KR20180088611A - Circuit protection device - Google Patents

Abstract

The present invention provides a circuit protection device which includes a lower cover layer and an upper cover layer provided in a vertical direction; a plurality of sheets provided between the lower cover layer and the upper cover layer; and three or more noise filter units which are formed in the vertical direction and include coil patterns formed in a spiral shape on the plurality of sheets, respectively, wherein at least two of the coil patterns are vertically connected to form one noise filter unit. Accordingly, the present invention can remove a common mode noise and improve the reliability of the device.

Description

Circuit protection device < RTI ID = 0.0 >

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit protection element, and more particularly to a circuit protection element for eliminating common mode noise.

Conventional differential signaling transmits signals using two lines. Differential signaling using three lines capable of increasing the bandwidth and transmitting signals at the same speed has recently been proposed. Differential signaling using three lines can be applied to the display of cameras and LCDs of smart phones. Differential signaling using two existing lines is referred to as D-PHY and differential signaling using three lines is referred to as C-PHY. Therefore, Si-P may reduce the number of signal transmission lines compared to D-Fi. For example, in order to realize 4K image on LCD of smartphone, existing DIPRO requires 20 transmission lines. By using Si-Fi, transmission lines can be reduced to 9.

In the conventional differential signaling, two transmission lines are paired to transmit one signal. In an ideal case, only differential signals having different phases of the signals must exist. However, it is difficult to maintain an out of phase between two complete signals depending on the state of the semiconductor chip set as the signal source, the PCB as the body of the signal transmission line, and the state of the connector. Since maintaining the phase difference is complicated as the system becomes complicated and the transmission line becomes longer, it is more difficult for a smartphone to generate a common mode component having the same signal phase among each other, and this signal acts as noise and affects peripheral circuits . Especially, it affects noise sensitive wireless communication sensitivity, and in the sensitive order, GPS, 800MHz 2G / 3G wireless communication, 1.8GHz band, WiFi band and so on. In order to improve the communication quality by removing the common mode noise component, a common mode noise filter is used. The common mode noise filter can be mounted on an LCD, a camera, a USB, an external display, or the like.

As described above, as the demand for high-quality video and voice service has increased, a new time-phi method has been proposed. In the conventional two-line paired devices, three lines transmit signals in one pair, Transmission becomes more complicated. Therefore, it is impossible to apply a filter that can remove generated noise to a conventional filter. In other words, since the package itself must be changed according to the change of the number of lines, it is impossible to apply the existing filter to the external shape. Also, if the internal circuit of the filter is changed, the noise can be removed while passing a proper signal.

On the other hand, a general circuit protection element forms a glassy sheet on the entire surface of the laminate on which the noise filter is implemented. That is, a plurality of sheets are stacked to form a laminate, wherein the lowermost layer and the uppermost layer of the laminate consist of a glassy sheet. However, when a vitreous sheet is formed on the entire surface of the laminate, the vitreous sheet absorbs moisture, which may lower the reliability of the device. Further, since the glassy sheet is further formed, the thickness of the circuit protection element is increased.

Korean Patent No. 10-0876206

The present invention provides a circuit protection device for eliminating common mode noise.

The present invention provides a circuit protection element that eliminates common mode noise that occurs simultaneously in three lines and common mode noise that occurs between the two lines.

The present invention provides a circuit protection device capable of reducing the thickness without forming a glassy sheet on upper and lower surfaces.

According to an aspect of the present invention, there is provided a circuit protection device comprising: a lower cover layer and an upper cover layer provided in a vertical direction; A plurality of sheets provided between the lower cover layer and the upper cover layer; And at least three or more noise filter units each including a coil pattern formed in a spiral shape on the plurality of sheets, at least two coil patterns being vertically connected to constitute one noise filter unit and formed in mutually perpendicular directions.

A plurality of external electrodes connected to the at least three noise filter portions, and a plurality of external electrodes connected to the at least one noise filter portion.

The external electrodes connected to the three or more noise filter units are respectively connected to the number of signal lines corresponding to the number of the noise filter units.

Eliminates the common mode noise of each of the three signal lines and the common mode noise between the two signal lines.

First to sixth sheets stacked in a vertical direction, first to sixth coil patterns formed in a spiral shape on the first to sixth sheets, respectively, the first and fourth coil patterns being connected to each other, Second to fifth coil patterns are connected, and the third and sixth coil patterns are connected.

The first to sixth sheets stacked in the vertical direction and the first to sixth coil patterns formed on the first to sixth sheets respectively and the third and fourth coil patterns are connected, 5 coil patterns are connected, and the first and sixth coil patterns are connected.

At least one noise filter section has a different number of revolutions of the coil pattern.

The at least one noise filter section further includes a magnetic core formed at the center of the coil pattern.

And at least one capacitor provided in the laminate.

And at least one overvoltage protector provided in the laminate.

The sheet on which the noise filter section is formed is a non-magnetic substance sheet, and the sheet on which the overvoltage protection section is formed is a magnetic substance sheet.

And a surface modification member formed on at least a part of the surface of the laminate and made of a material different from the surface of the laminate.

According to another aspect of the present invention, there is provided a circuit protection device comprising: an upper and a lower cover layer; a laminate including a plurality of sheets stacked between the upper and lower cover layers; At least one over-voltage protecting portion, at least three noise filter portions provided between the upper and lower cover layers; And a surface modification member formed on at least a part of a surface of the laminate and different from a surface of the laminate, wherein the three or more noise filter portions are provided between the upper cover layer and the overvoltage protection portion in the laminate The overvoltage protection portion is provided between the noise filter portion and the lower cover layer in the laminate body, the noise filter portion is formed on the non-magnetic body sheet, and the overvoltage The protective portion is formed on the magnetic substance sheet, and the surface modification member is formed by dispersing the oxide.

The present invention is characterized in that a plurality of coil patterns are formed in a laminate in which a plurality of sheets are laminated and at least two coil patterns are connected to each other to form one noise filter portion, and at least three such noise filter portions are formed in the laminate. That is, in the present invention, three or more noise filter portions are provided in the laminate. Further, the plurality of noise filter portions are connected to a plurality of external electrodes formed on the outside of the laminate to be provided in three signal lines. Therefore, common mode noise occurring simultaneously in three signal lines and common mode noise occurring between the two signal lines can be eliminated, and thus applicable to C-PHY.

Further, since the glassy layer is not formed on the entire surface, the thickness of the device can be reduced, and the circuit protection device can be mounted corresponding to the electronic device whose size is reduced and the mounting area and height are reduced. Since the glassy layer is not formed on the entire surface, absorption of moisture can be suppressed, and reliability of the device can be improved.

On the other hand, as the size of the device decreases, the area of the external electrode becomes smaller to reduce the adhesion between the external electrode and the laminate, thereby lowering the adhesion strength when mounted on the PCB. So that the bonding strength can be increased.

