KR102053356B1 - Method of manufacturing a complex component and the complex component manufactured by the same and electronic device having the same - Google Patents

Abstract

The present invention is a laminate; Two or more functional units provided in the stack and having different functions; A coupling part provided between the functional parts to couple them; And an external electrode formed outside the laminate and connected to at least a portion of the functional unit, and an electronic device having the same.

Description

Method for manufacturing a composite device, a composite device manufactured thereby and an electronic device having the same {Method of manufacturing a complex component and the complex component manufactured by the same and electronic device having the same}

The present invention relates to a composite device, and more particularly, to a composite device including two or more functional layers having different functions and an electronic device having the same.

Passive devices that make up electronic circuits include resistors, capacitors, and inductors, and the functions and roles of these passive devices vary widely. For example, resistors control the flow of current through a circuit, and in AC circuits they also play a role in achieving impedance matching. The capacitor basically blocks the direct current and passes the alternating current signal. Capacitors also form time constant circuits, time delay circuits, RC and LC filter circuits, and the capacitor itself serves to remove noise. In the case of the inductor, it performs functions such as removing high frequency noise and matching impedance.

In addition, an electronic circuit requires an overvoltage protection device such as a varistor or a suppressor to protect the electronic device from an overvoltage such as an ESD applied to the electronic device from the outside. That is, an overvoltage protection device is required in order to prevent overvoltage above the driving voltage of the electronic device from being applied from the outside. For example, varistors are widely used as devices for protecting electronic components and circuits from overvoltage because the resistance changes with applied voltage. In other words, the current does not flow to the varistors arranged in the circuit, but if the overvoltage is applied at both ends of the varistor due to overvoltage or lightning over the breakdown voltage, the resistance of the varistor decreases rapidly, and almost all currents flow through the varistor, and the current to other devices. Does not flow, and the circuit or the electronic components mounted on the circuit are protected from overvoltage.

On the other hand, in recent years, in order to reduce the area occupied by these components in response to the miniaturization of electronic devices, at least two or more having different functions or characteristics may be stacked to manufacture chip components. For example, a capacitor and an overvoltage protection device may be stacked in one chip to implement chip components to implement high varistor voltage and capacitance. In other words, the varistor has a breakdown voltage determined by its thickness. In order to realize a high breakdown voltage, the varistor has a relatively low capacitance. To compensate for this, the capacitor is made of a material having a high dielectric constant to improve or maintain the capacitance. do.

However, two or more functional layers having different functions have a problem in that they are not bonded well because their physical properties are different from each other. For example, a laminate in which a varistor material and a capacitor material are laminated is easily peeled off or cracked by high temperature sintering. That is, since the varistor material and the capacitor material have different thermal shrinkage rates, torsion may occur during the sintering process, and peeling and cracking may occur. Peeling and cracking deteriorate the characteristics of the varistor and the capacitor, making it difficult to manufacture a practical composite device. In addition, in the sintering process, the materials of the respective functional layers are mutually diffused, and the concentrations distributed according to the positions are different, thereby causing a problem of lowering the function of each functional layer. That is, the closer to the boundary region between the two functional layers, the higher the concentration of the other functional layer material included in the one functional layer, and thus, the functional deterioration of each functional layer may occur due to the variation in the concentration.

Korea Patent Registration No. 10-0638802

The present invention provides a composite device in which two or more functional units are stacked with different functions.

The present invention provides a composite device capable of preventing the interdiffusion of materials forming two or more functional units.

A method of manufacturing a composite device according to an aspect of the present invention includes the steps of stacking and sintering a plurality of first sheets on which at least one first conductive electrode is formed to manufacture a first functional portion; Stacking and sintering a plurality of second sheets on which at least one second conductive electrode is formed to manufacture a second functional unit; Forming a laminate by providing a coupling part between the first and second functional parts to combine the first and second functional parts; And forming an external electrode on the outside of the laminate in which the first and second functional units are combined.

The first and second functional units each include two or more of resistors, capacitors, inductors, noise filters, varistors, and suppressors.

The first and second functional portions each include a capacitor portion and an overvoltage protection portion, the capacitor portion includes a plurality of dielectric sheets and two or more internal electrodes, and the overvoltage protection portion includes a plurality of discharge sheets and two or more discharge electrodes. .

At least one of the internal electrodes is provided spaced apart from each other on the same plane.

The spacing between the discharge electrodes is greater than the spacing between the internal electrodes.

The thickness of the internal electrode is equal to or thicker than the thickness of the discharge electrode.

The overlapping area between the internal electrodes is larger than the overlapping area between the discharge electrodes.

The discharge electrode may include first and second discharge electrodes spaced apart from each other on the same plane by a predetermined distance, and third discharge electrodes partially overlapping the first and second discharge electrodes and spaced apart in a vertical direction. The distance between the second discharge electrodes is greater than the sum of the distances between the first and third discharge electrodes and the distance between the second and third discharge electrodes.

The electronic device further includes a second overvoltage protection unit provided between the capacitor units.

The second overvoltage protection unit includes two or more discharge electrodes and an overvoltage protection member provided between the discharge electrodes.

The bonding portion comprises at least one of glass, polymer and oligomer.

It is formed on at least part of the surface of the laminate, and further comprises a surface modification member of a material different from the surface of the laminate.

The external electrode extends on at least one of the lowermost layer and the uppermost sheet of the laminate, and the surface modification member is provided between at least the extension region of the external electrode and the laminate.

The external electrode is formed on the first and second functional parts including a coupling part, and the external electrode is formed to be connected to the first and second conductive electrodes.

The composite device which concerns on another aspect of this invention is manufactured by the manufacturing method which concerns on said one aspect of this invention.

An electronic device according to another aspect of the present invention includes a conductor and an internal circuit to which a user can contact, and a composite device according to another aspect of the present invention is provided between the conductor and the internal circuit.

In the composite device according to the embodiments of the present invention, two or more functional units having different functions are stacked, and two or more functional units may be combined by a coupling unit. By combining the different functional units using the coupling unit as described above, it is possible to prevent distortion, peeling, cracking, etc. due to the shrinkage difference of the composite device.

In addition, since two or more functional units are manufactured and sintered in the respective processes and then joined by the coupling units, interdiffusion of the materials constituting each functional unit can be prevented, thereby preventing the functional deterioration of each functional unit.

1 is a perspective view of a composite device according to embodiments of the present invention.
2 is a cross-sectional view of a composite device according to a first embodiment of the present invention.
3 is a schematic view of at least a portion of the surface of a composite device according to a first embodiment of the present invention;
4 is a cross-sectional view of a composite device according to a second exemplary embodiment of the present invention.
5 is a cross-sectional view of a composite device according to a third embodiment of the present invention.
6 is a sectional view of a composite device according to a fourth embodiment of the present invention.
7 and 8 are block diagrams showing the arrangement of the composite device according to the embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 is a perspective view of a composite device according to embodiments of the present invention. 2 is a cross-sectional view taken along line AA ′ of FIG. 1 as a cross-sectional view of a composite device according to a first exemplary embodiment of the present invention, and FIG. 3 is a schematic view of at least part of the surface thereof.

