JP5981173B2 - Manufacturing method of connection body, bonding method of adhesive film, drawing method of adhesive film, and adhesive film - Google Patents

Description

The present invention relates to adhesive film adhesive film tape-like is wound on the reel member and said reel member is wound, the connection body can improve the bonding of the adhesive film, especially by improving the reel member The present invention relates to a manufacturing method, an adhesive film bonding method, an adhesive film drawing method, and an adhesive film.

  Conventionally, a mounting method has been used in which an electronic component is mounted on a substrate using an adhesive film. For example, a COG (Chip on Glass) mounting method in which an IC chip that is a liquid crystal driving circuit is mounted on a peripheral portion of a liquid crystal display panel (LCD panel) via a conductive adhesive film, or a tab serving as an interconnector in a solar cell The connection method which connects a line is mentioned.

  In the conductive adhesive film, an insulating adhesive layer in which conductive particles are dispersed is formed on a base film serving as a support. Such a conductive adhesive film 50 is used in the form of a reel wound body wound around a core 53 of a reel member 51 having a reel flange 52 as shown in FIG. Reference 1).

  When the electronic component is mounted, the conductive adhesive film 50 is first drawn from the reel member 51 and drawn on the electrode of the substrate to be connected, and then the adhesive layer is attached on the electrode. Is done. For example, as shown in FIG. 10, the conductive adhesive film 50 is attached to the substrate over the entire attachment region R between the conductive adhesive film 50 and the electrode 57 formed on the substrate 56 using a heating and pressing head 55. Simultaneously, a predetermined pressure is applied and predetermined heat is applied to the conductive adhesive film 50.

  Next, the base film of the conductive adhesive film 50 is peeled off, and the connection terminal of the electronic component is placed on the exposed adhesive layer. Thereafter, when the conductive adhesive film 50 is heated and pressed through the electronic component, the adhesive layer softens and flows out from between the electrode of the substrate and the connection terminal of the electronic component, and the conductive particles are sandwiched. It is cured in this state. Thereby, the conductive adhesive film 50 can electrically and mechanically connect the electrode of the substrate and the connection terminal of the electronic component.

JP 2001-171033 A

  However, in the conventional mounting method using the conductive adhesive film 50, when the conductive adhesive film 50 drawn out from the reel member 51 is stuck on the electrode 57 of the substrate 56, the heat pressing head 55 performs the conductive operation. The adhesive film 50 is simultaneously pressed on the entire sticking region R of the substrate. For this reason, bubbles may be involved between the electrode 57 of the substrate 56 and the adhesive layer, and the adhesive layer may not be adhered to the substrate 56 due to the remaining bubbles. Further, if bubbles remain between the electrode 57 of the substrate 56 and the adhesive layer, the bubbles may be mistakenly recognized as an alignment mark.

  Further, when the electronic component is connected in this state, the bubbles remaining in the adhesive layer cause a conduction failure between the electrode 57 of the substrate 56 and the connection terminal of the electronic component, and the connection reliability between the substrate 56 and the electronic component is increased. May decrease.

The present invention relates to a method of manufacturing a connection body can improve the bonding of the adhesive film to prevent entrainment of bubbles, bonding method of the adhesive film, to provide a drawer method and adhesive film of the adhesive film With the goal.

In order to solve the above-described problems, a manufacturing method of a connection body according to the present invention includes an adhesive layer and a reel member around which an adhesive film having a base film provided on one surface side of the adhesive layer is wound. After pulling out the adhesive film, sticking the adhesive layer of the adhesive film to a substrate, peeling the base film, placing the electronic component on the adhesive layer, and curing the adhesive layer In this manufacturing method, the reel member includes a core around which the adhesive film is wound, and a reel flange that supports a side surface of the wound body of the adhesive film wound around the core. The winding core has a surface along the outer periphery so that the other surface of the adhesive layer of the adhesive film opposite to the one surface on which the base film is provided projects in the widthwise central portion to the opposite side. A recess is formed on the Adhesive film, the other surface opposite to the one surface side of the base film of the adhesive layer is provided, in which the central portion in the width direction is curved so as to protrude to the opposite side.

