CN107801325A - Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil - Google Patents
Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil Download PDFInfo
- Publication number
- CN107801325A CN107801325A CN201710762563.8A CN201710762563A CN107801325A CN 107801325 A CN107801325 A CN 107801325A CN 201710762563 A CN201710762563 A CN 201710762563A CN 107801325 A CN107801325 A CN 107801325A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- core plate
- resin
- exposure
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention relates to printed substrate field, the method of specially a kind of preparation method for covering resin copper foil and pressing with big spacious area's core plate, the present invention carries out lamination pressing by the way that prepreg is clipped between two blocks of copper foils, then a wherein face copper foil is removed, so as to obtain covering resin copper foil, after resin bed is arranged on copper foil, the thickness of copper foil is not only increased, also add the bend resistance degree of copper foil.For the core plate with big spacious area, pressed using resin copper foil is covered, it is strong due to covering resin copper foil bend resistance degree, it effectively prevent the copper foil wrinkling occurred in bonding processes, the yield rate of product is improved, significantly reduces the production cost of printed substrate.
Description
Technical field
The present invention relates to printed substrate field, more particularly to a kind of preparation method for covering resin copper foil and pressing to have greatly
The method of spacious area's core plate.
Background technology
At present, due to the increase of integrated antenna package density, the high concentration of interconnection line is result in, this causes multi-sheet printed
The application of wiring board is more and more extensive.Multilayer printed circuit board carries out pressing system after being generally superimposed prepreg and copper foil by core plate
Form, the principle of pressing is as follows：It is in the characteristic of semi-cured state (B-stage) at normal temperatures using prepreg so that
After the heating, the resin in prepreg rises with temperature occurs high molecular polymer reaction, the shape of prepreg to prepreg
State is from melting → flowing → gel → hardening, finally as solid polymer, reaches C-stage state.
For core plates more than four floor with big spacious area, core plate is roughly divided into no copper area and You Tong areas, no copper area and
You Tong areas are in bonding processes, and due to being set low without copper position, for the pressure being subject to regard to small, the position in Er Youtong areas is higher, is subject to
Pressure easily causes no copper region decompression with regard to big, and gummosis is uneven, so as to cause surface copper foil corrugation.On the other hand, it is right
Big spacious region in core plate, the loading of resin is more more than You Tong area, and the mobility of resin is bigger so that was pressing
It can usually drive copper foil to move in journey, cause multi-layer sheet to scrap so that fold occurs for copper foil.
The content of the invention
The present invention, which is directed to, has the problem of big spacious area's core plate produces copper foil fold in bonding processes, there is provided one kind is in copper
One layer of resin is set also to be provided a kind of to add the preparation method for covering resin copper foil of the thickness of copper foil and bend resistance degree on paper tinsel
Core plate of the pressing with big spacious area is carried out so as to prevent that corrugated pressure occurs for copper foil in bonding processes by covering resin copper foil
Conjunction method.
To achieve the above object, the present invention uses following technical scheme：
A kind of preparation method for covering resin copper foil, comprises the following steps：
S1, lamination pressing is carried out according to the order of copper foil, prepreg, copper foil successively, copper foil core plate is made；
S2, the wherein face copper foil for removing copper foil core plate, obtain covering resin copper foil.
Further, it is as follows to obtain the step of covering resin copper foil：
S1, by copper foil core plate whole plate be coated with ink；
S2, copper foil core plate to being coated with ink wherein simultaneously carry out whole face exposure, obtain plane of exposure copper foil and non-exposure
Shiny copper foil；
S3, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S4, ink is carried out to plane of exposure copper foil move back film process, obtain exposing copper-clad surface covers resin copper foil.
Further, it is as follows to obtain the step of covering resin copper foil：
S1, the wherein one side progress whole plate pad pasting by copper foil core plate；
S2, the side to the copper foil core plate of pad pasting carry out whole face exposure, obtain plane of exposure copper foil and non-exposed face copper foil；
S3, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S4, plane of exposure copper foil is carried out to move back film process, obtain exposing copper face covers resin copper foil.
