JP2007258519A - Method fot pasting tape and its device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for pasting a tape for pasting a resin tape for mounting an electroic component on a circuit board capable of absorbing a dimensional error in a tolerance level even though a width of a base tape is measurably large or small, and capable of intermittently supplying the tape with a desirable travel resistance. <P>SOLUTION: The tape is stably supplied by a board holding part, a tape supplying mechanism, a depressing part for depressing the resin tape from the base tape side to the board, a plurality of guide rollers having a guide part at least at one end part, and the tape pasting device with the distance between the one guide part of the guide rollers and the other suide part of the guide rollers not more than the width of the base tape. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a tape applying method and a tape applying apparatus for applying a resin tape on a circuit board.

As a conventional method of attaching a resin tape to a circuit board, when mounting electronic components on the circuit board, print a resin tape such as a thermosetting anisotropic conductive resin tape or non-conductive resin tape. A technique is used in which an electronic component is mounted on a circuit board such as a substrate and the electronic component is pressed and heated from a resin tape (see, for example, Patent Document 1). In mounting such electronic components, as a method of sticking the resin tape to the circuit board, for example, as disclosed in Patent Document 1, the resin tape held on the lower surface of the base tape is supplied onto the circuit board. A method is used in which a resin tape piece is cut out from a resin tape with a cutter extending in the width direction of the base tape, and the resin tape piece is pressed from the upper surface side of the base tape and attached to a circuit board.
JP 2002-184809 A

  By the way, in mounting electronic components, it is necessary to equalize the size of the resin tape pieces to be attached in accordance with the downsizing of the mounted electronic components. However, in the conventional resin tape affixing method, the length of the resin tape piece in the base tape supply direction can be accurately cut, but when the resin tape piece is pressed from the upper surface side of the base tape, In some cases, the length in the tape supply direction is not determined, and the resin tape piece bends or overlaps on the substrate or shifts, so that electrical contact between the electronic component and the substrate cannot be achieved.

  As shown in FIG. 8, the restriction in the direction perpendicular to the supply direction of the flat surface of the base tape 41 is performed by the guide portion 376 of the roller 375 that allows an error in the width of the base tape 41. Therefore, in order to allow a dimensional error in the width of the base tape 41, the distance between the guide portions 376 at both ends of the roller 375 in the tape width direction (Y direction) of the guide portion 376 of the roller 375 is larger than the base tape width. However, after the tape application operation, that is, after the tape is applied to the substrate by pressing by the pressing portion 52 from the state shown in FIG. 8A, the base tape 41 is slackened each time as shown in FIG. The contact state between 376 and the end of the tape changes in various ways, and the running resistance when the base tape runs greatly fluctuates. Therefore, when the base tape is intermittently fed, bending due to insufficient feeding amount or excessive feeding occurs, causing the resin tape pieces to bend or overlap on the substrate or to be displaced.

  Furthermore, when the base tape width is small, the position of the resin tape in the width direction is not fixed in the roller guide because the base tape is slackened when the base tape is peeled off from the resin tape affixed to the circuit board. The paste operation starts. For this reason, the resin tape piece cannot be applied with high accuracy by the conventional application method.

  The present invention has been made in view of the above problems, and in a resin tape application method for applying a resin tape for mounting an electronic component on a circuit board, the allowable size of the base tape is large or small to some extent. It is an object of the present invention to provide a tape tape application method that can absorb errors and always supply a tape with intermittent motion with a desired running resistance.