Figs. 1 to 4 are waveform diagrams of signals according to ideal signals and delays. Fig.
5 to 10 are views for explaining a circuit protection device according to a first embodiment of the present invention.
11 to 13 are views for explaining a circuit protection device according to a second embodiment of the present invention.
14 and 15 are views for explaining a circuit protection device according to a third embodiment of the present invention.
16 to 20 are views for explaining a circuit protection device according to a fourth embodiment of the present invention.
21 and 22 are a circuit diagram of a circuit protection device according to embodiments of the present invention and waveforms of common mode noise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely. In the drawings, the thickness is enlarged to clearly illustrate the various layers and regions, and the same reference numerals denote the same elements in the drawings.

Common-mode noise is caused by abnormal voltage level of each signal, delay, difference in characteristic impedance of PCB, etc., and there are a lot of cases when it occurs as various causes. However, a case where a delay occurs in one signal line among three signal lines is simulated and illustrated in FIG. 2 to FIG. An ideal case in which no delay occurs is shown in Fig.

Fig. 1 shows a signal waveform in an ideal case where no delay is generated. Fig. 1 (a) is a waveform diagram illustrating three signal waveforms, and Fig. 1 (b) is a signal waveform of common mode noise. As shown in FIG. 1, no delay occurs in the first to third signals 11, 12, and 13, so that it is understood that common mode noise is not generated in an ideal case.

2 (a) shows a signal waveform when a delay is generated in the first signal 11, and FIG. 2 (b) shows a signal waveform of common mode noise due to a delay of the first signal 11. 2B is a common mode noise generated between the first signal 11 and the second signal 12 and the signal denoted by C is the second signal 12 and the third signal 13, Is a common-mode noise generated between the input-output terminals.

3 (a) shows a signal waveform when a delay is generated in the second signal 12, and FIG. 3 (b) shows a signal waveform of common mode noise due to a delay of the second signal 12. FIG. In FIG. 3 (b), A is the common mode noise generated between the first and second signals 11 and 12, and what is denoted by C is the noise generated between the second and third signals 12 and 13 Common-mode noise.

4A is a signal waveform when a delay is generated in the third signal 13 and FIG. 4B is a signal waveform of a common mode noise due to the delay of the third signal 13. FIG. In FIG. 4 (b), A is a common mode noise generated between the third signal 13 and the first signal 11, and what is denoted by B is the second signal 12 and the third signal 13, Is a common-mode noise generated between the input-output terminals.

As described above, when a delay occurs in one signal, a common mode noise occurs between the two signal lines. If there is a delay in both signal lines or a delay occurs in three signal lines simultaneously, Common mode noise is simultaneously generated in all three signal lines.

To eliminate this common-mode noise component, it is difficult to use a conventional filter that can cope with only two signal lines. Although it is possible to use a plurality of elements, cost increases greatly, but it is difficult to obtain a good effect such as an increase in a mounting area. On the other hand, in the case of high-speed signal lines, it is also important to manage the size of the inductor's direct current resistance (RDC). However, when a plurality of elements are connected to each other, the value thereof is greatly increased, or a device having a low DC resistance is selected. However, most of the devices having a low DC resistance have a poor noise removal effect.

Accordingly, there is a need for a noise canceling part that can satisfy various requirements. A circuit element according to embodiments of the present invention, which can satisfy such a requirement, will be described as follows.

FIG. 5 is a perspective view of a circuit protection device according to a first embodiment of the present invention, FIG. 6 is a perspective plan view, and FIG. 7 is an exploded perspective view. 8 and 9 are sectional views taken along the line A-A 'according to the first embodiment and its modified example. And Figure 10 is a schematic view of at least some surfaces.

5 to 10, a circuit protection device according to an embodiment of the present invention includes a laminate 1000 in which a plurality of sheets 101 to 108 and 100 are laminated, At least three or more noise filter portions 2100, 2200 and 2300 including 2000 coil patterns 210 to 260 and an external electrode 220 provided outside the layered structure 1000 and connected to the noise filter portion 2000 3100, 3200, 3000). Further, it may further include a surface modification member 4000 provided at least a part between the layered body 1000 and the external electrode 3000. Here, three noise filter units 2000 may be provided and may be spaced apart from each other by a predetermined distance in the stacking direction of the sheets 100. That is, in the circuit protection device according to an embodiment of the present invention, at least three or more noise filter units 2000 are provided in the stacked body 1000, the noise filter unit 2000 is connected to the external electrodes 3000, Lt; RTI ID = 0.0 > (3000). ≪ / RTI >

1. Laminate

The stacked body 1000 may be provided in a substantially hexahedral shape. That is, the stacked body 1000 has a predetermined length and width in one direction (for example, X direction) and another direction (for example, Y direction) orthogonal to each other in the horizontal direction, Direction) and a substantially hexahedron shape having a predetermined height. Here, the length in the X direction may be equal to or different from the width in the Y direction, and the width in the Y direction may be equal to or different from the height in the Z direction. For example, the length and width may be the same or different, and the height may vary from length to length. The ratio of length, width, and height may be 1: 5: 1: 0.2 : 2. That is, the length may be about 1 to 5 times as wide as the width, and the height may be about 0.2 to 2 times the width. However, the size in the X, Y, and Z directions can be variously changed according to, for example, the internal structure of the electronic device to which the stacked device is connected, the shape of the stacked device, and the like.

The stacked body 1000 may be formed by stacking a plurality of sheets 101 to 108 (100). That is, the stacked body 1000 may be formed by stacking a plurality of sheets 100 having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Therefore, the length and width of the laminate 1000 can be determined by the length and width of the sheet 100, and the height of the laminate 1000 can be determined by the number of laminations of the sheet 100. [ On the other hand, the plurality of sheets 100 may be a magnetic sheet or a non-magnetic sheet. That is, the plurality of sheets 100 may all be magnetic sheet or non-magnetic sheet. However, the plurality of sheets 100 may at least partially be a magnetic sheet, and the remainder may be a non-magnetic sheet. For example, the sheets on which the noise filter unit 2000 is implemented, that is, the first to sixth sheets 101 to 106 may be nonmagnetic sheets, and the seventh and eighth sheets 107, 108 may be a magnetic sheet. On the other hand, the magnetic sheet can be formed using, for example, NiZnCu or NiZn magnetic ceramic. For example, NiZnCu based magnetic material sheet is _{Fe 2 O 3, ZnO, NiO} , there CuO may be formed of a mixture _{of, Fe 2 O 3, ZnO,} NiO and CuO is for example 5: 1 ratio: 2: 2 ≪ / RTI > Further, the non-magnetic sheet can be manufactured using, for example, a low temperature co-fired ceramic (LTCC). The LTCC material may comprise Al ₂ O ₃ , SiO ₂ , a glass material.

