KR102522082B1 - Laminated device - Google Patents

Abstract

The present invention is a laminate in which a plurality of sheets are laminated; at least one noise filter unit provided inside the laminate and including a plurality of coil patterns; an external electrode provided outside the laminate and connected to at least a portion of the coil pattern; and a surface modification member provided between the laminate and at least a portion of the external electrode.

Description

Laminated device {Laminated device}

The present invention relates to a multilayer device, and more particularly, to a multilayer device capable of reducing a thickness and improving reliability.

Recently, various frequency bands are being used according to the multifunctionality of portable electronic devices, such as smart phones. That is, a plurality of functions using different frequency bands such as wireless LAN, Bluetooth, and GPS have been adopted within one smart phone. In addition, with the high integration of electronic devices, the density of internal circuits in a limited space increases, and accordingly, noise interference inevitably occurs between internal circuits. For example, noise of 750 MHz degrades call quality of a smartphone, and noise of 1.5 GHz degrades GPS quality.

In this way, a plurality of circuit protection elements are used to suppress noise of various frequencies of portable electronic devices and noise between internal circuits. For example, a capacitor, a chip bead, a common mode filter, and the like that remove noise of different frequency bands are used. Here, the common mode filter has a structure in which two choke coils are combined into one, and can pass a differential mode signal current and remove only a common mode noise current. That is, the common mode filter can classify and remove the differential mode signal current and the common mode noise current, which are alternating currents.

In addition, an ESD protection device is required to protect electronic devices from overvoltages such as ESD applied to electronic devices from the outside. However, when the common mode noise filter and the ESD protection device are mounted separately, the area occupied by them increases. Accordingly, a circuit protection device is implemented by stacking a common mode noise filter and an ESD protection device in a single chip. In this case, the common mode noise filter and the ESD protection element may be implemented on a non-magnetic ceramic sheet. In addition, a separation layer using a magnetic ceramic sheet is provided between the common mode noise filter and the ESD protection device, and upper and lower cover layers using magnetic sheets are provided on top and bottom of the common mode noise filter and the ESD protection device. In this case, each of the layers may be formed by stacking non-magnetic sheets or magnetic sheets having a predetermined thickness. In addition, a surface layer made of a glass sheet is further formed on the surface of each of the upper and lower magnetic cover layers. That is, a vitreous sheet is formed over the entire top and bottom surfaces. Accordingly, the circuit protection element is formed in a laminated structure of the glass sheet, the upper magnetic cover layer, the non-magnetic common mode noise filter, the magnetic separation layer, the non-magnetic ESD protection element, the lower magnetic cover layer, and the glass sheet.

A plurality of layers are stacked in this way, and a glass sheet is further formed on the entire surface of the upper and lower surfaces, thereby further increasing the thickness of the circuit protection element. Therefore, there is a limit to reducing the thickness of the circuit protection device according to the size reduction or mounting area reduction of the electronic device.

Korea Patent Registration No. 10-0876206

The present invention provides a multilayer device capable of reducing the thickness.

The present invention provides a multilayer device that includes a noise filter unit and may further include an overvoltage protection unit.

The present invention provides a stacked device in which glassy sheets are not formed on the upper and lower surfaces.

A stacked device according to an aspect of the present invention includes a stacked body in which a plurality of sheets are stacked; at least one functional unit provided inside the laminated body; an external electrode provided outside the laminate and connected to at least a portion of the functional unit; and a surface modification member provided between the laminate and at least a portion of the external electrode.

The laminate includes a first magnetic layer including at least one magnetic sheet, a nonmagnetic layer including at least one nonmagnetic sheet, and a second magnetic layer including at least one magnetic sheet.

The functional unit includes a noise filter unit provided in the non-magnetic layer and including at least one coil pattern.

At least two of the noise filter units are provided at a predetermined interval in the stacking direction of the sheets.

A connection electrode provided outside the laminate and spaced apart from the external electrode and connecting the two or more noise filter units is further included.

It further includes at least one non-magnetic sheet provided between at least two coil patterns and having at least one capacitor electrode formed thereon.

An overvoltage protection unit provided to be spaced apart from the noise filter unit is further included.

The overvoltage protection unit is provided on at least one of the first and second magnetic layers.

The external electrode extends on at least one of the lowermost and uppermost sheets of the laminate, and the surface modifying member is provided between the extended region of the external electrode and the laminate.

The connection electrode extends on at least one of the lowermost and uppermost sheets of the laminate, and the surface modifying member is provided between the extended region of the external electrode and the laminate.

The surface modifying member has a size equal to or different from that of the extension area of the external electrode or the connection electrode.

The surface modification member includes a glassy material.

At least a portion of the surface modification member is discontinuously or continuously formed.

In the multilayer device according to the embodiments of the present invention, since the glassy layer is not formed on the entire surface, the thickness of the device can be reduced, and the size is reduced accordingly, so that the mounting area and height of the multilayer device are reduced. can do.

In addition, in the case of a small-sized stacked device, the area of the external electrode is reduced, so the adhesion between the external electrode and the laminate is reduced, and thus the adhesion strength may be lowered when mounted on a PCB. However, according to the present invention, the adhesion between the external electrode and the laminate is improved It can increase the adhesive strength.

Reliability can be improved by forming an overvoltage protection unit in the magnetic layer without forming a glassy layer on the entire surface. That is, when a vitreous layer is formed on the entire surface, the vitreous layer absorbs moisture, which may reduce the reliability of the device. and thus reliability can be improved.

On the other hand, when the surface is made of a magnetic layer, when forming external electrodes in a plating process to improve SMT, plating spread occurs, making it difficult to control the shape of the external electrode. However, according to the present invention, a surface modification member is formed between the external electrode and the laminate By doing so, it is possible to improve plating spreading defects, and accordingly, poor properties and poor appearance of the multilayer device.

1 is a combined perspective view of a stacked element according to a first embodiment of the present invention;
2 to 5 are cross-sectional views of a multilayer device according to a first embodiment of the present invention.
6 is an exploded perspective view of the multilayer device according to the first embodiment of the present invention.
7 is a schematic cross-sectional view of a partial area of a stacked device according to embodiments of the present invention.
8 is a schematic diagram for explaining a method of manufacturing a partial area of a multilayer device according to example embodiments of the inventive concepts;
9 is an exploded perspective view of a multilayer device according to a second embodiment of the present invention;
10 and 11 are a partial plan view and cross-sectional view of a multilayer device according to a third embodiment of the present invention.
12 and 13 are a combined perspective view and an exploded perspective view of a stacked device according to a fourth embodiment of the present invention.
14 to 16 are perspective views, cross-sectional views, and equivalent circuit diagrams of a multilayer device according to a fifth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only these embodiments make the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information. In order to clearly express the various layers and each region in the drawing, the thickness is enlarged and expressed, and the same reference number in the drawing refers to the same element.

1 is a perspective view of a stacked device according to a first embodiment of the present invention, and FIGS. 2 to 5 are taken along lines A-A', B-B', C-C', and D-D' of FIG. 1, respectively. It is a cross-sectional view, and FIG. 6 is an exploded perspective view. 7 is a schematic cross-sectional view of some areas of the present invention, and FIG. 8 is a schematic diagram for explaining some manufacturing processes of the present invention.

