CN108668464A - A kind of method and article construction of ultra-thin soft board and metal terminal ultrasonic bonding - Google Patents
A kind of method and article construction of ultra-thin soft board and metal terminal ultrasonic bonding Download PDFInfo
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- CN108668464A CN108668464A CN201810304415.6A CN201810304415A CN108668464A CN 108668464 A CN108668464 A CN 108668464A CN 201810304415 A CN201810304415 A CN 201810304415A CN 108668464 A CN108668464 A CN 108668464A
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- Prior art keywords
- epiphragma
- metal terminal
- ultrasonic bonding
- copper
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of methods of ultra-thin soft board and metal terminal ultrasonic bonding, are made according to following order：S1. it drills；S2. epiphragma is processed；S3. it is bonded epiphragma；S4. dry film is pressed；S5. circuit is made；S6. it is bonded epiphragma；S7. joint adhesive band；S8. copper facing；S9. adhesive tape is torn off；S10. it is bonded double faced adhesive tape；S11. it is bonded metal terminal；S12. ultrasonic bonding；S13. dispensing and solidification；The invention discloses the methods and article construction of a kind of flexible circuit board and metal terminal ultrasonic bonding, to realize the ultrasonic wave connection between ultra-thin FPC circuit boards and different-thickness metal terminal, enhance Joint Strength and structural reliability of the ultra-thin FPC products after ultrasonic bonding, and then promotes the circuit accuracy of FPC plates used in ultrasonic welding process.
Description
Technical field
The present invention relates to wiring board manufacturing field more particularly to a kind of ultra-thin soft board and metal terminal ultrasonic bonding
Method and article construction.
Background technology
Ultrasonic welding technique has been widely used for the fields such as mobile phone, instrument and meter, power electronics and automobile, but ultrasound
Wave soldering is connected on flexible circuit board（FPC）In apply critical constraints.
The shortcomings that prior art and prior art：
1, ultrasonic bonding automobile FPC plates and metal terminal.This ultrasonic welding technique is severely limited by FPC materials selected
The thickness of copper sheet commonly uses 70 μm or more of copper foil to process, but this copper foil have be costly and difficult to make precise circuit
The shortcomings that.The reason of wherein selecting 70 μm or more copper foils is ultra-thin used in FPC products（8 ~ 40 μm of thickness）Copper foil is difficult to bear
The stress deformation that supersonic welding termination process generates, and then extremely it be easy to cause copper foil breakage.
2, ultrasonic bonding mobile phone shell, copper is welded with aluminium in mobile phone shell, and solder joint is diameter about 1mm semicircle, pad surrounding
Spot-shaped weld, centre are not welded, and this design is the disadvantage is that the copper foil depth of cup, solder joint are few, weld strength is low, the double hit area of copper and aluminium
Small and then poorly conductive etc..
3, ultrasonic welding process between multilayer copper foil in lithium ion battery since the copper foil layer number of plies is more, and is gold of the same race
Welding and this programme between category have the difference of essence.
4, Al lines are bound in COB or ICBT, and pad is small and aluminium flake is Filamentous and this programme application essential difference.
Prior art Shortcomings need to improve.
Invention content
It is super to realize the invention discloses the method and article construction of a kind of ultra-thin soft board and metal terminal ultrasonic bonding
Ultrasonic wave connection between thin FPC circuit boards and different-thickness metal terminal.
