JP2007308309A - Adhesive tape connecting method and adhesive tape connecting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape connecting method and an adhesive tape connecting body capable of improving production efficiency of electronic equipment by easily replacing an adhesive reel. <P>SOLUTION: The adhesive tape connecting method is provided for connecting a first adhesive tape formed by applying an electrode connecting adhesive to a base material and wound on a first reel, to a second adhesive tape wound on a second reel. The second adhesive tape comprises a lead tape 41 having an adhesive surface abutting on a base material surface of its starting edge 32 and sticking to fix the starting edge 32 to the base material surface of the adhesive tape wound on the reel. The adhesive surface of the lead tape 41 is placed over to abut on both of the adhesive surface of a terminal part 30 of the first adhesive tape and the adhesive surface of the starting edge of the second adhesive tape, and an overlap part is pressure-bonded by heating. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an adhesive tape that bonds and fixes an electronic component and a circuit board or circuit boards and electrically connects both electrodes, and particularly relates to a method of connecting an adhesive tape wound in a reel shape.

In general, as a method of bonding and fixing an electronic component such as a liquid crystal panel, PDP (plasma display panel), EL (fluorescent display) panel, bare chip mounting, etc., a circuit board and circuit boards, and electrically connecting both electrodes together, Adhesive tape is used.
Patent Document 1 discloses a tape in which an adhesive tape having a base material coated with an adhesive is wound up in a reel shape. This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around the reel is about 50 m.

  When the adhesive tape is mounted on the bonding apparatus, a reel of adhesive tape (hereinafter simply referred to as “adhesive reel”) is attached to the bonding apparatus, and the starting end of the adhesive tape is pulled out and attached to the take-up reel. Then, the adhesive is pressure-bonded to the circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel, and the remaining base material is taken up on the take-up reel.

When the adhesive tape on the adhesive reel is finished, the finished reel and the take-up reel that has wound up the base material are removed, and a new take-up reel and a new adhesive reel are mounted on the bonding apparatus, and the adhesive material is removed. The beginning of the tape is attached to the take-up reel.
JP 2001-284005 A

  However, with the recent increase in panel screen size in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive used at one time has increased. Moreover, since the use of adhesives has expanded, the amount of adhesives used has increased. For this reason, there is a problem in the electronic device manufacturing factory that the frequency of replacement of the adhesive material reels is increased, and it takes time to replace the adhesive material reels, so that the production efficiency of the electronic device cannot be improved.

  To solve this problem, it is conceivable to increase the number of adhesive tapes wound around the reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. Since the width is as narrow as 1 to 3 mm, if the number of windings is increased, collapse may occur. Further, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape and cause blocking.

  Further, when the number of windings of the adhesive tape is increased, the diameter of the reel increases, and it is difficult to mount the reel on the existing bonding apparatus, and the existing bonding apparatus may not be used.

  Therefore, an object of the present invention is to provide an adhesive tape connection method and an adhesive tape connector that can easily replace an adhesive reel and can improve the production efficiency of an electronic device.

  In order to solve the above-mentioned problems, the connection method of the present invention has a first adhesive tape wound around a first reel and an adhesive for electrode connection applied to a base material, and a second reel. A method of connecting an adhesive tape for connecting a second adhesive tape, wherein the second adhesive tape has an adhesive surface in contact with a base material surface of the start end portion, and the start end portion is A lead tape for attaching and stopping to the base material surface of the second adhesive tape wound around the reel is provided, and the adhesive surface of the terminal portion of the first adhesive tape and the second adhesive tape The adhesive surface of the lead tape is overlapped so as to abut on both of the adhesive surfaces of the starting end portion, and the overlapped portion is heat-pressed.

