JP6297381B2 - Method for manufacturing adhesive film, film winding body, and connection body - Google Patents

Description

  The present invention relates to an adhesive for circuit connection formed in a film shape, and in particular, an adhesive film manufactured as a film winding body wound around a reel and unwound when used, a film winding body, and the same. The present invention relates to a method for manufacturing a connection body.

  Conventionally, anisotropic conductive films (ACF: Anisortropic Conductive Film) have been used as means for connecting electronic components to circuit boards and the like. This anisotropic conductive film can be used for various purposes including connecting a terminal of a flexible printed circuit board (FPC) or an IC chip and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used for bonding and electrically connecting the terminals.

  As this anisotropic conductive film, generally, an epoxy resin-based insulating binder resin (adhesive) in which conductive particles are dispersed is used, for example, an IC chip terminal and ITO on a glass substrate. When the conductive particles are sandwiched between the electrodes and crushed, the electrical connection between the terminals of the IC chip and the ITO electrodes is realized, and the binder resin is cured in this state, whereby the IC A mechanical connection between the chip and the glass substrate is realized.

  The anisotropic conductive film 50 is a long film having a width of several millimeters. As shown in FIG. 6, the binder resin layer 51 containing conductive particles 56 is a release film such as PET (Poly Ethylene Terephthalate) at the time of manufacture. 1 and is wound around a core 53a of a reel 53 in a state of being supported by the release film 52 as shown in FIG. The anisotropic conductive film 50 is stored in a state of a film wound body 54 wound around a reel 53, and is pulled out from the reel 53 at the time of use, cut to a required length, and then connected to an electronic component. Provided.

JP 2005-26577 A

  In the anisotropic conductive film 50, the binder resin layer 51 supported by the release film 52 is attached to glass or a rigid substrate. At that time, the binder resin layer 51 is required to have tackiness. In order to achieve tackiness, the binder resin layer 51 is generally mixed with a large amount of liquid material.

  When the wound body 54 of the anisotropic conductive film 50 is pulled out from the reel 53, a tightening due to the tension occurs, and the stress due to the tightening increases as the winding core portion is formed. The stress increases as the anisotropic conductive film 50 wound around the reel 53 becomes longer.

  Here, when a lot of liquid material is blended in the binder resin layer 51, the viscosity is lowered. Therefore, when the anisotropic conductive film 50 is pulled out from the film winding body 54, particularly when a stress is generated in the central portion of the reel, The binder resin layer 51 is deformed to induce protrusion of the binder resin component. Furthermore, the protruding binder resin adheres to the flange 55 of the reel 53, and so-called blocking, in which the anisotropic conductive film 50 cannot be normally drawn out, occurs. This phenomenon tends to occur remarkably in an anisotropic conductive film having a particularly low viscosity.

  Further, if the anisotropic conductive film 50 is shortened in order to reduce the stress due to the tightening of the wound body 54, the replacement frequency of the reel 53 increases, and the line needs to be stopped each time. Resulting in.

  The present invention solves the above-mentioned problems in the prior art, and suppresses the protrusion of the binder resin component due to the tightening stress even when the tightening occurs due to the tension when the adhesive film is pulled out, so-called blocking. An object of the present invention is to provide an adhesive film, a film winding body, and a method of manufacturing a connection body using the same, which can prevent the occurrence of the above.

  In order to solve the above-described problems, an adhesive film according to the present invention is laminated on a first adhesive layer and the first adhesive layer, and is narrower than the first adhesive layer, and It has a 2nd adhesive bond layer whose viscosity in 30 degreeC is lower than the said 1st adhesive bond layer.

  In addition, the film winding body according to the present invention is a film winding body in which an adhesive film is wound in a reel shape, and the adhesive film is laminated on the first adhesive layer and the first adhesive layer. And a second adhesive layer having a narrower width than the first adhesive layer and a viscosity at 30 ° C. lower than that of the first adhesive layer.