To solve the above problems, technical solution provided by the invention is as follows：
A kind of method of ultra-thin soft board and metal terminal ultrasonic bonding, makes according to following order：
S1. drilled-processed by the way of laser or machine drilling the location hole of pure copper foil；
S2. epiphragma is processed-is used the modes such as punching press, graduating with cutter or photoetching and processes epiphragma windowing and location hole；
S3. fitting epiphragma-is opened using vacuum press and baking oven patch epiphragma epiphragma at pure copper foil rough surface, ultrasonic welding station
Mouth size is more than the size of ultrasonic welding machine soldering tip；
S4. two-sided pressing dry film-is using wet method or dry method rolling dry film and product two sides；
S5. circuit-use exposure, development are made, the traditional handicraft for etching and taking off film makes circuit；
S6. two fitting epiphragmas-using vacuum press and baking oven patch epiphragma on another side copper foil, wherein ultrasonic bonding pad
Epiphragma opening is more than epiphragma opening on copper foil rough surface at position；
S7. the gummed paper of acid and alkali-resistance is fitted in exposed copper at non-ultrasonic solder pad position by joint adhesive band-using vacuum press
On face and ultrasonic bonding pad locations at copper foil rough surface on；
S8. copper facing-electro-coppering is on the copper foil shiny surface of ultrasonic wave pad locations；
S9. the adhesive tape of adhesive tape-removing protection copper foil is torn off；
S10. fitting double faced adhesive tape-is bonded double faced adhesive tape electro-coppering one at ultrasonic bonding pad locations using jig and vacuum press
On the copper foil in face, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size exceeds
The opening size of epiphragma；
S11. fitting metal terminal-fits closely metal terminal on double faced adhesive tape using jig, vacuum press and baking oven；
S12. copper foil one side of the ultrasonic bonding-from ultrasonic bonding pad carries out ultrasonic bonding to metal terminal side；
S13. dispensing and solidification-the dot encapsulation glue on the copper face of ultrasonic wave bond pad locations, and carried out with high temperature or ultraviolet light close
The solidification of sealing.
Preferred technical solution needs to carry out sawing sheet process, it is therefore an objective to according to engineering data before carrying out drill process
It is required that on satisfactory big Zhang Jicai, cut into the substrate for meeting engine request or customer requirement, including cutting plate, curium plate,
Edging；
Preferred technical solution, which is characterized in that S1 drillings include the following steps：
Step 1, according to engineering data, the operating parameter of robot is preset and preserves, operating parameter includes drilling parameter, needs
Want region that dry film protects, need to take off the region of film, circuit graphic designs, need to be bonded the region of epiphragma, need joint adhesive
The region of band, copper-plated thickness, overlay film position, need to be bonded the region of double faced adhesive tape, ultrasonic wave welding parameter；
Step 2, substrate is moved to the drilling station of drilling equipment, and drilling equipment carries out pretreatment procedure to substrate, passes through detection
Whether identification substrate is qualified substrate, if the size of substrate or other defect of data, drilling equipment alarm and not into
Row boring work；Conversely, then carrying out drilling operating according to parameter preset；
Step 3, it after drilling operating is completed, needs by control chip according to preset drilling parameter before on drilling metacoxal plate
Location hole carry out qualified detection, be waste material by detection device alarm if the location hole on detection substrate is unqualified
And it is removed by moving material device；Conversely, then carrying out the next step.
Preferred technical solution, which is characterized in that S2 epiphragmas, which are processed, includes：It is processed and is opened a window according to parameter preset on epiphragma
And location hole, processing method is by the way of punching press, graduating with cutter or photoetching；
S3 is bonded epiphragma：Epiphragma is fitted in the rough surface of substrate pure copper foil using vacuum press and baking oven, this epiphragma is opened
Mouth size is slightly larger than the size of ultrasonic welding connection welding head, and then protects copper sheet；
The two-sided pressing dry films of S4 include：Dry film is pressed on the two sides of substrate,；
S5 makes circuit：The substrate for posting dry film is exposed, developed, etched and taken off film, then makes circuit, wherein
The one side that epiphragma is pressed on the substrate is exposed entirely, and the one side without epiphragma carries out line film exposure on the substrate；
S6 is bonded epiphragma：Epiphragma is pressed together on another side copper foil using vacuum press and with baking oven baking-curing, wherein
Epiphragma opening is more than epiphragma opening on substrate pure copper foil rough surface at ultrasonic bonding pad locations；
Preferred technical solution, S7 joint adhesive bands include：The gummed paper of acid and alkali-resistance is fitted in by non-ultrasonic weldering using vacuum press
It connects at pad locations on exposed copper face and on the copper foil rough surface of ultrasonic wave pad locations；
Preferred technical solution, S8 copper facing include：Substrate is moved to the station of copper plating device, by control chip according to default ginseng
Number, copper plating treatment is carried out by substrate, the copper of the copper foil shiny surface plating last layer preset thickness of ultrasonic wave pad locations on substrate,
The copper sheet overall thickness of ultrasonic wave pad locations is more than 50 μm after guarantee copper facing, and by the copper-plated thickness of institute on copper plating device detection substrate
Whether degree reaches preset thickness, as qualified if the copper-plated thickness of institute reaches preset thickness on substrate, then enters next
Process；Otherwise it is unqualified, marks, wait reprocessing or calcellation is handled.
