pressurized by the wiring circuit 2 3 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed against the entire periphery of the PDP 26, and the amount of the adhesive 1 used at one time is significantly larger than that of the PDP 26. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disc 3a is also increased because the adhesive tape 1 wound on the disc 3a is taken up to the take-up reel 1 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 52A). As shown in Fig. 52A, when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape of the tray 3a-132-200913828 (one side) The end portion 30 of the adhesive tape 1 and the adhesive tape (the other adhesive material) 1 wound around the new adhesive sheet 3 is the starting end portion 3 2 of the adhesive tape. The adhesive tape is connected to the end, as shown in Fig. 5B, the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a, and the beginning end portion 3 2 of the adhesive tape 1 of the new adhesive sheet 3. The surface of the adhesive 1 1 of the starting end portion 3 2 is superposed on the hot melt layer 9 a of the substrate 9 of the terminal portion 30 and placed on the table 1 〇 4 . Next, the heating and pressurizing heads 19 of the adhesive device 15 are heated by the overlapping portions to melt the hot melt layer 9a, and the hot melt is solidified by cooling, and the terminal portion 30 and the start portion 3 2 are implemented. connection. In this manner, the adhesive tape 1 wound on the used tray 3a and the adhesive tape 1 wound on the new tray 3 can be connected, and the used tray 3a and the new tray 3 can be used. The switches are replaced with each other, and the new tray 3 is attached to the bonding device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Further, since the take-up reel 17 only winds up the substrate 9, it is possible to take up a plurality of sheets of the adhesive sheet, and to reduce the number of replacements of the take-up reel 1', and to have a good work efficiency. Here, the method of manufacturing the adhesive tape 1 of the present embodiment will be described in the fifth drawing of the dream. The adhesive u mixed with the resin and the conductive particles 13 is applied onto a substrate unwound from the unwinding machine 25, and dried by a drying furnace 29, and then taken up by a coiler. 31 take the original material. The original material of the adhesive tape 1 taken up is cut into a specific -133-200913828 width by the cutter 3 3 and taken up to the reel, and the side plates are loaded from the both sides to the reel 'to be packaged together with the dehumidifying material The management of low temperature (-5t~-10°C) is carried out and shipped. In the following, the other embodiments of the invention are described in the following claims, and the same reference numerals will be given to the same parts as in the above-described embodiments, and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 5, the hot melt layer 9a is sandwiched between the support layers 9b on the base material 9 of the adhesive tape 1. At this time, as shown in Fig. 3, in order to carry out the connection between the adhesive tapes 1, the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 3 of the other adhesive tape 1 abut each other. The heating of the hot melt layer 9a is carried out by the heating and pressing head 19 of the bonding device 15. Heating is performed to bleed the hot melt from the hot melt layer 9a, and the hot melt is solidified by cooling to effect the connection between the adhesive tapes 1. In this manner, since the hot melt layer 9a is sandwiched between the support layers 9b, the adhesion strength of the hot melt layer 9a can be prevented from being lowered due to moisture absorption or adhesion of dust or the like. The invention described in the claims is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. In the first embodiment, the base material 9 is composed of a support layer 9b and three layers of the hot melt layer 9a sandwiching the support layer 9b from both sides. However, the present invention is not limited thereto, and may be four or more layers. In the present embodiment, the heating and pressing of the connecting portion is performed by the heating and pressing head of the adhesive device -134-200913828 1 5, however, other heaters may be used instead of the heating and pressing head 19. The parts are heated and the connection between the adhesive tapes 1 is carried out. Next, the invention described in the claims 50 to 5 will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Next, the background art of the invention described in the claims 50 to 5 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection 'uses adhesive tape. Also, the adhesive tape is also applied to the lead fixing tape of the lead frame, the LOC tape, the tape-bonded tape, and the micro BGA. The adhesive film or the like of CSP or the like is intended to improve the productivity and reliability of the entire semiconductor device. Japanese Patent Publication No. 2 00 1 - No. 84,005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. Such conventional adhesive tapes are treated on both sides of the substrate in order to prevent the adhesive from sticking to the substrate or to be easily peeled off. -135- 200913828 When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and installed. Roll up the disk. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive material disc is used up, the used disc and the take-up reel of the take-up substrate are removed, the new adhesive disc is loaded to the adhesive device, and the beginning of the adhesive tape is installed. On the take-up tray. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the Patent Application No. 50-51 is -136-200913828 'providing a method of joining adhesive tapes, which makes it easier to change the adhesive discs" and improves the production efficiency of electronic machines. . Next, the embodiment of the invention described in the fifth paragraph of the patent application will be described with reference to the attached drawings. First, referring to the 54th A to C, 55th, 56th, 4th, and 29th, the first embodiment of the invention described in the fifth to fifth aspect of the patent is described. Fig. 54 is a sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55, Fig. 54 is the state of the adhesive tape before discharge, and Fig. B is the state of the adhesive tape after discharge, the fifth. Figure C is a heating map of the joints. Fig. 5 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method, and Fig. 5 is a schematic view showing the steps of the adhesive of the adhesive device. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the discs 3, 3a are provided with a reel 5 and a side 配置 disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. From the strength 'and the peelability of the adhesive 1 1 , the substrate 9 should be OPP (extended polypropylene), polytetrafluoroethylene, and PET (polyethylene terephthalate), etc., with release agent 9 a Perform surface treatment. The release agent is an olefin-based release agent, ethylene glycol octacarbonate, palm wax, petroleum wax low melting point wax, low molecular weight fluororesin, lanthanide or fluorine-based surfactant oil, wax, resin, The polyester denatured resin or the like is generally an anthracene resin. Adhesive 1 1 is made of thermoplastic resin, thermosetting resin, 54 parts of the series, 54 parts of the upper plate, etc., or -137- 200913828, a mixture of thermoplastic resin and thermosetting resin. . The thermoplastic resin system is represented by a styrene-based resin and a polyester resin, and the thermosetting resin is represented by an epoxy resin, an acrylic resin, and an enamel resin. 0 Adhesive 1 1 Conductive particles 13 may also be dispersed therein. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, w, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 5', the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is loaded via the guide pin 22. Set to the take-up reel 1 7 ' and roll out the adhesive tape 1 (arrow E in Figure 5). Next, the adhesive tape 1 is placed on the circuit board 2 1 'Adhesive bonding of the adhesive tape 1 from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3 and 17 to place the adhesive-138 - 200913828 1 1 pressed to the circuit board 2 1. Thereafter, the substrate 9 is taken up to the take-up reel i 7 〇 Next, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is placed on the adhesive 1 1 pressed onto the circuit board 21, The polytetrafluoroethylene material 24 is used as a buffer material, and the heating and pressurizing head 19 is used to heat and press the wiring circuit 2 to the circuit board 21. In this manner, the electrode 2 1 a of the circuit board 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in the connection portion of the PE) P 26 of the adhesive tape of the present embodiment as shown in Fig. 29, the adhesive 丨丨 is pressed to the entire periphery of the pdp 26, and the use of the adhesive 1 1 used at one time is known. The amount will be much larger than the traditional usage. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up tray 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 5). As shown in Fig. 5, in order to replace the disc 3a with the new adhesive sheet 3, the end portion 3 of the adhesive tape 1 (adhesive tape) of the disc 3a is joined to the adhesive tape 1 of the disc 3a. 0, and the beginning end portion 3 2 of the adhesive tape (the other adhesive tape) wound on the new adhesive sheet 3 . On the connection of the adhesive tape 1, as shown in Fig. 54B, the end portion 30 of the adhesive tape 1 of the used disc 3a is placed at the irradiation position of the discharger 105. Next, discharge is performed on the surface of the substrate 9 to remove the release agent 9a.
其次，使另一方之黏著材膠帶1之始端部32之黏著 劑1 1面重疊於已去除脫模劑9 a之基材9面（第5 4圖C -139- 200913828 )。將兩者之重疊部份置於工作台’以黏著裝置15之加 熱加壓頭1 9進行加熱加壓實施黏著。利用此方式’可實 施捲繞於已使用之盤3a上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1之連接。 其次，將已使用之盤3a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，而無需使用其他 黏著材膠帶1間之連接器具，即可更換已捲繞著黏著材膠 帶1之盤3、3a。又，因爲捲取盤17只會捲取基材9，故 可捲取數個黏著材盤份，減少捲取盤17之更換次數，而 有良好之作業效率。 申請專利範圍第5 0〜5 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 0〜5 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如’上述之實施形態時，去除已結束捲取之一方之 黏著材膠帶1之基材9之脫模劑9 a，將新黏著材膠帶1之 黏著劑1 1面重疊於此部份，並以加熱加壓頭1 9實施加熱 加壓進行黏著來連接兩者，然而，亦可去除新黏著材膠帶 1之基材9之脫模劑9 &，將已結束捲取之一方之黏著材膠 帶1之黏著劑1 1面重疊於此部份來連接兩者。 去除脫模劑9a之方法’除了電漿放電以外，亦可以 爲紫外線照射或雷射照射之方法，紫外線照射時，例如將 水銀燈當做光源使用，實施一定時間之水銀燈的紫外線照 -140- 200913828 射。其次，雷射照射時，則利用以雷射振盪器照射之雷射 光來分解飛散脫模劑9a，去除脫模劑9a。 上述係針對電子構件及電路基板、以及電路基板間之 黏著固定時進行說明，然而，亦可應用於將半導體元件（ 晶片）黏著·固定至引線框架之固定用支持基板、引線框 架之晶片、半導體元件載置用支持基板之半導體裝置所使 用之黏著材膠帶。 其次，針對申請專利範圍第52〜58項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ’係關於在將半導體元件（晶片）黏著.固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板所使用之半導體裝置使用之黏著材膠帶，尤其 是，和捲成盤狀之黏著材膠帶盤相關。 其次，針對申請專利範圍第5 2〜5 8項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯不）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固定膠帶 、L 〇 C膠帶、晶粒結著膠帶等，例如，使用引線固定膠帶 之目的’係用以固定引線框架之引線銷，提高引線框架自 -141 - 200913828 體或半導體裝置全體之生產性及信賴性。 隨著電子機器之小型·輕量化發展，半導 展被稱爲微BGA (球形陣列）或CSP (晶片尺 小型封裝之開發，前述微B G A (球形陣列）或 尺寸封裝）係在半導體裝置（封裝）下部以區 置其外部端子’這些封裝之構造上，係在具有 配線構造之玻璃環氧基板或聚醯亞胺基板等半 置用支持基板上’利用黏著劑載置半導體元件 半導體元件側之端子及基板之配線板側端子則 裝晶片方式連接，連接部、及晶片上面部或端 系密封材或環氧系液狀密封材進行密封，在配 以區域陣列狀配置焊球等金屬端子。又，QFN Non-leaded Package)或 SON (Small Outline Package )等亦採用黏著材膠帶。其次，在電 板Jl ’以迴焊方式實施高密度之複數個上述封 齊安裝。其次，利用黏著劑載置引線框架之晶 元件（晶片），以絲焊連接半導體元件側之端 架端子’以環氧系密封材或環氧系液狀密封材 、及晶片上面部或端面部。此種半導體裝置之 用黏著材膠帶。 日本特開2001-284005號公報中，電極間 方法係將基材上塗布著黏著材之黏著材膠帶捲j 此種傳統黏著材膠帶之寬度爲1〜3 m m程 盤之膠帶之長度爲50m程度。 體裝置亦推 寸封裝）之 CSP (晶片 域陣列狀配 1層或多層 導體元件載 (晶片）， 以絲焊或倒 面部以環氧 線基板背面 (Quad Flat N on-leaded 子機器之基 裝之全面一 片及半導體 子及引線框 密封連接部 黏著劑亦採 之電性連接 矣盤狀者。 度，捲取至 -142 - 200913828 將黏著材膠帶裝著於黏著裝置時，將盤上捲繞著黏著 材膠帶之黏著材膠帶盤裝設至黏著裝置，拉出黏著材膠帶 之始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出 之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路 基板等，再以捲取盤捲取殘餘之基材。 其次’ 一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因，或者，盤之 直徑尺寸增大而可能因無法裝著於既存之黏著裝置上而無 法使用既存之黏著裝置。 其次，黏著材膠帶盤若使黏著材膠帶直接曝露於大氣 -143- 200913828 下，則可能因爲灰麈或濕氣而導致品質降低。 因此’申請專利範圍第5 2〜5 8項記載之發明的目的 ，係在提供一種黏著材膠帶盤，黏著材膠帶盤之更換比較 簡單，而可提高電子機器之生產效率及維持黏著材膠帶之 品質。 其次，參照附錄圖面，以電極連接用之黏著材膠帶爲 例，針對申請專利範圍第52〜58項記載之發明之實施形 態進行說明，然而，半導體元件連接用之黏著材膠帶亦相 同。首先，參照第57圖A〜C、第3圖、第4圖、第29 圖、及第5 8圖，針對申請專利範圍第5 2〜5 8項記載之發 明之第1實施形態進行說明。第5 7圖A〜C係第1實施形 態之黏著材膠帶盤圖，第5 7圖A係黏著材膠帶盤的斜視 圖，第57圖B係第57圖A之正面圖，第57圖C係第57 圖A之蓋體構件之正面圖’第58圖係黏者材膠帶之製造 方法的步驟圖。 本實施形態之黏著材膠帶盤A，具有複數之黏著材膠 帶1之捲部（以下簡稱爲捲部）2、2a，捲部2、2a具有 已捲繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著 捲軸5、及配置於黏著材膠帶1之兩寬度側之側板7、7a 、7b。如第3圖所示，黏著材膠帶1係由基材9、及塗布 於基材9之一側面之黏著劑1 1所構成。未使用之捲部2a 上，覆蓋捲繞於盤3a上之黏著材膠帶1之周圍的蓋體構 件8，以可自由裝卸之方式裝設於盤3 a上。 又，捲部2、2 a之內側之側板7 a上’配設著乾燥劑 -144- 200913828 1 〇之收容部（收容空間）1 2，收容剖1 2內收容著矽凝膠 等乾燥劑1 〇，用以從內部去除未使用之捲部2 a內之濕氣 〇 從強度、及構成向異導電材之黏著劑之剝離性而言’ 基材9應由Ο P P (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而’並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑U內亦可分散著導電粒子1 3。導電粒子1 3係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子 '或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小’連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是’以高分子類做爲核材更佳，如焊錫因沒 有融點’在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 -145- 200913828 件。 其次’針對本實施形態之黏著材膠帶之使用方法 說明。如第3圖所示，將黏著材膠帶盤a、及捲取| 裝著至黏著裝置1 5，將一方之黏著材膠帶1之始端部 導引銷22裝設至捲取盤17，並捲出黏著材膠帶1( 圖中之箭頭E)。其次，將黏著材膠帶1配置於電路 21上，利用配置於兩盤3、1 7間之加熱加壓頭1 9從 9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著至電 板21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）23，將聚四 烯材24當做緩衝材，以加熱加壓頭19對電路基板Ί 施配線電路2 3之加熱加壓。利用此方式，可連接電 板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示’黏著劑1 1會被壓著至PDP 26 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳 之使用量。因此，黏著材膠帶1之使用量亦較多，捲 盤3、3a上之黏著材膠帶1會在相對較短之時間內被 至捲取盤17。 在一方之捲部2之黏著材膠帶1上露出結束標記 將其更換成新捲部2a之黏者材膠帶1 °本實施形態時 使用之捲部2a上’配設著蓋體構件8 ’拆下此蓋體構 後，捲出黏著材膠帶1並將其裝設至捲取盤1 7 ° 進行 I 17 經由 第3 基板 基材 路基 之黏 氟乙 ,1實 路基 PDP 之周 統上 繞於 捲取 時， ，未 件8 -146- 200913828 如此，一方之捲部2全部捲出時’可將另一方之捲部 2a之黏著材膠帶1裝設至捲取盤17而實施黏著材膠帶i 之更換，故無需將新黏著材膠帶盤裝著至黏著裝置15。因 此，只需較少之新黏著材膠帶盤之更換作業，故可提高電 子機器之生產效率。 又，因爲未使用之捲部2a上配設著蓋體構件8，黏著 材膠帶1不會直接曝露於大氣下，故黏著材膠帶1不易因 灰塵或濕氣而發生黏著力降低等情形。因此，即使配設著 複數捲部2、2a時，亦可利用在未使用之捲部2a上配設 蓋體構件8來防止黏著材膠帶1之品質降低。 又’因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤1 7之更換次數，而有良好之 作業效率。 此處，參照第5 8圖，針對本實施形態之黏著材膠帶 盤A之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑，並以 乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被捲 取之黏著材膠帶之原始材料，以切割機3 3切成特定寬度 並捲取至捲軸後，從兩側將側板7 ' 7 a、7 b裝著於捲軸上 ，然後，實施蓋體構件8之裝著，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次’針對申請專利範圍第5 2〜5 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 -147- 200913828 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第59圖所示之第2實施形態時，裝設於捲部2、2a 之蓋體構件8，具有黏著材膠帶1之拉出口 106。此時， 因爲可從蓋體構件8之拉出口 106捲出黏著材膠帶1，不 拆下捲部2、2a之蓋體構件8亦可從捲部2、2a直接捲出 黏著材膠帶1。 第60圖A及B所示之第3實施形態時，捲部2、2a 、2b係不同之個體，以可自由滑動方式，裝設於黏著裝置 15本體上之軸107上。其次，一方之捲部2全部捲出時， 拆下裝設於軸107之前端的蓋帽108，從黏著裝置15取下 一方之捲部2。其次，使另一方之捲部2a移動至黏著位置 並拆下蓋體構件8後，將另一方之捲部2a之黏著材膠帶1 捲裝至捲取盤17，實施黏著材膠帶1之更換。此時，因爲 複數之捲部2、2a、2b係不同之個體，故很容易處理。 第61圖所示之第4實施形態時，和第3實施形態相 同，捲部2、2a、2b係不同之個體，使捲部2、2a、2b之 側板7、7 a互相嵌合，將其裝著至黏著裝置1 5。如第6 1 圖所示，另一方之捲部2 a之側板7 a上，配設著橫剖面略 呈3字形之被嵌合部1 1 〇，將配設於一方之捲部2之側板 7上之被嵌合部49，從上側嵌合至被嵌合部1 1 〇，可連接 兩者。將全部捲出之一方之捲部2從黏著裝置1 5拆下時 ’只要將一方之捲部2向上提起即可解除嵌合，很簡單即 可拆下一方之捲部2。 -148 - 200913828 申請專利範圍第5 2〜5 8項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 2〜5 8項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，捲部2、2a之數量並無特 別限制，可以爲任意個。 第4實施形態時，係以使側板7、7a上下滑動來嵌合 一方及另一方之捲部2、2a，然而，亦可在一方之側板7 上形成嵌合孔，而在另一方之側板7a上配設嵌合突起， 並從膠帶之寬度方向將嵌合突起壓入嵌合孔內來使兩者嵌 合。 第3 1圖A、B係用以實施引線框架之固定用支持基板 、半導體元件載置用支持基板、或引線框架之晶片和半導 體元件之連接1黏著材膠帶當中，將半導體元件黏著·固 定於引線框架之固定用支持基板及引線框架之LOC ( Lead on Chip )構造的1個實例。 實施厚度50/zm之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25/zm之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏著 材膠帶，而可得到第31圖B所示之LOC構造之半導體裝 置。將第31圖A所示之黏著材膠帶’以第32圖A〜（：所 示之黏著裝置之冲切模具87 (公模（凸部）95、母模（凹 部）96 )冲切成細長形，例如’在厚度〇.2mm之鐵-鎳合 金製引線框架上，以400乞、3 MPa之壓力、3秒鐘之加壓 實施壓著，形成〇.2mm間隔、0.2mm寬度之內引線，製成 -149- 200913828 附有半導體用黏著膜之引線框架。其次，在其他步驟實施 350 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半導體元 件壓著至此附有半導體用黏著膜之引線框架之黏著劑層面 ，其後，以金線實施引線框架及半導體元件之絲焊，以連 續成形使用環氧樹脂成形材料等密封材實施密封，得到第 31圖B所示之半導體裝置。第31圖a、B中，81係以黏 著材膠帶冲切所得之半導體用黏著膜，5 4係半導體元件， 8 3係引線框架，8 4係密封材’ 8 5係焊絲，8 6係匯流排條 。第32圖A、B、C係黏著裝置，第32圖A'B中，87 係冲切模具’ 8 8係引線框架搬運部，6 1係黏著劑膠帶冲 切貼附部’ 9 0係加熱器部’ 91係黏著材膠帶盤（黏著材 膠帶捲出部），92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第32圖C中，94係黏著材 膠帶（半導體用黏著膜），95係公模（凸部），96係母 模（凹部），97係膜壓板。黏著材膠帶92會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部8 9冲切成細長形且黏著至引線框架之引線部 份’將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪9 3搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接.黏著。黏著材膠帶只單純用 於黏著·固定時’可以電極間之接觸、或以導電性粒子實 -150- 200913828 施電性連接’而對應目的來選擇使用之黏著劑，若利用支 持膜’則有時會單純由黏著劑所構成。 其次’針對申請專利範圍第5 9項記載之發明進行說 明。 此發明係關於將電子構件及電路基板' 或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑壓著 至電路基板之黏著具。 其次’針對申請專利範圍第5 9項記載之發明之背景 技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者，將此黏著劑膠帶之 盤（以下稱爲「黏著劑盤」）裝著於自動黏著機械來使用 〇 自動黏著機械具有黏著劑盤之裝著部、空盤之裝著部 、配設於前述盤間之加熱加壓構件、以及用以載置基板之 工作台，從黏著劑盤將黏著劑膠帶拉出至基板上，利用加 熱加壓構件從基材之背面側實施黏著劑膠帶之加熱加壓， 將黏著劑壓著至基板上。 然而，傳統之自動黏著機械較爲大型，欲在部份基板 上實施黏著劑之壓著時 '壓著黏著劑之面積較小時、或暫 -151 - 200913828 時壓著時等，會因爲較爲大型，反而有不易操作之問題。 另一方面，若爲和此種大型自動黏著機械不同之小型 卻可很簡單地進行操作，故在局部或暫時壓著時，希望能 有不使用大型裝置卻可實施黏著劑之壓著的器具。 因此’申請專利範圍第5 9項記載之發明的目的，係 提供一種黏著具，十分小型且可以單手操作，並且很容易 即可對基板之一部份實施黏著劑之壓著。 其次，參照附錄圖面，針對申請專利範圍第5 9項記 載之發明之實施形態進行說明。第6 2圖A及B係申請專 利範圍第5 9項記載之發明之第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 A · A剖面圖，第6 3圖係用以說明第6 2圖A及B所示之黏 著具之使用方法的側面圖，第64圖係黏著具之製造方法 的步驟圖。 本實施形態之黏著具1 1 1之主要構成係一方之盤（供 應盤）3、另一方之盤（空盤）5、以及收容前述盤之殼體 99，一方之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之 一端9a則固定於另一方之盤5。 殻體99之形成上’係可以單手把持之尺寸，從側面 觀看時，角部具有弧度而大致呈三角形，係容易把持之形 狀。略呈三角形之殼體99之角部上，會形成開口部1 1 3， 黏著劑膠帶9會從此開口部1 1 3露出。 又，開口部1 1 3上突設著加熱構件〗1 4，從側面觀看 時，此加熱構件丨14亦略呈三角形，用以引導從上面i3a -152 - 200913828 沿著下面1 3 b拉出之黏著劑膠帶1，其下面側配設著電熱 板 1 1 5。 加熱構件1 1 4之形狀呈棒狀，在以電熱板1 1 5覆蓋加 熱構件1 1 4之情形下拉出黏著材膠帶9時，可利用加熱構 件1 1 4之旋轉而順利拉出膠帶9。又，電熱板1 1 5之外側 若配設聚四氟乙烯、矽橡膠、或雙方，則實施黏著劑9之 壓著時，可獲得均一之壓力。 殼體99係由半殼體99a、99b嵌合而成，一方及另一 方之盤3、5係收容於殼體內。殼體內配設著導引件1 6， 用以引導黏著劑膠帶1之移動。又，殻體99a或7b之其 中任一方之底面之一方上，會形成板狀之導引件，在使此 導引件抵壓至電路基板之邊緣之情形下，將黏著劑壓著至 電路基板，則可沿著電路基板實施精度良好之黏著劑壓著 〇 一方之盤3上會以同軸方式固定著一方之齒輪116, 另一方之盤17上亦以同軸方式固定著另一方之齒輪117, —方之齒輪116及另一方之齒輪117會互相齒合，當一方 之盤3旋轉而使黏著劑膠帶1被拉出時，另一方之盤17 會實施黏著劑膠帶1之拉出量的旋轉，並捲取基材9。又 ’齒輪單元118係由一方之齒輪116及另一方之齒輪117 所構成。 