1 to 6, the multilayer device according to the first embodiment of the present invention includes a multilayer body 1000 in which a plurality of sheets 110 to 180; 100 are stacked, and a noise filter provided in the multilayer body 1000. A surface modification member provided on at least a part between the unit 2000 and the overvoltage protection unit 3000, the external electrode 4000 provided outside the laminate 1000, and the contact surface of the laminate 1000 and the external electrode 4000 (5000). That is, in the multilayer device according to the embodiments of the present invention, at least one functional unit is formed inside the multilayer body 1000, and an external electrode 4000 is formed outside the multilayer body 1000 to be connected to the functional unit. A surface modifying member 5000 may be formed on at least a portion between the electrode 1000 and the external electrode 4000 . Although this embodiment describes a structure including a noise filter unit and an overvoltage protection unit as functional units, the present invention can be applied to all chip-type components forming external electrodes such as varistors, suppressors, resistors, inductors, and electric shock prevention elements. Here, the surface modification member 5000 may be formed between the contact surfaces of the laminate 1000 and the external electrode 4000, for example, the external electrode 4000 on the lower and upper surfaces of the laminate 1000 and It can be formed in the contact area. Of course, the surface modifying member 5000 may also be provided between the external electrodes 4000 contacting the side surfaces of the laminate 1000 . Also, the surface modifying member 5000 may be formed such that at least a portion of the surface of the laminate 1000 is exposed. That is, since the surface modifying member 5000 is not formed on the entire surface of the laminate 1000 but is formed only in the region where the external electrode 4000 is formed, the surface of the laminate 1000 may be exposed by the surface modifying member 5000. can

1. Laminates

The laminate 1000 may be provided in a substantially hexahedral shape. That is, the laminate 1000 has a predetermined length and width in one direction (eg X direction) and another direction (eg Y direction) orthogonal to each other in the horizontal direction, and in the vertical direction (eg Z direction). direction) may be provided in a substantially hexahedral shape having a predetermined height. Here, the length in the X direction may be equal to or different from the width in the Y direction, and the width in the Y direction may be equal to or different from the height in the Z direction. For example, the length and width may be the same, but the height may be different, and the ratio of the length, width and height may be 1 to 2:1:0.5 to 1. That is, based on the width, the length may be 1 to 2 times greater than the width, and the height may be 0.3 to 1 time greater than the width. However, the sizes in the X, Y, and Z directions can be variously modified depending on, for example, an internal structure of an electronic device to which the stacked element is connected, a shape of the stacked element, and the like.

The laminate 1000 may be formed by stacking a plurality of sheets 110 to 180; That is, the laminate 1000 may be formed by stacking a plurality of sheets 100 having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Accordingly, the length and width of the laminate 1000 may be determined by the length and width of the sheet 100, and the height of the laminate 1000 may be determined by the number of laminated sheets 100. Meanwhile, the plurality of sheets 100 may be magnetic sheets or non-magnetic sheets. That is, all of the plurality of sheets 100 may be magnetic sheets or non-magnetic sheets. However, at least some of the plurality of sheets 100 may be magnetic sheets, and the rest may be non-magnetic sheets. For example, the sheet in which the noise filter unit 2000 is implemented, that is, the first to fifth sheets 110 to 150 may be non-magnetic sheets, and the sheet in which the overvoltage protection unit 3000 is implemented, that is, the sixth sheet The to eighth sheets 160 to 180 may be magnetic sheets. Here, since the first sheet 110 is formed to cover the noise filter unit 2000 on which the coil pattern or the like is formed without forming the coil pattern constituting the noise filter unit 2000, it may be formed of a magnetic sheet. Meanwhile, the magnetic sheet may be formed using, for example, NiZnCu or NiZn-based magnetic ceramic. For example, the NiZnCu-based magnetic sheet may be formed by mixing Fe ₂ O ₃ , ZnO, NiO, and CuO, and Fe ₂ O ₃ , ZnO, NiO, and CuO are mixed in a ratio of, for example, 5:2:2:1. can be mixed with In addition, the non-magnetic sheet may be manufactured using, for example, low temperature co-fired ceramic (LTCC). The LTCC material may include Al ₂ O ₃ , SiO ₂ , and a glass material.

The plurality of sheets 100 may be provided in a rectangular plate shape having a predetermined thickness. For example, it may be provided in the shape of a square plate having the same length and width, or may be provided in the shape of a rectangular plate having different lengths and widths. In addition, all of the plurality of sheets 100 may be formed to have the same thickness, and at least one may be formed thicker or thinner than the others. For example, the sheet of the overvoltage protection unit 3000 may be formed to have a different thickness from the sheet of the noise filter unit 2000, and the sheet formed between the overvoltage protection unit 3000 and the noise filter unit 2000 may be a different sheet. It can be formed with a different thickness than the As a specific example, the thickness of at least one of the sheets between the overvoltage protection unit 3000 and the noise filter unit 2000, for example, the fifth sheet 150 and the sixth sheet 160 may be thicker than the other sheets. can That is, the interval between the overvoltage protection unit 3000 and the noise filter unit 2000 may be greater than the interval between the coil patterns of the noise filter unit 2000. Of course, the sheets of the noise filter unit 2000 may be formed to have the same thickness, and one sheet may be thinner or thicker than the other. Meanwhile, the plurality of sheets 100 may be formed to a thickness of, for example, 1 μm to 4000 μm, and may be formed to a thickness of 3000 μm or less. That is, depending on the thickness of the laminate 1000, each sheet 100 may have a thickness of 1 μm to 4000 μm, for example, 1 μm to 300 μm. However, the thickness and number of layers of the sheet 100 may be adjusted according to the size of the stacked device. That is, when applied to a multilayer device having a thin thickness or a small size, the sheet 100 may be formed with a thin thickness, and when applied to a multilayer device having a large thickness or a large size, the sheet 100 may be formed with a thick thickness. It can be. In addition, when the sheets 100 are stacked in the same number, the size of the stacked element is small and the thickness is reduced as the height is low, and the thickness may be thick as the size of the stacked element is increased. Of course, thin sheets can also be applied to large-sized stacked devices, in which case the number of stacked sheets increases. In this case, the sheet 100 may be formed to a thickness that is not destroyed when an overvoltage is applied. That is, even when the number of stacked sheets 100 or the different thicknesses are formed, at least one sheet may be formed with a thickness that is not destroyed by repeated application of overvoltage.

In addition, the laminate 1000 may further include a cover layer (not shown) provided on at least one of the lower part and the upper part. That is, the laminate 1000 may include cover layers respectively provided on the lowermost layer and the uppermost layer. At this time, only one cover layer may be provided on the top or bottom, or may be provided on both the top and bottom. Of course, a separate cover layer may not be provided, and the uppermost sheet, ie, the first sheet 110 may function as an upper cover layer, and the lowermost sheet, ie, the eighth sheet 180 may function as the upper cover layer. Upper and lower cover layers provided separately from the sheet 100 may be formed to have the same thickness. However, the lower and upper cover layers may be formed with different thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, the lower and upper cover layers may be provided by stacking a plurality of magnetic sheets. Meanwhile, the lower and upper cover layers may be thicker than each of the sheets 100 . That is, the cover layer may be thicker than the thickness of one sheet. Accordingly, when the uppermost and lowermost sheets, that is, the first and eighth sheets 110 and 180 function as the upper and lower cover layers, they may be formed to be thicker than the respective sheets 120 to 170 therebetween.

2. noise filter part

As shown in FIGS. 2 to 6 , the noise filter unit 2000 may include a plurality of sheets 110 to 150 stacked, and lead electrodes, coil patterns, and conductive materials are embedded in the plurality of sheets 110 to 150. A hole may be selectively formed. That is, the noise filter unit 2000 includes a plurality of sheets 110 to 150 each made of a non-magnetic material and a plurality of holes 351 and 352 selectively formed in the plurality of sheets 120 to 150 and filled with a conductive material. , 361, 362), the coil patterns 310, 320, 330, 340 formed on the selected sheets 120 to 150, and the coil patterns 310, 320 formed on the selected sheets 120 to 150, It may include lead electrodes 410, 420, 430, and 440 connected to the 330 and 340 and drawn out. Here, the plurality of holes 351 , 352 , 353 , 361 , 362 , and 363 filled with a conductive material form vertical connection wires 350 and 360 . That is, the plurality of holes 351 and 352 form the vertical connection wire 350 and the plurality of holes 361 and 362 form the vertical connection wire 360 . Meanwhile, the plurality of sheets 110 to 150 constituting the noise filter unit 2000 may all be provided in the same shape, for example, in the shape of a rectangular plate, all may be provided with the same thickness, and at least one of them may be provided. It may be provided with a different thickness. The configuration of the noise filter unit 2000 will be described in detail as follows.

