KR20180044018A - Circuit protection device - Google Patents

Abstract

The present invention provides a circuit protection device which simultaneously restrains or removes a common mode noise and a differential mode noise. The circuit protection device comprises: a laminate in which a plurality of sheets are stacked; at least one inductor provided in the laminate; at least one capacitor unit provided in the laminate; and first and second external electrodes selectively connected to the inductor and the capacitor unit.

Description

Circuit protection device < RTI ID = 0.0 >

The present invention relates to a circuit protection device, and more particularly, to a circuit protection device capable of removing or suppressing noise in a common mode and a differential mode.

2. Description of the Related Art In recent years, various frequency bands have been used in accordance with multifunctionality of portable electronic devices, for example, smart phones. That is, a plurality of functions using different frequency bands such as a wireless LAN (wireless LAN), a bluetooth, and a GPS are adopted in one smart phone, and thus a smart phone is used as a multimedia device beyond communication means have. Also, there is a continuing demand for high-definition (HD) quality video. In response to these demands, differential signaling, a high-speed communication method, has been applied to LCDs, cameras and USB lines of smart phones.

The differential signaling transmission scheme generates a common mode noise, which causes a problem of deteriorating the performance of the antenna. Common mode filters are widely used to eliminate such common mode noise. The common mode filter has a structure in which two choke coils are combined into one, can pass a signal current in a differential mode, and can remove only a common mode noise current. That is, the common mode filter can classify and remove the signal current of the differential mode and the noise current of the common mode, which are alternating currents. In addition, a plurality of circuit protection elements are used to suppress noise at various frequencies of portable electronic devices such as smart phones and to suppress noise between internal circuits.

However, when the common mode noise as well as the differential mode noise are removed, the antenna performance is improved. Therefore, a filter capable of removing both components is required. This does not apply to all smartphones and it is necessary to use these filters when the differential mode is a major source of noise.

Korea Patent No. 10-0578296

The present invention provides a circuit protection element that can eliminate or suppress both common mode noise and differential mode noise.

According to an aspect of the present invention, there is provided a circuit protection device comprising: a laminate in which a plurality of sheets are stacked; At least one inductor provided in the laminate; At least one capacitor portion provided in the laminate; And first and second external electrodes selectively connected to the inductor and the capacitor unit, wherein the common mode noise and the differential mode noise are simultaneously suppressed or eliminated.

The sheet comprises at least one of ferrite, LTCC, MLCC, HTCC, and varistor materials.

A glassy layer is further formed on the outermost portion of the laminate or a surface modifying member is further formed.

The inductor includes a plurality of coil patterns, and the capacitor portion includes a plurality of internal electrodes.

The ratio of the line width to the line-to-line spacing is 0.5 to 2 or the ratio of the thickness of the coil pattern to the thickness of the internal electrode is 0.5 to 2.

The plurality of coil patterns are connected to each other through a hole filled with a conductive material formed in a vertical direction, and the hole into which the conductive material is embedded is formed into various shapes with a diameter of 50 mu m to 500 mu m.

A first lead-out electrode connected to the coil pattern and drawn out to the outside, and a second lead-out electrode connected to the inner circuit and drawn out to the outside.

The internal electrode includes a data electrode connected to the first external electrode together with the coil pattern, and a ground electrode connected to a second external electrode to which the coil pattern is not connected.

The second external electrode is connected to the ground terminal, and the resistance between the both ends of the ground terminal is 10? Or less.

The coil pattern and the internal electrode are formed of at least one of Ag, Ag / Pd, Ag / Pt, Pd, Pt, Cu and Al.

And the capacitance between the capacitor electrode and the ground electrode is 100 pF or less.

The first and second lead-out electrodes are formed of at least one of materials used as the coil pattern and the inner electrode, respectively.

The first and second lead electrodes have different content ratios of the same components as the materials used for the coil pattern and the internal electrode, respectively.

The laminate has the uppermost and lowermost sheet thicknesses equal to or thicker than the sheet thickness between the inductor and the capacitor portion.

The laminate has the uppermost and lowermost sheet thicknesses larger than the sheet thickness of the inductor or the sheet thickness of the capacitor section.

The thickness of the sheet between the inductor and the capacitor is greater than the thickness of the inductor or the thickness of the capacitor.

The ground electrode of the capacitor portion is spaced apart from the predetermined region by a predetermined distance, and the spacing distance is larger than the sheet thickness of the capacitor portion.

The first and second external electrodes are made of a conductive material containing at least one of the same components as the layered body.

The width of the first and second external electrodes is greater than or equal to the width of the first and second extraction electrodes and the width of the first and second extraction electrodes is larger than the width of the coil pattern.

In the circuit protection device according to the embodiments of the present invention, a capacitor is provided in an inductor in a laminated body, an inductor is connected to a data terminal through a first external electrode, and a capacitor part is connected to a data terminal And a part thereof is connected to the ground terminal through the second external electrode.

Such a circuit protection element can control the inductance and capacitance by adjusting the number of turns of the coil pattern, the area of the internal electrode of the capacitor, the interval between the internal electrodes, and the interval between the coil patterns, Can be adjusted.

Therefore, it is possible to eliminate or suppress the differential mode noise as well as the common mode.

1 and 2 are an assembled perspective view and an exploded perspective view showing the outline of a circuit protection device according to an embodiment of the present invention.
FIGS. 3, 4 and 5 are schematic cross-sectional views taken along lines A-A ', BB' and CC 'of FIG. 1, respectively.
FIGS. 6 and 7 are graphs illustrating characteristics of a conventional circuit protection device and a circuit protection device according to an embodiment of the present invention.
8 to 23 are a conceptual diagram and an equivalent circuit diagram of a circuit protection element according to various embodiments and modifications of the present invention.
FIGS. 24-27 are cross-sectional views of a protective portion according to another embodiment of the present invention and variations thereof. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely. In the drawings, the thickness is enlarged to clearly illustrate the various layers and regions, and the same reference numerals denote the same elements in the drawings.

1 is an exploded perspective view showing the outline of a circuit protection device according to an embodiment of the present invention, FIG. 2 is an exploded perspective view, FIGS. 3, 4 and 5 are cross- CC 'line in FIG. 3 and 5 are schematic cross-sectional views taken through a central portion. 6 and 7 are characteristic graphs of a conventional circuit protection device and a circuit protection device according to an embodiment of the present invention.

1 to 5, a circuit protection device according to an embodiment of the present invention includes a laminate 1000 formed by laminating a plurality of sheets 100, first and second laminate members 1000 provided inside the laminate 1000, A capacitor unit 3000 provided between the first and second inductors 2000 and 4000 and a capacitor unit 3000 provided between the first and second inductors 2000 and 4000 and the first and second inductors 2000 and 4000, A first external electrode 5000 connected to the capacitor unit 3000 and a second external electrode 6000 provided outside the multilayer body 1000 and connected to the capacitor unit 3000. That is, in the circuit protection device according to the present invention, at least one inductor 2000, 4000 and at least one capacitor 3000 are provided in the stacked body 1000, and an inductor 2000 The first and second external electrodes 5000 and 6000 are connected to the capacitor unit 3000 and the capacitor unit 3000, respectively.

One. The laminate

The stacked body 1000 may be provided in a substantially hexahedral shape. That is, the stacked body 1000 has a predetermined length and width in one direction (for example, X direction) and another direction (for example, Y direction) orthogonal to each other in the horizontal direction, Direction) and a substantially hexahedron shape having a predetermined height. Here, the length in the X direction is larger than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height. For example, the ratio of length, width, and height may be 2: 5: 1: 0.3-1. That is, the length may be about two to five times greater than the width based on the width, and the height may be about 0.3 to about 1 times the width. However, the sizes in the X, Y, and Z directions can be variously modified depending on, for example, the internal structure of the electronic device to which the circuit protection device is connected, the shape of the circuit protection device, and the like. The first and second inductors 2000 and 4000 and the capacitor unit 3000 are formed in the stacked body 1000 and the first and second external electrodes 5000 and 6000 are formed outside the stacked body 1000, .

The stacked body 1000 may be formed by stacking a plurality of sheets 101 to 117 (100) having a predetermined thickness. That is, the stacked body 1000 can be formed by stacking a plurality of sheets having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Therefore, the length and width of the laminate 1000 are determined by the length and width of the sheet, and the height of the laminate 1000 can be determined by the number of laminated sheets. On the other hand, a plurality of sheets constituting the laminate 1000 can be formed using dielectric materials such as MLCC, LTCC, and HTCC. At least one of Bi ₂ O ₃ , SiO ₂ , CuO, MgO, and ZnO is added to the MLCC dielectric material as a main component of at least one of BaTiO ₃ and NdTiO ₃ , and the LTCC dielectric material is Al ₂ O ₃ , SiO ₂ , And glass materials. The sheet may contain at least one of BaTiO ₃ , NdTiO ₃ , Bi ₂ O ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , SiO ₂ , CuO, MgO, ZnO and Al ₂ O ₃ in addition to MLCC, Or the like. In addition to the above materials, the sheet may be formed of a material having a varistor characteristic such as a Pr-based material, a Bi-based material or an ST-based ceramic material, or may be formed of a ferrite material. Therefore, the sheet may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 5,000, and more preferably 200 to 3000 depending on the material.

