JP2005327923A - Method and device of sticking conductive joint film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive joint film sticking method and a conductive joint film sticking device capable of performance enhancement with certainty, by improving productivity, versatility, and the like. <P>SOLUTION: The conductive coupling film sticking device 1 comprises a transferring mechanism 3 for transferring a sticking part Fa to a stuck part Pc. The transferring mechanism 3 is provided with a transfer head 9 having contact/separation action to/from the stuck part Pc via an electric conductive coupling film F from the separator S side. In this transfer head 9, there is provided a vibrator 11 possessing a pressurization oscillating side 12 formed in the same plane shape as the stuck part Pc. The electric conductive coupling film sticking method is constituted such that after locating the electric conductive coupling film F in the stuck part Pc, vibration and pressure may be granted to the sticking part Fa from the separator S side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a conductive bonding film sticking method and a conductive bonding film sticking apparatus suitable for sticking a conductive bonding film used for electrical connection between parts of an electronic component to an adhesion part of the electronic component.

  2. Description of the Related Art Conventionally, a technique for performing electrical connection between electronic components using a conductive bonding film is known. For example, mounting of a chip component that connects an electrode of a circuit board and an electrode of a chip component made into a chip such as a semiconductor, LED, resistor, capacitor, etc., or electrical connection between an electrode of a circuit board and an electrode of another circuit board Conductive bonding films are used for connecting parts that perform general connection instead of soldering. As such a conductive bonding film, an anisotropic conductive film (ACF: Anisotropic Conductive Film) is generally used.

  The anisotropic conductive film is composed of an adhesive (binder) having insulating properties and conductive particles. Examples of the adhesive include thermoplastic resins and thermosetting resins. Examples of the conductive particles used for the anisotropic conductive material include metal particles such as nickel and copper, or particles obtained by coating a resin bead with a metal such as nickel and gold. In addition, the anisotropic conductive film has conductivity in the thickness direction (connection direction) and conductivity in the surface direction (horizontal direction) by dispersing conductive particles in the insulating adhesive. It has electrical anisotropy. The connection by the anisotropic conductive film is basically thermocompression bonding, and the conductive particles share the function of electrical connection, and the adhesive shares the function of maintaining the pressure contact state. In addition, the anisotropic conductive film has a structure like a double-sided tape, that is, a flexible film-like separator such as polyethylene terephthalate (PET) or polyimide (PI) (release film) before being attached to the adherend. ) Is supplied as a tape-like anisotropic conductive tape in which an anisotropic conductive film is detachably laminated.

  As a method for attaching an anisotropic conductive film as a conductive bonding film to an adhesion part of an electronic component, for example, only the anisotropic conductive film is cut to a predetermined size while being attached to the separator, and the electronic film is attached together with the separator. After moving onto the adherend part of the component, the anisotropic conductive film is temporarily attached to the adherend surface on which the electrode of the adherent part is arranged by thermocompression bonding, and then the temporarily attached anisotropic conductive film An anisotropic conductive film sticking method in which a separator is peeled off from a film is known as a conductive bonding film sticking method. In order to realize such a conductive bonding film sticking method, a tape feeding mechanism that feeds the anisotropic conductive tape from the supply reel to the take-up reel, and a half that cuts only the anisotropic conductive film portion of the anisotropic conductive tape. An anisotropic conductive film sticking device having a cutting mechanism, a pressure bonding mechanism for sticking an anisotropic conductive film to an adherend, and a peeling mechanism for peeling the separator from the anisotropic conductive film has been proposed as a conductive bonding film sticking device. (For example, refer to Patent Document 1).

  About the conductive bonding film sticking apparatus which implements the conventional conductive bonding film sticking method, the anisotropic conductive film sticking apparatus which implements the anisotropic conductive film sticking method will be exemplified and described.

  FIG. 5 shows an anisotropic conductive film sticking apparatus for carrying out a conventional anisotropic conductive film sticking method. In the conventional anisotropic conductive film sticking apparatus 101, an anisotropic conductive tape T in which an anisotropic conductive film F is laminated on a tape-shaped separator S is used. The anisotropic conductive tape T is wound between a pair of reels 103 and 104 of the tape feeding mechanism 102. One reel 103 shown on the left side of FIG. The other reel 104 shown on the right side of FIG. 5 is a take-up reel for winding the anisotropic conductive tape T. Both reels 103 and 104 are arranged in a frame (both not shown) having a control unit for controlling the operation of each unit, and the anisotropic conductive tape T is transferred from the delivery reel 103 to the take-up reel 104. It is formed so that it can be sent toward. The tape feed mechanism 102 is provided with two guide rollers 105 and 106 facing the tape moving path of the anisotropic conductive tape T, and these guide rollers 105 and 106 are arranged on the anisotropic conductive tape T. By contacting the separator S, the tape moving path of the anisotropic conductive tape T is controlled as indicated by arrows in FIG. The tape feeding mechanism 102 is provided with tension applying means (not shown) such as a tension roller so that the anisotropic conductive tape T can be smoothly fed.

