KR20170063156A

KR20170063156A - Circuit protection device and mobile electronic device with the same

Info

Publication number: KR20170063156A
Application number: KR1020150169200A
Authority: KR
Inventors: 이승철; 김리언
Original assignee: 주식회사 아모텍
Priority date: 2015-11-30
Filing date: 2015-11-30
Publication date: 2017-06-08

Abstract

An electric shock protection device and a portable electronic device having the same are provided. The present invention relates to an electric shock protection element disposed between a body contactable conductor of an electronic device and a built-in circuit portion, comprising: a first body; a plurality of first internal electrodes arranged in a line in the first body; An electric shock protection unit including a second internal electrode spaced apart from the other electrodes; An outer electrode formed on an outer surface of the first element to be electrically connected to the first inner electrode and the second inner electrode; And a glass coating layer formed on the outer surface of the body including at least an area where the outer electrode and the outer surface of the body contact each other. According to this, it is possible to protect the user from the leakage current by the power source, protect the internal circuit from external static electricity, significantly improve the mechanical strength of the device, and maintain the initial design property even if the device is electrochemically post-treated .

Description

[0001] The present invention relates to an electric shock protection device and a portable electronic device having the same,

The present invention relates to an electric shock protection device and a portable electronic device having the same.

Recently, the adoption of a metal-made housing has been increasing in order to improve aesthetics and robustness of portable electronic devices.

However, since the metal housing is excellent in electrical conductivity due to the nature of the material, an electrical path can be formed between the housing and the built-in circuit depending on the particular device or part. Particularly, since the metal housing and the circuit part form a loop, when a static electricity having a high voltage instantaneously flows through a conductor such as a metal housing having a large exposed surface area, the circuit part such as an IC can be damaged, Measures are required.

On the other hand, such a portable electronic device typically uses a charger to charge the battery. Such a charger rectifies an external AC power source to a DC power source and then through a transformer to a low DC power source suitable for a portable electronic device. Here, in order to enhance the electrical insulation of the transformer, a Y-CAP composed of a capacitor is provided at both ends of the transformer.

However, when the Y-CAP does not have the normal characteristics, such as a non-genuine charger, the DC power may not be sufficiently blocked by the Y-CAP, and furthermore, a leakage current may be generated by the AC power. As shown in FIG.

Such a leakage current can be transmitted to a conductor that can be contacted with a human body as in an external case of a portable electronic device. As a result, the user can give an unpleasant feeling of crushing and, in severe cases, You can wear it.

Therefore, a portable electronic device such as a cellular phone employing a metal case is required to protect the user from such a leakage current.

On the other hand, since the device being studied for this purpose must be mounted on a printed circuit board through a conventional reflow soldering method or the like, an electrode (external electrode) is provided on the outer surface of the device so as to be electrically connected to the circuit board , The external electrode is easily peeled due to low adhesive strength due to compatibility with the outer surface of the device.

In order to improve the wettability during reflow soldering, plating of the outer electrode surface with nickel, lead, tin or the like is required, but the plating solution for this purpose can penetrate into the inside of the device, There is a problem that the function of a device designed to cut off the leakage current or protect the circuit from static electricity may be remarkably deteriorated.

Accordingly, there is a demand for a method for maintaining the inherent physical properties even when the device is subjected to a post-treatment process such as a plating solution, in addition to the protection from static electricity and the interruption of leakage current, and the mechanical strength of the device is remarkably improved.

KR 0573364 B

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and it is an object of the present invention to provide a method of protecting an internal circuit and / or a user from a leakage current caused by static electricity or an external power source, remarkably improving the mechanical strength of the device, An object of the present invention is to provide an electric shock protection device and a portable electronic device having the same.

An object of the present invention is to provide an electric shock protection device which is disposed between a body contactable conductor of an electronic device and a built-in circuit portion, comprising: a first body; a plurality of first internal electrodes arranged in a line in the first body; An electric shock protection unit including a plurality of first internal electrodes and a second internal electrode spaced apart from the first internal electrodes; An outer electrode formed on an outer surface of the first element to be electrically connected to the first inner electrode and the second inner electrode; And a glass coating layer formed on the outer surface of the body including at least an area where the outer electrode and the outer surface of the body contact each other.

In addition, it is possible to pass the static electricity without causing insulation breakdown when the static electricity flows from the conductor, and to prevent leakage current of the external power source flowing from the ground of the circuit part.

Vbr > Vin where Vbr is the breakdown voltage of the electric shock protection element, and Vin is the rated voltage of the external power supply of the electronic device.

In addition, the rated voltage may be a national standard rated voltage.

The plurality of electrodes may be arranged in a line in the second internal electrode.

Each of the second internal electrodes may be disposed so as to overlap at least part of the first internal electrode.

In addition, each of the second internal electrodes may be disposed so as not to overlap with the first internal electrode.

The distance L between any two first internal electrodes disposed adjacent to and closest to the second internal electrodes among the plurality of first internal electrodes may be a distance between the first internal electrodes and the second internal electrodes, May be larger than the sum of the shortest distances (d1, d2).

The first elementary body may be formed of a plurality of sheet layers, at least a part of the sheet layer may be formed of a first varistor composition, and the remaining sheet layer may be formed of a second varistor composition different from the first varistor composition .

The thicknesses of the first internal electrode and the second internal electrode may independently be 2 to 10 탆.

Further, the glass coating layer may be formed on the outer surface of the body. The glass coating layer may be formed of a material selected from the group consisting of aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, And may include at least one element selected from cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum. In addition, the average thickness of the glass coating layer may be A to B m.

In order to allow a communication signal flowing from the conductor to pass therethrough, a second elementary body disposed at one side of the first elementary body of the electric shock protection element and at least a part of the electrode are provided inside the second elementary element, And a capacitor portion including a capacitor electrode electrically connected to the electrode. At this time, Vcp > Vbr, where Vcp is the dielectric breakdown voltage of the capacitor portion.

Also, the capacitor unit may be electrically connected in parallel with the electric shock protection unit.

In addition, the second element may include a dielectric.

The breakdown voltage Vbr of the electric shock protection element may be the sum of the unit breakdown voltages formed between the first and second inner electrodes adjacent to each other.

According to another aspect of the present invention, there is provided an electric shock protection element disposed between a body contactable conductor of an electronic device and a built-in circuit, comprising: a first body; a plurality of first internal electrodes arranged in a line in the first body; An electric shock protection unit including a first internal electrode and a second internal electrode spaced apart from the first internal electrode; And a capacitor electrode provided in the second elementary body so that at least a part of the surfaces of the second elementary body and the electrode disposed on one side of the first elementary body of the electric shock protection element for allowing the communication signal flowing from the conductor to pass therethrough, A capacitor portion; An external electrode formed on an outer surface of the first and second main bodies so as to be electrically connected to the first internal electrode, the second internal electrode, and the capacitor electrode; And a glass coating layer formed on the outer surface of the body including the outer surface of the body including the first body and the second body and the region in contact with the outer electrode.

On the other hand, the present invention provides a human body contactable conductor; Circuitry; And an electric shock protection element disposed between the conductor and the circuit portion, wherein the electric shock protection element includes a first elementary body, a plurality of first inner electrodes disposed in a line in the first elementary body, An electric shock protection unit including a second internal electrode spaced apart from an electrode and another column; An outer electrode formed on an outer surface of the first element to be electrically connected to the first inner electrode and the second inner electrode; And a glass coating layer formed on the outer surface of the body including at least an area where the outer electrode and the outer surface of the body contact each other.

In addition, the conductor may include at least one of an antenna, a metal case, and conductive ornaments for communication between the electronic device and an external device.

In addition, the metal case may be provided to partially surround or entirely surround the side of the housing of the electronic device.

In addition, the metal case may be provided to surround the camera, which is exposed to the outside on the front surface or the rear surface of the housing of the electronic device.

The present invention also relates to a human body contactable conductor; Circuitry; And an electric shock protection element disposed between the conductor and the circuit portion, wherein the electric shock protection element includes a first elementary body, a plurality of first inner electrodes disposed in a line in the first elementary body, An electric shock protection unit including a second internal electrode spaced apart from an electrode and another column; And a capacitor electrode provided in the second elementary body so that at least a part of the surfaces of the second elementary body and the electrode disposed on one side of the first elementary body of the electric shock protection element for allowing the communication signal flowing from the conductor to pass therethrough, A capacitor portion; An external electrode formed on an outer surface of the first and second main bodies so as to be electrically connected to the first internal electrode, the second internal electrode, and the capacitor electrode; And a glass coating layer formed on the outer surface of the body including the outer surface of the body including the first body and the second body and the region where the outer electrode abuts the body, and a portable electronic device having an electric shock protection function.

The present invention also provides a method of manufacturing a semiconductor device, comprising the steps of: (1) sintering a multilayer body including a plurality of first internal electrodes arranged in a line spaced apart and a second internal electrode spaced apart from the other first internal electrodes; ; (2) forming a glass coating layer on the outer surface of the first elementary body including at least the first outer surface of the first elementary body in a region corresponding to the inner electrode of the first elementary body; And (3) forming an external electrode to be electrically connected to the internal electrode.

(A) a first laminate including a plurality of first inner electrodes spaced in a line and a second inner electrode spaced apart from the other first inner electrodes; Forming a first body and a second body by sintering a second layered body disposed on one side of the first layered body including capacitor electrodes provided so as to overlap each other; (B) an outer surface of a first elementary body including at least an outer surface of a first elementary body of a region corresponding to an inner electrode of the first elementary body and a second elementary body outer surface corresponding to a capacitor electrode of the second elementary body, Forming a glass coating layer on the substrate; And (C) forming an external electrode to be electrically connected to the internal electrode and the capacitor electrode.