Also provide it is a kind of carry out method of the pressing with big spacious area's core plate using covering resin copper foil, comprise the following steps：
According to cover resin copper foil, prepreg, core plate, prepreg, cover resin copper foil row's harden structure carry out walkthrough lamination；After lamination
Each plate is pressed, obtains laminate；Wherein described core plate is the core plate with big spacious area.
Further, before lamination step, brown processing is carried out to core plate and the surface for covering resin copper foil, it is thick to form surface
Rough brown layer.
Further, after step is pressed, nog plate process is carried out to laminate, removes the palm fibre in exposed besides portion in laminate
Change layer, the laminate after being polished.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention by by prepreg be clipped in two blocks of copper foils it
Between carry out lamination pressing, then remove a wherein face copper foil, so as to obtain covering resin copper foil, after resin bed is arranged on copper foil,
The thickness of copper foil is not only increased, also add the bend resistance degree of copper foil.
For the core plate with big spacious area, pressed using resin copper foil is covered, due to covering resin copper foil bend resistance degree
By force, the copper foil wrinkling occurred in bonding processes is effectively prevent, the yield rate of product is improved, reduces and be produced into
This.
Embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Cover the embodiment one of the preparation method of resin copper foil：
The present invention provides a kind of preparation method for covering resin copper foil, specifically includes following steps：
S1, lamination pressing is carried out according to the order of copper foil, prepreg, copper foil successively, copper foil core plate is made；
S2, by copper foil core plate whole plate be coated with ink；
S3, copper foil core plate to being coated with ink wherein simultaneously carry out whole face exposure, obtain plane of exposure copper foil and non-exposure
Shiny copper foil；
S4, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S5, ink is carried out to plane of exposure copper foil move back film process, obtain exposing copper-clad surface covers resin copper foil.
Cover the embodiment two of the preparation method of resin copper foil：Specifically include following steps：
S1, lamination pressing is carried out according to the order of copper foil, prepreg, copper foil successively, copper foil core plate is made；
S2, the wherein one side progress whole plate pad pasting by copper foil core plate；
S3, the side to the copper foil core plate of pad pasting carry out whole face exposure, obtain plane of exposure copper foil and non-exposed face copper foil；
S4, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S5, plane of exposure copper foil is carried out to move back film process, obtain exposing copper face covers resin copper foil.
Also provide it is a kind of carry out method of the pressing with big spacious area's core plate using covering resin copper foil, comprise the following steps：
S1, to core plate and cover resin copper foil surface carry out brown processing, form shaggy brown layer；Brown processing
Purpose be in a manner of chemical reaction so that core plate and cover the copper face of resin copper foil and generate one layer of brown oxide, so as to shape
Into suitable surface roughness, adhesion when being pressed with enhancing.After brown, the roughness of brown layer is 1.3~1.8 μm.
S2, baking sheet, dry core plate and cover the moisture of resin copper foil, prevent layering and plate bursting.
S3, according to cover resin copper foil, prepreg, core plate, prepreg, cover resin copper foil row's harden structure carry out walkthrough
Lamination；The wherein pressing thickness of prepreg is 0.27mm, resin content 57%, wherein the core plate is with big spacious area
Core plate.
S4, each plate pressed according to normal pressing parameter, obtain laminate；By the way of hot pressing and then being cold-pressed,
140 DEG C~220 DEG C of hot pressing temperature, 2.5 hours of time, one hour of time is cold-pressed, cold pressing is to eliminate internal stress, there is provided
Slow cooling condition.Because resin absorbs amount of heat in curing reaction, thus larger thermal stress has been concentrated, it is necessary to make it
It is cold-pressed under a certain pressure to less than 100 DEG C, prevents that plate sticks up phenomenon caused by internal stress.
S5, nog plate process is carried out to laminate, remove the brown layer that outside is exposed in laminate, the layer after being polished
Pressing plate.
The present invention carries out lamination pressing by the way that prepreg is clipped between two blocks of copper foils, then removes a wherein face copper
Paper tinsel, so as to obtain covering resin copper foil, after resin bed is arranged on copper foil, the thickness of copper foil is not only increased, also add copper foil
Bend resistance degree.For the core plate with big spacious area, pressed using resin copper foil is covered, due to covering resin copper foil bend resistance
Degree is strong, effectively prevent the copper foil wrinkling occurred in bonding processes, improves the yield rate of product, significantly reduce
The production cost of printed substrate.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (6)
1. a kind of preparation method for covering resin copper foil, it is characterised in that comprise the following steps：
S1, lamination pressing is carried out according to the order of copper foil, prepreg, copper foil successively, copper foil core plate is made；
S2, the wherein face copper foil for removing copper foil core plate, obtain covering resin copper foil.
2. the preparation method according to claim 1 for covering resin copper foil, it is characterised in that the step of resin copper foil is covered in acquisition
It is as follows：
S1, by copper foil core plate whole plate be coated with ink；
S2, copper foil core plate to being coated with ink wherein simultaneously carry out whole face exposure, obtain plane of exposure copper foil and non-exposed face
Copper foil；
S3, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S4, ink is carried out to plane of exposure copper foil move back film process, obtain exposing copper-clad surface covers resin copper foil.
3. the preparation method according to claim 1 for covering resin copper foil, it is characterised in that the step of resin copper foil is covered in acquisition
It is as follows：
S1, the wherein one side progress whole plate pad pasting by copper foil core plate；
S2, the side to the copper foil core plate of pad pasting carry out whole face exposure, obtain plane of exposure copper foil and non-exposed face copper foil；
S3, the copper foil core plate after exposure is etched, etching removes non-exposed face copper foil；
S4, plane of exposure copper foil is carried out to move back film process, obtain exposing copper face covers resin copper foil.
4. a kind of resin copper foil that covers used in claims 1 to 3 described in any one carries out pressing with big spacious area's core
The method of plate, it is characterised in that comprise the following steps：According to covering resin copper foil, prepreg, core plate, prepreg, cover resin
Row's harden structure of copper foil carries out walkthrough lamination；Each plate is pressed after lamination, obtains laminate；Wherein described core plate be with
The core plate in big spacious area.
5. method of the pressing according to claim 4 with big spacious area's core plate, it is characterised in that：Lamination step it
Before, brown processing is carried out to core plate and the surface for covering resin copper foil, forms shaggy brown layer.
6. method of the pressing according to claim 5 with big spacious area's core plate, it is characterised in that：Pressing step it
Afterwards, nog plate process is carried out to laminate, removes the brown layer that outside is exposed in laminate, the laminate after being polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710762563.8A CN107801325A (en) | 2017-08-30 | 2017-08-30 | Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710762563.8A CN107801325A (en) | 2017-08-30 | 2017-08-30 | Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107801325A true CN107801325A (en) | 2018-03-13 |
Family
ID=61531658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710762563.8A Pending CN107801325A (en) | 2017-08-30 | 2017-08-30 | Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107801325A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867289A (en) * | 2021-01-05 | 2021-05-28 | 宏华胜精密电子(烟台)有限公司 | Manufacturing method of circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342604A (en) * | 2008-08-08 | 2009-01-14 | 东莞生益电子有限公司 | Hole drilling method with single-side brass plate as back drill cover plate |
| CN102497736A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing process for printed circuit board |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
| CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
-
2017
- 2017-08-30 CN CN201710762563.8A patent/CN107801325A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342604A (en) * | 2008-08-08 | 2009-01-14 | 东莞生益电子有限公司 | Hole drilling method with single-side brass plate as back drill cover plate |
| CN102497736A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing process for printed circuit board |
| CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867289A (en) * | 2021-01-05 | 2021-05-28 | 宏华胜精密电子(烟台)有限公司 | Manufacturing method of circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180313 |