JP6524283B2 - Adhesive film, film wound body, method of manufacturing connected body - Google Patents

Description

  The present invention relates to an adhesive for circuit connection formed into a film, and in particular, an adhesive film produced as a film wound around a reel and unwound at the time of use, and a film wound using the same. The present invention relates to a method of manufacturing a connector.

  Conventionally, an anisotropic conductive film (ACF: Anisotropic Conductive Film) is used as a means to connect an electronic component and a circuit board etc. This anisotropic conductive film is variously connected to, for example, the case of connecting a terminal of a flexible printed circuit (FPC) or an IC chip to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used when adhering and electrically connecting terminals of each other.

  Generally as this anisotropic conductive film, what disperse | distributed electroconductive particle in the insulating binder resin (adhesive agent) of an epoxy resin type is used, for example, ITO in the terminal of an IC chip, and a glass substrate The conductive particles are sandwiched and crushed between the electrodes, whereby the electrical connection between the terminal of the IC chip and the ITO electrode is realized, and by curing the binder resin in this state, the IC is produced. A mechanical connection between the chip and the glass substrate is realized.

The anisotropic conductive film 50 is a long film having a width of several mm, and as shown in FIG. 6, the binder resin layer 51 containing the conductive particles 56 at the time of production is a release film such as PET (Poly Ethylene Terephthalate) As shown in FIG. 1, the core 53 a is wound around a core 53 a of the reel 53 in a state where it is laminated on 52 and supported by the release film 52. The anisotropic conductive film 50 is stored in the state of the film wrapping 54 wound around a reel 53, pulled out from the reel 53 in use, cut to a required length, and then connected to electronic parts. Be served.

JP 2005-26577 A

  In the anisotropic conductive film 50, the binder resin layer 51 supported by the peeling film 52 is attached to glass, a rigid substrate or the like. At that time, the binder resin layer 51 is required to have tackiness. Generally, a large amount of liquid material is blended in the binder resin layer 51 in order to obtain tackiness.

  When the wound body 54 of the anisotropic conductive film 50 is pulled out from the reel 53, winding tightness occurs due to tension, and the stress due to the winding tightness becomes larger at the winding core. Further, this stress increases as the length of the anisotropic conductive film 50 wound around the reel 53 is longer.

  Here, when a large amount of liquid substance is mixed in the binder resin layer 51, the viscosity is lowered, so that when stress is generated particularly at the center of the reel when the anisotropic conductive film 50 is pulled out from the film wound body 54, The binder resin layer 51 is deformed to induce the protrusion of the binder resin component. Furthermore, the binder resin which has run out adheres to the flange 55 of the reel 53, so that so-called blocking, which can not properly pull out the anisotropic conductive film 50, occurs. This phenomenon tends to occur notably in an anisotropic conductive film having a low viscosity.

  In addition, if the anisotropic conductive film 50 is shortened to reduce stress due to winding tightness of the wound body 54, the frequency of replacement of the reels 53 increases, and it is necessary to stop the line each time, for example, the production efficiency decreases. Resulting in.

  The present invention solves the above-mentioned problems in the prior art, and suppresses the protrusion of the binder resin component due to the stress of the winding tightening even when the winding tightening occurs due to the tension when pulling out the adhesive film, so-called blocking An object of the present invention is to provide an adhesive film capable of preventing the occurrence of a film, a film wound body, and a method of manufacturing a connection body using the same.

In order to solve the problems described above, an adhesive film according to the present invention is an adhesive film for connecting a first electronic component and a second electronic component, comprising: a first adhesive layer; A second adhesive layer laminated to the adhesive layer and attached to the first electronic component, the second adhesive layer being narrower than the first adhesive layer, It has tackiness at a temporary bonding temperature of 30 ° C. to 70 ° C. to the first electronic component, and has a viscosity lower than that of the first adhesive layer.

  Further, in the film wound body according to the present invention, in the film wound body in which the adhesive film is wound in a reel shape, the adhesive film is laminated on the first adhesive layer and the first adhesive layer. A second adhesive layer which is narrower than the first adhesive layer and lower in viscosity at 30 ° C. than the first adhesive layer, and the first adhesive layer and At least one of the second adhesive layers is a conductive particle-containing layer.