An electric shock protection device and a portable electronic device having the same according to an embodiment of the present invention include an electric shock protection device for connecting a conductor and a circuit portion in a portable electronic device in which a conductor such as a metal case is exposed to the outside, It protects the user and internal circuits from leakage current and static electricity and realizes high capacitance, minimizing the attenuation of the communication signal and delivering it.

1 is a perspective view of an electric shock protection device according to an embodiment of the present invention. FIG. 1B is an exploded perspective view of an electric shock protection unit included in an electric shock protection device, and FIG. 1C is a longitudinal sectional view of FIG. 1A,
2 is a longitudinal sectional view of an electric shock protection device according to an embodiment of the present invention,
FIG. 3 is a view showing an electric shock protection unit included in an embodiment of the present invention. FIG. 3 (a) is an exploded perspective view of the electric shock protection unit, FIG. 3
FIG. 4 is a perspective view of an electric shock protection unit included in an embodiment of the present invention, FIG. 4A is an exploded perspective view of the electric shock protection unit, FIG. 4B is a longitudinal sectional view of FIG.
FIG. 5 is a longitudinal sectional view of an electric shock protection unit included in an embodiment of the present invention, FIGS. 5A and 5B are diagrams illustrating various positional relationships of internal electrodes included in the electric shock protection unit,
FIG. 6 is a perspective view of an electric shock protection device according to an embodiment of the present invention. FIG. 6B is an exploded perspective view of the electric shock protection device included in the electric shock protection device. 6C is a longitudinal sectional view of FIG. 6A,
7A and 7B are views showing various arrangements of the electric shock protection unit and the capacitor unit in the electric shock protection device according to the embodiment of the present invention,
8A to 8E are views showing various forms of a capacitor portion made of dissimilar materials in an electric shock protection device according to an embodiment of the present invention,
FIGS. 9A to 9E are conceptual diagrams showing an application example of an electric shock protection device according to an embodiment of the present invention,
10A to 10C are schematic equivalent circuit diagrams for explaining operation of (a) leakage current, (b) static electricity (ESD), and (c) communication signal of the electric shock protection device according to the embodiment of the present invention,
11A and 11B show simulation results of the pass frequency band according to the capacitance,
Figs. 12A and 12B are SEM photographs of the surface of a sintered body, Fig. 12A is a photograph of a surface of a sintered body having no glass coating layer formed thereon, and Fig. 12B is a photograph of a sintered body surface after a glass coating layer is formed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

1A to 1C, an electric shock protection device 100 according to an embodiment of the present invention includes a first varistor sheet layer 111 and a second varistor sheet layer 112, And an electric shock protection unit 110 including a plurality of internal electrodes 111a and 111b and a plurality of internal electrodes 111a and 111b and 112a. The electric shock protection unit 110 may be, for example, a varistor.

The electric shock protection element 100 is disposed between the human-contactable conductor of the electronic device and the internal circuit part, passes the static electricity without being broken down in insulation when the static electricity flows from the electric conductor, and the leakage current The following conditions can be satisfied for this purpose:

Vbr> Vin where Vbr is the sum of the breakdown voltages formed between the nearest first internal electrodes 111a and 111b and the second internal electrode 112a and Vin is the rated voltage of the external power supply of the electronic device. The rated voltage may be a standard rated voltage for each country, for example, 240V, 110V, 220V, 120V, 110V, and 100V.

At this time, the first core bodies 111 and 112 include a first varistor sheet layer 111 having first internal electrodes 111a and 111b formed on at least one surface thereof and a second varistor sheet body 111 having at least one surface formed with second internal electrodes 112a. The sheet layers 112 may be alternately stacked and then integrally formed through a squeezing and sintering process.

The first elementary body 111 and the second element 112 may be formed through a varistor composition so as to realize a varistor type electric shock protection unit. There is no limitation to the varistor composition, and a known varistor composition may be used. For example, the first core bodies 111 and 112 may be formed by laminating a plurality of sheet layers 111 and 112 formed through a varistor composition, and sintering the same. The plurality of sheet layers 111 and 112 may be formed of the same varistor composition, or may be formed of at least two varistor compositions, respectively. The sheet layers 111 and 112 may be alternately stacked, May be stacked or randomly stacked.

When the electric shock protection housing according to an embodiment of the present invention is not further provided with a capacitor unit 120 to be described later, the first elementary bodies 111 and 112 included in the electric shock protection unit 110 can prevent data loss in the communication frequency range A dielectric constant of 20 or more can be satisfied. Specifically, an electric shock protection device realized through a substantially low-permittivity element can be easily implemented to realize a low-capacitance electric shock protection device. A low-capacitance electric shock protection device is a device in which a low- There is a problem of accelerating data loss in a communication frequency band used by an electronic device having the electronic device. Therefore, an electronic device having frequent data communication with an external device is not suitable for a low electrostatic capacity can do. In order to solve the problem of data loss due to such an electric shock protection device, it is possible to assume that the electrostatic capacity of the electric shock protection device is increased to a certain value or more. For this purpose, a method of increasing the surface area of the body of the electric shock protection device, A method of reducing the distance between the internal electrodes provided in the internal electrode and / or a method of increasing the overlapping area between the internal electrodes may be considered. However, it is not desirable to increase the overlap area between the internal electrodes or to increase the surface area of the body in consideration of the tendency to implement electronic devices such as portable devices which are small and light in recent years. In addition, reducing the distance between the internal electrodes provided inside the body may weaken resistance to static electricity and fail to achieve a level for which leakage current interruption is desired. Therefore, in order to satisfy the basic physical property of protecting the user from electric shock due to the circuit protection from the static electricity and the leakage current that the electric shock protection device must express, and to prevent communication data loss, the distance between the internal electrodes, And porosity should be considered together with the dielectric constant of the sintered body at the same time. Preferably, when the dielectric constant of the sintered body satisfies 20 or more, more preferably 38 or more, There is an advantage that can be advantageous. If the dielectric constant of the body is less than 20, there is a problem that the data communication efficiency and the communication distance of the electronic device can be remarkably reduced even when there is no problem in the electrostatic shielding of the electric shock protection element and the physical property of the leakage current shielding.

The internal electrodes included in the first body 110 and the first varistor sheet layer 111 are formed on the first varistor sheet layer 111 and the first internal electrodes 111a and 111b, 112 formed on the first and second inner electrodes 112a, 112b.

The internal electrodes 111a, 111b, and 112a may be any conventional electrode material, and may include any one or more of Ag, Au, Pt, Pd, Ni, and Cu. , Ag / Pd. The first inner electrodes 111a and 111b and the second inner electrodes 112a may have a thickness of 2 to 10 탆. If the thicknesses of the first and second inner electrodes 111a and 111b and the second inner electrode 112a are less than 2 m, they can not serve as the inner electrode. If the thickness is more than 10 m, The thickness of the inner electrode or varistor sheet layer arranged in parallel increases, and the overall size of the electric shock protection device 100 increases, which may adversely affect miniaturization.

The breakdown voltage Vbr of the electric shock protection device 100, more specifically, the electric shock protection unit 110 is a unit breakdown voltage (Vbr) formed between the first adjacent first internal electrodes 111a and 111b and the second internal electrode 112a, Voltage. That is, the breakdown voltage Vbr of the electric shock protection unit 110 is a unit breakdown voltage formed between the first internal electrodes 111a and 111b and the second internal electrode 112a, May be determined according to the number of the electrodes 111a and 111b and the number of the second internal electrodes 112a. 1A to 1C, a unit element (unit breakdown voltage) formed by the first internal electrodes 111a and 111b and the second internal electrode 112a is 2, but the present invention is not limited thereto, As shown in FIG. Specifically, in FIG. 3B, the number of unit devices may be four, that of FIG. 5A may be eight, and that of FIG. 5B may be five.

The first internal electrodes 111a and 111b and the second internal electrodes 112a may be arranged in a line so that at least a part of the first internal electrodes 111a and the second internal electrodes 112a overlap with each other. Or alternately disposed between each other so as not to overlap with each other.

At this time, the first internal electrode or the second internal electrode does not leak static electricity or leakage current to adjacent external electrodes (not shown) of the internal electrodes 111a, 111b, and 112a, It is preferable that the interval is set so as to proceed normally.

For example, a distance L between any two first internal electrodes 111a and 111b disposed adjacent to and closest to the second internal electrode 112a of the plurality of first internal electrodes 111a and 111b, May be formed to be larger than the sum of the shortest distances d1 and d2 between the two first inner electrodes 111a and 111b and the second inner electrode 112a.

The distance between the second internal electrode 112a and the adjacent external electrodes 131 and 132 may be greater than the distance between the first internal electrodes 111a and 111b.

More specifically, the first varistor sheet layer 111 may include two first internal electrodes 111a and 111b, and the two first internal electrodes 111a and 111b may be arranged on the same plane As shown in FIG. The second varistor sheet layer 112 may include at least one second internal electrode 112a on one surface thereof.

At this time, the first varistor sheet layer 111 and the second varistor sheet layer 112 are stacked in the vertical direction so that the second internal electrode 112a forms a different row from the two first internal electrodes 111a and 111b The first varistor sheet layer 111 and the second varistor sheet layer 112 may be stacked in the upward and downward directions.

In addition, the second internal electrode 112a may be disposed such that both end portions thereof overlap with one end side of the first internal electrodes 111a and 111b. For this purpose, the center of the second internal electrode 112a may be located at the center of the gap L1 formed between the two first internal electrodes 111a and 111b.

Here, the first varistor sheet layer 111 in which two first internal electrodes 111a and 111b are formed is a second varistor sheet layer in which one second internal electrode 112a is formed as shown in FIG. 1C 112 and may be deposited on the bottom of the second varistor sheet layer 112, as shown in FIG.

