WO2018124535A1

WO2018124535A1 - Complex device and electronic device having same

Info

Publication number: WO2018124535A1
Application number: PCT/KR2017/014399
Authority: WO
Inventors: 조승훈; 이동석; 허성진
Original assignee: 주식회사 모다이노칩
Priority date: 2016-12-29
Filing date: 2017-12-08
Publication date: 2018-07-05

Abstract

The present invention provides a complex device and an electronic device having same, the complex device comprising: two or more function units which function differently from one another; a connection unit provided between the function units and connecting same; and an external electrode formed on the outside of a lamination body, which are formed from the function units and the connection unit, and connected to at least one part of the function units, wherein the color or brightness of two or more sides, of the lamination body, facing each other differs from one another.

Description

Composite device and electronic device having same

The present invention relates to a composite device, and more particularly, to a composite device including two or more functional layers having different functions and an electronic device having the same.

Passive devices that make up electronic circuits include resistors, capacitors, and inductors, and the functions and roles of these passive devices vary widely. For example, resistors control the flow of current through a circuit, and in AC circuits they also play a role in achieving impedance matching. The capacitor basically blocks the direct current and passes the alternating current signal. Capacitors also form time constant circuits, time delay circuits, RC and LC filter circuits, and the capacitor itself serves to remove noise. In the case of the inductor, it performs functions such as removing high frequency noise and matching impedance.

In addition, an electronic circuit requires an overvoltage protection device such as a varistor or a suppressor to protect the electronic device from an overvoltage such as an ESD applied to the electronic device from the outside. That is, an overvoltage protection device is required in order to prevent overvoltage above the driving voltage of the electronic device from being applied from the outside. For example, varistors are widely used as devices for protecting electronic components and circuits from overvoltage because the resistance changes with applied voltage. In other words, the current does not flow to the varistors arranged in the circuit, but if the overvoltage is applied at both ends of the varistor due to overvoltage or lightning over the breakdown voltage, the resistance of the varistor decreases rapidly, and almost all currents flow through the varistor, and the current to other devices. Does not flow, and the circuit or the electronic components mounted on the circuit are protected from overvoltage.

Recently, in order to reduce the area occupied by these components in response to the miniaturization of electronic devices, at least two or more layers having different functions or characteristics may be stacked to manufacture chip components. For example, a capacitor and an overvoltage protection device may be stacked in one chip to implement chip components to implement high varistor voltage and capacitance. In other words, the varistor has a breakdown voltage determined by its thickness. In order to realize a high breakdown voltage, the varistor has a relatively low capacitance. To compensate for this, the capacitor is made of a material having a high dielectric constant to improve or maintain the capacitance. do.

However, two or more functional layers having different functions have a problem in that they are not bonded well because their physical properties are different from each other. For example, a laminate in which a varistor material and a capacitor material are laminated is easily peeled off or cracked by high temperature sintering. That is, since the varistor material and the capacitor material have different thermal shrinkage rates, torsion may occur during the sintering process, and peeling and cracking may occur. Peeling and cracking deteriorate the characteristics of the varistor and the capacitor, making it difficult to manufacture a practical composite device. In addition, in the sintering process, the materials of the respective functional layers are mutually diffused, and the concentrations distributed according to the positions are different, thereby causing a problem of lowering the function of each functional layer. That is, the closer to the boundary region between the two functional layers, the higher the concentration of the other functional layer material included in one functional layer, and thus, the functional variation of each functional layer may occur due to the variation in concentration.

On the other hand, a device in which two or more functional layers are stacked is mounted on the PCB of the electronic device to have a directivity. For example, the device in which the varistor and the capacitor are stacked is mounted such that the capacitor is provided on the lower side to reduce the parasitic inductance along the parking lot movement path of the capacitor. That is, when the capacitor is located on the upper side, the frequency moving path from one terminal of the PCB to the other terminal of the PCB becomes longer than the case on the lower side, which acts as a parasitic inductance in high frequency communication. Therefore, in high frequency communication, S21 (transmission coefficient) is affected to increase the insertion loss or to narrow the bandwidth of the frequency. Thus, in order to give a directionality to a composite element, the method of apply | coating fluorescent substance to the upper surface of a laminated body, for example, the upper surface of a varistor can be used. However, since the process for applying the phosphor is added, the number of processes is increased and the material cost is increased. In addition, the direction of the laminate is to be adjusted before applying the phosphor, there is a problem that it is difficult to adjust the direction because there is no distinction between the varistor and the capacitor.

(Prior art document)

Korea Patent Registration No. 10-0638802

The present invention provides a composite device in which two or more functional units are stacked with different functions.

The present invention provides a composite device capable of preventing the interdiffusion of materials forming two or more functional units.

The present invention provides a composite device having two or more functional parts and having a directivity.

A composite device according to an aspect of the present invention includes two or more functional units having different functions; A coupling part provided between the functional parts to couple them; And an external electrode formed outside the stack of the functional unit and the coupling unit and connected to at least a portion of the functional unit, wherein at least two opposite surfaces of the stack have different colors or contrasts.

The two or more functional parts have different colors or contrasts.

The two or more functional units differ from each other in at least one of thickness and size.

The functional unit includes two or more of resistors, capacitors, inductors, noise filters, varistors, and suppressors.

The two or more functional units each include a plurality of sheets and a conductive layer selectively formed on the plurality of sheets.

Sheets of each of the two or more functional parts have different colors or contrasts.

At least one of the sheets of the same functional part has a different color or contrast.

Sheets of each of the two or more functional parts are added with pigments of different colors.

The sheets of each of the two or more functional parts are added with pigments of the same color in different amounts.

The conductive layer is formed of a conductive material or at least one portion thereof is formed of a mixture of the conductive material and the same material as the sheet.

The two or more functional parts are manufactured and sintered in different processes and then joined by the coupling parts.

The bonding portion comprises at least one of glass, polymer and oligomer.

The external electrode is different from the region in which the thickness of at least one region is different.

An electronic device according to another aspect of the present invention includes a conductor to which a user can contact and an internal circuit, and a composite device according to an aspect of the present invention is provided between the conductor and the internal circuit.

Further comprising at least one conductive member provided between the conductor and the composite element, the composite element is connected to the ground terminal or through the passive element is connected to the ground terminal.

The composite element includes a capacitor portion and an overvoltage protection portion, and the capacitor portion is mounted adjacent to the internal circuit.

In the composite device according to the embodiments of the present invention, two or more functional units having different functions are stacked, and two or more functional units may be combined by a coupling unit. By combining the different functional units using the coupling unit as described above, it is possible to prevent distortion, peeling, cracking, etc. due to the shrinkage difference of the composite device.

In addition, since two or more functional units are manufactured and sintered in the respective processes and then joined by the coupling units, interdiffusion of the materials constituting each functional unit can be prevented, thereby preventing the functional deterioration of each functional unit.

In addition, one of the functional units may include an overvoltage protection unit to protect the electronic device on which the composite device is mounted from overvoltage such as ESD. In this case, since the overvoltage protection unit is formed in a varistor or suppressor type, it is possible to implement various breakdown voltages or discharge start voltages from 310V to several tens of kV.

Meanwhile, the two or more functional units may have different colors or contrasts to distinguish colors to determine the direction of the composite device. For example, the lower functional part may have a lighter color than the upper functional part. Therefore, by allowing two or more functional units to have different colors or contrasts, the present invention can realize a composite device to which directionality is imparted without applying a phosphor or the like.

1 is a perspective view of a composite device according to embodiments of the present invention.

2 is a cross-sectional view of a composite device according to a first embodiment of the present invention.

3 is a schematic view of at least a portion of the surface of a composite device according to a first embodiment of the present invention;

4 is a cross-sectional view of a composite device according to a second exemplary embodiment of the present invention.

5 is a cross-sectional view of a composite device according to a third embodiment of the present invention.

6 is a sectional view of a composite device according to a fourth embodiment of the present invention.

7 is a cross-sectional view of a composite device according to a fifth embodiment of the present invention.

8 and 9 are block diagrams illustrating an arrangement form of a composite device according to example embodiments.

10 and 11 are schematic diagrams illustrating a frequency path according to a position of a capacitor part of a composite device according to embodiments of the present disclosure.

12 to 14 are graphs showing the insertion loss according to the position of the capacitor portion of the composite device according to the embodiments of the present invention.

15 and 16 are schematic views of tapes and wheels for receiving composite devices in accordance with embodiments of the present invention.

Figure 17 is a block diagram of a packaging device for determining and packaging the orientation of the composite device according to embodiments of the present invention.

18 and 19 are schematic views of a packaging device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 is a perspective view of a composite device according to embodiments of the present invention. 2 is a cross-sectional view taken along line AA ′ of FIG. 1 as a cross-sectional view of a composite device according to a first exemplary embodiment of the present invention, and FIG. 3 is a schematic view of at least part of the surface thereof.

1 to 3, a composite device according to a first embodiment of the present invention is provided with a laminate 1000 including a plurality of stacked sheets 100, and a different function provided in the laminate 1000. It may include at least two or more functional units. That is, it may include a first functional unit including at least one of a resistor, a noise filter, an inductor, a capacitor, and the like, and a second functional unit including an overvoltage protection unit such as a varistor or a suppressor to protect the overvoltage. In other words, the composite device of the present invention may include at least one first functional part functioning as a passive element, and at least one second functional part functioning as an overvoltage protection element. For example, the composite device according to the first embodiment of the present invention may include a laminate 1000 including a plurality of sheets 100, at least one capacitor unit 2000 provided in the laminate 1000, and at least One over-voltage protection unit 3000, that is, may include a varistor. In addition, a coupling portion 4000 provided between the capacitor portion 2000 and the overvoltage protection portion 3000 and coupled thereto, and

external electrodes

5100, 5200; 5000 provided on two side surfaces facing each other outside the stack 1000. It may further include, and may further include a surface modification member 6000 formed on at least one surface of the laminate (5000). Here, two or more functional layers having different functions, for example, the capacitor part 2000 and the overvoltage protection part 3000 may be joined by the coupling part 4000 after being sintered, respectively. That is, one surface of the capacitor unit 2000 and one surface of the overvoltage protection unit 3000 may be coupled by the coupling unit 4000. In addition, the capacitor unit 2000 includes a plurality of sheets having a predetermined dielectric constant, and the overvoltage protection unit 3000 includes a varistor portion, and a plurality of sheets having varistor characteristics are stacked. That is, the overvoltage protection unit 3000 may be formed of a varistor type. Of course, the overvoltage protection unit 3000 may be made of a suppressor type including an overvoltage protection member. In the first embodiment of the present invention, the varistor type overvoltage protection unit 3000 will be described as an example. In addition, in the present invention, at least a part of the laminate 1000 has a different color or contrast. For example, the capacitor unit 2000 and the overvoltage protection unit 3000 may have different colors or contrasts, and the upper and lower surfaces of the stack 1000 may have different colors or contrasts. Meanwhile, the plurality of sheets constituting the capacitor unit 2000 are called dielectric sheets 110 (101 to 107), and the plurality of sheets constituting the overvoltage protection unit 3000 are called discharge sheets 120 (121 to 127), The entire sheet including the sheet 110 and the discharge sheet 120 is called a sheet 100. The conductive layers of the capacitor part 2000 are referred to as internal electrodes 210 to 270, and the conductive layers of the overvoltage protection part 3000 are called

discharge electrodes

311 and 312. On the other hand, the voltage at which the varistor type overvoltage protection unit 3000 starts to be discharged is called the breakdown voltage, and the voltage at which the suppressor type overvoltage protection unit 3000 is discharged is called the discharge start voltage.

The configuration of the composite device according to the first exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 as follows.

1. 적층체1. Laminate

The stack 1000 is formed by stacking a plurality of sheets 100, that is, a plurality of dielectric sheets 110 (101 to 107) and a plurality of discharge sheets 120 (121 to 127). That is, the coupling part 4000 includes a first stack in which the plurality of dielectric sheets 110 having the internal electrodes 200 are stacked, and a second stack in which the plurality of discharge sheets 120 having the discharge electrodes 310 are stacked. The laminated body 1000 is made by combining. The laminate 1000 has a predetermined length in one direction (for example, the X direction) and another direction (for example, the Y direction) orthogonal thereto, and has a predetermined height in the vertical direction (for example, the Z direction). It may be provided in a substantially hexahedral shape having a. In this case, when the forming direction of the external electrode 5000 is referred to as the X direction, the direction perpendicular to the horizontal direction may be referred to as the Y direction, and the vertical direction may be referred to as the Z direction. Here, the length of the X direction is longer than the length of the Y direction and the length of the Z direction, the length of the Y direction may be equal to or different from the length of the Z direction. However, the lengths of the X, Y, and Z directions may be variously modified according to the internal structure of the electronic device to which the composite device is connected, the internal structure and shape of the composite device, and the like. In addition, at least one overvoltage protection unit 3000, such as at least one capacitor unit 2000 and a varistor unit, may be provided in the stack 1000. For example, the capacitor part 2000 and the overvoltage protection part 3000 may be provided in the stacking direction of the sheets, that is, the Z direction.