  In the method for manufacturing a connection body according to the present invention, an adhesive film is temporarily attached to the first electronic component, and the second electronic component is disposed via the adhesive film. 2 and a step of curing the adhesive film, and the adhesive film is laminated on the first adhesive layer and the first adhesive layer, and the first adhesive A second adhesive layer having a narrower width than that of the first layer and a viscosity at 30 ° C. lower than that of the first adhesive layer, and affixing the second adhesive layer to the first electronic component To do.

  According to the present invention, when the second adhesive layer having a lower viscosity than the first adhesive layer has good tackiness and the anisotropic conductive film is formed as a film wound body, Even when the stress due to tightening is applied and the second adhesive layer having a lower viscosity is deformed, the binder resin of the second adhesive layer can be prevented from protruding from the side surface of the film wound body. Therefore, even if the anisotropic conductive film is elongated and the tightening stress increases, the occurrence of blocking due to the binder resin adhering to the reel flange is prevented.

FIG. 1 is a perspective view showing a film winding body to which the present invention is applied. FIG. 2 is a cross-sectional view showing an anisotropic conductive film to which the present invention is applied. FIG. 3 is a perspective view showing an anisotropic conductive film to which the present invention is applied. FIG. 4 is a perspective view showing an anisotropic conductive film in which a second adhesive layer composed of a plurality of dots is formed, and a state in which the dots of the anisotropic conductive film are crushed. FIG. 5 is a perspective view showing an anisotropic conductive film having a first adhesive layer composed of two layers of a conductive particle-containing layer and an insulating adhesive layer. FIG. 6 is a cross-sectional view showing a conventional anisotropic conductive film.

  Hereinafter, the manufacturing method of the adhesive film, film winding body, and connection body to which this invention was applied is demonstrated in detail, referring drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  A film winding body 1 to which the present invention is applied is formed by winding an adhesive film 2 around a reel 3 as shown in FIG.

[reel]
The reel 3 includes a cylindrical core 10 around which the adhesive film 2 is wound, and plate-like flanges 11 provided at both ends of the core 10. The winding core 10 has a shaft hole 10a into which a rotating shaft for rotating the reel 3 is inserted. One end of the adhesive film 2 in the longitudinal direction is connected to the core 10, and the adhesive film 2 is wound around the core 10.

  The core 10 and the flange 11 can be formed using, for example, various plastic materials. The flange 11 may be subjected to electrostatic treatment on the surface in contact with the adhesive film 2. Examples of the method for applying the electrostatic treatment include a method of applying a compound such as polythiophene to the flange 11.

[Adhesive film]
The adhesive film 2 wound around the reel 3 and constituting the film winding body 1 is an anisotropic conductive film (such as COG mounting for mounting electronic components on a circuit board or the like, FOG mounting for connecting substrates to each other) Examples thereof include ACF (Anisortropic Conductive Film) or a conductive adhesive film that connects a solar cell electrode and a tab wire.

  Hereinafter, the anisotropic conductive film 20 will be described as an example of the adhesive film 2. FIG. 2 is a cross-sectional view illustrating a configuration example of the anisotropic conductive film 20. The anisotropic conductive film 20 includes a release film 21 and a binder resin layer 22 formed on the release film 21. The anisotropic conductive film 20 is formed in a tape shape, and the core 10 and the flange 11 are wound around the core 10 sandwiched by the flange 11 so that the release film 21 is on the outer peripheral side. The film winding body 1 is comprised in the area | region formed by these.

[Peeling film]
The release film 21 is formed in a tape shape, for example, by applying a release agent such as silicone to a base material. The release film 21 prevents the anisotropic conductive film 20 from drying and maintains the shape of the anisotropic conductive film 20. Examples of the substrate used for the release film 21 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like.

[Binder resin layer]
As shown in FIG. 2 and FIG. 3, the binder resin layer 22 is laminated on the first adhesive layer 23 and the first adhesive layer 23, the width is narrower than the first adhesive layer 23, and And a second adhesive layer 24 having a viscosity at 30 ° C. lower than that of the first adhesive layer 23.