Further, the bonding method of the adhesive film according to the present invention is a method of pulling out the adhesive film from a reel member around which an adhesive layer and an adhesive film provided with a base film on one side of the adhesive layer are wound, In the method of laminating an adhesive film in which the adhesive layer of the adhesive film is adhered to a substrate, the reel member includes a core around which the adhesive film is wound, and the adhesive film wound around the core. A reel flange that supports a side surface of the wound body, and the other surface of the adhesive film on the side opposite to the one surface provided with the base film is in the width direction. A concave portion is formed on the surface along the outer periphery so that the central portion protrudes on the opposite side, and the other side of the adhesive layer opposite to the one side where the base film of the adhesive layer is provided, Width Central portion of those which are curved so as to protrude to the opposite side.

The lead method of the adhesive film according to the present invention, an adhesive layer, and the adhesive film base film is provided on one side of the adhesive layer is draw out the adhesive film from the reel member wound In the method for pulling out an adhesive film for sticking the adhesive layer of the adhesive film to a base material while preventing air bubbles from being caught , the reel member includes a winding core on which the adhesive film is wound, and the winding A reel flange that supports a side surface of the wound body of the adhesive film wound around the core, and the winding core is opposite to the one surface side on which the base film of the adhesive layer of the adhesive film is provided. A concave portion is formed on the surface along the outer periphery so that the other side of the side protrudes in the widthwise central portion, and the adhesive film is provided with the base film of the adhesive layer. Other surfaces of the side opposite the one in which the central portion in the width direction is curved so as to protrude to the opposite side.

The adhesive film according to the present invention is wound on the reel member, an adhesive film for adhering the adhesive layer to a substrate to prevent entrainment of bubbles, the adhesive film, the adhesive A base film on one side of the adhesive layer and the adhesive layer, the reel member comprising: a core around which the adhesive film is wound; and a wound body of the adhesive film wound around the core. A reel flange that supports a side surface, and the winding core has the other side opposite to the one side where the base film of the adhesive layer of the adhesive film is provided, and the center portion in the width direction is opposite to the center. A concave portion is formed on the surface along the outer periphery so as to protrude to the side, and the adhesive film is wound around the core in accordance with the concave portion of the reel member , whereby the base of the adhesive layer Opposite to one side where film is provided Other surfaces of, in which the central portion in the width direction is curved so as to protrude to the opposite side.

  According to the present invention, the adhesive film has a curved shape in which a protruding portion in which a central portion in the width direction protrudes to the other surface side is formed on the other surface of the adhesive layer according to the shape of the concave portion of the core. And when sticking an adhesive bond layer, an adhesive film can be stuck toward the width direction edge part from the protrusion part provided in the center part of the width direction. Therefore, the adhesive film can be attached while preventing entrainment of bubbles.

It is a perspective view which shows the reel member to which this invention was applied. It is sectional drawing which shows an adhesive film. It is sectional drawing which shows the state by which the adhesive film was wound by the winding core. It is a perspective view which shows the reel member by which the adhesive film was wound. It is sectional drawing which shows the state which sticks an adhesive film. It is sectional drawing which shows the structure of the recessed part of a winding core. It is sectional drawing which shows the other shape of a recessed part. It is a figure which shows the measuring method of a protrusion. It is a perspective view which shows the conventional reel member by which the electroconductive adhesive film was wound. It is a side view which shows the state which sticks the conventional conductive adhesive film on the electrode of a board | substrate.

  Hereinafter, a reel member to which the present invention is applied, a method for manufacturing a connector, a method for bonding an adhesive film, a method for pulling out an adhesive film, and an adhesive film will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

[Reel member]
As shown in FIG. 1, a reel member 1 to which the present invention is applied includes a core 3 around which a tape-like adhesive film 2 is wound, and reel flanges 5 provided on both sides of the core 3. The winding core 3 has a substantially cylindrical shape, and an engagement hole 3a through which a driving member (not shown) for rotationally driving the winding core 3 is inserted and engaged is formed at the center. The reel flange 5 supports the wound body of the adhesive film 2 wound around the core 3, and is formed into a disk shape using, for example, a transparent plastic material and bonded to both ends of the core 3. ing. Further, the reel flange 5 may be subjected to electrostatic treatment on the surface in contact with the adhesive film 2. Examples of the method for applying electrostatic treatment include a method of applying a compound such as polythiophene.

