KR20050023355A - Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape - Google Patents

Abstract

The present invention is a method of connecting an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, on which an adhesive for electrode connection is applied to a substrate, wherein one adhesive tape The end part of is inverted, the adhesive face of one adhesive tape and the adhesive face of the other adhesive tape are overlapped, and the overlapped portions of the adhesive tape are heated and pressed together. According to this invention, since the end part of the adhesive tape which unwinding was completed using the adhesive agent of an adhesive tape, and the start end part of a newly attached adhesive tape are adhere | attached, and an adhesive material reel is replaced, a winding tape is changed every time a new adhesive tape is replaced. No need for replacement of the adhesive tape or the installation of the new adhesive tape beginning on the winding reel, so that the replacement time of the new adhesive reel is reduced, and the production efficiency of the electronic device is increased.

Description

Adhesive tape, its connecting method, manufacturing method, crimping method, adhesive tape reel, adhesive device, adhesive tape cassette, adhesive bonding method using this, and anisotropic conductive tape {ADHESIVE MATERIAL TAPE, METHOD OF CONNECTING, PRODUCING, AND PRESS-CONNECTING THE TAPE, ADHESIVE MATERIAL-TAPE REEL, ADHERING DEVICE, ADHESIVE AGENT-TAPE CASSETTE, METHOD OF PRESS-CONNECTING ADHESIVE AGENT USING THE CASSETTE, AND ANISOTROPIC ELECTROCONDUCTIVE TAPE}

The present invention provides an adhesive tape for electrically connecting electronic components and a circuit board or circuit boards and electrically connecting both electrodes, a connecting method thereof, a manufacturing method, a pressing method, an adhesive tape reel, an adhesive apparatus, The present invention relates to an adhesive tape cassette and an adhesive method using the same, in particular an adhesive tape wound in a reel shape, a connecting method, a manufacturing method, a pressing method, an adhesive tape reel, an adhesive device, an adhesive tape cassette, and an adhesive pressing method using the same. And an anisotropic conductive tape.

Generally, as a means for adhesively fixing electronic components such as liquid crystal panels, plasma display panels (PDPs), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards, and electrically connecting the electrodes. Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as an "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is mounted. Then, the adhesive is pressed on a circuit board or the like with a heating press head on the substrate side of the adhesive tape unwound from the adhesive reel, and the remaining substrate is wound on the winding reel.

Then, when the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. .

With the recent increase in the size of panel screens in PDPs and the like, the adhesive area (or dimensions of one side) of a circuit board has increased, and the amount of adhesive used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, there is a problem that the frequency of replacement of the adhesive material reel increases, and since the exchange of the adhesive material reel takes much time, the production efficiency of the electronic device cannot be improved.

In response to this problem, it is considered to increase the amount of adhesive per reel and to reduce the reel replacement frequency by increasing the number of turns of the adhesive tape wound on the reel, but the tape width of the adhesive tape is 1 to 3 mm. Because it is narrow, if the number of turns is increased, there is a fear that the wound may be disturbed. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape and cause blocking.

Furthermore, when the number of turns of the adhesive tape is increased, the diameter of the reel also increases, and it is difficult to attach to the existing adhesive device, and there is a possibility that the existing adhesive device cannot be used.

1: is a perspective view which shows the connection of adhesive material reels in the connection method of the adhesive material tape which concerns on 1st Embodiment.

2A and 2B are perspective views illustrating a connection process of the connection portion in FIG. 1.

3 is a schematic view showing a pressing process of an adhesive agent in the bonding apparatus.

4 is a cross-sectional view showing adhesion of circuit boards.

5 is a flowchart showing a method for producing an adhesive tape.

6 is a perspective view illustrating a method for connecting an adhesive tape in a second embodiment of the present invention.

It is a perspective view which shows the connection method of an adhesive tape in the modified example of 2nd Embodiment of this invention.

8A to 8C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 8A is a perspective view showing the connection between the adhesive material reels, and FIG. 8B is a connection method of the connection portion in FIG. 8A. 8C is a plan view of the connecting portion in FIG. 8A.

9 is a cross-sectional view showing a connection method of an adhesive tape in a second embodiment of the present invention.

It is sectional drawing which shows the connection method of an adhesive tape in 3rd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 4th Embodiment of this invention.

12A and 12B are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 12A is a perspective view showing the connection between the adhesive material reels, and FIG. 12B is a connection method of the connection portion in FIG. 12A. It is a perspective view showing.

It is sectional drawing which shows the connection method of an adhesive tape in 2nd Embodiment of this invention.

14A and 14B are sectional views showing the connection method of the adhesive tape in the third embodiment of the present invention, FIG. 14A shows a state before heating and pressing, and FIG. 14B shows a state after heating and pressing.

15A and 15B are views showing a connection method of the adhesive tape in the fourth embodiment of the present invention, FIG. 15A is a sectional view, and FIG. 15B is a plan view.

16A and 16B are views showing a connection method of the adhesive tape according to the first embodiment, Fig. 16A is a perspective view showing the connection between the adhesive material reels, and Fig. 16B is a connection portion (b) in Fig. 16A. It is a perspective view showing.

It is sectional drawing which shows the connection method of an adhesive tape in 2nd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 3rd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 4th Embodiment of this invention.

20A to 20C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 20A is a perspective view showing the connection between the adhesive material reels, and FIGS. 20B and 20C are connection portions in FIG. 20A. It is sectional drawing which shows the connection method of the.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive agent in a bonding apparatus.

22A to 22C are views showing an adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing an adhesive tape reel, FIG. 22B is a front view in FIG. 22A, and FIG. 22C is a view in FIG. 22A. Top view of the connection tape.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive agent in a bonding apparatus.

It is a top view of the connection tape in 2nd Embodiment of this invention.

It is a top view of the connection tape in 3rd Embodiment of this invention.

It is a perspective view which shows the adhesive tape reel in 4th Embodiment of this invention.

27A to 27C are diagrams showing an adhesive tape reel according to the first embodiment, FIG. 27A is a perspective view showing an adhesive tape reel, FIG. 27B is a front view in FIG. 27A, and FIG. 27C is shown in FIG. 27A. It is sectional drawing of the connection part in this.

It is a schematic diagram which shows the crimping | bonding process of the adhesive agent in a bonding apparatus.

It is a perspective view which shows the use condition of the adhesive agent in PDP.

It is a perspective view which shows the adhesive tape reel in 2nd Embodiment of this invention.

Fig. 31A is a cross-sectional view of the adhesive tape when the adhesive tape of the adhesive tape reel of the present invention is used for a semiconductor device having a LOC structure.

Fig. 31B is a sectional view of the semiconductor device of the LOC structure when the adhesive tape of the adhesive tape reel of the present invention is used for the semiconductor device of the LOC structure.

32A to 32C are schematic views of an adhesive apparatus using the adhesive tape reel of the present invention, FIG. 32A is a front view, and FIG. 32B is a side view, and FIG. 32C is an adhesive tape punching and attachment portion 89 of FIG. 32B. It is an enlarged view of the main part.

33A and 33B are views of an adhesive tape, FIG. 33A is a perspective view of a reel wound with adhesive tape, and FIG. 33B is a sectional view taken along line A-A in FIG. 33A.

It is a perspective view which shows the use condition of the adhesive agent in PDP.

It is sectional drawing which shows the process of apply | coating an adhesive agent to a base material.

36A to 36C are cross-sectional views of the adhesive tape according to the second embodiment of the present invention.

Width W-37C is process drawing which shows the adhesive tape which concerns on 3rd Embodiment of this invention, and its crimping method.

38A to 38C are process charts showing the manufacturing method of the adhesive tape according to the fourth embodiment of the present invention.

39A and 39B are views of an adhesive tape, FIG. 39A is a perspective view of a reel wound around the adhesive tape, and FIG. 39B is a plan view of the adhesive tape of FIG. 39A seen from the adhesive side.

40 is a schematic view showing a pressing process of an adhesive agent in the bonding apparatus.

Fig. 41 is a schematic diagram showing a second step of bonding the adhesive in the bonding apparatus according to the second embodiment of the present invention.

42A to 42C are cross-sectional views of an adhesive tape according to a third embodiment of the present invention.

43A to 43C are process charts showing an adhesive tape and a crimping method thereof according to a fourth embodiment of the present invention.

44A to 44C are process charts showing the manufacturing method of the adhesive tape according to the fifth embodiment of the present invention.

45A and 45B are views of the adhesive tape cassette according to the first embodiment of the present invention, FIG. 45A is a perspective view of the adhesive tape cassette, and FIG. 45B is an A-A cutaway view of FIG. 45A.

FIG. 46 is a cross-sectional view illustrating a mounting state of a reel in the tape cassette shown in FIG. 45A.

It is a front view which shows the crimping | compression-bonding process of the adhesive agent in a bonding apparatus.

48 is a process chart showing the method for producing the adhesive tape cassette.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive agent in a bonding apparatus as 2nd Embodiment of this invention.

It is sectional drawing of the adhesive tape which concerns on 3rd Embodiment of this invention.

51A and 51B are process drawings showing the adhesive tape and the crimping method thereof according to the fourth embodiment of the present invention.

52A and 52B are views showing the adhesive tape according to the first embodiment, FIG. 52A is a perspective view showing the connection between the adhesive material reels, and FIG. 52B is a cross-sectional view showing the connection portion in FIG. 52A.

It is sectional drawing which shows the adhesive tape which concerns on 2nd Embodiment.

54A to 54C are sectional views showing the connection process of the connecting portions in FIG. 55, FIG. 54A shows the state before discharging, FIG. 54B shows the state after discharging, and FIG. 54C shows the heat compression of the connecting portion. Drawing.

Fig. 55 is a perspective view illustrating the connection between adhesive material reels in the method for connecting an adhesive tape.

Fig. 56 is a schematic view showing the crimping step of adhesive in the bonding apparatus.

57A to 57C are views showing an adhesive tape reel according to the first embodiment, FIG. 57A is a perspective view showing an adhesive tape reel, FIG. 57B is a front view in FIG. 57A, and FIG. 57C is shown in FIG. 57A. It is a front view of the cover member in FIG.

Fig. 58 is a flowchart illustrating a method of manufacturing the adhesive tape reel.

Fig. 59 is a side view of the adhesive tape reel of the second embodiment of the present invention.

60A and 60B are front views of the adhesive tape reel in the third embodiment of the present invention, illustrating the exchange of the adhesive tape.

It is a perspective view which shows the side plate of a winding part in 4th Embodiment of this invention.

62A and 62B are views of the bonding tool according to the first embodiment of the present invention, FIG. 62A is a perspective view of the bonding tool, and FIG. 62B is an A-A cutaway view of FIG. 62A.

FIG. 63: is a side view explaining the usage method of the bonding tool shown in FIG. 62A and 62B. FIG.

64 is a process chart showing a method for manufacturing the bonding tool.

65A and 65B are views showing the adhesive tape according to the first embodiment, FIG. 65A is a perspective view in which the adhesive tape is wound on a reel, and FIG. 65A is a cross-sectional view A-A in FIG. 65A.

66A and 66B are views showing an adhesive material forming step of the adhesive tape according to the first embodiment, and FIG. 66A shows a step of overlapping each adhesive tape together to unify and winding one substrate onto a reel for winding. 66B is sectional drawing which shows the overlapping part of adhesive agents in FIG. 66A.

It is a schematic diagram which shows the process of forming the adhesive agent in a to-be-adhered body in a bonding apparatus.

It is a perspective view of the reel which wound the adhesive tape.

It is sectional drawing which shows the adhesive material formation process of the adhesive tape in 2nd Embodiment.

FIG. 69B is a cross-sectional view showing the bonding between circuit boards using the adhesive material shown in FIG. 69A. FIG.

It is a schematic diagram of the supply form of the two-layered anisotropic conductive tape of this invention.

FIG. 71: is a schematic diagram of the supply form of the 3-layered anisotropically conductive tape of this invention.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Next, embodiment of this invention is described, referring an accompanying drawing. In addition, in the following description, the same code | symbol is attached | subjected about the same or equivalent component.

First, embodiments of the invention according to claims 1 to 4 will be described with reference to FIGS. 1 to 5.

BRIEF DESCRIPTION OF THE DRAWINGS In the connection method of the adhesive tape which concerns on 1st Embodiment, it is a perspective view which shows the connection of adhesive material reels, and FIG. 2A and 2B show the connection process of the connection part A in FIG. 2A is a perspective view showing cutting of an end tape of a used adhesive tape, FIG. 2B is a perspective view showing a connection with a new adhesive tape by inverting the used adhesive tape, and FIG. 3 is a pressing process of the adhesive in the bonding apparatus. 4 is a cross-sectional view showing the adhesion of circuit boards, and FIG. 5 is a process chart showing the manufacturing method of the adhesive tape.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a is provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively. That is, each reel 3 and 3a has the core 5 and the side plate 7 arrange | positioned at the both width side of the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The base material 9 is composed of OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like. The conductive particles 13 include these and non-conductive glass, A conductive layer made of a material constituting the conductive particles 13 described above may be formed by coating or the like on a polymer core material such as ceramics or plastic. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned conductive particle 13 with the insulating layer, the combination of the conductive particle 13, and insulating particle, etc. are also applicable. The formation of a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, in the case where the polymers are the nucleus, the conductive particles 13 do not exhibit melting points like solder, so that the softening state can be controlled widely at the connection temperature, and the connection member is easy to cope with variations in thickness and flatness of the electrode. It is more preferable because is obtained.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the winding reel 17 were attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the reel 3a was attached. Is attached to the take-up reel 17 on the guide pin 22, and the adhesive tape 1 is fed out (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive agent 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be pressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at one time. ), The usage amount is significantly higher than in the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 1).

In the method of connecting the adhesive tape of the present invention, (a) the winding reel 17 is used as it is, the used adhesive tape 1 is replaced with an adhesive tape with only a few wounds left, and a new adhesive tape and the winding reel ( 17) and the (b) winding-up reel 17, the adhesive tape 1 of the used adhesive tape 1 is left with a small amount of winding, and the new adhesive tape and the adhesive tape with a few remaining windings are connected. There is a case.

In the case of (b), as shown in FIG. 1, in order to replace the reel 3a with the new adhesive material reel 3 in the adhesive tape 1 of the reel 3a, the adhesive tape of the reel 3a (one side) The end portion 30 of the adhesive tape 1 is connected to the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3.

When the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the connection of this adhesive tape 1 is carried out, as shown in FIG. 2A, the end mark 28 of the adhesive tape 1 ) And the end part 30 of the adhesive tape 1 is inverted, and the adhesive 11 surface of the adhesive tape 1 is turned upward (FIG. 2B). Then, on the adhesive 11 surface of the end portion 30 of the adhesive tape 1 of the used reel 3a, the adhesive of the start end 32 of the adhesive tape 1 of the new adhesive material reel 3 ( 11) Overlap the faces (FIG. 2B).

As shown in FIG. 4, the overlapped portions are placed on the table 104, and heated and pressed by the heat press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary. In addition, since the surfaces of the adhesive 11 are bonded to each other, the connection strength is high.

Moreover, the end mark 28 is the adhesive tape 1 in the adhesive tape 1 from the used reel (reel to which the adhesive tape 1 is fully fed out) 3a to the heating press head 19. When is increased, it is preferable to stick to the position of the length from the fixed position to the used reel 3a of the adhesive tape 1 to the heating press head 19. In this case, when the vicinity of the end mark 28 is cut off, the adhesive tape 1 is cut at the minimum required position, and the waste of the adhesive tape 1 can be prevented, and the used reel ( By removing 3a), cumbersome work of moving the used reel 3a so that the end mark 28 reaches the heating press head 19 can be prevented.

In this embodiment, the bonding apparatus 15 has the heating press head 19, and the terminal 30 of the adhesive tape 1 of the reel 3a which was used using this heating press head 19 was used. Of the adhesive 11 and the adhesive 11 of the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are separately connected. The reels 3 and 3a wound around the adhesive tape 1 can be replaced without being used.

When using the winding reel 17 of (a) as it is, and replacing the adhesive tape which has just remaining of the used adhesive tape 1 with a new adhesive tape, and connecting a new adhesive tape and the winding reel 17, When the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the adhesive material cuts around the end mark 28 of the adhesive tape 1, and remains on the winding reel 17 side. The end of the tape is turned over, and the adhesive 11 face up. The adhesive 11 surface of the end portion of the adhesive tape 1 and the adhesive 11 surface of the start end 32 of the adhesive tape 1 of the new adhesive material reel 3 overlap with each other. Then, the overlapped portions are placed on the table 104 and heated and pressurized by the heat press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound around the winding reel 17 and the adhesive tape 1 wound around the new reel 3 are connected. Thereby, since only the base material 9 is wound up in the winding reel 17, some of the adhesive material reels can be wound up and the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

A coater 27 is applied to the base material (separator) 9 unloaded from the unwinder 25 to apply the adhesive 11 mixed with the resin and the conductive particles 13, and then in the drying furnace 29. After drying, the disk is wound up in the winder 31. After the disk of the wound adhesive tape 1 is cut into a predetermined width by a slitter 33 and wound around the core, the side plates 7 and 7 are attached to the core from both sides, or the core with the side plate attached. It is wound up in and wrapped with a dehumidifying material, and it is controlled and released at low temperature (-5 degreeC--10 degreeC).

Next, although 2nd Embodiment of this invention is described, a mainly different point from embodiment mentioned above is demonstrated below.

In 2nd Embodiment shown in FIG. 6, the adhesive material of the new adhesive material reel 3 is used using the lead tape 41 with which the start end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 was equipped. The tape 1 and the adhesive tape 1 wound around the used reel 3a are connected. The lead tape 41 consists of the base material 63 and the adhesive 43 surface of the back surface, and the start end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 is connected by the lead tape 41. It sticks to the base material 9 surface of the adhesive tape 1 wound around the reel. And the lead tape 41 is peeled off from the base material 9 surface, and it overlaps with the adhesive agent 11 surface of the terminal part 30 of the inverted adhesive tape 1. The overlapped portions of the two are placed on the table 104, and heated and pressurized by the heating press head 19 of the bonding apparatus 15 to be bonded. Thus, using the lead tape 41 of the adhesive tape 1, the terminal part 30 of the adhesive tape 1 which unwinding | finished is adhere | attached, and the start end part 32 of the adhesive tape 1 to attach newly is adhere | attached. Thus, the connection between the adhesive tapes 1 is easy. In this case, the adhesive 43 surface provided on the back surface side of the base material 63 of the lead tape 41 is sticky, and is adhered to the adhesive 11 surface of the end portion 30 of the inverted adhesive tape 1. Since it connects only to overlap, this method may be sufficient.

This invention is not limited to embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the summary of this invention.

For example, in the above-described second embodiment, the start end portion 32 of the adhesive tape 1 to be newly mounted as shown in FIG. 7 without inverting the adhesive tape 1 wound on the used reel 3a. Peels off the lead tape 41 from the substrate 9 surface, attaches the lead tape 41 to the adhesive 11 surface on the back surface, and attaches the lead tape 41 to the end portion 30 of the used adhesive tape 1. It may be connected to the surface and heated and pressurized by the heat press head 19 of the bonding apparatus 15, and may be bonded. In this case, since it is not necessary to turn over the adhesive tape 1 after unwinding, it can prevent the possibility that the winding | winding of the winding | winding arises when the adhesive tape 1 is wound up to the winding reel.

Furthermore, in this case, the lead tape 41 of the start end 32 of the adhesive tape 1 is peeled off from the base 9 surface, and the lead tape 41 is removed from the base 9 surface of the used adhesive tape 1. May be adhered to.

Next, the invention of Claims 5-8 is demonstrated.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background of the invention according to claims 5 to 8 will be described.

Generally, electronic components such as liquid crystal panels, PDPs (plastic display panels), EL (fluorescent display) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and are electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and attached to the winding reel. And the adhesive agent is crimped | bonded by a heating press head with the heating press head from the base material side of the adhesive tape unwound from the adhesive material reel, and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. .

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, since the frequency of replacement of an adhesive material reel becomes large and a lot of labor is required for replacement of an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device cannot be aimed at.

In response to such a problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase the amount of winding, there is a risk of drift of the wound. In addition, when the number of turns is increased, the pressure acting on the adhesive tape wound on the tape increases, which may cause the adhesive to bleed out from both widths of the tape and cause blocking.

Furthermore, increasing the number of turns of the adhesive tape also increases the diameter dimension of the reel, making it difficult to attach to the existing adhesive apparatus, and there is a concern that the existing adhesive apparatus cannot be used.

Therefore, the invention as recited in claims 5 to 8 aims at providing an adhesive tape connecting method which can simplify the replacement of the adhesive reel and improve the production efficiency of the electronic device. .

Next, a first embodiment of the present invention will be described with reference to FIGS. 8A to 8C and FIGS. 3 to 5. 8A to 8C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 8A is a perspective view showing the connection between the adhesive material reels, and FIG. 8B shows a connection method of the connection portions in FIG. 8A. It is a perspective view, and FIG. 8C is a top view of the connection part in FIG. 8A.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 5 mm.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The base material 9 is composed of OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like. The conductive particles 13 include these and non-conductive glass, A conductive layer made of a material constituting the conductive particles 13 described above may be formed by coating or the like on a polymer core material such as ceramics or plastic. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned conductive particle 13 with the insulating layer, the combination of the conductive particle 13, and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder, or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, in the case where the polymers are the nucleus, the conductive particles 13 do not exhibit melting points like solder, so that the softening state can be widely controlled at the connection temperature, and a connection member that is easy to cope with variations in thickness and flatness of the electrode can be obtained. It is more preferable because it can be obtained.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the winding reel 17 were attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a was guide pin. It hangs on (22), it is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive agent 11 crimped | bonded to the circuit board 21, and it is needed as a cushion material, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The size of the PDP using the adhesive tape 1 according to the present embodiment is large, and may be crimped over the entire circumference of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at once. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 8A).

In the method of connecting the adhesive tape of the present invention, (a) the winding reel 17 is used as it is, the used adhesive tape 1 is replaced with an adhesive tape with only a few wounds left, and a new adhesive tape and the winding reel ( 17) and the (b) winding-up reel 17, the adhesive tape 1 of the used adhesive tape 1 is left with a small amount of winding, and the new adhesive tape and the adhesive tape with a few remaining windings are connected. There is a case.

In the case of (b), when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, as shown in FIG. 8A, in order to replace the reel 3a with the new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. (See Figure 8A).

The connection of this adhesive tape 1 is the terminal 30 of the adhesive tape 1 of the adhesive reel 3a, and the adhesive tape 1 of the new adhesive reel 3, as shown to FIG. 8B and FIG. 8C. ), The adhesive 11 surface of the start end portion 32 is overlapped with the base 9 surface of the end portion 30. Then, a substantially U-shaped locking pin 46 is inserted in the overlapped portion to connect the end portion 30 of the adhesive tape 1 and the start end 32 of the adhesive tape 1 of the new adhesive material reel 3. do.

Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding | finished and the start end part 32 of the adhesive material tape 1 which are newly attached are fixed with the locking pin 46, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 newly to the winding reel 17 is unnecessary.

Using the winding reel 17 of (a) as it is, and replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, a substantially U-shaped locking pin 46 is inserted into the overlapped portion so that the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3 are inserted. Connect

Since only the base material 9 is wound by the winding reel 17, several parts of an adhesive material reel can be wound up. For this reason, the replacement | exchange frequency of the winding reel 17 can be made small, and work efficiency is good.

Next, although the 2nd-4th embodiment of the invention of Claims 5-8 is demonstrated, in embodiment described below, the same code | symbol is attached | subjected to the same part, and that part The detailed description will be omitted, and the following will mainly describe differences from the first embodiment described above.

In the second embodiment shown in FIG. 9, the locking member provided with the elastic members 50 which connect the click parts 48 and 49 provided in the one end and the other end, and the click parts 48 and 49 of both ends ( 47), the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are connected. In detail, the click part 48 which provided the end part 30 of one adhesive material tape 1 and the start end part 32 of the other adhesive material tape 1, and was provided in one end of the locking member 47 is provided. To the end portion 30, the click portion 49 provided at the other end is locked to the start end portion 32, and one click portion 48 and the other click portion 49 are elastic members ( 50). Further, the click portions 48 and 47 are provided with a plurality of clicks 51 having sharp ends at the rear surface of the plate member.

Since the click portion 48 provided at one end of the locking member 47 is latched to the end portion 30, and then the click portion 49 provided at the other end is latched on the start end portion 32 so as to connect both to each other. , Connection is easy. Moreover, since the elastic member 50 is provided between the one click part 48 and the other click part 49, the elastic member 50 is extended and the other click part of the locking member 47 is extended. Since 49 can be latched in the arbitrary position of the start end part 32 of the other adhesive tape 1, the freedom of connection is high.

In the third embodiment shown in FIG. 10, the end portion 30 of the adhesive tape 1 wound around the used reel 3a and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3. ), The adhesive 11 surface of the start end portion 32 overlaps the surface of the substrate 9 of the end portion 30, and the overlapped portion is sandwiched by an elastically deformable clip 53 whose cross section is approximately co-shaped. It is fixed. Since the overlapping part can be connected only by pinching | clipping the clip 53, connection operation is easy.

In 4th Embodiment shown in FIG. 11, in 1st Embodiment, the overlapped part is covered with the metal clamping piece 55 whose cross section is substantially co-shaped, and the clamping piece 55 is pressed from both surfaces of the overlapping part, and is pressed. It is crushed and connects both. Since the clamping piece 55 is pressed and crushed from both surfaces of the overlapped portion, a firm connection can be obtained at the overlapped portion.

The invention described in claims 5 to 8 is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention according to claims 5 to 8. .

For example, in the above-described first embodiment, the engagement pin 46 may be one linear pin without making the substantially U-shape, and in this case, it is preferable to fix it by using a plurality of pins in the overlapped portion. Do.

In the second embodiment, a plurality of locking members 47 may be used depending on the width of the adhesive tape 1.

In the third embodiment and the fourth embodiment, a plurality of clips 53 or clamping pieces 55 may be used, and may be fixed from both sides of the overlapped portions of the adhesive tape 1, respectively.

Next, the invention according to claims 9 to 13 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background of the invention according to claims 9 to 13 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

When the adhesive tape is attached to the adhesive device, a reel of the adhesive tape (hereinafter simply referred to as "adhesive reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is provided. And the adhesive agent is crimped | bonded by a heating press head with the heating press head from the base material side of the adhesive tape unwound from the adhesive reel, and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel on which the base material is wound are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, there exists a problem that the frequency of replacement of an adhesive reel increases, and since labor takes for exchanging an adhesive reel, the improvement of the production efficiency of an electronic device is not aimed at.

In response to this problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of winding up. In addition, when the number of turns is increased, the pressure acting on the adhesive tape wound on the tape increases, which may cause the adhesive to bleed from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also large, and it is difficult to attach to the existing adhesive device, and there is a fear that the existing adhesive device cannot be used.

Therefore, the invention as recited in claims 9 to 13 is intended to provide an adhesive tape connection method which can easily replace an adhesive reel and can improve the production efficiency of an electronic device. do.

Next, an embodiment of the invention as claimed in claims 9 to 13 will be described with reference to the accompanying drawings. First, the claim 9 is described with reference to FIGS. 12A, 12B and FIGS. The first embodiment of the invention according to -13 will be described. 12A to 12C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 12A is a perspective view showing the connection between the adhesive material reels, and FIG. 12B shows a connection method of the connection portions in FIG. 12A. Perspective view.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 3 mm.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the end of the adhesive tape 1 wound on the reel 3a is wound. It installs in (7) and feeds out the adhesive tape 1 (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and it is polytetrafluoro, for example as a cushion material as needed. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at once. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 12A).

The adhesive tape of the adhesive tape of the invention as described in Claims 9-13 uses the winding reel 17 as it is, and the winding of the used adhesive tape 1 is few. The new adhesive tape and connecting the new adhesive tape and the winding reel 17, and (b) the new adhesive tape using the adhesive tape with only a few windings of the used adhesive tape 1 remaining as the winding reel 17. There may be a case where a tape and an adhesive tape having only a few wounds are connected.

In the case of (b), as shown in FIG. 12A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. (See Figure 12A).

As shown in FIG. 12B, the connection of the adhesive tape 1 is the beginning of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the adhesive tape 1 of the new adhesive reel 3. About the part 32, the adhesive agent 11 of the start end part 32 is overlapped with the base material 9 surface of the terminal part 30. As shown in FIG. The overlapped length H of both of them is set to about 2.5 of the width W of the adhesive tape 1, it is placed on the table 36, and it heat-presses with the heating press head 19 of the bonding apparatus 15, and adhere | attaches them. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches an adhesive tape to the winding reel 17 is unnecessary.

In this embodiment, since the heating press head 19 is used, the reel 3 and 3a by which the adhesive material 1 was wound can be replaced without using the crimping mechanism of adhesive agents separately.

Using the winding reel 17 of (a) as it is, and replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the overlapped portions are heated and pressurized by the heat press head 19 of the bonding apparatus 15 and bonded. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The adhesive 11 which mixed resin and the conductive particle 13 was apply | coated to the base material (separator) wound from the unwinder 25, and dried in the drying furnace 29, and then wound up Wind the disc in (31). After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 and 7 are attached to the core from both sides, or the core of the side plate attached to the core is wound, And packed together, preferably, controlled and released at low temperature (-5 ° C to -10 ° C).

Next, although an embodiment different from the invention of Claims 9-13 is demonstrated, in embodiment described below, the same code | symbol is attached | subjected to the same part as embodiment mentioned above, The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 13, one mold 56 and the other mold on which the overlapped portions 34 of the adhesive tape 1 are aligned with the jagged portions (unevenness) 44 on the surface thereof are formed. It sandwiches with 57, and the unevenness | corrugation 58 is formed in the overlapped part 34. FIG. By forming the concave-convex 58 in this way, the adhesive area in the overlapped portion 34 can be increased, and the tensioning direction by the engagement of the concave-convex 58 in the overlapped portion 34 (the longitudinal direction of the adhesive tape). ) Can increase the strength. In the case of the uneven formation, the end faces of the overlapped portions of the adhesive 11 are flown together by the adhesive, and the strength in the tensile direction of the overlapped portions 34 is increased.

