JP2006096788A - Anisotropic conductive film having nonadhesive film, electro-optic apparatus using anisotropic conductive film having nonadhesive film, method and apparatus for producing electro-optic apparatus, method for producing the same film by using the same production apparatus and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably perform conductive connection between two electrode terminals by preventing impurities, etc., from being inserted into between the electrode terminals that are about to be subjected to conductive connection. <P>SOLUTION: A bump electrode 27 of driver IC 13-15 is electrically conductively connected through an ACF 23 having a nonadhesive film to an electrode 22 on a liquid crystal substrate 1a. The ACF23 having the nonadhesive film has a resin layer 24 for adhesion having conductive particles and a nonadhesive film 26 provided on the upper surface of the resin layer 24 for adhesion. In a step before mounting a first Y driver IC14 after attaching the resin layer 24 for adhesion to the electrode 22, the ACF 23 having the nonadhesive film is kept in a condition scarcely causing adhesion of impurities such as dust by the nonadhesive film 26 provided on the upper surface. Then, driver IC 13-15 are subjected to pressing treatment from the side of the nonadhesive film 26. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention uses an anisotropic conductive film with a non-adhesive film, an electro-optical device using the anisotropic conductive film with a non-adhesive film, a method for manufacturing the electro-optical device, a manufacturing apparatus for the electro-optical device, and a manufacturing apparatus therefor The present invention relates to a manufacturing method and an electronic device.

  In general, a liquid crystal display device as an electro-optical device joins a pair of substrates having a plurality of transparent electrodes with a sealant and a spacer interposed therebetween, and encloses liquid crystal in a cell gap formed between the two substrates. Formed by. One or both of the substrates sandwiching the liquid crystal is formed with an overhang portion that protrudes to the outside, and an electrode terminal connected to the plurality of transparent electrodes is formed on the overhang portion.

  In a liquid crystal display device, a structure in which a liquid crystal driving IC is directly bonded on a substrate is generally called a COG (Chip On Glass) system. In this COG method, an adhesive tape such as an ACF (Anisopic Conductive Film) having adhesiveness is adhered to an IC mounting position on a substrate, and a liquid crystal driving IC is further formed on the adhesive tape. Glue. Thus, as shown in FIG. 12, the substrate 107 and the liquid crystal driving IC 108 are brought into an electrically connectable state by pressure-bonding each other via the conductive particles 109 contained in the adhesive tape 106. Become.

However, after the adhesive tape 106 is pasted on the substrate 107, if there is time before the liquid crystal driving IC 108 is adhered, dust or the like floating in the air will adhere to the adhesive surface of the adhesive tape 106. It had adhered. As a result, the impurities 103 and 104 are sandwiched between the two electrode terminals 101 and 102 that are to be conductively connected, and the conductivity between the electrode terminals 101 and 102 may be reduced. The impurities 103 and 104 are, for example, a piece of a resin container, a piece of glass used for a substrate, a part of an operator's skin, and the like, and about 30 μm. If the conductive impurity 103 is in contact between the adjacent electrode terminals 105, a short circuit occurs, and if the insulating impurity 104 is sandwiched between the electrode terminals 101 and 102, a poor conduction state occurs.
Accordingly, a method is disclosed in which the adhesion of the impurities 103 and 104 is suppressed by holding the adhesive tape 106 downward during the pasting operation (for example, Patent Document 1).

JP 2003-57681 A

  However, the conventional adhesive tape 106 has not been able to prevent adhesion of dust and the like floating in the air. As a result, the impurities 103, 104, etc. adhere to the adhesive surface of the adhesive tape 106 affixed on the substrate 107, and as a result, the impurities 103, 104 between the two electrode terminals 101, 102 that are to be conductively connected. There is a possibility that the conductivity (short circuit, poor conduction, etc.) between the electrode terminals 101 and 102 may be lowered due to the 104 or the like being sandwiched.

  The present invention has been made paying attention to such an unsolved problem of the conventional technology, and suppresses impurities and the like from being sandwiched between two electrode terminals to be conductively connected. Anisotropic conductive film with non-adhesive film, electro-optical device using anisotropic conductive film with non-adhesive film, electro-optical device manufacturing method, electro-optical An object of the present invention is to provide a device manufacturing apparatus, a manufacturing method using the manufacturing apparatus, and an electronic apparatus.

  In order to solve the above problem, an anisotropic conductive film with a non-adhesive film according to the present invention includes an adhesive layer containing conductive particles, a non-adhesive film provided on one surface of the adhesive layer, and the adhesive layer. And a peelable protective film provided on the other surface.

  According to this configuration, since there is a non-adhesive film on the surface of the anisotropic conductive film with a non-adhesive film attached to the substrate, impurities such as dust floating in the air are not removed before the electronic component is mounted. Adhesion to the anisotropic conductive film with an adhesive film can be reduced. Therefore, when an electronic component and a board | substrate are crimped | bonded via an anisotropic conductive film with a non-adhesion film | membrane, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate. Thereby, it is possible to conduct conductive connection in a state where the electrical characteristics between the electrodes are stable.

  In the anisotropic conductive film with a non-adhesive film according to the present invention, the non-adhesive film may be formed by surface modification of the adhesive layer.

  According to this configuration, since the non-adhesive film is formed by surface modification of the adhesive layer, the non-adhesive film can be formed without performing a manufacturing process such as bonding the non-adhesive film to the adhesive layer. Therefore, it is possible to easily form a non-adhesive film.

  In the anisotropic conductive film with a non-adhesive film according to the present invention, the adhesive layer is preferably a thermosetting resin.

  According to this configuration, since the adhesive layer is a thermosetting resin, it can be cured by applying a temperature. Therefore, the electronic component that is conductively connected via the adhesive layer and the substrate can be fixed. This makes it possible to conduct conductive connection between the electrodes of the electronic component and the substrate in a stable state.

  In order to solve the above problem, an electro-optical device according to the present invention includes an anisotropic conductive film with a non-adhesive film, a substrate having an electro-optical material, and an electronic component, and the substrate and the electronic component are And electrically connected through the anisotropic conductive film with the non-adhesive film.

  According to this configuration, when an electronic component is connected to the anisotropic conductive film with a non-adhesive film attached to the substrate, there is a non-adhesive film on the surface of the anisotropic conductive film with a non-adhesive film. It is possible to prevent foreign matters such as dust floating on the sticking to the anisotropic conductive film with the non-adhesive film. Therefore, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate electrically connected through the anisotropic conductive film with a non-adhesion film | membrane. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  In the electro-optical device according to the invention, the electro-optical material is a liquid crystal.

  According to this configuration, since the anisotropic conductive film with the non-adhesive film is used to connect the liquid crystal substrate having the liquid crystal and the electronic component, there is no dust between the electronic component and the liquid crystal substrate. It is possible to provide a liquid crystal display device that can prevent foreign matter from being caught and can be driven in a stable conductive state.

  In order to solve the above problem, an electronic apparatus according to the present invention includes an electro-optical device as a display unit.

  According to this method, since an electro-optical device using an anisotropic conductive film with a non-adhesive film is used as a display unit, foreign substances such as dust are prevented from being caught between the electrodes of the electronic component and the substrate, and stable. Thus, it is possible to provide an electronic device that can display in a connected state.

  In order to solve the above problem, an electro-optical device manufacturing method according to the present invention includes a substrate, an anisotropic conductive film including an adhesive layer including conductive particles, and the substrate through the anisotropic conductive film. A non-adhesive film having a non-adhesive film formed on one surface of the adhesive layer, wherein the anisotropic conductive film is a non-adhesive film formed on one surface of the adhesive layer An affixing step of attaching the adhesive layer side of the anisotropic conductive film with a non-adhesive film to a mounting region of the substrate, and the attached anisotropic conductive film with the non-adhesive film The electronic component placed on the non-adhesive film side of the film is connected to the plurality of bump electrodes provided on the electronic component via the anisotropic conductive film with the non-adhesive film and the mounting region of the substrate. Crimp the formed electrodes to a state where they can be electrically connected to each other. And a Chakukotei.

  According to this configuration, since it has a pasting step and a crimping step, even if the anisotropic conductive film with a non-adhesive film is left attached to the electrode formed on the substrate, Since the adhesive layer does not appear on the surface, foreign substances such as dust can be made difficult to adhere to the anisotropic conductive film with the non-adhesive film. Thereby, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate, and it becomes possible to conduct conductive connection in the stable state between electrodes.

