KR20170126840A - Laminated device and electronic device having the same - Google Patents

Abstract

The present invention suggests a laminated device and an electronic device having the same. The laminated device includes a laminated body where a plurality of insulating sheets are laminated; a capacitor part including a plurality of internal electrodes formed in the laminated body; an ESD protection part formed on at least a part of the insulating sheet to protect an ESD voltage; and an external electrode provided on at least two sides of the laminated body and connected to the capacitor part and the ESD protection part. The ESD protection part includes at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes. One of the external electrodes is connected to the metal case of an electronic device. The other one is connected to a ground terminal to cut off an electric shock voltage and bypass the ESD voltage. It is possible to prevent the electric shock of a user.

Description

[0001] LAMINATED DEVICE AND ELECTRONIC DEVICE HAVING THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a stacked device, and more particularly to a stacked device capable of preventing an electrostatic voltage from being transmitted to a user through a chargeable electronic device such as a smart phone.

The use of the mobile communication terminal has evolved from the center of the voice communication in the past to the service of the life-like service based on the smartphone through the data communication service. In addition, various frequency bands have been used in accordance with the multifunctionality of smart phones and the like. That is, a plurality of functions using different frequency bands such as wireless LAN (wireless LAN), bluetooth, and GPS are adopted in one smartphone. In addition, due to the high integration of electronic devices, the internal circuit density in a limited space is increased, thereby causing noise interference between internal circuits inevitably. A plurality of circuit protection devices are used to suppress noise at various frequencies of a portable electronic device and to suppress noise between internal circuits. For example, a capacitor, a chip bead, a common mode filter, or the like that removes noise in different frequency bands are used.

Meanwhile, in recent years, as the image and durability of smart phones have been emphasized, the spread of terminals using metal materials is increasing. That is, the spread of smart phones having a frame made of metal or a case made of metal except the screen display portion on the front is increasing.

However, if a smartphone using a metal case is charged while using a non-genuine charger, an electric shock may occur. That is, a shock current is generated by charging using a non-genuine charger or a defective charger that does not incorporate an over-current protection circuit or a low-quality device, and this shock current is conducted to the ground terminal of the smart phone, So that a user who is in contact with the metal case can be electrically charged.

Korean Patent No. 10876206

The present invention provides a stacked element that is provided in an electronic device such as a smart phone and can prevent a user from being charged by a shock current input from a charger.

The present invention provides a stacked device that is not dielectric-breakable by ESD (ElectroStatic Discharge).

According to one aspect of the present invention, a stacked element includes: a stacked body including a plurality of insulating sheets stacked; A capacitor unit including a plurality of internal electrodes formed in the laminate; An ESD protection part formed on at least a part of the insulating sheet to protect the ESD voltage; And an external electrode provided on at least two sides of the stacked body and connected to the capacitor unit and the ESD protection unit, wherein the ESD protection unit includes at least two discharge electrodes, at least one ESD protection One of the external electrodes is connected to the metal case of the electronic device and the other is connected to the ground terminal to cut off the electrostatic voltage and bypass the ESD voltage.

The ESD protection layer includes at least one of a porous insulating material, a conductive material, and an air gap, and the air gap is formed by connecting at least two pores of the adjacent insulating material.

The electrostatic voltage is equal to or lower than the discharge start voltage, and the ESD voltage is equal to or higher than the discharge start voltage.

The discharge electrode and the ESD protection layer are formed on different planes or on the same plane.

The inner electrodes adjacent to the discharge electrodes are connected to the same outer electrode or connected to different outer electrodes.

Wherein A is a distance between the discharge electrode and the adjacent inner electrode, A is a distance between the discharge electrodes, and C is a distance between the inner electrodes.

D1 " and " D2 " are equal to or different from each other when the thicknesses of the lowermost and uppermost insulating sheets are D1 and D2, respectively.

The external electrode extends to at least one of an upper portion and a lower portion of the laminate and is partially overlapped with the internal electrode.

An electronic apparatus according to another aspect of the present invention includes a stacked element provided between a metal case and an internal circuit to block an ESD voltage and bypass an ESD voltage, the stacked element comprising: a stacked body including a plurality of stacked insulating sheets; A capacitor unit including a plurality of internal electrodes formed in the laminate; An ESD protection part formed on at least a part of the insulating sheet and including at least two discharge electrodes and at least one ESD protection layer; And an external electrode provided on at least two sides of the laminated body and connected to the capacitor unit and the ESD protection unit.

The inner electrodes adjacent to the discharge electrodes are connected to the same outer electrode or connected to different outer electrodes.

The external electrode extends to at least one of an upper portion and a lower portion of the laminate and is partially overlapped with the internal electrode.

Wherein A is a distance between the discharge electrode and the adjacent inner electrode, A is a distance between the discharge electrodes, and C is a distance between the inner electrodes.

D1 " and " D2 " are equal to or different from each other when the thicknesses of the lowermost and uppermost insulating sheets are D1 and D2, respectively.

The ESD protection device as a stacked type device according to embodiments of the present invention includes an ESD protection part, and the ESD protection part has a porous structure, and includes an insulating layer that allows a current to flow through the micropores, thereby bypassing the ESD, State can be maintained. Therefore, the ESD protection device is provided between the metal case and the internal circuit of the electronic device to interrupt the ESD voltage, bypass the ESD voltage to the ground terminal, prevent the ESD from destroying the ESD, Can be prevented from being transmitted to the user through the metal case of the electronic apparatus.

Also, the external electrode may be formed to overlap at least a part of the internal electrode with a predetermined region. Therefore, a predetermined parasitic capacitance can be generated between the external electrode and the internal electrode, and the capacitance of the electrostatic discharge protection element can be adjusted by adjusting the overlapping area of the external electrode and the internal electrode.

An internal electrode of the capacitor portion adjacent to the discharge electrode of the ESD protection portion may be connected to the same external electrode. Therefore, it is possible to prevent the ESD voltage from being applied even if the insulation sheet breaks down.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an anti-electrostatic device as a laminate type device according to a first embodiment of the present invention; FIG.
FIG. 2 is a cross-sectional view taken along the line AA 'in FIG. 1; FIG.
3 is an equivalent circuit diagram of an electric shock preventing device according to the first embodiment of the present invention.
FIGS. 4 and 5 are cross-sectional and cross-sectional photographs of an ESD protection layer of an anti-shock device according to embodiments of the present invention. FIG.
6 is a sectional view of an electric shock preventing device according to a second embodiment of the present invention.
7 is a sectional view of an electric shock preventing device according to a third embodiment of the present invention;
8 to 14 are schematic views of an electric shock preventive device according to a fourth embodiment of the present invention and its modifications.
15 to 18 are sectional views of an electric shock preventing device according to a fifth embodiment of the present invention.
19 to 22 are sectional views of an electric shock preventing device according to the sixth embodiment of the present invention.
23-26 illustrate discharge firing voltages according to various experimental examples of an ESD protection layer of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely.

Fig. 1 is a perspective view of an anti-static device as a laminate device according to a first embodiment of the present invention, Fig. 2 is a sectional view taken in one direction (X direction) of Fig. 1, and Fig. 3 is an equivalent circuit diagram.

1 to 3, an anti-shock device according to a first embodiment of the present invention includes a stacked body 1000 in which a plurality of insulating sheets 100 to 101 to 111 are stacked, And at least one capacitor unit 2000 and 4000 having a plurality of internal electrodes 200 to 201 and at least one discharge electrode 310 and an ESD protection layer 320, And a protection unit 3000. For example, the stacked body 1000 may include first and second capacitor units 2000 and 4000, and an ESD protection unit 3000 may be provided therebetween. That is, the first capacitor unit 2000, the ESD protection unit 3000, and the second capacitor unit 4000 are stacked in the stacked body 1000 to realize the anti-electrostatic device. The ESD protection unit 3000 further includes external electrodes 5100, 5200, 5000 formed on two opposite sides of the stack 1000 to be connected to the first and second capacitor units 2000, 4000 and the ESD protection unit 3000 can do. Of course, the ESD device may include at least one capacitor portion and at least one ESD protection portion. That is, the capacitor unit may be provided on either the lower side or the upper side of the ESD protection unit 3000, and at least one capacitor unit may be provided on the upper and lower sides of the two or more ESD protection units 3000 spaced from each other. Such an anti-shock device is provided between the internal circuit of the electronic device, for example, between the PCB and the metal case to block the electric voltage, bypass the ESD voltage, and prevent the insulation from being broken by ESD, .

