WO2018117447A1

WO2018117447A1 - Complex protective element and electronic device comprising same

Info

Publication number: WO2018117447A1
Application number: PCT/KR2017/013465
Authority: WO
Inventors: 박인길; 김대겸; 조승훈
Original assignee: 주식회사 모다이노칩
Priority date: 2016-12-23
Filing date: 2017-11-24
Publication date: 2018-06-28
Also published as: KR20180074204A; KR101958775B1

Abstract

The present invention provides a complex protective element and an electronic device comprising the same. The complex protective element is provided between a conductor, which a user of the electronic device can contact, and an inner circuit. The complex protective element comprises: a contact portion, at least a part of which contacts the inner circuit of the electronic device; a complex protective portion having a surface coupled to the contact portion; and a conductive portion having an area to which another surface of the complex protective portion is coupled, the conductive portion being retained inside the electronic device.

Description

Composite protection device and electronic device having same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite protection device, and more particularly, to a composite protection device capable of protecting an electronic device or a user from voltage and current.

Electronic devices having multifunction such as smartphones are integrated with various components according to their functions. In addition, the electronic device is provided with an antenna capable of receiving various frequency bands such as wireless LAN, Bluetooth, and Global Positioning System (GPS) in various frequency bands, and some of them are built-in antennas. It may be installed in the case constituting the electronic device. Therefore, a contactor for electrical connection is provided between the antenna installed in the case and the internal circuit of the electronic device.

On the other hand, in recent years, with the emphasis on luxury image and durability of smart phones, the spread of terminals using metal materials is increasing. In other words, the spread of smart phones, which are made of metal with the edges or with the case made of metal other than the front screen display unit, is increasing.

However, using a smartphone during charging using a non-genuine charger in a smartphone using a metal case may cause an electric shock accident. That is, a shock current is generated by charging using a non-genuine charger or a poor charger using a low-quality device without built-in overcurrent protection circuit, and the shock current is conducted to the ground terminal of the smartphone, and then the metal case Electric shock may be caused to the user who is in contact with the metal case.

Accordingly, there is a need for a component capable of preventing damage to an internal circuit and electrocution by a user due to static electricity.

(Prior art document)

Korea Patent Registration No. 10-0876206

The present invention is provided with an electronic device, such as a smart phone provides a composite protection device that can protect the electronic device or the user from voltage and current and an electronic device having the same.

The present invention provides a composite protection device that does not break down by overvoltage, such as ESD (ElectroStatic Discharge), and an electronic device having the same.

A composite protection device according to an aspect of the present invention is a composite protection device provided between the conductor and the internal circuit that the user of the electronic device can contact, at least a portion of the contact portion in contact with the internal circuit of the electronic device; A composite protective part having one surface coupled with the contact part; The other surface of the composite protection unit is coupled to one region, and includes a conductive unit fixed inside the electronic device.

Bypassing the transient voltage applied from the outside to the ground terminal inside the electronic device, cut off the voltage or current leaking from the inside of the electronic device, and transmits a communication signal.

Further comprising a conductive adhesive member provided on the contact portion.

It further includes a support provided in contact with the conductive portion one side.

The support part is provided at a height of the contact part and the composite protection part, and one side contacts the conductive part, the other side contacts the inside of the electronic device, and the support part is insulative.

The support portion is provided between the conductive portion and the fixing portion of the electronic device, and the support portion is conductive.

An electronic device according to another aspect of the present invention is an electronic device in which a composite protection device is provided between a user contactable conductor and an internal circuit, and includes a window and a display unit, a bracket provided below the display unit, and a main provided below the bracket. A mode, a cover case provided to cover the main board, and a side case for closing the side space between the window and the cover case, the composite protective element is provided inside the side case.

The composite protection device may include a contact portion at least partially in contact with an internal circuit of an electronic device; A composite protective part having one surface coupled with the contact part; The other surface of the composite protection unit is coupled to one region, and includes a conductive unit fixed inside the electronic device.

It is provided on the inner side of the case further includes a fixing part for fixing the composite protection element.

The conductive portion is fixed to the fixed portion.

The contact part is electrically connected to an internal circuit of the main board.

The bracket is at least partially conductive, the contact portion is in contact with the bracket, and the bracket is connected to an internal circuit of the main board.

A composite protection device according to embodiments of the present invention is provided between a metal case of an electronic device and an internal circuit to block an electric shock voltage and bypass an overvoltage such as an ESD to a ground terminal. That is, the composite protection element may be provided between the side case of the electronic device and the internal circuit including the contact portion, the composite protection portion, and the conductive portion. That is, the combined body of the contact portion and the composite protection portion is fixed to one end of the plate-shaped conductive portion, and the other end of the conductive portion is fixed by the fixing portion provided inside the side case. At this time, the support part is provided in the side case to facilitate the fastening of the composite protective element.

The composite protection device maintains an insulation state to block an electric shock voltage leaking from an internal circuit, and provides a protection unit for protecting an internal circuit by protecting an overvoltage therein to prevent an overvoltage from flowing into the electronic device. Thus, it is possible to protect the electronic device and the user from voltage and current.

1 to 3 is a front perspective view, a rear perspective view and an exploded perspective view of an electronic device to which the composite protection device according to embodiments of the present invention is applied.

4 is a view of a region of an electronic device equipped with a composite protection device according to embodiments of the present invention.

5 is an enlarged view of a region of an electronic device equipped with a composite protection device according to a first embodiment of the present invention.

6 is a sectional view of a composite protective element.

7 and 8 are a perspective view and a cross-sectional view of the composite protection of the composite protection device according to an embodiment of the present invention.

9 to 12 are enlarged views of one region of an electronic device equipped with the composite protection device according to the second to fifth embodiments of the present invention.

13 to 17 is a view of the composite protection unit according to another embodiment of the present invention.

18 to 20 are cross-sectional views of a composite protection unit according to various embodiments of the present disclosure.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 to 3 are a front perspective view, a rear perspective view, and an exploded perspective view of an electronic device to which the composite protection device according to embodiments of the present invention is applied.

1 to 3, the electronic device 1000 includes a case 1100 forming an appearance, and includes a plurality of functional modules for performing a plurality of functions of the electronic device 1000 inside the case 1100. A circuit or the like is provided. The case 1100 may include a side case 1110 and a cover case 1120. Here, the side case 1110 may form at least a side of the electronic device 1000, and the cover case 1120 may be provided on the rear surface of the electronic device 1000 to cover the battery 1200. Meanwhile, the cover case 1120 may be integrally provided or detachably provided. When the battery 1200 is integrated, the cover case 1120 may be integrally formed, and the cover may be detached when the battery 1200 is detachable. Case 1120 may also be removable. Of course, the side case 1110 and the cover case 1120 may be integrally manufactured. That is, the case 1100 may be formed to close the side and rear surfaces and expose the top surface without distinguishing the side case 1110 and the cover case 1120. At least a part of the case 1100 may be formed by injecting synthetic resin or formed of a metal material. That is, at least a part of the side case 1110 and the cover case 1120 may be formed of a metal material. For example, the side case 1110 constituting the side of the electronic device 1000 may be formed of a metal material. . Of course, the cover case 1120 may also be formed of a metal material. The metal material used for the case 1100 may include, for example, stainless steel (STS), titanium (Ti), aluminum (Al), or the like. Meanwhile, as shown in FIG. 3, the bracket 1400 may be provided inside the side case 1110, and the display unit 1310 may be provided on the bracket 1400. In addition, a main board 1500 and a battery 1200 may be provided between the bracket 1400 and the cover case 1120. In this case, the battery 1200 may be provided in a predetermined area of the main board 1500. That is, the battery 1200 may be provided in a region where a predetermined region of the main board 1500 is removed.

The display unit 1310, the sound output module 1320, the camera module 1330a, and the like may be disposed on the upper surface of the electronic device 1000. In addition, a microphone 1340, an interface 1350, and the like may be disposed on one side of the electronic device 1000. That is, the display unit 1310, the sound output module 1320, the camera module 1330a, and the like are disposed on the upper surface of the electronic device 1000, and the predetermined area of the side case 1110 of the electronic device 1000, that is, the lower portion of the electronic device 1000. The microphone 1340, the interface 1350, and the like may be disposed on the side surface. The display unit 1310 is disposed on the upper surface of the electronic device 1000 and occupies most of the upper surface. That is, the display unit 1310 is provided in a substantially rectangular shape having a predetermined length in the X and Y directions, respectively, and includes the central area of the upper surface of the electronic apparatus 1000 in most regions of the upper surface of the electronic apparatus 1000. Is formed. In this case, a predetermined space that is not occupied by the display unit 1310 is provided between the upper surface of the electronic apparatus 1000, that is, between the side case 1110 and the display unit 1310, and the display unit 1310 in the X direction. The audio output module 1320 and the camera module 1330a may be provided at an upper side thereof, and a user input unit including the front input unit 1360 may be provided at a lower side thereof. In addition, a bezel area between two edges of the display unit 1310 extending in the X direction and the edge of the electronic device 1000, that is, between the display unit 1310 and the side case 1110 of the electronic device 1000 in the Y direction. This can be arranged. Of course, the display unit 1310 may be extended to the edge of the electronic device 1000 in the Y direction without a separate bezel area.

The display unit 1310 may output visual information and input tactile information of the user. To this end, the display unit 1310 may be provided with a touch input device. The touch input device includes a window (not shown) covering the front surface of the terminal body, a display unit (not shown) for outputting start information, for example, a liquid crystal display, and a touch sensor (not shown) provided between the window and the display unit. It may include. The touch sensor may be formed, for example, on a transparent plate having a predetermined thickness with a plurality of electrodes spaced apart by a predetermined interval in one direction and another direction perpendicular thereto, and a dielectric layer disposed therebetween to detect a user's touch input. That is, the touch sensor may include a plurality of electrodes arranged in a grid shape, for example, and detect capacitance according to a distance between electrodes according to a user's touch input. In addition, the display unit 1310 may further include a pressure sensor for inputting user's touch or pressure information. Accordingly, the touch sensor may detect coordinates in the horizontal direction, ie, the X direction and the Y direction, which are touched by the user, and the pressure sensor may detect the coordinates in the vertical direction, that is, the Z direction as well as the X and Y directions. .

The sound output module 1320, the camera module 1330a, and the front input unit 1360 may be provided in an area other than the display unit 1310 on the upper surface of the electronic device 1000. In this case, the sound output module 1320 and the camera module 1330a are provided above the display unit 1310 in the X direction, and a user input unit such as the front input unit 1360 is positioned below the display unit 1310 in the X direction. Can be prepared. The front input unit 1360 may be configured as a touch key, a push key, or the like, and the front input unit 1350 may be configured by using a touch sensor or a pressure sensor. In this case, a function module (not shown) for the function of the front input unit 1360 may be provided below the front input unit 1360, that is, under the front input unit 1360 in the Z direction. That is, a function module that performs a function of a touch key or a push key may be provided according to the driving method of the front input unit 1360, and a touch sensor or a pressure sensor may be provided. In addition, the front input unit 1360 may include a fingerprint recognition sensor. That is, the front input unit 1360 may recognize the user's fingerprint and detect whether the user is a legitimate user. For this purpose, the function module may include a fingerprint recognition sensor. Meanwhile, a second pressure sensor (not shown) may be provided at one side and the other side of the front input unit 1360 in the Y direction. As the user input unit, second pressure sensors are provided at both sides of the front input unit 1360 to detect a user's touch input and return to a previous screen, and perform a setting function for setting a screen of the display unit 1310. In this case, the front input unit 1360 using the fingerprint sensor may perform a function of returning to the initial screen as well as fingerprint recognition of the user. The haptic feedback device, such as a piezoelectric vibration device, may be further provided in contact with the display unit 1310 to provide feedback in response to a user's input or touch. The haptic feedback device may be provided in a predetermined area of the electronic device 1000 other than the display unit 1310. For example, a haptic feedback device may be provided in an outer region of the sound output module 1310, an outer region of the front input unit 1360, and a bezel region. Of course, the haptic feedback device may be provided under the display unit 1310.

Although not shown on the side of the electronic device 1000, a power supply unit and a side input unit may be further provided. For example, the power supply unit and the side input unit may be provided on two sides facing each other in the Y direction of the electronic device, or may be provided spaced apart from each other on one side. The power supply unit may be used to turn on / off the electronic device, and may be used to enable or disable the screen. In addition, the side input unit may be used to adjust the size of the sound output from the sound output module 1320. In this case, the power supply unit and the side input unit may be configured as a touch key, a push key, or may be configured as a pressure sensor. That is, the electronic device according to the present invention may be provided with a pressure sensor in a plurality of areas other than the display unit 1310, respectively. For example, pressure sensing of the upper sound output module 1320 and the camera module 1330a of the electronic device, pressure control of the lower front input unit 1360, and controlling pressure of the side power supply unit and side input unit, etc. At least one pressure sensor may be further provided.

Meanwhile, the camera module 1330b may be additionally mounted through the rear surface of the electronic apparatus 1000, that is, the cover case 1120. The camera module 1330b has a photographing direction substantially opposite to the camera module 1330a and may be a camera having different pixels from the camera module 1330a. A flash (not shown) may be further disposed adjacent to the camera module 1330b. In addition, although not shown, a fingerprint sensor may be provided below the camera module 1330b. That is, the fingerprint sensor may not be provided at the front input unit 1360, but a fingerprint sensor may be provided at the rear of the electronic device 1000.

