KR20180065008A - Complex protection device and electronic device having the same - Google Patents

Abstract

The present invention provides a composite protection element provided in an electronic device such as a smartphone or the like to protect the electronic device or a user from voltage or current, and an electronic device having the same. The composite protection element comprises: a stacked body in which a plurality of sheets are stacked; a plurality of internal electrodes formed in the stacked body; an overvoltage protection unit formed in at least a part of the sheet; and an external electrode provided outside the stacked body, and connected to the internal electrode and the overvoltage protection unit. A specific inductive capacity of a sheet provided between the external electrode and the outermost internal electrode is 100 or lower, and a specific inductive capacity of the remaining sheets is 500 or higher.

Description

TECHNICAL FIELD [0001] The present invention relates to a composite protection device, and more particularly,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite protection device, and more particularly, to a complex protection device provided in various electronic devices and capable of protecting an electronic device or a user from voltage and current.

Various electronic components such as smart phones are integrated with various components according to their functions. An electronic device is provided with an antenna capable of receiving various frequency bands such as a wireless LAN (wireless LAN), a Bluetooth (Bluetooth), and a GPS (Global Positioning System) And can be installed in a case constituting an electronic device. Therefore, a contactor for electrical connection is provided between the antenna installed in the case and the internal circuit of the electronic device.

Meanwhile, in recent years, as the image and durability of smart phones have been emphasized, the spread of terminals using metal materials is increasing. That is, the spread of smart phones having a frame made of metal or a case made of metal except the screen display portion on the front is increasing.

However, if a smartphone using a metal case is charged while using a non-genuine charger, an electric shock may occur. That is, a shock current is generated by charging using a non-genuine charger or a defective charger which does not incorporate an overcurrent protection circuit or uses a low-quality device, and this shock current is conducted to the ground terminal of the smart phone, So that a user who is in contact with the metal case can be electrically charged.

Therefore, there is a need for a component that can prevent damage to the internal circuit caused by static electricity and electric shock of the user.

Korean Patent No. 10-0876206

The present invention provides a composite protection device provided in an electronic device such as a smart phone and capable of protecting an electronic device or a user from a voltage and a current, and an electronic apparatus having the same.

The present invention provides a composite protection device that is not insulated and destroyed by overvoltage such as ESD (ElectroStatic Discharge), and an electronic apparatus having the same.

The present invention provides a composite protection device capable of controlling parasitic capacitance and preventing degradation of performance of an electronic device due to parasitic capacitance, and an electronic apparatus having the composite protection device.

A composite protection device according to an aspect of the present invention includes: a laminate having a plurality of sheets stacked; A plurality of internal electrodes formed in the laminate; An overvoltage protector formed on at least a portion of the sheet; And an outer electrode provided outside the laminate and connected to the inner electrode and the overvoltage protection unit, wherein a relative dielectric constant of the sheet provided between the outer electrode and the outermost inner electrode is 100 or less, and a relative dielectric constant of the remaining sheet is 500 or more.

The overvoltage protection unit includes at least two discharge electrodes and at least one overvoltage protection layer provided between the discharge electrodes.

The overvoltage protection layer includes at least one of a porous insulating material, a conductive material and a void.

And the inner electrode adjacent to the discharge electrode is connected to the same outer electrode.

The internal electrode adjacent to the discharge electrode is connected to another external electrode.

At least one of the plurality of internal electrodes is formed to have a length different from that of the other internal electrodes.

The external electrode is different from at least one region having a different thickness.

The external electrode extends on at least one of the lowermost layer and the uppermost layer sheet of the laminate and is partially overlapped with the outermost internal electrode.

The outermost inner electrode has a region overlapping the outer electrode with a width larger than that of the remaining region.

The sheet provided between the outer electrode and the outermost inner electrode has a lower content of Ba or Ti than the remaining sheet.

The sheet provided between the outer electrode and the outermost inner electrode has a higher Nd or Bi content than the remaining sheet.

The electronic device according to another aspect of the present invention is an electronic device including the composite protection device, and the composite protection device is provided between the conductive circuit and the internal circuit that can be contacted by the user, thereby blocking the electric voltage and bypassing the overvoltage.

A composite protection device according to embodiments of the present invention is provided between a metal case and an internal circuit of an electronic device to block an electric voltage and bypass an overvoltage such as ESD to a ground terminal. That is, the composite protection device maintains the insulated state, shields the electrostatic voltage leaking from the internal circuit, and protects the internal circuit by protecting the overvoltage to prevent the overvoltage from flowing into the electronic device. Thus, electronic devices and users can be protected from voltage and current.

In addition, the external electrodes are formed so as to overlap with at least a part of the internal electrodes, and the capacitance of the composite protection device can be adjusted by adjusting the overlapping area. By making the dielectric constant of the sheet between the external electrode and the internal electrode smaller than the dielectric constant of the other sheets, it is possible to reduce the scattering of the parasitic capacitance, thereby preventing degradation of the performance of the electronic device such as degradation of antenna performance due to parasitic capacitance .

On the other hand, the internal electrode of the capacitor portion adjacent to the discharge electrode of the protection portion can be connected to the same external electrode, thereby preventing the overvoltage from flowing into the internal circuit even if the sheet is broken.

1 and 2 are a perspective view and a cross-sectional view of a composite protection device according to an embodiment of the present invention;
FIGS. 3 to 5 are a cross-sectional photograph and a partial enlarged photograph of a composite protection device according to an embodiment of the present invention;
6 to 8 are cross-sectional views according to embodiments of a protective layer constituting a composite protective device according to the present invention.
9 is a cross-sectional view of a composite protection device according to another embodiment of the present invention.
10 and 11 are equivalent circuit diagrams of a composite protection device according to embodiments of the present invention.
12 and 13 are cross-sectional views of a composite protection device according to a modification of the embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely.

FIG. 1 is a perspective view of a composite protection device according to an embodiment of the present invention, and FIG. 2 is a sectional view.

1 and 2, a composite protection device according to an embodiment of the present invention includes a laminated body 1000 in which a plurality of sheets 100 to 101 to 111 are laminated, At least one capacitor unit 2000a, 2000b and 2000b having internal electrodes 200 to 201 and at least one discharge electrode 310 and 311 and a protective layer 320 to form an ESD And a protection unit 3000 that protects the overvoltage of the battery. For example, first and second capacitor portions 2000a and 2000b may be provided in the stacked body 1000, and a protective portion 3000 may be provided between the first and second capacitor portions 2000a and 2000b. That is, the first capacitor unit 2000a, the protection unit 3000, and the second capacitor unit 2000b are stacked in the stacked body 1000 to realize a complex protection device. The organic EL device may further include outer electrodes 4100, 4200, and 4000 formed on two opposite sides of the layered structure 1000 and connected to the capacitor unit 2000 and the protection unit 3000. Of course, the composite protection device may include at least one capacitor portion 2000 and at least one protection portion 3000. That is, the capacitor unit 2000 may be provided on either the lower side or the upper side of the protection unit 3000, and at least one capacitor unit 2000 may be provided on the upper side and the lower side of the two or more protection units 3000 spaced from each other . Such a composite protection device is provided between a conductive member and an internal circuit that can be contacted by a user of the electronic device, for example, between the metal case and the PCB, shields the electric voltage, bypasses the ESD voltage, The voltage can be continuously blocked.

1. Laminate

The stacked body 1000 may be provided in a substantially hexahedral shape. That is, the stacked body 1000 has a predetermined length and width in one direction (for example, X direction) and another direction (for example, Y direction) orthogonal to each other in the horizontal direction, Direction) and a substantially hexahedron shape having a predetermined height. That is, when the forming direction of the external electrode 4000 is the X direction, the direction orthogonal to the horizontal direction may be the Y direction and the vertical direction may be the Z direction. Here, the length in the X direction is larger than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height. For example, the ratio of length, width, and height may be 2: 5: 1: 0.3-1. That is, the length may be about two to five times greater than the width based on the width, and the height may be about 0.3 to about 1 times the width. However, the size in the X, Y, and Z directions can be variously changed according to, for example, the internal structure of the electronic device to which the complex protection device is connected, the shape of the complex protection device, and the like.

