WO2011092809A1

WO2011092809A1 - Ultrasonic bonding method and ultrasonic bonding device

Info

Publication number: WO2011092809A1
Application number: PCT/JP2010/051061
Authority: WO
Inventors: 俊夫八木原; 誠小玉; 正康戸来
Original assignee: 株式会社コグコフ; Ｅｓｂ株式会社
Priority date: 2010-01-27
Filing date: 2010-01-27
Publication date: 2011-08-04

Abstract

As the weight, thickness, and size of a portable electronic device are reduced, a conventional method for bonding a FPC to a circuit board using a connector and/or solder, ACF, NCF, etc., is not reasonable because the component cost is high, the number of mounting processes is large, the mounting time is long, the mounting temperature is high, the bonding thrust is high, the bonding resistance is large, and the repair property is low in the conventional method. The bonding operation for a lightweight, thin, and small electronic device can be realized at a low cost, a small number of processes, a short period of time, a low temperature, a low load, a low resistance, and a high repair property, because a heating ultrasonic horn shaped like a projected blade having a tip perpendicular to the vibration direction and a section perpendicular to the pressing surface, is disposed so that the heating ultrasonic horn is vibrated in a direction parallel to the bonding surface and the electrode direction; the electrodes of the FPC and the circuit are metal-bonded by overlapping the electrodes before heating and vibrating the electrodes while a predetermined pressure is vertically applied to the bonding surface; and the FPC and the PCB are bonded using resin.

Description

Ultrasonic bonding method and ultrasonic bonding apparatus

The present invention relates to an ultrasonic bonding method and an ultrasonic bonding apparatus, and relates to a method for connecting electrodes of a printed circuit board (hereinafter referred to as FPC), at least one of which is flexible, using ultrasonic waves, and an apparatus using the same. Is.

Recent electronic devices, particularly portable electronic devices, are becoming lighter, thinner, and smaller, while the number of wires at the junction is increasing. For this reason, the existing bonding method between the FPC and the PCB has a limit for increasing the bonding density.

Here, the above PCB is a substrate on the other side to which the FPC is bonded. The substrate is, for example, an FPC, a rigid flexible printed circuit board (hereinafter referred to as RFC), a rigid printed circuit board (hereinafter referred to as RPC), a ceramic printed circuit board, a film liquid crystal substrate, a touch panel substrate, or a sheet. It is a switch board.

As a measure to limit the density of bonding, a method of mounting components on the FPC and the same structure as the FPC suitable for it, all components are mounted on the surface, and then folded to form a compact mounting form. The RFC etc. which completed this and raised the mounting density are also developed. However, since there is no joint in this method, the productivity is remarkably inferior to the method of providing the joint due to the reliability of individual mounting components and the reliability of the individual mounting methods.

For this reason, it is expected that the production form in which PCBs and parts are produced and inspected independently, finally joined by FPC, etc., and integrated and completed will be maintained in the future.

In addition, for example, in the method of using a connector for joining, if the pitch is not 0.3 mm or more, disconnection, misalignment, incorrect insertion, etc. occur during the process from manufacture to assembly, so the connector arrangement space is large compared to other methods. Necessary. The thickness of the connector is about 1 mm. Therefore, in a portable electronic device, if a connector is used, the thickness of the final product cannot be reduced and the weight cannot be ignored. In addition to the high cost of the connector, the mounting of the connector requires a large number of processes before joining, and the mounting cost is high.

Also, for example, in the method using solder for bonding, stable production from manufacturing to assembly cannot be secured unless the pitch is 0.5 mm or more due to short circuit, poor connection, or the necessity of flux removal. For this reason, the method using solder is more advantageous than the connector in terms of weight, thickness, and mounting cost, but on the other hand, soldering at a high temperature is necessary, and there are many restrictions on the thermal design near the joint, and the layout area It is difficult to make small. In addition, as lead and flux are avoided from environmental considerations, the bonding temperature increases further, and the thermal design and component placement near the joint is difficult, which hinders the miniaturization of the final product.

For example, a method using an anisotropic conductive film (hereinafter referred to as ACF) or a non-conductive film (hereinafter referred to as NCF) for bonding is capable of a pitch of 0.3 mm or less, and has recently attracted attention rapidly. This method using ACF or NCF has advantages over solder in weight and thickness, and has the advantage that the arrangement area is about half, but the temperature, time, and stress for bonding are much larger than solder. For this reason, there are many restrictions on thermal design and substrate design, and the unit cost of NCF / NCP is high, so the place of use is limited.

In order to solve the above problems, there is a method of joining a thermoplastic resin as disclosed in Patent Document 1 by generating heat by ultrasonic vibration. However, because this method generates heat, it needs to vibrate for several tens of seconds with an amplitude of several tens of μm from the upper surface of the joint. Therefore, the FPC is broken, the PCB is broken, and the PCB or RPC has a high density. Since the mounted parts are easily destroyed, they are not widely used as production means.

Also, in order to reduce the destruction of FPC, a method of applying vibration from the lateral direction of the joint as in Patent Document 2 and Patent Document 3 has been devised. However, since these methods are simply methods for metal bonding of the metal of the electrode by ultrasonic vibration, the peel strength is lower than the method using a resin. For example, in the electrode structure required in the market, the thickness of the nickel plating that prevents gold from being eroded by copper, which is the base metal of the electrode, is about 4 μm, and further prevents surface oxidation, and When the gold plating thickness for lowering the bonding resistance is 0.05 μm or less, the surface hardness of nickel is very high compared to HV220 and copper or gold. Since the interface is detached and sufficient bonding strength cannot be obtained, it is not widely used as a production means.

Further, since the tip shape of the ultrasonic horn of Patent Document 3 is wavy, even if the load is increased, the tip of the ultrasonic horn bites into the surface of the FPC, so that the apparent load area received by the FPC from the ultrasonic horn is reduced. Because the actual pressure receiving area increases, the load per unit area decreases, the electrode cannot be pressurized sufficiently, it cannot be plastically deformed, the bonding force becomes weak, and the bonding force is not stable Contains the problem.

JP-A-4-18697 JP 2005-223054 A JP 2006-24590 A WO2008 / 018160 JP 2006-156813 A

Here, the ultrasonic horn as in Patent Document 4 is provided with a heater, and the above-described excitation = is achieved by sharing the roles of solid-phase metal bonding by ultrasonic waves, promotion of plastic deformation by heating, and heating of the resin. A method has been devised in which FPC and RPC are bonded with high strength at a lower temperature and in a shorter time than heating methods and resin-free bonding.

However, with this method, the ease of resin discharge must be taken into consideration, and the electrode pitch, which is usually 1.5 to 2 times the electrode thickness, is 3 to 4 times. If it becomes necessary and the electrode pitch is narrowed in the future, the production management of the electrode becomes difficult.

From the above, the plating structure and shape of the electrode satisfy the current market demand as shown above, while electrical bonding ensures solid-phase bonding between the electrodes, mechanical bonding strength is a method using resin It is to provide a bonding method satisfying the same strength.

In the heating and direct pressure ultrasonic horn as in Patent Document 5, the tool for holding the electronic component is changed to hold the FPC instead of the electronic component, and the tip width is 0.001 to 0.5 mm. A heating type ultrasonic horn characterized in that the tip shape is orthogonal to the vibration direction and the cross-sectional shape is a convex groove type blade shape perpendicular to the pressing surface is parallel to the bonding surface and with respect to the electrode direction. However, the electrodes are arranged so that they are vibrated in a parallel direction, and the FPC and circuit electrodes are overlapped, a load is applied perpendicularly to the joint surface with a predetermined pressure, and then the electrodes are heated and vibrated. This is solved by bonding the FPC and the PCB using a resin.

The convex groove type blades according to claim 1 are arranged in a plurality of columns, one row, a plurality of rows, or a plurality of rows, and a plurality of rows on the electrode × 1 column, or 1 row × multiple columns, or a plurality of rows. X It is solved by obtaining a high joint strength with a lower load by joining at a plurality of positions.

In carrying out

Claims

1 and 2, the joining positions are moved relative to each other, and joining is carried out at a position of a plurality of rows x one row, or one row x a plurality of rows, or a plurality of rows x a plurality of rows on the electrode. In addition, it can be solved by obtaining a high bonding strength with a lower load.

At the time of carrying out Claim 1, Claim 2 or Claim 4, the resin is preliminarily disposed in an area of about half of the joining area and the amount of the joining volume before joining, and the FPC and the circuit electrode are overlapped and then predetermined. By applying a load perpendicular to the bonding surface with the pressure of, and then applying vibration and heating, the metal bonding of the electrode where the resin was not placed and the resin was heated to melt between the electrodes By providing a time difference to flow and joining the metal, it is not necessary to discharge the resin from between the electrodes even if the resin is arranged in advance, so that the adhesion between the FPC and the PCB and the bonding between the electrodes can be compatible even at a low load. Solved.

When carrying out claim 1, claim 2 or claim 4, a liquid room temperature curable resin, anaerobic curable resin, moisture curable resin, etc. are poured from the end surfaces of the electrodes after metal bonding between the electrodes, thereby resin from between the electrodes. Therefore, it is possible to solve both the adhesion between the FPC and the PCB and the bonding between the electrodes even at a low load.

When implementing Claim 1, Claim 2 or Claim 4, a liquid UV curable resin is poured from the end face of the FPC or PCB after metal bonding between the electrodes, and further UV irradiation is performed to discharge the resin from between the electrodes. Since there is no need, both the adhesion of the FPC and the PCB and the bonding of the electrodes can be solved even with a low load.

In claim 3 or claim 5, even if the ultrasonic horn is worn or a resin adheres to the ultrasonic horn and becomes dirty, a polishing grindstone, a paper file, a wrap film, etc. are applied to the ultrasonic horn while applying a load. Since the life of the ultrasonic horn is extended by vibrating the ultrasonic horn and performing planar polishing of the ultrasonic horn, the problem of running cost and the problem of soiling the horn by using a resin are solved.

It is considered that the joining method of applying vibration from the transverse direction by longitudinal vibration while applying a load from the direction perpendicular to the pressing surface consists of the transition of the following four phases (hereinafter referred to as PHASE).

"PHASE1"
When a vibration is applied from the lateral direction while applying a load from the direction perpendicular to the pressure surface, the vibration of the ultrasonic horn causes the FPC and PCB to move relative to each other in parallel, causing local heat generation due to local adhesion and destruction. This heat generation promotes softening of the electrode surface. Further, the electrodes grind each other's surface to remove the oxide film and oil components and expose the new surface. It should be noted that when observing the cross section of the joint, it was possible to observe a shaving-like metal lump on both sides of the joint and the temperature of the joint using an ultra-small thermocouple. This was considered because the temperature rose rapidly in the initial stage.

"PHASE2"
Adhesion of the exposed new surface progresses, the relative movement of FPC and PCB decreases, and heat generation is reduced. Furthermore, the temperature of the joint rapidly decreases due to the relative movement of the ultrasonic horn and the FPC surface. This is considered from the fact that “when the temperature of the joint is measured using an ultra-small thermocouple, the temperature rapidly increases at the initial stage of vibration, but then rapidly decreases”.

"PHASE3"
As the relative movement between the ultrasonic horn and the FPC surface increased, the exposed joint of the newly-born surface was vibrated from the lateral direction while receiving a load from the direction perpendicular to the joint surface. The oscillating motion is centered on the part, and an alternating load is received centering on the adhesion part, so that plastic deformation progresses and the joint part expands. In addition, this was considered from the fact that “a layered joint trace can be observed when the joint is peeled and the joint trace is observed”.