  A half-cut mechanism 107 and a pressure-bonding mechanism 108 are arranged in this order from the upstream side in the tape moving direction while the anisotropic conductive tape T moves along the tape moving path.

  The half-cut mechanism 107 is for cutting only the anisotropic conductive film F portion of the anisotropic conductive tape T and is opposed to the anisotropic conductive film F of the anisotropic conductive tape T. A cutter 109 is provided. The cutter 109 is formed so as to be able to contact and separate from the anisotropic conductive film F of the anisotropic conductive tape T.

  The crimping mechanism 108 is for pasting (temporary crimping) the anisotropic conductive film F formed in a predetermined shape by the cutter 109 onto the adherend Pc on which the electrode of the electronic component P such as a circuit board is formed. And has a heatable crimping head 110. The pressure-bonding head 110 is disposed such that the front end surface (pressure-bonded surface) faces the separator S of the anisotropic conductive tape T. Moreover, the front end surface of the crimping head 110 is formed flat and is formed so as to be able to contact and separate from the separator S of the anisotropic conductive tape T.

  A transport mechanism 111 that transports and holds the electronic component P at a predetermined position is disposed on the downstream side of the tape moving path of the half-cut mechanism 107, and the adherend portion Pc of the electronic component P is attached to the anisotropic conductive tape T. Thus, it can be conveyed and held at a position facing the front end surface of the crimping head 110.

  According to the anisotropic conductive film sticking apparatus 101 having such a configuration, as shown in FIG. 6A, only the anisotropic conductive film F is cut at a predetermined position by the cutter 109 of the half-cut mechanism 107. Then, after feeding the anisotropic conductive tape T by a predetermined length along the tape path, only the anisotropic conductive film F is cut again by the cutter 109 as shown in FIG. 6B. The sticking site | part Fa used for sticking of the anisotropic conductive film F is obtained. Next, the anisotropic conductive tape T is fed by a predetermined length along the tape path, and the electronic component P is conveyed and held at a predetermined position, so that the adherend Pc is opposed to the front end surface of the pressure-bonding head 110. While being transported and held at the position, the attachment site Fa is made to face the adherend Pc. Next, as shown in FIG. 6 (c), the pressure-bonding head 110 of the pressure-bonding mechanism 108 is brought into contact with the separator S side of the anisotropic conductive tape T while applying light pressure and heat of about 80 ° C. Pressure and heat are applied to the adhesion part Fa of the conductive film F, and the adhesion part Fa of the anisotropic conductive film F is temporarily attached to the adherend Pc of the electronic component P. Next, as shown in FIG. 6 (d), the separator S is peeled off from the sticking portion Fa of the temporarily attached anisotropic conductive film F, thereby sticking the sticking portion Fa to the adherend Pc (temporary attachment). Yes) An anisotropic conductive film sticking method is implemented.

  The separator S is peeled off by moving the entire tape feed mechanism 102 or the guide rollers 105 and 106 upward or using a separator peeling mechanism.

JP-A-5-53130

  However, in the anisotropic conductive film pasting apparatus 101 that performs the conventional anisotropic conductive film pasting method, there is a problem that it is not possible to achieve high performance by improving productivity and versatility in recent years. there were.

  That is, in the anisotropic conductive film bonding apparatus 101 that performs the conventional anisotropic conductive film bonding method, the cutting blade of the cutter 109 is brought into direct contact with the anisotropic conductive film F stacked on the separator S. Therefore, there is a problem in that a part of the anisotropic conductive film F adheres to the cutting blade and maintenance of the cutter 109 is required.