In the 3rd Embodiment shown to FIG. 14A and 14B, the adhesive tape wound around the used reel 3a by bending the start end part 32 of the reel 3 by which the new adhesive material 1 was wound in substantially V shape. The end portion 30 of (1) is also bent into a substantially V-shape, hooked to the adhesive 11 to face each other (Fig. 14A), and heated and pressurized by the heat press head 19, Is connected (FIG. 14B). In the third embodiment, the terminal 30 and the start end 32 are connected by hooks, so that they can be firmly connected, and the adhesive 11 is superimposed on each other, whereby a stronger connection can be obtained. have. Since the adhesive agent of the overlapped part flows and adheres also in the cross section as mentioned above, a more firm connection can be obtained.

In 4th Embodiment shown to FIG. 15A and FIG. 15B, the through-hole 59 is drilled in the part 34 which overlapped before heating pressurization or simultaneously with heating pressurization in 1st Embodiment. By drilling the through-hole 59, the adhesive 11 oozes out from the periphery of the through-hole 59 at the time of heat pressurization, and since they adhere, the adhesive force can be raised and the overlap part 34 makes a firm connection. You can get it.

The invention described in claims 9 to 13 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 9 to 13. .

For example, in the above-described second embodiment, the concave-convex portion 58 may be an annular shape rounded without being formed in a mountain shape.

In the fourth embodiment, the number of the through holes 59 may be any number without any particular limitation. In addition, the diameter of the through hole 59 is not limited. In the second and third embodiments, the through hole 59 may be further formed in the overlapped portion 34.

Next, the invention described in claims 14 to 18 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background art of the invention as described in Claims 14-18 is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as an "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is installed. After mounting the adhesive reel, the adhesive is pressed onto a circuit board or the like from the substrate side of the adhesive tape unwound from the adhesive reel with a heating press head, and the remaining substrate is wound around the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel wound around the substrate are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the adhesive tape is fastened to the guide of the adhesive device. I install a start on a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, since the frequency of replacement of an adhesive material reel becomes large and a labor takes for exchanging an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device cannot be aimed at.

For this problem, it is considered to increase the amount of adhesive per one reel and reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the tape width of the adhesive tape is narrow to 1 to 3 mm. If it increases a lot, there is a possibility that the wound of the winding may occur. In addition, when the number of turns is increased, the pressure acting on the adhesive tape wound on the tape increases, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, making it difficult to attach to the existing adhesive apparatus, and there is a possibility that the existing adhesive apparatus cannot be used.

On the other hand, even when it tried to stick an adhesive tape and an adhesive tape with an adhesive tape, it could not adhere with sufficient adhesive force. This is because a fluorine mold release agent, a silicone mold release agent, etc. are apply | coated to an adhesive tape in order to make peelability with an adhesive material favorable, and it is based on the influence.

Therefore, the invention as recited in claims 14 to 18, in particular, even when the base material of the adhesive tape uses a siliconized base material, the replacement of the adhesive material reel can be simplified, and the production efficiency of the electronic device can be reduced. An object of the present invention is to provide a method for connecting an adhesive tape that can be improved.

Next, although an embodiment of the invention described in claims 14 to 18 will be described with reference to the accompanying drawings, the claim 14 will be described first with reference to FIGS. 16A, 16B, and 3 to 5. The first embodiment of the invention according to -18 will be described. 16A and 16B are views showing a connection method of the adhesive tape according to the first embodiment, Fig. 16A is a perspective view showing the connection between the adhesive material reels, and Fig. 16B is a connection of the connection portion b in Fig. 16A. It is a perspective view showing a method.

The adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1 are provided on each reel 3 and 3a.

The adhesive tape 1 is composed of a silicon processing substrate 9 and an adhesive 11 applied to one side of the silicon processing substrate 9.

The silicon-treated substrate 9 uses a substrate such as OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate) and the like from the peelable side of the adhesive constituting the strength and anisotropic conductive material. Is surface-treated with a silicone resin or the like.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. Therefore, since reliability improves, it is preferable. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the end of the adhesive tape 1 wound on the reel 3a is wound. It attaches to (17) and feeds out the adhesive tape 1 (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, and the adhesive tape 1 is press-contacted from the silicon processing base material 9 side by the heating press head 19 arrange | positioned between both reels 3a, 17. The adhesive 11 is pressed against the circuit board 21. Thereafter, the silicon substrate 9 is wound around the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and it is polytetrafluoro, for example as a cushion material as needed. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be pressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 16A).

As for the connection method of the adhesive tape of the invention of Claims 14-18, the adhesive tape which (a) uses the winding reel 17 as it is, and the winding of the used adhesive tape 1 is few. The new adhesive tape and the winding reel 17, and (b) using the adhesive tape with only a few windings of the used adhesive tape 1 remaining as the winding reel 17, There may be a case where a tape and an adhesive tape having only a few wounds are connected.

In the case of (b), as shown in FIG. 16A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. .

As shown in FIG. 16B, the connection of this adhesive tape 1 is the beginning of the end part 30 of the adhesive tape 1 of the adhesive reel 3a, and the beginning of the adhesive tape 1 of the new adhesive reel 3. As shown in FIG. The part 32 is abutted, the silicone adhesive tape 60 is affixed over the surfaces of the silicon processing base materials 9 and 9 of both adhesive tapes 1 and 1, and both adhesive tapes 1 and 1 are connected.

This silicone adhesive tape 60 is comprised from the base material 63 and the silicone adhesive 62 apply | coated to the single side | surface of the base material 63. As shown in FIG. Although the material of the base material 63 is not specifically limited, In this embodiment, it is a polyimide resin material. Moreover, in FIG. 16B, the adhesive 11 of the adhesive tape and the adhesive part 43 of the silicone adhesive tape 60 are shown with the diagonal line, respectively.

Here, the adhesion by the silicone adhesive tape 60 will be described. In one and the other adhesive tapes 1 and 1, since the silicon processing bases 9 and 9 are coated with silicon, respectively, it is difficult to adhere with an adhesive, but in this embodiment, the silicone adhesive tape 60 By using a silicone resin as the pressure-sensitive adhesive 43, the end of one adhesive tape 1 by making the difference between the surface tensions of both the silicon processing substrates 9 and 9 and making them adhere (adhesion) 30 and the start end part 32 of the other adhesive tape 1 are connected satisfactorily. The difference in surface tension between the surface of the silicone adhesive 62 and the surface of the silicon processing substrates 9 and 9 in the silicone adhesive tape 60 is preferably 10 mN / m (10 dyne / cm) or less. In the form of, there is little difference in surface tension.

In general, the surface tensions of both the terminal portions 30 of one adhesive tape 1 and the silicon substrates 9 and 9 of the other adhesive tape 1 are 25 mN / m to 60 mN / m (25 to 25). 60 dyne / cm) and, for example, when the surface tension is 30 mN / m, the surface tension of the silicone pressure-sensitive adhesive 62 in the silicone adhesive tape 60 is set to 20 mN / m or more and 40 mN / m or less.

The silicone pressure sensitive adhesive is mainly composed of a silicone gum and a silicone resin, and condensation reaction of both is performed to express the adhesiveness. Furthermore, the glass transition temperature is -100 by crosslinking by a hydrosilylation reaction with a peroxide and a platinum catalyst. It is common to set it as below. These are commercially available and can be used suitably.

Thus, using the adhesive tape 60, the adhesive tape 1 wound around the used adhesive reel 3a and the adhesive tape 1 wound on the new adhesive reel 3 are connected. Next, the used adhesive reel 3a and the new adhesive reel 3 are replaced, and the new adhesive reel 3 is attached to the adhesive device 15. Therefore, the adhesive tape 1 of the new adhesive reel 3 is taken out, and the adhesive tape 1 is mounted on the winding reel 17, or the new adhesive tape 1 is hung on the guide 36 of the adhesive device 15. Since no work is required, the work efficiency of replacing the adhesive material reels 3 and 3a is good. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding is complete | finished and the start end part 32 of the adhesive material tape 1 which are newly attached are connected with a silicone adhesive tape, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 newly to the winding reel 17 is unnecessary.

Using the winding reel 17 of (a) as it is, and replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end portion 30 of the adhesive tape is joined with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3 are connected to each other by using a silicone adhesive tape. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Next, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25 to apply an adhesive in which the resin and the conductive particles are mixed, dried in the drying furnace 29, and then wound up in the winder 31. . After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 and 7 are attached to the core from both sides, or the core of the side plate attached to the core is wound, And packed together, preferably, controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the invention described in claims 14 to 18 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 17, in addition to the first embodiment described above, the adhesive 11 between the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape. The silicone adhesive tape 60 is also adhered to the surface side. The adhesive force of the silicone adhesive 62 of the silicone adhesive tape 60 in this 2nd Embodiment is 100 g / 25 mm or more, and is 700 g / 25 mm-1400 g / 25 mm in this embodiment. In addition, the surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is 10 mN / different from the surface tension of the silicone substrate in one and the other adhesive tapes as in the above-described embodiment. m (10 dyne / cm) or less. In this second embodiment, since both sides of the end portion 30 of one adhesive material tape 1 and the start end portion 32 of the other adhesive material tape are bonded with the silicone adhesive tape 60, Both adhesive tapes 1 and 1 can be adhere | attached with higher intensity | strength than 1st Embodiment.

In the third embodiment shown in FIG. 18, the end portion 30 of one adhesive material tape 1 and the start end portion 32 of the other adhesive material tape 1 are disposed so as to overlap each other, and the silicon processing substrate 9 The silicone adhesive tape 60 which concerns on 2nd Embodiment was stuck to the side surface and the adhesive material 11 side. According to this 3rd Embodiment, the effect similar to 2nd Embodiment can be acquired.

In the fourth embodiment shown in FIG. 19, a silicone pressure-sensitive adhesive is formed on both surfaces of a substrate between the end portion 30 of one adhesive material tape 1 and the start end portion 32 of the other adhesive material tape 1. The end part 30 and the start end part 32 are connected through the silicone adhesive tape 61 which apply | coated 62. According to this fourth embodiment, by using the double-sided silicone adhesive tape 61, the end portion 30 of one adhesive tape 1 and the start end portion of the other adhesive tape 1 are further reduced. The connection with (32) can be simple and easy.

Next, the invention described in claims 19 to 21 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background of the invention according to claims 19 to 21 will be described.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed to each other and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching an adhesive tape to an adhesive apparatus, an adhesive tape reel (henceforth simply called "adhesive reel") is attached to an adhesive apparatus, the lead end of an adhesive tape is taken out, and it is attached to a winding reel. And the adhesive agent is crimped | bonded by a heating press head with the heating press head from the base material side of the adhesive tape unwound from the adhesive material reel, and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesive area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, there is a problem that the frequency of replacement of the adhesive reel increases, and the effort for exchanging the adhesive reel is not improved, thereby improving the production efficiency of the electronic device.

For this problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

In addition, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, and it is difficult to attach to the existing adhesive apparatus, and there is a possibility that the conventional adhesive apparatus cannot be used.

Accordingly, the invention described in claims 19 to 21 is intended to provide a method for connecting an adhesive tape, which can easily replace an adhesive reel and can improve the production efficiency of an electronic device. .

EMBODIMENT OF THE INVENTION Next, although embodiment of invention of Claim 19 is described with reference to an accompanying drawing, it claims at first with reference to FIGS. 20A-20C, FIG. 21, FIG. 4, and FIG. The first embodiment of the invention according to claim 19 will be described. 20A to 20C are views showing a connection method of the adhesive tape according to the present embodiment, FIG. 20A is a perspective view showing the connection between the adhesive material reels, and FIGS. 20B and 20C are a connection method of the connection portion in FIG. 20A. It is sectional drawing which shows.

The adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the reel 3 and 3a is provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the adhesive property which comprises the strength and anisotropic conductive material, it restrict | limits to these. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 21, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a is guide pin. It hangs on (22), it is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 21). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive agent 11 crimped | bonded to the circuit board 21, and it is needed as a cushion material, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, and there are many connection portions. The adhesive 11 is an adhesive 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 20A).

The adhesive tape of the adhesive tape of the invention as described in Claims 19-21 uses the winding reel 17 as it is, and the winding of the used adhesive tape 1 is few. The new adhesive tape and the winding reel 17, and (b) using the adhesive tape with only a few windings of the used adhesive tape 1 remaining as the winding reel 17, There may be a case where a tape and an adhesive tape having only a few wounds are connected.

In the case of (b), as shown in FIG. 20A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive reel 3, End portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3. Is connected using the resin adhesive 64.

Examples of the resin adhesive 64 include epoxy resins, cyanate resins, bismaleimide resins, phenol resins, urea resins, melamine resins, alkyd resins, acrylic resins, unsaturated polyester resins, diallyl phthalate resins, silicone resins, Resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallyl cyanurate resin, etc. are mentioned.

As shown in FIG. 20B, the connection of this adhesive tape 1 is the beginning of the end part 30 of the adhesive tape 1 of the adhesive reel 3a, and the beginning of the adhesive tape 1 of the new adhesive reel 3. As shown in FIG. With respect to the portion 32, the adhesive 11 surface of the start end portion 32 overlaps the base 9 surface of the end portion 30. And the paste-form resin adhesive 64 is apply | coated to the overlapped part from the charger 65 assembled to the bonding apparatus 15. Then, as shown in FIG. As shown in FIG. 20C, when the resin adhesive 64 is a thermosetting resin by heating the heater 66 assembled in the bonding apparatus 15, the end portion of the adhesive tape 1 is cured by curing the resin adhesive 64. 30 and the start end 32 of the adhesive tape 1 of the new adhesive reel 3 are connected.

Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding | finished and the start-end part 32 of the adhesive material tape 1 which are newly attached are fixed with the resin adhesive 64, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary.

Using the winding reel 17 of (a) as it is, and replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the paste-like resin adhesive 64 is applied to the overlapped portions of the paste, and the ends 30 and the new adhesive material are heated or irradiated with ultraviolet rays so that the adhesive force can be exhibited according to the type of the resin adhesive used. The start end 32 of the adhesive tape 1 of the reel 3 is connected. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) unwound from the unwinder 25 to apply the adhesive 11 in which the resin and the conductive particles 13 are mixed and dried in the drying furnace 29. 31) wind the disc. After the disk of the adhesive tape wound up is cut | disconnected by the slitter 33 to predetermined width, and wound up by the core, the side plates 7 and 7 are mounted in the core from both sides, or it is wound up by the side plate attachment core, And packed together, preferably, controlled and released at low temperature (-5 ° C to -10 ° C).

The invention described in claims 19 to 21 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 19 to 21. .

In this embodiment, although the thermosetting resin was used as the resin adhesive 64 as an example, it uses the photocurable resin instead of a thermosetting resin, and hardens | cures a photocurable resin by light irradiation, such as an ultraviolet-ray, an adhesive tape ( 1) You may make mutual connection.

In this case, as a photocurable resin, the epoxy resin containing the composition which mix | blended the photoinitiator with resin which has an acrylate group or a methacrylate group, and photocuring agents, such as aromatic diazonium salt, diallyl iodonium salt, and sulfonium salt, etc. Etc. can be used.

As the resin adhesive, a hot melt adhesive mainly composed of ethylene vinyl acetate resin or polyolefin resin may be used. For example, in the case of a sheet-like hot melt adhesive, a sheet-like hot melt adhesive is wound around a portion where the adhesive tapes 1 overlap. After the hot melt adhesive is heated and melted by the heater 66, the adhesive tapes 1 are connected to each other by cooling the hot melt adhesive.

The resin adhesive used for the connection of the adhesive tape 1 may be used in plural from the group of thermosetting resins, photocurable resins and hot melt adhesives.

In the above-described embodiment, the base 9 surface of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the start end 32 of the adhesive tape 1 of the new adhesive reel 3 are formed. Although the surface of the adhesive 11 of () was overlapped and the thermosetting resin which is a resin adhesive was apply | coated and connected, the edge part 30 of the adhesive tape 1 of the adhesive reel 3a was reversed, and the surfaces of the adhesive 11 were After laminating | stacking both on top of each other, you may fix with a thermosetting resin.

Next, the invention described in claims 22 to 24 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape reel and an adhesive device wound in a reel shape.

Next, the background of the invention according to claims 22 to 24 will be described.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and are electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel wound around the adhesive tape is attached to the adhesive apparatus, the beginning end of the adhesive tape is taken out, and installed on the winding reel. Then, the adhesive is pressed into a circuit board or the like from the substrate side of the adhesive tape unwound from the adhesive tape reel with a heating press head, and the remaining substrate is wound around the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, there exists a problem that the manufacturing frequency of an electronic device increases the frequency of replacement of an adhesive tape reel, and since the trouble of exchanging adhesive tape reels increases, the production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Moreover, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the conventional adhesive apparatus cannot be used.

Accordingly, the invention described in claims 22 to 24 is intended to provide an adhesive tape reel and an adhesive device which can easily replace the adhesive tape reel and can improve the production efficiency of the electronic device. It is done.

EMBODIMENT OF THE INVENTION Next, although embodiment of invention of Claim 22-24 is described referring an accompanying drawing, Claim is first referred to with reference to FIGS. 22A-22C, FIG. 23, FIG. 4, and FIG. The first embodiment of the invention according to claims 22 to 24 will be described. 22A to 22C are views showing an adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing an adhesive tape reel, FIG. 22B is a front view in FIG. 22A, and FIG. 22C is a view in FIG. 22A. It is a top view of the connection tape of, and FIG. 23 is a schematic diagram which shows the crimping | compression-bonding process of the adhesive agent in a bonding apparatus.

As shown to FIG. 22A, the adhesive tape reel A which concerns on this embodiment is equipped with the winding parts (hereafter winding) 2, 2a of several adhesive material tapes, and the winding parts 2, 2a are reels. Adhesive tape 1 is wound around 3 and 3a, respectively. Each reel 3, 3a is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. As shown in FIG. 23, the adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9. As shown in FIG.

Among the plurality of windings 2, 2a, the adhesive tape wound on the other end portion 30 of the adhesive tape (hereinafter, one adhesive tape) 1 wound on one winding portion 2 (the other winding tape) (hereinafter, the other The connection tape 41 which connects both is provided between the start end part 32 of the adhesive tape 1 of this side. The connection tape 67 is disposed from the end portion 30 of one adhesive tape 1 over the inner side surface of the side plate 7 of the reel 3, and is cut and broken at an upper portion of the side plate 7. Locked to (68), it is connected to the start end 32 of the adhesive tape 1 on the other side.

In addition, marks 69 and 70 for recognizing the connection tape 67 are attached to the connection portion between the one and the other adhesive tape 1 and the connection tape 67, and the tape detection means (light emitting portion ( When the marks 69 and 70 are detected by the light receiving portion 72, the connecting tape 67 portion is skipped so that the pressing is not performed on the connecting tape 67 portion.

As the base material 9, OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) and the like are used from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but are not limited thereto. It is not.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape reel A which concerns on this embodiment is demonstrated. As shown in FIG. 23, the adhesive tape reel A and the winding reel 17 are attached to the bonding apparatus 15, and the starting end 32 of one adhesive tape 1 is attached to the guide pin 22. As shown in FIG. It is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 23). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive agent 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3 also increases, and the adhesive tape 1 wound on the reel 3 is wound up by the winding reel 17 in a comparatively short time.

When the unwinding of one adhesive tape 1 is finished, the connecting tape 67 is peeled off from the cut and broken portion 68, and the other adhesive tape 1 is subsequently fed out. In this embodiment, since the connection tape 67 which connects both is provided between the terminal part 30 of one adhesive material tape 1, and the start end part 32 of the other adhesive material tape 1, it is provided. When the unwinding of one adhesive tape 1 is finished, the feeding of the other adhesive tape 1 can be started continuously. Therefore, after the unwinding of one adhesive tape 1 is completed, the work of installing the new adhesive tape 1 on the winding reel 17 becomes unnecessary, and the production efficiency of the electronic device is increased.

In addition, the bonding apparatus 15 is provided with a pair of light emitting part 71 and the light receiving part 72, as shown in FIG. 23, and optically detects the connection tape 67. As shown in FIG. Black marks 69 and 70 are attached to both ends of the connecting tape 67 connecting both the adhesive tape 1 on the one side and the adhesive tape 1 on the other side. The light emitting part 71 emits laser light continuously toward the adhesive tape 1, the light receiving part 72 receives the reflected light, and transmits the detection signal to the control apparatus 79. FIG. And the light receiving part 72 receives the reflected light of the marks 69 and 70 of the both ends of the connection tape 67, and the detection signal is sent to the control apparatus 79. FIG.

The control device 79 that has received the detection signal outputs a control signal to the motor that drives both reels 3 and 17 of the bonding device 15 and starts outputting the drive pulse to the motor through the motor driver. . Then, the motor rotates in accordance with the number of pulses applied from the motor driver, and the adhesive tape 1 is moved by a distance corresponding to the length of the connecting tape 67 while moving the reels 3 and 17 at a speed faster than the normal speed. ) In the direction of unwinding.

As a result, the other adhesive tape 1 is automatically fed to the position of the heating press head 19, so that the start end 32 of the other adhesive tape 1 is The time for feeding out the connecting tape 67 can be saved until it is in position.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape reel A which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25 to apply an adhesive in which the resin and the conductive particles are mixed, dried in the drying furnace 29, and then wound up in the winder 31. . After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 and 7 are attached to the core from both sides, or the core of the side plate attached to the core is wound, And packed together, preferably, controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the invention described in claims 22 to 24 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above-described embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 24, the connecting tape 67 is recognized by making the width T of the connecting tape 67 narrower than the width W of the front and rear adhesive tape 1. In the bonding apparatus 15, the same light emitting portion and the light receiving portion as those of the first embodiment are provided at opposite positions of the adhesive tape 1. In this case, the light receiving portion receives the laser light transmitted through the narrow portion of the connection tape 67 to recognize the connection tape 67.

In the third embodiment shown in FIG. 25, a plurality of holes 53 are formed in the connecting tape 67 to recognize the connecting tape 67. Also in this case, the light receiving part receives the laser light transmitted through the hole 53 of the connection tape 67, thereby recognizing the connection tape 67.

In 4th Embodiment shown in FIG. 26, when unwinding of the one adhesive material tape 1 is complete | finished without connecting the adhesive material tapes 1 with a connection tape 67, the other adhesive material tape 1 is carried out. Is wound around the winding reel 17, and the adhesive tape 1 is replaced. Also in this case, since the attachment of the new adhesive tape reel to the adhesive device is unnecessary, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device is increased.

The invention described in claims 22 to 24 is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention according to claims 22 to 24. .

For example, in the above-described first and second embodiments, there may be any number of windings 2 and 2a without particular limitation.

In the first to third embodiments, the connecting tape 67 is optically detected. Alternatively, the magnetic tape may be wound around the connecting tape 67 to detect the magnetic tape.

Next, the invention according to claims 25 to 28 will be described.

These inventions relate to an adhesive tape for electrically fixing electronic components and circuit boards or circuit boards, and electrically connecting both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. A method of connecting a reel, an adhesive device, and an adhesive tape.

Next, the background of the invention according to claims 25 to 28 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used. Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve the productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape for electrode connection of this kind is about 1-3 mm in width, and the length of the tape wound on a reel is about 50 m.

When attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel wound around the adhesive tape is installed in the adhesive apparatus, the lead end of the adhesive tape is taken out, and the winding reel is installed. Then, the adhesive is pressed into a circuit board or the like from the substrate side of the adhesive tape unwound from the adhesive tape reel with a heating press head, and the remaining substrate is wound around the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of an electronic device has a problem that the frequency of replacement of an adhesive tape reel increases, and since labor takes for exchanging an adhesive tape reel, the improvement of the production efficiency of an electronic device cannot be aimed at.

In response to this problem, it is considered to increase the amount of adhesive per one reel and reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase the amount of winding, there is a risk of drift of the wound. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, and it is difficult to attach to the existing adhesive device, and there is a fear that the existing adhesive device cannot be used.

Therefore, the invention as recited in claims 25 to 28 provides an adhesive tape reel, an adhesive device, and a connection method which can simplify the replacement of the adhesive tape reel and can improve the production efficiency of electronic equipment. It is for the purpose of providing.

Next, although an embodiment of the invention as claimed in claims 25 to 28 will be described with reference to the accompanying drawings, first, referring to FIGS. 27A to 27C, FIG. 28, FIG. 4, FIG. 29, and FIG. The first embodiment of the invention according to claims 25 to 28 will be described. 27A to 27C are views showing an adhesive tape reel according to the first embodiment, FIG. 27A is a perspective view showing an adhesive tape reel, FIG. 27B is a front view in FIG. 27A, and FIG. 27C is a view in FIG. 27A. It is sectional drawing of a connection part, FIG. 28 is a schematic diagram which shows the crimping | bonding process of the adhesive agent in a bonding apparatus, and FIG. 29 is a perspective view which shows the use state of the adhesive agent in a PDP.

The adhesive tape reel A according to the present embodiment includes windings (hereinafter referred to as windings) 2 and 2a of the plurality of adhesive tapes 1, and the windings of the adhesive tapes are wound on the windings 2 and 2a. (3, 3a) is provided. Each reel 3, 3a is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. As shown in FIG. 28, the adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9. As shown in FIG.

Among the plurality of windings 2 and 2a, the adhesive tape wound around the terminal portion 30 of the adhesive tape (hereinafter, one adhesive tape) 1 and the other winding portion 2a wound on one winding portion 2 ( Hereinafter, the start end part 32 of the other adhesive material tape 1 is connected using the latching | hanging tool 76. As shown in FIG. The locking strip 76 is, for example, a cross-shaped locking pin having a substantially U-shape, and overlaps the end portion 30 of one adhesive tape 1 with the start end 32 of the other adhesive tape 1. The retaining pin is inserted in the overlapped portion to connect the two.

Further, in the present embodiment, the connecting portion 74 is connected to the termination portion 30 and the starting end 32 by the locking mechanism 76, as shown in Fig. 27C, and then the connecting portion 74 is taped. By returning 180 degrees in the longitudinal direction of, the locking zone 76 is covered with the adhesive tape 1.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape reel which concerns on this embodiment is demonstrated. As shown in FIG. 28, the adhesive tape reel A and the winding reel 17 are attached to the adhesive device 15, and the start end part 32 of one adhesive tape 1 is wound on the guide pin 22, and wound up. It installs in the reel 17 and draws out the adhesive tape 1 (arrow E in FIG. 28). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment, the adhesive agent 11 is crimped all over the periphery of the PDP 26, and the adhesive agent used at once It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 also increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound up by the winding reel 17 in a comparatively short time.

In this embodiment, when the unwinding of the one adhesive material tape 1 is complete | finished, the connection part 74 is peeled off from the cut-off damage part 75, and the other adhesive material tape 1 is continuously extracted. (FIG. 27B). In this embodiment, since the end part 30 of one adhesive material tape 1 and the start end 32 of the other adhesive material tape 1 are connected to the latching | hanging stop 76, one adhesive material tape ( When the unwinding of 1) ends, the feeding of the other adhesive tape 1 can be started continuously. Therefore, after the unwinding of one adhesive tape 1 is completed, the work of installing the new adhesive tape 1 on the winding reel 17 becomes unnecessary, and the production efficiency of the electronic device is increased. In addition, since the connecting portion 74 covers the locking portion 76 with the adhesive tape 1, the external appearance is good, and the locking portion 76 of the connecting portion 74 is in contact with the adhesive tape 1. The adhesive tape 1 can be prevented from being damaged.

In addition, as shown in FIG. 28, the bonding apparatus 15 is equipped with the thickness detection sensor as the connection part detection sensor 47, optically detects the connection part 74, and the connection part 74 heats and pressurizes. The part of the head 19 is skipped. The connecting portion 74 between one adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape 1, as shown in Fig. 27C, by detecting the difference in thickness. The connecting portion 74 is recognized. The thickness detection sensor 47 always detects the thickness of the adhesive tape 1, and transmits the detection signal to the control device 79.

Receiving the detection signal, the control device 79 outputs a control signal to the motor that drives both reels 3 and 17 of the bonding device 15, and starts outputting a drive pulse to the motor through the motor driver. . Then, the motor rotates in accordance with the number of pulses applied from the motor driver, and the predetermined distance corresponding to the length of the conveyance direction of the connecting portion 74 while rotating both the reels 3 and 17 at a speed faster than the normal speed. The adhesive tape 1 is moved in the direction in which the adhesive tape 1 is unwound.

Thereby, since the other adhesive tape 1 is conveyed to the position of the heating press head 19, the connection part 74 of one and the other adhesive tape 1 is a position of the heating press head 19. FIG. Can be prevented from being defective. Moreover, since one adhesive tape 1 is automatically wound up to the winding reel 17 until the connection part 41 passes the heating press head 19, the time of winding can be saved.

Further, the adhesive tape 1 is effective if the thickness detecting sensor 47 recognizes the front end portion 41a and the rear end portion 41b of the connecting portion 74 and allows only the connecting portion 74 to be skipped. Can be used.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25 to apply an adhesive, in which the resin and the conductive particles 13 are mixed, dried in the drying furnace 29, and then disked with a winder 31. Winding up. After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, side plates 7 and 7 are mounted on both sides of the core, and are packed together with the dehumidifying material, preferably It is released at low temperature (-5 ℃ ~ -10 ℃).

Next, another embodiment of the invention described in claims 25 to 28 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above-described embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In 2nd Embodiment shown in FIG. 30, the adhesive tape reel 2c provided with one winding part is used, without using the adhesive tape reel A provided with the some winding parts 2 and 2a. In this case, when the adhesive tape 1 is wound on the winding reel 17 and the end mark 28 is exposed on one adhesive tape 1, one adhesive tape reel 2b is replaced with a new adhesive tape reel ( In order to exchange with 2c), the end part 30 of one adhesive material tape 1 and the start end part 32 of the other adhesive material tape 1 are connected.