Preferred technical solution, which is characterized in that S9 tears adhesive tape off and includes：Tear the glue for protecting copper foil in S7 steps off
Band；
S10 is bonded double faced adhesive tape：Double faced adhesive tape is fitted in by ultrasonic wave pad locations electro-coppering one using jig and vacuum press
On the copper foil in face, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size exceeds
The opening size of epiphragma；
Preferred technical solution, S11 fitting metal terminals include：It is using jig, vacuum press and baking oven that metal terminal is close
It is fitted on the double faced adhesive tape；
S12 ultrasonic bonding includes：With jig by product orientation, metal terminal is located at downside, by the soldering tip water of ultrasonic bonding
Flat to be moved to above bond pad locations, then wave welding head of ultrasonic wave is welded downwards by the copper foil surface of ultrathin flexible wiring board, into
And ultrathin flexible wiring board is welded together with metal terminal；
S13 dispensings and solidification include：Upper fluid sealant is put on the copper face of ultrasonic wave bond pad locations using point glue equipment, fluid sealant
Area coverage will exceed epiphragma opening shape, and the solidification of glue is sealed with high temperature or ultraviolet light.
Further include after preferred technical solution, S13 dispensings and curing schedule：
Step 1, Quality Detection is carried out according to product standard, detection finished product whether has electric leakage, short circuit, open circuit and other are various not
Good defect is then substandard products beyond standard, and identifies, and waits reprocessing or calcellation is handled；Certified products then carry out appearance packaging, are put into library
It deposits.
The present invention also provides a kind of article constructions of ultra-thin soft board and metal terminal ultrasonic bonding, and the article construction is by weighing
Profit requires the ultra-thin soft board of any one in 1-9 and the method for metal terminal ultrasonic bonding to be made, and the article construction is from down to up
It is followed successively by metal terminal, double faced adhesive tape, electro-coppering, tough cathode, epiphragma, fluid sealant.
Compared with prior art, the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding provided by the invention, it is real
Show ultra-thin（8-40 μm of copper sheet thickness）Ultrasonic bonding between accurate flexible circuit board and metal terminal is increased by being electroplated
The thickness of spot area copper foil reduces the technology difficulty of ultrasonic bonding；The present invention also provides a kind of ultra-thin soft board and metals
The article construction of terminal ultrasonic bonding can not only be effectively protected the thin copper foil of FPC welding disking areas, but also can effectively improve
The ageing-resistant performance of pad pastes legal manner by the dislocation of protective film and double faced adhesive tape, evacuation epiphragma be bonded the step to be formed and
Be electroplated the step formed, and then protection cap film edge and the copper foil of plating area, to prevent at the step of copper foil by metal terminal
It is bent and pulls damage.
Description of the drawings
Illustrate embodiment or technical solution in the prior art in order to clearer, it below will be to embodiment or the prior art
The required attached drawing used is briefly described in description, it is clear that, the accompanying drawings in the following description is only some realities invented
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the flow diagram of the present invention；
Fig. 2 is that the structure tree of the present invention is intended to.
Attached body explanation：1- metal terminals, 2- double faced adhesive tapes, 3- electro-copperings, 4- tough cathodes, 5- epiphragmas, 6- fluid sealants.
Specific implementation mode
To facilitate the understanding of the present invention, in the following with reference to the drawings and specific embodiments, the present invention will be described in more detail.
The preferred embodiment of the present invention is given in attached drawing.But the present invention can realize in many different forms, and it is unlimited
In this specification described embodiment.Make to the disclosure on the contrary, purpose of providing these embodiments is
Understand more thorough and comprehensive.
