WO2016178529A1

WO2016178529A1 - Electric shock-prevention element and electronic device provided with same

Info

Publication number: WO2016178529A1
Application number: PCT/KR2016/004747
Authority: WO
Inventors: 박인길; 노태형; 조승훈; 허성진; 이동석; 신민섭
Original assignee: 주식회사 이노칩테크놀로지
Priority date: 2015-05-07
Filing date: 2016-05-04
Publication date: 2016-11-10

Abstract

Disclosed are an electric shock-prevention element and an electronic device provided with same, the electric shock-prevention element comprising: a laminate body in which a plurality of insulating sheets are laminated; a capacitor part provided with a plurality of inner electrodes in the interior of the laminate body; an ESD protection part provided in the interior of the laminate body and comprising at least two discharge electrodes and at least one ESD protection layer provided in between the discharge electrodes; and outer electrodes provided on at least two outer sides of the laminate body to be connected to the capacitor part and ESD protection part, wherein at least one among the thickness and width of at least one part of the ESD protection layer differs from the other part thereof.

Description

Electric shock prevention device and electronic device having same

The present invention relates to an electric shock prevention device, and more particularly, to an electric shock prevention device capable of preventing the electric shock voltage from being transmitted to a user through a chargeable electronic device such as a smart phone.

The use of mobile communication terminal has evolved from the center of voice call to the convenience service of smartphone based life through data communication service. In addition, various frequency bands are used according to the multifunctionalization of smart phones and the like. That is, a plurality of functions using different frequency bands, such as wireless LAN, Bluetooth, and GPS, are adopted in one smartphone. In addition, due to the high integration of electronic devices, the internal circuit density in a limited space is increased. This inevitably causes noise interference between internal circuits. In order to suppress noise of various frequencies of a portable electronic device and to suppress noise between internal circuits, a plurality of circuit protection elements are used. For example, a capacitor, a chip bead, a common mode filter, and the like, which remove noise in different frequency bands, are used.

On the other hand, recently, with the emphasis on the high-end image and durability of smart phones, the spread of terminals using metal materials is increasing. In other words, the spread of smart phones, which are made of metal with the edges or with the case made of metal other than the front screen display unit, is increasing.

However, a shock current is generated by charging using a non-genuine charger or a defective charger using an overcurrent protection circuit or a low quality device. Such a shock current is transmitted to the ground terminal of the smartphone, and again from the ground terminal to the metal case, the user in contact with the metal case may be electrocuted. As a result, using a smartphone during charging using a non-genuine charger in a smartphone using a metal case may cause an electric shock accident.

(Prior art document)

Korean Patent Registration No. 10876206

The present invention provides an electric shock prevention device that can be provided in an electronic device such as a smartphone to prevent an electric shock of a user due to a shock current input from a charger.

The present invention provides an electric shock prevention device that is not dielectrically broken by an electrostatic discharge (ESD).

An electric shock prevention device according to an aspect of the present invention includes a laminate in which a plurality of insulating sheets are stacked; A capacitor unit including a plurality of internal electrodes formed in the stack; An ESD protection unit formed inside the stack and including at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes; And external electrodes provided on at least two side surfaces of the stack and connected to the capacitor unit and the ESD protection unit, wherein the ESD protection layer is formed at least one of a thickness and a width of at least one region different from the other regions. .

The inner electrode adjacent to the discharge electrode is connected to the same outer electrode.

The external electrode extends to at least one of the upper and lower portions of the stack to partially overlap the inner electrode.

The length of one direction of the internal electrode is longer than or equal to the length of the discharge electrode, and the width of the internal electrode in another direction perpendicular to the one direction is greater than the width of the ESD protection layer and the width of the discharge electrode.

The width of the ESD protection layer is larger than the width of the discharge electrode.

A ≤ C ≤ or A ≤ B when the distance between the discharge electrode and the inner electrode adjacent to A, the distance between the discharge electrode is B, and the distance between the inner electrode is C.

The ESD protection layer includes at least one of an ESD protection material and a void including at least one of a porous insulating material and a conductive material.

The ESD protection layer is formed in the vertical direction or in the horizontal direction between the discharge electrodes.

The ESD protection layer is formed on at least one insulating sheet.

The ESD protection layer is formed in a polyhedron shape.

The ESD protection layer is formed in a shape that is widest at an intermediate thickness in one direction and narrows toward upper and lower portions thereof.

The ESD protection layer is formed in a shape that is thickest in the central area and becomes thinner from both ends thereof.

The ESD protection layer is formed in a shape in which the thickness decreases in one direction and then increases again.

The ESD protection layer is formed to at least partially contact between the discharge electrodes.

The ESD protection material is connected to at least one of the discharge electrodes and voids are formed in the remaining areas.

The ESD protection material is formed in at least one region in the through hole so as not to contact the discharge electrode, and the remaining region is formed with a void.

At least two capacitor parts and the ESD protection part are provided in the stack in a horizontal direction.

The internal electrodes are stacked in a vertical direction to form one capacitor portion, and are arranged in a horizontal direction to form a plurality of capacitor portions.

One of the external electrodes is connected to the metal case of the electronic device and the other is connected to the ground terminal to cut off the electric shock voltage and bypass the ESD voltage.

An electric shock prevention device according to another aspect of the present invention includes a laminate in which a plurality of insulating sheets are stacked; A capacitor unit including a plurality of internal electrodes formed in the stack; An ESD protection unit formed on at least a portion of the insulating sheet to protect the ESD voltage; And external electrodes provided on at least two side surfaces of the stack and connected to the capacitor unit and the ESD protection unit, wherein the ESD protection unit includes at least two discharge electrodes and at least one ESD protection provided between the discharge electrodes. And at least one of a thickness and a width of at least one region is different from the other region, and the length of one direction of the inner electrode is longer than or equal to the length of the discharge electrode and is equal to the one direction. The width in the other direction perpendicular to each other is greater than the width of the ESD protection layer and the width of the discharge electrode, and the width of the ESD protection layer is greater than the width of the discharge electrode.

A is the distance between the discharge electrode and the internal electrodes adjacent to A, the distance between the discharge electrodes is B, and the distance between the internal electrodes is A≤C or A≤B.

According to another aspect of the present invention, an electronic device includes an electric shock prevention device provided between a metal case and an internal circuit to block an electric shock voltage and bypass an ESD voltage, wherein the electric shock prevention device includes a plurality of insulating sheets stacked thereon. Laminate; A capacitor unit including a plurality of internal electrodes formed in the stack; An ESD protection unit formed on at least a portion of the insulating sheet to protect the ESD voltage; And external electrodes provided on at least two side surfaces of the stack and connected to the capacitor unit and the ESD protection unit, wherein the ESD protection unit includes at least two discharge electrodes and at least one ESD protection provided between the discharge electrodes. And at least one of a thickness and a width of at least one region is different from the other region, and the length of one direction of the inner electrode is longer than or equal to the length of the discharge electrode and is equal to the one direction. The width in the other direction perpendicular to each other is greater than the width of the ESD protection layer and the width of the discharge electrode, and the width of the ESD protection layer is greater than the width of the discharge electrode.

An inner electrode adjacent to the discharge electrode is connected to the same outer electrode.

An electric shock prevention device according to embodiments of the present invention may be provided between a metal case of an electronic device and an internal circuit to block an electric shock voltage transmitted from a ground terminal of the internal circuit. Therefore, it is possible to prevent the electric shock voltage generated in the defective charger from being transmitted to the user through the metal case from the ground terminal inside the electronic device. In addition, the electric shock prevention device may include an ESD protection unit, and the ESD protection unit may be made of a porous structure to allow current to flow through the micropores to bypass the incoming ESD to the ground terminal to maintain the insulation state of the device. Therefore, the electric shock voltage can be interrupted continuously and the ESD voltage applied from the outside can be bypassed to the ground terminal.

In addition, at least one of the thickness and the width of at least one region may be formed differently from the other region. Thus, it is possible to distribute the ESD voltage efficiently, thereby bypassing the ESD voltage more efficiently.

The external electrode may be formed to overlap at least a portion of the internal electrode and a predetermined region. Therefore, a predetermined parasitic capacitance may be generated between the external electrode and the internal electrode, and the capacitance of the electric shock prevention device may be adjusted by adjusting the overlapping area of the external electrode and the internal electrode.

In addition, the discharge electrode of the ESD protection unit and the inner electrode of the capacitor unit adjacent to each other may be connected to the same external electrode. Therefore, even if the insulating sheet is broken insulated, it is possible to prevent the ESD voltage from being applied.

1 is a perspective view of an electric shock prevention device according to a first embodiment of the present invention.

2 and 3 are cross-sectional views taken along line A-A 'and line B-B' of FIG.

4 is an equivalent circuit diagram of an electric shock prevention device according to a first embodiment of the present invention.

5 and 6 are cross-sectional and cross-sectional photograph of the ESD protection layer of the electric shock protection device according to the embodiments of the present invention.

7 is a cross-sectional view of an electric shock prevention device according to a second embodiment of the present invention.

8 is a cross-sectional view of an electric shock prevention device according to a third embodiment of the present invention.

9 to 11 are schematic cross-sectional views of an ESD protection unit including an ESD protection layer according to other embodiments of the present invention.

12 to 18 are schematic cross-sectional views of an ESD protection unit including an ESD protection layer according to still another embodiment of the present invention.

19 to 22 are schematic views of an electric shock prevention device according to a fourth embodiment of the present invention and modified examples thereof.

23 to 26 are cross-sectional views of the electric shock prevention device according to the fifth embodiment of the present invention.

27 to 30 are cross-sectional views of the electric shock prevention device according to the sixth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 is a perspective view of an electric shock prevention device according to a first exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B ′ of FIG. 1. 4 is an equivalent circuit diagram.

1 to 4, an electric shock prevention device according to a first exemplary embodiment of the present invention is provided in a laminate 1000 in which a plurality of insulating sheets 100 (101 to 111) are stacked and in a laminate 1000. And at least one

capacitor unit

2000 and 4000 having a plurality of

internal electrodes

200 and 201 to 208, at least one

discharge electrode

310 and 311 and 312, and an ESD protection layer 320. The protection unit 3000 may be included. For example, the first and

second capacitor parts

2000 and 4000 may be provided in the stack 1000, and the ESD protection part 3000 may be provided therebetween. That is, the first capacitor part 2000, the ESD protection part 3000, and the second capacitor part 4000 may be stacked in the stack 1000 to implement an electric shock prevention device. In addition, the electronic device may further include

external electrodes

5100, 5200; 5000 formed on two opposite sides of the stack 1000 and connected to the first and

second capacitor parts

2000 and 4000 and the ESD protection part 3000. can do. Of course, the electric shock prevention device may include at least one capacitor part and at least one ESD protection part. That is, a capacitor unit may be provided on either the lower side or the upper side of the ESD protection unit 3000, and at least one capacitor unit may be provided on the upper side and the lower side of the two or more ESD protection units 3000 spaced apart from each other. Such an electric shock prevention element is provided between an internal circuit of an electronic device, for example, a PCB and a metal case to block an electric shock voltage and bypass the ESD voltage to the ground terminal. In addition, since the insulation is not destroyed by the ESD, the electric shock voltage can be continuously interrupted.

