KR20180074204A - Complex protection device and electronic device having the same - Google Patents

Abstract

The present invention suggests a complex protection element and an electronic device including the same. The complex protection element, as a complex protection element provided between an internal circuit and a conductor which a user of an electronic device can touch, includes: a contact part of which at least a part is in contact with the internal circuit of an electronic device; a complex protection part of which one side is coupled to the contact part; and a conductive part which has one area coupled to the other side of the complex protection part and is fixed to the inside of the electronic device. Accordingly, the present invention can protect an electronic device and a user from a voltage and a current.

Description

TECHNICAL FIELD [0001] The present invention relates to a composite protection device, and more particularly,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite protection device, and more particularly, to a complex protection device provided in various electronic devices and capable of protecting an electronic device or a user from voltage and current.

Various electronic components such as smart phones are integrated with various components according to their functions. An electronic device is provided with an antenna capable of receiving various frequency bands such as a wireless LAN (wireless LAN), a Bluetooth (Bluetooth), and a GPS (Global Positioning System) And can be installed in a case constituting an electronic device. Therefore, a contactor for electrical connection is provided between the antenna installed in the case and the internal circuit of the electronic device.

Meanwhile, in recent years, as the image and durability of smart phones have been emphasized, the spread of terminals using metal materials is increasing. That is, the spread of smart phones having a frame made of metal or a case made of metal except the screen display portion on the front is increasing.

However, if a smartphone using a metal case is charged while using a non-genuine charger, an electric shock may occur. That is, a shock current is generated by charging using a non-genuine charger or a defective charger which does not incorporate an overcurrent protection circuit or uses a low-quality device, and this shock current is conducted to the ground terminal of the smart phone, So that a user who is in contact with the metal case can be electrically charged.

Therefore, there is a need for a component that can prevent damage to the internal circuit caused by static electricity and electric shock of the user.

Korean Patent No. 10-0876206

The present invention provides a composite protection device provided in an electronic device such as a smart phone and capable of protecting an electronic device or a user from a voltage and a current, and an electronic apparatus having the same.

The present invention provides a composite protection device that is not insulated and destroyed by overvoltage such as ESD (ElectroStatic Discharge), and an electronic apparatus having the same.

A composite protection device according to an embodiment of the present invention is a composite protection device provided between an internal circuit and a conductor capable of being contacted by a user of the electronic device, the contact protection device comprising: a contact part at least part of which is in contact with an internal circuit of the electronic device; A composite protection part having a contact surface coupled to the contact part; And a conductive part coupled to the other surface of the composite protection part in one area and fixed inside the electronic device.

A transient voltage applied from the outside is bypassed to a ground terminal inside the electronic device, a voltage or a current leaked from the inside of the electronic device is cut off, and a communication signal is transmitted.

And a conductive adhesive member provided on the contact portion.

And a support portion provided on one side of the conductive portion.

The support portion is provided at a height of the contact portion and the composite protection portion so that one side is in contact with the conductive portion and the other side is in contact with the inside of the electronic device, and the support portion is insulating.

The support portion is provided between the conductive portion and the fixed portion of the electronic device, and the support portion is conductive.

According to another aspect of the present invention, there is provided an electronic apparatus comprising a window and a display unit, a bracket provided below the display unit, and a main body provided below the bracket, Mode, a cover case covering the main board, and a side case closing a side space between the window and the cover case, and the composite protection element is provided inside the side case.

The composite protection device includes: a contact portion at least a portion of which is in contact with an internal circuit of the electronic device; A composite protection part having a contact surface coupled to the contact part; And a conductive part coupled to the other surface of the composite protection part in one area and fixed inside the electronic device.

And a fixing unit provided on the inner side of the side case to fix the composite protection element.

And the conductive portion is fixed to the fixing portion.

The contact portion is electrically connected to an internal circuit of the main board.

The bracket is at least partially electrically conductive, the contact portion is in contact with the bracket, and the bracket is connected to an internal circuit of the main board.

A composite protection device according to embodiments of the present invention is provided between a metal case and an internal circuit of an electronic device to block an electric voltage and bypass an overvoltage such as ESD to a ground terminal. That is, the composite protection element may be provided between the side case of the electronic device and the internal circuit, including the contact portion, the composite protection portion, and the conductive portion. In other words, the coupling unit in which the contact unit and the complex protection unit are combined is fixed to one end of the plate-like conductive unit, and the other end of the conductive unit is fixed by the fixing unit provided inside the side case. At this time, a supporting portion is provided in the side case, so that the coupling of the complex protective element can be smoothly performed.

Such a composite protection device maintains an insulated state to block an electrostatic voltage leaking from an internal circuit, and has a protection part for protecting an internal circuit by protecting an overvoltage inside, thereby preventing an overvoltage from flowing into the electronic device. Thus, electronic devices and users can be protected from voltage and current.

1 to 3 are a front perspective view, a rear perspective view, and an exploded perspective view of an electronic apparatus to which a composite protection device according to embodiments of the present invention is applied.
4 is a view of one area of an electronic device equipped with a composite protection device according to embodiments of the present invention.
FIG. 5 is an enlarged view of one area of an electronic device equipped with a composite protection device according to the first embodiment of the present invention; FIG.
6 is a cross-sectional view of a composite protection device;
7 and 8 are a perspective view and a cross-sectional view of a composite protection portion of a composite protection device according to an embodiment of the present invention;
9 to 12 are enlarged views of one area of an electronic device equipped with a composite protection device according to second to fifth embodiments of the present invention.
13 to 17 are views of a composite protection unit according to another embodiment of the present invention.
18-20 are cross-sectional views of a composite guard according to various embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely.

1 to 3 are a front perspective view, a rear perspective view and an isolated perspective view of an electronic apparatus to which a composite protection device according to embodiments of the present invention is applied.

1 to 3, an electronic device 1000 includes a case 1100 that forms an appearance, a plurality of function modules for performing a plurality of functions of the electronic device 1000 in the case 1100, Circuit and the like are provided. The case 1100 may include a side case 1110 and a cover case 1120. The side case 1110 may be at least a side surface of the electronic device 1000 and the cover case 1120 may be provided on the rear surface of the electronic device 1000 to cover the battery 1200. The cover case 1120 may be integrally formed or detachable. When the battery 1200 is integrated, the cover case 1120 may be integrally formed. When the battery 1200 is removable, The case 1120 may also be removable. Of course, the side case 1110 and the cover case 1120 may be integrally formed. That is, the case 1100 can be formed so as to close the side surface and the rear surface of the side case 1110 and the cover case 1120 and expose the upper surface. At least a part of the case 1100 may be formed by injection molding of a synthetic resin or may be formed of a metal material. That is, at least a part of the side case 1110 and the cover case 1120 may be formed of a metal material. For example, the side case 1110 constituting the side surface of the electronic device 1000 may be formed of a metal material . Of course, the cover case 1120 may also be formed of a metal material. The metal material used for the case 1100 may include, for example, stainless steel (STS), titanium (Ti), aluminum (Al), or the like. 3, a bracket 1400 may be provided inside the side case 1110, and a display unit 1310 may be provided on the bracket 1400. In addition, a main board 1500 and a battery 1200 may be provided between the bracket 1400 and the cover case 1120. At this time, the battery 1200 may be provided in a predetermined area of the main board 1500. That is, the battery 1200 may be provided in a region where a predetermined area of the main board 1500 is removed and removed.

A display unit 1310, an audio output module 1320, a camera module 1330a, and the like may be disposed on an upper surface of the electronic device 1000. [ In addition, a microphone 1340, an interface 1350, and the like may be disposed on one side of the electronic device 1000. That is, the display unit 1310, the sound output module 1320, and the camera module 1330a are disposed on the upper surface of the electronic device 1000, and a predetermined area of the side case 1110 of the electronic device 1000, A microphone 1340, an interface 1350, and the like may be disposed on the side surface. The display unit 1310 is disposed on the upper surface of the electronic device 1000 and occupies most of the upper surface. That is, the display unit 1310 is provided in a substantially rectangular shape having predetermined lengths in the X and Y directions, and includes a central region on the upper surface of the electronic apparatus 1000, . In this case, a predetermined space not occupied by the display unit 1310 is provided between the outer surface of the upper surface of the electronic device 1000, that is, between the side case 1110 and the display unit 1310, An audio output module 1320 and a camera module 1330a may be provided on the upper side and a user input unit including the front input unit 1360 may be provided on the lower side. A bezel region 1110 is provided between the display portion 1310 and the side case 1110 of the electronic device 1000 between the two edges of the display portion 1310 extending in the X direction and the edge of the electronic device 1000, Can be provided. Of course, a separate bezel area may not be provided and the display unit 1310 may be extended to the edge of the electronic device 1000 in the Y direction.

The display unit 1310 outputs time information and can input tactile information of the user. The display unit 1310 may be provided with a touch input device. The touch input device includes a window (not shown) covering a front surface of the terminal body, a display unit (not shown) such as a liquid crystal display device for outputting start information, a touch sensor (not shown) provided between the window and the display unit, . ≪ / RTI > For example, a plurality of electrodes may be formed on a transparent plate having a predetermined thickness and spaced apart from each other by a predetermined distance in one direction and another direction orthogonal to the predetermined direction, and a dielectric layer may be provided therebetween to detect a touch input of a user. That is, in the touch sensor, a plurality of electrodes are arranged in a lattice pattern, for example, and a capacitance according to a distance between electrodes according to a touch input of a user can be detected. The display unit 1310 may further include a pressure sensor for inputting touch information or pressure information of a user. Accordingly, the touch sensor detects coordinates in the horizontal direction, i.e., mutually orthogonal X direction and Y direction, which the user touches, and the pressure sensor can detect not only the X direction and Y direction but also the vertical direction, i.e., .

An audio output module 1320, a camera module 1330a, a front input unit 1360, and the like may be provided in an area other than the display unit 1310 on the top surface of the electronic device 1000. [ At this time, the sound output module 1320 and the camera module 1330a are provided on the upper side of the display portion 1310 in the X direction, and the user input portion such as the front input portion 1360 is provided on the lower side of the display portion 1310 in the X direction . The front input unit 1360 may include a touch key, a push key, or the like, and may be configured without a front input unit 1350 using a touch sensor or a pressure sensor. At this time, a function module (not shown) for the function of the front input unit 1360 may be provided on the lower side of the front input unit 1360 in the lower side of the front input unit 1360, that is, in the Z direction. That is, a function module that performs a function of a touch key or a push key may be provided according to a driving method of the front input unit 1360, and a touch sensor or a pressure sensor may be provided. Also, the front input unit 1360 may include a fingerprint recognition sensor. That is, the user can recognize the fingerprint of the user through the front input unit 1360 and detect whether the user is a legitimate user. For this purpose, the function module may include a fingerprint recognition sensor. On the other hand, a second pressure sensor (not shown) may be provided on one side and the other side of the front input unit 1360 in the Y direction. A second pressure sensor is provided on both sides of the front input unit 1360 as a user input unit to detect a touch input of a user and return to a previous screen and a setting function for setting a screen of the display unit 1310. [ At this time, the front input unit 1360 using the fingerprint recognition sensor may perform a function of returning to the initial screen as well as the fingerprint recognition of the user. Meanwhile, a haptic feedback device such as a piezoelectric vibrating device may be further provided in contact with the display portion 1310 to provide feedback in response to a user's input or touch. The haptic feedback device may be provided in a predetermined area of the electronic device 1000 other than the display unit 1310. For example, a haptic feedback device may be provided on the outer region of the acoustic output module 1310, the outer region of the front input portion 1360, and the bezel region. Of course, the haptic feedback device may be provided on the lower side of the display unit 1310.

Although not shown in the side of the electronic device 1000, a power supply unit and a side input unit may be further provided. For example, the power supply unit and the side input unit may be provided on two sides of the electronic device facing each other in the Y direction, or may be provided on one side of the power supply unit and the side input unit. The power supply can be used to turn the electronic device on and off, and can be used to enable or disable the screen. The side input unit may be used to adjust the size of the sound output from the sound output module 1320, for example. At this time, the power supply unit and the side input unit may be constituted by a touch key, a push key, or the like, or may be constituted by a pressure sensor. That is, the electronic device according to the present invention may be provided with pressure sensors in a plurality of areas other than the display part 1310. For example, it is possible to control the pressure of the sound output module 1320 and the camera module 1330a on the upper side of the electronic device, the pressure control of the lower side front input part 1360 and the pressure of the side power supply part and the side input part, At least one pressure sensor may be further provided.