The stacked body 1000 is formed by stacking a plurality of insulating sheets 101 to 111 (100). The stacked body 1000 has a predetermined length in one direction (for example, the X direction) and the other direction (for example, the Y direction) orthogonal thereto and has a predetermined length in the vertical direction As shown in Fig. That is, when the forming direction of the external electrode 5000 is the X direction, the direction orthogonal to the horizontal direction may be the Y direction and the vertical direction may be the Z direction. Here, the length in the X direction may be longer than the length in the Y direction and the length in the Z direction, and the length in the Y direction may be equal to or different from the length in the Z direction. When the lengths in the Y direction and the Z direction are different, the length in the Y direction may be shorter or longer than the length in the Z direction. For example, the ratio of the length in the X, Y and Z directions may be 2: 5: 1: 0.5 to 1. That is, the length in the X direction may be about 2 to 5 times longer than the length in the Y direction with respect to the length in the Y direction, and the length in the Z direction may be 0.5 to 1 time longer than the length in the Y direction. However, the lengths in the X, Y, and Z directions can be variously changed according to the internal structure of the electronic device to which the discharge sensing device is connected, the shape of the discharge sensing device, and the like. At least one capacitor unit 2000 and 4000 and at least one ESD protection unit 3000 may be provided in the stacked body 1000. For example, the first capacitor unit 2000, the ESD protection unit 3000, and the second capacitor unit 4000 may be provided in the lamination direction of the sheet 100, that is, the Z direction. The plurality of insulating sheets 100 may have a predetermined dielectric constant, for example, a dielectric constant of 10 to 20,000. The insulating sheet 100 may be formed of a material including at least one of dielectric material powder such as MLCC, BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , Bi ₂ O ₃ , ZnO, and Al ₂ O ₃ have. In addition, the plurality of insulating sheets 100 may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others. That is, the insulation sheet of the ESD protection unit 3000 may be formed to have a different thickness from the insulation sheet of the first and second capacitor units 2000 and 4000, and the ESD protection unit 3000 and the first and second capacitors 2000, and 4000 may be formed to have a thickness different from that of the other sheets. For example, the thickness of the insulating sheet between the ESD protection unit 3000 and the first and second capacitor units 2000 and 4000, that is, the fifth and seventh insulating sheets 105 and 107, The insulating sheets 102 to 104 and 108 to 110 between the internal electrodes of the first and second capacitor units 2000 and 4000 are formed to be thinner than the insulating sheet of the first and second capacitor units 2000 and 4000, It may be formed to be thin or the same thickness. That is, the gap between the ESD protection unit 3000 and the first and second capacitor units 2000 and 4000 may be formed to be thinner or equal to the gap between the internal electrodes of the first and second capacitor units 2000 and 4000, The thickness of the ESD protection part 3000 may be less than or equal to the thickness of the ESD protection part 3000. Of course, the insulating sheets 102 to 104 and 108 to 110 of the first and second capacitors 2000 and 4000 may be formed to have the same thickness, and either one of them may be thinner or thicker than the other. On the other hand, the insulating sheets 100 may be formed to have a thickness that is not broken when ESD is applied, for example, a thickness of 5 to 300 탆. The stacked body 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided at the lower portion and the upper portion of the first and second capacitor portions 2000 and 4000, respectively. Of course, the first insulating sheet 101 may function as a lower cover layer and the eleventh insulating sheet 111 may function as an upper cover layer. The lower and upper cover layers may be formed by stacking a plurality of magnetic material sheets, and may have the same thickness. Here, a nonmagnetic sheet, for example, a sheet of glassy material, may be further formed on the outermost portions of the lower and upper cover layers, i.e., the lower and upper surfaces of the magnetic sheet. Further, the lower and upper cover layers may be thicker than the inner insulating sheets, i.e., the second to tenth insulating sheets 102 to 110. Therefore, when the first and eleventh insulating sheets 101 and 111 function as lower and upper cover layers, they may be formed thicker than the second to tenth insulating sheets 102 to 110. [

The first capacitor unit 2000 may be provided on the lower side of the ESD protection unit 3000 and may include at least two internal electrodes and at least two insulating sheets provided therebetween. For example, the first capacitor unit 2000 includes first to fourth insulating sheets 101 to 104, first to fourth internal electrodes 201 to 204 formed on the first to fourth insulating sheets 101 to 104, respectively, 204). The first to fourth internal electrodes 201 to 204 may be formed to have a thickness of 1 占 퐉 to 10 占 퐉, for example. Here, the first to fourth inner electrodes 201 to 204 are connected to the outer electrodes 5100, 5200, and 5000 formed to face each other in the X direction, and the other is connected to the other. The first and third internal electrodes 201 and 203 are formed on the first and third insulating sheets 101 and 103 to have a predetermined area and one side is connected to the first external electrode 5100, And is spaced apart from the external electrode 5200. The second and fourth internal electrodes 202 and 204 are formed on the second and fourth insulating sheets 102 and 104 to have a predetermined area and one side is connected to the second external electrode 5200, And is spaced apart from the electrode 5100. That is, the first to fourth internal electrodes 201 to 204 are alternately connected to any one of the external electrodes 5000, and are formed so as to overlap the predetermined region through the second to fourth insulating sheets 202 to 204 . At this time, the first to fourth internal electrodes 201 and 204 are formed in an area of 10% to 85% of the area of each of the first to fourth insulation sheets 101 to 104, respectively. In addition, the first to fourth internal electrodes 201 to 204 are formed so as to overlap with an area of 10% to 85% of the area of each of the electrodes. Meanwhile, the first to fourth internal electrodes 201 to 204 may be formed in various shapes such as a square shape, a rectangular shape, a predetermined pattern shape, a spiral shape having a predetermined width and an interval, and the like. The capacitance of the first capacitor unit 2000 is formed between the first to fourth internal electrodes 201 to 204. The capacitance of the first capacitor unit 2000 is determined by the overlapping area of the first to fourth internal electrodes 201 to 204, The thicknesses of the first and second substrates 101 to 104, and the like. The first capacitor unit 2000 further includes at least one internal electrode formed in addition to the first through fourth internal electrodes 201 through 204, and at least one insulating sheet having at least one internal electrode formed thereon It is possible. In addition, the first capacitor unit 2000 may have two internal electrodes. That is, although the present embodiment has been described by way of example in which four internal electrodes of the first capacitor 2000 are formed, two or more internal electrodes may be formed.

The ESD protection unit 3000 includes at least two discharge electrodes 310 and 311 and 312 formed in the vertical direction and at least one ESD protection layer 320 provided between the at least two discharge electrodes 310 . For example, the ESD protection unit 3000 includes the fifth and sixth insulating sheets 105 and 106, first and second discharge electrodes 311 and 312 formed on the fifth and sixth insulating sheets 105 and 106, respectively. , 312 and an ESD protection layer 320 formed through the sixth insulating sheet 106. [ Here, the ESD protection layer 320 may be formed so that at least a part of the ESD protection layer 320 is connected to the first and second discharge electrodes 311 and 312. The first and second discharge electrodes 311 and 312 may have the same thickness as the internal electrodes 200 of the capacitor units 2000 and 4000. For example, the first and second discharge electrodes 311 and 312 can be formed to a thickness of 1 m to 10 m. However, the first and second discharge electrodes 311 and 312 may be thinner or thicker than the internal electrodes 200 of the capacitor units 2000 and 4000. The first discharge electrode 311 is connected to the first external electrode 5100 and is formed on the fifth insulating sheet 105 and the end portion is connected to the ESD protection layer 320. The second discharge electrode 312 is connected to the second external electrode 5200 and is formed on the sixth insulating sheet 106 and has a distal end connected to the ESD protection layer 320. Here, the region of the first and second discharge electrodes 311 and 312 that is in contact with the ESD protection layer 320 may be the same size or smaller than the ESD protection layer 320. Also, the first and second discharge electrodes 311 and 312 may be formed to be completely overlapped with each other without leaving the ESD protection layer 320. That is, the edges of the first and second discharge electrodes 311 and 312 may be perpendicular to the edges of the ESD protection layer 320. Of course, the first and second discharge electrodes 311 and 312 may be formed to overlap with a part of the ESD protection layer 320. For example, the first and second discharge electrodes 311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the ESD protection layer 320. That is, the first and second discharge electrodes 311 and 312 are not formed to deviate from the ESD protection layer 320. Meanwhile, the first and second discharge electrodes 311 and 312 may be formed to have a larger area than a region in contact with the ESD protection layer 320 is not in contact with. The ESD protection layer 320 may be formed at a predetermined region of the sixth insulating sheet 106, for example, at a central portion thereof, and may be connected to the first and second discharge electrodes 311 and 312. At this time, the ESD protection layer 320 may be formed to overlap with the first and second discharge electrodes 311 and 312 at least partially. That is, the ESD protection layer 320 may be formed to overlap with the first and second discharge electrodes 311 and 312 by 10% to 100% of the horizontal area. The ESD protection layer 320 may be formed to form through holes having a predetermined size in a predetermined region of the sixth insulating sheet 106, for example, a central portion thereof, and to fill the through holes using a thick film printing process. The ESD protection layer 330 may be formed to have a diameter of, for example, 100 mu m to 500 mu m and a thickness of 10 mu m to 50 mu m. At this time, the smaller the thickness of the ESD protection layer 320, the lower the discharge start voltage. The ESD protection layer 320 may be formed using a conductive material and an insulating material. For example, a mixed material of a conductive ceramic and an insulating ceramic may be printed on the sixth insulating sheet 106 to form the ESD protection layer 320. On the other hand, the ESD protection layer 320 may be formed on at least one insulating sheet 100. That is, an ESD protection layer 320 is formed on at least one of the two insulating sheets 100 stacked in the vertical direction, and a discharge electrode is formed on the insulating sheet 100 so as to be spaced apart from each other, Layer 320 as shown in FIG. A detailed description of the structure, materials, and the like of the ESD protection layer 320 will be described later.

The second capacitor unit 4000 may be provided on the upper side of the ESD protection unit 3000 and may include at least two internal electrodes and at least two insulating sheets provided therebetween. For example, the second capacitor unit 2000 includes the seventh to tenth insulation sheets 107 to 110 and the fifth to eighth internal electrodes (not shown) formed on the seventh to tenth insulation sheets 107 to 110 205-208). The fifth to eighth internal electrodes 205 to 208 are connected to the external electrodes 5100, 5200 and 5000, which are formed to face each other in the X direction. The fifth and seventh internal electrodes 205 and 207 are formed on the seventh and ninth insulating sheets 107 and 109 to have a predetermined area and have one side connected to the first external electrode 5100 and the other side connected to the second external side And is spaced apart from the electrode 5200. The sixth and eighth internal electrodes 206 and 208 are respectively formed on the eighth and tenth insulation sheets 108 and 110 to have a predetermined area and have one side connected to the second external electrode 5200 and the other side connected to the first external side And is spaced apart from the electrode 5100. That is, the fifth to eighth internal electrodes 205 to 108 are alternately connected to any one of the external electrodes 5000, and are formed so as to overlap a predetermined region through the eighth to tenth insulation sheets 208 to 110 . At this time, the fifth to eighth internal electrodes 205 to 208 are formed in an area of 10% to 85% of the area of each of the seventh to tenth insulation sheets 107 to 110, respectively. In addition, the fifth to eighth internal electrodes 205 to 208 are formed so as to overlap with each other by an area of 10% to 85% of the area of each of these electrodes. The fifth to eighth internal electrodes 205 to 208 may be formed to have a thickness of, for example, 1 占 퐉 to 10 占 퐉. Meanwhile, the fifth to eighth internal electrodes 205 to 208 may be formed in various shapes such as a square shape, a rectangular shape, a predetermined pattern shape, a spiral shape having a predetermined width and an interval, and the like. The capacitance of the second capacitor portion 4000 is formed between the fifth to eighth internal electrodes 205 to 208. The capacitance of the second capacitor portion 4000 is determined by the overlapping area of the fifth to eighth internal electrodes 205 to 208, The thickness of the first through fourth layers 108 to 110, and the like. The second capacitor unit 4000 includes at least one inner electrode formed in addition to the third and fourth inner electrodes 203 and 204, and at least one insulating sheet having at least one inner electrode formed thereon It is possible. In addition, the second capacitor unit 4000 may have two internal electrodes. That is, in the present embodiment, four internal electrodes of the second capacitor 4000 are formed. However, two or more internal electrodes may be formed.