The battery 1200 may be provided between the bracket 1400 and the cover case 1120. In this case, the battery 1200 may be provided inside the main board 1500. On the other hand, the battery 1200 may be fixed, or may be provided detachably.

In addition, as shown in FIG. 3, the bracket 1400 is provided inside the side case 1110 inside the electronic apparatus 1000, and the display unit 1310 includes a window, a display unit, and a touch sensor on the bracket 1400. ) May be provided. That is, the bracket 1400 supports the display unit 1310 including a window, a display unit, and a touch sensor. In addition, the bracket 1400 may be extended to an area other than the display unit 1310. That is, the bracket 1400 may be extended to a region where the front input unit 1360 and the like are formed. In addition, at least a portion of the bracket 1400 may be in contact with at least a portion of the side case 1110 and may be supported by at least a portion of the side case 1110. At least a portion of the bracket 1400 may be formed of a conductive material, for example, magnesium or an alloy thereof. That is, the bracket 1400 may include at least a portion of a first region made of a metal material and a second region made of a non-conductive material, for example, PC. For example, the second region may be formed in a plate shape having a predetermined thickness, and the first region may be provided in at least a partial region on the second region. Meanwhile, a first region made of a metal material of the bracket 1400 may be connected to the main board 1500. At least a portion of the first region may be connected to, for example, a ground terminal of the main board 1500.

The main board 1500 may be provided inside the electronic device 1000, and various circuits, elements, and function modules for driving the electronic device 1000 may be provided. For example, at least one driving means may be provided on the main board 1500 to supply power to a display unit, a touch sensor, a pressure sensor, a haptic module, a fingerprint sensor, and input and detect a signal output from the display board. Control means for processing various signals may be provided. In addition, a ground terminal for bypassing a high voltage such as an ESD applied from the outside may be further provided on the main board 1500.

4 is a diagram illustrating an area of an electronic device equipped with a composite protection device according to embodiments of the present disclosure. 5 is an enlarged view of one region of the electronic apparatus equipped with the composite protection element, and FIG. 6 is a schematic cross-sectional view of the composite protection element. 7 and 8 are a perspective view and a cross-sectional view of the composite protection unit of the composite protection device according to an embodiment of the present invention.

4 to 8, at least one composite protection device 2000 according to embodiments of the present disclosure may be provided inside the side case 1110 of the electronic device 1000. For example, the complex protection device 2000 may be provided on an inner surface of the side case 1110 facing the area where the battery 1200 is located. In addition, the complex protection device 2000 may be provided so as not to contact the battery 1200 facing each other. In this case, at least one composite protection device 2000 may be provided. The embodiment of the present invention shows a case in which four composite protection devices 2000 are provided at equal intervals.

The composite protection device 2000 according to the exemplary embodiments of the present invention may be fixed to the inner side of the side case 1110 using the fixing part 1600. The fixing part 1600 may be provided inside the side case 1110. The connection member 1610 may include a coupling member 1620 to fix the composite protection device 2000 to the connection member 1610. In this case, at least a part of the connection member 1610 may be provided in the side case 1110 and at least a part of the connection member 1610 may be provided in the bracket 1400. The connection member 1610 may protrude from the inner side of the side case 1110 to the inside in a predetermined width and may have a predetermined height. That is, the connection member 1610 may protrude from the inner surface of the side case 1110 at a predetermined width and height to support at least a portion of the composite protection device 2000. In addition, the connection member 1610 may protrude from the bracket 1400 to a predetermined height. In this case, the connection member 1610 formed on the side case 1110 and the connection member formed on the bracket 1400 may be aligned. Of course, the connecting member 1610 may be formed only in the side case 1110, in which case the lower side of the connecting member 1610 may be connected to the bracket 1400. In addition, at least a portion of the connection member 1610 may be formed of a conductive material. For example, the entire connecting member 1610 may be made of a conductive material, and at least a portion formed in contact with the side case 1110 may be made of a conductive material. Meanwhile, a groove or an opening may be formed in the connection member 1610 in the vertical direction. For example, a through opening may be formed in the connection member 1610 formed in the side case 1110, and a groove may be formed in the connection member 1610 on the bracket 1400 to align the opening with the groove. Of course, when the connection member 1610 is formed only in the side case 1110, a groove having a predetermined depth may be formed in the connection member 1610. The fastening member 1620 may be inserted into the opening or the groove of the connection member 1610. That is, the fastening member 1620 may be inserted into the groove of the connection member 1610 formed on the bracket 1400 by passing through the opening of the connection member 1610 formed in the side case 1110. The fastening member 1620 is fastened to the connection member 1610 to fix the composite protection device 2000. The fastening member 1620 may be provided by, for example, a screw. The composite protective device 2000 may be positioned on the connecting member 1610 and then fastened to the connecting member 1610 to connect the composite protective device 2000. Fix it. In addition, the fastening member 1620 may be provided with a screw thread on its outer surface, and a screw groove may be formed on the connection member 1610 correspondingly. That is, the fastening member 1620 may serve as a male screw, and the connection member 1610 may serve as a female screw. Meanwhile, the fastening member 1620 may be made of a conductive material. For example, the fastening member 1620 may be made of a metal material. Accordingly, the side case 1110, the connection member 1610, and the fastening member 1620 may be a path of an overvoltage or communication signal such as an ESD. The fixing part 1600 may electrically connect the conductive part 2300 and the side case 1100 by using welding, soldering, bonding, or adhesive tape in addition to the screw.

As shown in FIGS. 4 and 5, the composite protection device 2000 according to the exemplary embodiment of the present invention may include a contact part 2100, a composite protection part 2200, a conductive part 2300, and a support part 2400. It may include. Here, the conductive portion 2300 is fixed to at least a portion of the fixing portion 1600, the composite protective portion 2200 is fixed on one region of the conductive portion 2300, the contact portion 2100 is a composite region It is coupled to the protection unit 2200 and the other area is provided to be in contact with the main board 1500 through an internal circuit, that is, the bracket 1400. In addition, the support 2400 may support the composite protection device 2000 when the conductive part 2300 is fixed to the fixing part 1600. That is, in the composite protection device 2000 of the present invention, one surface of the composite protection part 2200 and the contact part 2100 are coupled by, for example, a conductive adhesive, and the other surface of the composite protection part 2200 is a conductive part 2300. On the one side of the) is coupled to, for example, such as SMD, the support portion 2400 is provided in a predetermined region of the side case 1110 or bracket 1400, and then the contact portion 2100 and the composite protective portion 2200 The mounted conductive part 2300 may be supported by the support part 2400 to be fixed to the fixing part 1600. The composite protective device 2000 will be described in more detail as follows.

1. 컨택부(2100)1. Contact portion 2100

The contact part 2100 may be made of a material having an elastic force and containing a conductive material to relieve the impact when an external force is applied from the outside of the electronic device. The contact part 2100 may have a clip shape as shown in FIG. 6. For example, the contact part 2100 may be provided on the support part 2110 provided on one side of the composite protection part 2000, and disposed on the support part 2110 to face the main board 1500, and at least a part of the contact part 2100. The contact portion 2120 which may be in contact with the 1500, and the support portion 2110 may be provided between one side of the contact portion 2120 and the contact portion 2120, and may include a connection portion 2130 having elastic force. Therefore, the height of the contact portion 2100 may be higher than the height of the composite protective part 2200.

The support part 2110 may be provided on an upper surface of the composite protection part 2200. Since the support part 2110 is provided on the upper surface of the composite protection part 2200, the support part 2110 may support the contact part 2120, the connection part 2130, and the mounting part 3000. The support part 2110 may be provided in a plate shape having a predetermined thickness, for example, may be provided in a rectangular plate shape having a predetermined thickness. The support part 2110 may be provided to have the same width as the upper surface of the composite protection part 2200. In addition, the support part 2110 may be provided shorter than the length of the upper surface of the composite protection part 2200. That is, the support part 2110 may be formed to have a length shorter than the length of the composite protection part 2200 so as not to contact the

external electrodes

2241, 2242 and 2240 of the composite protection part 2200. At this time, when the connection part 2130 is contracted by the elastic force, the support part 2110 is shorter than the length of the compound protection part 2200 so that the connection part 2130 does not come into contact with the external electrode 2240 of the composite protection part 2200. It can be formed as. Meanwhile, a coupling member (not shown) may be provided between the support part 2110 and the composite protection part 2200 to couple the support part 2110 and the composite protection part 2200. As the coupling member, for example, an adhesive tape, an adhesive or the like can be used. That is, the support part 2110 may be attached to the upper surface of the composite protection part 2200 by an adhesive member such as an adhesive tape or an adhesive.

One end of the contact part 2120 is connected to the connection part 2130, and extends in one direction from the connection part 2130, and a part of the contact part 2120 is extended to be inclined downward toward the bracket 1400, for example, to be in contact with the bracket 1400. have. In this case, the bracket 1400 includes at least a portion of the conductive first region 1400a and the insulating second region 1400b, and the first region 1400a is provided on the second region 1400b. 2120 may be in contact with the first region 1400a. In addition, the region adjacent to the other end of the contact portion 2120 may have a shape having a curvature that is convex in the direction in which the bracket 1400 is positioned. For example, the contact portion 2120 may be formed to be horizontal to a predetermined length and be inclined downward from the predetermined length, and then be inclined upward to the predetermined length again. At this time, the area in contact with the bracket 1400 of the contact portion 2120 may form a circle, for example, elliptical, semicircular. That is, the region of the support 2110 may be a shape having a bent portion in which the peripheral area including the other end of the support portion 2110 or far away from the connecting portion 2130 is bent upward, and the bent portion is connected to the bracket 1400. It is installed to be in contact.

The connection part 2130 is formed to connect one end of the support part 2110 and one end of the contact part 2120, and may have a curvature. When the connection portion 2130 is pressed by an external force, the bracket 1400 is pressed in the direction in which it is positioned, and when the external force is released, it has an elastic force that is restored to its original state. Therefore, the contact portion 2100 may be formed of a metal material having at least the connection portion 2130 elasticity.

Meanwhile, the contact part of the present invention may include a conductive rubber, a conductive silicon, an elastic body having a conductive wire inserted therein, and a gasket having a surface coated or bonded with a conductor in addition to a clip having conductivity and elasticity. In other words, the contact portion may include a conductive material layer. For example, in the case of a conductive gasket, the inside may be made of a nonconductive elastomer and the outside may be coated with a conductive material. Although not shown, the conductive gasket may include an insulating elastic core having a through hole formed therein and a conductive layer formed to surround the insulating elastic core. The insulating elastic core has a tube shape having a through hole formed therein, and a cross section may be formed in a substantially rectangular or circular shape, but is not limited thereto and may be formed in various shapes. For example, the through-hole may not be formed in the insulating elastic core. The insulating elastic core may be formed of silicone or elastic rubber. The conductive layer may be formed to surround the insulating elastic core. The conductive layer may be formed of at least one metal layer, for example, gold, silver, copper, or the like. Meanwhile, the conductive layer may be mixed with the elastic core without forming the conductive layer.

2. 복합 보호부2. Composite protection

The complex protection unit 2200 may bypass a high voltage such as an ESD applied from the outside to an internal circuit, that is, a ground terminal of the main board 1500, and cut off a leakage current from the main boss 1500. The composite protection unit 2200 may have an insulating state below a predetermined voltage and may be electrically conductive at a voltage above a predetermined voltage. For example, the complex protection unit 2200 may be formed of a varistor, a suppressor, a diode, and the like that are conducted at a predetermined voltage or more. Here, the voltage for conducting the composite protection unit 2200, that is, the breakdown voltage or the discharge start voltage may be higher than an external rated voltage and lower than the dielectric breakdown voltage of the composite protection unit 2200. That is, when an overvoltage higher than the rated voltage and lower than the dielectric breakdown voltage is applied, the complex protection unit 2200 may conduct the applied overvoltage to the ground terminal of the main board 1500. In addition, the complex protection unit 2200 may further include a capacitor or the like for transmitting a communication signal. An example of such a composite protection unit 2200 is shown in FIGS. 7 and 8. FIG. 8 is a cross-sectional view of a suppressor type composite protection unit 2200, and may include an ESD protection unit 2300 and at least one

capacitor unit

2200 and 2400.

As shown in FIG. 7 and FIG. 8, the composite protective part 2200 is provided in a stack 2210 in which a plurality of insulating sheets 100 (101 to 111) are stacked, and is provided in the stack 2210 and provided in a plurality of interiors. An overvoltage protection unit including at least one

capacitor unit

2220a, 2220b; 2220 having electrodes 200; 201 to 208, at least one discharge electrode 310; 311, 312, and an overvoltage protection member 320; 2230. That is, a conductive layer including a plurality of internal electrodes 200 and discharge electrodes 310 may be formed on the insulating sheet 100 selected from the plurality of insulating sheets 100 in the laminate 2210. For example, the first and

second capacitor parts

2220a and 2220b may be provided in the stack 2210, and the overvoltage protection part 2230 may be provided therebetween. That is, the first capacitor part 2220a, the overvoltage protection part 2230, and the second capacitor part 2220b may be stacked in the stack 2210 to implement the composite protection part 2200. In addition, the laminate 2210 further includes

external electrodes

2241, 2242 and 2240 formed on two opposite sides of the laminate 2210 and connected to the first and

second capacitor parts

2220a and 2220b and the overvoltage protection part 2230. can do. Of course, the composite protection unit 2200 may include at least one capacitor unit and at least one overvoltage protection unit. That is, the capacitor unit 2220 may be provided at either the lower side or the upper side of the overvoltage protection unit 2230, and at least one capacitor unit 2220 at the upper side and the lower side of the two or more overvoltage protection units 2230 spaced apart from each other. ) May be provided. In addition, the overvoltage protection unit 2230 may be provided inside the stack 2210 or outside the stack 2210, and embodiments of the present disclosure will be described in the stack 2210. When the overvoltage protection unit 2230 is formed outside the stack 2210, the overvoltage protection member 320 is formed between the stack 2210 and the external electrode 2240, and the discharge electrode 310 is stacked on the stack 2210. It may be formed inside. On the other hand, a more detailed description of the detection prevention unit 2200 will be described later.

