WO2017196151A1

WO2017196151A1 - Contactor, and electronic device provided with same

Info

Publication number: WO2017196151A1
Application number: PCT/KR2017/004989
Authority: WO
Inventors: 김대겸; 조승훈
Original assignee: 주식회사 모다이노칩
Priority date: 2016-05-13
Filing date: 2017-05-12
Publication date: 2017-11-16

Abstract

The present invention provides a contactor and an electronic device provided with same, the contactor comprising: a contact part; a complex protection part provided in contact with one side of the contact part; and a conductive adhesive part provided on at least one side of the complex protection part.

Description

Contactor and electronic device having same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactor, and more particularly, to a contactor and an electronic device having the same, which can prevent a user from being shocked by leakage current through an electronic device using a charger or a transformer.

Electronic devices having a multifunction are integrated with various components according to their functions. In addition, the electronic device is provided with an antenna capable of receiving various frequency bands, such as a wireless LAN, a Bluetooth, and a Global Positioning System (GPS). It may be installed in a case constituting the electronic device. Therefore, a contactor for electrical connection is provided between the antenna installed in the case and the internal circuit board of the electronic device.

On the other hand, in recent years, with the emphasis on high-end image and durability, the spread of electronic devices made of a metallic material case is increasing. In other words, the popularity of electronic devices in which the edge is made of metal or the case is made of metal other than the front screen display is increasing.

However, when the case is made of a metal material, static electricity having a high voltage may be instantaneously introduced through the external metal case, and the static electricity may be introduced into the internal circuit through the contactor to damage the internal circuit.

In addition, a leakage current is generated by charging an electronic device using a metal case with a non-genuine charger or a defective charger using a low quality device. This leakage current is transmitted to the ground terminal of the electronic device, and again from the ground terminal to the metal case, the user in contact with the metal case may be electrocuted. As a result, when an electronic device is used while charging with a non-genuine charger to an electronic device using a metal case, an electric shock may occur.

Therefore, there is a need for a contactor capable of preventing damage to an internal circuit and electrocution by a user due to static electricity.

(Prior art document)

Korea Patent Registration No. 10-1001354

Korean Patent Registration No. 10-0809249

The present invention provides a contactor provided in an electronic device that can prevent an electric shock of a user due to leakage current.

The present invention provides a contactor including a composite protection unit that is not dielectrically broken by an overvoltage such as an electrostatic discharge (ESD).

The present invention provides a contactor that can be transmitted by minimizing attenuation of a communication signal flowing from the outside.

A contactor according to an aspect of the present invention includes a contact portion; A composite protective part provided in contact with one surface of the contact part; And a conductive adhesive part provided on at least one surface of the composite protective part.

The composite protection part is electrically connected directly to the contact part.

The conductive adhesive part is provided on the other surface opposite to one surface of the composite protective part.

It is provided between the contact portion and the composite protective portion, and further comprises a second conductive adhesive portion having the same structure as the conductive adhesive portion.

The composite protective part is not electrically connected to the contact part directly, but is electrically indirectly connected through an internal circuit of the electronic device.

And an extension part electrically connected to the contact part and extending toward the internal circuit along the side surface of the composite protection part and mounted on the internal circuit.

The conductive adhesive part is provided between the composite protective part and the internal circuit and between the extension part and the internal circuit.

The composite protection part and the extension part are mounted on one surface, and the mounting part further includes a mounting part mounted on the internal circuit.

The conductive adhesive part is provided between the composite protective part and the mounting part and between the extension part and the mounting part.

According to another aspect of the present invention, a contactor includes a contact unit; A composite protection unit having one surface contacted with the contact unit; A conductive part having one surface contacted with the other surface of the composite protective part; And a conductive adhesive portion provided on the other surface of the conductive portion.

And a second conductive adhesive portion provided between at least one of the contact portion and the composite protective portion and between the composite protective portion and the conductive portion.

The composite protection part maintains an insulation state below a predetermined voltage and is conducted at a predetermined voltage or higher, and passes an AC signal and blocks a DC signal.

The conductive adhesive part includes a porous base, a filler filling the pores of the base and having an adhesive property, and a plurality of conductive particles dispersed in the filler.

The base includes a nonwoven fabric structure or a woven fabric structure using a conductive thread.

At least a part of the conductive particles have a size smaller than the pore size of the base.

The conductive particles are unevenly distributed in at least one region, or at least some of the conductive particles are in contact with each other and dispersed.

The conductive particles are contained in an amount of 5 wt% to 40 wt% based on 100 wt% of the mixture of the filler and the conductive particles.

It further includes pores formed in at least one region of the conductive adhesive portion.

The conductive adhesive portion has a resistance of 10 kPa or less.

An electronic device according to another aspect of the present invention is an electronic device including a conductor and an internal circuit to which a user can contact, and a contactor according to one or another aspect of the present invention is provided between the conductor and the internal circuit. do.

The complex protection unit passes an overvoltage applied from the outside through the conductor to the internal circuit, blocks a leakage current through the internal circuit, and passes a communication signal.

The contactor according to the embodiments of the present invention includes a contact portion and a composite protection portion, and is provided between a conductor accessible by a user of the electronic device and an internal circuit of the electronic device, and may be mounted on the internal circuit using a conductive adhesive part. . In addition, the conductive adhesive portion is provided to fill the porous base and the pores of the base and includes a filler containing a plurality of conductive particles dispersed.

Meanwhile, the contact portion and the composite protection portion may not be electrically connected directly, but may be indirectly connected through an internal circuit. That is, two external electrodes of the composite protection part are mounted on the internal circuit and spaced apart from each other, and the contact parts are mounted on the internal circuit so as to be connected to any one of the composite protection parts.

In the contactor according to the present invention, leakage current that may flow from the internal circuit is cut off by the composite protection part, and transient voltage such as ESD applied from the outside is bypassed to the ground terminal through the contact part, the internal circuit, and the composite protection part. . In addition, the contactor may be stably mounted even in a narrow region where surface mount technology (SMT) is difficult by mounting using the conductive adhesive portion. In addition, since the resistance of the conductive adhesive part does not increase even after repeated overvoltage application, the function of the contact part is not lost, thereby improving reliability.

1 is a cross-sectional view of a contactor according to a first embodiment of the present invention.

2 is a cross-sectional view of a conductive bonding part constituting a contactor according to embodiments of the present invention.

3 and 4 are photographs of the base of the conductive adhesive portion in the form of a nonwoven fabric and a woven fabric.

5 and 6 are surface photographs of the conductive adhesive portion using a nonwoven fabric and a woven base.

7 is a cross-sectional view of a contactor according to a second embodiment of the present invention.

8 and 9 are views according to embodiments of the composite protection unit constituting the contactor according to the embodiments of the present invention.

10 is a cross-sectional view of a contactor according to a third embodiment of the present invention.

11 is a perspective view of a contactor according to a fourth embodiment of the present invention;

12 and 13 are a side view and another side view of a contactor according to a fourth embodiment of the present invention.

14 and 15 are a plan view of an internal circuit in which a contactor is mounted according to a fourth embodiment of the present invention, and a plan view of a state in which the contactor is mounted in the internal circuit.

16 and 17 are a perspective view and a disassembled perspective view of the contactor according to the fifth embodiment of the present invention.

18 and 19 are side and other side views of a contactor according to a fifth embodiment of the present invention.

20 is a cross-sectional view of a contactor provided between a conductor and an internal circuit according to a fifth embodiment of the present disclosure;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 is a cross-sectional view of a contactor according to a first embodiment of the present invention. In addition, Figure 2 is a cross-sectional view of the conductive adhesive portion, Figures 3 and 4 are photographs of the base of the nonwoven fabric and woven fabric of the conductive adhesive portion, Figures 5 and 6 are surface photographs of the conductive adhesive portion using the base of the nonwoven fabric and woven fabric. . 7 is a cross-sectional view of a contactor according to a second embodiment of the present invention, and FIGS. 8 and 9 are views according to one embodiment and another embodiment of the composite protection unit.

Referring to FIG. 1, a contactor according to embodiments of the present disclosure may be provided outside of an electronic device and provided with a conductor 10 that a user may contact, and an internal circuit provided inside the electronic device to perform various functions of the electronic device. 20) may be provided between. As shown in FIG. 1, the contactor may include a contact portion 1000 in which at least one region is in contact with the conductor 10, at least one region is in contact with the contact portion 1000, and at least another region is in contact with the internal circuit 2000. The composite protective part 2000 may be electrically connected to each other, and the conductive adhesive part 3000 may be provided between the composite protective part 2000 and the internal circuit 20. Of course, the contact portion 1000 may be in contact with the internal circuit 20, and the complex protection part 2000 may be in contact with the conductor 10. Here, the conductor 10 may include at least a portion of a case forming the overall appearance of the electronic device. That is, the edge of the case may be formed of a conductive material such as metal to form the conductor 10, and the entire case may be formed of a conductive material such as metal to form the conductor 10. And, the conductor 10, that is, at least a part of the case may function as an antenna that can communicate with the outside as needed. In other words, the conductor 10 may be used as the antenna without providing a separate antenna. Of course, the electronic device may be provided with a separate antenna and at least a part of the case may be formed of the conductor 10. In addition, the internal circuit 20 includes a printed circuit board (PCB) on which a plurality of passive elements, active elements, etc., which are provided for performing various functions of the electronic device, is provided, and at least one ground terminal has a ground terminal. Can be prepared. On the other hand, the contactor according to the present invention may be directly mounted on the ground terminal of the internal circuit 20, or a predetermined component or another configuration of an electronic device may be provided between the contactor and the ground terminal of the internal circuit 20. . For example, a capacitor, a diode, or the like may be provided between the contactor and the ground terminal, whereby the contactor may be connected to the ground terminal through at least one of the capacitor and the diode. In addition, the contactor may be mounted on an area of the bracket of the electronic device, and the bracket may be electrically connected to the ground terminal of the internal circuit 20. Here, the bracket may be provided between the display of the electronic device and the printed circuit board (that is, the internal circuit), and at least part of the bracket may be conductive. Thus, the contactor may be mounted on the bracket and connected to the internal circuit 20 through the bracket.

1. 컨택부1. Contact

When the external force is applied from the outside of the electronic device, the contact part 1000 may be made of a material having an elastic force so as to alleviate the impact and including a conductive material. The contact part 1000 may have a conductive gasket or a clip shape. For example, as shown in FIG. 1, the contact unit 1000 may have a clip shape. The clip-shaped contact part 1000 is provided on the support part 1100 provided on the composite protection part 2000, and is disposed above the support part 1100 so as to face the conductor 10 and at least a part of the contact part 1000. It may include a contact portion 1200 that can be contacted, provided between the support portion 1100 and one side of the contact portion 1200 to connect them and have a connecting portion 1300 having an elastic force. Here, the height of the contact unit 1000 may be equal to or higher than the height of the composite protection unit 2000. Of course, the height of the contact unit 1000 may be lower than the height of the composite protection unit 2000.

The support part 1100 may be provided on one surface of the composite protection part 2000. That is, the support part 1100 may be provided on one surface of the composite protection part 2000 to be in contact with any one of the

external electrodes

2510, 2520 and 2500 of the composite protection part 2000. Since the support part 1100 is provided on one surface of the composite protection part 2000, the support part 1100, the connection part 1300, and the extension part 5000 may be supported. The support 1100 may be provided in a plate shape having a predetermined thickness, for example, may be provided in a rectangular plate shape having a predetermined thickness. In addition, the support 1100 may be provided to have the same width as one surface of the composite protection unit 2000, and may be provided to be the same as or shorter than the length of one surface of the composite protection unit 2000. Meanwhile, a coupling member (not shown) may be provided between the support part 1100 and the composite protection part 2000 to couple the support part 1100 and the composite protection part 2000. As the coupling member, for example, an adhesive tape, an adhesive or the like can be used. That is, the support 1100 may be adhered to the upper surface of the composite protection part 2000 by an adhesive member such as an adhesive tape or an adhesive. In this case, since the support 1100 and the composite protective part 2000 are electrically connected, the coupling member may be a conductive material. For this purpose, the conductive adhesive part 3000 of the present invention may be used. That is, the conductive adhesive part 3000 may be provided between the composite protection part 2000 and the contact part 1000 as well as the composite protection part 2000 and the internal circuit 20.