[First adhesive layer]
The first adhesive layer 23 is made of a normal binder resin containing a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, and the like, and conductive particles 25 are dispersed therein.

  The film-forming resin contained in the binder resin is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  It does not specifically limit as curable resin, For example, a commercially available epoxy resin, an acrylic resin, etc. are mentioned.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature There are a method of initiating a curing reaction by dissolving and dissolving with a resin, a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  The adhesive composition constituting the binder resin is not limited to the case where it contains a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc. You may make it consist of any material used as an agent composition.

[Conductive particles]
Examples of the conductive particles 25 include any known conductive particles used in the anisotropic conductive film 1. Examples of the conductive particles 25 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

[Second adhesive layer]
Similarly to the first adhesive layer 23, the second adhesive layer 24 laminated on the first adhesive layer 23 is also a film forming resin, a curable resin, a latent curing agent, a silane coupling agent, or the like. It consists of a normal binder resin containing. As shown in FIG. 3, the second adhesive layer 24 is formed to be narrower than the first adhesive layer 23 and has a viscosity at 30 ° C. lower than that of the first adhesive layer 23.

  Thereby, when the anisotropic conductive film 20 is formed as the film winding body 1, the second adhesive layer 24 having a lower viscosity is subjected to stress due to the tightening, and the second adhesive layer 24 having a lower viscosity is deformed. It is possible to prevent the binder resin of the adhesive layer 24 from protruding from the side surface of the film wound body 1. Therefore, in the anisotropic conductive film 20 and the film winding body 1 using the same, the binder resin adheres to the reel flange even when the anisotropic conductive film 20 is lengthened and the tightening stress increases. Occurrence of blocking is prevented.

  Further, since the anisotropic conductive film 20 has a viscosity of the second adhesive layer 24 at 30 ° C. lower than that of the first adhesive layer 23, the anisotropic conductive film 20 is drawn from the film winding body 1 and temporarily attached to a circuit member or the like. In this case, a good tackiness is exhibited as compared with an anisotropic conductive film composed only of the first adhesive layer 23. Therefore, temporary sticking can be reliably performed in a low temperature and low pressure in a short time.

  In addition, the temperature of 30 degreeC is an upper limit of the environmental temperature at the time of an anisotropic conductive film being normally pulled out from the winding body of an anisotropic conductive film.

[30 ° C viscosity ratio]
The viscosity of the second adhesive layer 24 at 30 ° C. is preferably 0.05 to 0.5 times the viscosity of the first adhesive layer 23 at 30 ° C. If it is less than 0.05 times, the fluidity is too large and blocking due to protrusion tends to occur, and if it is more than 0.5 times, the tackiness is insufficient, so that it is temporarily pasted at a low temperature, etc. This is because turning over occurs and the temporary sticking property is poor.

[Width of second adhesive layer]
The width of the second adhesive layer 24 is preferably 30% or more and 80% or less of the width of the first adhesive layer 23. If it is less than 30%, since the area is small at the time of temporary sticking, turning and misalignment may occur, and the temporary sticking property may be impaired. On the other hand, if it is larger than 80%, the second adhesive layer 24 is easily deformed by the stress generated when the anisotropic conductive film is pulled out from the film winding body 1, and the protrusion is likely to occur. In addition, there is a concern that the binder resin becomes excessive and harmful effects such as impairing the ability to capture particles between terminals.

[Production method]
The second adhesive layer 24 is formed as an insulating adhesive layer that does not contain conductive particles. That is, in the anisotropic conductive film 20, the second adhesive layer 24, which is an insulating adhesive layer, is laminated on the first adhesive layer 23, which is a conductive particle-containing layer.

  The anisotropic conductive film 20 may be produced by any method, but can be produced, for example, by the following method. An adhesive composition containing a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, conductive particles 25 and the like constituting the first adhesive layer 23 is prepared. Similarly, the adhesive composition constituting the second adhesive layer 24 is adjusted. Each adjusted adhesive composition was applied onto the release film 21 using a bar coater, an application device, and the like, and dried by an oven or the like, whereby the first adhesive layer 23 was laminated and supported on the release film 21. A second adhesive film in which the second adhesive layer 24 is laminated and supported on the adhesive film 1 and the release film 21 is obtained.