Here, in FIG. 3, reference numeral 10a denotes a knurl-shaped (pyramid-shaped) ultrasonic horn. When this was prototyped and the peel strength was compared with that of a convex groove-shaped ultrasonic horn by the above method, Joining with the shape (pyramid shape) ultrasonic horn 10a has the result that the peel strength is lower than that of a convex groove type blade-shaped ultrasonic horn despite the presence of indentations on the FPC surface or PCB electrode surface. Obtained. From this, it was considered that “the relative motion between the PHASE 2 and the PHASE 3 is required on the surfaces of the ultrasonic horn and the FPC to increase the bonding strength”.

"PHASE4"
As the actual bonding area of the bonded portion increases, the stress on the electrode surface due to the load decreases, and plastic deformation does not progress. This was considered from the experimental result that “the bonding strength does not increase even if the vibration is applied for a certain time or longer”.

In addition, as a result of experiments, it was found that when the ultrasonic horn or anvil is heated in the above, the bonding time is shortened. This was considered because the yield point (proof stress) of the metal material was lowered due to heating.

Next, in the above-described knurl-shaped (pyramid-shaped) ultrasonic horn 10a, when the load of the load means 13 is increased, the size of the impression on the FPC surface increases as the load increases. An experimental result was obtained that the size of the indentation on the surface of 4 hardly changed.

In the following calculation, in the wedge-shaped ultrasonic horn having a length γ having an angle θ ° from the direction perpendicular to the bonding surface, the area β increases when the biting amount α of the horn tip into the resin or metal electrode increases. Β = γ × α (1-Sinθ), and in the case of a knurl-shaped ultrasonic horn, when the biting amount α of the horn tip into the resin or metal electrode increases, the area β becomes β = (α × ( 1-Sinθ)) ^ 2. For this reason, in the case of an ultrasonic horn shape having a cross section that is not perpendicular to the joint surface such as a knurled (pyramid), wedge, or corrugated surface, “the hardness and thickness of the FPC substrate even if the load is increased As a result, the actual pressure receiving area on the FPC side increases more than the apparent pressure area on the ultrasonic horn side, so that the stress decreases or becomes saturated.

Metals are deformed in proportion to the stress in the elastic deformation region, but when they enter the plastic deformation state beyond the yield point (proof stress), they begin to deform at an accelerated rate without being proportional to the stress. However, if the joint area increases even if the load is increased, the stress will not be proportional to the load. Even if the load is increased, the yield point (proof stress) cannot be exceeded. It will come off and as a result, the bonding strength will decrease. " As a result of the experiment, the joint strength of the knurl type (pyramid type) ultrasonic horn was “saturated” at a lower value than that of the convex blade type ultrasonic horn, so this consideration was supported. .

By the way, when the stress is increased, the solid-phase bonding strength is “saturated” when there is no breakage in the electrode or substrate, and the bonding strength of the plating surface or the metal on the plating and plating base. It is known to saturate at the lower value of the bond strength of.
As described above, in the present invention, even if the load is changed, the pressure receiving area does not change. Therefore, it is possible to provide a joining method in which the stress is proportional to the load.

Next, the material, thickness, hardness, longitudinal elastic modulus of the base metal of the joining metal, and if the surface is plated, the material, thickness, hardness, longitudinal elastic modulus of the plating, The treatment method and state of the surface, the material, thickness, hardness, longitudinal elastic modulus of the resin that is the base material of the FPC, the treatment method and state of the surface, the material of the ultrasonic horn, The thickness dimension of the convex blade at the tip of the ultrasonic horn, which is the most important in the present invention, cannot be defined unconditionally due to processing limitations due to the characteristics of the material.

However, the relationship between the cross-sectional shape of the tip, the amplitude of the ultrasonic horn and the stress applied to the metal electrode through the FPC substrate can be theoretically confirmed by a simplified model. A theoretical model is used to summarize how the relationship between the shape and the amplitude of the ultrasonic horn is related to the thickness dimension of the tip.

Fig. 7 is a list of theoretical models that summarize the relationship between cross-sectional shape and amplitude. 6 (a) and 6 (b) are legends excerpting 131a and 131b in FIG. 7. The a series composed of 111a, 112a, 113a, and 135a in FIG. It is a "static stress" graph, the horizontal scale is in units of the amplitude of the ultrasonic horn, and the vertical scale is in units of stress in which the downward direction is positive. In addition, the b series composed of 111b, 112b, 113b, and 135b is a “stress sum” graph obtained by adding the stress due to the load and the weight when the ultrasonic horn moves, and the horizontal scale indicates the amplitude of the ultrasonic horn. The vertical scale is in units of stress with the downward direction being positive.

In addition, when the load portion length is 0.5 times the amplitude of the ultrasonic horn, the one series composed of 111a, 111b, 121a, and 131b is composed of the two series composed of 111a, 111b, 121a,. When the part length is 1 times the amplitude of the ultrasonic horn, the three series consisting of 113a, 113b, 123a, 133b are 114a, 114b, 124a, when the load part length is twice the amplitude of the ultrasonic horn. When the load section length is three times the amplitude of the ultrasonic horn, the four series composed of 134b has a load section length of 5 of the amplitude of the ultrasonic horn. If it is double, it is a model list.

Furthermore, when the cross-sectional shape of the ultrasonic horn of the 10 series composed of 111a, 111b, 112a, 115b is a triangle, the cross-sectional shape of the ultrasonic horn of the 20 series composed of 121a, 121b, 122a,. In the case of a trapezoid, the 30 series composed of 131a, 131b, 132a, and 135b is a model list in the case where the cross-sectional shape of the ultrasonic horn is a square. In FIG. 7, a thin solid line drawn in each figure of the a series indicates a position where the amplitude length has been moved.

Fig. 8 (a) is a comparison table of the maximum stresses of the b series in Fig. 7, and the unit is 100% for each one series. FIG. 8B is a comparison table of the stress sums of the b series in FIG. 7, and the unit is 100% for each one series. FIG. 8C is a comparison table of the maximum values of the rate of change of the stress sum, and the unit is 100% for each one series. FIG. 8D is a comparison table of the minimum values of the rate of change of the sum of stress, and the unit is 100% for each one series.

The a series is an ideal stress distribution graph in a static state in which the ultrasonic horn is pressed against the FPC, and the load portion length is proportional to the pressurizing area if the length of the ultrasonic horn is the same. Furthermore, if the load is the same, the stress is considered to be the same in all models. The b series is an ideal stress sum distribution graph in which the load from the position at which the ultrasonic horn is pressed against the FPC to the position at which the amplitude length is moved and the stress that has changed due to the pulling are added.

Here, the maximum acceleration of an ultrasonic wave having a period of 40 kHz and an amplitude of 3 μm is the vibration equation x = Asin (ωT): (x: position · A: amplitude = 0.003 mm · ω: frequency = 40,000 Hz · T: Substituting −1 = sin (ωT) from −1 <= sin (ωT) <= 1 into α = −Aω ^ 2 sin (ωT) :( α: acceleration) obtained by second-order integration of time) with T Since the huge acceleration of α = 4,800 g and the action time = 1 / 40,000 seconds, the movement is instantaneous, so the change in stress during the movement can be ignored. When the ultrasonic horn moves, the stressed part becomes positive (positive downward), and the part where the load is applied is extracted and the stress becomes negative.

Since the maximum height of the b-series graph is the maximum stress when the ultrasonic horn is moved, the stress scale is summarized as a unit. Fig. 8 (a) "Comparison table of maximum stress: 1 series 100%" become that way. From this table, it was found that if the ultrasonic horn had a square cross section, that is, a cross section perpendicular to the pressing surface, the maximum stress was stable even if the amplitude changed. Further, one series, that is, “ultrasonic horn length = amplitude × 0.5” and two series, that is, “ultrasonic horn length × 1 = amplitude”, and three series, that is, “ultrasonic horn length”. If “× 2 = amplitude”, it was found that the maximum stress was stable in all cross-sectional shapes.

In the b series graph, the area between the graph and the stress axis is the sum of the stress received when the ultrasonic horn is moved. Fig. 8 (b) "Stress sum comparison table: 1 series: 100%". From this table, the cross-sectional shape of the ultrasonic horn is quadrangular, that is, the cross-sectional shape perpendicular to the pressing surface is proportional to the proportion of the load received even if the amplitude is changed if it is 1 or more times. I understood. From this table, if one series, that is, “ultrasonic horn length = amplitude × 0.5” and two series, ie, “ultrasonic horn length = amplitude × 1”, all cross-sectional shapes are stable. I found out that

In the b series graph, the slope of the graph represents the rate of change of the stress. When the amplitude and the scale of the stress are calculated as a unit and put together, the maximum value is shown in FIG. The maximum value comparison table unit: 1 series 100% ", and the minimum value is as shown in Fig. 8 (d) Stress sum change rate minimum value comparison unit: 1 series 100%. From these tables, it was found that if the cross-sectional shape of the ultrasonic horn is a square, that is, a cross-sectional shape perpendicular to the pressing surface, the degree of change in stress when the amplitude changes is stable. Further, from this table, it was found that all cross-sectional shapes were stable except for two series, that is, “ultrasonic horn length = amplitude × 2”.

In summary, all the ultrasonic horn shapes are stable in one series, that is, “ultrasonic horn length amplitude × 0.5” and two series, that is, “ultrasonic horn length = amplitude × 1 ". Further, it was found that if the cross-sectional shape is a quadrangle, that is, a cross-sectional shape perpendicular to the pressing surface, it is stable even if the amplitude changes. Therefore, the present invention can provide a joining method in which the joining force is stable even if the amplitude changes, because the sectional shape of the ultrasonic horn is a quadrangle, that is, a sectional shape perpendicular to the pressing surface.

In addition, the present invention provides a joining method in which the tip shape of an ultrasonic horn is formed into a convex groove type blade shape and arranged in a plurality of rows so that a joining strength several times that of one row can be obtained in a single joining process. it can.

Similarly, the present invention can provide a bonding method and apparatus that can obtain a bonding strength several times that of a single bonding because the bonding position by the ultrasonic horn is relatively moved each time and bonded many times. Theoretically, it is possible to bond N times (N = overlap length / ultrasonic amplitude) times obtained by dividing the overlapping length of the joining portion of FIG. 21 by the ultrasonic amplitude, so that N times the strength can be obtained. Can do.

Furthermore, since the tip shape of the ultrasonic horn is a convex-blade blade shape in the present invention, the bonding area does not change even if the ultrasonic horn bites into the resin that is the FPC base material.

Furthermore, the present invention can provide a bonding method and apparatus that reduce stress on the PCB and facilitates stress design and stress management of the PCB because the bonding stress is locally concentrated even at a low load.

Thus, the convex groove type blade shape, dimensions and arrangement of the heating ultrasonic horn according to the present invention have a stable pressure receiving area and a stable stress concentration. In addition, the degree of concentration is increased, and the plastic deformation of the metal surface is accelerated at an accelerated rate by heating. Therefore, it was confirmed in the experiment that the electrode surface can be joined with other than gold (for example, silver, tin, and aluminum).