Also in this case, the connection part 74 is detected by the thickness detection sensor 77 as a connection part detection means, and the connection part 74 is made to skip the part of the heating press head 19. FIG.

The invention described in claims 25 to 28 is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention according to claims 25 to 28. .

For example, in the above-mentioned 1st and 2nd embodiment, the engaging strip 76 which connects adhesive tape 1 comrades is not limited to a latching pin, The elasticity whose cross section is substantially co-shaped in the part in which both overlapped is overlapped. It may be fixed to a deformable clip or a method of connecting the overlapped portions to a metal piece having a substantially U-shaped cross section and pressing the sandwich pieces from both sides of the overlapped portion to connect them.

In the first and second embodiments, the connection portion 74 is recognized by detecting the thickness of the connection portion 74 using the thickness detection sensor 47, but not limited thereto. Transmittance detection The connection portion 74 may be recognized by using a sensor, or the connection portion may be detected by using a CCD camera to accept the surface of the connection portion on a monitor screen and compare shades of pixels.

31A, 31B, and 32A to 32C show the support frame for fixing the lead frame and the semiconductor element, among the support substrate for fixing the lead frame, the support substrate for mounting the semiconductor element, or the adhesive tape connecting the die and the semiconductor element of the lead frame. An example of a LOC (Lead on Chip) structure for bonding and fixing a to a lead frame is shown.

The adhesive tape of the structure of FIG. 31A which adhere | attached the adhesive layer 80, such as the polyamide-imide-type adhesive layer of thickness 25micrometer, on both surfaces of support films 78, such as a polyimide film which surface-treated with a thickness of 50 micrometers, on both surfaces. By using the above, the semiconductor device of the LOC structure shown in Fig. 31B is obtained. The adhesive tape shown in FIG. 31A is punched into a single step using a punching die 87 (male type (convex portion) 95, female type (concave portion) 96) of the adhesive apparatus shown in FIGS. 32A to 32C. For example, a 0.2 mm-thick inner lead on a lead frame made of an iron-nickel alloy having a thickness of 0.2 mm is brought into contact with each other, pressurized for 3 seconds at a pressure of 3 MPa at 400 ° C., and pressed. To produce. Subsequently, in a separate step, the semiconductor element is pressed onto the adhesive layer surface of the lead frame with adhesive film for semiconductors for 3 seconds at a pressure of 3 MPa at a temperature of 350 ° C., and then the lead frame and the semiconductor element are wired with gold wires. Bonded and sealed by transfer molding using sealing materials, such as an epoxy resin molding material, and the semiconductor device as shown in FIG. 31B is obtained. In FIGS. 31A and 31B, 81 is an adhesive film for semiconductor punched from adhesive tape, 82 is a semiconductor element, 83 is a lead frame, 84 is an encapsulant, 85 is a bonding wire, and 86 is a bus bar. 32A, 32B and 32C are bonding apparatuses, in FIG. 32A and 32B, 87 is a punching die, 88 is a lead frame conveying part, 61 is adhesive tape punching, an attachment part, 90 is a heater part, 91 is an adhesive tape reel (Adhesive tape unwinding part), 92 are adhesive tapes (adhesive film for semiconductors), 93 are adhesive tape unwinding rollers. In Fig. 32C, 94 is an adhesive tape (adhesive film for semiconductor), 95 is a male type (convex portion), 96 is a female type (concave portion), and 97 is a film holding plate. The adhesive tape 92 is continuously unwound from the adhesive tape reel (adhesive tape unwinding portion) 91 and punched in a single step at the adhesive tape punching and attachment portion 89, and adhered to the lead portion of the lead frame, thereby providing a semiconductor. It is conveyed from a lead frame conveyance part as a lead frame with an adhesive film for resin. The punched adhesive tape is taken out from the adhesive tape unwinding roller 93.

In the same manner to the above, the semiconductor element is connected to the support substrate for semiconductor element mounting using an adhesive tape. Similarly, the die of the lead frame and the semiconductor element are connected and bonded. The adhesive tape may be made of only a case where the adhesive tape is simply adhered and fixed, an adhesive that electrically connects the electrodes to each other by contact or via conductive particles is used depending on the purpose, and a support film is used.

Next, the invention of Claims 29-34 is demonstrated.

These inventions relate to an adhesive tape for adhesively fixing an electronic component, a circuit board, or circuit boards and electrically connecting both electrodes, and in particular, a method for producing an adhesive tape, an adhesive tape wound in a reel shape, and It relates to a pressing method of the adhesive tape.

Next, the background art of the invention as described in Claims 29-34 is demonstrated.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed to each other and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding an adhesive tape coated with an adhesive onto a substrate in a reel form.

This type of conventional adhesive tape has a width of about 1 to 3 mm, a length of the tape wound on a reel is about 50 m, and the adhesive tape is unwound from the reel once and then used again after the adhesive is pressed onto a circuit board or the like. There is no work.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of the electronic device mentioned above has a problem that the reel which wound the adhesive tape increases, and since the labor of exchanging a new reel takes effort, the improvement of the production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesives per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is narrow because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase the amount of winding, there is a risk of drift of the wound. In addition, when the number of turns is increased, the pressure acting on the adhesive film wound on the tape increases, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also large, and it is difficult to attach to the existing bonding apparatus, and there is a fear that the existing bonding apparatus cannot be used.

Therefore, the invention of Claims 29-34 provides the provision of the adhesive tape which can increase the adhesive amount, the manufacturing method of an adhesive tape, and the crimping | bonding method of an adhesive tape, without increasing the number of turns of an adhesive tape. The purpose.

Next, although an embodiment of the invention according to claims 29 to 34 will be described with reference to the accompanying drawings, first, FIGS. 33A, 33B, 3, 4, 5, and 35 are referred to. In the meantime, the first embodiment of the invention according to claims 29 to 34 will be described. 33A and 33B are views of an adhesive tape, FIG. 33A is a perspective view of a reel wound with adhesive tape, FIG. 33B is a cross-sectional view taken along AA in FIG. 33A, and FIG. 34 is a perspective view showing the use state of the adhesive in the PDP. 35 is a cross-sectional view showing a step of applying an adhesive to a substrate.

The adhesive tape 1 which concerns on this embodiment is wound by the reel 3, and the reel 3 is provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 10 mm.

The adhesive tape 1 consists of the base material 9 and the adhesive agent 11 apply | coated on the base material 9, and on the base material 9, the adhesive agent 11 of 0.5 mm in width of a set is spaced apart. There are five sets.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It is not.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The conductive layer may be formed by, for example, coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. The reel 3 of the adhesive tape 1 and the empty reel 17 are attached to the bonding apparatus 15, and the tip of the adhesive tape 1 wound on the reel 3 is attached to the empty reel 17, The adhesive tape 1 is fed out (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, And one trillion adhesive 11 is pressed onto the circuit board. Thereafter, the remaining adhesive 11 is wound around the empty reel 17 together with the substrate 9.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. This connection arrange | positions the wiring circuit (or electronic component) 23 in the adhesive agent 11 crimped | bonded to the circuit board 21, and if necessary, interposes polytetrafluoroethylene material 24 as a cushion material, for example. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 34, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment is adhere | attached over the periphery of PDP, and the usage-amount of the adhesive agent 11 used at once is conventionally Compared to that much. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3 also increases, the adhesive tape 1 wound on the reel 3 is wound up to the empty reel 17 in a relatively short time, and the reel 3 becomes empty. .

When the reel 3 becomes empty, the reel 3 and the reel 17 are reversed, respectively, this time being wound around the hollow reel 3 to reverse the moving direction of the adhesive tape 1 (Fig. Triple arrow F).

In this manner, the winding directions E and F of the adhesive tape 1 are sequentially changed for each pair of the adhesive 11, and the adhesive 11 is pressed against the circuit board 21.

Here, with reference to FIG. 5 and FIG. 35, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The adhesive 11 which mixed resin and the conductive particle 13 was apply | coated to the base material (separator) wound from the unwinder 25, and after drying in the drying furnace 29, the winder 31 Wind the disc with). In the coater 27, as shown in FIG. 35, five coaters 27 are arrange | positioned with respect to the 10 mm width of the base material 9, and five sets of adhesive agents 11 are apply | coated in 10 mm width. The disk of the wound adhesive tape is cut to a predetermined width by the slitter 33 and wound around the core, and the side plates 7 and 7 are mounted on both sides of the core, or wound around the core with the side plates, They are packed together and are preferably released at a low temperature (-5 ° C to -10 ° C).

Next, although another embodiment of the invention described in Claims 29-34 is described, in embodiment described below, the same code | symbol is attached | subjected to the same part as embodiment mentioned above, The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In 2nd Embodiment shown to FIG. 36A-36C, the adhesive tape 1 is apply | coated the adhesive agent to the width | variety W on the whole single side | surface single side of a base material, and the adhesive agent is provided by the slit 35 formed in the longitudinal direction of the base material. It is separated into a plurality of sets in the width W direction. In the adhesive tape 1 of the second embodiment, the slit 35 immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is attached to the bonding apparatus 15. It is preferable to form in. In this case, the slit 35 may be formed in the adhesive 11 of the adhesive tape 1 which is provided by cutting blades in the vicinity of the reel mounting portion of the bonding apparatus 15 (indicated by S in FIG. 3). The thing which formed the slit in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 5 may be wound up to a reel, and you may form a slit immediately before winding up in the winding machine 31 after drying in a coating process.

When using the adhesive tape 1 which concerns on 2nd Embodiment with the bonding apparatus 15, the adhesive of one set separated by the slit 35 is heated from the base material 9 side similarly to 1st Embodiment. It is crimped | bonded by the pressurizing head 19, and it uses sequentially, as shown to FIG. 36A, 36B, 36C.

In this 2nd Embodiment, since a plurality of sets of adhesives 11 can be obtained only by forming the slit 35 in the adhesive agent on the base material obtained by the same process as before, manufacture is easy.

In 3rd Embodiment shown to FIG. 37A-37C, the adhesive agent 11 is apply | coated to the base material 9 in the whole surface (FIG. 37A), and the width W of the base material 9 and the adhesive agent 11 is implementation mentioned above. It is 5 to 1000 mm in the same manner as At the time of use, the adhesive tape 15 is mounted in the same manner as in the first embodiment, and the adhesive tape 1 drawn from the reel 3 is placed on the circuit board 21, and the adhesive tape 1 is By heating and pressing a part (one set) of adhesive agent in the width W direction (FIG. 37B), the cohesion force of the part is reduced, and only the adhesive agent of the heat-pressing part is separated from a base material and crimped to the circuit board 21. (FIG. 37C).

In this case, a cohesion declining line is formed along the peripheral line of the heating press head 19, so that the majority of the heat pressurized portion softens and flows (based on 1000 poise or less), and the curing reaction of the adhesive does not start or is low. It is preferable to set it as the state (20% or less of reaction rate is a reference | standard), and heating temperature is selected according to the adhesive system to be used.

According to this third embodiment, since the adhesive 11 softens and fluidizes one set of the width W at the time of use, and compresses it to the substrate circuit, the reel 3 of the adhesive tape 1 is the same as in the above-described embodiment. ) And an empty reel can be used multiple times by electrostatic and inverting.

In addition, as in the above-described embodiment, there is no need to form the slits 35 in the adhesive 11 or to separate a plurality of sets, and only to apply the adhesive 11 to the entire surface of one side of the wide base material. , The production of the adhesive tape is easy.

The 4th Embodiment shown to FIG. 38A-38C shows another manufacturing method of the adhesive tape which concerns on 1st Embodiment, and provided the slit 98 in the adhesive agent 11 apply | coated to the base material 9a. Subsequently (FIG. 38A), the other base material 9b is stuck on the adhesive agent 11 so that the adhesive agent 11 may be stuck to the base material 9a, 9b (FIG. 38B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and the adhesive baths 11a and 11b are arrange | positioned to each base material 9a and 9b by one space | interval. In this fourth embodiment, the adhesive baths 11a and 11b are alternately arranged on one and the other base materials 9a and 9b so that the adhesive baths 11a, By heating and pressurizing 11b) by one space | interval, you may filter out the adhesive bath 11a, 11b and arrange | positioning to each base material 9a, 9b.

The invention described in claims 29 to 34 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 29 to 34. .

For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive that does not disperse the conductive particles 13.

In the above-described embodiment, any number of the adhesives formed on the substrate 9 may be any number, and at least two or more sets may be used.

Next, the invention described in claims 35 to 41 will be described.

The present invention relates to an adhesive tape, a method for producing an adhesive tape, and a method for compressing an adhesive tape for adhesively fixing an electronic component and a circuit board or circuit boards and electrically connecting both electrodes.

Next, the background art of the invention as described in Claims 35-41 is demonstrated.

Generally, a method of bonding and fixing electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards to each other, and electrically connecting both electrodes. As the adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m. In the case where the adhesive is squeezed to the four circumferences of the circuit board, the adhesive tape is taken out along one side of the circuit board to squeeze the adhesive, and the adhesive circumference is performed on the four circumferences of the circuit board. It is squeezed.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area (circumference of one side) of a circuit board has increased, and the amount of adhesive used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of the electronic device mentioned above has the problem that the reel which wound the adhesive tape was replaced frequently, and since reel replacement takes time, production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesives per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reels, but since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, when the number of turns is increased, the pressure acting on the adhesive tape wound on the tape increases, which may cause the adhesive to seep out from both widths of the tape and cause blocking.

Therefore, the invention as claimed in claims 35 to 41 provides an adhesive tape capable of increasing the amount of adhesive without increasing the number of turns of the adhesive tape, a method for producing the adhesive tape, and a method for compressing the adhesive tape. The purpose.

Next, although an embodiment of the invention according to claims 35 to 41 will be described with reference to the accompanying drawings, first, reference is made to FIGS. 39A, 39B, 40, 34, 5, and 41. The first embodiment of the invention according to claims 35 to 41 will now be described. 39A and 39B are views of an adhesive tape, FIG. 39A is a perspective view of a reel wound with adhesive tape, FIG. 39B is a plan view of the adhesive tape of FIG. 39A seen from the adhesive side, and FIG. 40 is a view of the adhesive in the bonding apparatus. It is a perspective view which shows a crimping process.

The adhesive tape 1 which concerns on this embodiment is wound by the reel 3, and the reel 3 is provided with the core 5 and the side plate 7 arrange | positioned at both sides of the adhesive tape 1. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 1500 mm having approximately the same dimensions as one side of the circuit board.

The adhesive tape 1 consists of the base material 9 and the adhesive agent 11 apply | coated on the base material 9, and on the base material 9, the adhesive 11 whose width of a set is 0.5 mm is equidistantly spaced. It is provided in the width direction of the tape.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It is not.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such a resin include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins, vinyl ester resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. The reel 3 of the adhesive tape 1 and the empty reel 17 are attached to the bonding apparatus 15, and the tip of the adhesive tape 1 wound on the reel 3 is attached to the empty reel 17, The adhesive tape 1 is fed out (arrow E in FIG. 40). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, 1 trillion adhesive 11 is crimped | bonded to one side of the circuit board in the width direction of an adhesive tape, and the adhesive 11 is wound up to the empty reel 17 by the width | variety of the adhesive.

Next, the circuit board 21 is rotated about 90 degrees so that the adjacent sides of the circuit board 21 are positioned in the width direction of the adhesive tape 1 so that the adhesive 11 is circuitd by the heating press head 19. The other side of the board | substrate 21 is crimped | bonded. Thus, the adhesive 11 is crimped | bonded by rotating the circuit board 21 about 90 degrees, and the adhesive 11 is crimped | bonded over the four circumference | surroundings of the circuit board 21.

After the crimping (temporary connection) described above, the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned to make the main connection. In this connection, after the adhesive 11 is crimped on the four circumferences of the circuit board 21, the wiring circuit (or electronic component) 23 is disposed on the adhesive 11, and as necessary, for example, polytetra The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating press head 19 via the fluoroethylene material 24 (see FIG. 4). Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are fixedly connected.

As shown in FIG. 34, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment is adhere | attached over the periphery of PDP, and the usage-amount of the adhesive agent 11 used at once is conventionally Compared to that much. However, since the width W of the adhesive tape 1 is approximately equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 becomes wider, and even if the number of turns is the same as before, the amount of adhesive is extremely smaller than before. As there is much, reel exchange is particularly small than conventional one.

Here, with reference to FIG. 5 and FIG. 41, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The adhesive 11 which mixed resin and the conductive particle 13 was apply | coated to the base material (separator) wound from the unwinder 25, and after drying in the drying furnace 29, the winder 31 Wind the disc with). The coater 27 moves to the left and right to apply a coarse adhesive to the substrate 9 at equal intervals. After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 and 7 are attached to the core from both sides, or the side plate core is wound to the dehumidifying material. It is packed together with it, Preferably it is controlled by low temperature (-5 degreeC--10 degreeC), and it is released.

Next, another embodiment of the invention as set forth in claims 35 to 41 will be described. In the embodiment to be described below, the same parts as in the above-described embodiment are denoted by the same reference numerals. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 41, in the bonding apparatus 15, the adhesive tape 1 is attached to two places, and one adhesive tape 1 and the other adhesive tape 1 are mutually connected. We install in orthogonal direction. In one adhesive tape 1, the adhesive 11 is pressed against a pair of longitudinal sides N of the circuit board 21 facing each other (first step), and in the other adhesive tape 1 The adhesive agent 11 is crimped | bonded to a pair of opposite side edges M (2nd process), and an adhesive agent is crimped | bonded to the four circumference | surroundings of the circuit board 21 in two processes. In this second embodiment, the circuit board 21 arranged in the first step is directly replaced with the second step without rotating the direction of the circuit board 21 between the first step and the second step. By moving, the adhesive can be automatically pressed, and the work efficiency can be further improved. In this case, the circuit board 21 may be loaded on the conveyance belt and automatically conveyed.

In 3rd Embodiment shown to FIG. 42A-42C, the adhesive agent is apply | coated to width | variety W of the single side | surface single side | surface of a base material, and the adhesive agent is plural in a width W direction by the slit 35 formed in the width W direction of a base material. It is separated. In the adhesive tape 1 of this third embodiment, the slit 35 immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is attached to the bonding apparatus 15. It is preferable to form. In this case, the slit 35 may be formed in the adhesive 11 of the adhesive tape 1 which is provided by cutting blades in the vicinity of the reel mounting portion of the bonding apparatus 15 (indicated by S in FIG. 40). The thing which formed the slit in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 5 may be wound up to a reel, and you may form a slit immediately before winding up in the winding machine 31 after drying in a coating process. In addition, in each case, the cutting blade may reciprocate in the width W direction of the adhesive sheet 1.

Further, when using the adhesive tape 1 according to the third embodiment in the bonding apparatus 15, in the same manner as in the first embodiment, one set of adhesives separated by the slit 35 is placed on the substrate 9 side. It is crimped | bonded by a heating pressurizing head from a front end side, and is used sequentially.

In this 3rd Embodiment, since the several sets of adhesive agent 11 provided in the width direction can be obtained only by forming the slit 35 in the adhesive agent on the base material obtained by the same process as the past, manufacture is easy.

In the fourth embodiment shown in FIGS. 43A to 43C, the adhesive 11 is applied to the base material 9 on the single-sided front surface (FIG. 43A), and the width W of the base material 9 and the adhesive 11 is described above. In the same manner as in the embodiment, the circuit board has the same dimensions as the length of one side of the circuit board. At the time of use, it mounts similarly to 1st Embodiment, and heat-presses a part (one set) of adhesive agent in the width W direction of the adhesive tape 1 (FIG. 43B), and reduces the cohesion force of the part, Only the adhesive of the heated and pressurized portion is separated from the substrate and pressed onto the circuit board 21 (FIG. 43C).

In this case, a cohesion declining line is formed along the peripheral line of the heating press head 19, so that the majority of the heat pressurized portion softens and flows (based on 1000 poise or less), and the curing reaction of the adhesive does not start or is low. It is preferable to set it as the state (20% or less of reaction rate is a reference | standard), and heating temperature is selected according to the adhesive system to be used.

According to the fourth embodiment, the adhesive 11 can be press-bonded to the substrate circuit by softening and fluidizing one trillion portions in the width W direction only at the time of use.

In addition, as in the above-described embodiment, there is no need to form the slits 35 in the adhesive 11 or to separate a plurality of sets, and only to apply the adhesive 11 to the entire surface of one side of the wide base material. , The production of the adhesive tape is easy.

44A to 44C show another manufacturing method of the adhesive tape 1 according to the first embodiment, wherein the slit 98 is applied to the adhesive 11 applied to the substrate 9a. After formation (FIG. 44A), the other base material 9b is stuck on the adhesive agent 11 so that the adhesive agent 11 may be clamped on the base materials 9a and 9b (FIG. 44B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and the adhesive baths 11a and 11b are arrange | positioned to each base material 9a and 9b by one space | interval. In this fifth embodiment, the adhesive baths 11a and 11b are arranged from one base material 9a or 9b side so that the adhesive baths 11a and 11b are alternately arranged on one side and the other base materials 9a and 9b. The adhesive baths 11a and 11b may be adhere | attached on each base material 9a and 9b one by one by heat-pressing at intervals.

The invention described in claims 35 to 41 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 35 to 41. .

For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive that does not disperse the conductive particles 13.

Next, the invention of Claims 42-46 is demonstrated.

The present invention relates to a method of crimping an adhesive using an adhesive tape cassette and an adhesive tape cassette for adhesively fixing an electronic component, a circuit board, or circuit boards, and electrically connecting both electrodes.

Next, the background of the invention according to claims 42 to 46 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m. In the case where the adhesive is squeezed to the four circumferences of the circuit board, the adhesive tape is drawn out over one side of the circuit board to squeeze the adhesive, and the adhesive circumference is performed on the four circumferences of the circuit board. It is squeezed.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesive area (circumference of one side) of a circuit board has increased, and the amount of adhesive used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of the electronic device mentioned above, the reel which wound the adhesive tape increases, and since reel replacement takes time, the production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesives per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reels, but since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape and cause blocking.

Therefore, the invention of Claims 42-46 can increase the amount of adhesives without increasing the number of turns of an adhesive tape, and also the adhesive tape cassette and adhesive tape by which reel exchange can be simplified. An object of the present invention is to provide a method for compressing an adhesive using a cassette.

Next, an embodiment of the invention according to claims 42 to 46 will be described with reference to the accompanying drawings. First, FIGS. 45A, 45B, 46, 47, 4, 34, and FIG. With reference to 48, the 1st Embodiment of invention of Claims 42-46 is described. For convenience of explanation, the adhesive tape is described in the case where two sets of adhesives are arranged, but a plurality of sets may be formed. 45A and 45B are views of an adhesive tape cassette according to a first embodiment of the invention as claimed in claims 42 to 46, FIG. 45A is a perspective view of an adhesive tape cassette, and FIG. 45B is a view of FIG. It is AA sectional drawing, FIG. 46 is sectional drawing which shows the installation state of the reel in the tape cassette shown to FIGS. 45A and 45B, FIG. 47 is a front view which shows the crimping | bonding process of the adhesive agent in a bonding apparatus, FIG. It is a process chart which shows the manufacturing method of a tape cassette.

The adhesive tape cassette 100 according to the present embodiment is mainly composed of one reel 3, the other reel 17, and a case 99 for storing them, and one reel 3. The adhesive tape 1 is wound around, and the other end 9a of the adhesive tape 1 is fixed to the other reel 17.

An opening 11 is formed in one side of the case 99, and the adhesive tape 1 is drawn out from the opening 11. In addition, guides 13 and 13 for guiding the movement of the adhesive tape 1 are provided at both sides of the opening 11.

The case 99 is manufactured by fitting the half cases 99a and 99b, and the spool 17 provided in the bonding apparatus 27 (to be described later) on one and the other reels 3 and 5 (FIG. 46). Fitting) into each reel (3, 5).

Here, with reference to FIG. 46, the combination of each reel 3 and 5 and each reel 3 and 5 and the case 99 is demonstrated. Each reel 3, 5 is provided with a fitting tank 19 for fitting the spool 17 of the bonding device 27 to the inner circumferential side thereof, and rotatable to the protrusion 7c of the case 99 on the outer circumferential side thereof. Engaging holes 21 to be fitted together are formed.

As shown to FIG. 45B, the adhesive agent 11a, 11b is apply | coated to the adhesive tape 1 side by side in the width direction on the single side | surface of the base material 9. As shown to FIG. Each of the two sets of adhesives 11a and 11b are provided at intervals from each other.

In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 4 mm. The width of each set of adhesives 11a and 11b is about 1.2 mm.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It is not.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylics, vinyl ester resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. The formation of a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape cassette 100 which concerns on this embodiment is demonstrated. As shown in FIG. 47, the adhesive tape cassette 100 is attached to the bonding apparatus 27. As shown in FIG. The spools 17 and 17 (refer FIG. 46) for cassettes are provided in the bonding apparatus 27 at intervals, and the spools 17 and 17 are attached to each reel 3 and 5 of the adhesive tape cassette 100. As shown in FIG. Engage. Therefore, the adhesive tape cassette 100 can be mounted in one touch, and there is no need to install the other end 9a of the adhesive tape 1 wound on the reel to the empty reel as in the prior art.

Next, the adhesive tape 1 is taken out from the adhesive tape cassette 100 and crossed over the guides 31 and 31 of the bonding apparatus 27.

Then, the spool 17 of the bonding apparatus 27 is driven to draw out the adhesive tape 1 (in the direction of arrow E in FIG. 47), and the adhesive tape 1 is disposed on the circuit board 21 to heat the pressurized head. (19) presses the adhesive tape 1 from the base 9 side, presses one set of adhesive 11a on one side in the width direction to one side of the circuit board 21, and then presses the remaining adhesive 11b. ) And the base material 9 are wound on the other reel 17. In this way, the adhesive 11a is crimped | bonded over the four circumferences of the circuit board 21. FIG.

Then, after the adhesive tape 1 wound on one reel 3 is finished, the adhesive tape cassette 100 is removed once, and then it is mounted upside down to repeat the above-described steps. When an adhesive agent is formed in two or more sets in an adhesive tape, you may perform crimping | compression-bonding in order or space | interval by changing the position of the width direction.

After the crimping (temporary connection) described above, the electrodes 33a of the circuit board 21 and the electrodes 37a of the wiring circuit (electronic component) 37 are aligned and connected. In this connection, after the adhesive 11a is crimped on the four circumferences of the circuit board 21, the wiring circuit (or electronic component) 37 is arranged on the adhesive 11a, and as a cushion material, for example, polytetra The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the fluoroethylene material 39 to the circuit board 21 (see FIG. 4). Thus, the electrode of the circuit board 21 ( 33a) and the electrode 37a of the wiring circuit 23 are fixed.

As shown in FIG. 34, the connection part of the PDP 26 bonded using the adhesive tape cassette 100 which concerns on this embodiment adheres to the whole periphery of the PDP 26 in this embodiment. Therefore, the usage-amount of the adhesive agent 11 used at once becomes especially large compared with the conventional. However, since two sets of adhesives 11a and 11b are disposed on the width W in the adhesive tape 1, even if the number of windings is the same as before, the amount of adhesive is doubled, so that the number of exchanges of cassettes is reduced.

Moreover, since the adhesive tape 1 is used as the cassette 1, it is easy to replace, handle, and mount, and workability is good.

Here, with reference to FIG. 48, the manufacturing method of the adhesive tape cassette 100 which concerns on this embodiment is demonstrated.

After the coater 28 was apply | coated to the base material (separator) 23 unwound from the unwinder 25, the adhesive agent 11 which mixed resin and the electroconductive particle 30 was mixed, and after drying in the drying furnace 29, The disk is wound up by the winder 31. The coater 28 applies a large number of sets of adhesives to the substrate 9. After the raw material of the wound adhesive tape is cut into the predetermined width (the width which becomes two sets of adhesive bonds) by the slitter 33 in the finishing process, and wound up on the reel 3, the reel 3 and the empty reel 5 ) Is fitted to the half cases 99a and 99b to manufacture the adhesive tape cassette 100.

The adhesive tape cassette 100 is packed together with the dehumidifying material, and is preferably released at a low temperature (-5 ° C to -10 ° C).

Next, another embodiment of the invention described in claims 42 to 46 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 49, the adhesive 11 is pressed at one time over one side of the circuit board 21, and the adhesive apparatus 27 is attached to the adhesive tape 1 from the adhesive tape cassette 100. The guide 101 which draws out and arrange | positions) is provided. According to this 2nd Embodiment, since an adhesive agent can be crimped | bonded to the whole one side of the circuit board 21 at once, work efficiency is good.

In 3rd Embodiment shown in FIG. 50, the adhesive agent 11 is apply | coated with the width W on the single side whole surface of the base material 9, and the adhesive agent is isolate | separated into two sets by the slit 102. FIG. In the adhesive tape 1 of this third embodiment, the slit 102 presses the adhesive tape 1 onto the circuit board 21 after attaching the adhesive tape cassette 100 to the bonding apparatus 27. It is preferable to form immediately before. In this case, the slit 102 may be formed in the adhesive 11 of the adhesive tape 1 which is provided by cutting blades in the vicinity of the cassette mounting portion of the bonding apparatus 27 (indicated by S in FIG. 47). What wound up the slit in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 48 may be wound up to the reel 3, and in the coating process, the slit 102 is just before winding up with the winding machine 31 after drying. You may form.

In this third embodiment, since two sets of adhesives 11a and 11b can be obtained only by forming the slits 102 in the adhesive 11 on the substrate 9 obtained by the same process as in the related art, manufacturing is easy. Do.

In the fourth embodiment shown in FIGS. 51A and 51B, the adhesive 11 is applied to the base material 9 on the single-sided front surface (FIG. 51A), and the adhesive tape cassette 100 in which the adhesive tape 1 is accommodated is provided. To the bonding apparatus 27 in the same manner as in the first embodiment, and cohesive force of the portion by heating and pressing a part (one set) of the adhesive 11 in the width W direction of the adhesive tape 1. Is lowered, and only the adhesive 11a of the heat-pressed portion is separated from the substrate 9 and pressed onto the circuit board 21 (FIG. 51B).

