JPH02163790A - Manufacture of electronic equipment - Google Patents
Manufacture of electronic equipmentInfo
- Publication number
- JPH02163790A JPH02163790A JP63319858A JP31985888A JPH02163790A JP H02163790 A JPH02163790 A JP H02163790A JP 63319858 A JP63319858 A JP 63319858A JP 31985888 A JP31985888 A JP 31985888A JP H02163790 A JPH02163790 A JP H02163790A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- circuit pattern
- conductive film
- anisotropic conductive
- connection circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 117
- 239000011888 foil Substances 0.000 claims abstract description 33
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 abstract description 15
- 230000007547 defect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、カード電卓やＩＣカードなどの薄型電子機
器の製造方法に係り、特にその半導体装置ブの接続方法
を改良した電子機器の製造方法に関する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing thin electronic devices such as card calculators and IC cards, and in particular to an improved method for connecting semiconductor devices. It relates to a method of manufacturing electronic equipment.
（従来の技術）
カード電卓やＩＣカードなど薄型電子機器は、その動作
回路中にＩＣ（半導体集積口路）などの半導体装置を備
える。(Prior Art) Thin electronic devices such as card calculators and IC cards include semiconductor devices such as ICs (semiconductor integrated circuits) in their operating circuits.
従来、この薄型電子機器における半導体装置の取付けは
、所要の回路パターンが形成された印刷配線板の半導体
チップ取付は位置に半導体チップを後前固定し、その半
導体チップの電極と印刷配線板の回路パターンとを金属
細線をかけわたすいわゆるワイヤボンディング法により
接続するか、あるいはあらかじめテープに形成された導
電パターンを半導体チップの電極および印刷配線板の回
路パターンに圧着するいわゆるＴ Ａ Ｂ （Ｔａｐｅ
Ａｕｔ。Conventionally, when mounting a semiconductor device in a thin electronic device, a semiconductor chip is mounted on a printed wiring board on which a desired circuit pattern has been formed. The pattern is connected by the so-called wire bonding method, in which a thin metal wire is passed, or the so-called T A B (Tape) method, in which a conductive pattern previously formed on a tape is crimped onto the electrode of a semiconductor chip and the circuit pattern of a printed wiring board.
Out.
１Ｉｌａｔｅｄ Ｂｏｎｄｉｎｇ）法でおこなわれてい
る。1Ilated Bonding) method.
しかし、上記構造の薄型電子機器は、印刷配線板上に半
導体装置が接続されるため、たとえばカード電卓の例で
は、印刷配線板と液晶表示装置との回路接続が複雑とな
り、製造コストが高くなるという問題がある。However, in thin electronic devices with the above structure, the semiconductor device is connected on the printed wiring board, so in the case of a card calculator, for example, the circuit connection between the printed wiring board and the liquid crystal display device is complicated, which increases manufacturing costs. There is a problem.
この薄型電子機器の製造上の問題を解決する方法として
、第５図に示すように、液晶表示装置（１）側に半導体
チップ接続回路パターン（２）を形成して、これに半導
体チップ（３）を接続し、印刷配線板（４）と液晶表示
装置（１）との回路接続を単純化することが考えられる
。As a method to solve this problem in manufacturing thin electronic devices, as shown in FIG. ) to simplify the circuit connection between the printed wiring board (4) and the liquid crystal display device (1).
しかしこの場合、薄型電子機器では、一般に液晶表示装
置（１）側の回路パターンは、液晶表示装置（１）の背
面板を延長した薄いプラスチックフィルム上に形成され
ているため、半導体チップ（３）を低温で接続すること
が必要となる。したがってその接続は、半導体チップに
バンブを形成しておき、たとえば異方性導電接着剤を用
いて接続することが考えられるが、この方法も半導体チ
ップにバンブを形成する必要があるため、製造コストが
高くなる。However, in this case, in thin electronic devices, the circuit pattern on the liquid crystal display (1) side is generally formed on a thin plastic film that is an extension of the back plate of the liquid crystal display (1). It is necessary to connect at low temperature. Therefore, the connection can be made by forming bumps on the semiconductor chip and using an anisotropic conductive adhesive, for example, but this method also requires forming bumps on the semiconductor chip, which increases the manufacturing cost. becomes higher.