  Moreover, the core 3 is formed so that the width a of the outer peripheral surface is substantially the same as the width of the wound adhesive film 2. Further, the core 3 has a recess 6 formed on the outer peripheral surface thereof in the circumferential direction so that the central portion in the width direction of the adhesive film 2 protrudes. Further, as shown in FIG. 2, the adhesive film 2 wound around the core 3 is provided with at least an adhesive layer 7 serving as an adhesive layer and the one surface 7a side of the adhesive layer 7. 7 and a base film 8 serving as a support for supporting 7.

  As shown in FIG. 3, the reel member 1 is wound around the winding core 3 so that the adhesive film 2 is on the inner peripheral side and the base film 8 is on the outer peripheral side. Therefore, the adhesive film 2 has a recess 6 formed along the outer peripheral surface of the core 3, and the other surface 7 b side opposite to the one surface 7 a supported by the base film 8 of the adhesive layer 7 is centered in the width direction. The portion is curved and wound around the core 3 so as to protrude toward the other surface 7b.

  Thereby, as shown in FIG. 4, the adhesive film 2 has a protruding portion in which the central portion in the width direction protrudes to the other surface 7 b side on the other surface 7 b of the adhesive layer 7 according to the shape of the recess 6 of the core 3. 10 has a curved shape formed. Then, as shown in FIG. 5, when the adhesive film 2 is stuck on the electrode 16 of the substrate 15, the adhesive film 2 is moved from the protruding portion 10 provided at the center portion in the width direction to the end portion in the width direction. Can be stuck toward. Therefore, the adhesive film 2 can be attached while preventing entrainment of bubbles between the adhesive layer 7 and the substrate 15.

[Recess shape of core]
As shown in FIG. 6, when the width of the outer peripheral surface is a and the depth of the recess 6 is b, as shown in FIG.
b = 0.1a-0.3a
It is preferable that

  If the depth b of the recess 6 is less than 0.1a, the adhesive film 2 may hardly be curved and air bubbles may be mixed in, as in the case of a conventional core having a substantially flat outer peripheral surface. Further, when the depth b of the recess 6 is deeper than 0.4a, the curve becomes too large, and the both sides of the adhesive layer 7 and the base film 8 in the width direction are not attached to the substrate 15 and are peeled off from the base film 8. There is a risk of being lost. In addition, there may be a problem that the adhesive layer is peeled off during temporary attachment to a substrate or the like.

  Moreover, it is preferable that the core 3 is formed in the range of 0.5-4.0 mm in width a of an outer peripheral surface, and it is still more preferable to set it as 0.8-3.5 mm. The winding core 3 is formed with a width substantially the same as the width of the adhesive film 2, and the width a of the outer peripheral surface (the width of the adhesive film 2) is the space in which the electronic component is mounted or the electrode size to which the adhesive film 2 is attached. It is decided according to etc.

  Further, the core 3 may be formed in a trapezoidal cross section as shown in FIG. 7 in addition to the shape of the recess 6 having a rounded curved shape.

[Adhesive film]
Here, the adhesive film 2 wound around the reel member 1 will be described. As shown in FIG. 2, the adhesive film 2 includes an adhesive layer 7 and a base film 8 serving as a support that supports the adhesive layer 7.

  The adhesive layer 7 can be an anisotropic conductive film (ACF) containing conductive particles 12 in a binder (insulating adhesive composition) 7c, but is not limited thereto. The insulating adhesive film (NCF: Non-Conductive Film) which does not contain the electroconductive particle 12 in 7c may be sufficient.