The plurality of sheets 100 may be provided in a rectangular plate shape having a predetermined thickness. For example, they may be provided in the form of a square having the same length and width, and may be provided in the shape of a rectangular plate having a different length and width. In addition, the plurality of sheets 100 may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others. On the other hand, the plurality of sheets 100 may be formed to have a thickness of, for example, 1 m to 4000 m and 3000 m or less. That is, the thickness of each of the sheets 100 may be 1 탆 to 4000 탆 according to the thickness of the laminate 1000, and may be, for example, 1 탆 to 300 탆. However, the thickness and the number of stacked sheets of the sheet 100 can be adjusted according to the size of the stacked element. That is, the sheet 100 may be formed to have a small thickness when it is applied to a thin-layered or small-size stacked device, and when the stacked device is applied to a stacked-type device having a large thickness or a large size, . Further, when the sheets 100 are laminated in the same number, the size of the stacked elements may be small, the thickness may be thinner as the height is lower, and the thickness may be thicker as the size of the stacked elements is larger. Of course, a thin sheet can also be applied to a large-size stacked device, in which case the number of stacked sheets increases.

In addition, the layered structure 1000 may further include a cover layer (not shown) provided on at least one of the lower portion and the upper portion. That is, the stacked body 1000 may include a cover layer provided on each of the lowermost layer and the uppermost layer. At this time, only one cover layer may be provided on the upper or lower portion, or both the upper and lower cover layers may be provided. Of course, a separate cover layer is not provided, and the lowermost sheet, that is, the seventh sheet 107 functions as a lower cover layer, and the uppermost sheet, i.e., the eighth sheet 108, may function as an upper cover layer. The seventh and eighth sheets 107, 108 functioning as the lower and upper cover layers may be thicker than the respective thicknesses of the sheets 101 to 106 therebetween. At this time, the seventh and eighth sheets 107 and 108, that is, the cover layer, may be formed by laminating a plurality of sheets having the same thickness as the sheets 101 to 106. Further, the seventh and eighth sheets 107, 108 may be formed to have different thicknesses, for example, the eighth sheet 108 may be thicker than the seventh sheet 107. [ Here, the seventh and eighth sheets 107 and 108 may be formed of a magnetic material sheet, and at least two or more magnetic material sheets may be laminated.

2. noise The filter unit

The noise filter unit 2000 includes a plurality of coil patterns 210 to 260 formed selectively on a plurality of sheets 100 and at least two coil patterns 200, 300 and 300 and lead electrodes 410 to 460 extending out from the coil pattern 200 to the outside of the sheet 100. The vertical connection wirings 300a, That is, the coil patterns 210 to 260 (200) are formed on the upper portions of the plurality of sheets 100, and at least two coil patterns 200 in the stacking direction of the sheets 100, And are connected through holes 310 to 350: 300, that is, vertical connection wirings 300a, 300b, and 300c. Accordingly, a plurality of, for example, two coil patterns 200 connected in the vertical direction form one noise filter portion 2000, and three noise filter portions 2100, 2200, 2300, and 2000, for example, And are stacked in the vertical direction. That is, at least three noise filter parts 2000 are formed in the stacking direction of the sheets 100. Here, the noise filter unit 2000 includes a common mode noise filter that removes common mode noise. At least three noise filter parts 2000 are connected to the external electrode 3000 outside the layered structure 1000.

A first coil pattern 210 and a first lead electrode 410 are formed on the first sheet 101. A second coil pattern 220, a hole 310 filled with a conductive material, and a second lead electrode 420 are formed on a second sheet 102 provided on the first sheet 101. The third sheet 230 provided on the second sheet 102 is provided with a third coil pattern 230, holes 321 and 322 and a third lead electrode 430, . The fourth sheet 104 provided on the third sheet 103 is provided with a fourth coil pattern 240, holes 331, 332, 333 and 330 in which a plurality of conductive materials are separated from each other, 440 are formed. A fifth coil pattern 250 is formed on the fifth sheet 105 provided on the fourth sheet 104 and a plurality of holes 341 and 342 340 and a fifth lead electrode 450, . A sixth coil pattern 260 provided on the fifth sheet 105, a hole 350 filled with a conductive material, and a sixth lead electrode 460 are formed.

Each of the first to sixth coil patterns 210 to 260 may be formed in a predetermined number of turns by rotating in one direction from the central region of each of the first to sixth sheets 101 to 106. For example, the first coil pattern 210 may be formed by rotating in one direction from a region corresponding to the hole 310 of the second sheet 102, and the second coil pattern 220 may be formed by rotating the hole 310, And may be formed by rotating in one direction from a region corresponding to the hole 321 of the third sheet 103. [ The third coil pattern 230 may be formed by rotating in one direction from a region spaced apart from the holes 321 and 322 spaced apart from each other by a predetermined distance and corresponding to the hole 331 of the fourth sheet 104, The fourth coil pattern 240 may be formed by rotating in one direction from a hole 333 formed in a region corresponding to the hole 310 of the second sheet 102 and the hole 322 of the third sheet 103 have. The fifth coil pattern 250 may be formed by rotating in one direction from a hole 342 formed in an area corresponding to the hole 332 of the fourth sheet 104, May be formed by rotating in one direction from a hole (350) to be formed in an area corresponding to the hole (341) of the fifth sheet (105). In addition, the coil pattern 200 may be formed at a predetermined number of revolutions, and may be formed at a number of revolutions of 2 to 20 . For example, the first, third, and fifth coil patterns 210, 230, and 250 may be formed at a rotational speed of 3 to 20 , and the number of rotations of the coil pattern 200 may be at least one, 2, the fourth and sixth coil patterns 220, 240, and 260 may be formed at a rotational speed of 2.5 to 18 , respectively. That is, the number of rotations of the first, third, and fifth coil patterns 210, 230, and 250 may be equal to or greater than the number of rotations of the second, fourth, and sixth coil patterns 220, Further, the coil pattern 200 may have a predetermined line width and a predetermined interval, and may be formed in a spiral shape that rotates outward in at least one of the counterclockwise direction and the clockwise direction. At this time, the line widths of the coil patterns 200 may be the same or different, and the intervals may be the same or different. That is, the line spacing of the same coil pattern 200 may be different depending on the number of revolutions of the coil pattern 200. Further, the coil pattern 200 may be rotated in different directions. For example, the first, third and fifth coil patterns 210, 220 and 250 are rotated counterclockwise, and the second, fourth and sixth coil patterns 220, 240 and 260 are rotated clockwise It can rotate. However, all of the coil patterns 200 may rotate in the same direction in the clockwise or counterclockwise direction. The coil pattern 200 may be formed in various shapes such as a straight line and a curved shape in addition to the spiral shape. That is, in the noise filter unit 2000 of the present invention, a plurality of conductive patterns may be vertically connected, and at least one of the plurality of conductive patterns may have a spiral shape, and at least the other may have a shape other than a spiral shape . Further, although not shown, a magnetic core structure may be formed inside the at least one coil pattern 300. That is, the coil pattern 300 may be formed so that magnetic material is embedded in the center of the sheet 100 to form a magnetic core and surround the magnetic core.

