JP5318840B2 - Anisotropic conductive film, method for manufacturing anisotropic conductive film, connection method between electronic members, and connection structure - Google Patents

Description

  The present invention relates to an anisotropic conductive film for use in conductive connection between electronic members, such as a liquid crystal display panel and a flexible printed wiring board or a semiconductor element, a method for manufacturing an anisotropic conductive film, The present invention relates to a connection method and a connection structure between electronic members using an anisotropic conductive film.

  In general, as a method of connecting a liquid crystal display panel, PDP (plasma display panel), EL (fluorescent display) panel, etc. and a circuit board, or connecting and fixing circuit boards to each other, and electrically connecting them together, different methods are used. An isotropic conductive film is used.

  The anisotropic conductive film is obtained by forming a conductive particle-containing layer in which conductive particles are dispersed in an insulating resin on a release film. These are electrically connected by interposing a conductive particle-containing layer between the liquid crystal display panel and the circuit board and between the circuit boards.

  An example of the anisotropic conductive film is an anisotropic conductive film 20 as shown in FIG. The anisotropic conductive film 20 is obtained by forming a conductive particle-containing layer 22 on a long release film 21. Such an anisotropic conductive film 20 has a liquid crystal display panel 23 side facing the liquid crystal display panel 23 when, for example, an IC chip as a liquid crystal driving circuit is mounted on the peripheral portion of the liquid crystal display panel 23. The conductive particle-containing layer 22 is transferred to the liquid crystal display panel 23 by being heat-pressed to the peripheral edge of the display panel 23. Then, the conductive particle-containing layer 22 is bonded to the liquid crystal display panel 23 by peeling the release film 21 from the conductive particle-containing layer 22. Then, by mounting the IC chip on the conductive particle-containing layer 22, the liquid crystal display panel 23 and an IC chip (not shown) can be connected and conducted.

  In such an anisotropic conductive film 20, for example, when the width of the pasting portion of the liquid crystal display panel 23 is narrow, the width is narrowed according to the place to be pasted. When pasting on the liquid crystal display panel 23, as shown in FIG. 10, the anisotropic conductive film 20 is aligned and pasted in parallel to the part to be pasted. Therefore, the sticking condition is likely to vary depending on the tension of the anisotropic conductive film 20 and the accuracy of the mounting position.

  In addition to the structure shown in FIG. 10, the anisotropic conductive film has a width of several millimeters, a length of, for example, 50 m, and is wound around a reel, although not shown. When using it, feed it out from the reel, cut it out, and use it.

  By the way, in the recent mounting in the liquid crystal display panel, the mounting area of the anisotropic conductive film tends to be widened with the enlargement of the panel. Moreover, since the connection part which has various mounting areas exists, the usage-amount of an anisotropic conductive film is increasing.

  As a result, in the mounting process of a circuit board or the like, the reel around which the anisotropic conductive film is wound is frequently exchanged, the number of times of attaching / detaching the reel is increased, and the production efficiency tends to be lowered. Therefore, in order to reduce the number of times the reel is attached and detached, it is conceivable to increase the number of windings of the anisotropic conductive film, but when the number of windings is increased, the width of the anisotropic conductive film is several mm, Unwinding occurs, which is not preferable.

  Therefore, Patent Document 1 proposes an adhesive tape that can increase the amount of adhesive that adheres to a circuit board without increasing the number of windings on the reel. In patent document 1, the amount of the adhesive is determined by separating the adhesive applied to the entire surface of one side of the substrate with a width W into a plurality of strips in the width W direction, and bonding the separated strips to the periphery of the circuit board. It is described to increase.

  However, in the adhesive tape proposed in Patent Document 1, the length of the adhesive bonded to the circuit board is limited to the width W of the base material. For this reason, the reel of the adhesive tape must be replaced every time the size of the portion of the circuit board to which the adhesive is bonded changes. Moreover, the size of the part to be bonded varies, and the width of the adhesive tape must be changed in accordance with these sizes to be newly manufactured. Therefore, with the adhesive tape proposed in Patent Document 1, it is difficult to significantly reduce the number of times the reels are attached and detached, and furthermore, adhesive tapes with various widths must be manufactured, which increases costs.

JP 2004-2111018 A

  The present invention has been proposed in view of such a conventional situation, and forms a conductive particle-containing layer in accordance with the size of a portion to be bonded to an electronic member without increasing the width of the substrate. An anisotropic conductive film that can be manufactured, has no sticking variation, and has improved production efficiency, a method for manufacturing an anisotropic conductive film, a method for connecting electronic members and a connection structure using the anisotropic conductive film The purpose is to provide.

  The anisotropic conductive film according to the present invention that achieves the above-described object is an anisotropic conductive film that electrically connects electronic members with a conductive particle-containing layer, and at least conductive particles are present on the substrate. A conductive particle-containing layer dispersed in a binder is formed, and an angle b is formed in the long side direction of the substrate, and slit lines that divide the conductive particle-containing layer are formed in at least the conductive particle-containing layer The angle b satisfies 180 degrees> b> 0 degrees (excluding 90 degrees).

The method for producing an anisotropic conductive film according to the present invention that achieves the above-described object is a method for producing an anisotropic conductive film in which electronic members are electrically connected by a conductive particle-containing layer. An angle of satisfying the following relationship with respect to the long-side direction of the base material is formed by applying a binder in which conductive particles are dispersed on the surface of the base material and drying to form a conductive particle-containing layer on the base material. a slit line dividing the conductive particle-containing layer is formed in at least the conductive particle-containing layer, and the angle b satisfies 180 degrees>b> 0 degrees (except 90 degrees). .
The connection method between the electronic members according to the present invention that achieves the above-described object is a connection method between the electronic members that connects and connects the electronic members through the conductive particle-containing layer. Is formed in the binder, the conductive particle-containing layer is formed, and has an angle b with respect to the long side direction of the substrate, and the slit lines dividing the conductive particle-containing layer are at least in the conductive particle-containing layer. An anisotropic conductive film that is formed and satisfies an angle b of 180 degrees>b> 0 degrees (excluding 90 degrees) is used, and the conductive particle-containing layer is a first electron on the terminal of the first electronic member. An anisotropic conductive film is disposed so as to be on the terminal side of the member, the anisotropic conductive film is heated and pressurized against the first electronic member, the substrate is peeled from the conductive particle-containing layer, and the first The conductive particle-containing layer is temporarily pressure-bonded onto the terminal of the electronic member, and the end of the second electronic member The second electronic member is disposed on the first electronic member such that the second electronic member is heated and pressurized with respect to the first electronic member so that the first electronic member is on the conductive particle-containing layer. The terminal of the member and the terminal of the second electronic member are connected by a conductive particle-containing layer and are made conductive.

  The connection structure according to the present invention that achieves the above-described object is a connection structure manufactured by the connection method between the electronic members.

  In the present invention, the conductive particle-containing layer of the anisotropic conductive film has an angle b satisfying 180 degrees> b> 0 degrees (except 90 degrees) with respect to the long side direction, and the conductive particle-containing layer Is formed, and one conductive particle-containing layer divided and separated by the slit line is bonded to the electronic member. Therefore, in this invention, the width | variety and length of the electroconductive particle content layer isolate | separated by a slit line and bonded together can be adjusted by adjusting the angle b.

  Thereby, in this invention, even when the magnitude | size of the part which bonds an electroconductive particle content layer to an electronic member differs, or when it is a narrow width | variety, the angle b of a slit line is adjusted and a slit line is formed. Thus, the size of the conductive particle-containing layer to be bonded can be formed in accordance with the bonded portion without changing the size of the substrate. In addition, even if the bonding portion is narrow, the conductive particle-containing layer divided and separated by the slit line is bonded, so there is no need to reduce the width of the base material, thus improving the bonding accuracy to the electronic member. be able to.

