JP3783791B2 - Connection member and electrode connection structure and connection method using the connection member - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component and a circuit board, and a connection member that bonds and fixes circuit boards together and electrically connects both electrodes, and an electrode connection structure and a connection method using the connection member.
[0002]
[Prior art]
In recent years, with the reduction in size and thickness of electronic components, circuits used for these have become denser and higher in definition. Since it is difficult to connect such an electronic component and a fine electrode with a conventional solder or rubber connector, an anisotropic conductive adhesive or a film-like material (hereinafter referred to as a connecting member) having excellent resolution is recently available. ) Is frequently used.
This connecting member is made of an adhesive containing a predetermined amount of a conductive material such as conductive particles. This connecting member is provided between the electronic component and the electrode or circuit of the substrate, and constitutes a pressurizing or heating and pressing means. The two electrodes are electrically connected to each other, and the electrodes formed adjacent to the electrodes are provided with insulation so that the electronic component and the circuit are bonded and fixed. is there.
[0003]
The basic idea for increasing the resolution of the connecting member is to ensure the insulation between the adjacent electrodes by making the particle size of the conductive particles smaller than the insulating portion between the adjacent electrodes. The amount is set to such an extent that the particles do not come into contact with each other and is surely present on the electrode to obtain conductivity at the connection portion.
The mounting by this connecting member has been put into practical use for mounting a TAB mounted with an IC chip on a substrate such as glass or plastic, or mounting a bare chip directly on these substrates.
[0004]
In addition, as a connection member capable of connecting such fine electrodes and circuits and having excellent connection reliability, a connection member having conductive particles, dense areas thereof, or conductive protrusions in a necessary portion in the plane direction is also proposed. is there. According to this, although a dot-shaped fine electrode such as a semiconductor chip can be connected, there is a disadvantage that the precise alignment between the conductive particle dense region and the dot-shaped electrode is necessary and the workability is inferior.
[0005]
[Problems to be solved by the invention]
In the conventional method described above, for example, when the leads of package type ICs such as QFP (quad flat package), PLCC, and SOP are mounted on a substrate, or the circuits such as TAB, FPC, and PCB are connected to each other, When there is no combination of protrusions or a substrate on one lead, or when the electrode height (H) is larger than the electrode width (B), there are the following problems and the practical application has not progressed.
(1) If both electrodes are convex, the aligned counter electrode flows together with the adhesive due to the flow of the adhesive when the electrodes are connected by pressurization or heating and pressurization, resulting in displacement of the electrodes.
(2) When there is no substrate on one of the leads to be connected, these lead electrodes have a large height of, for example, 100 μm or more in order to maintain mechanical strength. It tends to cause height variations.
(3) When the electrode height (H) is larger than the electrode width (B), the conductive material flows out from the electrode to the space between the electrodes because the adhesive flow distance at the time of connection is large. Connection characteristics are insufficient. When the flow of the adhesive is suppressed, the space is not sufficiently filled with the adhesive, and the two substrates are not sufficiently bonded.
[0006]
The present invention has been made in view of the above-described drawbacks, and even when the electrode height is larger than the electrode width, the positional displacement of the electrode is less likely to occur, the adhesiveness is excellent, and the warpage and height variation of the electrode and lead are absorbed. It is related with the connection member of high resolution which can be connected.
[0007]
[Means for Solving the Problems]
The present invention provides a connection member in which an insulating adhesive layer is formed on at least one surface of a conductive adhesive layer made of a conductive material and a binder, wherein the conductive adhesive layer includes the conductive material, the insulating fibrous material, and the binder. And the conductive material has a height of 15 μm or less, and the height of the conductive material is larger than the diameter of the single fiber constituting the insulating fibrous material. It is a connection member characterized by these.
[0008]
Further, the conductive material using this connecting member and the fibrous material are present between the electrodes facing each other, and at least a part of the fibrous material in the longitudinal direction is continuously present between the adjacent electrodes and insulated. The electrode connection structure is characterized in that a conductive adhesive layer covers at least the periphery of the protruding electrode on the substrate side. Preferably, the distance between the electrode rows facing each other is substantially equal to the diameter of the single fiber constituting the fibrous material. In this connection structure, the conductive material is deformed, and at least one electrode outside the electrode connection portion is covered with a connection member made of a fibrous material and a binder.