In addition, the plurality of sheets, that is, the dielectric sheet 110 and the discharge sheet 120 may all be formed with the same thickness, and at least one may be formed thicker or thinner than the others. For example, the discharge sheet 120 of the overvoltage protection unit 3000 may be formed to have a thickness different from that of the dielectric sheet 110 of the capacitor unit 2000, and the discharge sheet 120 may be thicker than the dielectric sheet 110. Can be formed. That is, the thickness of each of the discharge sheets 120 may be thicker than the thickness of each of the dielectric sheets 110. However, the thickness of each of the discharge sheets 120 may be thinner or the same as the thickness of each of the dielectric sheets 110. In addition, at least one of the discharge sheets 120 may be thicker than the thickness of the other discharge sheet 120, and at least one of the dielectric sheets 110 may be thicker than the other dielectric sheets 110. In this case, the dielectric sheet 110 thicker than the other dielectric sheet 110 may be thicker than the thinner discharge sheet 120. That is, at least one of the plurality of dielectric sheets 110 and the plurality of discharge sheets 120 may be formed to have a thickness different from that of the other sheets 100. Meanwhile, the plurality of sheets 100, that is, each of the dielectric sheets 110 and the discharge sheets 120 may be formed to have a thickness that does not break when an overvoltage such as ESD is applied, for example, a thickness of 5 μm to 300 μm. . The thickness of the discharge sheet 120 is proportional to the breakdown voltage, and at least a part of the composite element must have a breakdown voltage of 310V or more to function as an electric shock prevention element. That is, you must cut off the voltage below 310V and bypass the voltage above 310V. To this end, the discharge sheet 120 may have a thickness of about 50 μm to about 250 μm in the overvoltage protection part 3000, which is about 1/2 the thickness of the composite device. That is, if the discharge sheet 120 of the overvoltage protection unit 3000 that protects the ESD is too thick, the bypassable voltage is increased, and if the discharge sheet 120 is too low, the breakdown voltage is lowered to 310V or less to protect the user from electric shock. You will not be able to. Therefore, the discharge sheet 120 may be formed to a thickness that may have a breakdown voltage of 310V or higher. In addition, the thickness of the dielectric sheet 110 is proportional to the capacitance of the composite device, and 150 pF or less is suitable to function as an electric shock protection device. In order to implement such capacitance, the thickness of the dielectric sheet 110 should have a dielectric constant of 10 to 3000. For this purpose, the thickness of the dielectric sheet 110 may be about 10 μm to 200 μm. The greater the thickness of the dielectric sheet 110, the higher the capacitance can be realized, and the thinner the dielectric sheet 110 may be destroyed by the overvoltage. Accordingly, the dielectric sheet 110 can be formed to a thickness having a capacitance appropriate for the function without being destroyed by overvoltage.

In addition, the capacitor part 2000 and the overvoltage protection part 3000 may have the same thickness or may have different thicknesses. That is, the first laminate in which the plurality of dielectric sheets 110 constituting the capacitor unit 2000 and the second laminate in which the plurality of discharge sheets 120 constituting the overvoltage protection unit 3000 are stacked are the same thickness. It may be formed, or may be formed in a different thickness. For example, the thickness of the overvoltage protection unit 3000 may be equal to or thicker than the thickness of the capacitor unit 2000. The overvoltage protection unit 3000 may be one to two times thicker than the capacitor unit 2000. That is, when the thickness of the capacitor unit 2000 is 100, the overvoltage protection unit 3000 may be formed to a thickness of 100 to 200. In addition, the number of stacked layers of the dielectric sheet 110 of the capacitor unit 2000 and the number of stacked sheets of the discharge sheet 120 of the overvoltage protection unit 3000 may be different or may be the same. For example, the number of stacked sheets of the discharge sheet 120 may be less than the number of stacked sheets of the dielectric sheet 110. As a specific example, the thickness of each of the discharge sheets 120 is thicker than the thickness of each of the dielectric sheets 110, and the discharge sheets 120 are stacked in the same or different numbers as the dielectric sheets 110 so that the discharge sheets 120 are stacked. The second stack may be equal to or thicker than the thickness of the first stack on which the dielectric sheet 110 is laminated. In addition, the thickness of each of the dielectric sheets 110 is greater than that of each of the discharge sheets 120, and the first and the dielectric sheets 110 are stacked by stacking the dielectric sheets 110 in the same or different number as the discharge sheets 120. The laminate may be equal to or thicker than the thickness of the second laminate on which the discharge sheet 120 is laminated. However, the thickness of each of the dielectric sheets 110 and the thickness of each of the discharge sheets 120 are the same, and the number of stacks of the dielectric sheets 110 and the number of stacks of the discharge sheets 120 are the same or different, so that the first stack and the second stack are different. The thickness of the sieves may be the same or different. For example, the capacitor part 2000 and the overvoltage protection part 3000 may each have a thickness of 0.1 mm to 0.4 mm.

In addition, any one of the capacitor part 2000 and the overvoltage protection part 3000 may protrude outward from the other of the laminate 1000. That is, any one of the capacitor unit 2000 and the overvoltage protection unit 3000 may protrude in at least one of the X direction and the Y direction. Therefore, the capacitor part 2000 and the overvoltage protection part 3000 may have a step without forming side surfaces in a horizontal direction. For example, the capacitor part 2000 may protrude outside about 1 μm to 100 μm relative to the overvoltage protection part 3000. Of course, the overvoltage protection unit 3000 may protrude outward from the capacitor unit 2000 by about 1 μm to 100 μm. In this case, the capacitor part 2000 and the overvoltage protection part 3000 may be formed in the same size in the X direction and the Y direction, and accordingly, a step may be formed on one side and the other side opposite thereto. For example, when the capacitor unit 2000 protrudes from one side of the X direction, the overvoltage protection unit 3000 may protrude from the other side of the X direction opposite thereto. In addition, any one of the capacitor unit 2000 and the overvoltage protection unit 3000 may have a different size in one of the X direction and the Y direction than the other. For example, any one of the capacitor unit 2000 and the overvoltage protection unit 3000 may be formed to be large in either of the X direction and the Y direction so that at least one of the side surfaces of the stack 1000 may have a step. Can be. For example, the capacitor part 2000 may be formed to be about 1 μm to about 100 μm larger than the overvoltage protection part 3000, and the overvoltage protection part 3000 may be about 1 μm to about 100 μm compared to the capacitor part 2000. It may be formed to be large in size. In addition, one of the capacitor unit 2000 and the overvoltage protection unit 3000 may be formed thicker than the other. For example, the capacitor part 2000 may be formed to be about 1 μm to 100 μm thicker than the overvoltage protection part 3000, and the overvoltage protection part 3000 may be about 1 μm to 100 μm compared to the capacitor part 2000. It may be formed to a thickness of about μm thick.

Meanwhile, the laminate 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) respectively provided on the lower surface and the upper surface. That is, the stack 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided at the lower portion of the capacitor unit 2000 and the upper portion of the overvoltage protection unit 3000, respectively. Of course, the lowermost sheet of the laminate 1000 may function as the lower cover layer and the uppermost sheet may function as the upper cover layer. That is, the lowermost dielectric sheet of the capacitor unit 2000, that is, the first dielectric sheet 101 may function as a lower cover layer, and the uppermost discharge sheet of the overvoltage protection unit 3000, that is, the seventh discharge sheet 207. ) May serve as the top cover layer. The lower and upper cover layers, which are separately provided, may be formed to have the same thickness, and a plurality of magnetic sheets may be stacked. However, the lower and upper cover layers may be formed in other thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, a nonmagnetic sheet, for example, a glass sheet, may be further formed on the outermost portion of the lower and upper cover layers formed of the magnetic sheet, that is, the lower and upper surfaces. In addition, the lower and upper cover layers may be thicker than the insulating sheets therein. Therefore, when the lowermost and uppermost insulating sheets function as lower and upper cover layers, they may be formed thicker than each of the insulating sheets therebetween. Meanwhile, when the lower cover layer and the upper cover layer are formed, the lower cover layer and the upper cover layer may have different colors or contrasts. For example, the color or contrast of the lower cover layer may be lighter than the color or contrast of the upper cover layer. In addition, when the lower cover layer and the upper cover layer have different colors or contrasts, the capacitor unit 2000 and the overvoltage protection unit 3000 may have the same color or contrast. That is, the present invention may be different in color or contrast of the lower side and the upper side in order to distinguish the upper and lower, when the lower and the upper cover layer has a different color or contrast, the capacitor portion 2000 and the overvoltage protection portion 3000 of the inner It may have the same color or contrast. Of course, the capacitor unit 2000 may have the same color or contrast as the lower cover layer, and the overvoltage protection unit 3000 may have the same color or contrast as the upper cover layer. In addition, even when the lower and upper cover layers are not provided separately, the lower surface of the capacitor unit 2000 and the upper surface of the overvoltage protection unit 3000 may have different colors or contrasts, and the inner side may have the same color or contrast. Can have

Meanwhile, the surface modification member may not be formed on at least a portion of the surface of the laminate 1000, and the lower and upper cover layers may be formed of a glass sheet, and the surface of the laminate 1000 may be coated with a polymer or glass material. . In the overvoltage protection unit 3000 formed of the varistor material, when the plating layer is formed on the surface of the external electrode 5000 by a plating process, a plating layer (ie, plating bleeding) may be formed on the varistor surface. That is, when the plating layer is formed on the surface area of the four varistors that are not desired, the bypass characteristic may be lowered when an overvoltage such as ESD is applied, or the insulation characteristic may be lowered below the breakdown voltage. That is, the overvoltage protection unit 3000 must bypass the overvoltage by functioning as a conductor above the breakdown voltage, but may also function as a conductor below the breakdown voltage when the plating layer is formed on the surface. Therefore, the plating layer should not be formed on the surface of the overvoltage protection unit 3000. For this purpose, an insulating material should be coated on the surface of the overvoltage protection unit 3000 before the coupling process after completing the overvoltage protection unit 3000. That is, an insulating material such as parylene, glass, epoxy, and polymer is coated on the surface of the overvoltage protection unit 3000 to increase the surface resistance to prevent the plating layer from being formed. For example, the insulating material may be liquefied or vaporized in various ways and then formed on the surface by deposition or deposition, and the surface may be insulated by repeating drying, curing or firing. On the other hand, since the capacitor part 2000 is an insulator due to the material property, a plating layer is less formed on the surface when the external electrode 5000 is formed. However, the capacitor part 2000 is the same as the capacitor part 2000 in order to strengthen the adhesion force when the overvoltage protection part 3000 is combined. It may also be coated with a substance. Of course, after the capacitor part 2000 and the overvoltage protection part 3000 are combined to simplify the process, a coating layer may be formed on the surface of the laminate 1000 using an insulating material.

2. 캐패시터부2. Capacitor

The capacitor part 2000 may be provided below or over the overvoltage protection part 3000. However, it is preferable that the capacitor part 2000 faces the PCB based on the PCB of the electronic device in which the composite device is mounted. That is, it is preferable that the capacitor part 2000 is provided below. By doing so, the frequency moving path to the PCB can be shortened through the capacitor unit 2000, thereby reducing parasitic inductance in high frequency communication, thereby preventing an increase in insertion loss in high frequency communication, and bandwidth of a frequency. This can be prevented from narrowing. The capacitor part 2000 may include at least two internal electrodes 200 and at least two dielectric sheets 110 provided therebetween. For example, as shown in FIG. 2, the capacitor part 2000 may include first to seventh dielectric sheets 101 to 107; 110 and first to seventh internal electrodes 210 to 270; 200. have. Meanwhile, in the present exemplary embodiment, the capacitor part 2000 has a plurality of internal electrodes 200 formed therein, and for this purpose, the dielectric sheet 110 is formed with one more than the number of the internal electrodes 200, but the capacitor part 2000 Two or more internal electrodes 200 may be formed and three or more dielectric sheets 110 may be provided. In addition, the capacitor unit 2000 may have a color or contrast different from that of the overvoltage protection unit 3000. For example, the capacitor unit 2000 may have a lighter color than the overvoltage protection unit 3000. To this end, the capacitor part 2000 may form the dielectric sheets 101 to 107 and 110 by adding a bright pigment. For example, color pigments may be added to the dielectric material when forming the dielectric sheet 110. Color pigments may include white pigments, transparent pigments, purple pigments, and the like. That is, a pigment of brighter color than the pigment added to the overvoltage protection unit 3000 may be added to the capacitor unit 2000. The white pigment may include ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and the like, the transparent pigment may include CaCO ₃ , and the like, and the purple pigment may include Fe ₂ O _3, or the like. Therefore, the dielectric sheet 110 may have a color such as white, purple, or the like, depending on the added pigment, and thus the capacitor part 2000 may have a color such as white, purple, or the like. Of course, the capacitor unit 2000 may be added to the pigment added to the overvoltage protection unit 3000, in this case, less than the amount added to the overvoltage protection unit 3000 is added to the capacitor unit 2000 overvoltage protection unit ( 3000). Meanwhile, at least one of the dielectric sheets 110 may have a different color or brightness than the other dielectric sheets 110. That is, the amount of pigment added to at least one of the plurality of dielectric sheets 110 may be different, so that the color or brightness of the at least one dielectric sheet 110 may be different. However, even in this case, the dielectric sheet 110 may have a brighter color or brightness than the discharge sheet 120.