  A substrate holding portion for holding a circuit board, and a resin tape held on a surface of the base tape on the side of the circuit board, substantially parallel to the surface of the circuit board, in a supply direction along the surface of the circuit board A tape supply mechanism that feeds and supplies, a cutter that cuts the resin tape held by the base tape by a blade extending in the supply direction from the resin tape side, and a state that is held by the base tape by the cutter A pressing portion that presses the resin tape piece cut out at the base tape side and affixes it to the circuit board; and the resin tape that is affixed to the circuit board by pulling the base tape away from the circuit board A peeling mechanism for peeling the base tape from a piece, between the tape supply mechanism and the pressing portion, and in the direction of supply to the peeling mechanism. And a roller for holding the base tape having a groove that is 0.1 mm or more wider than the width of the base tape, which is alternately shifted by 0.1 mm at right angles, and affixing the resin tape piece to the substrate surface .

  With this configuration, it is possible to prevent a shortage of the feeding amount during the intermittent feeding of the tape and the occurrence of bending due to excessive feeding, and to realize stable tape application.

  As described above, according to the tape sticking method and apparatus of the present invention, in the resin tape sticking method for sticking the resin tape for mounting electronic components on the circuit board, the variation in the contact friction force with the guide of the roller is small. Absorbing the dimensional error in the allowable range of the tape width, the tape can be supplied intermittently with the desired running resistance. Thereby, it is possible to prevent a shortage of feed amount during intermittent feeding and the occurrence of bending due to excessive feeding, thereby realizing stable tape application. Furthermore, according to the tape sticking method and apparatus of the present invention, it is possible to improve the sticking accuracy of the position of the resin tape piece stuck on the circuit board with respect to the direction perpendicular to the supply direction.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing the configuration of an apparatus for carrying out the tape applying method according to the first embodiment of the present invention. The tape affixing method is a method for affixing a resin tape for mounting electronic components on a circuit board 9 such as a printed circuit board.

  The resin tape affixing method includes a substrate holding part 2 for holding a plurality of circuit boards 9, and a supply direction of the tape 4 used for affixing the resin tape above the substrate holding part 2 along the surface of the circuit board 9 (in FIG. 1). (−X) direction) of the tape supply mechanism 3, the head portion 5 that cuts the resin tape piece from the tape 4 held by the tape supply mechanism 3 and affixes it to the circuit board 9, and the tape supply mechanism 3 A lifting mechanism 6 that moves (moves up and down) in a direction and a control unit 7 that controls these mechanisms are provided.

  The substrate holding unit 2 holds the plurality of circuit boards 9 by suction and moves them in the X direction and the Y direction, thereby sequentially moving the circuit boards 9 in a predetermined resin tape application method. In addition, the circuit board 9 on the board | substrate holding | maintenance part 2 may be hold | maintained with an adhesive material, and may be hold | maintained by other methods, such as a mechanical chuck.

  When the tape 4 is not used, the base tape 41, the resin tape 42 held on the (−Z) side surface of the base tape 41, and the side opposite to the surface held on the base tape 41 of the resin tape 42 A three-layer structure constituted by a cover tape 43 that covers the surface of the cover and prevents the adhesion of foreign matters and the like. The resin tape 42 is a so-called ACF (Anisotropic Conductive Film) formed of a thermosetting insulating resin having conductive particles uniformly dispersed therein.

  The tape supply mechanism 3 includes a supply reel 31 around which an unused tape 4 is wound, a plurality of guide rollers 32 having a flange shape on at least one guiding the tape 4, and a cover tape recovery in which the cover tape 43 is peeled off from the tape 4 In the vicinity of the reel 33, the feed chuck 34 and the fixed chuck 35, which are intermittent feeding means for feeding the tape 4 in the (−X) direction, the collection reel 36 for winding the used tape 4 (base tape 41), and the pressing portion 52 The guide roller 37 having a plurality of flange portions (grooves) for guiding the tape 4, the peeling mechanism 38 operating in parallel with the circuit board 9, and the structure holds the tape 4 above the circuit board 9. .