  Moreover, in the anisotropic conductive film sticking apparatus 101 which implements the conventional anisotropic conductive film sticking method, the cutting blade of the cutter 109 is applied twice to the anisotropic conductive film F laminated on the separator S. Since it is set as the structure which obtains the sticking site | part Fa used for sticking of the anisotropic conductive film F by cut | disconnecting, there existed a problem that the planar shape of the sticking site | part Fa was limited to a rectangle. As a result, there is a problem in that it cannot cope with various shapes of the adherend part Pc of the electronic component P, that is, it is inferior in versatility.

  Furthermore, in the anisotropic conductive film sticking apparatus 101 that performs the conventional anisotropic conductive film sticking method, the half-cut mechanism 107 for obtaining the sticking part Fa used for sticking the anisotropic conductive film F is used. And the pressure bonding mechanism 108 for temporarily attaching the bonding portion Fa to be bonded to the anisotropic conductive film F to the adherend portion Pc of the electronic component P, the overall configuration is complicated. There was a problem of becoming. This leads to an increase in tact time because it is necessary to carry out a temporary attachment process by the pressure-bonding mechanism 108 after the cutting of the anisotropic conductive film F by the half-cut mechanism 107 twice.

  Therefore, there is a need for a conductive bonding film sticking method and a conductive bonding film sticking apparatus that can reliably improve performance by improving productivity and versatility.

  The present invention has been made in view of the above points, and provides a conductive bonding film bonding method and a conductive bonding film bonding apparatus capable of surely improving performance by improving productivity and versatility. The purpose is to do.

  In order to achieve the above-described object, the conductive bonding film sticking method of the present invention is characterized in that a sticking site used for sticking a conductive bonding film laminated on a separator is stuck on an adherent portion of an electronic component. In this method, the conductive bonding film is positioned on the adherend, and then vibration and pressure are applied from the separator side to the bonding site.

  In the conductive bonding film sticking method of the present invention, it is preferable to use ultrasonic vibration as the vibration, and it is preferable to use an anisotropic conductive bonding film as the conductive bonding film.

  When there are a plurality of sticking parts, it is preferable that vibration and pressure are simultaneously applied to each of the plurality of sticking parts.

  In addition, the conductive bonding film sticking apparatus of the present invention is characterized in that the conductive bonding film sticking for sticking the sticking part for sticking the conductive bonding film laminated on the separator to the adherend part of the electronic component. An apparatus having a transfer mechanism for transferring the sticking part to the adherend, the transfer mechanism contacting the adherent from the separator side via the conductive bonding film. A transfer head that can be separated is provided, and this transfer head is provided with a vibrator having a pressurizing vibration surface that is formed in the same plane as the adherend.

  In the conductive bonding film sticking apparatus of the present invention, the vibrator is preferably connected to an ultrasonic oscillator, and the conductive bonding film is preferably an anisotropic conductive film. Furthermore, a configuration may be adopted in which a plurality of the pressure vibration surfaces protrude from the transfer head.

  According to the conductive bonding film sticking method and the conductive bonding film sticking apparatus according to the present invention, it is possible to reliably achieve high performance by improving productivity and versatility. Moreover, according to the electroconductive bonding film sticking apparatus of this invention, there exists an outstanding effect that the conductive bonding film sticking method of this invention can be implemented reliably and easily.

  The present invention will be described below with reference to embodiments shown in the drawings. Note that the same or corresponding components as those of the conventional one described above are denoted by the same reference numerals in the drawings, and description thereof is omitted.

  FIG. 1 and FIG. 2 show an embodiment of a conductive bonding film sticking apparatus for carrying out the conductive bonding film sticking method according to the present invention, and FIG. 1 is a schematic view showing the main part of the overall configuration in a simplified manner. FIG. 2 is an enlarged front view of the transfer head.

  In the conductive bonding film sticking apparatus 1 of the present embodiment, an anisotropic conductive film F is used as a conductive bonding film to be stuck to the adherend part Pc of the electronic component P, and a conductive film in which a conductive bonding film is stacked on a separator. As a bonding film tape, an anisotropic conductive tape T in which an anisotropic conductive film F is laminated on a tape-shaped separator S is used as in the past.

  As shown in FIG. 1, the conductive bonding film sticking apparatus 1 of the present embodiment includes a tape feeding mechanism 2, a transfer mechanism 3, and a transport mechanism 4.