又，殻體9 9之側面配設著對加熱構件1 1 4供應電力 之第三穀體（電源手段）119，第三殼體119內除了收容 乾電池以外，尙會收容供應給加熱構件1 1 4之電力之調整 -153- 200913828 電路。又’第三殼體1 1 9上配設著電源開關1 2 0，可以把 持黏著具1 1 1之手的手指實施ΟΝ/OFF之操作。 如第62圖Β所示，黏著劑膠帶1上之基材9之單面 上塗布著黏著劑1 1。 本實施形態時’黏著劑膠帶]之長度約爲20m、寬度 W 約爲 1 · 2 m m。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑11係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ’熱硬化性樹脂系係以環氧樹脂系、乙烯基酯系樹脂 '壓 克力系樹脂、及砂樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小’連接時可增加和電路接觸之面積，而可提高信賴 -154- 200913828 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件° 其次，針對本實施形態之黏著具1 1 1之使用方法進行 說明。如第63圖所示，以單手握持黏著具1 1 1，將電源開 關120切至ON。其次，使露出黏著劑膠帶1之開口部 1 1 3抵壓電路基板27。因爲開口部1 1上之黏著劑膠帶1 之基材9側配設著加熱構件1 1 4，壓附位於加熱構件1 1 4 下面側之黏著劑膠帶1，對電路基板2 7實施黏著劑1 1之 加熱壓著。 在將黏著具Π 1壓向下方之狀態下朝前方（第63圖 中之箭頭E)移動，會依序拉出黏著劑膠帶1，加熱構件 1 1 4會朝E方向前進，同時，新黏著劑9會位於加熱構件 114之下’而將黏著劑11依序壓著至電路基板27。 如此’從一方之盤3拉出黏著劑膠帶丨時，因一方之 盤3會旋轉，故和一方之盤3以同軸方式固定之一方之齒 輪116亦會旋轉，和其齒合之另一方之齒輪117亦會隨之 fe轉’而將已剝離d者劑2 5之基材9捲取至另一方之盤 17 〇 利用本實施形態，欲將黏著劑1 1壓著至電路基板27 上之任意位置時，只要以單手握持黏著具ηι並向前推， 很簡單即可實施黏著劑1丨之壓著。如此，因爲很黏著劑 1 1之壓著很簡單，特別適合例如將電子構件（配線電路） 3 7暫時黏著於電路基板2 7上時、或只對電路基板2 7之一 -155- 200913828 部份實施電子構件（配線電路）3 7之壓著時。 上述之壓著後（暫時連接），實施電路基板27之電 極及電子構件（配線電路）37之電極的定位並進行正式連 接。正式連接上，對電路基板27實施黏著劑1 1之壓著後 ’在黏著劑1 1上配置電子構件（配線電路）3 7，必要時 ’可將聚四氟乙烯材3 9當做緩衝材，以加熱加壓頭1 9對 電路基板2 7實施電子構件（配線電路）3 7之加熱加壓（ 參照第4圖）。利用此方式，可連接固定電路基板27之 電極2 7 a及電子構件（配線電路）3 7之電極3 7 a。 又，因爲構成上，黏著劑膠帶1係收容於殻體99內 且直接使用，故十分容易處理而具有良好之作業性。 此處，參照第64圖，針對本實施形態之黏著具ηι 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機28塗布由樹脂及導電粒子1 3混合而成之黏著劑，並 以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著劑膠帶之原始材料，在整修步驟中以切割機3 3 切成特定寬度並捲取至盤3後，以夾於半殼體99a、99b 間之方式嵌合一方之盤3及另一方之盤（空盤）5,且組 裝收容著加熱構件1 1 4及乾電池等之第三殻體1丨9，製成 黏著具1 1 1。 將黏著具1 U和除濕材一起綑包，實施低溫（_ 5 C〜_ 10 °c )之管理並進行出貨。 其次，針對申請專利範圍第60〜64項記載之發明進 -156- 200913828 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第60〜64項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -2 8400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲〗〜3 mm程度，捲取至 盤之膠帶之長度爲5 0m程度，黏著材膠帶從盤捲出並將黏 著劑壓著至電路基板等後，即不會再度使用。 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量’用以降低盤之更換頻 率，然而，因爲黏著材膠帶之厚度較厚，很難增加每1盤 -157- 200913828 之捲數。 又’若考慮減少黏著材膠帶之厚度，則因爲使用經過 矽處理之PET (聚對苯二甲酸乙二酯）當做基材，基材之 厚度若太薄’會有容易發生基材伸展或斷裂等之問題。 因此’申請專利範圍第60〜64項記載之發明的目的 ’係在提供一種黏著材膠帶，可增加每1盤之捲數，而提 高電子機器之生產效率。 其次’參照附錄圖面，針對申請專利範圍第60〜64 項記載之發明之實施形態進行說明。參照第65圖A、B、 第3圖、第4圖、第29圖、及第5圖，針對申請專利範 圍第60〜64項記載之發明之第1實施形態進行說明。第 65圖A及B係第1實施形態之黏著材膠帶圖，第65圖A 係黏著材盤的斜視圖，第65圖B係第65圖A之A-A剖 面圖。 黏著材膠帶1係捲繞於盤3者，盤3上配設著捲軸5 、及配置於黏著材膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑Π所構成。 基材9係採用銅膜（銅箔）。基材9之厚度（第65 圖B中之S)爲10//m，基材9之25°C時之拉伸強度爲 5 0 0MPa，基材9對黏著劑11之厚度比（S/T)爲0.5，黏 著劑1 1之厚度爲20 y m。基材9之表面粗細度Rmax爲 0.2 5 // m。 又，亦製成採用芳香族聚醯胺膜（MIC TRON )當做基 -158- 200913828 材9者。製作上，基材9之厚度、拉伸強度、及基材9對 黏著劑1 1之厚度比（S/T )皆和銅膜相同。 其次，針對上述之黏著材膠帶之使用方法進行說明。 如第3圖所示，將黏著材膠帶1之盤3、及捲取盤17裝著 至黏著裝置15，捲繞於盤3上之黏著材膠帶1之前端會經 由導引銷22裝設至捲取盤17並捲出黏著材膠帶1 (第3 圖中之箭頭E)。其次，將黏著材膠帶1配置於電路基板 21上，以配置於兩盤3、1 7間之加熱加壓頭1 9從基材9 側壓接黏著材膠帶1，將黏著劑1 1壓著至電路基板21。 其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配線電路（或電子構件）2 3，將聚四氟乙烯材 24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實施配線 電路23之加熱加壓。利用此方式，可連接電路基板21之 電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP之周圍全體 ，可知一次使用之黏著劑〗1的使用量會遠大於傳統上之 使用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦 會增多，捲繞於盤3上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而使盤3成爲空的。 盤3成爲空的時，更換已使用之盤3及新盤，將新盤 裝著至黏著裝置1 5。其次，如上面所述，重複將黏著劑 11壓著至電路基板21並將基材9捲取至捲取盤17之動作 -159- 200913828 結果’採用銅膜做爲基材9者、及採用芳香族聚醯胺 膜做爲基材9者，皆和傳統黏著材膠帶1同樣容易處理， 且沒有基材9伸展或斷裂之問題。其次，相對於基材1 1 之厚度較傳統品（50/xm)爲薄之部份，黏著材膠帶之捲 數會增多’故可減少盤之更換頻率而提高生產性。 此處’參照第5圖，針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機3 3切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸5 上，將其和除濕材一起綑包，實施低溫（-5t〜-10°C )之 管理並進行出貨。 又，針對基材9之厚度爲4/zm、20//m、25#m之銅 膜及芳香族聚醯胺膜，製作黏著材膠帶1，如上面所述之 實際使用上，未發生基材9之伸展或斷裂等之問題。 又，針對基材9對黏著劑1 1之厚度比（S/T )爲0.01 、0.05、1.0之銅膜及芳香族聚醯胺膜，製作黏著材膠帶1 ，如上面所述之實際使用上，未發生基材9之伸展或斷裂 等之問題。 其次，針對申請專利範圍第65〜66項記載之發明進 行說明。 -160- 200913828 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接黏著材膠帶之 黏著材形成方法。又，係關於在將半導體元件（晶片）黏 著·固定至引線框架之固定用支持基板或引線框架之晶片 、或半導體元件載置用支持基板之半導體裝置上所使用之 黏著材膠帶之黏著材形成方法，尤其是，和捲成盤狀之黏 著材膠帶盤之黏著材形成方法相關。 其次，針對申請專利範圍第6 5〜6 6項記載之發明之 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又’黏著材膠帶亦被應用於引 線框架之引線固定膠帶、L 0 C膠帶、晶粒結著膠帶、微 BGA. CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 曰本特開2001-284005號公報’係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏者材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏者材膠帶之基材側以加熱加壓頭將黏著劑壓著至 200913828 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 '及捲取基材之捲取盤，新黏著材盤及新捲取盤仓裝著至 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，黏著材膠帶之捲數若增加，盤之黏著材膠帶捲 繞直徑之尺寸（以下稱爲「捲繞直徑」）亦會較大，可能 因無法裝著於既存之黏著裝置上而無法使用既存之黏著裝 置。 因此’申請專利範圍第65〜66項記載之發明的目的 ’係在提供一種黏著材膠帶之形成方法，可不增加黏著材 膠帶之捲繞直徑’而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第 65〜66 項記載之發明之實施形態進行說明。參照第66圖A及B 、第67圖、第68圖、第4圖、第29圖、及第5圖，針 對申請專利範圍第65〜66項記載之發明之第1實施形態 進行說明。第66圖a及B係第1實施形態之黏著材膠帶 -162- 200913828 之黏著樹形成步驟圖’第66圖A係將各黏著材膠帶重疊 成一體並將一方之基材捲取至捲取用盤之步驟的槪略圖’ 第66圖B係第66圖A之黏著劑間之重疊部份的剖面圖’ 第67圖係在被覆體上形成黏著裝置之黏著劑之步驟的槪 略圖，第6 8圖係捲繞著黏著材膠帶之盤之斜視圖，第4 圖係電路基板間之黏著的剖面圖，第29圖係PDP之黏著 劑之使用狀態的斜視圖，第5圖係黏著材膠帶之製造方法 的步驟圖。 黏著材膠帶1分別捲繞於盤3、121，各盤3、12 1上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。黏著材膠帶1係由基材9、及塗布於基材9之一側面之 黏者劑1 1所構成。 從強度、及黏著劑之剝離性而言，基材9應由Ο P P ( 延伸聚丙烯）、聚四氟乙烯、或經過矽處理之PET (聚對 苯二甲酸乙二酯）等所構成，然而，並不限於此。 黏著劑1丨係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 ^者劑11內亦可分散著導電粒子13。導電粒子13係 如 Au、Ag、pt、Ni、cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃 '陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 -163- 200913828 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第6 6圖A所示，將2個黏著材膠帶1之盤3、 121、及捲取用之盤17、18裝著至黏著裝置15，將捲繞於 一方之盤3上之黏著材膠帶1之前端經由導引銷22裝設 至一方之捲取盤17，並捲出黏著材膠帶1(第66圖A甲 箭頭E)。又，捲繞於另一方之盤121上之黏著材膠帶1 之前端亦裝設至另一方之捲取盤18，並捲出黏著材膠帶1 〇 從盤3、121捲出之黏著材膠帶1，會利用配置於盤3 ' 1 2 1及加熱加壓頭1 9之間之壓著滾輪1 2 2，使各黏著材 膠帶1重疊成一體。其次，將另一方之黏著材膠帶1之基 材9捲取至捲取盤1 8。 其次，將一方之黏著材膠帶1配置於電路基板21上 ，以加熱加壓頭1 9從基材9側實施黏著材膠帶1之壓接 ，將黏著劑Π壓著至被覆體之電路基板21。其後，將基 -164- 200913828 材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）2 3，將聚四 烯材24當做緩衝材，以加熱加壓頭1 9對電路基板： 施配線電路2 3之加熱加壓。利用此方式，可連接電 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑11會被壓著至PDP 26 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳 之使用量。因此，捲繞於盤3、121之黏著材膠帶1 用量亦會增多，捲繞於盤3、12 1之黏著材膠帶1會 對較短之時間內被捲取至捲取盤1 7、1 8。 此實施形態時，將黏著劑1 1壓著至電路基板2 1 一步驟中，會使一方之黏著材膠帶1之黏著劑11、及 方之黏著材膠帶1之黏著劑1 1重疊，得到期望之黏 1 1之厚度後，再將黏著劑1 1壓著至電路基板2 1，故 著材膠帶1之厚度只要一半即可。因此，可增加每1 黏著材膠帶1之捲數，而可大幅增加1次更換作業之 用的黏著劑量。因此，只需較少之新黏著材膠帶1之 作業，故可提高電子機器之生產效率。 此處，參照第5圖，針對本實施形態之黏著材膠 製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以 爲通常之大約一半的方式利用塗布機2 7塗布由樹脂 之黏 氟乙 實 路基 PDP 之周 統上 之使 在相 之前 另一 著劑 各黏 盤之 可使 更換 帶之 厚度 及導 -165- 200913828 電粒子13混合而成之黏著劑ii，並以乾燥爐29實施乾燥 後’以捲取機31捲取原始材料。被捲取之黏著材膠帶1 之原始材料’以切割機3 3切成特定寬度並捲取至捲軸5 後，從兩側將側板7、7裝著於捲軸5上，將其和除濕材 一起綑包’實施低溫（-5 °C〜-1 〇 t：)之管理並進行出貨。 又’黏著材膠帶1亦可以爲黏著劑11中含有後述之硬化 劑者。 其次’針對申請專利範圍第6 5〜6 6項記載之發明之 其他實施形態進行說明’以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第69圖A所示之第2實施形態時，亦可製作黏著劑 11a含有硬化劑及導電粒子13之黏著材膠帶la、及不含 有硬化劑及導電粒子1 3之黏著材膠帶1 b，如第6 9圖A 所示，使含有硬化劑等之黏著材膠帶1 a、及不含有硬化劑 等之黏著材膠帶lb重疊成一體，再將重疊之物壓著至電 路基板2 1。此時，因爲只有一方之黏著材膠帶1 a之黏著 劑11a含有硬化劑，另一方之黏著材膠帶lb之黏著劑Ub 即無需含有硬化劑。因此，未含有硬化劑之黏著劑1 1 b之 黏著材膠帶1 b無需實施低溫管理。 因此，可減少需要低溫管理之黏著材膠帶1 a之數， 黏著材膠帶之運送及保管可實現較有效率之管理。 又，黏著劑爲環氧樹脂系時，環氧樹脂之硬化劑應爲 咪唑系、胺醯亞胺、銨鹽、聚胺類、及聚硫醇等。 -166 - 200913828 又，如第69圖B所示，含有硬化劑之一方之黏著材 膠帶la之黏著劑11a含有導電粒子13而爲2層構成，因 被壓著側未含有導電粒子，樹脂會流動，不會從導電粒子 相對峙之電路間流出，加熱加壓時可確實使導電粒子13 保持留在電極21a及電極23a之間。 申請專利範圍第65〜66項記載之發明並未受限於上 述之實施形態，申請專利範圍第65〜66項記載之發明之 要旨的範圍內，可實施各種變形。 第I實施形態時，黏著劑1 1係含有導電粒子1 3，然 而，亦可以爲未含有導電粒子1 3之黏著劑1 1。 上面所述係針對電子構件及電路基板、以及電路基板 間之黏著固定時進行說明，然而，亦可應用於將半導體元 件（晶片）黏著·固定於引線框架之固定用支持基板、引 線框架之晶片、或半導體元件載置用支持基板之半導體裝 置上。 其次，針對申請專利範圍第67〜72項記載之發明進 行說明。 這些發明係關於例如液晶面板、PDP面板、EL面板 、裸晶片封裝等之電子構件及電路板、或電路板間之黏著 固定、以及以提供用以實施兩者之電極間之電性連接之向 異導電材爲目的之向異導電材膠帶，尤其是，和向異導電 材之捲取形態相關。 其次’針對申請專利範圍第6 7〜7 2項記載之發明之 背景技術進行說明。 -167- 200913828 利用向異導電材膠帶之電子構件及電路板、或電路板 間之連接方法，係利用相對峙之電極間夾著膜狀黏著劑之 向異導電材，以加熱加壓實施電子構件及電路板、或電路 板間之連接。膜狀之黏著劑中，混合著以實現電極間之導 通爲目的之導電粒子，採用之樹脂爲熱可塑性樹脂、熱硬 化性樹脂、熱可塑性樹脂及熱硬化性樹脂之混合物、以及 光硬化性樹脂（例如，參照日本特開昭5 5- 1 04007號公報 )。 又，採用不含導電粒子而只由樹脂所構成之向異導電 材的電路連接方法亦爲大家所熟知（例如，參照日本特開 昭60-262430號公報）。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 表，又，熱硬化性樹脂系則以環氧樹脂系、矽樹脂系、及 壓克力樹脂系爲代表。熱可塑性樹脂系及熱硬化性樹脂系 之連接上，皆需要實施加熱加壓。其目的係爲了使熱可塑 性樹脂系之樹脂流動並得到和被覆體間之密著力、以及爲 了使熱硬化性樹脂系能獲得進一步之樹脂之硬化反應。近 年來，以連接信賴性之角度而言，係以熱可塑性樹脂及熱 硬化性樹脂之混合物、及熱硬化性樹脂系爲主流。又，可 以低溫度實施連接之光硬化樹脂系亦開始被應用於工業上 〇Next, the surface of the adhesive 1 1 of the other end portion 32 of the adhesive tape 1 is superposed on the surface of the substrate 9 from which the release agent 9 a has been removed (Fig. 5 - C - 139 - 200913828). The overlapping portion of the two is placed on the table, and the bonding is performed by heating and pressing the heating head 19 of the bonding device 15. By this means, the bonding of the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be realized. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. In this embodiment, the discs 3, 3a around which the adhesive tape 1 has been wound can be replaced by using the heating and pressing head 19 without using a connecting device between the other adhesive tapes 1. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive disc portions can be taken up, and the number of replacement of the take-up reel 17 can be reduced, and the work efficiency is good. The invention described in the claims 5th to 5th is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in the claims 50 to 51. . For example, in the above embodiment, the release agent 9 a of the substrate 9 of the adhesive tape 1 which has been wound up is removed, and the surface of the adhesive 1 1 of the new adhesive tape 1 is overlapped. The heating and pressing head 19 is heated and pressurized to bond the two, however, the release agent 9 & of the substrate 9 of the new adhesive tape 1 can be removed, and the adhesive material of one of the winding ends can be finished. The adhesive 1 1 of the tape 1 overlaps this portion to connect the two. The method of removing the release agent 9a can be a method of ultraviolet irradiation or laser irradiation in addition to the plasma discharge. For example, when the ultraviolet light is irradiated, for example, a mercury lamp is used as a light source, and the ultraviolet light of the mercury lamp is irradiated for a certain period of time - 140-200913828 . Next, in the case of laser irradiation, the scattering release agent 9a is decomposed by the laser light irradiated with the laser oscillator to remove the release agent 9a. The above description is for the case where the electronic component, the circuit board, and the circuit board are fixed to each other. However, the present invention can also be applied to a fixing support substrate for bonding and fixing a semiconductor element (wafer) to a lead frame, a wafer of a lead frame, and a semiconductor. An adhesive tape used in a semiconductor device in which a component is mounted on a support substrate. Next, the invention described in the patent application section 52 to 58 will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. Also, it is about sticking semiconductor components (wafers). The adhesive tape used for fixing the support substrate or the lead frame of the lead frame or the semiconductor device used for the support substrate for mounting the semiconductor element is, in particular, associated with a disk-shaped adhesive tape roll. Next, the background art of the invention described in the patent application Nos. 5-2 to 5 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display panel), or a bare chip package, and a circuit board, or an adhesion between the circuit boards, and electrodes between the two are used. The electrical connection method uses adhesive tape. Also, 'adhesive tape is also applied to lead frame fixing tape, L 〇C tape, die-bonding tape, etc. For example, the purpose of using lead fixing tape is to fix the lead pin of the lead frame, and to improve the lead frame. From -141 to 200913828 The productivity and reliability of the entire body or semiconductor device. With the development of small size and light weight of electronic equipment, semi-guided exhibition is called micro BGA (spherical array) or CSP (development of wafer scale small package, the aforementioned micro BGA (spherical array) or size package) is attached to a semiconductor device (package) The lower portion is provided with the external terminal 'the package structure. The semiconductor device is mounted on the semi-support substrate such as a glass epoxy substrate or a polyimide substrate having a wiring structure. The terminal and the wiring board side terminal of the substrate are connected by a wafer, and the connection portion, the wafer upper surface portion or the end seal material or the epoxy liquid sealing material are sealed, and metal terminals such as solder balls are arranged in an array of regions. Also, QFN Non-leaded Package) or SON (Small Outline Package) also use adhesive tape. Next, a plurality of the above-described sealed mountings of high density are carried out by reflowing on the board J1'. Next, the crystal element (wafer) of the lead frame is placed by an adhesive, and the end frame terminal of the semiconductor element side is wire-bonded with an epoxy-based sealing material or an epoxy-based liquid sealing material, and a face or end face on the wafer. . Adhesive tape for such a semiconductor device. In Japanese Laid-Open Patent Publication No. 2001-284005, the method of inter-electrode is to apply an adhesive tape to a substrate. The width of the tape of the conventional adhesive tape is 1 to 3 mm. The length of the tape is 50 m. . The body device also pushes the CSP of the package (the wafer domain array is equipped with one or more layers of conductor elements (wafer), and is wire-bonded or inverted to the back of the epoxy-line substrate (the base of the Quad Flat N on-leaded sub-machine) The entire piece and the semiconductor and lead frame sealing joint adhesive are also electrically connected to the disk. Degree, reel to -142 - 200913828 When the adhesive tape is attached to the adhesive device, the disk is wound The adhesive tape of the adhesive tape is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Secondly, the substrate side of the adhesive tape which is rolled out from the self-adhesive tape is The heating and pressing head presses the adhesive onto the circuit board, etc., and then reeles the residual substrate by the winding reel. Next, when the adhesive tape of the adhesive tape of one of the adhesive tapes is used up, the used disc is removed, and Winding the take-up reel of the substrate, loading the new reel and the new adhesive tape onto the adhesive device, and mounting the beginning of the adhesive tape on the take-up reel. However, in recent years, along with the PDP, etc. Large-scale panel image, circuit base The adhesive area is also increased, and the amount of the adhesive used at one time is also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is replaced. It is more frequent, because the replacement of the adhesive tape is very troublesome, so there is a problem that the production efficiency of the electronic machine cannot be improved. For this problem, it can be considered to increase the number of the tape of the adhesive tape taken up to the disk to increase the number of the adhesive tape. The adhesive dose of the disc is used to reduce the frequency of replacement of the disc. However, since the tape width of the adhesive tape is 1 to 3 mm narrower, if the number of rolls is increased, the winding may be scattered. Moreover, if the number of rolls is increased, the effect is increased. The pressure of the adhesive tape which is rolled into a tape shape may increase, which may cause the adhesive to leak out from both sides of the tape to cause blockage, or the diameter of the disk may increase due to the inability to be attached to the existing adhesive device. It is impossible to use the existing adhesive device. Secondly, if the adhesive tape is directly exposed to the atmosphere -143- 200913828, it may be because麈 or moisture causes a decrease in quality. Therefore, the purpose of the invention described in the patent application No. 5 2 to 5 is to provide an adhesive tape tray, and the replacement of the adhesive tape is relatively simple, and the electronic machine can be improved. The production efficiency and the quality of the adhesive tape are maintained. Next, the embodiment of the invention described in the patent application No. 52-58 will be described by taking the adhesive tape for electrode connection as an example, but the semiconductor is described. The adhesive tape for connecting the components is also the same. First, referring to Figs. 57A to C, Fig. 3, Fig. 4, Fig. 29, and Fig. 5, the description of the scope of the patent application is 5-2 to 5 The first embodiment of the invention will be described. Fig. 7A to Fig. 7C are diagrams showing the adhesive tape of the first embodiment, and Fig. 7A is a perspective view of the adhesive tape tray, and Fig. 57B is the 57th. Fig. A is a front view, Fig. 57C is a front view of the cover member of Fig. 57A, and Fig. 58 is a step view showing a method of manufacturing the adhesive tape. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter simply referred to as rolls) 2, 2a of the adhesive tape 1, and the roll portions 2, 2a have the disks 3, 3a around which the adhesive tape 1 has been wound. . Each of the disks 3, 3a is provided with a reel 5 and side plates 7, 7a, 7b disposed on both width sides of the adhesive tape 1. As shown in Fig. 3, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. On the unused roll portion 2a, the cover member 8 covering the periphery of the adhesive tape 1 wound around the disk 3a is detachably attached to the disk 3a. Further, the side plate 7a on the inner side of the roll portions 2, 2a is provided with a desiccant-144-200913828 1 收容 accommodating portion (accommodating space) 1 2, and a desiccant such as a gel is contained in the storage section 1 2 . 1 〇, used to remove moisture from the inside of the unused roll 2 a from the strength, and the peeling property of the adhesive to the different conductive material. 'Substrate 9 should be made of Ο PP (stretched polypropylene) , PTFE, or ruthenium treated PET (polyethylene terephthalate), etc., but 'not limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthraquinone resin type. The conductive particles 13 may be dispersed. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, it is also possible to apply an insulating film particle ' of the above-mentioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use a polymer as a core material, such as solder because there is no melting point, and it can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The connection structure -145- 200913828 pieces. Next, the method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the adhesive tape tray a and the take-up | are attached to the adhesive device 15, and the leading end guide pin 22 of one of the adhesive tapes 1 is attached to the take-up reel 17, and is wound. Adhesive tape 1 (arrow E in the figure). Next, the adhesive tape 1 is placed on the circuit 21, and the adhesive tape 1 is pressed from the side 9 by the heating and pressing heads 19 disposed between the two disks 3 and 17 to press the adhesive 1 1 to Electric board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polytetraene material 24 is used as a buffer material to heat the pressing head 19 to the circuit. The substrate is subjected to heating and pressurization of the wiring circuit 23. In this manner, the electrode 2 1 a of the board 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Fig. 29, the adhesive portion 1 of the adhesive tape 1 of the present embodiment is shown to be pressed to the entire PDP 26, and the amount of the adhesive 1 used at one time is much larger than that of the PDP 26 used. The amount of usage passed. Therefore, the adhesive tape 1 is used in a large amount, and the adhesive tape 1 on the reels 3, 3a is taken to the take-up reel 17 in a relatively short period of time. The adhesive tape 1 is formed on the adhesive tape 1 of the one roll portion 2, and the adhesive tape is replaced with the new roll portion 2a. 1° The cover portion 2a used in the present embodiment is provided with the cover member 8' After the cover structure is completed, the adhesive tape 1 is rolled out and mounted to the take-up reel 1 7 ° for I 17 through the third substrate substrate, and the solid substrate PDP is wound around the periphery. At the time of winding, the unattached 8-146-200913828 is such that when one of the rolled portions 2 is completely unwound, the adhesive tape 1 of the other rolled portion 2a can be attached to the take-up reel 17 to carry out the adhesive tape i Since it is replaced, it is not necessary to mount the new adhesive tape to the adhesive device 15. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved. Further, since the cover member 8 is disposed on the unused roll portion 2a, the adhesive tape 1 is not directly exposed to the atmosphere, so that the adhesive tape 1 is less likely to be lowered by adhesion of dust or moisture. Therefore, even when the plurality of winding portions 2, 2a are disposed, the lid member 8 can be disposed on the unused roll portion 2a to prevent the quality of the adhesive tape 1 from being lowered. Further, since the take-up reel 17 only winds up the substrate 9, it is possible to take up a plurality of adhesive tape discs and reduce the number of replacements of the take-up reel 17 with good work efficiency. Here, a method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 58. On the substrate which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying oven, followed by a coiler. 3 1 Take the original material. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7' 7 a, 7 b are attached to the reel from both sides, and then the cover is applied. The member 8 is attached, and is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the other embodiments of the invention described in the fifth and second aspects of the patent application are described, and the same portions as the above-described embodiments are denoted by the same reference numerals and the same reference numerals will be given, and the detailed description of the parts will be omitted. The description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 59, the lid member 8 attached to the rolls 2, 2a has the pull-out port 106 of the adhesive tape 1. At this time, since the adhesive tape 1 can be unwound from the take-out opening 106 of the lid member 8, the cover member 8 can be directly unwound from the rolls 2, 2a without removing the cover member 8 of the rolls 2, 2a. In the third embodiment shown in Figs. 60A and B, the individual portions of the roll portions 2, 2a, and 2b are slidably attached to the shaft 107 of the body of the adhesive device 15. Next, when all the winding portions 2 are unwound, the cap 108 attached to the front end of the shaft 107 is removed, and one of the winding portions 2 is removed from the adhesive device 15. Next, after the other roll portion 2a is moved to the adhesive position and the lid member 8 is removed, the adhesive tape 1 of the other roll portion 2a is wound up to the take-up reel 17, and the adhesive tape 1 is replaced. At this time, since the plural rolls 2, 2a, and 2b are different individuals, they are easy to handle. In the fourth embodiment shown in Fig. 61, the roll portions 2, 2a, and 2b are different from each other in the same manner as in the third embodiment, and the side plates 7, 7a of the roll portions 2, 2a, and 2b are fitted to each other. It is attached to the adhesive device 15 . As shown in Fig. 61, the side plate 7a of the other roll portion 2a is provided with a fitting portion 1 1 略 having a substantially three-dimensional cross section, and is disposed on the side plate of the one roll portion 2 The fitted portion 49 on the upper side is fitted to the fitted portion 1 1 from the upper side, and both of them can be connected. When all of the rolled portion 2 is taken out from the adhesive device 15, the one of the rolled portions 2 can be removed by simply lifting one of the rolled portions 2 upwards. -148 - 200913828 The invention described in the claims 5th to 5th is not limited to the above-described embodiments, as long as it does not deviate from the gist of the invention described in the fifth to fifth aspects of the patent application, Various modifications can be implemented. For example, in the above embodiment, the number of the rolls 2, 2a is not particularly limited, and may be any number. In the fourth embodiment, the side plates 7 and 7a are slid up and down to fit one and the other of the roll portions 2 and 2a. However, the one side plate 7 may be formed with a fitting hole, and the other side plate may be formed. A fitting projection is disposed on the 7a, and the fitting projection is press-fitted into the fitting hole from the width direction of the tape to fit the both. FIG. 3A and FIG. 3B are diagrams for attaching and fixing a semiconductor element to a fixing support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a connection between a wafer of a lead frame and a semiconductor element; One example of the LOC (Lead on Chip) structure of the support substrate and the lead frame for fixing the lead frame. An adhesive layer 80 having a polyacetal-based adhesive layer having a thickness of 25/zm on both sides of the support film 78 such as a polyimide film having a thickness of 50/zm is used as shown in FIG. The adhesive tape of the configuration of A, the semiconductor device of the LOC structure shown in Fig. 31B can be obtained. The adhesive tape 'shown in Fig. 31A' is punched into a slender die by a punching die 87 (male die (protrusion) 95, mother die (recess) 96) of the adhesive device shown in Fig. 32A to Fig. 32. Shape, for example 'in thickness 〇. The 2mm iron-nickel alloy lead frame is pressed at a pressure of 400 乞, 3 MPa, and pressed for 3 seconds to form a crucible. 2mm interval, 0. Lead within 2mm width, made of -149- 200913828 with a lead frame for adhesive film for semiconductors. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the adhesive film for semiconductor, and then the gold wire is applied. The wire bonding of the lead frame and the semiconductor element is performed by sealing with a sealing material such as an epoxy resin molding material in a continuous molding to obtain a semiconductor device shown in Fig. 31B. In Fig. 31, a and B, 81 is an adhesive film for semiconductor obtained by die-bonding tape, a semiconductor element of 5 4 type, a lead frame of 8 3 type, a sealing material of 8 4 type, a wire of 8 5 series, and a convergence of 8 6 systems. Rowing. Fig. 32A, B, and C are adhesion devices, and Fig. 32A'B, 87 is a punching die '8 8 series lead frame conveying portion, and 6 1 is an adhesive tape punching and attaching portion '90 heating The part '91 is an adhesive tape tape (adhesive tape roll-out part), 92 type adhesive tape (semiconductor adhesive film), and 93-series adhesive tape roll-out roller. Further, in Fig. 32C, a 94-type adhesive tape (adhesive film for semiconductor), a 95-type male mold (protrusion), a 96-series male mold (concave portion), and a 97-series film press plate. The adhesive tape 92 is continuously unwound from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport unit. The adhesive tape obtained by die cutting is taken out from the roller 9 3 by the adhesive tape. The semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape in the same manner as described above. Moreover, the connection of the wafer and the semiconductor component of the lead frame is carried out in the same manner. Adhesive. Adhesive tape is only used for adhesion and adhesion. It can be contacted between electrodes or electrically connected with conductive particles. The adhesive is selected for the purpose. If the support film is used, It will consist of adhesive alone. Next, the invention described in Section 59 of the patent application is described. This invention relates to an adhesive in which an adhesive between an electronic component and a circuit board ' or a circuit board is fixed and an electrode electrically connected between the electrodes is pressed to a circuit board. Next, the background art of the invention described in claim 59 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses that a tape of an adhesive tape coated with an adhesive on a substrate is taken up, and a disk of the adhesive tape (hereinafter referred to as an "adhesive disk") is attached. In the automatic bonding machine, the automatic bonding machine has an adhesive portion, an empty disk mounting portion, a heating and pressing member disposed between the disks, and a table for placing the substrate, and is adhered to The agent disk pulls the adhesive tape onto the substrate, and heats and presses the adhesive tape from the back side of the substrate by a heating and pressing member to press the adhesive onto the substrate. However, the conventional automatic bonding machine is relatively large, and when the adhesive is pressed on a part of the substrate, when the area of the adhesive is small, or when the pressure is pressed at -151 - 200913828, For large, it is not easy to operate. On the other hand, if it is small in size and can be easily operated in comparison with such a large automatic adhesive machine, it is desirable to have a device that can be pressed without using a large device when partially or temporarily pressed. . Therefore, the object of the invention described in claim 59 is to provide an adhesive which is extremely small and can be handled by one hand, and it is easy to apply an adhesive to a part of the substrate. Next, an embodiment of the invention described in the ninth application of the patent application will be described with reference to the attached drawings. Fig. 6 is a perspective view of the first embodiment of the invention according to the fifth aspect of the invention, wherein Fig. 62A is a perspective view of the adhesive, and Fig. 62B is a view of Fig. 62A. A sectional view, Fig. 63 is a side view for explaining the use method of the adhesive shown in Fig. 62 and Fig. 64, and Fig. 64 is a step view showing the manufacturing method of the adhesive. The main structure of the adhesive 1 1 1 of the present embodiment is a disk (supply disk) 3, another disk (empty disk) 5, and a casing 99 for accommodating the disk, and the disk 3 is wound on one side. The adhesive tape 1, one end 9a of the adhesive tape 1 is fixed to the other disk 5. The upper portion of the casing 99 can be gripped by one hand, and when viewed from the side, the corner portion has a curvature and is substantially triangular, and is easily gripped. An opening portion 1 1 3 is formed at a corner portion of the slightly triangular casing 99, and the adhesive tape 9 is exposed from the opening portion 113. Further, the heating member 141 is protruded from the opening portion 1 1 3 , and the heating member 丨 14 is also slightly triangular when viewed from the side for guiding the pulling out from the upper surface i 3a - 152 - 200913828 along the lower side 1 3 b The adhesive tape 1 is provided with a hot plate 1 15 on the lower side thereof. The shape of the heating member 1 1 4 is rod-shaped, and when the adhesive member tape 9 is pulled down by covering the heating member 1 14 with the hot plate 115, the tape 9 can be smoothly pulled out by the rotation of the heating member 1 14 . Further, when the outer side of the hot plate 1 1 5 is provided with polytetrafluoroethylene, ruthenium rubber, or both, when the adhesive 9 is pressed, a uniform pressure can be obtained. The casing 99 is fitted by the half casings 99a and 99b, and the one and the other disks 3 and 5 are housed in the casing. A guide member 16 is disposed in the housing for guiding the movement of the adhesive tape 1. Further, on one of the bottom surfaces of either one of the casings 99a or 7b, a plate-shaped guide member is formed, and the adhesive is pressed to the circuit in the case where the guide member is pressed against the edge of the circuit substrate. In the substrate, one of the gears 116 can be coaxially fixed to the disk 3 which is adhered to the circuit board with a high-precision adhesive. The other disk 17 is also coaxially fixed to the other gear. 117, the square gear 116 and the other gear 117 are meshed with each other, and when one of the disks 3 rotates to cause the adhesive tape 1 to be pulled out, the other disk 17 performs the amount of the adhesive tape 1 pulled out. Rotate and wind up the substrate 9. Further, the gear unit 118 is composed of one gear 116 and the other gear 117. Further, a third cell (power source means) 119 for supplying electric power to the heating member 141 is disposed on the side surface of the casing 919. The third casing 119 is housed and supplied to the heating member 1 except for accommodating the dry battery. 4 power adjustment -153- 200913828 circuit. Further, the third housing 1 1 9 is provided with a power switch 1 220, and the finger of the hand holding the adhesive 1 1 1 can be turned on/off. As shown in Fig. 62, the adhesive material 11 is coated on one side of the substrate 9 on the adhesive tape 1. In the present embodiment, the "adhesive tape" has a length of about 20 m and a width W of about 1 m 2 m. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the 'thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin, and a sand resin type. . The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass or ceramic. A polymer core material such as plastic or the like is formed by covering the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit, and can improve the reliability of -154-200913828. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connecting member ° Next, a method of using the adhesive 1 1 1 of the present embodiment will be described. As shown in Fig. 63, the power switch 120 is turned ON by holding the adhesive 1 1 1 with one hand. Next, the opening portion 1 1 3 exposing the adhesive tape 1 is pressed against the circuit board 27. Since the heating member 1 1 4 is disposed on the substrate 9 side of the adhesive tape 1 on the opening portion 1 1 , the adhesive tape 1 on the lower side of the heating member 1 1 4 is pressed, and the adhesive 1 is applied to the circuit substrate 27 . 1 is heated and pressed. When the adhesive Π 1 is pressed downward, moving forward (arrow E in Fig. 63), the adhesive tape 1 is sequentially pulled out, and the heating member 1 1 4 advances in the E direction, and at the same time, the new adhesive The agent 9 will be located under the heating member 114 and the adhesive 11 will be sequentially pressed to the circuit substrate 27. When the adhesive tape 拉 is pulled out from the one of the trays 3, since one of the trays 3 is rotated, one of the disks 3 is fixed coaxially with one of the disks 3, and the other one of the gears 116 is rotated. The gear 117 is also turned "to" and the substrate 9 from which the debonded agent 2 5 is wound up to the other disk 17 . With the present embodiment, the adhesive 1 1 is pressed onto the circuit board 27 In any position, as long as the adhesive ηι is held by one hand and pushed forward, it is very simple to carry out the pressing of the adhesive. Thus, since the adhesion of the adhesive 11 is very simple, it is particularly suitable, for example, when the electronic component (wiring circuit) 37 is temporarily adhered to the circuit substrate 27, or only one of the circuit substrates 27-155-200913828 When the electronic component (wiring circuit) 37 is pressed, it is pressed. After the above-described pressing (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are positioned and officially connected. In the case of the main connection, after the adhesive 1 1 is pressed against the circuit board 27, an electronic component (wiring circuit) 3 is disposed on the adhesive 1 1 , and if necessary, the polytetrafluoroethylene material 3 9 can be used as a cushioning material. The electronic substrate (wiring circuit) 37 is heated and pressurized by the heating and pressing head 19 to the circuit board 27 (refer to Fig. 4). In this manner, the electrode 27a of the fixed circuit substrate 27 and the electrode 3 7a of the electronic component (wiring circuit) 37 can be connected. Further, since the adhesive tape 1 is housed in the casing 99 and used as it is, it is easy to handle and has good workability. Here, a method of manufacturing the adhesive ηι of the present embodiment will be described with reference to Fig. 64. On a substrate 23 which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 28, and dried in a drying oven 29, followed by a coiler. 