  In the tape supply mechanism 3, the tape 4 (the base tape 41 and the resin tape 42) from which the cover tape 43 has been peeled is transferred from the (+ X) side (upstream side) toward the (−X) side (downstream side). The resin tape 42 is held on the (−Z) side (circuit board 9 side) surface of the base tape 41 so as to be substantially parallel to the surface of the circuit board 9. The supply of the tape 4 is performed when the fixed chuck 35 is closed (that is, the base tape 41 is sandwiched), the feed chuck 34 is opened and moved in the (+ X) direction, and then the fixed chuck 35 is opened. Thereafter, the feed chuck 34 is closed and moved in the (−X) direction.

  Each configuration of the tape supply mechanism 3 is attached to one frame (not shown), and the configuration of the tape supply mechanism 3 and the tape 4 are integrally moved up and down as the frame is moved up and down by the lifting mechanism 6.

  The head unit 5 includes a cutter unit 51 that cuts out a resin tape piece from the resin tape 42 that is held by the base tape 41, and the resin tape piece that is cut off while being held by the base tape 41 by the cutter unit 51. A pressing portion 52 that is pressed from the side ((+ Z) side) and is attached to the circuit board 9 is provided.

  FIG. 2 shows details of the pressing portion. In FIG. 2A, the pressing part 52 has a pressing head 521 having a substantially rectangular pressing surface 522 at the end on the (−Z) side (side facing the circuit board 9), and moves the pressing head 521 in the Z direction. A press head elevating mechanism 523 and a guide rail 524 that perform (elevate and lower) are driven, and when the press head elevating mechanism 523 is driven by the control unit 7, the press head 521 is guided by the guide rail 524 and smoothly ascends and descends. To do.

  In the resin tape affixing method, the pressing portion 52 is moved together with the cutter portion 51 to the tape 4 in the Y direction perpendicular to the tape plane with respect to the supply direction of the tape 4 by the head portion horizontal movement mechanism 55 constituted by a ball screw, a guide or the like. Move against. As shown in FIG. 2B, in the pressing portion 52, the pressing head 52 is lowered after the pressing portion 52 is moved above the tape 4 by the head portion horizontal movement mechanism 55, and is held on the base tape 41 by the pressing surface 522. The resin tape piece is stuck by pressing the resin tape piece against the circuit board 9.

  FIG. 3 is a diagram showing details of the arrangement of guide rollers arranged on the left and right of the pressing portion 52 of the tape supply mechanism 3. In FIG. 3A, the guide rollers are alternately shifted by 0.1 mm perpendicularly to the supply direction (−X direction) of the pressing portion 52 and the peeling mechanism 38, and further, with respect to the width of the base tape 41. It is a figure which shows arrangement | positioning of the guide rollers 371, 372, 373, and 374 which have a groove | channel widened 0.1 mm or more (it regulates the base tape 41). FIG. 3B is a diagram after the peeling mechanism 38 operates in the (−X direction).

  FIG. 4 is a diagram showing an operation flow of the resin tape attaching method. FIG. 5 is a plan view showing the vicinity of the head unit 5. In the resin tape affixing method, as shown in FIG. 5, nine circuit boards 9 are held on the board holding part 2, and three circuit boards 9 arranged in a line in the Y direction on the (−X) side. The resin tape piece 421 has already been affixed. Hereinafter, with reference to FIGS. 4 and 5 and other drawings, three circuit boards 9 arranged in a line in the Y direction at the center on the board holding portion 2 are connected to the (−Y) side from the (−Y) side ( The operation of the resin tape affixing method for affixing the resin tape pieces 421 one by one to the + Y) side will be described.

  As shown in FIG. 1, when a resin tape piece is affixed to the circuit board 9 by the resin tape affixing method, first, the resin tape piece is to be affixed by the substrate holding unit 2 controlled by the control unit 7. The circuit board 9 (the central circuit board 9 among the three circuit boards 9 on the (−Y) side on the board holding unit 2 in FIG. 5) moves below the tape 4 and the bed part 5 (step S11). The position where the resin tape piece is affixed is confirmed by a camera (not shown), and the position of the circuit board 9 is corrected as necessary.