  In the connection method of the present invention, the adhesive tape and the lead tape are used to bond the terminal portion of the adhesive tape that has been unwound and the starting end portion of the adhesive tape to be newly attached, Therefore, it is possible to easily attach a new adhesive tape to the bonding apparatus. In addition, since there is no need to replace the take-up tape, attach the start edge of the new adhesive tape to the take-up reel every time a new adhesive tape is replaced, and set a guide pin or the like in a predetermined path, a new adhesive reel The time required for replacement is reduced, and the production efficiency of electronic equipment is increased. Furthermore, since it is not necessary to turn over the adhesive tape that has been unwound, it is possible to prevent the occurrence of collapse when the adhesive tape is wound around the take-up reel. In addition, for the thermocompression bonding of the connecting portion, the bonding apparatus can be rationally used by using the heating and pressing head of the bonding apparatus on which the adhesive reel is mounted.

  In the connection method of the present invention, it is preferable that an end mark is attached to the terminal portion of the first adhesive tape. By attaching the end mark, cutting of the adhesive tape that has been unwound can be performed when the end mark is exposed, so that the portion to be cut and connected is easy to understand and at the minimum necessary position. Since it can be connected, waste of the adhesive tape can be prevented.

  The adhesive tape connector of the present invention includes a terminal portion of the first adhesive tape wound around the first reel, in which an adhesive for electrode connection is applied to the substrate, and a second reel wound around the second reel. The second adhesive tape has an adhesive surface in contact with the base material surface of the start end portion and the start end portion. Is attached to the base material surface of the second adhesive tape wound around the reel, and the connection portion includes an adhesive surface at an end portion of the first adhesive tape and The second adhesive tape is provided by overlapping the adhesive surfaces of the lead tape so as to contact both of the adhesive surfaces of the starting end portion of the second adhesive tape, and heat-pressing the overlapped portion. .

  According to the present invention, the adhesive reel can be easily replaced, and the production efficiency of the electronic device can be improved.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. First, the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing connection between adhesive reels in the method for connecting adhesive tapes according to the first embodiment, and FIG. 2 is a view showing a connection process of a connection portion (A) in FIG. Yes, (a) is a perspective view showing the cutting of the end tape of the used adhesive tape, (b) is a perspective view showing the connection with a new adhesive tape by turning over the used adhesive tape, and FIG. FIG. 4 is a schematic view showing a bonding process of an adhesive in the bonding apparatus, FIG. 4 is a cross-sectional view showing bonding between circuit boards, and FIG. 5 is a process drawing showing a method for manufacturing an adhesive tape.

The adhesive tape 1 is wound around reels 3 and 3 a, respectively. Each reel 3 and 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
The adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.

  As the base material 9, OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), etc. are used in view of strength and releasability of the adhesive constituting the anisotropic conductive material. It is not a thing.

  As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such resins include thermoplastic resin systems such as styrene resin systems and polyester resin systems, and thermosetting resin systems that use epoxy resin systems, vinyl ester resins, acrylic resin systems, and silicone resin systems. It is done.

  Conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and polymers such as non-conductive glass, ceramics, and plastics. The above-described conductive layer may be formed on a core material or the like by coating or the like.

  Furthermore, the insulating covering particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, combined use of an electrically-conductive particle and an insulating particle, etc. are applicable. Heat melting metal such as solder or polymer core material such as plastic formed with a conductive layer is deformable by heating or pressing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, it does not show a melting point like solder, so the softening state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .

  Next, the usage method of the adhesive tape concerning this Embodiment is demonstrated. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15, and the leading end of the adhesive tape 1 wound around the reel 3a is hung on the guide pin 22 to take up the reel. 17 and the adhesive tape 1 is fed out (arrow E in FIG. 3). Then, the adhesive tape 1 is disposed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the reels 3a and 17, and the adhesive 11 is connected to the circuit. Crimp to the substrate 21. Thereafter, the substrate 9 is taken up on the take-up reel 17.