The dielectric sheets 101-107; 110 may be formed of a dielectric material. As the dielectric material, for example, a high dielectric material having a dielectric constant of about 5 to 20,000 may be used, and MLCC, LTCC, HTCC, and the like may be used. The MLCC dielectric material includes at least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO based on at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO _2. It may include a glass material. In addition, the dielectric sheet 110 may be formed of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, and Al ₂ O ₃ in addition to MLCC, LTCC, and HTCC. It may be formed of a material comprising one or more. For example, the dielectric sheet 110 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and adjust the content of these materials. By controlling the dielectric constant. Therefore, the dielectric sheet 110 may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 4000, and more preferably 100 to 3000, depending on the material. For example, the dielectric sheet 110 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , increasing the content of BaTiO ₃ . By increasing the dielectric constant, it is possible to increase the content of NdTiO ₃ and SiO ₂ to lower the dielectric constant. Among the materials used for the dielectric sheet 110, ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ may be white pigment materials. Therefore, at least one of ZnO, TiO ₂ , SiO ₂ , and Al ₂ O ₃ may be included to color the dielectric sheet 110 while controlling the dielectric constant of the dielectric sheet 110. The pigment material may be contained in an amount of 0.1 wt% to 10 wt% with respect to 100 wt% of the mixed material of the dielectric material and the pigment material. Meanwhile, the dielectric sheet 110 may be formed by mixing a dielectric material and an overvoltage protection material such as a varistor material. That is, the dielectric sheet 110 is mainly made of a dielectric material and may include some varistor material. The overvoltage protection material may include a material constituting the overvoltage protection unit 3000 to be described later, for example, a material constituting a discharge sheet of the overvoltage protection unit 3000. Such an overvoltage protection material may use a varistor material, which may be ZnO, Bi ₂ O ₃ , Pr ₆ O ₁₁ , Co ₃ O ₄ , Mn ₃ O ₄ , CaCO ₃ , Cr ₂ O ₃ , SiO ₂ , Al It may include at least one of ₂ O ₃ , Sb ₂ O ₃ , SiC, Y ₂ O ₃ , NiO, SnO ₂ , CuO, TiO ₂ , MgO, AgO. For example, the varistor material contained in the capacitor part 2000 may be ZnO. At this time, the size of the ZnO particles may be 1㎛ or less based on the average particle size distribution (D50). Meanwhile, the amount of varistor material contained in the capacitor part 2000 may be 0.2 wt% to 10 wt%. That is, the dielectric sheet 110 of the capacitor part 2000 may be formed by containing about 0.2 wt% to 10 wt% of the varistor material with respect to 100 wt% of the mixed material of the dielectric material and the varistor material. Preferably, the varistor material may contain 2 wt% to 5 wt% with respect to 100 wt% of the mixture of the capacitor material and the varistor material. In this case, when the overvoltage protection material, that is, the varistor material is contained in excess of 10wt%, the capacitance of the capacitor part 2000 may be reduced or at least a part of the discharge voltage may flow through the capacitor part 2000.

The plurality of internal electrodes 210 to 270; 200 may be formed of a conductive material, for example, a metal or a metal alloy including at least one of Ag, Au, Pt, Pd, Ni, and Cu. have. In the case of an alloy, for example, Ag and Pd alloys may be used. In addition, the internal electrode 200 may further include a dielectric sheet 110 material. That is, the internal electrode 200 may include at least one of a conductive material such as a metal or a metal alloy, for example, BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , or B ₂ O ₃ . It may include one dielectric material. In this case, the dielectric material content of the internal electrode 200 may be 20 wt% or less. That is, the dielectric material may contain 1 wt% to 20 wt% with respect to 100 wt% of the mixture of the conductive material and the dielectric material. As the dielectric material is contained in the internal electrode 200, the adhesion between the internal electrode 200 and the dielectric sheet 110 may be improved to prevent micro-delamination due to the difference in shrinkage between the internal electrode 200 and the dielectric sheet 110. As a result, a decrease in capacitance can be prevented. In this case, when the content of the dielectric material in the internal electrode 200 is less than 1 wt%, the adhesion between the internal electrode 200 and the dielectric sheet 110 may not be improved, and when the content exceeds 20 wt%, the electrical conductivity of the internal electrode 200 may be reduced. Can be. On the other hand, the internal electrode 200 can be formed to a thickness of, for example, 1㎛ 10㎛. Here, the internal electrode 200 is formed so that one side is connected to the

external electrodes

5100, 5200; 5000 formed to face each other in the X direction, and the other side is spaced apart from each other. That is, the first, third, and fifth

internal electrodes

210, 230, and 250 are formed on the first, third, and fifth dielectric sheets 101, 103, 105, respectively, with predetermined areas, and one side thereof has a first area. It is connected to the external electrode 5100 and the other side is formed to be spaced apart from the second external electrode 5200. In addition, the second, fourth, and sixth

internal electrodes

220, 240, and 260 are formed on the second, fourth, and sixth dielectric sheets 102, 104, and 106 in a predetermined area, and one side thereof is the second external electrode. It is connected to the 5200 and the other side is formed to be spaced apart from the first external electrode 5100. That is, the internal electrodes 200 are alternately connected to any one of the external electrodes 5000 and are formed to overlap a predetermined region with the dielectric sheet 110 interposed therebetween. In this case, the internal electrodes 200 are formed in areas of 10% to 85% of the area of each of the dielectric sheets 110. In addition, two adjacent inner electrodes, for example, the first and second

inner electrodes

210 and 220 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. Meanwhile, the internal electrode 200 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and spacing, and the like. The capacitor part 2000 has capacitances formed between the internal electrodes 200, and the capacitance may be adjusted according to the overlapping area of the adjacent internal electrodes 200, the thickness of the dielectric sheets 110, and the like. The capacitor part 2000 may have, for example, a capacitance of 20 μF or more.

3. 과전압 보호부3. Overvoltage Protection

The overvoltage protection unit 3000 may be provided above the capacitor unit 2000. The overvoltage protection unit 3000 may include a plurality of discharge sheets 120 and at least two

discharge electrodes

311, 312; 310. For example, the overvoltage protection unit 3000 may include the first to seventh discharge sheets 121 to 127 and 120 and the second to sixth discharge sheets 122 to 126 as shown in FIG. 2. The first and

second discharge electrodes

311, 312; 310 may be formed. In the present embodiment, the overvoltage protection unit 3000 illustrates and describes a case in which seven discharge sheets 110 and two discharge electrodes 310 are provided. However, the discharge sheet 120 and the discharge electrodes 310 may be described. It can be provided in various numbers. On the other hand, the breakdown voltage or the discharge start voltage for starting the discharge of the overvoltage protection unit 3000 may be determined according to the material of the discharge sheet 120, the distance between the discharge electrodes 310, and the like. In addition, the overvoltage protection unit 3000 may have a color or contrast different from that of the capacitor unit 3000, and may have a color darker than that of the capacitor unit 2000, for example. To this end, the overvoltage protection unit 3000 may form the discharge sheets 121 to 127 and 120 by adding a pigment of dark color. For example, color pigments may be added to the varistor material when forming the discharge sheet 120. The color pigments may include black pigments, dark green pigments, and the like. That is, a pigment of darker color than the pigment added to the capacitor unit 2000 may be added to the overvoltage protection unit 3000. The black pigment may include Co 3 O 4, CoO, and the like, and the dark green pigment may include MnO 4, and the like. Therefore, the discharge sheet 120 may have a color such as black, dark green, etc. according to the added pigment, and thus the overvoltage protection unit 3000 may have a color such as black, dark green, or the like. Of course, the overvoltage protection unit 3000 may include a pigment added to the capacitor unit 2000. In this case, more than the amount added to the capacitor unit 2000, the overvoltage protection unit 3000 is added to the capacitor unit 2000. Can be darker than). On the other hand, at least one of the discharge sheet 120 may have a different color or brightness than the other discharge sheet 120. That is, the amount of pigment added to at least one of the plurality of discharge sheets 120 may be different, and thus the color or brightness of the at least one discharge sheet 120 may be different. However, even in this case, the discharge sheet 120 may have a darker color or brightness than the dielectric sheet 110.

The discharge sheets 121 to 127 and 120 may be formed of a varistor material. On the other hand, the varistor material is ZnO, Bi ₂ O ₃ , Pr ₆ O ₁₁ , Co ₃ O ₄ , Mn ₃ O ₄ , CaCO ₃ , Cr ₂ O ₃ , SiO ₂ , Al ₂ O ₃ , Sb ₂ O ₃ , SiC, It may include at least one of Y ₂ O ₃ , NiO, SnO ₂ , CuO, TiO ₂ , MgO, AgO. For example, a material in which at least one of the materials is mixed with ZnO as a main component may be used as a varistor material. Of course, the varistor material may use Pr-based, Bi-based, or SiC-based materials in addition to the above materials. Among the materials used for the discharge sheet 120, Co ₃ O ₄ may be a black pigment material. Therefore, the discharge sheet 120 may be formed including Co ₃ O ₄ , and color may be applied to the discharge sheet 120. The pigment material may be contained in an amount of 0.1 wt% to 10 wt% with respect to 100 wt% of the mixed material of the varistor material and the pigment material. In addition, the discharge sheet 120 may be formed of a material in which a varistor material and a dielectric material are mixed. That is, the discharge sheet 120 may be formed by mixing a material having a varistor characteristic and a material forming the capacitor part 2000, that is, a dielectric material. The discharge sheets 120 are mainly made of a varistor material, and some capacitor materials may be formed. May be included. The dielectric material mixed with the varistor material may include a main material of the dielectric sheet 110 of the capacitor unit 2000. That is, dielectrics such as MLCC, LTCC, HTCC having a dielectric constant of about 5 to 20,000 may be mixed with the varistor material. For example, a material comprising at least one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, Al ₂ O ₃ may be added to the varistor material. Can be mixed. For example, the capacitor material, that is, the dielectric material contained in the overvoltage protection part 3000 may be at least one of BaTiO ₃ and NdTiO ₃ . On the other hand, the amount of the capacitor material, that is, the dielectric material contained in the overvoltage protection unit 3000 may be 0.2wt% to 10wt%. That is, the dielectric sheet material may contain 0.2 wt% to 10 wt% with respect to 100 wt% of the mixed sheet of the discharge sheet material and the dielectric sheet material. Preferably, the dielectric sheet material may contain 2 wt% to 5 wt% with respect to 100 wt% of the mixture of the discharge sheet material and the dielectric sheet material. In this case, when the capacitor material, that is, the dielectric sheet material is contained in excess of 10wt%, the characteristics of the overvoltage protection unit 3000 may be reduced. That is, the breakdown voltage is changed or becomes a complete non-conductor to discharge the overvoltage can lose the function as the overvoltage protection unit 3000.

The first and

second discharge electrodes

311, 312; 310 may be formed of a conductive material, for example, a metal or a metal alloy including at least one of Ag, Au, Pt, Pd, Ni, and Cu. Can be formed. In the case of an alloy, for example, Ag and Pd alloys may be used. In this case, the discharge electrode 310 may be formed of the same material as the internal electrodes 220 of the capacitor unit 2000. In addition, the discharge electrode 310 may be formed by further including a varistor material. That is, the discharge electrode 310 is formed of a conductive material such as a metal or a metal alloy and at least one of ZnO, Bi ₂ O ₃ , Co ₂ O ₄ , MnO ₄ , Pr ₆ O ₁₁ , Al ₂ O ₃ , and CaO. It may comprise a varistor material. At this time, the varistor material content in the discharge electrode 310 may be 20wt% or less. That is, the varistor material may contain 1 wt% to 20 wt% with respect to 100 wt% of the mixture of the conductive material and the varistor material. The varistor material is contained in the discharge electrode 310 to improve the adhesion between the discharge electrode 310 and the discharge sheet 120, thereby preventing micro-delamination due to the difference in shrinkage between the discharge electrode 310 and the discharge sheet 120. As a result, the degradation of ESD resistance can be prevented. At this time, if the content of the varistor material in the discharge electrode 310 is less than 1wt%, the adhesion between the discharge electrode 310 and the discharge sheet 120 may not be improved, and if the content exceeds 20wt%, the electrical conductivity of the discharge electrode 310 may be reduced. Can be. On the other hand, the discharge electrode 310 can be formed, for example in thickness of 1 micrometer-10 micrometers. That is, the discharge electrode 310 may be formed to have the same thickness as each of the internal electrodes 200. However, the discharge electrode 310 may be formed thinner or thicker than each of the internal electrodes 200. For example, the discharge electrode 310 may be formed to have a thickness of 10% to 90% than that of each of the internal electrodes 200. For example, the discharge electrode 310 may be formed to a thickness of 1㎛ 5㎛, each internal electrode 200 may be formed to a thickness of 2㎛ 10㎛. On the other hand, since the varistor type overvoltage protection unit 3000 bypasses the overvoltage in an energy conduction method, the load on the

discharge electrodes

311 and 312 is small. That is, when the overvoltage protection unit 3000 is formed as a suppressor type, since the overvoltage is bypassed to the suppressor type, the load on the discharge electrode 310 is greater, but in the case of the varistor type, the discharge electrode 310 is larger than the suppressor type. The load on is small. Therefore, when the overvoltage protection unit 3000 is formed in the varistor type, the thickness of the discharge electrode 310 formed of the noble metal can be reduced, thereby reducing the manufacturing cost. The discharge electrode 310 may be alternately connected to the external electrode 5000. That is, the first discharge electrode 311 is connected to the first external electrode 5100 and formed on the first discharge sheet 121, and the second discharge electrode 312 is connected to the second external electrode 5200. It is formed on the sixth discharge sheet 126. That is, the first and

second discharge electrodes

311 and 312 are alternately connected to any one of the external electrodes 5000 and are formed to overlap a predetermined area with the second to sixth discharge sheets 122 to 126 interposed therebetween. . In this case, the first and

second discharge electrodes

311 and 312 are respectively formed with an area of 10% to 85% of the area of each of the discharge sheets 120. In addition, the first and

second discharge electrodes

311 and 312 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. Meanwhile, the length of the discharge electrode 310 may be equal to or smaller than the length of the internal electrode 200, and the width of the discharge electrode 310 may be equal to or smaller than the width of the internal electrode 200. Therefore, the discharge electrode 310 may be formed to have the same or smaller area than the internal electrode 200.