Next, even if the resin is pre-arranged over the entire surface of the bonding area, the FPC and the circuit electrodes are overlapped, and a load is applied perpendicularly to the bonding surface at a predetermined pressure, heating and vibration are applied. If the resin is not sufficiently heated, the resin is not discharged from between the electrodes, and the metal bonding of the electrodes is hindered, resulting in a case where the resistance is high or there is no conduction. Therefore, in this method of arranging in advance on the entire surface, the bonding time between the FPC and the PCB becomes longer and the load for bonding and adhesion becomes larger than in the case where only the electrodes are solid-phase bonded. Therefore, in the present invention, the resin is disposed in advance in an amount required to fill the gap portion of the joining portion with a length of about 30% to 50% of the joining length of the joining surface, and the FPC and circuit electrodes. When a load is applied perpendicularly to the bonding surface with a certain pressure after applying a certain amount of pressure, and then vibration and heating are performed, the metal bonding of the electrode where the resin has not been placed is completed first, and then the resin Is heated to melt and flow between the electrodes, so that it is possible to provide a joining method and apparatus for joining the FPC and the PCB with substantially the same time and load as the metal joining method.

After metal bonding of electrodes, when liquid room-temperature curable resin, anaerobic curable resin, hygroscopic curable resin, etc. with low viscosity are poured from the end surfaces of the electrodes after metal bonding between the electrodes, the FPC and the bonded electrodes are connected by capillary action. And filling the void formed by PCB. Thereafter, if left at room temperature, the resin is solidified, that is, the FPC and the PCB are bonded without hindering metal bonding of the electrodes.

In addition, when the adhesive is a capillary phenomenon and is filled in the gap formed by FPC and PCB and their electrodes, intermolecular force works between FPC and PCB, and in this state, the volume is difficult to change. Since there is a destructive force, a pseudo-adhesive force works even before solidification. Therefore, in the present invention, a strong adhesive force is generated until a complete adhesive force is generated, that is, until it is completely solidified, as compared with the case of solid-phase metal bonding alone. It is possible to provide a bonding method and apparatus in which separation does not occur until the process.

In the present invention, even when a liquid UV curable resin is used as the resin, an adhesive force that is also difficult to peel off is generated by movement between the processes, so that the UV irradiation process, which is a subsequent process of the present invention, is peeled off. It is possible to provide a safe joining method. Similarly, in the present invention, even when a liquid thermosetting resin or a thermoplastic resin is used as the resin, an adhesive force that is also difficult to peel off is generated by movement between processes. It is possible to provide a bonding method and apparatus that do not peel until a certain heating step.

It should be noted that in order to increase the penetrating power by capillarity or increase the adhesive strength, it is effective to wash the surface with isopropanol before joining to remove oil or dust on the surface, or to modify the surface by plasma discharge.

Since the heating type ultrasonic bonding by vibration from the lateral direction is solid phase bonding as described above, the present invention can provide a bonding method having a lower bonding resistance than fusion bonding. Moreover, since the removal of the oxide film and oil film on the surface is mechanically performed by vibration from the lateral direction, the present invention can provide a bonding method and apparatus that do not require electrode cleaning. Furthermore, since solid-phase bonding by lateral vibration causes very little change in the shape of the electrode surface, in the present invention, even if the FPC once bonded is peeled off and bonded again, both bonding strength and bonding resistance deteriorate. Can provide no joining method.

In the present invention, since the shape of the electrode is a simple shape as usual, it is not necessary to consider the resin flow, and it is possible to provide a joining method in which the PCB electrode pitch is narrow as usual.

In the present invention, since the tip shape of the ultrasonic horn is simple, even if the ultrasonic horn is worn, it can be reused by simply polishing the joint surface. Therefore, this can provide a joining method with a low running cost of the ultrasonic horn. Further, in the present invention, even if the ultrasonic horn is worn, it is possible to polish the joining surface of the ultrasonic horn by polishing the ultrasonic horn while applying a polishing grindstone or the like. Accordingly, this makes it possible to provide a joining method and apparatus that facilitates removal of dirt and that has a low running cost of the ultrasonic horn.

Electrode plating structure and dimensions can be narrowed to meet current market requirements, and electrical bonding ensures solid-state bonding between electrodes, while mechanical bonding strength is the same as resin-based methods A bonding method satisfying the strength can be provided.

It is a perspective view which shows the ultrasonic connection apparatus of FPC. It is a perspective view which shows how to overlap FPC and PCB, an electrode direction, a load direction, and a vibration direction. It is the perspective view which reversed the Naru form ultrasonic horn, the load direction, and the vibration direction from the lower surface. (A) is the perspective view which reversed the convex blade shape 1 row ultrasonic horn from the lower surface, and (b) is the perspective view which reversed the convex blade shape 3 row ultrasonic horn from the lower surface. And (c) is a perspective view of the convex blade-shaped single-row ultrasonic horn inverted from the lower surface, and (d) is the convex blade-shaped single-row ultrasonic horn inverted from the lower surface. It is the perspective view seen, and (e) is the perspective view which reversed the convex blade shape 3 row 1 row ultrasonic horn from the lower surface, and was seen. (A) is the perspective view which reversed and saw the convex blade shape 3 row 3 row ultrasonic horn from the lower surface, (b) is the arrow X figure of figure (a), (c) is a figure ( It is an arrow Y view of a). (A) is a legend of the static stress distribution graph of FIG. 7, and (b) is a legend of the stress sum distribution graph of FIG. It is a list of theoretical models that summarize the relationship between cross-sectional shape and amplitude. (A) is the b series maximum stress comparison table of FIG. 7, and the unit is 100% for each one series. (B) is a comparison table of the stress sums of the b series in FIG. 7, and the unit is 100% for each one series. (C) is a comparison table of the maximum values of the rate of change of the stress sum, and the unit is 100% for each one series. (D) is a comparison table of the minimum values of the rate of change of the stress sum, and the unit is 100% for each one series. (A) is a front view which shows the joining position before performing the relative movement of a convex blade-shaped ultrasonic horn, (b) performs the relative movement of a convex blade-shaped ultrasonic horn, FIG. It is a front view which shows the position which has joined next. FIG. 6A is a side view showing a bonding position before the relative movement of the convex blade-shaped ultrasonic horn, and FIG. 6B shows the relative movement of the convex blade-shaped ultrasonic horn. It is a side view which shows the position which has joined next. (A) is a front view showing the state before joining, in which resin is arranged on the entire surface of the PCB, (b) is a front view showing the middle of joining and bonding, which is the next stage of (a), (c) [FIG. 4] It is a front view which shows the state after joining and adhesion | attachment which is the next step of (b). (A) is the front view which shows the state before joining which arrange | positioned resin whose area is about half to PCB in the joint part center vicinity, (b) is the next step of (a), in the middle of joining and adhesion | attachment (C) is a front view showing a state after joining and bonding, which is the next stage of (b). (A) is a front view showing the state before joining, in which a resin having an area of about half of the PCB is arranged near the center of the joint, and (b) is the next stage of (a), the first stage of joining / bonding It is a front view which shows the step of (b), (c) is a front view which shows the step in the middle of joining and adhesion | attachment which is the next step of (b), (d) is the next step of (c). It is a front view which shows the last step of joining and adhesion | attachment. (A) is a front view showing a state before bonding, in which a resin having an area of about 1/3 is arranged in the vicinity of the PCB end surface on the PCB, and (b) is the next stage of (a), which is a bonding / adhesion step. It is a front view which shows the middle, (c) is a front view which shows the state after joining and adhesion | attachment which is the next step of (b). (A) is a front view showing a state before bonding, in which a resin having an area of about 1/3 is arranged in the vicinity of the PCB end surface on the PCB, and (b) is the next stage of (a), which is a bonding / adhesion step. It is a front view which shows the first stage, (c) is a front view which shows the stage in the middle of joining and adhesion | attachment which is the next stage of (b), (d) is the next stage of (c). It is a front view which shows a certain last stage of joining and adhesion | attachment. It is a perspective view which shows the middle of pouring resin from an end surface after joining FPC and PCB. It is a side view which shows the state before grind | polishing an ultrasonic horn in a present state. It is a side view which shows the middle of grinding | polishing the ultrasonic horn in a present state. It is a top view which shows an FPC alignment hole. It is a top view which shows a PCB alignment mark. It is a top view which shows the state which accumulated the PCB alignment mark. It is a perspective view which shows the positioning method with the fixed CCD camera of FPC and PCB. It is a perspective view which shows the positioning method by the movable CCD camera of FPC and PCB. It is a top view which shows a FPC positioning hole. It is a top view which shows a PCB positioning hole. It is a perspective view which shows the positioning method by the pin of FPC and PCB.

This example is an example of claim 1. Each part will be described in detail below with reference to FIGS. FIG. 2 is a perspective view showing how the FPC and the PCB are overlapped, the electrode direction, the load direction, and the vibration direction. In FIG. 2, 1 is an FPC, 1a is an FPC base material made of a resin such as polyimide (trade name) or pet (trade name), 2 is a conductive metal such as gold, silver or copper, or soldered on the surface thereof. FPC electrodes provided on the FPC 1 subjected to plating, tin plating, gold plating, etc., 3 is a PCB, 3a is a resin such as polyvinyl chloride, bakelite, fiber, polyimide (trade name), pet (trade name), PCB substrate made of ceramics and glass, 4 is a conductive metal such as gold, silver, copper, or PCB electrode provided on PCB 3 on which solder plating, tin plating, gold plating or the like is further applied, 6a, 7a Is an alignment mark provided for positioning described later.

FIG. 4 (a) is a perspective view of the convex blade-shaped single-row ultrasonic horn according to the present invention as seen from the lower surface showing the shape, load direction, vibration direction, and electrode direction. Reference numeral 10b denotes a convex blade shape single row ultrasonic horn. Similarly, 10c shown in FIG. 4 (b) is a convex blade-shaped three-row ultrasonic horn. 10d shown in FIG.4 (c) is a convex blade shape 1 row 1 row ultrasonic horn. Reference numeral 10e shown in FIG. 4 (d) denotes a convex blade-shaped three-row single-row ultrasonic horn. Reference numeral 10f shown in FIG. 4 (e) denotes a convex blade-shaped one-row, three-row ultrasonic horn. 10g shown in FIG.4 (g) is a convex-blade shape 3 row | line | column ultrasonic horn.

FIG. 5 (b) is a side view as seen from the direction of the arrow x in FIG. 5 (a), and is a side view arranged so that the load direction is from bottom to top. Wy is the length of the portion of the ultrasonic horn where the convex blade is provided, B is the length of the convex blade of the ultrasonic horn, and Py is the pitch distance when multiple convex blades are arranged. Indicates. FIG.5 (c) is the figure seen from the arrow y direction of Fig.5 (a), and is the front view arrange | positioned so that a load direction may be from the bottom to the top. Wx is the width of the portion of the ultrasonic horn where the convex blades are provided, T is the thickness of the convex blades of the ultrasonic horn, and Px is the pitch distance when multiple rows of convex blades are arranged. .

The minimum value of the thickness T at the tip of the ultrasonic horn is considered to be sufficient if it is one time the amplitude of the ultrasonic horn based on the above theoretical model. Here, since the amplitude of the ultrasonic horn currently used in the experiment is 3 μm, it should be 0.003 mm. However, in the future, the oscillation frequency will be increased, and on the contrary, the amplitude will be further reduced, and the FPC1 due to ultrasonic vibration will be reduced. Since it is planned that it is necessary to suppress damage to the PCB 3 and the components mounted on the surface and inside thereof, the minimum value of the thickness T at the tip of the ultrasonic horn is set to 0.001 mm.