1 to 3, a composite device according to a first embodiment of the present invention is provided with a laminate 1000 including a plurality of stacked sheets 100, and a different function provided in the laminate 1000. It may include at least two or more functional units. That is, it may include a first functional unit including at least one of a resistor, a noise filter, an inductor, a capacitor, and the like, and a second functional unit including an overvoltage protection unit such as a varistor or a suppressor to protect the overvoltage. In other words, the composite device of the present invention may include at least one first functional part functioning as a passive element, and at least one second functional part functioning as an overvoltage protection element. For example, the composite device according to the first embodiment of the present invention may include a laminate 1000 including a plurality of sheets 100, at least one capacitor unit 2000 provided in the laminate 1000, and at least One over-voltage protection unit 3000, that is, may include a varistor. In addition, a coupling portion 4000 provided between the capacitor portion 2000 and the overvoltage protection portion 3000 and coupled thereto, and external electrodes 5100, 5200; 5000 provided on two side surfaces facing each other outside the stack 1000. It may further include, and may further include a surface modification member 6000 formed on at least one surface of the laminate (5000). Here, two or more functional layers having different functions, for example, the capacitor part 2000 and the overvoltage protection part 3000 may be joined by the coupling part 4000 after being sintered, respectively. That is, one surface of the capacitor unit 2000 and one surface of the overvoltage protection unit 3000 may be coupled by the coupling unit 4000. In addition, the capacitor unit 2000 includes a plurality of sheets having a predetermined dielectric constant, and the overvoltage protection unit 3000 includes a varistor portion, and a plurality of sheets having varistor characteristics are stacked. Hereinafter, the plurality of sheets constituting the capacitor unit 2000 are referred to as dielectric sheets 110 (101 to 107), and the plurality of sheets constituting the overvoltage protection unit 3000 are referred to as discharge sheets 120 (121 to 127). The entire sheet including the sheet 110 and the discharge sheet 120 is called a sheet 100. In addition, the conductive layers of the capacitor unit 2000 are referred to as internal electrodes 210 to 270, and the conductive layers of the overvoltage protection unit 3000 are referred to as discharge electrodes 311 and 312.

The configuration of the composite device according to the first exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 as follows.

One. Laminate

The stack 1000 is formed by stacking a plurality of sheets 100, that is, a plurality of dielectric sheets 110 (101 to 107) and a plurality of discharge sheets 120 (121 to 127). That is, the coupling part 4000 includes a first stack in which the plurality of dielectric sheets 110 having the internal electrodes 200 are stacked, and a second stack in which the plurality of discharge sheets 120 having the discharge electrodes 310 are stacked. The laminated body 1000 is made by combining. The laminate 1000 has a predetermined length in one direction (for example, the X direction) and another direction (for example, the Y direction) orthogonal thereto, and has a predetermined height in the vertical direction (for example, the Z direction). It may be provided in a substantially hexahedral shape having a. In this case, when the forming direction of the external electrode 5000 is referred to as the X direction, the direction perpendicular to the horizontal direction may be referred to as the Y direction, and the vertical direction may be referred to as the Z direction. Here, the length of the X direction is longer than the length of the Y direction and the length of the Z direction, the length of the Y direction may be equal to or different from the length of the Z direction. When the lengths of the Y and Z directions are different, the length of the Y direction may be shorter or longer than the length of the Z direction. For example, the ratio of the lengths in the X, Y, and Z directions may be 2 to 5: 1: 0.5 to 1. That is, the length of the X direction may be about 2 to 5 times longer than the length of the Y direction based on the length of the Y direction, and the length of the Z direction may be 0.5 to 1 times the length of the Y direction. However, the length of the X, Y and Z directions can be variously modified according to the internal structure of the electronic device to which the composite device is connected, the internal structure and shape of the composite device, and the like, as one example. In addition, at least one overvoltage protection unit 3000, such as at least one capacitor unit 2000 and a varistor unit, may be provided in the stack 1000. For example, the capacitor part 2000 and the overvoltage protection part 3000 may be provided in the stacking direction of the sheets, that is, the Z direction.

 In addition, the plurality of sheets, that is, the dielectric sheet 110 and the discharge sheet 120 may all be formed with the same thickness, and at least one may be formed thicker or thinner than the others. For example, the discharge sheet 120 of the overvoltage protection unit 3000 may be formed to have a thickness different from that of the dielectric sheet 110 of the capacitor unit 2000, and the discharge sheet 120 may be thicker than the dielectric sheet 110. Can be formed. That is, the thickness of each of the discharge sheets 120 may be thicker than the thickness of each of the dielectric sheets 110. However, the thickness of each of the discharge sheets 120 may be thinner or the same as the thickness of each of the dielectric sheets 110. In addition, at least one of the discharge sheets 120 may be thicker than the thickness of the other discharge sheet 120, and at least one of the dielectric sheets 110 may be thicker than the other dielectric sheets 110. In this case, the dielectric sheet 110 thicker than the other dielectric sheet 110 may be thicker than the thinner discharge sheet 120. That is, at least one of the plurality of dielectric sheets 110 and the plurality of discharge sheets 120 may be formed to have a thickness different from that of the other sheets 100. Meanwhile, the plurality of sheets 100, that is, each of the dielectric sheets 110 and the discharge sheets 120 may be formed to have a thickness that does not break when an overvoltage such as ESD is applied, for example, a thickness of 5 μm to 300 μm. .

In addition, the capacitor part 2000 and the overvoltage protection part 3000 may have the same thickness or may have different thicknesses. That is, the first laminate in which the plurality of dielectric sheets 110 constituting the capacitor unit 2000 and the second laminate in which the plurality of discharge sheets 120 constituting the overvoltage protection unit 3000 are stacked are the same thickness. It may be formed, or may be formed in a different thickness. For example, the thickness of the overvoltage protection unit 3000 may be equal to or thicker than the thickness of the capacitor unit 2000. The overvoltage protection unit 3000 may be one to two times thicker than the capacitor unit 2000. That is, when the thickness of the capacitor unit 2000 is 100, the overvoltage protection unit 3000 may be formed to a thickness of 100 to 200. In addition, the number of stacked layers of the dielectric sheet 110 of the capacitor unit 2000 and the number of stacked sheets of the discharge sheet 120 of the overvoltage protection unit 3000 may be different or may be the same. For example, the number of stacked sheets of the discharge sheet 120 may be less than the number of stacked sheets of the dielectric sheet 110. As a specific example, the thickness of each of the discharge sheets 120 is thicker than the thickness of each of the dielectric sheets 110, and the discharge sheets 120 are stacked in the same or different numbers as the dielectric sheets 110 so that the discharge sheets 120 are stacked. The second stack may be equal to or thicker than the thickness of the first stack on which the dielectric sheet 110 is laminated. In addition, the thickness of each of the dielectric sheets 110 is greater than that of each of the discharge sheets 120, and the first and the dielectric sheets 110 are stacked by stacking the dielectric sheets 110 in the same or different number as the discharge sheets 120. The laminate may be equal to or thicker than the thickness of the second laminate on which the discharge sheet 120 is laminated. However, the thickness of each of the dielectric sheets 110 and the thickness of each of the discharge sheets 120 are the same, and the number of stacks of the dielectric sheets 110 and the number of stacks of the discharge sheets 120 are the same or different, so that the first stack and the second stack are different. The thickness of the sieves may be the same or different. For example, the capacitor part 2000 and the overvoltage protection part 3000 may each have a thickness of 0.1 mm to 0.4 mm.

Meanwhile, the laminate 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) respectively provided on the lower surface and the upper surface. That is, the stack 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided at the lower portion of the capacitor unit 2000 and the upper portion of the overvoltage protection unit 3000, respectively. Of course, the lowermost sheet of the laminate 1000 may function as the lower cover layer and the uppermost sheet may function as the upper cover layer. That is, the lowermost dielectric sheet of the capacitor unit 2000, that is, the first dielectric sheet 101 may function as a lower cover layer, and the uppermost discharge sheet of the overvoltage protection unit 3000, that is, the seventh discharge sheet 207. ) May serve as the top cover layer. The lower and upper cover layers, which are separately provided, may be formed to have the same thickness, and a plurality of magnetic sheets may be stacked. However, the lower and upper cover layers may be formed in other thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, a nonmagnetic sheet, for example, a glass sheet, may be further formed on the outermost portion of the lower and upper cover layers formed of the magnetic sheet, that is, the lower and upper surfaces. In addition, the lower and upper cover layers may be thicker than the insulating sheets therein. Therefore, when the lowermost and uppermost insulating sheets function as lower and upper cover layers, they may be formed thicker than each of the insulating sheets therebetween. Meanwhile, the surface modification member may not be formed on at least a portion of the surface of the laminate 1000, and the lower and upper cover layers may be formed of a glass sheet, and the surface of the laminate 1000 may be coated with a polymer or glass material. . However, when the surface of the laminate 1000 is formed of a glassy sheet, it is preferable not to form a glassy sheet because the glassy sheet may absorb moisture and thus lower the reliability of the device.