[0009]
Furthermore, between the opposing electrode rows having at least one projecting electrode, the insulating adhesive layer of the connecting member is arranged on the projecting electrode side, and a fibrous material is interposed between adjacent electrodes between the electrode rows. In this state, the method of connecting electrodes is characterized by heating and pressurizing, and the heating and pressurizing process is divided into two or more stages, between which a connection electrode energization inspection process and / or a repair process are required. The present invention relates to an electrode connection method performed accordingly.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view of a connecting member for explaining an embodiment of the present invention. In the connecting member of the present invention, the insulating adhesive layer 2 is formed on at least one side of the conductive adhesive layer 1 having conductivity in the pressurizing direction composed of the conductive material 3, the insulating fibrous material 4, and the binder 5. A multilayer connection member. The insulating adhesive layer 2 may be formed on both surfaces (2, 2 ′) of the conductive adhesive layer 1.
Although not shown in FIG. 1, the insulating adhesive layer 2 may be further provided with a function such as adhesiveness in a multilayer structure. In order to prevent unnecessary adhesion or dust from adhering to these surfaces, a peelable separator can be present as necessary. Further, it is preferable that the connecting member is in the form of a continuous tape because the connection work process can be continuously automated.
[0011]
FIG. 2 is a schematic cross-sectional view illustrating the conductive adhesive layer 1 having conductivity in the pressing direction. The conductive adhesive layer 1 includes a conductive material 3 and a binder 5 containing a fibrous material 4. Here, as the conductive material 3, those shown in FIGS. 2A to 2G can be applied. Among these, the conductive material 3 has a particle size that can exist in a single layer in the thickness direction of the binder 5 as shown in FIGS. 2C to 2E, that is, a particle size substantially equal to the thickness of the binder 5. Since the conductive material 3 hardly flows at the time of connection, it is preferable that the conductive material 3 is easily held on the electrode. When the conductive material 3 is substantially equal to the thickness of the binder 5, it is easy to obtain conductivity because it can be electrically connected to the electrode by simple contact.
[0012]
The ratio of the conductive material 3 to the binder 5 is preferably about 0.1 to 20% by volume, more preferably 1 to 15% by volume, because anisotropic conductivity is easily obtained. Further, in order to easily obtain conductivity in the thickness direction and to achieve high resolution, the thickness of the binder 5 is preferably as thin as possible within the range in which a film can be formed, and is preferably 20 μm or less, more preferably 10 μm or less.
[0013]
As the conductive material 3, for example, as illustrated in FIGS. 2A to 2E, it is preferable to form the conductive material 3 because it is relatively easy to manufacture and is easily available. The conductive material 3 may be provided with a through-hole in the binder 5 as shown in FIG. 2 (f) to form a conductor by plating or the like, or may be in the form of a conductive fiber such as a wire as shown in FIG. 2 (g). .
[0014]
Examples of the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, and the like, and may be a simple substance, a mixture, a composite, an alloy, or the like. These conductive particles may be used as a core material, or a core material made of a polymer such as non-conductive glass, ceramics or plastic may be coated with a conductive layer made of the above-described material. Furthermore, insulating coating particles formed by coating the conductive material 3 with an insulating layer, or the combined use of conductive particles and insulating particles such as glass, ceramics, and plastics can be applied because the resolution is improved.
[0015]
In order to secure one or more particles, preferably as many particles as possible, on the minute electrode, the particle size is preferably 15 μm or less, more preferably 7 μm or less and 1 μm or more. If it is less than 1 μm, it is difficult to contact the electrode through the insulating adhesive layer. Further, it is preferable that the conductive material 3 has a uniform particle diameter because there is little outflow from between the electrodes.
Among these conductive particles, those in which a conductive layer is formed on a polymer core material such as plastic, and hot-melt metal such as solder are deformable by heating or pressurization, and contact with a circuit for connection This is preferable because the area is increased and the reliability is improved. In particular, when a polymer is used as a nucleus, it does not show a melting point like solder, so that the softening state can be widely controlled by the connection temperature and it is easy to cope with variations in electrode thickness and flatness.