  As the binder 7c of the adhesive film 2, for example, a normal binder containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, or the like can be used. For the adhesive film 2, an anisotropic conductive composition in which the conductive particles 12 are dispersed in the binder 7 c or an insulating adhesive composition that does not contain the conductive particles 12 in the binder 7 c is applied on the base film 8. Thus, the film is formed on the base film 8.

  The base film 8 supports the binder 7c in the form of a film. For example, PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), etc. are made of silicone. It is formed by applying a release agent such as.

  The film forming resin contained in the binder 7c is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  The thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  Examples of the conductive particles 12 include any known conductive particles used in anisotropic conductive films. Examples of the conductive particles 12 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin, and the like. Can be mentioned.

  In the above description, the adhesive film 2 in which the adhesive layer 7 made of ACF or NCF is formed on the base film 8 is used. However, the present invention is not limited to this example. For example, the adhesive film 2 may be an anisotropic conductive film in which the adhesive layer 7 is configured by laminating ACF and NCF.

  Moreover, the adhesive film 2 is good also as a structure which provides a cover film also in the surface side on the opposite side to the surface where the base film 8 of the adhesive film 2 was laminated | stacked. For example, as a base film or a cover film, it is good also as an adhesive film with copper foil using the copper foil for electrically connecting the electrodes of a plurality of photovoltaic cells.

[Winding tension]
The adhesive film 2 formed as described above is wound around the outer peripheral surface of the core 3 when the core 3 with the drive member engaged with the engagement hole 3a is rotated by the drive member. When the concave portion 6 is formed in the core 3, the adhesive film 2 is wound around the core 3 with the adhesive layer 7 as the inner peripheral side and the base film 8 as the outer peripheral side.

  At this time, the winding tension of the adhesive film 2 is preferably 10 to 40 g, more preferably 20 to 40 g. When the winding tension is less than 10 g, the adhesive film 2 is difficult to bend according to the shape of the concave portion 6, and the formation of the protruding portion 10 becomes insufficient, and there is a possibility that air bubbles are mixed when sticking to the substrate. When the winding tension is larger than 40 g, the winding pressure applied to the wound body of the adhesive film 2 becomes excessive, and the adhesive layer 7 protrudes from the side surface of the base film 8 and sticks to the reel flange 5. There is a possibility that blocking may occur where the adhesive film 2 cannot be normally pulled out from the reel member 1.

[Connection process]
Next, a process of drawing the adhesive film 2 from the reel member 1 and mounting an electronic component on the substrate will be described. The adhesive film 2 has a concave portion 6 formed in the core 3 such that the other surface 7b opposite to the one surface 7a on which the base film 8 of the adhesive layer 7 is provided, and the central portion in the width direction on the other surface 7b side. It is curved and wound so as to protrude. Thereby, the adhesive film 2 pulled out from the reel member 1 has a protruding portion 10 in which the central portion in the width direction of the adhesive layer 7 protrudes to the other surface 7b side (FIG. 4).

  When the adhesive film 2 is pulled out from the reel member 1, as shown in FIG. 5, the adhesive layer 7 is stuck on the electrode 16 formed on the substrate 15. At this time, the adhesive film 2 is stuck toward the both ends of the width direction from the protrusion part 10 which protrudes in the center part of the width direction of the adhesive bond layer 7. FIG. Therefore, the adhesive film 2 can be attached while preventing entrainment of bubbles between the adhesive layer 7 and the substrate 15.

  Next, the adhesive film 2 is heat-pressed by a heat pressing head (not shown), whereby the adhesive layer 7 is temporarily attached onto the substrate 15 and the base film 8 is peeled off. The temporary sticking of the adhesive film 2 onto the substrate 15 is performed by heat-pressing the adhesive layer 7 with a heat and pressure head at a temperature and pressure at which the adhesive layer 7 exhibits fluidity but is not thermally cured.

