TWI655747B - Circuit protection device - Google Patents

Abstract

A circuit protection device is provided. The circuit protection device includes a laminated body in which a plurality of sheets are laminated, a conductive pattern is selectively provided on the plurality of sheets, and a plurality of miscellaneous electrodes are arranged in three signal lines. A signal filter component to remove common mode noise from each of the three signal lines and common mode noise between every two signal lines.

Description

Circuit protection device

The present invention relates to a circuit protection device, and more particularly to a circuit protection device for removing common mode noise.

Existing differential signaling uses two wires to transmit signals. In contrast, in recent years, a differential transmission using three lines capable of transmitting a signal at the same speed while increasing the bandwidth has been proposed. Differential messaging using three wires can be applied to smart phone cameras, liquid crystal displays (LCDs), and the like. The existing differential signaling using two lines is called D-PHY, and the differential signaling using three lines is called C-PHY. Therefore, when compared to D-PHY, the number of C-PHY signal transmission lines can be reduced. For example, the existing D-PHY requires 20 transmission lines to achieve 4K image on the smart phone's LCD display. However, in the case of C-PHY, only 9 transmission lines are required.

Existing differential messaging uses a pair of transmission lines to transmit a signal. Ideally, there only needs to be one differential signal having a plurality of mutually different signal phases. However, depending on the state of the semiconductor chipset (ie, the signal source) or the state of the printed circuit board (ie, the body of the signal transmission line, connector, etc.), maintaining an out-of-phase between exactly two signals is difficult. As systems become more complex and transmission lines become longer, maintaining out of phase is difficult. Specifically, a common mode component having the same signal phase is generated in the smart phone, and the signal is used as noise to affect the peripheral circuits. Specifically, the signals can have an impact on the sensitivity of wireless communications. Here, the sensitivity can be increased in the order of GPS, 800 megahertz (MHz) 2G / 3G wireless communication, 1.8 GHz (GHz) band and wireless fidelity (Wi-Fi) band. In order to improve the communication quality by removing the common mode noise component, a common mode noise filter is used, and the common mode noise filter can be installed on a liquid crystal display with a high data transmission rate and a multimedia transmission line. , Cameras, universal serial bus (USB), external displays, etc.

As described above, as the demand for high-quality video and audio services increases, new C-PHY methods have been proposed. In addition, the existing two lines are provided with a pair (or the three lines are provided with a pair) to transmit signals, and therefore, signal transmission becomes more complicated. Therefore, it may not be possible to apply a filter capable of removing the generated noise to an existing filter. That is, since the package of the component itself has to be changed according to the number of lines, it is impossible to apply the above-mentioned filter to an existing filter. Therefore, when the filter's internal circuit is modified, the filter can remove noise while allowing appropriate signals to pass through it.

In the universal circuit protection device, a glassy sheet is formed on the entire surface of the laminated body in which the noise filter is implemented. That is, a plurality of sheets are laminated to achieve the laminated body, and the uppermost layer and the lowermost layer of the laminated body are both made of a glassy sheet. However, when the glassy sheet is formed on the entire surface of the laminated body, the glassy sheet may absorb moisture and thereby deteriorate the reliability of the device. In addition, the formation of the glassy sheet further increases the thickness of the circuit protection device. (Prior Art Document) Korean Patent Registration No. 10-0876206

The invention provides a circuit protection device for removing common mode noise.

The present invention also provides a circuit protection device for removing common mode noise generated from three lines at the same time and common mode noise generated between each two lines.

The invention also provides a circuit protection device with a reduced thickness because no glassy sheet is formed on the upper and lower surfaces.

According to an exemplary embodiment, a circuit protection device includes a laminated body in which a plurality of sheets are laminated, a conductive pattern is selectively provided on the plurality of sheets, and a plurality of noises are disposed in three signal lines. A filter component to remove common mode noise from each of the three signal lines and common mode noise between every two signal lines.

The plurality of noise filter components may be provided with at least three and are spaced apart from each other in the multilayer body and include a plurality of coil patterns, respectively, and the circuit protection device may further include an external electrode disposed on the external electrode. The laminate is externally connected to the at least three noise filter components, respectively.

The at least three noise filter parts may be disposed to be spaced apart from each other by a predetermined distance in a lamination direction of the sheet.

Each of the noise filter parts may include: a plurality of coil patterns respectively disposed on the plurality of sheets; and a plurality of vertical connecting lines disposed on the selected sheet to place at least two Coil patterns are connected to each other; and a plurality of lead-out electrodes are drawn outward from each of the plurality of coil patterns and connected to the external electrodes.

At least one of the noise filter components may differ in the number of turns of the coil pattern.

At least one of the noise filter parts may further include a magnetic core disposed at a center of each of the coil patterns.

The circuit protection device may further include at least one capacitor disposed in the laminated body.

The circuit protection device may further include at least one overvoltage protection member disposed in the laminated body.

The sheet on which the noise filter member is placed may be a non-magnetic sheet, and the sheet on which the overvoltage protection member is placed may be a magnetic sheet.

The circuit protection device may further include a surface modifying member disposed on at least a portion of a surface of the laminated body and made of a material different from a material of the surface of the laminated body.

Each of the external electrodes may extend to at least one of an uppermost sheet and a lowermost sheet of the laminated body, and the surface modification member may be disposed at least in an extension region of the external electrode and Between the laminated bodies.

At least a part of the surface modifying member may be discontinuously or continuously disposed.

Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. For clarity of illustration, the dimensions of layers and regions are exaggerated in the drawings. The same reference numbers refer to the same elements throughout the drawings.

Common mode noise may occur when the voltage level of each of the signals is abnormal, a delay occurs, or the characteristic impedance of the printed circuit board is different. In addition, the number of such occurrences can vary greatly due to their various causes. However, the results obtained by simulating a situation in which a delay occurs in one of the three signal lines are illustrated in FIGS. 2 to 4. Further, an ideal case in which no delay occurs is illustrated in FIG. 1.

FIG. 1 illustrates a signal waveform in an ideal case where no delay occurs, (a) in FIG. 1 is a waveform diagram illustrating an example of three signal waveforms, and (b) in FIG. 1 is a signal waveform of a common mode noise. As shown in FIG. 1, in an ideal case where no delay occurs in the first to third signals 11, 12, and 13, it can be seen that no common-mode noise is generated.

(A) in FIG. 2 is a signal waveform of a case where a delay occurs in the first signal 11, and (b) in FIG. 2 is a signal waveform of common mode noise caused by the delay of the first signal 11. The symbol expressed as B in (b) in FIG. 2 represents the common mode noise generated between the first signal 11 and the second signal 12, and the symbol expressed as C represents the second signal 12 and the second signal. Common-mode noise between the three signals 13.

(A) in FIG. 3 is a signal waveform of a case where a delay occurs in the second signal 12, and (b) in FIG. 3 is a signal waveform of common mode noise caused by the delay of the second signal 12. The symbol expressed as A in (b) in FIG. 3 represents the common mode noise generated between the first signal 11 and the second signal 12, and the symbol expressed as C represents the second signal 12 and the first Common-mode noise between the three signals 13.

(A) in FIG. 4 is a signal waveform of a case where a delay occurs in the third signal 13, and (b) in FIG. 4 is a signal waveform of common mode noise caused by the delay of the third signal 13. The symbol expressed as A in (b) in FIG. 4 represents the common mode noise generated between the third signal 13 and the first signal 11, and the symbol expressed as B represents the second signal 12 and the first Common-mode noise between the three signals 13.

As described above, when a delay occurs in one signal, common mode noise may be generated between every two signal lines. If a delay occurs in every two signal lines at the same time or a time difference occurs in the three signal lines at the same time, common mode noise may be generated in the three signal lines at the same time.