The varistor type overvoltage protection unit 3000 may implement a breakdown voltage of, for example, 310V to 2kV. The varistor type overvoltage protection unit 3000 can protect electronic devices and the like from voltages lower than the suppressor type. That is, when the overvoltage protection unit 3000 is implemented as a suppressor type, since the discharge start voltage is 2 kV or more, the discharge may not be bypassed to the over voltage of 2 kV or less, and the disconnection state may be maintained to other adjacent parts or signal lines inside the electronic device. Can cause damage to other components or cause abnormal operation. However, by implementing the overvoltage protection unit 3000 as a varistor type, it is possible to bypass the overvoltage higher than the breakdown voltage to prevent damage to the peripheral circuit. That is, since the varistor type overvoltage protection unit 3000 has a breakdown voltage of 310V to 2kV, the varistor type overvoltage protection unit 3000 may protect the internal circuit of the electronic device from an overvoltage lower than the suppressor type.

On the other hand, the overvoltage protection unit 3000 has a predetermined capacitance, which is smaller than the capacitance of the capacitor unit 2000. That is, since the capacitance of the capacitor unit 2000 is larger than the capacitance of the overvoltage protection unit 3000, the total capacitance of the composite device may be increased. In this case, the capacitance of the capacitor unit 2000 may be 1 to 500 times larger than the capacitance of the overvoltage protection unit 3000.

In addition, the breakdown voltage of the overvoltage protection unit 3000 may be 310V or more, and may be lower than the dielectric breakdown voltage of the capacitor 2000. That is, the breakdown voltage of the overvoltage protection unit 3000 may be 310V or more and less than the dielectric breakdown voltage of the capacitor 2000. Since the breakdown voltage is lower than the dielectric breakdown voltage, the overvoltage may be discharged before the capacitor unit 2000 is dielectric breakdown. In addition, an interval between the internal electrodes 200 of the capacitor unit 2000 may be smaller than an interval between the discharge electrodes 310 of the overvoltage protection unit 3000. In addition, the overlapping area of the discharge electrode 310 of the overvoltage protection unit 3000 may be smaller than the overlapping area of the internal electrode 200 of the capacitor unit 2000.

4. 결합부4. Coupling part

The coupling part 4000 may be provided between the capacitor part 2000 and the overvoltage protection part 3000 in the stack 1000. Here, the capacitor unit 2000 and the overvoltage protection unit 3000 may be manufactured by different processes and then coupled by the coupling unit 4000. The coupling part 4000 may include a material capable of bonding and bonding the first stack formed of the capacitor part 2000 and the second stack formed of the overvoltage protection part 3000. To this end, the coupling portion 4000 may use a material having an adhesive force, and a material capable of forming an adhesive force through drying, curing, and firing may be used. The coupling part 4000 may be formed of, for example, a glass paste, a polymer paste, an oligomer paste, or the like. That is, the paste may include glass-containing paste, polymer-containing paste, epoxy-containing paste, oligomer-containing paste, and the like. The glass paste may include at least one of SiO ₂ , BiO ₂ , B ₂ iO ₃ , B ₂ O ₃ , BaO, Al ₂ O ₃ , Na ₂ O ₃ , K ₂ O ₃ , ZrO ₂ , and the polymer paste may Si resins and synthetic resins may be included. In addition, the oligomer paste may include an epoxy resin, and the epoxy resin may include novolac-based, bisphenol-based, amine-based, cycloalipatic-based, and bromine-based epoxy resins. can do. The polymer paste and the epoxy resin may form an adhesive force through drying and curing. For example, the polymer paste and the epoxy resin may be dried at a temperature of 20 ° C. to 150 ° C. for at least 5 minutes and at least 5 minutes at a temperature of 20 ° C. to 300 ° C. In addition, a curing agent may be further used to maximize the adhesive strength and shorten the drying and curing time. The glass paste may contain 20 wt% to 90 wt% of a glass material, and may contain a binder, a solvent, and the like. That is, the glass material may contain 20 wt% to 90 wt% with respect to 100 wt% of the glass paste, and the remainder may be a binder and a solvent. Here, the EC-based, acrylic binder is used as the binder, the solvent may be BCA, Terpinol (Terpinol) system and the like. In addition, a glass paste can be mixed and used with at least any one of a polymer paste and an oligomer paste. Epoxy resins can be mixed in a proportion to complement the advantages and disadvantages of each system. That is, two or more series can also be mixed and used as an epoxy resin.

The coupling part 4000 may be formed to a thickness of about 1 μm to about 100 μm. When the coupling portion 4000 is formed to a thickness of less than 1 μm, the coupling force may be reduced, and when the coupling portion 4000 is formed to a thickness of more than 100 μm, poor assembly may occur, and contamination of the jig may occur. In addition, when the coupling portion 4000 is formed to exceed 100 μm, the paste material for forming the coupling portion 4000 flows to the side surface of the stack 1000, and accordingly, the internal electrode 200 and the discharge electrode 300 are formed. In order to cover the gap, the internal electrode 200, the discharge electrode 300, and the external electrode 5000 may be in poor contact to deteriorate device characteristics. In addition, the coupling part 4000 may be formed in its entirety or may be partially formed in at least one region. That is, the paste may be applied to one entire surface of the first or second laminate, or may be bonded after being applied to at least one region. On the other hand, the coupling portion 4000 may be formed to extend on the side of the stack 1000, it is formed so as not to cover the internal electrode 200 or the discharge electrode 300 to prevent a poor connection with the external electrode (5000) It is preferable. Also, in order to prevent the bonding paste from covering the internal electrode 200 or the discharge electrode 300, the internal electrode 200 or the discharge electrode 300 may be formed by forming the external electrode 5000 in advance before forming the bonding paste. Connection between the external electrode and the external electrode 5000 can be prevented. In this way, the coupling part 4000 is extended to the side surface of the stack 1000 to further improve the adhesion. In addition, the coupling part 4000 may have pores formed in at least one region, and the thickness of at least one region may be different from that of the other region.

On the other hand, the coupling portion 4000 may further include an electromagnetic shielding and absorbing material. In order to form the coupling part 4000, an electromagnetic wave shielding and absorbing material may be included in a glass paste having a bonding force. The electromagnetic shielding and absorbing material may include ferrite, alumina, or the like, and may be contained in an amount of 0.1 wt% to 50 wt% in the coupling portion 4000. That is, the electromagnetic shielding and absorbing material may be contained in an amount of 0.01 wt% to 50 wt% based on 100 wt% of the coupling portion 4000 material. When the electromagnetic shielding and absorbing material is less than 0.01% by weight, the electromagnetic shielding and absorbing properties are low, and when the electromagnetic shielding and absorbing material exceeds 50% by weight, the bonding property using the coupling part 4000 may be degraded. In addition, the coupling part 4000 including the electromagnetic shielding and absorbing material may be formed to a thickness of 1 μm to 100 μm. Here, the ferrite may be a MnZn-based ferrite having a high saturation magnetic flux density and a low core loss, a NiZn-based ferrite having an electrical resistivity of 10 µm or more, and a CuZn-based ferrite having a relatively low firing temperature. In addition, based on the high magnetic loss characteristics of the material, NiZn-based ferrite whose crystal structure is a spinel structure is used in a band of less than 1 GHz and replaced with Sr, Pb, and Ca elements instead of BaO-MeO-Fe ₂ O ₃ system or BaO. Since the ferrite of one hexagonal structure shows a natural resonance frequency at 1 kHz, it can be used as an electromagnetic wave absorbing and shielding material in the high frequency band of 1 kHz or more. In addition, R ₃ Fe ₅ O ₁₂ (R is a rare earth metal such as Y or Gd) is represented by a general formula, cubic structure of the cubic structure with low crystal magnetic anisotropy and low electromagnetic field can also be used. . As such, the electromagnetic shielding and absorbing material may be further contained in the coupling part 4000 to shield or absorb the electromagnetic waves.

On the other hand, the coupling portion 4000 may not have a separate color. That is, the coupling part 4000 may not have a separate color because no pigment is added. However, the coupling part 4000 may also have a color by adding a pigment. In this case, the coupling part 4000 may have the same color as the capacitor part 2000 and may have the same color as the overvoltage protection part 3000. That is, the pigment used when the capacitor part 2000 is formed may be added to the coupling part 4000 to have the same color as the capacitor part 2000, or the pigment used when the overvoltage protection part 3000 is added to protect the overvoltage. It may have the same color as the unit 3000. Of course, the coupling part 4000 may have a different color from the capacitor part 2000 and the overvoltage protection part 3000.

The coupling method of the capacitor unit 2000 and the overvoltage protection unit 3000 using the coupling unit 4000 is as follows. After forming the internal electrodes 200 on the plurality of dielectric sheets 110, respectively, and stacking and sintering the capacitor parts 2000, the discharge electrodes 310 are formed on the plurality of discharge sheets 120, respectively. After lamination and sintering, an overvoltage protection unit 3000 is manufactured. Subsequently, the coupling part 4000 is formed on one surface of the capacitor part 2000, and then the overvoltage protection part 3000 is combined to manufacture the laminate 1000. To this end, the capacitor unit 2000 may be aligned with a jig, and then an adhesive paste may be applied to one surface of the capacitor unit 2000, and the overvoltage protection unit 3000 may be aligned and compressed on top of the capacitor unit 2000. . In this case, the capacitor part 2000 and the overvoltage protection part 3000 are stacked in the stacking direction of the sheet 100 to expose the internal electrode 200 and the discharge electrode 310 on two opposite surfaces of the stack 1000. Be sure to In addition, after the capacitor unit 2000 and the overvoltage protection unit 3000 are combined, heat treatment may be performed at a predetermined temperature. For example, when the glass paste is used, the heat treatment may be performed at a temperature lower than the sintering temperature of the capacitor unit 2000 and the overvoltage protection unit 3000, and when the polymer paste is used, the heat treatment may be performed at a temperature of 10 ° C. to 300 ° C. FIG. .

Meanwhile, although the coupling part 4000 is formed by using a paste, the embodiment of the present invention uses a ceramic sheet and simultaneously stacks the coupling part 4000 between the capacitor part 2000 and the overvoltage protection part 3000. Sintering may also be used to implement composite devices.

5. 외부 전극5. External electrode

The

external electrodes

5100, 5200, and 5000 may be provided on two side surfaces of the stack 1000 that face each other. For example, the external electrodes 5000 may be formed on two opposite surfaces of the laminate 1000 in the X direction, that is, the length direction. In addition, the external electrode 5000 is connected to the internal electrode 200 and the discharge electrode 310 formed in the stack 1000. That is, one external electrode 5000 may be formed on each of two side surfaces facing each other, for example, the first and second sides, or two or more external electrodes may be formed. In this case, any one of the external electrodes 5000 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 5100 may be connected to an internal circuit, and the second external electrode 5200 may be connected to a metal case. In addition, the second external electrode 5200 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

The external electrode 5000 may be formed in various ways. That is, the external electrode 5000 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as deposition, sputtering, plating, and the like. The method of forming the external electrode 5000 by dipping or printing may vary depending on the material for forming the coupling part 4000. That is, when the coupling part 4000 is a polymer-based or epoxy-based dry or hardened type, the external electrode 5000 may be formed by using a polymer-based or epoxy-based material and drying or curing. If the coupling portion 4000 is of a dry or hardening type but the external electrode 5000 is advanced to a firing type, the coupling portion 4000 may burn out and the bonding force may be lowered. In addition, when the coupling portion 4000 is formed of a glass-based material, it may be free to determine the type of the external electrode 5000 since the material must be fired above the glass transition temperature in order to secure adhesion. That is, when the glass-based coupling portion 4000 forming material is used, the external electrode 5000 may be formed using a firing, drying, and curing type. On the other hand, the external electrode 5000 may be formed to extend on the surface in the Y direction and Z direction. That is, the external electrode 5000 may extend from two surfaces facing in the X direction to four adjacent surfaces. For example, when immersed in the conductive paste, the external electrode 5000 may be formed not only on two opposite sides of the X direction, but also on the front and rear surfaces of the Y direction, and the upper and lower surfaces of the Z direction. In contrast, when formed by printing, vapor deposition, sputtering, plating, or the like, the external electrode 5000 may be formed on two surfaces in the X direction. That is, the external electrode 5000 may be formed not only on one side mounted on the printed circuit board and the other side connected to the metal case, but also in other areas according to the formation method or process conditions. The external electrode 5000 may be formed of a metal having electrical conductivity. For example, the external electrode 5000 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, the internal electrode 200 and the discharge electrode 310 are formed on at least a part of the external electrode 5000, that is, at least one surface of the stack 1000, and the internal electrode 200 and the discharge electrode 310 are formed. A part of the external electrode 5000 to be connected may be formed of the same material as the internal electrode 200 and the discharge electrode 310. For example, when the internal electrode 200 and the discharge electrode 310 are formed of copper, at least a part of the inner electrode 200 and the discharge electrode 310 may be formed using copper. In this case, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by deposition, sputtering, plating, or the like. Preferably, the external electrode 5000 may be formed by plating. In order to form the external electrode 5000 by the plating process, the seed layer may be formed on upper and lower surfaces of the laminate 1000, and then the plating layer may be formed from the seed layer to form the external electrode 5000. Here, at least a part of the external electrode 5000 connected to the internal electrode 200 and the discharge electrode 310 may be an entire side surface of the stack 1000 on which the external electrode 5000 is formed, or may be a partial region. .

In addition, the external electrode 5000 may further include at least one plating layer. The external electrode 5000 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 5000 may be formed by stacking a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, the Cu plating layer, Ni plating layer and Sn plating layer may be laminated. In addition, the external electrode 5000 may be formed by mixing, for example, a multicomponent glass frit having 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. In this case, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to two surfaces of the laminate 1000. As the glass frit is included in the external electrode 5000, the adhesion between the external electrode 5000 and the stack 1000 may be improved, and the contact reaction of the electrodes in the stack 1000 may be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the upper portion thereof to form the external electrode 5000. That is, the metal layer including the glass and at least one plating layer formed thereon may form the external electrode 5000. For example, the external electrode 5000 may form a Ni plated layer and a Sn plated layer sequentially through electrolytic or electroless plating after forming a layer including glass frit and Ag and Cu. In this case, the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer. Of course, the external electrode 5000 may be formed of only at least one plating layer. That is, the external electrode 5000 may be formed by forming at least one layer of the plating layer using at least one plating process without applying the paste. Meanwhile, the external electrode 5000 may be formed to have a thickness of 2 μm to 100 μm, the Ni plating layer may be formed to have a thickness of 1 μm to 10 μm, and the Sn or Sn / Ag plating layer may have a thickness of 2 μm to 10 μm. Can be formed. Here, at least one region of the external electrode 5000 may be formed to have a different thickness from that of the other region. That is, the external electrode 5000 in the X direction from the side surface of the stack 1000 may be formed thicker or thinner than at least one region. For example, a step may be formed between the capacitor part 2000 and the overvoltage protection part 3000 on the side of the external electrode 5000, and the thickness of the external electrode 5000 formed along the step may be different.

As described above, the external electrode 5000 may be formed outside the laminate 1000 in which the capacitor unit 2000 and the overvoltage protection unit 3000 are coupled using the coupling unit 4000. However, the external electrode 5000 is formed on the capacitor unit 2000 and the overvoltage protection unit 3000 before coupling using the coupling unit 4000, and then coupled to each other using the coupling unit 4000. It may be formed to connect. That is, external capacitors are formed on two opposite sides of the capacitor unit 2000 and the overvoltage protection unit 3000, respectively, and are coupled using the coupling unit 4000, and then the capacitor unit 2000 and the overvoltage protection unit 3000 are combined. It is also possible to form an external electrode to connect the external electrode of the. In this case, each element may form a dry or hardened type external electrode or a fired type external electrode, and an external electrode for connecting them may also use a dry, hardened or fired type.

6. 표면 개질 부재6. Surface modification member

The surface modification member 6000 may be formed on at least a portion of the surface of the laminate 1000. That is, the surface modification member 6000 may be formed on the entire surface of the stack 1000, or may be formed only in an area in contact with the external electrode 5000 of the stack 1000. In other words, the surface modification member 6000 in which the surface modification member 6000 is formed on a part of the surface of the laminate 1000 may be formed between the laminate 1000 and the external electrode 5000. In this case, the surface modification member 6000 may be formed in contact with the extension region of the external electrode 5000. That is, the surface modification member 6000 may be provided between one region of the external electrode 5000 extending to the upper and lower surfaces of the laminate 1000 and the laminate 1000. In addition, the surface modification member 6000 may be provided in the same or different size than the external electrode 5000 formed thereon. For example, an area of 50% to 150% of an area of a portion of the external electrode 5000 extending to the upper and lower surfaces of the stack 1000 may be formed. That is, the surface modification member 6000 may be formed to be smaller or larger than the size of the extension region of the external electrode 5000, or may be formed to have the same size. Of course, the surface modification member 6000 may also be formed between the external electrode 5000 formed on the side surface of the laminate 1000. The surface modification member 6000 may include a glass material. For example, the surface modification member 6000 may include non-borosilicate glass (SiO ₂ -CaO-ZnO-MgO-based glass) that can be fired at a predetermined temperature, for example, 950 ° C. or less. Can be. In addition, the surface modification member 6000 may further include a magnetic material. That is, when the region on which the surface modification member 6000 is to be formed is made of a magnetic sheet, a magnetic material may be partially included in the surface modification member 6000 to facilitate coupling of the surface modification member 6000 and the magnetic sheet. In this case, the magnetic material may include, for example, NiZnCu-based magnetic powder, and may include, for example, 1-15 wt% of the magnetic material with respect to 100 wt% of the glass material. On the other hand, at least a portion of the surface modification member 6000 may be formed on the surface of the laminate 1000. In this case, at least a portion of the glass material may be evenly distributed on the surface of the stack 1000 as illustrated in FIG. 3A, and at least a portion of the glass material may have different sizes as illustrated in FIG. 3B. It may be distributed irregularly. Of course, the surface modification member 6000 may be continuously formed on the surface of the laminate 1000 to have a film form. In addition, as illustrated in FIG. 3C, a recess may be formed on at least part of the surface of the laminate 1000. That is, a glass material may be formed to form a convex portion, and at least a portion of the region where the glass material is not formed may be dug to form a recess. In this case, the glass material may be formed to a predetermined depth from the surface of the laminate 1000, and at least a portion thereof may be formed higher than the surface of the laminate 1000. That is, at least a portion of the surface modification member 6000 may be coplanar with the surface of the stack 1000, and at least a portion of the surface modification member 6000 may be maintained higher than the surface of the stack 1000. Thus, the surface of the laminate 1000 may be modified by distributing a glass material in a portion of the laminate 1000 before forming the external electrode 5000 to form the surface modifying member 6000, thereby improving the resistance of the surface. It can be made uniform. Therefore, the shape of the external electrode can be controlled, thereby facilitating the formation of the external electrode. Meanwhile, in order to form the surface modification member 6000 in a predetermined region of the surface of the laminate 1000, a paste including a glass material may be printed or applied to the predetermined region of the predetermined sheet. For example, the surface modifying member 6000 may be formed by applying a glass paste to at least two regions of the lower surface of the first dielectric sheet 111 and at least two regions of the upper surface of the seventh discharge sheet 127 and curing the glass paste. In addition, the glass paste may be applied to a predetermined area of the ceramic green sheet before cutting to the size of the stacked element. That is, after applying the glassy paste to a plurality of areas of the ceramic green sheet, the green sheet is cut by the cutting line of the stacked element unit including the portion where the glassy paste is formed, and the circuit is protected by laminating it with the sheet on which the noise filter part is formed. A device can be manufactured. In this case, since the surface modification member 6000 is formed at the edge of the laminate 1000, the surface modification member 6000 may be cut in a stacked device unit based on a region where the glassy paste is applied.

Meanwhile, the surface modification member 6000 may be formed using an oxide. That is, the surface modification member 6000 may be formed using at least one of a glassy material and an oxide, and may further include a magnetic material. In this case, the surface modification member 6000 may be distributed by dispersing the oxide in the crystalline state or amorphous state on the surface of the laminate 1000, at least a portion of the oxide distributed on the surface may be melted. In this case, the oxide may be formed as shown in FIGS. 3A to 3C. In addition, even when the surface modification member 6000 is formed of an oxide, the oxides may be spaced apart from each other and distributed in an island form, or may be formed in a film form in at least one region. Here, the oxide in the granular or molten state is, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , H ₂ At least one of BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ , and CaCO ₃ may be used.

As described above, in the composite device according to the first exemplary embodiment, at least two or more functional units having different functions may be coupled by the coupling unit 4000. For example, the passive element such as the capacitor unit 2000 and the overvoltage protection unit 3000 may be manufactured and then coupled by the coupling unit 4000. Therefore, two or more functional parts made of different materials may be provided in one laminate 1000. In addition, since the composite device is manufactured and sintered in each manufacturing process and then bonded, the materials of different functional portions do not diffuse together, thereby not degrading the function of each functional portion.

In addition, at least two or more functional units may have different colors or contrasts with the coupling portion 4000 interposed therebetween. For example, the capacitor part 2000 may have a lighter color than the overvoltage protection part 3000. Therefore, since the composite device has directionality by color, a separate phosphor coating process for imparting directionality may not be performed.

In addition, since the glass layer is not formed on the entire surface, the thickness of the device may be reduced, and thus the circuit protection device may be mounted in response to an electronic device having a reduced size and a reduced mounting area and height. On the other hand, if the size of the device is smaller, the area of the external electrode is smaller, the adhesion between the external electrode and the laminate is reduced, and thus the adhesion strength may be lowered when mounting on the PCB, but the adhesion between the external electrode and the laminate is improved according to the present invention. By improving the adhesion strength.

4 is a schematic cross-sectional view of a composite device according to a second exemplary embodiment of the present invention.

Referring to FIG. 4, a composite device according to a second embodiment of the present invention may include a stack 1000 including a plurality of sheets 100, at least one capacitor part 2000 provided in the stack 1000, The first overvoltage protection part 3100 provided to be spaced apart from the capacitor part 2000 in the laminate 1000, the second overvoltage protection part 3200 provided between the capacitor part 2000 in the laminate 1000, The coupling part 4000 provided between the capacitor part 2000 and the first overvoltage protection part 3100 in the stack 1000 and the external electrode 5000 provided outside the stack 1000 may be included. That is, in the composite device according to the second embodiment of the present invention, two overvoltage protection units 3000 are provided in the stack 1000, and the first overvoltage protection unit 3100 is provided on the capacitor unit 2000. The second overvoltage protection unit 3200 may be provided in the capacitor unit 2000. That is, a suppressor may be provided in the capacitor unit 2000. Here, since the first overvoltage protection unit 3100 is the same as the overvoltage protection unit 3000 of the first embodiment, and the capacitor unit 2000 is the same as the capacitor unit 2000 of the first embodiment, a detailed description thereof will be omitted. . However, the capacitor part 2000 includes the first to fourth internal electrodes 210 to 240, and the second overvoltage protection part 3200 is disposed between the second internal electrode 220 and the third internal electrode 240. Can be prepared. Here, even when the second overvoltage protection part 3200 is formed in the capacitor part 2000, the capacitor part 2000 may have a different color from the first overvoltage protection part 3100, for example, the first overvoltage protection part 3100. It may have a lighter color than). That is, not only the capacitor part 2000 but also the second overvoltage protection part 3200 may have a lighter color than the first overvoltage protection part 3100. In this case, the same pigment as that of the capacitor unit 2000 may be added to the second overvoltage protection unit 3200 to be manufactured. That is, the sheet forming the second overvoltage protection part 3200 may be formed of the same material as the dielectric sheet of the capacitor part 2000.