  After the above crimping (temporary connection), the electrode of the circuit board 21 and the electrode of the wiring circuit (electronic component) 23 are aligned and finally connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 that is pressure-bonded to the circuit board 21, and a polytetrafluoroethylene material 24 is used as a cushioning material if necessary. Then, the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19. Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

  The PDP using the adhesive tape 1 according to the present embodiment is large in size, and may be crimped over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is used at once. The amount of use will be much higher than before. Therefore, the amount of the adhesive tape 1 wound around the reel 3a is increased, and the adhesive tape 1 wound around the reel 3a is wound around the take-up reel 17 in a relatively short time, and the adhesive tape 1 wound around the reel 3a. The end mark 28 of the material tape 1 is exposed (see FIG. 1).

  The method for connecting the adhesive tape of the present invention is as follows: (a) Using the take-up reel 17 as it is, replacing the adhesive tape with a small amount of used adhesive tape 1 remaining, and replacing it with a new adhesive tape. When the take-up reel 17 is connected, and (b) an adhesive tape in which the winding of the used adhesive tape 1 is reduced as the take-up reel 17 is used, and a new adhesive tape and an adhesive in which the winding is reduced. A tape may be connected.

  In the case of (b), as shown in FIG. 1, in order to replace the reel 3a with a new adhesive reel 3 in the adhesive tape 1 on the reel 3a, an adhesive tape (one adhesive tape) 1 on the reel 3a. Are connected to the starting end portion 32 of the adhesive tape (the other adhesive tape) 1 wound around the new adhesive reel 3.

  The connection of the adhesive tape 1 is performed by cutting the vicinity of the end mark 28 of the adhesive tape 1 when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed as shown in FIG. B) The end portion 30 of the adhesive tape 1 is turned over so that the adhesive 11 surface of the adhesive tape 1 faces upward (FIG. 2B). Then, the adhesive 11 surface of the starting end portion 32 of the adhesive tape 1 of the new adhesive reel 3 is superimposed on the adhesive 11 surface of the terminal portion 30 of the adhesive tape 1 of the used reel 3a (FIG. 2B). )).

  The overlapping portion of both is placed on the table 34 and bonded by being heated and pressed by the heating and pressing head 19 of the bonding apparatus 15. Thereby, the adhesive tape 1 wound around the used reel 3a and the adhesive tape 1 wound around the new reel 3 are connected. Next, the used reel 3 a and the new reel 3 are exchanged, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17. Moreover, since the adhesive 11 surfaces are superposed and bonded, the connection strength is high.

  The end mark 28 is preferably attached to a position where the tape is extended from the fixing position of the adhesive tape 1 of the used reel 3 a to the heating and pressing head 19. In this case, if the vicinity of the end mark 28 is cut, the connection can be made at the minimum necessary position, so that the waste of the adhesive tape 1 can be prevented.

  In this embodiment, since the heating and pressing head 19 is used, the reels 3 and 3a around which the adhesive tape 1 is wound can be exchanged without using a separate crimping tool for the adhesive 11.

The take-up reel 17 of (a) is used as it is, and the adhesive tape in which the winding of the used adhesive tape 1 is reduced is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are replaced. In the case of connection, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 is cut, and the terminal portion of the adhesive tape remaining on the take-up reel 17 side is cut. And turn the adhesive 11 side up. Then, the adhesive 11 surface of the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 is overlapped. The overlapping portion of both is placed on the table 34 and bonded by being heated and pressed by the heating and pressing head 19 of the bonding apparatus 15. Thereby, the adhesive tape 1 wound on the take-up reel 17 and the adhesive tape 1 wound on the new reel 3 are connected. As a result, since only the base material 9 is taken up by the take-up reel 17, several adhesive reels can be taken up, so that the number of replacements of the take-up reel 17 can be reduced, and work efficiency can be reduced. Is good.

  Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 concerning this Embodiment is demonstrated.