Next, it is considered that the maximum value of the thickness T at the tip of the ultrasonic horn is sufficient to be one time the amplitude of the ultrasonic horn from the above-mentioned theoretical model. However, in actuality, the material, thickness T, hardness, longitudinal elastic modulus of the base metal of the joining metal, and if the surface is plated, the material, thickness, hardness, longitudinal elastic modulus of the plating, Furthermore, the processing method and state of the surface, further, the material, thickness, hardness, and longitudinal elastic modulus of the resin that is the base material of the FPC, and further the condition of the joining member such as the processing method and state of the surface, In addition, based on the results of experiments so far, the limits of processing from the material of the ultrasonic horn and the characteristics of the materials, the number of wires, the thickness of the wires, the control limits of the load control device, etc. .5mm is required. In summary, the thickness T of the tip of the ultrasonic horn is 0.001 to 0.5 mm.

And the height H of the tip of the ultrasonic horn cannot be determined at all because the thickness of the FPC substrate 1a is as wide as several tens to several hundreds μm depending on the application. However, as will be described later, when the resin is heated and melted, the heat radiation and the radiant heat are very important, so the height H of the tip of the ultrasonic horn is as much as possible in consideration of the thickness and material of the FPC substrate 1a. However, it is determined each time with a dimension that does not contact the FPC 1 except for the tip of the ultrasonic horn during joining.

This example is an example of claim 2. As described in the first embodiment, the thickness T of the ultrasonic horn tip can be determined. Even if the necessary load can be determined, the allowable stress of the PCB 3 may be exceeded depending on the conditions of the joining member. In this case, for example, the shape of the convex blade-shaped three-row ultrasonic horn 10g receives the reaction force from the “FPC” base material 3a rather than the shape of the convex blade-shaped three-row ultrasonic horn 10c. Since it is difficult, the load can be reduced. However, since the number of lines depends on the number of wires, it is actually 1 to several tens, not several, and sometimes several hundreds. The number of columns also depends on the allowable stress of the PCB. , In some cases, hundreds.

Conversely, if the allowable stress of the PCB 3 is sufficiently large, for example, the shape of the convex blade-shaped three-row ultrasonic horn 10c is simpler than the shape of the convex blade-shaped three-row ultrasonic horn 10g. The manufacturing cost of the ultrasonic horn 10 is reduced. As described above, since the number of columns and the number of strips cannot be uniquely determined, they are determined each time in the above conditions.

In the present embodiment, in carrying out

claims

1 and 2, solid-phase metal bonding, which is the core of the present invention, is an ultrasonic bonding apparatus having a load means, a vibration means, and a heating means. This is an embodiment of the third aspect of the invention. In addition, the example in the case of performing resin bonding together is the implementation in the case of aligning FPC and PCB in Example 5, Example 6, Example 7, Example 8, Example 9, and Example 10. Examples will be described in detail in Example 12, Example 13, and Example 14.

Hereinafter, each part will be described in detail with reference to FIG. 1, FIG. 4 (b), and FIG. FIG. 22 is a perspective view showing an embodiment of the present invention, excerpted from FIG. 1. In FIG. 22, 20 is an anvil having means for adsorbing and fixing

PCB

3, and 20 a is a PCB provided on the anvil 20. Fixing suction hole, 20b is an FPC fixing suction hole provided in the

anvil

20, 21 is an anvil heater for heating the anvil, 1 is an FPC, 1a is an FPC base material made of an insulating material of the

FPC

1, 2 Is an FPC electrode which is an electric circuit formed on the

FPC substrate

1a, 6a is two pairs of FPC alignment holes provided in the

FPC substrate

1a, 3 is a PCB, 3a is made of an insulating material of this PCB3 The PCB substrate 4 is a PCB electrode which is an electric circuit formed on the

PCB substrate

3a, and 7a is two pairs of PCB alignment marks provided on the PCB substrate 3a.

FIG. 4B is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn as viewed from the bottom, and 10c is the convex blade-shaped three-row super horn of the present invention. It is a sonic horn.
However, since the number of columns depends on the allowable stress of the PCB, it is actually not only 3 but 1 to several tens, and in some cases several hundreds.

FIG. 1 is a perspective view showing the configuration of the entire apparatus. In FIG. 1, 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown), and 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like. And 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like, and 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.

25 is a Y-axis stage fixed to the main body (not shown) with a screw, 24 is an X-axis stage fixed to the Y-axis stage with a screw, and 23 is fixed to the X-axis stage with a screw. A θ-axis stage, 22 is a load sensor fixed to the θ-axis stage with a screw or the like, 20 is an anvil fixed to the load sensor 22 with a screw or the like, and 21 is fixed to the anvil 20 with a screw or the like. There is an anvil heater.

70 is a control device, 71 is an ultrasonic transmitter that vibrates the ultrasonic horn 10c by the

ultrasonic vibrator

12, 72 is compared with a predetermined ultimate load by the load sensor 22, and holds a predetermined load. A load control device 73a for controlling the load means 13 includes a temperature measuring body (not shown) such as a thermocouple in which the temperature of the ultrasonic horn 10 heated by the ultrasonic horn heater 11 is fixed to the ultrasonic horn with a screw or the like. An ultrasonic horn temperature adjusting device 73b that performs feedback control using a temperature sensor (not shown) such as a thermocouple in which the temperature of the anvil 20 heated by the anvil heater 21 is fixed to the anvil with a screw or the like is fed back. An anvil temperature control device to be controlled.

76a is an FPC adsorption sensor provided in the FPC holding / supplying unit 50, which is provided in a piping path to the negative pressure generator (not shown) for adsorbing and fixing the FPC1, and confirming the adsorption of the FPC1. 76b is an FPC adsorption sensor provided in the anvil 20 for confirming the adsorption of the FPC 1 provided in the piping path from the adsorption fixing hole 20a in FIG. 22 for adsorbing and fixing the FPC 1 to the negative pressure generator (not shown). 76c is a PCB adsorption sensor provided on the anvil 20 for confirming the adsorption of the PCB 3 provided in the piping path from the adsorption fixing hole (not shown) for adsorbing and fixing the PCB 3 to the negative pressure generator (not shown). is there. A position control device 77 controls the moving speed and position of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25.

Hereinafter, the steps of this embodiment will be described with reference to FIGS. First, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. The FPC 1 is placed on the FPC 1 and the PCB 3 with the FPC electrode 2 facing downward by the FPC holding / supply means 50. Under the control of the control device 70, the FPC 1 is suctioned and fixed to the anvil 20 by making the FPC fixing suction hole 20 b negative pressure, the negative pressure of the FPC holding / supply means 50 is released, and the FPC 1 is supplied to the anvil 20. .

When the FPC suction sensor 76b and the PCB suction sensor 76c confirm the suction, the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77. That is, the anvil 20 and the FPC 1 and the PCB 3 that are adsorbed and fixed to the anvil 20 are moved directly below the ultrasonic horn 10c (hereinafter referred to as a joining position).

In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface. The load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load.

After pressurization and heating for a predetermined time, the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded. After the vibration is performed for a predetermined time, the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this PCB 3 joined to is moved to the original position (hereinafter referred to as supply / removal position). In response to the movement completion signal from the position control device 77, the control device 70 stops the adsorption of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 bonded thereto, thereby completing the solid-phase metal bonding step.

In the present embodiment, in order to reduce the load on the PCB while increasing the stress at the joint portion of the solid-phase metal joint that is the core of the present invention, The embodiment of claim 4 and claim 5, wherein the area is reduced and the joining position is moved relative to each other, and a plurality of rows on the electrode, or a plurality of rows, or a plurality of rows are implemented a plurality of times. . In addition, the example in the case of performing resin bonding together is the implementation in the case of aligning FPC and PCB in Example 5, Example 6, Example 7, Example 8, Example 9, and Example 10. Examples will be described in detail in Example 12, Example 13, and Example 14.

Hereinafter, each part will be described in detail with reference to FIG. 1, FIG. 4 (e), FIG. 9, and FIG. FIG. 22 is a perspective view showing an embodiment of the present invention, which is a part of FIG. In FIG. 22, 20 is an anvil having means for adsorbing and fixing PCB3, 20a is an adsorbing hole for fixing PCB on the

anvil

20, 20b is an adsorbing hole for fixing FPC on the

anvil

20, and 21 is for heating the anvil. Anvil heater, 1 is an FPC, 1a is an FPC base that is a base made of an insulating material of the

FPC

1, 2 is an FPC electrode that is an electric circuit formed on the

FPC base

1a, and 6a is an FPC base 1a Are two pairs of FPC alignment holes, 3 is a PCB, 3a is a PCB substrate made of an insulating material of this PCB3, and 4 is an electric circuit formed on the PCB substrate 3a. PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a.

FIG. 4 (e) is a perspective view showing the shape, load direction, and vibration direction of a convex blade-shaped single-row, three-row ultrasonic horn as seen from the bottom. 10f is a convex blade shape 1 row 3 row ultrasonic horn among this invention. However, since the number of rows depends on the allowable stress of the PCB, it is actually 1 to several tens, not several, and several hundreds in some cases. Further, since the number of stripes also depends on the number of wirings to be connected, it is actually 1 to several tens instead of three, and sometimes several hundreds.

FIG. 9A is a front view showing the joining position before the relative movement of the convex blade-shaped ultrasonic horn, 10f is a convex blade-shaped one-row, three-row ultrasonic horn, and 11 is a convex shape. An ultrasonic horn heater that heats the blade-shaped single-row, three-row ultrasonic horn 10f, and 12 is a vibrator that vibrates the convex blade-shaped single-row, three-row ultrasonic horn 10f. FIG. 9B is a front view showing a position where the convex blade-shaped ultrasonic horn is relatively moved, and the next joining position in FIG. 9A. FIG. It is a side view which shows the position which has joined before performing relative movement of a sound wave horn. FIG. 10B is a side view showing a position where the convex blade-shaped ultrasonic horn is relatively moved and next to FIG. 10A.

25 is a Y-axis stage fixed to the main body (not shown) with a screw, 24 is an X-axis stage fixed to the Y-axis stage with a screw, and 23 is fixed to the X-axis stage with a screw. A θ-axis stage 22 is a load sensor fixed to the θ-axis stage with a screw or the like, and 20 is an anvil fixed to the load sensor 20 with a screw or the like. An anvil heater 21 is fixed to the anvil with a screw or the like.

ultrasonic vibrator

12, 72 is compared with a predetermined ultimate load by the load sensor 22, and holds a predetermined load. A weight control device for controlling the load means 13,
73a is an ultrasonic horn temperature adjustment in which the temperature of the ultrasonic horn 10 heated by the ultrasonic horn heater 11 is feedback-controlled using a thermometer (not shown) such as a thermocouple fixed to the ultrasonic horn with a screw or the like. A device 73b is an anvil temperature adjusting device that feedback-controls the temperature of the anvil 20 heated by the anvil heater 21 using a temperature measuring body (not shown) such as a thermocouple fixed to the anvil with a screw or the like.

76b is an FPC adsorption sensor provided in the anvil 20 for confirming the adsorption of the FPC 1 provided in the piping path from the adsorption fixing hole 20a in FIG. 22 for adsorbing and fixing the FPC 1 to the negative pressure generator (not shown). Reference numeral 76c denotes a PCB adsorption sensor provided in the anvil 20 for confirming the adsorption of the PCB provided in the piping path from the PCB adsorption fixing hole 20a for adsorbing and fixing the PCB 3 to the negative pressure generator (not shown). A position control device 77 controls the moving speed and position of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25.