The second overvoltage protection part 3200 may include at least two

discharge electrodes

313 and 314 spaced apart in the vertical direction, and at least one overvoltage protection member 320 provided between the

discharge electrodes

313 and 314. have. For example, the second overvoltage protection unit 3200 may include the third and

fourth discharge electrodes

313 and 314 and the fourth sheet 114 formed on the third and fourth

dielectric sheets

113 and 114, respectively. It may include an over-voltage protection member 320 formed through. Here, the overvoltage protection member 320 may be formed such that at least a portion thereof is connected to the third and

fourth discharge electrodes

313 and 314. The third and

fourth discharge electrodes

313 and 314 may be formed to have the same thickness or different thicknesses from those of the first and

second discharge electrodes

311 and 312 of the first overvoltage protection part 3100 and the capacitor part 2000. The thickness of the internal electrodes 200 may be the same as or different from that of the internal electrodes 200. For example, the third and

fourth discharge electrodes

313 and 314 may be formed to have a thickness of 1 μm to 10 μm, and are thicker than the first and

second discharge electrodes

311 and 313, and may be formed in the internal electrode 200. It may be formed to the same thickness. At this time, since the varistor type first overvoltage protection unit 3100 bypasses the overvoltage by the energy conduction method, the load on the first and

second discharge electrodes

311 and 312 is small, but the second overvoltage protection of the suppressor type is performed. The part 3200 bypasses the overvoltage in the suppressor type, and thus the load on the third and

fourth discharge electrodes

313 and 314 is large. Therefore, the thicknesses of the third and

fourth discharge electrodes

313 and 314 of the second overvoltage protection part 3200 are greater than the thicknesses of the first and

second discharge electrodes

311 and 312 of the first overvoltage protection part 3100. It should be thickened. Meanwhile, the third and

fourth discharge electrodes

313 and 314 may further include a dielectric sheet 110 material. That is, the third and

fourth discharge electrodes

313 and 314 may be formed using a mixture of a conductive material and a dielectric material. In this case, the dielectric material may contain about 1 wt% to about 20 wt% with respect to 100 wt% of the mixture of the conductive material and the dielectric material. Therefore, the adhesion between the third and

fourth discharge electrodes

313 and 314 and the dielectric sheet 110 can be improved, thereby reducing microdelamination. The third discharge electrode 313 is connected to the second external electrode 5200 and is formed on the third sheet 113, and the end portion thereof is connected to the overvoltage protection member 320. The fourth discharge electrode 314 is connected to the first external electrode 5100 and is formed on the fourth sheet 114, and the terminal portion is formed to be connected to the overvoltage protection member 320. That is, the third and

fourth discharge electrodes

313 and 314 are formed to be connected to the adjacent external electrode 5000 with the adjacent inner electrode 200. That is, the third discharge electrode 313 is connected to the adjacent second internal electrode 220 and the second external electrode 5200, and the fourth discharge electrode 314 is adjacent to the third internal electrode 230 and the first external. It is connected to the electrode 5100. As such, when the third and

fourth discharge electrodes

313 and 314 and the inner electrode 200 adjacent thereto are connected to the same external electrode 5000, an overvoltage such as an ESD may occur even when the dielectric sheet 110 is deteriorated, that is, the dielectric breakdown. It is not applied inside the electronic device. That is, when the third and

fourth discharge electrodes

313 and 314 and the inner electrode 200 adjacent to each other are connected to different external electrodes 5000, the dielectric sheet 110 is applied through one external electrode 5000 when the dielectric sheet 110 is insulated and destroyed. The excess voltage flows to the other external electrode 5000 through the internal electrode 200 adjacent to the

discharge electrodes

313 and 314. For example, when the third discharge electrode 313 is connected to the first external electrode 5100 and the second internal electrode 220 adjacent thereto is connected to the second external electrode 5200, the dielectric sheet 110 breaks the insulation. If a conductive path is formed between the third discharge electrode 313 and the second internal electrode 220, the ESD voltage applied through the first external electrode 5100 is the third discharge electrode 313, and the dielectric breakdown third. It may flow to the dielectric sheet 113 and the second internal electrode 220, and thus may be applied to the internal circuit through the second external electrode 5200. In order to solve this problem, the thickness of the dielectric sheet 110 may be formed thick, but in this case, there is a problem in that the size of the device becomes large. However, even when the third and

fourth discharge electrodes

313 and 314 and the inner electrode 200 adjacent thereto are connected to the same outer electrode 5000, the overvoltage is applied into the electronic device even when the dielectric sheet 110 is destroyed. It doesn't work. In addition, it is possible to prevent the overvoltage from being applied without forming the thickness of the dielectric sheet 110 thickly. Of course, the third and

fourth discharge electrodes

313 and 314 may be connected to the external electrode 5000 which is different from the adjacent internal electrode 200. A distance between the third and

fourth discharge electrodes

313 and 314 and the adjacent internal electrode 200, that is, the second and third

internal electrodes

220 and 230 is referred to as A, and the third and

fourth discharge electrodes

313 , 314, and the distance between the internal electrodes 200 is referred to as C, and the third and

fourth discharge electrodes

313 and 314 and the adjacent internal electrodes 200 are different from each other. In order to improve the dielectric breakdown phenomenon between the internal electrode 200 and the third and

fourth discharge electrodes

313 and 314, the relationship of A> B and A> C is required. However, when the third and

fourth discharge electrodes

313 and 314 and the inner electrode 200 adjacent to each other are connected to the same outer electrode 5000, the inner electrode 200 and the third and

fourth discharge electrodes

313 and 314 are separated. Since the dielectric breakdown phenomenon is improved, A? B and A? C may be used. In addition, the thickness between the third and fourth discharge electrodes 313 314, that is, the thickness B of the fourth dielectric sheet 114 is the thickness of the lowermost and uppermost dielectric sheet 110 of the capacitor portion 2000, that is, the first thickness of the fourth dielectric sheet 114. When the thicknesses of the first and seventh

dielectric sheets

111 and 117 are D1 and D2, respectively, B ≦ D1 and B ≦ D2 may be D1 = D2 or D1 ≠ D2. Here, the thickness of the second overvoltage protection part 3200 is 0.4% to 40%, preferably 4% to 20% of the thickness of the capacitor part 2000, and the capacitor part 2000 and the first overvoltage protection part 3100. It may be 0.2% to 20%, preferably 2% to 10% of the thickness of the laminate 1000 including. Further, the thickness C between the internal electrodes 200 of the capacitor part 2000 is 10 μm to 250 μm, preferably 10 μm to 100 μm, and between the third and

fourth discharge electrodes

313 and 314. The distance B, that is, the thickness of the overvoltage protection member 320 is 1 µm to 100 µm, preferably 10 µm to 50 µm. In addition, the distance between the third and

fourth discharge electrodes

313 and 314 of the second overvoltage protection part 3200 is greater than the distance between the ends of the third and

fourth discharge electrodes

313 and 314 and the external electrode 5000. The distance between the inner electrode 200 of the capacitor unit 2000 may be smaller than the distance between the end of the inner electrode 200 and the outer electrode 5000. Meanwhile, the external electrode 5000 may be formed to extend not only on two side surfaces of the X direction but also on four surfaces of the Y direction and the Z direction. The internal electrode 200 connected to the first external electrode 5100 may have a distal end in the X direction. As a result, the distance between the second external electrode 5200 opposite to the distance between the regions extending from the second external electrode 5200 may be greater than the distance between the internal electrodes 200. In this way, a load may be applied between the internal electrodes 200.

Meanwhile, the regions of the third and

fourth discharge electrodes

313 and 314 that are in contact with the overvoltage protection member 320 may be the same size or smaller than the overvoltage protection member 320. In addition, the third and

fourth discharge electrodes

313 and 314 may be formed to completely overlap without leaving the overvoltage protection member 320. That is, the edges of the third and

fourth discharge electrodes

313 and 314 may form a vertical component with the edges of the overvoltage protection member 320. Of course, the third and

fourth discharge electrodes

313 and 314 may be formed to overlap a portion of the overvoltage protection member 320. For example, the third and

fourth discharge electrodes

313 and 314 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection member 320. That is, the third and

fourth discharge electrodes

313 and 314 are not formed beyond the overvoltage protection member 320. Meanwhile, the third and

fourth discharge electrodes

313 and 314 may be formed to have a larger area than one in contact with the overvoltage protection member 320.

The overvoltage protection member 320 may be formed in a predetermined region, for example, a central portion of the fourth dielectric sheet 114 to be connected to the third and

fourth discharge electrodes

313 and 314. In this case, the overvoltage protection member 320 may be formed to at least partially overlap the third and

fourth discharge electrodes

313 and 314. That is, the overvoltage protection member 320 may be formed to overlap 10% to 100% of the horizontal area with the third and

fourth discharge electrodes

313 and 314. The overvoltage protection member 320 may be formed to form a through hole having a predetermined size in a predetermined region, for example, a central portion of the fourth dielectric sheet 114, and fill the through hole using a thick film printing process. Of course, the overvoltage protection member 320 may be formed of only the through holes without filling the through holes. That is, the overvoltage protection member 320 may include a void or an overvoltage protection material provided in at least a portion of the void. On the other hand, the overvoltage protection member 320 may be formed, for example, a diameter of 100㎛ to 500㎛ and a thickness of 10㎛ to 50㎛. At this time, the thinner the thickness of the overvoltage protection member 320, the lower the discharge start voltage. The overvoltage protection member 320 may be formed using a conductive material and an insulating material. For example, the overvoltage protection member 320 may be formed by printing a mixed material of the conductive ceramic and the insulating ceramic on the fourth dielectric sheet 114. Meanwhile, the overvoltage protection member 320 may be formed on at least one dielectric sheet 110. That is, the overvoltage protection members 320 are formed on at least one dielectric sheet 110 stacked in the vertical direction, for example, and the discharge electrodes 310 are formed on the dielectric sheet 110 so as to be spaced apart from each other. And may be connected to the overvoltage protection member 320. Of course, the third and

fourth discharge electrodes

313 and 314 may be formed to be spaced apart in the horizontal direction on the same plane, and the overvoltage protection member 320 may be formed therebetween.

The overvoltage protection material which may be formed on the overvoltage protection member 320 is at least one selected from RuO ₂ , Pt, Pd, Ag, Au, Ni, Cr, W, and the like in an organic material such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB). It is possible to form a mixture of conductive materials. In addition, the overvoltage protection material may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ with the mixed material. Of course, a variety of materials may be used as the overvoltage protection material. For example, the overvoltage protection material may utilize at least one of a porous insulating material and a void. That is, a porous insulating material may be embedded or coated in the through hole, a void may be formed in the through hole, and a mixed material of the porous insulating material and the conductive material may be embedded or coated in the through hole. In addition, porous insulating materials, conductive materials, and voids may be formed in layers in the through holes. For example, a porous insulating layer is formed between the conductive layers, and voids may be formed between the insulating layers. In this case, the gap may be formed by connecting a plurality of pores of the insulating layer to each other. Here, as the porous insulating material, ferroelectric ceramics having a dielectric constant of about 50 to 500,000 may be used. For example, the insulating ceramic uses a mixture containing one or more of dielectric material powders such as MLCC, ZrO, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, Al ₂ O ₃ Can be formed. The porous insulating material may be formed in a porous structure in which a plurality of pores having a size of about 1 nm to 5 μm is formed to have a porosity of 30% to 80%. In this case, the shortest distance between the pores may be about 1nm to 5㎛. In addition, the conductive material used as the overvoltage protection material may be formed using a conductive ceramic, the conductive ceramic is at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Fe, Bi It is possible to use a mixture including. Meanwhile, a discharge induction layer (not shown) may be further formed on the overvoltage protection member 320. That is, the discharge induction layer may be formed between the discharge electrode 310 and the overvoltage protection member 320, and may be formed between the dielectric sheet 110 and the overvoltage protection member 320. The discharge induction layer may include an overvoltage protection material and a material of the discharge electrode 310, and may include an overvoltage protection material and a material of the dielectric sheet 110. In addition, the discharge induction layer may include an overvoltage protection material, a discharge electrode 310 material, and a dielectric sheet 110 material. That is, the discharge induction layer may be formed by the reaction of the overvoltage protection member 320, the discharge electrode 310, and the dielectric sheet 110. In this case, the discharge induction layer between the overvoltage protection member 320 and the discharge electrode 310 and the discharge induction layer between the overvoltage protection member 320 and the dielectric sheet 110 may have different compositions. For example, when the overvoltage protection member 332 is formed using porous ZrO or TiO and the discharge electrode 310 is formed using Al, AlZrO or TiAlO is formed between the overvoltage protection member 320 and the discharge electrode 310. A discharge induction layer of may be formed. The discharge induction layer is formed of a porous structure, the discharge of the overvoltage can be made more smoothly by the discharge induction layer.

On the other hand, in the composite device according to the present invention, the discharge electrode 310 of the overvoltage protection unit 3000 may be formed in various shapes. For example, as illustrated in FIGS. 5 and 6, the first and

second discharge electrodes

311 and 312 formed on the same plane and connected to different external electrodes 5000 are formed at predetermined intervals and are disposed on the upper side thereof. Alternatively, the fifth discharge electrode 315 may be formed to partially overlap the first and

second discharge electrodes

311 and 312. This will be described in more detail as follows. As shown in FIGS. 5 and 6, the first discharge electrode 311 is connected to the first external electrode 5100 so as to be disposed on the one discharge sheet 310, for example, the fifth discharge sheet 125 of FIG. 5. The second discharge electrode 312 is connected to the second external electrode 5200 and is formed on one discharge sheet 310, that is, the fifth discharge sheet 125, on which the first discharge electrode 311 is formed. In this case, the first and

second discharge electrodes

311 and 312 are formed spaced apart from each other by a predetermined interval. In addition, the fifth discharge electrode 315 is formed on one discharge sheet 120, for example, the second discharge sheet 122, below the first and

second discharge electrodes

311 and 312. The first and

second discharge electrodes

311 and 312 are formed to overlap a predetermined region. The distance between the first and

second discharge electrodes

311 and 312 is greater than the sum of the distances of the first and

fifth discharge electrodes

311 and 315 and the distances of the second and

fifth discharge electrodes

312 and 315. . That is, the distance between the first and

second discharge electrodes

311 and 312 is referred to as E, the distance between the first and

fifth discharge electrodes

311 and 315 is referred to as F, and the second and fifth discharge electrodes 312 are referred to as E. , 315) may have a relationship of E> F + G. In the overvoltage protection unit 3000 having such a structure, for example, an overvoltage applied from the outside is transmitted to the fifth discharge electrode 315 through the first discharge electrode 311, and then to the second discharge electrode 312. It can be bypassed to the ground terminal of the internal circuit.