The laminate 1000 is formed by stacking a plurality of insulating sheets 101 to 111; The laminate 1000 has a predetermined length in one direction (for example, the X direction) and another direction (for example, the Y direction) orthogonal thereto, and has a predetermined height in the vertical direction (for example, the Z direction). It may be provided in a substantially hexahedral shape having a. That is, when the forming direction of the external electrode 5000 is in the X direction, the direction orthogonal to this in the horizontal direction may be the Y direction, and the vertical direction may be the Z direction. Here, the length of the X direction is longer than the length of the Y direction and the length of the Z direction, the length of the Y direction may be equal to or different from the length of the Z direction. When the lengths of the Y and Z directions are different, the length of the Y direction may be shorter or longer than the length of the Z direction. For example, the ratio of the lengths in the X, Y, and Z directions may be 2 to 5: 1: 0.5 to 1. That is, the length of the X direction may be about 2 to 5 times longer than the length of the Y direction based on the length of the Y direction, and the length of the Z direction may be 0.5 to 1 times the length of the Y direction. However, the lengths of the X, Y, and Z directions may be variously modified according to the internal structure of the electronic device to which the discharge sensing device is connected, the shape of the discharge sensing device, and the like. In addition, at least one

capacitor part

2000 and 4000 and at least one ESD protection part 3000 may be provided in the stack 1000. For example, the first capacitor part 2000, the ESD protection part 3000, and the second capacitor part 4000 may be provided in the stacking direction of the sheet 100, that is, the Z direction. The plurality of insulating sheets 100 may have a predetermined dielectric constant, for example, a dielectric constant of 10 to 20000. The insulating sheet 100 may be formed of a material including at least one of dielectric material powder such as MLCC, BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , Bi ₂ O ₃ , Zn0, and Al ₂ O ₃ . have. In addition, the plurality of insulating sheets 100 may all be formed to have the same thickness, and at least one may be formed thicker or thinner than the others. That is, the insulating sheet of the ESD protection unit 3000 may be formed to have a different thickness from the insulating sheets of the first and

second capacitors

2000 and 4000, and the ESD protection unit 3000 and the first and second capacitors ( The insulating sheet formed between 2000 and 4000 may be formed to a different thickness from the other sheets. For example, the thickness of the insulating sheet, that is, the fifth and seventh insulating

sheets

105 and 107 between the ESD protection unit 3000 and the first and

second capacitor units

2000 and 4000 may be the ESD protection unit 3000. Thinner than or equal to the sixth insulating sheet 106, or between the insulating electrodes 102 to 104 and 108 to 110 between the internal electrodes of the first and

second capacitor portions

2000 and 4000. It may be formed to be thin or the same thickness. That is, the distance between the ESD protection unit 3000 and the first and

second capacitor parts

2000 and 4000 is formed to be thinner or the same as the distance between the internal electrodes of the first and

second capacitor parts

2000 and 4000, or It may be formed thinner or the same as the thickness of the ESD protection unit 3000. Of course, the insulating sheets 102 to 104 and 108 to 110 of the first and

second capacitors

2000 and 4000 may be formed to have the same thickness, and either one may be thinner or thicker than the other. Meanwhile, the insulating sheets 100 may be formed to have a thickness that is not destroyed when ESD is applied, for example, 5 μm to 300 μm. In addition, the laminate 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided on the lower and upper portions of the first and

second capacitor parts

2000 and 4000, respectively. Of course, the first insulating sheet 101 may function as the lower cover layer and the eleventh insulating sheet 111 may function as the upper cover layer. The lower and upper cover layers may be provided by stacking a plurality of magnetic sheets, and may have the same thickness. Here, a nonmagnetic sheet, for example, a glass sheet, may be further formed on the outermost portion of the lower and upper cover layers formed of the magnetic sheet, that is, the lower and upper surfaces. In addition, the lower and upper cover layers may be thicker than the insulating sheets therein, that is, the second to tenth insulating sheets 102 to 110. Therefore, when the first and eleventh insulating

sheets

101 and 111 function as lower and upper cover layers, they may be thicker than the second to tenth insulating sheets 102 to 110.

The first capacitor part 2000 may be provided under the ESD protection part 3000, and may include at least two internal electrodes and at least two insulating sheets provided therebetween. For example, the first capacitor part 2000 may include the first to fourth insulating sheets 101 to 104 and the first to fourth internal electrodes 201 to 4 formed on the first to fourth insulating sheets 101 to 104, respectively. 204). The first to fourth internal electrodes 201 to 204 may be formed to have a thickness of, for example, 1 μm to 10 μm. Here, the first to fourth internal electrodes 201 to 204 are formed such that one side of the first to fourth internal electrodes 201 to 204 are opposite to each other in the X direction, and the other side thereof is spaced apart from each other. The first and third

internal electrodes

201 and 203 are formed on predetermined areas on the first and third insulating

sheets

101 and 103, respectively, and one side is connected to the first external electrode 5100 and the other side is second. It is formed to be spaced apart from the external electrode 5200. The second and fourth

internal electrodes

202 and 204 are formed in predetermined areas on the second and fourth insulating

sheets

102 and 104, respectively, and one side thereof is connected to the second external electrode 5200 and the other side thereof is the first external electrode. It is formed to be spaced apart from the electrode 5100. That is, the first to fourth internal electrodes 201 to 204 are alternately connected to any one of the external electrodes 5000, and are formed to overlap a predetermined region with the second to fourth insulating sheets 202 to 204 interposed therebetween. . In this case, the first to fourth

internal electrodes

201 and 204 are respectively formed in an area of 10% to 85% of the area of each of the first to fourth insulating sheets 101 to 104. Further, the first to fourth internal electrodes 201 to 204 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. Meanwhile, the first to fourth internal electrodes 201 to 204 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and spacing, and the like. In the first capacitor part 2000, capacitances are formed between the first to fourth internal electrodes 201 to 204, respectively, and the capacitances are overlapped areas of the first to fourth internal electrodes 201 to 204, and insulating sheets. It may be adjusted according to the thickness of the 101 (101 to 104). Meanwhile, in the first capacitor part 2000, at least one or more inner electrodes may be further formed in addition to the first to fourth inner electrodes 201 to 204, and at least one insulating sheet on which at least one inner electrode is formed may be further formed. It may be. In addition, two internal electrodes may be formed in the first capacitor part 2000. That is, the present embodiment has described that four internal electrodes of the first capacitor 2000 are formed as an example, but two or more internal electrodes may be formed.

The ESD protection unit 3000 may include at least two discharge electrodes 310 (311 and 312) formed in the vertical direction and at least one ESD protection layer 320 provided between the at least two discharge electrodes 310. Can be. For example, the ESD protection unit 3000 may include the first and second discharge electrodes 311 formed on the fifth and sixth insulating

sheets

105 and 106 and the fifth and sixth insulating

sheets

105 and 106, respectively. 312 and the ESD protection layer 320 formed on the sixth insulating sheet 106. Here, the ESD protection layer 320 may be formed so that at least a part thereof contacts the first and

second discharge electrodes

311 and 312. The first and

second discharge electrodes

311 and 312 may be formed to have the same thickness as the internal electrodes 200 of the

capacitor parts

2000 and 4000. For example, the first and

second discharge electrodes

311 and 312 may be formed to a thickness of 1 μm to 10 μm. However, the first and

second discharge electrodes

311 and 312 may be formed thinner or thicker than the internal electrodes 200 of the

capacitor parts

2000 and 4000. In addition, the first and

second discharge electrodes

311 and 312 may be formed to have a smaller length and width than the internal electrodes 200 of the

capacitor parts

2000 and 4000. That is, the first and

second discharge electrodes

311 and 312 may be formed to have a shorter length than the internal electrodes 200 in the X direction, and have a narrower width than the internal electrodes 200 in the Y direction. For example, the first and

second discharge electrodes

311 and 312 are formed to have a length of 50% to 90% of the length of the internal electrode 200 in the X direction, and 10% of the width of the internal electrode 200 in the Y direction. To 60% in width. Meanwhile, the first discharge electrode 311 is connected to the first external electrode 5100 to be formed on the fifth insulating sheet 105, and the end portion thereof is connected to the ESD protection layer 320. The second discharge electrode 312 is connected to the second external electrode 5200 to be formed on the sixth insulating sheet 106, and the end portion thereof is connected to the ESD protection layer 320. In this case, an area in contact with the ESD protection layer 320 of the first and

second discharge electrodes

311 and 312 may have the same size or smaller size than the ESD protection layer 320. That is, the first and

second discharge electrodes

311 and 312 may be formed to at least partially overlap the ESD protection layer 320 in the X and Y directions. For example, the first and

second discharge electrodes

311 and 312 in the X direction may be completely overlapped without leaving the ESD protection layer 320. Accordingly, the edges of the first and

second discharge electrodes

311 and 312 in the X direction may form a vertical component with the edges of the ESD protection layer 320. Of course, the first and

second discharge electrodes

311 and 312 may be formed to overlap a portion of the ESD protection layer 320 in the X direction. For example, the first and

second discharge electrodes

311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the ESD protection layer 320 in the X direction. As a result, the first and

second discharge electrodes

311 and 312 are not formed beyond the ESD protection layer 320. In addition, the first and

second discharge electrodes

311 and 312 may be formed smaller than the ESD protection layer 320 in the Y direction. That is, as shown in FIG. 3, the first and

second discharge electrodes

311 and 312 may be formed to be smaller than the width of the ESD protection layer 320 in the central portion of the ESD protection layer 320 in the Y direction. For example, the first and

second discharge electrodes

311 and 312 may be formed to have a width of 10% to 95% of the width of the ESD protection part 320 in the Y direction. Meanwhile, the first and

second discharge electrodes

311 and 312 may be formed to have a larger area than one in contact with the ESD protection layer 320. The ESD protection layer 320 may be formed in a predetermined region, for example, a central portion of the sixth insulating sheet 106 and connected to the first and

second discharge electrodes

311 and 312. In this case, the ESD protection layer 320 may be formed to at least partially overlap the first and

second discharge electrodes

311 and 312. For example, the ESD protection layer 320 may be formed to overlap 10% to 100% in the X direction with the first and

second discharge electrodes

311 and 312, and may be formed to overlap 10% to 95% in the Y direction. Can be. Accordingly, the ESD protection layer 320 may have an overlap ratio in the X direction with the first and

second discharge electrodes

311 and 312 in the X direction or greater than the overlap ratio in the Y direction. In addition, the width of the ESD protection layer 320 in the Y direction may be smaller than the width of the internal electrode 200. For example, the width of the ESD protection layer 320 in the Y direction may be 40% to 90% wider than the width of the internal electrode 200. Accordingly, the ESD protection layer 320 may be formed smaller than the width of the internal electrode 200 in the Y direction and larger than the width of the discharge electrode 310. The ESD protection layer 320 forms a through hole having a predetermined size in a predetermined area, for example, a central portion of the sixth insulating sheet 106, and applies or fills an ESD protection material to at least a portion of the through hole by using a thick film printing process. Can be formed. The ESD protection layer 330 may be formed, for example, with a diameter of 100 μm to 500 μm and a thickness of 10 μm to 50 μm. In this case, the thinner the thickness of the ESD protection layer 320, the lower the discharge start voltage. Meanwhile, the ESD protection layer 320 may be formed using a conductive material and an insulating material. For example, the ESD protection layer 320 may be formed by printing a mixed material of the conductive ceramic and the insulating ceramic on the sixth insulating sheet 106. The ESD protection layer 320 may be formed by applying or filling at least a portion of an ESD protection material. For example, the ESD protection layer 320 may have a polygonal cross section, and may be formed by applying an ESD protection material to a side surface of the through hole formed in the sixth insulating sheet 106, and the ESD protection material only in at least some regions. It may be formed by coating or filling. In addition, at least one of the thickness and the width of at least one region may be formed differently from the other region of the ESD protection layer 320. That is, the ESD protection layer 320 may have a width in the X direction and a width in the Y direction larger than the thickness in the Z direction. For example, the ESD protection layer 320 may be formed in a substantially elliptical shape whose width in the X direction and the Y direction is larger than the thickness in the Z direction. In addition, the ESD protection layer 320 may have a thickness different from at least one region. For example, it may be formed in a shape in which the vertical gap of the central portion in the X direction and the Y direction is greatest, and the vertical gap decreases toward the edge thereof. In this case, the ratio of the region having the largest vertical gap and the region having the smallest vertical gap may be 5: 1 to 2: 1. Meanwhile, the ESD protection layer 320 may be formed on at least one insulating sheet 100. That is, the ESD protection layers 320 are formed on at least one of the insulating sheets 100 stacked in the vertical direction, for example, and the discharge electrodes are formed on the insulating sheet 100 so as to be spaced apart from each other. May be connected to the layer 320. The structure, material, and the like of the ESD protection layer 320 will be described later.