When the plurality of sheets are stacked, the electric shock protection portion 210 may be stacked such that the second varistor sheet layer 212 is interposed between the first varistor sheet layers 211 as shown in FIG. 3A, A varistor sheet layer in which internal electrodes are not formed above and below the sheet layer 211 may be further laminated. 3B, the distance between the first internal electrodes 211a and 211b may be greater than the sum of distances between the first internal electrodes 211a and 211b and the second internal electrodes 212a.

In another example, the electric shock protection unit 210 'may be laminated so that the first varistor sheet layer 211 is interposed between the second varistor sheet layers 212 as shown in FIG. 4A, and the first varistor sheet layer And the varistor sheet layer on which the internal electrodes are not formed may be further laminated on the upper and lower portions of the varistor sheet 211. 4B, the distance between the first internal electrodes 211a and 211b is larger than the sum of the distances between the first internal electrodes 211a and 211b and the second internal electrodes 212a at the upper portion and / .

The external electrodes 131 and 132 may be formed on the outer surfaces of the first and second bodies 110 and 112 so as to be electrically connected to the internal electrodes 111a and 111b and 112a. For example, And may be formed to cover both the top and bottom surfaces of both ends and both ends of the body as shown in Fig. For example, the outer electrode may have a thickness of 10 to 30 탆 and a width of the outer electrode may be formed to be longer than an outer electrode thickness of a surface on which the inner electrode protrudes, but the present invention is not limited thereto, Can be changed according to the width of the internal electrode.

The outer electrode may further include a plating layer (not shown) on the surface of the electrode to further improve ease of soldering and electrical connection when the device is mounted on a circuit board by flow soldering or the like. The plating layer may be formed using a conventional plating method, and may include at least one of metals such as nickel, tin, copper, and tin-lead alloys. At this time, when two or more kinds of metals are included, two or more kinds may be included in one layer in the form of a mixture or an alloy, or a plating layer may be formed of a plurality of layers and each layer may be formed of one kind of metal . The thickness of the plating layer may be 0.1 to 5 탆, but is not limited thereto.

On the other hand, a glass coating layer 141 is formed on the outer surface of the elementary body including at least a contact region (A in FIG. 1A) between the first elementary body 111 and the external electrodes 131 and 132 described above, As shown in Fig.

The glass coating layer 141 can prevent peeling of the elementary body, which may be formed by stacking a plurality of sheets, between the sheets, thereby improving the mechanical strength of the elementary body, further improving the adhesion between the external electrode and the elementary body, 131, and 132, the plating solution can be prevented from spreading and the plating solution can be prevented from penetrating into the inside of the body. In addition, it is possible to prevent corrosion of the surface of the electric shock protection device or penetration of the solvent into the inside of the body due to the solvent (Ex.Flux) which is treated for improving the lead wettability by removing the foreign substance at the area to be soldered when the electric shock protection device is mounted on the substrate .

If the thickness is less than 0.5 탆, the glass coating layer 141 may have a thickness of 0.5 to 10 탆. If the thickness of the glass coating layer 141 is less than 0.5 탆, the adhesion enhancement effect with a desired external electrode may be insignificant. It may not be able to properly perform a barrier function to prevent penetration into the interior. In addition, if the thickness of the glass coating layer is more than 10 mu m, a problem of electrical connection between the external electrode and the internal electrode may occur, thereby limiting the function of the device.

As described above, the electric shock protection housing according to an embodiment of the present invention includes (1) a plurality of first internal electrodes spaced in a line and a second internal electrode spaced apart from the first internal electrodes Sintering the laminate to produce a first body; (2) forming a glass coating layer on the outer surface of the first elementary body including at least the first outer surface of the first elementary body in a region corresponding to the inner electrode of the first elementary body; And (3) forming an external electrode to be electrically connected to the internal electrode.

First, in step (1), a first varistor sheet layer 111 and a second internal electrode 112a including first internal electrodes 111a and 111b are provided as shown in FIG. 1B And the second varistor sheet layer 112 are successively laminated on the first varistor sheet 112, the first varistors 111 and 112 can be manufactured. At this time, the varistor sheet layers 111 and 112 may be laminated so that the first internal electrodes 111a and 111b and the second internal electrode 112a are arranged as desired electrodes, and the pressing process may be further performed before the sintering process.

The varistor sheet layers 111 and 112 can be manufactured by press molding the varistor sheet forming composition into a sheet form. The composition for forming a varistor sheet may include a varistor forming component, and may further include a binder, a curing agent, a solvent, and the like. The varistor forming component may include at least one of a semiconductive material, a Pr-based material, and a Bi-based material including at least one of ZnO, SrTiO ₃ , BaTiO ₃ , and SiC. The average particle diameter of the varistor forming component powder may be 0.1 to 5 占 퐉, for example, 0.1 to 1 占 퐉. If the average particle diameter of the powder is less than 0.1 占 퐉, there may be a problem of greatly increasing the manufacturing cost. If the average particle diameter exceeds 1 占 퐉, if two or more kinds of varistor forming components are mixed for controlling the sintering temperature, The sintered body may not be uniformly mixed and there may be a problem that the first sintered body does not have a proper volume shrinkage ratio after sintering.

Accordingly, the varistor forming component may be pulverized through mechanical milling or the like so as to have an aimed average particle size before mixing with the binder, and then dried. The drying process may be performed at a temperature of 50 to 200 for 30 minutes to 10 hours, but is not limited thereto. After the drying process, the final dielectric powder can be prepared by further pulverizing to have the desired average particle size.

The binder can be used without limitation in the case of a binder used for producing a known green sheet, and as a non-limiting example thereof, a polyvinyl butyral resin, a polyvinylacetate resin, and a polyacrylic resin And the like. The binder may be mixed in an amount of 1 to 30 parts by weight based on the total weight of the varistor forming component and the binder. If the binder is contained in an amount of less than 1 part by weight, the binder strength of the varistor-forming component is lowered, and the mechanical strength of the body may be considerably lowered even after sintering. In addition, if the binder is contained in an amount exceeding 30 parts by weight, the air permeability of the sheet itself after being manufactured into a sheet form is not good, and an internal air trap may occur when a thick film staking method is applied. And the adhesion may be increased even with a small amount of moisture, and workability may be deteriorated, and volume shrinkage during drying of the sheet is remarkable, and there is a possibility that the sheet bends or the quality of the surface is deteriorated.

Further, the solvent may be water, a known organic solvent, and may vary depending on the specific kind of the binder selected, so that the present invention is not particularly limited thereto.

The above-described varistor sheet-forming composition can be molded into a single sheet layer, for example, by press molding. The press molding may be performed using a general press molding method used in the art. For example, the granules are put into a molding mold having a diameter of 7.0 to 10.0 mm, and then a pressure of 800 to 1,200 kg / A press molded product to be produced can be produced. Thereafter, the first internal electrodes 111a and 111b and the second internal electrodes 112a may be formed on one surface of the sheet, for example, the first varistor sheet layer 111 and the second varistor sheet layer 112, respectively. have. The inner electrodes 111a, 111b and 112a may be formed by a known method. The inner electrodes 111a, 111b and 112a may be formed by any known method. For example, the inner electrodes 111a, 111b and 112a may be formed by applying, .

The varistor sheet layers 111 and 112 formed on one surface of the internal electrodes 111a, 111b and 112 manufactured as described above can be stacked to form a desired electrode arrangement in a sintered body and then can be realized as the first sintered bodies 111 and 112 through a sintering process have. The sintering process can be performed, for example, by electric sintering using a silver (Ag) electrode, and the electric sintering can be performed at 850 to 950 ° C, preferably 880 to 940 ° C. If the temperature is lower than 850 ° C, sintering may not be smoothly performed. If the temperature is higher than 950 ° C, the material of the internal electrodes 111a, 111b, and 112 may be limited. For example, It may be necessary to change to a silver-palladium (Ag-Pd) alloy electrode. However, the temperature at the time of sintering is not limited to this, and may be changed depending on the kind of the varistor forming component contained in the varistor sheet layer, the type of the binder, and the material of the internal electrode. The electric shock protection device 100 including the electric shock protection unit 110 in which the first elementary bodies 111 and 112 are integrally formed through the above-described method can be implemented. At this time, it is preferable to set the particle diameter of the sintered particles contained in the varistor sheet layer after sintering so as to satisfy the breakdown voltage (Vbr).

Etching the outer surface of the first body by the step 1-2) of the first body produced through steps 1-1) described above.

The etching is performed by protruding the internal electrodes 111a, 111b and 112 inside the first body 111 and 112 to improve the electrical contact with the external electrodes 131 and 132 and to prevent the glass component of the glass coating layer 141 from contacting with the first body 111 and 112) to improve the adhesion between the outer surface and the glass coating layer 141, thereby suppressing the stabilization of the glass coating layer 141 and the coating blur.

The etching can be carried out through conventional dry etching or wet etching, for example, through a hydrochloric acid solution when wet etching is performed. The hydrochloric acid solution may be used at a concentration of 1 to 50 vol%, and the concentration may be changed according to the size and composition of the first body to be etched. Also, the etching time can be performed for 1 minute to 24 hours, and the etching time can be changed depending on the size of the body and the concentration of the etching solution used. Meanwhile, the step 1-2) should be performed at an appropriate level, and the degree of surface corrosion of the first element is too high when the first element is etched and the glass coating layer is not formed properly in step 2) The glass coating layer is unstable, and the coating blur increases, and / or the electrical characteristics of the electric shock protection device, for example, the insulation resistance IR can be reduced. If the etching is performed in a small amount, the electrical contactability between the internal electrodes 111a and 112a and the external electrodes 131 and 132 is reduced to deteriorate the electrical characteristics such as the breakdown voltage Vn and the electrostatic capacitance Cp of the electric shock protection device There is a problem. Also, even with a small impact, the glass coating layer 141 produced in the step (2) to be described later may be broken, and the coating blur may be significantly increased.