One end of the contact portion 1200 is connected to the connection portion 1300, and extends in one direction from the connection portion 1300, and a portion thereof extends to be inclined upward, for example, upwardly toward the conductor 10 to contact the conductor 10. Can be. In addition, the region adjacent to the other end of the contact portion 1200 may have a shape having a curvature convex in the direction in which the conductor 10 is located. For example, the contact portion 1200 may be horizontally formed to a predetermined length and formed to be inclined upward from the predetermined length, and then be formed to be inclined downward to a predetermined length again. In this case, an area in contact with the conductor 10 of the contact portion 1200 may have a circular shape such as an ellipse, a semicircle, and the like. That is, the region of the support 1100 may be shaped to have a bent portion in which the peripheral region including the other end of the support portion 1100 or the farther portion of the connection portion 1300 is bent upwards, and the bent portion is the conductor 10. It is installed to be in contact with.

The connection part 1300 is formed to connect one end of the support part 1100 and one end of the contact part 1200, and may have a curvature. When the connection part 1300 is pressed by an external force, the circuit board 20 is pressed in the direction in which the circuit board 20 is located, and when the external force is released, the connector 1300 has an elastic force that is restored to its original state. Therefore, the contact part 1000 may be formed of a metal material having at least the connection part 1300 having an elastic force.

As described above, the contact unit 1000 may be formed to be in contact with the conductor 10 that the user can contact. That is, the contact unit 1000 may be provided to be in contact with the metal case, or may be in contact with the conductor 10 serving as an antenna for transmitting a communication signal to the outside. Of course, the case may also serve as an antenna.

2. 복합 보호부2. Composite protection

The composite protection unit 2000 may bypass an overvoltage such as an ESD applied from the outside to the ground terminal of the internal circuit 20 and cut off a leakage current from the internal circuit 20. The complex protection unit 2000 may have an insulating state below a predetermined voltage and may be electrically conductive at a voltage above a predetermined voltage. For example, the composite protection unit 2000 may be formed of a varistor, a suppressor, a diode, and the like that are conducted at a predetermined voltage or more. Here, the voltage for conducting the composite protection unit 2000, that is, the breakdown voltage or the discharge start voltage may be higher than the external rated voltage and lower than the dielectric breakdown voltage of the composite protection unit 2000. That is, when an overvoltage higher than the rated voltage and lower than the dielectric breakdown voltage is applied, the composite protection unit 2000 may conduct the applied overvoltage to the ground terminal of the internal circuit 20. In addition, the complex protection unit 2000 may further include a capacitor or the like for transmitting a communication signal. On the other hand, on one surface of the composite protection unit 2000 and the other surface opposite thereto,

external electrodes

2510, 2520; 2500 connected to the conductive layer therein are formed, respectively, and one of the external electrodes 2500 is the contact unit 1000. ) And the other may contact the internal circuit 20 through the conductive adhesive 3000. For example, the first external electrode 2510 may be connected to the internal circuit 20, and the second external electrode 2520 may be connected to the contact unit 1000. An example of such a composite protection unit 2000 is illustrated in FIGS. 8 and 9, and the composite protection unit 2000 will be described in detail later.

As such, the complex protection part 2000 may be provided between the conductor 10 and the internal circuit 20 with the contact part 1000 interposed therebetween to block leakage current flowing from the internal circuit 20. In addition, the complex protection unit 2000 may bypass the ESD voltage to the ground terminal, and may continuously block the leakage current because the insulation is not destroyed by the ESD. That is, the composite protection unit 2000 according to the present invention maintains an insulation state below the electric shock voltage to cut off the leakage current flowing from the internal circuit 20, and maintains the conduction state above the ESD voltage to prevent the inside of the electronic device from the outside. Bypass the ESD voltage applied to the ground terminal. Therefore, the electric shock of the user due to leakage current can be prevented, and the internal circuit of the electronic device due to the overvoltage applied from the outside can be protected.

3. 도전성 접착부3. Conductive Adhesive

The conductive adhesive part 3000 may be provided between the composite protection part 2000 and the internal circuit 20. That is, one side of the composite protection unit 2000 may be in contact with the contact unit 1000, and the other side thereof may be connected to the internal circuit 20. The conductive adhesive part may be formed between the other side of the composite protection unit 2000 and the internal circuit 20. 3000 may be provided. Therefore, the composite protection part 2000 may be fixed to the internal circuit 20 through the conductive adhesive part 3000. In addition, the conductive adhesive part 3000 may be further provided between the composite protection part 2000 and the contact part 1000. That is, the conductive adhesive part 3000 may be further provided between one side of the composite protection part 2000 and the contact part 1000.

The conductive adhesive portion 3000 has conductivity and adhesive properties. In addition, the conductive adhesive portion 3000 is filled with a porous base 3100 having a conductive structure, the pores of the base 3100, the filler 3200 having adhesive properties and the filler 3200, as shown in FIG. It may include conductive particles 3300 contained in. That is, the conductive adhesive part 3000 may be provided by filling the pores of the base 3100 with the filler 3200 containing the conductive particles 3300.

The base 3100 may be formed, for example, in a mesh structure and have a porous structure having a plurality of pores. In addition, the base 3100 may be made of a conductive material. Here, the conductive base 3100 of the mesh structure may be a nonwoven structure in which the conductive yarns are irregularly arranged, or may be a woven structure in which the conductive yarns are regularly arranged. The nonwoven fabric structure may be a structure in which conductive yarns are irregularly entangled as shown in FIG. 3, and the woven fabric structure is a structure in which conductive warp yarns (wefts) and weft yarns (weft yarns) are woven in regular intervals as shown in FIG. 4. Can be. 3 is a photograph of a base 3100 of a nonwoven fabric structure, and FIG. 4 is a photograph of a base 3100 of a woven fabric structure. 3 and 4 (b) are enlarged photographs of the photograph of (a), and (c) is photographs of enlarged photographs of the photograph of (b). Meanwhile, the conductive thread forming the base 3100 may use, for example, a metal material having high electrical conductivity such as nickel, copper, and aluminum, and may have, for example, a thickness of 1 μm to 1000 μm. In addition, the base 3100 may have a porosity of 20% to 80%. Here, the porosity of the base 3100 may be adjusted according to the density of the conductive thread. The conductive thread may be densely formed so that the porosity of the base 3100 may be lowered. The porosity of the base 3100 may be made coarse. Can be high. On the other hand, when the porosity is less than 20%, the impregnation amount of the filler 3200 may be low, and thus the adhesiveness may be lowered. When the porosity is more than 80%, the proportion of the base 3100 is reduced to decrease the electrical conductivity, and thus the resistance is increased. can do. In addition, the pores formed in the base 3100 made of a micro-sized conductive seal may have a micro size or more according to the thickness, porosity, etc. of the base 3100.

The filler 3200 contains conductive particles 3300 and is formed to fill pores of the base 3100. The filler 3200 may be made of an adhesive material to bond the composite protection part 2000 to the internal circuit 20. As the adhesive substance, for example, an adhesive substance such as rubber, acryl or silicone can be used. Also, the conductive particles 3300 may be contained in an amount of 1 wt% to 50 wt%, preferably 5 wt% to 50 wt%, and more preferably 7 wt% to 40 wt%, based on 100 wt% of the mixture of the filler material and the conductive particles. Can be. When the conductive particles 3300 is contained in less than 1wt%, the resistance of the conductive adhesive portion 3000 may be increased when the overvoltage is repeatedly applied. If the conductive particles 3300 are more than 50wt%, the adhesion may be deteriorated.

The conductive particles 3300 may use an electrically conductive material. For example, the conductive particles 3300 may include nickel, copper, aluminum, chromium, carbon, or the like. The conductive particles 3300 may have a size smaller than the pores in the base 3100. Of course, at least some of the conductive particles 3300 may have a larger size than the pores. However, the size of the conductive particles 3300 is preferably smaller than the pores so that the conductive particles 3300 can be provided in the pores in the base 3100. On the other hand, the average size of the conductive particles 3300, that is, the average particle diameter may be, for example, 1㎛ to 1000㎛, preferably 1㎛ to 500㎛, more preferably may be 1㎛ to 100㎛ have. In addition, the electroconductive particle 3300 may use single particle | grains or 2 or more types of particle | grains of the same size, and may use single particle | grains or 2 or more types of particle | grains which have multiple sizes. When the electroconductive particle 3300 has a some size, it is the 1st electroconductive particle which has an average particle diameter of 20 micrometers-100 micrometers, the 2nd electroconductive particle which has an average particle diameter of 2 micrometers-20 micrometers, and 1-10, for example. 3rd electroconductive particle which has an average particle diameter of micrometer can be used. Here, the first conductive particles may be greater than or equal to the second conductive particles, and the second conductive particles may be greater than or equal to the third conductive particles. That is, A: B: C is 20-100: 2-20: When the average particle diameter of 1st electroconductive particle is A, the average particle diameter of 2nd electroconductive particle is B, and the average particle diameter of 3rd electroconductive particle is C. It may be 1 to 10. For example, A: B: C may be 20: 1.5: 1 and 10: 1.5: 1. When the plurality of pores in the base 3100 are filled with the filler 3200 containing the conductive particles 3300, the electrical conductivity may be further improved as compared to the case of using only the filler 3200 in the base 3100. That is, by including the conductive particles 3300 in the filler 3200, the resistance can be reduced as compared with the case where only the filler 3200 is used. In addition, the resistance does not increase even after repeated overvoltage such as ESD is applied, thereby preventing the contactor from deteriorating reliability. Meanwhile, FIGS. 5 and 6 show surface photographs of the conductive adhesive part 3000 after the filler 3200 containing the conductive particles 3300 is formed in the pores of the base 3100. 5 is a photograph in which the filler 3200 is formed in the base 3100 of the nonwoven fabric structure, and FIG. 6 is a photograph in which the filler 3200 is formed in the base 3100 of the woven fabric structure. 5 and 6 (a) to (e) are conductive particles 3300 and are photographs containing 12 wt%, 14 wt%, 16 wt%, 20 wt% and 24 wt% nickel, respectively. Here, the white particles are the conductive particles 3300 and the black ones are the fillers 3200. As shown in the photograph, the conductive particles 3300 may be dispersed at different densities from other regions in at least some regions, and at least two or more conductive particles 3300 may be in contact and dispersed in at least one region. On the other hand, the conductive bonding portion 3000 may be formed differently from at least one region having a different thickness. In addition, as shown in the photograph, at least one pore may be formed in the conductive adhesive part 3000 after the filler 3200 containing the conductive particles 3300 is filled. The pores may expose at least a portion of the base 3100,

Meanwhile, in order to include the conductive particles 3300 in the filler 3200, for example, the rubber or acrylic resin may be dissolved in an organic solvent, and then the conductive particles may be mixed. In addition, the filler 3200 may be filled in the pores in the base 3100 by immersing the base 3100 in the mixture in which the conductive particles 3300 are mixed. For example, as a filler 3200, an acrylic resin and conductive particles 3200 are mixed in a predetermined solvent to prepare a mixture, and then the porous base 3100 is immersed in the mixed solvent and the solvent is dried to form the base 3100. The filler 3200 containing the conductive particles 3300 may be distributed. Here, the solvent may include ethyl acetate, methyl ethyl ketone, methylene chloride, tetrahydrofuran or chloroform, and these may be used alone or in combination of two or more. After the mixture of the filler material, the conductive particles, and the solvent is immersed in the base 3100, the conductive particles 3300 may be 1 wt% to 50 wt% with respect to 100 wt% of the mixture of the filler 3200 and the conductive particles 3300.

On the other hand, the conductive bonding portion 3000 may have a resistance of 1 kΩ or less, the base 3100, preferably has a resistance of 0.5 kΩ or less, more preferably 0.05 kΩ or less. For example, the base 3100 may have a resistance of 0.01 kΩ to 1 kΩ. In addition, the conductive adhesive portion 3000 including the base 3100 may have a resistance of 5 kΩ or less, preferably 0.15 kΩ or less. The conductive adhesive part 3000 may have a resistance of 10 kΩ or less, for example, 0.5 kΩ to 10 kΩ even after the ESD voltage is repeatedly applied. That is, the resistance of the conductive adhesive part 3000 may increase according to the repeated application of the ESD voltage, which may cause a problem of failing to bypass the ESD voltage. It is preferable that the conductive adhesive portion 3000 has a resistance of 10 kΩ or less so as to pass. Meanwhile, although the resistance of the conductive adhesive part 3000 may vary according to the shape of the base 3100, the content of the conductive particles 3300 of the filler 3200, and the like, the resistance of the contactor may vary. It is desirable to have the following resistance, and 10 Ω or less even after the ESD voltage is applied.

Referring to FIG. 7, the contactor according to the second embodiment of the present invention may include a contact portion 1000 in which at least one area is in contact with the conductor 10, and a complex protection part in which at least one area is in contact with the contact part 1000. And a conductive portion 4000 having one surface thereof in contact with the composite protection portion 2000 and a conductive adhesive portion 3000 provided between the other surface of the conductive portion 4000 and the internal circuit 20. . That is, in the second embodiment of the present invention, the conductive part 4000 is further provided between the composite protection part 2000 and the internal circuit 20, and the conductive adhesive part 3000 is formed in the conductive part as compared with the first embodiment. It may be provided between the 4000 and the internal circuit 20. The second embodiment of the present invention will be described below with reference to parts that differ from the first embodiment.

4. 도전부4. Challenge

One surface of the conductive portion 4000 may be in contact with the composite protection portion 2000, and the other surface of the conductive portion 4000 may be mounted on the internal circuit 20 through the conductive adhesive portion 3000. That is, in the complex protection part 2000, the contact part 1000 is provided on one surface, and the conductive part 4000 is provided on the other surface. Here, the composite protection part 2000 and the conductive part 4000 may be bonded by soldering or the conductive adhesive part of the present invention. That is, the conductive adhesive part 3000 of the present invention may be further formed between the contact part 1000 and the composite protection part 2000 and between the composite protection part 2000 and the conductive part 4000. Therefore, the composite protection part 2000 and the internal circuit 20 may be electrically connected through the conductive part 4000. To this end, the conductive portion 4000 may be provided in a plate shape having a predetermined thickness using a conductive material, for example, may be provided in a rectangular shape. The conductive part 4000 may be made of a metal material, for example, made of SUS. In addition, the conductive portion 4000 may be plated with Ag, Cr, Ni, Au, or the like, and may be provided with a thickness of about 0.01 mm to 1 mm. Meanwhile, the conductive portion 4000 may have an area equal to or larger than that of the composite protection portion 2000. That is, the conductive part 4000 may have a length in one direction longer than or equal to the length of the composite protection part 2000, and a width in another direction perpendicular to one direction may be longer than or equal to the width of the composite protection part 2000. . Preferably, the conductive portion 4000 has a length and width greater than the length and width of the composite protection part 2000, and thus may have an area larger than the area of one surface of the composite protection part 2000. By providing the conductive portion 4000, the contactor can be easily mounted on the internal circuit 20. That is, although the small size of the complex protection unit 2000 is difficult to mount directly on the internal circuit 20, the composite protection unit 2000 is first fixed to the conductive portion 4000 having a larger area than the composite protection unit 2000. The mounting of the contactor can be facilitated by mounting the conductive portion 4000 on a conductive member electrically connected to the internal circuit 20 or an internal circuit such as a bracket.

실험 예Experiment example

The electrical properties of the conductive adhesive part 3000 according to the present invention were tested and the results are shown in [Table 1] to [Table 4]. Tables 1 to 4 show the resistance before and after applying the ESD voltage according to the shape and resistance of the base and the content of the conductive particles. In this case, a nonwoven fabric and a woven fabric using nickel were used as the base, and nickel was used as the conductive particles. In addition, a contact portion, a composite protective portion, and a conductive portion were formed to apply an ESD voltage, and a conductive adhesive portion was formed below the conductive portion, and then bonded to a circuit board.

Table 1 shows the resistance before and after applying the ESD voltage according to the nickel content as the conductive particles on the base of the nonwoven fabric. At this time, the resistance of the base of the nonwoven fabric is 0.035 kV and an ESD voltage of ± 10 kV was applied 300 times at 0.1 second intervals.

베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	저항resistance		평가결과Evaluation results
베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	ESD 인가 전Before ESD	ESD 인가 후After ESD applied	평가결과Evaluation results
부직포Non-woven	22	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	44	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	66	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	88	1Ω 이하1Ω or less	3Ω 이하3Ω or less		passpass
	1010	1Ω 이하1Ω or less	3Ω 이하3Ω or less	passpass
	1515	1Ω 이하1Ω or less	2Ω 이하2Ω or less		passpass
	2020	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	2525	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	3030	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	3535	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	4040	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass

As shown in Table 1, when the nickel content is 6wt% or less on the nonwoven fabric having a resistance of 0.035 kPa, the resistance of the conductive joint rapidly increases after repeated application of an ESD voltage, thereby failing the conductive adhesive. However, when the nickel content is 8wt% or more, even if the repetitive ESD voltage is applied, the resistance of the conductive joint does not increase, so that the conductive adhesive part functions normally. Therefore, if the nickel content is 6wt% or less on the base of the nonwoven fabric having a resistance of 0.035 kΩ, the contactor having the same does not operate normally as the resistance of the conductive adhesive increases after repeated application of an ESD voltage. Since the resistance of the conductive adhesive does not increase even after the ESD voltage is applied, the contactor having the same may operate normally.

Table 2 shows the resistance before and after applying the ESD voltage according to the nickel content in the base of the woven fabric. At this time, the resistance of the base of the woven fabric is 0.035 kV and an ESD voltage of ± 10 kV was applied 300 times at 0.1 second intervals.

베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	저항resistance		평가결과Evaluation results
베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	ESD 인가 전Before ESD	ESD 인가 후After ESD applied	평가결과Evaluation results
직포web	22	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	44	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	66	3Ω 이하3Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	88	3Ω 이하3Ω or less	3Ω 이하3Ω or less		passpass
	1010	3Ω 이하3Ω or less	3Ω 이하3Ω or less	passpass
	1515	2Ω 이하2Ω or less	1Ω 이하1Ω or less		passpass
	2020	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	2525	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	3030	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	3535	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass
	4040	1Ω 이하1Ω or less	1Ω 이하1Ω or less	passpass

As shown in Table 2, if the nickel content is 6wt% or less on the base of the woven fabric having a resistance of 0.035 kPa, the resistance of the conductive joint increases after repeated application of an ESD voltage, thereby failing the conductive adhesive. However, when the nickel content is 8wt% or more, even if the repetitive ESD voltage is applied, the resistance of the conductive joint does not increase, so that the conductive adhesive part functions normally. Therefore, if the nickel content is 6wt% or less on the base of the woven fabric having a resistance of 0.035 kΩ, the contactor having the same does not operate normally due to the increase in resistance of the conductive adhesive after repeated application of an ESD voltage. Since the resistance of the conductive adhesive does not increase even after the ESD voltage is applied, the contactor having the same may operate normally.

As can be seen in Tables 1 and 2, the nonwoven or woven bases exhibit almost the same properties depending on the content of the conductive particles when they have the same resistance.

Table 3 shows the resistance before and after applying the ESD voltage according to the nickel content in the base of the nonwoven fabric. At this time, the base of the nonwoven fabric is 0.05 kW and an ESD voltage of ± 10 kV was applied 300 times at 0.1 second intervals.

베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	저항resistance		평가결과Evaluation results
베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	ESD 인가 전Before ESD	ESD 인가 후After ESD applied	평가결과Evaluation results
부직포Non-woven	1414	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	1616	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	1818	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	2020	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	2222	5Ω 이하5Ω or less	3Ω 이하3Ω or less		passpass
	2424	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass
	2626	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass
	2828	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass
	3030	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass

As shown in Table 3, when the nickel content is 20 wt% or less on the base of the nonwoven fabric having a resistance of 0.05 kPa, the conductive junction resistance increases after repeated application of an ESD voltage, thereby failing to conduct the conductive adhesive. However, when the nickel content is more than 22wt%, even if the repetitive ESD voltage is applied, the resistance of the conductive joint does not increase, and thus the conductive adhesive part functions normally. Therefore, when the nickel content is 20wt% or less on the base of the nonwoven fabric having a resistance of 0.05 kV, the contactor having the same does not operate normally due to the increase in the resistance of the conductive adhesive after repeated application of an ESD voltage. Since the resistance of the conductive adhesive portion does not increase even after the ESD voltage is applied, the contactor having the same may operate normally. That is, compared with Table 1, when the resistance of the base is high, the content of nickel should be increased as compared with the case where the resistance is low to prevent the occurrence of the failing of the conductive adhesive portion.

Table 4 shows the resistance before and after applying the ESD voltage according to the nickel content in the base of the woven fabric. At this time, the resistance of the base of the woven fabric is 0.05 kW and an ESD voltage of ± 10 kV was applied 300 times at 0.1 second intervals.

베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	저항resistance		평가결과Evaluation results
베이스 형태Base form	Ni 함유량(wt%)Ni content (wt%)	ESD 인가 전Before ESD	ESD 인가 후After ESD applied	평가결과Evaluation results
직포web	1414	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	1616	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	1818	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	2020	5Ω 이하5Ω or less	수㏀∼수㏁㏀ ~ ㏁㏁	failfail
	2222	5Ω 이하5Ω or less	3Ω 이하3Ω or less		passpass
	2424	5Ω 이하5Ω or less	3Ω 이하3Ω or less	passpass
	2626	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass
	2828	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass
	3030	5Ω 이하5Ω or less	1Ω 이하1Ω or less	passpass

As shown in Table 4, when the nickel content is 20 wt% or less on the base of the woven fabric having a resistance of 0.05 kPa, the resistance of the conductive joint increases after repeated application of an ESD voltage, thereby failing the conductive adhesive. However, when the nickel content is more than 22wt%, even if the repetitive ESD voltage is applied, the resistance of the conductive joint does not increase, and thus the conductive adhesive part functions normally. Therefore, when the nickel content is 20wt% or less on the base of the woven fabric having a resistance of 0.05 kΩ, the contactor having the same does not operate normally as the resistance of the conductive adhesive increases after repeated application of an ESD voltage. Since the resistance of the conductive adhesive does not increase even after the ESD voltage is applied, the contactor having the same may operate normally. In other words, compared to Table 2, when the resistance of the base is high, the content of nickel should be increased as compared with the case of low resistance to prevent the occurrence of fail.

As can be seen from Tables 3 and 4, the nonwoven or woven bases exhibit almost the same properties depending on the content of the conductive particles when they have the same resistance. However, comparing [Table 1] and [Table 2] where the base has a resistance of 0.035 GPa and [Table 3] and [Table 4] where the base has a resistance of 0.05 mA, Even if the content of the conductive particles is low, the normal function is possible, but if the resistance of the base is high it can be seen that the normal function is possible to increase the content of the conductive particles. That is, the conductive adhesive portion may control the content of the conductive particles in accordance with the resistance of the base, and thus may have a normal function without increasing resistance even after repeated ESD application.

복합 보호부의 예Example of compound protection

8 and 9 illustrate an embodiment of the composite protection unit 2000 constituting the contactor according to the present invention.

8 is a view according to an embodiment of the composite protective part, FIG. 8A is a perspective view, and FIG. 8B is a sectional view.

As illustrated in FIG. 8, the composite protection unit 2000 according to an embodiment may include a stack 2100 in which a plurality of sheets are stacked, at least two internal electrodes 2200 provided in the stack 2100, and a plurality of sheets. At least one overvoltage protection unit 2300 provided between the at least two internal electrodes 2200 and at least two connection electrodes 2400 provided in the stack 2100 to be connected to the at least two internal electrodes 2200, respectively. ) And an external electrode 2500 formed outside the stack 2100 to be connected to the connection electrode 2400. Here, the external electrode 2500 may be formed on two surfaces facing each other in the stacking direction of the plurality of sheets constituting the stack 2100, that is, two surfaces facing in the Z direction.

2.1. 적층체2.1. Laminate

The laminate 2100 has a predetermined length and width in one direction (for example, X direction) and the other direction (for example, Y direction) orthogonal to each other in the horizontal direction, and has a vertical direction (for example, Z direction). It may be provided in a substantially hexahedral shape having a predetermined height. The stack 2100 may be formed by stacking a plurality of sheets having a predetermined thickness. The plurality of sheets constituting the laminate 2100 may be formed using a dielectric material such as MLCC, LTCC, HTCC, or the like. The MLCC dielectric material includes at least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO based on at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO _2. It may include a glass material. The sheet also includes one or more of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, Al ₂ O ₃ in addition to MLCC, LTCC, HTCC It may be formed of a material. In addition to the above materials, the sheet may be formed of a material having varistor characteristics such as Pr-based, Bi-based, or ST-based ceramic materials. Accordingly, the sheets may each have a predetermined dielectric constant, for example, 5 to 20000, preferably 7 to 5000, and more preferably 200 to 3000. In addition, the plurality of sheets may all be formed with the same thickness, and at least one may be formed thicker or thinner than the others. For example, the sheet in which the overvoltage protection unit 2300 is formed between the internal electrodes 2200 may have a thickness greater than that of each of the other sheets. Meanwhile, the plurality of sheets may be formed, for example, in a thickness of 1 μm to 5000 μm, and may be formed in a thickness of 3000 μm or less. That is, the thickness of each sheet may be 1 μm to 5000 μm, and preferably 5 μm to 300 μm, depending on the thickness of the laminate 2100. In addition, the thickness of the sheet and the number of stacked layers may be adjusted according to the size of the composite protection unit 2000. In this case, the sheet may be formed to a thickness that does not break when the ESD is applied. That is, even when the number of sheets or the thickness of the sheets is formed differently, at least one sheet may be formed to a thickness that is not broken by repeated application of ESD.

Meanwhile, the laminate 2100 may further include a lower cover layer (not shown) and an upper cover layer (not shown) respectively provided on the lowermost layer and the uppermost layer. Of course, the lowermost sheet may serve as the lower cover layer and the uppermost sheet may serve as the upper cover layer. The lower and upper cover layers, which are separately provided, may have the same or different thicknesses, and a plurality of magnetic sheets may be stacked. In addition, a nonmagnetic sheet, for example, a glassy sheet, may be further formed on the surfaces of the lower and upper cover layers made of magnetic sheets, that is, the lower and upper surfaces. In addition, the lower and upper cover layers may be thicker than the sheets therein. That is, the cover layer may be thicker than the thickness of one sheet. Thus, when the lowermost and uppermost sheets function as lower and upper cover layers, they may be formed thicker than each of the sheets therebetween. Meanwhile, the lower and upper cover layers may be formed of a glassy sheet, and the surface of the laminate 2100 may be coated with a polymer or glass material.

2.2. 내부 전극2.2. Internal electrode

At least two

internal electrodes

2210, 2220, and 2200 may be provided to be spaced apart from each other within the stack 2100. That is, the at least two internal electrodes 2200 may be formed to be spaced apart from each other in the stacking direction of the sheet, that is, in the Z direction. In addition, at least two internal electrodes 2200 may be formed with the overvoltage protection unit 2300 therebetween. For example, the first internal electrode 2210 may be formed below the overvoltage protection part 2300 in the Z direction, and the second internal electrode 2220 may be formed above the overvoltage protection part 2300. Of course, at least one internal electrode may be further formed between the first and second

internal electrodes

2210 and 2220 and the lowermost and uppermost sheets. Here, the internal electrodes 2200 are formed to be connected to the connection electrodes 2400, respectively, and to the overvoltage protection unit 2300. That is, the first internal electrode 2210 is formed such that one side is connected to the first connection electrode 2410 and the other side is connected to the overvoltage protection unit 2300. In addition, the second internal electrode 2220 is formed such that one side is connected to the second connection electrode 2420 and the other side is connected to the protection unit 3200. In this case, one surface of the first and second

internal electrodes

2210 and 2220 facing each other is connected to the overvoltage protection unit 2300.

The internal electrode 2200 may be formed of a conductive material. For example, the internal electrode 2200 may be formed of a metal or a metal alloy including any one or more components of Al, Ag, Au, Pt, Pd, Ni, and Cu. In the case of an alloy, for example, Ag and Pd alloys may be used. On the other hand, the internal electrode 2200 may be a porous insulating layer formed on the surface. That is, the internal electrode 2200 may have a structure in which a porous insulating layer is formed on the surface of the metal layer. For example, when the internal electrode 2200 is formed using Al, aluminum oxide (Al ₂ O ₃ ) may be formed on the surface of Al and the inside of Al may be maintained during firing. Therefore, the internal electrode 2200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on its surface. Of course, in addition to Al, various metals having an insulating layer, preferably a porous insulating layer, may be used on the surface. When the porous insulating layer is formed on the surface of the internal electrode 2200, the ESD voltage can be more easily and smoothly discharged through the overvoltage protection unit 2300. That is, the overvoltage protection unit 2300 includes a porous insulating material and discharges through fine pores. When the porous insulating layer is formed on the surface of the internal electrode 2200, the overvoltage protection unit 2300 may be formed. It is possible to increase the number of fine pores more than the fine pores, thereby improving the discharge efficiency.

In addition, the internal electrode 2200 may be formed to have a thickness of, for example, 1 μm to 10 μm. In this case, the internal electrode 2200 may be formed such that the thickness of at least one region is thin or at least one region is removed to expose the sheet. However, even if the thickness of at least one region of the internal electrode 2200 is thin or at least one region is removed, the connected state is maintained as a whole so that there is no problem in electrical conductivity. In addition, the internal electrode 2200 may have a length in the X direction and a width in the Y direction smaller than the length and width of the laminate 2100. In other words. The internal electrode 2200 may be formed smaller than the length and width of the sheet. For example, the internal electrode 200 may be formed to have a length of 10% to 90% and a width of 10% to 90% of the length of the stack 2100 or the sheet. In addition, the internal electrode 2200 may be formed with an area of 10% to 90% of the area of each sheet. Meanwhile, the internal electrode 2200 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and a gap, and the like.

The internal electrode 2200 may serve as a capacitor and also serve as a discharge electrode of the overvoltage protection unit 2300. The capacitor is formed by the first and second

internal electrodes

2210 and 2220 and a sheet therebetween. The capacitance may be adjusted according to the overlapping area of the first and second

internal electrodes

2210 and 2220, the thickness of the sheet between the first and second

internal electrodes

2210 and 2220, and the like. In addition, at least regions of the first and second

internal electrodes

2210 and 2220 that overlap with the overvoltage protection unit 2300 serve as discharge electrodes, and transmit an overvoltage such as an ESD applied from the outside to the overvoltage protection unit 2300. Then, the overvoltage protection unit 2300 transmits the overvoltage bypassed to the ground terminal of the electronic device, for example.

2.3. 과전압 보호부2.3. Overvoltage Protection

At least one overvoltage protection unit 2300 is provided between the internal electrodes 2200 and bypasses an overvoltage such as an ESD flowing from the outside to the ground terminal of the electronic device. That is, the overvoltage from the outside of the electronic device employing the contactor including the complex protection unit is introduced into the overvoltage protection unit 2300 through the second connection electrode 2420 and the second internal electrode 2220, for example. The electronic device is bypassed to the internal circuit of the electronic device through the first internal electrode 2210 and the first connection electrode 2410. The overvoltage protection unit 2300 may have at least one of a planar shape and a cross-sectional shape having a polygonal shape of about circular, elliptical, rectangular, square, pentagonal or more, and have a predetermined thickness. That is, the overvoltage protection unit 2300 may be formed in the shape of a cylinder, a cube, a polyhedron, or the like.

On the other hand, the overvoltage protection unit 2300 may at least partially overlap the first and second

internal electrodes

2210 and 2220. For example, the first and second

internal electrodes

2210 and 2220 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection unit 2300. That is, the overvoltage protection unit 2300 is formed with a length and a width of 10% to 100% in the X and Y directions of the first and second

internal electrodes

2210 and 2220, respectively, and the first and second internal electrodes ( 2210, 2220 is formed so as not to leave. In addition, the overvoltage protection unit 2300 may be formed in a central region between the first and second

internal electrodes

2210 and 2220. More preferably, the overvoltage protection unit 2300 may be formed in the central region of the stack 2100. Of course, when two or more overvoltage protection parts 2300 are formed, the overvoltage protection parts 2300 may be formed to be spaced apart from each other by a predetermined interval in the central area of the stack 2100. Accordingly, the at least one overvoltage protection unit 2300 may have a central region formed in the central region of the stack 2100 or the central regions of the first and second

internal electrodes

2210 and 2220. In addition, the overvoltage protection unit 2300 may be formed to have a thickness of 1% to 20% of the thickness of the laminate 2100, and may be formed to have a length of 3% to 50% of one length of the laminate 2100. In this case, when the overvoltage protection unit 2300 is formed in plural, the sum of the thicknesses of the plurality of overvoltage protection units 2300 may be 1% to 50% of the thickness of the laminate 2100. In addition, the overvoltage protection unit 2300 may be formed in an elongated long shape in at least one direction, for example, the X direction, and may be formed at 5% to 75% of the X direction length of the sheet. The overvoltage protection unit 2300 may have a width in the Y direction of 3% to 50% of the width of the Y direction of the sheet. The overvoltage protection unit 2300 may be formed to have a thickness smaller than or equal to the thickness of the connection electrode 2400 and smaller than or equal to the diameter of the connection electrode 2400. For example, the overvoltage protection unit 2300 may be formed to have a thickness of 1/5 times to 1 times the thickness of the connection electrode 2400, and may have a diameter of 1/10 to 1 times the diameter of the connection electrode 2400. Can be formed. Specifically, the overvoltage protection unit 2300 may be formed, for example, with a diameter of 50 μm to 1000 μm and a thickness of 5 μm to 600 μm. At this time, the thinner the thickness of the overvoltage protection unit 2300, the lower the discharge start voltage.

The overvoltage protection unit 2300 may include at least one opening formed in a predetermined region of the sheet between the internal electrodes 2200. That is, each of the at least one opening may function as the overvoltage protection unit 2300. Here, the overvoltage protection unit 2300 may be formed by applying an overvoltage protection material to at least a portion of the opening or by filling the opening with the overvoltage protection material. That is, the overvoltage protection unit 2300 may include an empty opening and an overvoltage protection material formed in at least a portion of the opening. In order to form the overvoltage protection material, a through hole having a predetermined size may be formed between the internal electrodes 2200, and the overvoltage protection material may be applied to at least a portion of the through hole or filled in the through hole. In this case, the overvoltage protection material may be applied to at least a portion of the side surface of the through hole, at least one portion of the upper and lower portions of the through hole, and the inside of the through hole at a predetermined thickness. In order to form an overvoltage protection material in a part of the through hole, a polymer material volatilized upon firing may be used.