2. Capacitor part

The capacitor part 2000 may be provided below or over the overvoltage protection part 3000. The capacitor part 2000 may include at least two internal electrodes 200 and at least two dielectric sheets 110 provided therebetween. For example, as shown in FIG. 2, the capacitor part 2000 may include first to seventh dielectric sheets 101 to 107; 110 and first to seventh internal electrodes 210 to 270; 200. have. Meanwhile, in the present exemplary embodiment, the capacitor part 2000 has a plurality of internal electrodes 200 formed therein, and for this purpose, the dielectric sheet 110 is formed with one more than the number of the internal electrodes 200, but the capacitor part 2000 Two or more internal electrodes 200 may be formed and three or more dielectric sheets 110 may be provided.

The dielectric sheets 101-107; 110 may be formed of a dielectric material. As the dielectric material, for example, a high dielectric material having a dielectric constant of about 5 to 20,000 may be used, and MLCC, LTCC, HTCC, and the like may be used. The MLCC dielectric material may include at least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO based on at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material may be Al ₂ O ₃ or SiO _2. It may include a glass material. In addition, the dielectric sheet 110 may be formed of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, and Al ₂ O ₃ in addition to MLCC, LTCC, and HTCC. It may be formed of a material comprising one or more. For example, the dielectric sheet 110 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and adjust the content of these materials. By controlling the dielectric constant. Therefore, the dielectric sheet 110 may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 4000, and more preferably 100 to 3000, depending on the material. For example, the dielectric sheet 110 may include BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , ZnO, TiO ₂ , SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , increasing the content of BaTiO ₃ . By increasing the dielectric constant, it is possible to increase the content of NdTiO ₃ and SiO ₂ to lower the dielectric constant. Meanwhile, the dielectric sheet 110 may be formed by mixing a dielectric material and an overvoltage protection material such as a varistor material. That is, the dielectric sheet 110 is mainly made of a dielectric material and may include some varistor material. The overvoltage protection material may include a material constituting the overvoltage protection unit 3000 to be described later, for example, a material constituting a discharge sheet of the overvoltage protection unit 3000. Such an overvoltage protection material may use a varistor material, which may be ZnO, Bi ₂ O ₃ , Pr ₆ O ₁₁ , Co ₃ O ₄ , Mn ₃ O ₄ , CaCO ₃ , Cr ₂ O ₃ , SiO ₂ , Al It may include at least one of ₂ O ₃ , Sb ₂ O ₃ , SiC, Y ₂ O ₃ , NiO, SnO ₂ , CuO, TiO ₂ , MgO, AgO. For example, the varistor material contained in the capacitor part 2000 may be ZnO. At this time, the size of the ZnO particles may be 1㎛ or less based on the average particle size distribution (D50). Meanwhile, the amount of varistor material contained in the capacitor part 2000 may be 0.2 wt% to 10 wt%. That is, the dielectric sheet 110 of the capacitor part 2000 may be formed by containing about 0.2 wt% to 10 wt% of the varistor material with respect to 100 wt% of the mixed material of the dielectric material and the varistor material. Preferably, the varistor material may contain 2 wt% to 5 wt% with respect to 100 wt% of the mixture of the capacitor material and the varistor material. In this case, when the overvoltage protection material, that is, the varistor material is contained in excess of 10wt%, the capacitance of the capacitor part 2000 may be reduced or at least a part of the discharge voltage may flow through the capacitor part 2000.

The plurality of internal electrodes 210 to 270 and 200 may be formed of a conductive material, for example, a metal or a metal alloy including at least one of Ag, Au, Pt, and Pd. In the case of an alloy, for example, Ag and Pd alloys may be used. In addition, the internal electrode 200 may be formed to have a thickness of, for example, 1 μm to 10 μm. Here, the internal electrode 200 is formed so that one side is connected to the external electrodes 5100, 5200; 5000 formed to face each other in the X direction, and the other side is spaced apart from each other. That is, the first, third, and fifth internal electrodes 210, 230, and 250 are formed on the first, third, and fifth dielectric sheets 101, 103, 105, respectively, with predetermined areas, and one side thereof has a first area. It is connected to the external electrode 5100 and the other side is formed to be spaced apart from the second external electrode 5200. In addition, the second, fourth, and sixth internal electrodes 220, 240, and 260 are formed on the second, fourth, and sixth dielectric sheets 102, 104, and 106 in a predetermined area, and one side thereof is the second external electrode. It is connected to the 5200 and the other side is formed to be spaced apart from the first external electrode 5100. That is, the internal electrodes 200 are alternately connected to any one of the external electrodes 5000 and are formed to overlap a predetermined region with the dielectric sheet 110 interposed therebetween. In this case, the internal electrodes 200 are formed in areas of 10% to 85% of the area of each of the dielectric sheets 110. In addition, two adjacent inner electrodes, for example, the first and second inner electrodes 210 and 220 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. Meanwhile, the internal electrode 200 may be formed in various shapes such as a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and spacing, and the like. The capacitor part 2000 has capacitances formed between the internal electrodes 200, and the capacitance may be adjusted according to the overlapping area of the adjacent internal electrodes 200, the thickness of the dielectric sheets 110, and the like. The capacitor part 2000 may have, for example, a capacitance of 20 μF or more.

3. Overvoltage Protection

The overvoltage protection unit 3000 may be provided above the capacitor unit 2000. The overvoltage protection unit 3000 may include a plurality of discharge sheets 120 and at least two discharge electrodes 311, 312; 310. For example, the overvoltage protection unit 3000 may include the first to seventh discharge sheets 121 to 127 and 120 and the second to sixth discharge sheets 122 to 126 as shown in FIG. 2. The first and second discharge electrodes 311, 312; 310 may be formed. In the present embodiment, the overvoltage protection unit 3000 illustrates and describes a case in which seven discharge sheets 110 and two discharge electrodes 310 are provided. However, the discharge sheet 120 and the discharge electrodes 310 may be described. It can be provided in various numbers. On the other hand, the breakdown voltage or the discharge start voltage for starting the discharge of the overvoltage protection unit 3000 may be determined according to the material of the discharge sheet 120, the distance between the discharge electrodes 310, and the like.

The discharge sheets 121 to 127 and 120 may be formed of a varistor material. Varistor materials include ZnO, Bi ₂ O ₃ , Pr ₆ O ₁₁ , Co ₃ O ₄ , Mn ₃ O ₄ , CaCO ₃ , Cr ₂ O ₃ , SiO ₂ , Al ₂ O ₃ , Sb ₂ O ₃ , SiC, Y ₂ It may include at least one of O ₃ , NiO, SnO ₂ , CuO, TiO ₂ , MgO, AgO. For example, a material in which at least one of the materials is mixed with ZnO as a main component may be used as a varistor material. Of course, the varistor material may use Pr-based, Bi-based, or SiC-based materials in addition to the above materials. In addition, the discharge sheet 120 may be formed of a material in which a varistor material and a dielectric material are mixed. That is, the discharge sheet 120 may be formed by mixing a material having a varistor characteristic and a material forming the capacitor part 2000, that is, a dielectric material. The discharge sheets 120 are mainly made of a varistor material, and some capacitor materials may be formed. May be included. The dielectric material mixed with the varistor material may include a main material of the dielectric sheet 110 of the capacitor unit 2000. That is, dielectrics such as MLCC, LTCC, HTCC having a dielectric constant of about 5 to 20,000 may be mixed with the varistor material. For example, a material comprising at least one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, Zn0, Al ₂ O ₃ may be added to the varistor material. Can be mixed. For example, the capacitor material, that is, the dielectric material contained in the overvoltage protection part 3000 may be at least one of BaTiO ₃ and NdTiO ₃ . On the other hand, the amount of the capacitor material, that is, the dielectric material contained in the overvoltage protection unit 3000 may be 0.2wt% to 10wt%. That is, the dielectric sheet material may contain 0.2 wt% to 10 wt% with respect to 100 wt% of the mixed sheet of the discharge sheet material and the dielectric sheet material. Preferably, the dielectric sheet material may contain 2 wt% to 5 wt% with respect to 100 wt% of the mixture of the discharge sheet material and the dielectric sheet material. In this case, when the capacitor material, that is, the dielectric sheet material is contained in excess of 10wt%, the characteristics of the overvoltage protection unit 3000 may be reduced. That is, the breakdown voltage is changed or becomes a complete non-conductor to discharge the overvoltage can lose the function as the overvoltage protection unit 3000.

The first and second discharge electrodes 311, 312; 310 may be formed of a conductive material. For example, the first and second discharge electrodes 311, 312 and 310 may be formed of a metal or a metal alloy including at least one of Ag, Au, Pt, and Pd. . In the case of an alloy, for example, Ag and Pd alloys may be used. In this case, the discharge electrode 310 may be formed of the same material as the internal electrodes 220 of the capacitor unit 2000. In addition, the discharge electrode 310 may be formed to have a thickness of, for example, 1 μm to 10 μm. That is, the discharge electrode 310 may be formed to have the same thickness as each of the internal electrodes 200. However, the discharge electrode 310 may be formed thinner or thicker than each of the internal electrodes 200. For example, the discharge electrode 310 may be formed to have a thickness of 10% to 90% than that of each of the internal electrodes 200. For example, the discharge electrode 310 may be formed to a thickness of 1㎛ 5㎛, each internal electrode 200 may be formed to a thickness of 2㎛ 10㎛. Meanwhile, the discharge electrode 310 may be alternately connected to the external electrode 5000. That is, the first discharge electrode 311 is connected to the first external electrode 5100 and formed on the first discharge sheet 121, and the second discharge electrode 312 is connected to the second external electrode 5200. It is formed on the sixth discharge sheet 126. That is, the first and second discharge electrodes 311 and 312 are alternately connected to any one of the external electrodes 5000 and are formed to overlap a predetermined area with the second to sixth discharge sheets 122 to 126 interposed therebetween. . In this case, the first and second discharge electrodes 311 and 312 are respectively formed with an area of 10% to 85% of the area of each of the discharge sheets 120. In addition, the first and second discharge electrodes 311 and 312 are formed to overlap with an area of 10% to 85% of the area of each of these electrodes. Meanwhile, the length of the discharge electrode 310 may be equal to or smaller than the length of the internal electrode 200, and the width of the discharge electrode 310 may be equal to or smaller than the width of the internal electrode 200. Therefore, the discharge electrode 310 may be formed to have the same or smaller area than the internal electrode 200.

On the other hand, the overvoltage protection unit 3000 has a predetermined capacitance, which is smaller than the capacitance of the capacitor unit 2000. That is, since the capacitance of the capacitor unit 2000 is larger than the capacitance of the overvoltage protection unit 3000, the total capacitance of the composite device may be increased. In this case, the capacitance of the capacitor unit 2000 may be 1 to 500 times larger than the capacitance of the overvoltage protection unit 3000.

In addition, the breakdown voltage of the overvoltage protection unit 3000 may be 310V or more, and may be lower than the dielectric breakdown voltage of the capacitor 2000. That is, the breakdown voltage of the overvoltage protection unit 3000 may be 310V or more and less than the dielectric breakdown voltage of the capacitor 2000. Since the breakdown voltage is lower than the dielectric breakdown voltage, the overvoltage may be discharged before the capacitor unit 2000 is dielectric breakdown. In addition, an interval between the internal electrodes 200 of the capacitor unit 2000 may be smaller than an interval between the discharge electrodes 310 of the overvoltage protection unit 3000. In addition, the overlapping area of the discharge electrode 310 of the overvoltage protection unit 3000 may be smaller than the overlapping area of the internal electrode 200 of the capacitor unit 2000.

4. Coupling

The coupling part 4000 may be provided between the capacitor part 2000 and the overvoltage protection part 3000 in the stack 1000. Here, the capacitor unit 2000 and the overvoltage protection unit 3000 may be manufactured by different processes and then coupled by the coupling unit 4000. The coupling part 4000 may include a material capable of bonding and bonding the first stack formed of the capacitor part 2000 and the second stack formed of the overvoltage protection part 3000. To this end, the coupling part 4000 may be formed of a paste having an adhesive force, for example, a glass paste, a polymer paste, an oligomer paste, or the like. That is, the paste may include a paste containing glass, a paste containing polymer, and a paste including oligomer. The glass paste may include at least one of SiO ₂ , BiO ₂ , B ₂ O ₃ , BaO, Al ₂ O ₃ , and the polymer paste may include Si resin and synthetic resin. In addition, the oligomer paste may include an epoxy resin, and the epoxy resin may include novolac-based, bisphenol-based, amine-based, cycloalipatic-based, and bromine-based epoxy resins. can do.

The coupling method of the capacitor unit 2000 and the overvoltage protection unit 3000 using the coupling unit 4000 is as follows. After forming the internal electrodes 200 on the plurality of dielectric sheets 110, respectively, and stacking and sintering the capacitor parts 2000, the discharge electrodes 310 are formed on the plurality of discharge sheets 120, respectively. After lamination and sintering, an overvoltage protection unit 3000 is manufactured. Subsequently, the coupling part 4000 is formed on one surface of the capacitor part 2000, and then the overvoltage protection part 3000 is combined to manufacture the laminate 1000. To this end, the capacitor unit 2000 may be aligned with a jig, and then an adhesive paste may be applied to one surface of the capacitor unit 2000, and the overvoltage protection unit 3000 may be aligned and compressed on top of the capacitor unit 2000. . In this case, the capacitor part 2000 and the overvoltage protection part 3000 are stacked in the stacking direction of the sheet 100 to expose the internal electrode 200 and the discharge electrode 310 on two opposite surfaces of the stack 1000. Be sure to In addition, after the capacitor unit 2000 and the overvoltage protection unit 3000 are combined, heat treatment may be performed at a predetermined temperature. For example, when the glass paste is used, the heat treatment may be performed at a temperature lower than the sintering temperature of the capacitor unit 2000 and the overvoltage protection unit 3000, and when the polymer paste is used, the heat treatment may be performed at a temperature of 10 ° C. to 300 ° C. FIG. .

The coupling part 4000 may further include an electromagnetic shielding and absorbing material. The electromagnetic shielding and absorbing material may include ferrite, alumina, or the like, and may be contained in an amount of 0.1 wt% to 50 wt% in the coupling portion 4000. That is, the electromagnetic shielding and absorbing material may be contained in an amount of 0.01 wt% to 50 wt% based on 100 wt% of the coupling portion 4000 material. When the electromagnetic shielding and absorbing material is less than 0.01% by weight, the electromagnetic shielding and absorbing properties are low, and when the electromagnetic shielding and absorbing material exceeds 50% by weight, the bonding property using the coupling part 4000 may be degraded. As such, the electromagnetic shielding and absorbing material may be further contained in the coupling part 4000 to shield or absorb the electromagnetic waves.