（発明が解決しようとする課題）
上記のように従来の薄型電子機器は、液晶表示装置に対
して半導体チップが印刷配線板上に接続されているため
、液晶表示装置と印刷配線板との回路接続が複雑となり
、製造コストが高くなるという問題がある。これを解決
する方法として、液晶表示装置側に半導体チップ接続回
路パターンを形成して、液晶表示装置と印刷配線板との
回路接続を単純化することが考えられるが、この方法で
も半導体チップを異方性導電接着剤により接続しようと
すると、半導体チップにバンブを形成する必要があるた
め、やはり製造コストが高くなるという問題がある。(Problems to be Solved by the Invention) As described above, in conventional thin electronic devices, the semiconductor chip is connected to the liquid crystal display device on the printed wiring board, so the circuit between the liquid crystal display device and the printed wiring board is There is a problem that the connection becomes complicated and the manufacturing cost increases. One possible way to solve this problem is to form a semiconductor chip connection circuit pattern on the liquid crystal display side to simplify the circuit connection between the liquid crystal display and the printed wiring board, but this method also allows the semiconductor chips to be If connection is attempted using a directional conductive adhesive, it is necessary to form bumps on the semiconductor chip, which again poses the problem of increased manufacturing costs.
この発明は、上記問題点を解決するためになされたもの
であり、液晶表示装置側に半導体チップ接続回路パター
ンを形成し、この回路パターンに低コストで半導体チッ
プを接続できるようにすることを目的とする。This invention was made to solve the above problems, and aims to form a semiconductor chip connection circuit pattern on the liquid crystal display side and to connect a semiconductor chip to this circuit pattern at low cost. shall be.
［発明の構成］
（課題を解決するための手段）
電子機器の半導体チップ接続回路パターンおよび半導体
チップのいずれか一方に、上記導体チップの電極に対応
して配置された金属箔の両面を異方性導電膜で挟んでな
るサンドイッチ状異方性導電膜部材を仮付けするか、ま
たは上記半導体チップ接続回路パターンおよび半導体チ
ップのいずれか一方に、半導体チップの電極に対応して
配置された金属箔を表面に接着してなる金属箔付き異方
性導電膜部材を仮付けするとともに、他方に金属箔を接
着しない異方性導電膜部材のみを仮付けしたのち、上記
半導体チップ接続回路パターンに上記半導体チップを位
置合せして、熱圧着により半導体チップ接続回路パター
ンに半導体チップを接続するようにした。[Structure of the Invention] (Means for Solving the Problems) Both sides of a metal foil placed in correspondence with the electrodes of the conductor chip on either one of the semiconductor chip connection circuit pattern and the semiconductor chip of an electronic device are anisotropically formed. A sandwich-like anisotropic conductive film member sandwiched between two conductive films is temporarily attached, or a metal foil is placed on either one of the semiconductor chip connection circuit pattern and the semiconductor chip in correspondence with the electrodes of the semiconductor chip. At the same time, the anisotropic conductive film member with metal foil bonded to the surface is temporarily attached, and only the anisotropic conductive film member with no metal foil bonded to the other side is temporarily attached. The semiconductor chips were aligned and connected to the semiconductor chip connection circuit pattern by thermocompression bonding.
さらに、この半導体チップ接続回路パターンと半導体チ
ップとの接続を、特に液晶表示装置に半導体チップ接続
回路パターンを形成して、この半導体チップ接続回路パ
ターンに適用した。Furthermore, the connection between this semiconductor chip connection circuit pattern and the semiconductor chip was applied to the semiconductor chip connection circuit pattern by forming the semiconductor chip connection circuit pattern particularly in a liquid crystal display device.
