JP2002184809A - Tape-affixing method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for preventing a portion that is not in contact with an affixing head from being heated, and for properly affixing a tape with specific length. SOLUTION: When a thermosetting resin tape 3 where viscosity changes according to temperature is pushed against a press surface 17 of the heated affixing head 11 for affixing onto a substrate 20, the thermosetting resin tape 3 supported by a base tape 2a is supplied to a position opposite to the press surface 17, and is cut into specific affixing length corresponding to the press surface 17 by a cutting means 9. Then, the cut thermosetting resin tape 3 with the specific length is pushed against the substrate 20 for affixing on the press surface 17, at the same time, a portion near the affixing section of the thermosetting resin tape 3 is cooled by jetting a cooling gas from a cooling nozzle 21, and the base tape 2a is peeled from the affixed thermosetting resin tape 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component such as an IC chip (bare IC) or a surface acoustic wave (SAW) device on a substrate in a single state by using a tape having adhesive and adhesive properties. The present invention relates to a method and an apparatus for attaching a tape to an apparatus.

[0002]

2. Description of the Related Art In recent years, electronic circuit boards have come to be used for all kinds of products, and their performance has been improving day by day.
The frequency used on the circuit board is increasing. In an electronic device using such a high frequency, flip-chip mounting with low impedance is suitable. Also, with the increase in portable devices, flip-chip mounting in which an IC chip is mounted on a circuit board as a bare chip instead of a package is required.

[0003] As a method for joining bare chips, a method using a thermosetting resin tape is known. After attaching a thermosetting tape to a circuit board or a glass substrate of a liquid crystal display, the IC chip is thermocompressed to obtain an IC.
2. Description of the Related Art A connection structure of a semiconductor chip in which an electrode of an IC chip is connected to an electrode of a substrate by bonding with a thermosetting resin layer interposed between the lower surface of the chip and the upper surface of the substrate is generally known. The thermosetting resin has a property of being softened without being cured under a certain temperature condition and having tackiness, and being cured under another temperature condition.

The procedure for applying the thermosetting resin tape will be described with reference to FIGS. 10 and 11. First, the tape supply means 1 supplies the tape 2 supporting the thermosetting resin tape 3 with the base tape 2a. Then, only the thermosetting resin tape 3 is cut by the cutting means 9 while leaving the base tape 2a, the bonding head 11 heated by the heater 16 is lowered, and the thermosetting resin tape 3 is Press 20 and heat and paste. Then, the sticking head 11
Is raised, and the release pin 18 is moved to release the thermosetting resin tape 3 and the base tape 2a.
“a” is collected and stored in the tape storage unit 6.

[0005]

By the way, in the above configuration, as shown in FIG. 12 (a), the thermosetting resin is applied to the pressing surface 17 of the attaching head 11 via the base tape 2a of the tape 2. When the tape 3 is pressed and heated, the edge of the pressing surface 17 and the cut surface 32 of the thermosetting resin tape 3 by the cutting means 9 accurately match, and oppose the pressing surface 17 of the thermosetting resin tape 3. When only the portion to be heated is heated to increase the adhesiveness, as shown in FIG.
When the base tape 2a is pulled up by the peeling pin 18 and peeled off, the thermosetting resin tape 3 having an appropriate length is attached to the substrate 20, but as shown in FIG.
7, the thermosetting resin tape 3 is heated from the pressurized surface 17 to a portion 33 adjacent to the outside of the cut surface 32 at a predetermined temperature or higher through the base tape 2a even if the edge of the cut 7 accurately matches the cut surface 32. When the adhesion increases,
As shown in FIG. 3 (b), the section 3 in which the cut surface 32 is located inside the edge of the pressing surface 17 and is adjacent to the outside of the cut surface 32
When the adhesive tape is heated to a predetermined temperature or higher to increase the adhesiveness, the cut surfaces 32 adhere to each other, and when the base tape 2a is pulled up with the peeling pin 18 and peeled off, these portions 33 become closer to the substrate 20 side. And the end of the thermosetting resin tape 3 to be attached next is chipped off, or even if it does not remain on the substrate 20 side, the characteristics of the end of the thermosetting resin tape 3 Is changed, and there is a possibility that the thermosetting resin tape 3 may not be stuck properly at the time of the next sticking operation.

The present invention has been made in view of the above-mentioned conventional problems, and prevents a portion which is not in contact with an attaching head from being heated when attaching a tape whose adhesiveness changes with temperature,
It is an object of the present invention to provide a method and an apparatus for attaching a tape of a predetermined length that can appropriately attach a tape.