Also, for example, in the case of hard metal particles such as Ni and W, or particles having a large number of protrusions on the surface, the conductive particles hit the electrodes and the wiring pattern, so that even when an oxide film or a contaminated layer is present, low connection resistance Is preferable, and reliability is improved.
[0016]
The fibrous material 4 can be either a non-woven fabric or a woven fabric, but needs to be insulative. Examples of the fibrous material 4 include inorganic materials such as glass, ceramics, aluminum oxide, magnesium oxide, and boron nitride, and polymers such as polyester, acrylic, polyamide, kevlar aramid, and silicone carbide. The fiber diameter, length, and the like of the fibrous material 4 are selected from the relationship with the conductive material 3 and the distance between the electrodes to be connected, but the thickness of the conductive material 3 (conductivity is larger than the diameter of single fibers constituting these fibrous materials. It is preferable that the particle diameter of the particles or the distance in the thickness direction of the conductive material is large so that conductivity can be easily obtained at the time of connection. In this case, when the conductive material 3 is deformable and the fibrous material 4 is harder than the conductive material 3 at the time of connection, the fibrous material 4 acts as a spacer, and the degree of deformation of the conductive material 3 can be controlled. (Refer to FIG. 8 described later).
The fiber length is preferably equal to or greater than the distance between adjacent electrodes, so that the effect of the present invention can be obtained with certainty because it can be continuously present between adjacent electrodes. It can be applied when an advantageous effect is obtained.
[0017]
3 to 4 show the relationship between the conductive material 3 and the fibrous material 4. FIG. 3 shows a case where the fibrous material 4 is a non-woven fabric. Since there is no directionality of the fibrous material 4, it is possible to disperse the curing stress generated at the time of connection. In addition, since the nonwoven fabric can be formed of a single fiber, the distance between the electrodes of the connecting portion can be easily set small.
[0018]
FIG. 4 shows a case where the fibrous material 4 is a woven fabric, and FIG. 4A is preferable because a constant thickness can be obtained by plain weaving and a fine mesh can be obtained. Moreover, (b) is a twill weave and has a feature that it can be obtained at a low cost.
In the case of the woven fabric, the strength is higher than that of the nonwoven fabric, so that even when the strength of the electrode or the lead is large and the variation in warpage or height is large, it can be connected and pressed.
[0019]
For the binder 5 and the insulating adhesive layer 2, a material exhibiting curability by heat or light can be widely applied, and it is preferable that the adhesive is high. Since these are excellent in heat resistance and moisture resistance after connection, application of a curable material is preferable. Among these, epoxy adhesives are particularly preferable because they can be cured in a short time, have good connection workability, and have excellent molecular adhesion.
[0020]
Epoxy adhesives are mainly composed of epoxy modified with high molecular weight epoxy, solid epoxy and liquid epoxy, urethane, polyester, acrylic rubber, NBR, silicone, nylon, etc., curing agent, catalyst, coupling agent, filling A material obtained by adding an agent or the like is generally used.
[0021]
When the binder component 5 and the insulating adhesive layer 2 of the present invention contain 1% or more, preferably 5% of a common material in each component, the interfacial adhesive force between the two layers is improved, which is suitable. As the common material, a main material, a curing agent, and the like are more effective.
[0022]
As a method for producing the connection member of the present invention, for example, a method of laminating the conductive adhesive layer 1 and the insulating adhesive layer 2 or laminating and sequentially applying the layers can be employed. The conductive adhesive layer 1 can be formed by impregnating and applying the impregnated conductive material 3 to the fibrous material 4.
[0023]
An electrode connection structure using the connection member of the present invention and a manufacturing method thereof will be described with reference to FIGS. FIG. 5 shows a structure in which the protruding electrode 12 formed on the substrate 11 and the planar electrode 13 of the substrate 11 ′ are connected via the connecting member of the present invention. That is, it is a connection structure between electrode rows in which at least one of the oppositely facing electrode rows protrudes, the conductive material 3 exists between the oppositely facing electrodes 12-13, and is more conductive than the periphery 14 of the protruding electrode 12 The material 3 exists in a high density state, and the electrode rows facing each other are connected. The insulating adhesive layer 2 covers at least the protruding electrode 12 around the protruding electrode 12. Here, the planar electrode 13 refers to a case where there is no unevenness from the surface of the substrate 11 or even a few μm or less. When these are illustrated, the electrodes obtained by the additive method and the thin film method are typical.