  In the electro-optical device manufacturing method according to the present invention, the crimping step includes a temporary crimping step of temporarily attaching the electronic component to the mounting region on the substrate, and the plurality of bump electrodes provided on the electronic component. And a main pressure bonding step of electrically connecting the plurality of electrodes formed in the mounting region on the substrate through the anisotropic conductive film with a non-adhesive film.

  According to this method, since the crimping process is divided into a temporary crimping process and a final crimping process, positioning and temporary crimping of the electronic component to be mounted and the substrate, and heating to the anisotropic conductive film with a non-adhesive film are performed. Can be performed in separate steps. Therefore, in the temporary press-bonding step, positioning can be performed without using a complicated manufacturing method. This makes it possible to fix the electronic component at a predetermined position.

  In order to solve the above problem, a method for manufacturing an electro-optical device according to the present invention includes a substrate, an anisotropic conductive film including an adhesive layer including conductive particles, and the anisotropic conductive film. A method of manufacturing an electro-optical device having at least one electronic component electrically connected to a substrate, wherein the anisotropic conductive film is a non-adhesive film provided on one surface of the adhesive layer. A non-adhesive film-attached anisotropic conductive film, and a sticking step of attaching the non-stick film-attached anisotropic conductive film to the mounting region on the substrate by the adhesiveness of the adhesive layer; Mounting the non-adhesive film-attached anisotropic conductive film of the at least one electronic component mounting region and the cut non-adhesive film-attached anisotropic conductive film. Stripping work for stripping the non-adhesive film in the area corresponding to the electronic component And the electronic component placed on the adhesive layer after peeling off, a plurality of bump electrodes provided on the electronic component via the adhesive layer, and a plurality of formed in the mounting region of the substrate A crimping step of crimping the electrodes to a state where they can be electrically connected to each other.

  According to this method, since it has a pasting step, a cutting step, a stripping step, and a crimping step, when crimping the electronic component, only the non-adhesive film corresponding to the electronic component to be mounted is stripped, Thereafter, the substrate and the electronic component can be pressure-bonded. Accordingly, since the contact time between the adhesive layer and the atmosphere in which the foreign matter floats is short, the attachment of the foreign matter to the adhesive layer to be mounted can be reduced. Thereby, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  In the electro-optical device manufacturing method according to the present invention, the crimping step includes a temporary crimping step of temporarily attaching the electronic component to the mounting region on the substrate, and the plurality of bump electrodes provided on the electronic component. And a main press-bonding step for electrically conducting and connecting the plurality of electrodes formed in the mounting region on the substrate.

  According to this method, since the crimping process is divided into a temporary crimping process and a final crimping process, positioning and temporary crimping of the electronic component to be mounted and the substrate, and heating to the anisotropic conductive film with a non-adhesive film are performed. Can be performed in separate steps. Therefore, in the temporary press-bonding step, positioning can be performed without using a complicated manufacturing method. This makes it possible to fix the electronic component at a predetermined position.

  In the method for manufacturing an electro-optical device according to the present invention, the electro-optical material may be a liquid crystal.

  According to this method, in a liquid crystal display device in which liquid crystal is sealed, foreign matter can be prevented from being sandwiched between the electrodes of the electronic component and the substrate. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  In order to solve the above problem, an electro-optical device manufacturing apparatus according to the present invention includes a non-adhesive film having an adhesive layer containing conductive particles and a peelable non-adhesive film provided on one surface of the adhesive layer. Manufacture of an electro-optical device having a coated anisotropic conductive film, a substrate having an electro-optic material, and the electronic component electrically connected to the electronic component through the non-adhesive anisotropic conductive film An apparatus, wherein the non-adhesive film-attached anisotropic conductive film is attached to a mounting region of the electronic component on the substrate, and the non-adhesive film-attached anisotropic conductive film is attached, A notch part that cuts into the mounting region of the electronic component, and a peeling part that peels off the non-adhesive film corresponding to the mounting region of the electronic component among the cut anisotropic film with the non-adhesive film The adhesive layer after the electronic component is peeled off Through and a crimping portion for electrically conductively connected to the substrate.

  According to this configuration, since it has an affixing part, a notch part, a peeling part, and a crimping part, when crimping an electronic component, only the non-adhesive film corresponding to the electronic component to be mounted is peeled off. After that, it is possible to crimp the substrate. Accordingly, since the contact time between the adhesive layer and the atmosphere in which the foreign matter floats is short, the attachment of the foreign matter to the adhesive layer to be mounted can be reduced. Thereby, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  In the electro-optical device manufacturing apparatus according to the present invention, the crimping portion includes a temporary crimping portion that temporarily crimps the electronic component to the adhesive layer, and a state in which the electronic component can be electrically connected to the substrate via the adhesive layer. And a main press-bonding portion for press-bonding to the main body.

  According to this configuration, since the crimping part is divided into the temporary crimping part and the main crimping part, positioning and temporary crimping of the electronic component to be mounted and the substrate, and heating to the anisotropic conductive film with a non-adhesive film Can be performed at different locations. Therefore, positioning can be performed without making the temporary crimping part a complicated mechanism. This makes it possible to fix the electronic component at a predetermined position.

  In the electro-optical device manufacturing apparatus according to the present invention, the electro-optical material may be a liquid crystal.

  According to this configuration, in a manufacturing apparatus for a liquid crystal display device in which liquid crystal is sealed, it is possible to suppress foreign matter from being sandwiched between the electrodes of the electronic component and the substrate. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  In order to solve the above problem, a manufacturing method using the electro-optical device manufacturing apparatus according to the present invention includes an attaching step of attaching an anisotropic conductive film with a non-adhesive film to a mounting region of a substrate by an attaching portion; Of the anisotropic conductive film cut by the cutting step for cutting the attached anisotropic conductive film with the non-adhesive film by the cut part, and the region corresponding to the electronic component to be mounted A peeling step for peeling the non-adhesive film, and a pressure-bonding step for pressure-bonding the electronic component and the substrate via the adhesive layer after the peeling by the pressure-bonding portion.

  According to this method, since there are a sticking step, a cutting step, a peeling step, and a crimping step, only the non-adhesive film corresponding to the electronic component to be mounted is peeled off by the peeling portion, and then the crimping portion. It becomes possible to crimp the electronic component and the substrate. Accordingly, since the contact time between the adhesive layer and the atmosphere in which the foreign matter floats is short, the attachment of the foreign matter to the adhesive layer to be mounted can be reduced. Thereby, it can suppress that a foreign material is pinched | interposed between the electrodes of an electronic component and a board | substrate. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

  Hereinafter, embodiments of an electro-optical device according to the invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is an exploded perspective view schematically showing the electro-optical device of the present embodiment. Hereinafter, the electro-optical device of this embodiment will be described with reference to FIG. As shown in the figure, a liquid crystal display device 1 as an electro-optical device includes a first substrate 3 and a second substrate 4 which are a pair of substrates bonded to each other with a sealant 2 therebetween, and both substrates 3. , 4 is provided with a liquid crystal (not shown) which is an electro-optical material sealed with a sealing material 2. Note that an illumination device (not shown) such as a backlight and other accessory devices (not shown) are attached to the liquid crystal display device 1 as necessary.
The liquid crystal display device 1 may be any of a TFT (Thin Film Transistor) active matrix type, a passive matrix type, a TFD (Thin Film Diord) active matrix type liquid crystal display device, and the like.

  Hereinafter, a TFD active matrix type will be described as an example of the liquid crystal display device 1.

  The first substrate 3 and the second substrate 4 are plate-like members made of a light-transmitting material such as glass or synthetic resin. A signal electrode 5 is formed in the X direction on the inner (liquid crystal side) surface of the first substrate 3, and a scanning electrode 6 is formed in the Y direction on the inner (liquid crystal side) surface of the second substrate 4. Yes. A pixel electrode (not shown) is formed for each pixel. The signal electrode 5 and the scanning electrode 6 are formed of a transparent conductive material such as ITO (Indium Tin Oxide). For example, as shown in FIG. 1, the scanning electrode 6 is formed by drawing the upper half to the left side and the lower half to the right side. A thin film diode D is provided for each pixel. And the intersection area | region of the signal electrode 5 and the scanning electrode 6 formed on each board | substrate 3 and 4 comprises many pixels arranged in matrix form, and the arrangement | sequence of these many pixels is liquid crystal as a whole. The display area A is configured.

  In addition, the first substrate 3 has a region 3 a that protrudes from the outer peripheral edge of the second substrate 4 (hereinafter referred to as “projected region”). On the surface of the overhang region 3a, wiring patterns such as output terminal groups 7, 8, 9 and input terminal groups 10, 11, 12 are formed, and an X driver IC 13 as a liquid crystal driving electronic component, a first Y A driver IC 14 and a second Y driver IC 15 are mounted. The signal electrode 5 extends and is connected to the output terminal group 7, and the scanning electrode 6 extends and is connected to the output terminal groups 8 and 9. The input terminal groups 10, 11, and 12 are connected to an external device (not shown) such as a circuit board via, for example, a flexible board P.

  FIG. 2 is a schematic cross-sectional view showing the configuration of the connecting portion of the overhang region. Hereinafter, the configuration of the connecting portion will be described with reference to FIG. 2 shows a cross section taken along the line BB in FIG. Since the connection configuration of the X driver IC 13, the first Y driver IC 14, and the second Y driver IC 15 is the same, only the first Y driver IC 14 will be described. As shown in FIG. 2, the connection portion 21 includes the first substrate 3, the electrodes 22 constituting the output terminal group 8 and the input terminal group 11 (both refer to FIG. 1), and an anisotropic conductive film with a non-adhesive film. A film (hereinafter referred to as “non-adhesive film-attached ACF”) 23 and a first Y driver IC 14 are included.

  The electrode 22 includes the input terminal group 11 and the output terminal group 8 and is formed on the first substrate 3. The electrodes 22 have a pitch of 38 μm, for example, and are arranged so that the pitch between the electrodes 22 is the same. Further, the gap between each electrode 22 is, for example, 15 μm.

  The non-adhesive film-attached ACF 23 includes an adhesive resin layer 24 as an adhesive layer, conductive particles 25 dispersed in the adhesive resin layer 24, and a non-adhesive film 26 formed on the upper surface of the adhesive resin layer 24. And have. The adhesive resin layer 24 is, for example, a thermosetting resin, and is mainly composed of an epoxy resin, and has excellent heat resistance. In the adhesive resin layer 24, the conductive particles 25 are evenly scattered. The non-adhesive film-attached ACF 23 before being attached to the first substrate 3 protects the non-adhesive film 26, the adhesive resin layer 24 having the conductive particles 25, and the adhesive resin layer 24 in order from the upper side in FIG. A base tape (see FIG. 4, step 1) 51 is formed as a protective film.

  The conductive particles 25 are used to electrically connect the bump electrode 27 and the electrode 22 constituting the first Y driver IC 14. The conductive particles 25 include a metal core itself (nickel (Ni) simple substance or Ni plated with gold), a resin core (such as styrene, acrylic and titanium oxide) subjected to gold plating, and on these particles. There are various types such as those having an insulating coating that breaks and melts by heat and pressure. In the present embodiment, the conductive particles 25 having an insulating coating are used. The conductive particles 25 are required not only to have electrical continuity but also to have a shape that is not in contact with adjacent electrodes and an appropriate dispersion rate. As the conductive particles 25, those close to a spherical shape are selected, and a material having a particle diameter of 5 μm, for example, is used according to the product specifications to be used.

  The non-adhesive film 26 is made of, for example, a thermoplastic resin. Thermoplastic resins have the property of softening when heated and solidifying when cooled. The non-adhesive film 26 may be made of, for example, polyethylene terephthalate (PET) or acetate resin. The non-adhesive film-attached ACF 23 may be formed, for example, by coating a thermoplastic resin on one surface of the adhesive resin layer 24 and drying the coating. Further, the non-adhesive film-attached ACF 23 may be formed by bonding a thermoplastic resin film on one surface of the adhesive resin layer 24. The non-adhesive film 26 has a thickness of 5 μm, for example. The thickness of the adhesive resin layer 24 is, for example, 25 μm.

  The first Y driver IC 14 has an IC body 28 and a bump electrode 27. The first Y driver IC 14 shown in FIG. 2 is adhered to the first substrate 3 by the adhesive resin layer 24. The pitch of the bump electrodes 27 is, for example, 38 μm, similar to the pitch of the electrodes 22, and the gap between the bump electrodes 27 is, for example, 15 μm, similar to the gap between the electrodes 22.

The bump electrode 27 and the electrode 22 become electrically conductive when the conductive particles 25 contained in the adhesive resin layer 24 are sandwiched and crushed between the bump electrode 27 and the electrode 22. Yes. That is, electrical anisotropy is exhibited such that the bump electrode 27 and the electrode 22 are electrically conductive in the thickness direction, while the surface direction is insulative.
Further, when a foreign object is caught between the bump electrode 27 and the electrode 22, a short circuit occurs between the electrodes 27 and 22, or a conduction failure occurs. The input terminal group 11 and the output terminal group 8 are in an electrically conductive state via the first Y driver IC 14.

  FIG. 3 is a schematic configuration diagram schematically showing a configuration of a mounting apparatus for mounting the X driver IC and the Y driver IC on the first substrate. Hereinafter, the configuration of the mounting apparatus will be described with reference to FIG. The mounting apparatus 31 includes a panel insertion unit 32, an ACF application processing unit 33 that is an application unit, a temporary application processing unit 34 that is a temporary application unit, a main application processing unit 35 that is a main application unit, and a panel discharge unit 36. And have.

  The panel insertion part 32 has a panel insertion port 32a and a panel supply belt 32b. The panel insertion port 32 a is an entrance through which the liquid crystal substrate 1 a on which no driver IC is mounted is inserted into the mounting apparatus 31. The liquid crystal substrate 1a input from the panel input port 32a is conveyed to the first position 37 by the panel supply belt 32b.

  The ACF attachment processing unit 33 includes an ACF attachment unit 38 and an ACF attachment table 39. The ACF sticking unit 38 supplies and sticks the non-adhesive film-attached ACF 23 to the liquid crystal substrate 1 a fixed on the ACF sticking table 39. In the ACF attaching unit 38, the non-adhesive film-attached ACF 23 sent out from the ACF reel 40 is cut into a predetermined length by an ACF cutting device (not shown). Then, the base tape 51 (see FIG. 4, step 1) is peeled off from the cut (cut) ACF 23 with the non-adhesive film by a peeling device (not shown). The non-adhesive film-attached ACF 23 is in the form of a long tape in consideration of convenience in the manufacturing process. The non-adhesive film-attached ACF 23 is wound around the ACF reel 40 described above. The ACF 23 with a non-adhesive film at the time of attachment is cut by a so-called half-cut technique in which the non-adhesive film 26 and the adhesive resin layer 24 are cut without cutting the base tape 51.

  In addition, the conveyance from the 1st position 37 to the ACF sticking table 39 is performed by the panel conveyance apparatus (not shown) called a pick and place.

  The temporary pressure bonding processing unit 34 includes an IC supply unit 41, a temporary pressure bonding table 42, and a temporary pressure bonding head (see FIG. 4, step 3) 43. The IC supply unit 41 supplies the X driver IC 13 and the first and second Y driver ICs 14 and 15 placed on an IC tray table (not shown) to the mounting area of the liquid crystal substrate 1a. It is configured. The supplied driver ICs 13 to 15 are temporarily crimped to the non-adhesive film-attached ACF 23 by being sandwiched between the temporary crimping head 43 and the temporary crimping table 42.

  The main crimping unit 35 includes a main crimping table 44 and a main crimping head (see FIG. 4, step 4) 45. The liquid crystal substrate 1a on the temporary pressure bonding table 42 is conveyed and fixed by the panel conveying device (not shown) following the second position 46, the third position 47, and the main pressure bonding table 44. The main pressure bonding head 45 is heated to, for example, 280 ° C. when performing the main pressure bonding process. The main pressure bonding head 45 presses the driver ICs 13 to 15 to pressure-bond them to the liquid crystal substrate 1 a and heats the adhesive resin layer 24 via the driver ICs 13 to 15. By this heating, each of the driver ICs 13 to 15 and the liquid crystal substrate 1a are fixed via the non-adhesive film-attached ACF.