In this way, the composite protective part 2200 may be provided between the conductive part 2300 and the bracket 1400 to block the electric shock voltage applied from the main board 1500 through the bracket 1400. In addition, the overvoltage is bypassed to the ground terminal, and the insulation is not destroyed by an overvoltage such as ESD, so that the electric shock voltage can be continuously interrupted. That is, the composite protection unit 2200 according to the present invention maintains an insulation state below the electric shock voltage to cut off the electric shock voltage applied from the main board 1500 and maintains a conductive state at an ESD voltage or higher, thereby preventing the internal of the electronic device from the outside. Bypass the ESD voltage applied to the ground terminal.

3. 도전부3. Challenge

One end of the conductive portion 2300 is fixed to the fixing portion 1600 and the other end of the composite protection portion 2200 is fixed. The conductive part 2300 supports the composite protective part 2200 and the contact part 2100 and electrically connects the composite protective part 2200 to the side case 1110. Therefore, the conductive portion 2300 may have a plate shape having a predetermined thickness. For example, the conductive portion 2300 may have a rectangular plate shape having a predetermined thickness. In addition, an opening may be formed in one region of the conductive portion 2300, that is, the region fixed to the fixing portion 1600. That is, the fastening member 1620 of the fixing part 1600 may be inserted through the opening to fix the conductive part 2300 to the fixing part 1600. The conductive part 2300 may be made of a metal material, for example, made of SUS. In addition, the conductive part 2300 may be made of the same material as the side case 1110. Meanwhile, the conductive portion 2300 may be plated with Ag, Cr, Ni, Au, or the like. In addition, the conductive part 2300 may be provided to have a thickness of about 0.1 mm to about 1 mm.

4. 지지부4. Support

The support part 2400 may be provided between the fixing part 1600, the contact part 2100, and the composite protection part 2200. The support part 2400 allows the contact part 2100 and the compound protection part 2200 to be supported thereon when the contact part 2100 and the compound protection part 2200 are fixed using the fixing part 1600. That is, the contact portion 2100 and the composite protection portion 2200 are fixed to the fixing portion 1600 in one region of the conductive portion 2300 in a state where the conductive portion 2300 is fastened to another region of the conductive portion 2300. Since the 2400 supports the contact portion 2100 and the composite protective portion 2200, the fastening of the conductive portion 2300 may be made easier. The support 2400 may be formed of a non-conductive material. For example, an adhesive is provided between at least one surface of the support part 2400 having a rectangular parallelepiped shape and an elastic force, for example, a surface contacting the side case 1110 and the side case 1100, and the support part 2400 is a side case. It may be adhesively fixed to the inner side of the 1110. The support 2400 is formed such that an upper surface thereof is parallel to the conductive portion 2300. That is, the upper surface of the support portion 2400 and the lower surface of the conductive portion 2300 are horizontal so that the lower surface of the conductive portion 2300 contacts the upper surface of the support portion 2400 so that the conductive portion 2300 is horizontal. Can be achieved. To this end, the upper surface of the support 2400 may be horizontal with the upper surface of the connection member 1610 of the fixing part 1600. That is, the upper surface of the support 2400 may be coplanar with the upper surface of the connection member 1610 without forming a step. Meanwhile, the bottom surface of the support 2400 may be in contact with the bracket 1400. That is, the support 2400 includes a bracket in which the first region 1400a is provided on the second region 1400b including at least a first region 1400a made of a conductive material and a second region 1400b made of an insulating material. It may be provided on the first region 1400a of the 1400. However, the lower surface of the support 2400 may be spaced apart from the bracket 1400 by a predetermined interval. Therefore, the height of the support 2400 may be equal to or smaller than the sum of the heights of the contact portion 2100 and the composite protective part 2200.

As described above, the composite protection device 2000 according to an embodiment of the present invention may be provided inside the electronic device 1000 by combining the contact portion 2100, the composite protection portion 2200, and the conductive portion 2300. Can be. For example, the composite protection device 2000 may be provided to be fixed to the side case 1110 of the electronic device 1000 and connected to the bracket 1400. In this case, in the composite protection device, the contact portion 2100 and the composite protection portion 2200 are coupled, and the combination is fixed to one end of the conductive portion 2300, and the other end of the conductive portion 2300 is fixed to the fixing portion 1600. It may be fixed to the inside of the side case 1110 by using. For example, the conductive part 2300 having the fixing member 1610 provided on the inner side of the side case 1110, and the contact part 2100 and the composite protective part 2200 provided on one side thereof is disposed on the fixing member 1610. The conductive part 2300 is fixed to the conductive part 2300 and the fixing member 1610 by using the coupling member 1620. In this case, the support part 2400 may be provided inside the side case 1110 to further facilitate the fastening of the composite protection device 2000. Therefore, an overvoltage such as an ESD applied from the outside is transmitted through the side case 1110 and the fixing part 1600, which in turn is connected to the ground terminal of the main board 1500 through the composite protection device 2000 and the bracket 1400. Bypassed. That is, the overvoltage transmitted through the side case 1110 and the fixing part 1600 is transferred to the composite protection part 2200 through the conductive part 2300, and discharged inside the composite protection part 2200 to contact the part 2100. It is delivered to the bracket 1400 and bypassed to the ground terminal of the main board 1500 connected to the bracket 1400. Meanwhile, the electric shock voltage or current generated by the defective charger may be transferred to the side case 1110 through the main mode 1500, but is blocked by the composite protection unit 2200 that maintains an insulation state at or above the electric shock voltage. It may not be delivered to the side case 1110, thereby preventing a user from electric shock.

Meanwhile, the composite protection device according to embodiments of the present invention may be provided in an electronic device in various ways, which are illustrated in FIGS. 9 to 12. 9 to 12 are views for explaining a fastening method of the composite protective device according to the second to fifth embodiments of the present invention.

As shown in FIG. 9, the support part 2400 is provided to contact the other end of the conductive part 2300, and the contact part 2100 and the composite protective part 2200 are provided between the support part 2400 and the fixing part 1600. This can be arranged. That is, in the first embodiment illustrated in FIG. 5, the support part 2400 is provided between the fixing part 1600 and the complex protection part 2200, but as shown in FIG. 9, the support part 2400 is formed of the conductive part 2300. The composite protection part 2200 may be provided to be in contact with the end of the support part and between the support part 2400 and the fixing part 1600. In this case, the support 2400 may be formed of an insulating material. On the other hand, the clip-shaped contact portion 2100 may have a shape as shown in FIG.

In addition, as illustrated in FIG. 10, a support 2400a may be provided between the fixing units 1600. That is, the support 2400a may be provided between the connection member 1610 and the fastening member 1620. In this case, the support part 2400a may be provided to be in contact with the connection member 1610 and the conductive part 2300 may be in contact with the support part 2400a. To this end, the support part 2400a may be provided at one end of the conductive part 2300, the support part 2400a may be provided on the connection member 1610, and then the fastening member 1620 may be fastened to the connection member 1610. In addition, a support portion 2400a is provided on the connection member 1610 and one end of the conductive portion 2300 is positioned on the support portion 2400a, and then the coupling member 1620 may be used to engage the connection member 1610 using the fastening member 1620. Can be. Therefore, it is possible to smoothly fasten the composite protection device 2000 without providing the support part 2400 illustrated in FIGS. 5 and 9 inside the side case 1110. On the other hand, the support 2400a may be formed of a conductive material, for example, may be formed of a conductive tape. An overvoltage applied from the outside may be bypassed to the ground terminal through the composite protection unit 2200 only when the support part 2400a is formed of a conductive material. That is, an overvoltage applied from the outside is transmitted through the side case 1110 and the fixing part 1600. The fixing part 1600 is connected to the connecting member 1610 and the fastening member 1620, so that an insulating material is formed therebetween. If provided, overvoltages cannot be bypassed to the ground terminal. Therefore, the support 2400a provided between the connecting member 1610 and the fastening member 1620 should be formed of a conductive material.

And, as shown in FIG. 11, the conductive portion 2300a may be provided in a curved form. That is, one end of the conductive portion 2300a is fastened to the lower side of the fixing portion 1600, and the conductive portion 2300 may be formed to be inclined upward in one region and then horizontally formed again. In this case, the complex protection unit 2200 may be provided in a predetermined area of a portion formed horizontally in the direction of the cover case 1120.

In addition, as illustrated in FIG. 12, the composite protection part 2200 and the contact part 2100a may be provided between the conductive part 2300 and the bracket 1400 and spaced apart from each other to provide the support part 2400. In this case, the contact part 2100a may include a conductive rubber, a conductive silicon, an elastic body having a conductive wire inserted therein, and a gasket having a surface coated or bonded with a conductor. That is, the contact portion 2100a may be formed in the form of a clip or may be formed in the form of a gasket. Here, the contact portion 2100a and the support portion 2400 may be horizontal. In addition, a conductive adhesive 2500 may be provided between one surface of each of the horizontal contact portion 2100a and the support portion 2400 and the bracket 1400. To this end, the composite protective part 2200 is mounted in one area of the conductive part 2300, and the contact part 2100a in the form of a gasket is mounted on the composite protective part 2200, and the supporting part is supported in the other area of the conductive part 2300. After preparing the 2400, the conductive adhesive 2500 may be provided on one surface of the contact portion 2100a and the support 2400, and the conductive adhesive 2500 may be attached onto the bracket 1400. Meanwhile, when the conductive adhesive 2500 is used, the support 2400 may not be used. That is, since the conductive adhesive 2500 may be formed on one surface of the contact portion 2100a and attached to the bracket 1400, the conductive portion 2300 may be fixed to the conductive portion 2300 without providing a separate support portion 2400. Can be fixed at

Hereinafter, the composite protection unit according to an embodiment of the present invention will be described in more detail with reference to FIGS. 7 and 8. Although the following example shows a composite protection part of suppressor time, the varistor type composite protection part is also possible.

7 is a perspective view of a composite protective device according to an embodiment of the present invention, Figure 8 is a cross-sectional view.

7 and 8, a composite protection device according to an exemplary embodiment of the present invention may include a laminate 2210 in which a plurality of sheets 100 (101 to 111) are stacked, and a plurality of sheets 2210 are provided in a laminate 2210. At least one capacitor unit (2220a, 2220b; 2220) having internal electrodes (200; 201 to 208), at least one discharge electrode (310; 311, 312), and an overvoltage protection member (320). It may include an overvoltage protection unit 2230 for protecting the overvoltage, such as. For example, the first and

second capacitor parts

2220a and 2220b may be provided in the stack 2210, and the overvoltage protection part 2230 may be provided therebetween. That is, the first capacitor part 2220a, the overvoltage protection part 2230, and the second capacitor part 2220b may be stacked in the stack 2210 to implement a composite protection device. In addition, the stack 2210 may further include

external electrodes

2241, 2242 and 4000 formed on two opposite sides of the stack 2210 and connected to the capacitor unit 2220 and the overvoltage protection unit 2230. Of course, the composite protection device may include at least one capacitor unit 2220 and at least one overvoltage protection unit 2230. That is, the capacitor unit 2220 may be provided at either the lower side or the upper side of the overvoltage protection unit 2230, and at least one capacitor unit 2220 at the upper side and the lower side of the two or more overvoltage protection units 2230 spaced apart from each other. ) May be provided. These complex protection elements are provided between the conductors accessible by the user of the electronic device and internal circuitry, for example, a metal case and a PCB, to block the electric shock voltage, bypass the ESD voltage, and prevent the insulation from being destroyed by the ESD. The voltage can be cut off continuously.

1. 적층체1. Laminate

The laminate 2210 may be provided in a substantially hexahedral shape. That is, the laminate 2210 has a predetermined length and width in one direction (for example, the X direction) and the other direction (for example, the Y direction) orthogonal to each other in the horizontal direction, and has a vertical direction (for example, Z). Direction) may be provided in an approximately hexahedral shape having a predetermined height. That is, when the direction in which the external electrodes 2240 are formed is the X direction, the direction orthogonal to the horizontal electrode 2 may be the Y direction, and the vertical direction may be the Z direction. The length in the X direction may be greater than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be the same as or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height. For example, the ratio of length, width and height may be 2-5: 1: 0.3-1. That is, the length may be about 2 to 5 times greater than the width and the height may be about 0.3 to 1 times greater than the width. However, the size of the X, Y and Z directions can be variously modified according to the internal structure of the electronic device to which the composite protective element is connected, the shape of the composite protective element, and the like, as one example.