The overvoltage protection unit 2300 may use a conductive material and an insulating material as the overvoltage protection material. In this case, the insulating material may be a porous insulating material having a plurality of pores. For example, the overvoltage protection unit 2300 may be formed by printing a mixed material of a conductive ceramic and an insulating ceramic on a sheet. On the other hand, the overvoltage protection unit 2300 may be formed on at least one sheet. That is, the overvoltage protection unit 2300 is formed on two sheets stacked in the vertical direction, for example, and the first and second

internal electrodes

2210 and 2220 are formed on the sheet to be spaced apart from each other. 2300 may be connected. On the other hand, the discharge start voltage can be adjusted according to the structure, material, size, etc. of the overvoltage protection unit 2300, the discharge start voltage of the composite protection unit 2000 may be 1kV to 30kV, for example.

In addition, the overvoltage protection unit 2300 may be formed to widen at least one region. In this case, the wide portion may be formed to a width of about 1% to 150% of the portion that is not wide. In addition, the height of the wide portion may be formed to a height of 10% to 70% of the overall height of the overvoltage protection unit 2300. As described above, at least one region of the overvoltage protection unit 2300 is formed to extend in width, thereby blocking the short path of the overvoltage protection unit 2300. That is, when an overvoltage such as ESD is continuously applied, a melting phenomenon of the connection electrode 2400 may occur, and thus a connection phenomenon may occur due to the connection electrode material being adhered to the sidewall of the through hole of the overvoltage protection unit 2300. Can be. However, an extension part having a different diameter may be formed in the overvoltage protection part 2300 to block the short path.

On the other hand, it may further include a discharge induction layer (not shown) formed between the internal electrodes (2210, 2220; 2200) and the overvoltage protection unit 2300. The discharge induction layer may be formed when the overvoltage protection unit 2300 is formed using a porous insulating material. In this case, the discharge induction layer may be formed of a dielectric layer having a higher density than the overvoltage protection unit 2300. That is, the discharge induction layer may be formed of a conductive material or may be formed of an insulating material. For example, when the overvoltage protection unit 2300 is formed using porous ZrO, and the internal electrode 2200 is formed using Al, the induction layer of AlZrO is discharged between the overvoltage protection unit 2300 and the internal electrode 2200. This can be formed. Meanwhile, TiO may be used as the overvoltage protection unit 2300, and in this case, the discharge induction layer may be formed of TiAlO. That is, the discharge induction layer may be formed by the reaction between the internal electrode 2200 and the overvoltage protection unit 2300. Of course, the discharge induction layer may be formed by further reacting the sheet material. In this case, the discharge induction layer may be formed by the reaction of an internal electrode material (eg Al), an overvoltage protection material (eg ZrO), and a sheet material (eg BaTiO ₃ ). In addition, the discharge inducing layer may be formed by reacting with the sheet material. That is, in the region where the overvoltage protection unit 2300 is in contact with the sheet, a discharge induction layer may be formed by the reaction between the overvoltage protection unit 2300 and the sheet. Therefore, the discharge induction layer may be formed to surround the overvoltage protection unit 2300. In this case, the discharge induction layer between the overvoltage protection unit 2300 and the internal electrode 2200 and the discharge induction layer between the overvoltage protection unit 2300 and the sheet may have different compositions. Meanwhile, the discharge induction layer may be formed by removing at least one region, and may be formed to have a thickness different from that of at least one region. That is, the discharge induction layer may be discontinuously formed by removing at least one region, and the thickness may be formed in a non-uniformly different thickness of at least one region. The discharge induction layer may be formed between the internal electrode 2200 and the overvoltage protection unit 2300 by interdiffusion of an internal electrode material and an overvoltage protection material during the firing process. Meanwhile, a part of the thickness of the overvoltage protection part 2300 is changed to the discharge induction layer, so that the discharge induction layer may be formed to have a thickness of 10% to 70% of the thickness of the overvoltage protection part 2300. Therefore, the discharge induction layer may be formed thinner than the overvoltage protection unit 2300, and may be formed to have a thickness that is thicker, equal to, or thinner than that of the internal electrode 2200. By the discharge inducing layer, the ESD voltage may be induced to the overvoltage protection unit 2300 or the level of discharge energy induced to the protection unit 2300. Therefore, it is possible to discharge the ESD voltage more easily to improve the discharge efficiency. In addition, since the discharge induction layer is formed, diffusion of heterogeneous materials into the overvoltage protection unit 2300 may be prevented. That is, diffusion of the sheet material and the internal electrode material into the overvoltage protection unit 2300 may be prevented, and external diffusion of the overvoltage protection material may be prevented. Accordingly, the discharge inducing layer may be used as a diffusion barrier, thereby preventing the overvoltage protection unit 2300 from being destroyed.

The overvoltage protection material used as at least a part of the overvoltage protection unit 2300 may be formed by mixing a conductive material and an insulating material. For example, the overvoltage protection material may be used by mixing a conductive ceramic and an insulating ceramic, and may be formed by mixing the conductive ceramic and the insulating ceramic in a mixing ratio of, for example, 10:90 to 90:10. As the mixing ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the mixing ratio of the conductive ceramic increases, the discharge starting voltage decreases. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted to obtain a predetermined discharge start voltage. In this case, a plurality of pores (not shown) may be formed in the overvoltage protection material. Of course, the overvoltage protection material may be formed by stacking a conductive layer and an insulating layer into a predetermined stacked structure, and a void may be further formed in a predetermined region. For example, the overvoltage protection unit 2300 may be formed in a stacked structure of a conductive layer, an insulating layer, a gap, an insulating layer, and a conductive layer from a lower side to an upper side.

On the other hand, the conductive material used as the overvoltage protection material can flow a current with a predetermined resistance. For example, the conductive material may be a resistor having several kilowatts to several hundred kilowatts. Such a conductive layer lowers the energy level when an ESD voltage or the like is introduced to prevent structural destruction of the composite protection part due to the overvoltage. In other words, the conductive material serves as a heat sink to convert electrical energy into thermal energy. The conductive material may use a conductive ceramic, and the conductive ceramic may use a mixture including at least one of La, Ni, Co, Cu, Zn, Ru, and Bi. In addition, the insulating material used as the overvoltage protection material may be made of a discharge inducing material, and may function as an electrical barrier having a porous structure. Such an insulating material may be formed of an insulating ceramic, and as the insulating ceramic, a ferroelectric material having a dielectric constant of about 50 to 25000 may be used. For example, the insulating ceramic may be formed of at least one of dielectric material powder such as MLCC, SiO ₂ , Fe ₂ O ₃ , Co ₃ O ₄ , BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, Al ₂ O ₃ . It can be formed using the mixture included. The insulating material may have a porous structure in which a plurality of pores having a size of about 1 nm to 30 μm are formed to have a porosity of 30% to 80%. At this time, the average of the shortest distance between the pores may be about 1nm to 50㎛. The insulating material does not flow current, but because pores are formed, current may flow through the pores. In this case, as the size of the pores increases or the porosity increases, the discharge start voltage may decrease. On the contrary, when the size of the pores decreases or the porosity decreases, the discharge start voltage may increase. Accordingly, the pore size and the porosity of the insulating layer may be adjusted to adjust the discharge start voltage while maintaining the shape of the overvoltage protection unit 2300. The overvoltage protection material is a material in which at least one conductive material selected from Ru, Pt, Pd, Ag, Au, Ni, Cr, W, Fe, and the like is mixed with organic materials such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB). Can be formed. In addition, the overvoltage protection material may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ with the mixed material.

2.4. 연결 전극2.4. Connecting electrode

The connection electrode 2400 is formed inside the stack 2100 and is formed to connect them between the internal electrode 2200 and the external electrode 2500. That is, the connection electrode 2400 is connected between the first and second

external electrodes

2510, 2520; 500 and the first and second

internal electrodes

2210, 2220, 2200, respectively, with the first and second connections.

Electrodes

2410 and 2420 may be included. The connection electrode 2400 may have at least one of a planar shape and a cross-sectional shape having a polygonal shape of approximately circular, elliptical, rectangular, square, pentagonal or more, and have a predetermined thickness. In addition, the connection electrode 2400 may be formed to at least overlap the overvoltage protection unit 2300. Preferably, the connection electrode 2400 may be formed at a central portion of the stack 2100 and overlap the overvoltage protection unit 2300.

The connection electrode 2400 is formed to form an opening in a predetermined region of at least one or more sheets stacked on the internal electrode 2200 and to fill the opening by using a conductive material. For example, the connection electrode 2400 may be formed of a metal or a metal alloy including any one or more components of Al, Ag, Au, Pt, Pd, Ni, and Cu. Of course, the connection electrode 2400 may be formed using various conductive materials in addition to the metal. The connection electrode 2400 may have a height in the Z direction, that is, in a vertical direction, the same as or different from that of the overvoltage protection part 2300, and a width in the X direction and the Y direction is the width of the overvoltage protection part 2300. It may be more identical or different. That is, the connection electrode 2400 may be formed to be greater than or equal to the height of the overvoltage protection part 2300, and may be formed to be equal to or greater than the diameter or width. Preferably, the height of the connection electrode 2400 may be higher than the height of the overvoltage protection unit 2300, and the plane width may be larger than the plane width of the overvoltage protection unit 2300. For example, each of the first and

second connection electrodes

2410 and 2420 may be formed to a height of 0.5 to 3 times the height of the overvoltage protection unit 2300. In addition, the sum of the heights of the first and

second connection electrodes

2410 and 2420 may be formed to be one to six times the height of the overvoltage protection unit 2300. For example, the sum of the heights of the first and

second connection electrodes

2410 and 2420 may be formed to 100 μm to 1000 μm, preferably 200 μm to 900 μm, and more preferably 400 μm to 700 μm. . In this case, the heights of the first and

second connection electrodes

2410 and 2420 may be different from each other, and the width may also be different from each other. In addition, the width of the X direction of the connection electrode 2400 may be formed to be 1% to 90% of the length of the X direction of the laminate 2100, and the width of the Y direction may be 5 times the width of the Y direction of the laminate 2100. It may be formed from% to 90%. In this case, the width of the X direction and the width of the Y direction of the connection electrode 2400 may be the same or different. That is, the width of at least one region including the X-direction width and the Y-direction width of the connection electrode 2400 may be the same as or different from the width of the other region. In other words, at least one region of the connection electrode 2400 may be formed in an asymmetric shape. The width of the connection electrode 2400 in the X direction and the Y direction may be formed to be 1 to 10 times the width of the overvoltage protection part 2300 in the X direction and the Y direction, and the X direction length and the Y direction of the internal electrode 2200. It can be formed from 1/10 times to 1 times the width of the direction, respectively. That is, the width of the connection electrode 2400 is shorter than the length and width of the laminate 2100 in the X and Y directions, is equal to or larger than the width of the overvoltage protection part 2300, and is smaller than the width of the internal electrode 2200. Or the same.

The connection electrode 2400 functions to connect the external electrode 2500 and the internal electrode 2200. Therefore, an overvoltage such as an ESD applied through the external electrode 2500 is transferred to the internal electrode 2200 and the overvoltage protection unit 2300 through the connection electrode 2400, and the overvoltage through the overvoltage protection unit 2300 is again provided. The internal electrode 2200 and the connection electrode 2400 are transferred to the external electrode 2500. In addition, since the connection electrode 2400 is formed at the center of the stack 2100 and preferably wider than the width of the overvoltage protection unit 2300, parasitic resistance and parasitic inductance may be reduced. That is, the parasitic resistance and the parasitic inductance can be reduced as compared with the case where the connection electrode 2400 is formed outside the stack 2100. Therefore, the insertion loss of S21 can be reduced in the wireless communication frequency range of 700 MHz to 3 GHz. In addition, since the connection electrode 2400 is formed to have a width wider than the width of the overvoltage protection unit 2300, it is possible to prevent deterioration due to repetitive ESD voltages and to suppress an increase in the discharge start voltage. That is, the overvoltage protection unit 2300 bypasses the ESD voltage by generating a spark therein, for example, by ESD energy. When the thickness of the connection electrode 2400 is thin, the connection electrode 2400 is repeated according to a repetitive ESD voltage. This loss may cause an increase in discharge start voltage. However, by forming the thickness of the connection electrode 2400 to be 10 μm or more, the loss of the connection electrode 2400 due to the repetitive ESD voltage can be prevented, thereby preventing the rise of the discharge start voltage.