The internal electrodes 201 to 204 of the first capacitor unit 2000 and the internal electrodes 205 to 208 of the second capacitor unit 4000 may be formed in the same shape and the same area, Can be the same. The insulating sheets 101 to 104 of the first capacitor unit 2000 and the insulating sheets 107 to 110 of the second capacitor unit 4000 may have the same thickness. At this time, when the first insulating sheet 101 functions as a lower cover layer, the first insulating sheet 101 may be thicker than the other insulating sheets. Therefore, the capacitances of the first and second capacitor units 2000 and 4000 may be the same. However, the first and second capacitor units 2000 and 4000 may have different capacitances. In this case, at least one of the area of the internal electrode, the overlapping area of the internal electrodes, and the thickness of the insulating sheet may be different from each other. The internal electrodes 201 to 208 of the capacitor units 2000 and 4000 may be formed longer than the discharge electrode 310 of the ESD protection unit 3000 and the area thereof may be larger.

The external electrodes 5100, 5200 and 5000 are provided on two opposing sides of the stack body 1000 and are connected to the internal electrodes of the first and second capacitor units 2000 and 4000 and the ESD protection unit 3000, respectively. The external electrode 5000 may be formed of at least one layer. The external electrode 5000 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 5000 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. The external electrode 5000 may be formed by mixing a multi-component glass frit containing, for example, 0.5% to 20% Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. At this time, the mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to the two sides of the laminate 1000. By including the glass frit in the external electrode 5000 in this manner, the adhesion between the external electrode 5000 and the layered body 1000 can be improved and the contact response between the internal electrode 200 and the external electrode 5000 can be improved . In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the external electrode 5000. That is, the outer electrode 5000 may be formed by forming a metal layer including glass and at least one plating layer on the metal layer. For example, the external electrode 5000 may be formed by successively forming a Ni plated layer and a Sn plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu. At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. On the other hand, the external electrode 5000 may be formed to a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 탆 to 10 탆 .

In the first embodiment of the present invention, the ESD protection part 3000 having one ESD protection layer 320 is provided in the stacked body 1000. However, when the ESD protection layer 320 is formed of two or more And a plurality of ESD protection units 3000 may be provided. For example, at least two ESD protection layers 320 are formed in the vertical direction, and a discharge electrode is further formed between the ESD protection layers 320 so that one ESD protection element is formed of at least one capacitor and two or more ESD protection parts . At least two or more of the internal electrodes 200 of the capacitor units 2000 and 4000 and the discharge electrodes 310 of the ESD protection unit 3000 and the ESD protection layer 320 may be formed in the Y direction. Therefore, a plurality of the anti-static devices may be provided in parallel in one laminate 1000.

4 and 5 are a cross-sectional schematic view and a cross-sectional view of the ESD protection layer 320 of the anti-shock device according to an embodiment of the present invention.

As shown in FIGS. 4 (a) and 5 (a), the ESD protection layer 320 may be formed by mixing a conductive material and an insulating material. For example, the ESD protection layer 320 may be formed by mixing conductive ceramics and insulating ceramics. In this case, the ESD protection layer 320 can be formed by mixing conductive ceramics and insulating ceramics at a mixing ratio of, for example, 10:90 to 90:10. As the blending ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the blending ratio of the conductive ceramic increases, the discharge starting voltage may be lowered. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted so that a predetermined discharge starting voltage can be obtained. At this time, a plurality of pores (not shown) may be formed in the ESD protection layer 320. By forming pores, the ESD voltage can be more easily bypassed.

In addition, the ESD protection layer 300 may be formed by laminating a conductive layer and an insulating layer in a predetermined laminated structure. That is, the ESD protection layer 300 may be formed by laminating the conductive layer and the insulating layer at least once to divide the conductive layer and the insulating layer. For example, the ESD protection layer 320 may have a two-layer structure in which a conductive layer and an insulating layer are laminated, and a three-layer structure may be formed by stacking a conductive layer, an insulating layer, and a conductive layer. Also, the conductive layer 321 and the insulating layer 322 may be repeatedly laminated a plurality of times to form a laminate structure of three or more layers. For example, as shown in FIG. 4 (b), a three-layered ESD protection layer 300 in which a first conductive layer 321a, an insulating layer 322, and a second conductive layer 321b are stacked is formed . 5 (b) is a photograph showing an ESD protection layer having a three-layer structure formed between internal electrodes between insulating sheets. On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the conductive layer may be located in the uppermost layer and the lowermost layer. At this time, a plurality of pores (not shown) may be formed in at least a part of the conductive layer 321 and the insulating layer 322. For example, since the insulating layer 322 formed between the conductive layers 321 is formed in a porous structure, a plurality of pores may be formed in the insulating layer 322.

The ESD protection layer 320 may further include an air gap in a predetermined region. For example, an air gap may be formed between a layer in which a conductive material and an insulating material are mixed, and an air gap may be formed between the conductive layer and the insulating layer. That is, the first mixed layer of the conductive material and the insulating material, the air gap and the second mixed layer may be laminated, and the conductive layer, the air gap, and the insulating layer may be laminated. For example, the ESD protection layer 320 may include a first conductive layer 321a, a first insulating layer 322a, an air gap 323, a second insulating layer 322b, And a second conductive layer 321b may be stacked. That is, an insulating layer 322 may be formed between the conductive layers 321, and an air gap 323 may be formed between the insulating layers 322. 5 (c) is a cross-sectional photograph of the ESD protection layer 320 having such a laminated structure. Of course, the ESD protection layer 320 may be formed by repeatedly stacking the conductive layer, the insulating layer, and the air gap. On the other hand, when the conductive layer 321, the insulating layer 322, and the air gap 323 are stacked, they may all have the same thickness, and at least one of them may be thinner than the others. For example, the air gap 323 may be thinner than the conductive layer 321 and the insulating layer 322. The conductive layer 321 may have the same thickness as the insulating layer 322 or may be thicker or thinner than the insulating layer 322. On the other hand, the air gap 323 can be formed by filling the polymer material and performing a sintering process to remove the polymer material. For example, a first polymer material including a conductive ceramic, a second polymer material including an insulating ceramic, and a third polymer material not including a conductive ceramic or an insulating ceramic are filled in a via hole and subjected to a sintering process By removing the polymer material, a conductive layer, an insulating layer, and an air gap can be formed. On the other hand, the air gap 323 may be formed without dividing the layers. For example, an insulating layer 322 may be formed between the conductive layers 321a and 321b and a plurality of pores may be formed in the insulating layer 322 in the vertical direction or the horizontal direction to form the air gap 323. That is, the air gap 323 may be formed as a plurality of pores in the insulating layer 322. Of course, the air gap 323 may be formed in the conductive layer 321 by a plurality of pores.

On the other hand, the conductive layer 321 used for the ESD protection layer 320 may have a predetermined resistance and allow a current to flow. For example, the conductive layer 321 may be a resistor having several ohms to several hundreds of M [Omega]. When the overvoltage is applied to the conductive layer 321 by ESD or the like, the energy level is lowered so that the electric breakdown due to the overvoltage does not occur. That is, the conductive layer 321 serves as a heat sink for converting electric energy into heat energy. The conductive layer 321 may be formed using a conductive ceramic and the conductive ceramic may be a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Can be used. The conductive layer 321 can be formed to a thickness of 1 to 50 mu m. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 to 50 탆.

In addition, the insulating layer 322 used for the ESD protection layer 320 may be formed of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 50,000. For example, the insulating ceramic can be formed using a mixture of dielectric material powder such as MLCC, BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, and Al ₂ O ₃ . The insulating layer 322 may be formed of a porous structure formed by forming a plurality of pores each having a size of about 1 nm to 5 μm and having a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 탆. That is, although the insulating layer 322 is formed of an electrically insulating material that can not conduct current, since pores are formed, a current can flow through the pores. At this time, as the size of the pores increases or the porosity increases, the discharge firing voltage may decrease. On the contrary, if the pore size decreases or the porosity decreases, the discharge firing voltage may increase. However, if the pore size exceeds 5 占 퐉 or the porosity exceeds 80%, it may be difficult to maintain the shape of the ESD protection layer 320. Therefore, the pore size and the porosity of the insulating layer 322 can be adjusted to adjust the discharge starting voltage while maintaining the shape of the ESD protection layer 320. Meanwhile, when the ESD protection layer 320 is formed of a mixture of an insulating material and a conductive material, the insulating material may be an insulating ceramic having micropores and porosity. Further, the insulating layer 322 has resistance lower than the resistance of the insulating sheet 100 by micropores, and partial discharge can be made through the micropores. That is, the insulating layer 322 is formed with micro-pores and partially discharged through the micro-pores. The insulating layer 322 may be formed to a thickness of 1 占 퐉 to 50 占 퐉. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to 1 占 퐉 to 50 占 퐉.