In this case, the cohesive force reduction line 103 (FIG. 51A) is formed around the heating press head 19, and the majority of the heat pressurized portion softens and flows the adhesive (1000 poise or less) and hardens the adhesive. It is preferable that reaction is not started or it is set as the low state (reaction rate 20% or less is a reference | standard), and a heating temperature is selected according to the adhesive system to be used.

According to the fourth embodiment, the adhesive 11 can be crimped to the substrate circuit by softening and fluidizing one trillion 25a in the width W direction only at the time of use.

Next, the invention described in claims 47 to 49 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.

Next, the background of the invention according to claims 47 to 49 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching an adhesive tape to an adhesive apparatus, an adhesive tape reel (henceforth simply called "adhesive reel") is attached to an adhesive apparatus, the lead end of an adhesive tape is taken out, and it is attached to a winding reel. And the adhesive agent is crimped | bonded by a heating press head with the heating press head from the base material side of the adhesive tape unwound from the adhesive material reel, and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of an electronic device has a problem that the replacement frequency of an adhesive reel increases, and since it takes time to replace an adhesive material reel, the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape, causing blocking.

Moreover, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the conventional adhesive apparatus cannot be used.

Therefore, the invention of Claims 47-49 aims at providing the adhesive tape which can simplify replacement of an adhesive reel, and can aim at the improvement of the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, embodiment of invention of Claim 47-49 is demonstrated, referring an accompanying drawing.

A first embodiment of the invention according to claims 47 to 49 will be described with reference to FIGS. 52A, 52B, 3, 4, 29, and 5. 52A and 52B are views showing the connection of the adhesive tape according to the present embodiment, FIG. 52A is a perspective view showing the connection between the adhesive material reels, and FIG. 52B is a cross-sectional view showing the connection portion in FIG. 52A.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The base material 9 has a support layer 9b and a heat melter layer (hot melt layer) 9a sandwiched from both sides, and is a polyethylene that is a thermoplastic resin in the heat melter (hot melt) constituting the heat melter layer 9a. , SBS (styrene butadiene styrene block copolymer), nylon and the like, and for the support layer 9b, plastics such as OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), glass fibers, aramid Reinforcing fibers such as fibers and carbon fibers are used.

As the adhesive agent 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by covering the above-mentioned conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer nuclear material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the winding reel 17 were attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a was guide pin. It hangs on (22), is attached to the winding reel 7, and draws out the adhesive tape 1 (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 by this embodiment, the adhesive agent 11 is crimped | bonded over the periphery of the PDP 26, and the adhesive agent used at once It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 52A).

As shown in FIG. 52A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, the adhesive material of the reel 3a. The end part 30 of the tape (one adhesive tape) 1 and the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive material reel 3 are connected.

As shown in FIG. 52B, the connection of this adhesive tape 1 is the beginning of the terminal part 30 of the adhesive tape 1 of the adhesive material reel 3a, and the beginning of the adhesive tape 1 of the new adhesive material reel 3; About the part 32, the adhesive agent 11 surface of the start part 32 is overlapped with the heat-melting layer 9a of the base material 9 of the terminal part 30, and this part is placed on the table 104. As shown in FIG. Then, the portion overlapped with the heating press head 19 of the bonding apparatus 15 is heated to melt the hot melt layer 9a, and the hot melt solidifies by cooling to terminate the end 30 and the start end 32. ). Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work of attaching the adhesive tape 1 to the winding reel 17 is not necessary. Moreover, since only the base material 9 is mainly wound up in the winding reel 17, since some of the adhesive material reels can be wound, the replacement | recovery frequency of the winding reel 17 can be reduced, and work efficiency is good.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) unwound from the unwinder 25 to apply the adhesive 11 in which the resin and the conductive particles 13 are mixed and dried in the drying furnace 29. 31) wind the disc. After the raw material of the wound adhesive tape 1 is cut into a predetermined width by the slitter 33 and wound around the core, side plates are mounted on both sides of the core and packed together with a dehumidifying material, and preferably a low temperature ( -5 ℃ ~ -10 ℃) is controlled and released.

Next, another embodiment of the invention described in claims 47 to 49 will be described. In the embodiment to be described below, the same parts as in the above-described embodiment are denoted by the same reference numerals. The detailed description will be omitted, and differences from the above-described embodiment will mainly be described below.

In 2nd Embodiment shown in FIG. 53, in the base material 9 of the adhesive tape 1, the heat melter layer 9a is sandwiched by the support layer 9b. In this case, as shown in FIG. 3, in order to connect the adhesive tapes 1 to each other, the end part 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are used. In the butt position, the hot melt layer 9a is heated by the heating press head 19 of the bonding apparatus 15. When heated, the thermal melter seeps out of the thermal melter layer 9a, and the adhesive tapes 1 are connected by solidifying the thermal melter by cooling. Thus, since the heat flux layer 9a is pinched by the support layer 9b, the adhesive strength of the heat flux layer 9a by moisture absorption by moisture, adhesion | attachment, etc. of dust can be prevented from falling.

The invention described in claims 47 to 49 is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention according to claims 47 to 49. .

In 1st Embodiment, although the base material 9 is comprised from the support layer 9b and the three layers which sandwiched this from the both sides by the heat flux layer 9a, it is not limited to this, Four or more layers may be sufficient as it.

In this embodiment, although the heating press of the connection part used the heating press head 19 of the bonding apparatus 15, instead of the heating press head 19, a separate heater is used and the connection part is heated, and an adhesive material is used. The tapes 1 may be connected to each other.

Next, the invention described in claims 50 to 51 will be described.

These inventions are related to the adhesive tape which electrically fixes an electronic component, a circuit board, or circuit boards, and electrically connects both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. The connection method of the.

Next, the background art of the invention as described in claims 50-51 is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

In the conventional adhesive tape of this kind, in order to prevent an adhesive from sticking to a base material or to make it easy to peel, silicone treatment is given to both surfaces of a base material.

In the case of attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel (hereinafter simply referred to as an "adhesive reel") is attached to the adhesive apparatus, the lead end of the adhesive tape is taken out, and attached to the winding reel. And the adhesive agent is crimped | bonded by a heating press head with the heating press head from the base material side of the adhesive tape unwound from the adhesive material reel, and the remaining base material is wound up by the winding reel.

And when the adhesive tape of an adhesive reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, the new adhesive reel is attached to an adhesive device, and the beginning of an adhesive tape is attached to the winding reel.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of an electronic device increases the frequency of replacement | exchange of an adhesive material reel, and since it takes time to replace an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device cannot be aimed at.

In response to this problem, it is considered to increase the amount of adhesives per reel and reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reels, but the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape, causing blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the existing adhesive apparatus cannot be used.

Therefore, the invention as recited in claims 50 to 51 aims at providing an adhesive tape connecting method which can simplify the replacement of the adhesive reel and can improve the production efficiency of electronic equipment. .

EMBODIMENT OF THE INVENTION Next, embodiment of invention of Claim 50-51 is described, referring an accompanying drawing. First, with reference to FIGS. 54A-54C, 55, 56, 4, and 29, the 1st Embodiment of invention of Claim 50-51 is demonstrated. 54A to 54C are cross-sectional views showing the connection process of the connecting portion in FIG. 55, FIG. 54A shows the state of the adhesive tape before discharge, FIG. 54B shows the state of the adhesive tape after discharge, and FIG. 54C shows the connection. It is a figure which shows the heat compression of a part. Fig. 55 is a perspective view showing the connection of the adhesive reels to each other in the method of connecting the adhesive tape, and Fig. 56 is a schematic view showing the pressing process of the adhesive in the bonding apparatus.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), etc. from the surface of the strength and peelability of the adhesive agent 11, and the surface treatment is carried out with the release agent 9a. It is carried out. Examples of the releasing agent include low melting point waxes such as olefinic releasing agents, ethylene glycol montanic acid esters, carnaubaarrows and petroleum waxes, low molecular weight fluorocarbon resins, silicone or fluorine-based surfactants, oils, waxes, resins, polyester modified silicone resins, and the like. This is used, in particular silicone resins are common.

As the adhesive agent 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 56, the reel 3a of the adhesive tape 1 and the winding reel 17 were attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a was guide pin. It hangs on (22), is attached to the winding reel 17, and pulls out the adhesive tape 1 (arrow E in FIG. 56). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

FIG. 29 shows a connecting portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is pressed over the entire circumference of the PDP 26 and used at one time. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 55).

As shown in FIG. 55, in order to replace the reel 3a with the new adhesive material reel 3 to the adhesive tape 1 of the reel 3a, the adhesive tape (one adhesive tape) 1 of the reel 3a 1 ) And the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3.

As shown in FIG. 54B, this adhesive tape 1 is connected to the terminal 30 of the adhesive tape 1 of the used reel 3a at the irradiation position of the discharger 105. Then, the release agent 9a is removed by discharging the surface of the substrate 9.

And the adhesive agent 11 surface of the start end part 32 of the other adhesive tape 1 is superposed on the base material 9 surface from which the mold release agent 9a was removed (FIG. 54C). The overlapped portions of the two are placed on a table, and heated and pressurized by the heating press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary.

In this embodiment, since the heating press head 19 is used, the reel 3 and 3a by which the adhesive tape 1 was wound can be replaced without using the connection mechanism of adhesive tape 1 separately. Do. Moreover, since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels are wound, the replacement | recovery frequency of the winding reel 17 can be reduced, and work efficiency is good.

The invention described in claims 50 to 51 is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention according to claims 50 to 51. .

For example, in the above-mentioned embodiment, the release agent 9a of the base material 9 of one adhesive tape 1 after winding up is removed, and the adhesive 11 surface of the new adhesive tape 1 is removed in such a part. , The adhesives were heated and pressurized with the heat press head 19 to be bonded to each other, but the release agent 9a of the base material 9 of the new adhesive tape 1 was removed, and the winding was completed on such a portion. You may connect the surface of the adhesive agent 11 of the adhesive tape 1 overlapping them.

The method of removing the release agent 9a may be a method by ultraviolet irradiation or laser irradiation in addition to plasma discharge. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and the ultraviolet light is irradiated for a predetermined time from the mercury lamp. By. Moreover, in the case of laser irradiation, the release agent 9a is decomposed and scattered by the laser light irradiated by the laser oscillator, and the release agent 9a is removed.

In the above, the case where the electronic component, the circuit board, and the circuit board are bonded to each other has been explained. The same applies to the adhesive tape for the semiconductor device to be fixed.

Next, the invention described in claims 52 to 58 will be described.

These inventions are related to the adhesive tape which electrically fixes an electronic component, a circuit board, or circuit boards, and electrically connects both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. It's about reels.

Next, the background art of the invention as described in Claims 52-58 is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Moreover, adhesive tape is used for lead fixing tape, LOC tape, die-bonding tape, etc. of a lead frame, for example, a lead fixing tape fixes the lead pin of a lead frame, and improves the productivity and reliability of the lead frame itself or the whole semiconductor device. It is used to make

As electronic devices become smaller and lighter, semiconductor devices have a small size called microBGA (ball grid array) or CSP (chip size package) in which their external terminals are arranged in an area array below the semiconductor device (package). The development of the package of semiconductor is progressed, and these packages mount a semiconductor element (chip) via an adhesive agent on the support substrate for semiconductor element mountings, such as a glass epoxy board | substrate or a polyimide board | substrate which has a one-layer or multilayer wiring structure, and a semiconductor The terminal on the element side and the terminal on the wiring board side of the board are connected by a wire bond or flip chip method, and the connection portion and the upper or cross section of the chip are sealed with an epoxy encapsulating material or an epoxy liquid encapsulating material, and a solder ball or the like is provided on the back side of the wiring board. The structure in which the metal terminals of are arrange | positioned on an area array is employ | adopted. Adhesive tapes are also used for QFN (Quad Flat Non-1eaded Package), SON (Smll 0utline Non-1eaded Package), and the like. In addition, a method in which a plurality of these packages are surface-adhered in a high density by solder reflow method on a substrate of an electronic device is adopted. Furthermore, the die of the lead frame and the semiconductor element (chip) are mounted via an adhesive, and the terminal on the semiconductor element side and the lead frame terminal are connected by wire bond, and the connection portion and the chip upper surface portion or the end face portion are epoxy-based encapsulant or epoxy-based. It is sealed with a liquid encapsulant. Adhesive tape is also used for the adhesive of such a semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding a reel of an adhesive tape coated with an adhesive on a substrate as a method of electrically connecting the electrodes.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel obtained by winding the adhesive tape around the reel is installed in the adhesive device, the lead end of the adhesive tape is taken out, and the winding tape is attached to the winding reel. Then, the adhesive is pressed into a circuit board or the like from the substrate side of the adhesive tape unwound from the adhesive tape reel with a heating press head, and the remaining substrate is wound around the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of an electronic device becomes large, and since the frequency of replacement of an adhesive tape reel becomes large and it takes time to replace an adhesive tape reel, there exists a problem that the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, causing the adhesive to leak out from both widths of the tape, causing blocking, and increasing the diameter dimension of the reel, making it difficult to attach to existing adhesive devices. There is a fear that the existing adhesive device will not be available.

In addition, the adhesive tape reel may cause deterioration in quality due to dust or moisture when the adhesive tape is directly weathered to the outside air.

Therefore, the invention described in claims 52 to 58 provides an adhesive tape reel that can be easily replaced with an adhesive tape reel, which can improve the production efficiency of electronic devices and maintain the quality of the adhesive tape. It is for the purpose of providing.

Next, the embodiment of the invention according to claims 52 to 58 will be described with reference to the accompanying drawings as an example of the adhesive tape for electrode connection, but the same applies to the adhesive tape for semiconductor element connection. First, with reference to FIGS. 57A-57C, FIG. 3, FIG. 4, FIG. 29, FIG. 58, 1st Embodiment of invention of Claim 52-58 is demonstrated. 57A to 57C are views showing the adhesive tape reel according to the first embodiment, FIG. 57A is a perspective view showing the adhesive tape reel, FIG. 57B is a front view of FIG. 57A, and FIG. 57C is a view of FIG. 57A. It is a front view of the cover part material of FIG. 58, and FIG. 58 is process drawing which shows the manufacturing method of an adhesive tape.

The adhesive tape reel A according to the present embodiment includes the windings (hereinafter, the windings) 2 and 2a of the plurality of adhesive tapes 1, and the adhesive tape 1 is attached to the windings 2 and 2a. Is provided with the reels 3 and 3a wound thereon. Each reel 3, 3a is provided with side plates 7, 7a, 7b disposed on both width sides of the core 5 and the adhesive tape 1. As shown in FIG. 3, the adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9. As shown in FIG. In the unused (unused) winding part 2a, the cover member 8 which covers the periphery of the adhesive tape 1 wound on the reel 3a is detachably attached to the reel 3a.

Moreover, the accommodating part (storage space) 12 of the desiccant 10 is provided in the side plate 7a of the inside of the winding part 2, 2a, and the desiccant 10, such as a silica gel, is stored in the accommodating part 12. As shown in FIG. By storing, moisture in the unused winding part 2a is removed from the inside.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive agent 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3, the adhesive tape reel A and the winding reel 17 are attached to the bonding apparatus 15, and the start end part of one adhesive tape 1 is hooked on the guide pin 22, and wound up ( 17), and the adhesive tape 1 is taken out (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is pressed against the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment, the adhesive agent 11 is crimped all over the periphery of the PDP 26, and the adhesive agent used at once It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 also increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound up by the winding reel 17 in a comparatively short time.

When an end mark is exposed to the adhesive tape 1 of the one winding part 2, it replaces with the adhesive tape 1 of the new winding part 2a. In this embodiment, the cover member 8 is provided in the unused winding part 2a, and after removing this cover member 8, the adhesive tape 1 is extracted and attached to the winding reel 17. In FIG. .

Thus, when the unwinding of one winding part 2 is complete | finished, the adhesive tape 1 of the other winding part 2a is attached to the winding reel 17, and the adhesive tape 1 is exchange | exchanged, No attachment of a new adhesive tape reel to the device 15 is necessary. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

In addition, since the cover member 8 is provided in the unused winding part 2a, the adhesive tape 1 does not directly wind outside, and the adhesive tape 1 reduces the adhesive force by dust and moisture. It becomes difficult to produce a back. Therefore, even when the some winding parts 2 and 2a are provided, the fall of the quality of the adhesive tape 1 can be prevented by providing the cover member 8 in the unused winding part 2a.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 58, the manufacturing method of the adhesive tape reel A which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) unwound from the unwinder 25 to apply an adhesive, in which the resin and the conductive particles 13 are mixed, dried in the drying furnace 29, and then to the winder 31. Wind up the disc. After the raw material of the wound adhesive tape is cut into a predetermined width by the slitter 33 and wound around the core, side plates 7, 7a, and 7b are mounted on the core from both sides, and the cover member 8 is mounted. It is packed with a dehumidifying material, and it is controlled and released at low temperature (-5 degreeC--10 degreeC) preferably.

Next, another embodiment of the invention described in claims 52 to 58 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 59, the cover member 8 provided on the winding portions 2, 2a is provided with a take-out port 106 of the adhesive tape 1. In this case, since the adhesive tape 1 can be taken out from the outlet opening 106 of the cover member 8, it is possible to remove the cover member 8 of the wound portions 2, 2a from the wound portions 2, 2a. The adhesive tape 1 can be fed out directly.

In 3rd Embodiment shown to FIG. 60A and FIG. 60B, the winding parts 2, 2a, and 2b are separate, respectively, and perturbation is provided in the shaft 107 provided in the main body of the bonding apparatus 15 freely. And when the unwinding of one winding part 2 is complete | finished, the cap 108 provided in the front-end | tip of the shaft 107 is removed, and one winding part 2 is removed from the bonding apparatus 15. As shown in FIG. And after moving the other winding part 2a to an adhesion position and removing the cover member 8, the adhesive tape 1 of the other winding part 2a is wound around the winding reel 17, and an adhesive tape (1) is exchanged. In this case, since the some winding part 2, 2a, 2b is respectively separate, handling is easy.

In the fourth embodiment shown in FIG. 61, as in the third embodiment, the windings 2, 2a and 2b are respectively separated, and the side plates 7 and 7a of each of the windings 2, 2a and 2b are different. ) Are fitted to the bonding apparatus 15 by being fitted together. As shown in FIG. 61, the side plate 7a of the other winding part 2a is provided with the to-be-fitted part 110 whose cross section is substantially co-shaped, and the to-be-held body provided in the side plate 7 of one winding part 2 is shown. Both are connected by fitting the fitting part 49 to the to-be-fitted part 110 from the upper side. In the case of removing one winding portion 2 from which the unwinding is completed from the bonding apparatus 15, the fitting is released only by lifting one winding portion 2 upward, and one winding portion 2 can be easily removed. Can be.

The invention described in claims 52 to 58 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 52 to 58. .

For example, in the above-described embodiment, there may be any number of the winding portions 2 and 2a without particular limitation.

In the fourth embodiment, the side plates 7 and 7a are slid up and down to fit the one and the other winding parts 2 and 2a, but a fitting hole is formed in one side plate 7. The fitting protrusion may be provided on the other side plate 7a, and the fitting protrusion may be pushed into the fitting hole in the width direction of the tape to fit the both.

31A and 31B show bonding of a support frame for fixing a lead frame and a semiconductor element to the lead frame, among the supporting substrate for fixing the lead frame, the support substrate for mounting a semiconductor element, or an adhesive tape connecting the die and the semiconductor element of the lead frame. An example of a fixed lead on chip (LOC) structure is shown.

The adhesive material tape of the structure of FIG. 31A in which the adhesive layers 80, such as the polyamide-imide-type adhesive layer of thickness 25micrometer, were formed on both surfaces of support films 78, such as a polyimide film which surface-treated with a thickness of 50 micrometers, on both surfaces. By using the above, the semiconductor device of the LOC structure shown in Fig. 31B is obtained. Punching the adhesive tape shown in FIG. 31A using a punching die 87 (male type (convex portion) 95, female type (concave portion) 96) of the adhesive apparatus shown in FIGS. 32A to 32C in a single step. For example, a 0.2 mm-thick inner lead is placed on a lead frame made of an iron-nickel alloy with a thickness of 0.2 mm so as to be in contact with each other, pressurized for 3 seconds at a pressure of 3 MPa at 400 ° C., and adhered to an adhesive film for semiconductors. Build a lead frame. Next, in a separate step, the semiconductor element is pressed onto the adhesive layer surface of the lead frame with an adhesive film for semiconductors for 3 seconds at a pressure of 3 MPa at a temperature of 350 ° C., and then the lead frame and the semiconductor element are gold wired. Wire-bonded and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in Fig. 31B. 31A and 31B, 81 is an adhesive film for semiconductor punched from adhesive tape, 54 is a semiconductor element, 83 is a lead frame, 84 is an encapsulant, 85 is a bonding wire, and 86 is a bus bar. 32A, 32B and 32C are bonding apparatuses, in FIG. 32A and 32B, 87 is a punching die, 88 is a lead frame conveying part, 61 is adhesive tape punching, an attachment part, 90 is a heater part, 91 is an adhesive tape reel (Adhesive tape unwinding part), 92 are adhesive tapes (adhesive film for semiconductors), 93 are adhesive tape unwinding rollers. In Fig. 32C, 94 is an adhesive tape (adhesive film for semiconductor), 95 is a male type (convex part), 96 is a female type (concave part), and 97 is a film pressing plate. The adhesive tape 92 is punched out of the adhesive tape reel (adhesive tape unwinding portion) 91 in a continuous manner from the adhesive tape punching and the attachment portion 89, and is bonded to the lead portion of the lead frame, thereby adhering to the semiconductor. It is conveyed from a lead frame conveyance part as a lead frame with an adhesive film for resin. The punched adhesive tape is taken out from the adhesive tape unwinding roller 93.

In the same manner to the above, the semiconductor element is connected to the support substrate for semiconductor element mounting using an adhesive tape. Similarly, the die of the lead frame and the semiconductor element are connected and bonded. The adhesive tape may be made of only an adhesive and a case of simply adhering and fixing the adhesive, an adhesive for electrically connecting the electrodes to each other by contact or via conductive particles, depending on the purpose, and using a support film. .

Next, the invention described in Claim 59 will be described.

The present invention relates to an adhesive tool for crimping an electronic component, a circuit board, or circuit boards together with a circuit board by pressing an adhesive for electrically connecting both electrodes to the circuit board.

Next, the background of the invention according to claim 59 will be described.

Generally, as a method of adhesively fixing electronic components, such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and circuit boards and circuit boards, and electrically connecting the electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding an adhesive tape coated with an adhesive on a substrate in a reel form, and attaching a reel of the adhesive tape (hereinafter referred to as an "adhesive reel") to an automatic adhesive machine. Use is described.

The automatic bonding machine includes a mounting portion of an adhesive reel, a mounting portion of an empty reel, a heating press member provided between these reels, and a table on which the substrate is placed, and withdraws the adhesive tape from the adhesive reel onto the substrate. This pressurizes an adhesive tape from the back side of a base material, and presses an adhesive agent on a board | substrate.

However, the conventional automatic bonding machine is large in size, and there is a problem that it is difficult to change and operate the adhesive when the adhesive is partially pressed to the substrate, the area where the adhesive is pressed or the pressure bonding is large. .

On the other hand, apart from such a large-scale automatic bonding machine, there is a need for a mechanism that can be compactly and easily operated so that the adhesive can be pressed without using a large apparatus in the case of localized parts or pressure bonding. .

Therefore, the invention as claimed in claim 59 is aimed at providing an adhesive tool which is compact and can be operated by one hand and which can easily press the adhesive to a part of the substrate.

EMBODIMENT OF THE INVENTION Next, embodiment of invention of Claim 59 is described, referring an accompanying drawing. 62A and 62B are views of a splicer according to a first embodiment of the invention as claimed in claim 59, FIG. 62A is a perspective view of the splicer, FIG. 62B is a cutaway AA view of FIG. 62A, and FIG. It is a side view explaining the usage method of the bonding tool shown in FIGS. 62A and 62B, and FIG. 64 is a process chart showing the manufacturing method of the bonding tool.

The bonding tool 111 according to the present embodiment is mainly composed of one reel (supply reel) 3, the other reel (empty reel) 5, and a case 99 for storing them. The adhesive tape 1 is wound around one reel 3, and one end 9a of the adhesive tape 1 is fixed to the other reel 5.

The case 99 is formed in a dimension which can be grasped by one hand, and when viewed from the side, the case 99 has a substantially triangular shape in which an angle is curved, and is easy to hold. Opening 113 is formed in each part of the substantially triangular case 99, and the adhesive tape 9 is exposed from this opening 113. As shown in FIG.

Moreover, the heating member 114 protrudes in the opening part 113, and this heating member 114 is substantially triangular when viewed from the side, and it is extended out from the upper surface 13a to the lower surface 13b. The adhesive tape 1 is guided and the heat transfer plate 115 is provided on the lower surface side.

In the case where the shape of the heating member 114 is in the shape of a rod, and the adhesive tape 9 is taken out by covering the heating member 114 with the heat transfer plate 115, the heating member 114 is rotated to smooth the tape 9. It is possible to withdraw. In addition, it is preferable to provide polytetrafluoroethylene, silicone rubber, or both of them on the outer side of the heat transfer plate 115, since the pressure is uniformly applied when the adhesive 9 is pressed.

The case 99 is made by fitting the half cases 99a and 99b, and one and the other reels 3 and 5 are housed in the case. Furthermore, the guide 16 is provided in the case, and guides the movement of the adhesive tape 1. In addition, a plate-shaped guide is formed on one side of the bottom of either of the cases 99a or 7b, and the guide is pressed against the edge of the circuit board to press the adhesive onto the circuit board so that the adhesive can be pressed precisely along the circuit board. Can be.

One gear 116 is fixed to one reel 3 on the same shaft, and the other gear 117 is fixed to the same shaft on the other reel 17, and one gear 116 and When the other gear 117 is joined together and one reel 3 is rotated and the adhesive tape 1 is pulled out, the other reel 17 is rotated by the amount of drawing of the adhesive tape 1. Thus, the substrate 9 is wound up. Furthermore, the gear unit 118 is comprised by one gear 116 and the other gear 117.

In addition, a third case (power supply means) 119 for supplying electric power to the heating member 114 is provided on the side surface of the case 99. In the third case 119, a battery is stored, The adjustment circuit of the electric power supplied to the heating member 114 is accommodated. In addition, a power switch 120 is provided in the third case 119. The ON / OFF operation is possible by the finger of the hand holding the bonding tool 111.

62B, the adhesive agent 11 is apply | coated to the single side | surface of the base material 9. As shown to FIG.

In this embodiment, the adhesive tape 1 is about 20 m in length and width W is about 1.2 mm.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, a method of using the bonding tool 111 according to the present embodiment will be described. As shown in Fig. 63, the bonding tool 111 is held by one hand, and the power switch 120 is turned ON. Then, the opening 113 exposed by the adhesive tape 1 is pressed against the circuit board 27. Since the heating member 114 is provided in the opening part 11 in the base material 9 side of the adhesive tape 1, by pressing the adhesive tape 1 in the lower surface side of the heating member 114, The adhesive 11 is heated and pressed to the circuit board 27.

When the adhesive sphere 111 is pressed downward and proceeds to the front (arrow E in FIG. 63), the adhesive tape 1 is sequentially drawn out, and the heating member 114 proceeds in the E direction and the new adhesive 9 Is placed under the heating member 114 so that the adhesive 11 is sequentially pressed onto the circuit board 27.

In this way, when the adhesive tape 1 is pulled out from one reel 3, one reel 3 rotates, so that one gear 116 fixed to the same shaft of one reel 3 is rotated. The other gear 117 which rotates and rotates and rotates is wound around the base 9 after the adhesive 25 is peeled off on the other reel 17.

According to the present embodiment, when the adhesive 11 is desired to be pressed at an arbitrary position on the circuit board 27, the adhesive 11 can be simply pressed by simply holding the adhesive sphere 111 with one hand and proceeding. There is a number. In this way, the adhesive 11 can be easily pressed, for example, when pressing the electronic component (wiring circuit) 37 on the circuit board 27 or the like, or only a part of the circuit board 27. This is particularly effective when the electronic component (wiring circuit) 37 is crimped.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are aligned and connected. In this connection, after bonding the adhesive 11 to the circuit board 27, the electronic component (wiring circuit) 37 is placed on the adhesive 11, and a polytetrafluoroethylene material 39 is used as a cushioning material if necessary. ), The electronic component (wiring circuit) 37 is heated and pressurized by the heating press head 19 to the circuit board 27 (see FIG. 4). Thereby, the electrode 27a of the circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 are connected and fixed.

Moreover, since the adhesive tape 1 is accommodated in the case 99 and used as it is, it is easy to handle and good workability.

Here, with reference to FIG. 64, the manufacturing method of the bonding tool 111 which concerns on this embodiment is demonstrated.

After the coater 28 is applied to the base material (separator) 23 unwound from the unwinder 25, an adhesive in which the resin and the conductive particles 13 are mixed is applied, and after drying in the drying furnace 29, the winder ( 31) wind the disc. After the raw material of the wound adhesive tape is cut to a predetermined width by the slitter 33 in the finishing step and wound up on the reel 3, one reel 3 and the other reel (empty reel) 5 ) Is fitted to the half cases 99a and 99b, and the bonding tool 111 is manufactured by assembling and attaching the third case 119 in which the heating member 114 and the battery are stored.

The adhesive sphere 111 is packed together with the dehumidifying material, and is preferably released at a low temperature (-5 ° C to -10 ° C).

Next, the invention according to Claims 60 to 64 will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.

