CN113061398A - Conductive adhesive tape, preparation process thereof and circuit construction device using conductive adhesive tape - Google Patents
Conductive adhesive tape, preparation process thereof and circuit construction device using conductive adhesive tape Download PDFInfo
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- CN113061398A CN113061398A CN202110277064.6A CN202110277064A CN113061398A CN 113061398 A CN113061398 A CN 113061398A CN 202110277064 A CN202110277064 A CN 202110277064A CN 113061398 A CN113061398 A CN 113061398A
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- adhesive tape
- conductive adhesive
- conductive
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 41
- 238000010276 construction Methods 0.000 title claims abstract description 8
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 50
- 238000000576 coating method Methods 0.000 claims abstract description 50
- 239000002994 raw material Substances 0.000 claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 68
- 229910021389 graphene Inorganic materials 0.000 claims description 65
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 44
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 42
- 239000004014 plasticizer Substances 0.000 claims description 36
- 238000003756 stirring Methods 0.000 claims description 27
- 125000003396 thiol group Chemical class [H]S* 0.000 claims description 23
- 239000004800 polyvinyl chloride Substances 0.000 claims description 16
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 12
- 229910021641 deionized water Inorganic materials 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 6
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical group CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 6
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000004108 freeze drying Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- 239000005457 ice water Substances 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 235000010344 sodium nitrate Nutrition 0.000 claims description 3
- 239000004317 sodium nitrate Substances 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 abstract description 6
- 229920006132 styrene block copolymer Polymers 0.000 description 28
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920006000 epoxidized styrene-butadiene-styrene block copolymer Polymers 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the technical field of electrical equipment, and particularly relates to a conductive adhesive tape, a preparation process thereof and a circuit construction device using the conductive adhesive tape. The circuit building device comprises a box body, wherein a raw material disc and a receiving disc are rotatably arranged in the box body; a belt end fixing device is arranged on the first rotating disc; and a second rotating disk is arranged on the mounting column, and a conductive adhesive tape is wound on the second rotating disk. The invention can adhere the conductive coating to the target plane and draw a conductive test circuit, thereby constructing a circuit diagram which can be electrified and being convenient for an electrical engineer to analyze the circuit; the invention is convenient to carry, and the drawn circuit is convenient to modify, and has the simplicity of a paper pen circuit diagram and the testability of a traditional test circuit.
Description
Technical Field
The invention belongs to the technical field of electrical equipment, and particularly relates to a conductive adhesive tape, a preparation process of the conductive adhesive tape and a circuit construction device using the conductive adhesive tape.
Background
When an electrical engineer analyzes a circuit, it is often necessary to construct a circuit diagram to assist in the analysis. In the prior art, electrical engineers usually draw pictures with paper and pens or use wires to build up test circuits. If the circuit is analyzed by using a paper stroke drawing, miscalculation and miscalculation are inevitable, the test cannot be carried out, and the reliability is difficult to ensure. The circuit built by the conducting wires is used, the conducting wires are overlapped in an intricate mode, and faults are difficult to arrange and troubleshoot.
Disclosure of Invention
In view of the above-mentioned disadvantages, the present invention provides a conductive tape, a process for preparing the same, and a circuit constructing apparatus using the conductive tape.
The invention provides the following technical scheme:
a conductive adhesive tape comprises a polyvinyl chloride carrier tape with the thickness of 0.4-0.6 mm, wherein one side of the polyvinyl chloride carrier tape is coated with a conductive coating, and the other side of the polyvinyl chloride carrier tape is coated with an organic silicon anti-sticking layer with the thickness of 0.1-0.2 mm; the conductive coating comprises 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer, 4-10 parts by weight of tackifier, 6-10 parts by weight of plasticizer, 20-30 parts by weight of metal powder and 20-30 parts by weight of mercapto functionalized graphene.
The epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer is an epoxidized styrene-butadiene-styrene segmented copolymer thermoplastic elastomer or an epoxidized styrene-isoprene-styrene segmented copolymer thermoplastic elastomer.
The tackifier is rosin or a terpene polymer.
The plasticizer is diethyl phthalate or dibutyl phthalate.
The diameter of the metal powder is 1.7-2.3 micrometers, and the metal powder is silver powder, gold powder, copper powder or aluminum powder; the diameter of the mercapto-functionalized graphene is 1.5-2.5 micrometers.
A preparation process of a conductive adhesive tape comprises the following steps:
step 1): preparing polyvinyl chloride into a carrier belt with the thickness of 0.4-0.6 mm;
step 2): coating an organic silicon anti-sticking layer of 0.1-0.2 mm on one surface of the carrier belt prepared in the step 1);
step 3): mixing and stirring 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer and 6-10 parts by weight of plasticizer;
step 4): heating and stirring 4-10 parts by weight of tackifier until the tackifier is molten;
step 5): slowly adding the product obtained in the step 3) into the product obtained in the step 4), and stirring until the product is molten;
step 6): adding 1-10 ml of 98 wt% concentrated sulfuric acid into a three-neck flask in an ice-water bath, sequentially adding 1-100 g of graphite and 1-10 g of sodium nitrate, slowly adding 1-20 g of potassium permanganate under a stirring state, controlling the whole system to react at 35-100 ℃ for 1 hour, slowly adding deionized water, controlling the system temperature to react at 80 ℃ for 45-90 minutes, after the reaction is finished, adding 100-500 ml of deionized water into the product to dilute the product, adding hydrogen peroxide to terminate the reaction, washing the product with dilute hydrochloric acid to remove metal ions, washing the product with deionized water to be neutral, and drying the obtained product at normal temperature or freeze drying to obtain graphene oxide; dispersing graphene oxide in deionized water, performing ultrasonic treatment for 0.5-1 hour to obtain graphene oxide/water dispersion, adding a silane coupling agent containing sulfydryl, wherein the silane coupling agent containing sulfydryl accounts for 1-10 wt% of the graphene oxide, heating and stirring for 5-10 hours, then adding hydrazine hydrate, stirring for 10-24 hours at 50-80 ℃, washing to remove redundant modifier molecules, and drying to obtain sulfydryl functionalized graphene; grinding the prepared mercapto-functionalized graphene after drying;
step 7): adding 20-30 parts by weight of the mercapto-functionalized graphene prepared in the step 6) into the product prepared in the step 5), dispersing for 2-3 hours by ultrasonic waves, and stirring at room temperature for 15-25 minutes to obtain a mixture;
step 8): grinding metal powder, adding 20-30 parts by weight of ground metal powder into the mixture prepared in the step 7), stirring at room temperature for 15-25 minutes to obtain a mixture, and grinding the mixture at room temperature for 3-30 minutes to obtain a uniform mixture;
step 9): removing bubbles from the product obtained in the step 8) at 20-40 ℃ through vacuum stirring to obtain a raw material;
step 10): coating the raw material prepared in the step 9) on the other side of the carrier belt, and hot-pressing at 80 ℃ to prepare a conductive coating with the thickness of 0.9-1.1 mm to prepare a conductive adhesive tape;
step 11): cutting the conductive adhesive tape into a strip-shaped conductive adhesive tape with the width of 6-8 mm;
step 12): and winding the strip-shaped conductive adhesive tape onto the turntable.
Grinding the sparse-group functionalized graphene to be 1.5-2.5 micrometers in diameter; the metal powder is ground to be 1.7-2.3 micrometers in diameter.
The mercapto-functionalized graphene is single-layer graphene.
A circuit construction device comprises a box body, wherein a raw material disc and a receiving disc are rotatably arranged in the box body; the raw material disc comprises a first meshing disc and a mounting column; the accommodating disc comprises a second meshing disc and a first rotating disc, the first meshing disc is meshed with the second meshing disc in a matching mode, and a belt end fixing device is arranged on the first rotating disc; a second rotating disc is arranged on the mounting column, and a conductive adhesive tape is wound on the second rotating disc; one end of the box body is provided with a belt scratching nozzle, the other end of the box body is slidably provided with a sliding rod, a spring is connected between one end of the sliding rod close to the interior of the box body and the box body, and one end of the sliding rod far away from the interior of the box body is provided with a scraper; a first clamping rod is slidably mounted on the box body on one side of the sliding rod, a first clamping block is fixedly connected to the sliding rod, and a first clamping groove is formed in the first clamping block and corresponds to the first clamping rod.
The belt end fixing device comprises a clamping rod II which is slidably installed on the rotary table I, a sliding groove is formed in the rotary table I which is located at one end of the clamping rod II, a sliding block is slidably installed in the sliding groove, a clamping block II is installed on the sliding block, and a clamping groove II is formed in the clamping block II and corresponds to the clamping rod II.
