JP4628765B2 - Film tape feeder - Google Patents

Description

  The present invention relates to an apparatus for supplying a film tape used for performing some work on an LCD substrate, a PDP substrate, or the like.

  In the manufacturing process of LCD (liquid crystal display) and PDP (plasma display), ACF (anisotropic) used to thermally weld TCP (Tape Carrier Package), flip chip and pair chip as driver chips to LCD substrate and PDP substrate Various types such as conductive film) tape, Teflon (DuPont) tape as a protective tape used to prevent ACF resin sticking from adhering to the pressure bonding head, and cleaning tape for cleaning electrodes on the LCD surface Film tape is used.

  For example, as shown in FIG. 14, the supplied ACF tape 101 is provided in a state of being wound around a reel 103, and is sequentially sent to a mounting process of a TCP on a substrate 107 by a thermocompression bonding apparatus 105. The tape 101 is wound around another reel 109 and discarded.

  Also, the driver chip is pressure-bonded to the liquid crystal panel, as shown in FIG. 15, by attaching the ACF tape 121 to the liquid crystal panel 125 (first step), and as shown in FIG. 16, the driver chip 123 is attached to the ACF tape 121. Temporary pressure bonding (second step) is performed, and as shown in FIG. 17, the driver chip 123 is finally pressure bonded to the liquid crystal panel 125 by the pressure bonding head 127 (third step). Among these, when performing the main pressure bonding in the third step, the protective tape 129 is used in order to prevent the protrusion of the resin of the ACF tape 121 from adhering to the pressure bonding head 127. The supplied protective tape 129 is provided in a state of being wound around a reel 131, and is used to protect the pressure-bonding head 127 in the final pressure bonding process, and then the used tape 129 is used on another reel 133. It is wound up and discarded.

  Therefore, when the tapes 101 and 129 wound around the reels 103 and 131 are consumed, it is necessary to replace the tape with a new reel and supply the tape. It was not preferable.

Therefore, the technique disclosed in Patent Document 1 has been developed. First, as a tape storage section, four separate reels 42A to 42D wound with the ACF tape 5 are rotatably supported on a reel shaft 43. For example, when the reel 42A is consumed, the tape is replenished from any of the other reels 42B, 42C, and 42D, so that the trouble of exchanging the reels can be omitted. The tape switching time was calculated by subtracting the integrated value of the tape feed amount from the length of the tape wound on the reel before use, and calculating the remaining amount of tape. When this is detected, the operator is warned by the indicator lamp 201. Further, the supply of the tape is such that the end portion of the consumed tape and the start end portion of the supplied tape are brought together and connected by joint tapes 212a and 212b. As a result, the trouble of newly arranging the replenished tape on the guide roller is eliminated, and the occurrence of erroneous work is also prevented. Further, the portion connected by the joint tapes 212a and 212b is detected by the sensor 51P, and the tape is sent so as to pass the pasting work position so that the pasting work to the PDP substrate 11 is not performed. It is like that.
JP-A-2003-197677 (page 19, FIG. 3, FIG. 4, page 21, FIGS. 18 to 21, page 22, FIG. 27)

  In the above-described conventional apparatus, the workability of the reel replacement work is improved, the frequency of reel replacement is reduced, and the accuracy of the remaining amount detection is improved. However, when connecting the end portion of the consumed tape and the starting end portion of the supplied tape, the pasting operation on the PDP substrate must be interrupted.

  The present invention has been made in view of the above-described conventional problems, and supplies a film-like tape used for performing some work on an LCD substrate or a PDP substrate without interrupting the work on the substrate. An object is to provide an apparatus.

In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a reel on which a film-like tape is wound, and the tape is supplied from the reel to the tape to the substrate. A substrate working means for working; a tape feeding means provided on the downstream side of the substrate working means; and feeding the tape from the reel to the substrate working means; and a tape feeding provided on the upstream side of the substrate working means. In the substrate working apparatus provided with a resistance applying means for applying resistance to the tape when the means sends the tape, the film-like tape is an ACF tape or a protective tape or a cleaning tape for preventing the ACF tape from adhering. And the substrate working means includes a thermocompression bonding apparatus for thermocompression bonding the ACF tape to the substrate, and an electronic component via the protective tape. The is any device of the cleaning device of the thermocompression bonding device, and the cleaning tape thermocompression bonding is brought into contact with the substrate to the substrate to clean the substrate, said tape feeding means, interposed between said tape in a driving double roller configured to rotated in opposite directions to each other, the resistance applying means, with each other respectively rotational resistance is imparted to the rollers to impart resistance in the feeding direction in between the tape It is a resistance double roller configured to be rotatable in the opposite direction .