Unless otherwise defined, technical and scientific term all used in this specification is led with the technology for belonging to the present invention
The normally understood meaning of technical staff in domain is identical.Used term is only in the description of the invention in this specification
The purpose of description specific embodiment is not intended to the limitation present invention.
As shown in Figure 1, one embodiment of the present of invention is：
To solve the above problems, technical solution provided by the invention is as follows：
A kind of method of ultra-thin soft board and metal terminal ultrasonic bonding, makes according to following order：
S1. drilled-processed by the way of laser or machine drilling the location hole of pure copper foil；
S2. epiphragma is processed-is used the modes such as punching press, graduating with cutter or photoetching and processes epiphragma windowing and location hole；
S3. fitting epiphragma-pastes epiphragma in pure copper foil rough surface, the wherein lid of ultrasonic wave pad locations using vacuum press and baking oven
Film opening is more than ultrasonic welding machine soldering tip area；
S4. two-sided pressing dry film-is using wet method or dry method rolling dry film and product two sides；
S5. circuit-use exposure, development are made, the traditional handicraft for etching and taking off film makes circuit；
S6. two fitting epiphragmas-using vacuum press and baking oven patch epiphragma on another side copper foil, wherein ultrasonic wave pad locations
Epiphragma opening more than copper foil rough surface epiphragma be open；
S7. joint adhesive band-is fitted in the gummed paper of acid and alkali-resistance using vacuum press exposed at non-ultrasonic solder pad position
On copper face and ultrasonic bonding pad locations at copper foil rough surface on；
S8. copper facing-electro-coppering is at the ultrasonic bonding pad locations on the shiny surface of copper foil；
S9. the adhesive tape of adhesive tape-removing protection copper foil is torn off；
S10. fitting double faced adhesive tape-is bonded double faced adhesive tape electro-coppering at ultrasonic bonding pad locations using jig and vacuum press
On copper foil on one side, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size is super
Go out the opening size of epiphragma；
S11. fitting metal terminal-fits closely metal terminal on double faced adhesive tape using jig, vacuum press and baking oven；
S12. copper foil one side of the ultrasonic bonding-from ultrasonic bonding pad carries out ultrasonic bonding to metal terminal side；
S13. upper fluid sealant is put in dispensing and solidification-on the copper face of ultrasonic wave bond pad locations, and is carried out with high temperature or ultraviolet light
The solidification of fluid sealant.
Preferred technical solution needs to carry out sawing sheet process, it is therefore an objective to according to engineering data before carrying out drill process
It is required that on satisfactory big Zhang Jicai, cut into the substrate for meeting engine request or customer requirement, including cutting plate, curium plate,
Edging；
Preferred technical solution, which is characterized in that S1 drillings include the following steps：
Step 1, according to engineering data, the operating parameter of robot is preset and preserves, operating parameter includes drilling parameter, needs
Want region that dry film protects, need to take off the region of film, circuit graphic designs, need to be bonded the region of epiphragma, need joint adhesive
The region of band, copper-plated thickness, overlay film position, need to be bonded the region of double faced adhesive tape, ultrasonic wave welding parameter；
Step 2, substrate is moved to the drilling station of drilling equipment, and drilling equipment carries out pretreatment procedure to substrate, passes through detection
Whether identification substrate is qualified substrate, if the size of substrate or other defect of data, drilling equipment alarm and not into
Row boring work；Conversely, then carrying out drilling operating according to parameter preset；
Step 3, it after drilling operating is completed, needs by control chip according to preset drilling parameter before on drilling metacoxal plate
Location hole carry out qualified detection, be waste material by detection device alarm if the location hole on detection substrate is unqualified
And it is removed by moving material device；Conversely, then carrying out the next step.