The invention has the beneficial effects that: the invention can adhere the conductive coating to the target plane and draw a conductive test circuit, thereby constructing a circuit diagram which can be electrified and being convenient for an electrical engineer to analyze the circuit; the invention is convenient to carry, and the drawn circuit is convenient to modify, and has the simplicity of a paper pen circuit diagram and the testability of a traditional test circuit.
Drawings
FIG. 1 is a schematic view of the structure of the conductive tape of the present invention;
FIG. 2 is a schematic diagram of the circuit construction apparatus of the present invention;
fig. 3 is an enlarged view of a in fig. 2.
Labeled as: the belt scratching device comprises a belt scratching nozzle 101, a box body 102, a first tensioning column 103, a second rotating disc 104, a second tensioning column 105, a first meshing disc 106, a second meshing disc 107, a first rotating disc 108, a mounting column 109, a spring 110, a first clamping rod 111, a first clamping block 112, a sliding rod 113, a scraper 114, a sliding block 115, a second clamping block 116 and a second clamping rod 117.
Detailed Description
As shown in the figure, the conductive adhesive tape comprises a polyvinyl chloride carrier tape with the thickness of 0.4-0.6 mm, wherein polyvinyl chloride has good mechanical property and the tensile strength of about 60MPa, and is suitable for being used as a base tape body. The polyvinyl chloride carrier band is coated with a conductive coating on one side, and the adhesion force of the conductive coating to a target plane is greater than that of the conductive coating to the polyvinyl chloride carrier band, so that the conductive coating can be separated from the polyvinyl chloride carrier band after the conductive coating is adsorbed to the target plane under force. The other side of the polyvinyl chloride carrier strip is coated with an organic silicon anti-sticking layer with the thickness of 0.1-0.2 mm, and the organic silicon anti-sticking layer is used for avoiding that the conductive coating can be adhered to the other side of the polyvinyl chloride carrier strip after the conductive adhesive tape is wound, so that the unwinding is not smooth, and the use experience is influenced.
Specifically, the conductive coating comprises 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer, 4-10 parts by weight of tackifier, 6-10 parts by weight of plasticizer, 20-30 parts by weight of metal powder and 20-30 parts by weight of mercapto-functionalized graphene. Preferably, the epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer is an epoxidized styrene-butadiene-styrene block copolymer thermoplastic elastomer or an epoxidized styrene-isoprene-styrene block copolymer thermoplastic elastomer. The tackifier is rosin or terpene polymer. The plasticizer is diethyl phthalate or dibutyl phthalate. The diameter of the metal powder is 1.7-2.3 microns, and the metal powder is silver powder, gold powder, copper powder or aluminum powder; the diameter of the mercapto functionalized graphene is 1.5-2.5 microns. Since graphene has a high specific surface area and is easily agglomerated, it is difficult to disperse in an organic matrix, and thus, graphene needs to be surface functionalized, so that graphene can be well dispersed in the matrix.
A preparation process of a conductive adhesive tape comprises the following steps:
step 1): preparing polyvinyl chloride into a carrier belt with the thickness of 0.4-0.6 mm;
step 2): coating an organic silicon anti-sticking layer of 0.1-0.2 mm on one surface of the carrier belt prepared in the step 1);
step 3): mixing and stirring 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer and 6-10 parts by weight of plasticizer;
step 4): heating and stirring 4-10 parts by weight of tackifier until the tackifier is molten;
step 5): slowly adding the product obtained in the step 3) into the product obtained in the step 4), and stirring until the product is molten;
step 6): adding 1-10 ml of 98 wt% concentrated sulfuric acid into a three-neck flask in an ice-water bath, sequentially adding 1-100 g of graphite and 1-10 g of sodium nitrate, slowly adding 1-20 g of potassium permanganate under a stirring state, controlling the whole system to react at 35-100 ℃ for 1 hour, slowly adding deionized water, controlling the system temperature to react at 80 ℃ for 45-90 minutes, after the reaction is finished, adding 100-500 ml of deionized water into the product to dilute the product, adding hydrogen peroxide to terminate the reaction, washing the product with dilute hydrochloric acid to remove metal ions, washing the product with deionized water to be neutral, and drying the obtained product at normal temperature or freeze drying to obtain graphene oxide; dispersing graphene oxide in deionized water, performing ultrasonic treatment for 0.5-1 hour to obtain graphene oxide/water dispersion, adding a silane coupling agent containing sulfydryl, wherein the silane coupling agent containing sulfydryl accounts for 1-10 wt% of the graphene oxide, heating and stirring for 5-10 hours, then adding hydrazine hydrate, stirring for 10-24 hours at 50-80 ℃, washing to remove redundant modifier molecules, and drying to obtain sulfydryl functionalized graphene; grinding the prepared mercapto-functionalized graphene to the diameter of 1.5-2.5 microns; the mercapto-functionalized graphene is a single-layer graphene.
Step 7): adding 20-30 parts by weight of the mercapto-functionalized graphene prepared in the step 6) into the product prepared in the step 5), dispersing for 2-3 hours by ultrasonic waves, and stirring at room temperature for 15-25 minutes to obtain a mixture;
step 8): grinding the metal powder to the diameter of 1.7-2.3 microns, adding 20-30 parts by weight of the ground metal powder into the mixture prepared in the step 7), stirring at room temperature for 15-25 minutes to obtain a mixture, and grinding the mixture at room temperature for 3-30 minutes to obtain a uniform mixture;
step 9): removing bubbles from the product obtained in the step 8) at 20-40 ℃ through vacuum stirring to obtain a raw material;
step 10): coating the raw material prepared in the step 9) on the other side of the carrier belt, and hot-pressing at 80 ℃ to prepare a conductive coating with the thickness of 0.9-1.1 mm to prepare a conductive adhesive tape;
step 11): cutting the conductive adhesive tape into a strip-shaped conductive adhesive tape with the width of 6-8 mm;
step 12): and winding the strip-shaped conductive adhesive tape onto the turntable.
Example 1: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 2: the conductive coating is prepared by using 43 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 3: the conductive coating is prepared by taking 45 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 4: the conductive coating is prepared by using 48 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 5: the conductive coating is prepared by taking 50 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 6: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 7 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 7: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 8 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 8: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 9 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 9: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 10 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 10: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 6 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 11: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 7 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 12: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 8 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 13: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 10 parts by weight of tackifier, 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 14: preparing the conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 23 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 15: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 24 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 16: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 25 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 17: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 28 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 18: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 30 parts by weight of mercapto functionalized graphene and 20 parts by weight of metal powder according to the steps.
Example 19: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 23 parts by weight of metal powder according to the steps.
Example 20: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 25 parts by weight of metal powder according to the steps.
Example 21: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 26 parts by weight of metal powder according to the steps.
Example 22: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 27 parts by weight of metal powder according to the steps.
Example 23: preparing a conductive coating by using 40 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 6 parts by weight of plasticizer, 4 parts by weight of tackifier, 20 parts by weight of mercapto functionalized graphene and 30 parts by weight of metal powder according to the steps.
Example 24: preparing 46 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 8 parts by weight of plasticizer, 4 parts by weight of tackifier, 23 parts by weight of mercapto functionalized graphene and 26 parts by weight of metal powder according to the steps.
Example 25: the conductive coating is prepared by using 47 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 7 parts by weight of plasticizer, 6 parts by weight of tackifier, 24 parts by weight of mercapto functionalized graphene and 27 parts by weight of metal powder according to the steps.
Example 26: preparing 49 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 9 parts by weight of plasticizer, 6 parts by weight of tackifier, 27 parts by weight of mercapto functionalized graphene and 27 parts by weight of metal powder according to the steps.
Example 27: the conductive coating is prepared by using 47 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer, 10 parts by weight of plasticizer, 9 parts by weight of tackifier, 30 parts by weight of mercapto functionalized graphene and 26 parts by weight of metal powder according to the steps.
A circuit construction device comprises a box body 102, wherein one end of the box body 102 is provided with a scribing nozzle 101. A raw material tray and an accommodating tray are rotatably arranged in the box body 102; the material tray includes a first engagement tray 106 and a mounting post 109; the receiving disc comprises a second meshing disc 107 and a first rotating disc 108, and the first meshing disc 106 is fittingly meshed with the second meshing disc 107.
The first rotating disc 108 is provided with a belt end fixing device. Specifically, the belt end fixing device comprises a second clamping rod 117 which is slidably mounted on the first rotating disc 108, a sliding groove is formed in the first rotating disc 108 located at one end of the second clamping rod 117, a sliding block 115 is slidably mounted in the sliding groove, a second clamping block 116 is mounted on the sliding block 115, and a second clamping groove is formed in the second clamping block 116 and corresponds to the second clamping rod 117. When one end of the conductive adhesive tape needs to be fixed on the first rotating disc 108, one end of the conductive adhesive tape is inserted into a gap between the sliding block 115 and the sliding groove, and then the second clamping rod 117 is inserted into the second clamping groove formed in the second clamping block 116, so that the position of the sliding block 115 is relatively fixed, and the conductive adhesive tape is clamped and cannot loosen.
The second rotating disk 104 is mounted on the mounting column 109, and a conductive adhesive tape is wound on the second rotating disk 104. The cylindrical surface of the mounting column 109 is provided with a clamping strip, the second rotating disc 104 is provided with an axial through hole, and the hole wall of the axial through hole is provided with a clamping groove. The second rotary table 104 is mounted on the mounting column 109 through clamping. One end of the conductive adhesive tape on the second rotating disk 104 is wound on the first rotating disk 108 and is fixed by the tape end fixing device.
The first tensioning column 103 and the second tensioning column 105 are arranged on the box body 102, and the first tensioning column 103 and the second tensioning column 105 are used for preventing the conductive adhesive tape from being clamped by the first engagement disc 106 or the second engagement disc 107, so that the use is inconvenient.
When the conductive adhesive tape is pulled by friction force, the conductive adhesive tape drives the second rotating disc 104 to unreel, the first meshing disc 106 rotates, the rotating first meshing disc 106 drives the second meshing disc 107 to rotate, and when the second meshing disc 107 rotates, the first rotating disc 108 rotates together, so that the conductive adhesive tape with the conductive coating removed is wound.
Since the conductive coating is applied to the target plane, sometimes the circuit needs to be modified, such as circuit breaking, etc., a sliding rod 113 is slidably mounted at the other end of the box 102, a spring 110 is connected between one end of the sliding rod 113 near the inside of the box 102 and the box 102, and a scraper 114 is mounted at one end of the sliding rod 113 away from the inside of the box 102. A first clamping rod 111 is slidably mounted on the box body 102 on one side of the sliding rod 113, a first clamping block 112 is fixedly connected to the sliding rod 113, and a first clamping groove is formed in the first clamping block 112 corresponding to the first clamping rod 111. The scraper 114 is used for pushing the scraper 114 installed at one end of the sliding rod 113 out by pushing the fixture block I112, and then one end of the fixture rod I111 is inserted into the fixture slot I, so that the scraper 114 is fixed in position, and the scraper 114 can be used for scraping the conductive coating on the target plane. When the scraper 114 is not needed, the first clamping rod 111 is pulled away from the first clamping groove, and the scraper 114 returns under the elastic force of the spring 110.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electrically conductive adhesive tape, characterized in that: the adhesive tape comprises a polyvinyl chloride carrier tape with the thickness of 0.4-0.6 mm, wherein one side of the polyvinyl chloride carrier tape is coated with a conductive coating, and the other side of the polyvinyl chloride carrier tape is coated with an organic silicon anti-sticking layer with the thickness of 0.1-0.2 mm; the conductive coating comprises 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer, 4-10 parts by weight of tackifier, 6-10 parts by weight of plasticizer, 20-30 parts by weight of metal powder and 20-30 parts by weight of mercapto functionalized graphene.
2. The conductive tape of claim 1, wherein: the epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer is an epoxidized styrene-butadiene-styrene segmented copolymer thermoplastic elastomer or an epoxidized styrene-isoprene-styrene segmented copolymer thermoplastic elastomer.
3. The conductive tape of claim 1, wherein: the tackifier is rosin or a terpene polymer.
4. The conductive tape of claim 1, wherein: the plasticizer is diethyl phthalate or dibutyl phthalate.
5. The conductive tape of claim 1, wherein: the diameter of the metal powder is 1.7-2.3 micrometers, and the metal powder is silver powder, gold powder, copper powder or aluminum powder; the diameter of the mercapto-functionalized graphene is 1.5-2.5 micrometers.