5. External electrode

The external electrodes 5100, 5200, and 5000 may be provided on two side surfaces of the stack 1000 that face each other. For example, the external electrodes 5000 may be formed on two opposite surfaces of the laminate 1000 in the X direction, that is, the length direction. In addition, the external electrode 5000 is connected to the internal electrode 200 and the discharge electrode 310 formed in the stack 1000. That is, one external electrode 5000 may be formed on each of two side surfaces facing each other, for example, the first and second sides, or two or more external electrodes may be formed. In this case, any one of the external electrodes 5000 may be connected to an internal circuit such as a printed circuit board inside the electronic device, and the other may be connected to the outside of the electronic device, for example, a metal case. For example, the first external electrode 5100 may be connected to an internal circuit, and the second external electrode 5200 may be connected to a metal case. In addition, the second external electrode 5200 may be connected to the metal case through a conductive member, for example, a contactor or a conductive gasket.

The external electrode 5000 may be formed in various ways. That is, the external electrode 5000 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as deposition, sputtering, plating, and the like. On the other hand, the external electrode 5000 may be formed to extend on the surface in the Y direction and Z direction. That is, the external electrode 5000 may extend from two surfaces facing in the X direction to four adjacent surfaces. For example, when immersed in the conductive paste, the external electrode 5000 may be formed not only on two opposite sides of the X direction, but also on the front and rear surfaces of the Y direction, and the upper and lower surfaces of the Z direction. In contrast, when formed by printing, vapor deposition, sputtering, plating, or the like, the external electrode 5000 may be formed on two surfaces in the X direction. That is, the external electrode 5000 may be formed not only on one side mounted on the printed circuit board and the other side connected to the metal case, but also in other areas according to the formation method or process conditions. The external electrode 5000 may be formed of a metal having electrical conductivity. For example, the external electrode 5000 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, the internal electrode 200 and the discharge electrode 310 are formed on at least a part of the external electrode 5000, that is, at least one surface of the stack 1000, and the internal electrode 200 and the discharge electrode 310 are formed. A part of the external electrode 5000 to be connected may be formed of the same material as the internal electrode 200 and the discharge electrode 310. For example, when the internal electrode 200 and the discharge electrode 310 are formed of copper, at least a part of the inner electrode 200 and the discharge electrode 310 may be formed using copper. In this case, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by deposition, sputtering, plating, or the like. Preferably, the external electrode 5000 may be formed by plating. In order to form the external electrode 5000 by the plating process, the seed layer may be formed on upper and lower surfaces of the laminate 1000, and then the plating layer may be formed from the seed layer to form the external electrode 5000. Here, at least a part of the external electrode 5000 connected to the internal electrode 200 and the discharge electrode 310 may be an entire side surface of the stack 1000 on which the external electrode 5000 is formed, or may be a partial region. .

In addition, the external electrode 5000 may further include at least one plating layer. The external electrode 5000 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 5000 may be formed by stacking a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, the Cu plating layer, Ni plating layer and Sn plating layer may be laminated. In addition, the external electrode 5000 may be formed by mixing, for example, a multicomponent glass frit having 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ as a main component with a metal powder. In this case, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to two surfaces of the laminate 1000. As the glass frit is included in the external electrode 5000, the adhesion between the external electrode 5000 and the stack 1000 may be improved, and the contact reaction of the electrodes in the stack 1000 may be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the upper portion thereof to form the external electrode 5000. That is, the metal layer including the glass and at least one plating layer formed thereon may form the external electrode 5000. For example, the external electrode 5000 may form a Ni plated layer and a Sn plated layer sequentially through electrolytic or electroless plating after forming a layer including glass frit and Ag and Cu. In this case, the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer. Of course, the external electrode 5000 may be formed of only at least one plating layer. That is, the external electrode 5000 may be formed by forming at least one layer of the plating layer using at least one plating process without applying the paste. Meanwhile, the external electrode 5000 may be formed to have a thickness of 2 μm to 100 μm, the Ni plating layer may be formed to have a thickness of 1 μm to 10 μm, and the Sn or Sn / Ag plating layer may have a thickness of 2 μm to 10 μm. Can be formed.

6. Surface modification member

The surface modification member 6000 may be formed on at least a portion of the surface of the laminate 1000. That is, the surface modification member 6000 may be formed on the entire surface of the stack 1000, or may be formed only in an area in contact with the external electrode 5000 of the stack 1000. In other words, the surface modification member 6000 in which the surface modification member 6000 is formed on a part of the surface of the laminate 1000 may be formed between the laminate 1000 and the external electrode 5000. In this case, the surface modification member 6000 may be formed in contact with the extension region of the external electrode 5000. That is, the surface modification member 6000 may be provided between one region of the external electrode 5000 extending to the upper and lower surfaces of the laminate 1000 and the laminate 1000. In addition, the surface modification member 6000 may be provided to have the same size or a different size than the external electrode 5000 formed thereon. For example, an area of 50% to 150% of an area of a portion of the external electrode 5000 extending to the upper and lower surfaces of the stack 1000 may be formed. That is, the surface modification member 6000 may be formed to be smaller or larger than the size of the extension region of the external electrode 5000, or may be formed to have the same size. Of course, the surface modification member 6000 may also be formed between the external electrode 5000 formed on the side surface of the laminate 1000. The surface modification member 6000 may include a glass material. For example, the surface modification member 6000 may include non-borosilicate glass (SiO ₂ -CaO-ZnO-MgO-based glass) that can be fired at a predetermined temperature, for example, 950 ° C. or less. Can be. In addition, the surface modification member 6000 may further include a magnetic material. That is, when the region on which the surface modification member 6000 is to be formed is formed of the magnetic sheet, a magnetic material may be partially included in the surface modification member 6000 to facilitate coupling of the surface modification member 6000 and the magnetic sheet. In this case, the magnetic material may include, for example, NiZnCu-based magnetic powder, and may include, for example, 1 to 15 wt% of the magnetic material with respect to 100 wt% of the glass material. On the other hand, at least a portion of the surface modification member 6000 may be formed on the surface of the laminate 1000. In this case, at least a portion of the glass material may be evenly distributed on the surface of the stack 1000 as illustrated in FIG. 3A, and at least a portion of the glass material may have different sizes as illustrated in FIG. 3B. It may be distributed irregularly. Of course, the surface modification member 6000 may be continuously formed on the surface of the laminate 1000 to have a film form. In addition, as illustrated in FIG. 3C, a recess may be formed on at least part of the surface of the laminate 1000. That is, a glass material may be formed to form a convex portion, and at least a portion of the region where the glass material is not formed may be dug to form a recess. In this case, the glass material may be formed to a predetermined depth from the surface of the laminate 1000, and at least a portion thereof may be formed higher than the surface of the laminate 1000. That is, at least a portion of the surface modification member 6000 may be coplanar with the surface of the stack 1000, and at least a portion of the surface modification member 6000 may be maintained higher than the surface of the stack 1000. Thus, the surface of the laminate 1000 may be modified by distributing a glass material in a portion of the laminate 1000 to form the surface modification member 6000 before forming the external electrode 5000, thereby increasing the resistance of the surface. It can be made uniform. Therefore, the shape of the external electrode can be controlled, thereby facilitating the formation of the external electrode. Meanwhile, in order to form the surface modification member 6000 in a predetermined region of the surface of the laminate 1000, a paste including a glass material may be printed or applied to the predetermined region of the predetermined sheet. For example, the surface modification member 6000 may be formed by applying a glass paste to at least two regions of the lower surface of the first dielectric sheet 111 and at least two regions of the upper surface of the seventh discharge sheet 127 and curing the glass paste. In addition, the glass paste may be applied to a predetermined area of the ceramic green sheet before cutting to the size of the stacked element. That is, after applying the glassy paste to a plurality of areas of the ceramic green sheet, the green sheet is cut by the cutting line of the stacked element unit including the portion where the glassy paste is formed, and the circuit is protected by laminating it with the sheet on which the noise filter part is formed. A device can be manufactured. In this case, since the surface modification member 6000 is formed at the edge of the laminate 1000, the surface modification member 6000 may be cut in a stacked device unit based on a region where the glassy paste is applied.

