CN109714904B - Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board - Google Patents
Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board Download PDFInfo
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- CN109714904B CN109714904B CN201910115936.1A CN201910115936A CN109714904B CN 109714904 B CN109714904 B CN 109714904B CN 201910115936 A CN201910115936 A CN 201910115936A CN 109714904 B CN109714904 B CN 109714904B
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Abstract
The invention provides a process for directly pasting a dry film on a hollowed-out area of a hollowed-out flexible circuit board, which is characterized by comprising the following steps of: a, obtaining a semi-finished product copper-clad soft board; b: selecting a dry film of which the thickness of the photosensitive emulsion layer is larger than that of the covering film; c: heating the two sides of the semi-finished copper-clad soft board respectively; then, adhering dry films on the two sides; d: after the semi-finished product copper-clad soft board after the dry film is pasted is placed still, the semi-finished product copper-clad soft board is pushed into an oven to be baked, and then the semi-finished product copper-clad soft board is placed still after being baked; e: and D, aligning the semi-finished product copper-clad flexible board obtained in the step D by using a film, exposing by using ultraviolet rays, completing polymerization hardening of the exposed part of the photosensitive emulsion, exposing the unexposed part of the photosensitive emulsion by developing to expose copper foils, etching the exposed copper foils, and removing the dry film of the hardened part to obtain the flexible circuit board. The invention solves the technical defect that the hollowed-out flexible circuit board needs to be pasted with the dry film after printing ink in the hollowed-out area, reduces the cost, improves the production efficiency and simultaneously reduces the ink pollution.
Description
Technical Field
The invention relates to a flexible circuit board processing technology.
Background
A technology for making the hollowed-out flexible circuit board includes such steps as drilling the locating holes on cover film and copper foil by digital control drilling machine, perforating the needed pad position on cover film, aligning the locating holes on cover film and copper foil, laminating, solidifying to obtain semi-finished copper-clad plate, making circuit on front surface, printing photosensitive ink on the hollowed-out position of cover film, baking and sticking the dry films on both surfaces. However, the method needs one more printing ink process, is easy to cause plate surface pollution, often needs secondary film stripping, and has low production efficiency and high cost.
Disclosure of Invention
The invention provides a process for directly pasting a dry film on a hollowed-out area of a hollowed-out flexible circuit board, aiming at solving the process defect that the hollowed-out flexible circuit board needs to paste the dry film after printing ink is printed on the hollowed-out area, reducing the cost, improving the production efficiency and reducing the ink pollution.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the process for directly pasting the dry film in the hollowed-out area of the hollowed-out flexible circuit board is characterized in that: the method comprises the following steps:
firstly, drilling a preset positioning hole in the cover film and the copper foil by using a numerical control drilling machine, windowing and hollowing the cover film according to the position of a bonding pad according to the requirement, carrying out alignment and lamination by using an alignment jig according to the positioning holes in the cover film and the copper foil, and curing to obtain a semi-finished product copper-clad soft board formed by windowing and hollowing one cover film at a specified position to expose the bonding pad or a golden finger copper foil;
b: selecting a dry film of which the thickness of the photosensitive emulsion layer is larger than that of the covering film;
c: b, performing oil removal, acid cleaning, water washing, cleaning and drying on a semi-finished product copper-clad soft board formed by windowing one surface of the cover film obtained in the step A at a specified position and hollowing out and exposing the bonding pad or the golden finger copper foil, then placing the semi-finished product copper-clad soft board on a heating platform, and respectively heating two surfaces of the semi-finished product copper-clad soft board; then, adhering dry films on the two sides;
d: after the semi-finished product copper-clad soft board after the dry film is pasted is placed still, the semi-finished product copper-clad soft board is pushed into an oven to be baked, and then the semi-finished product copper-clad soft board is placed still after being baked;
e: and D, aligning the semi-finished product copper-clad flexible board obtained in the step D by using a circuit film, exposing by using ultraviolet rays, completing polymerization hardening of the exposed part of the photosensitive emulsion, exposing the unexposed part of the photosensitive emulsion by developing to expose copper foils, etching the exposed copper foils, and removing the dry film of the hardened part to obtain the flexible circuit board.
Further:
the step C is as follows: the method comprises the steps of windowing a cover film at a specified position to expose a pad or a golden finger copper foil to form a semi-finished product copper-clad soft board, deoiling, pickling, washing, cleaning and drying, then stacking the semi-finished product copper-clad soft board on a heating platform in a stacking mode, setting the temperature of the heating platform to be 65-75 ℃, conducting heat transfer on the heating platform to the uppermost semi-finished product copper-clad soft board after 15-25 minutes, turning the semi-finished product copper-clad soft board to enable the bottommost surface to face upwards and the uppermost surface to face downwards on the heating platform, heating until the uppermost surface reaches 45-55 ℃, and then conducting double-sided dry film pasting.