It is an anisotropic conductive film to which this invention is applied, (a) is a perspective view of an anisotropic conductive film, (b) is a top view of an anisotropic conductive film. It is a top view of the anisotropic conductive film from which the angle of the slit line to which this invention is applied differs. It is a perspective view of the connection structure which connected the liquid crystal display panel and the flexible printed circuit board with the same anisotropic conductive film. It is sectional drawing of the connection part of the connection structure. It is a perspective view which shows the state which adhere | attached the electroconductive particle content layer on the liquid crystal display panel. It is a perspective view explaining the method to adhere | attach an electroconductive particle content layer on a liquid crystal display panel. It is a perspective view explaining the other method of adhere | attaching an electroconductive particle content layer on a liquid crystal display panel. It is a figure explaining the method of affixing the electroconductive particle content layer of the anisotropic conductive film of an Example on glass. It is a figure explaining the method of affixing the electroconductive particle content layer of the anisotropic conductive film of a comparative example on glass. It is a perspective view explaining the method to adhere | attach the conventional anisotropic conductive film.

  Hereinafter, an anisotropic conductive film to which the present invention is applied, a method for manufacturing an anisotropic conductive film, a method for connecting electronic members, and a connection structure will be described in detail with reference to the drawings.

  As shown in FIG. 1, the anisotropic conductive film 1 is usually one in which a conductive particle-containing layer 3 is formed on a release film 2 serving as a base material. As shown in FIG. 3, the anisotropic conductive film 1 has a liquid crystal display panel 10 and a flexible structure by interposing a conductive particle-containing layer 3 between a liquid crystal display panel 11 and a flexible printed circuit board 12 as an electronic member. It is used to connect the printed circuit board 11 and make it conductive.

  As the release film 2, a base material such as a polyethylene terephthalate film generally used in anisotropic conductive films (ACF) can be used. The width of the release film 2 is preferably 5 mm or more.

  The conductive particle-containing layer 3 is formed by dispersing conductive particles in a binder. The binder contains a thermosetting resin, a film-forming resin, a latent curing agent, a silane coupling agent, and the like, and is the same as the binder used for a normal anisotropic conductive film.

  As the film-forming resin, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  The thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and commercially available epoxy resins and acrylic resins can be mentioned.

  The epoxy resin is not particularly limited and may be appropriately selected depending on the purpose. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, Phenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like can be mentioned. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, it can select suitably, For example, an acrylic compound, liquid acrylate, etc. are mentioned. Specifically, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2 -Hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate , Tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, epoxy acrylate and the like. These may be used alone or in combination of two or more.

  It is preferable to use this epoxy resin or acrylic resin as the thermosetting resin.

  Examples of the latent curing agent include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Examples of the silane coupling agent include epoxy-based, amino-based, mercapto-sulfide-based, and ureido-based agents. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  Examples of the conductive particles include any known conductive particles used in anisotropic conductive films. Examples of conductive particles include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, metal oxides, carbon, graphite, glass, ceramics, and plastics. The surface of the particles such as those coated with a metal, or the surface of these particles further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

  As shown in FIG. 1B, the anisotropic conductive film 1 is formed in a strip shape, for example, has an angle b with respect to the long side direction L of the release film 2, and includes the conductive particle-containing layer 3. A plurality of slit lines 4 to be divided are formed in the conductive particle-containing layer 3. The slit line 4 is formed linearly from one long side 5 to the other long side 6. The plurality of slit lines 4 are parallel and are formed at a predetermined interval in accordance with the width to which the conductive particle-containing layer 3 is bonded.

  Here, the angle b is an angle formed by intersecting the long side direction L of the anisotropic conductive film 1 and one long side 5 and the slit line 4 in FIG. Specifically, as shown in FIG. 1B, in the angle formed by the slit line 4 and one long side 5 intersecting, the angle on one short side 7 side is b, and the other short side The angle on the 8th side is (180-b). The angle b is 180 degrees> b> 0 degrees (excluding 90 degrees), preferably 140 degrees ≧ b ≧ 40 degrees, and more preferably 130 degrees ≧ b ≧ 50 degrees.

  In the anisotropic conductive film 1, the angle b of the slit line 4 is adjusted according to the size of the region where the conductive particle-containing layer 3 is bonded to the electronic member such as the liquid crystal display panel 10. Or as shown in FIG. 2, the length of the one electroconductive particle content layer 3a divided | segmented by the slit line 4 can be adjusted. For example, as shown in FIG. 1, by reducing the angle b, the length from one long side 5 to the other long side 6 of one conductive particle-containing layer 3a can be increased, and the angle b It can be made longer than the anisotropic conductive film 1 shown in FIG. That is, even if the width of the anisotropic conductive film 1 is one kind of the determined size, by adjusting the angle b of the slit line 4, it can be adjusted to the width and length of the attachment part of the electronic member. In addition, the affixing width and length of the conductive particle-containing layer 3a can be arbitrarily set.

  Therefore, when the slit line 4 as shown in FIG. 1 is formed, it can be applied when the width of the pasting portion of the electronic member is narrow and long, and the slit line 4 as shown in FIG. 2 is formed. In this case, the present invention can be applied to a case where the width of the attachment part of the electronic member is slightly wide and short.

  The slit 4 wire can be slit by a slitting device or manually, but is not limited to these methods.

  In addition, the anisotropic conductive film 1 is formed by forming slit lines 4 having an angle b with respect to the long side direction L, and as shown in FIG. The length of the conductive particle-containing layer 3a, that is, the length c of the conductive particle-containing layer 3a bonded to the electronic member is larger than the width W of the release film 2, and contains the conductive particles bonded to the electronic member. The affixing width a of the layer 3 a is smaller than the width W of the release film 2. Although the anisotropic conductive film 1 depends on the width W of the release film 2 depending on the angle b of the slit line 4, the attachment length c of the conductive particle-containing layer 3 a is, for example, in the range of 1 mm to 50 mm. The width a can be adjusted within a range of 0.4 mm to 10 mm, for example.

  The slit line 4 may be included only in the conductive particle-containing layer 3, and may be included not only in the conductive particle-containing layer 3 but also in the release film 2.

  The anisotropic conductive film 1 is not limited to being formed in a strip shape, but may be formed in a long shape and wound around a reel for use.

  The anisotropic conductive film 1 may be formed by laminating an insulating adhesive layer (NCF (Non Conductive Film) layer) made of only a binder, for example, between the conductive particle-containing layer 3 and the release film 2. . Moreover, the release film may be provided on both surfaces of the conductive particle-containing layer 3 (when the NCF is laminated, both surfaces of the conductive particle-containing layer 3 and the NCF layer).

  The anisotropic conductive film 1 having the above configuration can be manufactured by, for example, the following method.

  First, an adhesive composition in which conductive particles are dispersed in a binder is applied to the entire area of one surface of a strip-shaped or long-shaped release film 2, dried, and the conductive particles on the release film 2. The containing layer 3 is formed.

  Next, with respect to only the conductive particle-containing layer 3 or the conductive particle-containing layer 3 and the release film 2, a slit line having an angle b with respect to the long side direction L of the anisotropic conductive film 2 is a slit device or Formed manually. Note that the present invention is not limited to these methods.

  Thereby, the anisotropic conductive film 1 by which the slit line 4 was formed in the electroconductive particle content layer 3 at least can be manufactured.

  In addition, the manufacturing method of the general anisotropic conductive film other than the formation method of the slit line 4 is applicable.

  Next, a connection structure in which electronic members are connected and conducted using the anisotropic conductive film 1 will be described.

  As shown in FIGS. 3 and 4, the connection structure 10 includes, for example, a liquid crystal display panel 11 serving as a first electronic member and a flexible printed circuit board 12 in the conductive particle-containing layer of the anisotropic conductive film 1 described above. 3 is connected and made conductive.

  In the liquid crystal display panel 10, a liquid crystal layer (not shown) is sandwiched between a pair of transparent substrates 13a and 13b made of glass or the like, and a sealing material 14 is provided around the liquid crystal layer to seal the liquid crystal layer. . Polarizing plates 34 are disposed on the lower surface of the transparent substrate 13a and the upper surface of the transparent substrate 13b, respectively. The transparent substrate 13a is provided with a terminal 16 provided with a plurality of electrodes in a portion where the transparent substrate 13b, the liquid crystal layer, and the sealing material are not laminated. The end 16 is formed in a rectangular shape, for example, and specifically, as shown in FIG.

  On the terminal 16 of the liquid crystal display panel 11, the conductive particle-containing layer 3 of the anisotropic conductive film 1 described above is bonded.

  In the connection structure 10, the terminals 17 of the flexible printed circuit board 12 are connected to the conductive particle-containing layer 3 bonded to the terminals 16 of the liquid crystal display panel 11, and the liquid crystal display panel 11 is connected via the conductive particle-containing layer 3. And the flexible printed circuit board 12 are electrically connected.

  First, as shown in FIG. 5, the manufacturing method of the connection structure 10 is divided on the terminals 16 of the liquid crystal display panel 11 by the slit lines 4 in the conductive particle-containing layer 3 of the anisotropic conductive film 1 described above. Then, the separated one conductive particle-containing layer 3a is temporarily pressure-bonded. The anisotropic conductive film 1 to be used has a predetermined angle b on the conductive particle-containing layer 3 in accordance with the width and length of the portion where the terminal 16 of the liquid crystal display panel 11 and the terminal 17 of the flexible printed circuit board 12 are bonded. A slit line 4 is formed.

  As shown in FIG. 6, the method of temporarily press-bonding the conductive particle-containing layer 3 a is an anisotropic conductive film on the terminal 16 of the liquid crystal display panel 11 so that the conductive particle-containing layer 3 a is on the terminal 16 side. 1 is placed. At this time, as shown in FIG. 6, the direction of the attachment length c of one conductive particle-containing layer 3 a divided by the slit line 4 is parallel to the terminal 16 of the liquid crystal front panel 11 as shown in FIG. Conductive film 1 is fed onto terminal 16 of liquid crystal display panel 11. That is, the anisotropic conductive film 1 is sent obliquely with respect to the terminals 16 of the liquid crystal display panel 11.

  And after arrange | positioning one electroconductive particle content layer 3a on the terminal 16, one electroconductive particle content layer 3a is heated and pressurized with a heating bonder from the peeling film 2 side, for example, and a heating bonder is separated from the peeling film 2. By peeling the release film 2 from the conductive particle-containing layer 3a on the terminal 16, only one conductive particle-containing layer 3a is separated from the release film 2 and the conductive particle-containing layer 3 by the slit wire 4. As shown in FIG. Temporary pressure bonding is heated while pressing the upper surface of the release film 2 to the terminal 16 side with a slight pressure (for example, about 0.1 MPa to 2 MPa) with a heating bonder. However, the heating temperature is set to such a temperature that the thermosetting resin such as epoxy resin and acrylic resin in the anisotropic conductive film 2 is not cured (for example, about 70 to 100 ° C.).

  Next, the flexible printed circuit board 12 is arranged so that the terminals 16 of the liquid crystal display panel 11 and the terminals 17 of the flexible printed circuit board 12 face each other with the conductive particle-containing layer 3a interposed therebetween.

  Next, the upper surface of the flexible printed circuit board 12 is heated at a temperature equal to or higher than the curing temperature of the thermosetting resin in the conductive particle-containing layer 3a while being pressurized with a heating bonder at a predetermined pressure. Thereby, the terminal 16 of the liquid crystal display panel 11 and the terminal 17 of the flexible printed circuit board 12 are pressure-bonded via the conductive particle-containing layer 3a.

  By such a connection method, as shown in FIG. 3, the connection structure in which the terminals 16 of the liquid crystal display panel 11 and the terminals 17 of the flexible printed circuit board 12 are connected via the conductive particle-containing layer 3a to achieve conduction. The body 10 can be manufactured.

  In the manufacturing method described above, slit lines 4 are formed in the conductive particle-containing layer 3 of the anisotropic conductive film 1, and the slit lines 4 are the sizes of the terminals 16 and 17 of the liquid crystal display panel 11 and the flexible printed circuit board 12. That is, the anisotropic conductive film 1 in which the angle b is adjusted according to the size of the portion where the conductive particle-containing layer 3 is bonded is used. Thereby, in this manufacturing method, even if the width | variety of the terminals 16 and 17 of the liquid crystal display panel 11 and the flexible printed circuit board 12 is narrow, and the length of the length direction is lengthened, the angle b of the slit line 4 is made small. Therefore, it is not necessary to narrow the width of the anisotropic conductive film 1 in accordance with the length of the portion to be attached, and the anisotropic conductive film 1 having a certain width can be used.

  For this reason, in this manufacturing method, it is not necessary to narrow the width of the anisotropic conductive film 1, and since there is a certain width, even if the bonding portion is narrow, the alignment is stable and the bonding accuracy is improved. Can be made.