However, it is difficult to use existing filters to control only the two signals while removing the common mode noise component. This is possible if multiple devices are used, however the cost may increase significantly and the installation area may increase. In the case of high-speed signal lines, it is important to manage the strength of the direct current resistance (RDC) of the inductor. However, if multiple devices are connected to each other, the resistance value will increase significantly, or a device with low DC resistance must be selected, but such devices are difficult to find. In the case of devices with low DC resistance, the devices often have poor noise removal effects.

Therefore, there is a need for a noise removal component capable of satisfying a plurality of necessary conditions. A circuit device capable of satisfying the conditions according to an exemplary embodiment will be explained below.

FIG. 5 is a perspective view of a circuit protection device according to an exemplary embodiment, FIG. 6 is a projection plan view, and FIG. 7 is an exploded perspective view. 8 and 9 are cross-sectional views taken along line A-A 'according to an exemplary embodiment and a modified example. FIG. 10 is a schematic diagram illustrating at least a part of the surface.

5 to 10, a circuit protection device according to an exemplary embodiment may include a laminated body 1000 in which a plurality of sheets 101 to 108 (100) are laminated, and a plurality of coil patterns 201 to 201 provided in the laminated body 1000. At least three noise filter parts 2100, 2200, and 2300 (2000) of 260 (200) and external electrodes 3100 and 3200 (3000) that are disposed outside the laminated body 1000 and connected to the noise filter part 2000. In addition, the input device 10 may further include a wiring portion 4000 connected to the piezoelectric vibration member 3000 via at least a portion of the frame 1000. Here, three noise filter parts 2000 spaced apart from each other by a predetermined distance in the lamination direction of the sheet 100 may be provided. That is, in the circuit protection device according to the exemplary embodiment, the at least three noise filter parts may be provided in the laminated body 1000, and the noise filter parts may be connected to the external electrode 3000 and then via the external electrode 3000 and connected to the signal line. Laminated body

The laminated body 1000 may have an approximately hexahedral shape. The laminated body 1000 may have a predetermined length and a predetermined width in one direction (for example, the X direction) and another direction (for example, the Y direction) that are perpendicular to each other in the horizontal direction and a predetermined direction Approximate hexahedral shape for height. Here, the length in the X direction may be equal to or different from the width in the Y direction, and the width in the Y direction may be equal to or different from the height in the Z direction. For example, the length and width may be equal to or different from each other, and the height may be different from the length. Here, the ratio of the width to the height may be 1 to 5: 1: 0.2 to 2. That is, the length may be 1 to 5 times larger than the width, and the height may be 0.2 to 2 times larger than the width. However, the dimensions in the X, Y, and Z directions may be merely examples. For example, the lengths in the X direction, the Y direction, and the Z direction may be changed in various forms according to the internal structure of the electronic device connected to the multilayer device and the shape of the multilayer device.

The laminated body 1000 can be manufactured by laminating the plurality of sheets 101 to 108 (100). That is, the laminated body 1000 can be manufactured by laminating the plurality of sheets 100 having a predetermined length in the X direction and a predetermined thickness in the Z direction. Therefore, the length and width of the laminated body 1000 can be determined by the length and width of each of the sheets 100, and the height of the laminated body 1000 can be determined by the number of laminated sheets 100. The plurality of sheets 100 may be a magnetic sheet or a non-magnetic sheet. That is, all the sheets 100 may be magnetic sheets or non-magnetic sheets. However, at least a part of the plurality of sheets 100 may be a magnetic sheet, and the remaining part may be a non-magnetic sheet. For example, the sheet in which the noise filter part 2000 is provided (that is, the first sheet 101 to the sixth sheet 106) may be a non-magnetic sheet, and the first sheet 101 to the sixth sheet 106 may be disposed above and below the sheet. The seven sheets 107 and the eighth sheet 108 may be magnetic sheets. For example, the magnetic sheet may be formed using a NiZnCu-based or NiZn-based magnetic ceramic. For example, a NiZnCu-based magnetic sheet can be formed by mixing Fe ₂ O ₃ , ZnO, NiO, and CuO. Here, Fe ₂ O ₃ , ZnO, NiO, and CuO can be mixed at a ratio of 5: 2: 2: 1. In addition, the non-magnetic sheet may be manufactured using a low temperature co-fired ceramic (LTCC). The low temperature co-fired ceramic material may include Al ₂ O ₃ , SiO ₂ and glass materials.

Each of the plurality of sheets 100 may have a rectangular plate shape having a predetermined thickness. For example, the sheet material 100 may have a square plate shape having the same length and width or a rectangular plate shape having different lengths and widths from each other. In addition, the plurality of sheets 100 may have the same thickness, or at least one of the sheets 100 may have a thickness greater than or smaller than the thickness of other sheets 100. For example, each of the plurality of sheets 100 may have a thickness of 1 micrometer ( μm ) to 4000 micrometers, that is, a thickness of 3000 micrometers or less. That is, the sheet 100 may have a thickness of 1 μm to 4000 μm, for example, a thickness of 1 μm to 3000 μm according to the thickness of the laminated body 1000. However, the thickness of the sheet 100 and the number of laminated sheets 100 can be adjusted according to the size of the laminated device. That is, the sheet 100 may have a thin thickness when applied to a laminated type device having a thin thickness and a small size. When applied to a laminated type device having a thick thickness and a large size, the sheet 100 may have a thick thickness. In addition, when the sheets 100 are laminated in the same number, the more the size of the laminated type device decreases, the more the thickness decreases. In addition, as the size of the multilayer device increases, the thickness increases. Alternatively, the thin sheet 100 may be applied to a laminated type having a large size. In this case, the number of laminated sheets can be increased.

In addition, the laminated body 1000 may further include a cover layer (not shown in the figure) disposed on at least one of a lower portion and an upper portion of the laminated body 1000. That is, the laminated body 1000 may include a cover layer disposed on each of the uppermost layer and the lowermost layer. Here, the cover layer may be placed on only one of the upper part and the lower part or on the owner in the upper part and the lower part. Alternatively, a separate cover layer may not be provided. Here, the lowermost sheet (ie, the seventh sheet 107) may serve as a lower cover layer, and the uppermost sheet (ie, the eighth sheet 108) may serve as an upper cover layer. Each of the seventh sheet material 107 and the eighth sheet material 108 serving as the lower cover layer and the upper cover layer may have one of the sheets 101 to 106 located between the seventh sheet material 107 and the eighth sheet material 108. The thickness of each is large. Here, the seventh sheet material 107 and the eighth sheet material 108 (ie, the cover layer) may be formed by laminating respective sheets, each of which has the same properties as each of the sheets 101 to 106. One of the same thickness. In addition, the seventh sheet 107 and the eighth sheet 108 may have different thicknesses from each other. For example, the eighth sheet 108 may have a thickness larger than that of the seventh sheet 107. Here, the seventh sheet 107 and the eighth sheet 108 may be provided as magnetic sheets and formed by laminating at least two magnetic sheets. 2. Noise Filter Components

The noise filter part 2000 may include a plurality of coil patterns 210 to 260 (200) selectively disposed on the plurality of sheets 100, vertically connecting at least two coil patterns 200 to each other and having a conductive material filled therein. The holes 310 to 350 (300) of the material are the vertical connection lines 300a, 300b, and 300c, and the lead-out electrodes 410 to 460 (400) drawn from the coil pattern 200 and exposed to the outside of the sheet 100. That is, the coil patterns 210 to 260 (200) are respectively disposed on upper portions of the plurality of sheets 100. At least two coil patterns 200 in a lamination direction (ie, vertical direction) of the sheet 100 are connected to via holes 310 to 350 (300) (ie, vertical connection lines 300a, 300b, and 300c) filled with a conductive material therein. each other. Therefore, the plurality of (eg, two) coil patterns 200 connected to each other in the vertical direction are disposed on one noise filter part 2000. For example, three noise filter parts 2100, 2200, 2300 (2000) are laminated to be spaced apart from each other in a vertical direction. That is, at least three noise filter parts 2000 are provided in the lamination direction of the sheet 100. Here, the noise filter component 2000 may include a common mode noise filter that removes common mode noise. In addition, at least three noise filter parts 2000 are connected to the external electrode 300 located outside the laminated body 1000.