The stack 2210 may be formed by stacking a plurality of sheets 101 to 111; That is, the laminate 2210 may be formed by stacking a plurality of sheets 100 having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Accordingly, the length and width of the laminate 2210 may be determined by the length and width of the sheet 100, and the height of the laminate 2210 may be determined by the number of stacked sheets of the sheet 100. Meanwhile, the plurality of sheets 100 constituting the laminate 2210 may be formed using dielectric materials such as MLCC, LTCC, HTCC, and the like. The MLCC dielectric material includes at least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO based on at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO _2. It may include a glass material. In addition, the sheet 100 is one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, and Al ₂ O ₃ in addition to MLCC, LTCC, and HTCC. It may be formed of a material containing the above. In addition to the above materials, the sheet 100 may be formed of a material having varistor characteristics such as Pr-based, Bi-based, and ST-based ceramic materials. Of course, the sheet 100 may be formed by mixing materials having MLCC, LTCC, HTCC and varistor characteristics. For example, the sheet 100 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and by adjusting the content of these materials The dielectric constant can be adjusted. Accordingly, the sheet 100 may have a predetermined dielectric constant, for example, 5 to 20000, preferably 7 to 4000, and more preferably 100 to 3000, depending on the material. For example, the sheet 100 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , by increasing the content of BaTiO ₃ The dielectric constant can be increased, and the dielectric constant can be lowered by increasing the contents of NdTiO ₃ and SiO ₂ . Meanwhile, at least one of the sheets 110 may have a dielectric constant different from that of the other sheets. For example, the outermost sheet, that is, the first and

eleventh sheets

101 and 111 positioned in the lowermost layer and the uppermost layer in the vertical direction, are the remaining sheets provided therebetween, that is, the second to tenth sheets 102 to 110. It can have a different dielectric constant than. That is, the dielectric constants of the first and

eleventh sheets

101 and 111 may be lower than those of the second to tenth sheets 102 to 110. For example, the dielectric constants of the first and

eleventh sheets

101 and 111 may be 100 or less, and the dielectric constants of the second to tenth sheets 102 to 110 may be 500 or more. For example, the dielectric constants of the first and

eleventh sheets

101 and 111 may be 5 to 100, and the dielectric constants of the second to tenth sheets 102 to 111 may be 500 to 3,000. Thus, in order to change the dielectric constant of the sheet 100, it is possible to adjust the content of the composition for forming the sheet. For example, the first to eleventh sheets 101 to 111 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , The first and

eleventh sheets

101 and 111 may increase the content of NdTiO ₃ and SiO ₂ and reduce the content of BaTiO ₃ to form a dielectric constant of 100 or less, and the second to tenth sheets 102 to 110. The dielectric constant of 500 or more may be formed by increasing the content of BaTiO ₃ and decreasing the content of NdTiO ₃ and SiO ₂ . That is, the first and

eleventh sheets

101 and 111 increase the content of NdTiO ₃ and SiO ₂ and decrease the content of BaTiO ₃ compared to the second to tenth sheets 102 to 110 so that the dielectric constant is 100 or less. can do. On the other hand, the second to tenth sheet (102 to 110) is the first and the 11 sheets (101 and 111) to increase the content of BaTiO ₃ was NdTiO ₃ and 500 or more dielectric constant by reducing the content of SiO ₂ than the You can do that. By lowering the dielectric constant of the outermost sheet, parasitic capacitance can be reduced. Meanwhile, of the second to tenth sheets 102 to 110, the sheets adjacent to the first and

eleventh sheets

101 and 111, for example, the second and

tenth sheets

102 and 110, are the remaining sheets ( 103 to 109) may have a lower dielectric constant. In addition, the dielectric constant of the sheets may increase from the first and

eleventh sheets

101 and 111 toward the center portion. This is because the compositions of the first and

eleventh sheets

101 and 111 diffuse into the central portion of the laminate 2210 upon sintering of the laminate 2210.

In addition, the plurality of sheets 100 may all be formed with the same thickness, and at least one may be formed thicker or thinner than the others. For example, the sheet of the overvoltage protection unit 2230 may be formed to have a different thickness from the sheet of the capacitor unit 2220, and the sheet formed between the overvoltage protection unit 2230 and the capacitor unit 2220 may be formed of another sheet. It can be formed in different thicknesses. For example, the thickness of the sheet between the overvoltage protection unit 2230 and the capacitor unit 2220, that is, the fifth and

seventh sheets

105 and 107, may be the sheet of the overvoltage protection unit 2230, that is, the sixth sheet 106. It may be formed to a thickness thinner than or the same as), or may be formed to a thickness thinner than or equal to the sheets 102 to 104 and 108 to 110 between the internal electrodes of the capacitor unit 2220. That is, the interval between the overvoltage protection unit 2230 and the capacitor unit 2220 is formed to be thinner or the same as the interval between the internal electrodes of the capacitor unit 2220, or thinner or equal to the thickness of the overvoltage protection unit 2230. Can be. Of course, the sheets 102 to 104 and 108 to 110 of the capacitor parts 2000 and 4000 may be formed to have the same thickness, and either one may be thinner or thicker than the other. Meanwhile, the plurality of sheets 100 may be formed, for example, in a thickness of 1 μm to 4000 μm, and may be formed to a thickness of 3000 μm or less. That is, the thickness of each sheet 100 may be 1 μm to 4000 μm, and preferably 5 μm to 300 μm, depending on the thickness of the laminate 2210. In addition, the thickness of the sheet 100 and the number of stacked layers may be adjusted according to the size of the composite protection device. That is, the sheet 100 may be formed in a thin thickness when the composite protective element is small in size, and may be formed in a thick thickness when the composite protective element is large in size. In addition, when the sheets 100 are stacked in the same number, the smaller the size of the composite protection device is, the thinner the height becomes, and the larger the size of the composite protection device may be. Of course, a thin sheet can also be applied to a composite protective element of a large size, in which case the number of sheets of the sheet is increased. At this time, the sheet 100 may be formed to a thickness that does not break when the ESD is applied. That is, even when the number of stacks or the thickness of the sheets 100 are different, at least one sheet may be formed to a thickness that is not destroyed by repeated application of ESD.

In addition, the laminate 2210 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided at the lower and upper portions of the capacitor unit 2220, respectively. That is, the laminate 2210 may include lower and upper cover layers respectively provided on the lowermost layer and the uppermost layer. Of course, the lowermost sheet, that is, the first sheet 101 may function as the lower cover layer, and the uppermost sheet, that is, the eleventh sheet 111 may function as the upper cover layer. The lower and upper cover layers provided separately from the sheet 100 may be formed to have the same thickness. However, the lower and upper cover layers may be formed in other thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, the lower and upper cover layers may be provided by stacking a plurality of magnetic sheets. In addition, a nonmagnetic sheet, for example, a glassy sheet, may be further formed on the outer surfaces of the lower and upper cover layers made of magnetic sheets, that is, the lower and upper surfaces of the laminate 2210. However, the lower and upper cover layers may be formed of glassy sheets, and the surface of the laminate 2210 may be coated with a polymer or glass material. Meanwhile, the lower and upper cover layers may be thicker than the thickness of each of the sheets 100. That is, the cover layer may be thicker than the thickness of one sheet. Thus, the lowermost and uppermost sheets, i.e., the first and

eleventh sheets

101 and 111, may function thicker than each of the sheets 102 to 110 therebetween when functioning as the lower and upper cover layers.

2. 캐패시터부2. Capacitor

At least one

capacitor portion

2220a, 2220b; 2000 is formed in the stack 2210. For example, first and

second capacitor parts

2220a and 2220b may be provided below and over the overvoltage protection part 2230. However, the first and

second capacitor parts

2220a and 2220b are referred to for convenience because the plurality of internal electrodes 200 are formed by being divided with the overvoltage protection part 2230 interposed therebetween, and the inside of the laminate 2210 functions as a capacitor. A plurality of internal electrodes 200 may be formed.

The capacitor unit 2220 is provided below and above the overvoltage protection unit 2230, respectively, and may include at least two or more internal electrodes and at least two or more sheets provided therebetween. For example, the first capacitor portion 2220a may include the first to fourth sheets 101 to 104 and the first to fourth internal electrodes 201 to 204 formed on the first to fourth sheets 101 to 104, respectively. It may include. In addition, the second capacitor unit 2220b includes seventh to tenth sheets 107 to 110 and fifth to eighth internal electrodes 205 to 208 formed on the seventh to tenth sheets 107 to 110, respectively. It may include. Herein, the internal electrodes 201 to 208 and 200 may be formed to have a thickness of, for example, 1 μm to 10 μm. In addition, the plurality of inner electrodes 200 are formed such that one side of the plurality of inner electrodes 200 and the

outer electrodes

2241, 2242 and 4000 are formed to face each other in the X direction, and the other side thereof is spaced apart from each other. For example, the first, third, fifth, and seventh

internal electrodes

201, 203, 205, 207 are disposed on the first, third, seventh, and

ninth sheets

101, 103, 107, 109. Each of them is formed in a predetermined area, and is formed such that one side is connected to the second external electrode 2242 and the other side is spaced apart from the first external electrode 2241. In addition, the second, fourth, sixth, and eighth

internal electrodes

202, 204, 206, and 208 are predetermined on the second, fourth, eighth, and

tenth sheets

102, 104, 108, and 110, respectively. It is formed to have an area and is formed such that one side is connected to the first external electrode 2241 and the other side is spaced apart from the second external electrode 2242. That is, the plurality of internal electrodes 200 are alternately connected to any one of the external electrodes 2240 and formed to overlap a predetermined region with the sheets 102 to 104 and 108 to 110 therebetween. In addition, the internal electrode 200 may have a length in the X direction and a width in the Y direction smaller than the length and width of the laminate 2210. In other words. The internal electrode 200 may be formed smaller than the length and width of the sheet 100. For example, the internal electrode 200 may be formed to have a length of 10% to 90% and a width of 10% to 90% of the length of the laminate 2210 or the sheet 100. In addition, the internal electrode 200 may be formed with an area of 10% to 90% of the area of each sheet 100. Meanwhile, the plurality of internal electrodes 200 may be formed in various shapes, for example, square, rectangular, predetermined pattern shapes, spiral shapes having a predetermined width and spacing. Capacitors 2220 have capacitances formed between the internal electrodes 200, respectively, and the capacitance may be adjusted according to the overlapping area of the internal electrodes 200, the thickness of the sheets 100, and the like. Meanwhile, at least one internal electrode may be further formed in addition to the first to eighth internal electrodes 201 to 208, and at least one sheet on which at least one internal electrode is formed may be further formed in the capacitor unit 2220. In addition, two internal electrodes may be formed in the first and

second capacitor parts

2220a and 2220b, respectively. That is, the present embodiment has been described as an example in which four internal electrodes of the first and

second capacitors

2220a and 2220b are formed, respectively, but two or more internal electrodes may be formed.

The internal electrode 200 may be formed of a conductive material. For example, the internal electrode 200 may be formed of a metal or a metal alloy including any one or more components of Al, Ag, Au, Pt, Pd, Ni, and Cu. In the case of an alloy, for example, Ag and Pd alloys may be used. Meanwhile, Al may form aluminum oxide (Al ₂ O ₃ ) on its surface during firing and maintain Al therein. That is, when Al is formed on the sheet, it comes into contact with air. In the Al process, the surface is oxidized to form Al ₂ O ₃ , and the inside maintains Al as it is. Therefore, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, in addition to Al, various metals having an insulating layer, preferably a porous insulating layer, may be used on the surface. Meanwhile, the internal electrode 200 may be formed so that at least one region has a thin thickness or at least one region is removed to expose the sheet. However, even if the thickness of at least one region of the internal electrode 200 is thin or at least one region is removed, the connected state is maintained as a whole so that there is no problem in electrical conductivity.

Meanwhile, the internal electrodes 201 to 204 of the first capacitor part 2220a and the internal electrodes 205 to 208 of the second capacitor part 2220b may be formed in the same shape and the same area, and the overlapping area may also be May be the same. However, the first internal electrode 201 and the eighth internal electrode 208 may overlap the external electrode 2240, and the first and eighth

internal electrodes

201 and 208 may be formed of the remaining internal electrodes 202 to 202. 207 may be formed longer than. That is, the first and eighth

internal electrodes

201 and 208 are formed to partially overlap the first and second

external electrodes

2241 and 2242, respectively, so that parasitic capacitances are formed therebetween, so that the first and eighth

internal electrodes

201 and 208 are formed. The

electrodes

201 and 208 may be formed, for example, about 10% longer than the remaining internal electrodes 202 to 207. In addition, in the first and eighth

internal electrodes

201 and 208, an area overlapping the external electrode 2240 may be formed wider than the remaining areas. For example, the first and eighth

internal electrodes

201 and 208 may be formed to be about 10% wider than a region overlapping with the external electrode 2240 or a region not adjacent thereto. In this case, regions of the first and eighth

internal electrodes

201 and 208 that do not overlap with the external electrodes 2240 may be the same as the widths of the remaining internal electrodes 202 to 209. Meanwhile, the sheets 101 to 104 of the first capacitor unit 2220a and the sheets 107 to 110 of the second capacitor unit 2220b may have the same thickness. In this case, when the first sheet 101 functions as the lower cover layer, the first sheet 101 may be formed thicker than the remaining sheets. Therefore, the first and

second capacitor parts

2220a and 2220b may have the same capacitance. However, the first and

second capacitor parts

2220a and 2220b may have different capacitances, and in this case, at least one of the area of the inner electrode, the overlapping area of the inner electrode, and the thickness of the sheet may be different from each other. In addition, the internal electrodes 201 to 208 of the capacitor unit 2220 may be formed longer than the discharge electrode 310 of the overvoltage protection unit 2230, and may have a large area.