The stacked body 1000 may be formed by stacking a plurality of sheets 101 to 111 (100). That is, the stacked body 1000 may be formed by stacking a plurality of sheets 100 having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Therefore, the length and width of the laminate 1000 can be determined by the length and width of the sheet 100, and the height of the laminate 1000 can be determined by the number of laminations of the sheet 100. [ On the other hand, the plurality of sheets 100 constituting the laminated body 1000 can be formed using dielectric materials such as MLCC, LTCC, and HTCC. At least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO is added to the MLCC dielectric material as a main component of at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO ₂ , And glass materials. In addition, the sheet 100 may include one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, ZnO and Al ₂ O ₃ in addition to MLCC, Or more. The sheet 100 may be formed of a material having varistor characteristics such as Pr-based, Bi-based, and ST-based ceramic materials in addition to the above materials. Of course, the sheet 100 may be formed by mixing materials having MLCC, LTCC, HTCC, and varistor characteristics. For example, the sheet 100 may comprise BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , The permittivity can be controlled. Therefore, the sheet 100 may have a specific dielectric constant of, for example, 5 to 20,000, preferably 7 to 4,000, and more preferably 100 to 3000 depending on the material. For example, seat 100 may include a _{BaTiO 3, NdTiO 3, Bi 2} O 3, ZnO, TiO 2, SiO 2, Al 2 O 3, B 2 O 3, by increasing the content of BaTiO ₃ The dielectric constant can be increased and the dielectric constant can be lowered by increasing the content of NdTiO ₃ and SiO ₂ . On the other hand, at least one of the sheets 110 may have a different dielectric constant from the other. For example, the outermost sheet, that is, the first and eleventh sheets 101 and 111 positioned at the lowest and uppermost layers in the vertical direction are the remaining sheets provided therebetween, that is, the second to tenth sheets 102 to 110, Lt; RTI ID = 0.0 > permittivity < / RTI > That is, the permittivities of the first and eleventh sheets 101 and 111 may be lower than the permittivities of the second to tenth sheets 102 to 110. For example, the relative dielectric constant of the first and eleventh sheets 101 and 111 may be 100 or less, and the relative dielectric constant of the second to tenth sheets 102 to 110 may be 500 or more. For example, the relative dielectric constant of the first and eleventh sheets 101 and 111 may be 5 to 100, and the relative dielectric constant of the second to tenth sheets 102 to 111 may be 500 to 3000. [ In order to make the dielectric constant of the sheet 100 different, the content of the composition for forming the sheet can be controlled. For example, the first to eleventh sheets 101 to 111 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and B ₂ O ₃ , The first and eleventh sheets 101 and 111 can increase the content of NdTiO ₃ and SiO ₂ and reduce the content of BaTiO ₃ to form a dielectric constant of 100 or less and the second to tenth sheets 102 to 110, Can increase the content of BaTiO ₃ and reduce the content of NdTiO ₃ and SiO ₂ , thereby forming a relative dielectric constant of 500 or more. That is, the first and eleventh sheets 101 and 111 increase the content of NdTiO ₃ and SiO ₂ and decrease the content of BaTiO ₃ , as compared to the second to tenth sheets 102 to 110, . On the other hand, the second to tenth sheets 102 to 110 increase the content of BaTiO _{3 and} the content of NdTiO ₃ and SiO ₂ compared to the first and eleventh sheets 101 and 111, . The parasitic capacitance can be reduced by lowering the dielectric constant of the outermost sheet. On the other hand, of the second to tenth sheets 102 to 110, the sheets adjacent to the first and eleventh sheets 101 and 111, for example, the second and tenth sheets 102 and 110, 103 to 109). Further, the dielectric constant of the sheets can be increased from the first and eleventh sheets 101 and 111 toward the center. This is because the composition of the first and eleventh sheets 101 and 111 diffuses to the center of the laminate 1000 when the laminate 1000 is sintered.

In addition, the plurality of sheets 100 may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others. For example, the sheet of the protection unit 3000 may have a thickness different from that of the capacitor unit 2000, and the sheet formed between the protection unit 3000 and the capacitor unit 2000 may have a thickness As shown in FIG. For example, the thickness of the sheet between the protective portion 3000 and the capacitor portion 2000, that is, the fifth and seventh sheets 105 and 107, is greater than the thickness of the sheet of the protective portion 3000, Or may be formed to have a thickness that is thinner than or equal to that of the sheets 102 to 104, 108 to 110 between the internal electrodes of the capacitor unit 2000. [ That is, the gap between the protection unit 3000 and the capacitor unit 2000 may be formed to be thinner or equal to the gap between the internal electrodes of the capacitor unit 2000, or may be formed to be thinner or equal to the thickness of the protection unit 3000 . Of course, the sheets 102 to 104 and 108 to 110 of the capacitor units 2000 and 4000 may be formed to have the same thickness, and one of them may be thinner or thicker than the other. On the other hand, the plurality of sheets 100 may be formed to have a thickness of, for example, 1 m to 4000 m and 3000 m or less. That is, the thickness of each of the sheets 100 may be from 1 탆 to 4000 탆, and preferably from 5 탆 to 300 탆, depending on the thickness of the laminate 1000. In addition, the thickness of the sheet 100 and the number of stacked layers can be adjusted according to the size of the composite protective element. That is, when the present invention is applied to a composite protective device having a small size, the sheet 100 may be formed to have a small thickness and may be formed to have a large thickness when applied to a complex protective device having a large size. In addition, when the sheets 100 are laminated in the same number, the thickness of the composite protective device may be smaller as the size of the composite protective device is smaller and the thickness is thinner as the height is lower. Of course, a thin sheet can also be applied to a composite protective device of a large size, in which case the number of sheets stacked increases. At this time, the sheet 100 may be formed to have a thickness not to be broken when ESD is applied. That is, even when the number of sheets or thickness of the sheets 100 is different, at least one sheet may be formed to a thickness that is not destroyed by repetitive application of ESD.

The stacked body 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided at the lower portion and the upper portion of the capacitor portion 2000, respectively. That is, the stacked body 1000 may include lower and upper cover layers respectively provided in the lowermost layer and the uppermost layer. Of course, the lowermost sheet, that is, the first sheet 101 functions as a lower cover layer, and the uppermost sheet, that is, the eleventh sheet 111, may function as an upper cover layer. The lower and upper cover layers provided separately from the sheet 100 may be formed to have the same thickness. However, the lower and upper cover layers may also be formed with different thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, the lower and upper cover layers may be formed by stacking a plurality of magnetic sheet sheets. Further, a nonmagnetic sheet such as a vitreous sheet may be further formed on the outer surface of the lower and upper cover layers of the magnetic substance sheet, that is, the lower surface and the upper surface of the laminate 1000. However, the lower and upper cover layers may be formed of a glassy sheet, and the surface of the laminate 1000 may be coated with a polymer or a glass material. On the other hand, the lower and upper cover layers may be thicker than the thickness of each of the sheets 100. That is, the cover layer may be thicker than the thickness of one sheet. Thus, the bottom and top sheets, that is, the first and eleventh sheets 101 and 111, may function as the lower and upper cover layers, respectively, and may be thicker than the sheets 102 to 110, respectively.

2. Capacitor section

At least one capacitor portion 2000a, 2000b, 2000 is formed in the stacked body 1000. For example, first and second capacitor units 2000a and 2000b may be provided on the lower portion and the upper portion of the protection unit 3000, respectively. However, the first and second capacitor units 2000a and 2000b are conveniently referred to as being formed by dividing the plurality of internal electrodes 200 with the protective unit 3000 interposed therebetween. In the stacked body 1000, A plurality of internal electrodes 200 may be formed.