Further, the plurality of sheets may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others. For example, the thicknesses of the sheets constituting the first and second inductors 2000 and 4000 may be the same, the thickness of the sheets constituting the capacitor unit 3000 may be the same, May be different from the thickness of the sheets constituting the first and second inductors 2000 and 4000. [ The sheet 106 between the first inductor 2000 and the capacitor unit 3000 and the sheet 112 between the capacitor unit 3000 and the second inductor 4000 may be thicker than the other sheets. Of course, the thicknesses of the plurality of sheets 100 are all the same, and at least one selected region may have at least two sheets and be thicker than the other regions. On the other hand, the plurality of sheets 100 may be formed to a thickness of, for example, 1 m to 5000 m and a thickness of 3000 m or less. That is, the thickness of each of the sheets 100 may be 1 to 5,000 mu m, preferably 5 to 300 mu m, depending on the thickness of the laminate 1000. In addition, the thickness of the sheet and the number of stacked layers can be adjusted according to the size of the circuit protection element. That is, the sheet may be formed to have a thin thickness when applied to a circuit protection device having a small size, and may be formed to have a thick thickness when applied to a circuit protection device having a large size. Further, when the sheets are stacked in the same number, the size of the circuit protection element may be small, the thickness may be thinner as the height is lower, and the thickness may be thicker as the size of the circuit protection element is larger. Of course, a thin sheet can also be applied to a large-sized circuit protection element, in which case the number of sheets stacked increases. At this time, the sheet may be formed to a thickness that is not broken when ESD is applied. That is, even when the number of stacked sheets or thickness is different, at least one of the sheets may be formed to have a thickness that is not destroyed by repeated application of ESD.

The stacked body 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided on the lowermost layer and the uppermost layer, respectively. Of course, the lowermost sheet 117 may function as a lower cover layer and the uppermost sheet 101 may function as an upper cover layer. The lower and upper cover layers provided separately may have the same thickness, and a plurality of magnetic substance sheets may be stacked. However, the lower and upper cover layers may also be formed with different thicknesses, for example, the upper cover layer may be formed thicker than the lower cover layer. Here, a nonmagnetic sheet such as a glassy sheet may be further formed on the surfaces of the lower and upper cover layers made up of the magnetic sheet, that is, the lower surface and the upper surface. In addition, the lower and upper cover layers may be thicker than the inner sheet. That is, the cover layer may be thicker than the thickness of one sheet. Thus, if the sheets of the bottom and top layers function as the bottom and top cover layers, they can be formed thicker than each of the sheets therebetween. On the other hand, the lower and upper cover layers may be formed of a glassy sheet, and the surface of the laminate 1000 may be coated with a polymer or a glass material.

The thickness of the top and bottom sheets, i.e. the first and seventeenth sheets 101,107, is determined by the thickness of the sheet between the first and second inductors 2000, 4000 and the capacitor portion 3000, , 112), and may be preferably thick. The thickness of the uppermost and lowermost layers, that is, the first and seventeenth sheets 101 and 107, may be equal to or greater than the thickness of each of the sheets 107 to 111 constituting the capacitor portion 3000, . The thicknesses of the sheets between the first and second inductors 2000 and 4000 and the capacitor unit 3000, that is, the sixth and the twelfth sheets 106 and 112, are the same as the thicknesses of the first and second inductors 2000 and 4000 May be thicker or equal to, and preferably thicker than, the sheets 102-105, 113-116.

2. 1st  Inductor

As shown in FIG. 2, the first inductor 2000 may be formed by stacking a plurality of sheets 102 to 106. In the plurality of sheets 101 to 106, a coil pattern, a hole filled with a conductive material, . That is, the first inductor 2000 includes a plurality of sheets 102 to 106, holes (251, 252, 253) selectively formed in the plurality of sheets (102 to 106) Coil patterns 210, 220, 230, and 240, respectively, formed on the substrate 102-105. In addition, the coil patterns 210 to 240 may be formed on the sheets 102 to 105 at least one. That is, the coil patterns 210 to 240 may be formed in two or more spaced apart in the horizontal direction on one sheet. The configuration of the first inductor 2000 will be described in more detail as follows.

A hole 251 and a coil pattern 210 may be formed on the sheet 102. The hole 251 may be formed in a predetermined region of the sheet 102, for example, in the center. A midpoint can be defined as the point at which two diagonal lines meet when a hypothetical line is drawn diagonally from four corners. The holes 251 may be formed to have a diameter of, for example, 50 mu m to 500 mu m, and holes described later may all be formed to have diameters of 50 mu m to 500 mu m. Further, the holes may be all formed to have the same diameter, and at least part of them may be formed to have different diameters. In addition, the holes including the holes 251 may be formed in various shapes, for example, shapes in which the upper and lower portions have the same diameter, regions having different thicknesses in at least one region and shapes different from each other, for example, Or increased in number. On the other hand, a conductive material is buried in the hole 251, and it can be buried using a paste of a metal material. In addition, the coil pattern 210 may be formed in a predetermined number of turns by rotating in one direction from the hole 251. At this time, the coil pattern 210 may be formed so as not to pass through the central region of the sheet 102. For example, the coil pattern 210 may have a predetermined width and spacing, and may be formed in a spiral shape that rotates outward in a counterclockwise direction. At this time, the line width and the interval of the coil pattern 210 may be the same. In addition, the end of the coil pattern 210 may be drawn so as to be exposed to a predetermined region of one side of the sheet 102. [ For example, the lead-out area is formed so as to be exposed at one side of the sheet 102. [ At this time, the lead-out area may be formed to have a predetermined width, for example, a width wider than the width of the coil pattern 210. The region drawn to be exposed to one side of the sheet 102 may be electrically connected to the 1-1 external electrode 5100.

A hole 252 and a coil pattern 220 may be formed on the sheet 103. The coil pattern 220 may be formed on the sheet 102 and connected to the hole 251 in which the conductive material is embedded. The coil pattern 220 may be formed in a predetermined number of turns by rotating in one direction from the central region of the sheet 103. [ At this time, the coil pattern 220 may be formed so as not to pass through the central region of the sheet 103. The coil pattern 220 has a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil pattern 210. For example, the coil pattern 220 may be formed in a spiral shape that rotates counterclockwise. Further, the coil pattern 220 may be formed at the same number of turns as the coil pattern 210, or may be formed at another number of turns. The line width and the interval of the coil pattern 220 may be the same and may be the same as the line width and the interval of the coil pattern 210. A hole 252 may be formed at the distal end of the coil pattern 220. The hole 252 is formed in a region spaced apart from the central portion of the sheet 103 by a predetermined distance in the direction of one side of the sheet, for example, the area between the central portion of the sheet 103 and the one- . The hole 252 is filled with a conductive material, which may be filled with a paste of a metal material.

A hole 253 and a coil pattern 230 may be formed on the sheet 104. [ The coil pattern 230 may be formed on the sheet 103 and connected to a hole 252 filled with a conductive material. The coil pattern 230 may be formed in a predetermined number of turns by rotating in one direction from the central region of the sheet 104. [ At this time, the coil pattern 230 may be formed so as not to pass through the central region of the sheet 103. The coil pattern 230 has a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil patterns 210 and 220. For example, the coil pattern 230 may be formed in a spiral shape that rotates clockwise. Also, the coil pattern 230 may be formed with the same number of turns as the coil patterns 210 and 220, or may be formed with another number of turns. The line widths and intervals of the coil patterns 230 may be the same and may be the same as the line widths and intervals of the coil patterns 210 and 220. A hole 253 may be formed at the center of the coil pattern 230. That is, the holes 253 may be formed in the central region of the sheet 104. At this time, the holes 253 may be formed to overlap with the holes 251 formed in the sheet 102, or may be spaced apart from the central region by a predetermined distance. The hole 252 is filled with a conductive material, which may be filled with a paste of a metal material.