（作 用）
上記のように、金属箔の両面を異方性導電膜で挟んだサ
ンドイッチ状異方性導電膜部材、あるいは金属箔を表面
に接着した金属付き異方性導電膜部材と金属箔を接着し
ない異方性導電膜部材とを用いて、半導体チップ接続回
路パターンに半導体チップを接続すると、半導体チップ
にバンブを形成することなく半導体チップ接続回路パタ
ーンに半導体チップを接続することができる。(Function) As mentioned above, a sandwich-like anisotropic conductive film member in which both sides of a metal foil are sandwiched between anisotropic conductive films, or a metal-attached anisotropic conductive film member in which a metal foil is bonded to the surface and a metal foil are used. If the semiconductor chip is connected to the semiconductor chip connection circuit pattern using an anisotropic conductive film member that does not adhere to the semiconductor chip, the semiconductor chip can be connected to the semiconductor chip connection circuit pattern without forming bumps on the semiconductor chip.
（実施例）
以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.
この実施例は、液晶表示装置のプラスチックからなる背
面板上に半導体チップ接続回路パターンを形成しておき
、その半導体チップ接続回路パターンに半導体チップを
接続してなる＋Ｃカードの例である。This embodiment is an example of a +C card in which a semiconductor chip connection circuit pattern is formed on a back plate made of plastic of a liquid crystal display device, and a semiconductor chip is connected to the semiconductor chip connection circuit pattern.
上記半導体チップ接続回路パターンと半導体チップとの
接続は、第２図に示すように、半導体チップの電極に対
応して配置された鋼、金、ニッケルなどの金属箔片（ｌ
Ｏ）の両面を異方性導電膜（１１）で挟んでサンドイッ
チ状とし、これを剥離紙（１２）上に接着したサンドイ
ッチ状異方性導電膜部材（１３）が使用される。The connection between the semiconductor chip connection circuit pattern and the semiconductor chip is as shown in FIG.
A sandwich-like anisotropic conductive film member (13) is used in which both sides of O) are sandwiched between anisotropic conductive films (11) and this is adhered onto a release paper (12).
このサンドイッチ状異方性導電膜部材（１３）は、フォ
トエツチングを利用して製作することができる。This sandwich-like anisotropic conductive film member (13) can be manufactured using photoetching.
まず、第１図（ａ、）に示すように、上記サンドイッチ
状異方性導電膜部材（１３）を液晶表示装置（１）の背
面板（１４）上に形成されたたとえばＩＴＯ膜（Ｉｎｄ
ｉｕｍ Ｔｉｎ ０ｘｉｄｅの透明導電膜）からなる半
導体チップ接続回路パターン（２）上に位置合せし、た
とえば軽く押圧して仮付けする。そして、同（ｂ）に示
すように、剥離紙（１２）を剥離する。つぎに、同（Ｃ
）に示すように、上記仮付けされた異方性環？！！膜部
材（１３）上に半導体チップ（３）を位置合せして搭載
し、この半導体チップ（３）を半導体チップ接続回路パ
ターン（２）に熱圧着する。First, as shown in FIG. 1(a), the sandwich-like anisotropic conductive film member (13) is placed on a back plate (14) of a liquid crystal display device (1), for example, an ITO film (Ind.
The semiconductor chip connection circuit pattern (2) made of a transparent conductive film (Tin Oxide) is aligned and temporarily attached by, for example, light pressure. Then, as shown in (b), the release paper (12) is peeled off. Next, the same (C
), the anisotropic ring tacked above? ! ! A semiconductor chip (3) is aligned and mounted on the membrane member (13), and this semiconductor chip (3) is thermocompression bonded to the semiconductor chip connection circuit pattern (2).
第３図は、その熱圧着により得られる半導体チップ（３
）と半導体チップ接続回路パターン（２）との接続状態
を示した図であり、半導体チップ（３）と半導体チップ
接続回路パターン（２）との間に介在させた異方性導電
膜部材（１３）は、熱圧着時の加熱加圧により、特に金
属箔片（１０）の両面上に位置する部分（ｌｌａ）の異
方性導電膜部材（１３）が他の部分より強く加圧変形さ
れ、半導体チップ（３）の電極（１５）と半導体チップ
接続回路パターン（２）とは、金属箔片（１０）を介し
て異方性導′ｒ！１膜部材（Ｉ３）中に介在する導電粒
子（１６）により導電接続される。しかし、他の部分は
、金属箔片（１０）部分にくらべて熱圧着時の加圧変形
が小さく、かつ半導体チップ（３）に形成されているパ
ッシベーション膜（１７）により絶縁されて導電接続さ
れることはない。Figure 3 shows the semiconductor chip (3) obtained by thermocompression bonding.