The capacitor unit 2000 may be provided on the lower side and the upper side of the protection unit 3000 and may include at least two or more internal electrodes and at least two sheets provided therebetween. For example, the first capacitor unit 2000a includes first to fourth sheets 101 to 104 and first to fourth internal electrodes 201 to 204 formed on the first to fourth sheets 101 to 104, respectively. . ≪ / RTI > The second capacitor portion 2000b includes fifth to eighth internal electrodes 205 to 208 formed on the seventh to tenth sheets 107 to 110 and seventh to tenth sheets 107 to 110, . ≪ / RTI > Here, each of the internal electrodes 201 to 208 and 200 may be formed to have a thickness of 1 占 퐉 to 10 占 퐉, for example. The plurality of internal electrodes 200 are connected to the external electrodes 4100, 4200, and 4000 formed to face each other in the X direction, and the other ends are connected to each other. For example, the first, third, fifth, and seventh internal electrodes 201, 203, 205, 207 are formed on the first, third, seventh, and ninth sheets 101, 103, 107, The first external electrode 4100 and the second external electrode 4200 are formed to have a predetermined area and one side is connected to the second external electrode 4200 and the other side is separated from the first external electrode 4100. The second, fourth, sixth and eighth internal electrodes 202, 204, 206 and 208 are respectively formed on the second, fourth, eighth and tenth seats 102, 104, 108, And is formed so that one side is connected to the first external electrode 4100 and the other side is separated from the second external electrode 4200. That is, the plurality of internal electrodes 200 are alternately connected to any one of the external electrodes 4000, and are formed so as to overlap a predetermined region with the sheets 102 to 104, 108 to 110 therebetween. The length of the internal electrode 200 in the X direction and the width in the Y direction may be smaller than the length and width of the layered body 1000. In other words. The internal electrode 200 may be formed to be smaller than the length and width of the sheet 100. For example, the internal electrode 200 may be formed to have a length of 10% to 90% of the length of the laminate 1000 or the sheet 100 and a width of 10% to 90%. In addition, the internal electrodes 200 may be formed in an area of 10% to 90% of the area of each of the sheets 100, respectively. Meanwhile, the plurality of internal electrodes 200 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and an interval, for example. Capacitors may be formed between the internal electrodes 200 and the capacitance of the capacitors 2000 may be adjusted according to the overlapping area of the internal electrodes 200 and the thickness of the sheets 100. The capacitor unit 2000 may include at least one internal electrode in addition to the first to eighth internal electrodes 201 to 208, and at least one sheet in which at least one internal electrode is formed. Also, the first and second capacitor units 2000a and 2000b may have two internal electrodes, respectively. That is, in the present embodiment, four internal electrodes of the first and second capacitors 2000a and 2000b are formed, respectively. However, two or more internal electrodes may be formed.

The internal electrode 200 may be formed of a conductive material, for example, a metal or a metal alloy containing at least one of Al, Ag, Au, Pt, Pd, Ni and Cu. In the case of alloys, for example, Ag and Pd alloys can be used. On the other hand, Al can form aluminum oxide (Al ₂ O ₃ ) on its surface during firing and can keep Al inside. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used. Meanwhile, the internal electrode 200 may be formed such that at least one region is thin or at least one region is removed to expose the sheet. However, since at least one region of the internal electrode 200 has a small thickness or at least one region is removed, the internal electrode 200 maintains the entirely connected state, so that no problem occurs in the electric conductivity.

The internal electrodes 201 to 204 of the first capacitor portion 2000a and the internal electrodes 205 to 208 of the second capacitor portion 2000b may be formed in the same shape and the same area, Can be the same. The first internal electrode 201 and the eighth internal electrode 208 may overlap with the external electrode 4000 and the first and eighth internal electrodes 201 and 208 may overlap with the remaining internal electrodes 202 and 202. [ 207). That is, the first and eighth internal electrodes 201 and 208 are formed so that the ends of the first and eighth internal electrodes 201 and 208 partially overlap with the first and second external electrodes 4100 and 4200, respectively, and parasitic capacitance is formed therebetween, The electrodes 201 and 208 may be formed to be longer by about 10% than the remaining internal electrodes 202 to 207, for example. In addition, the first and eighth internal electrodes 201 and 208 may be formed to have a larger area overlapping with the external electrode 4000 than the remaining area. For example, the first and eighth internal electrodes 201 and 208 may be formed to be about 10% wider than an area in which the external electrode 4000 overlaps or an area in which the adjacent area is not overlapped. At this time, the area of the first and eighth internal electrodes 201 and 208 that does not overlap the external electrodes 4000 may be the same as the width of the remaining internal electrodes 202 to 209. On the other hand, the sheets 101 to 104 of the first capacitor unit 2000a and the sheets 107 to 110 of the second capacitor unit 2000b may have the same thickness. At this time, when the first sheet 101 functions as a lower cover layer, the first sheet 101 may be thicker than the remaining sheets. Therefore, the capacitances of the first and second capacitor units 2000a and 2000b may be the same. However, the first and second capacitor units 2000a and 2000b may have different capacitances. In this case, at least one of the internal electrode area, the overlapping area of the internal electrodes, and the thickness of the sheet may be different from each other. The internal electrodes 201 to 208 of the capacitor unit 2000 may be formed longer than the discharge electrode 310 of the protection unit 3000 and the area thereof may be larger.

3. Protection

The protective portion 3000 may include at least two discharge electrodes 311 and 312 formed in a vertical direction and at least one protective layer 320 disposed between the discharge electrodes 310. [ For example, the protection unit 3000 includes first and second discharge electrodes 311 and 312 formed on the fifth and sixth sheets 105 and 106 and the fifth and sixth sheets 105 and 106, respectively. And a protective layer 320 formed through the sixth sheet 106. Here, the protective layer 320 may be formed so that at least a portion thereof is connected to the first and second discharge electrodes 311 and 312. The first and second discharge electrodes 311 and 312 may have the same thickness as the internal electrodes 200 of the capacitor unit 2000. For example, the first and second discharge electrodes 311 and 312 can be formed to a thickness of 1 m to 10 m. However, the first and second discharge electrodes 311 and 312 may be thinner or thicker than the internal electrode 200 of the capacitor unit 2000. The first discharge electrode 311 is connected to the first external electrode 4100 and is formed on the fifth sheet 105 and the distal end is connected to the protective layer 320. The second discharge electrode 312 is connected to the second external electrode 4200 and is formed on the sixth sheet 106 and has a distal end connected to the protective layer 320.

Here, the discharge electrodes 311 and 312 are formed to be connected to the same external electrode 4000 as the adjacent internal electrode 200. That is, the first discharge electrode 311 is connected to the adjacent fourth internal electrode 204 and the first external electrode 4100, and the second discharge electrode 312 is connected to the adjacent fifth internal electrode 205 and the second external Electrode 4200 as shown in Fig. The discharge electrode 310 and the adjacent inner electrode 200 are connected to the same outer electrode 4000 so that the ESD voltage is not applied to the inside of the electronic device even when the insulating sheet 100 is deteriorated, That is, when the discharge electrode 310 and the adjacent internal electrode 200 are connected to different external electrodes 4000, the ESD voltage applied through the external electrode 4000 is discharged to the discharge electrode 310 to the other external electrode 4000 through the adjacent internal electrode 200. [ For example, when the first discharge electrode 311 is connected to the first external electrode 4100 and the fourth internal electrode 204 adjacent to the first external electrode 4100 is connected to the second external electrode 4200, A conductive path is formed between the first discharge electrode 311 and the fourth internal electrode 204 so that an ESD voltage applied through the first external electrode 4100 is applied to the first discharge electrode 311, Flows to the insulating sheet 105 and the second internal electrode 202, and can therefore be applied to the internal circuit through the second external electrode 4200. [ In order to solve such a problem, the thickness of the insulating sheet 100 can be increased, but in this case, there arises a problem that the size of the electric shock prevention device increases. However, even when the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 4000, the ESD voltage is not applied to the inside of the electronic device even if the insulating sheet 100 is broken. In addition, it is possible to prevent the ESD voltage from being applied without forming the insulating sheet 100 thick.

A region of the first and second discharge electrodes 311 and 312 that is in contact with the protective layer 320 may be the same size as or smaller than the protective layer 320. Also, the first and second discharge electrodes 311 and 312 may be completely overlapped with each other without leaving the protective layer 320. That is, the edges of the first and second discharge electrodes 311 and 312 may be perpendicular to the edges of the protective layer 320. Of course, the first and second discharge electrodes 311 and 312 may be formed to overlap the protective layer 320. For example, the first and second discharge electrodes 311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the protective layer 320. That is, the first and second discharge electrodes 311 and 312 are not formed to be out of the protective layer 320. Meanwhile, the first and second discharge electrodes 311 and 312 may be formed to have a larger area than a region which is not in contact with the protective layer 320.