[0007]

The tape application method of the present invention is a tape application method in which a tape whose adhesiveness changes depending on temperature is pressed against a substrate by pressing the tape on a pressurized surface of a heated application head. Supplying the tape supported on the tape to the position facing the pressing surface of the bonding head, cutting only the tape at a predetermined bonding length corresponding to the pressing surface, and tape cut at the predetermined bonding length And a step of pressing the tape on the pressurized surface of the attaching head to adhere to the substrate, a step of cooling the vicinity of the tape attaching section, and a step of peeling off the base tape from the attached tape. Only the substrate is properly affixed to the substrate, the vicinity of the cut surface of the affixed portion is heated and there is no risk that the next affixed portion will remain on the substrate side and chip, and the change in the properties of the tape can be prevented. It can be pasted to the proper tape of a fixed length of.

In the cooling step, before pressing the pressing surface of the bonding head against the substrate, cooling near the point where the tape and the edge of the pressing surface come into contact is started, and after the tape is bonded, the bonding head is moved to the substrate. When cooling is finished after the
Cooling effect is large, and after pressing the pressure surface of the application head against the substrate, start cooling near the point where the tape and the edge of the pressure surface come into contact, and after removing the application head from the substrate after applying the tape When the cooling is completed, the tape can be prevented from moving by the cooling operation.

Further, the tape applying apparatus of the present invention comprises an applying head which has a pressing surface and a heating means and is movable between a position where the pressing surface is pressed toward the substrate and a position away from the substrate, and a base tape. Tape supply means for supplying the tape supported by the base tape, tape feeding means for sequentially feeding the tape supported by the base tape to a position facing the pressing surface of the bonding head, and a predetermined bonding length corresponding to only the tape corresponding to the pressing surface. Cutting means, a tape accommodating means for accommodating the base tape, and a cooling means for cooling the vicinity of the tape attaching portion, wherein the cooling means cools the vicinity of the tape attaching portion. Thereby, only the taped portion is properly bonded to the substrate, the vicinity of the cut surface of the bonded portion is heated and remains on the substrate side, and there is no possibility that the next bonded portion is chipped,
In addition, a change in the characteristics of the tape can be prevented, and a tape of a predetermined length can be appropriately affixed.

[0010] Further, if the cooling means comprises a cooling nozzle for jetting a cooling gas in the vicinity of the tape attaching portion, it is possible to cool a required portion easily and efficiently without contact.

Further, if means for controlling the timing at which the cooling gas is jetted from the cooling nozzle in conjunction with the movement of the attaching head is provided, the cooling timing can be accurately synchronized with the attaching operation.

If means for controlling the flow rate of the cooling gas supplied to the cooling nozzle is provided, the flow rate of the cooling gas can be adjusted and set so that the desired cooling performance is obtained and the tape is not affected.

If means for controlling the temperature of the cooling gas supplied to the cooling nozzle is provided, the required cooling performance can be obtained even when the proper cooling performance cannot be obtained by adjusting the flow rate.

Further, if the cooling nozzle is arranged so as to adjust the jetting position and jetting direction of the cooling gas, the cooling nozzle is set to an optimum cooling state by adjusting the thickness and width of the tape and the base tape. can do.

Further, if a heat insulating means is provided on the side of the pressing head adjacent to the tape supply side edge of the pressing head, the temperature distribution of the pressing surface of the bonding bed is affected by the cooling means, so that the bonding state is not affected. It can be suppressed and an appropriate state of attachment can be obtained.

Further, when a heating portion facing the pressing surface and a cooling portion on its side are provided on the supporting surface for supporting the substrate, it is possible to suppress the influence of the temperature distribution from the substrate side and to obtain a proper bonding state. Can be obtained.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, each embodiment of a thermosetting resin tape sticking apparatus to which the tape sticking apparatus of the present invention is applied will be described.

(First Embodiment) FIGS. 1 to 3 show a thermosetting resin tape sticking apparatus according to a first embodiment of the present invention.
This will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes a tape supply means, which comprises a supply reel section 1a, an elevating roller 1b, and a fixed roller 1c. The supply reel section 1a is provided with a tape when the elevating roller 1b reaches an upper limit position of a certain elevating range. 2 is supplied, and when the elevating roller 1b descends to the lower limit position, the supply is stopped. In a state where a predetermined tension is applied to the tape 2 by the elevating roller 1b, the tape feeding amount by the tape feeding means 8 described later The tape 2 is configured to be supplied in accordance with As shown in FIGS. 2 and 12, the tape 2 is configured by supporting a thermosetting resin tape 3 on one surface of a base tape 2a.