In addition, the composite device according to the present invention may form the internal electrode 200 of the capacitor unit 2000 in various shapes. For example, at least one of the internal electrodes 200 may be formed to be spaced apart from each other in the same plane. In addition, at least one of the internal electrodes 200 may be formed to overlap in the vertical direction with the internal electrodes 200 formed to be spaced apart by a predetermined interval on the same plane. That is, as shown in FIG. 7 illustrating the fifth embodiment of the present invention, at least one internal electrode 200, that is, the first

internal electrodes

211 and 212 and the sixth, among the plurality of internal electrodes 200. The

internal electrodes

261 and 262 may be formed to be spaced apart from each other by a predetermined interval. In this case, the inner electrode 200 formed at the outermost side in the vertical direction (Z direction) of the capacitor unit 2000 may be formed spaced apart on the same plane. That is, the first internal electrode 211 is formed to be connected to the first external electrode 5100, and the first internal electrode 212 is formed to be connected to the second external electrode 5200.

Electrodes

211 and 212 are formed on the first dielectric sheet 111 at predetermined intervals. Similarly, the 6a internal electrode 261 is formed to be connected to the first external electrode 5100, and the 6b internal electrode 262 is formed to be connected to the second external electrode 5200, and the 6a and 6b may be connected to each other.

Internal electrodes

261 and 262 are formed on the sixth dielectric sheet 116 at predetermined intervals. In addition, a second internal electrode 220 is formed above the first

internal electrodes

211 and 212 to partially overlap the first

internal electrodes

211 and 212, and partially overlaps the sixth

internal electrodes

261 and 262. The fifth internal electrode 250 is formed under the sixth

internal electrodes

261 and 262. In this case, the second and fifth

internal electrodes

220 and 250 are formed not to be connected to the external electrode 5000. By forming at least one of the internal electrodes 200 to be spaced apart on the same plane and forming another internal electrode 200 to overlap with each other, a floating capacitance is generated between them to obtain a capacity higher than the target capacitance. have. In addition, the capacitor unit 2000 may be damaged due to repeated overvoltage application, thereby preventing overvoltage inflow. That is, when the dielectric sheet 110 between two adjacent inner electrodes 200 connected to different outer electrodes 5000 is insulated, an overvoltage may be applied through the inner electrode 200, but the inner electrode 200 may not be applied. The floating type may prevent the overvoltage from flowing even when the dielectric sheet 110 is insulated-breakdown. Meanwhile, although the shape of the internal electrode 200 of the capacitor unit 2000 is modified in the third embodiment of the present invention, the fifth embodiment of the present invention can be applied to other embodiments. In other words, the first embodiment includes two discharge electrodes 310 and the second and fourth embodiments in which the second overvoltage protection unit 3200 is formed between the two internal electrodes 200 of the capacitor unit 2000. The fifth embodiment of the present invention may be applied by modifying the shape of the internal electrode 200 of the capacitor unit 2000.

The composite device according to embodiments of the present invention may be provided in an electronic device including a portable electronic device such as a smart phone. For example, as shown in FIG. 8, between an internal circuit (for example, a PCB) 20 of an electronic device and a conductor, for example, a metal case 10, which is used as a conductor or antenna that can be contacted by a user. A composite device including a capacitor unit and an overvoltage protection unit may be provided. In FIG. 7, the capacitor portion is denoted by reference numeral C, and the overvoltage protection portion is denoted by reference numeral V. In FIG. In this case, the composite device may be mounted in the internal circuit 20 of the electronic device. One area of the internal circuit 20 may be connected to the metal case 10, and the other area may be connected to the ground terminal. That is, in the composite device, one region of the internal circuit 20 on which one of the external electrodes 5000 is mounted is connected to the metal case 10, and the other of the internal circuit 20 on which the other of the external electrodes 5000 is mounted. The other area may be connected to the ground terminal. In this case, the ground terminal may be provided in the internal circuit 20 or may be provided in a region other than the internal circuit 20. Therefore, one of the external electrodes 5000 may be connected to the metal case 10 and the other may be connected to the ground terminal. Meanwhile, a conductive connector or sheet may be provided between the metal case 10 and the composite element, and a resistor and an inductor may be provided between the composite element and the internal circuit. Thus, the composite device may be directly connected to the ground terminal of the internal circuit, or may be connected to the ground terminal through a resistor and an inductor. In addition, a contact portion 30 may be provided between the metal case 10 and the composite element to be in electrical contact with the metal case 10 and have an elastic force. That is, the contact unit 30 and the composite device according to the present invention may be provided between the metal case 10 and the internal circuit 20 of the electronic device. In this case, one of the external electrodes 5000 may be in contact with the contact unit 30 and the other may be connected to the ground terminal through the internal circuit 20. The contact part 30 may be made of a material having an elastic force and containing a conductive material to relieve the impact when an external force is applied from the outside of the electronic device. The contact portion 30 may have a clip shape or may be a conductive gasket. In addition, at least one region of the contact portion 30 may be mounted on the internal circuit 20, for example, a PCB. In this way, the composite device may be provided between the metal case 10 and the internal circuit 20 to block leakage current flowing from the internal circuit 20. In addition, an overvoltage such as an ESD may be bypassed to the ground terminal, and the insulation may not be broken by the overvoltage, so that the leakage current can be continuously interrupted. That is, in the composite device according to the present invention, current does not flow between the external electrodes 5000 at the electric shock voltage due to the rated voltage and the leakage current, and at the overvoltage such as ESD, current flows through the overvoltage protection unit 3000 so that the overvoltage is grounded. It can be bypassed to the terminal. Meanwhile, the composite device may have a breakdown voltage or a discharge start voltage higher than the rated voltage and lower than an overvoltage such as an ESD. For example, a composite device may have a rated voltage of 100V to 240V, an electric shock voltage may be equal to or higher than an operating voltage of a circuit, an overvoltage generated by external static electricity, or the like, may be higher than an electric shock voltage, and a breakdown voltage or The discharge start voltage may be 350V to 15kV. In addition, a communication signal may be transmitted between the external circuit and the internal circuit 20 by the capacitor unit 2000. That is, a communication signal from the outside, for example, an RF signal may be transmitted to the internal circuit 20 by the capacitor unit 2000, and the communication signal from the internal circuit 20 is external to the capacitor unit 2000. Can be delivered. Therefore, even when using the metal case 10 as an antenna, it is possible to exchange communication signals with the outside using the capacitor unit 2000. In this case, an antenna such as a Planar Inverted F Antenna (PIFA) may be provided inside the metal case 10. That is, the conductor may be formed to surround one region or the entire region including the region where the antenna is provided. In this case, in an electronic device requiring AC coupling without attenuation of a communication frequency band in order to use a conductor as a radiator of an antenna, the metal case 10 may be connected to the composite device through a conductive connector or a conductive sheet. . That is, in the composite device, one external electrode 5000 is connected to the metal case 10 through a conductive connector or conductive sheet, and the other external electrode 5000 is directly connected to the ground terminal of the internal circuit, or a resistor, an inductor, or a diode is used. It can be connected to the ground terminal through a passive element such as. As a result, the composite device according to the present invention may block leakage current flowing from the ground terminal of the internal circuit, bypass an overvoltage applied from the outside to the ground terminal, and transmit a communication signal between the outside and the electronic device. That is, the composite device prevents the electric conduction of the electric current to the metal case 10 during the charging through the DC block, and by the AC coupling through the capacitor characteristic to the radiator of the antenna without attenuating the communication frequency of the PIFA. Can be used.

In addition, the composite device according to an embodiment of the present invention may be provided between the metal case 10 and the internal circuit 20 to be used as an electric shock prevention device, and a plurality of insulating sheets, that is, dielectric sheets having high breakdown voltage characteristics, may be stacked. By forming the capacitor part 2000, an insulation resistance state can be maintained so that a leakage current does not flow when an electric shock voltage of, for example, 310V is applied from the internal circuit by the defective charger to the metal case, and the overvoltage protection part is also provided in the metal case. When the overvoltage is applied to the internal circuit, the overvoltage can be bypassed to maintain a high insulation resistance state without damaging the device. Therefore, the insulation is not destroyed even by the overvoltage, and thus, it is possible to continuously prevent leakage current generated in the defective charger from being delivered to the user through the metal case of the electronic device provided in the electronic device having the metal case.

On the other hand, when comparing the characteristics of the composite device and the capacitor or the device having an overvoltage protection function according to the embodiments of the present invention. These characteristics comparison is to determine the leakage current, that is, the protection characteristics of the electric shock voltage or current and the overvoltage protection characteristics such as ESD, and the interference characteristics of the communication frequency when each element is provided between the metal case of the electronic device and the internal circuit.

First, in the case of a capacitor, that is, in the first embodiment of the present invention, when the overvoltage protection unit and the coupling unit do not exist and consist only of the capacitor unit, the capacitor has a leakage current blocking characteristic and no communication frequency interference occurs. The element may be damaged by an overvoltage, for example. In addition, the leakage current blocking function is lost after the device is damaged by the overvoltage.

In order to prevent communication frequency interference, TVS diodes are not capable of implementing breakdown voltages of 320V in a small size when they are implemented with a capacitance of 20 kHz or more, thereby preventing leakage current blocking characteristics. In addition, when a breakdown voltage of 320V or more is implemented for electric shock protection, a capacitance of 20 mA or more is not obtained in a small size. That is, the instantaneous voltage suppression diode may have an overvoltage protection characteristic, but a communication frequency interference problem occurs for the electric shock protection characteristic, and there is a problem in that an electric shock protection characteristic is not obtained in order to avoid communication frequency interference.

In the case of the varistor, that is, in the first embodiment of the present invention, when the capacitor unit and the coupling unit do not exist, and only the overvoltage protection unit exists, the implementation of the breakdown voltage of 320 V at a small size when implemented with a capacitance of 20 kHz or more to avoid communication frequency interference This is impossible and no leakage current blocking characteristic is obtained. In addition, when a breakdown voltage of 320V or more is implemented for electric shock protection, a capacitance of 20 mA or more is not obtained in a small size. In other words, the varistor has an overvoltage protection characteristic, but there is a problem of communication frequency interference for electric shock protection characteristics, and a problem of failing to obtain electric shock protection characteristic to avoid communication frequency interference.

In the case of a device which simultaneously sinters the capacitor and the overvoltage protection part, that is, when the capacitor part and the overvoltage protection part are laminated and co-sintered, the device may bypass the breakdown voltage or the ESD voltage above the discharge initiation voltage, for example, over 2 kV, but over 2 kV. There is a problem that the following overvoltage cannot be bypassed. That is, in the case of co-sintered devices, there is a problem in that overvoltage protection performance is lowered.

However, in the composite device according to the embodiments of the present invention, that is, a composite device manufactured by separately combining the capacitor unit and the overvoltage protection unit, and coupled using the coupling unit, the overvoltage protection unit may obtain a low breakdown voltage or a discharge start voltage of about 400V to 500V. . Therefore, overvoltage of 2 kV or less, that is, 400 V or more can be bypassed. In addition, a device having a capacitance of 20 Hz or more, preferably 30 Hz to 100 Hz, in which communication frequency interference does not occur despite a low breakdown voltage or a discharge start voltage can be implemented.

According to the present invention, at least two or more functional layers are stacked and different colors or contrasts are given to the at least two or more functional layers so that the composite device has a direction. With this directionality, for example, the capacitor part 2000 may face the PCB, that is, the internal circuit of the electronic device, that is, the lower side, thereby reducing the insertion loss. That is, FIGS. 10 and 11 are schematic diagrams illustrating a frequency path according to a mounting position of a capacitor unit, and FIG. 10 illustrates a frequency path when the capacitor unit is positioned below as an embodiment of the present invention, and FIG. 11 is a comparative example. The frequency path in the case where the capacitor section is located above is shown. Meanwhile, in FIGS. 10 and 11, two

external electrodes

5100 and 5200 of the composite device are illustrated as being mounted in the

internal circuits

21 and 22. In this case, the first external electrode 5100 is connected to the internal circuit 21 through the internal circuit 21. It may be connected to the metal case, and the second external electrode 5200 may be connected to another region or the ground terminal of the internal circuit 22. Insertion loss according to Comparative Examples and Examples is shown in [Table 1] and FIGS. 12 to 14. Comparative Example (A) shows the insertion loss according to the frequency when the overvoltage protection part is located on the lower side and the capacitor part is on the upper side. Example (B) shows the insertion loss according to the frequency when the capacitor part is on the lower side and the overvoltage protection part is on the upper side. Insertion loss is shown. Here, FIG. 12 is a graph showing the insertion loss according to the frequency of Comparative Examples (A) and (B), and FIG. 13 is an enlarged view of FIG. 12 to show the insertion loss at specific frequencies, that is, 1.8 GHz and 2.4 GHz. It is a graph, and FIG. 14 is a graph which shows insertion loss in the vicinity of 10 microseconds. In addition, the composite device uses a structure in which a capacitor and a varistor are coupled by a coupling unit according to the first embodiment of the present invention described with reference to FIGS. 1 and 2, and the capacitance of the composite device is 100 μs.