2. The joining station for joining the end of the tape wound around the reel with the tape cut and the beginning of the tape wound around the new reel between the reel and the resistance double roller according to claim 1. That is.

  The structural feature of the invention according to claim 3 is that in claim 2, the film-like tape is an ACF tape, and the end of the tape wound around the reel that has been cut off at the joining station and a new reel are provided. This is to provide a thermocompression bonding apparatus for joining the wound tape start end.

  The constitutional feature of the invention according to claim 4 is that, in claim 2, the film-like tape is a protective tape or a cleaning tape, and a splicing tape is applied to the joining station to wind the reel on the tape. A splicing tape attaching device is provided for joining the end of the tape that has been rotated and the start of the tape that has been wound around a new reel.

  The structural feature of the invention according to claim 5 is that, in claim 2, the film-like tape is a cleaning tape, and at the joining station, the end of the tape wound around the reel and the new reel are wound on the reel. The start end of the wound tape is joined by a stapler.

According to a sixth aspect of the present invention, there is provided a structural feature of the invention according to any one of the first to fifth aspects, wherein the tape breakage detecting that there is no tape wound around the reel between the reel and the resistance double roller. This means that a detection means is provided.

According to a seventh aspect of the present invention, there is provided a structural feature of the invention according to any one of the second to sixth aspects, wherein the joining station , a thermocompression bonding apparatus for thermocompression bonding the ACF tape to the substrate, and an electronic component via the protective tape. The end and start of the tape provided between a thermocompression bonding apparatus for thermocompression bonding to the substrate with an ACF tape and a cleaning apparatus for cleaning the substrate by bringing the cleaning tape into contact with the substrate And a control means for driving the feeding means and skipping the joining point detected by the detecting means to the downstream side from any one of the devices .

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, a rotating shaft that protrudes in a direction to be supported by each roller of the resistance double roller is relative to the roller. The rotation shafts are provided so as not to rotate, and each of the rotation shafts is rotatably supported by a bearing, and rotation resistance is applied by contacting a friction member with the rotation shaft.

According to the first aspect of the present invention, for example , the tape is forcibly pulled out by the driving double roller as the feeding means from the resistance double roller that sandwiches the film-like tape such as the ACF tape and gives resistance in the conveying direction. Therefore, tension is generated on the tape. For this reason, the tape is supplied in a tensioned state at a working position where a thermocompression bonding apparatus that thermocompresses the ACF tape that requires tension on the ACF tape is applied to the substrate . Therefore, the work performed by the thermocompression bonding apparatus can be continuously performed without being affected by the work performed on the upstream side of the resistance double roller .
Similarly, when using a protective tape for preventing the ACF tape from adhering, the protective tape is applied to the protective tape at the working position of the thermocompression bonding apparatus that thermocompresses the electronic component to the substrate with the ACF tape via the protective tape. It is desirable that tension is generated. In this case, since the tension of the protective tape is maintained at the work position as described above, the work by the thermocompression bonding apparatus is continuously performed without being affected by the work performed on the upstream side of the resistance double roller. be able to.
Similarly, when a cleaning tape is used, it is desirable that tension be generated in the cleaning tape at the working position of the cleaning device that cleans the substrate by bringing the cleaning tape into contact with the substrate. In this case, since the tension of the cleaning tape is maintained at the operation position as described above, the operation by the cleaning device is continuously performed without being affected by the operation performed on the upstream side of the resistance double roller. Can do.
Then, by using a driving double roller as the feeding means and a resistance double roller as the resistance applying means, respectively, it is possible to provide a supply device for a film-like tape having a simple structure that exhibits the effect of the invention according to claim 1. it can.

According to the second aspect of the present invention, at the joining station provided between the reel and the resistance double roller , the end of the tape wound around the reel out of the tape and the tape wound around the new reel. The beginning is joined. Therefore, even when the film-like tape breaks, the work by the substrate working means can be continuously performed by performing the joining work upstream of the resistance double roller .

  In the invention according to claim 3, by using the characteristics of the ACF tape, the end of the tape wound around the reel that has been cut out of the tape and the beginning of the tape wound around the new reel can be easily performed by the thermocompression bonding apparatus. Joined quickly. Therefore, even when the ACF tape runs out of tape, the continuous work by the substrate working means can be further secured by performing the joining work quickly on the upstream side of the resistance applying means.