Hereinafter, the steps of the present embodiment will be described with reference to FIGS. 1, 9, 10, and 22. First, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. The FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

When the FPC suction sensor 76b and the PCB suction sensor 76c confirm the suction, the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved by the command from the control device 70 to the position control device 77, that is, The anvil 20 and the FPC 1 and PCB 3 adsorbed and fixed to the anvil 20 are moved directly below the ultrasonic horn 10c.

In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface. The load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. FIG. 9A is a front view showing this state, and FIG. 10A is a side view showing this state.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this Is moved to the next bonding position in the Y direction. FIG. 9A is a front view showing this state, and FIG. 10B is a side view showing this state.
The above pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this PCB3 joined to is moved to the next joining position in the X direction. FIG. 9B is a front view showing this state, and FIG. 10A is a side view showing this state.

The above-described pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised. The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this Is moved to the next bonding position in the -Y direction. FIG. 9B is a front view showing this state, and FIG. 10B is a side view showing this state. The above relative movement is repeated a predetermined number of times, and when the final joining position is reached, the above pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position. In response to the movement completion signal from the position control device 77, the control device 70 stops the adsorption on the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 bonded thereto, thereby completing the solid-phase metal bonding step.

Assuming that the number of wirings is 3 and the maximum allowable force of the PCB is 3 rows, the productivity, the load received by the PCB, and the manufacturing cost of the ultrasonic horn 10 are compared as follows. The productivity is highest for the convex blade shape three-row ultrasonic horn 10c and the convex blade shape three-row ultrasonic horn 10g. In summary, the order is as follows.

Convex blade shape 3-row ultrasonic horn 10c = Convex blade shape 3-row ultrasonic horn 10g> Convex blade shape 1-row ultrasonic horn 10b = Convex blade shape 3-row ultrasonic horn 10e = Convex shape Blade shape 1 row 1 row ultrasonic horn 10f> Convex blade shape 1 row 1 row ultrasonic horn 10d
Further, when the stress received by the PCB is compared, the convex blade shape three-row ultrasonic horn 10c> is the largest. In summary, the order is as follows.

Convex blade shape 3 row ultrasonic horn 10c> Convex blade shape 3 row 3 ultrasonic horn 10g> Convex blade shape 1 row ultrasonic horn 10b> Convex blade shape 3 row 1 ultrasonic horn 10e = convex type Blade shape 1 row 1 row ultrasonic horn 10f> Convex blade shape 1 row 1 row ultrasonic horn 10d
Furthermore, when the manufacturing cost of the ultrasonic horn 10 is compared, the convex blade shape single-row ultrasonic horn 10b is the smallest. In summary, the order is as follows.

Convex blade shape 1 row ultrasonic horn 10b> Convex blade shape 1 row 1 ultrasonic horn 10d> Convex blade shape 3 row ultrasonic horn 10c> Convex blade shape 3 row 1 ultrasonic horn 10e = convex type Blade shape 1 row 3 row ultrasonic horn 10f> Convex blade shape 3 row 3 row ultrasonic horn 10g
As described above, there is no unique rule for the combination of the number of columns and the number of lines, and the actual number of lines depends on the number of wirings, so it is actually 1 to several tens instead of 3, and sometimes several hundreds. Since the number of columns also depends on the allowable stress of the PCB, it is actually 1 to several tens instead of three, and sometimes several hundreds. Therefore, since the number of columns and the number of strips cannot be determined uniquely, they are determined each time in the above conditions.

In the present embodiment, in carrying out

claims

1, 2, and 4, the resin is preliminarily disposed on the entire surface of the joining surface with a certain thickness on the FPC 1, and the electrodes of the FPC 1 and the PCB 3 are overlapped. The resin is heated by applying a load to the bonding surface with the pressure of, the resin is discharged from the bonding surface, and the electrode of the bonding surface from which the resin has been discharged by vibrating is subjected to solid-phase metal bonding, and further heated. The molten resin is melt-flowed between the electrodes, and as a result, the gap is filled and the FPC 1 and the PCB 3 are bonded. This method of placing the resin between the FPC 1 and the PCB before bonding and bonding and bonding is a known method.

Hereinafter, each part will be described in detail with reference to FIG. 1, FIG. 4 (b), and FIG. First, FIG. 1 is a perspective view showing the configuration of the entire apparatus. In FIG. 1, 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown), and 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like. And 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like, and 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.

25 is a Y-axis stage fixed to the main body (not shown) with a screw, 24 is an X-axis stage fixed to the Y-axis stage with a screw, and 23 is fixed to the X-axis stage with a screw. A θ-axis stage, 22 is a load sensor fixed to the θ-axis stage with a screw or the like, 20 is an anvil fixed to the load sensor 20 with a screw or the like, and 77 is a θ-axis stage 23 and an X-axis stage 24. And a position control device for controlling the moving speed and position of the Y-axis stage 25.

Next, FIG. 4 (b) is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn, as seen from the bottom, and 10c is a convex blade-shaped three-row supersonic horn. It is a sonic horn.

Further, FIG. 11A is a front view showing a state before resin is preliminarily disposed on the entire surface of the PCB of this embodiment and bonded and bonded, and FIG. 11B is a front view showing the middle of bonding and bonding. FIG. 11 (c) is a front view showing the state after bonding and joining.

In FIG. 11, 1a is an FPC substrate, 2 is an FPC electrode formed in advance on the

FPC substrate

1a, 3a is a PCB substrate, 4 is a PCB electrode formed in advance on the PCB electrode, and 5 is an FPC1 and PCB3. A resin to be bonded.

Hereinafter, the steps of the present embodiment will be described with reference to FIGS. 1, 4 (b), 11 and 22. First, the resin 5 is placed in advance on the entire bonding surface of the PCB 3 with a certain thickness before bonding, and then the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20. Further, the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved directly below the ultrasonic horn 10c. This is the state of FIG. 11A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.

In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10c. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface. The load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. This is the state of FIG.

The resin is melted by heat transfer and radiant heat of the ultrasonic horn heater 11c heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure. The discharged resins are FPC1 and PCB3. Through the gap formed by the FPC electrode 2 and the PCB electrode 4 and discharged from both end faces of the FPC 1 and the PCB 3. This is the state of FIG.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position. In response to the movement completion signal from the position control device 77, the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.

The resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying.

In the above embodiment, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 are the same in terms of the joining effect.

In the present embodiment, when the first, second and fourth aspects are carried out, the resin is applied to the joint surface of the FPC 1 at a length which is ½ of the joint length, and the FPC electrode 2 and the PCB at the joint portion. An amount sufficient to fill the gap formed by the electrode 4 is placed in advance near the center of the joining length, and the FPC and the circuit electrode are overlapped, and then a load is applied in a direction perpendicular to the joining surface with a predetermined pressure. By applying vibration and heating while applying pressure, there is a time difference between the solid-phase metal bonding timing of the electrode where the resin is not disposed and the timing at which the resin is heated and melted and flows between the electrodes. It is an Example of Claim 6 joined and adhere | attached, without inhibiting a phase metal joining.

Furthermore, FIG. 12A is a front view showing the state before bonding / bonding a resin having a half area to the PCB of this embodiment, which is arranged near the center of the bonding portion, and FIG. FIG. 12C is a front view showing the state after bonding and joining. In FIG. 12, 1a is an FPC substrate, 2 is an FPC electrode formed in advance on the

FPC substrate

Hereinafter, the steps of the present embodiment will be described with reference to FIGS. 1, 4 (b), 12, and 22. First, the resin 5 having a length of about ½ of the joining length is arranged in advance near the center of the joint portion of the joint surface of the PCB 3. Next, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Further, the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved directly below the ultrasonic horn 10c. This is the state of FIG. 12A, but the figure illustrates the state in which the resin 5 is disposed on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.

In the present invention, if a constant load is maintained, as the joining process proceeds, the stress decreases as the joining area increases, and the deformation due to joining does not proceed as described above. Therefore, since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .

In the present embodiment, when the first, second and fourth aspects are carried out, the resin is applied to the joint surface of the FPC 1 at a length which is ½ of the joint length, and the FPC electrode 2 and the PCB at the joint portion. An amount sufficient to fill the gap formed by the electrode 4 is placed in advance near the center of the joining length, and the FPC and the circuit electrode are overlapped, and then a load is applied in a direction perpendicular to the joining surface with a predetermined pressure. By applying vibration and heating while applying pressure, there is a time difference between the solid-phase metal bonding timing of the electrode where the resin is not disposed and the timing at which the resin is heated and melted and flows between the electrodes. This is an embodiment different from the above-described embodiment in which bonding and adhesion are performed without hindering phase metal bonding.

Hereinafter, each part will be described in detail with reference to FIG. 1, FIG. 4 (a), and FIG. First, FIG. 1 is a perspective view showing the configuration of the entire apparatus. In FIG. 1, 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown), and 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like. And 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like, and 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.

Next, FIG. 4A is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped single-row ultrasonic horn as viewed from the bottom, and 10b is a convex blade-shaped single row. It is a sonic horn.

FIG. 13A is a front view showing a state before joining, in which a resin having a half area is arranged in the vicinity of the center of the joint on the PCB of this embodiment, and FIG. 13B is a first stage of joining / bonding. FIG. 13C is a front view showing a stage in the middle of joining / bonding, and FIG. 13D is a front view showing the last stage of joining / bonding. In FIG. 13, 1a is an FPC substrate, 2 is an FPC electrode formed in advance on the

FPC substrate

Hereinafter, the steps of this embodiment will be described with reference to FIGS. 1, 4A, 13 and 22. FIG. First, the resin 5 is arranged in advance near the center of the joint portion of the joint surface of the PCB 3 before joining. Next, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20. Further, the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b. This is the state of FIG. 13A, but the figure illustrates the state where the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.

In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10b along the vertical movement guide (not shown) using the load means 13, and moves the FPC1 and PCB3 to the ultrasonic horn 10b. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface. The load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. After performing pressurization and heating for a predetermined time, the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 b is vibrated by the ultrasonic vibrator 12. By the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.

After performing the excitation for a predetermined time, the oscillation of the ultrasonic transmitter 71 is stopped by the instruction of the control device 70, and the excitation of the ultrasonic horn 10b by the ultrasonic vibrator 12 is stopped. The ultrasonic horn 10b is raised along the vertical movement guide (not shown) using the load means 13 according to the command of the control device 70 after the vibration is stopped, and the first joining process is completed.

Next, the FPC 1 and the PCB 3 bonded thereto are moved to the next bonding position. When this movement is completed, the ultrasonic horn 10b is lowered in the same manner as described above, and a load is applied to the bonding surface to apply pressure. Further, the ultrasonic horn 10b is oscillated. By the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.

The vibration is performed for a predetermined time, and after the vibration of the ultrasonic horn 10b is stopped, the ultrasonic horn 10b is raised, and the joining process in the middle is completed. Next, the FPC 1 and the PCB 3 bonded thereto are moved to the final bonding position. When this movement is completed, the ultrasonic horn 10b is lowered in the same manner as described above, and a pressure is applied to the joint surface while applying a load. The resin is melted by heat transfer and radiation heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure. The discharged resins are FPC1 and PCB3. And the gap between the FPC 1 and the PCB 3 is filled through the gap formed by the FPC electrode 2 and the PCB electrode 4. This is the state of FIG.