On the other hand, the camera module 1330b can be additionally mounted on the rear surface of the electronic device 1000, that is, the cover case 1120. [ The camera module 1330b may have a photographing direction substantially opposite to that of the camera module 1330a and may be a camera having different pixels from the camera module 1330a. A flash (not shown) may be additionally disposed adjacent to the camera module 1330b. Further, although not shown, a fingerprint recognition sensor may be provided below the camera module 1330b. That is, the fingerprint recognition sensor may not be provided on the front input unit 1360 and the fingerprint recognition sensor may be provided on the rear surface of the electronic device 1000. [

The battery 1200 may be provided between the bracket 1400 and the cover case 1120. At this time, the battery 1200 may be provided inside the main board 1500. Meanwhile, the battery 1200 may be fixed or detachable.

3, a bracket 1400 is provided inside the side case 1110 inside the electronic apparatus 1000 and a display unit 1310 including a window, a display unit, and a touch sensor is mounted on the bracket 1400. [ May be provided. That is, the bracket 1400 supports a display portion 1310 including a window, a display portion, a touch sensor, and the like. In addition, the bracket 1400 may be extended to a region other than the display portion 1310. That is, the bracket 1400 may be extended to an area where the front input unit 1360 is formed. Also, at least a portion of the bracket 1400 may contact at least a portion of the side case 1110 and be supported on at least a portion of the side case 1110. Meanwhile, the bracket 1400 may be formed of at least a part of a conductive material, for example, magnesium or an alloy thereof. That is, the bracket 1400 may include a first region, at least a portion of which is made of a metallic material, and a second region, which is made of a non-conductive material, for example PC. For example, the second region may be formed in a plate shape having a predetermined thickness, and the first region may be provided in at least a partial region on the second region. The first area of the bracket 1400 may be connected to the main board 1500. At least a portion of the first area may be connected to the ground terminal of the main board 1500, for example.

The main board 1500 is provided inside the electronic device 1000 and may be provided with various circuits, devices, and functional modules for driving the electronic device 1000. For example, on the main board 1500, at least one driving means may be provided for supplying power to the display unit, the touch sensor, the pressure sensor, the haptic module, the fingerprint recognition sensor, and the like, , A control means for processing various signals, and the like. Further, on the main board 1500, a ground terminal for bypassing a high voltage such as ESD or the like applied from the outside may be further provided.

4 is a view of one area of an electronic device equipped with a composite protection device according to embodiments of the present invention. Fig. 5 is an enlarged view of one area of the electronic apparatus to which the composite protection element is mounted, and Fig. 6 is a schematic sectional view of the composite protection element. 7 and 8 are a perspective view and a cross-sectional view of a composite protection portion of a composite protection device according to an embodiment of the present invention.

4 to 8, at least one composite protection device 2000 according to the embodiments of the present invention may be provided inside the side case 1110 of the electronic device 1000. As shown in FIG. For example, the composite protection device 2000 may be provided on the inner surface of the side case 1110 facing a region where the battery 1200 is located. In addition, the composite protection element 2000 may be provided so as not to be in contact with the facing battery 1200. At this time, at least one composite protection device 2000 may be provided, and the embodiment of the present invention shows a case where four composite protection devices 2000 are provided at regular intervals.

The composite protection device 2000 according to the embodiments of the present invention can be fixed to the inside of the side case 1110 using the fixing part 1600. The fixing part 1600 is provided inside the side case 1110 A coupling member 1610 and a coupling member 1620 for fixing the composite protection device 2000 to the coupling member 1610. [ At this time, at least a part of the connecting member 1610 may be provided in the side case 1110 and at least a part of the connecting member 1610 may be provided in the bracket 1400. The connecting member 1610 may protrude inward from the inner surface of the side case 1110 to a predetermined width and may have a predetermined height. That is, the connecting member 1610 may protrude to a predetermined width and height from the inner side surface of the side case 1110 so as to support at least a part of the composite protection element 2000. Further, the connecting member 1610 may protrude from the bracket 1400 to a predetermined height. At this time, the connection member 1610 formed on the side case 1110 and the connection member formed on the bracket 1400 can be aligned. Of course, the connecting member 1610 may be formed only in the side case 1110, and in this case, the lower side of the connecting member 1610 may be connected to the bracket 1400. Further, at least a part of the connecting member 1610 may be formed of a conductive material. For example, the entire connecting member 1610 may be made of a conductive material, and at least a portion formed in contact with the side case 1110 may be made of a conductive material. Meanwhile, grooves or openings may be formed in the connecting member 1610 in the vertical direction. For example, the connection member 1610 formed in the side case 1110 may be provided with a through opening in the vertical direction, and a groove may be formed in the connection member 1610 on the bracket 1400 to align the opening and the groove. Of course, when the connecting member 1610 is formed only in the side case 1110, a groove having a predetermined depth may be formed in the connecting member 1610. The fastening member 1620 can be inserted into the opening or groove of the connecting member 1610. That is, the fastening member 1620 can be inserted through the opening of the connecting member 1610 formed in the side case 1110 to the groove of the connecting member 1610 formed on the bracket 1400. The coupling member 1620 is coupled to the coupling member 1610 so that the composite protection device 2000 is fixed. The coupling member 1620 may be formed of a screw or the like and the complex protection device 2000 may be positioned on the coupling member 1610 and may be coupled to the coupling member 1610 to form the complex protection device 2000 . Further, the fastening member 1620 may be provided with a screw thread on its outer surface, and the connecting member 1610 may have a screw groove corresponding thereto. That is, the fastening member 1620 serves as a male screw, and the connecting member 1610 can function as a female screw. Meanwhile, the fastening member 1620 may be made of a conductive material. For example, the fastening member 1620 may be made of a metal material. Therefore, the side case 1110, the connecting member 1610, and the fastening member 1620 may be paths of an overvoltage or communication signal such as ESD. The fixing part 1600 is electrically connected to the conductive part 2300 and the side case 1100 by welding, soldering, bonding, adhesive tape or the like in addition to the screw.

The composite protection device 2000 according to the embodiments of the present invention includes the contact portion 2100, the composite protection portion 2200, the conductive portion 2300, the support portion 2400, . ≪ / RTI > Here, the conductive portion 2300 is fixed at least partly to the fixing portion 1600, the composite protection portion 2200 is fixed on one region of the conductive portion 2300, And is connected to the protection unit 2200 and is provided so as to be able to contact with the main board 1500 through an internal circuit, that is, a bracket 1400. The support portion 2400 also supports the composite protection element 2000 when the conductive portion 2300 is fixed to the fixing portion 1600. [ That is, in the composite protection device 2000 of the present invention, one surface of the composite protection portion 2200 and the contact portion 2100 are coupled by, for example, a conductive adhesive agent and the other surface of the composite protection portion 2200 is electrically connected to the conductive portion 2300 And the support portion 2400 is provided on a predetermined region of the side case 1110 or the bracket 1400. The contact portion 2100 and the complex protection portion 2200 are connected to each other by a method such as SMD The mounted conductive part 2300 can be fixed to the fixing part 1600 by being supported by the supporting part 2400. [ The composite protection device 2000 will be described in more detail as follows.

One. Contact portion (2100)

The contact portion 2100 is made of a material having elasticity and containing a conductive material so as to mitigate the impact when an external force is applied from the outside of the electronic device. The contact portion 2100 may be in the form of a clip as shown in FIG. For example, the contact portion 2100 may include a support portion 2110 provided on one side of the composite protection portion 2000, a support portion 2110 disposed on the upper side of the support portion 2110 and facing the main board 1500, And a connection portion 2130 provided between the support portion 2110 and one side of the contact portion 2120 and having an elastic force to connect the support portion 2110 and the contact portion 2120. Therefore, the height of the contact portion 2100 may be higher than the height of the composite protection portion 2200.

The support portion 2110 may be provided on the upper surface of the composite protection portion 2200. Since the support portion 2110 is provided on the upper surface of the composite protection portion 2200, it can support the contact portion 2120, the connection portion 2130, the mounting portion 3000, and the like. The supporting portion 2110 may be provided in a plate shape having a predetermined thickness, for example, a rectangular plate shape having a predetermined thickness. The support portion 2110 may be provided to have the same width as the upper surface of the composite protection portion 2200. The support portion 2110 may be shorter than the length of the upper surface of the composite protective portion 2200. That is, the support portion 2110 may be formed to have a length shorter than the length of the composite protection portion 2200 so as not to contact the external electrodes 2241, 2242, and 2240 of the composite protection portion 2200. The supporting portion 2110 may have a length shorter than the length of the composite protecting portion 2200 so that the connecting portion 2130 does not contact the external electrode 2240 of the composite protecting portion 2200 when the connecting portion 2130 is contracted by the elastic force. As shown in FIG. A coupling member (not shown) may be provided between the supporting portion 2110 and the composite protecting portion 2200 to couple the supporting portion 2110 and the composite protecting portion 2200. As the joining member, for example, an adhesive tape, an adhesive, or the like may be used. That is, the support portion 2110 can be adhered to the upper surface of the composite protective portion 2200 by an adhesive member such as an adhesive tape or an adhesive.

One end of the contact portion 2120 is connected to the connection portion 2130 and extends in one direction from the connection portion 2130 so that a portion of the contact portion 2120 may be extended toward the bracket 1400, have. At this time, the bracket 1400 includes a first region 1400a that is at least partially conductive and a second region 1400b that is insulative, and a first region 1400a is provided on the second region 1400b, The second region 2120 may be in contact with the first region 1400a. In addition, the area adjacent to the other end of the contact portion 2120 may be a shape having a convex curvature in a direction in which the bracket 1400 is located. For example, the contact portion 2120 may be formed horizontally at a predetermined length and inclined downwardly to a predetermined length therefrom, and then upwardly inclined to a predetermined length. At this time, the area of the contact portion 2120 that is in contact with the bracket 1400 may have a circular shape such as an elliptical shape or a semicircular shape. That is, the peripheral region including the other end of the support portion 2110, which is located far from the connection portion 2130, may have a bent portion bent upward, among the regions of the support portion 2110, .

The connection portion 2130 is formed to connect one end of the support portion 2110 and one end of the contact portion 2120, and may be formed to have a curvature. When the connection portion 2130 is pressed by an external force, the bracket 1400 is pushed in the direction in which the bracket 1400 is positioned. When the external force is released, the connection portion 2130 has an elastic force to be restored to its original state. Accordingly, at least the connection portion 2130 may be formed of a metal material having an elastic force.

Meanwhile, the contact portion of the present invention may include a conductive rubber, a conductive silicone, an elastic body having a conductive wire inserted therein, and a gasket whose surface is coated or bonded with a conductor, in addition to a conductive and elastic clip. That is, the contact portion may include a layer of a conductive material. For example, in the case of a conductive gasket, the inside may be made of a nonconductive elastomer and the outside may be coated with a conductive material. The conductive gasket may include an insulative elastic core having a through hole formed therein, though not shown, and a conductive layer formed to surround the insulative elastic core. The insulative elastic core may be formed in a tube shape having a through hole formed therein, and may have a substantially rectangular or circular cross section, but may be formed in various shapes without being limited thereto. For example, the insulated elastic core may not have a through hole formed therein. Such an insulative elastic core may be formed of silicone, elastic rubber or the like. The conductive layer may be formed to surround the insulative elastic core. Such a conductive layer may be formed of at least one metal layer, for example, gold, silver, copper, or the like. On the other hand, the conductive powder may be mixed in the elastic core without forming the conductive layer.

2. Compound Protection

The composite protection unit 2200 can bypass a leakage current from the main boss 1500 by bypassing a high voltage such as ESD applied from the outside to an internal circuit, that is, a ground terminal of the main board 1500. The complex protection unit 2200 may maintain an insulation state at a voltage lower than a predetermined voltage and may have an electrical continuity at a voltage higher than a predetermined voltage. For example, the complex protection unit 2200 may include a varistor, a suppressor, a diode, etc., which is conductive at a predetermined voltage or higher. Here, the voltage for conducting the composite protection part 2200, that is, the breakdown voltage or the discharge start voltage, may be higher than the external rated voltage and lower than the insulation breakdown voltage of the composite protection part 2200. That is, when an overvoltage higher than the rated voltage and lower than the breakdown voltage is applied, the composite protection unit 2200 can conduct the overvoltage to be bypassed to the ground terminal of the main board 1500. In addition, the complex protection unit 2200 may further include a capacitor or the like to transmit a communication signal. An example of such a composite protection portion 2200 is shown in Figs. 7 and 8. Fig. 8 is a cross-sectional view of a complex protective portion 2200 of a suppressor type, and may include an ESD protection portion 2300 and at least one capacitor portion 2200, 2400.