The protective layer 320 may be formed at a predetermined region of the sixth sheet 106, for example, at a central portion thereof, and may be connected to the first and second discharge electrodes 311 and 312. At this time, the protective layer 320 may be formed to overlap with the first and second discharge electrodes 311 and 312 at least partially. That is, the protective layer 320 may be formed to overlap with the first and second discharge electrodes 311 and 312 by 10% to 100% of the horizontal area. The passivation layer 320 may be formed to form a through hole having a predetermined size in a predetermined region of the sixth sheet 106, for example, a center portion thereof, and to fill the through hole using a thick film printing process. The protective layer 330 may be formed to have a diameter of, for example, 100 mu m to 500 mu m and a thickness of 10 mu m to 50 mu m. At this time, the smaller the thickness of the protective layer 320, the lower the discharge start voltage. The protective layer 320 may be formed using a conductive material and an insulating material. For example, the protective layer 320 may be formed by printing a mixed material of a conductive ceramic and an insulating ceramic on the sixth sheet 106. On the other hand, the protective layer 320 may be formed on at least one sheet 100. That is, a protective layer 320 is formed on at least one of the two sheets 100 stacked in the vertical direction, for example, and a discharge electrode is formed on the sheet 100 so as to be spaced apart from each other, Lt; / RTI > A more detailed description of the structure, material, and the like of the protective layer 320 will be described later.

4. External electrode

The external electrodes 4100, 4200, and 4000 may be provided on two surfaces of the stack body 1000 that are opposite to each other. For example, the external electrodes 4000 may be formed on opposite sides of the laminated body 1000 in the X direction, that is, the longitudinal direction. The external electrode 4000 may be connected to the internal electrode 200 and the discharge electrode 310 in the stacked body 1000. At this time, one of the external electrodes 4000 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 4100 may be connected to an internal circuit, and the second external electrode 4200 may be connected to a metal case. Further, the second external electrode 4200 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

The external electrode 4000 may be formed by various methods. That is, the external electrode 4000 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as vapor deposition, sputtering, and plating. On the other hand, the external electrode 4000 may be formed extending in the Y direction and the Z direction. That is, the external electrode 4000 may be formed extending from two surfaces opposed to each other in the X direction to four surfaces adjacent thereto. For example, when the conductive paste is immersed in the conductive paste, the external electrodes 4000 may be formed on both the front and rear surfaces in the Y direction as well as on the top and bottom surfaces in the Z direction as well as the two opposing sides in the X direction. On the other hand, when the electrodes are formed by printing, vapor deposition, sputtering, plating, or the like, the external electrodes 4000 may be formed on two surfaces in the X direction. That is, the external electrode 4000 may be formed on one side mounted on the printed circuit board and the other side connected to the metallic case, but also on other areas depending on the forming method or process conditions. The external electrode 4000 may be formed of an electrically conductive metal such as gold, silver, platinum, copper, nickel, palladium, or an alloy thereof. At least a part of the external electrode 4000 connected to the internal electrode 200 and the discharge electrode 310, that is, the internal electrode 200 and the discharge electrode 310 formed on at least one surface of the layered body 1000, A part of the external electrode 4000 to be connected may be formed of the same material as the internal electrode 200 and the discharge electrode 310. For example, when the internal electrode 200 and the discharge electrode 310 are formed using copper, at least a part of the external electrode 4000 may be formed from a region in contact with the internal electrode 200 and the discharge electrode 310 using copper. At this time, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by vapor deposition, sputtering, plating or the like. Preferably, the external electrode 4000 may be formed by plating. A seed layer may be formed on the upper and lower surfaces of the layered body 1000 to form the external electrode 4000 by a plating process, and then a plating layer may be formed from the seed layer to form the external electrode 4000. At least a part of the external electrode 4000 connected to the internal electrode 200 and the discharge electrode 310 may be the entire side surface of the laminated body 1000 in which the external electrode 4000 is formed, .

Further, the external electrode 4000 may further include at least one plating layer. The external electrode 4000 may be formed of a metal layer of Cu, Ag, or the like, and at least one plating layer may be formed on the metal layer. For example, the external electrode 4000 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, or a Cu plating layer, a Ni plating layer and a Sn plating layer may be laminated. The external electrode 4000 can be formed by mixing a multi-component glass frit containing, for example, 0.5% to 20% Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. At this time, the mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to the two sides of the laminate 1000. By including the glass frit in the external electrode 4000, the adhesion between the external electrode 4000 and the layered body 1000 can be improved, and the contact response of the electrodes inside the layered body 1000 can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the external electrode 4000. That is, the external electrode 4000 may be formed by forming a metal layer containing glass and at least one plating layer on the metal layer. For example, the external electrode 4000 may be formed by sequentially forming a Ni-plated layer and a Sn-plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu. At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. Of course, the external electrode 4000 may be formed of at least one plating layer only. That is, at least one plating layer may be formed using at least one plating process without applying the paste to form the external electrode 4000. [ On the other hand, the external electrode 5000 may be formed to a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 탆 to 10 탆 .

The external electrode 4000 may be formed to overlap with the internal electrode 200 connected to the external electrode 4000. For example, a portion of the first external electrode 4100 extending downward and upward from the stacked body 1000 may be formed to overlap with a predetermined region of the internal electrodes 200. A portion of the second external electrode 4200 extending to the lower and upper portions of the stacked body 1000 may be formed to overlap with a predetermined region of the internal electrodes 200. For example, portions of the external electrode 4000 extending to the upper and lower portions of the stacked body 1000 may be formed to overlap with the first and eighth internal electrodes 201 and 208. That is, at least one of the external electrodes 4000 may extend to the upper surface and the lower surface of the stack 1000, and at least one of the extended portions may be partially overlapped with the internal electrode 200. At this time, the area of the internal electrode 200 overlapping the external electrode 4000 may be 1% to 10% of the total area of the internal electrode 200. In addition, the external electrode 4000 can increase the area formed on at least one of the upper surface and the lower surface of the layered body 1000 by a plurality of processes.

A predetermined parasitic capacitance can be generated between the external electrode 4000 and the internal electrode 200 by overlapping the external electrode 4000 and the internal electrode 200. [ For example, a capacitance may be formed between the first and eighth internal electrodes 201 and 208 and the extension of the first and second external electrodes 4100 and 4200. Therefore, the capacitance of the complex protection device can be adjusted by adjusting the overlapping area of the external electrode 4000 and the internal electrode 200. However, since the capacitance of the complex protection element affects the antenna performance in the electronic device, the dispersion of the capacitance of the complex protection element is kept within 20%, preferably within 5%. For this purpose, the sheet 100 manufactured using a material having a high dielectric constant is used. However, as the dielectric constant of the sheet 100 increases, the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 4000 increases. That is, when the dielectric constant of the first and eleventh sheets 101 and 111 provided between the internal electrode 200 and the external electrode 4000 is high, parasitic capacitance is increased. However, since the permittivity of the first and eleventh sheets 101 and 111 located at the outermost positions is lower than that of the remaining sheets 102 to 110, the parasitic capacitance between the internal electrode 200 and the external electrode 4000 The effect can be reduced. That is, since the dielectric constants of the first and eleventh sheets 101 and 111 are low, the parasitic capacitance between the internal electrode 200 and the external electrode 4000 can be reduced.

5. Surface modification member

On the other hand, a surface modifying member (not shown) may be formed on at least one surface of the layered body 1000. The surface modification member may be formed by distributing an oxide, for example, on the surface of the layered body 1000 before the external electrode 600 is formed. Here, the oxide may be dispersed and distributed on the surface of the laminate 1000 in a crystalline state or an amorphous state. The surface modifying member may be distributed on the surface of the laminate 1000 before the plating process when the external electrode 600 is formed by a plating process. That is, the surface modifying member may be distributed before forming part of the external electrode 600 in the printing process, or may be distributed before the plating process after the printing process. Of course, in the case where the printing process is not performed, the plating process can be performed after distributing the surface modifying member. At this time, at least a part of the surface modification member distributed on the surface can be melted.

On the other hand, the surface modifying members may be evenly distributed on the surface of the laminate 1000 at least partially in the same size, and may be irregularly distributed at least in part in different sizes. Also, at least a part of the surface of the laminate 1000 may be provided with a recess. That is, at least a part of the region where the surface modifying member is formed and the convex portion is formed and the surface modifying member is not formed may be formed as a concave portion. At this time, at least a part of the surface modification member can be formed deeper than the surface of the layered body 1000. That is, the surface modifying member may be formed such that a predetermined thickness is embedded in a predetermined depth of the laminate 1000 and the remaining thickness thereof is higher than the surface of the laminate 1000. At this time, the thickness of the layered body 1000 may be 1/20 to 1 of the average diameter of the oxide particles. That is, the oxide particles can be embedded all within the laminate 1000, and at least a part thereof can be embedded. Of course, the oxide particles can be formed only on the surface of the laminate 1000. Therefore, the oxide particles may be formed hemispherically on the surface of the laminate 1000, or may be formed in a spherical shape. In addition, the surface modifying member may be partially distributed on the surface of the laminate 1000 as described above, and may be distributed in a film form in at least one region. That is, the oxide particles may be distributed in the form of islands on the surface of the layered body 1000 to form the surface modification member. That is, oxides in a crystalline state or an amorphous state may be spaced apart from each other on the surface of the layered body 1000 so that at least a part of the surface of the layered body 1000 may be exposed. Further, at least two or more of the surface modification members of the oxide may be connected to form a film in at least one region, and may be formed in an island form at least in part. That is, at least two oxide particles may aggregate or adjacent oxide particles may be connected to form a film. However, even when the oxide exists in a particle state, or when two or more particles are aggregated or connected, at least a part of the surface of the laminate 1000 is exposed to the outside by the surface modification member.

At this time, the total area of the surface modifying members may be, for example, 5% to 90% of the total area of the surface of the laminate 1000. If the surface modification member is formed too much, it is difficult to make contact between the conductive pattern inside the laminated body 1000 and the external electrode 400 . That is, when the surface modifying member is formed to be less than 5% of the surface area of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modifying member is formed in an amount exceeding 90% May not be in contact with each other. Therefore, it is preferable that the surface modifying member is formed to have an area that can control the spreading phenomenon of the plating and can contact the conductive pattern inside the laminate 1000 and the external electrode 400. For this purpose, the surface modifying member may be formed to 10% to 90% of the surface area of the laminate 1000, preferably 30% to 70%, more preferably 40% to 50% Area. At this time, the surface area of the laminated body 1000 may be a surface area of one surface or a surface area of six surfaces of the laminated body 1000 which forms a hexahedron. On the other hand, the surface modifying member may be formed to a thickness of 10% or less of the thickness of the laminate 1000. That is, the surface modifying member may be formed to a thickness of 0.01% to 10% of the thickness of the laminate 1000. For example, the surface modifying member may be present in a size of 0.1 mu m to 50 mu m, whereby the surface modifying member may be formed to a thickness of 0.1 mu m to 50 mu m from the surface of the laminate 1000. [ That is, the surface modifying member may be formed to a thickness of 0.1 占 퐉 to 50 占 퐉 from the surface of the layered product 1000, except for a region that is stuck to the surface of the layered product 1000. Therefore, if the thickness embedded in the laminated body 1000 is included, the surface modification member may have a thickness greater than 0.1 占 퐉 to 50 占 퐉. When the surface modification member is formed to a thickness of less than 0.01% of the thickness of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modification member is formed to a thickness exceeding 10% of the thickness of the laminate 1000, The inner conductive pattern and the outer electrode 400 may not be in contact with each other. That is, the surface modifying member may have various thicknesses depending on the material properties (conductive, semiconductive, insulating, magnetic material, etc.) of the layered body 1000 and may have various thicknesses depending on the size, have.

By forming the surface modifying member on the surface of the layered body 1000, at least two regions having different components may exist on the surface of the layered body 1000. That is, different components can be detected in the region where the surface modifying member is formed and the region where the surface modifying member is not formed. For example, an area where the surface modifying member is formed may have a component according to the surface modifying member, that is, an oxide, and an area where the area is not formed may have a component according to the laminate 1000, that is, a component of the sheet. By thus distributing the surface modifying member to the surface of the layered product 1000 before the plating process, the surface of the layered product 1000 can be modified by imparting roughness to the surface thereof. Therefore, the plating process can be performed uniformly, and thus the shape of the external electrode 600 can be controlled. That is, the surface of the layered product 1000 may have a resistance different from that of the other region in at least one region. If the plating process is performed while the resistance is uneven, the growth of the plating layer may be uneven. In order to solve such a problem, it is possible to modify the surface of the layered product 1000 and to control the growth of the plating layer by dispersing oxides in a particle state or a molten state on the surface of the layered product 1000 to form a surface modifying member have.

Here, the oxides in the particle state or in the molten state for making the surface resistance of the layered body 1000 uniform are, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ . On the other hand, the surface modification member may also be formed on at least one sheet in the laminate 1000. That is, the conductive patterns of various shapes on the sheet can be formed by a plating process, and the shape of the conductive pattern can be controlled by forming the surface modifying member.

FIG. 3 is a cross-sectional photograph of a composite protection device according to an embodiment of the present invention, and FIGS. 4 and 5 are photographs of surfaces of regions A and B of FIG. 4 is a photograph of the surface of the outer frame in the vertical direction, and Fig. 5 is a photograph of the surface of the central portion. Such a composite protective device is formed such that the outermost sheet in the vertical direction has a lower dielectric constant than the remaining sheets in between. A plurality of sheets is less, the content of BaTiO _3, NdTiO _3, Bi ₂ O _3, ZnO, TiO _2, etc. to form a mixture of substances in a predetermined ratio, including, the outermost sheet is BaTiO ₃ To this end, NdTiO ₃ and Bi ₂ O ₃ . Also, the sheets between the outermost sheets were formed by increasing the content of BaTiO ₃ and decreasing the content of NdTiO ₃ and Bi ₂ O ₃ . The remaining components were formed by controlling the amount of the other components. The component analysis tables of the A region and the B region of the composite protective device thus manufactured are shown in [Table 1] and [Table 2], respectively.

ingredient wt% at% O 6.65 31.40 Zn 4.57 5.28 Mg 0.68 2.11 Pt 9.47 3.66 Tc 6.51 5.01 Ba 24.21 13.31 Ti 15.39 24.25 Ce 0.00 0.00 Nd 19.95 10.44 Bi 12.56 4.54

ingredient wt% at% O 8.84 36.90 Zn 5.41 5.53 Mg 0.88 2.41 Pt 7/96 2.73 Tc 5.17 3.52 Ba 39.69 19.31 Ti 16.87 23.53 Ce 0.00 0.00 Nd 8.50 3.94 Bi 6.68 2.14

As can be seen from [Table 1] and [Table 2], it can be seen that the outer peripheral region in the vertical direction of the composite protective device has a smaller content of Ba or Ti than that of the central region and a larger content of Nd or Bi. Accordingly, it is possible to control the dielectric constant of the sheets by controlling the content of Ba, Ti, Nd and Bi, and to realize a composite protective device having a low dielectric constant of the outermost sheet according to the present invention and a high dielectric constant of the remaining sheets therebetween.

Meanwhile, the protective layer 320 of the present invention can be formed in various forms. Various embodiments of the protective layer 320 are shown in FIGS. 6 to 8. FIG.

6 is a cross-sectional schematic view and a cross-sectional view of the protective layer 320 according to the first embodiment of the composite protection device of the present invention. That is, the protective layer 320 may be formed to be smaller or larger in thickness than at least one region of the at least one region. FIG. 6 is a cross-sectional schematic view and a cross-sectional view of a portion of the protective layer 320.