A coil pattern 240 may be formed on the sheet 105. The coil pattern 240 may be formed on the sheet 104 and connected to the hole 253 filled with the conductive material. In addition, the coil pattern 240 may be formed in a predetermined number of turns by rotating in one direction from a region connected to the hole 253, that is, a central region of the sheet 105. The coil pattern 240 has a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil patterns 210, 220, and 230. For example, the coil pattern 240 may be formed in a spiral shape that rotates clockwise. At this time, the line width and the interval of the coil pattern 240 may be the same, and the line width, interval, and number of revolutions may be the same as the coil patterns 210, 220, and 230. Of course, the coil patterns 210, 220, 230, and 240 may have at least two different linewidths, intervals, and revolutions with at least two identical linewidths, intervals, , 230, and 240 may have different line widths, intervals, and revolutions. In addition, the end of the coil pattern 240 may be drawn out to a predetermined region of one side of the sheet 105. For example, the lead-out area is formed so as to be exposed to the other side of the sheet 105 so as to be drawn out to the area opposite to the area where the coil pattern 210 is drawn out. At this time, the lead-out area may be formed to have a predetermined width, for example, a width wider than the width of the coil pattern 240. The region drawn to be exposed by one side of the sheet 105 may be electrically connected to the first and second external electrodes 5200.

The sheet 106 is formed between the first inductor 2000 and the capacitor unit 3000 and may be formed thicker than the other sheets. Of course, the sheet 106 may be formed by stacking two or more sheets formed with the same thickness as the other sheets.

The coil patterns 210 to 240 may be formed of a conductive material and may be formed of a metal or a metal alloy containing any one or more of Al, Ag, Au, Pt, Pd, Ni, . The coil patterns 210 and 240 may be formed by a printing process using a conductive paste, a deposition process, or a plating process. Also, the conductive resistance between the coil patterns 210 to 240 may be 1? To 50 ?. Meanwhile, the ratio of the line width and the interval of the coil patterns 210 to 240 may be 0.5 to 2, and the line width may be 5 to 50 占 퐉.

In addition, the region connected to the coil patterns 210 to 240 and drawn out to the outside, that is, the lead-out region may be formed of the same material as the coil patterns 210 to 240, or may be formed of another material. That is, the lead-out region may be formed using at least one of the materials used as the coil patterns 210 to 240, and the same content may be formed of a different material.

The distance between the coil patterns 210 to 240 and the outer surface of the laminate 1000, that is, the distance between the outer periphery of the coil patterns 210 and 240 and one side of the sheets 102 to 105, Or may be greater than the thickness of the sheets 102-105.

As described above, the first inductor 2000 includes coil patterns 210, 220, 230, and 240 formed on a plurality of sheets 102, 103, 104, and 105, The conductive material is connected by a buried hole. The first inductor 2000 may be connected to the 1-1 and 1-2 external electrodes 5100 and 5200.

3. The capacitor portion

The capacitor unit 3000 may be provided between the first and second inductors 2000 and 4000 in the stacked body 1000 and may include at least two internal electrodes and at least two sheets provided therebetween. For example, the capacitor portion 4000 may include sheets 107 to 112 and internal electrodes 310, 320, 330, 340, and 350 formed on the sheets 107 to 111, respectively. The internal electrodes 310 to 350 may be formed to have a thickness of 1 占 퐉 to 10 占 퐉, for example. Here, a part of the internal electrodes may be connected to the first external electrode 5000 and a part of the internal electrodes may be connected to the second external electrode 6000. That is, the first, third and fifth internal electrodes 310, 330 and 350 are connected to the second external electrode 6000, and the second and fourth external electrodes 320 and 340 are connected to the first external electrode 5000 Lt; / RTI > At this time, the internal electrodes 310 to 350 are formed in an area of 10% to 85% of the area of each of the sheets 107 to 111, respectively. In addition, the internal electrodes 310 to 350 are formed so as to overlap with an area of 10% to 85% of the area of each of the electrodes. Meanwhile, the internal electrodes 310 to 350 may be formed in various shapes such as, for example, a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and an interval.

Meanwhile, at least a part of the internal electrodes 310 to 350 may be formed in different shapes. That is, the first, third, and fifth internal electrodes 310, 330, and 350 are formed on the sheets 107, 109, and 111, respectively, so that one end and the other end are exposed to two mutually opposing short sides . The exposed regions of the sheets of the first, third, and fifth internal electrodes 310, 330, and 350 are connected to the second-1 and second-2 external electrodes 6100 and 6200, respectively. In addition, the second and fourth internal electrodes 320 and 340 may be formed in two or more patterns spaced apart from each other by a predetermined distance in the central region. That is, the second internal electrode 320 may be divided into the 2-1 and 2-2 internal electrodes 321 and 322 by a predetermined distance from the long side of the sheet, that is, the central portion in the X direction. The fourth internal electrode 340 may be divided into 4-1 and 4-2 internal electrodes 341 and 342 spaced apart from each other by a predetermined distance in the longitudinal direction of the sheet, that is, the central portion in the X direction. At this time, the divided two electrodes of the second and fourth internal electrodes 320 and 340 may be connected to the first external electrode 5000, respectively. That is, the 2-1 and 4-1 internal electrodes 321 and 341 are connected to the 1-1 and 1-2 external electrodes 5100 and 5200, and the 2-2 and 4-2 internal electrodes The first and second external electrodes 322 and 342 may be connected to the first and fourth external electrodes 5300 and 5400, respectively. The first outer electrode 5000 may be connected between the data lines and the second outer electrode 6000 may be connected to the ground terminal. The first, third, and fifth internal electrodes 310, 330, and 350, which are connected to the internal electrodes, that is, the second and fourth internal electrodes 320 and 340 and the ground terminal, May be between 1 and 100 pF. That is, the capacitance between the ground terminal and the data line may be between 1 and 100 pF.

The internal electrodes 310 to 3500 may be formed of a conductive material such as a metal or metal alloy containing at least one of Ag, Ag / Pd, Ag / Pt, Pd, Pt, As shown in FIG. For the alloy, for example, Ag and Pd alloys or Ag and Pt alloys can be used. On the other hand, Al can form aluminum oxide (Al ₂ O ₃ ) on its surface during firing and can keep Al inside. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the internal electrodes 310 to 350 may be formed of Al coated with Al ₂ O ₃ , which is a porous thin insulating layer on the surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used. In addition, the internal electrodes 310 to 350 may be formed such that at least one region is thin or at least one region is removed to expose the sheet. However, since at least one region of the internal electrode has a small thickness or at least one region is removed, the entirety of the internal electrode remains connected, so that no problem occurs in the electric conductivity.

In addition, the region drawn out from the internal electrodes 310 to 350, that is, the lead-out region may be formed of the same material as the internal electrodes 310 to 350, or may be formed of another material. That is, the lead-out region may be formed using at least one of the materials used as the internal electrodes 310 to 350, and may be formed of a material having the same component.

On the other hand, the distance between the second and first internal electrodes 321 and 322 and the distance between the fourth and fourth internal electrodes 341 and 342 are determined by the distance between the first and second internal electrodes 321 and 322, May be equal to or greater than the thickness of each of the sheets 107 to 111, and may preferably be large. The inner electrodes 310 to 350 and the coil patterns 210 to 240 and 410 to 440 may have the same thickness or may be different from each other. The inner electrodes 310 to 350 and the coil patterns 210 To 240, 410 to 440) may be 0.5: 1 to 2: 1. The distance between the outer edges of the second and fourth inner electrodes 320 and 340 and one side of the sheets 108 and 110 may be greater than the thickness of the sheets 107 to 111. [

The capacitors 3000 may have capacitances between the internal electrodes 310 to 350 and capacitances may be adjusted according to the overlapping area of the internal electrodes 310 to 350 and the thickness of the sheets 107 to 110 have. The capacitor unit 3000 may include at least one internal electrode in addition to the first to fifth internal electrodes 310 to 350 and at least one sheet having at least one internal electrode.

4. Second  Inductor

As shown in FIG. 2, the second inductor 4000 may have a plurality of sheets 113 to 116 stacked thereon. In the plurality of sheets 113 to 116, a coil pattern, a hole filled with a conductive material, . That is, the second inductor 4000 includes a plurality of sheets 113 to 116, holes 451, 452, and 453 selectively formed in the plurality of sheets 113 to 116 and filled with a conductive material, 113, and 116, respectively. The coil patterns 410, 420, 430, In addition, the coil patterns 410 to 440 may be formed on the sheets 113 to 116 at least one. That is, the coil patterns 410 to 440 may be formed in two or more spaced apart in the horizontal direction on one sheet. The structure of the second inductor 3000 will be described in more detail as follows.

A hole 451 and a coil pattern 410 may be formed on the sheet 113. The hole 451 may be formed in a predetermined area of the sheet 113, for example, in the center. The hole 451 is filled with a conductive material, which may be filled with a paste of a metal material. In addition, the coil pattern 410 may be formed in a predetermined number of turns by rotating in one direction from the hole 451. At this time, the coil pattern 410 may be formed so as not to pass through the central region of the sheet 113. For example, the coil pattern 410 may have a predetermined width and spacing, and may be formed in a spiral shape that rotates outward in a counterclockwise direction. At this time, the line width and the interval of the coil pattern 410 may be the same. In addition, the end of the coil pattern 410 may be drawn so as to be exposed to a predetermined region of one side of the sheet 113. For example, the lead-out area is formed such that the coil pattern 210 of the first inductor 2000 is exposed at a predetermined interval in the same direction as the lead-out direction. At this time, the lead-out area may be formed to have a predetermined width, for example, a width wider than the width of the coil pattern 410. The region drawn to be exposed to one side of the sheet 113 may be electrically connected to the first to third external electrodes 5300.

A hole 452 and a coil pattern 420 may be formed on the sheet 114. [ The coil pattern 420 may be formed on the sheet 113 and connected to a hole 451 filled with a conductive material. The coil pattern 420 may be formed in a predetermined number of turns by rotating in one direction from the central area of the sheet 114. [ At this time, the coil pattern 420 may be formed so as not to pass through the central region of the sheet 114. The coil pattern 420 may have a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil pattern 410. For example, the coil pattern 420 may be formed in a spiral shape that rotates counterclockwise. In addition, the coil pattern 420 may be formed at the same number of turns as the coil pattern 410, or may be formed at another number of turns. The line width and the interval of the coil pattern 420 may be the same and may be the same as the line width and the interval of the coil pattern 410. A hole 452 may be formed at the distal end of the coil pattern 420. The hole 452 is formed in a region spaced apart from the center of the sheet 114 by a predetermined distance in the direction of the one short side, for example, five times between the central portion and the short side of the sheet 114, . The hole 452 is filled with a conductive material, which can be filled with a paste of a metal material.

A hole 453 and a coil pattern 430 may be formed on the sheet 115. The coil pattern 430 may be formed on the sheet 114 and connected to a hole 452 filled with a conductive material. The coil pattern 430 may be formed in a predetermined number of turns by rotating in one direction from the central region of the sheet 115. The coil pattern 430 has a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil patterns 410 and 420. For example, the coil pattern 430 may be formed in a spiral shape that rotates clockwise. In addition, the coil pattern 430 may be formed at the same number of turns as the coil patterns 410 and 420, or at different turns. The line width and the interval of the coil pattern 430 may be the same and may be the same as the line width and the interval of the coil patterns 410 and 420. A hole 453 may be formed at the center of the coil pattern 430. That is, the holes 453 may be formed in the central region of the sheet 115. At this time, the holes 453 may be formed to overlap with the holes 451 formed in the sheet 113, or may be spaced apart from the central region by a predetermined distance. A conductive material is buried in the hole 453, which can be buried using a paste of a metal material.

A coil pattern 440 may be formed on the sheet 116. The coil pattern 440 may be formed on the sheet 115 and connected to a hole 453 filled with a conductive material. In addition, the coil pattern 440 may be formed in a predetermined number of turns by rotating in one direction from a region connected to the hole 453, that is, a central region of the sheet 116. The coil pattern 440 has a predetermined width and an interval and may be formed in a spiral shape that rotates in the same or opposite direction as the coil patterns 410, 420, and 430. For example, the coil pattern 440 may be formed in a spiral shape that rotates clockwise. At this time, the line width and the interval of the coil pattern 440 may be the same, and the line width, the interval, and the number of revolutions may be the same as the coil patterns 410, 420, and 430. Of course, the coil patterns 410, 420, 430, and 440 may have at least two different line widths, intervals, and rotations with at least two identical linewidths, intervals, 430, and 440 may have different line widths, intervals, and revolutions. In addition, the end of the coil pattern 440 may be drawn so as to be exposed to a predetermined region of one side of the sheet 116. For example, the lead-out area is formed so as to be exposed to the other side of the sheet 116 so as to be drawn out to the area opposite to the area where the coil pattern 410 is drawn. At this time, the lead-out area may be formed to have a predetermined width, for example, a width wider than the width of the coil pattern 440. The region drawn to be exposed to one side of the sheet 116 may be electrically connected to the first to fourth external electrodes 5400.

The coil patterns 410 to 440 may be formed of a conductive material. For example, the coil patterns 410 to 440 may include a metal or a metal containing at least one of Ag, Ag / Pd, Ag / Pt, Pd, Pt, Alloy. The coil patterns 410 and 440 may be formed by a printing process using a conductive paste, a deposition process, or a plating process. The conductive resistances between the coil patterns 410 to 440 may be 1? Meanwhile, the ratio of the line width and the interval of the coil patterns 410 to 440 may be 0.5 to 2, and the line width may be 5 to 50 占 퐉.

In addition, the area connected to the coil patterns 410 to 440 and drawn out to the outside, that is, the lead-out area may be formed of the same material as the coil patterns 410 to 440, or may be formed of different materials. That is, the lead-out region may be formed using at least one of the materials used as the coil patterns 410 to 440, and the same content may be formed of a different material.

The distance between the coil patterns 410 to 440 and the outer surface of the laminate 1000, that is, the distance between the outer periphery of the coil patterns 410 to 440 and one side of the sheets 113 to 116, Or may be larger than the thickness of the sheets 113 to 116. [

As described above, in the second inductor 4000, the coil patterns 410, 420, 430, and 440 are formed on the plurality of sheets 113 to 116, and the two coil patterns adjacent to each other are formed by the conductive material Hole. The second inductor 4000 may be connected to the 1-3 and 1-4 external electrodes 5300 and 5400.

The first and second inductors 2000 and 4000 on the upper and lower sides of the capacitor unit 2000 are connected to a plurality of coil patterns on the upper side and the lower side of the capacitor unit 2000. The plurality of coil patterns are connected to the capacitor unit 2000 And may be vertically connected. That is, at least one coil pattern on the upper side of the capacitor unit 2000 may be connected to at least one coil pattern below the capacitor unit 2000. Thus, the connection pattern of the coil pattern can be variously changed.

5. 1st  And Second  External electrode

The first external electrodes 5100, 5200, 5300, 5400, 5000 may be provided on the first and second surfaces facing each other outside the layered body 1000, and the second external electrodes 6100, 6200, And may be provided on the third and fourth surfaces orthogonal to the first and second surfaces outside the layered structure 1000. [ For example, the first external electrode 5000 may be formed on two sides facing each other in the Y direction, and the second external electrode 6000 may be formed on two sides facing each other in the X direction. The first outer electrode 5000 may be connected between the data lines and the second outer electrode 6000 may be connected to the ground terminal. At this time, the resistance between the both ends of the ground terminal to which the second external electrode 6000 is connected may be 10? Or less. On the other hand, the first and second external electrodes 5000 and 6000 may be formed on the lower surface and the upper surface, respectively, as well as on the side surface. That is, the first external electrode 5000 and the second external electrode 5000 may be extended to at least part of the lower surface and the upper surface facing each other in the Z direction. Of course, the portions extending from the lower surface and the upper surface may be spaced apart from each other by a predetermined distance so as not to be in contact with each other. The first external electrode 5000 may be connected to the first and second inductors 2000 and 4000 and a part of the capacitor unit 3000 and the second external electrode 6000 may be connected to a part of the capacitor unit 3000 Can be connected. The width of the first and second external electrodes 5000 and 6000 may be equal to or greater than the width of the first and second inductors 2000 and 4000 and the width of the outgoing region of the capacitor unit 3000, May be greater than the width of the coil pattern of inductors 2000, 4000.

The first and second external electrodes 5000 and 6000 may be formed by various methods. That is, the first and second external electrodes 5000 and 6000 may be formed by an immersion or printing method using a conductive paste, or may be formed by various methods such as vapor deposition, sputtering, and plating. The first and second external electrodes 5000 and 6000 may be formed of an electrically conductive metal such as gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Or more. At this time, at least a part of the first external electrode 5000 connected to the first and second inductors 2000 and 4000, that is, at least part of the first external electrode 5000 connected to the inductors 2000 and 4000, 1 A part of the external electrode 5000 may be formed of the same material as the inductors 2000 and 4000. For example, when the inductors 2000 and 4000, that is, the coil patterns are formed using copper, at least a portion from a region in contact with the coil patterns of the first external electrode 5000 can be formed using copper. At this time, copper may be formed by an immersion or printing method using a conductive paste as described above, or may be formed by vapor deposition, sputtering, plating or the like. Preferably, the first external electrode 5000 may be formed by plating. In addition, the second external electrode 6000 may be formed by plating. A seed layer is formed on at least a part of the surface of the layered body 1000 in order to form the first and second external electrodes 5000 and 6000 by a plating process and then a plating layer is formed from the seed layer to form first and second external electrodes 5000, 6000) can be formed.

