JP2002141659A - Method for connecting flexible printed board to each other - Google Patents

Method for connecting flexible printed board to each other

Info

Publication number
JP2002141659A
JP2002141659A JP2000332819A JP2000332819A JP2002141659A JP 2002141659 A JP2002141659 A JP 2002141659A JP 2000332819 A JP2000332819 A JP 2000332819A JP 2000332819 A JP2000332819 A JP 2000332819A JP 2002141659 A JP2002141659 A JP 2002141659A
Authority
JP
Japan
Prior art keywords
flexible printed
printed circuit
circuit boards
fpc
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000332819A
Other languages
Japanese (ja)
Inventor
Ichiro Terunuma
一郎 照沼
Kazuya Akashi
一弥 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2000332819A priority Critical patent/JP2002141659A/en
Publication of JP2002141659A publication Critical patent/JP2002141659A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for mutual connection between flexible printed boards which can reduce the manufacture cost by securely connecting terminals of the flexible printed boards to each other. SOLUTION: Wires 16 and 26 are formed on insulating films 15 and 25 as the bases of FPC's 10 and 20, and a cover lay is formed on the insulating films 15 and 25 and wires 156 and 26 except parts which become the terminals 11 and 21 to manufacture the FPC's 10 and 20. After the terminal parts 11 and 21 of the FPC's 10 and 20 thus prepared are folded to the reverse surface sides of the insulating films 15 and 26, the wires 16 and 26 are brought into contact with each other. Further, temporary crimp contact processing is performed by pressing them from the sides of the insulating films 15 and 25. In this state, electrodes 9a and 9b of a series welding device (not illustrated) are made to abut from above the wires 16 and 26 of the respective terminal parts 11 and 21, and a specific voltage is applied to join the wires 16 and 26 together.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、可撓性プリント
基板同士の接続方法に関し、特に、可撓性プリント基板
の端末同士を安価に、且つ確実に接続することができる
可撓性プリント基板同士の接続方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting flexible printed circuit boards, and more particularly, to a method of connecting terminals of flexible printed circuit boards inexpensively and reliably. Connection method.

【0002】[0002]

【従来の技術】近年、自動車等に用いられているワイヤ
ハーネスをできるだけ可撓性プリント基板(Flexible P
rinted Circuits:FPC)に代替しようとする動きが
活発になってきている。このような動きに則って、例え
ば、図9に示すように、自動車等のダッシュボード30
0の内側に搭載された電子制御ユニット301や、ヒュ
ーズボックス302等を電気的に接続するためには、従
来の回路接続用ワイヤハーネス500に代えてFPC4
00をより多く使用することとなる。
2. Description of the Related Art In recent years, wire harnesses used in automobiles and the like have been used as much as
There is a growing movement to substitute rinted circuits (FPC). According to such a movement, for example, as shown in FIG.
In order to electrically connect the electronic control unit 301, the fuse box 302, and the like mounted inside the FPC 4 in place of the conventional circuit connection wire harness 500,
00 will be used more.

【0003】このような用途でFPCを使用する場合、
一般的には、例えば家電製品で用いられるFPCよりも
遥かにサイズの大きなFPCを使用することになる。通
常、FPCは金型で外形抜きをして製作されるため、そ
の大きさは所定のサイズに制約されているが、図9に示
すような従来の回路接続用ワイヤハーネス500に代え
て使用する場合は、現状の製造限界のFPCよりも更に
大きなサイズのFPCが必要となる。
When the FPC is used for such a purpose,
Generally, for example, an FPC that is much larger in size than an FPC used in home electric appliances will be used. Normally, the FPC is manufactured by punching out an outer shape by using a die, and its size is restricted to a predetermined size. However, the FPC is used instead of the conventional circuit connection wire harness 500 as shown in FIG. In such a case, an FPC having a size larger than the current production limit FPC is required.

【0004】この場合、図10に示すように、例えば、
それぞれ別々に製造したいくつかのFPC401〜40
4やFPCハーネス405,406等をジョイントさせ
て一つのFPC400を形成して使用するというような
対策が採られている。このように、FPC401〜40
4同士やこれらFPC401〜404にFPCハーネス
405,406等を接続するためには、専用の接続コネ
クタ(図示せず)を使用してFPC401〜404及び
FPCハーネス405,406を接続する方法が一般的
に行われている。なお、専用のコネクタを用いずにFP
C同士を接続するために、例えば、FPCの端末同士を
かしめたり、はとめたりする方法も検討されてはいる
が、電気的接続信頼性や耐久性等の問題があり、未だ全
面的な実用化には時間がかかるようである。したがっ
て、現段階では、専用の接続コネクタによる接続に頼ら
ざるを得ない状況である。
In this case, for example, as shown in FIG.
Several FPCs 401 to 40 each manufactured separately
4 and the FPC harnesses 405, 406, etc., are jointed to form one FPC 400 for use. Thus, the FPCs 401 to 40
In order to connect the FPC harnesses 405, 406 and the like to each other and to the FPCs 401 to 404, a method of connecting the FPCs 401 to 404 and the FPC harnesses 405, 406 using a dedicated connector (not shown) is generally used. It has been done. Note that the FP can be used without using a dedicated connector.
In order to connect C, for example, a method of caulking or removing FPC terminals is also being studied, but there are problems such as electrical connection reliability and durability, and there is still a full practical use. It seems to take time. Therefore, at this stage, it is necessary to rely on connection using a dedicated connection connector.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな専用の接続コネクタによるFPC同士の接続では、
図10に示すようなそれぞれのジョイント箇所毎に専用
の接続コネクタ(図示せず)がそれぞれ必要となるた
め、FPC同士の接続に関するコストだけでも莫大なも
のとなり、車載用FPC若しくはFPCハーネスの製造
コストの増大を招くおそれがあるという問題がある。ま
た、仮にこのような専用の接続コネクタを用いない接続
方法を採用したとしても、未だに接続技術が確立されて
いないため、接続信頼性等に欠けるおそれがあり、採用
に踏み切り難いという問題もある。
However, in connection between FPCs by such a dedicated connector,
Since a dedicated connector (not shown) is required for each joint portion as shown in FIG. 10, the cost of connecting FPCs alone becomes enormous, and the manufacturing cost of an in-vehicle FPC or FPC harness There is a problem that there is a risk of causing an increase. Even if such a connection method that does not use a dedicated connection connector is adopted, there is a problem that connection reliability or the like may be lacking because connection technology has not yet been established, and it is difficult to adopt the connection method.