The sheet 110 is provided in a substantially rectangular plate shape having a predetermined thickness. The sheet 110 is provided on the sheets 120 , 130 , 140 , and 150 on which coil patterns 310 , 320 , 330 , and 340 are formed. That is, the sheet 110 is provided to cover the second sheet 120 on which the coil pattern 310 is formed. At this time, the sheet 110 may be a non-magnetic sheet or a magnetic sheet. That is, when a cover layer (not shown) is provided on the sheet 110 and the cover layer is made of a magnetic sheet, the sheet 110 may be a non-magnetic sheet, but when the cover layer is not provided on the sheet 110 The sheet 110 may be a magnetic sheet.

A hole 351 filled with a conductive material, a first coil pattern 310 and a first lead electrode 410 are formed in the sheet 120 . The sheet 120 may be provided in a substantially rectangular plate shape having a predetermined thickness. That is, the sheet 120 may have a square or rectangular shape. The hole 351 may be formed in a predetermined area spaced apart from the center point of the sheet 120 in one direction. The central point may be defined as a point where two diagonal lines meet when an imaginary line is drawn diagonally from four corners. For example, the sheet 120 is provided in a rectangular shape, and the hole 351 is spaced apart at a predetermined interval from the center of the sheet 120 along one side direction, for example, along the direction in which the external electrodes 5120 and 5140 are formed. can be formed A conductive material is buried in the hole 351, which may be filled using a paste of a metal material. Also, the first coil pattern 310 may be formed with a predetermined number of turns by rotating in one direction from the hole 351 . For example, the first coil pattern 310 may be formed with 3 to 7.5 turns. In this case, the first coil pattern 310 may be formed not to pass through the central region of the sheet 120 . For example, the first coil pattern 310 may have a predetermined width and interval, and may be formed in a spiral shape that rotates outward in a counterclockwise direction. In this case, the line width and spacing of the first coil pattern 310 may be the same. Also, an end of the first coil pattern 310 is connected to the first lead electrode 410 . The first lead electrode 410 is formed to have a predetermined width and is exposed to one side of the sheet 120 . For example, the first outgoing electrode 410 extends in the direction of one side of the sheet 120, and one side of the sheet 120 in a direction opposite to the direction in which the hole 351 is formed at the center of the sheet 120. formed to be exposed to Thus, the first outgoing electrode 410 is connected to the first external electrode 4110 . Here, the first lead-out electrode 410 may be formed to have a width wider than that of the first coil pattern 310, thereby increasing a contact area with the first external electrode 4110 to prevent an increase in resistance. there is.

In the sheet 130, two holes 352 and 361, a second coil pattern 320, and a second lead electrode 420 are formed. The sheet 130 may be provided in the same shape as the sheets 110 and 120 . At this time, the sheet 130 may be provided with the same thickness as the sheets 110 and 120 or thicker than the sheets 110 and 120 . When the sheet 130 is thicker than the sheets 110 and 120, for example, it may be 1.1 to 2 times thicker. The hole 352 may be formed in a central region of the sheet 130 through the sheet 130 . At this time, the hole 352 may be formed at the same position as the hole 351 formed in the sheet 120 . In addition, the hole 361 may be formed in a predetermined area spaced apart from the center point in another direction by the same distance as the distance of the hole 352 from the center point. That is, based on the center point of the sheet 130, the two holes 352 and 361 are formed to be spaced apart at equal intervals. A conductive material is buried in the holes 352 and 361, which may be filled using a paste of a metal material. In addition, the holes 352 are connected to the conductive material buried in the hole 351 of the sheet 120 by a conductive material. The second coil pattern 320 may be formed with a predetermined number of turns by rotating in one direction from the hole 361 . For example, the second coil pattern 320 may be formed with fewer turns than the first coil pattern 310, but may be formed with 2.5 to 7 turns. In this case, the second coil pattern 320 may be formed so as not to pass through the central region of the sheet 130 and the hole 352 . For example, the second coil pattern 320 may have a predetermined width and interval, and may be formed in a spiral shape that rotates outward in a counterclockwise direction. That is, the second coil pattern 320 may be formed by rotating in the same direction as the first coil pattern 310 formed on the sheet 120 . Also, an end of the second coil pattern 320 is connected to the second lead electrode 420 . The second lead electrode 420 is formed to have a wider width than the width of the second coil pattern 320 and is exposed to one side of the sheet 130 . At this time, the second lead electrode 420 is spaced apart from the first lead electrode 410 formed on the sheet 120 at a predetermined interval and exposed in the same direction. The second outgoing electrode 420 may be connected to the first external electrode 4120 . That is, the outgoing electrodes 410 and 420 of the sheets 120 and 130 may be spaced apart from each other by a predetermined interval and exposed in the same direction to be connected to the first external electrodes 4110 and 4120, respectively.

A hole 362 , a third coil pattern 330 , and a third lead electrode 430 are formed in the sheet 140 . The sheet 140 may be provided in a substantially rectangular plate shape having a predetermined thickness. The hole 362 may be formed in a central region of the sheet 140 through the sheet 140 . At this time, the hole 362 may be formed at the same position as the hole 361 formed in the sheet 130 . The hole 362 is filled with a conductive material, for example, it can be filled using a paste of a metal material, and thus connected to the hole 361 of the sheet 130 . Also, the third coil pattern 330 may be formed with a predetermined number of turns by rotating in one direction from an area spaced apart from the hole 362 by a predetermined distance. That is, the third coil pattern 330 may be formed from a predetermined area spaced apart from the center of the sheet 140 in another direction by the same distance as the distance of the hole 362 . That is, the third coil pattern 330 may be formed from the same position as the hole 352 formed in the sheet 130 . Also, the third coil pattern 330 may be formed with the same number of turns as the second coil pattern 320, for example, 2.5 to 7 turns. In this case, the third coil pattern 330 may be formed so as not to pass through the central region of the sheet 140 and the hole 362 . For example, the third coil pattern 330 may have a predetermined width and interval, and may be formed in a spiral shape rotating outward in a clockwise direction. That is, the third coil pattern 330 may be formed by rotating in the opposite direction to the coil patterns 310 and 320 formed on the sheets 120 and 130 . Also, an end of the third coil pattern 330 is connected to the third lead electrode 430 . The third lead electrode 430 is formed to have a predetermined width and is exposed to one side of the sheet 140 . At this time, the third lead electrode 430 is formed to be exposed on a surface opposite to the first lead electrode 410 formed on the sheet 120 . In addition, the third lead electrode 430 is formed to form a straight line with the first lead electrode 410 formed on the sheet 120 . The third outgoing electrode 430 is connected to the first external electrode 4130 .

A fourth coil pattern 340 and a fourth lead electrode 440 are formed on the sheet 150 . The sheet 150 may be provided in a substantially rectangular plate shape having a predetermined thickness. The fourth coil pattern 340 may be formed with a predetermined number of turns by rotating in one direction from a predetermined area of the sheet 150 . For example, the fourth coil pattern 340 may be formed in the same number of turns as the first coil pattern 310 from an area overlapping an area of the sheet 140 where the hole 362 is formed. For example, the fourth coil pattern 340 may be formed with 3 to 7.5 turns. In this case, the fourth coil pattern 340 may be formed not to pass through the central region of the sheet 150 . Also, the fourth coil pattern 340 may have a predetermined width and interval, and may be formed in a spiral shape rotating outward in a clockwise direction. An end of the fourth coil pattern 340 is connected to the fourth lead electrode 440 . The fourth lead electrode 440 has a predetermined width and is exposed to one side of the sheet 150 . For example, the fourth outgoing electrode 440 extends along one side of the sheet 150, is spaced apart from the third outgoing electrode 430 formed on the sheet 140 by a predetermined distance, and the second outgoing electrode 440 formed on the sheet 130. It is formed to form a straight line with the lead electrode 420 . The fourth outgoing electrode 440 is connected to the first external electrode 4140 .