Next, the background art of the invention as claimed in claims 60 to 64 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

This type of conventional adhesive tape has a width of about 1 to 3 mm, a length of the tape wound on the reel is about 50 m, and the adhesive tape is once unwound from the reel and pressed again to press the adhesive onto a circuit board or the like. There is no case.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, in the manufacturing plant of an electronic device, since the frequency of replacement of an adhesive reel becomes large and it takes time to replace an adhesive reel, there exists a problem that the improvement of the production efficiency of an electronic device cannot be aimed at.

For this problem, it is considered to increase the amount of adhesive per one reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the thickness of the adhesive tape is thick, the number of turns per reel is increased. it's difficult.

In addition, although it is considered to reduce the thickness of the adhesive tape, since PET (polyethylene terephthalate) treated with silicon is used as the base material, there is a fear that if the thickness of the base material is reduced, defects such as sagging of the base material and cutting are likely to occur. have.

Therefore, the invention of Claims 60-64 aims at providing the adhesive tape which can increase the number of turns per reel, and can aim at the improvement of the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, embodiment of invention of Claim 60-64 is described, referring an accompanying drawing. 65A, 65B, 3, 4, 29, and 5 illustrate a first embodiment of the invention according to claims 60 to 64. FIG. 65A and 65B are views of the adhesive tape according to the first embodiment, FIG. 65A is a perspective view showing an adhesive reel, and FIG. 65B is an A-A cross-sectional view in FIG. 65A.

The adhesive tape 1 is wound on the reel 3, and the reel 3 is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1.

The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

The copper film (copper foil) was used for the base material 9. The thickness of the substrate 9 (indicated by S in FIG. 65B) is 10 μm, the tensile strength at 25 ° C. of the substrate 9 is 500 MPa, and the ratio of the thickness of the substrate 9 to the adhesive 11 of the substrate 9 (S / T) was 0.5 and the thickness of the adhesive agent 11 was 20 micrometers. The surface roughness R _max of the substrate 9 was 0.25 μm.

Moreover, what used aromatic polyamide film (mixtron) for the base material 9 was also produced. The thickness (S / T) of the thickness of the base material 9, the tensile strength, and the thickness with respect to the adhesive agent 11 of the base material 9 was produced like the copper film, respectively.

Next, the use method of the adhesive tape mentioned above is demonstrated. As shown in FIG. 3, the reel 3 of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is guided. It hanged on (22), it was attached to the winding reel 17, and the adhesive tape 1 was taken out (arrow E in FIG. 3). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive 11 was pressed onto the circuit board 21. Then, the base material 9 was wound up to the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 was heat-pressed to the circuit board 21 by the heating press head 19. As a result, the electrodes 21a of the circuit board 21 and the electrodes 23a of the wiring circuit 23 were connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment, the adhesive agent 11 is crimped | bonded all around the PDP, and the adhesive agent 11 used at once It is evident that the amount of used is significantly higher than in the prior art. Therefore, the usage amount of the adhesive tape 1 wound on the reel 3 also increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 17 in a relatively short time, and the reel 3 is empty. You lose.

When the reel 3 became empty, the used reel 3 and the new reel were replaced, and a new reel was attached to the bonding apparatus 15. Then, as described above, the adhesive 11 was pressed onto the circuit board 21, and the operation of winding the substrate 9 to the winding reel 17 was repeated.

As a result, the thing using the copper film for the base material 9, the thing using the aromatic polyamide film, and both were easy to handle similarly to the conventional adhesive tape 1, and there was no sagging or cutting | disconnection of the base material 9, either. . And as the thickness of the base material 11 became thin compared with the conventional product (50 micrometers), the number of turns of the adhesive tape became large, the frequency of reel replacement became small, and productivity improved.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) unwound from the unwinder 25 to apply the adhesive 11 in which the resin and the conductive particles 13 are mixed and dried in the drying furnace 29. 31) wind the disc. After the disk of the wound adhesive tape 1 is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 and 7 are attached to the core 5 from both sides, and together with a dehumidifier It is packed and is preferably controlled at low temperature (-5 ° C to -10 ° C) and released.

Furthermore, also in the case of 4 micrometers, 20 micrometers, and 25 micrometers copper film and aromatic polyamide film, the thickness of the base material 9 produced the adhesive tape 1, and actually used it as mentioned above, No defects such as sagging and cutting of (9) were generated.

Moreover, also about the case of the copper film and aromatic polyamide film which made ratio (S / T) of thickness with respect to the adhesive agent 11 of the base material 9 0.01, 0.05, 1.0, the adhesive tape 1 is produced, As described above, when actually used, no defects such as sagging of the base material 9 and cutting occurred.

Next, the invention according to Claims 65 to 66 will be described.

These inventions are related with the adhesive material formation method of the adhesive tape which adhesively fixes an electronic component, a circuit board, or a circuit board, and electrically connects both electrodes. The present invention also relates to a method of forming an adhesive material for an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element. It relates to a method for forming an adhesive of the adhesive tape reel wound with a.

Next, the background art of the invention as claimed in claims 65 to 66 will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used. Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve the productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m.

In the case of attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel (hereinafter simply referred to as "adhesive reel") is attached to the adhesive apparatus, the lead end of the adhesive tape is taken out, and attached to the winding reel. Then, the adhesive is pressed into a circuit board or the like from the substrate side of the adhesive tape wound from the adhesive reel with a heating press head, and the remaining substrate is wound around the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new adhesive reel and a new winding reel are mounted on the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesives used at one time has increased. In addition, since the use of the adhesive has also been expanded, the amount of the adhesive used has increased. For this reason, the manufacturing frequency of an electronic device becomes large, and since the replacement frequency of an adhesive material reel becomes large and it takes time to replace an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device is not aimed at.

In response to this problem, it is considered to increase the amount of adhesive per one reel by increasing the number of turns of the adhesive tape wound on the reel, and to reduce the frequency of reel exchange.However, when the number of turns of the adhesive tape is increased, the diameter of the reel adhesive tape wound is increased. The dimension (hereinafter referred to as "winding diameter") is also large, and it is difficult to attach to the existing adhesive device, there is a fear that the existing adhesive device can not be used.

Therefore, the invention as claimed in claims 65 to 66 is for the purpose of providing a method for forming an adhesive tape that can improve the production efficiency of an electronic device without increasing the wound diameter of the adhesive tape. do.

EMBODIMENT OF THE INVENTION Next, embodiment of invention of Claim 65-66 is described, referring an accompanying drawing. EMBODIMENT OF THE INVENTION The 1st Embodiment of invention of Claim 65-66 is demonstrated with reference to FIGS. 66A and 66B, 67, 68, 4, 29, and 5. FIG. 66A and 66B are views showing an adhesive material forming step of the adhesive tape according to the first embodiment, and FIG. 66A shows a step of overlapping each adhesive tape together to unify and winding one substrate onto a reel for winding. 66B is sectional drawing which shows the overlapping part of the adhesive agents in FIG. 66A, FIG. 67 is a schematic diagram which shows the process of forming the adhesive agent in a to-be-adhered body, and FIG. 68 wound the adhesive tape 4 is a cross-sectional view showing adhesion of circuit boards, FIG. 29 is a perspective view showing a state of use of an adhesive in a PDP, and FIG. 5 is a process chart showing a manufacturing method of an adhesive tape.

The adhesive tape 1 is wound around the reels 3 and 121, respectively, and the reel 3 and 121 are provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively. The adhesive tape 1 is comprised from the base material 9 and the adhesive agent 11 apply | coated to one side surface of the base material 9.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the strength and the peelability of an adhesive agent, it is not limited to these.

As the adhesive agent 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 66A, the reel 3 and 121 of the two adhesive tapes 1 and the reels 17 and 18 for winding are attached to the bonding apparatus 15 and wound on one reel 3. The tip of the adhesive tape 1 is hooked on the guide pin 22 to be attached to one winding reel 17, and the adhesive tape 1 is fed out (arrow E in Fig. 66A). Moreover, the front end of the adhesive tape 1 wound on the other reel 121 is also attached to the other winding reel 18, and the adhesive tape 1 is fed out.

The adhesive tape 1 drawn out from the reels 3 and 121 is formed by pressing rollers 122 disposed between the reels 3 and 121 and the heating press head 19. Put them together. And the base material 9 of the other adhesive tape 1 is wound up to the winding reel 18. As shown in FIG.

Then, one adhesive tape 1 is placed on the circuit board 21, the adhesive tape 1 is press-contacted from the substrate 9 side with the heating press head 19, and the adhesive 11 is a circuit as an adherend. It forms by crimping | bonding to the board | substrate 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned in the adhesive agent 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

FIG. 29 shows a connecting portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is pressed over the entire circumference of the PDP 26 and used at one time. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reels 3 and 121 also increases, and the adhesive tape 1 wound on the reels 3 and 121 is wound around the winding reels 17 and 18 in a relatively short time.

In this embodiment, the adhesive 11 of one adhesive tape 1 and the adhesive 11 of the other adhesive tape 1 in the step immediately before the adhesive 11 is crimped to the circuit board 21. ), The adhesive 11 is pressed onto the circuit board 21 after making the desired thickness of the adhesive 11, and thus the thickness of each adhesive tape 1 can be made half. Therefore, the number of turns of the adhesive tape 1 per reel can be increased, and the amount of adhesive usable in one replacement operation can be significantly increased. Therefore, the replacement work of the new adhesive tape 1 takes less time, and the production efficiency of the electronic device becomes high.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive 11 in which the resin and the conductive particles 13 are mixed is applied to a thickness of about half the normal length, and then, in the drying furnace 29. After drying, the disk is wound up with a winder 31. After the disk of the wound adhesive tape 1 is cut into the predetermined width by the slitter 33 and wound up to the core 5, the side plates 7 and 7 are attached to the core 5 from both sides, and dehumidification is carried out. It is packed together with the ash, and preferably released at a low temperature (-5 ° C to -10 ° C). Furthermore, the adhesive tape 1 may contain the hardening | curing agent mentioned later in the adhesive agent 11.

Next, another embodiment of the invention described in claims 65 to 66 will be described. In the embodiment to be described below, the same reference numerals are assigned to the same parts as the above embodiment. The detailed description of the parts will be omitted and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 69A, the adhesive tape 1a containing the curing agent and the conductive particles 13 in the adhesive 11a and the adhesive tape 1b not containing the curing agent and the conductive particles 13 are shown. Both production is performed, and as shown in FIG. 69A, the adhesive material tape 1a containing a curing agent or the like and the adhesive material tape 1b containing no curing agent or the like are overlapped and integrated, so that the overlapping is pressed onto the circuit board 21. You may also In this case, since the hardening | curing agent is contained only in the adhesive agent 11a of one adhesive material tape 1a, a hardening | curing agent is unnecessary for the adhesive agent 11b of the other adhesive material tape 1b. Therefore, low temperature management is unnecessary for the adhesive tape 1b of the adhesive agent 11b which does not contain a hardening | curing agent. Therefore, the number of adhesive tapes 1a requiring low temperature management can be reduced, and efficient management of transportation and storage of adhesive tapes can be performed.

Moreover, when an adhesive agent is an epoxy resin type, as a hardening | curing agent of an epoxy resin, an imidazole type, an amine imide, an onium salt, polyamines, a polymercaptan, etc. are mentioned.

Moreover, as shown to FIG. 69B, the electroconductive particle 13 is contained in the adhesive agent 11a of one adhesive tape 1a containing a hardening | curing agent, and it has a 2-layered constitution, and the electroconductive particle is not contained in the side to be crimped | bonded. Therefore, the conductive particles do not flow out between the circuits in which the conductive particles oppose each other with the flow of the resin, and the conductive particles 13 are reliably held between the electrodes 21a and the electrodes 23a in the case of heating and pressing. Can be.

The invention described in claims 65 to 66 is not limited to the embodiment described above, and various modifications can be made without departing from the spirit of the invention according to claims 65 to 66. .

In the first embodiment, although the conductive particles 13 are included in the adhesive 11, the adhesive 11 without the conductive particles 13 may be used.

In the above, the case where the electronic component, the circuit board, and the circuit boards are bonded to each other has been described. However, the semiconductor elements (chips) are bonded to the support frame for fixing the lead frame, the die for the lead frame, and the support substrate for the semiconductor element mounting. The same can be done for the semiconductor device to be fixed.

Next, the invention described in claims 67 to 72 will be described.

These inventions provide, for example, an electronic component such as a liquid crystal panel, a PDP panel, an EL panel, a bare chip mounting, and an electronic conductive material such as a circuit board and a circuit board, and for supplying an anisotropic conductive material for electrically connecting the electrodes. It relates to anisotropically conductive tapes, and in particular to the shape of the anisotropically conductive material.

Next, the background art of the invention as described in Claims 67-72 is demonstrated.

A method of connecting an electronic component, a circuit board, and a circuit board by an anisotropic conductive tape, by inserting an anisotropic conductive material, which is a film adhesive, between electrodes facing each other, and heating and pressurizing the connection between the electronic component, the circuit board, and the circuit board. It is supposed to. In the film adhesive, conductive particles for obtaining conduction between electrodes are mixed, and as the resin, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin and a photocurable resin are used (for example, Japanese Patent Application Laid-Open No. 55 -104007).

Moreover, the circuit connection method using the anisotropic conductive material which does not contain electroconductive particle but consists only of resin is also known (for example, refer Unexamined-Japanese-Patent No. 60-262430).

Typical resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, silicone resins and acrylic resins are known as thermosetting resins. In order to connect both a thermoplastic resin system and a thermosetting resin system, heating pressurization is required. In a thermoplastic resin system, resin is made to flow and the adhesive force with a to-be-adhered body is obtained, and in a thermosetting resin system, it is for further hardening reaction of resin. In recent years, from the standpoint of connection reliability, the mixed system of a thermoplastic resin and a thermosetting resin and a thermosetting resin system have become mainstream. In addition, photocurable resins that can be connected at low temperatures are also being used industrially.

Moreover, in recent years, in order to prevent the to-be-bent and droop of a to-be-connected body, the connection temperature at the time of the connection of an anisotropic conductive material is calculated | required. In addition, the demand for shortening the tact time at the time of connection is increasing with the expansion of the connection use of anisotropic conductive materials and the expansion of demand for liquid crystal panels, PDP panels, EL panels, bare chip mounting, and the like.

In addition, as connection demands and applications of anisotropic conductive materials expand, productivity as well as short-term connections are demanded. As the demand for liquid crystal panels, PDP panels, EL panels, and bare chip mounting increases, the use of anisotropic conductive materials is increasing. Han Hyun, along with the growing demand for large-screen flat panels, such as large-screen LCD panels and PDP panels, has also increased the amount used for one panel of anisotropic conductive materials. Conventionally, the anisotropic conductive material is supplied in the form of a reel in which a film-shaped adhesive is wound around and laminated with a circular core having a circular cross section, and the reel replacement time has hindered the improvement in productivity.

On the other hand, as the liquid crystal panel softens, narrowing of the anisotropic conductive material is progressing, and in the conventional reel shape wound on the same centrifuge, the winding of the wound occurs, and the yield in manufacturing process deteriorates. Was doing.

Claims 67-72 were made in view of the said fault, and contributed to the improvement of productivity by lengthening the interval of the exchange time of a reel, and also eliminating the fall of workability by the disturbance of the winding. It was an object of the present invention to provide an anisotropic conductive tape.

Next, embodiment of invention of Claim 67-72 is described.

FIG. 70: is a schematic diagram which shows 1st Embodiment of invention of Claim 67-72.

As shown in FIG. 70, the anisotropic electrically conductive material tape of this embodiment uses the anisotropic electrically conductive material which consists of a 2-layered structure of the film-form adhesive 11 and the base film (base material) 9 which peeled off both surfaces. It is formed by winding a plurality of times in a phase of failure in the longitudinal direction of), and FIG. 70 shows a supply mode of the anisotropic conductive material. In FIG. 70, side plates 7 are provided at both ends of the core 5. Moreover, the anisotropically conductive material tape consists of the film adhesive 11 which is an anisotropically conductive material apply | coated on the base film 9 and the base film 9, and in an anisotropically conductive material tape, Since it is used for connection, in order to prevent the foreign material and contamination of an inorganic and organic substance, the base film 9 becomes the outer side of an adhesive agent.

The connection using the anisotropic conductive material is required to improve the tact time, and the rapid transferability of the anisotropic conductive material is required. As described above, the anisotropic conductive material is wound several times in the longitudinal direction of the core material (the core) 5 with the side plate 7, laminated, and wound in a failure phase, so that the wound is not disturbed. It is possible to supply long anisotropic conductive materials. For this reason, the space | interval of the exchange time of an anisotropically conductive material tape can be lengthened, and productivity can be improved.

In the anisotropic conductive tape, the tensile strength of the base film 9 is preferably 12 kg / mm 2 or more, and the breaking elongation of the base film 9 is preferably 60 to 200%. As a result, since the base film 9 has strength and small sagging, in the process before transferring the film adhesive 11 constituting the anisotropic conductive material to a connection member such as a circuit board, the film adhesive ( 11) can be prevented from sagging, thinning, or narrowing in width. In addition, the thickness of the base film 9 is preferably 100 μm or less in consideration of handling and environment. Since the said effect becomes inferior when the base film 9 is thin, it is preferable that the thickness of the base film 9 shall be 0.5 micrometer or more.

Moreover, as the base film 9 used for the said anisotropic conductive tape, PP (polypropylene), OPP (stretched polypropylene) which carried out the silicone and fluorine peeling process from the peelable side of the adhesive which comprises an anisotropic conductive material with strength, Although PET (polyethylene terephthalate) etc. are used, it is not limited to these.

The peeling treatment of the base film 9 can be easily carried out by performing a silicon or fluorine treatment. If the peeling treatment is carried out only on one side of the base film 9, the difference in the releasability in the front and back of the base film 9 is different. It can design, and the back transfer with respect to the base film 9 can be prevented. In addition, when performing peeling process on both surfaces of the base film 9, silicone and a fluorine process are performed with respect to the film adhesive 11 surface, and it is made to have peelability on the film adhesive 11 surface.

As the film adhesive 11, the epoxy resin system which is a thermosetting resin system which has high reliability, the silicone resin system which aims at the low stress of an adhesive agent, and is effective in compatibility of an adhesive agent, and can be connected at low temperature and a short time more than these. Although what is a system type is used, the film adhesive 11 is not limited to these. As the radical adhesive 11, an acrylic adhesive is mainly used.

FIG. 71: is a schematic diagram which shows 2nd Embodiment of invention of Claim 67-72. In addition, in FIG. 71, the same code | symbol is attached | subjected to the same component as FIG. 70, and detailed description is abbreviate | omitted.

As shown in FIG. 71, the anisotropically conductive tape of this embodiment has two types of base films, and except for using the anisotropically conductive material of 1st Embodiment except having used the anisotropically conductive material comprised so that an adhesive agent might be stuck by these, Have the same configuration. That is, as shown in FIG. 71, the anisotropic electrically conductive material in this embodiment becomes a three-layered structure of the two types of base materials 9a and 9b which peeled the film-like adhesive agent 11 and the adhesive agent 11 surface. .

When the adhesive agent which comprises an anisotropic conductive material is soft, deformation | transformation of an adhesive agent by the following base film on the core side can be prevented.

Moreover, it is preferable that the tensile strength of the base film 9a, 9b which is the physical property value of the base film 9a, 9b shall be 12 kg / mm <2> or more, and the breaking elongation of the base film 9a, 9b shall be 60-200%. The same as in the case of the first embodiment. Thereby, physical strength is obtained to the base films 9a and 9b, and it is possible to prevent thinning and thinning in the width direction with the sagging of the film adhesive. In addition, it is preferable that the thickness of the base materials 9a and 9b be 100 micrometers or less, and, by this, handling and an environment can respond.

Moreover, in the said 1st and 2nd embodiment, if the film-form adhesive agent 11 which comprises an anisotropic conductive material does not have adhesiveness, and does not show a blocking phenomenon, the film-form adhesive agent 11 is used as a base film 9 or 9a. 9b) can be wound alone without failure.

EXAMPLES Next, although an Example is described, the invention as described in claims 67-72 is not restrict | limited to these Examples.

(Example 1)

(1) Production of anisotropic conductive film

A 30 wt% solution of ethyl acetate was prepared, and 5 vol% of Ni powder having an average particle diameter of 2.5 µm was added thereto. Then, 50 g of phenoxy resin (high molecular weight epoxy resin), 20 g of epoxy resin, and 5 g of imidazole were added to the ethyl acetate solution as a film forming material to obtain a solution for forming an adhesive. On the other hand, the base film which carried out the siliconization on both surfaces of the transparent polyethylene terephthalate film (breaking strength 25kg / mm <2>, breaking elongation 130%) of 50 micrometers in thickness was prepared. And the said solution was apply | coated to the single side | surface of this base film using the roll coater, it dried at 110 degreeC for 5 minutes, and the roll of the anisotropically conductive material film of thickness 50micrometer was obtained.

(2) Production of anisotropic conductive tape

Anisotropically 300m long by slitting the roll of said anisotropically conductive material film to width 1.5mm, winding it several times in the longitudinal direction of the core material (winding core) of diameter 48mm and width 100mm with a side plate, and winding it in a failure phase. A conductive tape was obtained.

When anisotropic conductive material, that is, anisotropic conductive tape, which is wound around this failure phase, is installed in an anisotropic conductive tape squeezing automatic machine and supplied with an anisotropic conductive material, good results are obtained in the transferability and elongation test of the anisotropic conductive material. In addition, the number of times of reel adhesion was reduced, and the repetition of the attachment work due to time required for attachment, transferability, and sagging of the adhesive was eliminated, and productivity was improved by these effects.

(Example 2)

In the same manner as in Example 1, a roll of an anisotropic conductive tape was produced. Then, a laminate of a base film and an adhesive was further laminated with a single polyethylene terephthalate base film having a thickness of 25 μm (break strength of 25 kg / mm 2 and elongation at break of 130%) so as to sandwich the adhesive with two base films. A roll of a three-layered anisotropic conductive film was obtained. Then, in the same manner as in Example 1, while winding the roll of this film at a width of 1.5 mm, an anisotropic conductive tape having a length of 300 m was wound around a core material (winding core) having a diameter of 48 mm and a width of 100 mm with a side plate. Got.

Also in Example 2, the favorable productivity similar to Example 1 was obtained.

(Example 3)

As in Example 1, except that a polytetrafluoroethylene film having a thickness of 50 µm (breakage strength of 4.6 kg / mm 2, elongation at break of 350%) was used in the same manner as in Example 1, a roll of the anisotropic conductive film was prepared. The 300-m length anisotropic conductive tape was obtained by winding a roll of this film with a width of 1.5 mm in the same manner as in Example 1, and winding the core material (wound) with a diameter of 48 mm and a width of 100 mm with a side plate. In this case too, it could be wound up to a length of 300 m.

(Comparative Example 1)

In the same manner as in Example 1, a roll of the anisotropic conductive film was obtained. Further, in the same manner as in Example 1, the roll of the film was wound in the same centrifugal shape on a conventional reel while slitting the roll of the film in a width of 1.5 mm. A transfer tape was obtained.

When the anisotropic conductive tape wound by this failure phase is installed in the anisotropic conductive tape squeezing automatic machine and the anisotropic conductive material is supplied, good results are obtained in the transferability and elongation test of the anisotropic conductive material. The number of times was three times higher than in the examples, and the time required for adhesion and the time used for adjustment were increased.

Therefore, the present invention can simplify the replacement of the adhesive reel, the adhesive tape connection method and the adhesive tape, the manufacturing method, the pressing method, the adhesive tape reel, the adhesive device, which can improve the production efficiency of the electronic device It is an object of the present invention to provide an adhesive tape cassette, an adhesive method using the same, and an anisotropic conductive tape.

The invention according to claim 1 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method, the terminal part of one adhesive tape is turned upside down, the adhesive surface of one adhesive tape and the adhesive surface of the other adhesive tape are overlapped, and the overlapping part of both is heated and crimped | bonded, It is characterized by the above-mentioned.

In the invention as set forth in claim 1, the end of the uncoiled adhesive tape and the start end of the newly attached adhesive tape are adhered using an adhesive of the adhesive tape to replace the adhesive reel. Of the new adhesive tape can be simplified. In addition, it is not necessary to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the new adhesive tape is replaced. Since the exchange time is short, the production efficiency of the electronic device is increased.

Since the end part of the adhesive tape in which unwinding | finished was completed was overturned, the adhesive surface of an adhesive tape and the adhesive surface of the adhesive tape to be newly attached are overlapped, and adhesiveness is high.

The heat bonding of the connecting portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is attached.

The invention according to claim 2 is characterized in that an end mark is attached to an end of one adhesive tape in the invention according to claim 1.

According to the invention described in claim 2, the same effect as that of the invention according to claim 1 can be achieved, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed. Since the part to be cut and connected can be connected easily and at the minimum necessary position, waste of the adhesive tape can be prevented.

The invention according to claim 3 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to the substrate. As a method, the beginning end of the other adhesive tape is attached to the base surface of the adhesive tape wound on the reel by the lead tape, and the tip end of one adhesive tape is turned over, and then the adhesive surface of the lead tape is turned on the one adhesive tape. It overlaps with the adhesive surface of the terminal part of the, and it overlaps and superimposes the overlapping part, It is characterized by the above-mentioned.

According to the invention as recited in claim 3, as in the invention as recited in claim 1, the attachment of a new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel is short. Therefore, the production efficiency of the electronic device is increased.

Furthermore, since the lead tape of the adhesive tape is adhered to the end of the adhesive tape after the unwinding and the starting end of the adhesive tape to be newly mounted, the adhesive tapes can be easily bonded.

The invention according to claim 4 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method, the starting end portion of the other adhesive tape is attached to the base surface of the adhesive tape wound on the reel by a lead tape, and the adhesive surface of the lead tape overlaps the adhesive surface of the terminal portion of one adhesive tape, and the overlapped portion. It is characterized by heating and pressing.

According to the invention as recited in claim 4, as in the invention as recited in claim 1, the mounting of a new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

Moreover, since it is not necessary to turn over the adhesive tape after completion of unwinding, it is possible to prevent the possibility that the winding may be disturbed when the adhesive tape is wound on the winding reel.

The invention according to claim 5 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to the substrate. As a method, it is characterized by overlapping the terminal end of one adhesive tape and the start end of the other adhesive tape and inserting and connecting a locking pin to both of the overlapping portions.

In the invention according to claim 5, since the end of the adhesive tape after the unwinding and the start end of the adhesive tape to be newly attached are fixed by the locking pin, the connection is simple. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

The invention according to claim 6 is an adhesive tape which connects one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method of connecting an adhesive tape connected using a locking member, the locking member has a click portion provided at one end and the other end and an elastic member provided between the click portion, Abutting the end of the adhesive tape with the end of the adhesive tape against the end of the adhesive tape, engaging the end of the adhesive tape with the click portion provided at one end of the locking member, and the end of the adhesive tape at the other end. The part is latched on the part, and both click parts are pulled by the elastic member.

According to the invention as recited in claim 6, one click portion of the locking member is held at the end of one adhesive tape, and the other click portion of the locking member is next to the start end of the other adhesive tape. By interlocking and connecting them mutually, connection is easy. Moreover, since the elastic member is provided between the one click part and the other click part, the elastic member is extended so that the other click part of the locking member can be locked at an arbitrary position of the start end of the other adhesive tape. As a result, the degree of freedom of connection is high.

In addition, since the ends of one adhesive tape and the other end of the adhesive tape are connected with each other, the tapes do not need to overlap each other and can be connected at the minimum position, thereby preventing waste of the adhesive tape. .

The invention according to claim 7 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. The method is characterized by overlapping an end portion of one adhesive tape and an end portion of the other adhesive tape, and fixing the overlapped portions to an elastically deformable clip having a substantially cross-shaped cross section.

According to the invention as recited in claim 7, the connection work is easy because the overlapped portion of the end portion of one adhesive material tape and the start end portion of the other adhesive material tape can be connected with a clip.

The invention according to claim 8, wherein the overlapping portion of one adhesive tape and the other adhesive tape overlaps the overlapping portion of one adhesive tape and the other adhesive tape, and the metal nipper having a substantially cross-shaped cross section. It sandwiches a piece, and presses a clamping piece from both sides of an overlapping part, it crushes, and it connects both.

According to this invention of Claim 8, since the clamping piece is pressed and crushed from both surfaces of an overlapping part, both are connected, and the connection strength of the overlapping part of an adhesive tape can be improved.

The invention according to claim 9 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method, the end part of one adhesive material tape and the start end part of the other adhesive material tape overlap the other adhesive surface on one base material surface, and the overlapped length of both is 2 to 50 times the width of the adhesive tape. It is characterized by the fact that it heat-presses and connects both in the range of.

In the invention as recited in claim 9, the end of the adhesive tape which has been terminated using the adhesive of the adhesive tape and the beginning of the adhesive tape to be newly attached are bonded to each other so that the adhesive reel is exchanged. Mounting of a new adhesive reel can be simplified. In addition, it is not necessary to replace the winding reel or to install the beginning of the new adhesive on the winding reel every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is shortened, and the production efficiency of the electronic device is increased.

If the length of the overlapped portion is 2 to 50 times the width of the adhesive tape, less than 2 times the sufficient connection strength is not obtained. If the length of the overlapped portion is larger than 50 times, the adhesive material used for the connecting portion becomes too large, and the adhesive wastes. Because it becomes.

The hot pressing of the connecting portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is mounted.

The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in the insulating adhesive, may be only an insulating adhesive, or may be a dispersion of insulating spacer particles in such adhesive.

The invention according to claim 10 is a connection of an adhesive tape connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method, the ends of one adhesive tape are bent in the direction in which the adhesive faces, the beginning ends of the other adhesive tape are bent in the direction in which the adhesive faces, and the bent portions of the adhesive tapes are overlapped and overlapped with each other, and the surfaces of both adhesive materials face each other. It is characterized in that the overlapped portion is heated and pressed.

According to the invention described in claim 10, the same effect as that of the invention according to claim 1 can be achieved, and at the same time, the end of one adhesive tape and the start end of the other adhesive tape are hooked with each other. At the same time, the connection strength is high because both connect the adhesive surfaces to each other.

