JPS63190076U - - Google Patents
Info
- Publication number
- JPS63190076U JPS63190076U JP8208487U JP8208487U JPS63190076U JP S63190076 U JPS63190076 U JP S63190076U JP 8208487 U JP8208487 U JP 8208487U JP 8208487 U JP8208487 U JP 8208487U JP S63190076 U JPS63190076 U JP S63190076U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic component
- tape
- adhesive layer
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の実例を示す部分平面図、第２
図は第１図における−′線切断面図、第３図
は本考案の他の実例を示す部分平面図である。
１……テーピング帯、１１……透孔、１２……
送り孔、２……電子部品、３……粘着テープ状体
、３１……粘着剤層。
Figure 1 is a partial plan view showing an example of the present invention;
The figure is a sectional view taken along the line -' in FIG. 1, and FIG. 3 is a partial plan view showing another example of the present invention. 1...Taping band, 11...Through hole, 12...
Feed hole, 2...Electronic component, 3...Adhesive tape-like body, 31...Adhesive layer.
Claims (1)
孔上に電子部品を配置し、該テーピング帯の裏面
側に粘着テープ状体を貼り合せると共に前記透孔
該当位置において該テープ状体に変形を与えて前
記電子部品を接着固定してなる電子部品搬送体で
あつて、前記テープ状体の粘着剤層はストライプ
状の如く部分的に設けられたものであり、且つ電
子部品は底面全体が該粘着剤層にて略均等な接着
状態で固定されていることを特徴とする電子部品
搬送体。 An electronic component is placed over the hole of a taping band having a through hole and a feed hole, and an adhesive tape-like body is pasted on the back side of the taping band, and the tape-like body is deformed at the corresponding position of the through-hole. The adhesive layer of the tape-like body is partially provided in a stripe-like manner, and the entire bottom surface of the electronic component is covered with the adhesive layer. An electronic component carrier characterized by being fixed in a substantially uniform adhesive state with an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082084U JPH076120Y2 (en) | 1987-05-28 | 1987-05-28 | Electronic component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082084U JPH076120Y2 (en) | 1987-05-28 | 1987-05-28 | Electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63190076U true JPS63190076U (en) | 1988-12-07 |
| JPH076120Y2 JPH076120Y2 (en) | 1995-02-15 |
Family
ID=30934418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987082084U Expired - Lifetime JPH076120Y2 (en) | 1987-05-28 | 1987-05-28 | Electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH076120Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057199U (en) * | 1983-09-27 | 1985-04-20 | 松下電器産業株式会社 | Taping parts series for chip-shaped electronic parts |
| JPS61110576U (en) * | 1984-12-24 | 1986-07-12 |
-
1987
- 1987-05-28 JP JP1987082084U patent/JPH076120Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057199U (en) * | 1983-09-27 | 1985-04-20 | 松下電器産業株式会社 | Taping parts series for chip-shaped electronic parts |
| JPS61110576U (en) * | 1984-12-24 | 1986-07-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH076120Y2 (en) | 1995-02-15 |