  The tape feeding mechanism 2 is for feeding an anisotropic conductive tape T as a conductive bonding film tape along a predetermined tape movement path, and a pair of reels 5 around which the anisotropic conductive tape T is wound. , 6. These reels 5 and 6 are used as a delivery reel in which one of the reels shown on the left side of FIG. 1 feeds the anisotropic conductive tape T, and the other reel shown on the right side of FIG. It is said to be a reel. These reels 5 and 6 are arranged in a frame (not shown) provided with a control unit including a CPU, a memory and the like for controlling the operation of each unit. Further, a plurality of, in the present embodiment, two guide rollers 7 and 8 are arranged in the tape moving path so as to face the tape moving path of the anisotropic conductive tape T, and these guide rollers 7 and 8 are arranged. Is brought into contact with the separator S of the anisotropic conductive tape T, so that the tape moving path of the anisotropic conductive tape T is controlled as indicated by the arrows in FIG. The tape feeding mechanism 2 is driven at a predetermined timing and at a predetermined speed by a driving force of an actuator (not shown) such as a stepping motor driven at a predetermined timing based on a control command sent from the control unit. The anisotropic conductive tape T is formed so as to be fed from the delivery reel 5 toward the take-up reel 6 along a predetermined tape moving path.

  The tape feeding mechanism 2 is provided with tension applying means (not shown) such as a tension roller so that the anisotropic conductive tape T can be smoothly fed.

  The tape feeding mechanism 2 can be selected from various conventionally known ones.

  The transfer mechanism 3 is for transferring the adhesion part Fa of the anisotropic conductive film F to the adhesion part Pc of the electronic component P, that is, for adhering the adhesion part Fa to the adhesion part Pc. The transfer mechanism 3 is provided in the middle of feeding the anisotropic conductive tape T along the tape moving path.

  The tape transfer mechanism 3 of this embodiment has a transfer head 9. The transfer head 9 is disposed such that a flat front end surface 9a shown in the lower part of FIG. 1 faces the separator S of the anisotropic conductive tape T. The transfer head 9 is connected to an ultrasonic oscillator 10 as a vibration generator. That is, in the present embodiment, the entire transfer head 9 is the vibrator 11.

  As shown in detail in FIG. 2, the front end surface 9a of the transfer head 9 is a pressing vibration surface 12 formed in the same plane shape as the adherend Pc. The transfer head 9 can be reciprocated in the vertical direction by a driving force of an actuator 13 such as a reciprocating cylinder driven at a predetermined timing based on a control command sent from the control unit. Then, due to the reciprocating movement of the transfer head 9, the vibration surface 12 as the leading end surface 9 a of the transfer head 9 is applied to the adherend Pc from the separator side through the anisotropic conductive tape T at a predetermined speed and a predetermined pressure. It can be connected and separated.

  In other words, the transfer mechanism 3 is provided with a transfer head 9 that can be brought into and out of contact with the adherend Pc through the anisotropic conductive film F from the separator side.

  The shape and size of the pressing vibration surface 12 can be selected according to the shape and size of the adherend Pc. Examples of the shape of the pressure vibration surface 12 include various shapes such as a circle, an ellipse, a triangle, a quadrangle including a square, a polygon, a trapezoid, a straight line, and a curve.

  Moreover, the formation position of the pressurization vibration surface 12 should just be a position which can oppose the separator S. FIG. For example, the transfer head 9 that can be moved toward and away from the separator S has a barrel section having a polygonal cross section that can rotate around a horizontal axis, and is different on each surface around the barrel section. A pressurizing vibration surface 12 having a shape can be provided. With such a configuration, the transfer head 9 can be provided with versatility, and the setup time can be shortened.

  In addition, it is preferable that a vibration isolating device such as an anti-vibration rubber (not shown) is interposed in the connection portion between the vibrator 11 and the actuator 13 in the sense that adverse effects on the actuator 13 due to vibration can be prevented.

  Further, at least the pressure vibration surface 12 of the transfer head 9 may be covered with a protective cover made of resin or the like.

  The vibrator 11 can be selected from various materials that can withstand vibration transmission and applied pressure, such as metal such as tool steel, ceramics, and ruby. It is preferable in the sense that it is easy and can be obtained easily and inexpensively with excellent hardness, wear resistance and durability.

  Note that the vibrator 11 having the pressurizing vibration surface 12 may be formed individually, and the vibrator 11 may be fixed to the tip of the transfer head 9. That is, the transfer head 9 only needs to be provided with the vibrator 11 having the pressure vibration surface 12.

  Further, when a plurality of adherend parts Pc are provided on the electronic component P, such as when a plurality of chip parts are mounted on a circuit board, the number of the adherent parts Pc is set on one transfer head 9. A plurality of pressurizing vibration surfaces 12 may be provided in a projecting manner according to the position. An example of the transfer head 9A provided with the plurality of pressure vibration surfaces 12 is shown in FIG. As described above, the anisotropic conductive film F is adhered to the plurality of adherends Pc arranged at high density by providing a configuration in which the plurality of pressure vibration surfaces 12 protrude from one transfer head 9A. Can be easily performed simultaneously. That is, high density arrangement of the anisotropic conductive film F can be easily performed.

  The transport mechanism 4 is for transporting and holding the electronic component P at a predetermined position, and the adherend portion Pc of the electronic component P is opposed to the front end surface 9a of the transfer head 9 via the anisotropic conductive tape T. It can be conveyed and held at the position.

  The transport mechanism 4 can be selected from various conventionally known ones.

  Next, the operation of the conductive bonding film bonding apparatus according to the present invention will be described together with the conductive bonding film bonding method of the present invention.

  FIG. 4 shows an embodiment of the conductive bonding film sticking method according to the present invention, and FIG. 4 (a) is a schematic explanation showing the main part in a set state in which the anisotropic conductive tape is positioned on the adherend. Sectional drawing, FIG. 4B is a schematic explanatory sectional view showing the main part of the pasting state of the pasting part by the transfer head following FIG. 4A, and FIG. 4C is the transfer following FIG. FIG. 4D is a schematic explanatory cross-sectional view showing a main part in a state where the sticking is completed at the sticking site following FIG. 4C.

  The conductive bonding film sticking method of this embodiment is implemented using the conductive bonding film sticking apparatus 1 of this embodiment shown in FIG.

  Then, when the conductive bonding film sticking method of the present embodiment is started, the tape feeding mechanism 2 and the transport mechanism 4 are driven to send the anisotropic conductive tape T to a predetermined position, and the adherend portion Pc of the electronic component P. Is conveyed and held at a position facing the front end surface 9a of the transfer head 9 via the anisotropic conductive tape T. Then, as is conventionally known, the anisotropic conductive tape T is positioned on the adherend Pc of the electronic component P by moving the entire tape feeding mechanism 2 or the guide rollers 7 and 8 downward. As a result, the front end surface 9a of the transfer head 9 is disposed so as to face the adherent part Pc via the anisotropic conductive tape T. FIG. 4A shows a set state in which the anisotropic conductive tape T is positioned on the adherend Pc of the electronic component P. FIG.

  Next, the actuator 13 is driven to lower the transfer head 9 toward the separator side of the anisotropic conductive tape T and pressurize the pressurizing vibration surface 12 as the end face 9a against the separator S of the anisotropic conductive tape T. At the same time, the ultrasonic oscillator 10 is driven. Then, the adhesion site Fa of the anisotropic conductive film F is vibrated under pressure, and the adhesion site Fa is melted and adhered to the adherend Pc by frictional heat due to ultrasonic vibration. FIG. 4B shows a pressure vibration state of the adhesion site Fa of the anisotropic conductive film F by the pressure vibration surface 12 of the transfer head 9.

  Here, the sticking to the adherend Pc by the pressure vibration of the sticking part Fa of the anisotropic conductive film F will be specifically described.

  For example, as the anisotropic conductive tape T, an ACF manufactured by Sony Chemical Co., Ltd. (model number FP3111N: a separator S made of PET having a thickness of 50 μm, an anisotropic conductive film F having a thickness of 50 μm, and an anisotropic conductive film F having a binder) Glass epoxy in which a circuit is formed on the adherend portion Pc of the electronic component P using an epoxy resin, a conductive particle having a particle diameter of 5 μm obtained by nickel / gold plating on the resin, and a number of conductive particles of 1.5 million per square millimeter) The external connection terminal (electrode) forming part of the substrate is used, the shape of the sticking part Fa is square, and the pressure vibration surface 12 of the transfer head 9 is square.

  When the size of the adherend Pc, that is, the pressure vibration surface 12 is a square having a side of 1 mm, the frequency of the ultrasonic oscillator 10 is used to attach the anisotropic conductive film F to the adherend Pc. Is 30 kHz, the output is 5 to 10 W, the applied pressure is 160 to 650 MPa, and the pressurization time is 1 to 5 seconds.