The invention according to claim 11 is characterized in that an end mark is attached to an end of one adhesive tape in the invention according to claim 9 or claim 10.

According to the invention as recited in claim 11, the same effect as the invention as recited in claim 9 or claim 10 can be achieved, and the end of one adhesive tape can be carried out at the end mark portion. Therefore, since the part to which a connection work is performed can be easily understood and can be connected in the minimum position required, waste of an adhesive tape can be prevented. In addition, the end mark portion can be automatically detected, and the work efficiency can be increased by controlling the device or generating an alarm by the detection signal.

In the invention according to claim 12, in the invention according to any one of claims 9 to 11, the overlapped portions of one adhesive tape and the other adhesive tape are formed with irregularities. It is characterized in that it is inserted into one mold and the other mold engaged with the mold and heated and pressed.

According to the invention as recited in claim 12, the same effect as the invention as claimed in any one of claims 9 to 11 can be exhibited, and at the same time, irregularities are formed in the connecting portion. The area can be increased, and the connection strength in the tensile direction (length direction) of the adhesive tape can be increased by joining the uneven portions.

In the invention according to claim 13, in the invention according to any one of claims 9 to 11, a through hole is formed in an overlapped portion of one adhesive tape and the other adhesive tape. After that, it is characterized in that the overlapped portion is hot-pressed.

According to the invention described in claim 13, the same effect as that of the invention according to any one of claims 9 to 11 can be achieved, and a through hole is formed in the connecting portion. Since the adhesive penetrates into the inner circumference of the hole and the adhesive area by the adhesive increases, the connection strength can be further increased.

The invention according to claim 14 is an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is coated on a silicon substrate. A method of connecting two adhesive tapes by connecting the end portions of one adhesive tape and the beginning end portions of the other adhesive tape so as to overlap each other, and attaching the portions of the adhesive tapes on the surface of the silicon processing substrate with silicone adhesive tape. It is characterized by.

In the invention according to claim 14, an adhesive reel wound with one adhesive tape and a winding reel for winding up only the base material of the adhesive tape are attached to the adhesive device, which is terminated when the adhesive tape of the adhesive reel is finished. Connect the end of the adhesive tape (one adhesive tape) and the start end of the adhesive tape (the other adhesive tape) of the newly attached adhesive reel with a silicone adhesive tape, and attach a new adhesive reel in place of the finished adhesive reel. Mount on.

In the present invention, since the reel is exchanged only by connecting the finished adhesive tape and the new adhesive tape, the mounting of the new adhesive reel to the adhesive device can be simplified. In addition, it is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, or fasten the adhesive tape on the guide every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel takes less time. Will increase the production efficiency.

Since the base material of an adhesive tape is surface-treated with silicone, and also using a silicone adhesive for the adhesive tape to be used, since the difference of the surface tension of both is made small and adhesive force is raised, adhesion | attachment of both which was conventionally difficult can be implement | achieved.

The adhesive of the adhesive tape may be an anisotropic conductive adhesive in which conductive particles are dispersed in the insulating adhesive, may be only an insulating adhesive, or may be a dispersion of insulating spacer particles in these adhesives.

According to the invention according to claim 15, the silicone adhesive tape according to claim 14 is characterized in that the difference between the surface tension of the adhesive surface and the surface tension of the silicone-treated substrate of the adhesive tape is 10 mN / m (10 dyne / cm) or less.

According to the invention described in claim 15, the same effect as the invention according to claim 14 is achieved, and the surface tension of the pressure-sensitive adhesive surface in the silicone adhesive tape and the silicon treatment in the adhesive tape By making the difference with the surface tension of a base material below 10 mN / m (10 dyne / cm), strong adhesive force can be obtained and both can be reliably adhere | attached. Surface tension can be measured with a wet reagent or a contact angle.

The difference in surface tension between the silicone treatment base material of the adhesive tape and the adhesive face of the silicone adhesive tape is preferably 0 to 5 mN / m (5 dyne / cm). This is because the smaller the difference in surface tension is, the better the strength is over 10 mN / m (10 dyne / cm).

The invention according to claim 16 is characterized in that the silicone adhesive tape has an adhesive force of 100 g / 25 mm or more in the invention according to claim 2.

According to this invention of Claim 16, while exhibiting the same effect as the invention of Claim 2, in the connection of one and the other adhesive tape, silicone adhesion also to both adhesive surfaces. Since the tape can be adhered to each other, the adhesive tapes on one side and the other can be adhered (or adhered to) from both sides, whereby they can be adhered at high strength.

In particular, by making the adhesive force 100 g / 25 mm or more, adhesion | attachment with both adhesive surfaces of one and the other adhesive tape can be made stronger.

If the adhesive strength is large, strong adhesive strength can be obtained, but if it is smaller than 100 g / 25 mm, there is a fear that a predetermined strength cannot be obtained.

The invention according to claim 17 is, in the invention according to claim 16, the silicone adhesive tape according to claim 16 is used to terminate the end of one adhesive tape and the other adhesive tape. It is characterized by overlapping or abutting the starting ends and pasting and connecting them on both sides of both adhesive tapes.

According to the invention described in claim 17, the same effect as that of the invention according to claim 16 is achieved, and one and the other adhesive tape are connected on both sides thereof, thereby making the connection more firm. You can get it.

The invention according to claim 18, wherein the adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to the siliconized base material As a connecting method, both adhesive tapes are connected by sandwiching a silicone adhesive tape coated with a silicone adhesive on both sides between the end portion of one adhesive tape and the start end portion of the other adhesive tape. A difference from the surface tension of the substrate is 10 mN / m (10 dyne / cm) or less, and the adhesive strength is 100 g / 25 mm or more.

According to the invention described in claim 18, since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, since the double-sided silicone pressure-sensitive adhesive tape can be sandwiched between one and the other adhesive material tapes, both of them can be bonded (or adhered to). Both connections are simple and easy.

The invention according to claim 19 is a connection of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, to which an adhesive for electrode connection is applied to a substrate. As a method, the terminal end of one adhesive tape and the start end of the other adhesive tape are overlapped or abutted, and the pasty resin adhesive is pasted or overlapped, thereby curing the pasty resin adhesive. It characterized in that to connect.

In the invention described in claim 19, the end portion of the adhesive tape after the unwinding and the start end portion of the adhesive tape to be newly attached are fixed with a paste-like resin adhesive, so that the connection is simple. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is needed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

Since a resin adhesive is stuck in the overlapping part or the butt | matching part of the terminal part of one adhesive material tape, and the starting end part of the other adhesive material tape, the freedom degree of connection is high.

The invention according to claim 20 is the invention according to claim 19, wherein the resin adhesive is made of at least one material selected from the group of thermosetting resins, photocurable resins, and hot melt adhesives. do.

According to the invention described in claim 20, the same adhesive effect as in the invention described in claim 19 is achieved, and the adhesive tape is selected from the group of thermosetting resins, photocurable resins, and hot melt adhesives as resin adhesives. The resin adhesive suitable for the connection of each other can be selected, and the connection strength of adhesive tapes can be raised.

The invention according to claim 21 is characterized in that the bonding apparatus to which the adhesive tape is mounted is provided with a charger for supplying the resin adhesive according to claim 19 or claim 20.

According to the invention described in claim 21, a charger for supplying the resin adhesive according to claim 19 or claim 20 is provided in the bonding apparatus, so that a charger needs to be prepared separately. There is no waste of connection work.

Furthermore, in the bonding apparatus, in addition to a charger, in order to harden a thermosetting resin, you may be equipped with the ultraviolet-ray for light-irradiating a heater or photocurable resin.

The invention according to claim 22 is an adhesive tape reel obtained by winding an adhesive tape coated on a base material with an adhesive for electrode connection to a reel, wherein the adhesive tape reel is formed by winding the winding portion of the adhesive tape in the width direction of the tape. It is characterized by providing a plurality.

In the invention according to claim 22, since a plurality of windings (winding portions) of the adhesive tape are provided, when the unwinding of the adhesive tape wrapped around one winding portion among the plurality of windings ends, the neighbor of the winding portion where the unwinding is finished The adhesive tape of the other winding part which was arrange | positioned at is installed in the winding reel.

In this way, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is replaced, so that a new adhesive tape reel is not attached to the adhesive device. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

Since the adhesive tape wound around a plurality of windings can be used sequentially, the amount of adhesive that can be used in one replacement operation can be greatly increased without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the so-called blocking of the adhesive tapes which have been wound up and leaked in the width direction of the tape and adhere to each other. Since the base material is lengthened, it is possible to prevent damage such as sagging of the base material, which is likely to occur.

In the invention according to claim 23, in the invention according to claim 22, a connecting tape for connecting both is connected between the end of one adhesive tape and the start end of the other adhesive tape. It is equipped, and when the unwinding of one adhesive tape is complete | finished, feeding out of the other adhesive tape is started, It is characterized by the above-mentioned.

According to the invention described in Claim 23, the same effect as that of the invention according to Claim 22 can be achieved, and the end of one adhesive tape and the start end of the other adhesive tape are the connection tape. Since it is connected to, since the unwinding of the adhesive tape of one winding part is complete | finished, the work which attaches the adhesive tape of the other winding part to a winding reel becomes unnecessary, and the production efficiency of an electronic device becomes higher.

The invention according to claim 24 is provided between the adhesive tape reel of the claim 23, the winding reel of the adhesive tape, and the adhesive tape reel and the winding reel. An adhesive apparatus having a crimping part for crimping an adhesive of a tape to a circuit board of an electronic device and a tape detecting means for detecting a connecting tape. When the tape detecting means detects the connecting tape, the connecting tape passes through the crimping part. It is characterized by winding the connecting tape on the winding reel until.

According to the invention described in Claim 24, the connecting tape is automatically wound on a winding reel. Therefore, after the adhesive tape of one winding part is finished, the adhesive tape can be sequentially fed from the next winding part.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, thereby reducing the labor of winding up.

Moreover, as a tape detection means, for example, an adhesive apparatus is provided with a pair of light emitting part and a light receiving part, and optically detects a connection tape. On the other hand, both ends of the connection tape are provided with marks (for example, black) that give color, and the light receiving unit detects the marks on both ends of the connection tape by the laser light emitted from the light emitting part, thereby determining the connection tape. In addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape and a method of forming a plurality of holes in the connecting tape may be used.

The invention according to claim 25 is an adhesive tape reel in which an end portion of one adhesive tape and a start end portion of the other adhesive tape are connected using a gage tool, and the connection portion is formed of an adhesive tape. It is characterized by covering the base region.

In the invention according to claim 25, the end portion of the unbonded adhesive tape and the start end portion of the adhesive tape to be newly mounted are connected using a gating aperture, and the adhesive tape reel is exchanged. Of the new adhesive tape reel can be simplified. In addition, it is not necessary to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape reel is performed. It takes less, and the production efficiency of an electronic device becomes high.

Since an adhesive tape can be used one by one, the amount of adhesive which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the so-called blocking of the adhesive tapes sticking out in the width direction of the tape and adhering the adhesive tapes together. By increasing the length, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

In addition, since the connecting portion between the end of one adhesive tape and the starting end of the other adhesive tape covers the locking zone with the adhesive tape, the appearance of the connecting zone is in contact with the adhesive tape. The adhesive tape can be prevented from being damaged, or components such as a heating press head and a support of the adhesive apparatus are not damaged by the locking mechanism.

Further, as a method of covering the gage strip with the adhesive tape, after connecting the end portion of one adhesive tape and the start end portion of the other adhesive tape at the gage strip, the connection portion is returned by 180 degrees in the longitudinal direction of the tape. It is preferable to cover the earth with adhesive tape.

In addition, the connecting portion may be wound with another adhesive tape so as to cover the locking portion.

The invention according to claim 26 is provided between the adhesive tape reel according to claim 1, the winding reel of the adhesive tape, and the adhesive tape reel and the winding reel. A bonding apparatus comprising a crimping portion for crimping an adhesive material on a circuit board of an electronic device and a connecting portion detecting means for detecting a connecting portion of the tape. It is characterized in that one side of the adhesive tape is wound on the reel until the part passes.

According to the invention described in claim 26, if the connecting portion detecting means detects the connecting portion, one adhesive tape is wound around the winding reel until the connecting portion passes the crimping portion. As a result, a defect in which the crimping operation is performed can be prevented. Moreover, since one adhesive tape is automatically wound up to a winding reel until a connection part passes a crimping | compression-bonding part, the labor of winding can be saved.

The invention according to claim 27 is the invention according to claim 26, wherein the connection portion detecting means is any one of a CCD camera, a thickness detection sensor, and a transmittance detection sensor.

According to the invention as claimed in claim 27, the same effect as that of the invention as claimed in claim 26 can be achieved, and the connection portion can be detected with a simple configuration. The precision can be increased.

For example, when a CCD camera is used as the connection part detecting means, the connection part is detected by taking the surface of the connection part into the monitor screen and comparing the shades of pixels. In addition, when the thickness detection sensor is used, since the thickness of a connection part is larger than the thickness of an adhesive tape, the connection part is detected by comparing the change of thickness. In addition, when the transmittance sensor is used, the connection portion has a thicker thickness, and since there is a locking region, the transmittance is lowered, and the connection portion is detected by comparing the values of the transmittance.

The connection method of the adhesive tape of Claim 28 connects the terminal part of one adhesive tape and the start end of the other adhesive tape using a latching | difference, and a connection part covers a latching | ditching strip with an adhesive tape. It features.

In the invention described in claim 28, the end portion of the unbonded adhesive tape and the start end portion of the adhesive tape to be newly mounted are connected to each other using a gating aperture, and the adhesive tape reel is exchanged. New adhesive tape reel can be easily mounted. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape reel is performed. It takes less, and the production efficiency of an electronic device becomes high.

Since an adhesive tape can be used one by one, the amount of adhesive which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the so-called blocking of the adhesive tapes that have leaked out in the width direction of the tape and adhere to each other. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

In addition, since the connecting portion between the end of one adhesive tape and the starting end of the other adhesive tape covers the locking zone with the adhesive tape, the appearance of the connecting zone is in contact with the adhesive tape. It is possible to prevent the adhesive tape from being damaged or to damage the components such as the heating press head and the support of the bonding apparatus with the latch.

Further, as a method of covering the gage strip with the adhesive tape, after connecting the end portion of one adhesive tape and the start end portion of the other adhesive tape to the gage strip, the connecting portion is returned by 180 degrees in the longitudinal direction of the tape. It is preferable to cover the earth with adhesive tape.

In addition, the connecting portion may be wound with another adhesive tape so as to cover the locking portion.

The invention according to claim 29 is an adhesive tape coated on a reel with an adhesive applied to a base material, wherein a plurality of sets of adhesives are disposed on the base material in the longitudinal direction of the tape.

In the invention according to claim 29, in the use of the adhesive tape, a reel and an empty reel wound with the adhesive tape are attached to the bonding apparatus, and the substrate is wound on the empty reel after heat-pressurizing the adhesive onto the circuit board. Mount it.

In the case where the adhesive is heated and pressurized to the circuit board, one group of a plurality of sets of adhesives provided in plural in the width direction of the base material is pressed against the circuit board, and the remaining adhesive bath after the pressing is wound on an empty reel together with the base material. And after dispensing of adhesive tape from a reel is complete | finished, the rotation direction of a reel is reversed and the supply direction of an adhesive tape is reversed. In this manner, after the adhesive is used for each pair, the remaining adhesive and the base are wound up, and the remaining adhesive bath is used sequentially. Therefore, since a plurality of sets of adhesives can be used one by one, the amount of adhesives that can be used in one reel can be greatly increased (two times or more) without increasing the number of turns of the tape.

According to the present invention, the amount of adhesive to be used can be significantly increased without increasing the number of turns of the adhesive tape. Moreover, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tapes sticking out in the width direction of the tape and bonding between the tapes. The elongation of the base material can prevent the damage (damage or cutting of the base material), such as sagging of the base material.

In the manufacturing plant of an electronic component, since the replacement | exchange frequency of a new adhesive tape becomes small, manufacturing efficiency becomes high.

Moreover, in manufacture of an adhesive tape, since the adhesive amount per 1 reel can be increased, the usage-amount of a reel material and a damp prevention material can be reduced, and a manufacturing cost can be reduced.

In addition, since after pressing the first set of adhesives, the adhesive tape is wound on an empty reel and then the next set of adhesives is used, the two reels attached to the bonding apparatus may be replaced without reversed the rotation direction.

The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be one in which insulating spacer particles are dispersed in such an adhesive.

The width of the substrate is preferably 5 mm to 1000 mm, but is arbitrarily selected by the width of a set of adhesives or the number of adhesives. As for the width of one set of an adhesive agent, 0.5 mm-10.0 mm are preferable.

If the width of the substrate is less than 5 mm, the width of the substrate is limited to the number of adhesives and the width of the adhesive provided on the substrate, and if the width of the substrate is larger than 1000 mm, it cannot be attached to an existing adhesive device. Because there is a fear.

In the invention described in Claim 30, in the invention according to Claim 29, a plurality of sets of adhesives are spaced apart from each other by an adhesive group.

According to the invention described in Claim 30, the same effects as in the invention according to Claim 29 are exhibited, and neighboring adhesive vests are separated, so that the adhesive can be easily pressed one by one. .

In the invention described in claim 31, the invention according to claim 29 is characterized in that the adhesive is separated into a plurality of sets by slits formed in the longitudinal direction of the tape.

According to the invention as claimed in claim 31, the same effect as in claim 29 is achieved, and the adhesive is applied to the entire surface of one side of the substrate, and immediately before the adhesive is pressed onto the circuit board. That is, it is preferable to form a slit by inserting cutting gold into the adhesive with a cutting knife or the like immediately before using the adhesive tape.

In addition, the slits may form cutting slits by engraving cutting gold into the adhesive with a cutting knife or the like during the production of the adhesive tape.

The slit may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

According to the present invention, it is possible to increase the number of the adhesive baths arranged on the substrate.

The invention according to claim 32 is a method for producing an adhesive tape coated on a reel with an adhesive applied to the substrate, wherein the adhesive is placed on the substrate surface continuously conveyed from an applicator disposed at intervals in the width direction of the substrate. By supplying, plural sets of adhesives were apply | coated to a base material, It is characterized by the above-mentioned.

According to this invention of Claim 32, the adhesive tape of Claim 30 can be manufactured using existing equipment.

The applicator may be a roll provided in plural in the width direction of the substrate, or may be a nozzle.

The invention according to claim 33 is a method for producing an adhesive tape wound on a substrate by applying an adhesive to the substrate, wherein the adhesive is applied to the entire surface of one side of one substrate, and then the longitudinal slits are formed on the adhesive. After that, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one substrate and the other substrate, and then one substrate and the other substrate are separated from each other, and a plurality of substrates are formed on each of the one substrate and the other substrate. The adhesive agent of a tank is alternately adhere | attached, and what arrange | positioned the some group adhesive agent at intervals on one side and the other base material is produced.

According to this invention of Claim 33, since two adhesive tapes of Claim 2 can be manufactured simultaneously, it is excellent in manufacturing efficiency.

The invention according to claim 34 is an adhesive method for crimping an adhesive onto a circuit board by using an adhesive tape coated on a substrate and wound on a reel, wherein the substrate is coated with an adhesive on the entire surface of one side thereof. By pressing a part of the adhesive in the width direction of the adhesive tape from the substrate side to the ancestor along the longitudinal direction of the tape, the adhesive is pressed onto the circuit board while reducing the cohesive force of the adhesive of the heated portion. After the remaining adhesive is wound on a reel together with the base material, and using the adhesive tape wound on the reel again, the remaining adhesive is heat-pressurized to the circuit board.

According to the invention described in Claim 34, if the cohesive force of the portion decreases by heating a portion of the adhesive (hereinafter referred to as the "cohesive force lowering line"), the adhesive of the portion heated from the cohesive force lowering line is It is pressed against the circuit board and separated from the substrate. The remaining adhesive remains on the substrate and is wound on an empty reel with the substrate.

According to this invention, since only the width | variety of an adhesive tape is made wider than before, an adhesive tape can be manufactured using the existing equipment as it is.

Moreover, the width of the adhesive agent pressed on the circuit board can be arbitrarily set by changing the heating area, and the degree of freedom of the adhesive width pressed is high.

In addition, as described in claim 29, after the dispensing of the adhesive tape to the empty reel is completed, the rotation direction of the reel is reversed to reverse the supply direction of the tape, or the reel rotation direction is left as it is. Exchange the reels with each other. As a result, it is possible to press and press the circuit board one by one from the adhesive on the substrate one by one, so that the amount of adhesive that can be used in one reel can be significantly increased without increasing the number of turns of the tape.

In addition, as in the invention described in claim 29, the amount of adhesive can be increased without increasing the number of turns, and thus it is possible to prevent the disturbance of the wound and to prevent blocking by the exudation of the adhesive. The effect of being able to prevent the damage caused by sagging can be obtained.

The tape width is preferably 5 mm to 1000 mm, and preferably 0.5 mm to 1.5 mm for the adhesive to be pressed onto the circuit board. The tape width of 5 mm to 1000 mm is because when the tape width is less than 5 mm, the number of times of crimping of the adhesive per one reel is reduced, and when the tape width is larger than 1000 mm, the tape may not be attached to the existing adhesive device. to be.

The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in the insulating adhesive, may be only an insulating adhesive, or may be one in which insulating spacer particles are dispersed in these adhesives.

The invention according to claim 35 is an adhesive tape coated on a reel with an adhesive applied to a substrate, the width of the adhesive tape being equal to or greater than the length of one side of the circuit board, and the adhesive being plural in the width direction of the tape. It is characterized by being arranged.

In the invention described in claim 35, the adhesive tape is arranged so that its width overlaps one side of the circuit board, and one set of the adhesive provided in the width direction of the adhesive tape is directly along one side of the circuit board. Pressurize by heating.

Since the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, the adhesive tape may be drawn out by the width of the adhesive.

After pressing the adhesive on one side of the circuit board, the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape to heat and press the adhesive bath to the other side. In this manner, when the adhesive is sequentially pressed to the other side of the circuit board, the adhesive can be easily pressed onto the four circumferences of the circuit board.

Therefore, since adhesives having a length of at least one side of the circuit board are used one by one, the amount of one use is equal to the width of the adhesive bath, so that the amount of adhesive that can be used in one reel can be greatly increased without increasing the number of turns of the adhesive tape. Can be.

Moreover, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tapes sticking out in the width direction of the tape and bonding between the tapes. By increasing the length, it is possible to prevent damage such as sagging of the base material (damage or cutting of the base material), which is likely to occur.

On the other hand, in the manufacturing plant of an electronic component, since the replacement | exchange frequency of a new adhesive tape becomes small, manufacturing efficiency becomes high.

Moreover, in manufacture of an adhesive tape, since the amount of adhesives per reel can be increased, the usage-amount of a reel material and a damp prevention material can be reduced, and manufacturing cost can be reduced.

The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be one in which insulating spacer particles are dispersed in such adhesive.

Since the width | variety of an adhesive tape has more than the dimension of one side of a circuit board, it is 5 mm-3000 mm, for example. Moreover, even if it is an adhesive tape which does not have the dimension of one side of a circuit board, what is necessary is just to have the dimension of one side of a circuit board by plural sets and adjoining in the width direction of an adhesive tape. In this case, production efficiency can be improved because it can be easily adapted to circuit boards of other dimensions. The width of one set of the adhesive is, for example, 0.5 mm to 10.0 mm.

The adhesive tape has a width of 5 mm to 3000 mm because the width of one side of the circuit board is less than 5 mm. When the thickness of the adhesive tape is larger than 3000 mm, the width of the reel becomes too wide, which makes it impossible to mount the existing adhesive device. Because there is concern.

In the invention described in Claim 36, in the invention according to Claim 35, a plurality of sets of adhesive groups are spaced apart from each other by an adhesive group.

According to the invention described in Claim 36, the same effects as in the invention described in Claim 35 are achieved, and neighboring adhesive vests are separated, so that the adhesive is easily removed from the substrate one by one. It can be compressed.

In the invention described in Claim 37, in the invention according to Claim 35, the adhesive is separated into a plurality of sets by slits formed in the width direction of the tape.

According to the invention described in claim 37, the same adhesive effect as in claim 35 is achieved, and the adhesive tape is coated with an adhesive on the entire surface of one side of the substrate and dried, and the adhesive is applied to the circuit board. It is preferable to form a slit by severing the cutting gold in the adhesive with a cutting knife or the like immediately before pressing, that is, immediately before using the adhesive tape.

In addition, the slits may be formed by inserting cutting gold into the adhesive with a cutting knife or the like at the time of manufacturing the adhesive tape to form the slits, or may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

According to the present invention, it is possible to increase the number of adhesive baths arranged on the base material, and at the same time, it is easy to manufacture an adhesive tape in which a plurality of adhesives are arranged in the tape width direction.

The invention according to claim 38 is a method for producing an adhesive tape in which an adhesive is applied to a substrate and wound in a reel, wherein the adhesive is applied to the entire surface of one substrate, and then the adhesive is slit along the width direction of the tape. After forming the substrate, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one substrate and the other substrate, and then the one substrate and the other substrate are separated from each other, respectively, By alternately adhering a plurality of sets of adhesives to each other, a product in which a plurality of sets of adhesives are arranged at intervals on one and the other substrates is produced.

According to this invention of Claim 38, since the adhesive tape of Claim 2 can be manufactured simultaneously using existing equipment, it is excellent in manufacturing efficiency.

The invention according to claim 39 is a circuit by arranging the adhesive tape according to any one of claims 35 to 37 on a circuit board and heating and pressing the adhesive tape along the width direction. An adhesive tape is press-bonded to one side of a substrate. In this crimping method, the adhesive tape is placed on the circuit board, and the adhesive tape is pressed on one side of the circuit board by heating and pressing the adhesive tape along the width direction, and then the position of the circuit board is changed to change the other side of the circuit board. The following adhesive bath may be crimped | bonded to the other side of a circuit board by heat-pressing an adhesive tape along the width direction.

According to the invention as claimed in claim 39, the effect of any one of claims 35 to 37 can be obtained, and after the adhesive tape is attached to the bonding apparatus, One side is placed in the width direction of the adhesive tape and the adhesive is pressed on one side of the circuit board. Then, the circuit board is rotated about 90 degrees, for example, so that the other side of the circuit board is positioned parallel to the width direction of the adhesive tape. Glue the adhesive on the other side of the circuit board. In this way, by pressing the adhesive by turning the circuit board 90 degrees one by one, the adhesive can be simply pressed onto the four circumferences of the circuit board, and the work efficiency of the electronic component manufacturing plant can be improved.

The invention according to claim 40 is provided with at least two adhesive tapes according to any one of claims 35 to 37 in a conveyance path for moving a circuit board, and one adhesive tape is The width direction is arrange | positioned in the direction orthogonal to a conveyance path, and the other adhesive tape arranges the width direction in the direction along a conveyance path, and in one adhesive tape, an adhesive tape with respect to the two opposite sides of a circuit board. The adhesive bath is pressed on two opposite sides of the circuit board by heating and pressing in the width direction, and then the circuit board is moved to the other adhesive tape, and the remaining two sides of the circuit board are removed from the substrate side. It is characterized by pressing the adhesive tape on the periphery of the circuit board by heating and pressing the adhesive tape along the width direction.

According to the invention described in Claim 40, the effect of the Claims 35 to 37 can be obtained, and the adhesive tape and the other adhesive of one adhesive tape are rotated without rotating the circuit board. By moving to the position of an adhesive tape and heat-pressing in the width direction at each position, an adhesive agent can be crimped easily around the perimeter of a circuit board, and work efficiency is good.

The invention according to claim 41 is a method of crimping an adhesive tape to an adhesive on a circuit board by using an adhesive tape coated on an entire surface of one side of a substrate and wound around a reel, wherein the width of the adhesive tape is a circuit board. It has a length of at least one side, and by pressing a portion of the adhesive in the width direction of the adhesive tape in the width direction, the adhesive is pressed onto the circuit board while reducing the cohesive force of the adhesive of the heated portion. .

According to the invention described in claim 41, in the case of pressing the adhesive around the circuit board, the adhesive tape is attached to the bonding apparatus, and the adhesive tape is heated and pressurized along the width direction, thereby Cohesion force decreases (henceforth a "cohesion force fall line"), the adhesive of the part heated from the cohesion force fall line is isolate | separated from a base material, and is crimped | bonded to a circuit board. Next, the circuit board is rotated about 90 degrees, the neighboring side is positioned in the width direction of the adhesive tape, the next adhesive bath is heated and pressurized along the width direction, and the adhesive bath is pressed onto the neighboring side. In this way, an adhesive can be crimped | bonded to the four sides of a sequential circuit board, and work efficiency is good.

In addition, since the adhesive tape should just be apply | coated on the whole surface, an adhesive tape can be manufactured as it is using existing equipment.

Moreover, the width of the adhesive agent pressed on the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive width to be pressed is high.

In addition, as in the invention described in Claim 35, the amount of adhesive can be increased without increasing the number of turns, and thus it is possible to prevent disturbance of the wound and to prevent blocking by exudation of the adhesive. The effect of being able to prevent the damage by sagging of a base material, etc. can be acquired.

The invention according to claim 42 is provided with one reel, the other reel, and a case for storing the reels while keeping the reels freely rotatable, and one reel has an adhesive tape coated with an adhesive on a substrate. One end of the adhesive tape is fixed to the other reel, and at least two sets of adhesives are arranged on the adhesive tape along the longitudinal direction of the tape.

In the invention as set forth in claim 42, the adhesive tape cassette is attached to the bonding apparatus, and the pair of adhesives formed along the longitudinal direction in at least two sets in the width direction of the adhesive tape are arranged so as to overlap one side of the circuit board. Then, by heating and pressurizing from the substrate side, a set of adhesives are pressed onto the circuit board. In this way, the adhesive is sequentially pressed onto the circuit board, and the adhesive tape is sequentially taken out from one reel, and the other adhesive is coated with the remaining adhesive tape on the other reel. And when the adhesive tape wound on one reel is complete | finished, the cassette is reversed and it attaches again to a crimping apparatus.