As shown in FIG. 6 (a), the protective layer 320 may be formed of an insulating material. At this time, the insulating material may be a porous insulating material including a plurality of pores (not shown). That is, a plurality of pores (not shown) may be formed in the protective layer 320. By forming pores, overvoltage such as ESD can be more easily bypassed. In addition, the protective layer 320 may be formed by mixing a conductive material and an insulating material. For example, the protective layer 320 can be formed by mixing a conductive ceramic and an insulating ceramic. In this case, the protective layer 320 can be formed by mixing conductive ceramics and insulating ceramics at a mixing ratio of, for example, 10:90 to 90:10. As the blending ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the blending ratio of the conductive ceramic increases, the discharge starting voltage may be lowered. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted so that a predetermined discharge starting voltage can be obtained.

In addition, the protective layer 320 may be formed by laminating a conductive layer and an insulating layer in a predetermined laminated structure. That is, the protective layer 320 may be formed by laminating the conductive layer and the insulating layer at least once to divide the conductive layer and the insulating layer. For example, the protective layer 320 may have a two-layer structure in which a conductive layer and an insulating layer are stacked, and a conductive layer, an insulating layer, and a conductive layer may be stacked to form a three-layer structure. In addition, the conductive layers 321a and 321b (321) and the insulating layer 322 may be repeatedly laminated a plurality of times to form a laminate structure of three or more layers. For example, as shown in FIG. 6 (b), a protective layer 320 having a three-layer structure in which a first conductive layer 321a, an insulating layer 322, and a second conductive layer 321b are stacked is formed . On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the conductive layer may be located in the uppermost layer and the lowermost layer. At this time, a plurality of pores (not shown) may be formed in at least a part of the conductive layer 321 and the insulating layer 322. For example, since the insulating layer 322 formed between the conductive layers 321 is formed in a porous structure, a plurality of pores may be formed in the insulating layer 322.

Further, the protective layer 320 may be further formed with a void in a predetermined region. For example, a gap may be formed between the layer in which the conductive material and the insulating material are mixed, and a gap may be formed between the conductive layer and the insulating layer. That is, a first mixed layer of a conductive material and an insulating material, a cavity and a second mixed layer may be laminated, and a conductive layer, a cavity, and an insulating layer may be laminated. For example, the protective layer 320 may include a first conductive layer 321a, a first insulating layer 322a, a cavity 323, a second insulating layer 322b, And the second conductive layer 321b may be stacked. That is, the insulating layers 322a and 322b may be formed between the conductive layers 321a and 321b and the spaces 323 may be formed between the insulating layers 322. Of course, the protective layer 320 may be formed by repeatedly stacking the conductive layer, the insulating layer, and the pores. On the other hand, when the conductive layer 321, the insulating layer 322, and the void 323 are stacked, the thicknesses of all of them may be the same, and at least one of them may be thinner than the others. For example, the void 323 may be thinner than the conductive layer 321 and the insulating layer 322. [ The conductive layer 321 may have the same thickness as the insulating layer 322 or may be thicker or thinner than the insulating layer 322. Meanwhile, the void 323 can be formed by filling the polymer material and performing a sintering process to remove the polymer material. For example, a first polymer material including a conductive ceramic, a second polymer material including an insulating ceramic, and a third polymer material not including a conductive ceramic or an insulating ceramic are filled in a via hole and subjected to a sintering process By removing the polymer material, a conductive layer, an insulating layer, and voids can be formed. Meanwhile, the voids 323 may be formed without dividing the layers. For example, an insulating layer 322 may be formed between the conductive layers 321a and 321b, and a plurality of pores may be formed in the insulating layer 322 in the vertical direction or the horizontal direction to form the voids 323. That is, the void 323 may be formed as a plurality of pores in the insulating layer 322. Of course, the void 323 may be formed in the conductive layer 321 by a plurality of pores.

On the other hand, the conductive layer 321 used for the protective layer 320 may have a predetermined resistance and allow current to flow. For example, the conductive layer 321 may be a resistor having several ohms to several hundreds of M [Omega]. When the overvoltage is applied to the conductive layer 321 by ESD or the like, the energy level is lowered so that the structural damage of the complex protective device due to the overvoltage does not occur. That is, the conductive layer 321 serves as a heat sink for converting electric energy into heat energy. The conductive layer 321 may be formed using a conductive ceramic and the conductive ceramic may be a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Can be used. The conductive layer 321 can be formed to a thickness of 1 to 50 mu m. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 to 50 탆.

In addition, the insulating layer 322 used for the protective layer 320 may be formed of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a relative dielectric constant of about 50 to 50,000. For example, the insulating ceramics may be formed by using a dielectric material powder such as MLCC, a mixture containing at least one of ZrO 2, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn and Al ₂ O ₃ . The insulating layer 322 may be formed of a porous structure having a plurality of pores each having a size of 1 nm to 5 탆 and formed with a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 탆. That is, although the insulating layer 322 is formed of an electrically insulating material that can not conduct current, since pores are formed, a current can flow through the pores. At this time, as the size of the pores increases or the porosity increases, the discharge firing voltage may decrease. On the contrary, if the pore size decreases or the porosity decreases, the discharge firing voltage may increase. However, if the pore size exceeds 5 占 퐉 or the porosity exceeds 80%, it may be difficult to maintain the shape of the protective layer 320. Therefore, the pore size and the porosity of the insulating layer 322 can be adjusted to adjust the discharge starting voltage while maintaining the shape of the protective layer 320. On the other hand, if the protective layer 320 is formed of a mixed material of an insulating material and a conductive material, the insulating material may be an insulating ceramic having micropores and porosity. Further, the insulating layer 322 has resistance lower than the resistance of the sheet due to the micropores, and partial discharge can be performed through the micropores. That is, the insulating layer 322 is formed with micro-pores and partially discharged through the micro-pores. The insulating layer 322 may be formed to a thickness of 1 占 퐉 to 50 占 퐉. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to 1 占 퐉 to 50 占 퐉.

7 is a schematic cross-sectional view of a protective layer 320 according to a second embodiment of the composite protection device of the present invention. That is, the protective layer 320 may include the void 323 as shown in FIG. 7 (a). That is, the protective layer 320 may be formed with voids 323 without filling with an overvoltage protective material in the openings formed through the sheet. In addition, the protective layer 320 may be formed with a porous insulating material in at least one region of the through-hole. That is, as shown in FIG. 7 (b), a porous insulating material may be applied to the side wall of the through hole to form the insulating layer 322, and as shown in FIG. 7 (c) The insulating layers 322a, 322b, and 322 may be formed on at least one of the insulating layers 322a and 322b.

8, a protection layer 320 is formed between the discharge electrodes 311, 312, 310 and the protective layer 320, as shown in FIG. 8, according to a third embodiment of the present invention. And a discharge inducing layer 330 formed between the first and second layers 320 and 320. That is, a discharge induction layer 330 may be further formed between the discharge electrode 310 and the protective layer 320. At this time, the discharge electrode 310 may include the conductive layers 311a and 312a and the porous insulating layers 311b and 312b formed on at least one surface of the conductive layers 311a and 311a. Of course, the discharge electrode 310 may be a conductive layer having no porous insulating layer formed on its surface.