  The first and second adhesive films are appropriately slit, and then the first and second adhesive layers 23 and 24 are aligned and laminated. Thereby, the anisotropic conductive film 20 is obtained. The film winding body 1 is manufactured by winding the anisotropic conductive film 20 on the reel 3 by a predetermined length.

[Connection process]
In use, the anisotropic conductive film 20 is drawn out from the film winding body 1, cut into a predetermined length, and temporarily attached to a circuit board. At this time, in the anisotropic conductive film 20, the second adhesive layer 24 is formed to be narrower than the first adhesive layer 23, and the viscosity at 30 ° C. is lower than that of the first adhesive layer 23. Since it is formed, the binder resin of the second adhesive layer 24 does not protrude from the side surface of the film wound body 1 and is smoothly pulled out even when stress due to tightening is applied. Can do.

  The anisotropic conductive film 20 drawn out from the film winding body 1 has the second adhesive layer 24 temporarily attached to the circuit board. At this time, since the anisotropic conductive film 20 has a viscosity of the second adhesive layer 24 at 30 ° C. lower than that of the first adhesive layer 23, the anisotropic conductive film 20 is composed of only the first adhesive layer 23. Compared to film, it exhibits good tackiness. Therefore, temporary sticking can be reliably performed in a low temperature and low pressure in a short time.

  After the temporary attachment, the anisotropic conductive film 20 is subjected to main pressure bonding by heat-pressing or ultraviolet irradiation after the release film 21 is peeled off from the first adhesive layer 23 and various electronic parts such as IC chips are mounted. Provided to the process. Thereby, the connection body by which the electronic component was connected to the circuit board via the anisotropic conductive film 20 is manufactured.

  The anisotropic conductive film 20 may be formed with the second adhesive layer 24 as a conductive particle-containing layer.

[Second adhesive layer]
Further, as shown in FIG. 4, the second adhesive layer 24 may be constituted by a plurality of dots 24a. By comprising a plurality of dots 24a, a space is interposed between the dots 24a, so that each dot 24a is also within the space between the dots due to the stress generated when pulling out the anisotropic conductive film from the film winding body 1. It can only be deformed and prevent protrusion and blocking.

  Moreover, since the adhesive layer which flows at the time of mounting decreases by comprising by several dots, it can also be expected that the particle capturing efficiency is improved. Furthermore, the corresponding area can be maintained without increasing the amount of particles, and the short-circuit risk can be reduced.

  Such a second adhesive layer 24 is formed by, for example, screen-printing a binder resin on the first adhesive layer 23 using a nickel sheave having a predetermined opening diameter and pitch, and drying the binder resin. Can do. The shape of the dot 24a may be any shape such as a circle, an ellipse, and a rectangle, and the size, pitch, and the like can be appropriately designed.

  When the second adhesive layer 24 is constituted by a plurality of dots 24a, the width of the second adhesive layer 24 is the outermost side in the width direction of the first adhesive layer 23 when the dots 24a are formed. Is the distance between the dots 24a.

[First adhesive layer]
The anisotropic conductive film 20 includes a plurality of first adhesive layers 23 and at least one conductive particle-containing layer, and the second adhesive layer is formed on the conductive particle-containing layer. 24 may be laminated. For example, as shown in FIG. 5, the first adhesive layer 23 is formed by laminating a conductive adhesive layer 23a containing conductive particles 25 and an insulating adhesive layer 23b containing no conductive particles. It may be a two-layer structure. In this case, in the binder resin layer 22 of the anisotropic conductive film 20, the insulating adhesive layer 23b of the first adhesive layer 23 is supported by the release film 21, and the second adhesion is performed on the conductive particle-containing layer 23a. A three-layer structure in which the agent layer 24 is laminated. The second adhesive layer 24 may be a film or a dot, and may be an insulating adhesive layer or a conductive particle-containing layer.