) and the semiconductor chip connection circuit pattern (2), and is a diagram showing the connection state of the anisotropic conductive film member (13) interposed between the semiconductor chip (3) and the semiconductor chip connection circuit pattern (2). ), the anisotropic conductive film member (13) in the portion (lla) located on both surfaces of the metal foil piece (10) is deformed by pressure more strongly than other portions due to heat and pressure during thermocompression bonding; The electrode (15) of the semiconductor chip (3) and the semiconductor chip connection circuit pattern (2) are anisotropically conductive through the metal foil piece (10). Conductive connection is made by conductive particles (16) interposed in the single membrane member (I3). However, the other parts are less deformed by pressure during thermocompression bonding than the metal foil piece (10), and are insulated and conductively connected by the passivation film (17) formed on the semiconductor chip (3). It never happens.
なお、ＩＣカードは、その後、この半導体チップ（３）
の取付けられた液晶表示装置（１）の回路パターンと印
刷配線板の回路パターンとを接続することにより得られ
る。Note that the IC card is then manufactured using this semiconductor chip (3).
It is obtained by connecting the circuit pattern of the liquid crystal display device (1) to which the circuit pattern is attached and the circuit pattern of the printed wiring board.
ところで、上記方法により半導体チップ接続回路パター
ン（２）に半導体チップ（３）を接続すると、半導体チ
ップ（３）にバンブを形成することなく液晶表示装置の
プラスチックからなる背面板上に形成された半導体チッ
プ接続回路パターン（２）に半導体チップ（３）を容易
に接続できる。しかも、半導体チップ（３）を液晶表示
装置側に取付けたことにより、液晶表示装置（１）と印
刷配線板との回路接続を単純化して、接続不良をおこし
にくい信頼性の高いＩＣカードとすることができ、かつ
その製造コストを大幅に低減することができる。By the way, when the semiconductor chip (3) is connected to the semiconductor chip connection circuit pattern (2) by the above method, the semiconductor chip (3) formed on the back plate made of plastic of the liquid crystal display device can be connected without forming bumps on the semiconductor chip (3). The semiconductor chip (3) can be easily connected to the chip connection circuit pattern (2). Moreover, by attaching the semiconductor chip (3) to the liquid crystal display device side, the circuit connection between the liquid crystal display device (1) and the printed wiring board is simplified, resulting in a highly reliable IC card that is less prone to connection failures. and its manufacturing cost can be significantly reduced.
つぎに、他の実施例について述べる。Next, other embodiments will be described.
上記実施例では、サンドイッチ状異方性導電膜部材を液
晶表示装置に形成された半導体チップ接続回路パターン
に仮付けしたのち、その半導体チップ接続回路パターン
に半導体チップを接続したが、この半導体チップの接続
は、逆にサンドイッチ状異方性導電膜部材を半導体チッ
プに仮付けしておき、この異方性導電膜部材の仮付けさ
れた半導体チップを液晶表示装置に形成された半導体チ
ップ接続回路パターンに接続してもよい。In the above embodiment, the sandwich-like anisotropic conductive film member was temporarily attached to the semiconductor chip connection circuit pattern formed on the liquid crystal display device, and then the semiconductor chip was connected to the semiconductor chip connection circuit pattern. For connection, conversely, the sandwich-like anisotropic conductive film member is temporarily attached to the semiconductor chip, and the semiconductor chip to which the anisotropic conductive film member is temporarily attached is connected to the semiconductor chip connection circuit pattern formed on the liquid crystal display device. may be connected to.
また、上記実施例では、金属箔片の両面を異方性導電膜
で挟んだサンドイッチ状異方性導電膜部材を用いて、半
導体チップ接続回路パターンに半導体チップを接続した
が、このサンドイッチ状異方性導電膜部材のかわりに、
第４図に示すように、液晶表示装置（１）に形成された
半導体チップ接続回路パターン（２）に、半導体チップ
の電極に対応して配置された金属箔（１０）を表面に接
着してなる金属箔付き異方性導電膜部材（１８）を位置
合せして仮付けし、一方、半導体チップ（３）に金属箔
を接着しない異方性導電膜部材（１９）のみを仮付けし
、その後、矢印（２０）方向に加圧して両者を熱圧着し
て接続し５でも、前記実施例と同様に半導体チップ接続
回路パターン（２）に半導体チップ（３）を接続するこ
とができる。Furthermore, in the above embodiment, a semiconductor chip was connected to a semiconductor chip connection circuit pattern using a sandwich-like anisotropic conductive film member in which both sides of a metal foil piece were sandwiched between anisotropic conductive films. Instead of a directional conductive film member,
As shown in FIG. 4, a metal foil (10) arranged corresponding to the electrodes of the semiconductor chip is adhered to the surface of the semiconductor chip connection circuit pattern (2) formed on the liquid crystal display device (1). The anisotropic conductive film member (18) with metal foil is aligned and temporarily attached, while only the anisotropic conductive film member (19) without the metal foil bonded to the semiconductor chip (3) is temporarily attached, Thereafter, by applying pressure in the direction of arrow (20) and thermocompression bonding the two to connect them (5), it is possible to connect the semiconductor chip (3) to the semiconductor chip connection circuit pattern (2) in the same manner as in the previous embodiment.
また、逆に半導体チップに金属箔付き異方性導電膜部材
を位置合せして仮付けするとともに、半導体チップ接続
回路パターン（２）に金属箔を接着しない異方性導電膜
部材のみを仮付けして、両者を熱圧着しても同様に接続
することができる。Conversely, the anisotropic conductive film member with metal foil is aligned and temporarily attached to the semiconductor chip, and only the anisotropic conductive film member without the metal foil is temporarily attached to the semiconductor chip connection circuit pattern (2). The same connection can be achieved by thermocompression bonding the two.
なお、上記実施例では、ＩＣカードについて述べたが、
この発明は、ＩＣカード以外の電子機器にも適用できる
。In addition, although the above embodiment described an IC card,
This invention can also be applied to electronic devices other than IC cards.
［発明の効果］
電子機器の半導体チップ接続回路パターンと半導体チッ
プとを、半導体チップの電極に対応して配置された金属
箔の両面を異方性導電膜で挟んだサンドイッチ状異方性
導電膜部材、あるいは半導体チップの電極に対応して配
置された金属箔を表面に接着した金属箔付き異方性導電
膜部材と金属箔を接着しない異方性導電膜部材とを用い
て接続すると、半導体チップにバンブを形成することな
く、半導体チップ接続回路パターンに半導体チップを接
続することができ、電子機器の製造コストを低減するこ
とができる。[Effect of the invention] A sandwich-like anisotropic conductive film in which a semiconductor chip connection circuit pattern of an electronic device and a semiconductor chip are sandwiched between anisotropic conductive films on both sides of a metal foil arranged corresponding to the electrodes of the semiconductor chip. When a semiconductor is connected using an anisotropic conductive film member with a metal foil attached to the surface of the metal foil placed corresponding to the electrodes of the semiconductor chip and an anisotropic conductive film member with no metal foil adhered, the semiconductor The semiconductor chip can be connected to the semiconductor chip connection circuit pattern without forming bumps on the chip, and the manufacturing cost of electronic devices can be reduced.
特に液晶表示装置に半導体チップ接続回路パターン形成
して、上記半導体チップ接続回路パターンと半導体チッ
プとを接続方法を適用すると、液晶表示装置と印刷配線
板との回路接続を単純化でき、液晶表示装置を備える電
子機器の回路の接続不良をなくし、て、その信頼性を高
めることができ、かつ製造コストを大幅に低減すること
ができる。In particular, if a semiconductor chip connection circuit pattern is formed on a liquid crystal display device and the method for connecting the semiconductor chip connection circuit pattern and the semiconductor chip described above is applied, the circuit connection between the liquid crystal display device and the printed wiring board can be simplified, and the liquid crystal display device It is possible to eliminate connection failures in the circuits of electronic devices equipped with the present invention, improve the reliability thereof, and significantly reduce manufacturing costs.