  According to the fourth aspect of the present invention, the splicing tape application device can quickly join the end of the tape wound around the reel that has been cut out of the tape and the start end of the tape wound around the new reel. Since the splicing tape does not protrude from the tape edge and has a very small thickness, the joined tape can be smoothly conveyed. Therefore, even when the protective tape or the cleaning tape runs out of tape, the continuous operation by the substrate working means can be further secured by performing the same joining work quickly on the upstream side of the resistance applying means.

  According to the fifth aspect of the present invention, with the cleaning tape that does not require much joining accuracy, the end of the tape wound around the reel that has been cut out of the tape and the beginning of the tape wound around the new reel can be joined by staple. Since this joining work can be performed quickly and easily by stapler, even if the cleaning tape runs out of tape, continuous work by the substrate working means is further secured by performing the joining work upstream of the resistance applying means. be able to.

  According to the invention of claim 6, since a new reel can be prepared immediately based on the detection result of the detection means, the continuous work by the substrate working means can be further performed using the film-like tape wound around the new reel. Can be secured.

  In the invention which concerns on Claim 7, the said joining location is detected by the detection means provided between the said joining station, a means, and the said board | substrate working means, and the detected joining location is sent by a control means. The means can be driven to skip downstream of the substrate working means. Therefore, it is possible to prevent the joint portion of the supplied tape that cannot be used for the work in the substrate working means from being used for the work, and to connect the joint place downstream of the substrate work means in a series of steps. Therefore, the tape can be supplied efficiently without interrupting the substrate operation.

According to the eighth aspect of the present invention, the resistance double roller does not drive itself, and a rotational resistance is imparted to the rotating shaft provided to the roller in a relatively non-rotatable manner by the friction member. The tape is pulled out in the transport direction while being given resistance by sandwiching the tape between the two rollers and pulling it by the driving double roller.

  A film tape supply method according to the present invention and a first embodiment to which an apparatus used therefor is applied will be described with reference to the drawings. FIG. 1 shows an outline of a component mounter 2 having an ACF tape supply device 1.

  The component mounter 2 is for mounting a flexible printed circuit board (FPC) having a drive circuit formed on an LCD panel board 3. The ACF tape supply device 1 includes a thermocompression bonding device 11 for joining the ACF supply reel 7 and the ACF tapes 5 installed at the joining station JS, a resistance double roller 13 as resistance applying means, and a drive double as tape feeding means. A roller 17 and a control device 18 for controlling the operation of each device and performing various calculations are provided. A component mounting machine 2 is configured by adding a thermocompression bonding device 15 for mounting an FPC (not shown) by pressure bonding the ACF tape 5 to the LCD panel substrate 3 to the ACF tape supply device 1.

  The ACF supply reel 7 is overlaid with an ACF tape 5 and a separator 6 that prevents unnecessary bonding between the ACF tapes 5 and facilitates peeling, and is wound in a state of being bonded with an adhesive. A photo sensor 19 as a tape break sensor is provided in the vicinity of the ACF supply reel 7 to detect when the amount of tape in the ACF supply reel 7 is equal to or less than a set amount and notify the operator. A first guide roller 21 is rotatably supported on the downstream side of the ACF supply reel 7 (right side in the figure), and the ACF tape 5 fed laterally from the ACF supply reel 7 is converted into a vertical direction. To send. A second guide roller 23 is rotatably supported below the first guide roller 21 so that the ACF tape 5 fed in the vertical direction is converted into a lateral direction and sent to the joining station JS. . As shown in FIGS. 4 and 5, the bonding station JS is provided with a tape fixing base 25 of the thermocompression bonding apparatus 11. A guide wall 27 is juxtaposed along the tape feed direction on the tape fixing base 25, and a vacuum suction portion 31 is provided on each tape feed surface 29 in front of the guide wall 27. A vacuum pipe 32 leading to a vacuum pump (not shown) is disposed below the vacuum suction portion 31, and as shown in FIGS. 2 and 4, the ACF tape wound around a reel of tape that has been cut in the vacuum suction portion 31. 5 and the start end 35 of the ACF tape 5 wound around a new reel are overlapped and fixed.

  Above the tape fixing base 25, a pressing head 37 that presses the tape stacked as described above is provided so as to be movable up and down. The pressing head 37 is connected to the piston portion 41 of the cylinder device 39 at the upper portion thereof. ing. The cylinder device 39 is provided with an intake pipe 43 that encloses air and an exhaust pipe 45 that exhausts air. By suctioning and exhausting air by an air pump (not shown), the piston 41 is moved up and down so that the pressing head 37 is moved up and down. It has become. In addition, a heater portion 47 is provided in the vicinity of the pressing surface 37a of the pressing head 37, and the amount of heat necessary for thermocompression bonding of the ACF tape 5 is generated on the pressing surface 37a.

  As shown in FIG. 1, the resistance double roller 13 is disposed on the downstream side of the thermocompression bonding apparatus 11. The resistance double roller 13 is not driven by itself and is supported so that the two rollers face each other and can rotate in opposite directions. These rollers are formed with a rotation shaft that protrudes in a supported direction so as not to rotate relative to each other. The rotation shaft is rotatably supported by a bearing and is rotated when a friction member is brought into contact with the rotation shaft. Resistance is given. When the ACF tape 5 is sandwiched between the two rollers and pulled by a driving double roller described later, the ACF tape 5 is pulled out in the transport direction while being given resistance.

  A gap sensor 48 is provided on the downstream side of the resistance double roller 13, and the gap sensor 48 detects a joining portion of the ACF tape 5 or 6 formed thick by joining and transmits it to the control device 18. It has become. The control device 18 drives the drive double roller 17 to skip to the downstream side of the work position WA so that the joint is not used at the work position WA.

  Further, the third and fourth guide rollers 49 and 51 are rotatably supported on the downstream side of the resistance double roller 13 so that the ACF tape 5 is sent out to the work position WA of the thermocompression bonding apparatus 15 for mounting the FPC. It has become.

  Although not shown, the thermocompression bonding device 15 is provided with a crimping table on which the LCD panel substrate 3 is placed, and a slider 53 having a thermocompression bonding head below is provided above the pressure bonding table by a cylinder device (not shown). It is raised and lowered toward the crimping table.

  A fifth guide roller 55 is rotatably supported at a position facing the opposite side of the fourth guide roller 51 with the slider 53 interposed therebetween, and the fourth guide roller 51 and the fifth guide roller 55 are in contact with each other. The LCD panel substrate 3 mounted with the ACF tape 5 stretched between them passes through the horizontal vicinity.

  Further, a cutting device (not shown) is provided between the fourth and fifth guide rollers 51 and 55 and downstream of the slider 53. For each required length used for mounting work by this cutting device, an ACF is provided. Only the tape 5 is cut. Sixth and seventh guide rollers 57 and 59 are rotatably supported above the fifth guide roller 55, and the separator 6 from which the ACF tape 5 has been cut and removed by the cutting device is fed. The separator 6 is sent to the drive double roller 17 by changing the feeding direction by an eighth guide roller 61 rotatably supported above the seventh guide roller 59. Like the resistance double roller 13, the drive double roller 17 is a roller in which two rollers are opposed to each other. The drive double roller 17 is rotated by a drive device (drive motor) (not shown) and is disposed in the feed direction with the separator 6 in between. 65 is sent out. The tension in the ACF tape 5 (separator 6) is generated at the working position of the thermocompression bonding device 15 by the pulling in the feeding direction by the driving rotation of the driving double roller 17 and the resistance of the resistance double roller 13.

  A method of using the ACF tape supply apparatus 1 configured as described above will be described. First, the ACF supply reel 7 is rotatably supported with a rotational resistance applied thereto, and a separator 6 is overlapped on the inside of the ACF supply reel 7 and an ACF tape 5 is overlapped on the outside, and is adhered with an adhesive. It is wound in a state (hereinafter referred to as ACF tape 5 or 6). The wound ACF tapes 5 and 6 are guided by the first and second guide rollers 21 and 23, pass through the junction double roller 13 through the joining station JS, and pass through the third and fourth guide rollers 21 and 23. Are guided by the guide rollers 49, 51 and the work position WA, and are guided by the fifth, sixth, seventh, eighth guide rollers 55, 57, 59, 61 to drive the double roller 17 and the disposal box 65. It is routed to reach. (However, as described above, since the ACF tape 5 is pressed against the LCD panel substrate 3 at the working position WA and separated from the separator 6, only the separator 6 is sent to the drive double roller 17. .)

  Next, when the driving double roller 17 is driven by a driving device (driving motor), ACF tapes 5 and 6 are fed out by the ACF supply reel 7 and supplied to the working position WA. In mounting the LCD panel substrate 3 with the ACF tape 5, the slider 53 of the thermocompression bonding device 15 is lowered toward the LCD panel substrate 3, and the FPC is mounted by a thermocompression bonding head (not shown) provided at the tip. This is done by thermocompression bonding. At this time, the ACF tape 5 is controlled to be fed by a predetermined length (one pitch) used at a time for each thermocompression bonding operation. Then, only the ACF tape 5 is cut for each required length used for the mounting operation described above by a cutting device (not shown) provided on the downstream side of the operation position WA. The cut ACF tape 5 is used for actual thermocompression bonding of the FPC to the LCD panel substrate 3. Then, the separator 6 is not cut, but is separated from the ACF tape 5 and guided to the fifth, sixth, seventh, and eighth guide rollers 55, 57, 59, and 61. Along with driving, it is discarded in the disposal box 65.