The discharge induction layer 330 may be formed when the protective layer 320 is formed using a porous insulating material. At this time, the discharge induction layer 330 may be formed of a dielectric layer having a higher density than the protective layer 320. That is, the discharge induction layer 330 may be formed of a conductive material or an insulating material. For example, when the protective layer 320 is formed using porous ZrO 2 and the internal electrode 200 is formed using Al, a discharge induction layer 330 made of AlZrO is formed between the protective layer 320 and the discharge electrode 310 May be formed. On the other hand, TiO may be used instead of ZrO as the protective layer 320, and in this case, the discharge inducing layer 330 may be formed of TiAlO. That is, the discharge inducing layer 330 may be formed by the reaction between the discharge electrode 310 and the protective layer 320. Of course, the discharge inducing layer 330 can be formed by further reacting the sheet material. In this case, the discharge inducing layer 330 can be formed by the reaction of an internal electrode material (for example, Al), a protective material (for example, ZrO 2), and a sheet material (for example, BaTiO ₃ ). In addition, the discharge inducing layer 330 may be formed by reacting with the sheet material. That is, the discharge inducing layer 330 may be formed by the reaction between the protective layer 320 and the sheet in a region where the protective layer 320 contacts the sheet. Accordingly, the discharge inducing layer 330 may be formed so as to surround the protective layer 320. At this time, the discharge induction layer 330 between the protective layer 320 and the discharge electrode 310, the protective layer 320, and the discharge induction layer 330 between the sheets may have different compositions. Meanwhile, the discharge inducing layer 330 may be formed by removing at least one region, and may be formed differently from at least one region having a different thickness. That is, the discharge induction layer 330 may be discontinuously formed by removing at least one region, and the thickness of the discharge induction layer 330 may be non-uniformly formed in at least one region different in thickness. The discharge induction layer 330 may be formed during the baking process. That is, the discharge inducing layer 330 may be formed between the discharge electrode 310 and the protective layer 320 by mutually diffusing the discharge electrode material, the ESD protective material, and the like during the firing process at a predetermined temperature. On the other hand, the discharge inducing layer 330 may be formed to a thickness of 10% to 70% of the thickness of the protective layer 320. That is, a part of the thickness of the protective layer 320 may be changed into the discharge inducing layer 330. Accordingly, the discharge inducing layer 330 may be formed thinner than the protective layer 320, and may be thicker, thinner, or thinner than the discharge electrode 310. The level of the discharge energy of the ESD voltage induced in the protective layer 320 can be lowered by the discharge inducing layer 330. Therefore, the discharge efficiency can be improved by discharging the ESD voltage more easily. In addition, since the discharge inducing layer 330 is formed, it is possible to prevent diffusion of heterogeneous materials into the protective layer 320. That is, diffusion of the sheet material and the internal electrode material into the protective layer 320 can be prevented, and external diffusion of the overvoltage protective material can be prevented. Accordingly, the discharge inducing layer 330 can be used as a diffusion barrier, thereby preventing the protection layer 320 from being broken. Meanwhile, the protective layer 320 may further include a conductive material. In this case, the conductive material may be coated with an insulating ceramic. 6A, when the protective layer 320 is formed by mixing a porous insulating material and a conductive material, the conductive material may be coated using NiO, CuO, WO, or the like . Accordingly, the conductive material can be used as the material of the protective layer 320 together with the porous insulating material. When a conductive material other than a porous insulating material is further used for the protective layer 320, for example, two conductive layers 321a and 321b are formed as shown in FIGS. 6 (b) and 6 (c) The discharge inducing layer 330 may be formed between the conductive layer 321 and the insulating layer 322. In this case, Meanwhile, the discharge electrode 310 may be formed in a shape in which a part of the area is removed. That is, the discharge electrode 310 may be partially removed and the discharge inducing layer 330 may be formed in the removed region. However, even if the discharge electrode 310 is partially removed, the electric characteristics are not deteriorated because it maintains a generally connected shape in plan view.

The discharge electrode 310 may be formed of a metal or a metal alloy on which an insulating layer is formed. That is, the discharge electrode 310 may include the conductive layers 311a and 312a and the porous insulating layers 311b and 312b formed on at least one surface of the conductive layers 311a and 312a. At this time, the porous insulating layers 311b and 312b may be formed on at least one surface of the discharge electrode 310. That is, the protective layer 320 may be formed only on one surface that does not contact with the protective layer 320 and on another surface that is in contact with the protective layer 320, . Also, the porous insulating layers 311b and 312b may be formed on at least one surface of the conductive layers 311a and 312a, or may be formed on at least a part of the conductive layers 311a and 312a. At least one region of the porous insulating layers 311b and 312b may be removed or formed to have a small thickness. That is, the porous insulating layers 311b and 312b may not be formed in at least one region on the conductive layers 311a and 312a, and the thickness of at least one region may be thinner or thicker than the thickness of the other regions. In this discharge electrode 310, an oxide film is formed on the surface during firing, and the inside can be formed of Al which maintains conductivity. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the internal electrode 200 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used.

Meanwhile, one embodiment of the present invention is formed by embedding or applying an overvoltage protection material in a through hole formed in a sheet 106 of a protective layer 320. However, the protective layer 320 may be formed in a predetermined region of the sheet, and the discharge electrode 310 may be formed to contact the protective layer 320, respectively. 9, two discharge electrodes 311 and 312 are formed on the sheet 105 so as to be spaced apart from each other by a predetermined distance in the horizontal direction, and a protective layer 313 is formed between the two discharge electrodes 311 and 312. In this case, (320) may be formed.

The protection unit 3000 includes at least two discharge electrodes 311 and 312 formed on the same plane and at least one ESD protection layer 320 provided between the at least two discharge electrodes 311 and 312 . That is, two discharge electrodes 311 and 312 may be provided in the direction in which the external electrode 4000 is formed, that is, in the X direction, so as to be spaced apart from each other in a predetermined region of the sheet, Two or more discharge electrodes (not shown) may be further provided. Accordingly, at least one discharge electrode may be formed in a direction perpendicular to the direction in which the external electrode 4000 is formed, and at least one discharge electrode may be formed so as to face the discharge electrode at predetermined intervals. For example, as shown in FIG. 9, the protection unit 3000 includes a fifth sheet 105, first and second discharge electrodes 311 and 312 formed on the fifth sheet 105, And a protective layer 320 formed on the fifth sheet 105. Here, the protective layer 320 may be formed so that at least a portion thereof is connected to the first and second discharge electrodes 311 and 312. The first discharge electrode 311 is connected to the external electrode 4100 and is formed on the fifth sheet 105 and the end portion is connected to the protective layer 320. The second discharge electrode 312 is connected to the external electrode 4200 to be spaced apart from the first discharge electrode 311 on the fifth sheet 105 and has a distal end connected to the passivation layer 320. The protective layer 320 may be formed to be connected to the first and second discharge electrodes 311 and 312 at a predetermined region of the fifth sheet 105, for example, a central portion thereof. At this time, the protective layer 320 may be partially overlapped with the first and second discharge electrodes 311 and 312. The protective layer 320 may be formed on the exposed fifth sheet 105 between the first and second discharge electrodes 311 and 312 and connected to the side surfaces of the first and second discharge electrodes 311 and 312 . In this case, since the protection layer 320 may be separated from the first and second discharge electrodes 311 and 312 without being in contact with the first and second discharge electrodes 311 and 312, the ESD protection layer 320 ) Is preferably formed. Even when the discharge electrode 310 and the protective layer 320 are formed on the same plane, the external electrode 4000 is formed to overlap at least part of the internal electrode 200, and the outermost sheet, that is, The sheets 101 and 110 may be formed to have a lower permittivity than the remaining sheets, that is, the second to ninth sheets 102 to 109 therebetween.

The composite protection device according to the embodiments of the present invention as described above may be provided between the metal case 10 of the electronic device and the internal circuit 20 as shown in FIG. That is, one of the external electrodes 4000 may be connected to the ground terminal, and the other one may be connected to the metal case 10 of the electronic device. At this time, the ground terminal may be provided in the internal circuit 20. [ For example, the first external electrode 4100 may be connected to the ground terminal, and the second external electrode 4200 may be connected to the metal case 10. 11, a contact portion 30 may be further provided between the second external electrode 4200 and the metal case 10 using a conductive member such as a contactor or a conductive gasket. Accordingly, the electrostatic voltage transmitted from the ground terminal of the internal circuit 20 to the metal case 10 can be cut off, and the overvoltage such as ESD applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, in the composite protection device of the present invention, current does not flow between the external electrodes 4000 at the rated voltage and the electrostatic voltage, and current flows through the protection layer 320 at the ESD voltage, thereby bypassing the overvoltage to the ground terminal. On the other hand, the composite protection device may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the composite protection device may have a rated voltage of 100 V to 240 V, and the electrostatic voltage may be equal to or higher than the operating voltage of the circuit, and the ESD voltage generated by external static electricity or the like may be higher than the electrostatic voltage. In addition, a communication signal from the outside, that is, an AC frequency, can be transmitted to the internal circuit 20 by a capacitor formed between the internal electrodes 200. Therefore, even when a separate antenna is not provided and the metal case 10 is used as an antenna, a communication signal can be received from the outside. As a result, the composite protection device according to the present invention can interrupt the electric voltage, bypass the ESD voltage to the ground terminal, and apply the communication signal to the internal circuit.