Further:
step D is as follows: and (3) standing the semi-finished product copper-clad soft board after the dry film is pasted for 25-35 minutes, pushing the semi-finished product copper-clad soft board into an oven to bake for 25-35 minutes at the temperature of 45-55 ℃, and standing for 25-35 minutes after baking.
The invention has the advantages that:
the invention is different from the traditional dry film pasting method, finds the characteristic that the emulsion of the dry film can be softened and expanded after being heated before being exposed by ultraviolet rays (before being polymerized), and utilizes the characteristic to carry out softening and expanding treatment on the dry film: namely, a heating plate is added before film sticking and low-temperature baking is added after film sticking. The hot plate is added before film pasting, dry film softening is facilitated, meanwhile, the film pasting speed, the temperature and the pressure are controlled along the length direction of the hollowed-out area in the pasting and pressing process, and the purpose is to enable the dry film to be better sunk into the hollowed-out area. The method is characterized in that low-temperature baking is added after film pasting to facilitate expansion of a dry film, and aims to crush bubbles at certain parts of junctions of the peripheral edges of a cover film of a hollowed-out area and a copper foil after film pasting to enable an emulsion to permeate into the parts, so that the parts can be ensured to be filled with the emulsion, and the emulsion is polymerized and hardened through ultraviolet exposure, thereby effectively preventing the problem of bubbles, biting and etching a pad or a copper foil of a golden finger during etching, solving the technical defect that the hollowed-out flexible circuit board needs to paste the dry film after printing ink is printed in the hollowed-out area, reducing the cost, improving the production efficiency, and reducing the ink pollution.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a state diagram of a semi-finished hollow copper-clad plate of the invention in a hollow area after pre-baking, adhering dry adhesive films on two sides and baking;
FIG. 2 is a diagram of a state of a hollow-out area after a photoresist is removed in the state of FIG. 1.
Detailed Description
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained according to the drawings without inventive labor.
The invention comprises the following steps:
firstly, drilling a preset positioning hole in the cover film 2 and the copper foil 1 by using a numerical control drilling machine, windowing and hollowing the cover film at a pad position according to the requirement, aligning and attaching by using an alignment jig according to the positioning hole in the cover film 2 and the copper foil 1, laminating and curing to obtain a semi-finished product copper-clad soft board 3 formed by windowing and hollowing one cover film at a specified position to expose the pad or the gold finger copper foil.
1. Materials and parameters need to be selected and confirmed before film pasting:
1) the thickness of the dry film 4 is selected, and the thicknesses of the cover films 2 of the hollow layers of different products are not necessarily the same, so that the dry film 4 with the thickness larger than that of the cover film 2 is selected according to the thicknesses of the cover films 2, namely the thickness of the photosensitive emulsion layer of the dry film 4 is required to be larger than the height of the step of the hollow area 5 (namely the thickness of the cover film 2), so that the photosensitive emulsion is prevented from being pulled through at the right-angle edge of the hollow area 5 of the cover film 2 during softening and expansion. For example, if the thickness of the cover film 2 is 35um, the thickness of the dry film 4 is 40 um.
2) The upper and lower film pressing rubber wheels are rubber wheels with Shore hardness of 75-80A, have certain elasticity and certain hardness, and can press the dry film 4 into the hollow area 5.
3) Parameters, upper and lower lamination rubber wheel pressure: 0.65 +/-0.05 MPa
The temperature is 110 +/-5 DEG C
Speed of 0.6-1.0 m/min
2. Debugging and inspecting before film pasting
1) The dry film 4 is put into an upper and a lower dry film shafts of a device for automatically wetting the flexible circuit board to paste the dry film, the release film on the surface of the film pasting surface is separated, and the tension is adjusted.
2) The sponge of the sponge roller of the device for automatically wetting the flexible circuit board to paste the dry film is checked whether to be wetted, the water level of the water tank and the water pump are checked whether to be normal, and the parameter setting is checked whether to be within a specified range.