3 1 Take the original material. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 3 3 and taken up to the tray 3 in the refurbishing step, and then the one of the trays 3 is sandwiched between the half-shells 99a and 99b. And the other disk (empty disk) 5, and the third casing 1 丨 9 in which the heating member 1 14 and the dry battery are housed is assembled to form the adhesive 1 1 1 . The adhesive 1 U is bundled with the dehumidifying material, and the low temperature (_ 5 C to _ 10 °c) is managed and shipped. Next, the invention described in the 60th to 64th paragraphs of the patent application is described in the line -156-200913828. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to an adhesive tape wound in a disk shape. Next, the background art of the invention described in the claims 60 to 64 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The width of the conventional adhesive tape is about 〜3 mm, and the length of the tape taken up to the disk is about 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., Use again. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is considered to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per disk 'to reduce the frequency of replacement of the disk. However, because the thickness of the adhesive tape is thick, it is difficult Increase the number of volumes per plate -157- 200913828. 'If you consider reducing the thickness of the adhesive tape, because the use of enamel-treated PET (polyethylene terephthalate) as the substrate, if the thickness of the substrate is too thin, there will be a tendency for the substrate to stretch or break. Waiting for the problem. Therefore, the object of the invention described in the claims 60 to 64 is to provide an adhesive tape which can increase the number of rolls per one disk and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in the claims 60 to 64 will be described with reference to the attached drawings. The first embodiment of the invention described in the claims 60 to 64 will be described with reference to Figs. 65, A, B, 3, 4, 29, and 5. Fig. 65 is a perspective view of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive disk, and Fig. 65B is a cross-sectional view taken along line A-A of Fig. 65A. The adhesive tape 1 is wound around the disk 3, and the disk 3 is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive enamel applied to one side of the substrate 9. The substrate 9 is made of a copper film (copper foil). The thickness of the substrate 9 (S in FIG. 65B) is 10/m, the tensile strength of the substrate 9 at 25 ° C is 500 MPa, and the thickness ratio of the substrate 9 to the adhesive 11 (S/ T) is 0. 5. The thickness of the adhesive 1 1 is 20 y m. The surface roughness Rmax of the substrate 9 is 0. 2 5 // m. Further, it was also made into an aromatic polyamine film (MIC TRON) as the base -158-200913828 material. In the production, the thickness of the substrate 9, the tensile strength, and the thickness ratio (S/T) of the substrate 9 to the adhesive 11 are the same as those of the copper film. Next, the method of using the above-mentioned adhesive tape will be described. As shown in Fig. 3, the disc 3 of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3 is attached to the front end via the guide pin 22. Wind the tray 17 and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressure-bonded from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3 and 17 to press the adhesive 1 1 To the circuit substrate 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, the wiring circuit (or electronic component) 23 is attached to the adhesive 1 1 pressed onto the circuit substrate 21, and the polytetrafluoroethylene material 24 is used as a buffer material to heat the pressurizing head 1. The pair of circuit boards 2 1 are heated and pressurized by the wiring circuit 23. In this manner, the electrode 2 1 a of the circuit substrate 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Fig. 29, as shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 1 1 is pressed against the entire periphery of the PDP, and it can be seen that the amount of the adhesive 1 used at one time is large. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time, thereby Disk 3 becomes empty. When the disc 3 becomes empty, the used disc 3 and the new disc are replaced, and the new disc is loaded to the adhesive device 15. Next, as described above, the action of pressing the adhesive 11 to the circuit substrate 21 and winding the substrate 9 to the take-up reel 17 is repeated - 159 - 200913828, and the result is 'using a copper film as the substrate 9 and adopting The aromatic polyamide film as the substrate 9 is treated as easily as the conventional adhesive tape 1, and there is no problem that the substrate 9 is stretched or broken. Secondly, the thickness of the adhesive tape is increased relative to the thickness of the substrate 11 compared to the conventional product (50/xm), so that the frequency of replacement of the disk can be reduced to improve productivity. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5. The adhesive 11 mixed with the resin and the conductive particles 13 is applied onto a substrate unwound from the unwinder 25, and dried by a drying furnace 29, and then taken up by a winding machine 3 1 . Take the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 3 3 and taken up to the reel, and the side plates 7 and 7 are attached to the reel 5 from both sides, and are bundled with the dehumidifying material. The package is managed and shipped at a low temperature (-5t~-10°C). Further, the adhesive film tape 1 was produced for the copper film of the base material 9 having a thickness of 4/zm, 20//m, and 25#m, and an aromatic polyamide film. As described above, the base was not produced. The problem of stretching or breaking of the material 9. Further, the thickness ratio (S/T) of the substrate 9 to the adhesive 1 is 0. 01, 0. 05, 1. The copper film and the aromatic polyamide film of 0 were used to form the adhesive tape 1, and as described above, the problem of stretching or breaking of the substrate 9 did not occur. Next, the invention described in the claims 65 to 66 will be described. -160- 200913828 These inventions relate to a method of forming an adhesive material for an adhesive bond between an electronic component and a circuit board, or a circuit board, and an electrode between the electrodes. Further, the adhesive material is formed of an adhesive tape used for bonding and fixing a semiconductor element (wafer) to a fixing support substrate or a lead frame of a lead frame or a semiconductor device for supporting a semiconductor element mounting substrate. The method, in particular, relates to a method of forming an adhesive material that is rolled into a disk-shaped adhesive tape. Next, the background art of the invention described in the patent application Nos. 6 to 6 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Also, the adhesive tape is also applied to the lead fixing tape of the lead frame, L 0 C tape, die-bonded tape, micro BGA. The adhesive film of CSP or the like is intended to improve the productivity and reliability of the entire semiconductor device. Japanese Laid-Open Patent Publication No. 2001-284005 describes a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. . Next, the adhesive side of the adhesive tape which is taken up from the adhesive material disc is pressed against the circuit board of 200913828 by a heating and pressing head, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive material plate is used up, the used tray 'and the take-up tray of the take-up substrate are removed, the new adhesive material tray and the new take-up tray are loaded to the adhesive device, and the adhesive material is adhered. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesive amount per one disk, so as to reduce the frequency of replacement of the disk. However, if the number of the adhesive tape is increased, the disk is increased. The size of the winding diameter of the adhesive tape (hereinafter referred to as "winding diameter") is also large, and it may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 65 to 66 is to provide a method for forming an adhesive tape which can improve the production efficiency of an electronic device without increasing the winding diameter of the adhesive tape. Next, an embodiment of the invention described in the claims 65 to 66 will be described with reference to the attached drawings. Referring to Figs. 66A and A, Fig. 67, Fig. 68, Fig. 4, Fig. 29, and Fig. 5, a first embodiment of the invention described in the claims 65 to 66 will be described. Fig. 66 and Fig. 66 are the steps of forming the adhesive tree of the adhesive tape-162-200913828 of the first embodiment. Fig. 66 is a view in which the adhesive tapes are integrally laminated and one of the substrates is taken up to the take-up. A schematic view of the step of using the disk 'Fig. 66B is a sectional view of the overlapping portion between the adhesives of Fig. 66A'. Fig. 67 is a schematic view showing the steps of forming an adhesive for the adhesive device on the covering body, 6 8 is a perspective view of a disk with an adhesive tape wound, Figure 4 is a cross-sectional view of the adhesion between the circuit boards, and Figure 29 is a perspective view of the state of use of the adhesive of the PDP, and Figure 5 is an adhesive. A step diagram of the method of manufacturing the tape. The adhesive tape 1 is wound around the discs 3, 121, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 12 1 . The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. In terms of strength and adhesion of the adhesive, the substrate 9 should be composed of Ο PP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate). However, it is not limited to this. The adhesive 1 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. The conductive particles 13 may also be dispersed. The conductive particles 13 are metal particles such as Au, Ag, pt, Ni, cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass 'ceramics, Polymer core materials such as plastic cover the above-mentioned conductive layer to form -163- 200913828. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 6A, the discs 3 and 121 of the two adhesive tapes 1 and the reels 17 and 18 for winding are attached to the adhesive device 15, and the adhesive material wound on one of the discs 3 is attached. The front end of the tape 1 is attached to one of the take-up reels 17 via the guide pins 22, and the adhesive tape 1 is unwound (Fig. 66A, arrow A). Further, the front end of the adhesive tape 1 wound on the other disk 121 is also attached to the other take-up reel 18, and the adhesive tape 1 is unwound, and the adhesive tape 1 is unwound from the discs 3, 121. The adhesive tape 1 is placed integrally by the pressing roller 1 2 2 disposed between the disk 3'1 2 1 and the heating and pressing head 19. Next, the base material 9 of the other adhesive tape 1 is taken up to the take-up reel 18. Next, one of the adhesive tapes 1 is placed on the circuit board 21, and the pressure-sensitive adhesive tape 1 is pressed from the base material 9 side by the heat-pressing head 19 to press the adhesive onto the circuit board 21 of the covering body. . Thereafter, the base -164 - 200913828 material 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polytetraene material 24 is used as a buffer material to heat the pressing head 19 For the circuit board: The wiring circuit 2 is heated and pressurized. In this manner, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed against the entire PDP 26, and the amount of the adhesive 1 used at one time is much larger than that of the transfer. The amount of use. Therefore, the amount of the adhesive tape 1 wound around the trays 3, 121 is also increased, and the adhesive tape 1 wound on the trays 3, 12 1 is taken up to the take-up tray 1 7 and 1 in a short period of time. 8. In this embodiment, when the adhesive 1 1 is pressed against the circuit board 2 1 in one step, the adhesive 11 of the adhesive tape 1 and the adhesive 1 1 of the adhesive tape 1 are superposed, and the desired one is obtained. After the thickness of the adhesive layer 1 is applied, the adhesive 1 1 is pressed to the circuit board 2 1, so that the thickness of the tape 1 can be half. Therefore, the number of rolls per 1 adhesive tape 1 can be increased, and the amount of adhesive for replacement work can be greatly increased. Therefore, less work of the new adhesive tape 1 is required, so that the production efficiency of the electronic machine can be improved. Here, a method of manufacturing an adhesive paste according to the present embodiment will be described with reference to Fig. 5 . On the substrate 9 which is unwound from the unwinding machine 25, the coating machine 27 is used to coat the periphery of the fluoroacetic acid-based PDP from the resin in a manner of about half of the usual manner. Each of the adhesive discs can be used to fold the thickness of the strip and the adhesive ii formed by mixing the conductive particles 13 and dried in the drying oven 29 to take up the original material by the coiler 31. After the raw material of the taken up adhesive tape 1 is cut into a specific width by the cutter 3 3 and taken up to the reel 5, the side plates 7, 7 are attached to the reel 5 from both sides, together with the dehumidifying material. The bale 'is implemented at a low temperature (-5 °C~-1 〇t:) and shipped. Further, the adhesive tape 1 may be one in which the adhesive 11 described later contains a curing agent. In the following, the embodiment of the invention described in the sixth to fifth aspects of the patent application is described. In the embodiments described below, the same portions as the above-described embodiments will be denoted by the same reference numerals and the details of the parts will be omitted. Note that the following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 69A, the adhesive 11a containing the curing agent and the conductive particles 13 and the adhesive tape 1b not containing the curing agent and the conductive particles 13 can be produced. As shown in Fig. 69, the adhesive tape 1a containing a curing agent or the like and the adhesive tape lb not containing a curing agent are integrally stacked, and the superposed substances are pressed against the circuit board 21. At this time, since only one of the adhesive tapes 1a of the adhesive tape 1a contains a hardener, the adhesive Ub of the other adhesive tape lb does not need to contain a hardener. Therefore, the adhesive tape 1 b of the adhesive 1 1 b which does not contain the hardener does not need to be subjected to low temperature management. Therefore, the number of adhesive tapes 1 a requiring low temperature management can be reduced, and the transportation and storage of the adhesive tape can achieve more efficient management. Further, when the adhesive is an epoxy resin, the curing agent of the epoxy resin should be an imidazole type, an amine imide, an ammonium salt, a polyamine, or a polythiol. -166 - 200913828 Further, as shown in Fig. 69B, the adhesive 11a containing the adhesive tape la of one of the curing agents contains the conductive particles 13 and is composed of two layers. Since the pressed side does not contain conductive particles, the resin will The flow does not flow out from the circuit between the conductive particles and the crucible, and the conductive particles 13 can be surely kept between the electrode 21a and the electrode 23a when heated and pressurized. The invention described in the claims 65 to 66 is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the invention as set forth in the claims 65 to 66. In the first embodiment, the adhesive 11 contains the conductive particles 13 or, however, the adhesive 11 which does not contain the conductive particles 13 may be used. The above description is directed to the case where the electronic component, the circuit board, and the circuit board are fixed to each other. However, the present invention can also be applied to a wafer for fixing and fixing a semiconductor element (wafer) to a fixing support substrate of a lead frame or a lead frame. Or on a semiconductor device on which a semiconductor substrate is mounted. Next, the invention described in the claims 67 to 72 will be described. These inventions relate to electronic components such as liquid crystal panels, PDP panels, EL panels, bare chip packages, and the like, and to the adhesion between the boards, and to provide electrical connection between the electrodes of the two. The conductive material for the purpose of the different conductive material is, in particular, related to the winding form of the different conductive material. Next, the background art of the invention described in the claims 6-7 to 7 will be described. -167- 200913828 A method of connecting electronic components to a different-conductive conductive tape, a circuit board, or a circuit board, by using a conductive adhesive material sandwiching a film-like adhesive between opposing electrodes, and performing electron heating and pressing The connection between components and boards, or boards. In the film-like adhesive, conductive particles for the purpose of conducting conduction between the electrodes are mixed, and the resin used is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin, and a photocurable resin. (For example, refer to Japanese Laid-Open Patent Publication No. 55-1084007). Further, a circuit connection method using a conductive material composed of a resin and containing a conductive material is also known (for example, refer to Japanese Laid-Open Patent Publication No. SHO 60-262430). The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an anthracene resin type, and an acrylic resin type. Both the thermoplastic resin and the thermosetting resin are required to be heated and pressurized. The purpose is to allow a resin of a thermoplastic resin to flow and to obtain a adhesion between the resin and the coating, and to obtain a further curing reaction of the resin in order to obtain a thermosetting resin. In recent years, from the viewpoint of connection reliability, a mixture of a thermoplastic resin and a thermosetting resin, and a thermosetting resin are mainly used. Moreover, the photohardenable resin which can be connected at a low temperature has also been applied to industrial applications.