In addition, in the noise filter unit 2000, the first coil pattern 310 of the sheet 120 is connected to the third coil pattern 330 of the sheet 140 by a vertical connection wire 350, and the sheet 130 The second coil pattern 320 of the sheet 150 is connected to the fourth coil pattern 340 by a vertical connection wire 360 . That is, the first coil pattern 310 and the third coil pattern 330 are connected to each other, and the second coil pattern 320 and the fourth coil pattern 340 are connected to each other. Therefore, in the multilayer device according to the present invention, the first coil pattern 310 and the third coil pattern 330 connected thereto configure the first inductor, and the second coil pattern 320 and the fourth coil pattern 340 connected thereto constitute the first inductor. ) constitutes the second inductor. Also, in the noise filter unit 2000, the first and fourth coil patterns 310 and 340 may be formed with the same number of turns, and the second and third coil patterns 320 and 330 may be formed with the same number of turns. In this case, the number of turns of the first and fourth coil patterns 310 and 340 and the number of turns of the second and third coil patterns 320 and 330 may be different from each other. For example, the first and fourth coil patterns 310 and 340 may have more turns than the second and third coil patterns 320 and 330 . That is, one of the two coil patterns constituting the first inductor and one of the two coil patterns constituting the second inductor may be formed with the same number of turns and may be formed with a greater number of turns than the other coil patterns constituting the first and second inductors. there is. In this case, other coil patterns constituting the first and second inductors may be formed with the same number of turns. For example, the first and fourth coil patterns 310 and 340 may have 3 to 7.5 turns, and the second and third coil patterns 320 and 330 may have 2.5 to 7 turns. Specifically, the first and fourth coil patterns 310 and 340 have turns of 3, 4.5, 6.5 and 7.5, and the second and third coil patterns 320 and 330 have turns of 2.5, 4.5, 6.5 and 7.5, respectively. It can be formed with the number of turns of 7. However, since the first and third coil patterns 310 and 330 are connected to form a first inductor and the second and fourth coil patterns 320 and 340 are connected to form a second inductor, the first and second coil patterns 320 and 340 form a second inductor. The number of turns of all coil patterns of the inductor may be the same. Also, the first to fourth coil patterns 310, 320, 330, and 340 may have different lengths. That is, even if the coil patterns are formed with the same number of rotations, the lengths may be different.

Meanwhile, in the multilayer device according to the first embodiment of the present invention, the first coil pattern 310 and the third coil pattern 330 of the noise filter unit 2000 are connected to form a first inductor, and the second coil pattern 320 and the fourth coil pattern 340 are connected to form a second inductor. That is, odd-numbered coil patterns were connected and even-numbered coil patterns were connected. However, the first coil pattern 310 and the fourth coil pattern 340 are connected to form a first inductor, and the second coil pattern 320 and the third coil pattern 330 are connected to form a second inductor. You may. That is, outer coil patterns may be connected to each other and inner coil patterns may be connected to each other in a vertical direction. At this time, the first and third coil patterns 310 and 330 are formed with the same number of turns, the second and fourth coil patterns 320 and 340 are formed with the same number of turns, and the first and third coil patterns 310 and 340 are formed with the same number of turns. 330) and the number of turns of the second and fourth coil patterns 320 and 340 may be different.

Also, in the present invention, four or more coil patterns are formed and connected two by one to implement an inductor, but four or more coil patterns are formed and three or more coil patterns are connected to implement an inductor. Of course, a plurality of coil patterns may be formed, and three or more inductors may be implemented by connecting two coil patterns to each other. Also, the inductances of the plurality of inductors may be all the same, or at least one inductance may be different. In order to make the inductance different, for example, the number of turns of the coil pattern may be different.

3. Overvoltage protection

The overvoltage protection unit 3000 is formed by stacking a plurality of sheets 160 , 170 , and 180 on which the discharge electrodes 510 and 520 and the overvoltage protection member 530 are selectively formed, respectively. Here, the sheets 160, 170, and 180 may be provided with the same thickness, or at least one of them may be provided with a different thickness. In addition, the sheets 160, 170, and 180 may be made of a magnetic material. That is, the overvoltage protection unit 3000 may be provided in a magnetic layer made of a plurality of magnetic sheets. However, the sheets 160, 170, and 180 may be made of non-magnetic sheets, and accordingly, the overvoltage protection unit 3000 may be provided in a non-magnetic layer made of a plurality of non-magnetic sheets.

The sheet 160 may be provided in the same shape as the sheets 110 to 150 of the noise filter unit 2000, that is, in a substantially rectangular plate shape. At this time, the sheet 160 may be provided with the same thickness as the sheets 110 to 150 of the noise filter unit 2000, or may be provided with a different thickness. For example, the sheet 160 may be thicker than the sheets 110 to 150 of the noise filter unit 2000 . Therefore, the distance between the first discharge electrode 510 formed on the sheet 170 and the fourth coil pattern 340 formed on the sheet 150 is the coil pattern 310, 320, 330, 340) may be greater than the distance between them.

The sheet 170 has the same shape as the sheet 160 and may be thicker than the sheets 110 to 150 of the noise filter unit 2000 . A plurality of first discharge electrodes 511, 512, 513, 514; 510 are formed on the upper surface of the sheet 170. The plurality of first discharge electrodes 510 may be formed at the same location as the lead electrode 400 of the noise filter unit 2000 . That is, the 1-1 discharge electrode 511 is formed to overlap the first lead electrode 410, the 1-2 discharge electrode 512 is formed to overlap the second lead electrode 420, and the first The -3 discharge electrode 513 is formed to overlap the third lead electrode 430 , and the 1-4 discharge electrodes 514 are formed to overlap the fourth lead electrode 440 . Accordingly, the first discharge electrode 510 is connected to the first external electrode 4100 together with the lead electrode 400 of the noise filter unit 2000 . In addition, a plurality of overvoltage protection members 531, 532, 533, 534; 530 are formed on the sheet 170, and each of the plurality of overvoltage protection members 530 is provided at one end of the plurality of first discharge electrodes 510. can be formed That is, a hole penetrating the sheet 170 is formed at the distal end of the plurality of first discharge electrodes 510, and an overvoltage protection material is buried or applied to at least a portion of each hole to form an overvoltage protection member 530. It can be. For example, the overvoltage protection member 530 may be formed by coating a side surface of a hole formed in the sheet 170 with an overvoltage protection material, or may be formed by coating or filling at least a portion of the overvoltage protection material. The overvoltage protection material may be formed of at least one conductive material selected from RuO ₂ , Pt, Pd, Ag, Au, Ni, Cr, W, and the like. In order to form the overvoltage protection member 530 using such a conductive material, for example, the conductive material is mixed with an organic material such as PVA (Polyvinyl Alcohol) or PVB (Polyvinyl Butyral), and then applied or filled in the hole, followed by a firing process organic matter can be removed by At this time, the overvoltage protection member 530 may have a plurality of pores formed therein. For example, a plurality of pores may be formed in a region where organic matter is volatilized and removed. In addition, the overvoltage protection material may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ to the mixed material. Of course, various materials other than the above materials may be used as the overvoltage protection material. For example, at least one of a porous insulating material and a void may be used as the overvoltage protection material. That is, a porous insulating material may be filled or coated in the hole, a void may be formed in the hole, or a mixture of a porous insulating material and a conductive material may be buried or coated in the hole. In addition, a porous insulating material, a conductive material, and a void may be layered and formed in the hole. For example, a porous insulating layer may be formed between the conductive layers, and a gap may be formed between the insulating layers. At this time, the gap may be formed by connecting a plurality of pores of the insulating layer to each other. Of course, the overvoltage protection member 530 may be formed as an empty space inside the hole. Here, a ferroelectric ceramic having a permittivity of about 50 to 50,000 may be used as the porous insulating material. For example, the insulating ceramic uses a mixture including one or more of dielectric material powder such as MLCC, ZrO, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn, and Al ₂ O ₃ can be formed by The porous insulating material may have a porous structure in which a plurality of pores having a size of about 1 nm to 5 μm are formed to have a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 μm. In addition, the conductive material used as the overvoltage protection material may be formed using conductive ceramics, and the conductive ceramics may include one or more of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Fe, and Bi. A mixture containing may be used. Of course, the overvoltage protection member 530 may be formed as an air gap. That is, the overvoltage protection member 530 may be formed by forming an empty space between the first and second discharge electrodes 510 and 520 . Meanwhile, in the overvoltage protection member 530, at least one of the thickness and width of at least one region may be formed differently from other regions. For example, the overvoltage protection member 530 is formed to a predetermined thickness in the Z direction, that is, in the stacking direction of the sheets, and in the X and Y directions, that is, the direction in which the first external electrode 4100 is formed and the second external electrode orthogonal thereto. Each of the electrodes 4200 is formed to have a predetermined width, and the width in the X direction may be greater than the width in the Y direction in the middle region of the thickness. In addition, the overvoltage protection member 530 may have an elliptical cross-section in one cross section, and thus may be formed in an egg shape. Even in this case, one of the width and thickness of one region may be different from that of the other region. Also, the thickness of the overvoltage protection member 530 may be greater than the distance between the coil patterns 310 , 320 , 330 , and 340 .