  The conductive particle-containing layer 23a can be made of the same material as the first adhesive layer 23 described above, and the insulating adhesive layer 23b is a binder obtained by removing the conductive particles 25 from the conductive particle-containing layer 23a. It can be composed of the same material as the resin component.

  The first adhesive layer 23 is formed by applying and drying each adhesive composition constituting the conductive particle-containing layer 23a on a release film and drying each adhesive composition constituting the insulating adhesive layer 23b. After being applied to 21 and dried, the conductive particle-containing layer 23a and the insulating adhesive layer 23b can be laminated.

  Thereafter, the first adhesive layer 23 is anisotropic having the binder resin layer 22 having a three-layer structure by peeling the release film from the conductive particle-containing layer 23a and laminating the second adhesive layer 24. Conductive film 20 is obtained.

  Next, examples of the present invention will be described. In this example, a sample of an anisotropic conductive film formed by changing the components of the first adhesive layer and the second adhesive layer, and a sample of an anisotropic conductive film consisting only of the first adhesive layer The film winding bodies were respectively manufactured using and, and the protruding property at the time of drawing and the temporary sticking property to the substrate were measured and evaluated.

  As the binder resin layer constituting the first and second adhesive layers of the anisotropic conductive film, those shown in Table 1 were used.

[Example 1]
In Example 1, the material described in 1-1 in Table 1 serving as the first adhesive layer was dissolved in toluene and then applied onto a PET film subjected to a peeling treatment with a bar coater. The 1st adhesive film was created by making it dry for minutes. Next, after dissolving the materials described in Table 2-1 in Table 1 serving as the second adhesive layer in toluene, the material is applied onto a PET film which has been subjected to a peeling treatment with a bar coater and dried at 70 ° C. for 10 minutes. Thus, a second adhesive film was prepared.

  Next, after slitting the first adhesive film to a width of 1.0 mm and the second adhesive film to a width of 0.5 mm, respectively, the first adhesive layer is bonded to the first adhesive layer by laminating. An anisotropic conductive film in which a film-like second adhesive layer narrower than the layer was laminated was obtained. In the anisotropic conductive film according to Example 1, the second adhesive layer and the first adhesive layer are laminated so that the center in the width direction is substantially coincident (see FIG. 3).

  The viscosity of the first adhesive layer and the second adhesive layer was measured using a rotary rheometer (manufactured by TA Instruments) at a heating rate of 10 ° C./min, a measurement pressure of 0 to 5 g, a measurement plate diameter of 8 mm, and 1 Hz. The dynamic viscoelasticity measurement was performed under the conditions, and the viscosity at 30 ° C. was measured. In the anisotropic conductive film according to Example 1, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 600 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer = 0.03.

[Example 2]
In Example 2, the same conditions as in Example 1 were used except that the materials described in Table 2-2 were used as the second adhesive layer. In the anisotropic conductive film according to Example 2, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 1000 Pa · s / 30 ° C., and the second adhesive layer. Of the first adhesive layer / viscosity of the first adhesive layer = 0.05.

[Example 3]
In Example 3, the same conditions as in Example 1 were used except that the materials described in 2-3 in Table 1 were used as the second adhesive layer. In the anisotropic conductive film according to Example 3, the first adhesive layer has a viscosity of 20000 Pa · s / 30 ° C., the second adhesive layer has a viscosity of 2000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.1.

[Example 4]
In Example 4, it was set as the same conditions as Example 1 except having used the material of 2-4 in Table 1 as a 2nd adhesive bond layer. In the anisotropic conductive film according to Example 4, the first adhesive layer has a viscosity of 20000 Pa · s / 30 ° C., the second adhesive layer has a viscosity of 10,000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer = 0.5.

[Example 5]
In Example 5, it was set as the same conditions as Example 1 except having used the material of 2-5 in Table 1 as a 2nd adhesive bond layer. In the anisotropic conductive film according to Example 5, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 16000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.8.