The second capacitor part 4000 may be provided above the ESD protection part 3000 and may include at least two or more internal electrodes and at least two or more insulating sheets provided therebetween. For example, the second capacitor part 2000 may include fifth to eighth internal electrodes formed on the seventh to tenth insulating sheets 107 to 110 and the seventh to tenth insulating sheets 107 to 110, respectively. 205 to 208). Here, the fifth to eighth internal electrodes 205 to 208 are formed such that one side of the fifth to eighth internal electrodes 205 to 208 is opposite to each other in the X direction, and the other side thereof is spaced apart from each other. The fifth and seventh

internal electrodes

205 and 207 are formed on the seventh and ninth insulating

sheets

107 and 109 in predetermined areas, one side of which is connected to the first external electrode 5100 and the other side of which is the second external. It is formed to be spaced apart from the electrode 5200. The sixth and eighth

internal electrodes

206 and 208 are formed in predetermined areas on the eighth and tenth insulating

sheets

108 and 110, respectively, and one side of the sixth and eighth

internal electrodes

206 and 208 is connected to the second external electrode 5200 and the other side of the first external electrode. It is formed to be spaced apart from the electrode 5100. That is, the fifth to eighth internal electrodes 205 to 108 are alternately connected to any one of the external electrodes 5000, and are formed to overlap a predetermined area with the eighth to tenth insulating sheets 208 to 110 interposed therebetween. . In this case, the fifth to eighth internal electrodes 205 to 208 are respectively formed with an area of 10% to 85% of the area of each of the seventh to tenth insulating sheets 107 to 110. In addition, the fifth to eighth internal electrodes 205 to 208 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. In addition, the fifth to eighth internal electrodes 205 to 208 may be formed to have a thickness of, for example, 1 μm to 10 μm. On the other hand, the fifth to eighth internal electrodes 205 to 208 may be formed in various shapes such as square, rectangular, predetermined pattern shape, spiral shape having a predetermined width and spacing. In the second capacitor part 4000, capacitances are formed between the fifth to eighth internal electrodes 205 to 208, respectively, and the capacitances are overlapped areas of the fifth to eighth internal electrodes 205 to 208, and insulating sheets. 108 to 110, etc., to adjust the thickness. Meanwhile, in the second capacitor part 4000, at least one or more internal electrodes are further formed in addition to the third and fourth

internal electrodes

203 and 204, and at least one insulating sheet on which at least one internal electrode is formed is further formed. It may be. In addition, two internal electrodes may be formed in the second capacitor part 4000. That is, the present embodiment has described that four internal electrodes of the second capacitor 4000 are formed as an example. However, two or more internal electrodes may be formed.

Meanwhile, the internal electrodes 201 to 204 of the first capacitor part 2000 and the internal electrodes 205 to 208 of the second capacitor part 4000 may be formed in the same shape and the same area, and the overlapping area may also be May be the same. In addition, the insulating sheets 101 to 104 of the first capacitor part 2000 and the insulating sheets 107 to 110 of the second capacitor part 4000 may have the same thickness. In this case, when the first insulating sheet 101 functions as a lower cover layer, the first insulating sheet 101 may be thicker than the other insulating sheets. Therefore, the first and

second capacitor parts

2000 and 4000 may have the same capacitance. However, the first and

second capacitor parts

2000 and 4000 may have different capacitances. In this case, at least one of the area of the inner electrode, the overlapping area of the inner electrode, and the thickness of the insulating sheet may be different. In addition, the internal electrodes 201 to 208 of the

capacitor parts

2000 and 4000 may be formed longer and wider than the discharge electrode 310 of the ESD protection part 3000. That is, as shown in FIG. 2, the internal electrode 200 is formed longer than the discharge electrode 310 in the X direction, and is wider than the discharge electrode 310 in the Y direction orthogonal to this as shown in FIG. 3. . In addition, the width of the ESD protection layer 320 in the Y direction may be greater than the width of the discharge electrode 310 and smaller than the width of the internal electrode 200. Therefore, the internal electrode 200 may be formed to have a larger area than the discharge electrode 310.

The

external electrodes

5100, 5200; 5000 are provided on two opposite sides of the stack 1000 to be connected to the first and

second capacitor parts

2000 and 4000 and the internal electrodes of the ESD protection part 3000. The external electrode 5000 may be formed of at least one layer. The external electrode 5000 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 5000 may be formed by stacking a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. In addition, the external electrode 5000 may be formed by mixing, for example, a multicomponent glass frit having 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. In this case, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to two surfaces of the laminate 1000. As the glass frit is included in the external electrode 5000, the adhesion between the external electrode 5000 and the stack 1000 may be improved, and the contact reaction between the internal electrode 200 and the external electrode 5000 may be improved. . In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the upper portion thereof to form the external electrode 5000. That is, the metal layer including the glass and at least one plating layer formed thereon may form the external electrode 5000. For example, the external electrode 5000 may form a Ni plated layer and a Sn plated layer sequentially through electrolytic or electroless plating after forming a layer including glass frit and Ag and Cu. In this case, the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer. Meanwhile, the external electrode 5000 may be formed to have a thickness of 2 μm to 100 μm, the Ni plating layer may be formed to have a thickness of 1 μm to 10 μm, and the Sn or Sn / Ag plating layer may have a thickness of 2 μm to 10 μm. Can be formed.

In addition, the oxide powder may be distributed on the surface of the laminate before the external electrode 5000 is formed. In this case, the oxide powder may be distributed before forming a part of the external electrode 5000 by the printing process, or may be formed before performing the plating process. That is, the oxide powder may be distributed on the surface of the laminate before the plating process when the external electrode 5000 is formed by the plating process. Thus, by distributing the oxide powder before the plating process, the resistance of the surface of the laminate can be made uniform, whereby the plating process can be performed uniformly. That is, the surface of the laminate may be different from the resistance of other regions of at least one region. For example, in the plating process, the plating proceeds better than the region of high resistance in the region of low resistance, resulting in uneven growth of the plating layer. . Therefore, in order to solve this problem, the surface resistance of the laminate must be kept uniform, and for this purpose, the oxide powder can be dispersed on the surface of the laminate. In this case, the oxide powder may be distributed on the surface of the laminate as a whole, and may be formed in a film form, or may be partially distributed on the surface of the laminate, and may be formed in a film form in at least one region and partially distributed in at least one region. It may be. For example, the oxide powder may be distributed over the entire surface of the laminate, and the oxide powder may be connected to form an oxide film having a predetermined thickness. At this time, since the oxide film is formed on the surface of the laminate, the surface of the laminate may not be exposed. In addition, the oxide powder may be distributed in the form of islands on the surface of the laminate. That is, the oxide powders may be spaced apart from each other and distributed in an island form on the surface of the laminate, whereby at least a portion of the laminate surface may be exposed. The oxide powder may be formed in a film form in at least one region and distributed in an island form in at least a portion thereof. That is, at least two oxide powders may be connected to each other to form a film in at least one region and may be formed in an island form at least in part. Thus, at least a portion of the laminate surface may be exposed by the oxide powder. The total area of the oxide powder distributed in at least a portion in island form may be, for example, 10% to 80% of the total area of the laminate surface. Here, at least one or more metal oxides may be used as the oxide powder for making the surface resistance of the laminate uniform, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO At least one or more of materials containing ₂ , Al ₂ O ₃ , MnO may be used.

Here, the distance between the ESD protection unit 3000 and the

capacitors

2000 and 4000 may be shorter or equal to the distance between two internal electrodes in the

capacitors

2000 and 4000. That is, the thickness of each of the fifth and seventh insulating

sheets

105 and 107 positioned between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 is between the internal electrodes 200 in the

capacitor units

2000 and 4000. It may be thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110 located at. In addition, the distance between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 may be shorter or equal to the distance between the two discharge electrodes 310 of the ESD protection unit 3000. That is, the thickness of each of the fifth and seventh insulating

sheets

105 and 107 disposed between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 may be the sixth insulating sheet 106 on which the ESD protection layer 320 is formed. Thinner than or equal to the thickness of As a result, each of the thicknesses of the fifth and seventh insulating

sheets

105 and 107 positioned between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 is between the internal electrodes 200 in the

capacitor units

2000 and 4000. Thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110, or thinner than or equal to the distance B between the two discharge electrodes 310 of the ESD protection unit 3000. Can be formed. That is, the distance between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 is A1 and A2, and the distance between the two internal electrodes in the

capacitor units

2000 and 4000 is C1 and C2, and the ESD protection unit 3000 is used. When the distance between two discharge electrodes 300 of B is A1 = A2 ≦ C1 = C2 or A1 = A2 ≦ B. Of course, A1 and A2 and C1 and C2 may not be the same. Meanwhile, the thicknesses of the lowermost and uppermost insulating sheets, that is, the first and eleventh insulating

sheets

101 and 111 may be 10 μm or more and 50% or less of the thickness of the laminate 1000, respectively. In this case, when the thicknesses of the first and eleventh insulating

sheets

101 and 111 are D1 and D2, respectively, B ≦ D1 = D2, and D1 and D2 may be different.

Meanwhile, although the first embodiment of the present invention has been described in which the ESD protection unit 3000 including one ESD protection layer 320 is provided in the stack 1000, two or more ESD protection layers 320 are provided. In some embodiments, a plurality of ESD protection units 3000 may be provided. For example, at least two ESD protection layers 320 are formed in a vertical direction, and a discharge electrode is further formed between the ESD protection layers 320 so that an electric shock prevention device includes at least one capacitor and two or more ESD protection parts. Can be. In addition, at least two internal electrodes 200 of the

capacitor parts

2000 and 4000, a discharge electrode 310 of the ESD protection part 3000, and an ESD protection layer 320 may be formed in the Y direction. Accordingly, a plurality of electric shock prevention devices may be provided in one laminate 1000 in parallel.

Further, the electric shock prevention device has a length L of 0.3 mm to 1.1 mm in one direction, that is, an X direction, and a width W of 0.15 mm to 0.55 mm in the other direction, ie, the Y direction, which is perpendicular thereto. That is, the thickness in the Z direction may be 0.15 mm to 0.55 mm. For example, the electric shock prevention device may have a length, a width, and a thickness of 0.9 mm to 1.1 mm, 0.45 mm to 0.55 mm, and 0.45 mm to 0.55 mm, respectively, 0.55 mm to 0.65 mm, 0.25 mm to 0.35 mm, and 0.25 mm, respectively. 0.35 mm to 0.45 mm, 0.15 mm to 0.25 mm and 0.15 mm to 0.25 mm. That is, the electric shock prevention device may have a length: width: thickness ratio of 2 to 3: 1 to 2: 1 to 2. Preferably, the length × width × thickness may be 1.0 mm × 0.5 mm × 0.5 mm, 0.6 mm × 0.3 mm × 0.3 mm, and 0.4 mm × 0.2 mm × 0.2 mm. That is, the electric shock prevention device may have a length: width: thickness ratio of 2: 1: 1. The dimensions of these devices follow typical device specifications for SMT. In this case, the ESD protection layer 320 may be formed to have a width of 50 μm to 500 μm and a thickness of 5 μm to 50 μm, depending on the size of the device. For example, in a device having a length x width x thickness of 1.0 mm x 0.5 mm x 0.5 mm, 0.6 mm x 0.3 mm x 0.3 mm, and 0.4 mm x 0.2 mm x 0.2 mm, the ESD protection layer 320 is 50 µm to 450. It may be formed to a width of 5㎛ and a thickness of 5㎛ to 50㎛.

5 and 6 are cross-sectional schematic and cross-sectional photograph of the ESD protection layer 320 of the electric shock prevention device of an embodiment of the present invention. That is, the ESD protection layer 300 may be formed at least one region smaller or larger than another region, and FIGS. 5 and 6 are cross-sectional schematics and cross-sectional photographs of an enlarged portion of the ESD protection layer 320. .

As illustrated in FIGS. 5A and 6A, the ESD protection layer 320 may be formed by mixing a conductive material and an insulating material. For example, the ESD protection layer 320 may be formed by mixing a conductive ceramic and an insulating ceramic. In this case, the ESD protection layer 320 may be formed by mixing the conductive ceramic and the insulating ceramic in a mixing ratio of 10:90 to 90:10. As the mixing ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the mixing ratio of the conductive ceramic increases, the discharge starting voltage decreases. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted to obtain a predetermined discharge start voltage. In this case, a plurality of pores (not shown) may be formed in the ESD protection layer 320. The formation of pores makes it easier to bypass the ESD voltage.

In addition, the ESD protection layer 320 may be formed by stacking a conductive layer and an insulating layer in a predetermined stacked structure. That is, the ESD protection layer 320 may be formed by dividing the conductive layer and the insulating layer at least once and separating the conductive layer and the insulating layer. For example, the ESD protection layer 320 may be formed in a two-layer structure by laminating a conductive layer and an insulating layer, and may be formed in a three-layer structure by laminating the conductive layer, the insulating layer, and the conductive layer. In addition, the conductive layer 321 and the insulating layer 322 may be repeatedly stacked a plurality of times to form a stacked structure of three or more layers. For example, as illustrated in FIG. 5B, an ESD protection layer 320 having a three-layer structure in which the first conductive layer 321a, the insulating layer 322, and the second conductive layer 321b are stacked is provided. Can be formed. FIG. 6B is a photograph in which an ESD protection layer having a three-layer structure is formed between internal electrodes between insulating sheets. On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the uppermost layer and the lowest layer may be a conductive layer. In this case, a plurality of pores (not shown) may be formed in at least a portion of the conductive layer 321 and the insulating layer 322. For example, since the insulating layer 322 formed between the conductive layers 321 has a porous structure, a plurality of pores may be formed in the insulating layer 322.

In addition, a gap may be further formed in the ESD protection layer 320 in a predetermined region. For example, a void may be formed between the layer in which the conductive material and the insulating material are mixed, and a gap may be formed between the conductive layer and the insulating layer. That is, the first mixed layer, the void, and the second mixed layer of the conductive material and the insulating material may be laminated, and the conductive layer, the void, and the insulating layer may be laminated. For example, the ESD protection layer 320 may include a first conductive layer 321a, a first insulating layer 322a, a void 323, and a second insulating layer 322b as shown in FIG. 5C. And the second conductive layer 321b may be stacked. That is, the insulating layer 322 may be formed between the conductive layers 321, and the gap 323 may be formed between the insulating layers 322. 6C is a cross-sectional photograph of the ESD protection layer 320 having such a laminated structure. Of course, the conductive layer, the insulating layer, and the pores may be repeatedly stacked to form the ESD protection layer 320. Meanwhile, when the conductive layer 321, the insulating layer 322, and the gap 323 are stacked, all of them may have the same thickness, and at least one thickness may be thinner than the others. For example, the void 323 may be thinner than the conductive layer 321 and the insulating layer 322. In addition, the conductive layer 321 may be formed to have the same thickness as the insulating layer 322, or may be formed thicker or thinner than the insulating layer 322. On the other hand, the void 323 may be formed by filling the polymer material and then performing a sintering process to remove the polymer material. For example, the first polymer material including conductive ceramics, the second polymer material including insulating ceramics, and the third polymer material not containing conductive ceramics or insulating ceramics are filled in the via hole, and then a firing process is performed. By removing the polymer material, a conductive layer, an insulating layer and a void can be formed. On the other hand, the gap 323 may be formed without being divided into layers. For example, the insulating layer 322 may be formed between the

conductive layers

321a and 321b, and a plurality of pores may be connected in the insulating layer 322 in a vertical direction or a horizontal direction to form a gap 323. That is, the gap 323 may be formed with a plurality of pores in the insulating layer 322. Of course, the void 323 may be formed in the conductive layer 321 by a plurality of pores.

In addition, the ESD protection layer 320 may be formed by applying an ESD protection material including a porous insulating material and a conductive material to a portion of the hole, and the remaining area is not coated with the ESD protection material, thereby forming voids. Of course, in the ESD protection layer 320, an ESD protection material is not formed in the through hole, and a gap may be formed between the two

discharge electrodes

311 and 312.

Meanwhile, the conductive layer 321 used for the ESD protection layer 320 may flow a current with a predetermined resistance. For example, the conductive layer 321 may be a resistor having several kilowatts to several hundred kilowatts. The conductive layer 321 lowers the energy level when an overvoltage flows, such as ESD, to prevent structural damage of the electric shock prevention device due to the overvoltage. That is, the conductive layer 321 serves as a heat sink that converts electrical energy into thermal energy. The conductive layer 321 may be formed using a conductive ceramic, and the conductive ceramic may include a mixture including at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Fe, and Bi. It is available. In addition, the conductive layer 321 can be formed to a thickness of 1 μm to 50 μm. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 μm to 50 μm.

In addition, the insulating layer 322 used for the ESD protection layer 320 may be made of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 500,000. For example, the insulating ceramic can be formed using a mixture containing at least one of dielectric material powder such as MLCC, BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, Al ₂ O ₃ . The insulating layer 322 may have a porous structure in which a plurality of pores having a size of about 1 nm to about 5 μm are formed to have a porosity of about 30% to about 80%. In this case, the shortest distance between the pores may be about 1nm to 5㎛. That is, the insulating layer 322 is formed of an electrically insulating material that does not flow current, but since pores are formed, current may flow through the pores. In this case, as the size of the pores increases or the porosity increases, the discharge start voltage may decrease. On the contrary, when the size of the pores decreases or the porosity decreases, the discharge start voltage may increase. However, when the pore size exceeds 5 μm or the porosity exceeds 80%, it may be difficult to maintain the shape of the ESD protection layer 320. Therefore, the pore size and the porosity of the insulating layer 322 may be adjusted to adjust the discharge start voltage while maintaining the shape of the ESD protection layer 320. Meanwhile, when the ESD protection layer 320 is formed of a mixed material of an insulating material and a conductive material, the insulating material may use an insulating ceramic having fine porosity and porosity. In addition, the insulating layer 322 may have a resistance lower than that of the insulating sheet 100 by micropores, and partial discharge may be performed through the micropores. That is, the micropore is formed in the insulating layer 322 and partial discharge is performed through the micropore. The insulating layer 322 may be formed to a thickness of 1㎛ 50㎛. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to be 1 μm to 50 μm.

As described above, the electric shock prevention device according to the first embodiment of the present invention may be provided between the metal case 10 and the internal circuit 20 of the electronic device. That is, one of the external electrodes 5000 may be connected to the metal case 10 of the electronic device, and the other may be connected to the ground terminal. In this case, the ground terminal may be provided in the internal circuit 20. For example, the first external electrode 5100 may be connected to the metal case 10 of the electronic device, and the second external electrode 5200 may be connected to the ground terminal. Therefore, the electric shock voltage transmitted from the ground terminal of the internal circuit 20 to the metal case can be cut off, and the ESD voltage applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, in the electric shock prevention device of the present invention, current does not flow between the external electrodes 5000 at the rated voltage and the electric shock voltage, and current flows through the ESD protection unit 3000 at the ESD voltage so that the ESD voltage is bypassed to the ground terminal. . Meanwhile, the electric shock prevention device may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the electric shock prevention device may have a rated voltage of 100V to 240V, the electric shock voltage may be equal to or higher than the operating voltage of the circuit, and the ESD voltage generated by external static electricity or the like may be higher than the electric shock voltage. In addition, communication signals may be transmitted between the external circuit and the internal circuit 20 by the

capacitor units

2000 and 4000. That is, a communication signal from the outside, that is, an RF signal may be transmitted to the internal circuit 20 by the

capacitor units

2000 and 4000, and the communication signal from the internal circuit 20 is transmitted to the

capacitor units

2000 and 4000. Can be delivered to the outside. Therefore, even when the metal case 10 is used as an antenna without a separate antenna, communication signals with the outside may be exchanged using the

capacitor units

2000 and 4000. As a result, the electric shock prevention device according to the present invention may block an electric shock voltage applied from the ground terminal of the internal circuit, bypass the ESD voltage applied from the outside to the ground terminal, and transmit a communication signal between the external device and the electronic device. .

In addition, the electric shock prevention device according to an embodiment of the present invention, when a plurality of insulating sheets having high breakdown voltage characteristics are stacked to form a capacitor, when an electric shock voltage of, for example, 310V is introduced into the metal case from an internal circuit caused by a defective charger. Insulation resistance can be maintained to prevent leakage current, and ESD protection can bypass the ESD voltage when the ESD voltage flows from the metal casing to the internal circuitry to maintain a high insulation resistance without damaging the device. That is, the ESD protection unit 3000 is formed of a conductive layer 321 for converting electrical energy into thermal energy by lowering an energy level and an ESD protection layer made of a porous structure and an insulating layer 322 for flowing current through micropores. By including 300) it is possible to protect the circuit by bypassing the incoming ESD voltage. Therefore, it is not dielectric breakdown even by the ESD voltage, and thus it is possible to continuously prevent the electric shock voltage generated from the defective charger from being delivered to the user through the metal case of the electronic device provided in the electronic device having the metal case. On the other hand, the general MLCC (Multi Layer Capacitance Circuit) protects the electric shock voltage but is vulnerable to ESD. It is damaged due to sparking due to leakage point caused by charge charging when repeated ESD is applied. Phenomenon may occur. However, in the present invention, the ESD protection layer including the conductive layer and the insulating layer is formed between the capacitor parts so that the capacitor part is not destroyed by passing the ESD voltage through the ESD protection layer.

Referring to FIG. 7, the electric shock prevention device according to the second exemplary embodiment of the present invention may include a laminate 1000 in which a plurality of insulating sheets 100 (101 to 111) are stacked, and are provided in the laminate 1000. At least one

capacitor part

2000 and 4000 including

internal electrodes

200 and 201 to 208, an ESD protection part 3000 including at least one discharge electrode 310 and an ESD protection layer 320; The stack 1000 may include

external electrodes

5100, 5200, and 5000 formed on two opposite sides of the stack 1000 and connected to the first and

second capacitor parts

2000 and 4000 and the ESD protection part 3000. .

Here, the distances A1 and A2 between the ESD protection unit 3000 and the

capacitors

2000 and 4000 may be shorter or equal to the distances C1 and C2 between the two internal electrodes in the

capacitors

2000 and 4000. . That is, the thickness of each of the fifth and seventh insulating

sheets

105 and 107 positioned between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 is between the internal electrodes 200 in the

capacitor units

2000 and 4000. It may be thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110 located at. In addition, the distances A1 and A2 between the ESD protection unit 3000 and the

capacitors

2000 and 4000 may be shorter or equal to the distance B between the two discharge electrodes 310 of the ESD protection unit 3000. . That is, the thickness of each of the fifth and seventh insulating

sheets

105 and 107 disposed between the ESD protection unit 3000 and the

capacitor units

sheets

105 and 107 positioned between the ESD protection unit 3000 and the

capacitor units

2000 and 4000 is between the internal electrodes 200 in the

capacitor units

2000 and 4000. Thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110, or thinner than or equal to the distance B between the two discharge electrodes 310 of the ESD protection unit 3000. Can be formed. That is, the distances A1 and A2 between the ESD protection unit 3000 and the

capacitors

2000 and 4000, the distances C1 and C2 between the two internal electrodes in the

capacitors

2000 and 4000, and the ESD protection unit 3000. The distance B between the two discharge electrodes 300 may be A1 = A2 ≦ C1 = C2 or A1 = A2 ≦ B. Of course, A1 and A2 and C1 and C2 may not be the same. The thicknesses D1 and D2 of the lowermost and uppermost insulating sheets, that is, the first and eleventh insulating

sheets

101 and 111 may be 10 μm or more and 50% or less of the thickness of the laminate 1000, respectively. In this case, B ≦ D1 = D2, and D1 and D2 may be different.

In addition, in the electric shock prevention device according to the second embodiment of the present invention, two internal electrodes adjacent to the

discharge electrodes

311 and 312, that is, the fourth and fifth

internal electrodes

204 and 205 may be connected to the

discharge electrodes

311 and 312. It may be connected to the same external electrode 5000. That is, the first, third, fifth, and seventh

internal electrodes

201, 203, 205, and 207 are connected to the second external electrode 5200, and the second, fourth, sixth, and eighth internal electrodes ( 202, 204, 206, and 208 are connected to the first external electrode 5100. In addition, the first discharge electrode 311 is connected to the first external electrode 5100, and the second discharge electrode 312 is connected to the second external electrode 5200. Accordingly, the first discharge electrode 311 and the fourth internal electrode 204 adjacent thereto are connected to the first external electrode 5100, and the second discharge electrode 312 and the fifth internal electrode 205 adjacent thereto are formed of the first discharge electrode 311 and the fourth internal electrode 205 adjacent thereto. 2 is connected to the external electrode 5200.

As described above, when the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 5000, the ESD voltage is not applied to the electronic device even when the insulating sheet 100 is deteriorated, that is, the dielectric breakdown. Do not. That is, when the insulating electrode 100 is insulated and broken when the inner electrode 200 adjacent to the discharge electrode 310 and the inner electrode 200 are different from each other, the ESD voltage applied through the outer electrode 5000 is discharge electrode ( It flows to the other external electrode 5000 through the internal electrode 200 adjacent to 310. For example, as shown in FIG. 2, when the first discharge electrode 311 is connected to the first external electrode 5100 and the fourth internal electrode 204 adjacent thereto is connected to the second external electrode 5200, insulation is performed. When the sheet 100 is dielectrically broken, a conductive path is formed between the first discharge electrode 311 and the fourth internal electrode 204, and an ESD voltage applied through the first external electrode 5100 is applied to the first discharge electrode 311. ), It may flow into the dielectric breakdown fifth insulating sheet 105 and the second internal electrode 202, and thus may be applied to the internal circuit through the second external electrode 5200. In order to solve this problem, the thickness of the insulating sheet 100 can be formed to be thick, but in this case, there is a problem that the size of the electric shock prevention device increases. However, as shown in FIG. 6, even when the insulating sheet 100 is insulated and destroyed by the discharge electrode 310 and the inner electrode 200 adjacent thereto connected to the same external electrode 5000, the ESD voltage is transferred into the electronic device. Not authorized In addition, it is possible to prevent the ESD voltage from being applied without forming the thickness of the insulating sheet 100 thickly.

Referring to FIG. 8, the electric shock prevention device according to the third exemplary embodiment of the present invention may include a laminate 1000 in which a plurality of insulating sheets 100 (101 to 111) are stacked, and are provided in the laminate 1000, At least one

capacitor part

2000 and 4000 including

internal electrodes

external electrodes

second capacitor parts

2000 and 4000 and the ESD protection part 3000. . In this case, the external electrode 5000 may be formed to overlap the internal electrodes 200 by a predetermined region. That is, the third embodiment of the present invention differs from the first and second embodiments of the present invention in which the external electrode 5000 partially overlaps the internal electrode 200.

The external electrode 5000 may extend to the upper and lower surfaces as well as the side of the stack 1000. In addition, the external electrode 5000 may be formed to overlap a predetermined region with the internal electrode 200 connected to the different external electrodes 5000. For example, a portion extending below and above the stack 1000 of the first external electrode 5100 may overlap a predetermined region of the internal electrodes 200. In addition, portions formed to extend below and above the stack 1000 of the second external electrode 5200 may overlap the predetermined regions of the internal electrodes 200. For example, portions extending to the upper and lower portions of the stack 1000 of the external electrode 5000 may overlap the first and eighth

internal electrodes

201 and 208. That is, at least one of the external electrodes 5000 may extend to the top and bottom surfaces of the stack 1000, and at least one of the extended portions may partially overlap the internal electrodes 200. In this case, an area of the internal electrode 200 overlapping the external electrode 5000 may be 1% to 10% of the total area of the internal electrode 200. In addition, the external electrode 5000 may increase the area formed on at least one of the upper and lower surfaces of the laminate 1000 by a plurality of processes.

Meanwhile, in order to overlap the external electrode 5000, the internal electrodes 200 of the

capacitor parts

2000 and 4000 may be formed longer in the X-axis direction than in the first embodiment. For example, the end of the inner electrode 200 and the outer electrode 5000 adjacent thereto may be formed to maintain a spacing of 5% to 10% of the length of the X-axis direction. That is, the internal electrode 200 may be formed to have a length of 90% to 95% of the length of the insulating sheet 100 in the X axis direction.

By overlapping the external electrode 5000 and the internal electrode 200, a predetermined parasitic capacitance may be generated between the external electrode 5000 and the internal electrode 200. For example, capacitance may be formed between the first and eighth

internal electrodes

201 and 208 and the extensions of the first and second

external electrodes

5100 and 5200. Therefore, the capacitance of the electric shock prevention device may be adjusted by adjusting the overlapping area of the external electrode 5000 and the internal electrode 200. That is, even after the manufacturing process of the electric shock prevention device is completed, by adjusting the overlapping area of the external electrode 5000, the capacitance of the electric shock prevention device can be adjusted outside the laminate 1000.

Meanwhile, the ESD protection layer 320 of the ESD protection unit 3000 according to the present invention may be formed in various shapes. For example, as illustrated in FIGS. 9 to 11, the ESD protection layer 320 may be formed by applying or filling at least one region to a through hole formed in the insulating sheet 106. Although not shown,

capacitors

2000 and 4000 including a plurality of insulating sheets and internal electrodes may be formed on at least one of the lower and upper portions of the ESD protection layer 320. That is, FIGS. 9 to 11 illustrate only the ESD protection unit 3000 excluding the capacitor unit, and the capacitor unit (as shown in FIGS. 2, 3, 7 and 8 in at least one region of the lower side and the upper side thereof). 2000, 4000 may be formed. Various shapes of the ESD protection layer 320 according to the embodiments of the present invention will be described with reference to FIGS. 9 to 11 as follows.

9 to 11 are cross-sectional schematic views of the ESD protection unit 3000 according to embodiments of the present invention.

Referring to FIG. 9, through holes are formed in an insulating sheet, for example, the sixth insulating sheet 106 as shown in FIGS. 2 and 3, and an ESD protection layer 320 is formed in one region of the through holes. Can be. For example, as illustrated in (a) of FIG. 9, a through hole may be formed in a shape of a circle, a square, or the like, and an ESD protection material 324 may be formed on a side of the through hole. Here, the ESD protection material 324 may be at least one of the porous insulating layer, the conductive layer, and the void described with reference to FIGS. 5 and 6, and may be, for example, a mixed material of the porous insulating material and the conductive material. . In addition, voids 323 may be formed in regions where the ESD protection material 324 is not formed. Of course, as illustrated in FIG. 9B,

ESD protection materials

324b and 324c may be further formed on the lower and upper portions of the through-holes contacting the

discharge electrodes

311 and 312. That is, the ESD protection layer 320 may include an ESD protection material 324a formed on the side of the through hole, and an

ESD protection material

324b and 324c formed to contact the

discharge electrodes

311 and 312 at the bottom and the top of the through hole. have. In this case, a gap 323 may be formed in an area between the

ESD protection materials

324a, 324b, and 324c. In addition, as illustrated in FIG. 9C, an ESD protection material 324 may be formed in the through hole to be spaced apart from the side surface of the through hole. The ESD protection material 324 may be formed to contact the first and

second discharge electrodes

311 and 312. That is, the ESD protection material 324 may be in contact with the first and

second discharge electrodes

311 and 312 to be formed in a vertical direction therebetween. In this case, a gap 323 is formed between the ESD protection material 324 and the sidewall of the through hole in the through hole where the ESD protection material 324 is not formed. Meanwhile, the void 323 may be formed by filling the polymer material and then removing the polymer material during the firing process. That is, the polymer material is formed so that a part of the through hole is filled, and the ESD protection material, for example, a mixture of porous insulating material and conductive material is formed in one region of the through hole, and then the polymer material is removed in the firing process. An ESD protection layer 320 having an ESD protection material and a void 323 formed therein may be formed in the hole. Hereinafter, the ESD protection layer 320 including the ESD protection material and the voids 323 may be formed by such a process.

Referring to FIG. 10, an ESD protection layer 320 may be formed to form a through hole in a predetermined region of the insulating sheet 106 and to contact any one of the

discharge electrodes

311 and 312. For example, as shown in FIG. 10A, an ESD protection material 324 may be formed in the through hole to be spaced apart from the insulating sheet 106 and to contact the first discharge electrode 311. An ESD protection material 324 may be formed in the through hole to be spaced apart from the insulating sheet 106 and in contact with the second discharge electrode 312 as illustrated in (b) of FIG. In addition, as shown in FIG. 10C,

ESD protection materials

324a and 324b are formed in the through hole to be spaced apart from the insulating sheet 106 and to contact the first and

second discharge electrodes

311 and 312, respectively. Can be. In this case, the first and second

ESD protection materials

324a and 324b may be spaced apart from each other at a central portion of the through hole. In addition, a gap 323 is formed in a region where the ESD protection material 324 is not formed in the through hole. That is, the ESD protection material 324 is formed to be applied to a portion of the through-hole and in contact with at least one of the first and

second discharge electrodes

311 and 312, and the void 323 is formed in the remaining area so that the ESD protection layer is formed. 320 may be formed.

Referring to FIG. 11, a through hole may be formed in a predetermined region of the insulating sheet 106, and an ESD protection material 324 may be formed in a horizontal direction. In this case, the ESD protection material 324 may be formed to be spaced apart from the

discharge electrodes

311 and 312. That is, as illustrated in FIG. 11A, an ESD protection material 320 may be formed by protruding inward to at least one side of the through hole in the insulating sheet 106. That is, the first and second

ESD protection materials

324a and 324b may be formed to be spaced apart from each other from the sidewall of the through hole. In this case, the first and second

ESD protection materials

324a and 324b may be spaced apart from the first and

second discharge electrodes

311 and 312 and spaced apart from the center of the through hole. Of course, voids 323 are formed in regions where the ESD protection material 324 is not formed. In addition, as shown in FIG. 11B, the ESD protection material 324 may be formed in the horizontal hole in the through hole. That is, the ESD protection material 324 may be formed horizontally from one side of the through hole to the other side. Here, the void 323 may be formed in the remaining area of the through hole where the ESD protection layer 320 is not formed. That is, voids 323a and 323b are formed between the

discharge electrodes

311 and 312 and the ESD protection material 324, respectively.