After the step 1-2), the washing process can be further performed, thereby preventing the over-drying. The washing process may be carried out through a conventional method using water or a conventional organic solvent or solution used in a washing process, so that the present invention is not particularly limited thereto.

Meanwhile, between the steps 1-1) and 1-2), it is possible to further polish the edges of the first elementary body 111 and the second element, and thereby the thickness of the glass coating layer in step 2) It is possible to improve the surface uniformity and increase the curvature of the edges and the triple points of the first elementary body to improve the thickness of the external electrode at the corresponding point and to reduce the defects due to plating blurring and electrode damage.

The polishing may be performed by a known method, and may be performed using an abrasive or a grinding stone. Depending on the surface area of the first body, the number of revolutions for polishing, the amount of distilled water supplied, and the like may be changed.

Meanwhile, a heat treatment process may be further performed before the polishing process to volatilize the binder and the solvent that may be present in the first body. If the binder or the solvent remains in the first elementary body, there is a problem that the defective rate due to the sticking phenomenon between the first elementary body and the inner wall or the first elementary body due to frictional force generated during the polishing process may increase. The heat treatment may be performed at a temperature of 500 to 800 ° C for 1 minute to 24 hours, but may be changed depending on the type of the varistor forming component, the solvent, and the organic solvent of the first body.

Next, in step (2), a step of forming a glass coating layer on the outer surface of the first elementary body including at least the first outer surface of the first elementary body in a region corresponding to the inner electrode of the first elementary body may be performed, 2-1) treating a glass coating layer forming composition on an outer surface of a first body; And 2-2) drying the glass coating layer forming composition; 2-3) ball milling the surface of the dried glass coating layer-forming composition; And 2-4) firing the glass coating layer-forming composition.

First, in step 2-1), the glass coating layer may be formed by treating a part or all of the outer surface of the first body with a glass coating layer forming composition, wherein the glass coating layer forming composition includes a glass component, a binder component, and a solvent can do. Wherein the glass component is selected from the group consisting of aluminum, silicon, germanium, indium, tin, lead, phosphorous, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, erbium, Titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum. The glass component may preferably comprise silicon, zinc, manganese, magnesium, potassium, calcium and boron. The content of each of the elements is 10 to 35% by weight of silicon, 5 to 15% by weight of manganese, 0.5 to 5% by weight of magnesium, 2 to 10% by weight of potassium, 3 to 10% by weight of calcium, 2 to 10% %, Zinc 5-15% by weight, but it is not limited thereto, and it is possible to reduce the content of some components and increase the content of the other components, or to add other kinds of components not described . The glass component may be included in the composition as a granule, and the average particle diameter of the glass component may be 0.1 to 10 탆, but is not limited thereto. In addition, it is more preferable to use the glass component having a uniform particle size distribution, whereby the thickness of the glass coating layer can be made uniform, and the formed coating layer can be more stably bonded to the outer surface of the body.

The glass coating layer forming composition may be prepared by dipping the first core bodies 111, 112 and 113 into a glass coating layer forming composition or by blending, flow coating, casting, printing, transfer, Or spraying or the like to be treated on the outer surface of the first body. At this time, when the composition for forming a glass coating layer is over-treated, cracks may be generated in the glass coating layer. If the composition is less treated, the mechanical strength of the glass coating layer may be lowered.

Next, the drying step of the composition for forming a glass coating layer can be performed in step 2-2), and the formation of the glass coating layer can be facilitated through the drying step. The drying process may be performed at 60 to 200 ° C for 10 minutes to 2 hours, but is not limited thereto.

Next, the step of ball milling the surface of the dried glass coating layer-forming composition may be carried out in the step 2-3), thereby preventing the glass component from being clumped in the dried glass coating layer- The uniformity of the coating layer can be improved. The ball milling can be performed by a conventional method. At this time, the ball to be used may be a ball of a common material such as a ceramic material such as zirconium, and the particle diameter of the ball to be used may also be changed according to the purpose, so that the present invention is not particularly limited thereto.

Next, the step of baking the glass coating layer-forming composition may be performed in steps 2-4. The glass component can be melted on the surface of the first elementary body through the firing to form a glass coating layer through crystal growth of the elementary body surface. Specifically, it may be fired at 600 to 1000 ° C for about 10 minutes to about 2 hours in an atmospheric atmosphere or a nitrogen atmosphere. However, the firing temperature may be changed depending on the kind of the used glass component. Specifically, FIG. 12A shows the surface of the first elementary body before the formation of the glass coating layer. As shown in FIG. 12B, it can be seen that as the glass coating layer is formed, the outer appearance of the elementary body surface becomes uniform and the separation of the powder forming the elementary body can be prevented .

Next, in step (3), an external electrode is formed to be electrically connected to the internal electrode.

The external electrodes 131 and 132 may be formed by applying an external electrode forming composition to the outer surfaces of the first and second bodies 110 and 112 and then sintering the first and second bodies 111 and 112 so as to be electrically connected to the internal electrodes 111a, The composition for forming an external electrode may be used without limitation as long as it is an external electrode forming composition provided in a conventional varistor. However, it may preferably include a conductive component and a glass component, and the mechanical strength and durability of the electric shock protection device can be remarkably improved by improving the adhesive strength according to the increase in material compatibility with the body through the glass component .

The conductive component may include at least one selected from the group consisting of Ag, Au, Cu, Ni, Pd, and Pt. The conductive component may be included in the composition as a granule, wherein the average particle size of the conductive component may be 0.1 to 10 탆.

The glass component may be selected from the group consisting of aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, erbium, And may contain at least one element selected from among cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum, Or zinc, silicon, boron and aluminum. At this time, the content of each element may be 5 to 20 wt% in the external electrode forming composition based on the oxide.

The glass component may be included in the composition as a granular material. In this case, the glass component may have an average particle diameter of 0.1 to 10 mu m, thereby improving the dispersibility. Through this, the adhesion of the glass component Can be improved.

The external electrode forming composition may further include a solvent and a binder component in addition to the conductive component and the glass component.

The binder component may be used without limitation in the case of conventional binders used for producing external electrodes, and as a non-limiting example, polyvinylbutyral resin, polyvinylacetate resin, ethyl cellulose , Nitrocellulose, polyacrylic resin, and the like.

In addition, the above-mentioned solvent can be used without limitation in the case of ordinary water or organic solvent which does not affect the above-mentioned conductive component and glass component to be used, and which does not cause problems in dissolving additives such as a binder component and other dispersant. As a non-limiting example, butoxyethoxy ethyl acetate), ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monobutyl ether, propylene glycol monoethyl ether propylene glycol monomethyl ether, diethylene glycol methyl ether, glycerol, diethylene glycol ethyl ether acetate, terpineol, menthol, ), Diethylene glycol methyl ethyl ether (MEDG), and butyl diglycol (BDG), which may be used alone or in combination.

At this time, the external electrode forming composition may contain 5 to 20 parts by weight of a glass component, 1 to 10 parts by weight of a binder component and 5 to 20 parts by weight of a solvent, based on 100 parts by weight of the conductive component. If the glass component is contained in an amount of less than 5 parts by weight based on the conductive component, the adhesion strength between the desired external electrode and the body may not be exhibited. If the glass component exceeds 20 parts by weight based on the conductive component, / When the external electrode is contacted, the glass component dissolves and acts as an obstacle on the contact surface, so there may be a problem of contact failure.

The viscosity of the external electrode forming composition may be 10 to 60 Kcps as measured on Brookfield HBDV-1 SC4-14, 10 RPM. If the viscosity range is unsatisfactory, it may not be easy to form the external electrode with the desired thickness, and the dispersibility of each component in the composition is weak, so that the mechanical strength of the manufactured external electrode, There is a problem.

The external electrode forming composition described above can be applied to the outer surface of the body by a conventional method. As a non-limiting example of the coating method, a blade coating, a flow coating, a casting, A method of transfer, a method of brushing, dipping or spraying may be used. The applied external electrode forming composition can be sintered at 600 to 1000 ° C for about 10 minutes to about 2 hours in an atmospheric or nitrogen atmosphere and then dried at 60 to 200 ° C for 10 minutes to 2 hours before the sintering process have.

Meanwhile, as shown in FIG. 6, the electric shock protection device according to an embodiment of the present invention includes capacitor portions 120a and 120b for passing a communication signal flowing into a conductor without further attenuation. The capacitor portions 120a and 120b cut off the leakage current of the external power source, in particular, the DC component. The capacitor portions 120a and 120b allow the communication signal flowing from the conductor 12 to pass therethrough without being insulated from the static electricity flowing into the conductor 12 Can be satisfied: < RTI ID = 0.0 >

Vcp > Vbr where Vbr is the breakdown voltage of the electric shock protection element, and Vcp is the breakdown voltage of the capacitor portion.

The capacitor units 120a and 120b may be electrically connected in parallel to the electric shock protection unit 110 to pass the communication signal from the electric conductor 12 such as an antenna without attenuation. For example, the capacitor portions 120a and 120b may be included at one side of the first elementary body, specifically, at the top and / or bottom of the first elementary body, Or may be positioned biased either in the upper part or the lower part. The dielectric breakdown voltage (Vcp) of the capacitor portion is used to prevent the leakage current, especially the DC component, of the external power source, which flows from the ground of the circuit portion, Specifically, the breakdown voltage Vbr of the electric shock protection unit. At this time. The dielectric breakdown voltage Vcp of the capacitor units 120a and 120b is formed at both ends of the capacitor electrode included in the capacitor unit. In the case of a capacitor unit having a plurality of capacitor electrodes spaced apart from each other, Are formed between the respective capacitor electrodes as they are connected in parallel.