5. 외부 전극5. External electrode

The

external electrodes

2510, 2520; 2500 may be provided on two surfaces facing each other outside the stack 2100. For example, the external electrode 2500 may be formed on two opposite surfaces of the stack 2100, that is, the lower surface and the upper surface, in the Z direction, that is, in the vertical direction. In addition, the external electrodes 2500 may be connected to the connection electrodes 2400 in the stack 2100, respectively. In this case, any one of the external electrodes 2500 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 2510 may be connected to the internal circuit 20, and the second external electrode 2520 may be connected to the conductor 10 through the contact portion 1000.

The external electrode 2500 may be formed in various ways. That is, the external electrode 2500 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as deposition, sputtering, plating, and the like. Meanwhile, the external electrode 2500 may be formed on the entire lower surface and the upper surface of the stack 2100 or on a portion of the lower surface and the upper surface. For example, the external electrode 2500 may be formed with an area of 50% to 95% excluding a predetermined width from edges of the lower surface and the upper surface. In addition, the external electrode 2500 may be formed in the entire area of the lower surface and the upper surface, and extend from the upper and lower portions therefrom to be formed on the other side. That is, the external electrode 2500 may extend to a predetermined area of a lower surface and an upper surface facing in the Z direction as well as a surface opposite to the X and Y directions, respectively. The external electrode 500 may be formed of one or more metals selected from the group consisting of, for example, gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, at least a part of the external electrode 2500 connected to the connection electrode 2400 may be formed of the same material as the connection electrode 2400. For example, when the connection electrode 2400 is formed of copper, at least a part of the connection electrode 2400 may be formed of copper from an area in contact with the connection electrode 2400 of the external electrode 2500.

In addition, the external electrode 2500 may further include at least one plating layer. The external electrode 2500 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 2500 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, the Cu plating layer, Ni plating layer and Sn plating layer may be laminated. In addition, the external electrode 2500 may be formed by mixing, for example, a glass frit of a multicomponent system based on 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ with a metal powder. In this case, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to two surfaces of the laminate 2100. As the glass frit is included in the external electrode 2500, the adhesion between the external electrode 2500 and the laminate 2100 may be improved, and the contact reaction between the connection electrode 2400 and the external electrode 2500 may be improved. . In addition, after the conductive paste including glass is applied, at least one plating layer may be formed on the upper portion to form the external electrode 2500. That is, the metal layer including the glass and at least one plating layer formed thereon may be formed to form the external electrode 2500. For example, the external electrode 2500 may sequentially form a Ni plating layer and a Sn plating layer through electrolytic or electroless plating after forming a layer including a glass frit and Ag and Cu. In this case, the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer. Of course, the external electrode 2500 may be formed of only at least one plating layer. That is, the external electrode 2500 may be formed by forming at least one layer of the plating layer using at least one plating process without applying the paste. Meanwhile, the external electrode 2500 may be formed to a thickness of 2 μm to 100 μm, the Ni plating layer may be formed to a thickness of 1 μm to 10 μm, and the Sn or Sn / Ag plating layer may have a thickness of 2 μm to 10 μm. Can be formed.

2.6. 표면 개질 부재2.6. Surface modification

Meanwhile, a surface modification member (not shown) may be formed on at least one surface of the laminate 2100. The surface modification member may be formed by, for example, distributing an oxide on the surface of the laminate 2100 before forming the external electrode 2500. Here, the oxide may be dispersed and distributed on the surface of the laminate 2100 in a crystalline state or an amorphous state. The surface modification member may be distributed on the surface of the laminate 2100 before the plating process when the external electrode 2500 is formed by the plating process. That is, the surface modification member may be distributed before forming a part of the external electrode 2500 in the printing process, or may be distributed before performing the plating process after the printing process. Of course, when the printing process is not performed, the plating process may be performed after the surface modification member is distributed. At this time, at least a portion of the surface modification member distributed on the surface may be melted.

On the other hand, at least a portion of the surface modification member may be evenly distributed on the surface of the laminate 2100 in the same size, and at least a portion may be irregularly distributed in different sizes. In addition, a recess may be formed on at least part of the surface of the laminate 2100. That is, the surface modification member may be formed to form a convex portion, and at least a portion of the region where the surface modification member is not formed may be recessed to form a recess. In this case, at least a portion of the surface modification member may be formed deeper than the surface of the laminate 2100. That is, the surface modification member may be formed with a predetermined thickness to be embedded at a predetermined depth of the laminate 2100 and the remaining thickness higher than the surface of the laminate 2100. In this case, the thickness of the laminate 2100 may be 1/20 to 1 of the average diameter of the oxide particles. That is, all of the oxide particles may be embedded in the laminate 2100, and at least some may be embedded. Of course, the oxide particles may be formed only on the surface of the laminate 2100. Therefore, the oxide particles may be formed in a hemispherical shape on the surface of the laminate 2100, or may be formed in a spherical shape. In addition, the surface modification member may be partially distributed on the surface of the laminate 2100 as described above, or may be distributed in a film form on at least one region. That is, the oxide particles may be distributed in the form of islands on the surface of the laminate 2100 to form a surface modification member. That is, oxides in a crystalline state or an amorphous state may be distributed in an island form on the surface of the laminate 2100, and thus at least a portion of the surface of the laminate 2100 may be exposed. In addition, the oxide may be formed as a film in at least one region and at least a portion thereof in an island form by connecting at least two surface modification members. That is, at least two or more oxide particles may be aggregated or adjacent oxide particles may be connected to form a film. However, even when the oxide is present in the form of particles or when two or more particles are aggregated or connected, at least a part of the surface of the laminate 2100 is exposed to the outside by the surface modification member.

In this case, the total area of the surface modification member may be, for example, 5% to 90% of the total surface area of the laminate 2100. The plating bleeding phenomenon of the surface of the laminate 2100 may be controlled according to the area of the surface modifying member. However, when too much surface modifying member is formed, it may be difficult to contact the conductive pattern inside the laminate 2100 and the external electrode 2500. Can be. That is, when the surface modification member is formed to less than 5% of the surface area of the laminate 2100, the plating bleeding phenomenon is difficult to control, and when formed to exceed 90%, the conductive pattern and the external electrode 2500 inside the laminate 2100 are difficult to control. ) May not be in contact. Accordingly, the surface modification member may be formed to have an area that can control the plating bleeding phenomenon and can be in contact with the conductive pattern inside the laminate 2100 and the external electrode 2500. For this purpose, the surface modification member may be formed in 10% to 90% of the surface area of the laminate 2100, preferably in an area of 30% to 70%, more preferably of 40% to 50% It can be formed into an area. At this time, the surface area of the laminate 2100 may be one surface area, or may be the surface areas of six surfaces of the laminate 2100 forming a hexahedron. Meanwhile, the surface modification member may be formed to a thickness of 10% or less of the thickness of the laminate 2100. That is, the surface modification member may be formed to a thickness of 0.01% to 10% of the thickness of the laminate 2100. For example, the surface modification member may be present in a size of 0.1 μm to 50 μm, and thus the surface modification member may be formed to a thickness of 0.1 μm to 50 μm from the surface of the laminate 2100. That is, the surface modification member may be formed to have a thickness of 0.1 μm to 50 μm from the surface of the laminate 2100 except for a region that is more than the surface of the laminate 2100. Accordingly, when the thickness of the laminate 2100 is embedded, the surface modification member may have a thickness greater than 0.1 μm to 50 μm. When the surface modification member is formed to a thickness less than 0.01% of the thickness of the laminate 2100, it is difficult to control the plating bleeding phenomenon, and when the surface modified member is formed to a thickness exceeding 10% of the thickness of the laminate 2100, the laminate 2100. The internal conductive pattern and the external electrode 2500 may not be in contact. That is, the surface modification member may have various thicknesses according to the material properties (conductivity, semiconductivity, insulation, magnetic material, etc.) of the laminate 2100, and may have various thicknesses according to the size, distribution amount, or aggregation of the oxide powder. have.

As such, the surface modification member is formed on the surface of the laminate 2100, so that at least two regions having different components may exist on the surface of the laminate 2100. That is, different components may be detected in the region where the surface modification member is formed and the region where the surface modification member is not formed. For example, a region in which the surface modification member is formed may include a component according to the surface modification member, that is, an oxide, and a region according to the surface modification member may include a component according to the laminate 2100, that is, a component of the sheet. Thus, by distributing the surface modification member on the surface of the laminate 2100 before the plating process, the surface of the laminate 2100 may be provided with a roughness to be modified. Therefore, the plating process can be performed uniformly, thereby controlling the shape of the external electrode 500. That is, the surface of the laminate 2100 may have a resistance at least in one region different from that in another region. If the plating process is performed in a state where the resistance is uneven, growth unevenness of the plating layer may occur. In order to solve this problem, the surface of the laminate 2100 may be modified by dispersing oxides in a particulate state or a molten state on the surface of the laminate 2100 to form a surface modification member, and the growth of the plating layer may be controlled. have.

Here, the oxide in the granular or molten state to make the surface resistance of the laminate 2100 uniform is, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al _{At least one of 2} O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ , and CaCO ₃ may be used. Meanwhile, the surface modification member may be formed on at least one sheet in the laminate 2100. That is, although the conductive patterns of various shapes on the sheet may be formed by a plating process, the shape of the conductive patterns can be controlled by forming the surface modification member.

9 is a view according to another embodiment of the composite protective part, FIG. 9A is a perspective view, and FIG. 9B is a sectional view.

As shown in FIG. 9, the composite protection unit 2000 according to another exemplary embodiment of the present invention may include a laminate 2100 in which a plurality of sheets 101 to 111 and 100 are stacked, and inside the laminate 2100. A capacitor formed between the capacitor parts 2200a and 2200b and the capacitor parts 2200a and 2200b including a plurality of internal electrodes 201 to 208 and 200, and disposed between the at least two discharge electrodes 311 and 312 and between them. A protective part 3000 including the provided overvoltage protection member 320, and

external electrodes

2510, 2520; 2500 provided outside the stack 2100 and connected to the capacitor parts 2200a and 2200b and the overvoltage protection part 2300. ) May be included.

According to another exemplary embodiment of the present disclosure, a plurality of internal electrodes 200 may be formed inside the stack 2100 to form capacitor parts 2200a and 2200b and to protect an overvoltage between the plurality of internal electrodes 200. An overvoltage protection unit 2300 is formed. In this case, the overvoltage protection unit 2300 may include a discharge electrode 310 and an overvoltage protection member 320 formed therebetween. That is, the composite protection unit according to an embodiment of the present invention functions as a capacitor while the internal electrode 2200 functions as a discharge electrode, but the composite protection unit according to another embodiment of the internal electrode 200 and the discharge electrode 310 may be used. Functions can be formed separately. In addition, in one embodiment of the present invention, the external electrode 2500 is formed on two surfaces facing the stacking direction of the sheet, but in another embodiment of the present invention, the external electrode 2500 is perpendicular to the stacking direction of the sheet 100. It is formed on two sides of the direction. However, in addition to the structural difference, the forming material, the shape, and the like are the same as those described in the embodiment, and thus detailed descriptions according to other embodiments will be omitted.