Preferred technical solution, which is characterized in that S2 epiphragmas, which are processed, includes：It is processed and is opened a window according to parameter preset on epiphragma
And location hole, processing method is by the way of punching press, graduating with cutter or photoetching；
S3 is bonded epiphragma：Epiphragma is fitted in the rough surface of substrate pure copper foil using vacuum press and baking oven, this epiphragma is opened
Mouth size is slightly larger than the size of ultrasonic welding connection welding head, and then protects copper sheet；
The two-sided pressing dry films of S4 include：Dry film is pressed on the two sides of substrate,；
S5 makes circuit：The substrate for posting dry film is exposed, developed, etched and taken off film, then makes circuit, wherein
The one side that epiphragma is pressed on the substrate is exposed entirely, and the one side without epiphragma carries out line film exposure on the substrate；
S6 is bonded epiphragma：Epiphragma is pressed together on another side copper foil using vacuum press and with baking oven baking-curing, wherein
Epiphragma opening is more than epiphragma opening on substrate pure copper foil rough surface at ultrasonic bonding pad locations；
Preferred technical solution, S7 joint adhesive bands include：The gummed paper of acid and alkali-resistance is fitted in by non-ultrasonic weldering using vacuum press
It connects at pad locations on exposed copper face and on the copper foil rough surface of ultrasonic wave pad locations；
Preferred technical solution, S8 copper facing include：Substrate is moved to the station of copper plating device, by control chip according to default ginseng
Number, copper plating treatment is carried out by substrate, the copper of the copper foil shiny surface plating last layer preset thickness of ultrasonic wave pad locations on substrate,
The copper sheet overall thickness of ultrasonic wave pad locations is more than 50 μm after guarantee copper facing, and by the copper-plated thickness of institute on copper plating device detection substrate
Whether degree reaches preset thickness, as qualified if the copper-plated thickness of institute reaches preset thickness on substrate, then enters next
Process；Otherwise it is unqualified, marks, wait reprocessing or calcellation is handled.
Preferred technical solution, which is characterized in that S9 tears adhesive tape off and includes：Tear the glue for protecting copper foil in S7 steps off
Band；
S10 is bonded double faced adhesive tape：Double faced adhesive tape is fitted in by ultrasonic wave pad locations electro-coppering one using jig and vacuum press
On the copper foil in face, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size exceeds
The opening size of epiphragma；
Preferred technical solution, S11 fitting metal terminals include：It is using jig, vacuum press and baking oven that metal terminal is close
It is fitted on double faced adhesive tape described in S10；
S12 ultrasonic bonding includes：With jig by product orientation, metal terminal is located at downside, by the soldering tip water of ultrasonic bonding
Flat to be moved to above bond pad locations, then wave welding head of ultrasonic wave is welded downwards by the copper foil surface of ultrathin flexible wiring board, into
And ultrathin flexible wiring board is welded together with metal terminal；
S13 dispensings and solidification include：Upper fluid sealant is put on the copper face of ultrasonic wave bond pad locations using point glue equipment, fluid sealant
Area coverage will exceed epiphragma opening shape, and the solidification of glue is sealed with high temperature or ultraviolet light.
Further include after preferred technical solution, S13 dispensings and curing schedule：
Step 1, Quality Detection is carried out according to product standard, detection finished product whether has electric leakage, short circuit, open circuit and other are various not
Good defect is then substandard products beyond standard, and identifies, and waits reprocessing or calcellation is handled；Certified products then carry out appearance packaging, are put into library
It deposits.
As shown in Fig. 2, the present invention also provides a kind of article construction of ultra-thin soft board and metal terminal ultrasonic bonding, the system
Product structure is made of any one ultra-thin soft board and the method for metal terminal ultrasonic bonding in claim 1-9, the product knot
Structure is followed successively by metal terminal 1, double faced adhesive tape 2, electro-coppering 3, tough cathode 4, epiphragma 5, fluid sealant 6 from down to up.
Compared with prior art, the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding provided by the invention, it is real
Show ultra-thin（8-40 μm of copper sheet thickness）Ultrasonic bonding between accurate flexible circuit board and metal terminal is increased by being electroplated
The thickness of spot area copper foil reduces the technology difficulty of ultrasonic bonding；The present invention also provides a kind of ultra-thin soft board and metals
The article construction of terminal ultrasonic bonding can not only be effectively protected the thin copper foil of FPC welding disking areas, but also can effectively improve
The ageing-resistant performance of pad pastes legal manner by the dislocation of protective film and double faced adhesive tape, evacuation epiphragma be bonded the step to be formed and
Be electroplated the step formed, and then protection cap film edge and the copper foil of plating area, to prevent at the step of copper foil by metal terminal
It is bent and is pullled damage, enhances Joint Strength and structural reliability of the ultra-thin FPC products after ultrasonic bonding, and then is promoted super
The circuit accuracy of FPC plates used in sonic welding process.