3B, the capacitor units 120a and 120b may be disposed on the upper and lower portions of the electric shock protection unit 110. Among them, the first capacitor unit 120a may include a capacitor electrode on one surface thereof A plurality of capacitor electrodes 121a, 122a, 123a, and 124a provided on one surface of each of the plurality of sheet layers 121, 122, 123, and 124 are sequentially stacked on top of the electric shock protection unit 110, Or may be integrally formed by forming a second body through a curing process. The second capacitor portion 120b also includes a plurality of sheet layers 125, 126, 127, and 128 stacked so that the capacitor electrodes 125a, 126a, 127a, and 128a are opposed to each other below the electric shock protection portion 110, The first capacitor unit 120a and the second capacitor unit 120b may be simultaneously sintered or cured to form a second body of each of the first capacitor unit 120a and the second capacitor unit 120b at different positions have. Alternatively, the second body may be formed by disposing the electrodes so as to have the electrode structures of the capacitor portions 120a and 120b in one sheet, and then sintering or curing the electrode.

The dielectric constant of the second elementary body 121, 122, 123, 124, 125, 126, 127, 128 may be 20 F / m or more, preferably 35 F / m or more so as to prevent attenuation of a communication signal passing therethrough. The communication signal passing through the electric shock protection element is allowed to pass through the element without attenuation and at the same time the blocking ability of the DC component in the leakage current of the capacitor portion is improved and a breakdown voltage And may not be destroyed by leakage current or static electricity. Further, it may be more advantageous to implement the device so as to be more downsized. If the dielectric constant is less than 20 F / m, there is a problem of attenuating the reception sensitivity of a communication signal in a communication signal, for example, a mobile wireless communication frequency band. In order to realize a capacitor using a low dielectric constant body with a fixed total capacitance, the distance between the electrodes must be remarkably narrowed. If there is a defect (including pores or cracks) in a body located between the electrodes, It may be highly undesirable to combine the capacitor portion designed with the electric-shock protection portion so that the distance between the electrodes is remarkably narrowed due to the fear that the breakdown may be remarkably increased. Further, the breakdown of the leakage current and / or the circuit protection function from static electricity may be degraded or lost as the breakdown voltage Vcp of the capacitor becomes lower than the rated voltage of the external power supply of the electronic device and the capacitor portion is destroyed by insulation.

The second elementary bodies 121, 122, 123, 124, 125, 126, 127, and 128 may be used without limitations in the case of a dielectric used for a capacitor, and a known dielectric may be used. For example, the dielectric forming the second body may be made of a ceramic material and a magnetic material including low temperature sintered ceramics (LTCC) and high temperature sintered ceramics (HTCC). In this case, the ceramic material may be an oxide-based ceramic compound or a non-oxide-based ceramic compound, wherein the oxide-based ceramic compound is _{BeO, MgO, LaCrO 3, PbTiO} 3, (Ba, Pb) TiO 3, ZrO 2, Er 2 O _{3, Dy 2 O 3, Ho} 2 O 3, V 2 O 5, CoO, MoO 3, SnO 2, BaTiO 3, Nd 2 O 3, SiO 2, TiO 2, ZnO, SrTiO 3, LiNbO 3, LiTaO 3, Mn-based oxides, Ni-based oxides, Mn-based oxides, Al ₂ O _3, and solid solutions thereof. The non-oxide ceramic compound may include at least one selected from SiC, CdTe, TiC, TiN, B ₄ C, Si ₃ N ₄ , BN, TiB ₂ and AlN. In addition, the magnetic material may be a ferrite compound, and may be used without limitation in the case of conventional soft ferrite. One or more of Ni-Zn ferrite and Mn-Zn ferrite may be included.

The capacitor electrode electrodes 122a, 123a, 124a, 125a, 125a, 126a, 127a and 128a may include any one or more of Ag, Au, Pt, Pd, Ni and Cu. / Pd. In addition, the capacitor electrode may be formed in various shapes and patterns, and one or more of the plurality of capacitor electrodes may be provided in the same pattern or may have different patterns. That is, the capacitor electrode is not limited to the pattern of each capacitor electrode when disposed inside the second element so as to realize the desired capacitance.

A plurality of capacitor electrodes 122a, 123a, 124a, 125a, 125a, 126a, 127a, and 128a constituting the capacitor units 120a and 120b are formed between a pair of opposing capacitor electrodes, The spacing between the first capacitor electrode 121a and the second capacitor electrode 122a in the first capacitor unit 120a may be in the range of 15 to 100 占 퐉, May be provided to have an interval.

If the distance between the capacitor electrodes is less than 15 mu m, it is difficult to ensure a sufficient capacitance for passing the communication signal of the wireless communication band without attenuation. If the distance exceeds 100 mu m, the distance between the capacitor electrodes is limited, Since the number of stacked sheet layers including the electrode is limited, it is difficult to realize a high capacity capacitor.

At this time, the thickness of each of the capacitor electrodes constituting the capacitor units 120a and 120b may be 1/10 to 1/2 of the gap between the pair of capacitor electrodes facing each other.

For example, when the interval between the pair of capacitor electrodes facing each other is 20 μm, the thickness of the capacitor electrode may be set to be in the range of 2 to 10 μm. If the thickness of the capacitor electrode is 2 mu m or less, the capacitor electrode can not function as an electrode. If the thickness of the capacitor electrode is more than 10 mu m, the thickness of the capacitor electrode becomes thick, and the distance between the capacitor electrode for forming the capacitor portion is limited. Since the number of stacked sheet layers including the electrode is limited, it is difficult to realize a high capacity capacitor.

The shortest distance d2 between the free ends of the capacitor electrodes that are not connected to the external electrodes and the external electrodes 131 and 132 is at least 15 mu m and the distance between 15 and 100 mu m is Respectively.

6, one capacitor electrode 121a is not formed in one sheet layer 121, and one capacitor electrode 121a is formed in one sheet layer (not shown) A plurality of capacitor electrodes (not shown) arranged in a line in a row on the plurality of capacitor electrodes, and a plurality of sheet layers each including a plurality of capacitor sheet electrodes on one surface thereof, They may be arranged to face each other so as to have an overlapping area equal to or larger than the area. For example, the number of capacitor electrodes formed in one sheet layer may be two, the spacing distance may be 50 탆, and one of the two capacitor electrodes may be 120 탆 long and 360 탆 wide, One of the two capacitor electrodes included in one sheet layer may have a length of 1010 mu m and a width of 360 mu m and a total of twelve such sheet layers may be stacked, Layers of the two capacitor electrodes included in the layer were stacked so that the overlapped areas of the long length capacitor electrodes included in the two adjacent sheet layers were alternately stacked so as to have a width of 360 x 840 m in length After sintering, the capacitor part can be realized.

As described above, the electric shock protection device 100 is provided with the capacitor portions 120a and 120b so as to pass the static electricity and to block the leakage current of the external power source, and to have a capacitance suitable for the communication band In particular, when the second element body having a dielectric constant of 20 F / m or more is included, the desired physical properties are more easily realized and the remarkably improved physical properties can be exhibited. That is, unlike the prior art in which a separate component for increasing RF reception sensitivity is used together with a suppressor, a varistor or a Zener diode for protecting the internal circuit against static electricity by such a capacitor unit, It is possible to increase the RF reception sensitivity as well as to protect the static electricity through the antenna 100. [

Meanwhile, the above-described electric shock protection unit 110 and the capacitor units 120a and 120b are electrically connected to each other in parallel so that the first elementary body is disposed on one side of the second elementary body, thereby realizing an electric shock protection element. As shown in FIG. 6, the first elementary body may be disposed between the second elementary bodies 121, 122, 123, and 124 of the first capacitor unit 120a and the second elementary bodies 125, 126, 127, and 128 of the second capacitor unit 120b. The capacitor electrodes 121a, 122a, 123a, 124a, 125a, 126a, 127a, and 128a of the first internal electrodes 111a and 111b and the second internal electrode 112a of the protection unit 110 and the capacitor electrodes 120a and 120b May be electrically connected to the external electrodes 131 and 132 provided at both ends of the stacked second elementary body and the first elementary body, respectively. In addition, the external electrodes 131 and 132 are electrically connected to the human body-accessible conductor of the electronic device, respectively, so that the electric shock protection unit and the capacitor unit can be electrically connected in parallel.

Meanwhile, the electrodes included in the electric shock protection unit 110 and the capacitor units 120a and 120b may have different electrode pitches, electrode lengths, and / or electrode widths.

The distance between the capacitor units 120a and 120b and the electric shock protection unit 110 is determined by the shortest distance between the first internal electrode 111a and the second internal electrode 112a, May be greater than the sum of the shortest distance between the electrode 111b and the second internal electrode 112a. That is, a sufficient gap is secured between the internal electrodes 111a, 111b and 112a so that static electricity or leakage current flowing along the first internal electrodes 111a and 111b or the second internal electrodes 112a does not leak to the adjacent capacitor electrodes . Referring to FIG. 6, the distance between the capacitor unit 120a and the electric shock protection unit 110 is the distance between the capacitor electrode 120a and the electric shock protection unit 110, which is closest to the electric shock protection unit 110 among the plurality of capacitor electrodes included in the capacitor unit 120a. Means the distance between the capacitor electrode 121a located nearest to the internal electrode 112a and the nearest internal electrode 112a or 112b among the internal electrodes provided in the electric shock protection unit 110. [ At this time, the distance between the capacitor units 120a and 120b and the electric shock protection unit 110 may be 15 to 100 m, and the distance between the first internal electrodes 111a and 111b and the second internal electrodes 112a It is preferable that the interval is two times or more larger than the interval. For example, when the interval between the first internal electrodes 111a and 111b and the second internal electrode 112a is 10 m, the distance between the capacitor portions 120a and 120b and the electric shock protection portion 110 is Or more.

Meanwhile, the electric shock protection unit 110 and the capacitor units 120a and 120b may be formed by stacking a plurality of sheet layers forming a second elementary body in a case where the element body included in each of the electric shock protection unit 110 and the capacitor units 120a and 120b is formed by sintering after a single- A plurality of sheet layers for forming a first sintered body are laminated on the first sintered body, and a plurality of sheet layers for forming a second sintered body on the first sintered body are stacked to form a second sintered body, An integrated electric shock protection device can be realized. Or the second sintered body formed by sintering and the first sintered body may be laminated in a desired arrangement to form an electric shock protection element. The method of forming the electric shock protection element is not particularly limited.

6B, the glass coating layer 142 including the capacitor portions 120a and 120b may be formed on the exposed surface of the elementary body including the first and second elementary bodies, and the glass coating layer 142 May be formed to include at least the exposed surface of the body corresponding to the portion where the external electrodes 131 and 132 are formed. Preferably, the first body and the second body are stacked in order to protect the inside of the body from the mechanical strength of the body, And may be formed on the entire exposed surface of the second body. The external electrodes 131 and 132 may be electrically connected to the capacitor electrodes 121a, 122a, 123a, 124a, 125a, 126a, 127a, and 128a as well as the internal electrodes 111a, 11a, and 112 of the electric shock protection unit 110 And may be formed on the outer surface of the body.

6 includes (A) a first laminated body including a plurality of first internal electrodes arranged in a line and a second internal electrode spaced apart from the first internal electrodes by a distance from the first internal electrodes, and The method comprising the steps of: preparing a first and a second body by sintering a second layered body disposed on one side of the first layered body including capacitor electrodes provided so that at least a part of the electrodes overlap each other; (B) an outer surface of a first elementary body including at least an outer surface of a first elementary body of a region corresponding to an inner electrode of the first elementary body and a second elementary body outer surface corresponding to a capacitor electrode of the second elementary body, Forming a glass coating layer on the substrate; And (C) forming an external electrode to be electrically connected to the internal electrode and the capacitor electrode.

First, the method of manufacturing the first laminate in the step (A) is the same as the one described in the step (1) of the example of manufacturing the electric shock protection device described above, and a detailed description thereof will be omitted. Also, in the second laminate, a plurality of sheets are formed through the composition for forming a capacitor sheet as in the above-described step (1), and capacitor electrodes are formed on one surface of the sheet so as to have a desired width and thickness And then laminating them. At this time, the capacitor sheet forming composition may include a dielectric component instead of the varistor forming component of the varistor sheet layer forming composition, and the dielectric component includes low temperature sintered ceramics (LTCC) and high temperature sintered ceramics A ceramic material and a magnetic material. In this case, the ceramic material may be an oxide-based ceramic compound or a non-oxide-based ceramic compound, wherein the oxide-based ceramic compound is _{BeO, MgO, LaCrO 3, PbTiO} 3, (Ba, Pb) TiO 3, ZrO 2, Er 2 O _{3, Dy 2 O 3, Ho} 2 O 3, V 2 O 5, CoO, MoO 3, SnO 2, BaTiO 3, Nd 2 O 3, SiO 2, TiO 2, ZnO, SrTiO 3, LiNbO 3, LiTaO 3, Mn-based oxides, Ni-based oxides, Mn-based oxides, Al ₂ O _3, and solid solutions thereof. The non-oxide ceramic compound may include at least one selected from SiC, CdTe, TiC, TiN, B ₄ C, Si ₃ N ₄ , BN, TiB ₂ and AlN. In addition, the magnetic material may be a ferrite compound, and may be used without limitation in the case of conventional soft ferrite. One or more of Ni-Zn ferrite and Mn-Zn ferrite may be included. In addition, the capacitor electrode is the same as the internal electrode forming composition in the above-described step (1), and the forming method is the same, and a detailed description thereof will be omitted. A specific method of laminating and sintering the first and second laminated bodies manufactured in the same manner is also the same as the sintering step in step (1) described above. However, depending on the specific constituents of the sheet included in the second laminate The sintering conditions may be changed. On the other hand, the first and second main bodies are obtained by simultaneously sintering the first and second stacked bodies as in the step (A) to form the first and second sintered bodies independently and sintered Two bodies may be stacked.

Meanwhile, the outer surfaces of the first and second sintered bodies sintered through step A-1 may be subjected to an etching process (step A-2). In addition, the first and second main bodies having the outer surface etched may further include an edge and a triple point to further polish the outer surface, and the specific method is the same as the description of the step (1).

Thereafter, a glass coating layer may be formed on the outer surfaces of the first and second polished bodies (step B). 3, the glass coating layer 142 including the capacitor portions 120a and 120b may be formed on the exposed surface of the body including the first and second bodies. In this case, The surface on which the coating layer 142 is formed may be formed to include at least a surface on which external electrodes are formed so as to come into contact with the elementary body. Preferably, the surface of the first elementary body 142, And a glass coating layer 142 may be formed on the exposed front surface of the second body. The step (B) may be performed through a step (B-1), a drying step (B-2), a ball milling step (B-3) and a firing step (B-4) The specific method is the same as the description of step (2).

After the formation of the glass coating layer 142, a step of forming the external electrode may be performed in step (C). The external electrodes 131 and 132 are electrically connected to the capacitor electrodes 122a, 123a, 124a, 125a, 125a, 126a, 127a, and 128a as well as the internal electrodes 111a and 112b of the electric shock protection unit 110, And the specific method is the same as the description of step (3) described above.

7 to 8, various embodiments of the electric shock protection device according to the embodiment of the present invention will be described in more detail. As shown in FIG. 7A, the electric shock protection device 100 ' A plurality of electric shock protection units 110 may be provided in the up / down direction of the unit 120. [ At this time, the internal electrodes of the electric shock protection unit 110 and the capacitor electrodes of the capacitor unit 120 may be configured to have the same interval between the electrodes facing each other, but as shown in FIG. 7B, . That is, the intervals d1 and d2 between the adjacent internal electrodes of the electric shock protection unit 110 and the interval between the adjacent capacitor electrodes of the capacitor unit 120 are the same, And the interval d3 between the capacitor electrodes of the adjacent capacitor portions 120 may be larger than the interval between the internal electrodes or the capacitor electrodes.

In addition, the number of the capacitor unit 120 and the electric shock protection unit 110 constituting the electric shock protection device 100 'is not limited and may be provided in various numbers in order to secure resistance against a desired capacitance and static electricity, The stacking relationship of the capacitor 110 and the capacitor 120 may be variously changed.

In another embodiment, as shown in Figs. 8A to 8E, the plurality of sheet layers constituting the capacitor portion 120 may be made of different kinds of ceramic materials.

More specifically, at least one of the plurality of sheet layers constituting the capacitor section 120 may use the first ceramic material (A), and the remaining sheet may use the second ceramic material (B).

At this time, the first ceramic material and the second ceramic material may be heterogeneous ceramic materials. Here, the meaning of 'heterogeneous' means that the physical properties are mutually consulted even if the chemical formulas are different from each other or the chemical formulas are the same.

That is, the first ceramic material and the second ceramic material include at least one selected from Er ₂ O ₃ , Dy ₂ O ₃ , Ho ₂ O ₃ , V ₂ O ₅ , CoO, MoO ₃ , SnO ₂ and BaTiO ₃ Metal oxide compound, ferrite, low temperature co-fired ceramic (LTCC), high temperature co-fired ceramic (HTCC), or the like.

In addition, the first ceramic material is _{Er 2 O 3, Dy 2 O} 3, Ho 2 O 3, V 2 O 5, CoO, MoO 3, SnO 2 And BaTiO ₃ , the second ceramic material may be made of ferrite, the first ceramic material is made of low temperature co-fired ceramic (LTCC), and the second ceramic material is made of high temperature Or may be made of co-fired ceramics (HTCC).

Further, the first ceramic material and the second ceramic material include at least one selected from Er ₂ O ₃ , Dy ₂ O ₃ , Ho ₂ O ₃ , V ₂ O ₅ , CoO, MoO ₃ , SnO ₂ and BaTiO ₃ Metal-based oxide compounds, and may be made of one selected from ferrite.

That is, the first ceramic material and the second ceramic material may be formed in various forms of metal oxide compound, ferrite, low temperature co-fired ceramic (LTCC), and high temperature co-fired ceramic (HTCC) Or cured.

Meanwhile, in the capacitor portion 120 made of a different type of ceramic material in the electric shock protection device 100 "according to the embodiment of the present invention, the first and second ceramic materials of different types are connected to the electric shock protection portion 110 As shown in FIG.

As shown in FIG. 8A, the capacitor part 120 bonded to the upper part or the lower part of the electric shock protection part 110 is made of the first ceramic material A, and the capacitor located at the uppermost layer and the lowermost layer of the electric shock protection element 100 " The portion 120 may be made of the second ceramic material B. [

Hereinafter, for convenience of description, it is assumed that the second ceramic material is a heterogeneous material.

8A to 8D show various arrangement relationships of the first ceramic material and the second ceramic material. The non-hatched portion (A) means that the sheet is made of the first ceramic material, and the hatched portion (B) in the figure means that the sheet is made of the second ceramic material. That is, in FIGS. 8A to 8D, the reference numerals A and B refer to the material of the sheet.

Specifically, as shown in FIG. 8B, the entire plurality of sheet layers constituting the capacitor portion 120 may be formed of one of the first ceramic material A or the second ceramic material B.

8C and 8D, a portion of the plurality of sheets constituting the capacitor portion 120 is made of the first ceramic material A, and among the plurality of sheets constituting the capacitor portion 120, And the remaining sheet may be made of a different second ceramic material (B).