As described above, in the contactor according to the first embodiment of the present invention, the contact part 1000 is in contact with the conductor 10 which the user can contact, and the composite protection part 2000 is connected to the internal circuit through the conductive adhesive part 3000. 20) can be used to cut off the leakage current, and to pass overvoltage such as ESD to the ground terminal. That is, the composite protection unit 2000 of the present invention transmits the electric current from the ground terminal of the internal circuit 20 to the conductor 10 such as a metal case since no current flows between the external electrodes 2500 at the rated voltage and the electric shock voltage. The leakage current can be cut off, and in an overvoltage such as an ESD voltage, a current flows through the inside of the composite protection unit 2000, so that an overvoltage applied from the outside to the internal circuit 20 through the conductor 10 to the ground terminal. I can pass it. Meanwhile, the composite protection unit 2000 may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the composite protection unit 2000 may have a rated voltage of 100 V to 240 V, an electric shock voltage may be equal to or higher than an operating voltage of a circuit, and an ESD voltage generated by external static electricity may be higher than an electric shock voltage. And the discharge start voltage may be 350V to 15kV. In addition, the composite protection unit 2000 is provided with a capacitor inside the communication unit may be a communication signal between the external and the internal circuit 20 by the capacitor. That is, a communication signal from the outside, for example, an RF signal may be transmitted to the internal circuit 20 by the capacitor unit, and the communication signal from the internal circuit 20 may be transmitted to the outside by the capacitor unit. Therefore, even when a separate antenna is not provided and a conductor 10 such as a metal case is used as the antenna, a communication unit may transmit and receive a communication signal with the outside. As a result, the composite protection unit 2000 according to the present invention cuts off leakage current flowing from the ground terminal of the internal circuit 20, bypasses the ESD voltage applied from the outside to the ground terminal, and between the outside and the electronic device. Can communicate communication signals.

In addition, the composite protection unit 2000 according to an embodiment of the present invention stacks a plurality of sheets having high breakdown voltage characteristics to form a capacitor, so as to form, for example, 310V from the internal circuit 20 to the conductor 10 by the defective charger. The insulation resistance state can be maintained so that a leakage current does not flow when an electric shock voltage is applied, and the overvoltage protection unit 2300 also bypasses the ESD voltage when the ESD voltage flows from the conductor 10 to the internal circuit 20. High insulation resistance can be maintained without breakage. That is, the overvoltage protection unit 2300 is introduced from the outside by including an overvoltage protection material consisting of a conductive layer for converting electrical energy into thermal energy by lowering an energy level and an insulating layer made of a porous structure to flow current through micropores. The circuit can be protected by bypassing the ESD voltage. Therefore, the insulation voltage is not broken even by the ESD voltage, and accordingly, the leakage current generated from the defective charger is provided in the electronic device having the conductor 10 such as the metal case to continuously transmit to the user through the metal case of the electronic device. Can be prevented. On the other hand, the general MLCC (Multi Layer Capacitance Circuit) protects the electric shock voltage but is vulnerable to ESD. It is damaged due to sparking due to leakage point caused by charge charging when repeated ESD is applied. Phenomenon may occur. However, in the present invention, an overvoltage protection member including a conductive layer and an insulating layer is formed between the capacitor portions so that the capacitor portion is not destroyed by passing the ESD voltage through the overvoltage protection member.

다른 실시 예Another embodiment

Hereinafter, a contact unit according to other exemplary embodiments of the present disclosure will be described, and portions already described above will be omitted.

Referring to FIG. 10, a contactor according to a third embodiment of the present invention may include a gasket-type contact part 1000a in which at least one area is in contact with the conductor 10, and at least one area is in contact with the contact part 1000a. The at least another region may include a composite protection part 2000 electrically connected to the internal circuit 2000, and a conductive adhesive part 3000 provided between the composite protection part 2000 and the internal circuit 20. That is, the third embodiment of the present invention may use the gasket type contact portion 1000a instead of the clip type of the first embodiment. In addition, in the case of the third embodiment of the present invention, similarly to the second embodiment, the conductive part 4000 may be further provided.

The contact part 1000a may include any one of a conductive rubber, a conductive silicon, an elastic body having a conductive lead inserted therein, and an elastic body whose surface is coated or bonded with a conductor. The conductive gasket type contact part 1000a may be provided on one side of the composite protection part 2000. That is, a gasket type contact part 1000a may be provided on one side of the composite protection part 2000, and a conductive adhesive part 3000 may be provided on the other side. The gasket type contact portion 1000a may include an elastic core (not shown) having an elastic force and a conductive layer (not shown) formed on the surface of the elastic core. That is, the conductive layer is formed on the outer surface of the elastic core to implement the contact portion 1000a in the form of a conductive gasket. The elastic core may have an elastic force and be formed of an insulating material. For example, the elastic core may be polyurethane foam, PVC, silicone, ethylene vinyl acetate copolymer, polymer synthetic resin such as polyethylene, natural rubber (NR), butylene rubber (SBR), ethylene propylene rubber (EPDM), age Rubber such as krill rubber (NBR) or neoprene, solid sheets or sponge sheets can be used. Meanwhile, a through hole (not shown) penetrating in one direction may be formed in the elastic core. The conductive layer may be formed to surround the outer circumferential surface of the elastic core. The conductive layer may be formed of various conductive materials such as carbon black, graphite, gold, silver, copper, nickel, and aluminum. The conductive layer is formed in a film form to surround the elastic core, and an adhesive may be applied to the elastic core. On the other hand, the elastic core may have conductivity, and thus a conductive layer may not be formed on the surface of the elastic core. For this purpose, for example, the conductive powder may be mixed in the elastic core.

11 is a perspective view of a contactor according to a fourth embodiment of the present invention, FIG. 12 is a side view, and FIG. 13 is another side view. 12 is a side view in the Y direction, and FIG. 13 is a side view in the X direction. 14 is a plan view of an internal circuit in which a contactor is mounted according to a fourth embodiment of the present invention, and FIG. 15 is a plan view of a state in which a contactor is mounted in an internal circuit according to a fourth embodiment.

11 to 15, a contactor according to a fourth embodiment of the present invention may include a contact portion 1000 in which at least one region is in contact with the conductor 10, and at least one region in contact with the internal circuit 20. The composite protection part 2000, at least the conductive adhesive part 3000 provided between the composite protection part 2000 and the internal circuit 20, and one area contacting the contact part 1000, and the other area is the internal circuit 20. It may include an extension portion 5000 in contact with. Here, the conductive adhesive part 3000 may be provided in at least one region of the external electrode 2500 and the extension part 5000 of the composite protection part 2000. That is, the conductive adhesive part 3000 may be provided on the lower surface of the external electrode 2500 and the lower surface of the extension part 5000 that are in contact with the internal circuit 20. In addition, the composite protection unit 2000 may use a structure in which the external electrode 2500 is formed in a direction crossing the stacking direction of the sheet illustrated in FIG. 9, and the contact unit 1000 may be formed of a laminate in the stacking direction of the sheet. It may be provided on one surface of the (1000). That is, in FIG. 9, external electrodes 2500 may be formed on two side surfaces of the composite protection part 2000 that face each other in the X direction, and a contact part 1000 may be provided on one surface in the Y direction. Therefore, the contact unit 1000 and the composite protection unit 2000 are not electrically connected directly. Meanwhile, as illustrated in FIG. 12, the internal circuit 20 includes a first mounting region 21 in which one region of the composite protection unit 2000 is mounted and a second region in which other regions of the composite protection unit 2000 are mounted. The mounting area 22 and the third and fourth mounting

areas

23 and 24 on which the extension part 5000 connected to the contact part 1000 are mounted may be included. That is, the first external electrode 2510 of the composite protection part 2000 is mounted on the first mounting area 21 using the conductive adhesive part 3000, and the composite protection part 2000 is mounted on the second mounting area 22. The second external electrode 2520 is mounted using the conductive adhesive part 3000, and the bottom surface of the extension part 5000 connected to the contact part 1000 is conductive in the third and fourth mounting

areas

23 and 24. Each may be mounted using the adhesive part 3000. Here, the first mounting region 21 is insulated from the second mounting region 22 and the third and fourth mounting

regions

23 and 24, and is insulated from the second mounting region 22 and the third and fourth. The mounting

regions

23 and 24 may be electrically connected to each other. Therefore, in the third embodiment of the present invention, the contact unit 1000 and the composite protection unit 2000 may not be electrically connected directly, but may be electrically indirectly connected through the internal circuit 20. That is, the contact unit 1000 and the composite protection unit 2000 may be electrically connected by the extension unit 5000 through the internal circuit 20.

4. 연장부4. Extension

The extension part 5000 may be provided at both edge portions of the support part 1100 of the contact part 1000 to extend in the direction of the internal circuit 20. In addition, the extension part 5000 may be formed in contact with the side surface of the composite protection part 2000. That is, the support part 1100 and the extension part 5000 of the contact part 1000 may be formed to surround the upper surface and the side surface of the composite protection part 2000. Here, the extension part 5000 may be integrally formed with the contact part 1000. That is, the extension part 5000 may extend from both side surfaces of the support part 1100 in the longitudinal direction, and may be bent downward from both side surfaces of the support part 1100 to be in contact with the side surface of the composite protection part 2000. However, the extension portion 5000 may be manufactured separately from the contact portion 1000 and may be coupled by a coupling member or the like. In this case, since the extension part 5000 must be electrically connected to the contact part 1000, the coupling member may include a conductive adhesive, soldering, or the like. When the conductive adhesive is used, the conductive adhesive portion of the present invention can be used. In addition, a coupling member may be provided between the contact part 1000 and the extension part 5000 and the composite protection part 2000 to couple the contact part 1000 and the extension part 5000 and the composite protection part 2000. For example, the contact part 1000, the extension part 5000, and the composite protective part 2000 may be adhered to each other using an adhesive member such as a double-sided adhesive tape, an adhesive, solder, or the like. In this case, the non-conductive adhesive member may be used as the adhesive member between the composite protection part 2000, the contact part 1000, and the extension part 5000. Meanwhile, the conductive adhesive part 3000 may be provided on a region to be contacted and mounted on the inner electrode 20, that is, a lower surface of the extension part 5000 and a lower surface of the external electrode 2500 of the composite protective part 2000. have. At this time, the external electrode 2500 is electrically connected through the internal circuit 20, but since it is to be insulated other than that, the conductive adhesive parts 3000 provided on the lower surfaces of the two external electrodes 2500 are spaced apart from each other. In addition, the conductive adhesive parts 3000 provided under the extension part 5000 may also be formed to be spaced apart from each other. However, since the first external electrode 2510 and the extension part 5000 may be connected through the internal circuit 20, the conductive adhesive part 3000 may be formed on the bottom surface of the first external electrode 2510 and the bottom surface of the extension part 400. ) May be provided as one. That is, the conductive adhesive part 3000 includes a first conductive adhesive part provided under the second external electrode 2520, and a second conductive adhesive part provided to cover the first external electrode 2510 and the extension part 5000. The first and second conductive adhesive parts may be spaced apart by a predetermined interval.

As described above, the extension part 5000 may be provided on at least one region of the contact part 1000, for example, a side surface of the support part 1100, and may be mounted on the internal circuit 20. Since the extension part 5000 and the contact part 1000 are electrically connected, the contact part 1000 may be connected to the internal circuit 20 through the extension part 5000. Accordingly, the contact unit 1000 connects the internal circuit 20 and the conductor 10, such as a case of an electronic device, which can function as an antenna, for example, by the extension unit 5000, and the internal circuit ( The communication signal applied to 20 may be transmitted to the internal circuit 20, and a high voltage such as an ESD that may be applied from the outside may be transmitted to the internal circuit 20.

Meanwhile, although the fourth embodiment of the present invention has been described as the clip type contact part 1000, the contact part may be implemented by using a conductive gasket. In this case, the conductive gasket may be provided to surround the side surface of the composite protection part 2000, and the lower part may be used as the extension part 5000. Of course, the extension portion 5000 may be formed using a conductive material so as to extend downward from the side surface of the conductive gasket type contact portion 1000. In addition, in the case of the fourth embodiment of the present invention, like the second embodiment, the conductive part 4000 may be further provided. That is, the conductive part 4000 is further provided below the extension part 5000 and the external electrode 2500, and the conductive part 4000 may be mounted on the internal circuit 20 or the bracket using the conductive adhesive part 3000. Can be.