7 and 8, the composite protection portion 2200 includes a laminate body 2210 in which a plurality of insulating sheets 100 to 101 to 111 are laminated, Voltage protection unit having at least one capacitor unit 2220a, 2220b and 2220 having electrodes 200 to 201 and at least one discharge electrode 310 and 311 and 312 and an overvoltage protection member 320, (2230). That is, a conductive layer including a plurality of the internal electrodes 200 and the discharge electrodes 310 may be formed on the insulating sheet 100 selected from the plurality of insulating sheets 100 in the stacked body 2210. For example, first and second capacitor portions 2220a and 2220b may be provided in the stacked body 2210, and an overvoltage protection portion 2230 may be provided therebetween. That is, the first capacitor portion 2220a, the overvoltage protection portion 2230, and the second capacitor portion 2220b are stacked in the stacked body 2210 to realize the composite protection portion 2200. 2220 and 2240 formed on two mutually opposing sides of the stacked body 2210 and connected to the first and second capacitor units 2220a and 2220b and the overvoltage protection unit 2230 can do. Of course, the composite protection portion 2200 may include at least one capacitor portion and at least one overvoltage protection portion. That is, the capacitor unit 2220 may be provided on either the lower side or the upper side of the overvoltage protection unit 2230, and at least one capacitor unit 2220 may be provided on the upper side and the lower side of the two or more overvoltage protection units 2230 spaced from each other. ) May be provided. The overvoltage protection unit 2230 may be provided inside the laminate 2210 or outside the laminate 2210, and the present embodiments will be described in the case where the overvoltage protection unit 2230 is formed inside the laminate 2210. Voltage protection member 320 is formed between the stacked body 2210 and the external electrode 2240 when the overvoltage protection unit 2230 is formed outside the stacked body 2210 and the discharge electrode 310 is formed between the stacked body 2210 As shown in Fig. A more detailed description of the detection preventing section 2200 will be given later.

The composite protection unit 2200 is provided between the conductive part 2300 and the bracket 1400 so as to cut off the electrostatic voltage applied from the main board 1500 through the bracket 1400. In addition, the overvoltage is bypassed to the ground terminal, and the insulation is not destroyed by an overvoltage such as ESD, so that the electrostatic voltage can be continuously blocked. That is, the composite protection unit 2200 according to the present invention maintains the insulation state at a voltage lower than the electric shock voltage, blocks the electric shock voltage applied from the main board 1500, maintains the electric state at the ESD voltage or higher, The ESD voltage applied to the ground terminal is bypassed.

3. Conductive part

One end of the conductive part 2300 is fixed to the fixing part 1600 and the composite protection part 2200 is fixed to the other end. The conductive part 2300 supports the composite protection part 2200 and the contact part 2100 and electrically connects the composite protection part 2200 to the side case 1110. Therefore, the conductive portion 2300 may have a plate shape having a predetermined thickness. For example, the conductive portion 2300 may have a rectangular plate shape having a predetermined thickness. In addition, an opening may be formed in one region of the conductive portion 2300, that is, an area fixed to the fixed portion 1600. That is, the fastening member 1620 of the fixing portion 1600 is inserted through the opening, so that the conductive portion 2300 can be fixed to the fixing portion 1600. The conductive portion 2300 may be made of a metal material, for example, SUS. The conductive part 2300 may be made of the same material as the side case 1110. Meanwhile, the conductive portion 2300 may be plated with Ag, Cr, Ni, Au, or the like. In addition, the conductive portion 2300 may be provided with a thickness of about 0.1 mm to 1 mm.

4. Support

The support portion 2400 may be provided between the fixing portion 1600, the contact portion 2100, and the composite protection portion 2200. The support portion 2400 allows the contact portion 2100 and the composite protection portion 2200 to be supported at the upper portion thereof when the contact portion 2100 and the composite protection portion 2200 are fixed using the fixing portion 1600. [ That is, the contact portion 2100 and the composite protection portion 2200 are fixed to another portion of the conductive portion 2300 and one portion of the conductive portion 2300 is fixed to the fixing portion 1600. At this time, 2400 support the contact portion 2100 and the composite protection portion 2200, it is possible to further facilitate the fastening of the conductive portion 2300. The support portion 2400 may be formed of a non-conductive material. For example, an adhesive or the like may be provided between at least one surface of the support portion 2400 having a rectangular parallelepiped shape and elasticity, for example, a surface contacting the side surface case 1110 and the side surface case 1100, (Not shown). The support portion 2400 is formed so that the upper surface thereof can be level with the conductive portion 2300. The upper surface of the support portion 2400 and the lower surface of the conductive portion 2300 are arranged horizontally so that the lower surface of the conductive portion 2300 contacts the upper surface of the support portion 2400 to make the conductive portion 2300 horizontal, . To this end, the upper surface of the support portion 2400 may be level with the upper surface of the connecting member 1610 of the fixing portion 1600. That is, the upper surface of the support portion 2400 may be flush with the upper surface of the connecting member 1610 without forming a step. On the other hand, the lower surface of the support portion 2400 can be brought into contact with the bracket 1400. The supporting portion 2400 includes a first region 1400a made of at least a conductive material and a second region 1400b made of an insulating material so that the first region 1400a is provided on the second region 1400b, May be provided on the first area 1400a of the first substrate 1400. However, the lower surface of the support portion 2400 may be spaced apart from the bracket 1400 by a predetermined distance. Therefore, the height of the support portion 2400 may be equal to or less than the sum of the height of the contact portion 2100 and the complex protection portion 2200.

As described above, the composite protection device 2000 according to an embodiment of the present invention includes the contact portion 2100, the composite protection portion 2200, and the conductive portion 2300, which are provided inside the electronic device 1000 . For example, the composite protection device 2000 may be fixed to the side case 1110 of the electronic device 1000 and connected to the bracket 1400. At this time, the composite protection element has the contact portion 2100 and the composite protection portion 2200 coupled to each other, and the coupling portion is fixed to one end of the conductive portion 2300. The other end of the conductive portion 2300 is connected to the fixing portion 1600 The side case 1110 can be fixed to the inside of the side case 1110. A conductive part 2300 provided with a contact part 2100 and a composite protection part 2200 on one side is provided on the fixing member 1610 in the side of the side case 1110, And the conductive part 2300 is fixed by combining the conductive part 2300 and the fixing member 1610 using the coupling member 1620. [ At this time, the support portion 2400 is provided inside the side case 1110, so that the complex protective device 2000 can be more easily fastened. Therefore, an overvoltage such as ESD or the like applied from the outside is transmitted through the side case 1110 and the fixing portion 1600, which is again connected to the ground terminal of the main board 1500 through the composite protection element 2000 and the bracket 1400. [ . The overvoltage transferred through the side case 1110 and the fixing portion 1600 is transferred to the composite protection portion 2200 through the conductive portion 2300 and discharged inside the composite protection portion 2200 to be in contact with the contact portion 2100 To the bracket 1400 and bypassed to the ground terminal of the main board 1500 connected to the bracket 1400. On the other hand, the electric shock voltage or current generated by the defective charger or the like can be transmitted to the side case 1110 through the main mode 1500, but is blocked by the complex protection unit 2200 maintaining the insulation state at the electric shock voltage or higher It can not be transmitted to the side case 1110, thereby preventing electric shock of the user.

Meanwhile, the composite protection device according to the embodiments of the present invention can be provided in an electronic device in various ways, and these embodiments are shown in Figs. 9 to 12. Fig. 9 to 12 are views for explaining a fastening method of the composite protective device according to the second to fifth embodiments of the present invention.

9, the support portion 2400 is provided to be in contact with the other end of the conductive portion 2300, and the contact portion 2100 and the composite protection portion 2200 are provided between the support portion 2400 and the fixing portion 1600. [ Can be provided. 5, the supporting portion 2400 is provided between the fixing portion 1600 and the composite protecting portion 2200, but the supporting portion 2400 is provided between the conductive portion 2300 And a composite protective portion 2200 may be provided between the support portion 2400 and the fixing portion 1600. [ At this time, the support portion 2400 may be formed of an insulating material. On the other hand, the clip-shaped contact portion 2100 may have a shape as shown in FIG.

10, a support portion 2400a may be provided between the fixing portions 1600. In addition, That is, a support portion 2400a may be provided between the connection member 1610 and the fastening member 1620. [ At this time, the support portion 2400a may be provided in contact with the connection member 1610, and the conductive portion 2300 may be provided on the support portion 2400a. To this end, a support portion 2400a is provided at one end of the conductive portion 2300, a support portion 2400a is provided on the connection member 1610, and then the connection member 1620 is fastened to the connection member 1610. [ The support member 2400a is provided on the connection member 1610 and the one end of the conductive member 2300 is positioned on the support member 2400a and is then coupled to the connection member 1610 using the fastening member 1620 . Therefore, it is possible to smoothly fasten the composite protection element 2000 without providing the support portion 2400 shown in FIG. 5 and FIG. 9 inside the side case 1110. Meanwhile, the support portion 2400a may be formed of a conductive material, for example, a conductive tape. The supporter 2400a may be formed of a conductive material so that an overvoltage applied from the outside may be bypassed to the ground terminal through the composite protection portion 2200. [ That is, the overvoltage applied from the outside is transmitted through the side case 1110 and the fixing part 1600. Since the connecting part 1610 and the fastening part 1620 are coupled with each other, The overvoltage can not be bypassed to the ground terminal. Therefore, the support portion 2400a provided between the connection member 1610 and the fastening member 1620 must be formed of a conductive material.

As shown in FIG. 11, the conductive part 2300a may be formed in a curved shape. That is, one end of the conductive portion 2300a is coupled to the lower side of the fixing portion 1600, and the conductive portion 2300 may be horizontally formed after being upwardly inclined in one region. At this time, the composite protective portion 2200 may be provided in a predetermined region of the portion formed horizontally in the direction of the cover case 1120.

12, the composite protective portion 2200 and the contact portion 2100a may be provided between the conductive portion 2300 and the bracket 1400 and the support portion 2400 may be provided therebetween. At this time, the contact portion 2100a may include a conductive rubber, a conductive silicone, an elastic body having a conductive wire inserted therein, and a gasket whose surface is coated with or bonded to a conductor. That is, the contact portion 2100a may be formed in a clip shape or a gasket shape. Here, the contact portion 2100a and the support portion 2400 can be horizontal. A conductive adhesive agent 2500 may be provided between one side of each of the horizontal contact portion 2100a and the support portion 2400 and the bracket 1400. [ To this end, a composite protection portion 2200 is mounted on one region of the conductive portion 2300, a contact portion 2100a in the form of a gasket is mounted on the composite protection portion 2200, The conductive adhesive agent 2500 may be provided on one surface of the contact portion 2100a and the support portion 2400 and the conductive adhesive agent 2500 may be attached on the bracket 1400 after the conductive adhesive agent 2400 is provided. On the other hand, when the conductive adhesive agent 2500 is used, the support portion 2400 may not be used. That is, since the conductive adhesive agent 2500 is formed on one surface of the contact portion 2100a and the conductive adhesive agent 2500 can be attached to the bracket 1400, the conductive portion 2300 can be fixed to the fixing portion 1600 without providing a separate support portion 2400. [ .

Hereinafter, a composite protection unit according to an embodiment of the present invention will be described in detail with reference to FIGS. 7 and 8. FIG. Although the following embodiment shows a complex protection unit of a suppressor time, a composite protection unit of a varistor type is also possible.

FIG. 7 is a perspective view of a composite protection device according to an embodiment of the present invention, and FIG. 8 is a sectional view.

7 and 8, a composite protection device according to an embodiment of the present invention includes a laminate body 2210 in which a plurality of sheets 100 to 101 to 111 are laminated, At least one capacitor portion 2220a, 2220b and 2220 having internal electrodes 200 to 201 and 208 and at least one discharge electrode 310 and 311 and 312 and an overvoltage protection member 320, And an overvoltage protection unit 2230 for protecting the overvoltage of the battery. For example, first and second capacitor portions 2220a and 2220b may be provided in the stacked body 2210, and an overvoltage protection portion 2230 may be provided therebetween. That is, the first capacitor unit 2220a, the overvoltage protection unit 2230, and the second capacitor unit 2220b are stacked in the stacked body 2210 to realize a complex protection device. And may further include external electrodes 2241 and 2242 (4000) formed on two mutually opposing sides of the layered body 2210 and connected to the capacitor unit 2220 and the overvoltage protection unit 2230. Of course, the composite protection device may include at least one capacitor portion 2220 and at least one overvoltage protection portion 2230. That is, the capacitor unit 2220 may be provided on either the lower side or the upper side of the overvoltage protection unit 2230, and at least one capacitor unit 2220 may be provided on the upper side and the lower side of the two or more overvoltage protection units 2230 spaced from each other. ) May be provided. Such a composite protection device is provided between a conductive member and an internal circuit that can be contacted by a user of the electronic device, for example, between the metal case and the PCB, shields the electric voltage, bypasses the ESD voltage, The voltage can be continuously blocked.