The first coil pattern 210 and the first lead-out electrode 410 are disposed on the first sheet 101. The second coil pattern 220, the hole 310 filled with the conductive material, and the second lead-out electrode 420 are disposed on the second sheet 102 above the first sheet 101. The third coil pattern 230, the holes 321 and 322 (320) spaced apart from each other and filled with a conductive material, and the third lead-out electrode 430 are disposed on the third sheet 230 above the second sheet 102. A fourth coil pattern 240, holes 331, 332, and 333 (330) spaced apart from each other and filled with a conductive material, and a fourth lead-out electrode 440 are disposed on the fourth sheet 104 above the third sheet 103. The fifth coil pattern 250, the holes 341 and 342 (340) spaced apart from each other and filled with a conductive material, and the fifth lead-out electrode 450 are disposed on the fifth sheet 105 above the fourth sheet 104. The sixth coil pattern 260, the hole 350 filled with the conductive material, and the sixth lead-out electrode 460 are disposed on the sixth sheet material 106 located above the fifth sheet material 105.

Each of the first to sixth coil patterns 210 to 260 (200) is rotated in a direction from a center region of each of the first to sixth sheets 101 to 106 to form a predetermined number of turns. For example, the first coil pattern is formed to rotate in one direction from a region corresponding to the hole 310 of the second sheet 102, and the second coil pattern 220 is formed to be spaced a predetermined distance from the hole 310 and in one direction The top is rotated from a region corresponding to the hole 321 of the third sheet 103. In addition, the third coil pattern 230 is formed to be spaced apart from the holes 321 and 322 spaced apart from each other and rotated in one direction from a region corresponding to the holes 331 of the fourth sheet 104, and the fourth coil pattern 240 may be The holes 333 formed in one area corresponding to the holes 310 of the second sheet 102 and the holes 322 of the third sheet 103 are rotated in one direction. In addition, the fifth coil pattern 250 may be formed to rotate in one direction from a hole 342 defined in an area corresponding to the hole 332 of the fourth sheet 104, and the sixth coil pattern 260 may be formed to be in one direction The hole 350 defined in the area corresponding to the hole 341 of the fifth sheet 105 is rotated. In addition, the coil pattern 200 may be formed to have a predetermined number of turns, for example, 2 to 20 turns. Here, at least one of the coil patterns 200 may have a different number of turns. For example, each of the first coil pattern 210, the third coil pattern 230, and the fifth coil pattern 250 may be 3 to 20 turns, and the second coil pattern 220, the fourth coil pattern 240, and the sixth coil Each of the patterns 260 may be 2.5 to 18 turns. That is, the number of turns of each of the first coil pattern 210, the third coil pattern 230, and the fifth coil pattern 250 may be equal to or greater than that in the second coil pattern 220, the fourth coil pattern 240, and the sixth coil pattern 260. The number of turns for each of them. In addition, the coil pattern 220 may have a predetermined line width and a predetermined line distance and may have a spiral shape that rotates outward in at least one of a clockwise direction and a counterclockwise direction. Here, each of the coil patterns 200 may have a line width equal to or different from each other and a line distance equal to or different from each other. That is, the line distances of the same coil pattern 200 may be different from each other according to the number of turns of the coil pattern 200. In addition, the rotation directions of the coil patterns 200 may be different from each other. For example, the first coil pattern 210, the third coil pattern 230, and the fifth coil pattern 250 can be rotated in a counterclockwise direction, and the second coil pattern 220, the fourth coil pattern 240, and the sixth coil pattern 260 can be rotated in a clockwise direction. Rotate in the clockwise direction. However, all of the coil patterns 200 may be rotated in the same direction (ie, clockwise or counterclockwise). The coil pattern 200 may have various shapes such as a linear shape or a curved shape in addition to the spiral shape. That is, in the noise filter part 2000 according to the exemplary embodiment, the plurality of conductive patterns may be vertically connected to each other. In addition, at least one of the plurality of conductive patterns may have a spiral shape, and at least another one may have a shape different from the spiral shape. In addition, although not shown, a magnetic core structure may be formed in at least one of the coil patterns 300. That is, a magnetic material is filled into a central portion of the sheet 100 to form a magnetic core, and at this time, the coil pattern 300 may surround the magnetic core.

The coil pattern 200 may be connected to the lead-out electrodes 410 to 460 (400) drawn in an outward direction of the sheet 100. The first lead-out electrode 410 connected to the first coil pattern 210 may be exposed to a predetermined area on one long side of the first sheet 101. The second lead-out electrode 420 connected to the second coil pattern 220 may be exposed to one long side of the second sheet 102 and spaced apart from the first lead-out electrode 410. The third extraction electrode 430 connected to the third coil pattern 230 may be exposed to one long side of the third sheet 103 and spaced apart from the first extraction electrode 410 and the second extraction electrode 420. The fourth lead-out electrode 440 connected to the fourth coil pattern 240 may be exposed to the other long side of the fourth sheet 104 and to an area corresponding to the first lead-out electrode 410. The fifth lead-out electrode 450 connected to the fifth coil pattern 250 may be exposed to the other long side of the fifth sheet 105, spaced apart from the fourth lead-out electrode 440, and corresponds to the second lead-out electrode 420. The sixth lead-out electrode 460 connected to the sixth coil pattern 260 may be exposed to the other long side of the sixth sheet 106, spaced apart from the fourth lead-out electrode 440 and the fifth lead-out electrode 450 and correspond to the third lead-out electrode 430. The lead-out electrode 400 may have a width larger than that of the coil pattern 200. Preferably, the lead-out electrode 400 has a width smaller than or equal to the width of the external electrode 3000. Since the lead-out electrode 400 has a larger width than that of the coil pattern 200, the contact area between the lead-out electrode 400 and the external electrode 3000 can be increased, and therefore, the contact resistance between the lead-out electrode 400 and the external electrode 3000 can be reduced. .

As shown in FIGS. 7 and 8, the first coil pattern 210 and the fourth coil pattern 240 are connected to each other via a vertical connection line 300 a to constitute a first noise filter part 2100. That is, the fourth coil pattern 240 passes through the hole 333 defined in the fourth sheet 104 and filled with a conductive material, the hole 322 defined in the third sheet 103 and filled with a conductive material, and the second sheet. The material 102 is connected to the first coil pattern 210 with a hole 310 filled with a conductive material therein. The second coil pattern 220 and the fifth coil pattern 250 are connected to each other via a vertical connection line 300b to constitute a second noise filter part 2200. That is, the fifth coil pattern 250 passes through a hole 342 defined in the fifth sheet 105 and filled with a conductive material, a hole 332 defined in the fourth sheet 104 and filled with a conductive material, and a third sheet. The material 103 is connected to the second coil pattern 220 with a hole 321 filled with a conductive material therein. In addition, the third coil pattern 230 and the sixth coil pattern 260 are connected to each other via a vertical connection line 300c to constitute a third noise filter part 2300. That is, the sixth coil pattern 260 passes through the hole 350 defined in the sixth sheet 105 and filled with a conductive material, the hole 341 defined in the fifth sheet 105 and filled with a conductive material, and the fourth sheet. The material 104 is connected to the third coil pattern 230 with a hole 331 filled with a conductive material therein. However, the connection manner between the coil patterns spaced apart from each other can be changed in various forms. For example, as shown in FIG. 9, the third coil pattern 230 and the fourth coil pattern 240 may be connected to each other via a first vertical connection line 300 a, and the second coil pattern 220 and the fifth coil pattern 250 may be connected via a second The vertical line 300b is connected to each other, and the first coil pattern 210 and the sixth coil pattern 260 may be connected to each other via the third vertical connection line 300c to constitute a first noise filter part to a third noise filter part 2100, 2200, and 2300 (2000).