ｍ１図ないし第４図はこの発明の詳細な説明図で、第１
図（ａ）ないしくＣ）はそれぞれその一実施例であるＩ
Ｃカードにおける液晶表示装置に形成された半導体チッ
プ接続回路パターンに半導体チップを接続する方法を説
明するための工程図、第２図（ａ）および（ｂ）はそれ
ぞれその半導体チップ接続回路パターンと半導体チップ
との接続に用いられるサンドイッチ状異方性導電膜部材
の平面図およびそのＢ−Ｂ線断面図、第３図は上記半導
体チップ接続回路パターンと半導体チップとの接続構造
を拡大して示す図、第４図は他の実施例の接続方法の説
明図、第５図はＩＣカードの構成を示す図である。
１・・・液晶表示装置
２・・・半導体チップ接続回路パターン３・・・半導体
チップ
０・・・金属箔
Ｉ・・・異方性導電膜
２・・・剥離紙
３・・・サンドイッチ状異方性導電膜部材５・・・半導
体チップの電極
ア・・・パッシベーション膜
８・・・金属箔付き異方性導電膜部材
Ｉ９・・・金属箔を接着しない異方性導電膜部材代理人
弁理士 大 胡 典 夫
第
図
第
図
第
図
第
図Figures m1 to 4 are detailed explanatory diagrams of this invention.
Figures (a) to C) are each an example of I
A process diagram for explaining a method of connecting a semiconductor chip to a semiconductor chip connecting circuit pattern formed on a liquid crystal display device in a C card, FIGS. 2(a) and 2(b) show the semiconductor chip connecting circuit pattern and semiconductor, respectively. A plan view and a sectional view taken along the line B-B of a sandwich-like anisotropic conductive film member used for connection with the chip, and FIG. 3 is an enlarged view showing the connection structure between the semiconductor chip connection circuit pattern and the semiconductor chip. , FIG. 4 is an explanatory diagram of a connection method of another embodiment, and FIG. 5 is a diagram showing the configuration of an IC card. 1...Liquid crystal display device 2...Semiconductor chip connection circuit pattern 3...Semiconductor chip 0...Metal foil I...Anisotropic conductive film 2...Release paper 3...Sandwich-like difference Anisotropic conductive film member 5...Electrode a of semiconductor chip...Passivation film 8...Anisotropic conductive film member with metal foil I9...Anisotropic conductive film member without bonding metal foil Patent attorney Shidai Hu Dianhu
Claims (2)
半導体チップのいずれか一方に上記半導体チップの電極
に対応して配置された金属箔の両面を異方性導電膜で挟
んでなるサンドイッチ状異方性導電膜部材を仮付けする
か、または上記半導体チップ接続回路パターンおよび半
導体チップのいずれか一方に上記半導体チップの電極に
対応して配置された金属箔を表面に接着してなる金属箔
付き異方性導電膜部材を仮付けするとともに他方に金属
箔を接着しない異方性導電膜部材のみを仮付けしたのち
、上記半導体チップ接続回路パターンに上記半導体チッ
プを位置合せして熱圧着により上記半導体チップ接続回
路パターンに上記半導体チップを接続することを特徴と
する電子機器の製造方法。(1) Sandwich-like anisotropy formed by sandwiching both sides of a metal foil placed between anisotropic conductive films on either the semiconductor chip connection circuit pattern of electronic equipment or the semiconductor chip in correspondence with the electrodes of the semiconductor chip. Anisotropic with metal foil, which is obtained by temporarily attaching a conductive film member, or by adhering to the surface of either one of the semiconductor chip connection circuit pattern and the semiconductor chip a metal foil placed corresponding to the electrodes of the semiconductor chip. After temporarily attaching the anisotropic conductive film member and only the anisotropic conductive film member without adhering the metal foil to the other side, aligning the semiconductor chip with the semiconductor chip connection circuit pattern and bonding the semiconductor chip by thermocompression. A method of manufacturing an electronic device, comprising connecting the semiconductor chip to a connection circuit pattern.