A composite protection device according to an embodiment of the present invention includes a plurality of sheets having a high withstand voltage characteristic formed by stacking a plurality of sheets to form a main body 100 so that the internal circuit 20, The protection layer 320 can also bypass the overvoltage when the overvoltage is input from the metal case 10 to the internal circuit 20 to prevent the breakdown of the device, A high insulation resistance state can be maintained. In other words, the protective layer 320 includes a porous insulating material that has a porous structure and allows electric current to flow through micropores, and further includes a conductive material that converts electric energy into thermal energy by lowering the energy level, Can be bypassed to protect the circuit. Therefore, it is prevented from being insulated by the overvoltage, and accordingly, it is provided in the electronic apparatus having the metal case 10 to continuously prevent the electric shock voltage generated in the defective charger from being transmitted to the user through the metal case 10 of the electronic apparatus can do. On the other hand, a general MLCC (Multi Layer Capacitance Circuit) protects the electrostatic voltage but is vulnerable to ESD. When repeated ESD is applied, spark occurs due to leakage point due to charge, A phenomenon may occur. However, according to the present invention, at least a part of the main body 100 is not destroyed by passing the overvoltage through the protective layer 320 by forming the protective layer 320 including the porous insulating material between the internal electrodes 200.

A predetermined parasitic capacitance can be generated between the external electrode 4000 and the internal electrode 200 by overlapping the external electrode 4000 and the internal electrode 200. The external electrode 4000 and the internal electrode 200 The capacitance of the composite protection device can be adjusted. However, since the capacitance of the composite protection element affects the performance of the antenna in the electronic device, the sheet 100 having a high dielectric constant is used in order to keep the scattering of the capacitance of the composite protection element preferably within 5%. Therefore, the higher the dielectric constant of the sheet 100, the greater the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 4000. However, since the dielectric constant of the outermost sheet is lower than the dielectric constant of the remaining sheets, the influence of the parasitic capacitance between the internal electrode 200 and the external electrode 4000 can be reduced.

The present invention has been described taking an example of a complex protection device that is provided in an electronic device of a smart phone and protects the electronic device from overvoltage such as ESD applied from the outside and protects the user by blocking leakage current from the inside of the electronic device. However, the composite protection device of the present invention is provided in various electric and electronic devices other than the smart phone, and can perform more than two protection functions.

As shown in FIG. 11, a contact portion 30 may be provided between the metal case 10 and the composite protection device so as to be in electrical contact with the metal case 10 and have elasticity. That is, the contact portion 30 and the complex protection device according to the present invention may be provided between the metal case 10 and the internal circuit 20 of the electronic device. The contact portion 30 may be made of a material including an electrically conductive material having an elastic force so as to mitigate the impact when an external force is applied from the outside of the electronic device. Such a contact portion 30 may be, for example, a clip shape as shown in FIG. 12, or may be a conductive gasket as shown in FIG. Also, at least one region of the contact portion 30 may be mounted on the internal circuit 20, for example, a PCB. A composite protection device including the contact portion 30 will be described with reference to FIGS. 12 and 13. FIG.

12 and 13 are cross-sectional views of a composite protection device according to a modification of an embodiment of the present invention, in which a composite protection element is provided between the metal case 10 and the internal circuit 20, A contact portion 5100 having a clip shape or a contact portion 5200 using a conductive material layer may be provided on the electrode 4200 as shown in Figs. 12 and 13, respectively. The contact portions 5100 and 5200 are made of a material having elasticity and containing a conductive material so as to mitigate the impact when an external force is applied from the outside of the electronic device. The first external electrode 4100 of the composite protection element may be provided in contact with the internal circuit 20 and a metallic layer such as stainless steel may be further provided between the internal circuit 20 and the first external electrode 4100 .

As shown in FIG. 12, the contact portion 5100 may be in the form of a clip. The clip-shaped contact portion 5100 includes a support portion 5110 provided on the composite protective element, a contact portion 5110 provided on the upper portion of the support portion 5110 and opposed to the conductor such as a metal case, And a connection portion 5130 provided between one side of the support portion 5110 and the contact portion 5120 and having an elastic force to connect the support portion 5120 and the contact portion 5120. Here, the connection portion 5130 is formed to connect one end of the support portion 5110 and one end of the contact portion 5120, and may be formed to have a curvature. That is, when the connection portion 5130 is pressed by an external force, the circuit board 20 is pressed in a direction in which the circuit board 20 is positioned, and has an elastic force that is restored to its original state when the external force is released. Therefore, at least the connection portion 5130 of the contact portion 5100 may be formed of a metal material having an elastic force.

Further, the contact portion of the present invention may include a conductive rubber, a conductive silicone, an elastic body having a conductive wire inserted therein, and a gasket whose surface is coated or bonded with a conductor, in addition to a conductive and elastic clip. That is, as shown in FIG. 13, the contact portion 5200 may include a conductive material layer. For example, in the case of a conductive gasket, the inside may be made of a nonconductive elastomer and the outside may be coated with a conductive material. The conductive gasket may include an insulative elastic core having a through hole formed therein, though not shown, and a conductive layer formed to surround the insulative elastic core. The insulative elastic core may be formed in a tube shape having a through hole formed therein, and may have a substantially rectangular or circular cross section, but may be formed in various shapes without being limited thereto. For example, the insulated elastic core may not have a through hole formed therein. Such an insulative elastic core may be formed of silicone, elastic rubber or the like. The conductive layer may be formed to surround the insulative elastic core. Such a conductive layer may be formed of at least one metal layer, for example, gold, silver, copper, or the like. On the other hand, the conductive powder may be mixed in the elastic core without forming the conductive layer.

The present invention is not limited to the above-described embodiments, but may be embodied in various forms. In other words, the above-described embodiments are provided so that the disclosure of the present invention is complete, and those skilled in the art will fully understand the scope of the invention, and the scope of the present invention should be understood by the appended claims .

1000: laminate 2000: capacitor part
3000: Protection part 4000: External electrode

Claims (12)

A laminated body in which a plurality of sheets are laminated;
A plurality of internal electrodes formed in the laminate;
An overvoltage protector formed on at least a portion of the sheet; And
And an external electrode provided outside the laminated body and connected to the internal electrode and the overvoltage protection unit,
Wherein the relative dielectric constant of the sheet provided between the outer electrode and the outermost inner electrode is 100 or less and the relative dielectric constant of the remaining sheet is 500 or more.
The composite protection device according to claim 1, wherein the overvoltage protection portion includes at least two discharge electrodes and at least one overvoltage protection layer provided between the discharge electrodes.
The composite protection device according to claim 2, wherein the overvoltage protection layer comprises at least one of porous insulating material, conductive material, and air gap.
The composite protective device of claim 2, wherein the inner electrode adjacent to the discharge electrode is connected to the same outer electrode.
The composite protection device of claim 2, wherein the internal electrode adjacent to the discharge electrode is connected to another external electrode.
The composite protection device of claim 1, wherein at least one of the plurality of internal electrodes is formed to have a length different from that of the other internal electrodes.
The composite protection device according to claim 1, wherein the external electrode is different from a region having a different thickness in at least one region.
The composite protection device according to claim 1, wherein the external electrode extends on at least one of the lowermost layer and the uppermost layer sheet of the laminate and is partially overlapped with the outermost internal electrode.
[Claim 9] The composite protection device of claim 8, wherein the outermost internal electrode has a region overlapping with the external electrode.
The composite protection device according to claim 1, wherein the sheet provided between the outer electrode and the outermost inner electrode has a lower content of Ba or Ti than the remaining sheet.
The composite protection device according to claim 1, wherein the sheet provided between the outer electrode and the outermost inner electrode has a higher Nd or Bi content than the remaining sheet.
An electronic device comprising the composite protection element according to any one of claims 1 to 11,
Wherein the composite protection element is provided between a conductor capable of being contacted by a user and an internal circuit, thereby blocking an electric shock voltage and bypassing an overvoltage.

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