  Next, an electronic component is mounted on the substrate electrode 16 through the adhesive layer 7 exposed on the substrate 15, and is heated and pressed from above the electronic component by a heating and pressing head. Thus, the adhesive film 2 is softened by the adhesive layer 7 and flows out from between the electrode 16 of the substrate 15 and the connection terminal of the electronic component, and the conductive particles 12 are sandwiched and cured in this state. Thereby, the connection body by which the electrode 16 of the board | substrate 15 and the connection terminal of the electronic component were electrically and mechanically connected via the adhesive film 2 can be manufactured.

  At this time, since no bubbles remain between the adhesive layer 7 and the substrate 15, the adhesive film 2 ensures a good electrical connection between the electrode 16 of the substrate 15 and the connection terminal of the electronic component. In addition, the connection reliability between the substrate 15 and the electronic component can be improved.

  Next, examples of the present invention will be described. In this embodiment, a reel member 1 having a winding core 3 in which a curved concave portion 6 having a round outer peripheral surface is formed, a reel member having a conventional winding core having a flat outer peripheral surface, and a curvature having a round outer peripheral surface. Reel members on which convex portions of the shape were formed were prepared, and the conductive adhesive film or insulating adhesive film wound around each reel member was measured for the success rate of temporary attachment and the entrainment of bubbles during temporary attachment. Further, an IC chip was connected to a glass substrate using the conductive adhesive film, and initial conduction resistance and conduction resistance after PCT (Pressure Cooker Test) were measured. Furthermore, the protruding state of the adhesive layer when the conductive adhesive film and the insulating adhesive film were wound around the reel member was measured.

  As a conductive adhesive film wound around the reel member, ACF (trade name: CP6920F3) manufactured by Sony Chemical & Information Device Co., Ltd. was used. Moreover, as an insulating adhesive film wound around the reel member, NCF (trade name: NP2601A) manufactured by Sony Chemical & Information Device Co., Ltd. was used.

  The conductive adhesive film and the insulating adhesive film wound around the reel member were prepared in three types having a width of 2 mm, 0.8 mm, and 3.5 mm, and each length was 100 m.

  The glass substrate to which the conductive adhesive film is attached has a thickness of 0.7 mm, and an ITO electrode is formed on the surface. The IC chip connected to the glass substrate was 1.8 mm × 20 mm and 0.5 mm thick. The temporary bonding conditions for the conductive adhesive film are 50 ° C., 1 MPa, and 1 sec. The connection conditions for the IC chip are 170 ° C., 60 MPa, and 5 sec.

  In Example 1, the reel member 1 having the winding core 3 in which the curved concave portion 6 having a round shape along the outer peripheral surface was formed was used. The winding core 3 has a width a = 2 mm and a depth b of the recess 6 b = 0.1a. In Example 1, a conductive adhesive film having a width of 2 mm was wound around the core 3 with the adhesive layer as the inner peripheral side and the base film as the outer peripheral side. The winding tension of the conductive adhesive film during winding is 20 g.

  In Example 2, the conditions were the same as in Example 1 except that the depth b of the recess 6 was 0.2a.

  In Example 3, the conditions were the same as in Example 1 except that the depth b of the recess 6 was set to 0.3a.

  In Example 4, the conditions were the same as in Example 2 except that the winding tension during winding of the conductive adhesive film was 10 g.

  In Example 5, the conditions were the same as in Example 2 except that the winding tension when winding the conductive adhesive film was 30 g.

  In Example 6, the conditions were the same as in Example 2 except that the winding tension during winding of the conductive adhesive film was 40 g.

  In Example 7, the conditions were the same as in Example 3 except that the winding tension during winding of the conductive adhesive film was 10 g.

  In Example 8, the conditions were the same as in Example 3 except that the winding tension during winding of the conductive adhesive film was 30 g.

  In Example 9, the conditions were the same as in Example 3 except that the winding tension during winding of the conductive adhesive film was 40 g.

  In Example 10, the conditions were the same as in Example 2 except that the width a of the core 3 was set to 0.8 mm.

  In Example 11, the conditions were the same as in Example 2 except that the width a of the core 3 was set to 3.5 mm.

  In Example 12, the conditions were the same as in Example 2 except that an insulating adhesive film having an adhesive layer not containing conductive particles was used.