3. 과전압 보호부3. Overvoltage Protection

The overvoltage protection unit 2230 may include at least two

discharge electrodes

311, 312; 310 spaced apart in the vertical direction, and at least one overvoltage protection member 320 provided between the discharge electrodes 310. For example, the overvoltage protection unit 2230 may include the first and

second discharge electrodes

311 and 312 formed on the fifth and

sixth sheets

105 and 106 and the fifth and

sixth sheets

105 and 106, respectively. ) And an overvoltage protection member 320 formed through the sixth sheet 106. Here, the overvoltage protection member 320 may be formed such that at least a portion thereof is connected to the first and

second discharge electrodes

311 and 312. The first and

second discharge electrodes

311 and 312 may be formed to have the same thickness as the internal electrodes 200 of the capacitor unit 2220. For example, the first and

second discharge electrodes

311 and 312 may be formed to a thickness of 1 μm to 10 μm. However, the first and

second discharge electrodes

311 and 312 may be formed thinner or thicker than the internal electrode 200 of the capacitor unit 2220. The first discharge electrode 311 is connected to the first external electrode 2241 and is formed on the fifth sheet 105, and the distal end part is connected to the overvoltage protection member 320. The second discharge electrode 312 is connected to the second external electrode 2242 and formed on the sixth sheet 106, and the distal end portion is connected to the overvoltage protection member 320.

In this case, the

discharge electrodes

311 and 312 are formed to be connected to the adjacent inner electrode 200 and the same outer electrode 2240. That is, the first discharge electrode 311 is connected to the adjacent fourth internal electrode 204 and the first external electrode 2241, and the second discharge electrode 312 is connected to the adjacent fifth internal electrode 205 and the second external. Is connected to an electrode 2242. As such, when the discharge electrode 310 and the inner electrode 200 adjacent thereto are connected to the same outer electrode 2240, the ESD voltage is not applied to the electronic device even when the insulating sheet 100 is deteriorated, that is, the dielectric breakdown. That is, when the insulating sheet 100 is dielectrically broken when the discharge electrode 310 and the inner electrode 200 adjacent to each other are connected to different external electrodes 2240, the ESD voltage applied through the one external electrode 2240 is discharge electrode ( The internal electrode 200 adjacent to 310 flows to the other external electrode 2240. For example, when the first discharge electrode 311 is connected to the first external electrode 2241 and the fourth internal electrode 204 adjacent thereto is connected to the second external electrode 2242, the insulating sheet 100 breaks down the insulation. When the conductive path is formed between the first discharge electrode 311 and the fourth internal electrode 204, the ESD voltage applied through the first external electrode 2241 is the first discharge electrode 311, and the dielectric breakdown fifth is performed. It may flow to the insulating sheet 105 and the second internal electrode 202, and thus may be applied to the internal circuit through the second external electrode 2242. In order to solve this problem, the thickness of the insulating sheet 100 can be formed to be thick, but in this case, there is a problem that the size of the electric shock prevention device increases. However, even when the discharge electrode 310 and the inner electrode 200 adjacent thereto are connected to the same outer electrode 2240, the ESD voltage is not applied into the electronic device even when the insulating sheet 100 is destroyed. In addition, it is possible to prevent the ESD voltage from being applied without forming the thickness of the insulating sheet 100 thickly.

Meanwhile, regions in contact with the overvoltage protection member 320 of the first and

second discharge electrodes

311 and 312 may be formed the same size or smaller than the overvoltage protection member 320. In addition, the first and

second discharge electrodes

311 and 312 may be formed to completely overlap without leaving the overvoltage protection member 320. That is, the edges of the first and

second discharge electrodes

311 and 312 may form a vertical component with the edges of the overvoltage protection member 320. Of course, the first and

second discharge electrodes

311 and 312 may be formed to overlap a part of the overvoltage protection member 320. For example, the first and

second discharge electrodes

311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection member 320. That is, the first and

second discharge electrodes

311 and 312 are not formed beyond the overvoltage protection member 320. Meanwhile, the first and

second discharge electrodes

311 and 312 may be formed to have a larger area than one in contact with the overvoltage protection member 320.

The overvoltage protection member 320 may be formed in a predetermined region, for example, a central portion of the sixth sheet 106, and may be connected to the first and

second discharge electrodes

311 and 312. In this case, the overvoltage protection member 320 may be formed to at least partially overlap the first and

second discharge electrodes

311 and 312. That is, the overvoltage protection member 320 may be formed to overlap 10% to 100% of the horizontal area with the first and

second discharge electrodes

311 and 312. The overvoltage protection member 320 may be formed to form a through hole having a predetermined size in a predetermined region, for example, a central portion of the sixth sheet 106, and fill the through hole using a thick film printing process. The protective layer 330 may be formed, for example, with a diameter of 100 μm to 500 μm and a thickness of 10 μm to 50 μm. At this time, the thinner the thickness of the overvoltage protection member 320, the lower the discharge start voltage. The overvoltage protection member 320 may be formed using a conductive material and an insulating material. For example, the overvoltage protection member 320 may be formed by printing a mixed material of the conductive ceramic and the insulating ceramic on the sixth sheet 106. Meanwhile, the overvoltage protection member 320 may be formed on at least one sheet 100. That is, the overvoltage protection members 320 are formed on at least one sheet, for example, two sheets 100 stacked in a vertical direction, and discharge electrodes are formed on the sheet 100 so as to be spaced apart from each other. 320). The structure, material, and the like of the overvoltage protection member 320 will be described later.

4. 외부 전극4. External electrode

The

external electrodes

2241, 2242 and 4000 may be provided on two surfaces facing each other outside the stack 2210. For example, the external electrodes 2240 may be formed on two opposite surfaces of the stack 2210 in the X direction, that is, the length direction. In addition, the external electrode 2240 may be connected to the internal electrode 200 and the discharge electrode 310 in the stack 2210. In this case, any one of the external electrodes 2240 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 2241 may be connected to an internal circuit, and the second external electrode 2242 may be connected to a metal case. In addition, the second external electrode 2242 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

The external electrode 2240 may be formed in various ways. That is, the external electrode 2240 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as deposition, sputtering, plating, and the like. On the other hand, the external electrode 2240 may be formed to extend on the surface in the Y direction and Z direction. That is, the external electrode 2240 may extend from two surfaces facing in the X direction to four adjacent surfaces. For example, when immersed in the conductive paste, the external electrodes 2240 may be formed not only on two opposite sides of the X direction, but also on the front and rear surfaces of the Y direction and the upper and lower surfaces of the Z direction. In contrast, when formed by printing, deposition, sputtering, plating, or the like, the external electrode 2240 may be formed on two surfaces in the X direction. That is, the external electrode 2240 may be formed not only on one side mounted on the printed circuit board and the other side connected to the metal case, but also in other areas according to the forming method or process conditions. The external electrode 2240 may be formed of a metal having electrical conductivity. For example, the external electrode 2240 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, at least one portion of the external electrode 2240 connected to the internal electrode 200 and the discharge electrode 310, that is, at least one surface of the stack 2210 may be formed to be connected to the internal electrode 200 and the discharge electrode 310. A portion of the external electrode 2240 to be connected may be formed of the same material as the internal electrode 200 and the discharge electrode 310. For example, when the internal electrode 200 and the discharge electrode 310 are formed using copper, at least a part of the internal electrode 200 and the external electrode 2240 may be formed using copper. In this case, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by deposition, sputtering, plating, or the like. Preferably, the external electrode 2240 may be formed by plating. In order to form the external electrode 2240 by the plating process, a seed layer may be formed on upper and lower surfaces of the laminate 2210, and then a plating layer may be formed from the seed layer to form the external electrode 2240. Here, at least a part of the external electrode 2240 connected to the internal electrode 200 and the discharge electrode 310 may be an entire side surface of the stack 2210 on which the external electrode 2240 is formed, or may be a partial region. .

In addition, the external electrode 2240 may further include at least one plating layer. The external electrode 2240 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 2240 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, the Cu plating layer, Ni plating layer and Sn plating layer may be laminated. In addition, the external electrode 2240 may be formed by mixing, for example, glass frit having a multi-component glass frit containing 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ as a main component. In this case, the mixture of the glass frit and the metal powder may be manufactured in a paste form and applied to two surfaces of the laminate 2210. As the glass frit is included in the external electrode 2240, the adhesion between the external electrode 2240 and the stack 2210 may be improved, and the contact reaction between the electrodes in the stack 2210 may be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the upper portion, thereby forming the external electrode 2240. That is, the metal layer including the glass and at least one plating layer thereon may be formed to form the external electrode 2240. For example, the external electrode 2240 may be sequentially formed of a Ni plating layer and a Sn plating layer through electrolytic or electroless plating after forming a layer including glass frit and at least one of Ag and Cu. In this case, the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer. Of course, the external electrode 2240 may be formed of only at least one plating layer. That is, the external electrode 2240 may be formed by forming at least one layer of the plating layer using at least one plating process without applying the paste. Meanwhile, the external electrode 5000 may be formed to have a thickness of 2 μm to 100 μm, the Ni plating layer may be formed to have a thickness of 1 μm to 10 μm, and the Sn or Sn / Ag plating layer may have a thickness of 2 μm to 10 μm. Can be formed.

Meanwhile, the external electrode 2240 may be formed to overlap a predetermined region with the internal electrode 200 connected to the different external electrodes 2240. For example, a portion extending below and above the stack 2210 of the first external electrode 2241 may overlap a predetermined region of the internal electrodes 200. In addition, portions formed to extend below and above the stack 2210 of the second external electrode 2242 may also be formed to overlap the predetermined regions of the internal electrodes 200. For example, portions extending above and below the stack 2210 of the external electrode 2240 may overlap the first and eighth

internal electrodes

201 and 208. That is, at least one of the external electrodes 2240 may be extended to the upper and lower surfaces of the stack 2210, and at least one of the extended portions may be partially overlapped with the internal electrodes 200. In this case, an area of the internal electrode 200 overlapping the external electrode 2240 may be 1% to 10% of the total area of the internal electrode 200. In addition, the external electrode 2240 may increase an area formed on at least one of the upper and lower surfaces of the laminate 2210 by a plurality of processes.

By overlapping the external electrode 2240 and the internal electrode 200, a predetermined parasitic capacitance may be generated between the external electrode 2240 and the internal electrode 200. For example, capacitance may be formed between the first and eighth

internal electrodes

201 and 208 and the extensions of the first and second

external electrodes

2241 and 2242. Therefore, the capacitance of the composite protective device may be adjusted by adjusting the overlapping area of the external electrode 2240 and the internal electrode 200. However, since the capacitance of the composite protective element affects the antenna performance in the electronic device, the dispersion of the capacitance of the composite protective element is maintained within 20%, preferably within 5%. To this end, the sheet 100 manufactured using a material having a high dielectric constant is used. However, as the dielectric constant of the sheet 100 increases, the influence of parasitic capacitance between the inner electrode 200 and the outer electrode 2240 increases. That is, when the dielectric constants of the first and

eleventh sheets

101 and 111 provided between the inner electrode 200 and the outer electrode 2240 are high, the parasitic capacitance increases. However, since the permittivity of the outermost first and

eleventh sheets

101 and 111 is lower than the permittivity of the remaining sheets 102 to 110, the parasitic capacitance between the inner electrode 200 and the outer electrode 2240 is reduced. Can reduce the impact. That is, since the dielectric constant of the first and

eleventh sheets

101 and 111 is low, parasitic capacitance between the inner electrode 200 and the outer electrode 2240 may be reduced.

5. 표면 개질 부재5. Surface modification member

Meanwhile, before forming the external electrode 2240, an oxide may be distributed on the surface of the laminate 2210 to form a surface modification member (ie, an insulation member). In this case, the oxide may be dispersed and distributed on the surface of the laminate 2210 in a particulate state or a molten state. In addition, the oxide may be distributed before forming a part of the external electrode 2240 by the printing process, or may be distributed before performing the plating process. That is, when the external electrode 2240 is formed by the plating process, the oxide may be distributed on the surface of the laminate 2210 before the plating process. Thus, by distributing the oxide before the plating process, the resistance of the surface of the laminate 2210 can be made uniform, whereby the plating process can be performed uniformly. That is, the surface of the laminate 2210 may have a resistance at least in one region different from that in other regions. If the plating process is performed in a state where the resistance is uneven, the plating proceeds better than the region having high resistance in the region having low resistance. As a result, growth unevenness of the plating layer occurs. Therefore, in order to solve this problem, the surface resistance of the laminate 2210 needs to be maintained uniformly, and for this purpose, a resistance control member may be formed by dispersing oxides in a particulate state or a molten state on the surface of the laminate 2210. have. In this case, the oxide may be partially distributed on the surface of the laminate 2210, may be distributed on the surface of the laminate 2210, and may be formed in a film form, and may be formed in a film form in at least one region and at least one region. It may be partially distributed at. For example, the oxide may be distributed in the form of islands on the surface of the laminate to form a resistance adjusting member. That is, oxides in a particulate state or a molten state may be spaced apart from each other and distributed in an island form on the surface of the laminate 2210, and thus at least a portion of the surface of the laminate 2210 may be exposed. In addition, oxides may be distributed over the entire surface of the laminate 2210, and oxides having a predetermined thickness may be formed by connecting oxides in a particle state or a molten state with each other. In this case, since an oxide film is formed on the surface of the stack 2210, the surface of the stack 2210 may not be exposed. The oxide may be formed in a film form in at least one region and distributed in an island form in at least a portion thereof. That is, at least two oxides may be connected to each other to form a film in at least one region and may be formed in an island form at least in part. Thus, at least a portion of the laminate surface may be exposed by the oxide. The total area of the resistance adjusting member 400 made of an oxide distributed in at least a portion may be, for example, 10% to 90% of the total area of the surface of the laminate 2210. Here, at least one oxide may be used as the oxide in the granular state or in the molten state to uniform the surface resistance of the laminate 2210. For example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO At least one of Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ , and CaCO ₃ may be used. .