The tape 2 fed from the tape supply means 1 is stretched between guide rollers 4a and 4b provided on both right and left sides of the attaching section 10, and then is clamped via a clamp means 5 to a tape storage section. 6 to collect by suction. Reference numeral 7 denotes a suction fan of the tape storage unit 6. The tape feeding means 8 is constituted by including a tape clamp 8b on a moving body 8a which can reciprocate between the guide rollers 4a and 4b. The tape clamp 8b clamps the tape 2 at an appropriate position, and releases the clamp means 5. After moving the moving body 8a by a predetermined feed amount, the clamp 2 is closed, the tape clamp 8b is opened, and the moving body 8a is returned and the tape 2 is fed.

Reference numeral 9 denotes a cutting means provided with a cutting blade 9a and a driving motor 9b for cutting only the thermosetting resin tape 3 to a predetermined length, leaving the base tape 2a of the tape 2.

An elevating and lowering supporting means 12
The sticking head 11 is supported so as to be able to move up and down and can be driven up and down by a drive motor 13. At the lower part of the attachment unit 10, a support means 14 configured to mount and fix the substrate 20 on the support surface 15 on the upper surface is provided. The bonding head 11 has a built-in heater 16 as a heating means, and a pressing tool corresponding to the type of the tape 2 is removably mounted at the lower end thereof. 17 are formed. Reference numeral 18 denotes a peeling pin which sticks the thermosetting resin tape 3 cut to a predetermined length of the tape 2 to the substrate 20 and then pulls up and peels the base tape 2a, and is a reciprocally movable member between the guide rollers 4a and 4b. It is attached to the body 19.

Numeral 21 is a cooling nozzle as a cooling means for jetting a cooling gas. The sticking head 11 is capable of adjusting the vertical and horizontal positions and the jetting direction according to the type and width of the tape 2 by the position adjusting and supporting means 22. It is attached to. The cooling nozzle 21 is configured to supply air cooled by a cooling gas blower fan 23 or N ₂ gas by adjusting the flow rate with a flow rate adjusting valve 24. Further, the blower fan 23
Adjusting means 25 for adjusting the temperature of the cooling gas sent to the
Is provided.

Reference numeral 26 denotes a tape feeding means 1, a clamping means 5, a tape feeding means 8, a cutting means 9, a driving motor 13 of the attaching head 11, a moving body 19 of the peeling pin 18, and a blowing fan 23 of the cooling nozzle 21 mutually. It is a control unit that performs control in association with it. The position adjustment support means 22, the flow adjustment valve 24, and the temperature adjustment means 25 are manually adjusted in the illustrated example, but may be configured to be automatically adjusted by the control unit 26.

Next, the operation will be described with reference to FIGS. 2 and 3. First, the tape 2 supporting the thermosetting resin tape 3 with the base tape 2a from the tape supply means 1 is fed out and the tape feed means 8 is fed. The cutting means 9 cuts only the thermosetting resin tape 3 while leaving the base tape 2a. Next, cooling is started by ejecting a cooling gas from the cooling nozzle 21 around the end of the pressing surface 17 and the vicinity of the contact point of the tape 2 so as to avoid a portion where the pressing surface 17 contacts the tape 2 as much as possible. Next, heater 1
The bonding head 11 heated in 6 is lowered, and the thermosetting resin tape 3 is pressed against the substrate 20 via the base tape 2a of the tape 2 on the pressing surface 17 and heated to bond. Thereafter, after the application head 11 is raised, the blowing of the cooling gas from the cooling nozzle 21 is stopped, and the peeling pin 18 is moved to peel the thermosetting resin tape 3 and the base tape 2a.

According to the present embodiment, the portion outside the contact point between the thermosetting resin tape 3 and the end of the pressing surface 17 can be cooled, and the portion not facing the pressing surface 17 is heated and adhered to the substrate 20. Without being attached, the applied portion and the non-applied portion are reliably separated at the cut surface 32 by the cutting means 9 located substantially corresponding to the end of the pressing surface 17, and the non-applied portion is removed when the base tape 2a is peeled. The adhesive tape is reliably peeled off from the substrate 20 and supported by the base tape 2a, and then an accurate sticking length is set at the time of sticking operation.