又，近年來，爲了防止被連接體之反翹及伸展，要求 向異導電材之連接時之連接溫度的低溫化。又，隨著向異 導電材之連接用途的擴大、以及液晶面板、PDP面板' EL -168- 200913828 面板、及裸晶片封裝等之需要的擴大，對連接時之工作時 間之短時間化的要求愈來愈強。 又，隨著向異導電材之連接需要及用途之擴大，不但 要求短時間之連接’尙要求能提高生產性。因爲液晶面板 、PDP面板、EL面板、及裸晶片封裝等之需要的擴大， 向異導電材之使用量亦增加。另一方面，隨著液晶面板之 大畫面及PDP面板等大畫面平板之需要的擴大，向異導電 材之1片面板所使用之使用量亦增加。傳統上，向異導電 材之提供係採用將膜狀之黏著劑重疊捲繞於剖面爲圓形芯 材上的盤形狀，盤之更換時間妨礙生產性之提高。 另一方面，隨著液晶面板之細邊緣化，向異導電材亦 朝狹窄化發展’傳統上捲繞於同一圓芯狀之盤形狀很容易 發生捲取散亂，進而導致製造步驟之廢料率的惡化。 有鑑於上述缺點，申請專利範圍第6 7〜7 2項記載之 發明的目的，係在提供一種向異導電材膠帶，可延長盤之 更換時間之間隔，且以避免捲取散亂所導致之作業性的降 低，而可提高生產性。 其次，針對申請專利範圍第67〜72項記載之發明之 實施形態進行說明。 第70圖係申請專利範圍第67〜72項記載之發明之第 1實施形態之模式圖。 如第70圖所示，本實施形態之向異導電材膠帶，係 將由膜狀黏著劑Π、及兩面經過剝離處理之基材膜（基材 )9之2層構造所構成之向異導電材，以多捲數方式積層 -169- 200913828 於芯材5之縱向上而成爲捲線狀，第70圖係向異導電材 之供應形態。第70圖中，芯材5之雨端部分別配設著側 板7。又，向異導電材膠帶係由基材膜9、及塗布於基材 膜9上之向異導電材之膜狀黏著劑1 1所構成，向異導電 材膠帶因係應用於高精細化之電子構件之連接上，爲了防 止無機及有機物之異物及污染，基材膜9會位於黏著劑之 外側。 採用向異導電材之連接上，要求縮短工作時間，且要 求向異導電材之迅速轉錄性。如上面所述，將向異導電材 以多捲數方式積層於附有側板7之芯材（捲軸）5之縱向 上而成捲線狀’可提供不會發生捲取散亂之長方形向異導 電材。因此，可延長向異導電材膠帶之更換時間之間隔而 提高生產性。 上述向異導電材膠帶時，基材膜9之拉伸強度應爲 12kg/mm2以上、基材膜9之斷裂伸展應爲60〜200%。因 此，基材膜9因爲具有強度且伸展較小，在將構成向異導 電材之膜狀黏著劑1 1轉錄至電路基板等連接構件之前的 過程中’可防止膜狀黏著劑1 1伸展、厚度變薄、以及寬 度變細。又，以處理及環境保護之角度而言，基材膜9之 厚度應爲1〇〇 以下。因爲基材膜9太薄會導致上述效 果之劣化，故基材膜9之厚度應爲〇. 5 /2 m以上。 其次’上述向異導電材膠帶所採用之基材膜9，從強 度、及構成向異導電材之黏著劑之剝離性的角度而言，應 採用經過矽及氟剝離處理之PP (聚丙烯）、OPP (延伸聚 -170- 200913828 丙烯）、及PET (聚對苯二甲酸乙二酯）等，然而，並不 限於此。 基材膜9之剝離處理，以矽或氟處理即可實現，只在 基材膜9之單面實施剝離處理的話，可使基材膜9之表面 及背面具有不同之脫模性，而可防止對基材膜9之背面轉 錄。又，對基材膜9之兩面實施剝離處理時，對膜狀黏著 劑1 1面實施矽及氟處理，而使膜狀黏著劑1 1面具有剝離 性。 膜狀之黏著劑1 1係使用具高信賴性之熱硬化性樹脂 系之環氧樹脂系、以黏著劑之低應力化爲目的而且具有良 好黏著劑相溶性之矽樹脂系、以及可以較上述爲低之溫度 及較短之時間實施連接之自由基系之物，然而，膜狀之黏 著劑並未受限於此。自由基系之黏著劑1 1係以壓克力系 黏著劑爲主。 第71圖係申請專利範圍第67〜72項記載之發明之第 2實施形態的模式圖。又，第7 1圖中，和第70圖相同之 構成要素會附與相同符號並省略詳細說明。 如第71圖所示，本實施形態之向異導電材膠帶有2 種基材膜，除了採用以前述基材模夾住黏著劑之方式構成 之向異導電材以外，其餘構成和第1實施形態之向異導電 體膠帶相同。亦即，本實施形態之向異導電材如第7 1圖 所示，係由膜狀之黏著劑1 1、及黏著劑1 1面實施過剝離 處理之2種基材9a、9b之3層構造所構成。 構成向異導電材之黏著劑較軟時，可以利用捲軸側之 -171 - 200913828 如下所示之基材膜來防止黏著劑變形。 其次，基材膜9a、9b之物性値上，基材膜9a、9b之 拉伸強度應爲1.2kg/mm2以上、基材膜9a、9b之斷裂伸 展應爲60〜200%之理由，和第1實施形態時相同。利用 此方式，基材膜9a、9b可得到物理強度，而可防止因爲 膜狀黏著劑之伸展而產生薄膜化、以及寬度方向之變細。 又’基材9a、9b之厚度應爲100# m以下，如此’在操作 及環境保護都可有良好之對應。 又，上述第1及第2實施形態時，若構成向異導電材 之膜狀黏著劑1 1爲無黏著性且不會出現阻塞現象者，則 可在無基材膜9或9a、9b之狀態下單獨其膜狀黏著劑1 1 捲成捲線狀。 以下’針對實施例進行說明，然而，申請專利範圍第 67〜72項記載之發明並未受限於這些實施例。 (實施例1 ) (1)向異導電材膜之製作 製作乙酸乙酯之30重量百分率溶液，對其添加平均 粒徑爲2·5μιη、5體積百分率之Ni粉。其次，上述乙酸 乙醋溶液添加當做膜形成材之苯氧基樹脂（高分子量環氧 樹脂）50g、環氧樹脂2〇g、及咪唑5g，得到黏著劑形成 用溶液。另一方面，準備在著色成淡藍色之透明、厚度爲 5〇#m之聚對苯二甲酸乙二酯膜（斷裂強度爲25kg/mm2 、斷裂伸展爲1 3 0% )之兩面實施矽處理之基材膜。其次 -172- 200913828 ，在此基材膜之單面上以滾塗機塗布上述溶液’實施110 °C之5分鐘乾燥，得到厚度5 0 μ m之向異導電材膜的捲繞 物。 (2)向異導電材膠帶之製作 將上述向異導電材膜之捲繞物切割成寬度1 . 5mm，以 多捲數方式積層於附有側板之直徑48mm、寬度100mm之 芯材（捲軸）之縱向上而成爲捲線狀，得到3 00m長度之 向異導電材膠帶。 將此捲繞成捲線狀之向異導電材，亦即，將向異導電 材膠帶裝設於向異導電材膠帶自動壓著機上並供應向異導 電材時，在向異導電材之轉錄性及伸展試驗中獲得良好結 果，而且，可減少盤之裝設次數、無需裝設時間、以及避 免轉錄性及黏著劑之伸展所導致之貼附作業的重複，而這 些效果可提高生產性。 (實施例2 ) 製作和實施例1相同之向異導電材膠帶之捲物。其次 ，在基材膜及黏著劑之積層體上，以2基材膜夾住黏著劑 之方式，層壓另1種類之厚度爲25#m之聚對苯二甲酸乙 烯酯基材膜（斷裂強度爲25kg/mm2、斷裂伸展爲130%) ’得到3層構造之向異導電材膜之捲物。其次，和實施例 1相同’將此膜之捲物切割成寬度1.5mm，並將其捲取至 附有側板之直徑48mm、寬度100mm之芯材（捲軸）而成 -173- 200913828 爲捲線狀，得到3 0 0m長度之向異導電材膠帶。 實施例2亦和實施例1相同，可得到良好之生產性。 (實施例3 ) 除了基材膜採用厚度50"m之聚四氟乙烯膜（斷裂強 度爲4.6kg/mm2、斷裂伸展爲3 5 0%)以外，得到和實施例 1相同之向異導電材膜之捲繞物，此外，和實施例1相同 ’將此膜之捲繞物切割成寬度K 5 mm，捲繞於附有側板之 直徑48mm、幅l〇〇mm之芯材（捲軸）而成爲捲線狀，得 到3 00m長度之向異導電材膠帶。此時，亦可捲繞3 00m 之長度。 (比較例1 ) 得到和實施例1相同之向異導電材膜之捲繞物，此外 ’和實施例1相同，將此膜之捲繞物切割成寬度1 . 5mm， 以同一圓芯狀捲繞至傳統之盤，得到100m長度之向異導 電材膠帶。 將此捲繞成捲線狀之向異導電材膠帶裝著至向異導電 材膠帶自動壓著機，並供應向異導電材時，向異導電材之 轉錄性及伸展試驗皆獲得良好結果，然而，盤之裝設次數 爲實施例之3倍，裝設時間及調整時間都增加。 本發明之產業上的利用可能性如下所示。 如以上說明所示，利用申請專利範圍第1項記載之發 明時’係利用黏著材膠帶之黏著劑來黏著全部捲出之黏著 -174- 200913828 材膠帶（一方之黏著材膠帶）之終端部、及新裝著之黏著 材膠帶（另一方之黏著材膠帶）之始端部，實施黏著材盤 之更換，很簡單即可將新黏著材膠帶裝著至黏著裝置。 又，因爲無需在每次更換新黏著材膠帶時都更換捲取 膠帶、將新黏著材膠帶之始端裝設於捲取盤上之作業、以 及在特定路徑設定導引銷等之作業，只需要較少時間即可 更換新黏著材盤，故可提高電子機器之生產效率。 因爲一方之黏著材膠帶及另一方之黏著材膠帶係以重 疊黏著劑面來進行黏著，故有較高之連接強度。 利用申請專利範圍第2項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之效果以外，全部捲 出之黏著材膠帶之切斷係在露出結束標記時實施，切斷及 執行連接作業之部份容易解開且可利用必要最小之位置實 施連接，而可防止黏著材膠帶之浪費。 利用申請專利範圍第3項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶黏著全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 ，故很簡單即可實施黏著材膠帶間之黏著。 利用申請專利範圍第4項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果’很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 -175- 200913828 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 利用申請專利範圍第5項記載之發明時’因爲係以卡 止銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏 著材膠帶之始端部，故連接十分簡單。又，因爲無需在每 次更換新黏著材盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設於捲取盤上作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 利用申請專利範圍第6項記載之發明時，卡止構件之 一方之爪部會卡止於一方之黏著材膠帶之終端部，其後， 配設於卡止構件之另一方之爪部會卡止於另一方之黏著材 膠帶之始端部，實施兩者之互相連接，故連接十分容易。 因爲一方之爪部及另一方之爪部之間具有彈性構件， 故，彈性構件可伸展而使卡止構件之另一方之爪部卡止於 另一方之黏著材膠帶之始端部之任意位置上，故連接具有 高自由度。 又’ 一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部會在互相抵接之狀態進行連接，無需重疊膠帶 ’可利用必要最小之位置實施連接，而可防止黏著材膠帶 之浪費。 利用申請專利範圍第7項記載之發明時，只需以夾子 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 -176- 200913828 部之重疊部份即可連接，連接作業十分容易。 利用申請專利範圍第8項記載之發明時，係從重疊部 份之兩面壓扁夾持片來連接兩者，可提高黏著材膠帶之重 疊部份的連接強度。 利用申請專利範圍第9項記載之發明時，係利用黏著 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，因爲無需 每次更換新黏著材盤時都更換基材之捲取盤、及將新黏著 材之始端裝設至捲取盤，只需要較少時間即可更換新黏著 材盤，故可提高製造效率。 利用申請專利範圍第1 〇項記載之發明時，除了具有 和申請專利範圍第9項記載之發明相同之效果以外，一方 之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部會 互相形成鈎狀卡止，而且，兩者係以黏著劑面互相連接， 故有較高之連接強度。 利用申請專利範圍第1 1項記載之發明時，除了具有 和申請專利範圍第9或1 0項記載之發明相同之效果以外 ’一方之黏著材膠帶之終端部係結束標記之部份，執行連 接作業之部份容易解開，且防止黏著材膠帶之浪費。 利用申請專利範圍第1 2項記載之發明時，除了具有 和申請專利範圍第9項〜1 1之其中任一項記載之發明相同 之效果以外，因爲連接部份會形成凹凸，可擴大連接面積 ，同時，可提高連接部份之黏著材膠帶之拉伸方向（縱向 -177- 200913828 )之強度。 利用申請專利範圍第1 3項記載之發明時，除了具有 和申請專利範圍第9項〜第1 1項之其中任一項記載之發 明相同之效果以外，連接部份會形成貫通孔，貫通孔之內 緣會有黏著劑滲出，可增加黏著劑之黏著面積，而進一步 提高連接強度。 利用申請專利範圍第1 4項記載之發明時，只需連接 已用完之黏著材膝帶（一方之黏著材膠帶）、及新黏著材 膠帶（另一方之黏著材膠帶）即可更換盤，故很簡單即可 將新黏著材盤裝著至黏著裝置。又，因爲無需每次更換新 黏著材盤時都更換捲取盤、將新黏著材膠帶之始端裝設於 捲取盤上、以及將黏著材膠帶裝設於導引件之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 黏著材膠帶之處理基材所使用之處理劑係矽系樹脂， 且黏著膠帶亦使用矽黏著劑，因可降低兩者之表面張力差 而提高密著力，故可實現傳統上十分困難之兩者之黏著。 利用申請專利範圍第1 5項記載之發明時，除了具有 和申請專利範圍第1 4項記載之發明相同之效果以外，矽 黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽處理基 材之表面張力之差爲10mN/m ( 10dyne/cm)以下，可得到 強密著力，而可確實黏著兩者。 利用申請專利範圍第1 6項記載之發明時，除了具有 和申請專利範圍第1 5項記載之發明相同之效果以外，因 -178- 200913828 爲黏著力爲l〇〇g/2 5mm以上，可使一方及另一方之黏著材 膠帶之兩黏著劑面之黏著更爲強固。 利用申請專利範圍第1 7項記載之發明時，除了具有 和申請專利範圍第1 6項記載之發明相同之效果以外，係 利用兩面連接一方及另一方之黏著材膠帶，故可得到更爲 強固之連接。 利用申請專利範圍第1 8項記載之發明時，因爲採用 兩面黏著劑之矽黏著膠帶，利用將兩面矽黏著膠帶夾於一 方及另一方之黏著材膠帶間之方式來實施兩者之黏著（或 密著），故兩者之連接十分簡單且容易。 利用申請專利範圍第1 9項記載之發明時，因已全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部係以糊狀樹脂製黏著劑固定，故連接十分簡單。又， 因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、將 新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路 徑設定導引銷等之作業，只需要較少時間即可更換新黏著 材盤，故可提高電子機器之生產效率。 利用申請專利範圍第2 0項記載之發明時，除了具有 和申請專利範圍第1 9項記載之發明相同之作用效果以外 ，因樹脂製黏著劑可從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取適合黏著材膠帶間之連接的樹 脂製黏著劑，故可提高黏著材膠帶間之連接強度。 利用申請專利範圍第2 1項記載之發明時，黏著裝置 內因配設著供應申請專利範圍第1 9或2 0項記載之樹脂製 -179- 200913828 黏著劑之充塡機，無需另行準備充塡機，故可防止連接作 業之浪費。 利用申請專利範圍第2 2項記載之發明時，捲繞於一 方之捲部的黏著材膠帶全部捲出時，將捲繞於相鄰捲部之 黏者材膠帶裝設至捲取盤，貫施黏著材膠帶之更換’因爲 無需將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少 之新黏著材膠帶盤之更換作業，故可提高電子機器之生產 效率。 利用申請專利範圍第2 3項記載之發明時，除了具有 和申請專利範圍第22項記載之發明相同之效果以外，因 係以連結膠帶連接一方之黏著材膠帶之終端部及另一方之 黏著材膠帶之始端部，故一方之黏著材膠帶盤之黏著材膠 帶全部捲出後，無需將另一方之捲部之黏著材膠帶裝設至 盤之作業’故可進一步提高電子機器之生產效率。 利用申請專利範圍第24項記載之發明時，因爲連結 膠帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部 捲出後’會依序從下一捲部捲出黏著材膠帶。 又’膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，連結膠帶會被自動捲取至捲取盤，故可省 略捲取之麻煩。 利用申請專利範圍第2 5項記載之發明時，一方之黏 著材膠帶之終端部及另一方之黏著材膠帶之始端部之連接 部份’因爲係以黏著材膠帶覆蓋卡止具，故外觀良好，同 時’可防止連接部份之卡止具接觸黏著材膠帶而使黏著材 -180- 200913828 膠帶或黏著裝置受損。 利用申請專利範圍第2 6項記載之發明時，連接部檢 測手段檢測到連接部份’至連接部份通過壓著部爲止，會 將一方之黏著材膠帶捲取至捲取盤，可防止連接部份到達 壓著部時實施壓著動作之問題。又，至連接部份通過壓著 部爲止’因爲會自動將一方之黏著材膠帶捲取至捲取盤， 故可省略捲取之麻煩。 利用申請專利範圍第27項記載之發明時，除了具有 和申請專利範圍第2 6項記載之發明相同之作用效果以外 ’以簡單之構成即可實施連接部份之檢測，而且，可利用 這些手段來提高檢測精度。 利用申請專利範圍第29項記載之發明時，因可依序 逐條使用複數條黏著劑，可在不增加膠帶之捲數的情形下 ’可使1盤可使用之黏著劑的量增加成傳統之2倍以上。 因未增加捲數，故可防止捲取散亂，同時，可防止因 爲黏著劑從膠帶之寬度方向滲出而使捲取之膠帶間發生黏 著所導致之阻塞，此外，亦可防止因爲膠帶狀之基材較長 而容易發生之伸展等弊病（基材之損傷或斷裂）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高作業效率。 又，黏著劑膠帶之製造上，因可減少製造之盤數，可 減少盤材及濕氣防止材之使用量，故可降低製造成本。 利用申請專利範圍第3 0項記載之發明時，除了具有 和和申請專利範圍第2 9項記載之發明相同之效果以外， -181 - 200913828 因相鄰之黏著劑條間具有間隔，很容易即可實施逐條分離 ’而使對電路基板之壓著更爲容易。 利用申請專利範圍第3 1項記載之發明時，除了具有 和申請專利範圍第29項相同之效果以外，只需在塗布於 基材之單面全面上之黏著劑上形成縫隙即可，製造十分容 易，而且，相鄰之黏著劑條間的間隙很小，故可增加配置 於基材上之黏著劑條之條數。 利用申請專利範圍第3 2項記載之發明時，很容易即 可製造申請專利範圍第3 0項記載之黏著劑膠帶。 利用申請專利範圍第3 3項記載之發明時，因可同時 製造2條黏著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 4項記載之發明時，因係實施 部份黏著劑之加熱來降低該部份之凝聚力並將其壓著至電 路基板’而黏著劑膠帶係使用在基材之單面全面塗布黏著 劑者’故可直接利用既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用變更加熱區 域而進行任意設定，故壓著之黏著劑寬度具有高自由度。 和申請專利範圍第29項記載之發明相同，因爲會依 逐條對基材上之黏著劑加熱並壓著至電路基板，可在不增 加膠帶之捲數的情形下，將1盤可使用黏著劑量增加成2 倍以上。 因無需增加捲數即可增加黏著劑量，故和申請專利範 圍第2 9項記載之發明相同，可防止捲取散亂，同時，亦 可防止因黏著劑之滲出而導致之阻塞及基材伸展之弊病。 -182- 200913828 利用申請專利範圍第3 5項記載之發明時’因爲黏著 劑膠帶之寬度具有電路基板之一邊以上之長度’故可在增 加黏著劑量，同時，減少黏著劑膠帶之捲數。 因爲無需增加黏著劑膠帶之捲數即可大幅增加使用黏 著劑量，故可防止捲取散亂，同時，可防止阻塞、基材之 損傷或斷裂。又，因電子構件之製造工廠可減少新黏著劑 膠帶之更換次數，故可提高製造效率。 此外，黏著劑膠帶之製造上，因增加每1盤之黏著劑 量，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 利用申請專利範圍第3 6項記載之發明時，除了具有 和申請專利範圍第3 5項記載之發明相同之效果以外’相 鄰之黏著劑條會分離，很容易即可逐條將黏著劑從基材剝 離並實施壓著。 利用申請專利範圍第3 7項記載之發明時，除了具有 和申請專利範圍第3 5項相同之效果以外，尙可增加配置 於基材上之黏著劑條之條數且製造更爲容易。 利用申請專利範圍第3 8項記載之發明時，因爲可利 用既存設備同時製造2條申請專利範圍第3 6項記載之黏 著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 9項記載之發明時，除了可得 到申請專利範圍第3 5項〜第3 7項之其中任一項記載之效 果以外，很簡單即可將黏著劑壓著至電路基板之一邊，而 可提高電子構件之製造工廠之作業效率。 -183- 200913828 利用申請專利範圍第40項記載之發明時，除了可得 到申請專利範圍第3 5項〜第3 7項記載之效果以外，無需 旋轉電路基板’而只要移動一方之黏著劑膠帶及另一方之 黏著劑膠帶之位置，很容易即可將黏著劑壓著至電路基板 之四周，故有良好之作業效率。 利用申請專利範圍第4 1項記載之發明時，將黏著劑 壓著至電路基板之周圍時，會沿著寬度方向對黏著劑膠帶 實施條狀加熱加壓，很容易即可將黏著劑壓著至電路基板 ，而有良好之作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可， 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 尚自由度。 又，和申請專利範圍第3 5項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明時，因係逐條使用 配置於黏著劑板上之寬度方向的至少2條黏著劑，每1盤 至少可使用2盤份，無需增加黏著劑膠帶之捲數，即可大 幅增加1盤可使用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 -184- 200913828 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或斷 裂）。 因黏著劑膠帶係盒形式’黏著裝置上無需實施將黏著 劑膠帶裝設至盤之繁複業作，而只要將盒裝著至黏著裝置 即可’處理上更爲容易，且具有良好之裝設及更換作業性 〇 利用申請專利範圍第4 3項記載之發明時，除了具有 和申請專利範圍第4 2項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑並 實施壓著。 利用申請專利範圍第44項記載之發明時，除了具有 和申請專利範圍第42項相同之效果以外，黏著劑膠帶只 需在基材之單面全面塗布黏著劑並形成縫隙即可，故製造 十分容易。 利用申請專利範圍第4 5項記載之發明時’因爲黏著 劑膠帶只需在基材之全面塗布黏著劑即可，故可直接利用 既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度’可利用改變加熱加 壓區域來實施任意設定，故壓著之黏著劑寬度具有高自由 度。 利用申請專利範圍第46項記載之發明時’除了具有 和申請專利範圍第4 5項相同之效果以外’尙和申請專利 範圍第1項記載之發明相同，因爲未增加捲數卻可增加黏 -185- 200913828 著劑量，故可防止捲取散亂，同時，得到可防止因黏著劑 之滲出而造成之阻塞、及防止因基材之伸展而造成之弊病 等之效果。使用時，1盤份全部捲出時’只需反轉盒即可 ，故下一次之裝著十分容易。因採用盒形式，處理上更爲 容易，且具有良好之裝設及更換作業性。 利用申請專利範圍第4 7項記載之發明時，利用黏著 材膠帶之基材黏著全部捲出之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，無需每次 更換新黏著材盤時都更換捲取盤、及將新黏著材盤之始端 裝設至捲取盤之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 利用申請專利範圍第48項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。 又，因爲熱熔融劑層形成於膠帶之縱向全體，重疊長 度無需嚴格定位，故連接具有高自由度。 利用申請專利範圍第49項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 熱熔融劑層係夾於支持層之間，可防止熱溶融劑層曝露於 大氣下，故可防止濕氣之吸濕或灰塵等之附著而導致熱熔 融劑層之黏著強度降低。 -186- 200913828 利用申請專利範圍第5 0項記載之發明時，去除基材 端部之以脫模劑實施表面處理之部份，利用黏著材膠帶之 黏著劑黏著全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，來實施黏著材盤之更換，故很簡單即 可將新黏著材盤裝著至黏著裝置。 利用申請專利範圍第5 1項記載之發明時，除了具有 和申請專利範圍第5 OIX C記載之發明相同之效果以外， 因係利用電漿放電、紫外線照射、及雷射照射之其中任何 一種方法去除脫模劑，可在短時間內正確地去除脫模劑。 利用申請專利範圍第52項記載之發明時，因爲黏著 材膠帶盤上配設著複數個將黏著材膠帶捲繞於盤上之黏著 材膠帶之捲部（捲部），複數之捲部當中，一個捲部之黏 著材膠帶全部捲出時，會使用和全部捲出之捲部爲相鄰配 置之其他捲部之黏著材膠帶，因爲無需將新黏著材膠帶盤 裝著至黏著裝置，只需較少之新黏著材膠帶盤之更換作業 ，故可提高電子機器之生產效率。又，因爲係依序使用複 數之黏著材膠帶，無需增加1個黏著材膠帶盤之黏著材膠 帶的捲數，即可大幅增加1次更換作業之可使用的黏著劑 量。又’因爲無需增加黏著材膠帶之捲數，故可防止捲取 散亂，同時，可防止黏著劑從膠帶之寬度方向滲出而使已 捲取之黏著材膠帶間發生黏著，亦即，可防止阻塞，而且 ，亦可防止因爲基材較長而容易發生之伸展等弊病。 利用申請專利範圍第5 3項記載之發明時，因爲盤之 側板上配設著乾燥劑之收容部，除了具有和申請專利範圍 -187- 200913828 第5 2項記載之發明相同之作用效果以外，尙可從內部確 貫除去黏著材膠帶盤內之濕氣，故可進一步防止黏著材膠 帶因濕氣之吸濕而發生品質降低下。 利用申請專利範圍第5 4項記載之發明時，因爲覆蓋 捲繞於盤上之黏著材膠帶之周圍的蓋體構件，係以可自由 裝卸之方式配設於盤上，黏著材膠帶不會直接曝露於大氣 下’故可防止灰塵或大氣之濕氣對黏著材膠帶產生不良影 響。因此，即使配設複數之捲部時，對未使用之捲部配設 蓋體構件，可防止黏著材膠帶之品質降低。 又，因爲以可自由裝卸之方式配設蓋體構件，只要拆 下蓋體構件，即可簡單地從黏著材膠帶盤捲出黏著材膠帶 〇 利用申請專利範圍第5 5項記載之發明時，除了具有 和申請專利範圍第52至54項之其中任一項記載之發明相 同之作用效果以外，因爲尙可從蓋體構件之拉出口捲出黏 著材膠帶，故無需拆下黏著材膠帶盤之蓋體構件’而可直 接從黏著材膠帶盤捲出黏著材膠帶。 利用申請專利範圍第5 6項記載之發明時，具有和申 請專利範圍第5 2至5 5項之其中任一項記載之發明相同之 效果以外，尙因爲捲部之側板係以可自由裝卸之方式互相 嵌合，一方之捲部之黏著材膠帶全部捲出後，解除其和另 一方之捲部之嵌合，即可依序從下一捲部捲出黏著材膠帶 〇 利用申請專利範圍第5 7、5 8項記載之發明時’具有 -188- 200913828 和申請專利範圍第52至56項之其中任一項記載之發明相 同之作用效果’尤其是，黏著材膠帶爲將用以連接相對電 極之電極連接用黏著劑塗布於基材上之黏著材膠帶、黏著 材膠帶爲用以實施引線框架之固定用支持基板、半導體元 f牛_ ® 5；持基板 '或引線框架之晶片和半導體元件之連 接的黏者材膠帶時特別有用。 利用申請專利範圍第5 9項記載之發明時，以單手握 持殼體’使露出黏著劑膠帶之開口部抵壓電路基板，加熱 構件從基材側實施加熱壓著，將黏著劑壓著至電路基板， 故十分小型且可以單手操作，尙且，很容易即可將黏著劑 壓著至基板之一部份。 利用申請專利範圍第6 0項記載之發明時，因爲黏著 材膝帶之基材係金屬膜或芳香族聚醯胺膜，即使基材之厚 度較薄時’亦可防止基材伸展或斷裂等之問題。 因此’利用厚度較薄之基材所構成之黏著材膠帶，可 增加每1盤之捲數，而增加1盤可使用之黏著劑量。又， 使用本發明之黏著材膠帶時，因可增加每1盤之捲數，電 子構件之製造工廠只需實施較少之新黏著材膠帶之更換次 數’故可提高作業效率。其次，黏著材膠帶之製造上，可 減少製造之盤數，並可減少盤材及濕氣防止材之使用量， 故可降低製造成本。 利用申請專利範圍第6 1項記載之發明時，除了具有 和申請專利範圍第60項記載之發明相同之效果以外，尙 可獲得較薄且具高拉伸強度之黏著材膠帶。 -189- 200913828 利用申請專利範圍第62項記載之發明時，除了具有 和申請專利範圍第6 0或6 1項記載之發明相同之效果以外 ，因爲基材之拉伸強度爲300MPa以上，不易發生基材伸 展或斷裂之問題。 利用申請專利範圍第63項記載之發明時，除了具有 和申請專利範圍第6 0至6 2項之其中任一項記載之發明相 同之效果以外’因爲基材對黏著劑之厚度比爲0 · 0 1〜1. 0 ’此外，尙可得到較薄且具有高拉伸強度之黏著材膠帶。 利用申請專利範圍第6 4項記載之發明時，除了具有 和申請專利範圍第6 0至6 3項之其中任一項記載之發明相 同之效果以外’基材之表面粗細度Rmax爲〇. 5 // m以下， 基材之表面十分平滑，將黏著劑壓著至電路基板時，黏著 劑容易從基材分離。 利用申請專利範圍第6 5項記載之發明時，在被覆體 上形成黏著劑之前一步驟，使一方之黏著材膠帶之黏著劑 、及另一方之黏著材膠帶之黏著劑重疊，得到期望之黏著 劑之厚度後’再在被覆體上形成黏著劑，故各黏著材膠帶 之厚度較薄’雖然黏著材膠帶之捲數增多，每1盤之黏著 材膠帶之捲繞直徑卻更小。 因此，可增加每1盤之黏著材膠帶之捲數，而可大幅 增加1次更換作業之可使用的黏著劑量。因此，只需較少 之新黏著材膠帶之更換作業即可，故可提高電子機器之生 產效率。 利用申請專利範圍第6 6項記載之發明時，除了具有 -190 - 200913828 和申請專利範圍第65項記載之發明相同之效果以外’可 減少需要低溫管理之黏著材膠帶之數量，黏著材膠帶之運 送及保管可實施更有效率之管理。 利用申請專利範圍第67項〜72項之其中任一項記載 之發明時，因爲對被連接構件具有良好轉錄性（貼附性） 及良好連接信賴性，且可在改善步驟內之廢料率、及提高 作業性之情形下，提供傳統之長方形向異導電材膠帶，故 可提高生產性及作業性。 【圖式簡單說明】 第1圖係第1實施形態之黏著材膠帶連接方法時之黏 著材盤間之連接斜視圖。 第2圖A及第2圖B係第1圖之連接部份的連接步驟 斜視圖。 第3圖係黏著裝置之黏著劑的壓著步驟槪略圖。 第4圖係電路基板間之黏著的剖面圖。 第5圖係黏著材膠帶製造方法之步驟圖。 第6圖係本發明第2實施形態之黏著材膠帶連接方法 的斜視圖。 第7圖係本發明第2實施形態之變形例之黏著材膠帶 連接方法的斜視圖。 第8圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第8圖A係黏著材盤間之連接的斜視圖，第8圖B係 第8圖A之連接部份之連接方法的斜視圖，第8圖C係第 -191 - 200913828 8圖A之連接部份的平面圖。 第9圖係本發明第2實施形態之黏著材膠帶連接方法 的剖面圖。 第1 0圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第1 1圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第1 2圖A及B係第1實施形態之黏著材膠帶連接方 法圖，第1 2圖A係黏著材盤間之連接的斜視圖，第1 2圖 B係第1 2圖A之連接部份之連接方法的斜視圖。 第1 3圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 4圖A及第14圖B係本發明第3實施形態之黏著 材膠帶連接方法的剖面圖，第1 4圖A係加熱加壓前之狀 態，第1 4圖B係加熱加壓後之狀態。 第1 5圖A及第1 5圖B係本發明第4實施形態之黏著 材膠帶連接方法圖’第15圖A係剖面圖，第15圖B係平 面圖。 第1 6圖A及第1 6圖B係第1實施形態之黏著材膠帶 連接方法圖’第16圖A係黏著材盤間之連接的斜視圖， 第1 6圖B係第1 6圖A之連接部份（b )的斜視圖。 第1 7圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 8圖係本發明第3實施形態之黏著材膠帶連接方 -192 - 200913828 法的剖面圖。 第1 9圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第20圖A〜C係第〗實施形態之黏著材膠帶連接方法 圖’第20圖A係黏著材盤間之連接的斜視圖，第2〇圖b 及C係第2 0圖A之連接部份之連接方法的剖面圖。 第21圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第22圖A〜C係第丨實施形態之黏著材膠帶盤圖，第 22圖A係黏著材膠帶盤的斜視圖，第22圖b係第22圖 A之正面圖’第22圖c係第22圖A之連結膠帶之平面圖 〇 第2 3圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第24圖係本發明第2實施形態之連結膠帶之平面圖 〇 第25圖係本發明第3實施形態之連結膠帶之平面圖 〇 第26圖係本發明第4實施形態之黏著材膠帶盤的斜 視圖。 第27圖A〜C係第1實施形態之黏著材膠帶盤圖，第 27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 〇 第2 8圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第29圖係PDP之黏著劑之使用狀態的斜視圖。 -193 - 200913828 第3 0圖係本發明第2實施形態之黏著材膠帶盤的斜 視圖。 第31圖Α係將本發明之黏著材膠帶盤之黏著材膠帶 應用於LOC構造之半導體裝置時之黏著材膠帶之剖面圖 ，第31圖B係將本發明之黏著材膠帶盤之黏著材膠帶應 用於LOC構造之半導體裝置時之LOC構造之半導體裝置 之剖面圖。 第3 2圖A〜C係應用本發明之黏著材膠帶盤的黏著裝 置之槪略圖，第3 2圖A係正面圖，第3 2圖B係側面圖， 第3 2圖C係第3 2圖B之黏著材膠帶冲切貼附部8 9的重 要部位放大圖。 第33圖A及B係黏著劑膠帶圖，第33圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 3圖B係第3 3圖A之 A - A剖面圖。 第34圖係PDP之黏著劑之使用狀態的斜視圖。 第3 5圖係將黏著劑塗布於基材之步驟的剖面圖。 第3 6圖A〜C係本發明第2實施形態之黏著劑膠帶之 剖面圖。 第37圖A〜C係本發明第3實施形態之黏著劑膠帶及 其壓著方法的步驟圖。 第3 8圖A〜C係本發明第4實施形態之黏著劑膠帶製 造方法的步驟圖。 第3 9圖A及B係黏著劑膠帶圖，第3 9圖A係捲繞 著黏著劑膠帶之盤之斜視圖’第3 9圖B係從黏著劑側觀 -194- 200913828 看第39圖A之黏著劑膠帶時的平面圖。 第4 0圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第4 1圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第42圖A〜C係本發明第3實施形態之黏著劑膠帶之 剖面圖。 第43圖A〜C係本發明第4實施形態之黏著劑膠帶及 其壓著方法的步驟圖。 第44圖A〜C係本發明第5實施形態之黏著劑膠帶製 造方法的步驟圖。 第45圖A及B係本發明第1實施形態之黏著劑膠帶 盒圖，第45圖A係黏著劑膠帶盒之斜視圖，第45圖B係 第45圖A之A-A剖面圖。 第46圖係第45圖A所示之膠帶盒之盤的裝設狀態剖 面圖。 第4 7圖係黏著裝置之黏著劑壓著步驟的正面圖。 第4 8圖係黏著劑膠帶盒之製造方法的步驟圖。 第49圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第5 0圖係本發明第3實施形態之黏著劑膠帶之剖面 圖。 第5 1圖A及B係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第5 2圖A及B係第1實施形態之黏著材膠帶圖，第 -195- 200913828 5 2圖A係黏著材盤間之連接的斜視圖’第5 2圖B係第5 2 圖A之連接部份的剖面圖。 第5 3圖係第2實施形態之黏著材膠帶的剖面圖。 第54圖A〜C係第55圖之連接部份之連接步驟的剖 面圖，第54圖A係放電前之狀態’第54圖B係放電後之 狀態，第54圖C係連接部份之加熱壓著圖。 第55圖係黏著材膠帶連接方法之黏著材盤間之連接 的斜視圖。 第56圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第57圖A〜C係第1實施形態之黏著材膠帶盤圖，第 5 7圖A係黏著材膠帶盤的斜視圖，第5 7圖B係第5 7圖 A之正面圖，第57圖C係第57圖A之蓋體構件之正面圖 〇 第58圖係黏著材膠帶盤之製造方法的步驟圖。 第5 9圖係本發明第2實施形態之黏著材膠帶盤之側 面圖。 第60圖A及B係本發明第3實施形態之黏著材膠帶 盤之正面圖、及黏著劑膠帶之更換說明圖。 第6 1圖係本發明第4實施形態之捲部之側板的斜視 圖。 第62圖A及B係本發明第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 A-A剖面圖。 第63圖係用以說明第62圖A及第62圖B所示之黏 -196- 200913828 著具之使用方法的側面圖。 第64圖係黏著具之製造方法的步驟圖。 第65圖A及B係第1實施形態之黏著材膠帶圖，第 65圖A係黏著材膠帶捲繞於盤之斜視圖，第65圖A係第 65圖A之A-A剖面圖。 第66圖A及B係第1實施形態之黏著材膠帶之黏著 材形成步驟圖’第66圖A係使各黏著材膠帶重疊成一體 且將一方之基材捲取至捲取用盤之步驟的槪略圖，第66 圖B係第6 6圖A之黏著劑間之重疊部份的剖面圖。 第6 7圖係黏著裝置在被覆體上形成黏著劑之步驟的 槪略圖。 第6 8圖係捲繞著黏著材膠帶之盤之斜視圖。 第6 9圖A係第2實施形態之黏著材膠帶之黏著材形 成步驟的剖面圖，第69圖B係應用第69圖A之黏著材實 施電路基板間之黏著的剖面圖。 第70圖係本發明之2層構成向異導電材膠帶之供應 形態的模式圖。 第71圖係本發明之3層構成向異導電材膠帶之供應 形％的模式圖。 【主要元件對照表】 1 黏著材膠帶 2 捲部 2a 捲部 197- 200913828 2b 黏著材膠帶盤 2c 黏著材膠帶盤 3 ώη. 盤 3 a 盤 5 捲軸 7 側板 7a 側板 7b 側板 8 蓋體構件 9 基材 9 a 基材 9b 基材 10 乾燥齊!1 11 膜狀黏著劑 11a 黏著劑 lib 黏著劑 12 收容部 13 導電粒子 15 黏著裝置 16 導引件 17 捲取盤 19 加熱加壓頭 2 1 電路基板 2 1a 電極 -198 - 200913828 22 導引銷 23 配線電路 23a 電極 24 聚四氟乙烯材 25 捲出機 26 PDP 27 塗布機 28 結束標記 29 乾燥爐 3 0 終端部 3 1 捲取機 32 始而部 33 切割機 34 重疊部份 35 縫隙 36 工作台 4 1 連結膠帶 43 黏著劑 44 凹凸 46 卡止銷 47 卡止構件 48 爪部 49 爪部 50 彈性構件 -199 200913828 5 1 爪 5 3 夾子 55 夾持片 5 6 模具 5 7 模具 58 凹凸 5 9 貫通孔 60 矽黏著膠帶 6 1 矽黏著膠帶 62 矽黏著劑 63 基材 64 樹脂製黏著劑 65 充塡機 66 加熱器 67 連結膠帶 68 切口部份 69 標記 70 標記 7 1 發光部 72 受光部 74 連接部份 75 切口 76 卡止具 77 厚度檢測感測器 -200 200913828 78 支 持 膜 79 控 制 裝 置 80 黏 著 劑 層 8 1 半 導 體 用 黏 著 膜 82 半 導 體 元 件 83 引 線 框 架 84 密 封 材 85 焊 絲 86 匯 流 排 條 87 冲 切 模 具 88 引 線 框 架 搬 運 部 89 黏 著 材 膠 帶 冲 切 貼 附部 90 加 熱 器 部 9 1 黏 著 材 膠 帶 jftn. 