  The adhesive 11 in which the resin and the conductive particles 13 are mixed is applied to the base material (separator) 9 unwound from the unwinding machine 25 by the coater 27, dried in the drying furnace 29, and then unwound by the winding machine 31. Take up the anti. The wound raw material of the adhesive tape 1 is cut into a predetermined width by a slitter 33 and wound around the winding core, and then the side plates 7 and 7 are attached to the winding core from both sides, or the winding with the side plate is performed. It is wound around a core, packed with a dehumidifying material, managed at a low temperature (−5 ° C. to −10 ° C.) and shipped.

  Next, another embodiment of the present invention will be described. In the embodiment described below, the same reference numerals are given to the same portions as the above-described embodiments, and detailed description of the portions will be given. Omitted, the following description will mainly focus on differences from the above-described embodiment.

  In the second embodiment shown in FIG. 6, the lead tape 41 provided at the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 is used, and the adhesive tape 1 of the new adhesive reel 3 and The connection with the adhesive tape 1 wound around the used reel 3a is performed. The lead tape 41 includes a base material 45 and an adhesive 43 on the back surface, and the starting end portion 32 of the adhesive tape 1 of the new adhesive reel 3 is the base of the adhesive tape 1 wound around the reel by the lead tape 41. It is stuck on the 9th surface of the material. Then, the lead tape 41 is peeled off from the surface of the base material 9 and superposed on the surface of the adhesive 11 of the terminal portion 30 of the adhesive tape 1 turned upside down. The overlapping portion of both is placed on the table 34 and bonded by being heated and pressed by the heating and pressing head 19 of the bonding apparatus 15. In this way, the lead tape 41 of the adhesive tape 1 is used to bond the terminal portion 30 of the adhesive tape 1 that has been unwound and the start end portion 32 of the adhesive tape 1 to be newly mounted. Connection between one another is easy. Further, in this case, the adhesive 43 surface provided on the back surface side of the base material 45 of the lead tape 41 is sticky, so that it can be connected simply by overlapping it with the adhesive 11 surface of the terminal portion 30 of the adhesive tape 1 turned upside down. This method is also acceptable.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, in the second embodiment described above, the lead of the start end portion 32 of the adhesive tape 1 to be newly mounted as shown in FIG. 7 without turning over the adhesive tape 1 wound around the used reel 3a. The tape 41 is peeled off from the surface of the base material 9 and attached to the surface of the adhesive 11 on the back surface, and the lead tape 41 is connected to the surface of the adhesive 11 of the used adhesive tape 1 to connect the heating and pressure head 19 of the bonding apparatus 15. And may be bonded by heating and pressing. At this time, since it is not necessary to turn over the adhesive tape 1 that has been unwound, it is possible to prevent the occurrence of collapse when the adhesive tape 1 is wound around the take-up reel.

  Further, in this case, the lead tape 41 at the start end portion 32 of the adhesive tape 1 may be peeled off from the surface of the base material 9 and the lead tape 41 may be adhered to the surface of the base material 9 of the used adhesive tape 1.

  The present invention also provides an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein an adhesive for electrode connection is applied to a substrate. In this connection method, the end of one adhesive tape is turned over and the adhesive surface of one adhesive tape and the adhesive surface of the other adhesive tape are overlapped. And may be connected. According to such a connection method, the adhesive reel is replaced by bonding the end of the adhesive tape that has been unwound using the adhesive of the adhesive tape and the starting end of the adhesive tape to be newly installed. Therefore, it is possible to easily attach a new adhesive tape to the bonding apparatus. In addition, since there is no need to replace the take-up tape, attach the start edge of the new adhesive tape to the take-up reel every time a new adhesive tape is replaced, and set a guide pin or the like in a predetermined path, a new adhesive reel The time required for replacement is reduced, and the production efficiency of electronic equipment is increased. In addition, since the end portion of the adhesive tape that has been unwound is turned over and the adhesive surface of the adhesive tape and the adhesive surface of the adhesive tape to be newly attached are overlapped and bonded, the connection strength is high. For the thermocompression bonding of the connecting portion, the bonding apparatus can be rationally used by using the heating and pressing head of the bonding apparatus on which the adhesive reel is mounted.