[Example 6]
In Example 6, the same conditions as in Example 3 were used except that the second adhesive film was slit to a width of 0.2 mm. In the anisotropic conductive film according to Example 6, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.1.

[Example 7]
In Example 7, the same conditions as in Example 3 were used except that the second adhesive film was slit to a width of 0.3 mm. In the anisotropic conductive film according to Example 7, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.1.

[Example 8]
In Example 8, the same conditions as in Example 3 were used except that the second adhesive film was slit to a width of 0.8 mm. In the anisotropic conductive film according to Example 8, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.1.

[Example 9]
In Example 9, the conditions were the same as in Example 3 except that the second adhesive film was slit to a width of 0.9 mm. In the anisotropic conductive film according to Example 9, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., and the second adhesive layer. The viscosity of the first adhesive layer is 0.1.

[Example 10]
In Example 10, the material described in Table 1-1, which becomes the first adhesive layer, was dissolved in toluene and then applied onto a PET film subjected to a peeling treatment with a bar coater. The 1st adhesive film was created by making it dry for minutes. Next, the first adhesive film was slit to a width of 1.0 mm.

  Next, after dissolving the materials described in 2-3 in Table 1 serving as a second adhesive layer in toluene, openings 10 μm × 10 μm, 30 μm pitch on the first adhesive layer of the first adhesive film The screen was printed using a nickel sieve (manufactured by Tsutsui Rikagaku Co., Ltd.) and dried, so that the second adhesive layer composed of a plurality of dot-like binder resin layers was laminated on the first adhesive layer. An anisotropic conductive film was obtained (see FIG. 4).

  In the anisotropic conductive film according to Example 10, the second adhesive layer is disposed over a region having a width of 0.5 mm at the center in the width direction of the first adhesive layer, and the first adhesive layer and The layers are stacked so that the centers in the width direction are substantially matched. In the anisotropic conductive film according to Example 10, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., and the second adhesion is performed. The viscosity of the agent layer / the viscosity of the first adhesive layer = 0.1.

[Example 11]
In Example 11, as the first adhesive layer, a conductive adhesive layer using the material described in 1-2A in Table 1 and an insulating adhesive using the material described in 1-2N in Table 1 The conditions were the same as in Example 10, except that two adhesive layers were laminated.

  The first adhesive layer was prepared by dissolving the material described in 1-2A in Table 1 in toluene, and then applying it on a PET film subjected to a peeling treatment with a bar coater, followed by drying at 70 ° C. for 10 minutes. 1 conductive adhesive film was prepared. Next, after dissolving the material described in 1-2N in Table 1 in toluene, it was applied onto a PET film that had been subjected to a peeling treatment with a bar coater, and dried at 70 ° C. for 10 minutes to thereby form a first insulating adhesive film. It was created. The first conductive adhesive film and the first insulating adhesive film were each slit to a width of 1.0 mm, and then bonded together by a laminator to laminate the conductive adhesive layer and the insulating adhesive layer. A first adhesive film was obtained.

  Next, a second adhesive layer composed of a plurality of dot-like binder resin layers was laminated on the conductive adhesive layer of the first adhesive film in the same manner as in Example 10, and the anisotropic according to Example 11 was performed. Conductive film was obtained.

  In the anisotropic conductive film according to Example 11, the viscosity of the conductive adhesive layer of the first adhesive layer is 25000 Pa · s / 30 ° C., and the viscosity of the insulating adhesive layer of the first adhesive layer is 1500 Pa. S / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.1. The viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.1.

[Comparative Example 1]
In Comparative Example 1, an anisotropic conductive film consisting only of the first adhesive film using the material described in 1-1 in Table 1 was used as the first adhesive layer. In the anisotropic conductive film according to Comparative Example 1, the first adhesive layer was produced in the same manner as in Example 1, and slit to a width of 1.0 mm.