In the present embodiment, the timing of jetting the cooling gas is before the sticking head 11 descends. However, the timing of jetting the cooling gas is not particularly limited as long as the tape 2 comes into contact with the pressing surface 17.

(Second Embodiment) FIGS. 4 and 5 show a thermosetting resin tape sticking apparatus according to a second embodiment of the present invention.
This will be described with reference to FIG. First, the tape 2 supporting the thermosetting resin tape 3 is fed out from the tape supply means 1 by the base tape 2a, fed by the tape feed means 8 for a predetermined length, and cut by the heat leaving the base tape 2a. Cut only the curable resin tape 3. Next, the bonding head 11 heated by the heater 16 is lowered, and the thermosetting resin tape 3 is pressed against the substrate 20 on the pressing surface 17. Thereafter, a cooling gas is blown out from the cooling nozzle 21 around the end of the pressing surface 17 and the vicinity of the contact point of the tape 2 so as to avoid the portion where the pressing surface 17 and the tape 2 are in contact with each other as much as possible to start cooling. In this state, the thermosetting resin tape 3 is pressed and heated on the pressing surface 17 of the bonding head 11 and bonded to the substrate 20. Then, the bonding head 11 is raised, and then the cooling gas is ejected from the cooling nozzle 21. After stopping, the release pin 18 is moved to release the thermosetting resin tape 3 and the base tape 2a.

According to this embodiment, the portion outside the contact point between the thermosetting resin tape 3 and the end of the pressing surface 17 can be cooled, and the portion not facing the pressing surface 17 is heated and adhered to the substrate 20. The sticking portion and the non-sticking portion are surely separated at the cut surface 32 without being attached, and the non-sticking portion is surely peeled off from the substrate 20 when the base tape 2a is peeled off and supported by the base tape 2a. Sometimes, an accurate sticking length is set, and since the cooling gas is jetted after pressing the tape 2 on the pressing surface 17, the tape 2 can be stuck with high precision without moving.

In the present embodiment, the timing of jetting the cooling gas is after the sticking head 11 has been lowered, but the timing of jetting the cooling gas is not particularly limited as long as the tape 2 comes into contact with the pressing surface 17.

(Third Embodiment) In the above-described embodiment, the cooling gas ejected from the cooling nozzle 21 is blown to the base tape 2a side of the tape 2 so that the base tape 2a
In the example shown in FIG. 6, the thermosetting resin tape 3 is cooled via a pressurizing unit. However, as shown in FIG. A gas may be ejected to directly cool the thermosetting resin tape 3. In this case, it is necessary to use a clean gas as the cooling gas.

(Fourth Embodiment) In the above-described embodiment, the cooling nozzle 21 for jetting a cooling gas is exemplified as the cooling means for the tape 2, but as shown in FIG.
Various means can be used, such as cooling by bringing the tape 7 or the cooling block into contact with the base tape 2a side of the tape 2.

(Fifth Embodiment) Also, the cooling gas is blown onto the bonding head 11 so that the bonding head 1
As a countermeasure against the possibility of a temperature distribution such that the temperature drops at the end of the pressing surface 17 as shown in FIG. 8, as shown in FIG. Means 28 may be provided. Then, without being affected by the temperature distribution of the pressing surface 17 of the attaching head 11, it is possible to suppress the influence on the attaching state, and to obtain an appropriate attaching state.

(Sixth Embodiment) Further, as shown in FIG. 9, a support surface 15 for placing and supporting a substrate 20 is provided with a pressing surface 17.
The heating part 29 and the cooling part 30 on the side of the heating part 29 may be disposed with the heat insulating part 31 interposed therebetween. The heating portion 29 has a built-in heater 29 a, and the cooling portion 30 has a cooling medium passage 3.
0a, and a heat insulating part 31 is interposed between them. With such a configuration, it is possible to suppress the influence of the temperature distribution from the substrate 20 side and obtain an appropriate bonding state.

[0035]

According to the tape applying method and apparatus of the present invention, the tape supported on the base tape as described above is supplied to the position facing the pressing surface of the applying head, and only the tape corresponds to the pressing surface. A tape cut at a predetermined length and pressed with the tape cut at a predetermined length against the pressurized surface of the bonding head against the substrate, cooling the vicinity of the tape bonding part, and pasting the base tape. Since it is made to peel from, only the affixed portion of the tape is properly affixed to the substrate, the vicinity of the cut surface of the affixed portion is heated and remains on the substrate side, there is no fear that the next affixed portion is chipped, In addition, a change in the characteristics of the tape can be prevented, and a tape of a predetermined length can be appropriately attached.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a tape attaching device according to a first embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the embodiment.