Moreover, the method of manufacturing a connector according to the present invention is
The first electronic component and the second electronic component are pressed together with the adhesive film described above interposed therebetween, and the adhesive film is cured.

  According to the present invention, the second adhesive layer having a viscosity lower than that of the first adhesive layer has good tack, and when the anisotropic conductive film is formed as a film wound body, It is possible to prevent the binder resin of the second adhesive layer from protruding beyond the side surface of the film wrap even if stress due to tightening is applied and the second adhesive layer having a lower viscosity is deformed. Therefore, even if the anisotropic conductive film is elongated to increase the stress of winding, the occurrence of blocking due to the binder resin adhering to the reel flange is prevented.

FIG. 1 is a perspective view showing a film wrap to which the present invention is applied. FIG. 2 is a cross-sectional view showing an anisotropic conductive film to which the present invention is applied. FIG. 3 is a perspective view showing an anisotropic conductive film to which the present invention is applied. FIG. 4 is a perspective view showing an anisotropic conductive film on which a second adhesive layer composed of a plurality of dots is formed, and a state in which the dots of the anisotropic conductive film are crushed. FIG. 5 is a perspective view showing an anisotropic conductive film having a first adhesive layer composed of two layers of a conductive particle-containing layer and an insulating adhesive layer. FIG. 6 is a cross-sectional view showing a conventional anisotropic conductive film.

  Hereinafter, a method of manufacturing an adhesive film, a film wound body, and a connector to which the present invention is applied will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments, and it goes without saying that various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios among the drawings are included.

  The film wrap 1 to which the present invention is applied is formed by winding the adhesive film 2 around the reel 3 as shown in FIG.

[reel]
The reel 3 includes a cylindrical core 10 on which the adhesive film 2 is wound, and plate-like flanges 11 provided at both ends of the core 10. The winding core 10 has an axial hole 10 a into which a rotation shaft for rotating the reel 3 is inserted. One end of the adhesive film 2 in the longitudinal direction is connected to the winding core 10, and the adhesive film 2 is wound.

  The core 10 and the flange 11 can be formed, for example, using various plastic materials. The surface of the flange 11 in contact with the adhesive film 2 may be subjected to electrostatic treatment. As a method of performing an electrostatic process, the method of apply | coating compounds, such as a polythiophene, to the flange 11 is mentioned, for example.

[Adhesive film]
An anisotropic conductive film (COG mounting for mounting electronic components on a circuit board or the like, FOG mounting for connecting boards, etc.) as the adhesive film 2 wound around the reel 3 to constitute the film wound body 1 ACF: Anisotropic Conductive Film), or a conductive adhesive film connecting the electrode of the solar cell and the tab wire is exemplified.

  Below, the anisotropic conductive film 20 is demonstrated to an example as the adhesive film 2. FIG. FIG. 2 is a cross-sectional view showing a configuration example of the anisotropic conductive film 20. As shown in FIG. The anisotropic conductive film 20 includes a peeling film 21 and a binder resin layer 22 formed on the peeling film 21. The anisotropic conductive film 20 is formed in a tape shape, and wound around the core 10 held by the flange 11 so that the release film 21 is on the outer peripheral side, whereby the core 10 and the flange 11 are formed. The film wrap 1 is formed in the area formed by

[Peeling film]
The release film 21 is, for example, a substrate on which a release agent such as silicone is applied, and is formed into a tape shape. The release film 21 prevents the anisotropic conductive film 20 from drying and maintains the shape of the anisotropic conductive film 20. Examples of the substrate used for the release film 21 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly 4-methylpentene-1), and PTFE (Polytetrafluoroethylene).

[Binder resin layer]
As shown in FIGS. 2 and 3, the binder resin layer 22 is laminated on the first adhesive layer 23 and the first adhesive layer 23, and has a width smaller than that of the first adhesive layer 23, and It has a second adhesive layer 24 whose viscosity at 30 ° C. is lower than that of the first adhesive layer 23.

[First adhesive layer]
The first adhesive layer 23 is made of a normal binder resin containing a film forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc. The conductive particles 25 are dispersed.

  As a film forming resin contained in the binder resin, a resin having an average molecular weight of about 10000 to 80000 is preferable. Examples of the film-forming resin include various resins such as epoxy resin, modified epoxy resin, urethane resin, and phenoxy resin. Among them, phenoxy resins are particularly preferable from the viewpoint of film formation state, connection reliability and the like.