As described above, the contactor according to the fourth exemplary embodiment of the present invention is provided so that the extension part 5000 contacts the side surface of the composite protection part 2000 from a part of the contact part 1000 and is mounted on the internal circuit 20. That is, the internal circuit 20 includes a first mounting region 21 in which one region of the composite protection unit 2000 is mounted, a second mounting region 22 in which other regions of the composite protection unit 2000 are mounted, and And third and fourth mounting

regions

23 and 24 on which the extension portion 5000 electrically connected to the contact portion 1000 is mounted, and the first mounting region 21 includes the second to fourth mounting regions 22. And 23 and 24, and are insulated from each other, and the second mounting region 22 and the third and fourth mounting

regions

23 and 24 may be electrically connected to each other. Therefore, the contact part 1000 and the composite protection part 2000 may be electrically indirectly connected through the extension part 5000 and the internal circuit 20 instead of being electrically connected directly. That is, the contact part 1000 and the composite protection part 2000 may be electrically connected to each other through the second to fourth mounting

areas

22, 23, and 24 by the extension part 5000. In this case, the first mounting area 21 may be connected to the ground terminal. Accordingly, the ESD voltage applied from the outside is transferred to at least one of the third and fourth mounting

regions

23 and 24 through the contact portion 1000 and the extension portion 5000, and then the third and fourth mounting

regions

23, 24 is transferred to the second mounting region 22 electrically connected to the second mounting region 22, and is transferred to the other side of the composite protection unit 2000 connected to the second mounting region 22, for example, the second external electrode 2520. A ground terminal connected to one side of the composite protection unit 2000, for example, the first external electrode 2510, through the ESD overvoltage protection unit 2300 inside the protection unit 2000 and connected to the first mounting area 21. Bypassed.

16 is a perspective view of the contactor according to the fifth embodiment of the present invention, Figure 17 is an exploded perspective view. 18 is a side view of the Y direction, and FIG. 19 is another side view of the X direction. 20 is a cross-sectional view in which a contactor according to a fifth embodiment of the present invention is provided between a conductor and an internal circuit.

16 to 20, the electric shock prevention contactor according to the fifth embodiment of the present invention has a contact portion 1000 in which at least one region is in contact with the conductor 10, and the contact portion 1000 is insulated from the contact portion 1000. The composite protection unit 2000 is provided below the 1000 and blocks the electric shock voltage and bypasses overvoltage such as ESD, and one region is connected to the contact unit 1000 and contacts the side surface of the composite protection unit 2000. And an extension part 5000 formed to extend downward, a mounting part 6000 provided below the composite protection part 2000, on which the extension part 5000 and the composite protection part 2000 are mounted, an extension part 5000, and A conductive adhesive part 3000 may be provided between the composite protection part 2000 and the mounting part 6000 to bond the extension part 5000 and the composite protection part 2000 to the mounting part 6000. The conductive adhesive part 3000 may include a first conductive adhesive part 4100 provided under the first external electrode 2510, and a second conductive adhesive part provided under the second external electrode 2520 and the extension part 5000. 4200). In addition, since the contact unit 1000, the composite protection unit 2000, and the extension unit 5000 are the same as described in the fourth embodiment of the present invention, detailed description thereof will be omitted.

5. 실장부5. Mounting Department

The mounting unit 6000 may be provided below the composite protection unit 2000, and the composite protection unit 2000 and the extension unit 5000 may be mounted. In addition, the mounting unit 6000 in which the complex protection unit 2000 and the extension unit 5000 are mounted may be mounted on the internal circuit 20. The mounting portion 6000 may be provided in a plate shape having a predetermined thickness, and a conductive layer may be formed on at least one surface thereof. For example, the mounting portion 6000 may include an insulating layer 6100 provided in a plate shape having a predetermined thickness, a conductive pad 6200 formed on one surface of the insulating layer 6100, and the other surface of the insulating layer 6100. The conductive layer 6300 may be formed. In addition, the semiconductor device may further include a conductive via 6400 formed in the insulating layer 6100 to connect the conductive pad 6200 and the conductive layer 6300.

The insulating layer 6100 may be provided in a substantially rectangular plate shape having a predetermined thickness. The insulating layer 6100 may be provided larger than the size of the composite protective part 2000. That is, the length in the X direction may be longer than the length of the composite protection part 2000, and the width in the Y direction may be greater than the width of the composite protection part 2000. The insulating layer 6100 may be formed of, for example, a PCB material constituting the internal circuit 20, for example, a resin.

The conductive pad 6200 is formed on one surface of the insulating layer 6100. That is, the conductive pad 6200 is formed on one surface of the insulating layer 6100 facing the composite protective part 2000 and the extension part 5000. The conductive pad 6200 may be formed at a predetermined height on one surface of the insulating layer 6100, or may be formed at a predetermined depth in the insulating layer 6100 so that the upper surface may be exposed on the insulating layer 6100. The conductive pad 6200 may be mounted by contacting the first and second

external electrodes

2510 and 2520 and the extension part 5000 of the composite protection part 2000, respectively. That is, the conductive pad 6200 may include the first conductive pad 6210 on which the first external electrode 2510 of the composite protective part 2000 is mounted through the first conductive adhesive part 3100, and the composite protective part 2000. The second external electrode 2520 and the extension part 5000 may include a second conductive pad 6220 mounted through the second conductive adhesive part 3200. Here, the second conductive pad 6220 may be formed to have a larger area than the first conductive pad 6210 because the second external electrode 2520 and the extension portion 5000 must be mounted.

The conductive layer 6300 may be formed on the other surface of the insulating layer 6100 on which the conductive pad 6220 is not formed. Here, the conductive layer 6300 may be formed at a predetermined height on the other surface of the insulating layer 6100, or may be formed at a predetermined depth in the insulating layer 6100 so that the surface thereof is exposed to the other surface of the insulating layer 6100. . The conductive layer 6300 is in contact with the internal circuit 20 and serves to connect the internal circuit 20 and the electric shock prevention contactor. Here, the conductive layer 6300 may be mounted on the internal circuit 20 using a conductive adhesive or the like.

Meanwhile, the conductive via 6400 may be formed in the insulating layer 6100 in at least partially overlapping the first conductive pad 6210. That is, the conductive via 6400 is formed in a predetermined region of the insulating layer 6100 and is formed by filling a conductive material. The first conductive pad 6210 and the conductive layer 6300 are electrically connected by the conductive via 6400.

The extension part 5000 and the complex protection part 2000 connected to the contact part 1000 are mounted on the mounting part 6000. In addition, the mounting unit 6000 in which the extension unit 5000 and the composite protection unit 2000 are mounted may be mounted on the internal circuit 20. Therefore, the contact unit 1000 and the composite protection unit 2000 may be connected to the internal circuit 20 through the mounting unit 6000. Accordingly, the electric shock prevention contactor is connected between the internal circuit 20 and the conductor 10, such as a case of an electronic device, which can function as an antenna, for example, and transmits a communication signal supplied from the outside to the internal circuit 20. An overvoltage, such as ESD, may be transmitted to the ground terminal of the internal circuit 20.

Meanwhile, although the fifth embodiment of the present invention has been described as the clip type contact part 1000, the contact part may be implemented using a conductive gasket. In this case, the conductive gasket may be provided to surround the side surface of the composite protection part 2000, and the lower part may be used as the extension part 5000. Of course, the extension portion 5000 may be formed using a conductive material so as to extend downward from the side surface of the conductive gasket type contact portion 1000. Also, in the case of the fifth embodiment of the present invention, the conductive portion 4000 may be further provided as in the second embodiment. That is, the conductive part 4000 may be further provided below the mounting part 6000, and the conductive part 4000 may be mounted on the internal circuit 20 or the bracket using the conductive adhesive part 3000.

As described above, in the contactor according to the fifth exemplary embodiment, one region of the composite protection unit 2000 is mounted on the first conductive pad 6210 of the mounting unit 6000, and the second conductive pad 6220 is provided. An extension part 5000 electrically connected to the other area of the composite protection part 2000 and the contact part 1000 is mounted on the upper surface of the composite protection part 2000. Therefore, the contact part 1000 and the composite protection part 2000 may be electrically indirectly connected through the extension part 5000 and the mounting part 6000 instead of being electrically connected directly. In addition, the mounting part 6000 may be mounted on the internal circuit 20 through the third conductive adhesive part 3300 and a part of the internal circuit 20 connected to a part of the mounting part 6000 may be connected to the ground terminal. Therefore, the ESD voltage applied from the outside is transferred to the second conductive pad 6220 through the contact part 1000 and the extension part 5000, and then the other side of the composite protection part 2000 connected to the second conductive pad 6220. For example, the second external electrode 2520 is transferred to the second external electrode 2520, and is connected to one side of the composite protection unit 2000 through the ESD overvoltage protection unit 2300 inside the composite protection unit 2000, for example, the first external electrode 2510. ) Is bypassed to the ground terminal connected to the first conductive pad 6210.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. In other words, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

Claims

Contact portion;

A composite protective part provided in contact with one surface of the contact part; And

And a conductive adhesive portion provided on at least one surface of the composite protective portion.
The contactor of claim 1, wherein the composite protective part is electrically connected directly to the contact part.
The contactor of claim 2, wherein the conductive adhesive part is provided on the other surface of the composite protective part opposite to one surface.
The contactor of claim 3, further comprising a second conductive adhesive portion provided between the contact portion and the composite protective portion and having the same structure as the conductive adhesive portion.
The contactor of claim 1, wherein the complex protection unit is electrically indirectly connected through an internal circuit of the electronic device, rather than directly connected to the contact unit.
The contactor of claim 5, further comprising an extension part electrically connected to the contact part and extending along the side surface of the complex protection part toward the internal circuit and mounted on the internal circuit.
The contactor of claim 6, wherein the conductive adhesive part is provided between the composite protective part and the internal circuit and between the extension part and the internal circuit.
The contactor of claim 6, further comprising a mounting unit on which one side of the composite protective part and the extension part are mounted, and the other side of the composite protection part and the extension part are mounted on the internal circuit.
The contactor of claim 8, wherein the conductive adhesive part is provided between the composite protective part and the mounting part, and between the extension part and the mounting part.
Contact portion;

A composite protection unit having one surface contacted with the contact unit;

A conductive part having one surface contacted with the other surface of the composite protective part; And

And a conductive adhesive portion provided on the other surface of the conductive portion.
The contactor according to claim 10, further comprising a second conductive adhesive portion provided between at least one of the contact portion and the composite protective portion and between the composite protective portion and the conductive portion.
The contactor according to claim 1 or 10, wherein the complex protection part maintains an insulation state below a predetermined voltage and is conducting above a predetermined voltage, passing an AC signal and blocking a DC signal.
The contactor according to claim 1 or 10, wherein the conductive adhesive part comprises a porous base, a filler filling the pores of the base and having adhesiveness, and a plurality of conductive particles dispersed in the filler.
The contactor of claim 13, wherein the base comprises a nonwoven structure or a woven fabric structure using a conductive thread.
The contactor of claim 13, wherein at least some of the conductive particles have a size smaller than the pore size of the base.
The contactor of claim 13, wherein the conductive particles are unevenly distributed in at least one region, or at least some of the conductive particles are in contact with each other and dispersed.
The contactor of claim 13, wherein the conductive particles are contained in an amount of 5 wt% to 40 wt% based on 100 wt% of the mixture of the filler and the conductive particles.
The contactor of claim 1 or 10, further comprising pores formed in at least one region of the conductive adhesive portion.
The contactor according to claim 1 or 10, wherein the conductive adhesive portion has a resistance of 10 kΩ or less.
An electronic device comprising a conductor and an internal circuit that can be contacted by a user,

The electronic device provided with the contactor of any one of Claims 1-11 between the said conductor and the said internal circuit.
The electronic device of claim 20, wherein the complex protection part passes an overvoltage applied from the outside through the conductor to the internal circuit, blocks a leakage current through the internal circuit, and passes a communication signal.
21. The electronic device of claim 20, wherein the conductive adhesive part comprises a porous base, a filler filling and sealing the pores of the base, and a plurality of conductive particles dispersed in the filler.