JP6988482B2 - Adhesive film and its manufacturing method, adhesive tape, and reel for adhesive film - Google Patents

Description

The present invention relates to an adhesive film and a method for producing the same, an adhesive tape, and a reel for an adhesive film.

Conventionally, an anisotropic conductive film (ACF) has been used as a connecting material for electrically connecting members having a large number of electrodes to each other to manufacture a circuit connector. When connecting semiconductor elements such as ICs and LSIs, packages, etc. to substrates such as printed wiring boards, LCD glass substrates, and flexible printed circuits, the anisotropic conductive film maintains the conduction state between the opposing electrodes and is adjacent to each other. It is a connection material that makes electrical connection and mechanical fixation so as to maintain the insulation between the electrodes. Further, as a connecting material, a non-conductive film (NCF (Non-Conductive film)) or the like is known in addition to the anisotropic conductive film.

The connecting material contains, for example, an adhesive component containing a thermosetting resin or the like and conductive particles to be blended as necessary in an anisotropic conductive film on a substrate such as a polyethylene terephthalate (PET) film. In addition, it is formed in the form of a film as an adhesive layer. Further, the adhesive film may be used in the state of a reel in which a film-like raw fabric is cut into a tape having a width suitable for the intended use, and the tape is wound around a winding core to form a winding body (for example, a patent). See Document 1).

Japanese Unexamined Patent Publication No. 2003-34468

By the way, when a driver IC or the like is connected to an LCD module using a connection material, the portion of the connection material that effectively contributes to the connection between circuit members is less than about half of the entire LCD module, but the work efficiency and work efficiency are improved. From the viewpoint of capital investment, it is common to first attach the connection material to the entire LCD module and then mount the driver IC or the like. However, in recent years, there has been a movement to reduce the amount of connecting material used for the purpose of reducing the manufacturing cost of LCD. On the other hand, when connecting COF, FPC, etc. to the LCD module, the amount of connecting material used can be reduced by first pasting the connecting material on the COF or FPC side and then mounting it on the LCD module side. , Cost reduction is being considered.

On the other hand, when an LCD module equipped with a high-definition circuit is used, a non-conductive adhesive layer and a conductive adhesive layer containing conductive particles are used from the viewpoint of short circuit between circuits and efficiency of capturing conductive particles. It is desirable to use a connecting material consisting of two layers with. The two-layered connecting material is generally obtained by forming a non-conductive adhesive layer on a substrate and further forming a conductive adhesive layer on the non-conductive adhesive layer. However, when the step of first attaching the connection material having a two-layer structure to the COF or FPC side is adopted, the surface on the non-conductive adhesive layer side is attached toward the LCD module side, which is sufficient. There is a problem that connection characteristics cannot be obtained.

In order to solve the above problems, the present inventors first attach a two-layered connecting material to the COF or FPC side, and then adopt a process of mounting it on the LCD module. It was examined to form a conductive adhesive layer on the material and further form a non-conductive adhesive layer on the conductive adhesive layer to obtain a connecting material having a two-layer structure. However, in this case, it has been found that a phenomenon (so-called blocking phenomenon) in which the conductive adhesive layer is transferred to the base material occurs when the base material is peeled off from the connecting material at the time of circuit connection. When the blocking phenomenon occurs, a required amount of the conductive adhesive cannot be placed at a predetermined position on the connected member, and the connection reliability (electrical connection or mechanical fixing) of the connection portion may be insufficient.

The present invention has been made in view of the above circumstances, and when it has a conductive adhesive layer and a non-conductive adhesive layer, can suppress the occurrence of a blocking phenomenon, and is used for manufacturing a circuit connection. It is an object of the present invention to provide an adhesive film and a method for producing the same, an adhesive tape, and a reel for the adhesive film, which can obtain excellent connection reliability.

In one embodiment, the present invention comprises a first non-conductive adhesive layer, a conductive adhesive layer containing conductive particles, and a second non-conductive adhesive layer laminated in this order. Provided is an adhesive film in which the thickness T1 of the first non-conductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1).
T1 <T ... (1)

As another aspect of the present invention, the first non-conductive adhesive layer, the conductive adhesive layer containing conductive particles, and the second non-conductive adhesive layer are laminated in this order. Provided is a method for producing an adhesive film, comprising a step of obtaining an adhesive film, wherein the thickness T1 of the first non-conductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1).
T1 <T ... (1)

T1 and the average particle size r of the conductive particles preferably satisfy the following formula (2).
T1 ≤ 0.8 × r ... (2)

The T1 and the thickness T2 of the second non-conductive adhesive layer preferably satisfy the following formula (3).
T1 ≤ T2 ... (3)

As another aspect of the present invention, there is an adhesive film containing conductive particles, wherein the first non-conductive region in which the conductive particles do not exist, the conductive region in which the conductive particles exist, and the conductivity. A second non-conductive region in which no sex particles are present is provided in this order in the thickness direction of the adhesive film, and the length L1 in the thickness direction of the adhesive film in the first non-conductive region and the conductive region. Provided is an adhesive film in which the length L in the thickness direction of the adhesive film satisfies the following formula (4).
L1 <L ... (4)

L1 and the average particle size r of the conductive particles preferably satisfy the following formula (5).
L1 ≤ 0.8 × r ... (5)

L1 and the length L2 in the thickness direction of the adhesive film in the second non-conductive region preferably satisfy the following formula (6).
L1 ≤ L2 ... (6)

The present invention provides, as another aspect, an adhesive tape comprising a tape-shaped substrate and the adhesive film provided on one surface of the substrate.

The present invention provides, as another aspect, a reel for an adhesive film including the above-mentioned adhesive tape and a winding core around which the adhesive tape is wound.

According to the present invention, it is possible to suppress the occurrence of a blocking phenomenon while having a conductive adhesive layer and a non-conductive adhesive layer, and to obtain excellent connection reliability when used for manufacturing a circuit connector. It is possible to provide an adhesive film and a method for producing the same, an adhesive tape, and a reel for the adhesive film.