  It does not specifically limit as curable resin, For example, a commercially available epoxy resin, an acrylic resin, etc. are mentioned.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin And naphthol type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, a liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-Diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, epoxy acrylate and the like can be mentioned. In addition, what used the acrylate for the methacrylate can also be used. These may be used alone or in combination of two or more.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as heat curing type and UV curing type. The latent curing agent usually does not react, and is activated by various triggers selected according to applications such as heat, light, pressurization and the like to initiate the reaction. The activation method of the heat activated latent curing agent is a method of generating active species (cation, anion, radical) by dissociation reaction by heating, etc. It is stably dispersed in epoxy resin at around room temperature and epoxy at high temperature There is a method of starting the curing reaction by dissolving or dissolving the resin and starting the curing reaction, a method of eluting the curing agent of molecular sieve encapsulation type at high temperature to start the curing reaction, a dissolution and curing method using microcapsules, and the like. The heat activated latent curing agents include imidazoles, hydrazides, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamides and the like, and modified products thereof. It may be a mixture of the above. Among them, microcapsule-type imidazole-based latent curing agents are preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. The addition of the silane coupling agent improves the adhesion at the interface between the organic material and the inorganic material.

  The adhesive composition that constitutes the binder resin is not limited to the case where it contains a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc. You may make it consist of any material used as an agent composition.

[Conductive particles]
Examples of the conductive particles 25 include any known conductive particles used in the anisotropic conductive film 1. Examples of the conductive particles 25 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxides, carbon, graphite, glass, ceramic, What coated metal on the surface of particles, such as a plastic, or what coated the insulating thin film on the surface of these particles etc. is mentioned. When the surface of a resin particle is coated with a metal, examples of the resin particle include epoxy resin, phenol resin, acrylic resin, acrylonitrile styrene (AS) resin, benzoguanamine resin, divinyl benzene resin, styrene resin, etc. The particle of can be mentioned.

[Second adhesive layer]
Similarly to the first adhesive layer 23, the second adhesive layer 24 laminated to the first adhesive layer 23 also includes a film forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc. And a conventional binder resin containing As shown in FIG. 3, the second adhesive layer 24 is formed narrower than the first adhesive layer 23, and the viscosity at 30 ° C. is lower than that of the first adhesive layer 23.

  Thereby, when the anisotropic conductive film 20 is formed as the film wound body 1, stress is applied by winding tightness, and the second adhesive layer 24 having a lower viscosity is deformed even if the second adhesive layer 24 is deformed. The binder resin of the adhesive layer 24 can be prevented from coming out of the side surface of the film package 1. Therefore, in the anisotropic conductive film 20 and the film wound body 1 using the same, the binder resin adheres to the reel flange even when the anisotropic conductive film 20 is elongated and the stress of the winding tightening is increased. Possibility of blocking is prevented.

  Moreover, since the viscosity at 30 ° C. of the second adhesive layer 24 is lower than that of the first adhesive layer 23, the anisotropic conductive film 20 is drawn from the film package 1 and temporarily attached to a circuit member or the like. In addition to the anisotropic conductive film consisting only of the first adhesive layer 23, it exhibits good tackiness. Therefore, temporary pasting can be performed reliably at a low temperature and a low pressure in a short time.

  The temperature of 30 ° C. is usually the upper limit of the environmental temperature when the anisotropic conductive film is pulled out of the winding body of the anisotropic conductive film.

[30 ° C viscosity ratio]
The viscosity at 30 ° C. of the second adhesive layer 24 is preferably 0.05 times or more and 0.5 times or less the viscosity at 30 ° C. of the first adhesive layer 23. If it is less than 0.05 times, the flowability is too large, blocking tends to occur due to extrusion, and if it is more than 0.5 times, tackiness is insufficient, so the case of temporary sticking at low temperature, etc. This is because curling and the like occur and the temporary sticking property is inferior.

[Width of second adhesive layer]
The width of the second adhesive layer 24 is preferably 30% to 80% of the width of the first adhesive layer 23. If it is less than 30%, the area is small at the time of temporary bonding, so there is a risk of turning over, positional deviation, and the like, and the temporary bonding property may be impaired. If it is more than 80%, the second adhesive layer 24 is easily deformed due to the stress generated when pulling out the anisotropic conductive film from the film package 1, and the main pressure bonding step Also, there is a concern that the binder resin is excessive, which may impair the particle capture between the terminals.