On the other hand, the ESD protection layer 320 of the ESD protection unit 3000 according to the present invention may be formed differently from at least one of the thickness and width of at least one region different from the other region. In addition, the ESD protection layer 320 may be formed by applying at least a part of two or more sheets. An ESD protection layer according to other embodiments of the ESD protection layer 320 will be described with reference to FIGS. 12 to 18 as follows.

12 to 18 are schematic cross-sectional views of an ESD protection unit including an ESD protection layer according to another embodiment of the present invention. Although various embodiments of the present disclosure illustrate the ESD protection unit, a capacitor unit including a plurality of insulating sheets and a plurality of internal electrodes may be formed on and under the ESD protection unit.

Referring to FIG. 12, the ESD protection layer 320 may have a width in one direction of the central portion greater than that of the upper and lower portions. For example, the width of the center portion in the X direction may be greater than the width of the upper and lower portions. That is, as shown in FIGS. 12A and 12B, the ESD protection layer 320 is formed to have a predetermined thickness in the Z direction, and is formed to have a predetermined width in the X and Y directions, respectively. The width w1 in the X direction in the middle region of the thickness may be greater than the width w2 of the upper and lower portions. In addition, it may be formed so that the width becomes narrower toward the lower and upper in the central region. That is, the ESD protection layer 320 may have a hexagonal cross-sectional shape in the X direction. Accordingly, the ESD protection layer 320 may have a thickness t1 between the top surface and the bottom surface to be thicker than the thickness t2 of the edge. Of course, the ESD protection layer 320 may have a central portion larger than the upper and lower portions in the Y direction orthogonal to the X direction, and may have a smaller width from the central portion toward the lower and upper portions. Therefore, the ESD protection layer 320 may be formed in a polyhedral shape having a top surface and a bottom surface flat and having angular sides. In this case, the ESD protection layer 320 may be formed on two

sheets

106a and 106b as shown in FIG. 12C. That is, the lower sheet 106a has a first through-hole formed in a shape that becomes narrower from the lower surface to the upper surface, and the upper sheet 106b has a second width that becomes wider from the lower surface to the upper surface. Through-holes are formed, and at least a part of the ESD protection material is applied or filled in the first and second through-holes, and then stacked and pressed to form an ESD protection layer 320 having a width greater than that of the upper and lower portions of the center. Can be formed.

Referring to FIG. 13, the ESD protection layer 320 may have an elliptical cross-sectional shape in one direction. That is, the ESD protection layer 320 may be formed in an egg shape. For example, it may have a first width in the X direction and a second width in the Y direction orthogonal thereto, and may have different thicknesses in the Z direction. That is, as shown in FIGS. 13A and 13B, the first width w1 in the X direction and the second width w2 in the Y direction have the first width w1. It may be formed to be greater than or equal to the second width (w2). In addition, the thickness in the Z direction may be thicker at the center portion and thinner at the edge. That is, the central portion may be formed to have a first thickness t1 and become thinner from the edge toward the edge. Thus, any region between the central portion and the edge may be formed to have a second thickness t2 that is thinner than the first thickness t1. In this case, the entire surface of the upper and lower surfaces of the ESD protection unit 320 may be exposed on the insulating sheet 106, and only a part thereof may be exposed on the insulating sheet 106. For example, only about one third of the first width in the X direction may be exposed, and the remaining area may be formed in the insulating sheet 106. In addition, the ESD protection layer 320 may be formed on two

sheets

106a and 106b as shown in FIG. 13C. That is, the first through-hole is formed in a shape in which the lower sheet 106a becomes wider from the lower surface to the upper surface, and the second sheet 106b is in a shape in which the width narrows from the lower surface to the upper surface. Through-holes are formed, and at least a part of the ESD protection material is applied or filled in the first and second through-holes, and then stacked and pressed to form an ESD protection layer 320 having a width greater than that of the upper and lower portions of the center. Can be formed.

Referring to FIG. 14, the ESD protection layer 320 may be formed to have a width that increases from the bottom to the top. That is, as shown in (a) of FIG. 14, the ESD protection layer 320 may be formed in one sheet 106 in a shape in which the lower portion is smaller in width than the upper portion and wider in width toward the upper portion. Of course, on the contrary, the ESD protection layer 320 may be formed in a shape in which the lower portion is larger than the upper portion and the width thereof becomes narrower toward the upper portion. Therefore, the ESD protection layer can be formed in a substantially trapezoidal or inverted trapezoidal cross-sectional shape. In addition, as illustrated in FIG. 14B, an ESD protection layer 320 may be formed on at least two

sheets

106a and 106b. To this end, a first through hole is formed in the lower sheet 106a, the width of which extends from the bottom to the upper portion in contact with the first discharge electrode 311, and in the upper sheet 106b, the lower portion is the same as the upper width of the first through hole. A second through hole that maintains the width and becomes wider as the upper portion thereof is formed may be formed, and the ESD protection layer 320 may be formed by embedding, stacking, and compressing the ESD protection material in the first and second through holes.

Referring to FIG. 15, the ESD protection layer 320 may have a central portion having a width greater than that of the upper and lower portions. That is, the first ESD protection layer 320a having a predetermined width is formed at the bottom of the ESD protection layer 320, and the second width of the ESD protection layer 320a is wider than that of the first ESD protection layer 320a. An ESD protection layer 320b is formed, and a third ESD protection layer 320c having a narrower width than the second ESD protection layer 320b may be formed on the second ESD protection layer 320b. Here, the first to third

ESD protection layers

320a, 302b, and 320c may be formed to have the same thickness. In addition, the first and second

ESD protection layers

320a and 320c may have the same width and overlap each other. The second ESD protection layer 320b may be formed to have a width that is 1.5 times or more wider than that of the first and third

ESD protection layers

320a and 320c. For example, the second ESD protection layer 320b may be 1.5 to 3 times wider than the first and third

ESD protection layers

320a and 320c. As shown in FIG. 15A, the ESD protection layer 320 may be formed by stacking and compressing a predetermined hole in which at least a part of the ESD protection material is applied or filled in the two

sheets

106a and 106b. . For example, the lower sheet 106a is formed with a first through hole having a first width from the bottom to 2/3 thickness and a second width larger than the first width in the remaining 1/3 thickness, and the upper sheet 106b. ) Is formed with a second through hole having a second width from the bottom to a third thickness and the remaining 2/3 thickness having a first width, wherein at least some of these first and second through holes are coated with an ESD protection material or After filling, the ESD protection layer 320 may be formed by lamination and compression. Of course, the ESD protection layer 320 may be formed on the three

sheets

106a, 106b, and 106c as shown in FIG. 15B. To this end, a first through hole of a first width is formed in the lower sheet 106a, a second through hole of a second width larger than the first width is formed in the intermediate sheet 106b, and a first through hole is formed in the upper sheet 106c. A third through hole of one width may be formed, and an ESD protection layer 320 may be formed by stacking and compressing the ESD protection material by applying or filling at least a portion of the first through third through holes. Meanwhile, the ESD protection layer 320 may be formed by applying or filling at least a portion of an ESD protection material. For example, as shown in FIG. 15C, the ESD protection layer 320 may have a wide width. The voids may be formed in the first and third

ESD protection layers

320a and 320c to which the ESD protection material is applied or filled and the narrow first and third

ESD protection layers

320a and 320c are not applied or filled. Of course, the ESD protection material may be applied or filled only to a portion of the second ESD protection layer 320b that is coated or filled with and overlaps the first and third

ESD protection layers

320a and 320c. That is, as illustrated in FIG. 15D, the second ESD protection layer 320b is coated or filled with an ESD protection material only in an area overlapping the first and third

ESD protection layers

320a and 320c. In areas that do not have an ESD protection material applied or filled, voids may be formed.

Referring to FIG. 16, the ESD protection layer 320 may have a central portion smaller in width than the upper portion and the lower portion. That is, the ESD protection layer 320 has a first width of the first ESD protection layer 320a having a predetermined width, and a second width smaller than the first ESD protection layer 320a on the first ESD protection layer 320a. An ESD protection layer 320b is formed, and a third ESD protection layer 320c having a wider width than that of the second ESD protection layer 320b may be formed on the second ESD protection layer 320b. Here, the first to third

ESD protection layers

320a, 302b, and 320c may be formed to have the same thickness. In addition, the first and third

ESD protection layers

320a and 320c may have the same width and may overlap each other. The second ESD protection layer 320b may be formed to have a width that is 1.5 times or more narrower than that of the first and third

ESD protection layers

320a and 320c. For example, the second ESD protection layer 320b may be 1.5 to 3 times narrower than the first and third

ESD protection layers

320a and 320c. The ESD protection layer 320 may be formed by stacking and compressing a predetermined through hole in which at least a part of the ESD protection material is applied or filled in the two

sheets

106a and 106b as shown in FIG. 16A. have. For example, the lower sheet 106a is formed with a first through hole having a first width from the bottom to 2/3 thickness and a second width smaller than the first width in the remaining 1/3 thickness, and the upper sheet 106b. ) Is formed with a second through hole having a second width from the bottom to a third thickness and the remaining 2/3 thickness having a first width, wherein at least some of these first and second through holes are coated with an ESD protection material or After filling, the ESD protection layer 320 may be formed by lamination and compression. Of course, the ESD protection layer 320 may be formed on the three

sheets

106a, 106b, and 106c as shown in FIG. 16B. To this end, a first through hole of a first width is formed in the lower sheet 106a, a second through hole of a second width smaller than the first width is formed in the intermediate sheet 106b, and a first through hole is formed in the upper sheet 106c. A third through hole of one width may be formed, and an ESD protection layer 320 may be formed by stacking and compressing the ESD protection material by applying or filling at least a portion of the first through third through holes. Meanwhile, the ESD protection layer 320 may be formed by applying or filling at least a part of an ESD protection material. For example, as illustrated in FIG. An ESD protection material may be coated or filled on the 320a and 320c, and a gap may be formed in the narrow second ESD protection layer 320b without the ESD protection material being applied or filled. In addition, as shown in FIG. 16D, an ESD protection material may be applied or filled only on the second ESD protection layer 320b, and voids may be formed in the first and third

ESD protection layers

320a and 320c. have. Of course, the ESD protection material may be applied or filled only to a portion of the first and third

ESD protection layers

320a and 320c overlapping or overlapping the ESD protection material 320b. That is, as shown in FIG. 16E, an ESD protection material is formed in an area overlapping the second ESD protection layer 320b in the first and third

ESD protection layers

320a and 320c, and is not overlapped. In the region, voids may be formed.

Referring to FIG. 17, the ESD protection layer 320 may be formed in a shape in which thickness increases or decreases in one direction. For example, the ESD protection layer 320 may be reduced in thickness from one side in the X direction to the other side and then increased again to form a cross-sectional shape, for example, in a peanut shape. That is, the thickness increases from one end in the X direction toward the other end, and then decreases again, and then increases again. The thickness of one end and the other end is the same and may be formed in the thinnest shape in the center. Of course, it may be formed in an irregular shape so as to have a thickness that is thinnest in at least one region and increases in thickness in at least one direction from one side and the other side therefrom. The peanut protection ESD protection layer 320 may be formed on at least one insulating sheet 106. That is, the ESD protection layer 320 may be formed on one insulating sheet 106 or may be formed on two or more insulating sheets 106.

Referring to FIG. 18, the ESD protection layer 320 may be formed in a shape in which the upper and lower portions of the ESD protection layer 320 are wide and narrow in width toward the center portion therebetween. That is, the ESD protection layer 320 may be formed to be wider from the thickness direction, that is, the lower side and the upper side from the center in the Z direction. The ESD protection layer 320 may be formed on two insulating

sheets

106a and 106b. For example, a first through hole is formed in the lower insulating sheet 106a in a shape that becomes narrower from the bottom to an upper portion, and a second through hole is formed in the upper insulating sheet 106b in a width that becomes wider from the lower portion to the upper portion thereof. The through hole may be formed, and the ESD protection layer 320 may be formed by stacking and compressing the ESD protection material after applying or filling the ESD protection material in at least one region of the first and second through holes.

As described above, at least one of the thickness and the width of at least one region may be formed differently from the other regions, thereby effectively distributing the ESD voltage, thereby bypassing the ESD voltage more efficiently. Can be.

Meanwhile, in the first to third embodiments of the present invention, an ESD protection material is embedded or coated in a through hole in which the ESD protection layer 320 is formed in the insulating sheet 104. However, the ESD protection layer 320 may be formed in a predetermined region of the insulating sheet, and the discharge electrode 310 may be formed to contact the ESD protection layer 320, respectively. That is, as shown in the cross-sectional view of the fourth embodiment of FIG. 19, two

discharge electrodes

311 and 312 are formed on the insulating sheet 106 at a predetermined interval in the horizontal direction, and between the two

discharge electrodes

311 and 312. An ESD protection layer 320 may be formed on the substrate. Even in this case, the ESD protection layer 320 may be formed differently from other regions where the thickness and / or width of at least one region is different. In addition, the width of the ESD protection layer 320 in the Y direction may be greater than the widths of the

discharge electrodes

311 and 312. The length of the internal electrode 200 in the X direction and the width in the Y direction are greater than the lengths and the widths of the

discharge electrodes

311 and 312, and the width of the internal electrode 200 in the Y direction is the ESD protection layer ( Greater than the width of 320).

The ESD protection unit 3000 includes at least two

discharge electrodes

311 and 312 spaced apart on the same plane and at least one ESD protection layer 320 provided between the at least two

discharge electrodes

311 and 312. can do. That is, two

discharge electrodes

311 and 312 may be provided in a direction in which the external electrodes 5000 are formed so as to be spaced apart from each other in a predetermined region of the sheet, for example, in the X direction, and at least in a direction orthogonal thereto. Two or more discharge electrodes (not shown) may be further provided. Accordingly, at least one discharge electrode may be formed in a direction orthogonal to the direction in which the external electrode 5000 is formed, and at least one discharge electrode may be formed to face each other at a predetermined interval. For example, the ESD protection unit 3000 may include the sixth insulating sheet 106 and the first and

second discharge electrodes

311 and 312 spaced apart from the sixth insulating sheet 106. ) And an ESD protection layer 320 formed on the sixth insulating sheet 106. Here, the ESD protection layer 320 may be formed such that at least a portion thereof is connected to the first and

second discharge electrodes

311 and 312. The first discharge electrode 311 is connected to the external electrode 5100 to be formed on the sixth insulating sheet 106, and the end portion thereof is connected to the ESD protection layer 320. The second discharge electrode 312 is connected to the external electrode 5200 and is formed to be spaced apart from the first discharge electrode 311 on the sixth insulating sheet 106, and the end portion thereof is connected to the ESD protection layer 320. . The ESD protection layer 320 may be formed to be connected to the first and

second discharge electrodes

311 and 312 at a predetermined region, for example, a central portion of the sixth insulating sheet 106. In this case, the ESD protection layer 320 may be formed to partially overlap the first and

second discharge electrodes

311 and 312. An ESD protection layer 320 is formed on the exposed sixth insulating sheet 106 between the first and

second discharge electrodes

311 and 312 to be connected to the side surfaces of the first and

second discharge electrodes

311 and 312. It may be. However, in this case, since the ESD protection layer 320 may be spaced apart from the first and

second discharge electrodes

311 and 312 without being in contact with each other, the ESD protection layer 320 may overlap the first and

second discharge electrodes

311 and 312. It is preferred to form 320).

Meanwhile, in the fourth embodiment of the present invention, the discharge electrode 310 and the ESD protection layer 320 may be formed on the same plane, and thus may be modified in various shapes. For example, as shown in FIG. 20A, a portion of the ESD protection layer 320 may overlap the first discharge electrode 311, and a portion of the ESD protection layer 320 may be in contact with the insulating sheet 105. That is, the ESD protection layer 320 may be formed on the top and side surfaces of the first discharge electrode 311. In addition, the second discharge electrode 312 may be formed on the insulating sheet 200 in contact with the top and side surfaces of the ESD protection layer 320. In this case, the ESD protection layer 320 may have any one of a thickness and a width of at least one region different from the other regions. That is, the width in the X direction may be larger than the width in the Y direction, and the thickness of at least one region in the vertical direction may be different from the other region. For example, the thickness of the region in contact with the insulating sheet 105 may be thicker than the thickness of the region formed between the first and

second discharge electrodes

311 and 312.

In addition, as shown in FIG. 20B, the ESD protection layer 320 is in contact with the upper portion of the first discharge electrode 311, and the second discharge electrode 312 is formed on the upper portion of the ESD protection layer 320. In contact with the surface may be formed on the insulating sheet 312. In this case, a space A may be formed on side surfaces of the second discharge electrode 312, the ESD protection layer 320, and the first discharge electrode 311. That is, the space A may be formed so that at least the first discharge electrode 311 and the second discharge electrode 312 do not contact each other. Before forming the first discharge electrode 311 to form the space A, a spacer using a polymer material is formed on the side of the ESD protection layer 320, and then the polymer material is volatilized during formation in the firing process. Space A may be formed. Of course, an insulation may be formed in the space A, and the ESD protection layer 320 may be extended.

As shown in FIG. 20C, the ESD protection unit 3000 may be implemented using the insulating sheet 200 having a step. That is, the first discharge electrode 311 is formed in a thin region of the insulating sheet 200 in which some regions have a thinner thickness than other regions, and the ESD protection layer (3) is formed on the first discharge electrode 311 so that the step is removed. 320 may be formed, and the second discharge electrode 312 may be formed to overlap the ESD protection layer 320 in a thick region.

In addition, even when the ESD protection layer 320 and the discharge electrode 310 are formed on the same plane, internal electrodes of the

capacitor parts

2000 and 4000 adjacent to the one discharge electrode 310 may be connected to the same external electrode 5000. It may be. That is, as shown in FIG. 21, the first discharge electrode 311 and the fourth internal electrode 204 adjacent thereto are connected to the first external electrode 5100, and the second discharge electrode 312 and the fifth adjacent electrode 512 are adjacent to each other. The internal electrode 205 may be connected to the second external electrode 5200. In this case, the fourth internal electrode 204 may be formed to have the same length as the first discharge electrode 311, and the fifth internal electrode 205 may be formed to have the same length as the second discharge electrode 312. That is, when the fourth internal electrode 204 partially overlaps the second discharge electrode 312, or when the fifth internal electrode 205 partially overlaps the first discharge electrode 311, the insulating sheet 100 is formed. ), The ESD voltage may flow when the insulation breaks, so that the inner electrode 200 adjacent to the discharge electrode 310 and connected to the same external electrode 5000 is formed to have a length shorter or the same as the discharge electrode 310. Do. In addition, even when the discharge electrode 310 and the ESD protection layer 320 are formed on the same plane, the distances A1 and A2 between the discharge electrode 310 and the adjacent

internal electrodes

204 and 205 may be the capacitor portion 2000. It may be less than or equal to the distance (C1, C2) between the two internal electrodes 200 of, 4000. That is, A1 = A2 ≦ C1 = C2. At this time, A1 and A2 may be different, and C1 and C2 may also be different.

In addition, as shown in FIG. 22, even when the discharge electrode 310 and the ESD protection layer 320 are formed on the same plane, the external electrode 5000 is formed to partially overlap with the internal electrode 200, thereby preventing an electric shock. You can adjust the capacitance of.

On the other hand, as the chip size becomes smaller, the designable space becomes smaller. Therefore, there is a need for an internal structure of an electric shock prevention device having high ESD withstand characteristics even in a narrow space. However, when the size of the electric shock prevention device is reduced, the thickness of the insulating sheet is inevitably reduced due to the lack of space, which lowers the breakdown voltage characteristic of the insulating sheet itself, so that the insulation resistance of the insulating sheet can be easily applied even when a low level of ESD is applied. This breaking phenomenon occurs. In order to solve this problem, it is possible to improve ESD withstand voltage characteristics in the same space than a general stacking type by using a floating shape having a plurality of shapes. That is, since the thickness of the insulating sheet is increased by more than two times in one region between the internal electrodes by deforming the shape of the internal electrodes of the capacitor part, the ESD resistance characteristics may be maintained. This, combined with the design of the ESD protection of the electric shock protection device, results in a higher ESD immunity improvement. As a result, if the ESD is not passed to the ESD protection layer of the ESD protection due to the repetitive ESD voltage of the ESD protection, the capacitor part may be damaged, causing dielectric breakdown, and the ESD protection may not be degraded. During voltage inflow, an ESD voltage load may be generated in the capacitor part for a while at a time between 1 ns and 30 ns of vacancy until the response time of the ESD protection part of the electric shock protection device, thereby causing dielectric breakdown. However, by forming the capacitor portion in the floating type, it is possible to improve the ESD breakdown characteristic of the capacitor layer, thereby improving the phenomenon in which the insulation resistance is destroyed and the short is generated.

Hereinafter, various embodiments of the present invention for forming the capacitor unit in the floating type will be described with reference to FIGS. 23 to 26.

23 to 26, an electric shock prevention device according to another exemplary embodiment of the present disclosure may include a laminate 1000 in which a plurality of insulating sheets 101 to 113; 100 are stacked, and in the laminate 1000. The first capacitor part 2000, the ESD protection part 3000, and the second capacitor part 4000 may be provided. In addition, the electronic device may further include

external electrodes

second capacitor parts

2000 and 4000 and the ESD protection part 3000. can do. The first capacitor part 2000 may include a plurality of internal electrodes 201 to 205, and the second capacitor part 4000 may also include a plurality of internal electrodes 208 to 212. That is, the first and

second capacitor parts

2000 and 4000 may have the same number, for example, five internal electrodes. In addition, an ESD protection unit 3000 including

discharge electrodes

311 and 312 and an ESD protection layer 320 provided therebetween is provided between the first and

second capacitor units

2000 and 4000. Here, the first and

second capacitor parts

2000 and 4000 may be formed in a shape in which at least one internal electrode has at least one region removed.

As shown in FIG. 23, the internal electrode 201 of the first capacitor part 2000 is formed in a shape in which the center part is removed to a predetermined width, for example, and is symmetrical with the ESD protection part 3000 interposed therebetween. The internal electrode 210 of the second capacitor part 4000 provided at the location may also be formed in a shape in which a predetermined region is removed at the same location as the internal electrode 201. Since the

internal electrodes

201 and 210 are formed by removing a predetermined region, an overlapping area with the

internal electrodes

202 and 209 adjacent thereto is reduced. In this case, two regions may be connected to the first and second

external electrodes

5100 and 5200, respectively. As such, the predetermined regions of the

internal electrodes

201 and 210 are removed to form a thick

insulating sheet

102 and 112 between the

internal electrodes

201 and 210 and the adjacent

internal electrodes

202 and 209. That is, since two insulating

sheets

101 and 102 are provided between the inner electrode 202 and the removed portion of the inner electrode 201, the thickness of the insulating sheet 100 is increased. Therefore, since the thickness of the insulating sheet 100 is increased at least twice in one region between the internal electrodes 200 of the

capacitor parts

2000 and 4000, the ESD resistance characteristic may be maintained.