  The panel discharge part 36 has a panel discharge belt 36a and a panel discharge port 36b. The panel discharge belt 36a conveys the liquid crystal display device 1 in which the mounting of the driver ICs 13 to 15 has been completed to the panel discharge port 36b. The liquid crystal display device 1 is transported from the main pressure bonding table 44 to the third position 47 and the panel discharge belt 36a by a panel transport device (not shown).

  FIG. 4 is a process cross-sectional view schematically showing how the driver IC is mounted on the liquid crystal substrate. Hereinafter, how the driver IC is mounted on the first substrate will be described with reference to FIG. Since the X driver IC 13 and the first and second Y driver ICs 14 and 15 have the same mounting form, only the first Y driver IC 14 will be described.

  As shown in FIG. 4, step 1 shows a state where the base tape (first substrate side) 51 of the non-adhesive film-attached ACF 23 is peeled off. First, the roll-shaped non-adhesive film-attached ACF 23 is half-cut according to the length of the driver ICs 13 to 15 to be mounted. Next, the base tape 51 is peeled off from the non-adhesive film-attached ACF 23 cut by the half cut. In the present embodiment, the ACF with a non-adhesive film from which the base tape 51 has been peeled is also referred to as an ACF 23 with a non-adhesive film.

  Step 2 shows a state where the non-adhesive film-attached ACF 23 is attached to the driver IC mounting region on the first substrate 3. The non-adhesive film-attached ACF 23 is affixed on the electrode 22 by utilizing the adhesive property of the adhesive resin layer 24.

  Step 3 shows a state in which the first Y driver IC 14 is temporarily pressure-bonded to the non-adhesive film-attached ACF 23. In this temporary pressure bonding process, the first Y driver IC 14 is temporarily attached to the adhesive resin layer 24 and the first driver IC 14 is positioned. First, the first Y driver IC 14 is positioned and placed on the non-adhesive film-attached ACF 23. Next, the first Y driver IC 14 is pushed down by the temporary pressure bonding head 43, and the non-adhesive film 26 of the non-adhesive film-attached ACF 23 is pierced by the bump electrode. Further, the bump head 27 of the first Y driver IC 14 is embedded in the adhesive resin layer 24 by pressing the temporary pressure bonding head 43. Thereby, the temporary press-bonding process between the first Y driver IC 14 and the non-adhesive film-attached ACF 23 is completed.

  Step 4 shows a state in which the first substrate 3 and the first Y driver IC 14 are subjected to the main pressure bonding process. First, heat is applied while pressing the first Y driver IC 14 subjected to the temporary pressure bonding by the main pressure bonding head 45. By pressing, at least one or more appropriately dispersed conductive particles 25 are sandwiched between the bump electrode 27 provided on the first Y driver IC 14 and the electrode 22 formed on the first substrate 3. . Thereafter, the bump electrode 27 and the electrode 22 are brought into contact with the metal in the insulating coating on the surface where the sandwiched conductive particles 25 are crushed. As a result, the bump electrode 27 and the electrode 22 are in an electrically conductive state. Further, heat is applied to the adhesive resin layer 24 of the non-adhesive film-attached ACF 23 through the first Y driver IC 14 heated by the main pressure bonding head 45. As a result, the thermosetting adhesive resin layer 24 is cured with the conductive particles 25 sandwiched between the bump electrodes 27 and the electrodes 22. Therefore, the first Y driver IC 14 and the first substrate 3 are fixed.

  The mounting of the first Y driver IC 14 has been described above. However, the X driver IC 13 and the second Y driver IC 15 can also be mounted on the first substrate 3 by repeating Step 3 and Step 4. Yes.

  FIG. 5 is a flowchart showing a mounting method for mounting the driver IC on the liquid crystal substrate. Hereinafter, the mounting method will be described with reference to FIG.

  First, in step S <b> 11, the liquid crystal substrate 1 a is put into the mounting apparatus 31. First, the liquid crystal substrate 1a is loaded into the panel supply belt 32b from the panel loading port 32a of the panel loading unit 32 by handwork. The loaded liquid crystal substrate 1a is transported to the first position 37 by the panel transport device. Further, the liquid crystal substrate 1 a transported to the first position 37 is transported to the ACF attachment table 39. The liquid crystal substrate 1a is fixed to the ACF attachment table 39 by suction.

  In step S12, the ACF 23 with the non-adhesive film is cut. First, the ACF reel 40 of the ACF sticking unit 38 is sent out by a length corresponding to the mounting area of the driver ICs 13 to 15 to be mounted. Next, half cutting of the driver ICs 13 to 15 is performed at the position of the length of the mounting area by an ACF cutting device (not shown) provided in the ACF attaching unit 38. By this half-cutting, the non-adhesive film 26 and the adhesive resin layer 24 of the ACF 23 with the non-adhesive film are completely cut.

  In step S13, the base tape 51 is peeled from the ACF 23 with the non-adhesive film. First, the base tape 51 is peeled off from the non-adhesive film-attached ACF 23 in which the non-adhesive film 26 and the adhesive resin layer 24 are cut (step 1). The peeled base tape 51 is collected by a winding device (not shown).

  In step S <b> 14, the non-adhesive film-attached ACF 23 is attached to the mounting area of the driver IC on the first substrate 3. First, the non-adhesive film-attached ACF 23 is attached to the mounting area of the liquid crystal substrate 1a fixed to the ACF attaching table 39 by an attaching device (not shown) (step 2). The attached non-adhesive film-attached ACF 23 has the non-adhesive film 26 on the upper surface, so that foreign matter floating in the atmosphere is difficult to adhere, and even if attached, it can be easily removed by an air current or the like. It has become.

  In step S15, the driver IC is inserted and aligned. The first driver IC is, for example, an X driver IC 13. First, the X driver IC 13 mounted on the IC tray table (not shown) of the IC supply unit 41 is mounted on the liquid crystal substrate 1a fixed to the temporary pressure bonding table 42 by the transport device (not shown), that is, It is conveyed to the mounting area of the X driver IC 13 located in the center of the area where the non-adhesive film-attached ACF 23 is attached. Next, the X driver IC 13 is aligned with the mounting area within an allowable error range by an alignment device (not shown).

  In step S16, a temporary pressure bonding process between the non-adhesive film-attached ACF 23 and the driver IC is performed. First, the temporary pressure bonding head 43 provided above the temporary pressure bonding table 42 is lowered to contact the upper surface of the X driver IC 13, and the X driver IC 13, the liquid crystal substrate 1 a, and the non-adhesive film-attached ACF 23 are connected to the temporary pressure bonding head 43. It is sandwiched between the temporary crimping table 42. Further, when the temporary pressure bonding head 43 is lowered, the bump electrode 27 provided on the X driver IC 13 breaks through the non-adhesive film 26 of the ACF 23 with the non-adhesive film and comes into contact with the adhesive resin layer 24. Further, the X driver IC 13 is pressed until the bump electrode 27 enters the adhesive resin layer 24. Thereby, the positioning of the X driver IC 13 is completed, and the provisional pressure bonding process is completed (step 3).

  In step S17, it is determined whether or not other driver ICs are temporarily bonded. If temporary pressure bonding is to be performed, the process proceeds to step S15. If not temporarily crimped, the process proceeds to step S18. By repeating step S15 to step S17, the temporary pressure bonding process between the first Y driver IC 14 and the second Y driver IC 15 is completed.

In step S18, the main compression processing of the driver IC is performed. First, the liquid crystal substrate 1a placed on the temporary pressure bonding table 42 of the temporary pressure bonding processing unit 34 is transported and fixed in the order of the second position 46, the third position 47, and the main pressure bonding table 44 using a panel transport device. . Next, the main pressure bonding head 45 provided above the main pressure bonding table 44 is lowered, and the X driver IC 13, the liquid crystal substrate 1 a and the non-adhesive film-attached ACF 23 are sandwiched between the main pressure bonding head 45 and the main pressure bonding table 44. . At this time, the main pressure bonding head 45 is heated to a predetermined temperature.
Next, the X driver IC 13 is pressed and heated until a predetermined pressure is reached. By pressing, the conductive particles 25 contained in the adhesive resin layer 24 are sandwiched between the bump electrodes 27 provided on the X driver IC 13 and the electrodes 22 formed on the first substrate 3. The bump electrode 27 and the electrode 22 are brought into a state in which they can be electrically connected when the insulating coating covering the periphery of the conductive particles 25 is broken by the subsequent pressing force of the main pressure bonding head 45 and comes into contact with the metal core therein. . That is, the X driver IC 13 and the first substrate 3 are in an electrically conductive state (step 4).
On the other hand, the adhesive resin layer 24 having thermosetting property is melted and cured by the heat from the heated X driver IC 13, so that the X driver IC 13 and the first substrate 3 are interposed via the adhesive resin layer 24. Stick.