Meanwhile, the surface modification member 6000 may be formed using an oxide. That is, the surface modification member 6000 may be formed using at least one of a glassy material and an oxide, and may further include a magnetic material. In this case, the surface modification member 6000 may be distributed by dispersing the oxide in the crystalline state or amorphous state on the surface of the laminate 1000, at least a portion of the oxide distributed on the surface may be melted. In this case, the oxide may be formed as shown in FIGS. 3A to 3C. In addition, even when the surface modification member 6000 is formed of an oxide, the oxides may be spaced apart from each other and distributed in an island form, or may be formed in a film form in at least one region. Here, the oxide in the granular or molten state is, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , H ₂ At least one of BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ , and CaCO ₃ may be used.

As described above, in the composite device according to the first exemplary embodiment, at least two or more functional units having different functions may be coupled by the coupling unit 4000. For example, the passive element such as the capacitor unit 2000 and the overvoltage protection unit 3000 may be manufactured and then coupled by the coupling unit 4000. Therefore, two or more functional parts made of different materials may be provided in one laminate 1000. In addition, since the composite device is manufactured and sintered in each manufacturing process and then bonded, the materials of different functional portions do not diffuse together, thereby not degrading the function of each functional portion.

In addition, since the glass layer is not formed on the entire surface, the thickness of the device may be reduced, and thus, the circuit protection device may be mounted in response to an electronic device having a reduced size and a reduced mounting area and height. And since the glassy layer is not formed in the whole surface, absorption of moisture can be suppressed and the reliability of an element can be improved by it. On the other hand, if the size of the device is smaller, the area of the external electrode is smaller, the adhesion between the external electrode and the laminate is reduced, and thus the adhesion strength may be lowered when mounting on the PCB, but the adhesion between the external electrode and the laminate is improved according to the present invention. By improving the adhesion strength.

4 is a schematic cross-sectional view of a composite device according to a second exemplary embodiment of the present invention.

Referring to FIG. 4, a composite device according to a second embodiment of the present invention may include a stack 1000 including a plurality of sheets 100, at least one capacitor part 2000 provided in the stack 1000, The first overvoltage protection part 3100 provided to be spaced apart from the capacitor part 2000 in the laminate 1000, the second overvoltage protection part 3200 provided between the capacitor part 2000 in the laminate 1000, The coupling part 4000 provided between the capacitor part 2000 and the first overvoltage protection part 3100 in the stack 1000 and the external electrode 5000 provided outside the stack 1000 may be included. That is, in the composite device according to the second embodiment of the present invention, two overvoltage protection units 3000 are provided in the stack 1000, and the first overvoltage protection unit 3100 is provided on the capacitor unit 2000. The second overvoltage protection unit 3200 may be provided in the capacitor unit 2000. That is, a suppressor may be provided in the capacitor unit 2000. Here, since the first overvoltage protection unit 3100 is the same as the overvoltage protection unit 3000 of the first embodiment, and the capacitor unit 2000 is the same as the capacitor unit 2000 of the first embodiment, a detailed description thereof will be omitted. . However, the capacitor part 2000 includes the first to fourth internal electrodes 210 to 240, and the second overvoltage protection part 3200 is disposed between the second internal electrode 220 and the third internal electrode 240. Can be prepared.

The second overvoltage protection part 3200 may include at least two discharge electrodes 313 and 314 spaced apart in the vertical direction, and at least one overvoltage protection member 320 provided between the discharge electrodes 313 and 314. have. For example, the second overvoltage protection unit 3200 may include the third and fourth discharge electrodes 313 and 314 and the fourth sheet 114 formed on the third and fourth dielectric sheets 113 and 114, respectively. It may include an over-voltage protection member 320 formed through. Here, the overvoltage protection member 320 may be formed such that at least a portion thereof is connected to the third and fourth discharge electrodes 313 and 314. The third and fourth discharge electrodes 313 and 314 may be formed to have the same thickness or different thicknesses from those of the first and second discharge electrodes 311 and 312 of the first overvoltage protection part 3100 and the capacitor part 2000. The thickness of the internal electrodes 200 may be the same as or different from that of the internal electrodes 200. For example, the third and fourth discharge electrodes 313 and 314 may be formed to have a thickness of 1 μm to 10 μm, and are thicker than the first and second discharge electrodes 311 and 313, and may be formed in the internal electrode 200. It may be formed to the same thickness. The third discharge electrode 313 is connected to the second external electrode 5200 and is formed on the third sheet 113, and the end portion thereof is connected to the overvoltage protection member 320. The fourth discharge electrode 314 is connected to the first external electrode 5100 and is formed on the fourth sheet 114, and the terminal portion is formed to be connected to the overvoltage protection member 320. That is, the third and fourth discharge electrodes 313 and 314 are formed to be connected to the adjacent external electrode 5000 with the adjacent inner electrode 200. That is, the third discharge electrode 313 is connected to the adjacent second internal electrode 220 and the second external electrode 5200, and the fourth discharge electrode 314 is adjacent to the third internal electrode 230 and the first external. It is connected to the electrode 5100. As such, when the third and fourth discharge electrodes 313 and 314 and the inner electrode 200 adjacent thereto are connected to the same external electrode 5000, an overvoltage such as an ESD may occur even when the dielectric sheet 110 is deteriorated, that is, the dielectric breakdown. It is not applied inside the electronic device. That is, when the third and fourth discharge electrodes 313 and 314 and the inner electrode 200 adjacent to each other are connected to different external electrodes 5000, the dielectric sheet 110 is applied through one external electrode 5000 when the dielectric sheet 110 is insulated and destroyed. The excess voltage flows to the other external electrode 5000 through the internal electrode 200 adjacent to the discharge electrodes 313 and 314. For example, when the third discharge electrode 313 is connected to the first external electrode 5100 and the second internal electrode 220 adjacent thereto is connected to the second external electrode 5200, the dielectric sheet 110 breaks the insulation. If a conductive path is formed between the third discharge electrode 313 and the second internal electrode 220, the ESD voltage applied through the first external electrode 5100 is the third discharge electrode 313, and the dielectric breakdown third. It may flow to the dielectric sheet 113 and the second internal electrode 220, and thus may be applied to the internal circuit through the second external electrode 5200. In order to solve this problem, the thickness of the dielectric sheet 110 may be formed thick, but in this case, there is a problem in that the size of the device becomes large. However, even when the third and fourth discharge electrodes 313 and 314 and the inner electrode 200 adjacent thereto are connected to the same outer electrode 5000, the overvoltage is applied into the electronic device even when the dielectric sheet 110 is destroyed. It doesn't work. In addition, it is possible to prevent the overvoltage from being applied without forming the thickness of the dielectric sheet 110 thickly.