As described above, in the electric shock protection device 100 '' according to the embodiment of the present invention, the first ceramic material A and the second ceramic material B are selected and the first ceramic material A, which is a different kind of ceramic material, By arranging the capacitor portions 120a and 120b at appropriate positions, the capacitor portions 120a and 120b can be formed of a material having a high dielectric constant to realize desired characteristics, and the characteristics can be freely changed according to required characteristics.

For example, as shown in FIGS. 8A to 8D, when a second ceramic material, which is a different kind of ceramic material, is disposed in the capacitor portions 120a and 120b, the sheet constituting the capacitor portions 120a and 120b is referred to as a high- The more desirable characteristics can be realized in forming the capacitance.

8E, at least one intermediate sheet layer 130 may be disposed between the electric shock protection unit 110 and the capacitor unit 120, and the intermediate sheet layer 130 may include the capacitor unit 120, And a second ceramic material (B) identical to the first ceramic material (B). Here, the intermediate sheet layer 130 may be a separate sheet layer, or may be a buffer layer.

With this configuration, the electric shock protection element 100 " can provide a variety of capacitances suitable for the communication signal of the wireless communication band corresponding to the object to be used.

The above-described shock protection device 100, 100 ', 100 ", 200 can be disposed between the conductor 12 and the circuit part 14, such as an external metal case, in the portable electronic device 10, have.

Here, the portable electronic device 10 may be in the form of a portable electronic device that is portable and portable. For example, the portable electronic device may be a portable terminal such as a smart phone, a cellular phone, and the like, and may be a smart watch, a digital camera, a DMB, an electronic book, a netbook, a tablet PC, Such electronic devices may comprise any suitable electronic components including antenna structures for communication with external devices. In addition, it may be a device using local area network communication such as Wi-Fi and Bluetooth.

Such a portable electronic device 10 may be made of conductive materials such as metal (aluminum, stainless steel, etc.) or carbon-fiber composite materials or other fiber-based composites, glass, ceramics, plastic, . &Lt; / RTI >

At this time, the housing of the portable electronic device 10 may include a conductor 12 made of metal and exposed to the outside. Here, the conductor 12 may include at least one of an antenna for communication between the electronic device and an external device, a metal case, and conductive ornaments.

In particular, the metal case may be provided to partially surround or entirely surround the side of the housing of the portable electronic device 10. In addition, the metal case may be provided to surround the camera, which is exposed to the outside on the front surface or the rear surface of the housing of the electronic device.

As such, the electric shock protection element 100 may be disposed between the human contactable conductor 12 of the portable electronic device 10 and the circuit portion 14 to protect the internal circuit from leakage current and static electricity.

Such an anti-electrostatic device 100 may be suitably provided in accordance with the number of metal cases provided in the housing of the portable electronic device 10. [ However, when a plurality of metal cases are provided, each of the metal cases 12a, 12b, 12c, and 12d may be embedded in the housing of the portable electronic device 10 such that the anti- have.

That is, when the conductor 12 such as the metal case surrounding the side of the housing of the portable electronic device 10 is composed of three parts, as shown in Fig. 9A, each of the conductors 12a, 12b, 12c and 12d All of which are connected to the anti-shock device 100, thereby protecting the circuit inside the portable electronic device 10 from leakage current and static electricity.

When the plurality of metal cases 12a, 12b, 12c, and 12d are provided, the anti-shock device 100 may be provided in various ways according to the roles of the metal cases 12a, 12b, 12c, and 12d. have.

For example, when the camera of the portable electronic device 10 is exposed to the outside, when the anti-shock device 100 is applied to the conductor 12d surrounding the camera, the anti-shock device 100 May be provided in a form that blocks the leakage current and protects the internal circuit from static electricity.

In addition, when the metal case 12b serves as a ground, the anti-shock device 100 may be connected to the metal case 12b to shield the leakage current and protect the internal circuit from static electricity .

Meanwhile, as shown in FIG. 9B, the electric shock protection device 100 may be disposed between the metal case 12 'and the circuit board 14'. At this time, since the electric shock protection element 100 is for passing static electricity without damaging itself, the circuit board 14 'may have a separate protection element 16 for bypassing the static electricity to the ground. Here, the protection element 16 may be a suppressor or a varistor.

9C, the electric shock protection device 100 may be disposed through a matching circuit (for example, R and L components) between the metal case 12 'and the FFM (front end module) 14a have. Here, the metal case 12 'may be an antenna. At this time, the electric shock protection element 100 is to pass the communication signal without attenuation, to pass the static electricity from the metal case 12 ', and to block the leakage current flowing from the ground through the matching circuit.

As shown in FIG. 9D, the electric shock protection device 100 may be disposed between the metal case 12 'having the antenna and the IC 14c implementing the communication function through the antenna. Here, the corresponding communication function may be NFC communication. At this time, since the electric shock protection element 100 is for passing the static electricity without damaging itself, it may be provided with a separate protection element 16 for bypassing the static electricity to the ground. Here, the protection element 16 may be a suppressor or a varistor.

9E, the electric shock protection element 100 may be disposed between the short pin 22 of the PIFA (Planar Inverted F Antenna) antenna 20 and the matching circuit. At this time, the electric shock protection element 100 is to pass the communication signal without attenuation, to pass the static electricity from the metal case 12 ', and to block the leakage current flowing from the ground through the matching circuit.

10A to 10C, the electric shock protection device 100 may have a different function depending on a leakage current due to an external power source, a static electricity and a communication signal flowing from the electric conductor 12.

10A, when the leakage current of the external power source flows into the conductor 12 through the circuit board of the circuit portion 14, for example, the ground, the electric shock protection element 100 is notified of the breakdown voltage (Vbr) is larger than the overvoltage due to the leakage current, it can be kept open. That is, since the total breakdown voltage Vbr of the electric shock protection device 100 is larger than the rated voltage of the external power source of the portable electronic device, the electric shock protection device 100 maintains the open state without being electrically conducted, It is possible to prevent the leakage current from being transmitted.

At this time, the capacitor portions 120a and 120b provided in the electric shock protection device 100 can block the DC component included in the leakage current, and since the leakage current has a relatively lower frequency than the radio communication band, So that the leakage current can be cut off.

As a result, the electric shock protection device 100 can protect the user from electric shock by interrupting the leakage current to the external power source which flows from the ground of the circuit part 14. [

Further, as shown in FIG. 10B, when static electricity flows from the outside through the conductor 12, the electric shock protection element 100 functions as an electrostatic protection element such as a varistor. That is, since the breakdown voltage Vbr of the electric shock protection unit 110 is smaller than the instantaneous voltage of the static electricity, the electric shock protection element 100 can be electrically conducted to pass the static electricity. As a result, since the first internal electrodes 111a and 111b and the second internal electrode 112a are provided in the varistor material layer, the non-linear voltage characteristic of the varistor material when the static electricity flows from the conductor 12 The electrical resistance between the first internal electrodes 111a and 111b and the second internal electrode 112a is lowered, and the static electricity can pass therethrough without being electrically broken down.

Since the dielectric breakdown voltage Vcp of the capacitor units 120a and 120b provided in the electric shock protection device 100 is larger than the breakdown voltage Vbr of the electric shock protection unit 110, 120b, and can be passed only through the electric shock protection unit 110.

Here, the circuit unit 14 may have a separate protection element for bypassing the static electricity to the ground. As a result, the electric shock protection element 100 can pass the static electricity without being broken by the static electricity flowing from the electric conductor 12, thereby protecting the inner circuit of the following stage.

Further, as shown in Fig. 10C, when a communication signal is input through the conductor 12, the electric shock protection element 100 functions as a capacitor. That is, the electric shock protection device 100 is configured such that the electric shock protection unit 110 is kept open to shut off the conductor 12 and the circuit unit 14, but the internal capacitor units 120a and 120b pass the communication signal . Thus, the capacitor portions 120a and 120b of the electric shock protection device 100 can provide the inflow path of the communication signal.

Here, the capacitances of the capacitor units 120a and 120b are preferably set so as to pass the communication signal of the main wireless communication band without attenuation. As shown in Figs. 11A and 11B, according to the simulation result of the pass frequency band according to the capacitance, the mobile radio communication frequency band (700 MHz) is applied to a capacitance of 5 ㎊ or more including the second element body having a permittivity of 40 F / To 2.6 GHz), and exhibits an electrically short circuit phenomenon.

However, as shown in FIG. 11B, it can be seen that the capacitance of the capacitor portion is not influenced by the reception sensitivity during communication at a capacitance of about 20 pF or more, preferably 30 pF or more. In the wireless communication frequency band, it is preferable to use a capacitor including a body having a dielectric constant of 20 F / m or more so that it is easier to realize a high capacitance of 20 F or more. As a result, the electric shock protection device 100 can pass the communication signal flowing from the conductor 12 without a reduction by the high capacitance of the capacitor portions 120a and 120b.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: portable electronic device 12a, 12b, 12c, 12d: conductor
14: circuit parts 100, 100 ', 100 ", 200:
110, 210: an electric shock protection part 120: a capacitor part
111, 112: varistor sheet layer
111a, 111b, 112a: internal electrodes

Claims

An electric shock protection element disposed between a human contactable conductor of an electronic device and an internal circuit portion,
An electric shock protection unit comprising a first element, a plurality of first internal electrodes arranged in a line within the first element, and a second internal electrode spaced apart from the first internal electrode by a distance from the first internal electrode;
An outer electrode formed on an outer surface of the first element to be electrically connected to the first inner electrode and the second inner electrode; And
And a glass coating layer formed on the outer surface of the body including at least an area where the outer electrode and the outer surface of the body containing the first body are in contact with each other.

The method according to claim 1,
An electric shock protection element satisfying the following expression: < EMI ID = 1.0 > wherein the electric current passing through the electric conductor is passed through the electric conductor,
Vbr> Vin
Here, Vbr is the breakdown voltage of the electric shock protection element, and Vin is the rated voltage of the external power supply of the electronic device.