  The tape supply mechanism 3 is preliminarily positioned at the position shown in FIG. 1 (position where the tape 4 held on the circuit board 9 is positioned above the cutter unit 51) in the Z direction. Next, the head part 5 is moved in the Y direction by the head part horizontal movement mechanism 55 shown in FIG. 2, and the tape 4 is positioned between the cutter access member 513 and the cutter support member 512 of the cutter part 51 (step S12). . Here, 511 is a cutter. As will be described later, since the resin tape 42 is cut in a state where the tape supply mechanism 3 and the head unit 5 are located at the above positions, in the following description, the tape supply mechanism 3 shown in FIGS. The position of the head unit 5 is referred to as each “cutting position”.

  Subsequently, the cutter access member 513 is lowered by the cutter lifting mechanism 514 shown in FIG. 2, the cutter support member 512 is raised, and the tape 4 is sandwiched between the cutter access member 513 and the cutter 511, and the resin tape 42 is cut. Thus, the resin tape piece 421 is cut off (step S13).

  Next, after the cutter access member 513 and the cutter support member 512 are raised and lowered by the cutter lifting mechanism 514 shown in FIG. 2 and separated from the tape 4, the head portion 5 is moved from the cutting position by the head portion horizontal movement mechanism 55 ( + Y) direction (step S14). In the head unit 5, the cutter 511 retracts in the (+ Y) direction from the position where the tape 4 is sandwiched, and the pressing unit 52 moves above the tape 4.

  Subsequently, the tape supply mechanism 3 is lowered by the elevating mechanism 6 shown in FIG. 1, and the resin tape 42 and the resin tape piece 421 held by the base tape 41 approach the surface of the circuit board 9 (step S15). In the resin tape affixing method, the resin tape piece 421 is pressed against the circuit board 9 in a state where the tape supply mechanism 3 and the head unit 5 are located at the above positions.

  FIG. 6 is a front view showing a resin tape attaching method when the resin tape piece 421 is attached by the pressing portion 52. Hereinafter, the positions of the tape supply mechanism 3 and the head unit 5 shown in FIG. 6 are referred to as “pressing positions”. In the resin tape affixing method, the pressing head 521 is lowered by the pressing head lifting mechanism 523 in a state where the tape supply mechanism 3 and the head unit 5 are located at the pressing position, and the resin tape piece 421 is moved to the base tape 41 side ((+ Z) side). ) And affixed to the circuit board 9 by a predetermined pressure for a predetermined time (step S16).

  When the resin tape piece 421 is affixed onto the circuit board 9, the tape supply mechanism 3 is raised from the pressing position to the cutting position (see FIG. 1) by the elevating mechanism 6 shown in FIG. The base tape 41 that has been pulled up in the direction away from the substrate 9 ((+ Z) direction) and held the resin tape piece 421 is peeled off from the resin tape piece 421 attached to the circuit board 9 (step S17). The application of the resin film piece 421 to the substrate 9 is completed.

  The conventional tape sticking method in this state will be described. As shown in FIG. 8, since the positions of the guide rollers 375 are arranged on the same line in the Y direction, the width W of the tape 4 varies during production. Is ± 0.1, the distance W between the guide portions 376 at both ends of the roller 375 is +0.1, and the tape 4 is guided with play. Moreover, when peeling after sticking a resin tape piece, since the base tape 41 is slackened, the position of a tape is not settled. Therefore, the accuracy of the attaching position in the Y direction is deteriorated. As a result, the contact state between the guide portion 376 and the tape end portion changes in a non-constant manner, so that the running resistance when the base tape runs greatly fluctuates. Therefore, when the base tape is intermittently fed, bending due to insufficient feeding amount or excessive feeding occurs, causing the resin tape pieces to bend or overlap on the substrate or to be displaced.