The electric shock preventing device according to the first embodiment of the present invention as described above may be provided between the metal case 10 of the electronic device and the internal circuit 20 as shown in FIG. That is, one of the external electrodes 5000 may be connected to the metal case 10 of the electronic device, and the other may be connected to the ground terminal. At this time, the ground terminal may be provided in the internal circuit 20. [ For example, the first outer electrode 5100 may be connected to the metal case 10 of the electronic device, and the second outer electrode 5200 may be connected to the ground terminal. Accordingly, the electrostatic voltage transmitted from the ground terminal of the internal circuit 20 to the metal case can be cut off, and the ESD voltage applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, in the ESD protection device of the present invention, current does not flow between the external electrodes 5000 at the rated voltage and the electrostatic voltage, and current flows through the ESD protection part 3000 at the ESD voltage, thereby bypassing the ESD voltage to the ground terminal . On the other hand, the electric discharge prevention element may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage. For example, the ESD device may have a rated voltage of 100V to 240V, the ESD voltage may be equal to or higher than the operating voltage of the circuit, and the ESD voltage generated by external static electricity or the like may be higher than the ESD voltage. In addition, a communication signal from the outside, that is, an AC frequency, can be transmitted to the internal circuit 20 by the capacitor units 2000 and 4000. Therefore, even when a separate antenna is not provided and the metal case 10 is used as an antenna, a communication signal can be received from the outside. As a result, the anti-shock device according to the present invention can interrupt the electric voltage, bypass the ESD voltage to the ground terminal, and apply the communication signal to the internal circuit.

In addition, the electric shock preventing element according to an embodiment of the present invention includes a plurality of insulating sheets having a high withstand voltage characteristic to form a capacitor portion, so that when an electric shock voltage of, for example, 310 V from the internal circuit by the defective charger flows into the metal case The ESD protection section can maintain the high insulation resistance state without damaging the device by bypassing the ESD voltage when the ESD voltage is applied from the metal case to the internal circuit. That is, the ESD protection unit 3000 includes an ESD protection layer 310 composed of a conductive layer 310 that converts an electric energy into thermal energy by lowering the energy level, and an insulating layer 320 that is made of a porous structure and allows a current to flow through the micropores 300) to protect the circuit by bypassing the ESD voltage introduced from the outside. Therefore, the ESD voltage does not cause the insulation breakdown, and therefore, the ESD voltage generated in the electronic charger having the metal case can be continuously prevented from being transmitted to the user through the metal case of the electronic device. On the other hand, a general MLCC (Multi Layer Capacitance Circuit) protects the electrostatic voltage but is vulnerable to ESD. When repeated ESD is applied, spark occurs due to leakage point due to charge, A phenomenon may occur. However, according to the present invention, an ESD protection layer including a conductive layer and an insulating layer is formed between capacitor portions, so that the capacitor portion is not destroyed by passing the ESD voltage through the ESD protection layer.

On the other hand, the electric shock preventing element has a width L in the one direction, i.e., the X direction, of 0.3 mm to 1.1 mm, a width W in the other direction orthogonal thereto, i.e., in the Y direction of 0.15 mm to 0.55 mm, That is, the thickness in the Z direction may be 0.15 mm to 0.55 mm. For example, the length, width, and thickness of the anti-shock device may be 0.9 mm to 1.1 mm, 0.45 mm to 0.55 mm, 0.45 mm to 0.55 mm, 0.55 mm to 0.65 mm, 0.25 mm to 0.35 mm, And may be from 0.35 mm to 0.45 mm, from 0.15 mm to 0.25 mm, and from 0.15 mm to 0.25 mm. That is, the ratio of the length to the width to the thickness may be 2: 3: 1 to 2: 1 to 2. Preferably, the length x width x thickness is 1.0 mm x 0.5 mm x 0.5 mm, 0.6 mm x 0.3 mm x 0.3 mm, and 0.4 mm x 0.2 mm x 0.2 mm. That is, the anti-shock device may have a ratio of length: width: thickness of 2: 1: 1. The dimensions of these devices conform to typical SMT device specifications. At this time, the ESD protection layer 320 may be formed with a width of, for example, 50 탆 to 500 탆 and a thickness of 5 탆 to 50 탆 according to the size of the device. For example, in an element having a length x width x thickness of 1.0 mm x 0.5 mm x 0.5 mm, 0.6 mm x 0.3 mm x 0.3 mm, and 0.4 mm x 0.2 mm x 0.2 mm, the ESD protection layer 320 has a thickness of 50 to 450 Mu m and a thickness of 5 mu m to 50 mu m.

Further, the anti-electrostatic device of the present invention can be variously modified, and various embodiments of the present invention will be described below, and a description overlapping with the first embodiment of the present invention will be omitted.

6 is a cross-sectional view of an electric shock preventing device according to a second embodiment of the present invention.

6, the anti-shock device according to the second embodiment of the present invention includes a laminated body 1000 in which a plurality of insulating sheets 100 to 101 to 111 are laminated, An ESD protection unit 3000 having at least one capacitor unit 2000 and 4000 having internal electrodes 200 to 201 and at least one discharge electrode 310 and an ESD protection layer 320, And external electrodes 5100, 5200, 5000 formed on two mutually opposing sides of the stack body 1000 and connected to the first and second capacitor units 2000, 4000 and the ESD protection unit 3000 .

Here, the distances A1 and A2 between the ESD protection unit 3000 and the capacitor units 2000 and 4000 may be shorter or equal to the distances C1 and C2 between the two internal electrodes in the capacitor units 2000 and 4000 . That is, the thickness of each of the fifth and seventh insulating sheets 105 and 107 located between the ESD protection unit 3000 and the capacitor units 2000 and 4000 is greater than the thickness between the internal electrodes 200 in the capacitor units 2000 and 4000 May be thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110 located in the insulating layer. The distances A1 and A2 between the ESD protection unit 3000 and the capacitor units 2000 and 4000 may be shorter or equal to the distance B between the two discharge electrodes 310 of the ESD protection unit 3000 . That is, the thickness of each of the fifth and seventh insulating sheets 105 and 107 located between the ESD protection unit 3000 and the capacitor units 2000 and 4000 is set to be greater than the thickness of the sixth insulating sheet 106 ) ≪ / RTI > The thickness of each of the fifth and seventh insulating sheets 105 and 107 located between the ESD protection unit 3000 and the capacitor units 2000 and 4000 is set to be between the internal electrodes 200 in the capacitor units 2000 and 4000 The ESD protection unit 3000 may be formed to have a thickness equal to or thinner than the thickness of the insulating sheets 102 to 104 and 107 to 110 located in the ESD protection unit 3000 or to be thinner or thinner than the distance B between the two discharge electrodes 310 of the ESD protection unit 3000 . That is, the distances A1 and A2 between the ESD protection unit 3000 and the capacitor units 2000 and 4000, the distances C1 and C2 between the two internal electrodes in the capacitor units 2000 and 4000, The distance B between the two discharge electrodes 300 of the plasma display panel may be A1 = A2? C1 = C2 or A1 = A2? B. Of course, A1 and A2, and C1 and C2 may not be the same. On the other hand, the thicknesses D1 and D2 of the lowest and uppermost insulating sheets, that is, the first and eleventh insulating sheets 101 and 111, may be 10 μm or more and 50% or less of the thickness of the laminated body 1000, respectively. At this time, B? D1 = D2, and D1 and D2 may be different.

The electric shock preventing device according to the second embodiment of the present invention is characterized in that two internal electrodes adjacent to the discharge electrodes 311 and 312, namely, the fourth and fifth internal electrodes 204 and 205 are connected to the discharge electrodes 311 and 312 And may be connected to the same external electrode 5000. That is, the first, third, fifth and seventh internal electrodes 201, 203, 205 and 207 are connected to the second external electrode 5200 and the second, fourth, sixth and eighth internal electrodes 202, 204, 206, and 208 are connected to the first external electrode 5100. The first discharge electrode 311 is connected to the first external electrode 5100 and the second discharge electrode 312 is connected to the second external electrode 5200. The first discharge electrode 311 and the fourth internal electrode 204 adjacent to the first discharge electrode 311 are connected to the first external electrode 5100 and the second discharge electrode 312 and the fifth internal electrode 205 adjacent thereto are connected to each other. 2 external electrode 5200, as shown in FIG.

As described above, when the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 5000, the ESD voltage is not applied to the inside of the electronic device even when the insulating sheet 100 is deteriorated Do not. That is, when the discharge electrode 310 and the adjacent internal electrode 200 are connected to different external electrodes 5000, the ESD voltage applied through the external electrode 5000 is discharged to the discharge electrode 310 to the other external electrode 5000 through the adjacent internal electrode 200. For example, as shown in FIG. 2, when the first discharge electrode 311 is connected to the first external electrode 5100 and the fourth internal electrode 204 adjacent thereto is connected to the second external electrode 5200, A conductive path is formed between the first discharge electrode 311 and the fourth internal electrode 204 so that an ESD voltage applied through the first external electrode 5100 is applied to the first discharge electrode 311 , The fifth insulating sheet 105 and the second inner electrode 202 which have been broken down and can be applied to the internal circuit through the second external electrode 5200. [ In order to solve such a problem, the thickness of the insulating sheet 100 can be increased, but in this case, there arises a problem that the size of the electric shock prevention device increases. However, even if the discharge electrode 310 and the adjacent internal electrode 200 are connected to the same external electrode 5000 as shown in FIG. 6 so that the insulating sheet 100 is insulated and destroyed, It is not authorized. In addition, it is possible to prevent the ESD voltage from being applied without forming the insulating sheet 100 thick.

7 is a cross-sectional view of an electric shock preventing device according to a third embodiment of the present invention.

7, the anti-shock device according to the third embodiment of the present invention includes a laminated body 1000 in which a plurality of insulating sheets 100 to 101 to 111 are laminated, An ESD protection unit 3000 having at least one capacitor unit 2000 and 4000 having internal electrodes 200 to 201 and at least one discharge electrode 310 and an ESD protection layer 320, And external electrodes 5100, 5200, 5000 formed on two mutually opposing sides of the stack body 1000 and connected to the first and second capacitor units 2000, 4000 and the ESD protection unit 3000 . At this time, the external electrode 5000 may be formed to overlap with the internal electrodes 200 in a predetermined area. That is, the third embodiment of the present invention differs from the first and second embodiments of the present invention in that the external electrode 5000 is partially overlapped with the internal electrode 200.

The external electrode 5000 may be extended to the upper surface and the lower surface as well as the side surface of the laminate 1000. The external electrode 5000 may be formed to overlap with the internal electrode 200 connected to the external electrode 5000. For example, a portion of the first external electrode 5100 extending downward and upward from the stacked body 1000 may be formed to overlap with a predetermined region of the internal electrodes 200. In addition, portions of the second external electrode 5200 extending to the lower and upper portions of the stacked body 1000 may be formed to overlap with predetermined regions of the internal electrodes 200. For example, a portion of the external electrode 5000 extending to the upper and lower portions of the stacked body 1000 may be formed to overlap with the first and eighth internal electrodes 201 and 208. That is, at least one of the external electrodes 5000 may extend from the upper surface and the lower surface of the stack 1000, and at least one of the extended portions may be partially overlapped with the internal electrode 200. At this time, the area of the internal electrode 200 overlapping the external electrode 5000 may be 1% to 10% of the total area of the internal electrode 200. In addition, the external electrode 5000 can increase the area formed on at least one of the upper surface and the lower surface of the layered body 1000 by a plurality of processes.

In order to overlap the external electrode 5000, the internal electrodes 200 of the capacitor units 2000 and 4000 may be formed longer in the X-axis direction than in the first embodiment. For example, an end of the internal electrode 200 and an external electrode 5000 adjacent to the internal electrode 200 may be formed to maintain an interval of 5% to 10% of the length in the X-axis direction. That is, the internal electrode 200 may be formed to have a length of 90% to 95% of the length of the insulating sheet 100 in the X-axis direction.

A predetermined parasitic capacitance can be generated between the external electrode 5000 and the internal electrode 200 by overlapping the external electrode 5000 and the internal electrode 200. For example, a capacitance may be formed between the first and eighth internal electrodes 201 and 208 and the extension of the first and second external electrodes 5100 and 5200. Therefore, the capacitance of the anti-shock device can be adjusted by adjusting the overlapping area of the external electrode 5000 and the internal electrode 200. That is, the capacitance of the anti-shock device can be adjusted outside the stack body 1000 by adjusting the overlapping area of the external electrodes 5000 even after the manufacturing process of the anti-shock device is completed.

In the first to third embodiments of the present invention, an ESD protection layer 320 is formed by embedding or coating an ESD protection material in a through hole formed in an insulation sheet 104. However, the ESD protection layer 320 may be formed in a predetermined region of the insulating sheet, and the discharge electrode 310 may be formed so as to be in contact with the ESD protection layer 320, respectively. That is, as shown in the sectional view of the fourth embodiment of FIG. 8, two discharge electrodes 311 and 312 are formed on the insulating sheet 106 at predetermined intervals in the horizontal direction, and between the two discharge electrodes 311 and 312 An ESD protection layer 320 may be formed.

The ESD protection unit 3000 includes at least two discharge electrodes 311 and 312 formed on the same plane and at least one ESD protection layer 320 provided between the at least two discharge electrodes 311 and 312 can do. That is, the two discharge electrodes 311 and 312 may be provided in the direction in which the external electrode 5000 is formed, that is, in the X direction so as to be spaced apart from each other in a predetermined region of the sheet, Two or more discharge electrodes (not shown) may be further provided. Accordingly, at least one discharge electrode may be formed in a direction perpendicular to the direction in which the external electrode 5000 is formed, and at least one discharge electrode may be formed so as to face the discharge electrode at a predetermined distance. For example, as shown in FIG. 8, the ESD protection unit 3000 includes a sixth insulating sheet 106, first and second discharge electrodes 311 and 312 formed on the sixth insulating sheet 106, And an ESD protection layer 320 formed on the sixth insulating sheet 106. [ Here, the ESD protection layer 320 may be formed so that at least a part of the ESD protection layer 320 is connected to the first and second discharge electrodes 311 and 312. The first discharge electrode 311 is connected to the external electrode 5100 and is formed on the sixth insulating sheet 106 and the end portion is connected to the ESD protection layer 320. The second discharge electrode 312 is formed so as to be connected to the external electrode 5200 and spaced apart from the first discharge electrode 311 on the sixth insulating sheet 106 and has a distal end connected to the ESD protection layer 320 . The ESD protection layer 320 may be formed to be connected to the first and second discharge electrodes 311 and 312 in a predetermined region of the sixth insulating sheet 106, for example, a center portion thereof. At this time, the ESD protection layer 320 may be partially overlapped with the first and second discharge electrodes 311 and 312. The ESD protection layer 320 is formed on the exposed sixth insulating sheet 106 between the first and second discharge electrodes 311 and 312 to be connected to the side surfaces of the first and second discharge electrodes 311 and 312 It is possible. In this case, since the ESD protection layer 320 may be spaced apart from the first and second discharge electrodes 311 and 312, the ESD protection layer 320 may be overlapped with the first and second discharge electrodes 311 and 312 320 are preferably formed.

Meanwhile, in the fourth embodiment of the present invention, the discharge electrode 310 and the ESD protection layer 320 are formed on the same plane and can be deformed into various shapes. A part of the ESD protection layer 320 may be overlapped with the first discharge electrode 311 and the remaining part of the ESD protection layer 320 may be formed on the insulating sheet 200 as shown in FIG. 9 (a). That is, the ESD protection layer 320 may be formed on the upper and side surfaces of the first discharge electrode 311. The second discharge electrode 312 may be formed on the insulating sheet 200 in contact with the upper surface and the side surface of the ESD protection layer 320.

9 (b), the ESD protection layer 320 is formed on the upper portion of the first discharge electrode 311 and the second discharge electrode 312 is formed on the upper surface of the ESD protection layer 320 And may be formed on the insulating sheet 312. At this time, a space A may be formed on the side surfaces of the second discharge electrode 312, the ESD protection layer 320, and the first discharge electrode 311. That is, the space A may be formed such that at least the first discharge electrode 311 and the second discharge electrode 312 are not in contact with each other. A spacer using a polymer material or the like is formed on the side surface of the ESD protection layer 320 before the first discharge electrode 311 is formed to form the space A and the polymer material is volatilized The space A can be formed. Of course, an insulating material may be formed in the space A, or an ESD protection layer 320 may be extended.

9 (c), the ESD protection unit 3000 may be implemented using the insulating sheet 200 having the stepped portion. That is, a first discharge electrode 311 is formed in a lower region of the insulating sheet 200 having a lower height compared to other regions, and an ESD protection layer (not shown) is formed on the first discharge electrode 311 And the second discharge electrode 312 may be formed to overlap the ESD protection layer 320 in a high area.

10 is a schematic plan view according to one embodiment of an ESD protection part 3000 of an anti-shock device according to a third embodiment of the present invention.

10A, an ESD protection layer 320 is formed between two spaced apart first and second discharge electrodes 311 and 312, and the ESD protection layer 320 is formed of a conductive material and an insulating material And can be formed by mixing the materials.

10B, a first conductive layer 321a, an insulating layer 322, and a second conductive layer 321b are formed in a horizontal direction to form a triple-layered ESD protection layer 320 . That is, first and second conductive layers 321a and 321b are formed so as to be in contact with the first and second discharge electrodes 311 and 312, respectively, and between the first and second conductive layers 321a and 321b, An insulating layer 322 may be formed. However, the ESD protection layer 320 can be formed by using the conductive layer 321 and the insulating layer 322 at least once in the planar direction. For example, the ESD protection layer 320 can be formed in a double structure using the conductive layer 321 and the insulating layer 322, and the conductive layer 321, the insulating layer 322, and the conductive layer 321 ) May be alternately formed to have a triple structure. In addition, the conductive layer 321 and the insulating layer 322 may be alternately formed repeatedly a plurality of times to have a structure of a triple structure or more. At this time, a plurality of pores may be formed in at least the insulating layer 322. Of course, a plurality of pores may be formed in the conductive layer 321 as well.

10 (c), the ESD protection layer 320 includes a first conductive layer 321a, a first insulating layer 322a, and an insulating layer 322b between the first and second discharge electrodes 311 and 312, A gap 323, a second insulating layer 322b, and a second conductive layer 321b may be formed. That is, first and second conductive layers 321a and 321b are formed so as to be in contact with the first and second discharge electrodes 301 and 302, respectively, and first and second conductive layers 321a and 321b are formed between the first and second conductive layers 321a and 321b. And an air gap 323 may be formed between the first and second insulating layers 322a and 322b. Of course, the ESD protection layer 320 may be formed by repeatedly providing the conductive layer, the insulating layer, and the air gap a plurality of times. On the other hand, when the conductive layer 321, the insulating layer 322 and the air gap 323 are provided in the horizontal direction, they may all have the same width, and at least one of the widths may be narrower than the others . For example, the air gap 323 may be narrower than the conductive layer 321 and the insulating layer 322. The conductive layer 321 may be formed to have the same width as that of the insulating layer 322 and may be formed wider or narrower than the insulating layer 322. The air gap 323 may be formed by forming the insulating layer 322 so that a predetermined gap is maintained when the insulating layer 322 is formed in the printing process. Each of the conductive layer 321, the insulating layer 322 and the air gap 323 may be formed with a width of 30% to 50% of the width between the first and second discharge electrodes 311 and 312. That is, when at least one of the conductive layer 321, the insulating layer 322 and the air gap 323 is formed in the horizontal direction, the conductive layer 321, the insulating layer 322, and the air gap 323 each have a width May be 30% to 50% of the width between the first and second discharge electrodes 311 and 312. On the other hand, the air gap 323 may not be formed between the insulating layers 322. That is, the air gap 323 may be formed in the insulating layer 322, and a plurality of pores in the insulating layer 322 may be connected to form a horizontal direction or a vertical direction.