3. The method of claim 2,
Wherein the rated voltage is a national standard rated voltage.

The method according to claim 1,
Wherein the second internal electrode has a plurality of electrodes spaced apart in a line.

5. The method of claim 4,
Wherein each of the second internal electrodes is disposed to overlap at least a part of the first internal electrode.

5. The method of claim 4,
And each of the second internal electrodes is disposed so as not to overlap with the first internal electrode.

The method according to claim 1,
A distance L between any two first inner electrodes disposed adjacent to and closest to the second inner electrode among the plurality of first inner electrodes is a distance between the two first inner electrodes and the second inner electrode, (d1, d2).

The method according to claim 1,
Wherein at least a part of the sheet layer is formed of a first varistor composition and the remaining sheet layer is formed of a second varistor composition different from the first varistor composition.

The method according to claim 1,
Wherein the first prism body comprises at least one of a semiconductive material, a Pr-based material, and a Bi-based material including at least one of ZnO, SrTiO ₃ , BaTiO _3, and SiC.

The method according to claim 1,
Wherein the thicknesses of the first internal electrode and the second internal electrode are independently 2 to 10 mu m.

The method according to claim 1,
Wherein the first internal electrode and the second internal electrode each independently comprise any one or more of Ag, Au, Pt, Pd, Ni and Cu.

The method according to claim 1,
Wherein the glass coating layer is formed on the outer surface of the elementary body.

The method according to claim 1,
Wherein the glass coating layer comprises at least one selected from the group consisting of aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, erbium, And a glass component containing at least one element selected from titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum.

The method according to claim 1,
Wherein the glass coating layer has an average thickness of 0.5 to 10 占 퐉.

The method according to claim 1,
A second elementary body disposed on one side of the first elementary body of the electric shock protection element and a second elementary body disposed on the second elementary element so as to overlap at least a part of the surfaces of the second elementary element and the electrode, And a capacitor portion including a capacitor electrode electrically connected to the capacitor portion.

16. The method of claim 15,
Vcp > Vbr, wherein Vcp is an insulation breakdown voltage of the capacitor section.

19. The method of claim 18,
Wherein the capacitor unit is electrically connected in parallel with the electric shock protection unit.

16. The method of claim 15,
And said second elementary body comprises a dielectric.

The method according to claim 1,
Wherein the breakdown voltage (Vbr) of the electric shock protection element is a sum of unit breakdown voltages respectively formed between the first adjacent first internal electrode and the second internal electrode.

An electric shock protection element disposed between a human contactable conductor of an electronic device and an internal circuit portion,
An electric shock protection unit comprising a first element, a plurality of first internal electrodes arranged in a line within the first element, and a second internal electrode spaced apart from the first internal electrode by a distance from the first internal electrode;
And a capacitor electrode provided in the second elementary body so that at least a part of the surfaces of the second elementary body and the electrode disposed on one side of the first elementary body of the electric shock protection element for allowing the communication signal flowing from the conductor to pass therethrough, A capacitor portion;
An external electrode formed on an outer surface of the first and second main bodies so as to be electrically connected to the first internal electrode, the second internal electrode, and the capacitor electrode; And
And a glass coating layer formed on the outer surface of the body including the outer surface of the element body including the first elementary body and the second elementary body and the region where the outer electrode is in contact with the outer surface.

21. The method of claim 20,
An electric shock protection element satisfying the following expression: < EMI ID = 1.0 > wherein: the electric current is passed through the conductor without passing through the dielectric breakdown, and the leakage current of the external power source,
Vbr> Vin
Here, Vbr is the breakdown voltage of the electric shock protection element, and Vin is the rated voltage of the external power supply of the electronic device.

21. The method of claim 20,
Vcp > Vbr, wherein Vcp is an insulation breakdown voltage of the capacitor section.

21. The method of claim 20,
Wherein the capacitor unit is electrically connected in parallel with the electric shock protection unit.

21. The method of claim 20,
Wherein the communication signal has a wireless communication frequency band.

21. The method of claim 20,
The distance between the capacitor portion and the electric shock protection portion may be a distance between the first inner electrode and the second inner electrode disposed nearest to the second inner electrode of the plurality of first inner electrodes, d2) greater than the sum.

21. The method of claim 20,
Wherein a distance between the capacitor portion and the electric shock protection portion is 15 to 100 mu m.

21. The method of claim 20,
Wherein the thickness of the capacitor electrode is 2 to 10 mu m.

21. The method of claim 20,
Wherein an interval between the capacitor electrodes is 15 to 100 mu m.

Human contactable conductors;
Circuitry; And
And an electric shock protection element disposed between the conductor and the circuit portion,
An electric shock protection unit comprising a first element, a plurality of first internal electrodes arranged in a line within the first element, and a second internal electrode spaced apart from the first internal electrode by a distance from the first internal electrode;
An outer electrode formed on an outer surface of the first element to be electrically connected to the first inner electrode and the second inner electrode; And
And a glass coating layer formed on the outer surface of the body including at least an area where the outer electrode and the outer surface of the body contact each other.

30. The method of claim 29,
Wherein the electric shock protection device is a portable electronic device having an electric shock protection function satisfying the following expression in order to cut off the leakage current of the external power source flowing from the ground of the circuit part after allowing the static electricity to pass therethrough, :
Vbr> Vin
Here, Vbr is the breakdown voltage of the electric shock protection element, and Vin is the rated voltage of the external power supply of the electronic device.

30. The method of claim 29,
Wherein the conductor has at least one of an antenna, a metal case, and a conductive ornamental for communication between the electronic device and an external device.

32. The method of claim 31,
Wherein the metal case has an electric shock protection function that partially surrounds or entirely surrounds the side of the housing of the electronic device.

32. The method of claim 31,
Wherein the metal case is provided so as to surround a camera provided to be exposed to the outside on a front surface or a rear surface of the housing of the electronic device.

Human contactable conductors;
Circuitry; And
And an electric shock protection element disposed between the conductor and the circuit portion,
An electric shock protection unit comprising a first element, a plurality of first internal electrodes arranged in a line within the first element, and a second internal electrode spaced apart from the first internal electrode by a distance from the first internal electrode;
And a capacitor electrode provided in the second elementary body so that at least a part of the surfaces of the second elementary body and the electrode disposed on one side of the first elementary body of the electric shock protection element for allowing the communication signal flowing from the conductor to pass therethrough, A capacitor portion;
An external electrode formed on an outer surface of the first and second main bodies so as to be electrically connected to the first internal electrode, the second internal electrode, and the capacitor electrode; And
And a glass coating layer formed on the outer surface of the body including the outer surface of the body including the first body and the second body and the region where the outer electrode abuts.

35. The method of claim 34,
Wherein the static electricity is passed through the conductor without passing through the dielectric breakdown and the leakage current of the external power source flowing from the ground of the circuit part is cut off and the communication signal is passed through without passing through the dielectric breakdown from the static electricity A portable electronic device having an electric shock protection function:
Vbr> Vin, Vcp> Vbr
Here, Vbr is the breakdown voltage of the electric shock protection device, Vin is the rated voltage of the external power supply of the electronic device, and Vcp is the breakdown voltage of the capacitor.

35. The method of claim 34,
Wherein the capacitor portion is provided on at least one of the upper and lower portions of the electric shock protection portion or at least one of both the upper and lower portions of the electric shock protection portion at regular intervals.

(1) sintering a multilayer body including a plurality of first internal electrodes arranged in a line and spaced apart from other ones of the plurality of first internal electrodes, thereby manufacturing a first body;
(2) forming a glass coating layer on the outer surface of the first elementary body including at least the first outer surface of the first elementary body in a region corresponding to the inner electrode of the first elementary body; And
(3) forming an outer electrode to be electrically connected to the inner electrode.

The method of claim 37, wherein step (1)
1-1) sintering a multilayer body including a plurality of first internal electrodes arranged in a line and spaced apart from other ones of the plurality of first internal electrodes to manufacture a first body; And
1-2) etching the outer surface of the first elementary body;

39. The method of claim 38,
Further comprising the step of polishing the edge of the first body between steps 1-1) and 1-2).

The method of claim 37, wherein step (2)
2-1) treating the outer surface of the first body with a composition for forming a glass coating layer; And
2-2) drying the glass coating layer forming composition;
2-3) ball milling the surface of the dried glass coating layer-forming composition; And
2-4) firing the composition for forming a glass coating layer.

(A) a first laminated body including a plurality of first inner electrodes arranged in a line and spaced apart from the other first inner electrodes, and a second laminated body including at least some of the electrodes Sintering a second stacked body including a capacitor electrode provided on one side of the first stacked body to manufacture the first and second small bodies;
(B) an outer surface of a first elementary body including at least an outer surface of a first elementary body of a region corresponding to an inner electrode of the first elementary body and a second elementary body outer surface corresponding to a capacitor electrode of the second elementary body, Forming a glass coating layer on the substrate; And
(C) forming an external electrode to be electrically connected to the internal electrode and the capacitor electrode.

42. The method of claim 41, wherein step (A)
A-1) a first laminate including a plurality of first inner electrodes spaced in a line and a second inner electrode spaced apart from the other first inner electrodes, and at least some of the electrodes overlapping each other Sintering a second stacked body disposed on one side of the first stacked body including the capacitor electrode so as to manufacture the first and second sintered bodies; And
A-2) etching the outer surfaces of the first and second bodies.

43. The method of claim 42,
Further comprising the step of polishing an edge of the first body between the step A-1) and the step A-2).

42. The method of claim 41, wherein step (B)
B-1) treating a glass coating layer-forming composition on an outer surface of a first body; And
B-2) drying the glass coating layer-forming composition;
B-3) ball milling the surface of the dried glass coating layer-forming composition; And
B-4) firing the composition for forming a glass coating layer.