[Manufacturing method]
The second adhesive layer 24 is formed as an insulating adhesive layer not containing conductive particles. That is, in the anisotropic conductive film 20, the second adhesive layer 24 which is an insulating adhesive layer is laminated on the first adhesive layer 23 which is a conductive particle-containing layer.

  The anisotropic conductive film 20 may be produced by any method, but can be produced, for example, by the following method. An adhesive composition containing a film forming resin, a curable resin, a latent curing agent, a silane coupling agent, conductive particles 25 and the like constituting the first adhesive layer 23 is prepared. Similarly, the adhesive composition constituting the second adhesive layer 24 is adjusted. A first adhesive layer 23 is laminated and supported on the release film 21 by applying the adjusted adhesive composition onto the release film 21 using a bar coater, a coating device or the like, and drying using an oven or the like. A second adhesive film is obtained in which the second adhesive layer 24 is laminated and supported on the first adhesive film and the release film 21.

  The first and second adhesive films are appropriately slit to a predetermined width, and then the first and second adhesive layers 23 and 24 are aligned and laminated. Thereby, the anisotropic conductive film 20 is obtained. The film wound body 1 is manufactured by winding the anisotropic conductive film 20 around the reel 3 to a predetermined length.

[Connection process]
In use, the anisotropic conductive film 20 is pulled out of the film package 1, cut to a predetermined length, and temporarily attached to a circuit board. At this time, in the anisotropic conductive film 20, the second adhesive layer 24 is formed narrower than the first adhesive layer 23, and the viscosity at 30 ° C. is lower than that of the first adhesive layer 23. Since it is formed, the binder resin of the second adhesive layer 24 is pulled out smoothly from the side of the film package 1 and blocking does not occur even when stress due to tightening is applied. Can.

  The second adhesive layer 24 of the anisotropic conductive film 20 drawn out of the film package 1 is temporarily attached to the circuit board. At this time, since the anisotropic conductive film 20 has a viscosity at 30 ° C. of the second adhesive layer 24 lower than that of the first adhesive layer 23, the anisotropic conductive film 20 is composed of only the first adhesive layer 23. It exhibits good tackiness as compared to a film. Therefore, temporary pasting can be performed reliably at a low temperature and a low pressure in a short time.

  After temporary attachment, after the peeling film 21 is peeled off from the first adhesive layer 23 and various electronic parts such as IC chips are mounted, the anisotropic conductive film 20 is subjected to main pressure bonding by heat pressure, ultraviolet irradiation, etc. It is subjected to the process. Thereby, a connection body in which the electronic component is connected to the circuit board via the anisotropic conductive film 20 is manufactured.

  The anisotropic conductive film 20 may form the second adhesive layer 24 as a conductive particle-containing layer.

[Second adhesive layer]
Further, as shown in FIG. 4, the second adhesive layer 24 may be constituted by a plurality of dots 24 a. By forming the plurality of dots 24a, there is a space between the dots 24a, so each dot 24a is also in the space between the dots due to the stress generated when pulling out the anisotropic conductive film from the film package 1. It can be deformed, and it can prevent the protrusion and blocking.

  In addition, since the adhesive layer flowing at the time of mounting is reduced by forming the plurality of dots, it can be expected that the particle capture efficiency is improved. Furthermore, the corresponding area can be maintained without increasing the amount of particles, and the short risk can be reduced.

  Such a second adhesive layer 24 is formed, for example, by screen printing a binder resin on the first adhesive layer 23 using a nickel sieve having a predetermined opening diameter and pitch, and then drying it. Can. The shape of the dot 24a may be any shape such as a circle, an ellipse, or a square, and the size, the pitch, and the like can be appropriately designed.

  When the second adhesive layer 24 is constituted by a plurality of dots 24 a, the width of the second adhesive layer 24 means the outermost side in the width direction of the first adhesive layer 23 at the time of formation of the dots 24 a. Refers to the distance between dots 24a.