  Moreover, in this invention, the end mark may be attached | subjected to the terminal part of one adhesive material tape. By adopting such a configuration, cutting of the adhesive tape that has been unwound can be performed when the end mark is exposed, so that the portion to be cut and connected can be easily understood and connected at the minimum necessary position. This can prevent waste of the adhesive tape.

  The present invention also provides an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein an adhesive for electrode connection is applied to a substrate. The other end of the adhesive tape is attached to the base surface of the adhesive tape wound around the reel by the lead tape and stopped, and the end of the one adhesive tape is turned upside down. Thereafter, the adhesive surface of the lead tape may be superimposed on the adhesive surface of the terminal portion of one adhesive tape, and the overlapped portion may be heat-pressed. According to such a connection method, it is possible to easily attach a new adhesive tape to the bonding apparatus, and it is possible to reduce the time for replacing a new adhesive reel, thereby increasing the production efficiency of the electronic apparatus. Further, since the lead tape of the adhesive tape is used to bond the terminal portion of the adhesive tape that has been unwound and the start portion of the adhesive tape to be newly attached, the adhesive tape can be easily bonded to each other.

It is a perspective view which shows the connection of adhesive material reels in the connection method of the adhesive material tape concerning 1st Embodiment. It is a perspective view which shows the connection process of the connection part in FIG. It is the schematic which shows the crimping | compression-bonding process of the adhesive agent in an adhesion | attachment apparatus. It is sectional drawing which shows adhesion | attachment of circuit boards. It is process drawing which shows the manufacturing method of an adhesive tape. It is a perspective view which shows the connection method of the adhesive tape in 2nd Embodiment of this invention. It is a perspective view which shows the connection method of the adhesive tape in the modification of 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Adhesive tape, 3, 3a ... Reel, 5 ... Core, 7 ... Side plate, 9 ... Base material, 11 ... Adhesive, 13 ... Conductive particle, 15 ... Adhesive apparatus, 17 ... Take-up reel, 19 ... Heating Pressure head, 21 ... Circuit board, 22 ... Guide pin, 23 ... Wiring circuit, 25 ... Unwinder, 27 ... Coater, 28 ... End mark, 29 ... Drying furnace, 30 ... Termination part, 31 ... Winder, 32 ... Start end, 33 ... Slitter, 41 ... Lead tape, 43 ... Lead tape adhesive, 45 ... Lead tape substrate.

Claims (2)

Connection of the adhesive tape for connecting the first adhesive tape wound on the first reel and the second adhesive tape wound on the second reel, in which the adhesive for electrode connection is applied to the base material A method,
The second adhesive tape has an adhesive surface in contact with the base material surface of the start end portion, and the start end portion is attached to the base material surface of the second adhesive tape wound on a reel. It has a lead tape to stop,
The adhesive surface of the lead tape is overlapped so as to contact both the adhesive surface of the terminal end of the first adhesive tape and the adhesive surface of the start end of the second adhesive tape, and the overlapped portion is heat-pressed. A method for connecting an adhesive tape, comprising: The terminal part of the first adhesive tape wound on the first reel and the start part of the second adhesive tape wound on the second reel, in which the electrode-connecting adhesive is applied to the base material An adhesive tape connector having a connecting portion to be connected,
The second adhesive tape has an adhesive surface in contact with the base material surface of the start end portion, and the start end portion is attached to the base material surface of the second adhesive tape wound on a reel. It has a lead tape to stop,
The connecting portion overlaps and overlaps the adhesive surface of the lead tape so as to contact both the adhesive surface of the terminal end portion of the first adhesive tape and the adhesive surface of the start end portion of the second adhesive tape. An adhesive tape connector characterized by being provided by thermocompression bonding of the mating portions.

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