【0006】この発明は、このような問題点に鑑みてな
されたもので、可撓性プリント基板の端末同士を安価
に、且つ確実に接続し、可撓性プリント基板同士の接続
に関するコストの上昇を抑え、製造コストを削減するこ
とができる可撓性プリント基板同士の接続方法を提供す
ることを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and inexpensively and securely connects terminals of a flexible printed circuit board, thereby increasing the cost of connecting the flexible printed circuit boards. It is an object of the present invention to provide a method for connecting flexible printed circuit boards, which can reduce the manufacturing cost.

【0007】[0007]

【課題を解決するための手段】この発明に係る可撓性プ
リント基板同士の接続方法は、絶縁フィルム上に導体配
線が形成されてなる可撓性プリント基板同士の接続方法
であって、一方の可撓性プリント基板の端末部の導体配
線と他方の可撓性プリント基板の端末部の導体配線とを
向い合せ、且つそれぞれの端末部の端面が同一方向へ向
くように前記両可撓性プリント基板の端末部を折り曲げ
て前記向い合う導体配線を密着させ、前記両端末部に両
者が密着する向きの圧力を加え、前記一方の可撓性プリ
ント基板の導体配線上に一方の電極を当接させると共
に、前記他方の可撓性プリント基板の導体配線上に他方
の電極を当接させてこれら当接させた電極間に所定の電
圧を印加して前記密着させたそれぞれの導体配線同士を
抵抗溶接により接合することを特徴とする。
A method for connecting flexible printed circuit boards according to the present invention is a method for connecting flexible printed circuit boards each having a conductor wiring formed on an insulating film. The two flexible prints are arranged such that the conductor wiring at the terminal of the flexible printed circuit board and the conductor wiring at the terminal of the other flexible printed circuit board face each other, and the end faces of the respective terminal parts face in the same direction. The terminal portion of the substrate is bent so that the conductor wires facing each other are brought into close contact with each other, pressure is applied to the two terminal portions in a direction in which both are brought into close contact, and one electrode is brought into contact with the conductor wires of the one flexible printed circuit board. At the same time, the other electrode is brought into contact with the conductor wiring of the other flexible printed circuit board, and a predetermined voltage is applied between the contacted electrodes to make the respective conductor wirings adhered to each other a resistance. Joined by welding And wherein the Rukoto.

【0008】また、この発明に係る可撓性プリント基板
同士の接続方法は、絶縁フィルム上に導体配線が形成さ
れてなる可撓性プリント基板同士の接続方法であって、
一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とを向い合せ、
且つそれぞれの端末部の端面が同一方向へ向くように前
記両可撓性プリント基板の端末部を折り曲げて前記向い
合う導体配線を密着させ、前記両端末部を挟み込むよう
にホーンとアンビルとを両可撓性プリント基板に当接さ
せてこれらホーン及びアンビル間に所定の周波数の超音
波を出力して前記密着させたそれぞれの導体配線同士を
超音波溶着により接合することを特徴とする。
Further, a method for connecting flexible printed boards according to the present invention is a method for connecting flexible printed boards formed by forming conductor wiring on an insulating film,
The conductor wiring of the terminal part of one flexible printed board and the conductor wiring of the terminal part of the other flexible printed board face each other,
In addition, the terminal portions of the flexible printed circuit boards are bent so that the end surfaces of the terminal portions face in the same direction, and the facing conductor wirings are brought into close contact with each other, and both the horn and the anvil are sandwiched so as to sandwich the terminal portions. An ultrasonic wave of a predetermined frequency is output between the horn and the anvil while being in contact with the flexible printed circuit board, and the closely adhered conductor wirings are joined by ultrasonic welding.

【0009】この発明によれば、接続するそれぞれの可
撓性プリント基板(以下、この段落のみ「FPC」と呼
ぶ。)の端末部を、それぞれの端末部に形成された導体
配線を向い合せ、且つそれぞれの端末部の端面が同一方
向へ向くように折り曲げて向い合う導体配線を密着さ
せ、両端末部に両者が密着する向きの圧力を加え、圧力
を加えた状態でそれぞれのFPCの導体配線上に電極を
当接させてこれら当接させた電極間に電圧を印加して抵
抗溶接を行い密着させた導体配線同士を接合してFPC
同士を電気的に接続する。また、この発明によれば、接
続するそれぞれのFPCの端末部を、それぞれの端末部
に形成された導体配線を向い合せ、且つそれぞれの端末
部の端面が同一方向へ向くように折り曲げて向い合う導
体配線を密着させ、両端末を挟み込むようにホーンとア
ンビルとを両FPCに当接させてこれら当接させたホー
ン及びアンビル間に超音波を出力して超音波溶着を行い
密着させた導体配線同士を接合してFPC同士を電気的
に接続する。このため、従来のFPC同士の電気的接続
に必要であった専用の接続コネクタ等の部品が不要とな
るため、接続に関するコストを大幅に削減することがで
きる。また、FPCのそれぞれの導体配線を、例えば抵
抗溶接又は超音波溶着により接合するため、専用の接続
コネクタ等による接合に比べ、非常に高い接続信頼性を
得ることが可能となる。
According to the present invention, the terminals of the flexible printed circuit boards to be connected (hereinafter, referred to as "FPC" only in this paragraph) face the conductor wiring formed on each terminal, In addition, the conductor wires are bent so that the end surfaces of the respective terminal portions face in the same direction, and the facing conductor wires are brought into close contact with each other. The electrodes are brought into contact with each other, and a voltage is applied between the contacted electrodes, resistance welding is performed, and the closely adhered conductor wirings are joined together to form an FPC.
They are electrically connected to each other. Further, according to the present invention, the terminal portions of the respective FPCs to be connected face each other with the conductor wirings formed on the respective terminal portions facing each other, and are bent so that the end faces of the respective terminal portions face the same direction. The conductor wiring is brought into close contact with the horn and the anvil by contacting the horn and the anvil with both the FPCs so as to sandwich both ends, and ultrasonic waves are output between the contacted horn and the anvil to perform ultrasonic welding. The FPCs are joined together to electrically connect the FPCs. For this reason, components such as a dedicated connection connector, which are necessary for the conventional electrical connection between FPCs, become unnecessary, and the cost for connection can be greatly reduced. Further, since the respective conductor wirings of the FPC are joined by, for example, resistance welding or ultrasonic welding, it is possible to obtain extremely high connection reliability as compared with joining by a dedicated connection connector or the like.

【0010】なお、接続するそれぞれのFPCの端末部
を90°又は180°折り曲げて向い合う導体配線同士
を、例えば抵抗溶接又は超音波溶着により接合するよう
にすれば、更に好適にFPC同士を接続することが可能
となる。
[0010] If the terminal portions of the respective FPCs to be connected are bent at 90 ° or 180 ° so that the opposing conductor wires are joined to each other by, for example, resistance welding or ultrasonic welding, the FPCs can be connected more preferably. It is possible to do.

【0011】[0011]

【発明の実施の形態】以下、添付の図面を参照して、こ
の発明の実施例を説明する。図1は、この発明の一実施
例に係る可撓性プリント基板同士の接続方法を説明する
ための端末部の上方斜視図、図2は、一部を断面で示す
模式的側面図、図3は、可撓性プリント基板同士の接続
工程を示すフローチャートである。
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an upper perspective view of a terminal portion for explaining a method of connecting flexible printed circuit boards according to one embodiment of the present invention, FIG. 2 is a schematic side view showing a part of the terminal section, and FIG. 5 is a flowchart showing a connection process between flexible printed circuit boards.

【0012】図1に示すように、互いに接続されるべき
FPC10,20は、例えば、ポリエチレンテレフタレ
ート(PET)やポリエチレンナフタレート(PEN)
等からなる絶縁性を有する樹脂フィルム(以下、「絶縁
フィルム」と呼ぶ。)15,25の上に、銅箔による導
電パターンからなる配線16,26を形成し、これら絶
縁フィルム15,25及び配線16,26の上を電気的
絶縁性を有する合成樹脂等からなるカバーレイ17,2
7で覆った構造で形成されている。なお、FPC10,
20の端末部11,21の絶縁フィルム15,25上、
及び配線16,26上には、カバーレイ17,27は形
成されておらず、それぞれの端末部11,21において
は本来カバーレイ17,27に覆われているはずの配線
16,26が剥き出しの露出した状態となっており、容
易にFPC10,20の配線16,26同士を直接接触
することができるような工夫が施されて形成されてい
る。
As shown in FIG. 1, FPCs 10 and 20 to be connected to each other are made of, for example, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
Wirings 16 and 26 made of a conductive pattern made of copper foil are formed on resin films 15 and 25 having insulating properties (hereinafter referred to as “insulating films”) made of the same. Cover lays 17 and 2 made of synthetic resin or the like having electrical insulation properties on the tops 16 and 26
7 is formed. In addition, FPC10,
20 on the insulating films 15, 25 of the terminal portions 11, 21;
The cover lays 17 and 27 are not formed on the wirings 16 and 26, and the wirings 16 and 26, which should be originally covered by the cover lays 17 and 27, are exposed at the respective terminal portions 11 and 21. It is in a state of being exposed, and is formed so that the wirings 16 and 26 of the FPCs 10 and 20 can be easily brought into direct contact with each other.

【0013】以下に、このように形成されたFPC1
0,20同士の接続方法について説明する。まず、上記
PETやPEN等で構成されるFPC10,20の基体
となる絶縁フィルム15,25を構成するシート等を用
意し、所望の形状等に加工する(S1)。次に、加工し
た絶縁フィルム15,25上に、FPC10,20の回
路を構成するCu等を原材料とする導電パターンからな
る配線16,26を、例えばエッチング等の方法により
パターン形成し、端末部11,21となるべき部分を除
いた絶縁フィルム15,25及び配線16,26上にカ
バーレイ17,27を形成してFPC10,20を製造
する(S2)。ここまでの段階で、図1に示すような状
態のFPC10,20を準備することができる。次に、
このようにして準備されたFPC10,20の端末部1
1,21を図1中の矢印方向(絶縁フィルム15,25
下面側−90°方向)へそれぞれ折り曲げた後(S
3)、配線16,26同士を接触させると、端末部1
1,21は、図2(a)に示すような状態になる。この
状態では、それぞれの端末部11,21の配線16,2
6を接触させただけであるため、更に、同図(b)に示
すように、接触させた配線16,26部分を、例えば圧
着装置(図示せず)の圧着加工ヘッド19,29を用い
て絶縁フィルム15,25側からそれぞれ押圧して仮圧
着加工する(S4)。そして、この状態で同図(c)に
示すように、それぞれの端末部11,21の配線16,
26の上側から、例えばシリーズ溶接装置(図示せず)
の電極9a,9bを当接し、これら当接した電極9a,
9b間にシリーズ溶接に用いられる容量の大電流を通電
するために所定の電圧を印加する。そして、通電により
発生した熱エネルギーと電極9a,9bによる加圧力と
により配線16,26の銅が他方の層へ相互に拡散する
ことで接触した配線16,26同士を溶接接合し(S
5)、FPC10とFPC20とを電気的且つ機械的に
接続する。このようにしてFPC10,20同士を接続
することにより、高い接続信頼性を得ることができると
共に、専用の接続コネクタ等の部品を必要としないFP
C同士の接続が可能となるため、接続に関するコストを
大幅に削減し、FPCの製造コストの上昇を抑えること
が可能となる。
Hereinafter, the FPC 1 thus formed will be described.
A connection method between 0 and 20 will be described. First, sheets and the like constituting insulating films 15 and 25 serving as bases of FPCs 10 and 20 composed of PET or PEN are prepared and processed into a desired shape or the like (S1). Next, on the processed insulating films 15 and 25, wirings 16 and 26 made of a conductive pattern made of Cu or the like constituting the circuits of the FPCs 10 and 20 are formed by patterning, for example, by etching or the like. Then, coverlays 17 and 27 are formed on the insulating films 15 and 25 and the wirings 16 and 26 except for the portions that will become the FPCs 10 and 20 (S2). At this stage, the FPCs 10 and 20 in the state shown in FIG. 1 can be prepared. next,
Terminal 1 of FPCs 10 and 20 prepared in this way
1, 21 in the direction of the arrow in FIG.
After each bending to the lower side (-90 ° direction) (S
3) When the wires 16 and 26 are brought into contact with each other, the terminal 1
1 and 21 are in a state as shown in FIG. In this state, the wirings 16 and 2 of the respective terminal units 11 and 21 are
6, the contacted wires 16, 26 are further separated using, for example, crimping heads 19, 29 of a crimping device (not shown), as shown in FIG. Preliminary pressure bonding is performed by pressing each of the insulating films 15 and 25 (S4). Then, in this state, as shown in FIG.
26, for example, a series welding device (not shown)
Of the electrodes 9a, 9b, and the contacted electrodes 9a, 9b.
A predetermined voltage is applied during 9b to supply a large current having a capacity used for series welding. Then, due to the thermal energy generated by energization and the pressing force of the electrodes 9a and 9b, the copper of the wirings 16 and 26 is mutually diffused into the other layer, so that the wirings 16 and 26 that are in contact with each other are welded and joined (S
5) Connect the FPC 10 and the FPC 20 electrically and mechanically. By connecting the FPCs 10 and 20 in this manner, high connection reliability can be obtained, and an FP that does not require components such as a dedicated connection connector.
Since the connection between the Cs is possible, the cost related to the connection can be significantly reduced, and the increase in the manufacturing cost of the FPC can be suppressed.

【0014】なお、上述した例では、FPC10,20
同士の接続に際して抵抗溶接による接続を用いて説明し
たが、接続方法は特にこれに限定されるものではなく、
例えば、図4に示すような超音波溶着による接続を行っ
ても良い。以下、この超音波溶着による接続方法につい
て説明する。なお、上記抵抗溶接による接続方法で既に
説明した部分は割愛する。
In the above example, the FPCs 10, 20
Although connection using resistance welding has been described when connecting each other, the connection method is not particularly limited to this,
For example, connection by ultrasonic welding as shown in FIG. 4 may be performed. Hereinafter, the connection method by the ultrasonic welding will be described. The parts already described in the connection method by resistance welding are omitted.

【0015】超音波溶着によるFPC同士の接続方法で
は、上記ステップS3までの工程は同様であるが、それ
以降の処理が異なっている。即ち、それぞれの端末部1
1,21を折り曲げて配線16,26を接触させた後、
例えば端末部11の絶縁フィルム15の下面側に超音波
溶着装置(図示せず)のホーン50を当接し、端末部2
1の絶縁フィルム25の下面側にアンビル51を当接し
て周波数60KHz〜120KHzぐらいの超音波をこ
れらホーン50及びアンビル51間に出力し、接触させ
た配線16,26同士を超音波溶着により接合してFP
C10とFPC20とを電気的且つ機械的に接続する。
このため、上記抵抗溶接による接続の場合と同様に、高
い接続信頼性を得ることができると共に、専用の接続コ
ネクタ等の部品を必要としないFPC同士の接続が可能
となり、接続に関するコストを大幅に削減し、FPCの
製造コストの上昇を抑えることが可能となる。
In the method for connecting FPCs by ultrasonic welding, the steps up to step S3 are the same, but the subsequent steps are different. That is, each terminal unit 1
After bending the wires 21 and 21 to bring the wires 16 and 26 into contact with each other,
For example, a horn 50 of an ultrasonic welding device (not shown) is brought into contact with the lower surface side of the insulating film 15 of the terminal portion 11, and
The anvil 51 is brought into contact with the lower surface side of the insulating film 25 to output ultrasonic waves having a frequency of about 60 KHz to 120 KHz between the horn 50 and the anvil 51, and the contacted wirings 16 and 26 are joined together by ultrasonic welding. FP
C10 and FPC20 are electrically and mechanically connected.
For this reason, as in the case of the connection by resistance welding, high connection reliability can be obtained, and connection between FPCs that does not require components such as a dedicated connection connector becomes possible, and the connection cost is greatly reduced. It is possible to reduce the manufacturing cost of the FPC.

【0016】図5は、この発明の他の実施例に係る可撓
性プリント基板同士の接続方法を説明するための端末部
の上方斜視図、図6は、一部を断面で示す模式的側面
図、図7は、可撓性プリント基板同士の接続工程を示す
フローチャートである。
FIG. 5 is an upper perspective view of a terminal portion for explaining a method of connecting flexible printed circuit boards according to another embodiment of the present invention, and FIG. 6 is a schematic side view showing a part of the terminal portion in cross section. FIG. 7 and FIG. 7 are flowcharts showing a connection process between flexible printed circuit boards.

【0017】図5に示すように、互いに接続されるべき
FPC30,40は、PETやPEN等からなる絶縁フ
ィルム35,45の上に、銅箔による導電パターンから
なる配線36,46を形成し、これら絶縁フィルム3
5,45及び配線36,46の上を電気的絶縁性を有す
る合成樹脂等からなるカバーレイ37,47で覆った構
造で形成されている。なお、FPC30,40の端末部
31,41の絶縁フィルム35,45上、及び配線3
6,46上には、カバーレイ37,47は形成されてお
らず、それぞれの端末部31,41においては本来カバ
ーレイ37,47に覆われているはずの配線36,46
が露出した状態となっており、容易にFPC30,40
の配線36,46同士を直接接触することができるよう
な工夫が施されて形成されている。
As shown in FIG. 5, the FPCs 30 and 40 to be connected to each other form wirings 36 and 46 made of a conductive pattern of copper foil on insulating films 35 and 45 made of PET, PEN or the like. These insulating films 3
5, 45 and wirings 36 and 46 are covered with coverlays 37 and 47 made of synthetic resin or the like having electrical insulation. In addition, on the insulating films 35 and 45 of the terminal parts 31 and 41 of the FPCs 30 and 40, and the wiring 3
The coverlays 37 and 47 are not formed on the bases 6 and 46, and the wirings 36 and 46, which should be originally covered by the coverlays 37 and 47, in the respective terminal portions 31 and 41.
Are exposed, and the FPCs 30, 40 can be easily
The wires 36 and 46 are formed so as to be able to directly contact each other.

【0018】以下に、このように形成されたFPC3
0,40同士の接続方法について説明する。まず、上記
PETやPEN等で構成されるFPC30,40の基体
となる絶縁フィルム35,45を構成するシート等を用
意し、所望の形状等に加工する(S10)。次に、加工
した絶縁フィルム35,45上に、FPC30,40の
回路を構成するCu等を原材料とする導電パターンから
なる配線36,46を、例えばエッチング等の方法によ
りパターン形成し、端末部31,41となるべき部分を
除いた絶縁フィルム35,45及び配線36,46上に
カバーレイ37,47を形成してFPC30,40を製
造する(S20)。ここまでの段階で、図5に示すよう
な状態のFPC30,40を準備することができる。次
に、このようにして準備されたFPC30,40の端末
部31,41を図5中の矢印方向(絶縁フィルム35,
45下面側−180°方向)へそれぞれ折り曲げて絶縁
フィルム35,45のそれぞれの下面が対向するように
加工し(S30)、それぞれの端末部31,41の配線
36,46同士を接触させると、端末部31,41は、
図6(a)に示すような状態になる。即ち、それぞれの
端末部31,41を、配線36,46が絶縁フィルム3
5,45の外側にくるようにU字に折り曲げ、折り返さ
れた部分の配線36,46を接触させるようにする。配
線36,46を接触させた後、同図(b)に示すよう
に、例えばシリーズ溶接装置(図示せず)の電極9a,
9bを、接触させた配線36,46と絶縁フィルム3
5,45を介して反対位置の配線36,46上に当接さ
せ、それぞれの電極9a,9bで端末部31,41を押
圧する(S40)。そして、この状態で、電極9a,9
b間にシリーズ溶接に用いられる容量の大電流を通電す
るための所定の電圧を印加し、通電により発生した熱エ
ネルギーと電極9a,9bによる加圧力とにより配線3
6,46の銅が他方の層へ相互に拡散することで接触し
た配線36,46同士を溶接接合して(S50)、FP
C30とFPC40とを電気的且つ機械的に接続する。
このようにしてFPC30,40同士を接続することに
より、専用の接続コネクタ等の部品を必要としないFP
C同士の接続が可能となるため、FPC同士の接続に関
するコストを大幅に削減し、自動車等に用いられるFP
Cの製造コストの上昇を抑えることが可能となる。
Hereinafter, the FPC 3 thus formed will be described.
A connection method between 0 and 40 will be described. First, sheets and the like constituting insulating films 35 and 45 serving as bases of the FPCs 30 and 40 composed of PET or PEN are prepared and processed into a desired shape or the like (S10). Next, on the processed insulating films 35 and 45, wirings 36 and 46 made of a conductive pattern made of Cu or the like constituting the circuits of the FPCs 30 and 40 are formed by patterning, for example, by etching or the like. Then, coverlays 37 and 47 are formed on the insulating films 35 and 45 and the wirings 36 and 46 excluding the parts to become the FPCs 30 and 40 (S20). At this stage, the FPCs 30, 40 in the state shown in FIG. 5 can be prepared. Next, the terminal portions 31 and 41 of the FPCs 30 and 40 prepared as described above are placed in the direction of the arrow in FIG.
45 (the lower surface side -180 ° direction), and processing is performed so that the lower surfaces of the insulating films 35 and 45 face each other (S30), and the wires 36 and 46 of the terminal portions 31 and 41 are brought into contact with each other. The terminal units 31 and 41
The state is as shown in FIG. That is, the terminal portions 31 and 41 are connected to the wirings 36 and 46 by the insulating film 3.
The wires 36 and 46 are bent into a U-shape so that the wires 36 and 46 come into contact with the outside of the wires 5 and 45. After the wires 36 and 46 are brought into contact with each other, as shown in FIG. 2B, for example, the electrodes 9a and 9a of a series welding device (not shown) are used.
9b is contacted with the wirings 36 and 46 and the insulating film 3
The terminals 5 and 45 are brought into contact with the wirings 36 and 46 at opposite positions, and the electrodes 9a and 9b press the terminal portions 31 and 41 (S40). Then, in this state, the electrodes 9a, 9
b, a predetermined voltage for applying a large current having a capacity used for series welding is applied, and the heat energy generated by the application of the current and the pressure applied by the electrodes 9a and 9b are applied to the wiring 3.
The wirings 36 and 46 that were in contact with each other as the coppers 6 and 46 diffused into the other layer were welded together (S50), and the FP
The C30 and the FPC 40 are electrically and mechanically connected.
By connecting the FPCs 30 and 40 in this manner, an FP that does not require components such as a dedicated connector is required.
C can be connected to each other, so that the cost of connecting FPCs can be greatly reduced, and FPs used in automobiles and the like can be used.
It is possible to suppress an increase in the manufacturing cost of C.

【0019】なお、この例では、FPC同士の接続に際
して抵抗溶接による接続を用いて説明したが、接続方法
は特にこれに限定されるものではないため、例えば、図
8に示すような超音波溶着による接続を行っても良い。
以下、この超音波溶着による接続方法について簡単に説
明する。
In this example, the connection between the FPCs is described using the connection by resistance welding. However, the connection method is not particularly limited, and therefore, for example, the ultrasonic welding as shown in FIG. Connection may be performed.
Hereinafter, the connection method by the ultrasonic welding will be briefly described.

【0020】この超音波溶着によるFPC同士の接続方
法では、上記ステップS30までの工程は同様である
が、それ以降の処理が異なっている。即ち、それぞれの
端末部31,41を180°折り曲げて配線36,46
を接触させた後、例えば端末部31の外側にある配線3
6上に超音波溶着装置(図示せず)のホーン50を当接
させ、反対の端末部41の外側にある配線46上に(ホ
ーン50に対向する位置)にアンビル51を当接させて
周波数60KHz〜120KHz程度の超音波を、これ
らホーン50及びアンビル51間に出力し、接触させた
配線36,46同士を接合してFPC30とFPC40
とを電気的且つ機械的に接続する。これにより、上記抵
抗溶接による接続の場合と同様に、高い接続信頼性を得
ることができると共に、専用の接続コネクタ等の部品を
必要としないFPC同士の接続が可能となり、FPC同
士の接続に関するコストを大幅に削減することができ
る。また、この例での超音波溶着によるFPC同士の接
続では、絶縁フィルム35,45に直接ホーン50及び
アンビル51が接触しないため、仮に絶縁フィルム3
5,45が超音波溶着作業中に溶融したとしてもホーン
50やアンビル51に付着してしまう可能性は薄く、良
好な接続処理を継続して行うことができる。
In this method of connecting FPCs by ultrasonic welding, the steps up to step S30 are the same, but the subsequent steps are different. That is, the respective terminal portions 31 and 41 are bent by 180 ° and the wirings 36 and 46 are bent.
After the contact, for example, the wiring 3 outside the terminal unit 31
The horn 50 of the ultrasonic welding device (not shown) is brought into contact with the horn 6, and the anvil 51 is brought into contact with the wiring 46 on the outside of the opposite terminal portion 41 (at a position facing the horn 50). Ultrasonic waves of about 60 KHz to 120 KHz are output between the horn 50 and the anvil 51, and the contacted wirings 36, 46 are joined together to form the FPC 30 and the FPC 40.
Are electrically and mechanically connected to each other. As a result, as in the case of the connection by resistance welding, high connection reliability can be obtained, and connection between FPCs that does not require components such as a dedicated connection connector becomes possible. Can be greatly reduced. Further, in the connection between the FPCs by ultrasonic welding in this example, since the horn 50 and the anvil 51 do not directly contact the insulating films 35, 45, the insulating films 3
Even if 5, 45 is melted during the ultrasonic welding operation, the possibility of adhering to horn 50 or anvil 51 is small, and a good connection process can be continuously performed.

【0021】[0021]

【発明の効果】以上述べたように、この発明によれば、
接続するそれぞれのFPCの端末部を、それぞれの端末
部に形成された導体配線を向い合せ、且つそれぞれの端
末部の端面が同一方向へ向くように折り曲げて向い合う
導体配線を密着させ、両端末部に両者が密着する向きの
圧力を加え、圧力を加えた状態でそれぞれのFPCの導
体配線上に電極を当接させてこれら当接させた電極間に
電圧を印加して抵抗溶接を行い密着させた導体配線同士
を接合してFPC同士を電気的に接続する。また、この
発明によれば、接続するそれぞれのFPCの端末部を、
それぞれの端末部に形成された導体配線を向い合せ、且
つそれぞれの端末部の端面が同一方向へ向くように折り
曲げて向い合う導体配線を密着させ、両端末を挟み込む
ようにホーンとアンビルとを両FPCに当接させてこれ
ら当接させたホーン及びアンビル間に超音波を出力して
超音波溶着を行い密着させた導体配線同士を接合してF
PC同士を電気的に接続する。このため、従来のFPC
同士の電気的接続に必要であった専用の接続コネクタ等
の部品が不要となるため、接続に関するコストを大幅に
削減することができ、また、FPCのそれぞれの導体配
線を、例えば抵抗溶接又は超音波溶着により接合するた
め、専用の接続コネクタ等による接合に比べ、非常に高
い接続信頼性を得ることが可能となるという効果を奏す
る。
As described above, according to the present invention,
The terminals of the respective FPCs to be connected face each other with the conductor wires formed on the respective terminal portions facing each other, and are bent so that the end faces of the respective terminal portions face in the same direction so that the facing conductor wires are brought into close contact with each other. Apply pressure in the direction in which the two parts are in close contact with each other, contact the electrodes on the conductor wiring of each FPC with the pressure applied, apply a voltage between these contacted electrodes, and perform resistance welding to make contact. The FPCs are electrically connected by joining the conductor wirings thus formed. Further, according to the present invention, the terminal unit of each FPC to be connected is
The conductor wires formed on the respective terminal portions are opposed to each other, and the conductor wires are bent so that the end faces of the respective terminal portions face in the same direction, and the opposed conductor wires are brought into close contact with each other, and both the horn and the anvil are sandwiched between both terminals. An ultrasonic wave is output between the horn and the anvil contacted with the FPC and ultrasonic welding is performed between the horn and the anvil, thereby joining the closely adhered conductor wirings to form an F.
The PCs are electrically connected. For this reason, the conventional FPC
Since components such as a dedicated connector required for electrical connection between the components are not required, the cost for connection can be greatly reduced, and each conductor wiring of the FPC can be formed by, for example, resistance welding or superconducting. Since joining is performed by sonic welding, it is possible to obtain an effect that extremely high connection reliability can be obtained as compared with joining using a dedicated connection connector or the like.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の一実施例に係る可撓性プリント基
板同士の接続方法を説明するための端末部の上方斜視図
である。
FIG. 1 is a top perspective view of a terminal unit for explaining a method of connecting flexible printed circuit boards according to an embodiment of the present invention.