[0024]
FIG. 6 shows a case where the electrodes formed on the substrate are the protruding electrodes 12 and 12 ′. That is, this is a structure in which both surfaces shown in FIG. 1 are connected via a connecting member having insulating adhesive layers 2 and 2 ′. The insulating adhesive layers 2 and 2 ′ cover the periphery of the protruding electrodes 12 and 12 ′, respectively, and are in contact with the substrates 11 and 11 ′.
[0025]
FIG. 7 is a plan view of FIGS. The conductive material 3 and the fibrous material 4 exist between the electrodes 12 facing each other, and at least a part of the fibrous material in the length direction exists in common between adjacent electrodes (12-12 ′). . The conductive material 3 is deformed on the protruding electrode 12 if it can be deformed at the time of connection, but the particle diameter is relatively small because there is no deformation in the space 15 that is the distance between adjacent electrodes.
As shown in FIG. 8, the connection structure portion may be further covered with a connection member including a fibrous material 4 ′ and a binder 5 ′. In this case, it is preferable to contain a fibrous material because mechanical reinforcement is further enhanced.
5 to 6, the conductive adhesive layer 1 and the insulating adhesive layer 2 form a boundary, but may be mixed, and the density of the conductive material 3 from the top 16 of the protruding electrode 12 to the substrate 11 side. A configuration may be adopted in which the thickness becomes thin in an inclined manner.
[0026]
5 to 8, examples of the substrate 11 include plastic films such as polyimide and polyester, composites such as glass fiber / epoxy, semiconductors such as silicone, inorganic substances such as glass and ceramics, and the like. The protruding electrode 12 can include various circuits and terminals in addition to the above. The various electrodes shown in FIGS. 6 to 7 can be applied in any combination.
[0027]
In the electrode connecting method using the connecting member of the present invention, the insulating adhesive layer 2 of the connecting member is disposed on the protruding electrode 12 side, and a fibrous material is interposed between adjacent electrodes between the electrode rows. Heat and press with. The positional displacement of the electrode is less likely to occur due to the interposition of the fibrous material.
In the connection process, the heating and pressurizing process may be divided into two or more stages, and an electrode connection method including an energization inspection process and / or a repair process may be used as necessary. By dividing the heating and pressurizing step into two or more steps, it is possible to control the viscosity of the flow process associated with the curing reaction of the adhesive, and thus it is possible to achieve a good connection without bubbles. In addition, it is possible to impart repairability, which is a problem with curable adhesives.
[0028]
The energization inspection step can be performed while increasing the cohesive force of the connection member to the extent that the connection electrode can be held, or pressurizing the electrode connection portion. The energization inspection can be performed, for example, by taking out lead wires from both electrodes and measuring connection resistance. At this time, the appearance inspection of the contact state between the conductive material 3 and the electrode can also be performed together or independently.
Repairability is to remove the adhesive from unnecessary parts, clean it with a solvent, etc., and reconnect. In general, a curable adhesive has been regarded as a problem because a network structure develops after curing, becomes insoluble and infusible with heat, solvent, and the like, and is extremely difficult to clean. In the first stage of the heating and pressurizing process, for example, the conductive material 3 is in contact with the protruding electrode 12, and an energization inspection of both electrodes is performed in a state where the conductive material 3 can conduct with the flat electrode 13. At this time, if there is a connection portion of a defective electrode, repair is performed in this state, and reconnection is performed. Since the adhesive is in an uncured state or an insufficient curing reaction, it is easily peeled off and soaked in a solvent, and repair work is easy.