盤 92 黏 著 材 膠 帶 93 黏 著 材 膠 帶 捲 出 滾 輪 94 黏 著 材 膠 帶 95 公 模 96 母 模 97 膜 壓 板 98 縫 隙 99 殼 體 99a 半 殼 體 99b 半殼體 200913828 100 黏著劑膠帶盒 10 1 導引件 102 縫隙 103 凝聚力降低線 104 工作台 1 05 放電機 106 拉出口 107 軸 108 蓋帽 110 被嵌合部 111 黏著具 113 開口部 114 加熱構件 115 電熱板 116 齒輪 117 齒輪 118 齒輪單元 119 第三殼體 120 電源開關 12 1 rftru 盤Further, in recent years, in order to prevent the warpage and stretching of the connected body, it is required to lower the connection temperature at the time of connection to the different conductive material. In addition, with the expansion of the use of the conductive material, the expansion of the liquid crystal panel, the PDP panel 'EL-168-200913828 panel, and the bare chip package, etc., the short-term requirements for the operation time at the time of connection are required. It is getting stronger and stronger. Further, with the need for connection to a different-conductive material and the expansion of its use, it is required to improve the productivity without requiring a short-term connection. Since the demand for liquid crystal panels, PDP panels, EL panels, and bare chip packages has increased, the amount of use of the conductive material has also increased. On the other hand, with the expansion of large screens such as liquid crystal panels and large-screen panels such as PDP panels, the amount of use for one panel of a different conductive material has also increased. Conventionally, the supply of the electrically conductive material has been carried out by superimposing a film-like adhesive on a disk shape having a circular core shape, and the replacement time of the disk hinders the improvement of productivity. On the other hand, with the thinning of the liquid crystal panel, the development of the dissimilar conductive material is also narrowed. 'Traditionally wound in the same round core shape is prone to coiling and scattering, which leads to the scrap rate of the manufacturing steps. Deterioration. In view of the above disadvantages, the object of the invention described in the claims 6-7 to 7 is to provide a tape for the electrically conductive material, which can extend the interval of replacement of the disk and avoid the disorder of the winding. The workability is lowered, and the productivity is improved. Next, an embodiment of the invention described in claims 67 to 72 will be described. Fig. 70 is a schematic view showing a first embodiment of the invention described in the claims 67 to 72. As shown in Fig. 70, the dissimilar conductive material tape of the present embodiment is a cross-conductive material composed of a two-layer structure of a film-like adhesive Π and a base film (substrate) 9 subjected to release treatment on both sides. In the longitudinal direction of the core material 5, it is rolled in a multi-volume manner, and the 70th is a supply form to the electrically conductive material. In Fig. 70, the rain plated ends of the core material 5 are respectively provided with side plates 7. Further, the dissimilar conductive tape is composed of the base film 9 and the film-like adhesive 1 1 applied to the base film 9 to the different-conductive material, and the conductive tape is applied to the high-definition material. In order to prevent foreign matter and contamination of inorganic and organic substances, the base film 9 is located on the outer side of the adhesive. The use of a connection to a different electrically conductive material requires a shortened working time and requires rapid transcription to the electrically conductive material. As described above, the multi-corrugated material is laminated in the longitudinal direction of the core material (reel) 5 with the side plates 7 in a multi-volume manner to provide a rectangular cross-conducting which does not cause winding and scattering. material. Therefore, it is possible to increase the interval between the replacement time of the different conductive material tapes and improve the productivity. In the case of the above-mentioned conductive material tape, the tensile strength of the base film 9 should be 12 kg/mm2 or more, and the fracture stretch of the base film 9 should be 60 to 200%. Therefore, the base film 9 has a small strength and a small stretch, and prevents the film-like adhesive 1 1 from stretching during the process of transcribed the film-like adhesive 11 constituting the different-conductive material to a connecting member such as a circuit board. The thickness is thinner and the width is thinner. Further, the thickness of the base film 9 should be 1 Torr or less from the viewpoint of handling and environmental protection. Since the substrate film 9 is too thin to cause deterioration of the above effects, the thickness of the substrate film 9 should be 〇. 5 /2 m or more. Next, the base film 9 used for the above-mentioned conductive adhesive tape should be PP (polypropylene) which has been subjected to bismuth and fluorine peeling treatment from the viewpoint of strength and peeling property of the adhesive to the different conductive material. , OPP (extended poly-170-200913828 propylene), and PET (polyethylene terephthalate), etc., however, it is not limited thereto. The release treatment of the base film 9 can be carried out by treatment with hydrazine or fluorine. When the release treatment is performed on only one side of the base film 9, the surface and the back surface of the base film 9 can have different release properties. The back side of the substrate film 9 is prevented from being transcribed. Further, when the both surfaces of the base film 9 are subjected to the release treatment, the surface of the film-like adhesive 1 1 is subjected to a ruthenium treatment and a fluorine treatment to impart a peeling property to the surface of the film-like adhesive 11 . The film-like adhesive 1 1 is an epoxy resin based on a thermosetting resin having high reliability, a resin having a good adhesive compatibility for the purpose of reducing the stress of the adhesive, and the like. The attached radicals are carried out at a low temperature and for a short period of time, however, the film-like adhesive is not limited thereto. The free radical adhesive 1 1 is mainly composed of an acrylic adhesive. Fig. 71 is a schematic view showing a second embodiment of the invention described in the claims 67 to 72. In the seventh embodiment, the same components as those in the seventh embodiment will be denoted by the same reference numerals and will not be described in detail. As shown in Fig. 71, the dissimilar conductive material tape of the present embodiment has two types of base material films, and the other configuration and the first embodiment are the same except that the conductive material is sandwiched between the substrate molds. The shape of the different conductor tape is the same. That is, as shown in Fig. 7 , the conductive material of the present embodiment is composed of a film-like adhesive 1 1 and three layers of two kinds of substrates 9a and 9b which have been subjected to a release treatment on the surface of the adhesive 1 1 . Constructed by structure. When the adhesive constituting the electrically conductive material is relatively soft, the substrate film shown in the following paragraph -171 - 200913828 can be used to prevent the adhesive from being deformed. Next, on the physical properties of the substrate films 9a, 9b, the tensile strength of the substrate films 9a, 9b should be 1. The reason why the fracture elongation of the base film 9a, 9b is 60 to 200% is 2 kg/mm2 or more, and is the same as in the first embodiment. In this manner, the base film 9a, 9b can obtain physical strength, and can prevent filming due to stretching of the film-like adhesive and narrowing in the width direction. Further, the thickness of the base materials 9a and 9b should be 100 or less, so that there is a good correspondence between operation and environmental protection. Further, in the first and second embodiments, when the film-like adhesive 1 1 which is a conductive material is non-adhesive and does not cause clogging, the substrate-free film 9 or 9a, 9b can be used. In the state, the film adhesive 1 1 is wound into a coil shape alone. The following description is directed to the examples, however, the invention described in the claims 67 to 72 is not limited to these examples. (Example 1) (1) Preparation of a film of an isoelectric material A 30% by weight solution of ethyl acetate was prepared, and Ni powder having an average particle diameter of 2·5 μm and a volume of 5 was added thereto. Next, 50 g of a phenoxy resin (high molecular weight epoxy resin) as a film-forming material, 2 g of an epoxy resin, and 5 g of an imidazole were added to the above-mentioned ethyl acetate solution to obtain a solution for forming an adhesive. On the other hand, it is prepared to be carried out on both sides of a polyethylene terephthalate film (breaking strength of 25 kg/mm2 and fracture stretch of 130%) which is transparent to light blue and has a thickness of 5 Å #m. The substrate film to be treated. Next, -172-200913828, the solution was applied by a roll coater on one side of the base film, and dried at 110 ° C for 5 minutes to obtain a wound of a conductive material film having a thickness of 50 μm. (2) Fabrication of a different conductive material tape The above-mentioned winding material of the opposite conductive material film was cut into a width of 1. 5 mm was laminated in the longitudinal direction of a core material (reel) having a side plate having a diameter of 48 mm and a width of 100 mm in a multi-volume manner to obtain a tape of a different conductivity of 300 m. This is wound into a coil-shaped conductive material, that is, when the conductive material tape is attached to the isoconductive material tape automatic crimping machine and supplied to the different conductive material, the transcription to the different conductive material is performed. Good results have been obtained in the sex and stretch tests, and the number of times of setting the disk, the time required for mounting, and the repetition of the attaching operation caused by the transcription and the stretching of the adhesive are prevented, and these effects can improve productivity. (Example 2) A roll of the same conductive material tape as in Example 1 was produced. Next, another type of polyethylene terephthalate base film having a thickness of 25 #m is laminated on the laminate of the base film and the adhesive by sandwiching the adhesive with the two base film. The strength is 25 kg/mm2, and the elongation at break is 130%.] A roll of a three-layer structure of a dissimilar conductive film is obtained. Next, the same as in the first embodiment, the film roll was cut into a width of 1. 5mm, and it is taken up to a core material (reel) with a side plate diameter of 48mm and a width of 100mm. -173- 200913828 is a coiled wire, and a 300 mm length of dissimilar conductive tape is obtained. Also in Example 2, as in Example 1, good productivity was obtained. (Example 3) A polytetrafluoroethylene film having a thickness of 50 " m was used except for the base film (the breaking strength was 4. In the same manner as in Example 1, except that 6 kg/mm 2 and the elongation at break were 305 %), the winding of the film of the isoconductive material was obtained, and the winding of the film was cut into a width K. 5 mm, which was wound around a core material (reel) having a diameter of 48 mm and a width of 10 mm, which was attached to a side plate, and which was wound in a line shape, and obtained a tape of a dissimilar conductive material having a length of 300 m. At this time, it is also possible to wind a length of 300 m. (Comparative Example 1) A wound material of the same conductive material film as in Example 1 was obtained, and in the same manner as in Example 1, the wound material of the film was cut into a width of 1. 5mm, wound into the traditional disk in the same round core, and the tape of 100m length is obtained. When the tape is wound into a coil-shaped conductive material tape to the isoconductive tape automatic crimping machine and supplied to the isoelectric material, the transcription and stretching tests to the isoelectric material are good, however, The number of times the disk is installed is three times that of the embodiment, and the installation time and the adjustment time are increased. The industrial utilization possibilities of the present invention are as follows. As described above, when the invention described in the first paragraph of the patent application is used, the adhesive portion of the adhesive tape is used to adhere the entire end of the adhesive-174-200913828 material tape (adhesive tape of one side), And the newly-installed adhesive tape (the other side of the adhesive tape) at the beginning of the implementation of the adhesive plate replacement, it is very simple to put the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the operation of mounting the beginning of the new adhesive tape on the take-up reel, and the setting of the guide pin in a specific path, only The new adhesive plate can be replaced in less time, which can increase the production efficiency of the electronic machine. Since one of the adhesive tapes and the other adhesive tape are adhered by overlapping adhesive faces, there is a high connection strength. In the case of the invention described in the second paragraph of the patent application, in addition to the effects similar to those of the invention described in the first aspect of the patent application, the cutting of the entire adhesive tape is performed when the end mark is exposed, and the cutting is performed. The part that performs the joining operation is easy to unravel and the connection can be performed with the minimum necessary position, and the waste of the adhesive tape can be prevented. When the invention described in the third paragraph of the patent application is applied, the effect of the invention described in the first aspect of the patent application is the same, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. In addition, since the end portion of the adhesive tape which is completely unwound and the beginning end of the newly attached adhesive tape are adhered by the adhesive tape before the adhesive tape, the adhesion between the adhesive tapes can be easily performed. When the invention described in the fourth aspect of the patent application is applied, the same effect as the invention described in the first application of the patent application can be obtained. The new adhesive tape can be attached to the adhesive device in a simple manner, and only a small amount of time is required. Can be more -175- 200913828 Replace the new adhesive plate, so it can improve the production efficiency of electronic machines. In addition, since the adhesive tape is not required to be folded back, the adhesive tape can be taken up to the take-up reel to prevent possible winding up. When the invention described in the fifth paragraph of the patent application is used, the connection between the terminal portion of the adhesive tape and the newly-installed adhesive tape is fixed by the card pin, so that the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. According to the invention described in claim 6, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and thereafter, the other claw portion of the locking member is engaged. At the beginning of the adhesive tape on the other side, the two are connected to each other, so the connection is very easy. Since there is an elastic member between the claw portion of one of the claws and the claw portion of the other, the elastic member can be stretched so that the other claw portion of the locking member is locked at any position of the beginning end portion of the other adhesive tape. Therefore, the connection has a high degree of freedom. In addition, the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side are connected in a state of abutting each other, and the overlapping tape is not required. The connection can be performed at the minimum necessary position, and the adhesive tape can be prevented. waste. When the invention described in claim 7 is used, it is only necessary to connect the terminal portion of the adhesive tape on one side of the clip and the overlapping portion of the other end of the adhesive tape -176-200913828, and the connection operation is easy. . According to the invention described in the eighth aspect of the invention, the holding pieces are flattened from both sides of the overlapping portion to join the two, and the joint strength of the overlapping portion of the adhesive tape can be improved. When the invention described in claim 9 is applied, the adhesive portion of the adhesive tape is adhered to the end portion of the used adhesive tape and the beginning portion of the newly attached adhesive tape. Replacement, it is very simple to put the new adhesive plate to the adhesive device. Moreover, since it is not necessary to replace the winding disc of the substrate every time the new adhesive sheet is replaced, and the beginning of the new adhesive material is attached to the take-up reel, it takes only a small time to replace the new adhesive disc, so Improve manufacturing efficiency. When the invention described in the first aspect of the invention is applied, the end portion of the adhesive tape and the beginning of the other adhesive tape are mutually in addition to the same effects as the invention described in claim 9 A hook-like snap is formed, and the two are connected to each other with an adhesive surface, so that the joint strength is high. When the invention described in the first paragraph of the patent application is applied, the end portion of the end portion of the adhesive tape is attached to the end portion of the adhesive tape of the first application, and the connection is performed. Part of the job is easy to unravel and prevent the waste of adhesive tape. In addition to the effects of the invention described in any one of claims 9 to 11, the invention has the same effect as the invention described in any one of claims 9 to 11. At the same time, the strength of the stretching direction of the adhesive tape of the joint portion (longitudinal -177-200913828) can