【図2】 同接続方法を説明するための端末部の一部を
断面で示す模式的側面図である。
FIG. 2 is a schematic side view showing a part of a terminal section in a cross section for explaining the connection method.

【図3】 同可撓性プリント基板同士の接続工程を示す
フローチャートである。
FIG. 3 is a flowchart showing a connection process between the flexible printed circuit boards.

【図4】 この発明の他の実施例に係る可撓性プリント
基板同士の接続方法を説明するための端末部の一部を断
面で示す模式的側面図である。
FIG. 4 is a schematic side view showing a cross section of a part of a terminal portion for explaining a method of connecting flexible printed circuit boards according to another embodiment of the present invention.

【図5】 この発明の更に他の実施例に係る可撓性プリ
ント基板同士の接続方法を説明するための端末部の上方
斜視図である。
FIG. 5 is a top perspective view of a terminal unit for explaining a method of connecting flexible printed circuit boards according to still another embodiment of the present invention.

【図6】 同接続方法を説明するための端末部の一部を
断面で示す模式的側面図である。
FIG. 6 is a schematic side view showing a part of a terminal section in a cross section for explaining the connection method.

【図7】 同可撓性プリント基板同士の接続工程を示す
フローチャートである。
FIG. 7 is a flowchart showing a connection process between the flexible printed circuit boards.

【図8】 この発明の更に他の実施例に係る可撓性プリ
ント基板同士の接続方法を説明するための端末部の一部
を断面で示す模式的側面図である。
FIG. 8 is a schematic side view showing a part of a terminal section in cross section for explaining a method of connecting flexible printed circuit boards according to still another embodiment of the present invention.

【図9】 自動車等のダッシュボードに使用されるFP
Cとワイヤハーネスとを示す上方斜視図である。
FIG. 9 is an FP used for a dashboard of an automobile or the like.
It is an upper perspective view which shows C and a wire harness.

【図10】 FPCハーネスのジョイント構造を説明す
るための図である。
FIG. 10 is a diagram for explaining a joint structure of the FPC harness.

【符号の説明】[Explanation of symbols]

10,20,30,40…FPC、11,21,31,
41…端末部、15,25,35,45…絶縁フィル
ム、16,26,36,46…配線、17,27,3
7,47…カバーレイ。
10, 20, 30, 40 ... FPC, 11, 21, 31,
41 ... terminal part, 15, 25, 35, 45 ... insulating film, 16, 26, 36, 46 ... wiring, 17, 27, 3
7, 47 ... coverlay.

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01R 43/02 H01R 43/02 B // B23K 101:38 B23K 101:38 101:42 101:42 Fターム(参考) 4E067 AA07 BF00 DA13 DA17 EA04 EB00 5E051 LA02 LA04 LB05 5E085 BB09 CC03 DD03 DD04 HH11 HH13 JJ50 5E344 AA02 AA10 AA12 AA22 BB02 BB05 CC07 DD10 DD14 EE16 EE21 Continuation of the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) H01R 43/02 H01R 43/02 B // B23K 101: 38 B23K 101: 38 101: 42 101: 42 F term (reference) 4E067 AA07 BF00 DA13 DA17 EA04 EB00 5E051 LA02 LA04 LB05 5E085 BB09 CC03 DD03 DD04 HH11 HH13 JJ50 5E344 AA02 AA10 AA12 AA22 BB02 BB05 CC07 DD10 DD14 EE16 EE21