  Next, the main pressure bonding process is performed on the first Y driver IC 14 and the second Y driver IC 15 in the same procedure as in step S18. The first Y driver IC 14 and the second Y driver IC 15 may perform the main crimping process one by one, or two at the same time. Thereby, the main press-bonding process of the three driver ICs 13 to 15 ends.

  After that, the liquid crystal display device 1 for which the mounting process has been completed is transported from the main pressure bonding table 44 to the third position 47 using the panel transport device, and placed on the panel discharge belt 36a. And the liquid crystal display device 1 is discharged | emitted from the panel discharge port 36b of the panel discharge part 36, and a mounting process is complete | finished.

As described above in detail, according to the present embodiment, the following effects can be obtained.
(1) According to the present embodiment, since the non-adhesive film 26 is provided on the surface of the non-adhesive film-attached ACF 23 attached to the liquid crystal substrate 1a, impurities such as dust floating in the atmosphere are caused by the driver ICs 13-15. Adhesion to the non-adhesive film-attached ACF 23 before mounting can be reduced. Therefore, it is possible to prevent impurities from being sandwiched between the bump electrode 27 provided on the driver IC and the electrode 22 formed on the first substrate 3 during the crimping process. As a result, the driver ICs 13 to 15 and the first substrate 3 can be conductively connected through the adhesive resin layer 24 with stable electrical characteristics.

(Second Embodiment)
FIG. 6 is a schematic configuration diagram schematically showing the configuration of the mounting apparatus of the present embodiment. Hereinafter, the configuration of the mounting apparatus will be described with reference to FIG. As shown in FIG. 6, the mounting device 61 of the present embodiment has a non-adhesive for each mounting area of the driver ICs 13 to 15 after the ACF 23 with the non-adhesive film is attached to the liquid crystal substrate 1 a in the ACF application processing unit 62. An ACF cut unit 63 which is a cut portion for cutting the ACF with film 23 is provided. Further, the provisional pressure-bonding processing unit 64 includes a peeling unit 65 that is a peeling unit for peeling the non-adhesive film 26 and a recovery device 66 that collects the peeled non-adhesive film 26. Is different. The description of the same configuration as that of the first embodiment is omitted.

  The ACF cut unit 63 of the ACF sticking processing unit 62 includes a cutter 71 for cutting the non-adhesive film-attached ACF 23 attached on the liquid crystal substrate 1a, and an expansion / contraction actuator 72 such as an air cylinder or a hydraulic cylinder for moving the cutter 71 to extend / contract. And an elevating actuator (see FIG. 7) 73 for moving the cutter 71 up and down. The cutter 71 is fixed to the tip of the rod of the expansion / contraction actuator 72. The main body 63a of the ACF cut unit 63 is formed with a guide groove 74a (see FIG. 7) for guiding the actuator when it is moved up and down.

The cutter 71 is disposed at the raised position of the main body 74 when moving or returning to the predetermined position of the non-adhesive film-attached ACF 23 attached to the liquid crystal substrate 1 a on the cut table 67. On the other hand, the cutter 71 is disposed at the lowered position of the main body 74 when the ACF 23 with the non-adhesive film is cut.
Furthermore, when the cutter 71 is pushed out by the telescopic actuator 72, the cutter 71 reaches above the cut position on the liquid crystal substrate 1a. On the other hand, when the cutter 71 is pulled back by the telescopic actuator 72, the cutter 71 is returned to a position where it does not interfere with the liquid crystal substrate 1a and the panel transport device (not shown).

  The peeling unit 65 of the temporary press-bonding processing section 64 includes a pad 75 for peeling the non-adhesive film 26, an expansion / contraction actuator 76 for extending / contracting the pad 75, and an elevating actuator (see FIG. 8) 77 for moving the pad 75 up / down. Have. The pad 75 is fixed to the tip of the rod of the expansion / contraction actuator 76. The main body 78 of the peeling unit 65 is formed with a guide groove 78a (see FIG. 8) that guides the actuator when the actuator is moved up and down, like the ACF cut unit 63.

The pad 75 is disposed at the raised position of the main body 78 when moving to a predetermined position of the non-adhesive film-attached ACF 23 affixed to the liquid crystal substrate 1a. On the other hand, the pad 75 is disposed at the lowered position of the main body 78 when the non-adhesive film 26 is peeled off.
Furthermore, when the pad 75 is pushed out by the expansion / contraction actuator 76, the first non-adhesive film 26a, the second non-adhesive film 26b, and the third non-adhesive film 26c on the liquid crystal substrate 1a (both refer to FIG. 8). To the top of On the other hand, when the pad 75 is pulled back by the telescopic actuator 76, the pad 75 is returned to a position where it does not interfere with the liquid crystal substrate 1a and the panel transport device (not shown).
The first to third non-adhesive films 26a to 26c are affixed to the pad 75 using its own adhesiveness. Since the bonding strength between the bonded non-adhesive film 26 and the adhesive resin layer 24 is set lower than the bonding strength between the adhesive resin layer 24 and the electrode 22, only the non-adhesive film 26 is peeled off by the pad 75. It is possible to do. Moreover, the method of peeling the 1st-3rd non-adhesion film | membranes 26a-26c is not restricted to the method of using adhesion | attachment, The method of using adsorption | suction may be sufficient.

The recovery device 66 of the temporary pressure bonding processing unit 64 includes a main body 81 for recovering the non-adhesive film 26, a U groove portion 82 formed on the upper surface of the main body 81 for peeling the non-adhesive film 26 from the pad 75, And an opening 83 formed on the side surface. The recovery device 66 inserts the non-adhesive film 26 attached to the pad 75 together with the tip of the pad 75 constituting the peeling unit 65 from the opening 83 and lifts the pad 75 from the U-groove 82, thereby The non-adhesive film 26 is peeled off.
In addition, the peeling unit 65 is provided with a rotation mechanism (not shown), and the temporary pressing table 42 side and the collection device 66 side are moved.

  7 to 9 are process cross-sectional views schematically showing how the driver IC is mounted on the liquid crystal substrate. Hereinafter, how the driver IC is mounted will be described with reference to FIGS. In the present embodiment, the non-adhesive film 26 and the adhesive resin layer 24 constituting the ACF 23 with the non-adhesive film are different from the first embodiment in that they are joined in a peelable state.

  As shown in FIG. 7, Step 11 shows a state in which the base tape (first substrate 3 side) 51 is peeled from the adhesive resin layer 24 of the non-adhesive film-attached ACF 23. First, the ACF 23 with a non-adhesive film is half-cut to a length corresponding to the three driver ICs 13 to 15 to be mounted. Next, the base tape 51 is peeled off from the adhesive resin layer 24 cut by the half cut.

  Step 12 shows a state in which the non-adhesive film-attached ACF 23 is attached to the driver IC mounting region on the first substrate 3.

  Step 13 shows a state where the ACF 23 with the non-adhesive film attached is cut for each mounting area of the driver ICs 13 to 15 by the ACF cut unit 63. The cutter 71 is pushed out to the first cut position 85 by the expansion / contraction actuator 72 of the ACF cut unit 63 at the raised position. Thereafter, the non-adhesive film 26 and the adhesive resin layer 24 are cut by lowering the cutter 71 to the lowered position by the lifting actuator 73. The cutter 71 is pushed out to the second cut position 86 by the telescopic actuator 72. Thereafter, the non-adhesive film 26 and the adhesive resin layer 24 are cut by lowering the cutter 71 to the lowered position by the lifting actuator 73. Thereby, the non-adhesion film | membrane 26 is divided | segmented into the 1st non-adhesion film | membrane 26a, the 2nd non-adhesion film | membrane 26b, and the 3rd non-adhesion film | membrane 26c. The adhesive resin layer 24 is divided into a first adhesive resin layer 24a, a second adhesive resin layer 24b, and a third adhesive resin layer 24c. The cutter 71 has a width that allows the non-adhesive film 26 to be cut into three non-adhesive films 26a to 26c.