The first extraction electrode 410 connected to the first coil pattern 210 is connected to the first 1 external electrode 3110, and the fourth extraction electrode 440 connected to the fourth coil pattern 240 is connected to the second 1 external electrode 3210. In addition, the second extraction electrode 420 connected to the second coil pattern 220 is connected to the first and second external electrodes 3120, and the fifth extraction electrode 450 connected to the fifth coil pattern 250 is connected to the second 2 external electrode 3220. In addition, the third extraction electrode 430 connected to the third coil pattern 230 is connected to the first third external electrode 3130, and the sixth extraction electrode 460 connected to the sixth coil pattern 260 is connected to the second third external electrode 3230. Therefore, the first noise filter component 2100 is connected between the first 1 external electrode 3110 and the second 1 external electrode 3210, and the second noise filter component 220 is connected between the first 2 external electrode 3120 and the second 2 external electrode. 3220, and the third noise filter part 2300 is connected between the first third external electrode 3130 and the second third external electrode 3230.

The number of turns of each coil pattern constituting the first to third noise filter parts 2100, 2200, and 2300 may be the same or different from each other. Since the number of turns of each coil pattern 200 constituting the noise filter part 2000 is different from each other, one circuit protection device may have at least two impedance characteristics. External electrode

The external electrodes 3000 may be respectively disposed on two side surfaces of the laminated body 1000 facing each other. That is, when the laminated direction of the sheet 100 corresponds to the vertical direction (ie, the Z direction), the external electrodes 3000 may be disposed to face each other in a horizontal direction (ie, the Y direction) perpendicular to the vertical direction of the laminated body 1000. On both side surfaces. In addition, three external electrodes 3000 may be disposed on each of the two side surfaces. That is, two external electrodes 3000 may be disposed on each of the two side surfaces of each of the three noise filter parts 2100, 2200, and 2300. Here, the external electrodes 3110, 3120, and 3130 disposed on one side surface of the multilayer body 1000 are referred to as first external electrodes 3100, and the external electrodes 3210, 3220, and 3230 disposed on the other side surface are referred to as first Two external electrodes 3200. The external electrode 3000 may be connected to the first noise filter part to the third noise filter part 2100, 2200, and 2300 located in the multilayer body 1000 and then connected to one terminal and the other terminal (that is, outside the multilayer body 1000) , Signal input terminal and signal output terminal).

The first external electrode 3100 and the second external electrode 3200 extend to the top surface and the bottom surface of the laminated body 1000, respectively. That is, the first external electrode 3100 and the second external electrode 3200 may extend to two surfaces (ie, a top surface and a bottom surface) facing each other in the Z direction of the laminated body 1000. Therefore, each of the external electrodes 3000 may extend from a side surface to a top surface and a bottom surface of the laminated body 1000 and thus have, for example, a “ㄷ” shape.

The external electrode 3000 may include at least one layer. The external electrode 3000 may be made of a metal layer such as Ag, and at least one plating layer may be disposed on the metal layer. For example, the external electrode 3000 may be formed by laminating a copper layer, a nickel plating layer, a tin plating layer, or a tin / silver plating layer. In addition, the external electrode 3000 can be formed by, for example, mixing a multicomponent glass frit using 0.5% to 20% Bi ₂ O ₃ or SiO ₂ as a main component and a metal powder. Here, the mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to two surfaces of the laminated body 1000 facing each other. As described above, since the external electrode 3000 contains a glass frit, the adhesion between the external electrode 3000 and the laminated body 1000 can be improved, and the contact reaction between the lead-out electrode 400 and the external electrode 3000 can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be disposed on the conductive paste to form an external electrode 3000. That is, a metal layer containing glass may be provided, and the at least one plating layer may be disposed on the metal layer to form an external electrode 3000. For example, in the external electrode 3000, after forming a layer containing a glass frit and at least one of Ag and Cu, electroplating or electroless plating may be performed to sequentially form a nickel plating layer and a tin plating. Floor. Here, the tin-plated layer may have a thickness equal to or larger than the thickness of the nickel-plated layer. The external electrode 3000 may have a thickness of 2 to 100 micrometers. Here, the nickel plating layer may have a thickness of 1 to 10 micrometers, and the tin plating layer or tin / silver plating layer may have a thickness of 2 to 10 micrometers. 4. Surface modification components

The surface modification member 4000 may be disposed on at least a portion of a surface of the laminated body 1000. That is, the surface modification member 4000 may be disposed on the entire surface of the laminated body 1000 or only on a region that is in contact with the external electrode 3000 of the laminated body 1000. That is, the surface modification member 4000 disposed on a part of the surface of the multilayer body 1000 may be disposed between the multilayer body 1000 and the external electrode 3000. Here, the surface modification member 4000 may contact an extended area of the external electrode 3000. That is, the surface modification member 4000 may be disposed between a region of the external electrode 3000 extending to the top and bottom surfaces of the multilayer body 1000 and the multilayer body 1000. In addition, the surface modification member 4000 may have a length equal to or different from the length of the external electrode 3000 disposed on the surface modification member 4000. For example, the surface modification member 4000 may have an area corresponding to 50% to 150% of an area of the external electrode 3000 extending to a portion of the top surface and the bottom surface of the multilayer body 1000. That is, the surface modification member 4000 may have a size smaller than or larger than the size of the extended area of the external electrode 3000 or the same size as the external electrode 3000. Alternatively, the surface modification member 4000 may be disposed between the external electrodes 3000 disposed on the side surface of the laminated body 1000. The surface modification member 4000 may include a glass material. For example, the surface modification member 4000 may include a non-borosilicate glass (SiO ₂ -CaO-ZnO-MgO-based glass) capable of being plasticized at a predetermined temperature (for example, a temperature of 950 ° C. or lower). In addition, the surface modification member 4000 may further include a magnetic material. That is, when a region on which the surface modification member 4000 is to be disposed is set as a magnetic sheet, the surface modification member 4000 may partially contain a magnetic material to easily couple the surface modification member 4000 to the magnetic sheet. Here, the magnetic material may include, for example, a NiZnCu-based magnetic powder and is contained in a content of 1 to 15% by weight based on 100% by weight (wt%) of the glass material. At least a part of the surface modification member 4000 may be disposed on a surface of the laminated body 1000. Here, at least a part of the glass material may be uniformly distributed on the surface of the laminated body 1000 as shown in (a) of FIG. 10, or at least a part of the glass material may be as shown in (b) of FIG. 10. It is arranged non-uniformly to have sizes different from each other. Alternatively, the surface modification member 4000 may be continuously disposed on the surface of the laminated body 1000 to form a rod shape. Further, as shown in (c) of FIG. 10, a recessed portion may be formed in at least a part of the surface of the laminated body 1000. That is, a glass material may be provided to form the protruding portion, and at least a part of a region on which the glass material is not provided may be recessed to form the recessed portion. Here, the glass material may be formed at a predetermined height from the surface of the laminated body 1000, and therefore, at least a part of the surface modification member 4000 may be higher than the surface of the laminated body 1000. That is, at least a part of the surface modification member 4000 may be flush with the surface of the laminated body 1000, and at least a part of the surface modification member 4000 may be maintained higher than the surface of the laminated body 1000. As described above, the glass material may be distributed on a part of the region of the laminated body 1000 to form the surface modification member 4000 before the external electrode 3000 is formed. Therefore, the surface of the multilayer body 1000 may be modified, and the surface may have uniform resistance. Therefore, the shape of the external electrode can be controlled, and therefore, the external electrode can be easily formed. In order to form the surface modification member 4000 on a predetermined region of the surface of the laminated body 1000, a paste containing a glass material may be printed or applied to a predetermined region of a predetermined sheet. For example, a glass paste may be applied to six areas on the bottom surface of the seventh sheet 107 and six areas on the top surface of the eighth sheet 108 and then cured to form a surface modification member 4000. In addition, the glass paste may be applied to a predetermined area of a ceramic green sheet before the glass paste is cut into the same size as the laminated type device. That is, after the glass paste is applied to a plurality of regions of the ceramic green sheet, the green sheet including a portion on which the glass paste is formed may be cut along a cutting line in units of a laminated device and then Lamination is performed with a sheet on which a noise filter member is formed to manufacture the circuit protection device. Here, since the surface modification member 4000 is disposed on the edge of the laminated body 1000, the surface modified member 4000 can be cut in units of a laminated device for the area to which the glass paste is applied.