Of course, the ESD protection layer 320 may be formed only of the air gap 323. [ That is, as shown in FIG. 10 (d), the first and second discharge electrodes 311 and 312 are spaced apart from each other by a predetermined distance to form an air gap 323 therebetween, and an air gap 323 is formed between the ESD protection layer (320). When the ESD protection layer 320 is formed only by the air gap 323 as compared with the case where the ESD protection layer 320 is formed of the conductive layer 321, the insulating layer 322, 320 may be formed to have a narrow width.

Also, in the ESD protection device according to the fourth embodiment of the present invention, at least two discharge electrodes of the ESD protection part 3000 may be formed, and at least two ESD protection layers may be formed therebetween. Modifications of the fourth embodiment of the ESD protection unit 3000 according to the present invention will be described with reference to the schematic plan view of FIG.

As shown in FIG. 11A, at least three discharge electrodes 311, 312, and 313 spaced from each other in one direction are formed on the same plane, and an ESD protection unit 3000 is formed between adjacent discharge electrodes . That is, the first, second, and third discharge electrodes 311, 312, and 313 are spaced apart from each other by a predetermined distance, and a first ESD protection layer (not shown) is formed between the first and third discharge electrodes 311 and 313 And a second ESD protection layer 320b may be formed between the third and second discharge electrodes 313 and 312. Here, the first and second ESD protection layers 320a and 320b may be formed of the same material or different materials. For example, the first and second ESD protection layers 320a and 320b may be formed of a mixed material layer of an insulating material and a conductive material, a conductive layer, or an insulating layer. In addition, one of the first and second ESD protection layers 320a and 320b may be formed of a conductive layer and the other of the first and second ESD protection layers 320a and 320b may be formed of an insulating layer.

As shown in FIG. 11B, four discharge electrodes 311, 312, 313, and 314 spaced from each other in one direction are formed on the same plane, and an ESD protection layer 320 May be formed. That is, the four discharge electrodes 311, 312, 313 and 314 are formed at predetermined intervals in one direction, and a first ESD protection layer 320a is formed between the first and third discharge electrodes 311 and 313 A second ESD protection layer 320b is formed between the third and fourth discharge electrodes 313 and 314 and a third ESD protection layer 320c is formed between the fourth and second discharge electrodes 314 and 312. [ Can be formed. Here, the first through third ESD protection layers 320a, 320b, and 320c may be formed of the same material. For example, the first through third ESD protection layers 320a, 320b and 320c may be formed of a mixed material layer of an insulating material and a conductive material, respectively, and may be formed of a conductive layer, have. Also, at least one of the first through third ESD protection layers 320a, 320b, and 320c may be formed of a different material. For example, the first and third ESD protection layers 320a and 320c may be formed as a conductive layer, and the second ESD protection layer 320b may be formed as an insulation layer. In addition, the first and third ESD protection layers 320a and 320c may be formed of an insulating layer, and the second ESD protection layer 320b may be formed of a conductive layer.

Of course, at least one of the plurality of ESD protection layers 320 may be formed as an air gap 323. That is, as shown in FIG. 11 (c), four discharge electrodes 311, 312, 313 and 314 are formed at predetermined intervals in one direction, and between the first and third discharge electrodes 311 and 313 An air gap 323 is formed as a second ESD protection layer 320b between the third and fourth discharge electrodes 313 and 314 and a fourth ESD protection layer 320b is formed between the third and fourth discharge electrodes 313 and 314, A third ESD protection layer 320c may be formed between the electrodes 314 and 312. [ Here, the first and third ESD protection layers 320a and 320c may be formed of the same material. For example, the first and third ESD protection layers 320a and 320c may be formed of a mixed material layer of an insulating material and a conductive material, respectively, and may be formed of a conductive layer or an insulating layer. In addition, the first and third ESD protection layers 320a and 320c may be formed of different materials. For example, one of the first and third ESD protection layers 320a and 320c may be formed as a conductive layer, and the other may be formed as an insulating layer.

In addition, the ESD protection device of the present invention can deform the discharge electrode of the ESD protection part 3000 into various shapes. For example, as shown in Fig. 12 (a), the discharge electrodes 311 and 312 may be formed such that the end portions facing each other are pointed or the discharge electrodes 311 and 312 The end portions facing each other may be rounded. That is, at least one area of the discharge electrodes 311 and 312 facing each other can be formed closer to the other area. By forming the distal ends of the two discharge electrodes 311 and 312 spaced apart from each other to be sharp or rounded, the distance between the two discharge electrodes 311 and 312 becomes close to each other, so that a discharge is easily generated between the two discharge electrodes 311 and 312 .

In addition, the two discharge electrodes 311 and 312 can be formed in various shapes while maintaining the same spacing. For example, as shown in FIG. 12 (c), one discharge electrode 311 is formed to have a predetermined inclination from one side to the other side, and the other discharge electrode 312 is formed to have a predetermined inclination in an opposite shape . Also, the discharge electrodes 311 and 312 may be formed to have at least one concavo-convex structure while maintaining a constant spacing from each other. For example, as shown in FIG. 12 (d), the discharge electrode 311 is formed in a concave shape and the discharge electrode 312 is formed in a convex shape so that the convex portion is inserted into the concave portion. . In this way, since the two internal electrodes are formed in various shapes while maintaining the same spacing, the area between the two internal electrodes increases, thereby increasing ESD immunity.

Also, even when the ESD protection layer 320 and the discharge electrode 310 are formed on the same plane, the internal electrodes of the capacitor units 2000 and 4000 adjacent to the discharge electrode 310 are connected to the same external electrode 5000 It is possible. 13, the first discharge electrode 311 and the fourth internal electrode 204 adjacent to the first discharge electrode 311 are connected to the first external electrode 5100, and the second discharge electrode 312 and the fifth The inner electrode 205 may be connected to the second outer electrode 5200. The fourth internal electrode 204 may be formed to have the same length as that of the first discharge electrode 311 and the fifth internal electrode 205 may be formed to have the same length as the second discharge electrode 312. That is, when the fourth internal electrode 204 is partially overlapped with the second discharge electrode 312 or when the fifth internal electrode 205 is partially overlapped with the first discharge electrode 311, It is preferable that the internal electrode 200 adjacent to the discharge electrode 310 and connected to the same external electrode 5000 is formed to have a shorter or equal length than the discharge electrode 310 because the ESD voltage may flow Do. Even when the discharge electrode 310 and the ESD protection layer 320 are formed on the same plane, the distances A1 and A2 between the discharge electrode 310 and the adjacent internal electrodes 204 and 205 are smaller than the distance between the capacitor unit 2000 , 4000) between the two internal electrodes (200). That is, A1 = A2? Cl = C2. At this time, A1 and A2 may be different, and C1 and C2 may also be different.

14, even when the discharge electrode 310 and the ESD protection layer 320 are formed on the same plane, the external electrode 5000 is formed to partially overlap the internal electrode 200, Can be adjusted.

On the other hand, as the chip size becomes smaller, the space that can be designed becomes smaller. Therefore, an internal structure of the ESD element having a high ESD withstand voltage characteristic in a narrow space is required. However, if the size of the electric shock preventing element is reduced, the thickness of the insulating sheet must be reduced due to insufficient space. This is because the dielectric strength of the insulating sheet itself is lowered and the insulation resistance A phenomenon of breakdown occurs. In order to solve such a problem, it is possible to improve ESD withstand voltage characteristics in the same space by using a plurality of floating type structures. That is, since the shape of the internal electrode of the capacitor portion is deformed to increase the thickness of the insulating sheet in one region between the internal electrodes, the ESD withstand voltage characteristic can be maintained. This is combined with the design of the ESD protection part of the anti-shock device to show a higher ESD resistance improvement effect. As a result, if the ESD is not passed to the ESD protection layer of the ESD protection part due to the repetitive ESD voltage of the ESD protection part, the ESD protection part may not be deteriorated due to the damage of the capacitor part. An ESD voltage load may be generated for a short time in the capacitor portion during 1 ns to 30 ns blank time until the reaction time of the ESD protection portion of the ESD protection element during the voltage input, resulting in dielectric breakdown. However, by forming the capacitor portion to be a floating type, it is possible to improve the ESD withstand voltage characteristic of the capacitor layer and to improve the phenomenon that the insulation resistance is destroyed and a short circuit is generated.

Various embodiments of the present invention in which such a capacitor portion is formed as a floating type will be described with reference to FIGS. 15 to 18. FIG.

15 to 18, an anti-shock device according to another embodiment of the present invention includes a laminated body 1000 in which a plurality of insulating sheets 101 to 113 and 100 are laminated, A first capacitor unit 2000, an ESD protection unit 3000, and a second capacitor unit 4000 may be provided. The ESD protection unit 3000 further includes external electrodes 5100, 5200, 5000 formed on two opposite sides of the stack 1000 to be connected to the first and second capacitor units 2000, 4000 and the ESD protection unit 3000 can do. The first capacitor unit 2000 includes a plurality of internal electrodes 201 through 205 and the second capacitor unit 4000 may include a plurality of internal electrodes 208 through 212. That is, the first and second capacitor units 2000 and 4000 may have the same number, for example, five internal electrodes. An ESD protection unit 3000 including discharge electrodes 311 and 312 and an ESD protection layer 320 provided therebetween is provided between the first and second capacitor units 2000 and 4000. Here, the first and second capacitor units 2000 and 4000 may have a shape in which at least one internal electrode is removed from at least one region.