삽입 손실Insertion loss	비교 예Comparative example	실시 예Example
1.8㎓1.8 ㎓	-0.360dB-0.360 dB	-0.320dB-0.320 dB
2.4㎓2.4 ㎓	-0.408dB-0.408 dB	-0.368dB-0.368 dB

As shown in Table 1 and FIG. 13, the insertion loss of the comparative example (A) is -0.360 dB and the insertion loss of the example (B) is -0.320 dB at the frequency of 1.8 kHz. In addition, the insertion loss of the comparative example (A) is -0.408dB and the insertion loss of the example (B) is -0.368dB at the frequency of 2.4 kHz. Therefore, the insertion loss is better as it is closer to 0 dB, so the embodiment (B) in which the capacitor part is located below the insertion loss is superior to the comparative example (A) in which the capacitor part is located above. As a result, the insertion loss can be reduced by mounting the capacitor section below. In addition, as shown in FIG. 14, the insertion loss at a high frequency is smaller and the bandwidth is wider in the high frequency direction than that of the comparative example (A). That is, in the case of the insertion loss at 3 dB as the reference of the cutoff frequency, for example, the frequency of the embodiment (B) is higher than the frequency of the comparative example (A), and thus the bandwidth of the embodiment is wider.

As described above, when the capacitor unit is located on the upper side, the frequency moving path from one terminal of the internal circuit 20 to the other terminal of the internal circuit 20 becomes longer through the capacitor than in the case where the capacitor unit is located on the lower side. It acts as a parasitic inductance. Therefore, in high frequency communication, S21 (transmission coefficient) is affected to increase the insertion loss or to narrow the bandwidth of the frequency. As a result, the capacitor portion may be positioned downward to face the internal circuit 20, thereby reducing parasitic inductance and thus reducing insertion loss.

On the other hand, a composite device having directivity using color according to embodiments of the present invention can determine the directivity by checking the color or contrast of one surface. For example, the directionality can be determined by checking the brightness of the upper surface of the composite device, that is, the surface brightness of the overvoltage protection unit. The determination device for this may include a sensing unit for sensing the surface of the composite device, and the controller may determine the directionality of the composite device by determining, for example, surface brightness of the composite device sensed from the sensing unit. For example, the controller may determine the normal position when the brightness of the composite device sensed by the sensing unit is brighter than the set brightness. Of course, the controller may determine the normal position when the brightness of the composite device is darker than the set brightness. If it is determined that the abnormal position according to the determination result of the controller it is necessary to correct the position.

In addition, the composite device according to the embodiments of the present invention may be inserted into a tape having an opening after determining the orientation using color or contrast. For example, the composite device may be inserted into a plurality of receiving grooves 6100 provided in the tape 6000 as shown in FIG. 15. The accommodation grooves 6100 may be provided in plurality, spaced apart from each other by a predetermined interval, and a composite element may be inserted into each accommodation groove 6100. In addition, the tape 6000 may further include an auxiliary groove 6200 on one side of the receiving groove 6100. The auxiliary groove 6200 may be used to move the tape 6000 to the saw-toothed equipment. Meanwhile, when the composite element is inserted into the receiving groove 6100, the tape 6000 may be wrapped around the wheel 7000 as shown in FIG. 16.

17 to 19 illustrate examples of a device including a sensing unit and a control unit to determine the orientation of the composite device and insert the composite device into the receiving groove 6100 of the tape 6000.

17 is a block diagram of a packaging apparatus for determining and packaging a direction of a composite device according to embodiments of the present disclosure. 18 is a schematic top view of the packaging apparatus, and FIG. 19 is a front schematic view showing the tape supply section and the tape winding section.

17 to 19, a packaging apparatus to which the present invention is applied is a composite device according to embodiments of the present invention, that is, a chip injecting a chip from an inserting unit 7100 and an inserting unit 7100 according to embodiments of the present invention. Alignment unit 7200 to align the chip while rotating in the direction, the sensing unit 7300 is provided on one side of the alignment unit 7200 and the sensing unit 7300, spaced apart from the sensing unit 7300, alignment unit 7200 A discharge part 7400 provided at one side of the discharge part to discharge an abnormally positioned chip, a moving part 7500 for moving the chip in one direction from the alignment part 7200, and a chip provided at the end of the moving part 7500 Insert portion 7700 for inserting into the receiving groove 6100 of the tape 6000, tape supply portion 7700 for supplying the tape 6000 for inserting the chip, and tape winding portion for winding the tape inserted the chip (7800) and determine the alignment state of the chip by checking the surface color or contrast of the chip It may comprise a control unit (7900) that controls the entire operation of the device and packaging. In addition, although not shown, an inverting unit provided between the sensing unit 7300 and the discharge unit 7400 to invert a position of an abnormally positioned chip, and a display unit displaying an image of the chip sensed by the sensing unit 7300. It may further include.

The input unit 7100 may be disposed above the alignment unit 7200 to store a large amount of chips, and may inject chips into the alignment unit 7200 under the control of the controller 7900. In addition, the input unit 7100 may have an appearance of a cone shape. That is, the input unit 7100 may be provided in the shape of a cone, the upper portion of which is provided in a substantially circular shape and the width becomes narrower toward the lower side. The input unit 7100 may inject chips into the alignment unit 7200 for a predetermined time every predetermined time under the control of the controller 7900. That is, the input unit 7100 may adjust the amount of chips input to the alignment unit 7200 under the control of the controller 7900.

The alignment unit 7200 aligns the chips introduced from the input unit 7100. The alignment unit 7200 may be provided in the shape of a circumference in which the chip may be sequentially moved upward. That is, the alignment unit 7200 may be provided in a substantially circular shape having a predetermined depth, and a circumferential end may be formed on the inner side, and may rotate in one direction, for example, counterclockwise. Therefore, the chip inserted into the alignment unit 7200 may move upward along the side surface from the bottom surface. In addition, the alignment unit 7200 may be provided with a vibrating unit (not shown) on the lower side to vibrate. Therefore, the alignment unit 7200 may move the chip by rotating in one direction while providing vibration to the chip.

The sensing unit 7300 may be provided at one side of the alignment unit 7200 to sense a chip moving by the alignment unit 7200. In this case, the sensing unit 7300 may sense the moved chips one by one. In addition, the sensing unit 7300 may sense the chips in the aligned state. To this end, the sensing unit 7300 may be provided to sense a predetermined region at the top of the alignment unit 7200. Meanwhile, the sensing unit 7300 may sense the brightness and / or brightness of the chip, and sense the amount of light of the chip. In order to sense the brightness or the amount of light of the chip, the sensing unit 7300 may sense the light reflected from the chip.

The discharge part 7400 may be spaced apart from the sensing part 7300 and disposed outside the alignment part 7200. The discharge unit 7400 may be provided to discharge the abnormal chip sensed by the sensing unit 7300 and determined by the control unit 7900. Here, the normal chip may be a chip having a brighter side than the set brightness facing upwards, and the abnormal chip may be a chip having a surface darker than the set brightness upward. Of course, on the contrary, the side where the normal chip is darker than the set brightness may face upwards, and the side where the abnormal chip is brighter than the set brightness may face upward. For example, when the chip sensed by the sensing unit 7300 is in an inverted state, the discharge unit 7400 may discharge it. The discharge unit 7400 may blow out chips that are abnormally positioned using air. Chips discharged by the discharge unit 7400 may be moved upward again from the other end of the alignment unit 7200 or the bottom of the alignment unit 7200.

The moving unit 7500 is aligned with the upper and lower positions through the alignment unit 7200, and the passage is moved to a position for inserting the chip 6000 determined as the normal position by the sensing unit 7300 and the control unit 7970 to the tape 6000. to be. The moving unit 7500 may be provided in a straight line between the alignment unit 7200 and the insertion unit 7600. The moving unit 7500 may move the chip by the driving force, or may move the chip by the vibration.

The inserting unit 7600 may be provided to insert the chip moved through the moving unit 7500 into the receiving groove 6100 of the tape 6000. The inserting unit 7600 may, for example, suck the chip and move it onto the tape 6000 and then insert it into the receiving groove 6100. For this purpose, the insertion unit 7600 may be configured as a suction member, a moving member, a valve, a vacuum pump, and the like. For example, after the suction member sucks the chip using the suction force, the moving member moves the chip to be positioned on the receiving groove 6100 and removes the suction force using the valve so that the chip is inserted into the receiving groove 6100. can do. At this time, the vacuum pump provides a vacuum, the valve can open and close the vacuum to provide or release the suction force to the suction member. The driving of the valve, the vacuum pump, the suction member, and the moving member may be performed by the control of the controller 7900.

The tape supply unit 7700 supplies the tape 6000 for accommodating the chip, and the tape winding unit 7800 winds the tape in which the chip is accommodated. That is, the tape supply part 7700 is provided on the front lower side of the packaging apparatus to release and supply the tape 6000 wound on the roll, and the tape winding part 7800 winds the tape containing the chip on the roll. In this case, the tape 6000 may be supplied in the advancing direction of the chip of the moving unit 7500. Of course, the tape 6000 may move in a direction opposite to the moving direction of the chip, or move in a direction orthogonal to the moving direction of the chip. In addition, guide rolls 7710 and 7720 are provided between the tape supply unit 7700 and the tape winding unit 7800 to guide the movement of the tape. For example, the first guide roll 7710 may be provided at an upper end of the side on which the tape 6000 is supplied, and the second guide roll 7720 may be provided at an upper end of the side on which the tape 6000 is wound.

The controller 7790 checks the surface image of the chip sensed by the sensing unit 7300 to determine whether the chip is normal. For example, the controller 7790 may set the brightness or the amount of light and determine that the chip is normally positioned when the brightness or the amount of light is equal to or greater than the set brightness or the amount of light. Specifically, the composite device according to the present invention having different colors or contrasts may have a brightness of 3000 to 3500cd on one side and a brightness of 100 to 500cd on the other side. If it is normal, and if it is 1700cd or less, it can be determined abnormal. In addition, the control unit 7790 controls the driving of the overall packaging apparatus. That is, the input time and the input amount of the input unit 7100 is controlled, and the rotation and vibration of the regular unit 7200 is controlled, and the discharge unit 7400 is controlled to discharge the abnormal chip. In addition, by controlling the moving unit 7500 to move the chip to the insertion position and control the insertion unit 7600 to insert the chip into the tape 600, the tape supply unit 7700 and the tape winding unit 7800 Control to feed and wind the tape.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. In other words, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

Claims

Two or more functional units having different functions;

A coupling part provided between the functional parts to couple them; And

An external electrode formed outside the laminate of the functional part and the coupling part and connected to at least a part of the functional part,

At least two opposite surfaces of the laminate have different colors or contrasts.
The composite device of claim 1, wherein the two or more functional units have different colors or contrasts.
The composite device of claim 1, wherein the two or more functional units have different thicknesses and sizes.
The composite device of claim 1, wherein the functional unit includes two or more of a resistor, a capacitor, an inductor, a noise filter, a varistor, and a suppressor.
The composite device of claim 1, wherein each of the two or more functional units includes a plurality of sheets and a conductive layer selectively formed on the plurality of sheets.
The composite device of claim 5, wherein the sheets of each of the two or more functional units have different colors or contrasts.
The composite device of claim 6, wherein at least one of the sheets of the same functional portion has a different color or contrast.
The composite device of claim 6, wherein the sheets of each of the two or more functional parts are added with pigments of different colors.
The composite device according to claim 6, wherein the sheets of each of the two or more functional parts are added with different amounts of pigments of the same color.
The composite device of claim 5, wherein the conductive layer is formed of a conductive material or at least one portion thereof is formed of a mixture of a conductive material and the same material as the sheet.
The composite device of claim 1, wherein the two or more functional units are joined by the coupling unit after being manufactured and sintered in different processes.
The composite device of claim 1, wherein the bonding portion comprises at least one of glass, a polymer, and an oligomer.
The composite device of claim 1, wherein the external electrode has a thickness different from at least one region having a different thickness.
Includes conductors and internal circuitry accessible to the user,

The electronic device provided with the composite element of any one of Claims 1-13 between the said conductor and the said internal circuit.
The electronic device of claim 14, further comprising at least one conductive member provided between the conductor and the composite device, wherein the composite device is connected to the ground terminal or connected to the ground terminal through a passive element.
15. The electronic device of claim 14, wherein the composite element includes a capacitor portion and an overvoltage protection portion, and the capacitor portion is mounted adjacent to the internal circuit.