The surface modification member 4000 may be formed using an oxide. That is, the surface modification member 4000 may be formed using at least one of a glass material and an oxide and further includes a magnetic material. Here, in the surface modification member 4000, the oxide having a crystalline state or an amorphous state may be distributed to be scattered on the surface of the laminated body 1000. Here, at least a part of the oxide distributed on the surface may be melted. Here, the oxide may be formed as shown in (a) to (c) in FIG. 10. Further, even when the surface modification member 4000 is made of an oxide, each of the oxides may be spaced apart from each other and thus be distributed in an island shape, and further, the oxide may have a rod shape on at least one region. Here, the at least one oxide in a particle shape or in a molten state may include, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ At least one of BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ .

As described above, according to the exemplary embodiment, the plurality of coil patterns 200 are formed in a laminated body 1000 in which the plurality of sheets 100 are laminated, and at least two coil patterns 200 are connected to each other to form one noise. Filter assembly 2000. In addition, at least three noise filter components 2000 may be implemented in the laminated body 1000. In addition, the plurality of noise filter components 2000 may be connected to the plurality of external electrodes 3000 disposed outside the laminated body 1000 and then disposed between signal lines. Therefore, the common mode noise generated from the three signal lines and the common mode noise generated between each of the two signal lines can be removed at the same time, and therefore, the noise filter part can be applied to C -PHY.

In addition, since the glassy layer is not formed on the entire surface, the thickness of the device can be reduced, and therefore, as the size of the device is reduced, the circuit protection device and the mounting area and height can be reduced. Small electronic devices are mounted accordingly. In addition, since the glassy layer is not formed on the entire surface, absorption of moisture can be suppressed, and therefore, the reliability of the device is improved. When the size of the device is reduced, the area of the external electrode may be reduced so that the adhesion between the external electrode and the laminate is reduced. Therefore, although the adhesive strength is reduced when mounted on a printed circuit board, the adhesive strength between the external electrode and the laminated body can be increased to increase the adhesive strength.

FIG. 11 is a projection plan view of a circuit protection device according to another exemplary embodiment, FIG. 12 is a perspective view, and FIG. 13 is a circuit diagram. According to another exemplary embodiment, a capacitor including at least one internal electrode is disposed between at least some regions of the plurality of noise filter parts 2000. That is, according to another exemplary embodiment, a capacitor may be disposed in at least one noise filter part 2000 as shown in FIGS. 11 and 12, and the plurality of noise filters as shown in FIG. 3. A capacitor may be disposed in each of the device components 2000.

11 to 13, a circuit protection device according to another exemplary embodiment may include a laminated body 1000 in which a plurality of sheets 100 are laminated, and at least three of the laminated bodies 1000 each including a plurality of coil patterns 200 are provided. Noise filter parts 2100, 2200, and 2300 (2000), external electrodes 3100 and 3200 (3000) placed on two side surfaces of the laminated body 1000 facing each other and connected to the noise filter part 2000 and settings At least one internal electrode 500 (510 and 520) on a predetermined area in the laminated body 1000.

That is, in the protective circuit device according to another exemplary embodiment, at least two internal electrodes 510 and 520 are disposed to partially overlap each other in the laminated body 1000, where there is between the internal electrode 510 and the internal electrode 520 At least one capacitor. For example, two sheets 109 and 110 are disposed between the sixth sheet 106 and the eighth sheet 108, and internal electrodes 510 and 520 each having a predetermined shape are on each of the sheets 109 and 110 It is arranged to at least partially overlap each other to form the capacitor. That is, the capacitor may be formed of the first and second internal electrodes 510 and 520 and the tenth sheet 110 disposed between the first and second internal electrodes 510 and 520. Here, the at least two internal electrodes 510 and 520 may be connected to at least one of a first external electrode 3100 and a second external electrode 3200 respectively disposed on the two side surfaces of the laminated body 1000 facing each other. By. For example, the first internal electrode 510 may be connected to the first 3 external electrode 3130, and the second internal electrode 520 may be connected to the second 2 external electrode 3220. Here, at least one of the external electrodes 3000 may be connected to a ground terminal. For example, the first 3 external electrodes 3130 may be connected to a ground terminal. In order to connect at least one of the first internal electrode 510 and the second internal electrode 520 to the ground terminal, a third external electrode (not shown in the figure) may be disposed outside the laminated body 1000. That is, at least one of the first and second internal electrodes 510 and 520 may be connected to the third external electrode, but may not be connected to the first and second external electrodes 3100 and 3200. Here, the third external electrode may be disposed on two surfaces of the laminated body 1000 on which the first external electrode 3100 and the second external electrode 3200 face each other, and connected to the ground terminal. Therefore, in this case, one of the first internal electrode 510 and the second internal electrode 520 may be connected to the ground terminal via the third external electrode. The capacitor may be disposed between the coil patterns 200. For example, although not shown, the capacitor may be disposed between the third coil pattern 230 and the fourth coil pattern 240. To this end, at least one sheet may be further disposed between the third sheet 130 and the fourth sheet 140 on which the third coil pattern 230 and the fourth coil pattern 240 are respectively disposed, and at least one sheet may be disposed thereon. At least one internal electrode to reach the capacitor. For example, the sheets 109 and 110 on which the internal electrodes 500 are respectively disposed may be disposed between the third sheet 130 and the fourth sheet 140 to form the capacitor. In addition, a sheet having an internal electrode disposed thereon may be disposed between the coil patterns 200. Here, when a sheet is further disposed and an internal electrode is disposed, the capacitor may be disposed between the internal electrode and the upper coil pattern and between the internal electrode and the lower coil pattern. That is, the capacitor may be disposed between coil patterns adjacent to each other with an internal electrode and a sheet therebetween. As another option, at least two internal electrodes 500 may be respectively disposed on at least two regions between the coil patterns 200 to form at least two capacitors in the laminated body 1000. Here, the internal electrode 500 for forming a capacitor may have various shapes. In addition, a hole in which a conductive material is filled must be formed in a sheet on which the internal electrode 500 is disposed to connect the coil patterns 200 to each other, and in addition, the internal electrode 500 may be disposed to be electrically conductive with the inside filled with The holes of the material are spaced a predetermined distance apart. Therefore, at least one capacitor may be disposed in the multilayer body 1000. For example, as shown in FIG. 13, the capacitor may be disposed in each of the noise filters.