be increased. When the invention described in claim 13 is the same as the invention described in any one of the items 9 to 11 of the patent application, the connecting portion forms a through hole and a through hole. The inner edge will have an adhesive oozing, which can increase the adhesive area of the adhesive and further increase the joint strength. When the invention described in claim 14 is used, it is only necessary to connect the worn adhesive knee strap (one adhesive tape) and the new adhesive tape (the other adhesive tape) to replace the disc. Therefore, it is very simple to put the new adhesive plate to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the adhesive tape is installed on the guide member, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The treatment agent used for the treatment of the adhesive tape is a lanthanum resin, and the adhesive tape is also a ruthenium adhesive, which can reduce the surface tension difference between the two to improve the adhesion, so that it is practically difficult to achieve both. Sticky. When the invention described in the fifteenth aspect of the patent application is used, the surface tension of the adhesive surface of the adhesive tape and the treatment of the substrate of the adhesive tape are treated in addition to the same effects as the invention described in claim 14 of the patent application. When the difference in surface tension is 10 mN/m (10 dyne/cm) or less, a strong force can be obtained, and both can be surely adhered. In the case of the invention described in the fifteenth aspect of the patent application, in addition to the effect similar to the invention described in claim 15 of the patent application, the adhesion is -1 g/2 5 mm or more due to -178-200913828. The adhesion between the two adhesive faces of the adhesive tape of one side and the other is stronger. When the invention described in claim 17 is used, it has the same effect as the invention described in claim 16 of the patent application, and the adhesive tape of one side and the other is connected by both sides, so that it can be made stronger. The connection. In the case of the invention described in claim 18, since the adhesive tape of the double-sided adhesive is used, the adhesive tape of the two sides is sandwiched between the adhesive tape of one of the other and the adhesive tape of the other (or Closely, so the connection between the two is very simple and easy. When the invention described in claim 19 is used, since the end portion of the adhesive tape which has been completely rolled out and the beginning end portion of the newly attached adhesive tape are fixed by a paste-like resin adhesive, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. When the invention described in claim 20 is the same as the invention described in claim 19, the resin-based adhesive can be made of a thermosetting resin, a photocurable resin, and In the group of hot metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected, so that the joint strength between the adhesive tapes can be improved. When the invention described in the second paragraph of the patent application is applied, the filling device for supplying the resin-179-200913828 adhesive described in the No. 19 or 20 of the patent application scope is disposed in the adhesive device, and there is no need to separately prepare the charging device. Machine, it can prevent the waste of connection work. When the invention described in claim 2nd is used, when the adhesive tape wound around one of the rolls is completely unwound, the adhesive tape wound around the adjacent roll is attached to the take-up reel. The replacement of the adhesive tape is used because there is no need to load the new adhesive tape onto the adhesive device. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved. In the case of the invention described in the second paragraph of the patent application, in addition to the effect similar to the invention described in claim 22, the end portion of the adhesive tape and the other adhesive material are joined by a connecting tape. Since the adhesive tape of the adhesive tape of one of the adhesive tapes is completely unwound, the adhesive tape of the other roll portion is not required to be attached to the disk, so that the production efficiency of the electronic device can be further improved. When the invention described in claim 24 is used, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive tape is sequentially unwound from the next roll. . Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. When the invention described in claim 25 is applied, the connection portion of the end portion of the adhesive tape of one of the adhesive tapes and the other end portion of the adhesive tape is covered by the adhesive tape, so that the appearance is good. At the same time, it can prevent the contact part of the card from contacting the adhesive tape and causing damage to the adhesive tape-180- 200913828 tape or adhesive device. When the invention described in claim 26 is used, the connecting portion detecting means detects that the connecting portion 'to the connecting portion passes through the pressing portion, and the one of the adhesive tapes is taken up to the take-up reel to prevent the connection. The problem of pressing the part when it reaches the pressing part. Further, since the connecting portion passes through the pressing portion, since one of the adhesive tapes is automatically taken up to the take-up reel, the trouble of winding can be omitted. When the invention described in claim 27 is used, the detection of the joint portion can be performed with a simple configuration, in addition to the same effects as those of the invention described in claim 26, and these means can be utilized. To improve detection accuracy. When the invention described in claim 29 is used, since a plurality of adhesives can be used one by one, the amount of the adhesive which can be used in one disk can be increased to a conventional one without increasing the number of tapes. More than 2 times. Since the number of rolls is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to adhesion of the adhesive tape from the width direction of the tape, and also to prevent the tape from being formed. The substrate is long and prone to stretching and other disadvantages (damage or breakage of the substrate). Since the manufacturing unit of the electronic component can reduce the number of replacement of the new adhesive tape, the work efficiency can be improved. Further, in the manufacture of the adhesive tape, since the number of the manufactured disks can be reduced, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. In the case of the invention described in claim 30, in addition to the effects similar to those of the invention described in claim 29, -181 - 200913828 is easily separated by the adjacent adhesive strips. Separate strips can be implemented to make pressing on the circuit board easier. When the invention described in the third paragraph of the patent application is applied, in addition to the same effect as the item 29 of the patent application, it is only necessary to form a slit on the adhesive applied to the entire surface of the substrate. It is easy, and the gap between adjacent adhesive strips is small, so that the number of adhesive strips disposed on the substrate can be increased. When the invention described in the third paragraph of the patent application is applied, it is easy to manufacture the adhesive tape described in claim 30 of the patent application. When the invention described in the third paragraph of the patent application is applied, since two adhesive tapes can be simultaneously produced, it has good manufacturing efficiency. When the invention described in claim 4 is applied, heating of a part of the adhesive is performed to reduce the cohesive force of the portion and press it to the circuit substrate', and the adhesive tape is used on one side of the substrate. Adhesive tape can be made directly from existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating area, so that the adhesive width of the pressing has a high degree of freedom. It is the same as the invention described in claim 29, because the adhesive on the substrate is heated and pressed to the circuit substrate one by one, and one plate can be used without increasing the number of tapes. The dose is increased by more than 2 times. Since the adhesive amount can be increased without increasing the number of rolls, it is the same as the invention described in claim 29, which prevents the coiling from being scattered, and at the same time prevents the clogging due to the oozing of the adhesive and the stretching of the substrate. The drawbacks. When the invention described in claim 35 is used, 'because the width of the adhesive tape has a length of one or more sides of the circuit board', the amount of the adhesive can be increased and the number of the adhesive tape can be reduced. Since the amount of the adhesive tape can be increased without increasing the number of adhesive tapes, the coiling can be prevented from being scattered, and at the same time, the clogging, damage or breakage of the substrate can be prevented. Further, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. Further, in the manufacture of the adhesive tape, since the amount of the adhesive per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in the Patent Application No. 36 is applied, the adhesive sticks are separated from each other except for the same effect as the invention described in claim 35, and it is easy to remove the adhesive one by one. The substrate is peeled off and pressed. When the invention described in the Patent Application No. 37 is used, the number of the adhesive strips disposed on the substrate can be increased and the manufacturing can be made easier, in addition to the same effect as the third item of the patent application. When the invention described in the third paragraph of the patent application is applied, since the adhesive tape described in the sixty-sixth patent application scope can be simultaneously manufactured by using the existing equipment, it has good manufacturing efficiency. When the invention described in claim 39 is applied, the adhesive can be simply pressed to the circuit substrate in addition to the effects described in any one of claims 35 to 37. One side can improve the working efficiency of the manufacturing plant of the electronic component. In the case of the invention described in claim 40, in addition to the effects described in Items 35 to 37 of the patent application, it is not necessary to rotate the circuit board ', and only one of the adhesive tapes and one of the adhesive tapes are removed. The position of the adhesive tape on the other side makes it easy to press the adhesive onto the periphery of the circuit board, so that it has good work efficiency. According to the invention described in the fourth aspect of the patent application, when the adhesive is pressed around the circuit board, the adhesive tape is heated and pressurized in the width direction, and the adhesive can be easily pressed. To the circuit board, and have good work efficiency. Moreover, since it is only necessary to apply the adhesive to the adhesive tape in its entirety, it is possible to directly manufacture the adhesive tape using the existing equipment. Further, the width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressed adhesive has a degree of freedom. Moreover, the invention is the same as the invention described in claim 35, because the amount of the adhesive is increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive can be prevented, and Prevents the effects of defects such as stretching of the substrate. When applying the invention described in the 42nd paragraph, at least two adhesives disposed in the width direction of the adhesive sheet are used one by one, and at least two discs can be used per one tray, without increasing the number of adhesive tape rolls. , you can greatly increase the amount of adhesive that can be used in one set. Moreover, since the number of the adhesive tape is not increased, the winding can be prevented from being scattered, and at the same time, the adhesive can be prevented from clogging due to the adhesive tape being oozing out from the width direction of the tape -184-200913828 In addition, it is also possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or breakage of the substrate). Because the adhesive tape is in the form of a box, it is not necessary to implement the complicated operation of attaching the adhesive tape to the tray, and it is easier to handle the cartridge as long as the cartridge is attached to the adhesive device, and has a good installation. And the replacement workability. When the invention described in the fourth paragraph of the patent application is applied, the adjacent adhesive strips are separated except for the same effects as the invention described in claim 4, and it is easy to separate. The substrate is pulled away from the adhesive one by one and pressed. When the invention described in claim 44 is applied, the adhesive tape only needs to be completely coated on one side of the substrate and form a slit, in addition to the same effect as the application of the patent application. easily. When the invention described in the Patent Application No. 45 is used, it is only necessary to apply the adhesive to the entire substrate as the adhesive tape, so that the adhesive tape can be directly produced by using the existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressing region, so that the adhesive width of the pressing has a high degree of freedom. When the invention described in claim 46 is used, 'except for the same effect as the item 45 of the patent application scope', the invention described in the first paragraph of the patent application scope is the same as the invention described in claim 1, because the number of windings is increased without increasing the number of rolls - 185- 200913828 The dose is taken to prevent the coiling from being scattered, and at the same time, it is possible to prevent the clogging caused by the oozing of the adhesive and to prevent the disadvantage caused by the stretching of the substrate. When using, when all the ones are rolled out, you only need to reverse the box, so it is very easy to install the next time. Due to the box form, it is easier to handle and has good installation and replacement workability. When the invention described in claim 47 is applied, the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are adhered to the substrate of the adhesive tape to carry out the adhesive sheet. Replacement, it is very simple to put the new adhesive plate to the adhesive device. Moreover, it is not necessary to replace the take-up reel when replacing the new adhesive sheet, and to install the new adhesive sheet at the beginning of the new adhesive tray to the take-up reel, and it takes only a small time to replace the new adhesive disc, thereby improving Production efficiency of electronic machines. When the invention described in the 48th application of the patent application has the same effect as the invention described in claim 47, since the hot melt layer is located on the surface of the substrate, the adhesive surface at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. When the invention described in the 49th application of the patent application has the same effect as the invention described in claim 47, the hot melt layer is prevented from being exposed to the hot melt layer by being sandwiched between the support layers. Under the atmosphere, it is possible to prevent moisture from adhering to moisture or dust, and the adhesion strength of the hot melt layer is lowered. -186- 200913828 When using the invention described in claim 50, the surface of the substrate is removed by the release agent, and the adhesive tape of the adhesive tape is adhered to the adhesive tape. The end portion of the adhesive tape and the newly-installed adhesive tape are used to replace the adhesive disc, so that the new adhesive disc can be attached to the adhesive device. In the case of the invention described in the fifth paragraph of the patent application, the plasma discharge, the ultraviolet irradiation, and the laser irradiation are used in addition to the effects similar to those of the invention described in the fifth aspect of the patent application. By removing the release agent, the release agent can be removed correctly in a short time. In the invention described in claim 52, since the adhesive tape is provided with a plurality of roll portions (rolled portions) of the adhesive tape on which the adhesive tape is wound on the disk, among the plurality of rolls, When the adhesive tape of one roll is completely unwound, the roll portion of the other roll portion which is adjacently disposed and used is rolled up, since it is not necessary to put the new adhesive tape on the adhesive device, The replacement operation of the new adhesive tape is less, so the production efficiency of the electronic machine can be improved. Further, since the plurality of adhesive tapes are sequentially used, it is possible to greatly increase the amount of adhesive which can be used for one replacement operation without increasing the number of rolls of the adhesive tape of one adhesive tape. 'Because there is no need to increase the number of rolls of adhesive tape, it can prevent the coiling from being scattered. At the same time, it can prevent the adhesive from oozing out from the width direction of the tape and sticking between the adhesive tapes that have been taken up, that is, it can be prevented. It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. In the case of the invention described in the fifth paragraph of the patent application, the accommodating portion of the desiccant is disposed on the side plate of the disk, and the same effect as the invention described in the fifth aspect of the patent application- 187-200913828 is applied.