On the other hand, the surface modification member may be distributed over the entire region of the laminate 2210, or may be distributed only in at least one region. That is, the surface modification member may be formed on the entire surface of the laminate 2210 or may be formed only in an area in contact with the external electrode 2240 of the laminate 2210. In other words, the surface modification member in which the surface modification member is formed on a part of the surface of the laminate 2210 may be formed between the laminate 2210 and the external electrode 2240. In this case, the surface modification member may be formed in contact with the extension region of the external electrode 2240. That is, a surface modification member may be provided between one region of the external electrode 2240 and the laminate 2210 that extends to the top and bottom surfaces of the laminate 2210. In addition, the surface modification member may be provided in the same or different size than the external electrode 2240 formed thereon. For example, an area of 50% to 150% of an area of a part of the external electrode 2240 extending to the upper and lower surfaces of the stack 2210 may be formed. That is, the surface modification member may be formed to be smaller or larger than the size of the extension region of the external electrode 2240, or may be formed to the same size. Of course, the surface modification member may also be formed between the external electrode 2240 formed on the side surface of the laminate 2210. Such surface modification members may comprise a glass material. For example, the surface modification member may include non-borosilicate glass (SiO ₂ —CaO—ZnO—MgO-based glass) that is calcinable at a predetermined temperature, for example, 950 ° C. or less. In addition, the surface modification member may further include a magnetic material. That is, when the region on which the surface modification member is to be formed is formed of the magnetic sheet, a magnetic material may be partially included in the surface modification member to facilitate bonding of the surface modification member and the magnetic sheet. In this case, the magnetic material may include, for example, NiZnCu-based magnetic powder, and may include, for example, 1-15 wt% of the magnetic material with respect to 100 wt% of the glass material. Meanwhile, at least a portion of the surface modification member may be formed on the surface of the laminate 2210. In this case, at least a portion of the glass material may be evenly distributed on the surface of the laminate 2210, and at least a portion of the glass material may be irregularly distributed in different sizes. Of course, the surface modification member may be continuously formed on the surface of the laminate 2210 to have a film form. In addition, a recess may be formed on at least part of the surface of the laminate 2210. That is, a glass material may be formed to form a convex portion, and at least a portion of the region where the glass material is not formed may be dug to form a recess. In this case, the glass material may be formed to a predetermined depth from the surface of the laminate 2210, and at least a portion thereof may be formed higher than the surface of the laminate 2210. That is, at least a portion of the surface modification member may be coplanar with the surface of the laminate 2210, and at least a portion thereof may be maintained higher than the surface of the laminate 2210. Thus, the surface of the laminate 2210 may be modified by distributing a glass material in a portion of the laminate 2210 before forming the external electrode 2240 to form a surface modification member, thereby making the surface resistance uniform. Can be. Therefore, the shape of the external electrode 2240 can be controlled, thereby facilitating the formation of the external electrode.

Meanwhile, the composite protection unit 2000 according to the present invention may be modified in various shapes, and the composite protection unit 2000 according to another embodiment of the present invention is illustrated in FIGS. 13 to 16.

13 is a perspective view of a composite protection unit according to another embodiment of the present invention, and FIG. 14 is a sectional view. 15 is a cross-sectional view of a composite protective part according to a modified example of another embodiment of the present invention. And, Figure 16 is a cross-sectional view showing the shape of the composite protective portion and the contact portion according to another embodiment of the present invention.

13 to 16, a composite protection device according to another embodiment of the present invention may include a laminate 100, at least two internal electrodes 200 provided in the laminate 1000, and at least two interiors. At least one overvoltage overvoltage protection unit 300 provided between the electrodes 200, at least two connection electrodes 400 provided inside the stack 100 to be connected to at least two internal electrodes 200, respectively, It includes an external electrode 500 formed on the outside of the stack 100 to be connected to the electrode 400. That is, in another embodiment of the present invention, the overvoltage protection member is provided between the two internal electrodes 200 without having a separate discharge electrode. In other words, the internal electrode 200 provided with the overvoltage protection member interposed therebetween functions as a discharge electrode from the outside and functions as a capacitor to form capacitance. Here, the stack 100 and the overvoltage overvoltage protection unit 300 are the same as the stack 2110 and the overvoltage protection unit 2130 described in the embodiment of the present invention, and the internal electrode 200 is the capacitor of the embodiment. The internal electrode 200 of the 2200 has the same configuration, and the external electrode 500 has a different shape and the same configuration as the external electrode 2250. Accordingly, another embodiment of the present invention will be described below with reference to a part different from the description of the embodiment.

내부 전극Internal electrode

At least two

internal electrodes

210, 220; 200 may be provided to be spaced apart from each other within the stack 100. That is, at least two internal electrodes 200 may be formed to be spaced apart by a predetermined interval in the stacking direction of the sheet, that is, the Z direction. In addition, at least two internal electrodes 200 may be formed with the overvoltage protection unit 300 interposed therebetween. For example, the first internal electrode 210 may be formed below the overvoltage protection part 300 in the Z direction, and the second internal electrode 220 may be formed above the overvoltage protection part 300. Of course, at least one internal electrode may be further formed between the first and second internal electrodes 210 and the lowermost and uppermost sheets. Here, the internal electrodes 200 are formed to be connected to the connection electrodes 400 and to the overvoltage protection unit 300, respectively. That is, the first internal electrode 210 is formed such that one side is connected to the first connection electrode 410 and the other side is connected to the overvoltage protection unit 300. In addition, the second internal electrode 220 is formed such that one side is connected to the second connection electrode 420 and the other side is connected to the overvoltage protection part 300. In this case, one surface of the first and second

internal electrodes

210 and 220 facing each other is connected to the overvoltage protection unit 300.

The internal electrode 200 may act as a capacitor and also as a discharge electrode of the overvoltage protection unit 300. The capacitor is formed by the first and second internal electrodes 200 and the sheets therebetween. The capacitance may be adjusted according to the overlapping area of the first and second internal electrodes 200, the thickness of the sheet between the first and second internal electrodes 200, and the like. In addition, at least a region overlapping the overvoltage protection unit 300 serves as a discharge electrode, and the first and second internal electrodes 200 transmit overvoltage such as ESD applied from the outside to the overvoltage protection unit 300. The overvoltage protection unit 300 transmits the overvoltage bypassed to the ground terminal of the electronic device, for example.

연결 전극Connecting electrode

The connection electrode 400 is formed in the stack 100 and is formed between the internal electrode 300 and the external electrode 500. That is, the connection electrode 400 is formed to connect the internal electrode 300 and the external electrode 500. Accordingly, the connecting electrode 400 is connected between the first and second

external electrodes

510, 520; 500 and the first and second

internal electrodes

210, 220; 200, respectively. It may include

electrodes

410 and 420. At least one of the planar shape and the cross-sectional shape may have a polygonal shape of at least one of a circular shape, an ellipse shape, a rectangular shape, a square shape, a pentagon shape, and have a predetermined thickness. That is, the overvoltage protection unit 300 may be formed in the shape of a cylinder, a hexahedron, a polyhedron. In addition, the connection electrode 400 may be formed to at least overlap the overvoltage protection unit 300. Preferably, the connection electrode 400 may be formed at the center of the stack 100 and may overlap the overvoltage protection unit 300.

The connection electrode 400 is formed to form an opening in a predetermined region of at least one or more sheets stacked on the internal electrode 200 and to fill the opening by using a conductive material. For example, the connection electrode 400 may be formed of a metal or a metal alloy including any one or more components of Al, Ag, Au, Pt, Pd, Ni, and Cu. Of course, the connection electrode 400 may be formed using various conductive materials in addition to the metal.

The connection electrode 400 may be formed in the Z direction, that is, the height in the vertical direction is the same as or different from the height of the overvoltage protection part 300, and the width in the X direction and the Y direction is the width of the overvoltage protection part 300. It may be more identical or different. That is, the connection electrode 400 may be formed to be greater than or equal to the height of the overvoltage protection part 300, and may be formed to be equal to or greater than the diameter or width. Preferably, the height of the connection electrode 400 may be higher than the height of the overvoltage protection part 300, and the plane width may be larger than the plane width of the overvoltage protection part 300. For example, each of the first and

second connection electrodes

410 and 420 may be formed to have a height of 0.5 to 3 times the height of the overvoltage protection part 300. In addition, the sum of the heights of the first and

second connection electrodes

410 and 420 may be formed to be one to six times the height of the overvoltage protection part 300. For example, the sum of the heights of the first and

second connection electrodes

410 and 420 may be formed to be 100 μm to 1000 μm, preferably 200 μm to 900 μm, and more preferably 400 μm to 700 μm. . In this case, heights of the first and

second connection electrodes

410 and 420 may be different from each other, and widths thereof may also be different from each other. In addition, the width of the X direction of the connection electrode 400 may be formed from 1% to 90% of the length of the X direction of the laminate 100, and the width of the Y direction is 5 of the width of the Y direction of the laminate 100. It may be formed from% to 90%. In this case, the width of the X direction and the width of the Y direction of the connection electrode 400 may be the same or different. That is, the width of at least one region including the X-direction width and the Y-direction width of the connection electrode 400 may be the same as or different from the width of the other region. In other words, at least one region of the connection electrode 400 may be formed in an asymmetric shape. The width of the X and Y directions of the connection electrode 400 may be formed to be 1 to 10 times the width of the X and Y direction of the overvoltage protection part 300, and the X direction length and the Y direction of the internal electrode 200. It can be formed from 1/10 times to 1 times the width of the direction, respectively. That is, the width of the connection electrode 400 is shorter than the length and width of the laminate 100 in the X direction and the Y direction, is equal to or greater than the width of the overvoltage protection part 300, and is smaller than the width of the internal electrode 200. Or the same.

The connection electrode 400 functions to connect the external electrode 500 and the internal electrode 200. Therefore, an overvoltage such as ESD applied through the external electrode 500 is transferred to the internal electrode 200 and the overvoltage protection unit 300 through the connection electrode 400, and the overvoltage through the overvoltage protection unit 300 is again. It is transferred to the external electrode 500 through the internal electrode 200 and the connection electrode 400. In addition, since the connection electrode 400 is formed in the center of the stack 100 and preferably wider than the width of the overvoltage protection unit 300, parasitic resistance and parasitic inductance may be reduced. That is, the parasitic resistance and the parasitic inductance can be reduced as compared with the case where the connection electrode 400 is formed outside the laminate 100. Therefore, the insertion loss of S21 can be reduced in the wireless communication frequency range of 700 MHz to 3 GHz. In addition, since the connection electrode 400 is formed to have a width wider than the width of the overvoltage protection part 300, it is possible to prevent deterioration due to repetitive ESD voltages and to suppress an increase in the discharge start voltage. That is, the overvoltage protection unit 300 bypasses the ESD voltage by generating a spark therein, for example, by ESD energy. When the thickness of the connection electrode 400 is thin, the connection electrode 400 is repeated according to a repetitive ESD voltage. This loss may cause an increase in discharge start voltage. However, by forming the thickness of the connection electrode 400 to 10 μm or more, the loss of the connection electrode 400 due to the repetitive ESD voltage can be prevented, thereby preventing the rise of the discharge start voltage.

외부 전극External electrode

The

external electrodes

510, 520 and 500 may be provided on two surfaces of the stack 100 that face each other. For example, the external electrodes 500 are two opposite surfaces of the stack 100 in the Z direction, that is, the vertical direction. That is, it may be formed on the lower surface and the upper surface, respectively. In addition, the external electrodes 500 may be connected to the connection electrodes 400 inside the stack 100, respectively. In this case, any one of the external electrodes 500 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 510 may be connected to an internal circuit, and the second external electrode 520 may be connected to a metal case. In addition, the second external electrode 520 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

On the other hand, the external electrode 500 may be formed on the entire surface of the lower surface and the upper surface, or may be formed on a portion of the lower surface and the upper surface. That is, the external electrode 500 may be formed in the remaining regions except for a predetermined width from edges of the lower and upper surfaces. For example, the external electrode 500 may be formed with an area of 50% to 95% except for a predetermined width from edges of the lower surface and the upper surface. In addition, the external electrode 500 may be formed on the entire area of the lower surface and the upper surface, and may extend from the upper and lower portions thereof to be formed on the other side. That is, the external electrode 500 may extend to a predetermined region of the lower and upper surfaces facing in the Z direction as well as the surfaces facing the X and Y directions, respectively. For example, when immersed in the conductive paste, the external electrode 500 may be formed not only on the upper and lower surfaces of the Z direction but also on the side surfaces in the X and Y directions. In contrast, when formed by printing, deposition, sputtering, plating, or the like, the external electrode 500 may be formed on the lower and upper surfaces of the Z direction with a predetermined area. That is, the external electrode 500 may be formed not only on the lower surface mounted on the printed circuit board and the upper surface connected to the metal case, but also in other areas according to the formation method or process conditions.