  Next, a case where the ACF tape 5 or 6 is exchanged will be described below. When the winding amount of the ACF supply reel 7 is reduced by use and becomes less than a preset amount, the photosensor 19 detects and notifies the operator. The notified worker arranges the end of the ACF tapes 5 and 6 wound around the ACF supply reel 7 which has been cut in the joining station JS. Then, the ACF tapes 5 and 6 are fed out from a new ACF supply reel 7 prepared in advance, and the start ends of the ACF tapes 5 and 6 are overlapped with the end points, and arranged at the joining station JS. In the joining station JS, a vacuum pump (not shown) is operated to adsorb the ACF tapes 5 and 6 arranged as described above, so that the terminal end overlapped immediately below the pressing head 37 Fix so that the starting edge comes. And the cylinder apparatus 39 of the thermocompression bonding apparatus 11 is operated, and the press head 37 overheated previously is dropped. By this operation, the overlapped end and start ends are thermocompression bonded, and the ACF tape 5, 6 wound on the ACF supply reel 7 that has been cut off of the tape and the ACF tape wound on the new ACF supply reel 7. Etc. 5 and 6 are joined.

  The joint portion where the ACF tapes 5 and 6 are joined is detected by the gap sensor 48 when the tapes 5 and 6 are sent in the transport direction, and the gap sensor 48 passes the joint portion to the control device 18. Communicate to the effect. Therefore, the control for skipping the joint portion first determines whether or not the joint portion has passed the position of the gap sensor as shown in FIG. 7 (step 101). The control device 18 calculates the distance to be skipped from the position where the joint has passed (step 102). A command is sent to the drive motor that drives the drive double roller 17 to send the distance by the distance (step 103). The driving double roller 17 sends ACF tape 5 and 6 by the distance to be skipped (step 104). As a result, the joint portion can be prevented from being indexed to the work position WA. The ACF tape 5 is cut by the cutting device at the position where it is sent and stopped, and then the normal mounting operation on the LCD panel substrate 3 is continued.

  Even when the ACF tapes 5 and 6 are exchanged as described above, the ACF tapes 5 and 6 are always supplied in a tensioned state at the work position WA of the thermocompression bonding operation for mounting the FPC as described above. Will be. Therefore, the thermocompression bonding operation can be continuously performed without being affected by the operation of exchanging the ACF tape 5 or 6 performed on the upstream side of the resistance double roller 13.

  The joining of the ACF tapes 5 and 6 is not limited to the one according to the present embodiment, and as shown in FIG. The 6 pieces may be stacked and thermocompression bonded so as to straddle both ends.

  Moreover, as a thermocompression bonding apparatus for joining the ACF tapes 5 and 6 together, a thermocompression bonding jig 34 as shown in FIG. 6 may be used. The thermocompression-bonding jig 34 has a strip-like plate-like body intersected at an intermediate portion and is pivotally supported so as to be formed in a scissors shape. A tape holder 36 and a tape pressing portion 38 are formed at one opposing end. And are provided. The tape holder 36 is provided with a tape guide 44 provided with a tape presser 40 on both sides, and the end and start of the tape to be joined on the tape guide 44 are overlapped and fixed. A heater section (not shown) is provided in the vicinity of the center of the tape holder 36, and the heater section generates heat for thermocompression bonding of the ACF tape 5. A grip 42a is provided at the opposite end of the tape holder 36, and a power cord 46 connected to the power supply of the heater is provided at the tip of the grip 42a. The tape pressing portion 38 is configured to move so as to be able to approach and separate about the portion that is pivotally supported with respect to the tape placing portion 36. A gripping portion 42b is provided at the opposite end of the tape pressing portion 38, and ACF tapes 5 and 6 fixed to the tape placement portion 36 by gripping the gripping portion 42B and the gripping portion 42a. It is pressed by the tape pressing portion 38.

  Since the thermocompression bonding jig 34 can be manufactured in a very compact manner, the operator can hold it and can easily perform the thermocompression bonding operation between 5, 6 ACF tapes and the like without taking a special work place. .

  Next, a second embodiment according to the present invention will be described with reference to the drawings. The present embodiment relates to a protective tape supply device 71 instead of an ACF tape. As shown in FIG. 8, the protective tape 73 is the thermocompression bonding of the ACF tape 5 used in the first embodiment when the driver chip (FPC) 87 having the drive circuit formed thereon is mounted on the LCD panel substrate 3. In this case, the sticking adhesive portion is used as a tape for preventing the adhesive portion from adhering to the thermocompression bonding head provided at the tip of the slider 53 of the thermocompression bonding apparatus 15. As the protective tape 73, a material excellent in heat resistance, durability, non-adhesiveness and the like is suitable, and for example, a polyfluorinated ethylene (trade name: Teflon) tape can be used.

  In the present embodiment, the number of guide rollers is smaller than that in the first embodiment, and the protective tape 73 is stretched between the third guide roller 49 and the fourth guide roller 51, and the LCD panel substrate 3. In order to prevent the sticky adhesive portion from adhering to the thermocompression bonding head when the ACF tape 5 is thermocompression bonded, it is configured to be used over the ACF tape. The point is different. Further, as shown in FIG. 9 and FIG. 10, the end 77 of the protective tape 73 wound on the reel that has been cut out of the tape and the start end 79 of the protective tape 73 wound on the new reel are brought together. One or two splicing tapes 81 and 83 are bonded and joined so as to straddle the protective tape 73. The splicing tape is extremely thin, and the splicing tapes 81 and 83 and the protective tape 73 are configured to change the color, and the color sensor 85 detects the spliced portion. Other configurations are the same as those in the first embodiment, and thus are omitted.

  The usage method of the supply apparatus 71 of the protective tape (film tape) comprised as mentioned above is demonstrated. In the present embodiment, after the photosensor 19 detects that the protective tape 73 of the supply reel 75 is out of tape, the protective tape 73 wound around the reel of the tape between the photosensor 19 and the resistance double roller 13 is used. The work of joining the end of the tape and the start of the protective tape 73 wound around a new reel is performed. A space between the photo sensor 19 and the resistance double roller 13 corresponds to the joining station JS. As shown in FIG. 9 and FIG. 10, this work uses a splicing tape affixing device (not shown) in which splicing tapes 81 and 83 are wound around a reel or affixed to a release sheet. One end or two splicing tapes 81 and 83 are bonded and joined so that the end 77 and the start end 79 of the tape 73 are put together and straddle both protective tapes 73.

  According to the splicing tapes 81 and 83, the protective tape 73 can be quickly joined. Therefore, even when the protective tape runs out of tape, the continuous operation by the thermocompression bonding device 15 for mounting the FPC can be further secured by quickly performing the joining operation upstream of the resistance double roller 13. Further, since the splicing tapes 81 and 83 do not protrude from the tape edge, the tape does not stick to the apparatus with the glue, and the guide roller or the like that is the tape transport path is not contaminated by the glue. In addition, the holding power is excellent, and the bonded tape is hardly displaced. The thickness of this tape is extremely thin, and there is little influence on the automatic machine by using this tape.

  Note that the protective tape 73 is supplied to the working position WA where the ACF tape 5 is thermocompression bonded in a state where the protective tape 73 is tensioned as described above. However, if the protective tape is in tension when the driver chip 87 is crimped to the LCD panel substrate 3 by the thermocompression bonding head, the holding force is exerted on the resistance double roller 13 and the driving double roller 17 holding the protective tape 73. When the difference is generated, the protective tape 73 is displaced in the direction of the double roller 13 or 17 having the stronger holding force, and the driver chip 87 may be displaced from the predetermined thermocompression bonding position. . Therefore, in such a case, after the driving double roller 17 is reversely rotated to cause the protective tape 73 to loosen, the above-described thermocompression bonding is performed. The invention according to claim 1 includes such a case.

  Next, a third embodiment according to the present invention will be described below with reference to the drawings. The present embodiment is for the cleaning tape supply device 91. In this embodiment, as shown in FIG. 11, the number of guide rollers is smaller than in the first embodiment, and the cleaning tape 92 is stretched between the second guide roller 23 and the third guide roller 49. Then, it passes through the horizontal vicinity of the LCD panel substrate 3. Further, a cleaning head 99 as a substrate working means is provided at the working position of the LCD panel substrate 3 and is downstream of the holding claw 93 holding the cleaning tape 92 on the downstream side of the resistance double roller 13 and the third guide roller 49. A gripping / feeding claw 95 is provided on the side, and a dancing roller 97 is supported between the fifth guide roller 55 and the sixth guide roller 57 so as to be movable up and down.

