JPH02256251A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPH02256251A
JPH02256251A JP24956389A JP24956389A JPH02256251A JP H02256251 A JPH02256251 A JP H02256251A JP 24956389 A JP24956389 A JP 24956389A JP 24956389 A JP24956389 A JP 24956389A JP H02256251 A JPH02256251 A JP H02256251A
Authority
JP
Japan
Prior art keywords
chip
adhesive
die pad
semi
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24956389A
Other languages
Japanese (ja)
Other versions
JP2538071B2 (en
Inventor
Kiyoshi Takaoka
Nariyuki Uenishikubo
Hiroyoshi Yoshida
Original Assignee
Matsushita Electron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP24135488 priority Critical
Priority to JP63-312318 priority
Priority to JP63-241354 priority
Application filed by Matsushita Electron Corp filed Critical Matsushita Electron Corp
Priority to JP1249563A priority patent/JP2538071B2/en
Publication of JPH02256251A publication Critical patent/JPH02256251A/en
Application granted granted Critical
Publication of JP2538071B2 publication Critical patent/JP2538071B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

PURPOSE: To obtain a high quality semiconductor device free from occurrence of bubbles and chip tilt by a method wherein semi-hardened thermosetting resin or thermoplastic resin adhesive of uniform thickness is used to adhere a chip to a die pad.
CONSTITUTION: Adhesive 9 comprising semi-hardened resin or thermoplastic resin is used to make a chip 6 uniformly thick and adhere it to a die pad 2. That is, the adhesive 9 is screened on a tape-like release paper 10 with substantially uniform thickness, the adhesive 9 is heat-transferred to the die pad 2 of a leadframe 1, the chip 6 is press-fitted by a collet 7 while the adhesive 9 transferred to the die pad 2 is being heated, and heat treatment is performed for complete hardening if the adhesive 9 is semi-hardened resin so that the chip 6 is adhered to the die pad 2. Thus a high quality semiconductor device free from occurrence of bubbles and tilt of the chip 6 can be obtained.
COPYRIGHT: (C)1990,JPO&Japio
JP1249563A 1988-09-27 1989-09-26 Method for manufacturing semiconductor device Expired - Fee Related JP2538071B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP24135488 1988-09-27
JP63-312318 1988-12-09
JP63-241354 1988-12-09
JP1249563A JP2538071B2 (en) 1988-09-27 1989-09-26 Method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249563A JP2538071B2 (en) 1988-09-27 1989-09-26 Method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPH02256251A true JPH02256251A (en) 1990-10-17
JP2538071B2 JP2538071B2 (en) 1996-09-25

Family

ID=26535213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249563A Expired - Fee Related JP2538071B2 (en) 1988-09-27 1989-09-26 Method for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JP2538071B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140404A (en) * 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
JP2001176895A (en) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
WO2006137608A1 (en) * 2005-06-23 2006-12-28 Korea Taconic Co., Ltd Carrier tape for loading flexible printed circuits
JP2012174913A (en) * 2011-02-22 2012-09-10 Denso Corp Method of manufacturing structure having both-sided adhesive body

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131740A (en) * 1982-01-30 1983-08-05 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS62115729A (en) * 1985-11-15 1987-05-27 Hitachi Ltd Electronic device and production equipment thereof
JPS6422744U (en) * 1987-07-24 1989-02-06

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131740A (en) * 1982-01-30 1983-08-05 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS62115729A (en) * 1985-11-15 1987-05-27 Hitachi Ltd Electronic device and production equipment thereof
JPS6422744U (en) * 1987-07-24 1989-02-06

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5304842A (en) * 1990-10-24 1994-04-19 Micron Technology, Inc. Dissimilar adhesive die attach for semiconductor devices
US5140404A (en) * 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
JP2001176895A (en) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same
KR100426298B1 (en) * 1994-12-26 2004-04-08 히다치 가세고교 가부시끼가이샤 Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
WO2006137608A1 (en) * 2005-06-23 2006-12-28 Korea Taconic Co., Ltd Carrier tape for loading flexible printed circuits
JP2012174913A (en) * 2011-02-22 2012-09-10 Denso Corp Method of manufacturing structure having both-sided adhesive body

Also Published As

Publication number Publication date
JP2538071B2 (en) 1996-09-25

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Legal Events

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