It is a schematic cross-sectional view which shows one Embodiment of an adhesive film. It is a schematic cross-sectional view which shows the other embodiment of an adhesive film. It is a perspective view which shows one Embodiment of the reel for adhesive films. FIG. 3 is an enlarged schematic cross-sectional view of an adhesive tape in the reel for an adhesive film shown in FIG. It is a schematic cross-sectional view which shows one Embodiment of the manufacturing method of a circuit connection body.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to the following embodiments. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicate description will be omitted. Also, for the convenience of the drawings, the dimensional ratios in the drawings do not always match those described.

[Adhesive film (first embodiment)]
FIG. 1 is a schematic cross-sectional view showing an adhesive film according to the first embodiment. As shown in FIG. 1, in the adhesive film 1, the first non-conductive adhesive layer 2, the conductive adhesive layer 3, and the second non-conductive adhesive layer 4 are laminated in this order. Become.

The first and second non-conductive adhesive layers 2 and 4 are composed of adhesive components 2a and 4a, respectively. The adhesive components 2a and 4a constituting the first and second non-conductive adhesive layers 2 and 4 may be the same as or different from each other.

As the adhesive components 2a and 4a, any component that can be cured by heat or light can be widely used, and for example, an epoxy adhesive or an acrylic adhesive can be used. The adhesive components 2a and 4a are preferably crosslinkable components from the viewpoint of excellent heat resistance and moisture resistance of the cured product. Among them, an epoxy-based adhesive containing an epoxy resin, which is a thermosetting resin, as a main component is preferable in that it can be cured in a short time, has good connection workability, and has excellent adhesiveness. In addition, the epoxy-based adhesive is compared with the epoxy-based adhesive, for example, when an adhesive film is provided on the base material to form an adhesive tape (details will be described later), the adhesive component is transferred to the base material. It is preferable in that it can suppress. As the adhesive components 2a and 4a, for example, a radical curing adhesive as described in International Publication No. 98/44067 can also be used.

Specific examples of the epoxy adhesive include a high molecular weight epoxy resin (for example, a weight average molecular weight of 1000 to 100,000), a solid epoxy resin or a liquid epoxy resin, or these epoxy resins are urethane, polyester, acrylic rubber, nitrile rubber (for example). Examples thereof include an adhesive containing a modified epoxy resin modified with NBR), synthetic linear polyamide or the like as a main component. The epoxy adhesive may further contain additives such as a curing agent, a catalyst, a coupling agent, and a filler in addition to the epoxy resin.

Specific examples of the acrylic adhesive include an adhesive containing an acrylic resin (homogeneous polymer or copolymer) containing at least one of acrylic acid, acrylic acid ester, methacrylic acid ester and acrylonitrile as a monomer component as a main component. Can be mentioned. In addition to the above-mentioned acrylic resin, the acrylic adhesive may further contain additives such as a curing agent, a catalyst, a coupling agent, and a filler.

When the circuit members are connected to each other, the adhesive components 2a and 4a contain components that exert an internal stress relaxing action from the viewpoint of suppressing the warping of the circuit members caused by the difference in the coefficient of linear expansion between the two circuit members. It is preferable to do so. Specifically, the adhesive components 2a and 4a preferably contain an acrylic rubber, an elastomer component, or the like.

The conductive adhesive layer 3 contains an adhesive component 3a and conductive particles 5. The adhesive component 3a may be the same as the adhesive components described as the adhesive components 2a and 4a constituting the first and second non-conductive adhesive layers 2 and 4 described above, and the first and second adhesive components 3a may be the same. It may be the same as or different from each of the adhesive components 2a and 4a constituting the second non-conductive adhesive layers 2 and 4.

The conductive particles 5 are dispersed in the adhesive component 3a. Examples of the conductive particles 5 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, and particles of conductive carbon. Alternatively, the conductive particles 5 may be coated conductive particles in which particles such as non-conductive glass, ceramic, and plastic are used as nuclei, and the nuclei are coated with the above-mentioned metal or conductive carbon. The conductive particles 5 may be insulating coated conductive particles whose surface is coated with an insulating layer. The conductive adhesive layer 3 may further contain insulating particles in addition to the conductive particles 5 from the viewpoint of improving the insulating property between adjacent electrodes.

The content of the conductive particles 5 is, for example, 0.1 to 30 parts by volume, preferably 0.1 to 10 parts by volume, based on 100 parts by volume of the adhesive component 3a contained in the conductive adhesive layer 3. Is. When the content is 0.1 part by volume or more, the connection resistance between the opposing electrodes tends to be low, and when it is 30 parts by volume or less, a short circuit between adjacent electrodes can be suppressed.

In the adhesive film 1, the thickness T1 of the first non-conductive adhesive layer 2 and the thickness T of the conductive adhesive layer 3 satisfy the following formula (1).
T1 <T ... (1)

T1 and T are preferably T1 <0.9 × T, more preferably T1 <0.8 × T, still more preferably T1 from the viewpoint of further excellent capture efficiency of the conductive particles 5 at the time of circuit connection. <Satisfy the relational expression of 0.7 × T.

In the adhesive film 1, the thickness T1 of the first non-conductive adhesive layer 2 and the average particle size r of the conductive particles 5 are excellent in capturing efficiency of the conductive particles 5 at the time of circuit connection, and further increase the connection resistance. From the viewpoint of reduction, the following formula (2) is preferably satisfied.
T1 ≤ 0.8 × r ... (2)

From the same viewpoint, T1 and r more preferably satisfy the relational expression of T1 ≦ 0.7 × r.

In the adhesive film 1, the thickness T1 of the first non-conductive adhesive layer 2 and the thickness T2 of the second non-conductive adhesive layer 4 are transferable to circuit members and between circuit members at the time of circuit connection. From the viewpoint of excellent space filling property, the following formula (3) is preferably satisfied.
T1 ≤ T2 ... (3)

From the same viewpoint, T1 and T2 more preferably satisfy the relational expression of T1 ≦ 0.5 × T2, further preferably T1 ≦ 0.4 × T2, and particularly preferably T1 ≦ 0.3 × T2.

When the thickness of the first non-conductive adhesive layer 2, the conductive adhesive layer 3, or the second non-conductive adhesive layer 4 is non-uniform, the maximum value of the thickness of each layer is set to the thickness T1. , Thickness T or thickness T2.

The average particle size of the conductive particles in the present invention is defined as follows. That is, a plurality of conductive particles are randomly selected by observing a conductive particle image at a magnification of 3000 with a scanning electron microscope (SEM). At this time, it is preferable to select 30 or more conductive particles in order to accurately determine the average particle size. The maximum diameter and the minimum diameter of the selected conductive particles are measured, and the square root of the product of the maximum diameter and the minimum diameter is defined as the particle size of the conductive particles. The average particle size is defined by dividing the particle size calculated in this way by the measured number of particles.

The thickness T1 of the first non-conductive adhesive layer 2, the thickness T of the conductive adhesive layer 3, the thickness T2 of the second non-conductive adhesive layer 4, and the average particle size r of the conductive particles 5 are determined. It is preferable to satisfy the above-mentioned relationship, and the specific thickness or average particle size thereof is not particularly limited.

The thickness T1 of the first non-conductive adhesive layer 2 may be, for example, 0.5 μm or more, or 1 μm or more, and may be, for example, 2.5 μm or less, or 2 μm or less.

The thickness T of the conductive adhesive layer 3 may be, for example, 1.5 μm or more, or 2 μm or more, and may be, for example, 4 μm or less, or 3.5 μm or less.

The thickness T2 of the second non-conductive adhesive layer 4 may be, for example, 5 μm or more, or 7 μm or more, and may be, for example, 10 μm or less, or 9 μm or less.

The average particle size r of the conductive particles 5 may be, for example, 2 μm or more, or 3 μm or more, and may be, for example, 5 μm or less, or 4 μm or less.

The adhesive film 1 is on the surface of the first non-conductive adhesive layer 2 opposite to the conductive adhesive layer 3 or opposite to the conductive adhesive layer 3 of the second non-conductive adhesive layer 4. A substrate (not shown) may be further provided on the side surface. The thickness of the base material may be, for example, 4 to 200 μm.

The substrate may be, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic. It may be a base material made of a rubber-based material, a liquid crystal polymer, or the like. The adhesive surface of the base material with the first or second non-conductive adhesive layer may be subjected to a mold release treatment.

[Adhesive film (second embodiment)]
FIG. 2 is a schematic cross-sectional view showing the adhesive film according to the second embodiment. As shown in FIG. 2, the adhesive film 11 contains an adhesive component 11a and conductive particles 5. The adhesive film 11 has a first non-conductive region R1 in which the conductive particles 5 do not exist, a conductive region R in which the conductive particles 5 exist, and a second non-conductive region in which the conductive particles 5 do not exist. R2 is provided in this order in the thickness direction of the adhesive film 11.

The adhesive component 11a may be the same adhesive component as the adhesive components 2a, 3a, 4a described in the first embodiment described above, and the conductive particles 5 may be the conductive particles described in the first embodiment described above. It may be the same conductive particles as the sex particles 5. The adhesive component 11a may have a uniform component throughout the adhesive film 11 or may have a different component depending on the position of the adhesive film 11. For example, the adhesive component 11a may have a different component for each of the first non-conductive region R1, the conductive region R, and the second non-conductive region R2.

The conductive region R is a plane that is in contact with the conductive particles 5 and is substantially parallel to the surface 11b on the first non-conductive region R1 side of the adhesive film 11 and that exists at the shortest distance from the surface 11b. It exists at the shortest distance from a certain first tangent plane and a plane that is in contact with the conductive particles 5 and is substantially parallel to the surface 11c on the second non-conductive region R2 side of the adhesive film 11. It is defined as the area between the second tangent plane, which is a plane.

The first non-conductive region R1 extends in the thickness direction of the adhesive film 11 from the first tangent plane toward the surface 11b on the first non-conductive region R1 side of the adhesive film 11. It is defined as an area other than.

The second non-conductive region R2 extends in the thickness direction of the adhesive film 11 from the second tangent plane toward the surface 11c of the adhesive film 11 on the second non-conductive region R2 side. It is defined as an area other than.

In the adhesive film 11, the length L1 of the first non-conductive region R1 and the length L of the conductive region R satisfy the following formula (4).
L1 <L ... (4)

L1 and L are preferably L1 <0.9 × L, more preferably L1 <0.8 × L, still more preferably L1 from the viewpoint of further excellent capture efficiency of the conductive particles 5 at the time of circuit connection. <Satisfy the relational expression of 0.7 × L.

In the adhesive film 11, the length L1 of the first non-conductive region R1 and the average particle size r of the conductive particles 5 are excellent in capturing efficiency of the conductive particles 5 at the time of circuit connection, and further reduce the connection resistance. From the viewpoint of being able to do so, the following formula (5) is preferably satisfied.
L1 ≤ 0.8 × r ... (5)

From the same viewpoint, L1 and r more preferably satisfy the relational expression of L1 ≦ 0.7 × r.

In the adhesive film 11, the length L1 of the first non-conductive region R1 and the length L2 of the second non-conductive region R2 are transferability to the circuit member and a space between the circuit members at the time of circuit connection. From the viewpoint of excellent filling property, the following formula (6) is preferably satisfied.
L1 ≤ L2 ... (6)

From the same viewpoint, L1 and L2 satisfy the relational expression of more preferably L1 ≦ 0.5 × L2, further preferably L1 ≦ 0.4 × L2, and particularly preferably L1 ≦ 0.3 × L2.

The length L1 of the first non-conductive region R1, the length L of the conductive region R, the length L2 of the second non-conductive region R2, and the average particle size r of the conductive particles 5 are as described above. It is preferable to satisfy the relationship, and these specific lengths or average particle sizes are not particularly limited.

The length L1 of the first non-conductive region R1 may be, for example, 0.5 μm or more, or 1 μm or more, and may be, for example, 2.5 μm or less, or 2 μm or less.

The length L of the conductive region R may be, for example, 1.5 μm or more, or 2 μm or more, and may be, for example, 4 μm or less, or 3.5 μm or less.

The length L2 of the second non-conductive region R2 may be, for example, 5 μm or more, or 7 μm or more, and may be, for example, 10 μm or less, or 9 μm or less.

The adhesive film 11 may further include a region in which conductive particles are present or a region in which conductive particles are not present on the opposite side of the first non-conductive region R1 from the conductive region R.

[Manufacturing method of adhesive film]
The adhesive films 1 and 11 according to the first and second embodiments described above include, for example, a first non-conductive adhesive layer 2, a conductive adhesive layer 3 containing conductive particles 5, and a second. It is obtained by laminating the non-conductive adhesive layer 4 of the above in this order.

Specifically, for example, first, the first non-conductive adhesive layer 2 and the conductive adhesive layer 3 are laminated using a laminator or the like to obtain a laminate, and then the laminate is similarly obtained. Adhesive films 1 and 11 can be obtained by further laminating the second non-conductive adhesive layer 4 on the conductive adhesive layer 3 side of the body. Alternatively, first, the conductive adhesive layer 3 and the second non-conductive adhesive layer 4 are laminated using a laminator or the like to obtain a laminated body, and then similarly, the conductive adhesive of the laminated body is obtained. Adhesive films 1 and 11 can also be obtained by further laminating the first non-conductive adhesive layer 2 on the agent layer 3 side.

Each layer of the first non-conductive adhesive layer 2, the conductive adhesive layer 3, and the second non-conductive adhesive layer 4 is produced, for example, by the following method. First, the adhesive components 2a and 4a, or the adhesive component 3a and the conductive particles 5 are dissolved in a solvent to prepare a coating liquid. Next, this coating liquid is applied, for example, on the release-treated surface of the base material, and at, for example, at an active temperature or lower (for example, 100 ° C. or lower) of the curing agent contained in the adhesive components 2a, 3a, 4a. Each layer is obtained by drying and removing the solvent. The solvent may be an aromatic hydrocarbon solvent, an oxygen-containing solvent or the like. The boiling point of the solvent may be 150 ° C. or lower, and may be 60 to 150 ° C. or 70 to 130 ° C.

The thickness T1 of the first non-conductive adhesive layer 2, the thickness T of the conductive adhesive layer 3, the thickness T2 of the second non-conductive adhesive layer 4, and the conductive particles 5 used in this manufacturing method. It is preferable that the average particle size r satisfies the relationships of the formulas (1), (2), (3) and the like described in the above-mentioned first embodiment, respectively.

[Adhesive tape and reel for adhesive film]
FIG. 3 is a perspective view showing an embodiment of an adhesive film reel. As shown in FIG. 3, the adhesive film reel 21 includes a cylindrical winding core 22 and disk-shaped side plates 23 provided on both end faces of the winding core 22 in the axial direction. A long adhesive tape 24 is wound around the outer surface 22a of the winding core 22, whereby the adhesive tape 24 is made into a wound body. The adhesive tape 24 includes a tape-shaped base material 25 and an adhesive film 26 provided on one surface of the base material 25. The inner surface of the winding core 22 is, for example, a shaft hole 22b for mounting on a rotating shaft of a crimping device used at the time of circuit connection. The outer diameter of the winding core 22 is, for example, 4 to 15 cm from the viewpoint of excellent handleability.

FIG. 4 is an enlarged schematic cross-sectional view of the adhesive tape 24 in the adhesive film reel 21 shown in FIG. As shown in FIG. 4A, in one embodiment, the adhesive tape 24A is the first embodiment as a tape-shaped base material 25 and an adhesive film 26 provided on one surface of the base material 25. The adhesive film 1 according to the form is provided.

As shown in FIG. 4B, the adhesive tape 24B is, in another embodiment, as a tape-shaped base material 25 and an adhesive film 26 provided on one surface of the base material 25 as a second. The adhesive film 11 according to the embodiment is provided.

The length of the base material 25 is, for example, 1 to 400 m, preferably 50 to 300 m. The thickness of the base material 25 is, for example, 4 to 200 μm, preferably 20 to 100 μm. The width of the base material 25 is preferably the same as the width of the adhesive films 1 and 11 or wider than the width of the adhesive films 1 and 11, specifically, for example, 0.5 to 30 mm. It is preferably 0.5 to 3.0 mm. The length, thickness and width of the base material 25 are not limited to the above range.

Examples of the base material 25 include polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride. , Synthetic rubber-based, tape-shaped base material formed of liquid crystal polymer or the like can be used. The material constituting the base material 25 is not limited to these. The adhesive surface of the base material 25 with the adhesive film 26 may be subjected to a mold release treatment.

The width of the adhesive film 26 may be adjusted according to the intended use, for example, 0.5 to 5 mm, preferably 0.5 to 3.0 mm.

In the adhesive film reel 21, the first non-conductive adhesive layer 2 or the first is between the base material 25 of the adhesive tapes 24A and 24B and the conductive adhesive layer 3 or the conductive region R. Since the non-conductive region R1 of the above is provided, when the adhesive film 26 is peeled from the base material 25 and used for circuit connection, the transfer of the conductive adhesive layer 3 or the conductive region R to the base material 25 is performed. (Blocking phenomenon) can be suppressed.

In the above-described embodiment, the adhesive tape 24 is used in the form of the adhesive film reel 21, but the adhesive tape 24 is, for example, in the form of a single sheet (preliminarily cut into a desired size and shape). It may be used in the form).

[Circuit connector and its manufacturing method]
A circuit connection body manufactured by using the above-mentioned adhesive tape 24 will be described. FIG. 5 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection.

First, as shown in FIG. 5A, a first circuit member 33 including a first circuit board 31 and a first circuit electrode 32 formed on a main surface 31a of the first circuit board 31. Prepare. Then, the adhesive tape is placed on the first circuit member 33 so that the first circuit electrode 32 of the first circuit member 33 and the second non-conductive adhesive layer 4 of the adhesive tape 24A face each other. Place 24A.

Specific examples of the first circuit member 33 include an FPC board, a COF board, and the like. These circuit members generally have a large number of circuit electrodes. The first circuit electrode 32 may be composed of one or more selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and indium tin oxide (ITO). The materials of the plurality of first circuit electrodes 32 may be the same as or different from each other.

When the above-mentioned adhesive film reel 21 is used, for example, the adhesive film reel 21 is attached to the rotating shaft of the crimping device, and the second non-conductive adhesive layer 4 of the adhesive tape 24A is the second. After pulling out the adhesive tape 24A from the adhesive film reel 21 so as to face the first circuit electrode 32 of the circuit member 33 of 1, the adhesive tape 24A is cut to a predetermined length, and the first It may be placed on the circuit member 33 of.

Next, the first circuit member 33 and the adhesive tape 24A are pressed in the directions of arrows A and B, and the adhesive film 26 is temporarily connected to the first circuit member 33. The pressure at this time is not particularly limited as long as it does not damage the first circuit member 33, but is preferably 0.1 to 30.0 MPa, for example. At the time of temporary connection, pressurization may be performed while heating. In this case, the heating temperature may be any temperature as long as the adhesive film 1 does not substantially cure, and is preferably 50 to 100 ° C., for example. Pressurization (and heating) is preferably performed for 0.1 to 2 seconds.

Next, as shown in FIG. 5B, a second circuit member including a second circuit board 34 and a second circuit electrode 35 formed on the main surface 34a of the second circuit board 34. Prepare 36. Then, after the base material 25 of the adhesive tape 24A is peeled off from the adhesive film 1, the first circuit member 33 and the adhesive film so that the first circuit electrode 32 and the second circuit electrode 35 face each other. 1 is placed on the second circuit member 36.

Specific examples of the second circuit member 36 include an LCD module and the like. The second circuit electrode 35 may be composed of one or more selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and indium tin oxide (ITO). The materials of the plurality of second circuit electrodes 35 may be the same as or different from each other.

Then, while heating, the whole is pressurized in the directions of arrows C and D. The heating temperature at this time may be any temperature as long as the adhesive components 2a, 3a, 4a of the adhesive film 1 can be cured, preferably 60 to 180 ° C, more preferably 70 to 170 ° C, and further preferably 80 to 80. It is 160 ° C. When the heating temperature is 60 ° C. or higher, an appropriate curing rate can be maintained, and when the heating temperature is 180 ° C. or lower, unwanted side reactions can be suppressed. The heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and even more preferably 1 to 180 seconds.

The above connection conditions are appropriately selected depending on the use of the obtained circuit connection body and the types of the adhesive film and the circuit member. When the adhesive components 2a, 3a, 4a of the adhesive film 1 are adhesive components that are cured by light, the adhesive film 1 may be appropriately irradiated with active light or energy rays at the time of connection. Examples of the active light ray include ultraviolet rays, visible light, infrared rays and the like. Examples of energy rays include electron beams, X-rays, γ-rays, microwaves, and the like.

By curing the adhesive components 2a, 3a, 4a in this way, a connecting portion 38 containing the cured product 37 of the adhesive components 2a, 3a, 4a and the conductive particles 5 is formed, and FIG. The circuit connection body 39 as shown in (c) is obtained. That is, the circuit connection body 39 includes a first circuit member 33, a second circuit member 36, and a connection portion 38 provided between the first circuit member 33 and the second circuit member 36. There is. In the circuit connection body 39, the first circuit electrode 32 and the second circuit electrode 35 are electrically connected via the conductive particles 5. That is, since the conductive particles 5 are in direct contact with both the first and second circuit electrodes 32 and 35, the connection resistance between the first and second circuit electrodes 32 and 35 is sufficiently reduced, and the first Good electrical connection between the first and second circuit electrodes 32 and 35 is possible. On the other hand, since the cured product 37 has electrical insulation, the insulation between the adjacent first circuit electrodes 32 and the second circuit electrodes 35 is ensured. Therefore, in this circuit connection body 39, the flow of electricity between the first and second circuit electrodes 32 and 35 becomes smooth, and the functions of the circuit members 33 and 36 are fully exhibited.

In the method for manufacturing the circuit connector 39 described above, first, in order to temporarily connect the adhesive film 1 to the first circuit member 33 such as the FPC substrate and the COF substrate, the second circuit member 36 such as the LCD module is first used. Compared with the case where the adhesive film 1 is temporarily connected to the adhesive film 1, the amount of the adhesive film 1 used can be minimized, and the manufacturing cost can be reduced. Further, in this method of manufacturing the circuit connection 39, since the adhesive film 1 in which the thickness of the first non-conductive adhesive layer 2 is less than the thickness of the conductive adhesive layer 3 is used, the first and second When the circuit members 33 and 36 are connected to each other, the conductive particles 5 are easily captured between the first and second circuit electrodes 32 and 35, and good electrical connection is possible.

In the above-described embodiment, the adhesive tape 24A provided with the adhesive film 1 according to the first embodiment is used as the adhesive tape, but the adhesive tape 11 provided with the adhesive film 11 according to the second embodiment is used as the adhesive tape. The agent tape 24B may be used.

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

(Example 1)
[Synthesis of urethane acrylate]
Stir 400 parts by mass of polycaprolactone diol with a weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 part by mass of hydroquinone monomethyl ether as a polymerization inhibitor. While heating to 50 ° C., the mixture was mixed. Then, 222 parts by mass of isophorone diisocyanate was added dropwise, and the temperature was raised to 80 ° C. with further stirring to carry out a urethanization reaction. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain urethane acrylate.

[Preparation of polyester urethane resin]
Using terephthalic acid as the dicarboxylic acid, propylene glycol as the diol, and 4,4'-diphenylmethane diisocyanate as the isocyanate, the molar ratio of terephthalic acid / propylene glycol / 4,4'-diphenylmethane diisocyanate was 1.0 / 1.3 / 0. Two types of polyester urethane resins A and B were prepared as 0.25 or 1.0 / 2.0 / 0.25. Each polyester urethane resin was dissolved in methyl ethyl ketone so as to be 20% by mass. A methyl ethyl ketone solution of each polyester urethane resin was applied to a PET film having a thickness of 80 μm with one side surface-treated using a coating device, and dried with hot air at 70 ° C. for 10 minutes to obtain a film having a thickness of 35 μm. For each film, the temperature dependence of the elastic modulus was measured at a tensile load of 5 g and a frequency of 10 Hz using a wide-area dynamic viscoelasticity measuring device. The glass transition temperature of the polyester urethane resin obtained from the glass transition temperature was 105 ° C. for the polyester urethane resin A: 105 ° C. and 70 ° C. for the polyester urethane resin B.

[Preparation of first non-conductive adhesive layer]
As the radically polymerizable substance, 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toa Synthetic Co., Ltd.), dimethylol tricyclodecandic acrylate (product name:: DCP-A, manufactured by Kyoeisha Chemical Co., Ltd., 10 parts by mass, and 2-methacryloxyethyl acid foshet (product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.), 1 part by mass were used as a free radical generator. 3 parts by mass of benzoyl radical (product name: Niper BMT-K, manufactured by Nichiyu Co., Ltd.) was used. Each of these components was mixed with 50 parts by mass of a 23% by mass solution obtained by dissolving polyester urethane resin B in a mixed solvent of toluene / methyl ethyl ketone = 50/50, and stirred to obtain a resin solution. This resin solution is applied to a PET film having a thickness of 50 μm with one side surface-treated using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a PET film and a non-conductive adhesive layer A having a thickness of 2 μm. A laminated body PA (width 15 cm, length 80 m) with the non-conductive adhesive layer (1) was obtained.

[Preparation of conductive adhesive layer]
As radically polymerizable substances, 25 parts by mass of the above urethane acrylate, 15 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toa Synthetic Co., Ltd.), and 2-methacryloyloxyethyl acidphoshet. (Product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.) 1 part by mass was used, and 3 parts by mass of benzoyl peroxide (product name: Niper BMT-K40, manufactured by Nichiyu Co., Ltd.) was used as a free radical generator. Each of these components was mixed with 60 parts by mass of a 20 mass% methyl ethyl ketone solution of polyester urethane resin A and stirred to obtain a binder resin solution. On the other hand, a nickel layer having a thickness of 0.1 μm is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 μm is further provided outside the nickel layer to provide conductive particles having an average particle size of 3 μm (20% compressive elastic modulus). (K value): 500 kgf / mm ² ) was obtained. The conductive particles were dispersed in a binder resin solution in an amount of 3% by volume, coated on a PET film having a thickness of 50 μm with one side surface-treated using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a PET film. A laminated body PB (width 15 cm, length 80 m) with a conductive adhesive layer B having a thickness of 3 μm was obtained.

[Preparation of second non-conductive adhesive layer]
As the radically polymerizable substance, 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toa Synthetic Co., Ltd.), dimethylol tricyclodecandic acrylate (product name:: DCP-A, manufactured by Kyoeisha Chemical Co., Ltd., 10 parts by mass, and 2-methacryloxyethyl acid foshet (product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.), 1 part by mass were used as a free radical generator. 3 parts by mass of benzoyl radical (product name: Niper BMT-K, manufactured by Nichiyu Co., Ltd.) was used. Each of these components was mixed with 50 parts by mass of a 23% by mass solution obtained by dissolving polyester urethane resin B in a mixed solvent of toluene / methyl ethyl ketone = 50/50, and stirred to obtain a resin solution. This resin solution is applied to a PET film having a thickness of 50 μm with one side surface-treated using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a PET film and a non-conductive adhesive layer C having a thickness of 8 μm (No. 1). A laminated PC (width 15 cm, length 70 m) with the non-conductive adhesive layer (2) was obtained.

[Preparation of adhesive film]
The obtained laminated body PA and the laminated body PB are bonded together so that the non-conductive adhesive layer A and the conductive adhesive layer B face each other, and a laminator (product name: RISTON, model: HRL, manufactured by Dupont) is bonded. , Roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min) for laminating. Next, the PET film on the conductive adhesive layer B side was peeled off, and the laminated body PAB (width 15 cm, length) in which the PET film, the non-conductive adhesive layer A, and the conductive adhesive layer B were laminated in this order. 70m) was obtained.

Subsequently, the obtained laminated body PAB and the laminated body PC are bonded together so that the conductive adhesive layer B and the non-conductive adhesive layer C face each other, and a laminator (product name: RISTON, model: HRL, Laminated using Dupont, roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min). Next, the PET film on the non-conductive adhesive layer C side is peeled off, and the PET film (base material), the non-conductive adhesive layer A, the conductive adhesive layer B, and the non-conductive adhesive layer C are in this order. A laminated PABC (width 15 cm, length 60 m) with the adhesive film laminated in 1 was obtained.

The end face of the obtained laminated body PABC was observed with a scanning electron microscope (SEM), and the length L of the conductive region, the length L1 of the first non-conductive region R1, and the second non-conductive region R2 were observed. The length L2 of each was measured as follows.
First, in the laminated PABC, the shortest of the planes in contact with the conductive particles and substantially parallel to the interface between the PET film and the non-conductive adhesive layer A (a line on the SEM image; the same applies hereinafter). Of the first tangent plane that exists at a distance and the plane that is in contact with the conductive particles and is substantially parallel to the surface of the laminated PABC on the non-conductive adhesive layer C side, it exists at the shortest distance from the surface. The length of the region (conductive region) between the second tangent plane, which is the plane to be formed, was measured as L.
Further, a region other than the conductive region (first non-conductive region) extending in the thickness direction of the laminated PABC from the first tangent plane toward the surface of the laminated PABC on the non-conductive adhesive layer A side. The length was measured as L1.
Further, a region other than the conductive region (second non-conductive region) extending in the thickness direction of the laminated PABC from the second tangent plane toward the surface of the laminated PABC on the non-conductive adhesive layer C side. The length was measured as L2.
As a result, L = 3 μm, L1 = 2 μm, and L2 = 8 μm.

[Making reels for adhesive films]
The obtained laminated PABC is cut into a tape having a width of 1.0 mm to form an adhesive tape, and a plastic winding core (width 1.7 mm) having an inner diameter of 40 mm and an outer diameter of 48 mm is 50 m with the adhesive film surface inside. It was wound to obtain a reel for an adhesive film.

(Example 2)
In the production of the conductive adhesive layer, a nickel layer having a thickness of 0.2 μm is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 μm is further provided outside the nickel layer to conduct conductivity having an average particle size of 4 μm. The substrate was used in the same manner as in Example 1 except that the sex particles (20% compressive elasticity (K value): 410 Kgf / mm ² ) were obtained and the thickness of the conductive adhesive layer was 4 μm. A laminate with an adhesive film (thickness 14 μm) was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 4 μm, L1 = 2 μm, and L2 = 8 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and a reel for an adhesive film was obtained in the same manner as in Example 1.

(Example 3)
The substrate and the adhesive film (thickness 14) are the same as in Example 2 except that the thickness of the first non-conductive adhesive layer is 2.5 μm and the thickness of the second non-conductive adhesive layer is 8 μm. A laminated body with .5 μm) was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 4 μm, L1 = 2.5 μm, and L2 = 8 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and a reel for an adhesive film was obtained in the same manner as in Example 1.

(Example 4)
The substrate and the adhesive film (thickness 15 μm) are the same as in Example 1 except that the thickness of the first non-conductive adhesive layer is 2 μm and the thickness of the second non-conductive adhesive layer is 10 μm. Was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 3 μm, L1 = 2 μm, and L2 = 10 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and a reel for an adhesive film was obtained in the same manner as in Example 1.

(Example 5)
The substrate and the adhesive film (thickness 14) are the same as in Example 1 except that the thickness of the first non-conductive adhesive layer is 2.5 μm and the thickness of the second non-conductive adhesive layer is 10 μm. A laminated body with .5 μm) was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 3 μm, L1 = 2.5 μm, and L2 = 10 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and an adhesive film reel was obtained in the same manner as in Example 1.

(Comparative Example 1)
As radically polymerizable substances, 20 parts by mass of the above urethane acrylate, 15 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toa Synthetic Co., Ltd.), and 2-methacryloyloxyethyl acid phosphate. (Product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.) 1 part by mass was used, and 3 parts by mass of benzoyl peroxide (product name: Niper BMT-K40, manufactured by Nichiyu Co., Ltd.) was used as a free radical generator. Each of these components was mixed with 60 parts by mass of a 20 mass% methyl ethyl ketone solution of polyester urethane resin A and stirred to obtain a resin solution. On the other hand, a nickel layer having a thickness of 0.1 μm is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 μm is further provided outside the nickel layer to provide conductive particles having an average particle size of 3 μm (20% compressive elastic modulus). (K value): 500 kgf / mm ² ) was obtained. The conductive particles were dispersed in a binder resin solution in an amount of 3% by volume, coated on a PET film having a thickness of 50 μm with one side surface-treated using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a PET film. A laminated body PB'(width 15 cm, length 70 m) with a conductive adhesive layer B'with a thickness of 3 μm was obtained.

As the radically polymerizable substance, 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toa Synthetic Co., Ltd.), dimethylol tricyclodecandic acrylate (product name:: DCP-A, manufactured by Kyoeisha Chemical Co., Ltd., 10 parts by mass, and 2-methacryloxyethyl acid foshet (product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.), 1 part by mass were used as a free radical generator. 3 parts by mass of benzoyl radical (product name: Niper BMT-K, manufactured by Nichiyu Co., Ltd.) was used. Each of these components was mixed with 50 parts by mass of a 23% by mass solution obtained by dissolving polyester urethane resin B in a mixed solvent of toluene / methyl ethyl ketone = 50/50, and stirred to obtain a resin solution. This resin solution was applied to a PET film having a surface treatment of 50 μm on one side using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a PET film and a non-conductive adhesive layer C'with a thickness of 12 μm. PC'(width 15 cm, length 70 m) was obtained.

The obtained laminated body PB'and the laminated body PC' are bonded together so that the conductive adhesive layer B'and the non-conductive adhesive layer C'face each other, and a laminator (product name: RISTON, model: HRL) is bonded. , Dupont, roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min). Next, the PET film on the non-conductive adhesive layer C'side is peeled off, and a laminate of the PET film (base material) and an adhesive composed of the conductive adhesive layer B'and the non-conductive adhesive layer C'. PB'C'(width 15 cm, length 60 m) was obtained. When L and L2 were measured in the same manner as in Example 1, L = 3 μm and L2 = 12 μm. The obtained laminate was cut into a tape having a width of 1.0 mm to form an adhesive tape, and a plastic winding core (width 1.7 mm) having an inner diameter of 40 mm and an outer diameter of 48 mm was 50 m with the adhesive film surface inside. It was wound to obtain a reel for an adhesive film.

(Comparative Example 2)
In the production of the conductive adhesive layer, a nickel layer having a thickness of 0.2 μm is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 μm is further provided outside the nickel layer to provide conductivity having an average particle size of 4 μm. Adhesion to the substrate in the same manner as in Comparative Example 1 except that particles (20% compressive elasticity (K value): 410 Kgf / mm ^{2) were obtained and the thickness of the conductive adhesive layer was 4 μm.} A laminated body with an agent film (thickness 16 μm) was obtained. When L and L2 were measured in the same manner as in Example 1, L = 4 μm and L2 = 8 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and a reel for an adhesive film was obtained in the same manner as in Comparative Example 1.

(Comparative Example 3)
The substrate and the adhesive film (thickness 13 μm) are the same as in Example 1 except that the thickness of the first non-conductive adhesive layer is 4 μm and the thickness of the second non-conductive adhesive layer is 6 μm. Was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 3 μm, L1 = 4 μm, and L2 = 6 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and an adhesive film reel was obtained in the same manner as in Example 1.

(Comparative Example 4)
The substrate and the adhesive film (thickness 14 μm) are the same as in Example 2 except that the thickness of the first non-conductive adhesive layer is 4 μm and the thickness of the second non-conductive adhesive layer is 6 μm. Was obtained. When L, L1 and L2 were measured in the same manner as in Example 1, L = 4 μm, L1 = 4 μm, and L2 = 6 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and an adhesive film reel was obtained in the same manner as in Example 1.

(Reference example)
In Comparative Example 1, after laminating the laminated body PB'and the laminated body PC', the PET film on the conductive adhesive layer B'side was peeled off instead of the PET film on the conductive adhesive layer C'side. A laminate of the base material and the adhesive film (thickness 15 μm) was obtained in the same manner as in Comparative Example 1. When L and L2 were measured in the same manner as in Example 1, L = 3 μm and L2 = 12 μm. Further, this laminated body was cut into a tape having a width of 1.0 mm to obtain an adhesive tape, and a reel for an adhesive film was obtained in the same manner as in Comparative Example 1.

<Evaluation of the presence or absence of blocking>
The reel for the adhesive film was laid down in a constant temperature bath at 30 ° C. (humidity: 40 to 60% RH) and left for 1 day (24 hours). Then, using a tensile compression tester (product name: STA-1150, manufactured by Orientec Co., Ltd.), the adhesive tape was pulled out to the end at a speed of 1 m / min. The case where the adhesive film was peeled off from the PET film in the middle was evaluated as blocking "Yes", and the case where the adhesive film could be pulled out without peeling from the PET film was evaluated as blocking "No". The evaluation results are shown in Tables 1 and 2.

<Manufacturing of circuit connection>
The adhesive film surface of each adhesive tape (width 1.0 mm, length 3 cm) obtained in Examples and Comparative Examples is placed on an FPC substrate having 500 tin-plated copper circuits having a pitch of 40 μm and a thickness of 8 μm. In this state, the adhesive film and the FPC substrate were temporarily connected by peeling off the PET film after heating and pressurizing at 70 ° C. and 1 MPa for 1 second. Next, the adhesive film and the FPC substrate were placed on an ITO-coated glass substrate (15Ω □) having a thickness of 1.1 mm, and were temporarily fixed by applying pressure at 50 ° C. and 0.5 MPa for 0.5 seconds. A glass substrate to which the FPC substrate was temporarily fixed by an adhesive film was installed in this crimping device, and a silicone rubber having a thickness of 200 μm was used as a cushioning material, and the FPC substrate was heated and pressed at 170 ° C. and 3 MPa for 5 seconds from the FPC substrate side. A circuit connection was obtained by connecting the adhesive film over a width of 1.0 mm. Only for the reference example, the adhesive film was first temporarily connected to the ITO-coated glass substrate, and then the FPC substrate was temporarily fixed to the adhesive film. Other than that, a circuit connector was obtained under the same conditions as in the above Examples and Comparative Examples.

<Measurement of connection resistance>
For each of the manufactured circuit connectors, the resistance value between the adjacent circuits of the FPC board including the connection portion was measured with a multimeter (device name: TR6485, manufactured by Advantest Co., Ltd.). The resistance value was obtained by measuring 30 points of resistance between different adjacent circuits and calculating them as an average value. The evaluation results are shown in Tables 1 and 2.

<Measurement of adhesive strength>
The adhesive strength of each of the manufactured circuit connectors was measured by pulling the FPC substrate perpendicularly to the main surface of the substrate at a peeling speed of 50 mm / min (peeling at 90 degrees). The evaluation results are shown in Tables 1 and 2.

As shown in Table 1, in Examples 1 to 5, blocking did not occur, and good connection resistance and adhesive strength were obtained.

As shown in Table 2, blocking occurred in both Comparative Examples 1 and 2 (therefore, the connection resistance and the adhesive strength were not evaluated). On the other hand, in a general two-layer adhesive film (reference example) in which a non-conductive adhesive layer is formed on a base material and a conductive adhesive layer is further formed on the non-conductive adhesive layer, blocking does not occur. The evaluation results of connection resistance and adhesive strength were also good. Further, in Comparative Examples 3 and 4, an increase in connection resistance was observed.

From the above, according to the present invention, for example, it can be attached to the FPC substrate side, the occurrence of blocking can be suppressed, and excellent connection reliability can be obtained when the circuit connector is used for manufacturing. Was confirmed.

1,11,26 ... Adhesive film, 2 ... First non-conductive adhesive layer, 3 ... Conductive adhesive layer, 4 ... Second non-conductive adhesive layer, 5 ... Conductive particles, 21 ... Adhesive film reel, 22 ... winding core, 24, 24A, 24B ... adhesive tape, 25 ... substrate, R ... conductive region, R1 ... first non-conductive region, R2 ... second non-conductive region region.

Claims (7)

With a tape-shaped base material,
An adhesive tape comprising an adhesive film provided on one surface of the substrate.
The adhesive film laminates a first non-conductive adhesive layer, a conductive adhesive layer containing conductive particles, and a second non-conductive adhesive layer in this order from the base material side. Let me
The base material is provided only on the first non-conductive adhesive layer side of the adhesive film.
The thickness T1 of the first non-conductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1).
An adhesive tape in which the T1 and the thickness T2 of the second non-conductive adhesive layer satisfy the following formula (3A).
T1 <T ... (1)
T1 ≤ 0.5 × T2 ... (3A) The adhesive tape according to claim 1, wherein the T1 and the average particle size r of the conductive particles satisfy the following formula (2).
T1 ≤ 0.8 × r ... (2) With a tape-shaped base material,
An adhesive tape comprising an adhesive film provided on one surface of the substrate.
The adhesive film is an adhesive film containing conductive particles.
From the base material side, the adhesive film has a first non-conductive region in which the conductive particles do not exist, a conductive region in which the conductive particles exist, and a second region in which the conductive particles do not exist. Non-conductive regions are provided in this order in the thickness direction of the adhesive film.
The base material is provided only on the first non-conductive region side of the adhesive film.
The length L1 in the thickness direction of the adhesive film in the first non-conductive region and the length L in the thickness direction of the adhesive film in the conductive region satisfy the following formula (4).
An adhesive tape in which the L1 and the length L2 in the thickness direction of the adhesive film in the second non-conductive region satisfy the following formula (6A).
L1 <L ... (4)
L1 ≦ 0.5 × L2… (6A) The adhesive tape according to claim 3 , wherein the L1 and the average particle size r of the conductive particles satisfy the following formula (5).
L1 ≤ 0.8 × r ... (5) The adhesive tape according to any one of claims 1 to 4,
An adhesive film reel comprising a winding core around which the adhesive tape is wound. With a tape-shaped base material,
A method for manufacturing an adhesive tape comprising an adhesive film provided on one surface of the base material.
The first non-conductive adhesive layer, the conductive adhesive layer containing conductive particles, and the second non-conductive adhesive layer are laminated in this order on one surface of the base material. With the process of obtaining an adhesive film,
In the adhesive tape, the base material is provided only on the first non-conductive adhesive layer side of the adhesive film.
The thickness T1 of the first non-conductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1).
A method for producing an adhesive tape, wherein the T1 and the thickness T2 of the second non-conductive adhesive layer satisfy the following formula (3A).
T1 <T ... (1)
T1 ≤ 0.5 × T2 ... (3A) The method for producing an adhesive tape according to claim 6 , wherein the T1 and the average particle size r of the conductive particles satisfy the following formula (2).
T1 ≤ 0.8 × r ... (2)

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