Meanwhile, the coil pattern 200 may be connected to the lead-out electrodes 410 to 460 (400) drawn out to the outside of the sheet 100. The first lead-out electrode 410 connected to the first coil pattern 210 is formed to be exposed to a predetermined region of one side of the first sheet 101. The second outgoing electrode 420 connected to the second coil pattern 220 is formed to be exposed at one side of the second sheet 102 and spaced apart from the first outgoing electrode 410. The third lead electrode 430 connected to the third coil pattern 230 is formed to be exposed at one side of the third sheet 103 and spaced apart from the first and second lead electrodes 410 and 420 . The fourth lead electrode 440 connected to the fourth coil pattern 240 is exposed to the other side of the fourth sheet 104 and is exposed in a region corresponding to the first lead electrode 410. The fifth lead electrode 450 connected to the fifth coil pattern 250 is exposed to the other side of the fifth sheet 105. The fifth lead electrode 450 is spaced apart from the fourth lead electrode 440, As shown in FIG. The sixth lead electrode 460 connected to the sixth coil pattern 260 is formed to be exposed to the other side of the sixth sheet 106 and spaced apart from the fourth and fifth lead electrodes 440 and 450, And is formed so as to correspond to the lead electrode 430. The outgoing electrode 400 may be formed to have a width wider than the width of the coil pattern 200 and preferably be narrower than or equal to the width of the external electrode 3000. The width of the lead electrode 400 is wider than the width of the coil pattern 200 so that the contact area with the external electrode 3000 can be increased and the contact resistance between the lead electrode 400 and the external electrode 3000 .

As shown in FIGS. 7 and 8, the first and fourth coil patterns 210 and 240 are connected through the vertical connection wiring 300a to form the first noise filter portion 2100. That is, the fourth coil pattern 240 is formed by the hole 333 in which the conductive material formed in the fourth sheet 104 is embedded, the hole 322 in which the conductive material is embedded in the third sheet 103, 102 are connected to the first coil pattern 210 through the hole 310 filled with the conductive material. The second and fifth coil patterns 220 and 250 are connected to each other through the vertical connection wiring 300b to form the second noise filter portion 2200. That is, the fifth coil pattern 250 is formed in the hole 342 in which the conductive material formed in the fifth sheet 105 is embedded, the hole 332 in which the conductive material is embedded in the fourth sheet 104, 103 are connected to the second coil pattern 220 through the hole 321 filled with the conductive material. The third and sixth coil patterns 230 and 260 are connected to each other through the vertical connection wiring line 300c to form the third noise filter portion 2300. That is, the sixth coil pattern 260 is formed by the holes 350 in which the conductive material formed in the sixth sheet 105 is embedded, the holes 341 in which the conductive material is embedded in the fifth sheet 104, 104 are connected to the third coil pattern 230 through the holes 331 filled with the conductive material. For example, as shown in FIG. 9, the third and fourth coil patterns 230 and 240 may be connected to each other by the first vertical connection wiring 300a The second and fifth coil patterns 220 and 260 are connected by the second vertical connection wirings 300b and the first and sixth coil patterns 210 and 260 are connected by the third vertical connection wirings 300c, The first to third noise filter units 2100, 2200, 2300, and 2000 may be connected to each other.

The first extraction electrode 410 connected to the first coil pattern 210 is connected to the 1-1 second outer electrode 3110 and the fourth extraction electrode 440 connected to the fourth coil pattern 240 is connected to the second -1 external electrode 3210 in the same manner. The second extraction electrode 420 connected to the second coil pattern 220 is connected to the first and second external electrodes 3120 and the fourth extraction electrode 450 connected to the fifth coil pattern 250 is connected to the second -2 external electrode 3220, as shown in Fig. The third outgoing electrode 430 connected to the third coil pattern 230 is connected to the first to third external electrodes 3130 and the sixth outgoing electrode 460 connected to the sixth coil pattern 260 is connected to the second -3 external electrode 3230, as shown in Fig. Thus, therefore, the first noise filter section 2100 is connected between the 1-1 and 2-1 external electrodes 3110 and 3210, and the second noise filter section 2200 is connected between the 1st and 2nd- -2 external electrodes 3120 and 3220 and the third noise filter 2300 is connected between the first and second external electrodes 3130 and 3230.

On the other hand, the number of rotations of the coil patterns 200 constituting the first to third noise filter portions 2100, 2200, and 2300 may be the same or different from each other. As the number of revolutions of the coil pattern 200 constituting the noise filter unit 2000 is different from each other, one circuit protection element may have at least two impedance characteristics.

3. External electrode

The external electrodes 3000 may be provided on two opposite sides of the stacked body 1000, respectively. That is, when the stacking direction of the sheets 100 is the vertical direction (that is, the Z direction), the external electrodes 3000 (in the Y direction) facing each other in the opposing horizontal direction May be formed. In addition, three external electrodes 3000 may be provided on both sides. That is, two external electrodes 3000 may be formed on two sides of the three noise filter units 2100, 2200, and 2300, respectively. The external electrodes 3110, 3120 and 3130 formed on one side of the laminated body 1000 are referred to as a first external electrode 3100 and the external electrodes 3210, 3220 and 3230 formed on the other side are referred to as a second external electrode (3200). The external electrode 3000 is connected to the first to third noise filters 2100, 2200 and 2300 in the laminated body 1000 and is connected to a terminal and a terminal other than the laminated body 1000, Terminal and the signal output terminal.

The first and second external electrodes 3100 and 3200 may extend from the upper surface and the lower surface of the layered body 1000. That is, the first and second external electrodes 3100 and 3200 may be formed on two sides of the stacked body 1000 facing each other in the Z direction, that is, on the upper and lower surfaces. Accordingly, the external electrode 3000 may extend from the side surface of the laminate 1000 to the upper surface and the lower surface, and may be formed, for example, in a "C" shape.

Meanwhile, the external electrode 3000 may be formed of at least one layer. The external electrode 3000 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 3000 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. The external electrode 3000 may be formed by mixing a multi-component glass frit containing Bi ₂ O ₃ or SiO ₂ as a main component with, for example, 0.5% to 20% of a metal powder. At this time, a mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to two opposite surfaces of the laminate 1000. By including the glass frit in the external electrode 3000, the adhesion of the external electrode 3000 laminated body 10 can be improved and the contact response between the external electrode 3000 and the external electrode 3000 can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the external electrode 3000. That is, the outer electrode 3000 may be formed by forming a metal layer including glass and at least one plating layer on the metal layer. For example, the external electrode 3000 may be formed by sequentially forming a Ni plated layer and a Sn plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu. At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. On the other hand, the external electrode 3000 may be formed to a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 탆 to 10 탆 .

4. Surface modification member

The surface modifying member 4000 may be formed on at least a part of the surface of the laminate 1000. [ That is, the surface modifying member 4000 may be formed on the entire surface of the laminate 1000, or may be formed only in a region of the laminate 1000 in contact with the external electrode 3000. In other words, the surface modifying member 4000 in which the surface modifying member 4000 is formed on a part of the surface of the layered body 1000 may be formed between the layered body 1000 and the external electrode 3000. At this time, the surface modification member 4000 may be formed in contact with the extended region of the external electrode 3000. That is, the surface modification member 4000 may be provided between one side of the external electrode 3000 extending from the upper surface and the lower surface of the layered body 1000 and the layered body 1000. The surface modification member 4000 may be formed to have the same or different size as the external electrode 3000 formed thereon. For example, an area of 50% to 150% of the area of a portion of the external electrode 3000 extending from the upper surface and the lower surface of the layered body 1000 may be formed. That is, the surface modification member 4000 may be formed to have a size smaller or larger than the size of the extension region of the external electrode 3000, or may be formed to have the same size. Of course, the surface modification member 4000 may also be formed between the external electrode 3000 formed on the side surface of the laminated body 1000. The surface modification member 4000 may include a glass material. For example, the surface-modified member (4000) is to include a predetermined temperature, for example below 950 ℃ firing available free (無), borosilicate glass (non-borosilicate glass) (SiO 2 -CaO-ZnO-MgO based glass) in . Further, the surface modification member 4000 may further include a magnetic substance material. That is, if the area in which the surface modifying member 4000 is to be formed is a magnetic substance sheet, the magnetic substance material may be partially contained in the surface modifying member 4000 to facilitate coupling of the surface modifying member 4000 and the magnetic substance sheet. At this time, the magnetic substance material includes, for example, a NiZnCu-based magnetic powder, and the magnetic substance may be contained in an amount of, for example, 1 to 15 wt% with respect to 100 wt% of the glass material. On the other hand, at least a part of the surface modifying member 4000 may be formed on the surface of the laminated body 1000. At this time, at least a part of the glass material may be uniformly distributed on the surface of the laminate 1000 as shown in FIG. 10 (a), and at least a part of the glass material may have a different size as shown in FIG. 10 (b) And may be irregularly distributed. Of course, the surface modifying member 4000 may be formed continuously on the surface of the laminate 1000 to have a film shape. 10 (c), a concave portion may be formed on at least a part of the surface of the laminated body 1000. [ That is, at least a part of the region where the convex portion is formed and the glass material is not formed may be formed by the glass material, and the concave portion may be formed. At this time, the glass material may be formed at a predetermined depth from the surface of the layered body 1000, and at least a portion thereof may be formed higher than the surface of the layered body 1000. That is, at least a part of the surface modifying member 4000 may be flush with the surface of the laminate 1000, and at least a portion thereof may be maintained higher than the surface of the laminate 1000. By forming the surface modifying member 4000 by distributing the glass material in a part of the layered body 1000 before the external electrode 3000 is formed, the surface of the layered body 1000 can be modified, It can be made uniform. Therefore, it is possible to control the shape of the external electrode, thereby facilitating the formation of the external electrode. On the other hand, in order to form the surface modifying member 4000 in a predetermined area on the surface of the laminate 1000, a paste containing a glass material may be printed or applied on a predetermined area of a predetermined sheet. For example, the surface modification member 4000 can be formed by applying glass paste to the six areas on the lower surface of the seventh sheet 107 and the upper surface of the eighth sheet 108, and then curing. In addition, the glass paste can be applied to a predetermined area of the ceramic green sheet before cutting into the size of the layered device. That is, after a glassy paste is applied to a plurality of regions of a ceramic green sheet, a green sheet is cut with a cutting line of a unit of a laminate-type element including a portion where a glassy paste is formed, and the green sheet is laminated with a sheet having a noise filter portion, The device can be manufactured. At this time, since the surface modifying member 4000 is formed at the edge of the laminate 1000, it can be cut in the laminated device unit around the area coated with the glassy paste.

On the other hand, the surface modifying member 4000 may be formed using an oxide. That is, the surface modification member 4000 may be formed using at least one of a vitreous substance and an oxide, and may further include a magnetic substance material. At this time, the surface modifying member 4000 can be dispersed and distributed in the crystalline or amorphous state on the surface of the laminate 1000, and at least a part of the oxide distributed on the surface can be melted. At this time, the oxide may also be formed as shown in Figs. 10 (a) to 10 (c). In addition, even when the surface modifying member 4000 is formed of an oxide, the oxides may be separated from each other and distributed in an island shape, and may be formed in a film form in at least one region. Here, the oxide of a particle state or a molten state is, for example, _{Bi 2 O 3, BO 2,} B 2 O 3, ZnO, Co 3 O 4, SiO 2, Al 2 O 3, MnO, H 2 BO 3, H 2 BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ .

As described above, in one embodiment of the present invention, a plurality of coil patterns 200 are formed in a laminated body 1000 in which a plurality of sheets 100 are stacked, and at least two or more coil patterns 200 are connected to each other, And at least three or more noise filter units 2000 are formed in the stacked body 1000. [ The plurality of noise filter units 2000 are connected to the plurality of external electrodes 3000 formed outside the stacked body 1000 and are provided between the signal lines. Therefore, common mode noise occurring simultaneously in three signal lines and common mode noise occurring between the two signal lines can be eliminated, and thus applicable to C-PHY.

Further, since the glassy layer is not formed on the entire surface, the thickness of the device can be reduced, and the circuit protection device can be mounted corresponding to the electronic device whose size is reduced and the mounting area and height are reduced. Since the glassy layer is not formed on the entire surface, absorption of moisture can be suppressed, and reliability of the device can be improved. On the other hand, as the size of the device decreases, the area of the external electrode becomes smaller to reduce the adhesion between the external electrode and the laminate, thereby lowering the adhesion strength when mounted on the PCB. So that the bonding strength can be increased.

Fig. 11 is a perspective plan view of a circuit protection device according to a second embodiment of the present invention, Fig. 12 is an exploded perspective view, and Fig. 13 is a circuit diagram. The second embodiment of the present invention is formed with a capacitor including at least one internal electrode between at least one region of the plurality of noise filter portions 2000. [ 11 and 12, a capacitor is formed in at least one noise filter unit 2000, and a plurality of noise filter units 2000, as shown in FIG. 13, Respectively.

11 to 13, the circuit protection device according to the second embodiment of the present invention includes a laminated body 1000 in which a plurality of sheets 100 are laminated, At least three or more noise filter parts 2100, 2200 and 2300 (2000) each including a plurality of noise filters 200 and an external electrode (not shown) connected to the noise filter part 2000, 3100, 3200, and 3000, and at least one internal electrode 510, 520, 500 provided in a predetermined region in the stacked body 1000.

That is, in the circuit protection device according to the second embodiment of the present invention, at least two internal electrodes 510 and 520 are provided so as to overlap at least a part of the stacked body 1000, and at least one capacitor is formed therebetween. For example, two sheets 109 and 110 are provided between the sixth sheet 106 and the eighth sheet 108, and on the respective sheets 109 and 110, the internal electrodes 510, 520 are formed to overlap at least a part to form a capacitor. That is, the capacitor is formed by the first and second internal electrodes 510 and 520 and the tenth sheet 110 formed therebetween. At least two internal electrodes 510 and 520 may be connected to at least one of the first and second external electrodes 3100 and 3200 formed on opposite sides of the stack 1000, respectively. For example, the first inner electrode 510 may be connected to the first to third outer electrodes 3130, and the second inner electrode 520 may be connected to the second to second outer electrodes 3220. At this time, at least one of the external electrodes 3000 may be connected to the ground terminal, for example, the first to third external electrodes 3130 may be connected to the ground terminal. Meanwhile, a third external electrode (not shown) may be formed outside the layered structure 1000 to connect at least one of the first and second internal electrodes 510 and 520 to the ground terminal. That is, at least one of the first and second internal electrodes 510 and 520 may be connected to the third external electrode without being connected to the first and second external electrodes 3100 and 3200. At this time, the third external electrode may be formed on two opposite surfaces of the stacked body 1000 where the first and second external electrodes 3100 and 3200 are not formed, and may be connected to the ground terminal. Therefore, in this case, any one of the first and second internal electrodes 510 and 520 may be connected to the ground terminal through the third external electrode. On the other hand, the capacitor may be formed between the coil patterns 200. For example, although not shown, a capacitor may be formed between the third coil pattern 230 and the fourth coil pattern 240. For this purpose, at least one sheet is further provided between the third and fourth sheets 130 and 140 respectively formed with the third and fourth coil patterns 230 and 240, and at least one internal electrode is provided on at least one sheet So that a capacitor can be realized. For example, a sheet 109, 110 in which the internal electrode 500 is formed between the third and fourth sheets 130, 140 may be provided to form a capacitor. In addition, one sheet having one internal electrode may be provided between the coil patterns 200. At this time, if one sheet is further provided and one internal electrode is formed, a capacitor may be formed between the internal electrode and the upper coil pattern, and between the internal electrode and the lower coil pattern. That is, a capacitor may be formed between adjacent coil patterns with the internal electrode and the sheet sandwiched therebetween. Of course, at least two internal electrodes 500 may be formed in at least two regions between the coil patterns 200, and at least two capacitors may be formed in the stacked body 1000. In this case, the internal electrodes 500 for forming the capacitors may be formed in various shapes. In order to connect the coil patterns 200 to each other, a hole in which a conductive material is buried should be formed in the sheet on which the internal electrode 500 is formed And the internal electrode 500 may be formed at a predetermined distance from the hole filled with the conductive material. Accordingly, at least one capacitor is formed in the stacked body 1000, and each capacitor may be formed in each noise filter, for example, as shown in FIG.

The circuit protection device according to the second embodiment of the present invention as described above can be fabricated by using the number of revolutions of the coil pattern 200, the area of the internal electrode 500 of the capacitor, and the interval between the coil patterns 200, To 106), it is possible to adjust the inductance and the capacitance, and thus to control the noise of the suppressed frequency. For example, by reducing the thickness of the sheets 102 to 106, noise in a low frequency band can be suppressed, and noise in a high frequency band can be suppressed by increasing the thickness. The circuit protection element consisting of the three noise filter units 2000 and one or more capacitors, that is, the common mode noise filter, can suppress noise in at least two frequency bands. Therefore, the circuit protection device according to the second embodiment of the present invention can suppress noise in two or more frequency bands and is thus used in portable electronic devices such as smart phones employing various frequency functions, Can be improved.

Meanwhile, the circuit protection device according to the present invention may be provided with a structure in which a plurality of noise filter parts 2000 and an overvoltage protection part for protecting electronic devices from overvoltage of ESD or the like are combined. That is, at least three or more noise filters 2000 and the overvoltage protection unit may be combined to implement the circuit protection device. The circuit protection device according to the third embodiment of the present invention will be described with reference to FIGS. 14 and 15. FIG. FIG. 14 is a perspective view of a circuit protection device according to a third embodiment of the present invention, and FIG. 15 is an exploded perspective view.

14 and 15, the circuit protection device according to the third embodiment of the present invention includes at least three noise filter portions 2100, 2200, 2300, 2000 each including a plurality of coil patterns 200, First and second external electrodes 3100 and 3200 formed on two mutually opposing sides of the layered structure 1000 and connected to at least three noise filter parts 2000 and an overvoltage protection part A third external electrode 3300 formed on two opposite sides of the stack 1000 separated from the first and second external electrodes 3100 and 3200 and connected to the overvoltage protection unit 5000, . ≪ / RTI > Here, the third external electrode 3300 may be formed on the side surface of the layered body 1000 where the first and second external electrodes 3100 and 3200 are not formed. For example, the first and second external electrodes 3100 and 3200 are formed on two sides of the layered body 1000 facing each other in the Y direction, and the third external electrode 3300 is formed in the X direction of the layered body 1000 As shown in Fig. That is, in the circuit protection device according to another embodiment of the present invention, at least three or more noise filter parts 2000 including a plurality of coil patterns 200 are connected to the first and second external electrodes 3100 and 3200 And the overvoltage protection unit 5000 is disposed inside the layered structure 1000 and spaced apart from the noise filter unit 2000 to be connected to the third external electrode 3300. On the other hand, although not shown, a capacitor including at least one internal electrode described in the second embodiment of the present invention can also be applied to the third embodiment of the present invention.

The overvoltage protection unit 5000 is formed by stacking at least two sheets 111 and 112 on which lead electrodes 471 to 476 and 480 and holes 361 to 366 are selectively formed, respectively. Here, the sheets 111 and 112 may be provided between the first sheet 101 and the seventh sheet 107, that is, between the first sheet 101 and the lower cover layer. Of course, the sheets 111 and 112 may be provided between the sixth sheet 106 and the eighth sheet 108, that is, between the sixth sheet 106 and the top cover layer. The sheets 111 and 112 may be provided in the shape of a rectangular plate having the same thickness and shape as those of the sheets 100 constituting the noise filter unit 2000. Further, the sheets 111 and 112 may be made of a nonmagnetic sheet or a magnetic sheet. For example, the sheets 101 to 106 constituting the noise filter portion 2000 may be made of a non-magnetic sheet, and the seventh and eighth sheets 107 and 108 used as lower and upper cover layers and the overvoltage protection The sheets 111 and 112 constituting the part 5000 may be made of a magnetic sheet.