The upper surface of the sheet 180 is formed with second discharge electrodes 520 extending in the direction of two opposite sides of the sheet 180 and exposed to the two sides. That is, the second discharge electrode 520 may be formed in a direction orthogonal to the formation direction of the first discharge electrode 510 . In addition, the second discharge electrode 520 has an extension portion formed at least partially overlapping with the overvoltage protection member 530 . That is, the second discharge electrode 520 is formed with a first width, and the area overlapping the overvoltage protection member 530, that is, the portion connected to the overvoltage protection member 530 is formed with a second width greater than the first width. extension is formed. The second discharge electrode 520 is connected to the second external electrodes 4210, 4220 and 4200 formed on two opposite side surfaces of the laminate 10. In addition, a predetermined area of the second discharge electrode 520 is connected to the overvoltage protection member 530 formed on the sheet 170. For this purpose, the area connected to the overvoltage protection member 530 is wider than other areas. can be formed

Meanwhile, the first and second discharge electrodes 510 and 520 of the overvoltage protection unit 3000 may be formed of a metal or metal alloy having a porous oxide formed on a surface thereof. Preferably, it may be formed of a metal or metal alloy in which a porous insulating layer is formed on the surface. That is, the first and second discharge electrodes 510 and 520 may include a conductive layer and a porous insulating layer formed on at least one surface of the conductive layer. In this case, the porous insulating layer may be formed on at least one surface of the first and second discharge electrodes 510 and 520 . That is, it may be formed on only one surface not in contact with the overvoltage protection member 530 or another surface in contact with the overvoltage protection member 530, and one surface not in contact with the overvoltage protection member 530 and the other surface in contact with the overvoltage protection member 530 can all be formed. In addition, the porous insulating layer may be entirely formed on at least one surface of the conductive layer, or may be formed only on at least a portion of the conductive layer. In addition, at least one region of the porous insulating layer may be removed or may be formed with a small thickness. That is, the porous insulating layer may not be formed on at least one region on the conductive layer, and the thickness of at least one region may be formed to be thinner or thicker than that of other regions. Preferably, the first and second discharge electrodes 510 and 530 are made of Al. This is because Al is cheaper than other metals and has almost similar conductivity to other metals. In addition, during firing, Al ₂ O ₃ is formed on the surface of Al and Al can be maintained on the inside. That is, when Al is formed on the sheets 170 and 180, it comes into contact with air, and the surface of Al is oxidized in a firing process to form Al ₂ O ₃ , and the inside of Al is maintained as it is. Accordingly, the discharge electrodes 510 and 520 may be formed of Al coated with a porous thin insulating layer Al ₂ O ₃ on the surface. Of course, other than Al, various metals may be used on which an insulating layer, preferably a porous insulating layer, is formed on the surface. When the porous insulating layer is formed on the surfaces of the first and second discharge electrodes 510 and 520 in this way, the overvoltage voltage can be more easily and smoothly discharged. That is, when the overvoltage protection member 530 is formed of a porous insulating material, discharge is performed through micropores. When a porous insulating layer is formed on the surfaces of the first and second discharge electrodes 510 and 520, The number of micropores may be increased more than that of the overvoltage protection member 530, and discharge efficiency may be improved accordingly. In addition, at least some regions of the first and second discharge electrodes 510 and 520 may be removed or at least some regions may have a different thickness than other regions. Even if the first and second discharge electrodes 510 and 520 are partially removed or formed thinly, electrical characteristics are not deteriorated because they are connected as a whole without a broken region on a plane.

Also, in the overvoltage protection unit 3000 , a discharge induction layer (not shown) may be further formed between the first and second discharge electrodes 510 and 520 and the overvoltage protection member 530 . Such a discharge inducing layer may be formed when the overvoltage protection member 530 is formed using a porous insulating material. In this case, the discharge induction layer may be formed of a dielectric layer having a higher density than the overvoltage protection member 530 . That is, the discharge inducing layer may be formed of a conductive material or an insulating material. For example, when the overvoltage protection member 520 is formed using porous ZrO and the first and second discharge electrodes 510 and 520 are formed using Al, the overvoltage protection member 530 and the first and second An AlZrO discharge inducing layer may be formed between the discharge electrodes 510 and 520 . Meanwhile, TiO may be used instead of ZrO as the overvoltage protection member 530, and in this case, the discharge inducing layer may be formed of TiAlO. The discharge induction layer may be formed by a reaction between the first and second discharge electrodes 510 and 520 and the overvoltage protection member 530 . Of course, the discharge induction layer may be formed by further reacting the materials of the sheets 170 and 180 . In this case, the discharge induction layer may be formed by a reaction of a discharge electrode material (eg Al), an overvoltage protection member material (eg ZrO), and a sheet material (eg LTCC material). The discharge inducing layer may be formed during a firing process. That is, during the firing process at a predetermined temperature, the discharge inducing layer 330 may be formed between the discharge electrodes 510 and 5200 and the overvoltage protection member 530 by mutual diffusion of the discharge electrode material and the overvoltage protection material. An overvoltage voltage may be induced to the overvoltage protection member 530 or a level of discharge energy induced to the overvoltage protection member 530 may be reduced by the discharge inducing layer. Accordingly, the discharge efficiency can be improved by more easily discharging the overvoltage voltage. In addition, since the discharge induction layer is formed, diffusion of a different kind of material to the overvoltage protection member 530 can be prevented. That is, diffusion of the insulating sheet material and the discharge electrode material into the overvoltage protection member 530 can be prevented, and external diffusion of the overvoltage protection member material can be prevented. Accordingly, the discharge induction layer can be used as a diffusion barrier, and thus the destruction of the overvoltage protection member 530 can be prevented.

4. External electrode

The first external electrodes 4100 may be provided on the first surface and the second surface opposite to the first surface of the laminate 1000, and may be provided on the first and second surfaces, respectively. That is, the first external electrodes 4100 may be provided on the first and second surfaces of the laminate 1000 facing each other in the X direction. The first external electrode 4100 may be connected to the lead electrode 400 of the noise filter unit 2000 and the first discharge electrode 510 of the overvoltage protection unit 3000, respectively. That is, the 1-1 external electrode 4110 is connected to the first lead electrode 410 and the 1-1 discharge electrode 511, and the 1-2 external electrode 4120 is connected to the second lead electrode 420. and connected to the 1-2nd discharge electrode 512, the 1-3rd external electrode 4130 connected to the 3rd lead electrode 430 and the 1-3rd discharge electrode 513, and the 1-4th external electrode 4130 The electrode 4140 is connected to the lead electric field 440 and the 1st-4th discharge electrodes 514. Also, the first external electrode 4000 may be connected between the input terminal and the output terminal, respectively. For example, the first-first and first-second external electrodes 4110 and 4120 formed on one side of the stacked device are connected to the signal input terminal, and the first-third and first-second external electrodes 4110 and 4120 formed on the other side corresponding thereto. 4 external electrodes 4130 and 4140 may be connected to an output terminal, for example, a system.

One second external electrode 4200 may be provided on each of the third and fourth surfaces facing each other of the laminate 1000 on which the first external electrode 4100 is not formed. That is, the second external electrodes 4200 may be provided on the third and fourth surfaces of the laminate 1000 that face each other in the Y direction. The second external electrode 4200 may be connected to the second discharge electrode 520 of the overvoltage protection unit 3000 . That is, the 2-1st and 2-2nd external electrodes 4210 and 4220 may be provided on the third and fourth side surfaces of the laminate 10, respectively, and connected to the second discharge electrode 520. Also, the second external electrode 4200 may be connected to the ground terminal. Thus, the overvoltage voltage can be bypassed to the ground terminal.