[First adhesive layer]
Further, in the anisotropic conductive film 20, the first adhesive layer 23 is formed of a plurality of layers and at least one layer is used as a conductive particle containing layer, and a second adhesive layer is formed on the conductive particle containing layer. 24 may be stacked. For example, as shown in FIG. 5, the first adhesive layer 23 is formed by laminating a conductive adhesive layer 23a containing conductive particles 25 and an insulating adhesive layer 23b not containing conductive particles. It may be a two-layer structure. In this case, in the binder resin layer 22 of the anisotropic conductive film 20, the insulating adhesive layer 23b of the first adhesive layer 23 is supported by the release film 21, and the second adhesion is performed on the conductive particle-containing layer 23a. It becomes a three-layer structure in which the agent layer 24 is laminated. The second adhesive layer 24 may be in the form of a film or a dot, and may be either an insulating adhesive layer or a conductive particle-containing layer.

  The conductive particle-containing layer 23a can be made of the same material as the first adhesive layer 23 described above, and the insulating adhesive layer 23b is a binder obtained by removing the conductive particles 25 from the conductive particle-containing layer 23a. It can be composed of the same material as the resin component.

  The first adhesive layer 23 applies each adhesive composition constituting the conductive particle-containing layer 23 a to a peeling film and dries the same, and peels off each adhesive composition constituting the insulating adhesive layer 23 b After coating and drying on 21, the conductive particle-containing layer 23 a and the insulating adhesive layer 23 b can be laminated.

  Thereafter, in the first adhesive layer 23, the peeling film is peeled off from the conductive particle-containing layer 23a, and the second adhesive layer 24 is laminated, so that the first adhesive layer 23 has the three-layer binder resin layer 22 Conductive conductive film 20 is obtained.

  Next, examples of the present invention will be described. In this example, a sample of an anisotropic conductive film formed by changing the components of the first adhesive layer and the second adhesive layer, and a sample of an anisotropic conductive film consisting only of the first adhesive layer Film wound bodies were manufactured, and the protrusion property at the time of withdrawal and the temporary sticking property to the substrate were measured and evaluated.

  What was shown in Table 1 was used as a binder resin layer which comprises the 1st, 2nd adhesive bond layer of an anisotropic conductive film.

Example 1
In Example 1, the material described in 1-1 in Table 1 to be the first adhesive layer is dissolved in toluene, and then coated on a PET film which has been subjected to release treatment with a bar coater, at 70 ° C. 10 The first adhesive film was made by drying for a minute. Next, the material described in 2-1 in Table 1 to be the second adhesive layer is dissolved in toluene, and then it is coated on a peeling-treated PET film with a bar coater and dried at 70 ° C. for 10 minutes To produce a second adhesive film.

  Next, after slitting the first adhesive film to a width of 1.0 mm and the second adhesive film to a width of 0.5 mm, a first adhesive is formed on the first adhesive layer by bonding using a laminator. The anisotropic conductive film in which the film-like 2nd adhesive bond layer narrower than a layer was laminated | stacked was obtained. In the anisotropic conductive film according to Example 1, the second adhesive layer is laminated such that the center in the width direction substantially coincides with that of the first adhesive layer (see FIG. 3).

  The viscosity of the first adhesive layer and the second adhesive layer was measured using a rotary rheometer (manufactured by TA Instruments) at a temperature rising rate of 10 ° C./min, a measurement pressure of 0 to 5 g, and a measurement plate diameter of 8 mm, 1 Hz Dynamic viscoelasticity measurement was performed under the following conditions, and the viscosity at 30 ° C. was measured. The anisotropic conductive film according to Example 1 had a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 600 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.03.

Example 2
In Example 2, the same conditions as in Example 1 were used except that the materials described in 2-2 in Table 1 were used as the second adhesive layer. The anisotropic conductive film according to Example 2 has a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 1000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.05.

[Example 3]
In Example 3, the same conditions as in Example 1 were used except that the materials described in 2-3 in Table 1 were used as the second adhesive layer. In the anisotropic conductive film according to Example 3, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., the second adhesive layer Viscosity of the first adhesive layer = 0.1.

Example 4
In Example 4, the same conditions as in Example 1 were used except that the materials described in 2-4 in Table 1 were used as the second adhesive layer. In the anisotropic conductive film according to Example 4, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 10000 Pa · s / 30 ° C., the second adhesive layer Of the first adhesive layer = 0.5.

[Example 5]
In Example 5, the same conditions as in Example 1 were used except that the materials described in 2-5 in Table 1 were used as the second adhesive layer. The anisotropic conductive film according to Example 5 had a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 16000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.8.