  In Comparative Example 1, a reel member having a conventional winding core with a flat outer peripheral surface was used. The winding core has a width a = 2. In Comparative Example 1, a conductive adhesive film having a width of 2 mm was wound around this winding core with the adhesive layer on the inner peripheral side and the base film on the outer peripheral side. The winding tension of the conductive adhesive film during winding is 20 g.

  In Comparative Example 2, a reel member having a rounded convex portion formed on the outer peripheral surface was used. The winding core has a width a = 2 mm and a recess depth b = −0.2a, that is, the height of the projection is 0.2a. In Comparative Example 2, a conductive adhesive film having a width of 2 mm was wound around the core with the adhesive layer on the inner peripheral side and the base film on the outer peripheral side. The winding tension of the conductive adhesive film during winding is 20 g.

  About each Example and the comparative example, the temporary sticking success rate (%) was measured. The temporary sticking success rate is the state where the adhesive layer is peeled off from the base film (PET) and attached to the glass substrate when the conductive adhesive film or the insulating adhesive film is attached onto the ITO electrode of the glass substrate. The success rate (%) is defined as success, when the state where the adhesive layer was not peeled off from the base film and was not attached to the glass substrate was regarded as failure, and temporary attachment was attempted 10 times each.

  Moreover, about each Example and the comparative example, it measured about the entrainment of the bubble in the connection surface where the adhesive film was temporarily stuck. Measurement is performed by magnifying and observing the connection surface using a metal microscope, ◎ when bubbles are not confirmed, ◯ when bubbles are confirmed in the range of less than 1 to 10% of the connection surfaces, and 10% of the connection surfaces. The case where bubbles were confirmed in the above range was marked as x.

  Moreover, about the Example and comparative example which affixed the conductive adhesive film, the conduction | electrical_connection resistance after the connection initial stage of IC chip and PCT (Pressure Cooker Test: 85 degreeC, 85% RH, 500 hr) was measured.

  Moreover, about each Example and the comparative example, the protrusion of the reel member by which the adhesive film was wound was measured. In the measurement of the protrusion, the side surface of the wound body of the adhesive film was magnified and observed over the entire surface using a metal microscope, and as shown in FIG. 8, the number of protrusion layers = (maximum thickness of the protruding portion to the base film 8) X) / (thickness Y of adhesive layer 7) was calculated. And, when the number of protruding layers of the adhesive layer is 0, ◎, when the number of protruding layers of the adhesive layer is 0-0.5, ○, the number of protruding layers of the adhesive layer is larger than 0.5 The case was marked with x. In addition, when there were a plurality of protruding portions, the maximum value of the number of protruding layers was adopted.

  As shown in Table 1, according to the examples, the temporary sticking success rate was 70% or more, and the bubble entrainment evaluation was also ◯ or more. This is because the adhesive film according to the example has a widthwise central portion on the other surface side on the other surface opposite to the one surface side on which the base film of the adhesive layer is provided, depending on the shape of the concave portion of the core. It has the curved shape in which the protrusion part which protrudes in was formed. Therefore, the adhesive film according to the example can be adhered from the protruding portion provided in the center portion in the width direction toward the end portion in the width direction when the adhesive layer is adhered on the glass substrate. This is because it was possible to adhere while preventing entrainment of bubbles between the adhesive layer and the glass substrate.

  On the other hand, in Comparative Example 1, since the shape of the adhesive film was flat, the temporary sticking success rate was as low as 60%. Further, in Comparative Example 2, the other surface opposite to the one surface provided with the base film of the adhesive layer has a central portion in the width direction that is recessed on one surface side, so that air can be easily caught during temporary bonding. Evaluation of bubble entrainment was x.

  Looking at Examples 1 to 3, in Example 1, since the depth b of the concave portion 6 was as shallow as 0.1a, the curvature of the adhesive film was small, and some entrainment of bubbles was observed.

  Looking at Examples 4 to 6, in Example 4, the winding tension was as small as 10 g, so the curvature of the adhesive film was small, and some entrainment of bubbles was observed.