Meanwhile, as shown in FIG. 15, the composite protection unit according to another embodiment of the present invention may further include an expansion unit 350 in which the overvoltage overvoltage protection unit 300 is widened at least one region. That is, the overvoltage protection unit 300 may further include an expansion unit 350 having a wide width of at least one region. The expansion unit 350 may have a width of 1% to 150% of the diameter of the overvoltage protection unit 300. That is, the width of the expansion unit 350 may be formed to have a width of 1% to 150% of the width of other regions of the overvoltage protection unit 300 in which the expansion unit 350 is not formed. For example, the expansion unit 350 may be formed to have a diameter of the overvoltage protection unit 300 plus 10 μm to 100 μm. In addition, the height of the expansion unit 350 may be formed to a height of 10% to 70% of the overall height of the overvoltage protection unit 300. As such, the expansion unit 350 is formed to block the short path of the overvoltage protection unit 300. That is, when an overvoltage such as ESD is continuously applied, a melting phenomenon of the connection electrode 400 occurs, and thus a connection phenomenon may occur due to the connection electrode material being adhered to the sidewall of the through hole of the overvoltage protection part 300. Can be. However, the short path may be blocked by the expansion unit 350 having a different diameter in the overvoltage protection unit 300.

As described above, the composite protective part according to another exemplary embodiment of the present invention may include a connection electrode 400 formed at the center of the laminate 100 and preferably formed in a wider width than the width of the overvoltage protection part 300. And parasitic inductance can be reduced. That is, the parasitic resistance and the parasitic inductance can be reduced as compared with the case where the connection electrode 400 is formed outside the laminate 100. Therefore, the insertion loss of S21 can be reduced in the wireless communication frequency range of 700 MHz to 3 GHz. In addition, since the connection electrode 400 is formed to have a width wider than the width of the overvoltage protection part 300, it is possible to prevent deterioration due to repetitive ESD voltages and to suppress an increase in the discharge start voltage. That is, the overvoltage protection unit 300 bypasses the ESD voltage by generating a spark therein, for example, by ESD energy. When the thickness of the connection electrode 400 is thin, the connection electrode 400 is repeated according to a repetitive ESD voltage. This loss may cause an increase in discharge start voltage. However, by forming the thickness of the connection electrode 400 to 10 μm or more, the loss of the connection electrode 400 due to the repetitive ESD voltage can be prevented, thereby preventing the rise of the discharge start voltage.

Meanwhile, the composite protection device of the present invention may form the overvoltage protection member 320 or the overvoltage protection unit 300 of another embodiment in various forms, such as the overvoltage protection member 320 or the overvoltage protection unit 300. Various embodiments of the present invention are illustrated in FIGS. 17 to 19. Hereinafter, the overvoltage protection member 320 is illustrated, but the overvoltage protection unit 300 of another embodiment is also the same.

17 is a schematic cross-sectional view and a cross-sectional photograph of the overvoltage protection member 320 according to the first embodiment of the composite protection device of the present invention. That is, the overvoltage protection member 320 may be formed at least one region smaller or larger than another region, and FIG. 17 is an enlarged cross-sectional schematic diagram and cross-sectional photograph of a portion of the overvoltage protection member 320.

As shown in FIG. 17A, the overvoltage protection member 320 may be formed of an insulating material. In this case, the insulating material may be a porous insulating material including a plurality of pores (not shown). That is, a plurality of pores (not shown) may be formed in the overvoltage protection member 320. By forming pores, it is possible to more easily bypass overvoltage such as ESD. In addition, the overvoltage protection member 320 may be formed by mixing a conductive material and an insulating material. For example, the overvoltage protection member 320 may be formed by mixing a conductive ceramic and an insulating ceramic. In this case, the overvoltage protection member 320 may be formed by mixing the conductive ceramic and the insulating ceramic in a mixing ratio of, for example, 10:90 to 90:10. As the mixing ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the mixing ratio of the conductive ceramic increases, the discharge starting voltage decreases. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted to obtain a predetermined discharge start voltage.

In addition, the overvoltage protection member 320 may be formed in a predetermined stacked structure by stacking a conductive layer and an insulating layer. That is, the overvoltage protection member 320 may be formed by stacking the conductive layer and the insulating layer at least once and separating the conductive layer and the insulating layer. For example, the overvoltage protection member 320 may be formed in a two-layer structure by laminating a conductive layer and an insulating layer, and may be formed in a three-layer structure by laminating the conductive layer, the insulating layer, and the conductive layer. In addition, the

conductive layers

321a, 321b; 321 and the insulating layer 322 may be repeatedly stacked a plurality of times to form a stacked structure of three or more layers. For example, as illustrated in FIG. 17B, an overvoltage protection member 320 having a three-layer structure in which the first conductive layer 321a, the insulating layer 322, and the second conductive layer 321b are stacked is provided. Can be formed. On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the uppermost layer and the lowest layer may be a conductive layer. In this case, a plurality of pores (not shown) may be formed in at least a portion of the conductive layer 321 and the insulating layer 322. For example, since the insulating layer 322 formed between the conductive layers 321 has a porous structure, a plurality of pores may be formed in the insulating layer 322.

In addition, a void may be further formed in the overvoltage protection member 320 in a predetermined region. For example, a void may be formed between the layer in which the conductive material and the insulating material are mixed, and a gap may be formed between the conductive layer and the insulating layer. That is, the first mixed layer, the void, and the second mixed layer of the conductive material and the insulating material may be laminated, and the conductive layer, the void, and the insulating layer may be laminated. For example, the overvoltage protection member 320 may include the first conductive layer 321a, the first insulating layer 322a, the void 323, and the second insulating layer 322b as shown in FIG. 17C. And the second conductive layer 321b may be stacked. That is, the insulating

layers

322a, 322b; 322 may be formed between the

conductive layers

321a, 321b; 321, and the voids 323 may be formed between the insulating layers 322. Of course, the overvoltage protection member 320 may be formed by repeatedly stacking the conductive layer, the insulating layer, and the gap. Meanwhile, when the conductive layer 321, the insulating layer 322, and the gap 323 are stacked, all of them may have the same thickness, and at least one thickness may be thinner than the others. For example, the void 323 may be thinner than the conductive layer 321 and the insulating layer 322. In addition, the conductive layer 321 may be formed to have the same thickness as the insulating layer 322, or may be formed thicker or thinner than the insulating layer 322. On the other hand, the void 323 may be formed by filling the polymer material and then performing a sintering process to remove the polymer material. For example, the first polymer material including conductive ceramics, the second polymer material including insulating ceramics, and the third polymer material not containing conductive ceramics or insulating ceramics are filled in the via hole, and then a firing process is performed. By removing the polymer material, a conductive layer, an insulating layer and a void can be formed. On the other hand, the gap 323 may be formed without being divided into layers. For example, the insulating layer 322 may be formed between the

conductive layers

321a and 321b, and a plurality of pores may be connected in the insulating layer 322 in a vertical direction or a horizontal direction to form a gap 323. That is, the gap 323 may be formed with a plurality of pores in the insulating layer 322. Of course, the void 323 may be formed in the conductive layer 321 by a plurality of pores.

On the other hand, the conductive layer 321 used for the overvoltage protection member 320 can flow a current with a predetermined resistance. For example, the conductive layer 321 may be a resistor having several kilowatts to several hundred kilowatts. The conductive layer 321 lowers the energy level when an overvoltage flows through the ESD, so that structural destruction of the composite protection device due to the overvoltage does not occur. That is, the conductive layer 321 serves as a heat sink that converts electrical energy into thermal energy. The conductive layer 321 may be formed using a conductive ceramic, and the conductive ceramic may use a mixture including at least one of La, Ni, Co, Cu, Zn, Ru, and Bi. In addition, the conductive layer 321 can be formed to a thickness of 1 μm to 50 μm. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 μm to 50 μm.

In addition, the insulating layer 322 used for the overvoltage protection member 320 may be made of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 500,000. For example, the insulating ceramic uses a mixture containing one or more of dielectric material powders such as MLCC, ZrO, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, Al ₂ O ₃ Can be formed. The insulating layer 322 may have a porous structure in which a plurality of pores having a size of about 1 nm to about 5 μm are formed to have a porosity of about 30% to about 80%. In this case, the shortest distance between the pores may be about 1nm to 5㎛. That is, the insulating layer 322 is formed of an electrically insulating material that does not flow current, but since pores are formed, current may flow through the pores. In this case, as the size of the pores increases or the porosity increases, the discharge start voltage may decrease. On the contrary, when the size of the pores decreases or the porosity decreases, the discharge start voltage may increase. However, when the pore size exceeds 5 μm or the porosity exceeds 80%, it may be difficult to maintain the shape of the overvoltage protection member 320. Therefore, the pore size and the porosity of the insulating layer 322 may be adjusted to adjust the discharge start voltage while maintaining the shape of the overvoltage protection member 320. Meanwhile, when the overvoltage protection member 320 is formed of a mixed material of an insulating material and a conductive material, the insulating material may use an insulating ceramic having fine porosity and porosity. In addition, the insulating layer 322 has a resistance lower than that of the sheet due to the fine pores, and partial discharge may be performed through the fine pores. That is, the micropore is formed in the insulating layer 322 and partial discharge is performed through the micropore. The insulating layer 322 may be formed to a thickness of 1㎛ 50㎛. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to be 1 μm to 50 μm.

Meanwhile, the overvoltage protection member 320 mixes at least one conductive material selected from Ru, Pt, Pd, Ag, Au, Ni, Cr, W, Fe, and the like with organic materials such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB). It can be formed from one material. In addition, the overvoltage protection member 320 may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ with the mixed material.

18 is a schematic cross-sectional view of the overvoltage protection member 320 according to the second embodiment of the composite protection device of the present invention. That is, the overvoltage protection member 320 may include a gap 323 as shown in FIG. 18A. That is, the overvoltage protection member 320 may have a void 323 formed in the opening formed through the sheet without filling the overvoltage protection material. In addition, the overvoltage protection member 320 may have a porous insulating material formed in at least one region of the through hole. That is, as shown in (b) of FIG. 18, a porous insulating material may be applied to the sidewall of the through-hole to form an insulating layer 322, and as shown in (c) of FIG. 18, upper and lower portions of the through-hole. An insulating

layer

322a, 322b; 322 may be formed on at least one of the insulating

layers

322a, 322b;

19 is a schematic cross-sectional view of the overvoltage protection member 320 according to the third embodiment of the composite protection device of the present invention. As shown in FIG. 19, the overvoltage protection member 320 includes

discharge electrodes

311, 312, and 310. And a discharge induction layer 330 formed between the overvoltage protection member 320. That is, the discharge induction layer 330 may be further formed between the discharge electrode 310 and the overvoltage protection member 320. In this case, the discharge electrode 310 may include

conductive layers

311a and 312a and porous insulating

layers

311b and 312b formed on at least one surface of the

conductive layers

311a and 311a. Of course, the discharge electrode 310 may be a conductive layer on which a porous insulating layer is not formed.