  As shown in FIG. 8, Step 14 shows a state where the peeling unit 65 peels off the first non-adhesive film 26 a corresponding to the mounting area of the X driver IC 13. The pad 75 is pushed out above the first non-adhesive film 26a by the telescopic actuator 76 at the rising position of the main body 78. Thereafter, the pad 75 is lowered to the lowered position by the lifting actuator 77 to bring the tip 75a of the pad 75 into contact with the first non-adhesive film 26a, and the first non-adhesive film 26a is brought into contact with the tip 75a. Paste. Next, the attached first non-adhesive film 26 a is peeled off by raising the pad 75 to the raised position by the lifting actuator 77. Thereafter, the pad 75 is pulled back to a predetermined position together with the first non-adhesive film 26 a by the expansion / contraction actuator 76.

  Step 15 shows a state in which the X driver IC 13 is pre-bonded to the mounting area. In this temporary press-bonding process, the X driver IC 13 is temporarily attached to the first adhesive resin layer 24a, and the X driver IC 13 is positioned. First, the X driver IC 13 is positioned and placed on the first adhesive resin layer 24a. Next, the X driver IC 13 is pushed down by the temporary pressure bonding head 43 (see FIG. 4) and embedded in the first adhesive resin layer 24a. Thereby, the temporary press-bonding process between the first adhesive resin layer 24a and the X driver IC 13 is completed.

  Step 16 shows a state in which the first Y driver IC 14 and the second Y driver IC 15 are subjected to a temporary pressure bonding process. Also in the first and second Y driver ICs 14 and 15, the steps 14 and 15 are performed in the same manner, and the first Y driver IC 14 is moved to the second adhesive resin layer 24 b and the second Y driver IC 15 is moved toward the second. 3 is temporarily bonded to the adhesive resin layer 24c.

  As shown in FIG. 9, step 17 shows a state where the X driver IC 13 is finally press-bonded to the first substrate 3. First, heat is applied to the X driver IC 13 that has been temporarily press-bonded while being pressed by the main press-bonding head 45 (see FIG. 4). By applying the pressure, at least one or more appropriately dispersed conductive particles 25 are sandwiched between the bump electrode 27 provided on the X driver IC 13 and the electrode 22 formed on the first substrate 3. The bump electrode 27 and the electrode 22 are in an electrically conductive state when the sandwiched conductive particles 25 are crushed and brought into contact with the metal in the insulating coating on the destroyed surface. Further, heat is applied to the first adhesive resin layer 24 a through the X driver IC 13 heated by the main pressure bonding head 45. Accordingly, the first adhesive resin layer 24 a having thermosetting properties is cured in a state where the conductive particles 25 are sandwiched between the bump electrode 27 and the electrode 22. Therefore, the X driver IC and the first substrate are fixed.

  Step 18 shows a state where the first Y driver IC 14 and the second Y driver IC 15 are subjected to the main pressure bonding process. In the first and second Y driver ICs 14 and 15 as well, the process of step 17 is performed in the same manner, and the main pressure bonding process to the first substrate 3 is completed.

  FIG. 10 is a flowchart showing a mounting method for mounting the driver IC on the first substrate. Hereinafter, the mounting method will be described with reference to FIG.

  First, in step S <b> 21, the liquid crystal substrate 1 a is put into the mounting device 61. First, the liquid crystal substrate 1a is loaded into the supply belt 32b from the panel loading port 32a of the panel loading unit 32 by handwork. The loaded liquid crystal substrate 1a is transported to the first position 37 by the panel transport device. Further, the liquid crystal substrate 1 a transported to the first position 37 is transported to the ACF attachment table 39. The liquid crystal substrate 1a is fixed to the ACF attachment table 39 by suction.

  In step S22, the ACF 23 with the non-adhesive film is cut. First, the ACF reel 40 of the ACF sticking unit 38 is sent out by a length corresponding to the mounting area of the driver ICs 13 to 15 to be mounted. Next, half cutting of the driver ICs 13 to 15 is performed at the position of the length of the mounting area by an ACF cutting device (not shown) provided in the ACF attaching unit 38. By this half-cutting, the non-adhesive film 26 and the adhesive resin layer 24 of the ACF 23 with the non-adhesive film are completely cut.

  In step S23, the base tape 51 is peeled from the ACF 23 with the non-adhesive film. First, the base tape 51 is peeled off from the non-adhesive film-attached ACF 23 from which the non-adhesive film 26 and the adhesive resin layer 24 have been cut (step 11). The peeled base tape 51 is collected by a winding device (not shown).

  In step S <b> 24, the non-adhesive film-attached ACF 23 is attached to the driver IC mounting region on the first substrate 3. First, the non-adhesive film-attached ACF 23 is attached to the mounting area of the liquid crystal substrate 1a fixed to the ACF attaching table 39 by an attaching device (not shown) (step 12). The attached ACF with the non-adhesive film has the non-adhesive film 26 on the upper surface, so that foreign matter floating in the atmosphere is difficult to adhere, and even if attached, it can be easily removed by an air current or the like. It has become.

  In step S25, the non-adhesive film 26 and the adhesive resin layer 24 are cut for each mounting region of the driver ICs 13-15. First, the liquid crystal substrate 1a placed on the ACF sticking table 39 is transported and fixed to the cut table 67 by a panel transport device (not shown). Next, the non-adhesive film 26 and the adhesive resin layer 24 are cut at the first cut position 85 and the second cut position 86 by the ACF cut unit 63 of the ACF sticking processing unit 62 (step 13). . Thereby, the 1st non-adhesion film | membrane 26a, the 2nd non-adhesion film | membrane 26b, and the 3rd non-adhesion film | membrane 26c will be in the state which can be peeled independently, respectively.

  In step S26, the non-adhesive film 26 corresponding to the mounting area of the driver IC is peeled off. First, the liquid crystal substrate 1a placed on the cut table 67 is conveyed and fixed in order to the first position 37, the second position 46, and the temporary pressure bonding table 42 by a panel conveying device (not shown). Next, of the non-adhesive film 26 attached on the first substrate 3, for example, the first non-adhesive film 26a is peeled off by the peeling unit 65 of the temporary pressure-bonding processing section 64 (Step 14). The order of the driver ICs to be temporarily bonded is the order of the X driver IC 13, the first Y driver IC 14, and the second Y driver IC 15.

  In step S <b> 27, driver ICs 13 to 15 to be temporarily crimped are put into the temporary crimping table 42. The first driver IC is, for example, an X driver IC 13. First, the X driver IC 13 mounted on the IC tray table (not shown) of the IC supply unit 41 is mounted on the liquid crystal substrate 1a fixed to the temporary pressure bonding table 42 by the transport device (not shown), that is, It is conveyed to the mounting area of the X driver IC 13 located in the center of the area where the non-adhesive film-attached ACF 23 is attached. Next, the X driver IC 13 is aligned with the mounting area within an allowable error range by an alignment device (not shown).

  In step S28, a temporary pressure bonding process between the adhesive resin layer 24 and the driver IC is performed. First, the temporary pressure bonding head 43 (see FIG. 4) provided above the temporary pressure bonding table 42 is lowered to contact the upper surface of the X driver IC 13, and the X driver IC 13, the liquid crystal substrate 1a, and the non-adhesive film-attached ACF 23 are It is sandwiched between the temporary pressure bonding head 43 and the temporary pressure bonding table 42. Further, by lowering the provisional pressure bonding head 43, the bump electrode 27 provided on the X driver IC 13 enters the first adhesive resin layer 24a. As a result, the positioning of the X driver IC 13 is completed and the provisional pressure bonding process is completed (step 15).

In step S29, it is determined whether or not other driver ICs are to be temporarily crimped. If it is provisional pressure bonding, the process proceeds to step S26. If not temporarily crimped, the process proceeds to step S30. By repeating Step S26 to Step S29, the provisional pressure bonding process between the first Y driver IC 14 and the second Y driver IC 15 is completed.
As described above, when the three driver ICs 13 to 15 are temporarily press-bonded, the respective non-adhesive films 26a to 26c are peeled off immediately before the temporary press-bonding, so that impurities such as dust floating in the atmosphere are adhered to the respective adhesive resin layers. It can suppress adhering to 24a-24c.