After pressurizing and heating for a predetermined time, the ultrasonic horn 10b is vibrated. Due to the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded. After performing the vibration for a predetermined time, the ultrasonic horn 10b is raised, and the final joining process is completed. Next, the FPC 1 and the PCB 3 joined thereto are moved to their original positions. In response to the movement completion signal from the position control device 77, the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.

The resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying.
Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.

In the present embodiment, when the first, second, and fourth embodiments are carried out, the resin is applied to the joint surface of the FPC 1 with a length of 1/3 of the joint length, and the FPC electrode 2 and the PCB at the joint portion. Arrange the FPC and the circuit electrodes in advance in the vicinity of the PCB end face of the joint in an amount increased to fill the gap formed by the electrode 4 and in an amount increased for the purpose of forming a fillet on the joint end face. Then, by applying vibration and heating while applying a load in a direction perpendicular to the bonding surface at a predetermined pressure, the timing of solid-phase metal bonding of the electrode where the resin was not disposed, and the resin is heated, The embodiment according to claim 6, wherein a time difference is generated in the timing of melting and flowing between them, and bonding and adhesion are performed without hindering solid-phase metal bonding.

Further, FIG. 14A is a front view showing a state before joining, in which a resin having a length of 1/3 of the joining length is disposed in the vicinity of the end face of the PCB on the joining surface of the PCB of the present embodiment. FIG. 14B is a front view showing the middle of bonding / bonding, and FIG. 14C is a front view showing the state after bonding / bonding. In FIG. 14, 1a is an FPC substrate, 2 is an FPC electrode formed in advance on the

FPC substrate

Hereinafter, the steps of this embodiment will be described with reference to FIGS. 1, 4A, 14 and 22. FIG. First, the resin 5 having about 1/3 of the joining length is placed in advance on the joining surface of the PCB 3 and in the vicinity of the end surface before joining. Next, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20. Further, the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b. This is the state of FIG. 14A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.

In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10b along the vertical movement guide (not shown) using the load means 13, and moves the FPC1 and PCB3 to the ultrasonic horn 10b. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface. The load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. This is the state of FIG.

The resin is melted by heat transfer and radiant heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure. The discharged resins are FPC1 and PCB3. And fills the gap between the FPC 1 and the PCB 3 through the gap formed by the FPC electrode 2 and the PCB electrode 4 and is discharged from the end face side of the PCB 3 to form a fillet. This is the state of FIG.

In the present embodiment, when the first, second, and fourth embodiments are carried out, the resin is applied to the joint surface of the FPC 1 with a length of 1/3 of the joint length, and the FPC electrode 2 and the PCB at the joint portion. Arrange the FPC and the circuit electrodes in advance in the vicinity of the PCB end face of the joint in an amount increased to fill the gap formed by the electrode 4 and in an amount increased for the purpose of forming a fillet on the joint end face. Then, by applying vibration and heating while applying a load in a direction perpendicular to the bonding surface at a predetermined pressure, the timing of solid-phase metal bonding of the electrode where the resin was not disposed, and the resin is heated, This is another embodiment different from the above-described embodiment of the present invention, in which a time difference is generated in the timing of melting and flowing between them, and the solid-phase metal bonding is bonded and bonded without hindering.

Further, FIG. 15A is a front view showing the state before joining, in which a resin having a length of about 1/3 of the joining surface is arranged in the vicinity of the end surface of the PCB, and FIG. FIG. 15C is a front view showing a first stage of joining / bonding, FIG. 15C is a front view showing a stage in the middle of joining / bonding, and FIG. 15D is a front view showing the last stage of joining / bonding. FIG. In FIG. 15, 1a is an FPC substrate, 2 is an FPC electrode formed in advance on the

FPC substrate

Hereinafter, the steps of the present embodiment will be described with reference to FIGS. 1, 4A, 15 and 22. First, the resin 5 is arranged in advance on the bonding surface of the PCB 3 before bonding and in the vicinity of the end surface. Next, the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward. Under the control of the control device 70, the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20. Further, the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b. This is the state of FIG. 15A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.

After the excitation is performed for a predetermined time, the oscillation of the ultrasonic transmitter 71 is stopped by an instruction from the control device 70, and the excitation of the ultrasonic horn 10b by the ultrasonic vibrator 12 is stopped. The ultrasonic horn 10b is raised along the vertical movement guide (not shown) using the load means 13 according to the command of the control device 70 after the vibration is stopped, and the first joining process is completed.

The vibration is performed for a predetermined time, and after the vibration of the ultrasonic horn 10b is stopped, the ultrasonic horn 10b is raised, and the joining process in the middle is completed. Next, the FPC 1 and the PCB 3 bonded thereto are moved to the final bonding position. When this movement is completed, the ultrasonic horn 10b is lowered in the same manner as described above, and a pressure is applied to the joint surface while applying a load.

The resin is melted by heat transfer and radiation heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure. The discharged resin passes through a gap formed by the FPC1, PCB3, FPC electrode 2 and PCB electrode 4, fills the gap between the FPC1 and PCB3, and is discharged from the end face side of the PCB3 to form a fillet. This is the state of FIG.

In the present embodiment, in carrying out

claims

1, 2, and 4, if resin is applied before bonding, the resin is discharged more between the electrodes than when only solid phase metal bonding is performed without resin. 8. The FPC and the circuit board are bonded without interfering with the solid-phase metal bonding of the electrodes by pouring resin from the end face of the terminal after solid-phase metal bonding between the electrodes based on the experimental result that a load is required. And an embodiment of claim 8.

Hereinafter, each part will be described in detail with reference to FIGS. FIG. 16 is a perspective view illustrating a state in which a resin is being applied after the FPC 1 and the PCB 3 are joined. In FIG. 16, 1a is an FPC substrate, 2 is an FPC electrode, 3a is a PCB substrate, 4 is a PCB electrode, and 5 is a liquid resin.

In FIG. 1, 25 is a Y-axis stage fixed to the main body (not shown) with screws, 24 is an X-axis stage fixed to the Y-axis stage with screws, and 23 is screwed to the X-axis stage. A fixed θ-axis stage, 22 is a load sensor fixed to the θ-axis stage with screws or the like, 20 is an anvil fixed to the load sensor 20 with screws or the like, and 77 denotes a θ-axis stage 23. This is a position control device that controls the moving speed and position of the X-axis stage 24 and the Y-axis stage 25.

32 is a syringe holding / up-and-down means, which is fixed to a main body (not shown) independent of the movement of the anvil 20 with a screw or the like. A syringe 31 is fixed to the syringe holding / up-and-down means 32 with a screw or the like, and a needle 30 is fixed to the syringe 31 with a screw or the like. The tip of the needle 31 does not hinder the movement of the FPC 1 or PCB 3 on the anvil 20 or the anvil 20 in the movement region formed by the movement of the anvil 20 with the θ-axis stage 23, the X-axis stage 24 and the Y-axis stage 25. In addition, the ultrasonic horn 10 is disposed at a position that does not interfere with the joining and positioning / supply / removal steps. 74 is a resin discharge control device that controls the amount of liquid discharged from the tip of the needle 32 by the liquid resin stored in the syringe 31.

1 and 16 will be used to explain the process when the present invention is implemented. First, after completion of the solid-phase metal bonding step, the FPC 1 and PCB 3 after bonding, which are adsorbed and fixed on the anvil 20 and moved together with the anvil 20, are the end faces of the FPC 1 provided in advance under the needle 30. The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved to a predetermined position (hereinafter referred to as a resin discharge start position) by the control of the position control device 77 according to a command from the control device 70. Complete.

Position control device 77 sends a positioning completion signal to control device 70, and based on this signal, control device 70 lowers syringe holding / up and down means 32, syringe 31, and needle 30. However, at this time, the needle 30 is separated from the end face of the FPC 1 and the upper surface of the PCB 3 by a distance (0.1 mm or more) that does not prevent relative movement in the horizontal plane. Does not come into contact with FPC1 or PCB3.

Further, when the lowering is completed, the control device 70 sends a command to the resin discharge control device 74 and starts discharging the liquid resin stored in the syringe 31 from the tip of the needle 32. Further, when the discharge is started, a resin discharge in-process signal from the resin discharge control device 74 is sent to the control device 70. Based on this signal, the control device 70 is opposite to the resin discharge start position of the FPC 1 from the resin discharge start position. The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved to a predetermined position on the side (hereinafter referred to as a resin discharge end position) at a predetermined speed by the speed control of the position control device 77, and resin discharge is performed. When the end position is reached, the position control device 77 stops moving.

When the stop of the movement is completed, a positioning completion signal is sent to the control device 70, and based on this signal, the control device 70 sends a command to the resin discharge control device 74 and the liquid resin stored in the syringe 31 of the needle 32. Stops resin discharge from the tip. When the stop of the resin discharge is completed, a resin discharge stop completion signal is sent from the resin discharge control device 74 to the control device 70, and the control device 70 raises the syringe holding / up-and-down means 32 to a predetermined position. Thus, the resin application process is completed.

Further, when it is necessary to apply the resin completely, that is, when the resin is disposed in advance, for example, in Examples 12, 10, and 11, which will be described later, the PCB electrode 4 of the PCB 3 faces up and is fixed to the anvil 20. If it is this apparatus configuration, it can be realized without adding a control device or a moving means if it is applied between the supply of the FPC 1 or after the positioning of the FPC 1 and the PCB 3.
Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.

In this embodiment, when the first, second, fourth, sixth, seventh and eighth aspects of the present invention are carried out, the ultrasonic horn is worn or a resin or the like is attached to the ultrasonic horn. If it becomes dirty, it is applied to a polishing grindstone, a paper file, a wrap film or the like during the joining standby time, and the ultrasonic horn is vibrated to perform planar polishing or cleaning. This is an example. Below, each part is demonstrated in detail using FIG.17 and FIG.18. FIG. 17 is a side view showing the position of the polishing grindstone immediately before and after the FPC 1 and PCB 3 are joined, that is, at the “joining position”. FIG. 18 is a side view showing the position of the polishing wheel at the FPC 1 take-out / supply position, that is, the “standby position”.

17 and 18, 1 is an FPC, 2 is an FPC electrode, 3 is a PCB, 4 is a PCB electrode, 10 is an ultrasonic horn, 13 is a load means, and 72 is a load control that controls the speed and load of the load means 13. The apparatus, 20 is an anvil, 22 is a load sensor, 23 is a θ-axis stage, 24 is an X-axis stage, 25 is a Y-axis stage, and 77 is a position control device for controlling the moving speed and position thereof.

50 is an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) independent of the movement of the anvil 20 with a screw or the like. ing. Reference numeral 61 denotes a grinding wheel holding means that is fixed to the X-axis stage 24 with a screw or the like and moves together with the X-axis stage 24. The polishing wheel holding means 61 is provided with a polishing load sensor (not shown), and the load is fed back to the load control device 70 during polishing. Reference numeral 60 denotes a polishing wheel fixed to the polishing wheel holding means 61 with a screw or an adhesive. When the X-axis stage 24 moves and moves to the “standby position”, the polishing grindstone 60 fixed to the grindstone holding means 61 is arranged in advance so as to be directly below the ultrasonic horn 10.

17 and 18 will be used to explain the process when the present invention is implemented. When the joining of the FPC 1 and the PCB 3 is completed at the position of FIG. 17, that is, the “joining position”, the X-axis stage 24 moves forward and returns to the FPC 1 take-out / supply position, that is, the “standby position”. The X-axis stage 24 is in this “standby position” during the period from when the FPC 1 and the PCB 3 after joining are taken out and supplied until the positioning is completed.