The first and second external electrodes 4100 and 4200 may extend to the upper and lower surfaces of the stack 1000 . That is, the first external electrodes 4100 are provided on first and second surfaces facing each other in the X direction of the stack 1000 and on two surfaces opposite to each other in the Z direction of the stack 1000, that is, an upper surface and a lower surface. It can be extended to the surface. In addition, the second external electrodes 4200 are provided on third and fourth surfaces of the stack 1000 that face each other in the Y direction, and are provided on two surfaces of the stack 1000 that face each other in the Z direction, that is, an upper surface and a lower surface. It can be extended to the surface. Accordingly, the external electrode 4000 may extend from the side surface of the laminate 1000 to the upper and lower surfaces, and may be formed in a “c” shape, for example.

Meanwhile, the first and second external electrodes 4100 and 4200 may be formed of at least one layer. The first and second external electrodes 4100 and 4200 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the first and second external electrodes 4100 and 4200 may be formed by stacking a copper layer, a Ni plating layer, and a Sn or Sn/Ag plating layer. In addition, the first and second external electrodes 4100 and 4200 are formed by mixing a multi-component glass frit containing, for example, 0.5% to 20% of Bi ₂ O ₃ or SiO ₂ as a main component with metal powder. can form At this time, a mixture of glass frit and metal powder may be prepared in the form of a paste and applied to two opposite surfaces of the laminate 10 . In this way, since the glass frit is included in the first and second external electrodes 4100 and 4200, adhesion between the first and second external electrodes 4100 and 4200 and the laminate 10 can be improved, and the lead electrode 400 , the contact reaction between the first and second discharge electrodes 510 and 520 and the first and second external electrodes 4100 and 4200 may be improved. In addition, after a conductive paste containing glass is applied, at least one plating layer may be formed thereon to form the first and second external electrodes 4100 and 4200 . That is, a metal layer including glass and at least one plating layer may be formed thereon to form the first and second external electrodes 4100 and 4200 . For example, the first and second external electrodes 4100 and 4200 may be formed by sequentially forming a Ni plating layer and a Sn plating layer through electrolytic or electroless plating after forming a layer including a glass frit and at least one of Ag and Cu. can At this time, the Sn plating layer may be formed to a thickness equal to or thicker than the Ni plating layer. Meanwhile, the first and second external electrodes 4100 and 4200 may be formed to a thickness of 2 μm to 100 μm, a Ni plating layer is formed to a thickness of 1 μm to 10 μm, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 μm to 10 μm. It may be formed to a thickness of ㎛ to 10㎛.

5. Surface modification member

The surface modifying member 5000 may be formed on a portion of the surface of the laminate 1000 . That is, the surface modifying member 5000 may be formed only in a region of the laminate 1000 in contact with the external electrode 4000 . In other words, the surface modification member 5000 may be formed between the laminate 1000 and the external electrode 4000 . In this case, the surface modification member 5000 may be formed in contact with the extended area of the external electrode 4000 . That is, the surface modification member 5000 may be provided between the laminate 1000 and one region of the external electrode 4000 extending to the upper and lower surfaces of the laminate 1000 . In addition, the surface modifying member 5000 may have the same size as or a different size than the external electrode 4000 formed thereon. For example, an area of 50% to 150% of the area of a part of the external electrode 4000 extending to the upper and lower surfaces of the laminate 1000 may be formed. That is, the surface modifying member 4000 may be formed in a size smaller or larger than the size of the extension region of the external electrode 4000, or may be formed in the same size. Also, adjacent surface modifying members 5000 may be formed so as not to contact each other. However, since the surface modification member 5000 is insulative, adjacent surface modification members 5000 may be connected to each other, but it is not preferable because the total area of the surface modification member 5000 is increased. The surface modification member 5000 may include a glass material. For example, the surface modification member 5000 may include non-borosilicate glass (SiO ₂ -CaO-ZnO-MgO-based glass) that can be fired at a predetermined temperature, for example, 950° C. or less. can In addition, the surface modification member 5000 may further include a magnetic material. That is, if a region where the surface modification member 5000 is to be formed is made of a magnetic sheet, a magnetic material may be partially included in the surface modification member 5000 to facilitate coupling between the surface modification member 5000 and the magnetic sheet. In this case, the magnetic material includes, for example, NiZnCu-based magnetic powder, and the magnetic material may be included in an amount of, for example, 1 to 15 wt% with respect to 100 wt% of the glass material. Meanwhile, at least a portion of the surface modification member 5000 may be formed on the surface of the laminate 1000 . At this time, as shown in (a) of FIG. 7, at least a portion of the glass material may be evenly distributed on the surface of the laminate 1000, and as shown in (b) of FIG. 7, at least a portion of the glass material may have different sizes. may be irregularly distributed. Of course, the surface modifying member 5000 may be continuously formed on the surface of the laminate 1000 to have a film shape. Also, as shown in (c) of FIG. 7 , a concave portion may be formed on at least a portion of the surface of the laminate 1000 . That is, the convex portion may be formed by forming the glass material, and the concave portion may be formed by concaving at least a part of the region where the glass material is not formed. In this case, the glass material may be formed to a predetermined depth from the surface of the laminate 1000 so that at least a portion thereof is higher than the surface of the laminate 1000 . That is, at least a portion of the surface modifying member 5000 may be flush with the surface of the laminate 1000 and at least a portion may be maintained higher than the surface of the laminate 1000 . In this way, the surface of the laminate 1000 may be modified by distributing a glass material on a partial region of the laminate 1000 before forming the external electrode 4000 to form the surface modification member 5000, thereby reducing the resistance of the surface. can be done evenly. Accordingly, it is possible to control the shape of the external electrode, thereby facilitating the formation of the external electrode. Meanwhile, in order to form the surface modifying member 5000 on a predetermined area of the surface of the laminate 1000, a paste containing a glass material may be printed or applied to a predetermined area of a predetermined sheet. For example, the surface modification member 5000 may be formed by applying glass paste to six regions of the upper surface of the first sheet 110 and six regions of the lower surface of the eighth sheet 180 and then curing the paste. In addition, the glass paste may be applied to a predetermined area of the ceramic green sheet prior to being cut into the size of the multilayer device. That is, as shown in FIG. 8 , after the glassy paste 210 is applied to a plurality of areas of the ceramic green sheet 200, the cutting line 220 of the multilayer device unit includes the portion where the glassy paste 210 is formed. A multilayer device may be manufactured by cutting a green sheet and stacking the green sheet with a sheet having a noise filter unit and an overvoltage protection unit. At this time, since the surface modification member 5000 is formed at the edge of the stack 1000, it may be cut in units of stacked devices around the region where the vitreous paste is applied.

Meanwhile, the surface modification member 5000 may be formed using an oxide. That is, the surface modification member 5000 may be formed using at least one of a glass material and an oxide, and may further include a magnetic material. In this case, in the surface modification member 5000, oxides in a crystalline state or amorphous state may be dispersed and distributed on the surface of the laminate 1000, and at least a portion of the oxides distributed on the surface may be melted. At this time, even in the case of oxide, it may be formed as shown in FIGS. 7(a) to 7(c). In addition, even when the surface modifying member 5000 is formed of oxide, the oxides may be distributed in an island shape spaced apart from each other, or may be formed in a film shape in at least one area. Here, oxides in a particulate or molten state are, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , H ₂ At least one of BO ₃ , Ca(CO ₃ ) ₂ , Ca(NO ₃ ) ₂ , and CaCO ₃ may be used.

As described above, in the multilayer device according to an embodiment of the present invention, the noise filter unit 2000 and the overvoltage protection unit 3000 are provided inside the laminate 1000, and the noise filter unit 2000 is provided on the non-magnetic layer And the overvoltage protection unit 3000 may be provided on the magnetic layer. In addition, glassy surface layers are not formed on the upper and lower surfaces of the laminate 1000 . Accordingly, the thickness of the multilayer device can be reduced, and accordingly, the multilayer device can be mounted in response to an electronic device having a reduced mounting height. In addition, in the case of a small-sized stacked device, the area of the external electrode 4000 is reduced so that the adhesion between the external electrode 4000 and the laminate 1000 is reduced, so that the adhesive strength may be lowered when mounted on a PCB. Attachment strength may be increased by improving adhesion between the electrode 4000 and the laminate 1000 . Of course, the surface modification member 5000 containing a glass material may be formed on some regions of the upper and lower surfaces of the laminate 1000 to facilitate the formation of the external electrodes 4000 . That is, when the external electrode 4000 is formed in a plating process to improve SMT when the surface is made of a magnetic layer, plating spread occurs, making it difficult to control the shape of the external electrode 4000, but according to the present invention, the external electrode 4000 and By forming the surface modification member 5000 between the laminates 1000, plating spreading defects may be improved, and thus defects in characteristics and appearance of the laminate device may be improved.