In addition, the first and second external electrodes 5000 and 6000 may further include at least one plating layer. The first and second external electrodes 5000 and 6000 may be formed of a metal layer such as Cu or Ag, and at least one plating layer may be formed on the metal layer. For example, the first and second external electrodes 5000 and 6000 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. Of course, the plating layer may be laminated with a Cu plating layer and a Sn plating layer, or a Cu plating layer, a Ni plating layer and a Sn plating layer may be laminated. In addition, the first and second external electrodes 5000 and 6000 may be formed of a conductive material including at least one of the same components as the layered body 1000. For example, the first and second external electrodes 5000 and 6000 may be formed by mixing a multi-component glass frit composed mainly of Bi ₂ O ₃ or SiO ₂ of 0.5% to 20% can do. At this time, the mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to the two sides of the laminate 1000. By including the glass frit in the first and second external electrodes 5000 and 6000, the adhesion between the first and second external electrodes 5000 and 6000 and the layered body 1000 can be improved, That is, the coil pattern and the contact between the internal electrode and the first and second external electrodes 5000 and 6000 can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the first and second external electrodes 5000 and 6000. That is, the first and second outer electrodes 5000 and 6000 may be formed by forming a metal layer containing glass and at least one plating layer on the metal layer. For example, the first and second external electrodes 5000 and 6000 may be formed by sequentially forming a Ni plated layer and a Sn plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu . At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. Of course, the first and second outer electrodes 5000 and 6000 may be formed of at least one plating layer only. That is, the first and second external electrodes 5000 and 6000 may be formed by forming at least one plating layer using at least one plating process without applying the paste. On the other hand, the first and second external electrodes 5000 and 6000 may be formed to have a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / And may be formed to a thickness of 10 to 10 mu m.

6. Surface modification member

On the other hand, a surface modifying member (not shown) may be formed on at least one surface of the layered body 1000. The surface modification member may be formed by distributing an oxide, for example, on the surface of the layered body 1000 before the first and second external electrodes 5000 and 6000 are formed. Here, the oxide may be dispersed and distributed on the surface of the laminate 1000 in a crystalline state or an amorphous state. The surface modifying member may be distributed on the surface of the laminate 1000 before the plating process when the first and second external electrodes 5000 and 6000 are formed by a plating process. That is, the surface modification member may be distributed before forming the first and second external electrodes 5000 and 6000 in the printing process, or may be distributed before the plating process after the printing process. Of course, in the case where the printing process is not performed, the plating process can be performed after distributing the surface modifying member. At this time, at least a part of the surface modification member distributed on the surface can be melted.

On the other hand, the surface modifying members may be evenly distributed on the surface of the laminate 1000 at least partially in the same size, and may be irregularly distributed at least in part in different sizes. Also, at least a part of the surface of the laminate 1000 may be provided with a recess. That is, at least a part of the region where the surface modifying member is formed and the convex portion is formed and the surface modifying member is not formed may be formed as a concave portion. At this time, at least a part of the surface modification member can be formed deeper than the surface of the layered body 1000. That is, the surface modifying member may be formed such that a predetermined thickness is embedded in a predetermined depth of the laminate 1000 and the remaining thickness thereof is higher than the surface of the laminate 1000. At this time, the thickness of the layered body 1000 may be 1/20 to 1 of the average diameter of the oxide particles. That is, the oxide particles can be embedded all within the laminate 1000, and at least a part thereof can be embedded. Of course, the oxide particles can be formed only on the surface of the laminate 1000. Therefore, the oxide particles may be formed hemispherically on the surface of the laminate 1000, or may be formed in a spherical shape. In addition, the surface modifying member may be partially distributed on the surface of the laminate 1000 as described above, and may be distributed in a film form in at least one region. That is, the oxide particles may be distributed in the form of islands on the surface of the layered body 1000 to form the surface modification member. That is, oxides in a crystalline state or an amorphous state may be spaced apart from each other on the surface of the layered body 1000 so that at least a part of the surface of the layered body 1000 may be exposed. Further, at least two or more of the surface modification members of the oxide may be connected to form a film in at least one region, and may be formed in an island form at least in part. That is, at least two oxide particles may aggregate or adjacent oxide particles may be connected to form a film. However, even when the oxide exists in a particle state, or when two or more particles are aggregated or connected, at least a part of the surface of the laminate 1000 is exposed to the outside by the surface modification member.

At this time, the total area of the surface modifying members may be, for example, 5% to 90% of the total area of the surface of the laminate 1000. If the surface modification member is formed too much, it is difficult to make contact between the conductive pattern inside the laminated body 1000 and the external electrode 400 . That is, when the surface modifying member is formed to be less than 5% of the surface area of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modifying member is formed in an amount exceeding 90% May not be in contact with each other. Therefore, it is preferable that the surface modifying member is formed to have an area that can control the spreading phenomenon of the plating and can contact the conductive pattern inside the laminate 1000 and the external electrode 400. For this purpose, the surface modifying member may be formed to 10% to 90% of the surface area of the laminate 1000, preferably 30% to 70%, more preferably 40% to 50% Area. At this time, the surface area of the laminated body 1000 may be a surface area of one surface or a surface area of six surfaces of the laminated body 1000 which forms a hexahedron. On the other hand, the surface modifying member may be formed to a thickness of 10% or less of the thickness of the laminate 1000. That is, the surface modifying member may be formed to a thickness of 0.01% to 10% of the thickness of the laminate 1000. For example, the surface modifying member may be present in a size of 0.1 mu m to 50 mu m, whereby the surface modifying member may be formed to a thickness of 0.1 mu m to 50 mu m from the surface of the laminate 1000. [ That is, the surface modifying member may be formed to a thickness of 0.1 占 퐉 to 50 占 퐉 from the surface of the layered product 1000, except for a region that is stuck to the surface of the layered product 1000. Therefore, if the thickness embedded in the laminated body 1000 is included, the surface modification member may have a thickness greater than 0.1 占 퐉 to 50 占 퐉. When the surface modification member is formed to a thickness of less than 0.01% of the thickness of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modification member is formed to a thickness exceeding 10% of the thickness of the laminate 1000, The inner conductive pattern and the outer electrode 400 may not be in contact with each other. That is, the surface modifying member may have various thicknesses depending on the material properties (conductive, semiconductive, insulating, magnetic material, etc.) of the layered body 1000 and may have various thicknesses depending on the size, have.

By forming the surface modifying member on the surface of the layered body 1000, at least two regions having different components may exist on the surface of the layered body 1000. That is, different components can be detected in the region where the surface modifying member is formed and the region where the surface modifying member is not formed. For example, an area where the surface modifying member is formed may have a component according to the surface modifying member, that is, an oxide, and an area where the area is not formed may have a component according to the laminate 1000, that is, a component of the sheet. By thus distributing the surface modifying member to the surface of the layered product 1000 before the plating process, the surface of the layered product 1000 can be modified by imparting roughness to the surface thereof. Therefore, the plating process can be performed uniformly, and thus the shape of the first and second external electrodes 5000 and 6000 can be controlled. That is, the surface of the layered product 1000 may have a resistance different from that of the other region in at least one region. If the plating process is performed while the resistance is uneven, the growth of the plating layer may be uneven. In order to solve such a problem, it is possible to modify the surface of the layered product 1000 and to control the growth of the plating layer by dispersing oxides in a particle state or a molten state on the surface of the layered product 1000 to form a surface modifying member have.

Here, the oxides in the particle state or in the molten state for making the surface resistance of the layered body 1000 uniform are, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ . On the other hand, the surface modification member may also be formed on at least one sheet in the laminate 1000. That is, the conductive patterns of various shapes on the sheet can be formed by a plating process, and the shape of the conductive pattern can be controlled by forming the surface modifying member.

In the circuit protection device according to the embodiment of the present invention, the capacitor unit 3000 is provided inside the stacked body 1000 with inductors 2000 and 4000 interposed therebetween, and the inductors 2000 and 4000 are formed in the 1 is connected to the data terminal through the external electrode 5000 and the capacitor unit 3000 is partially connected to the data terminal through the first external electrode 5000 and partly connected to the ground terminal through the second external electrode 6000 do. Such a circuit protection element can control the inductance and capacitance by adjusting the number of turns of the coil pattern, the area of the internal electrode of the capacitor, the interval between the internal electrodes, and the interval between the coil patterns, Can be adjusted. For example, reducing the thickness of the sheet can suppress the noise in the low frequency band, and increasing the thickness can suppress the noise in the high frequency band. The circuit protection element consisting of at least two inductors and capacitor portions can suppress or eliminate the common mode noise as well as the differential mode noise. That is, as shown in FIG. 6, the conventional circuit protection device can remove only the common mode noise. However, as shown in FIG. 7, the circuit protection device according to the embodiment of the present invention includes not only the common mode but also the differential mode noise Can be removed or suppressed.