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁フィルム上に導体配線が形成されて
なる可撓性プリント基板同士の接続方法であって、 一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とを向い合せ、
且つそれぞれの端末部の端面が同一方向へ向くように前
記両可撓性プリント基板の端末部を折り曲げて前記向い
合う導体配線を密着させ、 前記両端末部に両者が密着する向きの圧力を加え、 前記一方の可撓性プリント基板の導体配線上に一方の電
極を当接させると共に、前記他方の可撓性プリント基板
の導体配線上に他方の電極を当接させてこれら当接させ
た電極間に所定の電圧を印加して前記密着させたそれぞ
れの導体配線同士を抵抗溶接により接合することを特徴
とする可撓性プリント基板同士の接続方法。
1. A method for connecting flexible printed circuit boards, each having a conductive wiring formed on an insulating film, comprising: a conductive wiring at a terminal portion of one of the flexible printed boards; Face the conductor wiring of the terminal part of
In addition, the terminal portions of the two flexible printed circuit boards are bent so that the end surfaces of the respective terminal portions face in the same direction, and the opposed conductor wirings are brought into close contact with each other. An electrode in which one electrode is brought into contact with the conductor wiring of the one flexible printed board and the other electrode is brought into contact with the conductor wiring of the other flexible printed board. A method for connecting flexible printed circuit boards, wherein a predetermined voltage is applied between the conductive wirings and the conductor wirings that are brought into close contact with each other are joined by resistance welding.
【請求項2】 絶縁フィルム上に導体配線が形成されて
なる可撓性プリント基板同士の接続方法であって、 一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とを向い合せ、
且つそれぞれの端末部の端面が同一方向へ向くように前
記両可撓性プリント基板の端末部を折り曲げて前記向い
合う導体配線を密着させ、 前記両端末部を挟み込むようにホーンとアンビルとを両
可撓性プリント基板に当接させてこれらホーン及びアン
ビル間に所定の周波数の超音波を出力して前記密着させ
たそれぞれの導体配線同士を超音波溶着により接合する
ことを特徴とする可撓性プリント基板同士の接続方法。
2. A method of connecting flexible printed circuit boards each having a conductive wiring formed on an insulating film, wherein the conductive wiring at a terminal portion of one flexible printed circuit board and the other flexible printed circuit board are connected. Face the conductor wiring of the terminal part of
In addition, the terminal portions of the flexible printed circuit boards are bent so that the end surfaces of the terminal portions face in the same direction, and the facing conductor wirings are brought into close contact with each other, and the horn and the anvil are sandwiched so as to sandwich the terminal portions. A flexible printed circuit is produced by outputting ultrasonic waves of a predetermined frequency between the horn and the anvil and joining the closely adhered conductor wirings by ultrasonic welding. How to connect printed circuit boards.
【請求項3】 前記両可撓性プリント基板の端末部を9
0°折り曲げて前記向い合う導体配線を接合することを
特徴とする請求項1又は2記載の可撓性プリント基板同
士の接続方法。
3. The terminal portion of each of the flexible printed circuit boards is 9
The method for connecting flexible printed circuit boards according to claim 1 or 2, wherein the opposed conductor wirings are joined by being bent by 0 °.
【請求項4】 前記両可撓性プリント基板の端末部を1
80°折り曲げて前記向い合う導体配線を接合すること
を特徴とする請求項1又は2記載の可撓性プリント基板
同士の接続方法。
4. The terminal portions of the two flexible printed circuit boards are
3. The method for connecting flexible printed circuit boards according to claim 1 or 2, wherein the opposed conductor wirings are joined by being bent by 80 [deg.].
JP2000332819A 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other Pending JP2002141659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000332819A JP2002141659A (en) 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332819A JP2002141659A (en) 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other

Publications (1)

Publication Number Publication Date
JP2002141659A true JP2002141659A (en) 2002-05-17

Family

ID=18808976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000332819A Pending JP2002141659A (en) 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other

Country Status (1)

Country Link
JP (1) JP2002141659A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210619A (en) * 2007-02-26 2008-09-11 Fujikura Ltd Connection member of electric member
JP2011138853A (en) * 2009-12-28 2011-07-14 Hitachi Media Electoronics Co Ltd Connection structure of flexible printed circuit and optical pickup device
JP2012045620A (en) * 2010-07-28 2012-03-08 Nissan Motor Co Ltd Joining device and joining method
US8220696B2 (en) 2006-09-13 2012-07-17 Ibiden Co., Ltd. Manufacturing method of printed wiring board and a laminate jointing apparatus
JP2012248404A (en) * 2011-05-27 2012-12-13 Denso Corp Caulking device and caulking method
JP2012248403A (en) * 2011-05-27 2012-12-13 Denso Corp Caulking method and caulking device
CN108668464A (en) * 2018-04-08 2018-10-16 深圳市比亚迪电子部品件有限公司 A kind of method and article construction of ultra-thin soft board and metal terminal ultrasonic bonding

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8220696B2 (en) 2006-09-13 2012-07-17 Ibiden Co., Ltd. Manufacturing method of printed wiring board and a laminate jointing apparatus
JP2008210619A (en) * 2007-02-26 2008-09-11 Fujikura Ltd Connection member of electric member
JP2011138853A (en) * 2009-12-28 2011-07-14 Hitachi Media Electoronics Co Ltd Connection structure of flexible printed circuit and optical pickup device
JP2012045620A (en) * 2010-07-28 2012-03-08 Nissan Motor Co Ltd Joining device and joining method
JP2012248404A (en) * 2011-05-27 2012-12-13 Denso Corp Caulking device and caulking method
JP2012248403A (en) * 2011-05-27 2012-12-13 Denso Corp Caulking method and caulking device
CN108668464A (en) * 2018-04-08 2018-10-16 深圳市比亚迪电子部品件有限公司 A kind of method and article construction of ultra-thin soft board and metal terminal ultrasonic bonding

Similar Documents

Publication Publication Date Title
JP2962160B2 (en) Electrical junction box
JP3163592B2 (en) Composite circuit board
JPH0464122B2 (en)
JP2002141659A (en) Method for connecting flexible printed board to each other
JP2002025740A (en) Welding method and welding part structure of flat conductor wiring board
JP2002141660A (en) Method for connecting flexible printed board to each other
JP2973293B2 (en) Terminal structure of flexible printed circuit board and method of manufacturing the terminal structure
JPH0817259A (en) Flat cable branch connecting structure
JP2002359447A (en) Connection structure for connecting flat cable and printed board
JP2870263B2 (en) Connection method of flat conductor wiring board and electrode terminal mounting method
JPH09129284A (en) Terminal connection part of plane circuit body and manufacture thereof
JPH11149951A (en) Joined body of flexible wire distribution body
JPH04186697A (en) Connection method of flexible printed board
JP2002015792A (en) Terminal structure of flexible board and joining method of connection terminal
JP2002171058A (en) Connecting method of flexible printed board
JP2003347132A (en) Surface-mounted coil component and its manufacturing method
JP2991324B2 (en) Connection between circuit conductors and method of connecting circuit conductors
JP2002141645A (en) Structure and method for bonding of flexible printed- circuit board to connecting terminal
JP2001127426A (en) Method and structure for connecting circuit conductor of flat conductor wiring board
JP3949394B2 (en) Flat circuit body connection structure and flat circuit body connection method
JP4949571B2 (en) Wire harness
JP2006222057A (en) Connection structure of flexible flat electric structure body
JPH04359874A (en) Interconnecting method for conductor of flexible flat type conductor-cable
JPH09293545A (en) Terminal connection method for flexible wiring board
JP2004023853A (en) Circuit unit, its manufacturing method, and electric junction box for automobile with this circuit unit