[Comparative Example 2]
In Comparative Example 2, the same conditions as in Comparative Example 1 were used except that the materials described in 1-3 in Table 1 were used as the first adhesive layer.

[Evaluation of protrusion]
Film wound bodies were manufactured by winding the anisotropic conductive films according to the above Examples and Comparative Examples by 100 m, 200 m, 250 m, and 300 m, respectively. The film winding body was pulled out, and a weight was applied to the tip, and the film was allowed to stand at 30 ° C. for 6 hours in a state where 50 g of tension was applied. Then, the anisotropic conductive film was pulled out and the occurrence of blocking was confirmed.

  The case where blocking occurred in a winding body of 100 m winding x, the case where blocking did not occur in a winding body of 100 m winding, Δ, the case where blocking did not occur in a winding body of 200 m winding, 250 m The case where no blocking occurred in the wound winding body was marked as ◎, and the case where no blocking occurred in the 300 m winding body was marked as ◎. Since blocking is more likely to occur as the winding distance is longer, a wound body that does not generate blocking and has a longer winding distance is better.

[Evaluation of temporary sticking properties]
Moreover, the temporary stickability at the time of temporarily sticking the anisotropic conductive film which concerns on each said Example and a comparative example to each glass substrate was evaluated. Temporary bonding of the anisotropic conductive film is performed by thermocompression bonding at a predetermined temporary pressure bonding temperature of 1 MPa for 1 second with a temporary pressure bonding machine having a tool width of 1.5 mm through a buffer material (Teflon (registered trademark), 150 μm thick). When this was done, the temperature at which the first and second adhesive layers were affixed without turning over was confirmed.

  The glass substrate on which the anisotropic conductive film was temporarily attached was ITO pattern glass having a thickness of 0.5 mm and a predetermined electrode pattern formed thereon.

  Even when the tool temperature is 70 ° C., the first or second adhesive layer is turned over, and the case where the temporary attachment could not be performed is x, the case where the tool temperature is 70 ° C. is Δ, the tool temperature is 50 ° C. The case where it was temporarily pasted with ◯ was marked as 〇, and the case where it was temporarily pasted at a tool temperature of 30 ° C was marked as ◎. An anisotropic conductive film is more preferable as the temporary bonding temperature is lower because tackiness is less likely to occur as the pressure bonding temperature is lower.

  As shown in Table 2, in each of Examples 1 to 11, the evaluation of the protruding property was Δ or more, and no blocking occurred in a wound body of 100 m or more. In Examples 1 to 11, although the second adhesive layer having a viscosity lower than that of the first adhesive layer is provided, the second adhesive layer is more than the first adhesive layer. Is formed narrowly, the binder resin component does not protrude from the film winding body even when the second adhesive layer is deformed due to the stress due to the tightening.

  In each of Examples 1 to 11, the temporary sticking property evaluation was Δ or more, and temporary sticking was possible at a tool temperature of 70 ° C. In Examples 1 to 11, a second adhesive layer having a lower tackiness and lower tackiness than the first adhesive layer is provided on the first adhesive layer, and this second adhesive is provided. Since the layer was temporarily attached to the glass substrate, the temporary attachment could be surely performed without occurrence of turning or the like even at a low temperature.

  On the other hand, in Comparative Example 1, since the anisotropic conductive film consisting only of the first adhesive film using the material described in Table 1-1 in Table 1 having a viscosity of 20000 Pa · s / 30 ° C. was used, the viscosity was high, Temporary sticking could not be done at a temporary sticking temperature of 70 ° C.

  In Comparative Example 2, since the anisotropic conductive film made only of the first adhesive film using the material described in 1-3 in Table 1 having a viscosity of 10,000 Pa · s / 30 ° C. was used, the viscosity was low, When pulling out the film of the 100 m winding body, a stress due to winding was applied, and blocking occurred due to the binder resin component of the first adhesive layer protruding from the film winding body.