15, the internal electrode 201 of the first capacitor unit 2000 is formed in a shape such that a center portion thereof is removed with a predetermined width, and the ESD protection unit 3000 is interposed therebetween, The internal electrode 210 of the second capacitor unit 4000 may be formed in the same position as the internal electrode 201 to have a predetermined region removed. Since the internal electrodes 201 and 210 are formed by removing the predetermined region, the overlapping area between the internal electrodes 201 and 210 and the adjacent internal electrodes 202 and 209 becomes small. At this time, the internal electrodes 201 and 210, which are divided into two regions by removing a predetermined region, may be connected to the first and second external electrodes 5100 and 5200, respectively. The insulating sheets 102 and 112 are formed thickly between the inner electrodes 201 and 210 and the adjacent inner electrodes 202 and 209 by forming the predetermined area of the inner electrodes 201 and 210 to be removed. That is, since the two insulating sheets 101 and 102 are provided between the inner electrode 202 and the removed portion of the inner electrode 201, the thickness of the insulating sheet 100 is increased. Therefore, since the thickness of the insulating sheet 100 is increased at least twice in one region between the internal electrodes 200 of the capacitor units 2000 and 4000, the ESD withstand voltage characteristic can be maintained.

16, a predetermined region of the center portion of the internal electrodes 201, 203, and 205 of the first capacitor unit 2000 may be removed, and the ESD protection unit 3000 may be interposed between the internal electrodes 201, For example, a predetermined region of the central portion of the internal electrodes 206, 208, and 210 of the second capacitor unit 4000 positioned symmetrically may be removed. At this time, the internal electrodes 202, 204, 207, and 209 are formed to overlap with at least a part of the internal electrodes 201, 203, 205, 206, 208, . That is, the internal electrodes 202, 204, 207, and 209 are formed at the central portion of the insulating sheet 100 to form internal electrodes 201, 203, 205, 206, 208, 210, respectively.

Meanwhile, the internal electrodes of the first and second capacitor units 2000 and 4000 may be removed not only from the central region but also from the region spaced apart from the central region. For example, as shown in FIG. 17, the central regions of the internal electrodes 201, 203, and 205 of the first capacitor unit 2000 are removed, and the internal electrodes 202, The removing portions may be formed on both sides spaced apart from each other by a predetermined distance in the region. The second capacitor unit 4000 includes internal electrodes 206 and 208 at positions symmetrical to the internal electrodes 201, 203 and 205 of the first capacitor unit 2000 with the ESD protection unit 3000 interposed therebetween. And the inner electrodes 207 and 209 located between the first and second capacitors 2000 and 210 may be removed at the same position as the inner electrodes 202 and 204 of the first capacitor 2000 .

18, two or more removal regions are formed in a central region of the internal electrodes 201, 203, and 205 of the first capacitor unit 2000, and internal electrodes 202, 204 may have a removal region formed on both sides of the center region at predetermined intervals. The second capacitor unit 4000 includes internal electrodes 206 and 208 at positions symmetrical to the internal electrodes 201, 203 and 205 of the first capacitor unit 2000 with the ESD protection unit 3000 interposed therebetween. The inner electrodes 207 and 209 located between the inner electrodes 202 and 204 of the first capacitor unit 2000 are formed at the same position as the inner electrodes 202 and 204 of the first capacitor unit 2000, Can be formed.

Meanwhile, at least one ESD protection layer 320 of the ESD protection part 3000 may be formed in the ESD protection device according to the embodiments of the present invention. That is, one ESD protection layer 300 may be formed in the X direction as shown in FIGS. 2, 6, 7, and 8, and the ESD protection layer 300 may be formed in the X direction as shown in FIGS. (320) may be formed in two or more. At this time, a plurality of ESD protection layers 320 may be formed in the Y direction. For example, two ESD protection layers 320a and 320b may be formed on the same plane as shown in FIG. 19, and three ESD protection layers 320a and 320b may be formed on the same plane as shown in FIG. 320b, and 320c. At least two ESD protection layers 320a, 320b and 320c may be connected by internal electrodes. As shown in FIG. 21, four ESD protection layers 320a, 320b, 320c, and 320d may be formed by vertically dividing the ESD protection layers 320a, 320b, 320c, 320c, 320d, 320e, and 320f may be divided into three upper and lower portions. The upper ESD protection layers 320 formed above and below may be connected to each other and the lower ESD protection layers may be connected to each other. Even when a plurality of ESD protection layers 320 are formed, each ESD protection layer 320 may have the same structure or different structures.

As described above, at least one capacitor portion 2000 and 4000 and at least one ESD protection portion 3000 may be formed in one stack of the anti-shock device according to the present invention. For example, one capacitor and two or more ESD protection portions may be formed. At this time, the capacitor may be formed between the internal circuit of the electronic device and the metal case, and an ESD protection portion may be formed between the capacitor and the ground terminal. To this end, the first and second external electrodes 5100 and 5200 are formed on two mutually opposed sides of the laminate, and the first and second external electrodes 5100 and 5200 are formed on two mutually opposed sides where the first and second external electrodes 5100 and 5200 are not formed. 3 and a fourth external electrode (not shown) may be formed. The first and second external electrodes 5100 and 5200 may be respectively provided between the metal case and the internal circuit of the electronic device, and the third and fourth external electrodes may be connected to the ground terminal. That is, the first and second external electrodes 5100 and 5200 may be respectively connected to two regions between the metal case and the internal circuit of the electronic device, and the third and fourth external electrodes may be connected to the ground terminal

In addition, a plurality of capacitor units 2000 and 4000 and a plurality of ESD protection units 3000 may be formed in the stacked body 1000 in the horizontal direction in the anti-shock device according to the present invention. That is, at least one of the capacitor units 2000 and 4000 stacked in the vertical direction and the ESD protection unit 3000 are connected to at least two or more external electrodes 5000 arranged in the horizontal direction and arranged in the horizontal direction, A plurality of the ESD protection elements each including a plurality of capacitors and a plurality of ESD protection sections may be provided in parallel. Therefore, two or more of the anti-static devices may be implemented in one laminate 1000. At this time, for example, a plurality of first outer electrodes 5100 may be connected to a plurality of regions of the metal case of the electronic device, and a plurality of second outer electrodes 5200 may be connected to the ground terminal of the electronic device. At least one of the plurality of capacitors may have at least one of the internal electrodes formed to have a different length. That is, at least one internal electrode among the plurality of internal electrodes formed in the horizontal direction and forming the different capacitor portions may be formed to be shorter or longer than the other internal electrodes. Of course, the capacitance can be adjusted by controlling at least one of the length of the internal electrode, the overlapping area of the internal electrodes, and the number of stacked internal electrodes. Therefore, at least one of the plurality of capacitors can be made different in capacitance. That is, a plurality of capacitors having different capacitances may be implemented in at least one of the stacks.

The results of various experimental examples of the anti-electrostatic device according to the first embodiment of the present invention will be described as follows.

[Table 1] is a table showing the characteristics according to the structure of the ESD protection layer, and Fig. 23 is a diagram showing discharge firing voltage accordingly. That is, the thickness of the ESD protection layer, the thickness of the conductive layer (A) and the insulating layer (B), the pore size and porosity of the insulating layer, and the discharge starting voltage according to the structure of the ESD protection layer are shown.

Experimental Example ESD protection layer
Thickness (㎛) Conductive layer
Thickness (㎛) Insulating layer
Thickness (㎛) Insulating layer
Pore size Insulating layer
Porosity Air gap
thickness
(탆) Discharge start voltage
(kV) short
Incidence rate One 25 25 0 - - - 2 to 4 100% 2 10 0 10 1 nm to 5 μm 40% - 12.4
(11-13) 0.8% 3 25 0 25 1 nm to 5 μm 40% - 18.3
(17-19) 0% 4 25 15 10 1 nm to 5 μm 40% - 7.2
(6 to 9) 0% 5 25 8 5 1 nm to 5 μm 40% - 5.6
(4-6) 0% 6 25 8 2 1 nm to 5 μm 40% 3 5.1
(3 to 5.5) 0%

In Experimental Example 1, an ESD protective layer having a thickness of 25 mu m was formed using only a conductive layer (conductive ceramics). In Experimental Example 2, an ESD protective layer having a thickness of 10 mu m was formed using only an insulating layer (insulating ceramic) An ESD protection layer having a thickness of 25 mu m was formed. In Experimental Example 4, a conductive layer and an insulating layer were laminated to form an ESD protection layer having a thickness of 25 μm. In Experimental Example 5, an ESD protection layer having a thickness of 25 μm was formed by laminating a conductive layer, an insulating layer and a conductive layer . In Experimental Example 5, the conductive layer and the insulating layer were formed to a thickness of 8 탆 and 5 탆, respectively. In Experimental Example 6, a conductive layer, an insulating layer, an air-gap, an insulating layer, and a conductive layer were laminated to form an ESD protection layer having a thickness of 25 mu m. In this case, And 3 mu m. On the other hand, in Experimental Examples 2 to 6, the pore size of the insulating layer was 1 nm to 5 m and the porosity was 40%. That is, pores of various sizes having a size of 1 nm to 5 탆 were formed in the insulating layer.

As shown in [Table 1], a number of experiments were carried out on Experimental Example 1 in which an ESD protection layer was formed only of a conductive layer. At this time, discharge start voltage was about 2 to 4 kV and 100% short-circuit occurred. That is, the discharge start voltage of a large number of samples according to Experimental Example 1 was distributed in a range of 2 to 4 kV, and all of these samples were insulated and destroyed to generate a leakage current. In Experimental Example 2 in which an ESD protection layer having a thickness of 10 mu m was formed only by an insulating layer, a discharge start voltage was about 11 to 13 kV and a short of about 0.8% was generated. However, in Experimental Examples 3 to 6 in which the ESD protection layer was formed by laminating the conductive layer, the insulating layer, and the air gap, the discharge starting voltage could be adjusted from 3 kV to 19 kV, and no short circuit was generated. In other words, in Experimental Examples 4 to 6, although the discharge starting voltage is lower than that of Experimental Example 2, insulation breakdown is not caused by the structural difference. The discharge firing voltage according to this experimental example is shown in Fig.

