JPS6422744U - - Google Patents

Info

Publication number
JPS6422744U
JPS6422744U JP11441687U JP11441687U JPS6422744U JP S6422744 U JPS6422744 U JP S6422744U JP 11441687 U JP11441687 U JP 11441687U JP 11441687 U JP11441687 U JP 11441687U JP S6422744 U JPS6422744 U JP S6422744U
Authority
JP
Japan
Prior art keywords
tape
adhesive
applying
semi
backed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11441687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11441687U priority Critical patent/JPS6422744U/ja
Publication of JPS6422744U publication Critical patent/JPS6422744U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例である接着剤付きテ
ープの断面図、第２図は接着剤付きテープの製造
方法の一例を示す治具テープ並びにキヤリアテー
プの断面図、第３図は接着剤付きテープを用いた
ペレツトマウント工程を示すペレツトマウンタの
側面図である。第４図及び第５図は従来のリード
フレームへの接着剤の塗布工程及びペレツトマウ
ント工程を示すペレツトマウンタの側面図で、第
４図は接着剤を滴下する場合、第５図は接着剤塗
布用スタンプを用いる場合を夫々示す。 １０……接着剤付きテープ、１１……キヤリア
テープ、１２……接着剤層。 Fig. 1 is a sectional view of an adhesive-backed tape that is an embodiment of the present invention, Fig. 2 is a sectional view of a jig tape and a carrier tape showing an example of a method for manufacturing an adhesive-backed tape, and Fig. 3 is an adhesive tape. FIG. 3 is a side view of a pellet mounter showing a pellet mounting process using adhesive tape. Figures 4 and 5 are side views of a pellet mounter showing the conventional process of applying adhesive to a lead frame and the pellet mounting process. The cases in which a stamp for applying the agent is used are shown respectively. 10... Tape with adhesive, 11... Carrier tape, 12... Adhesive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤリアテープに、均一な厚さの接着剤層を所
定の間隔で、半硬化状に塗着・形成したことを特
徴とする接着剤付きテープ。 An adhesive-backed tape characterized by applying and forming a semi-cured adhesive layer of uniform thickness at predetermined intervals on a carrier tape.
JP11441687U 1987-07-24 1987-07-24 Pending JPS6422744U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11441687U JPS6422744U (en) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11441687U JPS6422744U (en) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6422744U true JPS6422744U (en) 1989-02-06

Family

ID=31355143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11441687U Pending JPS6422744U (en) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6422744U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256251A (en) * 1988-09-27 1990-10-17 Matsushita Electron Corp Semiconductor device and its manufacture
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
JP2012174913A (en) * 2011-02-22 2012-09-10 Denso Corp Method of manufacturing structure having both-sided adhesive body

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028971A (en) * 1973-07-14 1975-03-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028971A (en) * 1973-07-14 1975-03-24

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256251A (en) * 1988-09-27 1990-10-17 Matsushita Electron Corp Semiconductor device and its manufacture
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
JP2012174913A (en) * 2011-02-22 2012-09-10 Denso Corp Method of manufacturing structure having both-sided adhesive body

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