1. Laminate

The stacked body 2210 may be provided in a substantially hexahedral shape. That is, the stacked body 2210 has a predetermined length and width in one direction (for example, X direction) and another direction (for example, Y direction) orthogonal to each other in the horizontal direction, Direction) and a substantially hexahedron shape having a predetermined height. That is, when the forming direction of the external electrode 2240 is the X direction, the direction orthogonal to the horizontal direction may be the Y direction and the vertical direction may be the Z direction. Here, the length in the X direction is larger than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height. For example, the ratio of length, width, and height may be 2: 5: 1: 0.3-1. That is, the length may be about two to five times greater than the width based on the width, and the height may be about 0.3 to about 1 times the width. However, the size in the X, Y, and Z directions can be variously changed according to, for example, the internal structure of the electronic device to which the complex protection device is connected, the shape of the complex protection device, and the like.

The stacked body 2210 may be formed by stacking a plurality of sheets 101 to 111 (100). That is, the stacked body 2210 can be formed by stacking a plurality of sheets 100 having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Therefore, the length and width of the laminate 2210 are determined by the length and width of the sheet 100, and the height of the laminate 2210 can be determined by the number of laminations of the sheet 100. [ On the other hand, the plurality of sheets 100 constituting the layered body 2210 can be formed using a dielectric material such as MLCC, LTCC, or HTCC. At least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO is added to the MLCC dielectric material as a main component of at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO ₂ , And glass materials. In addition, the sheet 100 may include one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, ZnO and Al ₂ O ₃ in addition to MLCC, Or more. The sheet 100 may be formed of a material having varistor characteristics such as Pr-based, Bi-based, and ST-based ceramic materials in addition to the above materials. Of course, the sheet 100 may be formed by mixing materials having MLCC, LTCC, HTCC, and varistor characteristics. For example, the sheet 100 may comprise BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , The permittivity can be controlled. Therefore, the sheet 100 may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 4,000, and more preferably 100 to 3000 depending on the material. For example, seat 100 may include a _{BaTiO 3, NdTiO 3, Bi 2} O 3, ZnO, TiO 2, SiO 2, Al 2 O 3, B 2 O 3, by increasing the content of BaTiO ₃ The dielectric constant can be increased and the dielectric constant can be lowered by increasing the content of NdTiO ₃ and SiO ₂ . On the other hand, at least one of the sheets 110 may have a different dielectric constant from the other. For example, the outermost sheet, that is, the first and eleventh sheets 101 and 111 positioned at the lowest and uppermost layers in the vertical direction are the remaining sheets provided therebetween, that is, the second to tenth sheets 102 to 110, Lt; RTI ID = 0.0 > permittivity < / RTI > That is, the permittivities of the first and eleventh sheets 101 and 111 may be lower than the permittivities of the second to tenth sheets 102 to 110. For example, the permittivities of the first and eleventh sheets 101 and 111 may be 100 or less, and the permittivities of the second to tenth sheets 102 to 110 may be 500 or more. For example, the permittivities of the first and eleventh sheets 101 and 111 may be 5 to 100, and the permittivities of the second to tenth sheets 102 to 111 may be 500 to 3,000. In order to make the dielectric constant of the sheet 100 different, the content of the composition for forming the sheet can be controlled. For example, the first to eleventh sheets 101 to 111 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and B ₂ O ₃ , The first and eleventh sheets 101 and 111 can increase the content of NdTiO ₃ and SiO ₂ and reduce the content of BaTiO ₃ to form a dielectric constant of 100 or less and the second to tenth sheets 102 to 110, Can increase the content of BaTiO ₃ and reduce the content of NdTiO ₃ and SiO ₂ to form a dielectric constant of 500 or more. In other words, the first and eleventh sheets 101 and 111 increase the content of NdTiO ₃ and SiO ₂ and decrease the content of BaTiO ₃ compared to the second to tenth sheets 102 to 110 so that the dielectric constant becomes 100 or less can do. On the other hand, the second to tenth sheets 102 to 110 increase the content of BaTiO _{3 and} the content of NdTiO ₃ and SiO ₂ compared to the first and eleventh sheets 101 and 111, . The parasitic capacitance can be reduced by lowering the dielectric constant of the outermost sheet. On the other hand, of the second to tenth sheets 102 to 110, the sheets adjacent to the first and eleventh sheets 101 and 111, for example, the second and tenth sheets 102 and 110, 103 to 109). Further, the dielectric constant of the sheets can be increased from the first and eleventh sheets 101 and 111 toward the center. This is because the composition of the first and eleventh sheets 101 and 111 diffuses to the center of the laminate 2210 during the sintering of the laminate 2210.

In addition, the plurality of sheets 100 may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others. For example, the sheet of the overvoltage protection section 2230 may be formed to have a thickness different from that of the sheet of the capacitor section 2220, and the sheet formed between the overvoltage protection section 2230 and the capacitor section 2220 may be formed of other sheets But may be formed to have a different thickness. For example, the thickness of the sheet between the overvoltage protection portion 2230 and the capacitor portion 2220, that is, the fifth and seventh sheets 105 and 107, is equal to the thickness of the sheet of the overvoltage protection portion 2230, Or may be formed to have a thickness that is thinner than or equal to the thickness of the sheets 102 to 104, 108 to 110 between the internal electrodes of the capacitor portion 2220. [ That is, the gap between the overvoltage protection unit 2230 and the capacitor unit 2220 may be formed to be thinner or equal to the interval between the internal electrodes of the capacitor unit 2220, or to be thinner or equal to the thickness of the overvoltage protection unit 2230 . Of course, the sheets 102 to 104 and 108 to 110 of the capacitor units 2000 and 4000 may be formed to have the same thickness, and one of them may be thinner or thicker than the other. On the other hand, the plurality of sheets 100 may be formed to have a thickness of, for example, 1 m to 4000 m and 3000 m or less. That is, the thickness of each of the sheets 100 may be 1 탆 to 4000 탆, preferably 5 탆 to 300 탆, depending on the thickness of the layered product 2210. In addition, the thickness of the sheet 100 and the number of stacked layers can be adjusted according to the size of the composite protective element. That is, when the present invention is applied to a composite protective device having a small size, the sheet 100 may be formed to have a small thickness and may be formed to have a large thickness when applied to a complex protective device having a large size. In addition, when the sheets 100 are laminated in the same number, the thickness of the composite protective device may be smaller as the size of the composite protective device is smaller and the thickness is thinner as the height is lower. Of course, a thin sheet can also be applied to a composite protective device of a large size, in which case the number of sheets stacked increases. At this time, the sheet 100 may be formed to have a thickness not to be broken when ESD is applied. That is, even when the number of sheets or thickness of the sheets 100 is different, at least one sheet may be formed to a thickness that is not destroyed by repetitive application of ESD.

The stacked body 2210 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided on the lower portion and the upper portion of the capacitor portion 2220, respectively. That is, the stacked body 2210 may include a lower and an upper cover layer provided on the lowermost layer and the uppermost layer, respectively. Of course, the lowermost sheet, that is, the first sheet 101 functions as a lower cover layer, and the uppermost sheet, that is, the eleventh sheet 111, may function as an upper cover layer. The lower and upper cover layers provided separately from the sheet 100 may be formed to have the same thickness. However, the lower and upper cover layers may also be formed with different thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, the lower and upper cover layers may be formed by stacking a plurality of magnetic sheet sheets. Further, a non-magnetic sheet, for example, a vitreous sheet, may be further formed on the outer surface of the lower and upper cover layers of the magnetic material sheet, that is, the lower surface and the upper surface of the layered body 2210. However, the lower and upper cover layers may be formed of a glassy sheet, and the surface of the layered body 2210 may be coated with a polymer or a glass material. On the other hand, the lower and upper cover layers may be thicker than the thickness of each of the sheets 100. That is, the cover layer may be thicker than the thickness of one sheet. Thus, the bottom and top sheets, that is, the first and eleventh sheets 101 and 111, may function as the lower and upper cover layers, respectively, and may be thicker than the sheets 102 to 110, respectively.

2. Capacitor section

At least one capacitor portion 2220a, 2220b (2000) is formed in the stacked body 2210. For example, the first and second capacitor units 2220a and 2220b may be provided on the lower and upper portions of the overvoltage protection unit 2230, respectively. However, the first and second capacitor portions 2220a and 2220b are conveniently referred to as being formed by dividing the plurality of internal electrodes 200 across the overvoltage protection portion 2230. In the stacked body 2210, A plurality of internal electrodes 200 may be formed.

The capacitor portion 2220 may be provided on the lower side and the upper side of the overvoltage protection portion 2230 and may include at least two or more internal electrodes and at least two sheets provided therebetween. For example, the first capacitor portion 2220a includes first to fourth sheets 101 to 104 and first to fourth internal electrodes 201 to 204 formed on the first to fourth sheets 101 to 104, respectively. . ≪ / RTI > The second capacitor portion 2220b includes fifth to eighth internal electrodes 205 to 208 formed on the seventh to tenth sheets 107 to 110 and seventh to tenth sheets 107 to 110, . ≪ / RTI > Here, each of the internal electrodes 201 to 208 and 200 may be formed to have a thickness of 1 占 퐉 to 10 占 퐉, for example. The plurality of internal electrodes 200 are connected to external electrodes 2241, 2242, and 4000 formed to face each other in the X direction, and are formed such that one side is connected and the other side is spaced apart. For example, the first, third, fifth, and seventh internal electrodes 201, 203, 205, 207 are formed on the first, third, seventh, and ninth sheets 101, 103, 107, The first external electrode 2241 and the second external electrode 2241 are formed to have a predetermined area and one side is connected to the second external electrode 2242 and the other side is separated from the first external electrode 2241. The second, fourth, sixth and eighth internal electrodes 202, 204, 206 and 208 are respectively formed on the second, fourth, eighth and tenth seats 102, 104, 108, The first external electrode 2241 and the second external electrode 2242 are connected to each other. That is, the plurality of internal electrodes 200 are alternately connected to any one of the external electrodes 2240, and are formed so as to overlap a predetermined region with the sheets 102 to 104, 108 to 110 therebetween. The length of the internal electrode 200 in the X direction and the width in the Y direction may be smaller than the length and width of the layered body 2210. In other words. The internal electrode 200 may be formed to be smaller than the length and width of the sheet 100. For example, the internal electrode 200 may be formed to have a length of 10% to 90% of the length of the laminate 2210 or the sheet 100 and a width of 10% to 90%. In addition, the internal electrodes 200 may be formed in an area of 10% to 90% of the area of each of the sheets 100, respectively. Meanwhile, the plurality of internal electrodes 200 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and an interval, for example. Capacitors may be formed between the internal electrodes 200 and the capacitance of the capacitors 2220 may be adjusted according to the overlapping area of the internal electrodes 200 and the thickness of the sheets 100. The capacitor unit 2220 may include at least one internal electrode formed in addition to the first through eighth internal electrodes 201-208 and at least one sheet having at least one internal electrode. In addition, the first and second capacitor units 2220a and 2220b may have two internal electrodes, respectively. That is, in the present embodiment, four inner electrodes of the first and second capacitors 2220a and 2220b are formed, respectively, but two or more inner electrodes may be formed.

The internal electrode 200 may be formed of a conductive material, for example, a metal or a metal alloy containing at least one of Al, Ag, Au, Pt, Pd, Ni and Cu. In the case of alloys, for example, Ag and Pd alloys can be used. On the other hand, Al can form aluminum oxide (Al ₂ O ₃ ) on its surface during firing and can keep Al inside. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used. Meanwhile, the internal electrode 200 may be formed such that at least one region is thin or at least one region is removed to expose the sheet. However, since at least one region of the internal electrode 200 has a small thickness or at least one region is removed, the internal electrode 200 maintains the entirely connected state, so that no problem occurs in the electric conductivity.