In addition, as shown in FIG. 24, for example, a predetermined region of the

internal electrodes

201, 203, and 205 of the first capacitor unit 2000 is removed, and the ESD protection unit 3000 is interposed therebetween. For example, predetermined regions of the

internal electrodes

206, 208, and 210 of the second capacitor unit 4000 positioned symmetrically may be removed. In this case, the

internal electrodes

202, 204, 207, and 209 are formed to overlap at least some of the

internal electrodes

201, 203, 205, 206, 208, and 210 without being in contact with the external electrode 5000. Can be. That is, the

internal electrodes

202, 204, 207, and 209 are formed at the center of the insulating sheet 100 and not formed at the center of the insulating sheet 100, and the

internal electrodes

201, 203, 205, 206, 208, It may be formed to overlap with 210.

Meanwhile, the internal electrodes of the first and

second capacitor parts

2000 and 4000 may be removed from the central area as well as the areas spaced a predetermined distance therefrom. For example, as shown in FIG. 25, the central region of the

internal electrodes

201, 203, and 205 of the first capacitor unit 2000 is removed, and the

internal electrodes

202 and 204 positioned therebetween are disposed in the center. Removal portions may be formed at both sides of the region spaced apart from each other by a predetermined interval. In addition, the second capacitor part 4000 has

internal electrodes

206 and 208 at positions symmetrical with the

internal electrodes

201, 203 and 205 of the first capacitor part 2000 with the ESD protection part 3000 interposed therebetween. , A central region of 210 may be removed, and

internal regions

207 and 209 disposed therebetween may have a removal region formed at the same position as

internal electrodes

202 and 204 of the first capacitor unit 2000. .

In addition, as illustrated in FIG. 26, at least two removal regions are formed in the central region of the

internal electrodes

201, 203, and 205 of the first capacitor unit 2000, and the internal electrodes 202, which are positioned therebetween. 204 may be formed with removal regions on both sides spaced apart from the central region by a predetermined interval. In addition, the second capacitor part 4000 has

internal electrodes

206 and 208 at positions symmetrical with the

internal electrodes

201, 203 and 205 of the first capacitor part 2000 with the ESD protection part 3000 interposed therebetween. At least two removal regions are formed in the central region of the second and second regions 210, and the

internal electrodes

207 and 209 disposed therebetween are disposed at the same position as the

internal electrodes

202 and 204 of the first capacitor unit 2000. This can be formed.

Of course, even when the first and

second discharge electrodes

311 and 312 are formed in the horizontal direction and the ESD protection layer 320 is in contact with them, the

capacitor parts

2000 and 4000 may float at least one internal electrode. It can be formed into a type.

Meanwhile, the electric shock prevention device according to the embodiments of the present invention may form at least one ESD protection layer 320 of the ESD protection unit 3000. That is, one ESD protection layer 300 may be formed in the X direction as shown in FIGS. 2, 3, 7, and 8, and the ESD protection layer in the X direction as shown in FIGS. 27 to 30. Two or more 320 may be formed. In this case, a plurality of ESD protection layers 320 may be formed in the Y direction. For example, as shown in FIG. 27, two

ESD protection layers

320a and 320b may be formed on the same plane, and as shown in FIG. 28, three

ESD protection layers

320a, 320b and 320c may also be formed. At least two

ESD protection layers

320a, 320b, and 320c may be connected by internal electrodes. In addition, as shown in FIG. 29, four

ESD protection layers

320a, 320b, 320c, and 320d may be divided into two, respectively, and as shown in FIG. 30, six

ESD protection layers

320a, 320b, 320c, 320d, 320e, and 320f may be formed by being divided up and down by three. In the ESD protection layers 320 spaced apart from each other, the upper ESD protection layers may be connected to each other, and the lower ESD protection layers may be connected to each other. Even when the plurality of ESD protection layers 320 are formed as described above, each ESD protection layer 320 may be formed in the same structure or may be formed in a different structure.

Of course, even when the first and

second discharge electrodes

311 and 312 are formed in the horizontal direction and the ESD protection layer 320 is formed in contact with them, the ESD protection layer 320 is at least one of the vertical direction and the horizontal direction. At least two may be provided in the direction.

As described above, in the electric shock prevention device according to the present invention, at least one

capacitor part

2000 and 4000 and at least one ESD protection part 3000 may be formed in one stack. For example, one capacitor and two or more ESD protections may be formed. In this case, the capacitor may be formed between the internal circuit of the electronic device and the metal case, and an ESD protection unit may be formed between the capacitor and the ground terminal. To this end, the first and second

external electrodes

5100 and 5200 are formed on two opposite sides of the laminate, and the first and second

external electrodes

5100 and 5200 are not formed on the two opposite sides. Third and fourth external electrodes (not shown) may be formed. The first and second

external electrodes

5100 and 5200 may be provided between the metal case of the electronic device and the internal circuit, respectively, and the third and fourth external electrodes may be connected to the ground terminal. That is, the first and second

external electrodes

5100 and 5200 may be connected to two regions between the metal case of the electronic device and the internal circuit, respectively, and the third and fourth external electrodes may be connected to the ground terminal.

In addition, in the electric shock prevention device according to the present invention, a plurality of

capacitor parts

2000 and 4000 and a plurality of ESD protection parts 3000 may be formed in a horizontal direction in the stack 1000. That is, at least one

capacitor part

2000 and 4000 and the ESD protection part 3000 stacked in the vertical direction are arranged in at least two in the horizontal direction and connected to at least two external electrodes 5000 in the horizontal direction. A plurality of electric shock prevention elements including a plurality of capacitors and a plurality of ESD protection units may be provided in parallel. Therefore, two or more electric shock prevention devices may be implemented in one laminate 1000. In this case, for example, the plurality of first external electrodes 5100 may be connected to a plurality of regions of the metal case of the electronic device, and the plurality of second external electrodes 5200 may be connected to a ground terminal of the electronic device. Meanwhile, at least one of at least one internal electrode of the plurality of capacitor parts may be formed to have a different length. That is, at least one inner electrode of the plurality of inner electrodes formed in the horizontal direction to form different capacitor parts may be formed to be shorter or longer than the other inner electrodes. Of course, the capacitance may be adjusted by adjusting not only the length of the inner electrode but also at least one of the overlapping area of the inner electrode and the stacking number of the inner electrode. Therefore, at least one capacitance of the plurality of capacitors may be different. That is, at least one of the plurality of capacitors having different capacitances may be implemented in one stack.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. In other words, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

Claims

A laminate in which a plurality of insulating sheets are stacked;

A capacitor unit including a plurality of internal electrodes formed in the stack;

An ESD protection unit formed inside the stack and including at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes; And

An external electrode provided on at least two side surfaces of the laminate and connected to the capacitor part and the ESD protection part;

The ESD protection layer is formed of at least one of the thickness and width of at least one region is different from the other region.
The electric shock prevention device of claim 1, wherein the inner electrode adjacent to the discharge electrode is connected to a same outer electrode.
The electric shock prevention device according to claim 1 or 2, wherein the external electrode extends to at least one of upper and lower portions of the laminate and partially overlaps the internal electrode.
The electric shock prevention of claim 3, wherein the length of one direction of the internal electrode is longer than or equal to the length of the discharge electrode, and the width of the internal electrode in another direction perpendicular to the one direction is greater than the width of the ESD protection layer and the width of the discharge electrode. device.
The electric shock prevention device of claim 4, wherein a width of the ESD protection layer is larger than a width of the discharge electrode.
The electric shock prevention device according to claim 5, wherein A ≤ C or A ≤ B, wherein A is the distance between the discharge electrode and the adjacent internal electrodes, A is the distance between the discharge electrodes, and B is the distance between the internal electrodes. .
The device of claim 6, wherein the ESD protection layer comprises at least one of an ESD protection material and a void including at least one of a porous insulating material and a conductive material.
The electric shock prevention device of claim 7, wherein the ESD protection layer is formed in a vertical direction or in a horizontal direction between the discharge electrodes.
The electric shock prevention device of claim 8, wherein the ESD protection layer is formed on at least one insulating sheet.
The electric shock prevention device of claim 9, wherein the ESD protection layer has a polyhedron shape.
The electric shock prevention device of claim 10, wherein the ESD protection layer has a width that is widest at an intermediate thickness in one direction and narrows toward upper and lower portions thereof.
The electric shock prevention device of claim 10, wherein the ESD protection layer is formed to have a thickness in a central region, the thickness being thinner toward both edges.
The electric shock prevention device of claim 10, wherein the ESD protection layer has a shape in which the thickness decreases in one direction and then increases again.
The electric shock prevention device of claim 9, wherein the ESD protection layer is formed to at least partially contact the discharge electrodes.
The electric shock prevention device of claim 14, wherein the ESD protection material is connected to at least one of the discharge electrodes and the remaining area is formed with a void.
The electric shock prevention device of claim 7, wherein the ESD protection material is formed in at least one region in the through hole so as not to contact the discharge electrode, and the remaining region is formed with a void.
The electric shock prevention device of claim 4, wherein at least two capacitor parts and the ESD protection part are provided in the stack in a horizontal direction.
The electric shock prevention device of claim 17, wherein the internal electrodes are stacked in a vertical direction to form one capacitor part, and the horizontal electrodes are arranged in a horizontal direction to form a plurality of capacitor parts.
The electric shock prevention device of claim 1, wherein one of the external electrodes is connected to the metal case of the electronic device and the other is connected to the ground terminal to block the electric shock voltage and bypass the ESD voltage.
A laminate in which a plurality of insulating sheets are stacked;

A capacitor unit including a plurality of internal electrodes formed in the stack;

An ESD protection unit formed on at least a portion of the insulating sheet to protect the ESD voltage; And

An external electrode provided on at least two side surfaces of the laminate and connected to the capacitor part and the ESD protection part;

The ESD protection unit includes at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes,

The ESD protection layer is formed at least one of the thickness and width of at least one region is different from the other region,

The length of one direction of the internal electrode is longer than or equal to the length of the discharge electrode and the width in the other direction perpendicular to the one direction is greater than the width of the ESD protection layer and the width of the discharge electrode, and the width of the ESD protection layer. Is an electric shock prevention element larger than the width of said discharge electrode.
21. The electric shock prevention device according to claim 20, wherein A≤C or A≤B when the distance between the discharge electrode and the adjacent internal electrodes is A, the distance between the discharge electrodes is B, and the distance between the internal electrodes is C. .
An electric shock protection device provided between the metal case and the internal circuit to block the electric shock voltage and bypass the ESD voltage,

The electric shock prevention element,

A laminate in which a plurality of insulating sheets are stacked;

A capacitor unit including a plurality of internal electrodes formed in the stack;

An ESD protection unit formed on at least a portion of the insulating sheet to protect the ESD voltage; And

An external electrode provided on at least two side surfaces of the laminate and connected to the capacitor part and the ESD protection part;

The ESD protection unit includes at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes,

The ESD protection layer is formed at least one of the thickness and width of at least one region is different from the other region,

The length of one direction of the internal electrode is longer than or equal to the length of the discharge electrode and the width in the other direction perpendicular to the one direction is greater than the width of the ESD protection layer and the width of the discharge electrode, and the width of the ESD protection layer. Is an electronic device larger than the width of the discharge electrode.
The electronic device of claim 22, wherein an inner electrode adjacent to the discharge electrode is connected to a same outer electrode.
The method according to claim 22 or 23, wherein A is the distance between the discharge electrode and the inner electrode adjacent to A, the distance between the discharge electrode is B, and the distance between the inner electrodes is A ≦ C or A ≦ B. Electronics.
The electronic device of claim 22 or 23, wherein the external electrode extends to at least one of an upper portion and a lower portion of the stack to partially overlap the inner electrode.