  Moreover, in the manufacturing method mentioned above, the slit wire 4 of the anisotropic conductive film 1 is formed only in the conductive particle-containing layer 3, and one conductive particle-containing layer is formed by peeling the release film 2 after provisional pressure bonding. Although only 3a was separated, not limited to this, as shown in FIG. 7, the slit wire 4 is formed in the conductive particle-containing layer 3 and the release film 2, and is separated by the slit wire 4 together with the release film 2, Then, you may make it peel a peeling film from the electroconductive particle content layer 3a on the terminal 16. FIG.

  Further, when the conductive particle-containing layer 3 or the conductive particle-containing layer 3 and the release film 2 are separated by the slit 4, the conductive particle-containing layer 3 is heated and transferred onto the terminals 16 of the liquid crystal display panel 11. At this time, the edge portion of the liquid crystal display panel 11 may be used for separation.

  In addition, after temporary press-bonding of the conductive particle-containing layer 3, the alignment state of the conductive particle-containing layer 3 is confirmed. If a problem such as misalignment occurs, the anisotropic conductive film is peeled off and again You may make it perform the repair process which arrange | positions an anisotropic conductive film.

  In addition, the electronic member to which the conductive particle-containing layer 3 is attached is not limited to the liquid crystal display panel 11 and may be any insulating substrate provided with terminals. For example, a glass substrate, a plastic substrate, a glass reinforced epoxy substrate, etc. can be mentioned.

  Further, as an electronic member to be bonded to the liquid crystal display panel 11 or the like, in addition to the flexible printed base 12 plate, for example, a semiconductor chip such as an LSI (Large Scale Integration) chip or IC chip, a semiconductor element such as a chip capacitor, a liquid crystal drive Semiconductor mounting material COF (Chip On Film) etc. can be mentioned.

  As mentioned above, although this Embodiment was described, it cannot be overemphasized that this invention is not limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

  Next, specific examples of the present invention will be described based on the results of experiments actually performed, but the present invention is not limited to these examples.

Example 1
In Example 1, an anisotropic conductive film (CP6920F3, manufactured by Sony Chemical & Information Device Co., Ltd.) having a release film in which the surface of a PET film having a thickness of 50 μm is subjected to a release treatment with silicone and having an epoxy resin as a binder Was wound around a plastic reel to form a reel shape having a width (W) of 1.5 mm. Then, before pasting, slitting the conductive particle-containing layer with a half-cut knife so that the pasting width (a) and pasting length (c), angle b is as shown in Table 1, Slit lines were formed.

(Example 2 to Example 20)
In Examples 2 to 21, slit lines were formed so that the affixing width (a) and affixing length (c) of the conductive particle-containing layer and the angle b were as shown in Tables 1 and 2. Except that, the same procedure as in Example 1 was performed.
(Example 21)
In Example 21, an anisotropic conductive film (product name: CP6920F3 (manufactured by Sony Chemical & Information Device Co., Ltd.)) using an acrylic resin as a binder (product name: CP6920F3 manufactured by Sony Chemical & Information Device Co., Ltd.) The procedure was the same as in Example 1 except that the name CP1720ISV (manufactured by Sony Chemical & Information Device Corporation) was used.

(Comparative Examples 1 to 5)
In Comparative Examples 1 to 5, the width (W) of the release film is as shown in Table 3, and the width (a) of the conductive particle-containing layer is the same as the width (W) of the release film. The affixing length (c) is a length necessary for pasting and can be arbitrarily changed. Except for these, an anisotropic conductive film was produced in the same manner as in Example 1 to form a reel. In Comparative Examples 1 to 5, no slit line is formed, so the angle b is 0 degrees or 180 degrees.

(Comparative Example 6 to Comparative Example 10)
In Comparative Examples 6 to 10, the width (W) of the release film is as shown in Table 3, the angle b of the slit line is 90 degrees, that is, the angle at which the long side direction of the anisotropic conductive film intersects is 90 degrees. The affixation length (c) of one conductive particle-containing layer is the same as the width (W) of the release film, and the affixation width (a) formed slit lines as shown in Table 1. Except for this, an anisotropic conductive film was produced in the same manner as in Example 1 to obtain a reel shape.