[0029]
According to the present invention, the conductive adhesive layer of the connection member contains a conductive material, an insulating fibrous material, and a binder, and the fibrous material is present on the adjacent electrodes between the electrode rows when the electrodes are connected by pressurization or heating and pressurization. Heat and pressurize in an intervening state. Since the insulating fibrous material is not less than the distance between adjacent electrodes, the outflow of the space of the electrode protrusion is suppressed, and the positional displacement of the electrode hardly occurs. Further, since the strength of the connection portion is improved by the interposition of the fibrous material, the warp and height variation of the lead electrode are easily absorbed, and the flow of the conductive material is also suppressed, so that it is difficult to flow out from the electrode. As described above, stable and reliable connection can be obtained even when the electrode height (H) is larger than the electrode width (B).
When the thickness of the conductive material 3 (the particle diameter of the conductive particles or the distance in the thickness direction of the conductive material) is larger than the diameter of the single fiber constituting the fibrous material, the conductive material 3 easily comes into contact with the electrode. In this case, if the conductive material 3 is deformable and the fibrous material 4 is harder than the conductive material 3, the fibrous material 4 acts as a spacer, and the degree of deformation of the conductive material 3 is reduced. It is possible to control the distance between the electrodes after connection.
[0030]
Further, according to the present invention, since the conductive material 3 is reliably held on the electrode 12 and can be conducted, the reliability of the conduction test is improved. Since the adhesive can be inspected for continuity in an uncured state or an insufficient curing reaction, the repair work is easy.
Depending on the purpose of the adhesive layer, for example, a combination that exhibits adhesiveness suitable for the material of the electrode substrate is possible, so that choices of materials are expanded, and connection reliability is also improved due to reduction of bubbles in the connection portion. In addition, by making one of them soluble or swellable in a solvent, or by making a difference in heat resistance, it is possible to preferentially peel from one substrate surface, and to provide so-called repairability for reconnection. Alternatively, any combination suitable for the material of the electrode substrate is possible, and it is easy to obtain contact between the electrode and the conductive particles, and the manufacturing method is also simple. Further, it is possible to obtain a reinforcing or moisture-proof effect by protruding the adhesive layer outside the connecting portion and acting as a sealing material.
Since the insulating adhesive layer 2 is disposed on the protruding electrode 12 side, the insulation between adjacent electrodes and the resolution are improved. Since the conductive material 3 of the conductive adhesive layer 1 is uniformly dispersed over the entire surface, it is excellent in workability because accurate alignment between the conductive particles and the electrodes is unnecessary.
[0031]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
Example 1
(1) Preparation of conductive adhesive layer The ratio of phenoxy resin (high molecular weight epoxy resin) and liquid epoxy resin (epoxy equivalent 185) containing a microcapsule type latent curing agent is 30/70, and a 30% solution of ethyl acetate Got. In this solution, 5% by volume of conductive particles in which a Ni / Au metal coating with a thickness of 0.2 / 0.02 μm is formed on polystyrene-based particles having a particle size of 10 ± 0.5 μm, glass fibers (diameter 2 μm, average) 1% by volume of fiber length 100 μm) was added and mixed and dispersed. This dispersion was applied to a separator (silicone-treated polyethylene terephthalate film, thickness 40 μm) with a roll coater to obtain a sheet having a thickness of 12 μm.
(2) Formation of Insulating Adhesive Layer and Connection Member Preparation Conductive particles and glass fibers were removed from the formulation of (1), and a sheet having a thickness of 25 μm was prepared in the same manner as (1). First, the conductive adhesive layer surface (1) and the adhesive layer surface (2) were laminated while being rolled between rubber rolls.
(3) A two-layer FPC circuit board having a copper circuit with a height of 25 μm on the connecting polyimide film (parallel circuit electrodes with a circuit pitch of 100 μm and an electrode width of 40 μm), and an indium oxide thickness of 0.1 mm on a glass of 1.1 mm. Connection to a planar electrode having a thin film circuit of 2 μm (ITO, surface resistance 20Ω / □) was performed. At this time, the heat source of the connection device was arranged on the insulating adhesive layer side. First, a conductive adhesive layer was placed on the planar electrode side. The connecting member was placed with a width of 2 mm, and the separator was peeled off and pasted. Since it was temporarily connected to the flat electrode side, it was easy to attach, and the subsequent separation of the separator was also easy. Next, align the other circuit board with the upper and lower circuits, 150 ° C, 20 kgf / mm ² A connected body was obtained in 15 seconds.