  Looking at Examples 7 to 9, in Example 9, when the take-up tension was 40 g at the depth b of the recess 6 of b = 0.3a, the tension was strong and some protrusion was observed. In Example 7, since the winding tension was as small as 10 g, the curvature of the adhesive film was small, and some entrainment of bubbles was observed.

  From Example 10 and Example 11, a favorable result was obtained in each evaluation item whether the width a (width of the adhesive film) of the core 3 was 0.8 mm or 3.5 mm. Accordingly, the width a (width of the adhesive film) of the core 3 can be used in the range of 0.5 mm to 4.0 mm, and preferably 0.8 mm to 3.5 mm.

DESCRIPTION OF SYMBOLS 1 Reel member, 2 Adhesive film, 3 Winding core, 5 Reel flange, 6 Recessed part, 7 Adhesive layer, 8 Base film, 10 Protruding part, 12 Conductive particle

Claims (4)

Pulling out the adhesive film from the reel member around which the adhesive film and the adhesive film provided with the base film on one side of the adhesive layer are wound,
Adhering the adhesive layer of the adhesive film to a substrate,
After peeling the base film, the electronic component is placed on the adhesive layer,
In the method for producing a connection body for curing the adhesive layer,
The reel member has a core around which the adhesive film is wound, and a reel flange that supports a side surface of a wound body of the adhesive film wound around the core.
The winding core is arranged along the outer periphery such that the other surface of the adhesive film on the side opposite to the one surface on which the base film is provided protrudes on the opposite side of the center in the width direction. A recess is formed on the surface,
The manufacturing method of the connection body in which the other surface of the adhesive film opposite to the one surface provided with the base film is curved so that the central portion in the width direction protrudes to the opposite side. . Pulling out the adhesive film from the reel member around which the adhesive film and the adhesive film provided with the base film on one side of the adhesive layer are wound,
In the bonding method of the adhesive film for sticking the adhesive layer of the adhesive film to a substrate,
The reel member has a core around which the adhesive film is wound, and a reel flange that supports a side surface of a wound body of the adhesive film wound around the core.
The winding core is arranged along the outer periphery such that the other surface of the adhesive film on the side opposite to the one surface on which the base film is provided protrudes on the opposite side of the center in the width direction. A recess is formed on the surface,
The adhesive film is bonded to an adhesive film in which the other surface of the adhesive layer opposite to the one surface provided with the base film is curved so that the central portion in the width direction protrudes to the opposite side. Method. An adhesive layer, entrainment from the reel member adhesive film is wound the base film is provided in the bubble the adhesive layer of the adhesive film to pull out the adhesive film on one side of the adhesive layer In the method of pulling out an adhesive film for preventing and sticking to a substrate ,
The reel member has a core around which the adhesive film is wound, and a reel flange that supports a side surface of a wound body of the adhesive film wound around the core.
The winding core is arranged along the outer periphery such that the other surface of the adhesive film on the side opposite to the one surface on which the base film is provided protrudes on the opposite side of the center in the width direction. A recess is formed on the surface,
The adhesive film is a method of pulling out an adhesive film in which the other surface of the adhesive layer opposite to the one surface provided with the base film is curved so that a central portion in the width direction protrudes to the opposite side. . An adhesive film that is wound around a reel member and prevents the entrainment of bubbles in the adhesive layer and adheres to a substrate ;
The adhesive film includes the adhesive layer and a base film on one side of the adhesive layer,
The reel member includes a core around which the adhesive film is wound;
A reel flange that supports a side surface of the wound body of the adhesive film wound around the core;
The winding core is arranged along the outer periphery such that the other surface of the adhesive film on the side opposite to the one surface on which the base film is provided protrudes on the opposite side of the center in the width direction. A recess is formed on the surface,
The adhesive film is wound around the core in accordance with the concave portion of the reel member,
An adhesive film in which the other surface of the adhesive layer opposite to the one surface on which the base film is provided is curved so that a central portion in the width direction protrudes to the opposite side.

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