  The anisotropic conductive films produced in Examples 1 to 21 and Comparative Examples 1 to 10 were evaluated for reel shape evaluation, transferability to glass, and control in the length direction. The evaluation results are shown in Tables 1-3.

  The reel shape was evaluated by observing the anisotropic conductive films of Examples 1 to 21 and Comparative Examples 1 to 10 wound on a reel by 50 m, 100 m, and 200 m. ◯ if there is no step, no gap, etc., in a uniform and good winding state, △, if there is a step, gap in part of the winding state, but can be implemented and has no problems in use The winding state was extremely inferior due to the presence of gaps, etc., which could not be carried out and had problems in use, was evaluated as x.

  The transferability to glass evaluated the possibility of transfer of the electroconductive particle content layer to glass as follows. In Examples 1 to 21 and Comparative Examples 6 to 10, the anisotropic conductive films 31 of Examples 1 to 21 and Comparative Examples 6 to 10 are formed on the glass 30 as shown in FIG. The conductive particle containing layer 32 is fed so as to be on the glass 30 side, and the conductive particle containing layer 32 is heated and pressurized at a temperature of 80 ° C. and a pressure of 10 MPa by a heating bonder 34 from the release film 33 side. 32 was transferred to the glass 30.

  In Comparative Examples 1 to 5, as shown in FIG. 9, the anisotropic conductive film 35 formed in a strip shape on the glass 30 is arranged so that the conductive particle-containing layer is on the glass 30 side, and the release film 37 side is placed. Then, the conductive particle-containing layer 36 was heated and pressurized at a temperature of 80 ° C. and a pressure of 10 MPa with a heating bonder 34 to transfer the conductive particle-containing layer 36 to the glass 30.

  From the evaluation results shown in Tables 1 to 3, in Examples 1 to 21, even when the width of the release film is determined to be 15 mm, the conductive particle-containing layer is stuck by forming slit lines at an angle b. The attachment width (a) and the pasting length (c) can be adjusted to various sizes. Further, in Examples 1 to 21, since the width of the release film was 15 mm, even when wound on the reel by 200 m, there was no step, no gap, etc., and it was in a uniformly good winding state. Furthermore, in Examples 1 to 21, there was no problem in transferring the conductive particle-containing layer to the glass even when the slit lines were formed.

  On the other hand, since the slit lines are not formed in Comparative Examples 1 to 5, the affixing width (a) of the conductive particle-containing layer is determined by the width (W) of the release film and cannot be adjusted. Further, since the affixing length (c) is determined by the length of the anisotropic conductive film, it cannot be adjusted according to the size of the affixing portion, that is, the length direction cannot be controlled.

  In Comparative Examples 3 to 4, since the width (W) of the release film is as narrow as 0.8 mm and 0.6 mm, when wound on a reel, a discontinuous portion is generated in a part of the wound state. The winding state was extremely inferior. In Comparative Example 5, the width (W) of the release film was as narrow as 0.4 mm, and thus could not be wound.

  In Comparative Examples 6 to 10, since the width (W) of the release film is 15 mm, winding on the reel is not a problem, but the slit line is formed so as to intersect the long side direction of the release film at 90 degrees. Therefore, as in the example, it is not possible to adjust the attachment length of one conductive particle-containing layer.

  As described above, as shown in Examples 1 to 21, the slit line is formed so that the angle b is 180 degrees> b> 0 degrees (except 90 degrees) with respect to the long side direction of the release film, By forming with the width | variety of this, without changing according to the part which bonds the width | variety of an anisotropic conductive film, a conductive particle content layer can be formed according to the part to bond, and it can bond together.

  DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film, 2 Release film, 3 Conductive particle content layer, 4 Slit line, 10 Connection structure, 11 Liquid crystal display panel, 12 Flexible printed circuit board, 13 Transparent substrate, 14 Polarizing plate, 15 Sealing material, 16 Terminal, 17 terminals

Claims (16)

In the anisotropic conductive film that conducts conductive connection between the electronic members by the conductive particle-containing layer,
On the base material, the conductive particle-containing layer formed by dispersing at least conductive particles in a binder is formed,
With respect to the long side direction of the base material, an angle b is formed, and slit lines that divide the conductive particle-containing layer are formed in at least the conductive particle-containing layer,
The anisotropic conductive film characterized in that the angle b satisfies 180 degrees>b> 0 degrees (excluding 90 degrees).   The anisotropic conductive film according to claim 1, wherein a plurality of the slit lines are formed in parallel toward the long side direction of the base material.   The attachment length c of the conductive particle-containing layer to be attached to the electronic member, the attachment width a of the conductive particle-containing layer, and the width W of the base material satisfy the relationship of W <c and W> a. The anisotropic conductive film according to claim 1, wherein the anisotropic conductive film is satisfied.   The anisotropic conductive film according to any one of claims 1 to 3, wherein the angle b satisfies 140 degrees ≥ b ≥ 40 degrees.   The anisotropic conductive film according to any one of claims 1 to 4, wherein the binder is an epoxy resin or an acrylic resin. In the method for producing an anisotropic conductive film in which the electronic members are electrically connected by the conductive particle-containing layer,
On one surface of the substrate, a binder in which conductive particles are dispersed is applied and dried to form the conductive particle-containing layer on the substrate.
An angle b that satisfies the following relationship with respect to the long side direction of the base material is formed, and at least slit wires that divide the conductive particle-containing layer are formed in the conductive particle-containing layer,
The method for producing an anisotropic conductive film, wherein the angle b satisfies 180 degrees>b> 0 degrees (excluding 90 degrees).   The method for producing an anisotropic conductive film according to claim 6, wherein a plurality of the slit lines are formed in parallel in the long side direction of the base material.   The attachment length c of the conductive particle-containing layer to be attached to the electronic member, the attachment width a of the conductive particle-containing layer, and the width W of the base material satisfy the relationship of W <c and W> a. The method for producing an anisotropic conductive film according to claim 6, wherein the anisotropic conductive film is satisfied.   The method for producing an anisotropic conductive film according to claim 6, wherein the angle b satisfies 140 degrees ≧ b ≧ 40 degrees.   The method for manufacturing an anisotropic conductive film according to claim 6, wherein the binder is an epoxy resin or an acrylic resin. In the connection method between the electronic members for conductively connecting the electronic members through the conductive particle-containing layer,
The conductive particle-containing layer in which conductive particles are dispersed in a binder is formed on a base, and has an angle b with respect to the long side direction of the base and divides the conductive particle-containing layer An anisotropic conductive film satisfying 180 degrees>b> 0 degrees (excluding 90 degrees), wherein the slit line is formed at least in the conductive particle-containing layer, and the angle b satisfies 180 degrees>b> 0 degrees (except 90 degrees),
The anisotropic conductive film is disposed on the terminal of the first electronic member such that the conductive particle-containing layer is on the terminal side of the first electronic member, and the anisotropic conductive film is disposed on the first electronic member. Heating and pressurizing the electronic member, peeling the base material from the conductive particle-containing layer, temporarily bonding the conductive particle-containing layer on the terminal of the first electronic member,
The second electronic member is disposed on the first electronic member so that the terminal of the second electronic member is on the conductive particle-containing layer,
The second electronic member is heated and pressurized with respect to the first electronic member, the terminal of the first electronic member and the terminal of the second electronic member are connected by the conductive particle-containing layer, and conduction is established. A connection method between electronic members, characterized by:   The method for connecting electronic members according to claim 11, wherein a plurality of the slit lines of the anisotropic conductive film are formed in parallel toward the long side direction of the base material.   The attachment length c of the conductive particle-containing layer attached to the first electronic member and the second electronic member, the attachment width a of the conductive particle-containing layer, and the width W of the substrate are W < The method for connecting electronic members according to claim 11 or 12, wherein c and W> a are satisfied.   The method of connecting between electronic members according to claim 11, wherein the angle b satisfies 140 degrees ≧ b ≧ 40 degrees.   The method for connecting electronic members according to any one of claims 11 to 14, wherein the binder is an epoxy resin or an acrylic resin.   The connection structure manufactured by the connection method between the electronic members of any one of Claims 11 thru | or 15.

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