It should be noted that above-mentioned each technical characteristic continues to be combined with each other, the various embodiments not being enumerated above are formed,
It is accordingly to be regarded as the range of description of the invention record；Also, for those of ordinary skills, can according to the above description with
And present inventive concept is improved or converted, and all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of method of ultra-thin soft board and metal terminal ultrasonic bonding, which is characterized in that made according to following order：
S1. drilled-processed by the way of laser or machine drilling the location hole of pure copper foil；
S2. epiphragma is processed-is used the modes such as punching press, graduating with cutter or photoetching and processes epiphragma windowing and location hole；
S3. fitting epiphragma-pastes epiphragma in pure copper foil rough surface, the wherein lid of ultrasonic wave pad locations using vacuum press and baking oven
Film opening is more than ultrasonic welding machine soldering tip area；
S4. two-sided pressing dry film-is using wet method or dry method rolling dry film and product two sides；
S5. circuit-use exposure, development are made, the traditional handicraft for etching and taking off film makes circuit；
S6. two fitting epiphragmas-using vacuum press and baking oven patch epiphragma on another side copper foil, wherein ultrasonic wave pad locations
Epiphragma opening be more than copper foil rough surface on epiphragma opening；
S7. joint adhesive band-is fitted in the gummed paper of acid and alkali-resistance using vacuum press exposed at non-ultrasonic solder pad position
On copper face and ultrasonic bonding pad locations at copper foil rough surface on；
S8. copper facing-electro-coppering is at the ultrasonic bonding pad locations on the shiny surface of copper foil；
S9. the adhesive tape of adhesive tape-removing protection copper foil is torn off；
S10. fitting double faced adhesive tape-is bonded double faced adhesive tape electro-coppering one at ultrasonic bonding pad locations using jig and vacuum press
On the copper foil in face, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size exceeds
The opening size of epiphragma；
S11. fitting metal terminal-fits closely metal terminal on double faced adhesive tape using jig, vacuum press and baking oven；
S12. copper foil one side of the ultrasonic bonding-from ultrasonic bonding pad carries out ultrasonic bonding to metal terminal side；
S13. dispensing and solidification-the dot encapsulation glue on the copper face of ultrasonic wave bond pad locations, and carried out with high temperature or ultraviolet light close
The solidification of sealing.
2. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that
Before carrying out drill process, need to carry out sawing sheet process, it is therefore an objective to according to the requirement of engineering data, in satisfactory big Zhang Jicai
（Fine copper）On, cut into the substrate for meeting engine request or customer requirement, including cutting plate, curium plate, edging.
3. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that S1
Drilling includes the following steps：
Step 1, according to engineering data, the operating parameter of robot is preset and preserves, operating parameter includes drilling parameter, needs
Want region that dry film protects, need to take off the region of film, circuit graphic designs, need to be bonded the region of epiphragma, need joint adhesive
The region of band, copper-plated thickness, overlay film position, need to be bonded the region of double faced adhesive tape, ultrasonic wave welding parameter；
Step 2, substrate is moved to the drilling station of drilling equipment, and drilling equipment carries out pretreatment procedure to substrate, passes through detection
Whether identification substrate is qualified substrate, if the size of substrate or other defect of data, drilling equipment alarm and not into
Row boring work；Conversely, then carrying out drilling operating according to parameter preset；
Step 3, it after drilling operating is completed, needs by control chip according to preset drilling parameter before on drilling metacoxal plate
Location hole carry out qualified detection, be waste material by detection device alarm if the location hole on detection substrate is unqualified
And it is removed by moving material device；Conversely, then carrying out the next step.
4. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that S2
Epiphragma is processed：Windowing and location hole are processed according to parameter preset on epiphragma, processing method uses punching press, graduating with cutter or photoetching
Mode；
S3 is bonded epiphragma：Epiphragma is fitted in the rough surface of substrate pure copper foil using vacuum press and baking oven, this epiphragma is opened
Mouth size is slightly larger than the size of ultrasonic welding connection welding head, and then protects copper sheet；
The two-sided pressing dry films of S4 include：Dry film is pressed on the two sides of substrate using wet method or dry method；
S5 makes circuit：The substrate for posting dry film is exposed, developed, etched and taken off film, then makes circuit, wherein
The one side that epiphragma is pressed on the substrate is exposed entirely, and the one side without epiphragma carries out line film exposure on the substrate；
S6 is bonded epiphragma：Epiphragma is pressed together on another side copper foil using vacuum press and with baking oven baking-curing, wherein
Epiphragma opening is more than epiphragma opening on substrate pure copper foil rough surface at ultrasonic bonding pad locations.
5. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that
S7 joint adhesive bands include：The gummed paper of acid and alkali-resistance is fitted in using vacuum press exposed at non-ultrasonic solder pad position
On copper face and on the copper foil rough surface of ultrasonic wave pad locations.
6. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that
S8 copper facing includes：Substrate is moved to the station of copper plating device, by control chip according to parameter preset, substrate is plated
Copper treatment, the copper of the copper foil shiny surface plating last layer preset thickness of ultrasonic wave pad locations, ensures ultrasound after copper facing on substrate
The copper sheet overall thickness of wave pad locations is more than 50 μm, and whether reaches default by the copper-plated thickness of institute on copper plating device detection substrate
Thickness, it is as qualified if the copper-plated thickness of institute reaches preset thickness on substrate, then enter subsequent processing；Otherwise for not
Qualification marks, and waits reprocessing or calcellation is handled.
7. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that S9
Tearing adhesive tape off includes：Tear the adhesive tape for protecting copper foil in S7 steps off；
S10 is bonded double faced adhesive tape：Double faced adhesive tape is fitted in by ultrasonic wave pad locations electro-coppering one using jig and vacuum press
On the copper foil in face, hollow processing is carried out to the double faced adhesive tape of ultrasonic wave bond pad locations before fitting and ensures that double faced adhesive tape appearance and size exceeds
The opening size of epiphragma.
8. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that
S11 is bonded metal terminal：Metal terminal is fitted tightly over by double faced adhesive tape described in S10 using jig, vacuum press and baking oven
On；
S12 ultrasonic bonding includes：With jig by product orientation, metal terminal is located at downside, by the soldering tip water of ultrasonic bonding
Flat to be moved to above bond pad locations, then wave welding head of ultrasonic wave is welded downwards by the copper foil surface of ultrathin flexible wiring board, into
And ultrathin flexible wiring board is welded together with metal terminal；
S13 dispensings and solidification include：Using point glue equipment, dot encapsulation glue, fluid sealant cover on the copper face of ultrasonic wave bond pad locations
Capping product will exceed epiphragma opening shape, and the solidification of glue is sealed with high temperature or ultraviolet light.
9. the method for a kind of ultra-thin soft board and metal terminal ultrasonic bonding according to claim 1, which is characterized in that
Further include after S13 dispensings and curing schedule：
Step 1, Quality Detection is carried out according to product standard, detection finished product whether has electric leakage, short circuit, open circuit and other are various not
Good defect is then substandard products beyond standard, and identifies, and waits reprocessing or calcellation is handled；Certified products then carry out appearance packaging, are put into library
It deposits.
10. a kind of article construction of ultra-thin soft board and metal terminal ultrasonic bonding, which is characterized in that the article construction is by right
It is required that a kind of ultra-thin soft board and the method for metal terminal ultrasonic bonding of any one in 1-9 are made, the article construction is under
To being above followed successively by metal terminal, double faced adhesive tape, electro-coppering, tough cathode, epiphragma, fluid sealant.
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| CN108668464B CN108668464B (en) | 2020-01-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109714904B (en) * | 2019-02-15 | 2021-08-13 | 福建世卓电子科技有限公司 | Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board |
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| CN108668464B (en) | 2020-01-03 |
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Address after: 518119 BYD Industrial Park, Yanan Road, Kwai Chung street, Dapeng District, Shenzhen, Guangdong Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung street, Dapeng District, Shenzhen, Guangdong Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |