JPS5811245U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5811245U
JPS5811245U JP10518581U JP10518581U JPS5811245U JP S5811245 U JPS5811245 U JP S5811245U JP 10518581 U JP10518581 U JP 10518581U JP 10518581 U JP10518581 U JP 10518581U JP S5811245 U JPS5811245 U JP S5811245U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
fixed part
semiconductor element
semiconductor
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10518581U
Other languages
Japanese (ja)
Inventor
赤瀬　一豊
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10518581U priority Critical patent/JPS5811245U/en
Publication of JPS5811245U publication Critical patent/JPS5811245U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは半導体素子とリードフレームとをダー　　イ
ボンデイングするために対向させた状態の断面図、同図
すはグイボンディング後の断面図である。 第２図ａは半導体素子に硬化剤（又は主剤）を塗布する
前の関係を示す断面図、同図すは塗布時の断面図である
。FIG. 1a is a cross-sectional view of a semiconductor element and a lead frame in a state where they face each other for die bonding, and the same figure is a cross-sectional view after die bonding. FIG. 2a is a cross-sectional view showing the relationship before applying a curing agent (or main agent) to a semiconductor element, and the same figure is a cross-sectional view during application.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子裏面と該素子の固着部とに夫々接着剤の硬化
剤と有機性樹脂剤とを分けて塗布し、前記半導体素子を
前記固着部に貼り合わせたことを特徴とする半導体装置
。1. A semiconductor device, characterized in that a curing agent of an adhesive and an organic resin agent are separately applied to the back surface of a semiconductor element and a fixed part of the element, respectively, and the semiconductor element is bonded to the fixed part.
JP10518581U 1981-07-15 1981-07-15 semiconductor equipment Pending JPS5811245U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10518581U JPS5811245U (en) 1981-07-15 1981-07-15 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10518581U JPS5811245U (en) 1981-07-15 1981-07-15 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5811245U true JPS5811245U (en) 1983-01-25

Family

ID=29899729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10518581U Pending JPS5811245U (en) 1981-07-15 1981-07-15 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5811245U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254439A (en) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト Method of fixing electronic device on board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254439A (en) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト Method of fixing electronic device on board

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