  When the output of the ultrasonic oscillator 10 falls below this range, the bonding portion Fa is not sufficiently melted by the frictional heat of ultrasonic vibration, so the boundary between the ultrasonic vibration applying portion and the non-applying portion is unclear. Thus, when the separator S is peeled off, the shape of the outer periphery of the sticking portion Fa tends to become unstable. On the other hand, when the output exceeds this range, the adhesion site Fa is excessively melted by the frictional heat of ultrasonic vibration, and when the separator S is peeled off, the adhesion site Fa is peeled off from the adherend Pc, There is a tendency that the sticking part Fa does not remain on the sticking part Pc, that is, the sticking part Fa cannot be stuck on the sticking part Pc.

  Further, the respective ranges of the pressing force and the pressurizing time have the same tendency as the output of the ultrasonic oscillator 10. That is, when the pressure and pressurization time are both below the range, the shape of the outer periphery of the sticking portion Fa tends to become unstable. There is a tendency that the wearing site Fa does not remain.

  Further, when the size of the pressure vibration surface 12 is a square having a side of 3 mm, in order to attach the anisotropic conductive film F to the adherend Pc, the frequency of the ultrasonic oscillator 10 is 22 kHz, and the output is 10 It is good to set it to the range of -15W, pressurization pressure 12-72MPa, and pressurization time 5-45.

  Further, when the size of the pressure vibration surface 12 is a square having a side of 5 mm, in order to attach the anisotropic conductive film F to the adherend Pc, the frequency of the ultrasonic oscillator 10 is 22 kHz, and the output is 15 It is good to set it to the range of -25W, pressurizing force 8.6-30MPa, and pressurization time for 5-60 seconds.

  Furthermore, when the size of the pressure vibration surface 12 is a square having a side of 10 mm, in order to attach the anisotropic conductive film F to the adherend Pc, the frequency of the ultrasonic oscillator 10 is 22 kHz, and the output is It is preferable that the pressure is 15 to 25 W, the applied pressure is 6.5 to 19.5 MPa, and the pressing time is 10 to 60 seconds.

  In addition, what is necessary is just to set the frequency, output, pressurization force, pressurization holding time, etc. by the ultrasonic oscillator 10 according to specifications, such as the anisotropic conductive tape T and the adherend part Pc of the electronic component P.

  In addition, for attaching the attachment site Fa to the adherend Pc, the temperature of the anisotropic conductive tape T is set to 20 ° C. or less, which means that stable attachment can be performed for a long time. Is preferable. This is because when the anisotropic conductive tape T is exposed to a temperature environment exceeding 20 ° C. for a long time, the anisotropic conductive film F becomes soft with the passage of time, and a stable shape of the sticking part Fa is obtained. This is because it becomes difficult. Therefore, the anisotropic conductive tape T before being used may be stored at a temperature of -20 to 5 ° C.

  Furthermore, it has been confirmed by experiments that there is no significant difference in the frequency of the ultrasonic oscillator 10 within the range of 15 to 30 kHz.

  Returning to the conductive bonding film attaching method of the present embodiment, when the transfer head 9 is then raised, the transfer head 9 is separated from the anisotropic conductive tape T and returned to the initial position. The return state of the transfer head 9 is shown in FIG.

  Next, when the separator S is peeled from the sticking site Fa, the sticking site Fa remains on the adherend Pc, and the conductive bonding film sticking method of the present embodiment is completed. FIG. 4D shows a state where the anisotropic conductive film F has been pasted.

  The separator S is peeled off by moving the entire tape feeding mechanism 2 or the guide rollers 7 and 8 upward or using a separator peeling mechanism, as in the prior art.

  Thus, according to the conductive bonding film sticking method of the present embodiment, after the anisotropic conductive film F as the conductive bonding film is positioned on the adherend portion Pc, vibration and vibration are applied from the separator side to the sticking site Fa. By applying pressure, it is possible to easily attach the attachment site Fa to the adherend Pc using frictional heat due to pressure and vibration.

  Moreover, according to the conductive bonding film sticking method of the present embodiment, only the anisotropic conductive film F is cut into a predetermined size while being stuck to the conventional separator S to obtain the sticking site Fa, Unlike the method of positioning the sticking part Fa on the adherent part Pc, by positioning the anisotropic conductive film F on the sticking part Pc, by applying vibration and pressure to the sticking part Fa from the separator side, Since the sticking part Fa can be stuck to the adherend part Pc, a highly accurate feed control mechanism is required to keep the feed accuracy of the anisotropic conductive tape T by the tape feed mechanism 2 as high as conventional. do not do. As a result, the structure of the device can be simplified and the cost can be reduced.