6. A process for preparing the conductive adhesive tape of claim 1, comprising the steps of:
step 1): preparing polyvinyl chloride into a carrier belt with the thickness of 0.4-0.6 mm;
step 2): coating an organic silicon anti-sticking layer of 0.1-0.2 mm on one surface of the carrier belt prepared in the step 1);
step 3): mixing and stirring 40-50 parts by weight of epoxidized styrene-diene-styrene segmented copolymer thermoplastic elastomer and 6-10 parts by weight of plasticizer;
step 4): heating and stirring 4-10 parts by weight of tackifier until the tackifier is molten;
step 5): slowly adding the product obtained in the step 3) into the product obtained in the step 4), and stirring until the product is molten;
step 6): adding 1-10 ml of 98 wt% concentrated sulfuric acid into a three-neck flask in an ice-water bath, sequentially adding 1-100 g of graphite and 1-10 g of sodium nitrate, slowly adding 1-20 g of potassium permanganate under a stirring state, controlling the whole system to react at 35-100 ℃ for 1 hour, slowly adding deionized water, controlling the system temperature to react at 80 ℃ for 45-90 minutes, after the reaction is finished, adding 100-500 ml of deionized water into the product to dilute the product, adding hydrogen peroxide to terminate the reaction, washing the product with dilute hydrochloric acid to remove metal ions, washing the product with deionized water to be neutral, and drying the obtained product at normal temperature or freeze drying to obtain graphene oxide; dispersing graphene oxide in deionized water, performing ultrasonic treatment for 0.5-1 hour to obtain graphene oxide/water dispersion, adding a silane coupling agent containing sulfydryl, wherein the silane coupling agent containing sulfydryl accounts for 1-10 wt% of the graphene oxide, heating and stirring for 5-10 hours, then adding hydrazine hydrate, stirring for 10-24 hours at 50-80 ℃, washing to remove redundant modifier molecules, and drying to obtain sulfydryl functionalized graphene; grinding the prepared mercapto-functionalized graphene after drying;
step 7): adding 20-30 parts by weight of the mercapto-functionalized graphene prepared in the step 6) into the product prepared in the step 5), dispersing for 2-3 hours by ultrasonic waves, and stirring at room temperature for 15-25 minutes to obtain a mixture;
step 8): grinding metal powder, adding 20-30 parts by weight of ground metal powder into the mixture prepared in the step 7), stirring at room temperature for 15-25 minutes to obtain a mixture, and grinding the mixture at room temperature for 3-30 minutes to obtain a uniform mixture;
step 9): removing bubbles from the product obtained in the step 8) at 20-40 ℃ through vacuum stirring to obtain a raw material;
step 10): coating the raw material prepared in the step 9) on the other side of the carrier belt, and hot-pressing at 80 ℃ to prepare a conductive coating with the thickness of 0.9-1.1 mm to prepare a conductive adhesive tape;
step 11): cutting the conductive adhesive tape into a strip-shaped conductive adhesive tape with the width of 6-8 mm;
step 12): and winding the strip-shaped conductive adhesive tape onto the turntable.
7. The process according to claim 6, characterized in that: grinding the sparse-group functionalized graphene to be 1.5-2.5 micrometers in diameter; the metal powder is ground to be 1.7-2.3 micrometers in diameter.
8. The process according to claim 6, characterized in that: the mercapto-functionalized graphene is single-layer graphene.
9. A circuit construction device using the conductive tape of claim 1, characterized in that: comprises a box body (102), wherein a raw material plate and a receiving plate are rotatably arranged in the box body (102); the material tray comprises a first engagement tray (106) and a mounting post (109); the containing disc comprises a second meshing disc (107) and a first rotating disc (108), the first meshing disc (106) is meshed with the second meshing disc (107) in a matching mode, and a belt end fixing device is arranged on the first rotating disc (108); a second rotating disc (104) is mounted on the mounting column (109), and a conductive adhesive tape is wound on the second rotating disc (104); one end of the box body (102) is provided with a scribing nozzle (101), the other end of the box body (102) is slidably provided with a sliding rod (113), a spring (110) is connected between one end of the sliding rod (113) close to the interior of the box body (102) and the box body (102), and one end of the sliding rod (113) departing from the interior of the box body (102) is provided with a scraper (114); a first clamping rod (111) is slidably mounted on the box body (102) on one side of the sliding rod (113), a first clamping block (112) is fixedly connected to the sliding rod (113), and a first clamping groove is formed in the first clamping block (112) and corresponds to the first clamping rod (111).
10. The circuit building apparatus according to claim 9, wherein: the belt end fixing device comprises a second clamping rod (117) which is slidably installed on the first rotating disc (108), a sliding groove is formed in the first rotating disc (108) located at one end of the second clamping rod (117), a sliding block (115) is slidably installed in the sliding groove, a second clamping block (116) is installed on the sliding block (115), and a second clamping groove is formed in the second clamping block (116) and corresponds to the second clamping rod (117).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115975536A (en) * | 2022-12-24 | 2023-04-18 | 常州市白鹭电器有限公司 | Corrosion-resistant adhesive tape and preparation method thereof |
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