9 is an exploded perspective view of a multilayer device according to a second embodiment of the present invention.

Referring to FIG. 9 , the multilayer device according to the second embodiment of the present invention includes a multilayer body 1000, a noise filter unit 2000 and an overvoltage protection unit 3000 provided in the multilayer body 1000, and A capacitor electrode 610 is formed in the filter unit 2000 . That is, the sheet 190 on which the capacitor electrode 610 is formed between the sheet 130 on which the second coil pattern 320 of the noise filter unit 2000 is formed and the sheet 140 on which the third coil pattern 330 is formed. can be provided. Since the configuration of the noise filter unit 2000 and the overvoltage protection unit 3000 of the second embodiment of the present invention are the same as those of the first embodiment, the explanation will be omitted and the description of the capacitor 600 will be described below.

In the sheet 190, two holes 353 and 363, a capacitor electrode 610, and a lead electrode 620 are formed. The holes 353 and 363 may be formed to be spaced apart from each other, and may be formed to be spaced apart from each other in one direction and the other direction opposite to each other at the center point of the sheet 190 . Here, the hole 353 may be formed at the same position as the hole 352 of the sheet 130, and the hole 363 may be formed at the same position as the hole 361 of the sheet 130. A conductive material is buried in the holes 353 and 363, which may be filled using a paste of a metal material. The holes 353 and 363 are connected to the conductive material buried in the holes 352 and 361 of the sheet 130, respectively. Accordingly, the holes 353 and 363 become part of the vertical connection wires 350 and 360 . The capacitor electrode 610 is spaced apart from the holes 353 and 363 and is formed in at least one area on the sheet 190 with a predetermined area. The area of the capacitor electrode 610 and the area of the sheet 190 on which the capacitor electrode is not formed may be formed in a ratio of, for example, 1:100 to 100:1. That is, the capacitor electrode 610 may be formed on 1% of the area of the sheet 190 or may be formed on the entire upper portion of the sheet 190 so as not to contact the holes 353 and 363 . In addition, the capacitor electrode 610 may be formed in various shapes such as a quadrangular shape, a polygonal shape (including rounded corners), a circular shape, an elliptical shape, a spiral shape, and a meander shape. In particular, the capacitor electrode 610 may be formed in the same shape as the coil patterns 310, 320, 330, and 340. A capacitor may be provided between the sheet 190 and the sheet 130 and between the sheet 190 and the sheet 140 by the capacitor electrode 610 . That is, two capacitors may be provided. Also, the capacitance of the multilayer device according to the present invention may be adjusted according to the area of the capacitor electrode 610 . Meanwhile, a portion of the capacitor electrode 610 may be exposed on one side of the sheet 190 . For example, a portion of the capacitor electrode 610 may be exposed on one side and formed as the lead electrode 620. The lead electrode 620 is formed to be exposed on one area of one side of the sheet 190 to form the lead electrode 620. 2 may be connected to the external electrode 5210.

Meanwhile, the capacitor electrode may be formed in various shapes. For example, two capacitor electrodes may be formed to face each other with a hole formed therebetween, and in this case, the two electrodes may have symmetrical shapes. Also, one capacitor electrode may be formed or two capacitor electrodes may be formed. That is, one capacitor electrode 610 may be formed to be spaced apart from the holes 353 and 363 and surround a predetermined area of the holes 353 and 363 . At this time, a part of the region facing the holes 353 and 363 of the capacitor electrode 610 may be formed to be curved along the arc of the holes 353 and 363 . In addition, two capacitor electrodes are formed spaced apart by a predetermined interval with holes 353 and 363 interposed therebetween, and an area facing the holes 353 and 363 of one capacitor electrode is curved along the arc of the holes 353 and 356. A region facing the holes 353 and 363 of the other capacitor electrode may be formed in a straight line shape. Of course, the side facing the holes 353 and 363 of the two capacitor electrodes formed at a predetermined interval with the holes 353 and 363 interposed therebetween may be formed in a straight line shape.

As described above, in the multilayer device according to the second embodiment of the present invention, the capacitor electrode 610 is provided between the sheets 130 and 140, and the first capacitor is provided between the capacitor electrode 610 and the third coil pattern 330. and a second capacitor is formed between the capacitor electrode 610 and the second coil pattern 320 . After all, the multilayer device according to the present invention includes first and second inductors and first and second capacitors respectively connected thereto. That is, the multilayer device according to the second embodiment of the present invention includes at least two inductors and at least two capacitors respectively connected thereto.

In the multilayer device according to the second embodiment of the present invention, the number of turns of the coil patterns 310, 320, 330, and 340, the area of the capacitor electrode 610, and the spacing between the coil patterns 310, 320, 330, and 340 That is, by adjusting the thickness of the sheets 120, 130, 140, 150, and 190, inductance and capacitance can be adjusted, and accordingly, noise of a frequency that can be suppressed can be adjusted. For example, when the thickness of the sheets 120, 130, 140, 150, and 190 is reduced, noise in a low frequency band can be suppressed, and when the thickness is increased, noise in a high frequency band can be suppressed. The multilayer element composed of two inductors and two capacitors, that is, a common mode noise filter, can suppress noise in two frequency bands.

In the frequency characteristics of the multilayer device according to the second embodiment of the present invention, two peaks appear in the 1 GHz band and higher bands, and accordingly, noise in the two frequency bands can be suppressed. However, a conventional common mode noise filter without a capacitor has one peak in a 1 GHz band, and thus can suppress only noise in one frequency band. As a result, the multilayer device according to the second embodiment of the present invention can suppress noise of two or more frequency bands, and accordingly, it is used in portable electronic devices such as smart phones employing functions of various frequencies to improve the quality of electronic devices. can improve

Meanwhile, in the first and second embodiments of the present invention described above, the overvoltage protection unit 3000 includes first and second discharge electrodes 510 and 520 spaced apart in a vertical direction, and an overvoltage protection member 530 provided therebetween. ) were included. However, the first and second discharge electrodes 510 and 520 are provided on the same sheet in a horizontal direction, and the overvoltage protection member 530 is formed to partially overlap the first and second discharge electrodes 510 and 520. can That is, as shown in FIGS. 10 and 11 , the first and second discharge electrodes 510 and 520 and the overvoltage protection member 530 are provided on the same plane to implement the overvoltage protection unit 3000 . Here, FIG. 10 is a plan view of one sheet 107 on which the overvoltage protection unit 3000 according to the third embodiment of the present invention is formed, and FIG. 11 is a cross-sectional view taken along line E-E' of FIG. 10 . On the other hand, since the noise filter unit 2000 may be formed in any one structure of the first embodiment described with reference to FIGS. 1 to 6 and the second embodiment described with reference to FIG. I will omit it.

As shown in FIGS. 10 and 11 , a plurality of first discharge electrodes 511, 512, 513, 514; 510 are spaced apart from each other and formed on a sheet 107 made of a magnetic material. In this case, since the plurality of first discharge electrodes 510 are respectively connected to the plurality of first external electrodes 4100, one end may be exposed on the surface on which the first external electrodes 4100 are formed. In addition, the second discharge electrode 520 is formed to be spaced apart from the plurality of first discharge electrodes 510 on the same plane as the plurality of first discharge electrodes 510 . At this time, since the second discharge electrode 520 is connected to the second external electrode 4200, one end and the other end are exposed on the surface on which the second external electrode 4200 is formed. And, a plurality of overvoltage protection members 531 , 532 , 533 , 534 ; 530 are formed between the plurality of first discharge electrodes 510 and the second discharge electrodes 520 . That is, the plurality of overvoltage protection members 530 are formed on the sheet between the first and second discharge electrodes 510 and 520, and at least partially overlap the first and second discharge electrodes 510 and 520. do. At this time, the different overvoltage protection members 530 are formed so as not to come into contact with each other on the second discharge electrode 520 .