Meanwhile, the regions of the third and fourth discharge electrodes 313 and 314 that are in contact with the overvoltage protection member 320 may be the same size or smaller than the overvoltage protection member 320. In addition, the third and fourth discharge electrodes 313 and 314 may be formed to completely overlap without leaving the overvoltage protection member 320. That is, the edges of the third and fourth discharge electrodes 313 and 314 may form a vertical component with the edges of the overvoltage protection member 320. Of course, the third and fourth discharge electrodes 313 and 314 may be formed to overlap a portion of the overvoltage protection member 320. For example, the third and fourth discharge electrodes 313 and 314 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection member 320. That is, the third and fourth discharge electrodes 313 and 314 are not formed beyond the overvoltage protection member 320. Meanwhile, the third and fourth discharge electrodes 313 and 314 may be formed to have a larger area than one in contact with the overvoltage protection member 320.

The overvoltage protection member 320 may be formed in a predetermined region, for example, a central portion of the fourth dielectric sheet 114 to be connected to the third and fourth discharge electrodes 313 and 314. In this case, the overvoltage protection member 320 may be formed to at least partially overlap the third and fourth discharge electrodes 313 and 314. That is, the overvoltage protection member 320 may be formed to overlap 10% to 100% of the horizontal area with the third and fourth discharge electrodes 313 and 314. The overvoltage protection member 320 may be formed to form a through hole having a predetermined size in a predetermined region, for example, a central portion of the fourth dielectric sheet 114, and fill the through hole using a thick film printing process. Of course, the overvoltage protection member 320 may be formed of only the through holes without filling the through holes. That is, the overvoltage protection member 320 may include a void or an overvoltage protection material provided in at least a portion of the void. On the other hand, the overvoltage protection member 320 may be formed, for example, a diameter of 100㎛ to 500㎛ and a thickness of 10㎛ to 50㎛. At this time, the thinner the thickness of the overvoltage protection member 320, the lower the discharge start voltage. The overvoltage protection member 320 may be formed using a conductive material and an insulating material. For example, the overvoltage protection member 320 may be formed by printing a mixed material of the conductive ceramic and the insulating ceramic on the fourth dielectric sheet 114. Meanwhile, the overvoltage protection member 320 may be formed on at least one dielectric sheet 110. That is, the overvoltage protection members 320 are formed on at least one dielectric sheet 110 stacked in the vertical direction, for example, and the discharge electrodes 310 are formed on the dielectric sheet 110 so as to be spaced apart from each other. And may be connected to the overvoltage protection member 320.

The overvoltage protection material that may be formed on the overvoltage protection member 320 is at least one selected from RuO ₂ , Pt, Pd, Ag, Au, Ni, Cr, W, and the like in organic materials such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB). It is possible to form a mixture of conductive materials. In addition, the overvoltage protection material may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ with the mixed material. Of course, a variety of materials may be used as the overvoltage protection material. For example, the overvoltage protection material may utilize at least one of a porous insulating material and a void. That is, a porous insulating material may be embedded or coated in the through hole, a void may be formed in the through hole, and a mixed material of the porous insulating material and the conductive material may be embedded or coated in the through hole. In addition, porous insulating materials, conductive materials, and voids may be formed in layers in the through holes. For example, a porous insulating layer is formed between the conductive layers, and voids may be formed between the insulating layers. In this case, the gap may be formed by connecting a plurality of pores of the insulating layer to each other. Here, as the porous insulating material, ferroelectric ceramics having a dielectric constant of about 50 to 500,000 may be used. For example, the insulating ceramic uses a mixture containing one or more of dielectric material powders such as MLCC, ZrO, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, Al ₂ O ₃ Can be formed. The porous insulating material may be formed in a porous structure in which a plurality of pores having a size of about 1 nm to 5 μm is formed to have a porosity of 30% to 80%. In this case, the shortest distance between the pores may be about 1nm to 5㎛. In addition, the conductive material used as the overvoltage protection material may be formed using a conductive ceramic, the conductive ceramic is at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Fe, Bi It is possible to use a mixture including.

On the other hand, in the composite device according to the present invention, the discharge electrode 310 of the overvoltage protection unit 3000 may be formed in various shapes. For example, as illustrated in FIGS. 5 and 6, the first and second discharge electrodes 311 and 312 formed on the same plane and connected to different external electrodes 5000 are formed at predetermined intervals and are disposed on the upper side thereof. Alternatively, the fifth discharge electrode 315 may be formed to partially overlap the first and second discharge electrodes 311 and 312. This will be described in more detail as follows. As shown in FIGS. 5 and 6, the first discharge electrode 311 is connected to the first external electrode 5100 so as to be disposed on the one discharge sheet 310, for example, the fifth discharge sheet 125 of FIG. 5. The second discharge electrode 312 is connected to the second external electrode 5200 and is formed on one discharge sheet 310, that is, the fifth discharge sheet 125, on which the first discharge electrode 311 is formed. In this case, the first and second discharge electrodes 311 and 312 are formed spaced apart from each other by a predetermined interval. In addition, the fifth discharge electrode 315 is formed on one discharge sheet 120, for example, the second discharge sheet 122, below the first and second discharge electrodes 311 and 312. The first and second discharge electrodes 311 and 312 are formed to overlap a predetermined region. The distance between the first and second discharge electrodes 311 and 312 is greater than the sum of the distances of the first and fifth discharge electrodes 311 and 315 and the distances of the second and fifth discharge electrodes 312 and 315. . That is, the distance between the first and second discharge electrodes 311 and 312 is referred to as A, the distance between the first and fifth discharge electrodes 311 and 315 is referred to as B, and the second and fifth discharge electrodes 312 are referred to as A. , 315) may have a relationship of A> B + C. In the overvoltage protection unit 3000 having such a structure, for example, an overvoltage applied from the outside is transmitted to the fifth discharge electrode 315 through the first discharge electrode 311, and then to the second discharge electrode 312. It can be bypassed to the ground terminal of the internal circuit.

The composite device according to embodiments of the present invention may be provided in an electronic device including a portable electronic device such as a smart phone. For example, as shown in FIG. 7, a composite including a capacitor part and an overvoltage protection part between an internal circuit (for example, a PCB) 20 of an electronic device and a user contactable conductor, that is, a metal case 10. An element may be provided. In FIG. 7, the capacitor portion is denoted by reference numeral C, and the overvoltage protection portion is denoted by reference numeral V. In FIG. That is, in the composite device, any one of the external electrodes 5000 may contact the metal case 10 and the other of the external electrodes 5000 may contact the internal circuit 20. In this case, a ground terminal may be provided in the internal circuit 20. Therefore, one of the external electrodes 5000 may be in contact with the metal case 10 and the other may be connected to the ground terminal. In addition, a contact portion 30 which is in electrical contact with the metal case 10 and has an elastic force may be provided between the metal case 10 and the composite element. That is, the contact unit 30 and the composite device according to the present invention may be provided between the metal case 10 and the internal circuit 20 of the electronic device. In this case, one of the external electrodes 5000 may be in contact with the contact unit 30 and the other may be connected to the ground terminal through the internal circuit 20. The contact part 30 may be made of a material having an elastic force and containing a conductive material to relieve the impact when an external force is applied from the outside of the electronic device. The contact portion 30 may have a clip shape or may be a conductive gasket. In addition, at least one region of the contact portion 30 may be mounted on the internal circuit 20, for example, a PCB. In this way, the composite device may be provided between the metal case 10 and the internal circuit 20 to block leakage current flowing from the internal circuit 20. In addition, an overvoltage such as an ESD may be bypassed to the ground terminal, and the insulation may not be broken by the overvoltage, so that the leakage current can be continuously interrupted. That is, in the composite device according to the present invention, current does not flow between the external electrodes 5000 at the electric shock voltage due to the rated voltage and the leakage current, and at the overvoltage such as ESD, current flows through the overvoltage protection unit 3000 so that the overvoltage is grounded. It can be bypassed to the terminal. Meanwhile, the composite device may have a breakdown voltage or a discharge start voltage higher than the rated voltage and lower than an overvoltage such as an ESD. For example, a composite device may have a rated voltage of 100V to 240V, an electric shock voltage may be equal to or higher than an operating voltage of a circuit, an overvoltage generated by external static electricity, or the like, may be higher than an electric shock voltage, and a breakdown voltage or The discharge start voltage may be 350V to 15kV. In addition, a communication signal may be transmitted between the external circuit and the internal circuit 20 by the capacitor unit 2000. That is, a communication signal from the outside, for example, an RF signal may be transmitted to the internal circuit 20 by the capacitor unit 2000, and the communication signal from the internal circuit 20 is external to the capacitor unit 2000. Can be delivered. Therefore, even when the metal case 10 is used as an antenna without a separate antenna, it is possible to exchange communication signals with the outside using the capacitor unit 2000. As a result, the composite device according to the present invention may block leakage current flowing from the ground terminal of the internal circuit, bypass an overvoltage applied from the outside to the ground terminal, and transmit a communication signal between the outside and the electronic device.