After the ultrasonic horn 10 is lowered by the load means 13 during the above period, the ultrasonic horn 10 comes into contact with the grinding wheel 60, and it is detected that the grinding wheel load sensor (not shown) has reached a predetermined pressure. The ultrasonic wave horn 10 is vibrated by oscillating the ultrasonic vibrator 12 while the load means 13 continues to apply a load under the control of the load control device 72 that maintains the load. After vibrating for a predetermined time, the oscillation of the ultrasonic vibrator 12 is stopped, the load of the load means 13 is removed, the ultrasonic horn 10 is raised to the original position, and the planar polishing is completed.

This polishing method according to the present invention can be completed within a series of time from take-out / supply / positioning, that is, “standby time”, so that productivity is not lowered. In the above embodiment, the method of lowering the ultrasonic horn 10 and the method of raising the polishing wheel 60 by providing means for moving the polishing wheel holding means 61 in the vertical direction are the same in terms of the bonding effect. .

In addition, in order to prevent the polishing wheel 60 from being reduced, a method of changing the polishing position every time or several times by providing the polishing wheel holding means 61 with a moving means that moves in a horizontal plane is also conceivable. It is the same even if a paper file or a wrap film is used instead of the polishing grindstone 60. Further, a method of polishing the tip of the ultrasonic horn 10 by vibrating the moving means moving on the horizontal surface to the polishing grindstone holding means 61 without oscillating the ultrasonic horn 10 is also conceivable. In addition, a tape-shaped paper file or wrap film is unwound and sent using a bobbin and a take-up bobbin each time on the grinding wheel holding means 61 at a constant pitch, and ultrasonic waves are sent to the sent paper file or wrap film. A method of pressing the horn and then oscillating it can be considered.

In the above embodiment, if a constant load is maintained, the polishing amount is proportional to the polishing time. Therefore, if a timing device such as a timer is combined with a polishing wheel holding means 61 that can hold a constant load, a polishing wheel load sensor ( (No figure) is not an essential condition.

This embodiment is an embodiment according to claim 11 and claim 12 in which the FPC and the PCB are simply positioned in carrying out

claims

1, 2, and 4. Compared to Example 14 described later, this method uses the θ-axis stage 23, the X-axis stage 24, the Y-axis stage 25 of FIG. 1 and their positioning control devices 77, the lens 40 of FIG. Since 41 and these image positioning control devices 75 are provided, the device configuration and control configuration are complicated.

However, since there are a plurality of lenses 40 and CCD cameras 41, there is no need to provide moving means, so that the apparatus configuration is simpler than that of Example 13 below. However, since there are restrictions on the dimensions of the lens 40a, the CCD camera 41a and the lens 40b, and the CCD camera 41b, there are also restrictions on the pitches of the FPC alignment holes 6a and the PCB alignment marks 7a.

However, in contrast to the fact that the embodiment 14 described later is a system in which the FPC positioning hole 6b and the positioning pin 20c are brought into contact with each other, since the present invention is a non-contact system, there is no deformation due to the external force of the FPC 1, so positioning with high accuracy is possible. It can be performed. In addition, this invention is a method suitable for the apparatus for automatic work which does not depend on an operator by manual work.

Hereinafter, each part will be described in detail with reference to FIG. 1, FIG. 19, FIG. 20, FIG. In FIG. 1, 1 is an FPC, 3 is a PCB, 25 is a Y-axis stage fixed to the main body (not shown) with screws, 24 is an X-axis stage fixed to the Y-axis stage with screws, 23 Is a θ axis stage fixed to the X axis stage with screws, 22 is a load sensor fixed to the θ axis stage with screws, and 20 is an anvil fixed to the load sensor 20 with screws. , 77 is a position control device for controlling the moving speed and position of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25.

FIG. 19 is a plan view of the FPC. In FIG. 19, 1 is an FPC, 1a is an FPC substrate which is a substrate made of an insulating material of the

FPC

1, 2 is an FPC electrode which is an electric circuit formed on the

FPC substrate

1a, and 6a is an FPC substrate. These are two pairs of FPC alignment holes provided in the material 1a.

FIG. 20 is a plan view of the PCB. In FIG. 20, 3 is a PCB, 3a is a PCB substrate which is a substrate made of this PCB3 insulating material, 4 is a PCB electrode which is an electric circuit formed on the

PCB substrate

3a, and 7a is a PCB substrate. These are two pairs of PCB alignment marks provided on 3a. FIG. 21 is a plan view showing a state in which the FPC 1 is overlaid on the PCB 3.

FIG. 22 is a perspective view showing an embodiment of the present invention, which is a part of FIG. In FIG. 22, 20 is an anvil having means for adsorbing and fixing PCB3, 20a is an adsorbing hole for fixing PCB on the

anvil

20, 20b is an adsorbing hole for fixing FPC on the

anvil

20, and 21 is for heating the anvil. Anvil heater, 1 is an FPC, 1a is an FPC base that is a base made of the insulating material of this

FPC

1, 2 is an FPC electrode that is an electric circuit formed on the

FPC base

1a, 6a is an FPC base 1a Are two pairs of FPC alignment holes, 3 is a PCB, 3a is a PCB substrate made of an insulating material of this PCB3, and 4 is an electric circuit formed on the PCB substrate 3a. PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a.

41a is a means for observing the PCB alignment mark 7a through the FPC alignment hole 6a. A CCD camera 40a fixed to the main body (not shown) with a screw or the like independent of the movement of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 in FIG. Similarly, 41b is a means for observing another PCB alignment mark 7a through another FPC alignment hole 6a, and is a CCD fixed to the main body (not shown) with a screw or the like. A camera 40b is a lens fixed to the CCD camera 41b with a screw or the like. Reference numeral 50 denotes an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) with screws or the like.

Hereafter, the process at the time of implementing this invention is demonstrated using FIG. 1 and FIG. First, the PCB 3 is suction-fixed to the anvil 20 with the PCB electrode 4 facing upward and the PCB 3 suction hole 20 a under a negative pressure under the control of the control device 70. Next, the FPC 1 is attracted and fixed to the FPC supply / holding means 50 with the FPC electrode 2 facing downward.

The FPC supply / holding means 50 moves to a predetermined position where the joint portion of the FPC 1 overlaps the joint portion of the PCB 3. However, at this time, the PCB 3 and the FPC 1 are separated by a distance (about 0.1 mm) that does not hinder the relative movement in the horizontal plane, and the FPC 1 and the PCB 3 are not brought into contact by the relative movement in the horizontal plane. FIG. 22 shows this state.

Next, the image positioning control device 75 in FIG. 1 uses the CCD camera 41a to measure the mutual positional error between the FPC alignment hole 6a and the PCB alignment mark 7a from the upper surface of the FPC 1 through the lens 40a and through the FPC alignment hole 6a. To do. Similarly, the CCD camera 41b is used to measure the mutual positional error of the PCB alignment mark 6a through the lens 40b and another FPC alignment hole 6a from the upper surface of the FPC 1 and also through the other FPC alignment hole 6a.

The θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved by the command of the position control device 78 of FIG. 1 so that these errors are within a predetermined error range, that is, the anvil 20 and its The PCB 3 that is sucked and fixed to the anvil 20 is moved for alignment. After the alignment is completed, the FPC holding / supplying unit 50 is lowered, and when the FPC holding / supplying unit 50 is lowered to a position where the FPC 1 and the PCB 3 come into contact with each other, the FPC 1 comes into contact with the step provided on the anvil 20 and The provided FPC fixing suction hole 20 is closed.

Suction is started from the FPC suction hole 20b provided in the anvil 20, and when the FPC suction sensor 76b confirms the suction of the FPC 1, the FPC 1 is fixed by the FPC holding / supplying means 50 and the FPC holding / supplying means 50 is raised. Thus, the positioning process is completed. After joining, since the FPC1 and PCB3 are joined and integrated, the suction of the FPC suction hole 20b provided in the anvil 20 is released simultaneously with the release of the PCB suction, and the suction fixing of the FPC1 and the PCB3 is released. This completes the removal process. A method of observing the alignment mark of the FPC 1 through the lens 40 provided on the anvil side from the PCB alignment hole provided in the PCB 3 with the CCD 41 is also conceivable.

claims

1, 2, and 4. Compared with the following Example 14, this method is used for positioning the θ-axis stage 23, the X-axis stage 24, the Y-axis stage 25 and their positioning control device 77 in FIG. 1, the lens 40, and the CCD camera 41 in FIG. In addition, since it is necessary to provide the image positioning control device 75, the device configuration and the control configuration are complicated.

Further, since the moving means for the lens 40 and the CCD camera 41 is provided, the apparatus configuration is further complicated as compared to the twelfth embodiment. However, since there is no dimensional restriction by the lens 40 and the CCD camera 41, there is no restriction between the pitches of the FPC alignment holes 6a and the PCB alignment marks 7a. In addition, while the following embodiment 14 is a system in which the FPC positioning hole 6b and the positioning pin 20c are brought into contact with each other, since the present invention is a non-contact system, there is no deformation due to the external force of the FPC 1, so positioning can be performed with high accuracy. It can be carried out. In addition, this invention is a method suitable for the apparatus for automatic work which does not depend on an operator by manual work.

Hereinafter, each part will be described in detail with reference to FIGS. 1, 19, 20, 21, and 23. FIG. In FIG. 1, 1 is an FPC, 3 is a PCB, 25 is a Y-axis stage fixed to the main body (not shown) with screws, 24 is an X-axis stage fixed to the Y-axis stage with screws, 23 Is a θ axis stage fixed to the X axis stage with screws, 22 is a load sensor fixed to the θ axis stage with screws, and 20 is an anvil fixed to the load sensor 20 with screws. , 77 is a position control device for controlling the moving speed and position of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25.

FIG. 19 is a plan view of the FPC. In FIG. 19, 1 is an FPC substrate, 1a is an FPC substrate made of an insulating material of the

FPC

1, and 2 is an electric circuit formed on the FPC substrate 1a. FPC electrodes 6a which are circuits are two pairs of FPC alignment holes provided in the FPC base material 1a. 20 is a plan view of the PCB. In FIG. 20, 3 is a PCB, 3a is a PCB substrate made of an insulating material of the

PCB

3, and 4 is an electric circuit formed on the PCB substrate 3a. The PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a. FIG. 21 is a plan view showing a state in which the FPC 1 is overlaid on the PCB 3.

FIG. 23 is a perspective view showing an embodiment of the present invention, excerpted from a part of FIG. In FIG. 23, 20 is an anvil having means for adsorbing and fixing

PCB

3, and 20 b is an FPC fixing adsorbing hole provided in the anvil 20.

41 is a means for observing the PCB alignment mark 7a through the FPC alignment hole 6a, and is supported by a main body (not shown) independent of the movement of the θ-axis stage 23, the X-axis stage 24, and the Y-axis stage 25 in FIG. The CCD camera 40 having means (not shown) for moving between two pairs of alignment marks formed by the FPC alignment hole 6a and the PCB alignment mark 7a is fixed to the CCD camera 41 with screws or the like. Lens. Reference numeral 50 denotes an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) with screws or the like.