The internal electrodes 201-204 of the first capacitor portion 2220a and the internal electrodes 205-208 of the second capacitor portion 2220b may be formed in the same shape and the same area, Can be the same. The first internal electrode 201 and the eighth internal electrode 208 may overlap with the external electrode 2240 and the first and eighth internal electrodes 201 and 208 may overlap with the remaining internal electrodes 202 and 202. [ 207). That is, since the end portions of the first and eighth internal electrodes 201 and 208 are partially overlapped with the first and second external electrodes 2241 and 2242, respectively, and parasitic capacitance is formed therebetween, The electrodes 201 and 208 may be formed to be longer by about 10% than the remaining internal electrodes 202 to 207, for example. In addition, the first and eighth internal electrodes 201 and 208 may be formed to have a larger area overlapping with the external electrode 2240 than the remaining area. For example, the first and eighth internal electrodes 201 and 208 may be formed to be about 10% wider than the area where the external electrode 2240 overlaps or the area in which the adjacent area is not overlapped. At this time, the area of the first and eighth internal electrodes 201 and 208 not overlapped with the external electrode 2240 may be the same as the width of the remaining internal electrodes 202 to 209. On the other hand, the sheets 101 to 104 of the first capacitor unit 2220a and the sheets 107 to 110 of the second capacitor unit 2220b may have the same thickness. At this time, when the first sheet 101 functions as a lower cover layer, the first sheet 101 may be thicker than the remaining sheets. Therefore, the capacitances of the first and second capacitor units 2220a and 2220b may be the same. However, the capacitances of the first and second capacitor units 2220a and 2220b may be different. In this case, at least one of the area of the internal electrode, the overlapping area of the internal electrode, and the thickness of the sheet may be different from each other. The internal electrodes 201 to 208 of the capacitor unit 2220 may be formed longer than the discharge electrode 310 of the overvoltage protection unit 2230,

3. Overvoltage Protection

The overvoltage protection unit 2230 may include at least two discharge electrodes 311 and 312 formed in the vertical direction and at least one overvoltage protection member 320 disposed between the discharge electrodes 310. [ For example, the overvoltage protection unit 2230 may include first and second discharge electrodes 311 and 312 formed on the fifth and sixth sheets 105 and 106 and the fifth and sixth sheets 105 and 106, respectively. And an overvoltage protection member 320 formed through the sixth sheet 106. [ Here, the overvoltage protection member 320 may be formed so that at least a part thereof is connected to the first and second discharge electrodes 311 and 312. The first and second discharge electrodes 311 and 312 may have the same thickness as the internal electrodes 200 of the capacitor unit 2220. For example, the first and second discharge electrodes 311 and 312 can be formed to a thickness of 1 m to 10 m. However, the first and second discharge electrodes 311 and 312 may be thinner or thicker than the internal electrode 200 of the capacitor unit 2220. The first discharge electrode 311 is connected to the first external electrode 2241 and is formed on the fifth sheet 105 and has a distal end connected to the overvoltage protection member 320. The second discharge electrode 312 is connected to the second outer electrode 2242 and is formed on the sixth sheet 106 and has a distal end connected to the overvoltage protection member 320.

Here, the discharge electrodes 311 and 312 are formed to be connected to the same external electrode 2240 as the adjacent internal electrode 200. That is, the first discharge electrode 311 is connected to the adjacent fourth internal electrode 204 and the first external electrode 2241, and the second discharge electrode 312 is connected to the adjacent fifth internal electrode 205 and the second external Electrode 2242 as shown in Fig. Even when the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 2240, the ESD voltage is not applied to the inside of the electronic device even when the insulating sheet 100 is deteriorated. That is, when the discharge electrode 310 and the adjacent internal electrode 200 are connected to different external electrodes 2240, the ESD voltage applied through the external electrode 2240 is discharged to the discharge electrode 310 to the other external electrode 2240 through the adjacent internal electrode 200. For example, when the first discharge electrode 311 is connected to the first external electrode 2241 and the fourth internal electrode 204 adjacent thereto is connected to the second external electrode 2242, A conductive path is formed between the first discharge electrode 311 and the fourth internal electrode 204 and an ESD voltage applied through the first external electrode 2241 is applied to the first discharge electrode 311, And flows to the insulating sheet 105 and the second internal electrode 202, thereby being applied to the internal circuit through the second external electrode 2242. [ In order to solve such a problem, the thickness of the insulating sheet 100 can be increased, but in this case, there arises a problem that the size of the electric shock prevention device increases. However, even when the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 2240, the ESD voltage is not applied to the inside of the electronic device even if the insulating sheet 100 is broken. In addition, it is possible to prevent the ESD voltage from being applied without forming the insulating sheet 100 thick.

The areas of the first and second discharge electrodes 311 and 312 that are in contact with the overvoltage protection member 320 may be the same size or smaller than the overvoltage protection member 320. Also, the first and second discharge electrodes 311 and 312 may be formed so as to be completely overlapped with each other without leaving the overvoltage protection member 320. That is, the edges of the first and second discharge electrodes 311 and 312 may be perpendicular to the edge of the overvoltage protection member 320. [ Of course, the first and second discharge electrodes 311 and 312 may be formed to overlap the overvoltage protection member 320. For example, the first and second discharge electrodes 311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection member 320. That is, the first and second discharge electrodes 311 and 312 are not formed to deviate from the overvoltage protection member 320. Meanwhile, the first and second discharge electrodes 311 and 312 may be formed to have a larger area than a region that is not in contact with the overvoltage protection member 320.

The overvoltage protection member 320 may be formed at a predetermined region of the sixth sheet 106, for example, at a central portion thereof and connected to the first and second discharge electrodes 311 and 312. At this time, the overvoltage protection member 320 may be formed to overlap at least a part with the first and second discharge electrodes 311 and 312. That is, the overvoltage protection member 320 may be formed to overlap with the first and second discharge electrodes 311 and 312 by 10% to 100% of the horizontal area. The overvoltage protection member 320 may be formed to form a through hole having a predetermined size in a predetermined region of the sixth sheet 106, for example, a central portion thereof, and to fill the through hole using a thick film printing process. The protective layer 330 may be formed to have a diameter of, for example, 100 mu m to 500 mu m and a thickness of 10 mu m to 50 mu m. At this time, the discharge start voltage decreases as the thickness of the overvoltage protection member 320 becomes thinner. The overvoltage protection member 320 may be formed using a conductive material and an insulating material. For example, a mixed material of a conductive ceramic and an insulating ceramic may be printed on the sixth sheet 106 to form the overvoltage protection member 320. On the other hand, the overvoltage protection member 320 may be formed on at least one sheet 100. That is, overvoltage protection members 320 are formed on at least one vertically stacked sheet, for example, two sheets 100, and discharge electrodes are formed on the sheets 100 so as to be spaced apart from each other, 320, respectively. A more detailed description of the structure, materials, and the like of the overvoltage protection member 320 will be described later.

4. External electrode

The external electrodes 2241, 2242, and 4000 may be provided on two mutually opposed surfaces outside the stacked body 2210. For example, the external electrodes 2240 may be formed on opposite sides of the stacked body 2210 in the X direction, that is, the longitudinal direction. The external electrode 2240 may be connected to the internal electrode 200 and the discharge electrode 310 in the stacked body 2210. At this time, one of the external electrodes 2240 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first outer electrode 2241 may be connected to an internal circuit, and the second outer electrode 2242 may be connected to the metal case. Further, the second external electrode 2242 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

The external electrode 2240 may be formed in various ways. That is, the external electrode 2240 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as vapor deposition, sputtering, and plating. On the other hand, the external electrodes 2240 may be formed extending in the Y direction and the Z direction. That is, the external electrode 2240 may extend from two surfaces opposed to each other in the X direction and extend to four surfaces adjacent to each other. For example, when the conductive paste is immersed in the conductive paste, the external electrodes 2240 may be formed on the front and rear surfaces in the Y direction as well as on the upper and lower surfaces in the X direction as well as in the Y direction. On the other hand, in the case of forming by printing, vapor deposition, sputtering, plating, or the like, the external electrodes 2240 may be formed on two surfaces in the X direction. That is, the external electrode 2240 may be formed on one side of the printed circuit board and on the other side connected to the metallic case, but also on other areas depending on the forming method or process conditions. The external electrode 2240 may be formed of a metal having electrical conductivity, and may be formed of at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. At least a part of the external electrode 2240 connected to the internal electrode 200 and the discharge electrode 310 or the internal electrode 200 and the discharge electrode 310 formed on at least one surface of the layered body 2210, A part of the external electrode 2240 to be connected may be formed of the same material as the internal electrode 200 and the discharge electrode 310. For example, when the internal electrode 200 and the discharge electrode 310 are formed using copper, at least a part of the external electrode 2240 may be formed of copper in contact with the external electrode 2240. At this time, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by vapor deposition, sputtering, plating or the like. Preferably, the external electrode 2240 may be formed by plating. A seed layer may be formed on the upper and lower surfaces of the layered body 2210 to form the external electrode 2240 by a plating process, and then a plating layer may be formed from the seed layer to form the external electrode 2240. At least a part of the external electrode 2240 connected to the internal electrode 200 and the discharge electrode 310 may be the entire side surface of the layered body 2210 in which the external electrode 2240 is formed, .

In addition, the external electrode 2240 may further include at least one plating layer. The external electrode 2240 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 2240 may be formed by laminating a copper layer, a Ni plating layer and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, or a Cu plating layer, a Ni plating layer and a Sn plating layer may be laminated. The external electrode 2240 can be formed by mixing a multi-component glass frit containing, for example, 0.5% to 20% Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. At this time, a mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to the two sides of the laminate 2210. By including the glass frit in the external electrode 2240, the adhesion between the external electrode 2240 and the layered body 2210 can be improved, and the contact response of the electrodes inside the layered body 2210 can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the external electrodes 2240. That is, the outer electrode 2240 may be formed by forming a metal layer containing glass and at least one plating layer on the metal layer. For example, the external electrode 2240 may be formed by successively forming a Ni plated layer and a Sn plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu. At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. Of course, the external electrode 2240 may be formed of at least one plating layer only. That is, at least one plating layer may be formed using at least one plating process without applying the paste to form the external electrodes 2240. On the other hand, the external electrode 5000 may be formed to a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 탆 to 10 탆 .

The external electrodes 2240 may be formed to overlap with the internal electrodes 200 connected to the external electrodes 2240. For example, a portion of the first external electrode 2241 extending downward and upward from the stacked body 2210 may be formed to overlap with a predetermined region of the internal electrodes 200. A portion of the second external electrode 2242 extending to the lower and upper portions of the stacked body 2210 may be formed to overlap with a predetermined region of the internal electrodes 200. For example, the upper and lower portions of the laminate 2210 of the outer electrode 2240 may overlap with the first and eighth inner electrodes 201 and 208. That is, at least one of the external electrodes 2240 may extend to the upper surface and the lower surface of the layered body 2210, and at least one of the extended portions may be partially overlapped with the internal electrode 200. At this time, the area of the internal electrode 200 overlapping the external electrode 2240 may be 1% to 10% of the total area of the internal electrode 200. In addition, the external electrode 2240 can increase the area formed on at least one of the upper surface and the lower surface of the layered body 2210 by a plurality of processes.

A predetermined parasitic capacitance can be generated between the external electrode 2240 and the internal electrode 200 by overlapping the external electrode 2240 and the internal electrode 200. For example, a capacitance may be formed between the first and eighth internal electrodes 201 and 208 and the extension of the first and second external electrodes 2241 and 2242. Therefore, the capacitance of the composite protection device can be adjusted by adjusting the overlapping area of the external electrode 2240 and the internal electrode 200. However, since the capacitance of the complex protection element affects the antenna performance in the electronic device, the dispersion of the capacitance of the complex protection element is kept within 20%, preferably within 5%. For this purpose, the sheet 100 manufactured using a material having a high dielectric constant is used. However, as the dielectric constant of the sheet 100 increases, the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 2240 increases. That is, when the dielectric constant of the first and eleventh sheets 101 and 111 provided between the internal electrode 200 and the external electrode 2240 is high, the parasitic capacitance increases. However, since the permittivity of the first and eleventh sheets 101 and 111 located at the outermost periphery is lower than that of the remaining sheets 102 to 110, the parasitic capacitance between the internal electrode 200 and the external electrode 2240 The effect can be reduced. That is, since the dielectric constant of the first and eleventh sheets 101 and 111 is low, the parasitic capacitance between the internal electrode 200 and the external electrode 2240 can be reduced.

5. Surface modification member

On the other hand, the surface modification member (not shown), that is, the insulating member can be formed by distributing the oxide on the surface of the layered product 2210 before the external electrode 2240 is formed. At this time, the oxides may be dispersed and distributed on the surface of the layered product 2210 in a particle state or a molten state. In addition, the oxide may be distributed before the part of the external electrodes 2240 is formed by the printing process, or may be distributed before the plating process is performed. That is, the oxide may be distributed on the surface of the layered product 2210 before the plating process when the external electrode 2240 is formed by the plating process. By distributing the oxide before the plating process, the resistance of the surface of the layered product 2210 can be made uniform, and the plating process can be performed uniformly. That is, the surface of the layered product 2210 may have a resistance different from that of the other region in at least one region. If the plating process is performed in a state where the resistance is uneven, So that uneven growth of the plating layer occurs. Therefore, in order to solve such a problem, it is necessary to maintain the surface resistance of the layered product 2210 uniformly. To this end, it is necessary to disperse oxides in a particle state or a molten state on the surface of the layered product 2210, have. At this time, the oxide may be partially distributed on the surface of the layered product 2210, and may be formed in a film form distributed over the surface of the layered product 2210 as a whole, . ≪ / RTI > For example, the oxide may be distributed in the form of an island on the surface of the laminate to form a resistance adjusting member. That is, oxides in a particle state or a molten state may be distributed on the surface of the layered product 2210 so as to be spaced apart from each other, so that at least a part of the surface of the layered product 2210 can be exposed. Further, the oxide is distributed over the entire surface of the layered product 2210, and oxide in a particle state or a molten state can be connected to each other to form an oxide film of a predetermined thickness. At this time, since the oxide film is formed on the surface of the layered product 2210, the surface of the layered product 2210 may not be exposed. The oxide may be formed in a film form in at least one region and may be distributed in island form in at least a part. That is, at least two oxides may be connected to form a film in at least one region, and may be formed in an island form at least in part. Thus, at least a part of the surface of the laminate can be exposed by the oxide. The total area of the resistance regulating member 400 made of oxide distributed at least in an island shape may be, for example, 10% to 90% of the total surface area of the layered body 2210. Here, at least one oxide may be used for the oxide in the particle state or the molten state for making the surface resistance of the layered product 2210 uniform. For example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO , At least one of Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ .

On the other hand, the surface modification member may be distributed over the entire area of the layered product 2210, or may be distributed only in at least one area. That is, the surface modification member may be formed on the entire surface of the layered body 2210, or may be formed only in a region in contact with the external electrode 2240 of the layered body 2210. In other words, a surface modification member, in which a surface modification member is formed on a part of the surface of the layered product 2210, may be formed between the layered product 2210 and the external electrode 2240. At this time, the surface modification member may be formed in contact with the extended region of the external electrode 2240. That is, a surface modification member may be provided between one side of the external electrode 2240 extending from the upper surface and the lower surface of the layered body 2210 and the layered body 2210. In addition, the surface modification member may be formed to have the same or different size as the external electrode 2240 formed thereon. For example, an area of 50% to 150% of the area of a portion of the external electrode 2240 extending from the upper surface and the lower surface of the layered body 2210 may be formed. That is, the surface modification member may be formed to have a size smaller or larger than the size of the extended region of the external electrode 2240, or may be formed to have the same size. Of course, the surface modification member may also be formed between the external electrode 2240 formed on the side surface of the laminate body 2210. Such a surface modification member may comprise a glass material. For example, the surface-modified member may comprise a predetermined temperature, for example below 950 ℃ firing available free (無), borosilicate glass (non-borosilicate glass) (SiO 2 -CaO-ZnO-MgO based glass) in. Further, the surface modifying member may further include a magnetic substance material. That is, if the area in which the surface modifying member is to be formed is a magnetic substance sheet, the magnetic substance may be partially contained in the surface modifying member to facilitate coupling of the surface modifying member and the magnetic substance sheet. At this time, the magnetic substance material includes, for example, a NiZnCu-based magnetic powder, and the magnetic substance may be contained in an amount of, for example, 1 to 15 wt% with respect to 100 wt% of the glass material. On the other hand, at least a part of the surface modification member may be formed on the surface of the layered body 2210. At this time, at least a portion of the glass material may be uniformly distributed on the surface of the layered product 2210, and at least a part may be irregularly distributed in different sizes. Of course, the surface modification member may be formed continuously on the surface of the laminate 2210 to have a film shape. Also, at least a part of the surface of the layered product 2210 may be provided with a recess. That is, at least a part of the region where the convex portion is formed and the glass material is not formed may be formed by the glass material, and the concave portion may be formed. At this time, the glass material may be formed at a predetermined depth from the surface of the layered product 2210, and at least a portion thereof may be formed higher than the surface of the layered product 2210. That is, at least a part of the surface modifying member may be flush with the surface of the layered body 2210, and at least a part thereof may be maintained higher than the surface of the layered body 2210. By forming the surface modification member by distributing the glass material in a part of the area of the layered body 2210 before the external electrode 2240 is formed, the surface of the layered body 2210 can be modified, . Therefore, it is possible to control the shape of the external electrode 2240, thereby facilitating the formation of the external electrode.

Meanwhile, the composite protection part 2000 according to the present invention can be modified into various shapes, and the composite protection part 2000 according to another embodiment of the present invention is shown in FIGS. 13 to 16. FIG.

FIG. 13 is a perspective view of a composite protective portion according to another embodiment of the present invention, and FIG. 14 is a sectional view. 15 is a cross-sectional view of a composite protective portion according to a modification of another embodiment of the present invention. FIG. 16 is a cross-sectional view illustrating the shapes of the composite protection unit and the contact unit according to another embodiment of the present invention.

13 to 16, a composite protection device according to another embodiment of the present invention includes a laminate 100, at least two internal electrodes 200 provided in the laminate 1000, At least two overvoltage overvoltage protection parts 300 provided between the electrodes 200 and at least two connection electrodes 400 provided inside the layered body 100 so as to be connected to at least two internal electrodes 200, And an external electrode 500 formed outside the layered body 100 to be connected to the electrode 400. That is, in another embodiment of the present invention, the overvoltage protection member is provided between the two internal electrodes 200 without a separate discharge electrode. That is, the internal electrode 200 provided with the overvoltage protection member interposed therebetween functions as a discharging electrode from the outside and functions as a capacitor for forming a capacitance. Here, the stacked body 100 and the overvoltage overvoltage protection unit 300 are the same as the stacked body 2110 and the overvoltage protection unit 2130 described in the embodiment of the present invention, and the internal electrode 200 is a capacitor The outer electrode 500 is the same as the inner electrode 200 of the outer electrode 2200 and has the same configuration as the outer electrode 2250. Other embodiments of the present invention will now be described with reference to portions that are different from the description of one embodiment.

Inner electrode

At least two internal electrodes 210, 220, and 200 may be provided within the stack 100 at predetermined intervals. That is, at least two internal electrodes 200 may be spaced apart from each other by a predetermined distance in the lamination direction of the sheets, that is, the Z direction. Also, at least two internal electrodes 200 may be formed with the overvoltage protection unit 300 interposed therebetween. For example, the first internal electrode 210 may be formed on the lower side of the overvoltage protection unit 300 in the Z direction, and the second internal electrode 220 may be formed on the upper side of the overvoltage protection unit 300. Of course, at least one internal electrode may be further formed between the first and second internal electrodes 210 and the lowermost and uppermost sheets. The internal electrode 200 is connected to the connection electrode 400 and is connected to the overvoltage protection unit 300. That is, one end of the first internal electrode 210 is connected to the first connection electrode 410, and the other end of the first internal electrode 210 is connected to the overvoltage protection unit 300. The second internal electrode 220 is connected to the second connection electrode 420 at one side and connected to the overvoltage protection unit 300 at the other side. At this time, one surface of the first and second internal electrodes 210 and 220 facing each other is connected to the overvoltage protection unit 300.

The internal electrode 200 acts as a capacitor and also serves as a discharge electrode of the overvoltage protection unit 300. The capacitor is formed by the first and second internal electrodes 200 and the sheet therebetween. The capacitance can be adjusted according to the overlapping area of the first and second internal electrodes 200, the thickness of the sheet between the first and second internal electrodes 200, and the like. The first and second internal electrodes 200 function as discharge electrodes at least in a region overlapping the overvoltage protection unit 300. The overvoltage of the ESD or the like applied from the outside is transmitted to the overvoltage protection unit 300, For example, an overvoltage bypassed to the ground terminal of the electronic device.

Connecting electrode

The connecting electrode 400 is formed inside the layered body 100 and is formed between the internal electrode 300 and the external electrode 500. That is, the connection electrode 400 is formed to connect the internal electrode 300 and the external electrode 500. Accordingly, the connection electrode 400 is connected to the first and second external electrodes 510, 520, 500 and the first and second internal electrodes 210, 220, Electrodes 410 and 420, respectively. At least one of the planar shape and the cross-sectional shape of the connection electrode 400 may have a predetermined thickness and may have a substantially circular, oval, rectangular, square, pentagonal or more polygonal shape. That is, the overvoltage protection unit 300 may be formed in the shape of a cylinder, a hexahedron, a polyhedron, or the like. In addition, the connection electrode 400 may be formed to overlap at least the overvoltage protection unit 300. Preferably, the connection electrode 400 may be formed at the center of the laminate 100 and may overlap the overvoltage protector 300.

The connection electrode 400 is formed so that an opening is formed in a predetermined region of at least one sheet stacked on the internal electrode 200 and an opening is filled with a conductive material. For example, the connection electrode 400 may be formed of a metal or a metal alloy containing any one or more of Al, Ag, Au, Pt, Pd, Ni, and Cu. Of course, the connection electrode 400 may be formed using various conductive materials besides metal.

The height of the connection electrode 400 in the Z direction, that is, the vertical direction may be equal to or different from the height of the overvoltage protection unit 300, and the width in the X direction and the Y direction may be equal to or greater than the width of the overvoltage protection unit 300 May be the same or different from each other. That is, the connection electrode 400 may be formed to be greater than or equal to the height of the overvoltage protection unit 300, and may be formed to be wider than or equal to the diameter or width. The height of the connection electrode 400 may be higher than the height of the overvoltage protection unit 300 and the width of the connection electrode 400 may be larger than the planar width of the overvoltage protection unit 300. For example, each of the first and second connection electrodes 410 and 420 may be formed to have a height of 0.5 to 3 times the height of the overvoltage protection unit 300. The sum of the heights of the first and second connection electrodes 410 and 420 may be 1 to 6 times the height of the overvoltage protection unit 300. For example, the sum of the heights of the first and second connection electrodes 410 and 420 may be 100 占 퐉 to 1000 占 퐉, preferably 200 占 퐉 to 900 占 퐉, and more preferably 400 占 퐉 to 700 占 퐉 . At this time, the first and second connection electrodes 410 and 420 may have different heights and widths. The width of the connecting electrode 400 in the X direction may be 1% to 90% of the length of the laminate 100 in the X direction, and the width of the connecting electrode 400 in the Y direction may be 5 % ≪ / RTI > to 90%. At this time, the X direction width and the Y direction width of the connection electrode 400 may be the same or different. That is, the width of at least one region including the width of the connection electrode 400 in the X direction and the width in the Y direction may be equal to or different from the width of the other region. In other words, at least one region of the connection electrode 400 may be formed in an asymmetrical shape. The width of the connection electrode 400 in the X direction and the Y direction may be 1 to 10 times larger than the width of the overvoltage protection unit 300 in the X direction and the Y direction. And may be formed to be 1/10 to 1 times the direction width, respectively. That is, the width of the connection electrode 400 is shorter than the length and width of the laminated body 100 in the X direction and the Y direction, is equal to or larger than the width of the overvoltage protection unit 300, is smaller than the width of the internal electrode 200 Or the like.

The connection electrode 400 functions to connect the external electrode 500 and the internal electrode 200. Therefore, the overvoltage of the ESD or the like applied through the external electrode 500 is transmitted to the internal electrode 200 and the overvoltage protection unit 300 through the connection electrode 400, and the overvoltage through the overvoltage protection unit 300 is again And is transmitted to the external electrode 500 through the internal electrode 200 and the connection electrode 400. In addition, the connection electrode 400 is formed at the center of the laminate 100 and is formed to have a width wider than that of the overvoltage protector 300, thereby reducing parasitic resistance and parasitic inductance. In other words, parasitic resistance and parasitic inductance can be reduced compared with the case where the connection electrode 400 is formed on the outer periphery of the layered structure 100. Therefore, the insertion loss of S21 can be reduced in the radio communication frequency range of 700 MHz to 3 GHz. In addition, since the connection electrode 400 is formed to have a width preferably wider than the width of the overvoltage protection unit 300, it is possible to prevent deterioration due to repetitive ESD voltage, thereby suppressing an increase in the discharge start voltage. That is, the overvoltage protection unit 300 bypasses the ESD voltage by generating sparks in the interior due to, for example, ESD energy. When the thickness of the connection electrode 400 is thin, The discharge start voltage may be increased. However, by forming the connection electrode 400 to have a thickness of 10 m or more, it is possible to prevent the connection electrode 400 from disappearing due to the repetitive ESD voltage, thereby preventing the rise of the discharge start voltage.

External electrode

The external electrodes 510, 520 and 500 may be provided on two mutually opposed surfaces outside the layered body 100. For example, the external electrodes 500 are disposed on opposite sides of the laminate 100 in the Z direction, i.e., in the vertical direction. That is, the lower surface and the upper surface, respectively. The external electrodes 500 may be connected to the connection electrodes 400 in the stack 100. At this time, one of the external electrodes 500 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first outer electrode 510 can be connected to an internal circuit, and the second outer electrode 520 can be connected to a metal case. Further, the second outer electrode 520 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

Meanwhile, the external electrode 500 may be formed on the entire surface of the lower surface and the upper surface, or may be formed on the lower surface and a part of the upper surface. That is, the external electrode 500 may be formed on the lower surface and the remaining region except the predetermined width from the edge of the upper surface. For example, the external electrode 500 may be formed in an area of 50% to 95% excluding the predetermined width from the edges of the lower surface and the upper surface. Further, the external electrode 500 may be formed on the entire area of the lower surface and the upper surface, and may extend from the upper surface and the lower surface to the other surface. That is, the external electrode 500 may extend to a predetermined region of the surface facing the X and Y directions as well as the bottom and top surfaces facing the Z direction. For example, when the conductive paste is immersed in the conductive paste, the external electrodes 500 may be formed on the side surfaces in the X and Y directions as well as the upper and lower surfaces in the Z direction. In contrast, when the electrode is formed by printing, vapor deposition, sputtering, plating, or the like, the external electrode 500 may be formed on the lower surface and the upper surface in the Z direction with a predetermined area. That is, the external electrode 500 may be formed on the lower surface mounted on the printed circuit board and the upper surface connected to the metal case, as well as other areas depending on the forming method or process conditions.

Meanwhile, as shown in FIG. 15, the complex protection unit according to another embodiment of the present invention may further include an overvoltage overvoltage protection unit 300, which is formed to extend at least one area. That is, the overvoltage protection unit 300 may further include at least one wide region 350 having a wide width. The extension portion 350 may be formed to have a width of 1% to 150% of the diameter of the overvoltage protection portion 300. That is, the width of the extension portion 350 may be 1% to 150% of the width of the other region of the overvoltage protection portion 300 where the extension portion 350 is not formed. For example, the extension 350 may be formed to have a diameter of 10 [mu] m to 100 [mu] m added to the diameter of the overvoltage protector 300. [ In addition, the height of the extension portion 350 may be 10% to 70% of the height of the overvoltage protection portion 300. By forming the extension part 350 in this way, the short path of the overvoltage protection part 300 can be cut off. That is, when the overvoltage such as ESD is continuously applied, the melting phenomenon of the connection electrode 400 occurs, and thus the connection electrode material can be fixed to the side wall of the through hole of the overvoltage protection unit 300, . However, since the overvoltage protector 300 is formed with the enlarged portion 350 having a different diameter, the short path can be blocked.

As described above, according to another embodiment of the present invention, the connection electrode 400 is formed at the center of the laminate 100 and is formed to have a width wider than the width of the overvoltage protector 300, And parasitic inductance can be reduced. In other words, parasitic resistance and parasitic inductance can be reduced compared with the case where the connection electrode 400 is formed on the outer periphery of the layered structure 100. Therefore, the insertion loss of S21 can be reduced in the radio communication frequency range of 700 MHz to 3 GHz. In addition, since the connection electrode 400 is formed to have a width preferably wider than the width of the overvoltage protection unit 300, it is possible to prevent deterioration due to repetitive ESD voltage, thereby suppressing an increase in the discharge start voltage. That is, the overvoltage protection unit 300 bypasses the ESD voltage by generating sparks in the interior due to, for example, ESD energy. When the thickness of the connection electrode 400 is thin, The discharge start voltage may be increased. However, by forming the connection electrode 400 to have a thickness of 10 m or more, it is possible to prevent the connection electrode 400 from disappearing due to the repetitive ESD voltage, thereby preventing the rise of the discharge start voltage.

The overvoltage protection member 320 or the overvoltage protection unit 300 of another embodiment may be formed in various forms in the complex protection device of the present invention. The overvoltage protection member 320 or the overvoltage protection unit 300 Are shown in Figs. 17-19. Although the following embodiments exemplify the overvoltage protection member 320, the overvoltage protection unit 300 of the other embodiments is also the same.

17 is a cross-sectional schematic view and cross-sectional photograph of the overvoltage protection member 320 according to the first embodiment of the composite protection device of the present invention. That is, the overvoltage protection member 320 may be formed to be smaller or larger than at least one region of the thickness of one region. FIG. 17 is a cross-sectional schematic view and a cross-sectional view of a portion of the overvoltage protection member 320 enlarged.

As shown in Fig. 17A, the overvoltage protection member 320 may be formed of an insulating material. At this time, the insulating material may be a porous insulating material including a plurality of pores (not shown). That is, a plurality of pores (not shown) may be formed in the overvoltage protection member 320. By forming pores, overvoltage such as ESD can be more easily bypassed. In addition, the overvoltage protection member 320 may be formed by mixing a conductive material and an insulating material. For example, the overvoltage protection member 320 can be formed by mixing a conductive ceramic and an insulating ceramic. In this case, the overvoltage protection member 320 can be formed by mixing conductive ceramics and insulating ceramics at a mixing ratio of, for example, 10:90 to 90:10. As the blending ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the blending ratio of the conductive ceramic increases, the discharge starting voltage may be lowered. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted so that a predetermined discharge starting voltage can be obtained.

In addition, the overvoltage protection member 320 may be formed by stacking a conductive layer and an insulating layer in a predetermined laminated structure. That is, the overvoltage protection member 320 may be formed by laminating the conductive layer and the insulating layer at least once to divide the conductive layer and the insulating layer. For example, the overvoltage protection member 320 may be formed as a two-layer structure in which a conductive layer and an insulating layer are laminated, and a three-layer structure may be formed by stacking a conductive layer, an insulating layer, and a conductive layer. In addition, the conductive layers 321a and 321b (321) and the insulating layer 322 may be repeatedly laminated a plurality of times to form a laminate structure of three or more layers. For example, as shown in FIG. 17 (b), a three-layered overvoltage protection member 320 in which a first conductive layer 321a, an insulating layer 322, and a second conductive layer 321b are stacked . On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the conductive layer may be located in the uppermost layer and the lowermost layer. At this time, a plurality of pores (not shown) may be formed in at least a part of the conductive layer 321 and the insulating layer 322. For example, since the insulating layer 322 formed between the conductive layers 321 is formed in a porous structure, a plurality of pores may be formed in the insulating layer 322.

The overvoltage protection member 320 may further include a void in a predetermined area. For example, a gap may be formed between the layer in which the conductive material and the insulating material are mixed, and a gap may be formed between the conductive layer and the insulating layer. That is, a first mixed layer of a conductive material and an insulating material, a cavity and a second mixed layer may be laminated, and a conductive layer, a cavity, and an insulating layer may be laminated. For example, the overvoltage protection member 320 may include a first conductive layer 321a, a first insulation layer 322a, a gap 323, a second insulation layer 322b, And a second conductive layer 321b may be stacked. That is, the insulating layers 322a and 322b may be formed between the conductive layers 321a and 321b and the spaces 323 may be formed between the insulating layers 322. Of course, the overvoltage protection member 320 may be formed by repeatedly stacking the conductive layer, the insulating layer, and the voids. On the other hand, when the conductive layer 321, the insulating layer 322, and the void 323 are stacked, the thicknesses of all of them may be the same, and at least one of them may be thinner than the others. For example, the void 323 may be thinner than the conductive layer 321 and the insulating layer 322. [ The conductive layer 321 may have the same thickness as the insulating layer 322 or may be thicker or thinner than the insulating layer 322. Meanwhile, the void 323 can be formed by filling the polymer material and performing a sintering process to remove the polymer material. For example, a first polymer material including a conductive ceramic, a second polymer material including an insulating ceramic, and a third polymer material not including a conductive ceramic or an insulating ceramic are filled in a via hole and subjected to a sintering process By removing the polymer material, a conductive layer, an insulating layer, and voids can be formed. Meanwhile, the voids 323 may be formed without dividing the layers. For example, an insulating layer 322 may be formed between the conductive layers 321a and 321b, and a plurality of pores may be formed in the insulating layer 322 in the vertical direction or the horizontal direction to form the voids 323. That is, the void 323 may be formed as a plurality of pores in the insulating layer 322. Of course, the void 323 may be formed in the conductive layer 321 by a plurality of pores.

On the other hand, the conductive layer 321 used for the overvoltage protection member 320 may have a predetermined resistance and allow current to flow. For example, the conductive layer 321 may be a resistor having several ohms to several hundreds of M [Omega]. When the overvoltage is applied to the conductive layer 321 by ESD or the like, the energy level is lowered so that the structural damage of the complex protective device due to the overvoltage does not occur. That is, the conductive layer 321 serves as a heat sink for converting electric energy into heat energy. The conductive layer 321 may be formed using a conductive ceramic, and the conductive ceramic may be a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, and Bi. The conductive layer 321 can be formed to a thickness of 1 to 50 mu m. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 to 50 탆.

In addition, the insulating layer 322 used for the overvoltage protection member 320 may be made of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 50,000. For example, the insulating ceramics may be formed by using a dielectric material powder such as MLCC, a mixture containing at least one of ZrO 2, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn and Al ₂ O ₃ . The insulating layer 322 may be formed of a porous structure having a plurality of pores each having a size of 1 nm to 5 탆 and formed with a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 탆. That is, although the insulating layer 322 is formed of an electrically insulating material that can not conduct current, since pores are formed, a current can flow through the pores. At this time, as the size of the pores increases or the porosity increases, the discharge firing voltage may decrease. On the contrary, if the pore size decreases or the porosity decreases, the discharge firing voltage may increase. However, if the pore size exceeds 5 占 퐉 or the porosity exceeds 80%, it may be difficult to maintain the shape of the overvoltage protection member 320. Therefore, the pore size and the porosity of the insulating layer 322 can be adjusted to adjust the discharge start voltage while maintaining the shape of the overvoltage protection member 320. Meanwhile, when the overvoltage protection member 320 is formed of a mixed material of an insulating material and a conductive material, an insulating ceramic having micropores and porosity may be used as the insulating material. Further, the insulating layer 322 has resistance lower than the resistance of the sheet due to the micropores, and partial discharge can be performed through the micropores. That is, the insulating layer 322 is formed with micro-pores and partially discharged through the micro-pores. The insulating layer 322 may be formed to a thickness of 1 占 퐉 to 50 占 퐉. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to 1 占 퐉 to 50 占 퐉.

Meanwhile, the overvoltage protection member 320 may be formed by mixing at least one conductive material selected from Ru, Pt, Pd, Ag, Au, Ni, Cr, W, and Fe into an organic material such as polyvinyl alcohol (PVA) or polyvinyl butyral It can be formed from one material. In addition, the overvoltage protection member 320 may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ to the mixed material.

18 is a schematic cross-sectional view of the overvoltage protection member 320 according to the second embodiment of the composite protection element of the present invention. That is, the overvoltage protection member 320 may include the gap 323 as shown in FIG. 18 (a). That is, the overvoltage protection member 320 may be formed with the void 323 without filling the overvoltage protective material in the opening formed through the sheet. In addition, the overvoltage protection member 320 may be formed with a porous insulating material in at least one region of the through-hole. 18 (b), a porous insulating material may be applied to the side wall of the through hole to form the insulating layer 322, and as shown in FIG. 18 (c), the upper and lower portions of the through hole The insulating layers 322a, 322b, and 322 may be formed on at least one of the insulating layers 322a and 322b.

19, the overvoltage protection member 320 includes discharge electrodes 311, 312, and 310 as shown in FIG. 19, and FIG. 19 is a schematic cross-sectional view of the overvoltage protection member 320 according to the third embodiment of the present invention. And a discharge induction layer 330 formed between the overvoltage protection member 320 and the overvoltage protection member 320. That is, a discharge induction layer 330 may be further formed between the discharge electrode 310 and the overvoltage protection member 320. At this time, the discharge electrode 310 may include the conductive layers 311a and 312a and the porous insulating layers 311b and 312b formed on at least one surface of the conductive layers 311a and 311a. Of course, the discharge electrode 310 may be a conductive layer having no porous insulating layer formed on its surface.

The discharge induction layer 330 may be formed when the overvoltage protection member 320 is formed using a porous insulating material. At this time, the discharge induction layer 330 may be formed of a dielectric layer having a higher density than the overvoltage protection member 320. That is, the discharge induction layer 330 may be formed of a conductive material or an insulating material. For example, when the overvoltage protection member 320 is formed using porous ZrO and the internal electrode 200 is formed using Al, a discharge induction layer of AlZrO is formed between the overvoltage protection member 320 and the discharge electrode 310, (330) may be formed. On the other hand, TiO may be used instead of ZrO as the overvoltage protection member 320, in which case the discharge induction layer 330 may be formed of TiAlO. That is, the discharge induction layer 330 may be formed by the reaction of the discharge electrode 310 and the overvoltage protection member 320. Of course, the discharge inducing layer 330 can be formed by further reacting the sheet material. In this case, the discharge inducing layer 330 can be formed by the reaction of an internal electrode material (for example, Al), a protective material (for example, ZrO 2), and a sheet material (for example, BaTiO ₃ ). In addition, the discharge inducing layer 330 may be formed by reacting with the sheet material. That is, in the region where the overvoltage protection member 320 contacts the sheet, the discharge induction layer 330 can be formed by the reaction of the overvoltage protection member 320 and the sheet. Accordingly, the discharge induction layer 330 may be formed so as to surround the overvoltage protection member 320. At this time, the discharge induction layer 330 between the overvoltage protection member 320 and the discharge electrode 310, the overvoltage protection member 320, and the discharge induction layer 330 between the sheets may have different compositions. Meanwhile, the discharge inducing layer 330 may be formed by removing at least one region, and may be formed differently from at least one region having a different thickness. That is, the discharge induction layer 330 may be discontinuously formed by removing at least one region, and the thickness of the discharge induction layer 330 may be non-uniformly formed in at least one region different in thickness. The discharge induction layer 330 may be formed during the baking process. That is, during the firing process at a predetermined temperature, the discharge electrode material, the ESD protection material, and the like may be mutually diffused to form the discharge induction layer 330 between the discharge electrode 310 and the overvoltage protection member 320. On the other hand, the discharge induction layer 330 may be formed to a thickness of 10% to 70% of the thickness of the overvoltage protection member 320. That is, a part of the thickness of the overvoltage protection member 320 may be changed into the discharge inducing layer 330. Therefore, the discharge induction layer 330 may be formed thinner than the overvoltage protection member 320, and may be thicker, thinner, or thinner than the discharge electrode 310. The level of the discharge energy of the ESD voltage induced in the overvoltage protection member 320 can be lowered by the discharge induction layer 330. [ Therefore, the discharge efficiency can be improved by discharging the ESD voltage more easily. In addition, since the discharge inducing layer 330 is formed, it is possible to prevent the dissimilar materials from diffusing into the overvoltage protection member 320. That is, diffusion of the sheet material and the internal electrode material into the overvoltage protection member 320 can be prevented, and external diffusion of the overvoltage protection material can be prevented. Therefore, the discharge inducing layer 330 can be used as a diffusion barrier, and thus the breakdown of the overvoltage protection member 320 can be prevented. Meanwhile, the overvoltage protection member 320 may further include a conductive material. In this case, the conductive material may be coated with an insulating ceramic. 17A, when the overvoltage protection member 320 is formed by mixing a porous insulating material and a conductive material, the conductive material may be coated using NiO, CuO, WO, or the like. have. Therefore, the conductive material can be used as the material of the overvoltage protection member 320 together with the porous insulating material. In addition, when a conductive material other than a porous insulating material is further used for the overvoltage protection member 320, for example, two conductive layers 321a and 321b as shown in FIGS. 17B and 17C, The discharge inducing layer 330 may be formed between the conductive layer 321 and the insulating layer 322. In this case, Meanwhile, the discharge electrode 310 may be formed in a shape in which a part of the area is removed. That is, the discharge electrode 310 may be partially removed and the discharge inducing layer 330 may be formed in the removed region. However, even if the discharge electrode 310 is partially removed, the electric characteristics are not deteriorated because it maintains a generally connected shape in plan view.

The discharge electrode 310 may be formed of a metal or a metal alloy on which an insulating layer is formed. That is, the discharge electrode 310 may include the conductive layers 311a and 312a and the porous insulating layers 311b and 312b formed on at least one surface of the conductive layers 311a and 312a. At this time, the porous insulating layers 311b and 312b may be formed on at least one surface of the discharge electrode 310. That is, it may be formed only on one surface that does not contact with the overvoltage protection member 320 and another surface that does not contact with the overvoltage protection member 320 and another surface that is in contact with the overvoltage protection member 320, Respectively. Also, the porous insulating layers 311b and 312b may be formed on at least one surface of the conductive layers 311a and 312a, or may be formed on at least a part of the conductive layers 311a and 312a. At least one region of the porous insulating layers 311b and 312b may be removed or formed to have a small thickness. That is, the porous insulating layers 311b and 312b may not be formed in at least one region on the conductive layers 311a and 312a, and the thickness of at least one region may be thinner or thicker than the thickness of the other regions. In this discharge electrode 310, an oxide film is formed on the surface during firing, and the inside can be formed of Al which maintains conductivity. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used.

Meanwhile, in one embodiment of the present invention, the overvoltage protection member 320 is formed by embedding or applying overvoltage protection material in the through hole formed in the sheet 106. [ However, the overvoltage protection member 320 may be formed in a predetermined region of the sheet, and the discharge electrode 310 may be formed to contact the overvoltage protection member 320, respectively. That is, as shown in the cross-sectional view of another example of Fig. 20, two discharge electrodes 311 and 312 are formed on the sheet 105 at a predetermined interval in the horizontal direction, and overvoltage protection is provided between the two discharge electrodes 311 and 312 A member 320 may be formed.

The overvoltage protection unit 2230 includes at least two discharge electrodes 311 and 312 formed on the same plane and at least one ESD overvoltage protection member 320 provided between the at least two discharge electrodes 311 and 312 . That is, the two discharge electrodes 311 and 312 may be provided in the direction in which the external electrode 2240 is formed, that is, in the X direction, so as to be spaced apart from each other in a predetermined region of the sheet, Two or more discharge electrodes (not shown) may be further provided. Accordingly, at least one discharge electrode may be formed in a direction perpendicular to the direction in which the external electrode 2240 is formed, and at least one discharge electrode may be formed so as to face the discharge electrode at a predetermined distance. For example, as shown in FIG. 9, the overvoltage protection unit 2230 includes a fifth sheet 105, first and second discharge electrodes 311 and 312 formed on the fifth sheet 105, And an overvoltage protection member 320 formed on the fifth sheet 105. [ Here, the overvoltage protection member 320 may be formed so that at least a part thereof is connected to the first and second discharge electrodes 311 and 312. The first discharge electrode 311 is connected to the external electrode 2241 and is formed on the fifth sheet 105 and has a distal end connected to the overvoltage protection member 320. The second discharge electrode 312 is formed so as to be connected to the external electrode 2242 and spaced apart from the first discharge electrode 311 on the fifth sheet 105 and has a distal end connected to the overvoltage protection member 320. The overvoltage protection member 320 may be formed to be connected to the first and second discharge electrodes 311 and 312 at a predetermined area of the fifth sheet 105, for example, at the center thereof. At this time, the overvoltage protection member 320 may be partially overlapped with the first and second discharge electrodes 311 and 312. The overvoltage protection member 320 may be formed on the exposed fifth sheet 105 between the first and second discharge electrodes 311 and 312 so as to be connected to the sides of the first and second discharge electrodes 311 and 312 have. However, in this case, since the overvoltage protection member 320 may be separated from the first and second discharge electrodes 311 and 312 without being in contact with the first and second discharge electrodes 311 and 312, (320). Even when the discharge electrode 310 and the overvoltage protection member 320 are formed on the same plane, the outer electrode 2240 is formed to overlap at least part of the inner electrode 200, and the outermost sheet, that is, 10 sheets 101 and 110 may be formed to have a lower permittivity than the remaining sheets, that is, the second to ninth sheets 102 to 109 in between.

As described above, the complex protection unit according to the embodiments of the present invention is mainly described as a suppressor type including the overvoltage protection member. However, the present invention can be applied to various types of overvoltage protection parts as the complex protection unit. In other words, various types of overvoltage protection parts having a function of bypassing an overvoltage, blocking a leakage voltage or current such as an electric voltage, and transmitting a communication signal can be used as a composite protection part. For example, a structure in which a varistor and a capacitor are combined can be used.

The composite protection device according to embodiments of the present invention as described above may be provided between the metal case of the electronic device, that is, between the side case 1110 and the internal circuit, that is, the main board 1500. That is, the contact portion 2100 can be connected to the ground terminal, and the composite protection portion 2200 can be connected to the side case 1110 through the conductive portion 2300. At this time, the ground terminal may be provided in the main board 1500. Therefore, the electrostatic voltage transmitted from the ground terminal of the internal circuit to the metal case can be cut off, and the overvoltage such as ESD applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, in the composite protection device of the present invention, no current flows at the rated voltage and the electrostatic voltage, and current flows through the overvoltage protection member 320 at the ESD voltage, thereby bypassing the overvoltage to the ground terminal. On the other hand, the composite protection device may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the composite protection device may have a rated voltage of 100 V to 240 V, and the electrostatic voltage may be equal to or higher than the operating voltage of the circuit, and the ESD voltage generated by external static electricity or the like may be higher than the electrostatic voltage. In addition, a communication signal from the outside, that is, an AC frequency, can be transmitted to the internal circuit by a capacitor formed between the internal electrodes 200. [ Therefore, even when a separate antenna is not provided and the metal case is used as an antenna, a communication signal can be received from the outside. As a result, the composite protection device according to the present invention can interrupt the electric voltage, bypass the ESD voltage to the ground terminal, and apply the communication signal to the internal circuit.

Further, the composite protection unit of the composite protection device according to the embodiment of the present invention may be formed by stacking a plurality of sheets having high withstand voltage characteristics to form a laminate 2210, The overvoltage protection member 320 can also maintain the high insulation resistance state without damaging the device by bypassing the overvoltage when the overvoltage from the metal case flows into the internal circuit. . That is, the overvoltage protection member 320 includes a porous insulating material that has a porous structure and allows electric current to flow through the micropores, and further includes a conductive material that converts electric energy into thermal energy by lowering the energy level, Bypassing the overvoltage protects the circuit. Therefore, the electronic device is not broken by overvoltage, and accordingly, the electronic device provided with the metal case can continuously prevent the electric shock voltage generated in the defective charger from being transmitted to the user through the metal case of the electronic device. On the other hand, a general MLCC (Multi Layer Capacitance Circuit) protects the electrostatic voltage but is vulnerable to ESD. When repeated ESD is applied, spark occurs due to leakage point due to charge, A phenomenon may occur. However, since the overvoltage protecting member 320 including the porous insulating material is formed between the internal electrodes 200, at least a part of the laminated body 2210 is not destroyed by passing the overvoltage through the overvoltage protecting member 320 Do not.

A predetermined parasitic capacitance can be generated between the external electrode 2240 and the internal electrode 200 by overlapping the external electrode 2240 and the internal electrode 200. The parasitic capacitance can be generated between the external electrode 2240 and the internal electrode 200 The capacitance of the composite protection device can be adjusted. However, since the capacitance of the composite protection element affects the performance of the antenna in the electronic device, the sheet 100 having a high dielectric constant is used in order to keep the scattering of the capacitance of the composite protection element preferably within 5%. Therefore, the higher the dielectric constant of the sheet 100, the greater the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 2240. However, since the dielectric constant of the outermost sheet is lower than that of the remaining sheets, the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 2240 can be reduced.

The present invention has been described taking an example of a complex protection device that is provided in an electronic device of a smart phone and protects the electronic device from overvoltage such as ESD applied from the outside and protects the user by blocking leakage current from the inside of the electronic device. However, the composite protection device of the present invention is provided in various electric and electronic devices other than the smart phone, and can perform more than two protection functions.

The present invention is not limited to the above-described embodiments, but may be embodied in various forms. In other words, the above-described embodiments are provided so that the disclosure of the present invention is complete, and those skilled in the art will fully understand the scope of the invention, and the scope of the present invention should be understood by the appended claims .

1000: Electronic device 2000: Composite protection device
2100: contact part 2200: composite protection part
2300: conductive part 2400: support part

Claims (14)

A composite protective device provided between an internal circuit and a conductor capable of being contacted by a user of the electronic device,
At least a portion of which is in contact with an internal circuit of the electronic device;
A composite protection part having a contact surface coupled to the contact part;
And a conductive part coupled to the other surface of the composite protection part in one area and fixed in the electronic device.
The complex protection device according to claim 1, wherein a transient voltage applied from the outside is bypassed to a ground terminal inside the electronic device, a voltage or current leaked from the inside of the electronic device is cut off, and a communication signal is transmitted.
The composite protection device according to claim 1, further comprising a conductive adhesive member provided on the contact portion.
The composite protection device according to claim 1, further comprising a support portion provided in contact with the conductive portion.
[Claim 4] The composite protection device of claim 4, wherein the support portion is provided at a height of the contact portion and the composite protection portion, one side of which is in contact with the conductive portion and the other side of which is in contact with the inside of the electronic device.
5. The composite protection device according to claim 4, wherein the supporting portion is insulating.
The composite device according to claim 4, wherein the supporting portion is provided between the conductive portion and the fixed portion of the electronic device.
The composite device according to claim 7, wherein the support portion is conductive.
1. An electronic device in which a composite protection element is provided between a conductor which can be contacted by a user and an internal circuit,
A window and a display section,
A bracket provided below the display unit,
A main mode provided below the bracket,
A cover case provided to cover the main board,
And a side case closing a side space between the window and the cover case,
Wherein the composite protection element is provided inside the side case.
[12] The composite protection device according to claim 9,
At least a portion of which is in contact with an internal circuit of the electronic device;
A composite protection part having a contact surface coupled to the contact part;
And a conductive portion coupled to the other surface of the composite protection portion in one area and fixed inside the electronic device.
The electronic apparatus according to claim 10, further comprising a fixing unit provided inside the side case and fixing the complex protection element.
12. The electronic apparatus according to claim 11, wherein the conductive portion is fixed to the fixing portion.
11. The electronic device according to claim 10, wherein the contact portion is electrically connected to an internal circuit of the main board.
14. The electronic apparatus according to claim 13, wherein the bracket is at least partially conductive, the contact portion is in contact with the bracket, and the bracket is connected to an internal circuit of the main board.

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