12 is a perspective view of a multilayer device according to a fourth embodiment of the present invention, and FIG. 13 is an exploded perspective view.

12 and 13, the multilayer device according to the fourth embodiment of the present invention includes a noise filter unit 2000 and cover layers 1100 and 1200 provided on top and bottom of the noise filter unit 2000. can do. That is, the multilayer device according to the fourth embodiment of the present invention may include only a noise filter unit without an overvoltage protection unit. At this time, cover layers 1100 and 1200 may be provided on the upper and lower portions of the noise filter unit 2000 . That is, the first cover layer 1100, the noise filter unit 2000, and the second cover layer 1200 may be provided from the top. Here, the configuration of the noise filter unit 1000 is formed by stacking a plurality of coil patterns as described in the first embodiment of the present invention, and at least two coil patterns are connected to form an inductor, so that at least two or more inductors can be configured. And, as described in the second embodiment, a capacitor may be formed in the noise filter unit 2000. Also, the first and second cover layers 1100 and 1200 may be formed of a magnetic sheet, and the noise filter unit 2000 may be formed of a non-magnetic sheet.

FIG. 14 is a perspective view of a multilayer device according to a fifth embodiment of the present invention, FIG. 15 is a cross-sectional view taken along line E-E′ of FIG. 14, and FIG. 16 is an equivalent circuit diagram.

14 to 16, the stacked device according to the fifth embodiment of the present invention includes a stacked body 1000 in which a plurality of sheets 100 are stacked, and a plurality of coil patterns 300 within the stacked body 1000. At least two or more noise filter units (2100, 2200; 2000) including each are provided. Here, at least two or more noise filter units 2000 may be spaced apart from each other with the fifth and sixth sheets 150 and 160 interposed in the stacking direction of the sheet 100 . In addition, the plurality of coil patterns 310, 320, 330, and 340 of the first noise filter unit 2100 are connected to the sheet 100 through vertical connection wires 351 and 352, and the second noise filter unit 2200 The plurality of coil patterns 370 , 380 , 390 , and 391 of ) are connected through vertical connection wires 352 and 362 formed on the sheet 100 . In addition, external electrodes 4110, 4120, and 4130 formed on two opposite sides of the laminate 1000, that is, first and second surfaces facing each other in the X direction, are connected to at least two or more noise filter units 2000. , 4140; Here, a lead electrode extending outward from the coil patterns of the at least two or more noise filter units 2100 and 2200 is formed. The connection electrode 6000 is a lead electrode to connect the at least two or more noise filter units 2100 and 2200. It is connected to (450, 460, 470, 480). That is, in the multilayer device according to the fifth embodiment of the present invention, at least two or more common mode noise filters 2000 each including a plurality of coil patterns 300 are connected by a connection electrode 6000, as shown in FIG. can be connected in series as Of course, although not shown, an overvoltage protection unit may be further formed in the laminate 1000 .

Meanwhile, the connection electrode 6000 is floated on the circuit. That is, the connection electrode 6000 serves to connect at least two coil patterns 300 of each of the at least two or more noise filter units 2000 and externally connects to other circuits, such as an input terminal, an output terminal, or a ground terminal. It doesn't connect. Also, although the connection electrode 6000 is formed outside the stack 1000 , the connection electrode 6000 may be formed inside the stack 1000 . That is, through-holes are formed outside the coil patterns 300 of at least two selected sheets of the plurality of sheets 100, and the through-holes are filled with a conductive material to form coil patterns 300 of each of the at least two noise filter units 2000. It may also function as a connection electrode 6000 connecting each other. The characteristics of the noise filter unit 2000 may be improved by using the parasitic inductance of the connection electrode 6000 . At this time, the parasitic inductance of the connection electrode 6000 changes according to the interval between the first and second noise filter units 2100 and 2200. If the interval between the noise filter units 2000 is wide, the parasitic inductance increases and the interval decreases. Narrowing reduces parasitic inductance. The first and second noise filter units 2000 have an interval of 5 μm to 500 μm, for example. In addition, when the parasitic inductance of the connection electrode 6000 increases, the insertion loss frequency decreases, and when the parasitic inductance decreases, the insertion loss frequency increases. Accordingly, parasitic inductance of the connection electrode 6000 may be adjusted by adjusting the spacing between at least two or more noise filter units 2000, and accordingly, the insertion loss frequency may be adjusted. For example, the insertion loss frequency may be adjusted to 0.4 GHz to 5 GHz. In addition, by connecting at least two or more noise filter units 2000 in series using the connection electrode 6000, it is possible to implement a low insertion loss characteristic in a desired frequency band and implement a wide bandwidth. Therefore, since noise of various frequencies can be removed, noise removal characteristics can be improved.

Meanwhile, the embodiments of the present invention have been described by showing that the coil patterns 310, 320, 330, and 340 of the noise filter unit 2000 are formed one by one on one sheet, but two or more coils are formed in one sheet. A pattern may be formed. For example, two coil patterns may be spaced apart from each other, or three coil patterns may be spaced apart from each other on one sheet. A plurality of coil patterns spaced apart from each other may be connected in a vertical direction to form an inductor, for example. At this time, the coil patterns formed on the same sheet may be formed with the same number of turns or may be formed with different numbers of turns. When formed with the same number of turns, a plurality of inductors all having the same inductance may be implemented, and when formed with different numbers of turns, a plurality of inductors having at least two different inductance numbers may be implemented. Thus, a plurality of inductors may be implemented in one stacked device. In addition, an overvoltage protection unit may be formed on the lower and/or upper side of the noise filter unit 2000, and cover layers may be formed on the upper and lower sides without the overvoltage protection unit.

Although the technical idea of the present invention has been specifically described according to the above embodiments, it should be noted that the above embodiments are for explanation and not for limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical spirit of the present invention.

1000: laminate 2000: noise filter unit
3000: overvoltage protector 4100: first external electrode
4200: second external electrode 5000: surface modification member

Claims (13)

a laminated body in which a plurality of sheets are laminated;
Functional units including at least two noise filter units provided inside the laminate and spaced apart from each other by a predetermined interval in the stacking direction of the sheets;
an external electrode provided outside the laminate and connected to at least a portion of the functional unit;
a surface modification member provided between the laminate and at least a portion of the external electrode; and
A multilayer device comprising: a connection electrode provided outside the multilayer body to be spaced apart from the external electrode and connecting the two or more noise filter units.
The method according to claim 1, wherein the laminate is a laminated type in which a first magnetic layer including at least one magnetic sheet, a nonmagnetic layer including at least one nonmagnetic sheet, and a second magnetic layer including at least one magnetic sheet are stacked. device.
The multilayer device of claim 2 , wherein the functional unit is provided in the non-magnetic layer, and the noise filter unit includes at least one coil pattern.
delete delete The multilayer device of claim 3 , further comprising at least one non-magnetic sheet provided between at least two coil patterns and having at least one capacitor electrode formed thereon.
The multilayer device according to any one of claims 2 to 3 and 6, further comprising an overvoltage protection unit provided to be spaced apart from the noise filter unit.
The multilayer device of claim 7 , wherein the overvoltage protection unit is provided on at least one of the first and second magnetic layers.
The multilayer device of claim 1 , wherein the external electrode extends on at least one of a lowermost layer and an uppermost sheet of the laminate, and the surface modification member is provided between an extended region of the external electrode and the laminate.
The multilayer device of claim 1 , wherein the connection electrode extends on at least one of a lowermost layer and an uppermost sheet of the laminate, and the surface modification member is provided between an extended region of the external electrode and the laminate.
The layered device according to claim 9 or 10, wherein the surface modification member has a size equal to or different from an extension area of the external electrode or the connection electrode.
The multilayer device of claim 11 , wherein the surface modification member includes a glassy material.
The multilayer device of claim 11 , wherein at least a portion of the surface modification member is discontinuously or continuously formed.

Images