As can be seen from Table 1, by forming the insulating layer, it is possible to improve the probability of occurrence of a short circuit due to dielectric breakdown, and by forming the conductive layer, the thickness of the insulating layer can be reduced and the discharge starting voltage can be improved . Further, if the air gap is added while reducing the thickness of the insulating layer, the probability of short circuit can be improved while lowering the discharge start voltage.

[Table 2] is a table showing characteristics depending on the thickness of the insulating layer and the porosity, and Fig. 24 is a diagram showing discharge firing voltage according to the table. The porosity was set to 40% and 1% or less, and the pore size was set to 1 nm to 5 μm when the porosity was 40% and to 0 when the porosity was 1% or less. That is, the characteristics of the case where the pores are formed in the insulating layer and the case where the pores are not formed are compared and shown in Table 2.

Experimental Example ESD protection layer
Thickness (㎛) Conductive ceramic
Thickness (㎛) Insulating ceramic
Thickness (㎛) Insulation
ceramic
Pore size Insulating ceramic
Porosity Air gap
thickness
(탆)
Discharge start voltage
(kV) short
Incidence rate 7 10 0 10 1 nm to 5 μm 40% - 12.4
(11-13) 0.9% 8 10 0 10 0 ~ 1% - 20.3
(18-22) 3.5% 9 25 0 25 1 nm to 5 μm 40% - 18.3
(17-19) 0% 10 25 0 25 0 ~ 1% - 25.9
(24-28) 0% 11 25 0 25 1 nm to 5 μm 80% - 21.1
(19-22) 0%

In Experimental Examples 7 and 8, the thickness of the insulating layer was 10 탆 and the porosity was 40% or less and 1% or less, respectively. In Examples 9 and 10, the thickness of the insulating layer was 25 μm and the porosity was 40% or less and 1% or less, respectively. In Experimental Example 11, the thickness of the insulating layer was 25 탆 and the porosity was 40%. As can be seen from Experimental Examples 7 and 8, when the thickness of the ESD protection layer is 10 占 퐉 and the thickness of the insulating layer is 10 占 퐉, the discharge start voltage increases and the probability of occurrence of shot increases as the porosity of the insulating layer decreases . Also, as can be seen from Experimental Examples 9 and 10, when the thickness of the ESD protection layer is 25 占 퐉 and the thickness of the insulating layer is 25 占 퐉, the discharge starting voltage rises as the porosity of the insulating layer decreases. However, as the thickness of the insulating layer is increased, a short circuit is not generated. On the other hand, as can be seen from Experimental Example 11, when the thickness of the insulating layer is 25 μm and the porosity increases to 80%, the discharge firing voltage shows an average of about 21.1 kV. The discharge starting voltage according to Table 2 is shown in Fig.

[Table 3] is a table showing characteristics according to the pore size of the insulating layer, and Fig. 25 is a diagram showing discharge firing voltage according to the table. That is, the ESD protection layer had a thickness of 25 占 퐉 and the thickness of the insulating layer was 25 占 퐉, and the discharge firing voltage corresponding to the change in the pore size of the insulating layer was shown.

Experimental Example ESD protection layer
Thickness (㎛) Conductive ceramic
Thickness (㎛) Insulating ceramic
Thickness (㎛) Insulation
ceramic
Pore size Insulating ceramic
Porosity Air gap
thickness
(탆)
Discharge start voltage
(kV) short
Incidence rate 12 25 0 25 1 nm to 5 μm 40% - 18.3
(17-19) 0% 13 25 0 25 5 nm to 10 μm 40 to 60% - 19.7
(18-20.5) 0% 14 25 0 25 0 ~ 1% - 25.9
(24-28) 0%

In Experimental Example 12, the pore size of the insulating layer was 1 nm to 5 탆, and the porosity thereof was set to 40%. In Experimental Example 13, the pore size of the insulating layer was 5 nm to 10 m, and the porosity thereof was 40% to 60%. In Experimental Example 14, the pore size of the insulating layer was set to 0 and the porosity thereof was set to 1% or less. As shown in Table 3 and FIG. 25, in the case of Experimental Example 12, the discharge starting voltage was about 17 to 19 kV and the average was about 18.3 kV. In Experimental Example 13, the discharge starting voltage was about 18 to 20.5 kV and the average was 19.7 kV Respectively. That is, as the pore size increases, the discharge start voltage increases. In the case of Experimental Example 14, the discharge starting voltage is about 24 to 28 kV and the average is about 25.9 kV. That is, as shown in Experimental Example 14, when the ESD protection layer is formed using an insulating layer having no pores, a high discharge starting voltage can be obtained. In this case, however, no short circuit occurs.

[Table 4] is a table showing the characteristics according to the thickness of the ESD protection layer, and Fig. 26 is a diagram showing the discharge start voltage at this time. That is, the thickness of the ESD protection layer was adjusted to 10 탆, 25 탆 and 50 탆, and the thickness of the insulating layer was adjusted to 10 탆, 25 탆 and 50 탆, respectively, to display the discharge starting voltage according to the thickness of the ESD protection layer . At this time, the pore size of the insulating layer was 1 nm to 5 탆 and the porosity was 40%.

Experimental Example ESD protection layer
Thickness (㎛) Conductive ceramic
Thickness (㎛) Insulating ceramic
Thickness (㎛) Insulation
ceramic
Pore size Insulating ceramic
Porosity Air gap
thickness
(탆)
Discharge start voltage
(kV) short
Incidence rate 15 10 0 10 1 nm to 5 μm 40% - 12.4
(11-13) 0.9% short occurrence 16 25 0 25 1 nm to 5 μm 40% - 18.3
(17-19) 0% 17 50 0 50 1 nm to 5 μm 40% - 26.2
(25-27) 0%

In Experimental Example 15, the thickness of the ESD protection layer and the thickness of the insulating layer were set to 10 mu m. In Experimental Example 16, the thickness of the ESD protection layer and the insulating layer was set to 25 mu m, The thickness and thus the thickness of the insulating layer were 50 탆. As shown in Table 4 and FIG. 8, in the case of Experimental Example 15, the discharge starting voltage was about 11 to 13 kV (average 12.4 kV), the discharge starting voltage was about 17 to 19 kV (average 18.3 kV) . In the case of Experimental Example 17, the discharge starting voltage was about 25 to 27 kV (average 26.2 kV). As shown in EXPERIMENTAL EXAMPLES 15 to 17, when the thickness of the ESD protection layer is increased and accordingly the thickness of the insulating layer is increased, the discharge starting voltage is increased. In the case of Experimental Example 15 in which the ESD protection layer is 10 [micro] m, shot can occur at about 0.9%.

The present invention is not limited to the above-described embodiments, but may be embodied in various forms. In other words, the above-described embodiments are provided so that the disclosure of the present invention is complete, and those skilled in the art will fully understand the scope of the invention, and the scope of the present invention should be understood by the appended claims .

1000: laminate 2000: first capacitor part
3000: ESD protection part 4000: second capacitor part
5000: external electrode 100: insulating sheet
200: internal electrode 310: discharge electrode
320: ESD protection layer

Claims (13)

A laminated body in which a plurality of insulating sheets are laminated;
A capacitor unit including a plurality of internal electrodes formed in the laminate;
An ESD protection part formed on at least a part of the insulating sheet to protect the ESD voltage; And
And an external electrode provided on at least two sides of the laminated body and connected to the capacitor unit and the ESD protection unit,
Wherein the ESD protection unit includes at least two discharge electrodes and at least one ESD protection layer provided between the discharge electrodes,
Wherein one of the external electrodes is connected to the metal case of the electronic device and the other is connected to the ground terminal to cut off the electrostatic voltage and bypass the ESD voltage.
The device of claim 1, wherein the ESD protection layer comprises at least one of a porous insulating material, a conductive material, and an air gap, wherein the air gap is formed by connecting at least two pores of the adjacent insulating material.
The laminated element according to claim 1, wherein the electrostatic voltage is equal to or less than a discharge start voltage, and the ESD voltage is equal to or greater than the discharge start voltage.
The stacked element according to claim 1, wherein the discharge electrode and the ESD protection layer are formed on different planes or formed on the same plane.
The multilayered element according to claim 1, wherein the inner electrode adjacent to the discharge electrode is connected to the same outer electrode or connected to different outer electrodes.
The multilayered element according to claim 1, wherein A is a distance between the discharge electrode and the inner electrode, A is a distance between the discharge electrodes, B is a distance between the discharge electrodes, and C is a distance between the inner electrodes.
The multilayered element according to claim 1, wherein B ≤ D1 and B ≤ D2 where D1 and D2 denote the thicknesses of the insulation sheet of the lowermost layer and the uppermost layer, respectively.
The layered device of claim 1, wherein the external electrode extends to at least one of an upper portion and a lower portion of the laminate and is partially overlapped with the internal electrode.
And a stacked element provided between the metal case and the internal circuit for blocking the ESD voltage and for bypassing the ESD voltage,
The stacked-
A laminated body in which a plurality of insulating sheets are laminated;
A capacitor unit including a plurality of internal electrodes formed in the laminate;
An ESD protection part formed on at least a part of the insulating sheet and including at least two discharge electrodes and at least one ESD protection layer; And
And an external electrode provided on at least two sides of the stacked body and connected to the capacitor unit and the ESD protection unit.
The electronic apparatus according to claim 9, wherein the inner electrode adjacent to the discharge electrode is connected to the same outer electrode or connected to different outer electrodes.
[12] The electronic apparatus according to claim 9, wherein the external electrode extends to at least one of an upper portion and a lower portion of the laminate and is partially overlapped with the internal electrode.
The electronic device according to claim 9, wherein A is a distance between the discharge electrode and the inner electrode, A is a distance between the discharge electrodes, B is a distance between the discharge electrodes, and C is a distance between the inner electrodes.
12. The electronic apparatus according to claim 9, wherein B ≤ D1, B ≤ D2 where D1 and D2 denote the thicknesses of the lowermost and uppermost insulating sheets, respectively.

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