Thereby, since one reel and the other reel are replaced, this time, an adhesive tape is extracted from the other reel and the other 1 set of adhesives are crimped | bonded.

When an adhesive agent is formed in two or more sets in an adhesive tape, you may crimp | compress in order or space | interval by changing the position of the width direction.

As described above, in the present invention, at least two sets of adhesives are arranged side by side in the width direction and used one by one, so that at least one reel of two reels can be used for the adhesive sheet, without increasing the number of turns of the adhesive tape, The amount of adhesive available in one reel can be more than doubled.

Moreover, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tapes sticking out in the width direction of the tape and bonding between the tapes. The elongation of the base material can prevent the damage (damage or cutting of the base material), such as sagging of the base material.

On the other hand, in the case where the adhesive is formed in two sets, when the use of one reel (one set of adhesive) is finished in the electronic component manufacturing plant, the next mounting is easy by simply flipping the cassette.

In addition, since the adhesive tape is used as the cassette, the adhesive apparatus does not take much time to install the adhesive tape on the reel, and only the cassette is attached to the adhesive apparatus, so that the handling is easy and the workability of installation and replacement is good. .

The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be one in which insulating spacer particles are dispersed in these adhesives.

In the invention described in Claim 43, in the invention according to Claim 42, a plurality of sets of adhesives are spaced apart from each other by an adhesive group.

According to the invention described in Claim 43, the same effects as in the invention according to Claim 42 are exhibited, and neighboring adhesive jugs are separated, so that the adhesive is easily removed from the substrate one by one. It can be compressed.

In the invention according to Claim 44, in the invention according to Claim 42, the adhesive is separated into a plurality of sets by slits formed in the width direction of the tape.

According to the invention as claimed in claim 44, the adhesive tape exhibits the same effect as the claim 42, and the adhesive tape is coated with an adhesive on one side of the substrate and dried, and the adhesive is applied to the circuit board. It is preferable to form a slit by engraving the cutting gold in the adhesive with a cutting knife or the like immediately before pressing, i.e., just before using the adhesive tape.

Further, the slits may be formed by inserting cutting gold into the adhesive with a cutting knife or the like at the time of manufacturing the adhesive tape to form the slits, or may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

The invention according to claim 45 includes one reel, the other reel, and a case for storing the reels while keeping the reels freely rotated, and one reel is wound with an adhesive tape coated with a substrate. And attaching the adhesive tape cassette having one end of the adhesive tape fixed to the crimping device on the other reel, drawing the adhesive tape from the adhesive tape cassette onto the circuit board, and heating and pressing a portion of the adhesive tape in the width direction. This reduces the cohesive force of the adhesive in the heated portion and compresses a part of the adhesive in the width direction onto the circuit board.

According to this invention of Claim 45, the cohesion force of the adhesive agent of that part falls by heat-pressing a part of the width direction in an adhesive tape (henceforth a "cohesion force reduction line"), and cohesion force The adhesive of the portion heated from the drop line is separated from the substrate and pressed onto the circuit board.

In the present invention, the adhesive tape can be applied to the entire surface of the substrate, so that the adhesive tape can be manufactured using the existing equipment as it is.

Moreover, the width of the adhesive agent pressed on the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive width to be pressed is high.

The invention according to claim 46 includes one reel, the other reel, and a case for storing the reels while the rotation is freely held, and one reel is wound with an adhesive tape coated with a substrate. And attaching the adhesive tape cassette having one end of the adhesive tape fixed to the crimping device on the other reel, drawing the adhesive tape from the adhesive tape cassette onto the circuit board, and heating and pressing a portion of the adhesive tape in the width direction. This reduces the cohesion of the adhesive in the heated portion, compresses a part of the adhesive in the width direction to the circuit board, terminates the adhesive tape wrapped on one reel, and then turns the adhesive tape cassette over to transfer the adhesive in the remaining part to the circuit board. It is a crimping | compression-bonding method of the adhesive agent using the adhesive tape cassette characterized by crimping | bonding to the.

According to the invention described in claim 46, the same effects as in claim 45 can be achieved, and when the adhesive tape wound on one reel is finished, the cassette is turned over and mounted again in the crimping device. Since the adhesive of the part is crimped to the circuit board, the amount of adhesive can be increased without increasing the number of turns as in the invention described in claim 1, the distraction of the wound can be prevented, and the adhesive is exuded by oozing. The effect of preventing blocking and damaging due to sagging of the substrate can be obtained. In addition, when the use of one reel (one trillion of adhesives) is finished in an electronic component manufacturing plant, only the cassette is flipped over, so that the following mounting is easy. By using a cassette, handling is easy, and workability of installation and replacement is good.

The invention according to claim 47 is an adhesive tape applied to a substrate and wound in a reel, and the substrate has a hot melt layer and a support layer.

In the invention according to claim 47, in the case of using the adhesive tape, the reel and the empty reel wound up the adhesive tape are attached to the bonding apparatus, and the substrate is wound on the empty reel after heating and pressing the adhesive to the circuit board. To be installed. Then, the ends of one adhesive tape wound on one reel after the unwinding and the other ends of the adhesive tape wrapped on the other reel are overlapped or abutted, and these parts are heated to melt the hot melt layer. After making it melt | dissolve, the heat melter solidifies by cooling, and adhesive tapes are connected.

By using the base material of the adhesive tape, the end portion of the unbonded adhesive tape and the beginning end portion of the newly attached adhesive tape are adhered to each other to replace the adhesive reel, thereby simplifying the installation of a new adhesive reel to the adhesive device. Can be. In addition, it is not necessary to replace the winding reel or install the new adhesive material at the winding reel or wind around the guide pin every time the new adhesive material reel is replaced. As a result, production efficiency of electronic devices is increased.

The heat-pressing of the connection portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is mounted.

Invention of Claim 48 is the invention of Claim 1 WHEREIN: The support layer is sandwiched by the heat-melting layer. It is characterized by the above-mentioned.

According to this invention of Claim 48, while showing the same effect as the invention of Claim 1, the heat-melting layer has the surface of a base material, and heat-melts the terminal part of one adhesive tape. The adhesive surface of the start end part is superimposed on a layer, these parts can be heat-compressed, and both can be connected, and connection is easy. In addition, since the hot melt layer is formed over the entire length direction of the tape, it is not necessary to precisely position the overlapped length, and the degree of freedom of connection is high.

Invention of Claim 49 is the invention of Claim 1 WHEREIN: The hot melt layer is interposed in the support layer, It is characterized by the above-mentioned.

According to this invention of Claim 49, while showing the same effect as the invention of Claim 47, and connecting adhesive tapes, the other end and the other end of one adhesive tape are different. At the position back to the start end of the adhesive tape, it is heated by the heating press head of the bonding apparatus. When heated, the melting agent melts and starts to bleed out, and the adhesive tapes are connected by solidifying the melting agent by cooling. In this case, since the hot melt layer is sandwiched between the support layers, the melt layer is exposed to the outside air, and the adhesive strength of the hot melt layer due to moisture absorption and adhesion of dust or the like can be prevented from being lowered.

The invention according to claim 50 is a connection method of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive tape is surface-treated with a release agent. It is equipped with a base material and an adhesive agent, the mold release agent of the base material edge part of one adhesive material tape is removed, the adhesive surface of the other adhesive material tape is superimposed on the part, and the overlapped part of both is heated and crimped | bonded, It is characterized by the above-mentioned.

In the invention according to claim 50, the substrate surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped, the overlapped portions are heat-compressed, and the end portion of the adhesive tape after the unwinding is renewed. Since the start end of the adhesive tape to be attached is connected and the adhesive reel is replaced, the mounting of a new adhesive reel to the adhesive device can be simplified.

It is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, set the guide pin in the predetermined path, and replace the new adhesive reel each time. The production efficiency of electronic equipment becomes high.

Moreover, the release agent is provided in the surface of a base material so that an adhesive bond surface and a base material surface may not adhere in the state which wound the adhesive tape on the reel on the surface of a base material. In this invention, since the mold release agent of one adhesive material tape is removed and the adhesive surface of the other adhesive tape is overlapped and adhere | attached on the part, connection of adhesive tapes is easy.

The heat bonding of the connecting portion can be reasonably used by using the heat press head of the bonding apparatus in which the bonding material reel is attached.

The invention according to claim 51 is the invention according to claim 50, wherein the release agent is removed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation.

According to the invention described in claim 51, the same effect as that of the invention according to claim 50 is exhibited, and the release agent is removed using any one of plasma discharge, ultraviolet irradiation, and laser irradiation. Therefore, the release agent can be removed accurately and in a short time as compared with the case of peeling off by hand.

When plasma discharge is used as the method for removing the release agent, the release agent is removed by discharging the gas in the plasma state to make it easy to react (excitation state) and discharging the surface of the substrate. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source and irradiated with ultraviolet light for a predetermined time from the mercury lamp. Moreover, in the case of laser irradiation, a mold release agent is heated and melt | dissolved by the laser beam irradiated by the laser oscillator, and a mold release agent is removed.

The invention according to claim 52 is an adhesive tape reel wound on a reel in which an adhesive for electrode connection is applied to a substrate, wherein the adhesive tape reel is provided with a plurality of windings of the adhesive tape in the width direction of the tape. It is characterized by.

In the invention described in Claim 52, since a plurality of windings (winding portions) of the adhesive tape are provided, a neighbor of the winding portion where the unwinding is completed when the unwinding of the adhesive tape wound around one of the windings ends. The adhesive tape of the other winding part which was arrange | positioned at is installed in the winding reel.

In this way, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is exchanged. Therefore, the attachment of the new adhesive tape reel to the bonding apparatus is unnecessary. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

Since the adhesive tape wound around a plurality of windings can be used in sequence, the amount of adhesive that can be used in one replacement operation can be significantly increased without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the disturbance of the winding and to prevent the so-called blocking of the adhesive tapes that have leaked out in the width direction of the tape and to which the adhesive tapes adhere to each other. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

In the invention described in Claim 53, in the invention according to Claim 52, a connection tape for connecting both is connected between the end of one adhesive tape and the start end of the other adhesive tape. It is provided, and when unwinding of the one adhesive material tape is complete | finished, feeding of the other adhesive material tape continues, It is characterized by the above-mentioned.

According to this invention of Claim 53, while showing the same effect as the invention of Claim 52, the terminal part of one adhesive material tape and the start end part of the other adhesive material tape are a connection tape. Since it is connected to, since the unwinding of the adhesive tape of one winding part is complete | finished, the work which attaches the adhesive tape of the other winding part to a winding reel becomes unnecessary, and the production efficiency of an electronic device becomes higher.

The invention according to claim 54 is provided between the adhesive tape reel of the claim 53, the winding reel of the adhesive tape, and the adhesive tape reel and the winding reel. An adhesive apparatus having a crimping part for crimping an adhesive of an adhesive tape to a circuit board of an electronic device and a tape detecting means for detecting a connecting tape. When the tape detecting means detects the connecting tape, the connecting tape passes through the crimping part. It is characterized by winding the connecting tape on the winding reel until.

According to the invention described in Claim 54, the connecting tape is automatically wound on a winding reel. Therefore, after the adhesive tape of one winding part is finished, the adhesive tape can be fed sequentially from the next winding part.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, thereby saving time for winding up.

Further, as the tape detecting means, for example, the bonding apparatus is provided with a pair of light emitting portions and a light receiving portion to optically detect the connecting tape. On the other hand, both ends of the connection tape are provided with marks (for example, black) that give color, and the light receiving unit detects the marks at both ends of the connection tape by the laser light emitted from the light emitting part, thereby determining the connection tape. In addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape and a method of forming a plurality of holes in the connecting tape may be used.

The invention according to claim 59 is arranged in one reel, the other reel, the gear unit for interlocking rotation of one reel and the other reel, a case accommodating them, and an opening in the case. An adhesive device having one heating member and a power supply means for supplying electric power to the heating member, wherein one reel is wound with an adhesive tape coated with a base material, and the other reel has one end of an adhesive tape fixed thereto. The heating member includes a heat transfer member that generates heat by the supplied electric power, draws out the adhesive tape wound on one reel to the opening of the case, and heat-presses the adhesive tape in the opening from the substrate side with the heating member. The substrate is crimped to the circuit board, and the substrate on which the adhesive is peeled off is wound with the other reel.

The invention as set forth in claim 59 is, in the case of pressing an adhesive onto a circuit board, by holding the case in one hand and pressing the opening exposed by the adhesive tape onto the circuit board. The adhesive material is pressed onto the circuit board by pressing the adhesive tape in the opening portion of the heating portion on the side. Then, when the adhesive sphere is advanced while pressing the adhesive tape positioned under the heating member, the adhesive tape is taken out from one reel, and the reel rotates when the adhesive tape is taken out from the reel, so that it is fixed to the coaxial of one reel. The gear rotates, and the gear of the other reel engaged with it rotates and winds around the substrate on which the adhesive is peeled off on the other reel.

The electric power may be supplied to the heating member by a switch provided in the case, or a pressure reducing switch may be provided on the heating member, and when the heating member is pressed, it may be sensed to supply power to the heating member.

The adhesive may be anisotropically conductive adhesive in which conductive particles are dispersed in the insulating adhesive, may be only an insulating adhesive, or may be one in which insulating spacer particles are dispersed in these adhesives.

The invention according to claim 60 is an adhesive tape applied to a substrate, the substrate comprising a metal film or an aromatic polyamide film.

In the invention described in claim 60, the base material of the adhesive tape is a metal film (or metal foil) or an aromatic polyamide film, so that even when the thickness of the base material is made thin, the base material is stretched or cut. Can be prevented.

Therefore, by using the adhesive tape made of a thin base material, the number of turns per one reel can be increased, and the amount of adhesive usable in one reel can be increased. In addition, when the adhesive tape of the present invention is used, the number of turns per reel is large, so that the number of replacements of the new adhesive tape decreases in the manufacturing plant of the electronic component, thereby increasing the work efficiency. In addition, in the manufacture of the adhesive tape, the number of reels to be produced can be reduced, so that the amount of the reel materials and the moisture barrier material can be reduced, and the manufacturing cost can be reduced.

As the metal film, a metal having high stretch property is preferable, and copper, aluminum stainless, iron, tin and the like can be used.

As an aromatic polyamide film, a para-aramid film (Mictron; brand name of Toray Industries, Ltd.) etc. are used specifically ,.

As the adhesive, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles may be dispersed in the adhesive. Examples of the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or polymer core materials such as non-conductive glass, ceramics, plastics, and the like. The conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

The invention described in claim 61 is characterized in that the thickness of the substrate is 1 μm to 25 μm in the invention according to claim 60.

The thickness of the substrate is 1 µm to 25 µm because a sufficient tensile strength of the substrate is not obtained when the thickness of the substrate is less than 1 µm, and the substrate is easily broken. Moreover, when the thickness of a base material exceeds 25 micrometers, it is because it is difficult to obtain the number of turns for which satisfaction is obtained with respect to the number of turns per reel.

The invention described in Claim 62 is the invention according to Claim 60 or Claim 61, wherein the tensile strength of the substrate is 300 MPa or more at 25 ° C.

The tensile strength of the substrate is 300 MPa or more because when the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched and the adhesive tape is easily cut.

The invention according to claim 63 is the invention according to any one of claims 60 to 62, wherein the ratio of the thickness of the substrate to the adhesive is 0.01 to 1.0. .

The ratio of the thickness of the substrate to the adhesive agent is 0.01 to 1.0 because the substrate is too thin and the strength of the adhesive tape is not sufficiently obtained when the ratio of the thickness of the substrate to the adhesive agent is less than 0.01. When the ratio of the thickness of the substrate to the adhesive exceeds 1.0, the thickness of the substrate is too thick and the number of turns per reel cannot be increased.

The invention according to claim 64 is the invention according to any one of claims 60 to 63, wherein the surface roughness R _max of the substrate is 0.5 μm or less.

The surface roughness R _max of the substrate is 0.5 μm or less because when R _max exceeds 0.5 μ, the adhesive becomes difficult to separate from the substrate when the adhesive is pressed onto the circuit board due to the unevenness of the surface of the substrate. .

The invention according to claim 65 is an adhesive material forming method of an adhesive tape in which an adhesive is applied to a substrate and the adhesive tape wound on a reel to form an adhesive on the adherend, and each adhesive tape is taken out from a plurality of reels. Each adhesive material tape is piled up and integrated, and one base material is peeled off, and the adhesive agent integrated together is formed as a to-be-adhered body, It is characterized by the above-mentioned.

In the invention according to claim 65, the adhesive tape of the adhesive tape taken out from one reel and the adhesive surface of the adhesive tape taken out from the other reel are overlapped to form an adhesive tape. The base material of the other adhesive material tape is wound up to the reel for winding, and the adhesive agent of the adhesive material tape which integrated together is crimped | bonded to a to-be-adhered body by a pressurized heating head. The adherend is an electronic component or a circuit board, and is a lead frame or a die of a lead frame.

As described above, in the step immediately before forming the adhesive on the adherend, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are stacked together to form the adhesive on the adherend after the thickness of the desired adhesive is formed. Even if the number of turns of the tape is increased, the wound diameter of the adhesive tape per reel can be reduced. Therefore, the number of turns of the adhesive tape per one reel can be increased, and the amount of adhesive that can be used in one replacement operation can be greatly increased. Therefore, the replacement work of the new adhesive tape takes less, and the production efficiency of the electronic device is increased.

The invention according to claim 66 is characterized in that, in the invention according to claim 1, the curing agent is contained only in the adhesive of one adhesive tape.

According to the invention as claimed in claim 66, the same effect as the invention as claimed in claim 65 is achieved, and since only the adhesive agent of one adhesive tape contains a curing agent, A hardener is unnecessary for an adhesive agent. Therefore, low-temperature management becomes unnecessary for the adhesive tape of the adhesive agent which does not contain a hardening | curing agent. Therefore, the number of adhesive tapes requiring low temperature management can be reduced, and efficient management of transportation and storage of adhesive tapes can be performed. In addition, the adhesive agent of the adhesive tape with which a hardening | curing agent is not mix | blended, and the adhesive agent with the hardening | curing agent mixes the adhesive agent which uses the component which reacts with a hardening | curing agent on the other adhesive, and uses the component which does not react with a hardening | curing agent with a hardening | curing agent on one side adhesive agent. By doing so, the storage stability of the adhesive can be improved.

The invention according to claim 67 is an anisotropic conductive material tape which is wound by laminating a plurality of anisotropic conductive materials having a film-like adhesive in the longitudinal direction of the core material.

Moreover, the invention of Claim 68 is anisotropically conductive tape of Claim 67 whose said anisotropic conductive material is an anisotropic conductive material of the two-layer structure which provided the base film in the single side | surface of a film-form adhesive agent. to be.

Moreover, the invention of Claim 69 is an anisotropic degree of the three-layer structure in which the anisotropic electrically conductive material provided the base film on both surfaces of the adhesive agent of a film in the anisotropically conductive material tape of Claim 67. Anisotropic conductive tape.

Moreover, the invention described in Claim 70 is an anisotropic conductive tape in which the one-sided or both-sides of a base film are peeled off in the anisotropically conductive tape of Claim 68 or Claim 69. to be.

Moreover, the invention of Claim 71 is the anisotropically conductive material tape of any one of Claims 67-70, The width | variety of the adhesive agent of film form is 0.5-5 mm. Anisotropic conductive tape.

In addition, in the invention described in Claim 72, the anisotropic conductive tape according to any one of Claims 68 to 71, wherein the strength of the base film is 12 kg / mm 2 or more, It is an anisotropically conductive material tape whose elongation is 60 to 200% and thickness is 100 micrometers or less. And when a base film is colored by color transparency or color opacity, discrimination of a base film and an adhesive agent is easy, and the position of a wound part becomes easy, and workability improves.

As described above, according to the invention described in claim 1, the terminal portion of the adhesive tape (one adhesive tape) which has been unwinded using the adhesive of the adhesive tape and the adhesive tape to be newly mounted (the other Since the start end of the adhesive tape) is adhered and the adhesive reel is replaced, the attachment of the new adhesive tape to the bonding apparatus can be simplified.

In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape is required. The production efficiency of electronic equipment becomes high.

Since the adhesive tape of one side and the adhesive tape of the other side adhesively adhere | attach adhesive surfaces, connection strength is high.

According to the invention described in Claim 2, the same effects as in the invention according to Claim 1 can be obtained, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed, thus cutting and Since the part to which a connection work is performed is easy to understand and can be connected in the minimum position required, waste of an adhesive tape can be prevented.

According to the invention as recited in claim 3, it is possible to simplify the mounting of a new adhesive tape to the bonding apparatus in the same manner as the effect of the invention as claimed in claim 1, and to reduce the replacement time of the new adhesive reel. The production efficiency of electronic equipment becomes high.

Moreover, since the end part of the adhesive material tape which unwinding | finished and the start end part of the newly attached adhesive material tape are adhere | attached using the lead tape of an adhesive material tape, adhesion of adhesive tapes can be simplified.

According to the invention as recited in claim 4, it is possible to simplify the installation of a new adhesive tape to the bonding apparatus in the same manner as the effect of the invention as claimed in claim 1, and to reduce the replacement time of the new adhesive reel. The production efficiency of electronic equipment becomes high.

Moreover, since it is not necessary to turn over the adhesive tape after completion of unwinding, it is possible to prevent the possibility that the winding of the wound may occur when the adhesive tape is wound on the winding reel.

According to invention of Claim 5, since the end part of the adhesive material tape which unwinding | finished and the start end part of the adhesive material tape which are newly attached are fixed by a locking pin, connection is easy. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive reel is performed. The less it takes, the higher the production efficiency of the electronic device.

According to the invention as claimed in claim 6, one click portion of the locking member is locked to the end of one adhesive material tape, and the other click portion of the locking member is locked to the start end of the other adhesive tape. Since both are connected to each other, connection is easy.

Since the elastic member is provided between the one click portion and the other click portion, the elastic member is extended so that the other click portion of the locking member can be latched at an arbitrary position of the start end portion of the other adhesive tape. , The degree of freedom of connection is high.

In addition, since the ends of one adhesive tape and the other end of the adhesive tape are connected together, the tapes do not need to overlap each other and can be connected at the minimum position, so that the waste of the adhesive tape can be prevented. .

According to the invention as claimed in claim 7, the connection work is easy because the overlapped portion of the end portion of one adhesive material tape and the start end portion of the other adhesive material tape can be connected to the clip only.

According to invention of Claim 8, since the clamping piece is pressed and crushed from both surfaces of an overlapping part, and both are connected, the connection strength of the overlapping part of an adhesive tape can be raised.

According to the invention as claimed in claim 9, the end portion of the adhesive material tape terminated using the adhesive of the adhesive material tape and the start end portion of the newly attached adhesive material tape are adhered to each other so that the adhesive material reel is exchanged. New adhesive reel can be easily mounted. In addition, it is not necessary to replace the take-up reel of the base material or to install the beginning end of the new adhesive material on the take-up reel each time the new adhesive material reel is replaced, so that the replacement time of the new adhesive material reel is shortened, and the production efficiency is increased.

According to the invention as claimed in claim 10, the same effect as the invention as claimed in claim 9 is achieved, and the end of one adhesive tape and the start of the other adhesive tape are hooked with each other. At the same time as locking, both of the adhesive surfaces are connected to each other, so that the connection strength is high.

According to the invention as claimed in claim 11, the same effect as in the invention as claimed in claim 9 or claim 10 can be achieved, and the end portion of one adhesive tape can be performed at the end mark portion. The part which performs a connection work is easy to understand, and the waste of an adhesive tape can be prevented.

According to the invention described in claim 12, the same effects as in the invention according to any one of claims 9 to 11 can be obtained, and at the same time, irregularities are formed in the connecting portion. The connection area can be widened and the strength in the tensile direction (length direction) of the adhesive tape in the connection portion can be increased.

According to the invention as claimed in claim 13, the inner circumference of the through hole is achieved by providing the same effect as the invention as described in any one of claims 9 to 11, and forming a through hole in the connecting portion. As the adhesive penetrates into and the adhesive area by the adhesive increases, the connection strength can be further increased.

According to the invention according to claim 14, the reel is replaced by only connecting the finished adhesive tape (one adhesive tape) and the new adhesive tape (the other adhesive tape), and thus, a new adhesive material for the bonding apparatus. Reel mounting can be simplified. In addition, it is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, or to fasten the adhesive tape to the guide every time the replacement of the new adhesive reel is performed. Will increase the production efficiency.

Since the treatment agent used for the processing base material of an adhesive tape is silicone resin, and also using a silicone adhesive for an adhesive tape, since the difference of both surface tension is made small and adhesive force is raised, adhesion | attachment of both which was conventionally difficult can be achieved.

According to the invention as claimed in claim 15, the same effect as in the invention as claimed in claim 14 is achieved, and the surface tension of the pressure-sensitive adhesive surface in the silicone adhesive tape and the silicone-treated substrate in the adhesive tape By setting the difference with the surface tension to 10 mN / m (10 dyne / cm) or less, strong adhesion can be obtained, and both can be reliably bonded.

According to the invention as claimed in claim 16, the same effect as the invention as claimed in claim 15 can be achieved, and furthermore, both of one and the other adhesive tapes are made to have an adhesive force of 100 g / 25 mm or more. Adhesion with an adhesive surface can be made stronger.

According to the invention as claimed in claim 17, the same effect as the invention as claimed in claim 16 can be obtained, and one and the other adhesive tape are connected at both sides, whereby a more firm connection can be obtained. have.

According to the invention according to claim 18, since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, the double-sided silicone pressure-sensitive adhesive tape can be sandwiched between one and the other adhesive tape, so that both can be adhered (or adhered to). The connection is simple and easy.

According to invention of Claim 19, since the terminal part of the adhesive material tape which unwinding | finished and the starting end part of the adhesive material tape to attach newly are fixed by paste resin adhesive, connection is easy. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

According to the invention described in claim 20, the adhesive tapes are exhibited in the group of the thermosetting resin, the photocurable resin, and the hot melt adhesive as the resin adhesive, while exhibiting the same effect as the invention according to the claim 19. The resin adhesive suitable for the connection of can be selected, and the connection strength of adhesive tapes can be raised.

According to the invention described in claim 21, since a charger for supplying the resin adhesive according to claim 19 or claim 20 is provided in the bonding apparatus, it is necessary to prepare a charger separately. And waste of connection work can be prevented.

According to the invention as claimed in claim 22, when the unwinding of the adhesive tape wound around one winding ends, an adhesive tape wound around the winding portion is attached to the winding reel, and the adhesive tape is exchanged. It is not necessary to mount a new adhesive tape reel. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

According to the invention as claimed in claim 23, the same effect as the invention as claimed in claim 22 is achieved, and the terminal end of one adhesive tape and the start end of the other adhesive tape are connected by a connection tape. Therefore, after the unwinding of the adhesive tape of one adhesive tape reel is completed, the work of attaching the adhesive tape of the other winding portion to the take-up reel is unnecessary, resulting in higher production efficiency of the electronic device.

According to the invention according to claim 24, since the connecting tape is automatically wound on the winding reel, after the adhesive tape of one winding part is finished, the adhesive tape can be taken out from the next winding part sequentially.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, thereby saving time for winding up.

According to the invention as claimed in claim 25, the connection portion between the end portion of one adhesive material tape and the start end portion of the other adhesive material tape covers the locking portion with the adhesive material tape, so that the appearance is good and the connection is made. It is possible to prevent the interlocking portion of the portion from contacting the adhesive tape and damaging the adhesive tape or damaging the adhesive device.

According to the invention as claimed in claim 26, when the connecting portion detecting means detects the connecting portion, one adhesive tape is wound around the winding reel until the connecting portion passes through the pressing portion, so that the connecting portion comes to the pressing portion. The defect that the crimping operation is performed can be prevented. Moreover, since one adhesive tape is automatically wound up to a winding reel until a connection part passes a crimping | compression-bonding part, the time of winding can be saved.

According to the invention as claimed in claim 27, the same effect as that of the invention as claimed in claim 26 can be achieved, and the connection part can be detected with a simple configuration. Moreover, the detection accuracy can be improved by using these means. It can increase.

According to the invention described in Claim 29, since a plurality of sets of adhesives can be used one by one, the amount of adhesives that can be used in one reel can be increased by two times or more conventionally without increasing the number of turns of the tape.

Since the number of turns is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tapes sticking out in the width direction of the tape and to prevent the tapes from sticking to each other. This can prevent damages such as sagging of the base material (damage or cutting of the base material) which are likely to occur.

In an electronic component manufacturing plant, the replacement | exchange frequency of a new adhesive tape takes little, and work efficiency becomes high.

In addition, in manufacture of an adhesive tape, since the number of reels to manufacture can be reduced, the usage-amount of a reel material and a moisture proof material can be reduced, and a manufacturing cost can be reduced.

According to the invention as claimed in claim 30, the same effect as in the invention as claimed in claim 29 is achieved, and since the adjacent adhesive vests are separated, it can be easily separated one by one, so as to provide a circuit board. Can be easily pressed.

According to the invention described in claim 31, the same effect as in claim 29 is achieved, and since only a slit is formed on the adhesive applied to the entire surface of one side of the base material, it is easy to manufacture and adjacent adhesive Since there are few gaps between the baths, the number of the baths in the adhesive bath disposed on the substrate can be increased.

According to invention of Claim 32, the adhesive tape of Claim 30 can be manufactured easily.

According to invention of Claim 33, since two adhesive tapes can be manufactured simultaneously, it is excellent in manufacturing efficiency.

According to the invention as claimed in claim 34, since a part of the adhesive is heated to lower the cohesive force of the portion and press the circuit board, the adhesive tape uses an adhesive applied to the entire surface of one side of the substrate. The adhesive tape can be manufactured using the existing equipment as it is.