  The gripping claw 93 is configured to be openable and closable with the cleaning tape 92 interposed therebetween. When the cleaning tape 92 is fed in the transport direction, the gripping claw 93 is open so that the tape 92 can freely pass therethrough. When the feeding of 92 is stopped and a cleaning operation described later is performed, the tape 92 is gripped by being closed. The grip / feed claw 95 is configured to be openable and closable with the cleaning tape 92 interposed therebetween, and is configured to be movable up and down within a predetermined range corresponding to one pitch for feeding the tape 92. The dancing roller 97 rises when the cleaning tape 92 is loosened, and a limit switch (not shown) provided at the uppermost part is turned on to drive the driving double roller 17 to feed the tape 92 in the transport direction and It is configured to take looseness.

  The cleaning head 99 is provided above the LCD panel substrate 3 to be operated so as to be moved up and down by a cylinder device (not shown), and is configured to press the cleaning tape 92 against the electrode surface provided on the surface of the LCD panel substrate 3. ing. The LCD panel substrate 3 is placed on a work table (not shown), and the LCD panel substrate 3 on the work table is moved in the transport direction in a state where the cleaning tape 92 is pressed against the LCD panel substrate 3 to thereby move the surface of the electrode surface. A cleaning operation is performed. Further, as shown in FIG. 12, the cleaning tape 92 is joined by joining the end 94 of the cleaning tape 92 wound around the reel with the tape cut and the starting end 96 of the cleaning tape 92 wound around the new reel. Thus, a single splicing tape 81 is attached and joined so as to straddle both the cleaning tapes 92. The splicing tape 81 is extremely thin, so that the splicing tape 81 and the cleaning tape 92 are changed in color, and the color sensor 85 detects the spliced portion. Other configurations are the same as those in the first embodiment, and are therefore omitted.

  A method of using the cleaning tape supply device 91 configured as described above will be described. In this embodiment, when performing a cleaning operation, the drive double roller 17 is driven to send the cleaning tape 92 in the transport direction, and tension is applied to the cleaning tape 92 at the cleaning operation position. In this case, tension is generated in the cleaning tape 92 between the resistance double roller 13 and the drive double roller 17 as in the first embodiment. Next, in a state where the tension is generated, the gripping claw 93 and the grip / feed claw 95 are closed to grip the cleaning tape 92. Next, a cylinder device (not shown) is driven to lower the cleaning head 99 and press the cleaning tape 92 against the LCD panel substrate 3. Then, the surface of the LCD panel substrate 3 provided with the electrodes is cleaned by moving the LCD panel substrate 3 on the work table in the transport direction.

  After the cleaning operation, the gripping claws 93 are opened and the tape 92 can freely pass between the gripping claws 93. The gripping / feeding claw 95 is lifted in a closed state and performs an operation of feeding the tape 92 in the transport direction by one pitch. At this time, as the tape 92 is fed, the dancing roller 97 rises in the direction of taking the tape 92 loose. Next, when the grip / feed claw 95 is opened, the grip 92 is released and lowered. When such an operation is repeated and the dancing roller 97 reaches the uppermost part, the limit switch provided at the uppermost part is turned on to drive the driving double roller 17 so that the tape 92 is fed in the transport direction. And the tape 92 is loosened.

  In the present embodiment, after the photosensor 19 detects that the protective tape 73 of the supply reel 75 is out of tape, the cleaning tape 92 wound around the tape-out reel between the photosensor 19 and the resistance double roller 13 is used. The operation of joining the end of the cleaning tape and the starting end of the cleaning tape 92 wound around the new reel is performed. A space between the photo sensor 19 and the resistance double roller 13 corresponds to the joining station JS. This operation is performed by using a splicing tape affixing device (not shown) in which the splicing tape 81 is wound around a reel or affixed to a release sheet, as shown in FIG. And a single splicing tape 81 are bonded and joined so as to straddle both cleaning tapes 92.

  As shown in FIG. 13, the joining accuracy of the cleaning tape 92 is not required so much, so that the end 94 of the cleaning tape 92 wound around the reel out of tape and the cleaning tape 92 wound around the new reel are removed. The start end 96 may be overlapped and joined by a stapler 98. According to the stapler, the joining operation can be performed very quickly. In this case, a metal detection sensor can be used for detection of the joint.

  Moreover, about the joining method of the said various film tape, it is not limited to the said embodiment, The existing technique can be selected and used according to the kind of tape.

  Moreover, the detection means for detecting the tape break is not limited to the photosensor of the above embodiment, and various existing techniques that can detect the tape break can be selected and used.