Examples and Modifications

On the other hand, the circuit protection device according to the present invention including at least one inductor having at least one coil pattern in the laminate and at least one capacitor portion can be implemented and modified in various forms. Various embodiments and modifications of the circuit protection device according to the present invention will now be described. 8 to 18 are a conceptual diagram and an equivalent circuit diagram according to various embodiments and modifications of the present invention.

As shown in FIG. 8, the first and second inductors may be provided on the upper and lower sides of the capacitor unit with the capacitor unit interposed therebetween. Each of the first and second inductors may include two or more coil patterns, and each of the first and second inductors may have at least two outgoing electrodes. Further, at least one coil pattern may be formed on one sheet. That is, two or more coil patterns may be formed on one sheet. Also, the capacitor portion may have two data electrodes and a ground electrode therebetween. That is, the inductor may have a coil pattern and a lead electrode extending from the coil pattern to the outside, and the capacitor unit may have at least two data electrodes and at least one ground electrode among the plurality of internal electrodes. At this time, the data electrode of the capacitor unit may be connected between the lead-out electrode of the inductor and the first external electrode and provided between the data input / output terminals, and the ground electrode of the capacitor may be connected to the second external electrode and provided between the ground terminals. At this time, two lead terminals adjacent to the capacitor portion are drawn out in the same direction and two far terminals can be drawn out in the same direction. That is, two lead electrodes are drawn out in the first direction adjacent to the upper side and the lower side of the capacitor portion, and the two lead-out electrodes apart from each other can be drawn out in the second direction opposite to the first direction. In other words, assuming that the electrodes drawn out to the outside are the first and second lead electrodes of the first inductor, the first and second data electrodes of the capacitor unit, and the third and fourth lead electrodes of the second inductor from above, And the third extraction electrode are drawn out in the first direction, and the first and fourth extraction electrodes are drawn out in the second direction. 8A), the upper electrode can be drawn out in the first direction and the lower electrode can be drawn out in the second direction (Fig. 8A) (Fig. 8 (b)), both of the data electrodes may be drawn out in the second direction (Fig. 8 (c), the upper electrode may be drawn out in the second direction and the lower electrode may be drawn out in the first direction (FIG.

  9, the first extraction electrode of the first inductor and the third extraction electrode of the second inductor are drawn out in the first direction, and the second extraction electrode of the first inductor and the fourth extraction electrode of the second inductor May be drawn out in the second direction. At this time, one of the data electrodes of the capacitor portion can be drawn out in the first direction and the second direction, respectively, as shown in Figs. 9 (a) to 9 (d) And may be drawn out in the second direction. On the other hand, the inductor can be divided into two. For example, as shown in FIG. 9 (b), the inductor may be divided into two, and the upper inductor may be connected to the 1-1 second outer electrode and the lower inductor may be connected to the 1-2 second outer electrode. In addition, one external electrode may be connected on one sheet. An example of the shape of the coil pattern of the inductor is shown in Fig.

As shown in Fig. 11, the inductors may be formed as one unit and provided on the upper side of the capacitor unit. Here, the inductor may have two coil patterns formed on one sheet. Further, the two lead-out electrodes of the inductor can be respectively drawn out in the first and second directions which are opposite to each other. One of the data electrodes of the capacitor portion may be drawn out in the first direction and the second direction, and both electrodes may be drawn out in the first direction or the second direction. An example of the shape of the coil pattern of the inductor is shown in Fig.

Further, as shown in Fig. 13, the inductors may be formed as one unit, and may be provided on the lower side of the capacitor unit. At this time, the inductor may be formed with two coil patterns on one sheet. In addition, one of the data electrodes of the capacitor portion may be drawn out in the first direction and the second direction, respectively, and both electrodes may be drawn out in the first direction or the second direction.

As shown in FIG. 14, first and second inductors may be provided, and a plurality of capacitors may be provided with an inductor interposed therebetween. That is, a first capacitor may be provided above the first inductor, a second capacitor may be provided between the first and second inductors, and a third capacitor may be provided below the second inductor. That is, the capacitor portion may be divided into a plurality of portions. In this case, the first and third capacitor units may have one data electrode and the ground electrode, respectively, and the second capacitor unit may have two data electrodes and one ground electrode. 14A and 14B, the data electrodes of the first and third capacitor portions can be drawn out in the same direction, i.e., the first direction or the second direction, and the data of the second capacitor portion The electrode can be drawn in the opposite direction, that is, the second direction or the first direction. 14 (c) and 14 (d), the data electrodes of the first to third capacitor portions may be drawn in the same direction, that is, in the first or second direction.

As shown in FIG. 15, first and second inductors may be provided, and first and second capacitors may be provided therebetween. That is, the 1-1 inductor, the first capacitor, the second inductor, the second capacitor, and the 1-2 inductor may be provided from the top. The 1-1 inductor and the 1-2 inductor can be connected through a hole formed in the sheet therebetween. In addition, each of the first to third inductors has two outgoing electrodes, and each of the first and second capacitor units may have one data electrode and two ground electrodes. At this time, as shown in FIGS. 15A and 15C, the data electrodes of the capacitor portion can be drawn out in different directions, The data electrodes of the capacitor portion may be drawn out in the same direction as each other.

As shown in FIG. 16, a capacitor is provided between the first and second inductors, and a ground electrode may be formed on the upper side of the first inductor and the lower side of the second inductor. That is, the ground electrode of the capacitor portion may be further formed adjacent to the first and second inductors. At this time, the data electrodes of the capacitor portion can be drawn out in different directions as shown in Figs. 16A and 16C, and they can be drawn in directions opposite to each other as shown in Figs. 16B and 16D It may be withdrawn.

As shown in FIG. 17, the inductors may be configured as one, and the capacitor portion may be configured as two. That is, the first and second capacitors may be provided on the upper and lower sides of the inductor. At this time, the inductor may be formed with two coil patterns on one sheet. In addition, the first and second capacitor portions may each include at least one data electrode and at least one ground electrode. At this time, the data electrodes of the capacitor portion can be drawn out in the directions opposite to each other as shown in Figs. 17A and 17C, and as shown in Figs. 17B and 17D, .

Meanwhile, various shapes of circuit protection elements can be realized in one laminate by combining the shapes shown in FIG. 8 to FIG. For example, as shown in FIGS. 18 (a) and 18 (b), a capacitor unit having at least one data electrode and a ground electrode may be provided above and below the inductor, respectively.

19A and 19B, a capacitor portion including at least two data electrodes and at least one ground electrode is provided between the first and second inductors, and a capacitor portion including at least one ground electrode is provided between the first and second inductors, And a ground electrode may be further formed on the lower side. Further, the structures shown in Figs. 19 (a) and 19 (b) may be implemented in one stack. That is, Fig. 19 (a) is provided on the upper side and spaced apart by a predetermined distance, and a circuit protection element can be implemented by being provided on the lower side of Fig. 17 (b). In other words, the first and second inductors may be adjacent, the third and fourth inductors may be adjacent, and a predetermined space may be provided between the second and third inductors. A first capacitor may be provided between the first and second inductors, and a second capacitor may be provided between the third and fourth inductors. The first and second capacitors may each have at least two data electrodes and at least one ground electrode. At least one ground electrode may be provided on the upper side of the first inductor, the lower side of the second inductor, the upper side of the third inductor, and the lower side of the fourth inductor.

On the other hand, the shape and position of the data electrode and the ground electrode of the capacitor unit can be variously changed. That is, as shown in FIG. 20, at least two ground electrodes and data electrodes may be alternately formed. Also, as shown in FIG. 19, at least two ground electrodes are formed between at least two data electrodes. Also, as shown in FIG. 20, at least one ground electrode may be formed between two data electrodes. At this time, all of the data electrodes may be drawn in the same direction or may be drawn in different directions. Of course, at least one ground electrode may be formed as shown in FIG.

Although not shown, a protective portion may be formed inside the laminated body 1000 to protect the internal circuit of the electronic device from a high voltage such as ESD that can be applied from the outside. The protective portion may be provided in a predetermined region inside the stacked body 1000, for example, in various regions such as an upper portion or a lower portion of the inductor, a capacitor portion, and the like. The protective portion may be formed using a porous insulating material, or may be formed using a conductive material or a void. Figs. 24 and 25 show a cross-sectional schematic view and a cross-sectional view of such a protection portion. That is, the protective portion 7000 may include a protective layer 7100 and discharge electrodes 7210, 7220, and 7200 formed respectively under and over the protective layer. 24 and 25 are cross-sectional schematic views and cross-sectional photographs of an enlarged partial area of the protective portion 7000. The protection layer 7100 may be formed to have a thickness smaller than that of the other regions.