In step S30, the driver IC is subjected to a main pressure bonding process. First, the liquid crystal substrate 1a placed on the temporary pressure bonding table 42 of the temporary pressure bonding processing unit 64 is sequentially connected to the second position 46, the third position 47, and the main pressure bonding table 44 using a panel transport device (not shown). Transport and fix. Next, the main pressure bonding head 45 (see FIG. 4) provided above the main pressure bonding table 44 is lowered, and the X driver IC 13, the liquid crystal substrate 1a, and the non-adhesive film-attached ACF 23 are bonded to the main pressure bonding head 45 and the main pressure bonding. It is sandwiched between the table 44. At this time, the main pressure bonding head 45 is heated to a predetermined temperature.
Next, the X driver IC 13 is pressed and heated until a predetermined pressure is reached. By pressing, the conductive particles 25 contained in the first adhesive resin layer 24a are sandwiched between the bump electrode 27 provided on the X driver IC 13 and the electrode 22 formed on the first substrate 3. It is. The bump electrode 27 and the electrode 22 are brought into a state in which they can be electrically connected when the insulating coating covering the periphery of the conductive particles 25 is broken by the subsequent pressing force of the main pressure bonding head 45 and comes into contact with the metal core therein. . That is, the X driver IC 13 and the first substrate 3 are in an electrically conductive state (step 17).
On the other hand, the first adhesive resin layer 24a having thermosetting property is melted and cured by the heat from the heated X driver IC 13, whereby the X driver IC 13 and the first substrate 3 form the ACF 23 with the non-adhesive film. It sticks through.

  Next, the main pressure bonding process is performed on the first Y driver IC 14 and the second Y driver IC 15 in the same procedure as in step S30. The first Y driver IC 14 and the second Y driver IC 15 may perform the main crimping process one by one, or two at the same time. Thereby, the main press-bonding process of the three driver ICs 13 to 15 ends.

  Thereafter, the liquid crystal display device 1 in which the driver ICs 13 to 15 are mounted is transported from the main pressure bonding table 44 to the third position 47 using the panel transport device, and placed on the panel discharge belt 36a. And the liquid crystal display device 1 is discharged | emitted from the panel discharge port 36b of the panel discharge part 36, and a mounting process is complete | finished.

  FIG. 11 is a schematic perspective view schematically showing a configuration of a mobile phone which is an embodiment of the electronic apparatus of the present invention. Hereinafter, the configuration of the mobile phone will be described with reference to FIG. As shown in FIG. 11, the mobile phone 91 has an operation unit 92 and a display unit 93. A plurality of operation buttons 94 and 95 are arranged on the front surface of the operation unit 92, and a microphone (not shown) is built in the transmitter unit 96. In addition, a speaker (not shown) is arranged inside the reception unit 97 of the display unit 93.

  In the display section 93, the liquid crystal display device 1 described above is mounted inside the case body 98. The liquid crystal display device 1 installed in the case body 98 is configured so that the display surface can be viewed through the display window 99.

  Other electronic devices to which the liquid crystal display device according to the present invention can be applied include a liquid crystal television, a viewfinder type / direct monitor type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation. Video phone, POS terminal, digital still camera, and the like.

As described above in detail, according to the present embodiment, the following effects can be obtained.
(2) According to the present embodiment, the non-adhesive film 26 is cut for each mounting area of the driver ICs 13 to 15 from the ACF 23 with the non-adhesive film attached to the liquid crystal substrate 1 a by the ACF cut unit 63. Since the peelable non-adhesive film 26 is divided for each mounting area of the driver ICs 13 to 15, among the divided three non-adhesive films 26 a to 26 c, the non-adhesive film in the area corresponding to the driver IC to be mounted. Only the film can be peeled off. Therefore, for example, when the X driver IC 13 is mounted on the liquid crystal substrate 1a, only the first non-adhesive film 26a corresponding to the mounting area of the X driver IC 13 can be peeled off and mounted. Thereby, since the second and third non-adhesive films 26b and 26c remain in the mounting regions of the other driver ICs 14 and 15, impurities floating in the atmosphere are exposed to the second and third adhesive resin layers. It can prevent adhering to 24b, 24c.
Even if impurities such as dust adhere to the second and third non-adhesive films 26b and 26c by the time when the first and second Y driver ICs 14 and 15 are mounted, the second and third Y driver ICs 14 and 15 are mounted. Since the mounting process is performed after the non-adhesive films 26 b and 26 c are peeled off, impurities are sandwiched between the bump electrodes 27 provided on the respective driver ICs 14 and 15 and the electrodes 22 formed on the first substrate 3. Can be reduced. Thereby, it can suppress that a foreign material is pinched | interposed between the electrodes of each driver IC13-15 and the liquid crystal substrate 1a. Thereby, it becomes possible to conduct conductive connection between the electrodes in a stable state.

In addition, this embodiment is not limited above, It can also implement with the following forms.
(Modification 1) In the first embodiment, the non-adhesive film 26 is formed on the upper surface of the adhesive resin layer 24 by coating and drying a thermoplastic resin. However, the method of forming the non-adhesive film 26 is limited to this. Is not to be done. For example, the adhesive resin layer 24 is composed of a photoreactive adhesive resin layer, and the adhesive resin layer is made non-adhesive by UV (ultraviolet) irradiation, thereby forming a non-adhesive film on one surface thereof. It may be. In addition to UV irradiation, a non-adhesive film may be formed on one surface of the adhesive resin layer by eliminating the adhesiveness by surface modification. According to this, as in the above-described embodiment, it is possible to prevent impurities from adhering to the adhesive resin layer 24, and to suppress the impurities from being sandwiched between the bump electrode 27 and the electrode 22. be able to.

  (Modification 2) In the first embodiment, the ACF 23 with a non-adhesive film is attached to the electrode 22 formed on the first substrate 3, and then the X driver IC 13 is placed on the ACF 23 with the non-adhesive film, and the X driver The IC 13, the non-adhesive film-attached ACF 23, and the first substrate 3 were sandwiched and subjected to pressure bonding. The ACF 23 with the non-adhesive film is pasted on the bump electrode 27 of the X driver IC 13, and then the X driver IC 13 with the non-adhesive film-attached ACF 23 is placed on the electrode 22 of the first substrate, The X driver IC 13, the non-adhesive film-attached ACF 23, and the first substrate 3 may be sandwiched and subjected to a pressure-bonding process.

  (Modification 3) In the first and second embodiments, the temporary crimping process and the final crimping process are performed by crimping the X driver IC 13 and then crimping the first and second Y driver ICs 14 and 15. I made it. Alternatively, the X driver IC 13 may be crimped after the first and second Y driver ICs 14 and 15 are crimped.

  (Modification 4) In the second embodiment, the non-adhesive film 26 and the adhesive resin layer 24 are cut by the ACF cut unit 63. Alternatively, only the non-adhesive film 26 may be cut. According to this, as in the above-described embodiment, only the non-adhesive films 26a to 26c corresponding to the mounting regions of the respective driver ICs 13 to 15 can be peeled, so that the gap between the bump electrode 27 and the electrode 22 can be reduced. Impurities can be prevented from being caught in the substrate.

  (Modification 5) In the second embodiment, after the ACF 23 with the non-adhesive film is attached to the liquid crystal substrate 1a, the ACF 23 with the non-adhesive film is cut for each mounting area of the driver ICs 13-15. Alternatively, the ACF 23 with the non-adhesive film in which the non-adhesive film 26 is cut for each of the driver ICs 13 to 15 may be wound around the ACF reel 40 and attached to the liquid crystal substrate 1a. According to this, it is not necessary to use the ACF cut unit 63, and work efficiency can be improved.

  (Modification 6) In the above embodiment, it has been described that the driver ICs 13 to 15 are mounted on the COG (Chip On Glass) type liquid crystal substrate 1 a using the non-adhesive film-attached ACF 23. For example, a power IC for supplying power may be mounted on a COF (Chip On Film) type flexible substrate using an ACF with a non-adhesive film.

  (Modification 7) In the first and second embodiments, the case where a liquid crystal display (liquid crystal display device) is used has been described. This can be applied to a connection structure between various electro-optical panels such as an EL (electroluminescence) display device, a plasma display panel, and an FED (field emission display) and an external circuit.