As described above, in the circuit protection device according to another exemplary embodiment, the number of turns of the coil pattern 200, the area of the internal electrode 500 of the capacitor, and the distance between each coil pattern 200 (that is, in the sheets 102 to 106) The thickness of each) can be adjusted to control the inductance and capacitance, thereby controlling the frequency to suppress noise. For example, if the thickness of each of the sheets 102 to 106 is reduced, noise in a low frequency band can be suppressed. If the thickness of each of the sheets 102 to 106 is increased, noise in a high frequency band can be suppressed. As described above, the circuit protection device composed of three noise filter parts 2000 and one capacitor (ie, a common mode noise filter) can suppress noise in at least two frequency bands. Therefore, the circuit protection device according to another exemplary embodiment can suppress noise in at least two frequency bands, and therefore, can be used in a portable electronic device such as a smart phone in which various frequencies are used to improve the electronic Device quality.

A circuit protection device according to another exemplary embodiment may have a structure in which an overvoltage protection component is coupled to protect an electronic device from an overvoltage (for example, the plurality of noise filter components 2000) and electrostatic discharge (ESD). That is, at least three noise filter components 2000 and the overvoltage protection component may be coupled to each other to achieve the circuit protection device. A circuit protection device according to still another exemplary embodiment will be explained with reference to FIGS. 14 and 15. FIG. 14 is a perspective view of a circuit protection device according to still another exemplary embodiment, and FIG. 15 is an exploded perspective view.

14 and 15, a circuit protection device according to still another exemplary embodiment may include at least three noise filter parts 2100, 2200, and 2300 (2000) including a plurality of coil patterns 200, respectively, disposed on the laminated body 1000. A first external electrode 3100 and a second external electrode 3200 on two side surfaces facing each other and connected to the at least three noise filter parts 2000, an overvoltage protection part 5000 disposed in the laminated body 1000, and The third external electrode 3300 is spaced apart from the first external electrode 3100 and the second external electrode 3200, is disposed on two side surfaces of the laminated body 1000 facing each other, and is connected to the overvoltage protection member 5000. Here, the third external electrode 3300 may be disposed on a side surface of the multilayer body 1000 on which the first external electrode 3100 and the second external electrode 3200 are disposed. For example, the first external electrode 3100 and the second external electrode 3200 may be disposed on two side surfaces facing each other in the Y direction of the multilayer body 1000, and the third external electrode 3300 may be disposed on the multilayer body 1000 On two side surfaces facing each other in the X direction. That is, in the circuit protection device according to still another exemplary embodiment, the at least three noise filter parts 2000 each including the plurality of coil patterns 200 may be connected to the first external electrode 3100 and the second external The electrode 3200 and the overvoltage protection member 5000 may be disposed in the laminated body 1000 to be spaced apart from the noise filter member 2000 and connected to the third external electrode 3300. Although not shown, a capacitor including at least one internal electrode according to another exemplary embodiment may be applied to the further exemplary embodiment.

The overvoltage protection member 5000 can be formed by laminating at least two sheets 111 and 112 in which the extraction electrodes 471 to 476 and 480 and the holes 361 to 366 are selectively formed. Here, the sheets 111 and 112 may be disposed between the first sheet 101 and the seventh sheet 107 (ie, the first sheet 101 and the lower cover layer). Alternatively, the sheets 111 and 112 may be disposed between the sixth sheet 106 and the eighth sheet 108 (ie, the sixth sheet 106 and the upper cover layer). Each of the sheets 111 and 112 may have a rectangular plate shape having the same thickness and shape as each of the sheets 100 constituting the noise filter part 2000. Further, each of the sheets 111 and 112 may be provided as a non-magnetic sheet or a magnetic sheet. For example, the sheets 101 to 106 constituting the noise filter part 2000 may be provided as non-magnetic sheets, and used as the seventh and eighth sheets 107 and 108 of the lower cover layer and the upper cover layer and the constitution The sheets 111 and 112 of the overvoltage protection member 5000 may be provided as a magnetic sheet.

A plurality of lead-out electrodes 471 to 476 (470) are disposed on the top surface of the sheet 112. The plurality of extraction electrodes 470 may be disposed at the same positions as the extraction electrodes 410 to 460 of the plurality of noise filter parts 2000 connected to the first external electrode 3100 and the second external electrode 3200. Therefore, the lead-out electrode 471 may be connected to the first 1st external electrode 3110, the lead-out electrode 422 may be connected to the first 2nd external electrode 3120, and the lead-out electrode 473 may be connected to the first 3rd external electrode 3130. In addition, the extraction electrode 474 may be connected to the second first external electrode 3210, the extraction electrode 475 may be connected to the second second external electrode 3220, and the extraction electrode 476 may be connected to the second third external electrode 3230. In addition, the plurality of holes 361 to 366 may be defined in the sheet 112. The plurality of holes 361 to 366 may be respectively defined in respective ends of the plurality of extraction electrodes 471 to 476. In addition, each of the plurality of holes 361 to 366 may be filled with an overvoltage protection material. The overvoltage protection material may include at least one conductive material selected from Ru, Pt, Pd, Ag, Au, Ni, Cr, W, and Fe, and, for example, polyvinyl alcohol (PVA) or polyvinyl butyral (Polyvinyl butyral, PVB) and other organic materials. In addition, the overvoltage protection material can be formed by further mixing a material such as ZnO or an insulating ceramic material such as Al ₂ O ₃ with the above-mentioned mixed material. Alternatively, various materials other than the above-mentioned materials may be used as the overvoltage protection material. For example, the overvoltage protection material may use at least one of a porous insulation material and a void. That is, a porous insulating material may be filled into or applied to the hole, and the void may be formed in the hole. In addition, a mixed material formed of a porous insulating material and a conductive material may be filled into the holes or applied to the holes. In addition, the porous insulating material, the conductive material, and the void may be formed to form a layer within the hole. For example, a porous insulating layer may be formed between the conductive layers, and a gap may be formed between the insulating layers. Here, the void may be formed by connecting a plurality of pores in the insulating layer to each other. Here, as the porous insulating material, a ferroelectric ceramic having a dielectric constant of approximately 50 to approximately 50,000 may be used. For example, the insulating ceramic may include a multilayer ceramic capacitor (MLCC), ZrO, ZnO, BaTiO ₃ , Nd ₂ O5, BaCO ₃ , TiO ₂ , Nd, Bi, Zn, and Al ₂ O _3. Forming a mixture of at least one of the dielectric material powders. The porous insulating material may have a porous structure in which a plurality of pores are formed to have a porosity of 30% to 80%, and each of the plurality of pores has an approximate 1 nm (Nm) to approximately 5 microns. Here, the shortest distance between the pores may be approximately 1 nanometer to approximately 5 micrometers. In addition, a conductive material used as an overvoltage protection material may be formed using a conductive ceramic. As the conductive ceramic, a mixture containing at least one of La, Ni, Co, Cu, Zn, Ru, and Bi can be used. The inside of each of the plurality of holes 361 to 366 may be maintained as a hollow space, and the hollow space may be used as the overvoltage protection member.

The sheet 111 may be disposed below the sheet 112, and the lead-out electrode 480 may be disposed above the sheet 112. The lead-out electrode 480 may be disposed to be exposed from one side of the sheet 195 to the other side facing the one side. That is, the lead-out electrodes 480 may be disposed to be exposed to a side perpendicular to the side through which the lead-out electrodes 471 to 476 disposed on the sheet 112 pass, and the lead-out electrodes 471 to 476 pass through the side through which Exposed. The lead-out electrode 480 is connected to the third external electrodes 3310 and 3320 (3330) disposed on two side surfaces of the laminated body 1000 facing each other. In addition, a predetermined area of the lead-out electrode 480 may be connected to the holes 361 to 366 of the sheet 111. For this reason, each portion of the lead-out electrode 480 connected to the holes 361 to 366 may have a width larger than that of each other region.