As shown in Figs. 24 (a) and 25 (a), the protective layer 7100 may be formed of an insulating material. At this time, the insulating material may be a porous insulating material including a plurality of pores (not shown). That is, a plurality of pores (not shown) may be formed in the protective layer 7100. By forming pores, overvoltage such as ESD can be more easily bypassed. The protective layer 7100 may be formed by mixing a conductive material and an insulating material. For example, the protective layer 7100 can be formed by mixing conductive ceramics and insulating ceramics. In this case, the protective layer 7100 can be formed by mixing conductive ceramics and insulating ceramics at a mixing ratio of, for example, 10:90 to 90:10. As the blending ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the blending ratio of the conductive ceramic increases, the discharge starting voltage may be lowered. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted so that a predetermined discharge starting voltage can be obtained.

In addition, the protective layer 7100 can be formed by laminating a conductive layer and an insulating layer in a predetermined laminated structure. That is, the protective layer 7100 may be formed by laminating the conductive layer and the insulating layer at least once to divide the conductive layer and the insulating layer. For example, the protective layer 7100 may have a two-layer structure in which a conductive layer and an insulating layer are laminated, and a conductive layer, an insulating layer, and a conductive layer may be stacked to form a three-layer structure. In addition, the conductive layers 7121, 7122, and 7120 and the insulating layer 7110 may be repeatedly laminated to form a laminate structure of three or more layers. For example, as shown in FIG. 24B, a protective layer 7100 having a three-layer structure in which a first conductive layer 7121, an insulating layer 7110, and a second conductive layer 7122 are stacked is formed . 25 (b) is a photograph showing a protective layer 7100 having a three-layer structure formed between the discharge electrodes 7210 and 7220. On the other hand, when the conductive layer and the insulating layer are laminated a plurality of times, the conductive layer may be located in the uppermost layer and the lowermost layer. At this time, a plurality of pores (not shown) may be formed in at least a part of the conductive layer 7120 and the insulating layer 7110. For example, since the insulating layer 7110 formed between the conductive layers 7120 is formed of a porous structure, a plurality of pores may be formed in the insulating layer 7110.

Further, the protective layer 7100 may be further formed with a void in a predetermined region. For example, a gap may be formed between the layer in which the conductive material and the insulating material are mixed, and a gap may be formed between the conductive layer and the insulating layer. That is, a first mixed layer of a conductive material and an insulating material, a cavity and a second mixed layer may be laminated, and a conductive layer, a cavity, and an insulating layer may be laminated. For example, the protective layer 7100 may include a first conductive layer 7121, a first insulating layer 7111, a void 7130, a second insulating layer 7112, 2 conductive layer 7122 may be stacked. That is, insulating layers 7111, 7112 and 7110 may be formed between the conductive layers 7121, 7122 and 7120, and voids 7130 may be formed between the insulating layers 7110. 25 (c) is a cross-sectional photograph of the protective layer 7100 having such a laminated structure. Of course, the protective layer 7100 may be formed by repeatedly stacking the conductive layer, the insulating layer, and the pores. On the other hand, when the conductive layer 7120, the insulating layer 7110, and the gap 7130 are stacked, the thicknesses of all of them may be the same, and at least one of them may be thinner than the others. For example, the void 7130 may be thinner than the conductive layer 7120 and the insulating layer 7110. The conductive layer 7120 may have the same thickness as the insulating layer 7110 or may be thicker or thinner than the insulating layer 7110. Meanwhile, the voids 7130 can be formed by filling a polymer material and performing a sintering process to remove the polymer material. For example, a first polymer material including a conductive ceramic, a second polymer material including an insulating ceramic, and a third polymer material not including a conductive ceramic or an insulating ceramic are filled in a via hole and subjected to a sintering process By removing the polymer material, a conductive layer, an insulating layer, and voids can be formed. Meanwhile, the voids 7130 may be formed without dividing the layers. For example, an insulating layer 7110 may be formed between the conductive layers 7121 and 7122, and a plurality of pores may be formed in the insulating layer 7110 in the vertical direction or the horizontal direction to form the voids 7130. That is, the void 7130 may be formed in the insulating layer 7110 as a plurality of pores. Of course, the void 7130 may be formed in the conductive layer 7120 by a plurality of pores.

On the other hand, the conductive layer 7120 used for the protective layer 7100 can have a predetermined resistance and allow current to flow. For example, the conductive layer 7120 may be a resistor having several ohms to several hundreds of M [Omega]. This conductive layer 7120 lowers the energy level when an overvoltage is applied to the ESD or the like to prevent structural breakdown of the circuit protection element due to the overvoltage. That is, the conductive layer 7120 serves as a heat sink for converting electrical energy into heat energy. The conductive layer 7120 may be formed using a conductive ceramic and the conductive ceramic may be a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Can be used. The conductive layer 7120 may be formed to a thickness of 1 占 퐉 to 50 占 퐉. That is, when the conductive layer 7120 is formed of a plurality of layers, the sum of the total thicknesses may be formed to 1 占 퐉 to 50 占 퐉.

In addition, the insulating layer 7110 used for the protective layer 7100 may be formed of a discharge inducing material, and may function as an electrical barrier having a porous structure. The insulating layer 7110 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 50,000. For example, the insulating ceramics may be formed by using a dielectric material powder such as MLCC, a mixture containing at least one of ZrO 2, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn and Al ₂ O ₃ . The insulating layer 7110 may be formed of a porous structure having a plurality of pores each having a size of 1 nm to 5 탆 and formed with a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 탆. That is, the insulating layer 7110 is formed of an electrically insulating material that can not flow current, but a pore is formed, so that a current can flow through the pore. At this time, as the size of the pores increases or the porosity increases, the discharge firing voltage may decrease. On the contrary, if the pore size decreases or the porosity decreases, the discharge firing voltage may increase. However, if the pore size exceeds 5 占 퐉 or the porosity exceeds 80%, it may be difficult to maintain the shape of the protective layer 7100. Accordingly, the pore size and the porosity of the insulating layer 7110 can be adjusted so as to adjust the discharge starting voltage while maintaining the shape of the protective layer 7100. On the other hand, if the protective layer 7100 is formed of a mixed material of an insulating material and a conductive material, the insulating material may be an insulating ceramic having micropores and porosity. Further, the insulating layer 7110 has a lower resistance than the resistance of the sheet due to the micropores, and partial discharge can be made through the micropores. That is, the insulating layer 7110 is formed with micropores, and partial discharge is performed through the micropores. The insulating layer 7110 may be formed to a thickness of 1 占 퐉 to 50 占 퐉. That is, when the insulating layer 7110 is formed of a plurality of layers, the sum of the total thicknesses may be formed to 1 占 퐉 to 50 占 퐉.

26 is a schematic cross-sectional view of a protective layer 7100 according to a second embodiment of the circuit protection element of the present invention. That is, the protective layer 7100 may include voids 7130 as shown in FIG. 5 (a). That is, the protection layer 7100 can be formed with voids 7130 without filling with an overvoltage protection material in the opening formed through the sheet. In addition, the protective layer 7100 may be formed with a porous insulating material in at least one region of the through-hole. That is, as shown in FIG. 5 (b), a porous insulating material may be applied to the side wall of the through hole to form the insulating layer 7110, and at least the upper and lower portions of the through hole An insulating layer 7110 may be formed.

27 is a schematic cross-sectional view of the protective layer 7100 according to the third embodiment of the circuit protection element of the present invention. As shown in FIG. 27, the protective layer 7100 includes discharge electrodes 7210, 7220, 7200, And a discharge induction layer 7300 formed between the overvoltage protection layer 7100 and the overvoltage protection layer 7100. That is, a discharge induction layer 7300 may be further formed between the discharge electrode 7200 and the protective layer 7100. At this time, the discharge electrode 7200 may include the conductive layers 7210a and 7220a and the porous insulating layers 7210b and 7210b formed on at least one surface of the conductive layers 7210a and 7220a. Of course, the discharge electrode 7200 may be a conductive layer having no porous insulating layer formed on its surface.