  In Example 1, the viscosity of the second adhesive layer / viscosity of the first adhesive layer = 0.03, and the viscosity of the second adhesive layer was slightly low. Only the occurrence of blocking was suppressed. In Example 5, the viscosity of the second adhesive layer / viscosity of the first adhesive layer = 0.8, and the viscosity of the second adhesive layer was slightly high. Became possible.

  On the other hand, in Example 2, the viscosity of the second adhesive layer / viscosity of the first adhesive layer = 0.05, and the occurrence of blocking was suppressed even in a 200 m winding body. Then, the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.5, and temporary attachment was possible at a tool temperature of 50 ° C. Furthermore, in Example 3, viscosity of the second adhesive layer / viscosity of the first adhesive layer = 0.1, occurrence of blocking was suppressed even in a 300 m winding body, and the tool temperature was 30 ° C. The temporary sticking became possible.

  Accordingly, the viscosity of the second adhesive layer at 30 ° C. is preferably 0.05 to 0.5 times the viscosity of the first adhesive layer at 30 ° C., more preferably It turns out that it is 1 time.

  In Example 6, the width (0.2 mm) of the second adhesive layer was 20% of the width (1.0 mm) of the first adhesive layer, which was slightly too narrow. Can be pasted. In Example 9, the width (0.9 mm) of the second adhesive layer was 90% of the width (1.0 mm) of the first adhesive layer, which was slightly too wide. The occurrence of blocking was suppressed only in.

  On the other hand, Example 7 in which the width (0.3 mm) of the second adhesive layer was 30% of the width (1.0 mm) of the first adhesive layer, and the width (0. In Example 8 in which the width (8 mm) was 80% of the width (1.0 mm) of the first adhesive layer, the occurrence of blocking was suppressed even in a 200 m winding body, and the temporary bonding was performed at a tool temperature of 50 ° C. Became possible. From this, it can be seen that the width of the second adhesive layer is preferably 30% to 80% of the width of the first adhesive layer.

DESCRIPTION OF SYMBOLS 1 Film winding body, 2 Adhesive film, 3 Reel, 10 core, 10a Shaft hole, 11 Flange, 20 Anisotropic conductive film, 21 Release film, 22 Binder resin layer, 23 1st adhesive layer, 23a Conductivity Conductive particle-containing layer, 23b insulating adhesive layer, 24 second adhesive layer, 24a dots, 25 conductive particles

Claims (8)

A first adhesive layer;
Adhesion having a second adhesive layer laminated on the first adhesive layer and having a narrower width than the first adhesive layer and a viscosity at 30 ° C. lower than that of the first adhesive layer the film.   The adhesive film according to claim 1, wherein the viscosity of the second adhesive layer at 30C is 0.05 to 0.5 times the viscosity of the first adhesive layer at 30C.   The adhesive film according to claim 1 or 2, wherein a width of the second adhesive layer is 30 to 80% of a width of the first adhesive layer.   The adhesive film according to claim 1, wherein the second adhesive layer is constituted by a plurality of dots.   The adhesive film according to claim 1, wherein the first adhesive layer is a conductive particle-containing layer.   The first adhesive layer comprises a plurality of layers, at least one layer is a conductive particle-containing layer, and the second adhesive layer is laminated on the conductive particle-containing layer. The adhesive film according to any one of 5. In the film winding body in which the adhesive film is wound in a reel shape,
The adhesive film is laminated on the first adhesive layer and the first adhesive layer, has a narrower width than the first adhesive layer, and has a viscosity at 30 ° C. of the first adhesive layer. A film winding having a lower second adhesive layer. An adhesive film is temporarily attached to the first electronic component, a second electronic component is disposed via the adhesive film, the first electronic component and the second electronic component are pressure-bonded, and the adhesive film is attached. Having a step of curing;
The adhesive film is laminated on the first adhesive layer and the first adhesive layer, has a narrower width than the first adhesive layer, and has a viscosity at 30 ° C. of the first adhesive layer. A lower second adhesive layer,
A method for manufacturing a connection body, wherein the second adhesive layer is attached to the first electronic component.

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