The schematic perspective view which shows typically the structure of the liquid crystal display device in 1st Embodiment. FIG. 3 is a schematic cross-sectional view illustrating a configuration of a liquid crystal display device. The schematic block diagram which shows the structure of a mounting apparatus typically. Process sectional drawing which shows a mode that a driver IC is mounted in a board | substrate typically. The flowchart which shows the mounting method which mounts driver IC on a board | substrate. The schematic block diagram which shows typically the structure of the mounting apparatus in 2nd Embodiment. Process sectional drawing which shows a mode that a driver IC is mounted in a board | substrate typically. Process sectional drawing which shows a mode that a driver IC is mounted in a board | substrate typically. Process sectional drawing which shows a mode that a driver IC is mounted in a board | substrate typically. The flowchart which shows the mounting method which mounts driver IC on a board | substrate. The schematic perspective view which shows typically the structure of the mobile telephone which is an electronic device. FIG. 6 is a schematic cross-sectional view schematically showing a structure of a liquid crystal panel of a conventional technique.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device as an electro-optical device, 1a ... Liquid crystal substrate which comprises a liquid crystal display device, 3 ... 1st substrate which comprises a liquid crystal substrate, 4 ... 2nd substrate which comprises a liquid crystal substrate, 13 ... As an electronic component X driver IC, 14 ... 1st Y driver IC as an electronic component, 15 ... 2nd Y driver IC as an electronic component, 21 ... Connection part which comprises a liquid crystal display device, 22 ... Electrode, 23 ... Non-adhesive film ACF with a non-adhesive film as an attached anisotropic conductive film, 24... Adhesive resin layer as an adhesive layer, 24 a... First adhesive resin layer, 24 b ... Second adhesive resin layer, 24 c. Adhesive resin layer, 25 ... conductive particles constituting the adhesive layer, 26 ... non-adhesive film, 26a ... first non-adhesive film, 26b ... second non-adhesive film, 26c ... third non-adhesive film, 27 ... Bump electrode 31, 61 ... Mounting device as a manufacturing device, 3, 62 ... ACF sticking processing part, 34, 64 ... Temporary pressure-bonding processing part constituting the pressure-bonding part, 35 ... Main pressure-bonding processing part constituting the pressure-bonding part, 38 ... ACF sticking unit as the sticking part, 42 ... Temporary pressure-bonding table 43 ... Temporary pressure bonding head, 44 ... Main pressure bonding table, 45 ... Main pressure bonding head, 51 ... Base tape constituting non-adhesive film-attached ACF, 63 ... ACF cut unit as cut portion, 65 ... Peeling as peeling portion Device, 66 ... Recovery device, 71 ... Cutter, 75 ... Pad.

Claims (15)

An adhesive layer containing conductive particles;
A non-adhesive film provided on one surface of the adhesive layer;
An anisotropic conductive film with a non-adhesive film, comprising: a peelable protective film provided on the other surface of the adhesive layer. An anisotropic conductive film with a non-adhesive film according to claim 1,
The non-adhesive film is an anisotropic conductive film with a non-adhesive film, wherein the adhesive layer is formed by surface modification. An anisotropic conductive film with a non-adhesive film according to claim 1 or 2,
An anisotropic conductive film with a non-adhesive film, wherein the adhesive layer is a thermosetting resin. An anisotropic conductive film with a non-adhesive film according to any one of claims 1 to 3,
A substrate having an electro-optic material;
With electronic components,
The electro-optical device, wherein the substrate and the electronic component are electrically connected through the anisotropic conductive film with a non-adhesive film. The electro-optical device according to claim 4,
The electro-optical device is characterized in that the electro-optical material is a liquid crystal.   An electronic apparatus comprising the electro-optical device according to claim 4 as a display unit. A substrate,
An anisotropic conductive film provided with an adhesive layer containing conductive particles;
An electro-optical device manufacturing method having an electronic component electrically connected to the substrate through the anisotropic conductive film,
The anisotropic conductive film is an anisotropic conductive film with a non-adhesive film provided with a non-adhesive film formed on one surface of the adhesive layer,
An attaching step of attaching the adhesive layer side of the anisotropic conductive film with the non-adhesive film to the mounting region of the substrate;
A plurality of the electronic components placed on the non-adhesive film side of the attached anisotropic conductive film with the non-adhesive film are provided on the electronic component via the anisotropic conductive film with the non-adhesive film. A method of manufacturing an electro-optical device, comprising: a crimping step of crimping the bump electrodes and the plurality of electrodes formed in the mounting region of the substrate in a state where they can be electrically connected to each other. A method of manufacturing the electro-optical device according to claim 7,
The crimping step includes a temporary crimping step of temporarily attaching the electronic component to the mounting region on the substrate;
The plurality of bump electrodes provided in the electronic component and the plurality of electrodes formed in the mounting region on the substrate are electrically connected through the anisotropic conductive film with a non-adhesive film. A method of manufacturing an electro-optical device, comprising: A substrate,
An anisotropic conductive film provided with an adhesive layer containing conductive particles;
An electro-optical device manufacturing method comprising at least one electronic component electrically connected to the substrate through the anisotropic conductive film,
The anisotropic conductive film is an anisotropic conductive film with a non-adhesive film provided with a non-adhesive film provided on one surface of the adhesive layer,
Affixing step of attaching the non-adhesive film-attached anisotropic conductive film to the mounting area on the substrate by the adhesiveness of the adhesive layer;
A cutting step of cutting the anisotropic conductive film with the non-adhesive film after the pasting into a mounting region of the at least one electronic component;
Of the cut anisotropic adhesive film with a non-adhesive film, a stripping step of stripping the non-adhesive film in a region corresponding to the electronic component to be mounted;
The electronic component placed on the adhesive layer after peeling off, a plurality of bump electrodes provided on the electronic component via the adhesive layer, and a plurality of electrodes formed in the mounting region of the substrate, And a crimping step of crimping each of them to a state where they can be electrically conducted. A method of manufacturing the electro-optical device according to claim 9,
The crimping step includes a temporary crimping step of temporarily attaching the electronic component to the mounting region on the substrate;
An electro-optic comprising: a plurality of bump electrodes provided in the electronic component; and a main pressure bonding step of electrically connecting the plurality of electrodes formed in the mounting region on the substrate. Device manufacturing method. An electro-optical device manufacturing method according to claim 7,
The method of manufacturing an electro-optical device, wherein the electro-optical material is a liquid crystal. An anisotropic conductive film with a non-adhesive film having an adhesive layer containing conductive particles and a peelable non-adhesive film provided on one surface of the adhesive layer;
An electro-optical device manufacturing apparatus having an electro-optical material and an electronic component electrically connected to an electronic component through the anisotropic conductive film with a non-adhesive film,
The affixing part that affixes the anisotropic conductive film with the non-adhesive film to the mounting region of the electronic component on the substrate;
The notched portion for cutting the pasted anisotropic conductive film with the non-adhesive film into the mounting region of the electronic component;
Of the cut anisotropic anisotropic conductive film with the non-adhesive film, a peeling portion for peeling the non-adhesive film corresponding to the mounting region of the electronic component,
An electro-optical device manufacturing apparatus, comprising: a pressure-bonding portion that electrically connects the electronic component to the substrate through the adhesive layer after the peeling. The electro-optical device manufacturing apparatus according to claim 12,
The pressure-bonding part includes a temporary pressure-bonding part that temporarily pressure-bonds the electronic component to the adhesive layer, and a main pressure-bonding part that pressure-bonds the electronic component to be conductive with the substrate via the adhesive layer. An electro-optical device manufacturing apparatus. The electro-optical device manufacturing apparatus according to claim 12 or 13,
An electro-optical device manufacturing apparatus, wherein the electro-optical material is a liquid crystal. A manufacturing method using the electro-optical device manufacturing apparatus according to any one of claims 12 to 14,
A pasting step of pasting the anisotropic conductive film with a non-adhesive film on the mounting area of the substrate by the pasting part,
A notch process for cutting the pasted anisotropic conductive film with the non-adhesive film by a notch part, and
Of the anisotropic conductive film cut by the peeling portion, a peeling step of peeling a non-adhesive film in a region corresponding to the electronic component to be mounted;
A manufacturing method using an electro-optical device manufacturing apparatus, comprising: a pressure-bonding step of pressure-bonding the electronic component and the substrate through an adhesive layer after being peeled off by a pressure-bonding portion.

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