  However, as shown in FIG. 3, in the present invention, the distance between the guide portions of the guide rollers 371, 372 and 373, 374 is set to a value larger than the width W of the base tape 41, ie, about W + 0.1 mm. The shorter distance Y1 between the guides of the guide rollers 371 and 372 is W−0.1 mm, and the shorter distance Y2 between the guides of the guide rollers 373 and 374 is W−0.1 mm. Further, the shorter distance Y3 between the guides of the guide rollers 372 and 373 is set to W−0.2. As a result, when the base tape 41 and the resin tape piece 421 are peeled off, the contact state between the guide roller and the tape is always constant, so that the tape 4 always moves while squeezing with a constant frictional force. Therefore, the position of the tape 4 can always be returned stably.

  Further, FIG. 7 is an explanatory view of a concave portion for preventing the tape from running on the guide portion. When taking measures against the guide roller, the base tape 41 may run on the guide portion 376 depending on the type of tape. This is because the shortest distance between the guide portions of the plurality of guide rollers is smaller than the tape width as described above. As a countermeasure, a recess 377 is provided in the direction from the tape contact surface of the guide roller toward the center of the guide roller, and when the base tape 41 is too biased toward the guide portion 376, the end of the base tape 41 enters the recess. Since the vicinity of the end portion of 41 is curved, a force is generated in the direction of the arrow 378 on the base tape 41 due to the reaction force from the guide portion 376, and it is possible to prevent the tape from running.

  When the cutting and pasting of one resin tape piece 421 is completed, it is determined by the control unit 7 shown in FIG. 1 whether or not the pasting to all circuit boards 9 to which the resin tape piece 421 is to be pasted is finished. (Step S18). In the pasting stage, it is determined that the pasting on all the circuit boards 9 has not been completed, and then it is determined whether or not the supply of the tape 4 (resin film 42) is necessary (step S19). Here, it is determined that the supply is unnecessary, and the process returns to step S11, where the resin film piece 421 is cut and pasted on the next circuit board 9.

  The pasting operation to the next circuit board 9 (the circuit board 9 located on the (+ Y) side of the first circuit board 9) is except that the cutting position of the resin tape piece 421 on the resin tape 42 by the cutter 511 is different. The operation is the same as described above. When affixing to the next circuit board 9 is performed, the board holding unit 2 moves in the (−Y) direction from the position shown in FIG. 5 and the tape on which the next circuit board 9 is held by the tape supply mechanism 3 4 (step S11), and position correction is performed as necessary.

  As described above, according to the resin tape sticking method and apparatus of the present invention, in the tape supply mechanism, only one side in a different direction is guided by the guide portions (ridges) of the tape guide rollers at both ends of the pressing portion. The distance between the guides perpendicular to the tape feed direction and parallel to the tape surface is Y3, and the guide portion between the first tape guide roller and the second tape guide roller in the tape feed direction of the pressing portion is Only one side of each different direction is guided, the distance between the guides perpendicular to the tape feeding direction and parallel to the tape surface is Y2, and the first tape guide roller in the direction opposite to the tape feeding direction of the pressing portion and 2 The guide part with the first tape guide roller guides only one side in different directions, and the distance between the guides perpendicular to the tape feed direction and parallel to the tape surface is Y When Y3, Y2 and Y1 are not more than the tape width and the positional relationship of Y3 <Y2 and Y3 <Y1, the respective tape guide rollers are arranged and the tape is intermittently fed. It is possible to return the base tape to a predetermined position while squeezing the loose base tape, preventing insufficient feed amount during intermittent feeding and occurrence of bending due to excessive feeding, realizing stable tape sticking and sticking to the circuit board. The sticking accuracy with respect to the direction perpendicular to the supply direction can be improved.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible. For example, the resin tape piece 421 attached to the circuit board 9 (that is, the resin tape 42 held on the base tape 41) is not limited to the ACF, but is a non-conductive resin film (NCF (Non-Conductive Film)). It may be applied. Further, the intermittent feeding means can be replaced with driving means such as air, an electric motor, a cam mechanism, or the like other than the chuck according to the present invention.