The discharge induction layer 330 may be formed when the overvoltage protection member 320 is formed using a porous insulating material. In this case, the discharge induction layer 330 may be formed of a dielectric layer having a higher density than the overvoltage protection member 320. That is, the discharge induction layer 330 may be formed of a conductive material or may be formed of an insulating material. For example, when the overvoltage protection member 320 is formed by using porous ZrO and the internal electrode 200 is formed by using Al, a discharge induction layer of AlZrO is formed between the overvoltage protection member 320 and the discharge electrode 310. 330 may be formed. Meanwhile, TiO may be used instead of ZrO as the overvoltage protection member 320, and in this case, the discharge induction layer 330 may be formed of TiAlO. That is, the discharge induction layer 330 may be formed by the reaction of the discharge electrode 310 and the overvoltage protection member 320. Of course, the discharge induction layer 330 may be formed by further reacting the sheet material. In this case, the discharge induction layer 330 may be formed by a reaction of an internal electrode material (for example, Al), a protection material (for example, ZrO), and a sheet material (for example, BaTiO ₃ ). In addition, the discharge induction layer 330 may be formed by reacting with the sheet material. That is, the discharge induction layer 330 may be formed in a region where the overvoltage protection member 320 contacts the sheet by the reaction between the overvoltage protection member 320 and the sheet. Therefore, the discharge induction layer 330 may be formed to surround the overvoltage protection member 320. In this case, the discharge induction layer 330 between the overvoltage protection member 320 and the discharge electrode 310 and the discharge induction layer 330 between the overvoltage protection member 320 and the sheet may have different compositions. On the other hand, the discharge induction layer 330 may be formed by removing at least one region, and may be formed differently from other regions in at least one region. That is, the discharge induction layer 330 may be discontinuously formed by removing at least one region, and the thickness of the discharge induction layer 330 may be differently formed. The discharge induction layer 330 may be formed during the firing process. That is, the discharge induction layer 330 may be formed between the discharge electrode 310 and the overvoltage protection member 320 by diffusion of the discharge electrode material, the ESD protection material, and the like during the firing process at a predetermined temperature. Meanwhile, the discharge induction layer 330 may be formed to have a thickness of 10% to 70% of the thickness of the overvoltage protection member 320. That is, some thicknesses of the overvoltage protection member 320 may be changed to the discharge induction layer 330. Therefore, the discharge induction layer 330 may be formed thinner than the overvoltage protection member 320, and may be formed to be thicker, equal to, or thinner than the discharge electrode 310. The discharge induction layer 330 may reduce the level of the discharge energy of the ESD voltage induced by the overvoltage protection member 320. Therefore, it is possible to discharge the ESD voltage more easily to improve the discharge efficiency. In addition, since the discharge induction layer 330 is formed, diffusion of heterogeneous materials into the overvoltage protection member 320 may be prevented. That is, diffusion of the sheet material and the internal electrode material into the overvoltage protection member 320 may be prevented, and external diffusion of the overvoltage protection material may be prevented. Accordingly, the discharge induction layer 330 may be used as a diffusion barrier, thereby preventing breakage of the overvoltage protection member 320. Meanwhile, the overvoltage protection member 320 may further include a conductive material, in which case the conductive material may be coated with an insulating ceramic. For example, as described with reference to FIG. 17A, when the overvoltage protection member 320 is formed by mixing a porous insulating material and a conductive material, the conductive material may be coated using NiO, CuO, WO, or the like. have. Thus, a conductive material may be used as the material of the overvoltage protection member 320 together with the porous insulating material. In addition, in the case of using a conductive material in addition to the porous insulating material as the overvoltage protection member 320, for example, two

conductive layers

321a and 321b as shown in FIGS. 17B and 17C. In the case where the insulating layer 322 is formed therebetween, the discharge induction layer 330 may be formed between the conductive layer 321 and the insulating layer 322. Meanwhile, the discharge electrode 310 may be formed in a shape in which some regions are removed. That is, the discharge induction layer 330 may be formed in a region in which the discharge electrode 310 is partially removed and removed. However, even when the discharge electrode 310 is partially removed, the electrical characteristics are not degraded because the shape of the discharge electrode 310 is maintained as a whole.

The discharge electrode 310 may be formed of a metal or a metal alloy on which an insulating layer is formed. That is, the discharge electrode 310 may include

conductive layers

311a and 312a and porous insulating

layers

311b and 312b formed on at least one surface of the

conductive layers

311a and 312a. In this case, the porous insulating

layers

311b and 312b may be formed on at least one surface of the discharge electrode 310. That is, only one surface which is not in contact with the overvoltage protection member 320 and the other surface which is in contact with each other may be formed, and one surface which is not in contact with the overvoltage protection member 320 and the other surface which is in contact with the overvoltage protection member 320. Can be formed on both. In addition, the porous insulating

layers

311b and 312b may be formed on at least one surface of the

conductive layers

311a and 312a or may be formed on at least a portion thereof. In addition, at least one region may be removed from the porous insulating

layers

311b and 312b or may have a thin thickness. That is, the porous insulating

layers

311b and 312b may not be formed in at least one region on the

conductive layers

311a and 312a, and the thickness of at least one region may be thinner or thicker than the thickness of other regions. The discharge electrode 310 may be formed of Al to form an oxide film on the surface of the discharge electrode and maintain conductivity. That is, when Al is formed on the sheet, it comes into contact with air. In the Al process, the surface is oxidized to form Al ₂ O ₃ , and the inside maintains Al as it is. Therefore, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, in addition to Al, various metals having an insulating layer, preferably a porous insulating layer, may be used on the surface.

Meanwhile, in one embodiment of the present invention, the overvoltage protection member 320 is formed by embedding or applying an overvoltage protection material in a through hole formed in the sheet 106. However, the overvoltage protection member 320 may be formed in a predetermined region of the sheet, and the discharge electrode 310 may be formed to contact the overvoltage protection member 320, respectively. That is, as shown in the cross-sectional view of another example of FIG. 20, two

discharge electrodes

311 and 312 are formed on the sheet 105 at predetermined intervals in the horizontal direction, and overvoltage protection is performed between the two

discharge electrodes

311 and 312. Member 320 may be formed.

The overvoltage protection unit 2230 may include at least two

discharge electrodes

311 and 312 formed on the same plane and at least one ESD overvoltage protection member 320 provided between the at least two

discharge electrodes

311 and 312. It may include. That is, two

discharge electrodes

311 and 312 may be provided in a direction in which the external electrodes 2240 are formed to be spaced apart from each other in a predetermined region of the sheet, for example, the center, that is, in the X direction, and at least in a direction orthogonal thereto Two or more discharge electrodes (not shown) may be further provided. Therefore, at least one discharge electrode may be formed in a direction orthogonal to the direction in which the external electrode 2240 is formed, and at least one discharge electrode may be formed to face each other at a predetermined interval. For example, the overvoltage protection unit 2230 may include a fifth sheet 105 and first and

second discharge electrodes

311 and 312 spaced apart from the fifth sheet 105 as shown in FIG. 9. The overvoltage protection member 320 formed on the fifth sheet 105 may be included. Here, the overvoltage protection member 320 may be formed such that at least a portion thereof is connected to the first and

second discharge electrodes

311 and 312. The first discharge electrode 311 is formed on the fifth sheet 105 by being connected to the external electrode 2241 and has a distal end connected with the overvoltage protection member 320. The second discharge electrode 312 is connected to the external electrode 2242 so as to be spaced apart from the first discharge electrode 311 on the fifth sheet 105, and the distal end thereof is connected to the overvoltage protection member 320. The overvoltage protection member 320 may be formed to be connected to the first and

second discharge electrodes

311 and 312 at a predetermined region, for example, a central portion of the fifth sheet 105. In this case, the overvoltage protection member 320 may be formed to partially overlap the first and

second discharge electrodes

311 and 312. The overvoltage protection member 320 may be formed on the exposed fifth sheet 105 between the first and

second discharge electrodes

311 and 312 to be connected to the side surfaces of the first and

second discharge electrodes

311 and 312. have. However, in this case, since the overvoltage protection member 320 may be spaced without contacting the first and

second discharge electrodes

311 and 312, the ESD overvoltage protection member to overlap the first and

second discharge electrodes

311 and 312. It is desirable to form 320. Even when the discharge electrode 310 and the overvoltage protection member 320 are formed on the same plane, the external electrode 2240 is formed to at least partially overlap the internal electrode 200, and the outermost sheet, that is, the first and the first The ten

sheets

101 and 110 may be formed to have a lower dielectric constant than the remaining sheets, that is, the second to ninth sheets 102 to 109 therebetween.

As described above, the composite protection unit according to the embodiments of the present invention has been described based on a suppressor type including an overvoltage protection member. However, in the present invention, various types of overvoltage protection components may be used as the composite protection unit. That is, various types of overvoltage protection components having a function of bypassing overvoltage, blocking leakage voltage or current such as electric shock voltage, and transmitting a communication signal may be used as the composite protection unit. For example, a structure in which a varistor and a capacitor are combined may be used.

The complex protection device according to the embodiments of the present invention as described above may be provided between the metal case of the electronic device, that is, the side case 1110 and the internal circuit, that is, the main board 1500. That is, the contact portion 2100 may be connected to the ground terminal, and the complex protection unit 2200 may be connected to the side case 1110 through the conductive portion 2300. In this case, the ground terminal may be provided in the main board 1500. Therefore, the electric shock voltage transmitted from the ground terminal of the internal circuit to the metal case can be cut off, and overvoltage such as an ESD applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, in the composite protection device of the present invention, current does not flow at the rated voltage and the electric shock voltage, and current flows through the overvoltage protection member 320 at the ESD voltage so that the overvoltage is bypassed to the ground terminal. On the other hand, the composite protection device may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the composite protection device may have a rated voltage of 100V to 240V, an electric shock voltage may be equal to or higher than an operating voltage of a circuit, and an ESD voltage generated by external static electricity or the like may be higher than an electric shock voltage. In addition, the communication signal from the outside, that is, the AC frequency may be transmitted to the internal circuit by the capacitor formed between the internal electrode (200). Therefore, even when a separate antenna is not provided and a metal case is used as an antenna, communication signals can be received from the outside. As a result, the composite protection device according to the present invention can block the electric shock voltage, bypass the ESD voltage to the ground terminal, and apply a communication signal to the internal circuit.

In addition, the composite protection unit of the composite protection device according to an embodiment of the present invention by stacking a plurality of sheets with high breakdown voltage characteristics to form a laminate (2210), such as a metal case in the internal circuit of a defective charger (for example 310V) The insulation resistance state can be maintained so that a leakage current does not flow when an electric shock voltage is introduced, and the overvoltage protection member 320 also bypasses the overvoltage when an overvoltage flows from the metal case to the internal circuit, thereby maintaining a high insulation resistance state without damaging the device. I can keep it. That is, the overvoltage protection member 320 includes a porous insulating material made of a porous structure to flow a current through the fine pores, and further includes a conductive material that converts electrical energy into thermal energy by lowering an energy level, thereby being introduced from the outside. Overvoltage can be bypassed to protect the circuit. Therefore, the insulation is not destroyed even by overvoltage, and thus, it is possible to continuously prevent the electric shock voltage generated in the defective charger from being transmitted to the user through the metal case of the electronic device provided in the electronic device having the metal case. On the other hand, the general MLCC (Multi Layer Capacitance Circuit) protects the electric shock voltage but is vulnerable to ESD. It is damaged due to sparking due to leakage point caused by charge charging when repeated ESD is applied. Phenomenon may occur. However, according to the present invention, the overvoltage protection member 320 including the porous insulating material is formed between the internal electrodes 200 so that at least a part of the laminate 2210 is not destroyed by passing the overvoltage through the overvoltage protection member 320. Do not.

In addition, by allowing the external electrode 2240 and the internal electrode 200 to overlap, a predetermined parasitic capacitance may be generated between the external electrode 2240 and the internal electrode 200, and the external electrode 2240 and the internal electrode 200 may be generated. The capacitance of the composite protection element can be adjusted by adjusting the overlap area of However, since the capacitance of the composite protective element affects the antenna performance in the electronic device, the sheet 100 having a high dielectric constant is used to maintain the dispersion of the capacitance of the composite protective element within 5%. Therefore, as the dielectric constant of the sheet 100 increases, the influence of the parasitic capacitance between the inner electrode 200 and the outer electrode 2240 increases. However, since the dielectric constant of the outermost sheet is lower than that of the remaining sheets therebetween, the influence of the parasitic capacitance between the inner electrode 200 and the outer electrode 2240 can be reduced.

The present invention has been described by taking an example of a composite protection device provided in the electronic device of the smart phone to protect the electronic device from overvoltage such as ESD applied from the outside, and protects the user by blocking the leakage current from the inside of the electronic device. However, the composite protection device of the present invention may be provided in various electric and electronic devices in addition to the smart phone to perform two or more protection functions.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. In other words, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

Claims

As a composite protection device provided between a conductor that can be contacted by the user of the electronic device and the internal circuit

A contact portion at least partially in contact with an internal circuit of the electronic device;

A composite protective part having one surface coupled with the contact part;

The other surface of the composite protection unit is coupled to one region, the composite protection device comprising a conductive portion fixed to the inside of the electronic device.
The complex protection device of claim 1, wherein a transient voltage applied from the outside is bypassed to a ground terminal inside the electronic device, a voltage or a current leaking from the inside of the electronic device, and a communication signal is transmitted.
The composite protective device of claim 1, further comprising a conductive adhesive member provided on the contact portion.
The composite protective device of claim 1, further comprising a support part provided at one side in contact with the conductive part.
The composite protective device of claim 4, wherein the support part is provided at a height of the contact part and the composite protection part so that one side contacts the conductive part and the other side contacts the inside of the electronic device.
The composite protective device of claim 4, wherein the support is insulative.
The composite device of claim 4, wherein the support part is provided between the conductive part and the fixing part of the electronic device.
The composite device of claim 7, wherein the support is conductive.
An electronic device in which a composite protective element is provided between a user contactable conductor and an internal circuit.

Windows and displays,

A bracket provided below the display unit;

A main mode provided below the bracket,

A cover case provided to cover the main board;

A side case for closing a side space between the cover case from the window,

The composite protective device is provided on the inside of the side case.
The method according to claim 9, wherein the composite protective element,

A contact portion at least partially in contact with an internal circuit of the electronic device;

A composite protective part having one surface coupled with the contact part;

The other surface of the composite protection unit is coupled to one region, the electronic device including a conductive part fixed inside the electronic device.
The electronic device of claim 10, further comprising a fixing part provided inside the side case to fix the composite protective element.
The electronic device of claim 11, wherein the conductive part is fixed to the fixing part.
The electronic device of claim 10, wherein the contact unit is electrically connected to an internal circuit of the main board.
The electronic device of claim 13, wherein the bracket is at least partially conductive, the contact portion is in contact with the bracket, and the bracket is connected to an internal circuit of the main board.