(4) Evaluation When the cross section of this connection body was polished and observed with a microscope, it was a connection structure corresponding to FIG. 5 and FIG. The space between the adjacent electrodes was free of bubbles and the particles were spherical, but the particles were compressed and deformed on the electrodes and held in contact with the upper and lower electrodes. The glass fiber existed continuously between adjacent electrodes as shown in FIG. When the cross section of the connection portion was observed, the insulating adhesive layer covered the periphery of the protruding electrode on the substrate side.
As a result of evaluating the connection resistance between the electrodes facing each other and the insulation resistance between adjacent electrodes, the connection resistance is 1Ω or less and the insulation resistance is 10 ^8. As described above, this showed almost no change even after treatment at 85 ° C. and 85% RH for 1000 hours, and showed good long-term reliability.
[0032]
Comparative Example 1
Although it is the same as that of Example 1, the single-layer connection member of the conventional structure of thickness 35 micrometers was obtained. When evaluated in the same manner as in Example 1, a short-circuit defect occurred. It is considered that the insulation between the adjacent electrodes (space part) can no longer be maintained because the positional deviation of the electrodes is large and the conductive particles flow out from the electrodes at the time of connection.
[0033]
Example 2
Similarly, an insulating adhesive layer was formed on the other surface of the conductive adhesive layer of Example 1 to obtain a multi-layer connecting member having a three-layer structure shown in FIG. The FPCs of Example 1 were similarly connected to obtain a connection structure corresponding to FIGS. 6 and 7. When evaluated in the same manner as in Example 1, good connection characteristics were shown. The glass fiber existed continuously between adjacent electrodes as shown in FIG. When the cross section of the connection portion was observed, the insulating adhesive layer covered the periphery of the protruding electrode on the substrate side. The glass fiber eliminates the phenomenon that one electrode enters the other space during connection.
[0034]
Comparative Example 2
Using the connection member of Comparative Example 1, the FPCs of Example 2 were similarly connected. In this case, the positional displacement of the electrodes is large, and one electrode enters the other space, and circuit connection is impossible.
[0035]
Examples 3-5
Similar to Example 2, but the fiber type was changed as follows. In Examples 4 to 5, sheets were obtained by impregnating a nonwoven fabric or a woven fabric with a conductive adhesive solution. Example 3 has an acrylic fiber, a diameter of 3 μm, and an average fiber length of 100 μm. Example 4 has a glass nonwoven fabric, a diameter of 2 μm, an average fiber length of 100 μm, and a nonwoven fabric thickness of 8 μm. Example 5 has a glass nonwoven fabric (twill weave), a diameter of 2 μm, an average fiber length of 100 μm, and a woven fabric thickness of 10 μm. When evaluated in the same manner as in Example 2, good connection characteristics were exhibited.
[0036]
Example 6
Although it is the same as that of the connection member of Example 4, the thickness of one insulating adhesive layer was 50 micrometers. For the electrodes, a QFP type IC lead (thickness: 100 μm, pitch: 300 μm) and a glass epoxy substrate (circuit electrode height: 35 μm) were connected. This configuration is a connection configuration corresponding to FIGS. 6 and 7, but is a case where a substrate is not present on one of the electrodes. When evaluated in the same manner as in Example 2, good connection characteristics were exhibited. When the cross section of the connecting portion was observed, the distance between the electrode rows facing each other was substantially the same as the single fiber diameter of the fibrous material (glass nonwoven fabric, diameter 2 μm, average fiber length 100 μm, nonwoven fabric thickness 8 μm), and the conductive material was It was compressed and deformed and held in contact with the upper and lower electrodes.
In this example, the electrodes were connected to each other with a large height, but there was no displacement of the electrodes, no bubbles were mixed between adjacent electrodes, and good connection characteristics were shown.