A plurality of lead electrodes 471 to 476 (470) are formed on the upper surface of the sheet 112. The plurality of extraction electrodes 470 may be formed at the same positions as the extraction electrodes 410 to 460 of the plurality of noise filter units 2000 connected to the first and second outer electrodes 3100 and 3200, respectively. The lead electrode 471 is connected to the 1-1 external electrode 3110. The lead electrode 422 is connected to the 1-2 external electrode 3120. The lead electrode 473 is connected to the And may be connected to the external electrode 3130. The lead electrode 474 is connected to the 2-1 external electrode 3210. The lead electrode 475 is connected to the 2-2 external electrode 3220. The lead electrode 476 is connected to the 2- And may be connected to the external electrode 3230. A plurality of holes 361 to 366 are formed on the sheet 112. The plurality of holes 361 to 366 may be formed at one end of the plurality of extraction electrodes 471 to 476, respectively. Further, the plurality of holes 361 to 366 are each buried by the overvoltage protection material. The overvoltage protection material may be formed of a material in which at least one conductive material selected from Ru, Pt, Pd, Ag, Au, Ni, Cr, W and Fe is mixed with an organic material such as polyvinyl alcohol (PVA) or polyvinyl butyral . The overvoltage protection material may be formed by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ to the mixed material. Of course, various materials other than the above-mentioned materials may be used as the overvoltage protection material. For example, the overvoltage protection material may use at least one of porous insulating material and void. That is, a porous insulating material may be embedded or coated in the hole, a void may be formed in the hole, or a mixed material of the porous insulating material and the conductive material may be embedded or coated in the hole. Porous insulating materials, conductive materials and voids may also be formed in layers in the holes. For example, a porous insulating layer may be formed between the conductive layers, and voids may be formed between the insulating layers. At this time, the voids may be formed by connecting a plurality of pores of the insulating layer to each other. Here, as the porous insulating material, a ferroelectric ceramic having a dielectric constant of about 50 to 50,000 can be used. For example, the insulating ceramics may be formed by using a dielectric material powder such as MLCC, a mixture containing at least one of ZrO 2, ZnO, BaTiO ₃ , Nd ₂ O ₅ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn and Al ₂ O ₃ . Such a porous insulating material can be formed into a porous structure having a plurality of pores each having a size of 1 nm to 5 탆 and formed with a porosity of 30% to 80%. At this time, the shortest distance between the pores may be about 1 nm to 5 탆. The conductive ceramic used as the overvoltage protection material may be formed using a conductive ceramic. The conductive ceramic may be a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, and Bi. On the other hand, the inside of the plurality of holes 361 to 366 may maintain a vacant space and the vacant space may be used as the overvoltage protection member.

The sheet 111 is provided on the lower side of the sheet 112, and the lead electrode 480 is formed on the sheet 111. The lead electrode 480 may be formed so as to be exposed from one side of the sheet 195 to the other side opposite thereto. That is, the lead electrode 480 is formed so as to be exposed at the side orthogonal to the side on which the lead electrodes 471 to 476 formed on the sheet 112 are exposed. The lead electrodes 480 are connected to third external electrodes 3310, 3320, and 3300 formed on two mutually opposing sides of the layered body 1000. A predetermined region of the lead electrode 480 is connected to the holes 361 to 366 of the sheet 111. To this end, a portion connected to the holes 361 to 366 may be formed to have a width larger than other regions have.

Further, a sheet (not shown) may be provided on the sheet 112. The unshown sheet is provided for separating the noise filter unit 2000 and the overvoltage protection unit 5000 and may be formed to have a thickness that suppresses interference therebetween. The unshown sheet may be formed by laminating a plurality of sheets having the same thickness as the sheets 111 and 112.

The circuit protection device in which the plurality of noise filter units 2000 and the overvoltage protection unit 5000 according to the third embodiment of the present invention are combined has a first input terminal and a second input output terminal, 2 external electrodes 3100 and 3200 are connected to the ground terminal and the third external electrode 3300 is connected to the ground terminal to remove the common mode noise and to flow a high voltage such as static electricity to the input and output terminals to the ground terminal . That is, when the overvoltage protection unit 5000 is connected to the ground terminal between the input terminal and the output terminal and a voltage equal to or higher than an undesired predetermined voltage is applied between both terminals of the circuit protection element, a discharge occurs between the conductive particles of the overvoltage protection material The current is supplied to the ground terminal and the voltage difference between both ends of the circuit protection element is reduced. For example, the overvoltage protection unit 5000 may include the overvoltage protection material embedded in the holes 361 to 366 in a state where the conductive material and the porous insulating material are mixed at a predetermined ratio. That is, when conductive particles are present between the insulating materials and a voltage lower than a predetermined voltage is applied to the drawing electrodes 471 to 476, the insulating state is maintained, and a voltage higher than a predetermined voltage is applied to the drawing electrodes 471 to 476 A discharge is generated between the conductive particles, thereby reducing the voltage difference between the corresponding extraction electrodes 471 to 476. At this time, since both ends of the circuit protection element are not in a conductive state, the input signal is directly transmitted to the input / output terminal without distortion. That is, even when a static electricity is generated in the circuit protection device, the static electricity is discharged to the ground through the corresponding circuit protection device, thereby protecting the circuit, and the signal transmitted and received by the system is maintained.

16 to 20 are views for explaining a circuit protection device according to a fourth embodiment of the present invention. 16 is a circuit diagram, Figs. 17 and 19 are a schematic perspective plan view according to the fourth embodiment, and Figs. 18 and 20 are a partially separated perspective view of Figs. 17 and 19. Fig.

As shown in Fig. 16, a capacitor is formed in three lines connected to the circuit protection element, i.e., three input lines and three output lines, respectively. When the same capacitance is realized by the ground terminal, the differential signal passes through the capacitor without recognizing the capacitance, but only the common mode is filtered by the capacitance. To this end, it may be connected to both the input terminal and the output terminal, or to either the input terminal or the output terminal. Specifically, as shown in FIGS. 17 and 18, a plurality of internal electrodes 511, 512, 513, 521, 522, and 523 connected to the first and second external electrodes 3100 and 3200, Or a common electrode 530 connected to the third external electrode 3300 on the upper side. At this time, the plurality of internal electrodes 511, 512, 513, 521, 522, 523 are spaced apart from each other and overlap the common electrode 530 in a predetermined area. A sheet 113 on which a common electrode 530 is formed is provided below or above the sheet 114 on which the internal electrodes 511, 512, 513, 521, 522, 523 are formed, May be provided inside the laminated body 1000 according to the embodiments of the present invention. For example, it may be provided between the noise filter portion 2000 of the first and third embodiments of the present invention and the upper cover layer, i.e., the eighth sheet 108. Of course, the sheet 114, 115 may be provided instead of the sheet 109, 110 of FIG. 12, in which the internal electrode of the second embodiment of the present invention is formed. Therefore, a capacitance can be realized between the internal electrodes 511, 512, 513, 521, 522, 523 and the common electrode 530. Also, such a capacitor may be implemented together with an overvoltage protection unit.