In addition, a sheet (not shown) may be placed on the sheet 112. The sheet (not shown in the figure) may be provided for separating the noise filter part 2000 from the overvoltage protection part 5000 and the sheet (not shown in the figure) has a noise filtering function. The thickness at which the interference between the device component 2000 and the overvoltage protection component 5000 is suppressed. The sheet (not shown) may be formed by laminating a plurality of sheets, each of the plurality of sheets having the same properties as each of the sheets 111 and 112. thickness.

As described above, in the circuit protection device in which the plurality of noise filter parts 2000 and the overvoltage protection part 5000 are combined with each other according to still another exemplary embodiment, the first external electrode 3100 and the second external electrode 3200 It can be connected between the signal input terminal used in the electronic device and the system, and the third external electrode 3300 can be connected to the ground terminal to remove common mode noise and allow, for example, static electricity to be introduced into the input / output terminals. A voltage can flow to the ground terminal. That is, when the overvoltage protection member 5000 is connected to the ground terminal between the input terminal and the output terminal and further applies an undesired voltage larger than a predetermined voltage between both ends of the circuit protection device, the overvoltage protection A discharge may occur between the conductive particles of the material to enable current to flow to the ground terminal and reduce the voltage difference between the two ends of the corresponding circuit protection device. For example, in the overvoltage protection member 5000, the overvoltage protection material filled into the holes 361 to 366 may exist in a state where a conductive material and a porous insulating material are mixed with each other at a predetermined ratio. That is, there are conductive particles between the insulating materials. When a voltage smaller than a predetermined voltage is applied to the lead-out electrodes 471 to 476, the insulation state can be maintained. On the other hand, when a voltage greater than a predetermined voltage is applied to the lead-out electrodes 471 to 476, a discharge may occur between the conductive particles so that the voltage difference between the corresponding lead-out electrodes 471 to 476 is reduced. Here, since the two ends of the circuit protection device are not electrically connected to each other, the input signal can be transmitted to the input / output terminal as it is without signal distortion. That is, in the circuit protection device, the corresponding static electricity may be discharged to ground via the corresponding circuit protection device to protect the circuit and keep the signals received from or transmitted to the system as they are.

16 to 20 are diagrams for explaining a circuit protection device according to still another exemplary embodiment. That is, FIG. 16 is a circuit diagram, FIGS. 17 and 19 are schematic projection plan views according to still another exemplary embodiment, and FIGS. 18 and 20 are partially exploded perspective views.

As shown in FIG. 16, a capacitor is disposed in each of three lines (ie, three input lines and output lines) connected to the circuit protection device. When the same capacitance is achieved by the ground terminal as described above, the differential signal can pass through the capacitor regardless of the existence of the capacitance. However, the capacitor may filter only the common mode. To this end, the capacitor may be connected to all input terminals and output terminals or to only one of the input terminals and the output terminals. Specifically, as shown in FIG. 17 and FIG. 18, the plurality of internal electrodes 511, 512, 513, 521, 522, and 523 connected to the first external electrode 3100 and the second external electrode 3200, respectively, may be provided and connected. To the common electrode 530 of the third external electrode 3300 located above or below the internal electrode. Here, the plurality of internal electrodes 511, 512, 513, 521, 522, and 523 may be spaced apart from each other to overlap the common electrode 530 over a predetermined area. In addition, according to an exemplary embodiment, a sheet 113 may be provided on which the common electrode 530 is disposed above or below the sheet 114 on which the internal electrodes 511, 512, 513, 521, 522, and 523 are disposed, The sheets 113 and 114 may be disposed in the laminated body 1000. For example, the sheets 113 and 114 may be disposed between the noise filter part 2000 and the upper cover layer (ie, the eighth sheet 108) according to the foregoing exemplary embodiment. Alternatively, the sheets 113 and 114 may be provided in place of a sheet on which an internal electrode is disposed according to another exemplary embodiment (ie, the sheets 109 and 110 shown in FIG. 12). Therefore, a capacitor can be achieved between the internal electrodes 511, 512, 513, 521, 522, and 523 and the common electrode 530. In addition, the capacitor can be achieved together with an overvoltage protection component.

In addition, as shown in FIG. 18, the common electrodes 511, 512, and 513 connected to the first external electrode 5100, the common electrodes disposed under the internal electrodes 511, 512, and 513 and connected to the third external electrode 6300 may be provided, respectively. 530 and internal electrodes 521, 522, and 523 disposed below the common electrode 530 and connected to the second internal electrode 5200, respectively. That is, the internal electrode 510, the common electrode 530, and the internal electrode 520 may be laminated. Here, the internal electrode 510 and the internal electrode 520 may overlap each other and also overlap the common electrode 530. In addition, the internal electrodes 511, 512, and 513 may be disposed on the predetermined sheet 115, the common electrode 530 may be disposed on the predetermined sheet 114, and the internal electrodes 521, 522, and 523 may be disposed on the predetermined sheet 113, and then, The sheets 113, 114, and 115 can be laminated. In addition, according to an exemplary embodiment, the sheets 113, 114, and 115 may be provided in the laminated body 1000. For example, the sheets 113, 114, and 115 may be disposed between the noise filter part 2000 and the upper cover layer (ie, the eighth sheet 108) according to the aforementioned exemplary embodiment. Alternatively, the sheets 113, 114, and 115 may be provided in place of a sheet on which an internal electrode is disposed according to another exemplary embodiment (ie, sheets 109 and 110 shown in FIG. 12). Therefore, a capacitor can be achieved between the internal electrodes 511, 512, 513, 521, 522, and 523 and the common electrode 530. In addition, the capacitor can be achieved together with an overvoltage protection component.

21 and 22 are a circuit diagram of a circuit protection device capable of removing common mode noise and a waveform diagram of the common mode noise according to an exemplary embodiment.

(A) in FIG. 21 is a circuit diagram of a circuit protection device in which each noise filter part is respectively provided in three signal lines according to an exemplary embodiment. That is, (a) in FIG. 21 is a circuit diagram of a circuit protection device in which three noise filter parts are provided in a laminated body according to an exemplary embodiment. In addition, (b) in FIG. 21 is a waveform diagram of common mode noise when a circuit protection device is not applied and when the circuit protection device is applied according to an exemplary embodiment. Here, reference number 20 represents a common mode noise component when a circuit protection device is not applied, and reference number 30 represents a common mode noise component when the circuit protection device is applied. As shown in the figure, when the circuit protection device is not applied, the common mode noise component can be significantly increased, and when the circuit protection device is applied, the common mode noise component can be significantly reduced.

(A) in FIG. 22 is a circuit diagram of a circuit protection device in which a noise filter part and a capacitor are disposed in three signal lines according to another exemplary embodiment. That is, (a) in FIG. 22 is a circuit diagram of a circuit protection device according to an exemplary embodiment in which three noise filter parts are provided in a laminated body and a capacitor is disposed between each of the noise filter parts. . In addition, (b) in FIG. 22 is common mode noise when a circuit protection device is not applied (see reference number 40) and when the circuit protection device is applied (see reference number 50) according to an exemplary embodiment. Wave chart. As shown in the figure, when a circuit protection device is applied, the common mode noise component can be significantly reduced. In addition, the common mode noise can be removed by a combination of various inductors, capacitors, and common mode filters in addition to the above circuits.