  The tape sticking method of the present invention can be used in a resin tape sticking method of sticking a resin tape such as an anisotropic conductive resin film or a non-conductive resin film for mounting electronic components on a circuit board such as a printed board. .

The front view which shows the structure of the tape sticking method in embodiment of this invention The left view which shows the head part vicinity in embodiment of this invention The top view which shows the tape supply mechanism vicinity in embodiment of this invention The figure which shows the flow of operation | movement of the resin tape sticking method in embodiment of this invention. The top view which shows the head part vicinity in embodiment of this invention The front view which shows the structure arrangement | positioning at the time of tape sticking in embodiment of this invention The conceptual diagram which shows the recessed part of the guide in embodiment of this invention Plan view showing the vicinity of a conventional tape supply mechanism

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Substrate holding part 3 Tape supply mechanism 4 Tape 6 Elevating mechanism 7 Control part 9 Circuit board 38 Peeling mechanism 41 Base tape 42 Resin tape 51 Cutter part 52 Press part

Claims (5)

A substrate holder for holding the substrate;
A tape supply mechanism for supplying the substrate tape with a resin tape held on a base tape;
A pressing portion for pressing the resin tape from the base tape side to the substrate;
A plurality of guide rollers having at least one guide portion that regulates a direction parallel to the plane of the base tape and perpendicular to the supply direction of the base tape;
The distance between the flange surface of the guide portion of one of the guide rollers disposed at both ends of the pressing portion and the flange surface of the guide portion of the other guide roller facing each other is Y3,
The distance between the flange surface of the guide portion of one guide roller and the flange surface of the guide portion of the other guide roller facing each other, which is arranged with respect to the tape feeding direction of the pressing portion, is Y2.
Y1 is the distance between the flange surface of the guide portion of one guide roller and the flange surface of the guide portion of the other guide roller facing each other, arranged in the direction opposite to the tape feeding direction of the pressing portion,
Y3, Y2 and Y1 are set to be equal to or smaller than the width of the base tape. The tape sticking device according to claim 1, wherein each distance between the flange surfaces facing each other of the guide portions of the plurality of guide rollers satisfies a relationship of Y3 <Y2 and Y3 <Y1. At least one of the plurality of guide rollers has a recess in a portion in contact with the guide portion of the contact surface with the tape plane of the guide roller in a direction from the contact surface with the tape plane of the guide roller toward the center of the guide roller. The tape sticking device according to claim 1, wherein the tape sticking device is provided. The tape sticking device according to claim 1, further comprising a peeling mechanism for pulling the base tape away from the substrate and peeling the base tape from the resin tape piece stuck to the substrate. In the pasting method of pasting the resin tape piece held on the base tape on the substrate by the pressing part,
The base tape is regulated by a plurality of guide rollers having at least one guide portion that regulates a direction parallel to the base tape plane and perpendicular to the supply direction of the base tape,
The distance between the flange surface of the guide portion of one of the guide rollers disposed at both ends of the pressing portion and the flange surface of the guide portion of the other guide roller facing each other is Y3,
The distance between the flange surface of the guide portion of one guide roller and the flange surface of the guide portion of the other guide roller facing each other, which is arranged with respect to the tape feeding direction of the pressing portion, is Y2.
The distance between the flange surface of the guide portion of one guide roller and the flange surface of the guide portion of the other guide roller facing each other, which is arranged in the direction opposite to the tape feeding direction of the pressing portion, is Y1,
Y3, Y2 and Y1 are set to be equal to or smaller than the width of the base tape, and the base tape is fed in a state where the distances between the flange surfaces of the guide portions of the plurality of guide rollers satisfy the relationship of Y3 <Y2, Y3 <Y1. A tape affixing method, wherein a tape piece is supplied.

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