JPS63199969U - - Google Patents
Info
- Publication number
- JPS63199969U JPS63199969U JP9002387U JP9002387U JPS63199969U JP S63199969 U JPS63199969 U JP S63199969U JP 9002387 U JP9002387 U JP 9002387U JP 9002387 U JP9002387 U JP 9002387U JP S63199969 U JPS63199969 U JP S63199969U
- Authority
- JP
- Japan
- Prior art keywords
- perforations
- tape
- strip
- adhesive layer
- shaped substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
Description
第１図は本考案の実施を示す部分斜視図、第２
図Ａ及び第２図Ｂは本考案における部品の取り外
し状態の実例を示す説明図である。
１……テープ状物、１０……剥離フイルム、１
１……接着剤層、２……帯状基体、２０……透孔
、２１……送り孔。
Fig. 1 is a partial perspective view showing the implementation of the present invention;
Figures A and 2B are explanatory diagrams showing examples of parts removed in the present invention. 1... Tape-like material, 10... Peeling film, 1
DESCRIPTION OF SYMBOLS 1... Adhesive layer, 2... Strip-shaped substrate, 20... Through hole, 21... Feed hole.
Claims (1)
ープ状物が、透孔と送り孔とを長さ方向に列設し
てなる帯状基体の裏面側に前記送り孔を覆わない
ように貼り合されている電子部品用搬送体。 A tape-like material having an adhesive layer provided on the surface of a release film is bonded to the back side of a strip-shaped substrate having through holes and perforations arranged in a row in the length direction so as not to cover the perforations. Conveyor for electronic parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002387U JPS63199969U (en) | 1987-06-11 | 1987-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002387U JPS63199969U (en) | 1987-06-11 | 1987-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199969U true JPS63199969U (en) | 1988-12-22 |
Family
ID=30949526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9002387U Pending JPS63199969U (en) | 1987-06-11 | 1987-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199969U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (en) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | Electronic part assembly |
-
1987
- 1987-06-11 JP JP9002387U patent/JPS63199969U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (en) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | Electronic part assembly |
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