18, inner electrodes 511, 512 and 513 connected to the first outer electrode 5100 and a common electrode 530 connected to the third outer electrode 6300, which are provided below the inner electrodes 511, 512 and 513, respectively, And internal electrodes 521, 522 and 523 provided on the lower side thereof and connected to the second external electrode 5200, respectively. That is, the internal electrodes 510, the common electrode 530, and the internal electrodes 520 may be stacked. At this time, the internal electrodes 510 and the internal electrodes 520 overlap and can overlap with the common electrode 530. Internal electrodes 511, 512 and 513 are formed on a predetermined sheet 115, a common electrode 530 is formed on a predetermined sheet 114, and internal electrodes 521, 522 and 523 Are formed on the predetermined sheet 113 so that these sheets 113, 114, and 115 can be laminated. In addition, these sheets 113, 114, and 115 may be provided inside the laminated body 1000 according to the embodiments of the present invention. For example, it may be provided between the noise filter portion 2000 of the first and third embodiments of the present invention and the upper cover layer, i.e., the eighth sheet 108. Of course, the sheet 114, 115 may be provided instead of the sheet 109, 110 of FIG. 12, in which the internal electrode of the second embodiment of the present invention is formed. Therefore, a capacitance can be realized between the internal electrodes 511, 512, 513, 521, 522, 523 and the common electrode 530. Also, such a capacitor may be implemented together with an overvoltage protection unit.

21 and 22 are circuit diagrams of a circuit protection element capable of removing common mode noise according to embodiments of the present invention, and waveforms of common mode noise according to the circuit diagram.

21A is a circuit diagram of a circuit protection element in which noise filter portions are respectively provided in three signal lines as a first embodiment of the present invention. That is, it is a circuit diagram of a circuit protection element provided with three noise filter portions in a laminate according to the first embodiment of the present invention. FIG. 21 (b) is a waveform diagram of common mode noise when the circuit protection device according to the first embodiment of the present invention is not applied and when it is applied. FIG. Here, reference numeral 20 denotes a common mode noise component when the circuit protection element according to the present invention is not applied, and reference numeral 30 denotes a common mode noise component when a circuit protection element is applied. As shown, the common mode noise component is large when the circuit protection element is not applied, but the common mode noise component can be greatly reduced when the circuit protection element is applied.

22 (a) is a circuit diagram of a circuit protection element in which a plurality of noise filters and capacitors are formed on three signal lines, according to a second embodiment of the present invention. That is, it is a circuit diagram of a circuit protection element in which three noise filter portions are provided in the stacked body according to the second embodiment of the present invention, and a capacitor is formed therebetween. Fig. 22 (b) is a waveform diagram of the common mode noise when the circuit protection element is not applied (reference numeral 40) and when the circuit protection element is applied (reference numeral 50). As shown in the figure, when a circuit protection element is applied, the common mode noise component can be greatly reduced. On the other hand, common mode noise can be removed by a combination of various L, C, and common mode filters in addition to the circuit example.

The present invention is not limited to the above-described embodiments, but may be embodied in various forms. In other words, the above-described embodiments are provided so that the disclosure of the present invention is complete, and those skilled in the art will fully understand the scope of the invention, and the scope of the present invention should be understood by the appended claims .

1000: laminate 2000: noise filter part
3000: external electrode 4000: surface modification member
5000: Overvoltage Protection Unit

Claims (13)

A lower cover layer and an upper cover layer provided in a vertical direction;
A plurality of sheets provided between the lower cover layer and the upper cover layer;
And a coil pattern formed on the plurality of sheets in a spiral shape,
At least two coil patterns are vertically connected to constitute one noise filter section,
And at least three or more noise filter portions formed in mutually perpendicular directions.
The circuit protection device according to claim 1, comprising a lower cover layer, a plurality of sheets, and a plurality of external electrodes provided outside the stacked layers of the upper cover layers and connected to the at least three noise filter portions.
The circuit protection device according to claim 2, wherein the external electrodes connected to the at least three noise filter portions are respectively connected to the number of signal lines corresponding to the number of the noise filter portions.
4. The circuit protection device of claim 3, wherein common mode noise of each of the three signal lines and common mode noise between the two signal lines are eliminated.
The image forming apparatus according to claim 2, further comprising first through sixth sheets stacked in a vertical direction,
And first to sixth coil patterns formed in a spiral shape on the first to sixth sheets, respectively,
The first and fourth coil patterns are connected, the second to fifth coil patterns are connected, and the third and sixth coil patterns are connected.
The image forming apparatus according to claim 2, further comprising first through sixth sheets stacked in a vertical direction,
And first to sixth coil patterns respectively formed on the first to sixth sheets,
The third and fourth coil patterns are connected, the second to fifth coil patterns are connected, and the first and sixth coil patterns are connected.
The circuit protection element according to claim 1, wherein the at least one noise filter portion has a number of revolutions of the coil pattern. The circuit protection element of claim 1, wherein the at least one noise filter portion further comprises a magnetic core formed at the center of the coil pattern.
The circuit protection element of claim 1, further comprising at least one capacitor provided in the stack.
The circuit protection device according to any one of claims 2 to 9, further comprising at least one overvoltage protection portion provided in the laminate.
11. The circuit protection device according to claim 10, wherein the sheet on which the noise filter section is formed is a non-magnetic substance sheet, and the sheet on which the overvoltage protection section is formed is a magnetic substance sheet.
The circuit protection device according to claim 2, further comprising a surface modification member formed on at least a part of the surface of the laminate, the surface modification member being made of a material different from the surface of the laminate.
A laminate in which a plurality of sheets are stacked between an upper and a lower cover layer, and between the upper and lower cover layers;
At least one over-voltage protecting portion, at least three noise filter portions provided between the upper and lower cover layers; And
And a surface modification member formed on at least a part of the surface of the laminate and made of a material different from that of the surface of the laminate,
The three or more noise filter portions are provided to be spaced apart from each other between the upper cover layer and the overvoltage protection portion in the laminate and each have a plurality of coil patterns,
Wherein the overvoltage protection portion is provided between the noise filter portion and the lower cover layer in the laminate,
Wherein the noise filter portion is formed in a non-magnetic sheet, the overvoltage protection portion is formed in a magnetic sheet,
Wherein the surface modification member is formed by dispersing oxides.

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