[Example 6]
In Example 6, the conditions were the same as in Example 3 except that the second adhesive film was slit to a width of 0.2 mm. In the anisotropic conductive film according to Example 6, the viscosity of the first adhesive layer is 20000 Pa · s / 30 ° C., the viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., the second adhesive layer Viscosity of the first adhesive layer = 0.1.

[Example 7]
In Example 7, conditions were the same as in Example 3 except that the second adhesive film was slit to a width of 0.3 mm. The anisotropic conductive film according to Example 7 had a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 2000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.1.

[Example 8]
In Example 8, the conditions were the same as in Example 3 except that the second adhesive film was slit to a width of 0.8 mm. The anisotropic conductive film according to Example 8 had a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 2000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.1.

[Example 9]
In Example 9, conditions were the same as in Example 3 except that the second adhesive film was slit to a width of 0.9 mm. The anisotropic conductive film according to Example 9 had a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 2000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer Viscosity of the first adhesive layer = 0.1.

[Example 10]
In Example 10, the material described in 1-1 in Table 1 to be the first adhesive layer is dissolved in toluene, and then coated on a PET film subjected to release treatment with a bar coater at 70 ° C. 10 The first adhesive film was made by drying for a minute. Next, the first adhesive film was slit to a width of 1.0 mm.

  Then, after dissolving the material described in 2-3 in Table 1 as a second adhesive layer in toluene, openings 10 μm × 10 μm, 30 μm pitch on the first adhesive layer of the first adhesive film By screen printing using a nickel sieve (manufactured by Tsutsui Rikagaku Co., Ltd.) and drying it, the second adhesive layer consisting of a plurality of dot-like binder resin layers is laminated to the first adhesive layer. A directional conductive film was obtained (see FIG. 4).

  In the anisotropic conductive film according to Example 10, the second adhesive layer is disposed over the area of 0.5 mm in width at the center in the width direction of the first adhesive layer, and the first adhesive layer The centers in the width direction are substantially aligned and stacked. The anisotropic conductive film according to Example 10 has a viscosity of 20000 Pa · s / 30 ° C. for the first adhesive layer, a viscosity of 2000 Pa · s / 30 ° C. for the second adhesive layer, and a second adhesive layer. The viscosity of the agent layer / the viscosity of the first adhesive layer is 0.1.

[Example 11]
In Example 11, the conductive adhesive layer using the material described in 1-2A in Table 1 as the first adhesive layer, and the insulating adhesive using the material described in 1-2N in Table 1 The conditions were the same as in Example 10, except that a two-layered adhesive layer was used.

  The first adhesive layer was prepared by dissolving the material described in 1-2A in Table 1 in toluene, applying it on a PET film which had been subjected to release treatment with a bar coater, and drying it at 70 ° C. for 10 minutes. A conductive adhesive film of 1 was made. Then, after dissolving the material described in 1-2N in Table 1 in toluene, it is coated on a PET film which has been subjected to release treatment with a bar coater, and dried at 70 ° C. for 10 minutes to obtain a first insulating adhesive film It was created. The first conductive adhesive film and the first insulating adhesive film were respectively slit to a width of 1.0 mm, and then pasted with a laminator, the conductive adhesive layer and the insulating adhesive layer were laminated. The first adhesive film was obtained.

  Next, on the conductive adhesive layer of the first adhesive film, a second adhesive layer consisting of a plurality of dot-like binder resin layers is laminated in the same manner as in Example 10, and the anisotropy according to Example 11 Conductive film was obtained.

  The anisotropic conductive film according to Example 11 had a viscosity of 25000 Pa · s / 30 ° C. for the conductive adhesive layer of the first adhesive layer, and a viscosity of 1500 Pa for the insulating adhesive layer of the first adhesive layer. The viscosity of the second adhesive layer is 2000 Pa · s / 30 ° C., the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.1. The viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.1.

Comparative Example 1
In the comparative example 1, the anisotropic conductive film which consists only of a 1st adhesive film using the material of 1-1 in Table 1 as a 1st adhesive bond layer was used. The anisotropic conductive film which concerns on the comparative example 1 manufactured the 1st adhesive bond layer similarly to Example 1, and slitted 1.0 mm in width | variety.