形成しておき、この半導体チップ接続回路パターンおよ
び半導体チップのいずれか一方に上記半導体チップの電
極に対応して配置された金属箔の両面を異方性導電膜で
挟んでなるサンドイッチ状異方性導電膜部材を仮付けす
るか、または上記半導体チップ接続回路パターンおよび
半導体チップのいずれか一方に上記半導体チップの電極
に対応して配置された金属箔を表面に接着してなる金属
箔付き異方性導電膜部材を仮付けするとともに他方に金
属箔を接着しない異方性導電膜部材のみを仮付けしたの
ち、上記半導体チップ接続回路パターンに上記半導体チ
ップを位置合せして熱圧着により上記半導体チップ接続
回路パターンに上記半導体チップを接続することを特徴
とする電子機器の製造方法。(2) A semiconductor chip connection circuit pattern is formed on the liquid crystal display device, and both sides of the metal foil placed on either the semiconductor chip connection circuit pattern or the semiconductor chip in correspondence with the electrodes of the semiconductor chip are different. A sandwich-like anisotropic conductive film member sandwiched between anisotropic conductive films is temporarily attached, or a metal is placed on either the semiconductor chip connection circuit pattern or the semiconductor chip in correspondence with the electrodes of the semiconductor chip. After temporarily attaching the anisotropic conductive film member with metal foil, which is made by adhering foil to the surface, and temporarily attaching only the anisotropic conductive film member without adhering the metal foil to the other side, A method of manufacturing an electronic device, comprising aligning a semiconductor chip and connecting the semiconductor chip to the semiconductor chip connection circuit pattern by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63319858A JPH02163790A (en) | 1988-12-19 | 1988-12-19 | Manufacture of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63319858A JPH02163790A (en) | 1988-12-19 | 1988-12-19 | Manufacture of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02163790A true JPH02163790A (en) | 1990-06-25 |
Family
ID=18115021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63319858A Pending JPH02163790A (en) | 1988-12-19 | 1988-12-19 | Manufacture of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02163790A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013546154A (en) * | 2010-12-20 | 2013-12-26 | ゼネラル・エレクトリック・カンパニイ | Large area light emitting electrical package with current spreading bus |
-
1988
- 1988-12-19 JP JP63319858A patent/JPH02163790A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013546154A (en) * | 2010-12-20 | 2013-12-26 | ゼネラル・エレクトリック・カンパニイ | Large area light emitting electrical package with current spreading bus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6952250B2 (en) | Pressure-welded structure of flexible circuit boards | |
| KR100321883B1 (en) | Structure and method of mounting semiconductor device and liquid crystal display device | |
| US5726726A (en) | Liquid crystal display and method of producing the same | |
| KR100399379B1 (en) | Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same | |
| JPH075487A (en) | Hybrid circuit board | |
| JP3360445B2 (en) | Flexible wiring board connection structure | |
| TW447053B (en) | Semiconductor apparatus and its manufacturing method, circuit board and electronic machine | |
| JP3509573B2 (en) | Flexible substrate tape material, flexible substrate manufacturing method, semiconductor device manufacturing method, and liquid crystal device manufacturing method | |
| JPH10199930A (en) | Connection structure of electronic components and connecting method therefor | |
| JPH11121682A (en) | Tape carrier package semiconductor device and liquid crystal panel display device using the same | |
| JPH02163790A (en) | Manufacture of electronic equipment | |
| JPH06232523A (en) | Flexible printed board | |
| JPH0766518A (en) | Wiring circuit board connecting flexible substrate | |
| JP2001264794A (en) | Method for manufacturing liquid crystal display device | |
| US5767569A (en) | Tab tape and semiconductor chip mounted on tab tape | |
| JPH05173166A (en) | Liquid crystal display device | |
| JP3004317B2 (en) | Liquid crystal display | |
| US6720205B2 (en) | Electronic device and method of manufacturing the same, and electronic instrument | |
| JP3987288B2 (en) | Semiconductor element mounting structure and liquid crystal display device | |
| JP3224848B2 (en) | Liquid crystal display | |
| JP2000047244A (en) | Liquid crystal device and its production | |
| JP3822358B2 (en) | Liquid crystal display | |
| JP3608514B2 (en) | Semiconductor element mounting structure and electronic device | |
| JP2002229055A (en) | Liquid crystal display and method for manufacturing the same | |
| JP2816281B2 (en) | Liquid crystal display |