1 is a schematic diagram of an ACF tape supply device according to a first embodiment of the present invention. The figure which shows the joining method of an ACF tape. The figure which shows the other joining method of an ACF tape. The front view of the thermocompression bonding apparatus which joins an ACF tape. The same side view. The perspective view of other embodiment of the thermocompression bonding apparatus which joins an ACF tape. The block diagram which shows the control for skipping a junction part. The schematic diagram of the supply device of the protection tape concerning a 2nd embodiment of the present invention. The figure which shows the joining method of a protective tape. The figure which shows the other joining method of a protective tape. Schematic of the cleaning tape supply apparatus according to the third embodiment of the present invention. The figure which shows the joining method of a cleaning tape. The figure which shows the other joining method of a cleaning tape. The figure which shows a prior art. The figure which shows the 1st process of another prior art. The figure which shows the 2nd process of another prior art. The figure which shows the 3rd process of another prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... ACF tape supply apparatus, 3 ... LCD panel substrate, 5 ... ACF tape, 6 ... Separator, 11 ... Thermocompression bonding apparatus which joins ACF tapes, 13 ... Resistance double roller (resistance provision means), 15 ... FPC is mounted Thermocompression bonding apparatus (substrate working means), 17 ... drive double roller (tape feeding means), 18 ... control device (control means), 33 ... terminal, 34 ... thermocompression jig, 35 ... starting edge, 48 ... gap sensor (detection) 71) protective tape supply device, 73 ... protective tape, 75 ... supply reel, 77 ... end, 79 ... start end, 81 ... splicing tape, 83 ... splicing tape, 85 ... color sensor (detection means), 91 ... cleaning Tape supply device, 92 ... cleaning tape, 94 ... terminal, 95 ... grip / feed claw (tape feeding means), 96 ... start, 98 ... Tchikisu, JS ... joining station, WA ... working position.

Claims (8)

A reel on which a film-like tape is wound, a substrate working means for supplying the tape from the reel to work the substrate against the substrate, and a downstream side of the substrate working means. Tape feeding means that is fed out from a reel and sent to the substrate working means, and resistance applying means that is provided upstream of the substrate working means and applies resistance to the tape when the tape feeding means sends the tape . In substrate working equipment,
The film-like tape is an ACF tape or a protective tape or a cleaning tape that prevents adhesion of the ACF tape,
The substrate working means contacts the substrate with a thermocompression bonding apparatus for thermocompression bonding the ACF tape to the substrate, a thermocompression bonding apparatus for thermocompression bonding an electronic component to the substrate with the ACF tape via the protective tape, and the cleaning tape. And any one of the cleaning devices for cleaning the substrate,
The tape feeding means is a drive double roller configured to drive and rotate in opposite directions with the tape interposed therebetween,
It said resistance applying means is characterized in that the a resistance double roller rollers respectively rolling resistance is configured to be rotatable in the directions opposite to each other are imparted to confer resistance in a direction across at feed between the tape Film tape supply device. 2. The joining station for joining the end of the tape wound around the reel with the tape cut and the beginning of the tape wound around the new reel between the reel and the resistance double roller according to claim 1. An apparatus for supplying a film-like tape.   3. The thermocompression bonding according to claim 2, wherein the film-like tape is an ACF tape, and the end of the tape wound on the tape-reeled reel and the beginning of the tape wound on the new reel are joined to the joining station. An apparatus for supplying a film-like tape, comprising a device.   3. The film tape according to claim 2, wherein the film-like tape is a protective tape or a cleaning tape, and a splicing tape is applied to the joining station to wind the end of the tape wound around the reel and the new reel. A film tape supply device, comprising: a splicing tape attaching device for joining the starting end of the tape.   3. The film tape according to claim 2, wherein the film tape is a cleaning tape, and the end of the tape wound around the reel that has been cut at the joining station and the beginning of the tape wound around a new reel are joined together by a stapler. An apparatus for supplying a film-like tape. 6. A film-like tape according to claim 1, further comprising a tape breakage detecting means for detecting that the tape wound around the reel is lost between the reel and the resistance double roller. Feeding device. 7. The thermocompression bonding apparatus according to claim 2, wherein the joining station , a thermocompression bonding apparatus for thermocompression bonding the ACF tape to the substrate, a thermocompression bonding apparatus for thermocompression bonding an electronic component to the substrate with the ACF tape via the protective tape, and A detecting unit provided between the cleaning device for cleaning the substrate by bringing the cleaning tape into contact with the substrate and detecting a joining portion between a terminal end and a starting end of the tape; And a control means for driving the means to skip the joint detected by the detecting means to the downstream side of any of the devices.   8. The rotating shaft that protrudes in a supporting direction is provided on each of the resistance double rollers so as not to rotate relative to the roller according to claim 1, and each of the rotating shafts is a bearing. An apparatus for supplying film-like tape, characterized in that a rotational resistance is imparted when the friction member is brought into contact with the rotating shaft.

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