  Note that in the conventional conductive bonding film sticking method, the tape feeding mechanism 102 is provided with high feed pitch, that is, positioning accuracy, in order to position the cut sticking site Fa on the adherend Pc. A feed control mechanism is required.

  Furthermore, according to the conductive bonding film sticking method of the present embodiment, the sticking part Fa of the anisotropic conductive film F can be stuck to the adherend Pc in one step, so that the process can be simplified. In addition, the tact time can be shortened, that is, the production efficiency can be easily improved.

  Therefore, according to the conductive bonding film sticking method of this embodiment, high performance can be achieved by improving productivity and versatility in recent years.

  In addition, according to the conductive bonding film sticking method of the present embodiment, heat for melting the sticking site Fa can be easily obtained by using ultrasonic vibration as vibration.

  Furthermore, according to the conductive bonding film sticking method of the present embodiment, the anisotropic conductive bonding film F is used as the conductive bonding film, so that the electrical connection between the components of the electronic component P is easily and reliably performed. be able to.

  Furthermore, according to the conductive bonding film sticking method of the present embodiment, the pressure vibration surface 12 is brought into contact with the separator side of the anisotropic conductive tape T, so that the cutting blade of the conventional cutter 109 is anisotropic. There is no inconvenience that a part of the anisotropic conductive film F adheres to the cutting blade that occurs when the cutting is performed by directly contacting the conductive film F. That is, according to the conductive bonding film sticking method of the present embodiment, since the anisotropic conductive film F does not partially adhere to the pressurizing vibration surface 12, pressurization due to the adhesion of the anisotropic conductive film F is performed. Maintenance of the vibration surface 12 and thus the transfer head 9 is not required.

  Further, in the conductive bonding film sticking method of the present embodiment, even if there are a plurality of sticking portions Fa, a plurality of pressure vibration surfaces 12 are provided on one transfer head 9 so as to project a plurality of sticking parts Fa. Vibration and pressure can be simultaneously applied to each of the landing sites Fa. As a result, it is possible to reliably simplify the structure of the apparatus.

  According to the conductive bonding film sticking apparatus 1 of this embodiment, it has the transfer mechanism 3 for transferring the sticking site Fa to the adherend Pc, and the transfer mechanism 3 includes a conductive bonding film from the separator side. A transfer head 9 that can be brought into and out of contact with the adherend Pc is provided via an anisotropic conductive film F as a transfer head 9 and is formed in the same plane shape as the adherend Pc. Since the vibrator 11 having the pressurizing vibration surface 12 is provided, the conductive bonding film sticking method of the present invention, that is, the sticking site used for sticking the conductive bonding film laminated on the separator S is provided. A method of attaching a conductive bonding film for attaching to an adherent part Pc of an electronic component P, wherein after the conductive adhesive film is positioned on the adherent part Pc, vibration and pressure are applied from the separator side to the attachment part Fa. The conductive bonding film attaching method to be applied can be easily implemented in a simple process. Kill. As a result, since the anisotropic conductive film F can be attached to the adherent part Pc in one step, the process is simplified and the tact time is shortened, that is, the production efficiency is improved. Can be easily achieved.

  Therefore, according to the conductive bonding film sticking apparatus 1 of this embodiment, high performance can be achieved by improving productivity and versatility in recent years.

  Moreover, according to the conductive bonding film sticking apparatus 1 of the present embodiment, the sticking site of the anisotropic conductive film F is set by setting the planar shape of the pressure vibration surface 12 according to the shape of the adherend part Pc. The shape of Fa can be made to correspond to various shapes of the adherend part Pc of the electronic component P.

  Furthermore, according to the conductive bonding film sticking apparatus 1 of the present embodiment, the sticking portion Fa can be melted from the separator side by the pressurizing vibration surface 12 and stuck on the adherend surface Pc. Since there is no inconvenience that a part of the anisotropic conductive film F adheres to the cutting blade that occurs when the cutting blade is configured to be brought into direct contact with the anisotropic conductive film F, the pressing vibration surface 12, That is, maintenance of the transfer head 9 is not required.

  Further, according to the conductive bonding film sticking apparatus 1 of the present embodiment, since the vibrator 11 is connected to the ultrasonic oscillator 10, heat for melting the sticking site Fa can be easily obtained. .