FIG. 3 is an operation flowchart of the embodiment.

FIG. 4 is an operation explanatory diagram of the second embodiment of the present invention.

FIG. 5 is an operation flowchart of the embodiment.

FIG. 6 is a main part configuration diagram of a tape attaching device according to a third embodiment of the present invention.

FIG. 7 is a main part configuration diagram of a tape attaching device according to a fourth embodiment of the present invention.

FIG. 8 is a main part configuration diagram of a tape attaching device according to a fifth embodiment of the present invention.

FIG. 9 is a main part configuration diagram of a tape attaching device according to a sixth embodiment of the present invention.

FIG. 10 is an operation explanatory view of a conventional tape sticking apparatus.

FIG. 11 is an operation flowchart of the embodiment.

FIG. 12 is an operation explanatory view of the conventional example.

FIG. 13 is an explanatory diagram of a problem of the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape supply means 2 Tape 2a Base tape 3 Thermosetting resin tape 6 Tape accommodating part 8 Tape feeding means 9 Cutting means 10 Adhering part 11 Adhering head 16 Heater (heating means) 17 Pressing surface 18 Peeling pin 21 Cooling nozzle (cooling means) 22) Position adjustment support means 24 Flow rate adjustment valve 25 Temperature adjustment means 26 Control unit 28 Insulation means 29 Heating part 30 Cooling part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Shinya Matsumura, Inventor 1006 Kadoma, Kazuma, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. 72) Inventor Koji Takemura 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] 1. A method for attaching a tape whose adhesiveness changes according to temperature to a substrate by pressing the tape on a pressure surface of a heated application head, wherein the tape supported by a base tape is applied to the pressure surface of the application head. Supplying the tape to the opposing position, cutting the tape only at a predetermined length corresponding to the pressing surface, and pressing the tape cut at the predetermined length to the pressing surface of the bonding head against the substrate Attaching step, a step of cooling the vicinity of the tape application portion,
Separating the tape from the tape to which the base tape has been attached. 2. Before the pressing surface of the bonding head is pressed against the substrate, cooling near the point where the tape and the edge of the pressing surface come into contact is started, and after the tape is bonded, the bonding head is separated from the substrate and then cooled. 2. The method according to claim 1, wherein the step (c) is terminated. 3. After the pressing surface of the application head is pressed against the substrate, cooling is started near the point where the tape comes into contact with the edge of the pressing surface. After the tape is applied, the application head is separated from the substrate and then cooled. 2. The method according to claim 1, wherein the step (c) is terminated. 4. An application head having a pressing surface and a heating means, which is movable between a position where the pressing surface is pressed toward the substrate and a position away from the substrate, and a tape supported by the base tape. Tape supply means, a tape feeding means for sequentially feeding the tape supported by the base tape to a position facing the pressing surface of the bonding head, and a cutting means for cutting only the tape at a predetermined bonding length corresponding to the pressing surface, A tape application device, comprising: a tape storage device for storing a base tape; and a cooling device for cooling the vicinity of a tape application portion. 5. The tape sticking apparatus according to claim 4, wherein the cooling means comprises a cooling nozzle for jetting a cooling gas near the tape sticking portion. 6. The tape sticking apparatus according to claim 5, further comprising means for controlling the timing of jetting the cooling gas from the cooling nozzle in conjunction with the movement of the sticking head. 7. The apparatus according to claim 5, further comprising means for controlling a flow rate of the cooling gas supplied to the cooling nozzle.
The tape sticking device as described in the above. 8. The tape sticking apparatus according to claim 5, further comprising means for controlling a temperature of a cooling gas supplied to the cooling nozzle. 9. The tape sticking apparatus according to claim 5, wherein the cooling nozzle is arranged so as to adjust a position and a direction in which the cooling gas is jetted. 10. The tape sticking apparatus according to claim 4, wherein a heat insulating means is provided on a side surface of the pressing surface of the sticking head adjacent to the tape supply side edge. 11. The tape sticking apparatus according to claim 4, wherein a heating portion facing the pressing surface and a cooling portion on a side thereof are provided on the supporting surface for supporting the substrate.