Comparative Example 2
In Comparative Example 2, the same conditions as Comparative Example 1 were used except that the materials described in 1-3 in Table 1 were used as the first adhesive layer.

[Evaluation of extrusion property]
The film wound body which wound the anisotropic conductive film which concerns on the said each Example and comparative example 100 m, 200 m, 250 m, and 300 m, respectively was manufactured. The film package was pulled out, a weight was attached to the tip, and it was allowed to stand at 30 ° C. for 6 hours with a tension of 50 g. Thereafter, the anisotropic conductive film was pulled out to confirm the occurrence of blocking.

  When blocking occurs in the 100m-winding package x, in the case where blocking does not occur in the 100m-winding winding, △, when blocking does not occur in the 200-m-around winding ○, 250 m The case where blocking did not occur in the winding body of the winding was ◎, and the case where blocking did not occur in the winding body of the 300 m winding was ◎ ◎. Since the blocking is more likely to occur as the winding distance is longer, the longer the winding distance is, the better the winding is free of blocking.

[Evaluation of temporary stickability]
Moreover, it evaluated about temporary sticking property at the time of temporarily sticking the anisotropic conductive film which concerns on said each Example and comparative example by thermocompression bonding to a glass substrate, respectively. The temporary adhesion of the anisotropic conductive film is performed by using a buffer material (Teflon (registered trademark), 150 μm thickness) and a thermal compression bonding at a predetermined temporary compression temperature for 1 MPa and 1 second with a temporary bonding machine with a tool width of 1.5 mm. When it did, temperature attached was confirmed, without causing the 1st and 2nd adhesive bond layers and the like.

  As a glass substrate on which the anisotropic conductive film is temporarily attached, an ITO pattern glass having a thickness of 0.5 mm and a predetermined electrode pattern formed thereon was used.

  Then, even if the tool temperature is 70 ° C., the first or second adhesive layer may be curled up, and the case where temporary attachment is not possible is x, the case where temporary attachment is possible at the tool temperature 70 ° C. In the case where temporary attachment was possible, the case where temporary attachment was possible at a tool temperature of 30 ° C. was ◎. The lower the temporary bonding temperature, the better the anisotropic conductive film, as tackiness is less likely to occur as the pressure bonding temperature is lower.

  As shown in Table 2, in each of Examples 1 to 11, the evaluation of the protrusion property was Δ or more, and no blocking occurred in a winding body of 100 m or more. This is because in Examples 1 to 11, although the second adhesive layer having a viscosity lower than that of the first adhesive layer is provided, the second adhesive layer is more than the first adhesive layer. Because the width is too narrow, the binder resin component does not protrude from the film wound body even when the stress due to tightening is applied and the second adhesive layer is deformed.

  Moreover, in Examples 1-11, evaluation of temporary stickability of all was (triangle | delta) or more, and temporary sticking was possible at 70 degreeC of tool temperature. In Examples 1 to 11, the first adhesive layer is provided with a second adhesive layer having a viscosity lower than that of the first adhesive layer and having good tackiness, and this second adhesive Since the layer was temporarily attached to the glass substrate, it was possible to perform the temporary attachment reliably at low temperature without causing curling or the like.

  On the other hand, in Comparative Example 1, since the anisotropic conductive film made of only the first adhesive film using the material described in 1-1 in Table 1 having a viscosity of 20000 Pa · s / 30 ° C. is used, the viscosity is high. Temporary sticking temperature could not be temporarily attached at 70 ° C.

  Further, in Comparative Example 2, since the anisotropic conductive film formed of only the first adhesive film using the material described in 1-3 in Table 1 having a viscosity of 10000 Pa · s / 30 ° C. is used, the viscosity is low. At the time of drawing out the film of the winding body of 100 m winding, stress by winding tightness was applied, and blocking occurred due to the binder resin component of the first adhesive layer protruding from the film winding body.

  In Example 1, the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.03, and the viscosity of the second adhesive layer was a little low. Only the occurrence of blocking was suppressed. Further, in Example 5, since the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.8, and the viscosity of the second adhesive layer was somewhat high, temporary sticking was performed at a tool temperature of 70 ° C. It became possible.