Hereafter, the process at the time of implementing this invention is demonstrated using FIG. 1 and FIG. First, the PCB 3 is suction-fixed to the anvil 20 with the PCB electrode 4 facing upward and the PCB 3 suction hole 20 a under a negative pressure under the control of the control device 70. Next, the FPC 1 is attracted and fixed to the FPC supply / holding means 50 with the FPC electrode 2 facing downward. The FPC supply / holding means 50 moves to a predetermined position where the joint portion of the FPC 1 overlaps the joint portion of the PCB 3. However, at this time, the PCB 3 and the FPC 1 are separated by a distance (about 0.1 mm) that does not hinder the relative movement in the horizontal plane, and the FPC 1 and the PCB 3 are not brought into contact by the relative movement in the horizontal plane. FIG. 23 shows this state.

Next, the image positioning control device 75 in FIG. 1 uses the CCD camera 41 to measure the mutual positional error between the FPC alignment hole 6a and the PCB alignment mark 7a from the upper surface of the FPC 1 through the lens 40 and through the FPC alignment hole 6a. To do. Next, the CCD camera 41 and the lens 40 fixed to the CCD camera 41 are moved to another FPC alignment hole 6a and a position for measuring the mutual position error of the PCB alignment mark 7a through the FPC alignment hole 6a. Measure.

Suction is started from the FPC suction hole 20b provided in the anvil 20, and when the FPC suction sensor 76b confirms the suction of the FPC 1, the FPC 1 is fixed by the FPC holding / supplying means 50 and the FPC holding / supplying means 50 is raised. In addition, the CCD camera 41 and the lens 4 fixed thereto are returned to their original positions, and the positioning process is completed. After joining, since the FPC1 and PCB3 are joined and integrated, the suction of the FPC suction hole 20b provided in the anvil 20 is released simultaneously with the release of the PCB suction, and the suction fixing of the FPC1 and the PCB3 is released. This completes the removal process. A method of observing the alignment mark of the FPC 1 through the lens 40 provided on the anvil side from the PCB alignment hole provided in the PCB 3 with the CCD 41 is also conceivable.

This embodiment is an embodiment different from the above-described embodiments of claim 13 and claim 14 in which the FPC and the PCB are simply positioned when carrying out

claims

1, 2, and 4. According to this method, the θ-axis stage 23, the X-axis stage 24, the Y-axis stage 25 in FIG. 1 and the lenses 40 in FIG. 22 and FIG. Since it is not necessary to provide the CCD camera 41, the apparatus configuration is simplified and the cost of the apparatus is reduced.

Hereinafter, each part will be described in detail with reference to FIGS. 24, 25, and 26. FIG. 24 is a plan view of the FPC. In FIG. 24, 1 is an FPC, 1a is an FPC base material which is a base material made of an insulating material of the

FPC

1, 2 is an FPC electrode which is an electric circuit formed on the

FPC base material

1a, and 6b is an FPC base material. These are two pairs of FPC positioning holes provided in 1a. FIG. 25 is a plan view of the PCB. In FIG. 25, 3 is a PCB, 3a is a PCB substrate which is a substrate made of this PCB3 insulating material, 4 is a PCB electrode which is an electric circuit formed on the

PCB substrate

3a, and 7b is a PCB substrate. These are two pairs of PCB positioning holes provided in 3a. FIG. 26 is a perspective view showing an embodiment of the present invention, which is a part extracted from FIG. In FIG. 26, reference numeral 20 denotes an anvil, and 20c denotes two pairs of positioning pins that are press-fitted and fixed to the anvil 20.

The process when the present invention is carried out will be described with reference to FIG. First, the PCB positioning hole 7b is inserted into the positioning pin 20c fixed to the anvil 20 with the PCB 3 facing the PCB electrode 4 upward. Next, the positioning step is completed by inserting the FPC 1 with the FPC electrode 2 facing down and the FPC positioning hole 6b into the positioning pin 20c fixed to the anvil 20 so that the joint portion overlaps the PCB 3. . After joining, since the FPC 1 and the PCB 3 are joined together, the FPC positioning hole 6b and the PCB positioning hole 7b are simultaneously removed from the positioning pin 20c, thereby completing the taking out process.

As described above, the present invention can be easily positioned, and is suitable for manual work by an operator. However, in the present invention, since the FPC positioning hole 7b is deformed by the positioning pin 20c when the FPC 1 is inserted, there is a risk that the positioning accuracy is lowered. Therefore, the FPC having an electrode pitch of about 0.3 mm is joined. This is a suitable method. In order to compensate for the above disadvantages, the number of FPC positioning holes 6b, PCB positioning holes 7b, and positioning pins 20c may be increased.

In addition, as long as the material of the positioning pin 20c is a material which does not bend easily, a hard metal such as SUS304 or a hard resin such as PEEK (trade name) may be used. Further, the positioning pin 20c may have a cylindrical shape or a prismatic shape. Further, when the press-fitting is weak because the pin diameter is thin, a stepped pin having two or more different diameter portions, a thin diameter portion and a thick diameter portion, may be used. Moreover, if it is the shape of the stepped pin, the fixing method can be other than press-fitting, and may be fixed with a screw or the like instead of press-fitting. Further, if means for moving the positioning pin 20c up and down relative to the anvil 20 is provided and the positioning pin 20c is submerged below the surface of the anvil 20, the joined PCB 3 and FPC 1 can be easily pulled out of the pin. Can do.

Since the bonding process is performed at a low temperature for a short time, the FPC base material does not need to be a heat-resistant resin such as polyimide, and therefore a cheap resin such as PET can be used as the base material. In addition to the above characteristics, since the load is low, for example, if the electrode can be coated with gold, silver, aluminum or the like, it can be used for bonding to a film liquid crystal panel or touch panel whose base material is PET. Also, it can be used for bonding to a liquid crystal panel, plasma display, or organic EL whose base material is glass if the electrode can be coated with gold, silver, aluminum, or the like. In addition, since there is no three-dimensional part such as a connector at the joint, it can be considered that it contributes to the realization of a wearable computer or the like in combination with the film liquid crystal, RFC, sheet switch or the like.

1 FPC
1a FPC base material 2 FPC electrode 3 PCB
3a PCB base material 4 PCB electrode 5 Resin 5a Liquid resin 6a FPC alignment hole (alignment mark)
6b FPC positioning hole 7a FPC alignment hole (alignment mark)
7b PCB positioning hole 10 Ultrasonic horn 10a Knurl (pyramid) shaped ultrasonic horn 10b Convex blade shape 1 row ultrasonic horn 10c Convex blade shape 3 row ultrasonic horn 10d Convex blade shape 1 row 1 row ultrasonic horn 10e Convex blade shape 1 row 3 row ultrasonic horn 10f Convex blade shape 3 row 3 row ultrasonic horn 11 Ultrasonic horn heater 12 Ultrasonic vibrator 13 Load means 20 Anvil 20a PCB fixing suction hole 20b FPC fixing suction hole 20c Positioning pin 21 Anvil heater 22 Load sensor 23 θ-axis stage 24 X-axis stage 25 Y-axis stage 30 Needle 31 Syringe 32 Syringe holding / up-and-down means 40 Lens 40a Lens 40b Lens 41 CCD camera

41a CCD camera

41b CCD camera 50 FPC holding / supply hand 60 grinding wheel 61 grinding wheel holding means 70 control device 71 ultrasonic transmitter 72 load control device 73a ultrasonic horn temperature adjustment device 73b anvil temperature adjustment device 74 resin discharge control device 75 image positioning control device 76a FPC adsorption sensor 76b FPC adsorption sensor 76c PCB adsorption sensor 77 Position control device

Claims

The feature is that the width of the tip of the heated ultrasonic horn is 0.001 to 0.5 mm, the tip shape is orthogonal to the vibration direction, and the convex shape is perpendicular to the pressure surface. The heated ultrasonic horn characterized by the blade shape is arranged so as to vibrate in the direction parallel to the joint surface and parallel to the electrode direction, and the FPC and the circuit electrode are overlapped. It is characterized in that the electrodes are metal-bonded by heating and vibration while applying a load perpendicular to the bonding surface with a predetermined pressure, and further, FPC and PCB are bonded using resin. Ultrasonic bonding method.
The convex blades according to claim 1 are arranged in a plurality of rows, one row, a plurality of rows, or a plurality of rows, and a plurality of rows × 1 row, or 1 row × multiple rows, or a plurality of rows. An ultrasonic bonding method characterized in that bonding is performed at a position of rows x multiple stripes.
In order to implement Claim 1 and Claim 2, it has a load means, a vibration means, and a heating means, The ultrasonic bonding apparatus characterized by the above-mentioned.
In carrying out Claims 1 and 2, the joining positions are moved relative to each other, and joining at the position of a plurality of rows x one row, or one row x a plurality of rows, or a plurality of rows x a plurality of rows on the electrode. A characteristic ultrasonic bonding method.
In order to implement Claim 4, the ultrasonic joining apparatus characterized by having a load means, a vibration means, a heating means, an FPC, and an ultrasonic horn.
In carrying out the first, second, and fourth aspects, the resin is characterized in that it has a length of 30 to 50% of the joining length of the joining surface, and the volume necessary for adhesion is obtained. The metal of the part where the resin was not placed when pre-arranged with a certain constant thickness and the FPC and the circuit electrodes were overlapped and then applied with a predetermined pressure and applied with a load perpendicular to the joint surface. An ultrasonic bonding method characterized in that bonding and bonding are performed with a time difference between bonding and metal bonding in which resin is heated and melted at a portion where the resin has been disposed and discharged between electrodes.
After the implementation of claim 1, claim 2 or claim 4, a liquid room temperature curable resin, anaerobic curable resin, a moisture curable resin, a liquid thermoplastic resin, a thermosetting resin, a liquid UV curable resin, etc. An ultrasonic bonding method characterized in that FPC and PCB are bonded without impeding metal bonding of electrodes by pouring from the end face of the terminal after metal bonding of the electrodes.
In order to implement Claim 7, it has a means of resin application, An ultrasonic joining device characterized by things.
Even when the ultrasonic horn is worn or the ultrasonic horn is adhered to the ultrasonic horn and contaminated when the first, second, or fourth embodiments are performed, a polishing grindstone, a paper file, An ultrasonic bonding method characterized by applying a lapping film or the like and then vibrating the ultrasonic horn to perform planar polishing or cleaning of the ultrasonic horn.
An ultrasonic bonding apparatus having means for arranging a polishing grindstone, a paper file, a wrap film or the like for carrying out the method according to claim 11.
At the time of implementation of claim 1, claim 2 or claim 4, positioning of FPC and PCB is performed by making two or more positioning holes in one of FPC or PCB, and FPC and PCB on the other FPC or PCB. Two or more positioning marks with a size that can be observed through this hole, which are provided at a predetermined position by printing or plating so that they overlap at the same position when they are stacked, are passed through this hole with a microscope or a CCD camera. An ultrasonic bonding method comprising positioning while observing.
An ultrasonic bonding apparatus comprising observation means and positioning means for carrying out the invention.
At the time of implementation of claim 1, claim 2, or claim 4, positioning of the FPC and the PCB is performed by making two or more positioning holes on one side of the FPC or PCB, and on the other FPC or PCB, Two or more positioning holes having the same size as the above are formed so as to overlap at the same position when PCBs are stacked, and positioning is performed by inserting the positioning pins provided on the anvil into the holes. Ultrasonic bonding method.
An ultrasonic bonding apparatus characterized in that a positioning pin is provided on an anvil for carrying out the method according to claim 13.