JPH0371637U - - Google Patents

Info

Publication number
JPH0371637U
JPH0371637U JP13229789U JP13229789U JPH0371637U JP H0371637 U JPH0371637 U JP H0371637U JP 13229789 U JP13229789 U JP 13229789U JP 13229789 U JP13229789 U JP 13229789U JP H0371637 U JPH0371637 U JP H0371637U
Authority
JP
Japan
Prior art keywords
carrier tape
film carrier
electronic components
protrusions
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13229789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13229789U priority Critical patent/JPH0371637U/ja
Publication of JPH0371637U publication Critical patent/JPH0371637U/ja
Pending legal-status Critical Current

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  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例1を示すキヤリアテー
プの平面図であり、第2図は本考案の実施例1の
側断面図である。第3図は従来方法でのキヤリア
テープとエンボステープの側断面図、第4図は従
来方法でのリールへの収納図、第5図は実施例2
の側断面図、第6図は実施例3の側断面図である
。 1……フイルムキヤリアテープ、2……凸部、
3……電子部品、4……エンボステープ、5……
リール。
FIG. 1 is a plan view of a carrier tape showing a first embodiment of the present invention, and FIG. 2 is a side sectional view of the first embodiment of the present invention. Figure 3 is a side sectional view of the carrier tape and embossed tape in the conventional method, Figure 4 is a diagram of how they are stored on a reel in the conventional method, and Figure 5 is Example 2.
FIG. 6 is a side sectional view of the third embodiment. 1...Film carrier tape, 2...Protrusion,
3...Electronic parts, 4...Embossed tape, 5...
reel.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品等をフイルムキヤリアテープに実装す
る構造において、フイルムキヤリアテープに前記
電子部品以上の高さの突起を設けた事を特徴とす
るフイルムキヤリアテープ構造。
A film carrier tape structure in which electronic components and the like are mounted on a film carrier tape, characterized in that the film carrier tape is provided with protrusions that are higher than the height of the electronic components.
JP13229789U 1989-11-14 1989-11-14 Pending JPH0371637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13229789U JPH0371637U (en) 1989-11-14 1989-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13229789U JPH0371637U (en) 1989-11-14 1989-11-14

Publications (1)

Publication Number Publication Date
JPH0371637U true JPH0371637U (en) 1991-07-19

Family

ID=31679763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13229789U Pending JPH0371637U (en) 1989-11-14 1989-11-14

Country Status (1)

Country Link
JP (1) JPH0371637U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024155A1 (en) * 2008-08-28 2010-03-04 シャープ株式会社 Method for packing tab tape and structure for packing tab tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024155A1 (en) * 2008-08-28 2010-03-04 シャープ株式会社 Method for packing tab tape and structure for packing tab tape
JP2010052774A (en) * 2008-08-28 2010-03-11 Sharp Corp Method of packing tab tape and packing structure of tab tape

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