The width | variety of the adhesive agent crimped | bonded to a circuit board can be arbitrarily set by changing a heating area, and the freedom degree of the adhesive agent width crimped | bonded is high.

In the same manner as in the invention described in claim 29, since the adhesive can be heated one by one from the adhesive on the substrate and pressed against the circuit board, the amount of adhesive that can be used in one reel is doubled or more without increasing the number of turns of the tape. You can increase it.

Since the amount of adhesive can be increased without increasing the number of turns, similarly to the invention described in claim 29, it is possible to prevent the disturbance of the wound and to prevent the blocking by the exudation of the adhesive and the substrate. This can prevent the damage caused by sagging.

According to the invention described in Claim 35, since the width of the adhesive tape has the length of one side of the circuit board or more, the number of turns of the adhesive tape can be reduced while increasing the amount of the adhesive.

Since the amount of adhesive to be used can be significantly increased without increasing the number of turns of the adhesive tape, it is possible to prevent disturbance of the wound and to prevent blocking and damage or cutting of the substrate. Moreover, in the manufacturing plant of an electronic component, the replacement | exchange frequency of a new adhesive tape takes little and manufacturing efficiency becomes high.

Moreover, in manufacture of an adhesive tape, since the amount of adhesives per reel can be increased, the usage-amount of a reel material and a damp prevention material can be reduced, and manufacturing cost can be reduced.

According to the invention as claimed in claim 36, the same effect as the invention as claimed in claim 35 is achieved, and since the adjacent adhesive jug is separated, the adhesive can be easily removed from the substrate one by one and pressed. Can be.

According to the invention described in Claim 37, the same effect as in Claim 35 can be achieved, the number of adhesive baths disposed on the substrate can be increased, and the production is easy.

According to invention of Claim 38, since two adhesive tapes of Claim 36 can be manufactured simultaneously using existing equipment, it is excellent in manufacturing efficiency.

According to the invention as claimed in claim 39, the effect described in any one of claims 35 to 37 can be obtained, and an adhesive can be simply pressed onto one side of the circuit board. The work efficiency in the manufacturing plant of the electronic component can be improved.

According to the invention described in Claim 40, the effects described in Claims 35 to 37 can be obtained, and one adhesive tape and the other adhesive tape are not rotated without rotating the circuit board. The adhesive can be easily pressed to the four circumferences of the circuit board by moving to the position of, thereby improving the work efficiency.

According to the invention as claimed in claim 41, in the case of pressing the adhesive around the circuit board, pressing the adhesive tape to the circuit board by heating and pressing the adhesive tape along the width direction. It can be made easy, and work efficiency is good.

In addition, since the adhesive tape is only to be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using the existing equipment as it is.

Moreover, the width of the adhesive agent pressed on the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive width to be pressed is high.

In addition, as in the invention described in Claim 35, the amount of adhesive can be increased without increasing the number of turns, and thus it is possible to prevent disturbance of the wound and to prevent blocking by exudation of the adhesive. The effect of being able to prevent the damage by sagging of a base material, etc. can be acquired.

According to the invention as claimed in claim 42, at least two reels can be used in the adhesive sheet at least two reels in the width direction, so that at least two reels can be used in one reel, without increasing the number of turns of the adhesive tape. The amount of adhesive available for one reel can be greatly increased.

In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound, and to prevent the blocking of the adhesive tapes that leak out in the width direction of the tape and that the wound tapes adhere to each other. By lengthening, the damage (damage of a base material, cutting | disconnection), such as sagging of a base material which is easy to produce can be prevented.

Since the adhesive tape is used as the cassette, no effort is required to install the adhesive tape on the reel in the bonding apparatus, and thus the cassette is simply attached to the bonding apparatus so that it is easy to handle and the workability of installation and replacement is good.

According to the invention as claimed in claim 43, the same effect as the invention as claimed in claim 42 and the adjacent adhesive vest are separated, so that the adhesive can be easily removed from the substrate one by one and pressed. Can be.

According to the invention as claimed in claim 44, the adhesive tape exhibits the same effects as in claim 42, and the adhesive tape is easy to manufacture because it only forms an slit by applying an adhesive to the entire surface of one side of the substrate. .

According to the invention as claimed in claim 45, since the adhesive tape may be applied to the entire surface of the base material, the adhesive tape can be manufactured using the existing equipment as it is.

The width | variety of the adhesive agent crimped | bonded to a circuit board can be arbitrarily set by changing a heating press area | region, and the freedom degree of the adhesive agent width crimped | bonded is high.

According to the invention as claimed in claim 46, the same effect as in claim 45 can be achieved, and the amount of adhesive can be increased without increasing the number of turns, as in the invention as claimed in claim 1. Since it can increase, it is possible to prevent the disturbance of the wound and to prevent the blocking caused by the exudation of the adhesive and the damage caused by the sagging of the substrate. At the time of use, when use of one reel is finished, only a cassette is reversed, and the following installation is easy. Since it is a cassette, handling is easy and workability of installation and replacement is good.

According to the invention as claimed in claim 47, the base material of the adhesive tape which has been unwound and the start end of the adhesive tape to be newly attached are bonded by using the base material of the adhesive tape, so that the adhesive material reel is exchanged. Installation of a new adhesive reel to the bonding device can be simplified. In addition, since it is not necessary to replace the winding reel or install the beginning of the new adhesive reel on the winding reel every time the replacement of the new adhesive material reel is performed, the replacement time of the new adhesive material reel is shortened, and the production efficiency of the electronic device is increased.

According to the invention as claimed in claim 48, the same effect as the invention as claimed in claim 47 is achieved, and since the heat melter layer is on the surface of the base material, the heat melter layer at the end of one adhesive tape Since the adhesive surface of a starting end part is overlapped, these parts are heated and crimped, and both are connected, and connection is easy.

Moreover, since the hot melt layer is formed over the entire length direction of the tape, it is not necessary to precisely position the overlapped length, and the degree of freedom of connection is high.

According to the invention as claimed in claim 49, the same effect as the invention as claimed in claim 47 is achieved, and since the heat flux layer is sandwiched between the support layers, the heat flux layer is weatherproof to outside air, It can prevent that the adhesive strength of the heat melter layer by adhesion of moisture absorption, dust, etc. by this fall.

According to the invention described in Claim 50, the surface-treated part with the release agent of the base material part is removed, and the end part of the adhesive material tape which unwinding | finished off using the adhesive agent of the adhesive tape, and the starting end part of the adhesive material tape which are newly attached By bonding, the adhesive material reel is replaced, so that a new adhesive material reel can be easily attached to the adhesive device.

According to the invention as claimed in claim 51, the same effect as the invention as claimed in claim 50 is achieved, and at the same time, the release agent is removed using any one method of plasma discharge, ultraviolet irradiation, and laser irradiation. The release agent can be removed accurately and in a short time.

According to the invention described in Claim 52, since a plurality of windings (windings) of the adhesive tapes wound around the adhesive tapes are provided on the adhesive tape reel, the unwinding of the adhesive material tapes of one winding of the plurality of windings is finished. In this case, since the adhesive tape of the other winding portion disposed adjacent to the winding portion where the unwinding has been completed is used, it is unnecessary to attach a new adhesive tape reel to the adhesive device, so that replacement work of the new adhesive tape reel takes less, and production of electronic equipment The efficiency is increased. Moreover, since a some adhesive tape can be used one by one, the amount of adhesive which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the so-called blocking of the adhesive tapes soaked out in the width direction of the tape and bonding of the wound adhesive tapes together. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

According to the invention described in claim 53, since the accommodating portion of the reel is provided on the side plate of the reel, the same effect as the invention described in claim 52 is achieved, and the moisture in the adhesive tape reel is ensured from the inside. It is possible to further suppress the deterioration of the quality caused by the moisture absorption of moisture by the adhesive tape by removing it.

According to the invention described in Claim 54, since the cover member covering the periphery of the adhesive tape wound on the reel is detachably attached to the reel, the adhesive tape does not directly weather the outside air. It can prevent the bad influence by the moisture of the outside air. Therefore, even when a plurality of windings are provided, by providing the cover member in the unused windings, it is possible to prevent the deterioration of the quality of the adhesive tape.

In addition, since the cover member is detachably attached, the cover member can be removed and the adhesive tape can be simply fed from the adhesive tape reel.

According to the invention as set forth in claim 55, the same effect as the invention as set forth in any one of claims 52 to 54 can be achieved, and at the same time, the adhesive tape can be extracted from the outlet of the cover member. Therefore, the adhesive tape can be fed directly from the adhesive tape reel without removing the cover member of the adhesive tape reel.

According to the invention described in Claim 56, the same effect as the invention according to any one of Claim 52 or Claim 55 can be achieved, and the winding portion is freely detachable from each other. Therefore, after the adhesive tape of one winding part is complete | finished, an adhesive tape can be taken out from the next winding part sequentially by releasing the fitting with the other winding part.

According to the invention as claimed in claims 57 and 58, the same effect as the invention as described in any one of claims 52 to 56 can be obtained, and in particular, the adhesive tape is opposed to each other. The adhesive tape in which the adhesive for electrode connection connecting the electrodes to be applied is applied to the substrate, or the adhesive tape is a support substrate for fixing the lead frame, or a support substrate for mounting a semiconductor element or an adhesive for connecting a die of the lead frame and the semiconductor element. Especially useful for tapes.

According to the invention as claimed in claim 59, the hand is held, and the opening is exposed by the adhesive tape on the circuit board, and the heating member is heat-compressed from the substrate side to press the adhesive onto the circuit board. It can be operated by one hand, and can also be crimped easily when crimping | bonding an adhesive agent to a part of board | substrate.

According to the invention as claimed in claim 60, by making the substrate of the adhesive tape into a metal film or an aromatic polyamide film, even when the thickness of the substrate is thinned, it is possible to prevent the substrate from sagging and cutting or the like. .

Therefore, by using the adhesive tape which consists of a thin base material, the number of turns per one reel can be increased, and the amount of adhesive which can be used by one reel can be increased. Moreover, when the adhesive tape of this invention is used, since the number of turns per reel is large, in the manufacturing plant of an electronic component, the replacement | exchange frequency of a new adhesive tape takes little, and work efficiency becomes high. Moreover, in manufacture of an adhesive tape, since the number of reels to manufacture can be reduced, the usage-amount of a reel material and a damp prevention material can be reduced, and a manufacturing cost can be reduced.

According to the invention described in claim 61, the same adhesive effect as the invention described in claim 60 is obtained, and a thin and high tensile strength adhesive tape is obtained.

According to the invention described in Claim 62, the same effect as the invention described in Claim 60 or Claim 61 is achieved, and the stretching of the substrate is made difficult by making the tensile strength of the substrate 300 MPa or more. Also difficult to cut.

According to the invention described in Claim 63, the same effect as the invention described in any one of Claim 60 to Claim 62 is achieved, and the ratio of the thickness of the substrate to the adhesive is 0.01. By setting it as -1.0, the adhesive tape with a thinner and higher tensile strength can be obtained.

According to the invention as claimed in claim 64, the same effects as in the invention as defined in any one of claims 60 to 63 can be achieved, and the surface roughness R _max of the substrate is 0.5 μm or less. By doing so, the surface of the substrate becomes smooth, and the adhesive is easily separated from the substrate when the adhesive is pressed onto the circuit board.

According to the invention as claimed in claim 65, in the step immediately before the formation of the adhesive on the adherend, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are overlapped to form a desired adhesive thickness. Since an adhesive agent is formed in a complex, the thickness of each adhesive tape can be made thin, and since the number of turns of an adhesive tape is increased, the winding of an adhesive tape per reel can make diameter small.

Therefore, the number of turns of the adhesive tape per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape takes less time, and the production efficiency of the electronic device is increased.

According to the invention as claimed in claim 66, the same effect as the invention as claimed in claim 65 can be achieved, and the number of adhesive tapes requiring low temperature management can be reduced, and the transportation and storage of the adhesive tape can be reduced. Efficient management can be performed.

According to the invention according to any one of claims 67 to 72, it has good transferability (adhesiveness) to the connected member, has good connection reliability, and thereby yields in the process. It improves, workability further improves, supplying the long anisotropic conductive tape more conventionally, and productivity and workability improve.

Claims (72)

A method for connecting an adhesive tape wound on one reel and an adhesive tape wound on the other reel, on which an adhesive for electrode connection is applied to a base material, to connect the adhesive tape on the other reel. A bonding method of an adhesive tape, wherein the adhesive face of one adhesive tape and the adhesive face of the other adhesive tape are overlapped, and the overlapped portions thereof are heated and pressed to connect each other. The method of connecting an adhesive tape according to claim 1, wherein an end mark is attached to an end of one adhesive tape. A connecting method of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to the substrate, and the beginning end of the other adhesive tape After being attached to the base surface of the adhesive tape wound on the reel by the lead tape, the end of one adhesive tape is turned over, and the adhesive surface of the lead tape is overlapped with the adhesive surface of the terminal tape of the one adhesive tape, and the overlapped portion is A method of connecting an adhesive tape, the method comprising: hot pressing. A connecting method of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to the substrate, and the beginning end of the other adhesive tape It is attached to the base material surface of the adhesive tape wound on the reel by the lead tape, and the adhesive surface of the lead tape is overlapped with the adhesive surface of the end of one adhesive tape, and the overlapped portion is heat-compressed. How to connect. A method for connecting an adhesive tape wound on one reel and an adhesive tape wound on the other reel, on which an adhesive for electrode connection is applied to a substrate, and a method of connecting the adhesive tape on the other reel. A connecting method of an adhesive tape, comprising overlapping the start end of the other adhesive tape, and inserting and connecting a locking pin to the overlapped portion of the adhesive tape. Connection of the adhesive tape which connects the adhesive tape which connects the adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive agent for electrode connection was apply | coated to the base material using a locking member As a method, the locking member has a click portion provided at one end and the other end and an elastic member provided between the click portions, and the end portion of one adhesive tape and the start end of the other adhesive tape are brought into contact with each other. The click portion provided at one end of the adhesive member is held at the end of one adhesive tape, the click portion provided at the other end is held at the start end of the other adhesive tape, and both click portions are pulled to the elastic member. Connection method of adhesive tape. A method for connecting an adhesive tape wound on one reel and an adhesive tape wound on the other reel, on which an adhesive for electrode connection is applied to a substrate, and a method of connecting the adhesive tape on the other reel. A method of connecting an adhesive tape comprising: overlapping the beginning and end portions of the other adhesive tape, and fixing the overlapped portions to an elastically deformable clip having a cross section of approximately a U shape. The overlapped portion of one adhesive tape and the other adhesive tape is sandwiched between one adhesive tape and the overlapping portion of the other adhesive tape on a metal sandwich piece having a substantially co-shaped cross section, from both sides of the overlapped portion. A connecting method of an adhesive tape, characterized in that the pinched pieces are pressed and crushed to connect them. A method for connecting an adhesive tape wound on one reel and the other adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to a substrate, which is connected to a terminal end of one adhesive tape. The other end of the adhesive tape is overlapped with the other adhesive surface on one of the substrate surfaces, and the overlapped length of the adhesive tape is within the range of 2 to 50 times the width of the adhesive tape, and both are hot-pressed. An adhesive tape connection method characterized in that. A method of connecting an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to a substrate, wherein the end portion of one adhesive tape is adhesive Is bent in the direction facing each other, the beginning end of the other adhesive tape is bent in the direction facing the adhesive, the bent portions of the two are held together and overlapped with each other, and the surfaces of the adhesive materials face each other, and the overlapped portions are heated and compressed. Connection method of adhesive tape. The method of connecting an adhesive tape according to claim 9 or 10, wherein an end mark is attached to an end of one adhesive tape. The overlapping part of one adhesive material tape and the other adhesive material tape is heat-compression-bonded by inserting into the one metal mold | die with which the unevenness | corrugation was formed, and the other metal mold which meshes with this, An adhesive tape connection method characterized in that. 12. The connection of the adhesive tape according to any one of claims 9 to 11, wherein after the through hole is formed in the overlapped portion between the one adhesive tape and the other adhesive tape, the overlapped portion is hot-pressed. Way. Termination of one adhesive tape as a method of connecting an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to a silicon substrate. A method of connecting an adhesive tape, wherein the adhesive tape is connected by overlapping or abutting the first end portion of the adhesive tape with the other portion, and attaching a portion of the adhesive tape to the surface of the silicon processing substrate with a silicone adhesive tape. 15. The adhesive tape according to claim 14, wherein the silicone adhesive tape has a difference between the surface tension of the adhesive surface and the surface tension of the silicon treated substrate of the adhesive tape of 10 mN / m (10 dyne / cm) or less. How to connect. The method of connecting an adhesive tape according to claim 14 or 15, wherein the silicone adhesive tape has an adhesive force of 100 g / 25 mm or more. 17. The adhesive tape according to claim 16, wherein the silicone adhesive tape is connected by overlapping or abutting the end portions of one adhesive tape and the start ends of the other adhesive tape over both sides of both adhesive tapes. How to connect End of one adhesive tape as a method of connecting an adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive for electrode connection is applied to a silicon substrate. Both adhesive tapes were connected by sandwiching a silicone adhesive tape coated with a silicone adhesive on both sides between the part and the starting end of the adhesive tape on the other side, and the silicone adhesives on both sides had a difference of 10 mN / from the surface tension of the silicone-treated substrate. m (10 dyne / cm) or less, and the adhesive force is 100 g / 25 mm or more, The connection method of the adhesive tape characterized by the above-mentioned. A method for connecting an adhesive tape wound on one reel and the other adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to a substrate, which is connected to a terminal end of one adhesive tape. The adhesive tapes are connected by overlapping or abutting the beginning end portions of the other adhesive tapes, and attaching the paste resin adhesives to the overlapping portions or the butting portions, thereby curing the paste adhesives by curing the paste adhesives. Way. 20. The method of connecting an adhesive tape according to claim 19, wherein the resin adhesive is made of at least one material selected from the group of thermosetting resins, photocurable resins, and hot melt adhesives. 21. The method of connecting an adhesive tape according to claim 19 or 20, wherein a charger for supplying the resin adhesive is provided in the adhesive apparatus on which the adhesive tape is mounted. An adhesive tape reel obtained by winding an adhesive tape coated on a base material with an adhesive for electrode connection to a reel, wherein the adhesive tape reel is provided with a plurality of winding portions of the adhesive tape in the width direction of the tape. 23. The connection tape according to claim 22 is provided between the end of one adhesive tape and the start end of the other adhesive tape. The feeding of the adhesive tape of the side is started, The adhesive tape reel characterized by the above-mentioned. A crimping portion provided between the adhesive tape reel of claim 23, the winding reel of the adhesive tape, and the adhesive tape reel and the winding reel, and which presses the adhesive material of the adhesive tape onto the circuit board of the electronic device with a heating press head. An adhesive apparatus provided with a tape detecting means for detecting a connecting tape, wherein when the tape detecting means detects the connecting tape, the connecting tape is wound around the winding reel until the connecting tape passes the crimping portion. Device. An adhesive tape reel in which an end portion of one adhesive tape and a start end portion of the other adhesive tape are connected by using a gagement, wherein the connecting portion covers the gagement with an adhesive tape. A crimping portion provided between the adhesive tape reel according to claim 25, the winding reel of the adhesive tape, the adhesive tape reel and the winding reel, and pressing the adhesive material of the adhesive tape onto the circuit board by means of a heating press head, A bonding apparatus provided with a connecting part detecting means for detecting a connecting part, wherein when the connecting part detecting means detects the connecting part of the tape, one adhesive tape is wound on the winding reel until the connecting part passes through the crimping part. Bonding device. 27. The bonding apparatus according to claim 26, wherein the connection detecting unit is any one of a CCD camera, a thickness detecting sensor, and a transmittance detecting sensor. A connecting method of an adhesive tape, characterized in that a terminal end of one adhesive tape and a start end of the other adhesive tape are connected by using a locking mechanism, and the connecting portion covers the locking hole with an adhesive tape. An adhesive tape coated with a reel and coated with an adhesive on a substrate, wherein the adhesive tape is disposed in a plurality of sets in the longitudinal direction of the tape on the substrate. 30. The adhesive tape according to claim 29, wherein the plurality of sets of adhesives are spaced apart from each other by the adjacent adhesive groups. The adhesive tape according to claim 29, wherein the adhesive is separated into a plurality of sets by slits formed in the longitudinal direction of the tape. As a manufacturing method of the adhesive tape apply | coated to a base material and wound in the reel form, from an applicator arrange | positioned at intervals in the width direction of a base material, it supplies a plurality of adhesives to a base material by supplying an adhesive on the base material surface conveyed continuously. Method of producing an adhesive tape, characterized in that the coating. An adhesive is applied to a base material, and a method of manufacturing an adhesive tape wound in a reel, wherein an adhesive is applied to the entire surface of one side of one base material, and then a longitudinal slit is formed on the adhesive, and then the other base material is placed on the adhesive surface. The adhesive is sandwiched between one and the other substrate, and then one substrate and the other substrate are separated from each other, and a plurality of sets of adhesives are alternately adhered to each of the one and the other substrate, and one and the other The manufacturing method of the adhesive tape characterized by manufacturing the thing arrange | positioned at intervals with several sets of adhesive agents on the base material. An adhesive is applied to a substrate and the adhesive is pressed onto a circuit board by using an adhesive tape wound on a reel. An adhesive is coated on the entire surface of one side of the substrate, and the adhesive in the width direction of the adhesive tape is applied. By pressing a portion from the substrate side to the ancestors along the longitudinal direction of the tape, it is pressed onto the circuit board while reducing the cohesive force of the adhesive of the heated portion, and after pressing, the remaining adhesive is rolled together with the substrate onto the reel. And using the adhesive tape wound on a reel again to heat press the remaining adhesive onto the circuit board. An adhesive tape in which an adhesive is applied to a base material and wound in a reel, wherein the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and the adhesive tape is arranged in plural in the width direction of the tape. 36. The adhesive tape according to claim 35, wherein the plurality of sets of adhesives are spaced apart from each other by the adjacent adhesive groups. The adhesive tape according to claim 35, wherein the adhesive is separated into a plurality of sets by slits formed in the width direction of the tape. An adhesive is applied to a base material, and a method of producing an adhesive tape wound in a reel. An adhesive is applied to the entire surface of one base material, and then a slit is formed in the adhesive along the width direction of the tape. By arranging the base material, sandwiching the adhesive between one and the other base material, and then separating one base material and the other base material from each other and alternately applying a plurality of sets of adhesive to each of the one and the other base material The manufacturing method of the adhesive tape characterized by manufacturing the thing arrange | positioned at intervals of several sets of adhesive agent on one side and the other base material. The adhesive tape of any one of Claims 35-37 is arrange | positioned on a circuit board, and an adhesive bath is crimped | bonded to one side of a circuit board by heat-pressing an adhesive tape along a width direction. Method of pressing adhesive tape. At least two adhesive tapes in any one of Claims 35-37 are arrange | positioned in the conveyance path which moves a circuit board, One adhesive tape is arrange | positioned in the direction orthogonal to the conveyance path, and the other The adhesive tape on the side is disposed in the widthwise direction along the conveying path, and in one adhesive tape, the opposite side of the circuit board is formed by heating and pressing the adhesive tape along the width direction with respect to two opposite sides of the circuit board. The adhesive bath is crimped on two sides, and then the circuit board is moved to the other adhesive tape, and the adhesive tape is heated and pressurized along the width direction from the substrate side to the remaining two sides of the circuit board. A crimping method of an adhesive tape characterized in that the adhesive bath is crimped on the periphery of the substrate. An adhesive tape is applied to the entire surface of one side of the base material and the adhesive tape is pressed onto the circuit board by using an adhesive tape wound on a reel. The width of the adhesive tape has a length of at least one side of the circuit board, and the adhesive tape A pressure-sensitive adhesive method of an adhesive tape, wherein the adhesive is pressed onto a circuit board while lowering the cohesive force of the adhesive in the heated portion by heating and pressing a portion of the adhesive in the width direction of the substrate. One reel, the other reel, and a case for storing the reels while keeping the reels free, and one reel is wound with an adhesive tape coated with an adhesive on a substrate, and the other reel has an adhesive tape An adhesive tape cassette, characterized in that one end is fixed, and at least two sets of adhesive are disposed on the adhesive tape along the longitudinal direction of the tape. 43. The adhesive tape cassette of claim 42 wherein at least two sets of adhesive are spaced apart from adjacent adhesive pairs. The adhesive tape cassette according to claim 42, wherein the adhesive is separated into at least two sets by slits formed in the longitudinal direction of the tape. One reel, the other reel, and a case for storing the reels while keeping the reels free, and one reel is wound with an adhesive tape coated with an adhesive on a substrate, and the other reel has an adhesive tape Cohesion force of the adhesive of the heated part is mounted by attaching the adhesive tape cassette having one end fixed to the crimping device, drawing the adhesive tape from the adhesive tape cassette onto the circuit board, and heating and pressing part of the width direction of the adhesive tape. A method of pressing an adhesive using an adhesive tape cassette, wherein the adhesive in the width direction is pressed against a circuit board by lowering the pressure. One reel, the other reel, and a case for storing the reels while keeping the reels free, and one reel is wound with an adhesive tape coated with an adhesive on a substrate, and the other reel has an adhesive tape Cohesion force of the adhesive of the heated part is mounted by attaching the adhesive tape cassette having one end fixed to the crimping device, drawing the adhesive tape from the adhesive tape cassette onto the circuit board, and heating and pressing part of the width direction of the adhesive tape. The adhesive tape cassette in which the adhesive in the width direction is pressed onto the circuit board, the adhesive tape wound on one reel is finished, and then the adhesive tape cassette is turned upside down to press the adhesive on the remaining circuit board to the circuit board. Method of pressing the adhesive using. An adhesive tape applied to a substrate and wound in a reel, the substrate comprising a hot melt layer and a support layer. 48. The adhesive tape according to claim 47, wherein the support layer is sandwiched in the hot melt layer. 48. The adhesive tape according to claim 47, wherein the hot melt layer is sandwiched between the support layers. A method of connecting an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive tape includes a base material and an adhesive surface-treated with a release agent, and either adhesive tape The release agent of the base material edge part of the base material is removed, the adhesive surface of the other adhesive tape is superimposed on the part, and the overlapping part of both is heated and crimped | bonded and connected, The connecting method of the adhesive tape characterized by the above-mentioned. The method of connecting an adhesive tape according to claim 1, wherein the release agent is removed by one of plasma discharge, ultraviolet irradiation, and laser irradiation. An adhesive tape reel wound on a reel having a side plate, wherein the adhesive tape reel is provided with a plurality of windings of the adhesive tape in the width direction of the tape. 53. The adhesive tape reel of claim 52, wherein a side plate of the reel is provided with a storage portion of a desiccant. 55. The adhesive tape reel of claim 52 or 53, wherein a cover member covering the periphery of the adhesive tape wound on the reel is detachably attached to the reel. 55. The adhesive tape reel of claim 54, wherein the cover member is provided with an outlet of the adhesive tape. 54. The adhesive tape reel of claim 52 or 53, wherein the winding portions of the adhesive tape are detachably fitted to each other. The adhesive tape reel of Claim 52 or 53 whose adhesive material tape is an adhesive material tape in which the adhesive agent for electrode connection which connects the mutually opposing electrodes was apply | coated to the base material. 54. The adhesive tape reel of claim 52 or 53, wherein the adhesive tape is an adhesive support substrate for fixing the lead frame, a support substrate for mounting a semiconductor element, or an adhesive tape for connecting the die of the lead frame and the semiconductor element. Supplying power to one reel, the other reel, the gear unit for interlocking rotation of one reel and the other reel, a case accommodating them, a heating member disposed in the opening of the case, and a heating member A receptacle having a power supply means, wherein one reel is wound with an adhesive tape coated with a substrate, one end of the adhesive tape is fixed to the other reel, and the heating member generates heat by the supplied electric power. The adhesive is wound on the circuit board by heating the adhesive tape wound on one reel to the opening of the case, and pressing the adhesive tape in the opening from the substrate side with the heating member to press the adhesive onto the circuit board. Adhesive roll, characterized in that the winding of the other reel. An adhesive tape applied to a substrate, wherein the substrate is a metal film or an aromatic polyamide film. 61. The adhesive tape according to claim 60, wherein the substrate has a thickness of 1 µm to 25 µm. 63. The adhesive tape according to claim 60 or 61 wherein the tensile strength of the substrate is at least 300 MPa at 25 ° C. 63. The adhesive tape according to claim 60 or 61 wherein the ratio of the thickness of the substrate to the adhesive is 0.01 to 1.0. 63. The adhesive tape according to claim 60 or 61 wherein the surface roughness R _max of the substrate is 0.5 µm or less. As an adhesive material formation method of the adhesive tape in which an adhesive agent is apply | coated to a base material and the adhesive tape wound to a reel form and forms an adhesive agent on a to-be-adhered body, an adhesive tape is taken out from several reels, and each adhesive tape is piled up integrally, An adhesive material forming method of an adhesive tape, wherein one of the base materials is peeled off and an adhesive is formed on the adherend. 66. The method of forming an adhesive of an adhesive tape according to claim 65, wherein the curing agent is contained only in the adhesive of one adhesive tape. An anisotropic conductive tape having a film-like adhesive was wound and laminated a plurality of times in the longitudinal direction of the core material. The anisotropic conductive tape according to claim 67, wherein the anisotropic conductive material is an anisotropic conductive material having a two-layer structure in which a base film is provided on one side of a film adhesive. The anisotropic conductive tape according to claim 67, wherein the anisotropic conductive material is an anisotropic conductive material having a three-layer structure in which a base film is provided on both sides of a film adhesive. 70. The anisotropic conductive tape according to claim 68 or 69, wherein one side or both sides of the base film are peeled off. 70. The anisotropic conductive tape according to any one of claims 67 to 69, wherein the film adhesive has a width of 0.5 to 5 mm. 70. The anisotropic conductive tape according to claim 68 or 69, wherein the strength of the base film is 12 kg / mm 2 or more, the elongation is 60 to 200%, and the thickness is 100 m or less.