The discharge induction layer 7300 may be formed when the protective layer 7100 is formed using a porous insulating material. At this time, the discharge induction layer 7300 may be formed of a dielectric layer having a higher density than the protective layer 7100. That is, the discharge induction layer 7300 may be formed of a conductive material or an insulating material. For example, when the protective layer 7100 is formed using porous ZrO and the discharge electrode 7200 is formed using Al, a discharge induction layer 7300 of AlZrO is formed between the protective layer 7100 and the internal electrode 7210 May be formed. On the other hand, as the protective layer 7100, TiO may be used instead of ZrO. In this case, the discharge induction layer 7300 may be formed of TiAlO. That is, the discharge induction layer 7300 can be formed by the reaction of the discharge electrode 7200 and the protective layer 7100. Of course, the discharge inducing layer 7300 can be formed by further reacting the sheet material. In this case, the discharge induction layer 7300 can be formed by the reaction of an internal electrode material (for example, Al), a protective material (for example, ZrO 2), and a sheet material (for example, BaTiO ₃ ). Further, the discharge inducing layer 7300 can be formed by reacting with the sheet material. That is, in the region where the protective layer 7100 contacts the sheet, the discharge induction layer 7300 can be formed by the reaction of the protective layer 7100 and the sheet. Therefore, the discharge inducing layer 7300 can be formed so as to surround the protective layer 7100. [ At this time, the discharge induction layer 7300 between the protective layer 7100 and the discharge electrode 310, the protective layer 7100 and the discharge induction layer 7300 between the sheets may have different compositions. Meanwhile, the discharge induction layer 7300 may be formed by removing at least one region, and the thickness of at least one region may be formed differently from another region. That is, the discharge induction layer 7300 can be formed discontinuously by removing at least one region, and the thickness can be formed non-uniformly in at least one region different in thickness. The discharge induction layer 7300 may be formed during the firing process. That is, during the firing process at a predetermined temperature, the discharge electrode material, the ESD protection material, and the like may be mutually diffused to form the discharge induction layer 7300 between the discharge electrode 7200 and the protective layer 7100. On the other hand, the discharge induction layer 7300 may be formed to a thickness of 10% to 70% of the thickness of the protective layer 7100. That is, a part of the thickness of the protective layer 7100 may be changed to the discharge inducing layer 7300. Accordingly, the discharge inducing layer 7300 may be formed to be thinner than the protective layer 7100, and may be formed thicker, thinner, or thinner than the discharge electrode 7200. This discharge induction layer 7300 can induce an ESD voltage into the protective layer 7100 or lower the level of discharge energy induced in the protective layer 7100. [ Therefore, the discharge efficiency can be improved by discharging the ESD voltage more easily. In addition, since the discharge induction layer 7300 is formed, it is possible to prevent the dissimilar materials from diffusing into the protective layer 7100. That is, diffusion of the sheet material and the internal electrode material into the protective layer 7100 can be prevented, and external diffusion of the overvoltage protection material can be prevented. Accordingly, the discharge inducing layer 7300 can be used as a diffusion barrier, and thus the destruction of the protective layer 7100 can be prevented. Meanwhile, the protective layer 7100 may further include a conductive material. In this case, the conductive material may be coated with an insulating ceramic. For example, as described with reference to FIG. 22 (a), when the protective layer 7100 is formed by mixing a porous insulating material and a conductive material, the conductive material may be coated using NiO, CuO, WO, or the like. Accordingly, the conductive material can be used as the material of the protective layer 7100 together with the porous insulating material. When a conductive material other than a porous insulating material is further used for the protective layer 7100, for example, as shown in FIG. 22 (b) and FIG. 22 (c), between the two conductive layers 311 and 312 When the insulating layer 7110 is formed, the discharge inducing layer 7300 may be formed between the conductive layer 7120 and the insulating layer 7110. Meanwhile, the discharge electrode 7200 may be formed in a shape in which a part of the area is removed. That is, the discharge electrode 7200 may be partially removed and a discharge induction layer 7300 may be formed in the removed region. However, even if the discharge electrode 7200 is partially removed, the electric characteristics are not deteriorated because the shape is maintained as a whole connected in a planar manner.

The discharge electrode 7200 may be formed of a metal or a metal alloy on which an insulating layer is formed. That is, the discharge electrode 7200 may include the conductive layers 7210a and 7220a and the porous insulating layers 7210b and 7220b formed on at least one surface of the conductive layers 7210a and 7220a. At this time, the porous insulating layers 7210b and 7220b may be formed on at least one surface of the discharge electrode 7200. [ That is, the protective layer 7100 may be formed only on one surface that does not contact the protective layer 7100 and only on the other surface that is in contact with the protective layer 7100, . Also, the porous insulating layers 7210b and 7220b may be formed entirely on at least one surface of the conductive layers 7210a and 7220a, or may be formed only on at least a part thereof. At least one region of the porous insulating layers 7210b and 7220b may be removed or formed to have a small thickness. That is, the porous insulating layers 7210b and 7220b may not be formed in at least one region on the conductive layers 7210a and 7220a, and the thickness of at least one region may be formed to be thinner or thicker than the thickness of the other regions. The discharge electrode 7200 may be formed of Al while an oxide film is formed on the surface of the discharge electrode 7200 during firing and the inside thereof is kept conductive. That is, when Al is formed on the sheet, it comes into contact with air. In the sintering process, the surface of the Al is oxidized to form Al ₂ O ₃ , and the Al remains intact. Accordingly, the discharge electrode 7200 may be formed of Al coated with Al ₂ O ₃ , which is a thin insulating layer having a porous surface. Of course, a variety of metals other than Al, in which an insulating layer, preferably a porous insulating layer, is formed on the surface can be used.

Meanwhile, the circuit protection device according to the embodiments of the present invention can be applied to general electronic devices including a portable electronic device such as a smart phone, regardless of size and type, for example, a TV, a set-top box, and the like.

Although the technical idea of the present invention has been specifically described according to the above embodiments, it should be noted that the above embodiments are for explanation purposes only and not for the purpose of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

1000: laminate 2000: first inductor
3000: Capacitor part 4000: Second inductor
5000: first outer electrode 6000: second outer electrode

Claims (19)

A laminated body in which a plurality of sheets are laminated;
At least one inductor provided in the laminate;
At least one capacitor portion provided in the laminate; And
And first and second external electrodes selectively connected to the inductor and the capacitor unit,
A circuit protection device that suppresses or eliminates common mode noise and differential mode noise at the same time. The circuit protection element of claim 1, wherein the sheet comprises at least one of ferrite, LTCC, MLCC, HTCC, and varistor material. The circuit protection element according to claim 1, further comprising a glassy layer at the outermost portion of the laminate, or further comprising a surface modification member. The circuit protection device according to claim 1, wherein the inductor includes a plurality of coil patterns, and the capacitor portion includes a plurality of internal electrodes. The circuit protection device according to claim 4, wherein the coil pattern has a ratio of a line width to an interval between lines of 0.5 to 2, or a ratio of a thickness of the coil pattern to a thickness of the internal electrode is 0.5 to 2. 5. The circuit protection device according to claim 4, wherein the plurality of coil patterns are connected through holes filled with a conductive material formed in a vertical direction, and the holes in which the conductive material is embedded are formed into various shapes with diameters ranging from 50 μm to 500 μm. The circuit protection device of claim 4, further comprising: a first lead-out electrode connected to the coil pattern and drawn out to the outside; and a second lead-out electrode connected to the inner circuit and drawn out to the outside. The circuit protection device of claim 4, wherein the internal electrode includes a data electrode connected to the first external electrode together with the coil pattern, and a ground electrode connected to a second external electrode to which the coil pattern is not connected. The circuit protection device according to claim 8, wherein the second external electrode is connected to a ground terminal, and the resistance between both ends of the ground terminal is equal to or less than 10?. 5. The circuit protection device of claim 4, wherein the coil pattern and the internal electrode are formed of at least one of Ag, Ag / Pd, Ag / Pt, Pd, Pt, Cu and Al. 11. The circuit protection device according to claim 10, wherein a conductive line resistance between the coil patterns is 50Ω or less, and a capacitance between the capacitor electrode and the ground electrode is 100 pF or less. 11. The circuit protection device of claim 10, wherein the first and second lead-out electrodes are formed of at least one material selected from the group consisting of the coil patterns and the internal electrodes. 11. The circuit protection element of claim 10, wherein the first and second lead-out electrodes have different content ratios of the same components as the material used for the coil pattern and the internal electrode, respectively. The circuit protection device according to claim 1, wherein the laminate has a thickness of the uppermost and lowermost portions greater than or equal to a thickness of the sheet between the inductor and the capacitor portion. The circuit protection element according to claim 1 or 14, wherein the laminated body has a thickness of the uppermost and lowermost portions thicker than a sheet thickness of the inductor or a sheet thickness of the capacitor portion. The circuit protection device according to claim 1 or 14, wherein a sheet thickness between the inductor and the capacitor portion is thicker than a sheet thickness of the inductor or a sheet thickness of the capacitor portion. The circuit protection device according to claim 8, wherein the ground electrode of the capacitor portion is spaced apart from the predetermined region by a predetermined distance, and the spacing distance is larger than the sheet thickness of the capacitor portion. The circuit protection device according to claim 1, wherein the first and second external electrodes are made of a conductive material containing at least one of the same components as the laminate. The method of claim 1 or claim 18, wherein the widths of the first and second external electrodes are greater than or equal to the widths of the first and second extraction electrodes, and the widths of the first and second extraction electrodes Larger circuit protection devices.

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