  Furthermore, according to the conductive bonding film sticking apparatus 1 of the present embodiment, since the conductive bonding film is the anisotropic conductive film F, the electrical connection between the components of the electronic component P can be easily and reliably performed. it can.

  Furthermore, according to the conductive bonding film sticking apparatus 1 of the present embodiment, since a plurality of pressure vibration surfaces 12 can be projected on the transfer head 9, vibration and vibration are respectively applied to the plurality of sticking parts Fa. Pressure can be applied simultaneously. As a result, it is possible to reliably simplify the structure of the apparatus.

  In the present embodiment, the anisotropic conductive film F is used as the conductive bonding film to be attached to the adherend portion Pc of the electronic component P, and as a conductive bonding film tape in which the conductive bonding film is laminated on the separator, Although the anisotropic conductive tape T in which the anisotropic conductive film F is laminated on the tape-shaped separator S is used, it is not limited to this.

  That is, as the conductive bonding film and the conductive bonding film tape used in the conductive bonding film bonding method and the conductive bonding film bonding apparatus of the present embodiment, the bonding site can be transferred to the adherend using frictional heat due to vibration. As long as it can be used, for example, an indium foil tape in which indium is releasably supported by vapor deposition on a peeling tape, or a solder foil tape in which solder foil is releasably carried by vapor deposition on a peeling tape, etc. Can do.

  In addition, even if it used the indium foil tape, it was able to confirm by experiment that it became the same result as the case where the anisotropic conductive tape T of this embodiment was used.

  The present invention is not limited to the above-described embodiments, and various modifications can be made as necessary.

Schematic which simplifies and shows the principal part of the whole structure of embodiment of the conductive bonding film sticking apparatus which implements the conductive bonding film sticking method which concerns on this invention 1 is an enlarged front view of the transfer head of FIG. Bottom view showing a modified example in which a plurality of pressure vibration surfaces are provided on the transfer head. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an embodiment of a method for attaching a conductive bonding film according to the present invention, and FIG. FIG. 4B is a schematic cross-sectional view showing the main part of the pasting state of the pasting site by the transfer head following FIG. 4A, and FIG. 4C is the return state of the transfer head following FIG. Schematic explanatory cross-sectional view showing the main part, FIG. 4 (d) is a schematic explanatory cross-sectional view showing the main part of the pasting completion state of the pasting site following FIG. 4 (c) Schematic which simplifies and shows the principal part of the whole structure of the anisotropic conductive film sticking apparatus which enforces the conventional anisotropic conductive film sticking method Schematic explanatory cross-sectional view showing the main part of a conventional anisotropic conductive film attaching method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Conductive bonding film sticking apparatus 2 Tape feed mechanism 3 Transfer mechanism 4 Conveyance mechanism 9 Transfer head 9a Tip surface 10 Ultrasonic oscillator 11 Vibrator 12 Pressurized vibration surface T Anisotropic conductive tape F Anisotropic conductive film Fa S Separator P Electronic component Pc

Claims (8)

It is a conductive bonding film sticking method for sticking a sticking part to be attached to a sticking part of an electronic component to be used for sticking a conductive bonding film laminated on a separator,
After the conductive bonding film is positioned on the adherend, vibration and pressure are applied from the separator side to the bonding site.   2. The conductive bonding film sticking method according to claim 1, wherein ultrasonic vibration is used as the vibration.   The conductive bonding film sticking method according to claim 1, wherein an anisotropic conductive bonding film is used as the conductive bonding film.   4. The conductive bonding film sticking according to claim 1, wherein there are a plurality of sticking parts, and vibration and pressure are simultaneously applied to each of the sticking parts. How to wear. It is a conductive bonding film sticking device for sticking a sticking part to be attached to a sticking part of an electronic component for sticking a conductive bonding film laminated on a separator,
It has a transfer mechanism for transferring the sticking part to the adherend,
The transfer mechanism is provided with a transfer head that can be brought into and out of contact with the adherend from the separator side through the conductive bonding film. The transfer head has the same planar shape as the adherend. An electroconductive bonding film sticking apparatus, comprising: a vibrator having a pressure vibration surface formed on the surface.   The conductive bonding film sticking apparatus according to claim 5, wherein the vibrator is connected to an ultrasonic oscillator.   The conductive bonding film sticking apparatus according to claim 5, wherein the conductive bonding film is an anisotropic conductive film.   The conductive bonding film sticking apparatus according to claim 5, wherein a plurality of the pressure vibration surfaces protrude from the transfer head.