3. Preheating the board surface and pasting a film: the method comprises the steps of windowing a cover film at a specified position to expose a pad or a golden finger copper foil to form a semi-finished product copper-clad soft board, deoiling, pickling, washing, cleaning and drying, then arranging 50 pieces of the semi-finished product copper-clad soft board into a stack, placing the stack on a heating platform, setting the temperature of the heating platform to be 70 ℃, conducting heat to the topmost semi-finished product copper-clad soft board 3 by the temperature of the heating platform after about 20 minutes, turning the whole stack to face, enabling the bottommost face to face upwards, placing the topmost face to face downwards on the heating platform, heating to the topmost face to be about 50 ℃, taking two sides of the semi-finished product copper-clad soft board 3 with two hands, sending the semi-finished product copper-clad soft board into a sponge roller for wetting, and then entering a film-laminating rubber roller for double-sided automatic dry film laminating.
4. Baking: and (3) placing the semi-finished product copper-clad soft board 3 which is pasted with the dry film into a multi-layer frame, standing for 30 minutes, pushing into an oven to bake for 30 minutes at 50 ℃, and standing for 30 minutes again after baking. In the baking process, small bubbles are broken due to the expansion of the dry film 4 caused by heating, and the photosensitive emulsion is softened and infiltrated to the broken part of the bubbles to fill the part. As shown in FIG. 1, the part A is bubble-free.
5. And (3) circuit manufacturing: and aligning by using a circuit film, exposing by ultraviolet rays, completing polymerization hardening of the exposed part of the photosensitive emulsion, developing the unexposed part to expose the copper foil 1, etching the copper foil 1 by using a copper chloride solution, and removing the dry film 4 of the hardened part by using sodium hydroxide to obtain the flexible circuit board with a hollowed-out part of the substrate shown in figure 2, wherein the position of the copper foil 1 at the edge of the covering film 2, namely the position B, of the hollowed-out area 5 is visible, the copper foil 1 is not bitten into and the circuit is intact.
6. Summary of materials and parameters table:
the embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (1)
1. The process for directly pasting the dry film in the hollowed-out area of the hollowed-out flexible circuit board is characterized in that: the method comprises the following steps:
firstly, drilling a preset positioning hole in the cover film and the copper foil by using a numerical control drilling machine, windowing and hollowing the cover film at a pad position according to the requirement, aligning and attaching by using an aligning jig according to the positioning holes in the cover film and the copper foil, laminating and curing to obtain a semi-finished product copper-clad soft board formed by windowing and hollowing one cover film at a specified position to expose the pad or a golden finger copper foil;
b: selecting a dry film of which the thickness of the photosensitive emulsion layer is larger than that of the covering film;
c: carrying out oil removal, acid washing, water washing, cleaning and drying on a semi-finished product copper-clad soft board formed by windowing and hollowing out a pad or a golden finger copper foil on one side of a cover film at a specified position, then stacking the cover film on a heating platform, setting the temperature of the heating platform to 65-75 ℃, after 15-25 minutes, transferring the heat of the heating platform to the uppermost semi-finished product copper-clad soft board, turning the semi-finished product copper-clad soft board to enable the bottommost side to be upward and the uppermost side to be downward on the heating platform, heating until the uppermost temperature reaches 45-55 ℃, and then carrying out double-sided dry film pasting;
d: standing the semi-finished product copper-clad soft board after the dry film is pasted for 25-35 minutes, pushing the semi-finished product copper-clad soft board into an oven to bake for 25-35 minutes at the temperature of 45-55 ℃, and standing for 25-35 minutes after baking;
e: and D, aligning the semi-finished product copper-clad flexible board obtained in the step D by using a circuit film, exposing by using ultraviolet rays, completing polymerization hardening of the exposed part of the photosensitive emulsion, exposing the unexposed part of the photosensitive emulsion by developing to expose copper foils, etching the exposed copper foils, and removing the dry film of the hardened part to obtain the flexible circuit board.
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| CN201910115936.1A CN109714904B (en) | 2019-02-15 | 2019-02-15 | Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board |
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| CN201910115936.1A CN109714904B (en) | 2019-02-15 | 2019-02-15 | Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board |
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| CN109714904B true CN109714904B (en) | 2021-08-13 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN112654165A (en) * | 2020-12-29 | 2021-04-13 | 博罗县精汇电子科技有限公司 | Production method of novel heat dissipation conducting steel sheet circuit board with groove |
| CN112969306B (en) * | 2021-02-05 | 2022-06-03 | 福建世卓电子科技有限公司 | Process for improving surface tension of polyimide cover film of flexible circuit board |
| CN113597111B (en) * | 2021-07-29 | 2024-07-02 | 上达电子（黄石）股份有限公司 | FPC product manufacturing process without printing ink residue on back of through hole |
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