[0037]
Example 7
Similar to Example 6, except that one connection member of Example 6 is placed on and connected to the leads of the QFP type IC, and a part of one electrode outside of the electrode connection part is a fibrous material and a binder. The connection structure corresponding to FIG. 8 covered with a connection member made of When the connection structures of Examples 6 and 7 were subjected to a thermal shock test at −40 ° C. (30 minutes) / 125 ° C. (30 minutes), the change in connection resistance in Example 7 was small and good. It was. In Example 7, since the connection part was covered with the fibrous material, it is considered that the mechanical reinforcement was further enhanced.
[0038]
Example 8
Although it is the same as that of Example 6, the heating-pressing process was made into two steps. First, the connection resistance at the nuclear connection point was measured and inspected with a multimeter while applying pressure after 150 seconds at 20 ° C. and 20 kgf / mm ² . As a result, the IC chip was abnormal. Therefore, the abnormal chip was peeled off. Since the adhesive is in a state where the curing reaction is insufficient, the chip peeling and the subsequent cleaning with acetone are very simple, and the repair work is easy.
After the above energization inspection process and repair process, when connected at 150 ° C., 20 kgf / mm ² for 15 seconds, both examples showed good connection characteristics.
[0039]
【The invention's effect】
As described above in detail, according to the present invention, when the electrodes are connected, the adjacent electrodes between the electrode rows are connected with the fibrous material interposed therebetween, so that the outflow of the electrode protrusion into the space is suppressed and the electrode is displaced. Hard to occur. Further, since the strength of the connecting portion is improved by the interposition of the fibrous material, it is easy to absorb the warping and variation of the lead electrode.
Therefore, it is possible to provide a connection member with high resolution and excellent connection reliability, an electrode connection structure and a connection method using the connection member.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a connecting member showing an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view illustrating a conductive adhesive layer showing an example of the conductive adhesive layer of the present invention.
FIG. 3 is a schematic plan view showing the relationship between a conductive material and a fibrous material according to an embodiment of the present invention.
FIG. 4 is a schematic plan view showing the relationship between a conductive material and a fibrous material according to another embodiment of the present invention.
FIG. 5 is a schematic cross-sectional view of a connection structure showing an embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view of a connection structure showing another embodiment of the present invention.
FIG. 7 is a schematic plan view showing a connection structure showing an embodiment of the present invention.
FIG. 8 is a schematic cross-sectional view of a connection structure showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Conductive adhesive layer 2 Insulating adhesive layer 3 Conductive material 4 Fibrous material 5 Binder 11 Substrate 12 Protruding electrode 13 Planar electrode 14 Perimeter 15 Space 16 Top

Claims (7)

On at least one surface of the conductive material and comprising a server inductor conductive adhesive layer, in the connection member obtained by forming an insulating adhesive layer, the conductive adhesive layer is made of conductive material and the insulating fibrous material and a binder It is an adhesive layer showing conductivity only in the pressing direction, the height of the conductive material is 15 μm or less, and the height of the conductive material is larger than the diameter of the single fiber constituting the insulating fibrous material. Connecting member. 2. The connection member according to claim 1, wherein the height of the conductive material is substantially equal to the thickness of the binder.   3. A connection structure between electrode rows in which at least one of the opposed electrode rows protrudes, wherein the conductive material and the fibrous material according to claim 1 or 2 exist between the opposed electrodes, An electrode connection structure characterized in that at least a part in the length direction is continuously present between adjacent electrodes, and an insulating adhesive layer covers the periphery of the protruding electrode.   4. The electrode according to claim 3, wherein the distance between the electrode rows facing each other is substantially equal to the diameter of the single fiber constituting the fibrous material, and the conductive material is deformed and exists between the electrodes facing each other. Connection structure.   The electrode connection structure according to claim 3 or 4, wherein a part of the outside of at least one electrode of the electrode connection portion is covered with a connection member made of a fibrous material and a binder.   4. The connecting member according to claim 1, wherein at least one of the electrodes has a protruding electrode, and the insulating adhesive layer of the connection member according to claim 1 is disposed on the protruding electrode side, and adjacent between the electrode rows. A method for connecting electrodes, characterized in that heating and pressurization is performed in a state where a fibrous material is interposed in the electrode to be performed.   7. The electrode connection method according to claim 6, wherein the heating and pressurizing step is divided into two or more stages, and a connection electrode energization inspection step and / or a repair step are performed as necessary.

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