According to the present invention, the plurality of coil patterns may be formed in a laminated body in which the plurality of sheets are laminated, and at least two coil patterns may be connected to each other to form one noise filter part. In addition, at least three noise filter components can be achieved in the multilayer body. That is, the at least three noise filter components may be provided in the laminated body. In addition, the plurality of noise filter components may be connected to the plurality of external electrodes formed outside the laminated body and disposed in the three signal lines. Therefore, the common mode noise generated from the three signal lines and the common mode noise generated between each of the two signal lines can be removed at the same time, and therefore, the noise filter part can be applied to C- PHY.

In addition, since the glassy layer is not formed on the entire surface, the thickness of the device can be reduced, and therefore, as the size of the device is reduced, the circuit protection device and the mounting area and height can be reduced. Small electronic devices are mounted accordingly. In addition, since the glassy layer is not formed on the entire surface, absorption of moisture can be suppressed, and therefore, the reliability of the device is improved.

When the size of the device is reduced, the area of the external electrode may be reduced so that the adhesion between the external electrode and the laminate is reduced. Therefore, although the adhesive strength is reduced when mounted on a printed circuit board, the adhesive strength between the external electrode and the laminated body can be increased to increase the adhesive strength.

The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In addition, the present invention is defined only by the scope of the patent application.

11‧‧‧ first signal

12‧‧‧ second signal

13‧‧‧ third signal

20‧‧‧ Common mode noise component when no circuit protection device is applied

40‧‧‧ Waveform diagram of common mode noise when no circuit protection device is applied

30‧‧‧ Common mode noise component when the circuit protection device is applied

50‧‧‧ Waveform diagram of common mode noise when the circuit protection device is applied

100, 109, 111, 112‧‧‧ sheets

101‧‧‧sheet / first sheet

102‧‧‧sheet / second sheet

103‧‧‧sheet / third sheet

104‧‧‧sheet / fourth sheet

105‧‧‧sheet / fifth sheet

106‧‧‧ Sheet / Sixth Sheet

107‧‧‧ Sheet / Seventh Sheet

108‧‧‧sheet / eighth sheet

110‧‧‧sheet / tenth sheet

113, 114, 115‧‧‧ sheets / predetermined sheets

200‧‧‧ coil pattern

210‧‧‧coil pattern / first coil pattern

220‧‧‧coil pattern / second coil pattern

230‧‧‧coil pattern / third coil pattern

240‧‧‧coil pattern / fourth coil pattern

250‧‧‧coil pattern / fifth coil pattern

260‧‧‧coil pattern / sixth coil pattern

300a‧‧‧vertical cable / first vertical cable

300b‧‧‧Vertical Cable / Second Vertical Cable

300c‧‧‧Vertical Cable / Third Vertical Cable

310, 311, 312, 321, 322, 323, 331, 332, 333, 341, 342, 350, 361, 362, 363, 364, 365, 366‧‧‧ holes

400, 471, 472, 473, 474, 475, 476, 480‧‧‧ lead-out electrodes

410‧‧‧ lead-out electrode / first lead-out electrode

420‧‧‧ lead-out electrode / second lead-out electrode

430‧‧‧ lead-out electrode / third lead-out electrode

440‧‧‧ lead-out electrode / fourth lead-out electrode

450‧‧‧ lead-out electrode / fifth lead-out electrode

460‧‧‧ lead-out electrode / sixth lead-out electrode

500, 511, 512, 513, 521, 522, 523‧‧‧ internal electrodes

510‧‧‧internal electrode / first internal electrode

520‧‧‧Internal electrode / Second internal electrode

530‧‧‧Common electrode

1000‧‧‧Laminates / Frames

2000‧‧‧ Noise Filter Parts

2100‧‧‧Noise Filter Unit / First Noise Filter Unit

2200‧‧‧Noise Filter Unit / Second Noise Filter Unit

2300‧‧‧Noise Filter Unit / Third Noise Filter Unit

3000‧‧‧External electrode / piezoelectric vibration member

3100‧‧‧External electrode / First external electrode

3110‧‧‧External electrode / 1st external electrode

3120‧‧‧External electrode / First 2 external electrode

3130‧‧‧External electrode / First 3 external electrodes

3200‧‧‧External electrode / Second external electrode

3210‧‧‧External electrode / Second 1 external electrode

3220‧‧‧External electrode / Second 2 external electrode

3230‧‧‧External electrode / second 3 external electrode

3300, 3310, 3320‧‧‧ Third external electrode

4000‧‧‧wiring department / surface modification member

5000‧‧‧ overvoltage protection parts

A, B, C‧‧‧ Common mode noise

A-A’‧‧‧ line

X, Y, Z‧‧‧ directions

Exemplary embodiments can be understood in more detail by reading the following description in conjunction with the accompanying drawings, in which: Figures 1 to 4 are waveform diagrams of signals under ideal signal and ideal delay conditions. 5 to 10 are diagrams for explaining a circuit protection device according to an exemplary embodiment. 11 to 13 are diagrams for explaining a circuit protection device according to another exemplary embodiment. 14 and 15 are diagrams for explaining a circuit protection device according to still another exemplary embodiment. 16 to 20 are diagrams for explaining a circuit protection device according to still another exemplary embodiment. 21 and 22 are circuit diagrams and waveform diagrams of common mode noise of a circuit protection device according to an exemplary embodiment.

Claims (11)

A circuit protection device includes: a laminated body having a plurality of sheets laminated therein, wherein a conductive pattern is selectively provided on the plurality of sheets; at least three noise filter parts spaced from each other in the laminated body And each including a plurality of coil patterns; and a surface modifying member disposed on an outer surface of the laminated body, wherein the surface modifying member is formed so that a granular insulation is distributed on the outer surface of the laminated body Material, at least a part of the granular insulating material is spaced a predetermined distance from each other, and the surface modification member is formed on the entire surface of the laminated body including a region between the entire external electrode and the laminated body. The circuit protection device according to item 1 of the scope of patent application, further comprising an external electrode disposed outside the laminated body and connected to the at least three noise filter components, wherein the circuit protection The device is disposed in three signal lines to remove common mode noise of each of the three signal lines and remove common mode noise between two of the three signal lines. The circuit protection device according to item 2 of the scope of patent application, wherein the at least three noise filter parts are disposed to be spaced apart from each other by a predetermined distance in a lamination direction of the sheet. The circuit protection device according to item 3 of the scope of patent application, wherein each of the noise filter components includes: the plurality of coil patterns respectively disposed on the plurality of sheets; a plurality of vertical A connecting wire disposed on at least two of the sheets to connect at least two of the coil patterns to each other; and a plurality of lead-out electrodes that are led out from each of the plurality of coil patterns and are connected to The external electrode. The circuit protection device according to item 3 of the scope of patent application, wherein at least one of the noise filter components is different in the number of turns of the coil pattern. The circuit protection device according to item 3 of the scope of patent application, wherein at least one of the noise filter components further includes a magnetic core disposed at a center of each of the coil patterns. The circuit protection device according to item 2 of the scope of patent application, further comprising at least one capacitor disposed in the laminated body. The circuit protection device according to item 1 or item 7 of the scope of patent application, further comprising at least one overvoltage protection component disposed in the laminated body. The circuit protection device according to item 8 of the scope of patent application, wherein the sheet on which the noise filter member is placed is a non-magnetic sheet, and the sheet on which the overvoltage protection member is placed It is a magnetic sheet. The circuit protection device according to item 2 of the scope of patent application, wherein each of the external electrodes extends to at least one of the uppermost sheet and the lowermost sheet of the laminate, And the surface modification member is disposed at least between the extension region of the external electrode and the laminated body. The circuit protection device according to item 10 of the scope of patent application, wherein at least a part of the surface modification member is discontinuously or continuously disposed.