  On the other hand, in Example 2, with the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.05, the occurrence of blocking is suppressed also in the winding body of 200 m winding, and Example 4 In this case, with the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.5, temporary sticking was possible at a tool temperature of 50 ° C. Furthermore, in Example 3, with the viscosity of the second adhesive layer / the viscosity of the first adhesive layer = 0.1, the occurrence of blocking is suppressed even in the winding body of 300 m, and the tool temperature is 30 ° C. It became possible to paste temporarily.

  From this, the viscosity at 30 ° C. of the second adhesive layer is preferably 0.05 times or more and 0.5 times or less the viscosity at 30 ° C. of the first adhesive layer, more preferably 0. It turns out that it is 1 time.

  Further, in Example 6, since the width (0.2 mm) of the second adhesive layer was a little too narrow, 20% of the width (1.0 mm) of the first adhesive layer, the tool temperature was 70 ° C. It became possible to paste. In Example 9, the width (0.9 mm) of the second adhesive layer was a little too wide as 90% of the width (1.0 mm) of the first adhesive layer, so a 100 m-rolled body was obtained. The occurrence of blocking was suppressed only at.

  On the other hand, in Example 7 in which the width (0.3 mm) of the second adhesive layer was 30% of the width (1.0 mm) of the first adhesive layer, the width of the second adhesive layer (0. 1). In Example 8 in which 8 mm) is 80% of the width (1.0 mm) of the first adhesive layer, the occurrence of blocking is suppressed even in a wound body of 200 m winding, and temporary sticking is performed at a tool temperature of 50 ° C. It became possible. From this, it is understood that the width of the second adhesive layer is preferably 30% or more and 80% or less of the width of the first adhesive layer.

DESCRIPTION OF SYMBOLS 1 film winding body, 2 adhesive films, 3 reels, 10 cores, 10a axial hole, 11 flanges, 20 anisotropic conductive film, 21 peeling film, 22 binder resin layer, 23 1st adhesive layer, 23a electric conduction Particle-containing layer, 23b insulating adhesive layer, 24 second adhesive layer, 24a dots, 25 conductive particles

Claims (12)

An adhesive film for connecting a first electronic component and a second electronic component, comprising:
A first adhesive layer,
A second adhesive layer laminated on the first adhesive layer and attached to the first electronic component;
The second adhesive layer is narrower than the first adhesive layer, and has tackiness at a temporary bonding temperature of 30 ° C. or more and 70 ° C. or less to the first electronic component, and the second adhesive layer Lower viscosity than 1 adhesive layer,
Adhesive film. The second adhesive layer has tackiness under temporary sticking conditions of pressure bonding pressure to the first electronic component: 1 MPa, pressure bonding time: 1 second, pressure bonding temperature: 30 ° C., 50 ° C. or 70 ° C. The adhesive film according to claim 1 , wherein the viscosity is lower than that of the first adhesive layer. The first at least one of the adhesive layer and the second adhesive layer, adhesive film according to claim 1 or 2 is a conductive particle-containing layer. The adhesive film according to any one of claims 1 to 3 , wherein the first adhesive layer has a tackiness lower than the second adhesive layer at the temporary sticking temperature. The adhesive film according to any one of claims 1 to 4 is wound on a reel of film wound body. In a film case in which an adhesive film is wound in a reel shape,
The adhesive film is laminated on a first adhesive layer and the first adhesive layer, is narrower than the first adhesive layer, and has a viscosity at 30 ° C. of the first adhesive layer. Having a second adhesive layer lower than
At least one of the first adhesive layer and the second adhesive layer is a conductive particle-containing layer,
Film wrap. The film wrap according to claim 5 or 6 , wherein the viscosity at 30 ° C of the second adhesive layer is 0.05 to 0.5 times the viscosity at 30 ° C of the first adhesive layer. The film wound body according to any one of claims 5 to 7 , wherein a width of the second adhesive layer is 30 to 80% of a width of the first adhesive layer. The film winding body according to any one of claims 5 to 8 , wherein the second adhesive layer is constituted by a plurality of dots. The film wound body according to any one of claims 5 to 9 , wherein the adhesive film has a multilayer structure in which three or more adhesive layers are laminated. A connector having a step of pressing the first electronic component and the second electronic component with the adhesive film according to any one of claims 1 to 10 interposed therebetween and curing the adhesive film. Production method. The first electronic component and the second electronic component manufacturing method of the connecting body according to claim 11, wherein the terminal portions of each other which are formed a plurality are electrically connected via the above adhesive film.

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