尙 The moisture in the adhesive tape tray can be removed from the inside, so that the adhesive tape can be further prevented from deteriorating due to moisture absorption. When the invention described in claim 5 is applied, the cover member covering the periphery of the adhesive tape wound around the disk is detachably attached to the disk, and the adhesive tape is not directly Exposure to the atmosphere's can prevent dust or atmospheric moisture from adversely affecting the adhesive tape. Therefore, even when a plurality of rolls are provided, the cover member is disposed on the unused roll portion, and the quality of the adhesive tape can be prevented from being lowered. Moreover, since the cover member is detachably attached, the adhesive member tape can be simply unwound from the adhesive tape by removing the cover member, and when the invention described in claim 55 is used, In addition to the same effect as the invention described in any one of claims 52 to 54, since the adhesive tape can be unwound from the pull-out opening of the cover member, it is not necessary to remove the adhesive tape tray. The cover member can directly roll the adhesive tape from the adhesive tape. In addition to the effects of the invention described in any one of claims 5 to 5, the side plate of the roll portion is freely detachable. When the adhesive tapes of the one side of the roll are all rolled out, and the other part of the roll is unwound, the adhesive tape can be rolled out from the next roll in order, and the patent application scope is utilized. In the case of the invention described in the paragraphs 5 to 5, the invention has the same effect as the invention described in any one of the items of the inventions of the inventions of the present invention, in particular, the adhesive tape is to be used for connection. Adhesive tape and adhesive tape coated on the substrate by an electrode for electrode connection are a support substrate for fixing a lead frame, a semiconductor element, a wafer, and a semiconductor This is especially useful when attaching adhesive tape to components. In the invention described in the ninth aspect of the invention, the housing is held in one hand, the opening of the adhesive tape is exposed to press against the circuit board, and the heating member is heated and pressed from the substrate side to press the adhesive. It is very small and can be operated with one hand, and it is easy to press the adhesive to a part of the substrate. When the invention described in claim 60 is used, since the base material of the adhesive knee band is a metal film or an aromatic polyamide film, even when the thickness of the substrate is thin, the substrate can be prevented from being stretched or broken. The problem. Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, when the adhesive tape of the present invention is used, since the number of rolls per disk can be increased, the manufacturing facility of the electronic component only needs to perform a small number of replacements of the new adhesive tape, so that work efficiency can be improved. Secondly, in the manufacture of the adhesive tape, the number of manufactured disks can be reduced, and the amount of the disk and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in the sixth paragraph of the patent application is applied, in addition to the effects similar to those of the invention described in claim 60, a thin and high tensile strength adhesive tape can be obtained. -189- 200913828 When the invention described in claim 62 is used, the tensile strength of the substrate is 300 MPa or more, which is less likely to occur, except for the same effect as the invention described in claim 60 or 61. The problem of stretching or breaking the substrate. When the invention described in claim 63 is used, it has the same effect as the invention described in any one of claims 60 to 62, because the thickness ratio of the substrate to the adhesive is 0. 0 1~1. 0 ′ In addition, 尙 can obtain a thin and high tensile strength adhesive tape. When the invention described in the sixth paragraph of the patent application is applied, the surface roughness Rmax of the substrate is 〇 except that it has the same effect as the invention described in any one of claims 60 to 63. Below 5 // m, the surface of the substrate is very smooth, and when the adhesive is pressed against the circuit board, the adhesive is easily separated from the substrate. When the invention described in claim 65 is applied, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are superimposed one step before the adhesive is formed on the covering to obtain a desired adhesive. After the thickness of the agent, the adhesive is formed on the covering, so the thickness of each adhesive tape is thin. Although the number of the adhesive tape is increased, the winding diameter of the adhesive tape per one disk is smaller. Therefore, the number of rolls of the adhesive tape per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the productivity of the electronic machine can be improved. When the invention described in the sixth paragraph of the patent application is applied, the number of the adhesive tape which requires low temperature management can be reduced, in addition to the effects of the invention described in the -190 - 200913828 and the scope of the patent application, the adhesive tape. Transportation and storage can implement more efficient management. When the invention described in any one of the items 67 to 72 of the patent application is used, since the member to be connected has good transcription property (adhesiveness) and good connection reliability, and the scrap rate in the improvement step, In the case of improving the workability, the conventional rectangular-oriented conductive tape is provided, so that productivity and workability can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the connection between the adhesive sheets in the method of joining the adhesive tapes of the first embodiment. Fig. 2A and Fig. 2B are oblique views of the connecting step of the connecting portion of Fig. 1. Fig. 3 is a schematic view showing the step of pressing the adhesive of the adhesive device. Fig. 4 is a cross-sectional view showing adhesion between circuit boards. Figure 5 is a step diagram of a method of manufacturing an adhesive tape. Fig. 6 is a perspective view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 7 is a perspective view showing a method of connecting an adhesive tape according to a modification of the second embodiment of the present invention. 8A to C are views showing a method of connecting an adhesive tape according to a first embodiment, Fig. 8A is a perspective view showing a connection between the adhesive sheets, and Fig. 8B is a connection method of a connecting portion of Fig. 8A. Oblique view, Fig. 8C is a plan view of the connecting portion of Fig. A from page -191 - 200913828. Fig. 9 is a cross-sectional view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 10 is a cross-sectional view showing a method of joining an adhesive tape according to a third embodiment of the present invention. Fig. 1 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. Fig. 2 is a perspective view showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 2 is a perspective view showing a connection between the adhesive sheets, and Fig. 2B is a connection portion of Fig. 2A. An oblique view of the connection method. Fig. 3 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Figs. 14A and 14B are cross-sectional views showing a method of connecting an adhesive tape according to a third embodiment of the present invention, wherein Fig. 14A is a state before heating and pressurization, and Fig. 4B is after heating and pressurization. State. Fig. 15 is a cross-sectional view showing a method of connecting an adhesive tape according to a fourth embodiment of the present invention, and Fig. 15B is a plan view. Fig. 16 is a perspective view showing the connection between the adhesive sheets of the first embodiment, and Fig. 16 is a perspective view showing the connection between the adhesive sheets, and Fig. 6 is a diagram of Fig. 6 An oblique view of the connecting portion (b). Fig. 17 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Fig. 18 is a cross-sectional view showing the method of attaching the adhesive tape of the third embodiment of the present invention to -192 - 200913828. Fig. 19 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. Fig. 20A to Fig. C are diagrams showing the connection method of the adhesive tape of the first embodiment. Fig. 20A is a perspective view showing the connection between the adhesive sheets, and the connection portion of the second drawing b and the second drawing of Fig. 2A. A cross-sectional view of the connection method. Figure 21 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 22A to Fig. C are diagrams showing the adhesive tape of the third embodiment, Fig. 22A is a perspective view of the adhesive tape tray, and Fig. 22b is the front view of Fig. 22A. Figure 2 is a plan view of the adhesive tape of Figure A. Figure 23 is a schematic view of the adhesive pressing step of the adhesive device. Figure 24 is a plan view of a connecting tape according to a second embodiment of the present invention. Figure 25 is a plan view of a connecting tape according to a third embodiment of the present invention. Fig. 26 is a perspective view of a tape of an adhesive tape according to a fourth embodiment of the present invention. . 27A to C are the adhesive tape disk diagrams of the first embodiment, and Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is a front view of Fig. 27, and Fig. 27C is the 27 is a cross-sectional view of the connecting portion of Fig. A. Fig. 28 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 29 is a perspective view showing the state of use of the adhesive of the PDP. -193 - 200913828 Figure 30 is a perspective view of the adhesive tape tray of the second embodiment of the present invention. Figure 31 is a cross-sectional view showing an adhesive tape of the adhesive tape of the adhesive tape of the present invention applied to a semiconductor device of the LOC structure, and Figure 31B is an adhesive tape of the adhesive tape of the present invention. A cross-sectional view of a semiconductor device of the LOC structure applied to a semiconductor device of the LOC structure. Fig. 3 2A to Fig. 4C are schematic views showing the application of the adhesive device for the adhesive tape tray of the present invention, Fig. 3 is a front view, Fig. 3 2 is a side view, and Fig. 3 2 is a third. An enlarged view of an important part of the adhesive tape punching and attaching portion 8 of Fig. B is shown. Fig. 33A and Fig. B are adhesive tape patterns, Fig. 33A is a perspective view of a disk around which an adhesive tape is wound, and Fig. 3B is a sectional view of A-A of Fig. 3A. Figure 34 is a perspective view showing the state of use of the adhesive of the PDP. Fig. 5 is a cross-sectional view showing a step of applying an adhesive to a substrate. Fig. 3 is a cross-sectional view showing an adhesive tape according to a second embodiment of the present invention. Figs. 37A to 37C are process diagrams showing an adhesive tape and a method of pressing the same according to a third embodiment of the present invention. Fig. 3A is a flow chart showing a method of producing an adhesive tape according to a fourth embodiment of the present invention. Fig. 39 Fig. A and Fig. B are adhesive tape diagrams, and Fig. 39 Fig. A is a perspective view of a disk wrapped with adhesive tape. Fig. 39 Fig. B is from the side of the adhesive - 194- 200913828 See Fig. 39 A plan view of the adhesive tape of A. Figure 40 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 4 is a schematic view showing an adhesive pressing step of the adhesive device according to the second embodiment of the present invention. 42A to C are cross-sectional views showing an adhesive tape according to a third embodiment of the present invention. Fig. 43 is a flow chart showing the steps of the adhesive tape and the method of pressing the same according to the fourth embodiment of the present invention. Fig. 44 is a flow chart showing a method of producing an adhesive tape according to a fifth embodiment of the present invention. Fig. 45 is a perspective view of the adhesive tape cartridge according to the first embodiment of the present invention, Fig. 45A is a perspective view of the adhesive tape cartridge, and Fig. 45B is a cross-sectional view taken along line A-A of Fig. 45A. Fig. 46 is a cross-sectional view showing the mounting state of the disc cartridge of Fig. 45A. Figure 47 is a front view of the adhesive pressing step of the adhesive device. Fig. 4 is a step diagram of a method of manufacturing an adhesive tape cassette. Fig. 49 is a schematic view showing the step of adhering the adhesive to the adhesive device according to the second embodiment of the present invention. Fig. 5 is a cross-sectional view showing an adhesive tape according to a third embodiment of the present invention. Fig. 5 is a step diagram showing an adhesive tape and a method of pressing the same according to a fourth embodiment of the present invention. Fig. 5A and Fig. 2A are diagrams showing the adhesive tape of the first embodiment, and -195-200913828 5 2, Fig. A is a perspective view of the connection between the adhesive sheets, Fig. 5B, Fig. 5, Fig. 5 A cross-sectional view of the connecting part. Fig. 5 is a cross-sectional view showing the adhesive tape of the second embodiment. Fig. 54 is a sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55, Fig. 54 is a state before discharge 'Fig. 54B is a state after discharge, and Fig. 54 is a connection portion of Fig. 54 Heat the drawing. Fig. 55 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method. Figure 56 is a schematic view of the adhesive pressing step of the adhesive device. 57A to C are the adhesive tape tray diagrams of the first embodiment, and Fig. 7A is a perspective view of the adhesive tape tray, and Fig. 7B is a front view of Fig. 57, Fig. 57. Front view of the cover member of Fig. 57, Fig. A, Fig. 58 is a step view showing a method of manufacturing the adhesive tape tray. Fig. 5 is a side elevational view showing the adhesive tape tray of the second embodiment of the present invention. Fig. 60 is a front view of the adhesive tape tray and a replacement explanatory view of the adhesive tape according to the third embodiment of the present invention. Fig. 61 is a perspective view showing a side plate of a winding portion according to a fourth embodiment of the present invention. Fig. 62 is a perspective view of the first embodiment of the present invention, Fig. 62 is a perspective view of the adhesive, and Fig. 62B is a cross-sectional view taken along line A-A of Fig. 62A. Fig. 63 is a side view for explaining the method of use of the adhesive-196-200913828 shown in Figs. 62A and 62B. Fig. 64 is a step diagram of the manufacturing method of the adhesive. Fig. 65 is a perspective view of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive tape wound around the disk, and Fig. 65A is a cross-sectional view taken along line A-A of Fig. 65A. Fig. 66A and Fig. B are steps of forming an adhesive material for an adhesive tape according to a first embodiment. Fig. 66A is a step of integrally laminating the adhesive tapes and winding one of the substrates onto the winding tray. Figure 66 is a cross-sectional view of the overlap between the adhesives of Figure 66A. Fig. 6 is a schematic diagram showing the steps of the adhesive device forming an adhesive on the covering. Fig. 6 is a perspective view of the disk around which the adhesive tape is wound. Fig. 69 is a cross-sectional view showing the steps of forming the adhesive material of the adhesive tape of the second embodiment, and Fig. 69B is a cross-sectional view showing the adhesion between the circuit boards by the adhesive material of Fig. 69A. Fig. 70 is a schematic view showing a form of supply of a two-layer structure to a different-conductive conductive tape of the present invention. Fig. 71 is a schematic view showing the form % of the three-layer structure of the present invention to the isoconductive material tape. [Main component comparison table] 1 Adhesive tape 2 Roll 2a Roll 197- 200913828 2b Adhesive tape 2c Adhesive tape 3 ώη. Disc 3 a Disc 5 Reel 7 Side panel 7a Side panel 7b Side panel 8 Cover member 9 Substrate 9 a Substrate 9b Substrate 10 Drying! 1 11 Film adhesive 11a Adhesive lib Adhesive 12 Housing 13 Conductive particles 15 Adhesive Device 16 Guide member 17 Winding disk 19 Heating and pressing head 2 1 Circuit board 2 1a Electrode - 198 - 200913828 22 Guide pin 23 Wiring circuit 23a Electrode 24 Teflon material 25 Winding machine 26 PDP 27 Coater 28 End mark 29 Drying furnace 3 0 Terminal part 3 1 Coiler 32 Starting part 33 Cutting machine 34 Overlapping part 35 Slit 36 Table 4 1 Connecting tape 43 Adhesive 44 Bump 46 Locking pin 47 Locking member 48 Claw 49 Claw 50 Elastic member-199 200913828 5 1 Claw 5 3 Clamp 55 Clamping piece 5 6 Mold 5 7 Mold 58 Concavo-convex 5 9 Through-hole 60 矽 Adhesive tape 6 1 Adhesive tape 62 矽 Adhesive 63 Substrate 64 Resin Adhesive 65 Filling machine 66 Heater 67 Connecting tape 68 Cutting part 69 Marking 70 Marking 7 1 Light-emitting part 72 Light-receiving part 74 Connecting part 75 Cutting 76 Card 77 thickness detection sensor-200 200913828 78 support film 79 control device 80 adhesive layer 8 1 adhesive film for semiconductor 82 semiconductor element 83 lead frame 84 sealing material 85 welding wire 86 bus bar 87 die cutting die 88 lead frame conveying part 89 Adhesive tape punching and attaching part 90 Heater part 9 1 Adhesive tape jftn. Disk 92 Adhesive tape 93 Adhesive tape Roll-out roller 94 Adhesive tape 95 Male mold 96 Female mold 97 Membrane pressure plate 98 Gap 99 Housing 99a Half-shell 99b Half-shell 200913828 100 Adhesive tape cartridge 10 1 Guide 102 Slot 103 Cohesion reduction line 104 Table 05 Output motor 106 Pulling outlet 107 Shaft 108 Cap 110 Fitting portion 111 Adhesive 113 Opening portion 114 Heating member 115 Electric heating plate 116 Gear 117 Gear 118 Gear unit 119 Third housing 120 Power supply Switch 12 1 rftru disk