In addition, the composite device according to an embodiment of the present invention may be provided between the metal case 10 and the internal circuit 20 to be used as an electric shock prevention device, and a plurality of insulating sheets, that is, dielectric sheets having high breakdown voltage characteristics, may be stacked. By forming the capacitor part 2000, an insulation resistance state can be maintained so that a leakage current does not flow when an electric shock voltage of, for example, 310V is applied from the internal circuit by the defective charger to the metal case, and the overvoltage protection part is also provided in the metal case. When the overvoltage is applied to the internal circuit, the overvoltage can be bypassed to maintain a high insulation resistance state without damaging the device. Therefore, the insulation is not destroyed even by the overvoltage, and thus, it is possible to continuously prevent leakage current generated in the defective charger from being delivered to the user through the metal case of the electronic device provided in the electronic device having the metal case.

On the other hand, when comparing the characteristics of the composite device and the capacitor or the device having an overvoltage protection function according to the embodiments of the present invention. These characteristics comparison is to determine the leakage current, that is, the protection characteristics of the electric shock voltage or current and the overvoltage protection characteristics such as ESD, and the interference characteristics of the communication frequency when each element is provided between the metal case of the electronic device and the internal circuit.

First, in the case of a capacitor, that is, in the first embodiment of the present invention, when the overvoltage protection unit and the coupling unit do not exist and consist only of the capacitor unit, the capacitor has a leakage current blocking characteristic and no communication frequency interference occurs. The element may be damaged by an overvoltage, for example. In addition, the leakage current blocking function is lost after the device is damaged by the overvoltage.

In order to prevent communication frequency interference, TVS diodes cannot achieve discharge current blocking characteristics because the discharge start voltage of 320V cannot be realized in a small size when implemented with a capacitance of 20 kHz or more. In addition, when a discharge start voltage of 320V or more is implemented for electric shock protection, a capacitance of 20 mA or more is not obtained in a small size. That is, the instantaneous voltage suppression diode may have an overvoltage protection characteristic, but a communication frequency interference problem occurs for the electric shock protection characteristic, and there is a problem in that an electric shock protection characteristic is not obtained in order to avoid communication frequency interference.

In the case of the varistor, that is, in the first embodiment of the present invention, the capacitor portion and the coupling portion do not exist, and only the overvoltage protection portion is present, the discharge start voltage of 320 V at a small size when implemented with a capacitance of 20 kHz or more to avoid communication frequency interference. Implementable is impossible to achieve leakage current blocking characteristics. In addition, when a breakdown voltage of 320V or more is implemented for electric shock protection, a capacitance of 20 mA or more is not obtained in a small size. In other words, the varistor has an overvoltage protection characteristic, but there is a problem of communication frequency interference for electric shock protection characteristics, and a problem of failing to obtain electric shock protection characteristic to avoid communication frequency interference.

In the case of a device that simultaneously sinters the capacitor and the overvoltage protection part, that is, when the capacitor part and the overvoltage protection part are laminated and co-sintered, the ESD voltage above the discharge start voltage of the device, for example, overvoltage above 2 kV, is bypassed, but below the discharge start voltage. For example, there is a problem that the overvoltage of 2 kV or less cannot be bypassed. That is, in the case of co-sintered devices, there is a problem in that the overvoltage protection performance is lowered.

However, in the composite device according to the embodiments of the present invention, that is, the composite device manufactured by separately combining the capacitor unit and the overvoltage protection unit, and combined using the coupling unit, the overvoltage protection unit may obtain a low discharge start voltage of about 400V to 500V. Therefore, overvoltage of 2 kV or less, that is, 400 V or more can be bypassed. In addition, a device having a capacitance of 20 Hz or more, preferably 30 Hz to 100 Hz, in which communication frequency interference does not occur despite a low discharge start voltage can be implemented.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. In other words, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

1000: laminate 2000: capacitor portion
3000: overvoltage protection part 4000: coupling part
5000: external electrode 6000: surface modification member

Claims (16)

Manufacturing a capacitor part by laminating and sintering a plurality of dielectric sheets having internal electrodes formed thereon;
Manufacturing an overvoltage protection unit by stacking and sintering a plurality of discharge sheets having discharge electrodes formed thereon;
Providing a coupling part between the capacitor part and the overvoltage protection part to form a laminate by coupling the capacitor part and the overvoltage protection part; And
Forming an external electrode on the outside of the laminate;
After forming the laminate further comprises the step of heat treatment before forming the external electrode,
The heat treatment is carried out at a temperature lower than the sintering temperature of the capacitor portion and the overvoltage protection portion,
The dielectric sheet is formed of a mixture of dielectric material and varistor material,
The discharge sheet is formed of a mixture of varistor material and dielectric material,
The laminate is formed by providing the coupling part on one surface of the capacitor part in the stacking direction of the dielectric sheet and then coupling one surface of the overvoltage protection part in the lamination direction of the discharge sheet on the coupling part.
And the external electrode is formed to be connected to the internal electrode and the discharge electrode on two opposite surfaces of the laminate in a direction orthogonal to the stacking direction of the laminate.
delete delete The method of manufacturing a composite device according to claim 1, wherein at least one of the discharge electrodes formed on the same discharge sheet is spaced apart from each other by a predetermined interval on the same discharge sheet.
The method of claim 1, wherein an interval between the discharge electrodes is greater than an interval between the internal electrodes.
The method of claim 1, wherein a thickness of the internal electrode is equal to or thicker than a thickness of the discharge electrode.
The method of claim 1, wherein an overlap area between the internal electrodes is greater than an overlap area between the discharge electrodes.
The method of claim 1, wherein the discharge electrode includes first and second discharge electrodes spaced apart from each other on the same plane, and third discharge electrodes partially overlapping the first and second discharge electrodes and spaced in a vertical direction. And the distance between the first and second discharge electrodes is greater than the sum of the distance between the first and third discharge electrodes and the distance between the second and third discharge electrodes. The method of claim 1, further comprising forming a second overvoltage protection unit between at least two internal electrodes of the capacitor unit.
The method of claim 9, wherein the second overvoltage protection unit includes at least two discharge electrodes and an overvoltage protection member provided between the discharge electrodes.
The method of claim 1, wherein the bonding portion comprises at least one of glass, a polymer, and an oligomer.
The method of manufacturing a composite device according to claim 1, further comprising forming a surface modification member of a material different from the surface of the laminate on at least a portion of the surface of the laminate.
The method of claim 12, wherein the external electrode extends on at least one of the lowermost layer and the uppermost sheet of the laminate, and the surface modification member is formed between at least the extension region of the external electrode and the laminate. Way. delete The composite device manufactured by the manufacturing method of any one of Claims 1, 4-13.
Includes conductors and internal circuitry accessible to the user,
The electronic device of Claim 15 with which the composite element of Claim 15 was provided between the said conductor and the said internal circuit.

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